<?xml version="1.0" encoding="UTF-8"?>
<tw-patent-applications total-count="2043"> 
  <tw-patent-application no="1" publication-number="202611474"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611474.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611474</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133006</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相位檢測方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250318B">G01B9/02</main-classification>  
        <further-classification edition="200601120250318B">G02B27/28</further-classification>  
        <further-classification edition="200601120250318B">G02B27/10</further-classification>  
        <further-classification edition="200601120250318B">G01N21/59</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＰＳＩ系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSI SYSTEM INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳榮華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, YEONG HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開適用幾何相位光學器件的相移方式的相位檢測裝置。根據本實施例的一實施方式，提供相位檢測裝置，其特徵在於，包括使具有通過干涉儀生成的不同的圓形偏振光的物體光及參照光相移的光學掩膜，上述光學掩膜包括：光學陣列，包括使上述物體光及上述參照光以規定的光軸旋轉角度的兩倍相位延遲的幾何相位光學像素，以及圓偏振光分束器，使透射上述光學陣列的圓偏振光成分中一部分圓偏振光成分透射。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:相位檢測系統</p>  
        <p type="p">110:相位檢測裝置</p>  
        <p type="p">120:伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2" publication-number="202611439"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611439.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611439</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133008</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改良之倒T型的分離式排油煙機</chinese-title>  
        <english-title>IMPROVEMENT OF INVERTED-T-SHAPED SPLIT-TYPE RANGE HOOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">F24C15/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍天廚飾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLUESKY COOKING STYLE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖志榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHIN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種改良之倒T型的分離式排油煙機包括一排油煙機主體、一抽氣馬達、一導風直筒、以及一外罩殼。排油煙機主體包含一機殼及一集煙箱體，機殼具有一入風口，集煙箱體設置於機殼上，集煙箱體覆蓋於入風口，集煙箱體具有一出風口，集煙箱體的出風口與機殼的入風口相連通。抽氣馬達位在排油煙機主體的正上方的空間範圍內且與集煙箱體相間隔一預定距離。抽氣馬達包含一外殼體及一馬達主體，外殼體具有上下相對設置的一上開口及一下開口，馬達主體設置於外殼體內，馬達主體的一端具有與上開口相對應的一排出口。導風直筒呈垂直設置。導風直筒的下端連通於排油煙機主體的出風口，且導風直筒的上端連通於抽氣馬達的下開口。外罩殼垂直於排油煙機主體，且外罩殼罩蓋集煙箱體、導風直筒及抽氣馬達。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An improvement of inverted T-shaped split-type range hood includes a range hood main body, a suction motor, an air duct straight tube and an outer cover. The range hood main body includes a casing and a smoke collection box. The casing has an air inlet. The smoke collection box is disposed on the casing and covers the air inlet. The smoke collection box has an air outlet. The air outlet of the smoke collecting box communicates with the air inlet of the casing. The suction motor is located in a space directly above the range hood main body and spaced apart from the smoke collection box by a predetermined distance. The suction motor includes an outer shell and a motor main body. The outer shell has a top opening and a bottom opening oppositely arranged up and down. The motor main body is disposed in the outer shell. One end of the motor main body has an outlet port corresponding to the top opening. The air duct straight tube is arranged vertically. The bottom end of the air duct straight tube communicates with the air outlet of the range hood body, and the top end of the air duct straight tube communicates with the bottom opening of the suction motor. The outer cover is perpendicular to the range hood main body and covers the smoke collecting box, the air duct tube and the suction motor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:排油煙機主體</p>  
        <p type="p">11:機殼</p>  
        <p type="p">12:集煙箱體</p>  
        <p type="p">122:外箱壁</p>  
        <p type="p">124:蓋板</p>  
        <p type="p">2:抽氣馬達</p>  
        <p type="p">21:外殼體</p>  
        <p type="p">215:後壁面</p>  
        <p type="p">22:馬達主體</p>  
        <p type="p">221:排出口</p>  
        <p type="p">23:上安裝壁掛支架</p>  
        <p type="p">233:上壁掛片</p>  
        <p type="p">24:下安裝壁掛支架</p>  
        <p type="p">243:下壁掛片</p>  
        <p type="p">3:導風直筒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3" publication-number="202612409"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612409.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612409</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133009</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金手指結構的電鍍方法</chinese-title>  
        <english-title>METHOD FOR PLATING GOLDEN FINGER STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K3/18</main-classification>  
        <further-classification edition="200601120241105B">H05K3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>健鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIPOD TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張業勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YEH-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾博濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, PO-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種金手指結構的電鍍方法，其包含一前置步驟，提供一電路基板，所述電路基板形成有位於一中心區域的多個金屬線路及位於一周圍區域的一第一犧牲線路；一第一電鍍步驟，於多個所述金屬線路及所述第一犧牲線路鍍設多個鍍鎳層；一第二電鍍步驟，於多個所述金屬線路的多個所述鍍鎳層及所述第一犧牲線路的所述鍍鎳層鍍設多個鍍金層，以形成位於所述中心區域的多個金手指及位於所述周圍區域的一第一假金手指；以及一移除步驟，移除所述電路基板的所述周圍區域及所述第一假金手指，以形成一金手指結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for plating golden finger structure is provided. The method includes a preparing process implemented by providing a circuit substrate that includes a plurality of metal circuits arranged at a central region and a first sacrifice circuit arranged at a peripheral region; a first plating process implemented by plating a plurality of nickel plating layers onto the metal circuits and the first sacrifice circuit; a second plating process implemented by plating a plurality of golden plating layers onto the nickel plating layers of the metal circuits and the first sacrifice circuit, so as to form a plurality of golden fingers at the central region and a fake golden finger at the peripheral region; and a removing process implemented by removing the peripheral region of the circuit substrate and the first fake golden finger, so as to form a golden finger structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110:前置步驟</p>  
        <p type="p">S120:第一電鍍步驟</p>  
        <p type="p">S130:第二電鍍步驟</p>  
        <p type="p">S140:移除步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="4" publication-number="202611491"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611491.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611491</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133014</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>力量量測裝置和力量量測方法</chinese-title>  
        <english-title>FORCE MEASUREMENT DEVICE AND FORCE MEASUREMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241120B">G01L1/26</main-classification>  
        <further-classification edition="200601120241120B">G01R19/00</further-classification>  
        <further-classification edition="202001120241120B">G01R31/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達方電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARFON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃淇豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種力量量測裝置，用於一待測物，包含有一測試單元；一馬達，耦接該測試單元；一處理器，耦接於該馬達；以及一記憶體，耦接於該處理器，用來儲存一程式碼，該程式碼指示該處理器執行一力量量測方法，該力量量測方法包含有由該馬達控制該測試單元以一量測力量按壓該待測物；接收該馬達回應按壓該待測物的一第一量測電流；以及根據該第一量測電流，判斷該待測物的一回饋力量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A force measurement device for a device under test includes a test unit; a motor coupled to the device under test; a processor coupled to the motor; and a memory coupled to the processor and configured to store a program code. The program code instructs the processor to perform a force measurement method. The force measurement method includes controlling, by the motor, the test unit to press the device under test with a measurement force; receiving a first measurement current from the motor in response to pressing the device under test; and determining a feedback force from the device under test according to the first measurement current.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:力量量測裝置</p>  
        <p type="p">10:馬達</p>  
        <p type="p">20:測試單元</p>  
        <p type="p">40:處理器</p>  
        <p type="p">50:記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="5" publication-number="202611588"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611588.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611588</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133021</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像透鏡組</chinese-title>  
        <english-title>OPTICAL LENS ASSEMEBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241114B">G02B11/20</main-classification>  
        <further-classification edition="200601120241114B">G02B3/00</further-classification>  
        <further-classification edition="202101120241114B">G02B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新鉅科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEWMAX TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>耿曉婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENG, XIAO-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯賢勅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, SIAN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭國淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, KUO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種成像透鏡組，由物側至像側依序包含：一第一透鏡，具有正屈折力，該第一透鏡的像側表面近光軸處為凸面；一第二透鏡，具有負屈折力；一第三透鏡；以及一第四透鏡；其中，該第三透鏡於最大有效徑位置之厚度為ET3，該第四透鏡於最大有效徑位置之厚度為ET4，並滿足下列條件：0.48＜ET3/ET4＜1.50。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical lens assembly includes, in order from an object side to an image side: a first lens with positive refractive power, an image-side surface of the first lens is convex in a paraxial region thereof; a second lens with negative refractive power; a third lens; and a fourth lens; wherein a thickness of the third lens at a maximum effective diameter position of the third lens is ET3, a thickness of the fourth lens at a maximum effective diameter position of the fourth lens is ET4, and the following condition is satisfied: 0.48＜ET3/ET4＜1.50.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光欄</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">111:物側表面</p>  
        <p type="p">112:像側表面</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">121:物側表面</p>  
        <p type="p">122:像側表面</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">131:物側表面</p>  
        <p type="p">132:像側表面</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">141:物側表面</p>  
        <p type="p">142:像側表面</p>  
        <p type="p">170:濾光元件</p>  
        <p type="p">181:成像面</p>  
        <p type="p">183:影像感測器</p>  
        <p type="p">190:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="6" publication-number="202611618"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611618.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611618</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133023</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於光學投影模組之對位方法</chinese-title>  
        <english-title>ALIGNMENT METHOD FOR OPTICAL PROJECTION MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241113B">G03B5/00</main-classification>  
        <further-classification edition="200601120241113B">G02B27/18</further-classification>  
        <further-classification edition="200601120241113B">G02B5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和亞智慧科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEW SMART TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃韋豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝沛家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, PEI-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏宏桀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, HUNG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛淑燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIN, SHU-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳毅昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏俊杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHUN-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHIEN-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於光學投影模組之對位方法，該光學投影模組具有一光學面板、一補償器及一稜鏡組，該對位方法包括：相對稜鏡組，對位光學面板之一中心位置；其次，再於一垂直軸上移動掃描光學面板，以補償光學面板之一位置；最後，確認光學面板是否對位至一預定最佳位置，若否，則重複上述二步驟直至光學面板對位至該預定最佳位置為止。其中，移動掃描係指於移動光學面板之過程中連續取像，作為調整光學面板之位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to an alignment method for an optical projection module. The optical projection module has an optical panel, a compensator and a prism assembly. The method includes the following steps: aligning a central position of the optical panel according to the prism assembly, moving to scan the optical panel on a vertical axis to compensate a position of the optical panel, and confirming whether the optical panel is aligned to a predetermined optimal position, if not, repeating the above two steps until the optical panel aligns to the predetermined optimal position. The steps of moving to scan refers to continuously capturing images during the process of moving the optical panel, which is used as a basis for compensating the position of the optical panel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:矽基液晶面板</p>  
        <p type="p">20:補償器</p>  
        <p type="p">30:稜鏡組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="7" publication-number="202611619"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611619.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611619</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於擴增實境光學投影模組之對位方法</chinese-title>  
        <english-title>ALIGNMENT METHOD FOR AUGMENTED REALITY OPTICAL PROJECTION MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241114B">G03B5/00</main-classification>  
        <further-classification edition="200601120241114B">G02B27/01</further-classification>  
        <further-classification edition="200601120241114B">G02B27/18</further-classification>  
        <further-classification edition="202101120241114B">G02B7/02</further-classification>  
        <further-classification edition="200601120241114B">G02B5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和亞智慧科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEW SMART TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃韋豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝沛家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, PEI-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭繼增</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, CHI-TSENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王秉庠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, BING-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佳蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韋儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHIEN-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於擴增實境光學投影模組之對位方法，該擴增實境光學投影模組具有一鏡片組及一光源組，該對位方法包括：光源組提供一光線至鏡片組；於一第一方向軸上及與該第一方向軸反向上分別移動掃描鏡片組，以補償鏡片組於該第一方向軸上之一中心位置；於一第二方向軸上及與該第二方向軸反向上分別移動掃描鏡片組，以補償鏡片組於該第二方向軸上之一中心位置，其中該第一方向軸垂直於該第二方向軸；及，確認鏡片組是否對位至一預定位置，若否，則重複上述二步驟直至鏡片組對位至該預定位置為止。其中，該移動掃描係指於移動鏡片組之過程中連續取像，作為補償鏡片組位置之基準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for aligning an augmented reality optical projection module. The augmented reality optical projection module has a lens assembly and a light source assembly. The method includes: the light source assembly provides a light to the lens assembly, moving to scan the lens assembly in the first direction axis and in the opposite direction to the first direction axis to compensate for a central position of the lens assembly in the first direction axis, moving to scan the lens assembly in the second direction axis and in the opposite direction to the second direction axis to compensate for a central position of the lens assembly in the second direction axis, wherein the first direction axis is perpendicular to the second direction axis; and confirming whether the lens assembly is aligned to a predetermined optimal position, if not, repeating the above two steps until the lens assembly is aligned to the predetermined optimal position. The step of moving to scan refers to continuously capture images during the process of moving the lens assembly, which is used as a basis for compensating the position of the lens assembly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鏡片組</p>  
        <p type="p">20:光源組</p>  
        <p type="p">30:稜鏡組</p>  
        <p type="p">40:矽基液晶面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="8" publication-number="202612548"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612548.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612548</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133025</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光電元件及半導體光電裝置</chinese-title>  
        <english-title>SEMICONDUCTOR OPTOELECTRONIC DEVICE AND SEMICONDUCTOR OPTOELECTRONIC COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H20/81</main-classification>  
        <further-classification edition="202501120250102B">H10H20/84</further-classification>  
        <further-classification edition="202501120250102B">H10H20/857</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富采光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENNOSTAR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高振凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, ZHEN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佳蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮輝慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, HUI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任益華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RENN, YIH-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容提供一種半導體光電元件，包括半導體磊晶疊層、第一電極、電極墊、絕緣結構以及保護結構。半導體磊晶疊層包括第一半導體結構、第二半導體結構以及位於第一半導體結構及第二半導體結構之間的活性區。第一電極位於第二半導體結構上。電極墊覆蓋於第一電極。絕緣結構覆蓋於一部份的第二半導體結構。保護結構覆蓋於第一半導體結構、第二半導體結構以及活性區。第一半導體結構具有側壁。絕緣結構直接接觸電極墊而未覆蓋於側壁。保護結構覆蓋於側壁且與絕緣結構直接接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor optoelectronic device. The semiconductor optoelectronic device includes a semiconductor epitaxial stack, a first electrode, a conductive bump, an insulating reflective structure and a protection layer. The semiconductor epitaxial stack includes a first semiconductor structure, a second semiconductor structure and an active region located between the first semiconductor structure and the second semiconductor structure. The first electrode is located on the second semiconductor structure. The conductive bump covers the first electrode. The insulating reflective structure covers a portion of the second semiconductor structure. The protection layer covers the first semiconductor structure, the second semiconductor structure and the active region. The first semiconductor structure has a sidewall. The insulating reflective structure directly contacts the conductive bump and does not cover the sidewall. The protection layer covers the sidewall and directly contacts the insulating reflective structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體光電元件</p>  
        <p type="p">100s1:第一區域</p>  
        <p type="p">100s2:第二區域</p>  
        <p type="p">104:電極墊</p>  
        <p type="p">104s:上表面</p>  
        <p type="p">104s1:第一部分</p>  
        <p type="p">104s2:第二部分</p>  
        <p type="p">106:絕緣結構</p>  
        <p type="p">A-A’:線</p>  
        <p type="p">W:寬度</p>  
        <p type="p">L:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="9" publication-number="202610881"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610881.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610881</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133026</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無人搬運車</chinese-title>  
        <english-title>AUTOMATED GUIDED VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B62D63/02</main-classification>  
        <further-classification edition="200601120241007B">B62D63/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盟立自動化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIRLE AUTOMATION CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐條勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TIAO-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種無人搬運車及其驅動輪模組。所述無人搬運車包含一車架、及樞接於所述車架相反兩側的兩個驅動輪模組。每個所述驅動輪模組包含一第一平衡樑、樞接於所述第一平衡樑的後端部的一驅動輪、及樞接於所述第一平衡樑的前端部的一輔助輪。所述第一平衡樑具有樞接於所述車架的一第一樞接部，其位於所述後端部與所述前端部之間。所述第一平衡樑能以所述第一樞接部為支點而轉動，進而同步移動所述驅動輪與所述輔助輪。兩個所述驅動輪模組的所述驅動輪與所述輔助輪能用於保持接觸一地面行走，並且所述車架通過兩個所述第一樞接部而受力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an automated guided vehicle and a driving wheel module thereof. The automated guided vehicle includes a vehicle frame and two driving wheel modules that are pivotally connected to two opposite sides of the vehicle frame. Each of the driving wheel modules includes a first balance beam, a driving wheel pivotally connected to a rear end portion of the first balance beam, and an auxiliary wheel pivotally connected to a front end portion of the first balance beam. The first balance beam has a first pivotal portion that is pivotally connected to the vehicle frame arranged between the rear end portion and the front end portion of the first balance beam. The first balance beam is rotatable by using the first pivotal portion as a fulcrum for synchronously moving the driving wheel and the auxiliary wheel. The driving wheels and the auxiliary wheels of the two driving wheel modules are configured to travel on a ground by maintaining contact with the ground, and the vehicle frame is configured to receive force through the two first pivotal portions of the two driving wheel modules.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:無人搬運車</p>  
        <p type="p">1:車架</p>  
        <p type="p">11:主框體</p>  
        <p type="p">12:支撐桿</p>  
        <p type="p">121:突出部</p>  
        <p type="p">13:側框體</p>  
        <p type="p">14:後框體</p>  
        <p type="p">2:驅動輪模組</p>  
        <p type="p">21:第一平衡樑</p>  
        <p type="p">211:第一樞接部</p>  
        <p type="p">212:後端部</p>  
        <p type="p">213:前端部</p>  
        <p type="p">214:後樑段</p>  
        <p type="p">215:前樑段</p>  
        <p type="p">22:驅動輪</p>  
        <p type="p">23:輔助輪</p>  
        <p type="p">24:第一彈性件</p>  
        <p type="p">3:被動輪模組</p>  
        <p type="p">31:第二平衡樑</p>  
        <p type="p">311:第二樞接部</p>  
        <p type="p">312:端部</p>  
        <p type="p">313:側樑段</p>  
        <p type="p">32:被動輪</p>  
        <p type="p">33:第二彈性件</p>  
        <p type="p">C1:第一軸線</p>  
        <p type="p">C2:第二軸線</p>  
        <p type="p">H:高度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="10" publication-number="202612546"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612546.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612546</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133028</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光二極體及其製造方法</chinese-title>  
        <english-title>PHOTODIODE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10F99/00</main-classification>  
        <further-classification edition="202501120250102B">H10D8/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林駿杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光二極體及其製造方法，其中感光二極體包含一基板、一光作用區域、一濾波層及一遮光側壁。其中，光作用區域設置於基板上。濾波層覆蓋於光作用區域上，選擇性地僅允許一特定波長的光線通過被光作用區域接收並對應地產生一電訊號。遮光側壁完整覆蓋濾波層之側壁及基板之側壁，以阻擋該特定波長的光線穿過濾波層之側壁及基板側壁而被光作用區域接收。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photodiode and a manufacturing method thereof are provided. The photodiode includes a substrate, a light-active area, a filter layer and a light-shielding side wall. The light action area is disposed on the substrate. The filter layer covers the light-active area and selectively allows only light of a specific wavelength to pass through and be received by the light-active area and generate an electrical signal correspondingly. The light-shielding sidewall completely covers the sidewall of the filter layer and the sidewall of the substrate to block the light of a specific wavelength from passing through the sidewall of the filter layer and the sidewall of the substrate and being received by the light-action area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:感光二極體</p>  
        <p type="p">110:基板</p>  
        <p type="p">120:光作用區域</p>  
        <p type="p">130:濾波層</p>  
        <p type="p">140:上部電極</p>  
        <p type="p">150:下部電極</p>  
        <p type="p">160:遮光側壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="11" publication-number="202612491"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612491.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612491</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電晶體結構及其製作方法</chinese-title>  
        <english-title>TRANSISTOR STRUCTURE AND FABRICATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/00</main-classification>  
        <further-classification edition="202501120250102B">H10D64/66</further-classification>  
        <further-classification edition="202501120250102B">H10D64/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜銘祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, MING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭晉佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭竣文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHUN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃雅歆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YA-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊詠方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YUNG-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐世杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電晶體結構，包含：一基底；一主動區域，由該基底上的一溝槽隔離區所定義，其中，該主動區域包含一源極區、與該源極區間隔開的一汲極區，以及位於該源極區和該汲極區之間的一通道區；一閘極，設置於該通道區上，其中，該閘極具有平行於源極至汲極方向的一閘極長度以及小於該主動區域的寬度的一閘極寬度；以及一閘極介電層，設置於該主動區域與該閘極之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transistor structure includes a substrate and an active area defined by a trench isolation region on the substrate. The active area includes a source region, a drain region spaced apart from the source region, and a channel region between the source region and the drain region. A gate is disposed on the channel region. The gate has a gate length that is in parallel with a source-to-drain direction and a gate width that is smaller than a width of the active area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:電晶體結構</p>  
        <p type="p">100:基底</p>  
        <p type="p">102:溝槽隔離區</p>  
        <p type="p">110:主動區域</p>  
        <p type="p">111:源極區</p>  
        <p type="p">112:汲極區</p>  
        <p type="p">113:通道區</p>  
        <p type="p">114:閘極</p>  
        <p type="p">116:閘極介電層</p>  
        <p type="p">120:閘極接觸</p>  
        <p type="p">130:源極接觸</p>  
        <p type="p">140:汲極接觸</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">L:閘極長度</p>  
        <p type="p">W:閘極寬度</p>  
        <p type="p">La:長度</p>  
        <p type="p">Wa:寬度</p>  
        <p type="p">R:圓角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="12" publication-number="202611708"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611708.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611708</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133040</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>主動式即時韌體除錯方法及受測裝置</chinese-title>  
        <english-title>REAL-TIME ACTIVE FIRMWARE DEBUG METHOD AND DEVICE UNDER TEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241202B">G06F9/451</main-classification>  
        <further-classification edition="200601120241202B">G06F11/30</further-classification>  
        <further-classification edition="200601120241202B">G06F11/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁正明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種提供主動式即時韌體除錯方法，用以主動對受測裝置即時監測以藉此除錯，且具有以下步驟：依序讀取複數個監測點位址暫存器所儲存的複數個監測點位址；依序讀取複數個監測點位址所對應的複數個測試點資料暫存器所儲存的複數個運行數值；將讀取的複數個運行數值進行暫存於複數個監測點資料暫存器中；以及將複數個監測點資料暫存器中的複數運行數值的至少一部份組合，以產生監測信號，且使受測裝置主動持續地透過其預設的輸出接腳依序輸出監測信號中的複數個運行數值，其中監測點資料暫存器電性連接測試點資料暫存器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A real-time active firmware debug method used to actively monitor the device under test in real time for debugging, and has steps as follows: sequentially reading a plurality of monitoring point addresses stored in a plurality of monitoring point address registers; sequentially reading a plurality of operation values ​​stored in a plurality of measuring point data registers corresponding to monitoring point addresses; ​​temporarily storing the read operation values in a plurality of monitoring point data registers; and combining at least a part of the operation values in the monitoring point data registers to generate a monitoring signal, and making the device under test actively and continuously outputs the operation values ​​in the monitoring signal sequentially through a preset output pin of the device under test, wherein the monitoring point data registers is electrically connected to the measuring point data registers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S500~S504:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="13" publication-number="202611865"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611865.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611865</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133042</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像對位系統及影像對位方法</chinese-title>  
        <english-title>IMAGE REGISTRATION SYSTEM AND IMAGE REGISTRATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120241202B">G06T7/70</main-classification>  
        <further-classification edition="201701120241202B">G06T7/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>由田新技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UTECHZONE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李偉聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WEI-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳東榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, DONG-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種影像對位方法，包括以下步驟：取得一受測物的一參考影像，及受測物的一受測影像；使用至少一核函數，從參考影像提取一第一特徵點集，及從受測影像提取一第二特徵點集；基於第一特徵點集及第二特徵點集，計算一組最佳轉換參數；使用最佳轉換參數計算第一特徵點集與第二特徵點集之間的多個特徵點配對；從特徵點配對中選出多個候選配對；以及基於候選配對，計算一轉換矩陣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image registration method is provided. The method includes following steps: obtaining a reference image of a tested object and a test image of the tested object; using at least one kernel function to extract a first feature point set from the reference image and a second feature point set from the test image; calculating a set of optimal transformation parameters based on the first feature point set and the second feature point set; using the set of optimal transformation parameters to calculate multiple feature point pairs between the first feature point set and the second feature point set; selecting multiple candidate pairs from the feature point pairs; and calculating a transformation matrix based on the candidate pairs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:影像對位方法</p>  
        <p type="p">S21-S26:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="14" publication-number="202611563"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611563.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611563</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133046</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241227B">G02B5/30</main-classification>  
        <further-classification edition="200601120241227B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅唯菘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, WEI-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖士福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SHIH-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚怡安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, I-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的電子裝置包括第一基板、電路層、多個電子單元以及圓偏振器。第一基板具有第一表面。電路層設置於第一表面上。多個電子單元設置於第一表面上且與電路層電性連接。圓偏振器包括相位延遲膜與設置於相位延遲膜上的線偏振膜，且線偏振膜包括功能區與冗餘區。於第一表面的法線方向上，冗餘區重疊多個電子單元，且功能區重疊第一基板未被多個電子單元覆蓋的區域上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device including a first substrate, a circuit layer, a plurality of electronic units and a circular polarizer. The first substrate has a first surface. The circuit layer is disposed on the first surface. The plurality of electronic units are disposed on the first surface and are electrically connected to the circuit layer. The circular polarizer includes a phase retardation film and a linear polarizing film disposed on the phase retardation film, and the linear polarizing film includes a functional region and a redundant region. In a normal direction of the first surface, the redundant region overlaps the plurality of electronic units, and the functional region overlaps an area of ​​the first substrate not covered by the plurality of electronic units.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10a:電子裝置</p>  
        <p type="p">100:圓偏振器</p>  
        <p type="p">AL:黏著層</p>  
        <p type="p">CL:電路層</p>  
        <p type="p">EU:電子單元</p>  
        <p type="p">EU1:紅色發光單元</p>  
        <p type="p">EU2:綠色發光單元</p>  
        <p type="p">EU3:藍色發光單元</p>  
        <p type="p">OP:開口</p>  
        <p type="p">R1:功能區</p>  
        <p type="p">R2:冗餘區</p>  
        <p type="p">SB1、SB2:基板</p>  
        <p type="p">SB1_S1、SB2_S1:第一表面</p>  
        <p type="p">SB1_S2、SB2_S2:第二表面</p>  
        <p type="p">TP:圖案化透明圖案</p>  
        <p type="p">n:法線方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="15" publication-number="202610598"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610598.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610598</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133047</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療肩關節損傷之骨板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">A61B17/58</main-classification>  
        <further-classification edition="200601120241029B">A61F2/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺北醫學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIPEI MEDICAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳家麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JIA-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於治療肩關節損傷之骨板，其包含一骨板本體及一瞄準板，該骨板本體包括一固定部以及一勾部。該固定部上設置有複數個固定孔及一容置槽，該勾部呈Z形且用於固定該肩峰鎖骨關節，該勾部連接於該固定部的一端，該瞄準板被配置為可設置於該固定部的容置槽中，該瞄準板上設置有複數個瞄準孔，其中當該固定部被放置於該肩峰鎖骨關節上且該瞄準板被設置於該固定部的容置槽中時，該瞄準板的瞄準孔對準該肩峰鎖骨關節之喙突鎖骨韌帶的解剖附著點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:骨板</p>  
        <p type="p">10:骨板本體</p>  
        <p type="p">11:固定部</p>  
        <p type="p">111:固定部頂面</p>  
        <p type="p">112:固定部底面</p>  
        <p type="p">113:第一端部</p>  
        <p type="p">114:第二端部</p>  
        <p type="p">115:鏤空區域</p>  
        <p type="p">115a:容置槽</p>  
        <p type="p">116:固定孔</p>  
        <p type="p">12:勾部</p>  
        <p type="p">13:瞄準板</p>  
        <p type="p">131:瞄準板頂面</p>  
        <p type="p">132:瞄準板底面</p>  
        <p type="p">133:瞄準孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="16" publication-number="202611599"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611599.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611599</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133049</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>共用背光的雙解析度顯示器</chinese-title>  
        <english-title>DUAL RESOLUTION DISPLAY WITH A SHARED BACKLIGHT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241119B">G02F1/133</main-classification>  
        <further-classification edition="200601120241119B">G02F1/13357</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITEMAX ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳景昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種共用背光的雙解析度顯示器，包括：裝飾板，具有第一表面與相對於第一表面的第二表面；背光模組，固定於裝飾板的第二表面上；第一顯示器，設置於裝飾板與背光模組之間，被配置為根據第一顯示解析度訊號對應顯示具有第一顯示解析度的畫面內容；及第二顯示器，相鄰於第一顯示器，第二顯示器被配置為根據第二顯示解析度訊號對應顯示具有第二顯示解析度的畫面內容；其中背光模組向第一顯示器與第二顯示器提供背光光源，並且第一顯示器與第二顯示器於裝飾板的第一表面上分別露出第一顯示區與第二顯示區，以呈現不同解析度的畫面內容。藉此，本發明的共用背光的雙解析度顯示器可用於電子遊戲機台上，並且解決電子遊戲機台的體積變大、變重的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dual resolution display with a shared backlight, including: a decorative panel having a first surface and second surface opposite to the first surface; a backlight module fixed on the second surface of the decorative panel; a first display, disposed between the decorative panel and the backlight module, is configured to display picture content with a first display resolution according to a first display resolution signal; and a second display, adjacent to the first display, the second is configured to display picture content with a second display resolution according to a second display resolution signal. The backlight module provides a blacklight source to the first display and the second display, and the first display and the second display respectively expose a first display area and a second display area on the first surface of the decorative panel. The display area is used to display picture content with different resolutions. Thereby, the dual resolution display with a shared backlight of the present invention can be used on an electronic game machine, and solves the problem of the electronic game machine becoming larger and heavier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:裝飾板</p>  
        <p type="p">11:第一表面</p>  
        <p type="p">12:第二表面</p>  
        <p type="p">20:背光模組</p>  
        <p type="p">30:第一顯示器</p>  
        <p type="p">40:第二顯示器</p>  
        <p type="p">50:訊號分配模組</p>  
        <p type="p">52:第一顯示訊號轉換模組</p>  
        <p type="p">54:第二顯示訊號轉換模組</p>  
        <p type="p">100:共用背光的雙解析度顯示器</p>  
        <p type="p">DS:顯示訊號</p>  
        <p type="p">DS1:第一顯示訊號</p>  
        <p type="p">DS2:第二顯示訊號</p>  
        <p type="p">RS1:第一顯示解析度訊號</p>  
        <p type="p">RS2:第二顯示解析度訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="17" publication-number="202611664"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611664.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611664</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133057</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>外接式電子顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G06F1/16</main-classification>  
        <further-classification edition="200601120241007B">G02F1/133</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酷特科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COOLTEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林胤臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YIN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種外接式電子顯示裝置，包含一殼體，一發光組件，一電路板及一液晶面板，該殼體成形一殼內空間，該發光組件設於該殼內空間，該電路板位於該殼內空間並設有一顯露於該殼體表面的連接埠，該電路板驅動該發光組件以使該殼內空間產生光亮，該液晶面板顯露於該殼體表面，該液晶面板不包含一背光模組，該液晶面板於該殼內空間為光亮時其顯示的資訊可以被觀察到，該液晶面板不限制由該殼體外部透視觀察該殼內空間。藉此，該外接式電子裝置提供的視覺感受不再只有該液晶面板顯示的畫面，該液晶面板未顯示時可透過該殼體內的光線展示該殼內空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:外接式電子顯示裝置</p>  
        <p type="p">21:殼體</p>  
        <p type="p">211:殼內空間</p>  
        <p type="p">212:安裝口</p>  
        <p type="p">213:開口</p>  
        <p type="p">214:承架</p>  
        <p type="p">216:定位口</p>  
        <p type="p">218:支柱</p>  
        <p type="p">219:內壁面</p>  
        <p type="p">220:殼件</p>  
        <p type="p">23:發光組件</p>  
        <p type="p">231:光線</p>  
        <p type="p">232:發光源</p>  
        <p type="p">233:載板</p>  
        <p type="p">24:電路板</p>  
        <p type="p">241:連接埠</p>  
        <p type="p">243:連接端口</p>  
        <p type="p">25:液晶面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="18" publication-number="202610592"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610592.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610592</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133058</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>神經肌肉疲勞檢測與評估系統</chinese-title>  
        <english-title>NEUROMUSCULAR FATIGUE DETECTION AND ASSESSMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241120B">A61B5/11</main-classification>  
        <further-classification edition="200601120241120B">A61B5/22</further-classification>  
        <further-classification edition="202101120241120B">A61B5/24</further-classification>  
        <further-classification edition="200601120241120B">A61B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣師範大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN NORMAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>保利泰有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLYPACT INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭景峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋鴻武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, HUNG-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種神經肌肉疲勞檢測與評估系統包括第一穿戴裝置、第二穿戴裝置以及電子設備。第一穿戴裝置設置有慣性測量單元，且配戴於被檢測對象的腰部後方；第二穿戴裝置設置有近紅外線光譜儀，該第二穿戴裝置用以配戴於被檢測對象的大腿股外側肌的肌腹位置的皮膚上。電子設備配備有無線裝置並以無線裝置無線電連接至第一穿戴裝置及第二穿戴裝置，其中，藉由被檢測對象實施一垂直跳躍，第一穿戴裝置及第二穿戴裝置分別蒐集於垂直跳躍的過程中由被檢測對象產生的包括加速度資訊及肌肉氧合濃度變化之檢測數據，並將檢測數據無線傳送至該電子設備進行分析，據以判斷該被檢測對象之神經肌肉疲勞程度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A neuromuscular fatigue detection and assessment system includes a first wearable device, a second wearable device and an electronic apparatus. The first wearable device is provided with an inertial measurement unit and is worn behind the waist of the subject. The second wearable device is provided with a near-infrared spectrometer and is worn on the skin of the vastus lateralis muscle belly of the thigh of the subject. The electronic apparatus is equipped with a wireless device and is wirelessly connected to the first wearable device and the second wearable device through the wireless device. With the subject performing a vertical jump, the first wearable device and the second wearable device respectively collect detection data including acceleration information and muscle oxygenation concentration change generated by the subject during the vertical jump, and the detection data are wirelessly transmitted to the electronic apparatus for analysis to determine the degree of neuromuscular fatigue of the subject.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:神經肌肉疲勞檢測與評估系統</p>  
        <p type="p">90:被檢測對象</p>  
        <p type="p">11:第一穿戴裝置</p>  
        <p type="p">12:第二穿戴裝置</p>  
        <p type="p">20:電子設備</p>  
        <p type="p">21:無線裝置</p>  
        <p type="p">P1、P2、P3、P4:處理程序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="19" publication-number="202610727"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610727.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610727</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133068</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液量控制裝置及應用其之液量控制方法</chinese-title>  
        <english-title>LIQUID VOLUME CONTROL DEVICE AND CONTROL METHOD FOR LIQUID VOLUME USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B05B12/08</main-classification>  
        <further-classification edition="200601120241007B">G01F23/292</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英華達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC APPLIANCES CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡岳志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, ARTHUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何宗揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, TSUNGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液量控制裝置，用以控制試管內的液體的液量。液量控制裝置包括一幫浦、一驅動器、一移動裝置、一攝像器以及一控制器。幫浦連接滴管，滴管用以將液體吸出試管外。驅動器連接幫浦，且用以驅動幫浦。移動裝置用以移動試管。攝像器用以擷取滴管的吸取端的第一影像以及試管內液體之第二影像，其中，在擷取第一影像時，試管位於攝像器的可拍攝區域之外；在擷取第二影像時，試管位於攝像器的可拍攝區域之中。控制器電性連接於該攝像器、移動裝置、驅動器及幫浦。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid volume control device for controlling a liquid volume of a liquid in a tube includes a pump, a driver, a moving device, a camera and a controller. The pump is connected to a dropper, which is used to suck the liquid out of a tube. The driver is connected to the pump and used to drive the pump. The moving device is used to move the tube. The camera is used to capture a first image of a suction end of the dropper and a second image of the liquid in the tube. When the first image is captured, the tube is outside a photographable area of the camera. When the second image is captured, the tube is inside the photographable area of the camera. The controller is electrically connected to the camera, the moving device, the driver and the pump.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:試管</p>  
        <p type="p">20:滴管</p>  
        <p type="p">100:液量控制裝置</p>  
        <p type="p">110:幫浦</p>  
        <p type="p">120:驅動器</p>  
        <p type="p">130:移動裝置</p>  
        <p type="p">140:攝像器</p>  
        <p type="p">150:儲存模組</p>  
        <p type="p">160:控制器</p>  
        <p type="p">162:分析模組</p>  
        <p type="p">164:計算模組</p>  
        <p type="p">166:影像處理模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="20" publication-number="202611377"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611377.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611377</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133069</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙節式迴路型耐震繫筋及其工法</chinese-title>  
        <english-title>DOUBLE-SECTION LOOP TYPE EARTHQUAKE-RESISTANT STIRRUP COMPRISING THE SAME AND CONSTRUCTING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241114B">E04C5/06</main-classification>  
        <further-classification edition="200601120241114B">E04C5/18</further-classification>  
        <further-classification edition="200601120241114B">E04G21/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柱中柱科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CIC TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江文財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, WEN TSAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱耕樟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, KENG CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳哲生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHE-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種雙節式迴路型耐震繫筋，每一組雙節式迴路型耐震繫筋包括二支迴彎形鋼筋，且每支迴彎形鋼筋具有第一部、第二部及彎折部，彎折部係位於第一部與第二部之間，其中，第一部遠離彎折部的一端與彎折部之間的最大距離為搭接長度，搭接長度係為迴彎形鋼筋之直徑的12至48倍。此外，本發明還關於一種雙節式迴路型耐震繫筋工法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a double-section loop type earthquake-resistant stirrup. Each of double-section loop type earthquake-resistant stirrup includes two bending steel bars, wherein each of bending steel bars include a first part, a second part and a bending part. The bending part is located between the first part and the second part, and the maximum distance between an end of the first part away from the bending part and the bending part is an overlap length. The overlap length is 12 to 48 times a diameter of the bending steel bar. Moreover, the present invention also relates to a constructing method of the aforementioned double-section loop type earthquake-resistant stirrup.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:柱主筋</p>  
        <p type="p">2:箍筋</p>  
        <p type="p">3,3a,3b:迴彎形鋼筋</p>  
        <p type="p">30:雙節式迴路型耐震繫筋</p>  
        <p type="p">31:第一部</p>  
        <p type="p">311:端</p>  
        <p type="p">32:第二部</p>  
        <p type="p">321:端</p>  
        <p type="p">33:彎折部</p>  
        <p type="p">100:鋼筋組件</p>  
        <p type="p">L:搭接長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="21" publication-number="202611878"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611878.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611878</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133092</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物情緒識別裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241105B">G06V40/16</main-classification>  
        <further-classification edition="201301120241105B">G10L25/63</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣龍實業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANATECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃韋欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李毓庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張朝坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種生物情緒識別裝置，包括：一數據採集模組，係通過攝影機獲得生物表情數據及行為數據；通過接觸或非接觸式傳感器獲得生理數據；通過麥克風獲得聲波數據；一數據處理模組，依據表情數據、行為數據、生理數據及聲波數據，以提取表情特徵、行為特徵、生理特徵及聲波特徵；一特徵融合模組，依表情特徵、行為特徵、生理特徵及聲波特徵並加以運算處理，以形成綜合特徵向量；一模型訓練及預測模組，依據綜合特徵向量，透過機器學習分類模組進行模型訓練，且對已訓練模型之實時數據進行情緒預測並獲得情緒預測數據；一展示模組，依據情緒預測數據並加以顯示，或透過轉換模組將情緒預測數據轉換成情緒預測文字、情緒預測圖形或情緒預測動畫並加以顯示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">1:生物</p>  
        <p type="p">2:數據採集模組</p>  
        <p type="p">21:攝影機</p>  
        <p type="p">22:接觸或非接觸式傳感器</p>  
        <p type="p">23:麥克風</p>  
        <p type="p">3:數據處理模組</p>  
        <p type="p">4:特徵融合模組</p>  
        <p type="p">5:模型訓練及預測模組</p>  
        <p type="p">51:轉換模組</p>  
        <p type="p">52:智慧反饋模組</p>  
        <p type="p">6:展示模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="22" publication-number="202612036"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612036.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612036</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>扇出型晶圓級封裝單元</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H01L21/60</main-classification>  
        <further-classification edition="200601120241007B">H01L21/768</further-classification>  
        <further-classification edition="200601120241007B">H01L23/498</further-classification>  
        <further-classification edition="200601120241007B">H01L23/528</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華東科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALTON ADVANCED ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于鴻祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HONG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古瑞庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, RUEI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種扇出型晶圓級封裝單元包括一載板、一第一介電層、多條第一導接線路、至少一第一裸晶（Die）、一第二介電層、至少一導電柱、多條第二導接線路、一第三介電層、多條第三導接線路及至少一第二裸晶；其中各該第一裸晶及各該第二裸晶能經由各該第一裸晶的第二面上的晶片區域的周圍的各該第一銲墊以對外電性連結；其中各該第一導接線路、各該第二導接線路及各該第三導接線路是利用先將金屬膏填注於凹槽中之後再研磨成型導接線路的技術製成，以解決現有的扇出型封裝技術在製作各導接線路時易產生較高製造成本且不利於環保的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:扇出型晶圓級封裝單元</p>  
        <p type="p">10:載板</p>  
        <p type="p">11:第一面</p>  
        <p type="p">13:載板介電層</p>  
        <p type="p">20:第一介電層</p>  
        <p type="p">30:第一導接線路</p>  
        <p type="p">40:第一裸晶</p>  
        <p type="p">43:第一晶墊</p>  
        <p type="p">44:晶片導電柱</p>  
        <p type="p">50:第二介電層</p>  
        <p type="p">60:導電柱</p>  
        <p type="p">70:第二導接線路</p>  
        <p type="p">80:第三介電層</p>  
        <p type="p">90:第三導接線路</p>  
        <p type="p">91:第一銲墊</p>  
        <p type="p">100:第二裸晶</p>  
        <p type="p">103:晶墊</p>  
        <p type="p">104:晶片導電柱</p>  
        <p type="p">110:錫球</p>  
        <p type="p">2:印刷電路板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="23" publication-number="202610797"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610797.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610797</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133099</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模具</chinese-title>  
        <english-title>MOLD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B29C33/00</main-classification>  
        <further-classification edition="200601120241007B">H01L21/60</further-classification>  
        <further-classification edition="200601120241007B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福懋科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FATC TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙國英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, KUO-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種模具，用以製造窗型球柵陣列封裝結構，其包含第一本體、第一凸出部、第二凸出部以及第二本體。第一本體具有第一表面以及凹陷部，凹陷部凹陷於第一表面。第一凸出部設置於第一表面並鄰接凹陷部。第二凸出部設置於第一表面，第二凸出部與第一凸出部彼此隔開以形成第一凹槽於其中。第二本體設置於第一表面，第二本體與第二凸出部彼此隔開以形成第二凹槽於其中，第二凸出部位於第一凸出部與第二本體之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mold used for manufacturing a window ball grid array (WBGA) package is provided. The mold includes a first body, a first protrusion, a second protrusion and a second body. The first body includes a first surface and a recess. The recess is recessed on the first surface. The first protrusion is disposed on the first surface and is adjacent to the recess. The second protrusion is disposed on the first surface. The second protrusion and the first protrusion are spaced apart from each other and form a first groove therebetween. The second body is disposed on the first surface. The second body and the second protrusion are spaced apart from each other and form a second groove therebetween. The second protrusion is located between the first protrusion and the second body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:模具</p>  
        <p type="p">110:第一本體</p>  
        <p type="p">120:第一凸出部</p>  
        <p type="p">130:第二凸出部</p>  
        <p type="p">140:第二本體</p>  
        <p type="p">D1:第一距離</p>  
        <p type="p">D2:第二距離</p>  
        <p type="p">G1:第一凹槽</p>  
        <p type="p">G2:第二凹槽</p>  
        <p type="p">H1:第一高度</p>  
        <p type="p">H2:第二高度</p>  
        <p type="p">R:凹陷部</p>  
        <p type="p">S1:第一表面</p>  
        <p type="p">S2:第二表面</p>  
        <p type="p">S3:第三表面</p>  
        <p type="p">S4:第四表面</p>  
        <p type="p">S5:第五表面</p>  
        <p type="p">S6:第六表面</p>  
        <p type="p">S7:第七表面</p>  
        <p type="p">W1:第一寬度</p>  
        <p type="p">W2:第二寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="24" publication-number="202612461"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612461.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612461</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133100</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動態隨機存取記憶體結構及其製造方法</chinese-title>  
        <english-title>DYNAMIC RANDOM ACCESS MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">H10B12/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白詣軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, YI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱顯傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, HSIEN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種動態隨機存取記憶體結構，包括基底、元件隔離結構、埋入式字元線、位元線以及多個儲存節點接觸窗。元件隔離結構位於基底中，並在基底內定義出多個主動區。埋入式字元線位在基底中，並與主動區以及元件隔離結構交叉，其中埋入式字元線沿第一方向延伸。位元線位在基底上並沿第二方向延伸，其中第二方向垂直於該第一方向。儲存節點接觸窗位在位元線的兩側並自基底上方延伸至各個主動區內。每個儲存節點接觸窗具有上窄下寬結構，且在所述上窄下寬結構內具有界面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dynamic random access memory structure includes a substrate, a device isolation structure, a buried word line, a bit line and a plurality of storage node contacts. The device isolation structure is located in the substrate and defines a plurality of active regions in the substrate. The buried word line is located in the substrate and crosses the active regions and the device isolation structure, wherein the buried word line extends along a first direction. The bit line is on the substrate and extends along a second direction, wherein the second direction is perpendicular to the first direction. The storage node contacts are located on both sides of the bit line and extend from the top of the substrate into the active region. Each storage node contacts has a structure with a narrow top and a wide bottom, and the structure with the narrow top and the wide bottom has an interface therein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">100t:頂部</p>  
        <p type="p">102:元件隔離結構</p>  
        <p type="p">110:位元線接觸窗</p>  
        <p type="p">110b:底面</p>  
        <p type="p">112:頂蓋層</p>  
        <p type="p">118、120:位元線間隙壁</p>  
        <p type="p">122:界面</p>  
        <p type="p">AA:主動區</p>  
        <p type="p">AAt:頂面</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">C1:第一導體層</p>  
        <p type="p">C2:第二導體層</p>  
        <p type="p">R2:第二凹陷部</p>  
        <p type="p">SNC:儲存節點接觸窗</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="25" publication-number="202611932"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611932.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611932</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133101</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快閃記憶體裝置及其編程方法</chinese-title>  
        <english-title>FLASH MEMORY DEVICE AND PROGRAM METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G11C16/10</main-classification>  
        <further-classification edition="200601120241202B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宗仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNG-ZEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種快閃記憶體裝置及其編程方法。快閃記憶體裝置包括記憶體陣列以及記憶體控制電路。記憶體陣列具有多個位元群組。記憶體控制電路經配置以依序對位元群組進行編程操作。在位元群組中的目標位元群組未通過編程驗證的情況下，記憶體控制電路對目標位元群組執行一或多次編程驗證循環，其中目標位元群組被區分為M個部分，M為大於1的正整數。記憶體控制電路判斷對目標位元群組所執行的編程驗證循環是否為初次的編程驗證循環。當對目標位元群組執行初次的編程驗證循環時，記憶體控制電路以第一編程時間來依序對M個部分進行編程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flash memory device and a program method thereof are provided. The flash memory device includes a memory array and a memory control circuit. The memory array has a plurality of bit groups. The memory control circuit is configured to sequentially perform program operations on the bit groups. The memory control circuit performs one or more program verification cycles on a target bit group in the bit groups when the target bit group fails a program verification, wherein the target bit group is divided into M parts, M is a positive integer greater than 1. The memory control circuit determines whether or not the program verification cycle performed on the target bit group is the first program verification cycle. The memory control circuit sequentially programs the M parts with a first programming time when the first program verification cycle is performed on the target bit group.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S200~S208:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="26" publication-number="202611456"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611456.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611456</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133104</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>並聯式水冷系統</chinese-title>  
        <english-title>PARALLEL WATER-COOLING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241227B">F28D5/00</main-classification>  
        <further-classification edition="200601120241227B">F28F1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張坤龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, KUN-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>季懿棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, YIDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種並聯式水冷系統包含多個冷板組件及一分集水器。冷板組件包含一冷板本體、一冷水供應分流管、一熱水回流分流管及一快拆接頭固定件。冷板本體係安裝於一主機板。冷水供應分流管與熱水回流分流管係分別連結於冷板本體。快拆接頭固定件係固定於主機板，並用以固定冷水供應分流管與熱水回流分流管。分集水器係安裝固定於伺服器內，並包含一總進水接頭、一總出水接頭、多個分流供水接頭及多個回流集水接頭。多個分流供水接頭係分別連通於總進水接頭與冷水供應分流管。多個回流集水接頭係分別連通於總出水接頭與熱水回流分流管。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A parallel water-cooling system includes multiple cold plate components and a manifold. Each cold plate component comprises a cold plate body, a cold water supply manifold, a hot water return manifold, and a quick-release connector fixture. The cold plate body is installed on a motherboard. The cold water supply manifold and the hot water return manifold are connected to the cold plate body. The quick-release connector fixture is secured to the motherboard and is used to fix the cold water supply manifold and the hot water return manifold in place. The manifold is installed and fixed inside the server, and it includes a main inlet connector, a main outlet connector, multiple supply distribution connectors, and multiple return collection connectors. The supply distribution connectors are each connected to the main inlet connector and the cold water supply manifold. The return collection connectors are each connected to the main outlet connector and the hot water return manifold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:並聯式水冷系統</p>  
        <p type="p">11,12:冷板組件</p>  
        <p type="p">111,121:冷板本體</p>  
        <p type="p">1111,1211:進水口</p>  
        <p type="p">1112,1212:出水口</p>  
        <p type="p">112,122:冷水供應分流管</p>  
        <p type="p">113,123:熱水回流分流管</p>  
        <p type="p">114,124:快拆接頭固定件</p>  
        <p type="p">13:分集水器</p>  
        <p type="p">131:總進水接頭</p>  
        <p type="p">132:總出水接頭</p>  
        <p type="p">2:伺服器</p>  
        <p type="p">21:機殼</p>  
        <p type="p">22,23:主機板</p>  
        <p type="p">3:冷水供應管路</p>  
        <p type="p">4:熱水回流管路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="27" publication-number="202612263"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612263.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612263</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133106</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聲波裝置及其製造方法</chinese-title>  
        <english-title>ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">H03H3/08</main-classification>  
        <further-classification edition="200601120241231B">H03H9/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立積電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詩猛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳詩喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種聲波裝置及其製造方法。聲波裝置包含壓電基板及串接換能器組。壓電基板具有表面，串接換能器組包含串聯的第一換能器及第二換能器，並設置在壓電基板的表面上。第一換能器包含第一電極及共用電極，且第二換能器包含第二電極與共用電極，共用電極電位浮接，且第一換能器及第二換能器以共用電極形成串聯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An acoustic wave device and the manufacturing method thereof. An acoustic wave device includes a piezoelectric substrate and a series-connected transducer set. The piezoelectric substrate has a surface. The series-connected transducer set includes a first transducer and a second transducer coupled in series and is disposed on the surface of the piezoelectric substrate. The first transducer includes a first electrode and a common electrode, and the second transducer includes a second electrode and the common electrode. The potential of the common electrode is floating, and the first transducer and the second transducer are coupled in series using the common electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:聲波裝置</p>  
        <p type="p">10:基板</p>  
        <p type="p">131,132:電極</p>  
        <p type="p">141:共用電極</p>  
        <p type="p">151,152:偽電極</p>  
        <p type="p">121,122:母線</p>  
        <p type="p">e11,e21:側邊</p>  
        <p type="p">A1,A2:重疊區域</p>  
        <p type="p">IDT1,IDT2:換能器</p>  
        <p type="p">e411,e412:邊緣</p>  
        <p type="p">D1,D2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="28" publication-number="202611397"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611397.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611397</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合離岸風機與波浪能為基礎之魚礁永續裝置</chinese-title>  
        <english-title>WAVE ENERGY-BASED REEF SUSTAINABLE DEVICE INTEGRATED WITH OFFSHORE WIND TURBINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241007B">F03D13/25</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐庭嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU, TING-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種整合離岸風機與波浪能為基礎之魚礁永續裝置。整合離岸風機與波浪能為基礎之魚礁永續裝置可投放至一海床、可連接浮動式風機，並包括座體、錨固裝置、燈光裝置及綠能裝置。座體可作為一魚礁。錨固裝置設置於座體上、可連接浮動式風機並包括具有發光塗層的扣環與具有發光層的繫泊系統或纜繩。扣環藉由浮動式風機的拉動而晃動及/或轉動，並呈現閃爍效果來聚魚。具有發光層的繫泊系統或纜繩可提供警示效果。燈光裝置設置於座體中並可發光聚魚。綠能裝置設置於座體上並電性連接燈光裝置，且可將綠能轉換為電能並供應至燈光裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a wave energy-based reef sustainable device integrated with an offshore wind turbine. The wave energy-based reef sustainable device integrated with an offshore wind turbine can be put into a seabed, is configured to connect with a floating wind turbine, and includes a base, an anchoring device, a lighting device and a green energy device. The base is configured as a fish reef. The anchoring device is disposed on the base, configured to connect with the floating wind turbine, and includes plural rings with a luminous coating and at least one mooring system or cable with a luminous layer. The rings swing and/or rotate due to the pull of the floating wind turbine, and present a flashing effect to attract fish. The mooring system or cable with the luminous layer provides a warning effect. The lighting device is disposed in the base and configured to emit light to attract fish. The green energy device is disposed on the base, electrically connected to the lighting device and configured to convert a green energy into an electrical energy, which is provided to the lighting device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:整合離岸風機與波浪能為基礎之魚礁永續裝置</p>  
        <p type="p">110:座體</p>  
        <p type="p">111:橫向通道</p>  
        <p type="p">120:錨固裝置</p>  
        <p type="p">121a:扣環</p>  
        <p type="p">122a:繫泊系統或纜繩</p>  
        <p type="p">130:燈光裝置</p>  
        <p type="p">140:綠能裝置</p>  
        <p type="p">200:海床</p>  
        <p type="p">300:浮動式風機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="29" publication-number="202611303"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611303.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611303</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133108</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>合金靶材及其製造方法</chinese-title>  
        <english-title>ALLOY TARGET AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">C22C1/02</main-classification>  
        <further-classification edition="200601120240930B">C22C5/02</further-classification>  
        <further-classification edition="200601120240930B">C23C14/34</further-classification>  
        <further-classification edition="200601120240930B">B22D27/04</further-classification>  
        <further-classification edition="200601120240930B">B22D27/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鑫科材料科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THINTECH MATERIALS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文記</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫宸楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, CHEN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡欣翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, SHIN HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇朝正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHAU-JENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>管琪芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUAN, CHI-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景扶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關於一種合金靶材及其製造方法。此方法將特定組成的熔融合金液注入至動態凝固裝置後，控制動態凝固裝置之溫控澆鑄模具的溫度、動態凝固裝置之驅動裝置的振動頻率以及振動冷卻步驟之降溫速率，由此製得的合金靶材具有特定規格之樹枝狀晶。此合金靶材可應用於薄膜濺鍍及電子元件之鍵合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an alloy target and method of manufacturing the same. In this method, a molten alloy liquid with a specific composition is injected into the dynamic solidification apparatus, followed by controlling the temperature of the temperature-controlled casting mold of the dynamic solidification apparatus, the vibration frequency of the driving device of the dynamic solidification apparatus, and the cooling rate of the vibration cooling step. The produced alloy target has dendrites with specific specifications. The alloy target can be applied to thin film sputtering and bonding of electronic components.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110,120,130:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="30" publication-number="202610536"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610536.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610536</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133118</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>外掛式溢水器及具有外掛式溢水器的花盆</chinese-title>  
        <english-title>EXTERNAL OVERFLOW DEVICE AND FLOWER POT WITH EXTERNAL OVERFLOW DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120240912B">A01G9/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WUN-HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WUN-HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有外掛式溢水器的花盆，包含一花盆及一溢水器，其中，花盆具有一盆壁定義一預留高度設有一預留口。溢水器具有一本體，本體內設有一空間，本體定義一溢水側及一出水側，溢水側側壁在不同高度傾斜成型複數溢水口連通空間，出水側側壁成型一出水口連通空間，出水側側壁組設於花盆的盆壁，且出水口連接花盆的預留口。藉此，各溢水口在不同高度以調節不同的蓄水量提升使用便利性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flower pot with an external overflow device comprises a flower pot and an overflow device, the flower pot has a pot wall defining a predetermined height and a predetermined opening disposed at the predetermined height. The overflow device has a body, and a space is provided in the body. The body defines an overflowing side and a water outlet side. A side wall of the overflowing side is inclined at different heights to form a plurality of overflowing inlets communicating with a space, a side wall of the water outlet side forms a water outlet communicating with the space, the side wall of the water outlet side is assembled on the pot wall of the flower pot, and the water outlet is connected to the predetermined opening of the flower pot.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:花盆</p>  
        <p type="p">11:盆底</p>  
        <p type="p">12:盆壁</p>  
        <p type="p">13:盆緣</p>  
        <p type="p">20:溢水器</p>  
        <p type="p">21:本體</p>  
        <p type="p">22:溢水側</p>  
        <p type="p">221:高側</p>  
        <p type="p">222:低側</p>  
        <p type="p">22W:溢水口</p>  
        <p type="p">22P:啟閉件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="31" publication-number="202612193"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612193.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612193</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器</chinese-title>  
        <english-title>CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">H01R13/629</main-classification>  
        <further-classification edition="200601120241127B">H01R13/633</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啓碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WNC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊蘭淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LAN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳蕙萁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HUEI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王嘉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接器，適於連接一線材。該連接器包括一連接器本體、一解鎖機構以及一延伸拉柄。連接器本體包括一第一側面、一第二側面、一第三側面、一第四側面以及一連接埠，其中，該連接埠形成於該第四側面，該線材適於連接該連接埠。解鎖機構包括一第一臂、一第二臂以及一拉柄，該第一臂連接該拉柄之一側，該第二臂連接該拉柄之另一側，該第一臂設於該第一側面，該第二臂設於該第二側面，該拉柄僅沿一第一平面延伸，該第一平面平行於該第三側面。延伸拉柄連接該拉柄，其中，該延伸拉柄沿該第一平面延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A connector suitable for connecting a wire is provided. The connector includes a connector body, an unlocking mechanism, and an extended pull handle. The connector body includes a first side, a second side, a third side, a fourth side, and a port, wherein the port is formed on the fourth side, and the wire is suitable for connecting to the port. The unlocking mechanism includes a first arm, a second arm, and a pull handle, with the first arm connected to one side of the pull handle and the second arm connected to the other side of the pull handle. The first arm is disposed on the first side, the second arm is disposed on the second side, and the pull handle extends only along a first plane parallel to the third side. The extended pull handle is connected to the pull handle, wherein the extended pull handle extends along the first plane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C:連接器</p>  
        <p type="p">L:線材</p>  
        <p type="p">1:連接器本體</p>  
        <p type="p">101:第一側面</p>  
        <p type="p">103:第三側面</p>  
        <p type="p">104:第四側面</p>  
        <p type="p">2A:解鎖機構</p>  
        <p type="p">21:第一臂</p>  
        <p type="p">23A:拉柄</p>  
        <p type="p">3:延伸拉柄</p>  
        <p type="p">4:連接器蓋體</p>  
        <p type="p">41:散熱鰭片</p>  
        <p type="p">P1:第一平面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="32" publication-number="202611495"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611495.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611495</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133122</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬氧化物半導體電晶體的檢測方法</chinese-title>  
        <english-title>DETECTION METHOD OF MOS TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250618B">G01N1/28</main-classification>  
        <further-classification edition="200601120250618B">G01N1/32</further-classification>  
        <further-classification edition="200601120250618B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳智勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHI SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭盈廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YING-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種金屬氧化物半導體電晶體的檢測方法，其包括以下步驟。提供金屬氧化物半導體電晶體，其中所述金屬氧化物半導體電晶體的源極與汲極各自與接觸窗連接。移除所述接觸窗，以形成暴露出所述源極與所述汲極的接觸窗孔洞。經由所述接觸窗孔洞移除所述源極與所述汲極，以形成凹槽。於所述觸窗孔洞與所述凹槽中填入保護材料。獲得所述凹槽的剖面輪廓。根據所述凹槽的所述剖面輪廓判定所述金屬氧化物半導體電晶體是否失效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detection method of a MOS transistor is provided. The detection method includes the following steps. A MOS transistor is provided, wherein the source and the drain of the MOS transistor are each connected to a contact. The contacts are removed to form contact holes exposing the source and the drain. The source and the drain are removed through the contact holes to form recesses. The contact holes and the recesses are filled with a. protective material. The cross-sectional profiles of the recesses are obtained. It is determined whether the MOS transistor is failed according to the cross-sectional profiles of the recesses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:基底</p>  
        <p type="p">104:閘介電層</p>  
        <p type="p">106:閘極</p>  
        <p type="p">108:覆蓋層</p>  
        <p type="p">110:間隔件</p>  
        <p type="p">116:保護材料</p>  
        <p type="p">GS:閘極結構</p>  
        <p type="p">H:接觸窗孔洞</p>  
        <p type="p">R:凹槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="33" publication-number="202610854"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610854.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610854</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133124</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動定位節能判斷方法</chinese-title>  
        <english-title>AUTOMATIC POSITIONING ENERGY-SAVING JUDGMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B60C23/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>系統電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYSGRATION LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史　都華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEWART, WILLIAM DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游智為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊益松</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種自動定位節能判斷方法，其步驟包含: 行/停車模式判斷步驟、停車進階判斷步驟(一)、停車進階判斷步驟(二)、訊息傳送比對步驟及資料重置步驟，透過各胎壓偵測器內所界定的行車門檻值、停車門檻值、移動門檻值、自動定位門檻值、移動變異區間值的界定下，進一步能夠區分為行車模式及停車模式兩種狀態，並於停車模式下判斷各胎壓偵測器所移動的次數並予以紀錄，透過所記錄的次數之數值與前述的各門檻值進行比對，位於車輛內的主機會根據比對下的結果進而判斷各胎壓偵測器是否要進行自動定位，藉此能夠合適的狀態下進行自動定位，進而達到節省各胎壓偵測器所耗費的電力，且可省去有時不必要的自動定位執行時間，開車後便立即得到正確的輪胎資訊，省時又省電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is an automatic positioning energy-saving judgment method. The steps include: a driving/parking mode judgment step, a parking advanced judgment step (1), a parking advanced judgment step (2), a message transmission comparison step and a data reset step. Through the definition of the driving threshold, parking threshold, movement threshold, automatic positioning threshold, and movement variation interval defined in each tire pressure detector, it can be further distinguished into two states: driving mode and parking mode. And in parking mode, the number of times each tire pressure detector is moved is determined and recorded. By comparing the recorded number of times with the aforementioned thresholds, the host computer located in the vehicle will based on the comparison results. Then it is determined whether each tire pressure detector needs to be automatically positioned, so that automatic positioning can be performed in a suitable state, thereby saving the power consumed by each tire pressure detector and eliminating the need for sometimes unnecessary automatic positioning execution. time, you can get the correct tire information immediately after driving, saving time and energy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:行/停車模式判斷步驟</p>  
        <p type="p">S2:停車進階判斷步驟(一)</p>  
        <p type="p">S3:停車進階判斷步驟(二)</p>  
        <p type="p">S4:訊息傳送比對步驟</p>  
        <p type="p">S5:資料重置步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="34" publication-number="202610880"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610880.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610880</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133125</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可方便組設於不同車種之加熱方向盤結構</chinese-title>  
        <english-title>HEATED STEERING WHEEL STRUCTURE THAT CAN BE EASILY ASSEMBLED IN DIFFERENT TYPES OF VEHICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241114B">B62D1/04</main-classification>  
        <further-classification edition="200601120241114B">B62D1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>統亞電子科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG YAH ELECTRONIC TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSUNG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豐裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種可方便組設於不同車種之加熱方向盤結構，其主要在方向盤下方組設一盤座模組，所述盤座模組包含有上蓋、轉盤蓋、轉盤及底座，其中所述轉盤對應嵌入所述底座內，並安裝有水平向之內、外導電環，所述轉盤蓋覆蓋在所述轉盤上方並與所述底座結合，在所述轉盤蓋上設有分別與所述內、外導電環導通電力的導柱組件，再於所述轉盤蓋上覆合上蓋，且所述上蓋內設有一因應不同車輛而設的襯套，透過所述襯套讓所述盤座模組對應連接一束環組[或C型扣件] 帶動車輛轉向的控制軸部；藉此，讓加熱方向盤可安裝在不同類型的車輛上，不但可簡化整體結構、避免習用產品的軟排線產生纏繞問題，並可有效縮小體積且能提供更穩定可靠的導電效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a heated steering wheel structure that can be easily assembled in different types of vehicles. The primary feature is a assembly of a base module beneath the steering wheel, which includes an upper cover, a rotating disk cover, a rotating disk, and a base. The rotating disk is designed to fit into the base and is equipped with horizontal inner and outer conductive rings. The rotating disk cover is placed over the rotating disk and combined with the base. The rotating disk cover is fitted with guide pin components that respectively conduct power to the inner and outer conductive rings. The upper cover is then assembled over the rotating disk cover, and inside the upper cover is a bushing adaptable to different vehicles. Through the bushing, the base module is connected to a clamp ring assembly [or C-shaped fastener] that drives a control shaft to steer the vehicle. This configuration allows the heated steering wheel to be installed on various types of vehicles, simplifying the overall structure, avoiding the entanglement issues common with traditional flexible cables, reducing the size, and providing a more stable and reliable conductive effect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:方向盤</p>  
        <p type="p">2:控制軸部</p>  
        <p type="p">21:束環組</p>  
        <p type="p">211:第一束環</p>  
        <p type="p">212:第二束環</p>  
        <p type="p">213:第一凹部</p>  
        <p type="p">214:第二凹部</p>  
        <p type="p">215:第一限位凹槽</p>  
        <p type="p">A:盤座模組</p>  
        <p type="p">45:線座</p>  
        <p type="p">46:電線</p>  
        <p type="p">6:上蓋</p>  
        <p type="p">61:軸套孔</p>  
        <p type="p">613:螺孔</p>  
        <p type="p">62:穿線孔</p>  
        <p type="p">63:傳輸線</p>  
        <p type="p">7:襯套</p>  
        <p type="p">71:軸孔</p>  
        <p type="p">72:造型盤面</p>  
        <p type="p">721:鎖孔</p>  
        <p type="p">73:軸座</p>  
        <p type="p">74:螺設件</p>  
        <p type="p">75:螺帽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="35" publication-number="202611460"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611460.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611460</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133126</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>均溫板結構</chinese-title>  
        <english-title>VAPOR CHAMBER STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241113B">F28D15/04</main-classification>  
        <further-classification edition="200601120241113B">F28F3/00</further-classification>  
        <further-classification edition="200601120241113B">F28F21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳興奇宏科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIA VITAL COMPONENTS (CHINA) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉漢敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HAN-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周小祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, XIAO-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫大龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種均溫板結構，包括：一上蓋板、一下蓋板、至少一毛細結構層及至少一碳元素單元。該上蓋板與下蓋板對應蓋合界定一真空腔室，該真空腔室中填充有一工作流體；所述毛細結構層係設置於該下蓋板內側表面；所述碳元素單元可被設置在所述毛細結構層與該下蓋板之間或該下蓋板外側表面其中任一；藉此，本發明均溫板結構透過所述碳元素單元可大幅提高均溫性以達成更高效的熱傳導以及循環效率者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:上蓋板</p>  
        <p type="p">22:下蓋板</p>  
        <p type="p">23:碳元素單元</p>  
        <p type="p">24:毛細結構層</p>  
        <p type="p">3:真空腔室</p>  
        <p type="p">4:電子元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="36" publication-number="202612205"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612205.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612205</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133129</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電力保護裝置及包含其之供電系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H02H3/253</main-classification>  
        <further-classification edition="200601120241202B">H02H7/08</further-classification>  
        <further-classification edition="200601120241202B">H02H3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊岱諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊岱諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種電力保護裝置，其包括：一第一輸入電源連接端、一第二輸入電源連接端、一第三輸入電源連接端、一電磁接觸器、一第一電源輸出端、一第二電源輸出端、一第三電源輸出端、一第一切換單元、一第二切換單元、以及一第三切換單元。具體地，本發明之電力保護裝置係應用於一三相三線供電系統之中，用以在該供電系統所提供的三相三線電源發生線間短路或欠相時啟動，以阻斷三相三線電源與後端負載裝置(如：馬達)之連接，從而實現保護負載裝置及三相三線電源之功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電力保護裝置</p>  
        <p type="p">11:電磁接觸器</p>  
        <p type="p">12:第一切換單元</p>  
        <p type="p">13:第二切換單元</p>  
        <p type="p">14:第三切換單元</p>  
        <p type="p">15:重置開關</p>  
        <p type="p">16:漏電斷路器</p>  
        <p type="p">17:第一指示燈</p>  
        <p type="p">18:第二指示燈</p>  
        <p type="p">19:第三指示燈</p>  
        <p type="p">1A:蜂鳴器</p>  
        <p type="p">1B:計數器</p>  
        <p type="p">1C:第一限流保護器</p>  
        <p type="p">1D:第二限流保護器</p>  
        <p type="p">1E:第三限流保護器</p>  
        <p type="p">Ain:第一輸入電源連接端</p>  
        <p type="p">Bin:第二輸入電源連接端</p>  
        <p type="p">Cin:第三輸入電源連接端</p>  
        <p type="p">Uout:第一輸入電源連接端</p>  
        <p type="p">Vout:第二輸入電源連接端</p>  
        <p type="p">Wout:第三輸入電源連接端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="37" publication-number="202611534"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611534.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611534</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133130</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>繼電器檢測裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G01R31/327</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊岱諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊岱諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種繼電器檢測裝置，其包括：一第一輸入電源連接端、一第二輸入電源連接端、N個電連接單元、一開關、一指示燈、P個第一指示燈、以及Q個第二指示燈。本發明之繼電器檢測裝置用以確認受檢的繼電器的a接點、b接點及/或(電磁)線圈是否正常運作。具體地，當b接點正常閉合(close)且a接點正常打開(open)時，所述第二指示燈被點亮且所述第一指示燈熄滅。並且，當b接點正常切換至打開(open)且a接點正常切換至閉合(close)時，所述第一指示燈被點亮且所述第二指示燈熄滅。特別地，由於本發明之繼電器檢測裝置具有N個電連接單元用以對應連接N個繼電器，因此可以同時對N個繼電器進行檢測操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:繼電器檢測裝置</p>  
        <p type="p">11:電連接單元</p>  
        <p type="p">12:開關</p>  
        <p type="p">13:指示燈</p>  
        <p type="p">14:第一指示燈</p>  
        <p type="p">15:第二指示燈</p>  
        <p type="p">16:重設開關單元</p>  
        <p type="p">In1:第一輸入電源連接端</p>  
        <p type="p">In2:第二輸入電源連接端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="38" publication-number="202610844"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610844.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610844</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴墨晶片結構</chinese-title>  
        <english-title>INKJET CHIP STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241120B">B41J2/14</main-classification>  
        <further-classification edition="200601120241120B">B41J2/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>研能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫皓然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOU, HAO-JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張正明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖文雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, WEN-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種噴墨晶片結構，用於單色與多色列印，包含噴孔片及噴墨晶片。噴孔片的表面上具有數個噴孔。噴孔片設置於噴墨晶片表面上。噴墨晶片更包含複數個墨滴產生器。每一個墨滴產生器對應一個噴孔，且具有晶片基板、熱障層、加熱電阻層、導電層、保護層以及障壁層，並依序堆疊形成堆疊結構。加熱電阻層包含加熱電阻器，用於以加熱墨水。噴孔片的噴孔之直徑係為不同的大小。加熱電阻器對應於噴孔設置。每一個加熱電阻器的面積大小均相等。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An inkjet chip structure for single color or multi-color printing is disclosed and includes a nozzle plate and an inkjet chip. The nozzle plate has a plurality of nozzles disposed on a surface thereof. The nozzle plate is disposed on a surface of the inkjet chip. The inkjet chip further includes a plurality of ink drop generators. Each of the ink drop generators is corresponded to one of the nozzles, and includes a substrate, a thermal barrier layer, a heat resistance layer, a conductive layer, a protection layer and a barrier layer, which are stacked in sequence to form a stacked structure. The heat resistance layer includes a heat resistor for heating ink. Each of the nozzles of the nozzle plate has different diameter. The heat resistor is corresponded to one of the nozzles. Each of the heat resistors has same area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:噴墨晶片結構</p>  
        <p type="p">11:噴孔</p>  
        <p type="p">20:噴墨晶片</p>  
        <p type="p">23:供墨孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="39" publication-number="202611481"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611481.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611481</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133136</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>棒材直線度偏差評估方法、系統、電腦程式產品及電腦可讀取紀錄媒體</chinese-title>  
        <english-title>METHOD, SYSTEM, COMPUTER PROGRAM PRODUCT, AND COMPUTER-READABLE RECORDING MEDIUM FOR EVALUATING STRAIGHTNESS DEVIATION OF BARS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G11B11/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TUNG-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊諴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝源盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, YUAN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種棒材直線度偏差評估方法、系統、電腦程式產品及電腦可讀取紀錄媒體，該方法由一處理器執行，包括：獲取沿一軸向間隔設置的至少四光學感測組對沿該軸向移動的一棒材量測的數據，該數據與在數個離散時間中的每一者擷取的至少四個棒材截面的幾何特徵及空間特徵相關聯；對於每個離散時間，依據該至少四個棒材截面的幾何特徵及空間特徵與該至少四光學感測組的軸向座標擬合產生一量測區域的空間彎曲間隙值；及基於每個離散時間的空間彎曲間隙值產生一曲度曲線，該曲度曲線包括一瞬間峰值。藉此，可自動大量評估棒材局部曲度或直度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method, a system, a computer program product, and a computer-readable recording medium for evaluating straightness deviation of bars are disclosed. The method, executed by a processor, includes acquiring data measured by at least four optical sensing assemblies spaced in an axial direction on a bar moving in the axial direction, wherein the data is associated with geometric and spatial characteristics of at least four bar sections captured at each of several discrete times; for each discrete time, generating a spatial bending gap value of a measurement area in a fitting manner based on the geometric and spatial characteristics of the at least four bar sections and axial coordinates of the at least four optical sensors; and generating a curvature curve based on the spatial bending gap value for each discrete time, wherein the curvature curve includes an instantaneous peak value. This way, it is possible to evaluate bar local curvature or straightness on a large scale automatically.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="40" publication-number="202611408"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611408.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611408</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱風扇</chinese-title>  
        <english-title>COOLING FAN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241114B">F04D29/44</main-classification>  
        <further-classification edition="200601120241114B">F04D25/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>建準電機工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫安柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOHAMMED ABDELKAREEM MOSTAFA AMER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JO</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱風扇，用以解決習知散熱風扇進風量不足的問題。係包含：一扇框，具有一基座，一側牆連接該基座，一蓋板連接該側牆，該蓋板與該基座相對，該蓋板具有一入風口，該基座、該側牆及該蓋板共同形成一出風口；一扇輪，可旋轉地位於該扇框內，該扇框具有一風道；至少一增壓體，鄰接該風道，該至少一增壓體具有一導流面；及一氣流槽道，位於該扇框內，該氣流槽道軸向對位於該至少一增壓體，該氣流槽道徑向延伸至該導流面以連通該風道，該氣流槽道另朝該側牆徑向延伸以連接該側牆。藉此可以達成提升散熱風扇之散熱效率功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cooling fan is used to solve the problem of insufficient air intake of conventional cooling fans. Includes: a fan frame with a base, one side wall connected to the base, a cover plate connected to the side wall, the cover plate opposite to the base, the cover plate has an air inlet, the base, the side wall and the cover together form an air outlet; a fan wheel is rotatably located in the fan frame, and the fan frame has an air duct; at least one pressurizing body is adjacent to the air duct, and the at least one pressurizing body has an air guide surface; and an air flow channel located in the fan frame, the air flow channel is axially aligned with the at least one pressurizing body, and the air flow channel extends radially to the air guide surface to communicate with the air channel , the airflow channel extends radially toward the side wall to connect the side wall. This can improve the cooling efficiency of the cooling fan.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:扇框</p>  
        <p type="p">11:基座</p>  
        <p type="p">12:側牆</p>  
        <p type="p">13:蓋板</p>  
        <p type="p">14:入風口</p>  
        <p type="p">15:出風口</p>  
        <p type="p">16:軸管</p>  
        <p type="p">17:定子</p>  
        <p type="p">2:扇輪</p>  
        <p type="p">21:輪轂</p>  
        <p type="p">22:葉片</p>  
        <p type="p">23:轉軸</p>  
        <p type="p">3:增壓體</p>  
        <p type="p">31:導流面</p>  
        <p type="p">31a:第一端部</p>  
        <p type="p">31b:第二端部</p>  
        <p type="p">F:散熱風扇</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="41" publication-number="202611719"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611719.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611719</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>溫度感測方法、觸控處理裝置、主機和觸控系統</chinese-title>  
        <english-title>TEMPERATURE SENSING METHOD, TOUCH SENSITIVE PROCESSING APPARATUS, HOST, AND TOUCH SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G06F11/30</main-classification>  
        <further-classification edition="200601120241007B">G01K7/16</further-classification>  
        <further-classification edition="200601120241007B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>禾瑞亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGALAX_EMPIA TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張欽富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯慶辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種溫度感測方法，包含：一觸控處理裝置自一主機接收溫度量測的一指令，其中該指令指定量測一觸控螢幕的部分或全部的一表面的溫度；該觸控處理裝置分別針對該表面所對應的至少一條電路進行溫度量測，以得到至少一溫度值；以及該觸控處理裝置回報該至少一溫度值至該主機。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A temperature sensing method, comprising: receiving, by a touch sensitive processing apparatus, an instruction from a host for temperature sensing, wherein the instruction designates to sense temperature of a partial or a full surface of a touch screen; sensing temperatures by the touch sensitive processing apparatus with regard to at least one circuit corresponding to the surface, respectively, to get at least one temperature value; and reporting, by the touch sensitive processing apparatus, the at least one temperature value to the host.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:溫度感測方法</p>  
        <p type="p">410~460:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="42" publication-number="202610676"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610676.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610676</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含馬告果實萃取物之水凝膠及其用於痛風性關節炎之用途</chinese-title>  
        <english-title>HYDROGEL CONTAINING LITSEA CUBEBA FRUIT EXTRACT AND USE FOR GOUTY ARTHRITIS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">A61K36/54</main-classification>  
        <further-classification edition="200601120241001B">A61K9/06</further-classification>  
        <further-classification edition="200601120241001B">A61K47/32</further-classification>  
        <further-classification edition="200601120241001B">A61P19/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大葉大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAYEH UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費生恩分子應用股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FETHIANN MOLECULE APPLIED CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡仁傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JEN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭峻生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHUN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖淑娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SHU-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃大維</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種包含馬告果實萃取物之水凝膠及其用於痛風性關節炎之用途，所述馬告果實萃取物係藉由超臨界二氧化碳所萃取而得，而所述水凝膠係為溫敏性水凝膠。藉由將所述包含馬告果實萃取物之水凝膠塗抹於痛風性關節炎之患部，藉由溫度變化使馬告果實萃取物緩慢釋放至所述患部，進而減緩發炎及疼痛。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a hydrogel containing Litsea cubeba fruit extract and use for gouty arthritis thereof. The Litsea cubeba fruit extract is extracted by supercritical carbon dioxide, and the hydrogel is thermosensitive hydrogel. By applying the hydrogel containing Litsea cubeba fruit extract to the affected area of ​​gouty arthritis, the Litsea cubeba fruit extract is slowly released to the affected area through temperature changes, thereby alleviating inflammation and pain.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="43" publication-number="202611830"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611830.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611830</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133152</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>網站站內商品搜尋系統及其網站站內商品搜尋方法</chinese-title>  
        <english-title>WEBSITE PRODUCT SEARCH SYSTEM AND WEBSITE PRODUCT SEARCH METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">G06Q30/06</main-classification>  
        <further-classification edition="201901120241202B">G06F16/95</further-classification>  
        <further-classification edition="201901120241202B">G06F16/9535</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣大哥大股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張崇文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUNG-UEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱盈助</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YING-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林永宸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YONG-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游善合</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SHAN-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓世翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SHIN-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宗佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TZUNG-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種網站站內商品搜尋系統，包含收發介面以及處理單元。處理單元電性連接至收發介面，並用以執行網站系統。該網站系統包含快取系統以及自建搜尋引擎。網站系統包含以下運作：透過收發介面接收搜尋關鍵字；儲存搜尋關鍵字至快取系統；透過自建搜尋引擎，依據搜尋關鍵字產生複數筆自建搜尋結果；判斷快取系統是否具有相關於搜尋關鍵字的第三方搜尋結果紀錄；以及當快取系統未具有第三方搜尋結果紀錄，透過收發介面輸出該些自建搜尋結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A website product search system includes a transceiver interface and a processing unit. The processing unit is electrically connected to the transceiver interface and configured to perform the website system. The website system includes a cache system and a self-built search engine. The website system includes following operations: receiving a search keyword by the transceiver interface; storing the search keyword into the cache system; generating a plurality of self-built search results based on the search keyword by the self-built search engine; determining whether the cache system has a third-party search result record related to the search keyword; and outputting the self-built search results by the transceiver interface when the cache system does not have the third-party search result record.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:網站站內商品搜尋系統</p>  
        <p type="p">110:收發介面</p>  
        <p type="p">120:處理單元</p>  
        <p type="p">122:網站系統</p>  
        <p type="p">122A:快取系統</p>  
        <p type="p">122B:自建搜尋引擎</p>  
        <p type="p">130:儲存單元</p>  
        <p type="p">132:商品資料庫</p>  
        <p type="p">140:排程程序</p>  
        <p type="p">150:第三方大型搜尋引擎</p>  
        <p type="p">160:使用者</p>  
        <p type="p">API:應用程式介面</p>  
        <p type="p">SK:搜尋關鍵字</p>  
        <p type="p">SK1:商品名稱</p>  
        <p type="p">SK2:商品廠牌</p>  
        <p type="p">SK3:商品內容物</p>  
        <p type="p">HK:最新熱門關鍵字</p>  
        <p type="p">TR1:第三方搜尋結果紀錄</p>  
        <p type="p">TR2:移除後第三方搜尋結果</p>  
        <p type="p">TN1:更新後第三方搜尋結果</p>  
        <p type="p">TP1:處理後商品資訊</p>  
        <p type="p">TC1:合併商品資訊</p>  
        <p type="p">NP:最新商品資訊</p>  
        <p type="p">BR1:自建搜尋結果</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="44" publication-number="202612235"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612235.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612235</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抑制電磁干擾之電源供應器</chinese-title>  
        <english-title>POWER SUPPLY DEVICE FOR SUPPRESSING ELECTROMAGNETIC INTERFERENCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120241202B">H02M1/44</main-classification>  
        <further-classification edition="200601120241202B">H02M7/217</further-classification>  
        <further-classification edition="200601120241202B">H02M3/156</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹子增</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, TZU-TSENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種抑制電磁干擾之電源供應器，包括：一濾波及吸收電路、一橋式整流器、一升壓電感器、一感測電阻器、一功率切換器、一第一輸出級電路、一切換電路、一變壓器、一諧振電容器、一第二輸出級電路，以及一偵測及控制電路。偵測及控制電路可根據跨越感測電阻器之一電位差來控制濾波及吸收電路操作於一純濾波模式或一突波吸收模式兩者擇一。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power supply device for suppressing EMI (Electromagnetic Interference) includes a filter and absorption circuit, a bridge rectifier, a boost inductor, a sense resistor, a power switch element, a first output stage circuit, a switch circuit, a transformer, a resonant capacitor, a second output stage circuit, and a detection and control circuit. The detection and control circuit can control the filter and absorption circuit to operate in either a pure filter mode or a surge absorption mode according to a voltage difference across the sense resistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電源供應器</p>  
        <p type="p">110:濾波及吸收電路</p>  
        <p type="p">120:橋式整流器</p>  
        <p type="p">130:功率切換器</p>  
        <p type="p">140:第一輸出級電路</p>  
        <p type="p">150:切換電路</p>  
        <p type="p">160:變壓器</p>  
        <p type="p">161:主線圈</p>  
        <p type="p">162:第一副線圈</p>  
        <p type="p">163:第二副線圈</p>  
        <p type="p">170:第二輸出級電路</p>  
        <p type="p">180:偵測及控制電路</p>  
        <p type="p">CR:諧振電容器</p>  
        <p type="p">DT:工作週期</p>  
        <p type="p">LM:激磁電感器</p>  
        <p type="p">LR:漏電感器</p>  
        <p type="p">LU:升壓電感器</p>  
        <p type="p">MD1:純濾波模式</p>  
        <p type="p">MD2:突波吸收模式</p>  
        <p type="p">RS:感測電阻器</p>  
        <p type="p">VC:控制電位</p>  
        <p type="p">VE:中間電位</p>  
        <p type="p">VF1:第一濾波電位</p>  
        <p type="p">VF2:第二濾波電位</p>  
        <p type="p">VG1:第一驅動電位</p>  
        <p type="p">VG2:第二驅動電位</p>  
        <p type="p">VG3:第三驅動電位</p>  
        <p type="p">VIN1:第一輸入電位</p>  
        <p type="p">VIN2:第二輸入電位</p>  
        <p type="p">VOUT:輸出電位</p>  
        <p type="p">VR:整流電位</p>  
        <p type="p">VSS:接地電位</p>  
        <p type="p">VW:切換電位</p>  
        <p type="p">△V:電位差</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="45" publication-number="202610702"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610702.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610702</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>懸吊輔助裝置</chinese-title>  
        <english-title>SUSPENSION AUXILIARY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A63B23/035</main-classification>  
        <further-classification edition="200601120240929B">A61H1/00</further-classification>  
        <further-classification edition="200601120240929B">A63B26/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力伽實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPORTS ART INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭海濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HAI-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種懸吊輔助裝置，其適用於可移動性之定點狀態中的運動裝置上，該懸吊輔助裝置先透過控制器驅動馬達，以調整鋼索長度讓鋼索末端的掛鉤垂降下來，讓該掛鉤將使用者已穿載上的吊衣載具鈎起，使用者透過該懸吊輔助裝置來懸吊並支撐身體重量時，除了可確保使用者的使用安全，更可藉由該懸吊輔助裝置來減少下肢的承重，讓下肢無法承受較大重量之使用者可以自行在運動裝置上進行運動或復健訓練，當使用者移動到運動裝置上的操作定點位置時，可以重新設定鋼索的拉力值，亦即隨著使用者下肢的承重能力而適度地調整支撐力量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a suspension auxiliary device that is applicable for a moving device in a movable fixed-point state. The suspension auxiliary device drives a motor by using a controller to adjust the a length of a steel cable so that a hook on a distal end of the steel cable descends to lift the sling carrier that the user has put on. When the user uses the suspension auxiliary device to suspend and support the weight of the body, it not only ensures the user's safety, but also the suspension auxiliary device can be used to reduce the load-bearing of the lower limbs so that users whose lower limbs cannot bear greater weight can perform exercise or rehabilitation training on the sports device by themselves. When the user moves to an operating fixed point on the sports device, a tension value of the steel cable can be reset, hence the support force is appropriately adjusted based on the load-bearing capacity of the user's lower limbs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:懸吊輔助裝置</p>  
        <p type="p">1:骨架</p>  
        <p type="p">11:底桿</p>  
        <p type="p">12:豎桿</p>  
        <p type="p">13:下肋體</p>  
        <p type="p">15:吊桿</p>  
        <p type="p">150:聯結桿</p>  
        <p type="p">151:調整桿</p>  
        <p type="p">16:輔助吊帶</p>  
        <p type="p">161:掛鉤</p>  
        <p type="p">2:傳動機構</p>  
        <p type="p">21:馬達</p>  
        <p type="p">22:傳動皮帶</p>  
        <p type="p">23:索輪</p>  
        <p type="p">24:鋼索</p>  
        <p type="p">241:掛鉤</p>  
        <p type="p">25:可變速輪</p>  
        <p type="p">27:第一軸桿</p>  
        <p type="p">28:被動鏈輪</p>  
        <p type="p">29:第二軸桿</p>  
        <p type="p">291:鏈圈</p>  
        <p type="p">3:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="46" publication-number="202610834"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610834.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610834</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133164</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗靜電複合板及其製造方法</chinese-title>  
        <english-title>ANTISTATIC COMPOSITE BOARD AND METHOD FOR PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241011B">B32B27/08</main-classification>  
        <further-classification edition="200601120241011B">B32B27/18</further-classification>  
        <further-classification edition="200601120241011B">B32B27/36</further-classification>  
        <further-classification edition="200601120241011B">B32B27/40</further-classification>  
        <further-classification edition="200601120241011B">B32B33/00</further-classification>  
        <further-classification edition="200601120241011B">B32B37/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹俊哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHUN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江培瑀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, PEI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種抗靜電複合板及其製造方法。所述抗靜電複合板包含一PET基板、形成於所述PET基板的一側的一PET膜及通過將塗佈一塗液而形成於所述PET膜的一塗層。所述塗液包含一聚氨酯寡聚物、一抗靜電劑及一溶劑。所述抗靜電劑包含分散劑及分散於所述分散劑中的多個奈米碳管。基於所述塗液的總重為100 wt%，所述聚氨酯寡聚物的含量是介於30 wt%至40 wt%之間，所述抗靜電劑的含量是介於5 wt%至20 wt%之間，並且所述溶劑的含量是介於40 wt%至60 wt%之間。所述抗靜電複合板具有大於或等於84%的光穿透度、小於或等於4%的霧度及小於或等於10 &lt;sup&gt;7&lt;/sup&gt;Ω的表面比阻抗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antistatic composite board and method for producing the same are provided. The antistatic composite board includes a PET substrate, a PET film formed on one side of the PET substrate, and a coating layer formed by coating a coating liquid onto the PET film. The coating liquid includes a polyurethane oligomer, an antistatic agent, and a solvent. The antistatic agent includes a dispersant and a plurality of carbon nanotubes dispersed in the dispersant. Based on 100 wt% by weight of the coating liquid, a content of the polyurethane oligomer is between 30 wt% and 40 wt%, a content of the antistatic agent is 5 wt% and 20 wt%, and a content of the solvent is 40 wt% and 60 wt%. The antistatic composite board has a light transmittance that is greater than or equal to 84%, a haze that is less than or equal to 4 %, and a surface specific impedance of less than or equal to 10 &lt;sup&gt;7&lt;/sup&gt;Ω.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:抗靜電複合板</p>  
        <p type="p">1:PET基板</p>  
        <p type="p">2:PET膜</p>  
        <p type="p">3:塗層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="47" publication-number="202611612"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611612.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611612</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133171</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電泳顯示裝置</chinese-title>  
        <english-title>ELECTROPHORETIC DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241120B">G02F1/167</main-classification>  
        <further-classification edition="201901120241120B">G02F1/1676</further-classification>  
        <further-classification edition="201901120241120B">G02F1/1677</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元太科技工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E INK HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁兆民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, JAU-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEN-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駱伯遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, PO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法蘭契　伊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRENCH, IAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電泳顯示裝置，包括畫素結構和彩色濾光陣列。畫素結構的藍色畫素電極的面積小於紅色畫素電極的面積，且藍色畫素電極的面積小於綠色畫素電極的面積。彩色濾光陣列中的紅色濾光單元、綠色濾光單元和藍色濾光單元面積皆相同且分別重疊於紅色畫素電極、綠色畫素電極和綠色畫素電極。紅色濾光單元的面積與紅色畫素電極的面積的比值為RFF；綠色濾光單元的面積與綠色畫素電極的面積的比值為GFF；藍色濾光單元的面積與藍色畫素電極的面積的比值為BFF，並且BFF＞RFF≥GFF。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrophoretic display device includes a pixel structure and a color filter array. An area of ​​a blue pixel electrode of the pixel structure is smaller than an area of ​​a red pixel electrode, and an area of ​​the blue pixel electrode is smaller than an area of ​​a green pixel electrode. An area of a red filter unit in the color filter array, an area of a green filter unit in the color filter array, and an area of a blue filter unit in the color filter array are all the same and overlap with the red pixel electrode, the green pixel electrode and the green pixel electrode respectively. A ratio of the area of ​​the red filter unit to the area of ​​the red pixel electrode is RFF; a ratio of the area of ​​the green filter unit to the area of ​​the green pixel electrode is GFF; a ratio of the area of ​​the blue filter unit to the area of ​​the blue pixel electrode is BFF, and BFF＞RFF≥GFF.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:電泳顯示裝置</p>  
        <p type="p">110R:紅色濾光單元</p>  
        <p type="p">110G:綠色濾光單元</p>  
        <p type="p">110B:藍色濾光單元</p>  
        <p type="p">121R:紅色次畫素</p>  
        <p type="p">121G:綠色次畫素</p>  
        <p type="p">121B:藍色次畫素</p>  
        <p type="p">e1:第一端</p>  
        <p type="p">e2:第二端</p>  
        <p type="p">I-I’:剖線</p>  
        <p type="p">PR:紅色畫素電極</p>  
        <p type="p">PG:綠色畫素電極</p>  
        <p type="p">PB:藍色畫素電極</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="48" publication-number="202611428"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611428.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611428</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>不斷水降低水流速冷凍止水方法</chinese-title>  
        <english-title>WATER-UNDISRUPTED REDUCING WATER FLOW SPEED PIPE FREEZING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">F16L55/10</main-classification>  
        <further-classification edition="200601120241007B">F15D1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祥泰水電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIANG TAI WATER &amp; ELECTRICITY FACILITY COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉飛龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, FEI-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉飛鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, FEI-FUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江賜印</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, TZU-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武　文俠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VU, VAN-HIEP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　唯慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, DUY-KHANH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉家君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種不斷水降低水流速冷凍止水方法，包含：(a)偵測水管內的水流速是否小於0.001公尺/秒；若是，執行下一步驟；若否，則於水管上設置不斷水裝置或止漏裝置以降低水的流速，直到水的流速小於0.001公尺/秒；(b)以冷凍鞍帶包覆水管；(c)將液態氮冷凍裝置與冷凍鞍帶連接；(d)使水管之水壓在1~5分鐘內保持在約1kg/cm &lt;sup&gt;2&lt;/sup&gt;；以及，(e)透過液態氮冷凍裝置在0.5~1.5小時內將溫度等於或低於-196°C的液態氮輸入冷凍鞍帶內，使冷凍鞍帶表面溫度保持在-25°C~-70°C，水管未被冷凍鞍帶包覆的二端之溫度在0.5~1.5小時內保持在-30°C~-50°C，並使水管未被冷凍鞍帶包覆的二端產生約5~7公分結霜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A water-undisrupted reducing water flow speed pipe freezing method, includes: (a)detecting whether water flow rate is less than 0.001m/s; if yes, processing next step; if no, setting uninterruptable water device or anti-leakage device to reduce water flow rate to less than 0.001m/s; (b)covering a pipe by freezing fixture; (c)connecting liquid nitrogen freezing device to freezing fixture; (d)keeping water pressure of the pipe about 1kg/cm &lt;sup&gt;2&lt;/sup&gt;for 1~5 minutes; (e)keeping freezing the section of pipe which is covered by freeing fixture by entering liquid nitrogen with temperature equal or less than -196°C in 0.5~1.5 hour period to make the surface temperature of the freezing fixture retain between -25°C~-70°C, opposite two ends of the section of pipe which is not covered by the freezing fixture retain between -30°C~-50°C in said 0.5~1.5 hour period, and make opposite two ends of pip which are not covered by the freezing fixture generating frosting of about 5~7cm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201~205:不斷水降低水流速冷凍止水方法之步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="49" publication-number="202611699"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611699.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611699</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>程式專案生成系統及方法</chinese-title>  
        <english-title>PROGRAM PROJECT GENERATION SYSTEM AND PROGRAM PROJECT GENERATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241004B">G06F8/33</main-classification>  
        <further-classification edition="202001120241004B">G06F40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘俊霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, JUIN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐珮晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PEI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種程式專案生成方法，其包含以下步驟：取得初始需求文本；基於初始需求文本建立程式專案的架構樹，包含透過規格設計程序及需求規劃程序生成架構樹的每一節點對應的規格文本及需求文本；基於架構樹的每一節點對應的規格文本，透過程式碼生成程序生成該節點對應的程式碼。規格設計程序、該需求規劃程序及該程式碼生成程序分別涉及使用規格設計提示詞、需求規劃提示詞及至少一程式碼生成提示詞呼叫大型語言模型以生成架構樹的節點對應的規格文本、需求文本及程式碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A program project generation method is provided. The method includes obtaining an initial requirements text; constructing a structure tree of a program project based on the initial requirements text, including generating corresponding specification text and requirement text for each node of the structure tree through a specification design process and a requirements planning process; generating code corresponding to each node based on the specification text of each node in the structure tree through a code generation process. The specification design process, the requirements planning process, and the code generation process respectively involve using specification design prompts, requirements planning prompts, and at least one code generation prompt to invoke a large language model to generate the corresponding specification text, requirement text, and code for the nodes of the structure tree.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:程式專案生成方法</p>  
        <p type="p">S301-S303:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="50" publication-number="202612280"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612280.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612280</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料壓縮方法及其對應之資料解壓縮裝置</chinese-title>  
        <english-title>DATA COMPRESSION METHOD AND DATA DECOMPRESSION DEVICE CORRESPONDING THERETO</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H03M7/30</main-classification>  
        <further-classification edition="202301120241202B">G06N5/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立陽明交通大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JUINN-DAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何律明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, LYU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁智堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHIH-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種資料壓縮方法及其對應之資料解壓縮裝置。首先，計算不同之多個原碼字出現之第一頻率，其中每一原碼字具有至少兩個子碼字，每一子碼字具有至少一位元。接著，拆解每一原碼字為多個子碼字，並根據第一頻率，計算所有不同之子碼字出現之第二頻率。以壓縮方式對所有不同之子碼字進行可變長度編碼，以對應所有不同之子碼字分別產生不同壓縮碼。最後，根據壓縮碼與所有不同之子碼字之對應關係，分別轉換原碼字為多個已編碼碼字。此外，在對子碼字進行可變長度編碼之前，亦可對原碼字之子碼字進行重編碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure describes a data compression method and a data decompression device corresponding thereto. Firstly, the first frequencies of occurrence of different original codewords are calculated, wherein each original codeword has at least two sub-words and each sub-word has at least one bit. Then, each original codeword is decomposed into sub-words. Based on the first frequencies, the second frequencies of occurrence of all different sub-words are calculated. Variable-length encoding is performed on all different sub-words in a compression manner to generate different compression codes corresponding to all different sub-words. Finally, based on the corresponding relationship between the compression codes and all different sub-words, the original codewords are converted into encoded codewords. Besides, before performing variable-length encoding on the sub-words, the sub-words of the original codewords may be recoded.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10、S12、S14、S16:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="51" publication-number="202611818"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611818.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611818</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133199</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隱性用戶之偵測系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241007B">G06Q30/015</main-classification>  
        <further-classification edition="202301120241007B">G06Q30/016</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣大哥大股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN MOBILE CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡政嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種隱性用戶之偵測系統，包含：一收集模組，收集複數個用戶的第一資訊，該第一資訊關聯於所述複數個用戶之歷史投訴之案件、所述複數個用戶的歷史基地台軌跡、所述複數個用戶的辨識碼、所述複數個用戶的歷史DNS網域歷程以及所述複數個用戶的歷史測試速度；一分析模組，基於該第一資訊從而生成一結果，該結果關於複數個特定用戶的一名單或一查修名單；一通知模組，基於該結果通知該特定用戶或派工查修。藉由本發明可以偵測出潛在的不反饋隱性用戶並主動找出不反饋的事由，從而進行問題的排除</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:偵測系統</p>  
        <p type="p">100:收集模組</p>  
        <p type="p">110:用戶客訴伺服器</p>  
        <p type="p">120:用戶位置伺服器</p>  
        <p type="p">130:用戶服務伺服器</p>  
        <p type="p">140用戶網域伺服器</p>  
        <p type="p">150:用戶網速伺服器</p>  
        <p type="p">160:資料庫</p>  
        <p type="p">200:分析模組</p>  
        <p type="p">300:通知模組</p>  
        <p type="p">T:電信業</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="52" publication-number="202612529"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612529.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612529</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133200</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHODS FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D84/00</main-classification>  
        <further-classification edition="202501120250102B">H10D62/80</further-classification>  
        <further-classification edition="202501120250102B">H10D84/03</further-classification>  
        <further-classification edition="200601120250102B">H01L21/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>世界先進積體電路股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳姿宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TZU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴云凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋建憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, CHIEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒振東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZOU, CHEN-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅宗仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAO, CHUNG-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖志成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHIH-CHERNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構，包括具有第一導電類型的一基底；位於基底上的一磊晶層，且磊晶層具有第一導電類型；一第一摻雜區域，自前述磊晶層的頂表面延伸至磊晶層中，且第一摻雜區域具有第一導電類型；位於第一摻雜區域中的第一元件，其中基底作為第一元件的汲極；一第二摻雜區域，自磊晶層的頂表面延伸至磊晶層中，且第二摻雜區域具有第二導電類型，第二摻雜區域位於第一摻雜區域的一側，其中磊晶層的一部分延伸於第一摻雜區域與第二摻雜區域之間，以分隔第一摻雜區域與第二摻雜區域；以及位於第二摻雜區域中的一第二元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure includes a substrate having a first conductivity type, an epitaxial layer on the substrate and having the first conductivity type, a first region that extends from the top surface of the epitaxial layer into the epitaxial layer, a first device disposed in the first region, a second region having a second conductivity type and extending from the top surface of the epitaxial layer into the epitaxial layer, and a second device disposed in the second region, wherein the substrate functions as a drain electrode of the first device. The second region is positioned at one side of the first region. A portion of the epitaxial layer fills between the first region and the second region and separates the first region from the second region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體結構</p>  
        <p type="p">100:基底</p>  
        <p type="p">102:磊晶層</p>  
        <p type="p">102a:頂表面</p>  
        <p type="p">11:第一元件</p>  
        <p type="p">110:第一摻雜區域</p>  
        <p type="p">118:溝槽結構</p>  
        <p type="p">122,124,212,213,214,222,223,224,312,313,314:重摻雜部</p>  
        <p type="p">126,216,226,316:閘極結構</p>  
        <p type="p">21:第二元件</p>  
        <p type="p">21N:NMOS元件</p>  
        <p type="p">21P:PMOS元件</p>  
        <p type="p">210:第二摻雜區域</p>  
        <p type="p">31:第三元件</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="53" publication-number="202611213"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611213.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611213</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>芋頭生物塑膠的應用</chinese-title>  
        <english-title>APPLICATION OF TARO BIOPLASTIC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241220B">C08L3/02</main-classification>  
        <further-classification edition="200601120241220B">C08L89/00</further-classification>  
        <further-classification edition="200601120241220B">C08L91/06</further-classification>  
        <further-classification edition="200601120241220B">C08L101/16</further-classification>  
        <further-classification edition="200601120241220B">C08K5/053</further-classification>  
        <further-classification edition="200601120241220B">B65D65/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳大謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TA CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, DA-ZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳大謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TA-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, DA-ZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昱捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種用於生產可生物降解的芋頭生物塑膠的材料及其應用範圍，基於芋頭的粘液、天然蛋白質、植物來源的蠟和潤濕劑。</p>  
        <p type="p">製造方法係將芋頭加水打碎；然後加入明膠後，加熱混合物直至均勻化；加入甘油和預先熔化的小燭樹蠟，加熱並均化混合物；將液體混合物倒入模具中；在環境條件下將混合物在模具中乾燥，直至其凝固並從模具中鬆脫。</p>  
        <p type="p">使用所述混合物生產的可生物降解的塑料材料可應用於熱即溶包裝材料，例如泡麵中的調味料包裝材料，常溫下可包裝調味粉；熱水沖泡後，該材料即可溶解於熱水中，且可當營養料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a material for producing biodegradable bioplastics derived from taro, which has a wide range of applications. This material is formulated using taro-based viscosifiers, natural proteins, plant-derived waxes, and wetting agents.</p>  
        <p type="p">The production process involves several key steps: Gelatin is added to the solution, which is then heated and homogenized. Glycerin and pre-melted candelilla wax are added to the mixture, followed by further heating and homogenization. The resulting liquid mixture is poured into molds. The mixture is dried under ambient conditions, allowing the solvent to evaporate, and then the solidified material is carefully removed from the molds.</p>  
        <p type="p">The final product is a biodegradable bioplastic that can be used for various applications, such as packaging seasoning powders. These packages can be stored at room temperature and dissolved in hot water, where they can also serve as a nutritional supplement when brewed. This method offers an environmentally friendly alternative to traditional plastics, with the added benefit of potential nutritional value.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="54" publication-number="202612192"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612192.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612192</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133209</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241118B">H01R13/52</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商莫仕有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLEX, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊喆元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHE-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接裝置，包含一連接器組件及一散熱器組件。所述連接器組件包括供一可插拔組件沿一插接方向插入的一插接通道。所述散熱器組件設置在所述連接器組件外，並包括一液冷板及一可滑動機構。所述液冷板具有一主體及一散熱座。所述主體用以供冷卻液在其內部流動。所述散熱座可相對於所述主體浮動並用以與所述可插拔組件熱接合。所述可滑動機構可移動地設置於所述液冷板，且所述可滑動機構的一部分伸入至所述插接通道並能夠供所述可插拔組件推抵。所述可滑動機構在所述可插拔組件插入所述插接通道的過程中，受到所述可插拔組件推動而連動所述散熱座由與所述可插拔組件間隔的狀態變換成觸抵所述可插拔組件的狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:連接器組件</p>  
        <p type="p">211:插接通道</p>  
        <p type="p">211a:窗口</p>  
        <p type="p">33:散熱座</p>  
        <p type="p">331:散熱主體部</p>  
        <p type="p">332:緣延伸部</p>  
        <p type="p">333:鰭片部</p>  
        <p type="p">4:可滑動機構</p>  
        <p type="p">41:致動件</p>  
        <p type="p">411:致動件本體部</p>  
        <p type="p">412:突出部</p>  
        <p type="p">413:接觸部</p>  
        <p type="p">414:活動孔</p>  
        <p type="p">415:壓抵部</p>  
        <p type="p">42:彈性件</p>  
        <p type="p">X:插接方向</p>  
        <p type="p">Y:排列方向</p>  
        <p type="p">Z:上下方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="55" publication-number="202611838"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611838.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611838</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133210</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>款項移轉服務系統及款項移轉方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">G06Q40/02</main-classification>  
        <further-classification edition="201201120241101B">G06Q20/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林書維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林書維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種款項移轉服務系統包含一服務端設備及一管理端伺服系統。該管理端伺服系統用於在接收到一由一使用者電子裝置所傳送的款項移轉預約請求後據以產生並儲存一包含一指定移轉金額的款項移轉訂單資料，並將一對應的訂單識別資料傳送至該使用者電子裝置以供其據以產生一條碼；該服務端設備用於掃描該使用者電子裝置所顯示的該條碼以獲得一待處理訂單資料並據以傳送一訂單驗證請求至該管理端伺服系統，且在接收到一對應的驗證成功通知後切換至一收款預備狀態，且於接收到一筆與該指定移轉金額相符的現金後產生並輸出一收款完成通知。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:款項移轉服務系統</p>  
        <p type="p">11:服務端設備</p>  
        <p type="p">111:控制單元</p>  
        <p type="p">112:顯示單元</p>  
        <p type="p">113:輸入單元</p>  
        <p type="p">114:掃描單元</p>  
        <p type="p">115:紙鈔收取單元</p>  
        <p type="p">12:管理端伺服系統</p>  
        <p type="p">121:處理單元</p>  
        <p type="p">122:儲存單元</p>  
        <p type="p">D:註冊使用者資料</p>  
        <p type="p">D1:帳戶識別資料</p>  
        <p type="p">D2:帳戶資料</p>  
        <p type="p">K1:驗證端金鑰資料</p>  
        <p type="p">K2:使用端金鑰資料</p>  
        <p type="p">30:使用者電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="56" publication-number="202610785"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610785.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610785</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133218</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動送釘裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241030B">B25C3/00</main-classification>  
        <further-classification edition="200601120241030B">B25C1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光柘企業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇富誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作係一種自動送釘裝置，其能與電鑽工具相組接並提供釘帶裝設，自動送釘裝置包含外殼、設於外殼並能相對外殼移動之座體、能設置於電鑽工具前端的導桿、設於座體內部並能驅動釘帶之推帶輪、驅動機構以及設於座體與外殼之間並能提供座體復位之推頂彈簧，釘帶係能穿設於該座體底端的導帶部，並通過該推帶輪至所述座體的出釘端口，本創作自動送釘裝置能藉由該座體的導帶部的結構設計，使所述自動送釘裝置的外殼與座體相對移動的過程中，所述導帶部會與該座體同步移動，能避免所述釘帶受到拉扯等情形，進而能減少釘帶輸送不順之問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:外殼</p>  
        <p type="p">101:導引槽道</p>  
        <p type="p">102:銜接端部</p>  
        <p type="p">1021:配合座</p>  
        <p type="p">1022:扣合件</p>  
        <p type="p">11:導桿</p>  
        <p type="p">12:座體</p>  
        <p type="p">121:出釘端口</p>  
        <p type="p">122:導帶部</p>  
        <p type="p">1221:第一導帶單元</p>  
        <p type="p">1222:第二導帶單元</p>  
        <p type="p">1223:導帶通道</p>  
        <p type="p">123:裝配部</p>  
        <p type="p">124:距離調整組件</p>  
        <p type="p">1241:調整尺規</p>  
        <p type="p">1243:扣接單元</p>  
        <p type="p">13:推帶輪</p>  
        <p type="p">131:配合齒</p>  
        <p type="p">14:驅動機構</p>  
        <p type="p">141:棘輪結構</p>  
        <p type="p">142:驅動臂</p>  
        <p type="p">1421:導引輪部</p>  
        <p type="p">143:復位彈簧</p>  
        <p type="p">15:推頂彈簧</p>  
        <p type="p">20:配合組件</p>  
        <p type="p">21:配合罩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="57" publication-number="202611957"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611957.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611957</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133226</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>橋接式開關</chinese-title>  
        <english-title>BRIDGE SWITCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H01H71/10</main-classification>  
        <further-classification edition="200601120241007B">H01H33/666</further-classification>  
        <further-classification edition="200601120241007B">H02B1/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴斯威爾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN BUSWAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MIN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">橋接式開關包含用以插設於第一匯流排的第一插設端、用以插設於第二匯流排的第二插設端以及開關構件。開關構件的第一側電性耦接至第一插設端，且開關構件的第二側電性耦接至第二插設端；其中開關構件包括開關單元，開關單元用以控制第一側及第二側之間的電性導通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bridge switch includes a first plug terminal for inserting into a first busbar, a second plug terminal for inserting into a second busbar, and a switch component. A first side of the switch component is electrically coupled to the first plug terminal, and a second side of the switch component is electrically coupled to the second plug terminal; The switch component includes a switch unit configured to control the electrical conductivity between the first side and the second side.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:橋接式開關</p>  
        <p type="p">11:第一插設端</p>  
        <p type="p">111:導體片</p>  
        <p type="p">112:插接導體片</p>  
        <p type="p">114:定磅螺絲</p>  
        <p type="p">12:開關構件</p>  
        <p type="p">1201:第一側</p>  
        <p type="p">1202:第二側</p>  
        <p type="p">121:開關單元</p>  
        <p type="p">13:第二插設端</p>  
        <p type="p">134:定磅螺絲</p>  
        <p type="p">B1:第一匯流排</p>  
        <p type="p">B1S:插槽</p>  
        <p type="p">B2:第二匯流排</p>  
        <p type="p">B2S:插槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="58" publication-number="202610717"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610717.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610717</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可循環利用於二氧化碳固碳的催化反應方法及其系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241011B">B01D53/86</main-classification>  
        <further-classification edition="200601120241011B">B01D53/62</further-classification>  
        <further-classification edition="200601120241011B">B01J27/08</further-classification>  
        <further-classification edition="200601120241011B">B01J31/02</further-classification>  
        <further-classification edition="200601120241011B">B01J38/52</further-classification>  
        <further-classification edition="200601120241011B">C07C68/04</further-classification>  
        <further-classification edition="200601120241011B">C07C68/08</further-classification>  
        <further-classification edition="200601120241011B">C07C69/96</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東海大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜澄達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧野松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可循環利用於二氧化碳固碳的催化反應方法，包括以下步驟：步驟A：將一催化劑溶在一離子液體(Ionic liquid, IL)中，獲得一催化劑溶液；其中，該催化劑包括一碘化銀及一1,8-二氮雜二環[5.4.0]十一碳-7-烯(1,8-diazabicyclo[5.4.0]undec-7-ene；DBU)；步驟B：將一炔丙醇(Propargyl alcohol)添加至該催化劑溶液中，並再通入一二氧化碳，使該炔丙醇與該二氧化碳進行催化反應，從而獲得一環狀碳酸酯；以及步驟C：在步驟B中所生成的該環狀碳酸酯係混合於與該催化劑溶液中，而再將該環狀碳酸酯自該催化劑溶液中萃取分離出來，並使分離後的該催化劑溶液能重新進行如該步驟B中的催化反應。據此，本發明透過可重複使用的催化劑溶液，實現固化二氧化碳，並生產出具有商業價值的機環狀碳酸酯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="59" publication-number="202611814"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611814.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611814</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133232</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支援離線使用的數位貨幣交易方法</chinese-title>  
        <english-title>OFFLINE DIGITAL CURRENCY TRANSACTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241223B">G06Q20/38</main-classification>  
        <further-classification edition="201201120241223B">G06Q40/04</further-classification>  
        <further-classification edition="202301120241223B">G06Q40/02</further-classification>  
        <further-classification edition="201301120241223B">G06F21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中央銀行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTRAL BANK OF THE REPUBLIC OF CHINA (TAIWAN)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝鳳瑛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, FENG-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹凱傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KAI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳永祚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-TSO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種支援離線使用的數位貨幣交易方法，藉由一載具、一電子裝置及一金流處理單元來實施，包含：(A1)該電子裝置產生並傳送一包含一交易金額P的交易資訊至該載具；(A2) 該載具對該交易資訊進行簽章，產生並傳送一第一簽章交易資訊至該電子裝置，將儲存的離線幣更新為M-P個離線幣；(A3) 該電子裝置對該第一簽章交易資訊進行簽章，產生並傳送簽章後的一第二簽章交易資訊至該金流處理單元；(A4) 該金流處理單元進行驗證；及(A5) 當驗證成功時，該金流處理單元將銀行錢包中的Z個連線幣移轉至第二交易方錢包，且將銀行錢包中的K個離線幣更新為K+P個離線幣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An offline digital currency transaction method is implemented by an IC card, an electronic device and a payment unit, including: (A1) The electronic device generates and transmits transaction information including a transaction amount P to the IC card; (A2) The IC card signs the transaction information, generates and transmits a first signed transaction information to the electronic device, and updates the stored offline coins to M-P offline coins; (A3) The electronic device signs the first signed transaction information, generates and transmits the signed second signed transaction information to the payment unit; (A4) The payment unit performs verification processing; and (A5) When the verification is successful, the payment unit transfers the Z online coins in the bank wallet to the second transaction wallet, and updates the K offline coins in the bank wallet to K+P offline coins.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S107、S112~S114:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="60" publication-number="202611769"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611769.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611769</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>功率硬體迴路模擬系統及方法</chinese-title>  
        <english-title>POWER-HARDWARE-IN-THE-LOOP SIMULATION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241202B">G06F30/367</main-classification>  
        <further-classification edition="202001120241202B">G06F30/33</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連國龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAN, KUO-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　高祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUAN, CONSTANTINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種功率硬體迴路模擬系統，其包含放大器、感測模組、優化器以及控制模組。放大器電性連接待測物，優化器電性連接感測模組，控制模組電性連接優化器與放大器。感測模組感測待測物的電壓值，優化器取得待測物在即時模擬器的等效電流源模型的電壓值，進而基於待測物的電壓值與待測物在即時模擬器的等效電流源模型的電壓值之間的電壓差以計算出參考電流值。控制模組基於參考電流值以調控放大器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a power-hardware-in-the-loop simulation system, which includes an amplifier, a sensing module, an optimizer and a control moduleThe amplifier is electrically connected to the device under test, the optimizer is electrically connected to the sensing module, and the control module is electrically connected to the optimizer and the amplifier. The sensing module senses a voltage value of the device under test, and the optimizer obtains a voltage value of the equivalent current source model of a real-time simulator associated with the device under test, and then calculates the reference current value based on a voltage difference between the voltage value of the device under test and the voltage value of the equivalent current source model of the real-time simulator associated with the device under test. The control module controls the amplifier based on the reference current value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:感測模組</p>  
        <p type="p">112:感測器</p>  
        <p type="p">114:類比數位轉換器</p>  
        <p type="p">130:優化器</p>  
        <p type="p">140:控制模組</p>  
        <p type="p">142:控制器</p>  
        <p type="p">144:數位類比轉換器</p>  
        <p type="p">150:放大器</p>  
        <p type="p">180:即時模擬器</p>  
        <p type="p">181:電網</p>  
        <p type="p">182:等效電流源模型</p>  
        <p type="p">190:待測物</p>  
        <p type="p">
        &lt;i&gt;I&lt;/i&gt;
        &lt;sub&gt;1&lt;/sub&gt;:電流值</p>  
        <p type="p">
        &lt;i&gt;I&lt;/i&gt;
        &lt;sub&gt;2&lt;/sub&gt;:電流值</p>  
        <p type="p">
        &lt;i&gt;I&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;ref&lt;/i&gt;
        &lt;/sub&gt;:參考電流值</p>  
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;1&lt;/sub&gt;:電壓值</p>  
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;2&lt;/sub&gt;:電壓值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="61" publication-number="202612296"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612296.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612296</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133243</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兩截式頭戴式系統</chinese-title>  
        <english-title>TWO-SECTION HEAD MOUNTED SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241007B">H04B10/27</main-classification>  
        <further-classification edition="200601120241007B">G02B27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡運緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡啟良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHI-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱林威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, LIN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭示一種兩截式頭戴式系統，其具有運算處理部、頭戴部及纜線部。運算處理部與頭戴部透過纜線部內的多條光纖纜線互相連接。兩截式頭戴式系統包括處理器、第一轉換裝置、影像裝置以及第二轉換裝置。處理器安裝於運算處理部內。第一轉換裝置經配置以對處理器與光纖纜線之間傳輸的信號進行並串轉換與光電轉換。影像裝置安裝於頭戴部內。第二轉換裝置經配置以對影像裝置與光纖纜線之間傳輸的信號進行並串轉換與光電轉換。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A two-section head mounted system is provided. The two-section head mounted system has an arithmetic processing part, a head mounted part and a cable part. The arithmetic processing part and the head mounted part are connected to each other through a plurality of optical fiber cables in the cable part. The two-section head mounted system includes a processor, a first converting device, an imaging device and a second converting device. The processor is installed in the arithmetic processing part. The first converting device is configured to perform parallel-to-serial converting and photoelectric converting of signals transmitted between the processor and the optical fiber cables. The imaging device is installed in the head mounted part. The second converting device is configured to perform parallel-to-serial converting and photoelectric converting of signals transmitted between the imaging device and the optical fiber cables.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:兩截式頭戴式系統</p>  
        <p type="p">110:運算處理部</p>  
        <p type="p">120:頭戴部</p>  
        <p type="p">130:纜線部</p>  
        <p type="p">210:處理器</p>  
        <p type="p">220:第一轉換裝置</p>  
        <p type="p">230:影像裝置</p>  
        <p type="p">240:第二轉換裝置</p>  
        <p type="p">FC1:第一光纖纜線</p>  
        <p type="p">FC2:第二光纖纜線</p>  
        <p type="p">Spe1:第一並行電信號</p>  
        <p type="p">Spe2:第二並行電信號</p>  
        <p type="p">Spe3:第三並行電信號</p>  
        <p type="p">Spe4:第四並行電信號</p>  
        <p type="p">Sso1:第一串行光信號</p>  
        <p type="p">Sso2:第二串行光信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="62" publication-number="202610565"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610565.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610565</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133248</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調節機構及其快拆以及具有該快拆之滑軌總成</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120241105B">A47B88/407</main-classification>  
        <further-classification edition="201701120241105B">A47B88/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南俊國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN JUEN INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖偉良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, WEI-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連志益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, CHIH-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種調節機構及其快拆以及具有該快拆之滑軌總成，包含：一調整座，其具有一非封閉之調節孔，使調節孔形成一弧狀特徵，並在調節孔內設有一弧狀之內螺紋；以及一螺桿，其具有一外螺紋，外螺紋相對內螺紋進行轉動位移，當螺桿停止後，則外螺紋在空轉而頂開內螺紋，令調節孔藉由弧狀特徵撐開。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:調節機構</p>  
        <p type="p">11:調整座</p>  
        <p type="p">111:調節孔</p>  
        <p type="p">112:開口</p>  
        <p type="p">115:止擋件</p>  
        <p type="p">116:抵靠片</p>  
        <p type="p">12:螺桿</p>  
        <p type="p">121:主調節輪</p>  
        <p type="p">122:副調節輪</p>  
        <p type="p">123:固定桿</p>  
        <p type="p">13:底板</p>  
        <p type="p">131:固定片</p>  
        <p type="p">134:第一安裝孔</p>  
        <p type="p">20:快拆</p>  
        <p type="p">211:手柄</p>  
        <p type="p">212:扣件</p>  
        <p type="p">A:弧狀特徵</p>  
        <p type="p">C:外螺紋</p>  
        <p type="p">D:高低調節板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="63" publication-number="202612340"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612340.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612340</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133259</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於遠端操控天車之系統與方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR REMOTE-CONTROLLING BRIDGE CRANE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241007B">H04N21/234</main-classification>  
        <further-classification edition="200601120241007B">B66C13/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇育德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, YU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪子頡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, TZU-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳翊安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李科賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, KO-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李柏毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, PO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周冠緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, KUAN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於遠端操控天車之系統可包括成像模組、運算模組和顯示模組。成像模組用於生成關於第一場域之第一影像的第一封包。運算模組耦接於成像模組，並用於解壓縮來自成像模組之第一封包。顯示模組耦接於運算模組，並用於根據來自運算模組之經解壓縮的第一封包串流第一影像。用於遠端操控天車之方法可藉由成像模組、運算模組和顯示模組實現。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for remote-controlling a bridge crane may include an imaging module, computing module and a display module. The imaging module may be used to generate first packet corresponding to first image of a first field. The computing module may be coupled to the imaging module and used to decompress the first packet from the imaging module. The display module may be coupled to the computing module and used to stream the first image according to the decompressed first packet. A method for remote-controlling the bridge crane may be realized through the imaging module, the computing module and the display module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:用於遠端操控天車之系統</p>  
        <p type="p">100:成像模組</p>  
        <p type="p">101~112:成像單元</p>  
        <p type="p">200:定位模組</p>  
        <p type="p">300:運算模組</p>  
        <p type="p">400:顯示模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="64" publication-number="202610890"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610890.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610890</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133260</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車之線控裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241227B">B62K23/02</main-classification>  
        <further-classification edition="202001120241227B">B62J11/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久鼎金屬實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮彬杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之線控裝置包含一束環、一連接件、一撥桿、一調整螺絲及一定位塊。束環具有一環部與一連接環部之連接部，環部以一束孔套設一車手把，連接部具有一連通束孔之第一內螺孔，連接件具有一外螺紋軸及一貫穿外螺紋軸之第二內螺孔，連接件之外螺紋軸設於束環之第一內螺孔，撥桿可樞轉地套設於連接件，使撥桿能以連接件為軸心相對束環樞轉，調整螺絲設於連接件之第二內螺孔，定位塊設於束環之束孔內並可受調整螺絲之控制而迫緊或釋放車手把。藉此，本發明之線控裝置可以分開調整束環和撥桿而不會互相影響，以提升操作上的便利性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:線控裝置</p>  
        <p type="p">10:束環</p>  
        <p type="p">11:環部</p>  
        <p type="p">12:束孔</p>  
        <p type="p">13:凹槽</p>  
        <p type="p">14:連接部</p>  
        <p type="p">15:第一內螺孔</p>  
        <p type="p">16:線材轉接座</p>  
        <p type="p">17:轉接孔</p>  
        <p type="p">18:線材固定孔</p>  
        <p type="p">20:連接件</p>  
        <p type="p">21:頭部</p>  
        <p type="p">23:軸承支撐部</p>  
        <p type="p">24:外螺紋軸</p>  
        <p type="p">25:內多邊形孔</p>  
        <p type="p">30:撥桿</p>  
        <p type="p">31:內側面</p>  
        <p type="p">32:外側面</p>  
        <p type="p">33:樞孔</p>  
        <p type="p">34:第一操作部</p>  
        <p type="p">35:第二操作部</p>  
        <p type="p">40:軸承</p>  
        <p type="p">S:迫緊螺絲</p>  
        <p type="p">50:調整螺絲</p>  
        <p type="p">52:定位塊</p>  
        <p type="p">54:定位部</p>  
        <p type="p">56:受推部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="65" publication-number="202611423"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611423.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611423</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有水流量監測功能之水龍頭</chinese-title>  
        <english-title>FAUCET WITH WATER FLOW MONITORING FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">F16K37/00</main-classification>  
        <further-classification edition="200601120241230B">G01B21/22</further-classification>  
        <further-classification edition="202201120241230B">G01F1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞騫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞騫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳居亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種具有水流量監測功能之水龍頭，其特點主要包括：一龍頭主體，包括出水部件、進水端及容置腔室；一出水控制閥設於容置腔室一側；一導水內座置於容置腔室中，包括出水導引通道及進水導座，且進水導座具有流量計容置空間，且導水內座形成有電路板嵌置部與流量計容置空間的高度位置相對應；一流量計容置於流量計容置空間中，該流量計包括外殼及旋轉葉輪，且旋轉葉輪具有磁性部位；一感應電路板，嵌置定位於電路板嵌置部，感應電路板包括磁感應構件對應於流量計之磁性部位；一限位接頭，組設於進水導座以擋止限位流量計。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a faucet comprising a faucet body, a water flow control valve, a water guide inner seat, a flow meter, a sensing circuit board, and a limiting joint. The faucet body comprises a water outlet component, a water inlet end, and a receiving chamber. The water flow control valve is positioned on one side of the receiving chamber. The water guide inner seat is disposed within the receiving chamber, comprising a water outlet guide channel and a water inlet guide seat, wherein the water inlet guide seat comprises a flow meter receiving space. The water guide inner seat is formed with a circuit board embedding portion corresponding in height to the flow meter receiving space. The flow meter is received within the flow meter receiving space, the flow meter comprising a housing and a rotating impeller, wherein the rotating impeller comprises a magnetic portion. The sensing circuit board is embedded and positioned in the circuit board embedding portion, the sensing circuit board comprising a magnetic sensing component corresponding to the magnetic portion of the flow meter. The limiting joint is assembled to the water inlet guide seat for blocking and limiting the flow meter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:龍頭主體</p>  
        <p type="p">11:出水部件</p>  
        <p type="p">12:進水端</p>  
        <p type="p">13:容置腔室</p>  
        <p type="p">14:固定環件</p>  
        <p type="p">20:出水控制閥</p>  
        <p type="p">30:導水內座</p>  
        <p type="p">31:出水導引通道</p>  
        <p type="p">32:進水導座</p>  
        <p type="p">325:銷設孔</p>  
        <p type="p">34:電路板嵌置部</p>  
        <p type="p">341:嵌扣緣</p>  
        <p type="p">343:定位柱</p>  
        <p type="p">35:縮徑頸部</p>  
        <p type="p">40:流量計</p>  
        <p type="p">41:外殼</p>  
        <p type="p">50:感應電路板</p>  
        <p type="p">51:磁感應構件</p>  
        <p type="p">52:定位孔</p>  
        <p type="p">53:無線傳輸模組</p>  
        <p type="p">60:限位接頭</p>  
        <p type="p">61:縮徑嵌卡部</p>  
        <p type="p">66:進水管</p>  
        <p type="p">67:凸伸端</p>  
        <p type="p">70:徑向U型銷</p>  
        <p type="p">71:插置端</p>  
        <p type="p">72:連接段</p>  
        <p type="p">73:勾持緣部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="66" publication-number="202611433"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611433.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611433</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133267</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能燈具無線調控系統</chinese-title>  
        <english-title>INTELLIGENT LIGHTING WIRELESS CONTROL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120241114B">F21V23/00</main-classification>  
        <further-classification edition="200601120241114B">F21V23/04</further-classification>  
        <further-classification edition="200601120241114B">F21V21/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>睿騰光電科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUI TENG OPTO TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張承葳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智能燈具無線調控系統，包括，一電源、一智能燈具、一主控制器、一無線遙控裝置和一觸發裝置；其中該無線遙控裝置和該觸發裝置無線訊號連接，該無線遙控裝置可以提供一無線控制訊號至該觸發裝置；該觸發裝置和該主控制器訊號連接，該觸發裝置可以提供對應該無線控制訊號的一觸發動作訊號至該主控制器；該主控制器和一電源及一智能燈具電連接及/或訊號連接，該主控制器可以依該觸發動作訊號對該智能燈具進行一開啟、關閉和調控動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A intelligent lighting wireless control system comprising a power source, a smart lighting fixture, a main controller, a wireless remote control device and a trigger device; wherein the wireless remote control device is connected to the trigger device with a wireless signal, and the wireless remote control device can provide a wireless control signal to the trigger device; the trigger device is connected to the main controller with a signal and the trigger device can provide a trigger action signal to the main controller in response to the wireless control signal; the main controller is connected to the power source and the smart lighting fixture with an electrical and/or signal connection, and the main controller can carry out the triggering action signal to the smart lighting fixture in accordance with the trigger action signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:智能燈具無線調控系統</p>  
        <p type="p">11:電源</p>  
        <p type="p">12:主控制器</p>  
        <p type="p">13:智能燈具</p>  
        <p type="p">14:觸發裝置</p>  
        <p type="p">15:無線遙控裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="67" publication-number="202611622"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611622.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611622</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133270</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手持式電子裝置</chinese-title>  
        <english-title>HANDHELD ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241120B">G03B17/12</main-classification>  
        <further-classification edition="200601120241120B">G02F1/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王生樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHENG-LE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張忠翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUNG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾岳庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, YUEH-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種手持式電子裝置包括感光元件、透鏡組以及光束調整元件。透鏡組接收光束，且設置在感光元件和光束調整元件之間。當光束調整元件處於開啟狀態時，使光束通過光束調整元件以及透鏡組成像在感光元件上。當光束調整元件處於關閉狀態時，光束調整元件的透光率低於一閥值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A handheld electronic device includes a photosensitive element, a lens group and a light beam adjustment element. The lens group receives a light beam and is disposed between the photosensitive element and the light beam adjusting element. When the light beam adjustment element is in an open state, the light beam passes through the beam adjusting element and the lens group and is imaged on the photosensitive element. When the light beam adjustment element is in a closed state, the transmittance of the light beam adjustment element is lower than a threshold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:手持式電子裝置</p>  
        <p type="p">100A:光束調整元件</p>  
        <p type="p">110A:電致變色材料</p>  
        <p type="p">120:屈光透鏡組</p>  
        <p type="p">130:電控變焦透鏡</p>  
        <p type="p">200:透鏡組</p>  
        <p type="p">300:感光元件</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">I:光軸</p>  
        <p type="p">SW:開關</p>  
        <p type="p">V:電壓源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="68" publication-number="202610875"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610875.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610875</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133271</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>列車行駛警示方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B61L29/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇程裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊廷猷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種列車行駛警示方法，包含：提供一處理裝置，處理裝置具有一離線光達點雲圖資。透過一光達偵測列車之車頭前方的環境，得到一即時光達點雲資料，及透過一位姿感測模組偵測車頭的一即時位姿資料；將即時光達點雲資料與離線光達點雲圖資比對以取得一即時定位點及對應的即時位姿資料；取得與即時定位點相對應的離線軌跡點作為一參考定位點；依據即時位姿資料與參考定位點的離線位姿資料計算一位姿偏差資料以補償參考定位點對應的離線可行駛空間，得到一第一線上可行駛空間；判斷第一線上可行駛空間中具有一障礙物點雲時，產生一警示訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11,S12,S121~S126:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="69" publication-number="202611461"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611461.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611461</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133273</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有燒結式毛細的熱管及其製造方法</chinese-title>  
        <english-title>HEAT PIPE WITH SINTERED CAPILLARY AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">F28D15/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼得科超眾科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC CHAUN-CHOUNG TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李全祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHUAN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金嘉玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, CHIA LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡坤華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, KUN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUAN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請為一種具有燒結式毛細的熱管及其製造方法，其中熱管包括管體、粉末燒結層及工作流體，管體具有相對應的第一端和第二端，第一端和第二端都封閉；粉末燒結層形成在管體的內壁，且粉末燒結層背向管體的一側形成有槽溝，槽溝沿著管體的軸向延伸；工作流體填充於管體內。藉此，利於工作流體能夠沿著特定的路徑回流，進而提升熱管的導熱效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat pipe with sintered capillary and method thereof. Where the heat pipe includes a tube body, a powder sintering layer and a working fluid. The pipe body having corresponding a first end a second end. Both the first end and the second end are closed. The powder sintering layer is formed on an inner wall of the tube body. The powder sintered layer form a groove on the side of the tube body against it. The groove runs along the axial direction of the tube body. The working fluid is filled into the tube body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:管體</p>  
        <p type="p">20:粉末燒結層</p>  
        <p type="p">21:基底部</p>  
        <p type="p">22:液體輸送部</p>  
        <p type="p">23:槽溝</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="70" publication-number="202611386"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611386.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611386</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133274</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>並接式鋁窗結構</chinese-title>  
        <english-title>PARALLEL TYPE ALUMINUM WINDOW STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">E06B3/26</main-classification>  
        <further-classification edition="200601120241029B">E06B1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華家鋁業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWA CHIA ALUMIUNM COMPANY LIMITED.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉倚含</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YI HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉芝妤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZHI YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉兆原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZHAO YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請為一種並接式鋁窗結構，包括第一窗框、第二窗框及封膠，第一窗框包括第一立框架，第一立框架包括第一基板及自第一基板的邊緣分別同向延伸成型的第一立板，第一立板遠離第一基板的一側成型有支板，各第一立板分別與各支板共同圍設形成有凹槽；第二窗框與第一窗框並排連接且包括第二立框架，第二立框架包括第二基板、自第二基板的邊緣分別同向延伸成型的第二立板及第三立板，第二立板及第三立板分別穿接各凹槽內，在第三立板和第一立板之間形成有間隔空間；封膠填充於間隔空間內。藉此，利於填充封膠且可達成密合防水和補強的作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A parallel type aluminum window structure includes a first window frame, a second window frame and a sealant. The first window frame includes a first standing frame. The first standing frame includes a first substrate and a first vertical plate extending from the edge of the first substrate in the same direction. The first vertical plate away from the first substrate is formed with a supporting plate. The first vertical plate and the supporting plate are enclosed together to form a groove. The second window frame is connected side by side with the first window frame and having a second vertical frame. The second vertical frame includes a second substrate, a second vertical plate and a third vertical plate extending from the edge of the second substrate in the same direction. The second vertical plate and the third vertical plate are respectively penetrated the groove. A space is formed between the third vertical plate and the first vertical plate. The sealant is filled in the space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一窗框</p>  
        <p type="p">11:第一立框架</p>  
        <p type="p">12:第三立框架</p>  
        <p type="p">13:上側橫框架</p>  
        <p type="p">14:下側橫框架</p>  
        <p type="p">30:第二窗框</p>  
        <p type="p">31:第二立框架</p>  
        <p type="p">32:第四立框架</p>  
        <p type="p">33:上側橫框架</p>  
        <p type="p">34:下側橫框架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="71" publication-number="202611381"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611381.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611381</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133276</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無骨架之架高地板結構</chinese-title>  
        <english-title>FRAMELESS RAISED FLOOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">E04F15/024</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>主原木業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUU YUAN WOODEN MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳正彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種無骨架之架高地板結構，其包括一架高地板體及數架高螺栓組配合，該數架高螺栓組分別呈可調整佈設於架高地板體之周圍，而該數架高螺栓組之一側抵持於地面，且該數架高螺栓組之另側穿出架高地板體頂面，透過調整數架高螺栓組相對地面之高度，即可進行架高地板體之整平，並於整平固定後將穿出架高地板體之架高螺栓組端側切除，而該架高地板體下方供進行管線佈設，無須使用傳統地板架高之支撐腳料體及數支撐桿體，有效節省施工之工時及成本，且無須有長年木工經驗之師傅即可進行安裝，降低施作之不便及困難度，並克服裝潢缺工之問題，以達施作便利性佳及施作省工省時之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a frameless raised floor structure, which includes a raised floor body and multiple adjustable height bolts. These height bolts are distributed around the periphery of the raised floor body. One end of each height bolt is supported on the ground, while the other end extends through the top surface of the raised floor body. By adjusting the height of the bolts relative to the ground, the raised floor body can be leveled. After leveling and securing, the protruding ends of the height bolts are cut off. The area beneath the raised floor body allows for the installation of pipelines without the need for traditional floor-raising support legs or rods, effectively reducing construction time and cost. The installation does not require workers with extensive carpentry experience, thus minimizing the complexity and difficulty of the process, and addressing the issue of labor shortages in decoration work. The invention achieves the benefits of easy installation, labor-saving, and time efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:架高地板體</p>  
        <p type="p">11:凹陷槽</p>  
        <p type="p">110:固定平面</p>  
        <p type="p">12:穿制孔</p>  
        <p type="p">20:架高螺栓組</p>  
        <p type="p">21:無頭螺栓體</p>  
        <p type="p">210:栓身段</p>  
        <p type="p">211:裁切段</p>  
        <p type="p">212:工具頭固定槽孔</p>  
        <p type="p">22:自爪釘T形螺母體</p>  
        <p type="p">23:迫緊固定螺帽</p>  
        <p type="p">24:彈性腳套墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="72" publication-number="202610700"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610700.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610700</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防墜器之改良裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A62B35/04</main-classification>  
        <further-classification edition="200601120240929B">E04G21/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳晉弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHINHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳晉弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHINHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙元寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係包括一固定框架、一繩索容納轉盤、一複合離心棘齒機構及一殼組。固定框架具有一擋止部。繩索容納轉盤與複合離心棘齒機構係設於固定框架，並被殼組包覆。繩索容納轉盤設一安全繩及一第一齒部；繩索容納轉盤之轉速係被定義為一第一轉速；複合離心棘齒機構設一第二齒部及一可動棘齒；第二齒部與第一齒部嚙合連動，複合離心棘齒機構之轉速係被定義為一第二轉速；當第二轉速超過一門檻值，可動棘齒係離心力甩出並被擋止部擋止，繩索容納轉盤及安全繩均停止而防墜。並當第二轉速未超過門檻值時，繩索容納轉盤及安全繩係可移動。兼具適用於較大長度之安全繩的裝置，及防墜反應更敏銳等優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:固定框架</p>  
        <p type="p">11:吊掛部</p>  
        <p type="p">12:頂板部</p>  
        <p type="p">13:擋止部</p>  
        <p type="p">14:第一延伸部</p>  
        <p type="p">141:第一孔</p>  
        <p type="p">15:第二延伸部</p>  
        <p type="p">151:外垂直板部</p>  
        <p type="p">152:水平板部</p>  
        <p type="p">153:內垂直板部</p>  
        <p type="p">15A:第二孔</p>  
        <p type="p">15B:第三孔</p>  
        <p type="p">20:繩索容納轉盤</p>  
        <p type="p">21:工作圓盤</p>  
        <p type="p">211:第一齒部</p>  
        <p type="p">21A:內齒部</p>  
        <p type="p">30:複合離心棘齒機構</p>  
        <p type="p">31:第二齒部</p>  
        <p type="p">311:外齒部</p>  
        <p type="p">32:離心棘齒部</p>  
        <p type="p">321:環狀表面</p>  
        <p type="p">322:可動棘齒</p>  
        <p type="p">40:殼組</p>  
        <p type="p">41:第一殼體</p>  
        <p type="p">42:第二殼體</p>  
        <p type="p">91:安全繩</p>  
        <p type="p">S1:第一軸桿</p>  
        <p type="p">S2:第二軸桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="73" publication-number="202612559"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612559.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612559</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133293</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透明顯示裝置以及顯示窗戶</chinese-title>  
        <english-title>TRANSPARENT DISPLAY DEVICE AND DISPLAY WINDOW</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H29/10</main-classification>  
        <further-classification edition="202501120250102B">H10H20/851</further-classification>  
        <further-classification edition="200601120250102B">E06B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余瑞斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JUI-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種透明顯示裝置包括透明基板、電路層、發光元件及波長轉換層。電路層設置在透光基板上，發光元件適於發出可見光且設置在電路層上。發光元件和波長轉換層分別設置在電路層的相對兩側。其中波長轉換層適於將可見光轉換為紅外光或紫外光。亦提供一種顯示窗戶。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transparent display device includes a transparent substrate, a circuit layer, a light emitting element and a wavelength conversion layer. The circuit layer is disposed on the transparent substrate, and the light emitting element is adapted to emitting a visible light and is disposed on the circuit layer. The light emitting element and the wavelength conversion layer are respectively disposed on an opposite sides of the circuit layer. The wavelength conversion layer is adapted to converting the visible light into infrared light or ultraviolet light. A display window is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:顯示窗戶</p>  
        <p type="p">110:透明基板</p>  
        <p type="p">122b:子畫素</p>  
        <p type="p">130:電路層</p>  
        <p type="p">131:接墊</p>  
        <p type="p">140:封裝層</p>  
        <p type="p">150:波長轉換層</p>  
        <p type="p">151:第一波長轉換層</p>  
        <p type="p">152B:第二波長轉換層</p>  
        <p type="p">160:蓋板</p>  
        <p type="p">B:鳥類</p>  
        <p type="p">C1,C2B:核</p>  
        <p type="p">IMG:影像光</p>  
        <p type="p">lb:第三色光</p>  
        <p type="p">M1:第一介質</p>  
        <p type="p">M2B:第二介質</p>  
        <p type="p">O:觀察者</p>  
        <p type="p">P1:第一轉換材料</p>  
        <p type="p">PR1:第一粒徑</p>  
        <p type="p">P2B:第二轉換材料</p>  
        <p type="p">PR2B:第二粒徑</p>  
        <p type="p">S1:第一側</p>  
        <p type="p">S2:第二側</p>  
        <p type="p">SD1,SD2B:外殼</p>  
        <p type="p">UV:紫外光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="74" publication-number="202610914"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610914.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610914</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133294</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔熱紙盒結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">B65D81/38</main-classification>  
        <further-classification edition="200601120240929B">B65D81/02</further-classification>  
        <further-classification edition="200601120240929B">B65D85/30</further-classification>  
        <further-classification edition="200601120240929B">B65D85/36</further-classification>  
        <further-classification edition="200601120240929B">B65D5/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作包括以紙材摺製而成且內部形成容置空間的內盒體；紙材於兩表面分別設置兩保護層且包括有盒底外片材、能翻摺地分別連接盒底外片材之兩端的兩端壁外片材、能翻摺地分別連接兩端壁外片材的兩端壁內片材；相對翻摺的所述端壁內片材和端壁外片材形成了具有四個保護層的端壁，所述端壁內片材和端壁外片材之間形成間隔空間來容納空氣，使本創作能夠藉由導熱效率不佳的空氣和多層保護層來產生隔熱的效果，能解決現有紙盒的隔熱及保冷效果不佳的問題，提供一種能提升隔熱功能、妥善保存內容物的隔熱紙盒結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:內盒體</p>  
        <p type="p">12:端壁外片材</p>  
        <p type="p">13:端壁內片材</p>  
        <p type="p">16:插口</p>  
        <p type="p">17:側壁前片材</p>  
        <p type="p">19:側壁內片材</p>  
        <p type="p">22:盒底內片材</p>  
        <p type="p">25:翼片</p>  
        <p type="p">30:外盒體</p>  
        <p type="p">40:盛盤</p>  
        <p type="p">41:底片</p>  
        <p type="p">42:提把</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="75" publication-number="202611930"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611930.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611930</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133303</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體儲存裝置及其讀取方法</chinese-title>  
        <english-title>MEMORY STORAGE APPARATUS AND METHOD FOR READING MEMORY STORAGE APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G11C16/08</main-classification>  
        <further-classification edition="200601120241202B">G11C16/26</further-classification>  
        <further-classification edition="200601120241202B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宗仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNG-ZEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種記憶體儲存裝置，包括記憶胞陣列及控制器電路。記憶胞陣列包括多個第一記憶胞。控制器電路耦接到記憶胞陣列。控制器電路用以調整第一等待期間及第一導通期間，並根據第一等待期間及第一導通期間讀取第一記憶胞所儲存的資料，直到第一記憶胞讀取通過。當控制器電路將第一等待期間調整到目標等待時間長度，且將第一導通期間調整到目標導通時間長度時，第一記憶胞讀取通過。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory storage device including a memory cell array and a controller circuit is provided. The memory cell array includes a plurality of first memory cells. The controller circuit is coupled to the memory cell array. The controller circuit is configured to adjust a first waiting period and a first conduction period, and read data stored in the first memory cell according to the first waiting period and the first conduction period until the first memory cell is read pass. When the controller circuit adjusts the first waiting period to a target waiting time length and the first conduction period to a target conduction time length, the first memory cell is read pass.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:記憶體儲存裝置</p>  
        <p type="p">210:記憶胞陣列</p>  
        <p type="p">220:控制器電路</p>  
        <p type="p">230:位元開關電路</p>  
        <p type="p">240:字元線解碼器電路</p>  
        <p type="p">250:感測放大器電路</p>  
        <p type="p">260:比較器電路</p>  
        <p type="p">D1、D2:資料</p>  
        <p type="p">RVPP:電壓信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="76" publication-number="202612533"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612533.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612533</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔離圖案模組及其製作方法與隔離圖案的建構方法</chinese-title>  
        <english-title>ISOLATION PATTERN MODULE AND FABRICATING METHOD THEREOF AS WELL AS METHOD FOR MANUFACTURING ISOLATION PATTERN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250310B">H10D89/10</main-classification>  
        <further-classification edition="202001120250310B">G06F30/392</further-classification>  
        <further-classification edition="202001120250310B">G06F30/398</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昆源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, KUN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許振賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建孚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, RUEI-YAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周予品</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YU-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHENG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種隔離圖案模組，包括:第一子隔離圖案以及第二子隔離圖案。第一子隔離圖案包括複數個圖案單元，每一個圖案單元具有一條線寬邊界，用以定義出一個封閉區域。第二子隔離圖案對應於每一個圖案單元的該線寬邊界，並與封閉區域重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An isolation pattern module includes a first sub-isolation-pattern and a second sub-isolation-pattern. The sub-isolation-pattern includes a plurality of pattern units, and each of the pattern units has a pitch boundary to define a closed area. The second sub-isolation-pattern corresponds to the pitch boundary of each of the pattern units and overlaps the closed area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光罩模組</p>  
        <p type="p">101:第一光罩圖案</p>  
        <p type="p">101a:圖案單元</p>  
        <p type="p">101p:線寬邊界</p>  
        <p type="p">102:第二光罩圖案</p>  
        <p type="p">103:封閉區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="77" publication-number="202611659"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611659.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611659</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133307</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電壓調整裝置</chinese-title>  
        <english-title>VOLTAGE REGULATING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G05F1/565</main-classification>  
        <further-classification edition="200601120241202B">H03F1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣汝安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, JU-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電壓調整裝置包括放大器電路、分壓電路以及輸出級電路。放大器電路具有第一輸入端以接收參考電壓。放大器電路的輸出端提供第一電壓。分壓電路分壓第一電壓以產生回授電壓，並提供回授電壓至放大器的第二輸入端。輸出級電路包括相互串接的第一電阻以及電流源。電流源用以提供流向參考電壓端的拉低電流，第一電阻以及電流源的耦接端點產生輸出電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A voltage regulating device include an amplifying circuit, a voltage dividing circuit and an output stage circuit. The amplifying circuit has a first end for receiving a reference voltage. An output end of the amplifying circuit provides a first voltage. The voltage dividing circuit divides the first voltage to generate a feedback voltage, and provides the feedback voltage to a second input end of the amplifying circuit. The output stage circuit includes a first resistor and a current source coupled in series. The current source provides a pull down current flowing toward to a reference voltage end, and a coupling end of the first resistor and the current source generated an output voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電壓調整裝置</p>  
        <p type="p">110:放大器電路</p>  
        <p type="p">120:分壓電路</p>  
        <p type="p">130:輸出級電路</p>  
        <p type="p">V1:第一電壓</p>  
        <p type="p">VFB:回授電壓</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">VREF:參考電壓</p>  
        <p type="p">VS:參考電壓端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="78" publication-number="202612524"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612524.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612524</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133308</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電晶體結構及其製造方法</chinese-title>  
        <english-title>TRANSISTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D64/20</main-classification>  
        <further-classification edition="202501120250102B">H10D64/60</further-classification>  
        <further-classification edition="202501120250102B">H10D30/60</further-classification>  
        <further-classification edition="202501120250102B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電晶體結構及其製造方法。所述電晶體結構包括閘極、摻雜區以及閘介電結構。所述閘極設置於基底上，且包括第一部分與第二部分，其中所述第二部分圍繞所述第一部分，且所述第一部分的材料與所述第二部分的材料不同。所述摻雜區設置於所述閘極的兩側的所述基底中。所述閘介電結構設置於所述閘極與所述基底之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transistor structure and a manufacturing method thereof are provided. The transistor structure includes a gate, doped regions and a gate dielectric structure. The gate is disposed on a substrate and includes a first portion and a second portion, wherein the second portion surrounds the first portion, and a material of the first portion and a material of the second portion are different. The doped regions are disposed in the substrate on both sides of the gate. The gate dielectric structure is disposed between the gate and the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">102:隔離結構</p>  
        <p type="p">G:閘極</p>  
        <p type="p">P1:第一部分</p>  
        <p type="p">P2:第二部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="79" publication-number="202612549"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612549.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612549</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光晶片及顯示裝置</chinese-title>  
        <english-title>LIGHT-EMITTING CHIP AND DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H20/81</main-classification>  
        <further-classification edition="202501120250102B">H10H20/83</further-classification>  
        <further-classification edition="202501120250102B">H10H20/857</further-classification>  
        <further-classification edition="202501120250102B">H10H29/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇薪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳映羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YINYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊文瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種發光晶片包括第一型半導體圖案、第一主動圖案、第二主動圖案、多個第二型半導體圖案、第一電極及多個第二電極。第一主動圖案設置於第一型半導體圖案上。第二主動圖案設置於第一主動圖案的第二部分上。多個第二型半導體圖案於結構上彼此分離，且設置於第一主動圖案的第一部分及第二主動圖案上。第一電極電性連接至第一型半導體圖案。多個第二電極設置於多個第二型半導體圖案上且電性連接至多個第二型半導體圖案。第一型半導體圖案及第一電極設置於第一主動圖案的第一側。第二主動圖案及多個第二電極設置於第一主動圖案的第二側。此外，包括上述發光晶片的顯示裝置也被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light-emitting chip includes a first-type semiconductor pattern, a first active pattern, a second active pattern, second-type semiconductor patterns, a first electrode and second electrodes. The first active pattern is disposed on the first-type semiconductor pattern. The second active pattern is disposed on a second portion of the first active pattern. The second-type semiconductor patterns are structurally separated from each other and are disposed on a first portion of the first active pattern and the second active pattern. The first electrode is electrically connected to the first-type semiconductor pattern. The second electrodes are disposed on the second-type semiconductor patterns and are electrically connected to the second-type semiconductor patterns. The first type semiconductor pattern and the first electrode are disposed on a first side of the first active pattern. The second active pattern and the second electrodes are disposed on a second side of the first active pattern. In addition, a display apparatus including the light-emitting chip is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:發光晶片</p>  
        <p type="p">120:第一型半導體圖案</p>  
        <p type="p">120a、130a:表面</p>  
        <p type="p">130:第一主動圖案</p>  
        <p type="p">130s、142s、152s、161s、162s、163s、171s、172s、173s:側壁</p>  
        <p type="p">131:第一部分</p>  
        <p type="p">132:第二部分</p>  
        <p type="p">133:第三部分</p>  
        <p type="p">142:第二主動圖案</p>  
        <p type="p">152:第三主動圖案</p>  
        <p type="p">161、162、163:電子阻擋圖案</p>  
        <p type="p">171、172、173:第二型半導體圖案</p>  
        <p type="p">180:鈍化層</p>  
        <p type="p">181、182、183:接觸窗</p>  
        <p type="p">191、192、193:第二電極</p>  
        <p type="p">198:第一電極</p>  
        <p type="p">B:第一色光</p>  
        <p type="p">G:第二色光</p>  
        <p type="p">g1、g2、g3、g5、g6:間隙</p>  
        <p type="p">R:第三色光</p>  
        <p type="p">S1:第一側</p>  
        <p type="p">S2:第二側</p>  
        <p type="p">Z:方向</p>  
        <p type="p">I-I’:剖線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="80" publication-number="202612305"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612305.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612305</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>共同簽章系統及其方法、車聯網憑證管理系統、金融憑證管理系統</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR CO-SIGNATURE, INTERNET OF VEHICLES CERTIFICATE MANAGEMENT SYSTEM, FINANCIAL CERTIFICATE MANAGEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H04L9/08</main-classification>  
        <further-classification edition="200601120241202B">H04L9/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅方怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, FANG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昭綺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JAU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種共同簽章系統及其方法、車聯網憑證管理系統、金融憑證管理系統，方法適用於包括第一簽章設備、第二簽章設備以及驗章設備的共同簽章系統中，包括：第一簽章設備產製第一隨機數、第一橢圓曲線點，將後量子密碼學同態加密公鑰以及第一橢圓曲線密碼學私鑰加密後產製第一密文，並且傳送至第二簽章設備。第二簽章設備產製第二隨機數、第二橢圓曲線點、融合橢圓曲線點，且產製第二密文及第三密文並傳送至第一簽章設備。第一簽章設備根據第一隨機數、明文、融合橢圓曲線點產製簽章，並且將簽章以及訊息傳送至驗章設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for co-signature, internet of vehicles certificate management system, financial certificate management system are provided, the method is applicable to co-signature system including a first signature device, a second signature device and a verification device, includes that the first signature device generates a first random number and a first elliptic curve point, encrypts a post-quantum cryptography homomorphic encryption public key and a first elliptic curve cryptography private key to generate a first ciphertext, and transmits it to the second signature device. The second signature device generates a second random number, a second elliptic curve point, and a fused elliptic curve point, and generates a second ciphertext and a third ciphertext and transmits them to the first signature device. The first signature device generates a signature according to the first random number, a plaintext, and the fused elliptic curve point, and transmits the signature and message to the verification device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:第一簽章設備</p>  
        <p type="p">120:第二簽章設備</p>  
        <p type="p">130:驗章設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="81" publication-number="202611887"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611887.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611887</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133317</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板的電源驅動電路</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G09G3/30</main-classification>  
        <further-classification edition="200601120241202B">G09G5/18</further-classification>  
        <further-classification edition="202001120241202B">H05B45/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富動科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李騏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳正育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種顯示面板的電源驅動電路，包含有時序控制電路單元、第一電源管理電路單元、第二電源管理電路單元及線路單元。時序控制電路單元電連接第一電源管理電路單元及第二電源管理電路單元，以接收時序控制訊號。線路單元電連接第一電源管理電路單元及第二電源管理電路單元，且並聯第一電源管理電路單元的第一輸出埠及第二電源管理電路單元的第二輸出埠後，電連接至該些線路單元輸出埠。藉此增加電流流量，提供後端足夠的推力，以避免過度設計所帶來的成本，並可通過單一規格的電源管理電路單元應用於多種的面板單元產品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:時序控制電路單元</p>  
        <p type="p">21:第一電源管理電路單元</p>  
        <p type="p">210:第一輸入埠</p>  
        <p type="p">211:第一輸出埠</p>  
        <p type="p">2111:第一主輸出端、第一輸出端</p>  
        <p type="p">2112:第二主輸出端、第二輸出端</p>  
        <p type="p">22:第二電源管理電路單元</p>  
        <p type="p">220:第二輸入埠</p>  
        <p type="p">221:第二輸出埠</p>  
        <p type="p">2211:第一從輸出端、第一輸出端</p>  
        <p type="p">2212:第二從輸出端、第二輸出端</p>  
        <p type="p">30:線路單元</p>  
        <p type="p">310:第一線路單元輸入埠</p>  
        <p type="p">311:第一線路單元主輸入端、第一線路單元輸入端</p>  
        <p type="p">312:第二線路單元主輸入端、第二線路單元輸入端</p>  
        <p type="p">320:第二線路單元輸入埠</p>  
        <p type="p">321:第一線路單元從輸入端、第一線路單元輸入端</p>  
        <p type="p">322:第二線路單元從輸入端、第二線路單元輸入端</p>  
        <p type="p">330:線路單元輸出埠</p>  
        <p type="p">331:第一線路單元輸出端</p>  
        <p type="p">332:第二線路單元輸出端</p>  
        <p type="p">40:面板單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="82" publication-number="202612344"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612344.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612344</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133319</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影片播放系統及其方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241202B">H04N21/462</main-classification>  
        <further-classification edition="201101120241202B">H04N21/4627</further-classification>  
        <further-classification edition="200601120241202B">H04N5/913</further-classification>  
        <further-classification edition="201101120241202B">H04N21/432</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣大哥大股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN MOBILE CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳淑琴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張美惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方俞喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥佐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尚諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影片播放系統，包含：一資料庫，儲存一影片資料，該影片資料包含複數個影片區段資料，該複數個影片區段資料包含一第一影片區段資料以及一第二影片區段資料，該第二影片區段資料接續於該第一影片區段資料之後；以及一伺服器，存取該資料庫，並通訊連接一播放裝置；其中該伺服器自該播放裝置接收一播放要求指令，該伺服器基於該播放要求指令，而使該播放裝置具有播放該第一影片區段資料的權限；其中該伺服器基於該播放裝置播放該第一影片區段資料，而使該播放裝置具有播放該第二影片區段資料的權限。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:影片播放系統</p>  
        <p type="p">110:資料庫</p>  
        <p type="p">120:伺服器</p>  
        <p type="p">900:播放裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="83" publication-number="202612203"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612203.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612203</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133320</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>剝線鉗結構</chinese-title>  
        <english-title>WIRE STRIPPER STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">H02G1/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高屹工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAUW YEHI INDUSTRIAL CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏佑庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, YU TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案係為一種剝線鉗結構。本體包含對應設置的第一基座及第二基座。夾摯件設置在第一基座的一側。咬合刀刃組設置在第二基座的一側。一對鉗柄組包含第一、第二鉗柄組，第一鉗柄組樞接第一基座，第二鉗柄組樞接第二基座。剪切刀刃組對應設置在該對鉗柄組上。樞軸組設置在本體中，包含中軸、第一、第二扭簧，第一扭簧的一端抵掣第一鉗柄組、另一端抵掣第二鉗柄組，第二扭簧的一端固定在中軸、另一端固定在第二基座。中軸穿設本體、該對鉗柄組、第一扭簧及第二扭簧並固定在本體中，該對鉗柄組透過第一扭簧作相對開合而能夠在剪切刀刃組進行左右剪切，第二基座過該第二扭簧而能夠令咬合刀刃組進行上下裁切；藉此延長剝線鉗的使用壽命並提高使用安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wire stripper structure is disclosed. A main body includes a first base and a second base arranged correspondingly. A clamping piece is arranged on one side of the first base. An engaging blade set is arranged on one side of the second base. A pair of pliers groups includes a first handle set and a second handle set. The first handle set is pivotally connected to the first base, and the second handle set is pivotally connected to the second base. The engaging blade set is arranged on the pair of pliers groups. A pivot set is arranged on the main body and includes a central axis, a first and second torsion springs. One end of the first torsion spring abuts against the first handle set, and another end abuts against the second handle set. One end of the second torsion spring is fixed on the central axis, and another end is fixed on the second base. The central axis passes through the main body, the pair of pliers groups, the first torsion spring and the second torsion spring and is fixed in the main body. The pair of pliers groups operates through the first torsion spring, so that the engaging blade set performs a vertical cutting. The second base drives the engaging blade set through the second torsion spring to perform a horizontal cutting.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:剝線鉗結構</p>  
        <p type="p">10:本體</p>  
        <p type="p">20:夾摯件</p>  
        <p type="p">30:咬合刀刃組</p>  
        <p type="p">40:柄組</p>  
        <p type="p">41:第一鉗柄組</p>  
        <p type="p">411:第一支臂</p>  
        <p type="p">412:第一擋柱</p>  
        <p type="p">42:第二鉗柄組</p>  
        <p type="p">421:第二支臂</p>  
        <p type="p">422:第二擋柱</p>  
        <p type="p">50:剪切刀刃組</p>  
        <p type="p">60:樞軸組</p>  
        <p type="p">61:中軸</p>  
        <p type="p">62:第一扭簧</p>  
        <p type="p">70:連桿組</p>  
        <p type="p">90:彈臂組</p>  
        <p type="p">91:固定軸</p>  
        <p type="p">92:扣臂</p>  
        <p type="p">93:第三扭簧</p>  
        <p type="p">94:扣柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="84" publication-number="202611665"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611665.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611665</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133325</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>升降系統</chinese-title>  
        <english-title>ELEVATING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G06F1/16</main-classification>  
        <further-classification edition="200601220241007B">H04N5/655</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和碩聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGATRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊偉澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEI-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種升降系統，包括殼體、轉動模組、升降模組以及傳動件。轉動模組連接殼體，並包含轉動件。升降模組連接殼體，並包含升降件。傳動件連接轉動件與升降件。轉動件相對於殼體轉動時，傳動件帶動升降件相對於殼體切換於第一狀態與第二狀態之間。於第一狀態下，升降件係相對於殼體的表面具有第一高度，且於第二狀態下，升降件係相對於表面具有不同於第一高度的第二高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to an elevating system, which includes a housing, a rotating module, an elevating module, and a transmission component. The rotating module is connected to the housing and includes a rotating component. The elevating module is connected to the housing and includes an elevating component. The transmission component is connected to the rotating component and the elevating component. The rotating component is configured to rotate relative to the housing, so as to make the elevating component switch between a first state and a second state relative to the housing through the transmission component. In the first state, the elevating component has a first height relative to a surface of the housing. In the second state, the elevating component has a second height different from the first height relative to the surface of the housing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:筆記型電腦</p>  
        <p type="p">20:升降系統</p>  
        <p type="p">100:轉動模組</p>  
        <p type="p">200:傳動件</p>  
        <p type="p">300:升降模組</p>  
        <p type="p">400:殼體</p>  
        <p type="p">A1-A1:切線</p>  
        <p type="p">x:第一軸向</p>  
        <p type="p">y:第二軸向</p>  
        <p type="p">z:第三軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="85" publication-number="202612361"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612361.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612361</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133328</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於Bluetooth　Mesh與MODBUS　RTU/TCP整合的無線感測與控制系統</chinese-title>  
        <english-title>WIRELESS SENSING AND CONTROL SYSTEM BASED ON INTEGRATION OF BLUETOOTH MESH AND MODBUS RTU/TCP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241202B">H04W4/80</main-classification>  
        <further-classification edition="201801120241202B">H04W4/02</further-classification>  
        <further-classification edition="200601120241202B">H04L12/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譜羅科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANFI SEMICONDUCTOR CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　攸中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宸瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHEN WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種基於Bluetooth Mesh與Modbus RTU/TCP整合的無線感測與控制系統，包括：至少一感測器；一虛擬MODBUS TCP伺服器，具有Bluetooth Mesh架構的至少三個節點，各節點與該至少一感測器透過MODBUS RTU而通訊連接；一手持式裝置，與該虛擬MODBUS TCP伺服器的其中一節點通訊連接；以及一感測器集線器，與該虛擬MODBUS TCP伺服器透過MODBUS TCP而通訊連接。藉此，利用Bluetooth Mesh的廣播訊號來接收和傳輸來自無電開關和無電感測器的資料，同時將MODBUS RTU資料進行轉換並傳送至MODBUS TCP網絡中，藉此實現大規模網絡的無線通訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a wireless sensing and control system based on an integration of Bluetooth Mesh and MODBUS RTU/TCP. The system includes at least one sensor; a virtual MODBUS TCP server, having at least three nodes of a Bluetooth Mesh architecture, wherein each node communicates with the at least one sensor through MODBUS RTU; a mobile device, communicating with one of the nodes of the virtual MODBUS TCP server; and a sensor hub, communicating with the virtual MODBUS TCP server through MODBUS TCP. Thereby, an advertising signal of Bluetooth Mesh is used to receive and transmit data from powerless switches and powerless sensors, and at the same time, the MODBUS RTU data are converted and sent to a MODBUS TCP network, thereby realizing wireless communication on a large-scale network. &lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基於Bluetooth Mesh與MODBUS RTU/TCP整合的無線感測與控制系統</p>  
        <p type="p">110:工業用感測器</p>  
        <p type="p">120:環境感測器</p>  
        <p type="p">200:虛擬MODBUS TCP伺服器</p>  
        <p type="p">210:節點</p>  
        <p type="p">220:節點</p>  
        <p type="p">230:節點</p>  
        <p type="p">240:節點</p>  
        <p type="p">300:手持式裝置</p>  
        <p type="p">400:感測器集線器</p>  
        <p type="p">500:無電開關</p>  
        <p type="p">600:資訊系統</p>  
        <p type="p">610:顯示螢幕</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="86" publication-number="202611298"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611298.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611298</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133331</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防水透濕有機矽皮革及其製備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">C14C11/00</main-classification>  
        <further-classification edition="200601120240927B">C14C13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞帝歐光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADO OPTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>花明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉箐茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供防水透濕有機矽皮革及其製備方法。該方法步驟包括面膠製備步驟、底膠製備步驟、面層製備步驟、底層製備步驟及離型紙剝離步驟，以使製得之有機矽皮革包括一面層、一設於該面層表面的底層及一覆設於該底層表面的基布；該面層與該底層內部經機械發泡成型有不規則狀微型通道，並於表面成形有防水透濕孔，令該底層與該面層黏結並導通該防水透濕孔，使該底層的該微型通道連通至該面層的微型通道；藉此，透過有機矽材料本身良好的防水性能，結合機械發泡技術，實現防水和透氣性能的平衡，達到提升使用舒適度、耐候性和耐磨性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:面層</p>  
        <p type="p">21:第一表面</p>  
        <p type="p">22:第二表面</p>  
        <p type="p">23:微型通道</p>  
        <p type="p">24:防水透濕孔</p>  
        <p type="p">30:底層</p>  
        <p type="p">31:第三表面</p>  
        <p type="p">32:第四表面</p>  
        <p type="p">33:微型通道</p>  
        <p type="p">34:防水透濕孔</p>  
        <p type="p">40:基布</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="87" publication-number="202611809"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611809.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611809</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133332</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>得獎公告系統</chinese-title>  
        <english-title>AWARD ANNOUNCEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">G06Q10/10</main-classification>  
        <further-classification edition="202301120241101B">G06Q10/06</further-classification>  
        <further-classification edition="200601120241101B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兆豐國際商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張湘芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIANG-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的一些實施方式提供一種得獎公告系統，包含得獎單位端裝置、審核單位端裝置以及伺服器。得獎單位端裝置包含得獎呈報模組，得獎呈報模組配置以上傳對外公告資料。伺服器，連接得獎單位端裝置以及審核單位端裝置，伺服器包含對外公告資料庫、審核通知模組以及處理器，其中審核通知模組配置以當對外公告資料上傳至對外公告資料庫時，通知審核單位端裝置審核對外公告資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments of the disclosure provide an award announcement system, including an award-winning unit terminal device, a review unit terminal device and a server. The award-winning unit terminal device includes an award-reporting module, in which the award-reporting module is configured to upload an external announcement information. The server is linked to the award-winning unit terminal device and the review unit terminal device, in which the server includes an external announcement information database, a review-notification module and a processor, in which the review-notification module is configured to notice the review unit terminal device to review the external announcement information when the external announcement information is upload to the external announcement information database.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:得獎公告系統</p>  
        <p type="p">100:得獎單位端裝置</p>  
        <p type="p">110:得獎呈報模組</p>  
        <p type="p">200:伺服器</p>  
        <p type="p">210:對外公告資料庫</p>  
        <p type="p">212:對外公告資料</p>  
        <p type="p">214:對外新聞稿資料</p>  
        <p type="p">216:外部連結資料</p>  
        <p type="p">218:廣告設計資料</p>  
        <p type="p">220:對內公告資料庫</p>  
        <p type="p">222:對內公告資料</p>  
        <p type="p">230:審核通知模組</p>  
        <p type="p">240:處理器</p>  
        <p type="p">250:官網更新提醒模組</p>  
        <p type="p">300:審核單位端裝置</p>  
        <p type="p">310:第一審核單位端裝置</p>  
        <p type="p">312:第一審核模組</p>  
        <p type="p">320:第二審核單位端裝置</p>  
        <p type="p">322:第二審核模組</p>  
        <p type="p">330:第三審核單位端裝置</p>  
        <p type="p">332:第三審核模組</p>  
        <p type="p">400:經選定的其他單位端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="88" publication-number="202610870"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610870.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610870</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>駕駛自動化功能的升級方法以及適用此方法的域控制器和車輛</chinese-title>  
        <english-title>METHOD FOR UPGRADING DRIVING AUTOMATION FEATURES AND DOMAIN CONTROLLER AND VEHICLE FOR THIS METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241105B">B60W30/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍英庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, YING-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾碩彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, SHUO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種駕駛自動化功能的升級方法，適用於包括具有線控系統的第一控制器的車輛。升級方法包括連接第二控制器至第一控制器。第二控制器用以產生控制指令，並且將所述控制指令發送至第一控制器。第一控制器用以利用線控系統根據所述控制指令進行車輛的運動控制。此外，一種使用此方法的域控制器和車輛亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for upgrading driving automation features, applicable to vehicles that include a first controller with a drive-by-wire system. The method includes connecting a second controller to the first controller. The second controller is configured to generate a control command, and send the control command to the first controller. The first controller is configured to control a movement of the vehicle according to the control command by utilizing the drive-by-wire system. In addition, a domain controller and a vehicle using this method are also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:車輛</p>  
        <p type="p">110:第一控制器</p>  
        <p type="p">111:線控系統</p>  
        <p type="p">120:第一傳感器</p>  
        <p type="p">130:第二傳感器</p>  
        <p type="p">400:域控制器</p>  
        <p type="p">410:連接介面</p>  
        <p type="p">420:決策模組</p>  
        <p type="p">430:感知模組</p>  
        <p type="p">440:控制模組</p>  
        <p type="p">S1、S2、S3、S4、S5:訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="89" publication-number="202611163"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611163.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611163</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133336</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>酚樹脂及其應用</chinese-title>  
        <english-title>PHENOLIC RESIN AND APPLICATIONS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241011B">C08G61/10</main-classification>  
        <further-classification edition="200601120241011B">C08L65/00</further-classification>  
        <further-classification edition="200601120241011B">C08J5/24</further-classification>  
        <further-classification edition="200601120241011B">B32B15/08</further-classification>  
        <further-classification edition="200601120241011B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長春人造樹脂廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG CHUN PLASTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜安邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, AN-PANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉祈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GAI CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊博淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, PO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃琮益</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種酚樹脂，其係如下式（I）所示， &lt;br/&gt;&lt;img align="absmiddle" height="162px" width="608px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中， &lt;br/&gt;Ar為具有羥基之伸芳基，各Ar可相同或不同； &lt;br/&gt;R為伸甲基； &lt;br/&gt;m1及m2各自獨立為0至4之整數； &lt;br/&gt;n大於0；以及 &lt;br/&gt;該酚樹脂經由凝膠滲透層析（GPC）測定時，表示n小於5之部分的峰值面積總和為A，表示n為5以上之部分的峰值面積總和為B，且B與A的比值（B/A）為0.35至1.32。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A phenolic resin is provided. The phenolic resin is represented by formula (I) below, &lt;br/&gt;&lt;img align="absmiddle" height="170px" width="659px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein, &lt;br/&gt;each Ar is an arylene with hydroxyl group(s), and each Ar can be identical or different; &lt;br/&gt;each R is methylene; &lt;br/&gt;m1 and m2 are integers independently ranging from 0 to 4; &lt;br/&gt;n is greater than zero; and &lt;br/&gt;when the phenolic resin is characterized by gel permeation chromatography (GPC), peaks representing the parts where n is less than 5 have a total area A, peaks representing the parts where n is 5 or more have a total area B, and a ratio of A to B (B/A) is 0.35 to 1.32.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">：無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="90" publication-number="202611164"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611164.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611164</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環氧樹脂及其應用</chinese-title>  
        <english-title>EPOXY RESIN AND APPLICATIONS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241011B">C08G61/10</main-classification>  
        <further-classification edition="200601120241011B">C08G59/06</further-classification>  
        <further-classification edition="200601120241011B">C08L63/00</further-classification>  
        <further-classification edition="200601120241011B">C08J5/24</further-classification>  
        <further-classification edition="200601120241011B">B32B15/092</further-classification>  
        <further-classification edition="200601120241011B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長春人造樹脂廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG CHUN PLASTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜安邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, AN-PANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉祈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GAI CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊博淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, PO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃琮益</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種環氧樹脂，其係如下式（I）所示， &lt;br/&gt;&lt;img align="absmiddle" height="155px" width="627px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中， &lt;br/&gt;Ar為具有環氧基之伸芳基，各Ar可相同或不同； &lt;br/&gt;R為伸甲基； &lt;br/&gt;m1及m2各自獨立為0至4之整數； &lt;br/&gt;n大於0；以及 &lt;br/&gt;該環氧樹脂經由凝膠滲透層析（GPC）測定時，表示n小於5之部分的峰值面積總和為A，表示n為5以上之部分的峰值面積總和為B，且B與A的比值（B/A）為0.40至1.40。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A epoxy resin is provided. The epoxy resin is represented by formula (I) below, &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="646px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein, &lt;br/&gt;each Ar is an arylene with epoxy group(s), and each Ar can be identical or different; &lt;br/&gt;each R is methylene; &lt;br/&gt;m1 and m2 are integers independently ranging from 0 to 4; &lt;br/&gt;n is greater than zero; and &lt;br/&gt;when the epoxy resin is characterized by gel permeation chromatography (GPC), peaks representing the parts where n is less than 5 have a total area A, peaks representing the parts where n is 5 or more have a total area B, and a ratio of A to B (B/A) is 0.40 to 1.40.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">：無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="91" publication-number="202612551"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612551.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612551</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133340</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光二極體</chinese-title>  
        <english-title>LIGHT EMITTING DIODE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H20/822</main-classification>  
        <further-classification edition="202501120250102B">H10H20/851</further-classification>  
        <further-classification edition="202501120250102B">H10H20/81</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭鴻達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HONG-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡景元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAO-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種發光二極體，包括基板、半導體發光結構、P型電極及N型電極。半導體發光結構包括P型半導體層、發光層及N型半導體層，P型半導體層位於基板上，發光層位於P型半導體層上，且N型半導體層位於發光層上；其中P型半導體層包括相對之第一側及第二側，基板連接第一側，且發光層連接第二側；P型電極係自P型半導體層之第二側朝向第一側埋入P型半導體層內，使得P型電極已埋入部分之每一側面貼合P型半導體層；以及N型電極位於N型半導體層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a light-emitting diode, which includes a substrate, a semiconductor light-emitting structure, a P-type electrode and an N-type electrode. The semiconductor light-emitting structure includes a P-type semiconductor layer, a light-emitting layer and an N-type semiconductor layer. The P-type semiconductor layer is located on the substrate, the light-emitting layer is located on the P-type semiconductor layer, and the N-type semiconductor layer is located on the light-emitting layer. The P-type semiconductor layer includes a first side and a second side opposite to the first side, the substrate is connected to the first side, and the light-emitting layer is connected to the second side; the P-type electrode is buried in the P-type semiconductor layer from the second side of the P-type semiconductor layer toward the first side, so that each side of an embedded part of the P-type electrode is attached to the P-type semiconductor layer; and the N-type electrode is located on the N-type semiconductor layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:發光二極體</p>  
        <p type="p">10:基板</p>  
        <p type="p">20:半導體發光結構</p>  
        <p type="p">21:P型半導體層</p>  
        <p type="p">211:第一側</p>  
        <p type="p">212:第二側</p>  
        <p type="p">22:發光層</p>  
        <p type="p">23:N型半導體層</p>  
        <p type="p">30:P型電極</p>  
        <p type="p">40:N型電極</p>  
        <p type="p">50:鍵合層</p>  
        <p type="p">B:設置區</p>  
        <p type="p">D:設定深度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="92" publication-number="202611390"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611390.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611390</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133342</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>汽輪發電系統發電量提升方法</chinese-title>  
        <english-title>METHOD FOR INCREASING POWER GENERATION OF STEAM TURBINE POWER GENERATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">F01K25/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白啟正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAI, CHI-JENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昆蔚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張鈞程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂耀庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, YAO-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種汽輪發電系統發電量提升方法，汽輪發電系統包含冷卻風扇、循環水泵浦及發電機組，其包含以下步驟：通過預測模組獲得在第一運作條件下的第一預測蒸汽量及在第二運作條件下的第二預測蒸汽量；將第一預測蒸汽量減去第二預測蒸汽量以獲得蒸汽量差值；獲得發電機組在第一運作條件與第二運作條件下的發電功率差值；獲得第一運作條件與第二運作條件之間的冷卻風扇與循環水泵浦的耗電量差；將發電功率差值減去耗電量差，以獲得淨發電量；以及當淨發電量為正時，則以第二運作條件及第二預測蒸汽量運作汽輪發電系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method for increasing power generation of steam turbine power generation system. The steam turbine power generation system includes a cooling fan, a circulating water pump, and a power generator. The method includes the following steps: obtaining a first predicted steam amount under a first operating condition and a second predicted steam amount under a second operating condition by a prediction module; subtracting the second predicted steam amount from the first predicted steam amount to obtaining a steam amount difference; obtaining a generated power difference of the power generator under the first operating condition and the second operating condition; obtaining a power consumption difference of the cooling fan and the circulating water pump under the first operating condition and the second operating condition; subtracting the power consumption difference from the generated power difference to a net power generation value; and operating the steam turbine power generation system under the second operating condition and the second predicted steam amount, when the net power generation value is positive.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:汽輪發電系統發電量提升方法</p>  
        <p type="p">S110:步驟</p>  
        <p type="p">S120:步驟</p>  
        <p type="p">S130:步驟</p>  
        <p type="p">S140:步驟</p>  
        <p type="p">S142:步驟</p>  
        <p type="p">S144:步驟</p>  
        <p type="p">S150:步驟</p>  
        <p type="p">S160:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="93" publication-number="202611979"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611979.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611979</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133343</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體超薄堆疊結構的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING SEMICONDUCTOR STACK STRUCTURE WITH ULTRA THIN DIE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H01L21/02</main-classification>  
        <further-classification edition="200601120241101B">H01L21/306</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商奈興科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEXTHIN TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱志威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉人豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, JEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體超薄堆疊結構的製造方法，包括製造多個半導體晶圓，其在半導體基板內形成有由離子佈植形成的停止層結構，主動面形成有磊晶層、主動層及重布線層，且形成導電結構連接介電停止層及重布線層。在其中一個半導體晶圓的重布線層上接合承載板，且移除部分半導體基板及部分停止層結構，以顯露介電停止層及導電結構。在另一個半導體晶圓的重布線層上形成具導電柱的接合層，並進行切單以形成多批的半導體晶片；將一批半導體晶片的接合層以混合鍵合技術接合於半導體晶圓之顯露的介電停止層上，且導電結構分別與半導體晶片的導電柱電性連接。形成封裝膠體包覆半導體晶片；移除部分封裝膠體以及移除半導體晶片的部分半導體基板及部分停止層結構，以顯露此批半導體晶片的介電停止層及導電結構，以供進行下一批半導體晶片的接合堆疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing a semiconductor stack structure with ultra thin die, including manufacturing a plurality of semiconductor wafers, wherein a stop layer structure formed by ion implantation is formed in the semiconductor substrate, and an epitaxial layer, an active layer and a redistribution layer are formed on the active surface, and the conductive structures are formed to connect the dielectric stop layer and the redistribution layer. A carrier board is bonded to the redistribution layer of one of the semiconductor wafers, and part of the semiconductor substrate and part of the stop layer structure are removed to expose the dielectric stop layer and conductive structure. Form a bonding layer with conductive pillars on the redistribution layer of another semiconductor wafer, and performing a die sawing to form multiple batches of dies. Bonding the bonding layers of a batch of dies to the exposed dielectric stop layers of the semiconductor wafers by using hybrid bonding technology, and the conductive structures are electrically connected to the conductive pillars of the dies, respectively. Form an encapsulant to cover the batch of dies; removing part of the encapsulant, and removing part of the semiconductor substrate and part of the stop layer structure of each die, to expose the dielectric stop layer and conductive structure of this batch of dies for bonding and stacking of the next batch of dies.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2000a:第一批半導體晶片</p>  
        <p type="p">2000b:第二批半導體晶片</p>  
        <p type="p">2000c:第三批半導體晶片</p>  
        <p type="p">142’:介電停止層</p>  
        <p type="p">20:導電結構</p>  
        <p type="p">204:導電材</p>  
        <p type="p">24b:第一接合層</p>  
        <p type="p">40:導電柱</p>  
        <p type="p">42a:第一封裝膠體</p>  
        <p type="p">42b:第二封裝膠體</p>  
        <p type="p">42c:第三封裝膠體</p>  
        <p type="p">H:間隙高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="94" publication-number="202611745"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611745.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611745</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133344</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>長文本資料分析方法、體傷判決分析方法及其系統</chinese-title>  
        <english-title>METHODS FOR ANALYZING LONG SEQUENCES, METHODS FOR ANALYZING PHYSICAL INJURY JUDGMENTS, AND SYSTEMS USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241202B">G06F16/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國泰世紀產物保險股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CATHAY CENTURY INSURANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭逸翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃郁雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佳樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JIA-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝博丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, BO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹尉聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, WEI-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊勝堡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHENG-PAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何偉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, WEI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪又新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭庭毓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, TING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王泳人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUNG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鈺昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王沛倪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PEI-NI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴詠家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, YUNG-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭明斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, MING-SSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂孟凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, MENG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何美瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在此揭示一種長文本資料分析方法、體傷判決分析方法及其系統。本揭示內容之方法是以複合文本分析模組所執行，且複合文本分析模型包含通用資訊萃取模型（UIE）和通用文本分類模型(UTC)，其中先以通用資訊萃取模型擷取與長文本資料中與複數個特徵資訊相關的複數筆短文本資料，再以通用文本分類模型進行分類得到結構化文本資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is a method for analyzing long sequences, a method for analyzing physical injury judgments, and a system using the same. The method of present disclosure is executed using a composite text analysis module, which includes a Universal Information Extraction (UIE) model and a Universal Text Classification (UTC) model. First, the Universal Information Extraction model is used to extract multiple short texts related to a plurality of features from the long sequences. Then, the Universal Text Classification model classifies these short texts to obtain structured data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">402:結構化判決資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="95" publication-number="202610902"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610902.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610902</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>回收物捆線剪斷暨捲收設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B65B61/06</main-classification>  
        <further-classification edition="200601120241007B">B65B63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高大利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高大利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉安鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種回收物捆線剪斷暨捲收設備，包含有一機台、一設於機台上之輸送裝置、一設於機台一側上之第一剪斷裝置、一設於機台另一側上之第二剪斷裝置、一壓線裝置及一捲收裝置；壓線裝置具有一滑接於機台上之滑座、一樞接於該滑座上之壓制架、一連結於滑座與壓制架間之壓放動力件及一連結於機台與滑座間之升降動力件，捲收裝置具有一滑接於機台外側上之捲收馬達、一與捲收馬達連接而同轉之一捲收軸及一連結於機台與捲收馬達間之水平位移動力件；當第一剪斷裝置剪斷一回收物一側上之捆線後，由第二剪斷裝置勾住回收物另一側上之捆線向外拉，再由壓制架樞轉至一壓線位置，而被升降動力件帶動下移，以由壓制架將捆線下壓，接著由第二剪斷裝置剪斷捆線，再由水平位移動力件帶動捲收軸位移至一捲線位置進行旋轉，以將該捆線圈繞於捲收軸上呈圈狀捆線，當捲收軸回復至一鬆線位置後，呈圈狀之捆線便得以脫出加以收集；以達增進安全性及工作效率之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:回收物捆線剪斷暨捲收設備</p>  
        <p type="p">10:機台</p>  
        <p type="p">11:通道</p>  
        <p type="p">20:輸送裝置</p>  
        <p type="p">21:輸送馬達</p>  
        <p type="p">22:轉筒</p>  
        <p type="p">23:輸送帶</p>  
        <p type="p">30:第一剪斷裝置</p>  
        <p type="p">40:第二剪斷裝置</p>  
        <p type="p">50:壓線裝置</p>  
        <p type="p">51:滑軌</p>  
        <p type="p">52:滑座</p>  
        <p type="p">53:壓制架</p>  
        <p type="p">54:壓放動力件</p>  
        <p type="p">55:升降動力件</p>  
        <p type="p">60:捲收裝置</p>  
        <p type="p">61:捲收馬達</p>  
        <p type="p">62:捲收軸</p>  
        <p type="p">621:捲線凸部</p>  
        <p type="p">63:水平位移動力件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="96" publication-number="202612423"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612423.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612423</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133348</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱模組</chinese-title>  
        <english-title>HEAT DISSIPATION MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240906B">H05K7/20</main-classification>  
        <further-classification edition="200601120240906B">H05K7/12</further-classification>  
        <further-classification edition="200601120240906B">H05K7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋岱融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, TAI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱模組包含底座、散熱器以及把手部件。底座包含底板、定位柱、第一延伸部以及第二延伸部。定位柱設置於底板上。第一延伸部以及第二延伸部設置於底板上並與定位柱隔開。第一延伸部以及第二延伸部分別包含第一卡槽以及第二卡槽。散熱器設置於底座上方並包含供定位柱穿過之定位孔。把手部件連接散熱器。把手部件包含把手、旋轉臂、第一閂部以及第二閂部。旋轉臂延伸自把手並樞接散熱器。第一閂部以及第二閂部配置以分別與第一卡槽以及第二卡槽卡合。在旋轉臂相對於散熱器旋轉使得把手朝向散熱器移動時，散熱器朝向底座移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation module includes a base, a heat sink, and a handlebar component. The base includes a bottom plate, a positioning pillar, a first extending portion, and a second extending portion. The positioning pillar is disposed on the bottom plate. The first extending portion and the second extending portion are disposed on the bottom plate and separated from the positioning pillar. The first extending portion and the second extending portion respectively have a first engaging groove and a second engaging groove. The heat sink is disposed over the base and has a positioning hole configured to allow the positioning pillar to pass through. The handlebar component is connected to the heat sink. The handlebar component includes a handlebar, a rotating arm, a first latch portion, and a second latch portion. The rotating arm is extended from the handlebar and pivotally connected to the heat sink. The first latch portion and the second latch portion are respectively configured to be engaged with the first engaging groove and the second engaging groove. The heat sink moves toward the base when the rotating arm rotates relative to the heat sink so that the handlebar moves toward the heat sink.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:散熱模組</p>  
        <p type="p">110:底座</p>  
        <p type="p">112:底板</p>  
        <p type="p">113:定位柱</p>  
        <p type="p">114:第一延伸部</p>  
        <p type="p">115:第二延伸部</p>  
        <p type="p">120:散熱器</p>  
        <p type="p">122:本體</p>  
        <p type="p">123:定位孔</p>  
        <p type="p">124:止擋件</p>  
        <p type="p">126:導熱管</p>  
        <p type="p">130:把手部件</p>  
        <p type="p">132:把手</p>  
        <p type="p">133:旋轉臂</p>  
        <p type="p">134:第一連桿</p>  
        <p type="p">135:第二連桿</p>  
        <p type="p">136:第一閂部</p>  
        <p type="p">137:第二閂部</p>  
        <p type="p">C:發熱元件</p>  
        <p type="p">E:彈性件</p>  
        <p type="p">FX,SW,TS:鎖固件</p>  
        <p type="p">P:電路板</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="97" publication-number="202612362"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612362.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612362</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133349</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線通訊晶片</chinese-title>  
        <english-title>WIRELESS COMMUNICATION CHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241202B">H04W4/80</main-classification>  
        <further-classification edition="200601120241202B">H04B7/06</further-classification>  
        <further-classification edition="200601120241202B">H04B7/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仲君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JON-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無線通訊晶片包含放大級、第一射頻電路及第二射頻電路。放大級用以接收並放大射頻訊號。第一射頻電路支援第一無線傳輸技術並包含混頻器、基頻轉導器、輸出級及開關單元。混頻器用以接收振盪訊號及來自放大級的射頻訊號，並用以根據振盪訊號調整射頻訊號之頻率。開關單元電性連接於基頻轉導器之輸入端與基頻轉導器之輸出端之間。第二射頻電路支援異於第一無線傳輸技術之第二無線傳輸技術，並且第二射頻電路及第一射頻電路共同耦接於放大級之輸出端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless communication chip includes an amplifier stage, a first radio frequency circuit, and a second radio frequency circuit. The amplifier stage is configured to receive and amplify a radio frequency signal. The first radio frequency circuit supports a first wireless transmission technology and includes a mixer, a baseband transconductor, an output stage, and a switch unit. The mixer is configured to receive an oscillation signal and the radio frequency signal from the amplifier stage, and is configured to adjust a frequency of the radio frequency signal according to the oscillation signal. The switch unit is electrically connected between an input terminal of the baseband transconductor and an output terminal of the baseband transconductor. The second radio frequency circuit supports a second wireless transmission technology which is different from the first wireless transmission technology, and the second radio frequency circuit and the first radio frequency circuit are coupled to an output terminal of the amplifier stage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:無線通訊晶片</p>  
        <p type="p">10:第一放大級</p>  
        <p type="p">11:第一射頻電路</p>  
        <p type="p">110:第一混頻器</p>  
        <p type="p">111:基頻轉導器</p>  
        <p type="p">112:第一輸出級</p>  
        <p type="p">113:開關單元</p>  
        <p type="p">12:第二射頻電路</p>  
        <p type="p">CL1,CL2:漏電流</p>  
        <p type="p">LO1:第一振盪訊號</p>  
        <p type="p">Srf:射頻訊號</p>  
        <p type="p">Zin1:第一輸入阻抗</p>  
        <p type="p">Zin2:第二輸入阻抗</p>  
        <p type="p">Zin3:第三輸入阻抗</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="98" publication-number="202612418"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612418.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612418</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133350</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體模組及伺服器系統</chinese-title>  
        <english-title>MEMORY MODULE AND SERVER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250529B">H05K7/02</main-classification>  
        <further-classification edition="200601120250529B">H05K7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋岱融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, TAI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇維漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, WEI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體模組包含底板、內側板、數個儲存裝置、拱門部、第一鎖固件以及第二鎖固件。底板包含彼此相對之第一端以及第二端。內側板於第一方向上延伸。內側板垂直延伸自底板並自第一端延伸至第二端。儲存裝置設置於該底板上。拱門部設置於底板上。拱門部、底板與內側板共同定義走線空間。第一鎖固件設置於拱門部之頂部上。第二鎖固件設置於底板上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory module includes a bottom plate, an inner side plate, a plurality of hard drive modules, an arch portion, a first fixing part, and a second fixing part. The bottom plate has a first end and a second end opposite to each other. The inner side plate is extended in a first direction. The inner side plate is extended perpendicular to the bottom plate and is extended from the first end to the second end. The hard drive modules are disposed on the bottom plate. The arch portion is disposed on the bottom plate. The arch portion, the bottom plate, and the inner side plate jointly define a routing space. The first fixing part is disposed on a top portion of the arch portion. The second fixing part is disposed on the bottom plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體模組</p>  
        <p type="p">110:底板</p>  
        <p type="p">112:內側板</p>  
        <p type="p">115:外側板</p>  
        <p type="p">118:延伸側板</p>  
        <p type="p">120:儲存裝置</p>  
        <p type="p">130:拱門部</p>  
        <p type="p">E1:第一端</p>  
        <p type="p">E2:第二端</p>  
        <p type="p">EC:擴充卡插槽</p>  
        <p type="p">G1:第一滑槽</p>  
        <p type="p">RA:走線空間</p>  
        <p type="p">RS:纜線插槽</p>  
        <p type="p">SC1:第一鎖固件</p>  
        <p type="p">SC2:第二鎖固件</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="99" publication-number="202611785"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611785.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611785</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133356</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於深度學習和大型語言模型的延展實境標準化操作程序處理裝置及其生成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">G06N3/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇萌數位科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白璧珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉慶元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳凱嶸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐立森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹益維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高啟鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟欣達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於深度學習和大型語言模型的延展實境標準化操作程序處理裝置及其生成方法，主要包括︰一延展實境標準化操作程序編輯器；一標準化操作程序制定模組，係設置於該延展實境標準化操作程序編輯器上；一空間指引制定模組，係設置於該延展實境標準化操作程序編輯器上；一深度學習和大型語言模型處理模組，係設置於該延展實境標準化操作程序編輯器上，用以自動化產生標準化操作程序的設定檔，產生的設定檔可提供該標準化操作程序制定模組編輯與修改；以及一延展實境標準化操作程序播放器，係連接該延展實境標準化操作程序編輯器，用以播放該延展實境標準化操作程序編輯器產生的設定檔；而生成方法，其方法包含下列步驟：以下步驟 S 1至步驟 S 4︰S1 文件分割：利用深度學習技術，將輸入的電子化操作說明書分割成不同的區塊，如文字、圖像、表格；S2 語意分析：利用大型語言模型對分割後的文本進行語意分析，理解句子結構、詞彙含義和上下文關係，提取關鍵資訊，如操作步驟、條件判斷、參數設置；S3 步驟總結：利用大型語言模型基於語意分析結果，總結出工業應用執行標準操作程序的細部步驟，包括操作順序、執行條件、輸入輸出； 以及S4 設定檔生成：利用適合產生程式碼的大型語言模型生成符合工業應用標準化格式的JSON，XML或是YAML資料交換格式語法，將總結的步驟資訊轉換為機器可讀的操作流程設定檔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基於深度學習和大型語言模型的延展實境標準化操作程序處理裝置</p>  
        <p type="p">110:延展實境標準化操作程序編輯器</p>  
        <p type="p">10:標準化操作程序制定模組</p>  
        <p type="p">11:任務流程制定單元</p>  
        <p type="p">12:任務步驟制定單元</p>  
        <p type="p">20:空間指引制定模組</p>  
        <p type="p">21:空間識別制定單元</p>  
        <p type="p">22:空間指引制定單元</p>  
        <p type="p">30:延展實境標準化操作程序播放器</p>  
        <p type="p">31:行動裝置模組</p>  
        <p type="p">32:混合實境裝置模組</p>  
        <p type="p">33:電腦裝置模組</p>  
        <p type="p">40:深度學習和大型語言模型處理模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="100" publication-number="202612039"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612039.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612039</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體的微凸塊的高度量測方法</chinese-title>  
        <english-title>SEMICONDUCTOR MICRO BUMP HEIGHT MEASUREMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250529B">H01L21/66</main-classification>  
        <further-classification edition="200601120250529B">G01C11/12</further-classification>  
        <further-classification edition="200601120250529B">G01B11/02</further-classification>  
        <further-classification edition="200601120250529B">H01L23/488</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梭特科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAULTECH TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧彥豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體的微凸塊的高度量測方法，包括：第一影像擷取單元和第二影像擷取單元擷取參考物的頂部影像；第一影像擷取單元擷取待測物的頂部影像，且感測單元感測到工作平台或第一光源和第一影像擷取單元的第一移動距離d；第二影像擷取單元擷取待測物的頂部影像，且感測單元感測到工作平台或第二光源和第二影像擷取單元的第二移動距離D；以及當 &lt;img align="absmiddle" height="25px" width="49px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;時，處理單元判定待測物的高度等於參考物的高度；當 &lt;img align="absmiddle" height="22px" width="49px" file="ed10037.JPG" alt="ed10037.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;時，藉由下列公式計算出待測物的高度： &lt;img align="absmiddle" height="27px" width="198px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;img align="absmiddle" height="25px" width="117px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；當 &lt;img align="absmiddle" height="24px" width="48px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;時，藉由下列公式計算出待測物的高度： &lt;img align="absmiddle" height="27px" width="199px" file="ed10041.JPG" alt="ed10041.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;img align="absmiddle" height="30px" width="118px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor micro bump height measurement method includes the following steps: capturing the top image of the reference object by the first image capture unit and the second image capture unit; capturing the top image of the object to be tested by the first image capture unit ,and sensing a first movement distance d of the work platform or the first light source and the first image capture unit by the sensing unit; capturing the top image of the object to be tested by the second image capture unit, and sensing the second moving distance D of the work platform or the second light source and the second image capture unit by the sensing unit; and when &lt;img align="absmiddle" height="24px" width="52px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, the processing unit determines that the height of the object to be tested is equal to the height of the reference object; when &lt;img align="absmiddle" height="27px" width="51px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, calculating the height of the object to be tested by the following formula: &lt;img align="absmiddle" height="28px" width="199px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;img align="absmiddle" height="32px" width="111px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;; when &lt;img align="absmiddle" height="23px" width="52px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, calculating the height of the object to be tested by the following formula: &lt;img align="absmiddle" height="30px" width="139px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="32px" width="63px" file="ed10034.JPG" alt="ed10034.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;img align="absmiddle" height="30px" width="111px" file="ed10035.JPG" alt="ed10035.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S50:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="101" publication-number="202611666"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611666.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611666</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133365</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>筆記型電腦</chinese-title>  
        <english-title>NOTEBOOK COMPUTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241120B">G06F1/16</main-classification>  
        <further-classification edition="200601120241120B">H05K13/04</further-classification>  
        <further-classification edition="200601120241120B">G06F3/147</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>微星科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRO-STAR INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商微盟電子(昆山)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MSI ELECTRONIC (KUN SHAN) CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘仲恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, CHUNG-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種筆記型電腦，其包含一主機及可拆卸地安裝於所述主機的一快拆式螢幕。所述主機包含一機殼與一樞紐結構。所述樞紐結構安裝於所述機殼且包含有一軸桿所述軸桿的連接段穿出所述機殼。所述快拆式螢幕包含一螢幕本體、相連於所述螢幕本體的一組裝部、及一固定件。所述快拆式螢幕能使所述組裝部嵌設於所述連接段而位於一組裝位置、或是使所述組裝部離開所述連接段而位於一拆分位置。位在所述組裝位置的所述組裝部與所述連接段彼此之間能通過所述固定件而彼此固定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a notebook computer, which includes a host and a quickly disassemble screen that is detachably assembled to the host. The host includes a chassis and a hinge structure. The hinge structure is assembled to the chassis and includes a shaft. A connection segment of the shaft is arranged outside of the chassis. The quickly disassemble screen includes a screen body, an assembling portion connected to the screen body, and a fastener. The quickly disassemble screen is configured to allow the assembling portion to engage with the connection segment for being jointly located at an assembled position, or to allow the assembling portion to separate from the connection segment for being jointly located at a disassembled position. When the assembling portion and the connection segment are at the assembled position, the assembling portion and the connection segment can be fixed to each other through the fastener.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:筆記型電腦</p>  
        <p type="p">1:主機</p>  
        <p type="p">11:機殼</p>  
        <p type="p">111:快拆口</p>  
        <p type="p">12:樞紐結構</p>  
        <p type="p">2:快拆式螢幕</p>  
        <p type="p">21:螢幕本體</p>  
        <p type="p">22:組裝部</p>  
        <p type="p">221:嵌合槽</p>  
        <p type="p">23:固定件</p>  
        <p type="p">R:轉軸線</p>  
        <p type="p">D1:第一方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="102" publication-number="202611888"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611888.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611888</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133373</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示模組及其製造方法</chinese-title>  
        <english-title>DISPLAY MODULE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241007B">G09G3/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴庭君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, TING-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭玄宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHIUAN-TZUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施景耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王錚亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種顯示模組，其包括：基板，其上設置複數發光二極體（LED），其中該些LED具有非平滑之一上表面；第一介質層，位於該基板之上且圍繞該些LED；第二介質層，其中該第一介質層填充於該基板與該第二介質層之間，且該第二介質層之折射率大於該第一介質層；以及複數濾色片，位於該第二介質層相反於該第一介質層之一側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display module including a substrate on which a plurality of light-emitting diodes (LEDs) are arranged, wherein the LEDs have a non-smooth upper surface; a first dielectric layer located on the substrate and surrounding the LEDs; a second dielectric layer, wherein the first dielectric layer is filled between the substrate and the second dielectric layer, and the refractive index of the second dielectric layer is greater than the first dielectric layer; and a plurality of color filters located on a side of the second dielectric layer opposite to the first dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:顯示模組</p>  
        <p type="p">201:LED</p>  
        <p type="p">202:基板</p>  
        <p type="p">203:第一介質層</p>  
        <p type="p">205:第二介質層</p>  
        <p type="p">207:濾色片</p>  
        <p type="p">209:透光層</p>  
        <p type="p">211:遮光壁</p>  
        <p type="p">213:上表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="103" publication-number="202610928"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610928.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610928</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133377</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微機電裝置</chinese-title>  
        <english-title>MICRO-ELECTROMECHANICAL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241114B">B81B7/02</main-classification>  
        <further-classification edition="200601120241114B">B81B3/00</further-classification>  
        <further-classification edition="200601120241114B">G01K7/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈺太科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZILLTEK TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳振頤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯智璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, CHIH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣鎧宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, KAI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種微機電裝置。微機電裝置包括一基板、一介電層、兩個導電錨點件、一微機電結構及至少一彈性熱敏電阻。基板具有一高度方向、及垂直高度方向的一延伸方向。介電層設置於基板上。兩個導電錨點件分別設置於介電層上，並於延伸方向上彼此間隔地配置。彈性熱敏電阻的一端連接其中一導電錨點件，彈性熱敏電阻的另一端連接微機電結構的其中一端，微機電結構的另一端直接或間接地連接另一個導電錨點件。微機電結構通過彈性熱敏電阻間隔地配置於基板上，以形成於高度方向上的一預定間隙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A micro-electromechanical device is provided. The micro-electromechanical device includes a substrate, a dielectric layer, two conductive anchor points, a MEMS structure, and at least one thermistor. The substrate has a height direction and an extension direction perpendicular to the height direction. The dielectric layer is arranged on the substrate. The two conductive anchor points are respectively arranged on the dielectric layer and are spaced apart from each other in the extension direction. One end of the thermistor is connected to one of the conductive anchor points, while the other end of the thermistor is connected to one end of the MEMS structure. The other end of the MEMS structure is directly or indirectly connected to the other conductive anchor point. The MEMS structure is spaced from the substrate through the thermistor, forming a predefined gap in the height direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:微機電裝置</p>  
        <p type="p">1:基板</p>  
        <p type="p">M11:寬側面</p>  
        <p type="p">M12:環側面</p>  
        <p type="p">2:介電層</p>  
        <p type="p">21:絕緣部</p>  
        <p type="p">3:導電錨點件</p>  
        <p type="p">4:微機電結構</p>  
        <p type="p">41:耦合樑</p>  
        <p type="p">42:接點</p>  
        <p type="p">43:耦合環</p>  
        <p type="p">5:彈性熱敏電阻</p>  
        <p type="p">51:固定部位</p>  
        <p type="p">52:彈性部位</p>  
        <p type="p">D2:延伸方向</p>  
        <p type="p">P:中心線</p>  
        <p type="p">PL:預定長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="104" publication-number="202611384"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611384.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611384</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133392</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種智能鎖控制系統及其智能鎖</chinese-title>  
        <english-title>AN INTELLIGENT LOCK CONTROL SYSTEM AND INTELLIGENT LOCK THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">E05B47/06</main-classification>  
        <further-classification edition="201301120241231B">G06F21/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>禾聯碩股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡柏毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種智能鎖控制系統，其包括管理模組、管理端和智能鎖，管理模組用於根據身分資訊登入管理端，且根據管理端傳輸的管理規則和金流資訊，該管理模組驅使上鎖值計算模組基於其管理規則計算上鎖值，並當上鎖值高於上鎖閾值時，生成上鎖訊號，以及當金流確認模組獲取金流資訊時，生成金流確認訊號，並將金流確認訊號傳輸予上鎖值計算模組，若上鎖訊號生成時，管理模組則將上鎖訊號傳輸予智能鎖，使得智能鎖根據上鎖訊號執行鎖固門體的動作。藉此，智能鎖控制系統即可便於管理端管理房源，以自動根據管理規則管理金流和房源的出租狀況。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates an intelligent lock control system that includes a management module, a management end, and an intelligent lock, the management module logs in to the management end based on an identification, and receives a management regulation and a financial information from the management end, the management module drives a locking value calculation module to calculate a locking value based on the management regulation and generates a locking signal when the locking value is higher than a locking threshold, the management module drives a financial confirmation information generates a financial confirmation signal when a financial information is received, and transmits the financial information to the locking value calculation module. The management module transmits the locking signal when generated leads to the intelligent lock executing a movement of locking a door. The convenience of house resources management is provided by the intelligent lock control system and automatically managing the financial and rental status of the house resources according to the management regulation thereby.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:管理模組</p>  
        <p type="p">110:上鎖值計算模組</p>  
        <p type="p">111:管理規則</p>  
        <p type="p">112:計算器</p>  
        <p type="p">113:上鎖值</p>  
        <p type="p">114:上鎖閾值</p>  
        <p type="p">115:上鎖訊號</p>  
        <p type="p">116:強制上鎖機制</p>  
        <p type="p">1161:緊急上鎖訊號</p>  
        <p type="p">1162:緊急訊號</p>  
        <p type="p">120:金流確認模組</p>  
        <p type="p">121:金流資訊</p>  
        <p type="p">122:金流確認訊號</p>  
        <p type="p">130:第一無線傳輸模組</p>  
        <p type="p">200:管理端</p>  
        <p type="p">300:智能鎖</p>  
        <p type="p">310:鎖體</p>  
        <p type="p">320:第二無線傳輸模組</p>  
        <p type="p">400:客戶端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="105" publication-number="202612113"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612113.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612113</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133395</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構及其製造方法</chinese-title>  
        <english-title>PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240912B">H01L23/28</main-classification>  
        <further-classification edition="200601120240912B">H01L23/373</further-classification>  
        <further-classification edition="200601120240912B">H01L21/56</further-classification>  
        <further-classification edition="200601120240912B">H01L21/603</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聖崴科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUREWAY TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡幸樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HSING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊東漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫崧桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, SONG-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡志欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐明志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, MING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種封裝結構。所述封裝結構包括基板、設置在基板上的晶片、設置在晶片上方且具有面向晶片的一表面的散熱器、設置在散熱器的表面上的阻擋層、設置在基板與阻擋層之間的熱界面材料、環繞熱界面材料的框膠、以及設置在晶片與阻擋層之間的至少一暫態金屬層，且熱界面材料溶入有暫態金屬層之金屬元素。本揭露更提供一種封裝結構的形成方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package structure includes: a substrate, a chip disposed on the substrate, a heat sink having a surface facing the chip disposed on the chip, a barrier layer disposed on the surface of the heat sink, a thermal interface material (TIM) disposed between the substrate and the barrier layer, a dam surrounding the TIM, and at least one transient metal layer disposed between the chip and the barrier layer. The TIM incorporates a metallic element from the transient metal layer. A method for manufacturing the package structure is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝結構</p>  
        <p type="p">102:基板</p>  
        <p type="p">104:晶片</p>  
        <p type="p">104B:背側表面</p>  
        <p type="p">106:導電凸塊</p>  
        <p type="p">108:底部填充劑</p>  
        <p type="p">124:暫態金屬層</p>  
        <p type="p">126’:框膠</p>  
        <p type="p">126B:底表面</p>  
        <p type="p">126T:頂表面</p>  
        <p type="p">202:散熱器</p>  
        <p type="p">2022:凹槽</p>  
        <p type="p">202S:表面</p>  
        <p type="p">222:阻擋層</p>  
        <p type="p">222S:表面</p>  
        <p type="p">224:暫態金屬層</p>  
        <p type="p">304:熱界面材料</p>  
        <p type="p">304S:側壁</p>  
        <p type="p">402’:黏膠</p>  
        <p type="p">406:加熱製程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="106" publication-number="202612543"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612543.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612543</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測模組</chinese-title>  
        <english-title>SENSING MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10F77/40</main-classification>  
        <further-classification edition="202501120250102B">H10F77/70</further-classification>  
        <further-classification edition="200601120250102B">G01L1/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中強光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORETRONIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許懷忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUAI-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臧志仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSANG, CHIH-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳家驊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘柏志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, BO-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳上炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHANG-HSUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種感測模組包括感光電路板、光源結構、調光片及遮光片。感光電路板設有多個感光元件。光源結構設置在各個感光元件的感光面的一側。調光片設置在感光電路板與光源結構之間，且包括基板與多個光學微結構。這些光學微結構設置在基板朝向光源結構的基板表面上。遮光片設置在光源結構背對調光片的一側。遮光片適於受外力並經由光源結構按壓調光片，使多個光學微結構產生形變。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sensing module including a photosensitive circuit board, a light source structure, a light manipulation sheet and a light shielding sheet is provided. The photosensitive circuit board is provided with a plurality of photosensitive devices. The light source structure is disposed on one side of a photosensitive surface of each of the photosensitive devices. The light manipulation sheet is disposed between the photosensitive circuit board and the light source structure, and includes a substrate and a plurality of optical microstructures. The optical microstructures are disposed on a substrate surface of the substrate facing the light source structure. The light shielding sheet is disposed on one side of the light source structure facing away from the light manipulation sheet. The light shielding sheet is adapted to receive external force and press the light manipulation sheet through the light source structure to deform the plurality of optical microstructures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:感測模組</p>  
        <p type="p">100:感光電路板</p>  
        <p type="p">101:電路板</p>  
        <p type="p">105:感光元件</p>  
        <p type="p">105s:感光面</p>  
        <p type="p">120:調光片</p>  
        <p type="p">121:基板</p>  
        <p type="p">121s:基板表面</p>  
        <p type="p">125:光學微結構</p>  
        <p type="p">140:光源結構</p>  
        <p type="p">141:柔性導光板</p>  
        <p type="p">141is:入光面</p>  
        <p type="p">141s1:第一表面</p>  
        <p type="p">141s2:第二表面</p>  
        <p type="p">143:光源</p>  
        <p type="p">145:散射微結構</p>  
        <p type="p">160:遮光片</p>  
        <p type="p">161:基材</p>  
        <p type="p">165:反射層</p>  
        <p type="p">d1:距離</p>  
        <p type="p">L:光線</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="107" publication-number="202610929"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610929.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610929</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133403</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微機電陣列</chinese-title>  
        <english-title>MICRO-ELECTROMECHANICAL SYSTEM ARRAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B81B7/04</main-classification>  
        <further-classification edition="200601120241007B">B81B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈺太科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZILLTEK TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳振頤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯智璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, CHIH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣鎧宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, KAI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種微機電陣列。微機電陣列包括一基板、多個第一呼吸環、多個第二呼吸環、以及多個電極。基板包含多個錨點件。多個第一呼吸環包含多個第一環形部及多個第一耦合段。多個第一呼吸環通過多個錨點件與基板間隔地配置。多個第一耦合段連接多個第一環形部並共同地具有一節點。各第二呼吸環包含多個第二環形部及多個第二耦合段。多個第二環形部通過多個第二耦合段連接多個第一環形部。各第二環形部與各第一環形部的相位相反。多個電極設置於基板上。各電極被任一個第一環形部、或第二環形部圍繞且不接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A micro-electromechanical system array is provided. The micro-electromechanical system array includes a substrate, multiple first resonating rings, multiple second resonating rings, and multiple electrodes. The substrate includes multiple anchor points. The multiple first resonating rings include multiple first annular sections and multiple first coupling segments. The first breathing rings are arranged spaced apart from the substrate through the anchor points. The first coupling segments connect the first annular portions and jointly have a node. The multiple second resonating rings include multiple second annular sections and multiple second coupling segments. The multiple second annular sections are connected to the multiple first annular sections via the multiple second coupling segments. Each of the second annular sections has an opposite phase to each of the first annular sections . The multiple electrodes are arranged on the substrate. Each electrode is surrounded by, but not in contact with, either a first annular section or a second annular section.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:微機電陣列</p>  
        <p type="p">1:基板</p>  
        <p type="p">2:第一呼吸環</p>  
        <p type="p">21:第一環形部</p>  
        <p type="p">22:第一耦合段</p>  
        <p type="p">3:第二呼吸環</p>  
        <p type="p">31:第二環形部</p>  
        <p type="p">32:第二耦合段</p>  
        <p type="p">4:電極</p>  
        <p type="p">AP:節點</p>  
        <p type="p">AH:錨點件</p>  
        <p type="p">SA:對稱軸</p>  
        <p type="p">L22、L32:長度</p>  
        <p type="p">θ:預定角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="108" publication-number="202610752"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610752.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610752</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133409</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背板鑽孔清潔之視覺檢測與雷射加工系統及其方法</chinese-title>  
        <english-title>VISUAL INSPECTION AND LASER PROCESSING SYSTEM FOR BACKDRILL CLEANING AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B23K26/16</main-classification>  
        <further-classification edition="201401120241007B">B23K26/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商台本機械有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TCTM(HONG KONG)LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶嘉莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, CHIA-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁博鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, BO-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種背板鑽孔清潔之視覺檢測與雷射加工系統包括中央控制裝置、第一控制手臂、線掃描裝置、第一視覺檢測裝置、第二控制手臂、第二視覺檢測裝置與雷射加工裝置，其皆連接且受控於該中央控制裝置。透過初步判斷程序、背鑽穿孔率檢測程序、雷射加工之程序與背鑽偏心量檢測程序能夠高效率判斷篩選掉不合格基板，並且透過視覺檢測來有效進行精準的雷射清潔，以提升整體作業流程效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A visual inspection and laser processing system for backdrill cleaning includes a central control device, a first control arm, a line scanning device, a first visual inspection device, a second control arm, a second visual inspection device, and a laser processing device, all of which are connected to the central control device. Through the preliminary determination process, backdrill perforation detection process, laser processing process and backdrill eccentricity detection process, it is possible to efficiently determine and screen out unqualified substrates, as well as to carry out precise laser cleaning effectively through visual inspection and to enhance the overall efficiency of workflow.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:背板鑽孔清潔之視覺檢測與雷射加工系統</p>  
        <p type="p">101:上料平台</p>  
        <p type="p">102:不合格平台</p>  
        <p type="p">103:下料平台</p>  
        <p type="p">110:中央控制裝置</p>  
        <p type="p">120:第一控制手臂</p>  
        <p type="p">130:線掃描裝置</p>  
        <p type="p">140:第一視覺檢測裝置</p>  
        <p type="p">150:第二控制手臂</p>  
        <p type="p">160:第二視覺檢測裝置</p>  
        <p type="p">170:雷射加工裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="109" publication-number="202611754"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611754.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611754</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133418</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用程式服務系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G06F17/40</main-classification>  
        <further-classification edition="201301120241202B">G06F3/048</further-classification>  
        <further-classification edition="200601120241202B">G06F15/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>第一商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIRST COMMERCIAL BANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈家宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白仁豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種應用程式服務系統，適用於與一客戶端電子裝置通訊，該應用程式服務系統用於：接收一來自該客戶端電子裝置的輸入訊息，並利用一自然語言處理模型對該輸入訊息進行語意分析，以產生一對應於該輸入訊息的語意分析結果；從多筆功能特徵資料中選出與該語意分析結果之匹配程度最高的其中一筆關聯功能特徵資料，並傳送一對應於該關聯功能特徵資料的功能配置建議至該客戶端電子裝置；在接收到一來自該客戶端電子裝置且對應於該功能配置建議的同意通知之後，將對應該關聯功能特徵資料的一介面元件加入於一使用者介面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:應用程式服務系統</p>  
        <p type="p">1:處理單元</p>  
        <p type="p">2:儲存單元</p>  
        <p type="p">200:客戶端電子裝置</p>  
        <p type="p">D1:功能特徵資料</p>  
        <p type="p">D2:介面配置資料</p>  
        <p type="p">D3:行為紀錄資料</p>  
        <p type="p">D4:元件功能資料</p>  
        <p type="p">M1:自然語言處理模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="110" publication-number="202610589"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610589.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610589</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133425</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可量測心電訊號之卡片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">A61B5/0245</main-classification>  
        <further-classification edition="202101120241105B">A61B5/318</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>爾尼卡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANICA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭孟仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, MENG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種可量測心電訊號之卡片，其包含卡片本體、控制單元、電控單元、傳導單元、心電訊號處理單元、儲存單元、連結單元及光源處理單元。藉此，可讓待測者以雙手之手指同時接觸傳導單元，使待測者之心臟、待測者之雙臂、傳導單元與心電訊號處理單元之間形成閉合電路，藉以進行心律之量測，而量測後產生心電圖資料儲存於儲存單元，且由讀取設備經連結單元讀取心電圖資料，並於量測過程與量測後產生相關訊號至光源處理單元以進行光源演示，而達到提升量測準確性、便利性以及增加量測效率之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:可量測心電訊號之卡片</p>  
        <p type="p">11:卡片本體</p>  
        <p type="p">111:導光框</p>  
        <p type="p">112:遮光面板</p>  
        <p type="p">113:遮光背板</p>  
        <p type="p">114:電路載板</p>  
        <p type="p">12:控制單元</p>  
        <p type="p">13:電控單元</p>  
        <p type="p">131:開關部</p>  
        <p type="p">132:電池</p>  
        <p type="p">133:連接器</p>  
        <p type="p">14:傳導單元</p>  
        <p type="p">141:第一不鏽鋼電極</p>  
        <p type="p">142:第二不鏽鋼電極</p>  
        <p type="p">15:心電訊號處理單元</p>  
        <p type="p">16:儲存單元</p>  
        <p type="p">17:連結單元</p>  
        <p type="p">18:光源處理單元</p>  
        <p type="p">181:光控模組</p>  
        <p type="p">182:發光模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="111" publication-number="202610619"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610619.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610619</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133431</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗酸膠囊殼及抗酸膠囊</chinese-title>  
        <english-title>ANTI-ACID CAPSULE SHELL AND ANTI-ACID CAPSULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240924B">A61K9/48</main-classification>  
        <further-classification edition="200601120240924B">A61K47/36</further-classification>  
        <further-classification edition="200601120240924B">A61P1/14</further-classification>  
        <further-classification edition="200601120240924B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>星歐光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN MEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏村</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-TSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖崇淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHUNG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施攸怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯品立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, PIN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧鈞鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種抗酸膠囊殼，包含一第一膠囊殼以及一第二膠囊殼。第一膠囊殼具有一開口端。第二膠囊殼對應連接第一膠囊殼，且第二膠囊殼具有一開口端。抗酸膠囊殼的組成材料包含一第一耐酸材料及一第二耐酸材料。當抗酸膠囊殼滿足特定條件時，可有效提升抗酸膠囊殼的抗酸能力，以延緩抗酸膠囊殼被胃酸溶解崩散的速度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an anti-acid capsule shell includes a first capsule shell and a second capsule shell. The first capsule shell has an open end. The second capsule shell is correspondingly connected to the first capsule shell, and the second capsule shell has an open end. A composition material of the anti-acid capsule shell includes a first anti-acid material and a second anti-acid material. When the anti-acid capsule shell satisfies specific conditions, the anti-acid ability of the anti-acid capsule shell can be effectively enhanced, and the rates of degradation and disintegration of the anti-acid capsule shell by gastric acid can be slowed down.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:抗酸膠囊殼</p>  
        <p type="p">110:第一膠囊殼</p>  
        <p type="p">111:開口端</p>  
        <p type="p">120:第二膠囊殼</p>  
        <p type="p">121:開口端</p>  
        <p type="p">130:扣合環結構</p>  
        <p type="p">131:第一扣合環</p>  
        <p type="p">132:第二扣合環</p>  
        <p type="p">L:抗酸膠囊殼的最大長度</p>  
        <p type="p">L1:第一膠囊殼的最大長度</p>  
        <p type="p">L2:第二膠囊殼的最大長度</p>  
        <p type="p">Lo:重合區域的長度</p>  
        <p type="p">Lc:扣合環結構的最大寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="112" publication-number="202610539"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610539.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610539</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133433</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>養殖系統</chinese-title>  
        <english-title>AN AQUACULTURE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120240909B">A01K61/54</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日東科技漁業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN EAST AQUACULTURE TECHNOLOGY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, GUO LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智為</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李威聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種養殖系統，其包括：一養殖單元；及一造流裝置，設置於該養殖單元之一側，以使該造流裝置所產生之水流朝向該養殖單元流動。一種養殖方法，其包含：(S11) 提供一串連件設置於一養殖池，該串連件穿設於一第一養殖單元，並放入一造流裝置於該養殖池內，使其產生之水流可流經該第一養殖單元；(S12) 將貝類、螺類、或任意其組合投放於該第一養殖單元內使其自然生長一至三個月後移至一第二養殖單元；(S13) 於該第二養殖單元內使其自然生長一至兩個月後移至一第三養殖單元；及(S14) 於該些第三養殖單元內使其自然生長一至兩個月後即可收成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An aquaculture system comprising: an aquaculture unit; and a flow-making device arranged on one side of the aquaculture unit so that a water flow generated by the flow-making device flows toward the aquaculture unit. An aquaculture method comprising: (S11) providing a series connection member arranged in an aquaculture pond, wherein the series connection member is worn set in a first aquaculture unit, and a flow-making device is placed in the aquaculture pond so as to generate a water flow flowing through the first aquaculture unit; (S12) placing shellfish, snails, or any combination thereof in the first aquaculture unit and allowing the shellfish, the Gastropoda, or any combination to grow naturally for one to three months before being moved to a second aquaculture unit; (S13) allowing the shellfish, the Gastropoda or any combination thereof to grow naturally in the second aquaculture unit for one to two months before being moved to a third aquaculture unit; and (S14) allowing the shellfish, the Gastropoda, or any combination to grow naturally in the third aquaculture units for one to two months until being harvested.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:養殖池</p>  
        <p type="p">2:養殖單元</p>  
        <p type="p">3:串連件</p>  
        <p type="p">4:造流裝置</p>  
        <p type="p">K:養殖系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="113" publication-number="202610856"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610856.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610856</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133434</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動車直流充電系統</chinese-title>  
        <english-title>ELECTRIC VEHICLE DIRECT CURRENT CHARGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241114B">B60L53/10</main-classification>  
        <further-classification edition="201901120241114B">B60L53/14</further-classification>  
        <further-classification edition="201901120241114B">B60L53/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭仲結</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHUNG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江宗憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, ZONG-SIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯建名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, JIAN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭庭中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, TING-ZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電動車直流充電系統，包括：複數個並接的功率轉換群的組合、至少一充電輸出端口、以及一開關切換矩陣。該複數個並接的功率轉換群的組合用以提供直流電力。該至少一充電輸出端口至少與母線的其中之一可開關地電性連接。該開關切換矩陣包括複數第一並接線、複數第二並接線、複數第一並接開關以及複數第二並接開關，每一第一並接線與第一並接開關可開關地且不重複地電性連接任兩條母線，該第二並接線與該第二並接開關可開關地電性連接任兩不同功率轉換群的組合的母線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electric vehicle direct current charging system includes: a plurality of combinations of parallel power conversion groups, at least one charging output port, and a switch matrix. The plurality of combinations of parallel power conversion groups is used to provide DC power. The at least one charging output port is switched and electrically connected to at least one of busbars. The switch matrix includes a plurality of first parallel connections, a plurality of second parallel connections, a plurality of first parallel switches, and a plurality of second parallel switches. Each first parallel connection combined with the parallel switch can be switched and electrically connected any two busbars without repetition. The second parallel connections combined with the second parallel switches are switched and electrically connected to busbars of any two combination of power conversion groups respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電動車直流充電系統</p>  
        <p type="p">10:功率轉換群的組合</p>  
        <p type="p">11,G1,G2,G3,G4:功率轉換模塊群</p>  
        <p type="p">110:功率轉換模塊</p>  
        <p type="p">12:母線</p>  
        <p type="p">20,C1,C2,C3,C4:充電輸出端口</p>  
        <p type="p">30:開關切換矩陣</p>  
        <p type="p">311:第一並接線</p>  
        <p type="p">312:第二並接線</p>  
        <p type="p">321,K1,K2:第一並接開關</p>  
        <p type="p">322,K3,K4:第二並接開關</p>  
        <p type="p">323,K5,K6,K7,K8:第三開關</p>  
        <p type="p">P:位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="114" publication-number="202611589"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611589.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611589</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133435</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>攝影光學鏡頭組、取像裝置及電子裝置</chinese-title>  
        <english-title>PHOTOGRAPHING OPTICAL LENS ASSEMBLY, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241114B">G02B11/32</main-classification>  
        <further-classification edition="200601120241114B">G02B3/00</further-classification>  
        <further-classification edition="202101120241114B">G02B7/02</further-classification>  
        <further-classification edition="200601120241114B">G02B13/00</further-classification>  
        <further-classification edition="202101120241114B">G03B17/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN PRECISION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王勁森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIN SEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施語函</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YU-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種攝影光學鏡頭組，包含六個光學元件。六個光學元件沿光路由物側至像側依序為第一光學元件、第二光學元件、第三光學元件、第四光學元件、第五光學元件與第六光學元件。六個光學元件分別具有朝向物側方向的物側表面與朝向像側方向的像側表面。第一光學元件具有正屈折力。第一光學元件物側表面於近光軸處為凸面。第四光學元件具有正屈折力。第四光學元件物側表面於近光軸處為凸面。當滿足特定條件時，攝影光學鏡頭組能同時滿足望遠功能、微型化和高成像品質的需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photographing optical lens assembly includes six optical elements which are, in order from an object side to an image side along an optical path: a first optical element, a second optical element, a third optical element, a fourth optical element, a fifth optical element and a sixth optical element. Each of the six optical elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The first optical element has positive refractive power. The object-side surface of the first optical element is convex in a paraxial region thereof. The fourth optical element has positive refractive power. The object-side surface of the fourth optical element is convex in a paraxial region thereof. When specific conditions are satisfied, the requirements of telephoto feature, compact size and high image quality can be met by the photographing optical lens assembly, simultaneously.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:取像裝置</p>  
        <p type="p">S1,S2:光闌</p>  
        <p type="p">E1:第一光學元件</p>  
        <p type="p">E2:第二光學元件</p>  
        <p type="p">E3:第三光學元件</p>  
        <p type="p">E4:第四光學元件</p>  
        <p type="p">E5:第五光學元件</p>  
        <p type="p">E6:第六光學元件</p>  
        <p type="p">E7:濾光元件</p>  
        <p type="p">IMG:成像面</p>  
        <p type="p">IS:電子感光元件</p>  
        <p type="p">ImgH:攝影光學鏡頭組的最大成像高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="115" publication-number="202611301"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611301.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611301</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自釩鉬廢觸媒中回收金屬的方法</chinese-title>  
        <english-title>METHOD FOR RECOVERING METALS FROM VANADIUM/MOLYBDENUM-CONTAINING WASTE CATALYSTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240911B">C22B7/00</main-classification>  
        <further-classification edition="200601120240911B">C22B34/22</further-classification>  
        <further-classification edition="200601120240911B">C22B34/34</further-classification>  
        <further-classification edition="200601120240911B">C22B21/00</further-classification>  
        <further-classification edition="200601120240911B">C22B26/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虹京金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG JING METAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫玉龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YU-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-ZHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉永浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YUNG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自釩鉬廢觸媒中回收金屬的方法，用以解決習知方法無法自該釩鉬廢觸媒中回收鋁的問題。該自釩鉬廢觸媒回收金屬的方法包含：混合一釩鉬廢觸媒及一鹼性鈉鹽，得一混料，每公斤的釩鉬廢觸媒係混合0.5～1公斤的鹼性鈉鹽；使該混料進行一焙燒反應，得一釩鉬熟料；將該釩鉬熟料浸泡於熱水中，以浸出一釩鉬鋁鈉浸出液；及將二氧化碳氣體通入該釩鉬鋁鈉浸出液中，以得一氫氧化鋁沉澱物及一釩鉬鈉貴液。藉此可以回收呈現氫氧化鋁形式的鋁。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for recovering metals from vanadium/molybdenum-containing waste catalysts is used to solve the problem that aluminum cannot be recovered from the vanadium/molybdenum-containing waste catalysts in the conventional method. The method for recovering metals from the vanadium/molybdenum-containing waste catalysts comprises: forming a mixture by mixing the vanadium/molybdenum-containing waste catalysts and an alkaline sodium salt; performing a roasting reaction to the mixture to obtain a vanadium/molybdenum-containing clinker; soaking the vanadium/molybdenum-containing clinker into hot water to obtain a vanadium/molybdenum/aluminum/sodium-containing leach; and introducing carbon dioxide to the vanadium/molybdenum/aluminum/sodium-containing leach to obtain a precipitation of aluminum hydroxide and a vanadium/molybdenum/sodium-containing solution. Accordingly, aluminum in the vanadium/molybdenum-containing waste catalysts can be recovered in the form of aluminum hydroxide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:混料步驟</p>  
        <p type="p">S2:焙燒步驟</p>  
        <p type="p">S3:浸出步驟</p>  
        <p type="p">S4:酸化步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="116" publication-number="202611797"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611797.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611797</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133438</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於週期性及不規則事件進行優化的預測系統</chinese-title>  
        <english-title>PREDICTION SYSTEM OPTIMIZED FOR PERIODIC AND IRREGULAR EVENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250102B">G06Q10/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高嘉彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, CHIA-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高嘉彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, CHIA-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豫宛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基於非週期性及不規則事件進行優化的預測系統，由電腦載入儲存裝置後執行程式，包括：預處理模組、數字化模組、以及預測結果生成模組。預處理模組基於缺失值填補該原始資料。數字化模組將原始資料轉換成數字形式，將原始資料中的時間戳章資訊進行資料分箱以獲得日期時間分箱資料，並將其它資料成分進行快速傅立葉變換以獲得FFT轉換資料與原始資料及日期時間分箱資料合併以獲得多樣資料集。預測結果生成模組由多樣資料集的特徵獲得特徵子集，疊代執行遺傳演算法及輕量化梯度提升演算法評估後代特徵子集的適應度決定預測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a prediction system optimized for periodic and irregular events, which is executed by a computer after being loaded into a storage device. The system includes: a preprocessing module, a digitization module, and a prediction result generation module. The preprocessing module fills in missing values in the raw data. The digitization module converts the raw data into a digital format, bins the datetime components of the raw data to obtain datetime binned data, and applies a Fast Fourier Transform (FFT) to other data components to obtain FFT-transformed data. These are then combined with the raw data and datetime binned data to create a diverse dataset. The prediction result generation module selects feature subsets from the diverse dataset, iteratively executes a genetic algorithm and a lightweight gradient boosting algorithm to evaluate the fitness of the offspring feature subsets, and determines the prediction result based on the evaluation. &lt;br/&gt;​</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:預測系統</p>  
        <p type="p">10:電腦</p>  
        <p type="p">20:儲存裝置</p>  
        <p type="p">M1:預處理模組</p>  
        <p type="p">M2:數字化模組</p>  
        <p type="p">M3:預測結果生成模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="117" publication-number="202611798"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611798.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611798</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133441</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>泵浦的軸封壽命預測系統及方法</chinese-title>  
        <english-title>PUMP SHAFT SEAL LIFE PREDICTION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241007B">G06Q10/04</main-classification>  
        <further-classification edition="202001120241007B">G06F30/17</further-classification>  
        <further-classification edition="202301120241007B">G06F18/24</further-classification>  
        <further-classification edition="202001320241007B">G06F119/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虞哲弦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHE-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林金龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIN-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱繼贊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHI-TSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉湘羭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, HSIANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種泵浦的軸封壽命預測方法之運作包含以下步驟：取得泵浦的複數個時域振動幅值；依據複數個時域振動幅值建立時域振動模型；將泵浦運作的複數個參數輸入時域振動模型，以轉換為複數個傅立葉頻域模型，複數個參數包括泵浦的轉速及葉片數；基於複數個傅立葉頻域模型，以提取泵浦的複數個特徵幅值；將複數個特徵幅值互相組合後進行降維處理，產生複數個特徵組合；基於複數個特徵組合，建立壽命模型，並儲存壽命模型於泵浦的軸封壽命預測系統；以及依據壽命模型設立至少一門檻值，並將至少一門檻值與複數個特徵幅值比較而判斷泵浦的軸封壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A life prediction method for shaft seal of pump includes following steps: obtaining a plurality of time domain vibration magnitudes of a pump; establishing a time domain vibration model according to the plurality of time domain vibration magnitudes; inputting a plurality of parameters of the pump under operation into the time domain vibration model to convert into a plurality of Fourier frequency domain models The plurality of parameters include a rotation speed and a number of blades of the pump; extracting a plurality of characteristic amplitudes of the pump according to the plurality of Fourier frequency domain models, combining the plurality of characteristic amplitudes with each other and perform a dimensionality reduction process on the plurality of characteristic amplitudes to generate a plurality of characteristic combinations; establishing a life model according to the plurality of characteristic combinations to store the life model in a pump shaft seal life prediction system; and establishing at least one threshold value according to the life model to compare the at least one threshold value with plurality of characteristic amplitudes to determine a life of a shaft seal of the pump.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:泵浦的軸封壽命預測方法</p>  
        <p type="p">S1~S7:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="118" publication-number="202611740"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611740.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611740</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133443</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>匯流排系統</chinese-title>  
        <english-title>BUS SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G06F13/38</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃之鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種匯流排系統，包括：一主控元件；一增強序列週邊設備介面匯流排；以及複數從屬元件，經由增強序列週邊設備介面匯流排電性連接於主控元件；其中從屬元件各自包括： 一裝置分配單元，儲存有一裝置基礎號碼；以及複數裝置，各自具有一裝置號碼；其中從屬元件，對於裝置之每一者分別產生一新裝置號碼，且新裝置號碼為從屬元件的裝置基礎號碼加上裝置號碼而得；其中在經由主控元件得到一存取號碼之後，從屬元件各自比對存取號碼是否等於新裝置號碼之任一者，且使主控元件存取具有與存取號碼相同之新裝置號碼的裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides a bus system, including: a master component; an enhanced serial peripheral interface bus; and multiple slave components electrically connected to the master component via the enhanced serial peripheral interface bus; wherein each slave component includes: a device allocation unit storing a device base number; and multiple devices, each having a device number; wherein the slave component generates a new device number for each of the devices, and the new device number is obtained by adding the device number to the device base number of the slave component; wherein after obtaining an access number via the master component, each slave component compares whether the access number is equal to any of the new device numbers, and allows the master component to access the device with the new device number that matches the access number.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:匯流排系統</p>  
        <p type="p">10:主控元件</p>  
        <p type="p">12:匯流排</p>  
        <p type="p">14_1-14_n:從屬元件</p>  
        <p type="p">142:系統設定檔</p>  
        <p type="p">144_1-144_n:裝置分配單元</p>  
        <p type="p">146_11-146_nm:裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="119" publication-number="202612279"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612279.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612279</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133444</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>逐次逼近類比數位轉換器及其校正方法</chinese-title>  
        <english-title>SUCCESSIVE-APPROXIMATION REGISTER ANALOG-TO-DIGITAL CONVERTER AND CALIBRATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240909B">H03M1/38</main-classification>  
        <further-classification edition="200601120240909B">H03M1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂宜靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝仲銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHUNG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種逐次逼近類比數位轉換器，包括第一數位類比轉換器、比較器、逐次逼近控制器以及校正控制器。第一數位類比轉換器基於輸入電壓以及數位碼而產生差值電壓。數位碼係對應至輸入電壓以及差值電壓之總和。當差值電壓超過臨限值時，比較器將比較信號設為致能狀態。逐次逼近控制器基於比較信號調整數位碼，使得數位碼對應輸入電壓。校正控制器執行校正程序，用以決定數位碼發生改變至比較信號自失能狀態轉變至致能狀態所需之延遲時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A successive-approximation register analog-to-digital converter includes a first digital-to-analog converter, a comparator, a successive-approximation controller, and a calibration controller. The first digital-to-analog converter generates a difference voltage based on an input voltage and a digital code. The digital code corresponds to a sum of the input voltage and the difference voltage. When the difference voltage exceeds a threshold, the comparator sets a comparison signal to an enable state. The successive-approximation controller adjusts the digital code based on the comparison signal, so that the digital code corresponds to the input voltage. The calibration controller executes a calibration process to determine a delay time from the digital code changing to the comparison signal switching from a disable state to the enable state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:逐次逼近類比數位轉換器</p>  
        <p type="p">110:第一數位類比轉換器</p>  
        <p type="p">120:比較器</p>  
        <p type="p">130:逐次逼近控制器</p>  
        <p type="p">140:校正控制器</p>  
        <p type="p">510:第二數位類比轉換器</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">DC:數位碼</p>  
        <p type="p">VDIFF:差值電壓</p>  
        <p type="p">SCMP:比較信號</p>  
        <p type="p">RDY:完成信號</p>  
        <p type="p">DMC:補償數位碼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="120" publication-number="202612045"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612045.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612045</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133450</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓裝卸裝置</chinese-title>  
        <english-title>WAFER LOADING AND UNLOADING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241121B">H01L21/67</main-classification>  
        <further-classification edition="200601120241121B">H01L21/68</further-classification>  
        <further-classification edition="200601120241121B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣富創得工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORTREND ENGINEERING (HSIN CHU) CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁祐笙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖國訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, KUO HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種晶圓裝卸裝置，包括有一基座、一載台模組以及一門片模組。載台模組包括一固定座、一承載台以及一扣具，固定座設置於基座上，固定座係以一第一驅動組件連接承載台，承載台上可放置一晶圓盒，承載台係以一第二驅動組件連接扣具。門片模組包括一安裝座、一門片開關、一定位背板以及一鎖具，基座係以一第三驅動組件連接安裝座，安裝座係以一第四驅動組件連接門片開關，且門片開關設置有一連接一真空泵浦之吸盤，真空泵浦供給真空源，並以一蓄壓瓶保持真空壓力，安裝座係以一第五驅動組件連接定位背板，門片開關係以一第六驅動組件連接鎖具。其中，第一驅動組件、第二驅動組件、第三驅動組件、第四驅動組件、第五驅動組件以及第六驅動組件皆以電源驅動之馬達作為動力源。藉此，可降低裝置產生的微塵汙染問題，並且因內部配置有真空泵浦，無須再額外提供真空源與氣壓源，故可進一步減低廠務配置的複雜度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a wafer loading and unloading device, including a base, a table module and a door module. The table module includes a fixed base, a bearing platform and a buckle. The fixed base is disposed on the base. The fixed base is connected to the bearing platform through a first driving component. A wafer box can be placed on the bearing platform. The bearing platform is connected to the buckle through a second driving component. The door module includes a mounting base, a door switcher, a positioning backplate and a lock. The base is connected to the mounting base through a third driving component. The mounting base is connected to the door switcher through a fourth driving component. The door switcher is provided with a suction cup which is connected to a vacuum pump. The vacuum pump supplies a vacuum source, and maintains vacuum pressure with a pressure accumulator bottle. The mounting base is connected to the positioning backplate through a fifth driving component. The door switcher is connected to the lock through a sixth driving component. Among them, the first driving component, the second driving component, the third driving component, the fourth driving component, the fifth driving component and the sixth driving component are all motors which use electric power source. In this way, the problem of fine dust pollution generated by the device can be reduced, and there is no need to provide additional vacuum source and air pressure source since the device is provided with the vacuum pump. Thus, the complexity of factory configuration can be further reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基座</p>  
        <p type="p">11:基座外罩</p>  
        <p type="p">100:晶圓裝卸裝置</p>  
        <p type="p">2:載台模組</p>  
        <p type="p">21:固定座</p>  
        <p type="p">22:承載台</p>  
        <p type="p">23:扣具</p>  
        <p type="p">4:門片模組</p>  
        <p type="p">42:門片開關</p>  
        <p type="p">421:吸盤</p>  
        <p type="p">43:定位背板</p>  
        <p type="p">44:鎖具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="121" publication-number="202611793"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611793.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611793</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133458</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>大型語言模型之操作方法及應用其之電子裝置</chinese-title>  
        <english-title>METHOD FOR OPERATING LARGE LANGUAGE MODEL AND ELECTRONIC DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">G06N5/04</main-classification>  
        <further-classification edition="202301120241202B">G06N5/045</further-classification>  
        <further-classification edition="201901120241202B">G06F16/95</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種大型語言模型之操作方法及應用其之電子裝置。大型語言模型之操作方法包括以下步驟。儲存一網頁瀏覽紀錄。判斷大型語言模型是否被開啟。若大型語言模型被開啟，則依據網頁瀏覽紀錄取得至少一瀏覽網頁畫面。推論提示分類模型依據瀏覽網頁畫面獲得一推論提示。依據推論提示，執行大型語言模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for operating a large language model and an electronic device using the same are provided. The method for operating the large language model includes the following steps. A plurality of cookies are stored. Whether the large language model is enabled is determined. If the large language model is enabled, at least one web browsing frame is obtained according to the cookies. An inference prompt classification model obtains a prompt according to the web browsing frame. The large language model is executed according to the prompt.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100:訓練程序</p>  
        <p type="p">S110,S120,S210,S220,S230,S240,S250,S310,S320,S330,S340,S350,S360:步驟</p>  
        <p type="p">S200:推論程序</p>  
        <p type="p">S300:優化程序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="122" publication-number="202610970"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610970.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610970</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鹵化芳香族化合物的方法</chinese-title>  
        <english-title>METHODS FOR HALOGENATING AROMATIC COMPOUND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">C07C17/12</main-classification>  
        <further-classification edition="200601120240930B">C07C25/02</further-classification>  
        <further-classification edition="200601120240930B">C07C25/22</further-classification>  
        <further-classification edition="200601120240930B">C07C41/22</further-classification>  
        <further-classification edition="200601120240930B">C07C43/225</further-classification>  
        <further-classification edition="200601120240930B">C07C233/15</further-classification>  
        <further-classification edition="200601120240930B">C07C231/12</further-classification>  
        <further-classification edition="200601120240930B">C07C319/20</further-classification>  
        <further-classification edition="200601120240930B">C07C321/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中央大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯敦仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, DUEN-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳品嫻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PIN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許書榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHU-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鹵化芳香族化合物的方法包括：在酸性環境下以用於生成亞硝鎓離子的試劑催化芳香族化合物、鹵化物鹽及含氧氣氣體進行鹵化反應，以生成鹵化芳香族化合物。鹵化物鹽具有如式(1)所示的結構： &lt;br/&gt;MX &lt;sub&gt;n&lt;/sub&gt;式(1)。 &lt;br/&gt;M為鹼金屬、鹼土金屬、過渡金屬、鋁或銨離子，n為1、2或3，X為Cl、Br或I。試劑包括硝酸鹽、亞硝酸鹽、亞硝酸烷基酯、硝鎓鹽、亞硝鎓鹽或其組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for halogenating an aromatic compound includes catalyzing a halogenation reaction of the aromatic compound, a halide salt, and an oxygen gas-containing gas in an acidic environment by using a reagent for generating a nitrosonium ion to generate a halogenated aromatic compound. The halide salt has a structure shown in formula (1): &lt;br/&gt;MX &lt;sub&gt;n&lt;/sub&gt;formula (1). &lt;br/&gt;M is an alkali metal, an alkaline earth metal, a transition metal, aluminum, or an ammonium ion, n is 1, 2, or 3, and X is Cl, Br, or I. The reagent includes a nitrate, a nitrite, an alkyl nitrite, a nitronium salt, a nitrosonium salt, or combinations thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="123" publication-number="202611693"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611693.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611693</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133465</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用者介面之智慧顯示方法、電子裝置及介面顯示推論模型之訓練方法</chinese-title>  
        <english-title>SMART DISPLAY METHOD FOR USER INTERFACE, ELECTRONIC DEVICE AND TRAINING METHOD FOR INTERFACE DISPLAYING INFERENCE MODEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G06F3/14</main-classification>  
        <further-classification edition="202301120250102B">G06N5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種使用者介面之智慧顯示方法、電子裝置及介面顯示推論模型之訓練方法。使用者介面之智慧顯示方法包括以下步驟。擷取一電子裝置之至少一螢幕畫面。輸入螢幕畫面至一介面顯示推論模型。介面顯示推論模型依據螢幕畫面，推論一使用者介面之一介面顯示方式。介面顯示方式包括一介面顯示位置及一介面顯示項目。依據介面顯示方式，顯示使用者介面於一顯示單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A smart display method for a user interface, an electronic device and a training method for an interface displaying inference model are provided. The smart display method for the user interface includes the following steps. At least one frame of the electronic device is obtained. The frame is inputted to an interface displaying inference model. The interface displaying inference model outputs an interface displaying setting of a user interface according to the frame. The interface display setting includes an interface display position and a set of interface display items. The user interface is displayed on a display unit according to the interface display setting.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S510,S520,S530,S540,S550,S560:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="124" publication-number="202611580"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611580.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611580</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133467</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含彈性連接器適配器的光模組及光被動元件組</chinese-title>  
        <english-title>OPTICAL MODULE WITH ELASTIC CONNECTOR ADAPTOR AND OPTICAL PASSIVE ASSEMBLY WITH THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241025B">G02B6/36</main-classification>  
        <further-classification edition="200601120241025B">G02B6/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧波環球廣電科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBAL TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章辛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪琪淋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, QILIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳科軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KEJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍永祖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, YONGZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光模組，其包含殼體、適配器、光學接頭以及彈性體。適配器耦接於殼體。光學接頭容納於適配器。彈性體耦接於適配器，且殼體擠壓彈性體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an optical module, including a housing, an adapter, an optical connector, and an elastomer. The adapter is coupled to the housing. The optical connector is accommodated in the adapter. The elastomer is coupled to the adapter. The housing compresses the elastomer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光被動元件組</p>  
        <p type="p">10:適配器</p>  
        <p type="p">20:光學接頭</p>  
        <p type="p">30:彈性體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="125" publication-number="202610604"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610604.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610604</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133469</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於角膜地形圖的角膜塑型鏡片之智慧驗配輔助系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">A61F9/01</main-classification>  
        <further-classification edition="200601120250512B">A61B3/10</further-classification>  
        <further-classification edition="200601120250512B">G02C7/04</further-classification>  
        <further-classification edition="200601120250512B">G06F17/13</further-classification>  
        <further-classification edition="200601120250512B">G06F17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨泰光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRIGHTEN OPTIX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳怡璁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, I-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李毓庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張朝坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種基於角膜地形圖的角膜塑型鏡片之智慧驗配輔助系統及方法，包括：檢測模組，用以獲取患者之驗光參數與角膜特徵參數；角膜地形初建模組，依據驗光參數及角膜特徵參數繪製角膜初建地形圖；角膜地形優化模組，依據角膜初建地形圖進行重建、優化調整及重新取樣，以獲得角膜優化地形圖；模型建構模組，依據預定之角膜塑型鏡片參數結合驗光參數、角膜特徵參數、角膜優化地形圖來 獲建立角膜塑型鏡片評估輔助模型；模型評價模組，依據預定之評價指標而對角膜塑型鏡片評估輔助模型進行評價運算，評價運算方法為計算鏡片與角膜的接觸面積，並輸出最滿足評價模組的角膜塑型鏡片參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:檢測模組</p>  
        <p type="p">2:驗配輔助系統</p>  
        <p type="p">21:角膜地形初建模組</p>  
        <p type="p">22:角膜地形優化模組</p>  
        <p type="p">23:模型建構模組</p>  
        <p type="p">24:角膜塑型鏡片評估輔助模型</p>  
        <p type="p">25:模型評價模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="126" publication-number="202611469"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611469.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611469</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133470</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷裝置之連接器結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241120B">F28F9/26</main-classification>  
        <further-classification edition="200601120241120B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>搏盟科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRIMO TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃奇咸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHI-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李毓庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張朝坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種液冷裝置之連接器結構，包括：一轉接座，包括有至少二連接部；一連接器，包括有一本體且於該本體內部具有供該轉接座之該連接部穿設之一對接空間，而該本體外部形成有一定位環部且該定位環部形成有至少一鏤空槽；一結合件，包括裝設於該定位環部且形成彈性夾持之一包覆體，而該包覆體內壁處凸設有穿過該鏤空槽且抵接於該連接部外部形成固定之至少一抵持體，於該包覆體頂側開口處裝設有受彈性夾持力向上頂起之一釋放鍵，且該釋放鍵向下移動可撐開包覆體且使該抵持體脫離與該連接部抵接，以使該轉接座與該連接器呈可脫離狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:轉接座</p>  
        <p type="p">11:連接部</p>  
        <p type="p">12:擋止部</p>  
        <p type="p">13:定位部</p>  
        <p type="p">2:連接器</p>  
        <p type="p">21:本體</p>  
        <p type="p">22:定位環部</p>  
        <p type="p">221:鏤空槽</p>  
        <p type="p">222:擋止面</p>  
        <p type="p">3:結合件</p>  
        <p type="p">31:包覆體</p>  
        <p type="p">311:第一瓣片</p>  
        <p type="p">3111:抵持體</p>  
        <p type="p">3111a:導斜面</p>  
        <p type="p">3112:第一結合部</p>  
        <p type="p">3113:第一限位部</p>  
        <p type="p">3114:第一滑槽</p>  
        <p type="p">312:第二瓣片</p>  
        <p type="p">3122:第二結合部</p>  
        <p type="p">3123:第二限位部</p>  
        <p type="p">3124:第二滑槽</p>  
        <p type="p">313:樞軸</p>  
        <p type="p">314:定位槽</p>  
        <p type="p">315:彈性件</p>  
        <p type="p">32:釋放鍵</p>  
        <p type="p">321:基部</p>  
        <p type="p">3211:導板</p>  
        <p type="p">3212:中心凸塊</p>  
        <p type="p">3213:限位槽</p>  
        <p type="p">3214:擋止塊</p>  
        <p type="p">322:操作部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="127" publication-number="202611237"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611237.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611237</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低溫快乾水性塗料及其製備方法與使用方法</chinese-title>  
        <english-title>LOW-TEMPERATURE QUICK-DRYING WATER-BASED PAINT AND PREPARATION METHOD AND USE METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241011B">C09D1/00</main-classification>  
        <further-classification edition="201801120241011B">C09D7/61</further-classification>  
        <further-classification edition="201801120241011B">C09D7/62</further-classification>  
        <further-classification edition="201801120241011B">C09D7/63</further-classification>  
        <further-classification edition="201801120241011B">C09D7/65</further-classification>  
        <further-classification edition="200601120241011B">C09D5/18</further-classification>  
        <further-classification edition="200601120241011B">B05D1/00</further-classification>  
        <further-classification edition="200601120241011B">B05D3/02</further-classification>  
        <further-classification edition="200601120241011B">B22C3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皇廣鑄造發展股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEMC METAL &amp; CHEMICAL CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亦珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YI SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種低溫快乾水性塗料及其製備方法與使用方法。低溫快乾水性塗料包括耐火骨材、懸浮劑、流變助劑、高溫助劑、消泡劑、黏結劑、快乾助劑、減水劑、防腐劑以及溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a low-temperature quick-drying water-based paint and a preparation method and a use method thereof. The low-temperature quick-drying water-based paint includes refractory aggregates, suspending agents, rheology additives, high-temperature additives, defoaming agents, binders, quick-drying additives, water-reducing agents, preservatives, and solvents.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="128" publication-number="202611410"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611410.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611410</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樞軸模組及電子裝置</chinese-title>  
        <english-title>PIVOT MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241121B">F16C11/04</main-classification>  
        <further-classification edition="200601120241121B">H05K7/16</further-classification>  
        <further-classification edition="200601120241121B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林哲賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHE-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱哲賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHE-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種樞軸模組，包括一主軸體、一底座、至少一齒輪及一凸輪。主軸體可動地連接於底座。齒輪連接於主軸體。凸輪連動於齒輪，且包括相連的一連接部及一凸出部。當主軸體以一轉動軸線相對於底座轉動時，齒輪帶動凸輪抵靠底座，使主軸體沿一移動軸線相對於底座移動。轉動軸線相異於移動軸線。此外，一種電子裝置亦被提及。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pivot module including a main shaft, a base, at least one gear and a cam is provided. The main shaft is movably connected to the base. The gear is connected to the main shaft. The cam is linked to the gear and includes a connecting portion and a protruding portion. When the main shaft rotates relative to the base along a rotation axis, the gear drives the cam to abut the base, causing the main shaft to move along a movement axis relative to the base. The axis of rotation is different from the axis of movement. In addition, an electronic device is also mentioned.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">L1:轉動軸線</p>  
        <p type="p">L2:移動軸線</p>  
        <p type="p">M1:第一狀態</p>  
        <p type="p">200:樞軸模組</p>  
        <p type="p">210:主軸體</p>  
        <p type="p">220:底座</p>  
        <p type="p">221a、221b、221c:部件</p>  
        <p type="p">222:開槽</p>  
        <p type="p">223:第一端</p>  
        <p type="p">224:第二端</p>  
        <p type="p">225:抵接面</p>  
        <p type="p">230a、230b:齒輪</p>  
        <p type="p">231:中軸</p>  
        <p type="p">240:凸輪</p>  
        <p type="p">250:彈性件</p>  
        <p type="p">260:齒輪座</p>  
        <p type="p">270:桿件</p>  
        <p type="p">280:板體</p>  
        <p type="p">290:扭力組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="129" publication-number="202610788"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610788.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610788</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133474</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工具置放盤</chinese-title>  
        <english-title>TOOL TRAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">B25H3/06</main-classification>  
        <further-classification edition="200601120240929B">B25H3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立晏企業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIH YANN INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖伯霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, PO-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種工具置放盤，其包括：一盤體及至少一第一磁性件。該盤體包含有複數置放部及至少一可彎曲部，該至少一可彎曲部連接於二該置放部之間；該至少一第一磁性件設於至少一該置放部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tool tray is provided, including a tray body and at least one first magnetic component. The tray body includes multiple placement portions and at least one bendable portion, which is connected between the two placement portions. The at least one first magnetic component is located at least one of the placement portions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:盤體</p>  
        <p type="p">11:置放部</p>  
        <p type="p">17:可變形區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="130" publication-number="202610860"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610860.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610860</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池服務品質管理方法及系統</chinese-title>  
        <english-title>BATTERY SERVICE QUALITY MANAGEMENT METHODS AND SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120240927B">B60L53/68</main-classification>  
        <further-classification edition="201901120240927B">B60L53/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWANG YANG MOTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯一安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, YI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈怡宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池服務品質管理方法及系統，適用於一遠端伺服器。首先，透過一網路由位於一特定區域之複數電池能源站中之每一者接收一可用電池資訊，其中該可用電池資訊記錄相應該電池能源站中可提供進行一電池交換作業之一電池數量。之後，取得特定區域中相應複數特定電動車輛之一車輛數目，並依據相應每一該電池能源站之該電池數量及該車輛數目，計算一電池服務品質。接著，判斷該電池服務品質是否低於一既定臨限值。當該電池服務品質低於該既定臨限值時，產生一警示通知。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Battery service quality management methods and systems for use in a remote server are provided. First, available battery information is received through a network from each of a plurality of battery energy stations located in a specific area, wherein the available battery information records the number of batteries corresponding to the respective battery energy station that can be provided for a battery exchange operation. Then, the number of a plurality of specific electric vehicles in the specific area is obtained, and a battery service quality is calculated based on the number of batteries corresponding to the respective battery energy station and the number of the specific electric vehicles. When the battery service quality is lower than a predetermined threshold, a warning notification is generated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S410、S420、S430、S440、S450、S460:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="131" publication-number="202612355"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612355.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612355</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133477</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有發光結構的麥克風</chinese-title>  
        <english-title>MICROPHONE HAVING LIGHT-EMITTING STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H04R1/04</main-classification>  
        <further-classification edition="200601120241101B">H04R5/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商美律電子(深圳)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERRY ELECTRONICS(SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凃宥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, YU CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡伯源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PO YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹鴻文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, HUNG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有發光結構的麥克風，包括一外殼、一主體以及多個發光結構。主體設置在外殼內。多個發光結構設置在外殼與主體之間並固定於主體上。這些發光結構的每一個還包括一發光模組以及一導光結構。發光模組具有一電路板以及多個發光元件，且這些發光元件設置在電路板上。導光結構具有一凹槽與一導光部，其中凹槽覆蓋發光模組。導光部為山形並且由凹槽往外殼的方向延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A microphone having lighting-emitting structure including a housing, a main body and a plurality of light-emitting structure. The main body is disposed in the housing. The plurality of light-emitting structure disposed between the housing and the main body and fixed on the main body. Each of the plurality of light-emitting structure includes a light-emitting module and a light guide structure. The light-emitting module includes a circuit board and a plurality of light-emitting elements which disposed on the circuit board. The light guide structure includes a groove and a light guide part. The grove covers the light-emitting module. The light guide part is mountain-shaped and extends from the groove toward the housing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:外殼</p>  
        <p type="p">111:網狀結構</p>  
        <p type="p">111a:孔洞</p>  
        <p type="p">120:主體</p>  
        <p type="p">130:發光結構</p>  
        <p type="p">131:發光模組</p>  
        <p type="p">131a:電路板</p>  
        <p type="p">131b:發光元件</p>  
        <p type="p">132:導光結構</p>  
        <p type="p">132a:凹槽</p>  
        <p type="p">132a1:開口</p>  
        <p type="p">132a2:底部</p>  
        <p type="p">132b:導光部</p>  
        <p type="p">132b1:第一斜面</p>  
        <p type="p">132b2:第二斜面</p>  
        <p type="p">140:發泡結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="132" publication-number="202610883"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610883.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610883</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133478</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調整預載之避震座管結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">B62J1/02</main-classification>  
        <further-classification edition="200601120241029B">B62J1/08</further-classification>  
        <further-classification edition="200601120241029B">B62J1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久鼎金屬實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮彬杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃翔鈴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關於一種可調整預載之避震座管結構，其包含有一座管、一連桿組件、一調整組件以及一緩衝件。連桿組件係組設於座管之一端，調整組件則可移動地穿設於座管內，調整組件具有一設置於連桿組件之推抵件與一抵接於推抵件之調壓組，調壓組之一端再凸出至座管之一端的外側，而緩衝件穿設於座管內，且緩衝件之一端會抵接於調整組件之調壓組；藉此，調壓組位於座管外側的部分可提供緩衝件之預載的調整，以對應承載不同體重的騎乘者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:座管</p>  
        <p type="p">11:安裝座</p>  
        <p type="p">2:連桿組件</p>  
        <p type="p">21:第一連桿</p>  
        <p type="p">22:第二連桿</p>  
        <p type="p">23:第三連桿</p>  
        <p type="p">24:推抵件</p>  
        <p type="p">31:調壓組</p>  
        <p type="p">311:上套件</p>  
        <p type="p">312:下套件</p>  
        <p type="p">313:調整孔</p>  
        <p type="p">32:副調壓組</p>  
        <p type="p">33:帽件</p>  
        <p type="p">4:緩衝件</p>  
        <p type="p">5:限位件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="133" publication-number="202611583"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611583.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611583</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133479</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光纜配線箱</chinese-title>  
        <english-title>OPTICAL CABLE DISTRIBUTION BOX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241120B">G02B6/46</main-classification>  
        <further-classification edition="200601120241120B">H02G3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫子硯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, TZU-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳惠珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光纜配線箱，包括箱體、多個光纖連接器、多個收容盤以及多個預配光纜。箱體具有多個面板及彼此相對的前側與後側，面板位於前側。 光纖連接器分別是LC（lucent connector）雙心插座，陣列地配置於面板上。收容盤可拆卸地設置於箱體內。預配光纜設置於箱體內。各預配光纜具有多個LC插頭與多條第一光纖心線，其中LC插頭對應地插置於LC雙心插座，而第一光纖心線對應地熔接於局端光纜的多條第二光纖心線，且所述熔接的部分配置於收容盤中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical cable distribution box including a box, a plurality of optical fiber connectors, a plurality of receiving trays detached from or attached into the box, and a plurality of pre-configured optical fiber cables disposed in the box is provided. The box has a front side and a rear side opposite to each other, and a front panel disposed at the front side. The optical fiber connectors are Duplex LC (lucent connector) sockets arranged on the panel in an array. Each of the pre-configured optical fiber cables has a plurality of LC plugs and a plurality of first optical fiber cores, wherein the LC plugs are inserted into the LC sockets correspondingly. The first optical fiber cores are correspondingly fused to a plurality of second optical fiber cores of a central office optical fiber cable, and fusing parts of the first and the second fiber cores are disposed in the receiving trays.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光纜配線箱</p>  
        <p type="p">110:箱體</p>  
        <p type="p">120:光纖連接器</p>  
        <p type="p">200:局端光纜</p>  
        <p type="p">C1:前側</p>  
        <p type="p">C2:後側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="134" publication-number="202612100"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612100.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612100</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241114B">H01L21/76</main-classification>  
        <further-classification edition="200601120241114B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪至偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王炳堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PIN-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構，包括基底、深溝渠隔離結構與基底穿孔。基底包括元件區。深溝渠隔離結構穿過基底。深溝渠隔離結構圍繞元件區。基底穿孔位在深溝渠隔離結構中。基底穿孔直接接觸深溝渠隔離結構。基底穿孔穿過基底。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure including a substrate, a deep trench isolation structure, and a through-substrate via (TSV) is provided. The substrate includes a device region. The deep trench isolation structure passes through the substrate. The deep trench isolation structure surrounds the device region. The TSV is located in the deep trench isolation structure. The TSV is in direct contact with the deep trench isolation structure. The TSV passes through the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體結構</p>  
        <p type="p">102:隔離結構</p>  
        <p type="p">104a:深溝渠隔離結構</p>  
        <p type="p">106a:基底穿孔</p>  
        <p type="p">AA1:主動區</p>  
        <p type="p">R1:元件區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="135" publication-number="202610882"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610882.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610882</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>簡易機車駐立裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">B62H3/10</main-classification>  
        <further-classification edition="200601120241029B">B62H1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林運貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林運貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳恕琮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種簡易機車駐立裝置，包括：一座體，組配於一機車底部，該座體上樞設一樞軸；一支腳組件，具有兩同步連動之支腳，各支腳以一端樞套於該樞軸上；一連動組件，具有兩結合固定於該樞軸上之凸輪，各凸輪分別具有外凸之凸部，各凸部與各支腳中段之間設有一拉伸彈性件；一操作桿，樞設於該樞軸，用以驅動該樞軸樞轉；當該操作桿連動該樞軸轉至一釋放位置，能連動該兩支腳同步保持貼近於該機車底部，當該操作桿連動該樞軸至一作動位置，該樞軸連動該凸輪拉伸該拉伸彈性件，使該兩支腳同步轉動並抵觸於地面，藉由該兩支腳配合機車之前、後輪得以形成穩定的駐車狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:座體</p>  
        <p type="p">11:支部</p>  
        <p type="p">12:樞軸孔</p>  
        <p type="p">13:第一擋止部</p>  
        <p type="p">14:第二擋止部</p>  
        <p type="p">15,414:插接孔</p>  
        <p type="p">2:樞軸</p>  
        <p type="p">21:凹部</p>  
        <p type="p">3:支腳組件</p>  
        <p type="p">31:支腳</p>  
        <p type="p">311:樞接端</p>  
        <p type="p">312:軸孔</p>  
        <p type="p">32:拉伸彈性件</p>  
        <p type="p">33:被連動部</p>  
        <p type="p">4:連動組件</p>  
        <p type="p">41:凸輪</p>  
        <p type="p">411:結合孔</p>  
        <p type="p">412:凸部</p>  
        <p type="p">413:連動部</p>  
        <p type="p">42:扭轉彈性件</p>  
        <p type="p">421:第一端</p>  
        <p type="p">422:第二端</p>  
        <p type="p">5:操作桿</p>  
        <p type="p">51:樞接部</p>  
        <p type="p">511:樞接件</p>  
        <p type="p">512:扭簧</p>  
        <p type="p">52:踏板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="136" publication-number="202611756"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611756.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611756</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133482</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多元身分驗證方法及其系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241202B">G06F21/31</main-classification>  
        <further-classification edition="201301120241202B">G06F21/60</further-classification>  
        <further-classification edition="202301120241202B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國信託商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古旻弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃玉珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉哲均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHE-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃奕晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃淑禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多元身分驗證方法及其系統。該多元身分驗證系統包含一儲存單元及一電連接於該儲存單元的處理單元。該儲存單元儲存有該客戶的一有效驗證項目資料，該有效驗證項目資料指示出多個預定驗證項目其中一個或多個該客戶目前可使用的預定驗證項目。該處理單元接收到來自該客戶端裝置且對應於多個服務項目其中一者的服務請求。該處理單元自該有效驗證項目資料中所指示的該預定驗證項目或該等預定驗證項目選出其中一者作為一選定驗證項目，並執行對應於該選定驗證項目的一驗證程序，供該客戶透過該客戶端裝置進行身分驗證。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多元身分驗證系統</p>  
        <p type="p">1:儲存單元</p>  
        <p type="p">2:處理單元</p>  
        <p type="p">3:客戶端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="137" publication-number="202611896"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611896.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611896</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓降補償系統</chinese-title>  
        <english-title>VOLTAGE DROP COMPENSATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241007B">G09G3/3258</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇景光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙昌博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, PAUL C.-P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇泰齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, TAI CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林敬倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種壓降補償系統，包含掃描計數器，根據顯示器的同步信號以決定目前掃描像素列；平均灰階電路，根據目前掃描像素列以產生影像信號的平均灰階值；補償值產生裝置，根據平均灰階值以產生相應補償值；及補償裝置，根據補償值以補償影像信號，以產生補償影像信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A voltage drop compensation system includes a scanning counter that determines a current scanning pixel row according to synchronization signals of a display; an average gray circuit that generates an average gray value of an image signal according to the current scanning pixel row; a compensation value generating device that generates a corresponding compensation value according to the average gray value; and a compensation device that compensates the image signal according to the compensation value, thereby generating a compensated image signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:壓降補償系統</p>  
        <p type="p">11:掃描計數器</p>  
        <p type="p">12:平均灰階電路</p>  
        <p type="p">13:補償查表</p>  
        <p type="p">14:補償裝置</p>  
        <p type="p">101:時序控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="138" publication-number="202611889"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611889.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611889</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板及其畫素電路</chinese-title>  
        <english-title>DISPLAY PANEL AND PIXEL CIRCUIT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250102B">G09G3/32</main-classification>  
        <further-classification edition="202001120250102B">H05B45/30</further-classification>  
        <further-classification edition="202501120250102B">H10H29/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶微元電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP MICRO DEVICE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林振祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHEN CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃日鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JIH FON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示面板及畫素電路被提出。畫素電路包括驅動電晶體、第一開關、第二開關以及第三開關。驅動電晶體與發光元件相互串聯耦接，受控於驅動電壓以驅動發光元件。第一開關耦接在驅動電晶體的控制端以及源極線間，受控於第一閘極信號。第二開關與驅動電晶體及發光元件相互串聯耦接於電源電壓以及參考接地電壓間，受控於第二閘極信號。第三開關耦接在發光元件與設定/感測電壓傳輸線間，受控於第三閘極信號。其中驅動電晶體的控制端上的資料寫入動作以及電壓重置動作透過被導通的相同的第一開關來進行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display panel and pixel circuit are provided. The pixel includes a driving transistor, a first switch, a second switch and a third switch. The driving transistor and a light emitting device are coupled in series, and controlled by a driving voltage to drive the light emitting device. The first switch is coupled between a control end of the driving transistor and a source line, and controlled by a first gate signal. The second switch, the driving transistor and the light emitting device are coupled in series between a power voltage and a reference ground voltage, and controlled by a second gate signal. The third switch is coupled between the light emitting device and a setting/sensing voltage transmission wire, and controlled by a third gate signal. A data writing operation and a voltage resetting operation of the control end of the driving transistor are performed by the same first switch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:畫素電路</p>  
        <p type="p">C1、C2:電容</p>  
        <p type="p">GL1~GL3:閘極信號</p>  
        <p type="p">LD:發光元件</p>  
        <p type="p">M1~M3:電晶體</p>  
        <p type="p">MD:驅動電晶體</p>  
        <p type="p">OVDD:電源電壓</p>  
        <p type="p">OVSS:參考接地電壓</p>  
        <p type="p">SL1:源極線</p>  
        <p type="p">SW1~SW3:開關</p>  
        <p type="p">VD:驅動電壓</p>  
        <p type="p">VSW1:設定/感測電壓傳輸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="139" publication-number="202610841"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610841.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610841</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133500</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件之清潔網板及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B41F15/08</main-classification>  
        <further-classification edition="200601120241105B">B41F35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>偉立精密機械有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何宇捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件之清潔網板，包含一圍繞界定出一限位槽的環框板體，及一設置於該環框板體上的網框板體。該網框板體包括一凸設於該環框板體上且環繞該限位槽的凸垣，及複數連接該凸垣的分隔壁，該凸垣圍繞界定出一連通且對齊該限位槽的設置槽，該等分隔壁位於該設置槽內且將該設置槽區分為複數網孔。當該環框板體置放於承載盤上時，朝下凸出的凸垣會深入承載盤中，使該清潔網板盡可能地接近半導體元件，避免半導體元件浮動及重疊，該環框板體的讓位使刷具能伸入該限位槽中而接近半導體元件以提升清潔效果 。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:清潔網板</p>  
        <p type="p">10:網框板體</p>  
        <p type="p">11:環框板體</p>  
        <p type="p">111:限位槽</p>  
        <p type="p">12:凸垣</p>  
        <p type="p">121:設置槽</p>  
        <p type="p">13:分隔壁</p>  
        <p type="p">131:網孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="140" publication-number="202610590"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610590.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610590</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133502</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腦影像建立方法以及頭部影像建立方法</chinese-title>  
        <english-title>A METHOD FOR BRAIN/ HEAD IMAGE CREATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250227B">A61B5/055</main-classification>  
        <further-classification edition="200601120250227B">A61B6/03</further-classification>  
        <further-classification edition="201801120250227B">G16H30/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>醫百科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EPED INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃大可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TA-KO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　大千</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JERRY T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧治中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種腦影像建立方法以及頭部影像建立方法，可用於腦部位協助非侵入式腦部治療儀器之定位(如磁刺激（TMS）或電刺激等)使用。本發明的腦影像建立方法係依照所輸入的頭部3D影像(如電腦斷層CT或核磁共振MRI或超音波建立)進行比例校正，使得頭骨與腦部位之間的相對位置更為清楚。其中，腦影像建立方法的經由一運算裝置對所輸入之一頭部3D影像進行比例校正，以取得一腦影像；其比例校正步驟為一初始化步驟、一參考模型建置步驟、一區域成長步驟與一模型後處理步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a brain image creation method and a head image creation method, which can be used to assist in the positioning of non-invasive brain treatment instruments (such as magnetic stimulation (TMS) or electrical stimulation, etc.) in brain regions. The present invention performs proportional correction according to the input 3D head image (such as CT or MRI or Ultrasound creation), so that the relative position between the skull and the brain parts is clearer. Among them, the brain image creation method performs proportion correction on an input 3D head image through a computing device to obtain a brain image; the proportion correction step is an initialization step, a reference model construction step, a region growth step, and a model post-processing step.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="141" publication-number="202612422"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612422.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612422</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133511</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>免工具安裝的滑軌固定裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">H05K7/18</main-classification>  
        <further-classification edition="200601120241231B">H05K7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富世達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOSITEK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇家弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王浩評</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAO-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種免工具安裝的滑軌固定裝置，包含一後支撐軌及一後托架模組。後支撐軌包括一後底壁及兩個連接後底壁上下兩側的後側牆，該等後側牆其中一者形成一滑槽。後托架模組包括一後托架、一後鎖定件及一後安裝件單元。後鎖定件可卡扣於一後安裝片並具有一伸入滑槽的凸柱。後安裝件單元可適用於連接後安裝片，後鎖定件可在一鎖定狀態及一解鎖狀態之間移動，當後托架被操作朝後支撐軌的後端移動時，凸柱便沿著滑槽移動而帶動後鎖定件遠離後托架樞轉，達到解鎖狀態，當後安裝件單元接合後安裝片時，後托架被操作遠離後端移動，凸柱便沿著滑槽復位而帶動後鎖定件朝後托架樞轉與後安裝片卡合，達到鎖定狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:滑軌固定裝置</p>  
        <p type="p">20:後安裝片</p>  
        <p type="p">201:後安裝孔</p>  
        <p type="p">30:前安裝片</p>  
        <p type="p">301:前安裝孔</p>  
        <p type="p">1:滑軌</p>  
        <p type="p">2:後支撐軌</p>  
        <p type="p">3:後托架模組</p>  
        <p type="p">4:前支撐軌</p>  
        <p type="p">5:前托架模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="142" publication-number="202612114"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612114.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612114</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241227B">H01L23/28</main-classification>  
        <further-classification edition="200601120241227B">H01L23/34</further-classification>  
        <further-classification edition="200601120241227B">H01L23/52</further-classification>  
        <further-classification edition="200601120241227B">H01Q1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林芷妤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳亮斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包含有線路結構、嵌埋於該線路結構之第一電子元件、結合於該線路結構中且電性連接該第一電子元件之第二電子元件、以及佈設於該線路結構上之天線層，其中，該第二電子元件形成有外露出該線路結構之複數空氣通道，以協助逸散該第一電子元件及第二電子元件之熱量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a circuit structure, a first electronic component embedded in the circuit structure, a second electronic component combined in the circuit structure and electrically connected to the first electronic component, and an antenna layer arranged on the circuit structure. The second electronic component is formed with a plurality of air channels that expose the circuit structure to help dissipate the heat of the first electronic component and the second electronic component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:電子裝置</p>  
        <p type="p">20:線路結構</p>  
        <p type="p">20a:第一側</p>  
        <p type="p">20b:第二側</p>  
        <p type="p">200:絕緣層</p>  
        <p type="p">201:線路層</p>  
        <p type="p">21:第一電子元件</p>  
        <p type="p">21a:第一表面</p>  
        <p type="p">21b:第二表面</p>  
        <p type="p">210:第一電性接點</p>  
        <p type="p">22:第二電子元件</p>  
        <p type="p">22a:第三表面</p>  
        <p type="p">22b:第四表面</p>  
        <p type="p">220:第二電性接點</p>  
        <p type="p">221,231:空氣通道</p>  
        <p type="p">222,232:散熱層</p>  
        <p type="p">23:第三電子元件</p>  
        <p type="p">23a:第五表面</p>  
        <p type="p">23b:第六表面</p>  
        <p type="p">230:第三電性接點</p>  
        <p type="p">24:天線層</p>  
        <p type="p">25:導電元件</p>  
        <p type="p">h1,h2:深度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="143" publication-number="202610544"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610544.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610544</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133523</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>咖啡豆烘焙方法、咖啡萃取物及其用途</chinese-title>  
        <english-title>COFFEE BEAN ROASTING METHOD, COFFEE EXTRACT AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A23F5/04</main-classification>  
        <further-classification edition="200601120240929B">A23F5/10</further-classification>  
        <further-classification edition="200601120240929B">A23F5/24</further-classification>  
        <further-classification edition="200601120240929B">A23F5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯宣夙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯睿維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯宣夙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯睿維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種咖啡豆烘焙方法、咖啡萃取物及其用途，所述方法改變咖啡烘焙的pH值及/或壓力，得以獲得富含更多綠原酸的烘焙咖啡豆。所述咖啡萃取物為所述的烘焙咖啡豆被磨成粉狀，並經萃取液所萃取而成。所述用途是透過咖啡萃取物的有效成分，使受體達到減少體脂肪的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a coffee bean roasting method, a coffee extract, and uses thereof. The method involves altering the pH value and/or pressure during the roasting process to obtain roasted coffee beans rich in chlorogenic acid. The coffee extract is obtained by grinding the roasted coffee beans into powder and extracting them with an extraction solution. The use of this extract involves utilizing its active ingredients to achieve the effect of reducing body fat in the recipient.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="144" publication-number="202610605"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610605.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610605</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133524</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合曲率護目鏡片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241121B">A61F9/02</main-classification>  
        <further-classification edition="200601120241121B">G02C7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱俞惠炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU YU, HUI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱俞惠炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU YU, HUI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種複合曲率護目鏡片，結合於鏡框後供使用者配戴，並包含第一鏡片部、至少一第二鏡片部及第三鏡片部。第一鏡片部包括反向於使用者臉部且具有一第一縱向曲率半徑的第一弧凸面。第二鏡片部一體連接第一鏡片部底緣，並包括反向於使用者臉部並具有不同於第一縱向曲率半徑的第二縱向曲率半徑的第二弧凸面。第三鏡片部自第一鏡片部頂緣往上延伸，並包括位在反向於使用者臉部且具有不同於第一縱向曲率半徑的第三縱向曲率半徑的第三弧凸面。利用第一縱向曲率與第二、三縱向曲率都不同的設計，能在提供使用者良好的光學效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一鏡片部</p>  
        <p type="p">12:第一弧凸面</p>  
        <p type="p">2:第二鏡片部</p>  
        <p type="p">22:第二弧凸面</p>  
        <p type="p">3:第三鏡片部</p>  
        <p type="p">32:第三弧凸面</p>  
        <p type="p">CL1:第一縱向曲線</p>  
        <p type="p">CL2:第二縱向曲線</p>  
        <p type="p">CL3:第三縱向曲線</p>  
        <p type="p">CT1:第一橫向曲線</p>  
        <p type="p">CT2:第二橫向曲線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="145" publication-number="202612223"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612223.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612223</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133530</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁能連接傳動裝置</chinese-title>  
        <english-title>MAGNETIC ENERGY CONNECTION TRANSMISSION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">H02K7/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝正舉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, ZHENG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝正舉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, ZHENG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃珊珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磁能連接傳動裝置，包含一動力單元，及一傳動單元，該動力單元包括一致動模組、一與該致動模組連接的致動轉軸、一與該致動轉軸連接的致動旋轉體，及複數設置於該致動旋轉體的致動磁吸體，該傳動單元包括至少一發電模組、至少一與該發電模組連接的傳動轉軸、至少一與該傳動轉軸連接之第一旋轉體，及複數設置於該第一旋轉體的第一磁吸體，該複數致動磁吸體分別與該複數第一磁吸體磁吸連接並且間隔設置，該複數致動磁吸體與該複數第一磁吸體的數量為偶數，每二鄰近之致動磁吸體的磁性方向相反。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magnetic energy connection transmission device includes a power unit and a power generation unit. The power unit includes an actuating module, a power rotating shaft connected to the actuating module, a power fixed body connected to the power rotating shaft, and a plurality of power magnetic attraction bodies arranged on the power fixed body. The power generation unit includes at least one power generation module, at least one power generation shaft connected to the power generation module, at least one first fixed body connected to the power generation shaft, and a plurality of first magnetic attraction bodies arranged on the first fixed body. The plurality of dynamic magnetic attraction bodies are magnetically connected to the plurality of first magnetic attraction bodies respectively and are arranged at intervals. The number of the plurality of dynamic magnetic attraction bodies and the plurality of first magnetic attraction bodies is an even number. The magnetic directions of every two adjacent dynamic magnetic attraction bodies are opposite.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:動力單元</p>  
        <p type="p">311:致動模組</p>  
        <p type="p">312:致動轉軸</p>  
        <p type="p">313:致動旋轉體</p>  
        <p type="p">314:致動磁吸體</p>  
        <p type="p">32:傳動單元</p>  
        <p type="p">321:發電模組</p>  
        <p type="p">322:傳動轉軸</p>  
        <p type="p">323:第一旋轉體</p>  
        <p type="p">325:第二旋轉體</p>  
        <p type="p">326:第二磁吸體</p>  
        <p type="p">327:移動軌</p>  
        <p type="p">329:間距調整結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="146" publication-number="202612322"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612322.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612322</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像校正方法與顯示模組</chinese-title>  
        <english-title>IMAGE CORRECTION METHOD AND DISPLAY MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241202B">H04N13/106</main-classification>  
        <further-classification edition="201801120241202B">H04N13/122</further-classification>  
        <further-classification edition="201801120241202B">H04N13/344</further-classification>  
        <further-classification edition="201801120241202B">H04N13/327</further-classification>  
        <further-classification edition="202401120241202B">G06T5/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊皓亘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HAO-XUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像校正方法包含提供左眼影像以及右眼影像；提供左眼注視位置以及右眼注視位置；根據左眼注視位置消除畸變左眼影像且根據右眼注視位置消除畸變右眼影像，以得到無畸變左眼影像以及無畸變右眼影像；根據左眼注視位置對無畸變左眼影像進行亮度校正以及根據右眼注視位置對無畸變右眼影像進行亮度校正；以及對無畸變左眼影像以及無畸變右眼影像進行立體渲染以得到立體左眼影像以及立體右眼影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image correction method include providing a left eye image and a right eye image; providing a left eye gazing position and a right eye gazing position; dewarping the left eye image according to the left eye gazing position and dewarping the right eye image according to the right eye gazing position to acquire a dewarped left eye image and a dewarped right eye image; correcting a brightness of the dewarped left eye image according to the left eye gazing position and correcting a brightness of the dewarped right eye image according to the right eye gazing position; and 3D rendering the dewarped left eye image and the dewarped right eye image to acquire a stereoscopic left eye image and a stereoscopic right eye image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示模組</p>  
        <p type="p">110:影像生成單元</p>  
        <p type="p">112:顯示器</p>  
        <p type="p">114:計算單元</p>  
        <p type="p">116:投影鏡組</p>  
        <p type="p">118:照明模組</p>  
        <p type="p">120:反射單元</p>  
        <p type="p">130:眼動追蹤相機</p>  
        <p type="p">I:影像</p>  
        <p type="p">O:觀察者</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="147" publication-number="202611663"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611663.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611663</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽光電模組系統及最大功率點追蹤方法</chinese-title>  
        <english-title>PHOTOVOLTAIC MODULE SYSTEM AND MAXIMUM POWER TRACKING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">G05F1/67</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙貴祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, KUEI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　氏寶玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, THI BAO NGOC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基於改良型貓群演算法之最大功率點追蹤方法。改良型貓群演算法包含預設貓的數量及預設迭代次數，設定貓的初始位置、速度及模式旗標，計算貓的適應值，並將適應值中的最大者設為最佳適應值，判斷貓的模式旗標為搜尋旗標或追蹤旗標，依據貓更新後的適應值更新資料庫之最佳適應值，判斷最佳適應值是否為最大輸出功率或迭代次數是否等於預設迭代次數，以輸出最大輸出功率。藉此，提供最大輸出功率至負載。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A maximum power tracking method based on an improved cat algorithm is proposed. The improved cat algorithm includes setting a number of a plurality of cats and a predetermined iteration number, setting a original position, a speed and a mode flag of each of the cats, calculating a fitness value of each of the cats, and setting the biggest fitness value as a best fitness value, determining the mode flag of each of the cats is a searching flag or a tracking flag, updating the best fitness value of the database according to the updated fitness value of the cat, determining whether the best fitness value is the maximum output power or the iteration time is equal to the predetermined iteration number to output the maximum output power. Thus, the maximum power tracking method of the present disclosure can provide the maximum output power to the load.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:最大功率點追蹤方法</p>  
        <p type="p">S11,S12:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="148" publication-number="202612384"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612384.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612384</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133539</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種建立網路連線的方法及系統</chinese-title>  
        <english-title>A METHOD FOR ESTABLISHING NETWORK CONNECTIONS AND SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250102B">H04W76/10</main-classification>  
        <further-classification edition="200601120250102B">H04L12/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詮隼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>O'PRUEBA TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江易達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YI-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許郡泓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種建立網路連線的方法包含：由控制器監聽控制頻道；由客戶端設備產生隨機的對等節點識別碼加入控制頻道；在控制頻道發現客戶端設備，將客戶端設備顯示在控制器的待連線列表中，並判斷是否同意客戶端設備被控管；產生對應於客戶端設備的客戶端設備的公鑰及客戶端設備的私鑰；透過控制頻道傳送客戶端設備的公鑰、客戶端設備的私鑰及對應於控制器之控制器的公鑰；以及刪除隨機的對等節點識別碼，並以在控制頻道中取得之客戶端設備的公鑰作為客戶端設備的對等節點識別碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for establishing network connections includes: monitoring a controller channel by a controller; generating a random peer ID for participating in the controller channel by a customer premise equipment (CPE), displaying the CPE on a pending connection list, and determining whether the CPE should be controlled by the controller; generating a pair of CPE’s public key and CPE’s private key corresponding to the CPE; transmitting the CPE’s public key, the CPE’s private key, and the controller’s public key corresponding to the controller via the controller channel; deleting the random peer ID, and using the CPE’s public key obtained from the controller channel as the CPE's peer ID.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">112:控制器</p>  
        <p type="p">122:客戶端設備</p>  
        <p type="p">412:控制器管理者</p>  
        <p type="p">502:使用者</p>  
        <p type="p">512:控制頻道</p>  
        <p type="p">b1~b10:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="149" publication-number="202612531"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612531.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612531</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133540</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250529B">H10D84/83</main-classification>  
        <further-classification edition="202501120250529B">H10D84/01</further-classification>  
        <further-classification edition="200601120250529B">H01L21/027</further-classification>  
        <further-classification edition="200601120250529B">H01L21/302</further-classification>  
        <further-classification edition="200601120250529B">H01L21/203</further-classification>  
        <further-classification edition="200601120250529B">H01L21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雋佾科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUCKEWELL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉時豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倪誠聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NI, CHENG-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇　杰特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUJITH, SUDHEENDRAN SWAYAMPRABHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡居諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包含多個晶粒、保護層、多個閘極金屬層、多個源極金屬層及汲極金屬層。各晶粒包含閘極接點、源極接點及汲極接點，汲極接點設置於晶粒的背面。多個閘極開口個別地對應於各晶粒之閘極接點，多個源極開口個別地對應於各晶粒之源極接點。各閘極金屬層經由保護層之多個閘極開口電性連接位於同一列的多個閘極接點。各源極金屬層經由保護層之多個源極開口電性連接位於同一列的多個源極接點。汲極金屬層形成於多個晶粒的背面。汲極金屬層電性連接多個汲極接點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device comprises a plurality of dies, a protective layer, a plurality of gate metal layers, a plurality of source metal layers and a drain metal layer. Each dies comprises a gate contact, a source contact and a drain contact. The drain contact is disposed on the backside of the die. Gate openings respectively correspond to the gate contact of each of the dies. Source openings respectively correspond to the source contact of each of the dies. Each of the gate metal layers is electrically connected to the gate contacts located in the same row through the gate openings of the protective layer. Each of the source metal layers is electrically connected to the source contacts located in the same row through the source openings of the protective layer. The drain metal layer is formed on the backside of the dies and electrically connects to the drain contacts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">10:晶粒</p>  
        <p type="p">101:閘極接點</p>  
        <p type="p">102:源極接點</p>  
        <p type="p">103:汲極接點</p>  
        <p type="p">11:保護層</p>  
        <p type="p">111:閘極開口</p>  
        <p type="p">112:源極開口</p>  
        <p type="p">12:閘極金屬層</p>  
        <p type="p">13:源極金屬層</p>  
        <p type="p">19:汲極金屬層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="150" publication-number="202610595"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610595.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610595</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133543</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>心電圖顯示方法</chinese-title>  
        <english-title>ELECTROCARDIOGRAM DISPLAY METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250402B">A61B5/318</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商宇心生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QT MEDICAL, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾千倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHIEN-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳右庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種心電圖顯示方法包含有下列步驟。首先，測量心電圖，然後，根據量測的心電圖，計算複數個心電圖導程的ST振幅，並將量測後的心電圖，根據心臟部位進行分類，以及分類繪製心電圖導程的ST振幅的長條圖。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrocardiogram display method includes the following steps. First, the electrocardiogram is measured, the ST amplitudes of multiple electrocardiogram leads are then calculated based on the measured electrocardiogram, the measured electrocardiograms are classified according to regions of the heart, and bar charts of the ST amplitudes of the electrocardiogram leads are drawn according to the region classification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:心電圖顯示方法</p>  
        <p type="p">110~170:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="151" publication-number="202610907"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610907.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610907</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133547</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合材質雙層容器的邊捲成形裝置</chinese-title>  
        <english-title>A ROLLED-EDGE FORMING APPARATUS FOR A DOUBLY LAYER CONTAINER MADE OF COMPOSITE MATERIAL.</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B65D8/06</main-classification>  
        <further-classification edition="200601120241105B">A47G19/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>銓寶工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUMPOWER MACHINERY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝樹林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, SHU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王慶賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHING-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秉男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, PIN-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏志煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHIH-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴柏丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, PO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林奕德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪銘憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種複合材質雙層容器的邊捲成形裝置，該裝置包含：一機台，該機台由上而下分別連接有一上基板、支撐基板及一下基板，該上基板上方設置一旋轉動力源；一壓制機構，該壓制機構包含一旋轉軸，該旋轉軸上端穿伸過上基板並與旋轉動力源連接，該旋轉軸下端穿伸過該支撐基板並與一胚頭座連接，該旋轉軸於該上基板及該支撐基板間至少連接兩個旋轉凸輪；一邊捲機構，該邊捲機構至少包含兩組邊捲器，每一組邊捲器包含一連動桿，該連動桿上端連接一被動輪，該被動輪可受該旋轉凸輪推動，該連動桿下端穿伸過該支撐基板並與一邊捲輪連接；一頂昇機構，該頂昇機構是設置在下基板上方，該頂昇動力源連接一頂昇桿，該頂昇桿上端與該承載盤連接，該承載盤可供雙層容器置放。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention is about a kind of rolled-edge forming apparatus for a doubly layer container made of composite material. This apparatus in-cludes: A) a machine, which connects to an upper board, a supporting board and a lower board in the order from the top to bottom. The top of the upper board has a rotating power source. B) A pressing mechanism, which includes a rotating shaft. The upper rotating shaft extends through the upper board and is connected to the rotating power source. The lower rotating shaft extends through the supporting board and is connected to the raw base. There are at least two rotating cams connected on the rotat-ing shaft between the upper and and the supporting board. C) an edge rolling mechanism, which includes at least two sets of edge rolling devic-es. Each set of the edge rolling device has a linkage rod. The upper link-age rod is connected to a driven wheel. The driven wheel is driven by the rotating cam. The lower linkage rod extends through the supporting rod and is connected to one side of the roller. D) A lifting mechanism, which is located on the top of the lower board. The lifting power source is con-nected to a lifting rod. The upper lifting rod is connected to a holding tray. The holding tray can be used for placing double layer containers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:裝置</p>  
        <p type="p">12:支撐基板</p>  
        <p type="p">121:穿孔</p>  
        <p type="p">2:壓制機構</p>  
        <p type="p">21:旋轉軸</p>  
        <p type="p">22:胚頭座</p>  
        <p type="p">23:旋轉凸輪</p>  
        <p type="p">3:邊捲機構</p>  
        <p type="p">31:邊捲器</p>  
        <p type="p">32:連動桿</p>  
        <p type="p">33:被動輪</p>  
        <p type="p">34:邊捲輪</p>  
        <p type="p">341:捲合成型部</p>  
        <p type="p">4:頂昇機構</p>  
        <p type="p">41:固定座</p>  
        <p type="p">411:下層板</p>  
        <p type="p">412:支撐桿</p>  
        <p type="p">413:上層板</p>  
        <p type="p">414:穿孔</p>  
        <p type="p">42:頂昇動力源</p>  
        <p type="p">43:承載盤</p>  
        <p type="p">44:頂昇桿</p>  
        <p type="p">5:雙層容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="152" publication-number="202612115"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612115.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612115</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝件及其製法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">H01L23/28</main-classification>  
        <further-classification edition="200601120241129B">H01L23/34</further-classification>  
        <further-classification edition="200601120241129B">H01L23/488</further-classification>  
        <further-classification edition="200601120241129B">H01L21/56</further-classification>  
        <further-classification edition="200601120241129B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華泰電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董悦明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNG, YUEH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊家銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏伯晏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, PO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘冠霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, GUAN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝村隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, TSUN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>花瑞銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之半導體封裝件包含：一底座基板；一中介基板，設置在該底座基板上；複數第一導電塊，夾設在該底座基板與該中介基板之間，並電性連接到該底座基板與該中介基板；一第一晶片，設置在該中介基板上；以及複數第二導電塊，夾設在該中介基板與該第一晶片之間，並電性連接到該中介基板與該第一晶片。其中該等第二導電塊通過該中介基板電性連接到該等第一導電塊。本發明另提供一種製造上述半導體封裝件的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a semiconductor package. The semiconductor package includes a base substrate, an intermediate substrate, a plurality of first conductive bumps, a first die, and a plurality of second conductive bumps. The intermediate substrate is disposed on the base substrate. The first conductive bumps are disposed between and electrically connected to the base substrate and the intermediate substrate. The first die is disposed on the intermediate substrate. The second conductive bumps are disposed between and electrically connected to the intermediate substrate and the first die. The second conductive bumps are electrically connected to the first conductive bumps through the intermediate substrate. The present invention further provides a method of manufacturing the above semiconductor package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:底座基板</p>  
        <p type="p">111:第一表面</p>  
        <p type="p">112:第二表面</p>  
        <p type="p">113:導電線路</p>  
        <p type="p">114:導電線路</p>  
        <p type="p">115:電鍍通孔</p>  
        <p type="p">120:中介基板</p>  
        <p type="p">121:第一表面</p>  
        <p type="p">122:第二表面</p>  
        <p type="p">131:第一導電塊</p>  
        <p type="p">132:第二導電塊</p>  
        <p type="p">140:底膠</p>  
        <p type="p">150:晶片</p>  
        <p type="p">170:底膠</p>  
        <p type="p">180:散熱框</p>  
        <p type="p">190:錫球</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="153" publication-number="202612116"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612116.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612116</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133556</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝件及其製法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">H01L23/28</main-classification>  
        <further-classification edition="200601120241129B">H01L23/34</further-classification>  
        <further-classification edition="200601120241129B">H01L23/488</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華泰電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董悦明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNG, YUEH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊家銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王品鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PIN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏伯晏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, PO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>花瑞銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之半導體封裝件包含：一基板，具有一頂面與一底面；一晶片，設置在該基板的該頂面上；一導熱材料，設置在該晶片與該基板之間，用以將該晶片附著在該基板上；複數銲線，各該銲線的一端連接到該晶片而另一端連接到該基板的該頂面；一封膠體，形成在該基板的該頂面上並覆蓋該晶片與該等銲線；以及一散熱框，設置在該基板的該頂面上並圍繞該封膠體。本發明另提供一種製造上述半導體封裝件的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a semiconductor package. The semiconductor package includes a substrate, a die, a thermally conductive material, a plurality of bonding wires, a molding compound, and a heat-dissipating frame. The substrate has opposing top and bottom surfaces. The thermally conductive material is disposed between the die and the substrate to attach the die to the top surface of the substrate. One end of each of the bonding wires is connected to the die and the other end of each of the bonding wires is connected to the top surface of the substrate. The molding compound is formed on the top surface of the substrate to cover the die and the bonding wires. The heat-dissipating frame is disposed on the top surface of the substrate to enclose the molding compound. The present invention further provides a method of manufacturing the above semiconductor package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板</p>  
        <p type="p">111:第一表面</p>  
        <p type="p">112:第二表面</p>  
        <p type="p">113:導電線路</p>  
        <p type="p">114:導電線路</p>  
        <p type="p">115:電鍍通孔</p>  
        <p type="p">120:導熱材料</p>  
        <p type="p">130:第一晶片</p>  
        <p type="p">132:銲線</p>  
        <p type="p">140:第二晶片</p>  
        <p type="p">142:導電塊</p>  
        <p type="p">150:封膠體</p>  
        <p type="p">151:第一表面</p>  
        <p type="p">152:第二表面</p>  
        <p type="p">153:第三表面</p>  
        <p type="p">160:散熱框</p>  
        <p type="p">161:第一表面</p>  
        <p type="p">162:第二表面</p>  
        <p type="p">163:第三表面</p>  
        <p type="p">164:第四表面</p>  
        <p type="p">170:散熱片</p>  
        <p type="p">180:被動元件</p>  
        <p type="p">190:錫球</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="154" publication-number="202611356"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611356.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611356</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133557</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有反光紗之織物</chinese-title>  
        <english-title>FABRIC WITH REFLECTIVE YARN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120240929B">D03D15/547</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勤倫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANCE LINE INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚明賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, MING-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有反光紗之織物，包含有：一織物，具有不會反光的非反光紗；一或一條以上的反光紗，以織、縫、車縫、繡或緹花等方式與該織物結合，並外露於該織物的至少一表面；該反光紗具有顏色，該反光紗的顏色與該織物的顏色相同、不同或呈對比。該反光紗的顏色與織物的顏色相同時，不易於該織物中分辨出反光紗，使得反光紗形同隱藏於該織物中。該反光紗的顏色與織物的顏色不同或形成對比時，可使反光紗凸顯於該織物上。當織物上的有色圖案由相同顏色的反光紗與非反光紗形成，且該圖案的顏色與織物的顏色不同時，該反光紗仍隱藏於織物中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fabric with reflective yarn, including a fabric with non-reflective yarns; one or more reflective yarns that are combined with the fabric by weaving, sewing, stitching, embroidery or jacquard, and are exposed on at least one surface of the fabric. The reflective yarn has a color, and the color of the reflective yarn is the same as, different from or contrasting with the color of the fabric. When the color of the reflective yarn is the same as the color of the fabric, it is difficult to distinguish the reflective yarn from the fabric, rendering the reflective yarn virtually invisible in the fabric. When the color of the reflective yarn is different from or contrasts with the color of the fabric, the reflective yarn can be highlighted on the fabric. When a colored pattern on the fabric is formed by the reflective yarn and non-reflective yarns of the same color, and the color of the pattern is different from the color of the fabric, the reflective yarn remains hidden in the fabric.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:反光紗</p>  
        <p type="p">30A:織物</p>  
        <p type="p">35:齒</p>  
        <p type="p">36:布料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="155" publication-number="202612396"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612396.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612396</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133560</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板模組和太陽能板</chinese-title>  
        <english-title>CIRCUIT BOARD MODULE AND SOLAR PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H05K1/02</main-classification>  
        <further-classification edition="200601120250102B">H05K1/03</further-classification>  
        <further-classification edition="202501120250102B">H10F10/00</further-classification>  
        <further-classification edition="202501120250102B">H10F77/63</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商慶鼎精密電子（淮安）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QING DING PRECISION ELECTRONICS (HUAIAN) CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳伯元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種電路板模組和太陽能板。本申請通過在電路基板上設置具有電致變色性能的介電層，介電層在高溫條件下可通過調整電壓實現由透明態變為深色的轉變，從而能遮光並降低矽電池和電路基板的溫度，進而能改善太陽能板整體的發熱問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a circuit board module and a solar panel. By arranging a dielectric layer with electrochromic properties on a circuit substrate, the dielectric layer can be transformed from a transparent state to a dark color by adjusting the voltage under high temperature conditions, thereby shading and reducing the temperature of the silicon cell and the circuit substrate, and further improving the heating problem of the solar panel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路板模組</p>  
        <p type="p">10:電路基板</p>  
        <p type="p">20:矽電池</p>  
        <p type="p">30:介電層</p>  
        <p type="p">11:基材層</p>  
        <p type="p">12:導電線路層</p>  
        <p type="p">13:覆蓋膜層</p>  
        <p type="p">101:第一導通孔</p>  
        <p type="p">102:第二導通孔</p>  
        <p type="p">103:導電膏</p>  
        <p type="p">104:錫膏</p>  
        <p type="p">121:第一焊盤</p>  
        <p type="p">122:第二焊盤</p>  
        <p type="p">131:膠層</p>  
        <p type="p">132:覆蓋膜基材</p>  
        <p type="p">41:微控制器</p>  
        <p type="p">42:溫度感測器</p>  
        <p type="p">301:凹槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="156" publication-number="202612307"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612307.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612307</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133561</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支援乙太網路供電功能的裝置及其供電控制方法</chinese-title>  
        <english-title>DEVICE WITH POWER OVER ETHERNET FUNCTIONALITY AND POWER SUPPLY CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H04L12/10</main-classification>  
        <further-classification edition="200601120241202B">H04L12/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康聯訊科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONNECTION TECHNOLOGY SYSTEMS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳友信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王昱程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡弘熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種支援乙太網路供電功能的裝置及其供電控制方法。所述裝置包括訊號處理模組、PoE控制模組以及主控制器。PoE控制模組用以依據PoE控制訊號決定是否啟用該PoE功能，其中當PoE控制模組接收到致能的PoE控制訊號時，啟用PoE功能，以產生直流電源並施加至第二電訊號上。主控制器依據指示光訊號的連接狀態的第一狀態訊號以及指示光訊號的訊號強度的第二狀態訊號，發出對應的PoE控制訊號以控制PoE控制模組的運作。當主控制器接收到的第一狀態訊號與第二狀態訊號同時為致能時，產生致能的PoE控制訊號以啟用PoE功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device with PoE functionality and a power supply control method thereof are provided. The device includes a signal processing module, a PoE control module, and a main controller. The PoE control module is configured to determine whether to enable the PoE functionality based on a PoE control signal. When the PoE control module receives an enabling PoE control signal, the PoE functionality is activated to generate a DC power supply which is applied to the second electrical signal. The main controller sends a PoE control signal to control the operation of the PoE control module, based on a first status signal indicating the connection state of an optical signal and a second status signal indicating the signal intensity of the optical signal. When the main controller receives the first and the second status signals being enabled, the main controller activates the PoE functionality.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光纖網路設備</p>  
        <p type="p">20_1~20_n:終端設備</p>  
        <p type="p">100:支援PoE功能的裝置</p>  
        <p type="p">110:光電轉換模組</p>  
        <p type="p">120:訊號處理模組</p>  
        <p type="p">130:PoE控制模組</p>  
        <p type="p">140:主控制器</p>  
        <p type="p">Fp_1~Fp_m:光纖連接埠</p>  
        <p type="p">Rp_1~Rp_n:乙太網路連接埠</p>  
        <p type="p">Pdc:直流電源</p>  
        <p type="p">Se、Spd1~Spdn:電訊號</p>  
        <p type="p">Spc:PoE控制訊號</p>  
        <p type="p">Sopt:光訊號</p>  
        <p type="p">Slos、Slks:指示訊號</p>  
        <p type="p">St1:第一狀態訊號</p>  
        <p type="p">St2:第二狀態訊號</p>  
        <p type="p">St3:第三狀態訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="157" publication-number="202611411"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611411.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611411</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133565</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線性滑軌及其滑動模組與循環座</chinese-title>  
        <english-title>LINEAR GUIDEWAY, SLIDING MODULE THEREOF, AND CIRCULATION SEAT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">F16C29/06</main-classification>  
        <further-classification edition="200601120241230B">F16C33/58</further-classification>  
        <further-classification edition="200601120241230B">F16C19/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>精浚科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OME TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖國富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, KUO-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張若軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JO-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋岳儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, YUE-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種線性滑軌及其滑動模組與循環座。所述循環座形成有兩條滾動通道且用來安裝於一滑塊。所述循環座包含兩個轉向段、兩個外軌道段、及兩個內軌道段。每個所述轉向段具有鄰近於所述滑塊的一佈局面，其凹設形成有連通於兩條所述滾動通道的一多通道油路。兩個所述外軌道段各自的兩端分別連接於兩個所述轉向段。兩個所述內軌道段各自的兩端分別連接於兩個所述轉向段。每個所述外軌道段能通過兩個所述轉向段而與其中一個所述內軌道段相連通，以共同形成有一條所述滾動通道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a linear guideway, a sliding module thereof, and a circulation seat thereof. The circulation seat has two sliding channels and is configured to assemble to a slider. The circulation seat includes two turning segments, two outer track segments, and two inner track segments. Each of the two turning segments has a layout surface arranged adjacent to the slider and having a multi-path oil channel that is recessed therein and that is in spatial communication with the two sliding channels. Two ends of each of the two outer track segments are respectively connected to the two turning segments. Two ends of each of the two inner track segments are respectively connected to the two turning segments. Each of the two outer track segments is connected to one of the two inner track segments through the two turning segments so as to jointly form one of the two sliding channels.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:線性滑軌</p>  
        <p type="p">1:軌道</p>  
        <p type="p">11:上表面</p>  
        <p type="p">12:側表面</p>  
        <p type="p">2:滑動模組</p>  
        <p type="p">21:滑塊</p>  
        <p type="p">213:安裝端面</p>  
        <p type="p">22:循環座</p>  
        <p type="p">221:轉向段</p>  
        <p type="p">2214:多通道油路</p>  
        <p type="p">2214a:入油通道</p>  
        <p type="p">2214b:供油通道</p>  
        <p type="p">2214c:儲油通道</p>  
        <p type="p">222:外軌道段</p>  
        <p type="p">223:內軌道段</p>  
        <p type="p">23:滾動件</p>  
        <p type="p">3:防塵件</p>  
        <p type="p">3a:下防塵件</p>  
        <p type="p">3b:上防塵件</p>  
        <p type="p">4:端蓋</p>  
        <p type="p">41:注油通道</p>  
        <p type="p">P:滾動通道</p>  
        <p type="p">O1:第一開口</p>  
        <p type="p">O2:第二開口</p>  
        <p type="p">D2:厚度方向</p>  
        <p type="p">D3:寬度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="158" publication-number="202611412"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611412.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611412</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線性滑軌及其防塵機構</chinese-title>  
        <english-title>LINEAR GUIDEWAY AND DUST-PROOF MECHANISM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241121B">F16C29/08</main-classification>  
        <further-classification edition="200601120241121B">F16C19/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>精浚科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OME TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖國富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, KUO-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張若軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JO-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋岳儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, YUE-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李美琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MEI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種線性滑軌及其防塵機構。所述防塵機構包含一滑動模組、設置於所述滑動模組的兩個下防塵件、及分別固定於所述滑動模組兩端的兩個端蓋。每個所述下防塵件具的兩個末端部突伸出所述滑動模組。其中一個所述端蓋的兩個所述下溝槽沿滑動方向分別對應於另一個所述端蓋的兩個下溝槽。沿所述滑動方向配置且分屬於不同所述端蓋的任兩個所述下溝槽，其分別套設於一個所述下防塵件的兩個所述末端部、並與所述滑動模組於所述滑動方向共同具有一總長度，其為相對應所述下防塵件的長度的100.4%～110%，以使每個所述下防塵件能沿所述滑動方向移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a linear guideway and a dust-proof mechanism thereof. The dust-proof mechanism includes a sliding module, two lower dust-proof members disposed on the sliding module, and two end caps that are respectively fixed onto two ends of the sliding module. Two end portions of each of the two lower dust-proof members protrude from the sliding module. Two lower grooves of one of the two end caps respectively correspond in position to the two lower grooves of another one of the two end caps along a sliding direction. Any two of the lower grooves respectively belonging to the two end caps and arranged along the sliding direction are respectively sleeved around the two end portions of one of the two lower dust-proof members, and are cooperated with the sliding module to jointly have a total length that is within a range from 100.4%～110% of a length of the corresponding lower dust-proof member, such that each of the two lower dust-proof members is slidable along the sliding direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:滑動模組</p>  
        <p type="p">21:滑塊</p>  
        <p type="p">213:安裝端面</p>  
        <p type="p">22:循環座</p>  
        <p type="p">223:內軌道段</p>  
        <p type="p">23:滾動件</p>  
        <p type="p">3:防塵件</p>  
        <p type="p">31:末端部</p>  
        <p type="p">3a:下防塵件</p>  
        <p type="p">3b:上防塵件</p>  
        <p type="p">4:端蓋</p>  
        <p type="p">42:下溝槽</p>  
        <p type="p">43:上溝槽</p>  
        <p type="p">L:總長度</p>  
        <p type="p">L3a:長度</p>  
        <p type="p">L3b:長度</p>  
        <p type="p">G:間隙</p>  
        <p type="p">D1:滑動方向</p>  
        <p type="p">D2:厚度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="159" publication-number="202610775"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610775.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610775</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133569</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓研磨設備的主軸傾角調整結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B24B41/04</main-classification>  
        <further-classification edition="201201120241105B">B24B37/005</further-classification>  
        <further-classification edition="200601120241105B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玟締科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINDIRS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宣志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳育齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶圓研磨設備的主軸傾角調整結構，係包含：一主軸座；一主軸單元，具有一法蘭連接於一本體的外環周面；及數個傾角調整組，各該傾角調整組具有數個結合組件及一微調器，該數個結合組件結合該法蘭與該主軸座，該微調器具有一座體、一調整件及一連動件，該座體具有一貫穿孔，該調整件設於該貫穿孔，該調整件的一螺合部螺合該座體，該連動件可連動該主軸座位移地設於該貫穿孔，該調整件的一第一受力面朝向該連動件的一第二受力面，該第一受力面的面積不同於該第二受力面的面積，且該第一受力面與該第二受力面之間形成一液壓腔室。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:主軸座</p>  
        <p type="p">11:環座</p>  
        <p type="p">12:背板</p>  
        <p type="p">2:主軸單元</p>  
        <p type="p">21:本體</p>  
        <p type="p">22:法蘭</p>  
        <p type="p">3:傾角調整組</p>  
        <p type="p">M:研磨盤</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="160" publication-number="202611556"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611556.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611556</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133572</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120241125B">G02B1/115</main-classification>  
        <further-classification edition="201901120241125B">B32B7/023</further-classification>  
        <further-classification edition="200601120241125B">G02F1/1335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉芳驛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, FANG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭烱傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIUNG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃吉銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱韋名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, WEI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括顯示面板以及抗反射膜。抗反射膜設置於顯示面板上。抗反射膜包括依序堆疊的第一高折射率層與第一低折射率層。第一高折射率層的厚度大於第一低折射率層的厚度。在CIE標準施照體D65光源照射下，顯示裝置的反射光在CIE L*a*b*色彩空間滿足以下條件：0 ≥ a* ≥ -6 且 0 ≥ b* ≥ -6。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a display panel and an anti-reflective film. The anti-reflective film is disposed on the display panel. The anti-reflective film includes a first high refractive index layer and a first low refractive index layer stacked in sequence. A thickness of the first high refractive index layer is greater than a thickness of the first low refractive index layer. Under a CIE standard illuminant D65 light source, a reflected light of the display device satisfies the following conditions in a CIE L*a*b* color space: 0 ≥ a* ≥ -6 and 0 ≥ b* ≥ -6.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示裝置</p>  
        <p type="p">100:顯示面板</p>  
        <p type="p">110:第一基板</p>  
        <p type="p">120:畫素定義層</p>  
        <p type="p">121:隔板</p>  
        <p type="p">122:開口</p>  
        <p type="p">130:發光單元</p>  
        <p type="p">132:接墊</p>  
        <p type="p">140:黏著層</p>  
        <p type="p">145:封裝層</p>  
        <p type="p">150:色轉換單元</p>  
        <p type="p">151:色轉換層</p>  
        <p type="p">152:阻擋層</p>  
        <p type="p">160:彩色濾光單元</p>  
        <p type="p">161:彩色濾光層</p>  
        <p type="p">162:黑色矩陣層</p>  
        <p type="p">170:第二基板</p>  
        <p type="p">200:抗反射膜</p>  
        <p type="p">210:第一高折射率層</p>  
        <p type="p">220:第一低折射率層</p>  
        <p type="p">T1、T2:厚度</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="161" publication-number="202612175"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612175.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612175</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133574</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙圓極化天線裝置</chinese-title>  
        <english-title>DUAL CIRCULARLY POLARIZED ANTENNA DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H01Q21/24</main-classification>  
        <further-classification edition="200601120241202B">H01Q21/00</further-classification>  
        <further-classification edition="200601120241202B">H01Q1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>耀登科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUDEN TECHNO CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙君恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, CHUN-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種雙圓極化天線裝置。雙圓極化天線裝置包含一多層板、四個天線、四個耦合微帶線、及一耦合模組。四個天線設置於多層板上。四個耦合微帶線分別位置對應四個天線。各耦合微帶線包含一中間軸部、兩個C字部與至少兩個魚骨部。兩個C字部設置於中間軸部的兩側。各C字部具有一開口，各C字部的開口朝向遠離中間軸部的方向。至少兩個魚骨部連接中間軸部及兩個C字部。各魚骨部包含一主軸段、及連接主軸段的至少一延伸段。主軸段與至少一延伸段相互垂直。耦合模組通過四個耦合微帶線電性耦接各天線的一接收接點及一傳輸接點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dual circularly polarized antenna device is provided. The dual circularly polarized antenna device includes a multilayer board, four antennas, at least two coupling microstrip lines, and a coupling module. The four antennas are arranged on the multilayer board. The at least two coupling microstrip lines correspond in position to the four antennas. Each coupling microstrip line comprises a central shaft, two C-shaped sections, and four fishbone sections. The two C-shaped sections are positioned on both sides of the central shaft. Each C-shaped section has an opening facing away from the central shaft. The four fishbone sections connect the central shaft and the two C-shaped sections. Each fishbone section comprises a main shaft segment and at least one extension segments connected to the main shaft segment. The main shaft segment and the at least one extension segments are perpendicular to each other. The coupling module is electrically coupled to a receiving contact and a transmission contact of each antenna by the four coupling microstrip lines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:多層板</p>  
        <p type="p">3:耦合微帶線</p>  
        <p type="p">RP:接收接點</p>  
        <p type="p">TP:傳輸接點</p>  
        <p type="p">X:參考點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="162" publication-number="202611417"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611417.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611417</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133575</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙剛輪諧波減速裝置</chinese-title>  
        <english-title>DOUBLE RIGID WHEEL HARMONIC REDUCTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">F16H49/00</main-classification>  
        <further-classification edition="200601120241230B">F16H55/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盟英科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAIN DRIVE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝昆儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, KUN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHI-GEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李冠興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, GUAN-SHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種雙剛輪諧波減速裝置，其包含靜態剛輪、後蓋、前蓋、動態剛輪、柔輪及波產生器。靜態剛輪的兩側分別設置後蓋及前蓋。後蓋包含環狀片體及筒狀結構，環狀片體的一側凸出形成有筒狀結構。動態剛輪及柔輪設置於前蓋與後蓋之間。波產生器包含柔性軸承、連接構件及外轉子馬達。連接構件包含環狀底部，環狀底部的一側凸出形成環狀壁。環狀壁、筒狀結構的外側及環狀片體共同形成容置空間。外轉子馬達設置於容置空間，且外轉子固定於環狀底部，內定子與後蓋相互固定。外轉子能帶動連接構件旋轉，連接構件能帶動柔性軸承旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a dual rigid wheel harmonic reduction device, comprising a static rigid wheel, a rear cover, a front cover, a dynamic rigid wheel, a flexible wheel, and a wave generator. The static rigid wheel has a rear cover and a front cover installed on its two sides respectively. The rear cover comprises an annular plate body and a tubular structure, with the tubular structure protruding from one side of the annular plate body. The dynamic rigid wheel and the flexible wheel are positioned between the front cover and the rear cover. The wave generator comprises a flexible bearing, a connecting component, and an outer rotor motor. The connecting component comprises an annular base with an annular wall protruding from one side of the annular base. The annular wall, the outer side of the tubular structure and the annular plate body collectively form an accommodation space. The outer rotor motor is installed in the accommodation space, with the outer rotor fixed to the annular base and the inner stator fixed to the rear cover. The outer rotor can drive the connecting component to rotate, which in turn can drive the flexible bearing to rotate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雙剛輪諧波減速裝置</p>  
        <p type="p">1:靜態剛輪</p>  
        <p type="p">13:剛輪本體</p>  
        <p type="p">131:第一內側齒狀結構</p>  
        <p type="p">2:前蓋</p>  
        <p type="p">22:前環狀凸起結構</p>  
        <p type="p">3:動態剛輪</p>  
        <p type="p">31:第二內側齒狀結構</p>  
        <p type="p">4:柔輪</p>  
        <p type="p">41:第一齒狀結構</p>  
        <p type="p">42:第二齒狀結構</p>  
        <p type="p">43:溝槽</p>  
        <p type="p">5:波產生器</p>  
        <p type="p">51:柔性軸承</p>  
        <p type="p">52:連接構件</p>  
        <p type="p">521:環狀底部</p>  
        <p type="p">522:環狀壁</p>  
        <p type="p">5221:環狀凸台</p>  
        <p type="p">53:外轉子馬達</p>  
        <p type="p">531:外轉子</p>  
        <p type="p">532:內定子</p>  
        <p type="p">54:前軸承</p>  
        <p type="p">55:後軸承</p>  
        <p type="p">6:後蓋</p>  
        <p type="p">61:環狀片體</p>  
        <p type="p">611:穿孔</p>  
        <p type="p">62:筒狀結構</p>  
        <p type="p">621:中空通道</p>  
        <p type="p">63:後環狀凸起結構</p>  
        <p type="p">7:環狀油封結構</p>  
        <p type="p">8:外環狀油封結構</p>  
        <p type="p">9:交叉滾子軸承</p>  
        <p type="p">Q:螺絲</p>  
        <p type="p">AX:軸線</p>  
        <p type="p">SP1:容置空間</p>  
        <p type="p">SP2:封閉空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="163" publication-number="202612470"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612470.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612470</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133576</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250102B">H10B41/44</main-classification>  
        <further-classification edition="202301120250102B">H10B41/47</further-classification>  
        <further-classification edition="202501120250102B">H10D84/03</further-classification>  
        <further-classification edition="200601120250102B">H01L21/302</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯佳鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏偟任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, HUANG-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱崇益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體記憶裝置及其形成方法，包括基底、兩個浮動閘極、兩個控制閘極、一第一介電層、一側壁子以及一抹除閘極。浮動閘極設置在基底上。控制閘極分別設置在浮動閘極上。第一介電層設置在浮動閘極和控制閘極之間。側壁子設置在各控制閘極的側壁上。抹除閘極設置在基底上，位在浮動閘極之間。其中，各浮動閘極包含一側壁，其上具有朝向該抹除閘極的扇貝狀表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory device and a fabricating method thereof includes a substrate, two floating gates, two controlling gates, a first dielectric layer, two controlling gates, a spacer, and an erase gate. The floating gates are disposed on the substrate. The controlling gates are respectively disposed on the two floating gates. The first dielectric layer is disposed between the two floating gates and the two controlling gates in a vertical direction. The spacer is disposed on a sidewall of each of the two controlling gates. The erase gate is disposed on the substrate, between the two floating gates, wherein each of the two floating gates includes a sidewall with a scallops shaped surface facing the erase gate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體記憶裝置</p>  
        <p type="p">100:基底</p>  
        <p type="p">102:絕緣層</p>  
        <p type="p">110:浮動閘極</p>  
        <p type="p">110s:側壁</p>  
        <p type="p">112:扇貝狀表面</p>  
        <p type="p">112t:突出部</p>  
        <p type="p">114:第一介電層</p>  
        <p type="p">116:控制閘極</p>  
        <p type="p">116s:側壁</p>  
        <p type="p">116t:頂面</p>  
        <p type="p">118:阻擋層</p>  
        <p type="p">120:側壁子</p>  
        <p type="p">120s:側壁</p>  
        <p type="p">122:第二介電層</p>  
        <p type="p">124:抹除閘極</p>  
        <p type="p">124t:頂面</p>  
        <p type="p">126:第三介電層</p>  
        <p type="p">W1:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="164" publication-number="202611762"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611762.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611762</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133577</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝置安全性分析方法與電子裝置</chinese-title>  
        <english-title>DEVICE SECURITY ANALYZATION METHOD AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250102B">G06F21/53</main-classification>  
        <further-classification edition="201301120250102B">G06F21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東擎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASROCK INDUSTRIAL COMPUTER CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余兆偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHAO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉佳明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置安全性分析方法與電子裝置。所述方法包括：響應於外部裝置連接至電子裝置，將外部裝置維持於隔離狀態，並判斷外部裝置是否符合解隔離條件；若外部裝置不符合解隔離條件，在外部裝置處於隔離狀態的期間，透過沙盒分析模組對外部裝置執行安全性分析；以及根據安全性分析的執行結果，決定是否將外部裝置切換為連接狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device security analyzation method and an electronic device are disclosed. The method includes: in response to an external device being connected to the electronic device, maintaining the external device to be in an isolation status, and determining whether the external device meets a de-isolation condition; if the external device does not meet the de-isolation condition, in a time period that the external device being in the isolation status, performing a security analyzation on the external device through a sandbox analyzation module; and determining whether to change the external device to be in a connection status according to an execution result of the security analyzation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401~S406:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="165" publication-number="202611913"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611913.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611913</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133579</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>增強資料寫入功能的系統</chinese-title>  
        <english-title>DATA WRITING CAPABILITY ENHANCEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G11C11/02</main-classification>  
        <further-classification edition="202301120241202B">H10B61/00</further-classification>  
        <further-classification edition="200601120241202B">G11C7/12</further-classification>  
        <further-classification edition="200601120241202B">G11C7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張庭豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TING-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯建宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, CHIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃正同</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHENG-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">增強資料寫入功能的系統包含磁阻式隨機存取記憶體陣列、第一驅動電路、第二驅動電路及增強電路。第一驅動電路耦接於磁阻式隨機存取記憶體陣列，用以提供複數個字元線電壓至磁阻式隨機存取記憶體陣列。第二驅動電路，耦接於磁阻式隨機存取記憶體陣列的一側，用以提供複數個源極線電壓及複數個位元線電壓至磁阻式隨機存取記憶體陣列的該側。增強電路，耦接於磁阻式隨機存取記憶體陣列的另一側，用以提供複數個源極線補償電壓及複數個位元線補償電壓至磁阻式隨機存取記憶體陣列的另一側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data writing capability enhancement system includes a magnetic random access memory (MRAM) array, a first driving circuit, a second driving circuit, and a boosting circuit. The first driving circuit is coupled to the MRAM array for providing a plurality of word line voltages to the MRAM array. The second driving circuit is coupled to one side of the MRAM array for providing a plurality of source line voltages and a plurality of bit line voltages to the side of the MRAM array. The boosting circuit is coupled to another side of the MRAM array for providing a plurality of source line compensation voltages and a plurality of bit line compensation voltages to the another side of the MRAM array.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:增強資料寫入功能的系統</p>  
        <p type="p">10:磁阻式隨機存取記憶體陣列</p>  
        <p type="p">11:第一驅動電路</p>  
        <p type="p">12:第二驅動電路</p>  
        <p type="p">13:增強電路</p>  
        <p type="p">10a:記憶體單元</p>  
        <p type="p">BL1至BLN:位元線</p>  
        <p type="p">SL1至SLN:源極線</p>  
        <p type="p">WL1至WLM:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="166" publication-number="202610758"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610758.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610758</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133593</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鑽石切削刀頭及其製造方法</chinese-title>  
        <english-title>DIAMOND CUTTING HEAD AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241030B">B23P15/32</main-classification>  
        <further-classification edition="200601120241030B">B23P5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江信有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FINE ABRASIVES TAIWAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳偉恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YA WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種鑽石切削刀頭及其製法。鑽石切削刀頭呈片狀，且包括：一結合部，其主要由鎢鋼材構成；及一鑽石切削部，其藉燒結而結合於該結合部上，該鑽石切削部具有一切削尖端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A diamond cutting head and a method of manufacturing the same are disclosed. The diamond cutting head has a sheet shape, which comprises: an engaging portion which is mainly composed of tungsten steel; and a diamond cutting portion which is bonded bonded to the engaging portion by sintering, wherein the cutting portion has a cutting tip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鑽石切削刀頭</p>  
        <p type="p">110:鑽石切削部</p>  
        <p type="p">120:結合部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="167" publication-number="202611601"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611601.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611601</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>曲面顯示裝置</chinese-title>  
        <english-title>CURVED DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">G02F1/1333</main-classification>  
        <further-classification edition="200601120241125B">G09F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商群豐駿科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARUX TECHNOLOGY PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅靜怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHING-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種曲面顯示裝置，包括框架以及設置於框架上的曲面顯示面板。曲面顯示面板包括具有第一側的第一曲面玻璃基板以及設置於第一側上的晶片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A curved display device is provided. The curved display device includes a frame and a curved display panel disposed on the frame. The curved display panel includes a first curved glass substrate having a first side and a chip disposed on the first side.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:曲面顯示裝置</p>  
        <p type="p">110:框架</p>  
        <p type="p">121:第一曲面玻璃基板</p>  
        <p type="p">122:第一側</p>  
        <p type="p">124:邊緣</p>  
        <p type="p">126:第二曲面玻璃基板</p>  
        <p type="p">127:邊緣</p>  
        <p type="p">130:晶片</p>  
        <p type="p">151:上偏光片</p>  
        <p type="p">A-A,B-B:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="168" publication-number="202610786"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610786.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610786</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133596</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙向往復式氣動工具</chinese-title>  
        <english-title>BIDIRECTIONAL RECIPROCATING PNEUMATIC TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240920B">B25D11/06</main-classification>  
        <further-classification edition="200601120240920B">B25D11/12</further-classification>  
        <further-classification edition="200601120240920B">B25D17/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日研氣動有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIYAN PNEUMATIC CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐鈺晉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YU JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建平</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種雙向往復式氣動工具，包括：一鎚擊組，包括：一軸桿，包括一軸孔、一連通該軸孔之進氣口及設於一端的組接結構，該進氣口供輸入一驅動氣體，該組接結構供連接一待作業工件；一活塞，徑向連接凸設於該軸桿，包括至少一貫孔及至少一容設於該至少一貫孔之切換閥，該至少一切換閥可切換至一第一位置或一第二位置而阻斷該至少一貫孔；及一缸體，可移動地套設於該軸桿，該缸體之內部被該活塞區分成不相連通之一第一氣室及一第二氣室，該第一氣室可經由該至少一貫孔連通該活塞之內部，該第二氣室可經由該至少一貫孔連通該活塞之內部，該缸體包括多個通氣孔，該多個通氣孔分別連通該第一氣室及該第二氣室；其中，當該至少一切換閥位於該第一位置，該第一氣室連通該軸孔，該驅動氣體進入該第一氣室而驅動該缸體相對該活塞朝靠近該組接結構之方向位移至撞擊該活塞；當該至少一切換閥位於該第二位置，該第二氣室連通該軸孔，該驅動氣體進入該第二氣室而驅動該缸體相對該活塞朝遠離該組接結構之方向位移至撞擊該活塞；一調氣機構，設於該鎚擊組，可相對該鎚擊組調整而改變遮蔽該多個通氣孔的狀態，使得該多個通氣孔中連通該第一氣室的部分通氣孔之未被該調氣機構遮蔽的截面積總和，可被調整為大於、等於或小於該多個通氣孔中連通該第二氣室的部分通氣孔之未被該調氣機構遮蔽的截面積總和。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bidirectional reciprocating pneumatic tool is provided, wherein the bidirectional reciprocating pneumatic tool includes: a hammering assembly, including: a shaft, including an axial hole, an air inlet in communication with the axial hole, and a connection structure disposed at one end, the air inlet being configured for inputting a driving air, the connection structure being configured for being connected to a workpiece to be operated; a piston being radially connected to and protruding from the shaft, including at least one through hole and at least one switching valve received in the at least one through hole, the at least one switching valve being switchable to a first position or a second position to block the at least one through hole; and a cylinder, movably sleeved on the shaft, an interior of the cylinder being divided by the piston into a first chamber and a second chamber which are non-communicated with each other, the first chamber being able to be in communicated with an interior of the piston through the at least one through hole, the second chamber being able to be in communicated with the interior of the piston through the at least one through hole, the cylinder including a plurality of ventilation holes, the plurality of ventilation holes being in communicated with the first chamber and the second chamber respectively; wherein when the at least one switching valve is in the first position, the first chamber is in communicated with the axial hole, and the driving air enters the first chamber and drives the cylinder to move relative to the piston in a direction close to the connection structure to impact the piston; when the at least one switching valve is in the second position, the second chamber is in communication with the axial hole, and the driving air enters the second chamber to drive the cylinder relative to the piston in a direction away from the connection structure to impact the piston; an air adjusting mechanism, connected to the hammering assembly and movable relative to the hammering assembly, being adjustable to change a state of covering the plurality of ventilation holes so that a total cross-sectional area of a portion of the plurality of ventilation holes in communication with the first chamber which is not covered by the air adjusting mechanism is adjusted to be greater than, equal to or less than a total cross-sectional area of another portion of the plurality of ventilation holes in communication with the second chamber which is not covered by the air adjusting mechanism.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雙向往復式氣動工具</p>  
        <p type="p">10:鎚擊組</p>  
        <p type="p">11:軸桿</p>  
        <p type="p">112:進氣口</p>  
        <p type="p">113:組接結構</p>  
        <p type="p">133:通氣孔</p>  
        <p type="p">134:第一通氣孔</p>  
        <p type="p">135:第二通氣孔</p>  
        <p type="p">20:調氣機構</p>  
        <p type="p">21:第一調節件</p>  
        <p type="p">211:第一穿孔</p>  
        <p type="p">22:第二調節件</p>  
        <p type="p">221:第二穿孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="169" publication-number="202611952"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611952.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611952</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133597</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁吸電子元件及其製造方法與手作電路組</chinese-title>  
        <english-title>MAGNETIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF, AND HAND-MADE CIRCUIT KIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241121B">H01F7/02</main-classification>  
        <further-classification edition="200601120241121B">H05K1/18</further-classification>  
        <further-classification edition="200601120241121B">H05K13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>億觀生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIDMICS BIOTECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉長青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHANG-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昌佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林書聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種磁吸電子元件，包括一電路板、一功能性部件、至少一磁鐵以及至少一導電固定件。電路板具有一電路圖案；功能性部件設置於電路板並與電路圖案電性連接；磁鐵設置於電路板之一側；導電固定件用以電性連接電路板之電路圖案、並固定磁鐵。本發明亦揭露一種上述磁吸電子元件的製造方法以及運用上述磁吸電子元件的手作電路組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention discloses a magnetic electronic component, which includes a circuit board, a functional unit, at least one magnet and at least one conductive fixing member. The circuit board has a circuit pattern. The functional unit is arranged on the circuit board and are electrically connected to the circuit pattern. The magnet is located at one side of the circuit board. The conductive fixing member is configured to electrically connect the circuit pattern of the circuit board and fix the magnet. The invention also discloses a manufacturing method of the magnetic electronic component and a hand-made circuit kit using the magnetic electronic component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:磁吸電子元件</p>  
        <p type="p">22:電路板</p>  
        <p type="p">24:功能性部件</p>  
        <p type="p">26:磁鐵</p>  
        <p type="p">28:導電固定件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="170" publication-number="202610705"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610705.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610705</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133602</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>復健菜單修正系統及其修正方法</chinese-title>  
        <english-title>REHABILITATION MENU CORRECTING SYSTEM AND CORRECTING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120240927B">A63F13/80</main-classification>  
        <further-classification edition="201401120240927B">A63F13/46</further-classification>  
        <further-classification edition="201401120240927B">A63F13/213</further-classification>  
        <further-classification edition="201801120240927B">G16H20/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞東學校財團法人亞東科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIA EASTERN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李民慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MIN-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳槐桂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HUAI-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王清松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHING-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳暐迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-DI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱俊憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, JUN-XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周郁欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YU-QIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昭竣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田慧勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN, HUI-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種復健菜單修正系統及其修正方法，復健菜單修正系統包含一監測模組、連結於所述監測模組的一虛擬實境裝置與連結所述虛擬實境裝置的一伺服器。伺服器包含預測單元與電性耦接於預測單元的一分類單元。預測單元依據一復健者進行一復健遊戲的一遊戲分數以及監測模組監測復健者產生的一生理資料，產生一預設分數。分類單元接收預設分數，並依據預測分數產生一分類信號，並輸出分類信號至虛擬實境裝置，使虛擬實境裝置依據分類信號調整復健遊戲的等級供復健者進行下一次復健。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a rehabilitation menu correcting system and correcting method thereof. The rehabilitation menu correcting system includes a monitoring module, a virtual reality device that is linked to the monitoring, and a server that is linked to the virtual reality device. The server includes a prediction unit and a classification unit that is electrically coupled to the prediction unit. The prediction unit is operated to generate a predication score according to a game score of a rehabilitator playing a rehabilitation game and a physiology data that is generated by the monitoring module monitoring the rehabilitator. The classification unit is operated to receive the predication score and generate a classification signal according to the predication score, and the classification unit is operated to output the classification signal to the virtual reality device, such that the virtual reality device is operated to adjust a level of the rehabilitation game according to the classification signal for the rehabilitator to play the next rehabilitation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:復健菜單修正系統</p>  
        <p type="p">1:監測模組</p>  
        <p type="p">11:攝影處理模組</p>  
        <p type="p">111:攝像頭</p>  
        <p type="p">112:處理模組</p>  
        <p type="p">12:生理量測單元</p>  
        <p type="p">2:虛擬實境裝置</p>  
        <p type="p">3:伺服器</p>  
        <p type="p">31:預測單元</p>  
        <p type="p">32:分類單元</p>  
        <p type="p">33:資料庫</p>  
        <p type="p">34:查詢單元</p>  
        <p type="p">35:設定單元</p>  
        <p type="p">36:警示單元</p>  
        <p type="p">N:網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="171" publication-number="202612157"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612157.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612157</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133621</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及其製造方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H01L25/075</main-classification>  
        <further-classification edition="202501120250102B">H10H20/855</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范鐸正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, TO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝承志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHENG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施景耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，其內的各顯示像素包括下板結構以及上板結構。下板結構包括下基板、多個發光元件、光學層以及多個第一間隔件。上板結構包括上基板、多個第二間隔件以及填充層。填充層包括多個填充單元。該些第一間隔件分別對應該些填充單元，且該些第二間隔件的頂面與上基板的距離大於該些填充單元的頂面與上基板的距離。一種顯示裝置的製造方法亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device is provided, where each display pixel thereof includes a bottom-plate structure and a top-plate structure. The bottom-plate structure includes a bottom substrate, a plurality of light-emitting elements, an optic layer and a plurality of first spacers. The top-plate structure includes a top substrate, a plurality of second spacers and a filling layer. The filling layer includes a plurality of filling units. The first spacers correspond to the filling units, respectively. A distance between a top surface of the second spacers and the top substrate is greater than a distance between a top surface of the filling units and the top substrate. A manufacturing method of a display device is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10、20:基板</p>  
        <p type="p">30:下板結構</p>  
        <p type="p">40:上板結構</p>  
        <p type="p">50:空氣間隙</p>  
        <p type="p">100:顯示裝置</p>  
        <p type="p">100T:頂面</p>  
        <p type="p">101、102:間隔件</p>  
        <p type="p">102T:頂面</p>  
        <p type="p">103:色轉層</p>  
        <p type="p">103T:頂面</p>  
        <p type="p">104:填充單元</p>  
        <p type="p">104T:頂面</p>  
        <p type="p">105:散射層、透明層</p>  
        <p type="p">105T:頂面</p>  
        <p type="p">BM:黑色矩陣</p>  
        <p type="p">CF1、CF2、CF3:色阻層</p>  
        <p type="p">D1、D2、D4、D5:距離</p>  
        <p type="p">D3:厚度</p>  
        <p type="p">GL:填充層</p>  
        <p type="p">L1、L2、L3:發光元件</p>  
        <p type="p">RL:光線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="172" publication-number="202612495"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612495.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612495</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133623</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/60</main-classification>  
        <further-classification edition="202501120250102B">H10D62/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>世界先進積體電路股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳姿宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TZU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋建憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, CHIEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴云凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅宗仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAO, CHUNG-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖志成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHIH-CHERNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒振東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZOU, CHEN-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括具有第一導電類型的一基底、位於基底上且具有第一導電類型的一磊晶層、自磊晶層的頂表面延伸至磊晶層中的一溝槽結構和具有第二導電類型的一井區、具有第一導電類型的第一重摻雜部和具有第二導電類型的第二重摻雜部形成於井區中。溝槽結構包括一導電部以及包覆導電部的側壁和底面的一絕緣層。井區與溝槽結構在第一方向上相隔開，且井區在第二方向上延伸，第一重摻雜部和第二重摻雜部沿第一方向延伸，且於第二方向交替設置。半導體裝置還包括一閘極結構形成於磊晶層的頂表面上並對應井區，其中閘極結構沿著第二方向延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate having a first conductivity type, an epitaxial layer on the substrate and having the first conductivity type, a trench structure and a well region having a second conductivity type that extend from the top surface of the epitaxial layer into the epitaxial layer, a first heavily doped portion having the first conductivity type and a second heavily doped portion having the second conductivity type that are formed in the well region. The trench structure includes a conductive portion and an insulating layer that covers the sidewalls and the bottom surface of the conductive portion. The well region and the trench structure are separated from each other by a distance in the first direction. The well region extends in the second direction. The first and second heavily doped portions extend in the first direction and are alternately disposed in the second direction. The semiconductor device further includes a gate structure on the top surface of the epitaxial layer and over the well region. The gate structure extends in the second direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103:溝槽結構</p>  
        <p type="p">103-1:第一溝槽結構</p>  
        <p type="p">103-2:第二溝槽結構</p>  
        <p type="p">104:絕緣層</p>  
        <p type="p">105:導電部</p>  
        <p type="p">107:輕摻雜部</p>  
        <p type="p">108:第一重摻雜部</p>  
        <p type="p">108-S1,109-S1:第一側壁</p>  
        <p type="p">108-S2,109-S2:第二側壁</p>  
        <p type="p">109:第二重摻雜部</p>  
        <p type="p">110-1:第一閘極結構</p>  
        <p type="p">110-2:第二閘極結構</p>  
        <p type="p">S11,S22:側壁</p>  
        <p type="p">d1:距離</p>  
        <p type="p">L1:第一長度</p>  
        <p type="p">L2:第二長度</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">C1-C1,C2-C2:剖面線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="173" publication-number="202610885"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610885.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610885</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133627</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙向可收合的側方腳踏板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241121B">B62J25/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崑山科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUN SHAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱韋丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, WEI CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張幼銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YOU MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白峻維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAI, JUN WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳承祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHENG YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙向可收合的側方腳踏板，包含一座體，自一側面凹設有一側開口及一容置空間，該側開口連通該容置空間，該座體有相對的一前側面及一後側面，有一活動空間貫穿該前側面及該後側面，而分別在該前側面形成一前開口，以及在該後側面形成一後開口；一支撐軸，沿一高度方向延伸並置入該容置空間，該支撐軸的相對二端分別固定於該頂面及該底面；一腳踏板本體，有位於相對二端的一樞接部及一踩踏部，該樞接部套於該支撐軸；一彈性體，可伸縮的套設於該支撐軸，使該彈性體持續的對該腳踏板本體施加一彈力；藉此，在該活動空間中，該腳踏板本體能相對該支撐軸任意旋轉擺動使該踩踏部可選擇的對應該前開口、該側開口或該後開口的位置；當該踩踏部旋轉至對應該側開口的位置時，踩踏該腳踏板本體抵抗該彈力，使該腳踏板本體恰能沿該高度方向朝該底面的位置移動，並使該腳踏板本體被卡掣於該前側面及該後側面之間而無法相對該支撐軸旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:座體</p>  
        <p type="p">2:支撐軸</p>  
        <p type="p">3:扣環</p>  
        <p type="p">4:腳踏板本體</p>  
        <p type="p">5:彈性體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="174" publication-number="202610593"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610593.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610593</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133628</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膝關節檢測系統</chinese-title>  
        <english-title>KNEE JOINT INSPECTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">A61B5/11</main-classification>  
        <further-classification edition="200601120241125B">A61B7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立高雄科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIUN HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周偉倪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, WILLY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳永保</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KENNY GUNAWAN, TJAKRAWINATA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡佑霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIAN, YOU LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種膝關節檢測系統，包含一分析單元，有一訊號分析模組及一聲音接收元件，該訊號分析模組電性連接該聲音接收元件；一吸附單元，有一吸盤，該吸盤有一抽氣空間，以及連通該抽氣空間的一開口；有一真空泵，該真空泵有一抽氣端，該抽氣端經由一管路連接於該吸盤而連通該抽氣空間；有一微控制器，該微控制器電性連接該真空泵；有一連線模組，該微控制器經由該連線模組電性連接該分析單元；一收音單元，有一聲音擷取元件及一聲音發射元件，該聲音擷取元件固定於該吸盤並位於該抽氣空間中，該聲音擷取元件電性連接該聲音發射元件，該聲音發射元件電性連接該聲音接收元件；一影像擷取單元，電性連接該訊號分析模組；藉此，能在閉鎖鍊動作的模式量測膝關節的聲音變化及角度變化，進一步判斷膝關節的健康狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:分析單元</p>  
        <p type="p">11:訊號分析模組</p>  
        <p type="p">12:聲音接收元件</p>  
        <p type="p">2:吸附單元</p>  
        <p type="p">22:真空泵</p>  
        <p type="p">23:微控制器</p>  
        <p type="p">24:連線模組</p>  
        <p type="p">25:壓力感測元件</p>  
        <p type="p">3:收音單元</p>  
        <p type="p">31:聲音擷取元件</p>  
        <p type="p">32:放大器</p>  
        <p type="p">33:聲音發射元件</p>  
        <p type="p">4:影像擷取單元</p>  
        <p type="p">5:影像顯示單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="175" publication-number="202611842"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611842.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611842</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133631</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生成減碳護照的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR GENERATING A CARBON REDUCING PASSPORT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241101B">G06Q50/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許國洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, KUO-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許國洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, KUO-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江國慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種生成減碳護照的系統，包括：至少一數據收集盒，通訊地連接生產設備，用於收集其生產數據；一企業伺服器，通訊地連接上述至少一數據收集盒，依據上述生產數據產生減碳數據；一雲端管理平台，依據由企業伺服器上傳的減碳數據，透過人工智慧減碳模型，產生有關生產設備的減碳績效文件；以及一區塊鏈，通訊地連接雲端管理平台，接收減碳績效文件並據以生成減碳護照，以達防偽效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a system for generating a carbon reducing passport, which includes at least one data collection box communicatively connected to production equipment for collecting its production data, an enterprise server communicatively connected to the at least one data collection box for generating carbon reduction data according to the production data, a cloud management platform generates carbon reduction performance documents related to the production equipment by an artificial intelligence carbon reduction model based on the carbon reduction data uploaded by the enterprise server. The carbon reduction performance documents are uploaded to the blockchain to generate a carbon reduction passport with anti-counterfeiting effect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:雲端管理平台</p>  
        <p type="p">102a:人工智慧減碳模型</p>  
        <p type="p">102b:碳足跡國際數據交換標準轉換器</p>  
        <p type="p">102-1:標準一</p>  
        <p type="p">102-2:標準二</p>  
        <p type="p">104:企業伺服器</p>  
        <p type="p">106:區塊鏈</p>  
        <p type="p">108:數據採集盒</p>  
        <p type="p">110:生產設備</p>  
        <p type="p">110a:能耗設備</p>  
        <p type="p">110b:第一減碳設備</p>  
        <p type="p">110c:第二減碳設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="176" publication-number="202610817"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610817.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610817</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133636</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保護膜形成用複合片及附保護膜之半導體晶圓的製造方法</chinese-title>  
        <english-title>COMPOSITE SHEET FOR FORMING PROTECTIVE FILM AND METHOD FOR PREPARING SEMICONDUCTOR WAFER WITH PROTECTIVE FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250401B">B32B7/06</main-classification>  
        <further-classification edition="201901120250401B">B32B7/027</further-classification>  
        <further-classification edition="200601120250401B">H01L21/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶化科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAFERCHEM TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉晏全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, YAN-CHIUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳燈桂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TENG-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭亦傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王品勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PIN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林岳霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUEH-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉育銓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YU-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種保護膜形成用複合片，其包含一切割模片以及一保護膜形成用膜。切割模片包含一基材層及形成於基材層上之一黏著層。保護膜形成用膜夾持於一第一離型膜與一第二離型膜之間，第二離型膜以剝離的方式形成一離型面並貼合於黏著層，且離型面的一殘存接著力為60%至85%。藉此，透過選用特定的第二離型膜，使離型面具有較低的殘存接著力並將其與黏著層貼合，且後續加熱固化後可輕易分離保護膜形成用膜與切割模片，以降低製程不良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a composite sheet for forming protective film, which includes a dicing tape and a film for forming protective film. The dicing tape includes a substrate and an adhesive layer formed on the substrate. The film for forming protective film is sandwiched between a first release film and a second release film. The second release film is peeled off to form a release surface and the release surface is attached to the adhesive layer, wherein a residual adhesion force of the release surface is 60% to 85%. Therefore, the release surface has the lower residual adhesion force by selecting a specific second release film, and then the release surface is attached to the adhesive layer, so that the film for forming protective film and the dicing tape can be easily separated after subsequent heating and curing to reduce the process defect rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:保護膜形成用複合片</p>  
        <p type="p">110:切割模片</p>  
        <p type="p">111:基材層</p>  
        <p type="p">112:黏著層</p>  
        <p type="p">120:保護膜形成用膜</p>  
        <p type="p">121:第一離型膜</p>  
        <p type="p">130:離型面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="177" publication-number="202611873"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611873.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611873</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133639</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示器參數調整方法與電子裝置</chinese-title>  
        <english-title>DISPLAY PARAMETER ADJUSTMENT METHOD AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241202B">G06V10/12</main-classification>  
        <further-classification edition="202201120241202B">G06V10/70</further-classification>  
        <further-classification edition="202201120241202B">G06V40/18</further-classification>  
        <further-classification edition="200601120241202B">H04N5/262</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝明峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李安正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, AN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李源益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUAN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示器參數調整方法與電子裝置。所述方法包括：透過電子裝置的攝影鏡頭擷取外部影像以獲得影像串流，其中所述影像串流包括多張影像，且所述多張影像皆呈現使用者的臉部影像；通過人工智慧模型分析所述影像串流，以偵測使用者在目標時間範圍內的至少一次的眨眼動作；根據眨眼動作，更新計數值；響應於計數值符合預設條件，觸發顯示器調整操作，以調整顯示器的至少一顯示參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display parameter adjustment method and an electronic device are disclosed. The method includes: capturing an external image through a photographic lens of the electronic device to obtain an image stream, wherein the image stream includes a plurality of images which present facial images of a user; analyzing, by an artificial intelligence (AI) model, the image stream to detect a blink action of the user within a target time range; updating a count value according to the blink action; and in response to the count value meeting a preset condition, triggering a display adjustment operation to adjust at least one display parameter of a display.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S501~S506:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="178" publication-number="202611770"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611770.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611770</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133642</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件以及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250102B">G06F30/392</main-classification>  
        <further-classification edition="202501120250102B">H10D64/00</further-classification>  
        <further-classification edition="202501120250102B">H10D64/20</further-classification>  
        <further-classification edition="201201120250102B">B24B37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林岳璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUEH CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃善禧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHAN-SHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體元件以及其形成方法，此半導體元件包括：半導體基底；隔離區，位於半導體基底中；虛設金屬閘極，位於隔離區上，其中虛設金屬閘極沿著虛設金屬閘極的第一軸與虛設金屬閘極的第二軸被分割為多個獨立分離區塊，其中第一軸與第二軸彼此垂直；介電層，覆蓋虛設金屬閘極；高阻值阻抗層，位於介電層上；以及蓋層，位於高阻值阻抗層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device and a method of forming the same are provided. The semiconductor device includes: a semiconductor substrate; an isolation region in the semiconductor substrate; a dummy metal gate on the isolation region, wherein the dummy metal gate is divided into a plurality of discrete segments along a first axis of the dummy metal gate and a second axis of the dummy metal gate, where the first axis and the second axis are perpendicular to each other; a dielectric layer covering the dummy metal gate; a high resistance impedance layer on the dielectric layer; and a capping layer on the high resistance impedance layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體基底</p>  
        <p type="p">110:隔離區</p>  
        <p type="p">120:閘極氧化層</p>  
        <p type="p">130:側壁子</p>  
        <p type="p">140:接觸窗蝕刻停止層</p>  
        <p type="p">150:層間介電層</p>  
        <p type="p">160:上部介電層</p>  
        <p type="p">170:介電層</p>  
        <p type="p">180:高阻值阻抗層</p>  
        <p type="p">190:蓋層</p>  
        <p type="p">cc’:剖線</p>  
        <p type="p">C:半導體元件</p>  
        <p type="p">DG1S:獨立分離區塊</p>  
        <p type="p">DG1SB:大獨立分離區塊</p>  
        <p type="p">DG1SS:小獨立分離區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="179" publication-number="202611765"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611765.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611765</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片上系統和資料保護方法</chinese-title>  
        <english-title>SYSTEM ON CHIP AND METHOD FOR DATA PROTECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241202B">G06F21/78</main-classification>  
        <further-classification edition="201301120241202B">G06F21/70</further-classification>  
        <further-classification edition="200601120241202B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯保辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, PAO-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種晶片上系統，包括一控制暫存器、一狀態機以及一例外事件儲存器。控制暫存器被配置以依序接收一第一存取要求、一第二存取要求以及一第三存取要求，並輸出一例外事件或一功能訊號。狀態機被配置以依序接收第一存取要求、第二存取要求以及第三存取要求，且被配置以響應於第一存取要求進入對應第一存取要求之存取操作的狀態，並響應於第二存取要求或第三存取要求和第一存取要求的相關性，將一判斷訊號輸出至控制暫存器。例外事件儲存器被配置以接收並記錄例外事件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system on chip including a control register, a state machine, and an exception event storage is provided. The control register is configured to receive a first access request, a second access request, and a third access request in sequence, and output an exception event or a function signal. The state machine is configured to receive the first access request, the second access request, and the third access request in sequence. The state machine is further configured to enter a state corresponding to the access operation of the first access request in response to the first access request, and output a determination signal to the control register in response to the correlation between the first access request and the second access request or the third access request. The exception event storage is configured to receive and record the exception event.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶片上系統(SOC)</p>  
        <p type="p">110:控制暫存器</p>  
        <p type="p">120:狀態機</p>  
        <p type="p">130:例外事件儲存器</p>  
        <p type="p">140:功能區塊</p>  
        <p type="p">140a,140b,140c,140n:功能電路</p>  
        <p type="p">AC1,AC2,AC3:存取要求</p>  
        <p type="p">DET:判斷訊號</p>  
        <p type="p">ER:例外事件</p>  
        <p type="p">AVT:功能訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="180" publication-number="202611378"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611378.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611378</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133668</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋼筋籠與補漿管之改良結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">E04C5/16</main-classification>  
        <further-classification edition="200601120241105B">E04G21/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛文佐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛文佐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林邦棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鋼筋籠與補漿管之改良結構，係包括一鋼筋籠、至少一補漿管、至少一固定件、至少一帆布及至少一帆布保護件，該鋼筋籠係由複數鋼筋所組成，所述每一鋼筋彼此橫向及縱向交錯排列，該補漿管相鄰所述鋼筋並呈中空狀以使一水泥漿灌入，該固定件設於所述鋼筋上，該帆布對應固設於所述固定件上以使其覆蓋所述鋼筋，該帆布保護件上設有至少一卡扣件，該卡扣件對應卡設於該固定件上，以使該帆布保護件垂吊於該帆布上。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:鋼筋</p>  
        <p type="p">12:固定件</p>  
        <p type="p">13:帆布</p>  
        <p type="p">14:帆布保護件</p>  
        <p type="p">15:卡扣件</p>  
        <p type="p">3:混凝土</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="181" publication-number="202610893"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610893.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610893</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133671</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車鏈輪組件</chinese-title>  
        <english-title>BICYCLE SPROCKET ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241121B">B62M9/12</main-classification>  
        <further-classification edition="201001120241121B">B62M9/128</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣微轉股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AD-II ENGINEERING INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王建彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIEN PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張桂榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUEI JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種自行車鏈輪組件，供設於一棘輪座，包括：至少一鏈輪組及一限抵機構。該至少一鏈輪組包括一供沿一軸向套設於該棘輪座之套接部；該限抵機構包括至少一設於該套接部之迫緊單元，各該迫緊單元至少部分可調整地移動且可供抵接於該棘輪座。藉此，該自行車鏈輪組件可裝設於現有之棘輪座，適用範圍廣泛，可有效降低配置成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bicycle sprocket assembly is provided, configured to be disposed on a cassette body, including: at least one sprocket set and a restricting mechanism. The at least one sprocket set includes a sleeving portion configured to be sleeved on the cassette body in an axial direction. The restricting mechanism includes at least one urging unit disposed on the sleeving portion, and at least a portion of each of the plurality of urging units is adjustable to move and abut against the cassette body. Therefore, the bicycle sprocket assembly can be assembled to the existing cassette body, which has a wide range of applications and effectively reduces costs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:棘輪座</p>  
        <p type="p">111:容槽</p>  
        <p type="p">112:連通槽</p>  
        <p type="p">14:支架</p>  
        <p type="p">20:限抵機構</p>  
        <p type="p">211:推塊</p>  
        <p type="p">212:固緊件</p>  
        <p type="p">22:彈性件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="182" publication-number="202611667"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611667.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611667</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133672</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G06F1/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和碩聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGATRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊偉澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEI-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置包括一機體、一驅動件、滑接於驅動件的多個從動件及一轉盤。機體具有一內部空間、連通於內部空間的一底部開槽及位於內部空間中的多個導向滑槽。驅動件設置於內部空間中。驅動件適以繞一軸線相對於機體旋轉，且所述多個導向滑槽圍繞軸線。所述多個從動件滑設於所述多個導向滑槽中。轉盤沿軸線可移動地設置於機體，且位置對應底部開槽。轉盤與所述多個從動件相抵接。驅動件適以帶動所述多個從動件，使所述多個從動件推動轉盤沿軸線移動，並讓轉盤的至少部分從底部開槽突出以抬起機體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device including a body, a driving member, a plurality of driven members slidably connected to the driving member, and a turntable is provided. The body has an internal space, a bottom slot communicating with the internal space, and a plurality of guiding grooves located in the internal space. The driving member is disposed in the internal space. The driving member is adapted to rotate around an axis relative to the body and the guiding grooves surrounding the axis. The driven members are slidably disposed in the guiding grooves. The turntable is disposed at a position of the body as corresponding to the bottom slot and is able to side along the axis. The turntable abuts against the driven members. The driving member is adapted to drive the driven members, causing the driven members to push the turntable to move along the axis. As a result, at least a portion of the turntable protrudes from the bottom slot, thereby lifting the body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:機體</p>  
        <p type="p">101:內部空間</p>  
        <p type="p">103:導向滑槽</p>  
        <p type="p">104:頂部開槽</p>  
        <p type="p">110:驅動件</p>  
        <p type="p">111:弧形滑槽</p>  
        <p type="p">120:從動件</p>  
        <p type="p">121:滑動本體</p>  
        <p type="p">122:滑動凸柱</p>  
        <p type="p">140:控制鈕</p>  
        <p type="p">141:定位卡凸</p>  
        <p type="p">150:滑輪</p>  
        <p type="p">160:繩索</p>  
        <p type="p">170:定位齒條</p>  
        <p type="p">2A:區域</p>  
        <p type="p">AX:軸線</p>  
        <p type="p">R1:第一旋轉方向</p>  
        <p type="p">R2:第二旋轉方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="183" publication-number="202610596"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610596.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610596</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133673</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>舌根懸吊手術穿線器械</chinese-title>  
        <english-title>ROOT OF TONGUE SUSPENSION SURGICAL THREADING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">A61B17/00</main-classification>  
        <further-classification edition="200601120241001B">A61B17/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃喬瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CIAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃喬瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CIAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佑俞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種舌根懸吊手術穿線器械，其包括：一管體，該管體為中空狀，該管體其中一端的側壁成型有一安裝孔；一定位桿，設於該管體內部，該定位桿的一端延伸成型有一固定孔；以及一穿線鉤，其中一端成型有一固定端；其中，該定位桿能夠在受到外力後沿著該管體的軸向方向進行往復運動，當該穿線鉤以該固定端通過該安裝孔並穿入該固定孔後，該定位桿可通過往復運動朝遠離該安裝孔的方向軸向移動，使該固定端被該固定孔固定，以將該穿線鉤穩固的固定於該管體上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a root of tongue suspension surgical threading device, which includes: a tubular body, the tubular body being hollow, with one end of the tubular body's sidewall forming an installation hole; a positioning rod, arranged inside the tubular body, with one end of the positioning rod extending to form a fixing hole; and a threading hook, with one end forming a fixed end. The positioning rod can move axially along the tubular body in a reciprocating motion when external force is applied. When the threading hook passes through the installation hole with the fixed end and enters the fixing hole, the positioning rod can move axially away from the installation hole through the reciprocating motion, securing the fixed end in the fixing hole, thereby firmly securing the threading hook to the tubular body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:舌根懸吊手術穿線器械</p>  
        <p type="p">101:管體</p>  
        <p type="p">1011:安裝孔</p>  
        <p type="p">1013:開口</p>  
        <p type="p">1013':開口</p>  
        <p type="p">102:定位桿</p>  
        <p type="p">1021:固定孔</p>  
        <p type="p">103:穿線鉤</p>  
        <p type="p">1031:固定端</p>  
        <p type="p">1032:穿線孔</p>  
        <p type="p">1033:穿刺尖端</p>  
        <p type="p">104:調節旋鈕</p>  
        <p type="p">1042:止滑紋路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="184" publication-number="202611435"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611435.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611435</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133686</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光源散熱結構及其光源裝置</chinese-title>  
        <english-title>LIGHT SOURCE HEAT DISSIPATION STRUCTURE AND LIGHT SOURCE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120240930B">F21V29/503</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊烙亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IROYAL TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃清河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃忠捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUNG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈永屏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIA, YUNG-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光源散熱結構，包括發光元件及承載板。承載板具有承載面，且發光元件設置於承載面；其中承載板之材料至少為高導熱係數材料，其導熱係數為380 W/mK以上。高導熱係數材料在承載面構成第一區域，且發光元件接觸設置於第一區域。一種包括前述光源散熱結構的光源裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light source heat dissipation structure includes a light-emitting element and a carrying plate. The carrying plate has a carrying surface, and the light-emitting element is disposed on the carrying surface; the material of the carrying plate is at least a high thermal conductivity material, and its thermal conductivity is 380 W/mK or above 380 W/mK. The high thermal conductivity material forms a first area on the carrying surface, and the light-emitting element is disposed in contact with the first area. A light source device including the aforementioned light source heat dissipation structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光源散熱結構</p>  
        <p type="p">100:發光元件</p>  
        <p type="p">200:承載板</p>  
        <p type="p">220:通孔</p>  
        <p type="p">260:凹口</p>  
        <p type="p">400:熱敏元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="185" publication-number="202611764"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611764.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611764</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133692</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預設密碼檢測系統及其操作方法</chinese-title>  
        <english-title>PRESET PASSWORD DETECTION SYSTEM AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241202B">G06F21/70</main-classification>  
        <further-classification edition="201301120241202B">G06F21/60</further-classification>  
        <further-classification edition="200601120241202B">H04L9/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兆豐國際商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭應俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YING-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇家涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIA HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊志文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張伯靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, PO CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種預設密碼檢測系統及其操作方法。預設密碼檢測系統包括收發器、儲存媒體以及處理器。處理器耦接至收發器以及儲存媒體。儲存媒體儲存預設密碼對照表。收發器接收掃描清單。處理器依據掃描清單與多個物聯網設備建立連線。響應於與多個物聯網設備中的第一物聯網設備成功建立連線，處理器自第一物聯網設備接收設備資訊。處理器基於預設密碼對照表與設備資訊產生第一檢測結果。處理器基於第一檢測結果以及第二檢測結果的至少其中之一來產生掃描報告。處理器通過收發器輸出掃描報告。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A preset password detection system and an operation method thereof are provided. The preset password detection system includes a transceiver, a storage media, and a processor. The processor is coupled to the transceiver and the storage media. The storage media stores a preset password comparison table. The transceiver receives a scan list. The processor establishes connections with a plurality of IoT devices based on the scan list. In response to successfully establishing the connection with a first IoT device among the plurality of IoT devices, the processor receives a device information from the first IoT device. The processor generates a first detection result based on the preset password comparison table and the device information. The processor generates a scan report based on at least one of the first detection result and a second detection result. The processor outputs the scan report through the transceiver.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:預設密碼檢測系統</p>  
        <p type="p">110:處理器</p>  
        <p type="p">120:儲存媒體</p>  
        <p type="p">121:預設密碼對照表</p>  
        <p type="p">130:收發器</p>  
        <p type="p">200:終端設備</p>  
        <p type="p">300-1、300-2、300-N:物聯網設備</p>  
        <p type="p">DI-2、DI-N:設備資訊</p>  
        <p type="p">SL:掃描清單</p>  
        <p type="p">SR:掃描報告</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="186" publication-number="202612117"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612117.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612117</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133694</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片封裝結構及其製作方法</chinese-title>  
        <english-title>CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">H01L23/28</main-classification>  
        <further-classification edition="200601120241129B">H01L23/488</further-classification>  
        <further-classification edition="200601120241129B">H01L21/56</further-classification>  
        <further-classification edition="200601120241129B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHUNG W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHUNG W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶片封裝結構，包括一晶片接墊、多個輸入/輸出接墊、一晶片、多個第一打線、一封裝膠體、一防銲層、多個第一銲球以及多個第二銲球。輸入/輸出接墊配置於晶片接墊的周圍。晶片配置於晶片接墊上。第一打線電性連接晶片與輸入/輸出接墊。封裝膠體包覆晶片、晶片接墊、輸入/輸出接墊以及第一打線，且暴露出晶片接墊的一第一下表面與每一輸入/輸出接墊的一第二下表面。防銲層配置於晶片接墊的第一下表面上，且具有暴露出部分晶片接墊的多個開口。第一銲球分別配置於防銲層的開口內，而第二銲球分別配置於輸入/輸出接墊上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chip package structure includes a die pad, a plurality of input/output pads, a chip, a plurality of first bonding wires, a molding compound, a solder resist layer, a plurality of first solder balls and a plurality of second solder balls. The input/output pads are disposed around the die pad. The chip is disposed on the die pad. The first bonding wires are electrically connected to the chip and the input/output pads. The molding compound covers the chip, the die pad, the input/output pads and the first bonding wires and exposes a first lower surface of the die pad and a second lower surface of each of the input/output pads. The solder resist layer is disposed on the first lower surface of the die pad and has a plurality of openings exposing a portion of the die pad. The first solder balls are respectively disposed in the openings of the solder resist layer, and a second solder balls are respectively disposed on the input/output pads.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:晶片封裝結構</p>  
        <p type="p">110:晶片接墊</p>  
        <p type="p">111:第一下表面</p>  
        <p type="p">120:輸入/輸出接墊</p>  
        <p type="p">121:第二下表面</p>  
        <p type="p">140:防銲層</p>  
        <p type="p">141:第二底面</p>  
        <p type="p">142:開口</p>  
        <p type="p">150:晶片</p>  
        <p type="p">160:第一打線</p>  
        <p type="p">170:封裝膠體</p>  
        <p type="p">171:第一底面</p>  
        <p type="p">180:第一銲球</p>  
        <p type="p">182:第二銲球</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="187" publication-number="202610822"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610822.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610822</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133703</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耐溫防護面罩</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">B32B15/04</main-classification>  
        <further-classification edition="201901120241125B">B32B7/02</further-classification>  
        <further-classification edition="200601120241125B">A62B18/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昇明國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王李明陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種耐溫防護面罩，依序包含一聚碳酸酯成型件、一二氧化矽硬塗層、一銅鋅合金層及一介電層，該介電層包含氮化鈦、氮化鋯、氧化鋯、或其組合；其中銅鋅合金層之厚度為0.2 μm至3.0 μm，介電層之厚度為10 nm至999 nm，且銅鋅合金層和介電層之厚度比為1：1至100：1。本發明之耐溫防護面罩具有優良的耐熱性、可見光透視率、紅外光穿透率，且可降低成本，且在溫度60℃、相對溼度90RH%的條件下處理200小時後，紅外光穿透率及可見光透視率的變化率均小於等於100%，相對穩定，適合長期使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:耐溫防護面罩</p>  
        <p type="p">11:聚碳酸酯成型件</p>  
        <p type="p">12:二氧化矽硬塗層</p>  
        <p type="p">13:銅鋅合金層</p>  
        <p type="p">14:介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="188" publication-number="202611470"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611470.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611470</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133704</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器組件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">F28F9/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商莫仕有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLEX, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊喆元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHE-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接器組件，包含導引屏蔽罩與散熱器模組，導引屏蔽罩具有插接通道，散熱器模組設於所述導引屏蔽罩並且包括散熱器與致動件，散熱器具有基座，以及設置於所述基座的鰭片部，致動件具有軸部以及連接所述軸部的槓桿，槓桿具有相連接的第一端部、第二端部，軸部穿過散熱器並且靠設在基座頂表面，或使軸部穿過散熱器並且至少部分於鰭片部的風道外，致動件常態在第一狀態並且能受力位移至第二狀態；致動件在第一狀態時，第一端部伸入插接通道內；致動件在第二狀態時，致動件的第二端部作用於散熱器以使散熱器的基座伸入插接通道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:導引屏蔽罩</p>  
        <p type="p">115:插接通道</p>  
        <p type="p">33:致動件</p>  
        <p type="p">330:軸部</p>  
        <p type="p">331:第一端部</p>  
        <p type="p">332:第二端部</p>  
        <p type="p">35:基座</p>  
        <p type="p">351:第一板部</p>  
        <p type="p">352:第二板部</p>  
        <p type="p">36:鰭片部</p>  
        <p type="p">361:第二凹槽</p>  
        <p type="p">362:散熱鰭片</p>  
        <p type="p">363:風道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="189" publication-number="202612424"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612424.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612424</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水冷散熱結構及應用其之電子裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240910B">H05K7/20</main-classification>  
        <further-classification edition="200601120240910B">F28F3/06</further-classification>  
        <further-classification edition="200601120240910B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康舒科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓建廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, CHIEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫士誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, SHIH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭逸群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, I-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水冷散熱結構及應用其之電子裝置，該水冷散熱結構用以包覆該電子裝置內的發熱元件，並且包括冷卻板與線路載板，其中，該冷卻板和該線路載板包圍形成用以容置該發熱元件的空間，該空間內填充有第一導熱介質，該第一導熱介質與該冷卻板直接接觸，也與該線路載板直接接觸。藉此，該第一導熱介質直接接觸該發熱元件、該線路載板和該冷卻板，除了能簡化該水冷散熱結構及其組裝工序之外，還能減少熱阻、提高導熱效果，且該水冷散熱結構的體積以及該電子裝置的體積也都能進一步縮減。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:冷卻板</p>  
        <p type="p">101:流道</p>  
        <p type="p">11:冷卻液</p>  
        <p type="p">12:固定凸部</p>  
        <p type="p">20:線路載板</p>  
        <p type="p">21:功率半導體元件</p>  
        <p type="p">22:固定件</p>  
        <p type="p">30:第一導熱介質</p>  
        <p type="p">40:發熱元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="190" publication-number="202612242"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612242.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612242</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙向電源轉換器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H02M3/335</main-classification>  
        <further-classification edition="200601120241202B">H02M7/217</further-classification>  
        <further-classification edition="200601120241202B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康舒科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉政彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種雙向電源轉換器，包含一雙有源橋式轉換電路以及儲能單元。雙有源橋式轉換電路包含一次側橋式電路、二次側橋式電路、儲能器及變壓器，一次側橋式電路一端電性連接第一信號端，儲能器串聯連接變壓器一次側線圈或串聯連接二次側線圈。當儲能器串聯連接變壓器一次側線圈時係與一次側橋式電路另一端電性連接。當儲能器串聯連接變壓器二次側線圈時係與二次側橋式電路一端電性連接，二次側橋式電路另一端電性連接第二信號端。儲能單元具有阻抗值，與變壓器一次側線圈或二次側線圈並聯設置。一次側橋式電路及二次側橋式電路之充放電模式係運作於零電壓切換區域中，儲能單元阻抗值大小對應零電壓切換區域大小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雙向電源轉換器</p>  
        <p type="p">2:雙有源橋式轉換電路</p>  
        <p type="p">21:一次側橋式電路</p>  
        <p type="p">22:二次側橋式電路</p>  
        <p type="p">23:一次側儲能器</p>  
        <p type="p">24:變壓器</p>  
        <p type="p">3:一次側儲能單元</p>  
        <p type="p">N1:一次側線圈</p>  
        <p type="p">N2:二次側線圈</p>  
        <p type="p">L1:一次側第一電感</p>  
        <p type="p">L2:一次側第二電感</p>  
        <p type="p">Ls:電感</p>  
        <p type="p">I1:一次側第一電流電流</p>  
        <p type="p">I2:一次側第二電流</p>  
        <p type="p">ILs:一次側儲能器電流</p>  
        <p type="p">IL1:一次側第一電感電流</p>  
        <p type="p">IL2:一次側第二電感電流</p>  
        <p type="p">Vs:電壓</p>  
        <p type="p">Vreflect:一次側線圈電壓</p>  
        <p type="p">V1:第一信號端</p>  
        <p type="p">V2:第二信號端</p>  
        <p type="p">S11~S14:開關</p>  
        <p type="p">S21~S24:開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="191" publication-number="202610564"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610564.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610564</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133710</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏心軸變速機構及紋身機</chinese-title>  
        <english-title>VARIABLE SPEED ECCENTRIC DRIVING MECHANISM AND TATTOO MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">A45D44/22</main-classification>  
        <further-classification edition="200601120241105B">A61M37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧宗有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZONE TATTOO SUPPLY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁世裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, SHIN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬泓澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIAO, HUNG TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊傳鏈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種偏心軸變速機構，包含一機身、一馬達、一偏心凸輪安裝於馬達的輸出軸、一配重塊安裝並與偏心凸輪同步轉動。第一磁鐵固定於配重塊。第二磁鐵定位於機身，位於配重塊的旋轉軌跡的周圍，第二磁鐵被建構成，其磁場被建構成能在一預定距離與第一磁鐵的磁場形成交互作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A variable speed eccentric driving mechanism is provided and includes a body, a motor, an eccentric cam mounted on the output shaft of the motor, a counterweight installed and rotating synchronously with the eccentric cam. A first magnet is fixed to the counterweight, while a second magnet is positioned on the body, located surrounding the rotational path of the counterweight. The second magnet is constructed such that its magnetic field is configured to interact with the magnetic field of the first magnet at a predetermined distance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:機身</p>  
        <p type="p">113:安裝面</p>  
        <p type="p">12:配重塊</p>  
        <p type="p">121:槽</p>  
        <p type="p">14:偏心凸輪</p>  
        <p type="p">15:輸出柄</p>  
        <p type="p">151:軸承</p>  
        <p type="p">152:搖擺臂</p>  
        <p type="p">16:頂桿</p>  
        <p type="p">19A,19B:第一磁鐵</p>  
        <p type="p">20:磁鐵插板</p>  
        <p type="p">21:槽</p>  
        <p type="p">25:第二磁鐵</p>  
        <p type="p">26:斜面</p>  
        <p type="p">40:馬達</p>  
        <p type="p">41:輸出軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="192" publication-number="202611890"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611890.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611890</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133711</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示灰度細調電路、LED顯示驅動晶片、LED顯示裝置、及資訊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241101B">G09G3/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳雨壕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王景帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張漢儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種顯示灰度細調電路，用以整合在一LED顯示驅動晶片之中，且包括至少一信號產生模塊以及複數個灰度調節單元。依據本發明之設計，該信號產生模塊被配置對一基礎灰度時鐘信號(GLCK)執行N-1次的延時處理以對應地產生N-1個灰度時鐘信號，而後選擇一個所述灰度時鐘信號輸出為一延時信號。並且，各所述灰度調節單元被配置以依據一參考信號與該延時信號將由該LED顯示驅動晶片內部的一PWM產生單元所輸出的一初始PWM信號調整為一PWM信號。如此設計，本發明之顯示灰度細調電路可以對該初始PWM信號的脈衝寬度進行N種不同檔位的延時調整，從而提高顯示灰度的調整精度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:顯示灰度細調電路</p>  
        <p type="p">21:信號產生模塊</p>  
        <p type="p">211:延時單元</p>  
        <p type="p">213:選擇單元</p>  
        <p type="p">212:匹配單元</p>  
        <p type="p">20:灰度調節模塊</p>  
        <p type="p">22:灰度調節單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="193" publication-number="202611839"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611839.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611839</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133720</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>貸款資訊身份檢核系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">G06Q40/03</main-classification>  
        <further-classification edition="201201120241101B">G06Q20/38</further-classification>  
        <further-classification edition="201301120241101B">G06F21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANK OF TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泓志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種貸款資訊身份檢核系統，包含一通訊單元、一儲存單元及一電連接該通訊單元及該儲存單元的處理單元。當該處理單元獲得一的基本資料時，該處理單元至一貸款資料伺服器讀取對應該基本資料的一客戶資料並根據該客戶資料對該基本資料進行檢核。當檢核成功時，該處理單元再讀取對應該客戶資料的一貸款資料並根據一貸款資料檢核規則對該貸款資料進行檢核。當檢核成功時，該處理單元傳送一認證密碼至一終端行動裝置。當該處理單元比對從該終端行動裝置傳來的一回覆密碼與該認證密碼相同時，該處理單元傳送一認證成功訊息至該終端行動裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:貸款資訊身份檢核系統</p>  
        <p type="p">2:通訊單元</p>  
        <p type="p">3:儲存單元</p>  
        <p type="p">4:處理單元</p>  
        <p type="p">8:貸款資料伺服器</p>  
        <p type="p">9:終端行動裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="194" publication-number="202611758"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611758.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611758</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133721</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有輕量級注意力機制深度學習模型的手腕靜脈驗證方法</chinese-title>  
        <english-title>WRIST VEIN VERIFICATION METHOD HAVING LIGHTWEIGHT ATTENTION-BASED DEEP LEARNING MODEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241121B">G06F21/32</main-classification>  
        <further-classification edition="202201120241121B">G06V40/14</further-classification>  
        <further-classification edition="201901120241121B">G06N20/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人亞洲大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪西進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORNG, SHI-JINN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　氏雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, THI-VAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武　亭忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VU, DINH-TRUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳紅梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HONG MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李天瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TIAN RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種具有輕量級注意力機制深度學習模型的手腕靜脈驗證方法，其包含以下步驟：通過影像擷取裝置取得手腕靜脈可見光影像；通過影像處理裝置對手腕靜脈可見光影像進行手腕感興趣區域偵測程序，提取手腕感興趣區域影像，對手腕感興趣區域影像進行血管影像強化程序以取得模型輸入影像；通過影像處理裝置執行輕量級注意力機制深度學習模型，將模型輸入影像輸入以提取特徵向量；通過影像處理裝置比對特徵向量與待測者的註冊手腕特徵向量，若比對結果相符，判斷為驗證成功，若比對結果不符，判斷為驗證失敗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wrist vein verification method having lightweight attention-based deep learning model is disclosed. The method includes the following steps: obtaining a visible light image of the wrist vein by an image capture device; conducting a wrist region of interest detection process on the visible light image of the wrist veins by an image processing device and extracting a wrist region of interest image. Conducting a blood vessel image enhancement process on the wrist region of interest image to obtain a model input image; executing the lightweight attention-based deep learning model by the image processing device, inputting the model input image for extracting the feature vector; comparing the feature vector with the registered wrist feature vector of the user by the image processing device. If the comparison results match, the verification is successful; if the comparison results are inconsistent, the verification fails.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S6:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="195" publication-number="202610800"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610800.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610800</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多色容器成型法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B29C45/03</main-classification>  
        <further-classification edition="200601120241105B">B29C45/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊文豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊翔恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊晨恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊盈恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊懷恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊文豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種多色容器成型法，主要包含一推料裝置、一送料裝置及動力裝置和一模板座所組成；其中該推料裝置具有兩道以平行配置之推料道及容設在推料道內之活塞，該活塞以連動桿與動力裝置連接，提供動力令活塞移位進行推料；該送料裝置之兩平行送料道，係各別分設在推料道兩側，且對應連通推料裝置之兩推料道；藉此利用送料裝置將射出原料以螺桿同步送至推送裝置之推料道，再透過推料道內置之活塞，同步向前推料，使注入澆注道之射出原料，同速穩定的流入模具槽道，並利用高溫之射出原料，使兩道不同顏色之射出料產生溶合，使雙色射出原料頂接之端接邊達到無縫之接合，提昇容器之美觀度及增加端接邊之強度。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:推料裝置</p>  
        <p type="p">10:第一推料道</p>  
        <p type="p">11:第二推料道</p>  
        <p type="p">12:送料口</p>  
        <p type="p">13:送料口</p>  
        <p type="p">2:送料裝置</p>  
        <p type="p">20:第一送料道</p>  
        <p type="p">21:第二送料道</p>  
        <p type="p">22:螺桿</p>  
        <p type="p">23:螺桿</p>  
        <p type="p">24:動力單元</p>  
        <p type="p">25:動力單元</p>  
        <p type="p">3:動力裝置</p>  
        <p type="p">30:活塞</p>  
        <p type="p">31:活塞</p>  
        <p type="p">32:連動桿</p>  
        <p type="p">33:連動桿</p>  
        <p type="p">4:模板座</p>  
        <p type="p">5:模具</p>  
        <p type="p">50:澆注道</p>  
        <p type="p">51:澆注道</p>  
        <p type="p">6:滾珠</p>  
        <p type="p">60:彈簧</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="196" publication-number="202610923"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610923.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610923</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手動繞線器</chinese-title>  
        <english-title>MANUAL WINDING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B65H54/52</main-classification>  
        <further-classification edition="200601120241007B">B65H59/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中山大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王兆璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHAU-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李光祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, GUANG-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖奕鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種手動繞線器，包含線架、迫緊器、繞線裝置及張力保持器。線架用以提供線材。迫緊器鄰設於線架且配置以夾緊線材。繞線裝置設在迫緊器一側。繞線裝置包括驅動機構及線軸固定單元。線軸固定單元配置以安裝線軸。驅動機構配置以驅動線軸固定單元轉動以使線材捲繞至線軸上。張力保持器設在迫緊器與繞線裝置之間。張力保持器包含滑座、滑塊及四個連桿。滑塊可移動地設置在滑座上。連桿形成四邊形並以其相對兩個連接處分別樞設於在滑座與滑塊上，且另外兩個連接處分別設有滑輪。線材分別繞過滑輪。張力保持器配置以維持線材的張力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manual winding device includes a wire bracket, a clamp, a winder and a tension maintainer. The wire source is configured to provide a wire. The clamp is disposed adjacent to the wire source and is configured to clamp the wire. The winder is disposed at a side of the clamp. The winder includes a driving mechanism and a spool fixing unit. The spool fixing unit is configured to install a spool. The driving mechanism is configured to drive the spool fixing unit to rotate to wind the wire onto the spool. The tension maintainer is disposed between the clamp and the winder. The tension maintainer includes a sliding base, a slider and four connecting rods. The slider is movably disposed on the sliding base. The connecting rods are connected to each other to form a quadrilateral, where opposite connections are pivoted on the sliding base and the slider respectively, while the other two connections are provided with pulleys. The tension maintainer is configured to maintain the tension of the wire.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:手動繞線器</p>  
        <p type="p">11:線架</p>  
        <p type="p">111:把手</p>  
        <p type="p">12:迫緊器</p>  
        <p type="p">13:張力保持器</p>  
        <p type="p">131:滑座</p>  
        <p type="p">132:滑塊</p>  
        <p type="p">133a:連桿</p>  
        <p type="p">133b:連桿</p>  
        <p type="p">134a:連桿</p>  
        <p type="p">134b:連桿</p>  
        <p type="p">14:繞線裝置</p>  
        <p type="p">141:驅動機構</p>  
        <p type="p">141a:蝸桿</p>  
        <p type="p">141b:蝸輪</p>  
        <p type="p">141c:轉軸</p>  
        <p type="p">142:手輪</p>  
        <p type="p">143:線軸固定單元</p>  
        <p type="p">15:計數器</p>  
        <p type="p">A1:線軸</p>  
        <p type="p">W1:線材</p>  
        <p type="p">P1:連接處</p>  
        <p type="p">P2:連接處</p>  
        <p type="p">P3:連接處</p>  
        <p type="p">P31:滑輪</p>  
        <p type="p">P4:連接處</p>  
        <p type="p">P41:滑輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="197" publication-number="202611624"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611624.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611624</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>立體攝影系統</chinese-title>  
        <english-title>STEREOSCOPIC CAMERA SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241007B">G03B35/08</main-classification>  
        <further-classification edition="202001120241007B">G02B30/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塗宗偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, TSUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱奕榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石維國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, WEI-KUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種立體攝影系統，包括第一鏡頭、第一影像感測器、第二鏡頭、第二影像感測器以及控制器。第一鏡頭沿第一平面設置。第一影像感測器用以藉由第一鏡頭朝物體拍攝，以取得物體的第一影像。第二鏡頭沿第二平面設置。第二影像感測器用以藉由第二鏡頭朝物體拍攝，以取得物體的第二影像。控制器電性連接至第一影像感測器與第二影像感測器。控制器將第一影像及第二影像合成，以產生物體的立體影像。第一影像感測器的感測面不平行於第一平面，且第二影像感測器的感測面不平行於第二平面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stereoscopic camera system includes a first lens, a first image sensor, a second lens, a second image sensor and a controller. The first lens is disposed along a first plane. The first image sensor is configured to shoot toward an object by the first lens to obtain a first image of the object. The second lens is disposed along a second plane. The second image sensor is configured to shoot toward the object by the second lens to obtain a second image of the object. The controller is electrically connected to the first image sensor and the second image sensor. The controller synthesizes the first image and the second image to generate a stereoscopic image of the object. A sensing surface of the first image sensor is not parallel to the first plane, and a sensing surface of the second image sensor is not parallel to the second plane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:立體攝影系統</p>  
        <p type="p">20:眼球追蹤器</p>  
        <p type="p">100:第一攝影機</p>  
        <p type="p">200:第二攝影機</p>  
        <p type="p">300:控制器</p>  
        <p type="p">400:第一鏡頭</p>  
        <p type="p">500:第二鏡頭</p>  
        <p type="p">A1、A2:光軸</p>  
        <p type="p">B:基線</p>  
        <p type="p">D1:成像位置</p>  
        <p type="p">DP:顯示面</p>  
        <p type="p">FA:注視區域</p>  
        <p type="p">I1:第一影像</p>  
        <p type="p">I2:第二影像</p>  
        <p type="p">O:物體</p>  
        <p type="p">P1:位置</p>  
        <p type="p">SI:立體影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="198" publication-number="202611866"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611866.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611866</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腦部動靜脈畸形影像疊加分析系統</chinese-title>  
        <english-title>SUPERIMPOSING IMAGES ANALYSIS SYSTEM FOR AVM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120241105B">G06T7/80</main-classification>  
        <further-classification edition="202201120241105B">G06V10/774</further-classification>  
        <further-classification edition="202401120241105B">A61B6/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利像科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMVITEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭景明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, JING-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂　安豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARKONI, HERLEEYANDI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪慧雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, HUI-YA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種腦部動靜脈畸形影像疊加分析系統，其係包含一影像擷取單元、一影像疊加對準單元、以及一透明度調整單元。影像擷取單元係擷取一腦部MRA影像及一腦部MRI影像；影像疊加對準單元係連接該影像擷取單元，並接收影像擷取單元所傳送的腦部MRA影像及腦部MRI影像，並對該等影像進行疊加對準；透明度調整單元係連接影像疊加對準單元，其係根據一透明度調整指令以調整腦部MRA影像或腦部MRI影像的透明度，據以輸出一腦部對比疊加影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a superimposing images analysis system for AVM, which includes an image capturing unit, an image superimposing and aligning unit, and a transparency adjustment unit. The image capturing unit captures a brain MRA image and a brain MRI image. The image superimposing and aligning unit is connected to the image capturing unit. The image superimposing and aligning unit receives the brain MRA image and brain MRI image from the image capturing unit, and performs superimposing and aligning on these images. The transparency adjustment unit is connected to the image superimposing and aligning unit, and adjusts the transparency of the brain MRA image or the brain MRI image according to a transparency adjustment instruction, thereby outputting a brain comparing and superimposing image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:影像疊加分析系統</p>  
        <p type="p">11:影像擷取單元</p>  
        <p type="p">12:影像疊加對準單元</p>  
        <p type="p">13:透明度調整單元</p>  
        <p type="p">I&lt;sub&gt;O&lt;/sub&gt;:腦部對比疊加影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="199" publication-number="202611394"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611394.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611394</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機車引擎的輔助系統及其方法</chinese-title>  
        <english-title>AUXILIARY SYSTEM AND METHOD FOR MOTORCYCLE ENGINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">F02D41/08</main-classification>  
        <further-classification edition="201901120241029B">B60L58/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信通交通器材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENTEC E&amp;E CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王御丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李衍毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YEN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周俊奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHUN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧文賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, WEN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林斯和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SZU-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種機車引擎的輔助系統及其方法。機車引擎的輔助方法包含經由啟動兼發電裝置的位置感測器，偵測曲軸之位置資訊；在機車引擎的轉速小於熄火閾值時，根據機車引擎的引擎運作參數及曲軸的曲軸運作參數與位置資訊，預測在機車引擎停轉時曲軸的停止位置；及在機車引擎的轉速達到待停轉閾值時，根據曲軸的停止位置，控制啟動兼發電裝置輔助曲軸於機車引擎停轉時停留於指定位置，其中指定位置對應於該機車引擎的進氣行程或排氣行程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An auxiliary system and method thereof for motorcycle engine are provided. The auxiliary method includes detecting the position information of a crankshaft by a position sensor of an integrated starter and generator (ISG); when an engine speed is smaller than an idle threshold, predicting a stopping position of the crankshaft when the engine is stopped according to an engine operating parameter of the engine and a crankshaft operating parameter and the position information of the crankshaft; and when the engine speed reaches a to be stalled threshold, controlling the ISG to aid the crankshaft to stop at a designated position when the engine is stopped, wherein the designated position corresponds to the intake stroke or the exhaust stroke.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S301~S319:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="200" publication-number="202611393"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611393.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611393</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133747</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機車引擎的輔助系統及其方法</chinese-title>  
        <english-title>AUXILIARY SYSTEM AND METHOD FOR MOTORCYCLE ENGINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">F02D29/02</main-classification>  
        <further-classification edition="201901120241029B">B60L58/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信通交通器材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENTEC E&amp;E CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王御丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李衍毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YEN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周俊奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHUN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧文賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, WEN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林斯和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SZU-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些實施例中，機車引擎的輔助方法包含在電池的電量大於電量閾值時，響應於加速訊號，判斷機車引擎的轉速是否介於加速範圍；及在機車引擎的轉速介於加速範圍時，控制一啟動兼發電裝置進入一馬達模式以輔助該機車引擎的運轉。在一些實施例中，輔助方法包含在電池的電量大於電量閾值且該機車引擎的轉速介於平滑範圍時，判斷機車引擎是否處於壓縮行程；在機車引擎處於壓縮行程時，控制啟動兼發電裝置進入馬達模式以輔助該機車引擎的運轉；及在電池的該電量不大於電量閾值時，控制啟動兼發電裝置進入發電模式以停止輔助該機車引擎的運轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some embodiments, an auxiliary method includes determining whether an engine speed is at an acceleration range by responding to an acceleration signal when the power of a battery is bigger than a power threshold; and controlling an ISG to enter a motor mode to aid the operation of an engine when the engine speed is at the acceleration range. In some embodiments, an auxiliary method includes determining whether an engine is in a compression stroke when the power of a battery is bigger than a power threshold and an engine speed is at a smoothing range; controlling an ISG to enter a motor mode to aid the operation of an engine when the engine is in the compression stroke; and controlling the ISG to enter a generator mode to stop aiding the operation of the engine when the power of the battery is not bigger than the power threshold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S309,S313,S401~S413:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="201" publication-number="202612274"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612274.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612274</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133748</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器電路、控制電路及其迴轉率控制電路</chinese-title>  
        <english-title>CONNECTOR CIRCUIT, CONTROL CIRCUIT, AND SLEW RATE CONTROL CIRCUIT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H03K19/0185</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅國元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, GUO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴照民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHAO-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JYUN-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種迴轉率控制電路包含地線、電源線、輸出端、二開關、二開關電路及二對地電容。二開關分別連接在電源線與輸出端之間及在輸出端與地線之間。二開關電路個別連接在電源線與地線之間，且分別受控於二驅動訊號而反相地被驅動。二開關電路中之一者係用以經由第一阻值驅動一開關，而另一者係用以經由第二阻值驅動另一開關。二對地電容中之一者連接一開關的控制端與一開關電路，而另一者則連接另一開關的控制端與另一開關電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A slew rate control circuit includes a grounding trace, a power trace, an output note, two switches, two switching circuits, and two grounding capacitors. The switches are connected between the power trace and the output note and between the output note and the grounding trace, respectively. The switching circuits are individually connected between the power trace and the grounding trace, and controlled by two driving signals and driven invertedly to each other. Among the switching circuits, one is configured to drive the one switch through the first resistance, and the other is configured to drive the other switch through the second resistance. Among the grounding capacitors, one is connected to the control end of the first switch, and the other is connected to the control end of the second switch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:迴轉率控制電路</p>  
        <p type="p">520:輸出端</p>  
        <p type="p">540:地線</p>  
        <p type="p">550:電源線</p>  
        <p type="p">610:第一開關電路</p>  
        <p type="p">611:第一路徑開關</p>  
        <p type="p">620:第二開關電路</p>  
        <p type="p">621:第二路徑開關</p>  
        <p type="p">630:第三開關電路</p>  
        <p type="p">631:第三路徑開關</p>  
        <p type="p">640:第四開關電路</p>  
        <p type="p">641:第四路徑開關</p>  
        <p type="p">C1:第一對地電容</p>  
        <p type="p">C2:第二對地電容</p>  
        <p type="p">Q1:第一開關</p>  
        <p type="p">Q2:第二開關</p>  
        <p type="p">Q3:第三開關</p>  
        <p type="p">Q4:第四開關</p>  
        <p type="p">Q5:第五開關</p>  
        <p type="p">Q6:第六開關</p>  
        <p type="p">Q7:第七開關</p>  
        <p type="p">Q8:第八開關</p>  
        <p type="p">R1:第一阻抗元件</p>  
        <p type="p">R2:第二阻抗元件</p>  
        <p type="p">R3:第三阻抗元件</p>  
        <p type="p">R4:第四阻抗元件</p>  
        <p type="p">S1:第一驅動訊號</p>  
        <p type="p">S2:第二驅動訊號</p>  
        <p type="p">S11:第一模式訊號</p>  
        <p type="p">S22:第二模式訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="202" publication-number="202612425"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612425.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612425</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133751</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱裝置及散熱部件</chinese-title>  
        <english-title>HEAT DISSIPATION DEVICE AND HEAT DISSIPATION COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K7/20</main-classification>  
        <further-classification edition="200601120241105B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳企甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱裝置包含彼此相對之入風側以及出風側。散熱裝置包含底板、數個第一導流柱以及數個第二導流柱。第一導流柱設置於底板上並靠近出風側。第二導流柱設置於底板上並靠近入風側。第二導流柱與第一導流柱隔開。第一導流柱之形狀與第二導流柱之形狀相異。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation device has an inlet air side and an outlet air side opposite to each other. The heat dissipation device includes a bottom plate, a plurality of first flow guiding pillars, and a plurality of second flow guiding pillars. The first flow guiding pillars are disposed on the bottom plate and are close to the outlet air side. The second flow guiding pillars are disposed on the bottom plate and are close to the inlet air side. The second flow guiding pillars are separated from the first flow guiding pillars. A shape of the first flow guiding pillars is different from a shape of the second flow guiding pillars.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:散熱裝置</p>  
        <p type="p">110:底板</p>  
        <p type="p">120:導流柱</p>  
        <p type="p">122:第一導流柱</p>  
        <p type="p">124:第二導流柱</p>  
        <p type="p">A&lt;sub&gt;122&lt;/sub&gt;:第一導流區域</p>  
        <p type="p">A&lt;sub&gt;124&lt;/sub&gt;:第二導流區域</p>  
        <p type="p">IS:入風側</p>  
        <p type="p">OS:出風側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="203" publication-number="202611365"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611365.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611365</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133754</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透水鋪面構造</chinese-title>  
        <english-title>PERMEABLE PAVEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">E01C7/00</main-classification>  
        <further-classification edition="200601120241125B">E01C11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元厚環護營造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN HOU ENVIRONMENTAL PROTECTION CONSTRUCTION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊明得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, MIN-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方建弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, CHIEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, WEN-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟威</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一透水鋪面構造包含一加勁構件及一水硬性凝結材料，該加勁構件具有複數個竹筋及複數個竹管，該些竹筋排列成網格狀，各該竹管設置於相鄰的該些竹筋之間的一網格孔中，該水硬性凝結材料覆蓋該加勁構件，但未覆蓋各該竹管之上下開口，雨水可透過各該竹管內部之排水空間滲透至土壤，本發明將竹材應用於該透水鋪面構造，可大量去化廢棄老竹，還能減少高耗能及高碳排之鋼筋使用量，有利於降低二氧化碳排放量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A permeable pavement includes a hydraulic cement and a reinforcing component having bamboo bars and bamboo tubes. The bamboo bars are arranged as a grid, and each of the bamboo tubes is arranged in a grid hole formed between the adjacent bamboo bars. The hydraulic cement covers the reinforcing component but not cover top and bottom openings of each of the bamboo tubes. Rain can flow to solid via a drainage space in each of the bamboo tubes. Bamboo is applied in the permeable pavement of the present invention, so it is able to use a lot of abandoned bamboos and reduce the use of steel bars which are manufactured with high energy consumption and high carbon emissions. Thus, the present invention can lower carbon dioxide emissions significantly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:透水鋪面構造</p>  
        <p type="p">100:加勁構件</p>  
        <p type="p">110a:第一竹筋</p>  
        <p type="p">110b:第二竹筋</p>  
        <p type="p">200:水硬性凝結材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="204" publication-number="202612544"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612544.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612544</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用彩色、黑白、廣色域、專色印刷圖層堆疊技術形成彩色光陷阱結構而提高彩色太陽能板光電轉換率的方法</chinese-title>  
        <english-title>A METHOD THAT UTILIZES COLOR, BLACK AND WHITE, WIDE COLOR GAMUT, AND SPOT COLOR PRINTING LAYER STACKING TECHNOLOGY TO FORM A LIGHT TRAP STRUCTURE TO IMPROVE THE PHOTOELECTRIC CONVERSION RATE OF COLOR SOLAR PANELS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250225B">H10F77/40</main-classification>  
        <further-classification edition="202501120250225B">H10F71/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖宸賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHEN XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>睿田能源有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖宸賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHEN XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭朋深</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種利用彩色、黑白、廣色域、專色印刷圖層堆疊技術形成彩色光陷阱結構而提高彩色太陽能板光電轉換率的方法，主要在彩色太陽能板在綠色能源轉型關於太陽能板美觀裝飾中越來越受歡迎，但彩色、黑白、廣色域、專色圖層往往會反射部分光線，導致光電轉換效率降低。為了在不犧牲美觀的前提下提高太陽能板的效率，本發明提出了一種利用印刷方式將彩色、黑白、廣色域、專色印刷圖層堆疊技術來製造彩色光陷阱結構的方法以提高彩色太陽能板光電轉換率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention is a method that utilizes color, black and white, wide color gamut, and spot color printing layer stacking technology to form a light trap structure to improve the photoelectric conversion rate of color solar panels. It is mainly used in the green energy transformation of color solar panels and the aesthetics of solar panels. It is becoming more and more popular in decoration, but color, black and white, wide color gamut, and spot color layers often reflect part of the light, resulting in reduced photoelectric conversion efficiency. In order to improve the efficiency of solar panels without sacrificing aesthetics, the present invention proposes a method of manufacturing light trap structures using printing methods to stack color, black and white, wide color gamut, and spot color printing layers to improve color solar energy. board photoelectric conversion rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:選擇材料及設計</p>  
        <p type="p">B:彩色光陷阱結構設計</p>  
        <p type="p">C:彩色印刷圖層堆疊</p>  
        <p type="p">D:固化與堆疊</p>  
        <p type="p">E:彩色圖層的應用與封裝</p>  
        <p type="p">F:封裝</p>  
        <p type="p">G:光電轉換效能測試</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="205" publication-number="202610591"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610591.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610591</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訓練呼吸肌群方法與裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR TRAINING RESPIRATORY MUSCLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">A61B5/08</main-classification>  
        <further-classification edition="201801120241001B">G16H50/30</further-classification>  
        <further-classification edition="201801120241001B">G16H40/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山衛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMWELL TESTING INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>先進醫照股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MEDIWATCH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林松聯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SUNG-LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳金亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳孝三</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHAN-SAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭聖偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, SHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林礽俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種訓練呼吸肌群方法與裝置。在一實施例中，該方法首先提供罩體，罩覆於使用者面部上關於進出氣的位置，罩體上具有氣流調節元件設定吸氣阻力，於使用者吸氣過程，模擬呼吸道阻塞，造成呼吸道內產生負壓。接著，設定關於肺功能之訓練標準資訊，然後再進行訓練步驟，以讓使用者於吸氣阻力下，藉由進行至少一次的吸氣或呼氣運動，達到關於該肺功能之該訓練標準資訊。在另一實施例中，本發明提供一種訓練呼吸肌群裝置以實現前述的訓練呼吸肌群方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method and apparatus for training respiratory muscles. In one embodiment, the method is started by providing a mask for being air-tightly covered on inhaling and exhaling position on the face of the user, wherein an air flow adjusting element is arranged on the mask for simulating airway obstruction during the inhaling process thereby casing a negative pressure in the respiratory tract. Thereafter, a standard training information with respect to the pulmonary function is set. Then a training process is proceeded for achieving the standard training information through at least one inhalation exercise or exhalation exercise under the simulated airway obstruction. In another alternative embodiment, the present invention further provides a device for training respiratory muscles to achieve the aforementioned respiratory muscles training method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:方法</p>  
        <p type="p">20~23:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="206" publication-number="202610692"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610692.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610692</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133777</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽能芳香器</chinese-title>  
        <english-title>SOLAR AROMATIZER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">A61L9/012</main-classification>  
        <further-classification edition="200601120241001B">A61L9/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>睿澤企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AROMATE INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃祺娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種太陽能芳香器包括一座體、一機殼、一芳香包、一安裝閘、一太陽能板、及一搖擺裝置。座體包括一壁掛板、一承載框架、及一刺破結構，承載框架連接於壁掛板的前端面，刺破結構連接於承載框架。機殼可拆卸地連接於座體，機殼具有一觀測窗，機殼能在一打開位置以及一關閉位置之間移動。安裝閘可轉動地設置於承載框架，安裝閘具有兩個固持臂，兩個固持臂分別設置於安裝閘的相對兩側。太陽能板設置於機殼的頂側。芳香包能替換地裝設於安裝閘的兩個固持臂之間。搖擺裝置設置於座體，並電連接於太陽能板以接受電力。當裝有芳香包的安裝閘於關閉位置時，刺破結構能用以刺破芳香包；其中搖擺裝置能進行鐘擺運動，並能產生氣流以擴散芳香包中的揮發性液體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A solar aromatizer includes a base, a casing, an aroma package, an installation gate, a solar panel, a swinging device. The base includes a wall-hanging plate, a supporting frame, and a piercing structure. The supporting frame is connected to a front end of the wall-hanging plate. The piercing structure is connected to the supporting frame. The casing is detachably connected to the base, and has an observation window. The casing can move between an open position and a closed position. The installation gate is rotatably arranged on the supporting frame, and has two holding arms. The two holding arms are respectively arranged on opposite sides of the installation gate. The solar panel is arranged on a top side of the casing. The aroma package can be installed interchangeably between the two holding arms of the mounting gate. The swing device is installed on the base and electrically connected to the solar panel to receive power. When the installation gate containing the aroma package is in the closed position, the piercing structure can be used to puncture the aroma package; the swinging device can perform a pendulum motion and can generate airflow to diffuse the volatile liquid in the aroma package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:座體</p>  
        <p type="p">12:壁掛板</p>  
        <p type="p">120:組裝開口</p>  
        <p type="p">14:承載框架</p>  
        <p type="p">141:上框</p>  
        <p type="p">142:側框</p>  
        <p type="p">1420:樞接部</p>  
        <p type="p">143:前框</p>  
        <p type="p">145:彈性臂</p>  
        <p type="p">16:上組裝座</p>  
        <p type="p">18:刺破結構</p>  
        <p type="p">181、182:刺穿件</p>  
        <p type="p">19:下組裝座</p>  
        <p type="p">20:機殼</p>  
        <p type="p">22:前面板</p>  
        <p type="p">220:觀測窗</p>  
        <p type="p">24:側板</p>  
        <p type="p">30:芳香包</p>  
        <p type="p">40:安裝閘</p>  
        <p type="p">42:固持臂</p>  
        <p type="p">44:擋止桿</p>  
        <p type="p">50:太陽能板</p>  
        <p type="p">60:搖擺裝置</p>  
        <p type="p">61:連接件</p>  
        <p type="p">62:搖擺桿</p>  
        <p type="p">63:葉片</p>  
        <p type="p">65:感應部</p>  
        <p type="p">70:支撐架</p>  
        <p type="p">71:支撐柱</p>  
        <p type="p">72:卡勾</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="207" publication-number="202611463"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611463.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611463</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133778</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封閉式水冷散熱器</chinese-title>  
        <english-title>CLOSED-LOOP LIQUID COOLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">F28F3/02</main-classification>  
        <further-classification edition="200601120241125B">F28F21/08</further-classification>  
        <further-classification edition="200601120241125B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾姆勒科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMULAIRE THERMAL TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊景明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHING-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李國維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張銘軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MING-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封閉式水冷散熱器包括一銅散熱件及一鋁散熱件。銅散熱件及鋁散熱件之間形成一流道供冷卻液流動。銅散熱件和鋁散熱件是以摩擦攪拌焊相接合而形成至少有一接合面。銅散熱件和鋁散熱件之間形成至少有一間隙，且間隙內鍍有化學鍍鎳置入層，使間隙＜0.1mm。銅散熱件及鋁散熱件分別會與冷卻液接觸的銅面及鋁面分別鍍有至少一層厚度為5~13um的化學鍍鎳表面層，其用以代替銅面及鋁面與冷卻液接觸，藉此避免電位差腐蝕。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A closed-loop liquid cooler includes a copper heat sink and an aluminum heat sink. A channel is formed between the copper heat sink and the aluminum heat sink for a coolant to flow through it. The copper heat sink and the aluminum heat sink are joined together by friction stir welding to form at least one joint surface. At least one gap is formed between the copper heat sink and the aluminum heat sink. The gap is plated with an electroless nickel plating inner layer to make the gap ＜ 0.1mm. The copper and aluminum heat sinks that are in contact with the coolant are respectively plated with at least one electroless nickel plating layer with a thickness of 5-13um, which is used to replace the copper and aluminum surfaces that are in contact with the coolant, thereby preventing the potential difference corrosion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:銅散熱件</p>  
        <p type="p">101:銅鰭片</p>  
        <p type="p">102:銅基座</p>  
        <p type="p">15:接合面</p>  
        <p type="p">20:鋁散熱件</p>  
        <p type="p">202:鋁蓋</p>  
        <p type="p">40:化學鍍鎳表面層</p>  
        <p type="p">PA:流道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="208" publication-number="202611395"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611395.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611395</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133785</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>小水力垂降水位式水車發電機</chinese-title>  
        <english-title>SMALL HYDRAULIC VERTICAL WATER LEVEL WATERWHEEL GENERATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">F03B1/00</main-classification>  
        <further-classification edition="200601120241125B">F03B3/12</further-classification>  
        <further-classification edition="200601120241125B">F03B11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍華科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳常熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHANG-HSI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭瑞昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, RUEY-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳光禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUANG-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈登宬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, DENG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉子儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TZU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊傳鏈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種小水力垂降水位式水車發電機，包含：一導水框體，該導水框體為一矩形；二弧形導板，二該弧形導板分別為一第一弧形導板與一第二弧形導板，二該弧形導板於該導水框體內對稱設置；一旋轉傳動機構，位於該二弧形導板中間，具有一傳動桿與設置在該傳動桿周邊的一旋轉扇葉；以及一加速齒輪發電機組，連接該傳動桿，並位於該導水框體的該頂面；其中，該第一弧形導片的端部與該第一側面形成一出水口，該第二弧形導片的端部與該第三側面形成一入水口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A small hydraulic vertical water level waterwheel generator includes: a water-guiding frame, the water-guiding frame is a rectangle; two arc-shaped guide plates, the two arc-shaped guide plates are respectively a first arc-shaped guide plate and a first arc-shaped guide plate. a second arc-shaped guide plate, the two arc-shaped guide plates are symmetrically arranged in the water guide frame; a rotation transmission mechanism, located in the middle of the two arc-shaped guide plates, has a transmission rod and a rotating fan blade arranged around the transmission rod; and an acceleration gear generator set is connected to the transmission rod and located on the top surface of the water guide frame; wherein the end of the first arc-shaped guide piece and the first side surface form a water outlet, and the second arc-shaped guide plate forms a water outlet. The end of the shaped guide piece and the third side form a water inlet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:導水框體</p>  
        <p type="p">11:頂面</p>  
        <p type="p">12:底面</p>  
        <p type="p">13:第一側面</p>  
        <p type="p">14:第二側面</p>  
        <p type="p">15:第三側面</p>  
        <p type="p">16:第四側面</p>  
        <p type="p">201:第一弧形導板</p>  
        <p type="p">202:第二弧形導板</p>  
        <p type="p">30:旋轉傳動機構</p>  
        <p type="p">40:加速齒輪發電機組</p>  
        <p type="p">101:出水口</p>  
        <p type="p">102:入水口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="209" publication-number="202611368"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611368.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611368</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133786</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>異物排除機構</chinese-title>  
        <english-title>FOREIGN OBJECTION REMOVAL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">E02B5/08</main-classification>  
        <further-classification edition="200601120241105B">E02B9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍華科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳常熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHANG-HSI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭瑞昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, RUEY-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳光禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUANG-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈登宬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, DENG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉子儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TZU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊傳鏈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種異物排除機構，包含：一對稱支撐架體、二活動式導流板、一傳動機構輪組，包含一傳動連桿導輪組與一傳動齒輪組、一攔截循環網帶、一沉水動輪組、複數個傳動鍊條，該些傳動鍊條繞設於該傳動齒輪組及該沉水動輪組之間；其中，該傳動連桿導輪組包含一第一傳動組、一第二傳動組以及一第三傳動組，該第一傳動組、該第二傳動組以及該第三傳動組相對位置形成一三角形；其中，該傳動齒輪組具有至少二齒輪對組，每一齒輪對組皆具有一大齒輪以及與該大齒輪相鄰並同軸設置的一小齒輪。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An objection removal device, comprising: a pair of symmetrical support frames, two movable deflectors, a transmission mechanism wheel set, which includes a transmission link guide wheel set and a transmission gear set, an interception circulating belt, a submerged driving wheel set, and multiple transmission chains, where the transmission chains are arranged between the transmission gear set and the submerged driving wheel set. The transmission link guide wheel set includes a first transmission set, a second transmission set, and a third transmission set, with the relative positions of the first, second, and third transmission sets forming a triangle. The transmission gear set has at least two gear pair sets, each gear pair set having a large gear and a small gear adjacent to and coaxially arranged with the large gear.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:活動式導流板</p>  
        <p type="p">60:異物排除機構</p>  
        <p type="p">61:對稱支撐架體</p>  
        <p type="p">611:側架體</p>  
        <p type="p">62:傳動連桿導輪組</p>  
        <p type="p">621:第一傳動組</p>  
        <p type="p">6211:導輪</p>  
        <p type="p">6212:傳動連桿</p>  
        <p type="p">622:第二傳動組</p>  
        <p type="p">6221:導輪</p>  
        <p type="p">6222:傳動連桿</p>  
        <p type="p">623:第三傳動組</p>  
        <p type="p">6231:導輪</p>  
        <p type="p">6232:傳動連桿</p>  
        <p type="p">633:循環傳動鍊條</p>  
        <p type="p">64:導出蝸板</p>  
        <p type="p">65:傳動齒輪組</p>  
        <p type="p">651:第一齒輪對組</p>  
        <p type="p">652:第二齒輪對組</p>  
        <p type="p">653:第三齒輪對組</p>  
        <p type="p">66:傳動鍊條</p>  
        <p type="p">661:第一傳動鍊條</p>  
        <p type="p">662:第二傳動鍊條</p>  
        <p type="p">663:第三傳動鍊條</p>  
        <p type="p">67:沉水動輪組</p>  
        <p type="p">672:動力軸桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="210" publication-number="202611543"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611543.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611543</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133788</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉速量測裝置及方法</chinese-title>  
        <english-title>ROTATIONAL SPEED MEASUREMENT APPARATUS AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">G01S15/58</main-classification>  
        <further-classification edition="200601120241104B">G01S7/539</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林奇嶽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHI-YUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡世杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳江村</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIANG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊富凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, FU-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡予瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, YU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種轉速量測裝置及方法。該裝置轉換基於時域的一回波為基於頻域的一功率頻譜，其中該回波對應該裝置發出的具有一參考頻率的一參考聲波。該裝置在該功率頻譜中，擷取對應該參考頻率的一旁瓣頻率，其中該旁瓣頻率相對於複數個相鄰頻率具有一相對峰值。該裝置基於該旁瓣頻率及該參考頻率，計算一待測物運轉時的一轉速。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A rotational speed measurement apparatus and method are provided. The apparatus transforms a rebound wave based on a time domain into a power spectrum based on a frequency domain, wherein the rebound wave corresponds to a reference sound wave having a reference frequency emitted by the apparatus. The apparatus retrieves a sidelobe frequency corresponding to the reference frequency from the power spectrum, wherein the sidelobe frequency has a relative peak related to multiple adjacent frequency. The apparatus calculates a rotational speed of an object to be tested while operation based on the sidelobe frequency and the reference frequency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:轉速量測裝置</p>  
        <p type="p">12:處理器</p>  
        <p type="p">14:聲波發射器</p>  
        <p type="p">16:聲波接收器</p>  
        <p type="p">O:待測物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="211" publication-number="202612426"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612426.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612426</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133791</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具活動式散熱機構的機殼</chinese-title>  
        <english-title>CHASSIS WITH MOVABLE HEAT-DISSIPATION MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">H05K7/20</main-classification>  
        <further-classification edition="200601120240930B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和碩聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGATRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡偉凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, WEI-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具活動式散熱機構的機殼包括一機架殼體、一托盤、一連桿驅動件、及一門蓋。機架殼體包括一側壁。托盤可滑動地設置於機架殼體內且能承載一電子裝置，托盤具有一托盤插銷。連桿驅動件可滑動地設置於側壁。門蓋樞接於機架殼體、以及連桿驅動件。當托盤容納該電子裝置並且相對於機架殼體朝門蓋移動，連桿驅動件被該電子裝置推動以驅動門蓋旋轉至一開啟位置。當托盤相對於機架殼體沿遠離門蓋的方向移動，托盤插銷帶動連桿驅動件，連桿驅動件帶動門蓋旋轉至一關閉位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chassis with movable heat-dissipation mechanism includes a bracket housing, a tray, a linkage actuated member, and a cover. The bracket housing has a side wall. The tray is slidably disposed in the bracket housing, and capable of accommodating an electrical device. The tray has a tray pin. The linkage actuated member is slidably disposed on the side wall. The cover is pivotally mounted to the bracket housing and the linkage actuated member. When the tray is moved toward the cover related to the bracket housing, the linkage actuated member is pushed by the electrical device and drives the cover to rotate to an opened position. When the tray is moved away from the cover related to the bracket housing, the tray pin moves the linkage actuated member, and the linkage actuated member pushes the cover to rotate to a closed position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機架殼體</p>  
        <p type="p">12:側壁</p>  
        <p type="p">123:托盤導軌</p>  
        <p type="p">14:散熱壁</p>  
        <p type="p">20:托盤</p>  
        <p type="p">21:側板</p>  
        <p type="p">211:托盤插銷</p>  
        <p type="p">212:導軌滑輪</p>  
        <p type="p">30:連桿驅動件</p>  
        <p type="p">31:第一連桿</p>  
        <p type="p">32:第二連桿</p>  
        <p type="p">323:勾部</p>  
        <p type="p">40:門蓋</p>  
        <p type="p">41:下緣樞接部</p>  
        <p type="p">42:側邊樞接部</p>  
        <p type="p">9:電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="212" publication-number="202610783"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610783.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610783</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133794</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種螺絲鎖附管制方法及系統</chinese-title>  
        <english-title>A SCREW LOCKING CONTROL METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B25B23/151</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范綱倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, KANG-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟憲明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENG, HSIEN-MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, WU-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖祝湘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張基霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁仁龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, JEN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋柏駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, PO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳國樟</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種螺絲鎖附系統包括一電腦裝置、耦接該電腦裝置的一攝影裝置、及耦接該電腦裝置的一螺絲鎖附工具。該電腦裝置能接收該攝影裝置所拍攝的一即時影像並追踪該即時影像中的一螺絲鎖附工具的位置，及根據目前所追踪到的一位置與從一鎖附順序資訊依序讀取到的鎖附範圍，判斷該螺絲鎖附工具是否已進入一正確鎖附範圍，並根據判斷結果決定禁能或致能該螺絲鎖附工具。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A screw locking system includes a computer device, a camera device coupled to the computer device, and a screw locking tool coupled to the computer device. The computer device is able to receive a real-time image captured by the camera device and track the position of a screw locking tool within the real-time image, and determines whether the screw locking tool has entered the correct locking range based on the tracked position and the locking range read from a locking sequence information, and then determines whether to disable or enable the screw locking tool according to the determined result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電腦裝置</p>  
        <p type="p">11:電腦主機</p>  
        <p type="p">12:顯示器</p>  
        <p type="p">2:攝影裝置</p>  
        <p type="p">3:螺絲鎖附工具</p>  
        <p type="p">4:工作區域</p>  
        <p type="p">5:產品</p>  
        <p type="p">6:使用者</p>  
        <p type="p">A~C:螺絲孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="213" publication-number="202611629"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611629.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611629</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133795</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測微影製程中缺陷圖案印出風險的方法及其具有電腦可執行指令的電腦程式產品</chinese-title>  
        <english-title>METHOD OF INSPECTING A RISK OF PRINTING DEFECT PATTERN IN PHOTOLITHOGRAPHY PROCESS AND COMPUTER PROGRAM PRODUCT WITH COMPUTER-EXECUTABLE INSTRUCTIONS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120240927B">G03F1/84</main-classification>  
        <further-classification edition="201201120240927B">G03F1/72</further-classification>  
        <further-classification edition="201201120240927B">G03F1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱知蔚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史佩珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, PEI-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種檢測微影製程中缺陷圖案印出的方法，包含在空間影像模擬中產生一光罩圖案的強度曲線，該強度曲線具有一主波谷以及一鄰近該主波谷的次波谷，該空間影像模擬具有一閾值強度以及一與該次波谷相交而界定出的強度區域、將該強度區域分割成多個長方形切割塊、加總該些長方形切割塊的面積而得出一總面積、以及當該總面積小於一規範值時，判定該光罩圖案無形成缺陷圖案的風險，而當該總面積大於一規範值時，判定該光罩圖案有形成缺陷圖案的風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of inspecting a risk of printing defect pattern in photolithography process, including generating an intensity curve of a photomask pattern in aerial image simulation, wherein the intensity curve is provided with a primary trough and a secondary troughs adjacent to the primary trough, the aerial image simulation is provided with a threshold intensity intersecting one of the secondary troughs to define an intensity area, partitioning the intensity area into multiple rectangular fragments, summing up areas of the rectangular fragments to obtain a total area, and determining the photomask pattern having no risk of forming defect pattern if the total area is smaller than a spec value and determining the photomask pattern having risk of forming defect pattern if the total area is larger than the spec value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:強度面積</p>  
        <p type="p">D:強度差</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">I&lt;sub&gt;d&lt;/sub&gt;:容許值</p>  
        <p type="p">I&lt;sub&gt;n&lt;/sub&gt;:額定強度</p>  
        <p type="p">I&lt;sub&gt;th&lt;/sub&gt;:閾值強度</p>  
        <p type="p">T1:主波谷</p>  
        <p type="p">T2:次波谷</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="214" publication-number="202611585"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611585.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611585</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像鏡頭、相機模組、電子裝置及移動運輸工具</chinese-title>  
        <english-title>IMAGING LENS ASSEMBLY, CAMERA MODULE, ELECTRONIC DEVICE AND MOBILE TRANSPORTATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241007B">G02B7/02</main-classification>  
        <further-classification edition="202101120241007B">G02B7/20</further-classification>  
        <further-classification edition="202101120241007B">G03B17/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN PRECISION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張臨安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, LIN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭慎吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, SHEN WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃炫欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSUAN-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種成像鏡頭，具有光軸，且包含透鏡元件、環狀遮光結構、塑膠鏡筒、物側固定件及像側固定件。透鏡元件包含物側透鏡元件與像側透鏡元件。物側透鏡元件、環狀遮光結構及像側透鏡元件沿光軸從成像鏡頭的物側至像側依序設置，且環狀遮光結構包含遮光面、物側面、像側面及條狀楔型結構。物側面與像側面由遮光面往遠離光軸的方向延伸。條狀楔型結構設置於遮光面。透鏡元件及環狀遮光結構設置於塑膠鏡筒中。物側固定件與像側固定件分別設置於塑膠鏡筒的物側部與像側部。藉此，可提供較高的光學品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imaging lens assembly has an optical axis, and includes lens elements, an annular light blocking structure, a plastic lens barrel, an object-side retainer and an image-side retainer. The lens elements include an object-side lens element and an image-side lens element. The object-side lens element, the annular light blocking structure and the image-side lens element are disposed sequentially along the optical axis from an object side to an image side of the imaging lens assembly, and the annular light blocking structure includes a light blocking surface, an object-side surface, an image-side surface and a plurality of strip-shaped wedge structures. The object-side surface and the image-side surface extend from the light blocking surface towards a direction away from the optical axis. The strip-shaped wedge structures are disposed on the light blocking surface. The lens elements and the annular light blocking structure are disposed in the plastic lens barrel. The object-side retainer and the image-side retainer are disposed on an object-side portion and an image-side portion of the plastic lens barrel, respectively. Therefore, the higher optical quality can be provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:成像鏡頭</p>  
        <p type="p">111:透鏡元件</p>  
        <p type="p">130:塑膠鏡筒</p>  
        <p type="p">140:物側固定件</p>  
        <p type="p">150:像側固定件</p>  
        <p type="p">X:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="215" publication-number="202612238"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612238.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612238</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源供應器及其控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H02M3/156</main-classification>  
        <further-classification edition="200601120241202B">G05F1/565</further-classification>  
        <further-classification edition="200601120241202B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康舒科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅正校</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, CHENG-HSIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種電源供應器及其控制方法，電源供應器包含：電源轉換單元用以基於一輸入電源進行電源轉換並產生一輸出電流；其中，電源轉換單元具有一電源輸出端，且電源轉換單元從電源輸出端輸出該輸出電流；電流取樣電路電性連接電源轉換單元的電源輸出端，用以取樣輸出電流的暫態變化，並據以產生反應暫態變化幅度的一輸出電壓差異信號；以及信號比較單元，電性連接電流取樣電路，接收輸出電壓差異信號，並以預設電壓值比較輸出電壓差異信號；其中當輸出電壓差異信號大於等於預設電壓值時，信號比較單元產生動態補償指令。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電源供應器</p>  
        <p type="p">P:電源</p>  
        <p type="p">10:電源轉換單元</p>  
        <p type="p">11:電流取樣電路</p>  
        <p type="p">16:信號比較單元</p>  
        <p type="p">
        &lt;i&gt;I&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;out&lt;/i&gt;
        &lt;/sub&gt;:輸出電流</p>  
        <p type="p">
        &lt;i&gt;C&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;out&lt;/i&gt;
        &lt;/sub&gt;:輸出電容</p>  
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;out&lt;/i&gt;
        &lt;/sub&gt;:輸出電壓信號</p>  
        <p type="p">
        &lt;i&gt;R&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;L&lt;/i&gt;
        &lt;/sub&gt;:負載電阻</p>  
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;diff&lt;/i&gt;
        &lt;/sub&gt;:輸出電壓差異信號</p>  
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;th&lt;/i&gt;
        &lt;/sub&gt;:預設電壓值</p>  
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;cmd&lt;/i&gt;
        &lt;/sub&gt;:動態補償指令</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="216" publication-number="202611398"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611398.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611398</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133809</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風力發電機的發電量異常判斷方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241105B">F03D17/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>春禾科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>台中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳坤宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種風力發電機的發電量異常判斷方法，由一處理單元執行，該處理單元透過一風力發電機的複數歷史風能資料及複數歷史發電量資料建立一風電預測模型，該風電預測模型接收一即時風能資料以計算出該即時風能資料對應的一預測發電量，該處理單元根據該預測發電量與該風力發電機的一即時發電量計算一發電量差值，再判斷該發電量差值是否大於或等於一電量誤差值以判斷該風力發電機的發電狀況是否正常，藉此從業人員能運用本發明了解風力發電機的運作狀況，以優先維護發電量異常的風力發電機而掌握整體風力發電機的發電效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="217" publication-number="202610858"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610858.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610858</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133816</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充電樁管控系統及方法</chinese-title>  
        <english-title>CHARGING STATION MANAGEMENT AND CONTROL SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241101B">B60L53/60</main-classification>  
        <further-classification edition="201901120241101B">B60L53/31</further-classification>  
        <further-classification edition="201901120241101B">B60L53/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易控智慧生活科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EASY CONTROL TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周世泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, SHIH-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請關於一種充電樁管控系統，包括：前台顯示模組及後台管控模組。後台管控模組與前台顯示模組連線，並包括數據收發模組以及數據處理模組。數據收發模組用於取得充電樁對應的用電記錄數據。數據處理模組根據用電記錄數據計算充電樁的用電量資訊。其中，數據處理模組還包含充電樁設定單元，且充電樁設定單元根據用電量數據判斷是否控制充電樁停止供電，且前台顯示模組用於顯示充電樁的相關資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A charging station management and control system is provided. The system includes a front-end display module and a back-end management and control module connected with the front-end display module. The back-end management and control module includes a data transceiver module used to receive an electricity record data corresponding to a charging station and a data process module used to calculate a power consumption information of the charging station. Wherein, the data process module further includes a charging station setting unit used to determine whether to control the charging station to stop power supply according to the power consumption information, and the front-end display module used to display related information of the charging station.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:前台顯示模組</p>  
        <p type="p">20:後台管控模組</p>  
        <p type="p">30:BA系統</p>  
        <p type="p">40:遠端物業系統</p>  
        <p type="p">50:充電樁</p>  
        <p type="p">60:充電樁群組</p>  
        <p type="p">11、21:數據收發模組</p>  
        <p type="p">12:顯示介面</p>  
        <p type="p">13:前台操作介面</p>  
        <p type="p">22:數據處理模組</p>  
        <p type="p">23:後台顯示/操作介面</p>  
        <p type="p">24:API發送模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="218" publication-number="202610782"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610782.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610782</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133821</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>扭力接桿</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241030B">B25B23/143</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡厚飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡厚飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種扭力接桿，其包含本體、傳動桿、防脫套件、低摩擦裝置、離合裝置及扭力裝置。傳動桿插設於本體，並具有環繞外露設置於本體的第一凹槽；防脫套件套接於本體且內緣具有第二凹槽，第二凹槽與第一凹槽形成設置空間；低摩擦裝置設置於設置空間中；離合裝置連接傳動桿，且離合裝置能夠於傳動狀態及跳脫狀態間變換；扭力裝置提供預定扭力抵接於離合裝置，使離合裝置處於傳動狀態，以便傳動桿經由離合裝置傳遞扭力至本體；當傳動桿承受的扭力大於預定扭力時，離合裝置能夠變換至跳脫狀態，讓傳動桿無法傳遞扭力至本體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:扭力接桿</p>  
        <p type="p">11:第一端</p>  
        <p type="p">12:第二端</p>  
        <p type="p">121:工件結合孔</p>  
        <p type="p">13:腔室</p>  
        <p type="p">14:螺孔</p>  
        <p type="p">15:彈簧孔</p>  
        <p type="p">16:橫孔</p>  
        <p type="p">20:傳動桿</p>  
        <p type="p">21:插設端</p>  
        <p type="p">22:第一凹槽</p>  
        <p type="p">23:工具連接端</p>  
        <p type="p">30:防脫套件</p>  
        <p type="p">31:連接部</p>  
        <p type="p">32:止擋部</p>  
        <p type="p">321:第二凹槽</p>  
        <p type="p">41:球形接觸件</p>  
        <p type="p">50:離合裝置</p>  
        <p type="p">51:第一齒件</p>  
        <p type="p">511:第一齒部</p>  
        <p type="p">52:第二齒件</p>  
        <p type="p">521:第二齒部</p>  
        <p type="p">522:長槽</p>  
        <p type="p">53:限位桿</p>  
        <p type="p">60:扭力裝置</p>  
        <p type="p">61:固定件</p>  
        <p type="p">62:彈性件</p>  
        <p type="p">70:扣環</p>  
        <p type="p">80:磁吸件</p>  
        <p type="p">90:包覆件</p>  
        <p type="p">L:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="219" publication-number="202611399"> 
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      <tif no="1" file="202611399.zip"/>
    </tif-files>
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      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611399</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133826</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兼具綠能發電及水文監測之行動屋裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240920B">F03G6/06</main-classification>  
        <further-classification edition="200601120240920B">F03G7/00</further-classification>  
        <further-classification edition="200601120240920B">F03G7/04</further-classification>  
        <further-classification edition="200601120240920B">F03B13/00</further-classification>  
        <further-classification edition="200601120240920B">H02J7/00</further-classification>  
        <further-classification edition="202001120240920B">G16Y40/10</further-classification>  
        <further-classification edition="202001120240920B">G16Y10/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立雲林科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫志超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, JET-CHAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘志龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, CHIH-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫振翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, ZHEN-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁金富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHIN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙元寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係包括一上層屋體、一下層屋體、一水文監測裝置、至少一太陽能發電裝置、一通訊部、一儲能部、一水力發電裝置及一中控部。上、下層屋體上下連結成一體，其間設一維修口相互連通。水文監測裝置設於上層屋體，用以監測一河川之水文狀態資訊；太陽能發電裝置設於上層屋體以進行太陽能發電。通訊部及儲能部皆設於上層屋體，用以對外傳輸水文狀態資訊與儲存電能；水力發電裝置設於下層屋體，可利用河川之水流發電並儲電於儲能部；中控部設於上層屋體內，用以連結及進行控制。本案達到兼具水文監測、水力發電及太陽能發電相當方便、設有可置換水輪機部便於依需求更換，及可彈性遷移至所要之地點等優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:上層屋體</p>  
        <p type="p">11:上層殼體</p>  
        <p type="p">111:頂面</p>  
        <p type="p">20:下層屋體</p>  
        <p type="p">21:下層殼體</p>  
        <p type="p">30:水文監測裝置</p>  
        <p type="p">40:太陽能發電裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="220" publication-number="202611883"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611883.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611883</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133835</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種具有軌道大腦創知功能輔助學習模組的腦力鍛鍊評價輔助工具</chinese-title>  
        <english-title>A KIND OF BRAIN EXERCISE EVALUATION AUXILIARY TOOL WITH A TRACK-STYLE BRAIN CREATION FUNCTION AUXILIARY LEARNING MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250205B">G09B1/00</main-classification>  
        <further-classification edition="200601120250205B">G09B19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>創智生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRANSGENE BIOTECHNOLOGY COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃慶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐文雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEN-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種具有軌道大腦創知功能輔助學習模組的腦力鍛鍊評價輔助工具，其包含有一可快速連結基礎軌道環境模組，一大腦創知功能輔助學習模組，以及一注意力引導模組，其中該大腦創知功能輔助學習模組，包含一基礎軌道結合模組，一回饋提示傳遞响應模組，一動態反應回饋模組，一認知提示卡結合模組，及一認知訊息模組，以達到建構醒腦動態互動輔助認知鍛鍊系統的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a brain exercise evaluation auxiliary tool with a track-style brain knowledge creation function auxiliary learning module, which includes a basic track environment module that can quickly connect, a brain knowledge creation function auxiliary learning module, and an attention guide module, wherein the brain knowledge creation function auxiliary learning module includes a basic track combination module, a feedback prompt transmission response module, a dynamic response feedback module, a cognitive prompt card combination module, and a cognitive Message module to achieve the purpose of constructing a refreshing and dynamic interactive auxiliary cognitive exercise system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:腦力鍛鍊評價輔助工具</p>  
        <p type="p">10:大腦創知功能輔助學習膜組</p>  
        <p type="p">100:大腦創知功能訊息提示卡模組</p>  
        <p type="p">200:大腦創知功能提示卡結合模組</p>  
        <p type="p">300:大腦創知功能提示模組</p>  
        <p type="p">400:回饋提示响應訊息模組</p>  
        <p type="p">500:動態反應偵測模組</p>  
        <p type="p">600:注意力引導模組</p>  
        <p type="p">700:基礎軌道結合模組</p>  
        <p type="p">900:基礎軌道環境模組</p>  
        <p type="p">999:基礎軌道環境</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="221" publication-number="202611535"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611535.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611535</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133848</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池漏電檢測系統及方法</chinese-title>  
        <english-title>BATTERY LEAKAGE DETECTION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241230B">G01R31/385</main-classification>  
        <further-classification edition="202001120241230B">G01R31/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李哲鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JE-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪裕翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, YU HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭泰華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, TAI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池漏電檢測系統，包含脈衝產生器、電壓檢測器以及運算裝置。脈衝產生器連接於電池的正負極。電壓檢測器用於檢測電池於未連接於一負載的狀態下的多個檢測電壓值，或檢測所述電池被施加來自於脈衝產生器的脈衝訊號時的響應電壓訊號。運算裝置連接於電壓檢測器，用於計算所述檢測電壓值於多個連續時間區間的多個電壓偏差值，並於所述電壓偏差值的其中一者大於一預設閾值時判斷電池有漏電情形發生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery leakage detection system includes a pulse generator, a voltage detector and a computing device. The pulse generator is connected to the positive and negative terminals of the battery. The voltage detector is configured to detect a plurality of detection voltages ​​of the battery when it is not connected to a load, or detect response voltage signal of the battery when a pulse signal from the pulse generator is applied. The computing device is connected to the voltage detector and is configured to calculate a plurality of voltage deviation values ​​of the detection voltages in a plurality of continuous time intervals, and determine that a battery leakage occurs when one of the voltage deviation values ​​is greater than a preset threshold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電池漏電檢測系統</p>  
        <p type="p">11:脈衝產生器</p>  
        <p type="p">12:電壓檢測器</p>  
        <p type="p">13:運算裝置</p>  
        <p type="p">20:電池</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="222" publication-number="202611604"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611604.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611604</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133849</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板及其製造方法</chinese-title>  
        <english-title>DISPLAY PANEL AND METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241004B">G02F1/1335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瑤山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YAO-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育玄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示面板包括第一基板、第二基板、第一擋牆結構、第二擋牆結構、發光元件及色轉換圖案。第一擋牆結構與發光元件設置在第一基板上。發光元件位於第一擋牆結構定義的第一容置空間中。第二擋牆結構設置在第二基板上。設置在第一基板與第二基板之間的色轉換圖案包括彼此重疊且分離的第一部分與第二部分。第一部分設置在第一基板上且覆蓋發光元件。第二部分設置在第二基板上且位於第二擋牆結構定義的第二容置空間中。第一部分與第二部分沿著垂直於第一基板與第二基板的堆疊方向的方向分別具有第一寬度與第二寬度，且第二寬度小於第一寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display panel including a first substrate, a second substrate, a first bank structure, a second bank structure, a light emitting device and a color conversion pattern is provided. The first bank structure and the light emitting device are disposed on the first substrate. The light emitting device is located in a first accommodation space defined by the first bank structure. The second bank structure is disposed on the second substrate. The color conversion pattern disposed between the first substrate and the second substrate includes a first portion and a second portion overlapped with and separated from each other. The first portion is disposed on the first substrate and covers the light emitting device. The second portion is disposed on the second substrate and located in a second accommodation space defined by the second bank structure. The first portion and the second portion respective have a first width and a second width along a direction perpendicular to a stacking direction of the first substrate and the second substrate, and the second width is less than the first width.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示面板</p>  
        <p type="p">101:第一基板</p>  
        <p type="p">102:第二基板</p>  
        <p type="p">110、111、112、113:發光元件</p>  
        <p type="p">121:第一擋牆結構</p>  
        <p type="p">122:第二擋牆結構</p>  
        <p type="p">140:色轉換圖案</p>  
        <p type="p">141:第一部分</p>  
        <p type="p">142:第二部分</p>  
        <p type="p">151、152a、152b:透光圖案</p>  
        <p type="p">181、182:保護層</p>  
        <p type="p">AS1:第一容置空間</p>  
        <p type="p">AS2:第二容置空間</p>  
        <p type="p">BM:遮光圖案層</p>  
        <p type="p">CF1、CF2、CF3:濾光圖案</p>  
        <p type="p">CL1、CL2:轉換光</p>  
        <p type="p">E1:第一電極</p>  
        <p type="p">E2:第二電極</p>  
        <p type="p">ES:磊晶結構層</p>  
        <p type="p">h1、h2:高度</p>  
        <p type="p">Hd:元件高度</p>  
        <p type="p">L:光線</p>  
        <p type="p">PA1、PA2、PA3:畫素區</p>  
        <p type="p">W1、W2、Wa、Wb:寬度</p>  
        <p type="p">Wd:元件寬度</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="223" publication-number="202611370"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611370.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611370</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>營建立樁之施工方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">E02D7/22</main-classification>  
        <further-classification edition="200601120241125B">E02D11/00</further-classification>  
        <further-classification edition="200601120241125B">E02D13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>磐鼎營造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李坤得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李裕萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種營建立樁之施工方法，包含：(A)利用一鑽掘機之一導筒導引定位一套管，並將該套管之上端接合於該鑽掘機之一馬達；(B)利用該馬達帶動該套管及該鑽掘機之一螺旋鑽桿旋轉，使該套管及該螺旋鑽桿鑽掘一軟土基地至一預定深度，其中，該螺旋鑽桿掘取的軟土可經由該套管之一排放孔排出；(C)將該套管與該馬達分離；(D)利用該螺旋鑽桿內部管道，將水泥漿灌入該套管之內部空間，繼而拔出該螺旋鑽桿；(E)將一營建立樁插設於該水泥漿；(F)回填乾砂石於該水泥漿上；及(G)拔出該套管。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S31~S37:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="224" publication-number="202611650"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611650.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611650</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133854</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作業環境部署方法及系統</chinese-title>  
        <english-title>OPERATION ENVIRONMENT DEPLOYMENT METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G05B19/4093</main-classification>  
        <further-classification edition="200601120241007B">G05B19/418</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游國樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, KUO-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游國樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, KUO-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種作業環境部署方法，適用於包含工作單元的作業環境，其中工作單元各包含多個設備，且所述方法包括：從單元模型取得作業環境的第一當前部署狀態及目標部署狀態並進行問題規劃，利用預存行動組塊進行領域規劃，根據預存語意情境圖產生行動組塊序列，將行動組塊序列拆解為多個目標行動特徵，從單元模型取得作業環境的第二當前部署狀態，根據目標行動特徵及第二當前部署狀態產生可修改控制圖，根據可修改控制圖輸出控制指令至設備及取得對應的回饋狀態，以及根據設備對應的感知資料建構三維幾何情境圖及本地語意情境圖。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An operation environment deployment method, adapted to an operation environment including a work cell, wherein the work cell includes multiple equipment, and the method includes: obtaining a first current deployment status and a target deployment status of the operation environment from a cell model and performing problem planning, using pre-stored action chuncks to perform domain planning, generating an action chunk sequence according to a pre-stored semantic scene graph, dismantling the action chunk sequence into target action features, obtaining a second current deployment status of the operation environment from the cell model, generating a configurable control graph according to the target action features and the second current deployment status, outputting control commands to the equipment according to the configurable control graph and obtaining corresponding feedback status, and building a three-dimensional geometric scene and a local semantic scene according to sensory data corresponding to the equipment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S103,S105,S107,S109,S111:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="225" publication-number="202611605"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611605.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611605</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及電子裝置之重工方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND REWORKING METHOD FOR THE ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G02F1/1335</main-classification>  
        <further-classification edition="200601120241007B">H05K3/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尹婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YIN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慧娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇柏元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, BO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種電子裝置，其包含：發光模組，具有光源模塊；背框，配置以支承該光源模塊，且具有至少一通孔；至少一易拉膠，分別沿著延伸方向區分為第一區段及第二區段，且穿過至少一通孔而翻折，使得第一區段及第二區段分別位於該至少一通孔的不同側而貼附於背框朝向不同方向之不同表面上；以及電路基板。第一區段之至少一部分黏接光源模塊與背框，而第二區段之至少一部分黏接背框與電路基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an electronic device, which includes: a light emitting module having a light source module; a back frame configured to support the light source module and having at least one through hole; at least one stretch release adhesive tape which is divided into a first section and a second section along the extending direction, and is folded through the at least one through hole so that the first section and the second section are respectively located on different sides of the at least one through hole and attached on different surfaces of the back frame facing different directions; and a circuit substrate. At least a part of the first section bonds the light source module and the back frame, and at least a part of the second section bonds the back frame and the circuit substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:背框</p>  
        <p type="p">110:底板</p>  
        <p type="p">200:發光模組</p>  
        <p type="p">210:光源模塊</p>  
        <p type="p">220:第一柔性電路板</p>  
        <p type="p">300:光學膜片</p>  
        <p type="p">400:功能模組</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">Dk:翻折方向</p>  
        <p type="p">Dm、Dt:安裝方向</p>  
        <p type="p">F1:正面</p>  
        <p type="p">F2:背面</p>  
        <p type="p">H:通孔</p>  
        <p type="p">PB:電路基板</p>  
        <p type="p">S1:第一側邊</p>  
        <p type="p">S2:第二側邊</p>  
        <p type="p">S3:第三側邊</p>  
        <p type="p">S4:第四側邊</p>  
        <p type="p">ST:易拉膠</p>  
        <p type="p">T1:第一區段</p>  
        <p type="p">T2:第二區段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="226" publication-number="202612206"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612206.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612206</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133859</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>過電壓保護元件</chinese-title>  
        <english-title>OVER-VOLTAGE PROTECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H02H9/04</main-classification>  
        <further-classification edition="200601120241202B">H01L23/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聚鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLYTRONICS TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖璇真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, HSUAN CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏修哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, HSIU-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董朕宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNG, CHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉振男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHEN-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱敬庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHINGTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YAO-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種過電壓保護元件，包含基板、變壓材料及電極組。基板的表面形成凹槽，而變壓材料容設於凹槽中。變壓材料包含絕緣金屬材料、鈣鈦礦系化合物及含矽樹脂。鈣鈦礦系化合物選自由鈦酸鈣、鈦酸鍶、鈦酸鋇及其組合所組成的群組。以變壓材料的體積為100%計，鈣鈦礦系化合物所佔的體積百分比為0.5%至4.5%。電極組包含第一電極及第二電極分別連接變壓材料的兩端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An over-voltage protection device includes a substrate, a voltage variable material, and an electrode set. A recess is formed on the surface of the substrate, and the voltage variable material is disposed in the recess. The voltage variable material includes an insulated metal material, a perovskite-based compound, and a silicone-containing resin. The perovskite-based compound is selected from the group consisting of calcium titanate, strontium titanate, barium titanate, and combinations thereof. The total volume of the voltage variable material is calculated as 100%, and the perovskite-based compound accounts for 0.5% to 4.5%. The electrode set includes a first electrode and a second electrode respectively connected to two terminals of the voltage variable material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:過電壓保護元件</p>  
        <p type="p">10:基板</p>  
        <p type="p">20:變壓材料</p>  
        <p type="p">30a:第一電極</p>  
        <p type="p">30b:第一延伸部</p>  
        <p type="p">30c:第一連接件</p>  
        <p type="p">30d:第三電極</p>  
        <p type="p">40a:第二電極</p>  
        <p type="p">40b:第二延伸部</p>  
        <p type="p">40c:第二連接件</p>  
        <p type="p">40d:第四電極</p>  
        <p type="p">C:保護層</p>  
        <p type="p">R:凹槽</p>  
        <p type="p">S1:上表面</p>  
        <p type="p">S2:下表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="227" publication-number="202610887"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610887.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610887</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車元件配對方法</chinese-title>  
        <english-title>PAIRING METHOD FOR BICYCLE COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241105B">B62J45/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彥豪智能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEKTRO TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊恂諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, HSUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自行車元件配對方法，包含判斷一電子操控模組的多個操控鍵及一功能鍵的觸發狀態。若電子操控模組的功能鍵及這些操控鍵之其中一者被觸發，則令電子操控模組進入一第一配對程序。第一配對程序包含令電子操控模組與自行車元件進行配對，以及指定電子操控模組的這些操控鍵中被觸發之該者控制自行車元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pairing method for a bicycle component includes determining activation states of a plurality of control keys and a functional key of an electronic control module. When the functional key and one of the control keys are activated, driving the electronic control module to perform a first pairing process. The first pairing process includes pairing the electronic control module with the bicycle component, and assigning the one of the control keys which is activated to control the bicycle component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S12:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="228" publication-number="202611457"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611457.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611457</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133861</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伺服器</chinese-title>  
        <english-title>SERVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">F28D5/00</main-classification>  
        <further-classification edition="200601120240927B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄔將軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JIANG-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雪鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XUEFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔應翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUI, YINGXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄔榮強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, RONGQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種伺服器，機箱設有安裝腔和排液口；隔斷件設於安裝腔內並將安裝腔分隔形成第一腔體和第二腔體，第一腔體內設有第一發熱機構並與排液口連通，第二腔體內設有第二發熱機構，隔斷件設有連通孔，第一腔體和第二腔體通過連通孔連通；分水器設於第一腔體內並設有第一進液管和第二進液管，第一進液管與第一腔體連通，第一進液管能夠向第一腔體輸送第一冷卻液，第二進液管透過連通孔與第二發熱機構連通，第二進液管能夠向第二發熱機構輸送第二冷卻液。與傳統技術相比，上述的伺服器無需將冷卻液充滿整個伺服器的機箱，從而降低冷卻液的循環週期，提高散熱效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application relates to a server. The chassis is provided with an installation cavity and a drain port; a partition is provided in the installation cavity and separates the installation cavity to form a first cavity and a second cavity. The first cavity is provided with a first heating mechanism and is connected to the drain port, a second heating mechanism is provided in the second cavity, the partition is provided with a communication hole, the first cavity and the second cavity are connected through the communication hole; the water distributor is located in the first cavity and provided with a first liquid inlet pipe and a second liquid inlet pipe. The first liquid inlet pipe is connected with the first cavity. The first liquid inlet pipe can transport the first cooling liquid to the first cavity. The second liquid inlet pipe is connected to the second heating mechanism via the communication hole, and the second liquid inlet pipe can transport the second cooling liquid to the second heating mechanism. Compared with traditional technology, the above-mentioned server does not need to fill the entire server chassis with coolant, thereby reducing the coolant cycle and improving heat dissipation efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:機箱</p>  
        <p type="p">110:安裝腔</p>  
        <p type="p">111:第一腔體</p>  
        <p type="p">112:第二腔體</p>  
        <p type="p">120:排液口</p>  
        <p type="p">140:第一對接通孔</p>  
        <p type="p">150:第二對接通孔</p>  
        <p type="p">200:隔斷件</p>  
        <p type="p">210:連通孔</p>  
        <p type="p">310:第一冷板</p>  
        <p type="p">311:第一進液口</p>  
        <p type="p">312:第一出液口</p>  
        <p type="p">410:第二冷板</p>  
        <p type="p">411:第二進液口</p>  
        <p type="p">412:第二出液口</p>  
        <p type="p">512:第一進液支管</p>  
        <p type="p">521:第二進液主管</p>  
        <p type="p">522:第二進液支管</p>  
        <p type="p">530:進液部</p>  
        <p type="p">540:進液管路</p>  
        <p type="p">610:第一端</p>  
        <p type="p">620:第二端</p>  
        <p type="p">630:匯液器</p>  
        <p type="p">720:第二格蘭頭</p>  
        <p type="p">730:第三格蘭頭</p>  
        <p type="p">800:走線殼體</p>  
        <p type="p">810:進管通孔</p>  
        <p type="p">820:走線槽</p>  
        <p type="p">830:走線通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="229" publication-number="202612427"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612427.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612427</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133864</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷分水器及伺服器液冷裝置</chinese-title>  
        <english-title>LIQUID COOLING WATER DISTRIBUTOR AND SERVER LIQUID COOLING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">H05K7/20</main-classification>  
        <further-classification edition="200601120241125B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧曉剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, XIAOGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HONG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俞帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種液冷分水器及伺服器液冷裝置。本發明所述的液冷分水器，包括進液主體、回液主體、進液管道和回液管道，進液主體沿橫向設置，進液主體的沿一側面設有多個輸出接口，進液主體的另一側面設有進液連接管，進液連接管與任一輸出接口均連通，輸出接口用於連接待冷卻設備的進液接口。回液主體沿橫向設置，回液主體的沿一側面設有多個輸入接口，回液主體的另一端面設有回液連接管，回液連接管與任一輸入接口均連通，輸入接口用於連接待冷卻設備的出液接口。進液管道的輸出端與進液連接管連接，回液管道的輸入端與回液連接管連接。本發明所述的液冷分水器及伺服器液冷裝置具有使用便捷、安全隱患小的優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid cooling water distributor and a server liquid cooling device are provided. The liquid cooling water distributor includes an inlet main body, an outlet main body, an inlet pipeline and an outlet pipeline. The inlet main body is disposed horizontally, one side surface of the inlet main body is provided with a plurality of output joints, another side surface of the inlet main body is provided with an inlet connection pipe, the inlet connection pipe communicates with the output joints, and the output joints are configured to be connected to inlet joints of a to-be-cooled apparatus. The outlet main body is disposed horizontally, one side surface of the outlet main body is provided with a plurality of input joints, another side surface of the outlet main body is provided with an outlet connection pipe, the outlet connection pipe communicates with the input joints, and the input joints are configured to be connected to outlet joints of the to-be-cooled apparatus. An output end of the inlet pipeline is connected to the inlet connection pipe. An input end of the outlet pipeline is connected to the outlet connection pipe. The liquid cooling water distributor and the server liquid cooling device have the advantages of convenient use and low safety hazards</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:液冷分水器</p>  
        <p type="p">100:進液主體</p>  
        <p type="p">110:輸出接口</p>  
        <p type="p">130:第一安裝架</p>  
        <p type="p">130A:第一凹槽</p>  
        <p type="p">130B:第一通孔</p>  
        <p type="p">200:回液主體</p>  
        <p type="p">210:輸入接口</p>  
        <p type="p">230:第二安裝架</p>  
        <p type="p">230A:第二凹槽</p>  
        <p type="p">230B:第二通孔</p>  
        <p type="p">300:進液管道</p>  
        <p type="p">310:第一管夾</p>  
        <p type="p">400:回液管道</p>  
        <p type="p">410:第二管夾</p>  
        <p type="p">500:排氣閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="230" publication-number="202612483"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612483.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612483</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133865</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含有可變電阻式記憶體和雙電容的半導體結構以及其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE INCLUDING RESISTIVE RANDOM ACCESS MEMORY AND DOUBLE CAPACITORS AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">H10B80/00</main-classification>  
        <further-classification edition="202301120241101B">H10B63/10</further-classification>  
        <further-classification edition="202301120241101B">H10B63/00</further-classification>  
        <further-classification edition="202301120241101B">H10N70/00</further-classification>  
        <further-classification edition="202301120241101B">H10N97/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林大鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, DA-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯泰成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, TAI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馥郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, FU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡濱祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, BIN-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種包含有可變電阻式記憶體(RRAM) 和雙電容的半導體結構，包含一基底，基底上定義有一元件區以及一電容區位於元件區旁，一可變電阻式記憶體位於元件區內，其中可變電阻式記憶體包含有一可變電阻層，以及一雙電容結構位於電容區內，其中雙電容結構包含一下電容結構以及一上電容結構，其中下電容結構中的一第一高介電常數層的材質與可變電阻式記憶體的可變電阻層的材質相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a semiconductor structure comprising a resistive random access memory (RRAM) and a double capacitor, which comprises a substrate, wherein a cell region and a capacitor region are defined on the substrate, and the resistive random access memory is located in the cell region, wherein the RRAM comprises a variable resistance layer, and a double capacitor structure is located in the capacitor region, wherein the double capacitor structure comprises a lower capacitor structure and an upper capacitor structure, and the material of a first high-k layer in the lower capacitor structure is the same as the material of the variable resistance layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:遮罩層</p>  
        <p type="p">12:遮罩層</p>  
        <p type="p">14:遮罩層</p>  
        <p type="p">16:遮罩層</p>  
        <p type="p">18:第四介電層</p>  
        <p type="p">20:導電通孔</p>  
        <p type="p">24:第一電極層(下電極)</p>  
        <p type="p">26A:可變電阻層</p>  
        <p type="p">26B:第一絕緣層</p>  
        <p type="p">27A:第一阻障層</p>  
        <p type="p">27B:第一阻障層</p>  
        <p type="p">28:第二電極層(中電極)</p>  
        <p type="p">29:第二高介電常數層</p>  
        <p type="p">30:第三電極層(上電極)</p>  
        <p type="p">34:氧化層</p>  
        <p type="p">36:介電層</p>  
        <p type="p">37:遮罩層</p>  
        <p type="p">38:介電層</p>  
        <p type="p">C1:下電容結構</p>  
        <p type="p">C2:上電容結構</p>  
        <p type="p">DC:雙電容結構</p>  
        <p type="p">IMD1:第一介電層</p>  
        <p type="p">IMD2:第二介電層</p>  
        <p type="p">IMD3:第三介電層</p>  
        <p type="p">M1:第一金屬層</p>  
        <p type="p">M2:第二金屬層</p>  
        <p type="p">M3:第三金屬層</p>  
        <p type="p">M4:第四金屬層</p>  
        <p type="p">M5:第五金屬層</p>  
        <p type="p">R1:元件區</p>  
        <p type="p">R2:電容區</p>  
        <p type="p">R3:邏輯區</p>  
        <p type="p">RRAM:可變電阻式記憶體</p>  
        <p type="p">S:基底</p>  
        <p type="p">V1:導電通孔</p>  
        <p type="p">V2:導電通孔</p>  
        <p type="p">V3:導電通孔</p>  
        <p type="p">V4:導電通孔</p>  
        <p type="p">V5:導電通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="231" publication-number="202611401"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611401.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611401</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133877</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓力錶可收納的落地式打氣筒</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">F04B33/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雙餘實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BETO ENGINEERING &amp; MARKETING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王羅平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LO PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種壓力錶可收納的落地式打氣筒，包括：一底座，其上側設有一組設槽；一環形流道，形成於該組設槽之外周面；該組設槽與該環形流道氣體連通；一打氣缸，係固設於該底座上的組設槽內，該打氣缸內部形成有一第一腔室和一第二腔室與該組設槽氣體連通；一壓力錶，具有一顯示部和一套設部，該壓力錶內部開設有一氣流道，令該顯示部與該套設部的氣流道氣體連通，該套設部係套設於該底座的組設槽，令該壓力錶可相對該打氣缸以水平轉動，其中定義一垂直該打氣缸之軸向的水平線，該水平線係通過該組設槽和該壓力錶。藉此，該壓力錶可於使用和收納位置之間切換，可減少收納時整體尺寸、以及包裝材積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:壓力錶可收納的落地式打氣筒</p>  
        <p type="p">10:底座</p>  
        <p type="p">20:打氣缸</p>  
        <p type="p">30:壓力錶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="232" publication-number="202612106"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612106.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612106</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133878</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及其製造方法</chinese-title>  
        <english-title>MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">H01L21/78</main-classification>  
        <further-classification edition="200601120241129B">H01L21/302</further-classification>  
        <further-classification edition="200601120241129B">H01L21/265</further-classification>  
        <further-classification edition="202301120241129B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳建良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡毅豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, YI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置的製造方法，包含提供基板，基板的陣列區具有中心區及圍繞中心區的邊界區，且基板包含藉由隔離結構分隔的第一主動區及第二主動區。方法包含依序形成位元線接觸件及位元線結構於基板的第一主動區上方，順應地形成介電襯層於基板上以覆蓋位元線接觸件及位元線結構的側壁及位元線結構的頂表面，以及對基板執行蝕刻製程以形成溝槽並露出第二主動區。方法更包含對位於基板的邊界區中的溝槽執行離子佈植製程，以形成絕緣層於溝槽的底部且覆蓋第二主動區，以及形成電容接觸件結構於第二主動區上方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing a memory device includes: providing a substrate. An array region of the substrate includes a central region and an edge region surrounding the central region, and the substrate including a first active region and a second active region separated by an isolation structure. The method includes sequentially forming a bit line contact and a bit line structure over the first active region of the substrate, conformally forming a dielectric liner on the substrate to cover the bit line contact and the bit line structure, and performing an etching process on the substrate to form a trench and expose the second active region. The method further includes performing an ion implantation process on the trench in the edge region of the substrate to form an insulating layer at a bottom of the trench and covering the second active region, and forming a capacitor contact structure over the second active region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:記憶體裝置</p>  
        <p type="p">100:基板</p>  
        <p type="p">101:中心區</p>  
        <p type="p">102:邊界區</p>  
        <p type="p">105A:第一主動區</p>  
        <p type="p">105B:第二主動區</p>  
        <p type="p">107:隔離結構</p>  
        <p type="p">130:位元線接觸件</p>  
        <p type="p">140:位元線結構</p>  
        <p type="p">1401:導電層</p>  
        <p type="p">1403:導電層</p>  
        <p type="p">1405:導電層</p>  
        <p type="p">1407:介電層</p>  
        <p type="p">1409:蓋層</p>  
        <p type="p">150:間隔結構</p>  
        <p type="p">1501:間隔材料層</p>  
        <p type="p">1503:間隔材料層</p>  
        <p type="p">1505:間隔材料層</p>  
        <p type="p">1507:間隔材料層</p>  
        <p type="p">190:絕緣層</p>  
        <p type="p">200:電容接觸件結構</p>  
        <p type="p">X:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="233" publication-number="202611828"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611828.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611828</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133891</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於綠能捐款以建置綠能設備並獲得綠能回饋的系統及其方法</chinese-title>  
        <english-title>BASED ON GREEN ENERGY DONATION TO BUILD GREEN ENERGY EQUIPMENT AND RECEIVE GREEN ENERGY FEEDBACK SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241007B">G06Q30/0279</main-classification>  
        <further-classification edition="202301120241007B">G06Q30/0208</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彰化商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG HWA COMMERCIAL BANK, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王精鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHING HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於綠能捐款以建置綠能設備並獲得綠能回饋的系統及其方法，當客戶端裝置通過銀行綠能金融服務平台的登入驗證與綠能服務驗證時，客戶端裝置於銀行綠能金融服務平台提供的綠能金融服務頁面觸發與提供綠能公益電子捐款請求至銀行綠能金融服務平台，將捐款金額由客戶綠能帳戶轉帳至綠能公益電子捐款帳戶，當綠能公益電子捐款帳戶的總捐款金額大於等於社福單位綠電輔助資料庫中至少一筆社福單位綠電輔助方案的總執行費用資訊時，通知與撥款至第三方台灣綠能公益發展協會平台以執行對應的社福單位綠電輔助方案，並且試算與分配社福單位由綠能設備生產的可購買電量，藉此可以達成透過綠能捐款提供社福單位建置綠能設備使獲得綠能回饋的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A based on green energy donation to build green energy equipment and receive green energy feedback system and a method thereof are provided. Green energy charity electronic donation request is triggered in green energy financial service page which is provided from bank green energy financial service platform and provided to bank green energy financial service platform from client device when login verification and green energy service verification of bank green energy financial service platform are passed for client device. Donation amount is transferred from customer green energy account to the green energy charity electronic donation account. Funds are allocated and notified to third-party Taiwan green energy public welfare development association platform to implement corresponding social welfare green electricity auxiliary plan when total donation amount of green energy charity electronic donation account greater than or equal to total execution fee information of at least one social welfare green electricity auxiliary plan in social welfare green energy auxiliary database. Purchasable power which is produced by green energy equipment is calculated and assigned. Therefore, the efficiency of providing social welfare with green energy equipment to receive green energy feedback through green energy donation may be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:客戶端裝置</p>  
        <p type="p">20:銀行綠能金融服務平台</p>  
        <p type="p">21:捐款歷史資料庫</p>  
        <p type="p">22:綠能金融服務資料庫</p>  
        <p type="p">23:社福單位綠電輔助資料庫</p>  
        <p type="p">24:登入驗證模組</p>  
        <p type="p">25:綠能優惠設定模組</p>  
        <p type="p">26:綠能頁面生成模組</p>  
        <p type="p">27:綠能捐款模組</p>  
        <p type="p">28:綠能公益轉帳模組</p>  
        <p type="p">29:綠能分配模組</p>  
        <p type="p">30:第三方台灣綠能公益發展協會平台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="234" publication-number="202612428"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612428.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612428</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133896</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>免工具拆裝型散熱組件</chinese-title>  
        <english-title>TOOLLESS HEAT DISSIPATION ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">H05K7/20</main-classification>  
        <further-classification edition="200601120240927B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔立飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONG, LI-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HONG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俞帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種免工具拆裝型散熱組件包含一電路板、一散熱器與複數個固定鎖扣組件。電路板開設複數個第一非圓通孔。散熱器開設複數個第二非圓通孔。每一固定鎖扣組件包含一鎖扣本體、一墊片與一彈簧。鎖扣本體包含一本體部、一操作部與一卡扣部。操作部固接於本體部，用以操作本體部在一干涉方位角範圍與一鬆脫方位角範圍之間切換。卡扣部自本體部延伸出，用以在本體部位於鬆脫方位角範圍時，自第一非圓通孔與第二非圓通孔插入或拔脫，並用以在本體部位於干涉方位角範圍時，卡扣於電路板。墊片套設於本體部。彈簧套設於本體部，用以推抵墊片使卡扣部保持卡扣於電路板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A toolless heat dissipation assembly includes a circuit board, a heat sink, and multiple fixing latch assemblies. The circuit board is provided with multiple first non-circular through holes. The heat sink is provided with multiple second non-circular through holes. Each fixing latch assembly includes a latch body, a washer, and a spring. The latch body includes a body portion, an operating portion, and a latching portion. The operating portion is fixedly connected to the body portion and is used to operate the body portion to switch between an interference angular range and a release angular range. The latching portion extends from the body portion and is used to insert into or withdraw from the first non-circular through hole and the second non-circular through hole when the body portion is in the release angular range, and to latch onto the circuit board when the body portion is in the interference angular range. The washer is fitted over the body portion. The spring is fitted over the body portion and is used to push against the washer to keep the latching portion latched onto the circuit board.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:固定鎖扣組件</p>  
        <p type="p">31:鎖扣本體</p>  
        <p type="p">311:本體部</p>  
        <p type="p">3111:操作端</p>  
        <p type="p">3112:卡扣端</p>  
        <p type="p">3113:導引錐面</p>  
        <p type="p">312:操作部</p>  
        <p type="p">313:卡扣部</p>  
        <p type="p">3131:卡扣柱</p>  
        <p type="p">32:墊片</p>  
        <p type="p">33:彈簧</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="235" publication-number="202611668"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611668.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611668</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伺服器機殼及其框架組件</chinese-title>  
        <english-title>SERVER CHASSIS AND FRAME ASSEMBLY THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241028B">G06F1/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾博恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, BOHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HONG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俞帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種伺服器機殼包含一機殼本體以及一框架組件。機殼本體具有一底板。框架組件包含一框架本體以及一分隔板件。框架本體係組裝於該底板，並與該底板圍構出一組裝空間。分隔板件包含一隔板本體以及複數個連接柱體。隔板本體係設置於該組裝空間內，用以將該組裝空間分隔成一第一組裝空間與一第二組裝空間。複數個連接柱體係分別固定於該隔板本體，並具有相對設置之一柱體底端與一柱體頂端，該柱體底端係用以固接於該底板，該柱體頂端係用以固接於該框架本體，藉以使該隔板本體固定於該組裝空間內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A server chassis includes a chassis body and a frame assembly. The chassis body has a base plate. The frame assembly consists of a frame body and a partition plate. The frame body is assembled onto the base plate, creating an assembly space with the base plate. The partition plate includes a partition body and multiple connecting columns. The partition body is positioned within the assembly space, dividing it into a first assembly space and a second assembly space. The connecting columns are each fixed to the partition body and have a bottom end and a top end positioned opposite each other. The bottom end of the column is attached to the base plate, while the top end is attached to the frame body, securing the partition body within the assembly space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:底板</p>  
        <p type="p">111:底板鎖孔</p>  
        <p type="p">12:側壁</p>  
        <p type="p">21:框架本體</p>  
        <p type="p">211:上蓋部</p>  
        <p type="p">212,213:側邊支架</p>  
        <p type="p">221:隔板本體</p>  
        <p type="p">224:底端鎖接件</p>  
        <p type="p">225:頂端鎖接件</p>  
        <p type="p">2111:框架鎖孔</p>  
        <p type="p">D1:第一方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="236" publication-number="202610908"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610908.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610908</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133898</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複數層承載托盤的堆疊結構</chinese-title>  
        <english-title>STACKING STRUCTURE OF MULTIPLE LAYERS OF TRAYS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B65D19/38</main-classification>  
        <further-classification edition="200601120241007B">H01L21/677</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐韵葳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種複數層承載托盤的堆疊結構，包含：一奇數層承載托盤及一偶數層承載托盤，為完全相同的一承載托盤本體，其包括：一對平行的第一邊緣及一對平行的第二邊緣，且第一邊緣與第二邊緣相垂直；第一邊緣有一第一邊緣上表面、一第一邊緣下表面及一第一凹槽、一第一凹槽下表面；第二邊緣有一第二邊緣上表面、一第二邊緣下表面及一第二凹槽、一第二凹槽下表面；其中，當奇數層承載托盤與偶數層承載托盤反向堆疊，奇數層承載托盤之第一邊緣上表面抵住偶數層承載托盤之第一邊緣下表面及第一凹槽下表面，奇數層承載托盤之第二邊緣上表面抵住偶數層承載托盤之第二邊緣下表面及第二凹槽下表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stacking structure of multiple layers of trays, comprising: an odd-layer tray and an even-layer tray, both being exactly the same tray body, including: a pair of parallel first edges and a pair of parallel second edges, the first edge and the second edge being perpendicular to each other; the first edge having a first edge upper surface, a first edge lower surface, a first groove, and a first groove lower surface; the second edge having a second edge upper surface, a second edge lower surface, a second groove, and a second groove lower surface; wherein when the odd-layer tray and the even-layer tray are stacked in reverse, the first edge upper surface of the odd-layer tray is against the first edge lower surface and the first groove lower surface of the even-layer tray, and the second edge upper surface of the odd-layer tray is against the second edge lower surface and the second groove lower surface of the even-layer tray.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:承載托盤本體</p>  
        <p type="p">31:第一邊緣</p>  
        <p type="p">311:第一邊緣上表面</p>  
        <p type="p">313:第一凹槽</p>  
        <p type="p">32:第二邊緣</p>  
        <p type="p">321:第二邊緣上表面</p>  
        <p type="p">323:第二凹槽</p>  
        <p type="p">33:第一肋條</p>  
        <p type="p">331:第一肋條上表面</p>  
        <p type="p">332:第一肋條凹槽</p>  
        <p type="p">34:第二肋條</p>  
        <p type="p">341:第二肋條上表面</p>  
        <p type="p">342:第二肋條凹槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="237" publication-number="202611454"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611454.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611454</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133899</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分離式浸沒式液冷伺服器</chinese-title>  
        <english-title>DISCRETE IMMERSED LIQUID-COOLING SERVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">F28D1/02</main-classification>  
        <further-classification edition="200601120240930B">F28D5/00</further-classification>  
        <further-classification edition="200601120240930B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雪鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XUEFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄔將軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JIANGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分離式浸沒式液冷伺服器，包含：一分離區以容納冷卻管線路；一浸沒式液冷區充滿有冷卻液以冷卻一浸沒式電子元件，浸沒式電子元件連接至一第一電線；一進液口與一出液口，進液口連至分離區將冷卻液透過冷卻管線路傳入浸沒式液冷區，而出液口連至浸沒式液冷區傳出冷卻液；以及一密封連接元件以分隔浸沒式液冷區與分離區，包括：一豎插式PCB板，具有相連通之第一連接器及第二連接器，且第一電線與第一連接器相連接；一密封圈，其數量對應於第二連接器且環繞密封住第二連接器；以及一上蓋與豎插式PCB板固定以抵迫住密封圈。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A discrete immersion liquid-cooling server, comprising: a separation area to accommodate a cooling pipe line; an immersed liquid-cooling area, filled with a coolant to cool an immersed electronic component, which connected to a first wire; a liquid inlet and a liquid outlet, the liquid inlet connected to the separation area to transfer the coolant into the immersed liquid-cooling area through the cooling pipe line, the liquid outlet connected to the immersed liquid-cooling area to deliver the coolant out; and a sealed connection element to separate the immersed liquid-cooling area from the separation area, including: a vertical plug-in PCB board, having a first connector and a second connector that are connected, the first wire connected to the first connector; a sealing ring, the number of which corresponding to the second connector, surrounding and sealing the second connector; and an upper cover, fixed with the vertical plug-in PCB board to be against the sealing ring.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:分離式浸沒式液冷伺服器</p>  
        <p type="p">11:走線槽</p>  
        <p type="p">111:進液口</p>  
        <p type="p">112:進出電線口</p>  
        <p type="p">113:第二電線</p>  
        <p type="p">12:液冷板散熱區域</p>  
        <p type="p">121:上蓋</p>  
        <p type="p">122:發熱元件</p>  
        <p type="p">13:浸沒式液冷區</p>  
        <p type="p">131:電路板</p>  
        <p type="p">1311:浸沒式電子元件</p>  
        <p type="p">133:出液口</p>  
        <p type="p">14:豎插式PCB板</p>  
        <p type="p">15:上蓋</p>  
        <p type="p">21:進液主管路</p>  
        <p type="p">22:進液分液器</p>  
        <p type="p">23:進液分液器</p>  
        <p type="p">24:進液次管路</p>  
        <p type="p">25:冷板</p>  
        <p type="p">26:回液次管路</p>  
        <p type="p">27:回液分液器</p>  
        <p type="p">28:回液主管路</p>  
        <p type="p">29:回液主管路</p>  
        <p type="p">30:進液次管路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="238" publication-number="202611455"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611455.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611455</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133900</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分離式浸沒式液冷伺服器</chinese-title>  
        <english-title>DISCRETE IMMERSED LIQUID-COOLING SERVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">F28D1/02</main-classification>  
        <further-classification edition="200601120241125B">G06F1/20</further-classification>  
        <further-classification edition="200601120241125B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雪鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XUEFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄔將軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JIANGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分離式浸沒式液冷伺服器，包含：一分離區容納冷卻管線路；一浸沒式液冷區充滿冷卻液以冷卻一浸沒式電子元件，浸沒式電子元件連接至一第一電線；一進液口與一出液口，進液口連至分離區且將冷卻液傳入浸沒式液冷區，而出液口連至浸沒式液冷區以傳出冷卻液；以及一密封連接元件以分隔浸沒式液冷區與分離區，包括：一密封裝置具有設有一穿孔之一內部元件；一線束，穿設過穿孔，其第一端與第一電線相連接並有位置相對之第二端；一密封圈，設於密封裝置且與第二端同側，用以環繞內部元件之周圍；以及一上蓋，與密封裝置固定以抵迫住密封圈。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A discrete immersion liquid-cooling server, comprising: a separation area to accommodate a cooling pipe line; an immersed liquid-cooling area, filled with a coolant to cool an immersed electronic component, which connected to a first wire; a liquid inlet and a liquid outlet, the liquid inlet connected to the separation area to transfer the coolant into the immersed liquid-cooling area through the cooling pipe line, the liquid outlet connected to the immersed liquid-cooling area to deliver the coolant out; and a sealed connection element to separate the immersed liquid-cooling area from the separation area, including: a sealing device having an internal component provided with a perforation; a wire harness, passed through the perforation, having a first end connected to the first wire and a second end opposite to the first end; a sealing ring, located on the same side of the sealing device as the second end, for surrounding the internal component; and an upper cover, fixed with the sealing device to be against the sealing ring.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:分離式浸沒式液冷伺服器</p>  
        <p type="p">11:走線槽</p>  
        <p type="p">111:進液口</p>  
        <p type="p">112:進出電線口</p>  
        <p type="p">113:第二電線</p>  
        <p type="p">12:液冷板散熱區域</p>  
        <p type="p">121:上蓋</p>  
        <p type="p">122:發熱元件</p>  
        <p type="p">13:浸沒式液冷區</p>  
        <p type="p">131:電路板</p>  
        <p type="p">1311:浸沒式電子元件</p>  
        <p type="p">132:第一電線</p>  
        <p type="p">133:出液口</p>  
        <p type="p">14:密封裝置</p>  
        <p type="p">15:上蓋</p>  
        <p type="p">17:線束</p>  
        <p type="p">21:進液主管路</p>  
        <p type="p">22:進液分液器</p>  
        <p type="p">23:進液分液器</p>  
        <p type="p">24:進液次管路</p>  
        <p type="p">25:冷板</p>  
        <p type="p">26:回液次管路</p>  
        <p type="p">27:回液分液器</p>  
        <p type="p">28:回液主管路</p>  
        <p type="p">29:回液主管路</p>  
        <p type="p">30:進液次管路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="239" publication-number="202610695"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610695.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610695</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>注射劑量調整組件、注射機構及注射器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">A61M5/178</main-classification>  
        <further-classification edition="200601120241001B">A61M5/20</further-classification>  
        <further-classification edition="200601120241001B">A61M5/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群康生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉進民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種注射劑量調整組件、注射機構及注射器，注射劑量調整組件能組接注射機構的注射組件，並結合藥瓶套管組接藥瓶而組成注射器，注射劑量調整組件係於外管中裝設套筒，套筒之二彈力棘臂能分別抵接在外管之內棘輪部相異二單向棘齒，並在套筒後端組設彈性傳動件以及按壓部件，在外管後端裝設劑量旋鈕，劑量調整旋鈕能朝第一方向及第二方向旋轉，並經由彈性傳動件帶動套筒旋轉，以調整增減控制藥液注射劑量及控制注射組件之注射推桿的行程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:注射劑量調整組件</p>  
        <p type="p">10:外管</p>  
        <p type="p">11:刻度視窗</p>  
        <p type="p">12:內棘輪部</p>  
        <p type="p">20:套筒</p>  
        <p type="p">21:彈力棘臂</p>  
        <p type="p">23:嚙合齒部</p>  
        <p type="p">30:傳動環</p>  
        <p type="p">32:內環嚙合部</p>  
        <p type="p">40:彈性傳動件</p>  
        <p type="p">41:彈性部</p>  
        <p type="p">42:彈力傳導環部</p>  
        <p type="p">421:結合槽</p>  
        <p type="p">422:間隔柱</p>  
        <p type="p">424:推抵部</p>  
        <p type="p">50:劑量調整旋鈕</p>  
        <p type="p">51:推抵凸塊</p>  
        <p type="p">52:帶動部</p>  
        <p type="p">60:按壓部件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="240" publication-number="202611060"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611060.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611060</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133903</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於檢測短鏈脂肪酸的寡肽、套組及方法</chinese-title>  
        <english-title>OLIGOPEPTIDE, KIT AND METHOD FOR DETECTING SHORT-CHAIN FATTY ACIDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241212B">C07K7/06</main-classification>  
        <further-classification edition="200601120241212B">G01N33/92</further-classification>  
        <further-classification edition="200601120241212B">G01N27/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高雄醫學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAOHSIUNG MEDICAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂濟宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘品璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, PIN-SHIUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於檢測短鏈脂肪酸的寡肽，具有如SEQ ID NO：2所示之胺基酸序列，藉此可以達成提升短鏈脂肪酸被辨識之之辨識效率及專一性之功效。本發明另關於包含該寡肽的套組，以及使用該寡肽以用於檢測短鏈脂肪酸的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An oligopeptide for detecting short-chain fatty acids is disclosed. The oligopeptide has an amino acid sequence set forth as SEQ ID NO: 2. Accordingly, by the oligopeptide, the efficiency and specificity for detecting short-chain fatty acids can be improved. A kit comprising the oligopeptide, as well as a method for detecting short-chain fatty acids utilizing the oligopeptide, is also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:樣品提供步驟</p>  
        <p type="p">S2:偶合衍生步驟</p>  
        <p type="p">S3:偵測步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="241" publication-number="202611847"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611847.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611847</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133905</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>小鋼胚良率的預測方法</chinese-title>  
        <english-title>METHOD FOR PREDICTING YIELD OF BILLET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241231B">G06Q50/04</main-classification>  
        <further-classification edition="200601120241231B">C21C5/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡青憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHING-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">小鋼胚良率的預測方法包括：取得小鋼胚製程之過去的多個時間段的多個歷史製程數據與多個歷史小鋼胚良率；利用多元線性迴歸演算法來對於所述多個歷史製程數據與所述多個歷史小鋼胚良率進行迴歸分析，以建立良率預測模型；及將小鋼胚製程之當前的當前製程數據輸入所述良率預測模型，以預測小鋼胚製程的當前小鋼胚良率。所述多個歷史製程數據包括多個歷史大鋼胚燒除率與多個歷史剔退量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for predicting a yield of a billet includes: obtaining plural historical manufacturing data and plural historical billet yields for plural time periods of a billet manufacturing process in the past; utilizing a multiple regression algorithm to perform the regression analysis on the historical manufacturing data and the historical billet yields to establish a yield predicting model; and inputting a current manufacturing data of the billet manufacturing process into the yield predicting model to predict a current billet yield of the billet manufacturing process. The historical manufacturing data include plural historical bloom scarfing rates and plural historical rejection amounts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1,S2,S3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="242" publication-number="202611607"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611607.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611607</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133916</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可提高亮度的背光模組</chinese-title>  
        <english-title>BACKLIGHT MODULE CAPABLE OF ENHANCING BRIGHTNESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240920B">G02F1/13357</main-classification>  
        <further-classification edition="200601120240920B">G02B5/30</further-classification>  
        <further-classification edition="201501120240920B">G02B1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穎台科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTIRE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張裕偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚佳吟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, CHIA YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾仁鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, JEN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種可提高亮度的背光模組，可搭配液晶顯示器使用。該背光模組包括了能將LED發出的光適當地配光的二次光學透鏡、以及具獨特光擴散效果的擴散板。本發明的背光模組，不僅在LED上設置折反射式二次光學透鏡來對LED發出的光進行適當地配光，且搭配在擴散板入光面設置微結構，以及在擴散板中還添加擴散粒子，並以發泡技術押出使擴散板內包含均勻分佈的微氣泡。藉此，可將LED的光線做最佳化的配光與擴散，進而達到遮蔽MURA，以產生一個輝度提高且均勻的面光源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A backlight module capable of enhancing brightness can be used with a Liquid Crystal Display (LCD). The backlight module comprises a secondary optical lens that can appropriately distribute the light emitted by the LED, and a diffusion plate with a unique light diffusion effect. The backlight module not only provides a catadioptric secondary optical lens on the LED to appropriately distribute the light emitted by the LED, but also provides a plurality of microstructures on the light-inlet surface of the diffuser plate, and provides a plurality of diffusion particles in the diffuser plate, and also provides a plurality of microbubbles evenly distributed in the diffuser plate by using extruding foaming technology. In this way, the light of the LED can be optimally distributed and diffused, thereby shielding the MURA to produce a surface light source with increased brightness and uniformity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:擴散板</p>  
        <p type="p">10:板體</p>  
        <p type="p">101:主板層</p>  
        <p type="p">1011、1021、1031:擴散粒子</p>  
        <p type="p">1012:微氣泡</p>  
        <p type="p">102、103:表層</p>  
        <p type="p">1032:微結構</p>  
        <p type="p">151:光學膜</p>  
        <p type="p">152:增亮膜</p>  
        <p type="p">153:偏光增亮膜</p>  
        <p type="p">20:二次光學透鏡</p>  
        <p type="p">91:基板</p>  
        <p type="p">911:頂面</p>  
        <p type="p">92:發光元件</p>  
        <p type="p">93:液晶顯示器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="243" publication-number="202610888"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610888.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610888</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>跨騎式機車</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">B62K11/02</main-classification>  
        <further-classification edition="201001120241125B">B62M6/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃玟翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯秀萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種跨騎式機車，包含一車架單元，該車架單元包括一頭管、一連接於該頭管且向下延伸的縱管、一連接於該縱管下端且沿橫向延伸的前橫管、二彼此平行地自該前橫管向後延伸的下側管，及二連接於該縱管且彼此間距逐漸變大地向後延伸的上側管。該車架單元之該等上側管，因彼此由後向前逐漸往彼此內縮的設計，得以在連接於該縱管處藉由較窄的相互間距而優化整體的結構剛性。除此之外，本發明跨騎式機車之前後方向的外觀，也因而得以縮小寬度，能藉此降低行駛時所受的風阻，同時也提升油耗表現與行駛性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:車架單元</p>  
        <p type="p">21:頭管</p>  
        <p type="p">22:縱管</p>  
        <p type="p">23:前橫管</p>  
        <p type="p">24:下側管</p>  
        <p type="p">25:上側管</p>  
        <p type="p">26:後橫管</p>  
        <p type="p">3:控制器</p>  
        <p type="p">4:動力馬達</p>  
        <p type="p">5:電池槽體</p>  
        <p type="p">6:乘坐單元</p>  
        <p type="p">61:容置箱體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="244" publication-number="202612414"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612414.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612414</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133934</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保護殼</chinese-title>  
        <english-title>PROTECTIVE CASE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">H05K5/02</main-classification>  
        <further-classification edition="200601120241127B">F16B1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和碩聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGATRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓　猷敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOK, YOU-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啟桐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖和信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種保護殼，適用於套設至一電子裝置。保護殼包括一殼體以及一繩體。繩體設置於殼體，且具有一第一使用模式和一第二使用模式。當繩體於第一使用模式時，繩體圍繞殼體。當繩體於第二使用模式時，繩體形成一穿戴件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A protective case that is applicable for fitting over an electronic device. The protective case includes a casing and a cord. The cord is disposed on the casing and has a first using mode and a second using mode. When the cord is in the first using mode, the cord surrounds the casing. When the cord is in the second using mode, the cord forms a wearable piece.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:保護殼</p>  
        <p type="p">10:殼體</p>  
        <p type="p">101:長邊</p>  
        <p type="p">102:短邊</p>  
        <p type="p">11:外表面</p>  
        <p type="p">12:側緣</p>  
        <p type="p">13:鏡頭開口</p>  
        <p type="p">14:凹槽</p>  
        <p type="p">141:第一凹槽</p>  
        <p type="p">15:第二定位部</p>  
        <p type="p">20:繩體</p>  
        <p type="p">21:可動部分</p>  
        <p type="p">211:第一端</p>  
        <p type="p">212:第二端</p>  
        <p type="p">22:固定部分</p>  
        <p type="p">221:第一繩體</p>  
        <p type="p">222:第二繩體</p>  
        <p type="p">23:固定件</p>  
        <p type="p">30:限制件</p>  
        <p type="p">31:第一限制部</p>  
        <p type="p">32:第二限制部</p>  
        <p type="p">9:電子裝置</p>  
        <p type="p">91:鏡頭</p>  
        <p type="p">P1:第一位置</p>  
        <p type="p">P2:第二位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="245" publication-number="202610697"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610697.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610697</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133935</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中心靜脈導管護理裝置及其使用方法</chinese-title>  
        <english-title>CENTRAL VENOUS CATHETER DEVICE AND THE METHOD OF USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A61M25/01</main-classification>  
        <further-classification edition="200601120240929B">A61M25/02</further-classification>  
        <further-classification edition="202401120240929B">A61F13/02</further-classification>  
        <further-classification edition="201601120240929B">A61B90/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新生學校財團法人新生醫護管理專科學校</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIN SHENG JUNIOR COLLEGE OF MEDICAL CARE AND MANAGEMENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔禾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUI, HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宜葶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭子妤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, TZU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭眃柔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUN-JOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江謝語宸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HSIEH YU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何佳軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, JIA-XUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫大龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種中心靜脈導管護理裝置，包括有親膚層、連附結構、離型層及固定層，而該親膚層以第一面設置於人體皮膚上，該連附結構用於將該離型層連接於該親膚層的第二面，使離型層的離型面朝外；通過將該固定層以第三連接面對應連接與離型層的離型面並利用圍繞離型面的周邊黏膠可貼置於人體皮膚上，完成將被插設在人體皮膚上的中心靜脈導管定位，防止移位，防止傷口或者穿刺部位周圍受到外界感染；並且利用該離型層的離型面與固定層的第三連接面形成便利分合設計，通過撕除操作即便捷將固定層揭起離開離型面，利於傷口護理作業，提升護理人員傷口護理的效率及有效性，減輕工作量。本發明還提供一種中心靜脈導管護理裝置的使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:離型層</p>  
        <p type="p">32:離型面</p>  
        <p type="p">33:第三開口</p>  
        <p type="p">4:固定層</p>  
        <p type="p">8:中心靜脈導管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="246" publication-number="202612389"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612389.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612389</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133943</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>照明電源控制器</chinese-title>  
        <english-title>LIGHTING POWER CONTROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241101B">H05B47/175</main-classification>  
        <further-classification edition="202001120241101B">H05B45/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譜羅科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANFI SEMICONDUCTOR CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　攸中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宸瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHEN WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種照明電源控制器，包括一藍牙接收器，通訊連接一藍牙通訊裝置，接收一藍牙無線控制指令，並針對具有一設定位址的一群組發出該藍牙無線控制指令；至少二照明顏色系統轉換模組，包含在該群組中且均儲存有該設定位址並接收來自該藍牙接收器的該藍牙無線控制指令；以及至少二脈衝寬度調變通道，均配置有對應的一通道號碼，並與該至少二照明顏色系統轉換模組電性連接且根據該藍牙無線控制指令對應接受各該照明顏色系統轉換模組的控制。藉此，可以透過藍牙網路照明控制進行群組的恆壓及恆流(電流)的調光，以達到遠端控制及群組控制的功效，進而避免損害LED燈的使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a lighting power controller. The lighting power controller includes a Bluetooth receiver communicated with a Bluetooth communication device, receiving a Bluetooth wireless control command therefrom, and sending the Bluetooth wireless control command to a group with a setting address; at least two lighting color system conversion modules, included in the group and storing the setting address and receiving the Bluetooth wireless control command from the Bluetooth receiver; and at least two pulse width modulation channels, each configured with a corresponding channel number and electrically connected to a corresponding lighting color system conversion module and accepting a control of the corresponding lighting color system conversion module according to the Bluetooth wireless control command. In this way, the light modulation with a constant voltage and a constant current in a group manner can be performed through a Bluetooth network lighting control to achieve the effects of remote control and group control, thereby avoiding damage to the service life of LED lamps.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:照明電源控制器</p>  
        <p type="p">100:藍牙通訊裝置</p>  
        <p type="p">210:第一照明顏色系統轉換模組</p>  
        <p type="p">220:第二照明顏色系統轉換模組</p>  
        <p type="p">230:第三照明顏色系統轉換模組</p>  
        <p type="p">240:第四照明顏色系統轉換模組</p>  
        <p type="p">250:第五照明顏色系統轉換模組</p>  
        <p type="p">310:第一脈衝寬度調變通道</p>  
        <p type="p">320:第二脈衝寬度調變通道</p>  
        <p type="p">330:第三脈衝寬度調變通道</p>  
        <p type="p">340:第四脈衝寬度調變通道</p>  
        <p type="p">350:第五脈衝寬度調變通道</p>  
        <p type="p">400:光源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="247" publication-number="202610597"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610597.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610597</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133952</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>漏斗胸矯正板之連結固定結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">A61B17/56</main-classification>  
        <further-classification edition="200601120241125B">A61B17/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派特斯科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡義泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, YI-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇彥文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為有關一種漏斗胸矯正板之連結固定結構，結構包括有至少一固定板體、一止擋限位部、一固定槽、複數自由端、一開口端、一夾持限位部、一開放端、一固定部、一矯正板體、一調節孔、及一緊固件。矯正板體與固定板體結合時，直接讓矯正板體從固定板體的開放端處放置於固定板體上，並從開口端處進入固定槽內，以利用止擋限位部及夾持限位部暫時將矯正板體與固定板體平貼，而後藉由自由端調整矯正板體的位置，使調節孔與固定部對位，並以緊固件將矯正板體活動設置於固定板體上。藉此，在確保兩者簡便的結合動作，同時簡化矯正板體的製作難度、及提升其結構強度。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">11:固定部</p>  
        <p type="p">12:穿孔部</p>  
        <p type="p">13:圓滑面</p>  
        <p type="p">2:止擋限位部</p>  
        <p type="p">21:固定槽</p>  
        <p type="p">211:自由端</p>  
        <p type="p">212:開口端</p>  
        <p type="p">3:夾持限位部</p>  
        <p type="p">31:開放端</p>  
        <p type="p">4:矯正板體</p>  
        <p type="p">41:調節孔</p>  
        <p type="p">5:緊固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="248" publication-number="202612323"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612323.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612323</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133954</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>立體顯示系統與立體顯示方法</chinese-title>  
        <english-title>STEREOSCOPIC DISPLAY SYSTEM AND STEREOSCOPIC DISPLAY METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250102B">H04N13/302</main-classification>  
        <further-classification edition="201801120250102B">H04N13/32</further-classification>  
        <further-classification edition="201801120250102B">H04N13/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和　佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANTERO CLARES, SERGIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種立體顯示系統與立體顯示方法。所述方法包括：獲取顯示圖幀；從顯示圖幀裁剪3D內容圖像區塊，其中顯示圖幀包含3D內容圖像區塊和背景內容圖像區塊；基於3D內容圖像區塊獲取左子圖像和右子圖像；根據左子圖像、右子圖像和顯示圖幀的背景內容圖像區塊生成左眼圖像和右眼圖像；以及根據左眼圖像和右眼圖像利用3D顯示器以立體顯示效果顯示3D合成圖幀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An exemplary embodiment of the invention provides an stereoscopic display method for a stereoscopic display system. The method includes: obtaining a display frame; cropping a 3D content image segment from the display frame, wherein the display frame comprises the 3D content image segment and a background content image segment; obtaining a left sub-image and a right sub-image based on the 3D content image segment; generating a left eye image and a right eye image according to the left sub-image, the right sub-image and the background content image segment of the display frame; and displaying a 3D composite frame in a stereoscopic displaying effect according to the left eye image and the right eye image by using a 3D display.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S902~S910:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="249" publication-number="202612040"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612040.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612040</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133955</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製程、溫度、電壓變異偵測方法及其偵測電路</chinese-title>  
        <english-title>DETECTION METHOD AND CIRCUIT FOR PROCESS, TEMPERATURE, AND VOLTAGE VARIATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H01L21/66</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中山大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王朝欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUA-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈有為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YOU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑　佳藍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANGALANG, RALPH GERARD BOLINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟威</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製程、溫度、電壓變異偵測方法包含一製程變異偵測器測得一製程變異偵測訊號，其中該製程變異偵測器不受溫度變異及電壓變異影響；一溫度變異偵測器於已知製程變異的情況下測得一溫度變異偵測訊號，其中該溫度變異偵測器不受電壓變異影響；以及一電壓變異偵測器於已知製程及溫度變異的情況下測得一電壓變異偵測訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for detecting process, temperature, and voltage variations includes a process variation detector that measures a process variation detection signal, where the process variation detector is not affected by temperature or voltage variations; a temperature variation detector that measures a temperature variation detection signal under known process variations, where the temperature variation detector is not affected by voltage variations; and a voltage variation detector that measures a voltage variation detection signal under known process and temperature variations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:製程、溫度、電壓變異偵測方法</p>  
        <p type="p">11:提供一製程、溫度、電壓變異偵測電路</p>  
        <p type="p">12:製程變異偵測器測得製程變異偵測訊號</p>  
        <p type="p">13:溫度變異偵測器測得溫度變異偵測訊號</p>  
        <p type="p">14:電壓變異偵測器測得電壓變異偵測訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="250" publication-number="202612295"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612295.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612295</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133958</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧偵測與定位流氓ONU設備的系統及其方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR INTELLIGENTLY DETECTING AND LOCATING ROGUE ONU DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250102B">H04B10/07</main-classification>  
        <further-classification edition="200601120250102B">H04J14/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秉璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PING-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊舜凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃龍進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LUNG-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊魁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭斐華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, FEI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智慧偵測與定位流氓ONU設備的系統及其方法，包括複數個ONU設備、OLT設備、資料庫以及流氓設備智慧監控裝置。OLT設備經由光分歧器將光訊號分配至複數個ONU設備。流氓設備智慧監控裝置分別與OLT設備及資料庫電性連接，流氓設備智慧監控裝置週期性地收集OLT設備的告警訊息並儲存告警訊息至資料庫中，依據告警訊息判定OLT設備是否出現異常，並且依據告警訊息及告警規則識別ONU設備中的流氓ONU設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for intelligently detecting and locating rogue ONU device is provided, including a plurality of ONU devices, an OLT device, a database and a rogue device smart monitoring equipment. The OLT device distributes optical signals to the plurality of ONU devices through an optical splitter. The rogue device smart monitoring equipment is electrically connected to the OLT device and the database respectively. The rogue device smart monitoring equipment periodically collects alarm messages from the OLT device and stores the alarm messages in the database, determines whether the OLT device is abnormal according to the alarm messages, and identifies rogue ONU devices among the ONU devices according to the alarm messages and alarm rules.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:PON用戶端設備</p>  
        <p type="p">20:光分歧器</p>  
        <p type="p">30:PON機房端設備</p>  
        <p type="p">40:流氓設備智慧監控裝置</p>  
        <p type="p">50:資料庫</p>  
        <p type="p">41:設備監測模組</p>  
        <p type="p">42:流氓現象偵測模組</p>  
        <p type="p">43:流氓設備定位模組</p>  
        <p type="p">44:告警模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="251" publication-number="202611903"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611903.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611903</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133959</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G09G5/10</main-classification>  
        <further-classification edition="201601120250102B">G09G3/32</further-classification>  
        <further-classification edition="202501120250102B">H10F30/21</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高振凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, CHENG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置。顯示裝置包括時序控制器、以及折疊式顯示面板。折疊式顯示面板具有折疊式基板、多個畫素電路、以及多個畫素驅動電路。畫素電路個別具有多個發光元件以及光感測器。畫素驅動電路個別耦接對應的畫素電路的發光元件及光感測器，並且耦接時序控制器。當時序控制器啟動光學校正模式時，時序控制器於折疊式基板折疊而貼合時依照時序點亮畫素電路的發光元件，並且經由相對的畫素電路的光感測器感測亮度值，以產生多個感測亮度值。時序控制器基於感測亮度值校正這些畫素電路的發光元件的每一者對應的伽瑪曲線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An display apparatus is provided. The display apparatus includes includes a timing controller and a foldable display panel. The foldable display panel has a foldable substrate, multiple pixel circuits, and multiple pixel driving circuits. Each pixel circuit has multiple light-emitting elements and a light sensor. The pixel driving circuit is individually coupled to the light-emitting elements and the light sensor of the corresponding pixel circuit, and is coupled to the timing controller. When the timing controller activates an optical correction mode, the timing controller lights up the light-emitting elements of the pixel circuit according to the timing when the foldable substrate is folded and attached, and senses the brightness value through the light sensor of the corresponding pixel circuit to generate multiple sensed brightness values. The timing controller corrects a gamma curve corresponding to each of the light-emitting elements of the pixel circuits based on the sensed brightness value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">110:時序控制器</p>  
        <p type="p">120:折疊式顯示面板</p>  
        <p type="p">121:折疊式基板</p>  
        <p type="p">AVDD:系統電壓</p>  
        <p type="p">CLK:時脈信號</p>  
        <p type="p">CS:晶片選擇信號</p>  
        <p type="p">CTD11、CTD12、CTD1n、CTDa1、CTDa2、CTDan、CTDm1、CTDm2、CTDmn:畫素驅動電路</p>  
        <p type="p">Data[1]~Data[n]:顯示資料</p>  
        <p type="p">Db:藍色發光二極體</p>  
        <p type="p">Dg:綠色發光二極體</p>  
        <p type="p">Dr:紅色發光二極體</p>  
        <p type="p">LCK:時脈線</p>  
        <p type="p">LDT:資料線</p>  
        <p type="p">LPW:電源線</p>  
        <p type="p">LVR:參考電壓線</p>  
        <p type="p">PX11、PX12、PX1n、PXa1、PXa2、PXan、PXm1、PXm2、PXmn:畫素電路</p>  
        <p type="p">RG1:第一區域</p>  
        <p type="p">RG2:第二區域</p>  
        <p type="p">RG3:第三區域</p>  
        <p type="p">SR:光感測器</p>  
        <p type="p">VBS[1]~VBS[n]:感測亮度值</p>  
        <p type="p">Vref_B:藍色參考電壓</p>  
        <p type="p">Vref_G:綠色參考電壓</p>  
        <p type="p">Vref_R:紅色參考電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="252" publication-number="202612348"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612348.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612348</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133968</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>主動對焦方法及全景影像擷取裝置</chinese-title>  
        <english-title>ACTIVE FOCUSING METHOD AND PANORAMIC IMAGE CAPTURING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241125B">H04N23/698</main-classification>  
        <further-classification edition="200601120241125B">G01S3/80</further-classification>  
        <further-classification edition="202101120241125B">G03B13/36</further-classification>  
        <further-classification edition="202401120241125B">G06T3/4038</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群光電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭百祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, PAI-HSAING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉哲銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHE-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳永州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁介隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, JIE-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啟桐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖和信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種主動對焦方法，應用於一全景影像擷取裝置。主動對焦方法包括下列步驟：自麥克風陣列接收一空間內的複數聲音訊號；依據該些聲音訊號取得至少一聲源方位；取得靠近聲源方位的至少一影像畫面；分析並比對聲音訊號與影像畫面，以於複數鏡頭模組中選定其中之一作為一參考鏡頭模組，其所對應的視野範圍涵蓋一主要說話者；取得參考鏡頭模組對主要說話者的一自動對焦值；處理器依據自動對焦值調整該些鏡頭模組，使該些鏡頭模組具有相同的焦距；以及處理器自該些鏡頭模組分別取得一調整後影像畫面，並拼接成一全景影像畫面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An active focusing method is applied to a panoramic image capturing device. The active focusing method includes the following steps: receiving a plurality of audio signals in a space from a microphone array; obtaining at least one sound direction based on the plurality of audio signals; acquiring at least one image frame near the sound direction; analyzing and comparing the audio signals and image frame to select one of a plurality of camera modules as a reference camera module, where the field of view of the reference camera module covers a main speaker; obtaining an autofocus value of the reference camera module for the main speaker; adjusting the focal lengths of these camera modules according to the autofocus value via a processor so that these camera modules have the same focal length; and the processor acquiring an adjusted image frame from each of these camera modules and stitching them into a panoramic image frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01~S06:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="253" publication-number="202611507"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611507.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611507</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133969</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片式溶氧感測器以及溶氧感測系統</chinese-title>  
        <english-title>CHIP-BASED DISSOLVED OXYGEN SENSOR AND DISSOLVED OXYGEN SENSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">G01N27/30</main-classification>  
        <further-classification edition="200601120241125B">G01N27/416</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣海洋大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN OCEAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張忠誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUNG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡仁富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉箐茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶片式溶氧感測器用於感測含氧環境中的溶氧濃度。晶片式溶氧感測器包括工作電極、電解層、透氣薄膜以及參考電極。工作電極具有第一上表面與連接第一上表面的第一側壁。電解層覆蓋工作電極的第一上表面與第一側壁。電解層用於提供導電離子。透氣薄膜覆蓋電解層。透氣薄膜允許氧氣分子穿越其中以進入至電解層中。當氧氣分子進入至電解層中以接觸工作電極時，氧氣分子藉由導電離子與工作電極產生還原反應，使得工作電極產生關聯於溶氧濃度的工作電位。參考電極位於工作電極的一側且被電解層包覆。參考電極用於提供參考電位，參考電位的數值不同於工作電位的數值，且參考電位作為評估溶氧濃度的基準數值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶片式溶氧感測器</p>  
        <p type="p">110:基板</p>  
        <p type="p">120:絕緣層</p>  
        <p type="p">130:緩衝層</p>  
        <p type="p">140:工作電極</p>  
        <p type="p">142:第一上表面</p>  
        <p type="p">144:第一側壁</p>  
        <p type="p">150:參考電極</p>  
        <p type="p">152:第二上表面</p>  
        <p type="p">154:第二側壁</p>  
        <p type="p">160:輔助電極</p>  
        <p type="p">162:第三上表面</p>  
        <p type="p">164:第三側壁</p>  
        <p type="p">170:電解層</p>  
        <p type="p">180:透氣薄膜</p>  
        <p type="p">D:垂直方向</p>  
        <p type="p">I:導電離子</p>  
        <p type="p">W1、W2、W3:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="254" publication-number="202611757"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611757.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611757</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133970</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子資訊認可系統及其方法</chinese-title>  
        <english-title>ELECTRONIC INFORMATION RECOGNITION SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241007B">G06F21/31</main-classification>  
        <further-classification edition="201301120241007B">G06F21/62</further-classification>  
        <further-classification edition="200601120241007B">H04L9/32</further-classification>  
        <further-classification edition="200601120241007B">H04L9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡裕汌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡裕昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡裕汌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為解決電子資訊可信度認可的問題，本發明提供一種電子資訊認可系統及其方法，該系統包括：至少一電子裝置，連接於伺服主機的平台以來自身體的特徵，於客戶欲登入該平台時擷取至少一種來自身體的第一特徵，並搭配透過網路結合認可伺服器或第三方的可變金鑰碼回寫以認可客戶身分，從而決定客戶是否可以登入該平台，該可變金鑰碼可以自動更新或被動更新；於登入該平台後選擇性地每隔一段時間再擷取一次來自身體的第二特徵以維持登入，該第一特徵相同或不同於該第二特徵，其中，該平台包括彼此連接的至少一模組以交互處理網路上客戶的資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To address the issue of electronic information trustworthiness, this invention provides an electronic information recognition system and its method. The system includes at least one electronic device connected to the platform's server host to capture physical characteristics. When a customer attempts to log into the platform, the device retrieves at least one type of first physical characteristic from the user. In combination with the recognition server or third-party variable keycode, which is transmitted back through the network, the customer's identity is authenticated to determine whether they are allowed to access the platform. The variable keycode can be updated automatically or passively. After logging into the platform, the system can selectively capture a second physical characteristic from the user at regular intervals to maintain the login session. The first characteristic may be the same as or different from the second characteristic. The platform includes at least one module connected to each other to interactively process customer information on the network.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子資訊認可系統</p>  
        <p type="p">1100:電子裝置</p>  
        <p type="p">1200:伺服主機</p>  
        <p type="p">1210:平台</p>  
        <p type="p">1220:紀錄模組</p>  
        <p type="p">1230:核實模組</p>  
        <p type="p">1300:認可伺服器</p>  
        <p type="p">1400:第三方伺服器</p>  
        <p type="p">1500:政府機關</p>  
        <p type="p">1600:鑒別組織</p>  
        <p type="p">1700:第三方</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="255" publication-number="202612207"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612207.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612207</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133973</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冗餘電源系統及其保護電路和偵錯方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H02J3/04</main-classification>  
        <further-classification edition="200601120241202B">H02J7/34</further-classification>  
        <further-classification edition="201601120241202B">H02J7/02</further-classification>  
        <further-classification edition="200601120241202B">H02H7/10</further-classification>  
        <further-classification edition="200601120241202B">G06F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康舒科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳璿安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSUAN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種冗餘電源系統及其保護電路係由一第二電路單元通過一電源回路接收一第一電路單元所提供的電源；一隔離開關串接在該電源回路上，且一電性偵測單元電連接於該電源回路以檢測該電源回路的電性變化，並據以輸出一電壓訊號至一處理單元；一第一開關單元並聯於該第一電路單元和該第二電路單元；當該隔離開關被截止時，該處理單元控制該第一開關單元的導通狀態，以使該電壓訊號響應該第一開關單元的導通狀態發生變化；當該處理單元判斷該電壓訊號的一訊號特徵不符合一隔離狀態特徵時，該處理單元即判定該隔離開關發生異常以示有漏電情形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:冗餘電源系統</p>  
        <p type="p">10:電容</p>  
        <p type="p">11:第一端</p>  
        <p type="p">12:第二端</p>  
        <p type="p">20:電性偵測單元</p>  
        <p type="p">30:隔離開關</p>  
        <p type="p">40:處理單元</p>  
        <p type="p">50:第一開關單元</p>  
        <p type="p">60:第一電阻</p>  
        <p type="p">100:第一電路單元</p>  
        <p type="p">101:第一連接埠</p>  
        <p type="p">102:第二連接埠</p>  
        <p type="p">110:第一電源供應電路</p>  
        <p type="p">120:第一開關電路</p>  
        <p type="p">150:電源回路</p>  
        <p type="p">200:第二電路單元</p>  
        <p type="p">201:第三連接埠</p>  
        <p type="p">202:第四連接埠</p>  
        <p type="p">300:第三電路單元</p>  
        <p type="p">301:第五連接埠</p>  
        <p type="p">302:第六連接埠</p>  
        <p type="p">310:第三電源供應電路</p>  
        <p type="p">320:第三開關電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="256" publication-number="202611879"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611879.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611879</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133979</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物體置中方法及物體置中裝置</chinese-title>  
        <english-title>OBJECT CENTERING METHOD AND OBJECT CENTERING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250102B">G06V40/16</main-classification>  
        <further-classification edition="201701120250102B">G06T7/194</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭曜嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YAO-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEN-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳紀融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種物體置中方法，由處理器讀取儲存於記憶體的至少一指令以執行上述物體置中方法。物體置中方法包含以下步驟：根據深度圖像與人臉圖像進行前景物體分割以產生前景物體圖像；判斷前景物體圖像與預設閾值的關係以產生判斷結果；以及依照判斷結果對前景物體圖像進行物體置中以產生物體置中圖像，或依照判斷結果對人臉圖像進行物體置中以產生物體置中圖像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object centering method is disclosed herein. A processor reads at least command stored in a memory and executes the object centering method. The object centering method includes following steps: generating a foreground object image by executing a foreground object segmentation process according to a depth image and a face image; determining a relation between the foreground object image and a predetermined threshold to generate a determination result; and generating an object centering image by executing an object centering process to the foreground object image according to the determination result, or generating the object centering image by executing the object centering process to the face image according to the determination result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:物體置中方法</p>  
        <p type="p">210~230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="257" publication-number="202612410"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612410.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612410</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133981</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板及其製造方法</chinese-title>  
        <english-title>CIRCUIT BOARD AND FABRICATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H05K3/46</main-classification>  
        <further-classification edition="200601120241101B">H05K3/00</further-classification>  
        <further-classification edition="200601120241101B">H01L23/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商宏恆勝電子科技（淮安）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONGHENGSHEN ELECTRONICAL TECHNOLOGY(HUAI'AN)CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>代羽豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, YU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文乾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN-QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種電路板及其製造方法。電路板包含多層第一線路層、導電通孔、填充材料、覆蓋線路層、第二線路層和導電結構。第一線路層彼此堆疊。導電通孔延伸通過第一線路層，並電性連接第一線路層。填充材料設置於導電通孔內。覆蓋線路層覆蓋導電通孔，且與導電通孔電性連接。第二線路層堆疊於第一線路層和覆蓋線路層上。導電結構從第二線路層延伸通過覆蓋線路層且至填充材料，並插入於填充材料中。導電結構電性連接第二線路層和覆蓋線路層，且未貫穿填充材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board and a fabricating method of the same are provided. The circuit board includes multiple first wiring layers, a plated through hole, a filling material, a cover wiring layer, a second wiring layer and a conductive structure. The first wiring layers are stacked. The plated through hole extends through the first wiring layers and is electrically connected to the first wiring layers. The filling material is disposed in the plated through hole. The cover wiring layer covers the plated through hole and is electrically connected to the plated through hole. The second wiring layer is stacked on the first wiring layers and the cover wiring layer. The conductive structure extends through the cover wiring layer to the filling material from the second wiring layer and is inserted in the filling material. The conductive structure is electrically connected to the second wiring layer and the cover wiring layer and does not penetrate the filling material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路板</p>  
        <p type="p">111~114:線路層</p>  
        <p type="p">121~123:介電層</p>  
        <p type="p">130:導電通孔</p>  
        <p type="p">140:填充材料</p>  
        <p type="p">151,152:覆蓋線路層</p>  
        <p type="p">161,162:導電結構</p>  
        <p type="p">D:孔徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="258" publication-number="202611841"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611841.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611841</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133983</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於行動裝置的當日部位批次反向沖銷之股票交易系統、其操作方法、以及行動裝置</chinese-title>  
        <english-title>STOCK TRADING SYSTEM FOR BATCH REVERSE DAY TRADING ON MOBILE DEVICE, OPERATION METHOD OF THE SAME, AND MOBILE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241101B">G06Q40/04</main-classification>  
        <further-classification edition="202301120241101B">G06Q40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華南永昌綜合證券股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA NAN SECURITIES CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃進明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHANG-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林晉安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃聖鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHENG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MING-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭佳萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIA-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡其有</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於行動裝置的當日部位批次反向沖銷之股票交易系統包含：行動中台伺服器和交易處理主機。行動中台伺服器通訊連接至使用者的行動裝置且包含：反向出清處理模組其配置以接收使用者的指令而對當日成交部位進行反向出清且包含當沖損益試算功能模組和反向出清下單模組。交易處理主機與行動中台伺服器和金融商品交易中心通訊連接且包含股票交易模組和交易資料查詢模組。交易資料查詢模組配置以向金融商品交易中心查詢和接收當日成交資料和當日委託資料並且得到可反向出清資料。當沖損益試算模組根據該可反向出清資料試算當沖損益試算金額。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stock trading system for batch reverse day trading on mobile device includes a mobile middleware server and a transaction processing host. The mobile middleware server is connected to a user's mobile device and includes a reverse clearing processing module, which is configured to receive user commands to perform reverse clearing on the day's executed trades. It also includes an intraday profit and loss estimation module and a reverse clearing order module. The transaction processing host is connected to the mobile middleware server and a financial product trading center, and it includes a stock trading module and a transaction data query module. The transaction data query module is configured to query and receive the day's executed data and order data from the financial product trading center, and to obtain reverse clearing data. The intraday profit and loss estimation module calculates the estimated offset profit and loss amount based on the reverse clearing data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:股票交易系統</p>  
        <p type="p">100:行動中台伺服器</p>  
        <p type="p">110:股票下單處理模組</p>  
        <p type="p">120:反向出清處理模組</p>  
        <p type="p">130:當沖損益試算模組</p>  
        <p type="p">140:反向出清下單模組</p>  
        <p type="p">200:交易處理主機</p>  
        <p type="p">210:交易資料查詢模組</p>  
        <p type="p">220:股票交易模組</p>  
        <p type="p">300:行動裝置</p>  
        <p type="p">400:股票報價平台</p>  
        <p type="p">500:金融商品交易中心</p>  
        <p type="p">510:股票交易平台</p>  
        <p type="p">520:當日成交資料</p>  
        <p type="p">530:當日委託資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="259" publication-number="202610602"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610602.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610602</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133985</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藥物乾粉吸入裝置以及藥物乾粉給藥方法</chinese-title>  
        <english-title>DRUG DRY POWDER INHALATION DEVICE AND DRUG DRY POWDER ADMINISTRATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">A61D7/04</main-classification>  
        <further-classification edition="200601120241204B">A61K9/14</further-classification>  
        <further-classification edition="200601120241204B">A61M15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商亞證環球藥業(新加坡)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASG INSPIRATION LABORATORY (SINGAPORE) PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李榮生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JOHNSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤松材</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SUNG TSAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃浩偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪堯國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, JAO JUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙士磐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, SHIH PAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>談大成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, PHILIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種藥物乾粉吸入裝置，包含：呼吸偵測裝置、給藥裝置、以及計算機裝置。呼吸偵測裝置配置以監測動物的呼吸狀態並傳送多個呼吸狀態訊號。給藥裝置配置以施加藥物乾粉經口或經鼻至該動物的肺部。計算機裝置配置為接收所述呼吸狀態訊號、評估動物的緊張狀態、預測動物的呼吸周期，並且控制給藥裝置在不緊張的吸氣期間釋放藥物乾粉讓動物自主吸入。在此亦揭示藥物乾粉給藥方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A drug dry powder inhalation device is provided, including a breath detection device, a drug administration delivery device, and a computer device. The breath detection device is configured to monitor the breathing state of the animal and transmit a plurality of breathing state signals. The drug administration device is configured to apply drug dry powder to the lungs of the animal orally or nasally. The computer device is configured to receive the breathing state signal, evaluate the nervous state of the animal, predict the respiratory cycle of the animal, and control the drug delivery device to release the drug dry powder for the animal to inhale autonomously during an unstressed inhalation period. The disclosure also discloses a method for administering drug dry powder.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:藥物乾粉吸入裝置</p>  
        <p type="p">20:動物</p>  
        <p type="p">100:呼吸偵測裝置</p>  
        <p type="p">200:給藥裝置</p>  
        <p type="p">300:計算機裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="260" publication-number="202611062"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611062.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611062</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133988</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>嵌合型抗原及含此的豬用次單位疫苗組成物</chinese-title>  
        <english-title>CHIMERIC ANTOGEN AND PORCINE SUBUNIT VACCINE COMPOSITION INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240924B">C07K14/01</main-classification>  
        <further-classification edition="200601120240924B">A61K39/12</further-classification>  
        <further-classification edition="200601120240924B">A61K39/39</further-classification>  
        <further-classification edition="200601120240924B">A61P31/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立屏東科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱純燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHUN YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳幸潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSING-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>段氏　秋容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOAN THI, THU DUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史典娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STELLA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關於一種嵌合型抗原及含此的豬用次單位疫苗組成物。嵌合型抗原是將PCV2 外殼蛋白的誘餌表位(decoy epitope)區域及CD環(CD-loop)區域，替換成PCV3的特異性表位蛋白。嵌合型抗原可利用真核細胞表現系統表現而得。含嵌合型抗原的豬用次單位疫苗組成物，不論單劑接種或補強免疫，皆可提供有效對抗PCV2及PCV3的免疫保護力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to a chimeric antigen and a subunit vaccine composition including the same. The chimeric antigen is derived from a porcine circovirus type 2 (PCV2) capsid protein, a decoy epitope region and a CD-loop region of which are both replaced by PCV3-specific epitope protein. The chimeric antigen is expressed and obtained by an eukaryotic expression system. The porcine subunit vaccine composition can confer effectively immune protection against PCV2 and PCV3 via either a single vaccination or boost vaccination.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="261" publication-number="202610905"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610905.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610905</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113133998</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>食品之醣身分證標章及方法</chinese-title>  
        <english-title>SUGAR ID CODE LABELS AND METHODS FOR FOODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250629B">B65C9/46</main-classification>  
        <further-classification edition="200601120250629B">B65D79/00</further-classification>  
        <further-classification edition="200601120250629B">G01G19/40</further-classification>  
        <further-classification edition="201601120250629B">A23L29/30</further-classification>  
        <further-classification edition="201601120250629B">A23L33/125</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊沐恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, MU-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊沐恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, MU-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">隨著食品製程技術的進步，商品對於人體的價值在不斷提高。過快發展導致市場上對於同類商品的價值區分困難、如食品來源、配方、加工程序、成分的區分成了消費者及監管單位的盲區。本技術是利用醣類資訊製作食品身分證，以達到區分食品原料來源、食品配方、食品價值，增加產品指標成分的能見度、增加特殊處理之產品的區別性和增加獨特配方的科學指標依據，使食品從產地到消費者端有更科學的產品資訊，方便消費者區分商品，同時保護企業研發的投資。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">With the advancement of food processing technology, the value of products for human health is continually increasing. However, the rapid development has led to a consumer blind spot in distinguishing similar products in terms such as food formulations, source, process and ingredients. This technology utilizes carbohydrate information to create a " Sugar ID code and labels " enabling the differentiation and trace the source of food from food yield to terminal consumer (the information of raw material, food formulations, process and ingredients are provided). It also enhances the visibility of product value to customers, and provides scientific indicators for food products. This allows consumers to differentiate products more scientifically, also ensuring the profit of industry in research investments and development.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="262" publication-number="202610840"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610840.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610840</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134000</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>彩色太陽能板印刷控制方法</chinese-title>  
        <english-title>A PRINTING CONTROL METHOD FOR COLOR SOLAR PANELS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">B41F15/00</main-classification>  
        <further-classification edition="201401120250501B">H02S40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖宸賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHEN XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>睿田能源有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖宸賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHEN XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭朋深</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種彩色太陽能板印刷控制方法，其方法通過縮小印刷網點百分比面積並逐層堆疊增加印刷油墨濃度或在縮小的網點百分比面積內噴塗超過100%的墨水量來增加墨水濃度，有效減少塗料的覆蓋面積，增加鏤空區域，從而提高光透過率並提升彩色太陽能板的光電轉換效率，使本發明方法具有高效、靈活及可調整的特點，適合於各類彩色太陽能板的設計和製造，具有廣泛的應用前景。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention is a color solar panel printing control method. The method increases the concentration of printing ink by reducing the percentage area of ​​printing dots and stacking them layer by layer or by spraying more than 100% of the ink volume within the reduced percentage area of ​​dots to increase the ink concentration. It is effective. Reduce the coverage area of ​​the paint and increase the hollow area, thereby increasing the light transmittance and improving the photoelectric conversion efficiency of the colored solar panels. The method of the invention is efficient, flexible and adjustable, and is suitable for the design and design of various types of colored solar panels. manufacturing, with broad application prospects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:印刷網點縮小與堆疊設計</p>  
        <p type="p">2:鏤空面積增加</p>  
        <p type="p">3:印刷控制系統</p>  
        <p type="p">4:光學透光度與色彩飽和度的平衡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="263" publication-number="202612429"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612429.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612429</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134007</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源供應器</chinese-title>  
        <english-title>POWER SUPPLY UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H05K7/20</main-classification>  
        <further-classification edition="200601120241202B">H05K7/02</further-classification>  
        <further-classification edition="200601120241202B">G06F1/26</further-classification>  
        <further-classification edition="200601120241202B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李易軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏仕銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, SHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐清釧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHING-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種電源供應器，包括一絕緣片、一電路板、以及一膠材。絕緣片包括複數個側壁，以形成一容納空間。電路板包括一頂表面、以及一底表面。底表面面朝絕緣片。膠材容納在容納空間中，並且膠材覆蓋電路板之頂表面及底表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power supply unit is provided, including an insulating sheet, a circuit board, and an adhesive material. The insulating sheet includes a plurality of side walls to form an accommodation space. The circuit board includes a top surface, a bottom surface, and a connector. The bottom surface faces the insulating sheet. The connector is provided on the top surface. The adhesive material is accommodated in the accommodation space, and the adhesive material covers the top surface and the bottom surface of the circuit board. The adhesive material does not cover the connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:外殼</p>  
        <p type="p">11:底殼</p>  
        <p type="p">12:上蓋</p>  
        <p type="p">20:絕緣片</p>  
        <p type="p">21:底板</p>  
        <p type="p">22:側壁</p>  
        <p type="p">23:前壁</p>  
        <p type="p">30:電路板</p>  
        <p type="p">30a:頂表面</p>  
        <p type="p">30b:底表面</p>  
        <p type="p">31:連接器</p>  
        <p type="p">40:第一墊片</p>  
        <p type="p">50:第二墊片</p>  
        <p type="p">60:風扇</p>  
        <p type="p">70:膠材</p>  
        <p type="p">100:電源供應器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="264" publication-number="202610588"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610588.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610588</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134028</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具量化運動效果之個人健身導引裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A61B5/024</main-classification>  
        <further-classification edition="200601120240929B">A61B5/0205</further-classification>  
        <further-classification edition="200601120240929B">A61B5/11</further-classification>  
        <further-classification edition="200601120240929B">A63B21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王國樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王國樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱國雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種具量化運動效果之個人健身導引裝置，其係包括一可隨機穩固置放於運動使用者視線可及處，而可供隨時被觀視之顯示主機，以及，一可被繫固於該運動使用者身上並隨時偵測其心率之偵測發射器，其中，顯示主機內設有接收器，以隨時接收由偵測發射器所測得之當前心率訊息；惟其特徵在於：該顯示主機將可透過內建軟體程式及相應的操作程序，而對特定運動使用者之當前體能狀態予以量化成生理年齡，並再以此當前之生理年齡為基礎而運算出其最佳運動心率區間，之後，更將以清晰、明亮之不同顏色燈號加以顯示，進而可令運動使用者只需透過燈色便可立即清楚知曉其當前運動負荷是否處於有效的最佳運動心率區間，並據以隨時調整自身運動強度，配合維持最佳心率燈色，達到預期之引導健身效果，當然，其更可藉由特定警示燈號，甚或輔以警示聲響以顯示可能有心率超負荷等危險情事，從而獲致最佳運動安全性之積極目的者。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:顯示主機</p>  
        <p type="p">11:接收器</p>  
        <p type="p">12:IC處理器</p>  
        <p type="p">13:LED燈組</p>  
        <p type="p">14:可充電電池</p>  
        <p type="p">15:充電插槽</p>  
        <p type="p">16:觸控調整區</p>  
        <p type="p">17:觸控啟動鍵</p>  
        <p type="p">18:顯示屏幕</p>  
        <p type="p">19:磁吸元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="265" publication-number="202610814"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610814.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610814</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134039</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種長效緩釋薄膜結構</chinese-title>  
        <english-title>A LONG-LASTING CONTROLLED-RELEASE PRESERVATION FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241104B">B32B7/02</main-classification>  
        <further-classification edition="200601120241104B">B32B27/30</further-classification>  
        <further-classification edition="200601120241104B">B65D65/02</further-classification>  
        <further-classification edition="200601120241104B">B65D81/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人塑膠工業技術發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PLASTICS INDUSTRY DEVELOPMENT CENTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾向榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HSIANG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳克宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KE-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啟哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNG, CHI-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種長效緩釋薄膜結構，將複數個保鮮材料噴塗至該保鮮載體並烘乾，並與一塑料基底均勻混和後固化形成該緩釋層，從而有效地控制該長效緩釋薄膜結構釋放該保鮮材料，並且減緩該保鮮材料迅速析出於該長效緩釋薄膜結構之表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A long-lasting controlled-release preservation film has multiple preservation materials applied on a surface of multiple preservation carriers then the preservation carriers with the preservation materials is mixed into and solidified with a plastic substrate to from the controlled-release preservation film. The controlled-release preservation film can effectively control the release of preservation materials and prevent the preservation materials from quickly settling on the surface of the plastic substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:緩釋層</p>  
        <p type="p">11:塑料基底</p>  
        <p type="p">12:保鮮載體</p>  
        <p type="p">13:保鮮材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="266" publication-number="202610744"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610744.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610744</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134044</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工件斷屑裝置與工件斷屑系統</chinese-title>  
        <english-title>WORKPIECE CHIP-BREAKING DEVICE AND WORKPIECE CHIP-BREAKING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">B23B25/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立高雄科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪宗彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, TSUNG-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智為</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李威聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一種工件斷屑裝置，包含：一桿體；一刀頭組件，係可拆卸地設置於該桿體上，其中該桿體可選擇地：連帶該刀頭組件沿該桿體之軸向方向進行往復震動，以對一工件進行切削與斷屑；或連帶該刀頭組件沿該桿體之周向方向進行往復擺動，以對一工件進行切削與斷屑；以及一處理器，係設置於該桿體上，以可選擇地接收一工件資訊、以及一加工目標，並產生一加工流程，其中：該處理器係控制該桿體按照該加工流程進行運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a workpiece chip-breaking device, comprising: a rod body; a cutter head assembly detachably arranged on the rod body, wherein the rod body can optionally: cut and break a workpiece to generate chips of the workpiece by bringing the cutter head assembly to vibrate backward and forward along the axial direction of the rod body, or cut and break a workpiece to generate chips of the workpiece by bringing the cutter head assembly to swing backward and forward along the circumferential direction of the rod body; and a processor, which is arranged on the rod body, receiving a workpiece information and a processing target to generate a manufacturing process, wherein: the processor controls the movement of the rod body according to the manufacturing process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:工件斷屑裝置</p>  
        <p type="p">2:桿體</p>  
        <p type="p">3:刀頭組件</p>  
        <p type="p">4:軸向方向</p>  
        <p type="p">5:周向方向</p>  
        <p type="p">6:處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="267" publication-number="202611679"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611679.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611679</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134045</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有功率調整功能的電腦設備與主機板</chinese-title>  
        <english-title>A COMPUTER APPARATUS AND MOTHERBOARD HAVING POWER ADJUSTMENT FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250102B">G06F1/3203</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>研華股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉淑梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHU MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳重霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNG LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有功率調整功能的電腦設備，包含用以產生一總工作電流的電源模組，及包括處理單元與電流量測模組的主機板，電流量測模組電連接電源模組用以偵測總工作電流，並產生相關於總工作電流的偵測電流數據。處理單元根據偵測電流數據產生功耗預估數據，並根據功耗預估數據與功率閾值產生功率比較結果，且根據功率比較結果產生用以調整主機板的功率消耗的控制信號。主要功效為：處理單元根據功耗預估數據判斷是否產生控制信號，達到避免電源模組過載且減少處理單元運作於高功率消耗的運作時間，進而延長處理單元的使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computer apparatus having power adjustment function includes a power module for generating a total working current, and motherboard including a processing unit and a current measurement module, the current measurement module being electrically connected to the power module for detecting the total working current, and generating detection current data related to the total working current. The processing unit generates power consumption estimation data based on the detection current data, and generates a power comparison result based on the power consumption estimation data and a power threshold value, and generates a control signal for adjusting power consumption of the motherboard according to the power comparison result. The primary effect is that the processing unit determines whether to generate the control signal according to the power consumption estimation data, to thereby avoid overload of the power module and to reduce the operating time of the processing unit operating at high power consumption, thereby prolonging the service life of the processing unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電源模組</p>  
        <p type="p">2:主機板</p>  
        <p type="p">21:周邊元件</p>  
        <p type="p">22:處理單元</p>  
        <p type="p">23:電流量測模組</p>  
        <p type="p">24:溫度監測模組</p>  
        <p type="p">25:輸出介面模組</p>  
        <p type="p">3:風扇設備</p>  
        <p type="p">4:顯示設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="268" publication-number="202612475"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612475.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612475</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134047</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁阻式隨機存取記憶體及其製作方法</chinese-title>  
        <english-title>MAGNETORESISTIVE RANDOM ACCESS MEMORY AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">H10B61/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王慧琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡湘綺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, HSIANG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁宸毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, CHEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種製作磁阻式隨機存取記憶體(Magnetoresistive Random Access Memory, MRAM)元件的方法，其主要先形成形成一金屬間介電層於一基底上，然後形成第一金屬內連線以及第二金屬內連線於金屬間介電層內，形成一自旋軌道轉矩式(spin orbit torque, SOT)層於該第一金屬內連線以及該第二金屬內連線上，形成一磁性穿隧接面(magnetic tunneling junction, MTJ)於該SOT層上，形成一上電極於MTJ上，再形成一遮蓋層於MTJ以及SOT層上，其中該MTJ底表面包含第一曲面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for fabricating a magnetoresistive random access memory (MRAM) device includes the steps of first forming an inter-metal dielectric (IMD) layer on a substrate, forming a first metal interconnection and a second metal interconnection in the IMD layer, forming a spin orbit torque (SOT) layer on the first metal interconnection and the second metal interconnection, forming a magnetic tunneling junction (MTJ) on the SOT layer, forming a top electrode (TE) on the MTJ, and forming a cap layer on the MTJ and the SOT layer. Preferably, a bottom surface of the MTJ includes a first curve.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:基底</p>  
        <p type="p">14:MRAM區域</p>  
        <p type="p">16:層間介電層</p>  
        <p type="p">18:金屬內連線結構</p>  
        <p type="p">20:金屬內連線結構</p>  
        <p type="p">22:金屬間介電層</p>  
        <p type="p">24:金屬內連線</p>  
        <p type="p">26:停止層</p>  
        <p type="p">28:金屬間介電層</p>  
        <p type="p">30:金屬內連線</p>  
        <p type="p">32:金屬內連線</p>  
        <p type="p">34:阻障層</p>  
        <p type="p">36:金屬層</p>  
        <p type="p">38:接觸洞</p>  
        <p type="p">42:下電極</p>  
        <p type="p">50:SOT層</p>  
        <p type="p">52:自由層</p>  
        <p type="p">54:阻障層</p>  
        <p type="p">56:固定層</p>  
        <p type="p">58:MTJ</p>  
        <p type="p">60:遮蓋層</p>  
        <p type="p">62:上電極</p>  
        <p type="p">64:遮蓋層</p>  
        <p type="p">66:金屬間介電層</p>  
        <p type="p">68:金屬內連線</p>  
        <p type="p">70:阻障層</p>  
        <p type="p">72:金屬層</p>  
        <p type="p">74:停止層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="269" publication-number="202610865"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610865.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610865</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134052</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種腳踢感應模組</chinese-title>  
        <english-title>A FOOT-KICK SENSING MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250602B">B60R25/20</main-classification>  
        <further-classification edition="201501120250602B">E05F15/73</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡志峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIFEN CHIH FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡志峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIFEN, CHIH FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡豐名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, FENG MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種腳踢感應模組，應用於車輛尾門的自動控制。該模組包含感應單元、計算單元和傳輸單元。感應單元安裝於車輛尾部，負責偵測預設範圍內的物體運動，並透過影像捕捉裝置收集影像數據，輔以飛行時間測距(TOF)相機及紅外線感應器，提高在各種光線條件下的偵測精度。計算單元使用影像辨識技術結合類神經網路，進行物體運動的分析與腳踢動作的辨識，並通過深度學習模型增強辨識準確度和穩定性，特別是在複雜環境條件下降低誤判機率。傳輸單元則通過無線通訊技術，將辨識結果傳輸至車輛控制系統，以觸發車尾門的自動開啟或關閉。此模組設計提升了腳踢動作偵測的準確度和穩定性，特別適用於各種環境下的車輛尾門自動開啟系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a foot-kick sensing module applied to the automatic control of a vehicle’s tailgate. The module comprises a sensing unit, a computing unit, and a transmission unit. The sensing unit, installed at the rear of the vehicle, detects object movement within a predetermined range and captures image data through an image capturing device. It is further assisted by a Time-of-Flight (TOF) camera and an infrared sensor to enhance detection accuracy under various lighting conditions. The computing unit utilizes image recognition technology combined with a neural network to analyze object movement and recognize valid foot-kick actions, employing a deep learning model to improve recognition accuracy and system stability while reducing misidentification, particularly in complex environmental conditions. The transmission unit wirelessly transmits the recognition results to the vehicle control system, triggering the automatic opening or closing of the tailgate. This module design enhances the precision and reliability of foot-kick action detection, making it particularly suitable for vehicle tailgate automatic opening systems in diverse environmental conditions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:腳踢感應模組</p>  
        <p type="p">10:感應單元</p>  
        <p type="p">11:影像捕捉裝置</p>  
        <p type="p">12:飛行時間測距(TOF)相機</p>  
        <p type="p">13:紅外線感應器</p>  
        <p type="p">20:計算單元</p>  
        <p type="p">21:類神經網路系統</p>  
        <p type="p">30:傳輸單元</p>  
        <p type="p">31:無線通訊技術</p>  
        <p type="p">40:車輛控制系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="270" publication-number="202612413"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612413.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612413</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134059</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閂鎖把手、抽屜及機櫃</chinese-title>  
        <english-title>LATCHABLE HANDLE, DRAWER AND RACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H05K5/00</main-classification>  
        <further-classification edition="200601120250102B">H05K5/02</further-classification>  
        <further-classification edition="200601120250102B">H05K7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯穎科技服務股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIWYNN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉秉昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, PING SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林威辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種閂鎖把手，組裝於一機櫃的一機殼與一抽屜的一側板之間。閂鎖把手包含一把手、一連動機構、一推抵機構及一導向件。把手經由一第一樞紐樞接於側板，被配置來接受沿一第一方向的一第一施力。連動機構連接把手及側板，被配置來轉換第一施力為一反方向的一第二施力。推抵機構連接側板，被配置來在把手接受第二施力時沿反方向滑動。導向件固定於側板，被配置來在推抵機構沿反方向滑動時導引推抵機構沿垂直於該第一方向的一第二方向移動，使推抵機構推抵設置於機殼的一第一凸柱來傳遞第二施力給把手。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A latch handle is mounted between a casing of a rack and a side plate of a drawer. The latch handle includes a handle, a linkage mechanism, a push mechanism and a guide component. The handle is pivotably disposed on the side plate via a first shaft and is configured to receive a first force along a first direction. The linkage mechanism is connected to the handle and the side plate and is configured to transfer the first force to a second force in an opposite direction. The push mechanism is connected to the side plate and is configured to slide along the opposite direction when the handle receives the second force. The guide component is fixed to the side plate and is configured to guide the push mechanism to move along a second direction perpendicular to the first direction when the push mechanism slides along the opposite direction, such that the push mechanism presses against a first pillar of the casing for transferring the second force to the handle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">43R:側板</p>  
        <p type="p">100:推抵機構</p>  
        <p type="p">110:支架</p>  
        <p type="p">120:第二推抵件</p>  
        <p type="p">130:第二導銷</p>  
        <p type="p">131:第三導銷</p>  
        <p type="p">140:第五彈性件</p>  
        <p type="p">150:第六彈性件</p>  
        <p type="p">160:固定座</p>  
        <p type="p">170:第一固持件</p>  
        <p type="p">180:第二固持件</p>  
        <p type="p">200:導向件</p>  
        <p type="p">201:第一支臂</p>  
        <p type="p">202:第二支臂</p>  
        <p type="p">211:斜面</p>  
        <p type="p">212:導引凸塊</p>  
        <p type="p">300:連動機構</p>  
        <p type="p">310:第一連桿</p>  
        <p type="p">311:受推部</p>  
        <p type="p">312:推動部</p>  
        <p type="p">3121:第二凸柱</p>  
        <p type="p">313:第三連桿</p>  
        <p type="p">320:第二連桿</p>  
        <p type="p">321:第七導槽</p>  
        <p type="p">330:第一彈性件</p>  
        <p type="p">340:第二彈性件</p>  
        <p type="p">400:把手</p>  
        <p type="p">500:固持機構</p>  
        <p type="p">510:支撐柱</p>  
        <p type="p">520:第四連桿</p>  
        <p type="p">521:第一端</p>  
        <p type="p">522:第二端</p>  
        <p type="p">523:第三端</p>  
        <p type="p">524:第四端</p>  
        <p type="p">530:第七彈性件</p>  
        <p type="p">600:釋放機構</p>  
        <p type="p">610:釋放件</p>  
        <p type="p">620:第八彈性件</p>  
        <p type="p">700:第七導銷</p>  
        <p type="p">72:第二樞紐</p>  
        <p type="p">73:第三樞紐</p>  
        <p type="p">74:第四樞紐</p>  
        <p type="p">F1:第一施力</p>  
        <p type="p">F2:第二施力</p>  
        <p type="p">F3:第三施力</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="271" publication-number="202612147"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612147.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612147</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134065</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H01L23/522</main-classification>  
        <further-classification edition="202301120241101B">H10N97/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪雅娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, YA-JYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馥郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, FU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡濱祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, BIN-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件，包含一底電極層、一保護層、一絕緣層、一頂電極層、一第一接觸結構以及一第二接觸結構。底電極層包含一第一階梯結構，其中第一階梯結構包含一第一階面以及一第二階面低於第一階面。保護層設置於第二階面上，絕緣層設置於第一階面上，頂電極層設置於絕緣層上，第一接觸結構與底電極層電性連接，第二接觸結構與頂電極層電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a bottom electrode layer, a protective layer, an insulating layer, a top electrode layer, a first contact structure and a second contact structure. The bottom electrode layer includes a first step structure, in which the first step structure includes a first step surface and a second step surface lower than the first step surface. The protective layer is disposed on the second step surface. The insulating layer is disposed on the first step surface. The top electrode layer is disposed on the insulating layer. The first contact structure is electrically connected with the bottom electrode layer. The second contact structure is electrically connected with the top electrode layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體元件</p>  
        <p type="p">12:基底</p>  
        <p type="p">14:介電層</p>  
        <p type="p">16:底電極層</p>  
        <p type="p">18,20:絕緣層</p>  
        <p type="p">22:保護層</p>  
        <p type="p">28:頂電極層</p>  
        <p type="p">30,32,34,36:介電層</p>  
        <p type="p">38,40:孔洞</p>  
        <p type="p">42:第一接觸結構</p>  
        <p type="p">44:第二接觸結構</p>  
        <p type="p">221,361:頂表面</p>  
        <p type="p">140,160:階梯結構</p>  
        <p type="p">141,161:第一階面</p>  
        <p type="p">142,162:第二階面</p>  
        <p type="p">143,163:連接面</p>  
        <p type="p">D1:水平方向</p>  
        <p type="p">D2:垂直方向</p>  
        <p type="p">HD:間隔距離</p>  
        <p type="p">SD2:階差</p>  
        <p type="p">T3,T41,T42:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="272" publication-number="202612443"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612443.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612443</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134066</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動態隨機存取記憶體裝置及其製造方法</chinese-title>  
        <english-title>DYNAMIC RANDOM ACCESS MEMORY DEVICES AND METHODS FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241001B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤碩廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, SHUO-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱玄通</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, HSUAN-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張維哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEI-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種動態隨機存取記憶體裝置，包括基底、位元線、虛置位元線、虛置絕緣結構和蓋層。基底包含陣列區、週邊區以及位於陣列區與週邊區之間的虛置區。位元線位於陣列區中的基底上方。虛置位元線位於虛置區中的基底上方。虛置絕緣結構位於虛置位元線之間，且虛置絕緣結構的頂表面低於虛置位元線的頂表面。蓋層位於虛置區以覆蓋虛置位元線的頂部及虛置絕緣結構的頂部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A DRAM device includes a substrate, bit lines, dummy bit lines, a dummy insulation structure and a cap layer. The substrate includes an array region, a peripheral region and a dummy region between the array region and the peripheral region. The bit lines are formed over the substrate and disposed in the array region. The dummy bit lines are formed over the substrate and disposed in the dummy region. The dummy insulation structure is disposed between the dummy bit lines, and the top surface of the dummy insulation structure is lower than the top surface of the dummy bit lines. The cap layer is disposed in the dummy region to cover the top portions of the dummy bit lines and the top portion of the dummy insulation structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">101:主動區域</p>  
        <p type="p">102:隔離結構</p>  
        <p type="p">13:虛置位元線</p>  
        <p type="p">13T:頂部</p>  
        <p type="p">21:位元線接觸件</p>  
        <p type="p">23:位元線</p>  
        <p type="p">25:遮罩層</p>  
        <p type="p">262:絕緣材料層</p>  
        <p type="p">262h:節點接觸孔</p>  
        <p type="p">27:間隔結構</p>  
        <p type="p">271:第一間隔材料層</p>  
        <p type="p">272:第二間隔材料層</p>  
        <p type="p">273:第三間隔材料層</p>  
        <p type="p">273a,421a:頂表面</p>  
        <p type="p">32:元件結構</p>  
        <p type="p">42:蓋層</p>  
        <p type="p">421:主體部</p>  
        <p type="p">421b:底表面</p>  
        <p type="p">422:突出部</p>  
        <p type="p">A1:陣列區</p>  
        <p type="p">A2:週邊區</p>  
        <p type="p">AD:虛置區</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="273" publication-number="202611234"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611234.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611234</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物複合膜材料及其製備方法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">C08L89/00</main-classification>  
        <further-classification edition="200601120250303B">C08L1/04</further-classification>  
        <further-classification edition="200601120250303B">C08L1/28</further-classification>  
        <further-classification edition="200601120250303B">C08J5/18</further-classification>  
        <further-classification edition="200601120250303B">A61L31/14</further-classification>  
        <further-classification edition="200601120250303B">A22C13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商梧州勝馳生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUZHOU VICTORY BIOTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承致</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳淞鎰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SONG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周亞仙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YA-XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱顯丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種生物複合膜材料及其製備方法和應用。本發明提供的生物複合膜材料包括二醛纖維素類化合物和生物材料，該生物材料選自膠原蛋白或明膠。本發明提供的生物複合膜材料解決了現有蛋白腸衣及纖維素衍生物-蛋白薄膜因交聯劑導致的添加繁多及殘留、安全性不佳的問題，並且提升了拉伸強度和斷裂伸長率。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="274" publication-number="202612191"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612191.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612191</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134084</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蓋件、電子裝置及連接器單元拆卸方法</chinese-title>  
        <english-title>COVER, ELECTRONIC DEVICE AND CONNECTOR UNIT REMOVING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">H01R13/516</main-classification>  
        <further-classification edition="200601120241126B">H01R13/639</further-classification>  
        <further-classification edition="200601120241126B">H01R43/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啓碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON NEWEB CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建鋐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉英志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王崇豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUNG-HAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種蓋件，用以對應並鄰設於一電子裝置的一連接器單元並包含一第一表面、一第二表面、一拉動部及至少一第一卡合部。第一表面用以面向電子裝置的一外部空間。第二表面與第一表面相對地設置並用以面向電子裝置的一內部空間。拉動部包含一開口，其貫穿第一表面及第二表面，當連接器單元處於一傳輸狀態時，開口用以供一纜線通過以連接連接器單元。第一卡合部設置於第二表面。藉此，可維持電子裝置的美觀並便於拆卸連接器單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cover is configured for corresponding and being adjacent to a connector unit of an electronic device and includes a first surface, a second surface, a pulling portion and at least one first engaging portion. The first surface is configured for facing an outer space of the electronic device. The second surface is disposed opposite to the first surface and configured for facing an inner space of the electronic device. The pulling portion includes an opening, which penetrates the first surface and the second surface. When the connector unit is in a transmission state, the opening is configured for a cable to pass therethrough to be connected to the connector unit. The first engaging portion is disposed on the second surface. Therefore, the appearance of the electronic device can be maintained and the connector unit can be easily disassembled.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:外殼</p>  
        <p type="p">113:外表面</p>  
        <p type="p">120:蓋件</p>  
        <p type="p">121:第一表面</p>  
        <p type="p">122:第二表面</p>  
        <p type="p">123:第一卡合部</p>  
        <p type="p">125:拉動部</p>  
        <p type="p">126:開口</p>  
        <p type="p">127:蓋件樞軸</p>  
        <p type="p">128:按壓部</p>  
        <p type="p">140:連接器單元</p>  
        <p type="p">143:拉柄主體</p>  
        <p type="p">144:拉柄樞轉部</p>  
        <p type="p">148:連接器主體</p>  
        <p type="p">149:散熱結構</p>  
        <p type="p">160:纜線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="275" publication-number="202612430"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612430.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612430</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134085</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱系統</chinese-title>  
        <english-title>HEAT DISSIPATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K7/20</main-classification>  
        <further-classification edition="200601120241105B">F28D1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>建準電機工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MING-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張育誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱系統，用以解決習知散熱模組對電子元件瞬間升溫散熱效率不佳的問題。係包含一散熱模組，用以結合一電子元件；及一液冷散熱件，該液冷散熱件具有一殼體，該殼體熱接觸該散熱模組，該殼體具有一液密空間，該液密空間具有一工作液體，該液冷散熱件具有至少一流體驅動件，該至少一流體驅動件位於該液密空間。藉此可以達成有效率地將該電子元件降至適當溫度功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation system is used to solve the problem of poor heat dissipation efficiency of conventional heat dissipation modules for electronic components due to instantaneous heating. Includes: a heat dissipation module used to combine an electronic component; and a liquid cooling heat dissipation component, the liquid cooling heat dissipation component has a shell, the shell thermally contacts the heat dissipation module, the shell has a liquid-tight space, the liquid-tight space has a working fluid, and the liquid-cooling heat sink has at least one fluid driving component located in the liquid-tight space. This can effectively reduce the electronic component to the appropriate temperature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">11:導熱部</p>  
        <p type="p">12:環牆</p>  
        <p type="p">13:蓋體</p>  
        <p type="p">2:流體驅動件</p>  
        <p type="p">21:葉輪</p>  
        <p type="p">3:定位件</p>  
        <p type="p">3a:第一表面</p>  
        <p type="p">3b:第二表面</p>  
        <p type="p">31:結合槽</p>  
        <p type="p">M:液冷散熱件</p>  
        <p type="p">E:電子元件</p>  
        <p type="p">T:導熱管</p>  
        <p type="p">I:導熱件</p>  
        <p type="p">F:散熱風扇</p>  
        <p type="p">F1:風口</p>  
        <p type="p">J:鰭片</p>  
        <p type="p">S:液密空間</p>  
        <p type="p">K:散熱模組</p>  
        <p type="p">G:散熱系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="276" publication-number="202611732"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611732.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611732</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134092</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體管理方法、記憶體儲存裝置與記憶體控制電路單元</chinese-title>  
        <english-title>MEMORY MANAGEMENT METHOD, MEMORY STORAGE DEVICE AND MEMORY CONTROL CIRCUIT UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241202B">G06F12/0866</main-classification>  
        <further-classification edition="201601120241202B">G06F12/08</further-classification>  
        <further-classification edition="201601120241202B">G06F12/10</further-classification>  
        <further-classification edition="200601120241202B">G06F13/14</further-classification>  
        <further-classification edition="200601120241202B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群聯電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHISON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉彥辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YEN CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種記憶體管理方法，用於可複寫式非揮發性記憶體模組。此方法包括：啟動資料整併操作；從可複寫式非揮發性記憶體模組中選擇來源實體單元以及目標實體單元以執行資料整併操作；判斷是否建立對應於邏輯至實體映射表的備份表；若判斷建立備份表，將來源實體單元中位於第一實體地址的第一資料複製至目標實體單元的第二實體地址，並將第二實體地址紀錄於備份表；以及根據備份表中的資訊判斷是否將第二實體地址更新至邏輯至實體映射表。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory management method is provided for a rewritable non-volatile memory module. The method includes: initiating a data merging operation; selecting a source physical unit and a target physical unit from the rewritable non-volatile memory module to perform the data merging operation; determining whether to create a backup table corresponding to a logical-to-physical mapping table; if it is determined to create the backup table, copying first data located at a first physical address in the source physical unit to a second physical address in the target physical unit, and recording the second physical address in the backup table; and determining whether to update the second physical address to the logical-to-physical mapping table based on information in the backup table.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">701~707:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="277" publication-number="202611472"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611472.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611472</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134094</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具多孔目抗彈板的複合材料防彈結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240913B">F41H1/02</main-classification>  
        <further-classification edition="200601120240913B">F41H5/04</further-classification>  
        <further-classification edition="200601120240913B">B32B17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>擎天防護科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張賢財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王竣騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耿禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種具多孔目抗彈板的複合材料防彈結構，包含：一金屬層、至少一高分子量纖維層及複數克夫拉材料層；該金屬層佈滿有孔目狀捕彈孔，該捕彈孔貫穿該金屬層由內側到外側；該高分子量纖維層是以複數高分子量纖維布UD重複十字交叉編織成，再將該高分子量纖維布熱固定一第一含熱固定膠，該高分子量纖維層以外側設置於該金屬層內側處；該各克夫拉材料層是由複數克夫拉纖維編織布UD重複十字交叉編織成，再將該克夫拉纖維編織布熱固定一第二含熱固定膠而成，該克夫拉材料層以最外側設置於該高分子量纖維層內側處；藉此，能夠極大程度吸收子彈的衝擊力，有效減少殘餘衝擊力透過防彈護具對使用者造成傷害，提供更加安全可靠的防護。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:外套層</p>  
        <p type="p">20:金屬層</p>  
        <p type="p">21:捕彈孔</p>  
        <p type="p">30:高分子量纖維層</p>  
        <p type="p">31:高分子量纖維布</p>  
        <p type="p">32:第一含熱固定膠</p>  
        <p type="p">40:克夫拉材料層</p>  
        <p type="p">41:克夫拉纖維編織布</p>  
        <p type="p">42:第二含熱固定膠</p>  
        <p type="p">50:內套層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="278" publication-number="202610699"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610699.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610699</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帽狀腱膜刺激裝置</chinese-title>  
        <english-title>CAP-SHAPED APONEUROSIS STIMULATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">A61N5/06</main-classification>  
        <further-classification edition="202101120241125B">A42B1/017</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭智隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭智隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之帽狀腱膜刺激裝置用於刺激帽狀腱膜，透過肌肉傳導至全身，促使肌肉放鬆，幫助脊椎復位，從而緩解疾病。本發明的帽狀腱膜刺激裝置包括一帽體及多個第一光療模組。其中，第一光療模組是設置於所述帽體內，且這些第一光療模組配置為對應於使用者頭部頂骨區的第一局部位置。其中，這些第一光療模組發出光線以刺激該第一局部位置所涵蓋的帽狀腱膜。帽狀腱膜刺激裝置以非侵入性的方式刺激帽狀腱膜，以促使肌肉軟化，從而使脊椎復位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The cap-shaped aponeurosis stimulation device of this invention is used to stimulate the aponeurosis, which is conducted through muscles to the entire body, promoting muscle relaxation and aiding in spinal realignment, thereby relieving ailments. The cap-shaped aponeurosis stimulation device of this invention includes a cap body and multiple first phototherapy modules. Among them, the first phototherapy modules are arranged inside the cap body and are configured to correspond to the first localized areas of the parietal region of the user's head. These first phototherapy modules emit light to stimulate the aponeurosis covered by the first localized area. The aponeurosis stimulation device stimulates the aponeurosis in a non-invasive manner, promoting muscle softening, thereby facilitating spinal realignment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:帽狀腱膜刺激裝置</p>  
        <p type="p">12:帽體</p>  
        <p type="p">13:第一光療模組</p>  
        <p type="p">14:第二光療模組</p>  
        <p type="p">15:第三光療模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="279" publication-number="202611881"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611881.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611881</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134096</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車內生命體監測方法及車內生命體監測系統</chinese-title>  
        <english-title>IN-VEHICLE LIVING SUBJECT MONITORING METHOD AND IN-VEHICLE LIVING SUBJECT MONITORING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">G08B21/02</main-classification>  
        <further-classification edition="200601120240929B">G08B21/18</further-classification>  
        <further-classification edition="200601120240929B">G08B25/00</further-classification>  
        <further-classification edition="200601120240929B">G08B7/06</further-classification>  
        <further-classification edition="200601120240929B">B60R21/02</further-classification>  
        <further-classification edition="201201120240929B">B60W40/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啓碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON NEWEB CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘉智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳書逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種車內生命體監測方法，其用以監測車內空間，並包含：藉由偵測器偵測車內空間而得到複數點雲資訊；藉由處理器接收來自偵測器之點雲資訊，並計算點雲資訊而得到對應點雲資訊之複數訊雜比，並計算訊雜比而得到訊雜比之平均值及標準差；以及藉由處理器進行判斷步驟，判斷步驟包含依據平均值及標準差判斷車內空間是否存在生命體而產生狀態判斷結果，並依據狀態判斷結果輸出對應車內空間之狀態的狀態參數。藉此，透過平均值及標準差之判斷可得到對應車內空間之狀態的狀態參數，以有效判斷車內空間是否單獨存在孩童。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An in-vehicle living subject monitoring method is proposed. The in-vehicle living subject monitoring method is used to monitor a space inside a vehicle and includes configuring a detector to detect the space inside the vehicle to obtain a plurality of point clouds; configuring a processor to receive the point clouds from the detector, and calculate the point clouds to obtain a plurality of signal-to-noise ratios corresponding to the point clouds, and calculate the signal-to-noise ratios to obtain an average value and a standard deviation of the signal-to-noise ratios; and configuring the processor to perform a judging step. The judging step includes judging whether there is a living subject in the space according to the average value and the standard deviation to generate a state judgment result, and outputting a state parameter corresponding to a state of the space according to the state judgment result. Therefore, the present disclosure can obtain the state parameter corresponding to the state of the space by judgment of the average value and the standard deviation, thereby effectively determining whether there is a child alone in the space inside the vehicle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S0:車內生命體監測方法</p>  
        <p type="p">S02,S04,S06:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="280" publication-number="202610886"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610886.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610886</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134100</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種自行車後視鏡</chinese-title>  
        <english-title>A REARVIEW MIRROR OF BICYCLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">B62J29/00</main-classification>  
        <further-classification edition="200601120241029B">B60R1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張奉琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FONG-CHYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張奉琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FONG-CHYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種自行車後視鏡，包括一固定座、一鏡片及一線框支桿，其中該固定座之一側可結合一車把，另一側可結合該線框支桿，該線框支桿由一金屬線於一端形設一支桿部以結合該固定座，且於另一端形設一線框部以結合該鏡片並可藉由改變該支桿部之形狀來調整該鏡片之位置與角度。本發明善加利用該金屬線同時兼具一可支撐結構特性以及一可調整形狀特性，讓該金屬線於兩端分別形設一線框部及一支桿部，從而創造一結構簡單、調整容易、輕薄耐撞且同時適用於彎式車把與平式車把的左右兩側之自行車後視鏡。本發明可讓所有自行車都能輕鬆安裝及調整該後視鏡，進而全面提升自行車之行車安全。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a bicycle rearview mirror, which includes a fixed base, a mirror lens, and a wire frame support rod. One side of the fixed base can be connected to a handlebar, while the other side can be connected to the wire frame support rod. The wire frame support rod is formed from a metal wire, with one end shaped into a support section for connecting to the fixed base, and the other end shaped into a frame section for connecting to the mirror lens. The position and angle of the mirror lens can be adjusted by changing the shape of the support section. This invention effectively utilizes the metal wire to provide both a supportive structural characteristic and an adjustable shape feature. The metal wire has a frame section at one end and a support section at the other, creating a simple structure that is easy to adjust, lightweight, impact-resistant, and suitable for both curved and flat handlebars on either side of the bicycle. This invention allows all bicycles to easily install and adjust the rearview mirror, thereby significantly enhancing the riding safety of bicycles.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:固定座</p>  
        <p type="p">11:夾管部</p>  
        <p type="p">12:支桿結合部</p>  
        <p type="p">15:支桿結合孔</p>  
        <p type="p">50:鏡片</p>  
        <p type="p">60:線框支桿</p>  
        <p type="p">61:線框部</p>  
        <p type="p">62:支桿部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="281" publication-number="202611898"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611898.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611898</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134101</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及顯示面板的驅動方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND METHOD FOR DRIVING DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">G09G3/36</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昕儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIN-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐懿夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU, YI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游季芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, JI-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張育瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包含顯示面板及控制系統。顯示面板包含數個畫素群組。每個畫素群組包含數個子畫素電路及脈波寬度調變電路。子畫素電路接收脈波振幅調變資料並控制發光強度。脈波寬度調變電路接收脈波寬度調變資料並控制發光時間。控制系統用以接收包含子畫素電路之當前灰階值的影像資訊；透過第一查找表以基於當前灰階值建立脈波寬度調變資料；透過第二查找表以將當前灰階值轉換為目標灰階值，其中目標灰階值對應於脈波振幅調變資料；及輸出具有脈波寬度調變資料及目標灰階值的影像資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a display panel and a control system. The display panel includes multiple pixel groups. Each pixel group includes several sub-pixel circuits and a pulse-width modulation (PWM) circuit. The sub-pixel circuit receives pulse-amplitude modulation (PAM) data and controls the light emission intensity. The PWM circuit receives PWM data and controls the light emission time. The control system is used to receive image information that includes current grayscale values of the sub-pixel circuits; to establish the PWM data based on the current grayscale values through a first look-up table; to convert the current grayscale values to target grayscale values through a second look-up table, where the target grayscale values corresponds to the PAM data; and to output image information including the PWM data and the target grayscale values.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">110:顯示面板</p>  
        <p type="p">111:畫素群組</p>  
        <p type="p">120:控制系統</p>  
        <p type="p">121:運算模組</p>  
        <p type="p">122:斜波訊號產生電路</p>  
        <p type="p">130:驅動電路</p>  
        <p type="p">COF:覆晶薄膜</p>  
        <p type="p">R,G,B:子畫素電路</p>  
        <p type="p">I1,I2:影像資訊</p>  
        <p type="p">P:脈波寬度調變電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="282" publication-number="202611406"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611406.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611406</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134104</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>泵浦內磁組裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F04D13/06</main-classification>  
        <further-classification edition="200601120241105B">F04D29/40</further-classification>  
        <further-classification edition="200601120241105B">F04D29/58</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日益電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZI YI ELECTRICAL ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃丁財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TING-TSAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種泵浦內磁組裝置之製造方法，先製備一射出模具、一熱壓設備、一內磁單元及一內磁底座。將該內磁單元安裝於該射出模具的一模穴中，且該內磁單元受一頂針單元支撐定位，再將一塑膠材料射出至該模穴中，且使一包覆單元包覆於該內磁單元外部及該頂針單元的一部分。之後，可自該模穴中取出一半成品，該半成品具有一內結合區域，再將該內磁底座安裝於該半成品的內結合區域，且置入該熱壓設備中進行加熱且壓合作業，該內磁底座與該半成品熱融接合成該泵浦內磁組裝置，該泵浦內磁組裝置密合性高，不容易產生滲漏。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:泵浦內磁組</p>  
        <p type="p">10:內磁單元</p>  
        <p type="p">11:下金屬件</p>  
        <p type="p">111:嵌孔</p>  
        <p type="p">12:上金屬件</p>  
        <p type="p">13:鋼片組</p>  
        <p type="p">14:磁鐵組</p>  
        <p type="p">20:包覆單元</p>  
        <p type="p">21:內結合區域</p>  
        <p type="p">211:底端面</p>  
        <p type="p">212:鏤空部</p>  
        <p type="p">213:內接合環件</p>  
        <p type="p">214:外封環</p>  
        <p type="p">215:內凹溝</p>  
        <p type="p">215':對位部</p>  
        <p type="p">216:肩面</p>  
        <p type="p">217:擴徑內壁面</p>  
        <p type="p">218:窄徑內壁面</p>  
        <p type="p">219':內環圈</p>  
        <p type="p">219":內定位圈</p>  
        <p type="p">210:環凹部</p>  
        <p type="p">22:凹孔</p>  
        <p type="p">30:內磁底座</p>  
        <p type="p">31:底板</p>  
        <p type="p">32:外結合區域</p>  
        <p type="p">321:外接合環件</p>  
        <p type="p">322:凸環</p>  
        <p type="p">323:對位塊</p>  
        <p type="p">324:外環圈</p>  
        <p type="p">325:外定位圈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="283" publication-number="202611391"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611391.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611391</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134105</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>揮發性有機物蓄熱燃燒廢熱回收發電裝置</chinese-title>  
        <english-title>VOLATILE ORGANIC COMPOUNDS REGENERATIVE COMBUSTION WASTE HEAT RECOVERY POWER GENERATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F01K27/02</main-classification>  
        <further-classification edition="200601120241105B">F01D15/10</further-classification>  
        <further-classification edition="200601220241105B">F28D20/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家原子能科技研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林威廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李恒毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HENG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊昇府</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHENG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃財富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TSAIR-FUH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐奉璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種揮發性有機物蓄熱燃燒廢熱回收發電裝置，係包括一蓄熱發電模組、以及一揮發性有機氣體蓄熱燃燒爐所構成。藉此，本發明可針對揮發性有機氣體蓄熱燃燒爐，將從爐壁逸散的廢熱加以分解成無害氣體後回收發電再利用，充分發揮資源再生成能源，可改善製程尾氣排放與處理設備的耗能問題，以節能方式減少揮發性有機空氣污染物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A volatile organic compound regenerative combustion waste heat recovery power generation device is composed of a regenerative power generation module and a volatile organic gas regenerative combustion furnace. Thus, the present invention can be aimed at the volatile organic gas regenerative combustion furnace, the waste heat escaping from the furnace wall is decomposed into harmless gas, and then recovered for power generation and reuse, and the resources are regenerated and regenerated, and the energy consumption problem of process exhaust gas emission and treatment equipment can be improved, and the volatile organic air pollutants are reduced in an energy-saving manner.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:蓄熱發電模組</p>  
        <p type="p">11:熱電發電晶片</p>  
        <p type="p">12:導熱墊片</p>  
        <p type="p">13:蓄熱導熱板</p>  
        <p type="p">14:螺絲</p>  
        <p type="p">15:彈簧墊片</p>  
        <p type="p">16:隔熱墊片</p>  
        <p type="p">17:螺帽</p>  
        <p type="p">18:散熱鰭片</p>  
        <p type="p">2:揮發性有機氣體蓄熱燃燒爐</p>  
        <p type="p">21:入口管路</p>  
        <p type="p">22:漸擴管路</p>  
        <p type="p">23:細孔蓄熱磚</p>  
        <p type="p">24:粗孔蓄熱磚</p>  
        <p type="p">25:燃燒器</p>  
        <p type="p">26:反應室</p>  
        <p type="p">27:漸縮管路</p>  
        <p type="p">28:出口管路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="284" publication-number="202611654"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611654.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611654</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134106</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>航點修正裝置及航點修正方法</chinese-title>  
        <english-title>WAYPOINT CORRECTION DEVICE AND WAYPOINT CORRECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241007B">G05D1/249</main-classification>  
        <further-classification edition="202401120241007B">G05D1/248</further-classification>  
        <further-classification edition="202401120241007B">G05D1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張庭維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李國徵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUAL-ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種航點修正裝置及航點修正方法。響應於一無人飛行裝置的一定位訊號位於一預定航點，該裝置自該無人飛行裝置取得一即時影像。該裝置基於該即時影像，計算該即時影像中的一特徵點分布。該裝置基於該特徵點分布產生一調整視角指令，以控制該無人飛行裝置基於該調整視角指令進行原地旋轉，並擷取一調整後即時影像。該裝置基於複數個三維特徵點、該調整後即時影像及一取樣次數閾值，產生一修正航線，以控制該無人飛行裝置基於該修正航線自一實際位置移動至一預定航點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A waypoint correction device and waypoint correction method are provided. In response to a positioning signal of an unmanned aerial vehicleat a predetermined waypoint, the waypoint correction device obtains a real-time image from the unmanned aerial vehicle. The waypoint correction device calculates a feature point distribution in the real-time image based on the real-time image. The device generates an adjusted viewing angle signal based on the feature point distribution to control the unmanned aerial vehicle to rotate in place based on the adjusted viewing angle signal and capture an adjusted real-time image. The device generates a correction route based on a plurality of three-dimensional feature points, the adjusted real-time image, and a sampling number threshold to control the unmanned aerial vehicle to move from an actual position to a predetermined waypoint based on the correction route.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:航點修正方法</p>  
        <p type="p">S801~S807:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="285" publication-number="202612419"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612419.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612419</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134108</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎖固裝置及機箱組件</chinese-title>  
        <english-title>LOCKING DEVICE AND CHASSIS ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">H05K7/12</main-classification>  
        <further-classification edition="200601120241126B">H05K7/18</further-classification>  
        <further-classification edition="200601120241126B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡嘉亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, CHIA-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種機箱組件以及設置於其內的鎖固裝置。鎖固裝置包括本體、鎖定件以及轉動限位件。本體包含第一表面、第二表面及第一端面。第一表面包含容置槽。鎖定件包含位於容置槽中的滑動鎖定部。鎖定件配置以相對於本體沿著第一表面移動。轉動限位件樞接第二表面以相對於本體進行轉動。轉動限位件包含鎖定限位部及止擋部。鎖定限位部配置以在鎖定件相對於本體移動至第一位置時，被滑動鎖定部抵接，致使轉動限位件被鎖定件鎖定，且使止擋部維持凸出於第一端面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to a casing assembly and a locking device disposed therein. The locking device includes a body, a locking component, and a rotating limiting component. The body has a first surface, a second surface, and a first end surface. The first surface includes a recess. The locking component includes a sliding locking portion located at the recess. The locking component is configured to move relative to the body along the first surface. The rotating limiting component is pivotally connected to the second surface to rotate relative to the body. The rotating limiting component includes a locking limiting portion and a stopping portion. The locking limiting portion is configured to be abutted by the sliding locking portion when the locking component moves to a first position relative to the body, so as to make the rotating limiting component be locked and the stopping portion remain protruding from the first end surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鎖固裝置</p>  
        <p type="p">110:本體</p>  
        <p type="p">111:第一表面</p>  
        <p type="p">1110:容置槽</p>  
        <p type="p">1112:缺口</p>  
        <p type="p">1114:內壁</p>  
        <p type="p">1116:第一凹陷區域</p>  
        <p type="p">1118:第二凹陷區域</p>  
        <p type="p">113:第二表面</p>  
        <p type="p">115:第一端面</p>  
        <p type="p">117:第二端面</p>  
        <p type="p">120:鎖定件</p>  
        <p type="p">123:連接部</p>  
        <p type="p">125:柄部</p>  
        <p type="p">127:彈臂部</p>  
        <p type="p">1271:第一凸弧結構</p>  
        <p type="p">1272:第二凸弧結構</p>  
        <p type="p">130:轉動限位件</p>  
        <p type="p">131:鎖定限位部</p>  
        <p type="p">133:止擋部</p>  
        <p type="p">135:把手部</p>  
        <p type="p">151:樞軸件</p>  
        <p type="p">A1:第一軸向</p>  
        <p type="p">A2:第二軸向</p>  
        <p type="p">A3:第三軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="286" publication-number="202611671"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611671.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611671</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134109</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱模組</chinese-title>  
        <english-title>HEAT DISSIPATION MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">G06F1/20</main-classification>  
        <further-classification edition="200601120241126B">F04D25/08</further-classification>  
        <further-classification edition="200601120241126B">F28F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭懿倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種散熱模組，其包括第一鰭片、風扇以及致冷晶片。第一鰭片設置於熱管上。風扇對應第一鰭片設置，並使氣流沿第一方向通過第一鰭片。致冷晶片位於第一鰭片與風扇之間，其中致冷晶片包括相對的冷面和熱面，且冷面或熱面的法向量垂直第一方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a heat dissipation module, which includes a first fin, a fan, and a cooling chip. The first fin is disposed on a heat pipe. The fan is disposed corresponding to the first fin and allow an airflow to pass through the first fin in a first direction. The coolong chip is disposed between the first fin and the fan, in which the cooling chip includes opposite cold surface and hot surface, and a normal vector of the cold surface or the hot surface is perpendicular to the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:散熱模組</p>  
        <p type="p">110:第一鰭片</p>  
        <p type="p">120:熱管</p>  
        <p type="p">130:風扇</p>  
        <p type="p">140:氣流</p>  
        <p type="p">150:致冷晶片</p>  
        <p type="p">152:冷面</p>  
        <p type="p">154:熱面</p>  
        <p type="p">156:法向量</p>  
        <p type="p">160:第二鰭片/散熱鰭片</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="287" publication-number="202610859"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610859.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610859</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134110</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動車充電站之資料處理方法及系統</chinese-title>  
        <english-title>DATA PROCESSING METHODS AND SYSTEMS FOR ELECTRIC VEHICLE CHARGING STATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250102B">B60L53/60</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拓連科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOODOE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　景弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JOHN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉昱廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNG, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳竑霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HONG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電動車充電站之資料處理方法及系統，適用於包括至少第一電動車充電站之一充電場域與透過一網路與第一電動車充電站連接之一伺服器。首先，第一電動車充電站透過網路將相應第一電動車充電站之一充電站資料傳送至伺服器，其中充電站資料具有至少一特定量測資料。接著，伺服器透過網路接收充電站資料、分析充電站資料並且產生相應充電站資料之一第一資料，其中第一資料包括相應充電站資料之一分析結果。伺服器透過網路將第一資料傳送至一行動裝置，致使行動裝置透過一使用者介面顯示相應充電站資料之分析結果，其中第一資料至少包括相應特定量測資料的分析結果的一指示，用以指示是否需對第一電動車充電站執行一調整作業。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Data processing methods and systems for electric vehicle charging stations, applicable to a charging field that includes at least a first electric vehicle charging station and a server connected to the first electric vehicle charging station via a network are provided. First, the first electric vehicle charging station transmits charging station data corresponding to the first electric vehicle charging station to the server through the network, wherein the charging station data includes at least one specific measurement data. Next, the server receives the charging station data through the network, analyzes the charging station data, and generates first data corresponding to the charging station data, wherein the first data includes an analysis result corresponding to the charging station data. The server then transmits the first data to a mobile device through the network, causing the mobile device to display the analysis result corresponding to the charging station data through a user interface. The first data includes at least an indication of the analysis result corresponding to the specific measurement data, which indicates whether an adjustment operation needs to be performed on the first electric vehicle charging station.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S510、S520、S530:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="288" publication-number="202612261"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612261.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612261</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134118</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>功率級電路、自舉電路及驅動方法</chinese-title>  
        <english-title>POWER STAGE CIRCUIT, BOOTSTRAP CIRCUIT AND DRIVING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H03F3/20</main-classification>  
        <further-classification edition="200601120241202B">H03K4/58</further-classification>  
        <further-classification edition="200601120241202B">H03K17/04</further-classification>  
        <further-classification edition="200601120241202B">H02M3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能創半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯聖安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, SHENG-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯柏州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, BO-ZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供功率級電路、自舉電路及驅動方法。功率級電路包含開關電路、驅動電路及自舉電路。開關電路包含低側開關及高側開關，並耦接於切換節點。驅動電路耦接於開關電路，並依據控制訊號驅動低側開關及高側開關交替地導通。自舉電路耦接於開關電路及驅動電路，並包含自舉電容及預充電電路。在低側開關與高側開關皆關斷的期間，自舉電容在其兩端的電壓差低於第一預設限制電壓值時被充電，並在電壓差高於第二預設限制電壓值時放電，以使電壓差維持在預設電壓範圍內。預設電壓範圍由預充電電路中比較電路的兩個不同臨界電壓所決定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a power stage circuit, a bootstrap circuit and a driving method. The power stage circuit includes a switch circuit, a driving circuit and the bootstrap circuit. The switch circuit includes a low-side switch and a high-side switch, and is coupled to a switching node. The driving circuit is coupled to the switch circuit, and is used to drive the low-side switch and the high-side switch to be turned on alternatively according to a control signal. The bootstrap circuit is coupled to the switch circuit and a driving circuit, and includes a bootstrap capacitor and a precharge circuit. During a period that both the low-side switch and the high-side switch are turned off, the bootstrap capacitor is charged when a voltage difference across two terminals thereof is lower than a first preset limit voltage value, and discharges when the voltage difference is higher than a second preset limit voltage value, to maintain the voltage difference within a preset voltage range. The preset voltage range is determined by two different threshold voltages of a comparison circuit in the precharge circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:開關電路</p>  
        <p type="p">13:驅動電路</p>  
        <p type="p">15:自舉電路</p>  
        <p type="p">20:控制電路</p>  
        <p type="p">100:功率級電路</p>  
        <p type="p">131:驅動器</p>  
        <p type="p">151:預充電電路</p>  
        <p type="p">153:預充電電路</p>  
        <p type="p">531:充電開關電路</p>  
        <p type="p">BH:高側緩衝電路</p>  
        <p type="p">BL:低側緩衝電路</p>  
        <p type="p">BT:自舉節點</p>  
        <p type="p">CBT:自舉電容</p>  
        <p type="p">CMP:比較電路</p>  
        <p type="p">COUT:電容元件</p>  
        <p type="p">CS:控制訊號</p>  
        <p type="p">D1:單向導通開關</p>  
        <p type="p">D2:單向導通開關</p>  
        <p type="p">GH:高側驅動訊號</p>  
        <p type="p">GL:低側驅動訊號</p>  
        <p type="p">GND:接地訊號</p>  
        <p type="p">L:電感元件</p>  
        <p type="p">NG,NS:節點</p>  
        <p type="p">NL:負載節點</p>  
        <p type="p">PWM:控制訊號</p>  
        <p type="p">QA:充電開關</p>  
        <p type="p">QH:高側開關</p>  
        <p type="p">QL:低側開關</p>  
        <p type="p">SV:電壓源</p>  
        <p type="p">SW:切換節點</p>  
        <p type="p">VBS:定電壓</p>  
        <p type="p">VCC:電源訊號</p>  
        <p type="p">VEE:電源訊號</p>  
        <p type="p">VIN:輸入訊號</p>  
        <p type="p">VOUT:輸出訊號</p>  
        <p type="p">△VBT:電壓差</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="289" publication-number="202611660"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611660.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611660</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源轉換器</chinese-title>  
        <english-title>POWER CONVERTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250107B">G05F1/565</main-classification>  
        <further-classification edition="200601120250107B">H02M1/14</further-classification>  
        <further-classification edition="200601120250107B">H02M3/156</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力智電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UPI SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅炎國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, YEN-KUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王星翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SING-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉清強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHING-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王燕暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YEN-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡居諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電源轉換器包含第一電路、第二電路及脈衝訊號產生電路。第一電路包含誤差電路及補償電路。誤差電路用以比較輸出電壓及參考電壓以產生誤差訊號。補償電路用以接收誤差訊號並依據誤差訊號產生補償訊號。第二電路包含微分電路、斜坡訊號產生電路及比較器。微分電路接收與輸出電壓相關的回授電壓及補償訊號其中之一者，並對所接收的訊號微分，以產生斜率調整訊號。斜坡訊號產生電路用以接收斜率調整訊號並依據斜率調整訊號產生斜坡訊號。比較器用以產生觸發訊號。脈衝訊號產生電路用以依據觸發訊號及補償訊號產生脈衝訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power converter comprises a first circuit, a second circuit, and a pulse signal generation circuit. The first circuit comprises an error circuit and a compensation circuit. The error circuit is configured to compare the output voltage and the reference voltage to generate an error signal. The compensation circuit is configured to receive the error signal and generate a compensation signal according to the error signal. The second circuit comprises a differentiator circuit, a ramp signal generation circuit, and a comparator. The differentiator circuit receives one of the feedback voltage related to the output voltage and the compensation signal, and differentiates the received signal to generate a slope adjustment signal. The ramp signal generation circuit is configured to receive the slope adjustment signal and generate a ramp signal according to the slope adjustment signal. The comparator is configured to generate a trigger signal. The pulse signal generation circuit is configured to generate a pulse signal according to the trigger signal and the compensation signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電源轉換器</p>  
        <p type="p">10:第一電路</p>  
        <p type="p">11:誤差電路</p>  
        <p type="p">12:補償電路</p>  
        <p type="p">20:第二電路</p>  
        <p type="p">21:微分電路</p>  
        <p type="p">22:斜坡訊號產生電路</p>  
        <p type="p">23:比較器</p>  
        <p type="p">30:脈衝訊號產生電路</p>  
        <p type="p">D:驅動器</p>  
        <p type="p">S&lt;sub&gt;R&lt;/sub&gt;:斜坡訊號</p>  
        <p type="p">S&lt;sub&gt;D&lt;/sub&gt;:斜率調整訊號</p>  
        <p type="p">S&lt;sub&gt;T&lt;/sub&gt;:觸發訊號</p>  
        <p type="p">S&lt;sub&gt;P&lt;/sub&gt;:脈衝訊號</p>  
        <p type="p">S&lt;sub&gt;E&lt;/sub&gt;:誤差訊號</p>  
        <p type="p">V&lt;sub&gt;FSW&lt;/sub&gt;:頻率設定電壓</p>  
        <p type="p">Vref:參考電壓</p>  
        <p type="p">Vc2:補償訊號</p>  
        <p type="p">Vin:輸入電壓</p>  
        <p type="p">Sw1:第一開關</p>  
        <p type="p">Sw2:第二開關</p>  
        <p type="p">L:電感</p>  
        <p type="p">Vo:輸出電壓</p>  
        <p type="p">R&lt;sub&gt;Co&lt;/sub&gt;:等效串聯電阻</p>  
        <p type="p">Co:輸出電容</p>  
        <p type="p">R&lt;sub&gt;L&lt;/sub&gt;:負載電阻</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="290" publication-number="202611515"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611515.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611515</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134120</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可多點施壓和多點溫控之下壓模組及具備該下壓模組之半導體封裝構件測試裝置</chinese-title>  
        <english-title>MULTI-PRESS, MULTI-TEMPERATURE CONTROL WORKPRESS MODULE AND SEMICONDUCTOR PACKAGE COMPONENT TESTING DEVICE EQUIPPED WITH THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G01R1/04</main-classification>  
        <further-classification edition="200601120241007B">G01R1/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>京元電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING YUAN ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳國榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, KUO-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁興岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, HSING-YUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖栢維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, PO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏宏棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, HUNG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種可多點施壓和多點溫控之下壓模組及具備該下壓模組之半導體封裝構件測試裝置，其可對半導體封裝構件上多個晶片同時施加多個大小相同或不同下壓力，並且對該些晶片同時產生相同或不同的溫度控制效果。其中，利用多個下壓力產生單元來驅使多個壓接塊以分別施加下壓力於半導體封裝構件上之該些晶片；且利用壓接塊上各自的溫度調節單元分別對該些晶片加熱或冷卻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-press, multi-temperature control workpress module and a semiconductor packaging component testing device comprising the same are disclosed, wherein the workpress module is capable of simultaneously applying multiple pressures, which may be the same or different, to chips on a semiconductor packaging component, and simultaneously providing the same or different temperature control effects to the chips. The device utilizes a plurality of pressure generating units to drive a plurality of press blocks to apply respective pressures to the chips on the semiconductor packaging component; and utilizes respective temperature regulating units on the press blocks to respectively heat or cool the chips, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:下壓模組</p>  
        <p type="p">2:壓接塊</p>  
        <p type="p">3:下壓力產生單元</p>  
        <p type="p">4:溫度調節單元</p>  
        <p type="p">5:控制器</p>  
        <p type="p">6:力感測單元</p>  
        <p type="p">7:溫度感測單元</p>  
        <p type="p">15:冷卻液供給單元</p>  
        <p type="p">20:監控單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="291" publication-number="202611885"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611885.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611885</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>掃描式顯示裝置</chinese-title>  
        <english-title>SCANNING DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G09F13/30</main-classification>  
        <further-classification edition="200601120241007B">G02B26/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖韋齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種掃描式顯示裝置包括顯示面板、光纖板及掃描式光源模組。顯示面板包括複數個像素區。光纖板包括基板與複數個可撓曲光纖，基板具有複數個透光區，多個可撓曲光纖之入光端分別連接於基板之多個透光區，多個可撓曲光纖之出光端分別連接於顯示面板之多個像素區。掃描式光源模組包括掃描控制單元與發光單元，發光單元發出光線，光線照射至基板的入光面以形成入射點，掃描控制單元持續改變光線在入光面的入射位置，使入射點沿掃描路徑移動，且入射點沿掃描路徑的移動過程中，入射點的位置依序對應至基板之全部或部分的透光區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A scanning display device includes a display panel, an optical fiber board and a scanning light source module. The display panel includes a plurality of pixel areas. The optical fiber board includes a substrate and a plurality of flexible optical fibers. The substrate has a plurality of light-transmitting areas. The light-input ends of the flexible optical fibers are respectively connected to the light-transmitting areas of the substrate. The light-emitting ends of the flexible optical fibers connected to the pixel areas of the display panel respectively. The scanning light source module includes a scanning control unit and a light-emitting unit. The light-emitting unit emits light, and the light is irradiated to the incident surface of the substrate to form an incident point. The scanning control unit continuously changes the incident position of the light on the incident surface, so that the incident point moves along the scanned path, and during the moving process of the incident point along the scanned path, the position of the incident point corresponds to the whole or a part of the light-transmitting areas of the substrate in sequence.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:掃描式顯示裝置</p>  
        <p type="p">10:顯示面板</p>  
        <p type="p">20:光纖板</p>  
        <p type="p">21:基板</p>  
        <p type="p">23:入光面</p>  
        <p type="p">24:出光面</p>  
        <p type="p">25:可撓曲光纖</p>  
        <p type="p">251:入光端</p>  
        <p type="p">252:出光端</p>  
        <p type="p">30:掃描式光源模組</p>  
        <p type="p">31:掃描控制單元</p>  
        <p type="p">35:發光單元</p>  
        <p type="p">36:紅光發射件</p>  
        <p type="p">37:綠光發射件</p>  
        <p type="p">38:藍光發射件</p>  
        <p type="p">40:光學擴散板</p>  
        <p type="p">41:光擴散元件</p>  
        <p type="p">50:光耦合元件</p>  
        <p type="p">L1:光線</p>  
        <p type="p">A:箭號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="292" publication-number="202611674"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611674.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611674</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134129</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源供應裝置</chinese-title>  
        <english-title>POWER SUPPLY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G06F1/26</main-classification>  
        <further-classification edition="200601120241202B">G06F13/38</further-classification>  
        <further-classification edition="200601120241202B">G05F1/565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群光電能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHICONY POWER TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓昌霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, CHANG LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊舜旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHUN HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電源供應裝置包括Type-C連接埠、控制器、第一電阻、第二電阻、偵測開關以及供電開關。Type-C連接埠包括通道組態接腳、邊帶使用接腳以及電源輸出接腳。控制器控制偵測開關導通，使工作電壓提供至第二電阻與第一電阻進行邊帶使用接腳與接地端之間的第一電壓以及通道組態接腳與接地端之間的第二電壓的檢測。控制器根據第一電壓或第二電壓大小，導通或關斷供電開關，以控制供電電壓是否傳送至電源輸出接腳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power supply device includes a Type-C connection port, a controller, a first resistor, a second resistor, a detection switch, and a power-supply switch. The Type-C connection port includes a channel configuration pin, a sideband use pin, and a power-output pin. The controller controls the detection switch to be turned on so that a work voltage is provided to the second resistor and the first resistor to detect a first voltage between the sideband use pin and a ground and detect a second voltage between the channel configuration pin and the ground. The controller turns on or turns off the power-supply switch according to the first voltage and the second voltage to control whether a power-supply voltage is transmitted to the power-output pin.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:Type-C連接埠</p>  
        <p type="p">20:控制器</p>  
        <p type="p">30:第一電阻</p>  
        <p type="p">40:第二電阻</p>  
        <p type="p">50:偵測開關</p>  
        <p type="p">60:供電開關</p>  
        <p type="p">VBUS:電源輸出接腳</p>  
        <p type="p">CC:通道組態接腳</p>  
        <p type="p">SBU:邊帶使用接腳</p>  
        <p type="p">P1:第一路徑</p>  
        <p type="p">P2:第二路徑</p>  
        <p type="p">Vbus:供電電壓</p>  
        <p type="p">V&lt;sub&gt;DD&lt;/sub&gt;:工作電壓</p>  
        <p type="p">V&lt;sub&gt;SBU&lt;/sub&gt;:第一電壓</p>  
        <p type="p">V&lt;sub&gt;CC&lt;/sub&gt;:第二電壓</p>  
        <p type="p">S&lt;sub&gt;C50&lt;/sub&gt;:偵測控制信號</p>  
        <p type="p">S&lt;sub&gt;C60&lt;/sub&gt;:供電控制信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="293" publication-number="202611720"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611720.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611720</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134130</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR INFORMATION PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G06F11/30</main-classification>  
        <further-classification edition="200601120250102B">G06F11/34</further-classification>  
        <further-classification edition="202501120250102B">G06F11/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣大哥大股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃郁凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮柏森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUAN, PO-SEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁思淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUEN, SZU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資訊處理方法包含以下步驟:根據偵測相關資訊，從應用系統下載應用系統日誌，並判斷應用系統日誌是否包含風險資訊；以及當判斷應用系統日誌包含風險資訊時，透過人工智慧模型找出產生風險資訊的程式及在程式中的用以產生風險資訊的程式片段，並註解化在程式中的程式片段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An information processing system includes the following steps of: downloading an application system log from an application system, and determining whether the application system log includes risk information, according to detection associated information; and finding a program generating risk information and a program segment configured to generate risk information in the program, and commenting the program segment in the program out, through an artificial intelligence model, when determining that the application system log includes the risk information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:運作方法</p>  
        <p type="p">310~380:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="294" publication-number="202610706"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610706.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610706</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134139</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>仿生動物</chinese-title>  
        <english-title>BIONIC ANIMAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240924B">A63H13/02</main-classification>  
        <further-classification edition="200601120240924B">A63H29/22</further-classification>  
        <further-classification edition="200601120240924B">A63H29/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>先鋒材料科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIONEER MATERIAL PRECISION TECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃偉煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉禮源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, LI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉欽宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張昌祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHANG-QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種仿生動物，包含一軀體、一頭部、一頸部、複數個關節線盤、複數條關節驅動線以及複數個關節驅動機構。頸部包含一基座、複數個第一關節以及一第二關節。基座設置於軀體上。複數個第一關節相互樞接。第二關節固定於頭部。複數個關節線盤設置於軀體上。複數條關節驅動線捲繞於複數個關節線盤，且連接於複數個第一關節與第二關節。複數個關節驅動機構設置於軀體中，且連接於複數個關節線盤。複數個關節驅動機構驅動複數個關節線盤轉動，複數個關節線盤拉動複數條關節驅動線，且複數條關節驅動線帶動複數個第一關節與第二關節轉動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bionic animal includes a body, a head, a neck, a plurality of joint reels, a plurality of joint driving wires and a plurality of joint driving mechanisms. The neck includes a base, a plurality of first joints and a second joint. The base is disposed on the body. The first joints are pivotally connected to each other. The second joint is fixed to the head. The joint reels are disposed on the body. The joint driving wires are wound around the joint reels and connected to the first joints and the second joint. The joint driving mechanisms are disposed in the body and connected to the joint reels. The joint driving mechanisms drive the joint reels to rotate, the joint reels pull the joint driving wires, and the joint driving wires drive the first joints and the second joint to rotate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:仿生動物</p>  
        <p type="p">10:軀體</p>  
        <p type="p">12:頭部</p>  
        <p type="p">14:頸部</p>  
        <p type="p">16:臀部</p>  
        <p type="p">18:腳部</p>  
        <p type="p">20:外罩</p>  
        <p type="p">22a,22d:關節線盤</p>  
        <p type="p">24a,24d:關節驅動線</p>  
        <p type="p">30:臀部線盤</p>  
        <p type="p">32:臀部驅動線</p>  
        <p type="p">140:基座</p>  
        <p type="p">142a,142b,142c:第一關節</p>  
        <p type="p">142d:第二關節</p>  
        <p type="p">A1:第一軸</p>  
        <p type="p">A2:第二軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="295" publication-number="202610740"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610740.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610740</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋁合金半連續急冷式鑄造專用擋水環</chinese-title>  
        <english-title>ALUMINUM ALLOY SEMI-CONTINUOUS DIRECT CHILL CASTING WATER WIPER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B22D11/124</main-classification>  
        <further-classification edition="200601120241105B">B22D41/005</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庾忠義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石漢正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, HAN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種鋁合金半連續急冷式鑄造專用擋水環，其包含有一第一長側壁、一第二長側壁、一第一短側壁以及一第二短側壁，該第一長側壁與該第二長側壁沿一第一方向延伸且沿一第二方向呈相對設置，該第一短側壁與該第二短側壁沿該第二方向延伸且連接於該第一長側壁與該第二長側壁且沿該第一方向呈相對設置，該第一長側壁的一內側與該第二長側壁的一內側呈波浪狀，該第一長側壁的該內側與該第二長側壁的該內側之間沿該第二方向的一最大間距為H，H為一鋁胚之沿該第二方向之一尺寸（例如該鋁胚之沿該第二方向之一厚度）的0.92~0.98倍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses an aluminum alloy semi-continuous direct chill casting water wiper. The an aluminum alloy semi-continuous direct chill casting water wiper includes a first wide side, a second wide side, a first narrow side and a second narrow side. The first and second wide sides extend along a first direction and are opposite to each other along a second direction. The first and second narrow sides extend along the second direction and are opposite to each other along the first direction. Inner surfaces of the first and second wide sides are formed in wave shapes. A maximum distance between the inner surfaces of the first and second wide sides is H, which is equal to 0.92~0.98 times of a dimension of an aluminum flat ingot or slab along the second direction, e.g., a thickness of the aluminum flat ingot or slab along the second direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鋁合金半連續急冷式鑄造專用擋水環</p>  
        <p type="p">11:第一長側壁</p>  
        <p type="p">111,121,131,141:內側</p>  
        <p type="p">12:第二長側壁</p>  
        <p type="p">13:第一短側壁</p>  
        <p type="p">14:第二短側壁</p>  
        <p type="p">A,B,C,D:波谷</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">H:最大間距</p>  
        <p type="p">W:間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="296" publication-number="202611897"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611897.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611897</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134145</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板</chinese-title>  
        <english-title>DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">G09G3/34</main-classification>  
        <further-classification edition="200601120240926B">G02F1/1333</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀚宇彩晶股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANNSTAR DISPLAY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>焦佑麒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIAO, YU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉丁瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TING WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭舒展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, SHU CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示面板包括第一基板、第二基板、第一配向層、第二配向層、液晶層、第一電極層及第二電極層。第一配向層與第二配向層分別設置在第一基板與第二基板上。液晶層設置在第一配向層與第二配向層之間。第一電極層設置在第一配向層與第一基板之間。第二電極層設置在第二配向層與第二基板之間。第一電極層與第二電極層用於驅動液晶層的多個液晶分子。當第一電極層與第二電極層未被致能時，各個液晶分子的分子長軸與第一基板的基板表面之間的夾角大於9度，且分子長軸在第一基板或第二基板上的正投影平行於第一配向層或第二配向層的配向方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display panel including a first substrate, a second substrate, a first alignment layer, a second alignment layer, a liquid crystal layer, a first electrode layer and a second electrode layer is provided. The first alignment layer and the second alignment layer are respectively disposed on the first substrate and the second substrate. The liquid crystal layer is disposed between the first alignment layer and the second alignment layer. The first electrode layer is disposed between the first alignment layer and the first substrate. The second electrode layer is disposed between the second alignment layer and the second substrate. The first electrode layer and the second electrode layer are used to drive a plurality of liquid crystal molecules of the liquid crystal layer. When the first electrode layer and the second electrode layer are not enabled, an angle between a molecular long axis of each of the liquid crystal molecules and a substrate surface of the first substrate is greater than 9 degrees, and an orthographic projection of the molecular long axis on the first substrate or the second substrate is parallel to an alignment direction of the first alignment layer or the second alignment layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示面板</p>  
        <p type="p">AD1、AD2:配向方向</p>  
        <p type="p">AL1:第一配向層</p>  
        <p type="p">AL2:第二配向層</p>  
        <p type="p">EL1:第一電極層</p>  
        <p type="p">EL2:第二電極層</p>  
        <p type="p">LCL:液晶層</p>  
        <p type="p">LCM:液晶分子</p>  
        <p type="p">MLA:分子長軸</p>  
        <p type="p">PDL:畫素驅動層</p>  
        <p type="p">PX:畫素結構</p>  
        <p type="p">RE:反射電極</p>  
        <p type="p">SP:間隙物</p>  
        <p type="p">SUB1:第一基板</p>  
        <p type="p">SUB1s:基板表面</p>  
        <p type="p">SUB2:第二基板</p>  
        <p type="p">T:主動元件</p>  
        <p type="p">Z:方向</p>  
        <p type="p">θ:夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="297" publication-number="202610715"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610715.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610715</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二氧化碳捕捉系統及其方法</chinese-title>  
        <english-title>CARBON DIOXIDE CAPTURE SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240913B">B01D53/14</main-classification>  
        <further-classification edition="200601120240913B">B01D53/62</further-classification>  
        <further-classification edition="200601120240913B">B01D53/73</further-classification>  
        <further-classification edition="200601120240913B">B01D53/75</further-classification>  
        <further-classification edition="200601120240913B">B01D53/81</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穩碳永續股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACCE BIOTECH COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周士本</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, SHIH-PEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂宜蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾堯宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YAO-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游凱斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, KAI-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉建良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種二氧化碳捕捉系統及其方法，其包含吸收單元、反應單元、及分離單元。吸收單元經配置接收包含二氧化碳的第一氣體及包含胺類化合物的第一液體，以進行氣液接觸，而使胺類化合物吸收第一氣體中的二氧化碳，並形成富含二氧化碳的第二液體。反應單元經配置將鹼性物質加入於第二液體中，使鹼性物質與二氧化碳進行化學反應而形成包含酸氫鹽類化合物的第三液體。分離單元經配置將第三液體進行固液分離，以形成第一固體產物及分離液體。其中第一固體產物包含所述碳酸氫鹽類化合物，並且分離液體包含所述胺類化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A carbon dioxide capture system and method thereof comprising an absorption unit, a reaction unit, and a separation unit. The absorption unit is configured to receive a first gas containing carbon dioxide and a first liquid containing an amine compound for gas-liquid contact, enabling the amine compound to absorb the carbon dioxide from the first gas and form a second liquid that is CO &lt;sub&gt;2&lt;/sub&gt;-riched. The reaction unit is configured to add an alkaline substance to the second liquid, facilitating a chemical reaction between the alkaline substance and the carbon dioxide, thus forming a third liquid containing a bicarbonate compound. The separation unit is configured to perform solid-liquid separation on the third liquid to form a first solid product and a separated liquid. The first solid product contains the bicarbonate compound, and the separated liquid contains the amine compound.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">E:二氧化碳捕捉系統</p>  
        <p type="p">1:吸收單元</p>  
        <p type="p">2:反應單元</p>  
        <p type="p">3:分離單元</p>  
        <p type="p">G1:第一氣體</p>  
        <p type="p">G2:第二氣體</p>  
        <p type="p">L1:第一液體</p>  
        <p type="p">L2:第二液體</p>  
        <p type="p">L3:第三液體</p>  
        <p type="p">Lr:分離液體</p>  
        <p type="p">S1:鹼性物質</p>  
        <p type="p">PS1:第一固體產物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="298" publication-number="202610599"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610599.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610599</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎖緊式固定裝置</chinese-title>  
        <english-title>FASTENING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120240930B">A61B50/20</main-classification>  
        <further-classification edition="201601120240930B">A61B34/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>炳碩生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POINT ROBOTICS MEDTECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昆斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種鎖緊式固定裝置，其包括固定座、支架以及緊固件。固定座包括主基座、限位塊及支撐座。主基座的一側設有安裝部，安裝部具有凹槽。限位塊設置於凹槽中，限位塊具有限位槽。支撐座連接於主基座，並與限位塊相對應。支架包括限位柱，支架通過限位柱設置於限位槽中而組裝於固定座。緊固件設置於支撐座。緊固件抵接於限位柱以固定支架。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fastening device includes a fixing base component, a bracket, and fastener. The fixing base component includes a main base portion, a limiting block portion, and a supporting base portion. The main base portion includes a mounting portion that is disposed at on side thereof. The mounting portion has a slotted hole. The limiting block portion is disposed in the slotted hole and has a limiting groove. The supporting base portion is connected to the main base portion and corresponds to the limiting block portion. The bracket includes a limiting column, and the bracket is assembled on the fixed base component through the limiting column being arranged in the limiting groove. The fastener is disposed on the supporting base portion. The fastener abuts against the limiting column to fix the bracket.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">F:鎖緊式固定裝置</p>  
        <p type="p">1:固定座</p>  
        <p type="p">11:主基座</p>  
        <p type="p">110:安裝孔</p>  
        <p type="p">111:安裝部</p>  
        <p type="p">12:限位塊</p>  
        <p type="p">13:支撐座</p>  
        <p type="p">14:固定件</p>  
        <p type="p">2:支架</p>  
        <p type="p">22:固定銷</p>  
        <p type="p">3:緊固件</p>  
        <p type="p">4:墊圈</p>  
        <p type="p">D1:第一旋轉方向</p>  
        <p type="p">D2:第二旋轉方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="299" publication-number="202611338"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611338.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611338</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134166</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送裝置及鍍覆裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C25D17/00</main-classification>  
        <further-classification edition="200601120250402B">C25D17/06</further-classification>  
        <further-classification edition="200601120250402B">C25D21/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田展也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, NOBUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可簡化整個鍍覆裝置之結構，本發明之搬送裝置700包含：在具有複數個鍍覆模組之鍍覆裝置內用於搬送基板Wf的搬送機構710；安裝於搬送機構710之第一機器手720，且係用於與複數鍍覆模組之各鍍覆模組交接基板Wf的第一機器手720；及安裝於搬送機構710之第二機器手730，且係具有用於清洗配置於各鍍覆模組內之基板Wf及用於饋電至基板Wf的接觸構件之清洗機構740的第二機器手730。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:搬送裝置</p>  
        <p type="p">710:搬送機構</p>  
        <p type="p">712:第一搬送機構</p>  
        <p type="p">713:升降軌道</p>  
        <p type="p">714:第二搬送機構</p>  
        <p type="p">720:第一機器手</p>  
        <p type="p">722:第一支臂</p>  
        <p type="p">730:第二機器手</p>  
        <p type="p">732:第二支臂</p>  
        <p type="p">740:清洗機構</p>  
        <p type="p">Wf:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="300" publication-number="202611631"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611631.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611631</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134167</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓印校正系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G03F7/00</main-classification>  
        <further-classification edition="200601120250512B">B29C51/46</further-classification>  
        <further-classification edition="200601120250512B">B29C59/02</further-classification>  
        <further-classification edition="200601120250512B">G01B11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新竣科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林君懿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種壓印校正系統及方法，包含有一壓印設備、一量測單元、一演算單元、三高度調整裝置及一控制單元，該壓印設備包含相對之一載板與一模板，該載板供承載一壓合物，該壓合物包含一基板及塗佈於基板表面之一高分子材料層，該模板係可移動地設置於載板上方，供施壓於該高分子材料層，使該模板上預設之圖案轉印於高分子材料層，該量測單元係設置於壓印設備一側，供量測該壓合物受壓前、後預定三個量測位置之厚度，該演算單元連接量測單元，係可透過該壓合物受壓前、後三個量測位置厚度之變化運算產生若干補償值，各該高度調整裝置設置於壓印設備並分別連接載板之三個調整位置，可分別運作以改變該載板上各調整位置之高度，該控制單元設置於壓印設備並連接演算單元及各高度調整裝置，係接收該演算單元所傳輸之補償值資訊以驅動預定之高度調整裝置運作，用以調整、校正該載板相對模板之Z軸方向偏差。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:壓印校正系統</p>  
        <p type="p">12:量測單元</p>  
        <p type="p">14:演算單元</p>  
        <p type="p">16:高度調整裝置</p>  
        <p type="p">18:控制單元</p>  
        <p type="p">22:固定座</p>  
        <p type="p">24:量測裝置</p>  
        <p type="p">26:底座</p>  
        <p type="p">28:夾持固定裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="301" publication-number="202612556"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612556.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612556</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件</chinese-title>  
        <english-title>SEMICONDUCTOR ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H20/856</main-classification>  
        <further-classification edition="202501120250102B">H10H20/857</further-classification>  
        <further-classification edition="202501120250102B">H10H20/824</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富采光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENNOSTAR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳詠揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YONG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪孟祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, MENG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張育翎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件，包含有一半導體結構、一接觸結構、一絕緣反射結構以及一反射層。上述半導體結構包含有一第一半導體層、一主動層與一第二半導體層，主動層位於第一半導體層與第二半導體層之間。接觸結構覆蓋第二半導體層並包含有一厚區與複數個薄區，其中於上視觀之，厚區包含一主軸部，主軸部呈連續網格狀，且圍繞各該薄區。絕緣反射結構覆蓋接觸結構並具有複數個絕緣反射結構開口，這些絕緣反射結構開口分別對應暴露厚區。反射層覆蓋絕緣反射結構並填入這些絕緣反射結構開口，反射層經由各絕緣反射結構開口與接觸結構電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor element includes a semiconductor structure, a contact structure, an insulative reflecting structure, and a reflective layer. The semiconductor structure includes a first and second semiconductor layers and an active layer. The active layer is between the first and the second semiconductor layers. The contact structure covers the second semiconductor layer and includes a thick region and a plurality of thin regions. In a top view, the thick region includes a main axial portion shaped in a continuous mesh and surrounding each of the thin regions. The insulative reflecting structure covers the contact structure and includes a plurality of insulative reflecting structure openings. The insulative reflecting structure openings expose the thick portion accordingly and respectively. The reflective layer covers the insulative reflecting structure and fills the insulative reflecting structure openings. The reflective layer electrically connects the contact structure via the the insulative reflecting structure openings each.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體元件</p>  
        <p type="p">10:基板</p>  
        <p type="p">20b’:上表面</p>  
        <p type="p">301:厚區</p>  
        <p type="p">3011:主軸部</p>  
        <p type="p">3012:支部</p>  
        <p type="p">302,302’,302”:薄區</p>  
        <p type="p">322:導電部開孔</p>  
        <p type="p">401:第一組絕緣反射結構開口</p>  
        <p type="p">402:第二組絕緣反射結構開口</p>  
        <p type="p">610:絕緣結構第一開口</p>  
        <p type="p">620:絕緣結構第二開口</p>  
        <p type="p">810:保護結構第一開口</p>  
        <p type="p">820:保護結構第二開口</p>  
        <p type="p">91:第一電極墊</p>  
        <p type="p">92:第二電極墊</p>  
        <p type="p">E1:第一凹陷區域</p>  
        <p type="p">E2:第二凹陷區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="302" publication-number="202610948"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610948.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610948</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134180</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具側向出光模組的流體殺菌裝置</chinese-title>  
        <english-title>FLUID STERILIZATION STRUCTURE WITH LATERAL LIGHT-EMITTING MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120240923B">C02F1/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合鉅光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERGY LIGHTING TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅聖泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, SHENG-TAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佳德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭東泓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, DONG-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種具側向出光模組的流體殺菌裝置，用於一液體，此流體殺菌裝置包括主體及一或複數側向出光模組，主體包含外管及穿設於外管中的內管，外管與內管之間形成有間隔通道，外管延伸有對應間隔通道配置的複數中空管，外管的軸向與各中空管的軸向呈垂直或傾斜配置；側向出光模組穿接於複數中空管中一者，側向出光模組包含對應間隔通道照射的紫外光燈源；其中，液體通過間隔通道時被紫外光燈源照射。藉此，以達到本發明流體殺菌裝置可視間隔通道S的長度或客戶端所需的殺菌效率增減側向出光模組的安裝數量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure is directed to a fluid sterilization structure with lateral light-emitting module applied in a fluid. The fluid sterilization structure includes a main body and at least one lateral light-emitting module. The main body includes an outer tube and an inner tube inserted in the outer tube. The outer tube and the inner tube form a spacer channel is defined between the outer tube and the inner tube. The outer tube extends with a plurality of hollow tubes are extended from the outer tube and disposed correspond to the spacer channels. The axial direction of the outer tube is defined with an axial direction perpendicular or inclined to an axial direction of each of hollow tubes. The lateral light-emitting is inserted in one of the hollow tubes. The lateral light-emitting module includes a UV light source for correspondingly illuminating the spacer channel. The liquid passing through the spacer channel is illuminated by the UV light source. Accordingly, the fluid sterilization structure may be provided with a quantity of lateral light emitting module according to a length of the spacer channel or a required sterilization efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:流體殺菌裝置</p>  
        <p type="p">1:主體</p>  
        <p type="p">11:外管</p>  
        <p type="p">111:中空管</p>  
        <p type="p">12:內管</p>  
        <p type="p">13:入液管</p>  
        <p type="p">14:出液管</p>  
        <p type="p">16:第一蓋板</p>  
        <p type="p">164:分隔件</p>  
        <p type="p">2:側向出光模組</p>  
        <p type="p">22:殼套</p>  
        <p type="p">221:外螺紋</p>  
        <p type="p">24:電源接頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="303" publication-number="202611214"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611214.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611214</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134183</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>不包含聚乳酸的澱粉基生物質複合材料及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241011B">C08L3/02</main-classification>  
        <further-classification edition="200601120241011B">C08L67/02</further-classification>  
        <further-classification edition="200601120241011B">C08L97/02</further-classification>  
        <further-classification edition="200601120241011B">C08K3/34</further-classification>  
        <further-classification edition="200601120241011B">C08K5/5415</further-classification>  
        <further-classification edition="200601120241011B">C08K5/1515</further-classification>  
        <further-classification edition="200601120241011B">C08K5/1539</further-classification>  
        <further-classification edition="200601120241011B">C08J3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴俊榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHUN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關旭強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUAN, HSU-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃淑娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHU-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳貴貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, KUEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴俊榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHUN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關旭強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUAN, HSU-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種不包含聚乳酸的澱粉基生物質複合材料，包含複合物。該複合物包括衍生自生物可降解材料的生物可降解鏈段、植物纖維鏈段及界面改質單元。該生物可降解材料包括生物可分解脂肪族聚酯及澱粉。該界面改質單元包括矽烷鏈段。該矽氧鏈段衍生自矽烷材料。該矽烷材料選自於四乙氧基矽烷、3-胺丙基三甲氧基矽烷、γ-胺丙基三乙氧基矽烷、γ-胺丙基甲基二乙氧基矽烷、γ-甲基丙烯醯氧基丙基三甲氧基矽烷、N-(β-胺乙基)-γ-胺丙基三乙氧基矽烷或雙(3-三甲氧基甲矽烷基丙基)胺。本發明亦提供一種不包含聚乳酸的澱粉基生物質複合材料的製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="304" publication-number="202610661"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610661.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610661</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以增強癌症免疫治療的口服疫苗</chinese-title>  
        <english-title>ORAL VACCINE FOR ENHANCING CANCER IMMUNOTHERAPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250416B">A61K31/7088</main-classification>  
        <further-classification edition="200601120250416B">A61K48/00</further-classification>  
        <further-classification edition="202501120250416B">A61K9/127</further-classification>  
        <further-classification edition="200601120250416B">A61K47/36</further-classification>  
        <further-classification edition="200601120250416B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋信文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, HSING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅柏凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, PO KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張萬安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WAN AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用以增強癌症免疫治療的口服疫苗，包括β-葡聚醣與mRNA的複合體以及脂質奈米微粒，其中mRNA包括腫瘤抗原的編碼區，脂質奈米微粒包裹β-葡聚醣與mRNA的複合體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides an oral vaccine for enhancing cancer immunotherapy, which includes a complex of β-glucan and mRNA and lipid nanoparticles, wherein the mRNA includes the coding region of a tumor antigen, and the lipid nanoparticles wrap the complex of β-glucan and mRNA.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="305" publication-number="202611651"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611651.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611651</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134192</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維加工系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">G05B19/4099</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勁侑投資開發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡侑廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林永昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種三維加工系統，具有由多個拼接單元相互併合構成之承載基座，承載基座上設有多個呈等間距矩陣排列的定位孔，且每一拼接單元用以構成該組設基面之端面分別呈矩形而具有二個等長之第一邊及二個等長之第二邊，而至少一加工裝置用以組設於定位孔上，且加工裝置之加工定位原點與其組設座標間形成有一相對座標距離，並透過一控制單元依據其組設座標定位加工裝置之起始位置，並計算其加工定位原點與組設座標之間的相對座標距離，以可精準地控制加工裝置作動，並可彈性變化及擴充整合不同之加工機台。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:承載基座</p>  
        <p type="p">111:頂面</p>  
        <p type="p">112:底面</p>  
        <p type="p">12:拼接單元</p>  
        <p type="p">13:定位孔</p>  
        <p type="p">14:工作孔</p>  
        <p type="p">15:拼接孔</p>  
        <p type="p">100:組設基面</p>  
        <p type="p">31:加工裝置</p>  
        <p type="p">32:滑移機構</p>  
        <p type="p">321:移動平台</p>  
        <p type="p">41:控制單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="306" publication-number="202611840"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611840.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611840</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134195</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>款項發放檢核方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM OF FUNDS DISBURSEMENT VERIFICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">G06Q40/03</main-classification>  
        <further-classification edition="201201120241101B">G06Q20/38</further-classification>  
        <further-classification edition="201301120241101B">G06F21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財金資訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FINANCIAL INFORMATION SERVICE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪曉雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSIAO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭芳志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, FANG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀穎瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YING-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱柏超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIOU, BOR-CHAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種款項發放檢核系統，包含一儲存有一收款人名單的儲存裝置及一包括一第一檢核模組的伺服器。該第一檢核模組用來獲得一請領人的一待驗證身份識別資訊及一請領帳戶資訊，並判定該收款人名單中是否存在一目標收款人資料。當判定出存在該目標收款人資料時，判定該請領人是否未請領款項。當判定出該請領人未請領款項時，對該請領人進行身份帳戶驗證。當該請領人通過身份帳戶驗證時，傳送一款項發放通知至一發款伺服器，並更新該目標收款人資料的該款項發放結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system of funds disbursement verification includes a storage device storing a payee list and a server including a first verification module. The first verification module is configured to perform the following operations: obtaining a claimant's to-be-verified identification information and an account information; determining whether there is a target payee information in the payee list; determining whether the claimant has not claimed the money when it is determined that the target payee information exists; carrying out an identity account verification of the claimant when it is determined that the claimant has not claimed the money; sending a payment disbursement notification to a payment server when the claimant passes the identity account verification; and updating the payment result of the target payee information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:發放檢核系統</p>  
        <p type="p">11:儲存裝置</p>  
        <p type="p">12:伺服器</p>  
        <p type="p">121:直接入帳模組</p>  
        <p type="p">122:第一檢核模組</p>  
        <p type="p">123:第二檢核模組</p>  
        <p type="p">124:查詢模組</p>  
        <p type="p">2:發款伺服器</p>  
        <p type="p">3:驗證伺服器</p>  
        <p type="p">4:請款伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="307" publication-number="202611617"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611617.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611617</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示模組</chinese-title>  
        <english-title>DISPLAY MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241007B">G02F1/16753</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元太科技工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E INK HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YEN-ZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃振勛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JEN-SHIUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSIN-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示模組，沿堆疊方向依序包括主動層、顯示層、隔絕層、第一膠層、至少一導光層、第二膠層以及至少一透光層。顯示模組還包括第一框膠結構以及第二框膠結構。第一框膠結構配置於第一膠層的周圍，第一框膠結構的黏著力大於第一膠層的黏著力。第二框膠結構配置於第二膠層的周圍，第二框膠結構的黏著力大於第二膠層的黏著力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display module including an active layer, a display layer, an isolation layer, a first adhesive layer, at least one light-guiding layer, a second adhesive layer and at least one light-transmitting layer in order along the stacking direction is provided. The display module also includes a first frame adhesive structure and a second frame adhesive structure. The first frame adhesive structure is arranged around the first adhesive layer. The adhesion force of the first frame adhesive structure is greater than the adhesion force of the first adhesive layer. The second frame adhesive structure is arranged around the second adhesive layer. The adhesion force of the second frame adhesive structure is greater than the adhesion force of the second adhesive layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示模組</p>  
        <p type="p">110:主動層</p>  
        <p type="p">120:顯示層</p>  
        <p type="p">130:隔絕層</p>  
        <p type="p">140:第一膠層</p>  
        <p type="p">150:導光層</p>  
        <p type="p">160:第二膠層</p>  
        <p type="p">170:透光層</p>  
        <p type="p">172:第一子透光層</p>  
        <p type="p">174:第二子透光層</p>  
        <p type="p">176:連接透光膠層</p>  
        <p type="p">210:第一框膠結構</p>  
        <p type="p">220:第二框膠結構</p>  
        <p type="p">230:第三框膠結構</p>  
        <p type="p">D:堆疊方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="308" publication-number="202611499"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611499.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611499</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134200</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＬＥＤ光譜儀檢測裝置及其檢測方法</chinese-title>  
        <english-title>LED SPECTROMETER DETECTION DEVICE AND THE DETECTION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G01N21/27</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞電國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGRONIC INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林加偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政湧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種LED光譜儀檢測裝置及其檢測方法，包含：本體，勻光板，第一透明板，隔板，及檢測裝置。其中，該檢測裝置進一步包含：複數光源發射器，接收器，控制室，固定連結裝置。而該控制裝置更進一步包含：微控制器，記憶單元，顯示單元，電源單元。藉由光源發射器朝勻光板方向發射，順序掃描待測物；當量測光線撞擊到待測物，其反射回來，或繼續前行的光線訊號，由接收器加以接收；然後將訊號送入控制室內的控制裝置之微控制器，藉由演算、比對、分析形成特定的光譜；而微控制器再由記憶單元抓取儲存的光譜資訊進行後續的演算、比對、分析；最後將其結果回存入記憶單元，並輸出至顯示單元，藉以通知操作者。其藉由快速掃描待測物品，據以迅速判定物品是否為異常，除了可以提升檢測速度，提高檢測效率，亦可以增加檢測物品的範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a type of LED spectrometer detection device and the detection method thereof, comprising: a main body, a light homogenizing plate, a first transparent plate, a partition, and a detection device. The detection device further includes: multiple light source emitters, a receiver, a control chamber, and a fixed connection device. Moreover, the control device further includes: a microcontroller, a memory unit, a display unit, and a power unit. The light source emitters emit light towards the light homogenizing plate to sequentially scan the object under test. When the measurement light hits the object, the light signal either reflects back or continues forward, and is received by the receiver. The signal is then sent to the microcontroller in the control device within the control chamber, where it is processed, compared, and analyzed to form a specific spectrum. The microcontroller retrieves stored spectral information from the memory unit for further processing, comparison, and analysis. Finally, the results are stored back into the memory unit and output to the display unit to notify the operator. This enables rapid scanning of the test object, allowing for a quick determination of whether the object is abnormal, thereby improving detection speed, enhancing detection efficiency, and expanding the range of detectable objects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:檢測裝置</p>  
        <p type="p">22:光源發射器</p>  
        <p type="p">24:接收器</p>  
        <p type="p">26:控制室</p>  
        <p type="p">28:固定連結裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="309" publication-number="202610737"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610737.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610737</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134205</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種低耗能處理廢棄物玻璃化的方法</chinese-title>  
        <english-title>A LOW ENERGY CONSUMPTION METHOD FOR VITRIFICATION OF WASTE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241125B">B09B3/40</main-classification>  
        <further-classification edition="202201320241125B">B09B101/30</further-classification>  
        <further-classification edition="202201320241125B">B09B101/35</further-classification>  
        <further-classification edition="202201320241125B">B09B101/15</further-classification>  
        <further-classification edition="202201320241125B">B09B101/65</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鴻文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HON WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鴻文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HON WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種低耗能處理廢棄物玻璃化的方法，該方法特徵，包含：一廢棄物原料，為飛灰、石綿瓦、半導體、醫療等相關廢棄物；一廢棄物原料成分表，由廢棄物原料分析程序得到之成份檢測資料；一調整劑，依據廢棄物原料成分表，在廢棄物原料中添加相應成分的調整劑，以形成可快速熔融特性的被處理物整體物料；一廢棄物之整體物料調整製程，該調整製程是依據廢棄物原料成分表，將廢棄物原料與調整劑，經調配、混合、篩選、造粒、乾燥，形成的被處理物整體物料；一加熱爐，該加熱爐將整體物料經入料加溫熔融，並排出之設備；一玻璃化產出物，由高溫加熱爐排出冷卻處理得到。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for vitrification of waste with low energy consumption, characterized by the following: a waste material, which includes fly ash, asbestos tiles, semiconductor, medical, and other related waste; a waste material composition table, which contains the compositional data of the waste material obtained through an analysis process; an adjusting agent, which is added to the waste material based on the waste material composition table to introduce corresponding components, forming a material with fast melting properties; a process for adjusting the material, where the waste material and adjusting agent are blended, mixed, screened, granulated, and dried according to the waste material composition table; a heating furnace, which heats and melts the material, with equipment to discharge it; and a vitrified product, obtained through cooling treatment after discharge from the high-temperature furnace.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:低耗能處理廢棄物玻璃化的方法</p>  
        <p type="p">11:廢棄物原料</p>  
        <p type="p">12:廢棄物原料分析程序</p>  
        <p type="p">121:成份檢測資料</p>  
        <p type="p">122:廢棄物原料成分表</p>  
        <p type="p">13:廢棄物之整體物料調整製程</p>  
        <p type="p">131:調整劑</p>  
        <p type="p">132:廢棄物原料下料控制器</p>  
        <p type="p">133:調整劑下料控制器</p>  
        <p type="p">134:粉碎混合機</p>  
        <p type="p">135:篩選造粒機</p>  
        <p type="p">136:整體物料</p>  
        <p type="p">14:雙層分離式加熱爐</p>  
        <p type="p">141:外層加熱控制單元</p>  
        <p type="p">142:內層管狀爐體</p>  
        <p type="p">143:進料口</p>  
        <p type="p">144:出料口</p>  
        <p type="p">15:玻璃化產出物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="310" publication-number="202610829"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610829.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610829</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134206</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種提高入射光效的複合層貼膜</chinese-title>  
        <english-title>A COMPOSITE FILM FOR ENHANCING LIGHT TRANSMISSION EFFICIENCY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">B32B27/00</main-classification>  
        <further-classification edition="200601120250102B">B32B3/10</further-classification>  
        <further-classification edition="201801120250102B">C09J7/22</further-classification>  
        <further-classification edition="200601120250102B">C09J201/00</further-classification>  
        <further-classification edition="202501120250102B">H10F77/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鴻文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HON WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鴻文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HON WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種提高入射光效的複合層貼膜，該複合層貼膜由下而上的特徵包含有：一第一黏膠層，可貼合於太陽能電池板玻璃表面，或貼合於太陽能板結構基層之發電晶片層表面，擇一使用；一透光率大於85%的高分子基層，高分子基層底部塗佈第一黏膠層；一表面具有微凸出物結構體，該微凸出物結構體成形於高分子基層之表面；一凸出物體相互間隙溝槽，該溝槽形成於高分子基層之表面；一不沾黏層，該層成形於微凸出物結構體層表面上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composite film for enhancing incident light efficiency is characterized by the following structure from bottom to top: a first adhesive layer, which can either be adhered to the glass surface of a solar panel or to the surface of the power-generating chip on the structural substrate of the solar panel, with one of these options being used; a polymer substrate with a light transmittance greater than 85%, where the first adhesive layer is applied to the bottom of the polymer substrate; micro-protrusion structures formed on the surface of the polymer substrate; gaps between the protrusions forming grooves on the surface of the polymer substrate; and a non-stick layer formed on the surface of the micro-protrusion structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:複合層貼膜</p>  
        <p type="p">2:第一黏膠層</p>  
        <p type="p">21:發電晶片層</p>  
        <p type="p">22:第二黏膠層</p>  
        <p type="p">23:太陽能板結構基層</p>  
        <p type="p">3:高分子基層</p>  
        <p type="p">4:微凸出物結構體</p>  
        <p type="p">41:錐形體斜面</p>  
        <p type="p">42:錐形體上平臺</p>  
        <p type="p">43:微凸出物相互間隙溝槽</p>  
        <p type="p">5:不沾黏層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="311" publication-number="202612179"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612179.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612179</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134213</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電力線材及其導體組件</chinese-title>  
        <english-title>POWER CABLE AND CONDUCTOR ASSEMBLY THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241105B">H01R12/72</main-classification>  
        <further-classification edition="200601120241105B">H01R13/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳必琪國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JESS-LINK PRODUCTS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張旭峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSU FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YU-CHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種導體組件，其用於一電力線材，導體組件包含一第一導電片及一第二導電片。第一導電片包含複數第一端子及一第一滑軌結構，且該些第一端子並列配置。第二導電片包含複數第二端子及一第二滑軌結構，且該些第二端子並列配置。第一導電片及第二導電片相疊配置，第一滑軌結構及第二滑軌結構相對接而導引第一導電片及第二導電片相對移動至一預定相對位置。當第一導電片及第二導電片位於預定相對位置時，該些第一端子及該些第二端子穿插排列。第一導電片及第二導電片分別設有第一滑軌結構及第二滑軌結構且第一導電片及第二導電片可以藉由第一滑軌結構及第二滑軌結構相對接而便於組裝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure is directed to a conductor assembly for a power cable. The conductor assembly has a first conductive piece and a second conductive piece. The first conductive piece has a plurality of first terminals and a first rail structure, and the first terminals are arranged in parallel. The second conductive piece has a plurality of second terminals and a second rail structure, and the second terminals are arranged in parallel. The first conductive piece and the second conductive piece are stacked with each other, and the first rail structure and the second rail structure are engaged with each other to guide the first conductive piece and the second conductive piece to relatively move to a predetermined relative position. When the first conductive piece and the second conductive piece are at the predetermined relative position, the first terminals and the second terminals are arranged alternately. The first conductive piece and the second conductive piece can be assembled via the first rail structure and the second rail structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:導體組件</p>  
        <p type="p">11:卡勾</p>  
        <p type="p">32:第二導線</p>  
        <p type="p">100:第一導電片</p>  
        <p type="p">101:第一滑軌結構</p>  
        <p type="p">102:第一止擋部</p>  
        <p type="p">110:第一端子</p>  
        <p type="p">200:第二導電片</p>  
        <p type="p">201:第二滑軌結構</p>  
        <p type="p">202:第二止擋部</p>  
        <p type="p">210:第二端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="312" publication-number="202610892"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610892.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610892</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>跨騎型車輛</chinese-title>  
        <english-title>STRADDLE-TYPE VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120241126B">B62M6/90</main-classification>  
        <further-classification edition="201001120241126B">B62M6/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANYANG MOTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃亮誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LIANG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱松德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, SUNG-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種跨騎型車輛，包括一電池盒、一電池、一電池盒蓋、一車架、一限位單元以及一盒蓋鎖定單元。電池適於被置於該電池盒之中。電池盒蓋樞接該電池盒並適於覆蓋該電池，以對該電池提供限位。車架包括一橫桿。限位單元設置於該橫桿之上。盒蓋鎖定單元設置於該電池盒蓋，其中，該盒蓋鎖定單元包括一握把件以及一卡勾，該握把件以可轉動的方式連接電池盒蓋，該握把件適於將卡勾於一第一方位以及第二方位之間轉動，當該卡勾位於該第一方位時，該卡勾卡合該限位單元，當該卡勾位於該第二方位時，該卡勾脫離該限位單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A straddle-type vehicle is provided. The straddle-type vehicle includes a battery box, a battery, a battery box cover, a frame, a limiting unit, and a cover locking unit. The battery is adapted to be placed within the battery box. The battery box cover is pivotally connected to the battery box and is adapted to cover the battery, providing a limiting function for the battery. The frame includes a crossbar. The limiting unit is arranged on the crossbar. The cover locking unit is arranged on the battery box cover, wherein the cover locking unit includes a handle component and a latch hook. The handle component is rotatably connected to the battery box cover and is adapted to rotate the latch hook between a first position and a second position. When the latch hook is in the first position, it engages with the limiting unit; when the latch hook is in the second position, it disengages from the limiting unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:電池盒</p>  
        <p type="p">12:電池盒蓋</p>  
        <p type="p">2:電池</p>  
        <p type="p">3:車架</p>  
        <p type="p">31:橫桿</p>  
        <p type="p">4:限位單元</p>  
        <p type="p">5:盒蓋鎖定單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="313" publication-number="202611676"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611676.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611676</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134223</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安全機制電路及主機板</chinese-title>  
        <english-title>SAFETY MECHANISM CIRCUIT AND MOTHERBOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G06F1/28</main-classification>  
        <further-classification edition="200601120241202B">G06F11/30</further-classification>  
        <further-classification edition="200601120241202B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣達電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTA COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉金裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倪明宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NI, MING-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊恭彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, KUNG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種安全機制電路，設置於一主機板中。主機板包括一連接器，用以連接一功能模塊。安全機制電路包括一偵測電路、一控制電路以及一操作電路。當功能模塊連接連接器，並且一特定功能被開啟時，控制電路設定特定節點的電壓位準為一設定位準。當接觸端的電壓位準不等於一預設位準時，偵測電路設定特定節點的電壓位準不為設定位準，並且操作電路執行一安全動作。當接觸端的電壓位準等於預設位準時，操作電路不執行安全動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A safety mechanism circuit disposed in a motherboard which includes a connector to be coupled to a function board is provided. The safety mechanism circuit includes a detection circuit, a control circuit, and an operating circuit. When the function board is coupled to the connector and a specific function is activated, the control circuit sets the voltage level of a specific node at a setting level. When the voltage level of a contact terminal is not equal to a predetermined level, the detection circuit sets the voltage level of the specific node to not be the setting level and the operating circuit performs a safety operation. When the voltage level of the contact terminal is equal to the predetermined level, the operating circuit stops performing the safety operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:控制系統</p>  
        <p type="p">101A:主機板</p>  
        <p type="p">102:子板</p>  
        <p type="p">110A:安全機制電路</p>  
        <p type="p">111:控制電路</p>  
        <p type="p">112A:偵測電路</p>  
        <p type="p">113:操作電路</p>  
        <p type="p">114:微控制器</p>  
        <p type="p">115:電源電路</p>  
        <p type="p">120A:連接器</p>  
        <p type="p">F1~FN、P1~PN:傳送端</p>  
        <p type="p">GND:接地端</p>  
        <p type="p">D1、D2:接觸端</p>  
        <p type="p">ND:特定節點</p>  
        <p type="p">Q1、Q2:電晶體</p>  
        <p type="p">R1、R2:電阻</p>  
        <p type="p">VCC、VSS:操作電壓</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">VBA:電源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="314" publication-number="202611431"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611431.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611431</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134224</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保溫管</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">F16L59/065</main-classification>  
        <further-classification edition="200601120241029B">B23K9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>精金企業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>嘉義市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇清峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林時猛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>嘉義市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種保溫管，係應用於流體運輸工程中的管路技術，其要包含有內管體與外管體，該外管體包覆在該內管體外部，並在內、外管體之間維持一真空環境，其中該外管體由二端管單元及中間管段所構成，而該中間管段包含有多數個環管單元，且每一環管單元二端分別設有第一結合環，讓相鄰的環管單元藉由第一結合環相互貼接，並經氬焊結合；如上設計，讓第一結合環在管體上形成強化結構，有效增加外管體強度，進而在工程管路製作上無須採用厚材管件，能有效降低材料成本，使其更符合實用性與安全性的需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:保溫管</p>  
        <p type="p">2:內管體</p>  
        <p type="p">21:管口</p>  
        <p type="p">3:外管體</p>  
        <p type="p">31:端管單元</p>  
        <p type="p">311:開口端緣</p>  
        <p type="p">312:第二結合環</p>  
        <p type="p">32:中間管段</p>  
        <p type="p">321:環管單元</p>  
        <p type="p">3211:第一結合環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="315" publication-number="202611372"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611372.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611372</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134226</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一體成型水槽落水頭結構及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">E03C1/28</main-classification>  
        <further-classification edition="200601120241029B">E03C1/26</further-classification>  
        <further-classification edition="200601120241029B">E03C1/22</further-classification>  
        <further-classification edition="200601120241029B">E03C1/14</further-classification>  
        <further-classification edition="200601120241029B">B21D17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭朝升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭朝升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是提供一種一體成型水槽落水頭結構，主要係藉由一水槽內部形成一槽室，該槽室底部設一基面，及一落水頭，該落水頭內部貫通一落水孔，該落水頭底部中央設一排水口，該排水口外緣設一連結端，該連結端外緣設置一外螺紋，該落水頭係藉由該落水孔環周一體成型設於該水槽之該基面；藉此，本發明藉由該落水頭一體成型於該水槽，可減少落水頭的組裝，以避免該落水頭氣密墊圈氧化而造成漏水，並提升結構安裝性及實用性。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:水槽</p>  
        <p type="p">12:基面</p>  
        <p type="p">20:落水頭</p>  
        <p type="p">21:落水孔</p>  
        <p type="p">23:連結端</p>  
        <p type="p">24:排水口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="316" publication-number="202612118"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612118.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612118</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134233</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>扇出型晶圓級封裝單元</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">H01L23/28</main-classification>  
        <further-classification edition="200601120241126B">H01L23/488</further-classification>  
        <further-classification edition="200601120241126B">H01L21/56</further-classification>  
        <further-classification edition="200601120241126B">H01L21/301</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華東科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALTON ADVANCED ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于鴻祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HONG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古瑞庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, RUEI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種扇出型晶圓級封裝單元包括載板、至少一晶片、介電層、至少一導接線路及外護層；其中各該晶片具有裸晶、多條晶片導接線路、晶片介電層、多個晶片銲墊、晶片第一面及晶片第二面，各該裸晶是能由各該晶片銲墊對外電性連結；其中各該導接線路是先在該介電層的至少一凹槽內填入金屬膏後，再經研磨該金屬膏所成型，且各該導接線路是在該外護層的各開口內形成一銲墊；其中各該晶片能由位於該晶片第二面上的晶片區域的周圍的各該銲墊對外電性連結，以解決現有的扇出型封裝技術在製作各導接線路時易產生較高製造成本且不利於環保的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:扇出型晶圓級封裝單元</p>  
        <p type="p">10:載板</p>  
        <p type="p">11:第一面</p>  
        <p type="p">12:第二面</p>  
        <p type="p">20:晶片</p>  
        <p type="p">30:介電層</p>  
        <p type="p">40:導接線路</p>  
        <p type="p">41:銲墊</p>  
        <p type="p">50:外護層</p>  
        <p type="p">60:凸塊</p>  
        <p type="p">70:錫球</p>  
        <p type="p">80:晶片黏結薄膜</p>  
        <p type="p">2:印刷電路板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="317" publication-number="202610572"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610572.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610572</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134237</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>煮漿機</chinese-title>  
        <english-title>SOYBEAN MILK COOKING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">A47J31/00</main-classification>  
        <further-classification edition="200601120250102B">A47J31/44</further-classification>  
        <further-classification edition="200601120250102B">A47J36/24</further-classification>  
        <further-classification edition="200601120250102B">A47J27/04</further-classification>  
        <further-classification edition="202501120250102B">A23L11/65</further-classification>  
        <further-classification edition="201601120250102B">A23L5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永順利食品機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUNG SOON LIH FOOD MACHINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭瑞臺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, JUI-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種煮漿機，包括：至少一蒸氣加熱單元，各該蒸氣加熱單元設有相互連通之一加熱室、一入漿部、一蒸氣入口及一出漿部；一除泡單元，其可供去除漿液中的氣泡；一導流管，其連接於該至少一蒸氣加熱單元之該出漿部及該除泡單元之間，其包括至少一螺旋延伸之螺旋段；及一壓力閥，其設於該導流管且位於該出漿部及該除泡單元之間，使與該出漿部之間蓄壓至大於或等於一壓力值時才能開啟連通該出漿部及該除泡單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A soybean milk cooking machine is provided, including: at least one steam cooking heater, each steam cooking heater including a heating chamber, a soybean milk inlet portion, a steam inlet and a soybean milk outlet portion which are communicated with one another; a defoaming unit, being for removing bubbles from the soybean milk; a flow conduit, connected between the soybean milk outlet portion of the at least one steam cooking heater and the defoaming unit, the defoaming unit including at least one spiral section extending helically; and a pressure valve, disposed on the flow conduit and positioned between the soybean milk outlet portion and the defoaming unit, wherein when a accumulating pressure between the soybean milk outlet portion and the defoaming unit is equal to or greater than a certain pressure value, the pressure valve opens to allow communication between the soybean milk outlet portion and the defoaming unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:煮漿機</p>  
        <p type="p">10:蒸氣加熱單元</p>  
        <p type="p">15:筒體</p>  
        <p type="p">20:除泡單元</p>  
        <p type="p">21:除泡筒</p>  
        <p type="p">24:排液管</p>  
        <p type="p">31:螺旋段</p>  
        <p type="p">40:壓力閥</p>  
        <p type="p">50:清洗單元</p>  
        <p type="p">51:洗管路</p>  
        <p type="p">52:開關閥體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="318" publication-number="202611402"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611402.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611402</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134238</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充放氣裝置</chinese-title>  
        <english-title>INFLATION AND DEFLATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F04B33/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王孟淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MENG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王孟淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MENG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種充放氣裝置，其包括：一座體及一操作單元。該座體包含有一主體與一封蓋，該主體設有一第一單向閥、一第二單向閥、一第一連通口、一第二連通口與一第三連通口，該封蓋蓋設於該基部且共同圍構出一第一連通氣道與一第二連通氣道，該第一連通氣道連通該第一連通口與該第二單向閥，該第二連通氣道連通該第二連通口與該第三連通口，於該封蓋貫設有至少一貫孔，該至少一貫孔連通該第一單向閥及外界。該操作單元包含有一打氣囊及一洩壓閥，該打氣囊罩設住一該氣閥與該第一連通口地蓋設於該基部以共同圍構出一第一氣室，該洩壓閥罩設住另一該氣閥與該第二連通口地蓋設於該基部以共同圍構出一第二氣室。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An inflation and deflation device is provided, including a base and an operating unit. The base comprises a main body and a lid. The main body is equipped with a first one-way valve, a second one-way valve, a first communication port, a second communication port, and a third communication port. The lid is set on the base and jointly surrounds a first communication airway and a second communication airway. The first communication airway connects the first communication port and the second one-way valve, and the second communication airway connects the second communication port and the third communication port. At least a through hole is provided in the lid, which connects the first one-way valve and the outside world. The operating unit includes an airbag and a pressure relief valve. The airbag covers one of the air valves and the first communication port, and is mounted on the base to collectively form a first air chamber. The pressure relief valve covers the other air valve and the second communication port, and is mounted on the base to collectively form a second air chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第一連通氣道</p>  
        <p type="p">12:第二連通氣道</p>  
        <p type="p">211:第一側</p>  
        <p type="p">212:第二側</p>  
        <p type="p">34:第一導入氣道</p>  
        <p type="p">44:第二導入氣道</p>  
        <p type="p">51:貫孔</p>  
        <p type="p">62:濾網</p>  
        <p type="p">71:打氣囊</p>  
        <p type="p">77:壓件</p>  
        <p type="p">81:第一氣室</p>  
        <p type="p">82:第二氣室</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="319" publication-number="202610900"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610900.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610900</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134239</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包裝機及其封口前之導引機構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B65B43/46</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑨宸工業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JINCHEN INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭智仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡芝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種包裝機及其封口前之導引機構，係主要提供以該封口前之導引機構輔助包裝袋體之協力輸送，確保經填充後的包裝袋體之輸送順暢，且避免該包裝袋體傾倒，以利包裝袋體的開口處行進至一封口裝置來進行封口，其包含有：一第一夾臂，係設有數個滾輪；一第二夾臂，係設有一輸送帶；一樞件，係接設於包裝機的機架上並分別設有二第一樞接處與二第二樞接處，且該第一夾臂與該第二夾臂的一端分別接設於該二第一樞接處；及二致動缸，係分別接設於該第一夾臂、該樞件之間及該第二夾臂、該樞件之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:封口前之導引機構</p>  
        <p type="p">5:計量填充裝置</p>  
        <p type="p">51:機架</p>  
        <p type="p">52:狹道件</p>  
        <p type="p">6:供袋裝置</p>  
        <p type="p">7:取袋裝置</p>  
        <p type="p">8:輸送裝置</p>  
        <p type="p">81:震動輸送台</p>  
        <p type="p">82:主輸送台</p>  
        <p type="p">9:封口裝置</p>  
        <p type="p">102:斜上輸送帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="320" publication-number="202610730"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610730.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610730</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超音波換能器</chinese-title>  
        <english-title>ULTRASONIC TRANSDUCER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">B06B1/06</main-classification>  
        <further-classification edition="200601120241231B">G10K11/00</further-classification>  
        <further-classification edition="200601120241231B">H05K9/00</further-classification>  
        <further-classification edition="200601120241231B">A61B8/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳世達科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QISDA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣富昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, FU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宗謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TSUNG-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種超音波換能器。超音波換能器包括一換能層、一第一匹配層、一第二匹配層以及至少一電路板。換能層用以傳送及接收一超音波。第一匹配層設置於換能層的鄰近於一待測物的一側上。第二匹配層設置於第一匹配層的鄰近於待測物的一側上。電路板設置於換能層上，其中電路板包括複數個訊號線、一接地層及一屏蔽層。訊號線電性連接於換能層。接地層設置於訊號線的外圍。屏蔽層環繞訊號線及接地層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an ultrasonic transducer. The ultrasonic transducer includes a transducing layer, a first matching layer, a second matching layer and at least one circuit board. The transducing layer is used to transmit and receive an ultrasonic wave. The first matching layer is disposed on a side of the transducing layer adjacent to an object to be measured. The second matching layer is disposed on a side of the first matching layer adjacent to the object to be measured. The circuit board is disposed on the transducing layer, and the circuit board includes a plurality of signal lines, a ground layer and a shielding layer. The signal lines are electrically connected to the transducing layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:超音波換能器</p>  
        <p type="p">112:換能層</p>  
        <p type="p">114:第一匹配層</p>  
        <p type="p">114S:接地層</p>  
        <p type="p">116:第二匹配層</p>  
        <p type="p">116S:屏蔽層</p>  
        <p type="p">BML:背膠層</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">OB:待測物</p>  
        <p type="p">SL:訊號線</p>  
        <p type="p">TH1:第一連接部</p>  
        <p type="p">TH2:第二連接部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="321" publication-number="202611440"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611440.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611440</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134243</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清淨除濕機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">F24F3/14</main-classification>  
        <further-classification edition="202101120241126B">F24F3/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣松下電器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA ELECTRIC (TAIWAN) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳順昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊秉軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙瑩錚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃舒暘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種清淨除濕機，包含一機體、一風扇模組、一清淨模組、一除濕模組以及一風門模組。該機體具有位於內部的一主流道、與該主流道連通的一分支清淨流道與一分支除濕流道、位於該主流道末端的一出風口、位於該分支清淨流道末端的一清淨進風口，以及位於該分支除濕流道的一除濕進風口。該風扇模組設於該機體內的該主流道，該風扇模組用以使氣流自該出風口流出。該清淨模組設於該機體的該分支清淨流道。該除濕模組設於該機體的該分支除濕流道。該風門模組設於該機體且具有一風門，該風門位於該分支清淨流道與該分支除濕流道交界處且能在一除濕位置、一清淨位置以及一混合位置之間移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:清淨除濕機</p>  
        <p type="p">1:機體</p>  
        <p type="p">11:主流道</p>  
        <p type="p">12:分支清淨流道</p>  
        <p type="p">13:分支除濕流道</p>  
        <p type="p">14:出風口</p>  
        <p type="p">15:清淨進風口</p>  
        <p type="p">16:除濕進風口</p>  
        <p type="p">2:風扇模組</p>  
        <p type="p">3:清淨模組</p>  
        <p type="p">31:活性碳濾網</p>  
        <p type="p">32:HEPA濾網</p>  
        <p type="p">4:除濕模組</p>  
        <p type="p">5:風門模組</p>  
        <p type="p">51:風門</p>  
        <p type="p">52:驅動馬達</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="322" publication-number="202611596"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611596.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611596</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134253</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抬頭顯示器</chinese-title>  
        <english-title>HEAD UP DISPLAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250106B">G02B27/01</main-classification>  
        <further-classification edition="200601120250106B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業成光電(深圳)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業成科技(成都)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英特盛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連志賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, CHIH-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種抬頭顯示器，包括影像產生模組、第一偏振片、圓偏振片、第二偏振片以及鏡片組。圓偏振片位於影像產生模組與第一偏振片之間。第二偏振片配置為能夠附著於投影介質且面對影像產生模組與第一偏振片的一側。鏡片組配置以將影像產生模組所產生的光線，投射以通過第一偏振片，並使得通過第一偏振片的光線，抵達第二偏振片後被第二偏振片反射。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to a head-up display, which includes an image-generated module, a first polarizer, a circular polarizer, a second polarizer, and a lens group. The circular polarizer is between the image-generated module and the first polarizer. The second polarizer is configured to adhere to a projection medium and face to a side of the image-generated module and the first polarizer. The lens group is configured to make the light generated from the image-generated to pass through the first polarizer, and then arrive at the second polarizer and reflect by the second polarizer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:抬頭顯示器</p>  
        <p type="p">101:影像產生模組</p>  
        <p type="p">103:鏡片組</p>  
        <p type="p">1031:第一鏡片</p>  
        <p type="p">1033:第二鏡片</p>  
        <p type="p">111:第一偏振片</p>  
        <p type="p">113:圓偏振片</p>  
        <p type="p">115:透光散熱膜</p>  
        <p type="p">121:第二偏振片</p>  
        <p type="p">123:投影介質</p>  
        <p type="p">131:影像接收模組</p>  
        <p type="p">133:投影虛像</p>  
        <p type="p">R11:光線</p>  
        <p type="p">R12:雜散光線</p>  
        <p type="p">θ:鈍角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="323" publication-number="202610677"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610677.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610677</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134261</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金柑酵解物的製備方法及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240924B">A61K36/752</main-classification>  
        <further-classification edition="200601120240924B">A61K9/19</further-classification>  
        <further-classification edition="200601120240924B">A61P3/06</further-classification>  
        <further-classification edition="200601120240924B">A61P29/00</further-classification>  
        <further-classification edition="200601120240924B">A61P39/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拜寧騰能生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIONIN BIOTECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀之軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, JHIH-JYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秉叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PING-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃江鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIANG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃雅婕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YA-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳褕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, IU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勝騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHENG-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種金柑酵解物的製備方法，其係包含以下步驟：a. 發酵步驟：將殺菁後的金柑、發酵基質、酵素液投入發酵槽中加以混合，在40℃至75℃的溫度環境中進行發酵，歷時1天至45天，獲得酵解粗產物；b.發酵終止步驟：將該酵解粗產物加熱至沸騰並持續20~60分鐘，再利用分離手段進行固液分離，所得液體即為該金柑酵解物；其中該發酵基質含有發酵基質與酵素混合物，且該發酵基質含有黑糖、酵母菌、和水，以及該酵素混合物含有纖維酶、以及果膠酶。利用該製備方法所得的該金柑酵解物能夠有效地減少臟器及皮下脂肪細胞大小，並達到抗發炎及抗氧化的功效，進而預防或改善代謝性疾病之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="324" publication-number="202610549"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610549.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610549</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用馬達驅動刀具之鳳梨葉移除裝置</chinese-title>  
        <english-title>PINEAPPLE LEAF REMOVING APPARATUS WITH BLADE DRIVEN BY MOTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241119B">A23N15/06</main-classification>  
        <further-classification edition="200601120241119B">F16H55/26</further-classification>  
        <further-classification edition="200601120241119B">B23Q15/013</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晉億實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAVA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瑞益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JUI YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種利用馬達驅動刀具之鳳梨葉移除裝置，包含一桌體單元，在一X方向延伸而具有一長度，在一Y方向延伸而具有一寬度，該X方向與該Y方向互相垂直並構成一XY平面，有一Z方向垂直於該XY平面，該桌體單元有一桌面，該桌面平行於該XY平面，該桌面有二導孔；一刀具單元，有一環形刀片及二導柱，該二導柱的其中一端分別連接於該環形刀片的相對二側，該二導柱分別伸入該二導孔而穿設於該桌面，並使該環形刀片在該Z方向可選擇地移動靠近或遠離該桌面，前述導柱的側面有一齒條部；一驅動單元，有一馬達及一驅動齒輪，該驅動齒輪相切地嚙合於其中一前述導柱的該齒條部，該馬達連接該驅動齒輪並固定於該桌面；使該環形刀片在該Z方向對準一鳳梨欉，並啟動該馬達而帶動該驅動齒輪轉動，當該驅動齒輪轉動時，係使相嚙合的其中一前述導柱在該Z方向移動；藉此連接於該二導柱的環形刀片在Z方向往鳳梨欉的位置移動，而能移除環繞鳳梨莖生長的鳳梨葉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:桌體單元</p>  
        <p type="p">2:刀具單元</p>  
        <p type="p">3:驅動單元</p>  
        <p type="p">31:馬達</p>  
        <p type="p">32:被動齒輪</p>  
        <p type="p">33:驅動齒輪</p>  
        <p type="p">34:護蓋</p>  
        <p type="p">5:供電單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="325" publication-number="202612356"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612356.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612356</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134265</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>活動式麥克風抽氣系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H04R1/12</main-classification>  
        <further-classification edition="200601120241101B">H04R1/04</further-classification>  
        <further-classification edition="200601120241101B">H04R5/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崑山科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUN SHAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李崑池</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUEN CHYR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱維純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, WEI CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種活動式麥克風抽氣系統，包含一夾座，係設有一夾持壁，該夾持壁形成有一夾持空間，該夾持壁內部形成有一流道，該夾座的一端設有一吸入口與該流道相連通，該夾座的另一端設有一排出口與該流道相連通；一過濾單元，係連通該流道，該過濾單元內部係設有至少一過濾層；一抽氣單元，係連通至該過濾單元，該抽氣單元係對於該流道產生一負壓，使得該吸入口產生一吸力。藉以可供對於演講者在演講過程中，所產生的飛沫及氣體進行過濾、殺菌及清毒，以淨化周遭的空氣，藉以確保聽眾的健康。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:夾座</p>  
        <p type="p">11:夾持壁</p>  
        <p type="p">12:夾持空間</p>  
        <p type="p">13:束帶</p>  
        <p type="p">131:黏扣帶</p>  
        <p type="p">15:吸入口</p>  
        <p type="p">151:護網</p>  
        <p type="p">17:管接頭</p>  
        <p type="p">2:過濾單元</p>  
        <p type="p">21:第一氣管</p>  
        <p type="p">22:過濾層</p>  
        <p type="p">23:輸出端</p>  
        <p type="p">3:抽氣單元</p>  
        <p type="p">31:第二氣管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="326" publication-number="202612440"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612440.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612440</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134268</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板提起裝置及其電路板提把組件</chinese-title>  
        <english-title>CIRCUIT BOARD LIFTING DEVICE AND CIRCUIT BOARD HANDLE ASSEMBLY THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">H05K13/00</main-classification>  
        <further-classification edition="200601120241126B">H05K1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊遠章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YUAN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路板提起裝置包含複數個電路板提把組件。電路板提把組件用以可拆卸地組裝於開設有複數個開口之一電路板，並且包含一套筒、一膨脹型卡扣與一推桿。套筒設置有一第一限位結構。膨脹型卡扣穿設於套筒且受第一限位結構所限位，並且包含一連接端部與一膨脹端部。膨脹端部開設至少一狹槽，藉以形成複數個彈性爪。推桿穿設於套筒，並且包含一擠壓端部與一操作端部。操作端部用以在一提起模式下，在膨脹端部穿過開口中之一選定組裝開口後，供使用者操作而使擠壓端部深入狹槽並擠壓彈性爪，藉以使彈性爪擴撐而與選定組裝開口產生干涉，據以利用電路板提把組件將電路板提起。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board handle assembly, designed to be detachably assembled on a circuit board with multiple openings, allowing a user to lift the circuit board, and comprising a sleeve, an expandable latch, and a push rod. The sleeve is equipped with a limiting structure. The expandable latch is inserted through the sleeve and restricted by the limiting structure, and includes a connecting end and an expanding end. The expanding end has at least one narrow slot, forming multiple elastic claws. The push rod is inserted through the sleeve and includes a pressing end and an operating end. The operating end is used in a lifting mode, after the expanding end passes through the opening, for the user to operate, causing the pressing end to enter the narrow slot and squeeze the elastic claws, thereby expanding the elastic claws to interfere with the opening, thus using the circuit board handle assembly to lift the circuit board.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路板提把組件</p>  
        <p type="p">1:套筒</p>  
        <p type="p">11:第一通道</p>  
        <p type="p">12:第一限位結構</p>  
        <p type="p">13:套筒本體</p>  
        <p type="p">131:固定端部</p>  
        <p type="p">132:提起端部</p>  
        <p type="p">1321:翼片</p>  
        <p type="p">133:第一卡扣結構</p>  
        <p type="p">14:限位蓋</p>  
        <p type="p">141:第二卡扣結構</p>  
        <p type="p">2:膨脹型卡扣</p>  
        <p type="p">21:連接端部</p>  
        <p type="p">211:第二通道</p>  
        <p type="p">22:膨脹端部</p>  
        <p type="p">222a,222b:彈性爪</p>  
        <p type="p">3:推桿</p>  
        <p type="p">31:擠壓端部</p>  
        <p type="p">32:操作端部</p>  
        <p type="p">321:第一限位環</p>  
        <p type="p">322:第二限位環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="327" publication-number="202611530"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611530.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611530</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134273</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶粒點測方法</chinese-title>  
        <english-title>METHOD OF PROBING AND TESTING DIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G01R31/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威竣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-JYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種晶粒點測方法，便於一點測機點測一晶圓上之複數晶粒。晶圓上各晶粒彼此交錯排列且各晶粒之邊緣彼此串聯成一直線切割道。晶粒點測方法包含以下步驟，首先，等分各晶粒為二相等區塊。其次，重設點測機之一移動距離，其中該移動距離等於二相等區塊間之一間距。最終，改變點測機之一點測頻率為每移動二個該移動距離後進行一次點測其中之一該些晶粒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for probing and testing dies on a wafer is provided. Each die on the wafer is arranged staggered with each other, and the edges of each die are connected in series to form a straight cutting line. The method comprises the following steps. First, divide each die equally into two equal blocks. Secondly, reset a moving segment of the probing and testing machine, where the moving segment is equal to a distance between the two equal blocks. Finally, the frequency of probing and testing dies is changed so that one of the dies is probed and tested once every time the probing and testing machine moves the moving segment twice.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A、B、C、D、E:晶粒</p>  
        <p type="p">F、G、H、I、J:晶粒</p>  
        <p type="p">K、L、M、N、O:晶粒</p>  
        <p type="p">P、Q、R、S、T:晶粒</p>  
        <p type="p">A&lt;sub&gt;L&lt;/sub&gt;、B&lt;sub&gt;L&lt;/sub&gt;、C&lt;sub&gt;L&lt;/sub&gt;、D&lt;sub&gt;L&lt;/sub&gt;、E&lt;sub&gt;L&lt;/sub&gt;:區塊</p>  
        <p type="p">F&lt;sub&gt;L&lt;/sub&gt;、G&lt;sub&gt;L&lt;/sub&gt;、H&lt;sub&gt;L&lt;/sub&gt;、I&lt;sub&gt;L&lt;/sub&gt;、J&lt;sub&gt;L&lt;/sub&gt;:區塊</p>  
        <p type="p">K&lt;sub&gt;L&lt;/sub&gt;、L&lt;sub&gt;L&lt;/sub&gt;、M&lt;sub&gt;L&lt;/sub&gt;、N&lt;sub&gt;L&lt;/sub&gt;、O&lt;sub&gt;L&lt;/sub&gt;:區塊</p>  
        <p type="p">P&lt;sub&gt;L&lt;/sub&gt;、Q&lt;sub&gt;L&lt;/sub&gt;、R&lt;sub&gt;L&lt;/sub&gt;、S&lt;sub&gt;L&lt;/sub&gt;、T&lt;sub&gt;L&lt;/sub&gt;:區塊</p>  
        <p type="p">A&lt;sub&gt;R&lt;/sub&gt;、B&lt;sub&gt;R&lt;/sub&gt;、C&lt;sub&gt;R&lt;/sub&gt;、D&lt;sub&gt;R&lt;/sub&gt;、E&lt;sub&gt;R&lt;/sub&gt;:區塊</p>  
        <p type="p">F&lt;sub&gt;R&lt;/sub&gt;、G&lt;sub&gt;R&lt;/sub&gt;、H&lt;sub&gt;R&lt;/sub&gt;、I&lt;sub&gt;R&lt;/sub&gt;、J&lt;sub&gt;R&lt;/sub&gt;:區塊</p>  
        <p type="p">K&lt;sub&gt;R&lt;/sub&gt;、L&lt;sub&gt;R&lt;/sub&gt;、M&lt;sub&gt;R&lt;/sub&gt;、N&lt;sub&gt;R&lt;/sub&gt;、O&lt;sub&gt;R&lt;/sub&gt;:區塊</p>  
        <p type="p">P&lt;sub&gt;R&lt;/sub&gt;、Q&lt;sub&gt;R&lt;/sub&gt;、R&lt;sub&gt;R&lt;/sub&gt;、S&lt;sub&gt;R&lt;/sub&gt;、T&lt;sub&gt;R&lt;/sub&gt;:區塊</p>  
        <p type="p">R1、R2、R3、R4:行列</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="328" publication-number="202612552"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612552.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612552</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134274</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光二極體及其製造方法</chinese-title>  
        <english-title>LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H20/824</main-classification>  
        <further-classification edition="202501120250102B">H10H20/856</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡景元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭鴻達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HONG-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAO-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種發光二極體及其製造方法，發光二極體包含一基板、一反射鏡層、一磊晶複合層及複數個導電栓。其中反射鏡層設置於基板上，磊晶複合層具有一四元化合物半導體層，四元化合物半導體層直接接觸並電性連接反射鏡層，且四元化合物半導體層與反射鏡層間無介電材料。複數個導電栓合金擴散於四元化合物半導體層中且不突出於四元化合物半導體層之上表面，並與反射鏡層間形成歐姆接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light-emitting diode and a manufacturing method thereof are provided. The light-emitting diode includes a substrate, a reflective mirror layer, an epitaxial composite layer and a plurality of conductive plugs. The reflective mirror layer is disposed on the substrate, and the epitaxial composite layer has a light-emitting layer and a quaternary compound semiconductor layer. The quaternary compound semiconductor layer directly contacts and electrically connects the reflective mirror layer. There is no dielectric material between the quaternary compound semiconductor layer and the reflective mirror layer. The plurality of conductive plug are diffusely alloyed within the quaternary compound semiconductor layer and do not protrude above the upper surface of the quaternary compound semiconductor layer, and form ohmic contact with the reflective mirror layer. The plurality of conductive plugs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:N型砷化銦鎵(InGaAs)磊晶層</p>  
        <p type="p">103:第一化合物半導體層</p>  
        <p type="p">104:發光層</p>  
        <p type="p">105:第二化合物半導體層</p>  
        <p type="p">106:四元化合物半導體層</p>  
        <p type="p">110:磊晶複合層</p>  
        <p type="p">120:導電栓</p>  
        <p type="p">130:反射鏡層</p>  
        <p type="p">140:永久基板</p>  
        <p type="p">150:上部電極</p>  
        <p type="p">200:發光二極體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="329" publication-number="202611396"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611396.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611396</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可變換葉形之風力發電葉片裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">F03D3/02</main-classification>  
        <further-classification edition="200601120241126B">F03D3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德禮實業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林國尊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUO-TSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可變換葉形之風力發電葉片裝置，包含一支撐架、一固定旋轉環、一可動旋轉環及複數葉片。該固定旋轉環與該可動旋轉環沿一軸線之方向間隔設置於該支撐架，該可動旋轉環可相對於該固定旋轉環沿該軸線之方向來回移動，並可相對於該固定旋轉環繞該軸線轉動。該等葉片為可撓性材質，每一葉片之兩端分別連接該固定旋轉環與該可動旋轉環。藉此，可根據風力的大小而調整該可動旋轉環相對於該固定旋轉環的距離及角度，以改變該等葉片彎曲的弧度與扭轉的角度，如此，可在風速過大時降低受風面積，以避免因轉速過快而毀損。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:支撐架</p>  
        <p type="p">3:套筒模組</p>  
        <p type="p">31:固定旋轉環</p>  
        <p type="p">32:套筒</p>  
        <p type="p">33:軸承</p>  
        <p type="p">4:可動旋轉環</p>  
        <p type="p">5:葉片</p>  
        <p type="p">51:第一端</p>  
        <p type="p">52:第二端</p>  
        <p type="p">L:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="330" publication-number="202611407"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611407.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611407</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134281</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吊扇及吊扇牆控系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240913B">F04D25/08</main-classification>  
        <further-classification edition="200601120240913B">F04D27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德禮實業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林國尊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUO-TSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種吊扇牆控系統，包含一吊扇牆控裝置，及一經由一電力線電連接該吊扇牆控裝置的吊扇。該吊扇牆控裝置根據使用者之操作而將一市電信號調整為一電力信號，並於符合一設定條件時，藉由該電力信號輸出一接管訊息。該吊扇經由該電力線接收該電力信號並產生一對應的電力控制信號、接收一遙控信號並產生一對應的遙控控制信號。該吊扇接收該電力信號作為電源，並根據該電力控制信號判斷是否接收到一接管訊息，於判斷未接收到該接管訊息時，根據該遙控控制信號進行控制，於判斷接收到該接管訊息後，根據該電力控制信號進行控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:吊扇</p>  
        <p type="p">21:控制單元</p>  
        <p type="p">211:偵測模組</p>  
        <p type="p">212:遙控電路</p>  
        <p type="p">213:控制器</p>  
        <p type="p">22:驅動單元</p>  
        <p type="p">221:驅動控制電路</p>  
        <p type="p">222:馬達</p>  
        <p type="p">24:燈件組</p>  
        <p type="p">3:吊扇牆控裝置</p>  
        <p type="p">31:距離感測模組</p>  
        <p type="p">32:操控介面模組</p>  
        <p type="p">33:遙控模組</p>  
        <p type="p">34:控制模組</p>  
        <p type="p">61:電力線</p>  
        <p type="p">7:遙控器</p>  
        <p type="p">8:行動裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="331" publication-number="202612252"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612252.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612252</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134283</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電氣角檢測方法及裝置</chinese-title>  
        <english-title>METHODS AND DEVICES FOR ELECTRICAL ANGLE DETECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241007B">H02P21/32</main-classification>  
        <further-classification edition="201601120241007B">H02P25/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>士林電機廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIHLIN ELECTRIC &amp; ENGINEERING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余翊禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝鎮洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電氣角檢測方法及裝置，用於在電器角檢測裝置中檢測伺服電機之動子當前的電氣角，電器角檢測裝置包括控制單元、輸入單元、檢測單元及記錄單元，該電氣角檢測方法包括以下步驟：(a) 控制單元控制輸入單元將一目標電氣角及一q軸電流輸入伺服電機；(b)在一輸入時間後，控制單元控制檢測單元檢測伺服電機的動子的移動方向，控制單元控制記錄單元記錄伺服電機的動子的移動方向，其中移動方向為+、−或0，分別代表伺服電機的動子朝一正方向移動、朝一負方向移動以及不移動；以及(c) 控制單元根據在記錄單元中伺服電機的動子的移動方向，判斷是否繼續電氣角檢測：當在記錄單元中伺服電機的動子移動方向為+或−時，控制單元控制輸入單元改變目標電氣角，並重複步驟(b)，當在記錄單元中伺服電機的動子移動方向為0時，控制單元控制輸入單元停止電氣角檢測，並控制單元控制記錄單元記錄目標電氣角。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110,120,130,132,134:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="332" publication-number="202612306"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612306.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612306</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134284</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料處理裝置、資料安全傳輸系統與資料安全傳輸方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H04L9/08</main-classification>  
        <further-classification edition="200601120250102B">H04L9/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣海洋大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN OCEAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王榮華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JUNG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳振耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴易鍾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉箐茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種資料處理裝置，用於獲取經訓練後的加密資料處理模型的複數個相關參數，並使用經訓練後的加密資料處理模型根據第一加密資料產生第一加密處理資料，以及提供第一金鑰資料，其中第一加密處理資料關聯於第一加密資料之第一未加密資料經特定處理後的第一未加密處理資料，加密資料處理模型為類神經網路，以及複數個相關參數為經訓練後之類神經網路的複數個權重參數。第一加密處理資料與第一加密資料較佳地可以分別採用不同加密規格，藉此可以增加資料傳輸時的安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資料接收端</p>  
        <p type="p">11:資料處理裝置</p>  
        <p type="p">111:加密資料處理模組</p>  
        <p type="p">112:加密資料處理模型訓練模組</p>  
        <p type="p">2:資料傳送端</p>  
        <p type="p">21:加密裝置</p>  
        <p type="p">3:資料庫</p>  
        <p type="p">4:用戶終端裝置</p>  
        <p type="p">ED:第一加密資料</p>  
        <p type="p">ED':第二加密資料</p>  
        <p type="p">FD:第一加密處理資料</p>  
        <p type="p">FD':第二加密處理資料</p>  
        <p type="p">I:特定資訊</p>  
        <p type="p">K:第一金鑰資料</p>  
        <p type="p">P:相關參數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="333" publication-number="202611140"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611140.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611140</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134287</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降冰片烯衍生共聚物的製造方法，降冰片烯衍生共聚物及其用途</chinese-title>  
        <english-title>A METHOD TO PREPARE CO-POLY(NORBORNENE) DERIVATIVES AND THEIR APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240919B">C08F232/02</main-classification>  
        <further-classification edition="200601120240919B">C08J3/24</further-classification>  
        <further-classification edition="200601120240919B">C08J5/18</further-classification>  
        <further-classification edition="200601120240919B">C08F2/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣中油股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CPC CORPORATION, TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊高樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, KAO-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JYH-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳致葦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱則瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TSE-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIA-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JUI-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種降冰片烯衍生共聚物的製造方法，包含製備步驟、聚合步驟、沉澱步驟、還原步驟及製膜步驟，其中該製備步驟係製備5-(溴丙基)雙環[2.2.1]庚-2-烯的無水二氯甲烷溶液作為第一溶液，製備5-丁基雙環[2.2.1]庚-2-烯的無水二氯甲烷溶液第二溶液及製備[1,3-雙(2,4,6-三甲基苯基)-2-亞咪唑啉]二氯(苯基亞甲基)雙(3-溴吡啶)釕(II)的無水二氯甲烷溶液作為第三溶液；該聚合步驟係以第一方式、第二方式或第三方式將該第一溶液、該第二溶液及該第三溶液混合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method for prepare co-poly(norborene) derivatives, comprising a preparation step, a polymerization step, a precipitation step, a reduction step and a film formation step wherein the preparation step preparing a first solution of 5-(bromopropyl)bicyclo[2.2.1]hept-2-ene in anhydrous dichloromethane, preparing a second solution of 5-butylbicyclo[2.2.1]hept-2-ene in anhydrous dichloromethane, and preparing a third solution of [1,3-bis(2,4,6-trimethylphenyl)-2-imidazolinyl]dichloride(benzylidene)bis(3-bromopyridine)ruthenium(II) in anhydrous dichloromethane, the polymerization step mixing the first solution, the second solution, and the third solution by using either a first method, a second method, or a third method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:製備步驟</p>  
        <p type="p">S2:整合步驟</p>  
        <p type="p">S3:沉澱步驟</p>  
        <p type="p">S4:還原步驟</p>  
        <p type="p">S5:製膜步驟</p>  
        <p type="p">S6:離子交換步驟</p>  
        <p type="p">M1:第一方式</p>  
        <p type="p">M2:第二方式</p>  
        <p type="p">M3:第三方式</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="334" publication-number="202611655"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611655.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611655</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134292</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動導引車整合與決策系統及其運作方法</chinese-title>  
        <english-title>AUTOMATED GUIDED VEHICLE INTEGRATION AND DECISION-MAKING SYSTEM AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241105B">G05D1/43</main-classification>  
        <further-classification edition="200601120241105B">B65G35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華精測科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA PRECISION TEST TECH. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李幃閎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEI HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, CHIA YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊倬昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHO YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動導引車整合與決策系統及其運作方法，其中，自動導引車整合與決策系統包含：自動導引車，被配置為在工作場域內執行派發行程；前端設備，被配置為在工作場域內與自動導引車協作，前端設備產生前端運作資料；上位系統，儲存有工單及產品資訊以及輸出生產訊號；以及自動導引車後台，與上位系統、前端設備以及自動導引車通訊連接，自動導引車後台被配置為整合前端運作資料以及生產訊號向自動導引車輸出派發行程；自動導引車還被配置為在一製程的結束時間點後至自動導引車離開該製程之前，根據派發行程更新所執行的任務。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automatic guided vehicle integration and decision-making system and an operating method thereof, wherein the automatic guided vehicle integration and decision-making system includes: an automatic guided vehicle configured to perform a dispatch trip in a work site; a front-end device configured to collaborating with the automated guided vehicle in the workplace, the front-end equipment generates front-end operation data; the upper-level system stores work orders and product information and outputs production signals; and the automated guided vehicle backend connects with the upper-level system, front-end equipment, and automated guided vehicle. The automatic guided vehicle backend is configured to integrate front-end operation data and production signals to output and dispatch schedules to the automatic guided vehicle. The automated guided vehicle is further configured to update the tasks performed according to the dispatch schedule after the end time point of a process and before the automated guided vehicle leaves the process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:前端設備</p>  
        <p type="p">20:自動導引車</p>  
        <p type="p">30:自動導引車後台</p>  
        <p type="p">40:上位系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="335" publication-number="202611611"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611611.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611611</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134299</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示結構及其製造方法</chinese-title>  
        <english-title>DISPLAY STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">G02F1/1337</main-classification>  
        <further-classification edition="200601120241126B">G02F1/1335</further-classification>  
        <further-classification edition="200601120241126B">G02F1/1333</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀚宇彩晶股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANNSTAR DISPLAY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳映蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉政諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高翎誌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, LING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張少謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHAO-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱靖雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, JING-YA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅祈恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, QI-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示結構及其製造方法，顯示結構由多個畫素區域組成，每一畫素區域包括一基板、一電子元件層、一保護層、一反射層、一配向膜及一液晶層，配向膜具有一配向方向，液晶層包含多個液晶分子，反射層在遠離保護層的一上表面具有多條微配向結構，鄰近多條微配向結構的液晶分子被迫沿著多條微配向結構的一斜面傾倒，使多個液晶分子朝不同於配向膜的配向方向進行排列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display structure and a manufacturing method thereof are provided. The display structure is formed by a plurality of pixel areas. Each pixel area includes a substrate, an electronic component layer, a protective layer, a reflective layer, an alignment film, and a liquid crystal layer. The alignment film has an alignment direction, and the liquid crystal layer comprises liquid crystal molecules. The reflective layer is provided with a plurality of micro alignment structures on an upper surface away from the protective layer. The liquid crystal molecules close to the micro alignment structures are forced to tilt along a slope of the micro alignment structures, causing said liquid crystal molecules to be arranged in a direction different from the alignment direction of the alignment film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:畫素區域</p>  
        <p type="p">21:基板</p>  
        <p type="p">22:基板</p>  
        <p type="p">3:電子元件層</p>  
        <p type="p">31:第一金屬層</p>  
        <p type="p">32:介電層</p>  
        <p type="p">33:第二金屬層</p>  
        <p type="p">34:半導體層</p>  
        <p type="p">4:保護層</p>  
        <p type="p">5:反射層</p>  
        <p type="p">6:配向膜</p>  
        <p type="p">7:液晶層</p>  
        <p type="p">71:液晶分子</p>  
        <p type="p">8:濾光片</p>  
        <p type="p">S:微配向結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="336" publication-number="202611242"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611242.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611242</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134300</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔音制震塗料及其施工方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240918B">C09D175/04</main-classification>  
        <further-classification edition="200601120240918B">C09D201/00</further-classification>  
        <further-classification edition="201801120240918B">C09D7/61</further-classification>  
        <further-classification edition="200601120240918B">E04F15/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣艾富克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林仁彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇宥霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅香維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康文彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種隔音制震塗料及其施工方法。該隔音制震塗料主要是由聚胺脂樹脂粒及樹脂組成；以一定比例將其攪拌混合後成一種隔音制震塗料。本發明隔音制震塗料主要係使用於樓層地板，其施工方法為：首先清理地板表面並將RC素地整平 ；其次塗抹水性底漆；然後於角隅處貼8mm厚之緩衝材；再將隔音制震塗料鏝抹在施工地面表層，待其乾固後再澆置水泥砂漿，最後再進行整平或是使用磁磚黏著劑以鋪設面材。本發明藉由聚胺脂樹脂粒具有高彈性及低密度之形變低特性，用以吸收衝擊音，達到制震隔音功效，解決樓地板隔音之問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:隔音制震塗料</p>  
        <p type="p">10:聚胺脂樹脂粒</p>  
        <p type="p">11:樹脂</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="337" publication-number="202610872"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610872.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610872</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134301</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>行車動態暨工時管理系統</chinese-title>  
        <english-title>DYNAMIC DRIVING AND WORK HOUR MANAGEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241101B">B60W40/08</main-classification>  
        <further-classification edition="200601120241101B">G08B21/18</further-classification>  
        <further-classification edition="202401120241101B">G06Q50/40</further-classification>  
        <further-classification edition="202301120241101B">G06Q10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中興保全科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒純平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHUN-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝淑卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, SHU-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾新力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, XIN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯錦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏懿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鈺夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種行車動態暨工時管理系統，包含雲端伺服器及行動裝置。雲端伺服器包含設定模組及儲存模組。設定模組設定人員資料、車輛資料、門號資料及行程資料。儲存模組接收並儲存人員資料、車輛資料，門號資料與行程資料。行動裝置包含接收模組、讀取模組、定位模組、比對模組及警示模組。接收模組接收並儲存行程資料。讀取模組讀取車輛之卡片資料，綁定門號資料、車輛資料與卡片資料。定位模組定位行動裝置之行動位置。比對模組比對行動位置是否超出目的位置。警示模組用以發出警示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dynamic driving and work hour management system includes a cloud server and a mobile device. The cloud server includes a configuration module and a storage module. The configuration module is configured to set personnel data, a vehicle data, a identification number data, and an itinerary data. The storage module receives and stores the personnel data, the vehicle data, the identification number data, and the itinerary data. The mobile device includes a receiving module, a reading module, a positioning module, a comparison module, and an alert module. The receiving module receives and stores the itinerary data. The reading module reads the card data of a vehicle and binds the identification number data, the vehicle data, and the card data. The positioning module determines the location of the mobile device. The comparison module compares whether the location of the mobile device exceeds the intended destination. The alert module is used to issue an alert.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:雲端伺服器</p>  
        <p type="p">30:行動裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="338" publication-number="202610594"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610594.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610594</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134306</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於薦尾椎保健的系統</chinese-title>  
        <english-title>SYSTEM FOR SACROCOCCYGEAL HEALTHCARE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240924B">A61B5/11</main-classification>  
        <further-classification edition="201701120240924B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭智隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李炳宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, PING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭智隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李炳宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, PING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於薦尾椎保健的系統，設計用於精確調整薦尾椎，以保健與脊柱錯位相關的不適和疾病。該系統整合了多個感測器、演算法、計算裝置和保健裝置，通過精確的位置調整來增強保健效果。該系統利用感測器偵測薦尾椎的位置，產生位置資料及演算法並由計算裝置處理。計算裝置根據脊椎各區段與薦尾椎各區段之間的預定映射關係計算所需的調整，使用映射脊柱結構與保健動作的方程式。保健裝置可以包括機器人手臂或光療模組，在計算裝置的指導下對薦尾椎施行這些計算出的調整。這種整合方式允許進行高度精確的保健，適應個別病患的需求，顯著提高了保健的一致性和效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for the healthcare of the sacrococcygeal region, designed for precise adjustment of the sacrococcygeal vertebrae to alleviate discomfort and diseases related to spinal vertebrae dislocation. This system integrates multiple sensors, algorithm, computing devices, and healthcare devices to enhance healthcare effects through precise positional adjustments. The system uses sensors to detect the position of the sacrococcygeal vertebrae, generating position data which is then processed by the computing device. The computing device calculates the necessary adjustments based on a predetermined mapping relationship between various segments of the spine and the sacrococcygeal vertebrae, using equations and algorithm that map the spinal structure to healthcare actions. The healthcare device may include a robotic arm or a light therapy module, which performs these calculated adjustments on the sacrococcygeal vertebrae under the guidance of the computing device. This integrated approach allows for highly precise healthcare, tailored to the needs of individual patients, significantly improving the consistency and effectiveness of healthcare.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:感測器</p>  
        <p type="p">112:CCD相機</p>  
        <p type="p">120:計算裝置</p>  
        <p type="p">122:使用者介面</p>  
        <p type="p">130:保健裝置</p>  
        <p type="p">132:機器人手臂</p>  
        <p type="p">134:光療模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="339" publication-number="202612208"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612208.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612208</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134307</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制電力系統的方法</chinese-title>  
        <english-title>METHOD OF CONTROLLING A POWER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">H02J3/28</main-classification>  
        <further-classification edition="200601120241126B">H02J7/00</further-classification>  
        <further-classification edition="200601120241126B">H02J15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯佾寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, YI-KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林珈敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾翊凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯智涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, CHIH-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電力系統的控制方法，包括判斷儲能系統之電池存量是否低於第一臨限值。當電池存量低於第一臨限值時，啟動發電機並判斷發電機是否異常。當發電機為異常時，藉由儲能系統對負載供電。當發電機為正常時，藉由發電機與儲能系統共同對負載供電。判斷電池存量是否低於第二臨限值，以及當電池存量低於第二臨限值時，卸載一部份的負載。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A Method of controlling a power system, comprising: determining whether a source of charge of a power reservoir lower than a first threshold. When the source of charge is lower than the first threshold, a power generator is activated and determining whether the power generator is abnormal. When the power generator is abnormal, supplying the power to loads by the power reservoir. When the power generator is normal, supplying the power to loads by the power generator. Determine whether the source of charge of the power reservoir is lower than the second threshold, and off-load a part of loads when the source of charge is lower than the second threshold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">201~217:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="340" publication-number="202611755"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611755.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611755</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134308</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>衛星遙測物種辨識系統</chinese-title>  
        <english-title>CROP SPECIES IDENTIFICATION SYSTEM BASED ON SATELLITE TELEMETRY DATA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241007B">G06F18/24</main-classification>  
        <further-classification edition="202201120241007B">G06V10/82</further-classification>  
        <further-classification edition="202201120241007B">G06V20/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>悠由數據應用股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DATAYOO APPLICATION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳君孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-HSIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳君孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-HSIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊浩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAUNG, HAO-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種衛星遙測物種辨識系統，包含：一接收模組，接受一目標地區的一遙測植株指數；一預處理模組，對於遙測植株指數中異常值，進行一指數預處理，以產生一預處理數據；一特徵擷取模組，具有至少兩個不同的卷積核，將預處理數據藉由卷積核進行映射運算，分別產生對應卷積核的至少兩尺度特徵數據，特徵擷取模組進行尺度特徵數據的池化運算以產生一池化數據，與拼接(Concatenate)至少兩尺度特徵數據與池化數據，以產生一拼接數據；以及一分類模組，包含一全連接層(Fully Connected Layer)，提取拼接數據的特徵，以產生目標地區的一物種分類結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A crop species identification system based on satellite telemetry data, including: a receiver module, receiving plural telemetric vegetation indexes of a target area; a data cleaning module, cleaning anomalous data in the telemetric vegetation indices, to correspondingly generate cleaned index data; a feature extraction module, including at least two different convolution kernels for mapping the cleaned index data into at least two feature scale mapping data which respectively correspond to the convolution kernels, performing a pooling operation of the feature scale mapping data to generate a pooled data, and concatenating the at least two feature scale mapping data and the pooled data into concatenated data; and a classification module, including a fully-connected layer, for extracting features of the concatenated data, to generate a species classification result for the target area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:衛星遙測物種辨識系統</p>  
        <p type="p">10:接收模組</p>  
        <p type="p">20:預處理模組</p>  
        <p type="p">30:特徵擷取模組</p>  
        <p type="p">40:分類模組</p>  
        <p type="p">Csi:物種分類結果</p>  
        <p type="p">Cvk:卷積核</p>  
        <p type="p">Dcl:預處理數據</p>  
        <p type="p">Dcon:拼接數據</p>  
        <p type="p">Fcl:全連接層</p>  
        <p type="p">Itv:遙測植株指數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="341" publication-number="202612371"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612371.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612371</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134311</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料傳輸方法及資料傳輸系統</chinese-title>  
        <english-title>DATA TRANSMITTING METHOD AND DATA TRANSMITTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250102B">H04W52/02</main-classification>  
        <further-classification edition="201801120250102B">H04W4/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃振庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張加易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃致遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱沛鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, PEI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁而咨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, ER-ZIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種資料傳輸方法，由處理器讀取儲存於記憶體的至少一指令以執行上述資料傳輸方法，上述資料傳輸方法包含以下步驟：根據待命信號以調整延遲時間至目標時間；等待目標時間後，判斷是否具有至少一資料封包以決定是否傳輸至少一資料封包；以及執行待命模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data transmitting method is disclosed herein. A processor reads at least command stored in a memory and executes the data transmitting method. The data transmitting method includes following steps: adjusting a delay time into a target time according to a standby signal; determining whether there is at least one data packet to decide whether to transmit the at least one data packet after waiting for the target time; and executing a standby mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:資料收發方法</p>  
        <p type="p">210~230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="342" publication-number="202612119"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612119.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612119</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240923B">H01L23/28</main-classification>  
        <further-classification edition="200601120240923B">H01L23/488</further-classification>  
        <further-classification edition="200601120240923B">H01L21/56</further-classification>  
        <further-classification edition="200601120240923B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇志彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIH-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種半導體封裝結構，半導體封裝結構包含基板、第一材料、第二材料以及晶片。基板包含至少一通孔，至少一通孔貫穿基板。第一材料由基板之第一側填充進至少一通孔。第二材料由基板之第二側填充進至少一通孔。第一材料之第一膨脹係數大於第二材料之第二膨脹係數，且第一側與第二側分別位於基板之不同側。晶片設置於基板之第一側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor packaging structure is disclosed herein. The semiconductor packaging structure includes a substrate, a first material, a second material, and a chip. The substrate includes at least one through hole, and the at least one through hole penetrates the substrate. The first material is filled into the at least one through hole from a first side of the substrate. The second material is filled into the at least one through hole from a second side of the substrate. A first expansion coefficient of the first material is larger than a second expansion coefficient of the second material, and the first side and the second side are located on different sides of the substrate. The chip is disposed on the first side of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體封裝結構</p>  
        <p type="p">110:基板</p>  
        <p type="p">111:通孔</p>  
        <p type="p">112:第一側</p>  
        <p type="p">113:通孔</p>  
        <p type="p">114:第二側</p>  
        <p type="p">121:第一材料</p>  
        <p type="p">122:第一材料</p>  
        <p type="p">131:第二材料</p>  
        <p type="p">132:第二材料</p>  
        <p type="p">140:晶片</p>  
        <p type="p">150:連接球</p>  
        <p type="p">190:中性軸</p>  
        <p type="p">H1~H4:高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="343" publication-number="202611738"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611738.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611738</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134315</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中斷控制裝置及中斷控制方法</chinese-title>  
        <english-title>INTERRUPT CONTROL DEVICE AND INTERRUPT CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241211B">G06F13/24</main-classification>  
        <further-classification edition="200601120241211B">G06F13/38</further-classification>  
        <further-classification edition="200601120241211B">G06F9/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾民佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, MIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭浩源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, HAU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宗翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">中斷控制裝置包含中斷請求暫存器以及中斷遮罩暫存器。中斷請求暫存器用以在致能中斷期間紀錄第一中斷事件，並由中斷控制裝置在致能中斷期間輸出第一中斷事件。中斷遮罩暫存器用以根據中斷應答信號以切換致能中斷期間為禁能中斷期間，並由中斷請求暫存器在禁能中斷期間紀錄第二中斷事件。中斷遮罩暫存器根據中斷結束信號以切換禁能中斷期間為致能中斷期間，並由中斷控制裝置在致能中斷期間輸出第二中斷事件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An interrupt control device includes an interrupt request register and an interrupt mask register. The interrupt request register is configured to record a first interrupt event during an interrupt enable period, and the interrupt control device outputs the first interrupt event during the interrupt enable period. The interrupt mask register is configured to switch the interrupt enable period to an interrupt disable period according to an interrupt acknowledge signal, and the interrupt request register records a second interrupt event during the interrupt disable period. The interrupt mask register is configured to switch the interrupt disable period to the interrupt enable period according to an end of interrupt signal, and the interrupt control device outputs the second interrupt event during the interrupt enable period.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:網路積體電路</p>  
        <p type="p">110:中斷控制裝置</p>  
        <p type="p">111:中斷請求暫存器</p>  
        <p type="p">1111:第一中斷請求暫存單元</p>  
        <p type="p">1112:第二中斷請求暫存單元</p>  
        <p type="p">112:中斷處理器</p>  
        <p type="p">113:中斷服務暫存器</p>  
        <p type="p">114:中斷遮罩暫存器</p>  
        <p type="p">115:控制邏輯</p>  
        <p type="p">120:媒體存取控制處理器</p>  
        <p type="p">130:接收端暫存器</p>  
        <p type="p">140:發送端暫存器</p>  
        <p type="p">150:直接記憶體存取引擎</p>  
        <p type="p">160:快速周邊元件互聯介面</p>  
        <p type="p">900:系統端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="344" publication-number="202612233"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612233.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612233</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134316</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用Ｓｐｉｒｉｔｏ效應抑制湧浪電流的ＰＦＣ轉換器</chinese-title>  
        <english-title>POWER FACTOR CORRECTION CONVERTER SUPPRESSING INRUSH CURRENT USING SPIRITO EFFECT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120250401B">H02M1/42</main-classification>  
        <further-classification edition="200601120250401B">H02M7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博盛半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POTENS SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEN NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING KUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游智名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIH MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅益民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, I MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃照峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為提供一種使用Spirito效應抑制湧浪電流的PFC轉換器，包含有電感、多個電晶體及電容，主要藉由一第五電晶體與電容的串聯設置，並透過一控制單元控制所述第五電晶體的閘極－源極電壓（Drain Source Voltage），使第五電晶體呈高阻抗狀態，用以抑制接上交流電源時產生的湧浪電流（Inrush Current），避免湧浪電流造成功率元件的耗損並減少功耗，讓PFC轉換器在高功率運作時仍能維持良好的效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:無橋PFC轉換器</p>  
        <p type="p">11:第一橋臂</p>  
        <p type="p">12:第二橋臂</p>  
        <p type="p">111:第一中點</p>  
        <p type="p">121:第二中點</p>  
        <p type="p">112:第一端</p>  
        <p type="p">122:第二端</p>  
        <p type="p">13:第三橋臂</p>  
        <p type="p">14:控制單元</p>  
        <p type="p">Q&lt;sub&gt;1&lt;/sub&gt;:第一電晶體</p>  
        <p type="p">Q&lt;sub&gt;2&lt;/sub&gt;:第二電晶體</p>  
        <p type="p">Q&lt;sub&gt;3&lt;/sub&gt;:第三電晶體</p>  
        <p type="p">Q&lt;sub&gt;4&lt;/sub&gt;:第四電晶體</p>  
        <p type="p">Q&lt;sub&gt;5&lt;/sub&gt;:第五電晶體</p>  
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;:第一電感</p>  
        <p type="p">L&lt;sub&gt;2&lt;/sub&gt;:第二電感</p>  
        <p type="p">ac:交流電源</p>  
        <p type="p">v&lt;sub&gt;ac&lt;/sub&gt;:輸入交流電壓</p>  
        <p type="p">C&lt;sub&gt;o&lt;/sub&gt;:電容</p>  
        <p type="p">R&lt;sub&gt;o&lt;/sub&gt;:負載</p>  
        <p type="p">V&lt;sub&gt;o&lt;/sub&gt;:輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="345" publication-number="202611373"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611373.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611373</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134317</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>能快速排水的豎井結構</chinese-title>  
        <english-title>WELL STRUCTURE FOR RAPID DRAINAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">E03F1/00</main-classification>  
        <further-classification edition="200601120241127B">E03F5/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘宇翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU-HSIANG, PAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘宇翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU-HSIANG, PAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游麒弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI-HUNG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯明憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種能快速排水的豎井結構，該豎井結構設置於一地層，該地層包含一第一地下水層、一第二地下水層及一第三地下水層，該豎井結構包含一井體，該井體通過該地層的該第一地下水層及該第二地下水層並抵達該第三地下水層，該井體內形成有一流水通道，該流水通道具有一開口且連通該地層的一地表及該第三地下水層，使位於該地表的一積水能通過該開口並經由該流水通道排入該第三地下水層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure discloses a well structure for rapid drainage. The well structure is disposed on strata. The strata includes a first groundwater layer, a second groundwater layer and a third groundwater layer. The well structure includes a well body. The well body is through the first groundwater layer and the second groundwater layer, and reaches the third groundwater layer. A water channel is formed in the well body. The water channel has an opening and communicates with a ground surface and the third groundwater layer of the strata, so that a flood on the surface is discharged into the third groundwater layer through the opening and the water channel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:豎井結構</p>  
        <p type="p">3000:地層</p>  
        <p type="p">3000':地表</p>  
        <p type="p">3001:第一地下水層</p>  
        <p type="p">3002:第二地下水層</p>  
        <p type="p">3003:第三地下水層</p>  
        <p type="p">1:井體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="346" publication-number="202612399"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612399.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612399</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134324</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透明電路板</chinese-title>  
        <english-title>TRANSPARENT CIRCUIT BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">H05K1/03</main-classification>  
        <further-classification edition="200601120241127B">H05K1/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商慶鼎精密電子(淮安)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QINGDING PRECISION ELECTRONICS (HUAI'AN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股(深圳)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭澄軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHEN-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳伯元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種透明電路板包括第一層體、第二層體以及導電柱。第一層體包括第一金屬線層以及第一電致變色結構。第一電致變色結構位於第一金屬線層的上表面。第二層體包括第二金屬線層以及第二電致變色結構。第二電致變色結構位於第二金屬線層的一下表面。導電柱位於第一層體以及位於第二層體之間，其中導電柱連接第一金屬線層以及第二金屬線層，其中第一電致變色結構沿一通孔方向部分垂直重疊導電柱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transparent circuit board includes a first layer, a second layer and a conductive column. The first layer includes a first metal wire layer and a first electrochromic structure. The first electrochromic structure is on a top surface of the first metal wire layer. The second layer includes a second metal wire layer and a second electrochromic structure. The second electrochromic structure is on a bottom surface of the second metal wire layer. The conductive column is between the first layer and the second layer, in which the conductive column is connected to the first metal wire layer and the second metal wire layer, in which the first electrochromic structure vertically overlaps the conductive column along a via direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:透明電路板</p>  
        <p type="p">120:第一層體</p>  
        <p type="p">122、142:金屬線層</p>  
        <p type="p">124、144:電致變色結構</p>  
        <p type="p">1242、1442:透明導電層</p>  
        <p type="p">1244、1444:電致變色層</p>  
        <p type="p">1246、1446:電解質層</p>  
        <p type="p">1248、1448:離子儲存層</p>  
        <p type="p">140:第二層體</p>  
        <p type="p">122A、142A:表面</p>  
        <p type="p">124P、144P、1222、1422:部分</p>  
        <p type="p">160:導電柱</p>  
        <p type="p">126、146、180:透明絕緣層</p>  
        <p type="p">122L、142L:金屬線</p>  
        <p type="p">124L、144L:電致變色線</p>  
        <p type="p">LS:線堆疊</p>  
        <p type="p">ID:層間導電處</p>  
        <p type="p">L1、L2:長度</p>  
        <p type="p">VD:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="347" publication-number="202611906"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611906.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611906</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134325</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>音訊處理系統及具有音訊處理機制的虛擬實境穿戴式裝置</chinese-title>  
        <english-title>AUDIO PROCESSING SYSTEM AND VIRTUAL REALITY WEARABLE DEVICE HAVING AUDIO PROCESSING MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241202B">G10L21/02</main-classification>  
        <further-classification edition="201301120241202B">G10L25/57</further-classification>  
        <further-classification edition="200601120241202B">H04S5/00</further-classification>  
        <further-classification edition="200601120241202B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>驊訊電子企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>C-MEDIA ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭期成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧傑文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, JEI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種音訊處理系統及具有音訊處理機制的虛擬實境穿戴式裝置。本發明的虛擬實境穿戴式裝置包含虛擬實境穿戴元件以及音訊處理系統。本發明的虛擬實境穿戴元件播放歌曲訊號，穿戴本發明的虛擬實境穿戴式裝置的使用者跟隨播放的歌曲訊號進行唱歌。本發明的虛擬實境穿戴元件進行錄音以產生聲音訊號，音訊處理系統消除聲音訊號中的嘯叫後由虛擬實境穿戴元件播放給使用者聽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An audio processing system and a virtual reality wearable device having an audio processing mechanism are provided. The virtual reality wearable device includes a virtual reality wearable component and the audio processing system. The virtual reality wearable component plays a song signal, and a user that wears the virtual reality wearable device sings a song along with the played song signal. The virtual reality wearable component records voice to generate a voice signal. The audio processing system removes howl in the voice signal. Then, the virtual reality wearable component plays the voice signal from which the howl is removed to the user.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">VR4:虛擬實境穿戴式裝置</p>  
        <p type="p">VRGL:虛擬實境穿戴元件</p>  
        <p type="p">GLS:鏡架</p>  
        <p type="p">DIS:顯示器</p>  
        <p type="p">RVR:收音元件</p>  
        <p type="p">PLY:音訊播放元件</p>  
        <p type="p">AUCTD:音訊收播控制元件</p>  
        <p type="p">100:應用程式</p>  
        <p type="p">PTR:音訊播放控制模組</p>  
        <p type="p">PRO:音訊處理模組</p>  
        <p type="p">RDE:音訊記錄模組</p>  
        <p type="p">S1:歌曲訊號</p>  
        <p type="p">S2:使用者聲音</p>  
        <p type="p">S12:聲音訊號</p>  
        <p type="p">S321:音訊訊號</p>  
        <p type="p">USE:使用者</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="348" publication-number="202612170"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612170.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612170</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134326</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陣列天線裝置</chinese-title>  
        <english-title>ARRAY ANTENNA DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H01Q1/36</main-classification>  
        <further-classification edition="200601120241202B">H01Q21/00</further-classification>  
        <further-classification edition="200601120241202B">H01Q1/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>耀登科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUDEN TECHNO CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許閏凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIU, RUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種陣列天線裝置。陣列天線裝置包含一載體、及設置於載體上的多個圓極化天線模組、一波束成型芯片及多個放大器。載體具有一厚度方向，並包含一線路部位、多個天線部位、及多個焊接結構。線路部位具有堆疊的多個層板。多個層板以垂直厚度方向的一對稱軸呈對稱配置。多個天線部位配置於線路部位上，各天線部位通過焊接結構可拆卸地連接線路部位。多個圓極化天線模組分別設置於多個天線部位上。波束成型芯片電性連接多個圓極化天線模組。多個放大器設置於線路部位上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An array antenna device is provided. The array antenna device includes a carrier, and a plurality of circularly polarized antenna modules, a beamforming chip and a plurality of amplifiers that are arranged on the carrier. The carrier has a thickness direction and includes a circuit portion, a plurality of antenna portions, and a plurality of welding structures. The circuit portion has a plurality of stacked layers. The stacked layers are symmetrically arranged with a symmetry axis perpendicular to the thickness direction. The antenna portions are arranged on the circuit portion, and each of the antenna portions is detachably connected to the circuit portion through the welding structure. The circularly polarized antenna modules are respectively disposed on the antenna portions. The beam forming chip is electrically connected to the circularly polarized antenna modules. The amplifiers are arranged on the circuit portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:陣列天線裝置</p>  
        <p type="p">1:載體</p>  
        <p type="p">11:線路部位</p>  
        <p type="p">111A:第一層板</p>  
        <p type="p">111B:第二層板</p>  
        <p type="p">111C:第三層板</p>  
        <p type="p">111D:第四層板</p>  
        <p type="p">12:天線部位</p>  
        <p type="p">13:焊接結構</p>  
        <p type="p">2:圓極化天線模組</p>  
        <p type="p">21:貼片天線</p>  
        <p type="p">22:射頻線路</p>  
        <p type="p">3:放大器</p>  
        <p type="p">DT:厚度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="349" publication-number="202612411"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612411.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612411</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134328</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板的製作方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF CIRCUIT BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">H05K3/46</main-classification>  
        <further-classification edition="200601120240926B">H05K3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣興電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIMICRON TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WENHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳卓營</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHO-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路板的製作方法，包括以下步驟：提供基板，其具有導電層；藉由治具對所述基板的所述導電層進行壓印蝕刻，以形成具有凹凸圖案的中間體；以及對所述中間體進行蝕刻，以形成具有線路圖案的電路板，其中所述線路圖案對應於所述凹凸圖案的凸處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of a circuit board including the following steps is provided: providing a substrate with a conductive layer; using a jig to imprint-etch the conductive layer of the substrate to form an intermediate with a concave and convex pattern; and etching the intermediate to form a circuit board with a circuit pattern, wherein the circuit pattern corresponds to a convex portion of the concave and convex pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">150:核心層</p>  
        <p type="p">200:基板</p>  
        <p type="p">210:上導電層</p>  
        <p type="p">230:下導電層</p>  
        <p type="p">250:導電通孔</p>  
        <p type="p">371:凹處</p>  
        <p type="p">900:治具</p>  
        <p type="p">910:上治具</p>  
        <p type="p">930:下治具</p>  
        <p type="p">960:定位銷</p>  
        <p type="p">971:凸處</p>  
        <p type="p">973:流道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="350" publication-number="202612270"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612270.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612270</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訊號傳輸介面</chinese-title>  
        <english-title>SIGNAL TRANSMISSION INTERFACE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H03K17/04</main-classification>  
        <further-classification edition="200601120241202B">H03K17/14</further-classification>  
        <further-classification edition="200601120241202B">H03K19/0185</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊修銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, HSIU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐偉誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種訊號傳輸介面，其包含有一上橋電路、一下橋電路、一第一閘極控制電路以及一第二閘極控制電路。該上橋電路用來選擇性地將一供應電壓耦接至該訊號傳輸介面的一輸出端點，且該下橋電路用來選擇性地將該訊號傳輸介面的該輸出端點耦接至一接地電壓。該第一閘極控制電路用以接收一輸入訊號，並控制該輸入訊號輸入至該上橋電路的時間。該第二閘極控制電路用以接收該輸入訊號，並控制該輸入訊號輸入至該下橋電路的時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a signal transmission interface, which includes high-side bridge circuit and a low-side bridge circuit, a first gate control circuit, a second gate control circuit and an output resistor.. The high-side bridge circuit is configured to selectively couple a supply voltage to an output terminal of the signal transmission interface. The low-side bridge circuit is configured to selectively couple the output terminal of the signal transmission interface to a ground voltage. The first gate control circuit is configured to receive an input signal and control a timing of the input signal inputted into the high-side bridge circuit. The second gate control circuit is configured to receive the input signal and control a timing of the input signal inputted into the low-side bridge circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:訊號傳輸介面</p>  
        <p type="p">110,120:閘極控制電路</p>  
        <p type="p">102:上橋電路</p>  
        <p type="p">104:下橋電路</p>  
        <p type="p">C1,C2:電容</p>  
        <p type="p">CL:負載電容</p>  
        <p type="p">R1,R2:電阻</p>  
        <p type="p">Rout:輸出電阻</p>  
        <p type="p">VDD:供應電壓</p>  
        <p type="p">Vin:輸入訊號</p>  
        <p type="p">Vout:輸出訊號</p>  
        <p type="p">V1,V2:濾波後輸入訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="351" publication-number="202610780"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610780.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610780</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>扳手結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">B25B23/08</main-classification>  
        <further-classification edition="200601120241029B">B25B13/04</further-classification>  
        <further-classification edition="200601120241029B">B25B13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穩陞工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖嘉冠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種扳手結構，其係包括：一本體係設有一柄部、四第一面、四第一凹部、四凸塊、一第二面、二第二凹部、八肋部、二第一側面、二第二側面及一第一導角；該柄部具有一第一寬度、一第二寬度、一第三寬度、一第四寬度、一第五寬度及一第六寬度；該第一寬度之數值係大於該第四寬度之數值，該第四寬度之數值係大於該第五寬度之數值，該第五寬度之數值係大於該第三寬度之數值，該第三寬度之數值大於該第二寬度之數值，該第二寬度之數值大於該第六寬度之數值；該柄部具有一第一厚度、一第二厚度、一第三厚度及一第四厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:本體</p>  
        <p type="p">11:柄部</p>  
        <p type="p">111:第一面</p>  
        <p type="p">112:第一凹部</p>  
        <p type="p">1121:第一連接部</p>  
        <p type="p">113:凸塊</p>  
        <p type="p">114:第二面</p>  
        <p type="p">1141:第二連接部</p>  
        <p type="p">1142:凹槽</p>  
        <p type="p">115:第二凹部</p>  
        <p type="p">1151:第三連接部</p>  
        <p type="p">116:肋部</p>  
        <p type="p">117:第一側面</p>  
        <p type="p">118:第二側面</p>  
        <p type="p">119:第一導角</p>  
        <p type="p">12:第一旋動部</p>  
        <p type="p">121:第三面</p>  
        <p type="p">13:第二旋動部</p>  
        <p type="p">131:第四面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="352" publication-number="202610781"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610781.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610781</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134348</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接頭結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">B25B23/08</main-classification>  
        <further-classification edition="200601120241029B">B25B13/06</further-classification>  
        <further-classification edition="200601120241029B">B25F1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宇程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宇程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種接頭結構，該接頭結構係用於手工具結構中，其係包括：一第一本體係設有一第一套合部、一第一四角槽及一第一六角槽；該第一套合部之軸心處係設有一第一軸心及一第一垂直線，該第一套合部係設有十二個第一角端，該第一四角槽之其中二個邊面相交處係設有一第一虛擬角端，該第一套合部之每二個相對邊面之間係具有一第一距離，該第一四角槽之二個相對邊面之間係具有一第二距離；該第一六角槽之其中二個邊面之相交處係設有一第二角端，該第一六角槽係具有一第三距離；一第二本體係設有一第二套合部、一驅動頭及一第二六角槽。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:第一本體</p>  
        <p type="p">11:第一套合部</p>  
        <p type="p">12:第一四角槽</p>  
        <p type="p">13:第一六角槽</p>  
        <p type="p">14:第一環部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="353" publication-number="202611503"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611503.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611503</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134352</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於內引腳接合設備的光學檢測裝置、光學檢測方法、及具有光學檢測裝置的內引腳接合設備</chinese-title>  
        <english-title>OPTICAL INSPECTION DEVICE APPLIED TO INNER LEAD BONDING APPARATUS, OPTICAL INSPECTING METHOD, AND INNER LEAD BONDING APPARATUS WITH OPTICAL INSPECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G01N21/89</main-classification>  
        <further-classification edition="200601120241007B">G01N35/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>由田新技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UTECHZONE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡孟呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MENG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佳民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種應用於內引腳接合設備的光學檢測裝置，包括一影像擷取裝置、以及一瑕疵檢測模組。影像擷取裝置設置於該內引腳接合設備的一接合平台的下游，用以擷取一軟性電路板捲帶上的一已接合晶片的影像。該瑕疵檢測模組接收該已接合晶片的影像，以檢測該已接合晶片的瑕疵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical inspection device applied to an inner lead bonding apparatus includes an image capturing device, and a defect detection module. The image capturing device is disposed downstream of a bonding stage of the inner lead bonding apparatus, and used to capture an image of bonded chip. The defect detection module receives the image of bonded chip to detect defects of the bonded chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學檢測裝置</p>  
        <p type="p">12:影像擷取裝置</p>  
        <p type="p">14:除塵裝置</p>  
        <p type="p">141:氣流提供單元</p>  
        <p type="p">142:集塵單元</p>  
        <p type="p">17:光源裝置</p>  
        <p type="p">20:電腦</p>  
        <p type="p">21:資料儲存裝置</p>  
        <p type="p">22:處理器</p>  
        <p type="p">23:顯示器</p>  
        <p type="p">9:薄膜覆晶封裝製程系統</p>  
        <p type="p">90:捲帶釋放單元</p>  
        <p type="p">91:軟性電路板捲帶</p>  
        <p type="p">92:接合平台</p>  
        <p type="p">93:壓合頭</p>  
        <p type="p">94:點膠裝置</p>  
        <p type="p">942:封裝膠體</p>  
        <p type="p">95:乾燥設備</p>  
        <p type="p">96:最終檢測設備</p>  
        <p type="p">99:捲帶捲收單元</p>  
        <p type="p">C1,C2,C3,C4,C5:晶片</p>  
        <p type="p">M1:瑕疵檢測模組</p>  
        <p type="p">M2:偏移對位檢測模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="354" publication-number="202612269"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612269.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612269</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134353</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低漏電高速電壓平轉電路</chinese-title>  
        <english-title>LOW LEAKAGE HIGH-SPEED LEVEL-SHIFTER CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H03K5/003</main-classification>  
        <further-classification edition="200601120241202B">H03K19/0185</further-classification>  
        <further-classification edition="200601120241202B">G11C11/409</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUO-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種低漏電高速電壓平轉電路。本發明的低漏電高速電壓平轉電路包含電壓平轉主電路。本發明的低漏電高速電壓平轉電路更包含正向輸出電路、反向輸出電路或兩者。正向輸出電路包含正向電壓平轉電路以及正向端緩衝電路。電壓平轉主電路連接正向電壓平轉電路的輸入端以及反向電壓平轉電路的輸入端。正向電壓平轉電路的輸出端連接正向端緩衝電路。反向輸出電路包含反向電壓平轉電路以及反向端緩衝電路。反向電壓平轉電路的輸出端連接反向端緩衝電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A low leakage high-speed level-shifter circuit is provided. The low leakage high-speed level-shifter circuit includes a voltage shifter main circuit. The low leakage high-speed level-shifter circuit further includes a forward output circuit, a reverse output circuit, or a combination thereof. The forward output circuit includes a forward voltage shifting circuit and a forward terminal buffer circuit. The voltage shifter main circuit is connected to input terminals of both of the forward voltage shifting circuit and the reverse voltage shifting circuit. An output terminal of the forward voltage shifting circuit is connected to the forward terminal buffer circuit. An output terminal of the reverse voltage shifting circuit is connected to the reverse terminal buffer circuit. The reverse terminal buffer circuit is connected to an output terminal of the reverse voltage shifting circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">LSH2:電壓平轉主電路</p>  
        <p type="p">M1:第一主電晶體</p>  
        <p type="p">M2:第二主電晶體</p>  
        <p type="p">M3:第三主電晶體</p>  
        <p type="p">M4:第四主電晶體</p>  
        <p type="p">MA2:正向電壓平轉電路</p>  
        <p type="p">MP1:第一正向平轉電晶體</p>  
        <p type="p">MP2:第二正向平轉電晶體</p>  
        <p type="p">BUF:正向端緩衝電路</p>  
        <p type="p">BF1、BF2:正向端緩衝電路</p>  
        <p type="p">B11、B21:第一正向端緩衝電晶體</p>  
        <p type="p">B12、B22:第二正向端緩衝電晶體</p>  
        <p type="p">VDDQ:共用電壓</p>  
        <p type="p">VSS:參考電位</p>  
        <p type="p">VPD:第一控制電壓</p>  
        <p type="p">IBS:第一輸入訊號</p>  
        <p type="p">IS:第二輸入訊號</p>  
        <p type="p">OUTS:正向輸出訊號</p>  
        <p type="p">M5:第五主電晶體</p>  
        <p type="p">M6:第六主電晶體</p>  
        <p type="p">MP3:第三正向平轉電晶體</p>  
        <p type="p">VCORE:第二控制電壓</p>  
        <p type="p">SA:三態反向器</p>  
        <p type="p">S11:第一正向端穩壓電晶體</p>  
        <p type="p">S12:第二正向端穩壓電晶體</p>  
        <p type="p">S13:第三正向端穩壓電晶體</p>  
        <p type="p">S14:第四正向端穩壓電晶體</p>  
        <p type="p">S15:第五正向端穩壓電晶體</p>  
        <p type="p">S16:第六正向端穩壓電晶體</p>  
        <p type="p">Vtie1、Vtie0:第三控制電壓</p>  
        <p type="p">MAQ2:反向電壓平轉電路</p>  
        <p type="p">MQ1:第一反向平轉電晶體</p>  
        <p type="p">MQ2:第二反向平轉電晶體</p>  
        <p type="p">BUFQ:反向端緩衝電路</p>  
        <p type="p">BFQ1、BFQ2:子反向端緩衝電路</p>  
        <p type="p">BQ11、BQ21:第一反向端緩衝電晶體</p>  
        <p type="p">BQ12、BQ22:第二反向端緩衝電晶體</p>  
        <p type="p">OUTBS:反向輸出訊號</p>  
        <p type="p">MQ3:第三反向平轉電晶體</p>  
        <p type="p">SAQ:反向穩壓電路</p>  
        <p type="p">SQ11:第一反向端穩壓電晶體</p>  
        <p type="p">SQ12:第二反向端穩壓電晶體</p>  
        <p type="p">SQ13:第三反向端穩壓電晶體</p>  
        <p type="p">SQ14:第四反向端穩壓電晶體</p>  
        <p type="p">SQ15:第五反向端穩壓電晶體</p>  
        <p type="p">SQ16:第六反向端穩壓電晶體</p>  
        <p type="p">VPDB:反向控制電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="355" publication-number="202611849"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611849.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611849</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134354</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池數據平衡系統及方法</chinese-title>  
        <english-title>BATTERY DATA BALANCING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241231B">G06Q50/06</main-classification>  
        <further-classification edition="200601120241231B">H02J7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加百裕工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CELXPERT ENERGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉紫鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TZU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TAI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴百勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, PAI-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種電池數據平衡系統及方法。本發明的多電池數據平衡系統執行多電池數據平衡方法，包含以下步驟：由多個電池模組中的每一者將其本身的電池數據以有線或無線傳輸至其他各電池模組；以及由各電池模組，將多個電池模組分別的多個電池數據相互進行比對以決定是否調變自身的輸出電壓，若是，調變輸出電壓，若否，不調變輸出電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery data balancing system and method are provided. The battery data balancing system performs the multi-battery power balancing method including steps of: using each of a plurality of battery modules to transmit its own battery data to the others of the plurality of battery modules through wired or wireless connection; and, by each of the plurality of battery modules, comparing the battery data respectively of the plurality of battery modules with each other to determine whether or not to adjust its own output voltage, if yes, adjusting the own output voltage, if not, not adjusting the own output voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BP1~BP3:電池模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="356" publication-number="202612571"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612571.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612571</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134355</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置與拼接顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE AND TILED DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120240926B">H10K59/35</main-classification>  
        <further-classification edition="202301120240926B">H10K59/131</further-classification>  
        <further-classification edition="201601120240926B">G09G3/3208</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡乙誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜育維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒雨時</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, YU-SHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">顯示裝置包括第一面板，其包括複數個第一單元。第一單元包括第一子畫素區、第二子畫素區、第三子畫素區、第四子畫素區、第五子畫素區和第六子畫素區。第一子畫素區電連接第二子畫素區，第三子畫素區電連接第四子畫素區，第五子畫素區電連接第六子畫素區。第一子畫素區、第三子畫素區和第五子畫素區具有發光單元，第二子畫素區、第四子畫素區和第六子畫素區為備用子畫素區。第一子畫素區、第三子畫素區和第五子畫素區在第一方向上具有一排列方式，而第二子畫素區、第四子畫素區和第六子畫素區在相反於第一方向的一方向上具有所述排列方式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a first panel including first units. The first unit includes a first sub-pixel area, a second sub-pixel area, a third sub-pixel area, a fourth sub-pixel area, a fifth sub-pixel area and a sixth sub-pixel area. The first sub-pixel area is electrically connected to the second sub-pixel area, the third sub-pixel area is electrically connected to the fourth sub-pixel area, and the fifth sub-pixel area is electrically connected to the sixth sub-pixel area. The first, third and fifth sub-pixel areas include light emitting units, and the second, fourth and sixth sub-pixel areas are spare sub-pixel areas. The first sub-pixel area, the third sub-pixel area and the fifth sub-pixel area have an arrangement way in a first direction, and the second sub-pixel area, the fourth sub-pixel area and the sixth sub-pixel area have the arrangement way in a direction opposite to the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A1:第一顯示部分</p>  
        <p type="p">B1:第一周邊部分</p>  
        <p type="p">DC1:第一驅動電路板</p>  
        <p type="p">DD:顯示裝置</p>  
        <p type="p">DP1:第一顯示面板</p>  
        <p type="p">DR1:第一方向</p>  
        <p type="p">DR2:第二方向</p>  
        <p type="p">E1:第一單元</p>  
        <p type="p">G1:第一排子畫素區</p>  
        <p type="p">G2:第二排子畫素區</p>  
        <p type="p">LU1,LU2,LU3:發光單元</p>  
        <p type="p">PR:畫素區</p>  
        <p type="p">SL1,SL2,SL3,SL4:側邊</p>  
        <p type="p">SPR1,SPR2,SPR3,SPR4,SPR5,SPR6:子畫素區</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="357" publication-number="202611488"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611488.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611488</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134362</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅箔表面的檢測方法</chinese-title>  
        <english-title>DETECTION METHOD OF COPPER FOIL SURFACE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241223B">G01J5/48</main-classification>  
        <further-classification edition="200601120241223B">H05K1/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長春人造樹脂廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG CHUN PLASTICS CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長春石油化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG CHUN PETROCHEMICAL CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大連化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIREN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>衛子健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, TZU-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱寧　卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANNANKUTTY, KALA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何信瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, HSIN YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周瑞昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, JUI CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種銅箔表面的檢測方法，包含黑體接枝作業及表面檢測作業。黑體接枝作業包含以黑體材料對一銅箔表面上改質的一第一官能基進行接枝，以使第一官能基上接枝有黑體材料。其中，黑體材料的表面改質有第二官能基，其能與第一官能基進行接枝。表面檢測作業包含以紅外線熱像儀對接枝有黑體材料的銅箔的表面進行檢測，以得到紅外線熱影像，其能通過對黑體材料成像而對應顯示第一官能基改質於銅箔表面上的分布狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detection method of a copper foil surface includes a blackbody grafting operation and a surface detection operation. The blackbody grafting operation includes grafting a first functional group modified on a surface of a copper foil with a blackbody material, so that the blackbody material is grafted onto the first functional group. A surface of the blackbody material is modified with a second functional group that can be grafted onto the first functional group. The surface detection operation includes using an infrared thermal imager to detect the surface of the copper foil grafted with the blackbody material, to obtain an infrared thermal image, which corresponds to a distribution state of the first functional group modified on the surface of the copper foil, as visualized through imaging of the blackbody material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:銅箔</p>  
        <p type="p">11:表面</p>  
        <p type="p">FN&lt;sub&gt;1&lt;/sub&gt;:第一官能基</p>  
        <p type="p">2:黑體材料</p>  
        <p type="p">FN&lt;sub&gt;2&lt;/sub&gt;:第二官能基</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="358" publication-number="202611953"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611953.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611953</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134367</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>捲繞型電容器封裝結構及其封口元件</chinese-title>  
        <english-title>WOUND CAPACITOR PACKAGE STRUCTURE AND SEALING COMPONENT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241004B">H01G2/10</main-classification>  
        <further-classification edition="200601120241004B">H01G4/248</further-classification>  
        <further-classification edition="200601120241004B">H01G4/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈺邦科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APAQ TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝丞哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIE, CHENG-JHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇忠瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHUNG-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種捲繞型電容器封裝結構及其封口元件。捲繞型電容器封裝結構包括一捲繞式組件、一導電組件、一封裝殼體以及一封口元件。封裝殼體被配置以用於收容捲繞式組件。封口元件設置在封裝殼體的內部且與封裝殼體相互配合，封口元件被配置以用於阻隔捲繞式組件與外界環境的接觸。封裝殼體具有向內凹陷以擠壓封口元件的一圍繞狀內凹限位部以及從圍繞狀內凹限位部凸出以頂抵封口元件的一圍繞狀外凸收尾部。封口元件包括被圍繞狀內凹限位部所擠壓的一彈性封口結構以及用於保護彈性封口結構的一疏油性耐高溫結構。藉此，疏油性耐高溫結構可以被配置以用於使得捲繞型電容器封裝結構在最高150℃的溫度環境下靜置4000小時內仍保有93%以上的初始電容量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a wound capacitor packaging structure and a sealing element thereof. The wound capacitor package structure includes a wound assembly, a conductive assembly, a package casing and a sealing element. The package casing is configured for receiving the wound assembly. The sealing element is disposed inside the package casing and cooperates with the package casing, and the sealing element is configured to block the wound assembly from the external environment. The package casing has a surrounding concave position-limiting portion for inwardly press the sealing element, and a surrounding convex ending portion protruding from the surrounding concave position-limiting portion to abut against the sealing element. The sealing element includes an elastic sealing structure that is pressed by the surrounding concave position-limiting portion and an oleophobic and high-temperature resistant structure for protecting the elastic sealing structure. Therefore, the oleophobic and high-temperature resistant structure can be configured to enable the wound capacitor packaging structure to retain more than 93% of the initial capacitance before being left standing for 4,000 hours at a maximum temperature of 150°C.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S:捲繞型電容器封裝結構</p>  
        <p type="p">1:捲繞式組件</p>  
        <p type="p">2:導電組件</p>  
        <p type="p">21:第一導電接腳</p>  
        <p type="p">211:第一內埋部</p>  
        <p type="p">212:第一裸露部</p>  
        <p type="p">22:第二導電接腳</p>  
        <p type="p">221:第二內埋部</p>  
        <p type="p">222:第二裸露部</p>  
        <p type="p">3:封裝殼體</p>  
        <p type="p">3000:容置開口</p>  
        <p type="p">31:圍繞狀內凹限位部</p>  
        <p type="p">32:圍繞狀外凸收尾部</p>  
        <p type="p">4:封口元件</p>  
        <p type="p">41:彈性封口結構</p>  
        <p type="p">4101:上表面</p>  
        <p type="p">4102:下表面</p>  
        <p type="p">4103:外圍繞表面</p>  
        <p type="p">4104:貫穿孔</p>  
        <p type="p">411:外圍繞凹陷部</p>  
        <p type="p">4110:外圍繞凹陷空間</p>  
        <p type="p">42:疏油性耐高溫結構</p>  
        <p type="p">421:疏油性耐高溫結構層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="359" publication-number="202611925"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611925.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611925</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134369</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及其操作方法</chinese-title>  
        <english-title>MEMORY DEVICE AND OPERATION METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G11C11/54</main-classification>  
        <further-classification edition="200601120241202B">G11C7/06</further-classification>  
        <further-classification edition="200601120241202B">G11C7/16</further-classification>  
        <further-classification edition="200601120241202B">G11C11/21</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺宏電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置，包含記憶體陣列、感測電路及控制電路。記憶體陣列包含多個記憶體單元。多個記憶體單元各自具有第一電阻值或大於第一電阻值的第二電阻值。當多個記憶體單元皆具有第一電阻值時，記憶體陣列的等效電阻值第一等效電阻值。當多個記憶體單元皆具有第二電阻值時，記憶體陣列的等效電阻值等於第二等效電阻值。第二等效電阻值大於第一等效電阻值。感測電路耦接至記憶體陣列，用以感測等效電阻值。控制電路耦接至記憶體陣列，用以調整第二電阻值，使得第二等效電阻值介於感測電路的多個感測準位的其中一者的指定倍數區間之內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device is provided in the present disclosure. The memory device comprises a memory array, a sensing circuit and a control circuit. The memory array comprises a plurality of memory cells. Each of the plurality of memory cells has a first resistance or a second resistance greater than the first resistance. When all of the plurality of memory cells have the first resistance, an equivalent resistance of the memory array is equal to a first equivalent resistance. When all of the plurality of memory cells have the second resistance, the equivalent resistance of the memory array is equal to a second equivalent resistance greater than the first equivalent resistance. The sensing circuit is coupled to the memory array and is configured to sense the equivalent resistance. The control circuit is coupled to the memory array and is configured to adjust the second resistance, so as to make the second equivalent resistance be within a specified multiple range of one of the plurality of sensing levels of the sensing circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">110:記憶體陣列</p>  
        <p type="p">120:感測電路</p>  
        <p type="p">130:控制電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="360" publication-number="202612415"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612415.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612415</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134374</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置與機殼</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND CHASSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">H05K5/02</main-classification>  
        <further-classification edition="200601120241127B">H05K7/12</further-classification>  
        <further-classification edition="200601120241127B">H05K7/14</further-classification>  
        <further-classification edition="200601120241127B">H05K7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋岱融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, TAI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包含殼體、框架件、導軌及擴充卡。殼體包含第一卡扣部及限位槽。框架件可分離地設置於殼體，並包含容置空間。導軌包含本體部、第二卡扣部及限位彈臂。第二卡扣部與限位彈臂連接於本體部。第二卡扣部可分離地設置於相對應的第一卡扣部，並可相對第一卡扣部滑移，以令第二卡扣部卡扣於相對應的第一卡扣部且令限位彈臂可分離地抵頂於相對應的限位槽，使得導軌固定於殼體，或令第二卡扣部與相對應的第一卡扣部相解扣，使得導軌與殼體相分離。擴充卡可移動地設置於本體部，並至少部分位於容置空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a casing, a cage, a guiding rail and an expansion card. The casing includes a first engaging portion and a limiting recess. The cage is detachably disposed on the casing, and includes an accommodating space. The guiding rail includes a body portion, a second engaging portion and a limiting elastic arm. The second engaging portion and the limiting elastic arm are connected to the body portion. The second engaging portion is detachably disposed in the corresponding first engaging portion, and can slide relative to the first engaging portion. Accordingly, the second engaging portion is engaged with the corresponding first engaging portion, and the limiting elastic arm is detachably pressed against the corresponding limiting recess, so that the guiding rail is fixed to the casing. Alternatively, the second engaging portion is disengaged with the corresponding first engaging portion, so that the guiding rail is separated from the casing. The expansion card is movably disposed on the body portion, and is at least partially located in the accommodating space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">11:殼體</p>  
        <p type="p">111:第一卡扣部</p>  
        <p type="p">112:限位槽</p>  
        <p type="p">12:框架件</p>  
        <p type="p">121:底框</p>  
        <p type="p">1211:凸包結構</p>  
        <p type="p">122:側框</p>  
        <p type="p">123:頂框</p>  
        <p type="p">13:導軌</p>  
        <p type="p">131:本體部</p>  
        <p type="p">132:第二卡扣部</p>  
        <p type="p">133:限位彈臂</p>  
        <p type="p">14:擴充卡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="361" publication-number="202611492"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611492.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611492</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於座椅的測試系統和測試方法</chinese-title>  
        <english-title>TEST METHOD AND SYSTEM FOR CHAIRS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241105B">G01M13/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任源企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEN YUAN PLASTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊登任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TENG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種應用於座椅的測試方法適於測試該座椅的一椅部件的特性，且包含以下步驟：控制機械手臂帶動施壓物靠近並推抵關聯於該椅部件的樣品；控制力量感測器偵測經由該施壓物在推抵該樣品時傳遞的反作用力，以產生一力感測值；從該力量感測器接收該力感測值，以判斷該力感測值是否達到一設定值，該設定值是關聯於人類體重；及當該力感測值達到該設定值時，控制該機械手臂帶動該施壓物離開該樣品。上述步驟是由一伺服器根據一預設測試次數反覆執行一測試程序來進行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A test method for chairs is adaptive to test properties of a structural component of the chair and includes steps of: controlling a robotic arm to drive a pressing member to approach and push against a sample associated with the structural component; controlling a pressure sensor to sense a reaction force transmitted through the pressing member pushing against the sample so that the pressure sensor generates a pressure detection value; receiving the pressure detection value from the pressure sensor and determining whether the pressure detection value achieves a preset value associated with a human body weight; and controlling the robotic arm to take the pressing member away from the sample when the pressure detection value achieves the preset value. The foregoing steps are performed by repeatedly executing a test procedure according to a preset number of tests by a server.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="362" publication-number="202611669"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611669.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611669</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134388</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">G06F1/16</main-classification>  
        <further-classification edition="200601120241105B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何凡普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, FANPU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田光召</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, GUANG-ZHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HONG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俞帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括機箱、橫梁模組以及GPU模組。橫梁模組包括橫梁本體，橫梁本體沿第一方向的兩端分別連接於機箱的相對兩個側壁。橫梁本體與機箱圍設形成收容腔，GPU模組設於收容腔內。橫梁本體設有第一連接部以及第一插接部，在第一方向上，第一連接部與第一插接部錯開設置。GPU模組包括GPU顯卡以及第一支架，GPU顯卡具有第一端，第一端朝向橫梁模組，第一端設有第二插接部。第一支架連接於第一端，第一支架包括第二連接部。在第一方向上，第二連接部與第二插接部錯開設置。第一連接部與第二連接部連接配合，第一插接部與第二插接部插接配合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a chassis, a beam module and a GPU module. The beam module includes a beam body, and two ends of the beam body in a first direction are respectively connected to two opposite lateral walls of the chassis. The beam body and the chassis are surrounded to form a receiving cavity, and the GPU module is disposed in the receiving cavity. The beam body is provided with a first connection part and a first insertion part that are alternatively disposed in the first direction. The GPU module includes a GPU graphics card and a first bracket. The GPU graphics card has a first end facing towards the beam module. The first end is provided with a second insertion part. The first bracket is connected to the first end. The first bracket includes a second connection part. The second connection part and the second insertion part are alternatively disposed in the first direction. The first connection part and the second connection part are in a match connection with each other, and the first insertion part and the second insertion part are in a match insertion connection with each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:箱體</p>  
        <p type="p">111:第一開口</p>  
        <p type="p">13:後窗</p>  
        <p type="p">14:收容腔</p>  
        <p type="p">20:橫梁模組</p>  
        <p type="p">21:橫梁本體</p>  
        <p type="p">22:第一連接件</p>  
        <p type="p">30:GPU模組</p>  
        <p type="p">31:GPU顯卡</p>  
        <p type="p">311:第一端</p>  
        <p type="p">3111:第二插接部</p>  
        <p type="p">32:第一支架</p>  
        <p type="p">60:壓接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="363" publication-number="202611445"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611445.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611445</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134397</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空調室內機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241118B">F24F1/0043</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣松下電器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA ELECTRIC (TAIWAN) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳條明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉泰麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種空調室內機，包含一機身，以及一風鼓。該機身包括位於底部的一出風窗體，該出風窗體包括具有一出風口的一出風框，以及並排地設於該出風框的該出風口處的多個垂直羽根，各該垂直羽根具有設於該出風框的一底座，以及可拆地榫接於該底座且朝上延伸的一羽根片體。該風鼓設於該機身內且鄰近於該出風窗體。本發明中該出風窗體上的各該垂直羽根的該羽根片體為可拆式，因此，當空調室內機內的風鼓有清洗需求時，僅拆除各該垂直羽根的該羽根片體便可以針對該風鼓進行清洗，不但能省時省力，且能避免在繁雜的拆裝過程造成零件損壞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">112:垂直羽根</p>  
        <p type="p">114:底座</p>  
        <p type="p">114a:榫接孔</p>  
        <p type="p">114b:榫接部</p>  
        <p type="p">114c:第一定位孔部</p>  
        <p type="p">114d:第二定位孔部</p>  
        <p type="p">114e:第一導角部</p>  
        <p type="p">115:羽根片體</p>  
        <p type="p">115a:榫接柱</p>  
        <p type="p">115b:第一定位柱</p>  
        <p type="p">115c:第二定位柱</p>  
        <p type="p">115d:圓盤部</p>  
        <p type="p">115e:榫接凸塊</p>  
        <p type="p">115f:第二導腳部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="364" publication-number="202611527"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611527.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611527</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134401</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板的偵測裝置及其偵測方法</chinese-title>  
        <english-title>DETECTION DEVICE OF DISPLAY PANEL AND DETECTION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">G01R19/25</main-classification>  
        <further-classification edition="200601120241127B">G09G5/02</further-classification>  
        <further-classification edition="202201120241127B">B60R1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林濬智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JYUN JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃正義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JENG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示面板的偵測裝置及其偵測方法。顯示面板安裝於車輛的車頭且在車輛行駛中顯示車標，偵測裝置包括電流感測電路、類比數位轉換器、以及判斷電路。電流感測電路接收流經顯示面板的面板總電流，以提供電流特徵電壓。類比數位轉換器耦接電流感測電路，以基於電流特徵電壓提供電流特徵資料。判斷電路耦接類比數位轉換器，並且基於電流特徵資料判斷顯示面板是否操作於額定色度範圍，以提供面板狀態信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detection device of a display panel and a detection method thereof are provided. The display panel is installed on the front of a vehicle and displays the vehicle logo while the vehicle is running. The detection device includes a current sensing circuit, an analog-to-digital converter, and a determination circuit. The current sensing circuit receives a total panel current flowing through the display panel to provide a current characteristic voltage. The analog-to-digital converters coupled to the current sensing circuit to provide current characteristic data based on the current characteristic voltage. The determination circuit is coupled to the analog-to-digital converter, and determines whether the display panel operates within a rated chromaticity range based on the current characteristic data to provide a panel status signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:車輛</p>  
        <p type="p">10a:車頭</p>  
        <p type="p">11:顯示面板</p>  
        <p type="p">100:偵測裝置</p>  
        <p type="p">110:電流感測電路</p>  
        <p type="p">120:類比數位轉換器</p>  
        <p type="p">130:判斷電路</p>  
        <p type="p">Dct:電流特徵資料</p>  
        <p type="p">Dindex:面板狀態信號</p>  
        <p type="p">I&lt;sub&gt;uLED&lt;/sub&gt;:面板總電流</p>  
        <p type="p">Vct:電流特徵電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="365" publication-number="202611771"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611771.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611771</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134402</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控處理裝置及觸控處理方法</chinese-title>  
        <english-title>TOUCH PROCESSING DEVICE AND TOUCH PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241001B">G06F30/392</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾耀順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YAO SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種觸控處理裝置及觸控處理方法。觸控處理裝置包括處理氣、觸控控制器以及觸控螢幕。觸控螢幕包括第一觸控區域及第二觸控區域。第一觸控區域及第二觸控區域是基於特定應用被劃分。在觸控處理裝置進入或執行特定應用時，處理器控制觸控控制器來對第一觸控區域進行觸控感測，並禁能第二觸控區域。在觸控處理裝置並未進入特定應用時，處理器控制觸控控制器來對第一觸控區域及第二觸控區域進行觸控感測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A touch processing device and a touch processing method are provided. The touch processing device includes a processor, a touch controller, and a touch screen. The touch screen comprises a first touch area and a second touch area. The first and second touch areas are defined based on a specific application. When the touch processing device enters or executes the specific application, the processor controls the touch controller to sense touching in the first touch area and disable the second touch area. When the touch processing device is not in the specific application, the processor controls the touch controller to sense touching in the first touch area and in the second touch area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:處理器</p>  
        <p type="p">120:觸控控制器</p>  
        <p type="p">130:觸控螢幕</p>  
        <p type="p">TA1:第一觸控區域</p>  
        <p type="p">TA2:第二觸控區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="366" publication-number="202611760"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611760.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611760</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於使用者行為的零信任環境信任推斷系統及其方法</chinese-title>  
        <english-title>TRUST INFERENCE SYSTEM AND METHOD IN ZERO TRUST ENVIRONMENT BASED ON USER BEHAVIOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241007B">G06F21/44</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳少謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHAO-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃秀娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSIU-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於使用者行為的零信任環境信任推斷系統及其方法，包括權限檢查模組、異常行為偵測模組、異常原因生成模組及補償措施與雙因子認證模組。權限檢查模組對使用者的操作請求進行權限驗證。異常行為偵測模組用以判斷操作請求是否存在異常行為。異常原因生成模組用以於操作請求存在異常行為時，依據異常行為與歷史存取資料生成異常原因說明。補償措施與雙因子認證模組依據異常原因說明選擇雙因子認證方式並傳送至使用者，使用者依據雙因子認證方式進行認證，以獲取認證結果，依據認證結果判斷是否允許操作請求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A trust inference system and method in zero trust environment based on user behavior are provided, including a permission check module, an abnormal behavior detection module, an abnormal cause generation module and a compensation measure and two-factor authentication module. The permission check module performs a permission verification on a user's operation request. The abnormal behavior detection module is used to identify whether there is abnormal behavior in the operation request. The abnormal cause generation module is used to generate an abnormal cause description according to the abnormal behavior and historical access data when there is abnormal behavior in the operation request. The compensation measure and two-factor authentication module select a two-factor authentication method according to the abnormal cause description and send it to the user. The user authenticates according to the two-factor authentication method to obtain an authentication result, and determines whether to allow the operation request according to the authentication result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基於使用者行為的零信任環境信任推斷系統</p>  
        <p type="p">110:權限檢查模組</p>  
        <p type="p">120:權限資料庫</p>  
        <p type="p">130:異常行為偵測模組</p>  
        <p type="p">140:歷史存取紀錄資料庫</p>  
        <p type="p">150:異常原因生成模組</p>  
        <p type="p">160:補償措施資料庫</p>  
        <p type="p">170:補償措施與雙因子認證模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="367" publication-number="202612444"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612444.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612444</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134417</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241001B">H10B12/00</main-classification>  
        <further-classification edition="202301120241001B">H10N97/00</further-classification>  
        <further-classification edition="200601120241001B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳家銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAO-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何建廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHIEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置的製造方法包括以下步驟。在基板之上形成導電材料層。在導電材料層上形成硬罩幕層。以硬罩幕層為遮罩，圖案化導電材料層，以形成導電接墊。在導電接墊及硬罩幕層上形成覆蓋層。移除部分覆蓋層及硬罩幕層，以暴露出導電接墊的頂面。在導電接墊上形成電容器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of a semiconductor device includes the following steps. A conductive material layer is formed over a substrate. A hard mask layer is formed on the conductive material layer. Using the hard mask layer as a mask, the conductive material layer is pattered to form a conductive pad. A cover layer is formed on the conductive pad and the hard mask layer. A portion of the cover layer and the hard mask layer are removed to expose a top surface of the conductive pad. A capacitor is formed on the conductive pad.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">100:基板</p>  
        <p type="p">102:基底</p>  
        <p type="p">104:隔離結構</p>  
        <p type="p">108:位元線結構</p>  
        <p type="p">108a:位元線接觸窗</p>  
        <p type="p">108b:位元線</p>  
        <p type="p">108c:硬罩幕層</p>  
        <p type="p">109:接觸窗</p>  
        <p type="p">110:導電接墊</p>  
        <p type="p">130’:覆蓋層</p>  
        <p type="p">140:介電層</p>  
        <p type="p">162,164:支撐層</p>  
        <p type="p">170:電容器</p>  
        <p type="p">172:下電極</p>  
        <p type="p">174:介電層</p>  
        <p type="p">174a:第一介電層</p>  
        <p type="p">174b:第二介電層</p>  
        <p type="p">174c:第三介電層</p>  
        <p type="p">176:上電極</p>  
        <p type="p">AA:主動區</p>  
        <p type="p">BS:底面</p>  
        <p type="p">g2:氣隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="368" publication-number="202610601"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610601.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610601</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134426</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>口腔定位件</chinese-title>  
        <english-title>ORAL POSITIONING COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">A61C8/00</main-classification>  
        <further-classification edition="200601120241029B">A61C11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡東霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁麗雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, LI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳邦俠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BANG-SIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳茵慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YIN-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王躍鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUE-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王珮驊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PEI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種口腔定位件，用以解決習知的改善睡眠呼吸中止症的方法具有手術風險的問題。係包含：一上固定套，具有一容槽，一外側壁及一內側壁分別位於該容槽的相對二側；一下固定套，具有一容槽，一外側壁及一內側壁分別位於該下固定套的容槽的相對二側；及二定位件，分別連接該上固定套與該下固定套，使該下固定套相較於該上固定套突出一突出距離。藉此可以防止使用者在睡眠中因舌根肌肉造成呼吸阻塞的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An oral positioning component is used to solve the problem of surgical risks associated with the conventional method of improving sleep apnea. Includes: an upper fixed sleeve with a container, an outer wall and an inner wall located on opposite sides of the container; a lower fixed sleeve with a container, an outer wall and an inner wall located on opposite sides of the container of the lower fixed sleeve; and two positioning members respectively connecting the upper fixed sleeve and the lower fixed sleeve, so that the lower fixed sleeve protrudes a protruding distance compared to the upper fixed sleeve. This can prevent users from breathing obstruction caused by tongue base muscles during sleep.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:上固定套</p>  
        <p type="p">11,21:容槽</p>  
        <p type="p">12,22:外側壁</p>  
        <p type="p">13,23:內側壁</p>  
        <p type="p">14,24:栓部</p>  
        <p type="p">2:下固定套</p>  
        <p type="p">3:定位件</p>  
        <p type="p">31:第一連接段</p>  
        <p type="p">31a,32a:結合孔</p>  
        <p type="p">32:第二連接段</p>  
        <p type="p">33:彈性部</p>  
        <p type="p">4:壓舌件</p>  
        <p type="p">41:導流孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="369" publication-number="202612391"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612391.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612391</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134427</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H05F3/04</main-classification>  
        <further-classification edition="200601120241007B">G09G3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>睿生光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOCARE OPTOELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳省逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHENG-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置，其包括掃描線、主動元件、內部短路環以及靜電防護元件。主動元件設置於主動區中，且與掃描線電性連接。內部短路環設置於周邊區中，且環繞主動區。靜電防護元件設置於周邊區中，且與內部短路環以及掃描線電性連接。靜電防護元件為電晶體且包括閘極電極、第一源極/汲極電極、第二源極/汲極電極以及半導體層，閘極電極處於浮接的狀態，第一源極/汲極電極與內部短路環耦接，且第二源極/汲極電極與掃描線耦接。閘極電極與第一源極/汲極電極之間的第一寄生電容大於閘極電極與第二源極/汲極電極之間的第二寄生電容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device including a scan line, an active element, an inner short ring and an electrostatic protection element. The active element is disposed in an active area and is electrically connected to the scan line. The inner short ring is disposed in a peripheral area and surrounds the active area. The electrostatic protection element is disposed in the peripheral area and is electrically connected to the inner short ring and the scan line. The electrostatic protection element is a transistor and includes a gate electrode, a first source/drain electrode, a second source/drain electrode and a semiconductor layer. The gate electrode is in a floating state, and the first source/drain electrode is coupled to the inner short ring, and the second source/drain electrode is coupled to the scan line. A first parasitic capacitance between the gate electrode and the first source/drain electrode is greater than a second parasitic capacitance between the gate electrode and the second source/drain electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:靜電防護元件</p>  
        <p type="p">G:閘極電極</p>  
        <p type="p">L1a、L2a:長度</p>  
        <p type="p">SD1、SD2:源極/汲極電極</p>  
        <p type="p">SE:半導體層</p>  
        <p type="p">W1a、W2a:寬度</p>  
        <p type="p">d1、d2:方向</p>  
        <p type="p">z:法線方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="370" publication-number="202612313"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612313.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612313</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134431</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊系統與通訊方法</chinese-title>  
        <english-title>COMMUNICATION SYSTEM AND COMMUNICATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241007B">H04L49/90</main-classification>  
        <further-classification edition="200601120241007B">G06F13/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祥碩科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASMEDIA TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳玟丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭淵綜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, IUAN-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許明翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, MING-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種通訊系統與通訊方法，此通訊系統包含多個現場可程式化邏輯閘陣列(Field Programmable Gate Array，FPGA)裝置。每個FPGA裝置電性連接至另一個現場可程式化邏輯閘陣列裝置。第一現場可程式化邏輯閘陣列裝置用以決定一封包的格式。當封包的格式屬於第一傳輸格式或是第二傳輸格式，第一現場可程式化邏輯閘陣列裝置在封包加入路由資訊，並將封包傳送至第二現場可程式化邏輯閘陣列裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a communication system and a communication method. The communication system includes multiple Field Programmable Gate Array (FPGA) devices. Each FPGA device is electrically connected to another FPGA device. A first FPGA device determines a format of a packet. When the packet format belongs to either a first transmission format or a second transmission format, the first FPGA device adds routing information to the packet and transmits the packet to a second FPGA device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101~103:現場可程式化邏輯閘陣列裝置</p>  
        <p type="p">111,112,121,122,131,132:連接埠</p>  
        <p type="p">151~153,161~163,171~173:模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="371" publication-number="202612376"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612376.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612376</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>匹配移動裝置與物件的方法和電子裝置</chinese-title>  
        <english-title>METHOD AND ELECTRONIC DEVICE OF MATCHING MOBILE DEVICE AND OBJECT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250102B">H04W64/00</main-classification>  
        <further-classification edition="201801120250102B">H04W4/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王韋程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種匹配移動裝置與物件的方法和電子裝置。方法包含：接收第一移動裝置的第一定位資訊和第一物件的第一感測資訊；根據第一定位資訊和第一感測資訊判斷第一移動裝置與第一物件是否位在第一區域中；響應於判斷第一移動裝置與第一物件位在第一區域中而匹配第一移動裝置與第一物件以產生匹配結果；以及輸出匹配結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and an electronic device of matching a mobile device and an object are provided. The method includes: receiving first positioning information of a first mobile device and first sensed information of a first object; determining whether the first mobile device and the first object are located in a first area according to the first positioning information and the first sensed information; in response to determining the first mobile device and the first object are located in the first area, matching the first mobile device with the first object to generate a matching result; and outputting the matching result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S102,S103,S104:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="372" publication-number="202612173"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612173.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612173</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134433</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">H01Q11/08</main-classification>  
        <further-classification edition="200601120240927B">H01Q1/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和碩聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGATRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖志威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張桓嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUAN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳朝旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHAO-HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　浩元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, HAU YUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宗祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSUNG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括一主機板、一金屬屏蔽罩體、一近場通訊(NFC)天線模組及一屏蔽件。金屬屏蔽罩體罩設於主機板的一側，且包括遠離主機板的一頂面及凹陷於頂面的一容置槽。近場通訊天線模組設置於容置槽內，近場通訊天線模組訊號連接於主機板。屏蔽件設置於頂面，且包括對應於近場通訊天線模組的一感應區，其中感應區包括多個貫穿口及位於這些貫穿口之間的一支撐結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a motherboard, a metal shielding cover, a near field communication (NFC) antenna module and a shield. The metal shielding cover covers one side of the motherboard, and includes a top surface away from the motherboard and an accommodating groove recessed in the top surface. The near field communication antenna module is disposed in the accommodating groove, and the near field communication antenna module is connected to the motherboard in a signal manner. The shield is disposed on the top surface and includes a sensing area corresponding to the near field communication antenna module, the sensing area includes through-holes and a support structure located between the through-holes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">θ:夾角</p>  
        <p type="p">D:法線方向</p>  
        <p type="p">H:高度</p>  
        <p type="p">W:寬度</p>  
        <p type="p">100:電子裝置</p>  
        <p type="p">110:主機板</p>  
        <p type="p">120:金屬屏蔽罩體</p>  
        <p type="p">122:頂面</p>  
        <p type="p">124:容置槽</p>  
        <p type="p">126:底面</p>  
        <p type="p">128:斜面</p>  
        <p type="p">130:近場通訊天線模組</p>  
        <p type="p">131:絕緣層</p>  
        <p type="p">132:第一面</p>  
        <p type="p">133:第二面</p>  
        <p type="p">134:第一線圈組</p>  
        <p type="p">135:第二線圈組</p>  
        <p type="p">136:線圈</p>  
        <p type="p">140:屏蔽件</p>  
        <p type="p">141:感應區</p>  
        <p type="p">142:貫穿口</p>  
        <p type="p">143:支撐結構</p>  
        <p type="p">150:觸控顯示層</p>  
        <p type="p">155:蓋板</p>  
        <p type="p">160:金屬背蓋</p>  
        <p type="p">170:鐵氧體磁性片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="373" publication-number="202611453"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611453.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611453</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模組化窯爐發熱體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F27B7/36</main-classification>  
        <further-classification edition="200601120241105B">B27B5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦文隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, WEN LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦文隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, WEN LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種模組化窯爐發熱體，其主要包括有一發熱元件，該發熱元件外緣具有以耐熱陶瓷材料燒結預定外形的絕緣保護層，該絕緣保護層內緣設有預定外形以導熱耐火材料構成的導熱層，而構成發熱體，該發熱體相對於窯爐加熱面之內緣為加熱空間，發熱體與窯爐體間則具有以斷熱耐火材料構成之斷熱耐火層，發熱元件係對導熱層加熱，而令發熱體發熱；本發明可視實際需要將單一模組發熱體組合於窯爐內預定位置，該每一模組發熱體為獨立電源控制各別溫度，除具有能控制爐內各別溫度之功效外，更具有避免發熱元件碰撞損壞、感電及避免窯爐內燒結產生的揮發物及氣氛環境長期接觸發熱元件後造成之污染、侵蝕致減短壽命，以及避免發熱元件與導熱耐火材料長期接觸後造成之氧化、減短壽命之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:發熱體</p>  
        <p type="p">10:發熱元件</p>  
        <p type="p">11:絕緣保護層</p>  
        <p type="p">12:導熱層</p>  
        <p type="p">13:加熱空間</p>  
        <p type="p">20:斷熱耐火層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="374" publication-number="202611891"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611891.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611891</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134438</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置與溫度補償方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND TEMPERATURE COMPENSATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241007B">G09G3/32</main-classification>  
        <further-classification edition="200601120241007B">G09G3/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鈞正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JUN ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泓鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HONG JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬宗林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, TSUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種顯示裝置與溫度補償方法。此方法包括：透過溫度感測器取得溫度值，其中溫度感測器對應至顯示面板中像素陣列的一區域，此區域包含多個像素結構；設定上述區域中的降取樣位置，並接收對應至降取樣位置的子像素值；根據溫度值取得降取樣位置上的補償溫度值；根據子像素值以及補償溫度值查詢查找表以得到補償值；以及根據子像素值以及補償值產生驅動值以驅動位於降取樣位置的像素結構，並根據驅動值更新查找表。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a display device and a temperature compensation method. This method includes: obtaining a temperature value through a temperature sensor which corresponds to a region of a pixel array in a display panel, in which the region contains multiple pixel structures; setting a down-sampling position in the aforementioned region and receiving a sub-pixel value corresponding to the down-sampling position; obtaining a compensation temperature value at the down-sampling position based on the temperature value; querying a lookup table according to the sub-pixel value and the compensation temperature value to obtain a compensation value; and generating a driving value based on the sub-pixel value and compensation value to drive the pixel structure at the down-sampling position, and updating the lookup table based on the driving value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">801~805:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="375" publication-number="202612215"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612215.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612215</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134452</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分散式能源管理系統</chinese-title>  
        <english-title>DECENTRALIZED ENERGY MANAGEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H02J13/00</main-classification>  
        <further-classification edition="202401120241007B">G06Q50/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇辰系統科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU-CHEN SYSTEM TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俞境</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃培熏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PEI-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林清海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范漢君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, HAN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何瑞祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, JUI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分散式能源管理系統，係與一使用端設備及至少一個場域內之電力端設備電性連接，該分散式能源管理系統係包含有至少一個服務端管理單元及一使用端管理單元，該服務端管理單元與該使用端管理單元係能夠進行連線，該服務端管理單元係與該電力端設備進行連線，以收集該電力端設備之狀態資料，而該使用端管理單元係與該使用端設備進行連線，並能夠依據該服務端管理單元收集之電力端設備的狀態資料與該使用端設備提供之交易需求內容進行比對，若符合需求，則由該使用端管理單元傳送設定參數給該服務端管理單元，並由該服務端管理單元依據該設定參數進行調整該電力端設備之運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a decentralized energy management system, which is electrically connected to a user device and at least one power device in the field. The system includes at least one server management unit and a user management unit, which are connected to each other. The server management unit is connected to a power device to collect status data of the power device. The user management unit is connected to a user device and compares the status data of the power device collected by the server management unit with the transaction requirement content provided by the user device. When the requirements are met, the user management unit transmits the setting parameters to the server management unit, and the server management unit adjusts the operation of the power device according to the setting parameters.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:使用端設備</p>  
        <p type="p">4:伺服器設備</p>  
        <p type="p">421:使用端管理單元</p>  
        <p type="p">5:場域</p>  
        <p type="p">51:電力端設備</p>  
        <p type="p">52:伺服器設備</p>  
        <p type="p">5221:服務端管理單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="376" publication-number="202611941"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611941.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611941</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134453</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以預測敗血症之發生的系統</chinese-title>  
        <english-title>SYSTEMS FOR PREDICTING ONSET OF SEPSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250325B">G16H50/20</main-classification>  
        <further-classification edition="202301120250325B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣基督長老教會馬偕醫療財團法人馬偕紀念醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACKAY MEMORIAL HOSPITAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立陽明交通大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫芳如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, FANG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫坤品</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, KUN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉宏一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, HUNG-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭立國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, LI-KUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭廣華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KUANG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡亭宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, TING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳旻靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MIN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭聰貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, TSUNG-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張博仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, PO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鴻亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何美瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛珮雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容是關於一種用以預測一個體產生敗血症之機率的系統。依據本揭示內容某些實施方式，所述系統包含一非暫態之處理器可讀取的媒體、一與非暫態之處理器可讀取的媒體連接的處理器，以及一與處理器連接的顯示器，其中所述處理器係用以接收個體之複數筆特徵資料，並以一深度學習架構處理複數筆特徵資料，以得到個體產生敗血症之機率值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is a system for predicting the probability of developing sepsis in a subject. According to some embodiments of the present disclosure, the system comprises a non-transitory processor-readable medium, a processor communicably coupled to the non-transitory processor-readable medium, and a display communicably coupled to the processor, in which the processor is configured to receive a plurality of feature data from the subject, and then process the received feature data with a deep learning architecture to predict the probability of developing sepsis in the subject.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:系統</p>  
        <p type="p">12:非暫態之處理器可讀取的媒體</p>  
        <p type="p">14:處理器</p>  
        <p type="p">16:顯示器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="377" publication-number="202610703"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610703.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610703</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具多媒體直播系統化麻將桌</chinese-title>  
        <english-title>SYSTEMATIC MAHJONG TABLE WITH MULTIMEDIA AND STREAMING FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A63F9/20</main-classification>  
        <further-classification edition="200601120240929B">G06F3/14</further-classification>  
        <further-classification edition="202201120240929B">G06V10/00</further-classification>  
        <further-classification edition="202201120240929B">G06V20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHIA-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李豐聿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, FENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHENG-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHIA-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李豐聿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, FENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHENG-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏福楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具多媒體直播系統化麻將桌，其具有一頂板，該頂板設有至少一顯示器與至少一攝像器，另有一主控器同時電性連接至各該顯示器、各該攝像器與一連線模組，藉此人員於該頂板上進行麻將賽事時，該攝像器可攝錄下賽事畫面，並由該主控器透過該連線模組將賽事畫面傳送至直播伺服器，該顯示器則可顯示各項當前賽事資訊給參賽者觀看，而因本發明整合有影像攝錄與直播傳訊功能，所以可解決過往要進行直播時需要花費許多時間設置各項器材的缺點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention related to a systematic mahjong table with multimedia and streaming function includes a top plate. The top plate disposed with at least a displayer and at least a camera. A controller electrically connected to each displayer, each camera and a connecting module. When people playing mahjong game on the top plate, the camera can record it and the recorded data would be transported to the streaming server through the connecting module. The displayer can show different game information for participants. Because the present invention integrates the recording and streaming function, the drawback about spending too much time on preparing the equipment before streaming can be solved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:桌體</p>  
        <p type="p">11:頂板</p>  
        <p type="p">12:牌槽</p>  
        <p type="p">13:容槽</p>  
        <p type="p">14:基座</p>  
        <p type="p">2:顯示傳訊組件</p>  
        <p type="p">21:主控器</p>  
        <p type="p">22:連線模組</p>  
        <p type="p">23:顯示器</p>  
        <p type="p">24:攝像器</p>  
        <p type="p">25:活動支架</p>  
        <p type="p">251:轉向件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="378" publication-number="202611462"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611462.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611462</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提高流動沸騰熱傳效率的散熱器</chinese-title>  
        <english-title>HEAT DISSIPATION DEVICE WITH IMPROVED HEAT TRANSFER EFFICIENCY OF FLOW BOILING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">F28F1/04</main-classification>  
        <further-classification edition="200601120250328B">H01L23/473</further-classification>  
        <further-classification edition="200601120250328B">H01L23/367</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺南大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY OF TAINAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宜庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YEE TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊安石</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李育獻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高浩敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種提高流動沸騰熱傳效率的散熱器。包括有一散熱器主體，該散熱器主體有一散熱面，在該散熱器主體中並有一流道沿該散熱面延伸，該流道有相鄰該散熱面之一第一流道面以及遠離該散熱面之一第二流道面，該第二流道面的接觸角不小於該第一流道面的接觸角。將該散熱器主體之散熱面貼附一熱源，並於該流道中通入一冷卻流體，藉以對該熱源散熱。透過該第二流道面的接觸角不小於該第一流道面的接觸角可使冷卻流體沸騰產生的氣泡加速脫離該第一流道面並於該第二流道面附著鋪展，有效抑制氣泡附著於該第一流道面產生乾燒以及氣泡堵塞的問題，可提升熱傳性能並減少壓降。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:散熱器主體</p>  
        <p type="p">11:散熱面</p>  
        <p type="p">12:微流道</p>  
        <p type="p">121:流道面</p>  
        <p type="p">122:疏水性表面</p>  
        <p type="p">2:熱源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="379" publication-number="202612120"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612120.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612120</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模壓設備及方法</chinese-title>  
        <english-title>MOLDING EQUIPMENT AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H01L23/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬子茵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, TZU-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林榮政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, RUNG-JENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種模壓設備及方法，主要在電子模組上設置封裝膠材後，並於模壓作業前，將該電子模組設於具旋轉擴散封裝膠材功能之運動載台上，利用離心旋轉的方式將封裝膠材先擴散佈設到電子模組大部分面積，再進行模壓作業，以解決習知模壓作業中，封裝膠材未預先擴散，導致模壓作業後產生氣洞問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A molding equipment and method, wherein after setting packaging material on an electronic module, and before molding operation, the electronic module is placed on a moving structure with the function of rotating and diffusing the packaging material. The packaging material is first diffused and laid out to most of the area of the electronic module, by using centrifugal rotation, and then the molding operation is performed to solve the problem of voids after the molding operation due to the fact that the packaging material is not diffused in advance in the conventional molding operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:運動載台</p>  
        <p type="p">2:電子模組</p>  
        <p type="p">30:封裝膠材</p>  
        <p type="p">4:移動裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="380" publication-number="202611672"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611672.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611672</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134462</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浸沒式冷卻模組、多層浸沒式冷卻系統及其方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">G06F1/20</main-classification>  
        <further-classification edition="200601120241127B">H05K7/20</further-classification>  
        <further-classification edition="200601120241127B">F28D1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明曜科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETI CA BATTERY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳偉臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種浸沒式冷卻模組、多層浸沒式冷卻系統及其方法，其中多層浸沒式冷卻系統包括複數個浸沒式冷卻模組。浸沒式冷卻模組包括主槽體及溢流板。主槽體具有槽底部與分隔部，分隔部將主槽體分隔定義成儲液槽與暫存槽，儲液槽的上方設有進液口，儲液槽的內部可容納冷卻液與待冷卻模組，暫存槽的下方設有出液口。溢流板設在主槽體內，且溢流板的高度小於分隔部的高度。當冷卻液超過溢流板的高度時，冷卻液從儲液槽溢流至暫存槽，最終經出液口排出，實現冷卻液的循環。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:多層浸沒式冷卻系統</p>  
        <p type="p">1A、1A’:浸沒式冷卻模組</p>  
        <p type="p">10:主槽體</p>  
        <p type="p">102:進液口</p>  
        <p type="p">104:出液口</p>  
        <p type="p">20:溢流板</p>  
        <p type="p">200A、200B:待冷卻模組</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="381" publication-number="202611479"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611479.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611479</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134471</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>堆料體積測量方法及堆料體積測量系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">G01B11/03</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>乾坤測繪科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN-KUN SURVEYING &amp; MAPPING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張坤樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>饒見有</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種堆料體積測量方法及堆料體積測量系統，供測量一堆料的體積。該堆料體積測量方法包含：提供環繞一堆場的複數個影像並傳輸至一儲存裝置；透過一處理裝置讀取該儲存裝置的該些影像，並計算相鄰的二該影像之間的一重疊率，篩選出複數個過濾影像；對該些過濾影像進行影像增顯，以形成複數個增顯影像；於該些增顯影像中偵測該些控制點，並獲取各該控制點的一影像座標；計算該堆場與該堆料表面的複數個三維點雲，並生成一數值地表模型；將該數值地表模型減去一數值地形模型以獲取一數值堆料模型；以及計算該數值堆料模型之一體積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S18:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="382" publication-number="202611473"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611473.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611473</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動靶機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">F41J5/18</main-classification>  
        <further-classification edition="200601120241029B">F41J5/04</further-classification>  
        <further-classification edition="200601120241029B">F41J1/10</further-classification>  
        <further-classification edition="200601120241029B">F41J7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>震聯實業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宜賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王榮輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電動靶機，包含：一電源供應器用於接收一外部電源並調整該外部電源的電壓及電流以適配該電動靶機的需要；該外部電源連接市電或是該電源供應器連接一電池；一驅動機構連接該電源供應器；一驅動馬達連接該驅動機構；該驅動機構接收外部的動作而發出訊號，使得該驅動馬達做出對應的動作；一靶機動作機構連接該驅動馬達；以及一靶板連接該靶機動作機構，該靶機動作機構受該驅動馬達的連動，而驅動該靶板使得該靶板可以左右移動及仰倒動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:電源供應器</p>  
        <p type="p">11:外部電源</p>  
        <p type="p">15:驅動機構</p>  
        <p type="p">20:驅動馬達</p>  
        <p type="p">25:靶機動作機構</p>  
        <p type="p">30:靶板</p>  
        <p type="p">35:天線</p>  
        <p type="p">40:RF模組</p>  
        <p type="p">42:訊號線</p>  
        <p type="p">52:中彈感應器</p>  
        <p type="p">54:中彈檢知器</p>  
        <p type="p">56:可程式控制器</p>  
        <p type="p">58:計分器</p>  
        <p type="p">59:計分顯示器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="383" publication-number="202610868"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610868.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610868</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134478</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拖車之煞車系統</chinese-title>  
        <english-title>BRAKE SYSTEM FOR TRAILER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">B60T13/00</main-classification>  
        <further-classification edition="200601120241029B">B60T13/12</further-classification>  
        <further-classification edition="200601120241029B">B60T13/66</further-classification>  
        <further-classification edition="200601120241029B">B60T17/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃爾奇動力機電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VALSCH DYNAMIC MECHATRONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊安陶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, AN-TAO ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種拖車之煞車系統，能夠讓具有滑動型聯結裝置之拖車根據曳引車輛的行進方向及加速度，驅動制動裝置對碟盤施加制動力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a brake system for trailer having a sliding type coupling for driving the brake device to apply braking force on the brake disc or the brake drum according to the travel direction and the acceleration of the towing vehicle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:車體結構</p>  
        <p type="p">111:碟盤</p>  
        <p type="p">112:制動裝置</p>  
        <p type="p">114:流體管路</p>  
        <p type="p">115:制動源</p>  
        <p type="p">120:滑動型聯結裝置</p>  
        <p type="p">121:連結座</p>  
        <p type="p">122:滑動軸</p>  
        <p type="p">123:固定軸</p>  
        <p type="p">131:制動控制裝置</p>  
        <p type="p">201:感測器</p>  
        <p type="p">202:倒車訊號源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="384" publication-number="202610779"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610779.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610779</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝導線架的製作方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF PACKAGE LEAD FRAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B24C1/00</main-classification>  
        <further-classification edition="200601120241007B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>健策精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JENTECH PRECISION INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張建財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JIAN-TSAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虞晉瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIN-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃正東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JHENG-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳東融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TUNG JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種噴砂治具用於讓導線架之半蝕刻狹孔接受噴砂作業，且噴砂治具包含一下模具、一上模具及一定位組件。上模具包含一上蓋板及一噴砂狹孔。下模具包含一下蓋板。上蓋板可移除地蓋合至下蓋板上。噴砂狹孔貫穿地位於上蓋板上，且噴砂狹孔與半蝕刻狹孔具有相同外型。定位組件連接上蓋板，讓導線架固定於上蓋板上，並讓上蓋板完全遮蔽導線架之一面及噴砂狹孔完全重疊且曝露出半蝕刻狹孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sandblasting fixture is used to allow a half-etched elongated hole of a lead frame to be processed a sandblasting operation, and includes a lower mold, an upper mold and a positioning component. The lower mold includes a lower cover plate. The upper mold includes an upper cover plate and a sandblasting elongated hole. The upper cover plate removably covers the lower cover plate. The sandblasting elongated hole is formed on the upper cover plate, and featured with the same appearance with the half-etched elongated hole. The positioning component is connected to the upper cover to allow the lead frame to be fixed on the upper cover so that the upper cover plate can completely cover a top surface of the lead frame, and the half-etched elongated hole of the lead frame can be completely overlapped and exposed by the sandblasting elongated hole.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:下模具</p>  
        <p type="p">110:下蓋板</p>  
        <p type="p">111:第一上表面</p>  
        <p type="p">112:第一下表面</p>  
        <p type="p">120:容銷孔</p>  
        <p type="p">200:上模具</p>  
        <p type="p">210:上蓋板</p>  
        <p type="p">211:第二上表面</p>  
        <p type="p">212:第二下表面</p>  
        <p type="p">220:噴砂狹孔</p>  
        <p type="p">300:定位組件</p>  
        <p type="p">310:定位銷</p>  
        <p type="p">400:導線架</p>  
        <p type="p">410:頂面</p>  
        <p type="p">420:底面</p>  
        <p type="p">430:半蝕刻狹孔</p>  
        <p type="p">440:貫穿溝槽</p>  
        <p type="p">450:狹長階梯部</p>  
        <p type="p">451:直內壁</p>  
        <p type="p">452:橫內壁</p>  
        <p type="p">460:定位孔</p>  
        <p type="p">AA:線段</p>  
        <p type="p">g:間隙</p>  
        <p type="p">X,Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="385" publication-number="202611886"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611886.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611886</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螢幕閃爍方法與應用此螢幕閃爍方法之顯示裝置</chinese-title>  
        <english-title>SCREEN FLICKER METHOD AND DISPLAY DEVICE USING THE SCREEN FLICKER METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G09G3/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖亦婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAW, YI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林晉安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田堃正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN, KUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種螢幕閃爍方法與應用此螢幕閃爍方法之顯示裝置。此顯示裝置包含記憶體與處理器。處理器係用以載入記憶體之指令，以進行螢幕閃爍方法。螢幕閃爍方法包含：提供第一伽瑪曲線、第二伽瑪曲線以及第三伽瑪曲線；於顯示裝置之顯示畫面上定義複數個第一顯示區塊、複數個第二顯示區塊以及複數個第三顯示區塊；依序進行第一顯示操作、第二顯示操作以及第三顯示操作中，以於每個顯示操作中，控制顯示裝置來使上述顯示區塊分別對應上述伽瑪曲線來進行顯示。其中，每個顯示操作中的顯示區塊與伽瑪曲線的對應關係皆不相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A screen flicker method and a display device using the screen flicker method are provided. The display device includes a memory and a processor. The processor is configured to load instructions stored in the memory to execute the screen flicker method. Thee screen flicker method includes: providing a first gamma curve, a second gamma curve and a third gamma curve; defining first display blocks, second display blocks and third display blocks; sequentially performing a first display operation a second display operation and a third display operation to control the display device to display in accordance with the above gamma curves in each of the display operations. The display operations have relationships between the display blocks and the gamma curves, and the relationships are different one another.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:螢幕閃爍方法</p>  
        <p type="p">110~150:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="386" publication-number="202610546"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610546.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610546</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134488</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水產養殖用飼料添加劑、包含雙亞硝基鐵錯合物之水產養殖用飼料及雙亞硝基鐵錯合物於製備水產養殖用飼料之用途</chinese-title>  
        <english-title>FEED ADDITIVES FOR AQUACULTURE, AQUACULTURE FEEDS CONTAINING DINITROSYL IRON COMPLEX, AND USES OF DINITROSYL IRON COMPLEX IN PREPARING AQUACULTURE FEEDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250415B">A23K20/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昇泉生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENGQUAN BIOTECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯才德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, TSAI TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖玉惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種水產養殖用飼料添加劑，包含雙亞硝基鐵錯合物，具有式（I）之化學式： &lt;br/&gt;&lt;img align="absmiddle" height="142px" width="271px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中，R是C &lt;sub&gt;1-6&lt;/sub&gt;烷基（Alkyl Group）、可經-OH、-COOH或-NH &lt;sub&gt;2&lt;/sub&gt;取代的C &lt;sub&gt;1-6&lt;/sub&gt;烷基或苯基，或C &lt;sub&gt;1-6&lt;/sub&gt;羧基。本發明亦提供一種水產養殖用飼料，包含上述雙亞硝基鐵錯合物；本發明亦提供一種水產養殖業之生產方法，以及雙亞硝基鐵錯合物用於製備水產養殖用飼料之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a feed additive for aquaculture, including a dinitrosyl iron complex having the chemical formula of formula (I): &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="149px" width="276px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein R is a C &lt;sub&gt;1-6&lt;/sub&gt;alkyl Group, an -OH、-COOH, or -NH &lt;sub&gt;2&lt;/sub&gt;replaced C &lt;sub&gt;1-6&lt;/sub&gt;alkyl group or phenyl group, or a C &lt;sub&gt;1-6&lt;/sub&gt;carboxyl group. The present invention also provides an aquaculture feed comprising the above-described dinitrosyl iron complex; the present invention also provides a production method for aquaculture and the use of the dinitrosyl iron complex for preparing an aquaculture feed.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="387" publication-number="202610571"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610571.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610571</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134494</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防風衣架</chinese-title>  
        <english-title>WIND-PROOF HANGER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240918B">A47G25/06</main-classification>  
        <further-classification edition="200601120240918B">A47G25/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周聰佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, TSUNG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王德文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種防風衣架，包含有：一第一架體，一端設有一第一滑槽；一第二架體，概平行於該第一架體；該第二架體之一端設有一第二滑槽；一連桿組件，設於該第一架體與該第二架體之間；該連桿組件具有一第一連桿、一第二連桿及一中軸件；該第一連桿與該第二連桿呈交叉設置，其中一者一端樞設於該第一架體，另一端以可活動的方式伸入該第二架體之該第二滑槽中；另一者一端樞設於該第二架體，另一端以可活動的方式伸入該第一架體之該第一滑槽中；該中軸件穿設於該第一連桿與該第二連桿中央；以及一掛勾件，穿設於該連桿組件之該中軸件中央，一端從該中軸件之頂端露出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A windproof hanger, comprising: A first frame body with one end having a first sliding slot; A second frame body, approximately parallel to the first frame body, with one end having a second sliding slot; A connecting rod assembly positioned between the first and second frame bodies, consisting of a first rod, a second rod, and a central shaft; The first and second rods are arranged in a crossed manner, with one of the rods having one end pivotally connected to the first frame body and the other end movably extending into the second sliding slot of the second frame body; The other rod has one end pivotally connected to the second frame body and the other end movably extending into the first sliding slot of the first frame body; The central shaft passes through the center of the first and second rods: And a hook component, which is inserted through the central shaft of the connecting rod assembly, with one end protruding from the top of the central shaft.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一架體</p>  
        <p type="p">20:第二架體</p>  
        <p type="p">30:連桿組件</p>  
        <p type="p">40:彈性件</p>  
        <p type="p">50:轉動件</p>  
        <p type="p">60:掛勾件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="388" publication-number="202611379"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611379.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611379</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螺紋鋼筋之筋籠預組方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">E04C5/16</main-classification>  
        <further-classification edition="200601120241127B">E04G21/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>統榮鋼鐵企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京鐵鋼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO TEKKO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳德裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉原栄孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬出井康志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北山智彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康文彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種螺紋鋼筋之筋籠預組方法，係為一種將螺紋鋼筋預組為成型柱、樑筋籠之方法。該預組方法之步驟為：(1) 放樣主筋及箍筋；(2) 放置上方主筋並定位；(3)套入箍筋及縱向繫筋；(4) 穿置下方主筋及側邊主筋；(5) 套入橫向繫筋；(6)綁紮完成筋籠。本發明其係將螺紋鋼筋進行打版放樣後，再組成為成型柱、樑筋籠；將組裝好的成型籠筋構件運送到工地現場，進行預組成型之柱、樑筋籠的搭接，以完成建築主體結構。本發明螺紋鋼筋之筋籠預組方法不僅可以節省現場施工時間和人力，也可提升筋籠的品質，具有相當之進步性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:螺紋鋼筋之筋籠預組方法</p>  
        <p type="p">10:放樣主筋及箍筋</p>  
        <p type="p">11:放置上方主筋並定位</p>  
        <p type="p">12:套入箍筋及縱向繫筋</p>  
        <p type="p">13:穿置下方主筋及側邊主筋</p>  
        <p type="p">14:套入橫向繫筋</p>  
        <p type="p">15:綁紮完成筋籠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="389" publication-number="202611512"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611512.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611512</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134496</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鑽石磨棒檢測、篩選方法及其裝置</chinese-title>  
        <english-title>A METHOD FOR DETECTING AND SORTING DIAMOND GRINDING RODS AND A DEVICE OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">G01N35/00</main-classification>  
        <further-classification edition="200601120241104B">G01B5/28</further-classification>  
        <further-classification edition="200601120241104B">G01B5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHI HE TECHNOLOGY CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李忠軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUNG-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明鑽石磨棒檢測、篩選方法及其裝置，其鑽石磨棒檢測、篩選方法有一整列進料步驟係將集收之待測、篩選之鑽石磨棒經整列後輸出，一初步檢測步驟對輸出之每一該鑽石磨棒執行輸出方向的確認，並同步進行長度、準心位置及中線角度之丈量作業，以取得初步檢測資料後輸出，一該檢測步驟對經初步檢測後之該鑽石磨棒，再進行品質的檢測，以取得檢測資料輸出，一處理分析步驟結合所取得之初步檢測資料和檢測資料，以與一標準檢測規格值進行處理分析、計算，及一分料步驟以對檢測後之鑽石磨棒進行分類集收；藉由上述步驟之實施，不僅能大幅提升篩選速率外，更能確保篩選後之產品的穩定性，有效減少人工操作主觀性與錯誤。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for detecting and sorting diamond grinding rods and a device of the same comprises a feeding step which includes delivering a plurality of diamond grinding rods sequentially after the diamond grinding rods are collected and aligned, a preliminary detecting step which includes confirming and measuring the delivery direction, the length, the aim point, and the angle of the center line of each diamond grinding rod to obtain a preliminary detecting data, a main detecting step which includes testing the quality of each diamond grinding rod which is processed in the preliminary detecting step to obtain a main detecting data, a processing and analyzing step which includes comparing the preliminary detecting data and the main detecting data with a standard value data, and a sorting step which includes sorting the diamond grinding rods. Thus, the method facilitates an increase of sorting speed, ensures the stability of sorted products, and effectively prevents the bias and mistakes caused by manual operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(本發明)</p>  
        <p type="p">S1:整列進料步驟</p>  
        <p type="p">S2:初步檢測步驟</p>  
        <p type="p">S3:檢測步驟</p>  
        <p type="p">S4:處理分析步驟</p>  
        <p type="p">S5:分料步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="390" publication-number="202612216"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612216.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612216</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電力閘道裝置及智慧電力閘道系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H02J13/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝昱軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃祥寶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝昱軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃祥寶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電力閘道裝置，其具有：一主開關，具有一第一外網連接端、一第二外網連接端及一局網連接端，該第一外網連接端係用以與一市電電網耦接，該第二外網連接端係用以與一用戶電網耦接；一匯流排，耦接該局網連接端；多個雙向半導體開關單元，耦接該匯流排；以及一控制單元，與該些雙向半導體開關單元耦接，用以控制該些雙向半導體開關單元之導通/斷開；其中，各該雙向半導體開關單元係用以耦接於該匯流排與一創能裝置之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:市電電網</p>  
        <p type="p">11:用戶電網</p>  
        <p type="p">100:電力閘道裝置</p>  
        <p type="p">101:主開關</p>  
        <p type="p">102:匯流排</p>  
        <p type="p">103:雙向半導體開關單元</p>  
        <p type="p">104:控制單元</p>  
        <p type="p">105:感測單元</p>  
        <p type="p">120:創能裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="391" publication-number="202611382"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611382.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611382</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>建案之預組鋼筋工法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">E04G21/14</main-classification>  
        <further-classification edition="200601120241126B">E04C5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>統榮鋼鐵企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京鐵鋼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳德裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉原栄孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬出井康志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北山智彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康文彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種建案之預組鋼筋工法，係為一種預先在工廠製作完成筋籠，再配合工程進度於工地直接連接或搭接，用以節省現場施工時間和人力。該建案之預組鋼筋工法，其步驟為：(1) 工法說明；(2)建案分析；(3)工圖製作；(4) 工廠預組；(5) 運輸送貨；(6)現場施工；(7) 技術指導。本發明實施時，首先向業主介紹預組鋼筋之施工方法，並說明後續的作業流程；其次依據建案之結構圖說分析配筋，規劃施作方式；再就分析配筋之結果製作每一單元品之工圖，以作為施工組立使用；接著配合定案的工圖，於工廠内組裝各單元品構件，預組成型為柱、樑之筋籠；將組裝好的成型籠筋構件運送到指定地點；由專員於工地現場指導工班施作預組柱、樑之筋籠的搭接，以完成建築主體結構；並於施工時並提供指導建議、分析現場施工狀況並適時提供諮詢服務。本發明建案之預組鋼筋工法不僅可以節省現場施工時間和人力，也可改善工地現場施工品質管理的難度，具有相當之進步性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:建案之預組鋼筋工法</p>  
        <p type="p">10:工法說明</p>  
        <p type="p">11:建案分析</p>  
        <p type="p">12:工圖製作</p>  
        <p type="p">13:工廠預組</p>  
        <p type="p">14:運輸送貨</p>  
        <p type="p">15:現場施工</p>  
        <p type="p">16:技術指導</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="392" publication-number="202610550"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610550.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610550</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134500</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>填充草本植物生產線</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120240924B">A23P10/30</main-classification>  
        <further-classification edition="201601120240924B">A23L33/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昆山上維新技術研發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNSHAN SHANGWEIXIN TECHNOLOGY RESEARCH AND DEVELOPMENT CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬春豔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, CHUNYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種填充草本植物生產線，包括紙管下料機構、草本植物下料機構、第一滴液機構、軟隔離件下料機構、第二滴液機構、第一擴孔機構、硬隔離件下料機構；所述紙管下料機構排列紙管並送至所述草本植物下料機構，所述草本植物下料機構將草本植物顆粒落料至紙管中，而後所述第一滴液機構滴入液體至紙管中，所述第一滴液機構給草本植物顆粒潤濕和添加香味，以使草本植物顆粒易散發香味；所述軟隔離件下料機構將軟隔離件落入紙管中，接著，所述第二滴液機構滴入液體至紙管中，所述第二滴液機構給草本植物顆粒潤濕和添加香味，以使草本植物顆粒香味更濃郁，最後，所述第一擴孔機構對紙管進行擴孔操作，所述硬隔離件下料機構將硬隔離件落入紙管中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:紙管下料機構</p>  
        <p type="p">2:草本植物下料機構</p>  
        <p type="p">3:第一滴液機構</p>  
        <p type="p">4:軟隔離件下料機構</p>  
        <p type="p">5:第二滴液機構</p>  
        <p type="p">6:第一擴孔機構</p>  
        <p type="p">7:硬隔離件下料機構</p>  
        <p type="p">8:過濾顆粒下料機構</p>  
        <p type="p">9:爆珠下料機構</p>  
        <p type="p">10:第二擴孔機構</p>  
        <p type="p">11:棉柱下料機構</p>  
        <p type="p">12:成品下料機構</p>  
        <p type="p">14:治具轉接機構</p>  
        <p type="p">40:輸送管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="393" publication-number="202610552"> 
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      <tif no="1" file="202610552.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610552</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134501</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可以增加香氣種類和香氣濃度的香煙</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">A24D1/18</main-classification>  
        <further-classification edition="200601120240926B">A24D1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昆山上維新技術研發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNSHAN SHANGWEIXIN TECHNOLOGY RESEARCH AND DEVELOPMENT CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬春豔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, CHUNYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種可以增加香氣種類和香氣濃度的香煙，包括呈管狀的本體、及可以透氣的封口部件，所述本體的第一端部和第二端部之間具有容納腔，所述封口部件封蓋所述本體的第一端部，所述容納腔內依次間隔設有硬固件、吸附柱從而將所述容納腔分割成第一部分、第二部分，所述吸附柱封蓋所述本體的第二端部，所述第一部分填充顆粒狀的香料和軟固件，所述軟固件吸附有香水，且內部設置有香丸，所述第二部分填充降溫顆粒。本發明透過設置特定結構的軟固件，使得該香煙具備多種香氣種類，同時將香氣濃度始終維持在高位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:本體</p>  
        <p type="p">2:封口部件</p>  
        <p type="p">3:軟固件</p>  
        <p type="p">4:硬固件</p>  
        <p type="p">5:吸附柱</p>  
        <p type="p">6:間隙</p>  
        <p type="p">7:第一端部</p>  
        <p type="p">8:第二端部</p>  
        <p type="p">9:通孔</p>  
        <p type="p">10:容納腔</p>  
        <p type="p">11:第一部分</p>  
        <p type="p">12:第二部分</p>  
        <p type="p">13:香料</p>  
        <p type="p">14:降溫顆粒</p>  
        <p type="p">15:增香珠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="394" publication-number="202610574"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610574.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610574</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134502</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>烤肉用具</chinese-title>  
        <english-title>BARBECUE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">A47J37/07</main-classification>  
        <further-classification edition="200601120241029B">A47J37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恆德模具有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENGDE MOLD CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅濟寶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, CHI PAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豐裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種烤肉用具，係主要於一爐座的容腔內設有一支撐架，並於該支撐架上設置有一盛水盤，又於爐座其容腔內位於盛水盤上方處設有一置炭座，另於置炭座上設置有一烤網，藉此，當烤肉時即可將食材放置於烤網上，以利用烤網下方置炭座上所設置炭火進行食材燒烤，並以盛水盤承接食材油脂與炭火屑等，以避免造成火災或環境污染，再者，當欲製作甕仔雞等時，則可將烤網取下，另將烘烤桶設置於置炭座之炭網上，以將烘烤桶內的食材烤熟，據此燒烤及烘烤兩用的烤肉用具設計，不僅可充分享受烤肉樂趣，且具使用安全性，並可收合成小體積，以利收納及外出攜帶方便性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a barbecue device, primarily featuring a support frame positioned within a cavity of a furnace base. A water pan is placed on the support frame, and a charcoal holder is installed above the water pan in the cavity of the furnace base. Additionally, a grill is provided on the charcoal holder. When barbecuing, food can be placed on the grill, allowing it to be cooked using the charcoal fire placed on the charcoal holder below the grill. The water pan catches grease and charcoal debris from the food, preventing fire hazards or environmental pollution. Furthermore, when preparing dishes such as baked chicken, the grill can be removed, and a roasting barrel can be placed on a charcoal net of the charcoal holder to cook the food inside the barrel. According to this design, the barbecue device capable of both grilling and roasting, not only maximizes the enjoyment of barbecuing but also ensures safety in use. Additionally, it can be folded into a compact size for easy storage and portability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:爐座</p>  
        <p type="p">11:容腔</p>  
        <p type="p">111:第一止擋緣</p>  
        <p type="p">112:卡梢</p>  
        <p type="p">12:支撐架</p>  
        <p type="p">121:支桿</p>  
        <p type="p">13:腳架</p>  
        <p type="p">131:抵撐片</p>  
        <p type="p">132:缺口</p>  
        <p type="p">133:止擋部</p>  
        <p type="p">134:第一鎖接部</p>  
        <p type="p">2:盛水盤</p>  
        <p type="p">3:置炭座</p>  
        <p type="p">31:容室</p>  
        <p type="p">32:炭網</p>  
        <p type="p">33:止擋片</p>  
        <p type="p">4:烤肉架</p>  
        <p type="p">41:架體</p>  
        <p type="p">411:凸片</p>  
        <p type="p">412:第二鎖接部</p>  
        <p type="p">42:定位片</p>  
        <p type="p">43:烤網</p>  
        <p type="p">5:烘烤桶</p>  
        <p type="p">51:桶底座</p>  
        <p type="p">52:桶身</p>  
        <p type="p">53:桶蓋</p>  
        <p type="p">6:烘烤架</p>  
        <p type="p">61:集油盆</p>  
        <p type="p">611:組立件</p>  
        <p type="p">62:掛桿</p>  
        <p type="p">621:吊環</p>  
        <p type="p">63:勾桿</p>  
        <p type="p">631:勾部</p>  
        <p type="p">7:集熱罩</p>  
        <p type="p">71:集熱腔</p>  
        <p type="p">72:第二止擋緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="395" publication-number="202611429"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611429.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611429</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閥件保護蓋</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">F16L55/115</main-classification>  
        <further-classification edition="200601120241230B">F16K35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錦豐科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊錦池</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種閥件保護蓋，包括一座體及一固定部，固定部包括一頂面及互相平行的一第一側面及一第二側面，第一側面及第二側面之一端各連接頂面的相對兩端，且第二側面之另一端連接座體，於第一側面設有一開關件，開關件之一端連接頂面，另一端設有至少一卡扣。當一閥件開關嵌入固定部時，卡扣會固定住閥件開關使閥件開關無法轉動，以防止外力碰撞而造成閥件開關位置異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:閥件保護蓋</p>  
        <p type="p">12:座體</p>  
        <p type="p">122:腳柱</p>  
        <p type="p">124:凹槽</p>  
        <p type="p">14:固定部</p>  
        <p type="p">142:頂面</p>  
        <p type="p">144:第一側面</p>  
        <p type="p">146:第二側面</p>  
        <p type="p">148:指示符號</p>  
        <p type="p">16:頸部</p>  
        <p type="p">18:開關件</p>  
        <p type="p">186:導引區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="396" publication-number="202611376"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611376.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611376</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134505</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螺紋鋼筋砂漿填充續接器之查驗管理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">E04C3/32</main-classification>  
        <further-classification edition="201201120241104B">G06Q50/04</further-classification>  
        <further-classification edition="200601120241104B">E04C5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>統榮鋼鐵企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京鐵鋼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO TEKKO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳德裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉原栄孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬出井康志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北山智彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康文彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種螺紋鋼筋砂漿填充續接器之查驗管理方法，係為一種用於螺紋鋼筋砂漿填充續接器施工後的查驗方法之管理，用以確保續接鋼筋後之安全性。該查驗管理方法主要係以目視檢查為主，其步驟為：(1) 續接器套筒內鋼筋長度查驗；(2) 螺母鎖緊固定查驗；(3) 填充材灌漿查驗。首先續接器施工時，應依鋼筋上預先標記之位置定位，以避免鋼筋螺入之長度不夠，故應確認螺母是否位於鋼筋上的顏色標記範圍內；接著確認螺母和續接器套筒的標記錯開，以確認是否有以扭力板手鎖緊；最後確認填充材之注入量是否足夠，查驗確認砂漿填充材是否從兩端螺母溢出，以保證砂漿完全填充鋼筋間之細小縫隙。本發明利用嚴謹的查驗管理方法，確保組接人員操作完成鋼筋續接器之接續後能符合規範，使鋼筋續接器之使用更加安全，並能快速有效的查驗鋼筋續接的工作，具有相當之進步性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:螺紋鋼筋砂漿填充續接器之查驗管理方法</p>  
        <p type="p">10:續接器套筒內鋼筋長度查驗</p>  
        <p type="p">11:螺母鎖緊固定查驗</p>  
        <p type="p">12:填充材灌漿查驗</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="397" publication-number="202611380"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611380.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611380</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134511</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螺紋鋼筋續接器之施工方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">E04C5/16</main-classification>  
        <further-classification edition="200601120241127B">E04C5/20</further-classification>  
        <further-classification edition="200601120241127B">E04G21/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>統榮鋼鐵企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京鐵鋼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳德裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉原栄孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬出井康志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北山智彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康文彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種螺紋鋼筋續接器之施工方法，特別是指一種用於續接螺紋鋼筋之砂漿填充續接器的施工方法，用以鞏固續接兩根鋼筋的接點。其方法及步驟係為：(1)鋼筋續接；(2)鎖固螺母；(3)填充材拌合；(4) 注入填充材。首先將一鋼筋之端頭與續接器之套筒和一螺母預鎖，另一鋼筋之端頭則先鎖上螺母後，再與續接器之套筒螺合連接至二鋼筋所標記的記號位置內；其次使用麥克筆在續接器和螺母接合處畫上標記，再以扭力扳手將螺母鎖緊，當續接器和螺母接合處的標記分離後，即已完成鎖緊；然後將水泥砂漿與定量的水倒入拌合容器內，以攪拌器攪後形成填充材備用；最後將填充材倒入裝填筒中，將填充材注入續接器套筒上之灌漿孔，當填充材從兩端螺母中溢出時，即完成注入作業。本發明利用嚴謹的步驟方法，確保組接人員操作時其續接長度、扭力值及沙漿填充材能符合規範，使鋼筋續接器之使用更加安全，並能快速有效的完成鋼筋續接的工作，具有相當之進步性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:螺紋鋼筋續接器之施工方法</p>  
        <p type="p">10:鋼筋續接</p>  
        <p type="p">11:鎖固螺母</p>  
        <p type="p">12:填充材拌合</p>  
        <p type="p">13:注入填充材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="398" publication-number="202612167"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612167.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612167</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134512</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動設備的電池組件及電池交換與充電系統</chinese-title>  
        <english-title>BATTERY ASSEMBLY FOR ELECTRIC EQUIPMENT AND BATTERY EXCHANGE AND CHARGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120240926B">H01M50/102</main-classification>  
        <further-classification edition="201901120240926B">B60L53/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>典型工場有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EXEMPLAR FIELDS CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳增堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TSENG-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電動設備的電池組件，包括電池本體、把手蓋以及至少一套環。電池本體呈柱狀，且具有柱面與位在柱面之相對側的兩端面，端面被柱面的側緣環繞地鄰接。把手蓋配置於電池本體的端面上。套環套接於電池本體的柱面，其中把手蓋與套環相互扣接，且套環與電池本體相互扣接。另揭露一種電池交換與充電系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery assembly for electric equipment including a battery body, a handle cover, and at least one collar is provided. The battery body is a pillar having a pillar surface and two end surfaces at opposite sides of the pillar surface, wherein one of the end surface is connected and surrounded by an side edge of the pillar surface. The handle cover is disposed on the end surface of the battery body. The collar is sheathed onto the pillar surface. The handle cover is engaged with the collar, and the collar is engaged with the battery body. A battery exchange and charging system is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電池組件</p>  
        <p type="p">110:電池本體</p>  
        <p type="p">120:套環</p>  
        <p type="p">122:肋</p>  
        <p type="p">123:卡勾二</p>  
        <p type="p">124:卡勾一</p>  
        <p type="p">125:通氣孔</p>  
        <p type="p">130:把手蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="399" publication-number="202610749"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610749.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610749</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134516</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於雷射加工的定位調整系統及其操作方法</chinese-title>  
        <english-title>POSITIONING ADJUSTMENT SYSTEM FOR LASER PROCESSING AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241127B">B23K26/04</main-classification>  
        <further-classification edition="201401120241127B">B23K26/046</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華精測科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA PRECISION TEST TECH. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳伯群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊倬昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於雷射加工的定位調整系統及其操作方法，定位調整系統的處理器分別對掃描模組的第一振鏡掃描器及第二振鏡掃描器輸出至少二批次的第一控制電壓及第二控制電壓，使得雷射光束依序在加工區域對應的二個位置形成一第一聚焦點及一第二聚焦點，再利用平台單元的位置偵測器偵測雷射光束的第一聚焦點及第二聚焦點之間的一位移量，以調整第一振鏡掃描器及第二振鏡掃描器而校正雷射光束的聚焦點在加工區域的定位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A positioning adjustment system for laser processing and an operating method thereof are provided. A processor of the positioning adjustment system outputs two batches of a first control voltage and a second control voltage to a first galvo scanner and a second galvo scanner of a scanning module, respectively, so that a laser beam sequentially forms a first focusing point and a second focusing point at two corresponding positions in a processing area. A position detector of a platform unit is then used to detect a displacement between the first focus point and the second focus point of the laser beam to adjust the first galvo scanner and the second galvo scanner so that the positioning of the focus point of the laser beam in the processing area can be corrected.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:振盪器</p>  
        <p type="p">3:光學模組</p>  
        <p type="p">31:波片旋轉台</p>  
        <p type="p">32:旋轉台控制器</p>  
        <p type="p">33:偏振鏡</p>  
        <p type="p">34:阻擋器</p>  
        <p type="p">35:分束器</p>  
        <p type="p">36:光束監測器</p>  
        <p type="p">37:光路元件</p>  
        <p type="p">4:掃描模組</p>  
        <p type="p">5:平台單元</p>  
        <p type="p">51:平台</p>  
        <p type="p">52:位置偵測器</p>  
        <p type="p">53:平台驅動器</p>  
        <p type="p">6:處理器</p>  
        <p type="p">B、B1、B2:路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="400" publication-number="202611850"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611850.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611850</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>優化智慧微電網中低碳經濟調度的方法與智慧微電網系統</chinese-title>  
        <english-title>METHOD FOR OPTIMIZING LOW-CARBON ECONOMIC DISPATCH IN SMART MICROGRIDS AND SMART MICROGRIDS SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241204B">G06Q50/06</main-classification>  
        <further-classification edition="200601120241204B">H02J4/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍華科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖國清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, GWO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖柏同</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, BO-TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種在智慧微電網中優化低碳經濟調度的方法與系統。該方法將多個分佈式發電單元，包括可再生能源和非再生能源，整合於智慧微電網中。開發了一種低碳經濟調度模型，該模型在減少碳排放的同時，最小化發電成本。該模型還結合了一碳交易機制，用於高效分配和交易碳排放配額。調度過程通過應用雙延遲深度確定性策略梯度演算法來優化，該演算法利用先進的強化學習來提高決策的準確性和穩定性。該系統動態管理旋轉備用容量，以應對可再生能源的變動性並維持電網穩定性。本發明為優化智慧微電網的經濟和環境效益提供了一種有效的解決方案，特別適用於可再生能源整合和碳排放減少為重點的地區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and system for optimizing low-carbon economic dispatch within smart microgrids are disclosed. The method integrates a plurality of distributed generation units, including both renewable and non-renewable energy sources, into a smart microgrid. A low-carbon economic dispatch model is developed to minimize power generation costs while reducing carbon emissions. The model incorporates a carbon trading mechanism for the efficient allocation and trading of carbon emission allowances. The dispatch process is optimized using a Twin Delayed Deep Deterministic Policy Gradient algorithm, which leverages advanced reinforcement learning to enhance decision-making accuracy and stability. The system dynamically manages spinning reserve capacity to maintain grid stability, accounting for the variability of renewable energy sources. The invention provides an effective solution for optimizing economic and environmental performance in smart microgrids, particularly in regions where renewable energy integration and carbon emission reduction are priorities.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310~S370:流程圖符號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="401" publication-number="202610862"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610862.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610862</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134529</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動車之電池控制方法及其系統</chinese-title>  
        <english-title>BATTERY CONTROL METHOD AND SYSTEM FOR ELECTRIC VEHICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241127B">B60L58/10</main-classification>  
        <further-classification edition="201901120241127B">B60L58/18</further-classification>  
        <further-classification edition="201901120241127B">G01R31/378</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成運汽車製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASTER TRANSPORTATION BUS MANUFACTURING LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉鈞宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭家成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIA CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳登信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TENG HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭國和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KUO HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秀玫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡依庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電動車之電池控制方法及其系統，其透過電池檢測單元檢測該些個電池包之電池資訊，並將電池資訊傳遞至電池管理單元以及電池控制單元，接著透過電池管理單元平衡該些個電池包電壓，當電池管理單元無法平衡該至少一電池包電壓時，電池管理單元判斷至少一電池包發生故障，電池控制單元切斷發生故障之至少一電池包之供電，並調整未發生故障之該至少一電池包之供電，以此於電池包發生中低程度之故障時，仍能有最低限度之動力移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a battery control method and system for electric vehicles, which detects the battery information of such battery packs by means of a battery detection unit, transmits the battery information to a battery management unit and a battery control unit, and then balances the voltages of such battery packs by means of the battery management unit, and when the battery management unit fails to balance the voltage of the at least one battery pack, the battery management unit determines that at least one battery pack is faulty, and the battery control unit cuts off the power supply of the at least one battery pack which is faulty, and adjusts the power supply of the at least one battery pack which is not faulty. When the battery management unit fails to balance the voltage of at least one battery pack, the battery management unit determines that at least one battery pack is faulty, the battery control unit cuts off the power supply to the at least one battery pack that is faulty and adjusts the power supply to the at least one battery pack that is not faulty, so that there is still a minimum amount of power available to move the battery packs in the event that they have a low or medium level of fault.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10-S30:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="402" publication-number="202610763"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610763.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610763</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134531</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨加工製程的聲頻監控系統</chinese-title>  
        <english-title>ACOUSTIC MONITORING SYSTEM FOR GRINDING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241104B">B24B37/013</main-classification>  
        <further-classification edition="200601120241104B">G08C17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳凱榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KAI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡榮財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JUNG-TSAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊延</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃守正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHOU-ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仕偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明將聲頻感測器整合在研磨加工製程的設備中，聲頻感測器固定端與旋轉端的設計，透過無線傳輸之方式傳輸研磨加工聲頻訊號，以解決旋轉無法傳輸之問題；本發明所提供的研磨加工製程的聲頻監控系統，在晶圓研磨加工時利用材料在受力時發生微觀變形而產生的彈性波，達到加工細微監控的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention integrates an acoustic sensor into the equipment used in the grinding process. The design of both the fixed and rotating ends of the acoustic sensor enables the transmission of grinding acoustic signals through wireless transmission, addressing the issue of signal transmission during rotation. The acoustic monitoring system for the grinding process provided by this invention utilizes elastic waves generated by the microscopic deformation of the material under stress during wafer grinding, achieving precise monitoring of the grinding process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:聲頻監控單元</p>  
        <p type="p">11:連接介面</p>  
        <p type="p">111:連接介面螺孔</p>  
        <p type="p">112:連接介面環翼</p>  
        <p type="p">1121:環翼螺孔</p>  
        <p type="p">12:感測器固定端</p>  
        <p type="p">121:第一聲頻感測器</p>  
        <p type="p">13:感測器旋轉端</p>  
        <p type="p">131:第二聲頻感測器</p>  
        <p type="p">132:動態平衡調整件</p>  
        <p type="p">20:研磨加工單元</p>  
        <p type="p">21:旋轉軸</p>  
        <p type="p">22:主軸頭</p>  
        <p type="p">23:連接鈑</p>  
        <p type="p">231:連接鈑螺孔</p>  
        <p type="p">24:研磨件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="403" publication-number="202611281"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611281.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611281</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134549</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>稀釋劑組成物、基板處理的方法以及改質光阻</chinese-title>  
        <english-title>THINNER COMPOSITION, METHOD FOR SUBSTRATE PROCESSING AND MODIFIED PHOTORESIST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">C11D7/26</main-classification>  
        <further-classification edition="200601120241128B">C11D7/28</further-classification>  
        <further-classification edition="200601120241128B">C11D7/32</further-classification>  
        <further-classification edition="200601120241128B">C11D7/50</further-classification>  
        <further-classification edition="200601120241128B">G03F7/004</further-classification>  
        <further-classification edition="200601120241128B">G03F7/16</further-classification>  
        <further-classification edition="200601120241128B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新應材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED ECHEM MATERIALS COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭宸敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, CHEN-JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐繹函</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種稀釋劑組成物、基板處理的方法以及改質光阻。稀釋劑組成物包括溶劑（A）、含氟添加劑（B）以及聚醚多元醇（C）。含氟添加劑（B）包括由下述式（B-1）表示的聚合物、由下述式（B-2）表示的聚合物、由下述式（B-3）表示的聚合物、由下述式（B-4）表示的聚合物或其組合。聚醚多元醇（C）包括由下述式（C-1）表示的聚合物。含氟添加劑（B）的使用量與聚醚多元醇（C）的使用量的比例為2:1至1:4。基於100重量份的稀釋劑組成物，含氟添加劑（B）的使用量為0.001重量份至2重量份，聚醚多元醇（C）的使用量為0.001重量份至2重量份。 &lt;br/&gt;&lt;img align="absmiddle" height="368px" width="550px" file="ed10020.JPG" alt="ed10020.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="687px" width="598px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;在式（B-1）、式（B-2）、式（B-3）、式（B-4）以及式（C-1）中，R &lt;sup&gt;1&lt;/sup&gt;至R &lt;sup&gt;11&lt;/sup&gt;、T &lt;sup&gt;1&lt;/sup&gt;至T &lt;sup&gt;3&lt;/sup&gt;、Y &lt;sup&gt;1&lt;/sup&gt;至Y &lt;sup&gt;3&lt;/sup&gt;、a、b、e、f、g、j、k、m、p、t、u及w的定義與說明書中所定義的相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thinner composition, a method for substrate processing and a modified photoresist are provided. The thinner composition includes a solvent (A), a fluorine-containing additive (B) and a polyether polyol (C). The fluorine-containing additive (B) includes a polymer represented by following Formula (B-1), a polymer represented by following Formula (B-2), a polymer represented by following Formula (B-3), a polymer represented by following Formula (B-4), or a combination thereof. The polyether polyol (C) includes a polymer represented by following Formula (C-1). A ratio of a usage amount of the fluorine-containing additive (B) to a usage amount of the polyether polyol (C) is 2:1 to 1:4. Based on 100 parts by weight of the thinner composition, a usage amount of the fluorine-containing additive (B) is 0.001 parts by weight to 2 parts by weight, a usage amount of the polyether polyol (C) is 0.001 parts by weight to 2 parts by weight. &lt;br/&gt;&lt;img align="absmiddle" height="506px" width="625px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="552px" width="568px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;In Formula (B-1), Formula (B-2), Formula (B-3), Formula (B-4) and Formula (C-1), the definition of R &lt;sup&gt;1&lt;/sup&gt;to R &lt;sup&gt;11&lt;/sup&gt;, T &lt;sup&gt;1&lt;/sup&gt;to T &lt;sup&gt;3&lt;/sup&gt;, Y &lt;sup&gt;1&lt;/sup&gt;to Y &lt;sup&gt;3&lt;/sup&gt;, a, b, e, f, g, j, k, m, p, t, u and w are the same as defined in the specification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="404" publication-number="202611741"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611741.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611741</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134556</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路匯流排通訊位址分配方法</chinese-title>  
        <english-title>METHOD FOR INTER-INTEGRATED CIRCUIT (I2C) ADDRESSES ALLOCATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241211B">G06F13/38</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺玖科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROLIFIC TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許家彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐偉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEI-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余仁淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, REN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路匯流排位址的分配方法，包含該主設備經由該匯流排輸出通知訊號至該複數個從設備，當該複數個從設備之一從設備接收到該通知訊號後，該從設備產生延遲時段，偵測該串列資料線的訊號，若沒有偵測到該串列資料線腳位呈現高電位到低電位的轉換，則在該延遲時段結束時該從設備更新該從設備的設備識別碼，由該串列資料線腳位輸出低電位脈衝並維持低電位時段，在該低電位時段結束時，將該串列資料線訊號拉至高電位，偵測該串列資料線的訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for inter-integrated circuit (I2C) address allocation includes the master device sending a notification signal to the plurality of slave devices via the bus, and after one of the plurality of slave devices receives the notification signal, the slave device generating a delay period, and detecting the serial data (SDA) signal of the, if not detecting the SDA signal having a high to low signal transition, at the end of the delay period the slave device updating the identification of the slave device, outputting low-pulse signal from the SDA pin and maintaining a low-pulse period, at the end of the low-pulse period, pulling the SDA signal to high, and detecting the SDA pins.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">S400至S428:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="405" publication-number="202611944"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611944.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611944</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134557</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>能耗管理系統</chinese-title>  
        <english-title>ENERGY CONSUMPTION MANAGEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120240927B">G16Y20/30</main-classification>  
        <further-classification edition="202001120240927B">G16Y40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>行富投資股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HF INVESTMENT CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李健豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙彥榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明述及一種能耗管理系統，其包括一偵測模塊、一處理模塊、一資料庫以及一顯示模塊。偵測模塊被配置以測量一時間運作週期內的多個能耗變化數據。處理模塊被配置以接收由偵測模塊傳送之多個能耗變化數據，並依據一統計分析規則對多個能耗變化數據進行分析，並產生一分析結果。資料庫被配置以接收及儲存由偵測模塊傳送之多個能耗變化數據或由處理模塊傳送之分析結果。顯示模塊被配置以接收及呈現處理模塊或資料庫傳送之多個能耗變化數據或分析結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an energy consumption management system. The energy consumption management system includes a detection module, a processing module, a database, and a display module. The detection module is configured to measure a plurality of energy consumption change data during a time operation cycle. The processing module is configured to receive the energy consumption change data transmitted by the detection module, analyze the energy consumption change data according to a statistical analysis rule, and generate an analysis result. The database is configured to receive and store the energy consumption change data transmitted by the detection module or the analysis result transmitted by the processing module. The display module is configured to receive and display the energy consumption change data or analysis result transmitted by the processing module or the database.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:能耗管理系統</p>  
        <p type="p">110:偵測模塊</p>  
        <p type="p">120:處理模塊</p>  
        <p type="p">121:中央處理器</p>  
        <p type="p">122:記憶體</p>  
        <p type="p">123:儲存載體</p>  
        <p type="p">130:顯示模塊</p>  
        <p type="p">140:資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="406" publication-number="202611843"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611843.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611843</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134558</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於服務之碳排放管理方法及系統</chinese-title>  
        <english-title>SERVICE-BASED CARBON EMISSION MANAGEMENT METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250102B">G06Q50/00</main-classification>  
        <further-classification edition="202301120250102B">G06Q10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>行富投資股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HF INVESTMENT CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李健豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙彥榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明述及一種基於服務之碳排放管理方法，其包括：取得一人員之一行為資料，所述行為資料為人員經歷一服務時所產生；驗證人員之一身份識別資料；將身份識別資料與行為資料進行關聯分析；依據關聯分析結果篩選出人員經歷服務時相關之一碳排放演算法，利用碳排放演算法計算與行為資料相關之碳排放數據。藉此，快速取得所需之碳排放數據，減少不必要運算及增加管理效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A service-based carbon emission management method includes: obtaining behavioral data of a user, said behavioral data being generated when the user is using a service; verifying identification data of the user; performing a correlation analysis between the identification data and the behavioral data; and selecting a carbon emission algorithm based on the results of the correlation analysis when the user is using the service and calculating carbon emission data related to the behavioral data using the carbon emission algorithm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101、S102、S103、S104:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="407" publication-number="202611851"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611851.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611851</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134559</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>能耗信息分析系統</chinese-title>  
        <english-title>ENERGY CONSUMPTION INFORMATION ANALYSIS SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120240929B">G06Q50/06</main-classification>  
        <further-classification edition="202301120240929B">G06Q10/04</further-classification>  
        <further-classification edition="202301120240929B">G06Q10/063</further-classification>  
        <further-classification edition="202401120240929B">G06Q50/26</further-classification>  
        <further-classification edition="201301120240929B">G06F21/30</further-classification>  
        <further-classification edition="201301120240929B">G06F21/31</further-classification>  
        <further-classification edition="201901120240929B">G06F16/25</further-classification>  
        <further-classification edition="202401120240929B">G06Q50/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>行富投資股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HF INVESTMENT CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李健豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙彥榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明述及一種能耗信息分析系統，其包括一偵測模塊、一身份辨識模塊、一處理模塊以及一資料庫。偵測模塊被配置以測量一時間運作週期內的多個能耗變化數據。處理模塊被配置以接收由偵測模塊傳送之多個能耗變化數據及由身份辨識模塊傳送之人員之身份識別資料，將人員之身份識別資料與多個能耗變化數據進行關聯，取得至少一關聯後之能耗變化數據，並對關聯後之能耗變化數據進行分析。資料庫被配置以接收及儲存由偵測模塊傳送之多個能耗變化數據、由身份辨識模塊傳送之人員之身份識別資料或由處理模塊傳送之分析結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an energy consumption information analysis system. The energy consumption information analysis system includes a detection module, an identification module, a processing module and a database. The detection module is configured to measure a plurality of energy consumption change data during a time operation cycle. The processing module is configured to receive the energy consumption change data transmitted by the detection module and a personal identification data transmitted by the identification module, correlate the personal identification data with the energy consumption change data, obtain at least one correlated energy consumption change data, and analyze the correlated energy consumption change data. The database is configured to receive and store energy consumption change data transmitted by the detection module, the personal identification data transmitted by the identification module or an analysis result transmitted by the processing module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:能耗信息分析系統</p>  
        <p type="p">110:偵測模塊</p>  
        <p type="p">120:處理模塊</p>  
        <p type="p">121:中央處理器</p>  
        <p type="p">122:記憶體</p>  
        <p type="p">123:儲存載體</p>  
        <p type="p">130:身份辨識模塊</p>  
        <p type="p">140:資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="408" publication-number="202612360"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612360.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612360</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理國外簡訊的裝置及方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR PROCESSING FOREIGN TEXT MESSAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250102B">H04W4/14</main-classification>  
        <further-classification edition="202101120250102B">H04W12/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鴻鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HONG-PONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古勇勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, YONG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種處理國外簡訊的裝置及方法。所述方法包括以下步驟：由簡訊流程控制模組設定被叫裝置的STP轉導條件，其中STP轉導條件關聯於SRI-SM以及MT-FSM；由收訊端白名單模組分析出被叫門號是否為收訊端白名單，其中被叫門號對應於被叫裝置；當收訊端白名單模組分析出被叫門號不是收訊端白名單時，由簡訊封包分析模組分析出MT-FSM是否對應於異常國外來源簡訊中心；當收訊端白名單模組分析出被叫門號不是收訊端白名單時，由AI分析簡訊模組利用AI模型來分析出MT-FSM是否為詐騙國外簡訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device and a method for processing a foreign text message are provided. The method includes following steps: setting, by a SMS process control module, a STP transduction condition of a called device, wherein the STP transduction condition is associated with an SRI-SM and a MT-FSM; analyzing, by a receiving end whitelist module, whether a called number is in a receiving end whitelist, wherein the called number corresponds to the called device; when the receiving end whitelist module analyzes that the called number is not in the receiving end whitelist, analyzing, by a SMS packet analysis module, whether the MT-FSM corresponds to an abnormal foreign source SMS center; and when the receiving end whitelist module analyzes that the called number is not in the receiving end whitelist, using, by an AI ​​text message analysis module, an AI ​​model to analyze whether the MT-FSM is a fraudulent foreign text message.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S51、S52、S53、S54:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="409" publication-number="202612341"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612341.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612341</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134568</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像呈現方法與影像呈現系統</chinese-title>  
        <english-title>IMAGE PRESENTATION METHOD AND IMAGE PRESENTATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250102B">H04N21/43</main-classification>  
        <further-classification edition="201801120250102B">H04N13/366</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴佳微</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, JIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹展榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHAN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KAI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像呈現方法與影像呈現系統。所述方法包括：在影像擷取裝置處於移動狀態的期間，透過影像擷取裝置持續拍攝目標物，以取得影像串流；偵測在影像擷取裝置持續拍攝目標物的期間，影像擷取裝置與目標物之間的第一相對位置；根據第一相對位置，從影像串流中擷取多個影像，其中所述多個影像分別以不同視角呈現目標物；偵測使用者與顯示器之間的第二相對位置；以及根據第二相對位置，透過顯示器呈現所述多個影像的其中之一。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image presentation method and an image presentation system are disclosed. The method includes: continuously photographing a target object by an image capturing device to obtain an image stream in a period that the image capturing device is in a moving state; detecting a first relative position between the image capturing device and the target object in a period that the image capturing device continuously photographs the target object; obtaining a plurality of images from the image stream according to the first relative position, wherein the images respectively present the target object from different viewing angles; detecting a second relative position between a user and a display; and presenting one of the images by the display according to the second relative position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S801~S805:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="410" publication-number="202612342"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612342.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612342</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134569</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像串流處理方法與電子裝置</chinese-title>  
        <english-title>IMAGE STREAM PROCESSING METHOD AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250102B">H04N21/43</main-classification>  
        <further-classification edition="201101120250102B">H04N21/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳美蒓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳良其</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像串流處理方法與電子裝置。所述方法包括：透過影像擷取裝置取得影像串流，其中影像串流包括第一影像資料；將第一影像資料與對應於第一影像資料的第一時間資訊儲存於影像緩衝器中，其中第一時間資訊反映第一影像資料的取得時間；將第一時間資訊與系統時間資訊進行比較；以及響應於第一時間資訊與系統時間資訊之間的差值達到臨界值，將第一影像資料從影像緩衝器中移除。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A image stream processing method and an electronic device are disclosed. The method includes: obtaining an image stream through an image capture device, wherein the image stream includes first image data; storing the first image data and first time information corresponding to the first image data in an image buffer, wherein the first time information reflects an acquisition time of the first image data; comparing the first time information with system time information; and in response to a difference value between the first time information and the system time information reaching a threshold value, removing the first image data from the image buffer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401~S406:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="411" publication-number="202612542"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612542.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612542</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134570</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光感測裝置</chinese-title>  
        <english-title>PHOTOELECTRIC SENSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10F39/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>睿生光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOCARE OPTOELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳智濠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種光感測裝置，其包括電晶體、光感元件、平坦層、偏壓線、閃爍體層以及走線層。電晶體設置於基板上。光感元件設置於基板上，且與電晶體電性連接。平坦層設置於光感元件上，且部分地覆蓋光感元件。偏壓線在主動區中設置於平坦層上，且與光感元件電性連接。閃爍體層設置於平坦層上。走線層設置於偏壓線與位於周邊區中的接墊之間，且與偏壓線以及接墊電性連接。光感測裝置包括第一區域以及第二區域，第一區域為設置有閃爍體層的區域，且第二區域為第一區域以外的區域，其中位於第二區域中的走線層的至少部分未被平坦層覆蓋或位於平坦層的下方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photoelectric sensing device including a transistor, a photoelectric sensing element, a planarization layer, a bias line, a scintillator layer and a wiring layer. The transistor is disposed on a substrate. The photoelectric sensing element is disposed on the substrate and is electrically connected to the transistor. The planarization layer is disposed on the photoelectric sensing element and partially covers the photoelectric sensing element. The bias line located in an active area is disposed on the planarization layer and is electrically connected to the photoelectric sensing element. The scintillator layer is disposed on the planarization layer. The wiring layer is disposed between the bias line and a pad located in a peripheral area, and is electrically connected to the bias line and the pad. The photoelectric sensing device includes a first area and a second area. The first area is an area where the scintillator layer is provided, and the second area is an area outside the first area, wherein at least part of the wiring layer located in the second area is not covered by the planarization layer or is disposed under the planarization layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10c:光感測裝置</p>  
        <p type="p">10A、10B:區域</p>  
        <p type="p">10B1、10B2:子區域</p>  
        <p type="p">BE:下電極</p>  
        <p type="p">BL:偏壓線</p>  
        <p type="p">C-C’:剖線</p>  
        <p type="p">D:汲極</p>  
        <p type="p">G:閘極</p>  
        <p type="p">GI:閘介電層</p>  
        <p type="p">M:走線層</p>  
        <p type="p">PD:半導體</p>  
        <p type="p">PDi:本徵層</p>  
        <p type="p">PDn:第一層</p>  
        <p type="p">PDp:第二層</p>  
        <p type="p">PFA:平坦層</p>  
        <p type="p">PS:光感元件</p>  
        <p type="p">PV1、PV2:絕緣層</p>  
        <p type="p">S:源極</p>  
        <p type="p">SB:基板</p>  
        <p type="p">SC:閃爍體層</p>  
        <p type="p">SE:半導體層</p>  
        <p type="p">T:電晶體</p>  
        <p type="p">TE:上電極</p>  
        <p type="p">V1、V2、V3:通孔</p>  
        <p type="p">z:俯視方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="412" publication-number="202612277"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612277.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612277</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134580</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>延遲鎖相迴圈電路及操作方法</chinese-title>  
        <english-title>DELAY LOCK LOOP CIRCUIT AND OPERATING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241211B">H03L7/08</main-classification>  
        <further-classification edition="200601120241211B">G06F1/10</further-classification>  
        <further-classification edition="200601120241211B">G11C7/22</further-classification>  
        <further-classification edition="200601120241211B">G11C11/4076</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫啟翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, CHI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種延遲鎖相迴圈電路及操作方法，用以提供輸出時脈訊號至雙向數據控制引腳，延遲鎖相迴圈電路包括：第一延遲線，用以將輸入時脈訊號延遲後產生輸出時脈訊號；第二延遲線，用以接收輸出時脈訊號，並將輸出時脈訊號延遲後產生回授時脈訊號；相位比較器，用以依據輸入時脈訊號及回授時脈訊號的相位來進行比較，以調整第一延遲線的延遲；以及控制電路，控制第二延遲線，用以將第二延遲線的延遲調整為與雙向數據引腳上的離線驅動器（off-chip driver, OCD）的延遲對齊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A delay lock loop circuit and operating method for providing an output clock signal to a bidirectional data strobe (DQS) are provided. The delay lock loop circuit includes: a first delay line, configured to delay an input clock signal to generate the output clock signal; a second delay line, configured to receive the output clock signal and delay the output clock signal to generate a feedback clock signal; a phase detector, configured to compare phases of the input clock signal and the feedback clock signal to adjust a delay of the first delay line; and a control circuit, configured to control the second delay line, for adjusting a delay of the second delay line to be aligned to a delay of an off-line driver (OCD) coupled to the DQS.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:延遲鎖相迴圈電路</p>  
        <p type="p">10、14:接收器</p>  
        <p type="p">11、15:延遲線</p>  
        <p type="p">12:相位比較器</p>  
        <p type="p">13、16:控制電路</p>  
        <p type="p">Clkin、Clkin1、Clkin2、Clkout、Clkfb、Clkfb’:時脈訊號</p>  
        <p type="p">DA1、DA2:延遲調整訊號</p>  
        <p type="p">VD:調降訊號</p>  
        <p type="p">VU:調升訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="413" publication-number="202610713"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610713.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610713</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸媒濾布袋</chinese-title>  
        <english-title>CATALYTIC FILTER BAG</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">B01D46/02</main-classification>  
        <further-classification edition="200601120240929B">B01D46/10</further-classification>  
        <further-classification edition="200601120240929B">B01D39/02</further-classification>  
        <further-classification edition="200601120240929B">D03D1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富利康科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLEAN AIR TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林永清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林賜德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃毓瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張進煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIN-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明觸媒濾布袋，其係呈複數設置於一廢氣處理裝置內，而該觸媒濾布袋利用陶瓷纖維棉毯層及鐵氟龍層相互貼合而成，且該陶瓷纖維棉毯層係以低密度孔隙（即密度為0.096g/cm &lt;sup&gt;3&lt;/sup&gt;~0.128g/cm &lt;sup&gt;3&lt;/sup&gt;）所製備，以利觸媒穿透並完全覆蓋於該陶瓷纖維棉毯層之纖維表面，從而形成一觸媒層，更有效增加觸媒催化反應的接觸面積，同時該陶瓷纖維棉毯層具有質量輕、耐高溫等特性，使其不容易受高溫廢氣破壞，另配合該鐵氟龍層阻擋粗糙、尖銳顆粒及火星等物質，除能有效提升使用強度，大幅延長使用壽命外，該陶瓷纖維棉毯層及該鐵氟龍層亦可單獨進行更換，達到重複循環利用，以及降低所需費用成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plurality of catalytic filter bags are disposed in an exhaust gas treatment device. Each catalytic filter bag includes a ceramic fiber cotton blanket layer and a Teflon layer attached to each other. The ceramic fiber cotton blanket layer is provided with the low pore density which is arranged between 0.096g/cm &lt;sup&gt;3&lt;/sup&gt;and 0.128g/cm &lt;sup&gt;3&lt;/sup&gt;, thereby allowing catalyst to penetrate through and wrap fibers of the ceramic fiber cotton blanket layer completely to further form a catalyst layer whereby an area for proceeding the catalytic reaction is increased and the catalytic reaction is improved. The ceramic fiber cotton blanket layer is light and capable of resisting high temperature, and that prevent it from being damaged by high-temperature exhaust gas. Besides, the Teflon layer can filter rough and sharp particles, sparks, and other substances to thereby effectively increase the usage strength and extend the service life. The ceramic fiber cotton blanket layer and the Teflon layer can also be replaced separately to thereby achieve recycling usage and reduce the costs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:觸媒濾布袋</p>  
        <p type="p">31:袋體</p>  
        <p type="p">32:開放端</p>  
        <p type="p">33:封閉端</p>  
        <p type="p">311:陶瓷纖維棉毯層</p>  
        <p type="p">312:鐵氟龍層</p>  
        <p type="p">313:觸媒層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="414" publication-number="202610903"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610903.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610903</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134584</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動標識壓合裝置</chinese-title>  
        <english-title>AUTOMATIC LOGO PRESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B65C9/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鞠強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JU, QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫彎彎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, WAN WAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動標識壓合裝置，包括：第一機架，第一機架上設置有至少兩個壓合平台，任一壓合平台的兩側設置有移植平台；壓合機構，包括壓合組件以及第一傳送組件，壓合組件沿垂直方向相對設置在壓合平台上，第一傳送組件沿寬度方向相對設置在壓合平台上，並在壓合組件之間形成壓合作業位，第一傳送組件相互靠近或遠離以改變壓合作業位的大小；移植機構，包括第二傳送組件，第二傳送組件之間形成有傳送通道，第二傳送組件相互靠近或遠離以改變傳送通道的大小；本申請不僅能夠保證產品標識壓合品質，還能提升產品標識壓合效率，且可以滿足不同大小產品的標識壓合作業，提高生產效率，滿足產能需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automatic logo pressing device includes first frame, pressing mechanism and transplant mechanism. At least two pressing platforms are set on the first frame and the transplant mechanism is set on both sides of any pressing platform. Pressing mechanism includes pressing component and first transfer component. The pressing component is set relatively on the pressing platform along the vertical direction and the first transfer component is set relatively on the pressing platform along the width direction. Pressing operation station is formed between press components and size of pressing operation station is changed according to the first transfer components move closer or farther away from each other. The transplant mechanism includes second transfer component and transmission channel is formed between the second transfer components. The size of transmission channel is changed according to the second transfer components move closer or farther away from each other. This application can not only ensure quality of pressing product logo, but also improve the efficiency of pressing product logo. Logo pressing operation can be satisfied for products of different sizes, improve production efficiency and capacity requirements can be satisfied.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一機架</p>  
        <p type="p">2:第二機架</p>  
        <p type="p">3:壓合平台</p>  
        <p type="p">4:壓合機構</p>  
        <p type="p">5:移植平台</p>  
        <p type="p">6:移植機構</p>  
        <p type="p">7:旋轉平台</p>  
        <p type="p">8:旋轉機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="415" publication-number="202611892"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611892.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611892</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134589</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>LED晶片分級配置及LED晶片配置方法</chinese-title>  
        <english-title>LED CHIP BINNING CONFIGURATION AND LED CHIP CONFIGURATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241007B">G09G3/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆達電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEXTAR ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬維遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, WEI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾進興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, JIN-SHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉淳信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, CHUN-XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種LED晶片分級配置，包括複數個LED晶片。LED晶片具有相同發光顏色並且具有不同發光波長，並且LED晶片根據一波長間距分組。LED晶片之波長範圍與數量關係呈一高斯分布或一偏態分布。最小發光波長範圍之組之LED晶片之數量或最大發光波長範圍之組之LED晶片之數量小於等於LED晶片之總數量之百分之三十。不同組之LED晶片交錯排列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An LED chip binning configuration is provided, including a plurality of LED chips. The LED chips have the same luminous color and different wavelengths, and the LED chips are binning according to a wavelength spacing. The relationship between the range of the wavelength and quantity of LED chips is a Gaussian distribution or a skewed distribution. The number of LED chips in the bin with the minimum wavelength range or the number of LED chips in the bin with the maximum wavelength range is less than or equal to 30% of the total number of LED chips. Different bins of LED chips are staggered.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:LED晶片配置方法</p>  
        <p type="p">910:步驟</p>  
        <p type="p">920:步驟</p>  
        <p type="p">930:步驟</p>  
        <p type="p">940:步驟</p>  
        <p type="p">950:步驟</p>  
        <p type="p">960:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="416" publication-number="202612496"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612496.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612496</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134593</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/60</main-classification>  
        <further-classification edition="202501120250102B">H10D62/80</further-classification>  
        <further-classification edition="202501120250102B">H10D30/01</further-classification>  
        <further-classification edition="200601120250102B">H01L21/20</further-classification>  
        <further-classification edition="200601120250102B">H01L21/302</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TSUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃敬源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, KING-YUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐碩鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHUO-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種半導體結構包含一襯墊層、一溝槽、一閘極以及二保護部。溝槽沿一方向穿過襯墊層。閘極呈T型，設置於襯墊層，並往溝槽中延伸。閘極包含一第一部及一第二部。第一部設置於襯墊層，並包含二側壁及一第一金屬層。第二部連接第一部，位於溝槽中。二保護部分別覆蓋二側壁，以使第一金屬層設置於二保護部之間。藉此，避免元件特性受到影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure is proposed. The semiconductor structure includes a pad layer, a groove, a gate and two protection parts. The groove passes through the pad layer in a direction. The gate is T-shaped, disposed on the pad layer, and extends into the groove. The gate includes a first part and a second part. The first part is disposed on the pad layer and includes two side walls and a first metal layer. The second part is connected to the first part and is located in the groove. The two protection parts cover the two side walls respectively, so that the first metal layer is disposed between the two protection parts. Thus, the semiconductor structure can prevent the device characteristics from being affected.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體結構</p>  
        <p type="p">110:襯墊層</p>  
        <p type="p">120:溝槽</p>  
        <p type="p">130:閘極</p>  
        <p type="p">131:第一部</p>  
        <p type="p">1311:側壁</p>  
        <p type="p">132:第二部</p>  
        <p type="p">140:保護部</p>  
        <p type="p">150:基板</p>  
        <p type="p">160:介電層</p>  
        <p type="p">170:阻障層</p>  
        <p type="p">ML1:第一金屬層</p>  
        <p type="p">ML2:第二金屬層</p>  
        <p type="p">P:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="417" publication-number="202610704"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610704.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610704</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134602</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遊戲程式產品、電子裝置及遊戲系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241105B">A63F13/46</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金儀國際科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING I TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周明福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種遊戲程式產品、電子裝置及遊戲系統，電子裝置載入遊戲程式後執行下列步驟：取得一使用者帳號；顯示一操作介面，操作介面包括一第一區域，第一區域具有複數個操作區塊。選擇遊戲程式的一遊戲模式。依據所選擇的遊戲模式重覆進行一預定次數的一遊玩步驟，其中遊玩步驟包括：自該些操作區塊中選擇至少一目標操作區塊；判斷使用者是否在一預定時間內操作目標操作區塊；若是，則計分；若否，則不計分。記錄重覆遊玩步驟所得到之一總分數，並且產生一遊玩資料；儲存遊玩資料。遊戲系統更包含資料庫，電子裝置將遊玩資料傳送到資料庫儲存。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S16,S141,S142:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="418" publication-number="202612287"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612287.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612287</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134605</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>射頻前端電路及電子設備</chinese-title>  
        <english-title>RADIO FREQUENCY FRONT-END CIRCUIT AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241211B">H04B1/16</main-classification>  
        <further-classification edition="201501120241211B">H04B1/40</further-classification>  
        <further-classification edition="201801120241211B">H04B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神基科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GETAC TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊尚嶧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHANG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種射頻前端電路包含第一雙工器、提取器及第二雙工器。第一雙工器耦接用於接收射頻訊號的天線，且第一雙工器用以將射頻訊號分離成在無線廣域網路的低至高頻段中的第一訊號以及在無線廣域網路的超高頻段中的第二訊號。提取器耦接第一雙工器。提取器包含兩個帶通濾波器以及帶阻濾波器。兩個帶通濾波器用以自第一訊號提取在兩個全球導航系統頻段中的兩個全球導航系統訊號。帶阻濾波器用以允許第一訊號中在無線廣域網路的中至高頻段的第三訊號通過。第二雙工器耦接第一雙工器以及提取器，用以將第二訊號與第三訊號組合為無線廣域網路訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A radio frequency front-end circuit includes a first diplexer, an extractor and a second diplexer. The first diplexer is coupled to an antenna for receiving a radio frequency signal and the first diplexer is configured to separate the radio frequency signal to a first signal at a low to high band of a wireless wide area network and a second signal at an ultra-high band of the wireless wide area network. The extractor is coupled to a first diplexer. The extractor includes two band pass filters and a band rejection filter. The two band pass filters are configured to extract two global navigation system signals at two global navigation system bands from the first signal. The band rejection filter is configured to allow a third signal at a mid to high band of the wireless wide area network in the first signal to pass. The second diplexer is coupled to the first diplexer and the extractor and configured to combine the second third signals into a wireless wide area network signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210:天線</p>  
        <p type="p">400:射頻前端電路</p>  
        <p type="p">402,407:雙工器</p>  
        <p type="p">406:提取器</p>  
        <p type="p">408,409:低噪放大器</p>  
        <p type="p">410:射頻訊號</p>  
        <p type="p">410-1:第一訊號</p>  
        <p type="p">410-2:第二訊號</p>  
        <p type="p">410-3:第三訊號</p>  
        <p type="p">410-4:無線廣域網路訊號</p>  
        <p type="p">411-a,412-a:全球導航系統訊號</p>  
        <p type="p">411-b,412-b:放大後訊號</p>  
        <p type="p">420:全球導航系統模組/GNSS模組</p>  
        <p type="p">430:無線廣域網路模組/WWAN模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="419" publication-number="202611290"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611290.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611290</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134606</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可生物降解組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">C12N1/20</main-classification>  
        <further-classification edition="200601120250501B">C02F11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何鼎賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋其南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何鼎賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋其南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可生物降解組合物，包含一塑膠原料、一生質塑膠及一微生物添加劑；該塑膠原料含量以重量計佔該可生物降解組合物的總含量介於50wt%~96wt%；該生質塑膠含量以重量計佔該可生物降解組合物的總含量介於3wt%~30wt%；該微生物添加劑為乳酸桿菌及雙歧桿菌，該微生物添加劑的含量以重量計佔該可生物降解組合物的總含量介於1wt%~5wt%，據以該微生物添加劑能加速該生質塑膠自然降解，並促進環境中微生物生長並有助於降解該塑膠原料，該可生物降解組合物確實符合生物降解標準規範，提供環境友善及生物自然降解的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="420" publication-number="202610871"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610871.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610871</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134608</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車道線偵測方法及其系統</chinese-title>  
        <english-title>LANE DETECTION METHOD AND SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241030B">B60W40/06</main-classification>  
        <further-classification edition="201201120241030B">B60W30/08</further-classification>  
        <further-classification edition="200601120241030B">B60W30/10</further-classification>  
        <further-classification edition="202201120241030B">G06V20/54</further-classification>  
        <further-classification edition="202201120241030B">G06V10/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳修志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宸瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫鵬興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴國榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種車道線偵測方法，包括：一深度特徵提取器提取一影像中的複數個深度特徵，一主要演算法模型利用該影像及該深度特徵產生一第一誤差值，並將該第一誤差值回傳該深度特徵提取器，一輔助演算法模型利用該影像及該深度特徵產生一第二誤差值，並將該第二誤差值回傳該深度特徵提取器，該深度特徵提取器根據該第一誤差值和該第二誤差值調整所擷取的該複數個深度特徵，並利用該深度特徵提取器和該主要演算法模型產生一車道線預測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for lane detection, including extracting multiple deep features by a deep feature extractor from an image, generate a first error value according to the image and the deep features by a primary algorithm model and transmitting the first error value to the deep feature extractor, generate a second error value according to the image and the deep features by a secondary algorithm model and transmitting the second error value to the deep feature extractor, adjusting the extracted deep features based on the first and second error values by the deep feature extractor, and generating a lane prediction result by the deep feature extractor and the primary algorithm model.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="421" publication-number="202611777"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611777.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611777</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134609</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>時序特徵的輔助模組</chinese-title>  
        <english-title>TEMPORAL ASSISTANT MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G06N3/02</main-classification>  
        <further-classification edition="202301120250102B">G06N3/045</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳修志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱奕凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴國榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種時序特徵的輔助模組，用於單目3D 物件偵測，其中經由該時序特徵的輔助模組(temporal assistant module)，分別調整該遞迴神經網路模組（Recurrent Neural Networks module）、該長短期記憶模組（Long Short-Term Memory module, LSTM module）、以及該閘門循環單元模組(Gated Recurrent Unit module, GRU module)的當下時間點的一隱藏狀態資訊(H &lt;sub&gt;t&lt;/sub&gt;)、以及當下時間點的一輸出狀態資訊(Y &lt;sub&gt;t&lt;/sub&gt;)，藉以對物件被遮蔽、被移出偵測畫面、或是小物件偵測，增強輔助效果的平均精準度(average precision, AP)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">X&lt;sub&gt;t&lt;/sub&gt;:當下時間點的輸入狀態資訊</p>  
        <p type="p">Y&lt;sub&gt;t&lt;/sub&gt;:當下時間點的輸出狀態資訊</p>  
        <p type="p">H&lt;sub&gt;t-1&lt;/sub&gt;:前一時間點的隱藏狀態資訊</p>  
        <p type="p">H&lt;sub&gt;t&lt;/sub&gt;:當下時間點的隱藏狀態資訊</p>  
        <p type="p">C&lt;sub&gt;t-1&lt;/sub&gt;:前一時間點的單元狀態</p>  
        <p type="p">C&lt;sub&gt;t&lt;/sub&gt;:當下時間點的單元狀態</p>  
        <p type="p">64:第2激勵函數層</p>  
        <p type="p">65:第3激勵函數層</p>  
        <p type="p">54:第1二維卷積層</p>  
        <p type="p">53:第2二維卷積層</p>  
        <p type="p">55:第1連接層</p>  
        <p type="p">56:第3二維卷積層</p>  
        <p type="p">57:第2連接層</p>  
        <p type="p">61:遺忘閘</p>  
        <p type="p">62:輸入閘</p>  
        <p type="p">63:輸出閘</p>  
        <p type="p">64:第2激勵函數</p>  
        <p type="p">71:重製閘</p>  
        <p type="p">72:更新閘</p>  
        <p type="p">73:第4激勵函數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="422" publication-number="202610568"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610568.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610568</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134618</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>摺疊式兒童學習塔</chinese-title>  
        <english-title>FOLDABLE CHILDREN LEARNING TOWER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">A47D13/00</main-classification>  
        <further-classification edition="200601120241127B">A63B9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余乃玄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, NAI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余乃玄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, NAI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種創新的摺疊式兒童學習塔，包括前腳總成、後腳總成及學習平台。前腳總成與後腳總成以樞接機構樞連，學習平台跨接於前腳架與後腳架之間。樞接機構包括二差軸轉桿、設於前腳架上的二第一樞部及設於後腳架上的二第二樞部。二差軸轉桿具有第三樞部及第四樞部。二差軸轉桿的第三樞部與相對應的二第一樞部樞接而構成第一軸心，且其第四樞部與相對應的二第二樞部樞接而構成第二軸心，使前腳架與後腳架同步地以第一軸心及第二軸心為轉軸，而於一收合位置與一展開位置之間相對旋轉。藉以達到簡便操作、縮小材積及增進美觀之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An innovative foldable children's learning tower comprises a front leg assembly, a rear leg assembly, and a learning platform. The front leg assembly is pivotally connected to the rear leg assembly by a pivot mechanism, and the learning platform is positioned between the front and rear leg frames. The pivot mechanism includes a differential shaft, two first pivot parts on the front leg frame, and two second pivot parts on the rear leg frame. The differential shaft has a third pivot part and a fourth pivot part. The third pivot part of the differential shaft is pivotally connected to the corresponding first pivot parts to form a first axis, while the fourth pivot part is pivotally connected to the corresponding second pivot parts to form a second axis. This allows the front and rear leg frames to rotate synchronously around the first and second axes between a folded position and an unfolded position, achieving the objectives of easy operation, compactness, and enhanced aesthetics.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:前腳總成</p>  
        <p type="p">10a:前腳架</p>  
        <p type="p">101:前腳上結構樑</p>  
        <p type="p">102:前腳後結構樑</p>  
        <p type="p">20:後腳總成</p>  
        <p type="p">20a:後腳架</p>  
        <p type="p">201:後腳學習平台支撐梁</p>  
        <p type="p">202:踏階</p>  
        <p type="p">30:樞接機構</p>  
        <p type="p">31:差軸轉桿</p>  
        <p type="p">40:學習平台</p>  
        <p type="p">50:兒童護欄總成</p>  
        <p type="p">51:橫桿</p>  
        <p type="p">60:防傾倒裝置總成</p>  
        <p type="p">601:防傾倒側支柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="423" publication-number="202612213"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612213.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612213</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134620</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>不斷電系統</chinese-title>  
        <english-title>UNINTERRUPTIBLE POWER SUPPLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">H02J9/06</main-classification>  
        <further-classification edition="201601120241128B">H02J5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊永盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, YUNG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, KUO-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種不斷電系統，包含雙向交流-直流轉換器、諧振轉換器、自動電壓調節電路、控制單元。當交流輸入電壓超出預定電壓範圍且位於電壓調節範圍內時，自動電壓調節電路、諧振轉換器及雙向交流-直流轉換器依據交流輸入電壓而於電力輸出端產生交流補充電壓，並依據交流輸入電壓及交流補充電壓產生交流輸出電壓，以使交流輸出電壓位於預定電壓範圍。當交流輸入電壓超出電壓調節範圍時，諧振轉換器及雙向交流-直流轉換器依據電池的放電電壓、而於電力輸出端產生交流輸出電壓，並使交流輸出電壓位於預定電壓範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An uninterruptible power supply system includes a bidirectional AC-DC converter, a resonant converter, an automatic voltage regulation circuit and a control unit. When the AC input voltage exceeds a predetermined voltage range and is within a voltage regulation range, the automatic voltage regulation circuit, the resonant converter and the bidirectional AC-DC converter generate an AC supplementary voltage at a power output terminal based on the AC input voltage, and an AC output voltage is generated based on the AC input voltage and the AC supplementary voltage, so that the AC output voltage is within the predetermined voltage range. When the AC input voltage exceeds the voltage regulation range, the resonant converter and the bidirectional AC-DC converter generate the AC output voltage at the power output terminal based on a discharge voltage of a battery, and keep the AC output voltage within the predetermined voltage range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:不斷電系統</p>  
        <p type="p">102:電池</p>  
        <p type="p">104:雙向交流-直流轉換器</p>  
        <p type="p">106:諧振轉換器</p>  
        <p type="p">108:自動電壓調節電路</p>  
        <p type="p">110:控制單元</p>  
        <p type="p">I/P:交流輸入電壓</p>  
        <p type="p">O/P:交流輸出電壓</p>  
        <p type="p">Pin:電力輸入端</p>  
        <p type="p">Pout:電力輸出端</p>  
        <p type="p">L,L’:火線端</p>  
        <p type="p">N,N’:中性端</p>  
        <p type="p">RY1:第一繼電器</p>  
        <p type="p">RY1a:第一輸入繼電器</p>  
        <p type="p">RY1b:第一中性繼電器</p>  
        <p type="p">RY2:第二繼電器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="424" publication-number="202611307"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611307.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611307</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134622</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適用於彩色陽極處理之壓鑄鋁合金材料及其製造方法</chinese-title>  
        <english-title>ANODIC OXIDATION-COLORABLE ALUMINUM DIE CASTING ALLOY FOR COLOR AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240920B">C22C21/10</main-classification>  
        <further-classification edition="200601120240920B">C22F1/053</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藏古國際金屬有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>C H INTERNATIONAL CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳妍臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖玉惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種壓鑄鋁合金材料，適用於彩色陽極處理，具有如下以重量百分比計之組成：矽的含量為0.05%~0.1%、鐵的含量為0.45%~0.83%、銅的含量為0.018%~0.05%、錳的含量為1.2~2.6%、鎂的含量為0.35~0.7%、鋅的含量為3.3~4%，鉻的含量為0.04~0.08%，其餘由鋁及不可避免之微量金屬所構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A aluminum die-cast alloy, suitable for color-anodizing, consisting of: 0.05 wt% to 0.1 wt% silicon, 0.45 wt% to 0.83 wt% iron, 0.018 wt% to 0.05 wt% copper, 1.2 wt% to 2.6 wt% manganese, 0.35~0.7% magnesium, 3.3 wt% to 4 wt% zinc, 0.04 wt% to 0.08 wt% chromium and the rest is composed of aluminum and unavoidable impurities.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="425" publication-number="202610855"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610855.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610855</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134623</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動車輛的電池系統、控制方法及電池管理系統</chinese-title>  
        <english-title>BATTERY SYSTEM, CONTROL METHOD AND BATTERY MANAGEMENT SYSTEM FOR ELECTRIC VEHICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120240925B">B60L50/60</main-classification>  
        <further-classification edition="201901120240925B">B60L58/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張至翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種用於電動車輛的電池系統。電池系統包括主電池，用以驅動所述電動車輛的馬達；低壓電池，用以驅動所述電動車輛的低壓系統，其中所述低壓系統包括門鎖控制裝置、車內娛樂系統、車內燈光系統、空調系統和所述電池系統的加熱裝置的至少其中之一；以及抽換式電池模組，用以放置至少一個可抽換式電池和對所述低壓電池充電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery system for an electric vehicle is provided. The battery system includes a main battery configured to drive a motor of the electric vehicle; a low-voltage battery configured to drive a low-voltage system of the electric vehicle; and a swappable battery module configured to accommodate at least one swappable battery and charge the low-voltage battery. The low-voltage system includes at least one of a door lock control system, an in-car entertainment system, an in-car lighting system, an air conditioning system and a heating device of the battery system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電池系統</p>  
        <p type="p">12:馬達</p>  
        <p type="p">14:低壓系統</p>  
        <p type="p">16:電池管理系統</p>  
        <p type="p">101:主電池</p>  
        <p type="p">103:低壓電池</p>  
        <p type="p">105:抽換式電池</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="426" publication-number="202611509"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611509.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611509</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134624</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多用途之超音波換能器</chinese-title>  
        <english-title>MULTI-PURPOSE ULTRASONIC TRANSDUCER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G01N29/14</main-classification>  
        <further-classification edition="200601120241007B">A61B8/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳世達科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QISDA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣富昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, FU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種超音波換能器，包括第一換能器與第二換能器。第一換能器包括複數個第一陣列單元，係沿第一方向排列以形成第一陣列，其中第一方向是超音波換能器的長軸的方向。第二換能器包括複數個第二陣列單元，係沿第一方向排列以形成第二陣列，第二陣列與第一陣列係交錯設置並且彼此分離，其中第二陣列單元之一者夾設於對應之第一陣列單元之相鄰兩者之間。第一換能器與第二換能器具有共同參考座標，並且第一換能器與第二換能器沿第二方向具有多焦點透鏡的功能，第二方向是超音波換能器的短軸的方向並且實質垂直於第一方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An ultrasonic transducer, includes a first transducer and a second transducer. The first transducer includes a plurality of first array units arranged along a first direction to form a first array, wherein the first direction is a direction of a long axis of the ultrasonic transducer. The second transducer includes a plurality of second array units arranged along the first direction to form a second array. The second array and the first array are staggered and separated from each other, wherein one of the second array units is sandwiched between adjacent two of corresponding first array units. The first transducer and the second transducer have a common reference coordinate, and the first transducer and the second transducer have a function of a multi-focus lenses along the second direction, and the second direction is a direction of a short axis of the ultrasonic transducer, and is substantially perpendicular to the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">D1,D2,D3:方向</p>  
        <p type="p">101,201:換能器</p>  
        <p type="p">L1~L64,R1~R64:陣列單元</p>  
        <p type="p">PJ1,PJ2:長條形投影</p>  
        <p type="p">A1,A2:陣列</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="427" publication-number="202610566"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610566.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610566</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134631</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>座椅的調整方法、系統與控制器</chinese-title>  
        <english-title>METHOD, SYSTEM AND CONTROLLER FOR SEAT ADJUSTMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">A47C31/12</main-classification>  
        <further-classification edition="200601120241128B">A47C1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳國華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUO-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種座椅的調整方法，包括透過感測器系統，取得從座椅的椅墊前面向前起算的第一距離以及從座椅的椅背背面向後起算的第二距離；以及根據第一距離以及第二距離，透過座椅調整機構前後調整座椅。此外，使用此方法的調整系統及控制器亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for adjusting a seat. The method includes obtaining a first distance starting from a front surface of a seat pan of the seat and a second distance starting from a rear surface of a seat back of the seat through a sensor system; and adjusting the seat forward and backward according to the first distance and the second distance through a seat adjustment mechanism. In addition, a system and a controller employing this method for adjustment are also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:控制器</p>  
        <p type="p">1201:第一距離感測器</p>  
        <p type="p">1202:第二距離感測器</p>  
        <p type="p">20:座椅</p>  
        <p type="p">210:椅墊前面</p>  
        <p type="p">220:椅背背面</p>  
        <p type="p">D1:第一距離</p>  
        <p type="p">D2:第二距離</p>  
        <p type="p">D3:調整前距離</p>  
        <p type="p">D4:小腿徑</p>  
        <p type="p">D5:餘隙距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="428" publication-number="202611844"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611844.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611844</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134632</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳減量規畫系統</chinese-title>  
        <english-title>CARBON REDUCTION PLANNING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241101B">G06Q50/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>行富投資股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HF INVESTMENT CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李健豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種碳減量規畫系統包含一伺服器。該伺服器與一使用者介面訊號相連，且該伺服器包含一碳排分析模組、一資料庫、一減碳模組以及一計算模組。該使用者介面接收一碳排單元資料並傳輸至該伺服器，該碳排分析模組對該碳排單元資料進行分析並產生一碳排放量資料，其中該碳排單元資料包含一組織或一場域中複數個廠房、複數個設備或複數個設施的資訊，或生產一產品之一生產資料。該減碳模組透過該資料庫取得對照該碳排放量資料之一減碳手段或一減碳檢視規則，並取得一減碳規畫資料。該計算模組將該碳排放量資料對照該減碳規畫資料產生一碳減量規畫報告，並傳輸至該使用者介面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A carbon reduction planning system having a server. The server is signally connected to a user interface. The server includes a carbon emission analysis module, a database, a carbon reduction module, and a computation module. The user interface receives and transmits carbon emission unit data to the server. The carbon emission analysis module analyzes the carbon emission unit data and generates carbon emission data. The carbon emission unit data includes information on multiple factories, multiple pieces of equipment, or multiple facilities within an organization or a site, or production data for producing a product. The carbon reduction module obtains carbon reduction measures or a carbon reduction review rule corresponding to the carbon emission data through the database and acquires carbon reduction planning data. The computation module compares the carbon emission data with the carbon reduction planning data to generate a carbon reduction planning report and transmit the carbon reduction planning report to the user interface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:碳減量規畫系統</p>  
        <p type="p">11:使用者介面</p>  
        <p type="p">12:伺服器</p>  
        <p type="p">121:碳排分析模組</p>  
        <p type="p">122:資料庫</p>  
        <p type="p">123:減碳模組</p>  
        <p type="p">124:計算模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="429" publication-number="202611590"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611590.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611590</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134637</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像光學系統、取像裝置及電子裝置</chinese-title>  
        <english-title>IMAGING OPTICAL LENS SYSTEM, IMAGING APPARATUS AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">G02B11/34</main-classification>  
        <further-classification edition="202101120241128B">G02B7/02</further-classification>  
        <further-classification edition="200601120241128B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN PRECISION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周憫恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, MIN-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖冠智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, GUAN-JR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種成像光學系統，其由物側至像側依序包含八片透鏡，且所述八片透鏡由物側至像側為一第一透鏡、一第二透鏡、一第三透鏡、一第四透鏡、一第五透鏡、一第六透鏡、一第七透鏡以及一第八透鏡。各透鏡皆具有一物側表面朝向物側以及一像側表面朝向像側。第一透鏡具有負屈折力。第二透鏡具有負屈折力。第二透鏡像側表面近光軸處為凹面。第四透鏡物側表面近光軸處為凹面。第五透鏡物側表面近光軸處為凸面。第六透鏡具有負屈折力。第八透鏡像側表面包含至少一反曲點。當滿足特定條件時，可提供高成像品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imaging optical lens system includes eight lens elements, which are, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element and an eighth lens element. Each of the lens elements has an object-side surface facing towards the object side and an image-side surface facing towards the image side. The first lens element has negative refractive power. The second lens element has negative refractive power. The image-side surface of the second lens element is concave in a paraxial region thereof. The object-side surface of the fourth lens element is concave in a paraxial region thereof. The object-side surface of the fifth lens element is convex in a paraxial region thereof. The sixth lens element has negative refractive power. The image-side surface of the eighth lens element includes at least one inflection point. When specific conditions of the imaging optical lens system are satisfied, the high image quality can be provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:取像裝置</p>  
        <p type="p">IS:電子感光元件</p>  
        <p type="p">E1:第一透鏡</p>  
        <p type="p">E2:第二透鏡</p>  
        <p type="p">E3:第三透鏡</p>  
        <p type="p">E4:第四透鏡</p>  
        <p type="p">E5:第五透鏡</p>  
        <p type="p">E6:第六透鏡</p>  
        <p type="p">E7:第七透鏡</p>  
        <p type="p">E8:第八透鏡</p>  
        <p type="p">E9:濾光元件</p>  
        <p type="p">ST:光圈</p>  
        <p type="p">IMG:成像面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="430" publication-number="202611244"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611244.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611244</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134642</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面處理劑與使用其製造的覆銅積層板</chinese-title>  
        <english-title>SURFACE-TREATING AGENT AND COPPER CLAD LAMINATE MANUFACTURED USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">C09D183/04</main-classification>  
        <further-classification edition="201801120240930B">C09D7/40</further-classification>  
        <further-classification edition="200601120240930B">B32B15/092</further-classification>  
        <further-classification edition="200601120240930B">B32B15/20</further-classification>  
        <further-classification edition="200601120240930B">B32B27/04</further-classification>  
        <further-classification edition="200601120240930B">B32B27/38</further-classification>  
        <further-classification edition="200601120240930B">H05K3/38</further-classification>  
        <further-classification edition="200601120240930B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宏毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俐婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃威儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種表面處理劑與使用其製造的覆銅積層板。表面處理劑包括：矽烷偶合劑以及水性表面助劑。其中水性表面助劑包括：短鏈有機矽表面活性劑、長鏈有機矽表面活性劑、改性苯乙烯-馬來酸共聚物、聚丙烯酸酯或炔二醇。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A surface-treating agent and a copper clad laminate manufactured using the same are provided. The surface-treating agent includes silane coupling agent and aqueous surface additive. The aqueous surface additive includes short chain organosilicon surfactant, long chain organosilicon surfactant, modified styrene-maleic acid copolymer, polyacrylate or acetylene glycol.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="431" publication-number="202611999"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611999.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611999</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134643</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">H01L21/302</main-classification>  
        <further-classification edition="200601120240926B">H01L21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林曉江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIAO-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野村佳廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOMURA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昭文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHAO WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構的製造方法，包括以下步驟。提供基底。藉由微影製程在基底上形成圖案化光阻層。圖案化光阻層包括第一開口與第二開口。第一開口包括第一傾斜側壁。使用圖案化光阻層作為罩幕，對基底進行蝕刻製程，而在基底中形成對應於第一開口的第三開口與對應於第二開口的第四開口。第三開口包括第二傾斜側壁。在基底上形成導電層。導電層填入第三開口與第四開口。利用位在第三開口中的導電層作為終止層，移除部分導電層，而在第三開口中形成標記且在第四開口中形成基底穿孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of a semiconductor structure including the following steps is provided. A substrate is provided. A patterned photoresist layer is formed on the substrate by a lithography process. The patterned photoresist layer includes a first opening and a second opening. The first opening includes a first inclined sidewall. An etching process is performed on the substrate by using the patterned photoresist layer as a mask to form a third opening corresponding to the first opening and a fourth opening corresponding to the second opening in the substrate. The third opening includes a second inclined side wall. A conductive layer is formed on the substrate. The conductive layer fills the third opening and the fourth opening. A portion of the conductive layer is removed by using the conductive layer located in the third opening as a stop layer to form a mark in the third opening and a through-substrate via (TSV) in the fourth opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">104:導電層</p>  
        <p type="p">OP5,OP6:開口</p>  
        <p type="p">S3:傾斜側壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="432" publication-number="202612024"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612024.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612024</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134645</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240923B">H01L21/31</main-classification>  
        <further-classification edition="200601120240923B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牛培倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIU, PEI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構的製造方法，包括以下步驟。提供基底。基底包括第一區與第二區。第二區位在第一區旁。第一區包括中央區與邊緣區。邊緣區圍繞中央區。在第一區的基底上具有第一結構。在第二區的基底上具有第二結構。第一結構的高度高於第二結構的高度。在第一結構與第二結構上形成材料層。在材料層中形成多個開口。中央區中的多個開口的總上視面積除以中央區的總上視面積所得的值大於邊緣區中的多個開口的總上視面積除以邊緣區的總上視面積所得的值。對材料層進行化學機械研磨製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of a semiconductor structure including the following steps is provided. A substrate is provided. The substrate includes a first region and a second region. The second region is located aside the first region. The first region includes a central region and an edge region. The edge region surrounds the central region. There is a first structure on the substrate in the first region. There is a second structure on the substrate in the second region. The height of the first structure is higher than the height of the second structure. A material layer is formed on the first structure and the second structure. Openings are formed in the material layer. The value obtained by dividing the total top-view area of the openings in the central region by the total top-view area of the central region is greater than the value obtained by dividing the total top-view area of the of openings in the edge region by the total top-view area of the edge region. A chemical mechanical polishing process is performed on the material layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">106:材料層</p>  
        <p type="p">OP,OP1,OP2,OP21,OP22,OP23:開口</p>  
        <p type="p">P1:第一部分</p>  
        <p type="p">P2:第二部分</p>  
        <p type="p">R1:第一區</p>  
        <p type="p">R2:第二區</p>  
        <p type="p">RC:中央區</p>  
        <p type="p">RE,RE1,RE2:邊緣區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="433" publication-number="202611447"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611447.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611447</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134646</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用遠端觸發控制之電熱水器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120240923B">F24H9/20</main-classification>  
        <further-classification edition="202201120240923B">F24H1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠鋒科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王勝鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關於一種利用遠端觸發控制之電熱水器，其包含有一電熱儲水桶，係包括有一溫度感測模組以及一電性連接溫度感測模組之本地通信處理模組，其中溫度感測模組產生一溫度信號傳輸至本地通信處理模組；以及一遠端控制裝置，係包括有一電性連接電熱儲水桶之本地通信處理模組之遠端通信模組、一電性連接遠端通信模組之處理模組、一電性連接處理模組之觸發模組以及一電性連接處理模組之顯示模組，其中觸發模組產生一觸發信號傳輸至處理模組，使遠端通信模組接收本地通信處理模組之溫度信號，令處理模組分析溫度信號後，將對應的溫度顯示於顯示模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電熱儲水桶</p>  
        <p type="p">11:溫度感測模組</p>  
        <p type="p">12:本地通信處理模組</p>  
        <p type="p">2:遠端控制裝置</p>  
        <p type="p">21:遠端通信模組</p>  
        <p type="p">22:處理模組</p>  
        <p type="p">23:觸發模組</p>  
        <p type="p">24:顯示模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="434" publication-number="202610861"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610861.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610861</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134649</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池能源站之電池記錄管理方法及系統</chinese-title>  
        <english-title>BATTERY LOGS MANAGEMENT METHODS AND SYSTEMS FOR BATTERY ENERGY STATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120240924B">B60L53/68</main-classification>  
        <further-classification edition="201901120240924B">B60L53/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWANG YANG MOTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許啟輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHI-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志風</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈怡宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池能源站之電池紀錄管理方法及系統。首先，對於電池能源站中充電中之每一電池，週期地以一第一時間間隔由每一該等電池取得至多一既定筆數之電池紀錄，並將至多該既定筆數之該電池紀錄透過一網路傳送至一遠端伺服器，直至每一該等電池中之已無該電池能源站未取得之該電池紀錄。當該等電池中之一第一電池之該電量已經達到一飽電狀態時，致使該第一電池進入一睡眠狀態。接著，週期地以一第二時間間隔喚醒該第一電池。當該第一電池中存在該電池能源站尚未取得之該電池紀錄時，由該第一電池取得至多該既定筆數之該電池紀錄，並將至多該既定筆數之該電池紀錄透過該網路傳送至該遠端伺服器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Battery logs management methods and systems for battery energy stations are provided. First, for each battery that is being charged in a battery energy station, at most a predetermined number of battery logs are periodically obtained from each of the batteries at a first time interval, and at most the predetermined number of battery logs are transmitted to a remote server through a network until there are no more battery logs that the battery energy station has not obtained in each of the batteries. When the power of a first battery among the batteries has reached a fully charged state, the first battery is caused to enter a sleep state. Then, the first battery is periodically waked up at a second time interval. When there are battery logs that has not been obtained by the battery energy station in the first battery, at most the predetermined number of battery logs are obtained from the first battery, and transmitted to the remote server through the network.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S502、S504、S506、S508、S510、S512:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="435" publication-number="202611776"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611776.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611776</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>識別裝置、識別裝置的形成方法及包括識別裝置的定位追蹤系統</chinese-title>  
        <english-title>IDENTIFICATION DEVICE, FORMING METHOD OF IDENTIFICATION DEVICE, AND POSITIONING AND TRACKING SYSTEM INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">G06K19/07</main-classification>  
        <further-classification edition="200601120241128B">H04B7/00</further-classification>  
        <further-classification edition="200601120241128B">A01K35/00</further-classification>  
        <further-classification edition="201001120241128B">G01S19/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳測新技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XTREME TESTEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張成凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪嘉鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李松興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃富源</last-name>  
                <first-name>桃園市中壢區延平路500號12樓之1　B室</first-name> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種識別裝置、識別裝置的形成方法及包括識別裝置的定位追蹤系統於此揭露。識別裝置包括第一環狀部、第二環狀部以及基材。基材具有相對的第一表面與第二表面。在第一表面上形成有識別資訊，且在第二表面上形成有通訊模組。基材係環繞第一環狀部的內側設置，以及基材係環繞第二環狀部的外側設置。第一環狀部貼附於第一表面且覆蓋識別資訊，以及第二環狀部貼附於第二表面且覆蓋該通訊模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:識別裝置</p>  
        <p type="p">110:第一環狀部</p>  
        <p type="p">120:第二環狀部</p>  
        <p type="p">130:基材</p>  
        <p type="p">131:第一表面</p>  
        <p type="p">132:第二表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="436" publication-number="202610560"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610560.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610560</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134651</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吹塑成型之全片式充氣氣墊</chinese-title>  
        <english-title>A BLOW-MOLDED FULL-PIECE INFLATABLE AIR CUSHION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A43B13/20</main-classification>  
        <further-classification edition="200601120240929B">A43B13/14</further-classification>  
        <further-classification edition="200601120240929B">A43B13/37</further-classification>  
        <further-classification edition="200601120240929B">A43B17/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅枝芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHIH-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅枝芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHIH-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊益松</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種吹塑成型之全片式充氣氣墊，其與一鞋大底相結合，其包括﹕前掌氣墊部具有前氣室；後掌調控部具有後氣室，且於後掌調控部之頂面向內凹設形成置納槽；側向導接部兩端分別連接前掌氣墊部、後掌調控部並具有側氣室，前掌氣墊部、後掌調控部及側向導接部係以吹塑加工形成一體式結構，且前氣室、後氣室及側氣室為相互導通；及彈性吸汲總成裝設於置納槽，彈性吸汲總成包含彈性囊件、吸氣管道組及排氣管道組，吸氣管道組及排氣管道組皆以一端連接於彈性囊件，而排氣管道組的另一端則連接於前掌氣墊部並與前氣室連通；彈性囊件受壓變形時，位於彈性囊件內部的氣體得以從排氣管道組充填進入前氣室內，並充飽於前氣室、後氣室、側氣室內，足部保護上更為全面，不僅是侷限於前腳掌部位，而能確實的將足部所有的位置所承受的外力得到有效的緩衝，改善習知僅能針對足部受力較多的前腳掌部位給予緩衝之功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a blow-molded full-piece inflatable air cushion, which is combined with a shoe outsole and includes: the forefoot air cushion part has a front air chamber; the back sole control part has a rear air chamber, and the back sole control part has a rear air chamber. The top surface is concave to form a receiving groove; the two ends of the lateral guide part are respectively connected to the forefoot air cushion part and the rear palm control part and have side air chambers. The forefoot air cushion part, the back palm control part and the lateral guide part are connected to The blow molding process forms an integrated structure, and the front air chamber, the rear air chamber and the side air chamber are connected to each other; and the elastic suction assembly is installed in the receiving groove, and the elastic suction assembly includes an elastic bladder, an air suction The pipe group and the exhaust pipe group, the suction pipe group and the exhaust pipe group are connected to the elastic bladder at one end, and the other end of the exhaust pipe group is connected to the forefoot air cushion and communicates with the front air chamber; the elastic bladder When the piece is deformed under pressure, the gas inside the elastic bladder can be filled into the front air chamber from the exhaust duct group, and filled in the front air chamber, rear air chamber, and side air chamber. The foot protection is more comprehensive, not only It is limited to the forefoot area, and can effectively buffer the external forces borne by all positions of the foot, improving the conventional function of only providing cushioning for the forefoot area that bears more force.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鞋大底</p>  
        <p type="p">1:前掌氣墊部</p>  
        <p type="p">12:強化槽</p>  
        <p type="p">2:後掌調控部</p>  
        <p type="p">22:置納槽</p>  
        <p type="p">3:側向導接部</p>  
        <p type="p">4:彈性吸汲總成</p>  
        <p type="p">6:調控件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="437" publication-number="202610694"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610694.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610694</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134652</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抽痰管定位系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">A61M1/00</main-classification>  
        <further-classification edition="201801120250203B">G16H40/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺北醫學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIPEI MEDICAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周百謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, PAI-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇雪蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HSUEH-LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊雅婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUANG, YA-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種抽痰管定位系統，適用於呼吸道並包括設在鄰近呼吸道並用以收集呼吸音頻的收音單元、具抽氣動力源、光源與處理器的抽痰單元、具連通於抽氣動力源的起始端及位於呼吸道內的末端的抽痰管、具圍繞抽痰管的管本體的導引鞘、導引線與光纖。管本體具圍繞起始端與末端外圍的第一、二端及相反設置的第一、二穿孔。第一、二穿孔沿管本體軸向貫穿，導引線與光纖各設在第一、二穿孔中以供光源由第一端放射並經光纖的全反射導引至第二端。處理器訊號連接於收音單元並透過預載的演算法分析呼吸音頻從而確認抽痰管末端所在位置並產生操作資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:抽痰單元</p>  
        <p type="p">31:抽氣動力源</p>  
        <p type="p">32:光源</p>  
        <p type="p">33:處理器</p>  
        <p type="p">4:抽痰管</p>  
        <p type="p">41:起始端</p>  
        <p type="p">42:末端</p>  
        <p type="p">5:導引鞘</p>  
        <p type="p">5111:第一端</p>  
        <p type="p">5112:第二端</p>  
        <p type="p">9:使用者</p>  
        <p type="p">91:呼吸道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="438" publication-number="202611363"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611363.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611363</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134655</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紙漿模塑連接件和包含該紙漿模塑連接件的組件及組件的製造方法</chinese-title>  
        <english-title>PULP MOLDED CONNECTOR, AN ASSEMBLY INCLUDING THE PULP MOLDED CONNECTOR, AND A MANUFACTURING METHOD OF THE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">D21J3/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州市誠鑫環保科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU CITY CHENG XIN ENVIRONMENTAL PROTECTION TECHNOLOGY CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴宗伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, TZUNG-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏世坪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, SHIH-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董良義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNG, LIANG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳茂翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MAO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種紙漿模塑連接件和包含該紙漿模塑連接件的組件及組件的製造方法，紙漿模塑連接件適用於結合於容器蓋及容器上，使容器蓋和容器可相結合，紙漿模塑連接件為紙漿模塑一體成型件且包括：端板部、側板部和連接部，側板部圍繞端板部設置，連接部連接端板部與側板部，能夠從端板部的周側翻轉至端板部的同側，側板部的表面形成有連接結構，連接結構用於容器蓋與容器的連接，本發明的紙漿模塑連接件，既能呈現側板部位於端板部的周側的展開狀態以便於製造，又能呈現側板部位於端板部的同側的圍立狀態從而滿足與容器或容器蓋的裝配要求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a pulp molded connector, an assembly including the pulp molded connector, and a manufacturing method of the assembly. The pulp molded connector is configured to connect with a container lid and a container so that the container lid and the container are connected. The pulp molding connector is a pulp molding one-piece molded part and includes: an end plate portion, a side plate portion and a connecting portion, wherein the side plate portion is arranged around the end plate portion, the connecting portion is connected with the end plate portion and the side plate portion so as to be turned from the end plate portion, and a connection structure is formed on the surface of the side plate portion. The connection structure is used to connect the container lid and the container. The pulp molding connector of the present invention can not only present the side plate portion, but the unfolded state is located on the peripheral side of the end plate portion, thus obtaining easy manufacture. In addition, the encircling state of the side plate portion located on the same side of the end plate portion can be presented to meet the assembly requirements with the container or container lid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:紙漿模塑連接件</p>  
        <p type="p">1:端板部</p>  
        <p type="p">2:側板部</p>  
        <p type="p">21:連接結構</p>  
        <p type="p">22:柱形空間</p>  
        <p type="p">3:連接部</p>  
        <p type="p">4:凸出部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="439" publication-number="202610735"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610735.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610735</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134657</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>粉塵集中罩</chinese-title>  
        <english-title>DUST COLLECTION HOOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">B08B15/02</main-classification>  
        <further-classification edition="200601120241029B">B08B17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳麒安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王躍鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUE-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李書鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張沁柔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIN-JOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁麗雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, LI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王新斐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSIN-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種粉塵集中罩，用以解決習知熱噴塗製作過程的粉塵噴濺及材料浪費的問題。係包含：一框架，具有數個遮擋面及一開放面，該數個遮擋面以側面圍繞一工作空間，該開放面係該工作空間之側向開口；及數個耐衝擊板，可拆卸地貼附於正對該開放面的至少一該遮擋面，該數個耐衝擊板以耐熱且抗沾黏的材料製成。藉此可以達成減少材料汙染及提升回收效率的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dust collection hood is provided to solve the problem of dust splashing and material waste in the conventional thermal spraying process. The dust collection hood includes a frame with a plurality of shielding surfaces and an open side, and a plurality of impact-resistant plates. The plurality of shielding surfaces surrounds a workspace with sides. The open side is the lateral opening of the workspace. The plurality of impact-resistant plates is detachably attached to at least one of the shielding surfaces facing the open side. The plurality of impact-resistant plates is made of heat-resistant and anti-stick materials. The dust collection hood provides the effects of reducing material contamination and improving recycling efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:框架</p>  
        <p type="p">11:遮擋面</p>  
        <p type="p">11a:磁吸元件</p>  
        <p type="p">11b:開孔</p>  
        <p type="p">12:開放面</p>  
        <p type="p">13:斜面</p>  
        <p type="p">13a:通孔</p>  
        <p type="p">2:耐衝擊板</p>  
        <p type="p">21:磁鐵貼片</p>  
        <p type="p">22:對位件</p>  
        <p type="p">S:工作空間</p>  
        <p type="p">C:收集槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="440" publication-number="202610743"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610743.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610743</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134658</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>粉末回收裝置</chinese-title>  
        <english-title>POWDER RECYCLING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241105B">B22F10/73</main-classification>  
        <further-classification edition="202201120241105B">B09B3/20</further-classification>  
        <further-classification edition="201501220241105B">B33Y30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳麒安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王躍鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUE-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李書鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張沁柔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIN-JOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁麗雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, LI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王新斐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSIN-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種粉末回收裝置，用以解決習知收集槽對高溫不規則粉末的收集效率低的問題。係包含：一承接盤，具有至少一斜面及一管道，該至少一斜面朝該管道方向傾斜，且其底端鄰接該管道之一上開口，該至少一斜面的底端緣與該管道的上開口緣形成大於90度的一夾角；一儲料盒，連通該管道；及一振動模組，驅動該承接盤產生振動，使粉末自該至少一斜面移動且通過該管道移至該儲料盒。藉此可以提升粉末材料的回收效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A powder recycling device is provided to solve the problem of low collection efficiency of high-temperature and irregular powders in the conventional collection tank. The powder recycling device includes a receiving plate with at least one slope and a pipe, a storage box connected to the pipe, and a vibration module. The at least one slope is inclined toward the direction of the pipe. The bottom end of the at least one slope is adjacent to an upper opening of the pipe. The bottom edge of the at least one slope forms an angle greater than 90 degrees with the upper opening edge of the pipe. The vibration module drives the receiving plate to vibrate, causing the powder to move from the at least one slope and enter the storage box through the pipe. The powder recycling device provides the effect of improving the recycling efficiency of powder material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:承接盤</p>  
        <p type="p">11:斜面</p>  
        <p type="p">12:管道</p>  
        <p type="p">2:振動模組</p>  
        <p type="p">3:儲料盒</p>  
        <p type="p">4:孔蓋</p>  
        <p type="p">43:凸塊</p>  
        <p type="p">5:抽氣單元</p>  
        <p type="p">F:擋板</p>  
        <p type="p">G:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="441" publication-number="202612350"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612350.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612350</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像品質改善方法及其監控系統</chinese-title>  
        <english-title>IMAGE QUALITY IMPROVEMENT METHOD AND SURVEILLANCE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250418B">H04N23/74</main-classification>  
        <further-classification edition="202301120250418B">H04N23/60</further-classification>  
        <further-classification edition="200601120250418B">H04N5/30</further-classification>  
        <further-classification edition="202201120250418B">G06V10/764</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶睿通訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIVOTEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高鵬豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, PENG-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHANG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像品質改善方法，應用於一監控系統之一運算處理器。該影像品質改善方法包含有驅動該監控系統之一第一光源發出一第一照明光束，驅動該監控系統之一影像攝影機取得關聯於該第一光束之一第一影像，以及根據該第一影像之一分析結果，決定是否驅動該監控系統之一第二光源發出一第二照明光束、和/或決定該第二照明光束之一照明亮度。該第一光源與該第二光源係分別為一不可見光光源和一可見光光源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image quality improvement method is applied to an operation processor of a surveillance system and includes driving a first light source of the surveillance system to emit a first illumination beam, driving an image camera of the surveillance system to capture a first image relevant to the first illumination beam, and decide whether to drive a second light source of the surveillance system to emit a second illumination beam and/or decide an illumination intensity of the second illumination beam in accordance with an analysis result of the first image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S102、S104、S106、S108、S110、S112、S114、S116、S118:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="442" publication-number="202611673"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611673.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611673</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134662</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及用於其之溫控方法</chinese-title>  
        <english-title>TEMPERATURE CONTROL METHOD THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">G06F1/20</main-classification>  
        <further-classification edition="200601120241128B">F28F27/00</further-classification>  
        <further-classification edition="200601120241128B">F04D25/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯保辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, PAO-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包含：一風扇，用於逸散所述電子裝置內的第一熱能；一阻流模組，設置於所述第一熱能的一逸散路徑上；一電池；以及一控制模組，電性連接所述阻流模組，用於：量測所述電池的一溫度；判斷所述溫度是否低於一閥值；當所述溫度低於所述閥值時，控制所述阻流模組的一狀態，以使所述第一熱能逸散至所述電池；以及當所述溫度不低於所述閥值時，控制所述阻流模組的所述狀態，以使所述第一熱能不逸散至所述電池。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device, comprising: a fan for dissipating first heat in the electronic device; a choke module disposed on a dissipation path of the first heat; a battery; and a control module disposed next to the battery and electrically connected to the choke module, and configured for: measuring a temperature of the battery; determining whether the temperature is lower than a threshold; when the temperature is lower than the threshold, controlling a state of the choke module so that the first heat dissipates to the battery; and when the temperature is not lower than the threshold, controlling the state of the choke module so that the first heat does not dissipate to the battery.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">110:風扇</p>  
        <p type="p">120:阻流模組</p>  
        <p type="p">130:電池</p>  
        <p type="p">140:控制模組</p>  
        <p type="p">150:電熱模組</p>  
        <p type="p">160:處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="443" publication-number="202611539"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611539.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611539</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134668</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具定位找尋功能之儲存裝置</chinese-title>  
        <english-title>STORAGE DEVICE WITH A POSITIONING AND SEARCHING FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G01S7/02</main-classification>  
        <further-classification edition="200601120250102B">G06F1/16</further-classification>  
        <further-classification edition="200901120250102B">H04W64/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>十銓科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEAM GROUP INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張錦峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIN FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪倢妤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIEH YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宇哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YU-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秀玫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具定位找尋功能之儲存裝置，其包含一下殼體、一上殼體以及一蓋體，該下殼體之一上方設置一第一容置槽，一儲存裝置設置於該第一容置槽之一內側，該上殼體設置於該下殼體之該上方，該上殼體之一上方設置一第二容置槽，該追蹤裝置設置於該第二容置槽之該內側，該蓋體樞接於該第二容置槽之一樞接件，且該追蹤裝置滑設於該蓋體之一滑槽，其中該追蹤裝置發出無線訊號，供使用者尋找儲存裝置之位置，避免儲存裝置遺失。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a storage device with a positioning and searching function, which includes a lower housing, an upper housing and a cover, a first receiving groove is provided above one of the lower housings, a storage device is disposed inside one of the first receiving slots, the upper housing is disposed above the lower housing, a second accommodating groove is provided above one of the upper casings, the tracking device is disposed inside the second accommodating slot, the cover body is pivotally connected to a pivot member of the second accommodating groove, and the tracking device is slidably installed in a slide groove of the cover body, wherein the tracking device emits a wireless signal for the user to find the location of the storage device to avoid losing the storage device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:具定位找尋功能之儲存裝置</p>  
        <p type="p">10:下殼體</p>  
        <p type="p">12:第一容置槽</p>  
        <p type="p">14:穿孔</p>  
        <p type="p">20:儲存裝置</p>  
        <p type="p">22:第一電路板</p>  
        <p type="p">24:儲存元件</p>  
        <p type="p">30:上殼體</p>  
        <p type="p">32:第二容置槽</p>  
        <p type="p">34:樞接件</p>  
        <p type="p">40:追蹤裝置</p>  
        <p type="p">50:蓋體</p>  
        <p type="p">52:滑槽</p>  
        <p type="p">P1:連接埠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="444" publication-number="202612512"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612512.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612512</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134669</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/87</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中山大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林吉聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JYI-TSONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，包括基板、半導體層、源極電極、汲極電極以及閘極電極。半導體層設置於基板上。源極電極設置於半導體層的第一側表面，其中源極電極直接接觸半導體層的第一側表面。汲極電極設置於半導體層相對於第一側表面的第二側表面，其中汲極電極直接接觸半導體層的第二側表面。閘極電極位於源極電極與汲極電極之間，其中閘極電極直接接觸半導體層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate, a semiconductor layer, a source electrode, a drain electrode and a gate electrode. The semiconductor layer is disposed on the substrate. The source electrode is disposed on a first side surface of the semiconductor layer, in which the source electrode is in direct contact with the first side surface of the semiconductor layer. The drain electrode is disposed on a second side surface of the semiconductor layer opposite to the first side surface of the semiconductor layer, in which the drain electrode is in direct contact with the second side surface of the semiconductor layer. The gate electrode is between the source electrode and the drain electrode, in which the gate electrode is in direct contact with the semiconductor layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">110:基板</p>  
        <p type="p">120:氧化層</p>  
        <p type="p">130:半導體層</p>  
        <p type="p">130A、130B、130C、140A、150A、160A:表面</p>  
        <p type="p">140:源極電極</p>  
        <p type="p">150:汲極電極</p>  
        <p type="p">160:閘極電極</p>  
        <p type="p">L&lt;sub&gt;SG&lt;/sub&gt;、L&lt;sub&gt;G&lt;/sub&gt;、L&lt;sub&gt;DG&lt;/sub&gt;、L&lt;sub&gt;S&lt;/sub&gt;:長度</p>  
        <p type="p">T&lt;sub&gt;S&lt;/sub&gt;:厚度</p>  
        <p type="p">X、Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="445" publication-number="202611845"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611845.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611845</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134673</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>實驗動物管理與照護資訊系統</chinese-title>  
        <english-title>LABORATORY ANIMAL MANAGEMENT AND CARE INFORMATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241128B">G06Q50/00</main-classification>  
        <further-classification edition="202301120241128B">G06Q10/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高雄榮民總醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAOHSIUNG VETERANS GENERAL HOSPITAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴妙娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, MIO-JYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種實驗動物管理與照護資訊系統，包含：一動物實驗計畫申請單元，供一申請人申請一動物實驗計畫；一審核單元，供數個審核人審查該動物實驗計畫是否通過；及一代養單申請單元，當該動物實驗計畫審查通過時，該申請人操作該代養單申請單元，以申請該動物實驗計畫之一代養單。當該代養單申請單元判定該代養單之數個代養單項目與該動物實驗計畫之數個申請項目不完全相同時，該代養單申請單元不允許該申請人繼續申請該代養單，並發送一第一通知訊息給一系統管理者聯網裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laboratory animal management and care information system is disclosed. The system comprises: an animal experiment plan application unit is used for an applicant to apply for an animal experiment plan; a review unit is used for several reviewers to review whether the animal experiment plan passes; a care form application unit, when the animal experiment plan is reviewed and approved, the applicant operating the care form application unit to apply for a care form for the animal experiment plan. When the care form application unit determines that a plurality of care form items in the care form are not exactly the same as a plurality of application items in the animal experiment plan, the care form application unit does not allow the applicant to continue to apply for the care form, and sends a first notification message to a system administrator networked device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:實驗動物管理與照護資訊</p>  
        <p type="p">系統</p>  
        <p type="p">20:審核單元</p>  
        <p type="p">21:動物實驗計畫申請單元</p>  
        <p type="p">22:計畫變更單元</p>  
        <p type="p">23:代養單申請單元</p>  
        <p type="p">24:轉讓單申請單元</p>  
        <p type="p">25:代養費計算單元</p>  
        <p type="p">26:進出數量表單元</p>  
        <p type="p">3:申請人聯網裝置</p>  
        <p type="p">4:審核人聯網裝置</p>  
        <p type="p">5:系統管理者聯網裝置</p>  
        <p type="p">6:實驗相關人員聯網裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="446" publication-number="202611538"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611538.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611538</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134674</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多感測自適應失效補償系統與方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G01S5/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人車輛研究測試中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬新東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耘菱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多感測自適應失效補償系統與方法，該系統包含複數感測器與一處理器，該處理器電性連接複數感測器，該處理器透過融合模組根據該複數感測器的感測器資訊產生一第一融合結果；該處理器透過自適應補償模組判斷該複數感測器的感測器資訊之間的一特徵關係；該處理器透過失效判斷模組判斷該複數感測器是否失效，以透過自適應補償模組根據一有效感測器的感測器資訊與該特徵關係產生對應於該失效感測器的一感測器補償資訊；以及透過融合模組根據該有效感測器的感測器資訊與該感測器補償資訊產生一第二融合結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:感測器</p>  
        <p type="p">100:感測器資訊</p>  
        <p type="p">11:第一角落雷達感測器</p>  
        <p type="p">12:第二角落雷達感測器</p>  
        <p type="p">13:前方雷達感測器</p>  
        <p type="p">14:光學雷達感測器</p>  
        <p type="p">15:前視相機</p>  
        <p type="p">20:儲存器</p>  
        <p type="p">30:處理器</p>  
        <p type="p">31:融合模組</p>  
        <p type="p">32:失效判斷模組</p>  
        <p type="p">33:自適應補償模組</p>  
        <p type="p">Z1:第一融合結果</p>  
        <p type="p">Z2:第二融合結果</p>  
        <p type="p">C:感測器補償資訊</p>  
        <p type="p">S1:失效訊息</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="447" publication-number="202610919"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610919.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610919</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>托盤束帶的脫離機構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B65G49/07</main-classification>  
        <further-classification edition="200601120241105B">H01L21/673</further-classification>  
        <further-classification edition="200601120241105B">H01L21/677</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鏵友益科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱威瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳守傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴昱凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種托盤束帶的脫離機構，二束帶捆綁在一透過多個托盤堆疊而成的托盤堆疊組，該托盤束帶的脫離機構適用於脫離所述束帶。該托盤束帶的脫離機構包含一底板、二壓制模組、二剝離模組，及二回收單元。該等壓制模組設置於該底板上，每一該壓制模組包括一壓制板，及二銜接件。該等剝離模組設置於該底板上，每一該剝離模組包括一驅動件，及二能在一待命位置及一剝離位置間移動的剝離件。在該待命位置時，該等剝離件遠離該托盤堆疊組；在該剝離位置時，該等剝離件在該等驅動的推動下完成該等束帶的脫離。該等回收單元用以回收脫離該等束帶。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:底板</p>  
        <p type="p">2:固定治具</p>  
        <p type="p">3:壓制模組</p>  
        <p type="p">31:壓制板</p>  
        <p type="p">311:板片</p>  
        <p type="p">312:銜接件</p>  
        <p type="p">4:剝離模組</p>  
        <p type="p">41:驅動件</p>  
        <p type="p">42:剝離件</p>  
        <p type="p">5:回收單元</p>  
        <p type="p">50:回收空間</p>  
        <p type="p">51:回收件</p>  
        <p type="p">6:定位判別單元</p>  
        <p type="p">60:虛擬感測線</p>  
        <p type="p">61:定位判別件</p>  
        <p type="p">8:束帶</p>  
        <p type="p">80:托盤</p>  
        <p type="p">81:托盤堆疊組</p>  
        <p type="p">A0:感測線</p>  
        <p type="p">A:偵測件</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="448" publication-number="202611943"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611943.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611943</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134676</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>心因性休克死亡風險預測方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM OF CARDIOGENIC SHOCK DEATH RISK PREDICTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241001B">G16H80/00</main-classification>  
        <further-classification edition="201801120241001B">G16H50/30</further-classification>  
        <further-classification edition="201801120241001B">G16H20/00</further-classification>  
        <further-classification edition="201801120241001B">G16H10/60</further-classification>  
        <further-classification edition="201901120241001B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高雄榮民總醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAOHSIUNG VETERANS GENERAL HOSPITAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃偉春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許健威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊國銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KUO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃小文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSIAO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳育伶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YU-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃梓渝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TSZ-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃湘婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, XIANG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳垚生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAO-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳金順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIN-SHUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種心因性休克死亡風險預測系統，包含一處理器用來進行以下操作：獲得多筆訓練資料，每一訓練資料包括一存活狀態及多筆醫療記錄，每一醫療記錄包括多個特徵參數；對於每一訓練資料，利用機器學習演算法，對該訓練資料的該等醫療紀錄進行缺失值填補；根據經缺失值填補後的該等訓練資料，利用機器學習演算法，建立一心因性休克死亡風險預測模型；及利用 模型可解釋性技術，獲得該等特徵參數每一者對該心因性休克死亡風險預測模型的一貢獻度，並根據該等貢獻度，自該等特徵參數中選取出多個主要風險因子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system of cardiogenic shock death risk prediction includes a processor that is configured to perform the following operations: obtaining multiple training data, each training data including a survival status and multiple medical records, each medical record including multiple characteristic parameters; for each training data, using a machine learning algorithm to fill in missing values in the medical records of the training data; using a machine learning algorithm to establish a cardiogenic shock death risk prediction model based on the training data after filling in missing values; using model interpretability technology to obtain a contribution of each of the characteristic parameters to the cardiogenic shock death risk prediction model, and selecting multiple major risk factors from the characteristic parameters based on the contributions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:心因性休克死亡風險預測系統</p>  
        <p type="p">11:儲存裝置</p>  
        <p type="p">12:處理器</p>  
        <p type="p">121:資料前處理模組</p>  
        <p type="p">122:模型訓練模組</p>  
        <p type="p">123:模型解釋模組</p>  
        <p type="p">124:預測模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="449" publication-number="202610537"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610537.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610537</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>植物的定位培育裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A01G9/12</main-classification>  
        <further-classification edition="200601120240929B">A01G23/02</further-classification>  
        <further-classification edition="201801120240929B">A01G9/029</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永記造漆工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張德盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種植物的定位培育裝置，適用於固定在一支撐物，並包含一適用於設置於該支撐物的培育基質塊，及一用以將該培育基質塊定位於該支撐物的定位單元。該定位單元包括一圍繞於該培育基質塊外側的包覆片，及多個穿設於該包覆片且固定於該支撐物而將該培育基質塊固定於該支撐物的螺絲釘。該包覆片具有一界定一供植物向外生長之通口的本體部，及多個自該本體部以遠離該通口之方向延伸且用以供該等螺絲釘穿設的延伸部。將植物種植於該培育基質塊後，只要將該包覆片覆蓋於該培育基質塊，並螺固該等螺絲釘，即可輕易完成定位且提供培育環境的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:培育基質塊</p>  
        <p type="p">212:延伸部</p>  
        <p type="p">2:定位單元</p>  
        <p type="p">219:透氣孔</p>  
        <p type="p">200:通口</p>  
        <p type="p">22:螺絲釘</p>  
        <p type="p">21:包覆片</p>  
        <p type="p">9:支撐物</p>  
        <p type="p">211:本體部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="450" publication-number="202611899"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611899.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611899</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134678</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膽固醇液晶裝置及其驅動方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">G09G3/36</main-classification>  
        <further-classification edition="200601120241127B">G02F1/133</further-classification>  
        <further-classification edition="200601120241127B">G02F1/137</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富動科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李騏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳正育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種膽固醇液晶裝置驅動方法，包含下列步驟：藉由液晶驅動單元分別產生列驅動訊號及行驅動訊號至膽固醇液晶顯示面板Y條的列電路結構以及X條行電路結構上；其中列驅動訊號包含選擇電壓訊號及未被選擇電壓訊號；藉由訊號處理單元計算各個像素的反射率是否超出誤差值；針對反射率超出誤差值的像素，液晶驅動單元輸出M次未被選擇電壓訊號至該像素所在位置的列電路結構，以均勻像素的反射率；以及針對反射率未超出誤差值的像素，液晶驅動單元輸出N次開路電壓(Hi-Z)訊號至像素所在位置的列電路結構，以維持像素的反射率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S14:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="451" publication-number="202611772"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611772.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611772</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134679</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>大語言模型交互系統及方法</chinese-title>  
        <english-title>LARGE LANGUAGE MODEL INTERACTION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241211B">G06F40/40</main-classification>  
        <further-classification edition="202001120241211B">G06F40/20</further-classification>  
        <further-classification edition="202301120241211B">G06N3/08</further-classification>  
        <further-classification edition="200601120241211B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>律果科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEGAL TECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啓桐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啟桐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖和信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種大語言模型交互系統及方法，該系統包含接收模組、傳送模組及輸出模組。系統接收第一大語言模型生成的初步結果，並將其發送至第二大語言模型進行檢查或修正，產生修正結果，最終由第一或第二模型輸出修正結果。該系統可透過標籤來指示結果類型，且應用於產生法律文件或專利技術文件，確保高準確度文本生成並可自動學習修正。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A large language model interaction system and method, which includes a receiving module, a transmission module, and an output module. The system receives the preliminary result generated by a first large language model and sends it to a second large language model for review or correction, resulting in a corrected output. The final corrected result is output by either the first or second model. This system can use tags to indicate the type of result and is applied to the generation of legal or patent technical documents, ensuring high-accuracy text generation with automatic learning from corrections.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:大語言模型交互系統</p>  
        <p type="p">2:第一大語言模型</p>  
        <p type="p">3:第二大語言模型</p>  
        <p type="p">11:接收模組</p>  
        <p type="p">12:傳送模組</p>  
        <p type="p">13:輸出模組</p>  
        <p type="p">14:權重調整模組</p>  
        <p type="p">15:回饋模組</p>  
        <p type="p">16:學習模組</p>  
        <p type="p">17:優化模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="452" publication-number="202610776"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610776.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610776</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134686</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨修整器及其製造方法</chinese-title>  
        <english-title>ABRASIVE CONDITIONER AND A METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241104B">B24B53/017</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國砂輪企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINIK COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周瑞麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, JUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周至中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHIH-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐群凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, CHUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TING-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃麗蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮達發</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種研磨修整器包括：基材，在其一側具有複數個凸台，所述複數個凸台由複數個凹陷相互間隔開；以及複數個研磨顆粒，為通過接合劑層以一對一的對應方式分別固定於所述複數個凸台上；其中所述接合劑層延伸至所述複數個凹陷內。另，本發明亦揭露研磨修整器的製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An abrasive conditioner includes: a substrate having a side provided with a plurality of protruding portions, the protruding portions being spaced apart from one another by a plurality of recesses; and a plurality of abrasive particles respectively attached to the protruding portions according to a one-to-one correspondence via a bonding layer, wherein the bonding layer extends into the recesses. Moreover, the present invention also discloses a method of fabricating an abrasive conditioner.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:研磨修整器</p>  
        <p type="p">102:基材</p>  
        <p type="p">102A:第一側</p>  
        <p type="p">102B:第二側</p>  
        <p type="p">104:研磨顆粒</p>  
        <p type="p">106:接合劑層</p>  
        <p type="p">108:凸台</p>  
        <p type="p">110:凹陷</p>  
        <p type="p">112:底面</p>  
        <p type="p">114:凸台側壁</p>  
        <p type="p">H:凸台高度</p>  
        <p type="p">W:底面寬度</p>  
        <p type="p">P:凸台間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="453" publication-number="202611493"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611493.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611493</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134687</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於聯邦式學習模型的加工機健康度估測裝置及方法</chinese-title>  
        <english-title>MACHINE TOOL HEALTH ESTIMATION DEVICE BASED ON FEDERATED LEARNING MODEL AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241007B">G01M13/00</main-classification>  
        <further-classification edition="202301120241007B">G06N3/098</further-classification>  
        <further-classification edition="200601120241007B">B23Q17/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立虎尾科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秉均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PING-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林厚宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坪橙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PING-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於聯邦式學習模型的加工機健康度估測裝置，其包括複數個訊號感測模組、訊號擷取模組及處理模組。該些訊號感測模組分別與複數個加工機連接，並偵測對應的該些加工機的振動訊號。訊號擷取模組擷取該些加工機的振動訊號。處理模組分析各個加工機的振動訊號以獲得振動特徵，再根據振動特徵執行局域自組織映射圖計算程序以獲得各個加工機的局域自組織映射圖模型。處理模組根據該些加工機的該些局域自組織映射圖模型執行分散式學習程序以獲得全域自組織映射圖模型，並根據全域自組織映射圖模型在任一個加工機進行加工作業時執行健康度估測程序，以獲得加工機的刀具健康度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A machine tool health estimation device based on a federated learning model is provided, which includes a plurality of signal sensing modules, a signal acquisition module, and a processing module. The signal sensing modules are respectively connected to a plurality of machine tools and detect the corresponding vibration signals of these machine tools. The signal acquisition module captures the vibration signals. The processing module analyzes the vibration signals of each machine tool to obtain vibration characteristics and then performs a local self-organizing map (SOM) calculation process based on these vibration characteristics so as to generate a local SOM model of each machine tool. The processing module executes a distributed learning process based on these local SOM models to generate a global SOM model. The processing module executes a health estimation process for any one of the machine tools which implements a machining operation in order to obtain the cutter health of the machine tool.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:加工機健康度估測裝置</p>  
        <p type="p">11:訊號感測模組</p>  
        <p type="p">12:訊號擷取模組</p>  
        <p type="p">13:處理模組</p>  
        <p type="p">Vs1:振動訊號</p>  
        <p type="p">2:加工機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="454" publication-number="202612257"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612257.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612257</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134688</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽能裝置</chinese-title>  
        <english-title>SOLAR ENERGY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241128B">H02S40/22</main-classification>  
        <further-classification edition="201401120241128B">H02S40/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>營嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINNER PLUS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郅燊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊傳鏈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種太陽能裝置，包括：基座單元；至少一箱體單元，設置於該基座單元上；集熱單元，設於該基座單元上；以及至少一反射模組，分別設於所述箱體單元內的該基座單元上，用以反射太陽光至該集熱單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a solar energy device, the device includes: a base unit; at least one housing unit provided on the base unit; a heat collecting unit provided above the base unit; and at least one reflection module provided on the base unit within the housing unit respectively for reflecting sunlight to the heat collecting unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:底座</p>  
        <p type="p">12:調向裝置</p>  
        <p type="p">13:支撐管</p>  
        <p type="p">14:立柱</p>  
        <p type="p">2:箱體單元</p>  
        <p type="p">21:間隔空間</p>  
        <p type="p">31:集熱器</p>  
        <p type="p">32:隔熱入光管</p>  
        <p type="p">4:散射單元</p>  
        <p type="p">5:反射模組</p>  
        <p type="p">61:平面馬達組</p>  
        <p type="p">62:齒輪組</p>  
        <p type="p">71:第一馬達組</p>  
        <p type="p">72:第二馬達組</p>  
        <p type="p">74:第二鍊條及繩索單元</p>  
        <p type="p">75:除汙裝置</p>  
        <p type="p">76:鍊條鬆緊調節器</p>  
        <p type="p">L:太陽光</p>  
        <p type="p">R:焦點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="455" publication-number="202612256"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612256.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612256</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134689</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽能裝置</chinese-title>  
        <english-title>SOLAR ENERGY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241128B">H02S20/30</main-classification>  
        <further-classification edition="201401120241128B">H02S40/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>營嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINNER PLUS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郅燊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊傳鏈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種反射架，包括：反射片，具有相對之第一面及第二面；轉向件，設於該反射片之該第二面；以及支架，連接該轉向件。本揭露更提供一種包含複數反射架之太陽能裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a reflection frame, the reflection frame comprises: a reflection sheet having a first surface and a second surface opposite to the first surface; a universal element provided on the second surface of the reflection sheet; and a bracket connected to the universal element. The present disclosure further provides a solar energy device included a plurality of the reflection frames.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:反射架</p>  
        <p type="p">1:反射片</p>  
        <p type="p">11:第一面</p>  
        <p type="p">3:支架</p>  
        <p type="p">31:座體</p>  
        <p type="p">32:伸縮桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="456" publication-number="202611815"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611815.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611815</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於區塊鏈與共用帳本之網路共享系統、方法及電腦可讀媒介</chinese-title>  
        <english-title>NETWORK SHARING SYSTEM, METHOD AND COMPUTER READABLE MEDIUM BASED ON BLOCKCHAIN AND SHARED LEDGER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241007B">G06Q20/38</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佳輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種基於區塊鏈與共用帳本之網路共享系統、方法及電腦可讀媒介，係由第一使用者之網路分享裝置分享網路予第二使用者之網路使用裝置，以由第二使用者透過付費方式使網路使用裝置使用第一使用者之網路分享裝置之網路，俾使第一使用者之網路分享裝置與第二使用者之網路使用裝置共享網路。再者，由第一區塊鏈模組與第二區塊鏈模組將第一使用者之網路分享裝置與第二使用者之網路使用裝置所共享之網路之計費資料統一保存至同一共用帳本，俾藉由共用帳本使第一使用者之網路分享裝置與第二使用者之網路使用裝置所共享之網路之計費資料具有不可竄改之特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a network sharing system, method and computer readable medium based on blockchain and shared ledger. A first user's network sharing device shares network with a second user's network using device, and a second user allows the network using device to use the network of the first user's network sharing device through a payment method, so as to enable the first user's network sharing device to share the network with the second user's network using device. Furthermore, a first blockchain module and a second blockchain module uniformly save billing data of the network shared by the first user's network sharing device and the second user's network using device to same shared ledger, so as to make the billing data of the network shared by the first user's network sharing device and the second user's network using device have property of being immutable through the shared ledger.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基於區塊鏈與共用帳本之網路共享系統</p>  
        <p type="p">10:第一使用者</p>  
        <p type="p">11:網路分享裝置</p>  
        <p type="p">20:第二使用者</p>  
        <p type="p">21:網路使用裝置</p>  
        <p type="p">30:第一區塊鏈模組</p>  
        <p type="p">31:第一私鑰</p>  
        <p type="p">40:第二區塊鏈模組</p>  
        <p type="p">41:第二私鑰</p>  
        <p type="p">50:網路分析與阻斷模組</p>  
        <p type="p">60:計費模組</p>  
        <p type="p">70:網路模組</p>  
        <p type="p">A:網路</p>  
        <p type="p">B:流量幣</p>  
        <p type="p">C:共用帳本</p>  
        <p type="p">D:計費資料</p>  
        <p type="p">E:智能合約</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="457" publication-number="202611471"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611471.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611471</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134697</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水冷頭結構</chinese-title>  
        <english-title>WATER BLOCK STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">F28F13/06</main-classification>  
        <further-classification edition="200601120241127B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳興奇宏科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIA VITAL COMPONENTS (CHINA) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉雪輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XUE-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳九明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧敏健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, MIN-JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫大龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種水冷頭結構，包括：上蓋、中隔板及散熱器；上蓋具第一開口及第二開口，工作流體可從其中一者流入；中隔板具有分別連通第一及第二開口的第一及第二通道，中隔板下側與散熱器結合，並共同界定一連通第一及第二通道之熱交換腔室，熱交換腔室內凸設有橫向間隔排列的片體，該各片體之間並形成有複數橫向流道，該等橫向流道與上方第一通道交錯對應，形成工作流體通過的第一交流區，並於端處形成工作流體通過的第二交流區，第二交流區連通片體外緣的一周圍流道，周圍流道與上方第二通道相對應；故工作流體從第一或第二通道其一者進入熱交換腔室後，因受壓持續推擠將工作流體通過該等橫向流道後上升進入第一或第二通道之另一者，最後匯集由上蓋有別於工作流體流入的第一或第二開口之另一者流出，以完成一次單向之流體流路，藉由本發明的流路設計使工作流體可完整地通過散熱器之每一部位，以增加接觸面積及接觸時間可充分完整地進行熱交換，進而提升整體散熱效率者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:水冷頭結構</p>  
        <p type="p">10:上蓋</p>  
        <p type="p">12:第一開口</p>  
        <p type="p">14:第二開口</p>  
        <p type="p">20:中隔板</p>  
        <p type="p">20a:限位槽</p>  
        <p type="p">21:第一通道</p>  
        <p type="p">22:第二通道</p>  
        <p type="p">30:散熱器</p>  
        <p type="p">32:吸熱側</p>  
        <p type="p">34:散熱側</p>  
        <p type="p">36:片體</p>  
        <p type="p">361:橫向流道</p>  
        <p type="p">362:周圍流道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="458" publication-number="202612187"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612187.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612187</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134698</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241118B">H01R13/46</main-classification>  
        <further-classification edition="200601120241118B">H01R13/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商莫仕有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLEX, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊喆元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHE-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫偉哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, WEI-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接裝置，包含一連接器組件、一液冷板及一框架。所述連接器組件包括一金屬殼體。所述金屬殼體具有兩個側壁。各所述側壁具有一突出部及一側固持部。所述液冷板其內部供冷卻液流通。所述框架包括固定於所述液冷板的兩側的兩個側框。各所述側框具有一側鎖扣件及一第一限位件。所述側鎖扣件分別可解除地扣接於所述側固持部。各所述第一限位件具有一導槽。所述導槽能夠分別供所述突出部滑入。所述第一限位件讓所述突出部分別滑入所述導槽，使所述側鎖扣件分別扣接於所述側固持部，而將所述液冷板與所述連接器組件相結合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:連接器組件</p>  
        <p type="p">300:液冷板</p>  
        <p type="p">400:框架</p>  
        <p type="p">500a、500b、500c:螺絲</p>  
        <p type="p">10:連接器</p>  
        <p type="p">10a:對接插槽</p>  
        <p type="p">1:金屬殼體</p>  
        <p type="p">11:側壁</p>  
        <p type="p">111:側壁主體</p>  
        <p type="p">112:突出部</p>  
        <p type="p">113:側固持部</p>  
        <p type="p">13:插接通道</p>  
        <p type="p">2:側框</p>  
        <p type="p">21:側框主體</p>  
        <p type="p">22:側鎖扣件</p>  
        <p type="p">221a:第一扣孔</p>  
        <p type="p">23:第一限位件</p>  
        <p type="p">231:導槽</p>  
        <p type="p">3:前框</p>  
        <p type="p">4:後框</p>  
        <p type="p">42:後定位孔</p>  
        <p type="p">5:容置空間</p>  
        <p type="p">X:前後方向</p>  
        <p type="p">Y:左右方向</p>  
        <p type="p">Z:上下方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="459" publication-number="202612357"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612357.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612357</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134705</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及減震件</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND DAMPER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">H04R1/28</main-classification>  
        <further-classification edition="200601120241230B">H04R1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>微星科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRO-STAR INT 'L CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商微盟電子（昆山）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MSI ELECTRONIC (KUN SHAN) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡旺廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, WANG TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包含外殼、揚聲器及減震件。外殼具有二組裝凸塊，並圍繞出一容置空間。二組裝凸塊相對，並位於容置空間。揚聲器位於容置空間，並包含震動本體部及組裝部。組裝部連接於震動本體部。減震件包含二減震部及連接部。二減震部分別連接於連接部之相對兩端，並各具有內弧面。內弧面圍繞出減震空間。連接部裝設於組裝部。二減震部分別組裝於二組裝凸塊，且二組裝凸塊分別至少部分位於二減震空間，以令震動本體部與外殼相分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a casing, a speaker and a damper. The casing has two assembling protrusions, and surrounds an accommodating space. The two assembling protrusions are opposite to each other, and are located in the accommodating space. The speaker is located in the accommodating space, and includes a vibrating portion and an assembling portion. The assembling portion is connected to the vibrating portion. The damper includes two damping portions and a connecting portion. The two damping portions are connected to opposite ends of the connecting portion, respectively, and have an inner arc surface, respectively. The inner arc surface surrounds and form a damping space. The connection portion is mounted on the assembling portion. The two damping portions are mounted on the two assembling protrusions, respectively, and the two assembling protrusions are at least partially located in the two damping spaces, respectively, so that the vibrating portion is spaced apart from the casing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">11:外殼</p>  
        <p type="p">111:第一殼體</p>  
        <p type="p">1111:組裝凸塊</p>  
        <p type="p">1112:抵靠凸部</p>  
        <p type="p">11121:抵靠凸塊</p>  
        <p type="p">112:第二殼體</p>  
        <p type="p">1121:組裝凸塊</p>  
        <p type="p">1122:抵靠凸部</p>  
        <p type="p">11221:抵靠凸塊</p>  
        <p type="p">12:揚聲器</p>  
        <p type="p">121:震動本體部</p>  
        <p type="p">122:組裝部</p>  
        <p type="p">13:減震件</p>  
        <p type="p">131:減震部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="460" publication-number="202610561"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610561.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610561</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134709</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>足型數據取得方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A43D1/02</main-classification>  
        <further-classification edition="200601120240929B">A43D1/08</further-classification>  
        <further-classification edition="200601120240929B">A61B5/103</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達鞋技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA SHOE TECH LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖聰誼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, TSUNG-E</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種足型數據取得方法，包含以下步驟：(A)接收一足部正面圖片及一足部後跟圖片。(B)取得一定位物件的複數定位點於該足部正面圖片與該足部後跟圖片中的位置資訊。(C)辨識一正面輪廓線與一後跟輪廓線。(D)辨識該足部正面圖片而取得一前端點，辨識該足部後跟圖片而取得一腳跟點。(E)藉由重合該等定位點而疊合該後跟輪廓線與該正面輪廓線。(F)根據該前端點與一疊合腳跟點取得一第一直線。(G)根據該第一直線取得一外側點及一內側點。(H)根據該外側點、該內側點與該疊合腳跟點，取得一足型數據。藉此，可透過兩張圖片即求出相關於足部形狀的數據。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">61~68:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="461" publication-number="202611477"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611477.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611477</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134721</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面量測系統及其量測方法</chinese-title>  
        <english-title>SURFACE MEASUREMENT SYSTEM AND MEASUREMENT METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">G01B11/00</main-classification>  
        <further-classification edition="200601120241128B">G01B11/30</further-classification>  
        <further-classification edition="200601120241128B">G02F1/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華精測科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA PRECISION TEST TECH. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳浩偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HAO WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳伯群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PO CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊倬昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHO YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種表面量測系統，用於量測待側物的表面參數，包含：吸附載台，用於乘載待測物；電控平台，吸附載台設置於電控平台上，電控平台用於控制吸附載台移動；平台驅動裝置，與電控平台連接，用於向電控平台輸出包含吸附載台位移量的移動訊號；共焦雷射感測器，用於向待測物照射共焦雷射；共焦雷射感測控制器，與驅動裝置以及共焦雷射感測器連接，用於控制共焦雷射的輸出強度。其中共焦雷射感測器透過共焦雷射量測待測物表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A surface measurement system for measuring surface parameters of an object to be measured, including: an adsorption carrier for carrying the object to be measured; an electronic control platform, wherein the adsorption carrier is arranged on the electronic control platform, and wherein the electronic control platform is configured to control the movement of the adsorption carrier; an platform driving device connected to the electronic control platform and configured to output a movement signal including a displacement of the adsorption stage to the electronic control platform; a laser confocal sensor configured to irradiate the confocal laser to the object to be measured; and a laser confocal sensing controller connected to the driving device and the laser confocal sensor, configured to control an output intensity of the confocal sensing laser; wherein the laser confocal sensor measures the surface of the object under test through confocal sensing laser.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:表面量測系統</p>  
        <p type="p">10:吸附載台</p>  
        <p type="p">20:電控平台</p>  
        <p type="p">30:平台驅動裝置</p>  
        <p type="p">40:共焦雷射感測器</p>  
        <p type="p">50:共焦雷射感測控制器</p>  
        <p type="p">d:待測物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="462" publication-number="202611387"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611387.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611387</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134724</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可相互組合滑動之框架模組結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">E06B3/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林春和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林春和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可相互組合滑動之框架模組結構，其至少包含有一第一框架及一第二框架；第一框架係一矩形架體而包含有相對應的一第一側邊、一第二側邊，第二框架係一矩形架體而包含有相對應的一第三側邊、一第四側邊；第一及二側邊一端分別設有一第一滑部及一第一開口，第一及二側邊二端之間分別設有一第一狹長開口而連通第一開口；第三及四側邊一端分別設有一第二滑部及一第二開口，第三及四側邊二端之間分別設有一第二狹長開口而連通第二開口；第一滑部嵌接入第二開口，第二滑部嵌接入第一開口，使得第一滑部在第二狹長開口往復移動，第二滑部在第一狹長開口往復移動，用以達成可相互組合滑動之框架模組結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">22:第一側邊</p>  
        <p type="p">24:第二側邊</p>  
        <p type="p">42:第三側邊</p>  
        <p type="p">44:第四側邊</p>  
        <p type="p">221:第一滑部</p>  
        <p type="p">222:第一開口</p>  
        <p type="p">223:第一狹長開口</p>  
        <p type="p">421:第二滑部</p>  
        <p type="p">422:第二開口</p>  
        <p type="p">423:第二狹長開口</p>  
        <p type="p">2211:第一桿體</p>  
        <p type="p">2212:第一滾輪</p>  
        <p type="p">4211:第二桿體</p>  
        <p type="p">4212:第二滾輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="463" publication-number="202610901"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610901.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610901</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134726</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>絲餅包膜方法、絲餅包膜裝置、以及薄膜封裝絲餅</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">B65B51/10</main-classification>  
        <further-classification edition="200601120241230B">B65G63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻寶興業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張守綜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁玉芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種絲餅包膜方法、包膜裝置、以及薄膜封裝絲餅，包括：將絲餅壓在一包裝薄膜上，通過一壓模使該包裝薄膜的一部分擠入該絲餅的一軸管的第一端內部；接著，通過一導膜單元將該包裝薄膜包覆整個絲餅；然後，通過一熱封軸將該包裝薄膜的另一部分擠入該軸管的第二端內部；最後，通過該熱封軸將擠入該軸管中的包裝薄膜予以熱封接合，從而構成包裝完整美觀的薄膜封裝絲餅。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:絲餅</p>  
        <p type="p">11:軸管</p>  
        <p type="p">111:第一端</p>  
        <p type="p">112:第二端</p>  
        <p type="p">12:絲線</p>  
        <p type="p">13:第一面</p>  
        <p type="p">14:第二面</p>  
        <p type="p">15:圓周面</p>  
        <p type="p">20:包裝薄膜</p>  
        <p type="p">30:包裝薄膜卷</p>  
        <p type="p">32:展膜單元</p>  
        <p type="p">321:滑軌</p>  
        <p type="p">322:刀架</p>  
        <p type="p">323:拉膜架</p>  
        <p type="p">324:切膜刀</p>  
        <p type="p">33:壓模</p>  
        <p type="p">331:模板</p>  
        <p type="p">332:模芯</p>  
        <p type="p">34:絲餅驅動單元</p>  
        <p type="p">341:機械手臂</p>  
        <p type="p">342:氣脹軸</p>  
        <p type="p">35:導膜單元</p>  
        <p type="p">351:框架</p>  
        <p type="p">352:驅動缸</p>  
        <p type="p">353:噴氣嘴</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="464" publication-number="202610538"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610538.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610538</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134727</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>植物性纖維貓砂及其製造方法與貓砂產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">A01K1/01</main-classification>  
        <further-classification edition="200601120241105B">C08L3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐秀玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐秀玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉箐茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種植物性纖維貓砂，以植物性纖維貓砂為100wt%計，植物性纖維貓砂包括1wt%~94wt%的稻殼、4.9wt%~54.9wt%的樹薯澱粉、1wt%~94wt%的玉米芯粉以及0.1wt%~10wt%的洋菜粉。植物性纖維貓砂可快速與貓排泄物凝結成團以有效降低貓排泄物的臭味。本揭露還提供植物性纖維貓砂的製造方法，以及貓砂產品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:步驟</p>  
        <p type="p">S2:步驟</p>  
        <p type="p">S3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="465" publication-number="202612405"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612405.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612405</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134728</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">H05K1/11</main-classification>  
        <further-classification edition="200601120240926B">H05K3/46</further-classification>  
        <further-classification edition="200601120240926B">H05K3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡欣樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HSIN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括依序層疊的基板、絕緣層以及導電層。絕緣層包括第一部分、第二部分以及第三部分。第二部分位於第一部分遠離導電層的一側，第三部分位於第二部分遠離導電層的一側。第一部分、第二部分以及第三部分連續分布。導電層遠離基板的頂面高於絕緣層的頂面。第一部分的頂面高於第二部分的頂面，且第三部分的頂面高於第二部分的頂面。一種電子裝置的製造方法亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device including a substrate, an insulating layer and a conductive layer, which are sequentially stacked, is provided. The insulating layer includes a first portion, a second portion and a third portion. The second portion is located on a side of the first portion away from the conductive layer, and the third portion is located on a side of the second portion away from the conductive layer. The first portion, the second portion and the third portion are sited in a connection manner. A top surface of the conductive layer away from the substrate is higher than a top surface of the insulating layer. Top surfaces of the first portion and the third portion are higher than a top surface of the second portion. A manufacturing method of an electronic device is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:光罩</p>  
        <p type="p">10C、20C、20D:圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="466" publication-number="202610947"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610947.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610947</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134731</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>渠道式水體淡化系統</chinese-title>  
        <english-title>CHANNEL-TYPE WATER BODY DESALINATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120240918B">C02F1/14</main-classification>  
        <further-classification edition="202301120240918B">C02F1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣紳國際科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANGSHEN INTERNATIONAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡益在</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YI-ZAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李坤韋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種渠道式水體淡化系統，其包含：一渠道，其係呈長條狀配置；至少一霧化裝置，其係對應配置於該渠道一端；一遮蔽元件，其係對應遮罩於該渠道頂端，該遮蔽元件於至少一側端向下傾斜設置有一導流部件，且所述導流部件底端設有一對應於該導流部件之一導流方向之導水槽；藉此，本發明係可將渠道對應架設或部分的埋設於地面，並可透過所述霧化裝置以將水體，如：海水或滷水，以對應輸送至渠道內，而遮蔽元件係可防止霧化之水體逸散，同時，可透過外界之陽光或熱氣，使可易於將霧化之水體蒸發，而水體經蒸發後即可形成淡水，且其接觸於遮蔽元件之導流部件時，將可對應凝結為水滴，並可受導流部件導引而由導水槽流出，藉以令本發明可大面積且低成本的將海水透過太陽之熱量霧化蒸餾方式以凝結並聚集淡水，使可進行水體之淡化，進而可利於水資源之再生利用，以可作為飲用、農業或工業供水，以可加強供水韌性，並可有助於降低乾旱之發生者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a channel-type water body desalination system, which includes: a channel configured in an elongated shape; at least one atomizing unit corresponding to one end of the channel; a shielding component corresponding to cover the top of the channel, where the shielding component has a guiding part inclined downward on at least one side, and the bottom end of the guiding part is equipped with a water guide trough corresponding to the guiding direction of the guiding part. With this system, the channel can be installed on or partially embedded in the ground. The atomizing unit can be used to deliver water, such as seawater or brine, into the channel. The shielding component prevents the atomized water from escaping, while sunlight or heat from the environment facilitates the evaporation of the atomized water. After evaporation, the water turns into fresh water, which, upon contacting the guiding part of the shielding component, condenses into water droplets. These droplets are guided by the guiding part and flow out through the water guide trough. The invention enables large-scale and cost-effective desalination of seawater through solar-powered atomization and distillation, allowing for the condensation and collection of fresh water. It facilitates water desalination, contributing to the recycling of water resources for use in drinking, agriculture, or industrial applications. This improves water supply resilience and helps mitigate the occurrence of droughts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:渠道</p>  
        <p type="p">11:承接片</p>  
        <p type="p">12:支架</p>  
        <p type="p">3:遮蔽元件</p>  
        <p type="p">31:導流部件</p>  
        <p type="p">32:導水槽</p>  
        <p type="p">33:側板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="467" publication-number="202612276"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612276.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612276</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134734</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>類比電路</chinese-title>  
        <english-title>ANALOG CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H03K19/173</main-classification>  
        <further-classification edition="200601120241202B">H03K19/0185</further-classification>  
        <further-classification edition="200601120241202B">H03K19/094</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昀澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUN-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘昜甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, YANG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏嘉威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, CHIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">類比電路包含邏輯輸出電路以及標準元件。邏輯輸出電路輸出第一電源供應電壓或低位準信號以作為輸出信號。標準元件包含至少二第一類型電晶體以及至少二第二類型電晶體。至少二第一類型電晶體彼此串聯。至少二第一類型電晶體接收第二電源供應電壓，並根據輸出信號以輸出第二電源供應電壓。第一電源供應電壓之第一電壓值小於第二電源供應電壓之第二電壓值。至少二第二類型電晶體彼此並聯，與至少二第一類型電晶體耦接於輸出端，並根據輸出信號以輸出低位準信號。至少二第一類型電晶體之第一類型不同於至少二第二類型電晶體之第二類型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An analog circuit includes a logic output circuit and a standard cell. The logic output circuit outputs a first power supply voltage or a low-level signal to be an output signal. The standard cell includes at least two first-type transistors and at least two second-type transistors. The at least two first-type transistors are connected to each other in series. The at least two first-type transistors receive a second power supply voltage, and output the second power supply voltage according to the output signal. A first voltage value of the first power supply voltage is less than a second voltage value of the second power supply voltage. The at least two second-type transistors are connected to each other in parallel, coupled to the at least two first-type transistors at an output terminal, and output the low-level signal according to the output signal. First types of the at least two first-type transistors are different from second types of the at least two second-type transistors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:類比電路</p>  
        <p type="p">110:邏輯輸出電路</p>  
        <p type="p">120:標準元件</p>  
        <p type="p">IN1,IN2:輸入端</p>  
        <p type="p">OUT1,OUT2:輸出端</p>  
        <p type="p">VDD1:第一電源供應電壓</p>  
        <p type="p">VDD2:第二電源供應電壓</p>  
        <p type="p">Vdiff:壓差</p>  
        <p type="p">Vin:控制電壓</p>  
        <p type="p">M11,M12,M21,M22,M23,M24:電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="468" publication-number="202611900"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611900.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611900</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膽固醇液晶裝置及其局部畫面更新驅動方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">G09G3/36</main-classification>  
        <further-classification edition="200601120241128B">G02F1/133</further-classification>  
        <further-classification edition="200601120241128B">G02F1/137</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富動科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李騏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳正育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種膽固醇液晶裝置及其局部畫面更新驅動方法，只需針對色差超出誤差值之像素所在位置的列電路結構，局部更新該像素的色差，並針對色差未超出誤差值之像素所在位置的列電路結構，維持該像素的色差。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S12:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="469" publication-number="202612431"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612431.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612431</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRON DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240923B">H05K7/20</main-classification>  
        <further-classification edition="200601120240923B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉尚衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHANG-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置包括殼體及散熱模組。殼體包含內表面。內表面具有中心部及角部，中心部上方的區域為中心區域。散熱模組包含風扇及第一導流結構。風扇位於角部，並具有朝向中心區域的出風口。第一導流結構連接內表面並朝遠離出風口的方向延伸。第一導流結構包含起始部及前端部，起始部及前端部鄰近出風口。由前端部朝向出風口並沿著起始部的延伸方向平行延伸一虛擬延伸線。虛擬延伸線將出風口分為第一風口部以及第二風口部，且第一風口部與第二風口部分別具有不同的第一寬度以及第二寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electron device includes a housing and a dissipation module. The housing includes an inner surface. The inner surface has a center portion and a corner portion. An area above the center portion is a center area. The dissipation module includes a fan and a first fin structure. The fan is deposed at the corner portion and has an outlet toward the center area. The first fin structure is connected to the inner surface and extended away from the outlet. The first fin structure includes an initiation portion and a front end portion. The initiation portion and the front end portion near the outlet. A dummy extended line is parallel extended along an extended direction of the initiation portion from the front end portion toward the outlet. The dummy extended line divided the outlet into a first outlet portion and a second outlet portion. The first outlet portion and the second outlet portion have a first width and a second width, respectively. The first width is different from the second width.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:散熱模組</p>  
        <p type="p">110:殼體</p>  
        <p type="p">111:內表面</p>  
        <p type="p">1110:中心部</p>  
        <p type="p">1112:角部</p>  
        <p type="p">120:風扇</p>  
        <p type="p">121:出風口</p>  
        <p type="p">1211:第一風口部</p>  
        <p type="p">1212:第二風口部</p>  
        <p type="p">123:虛擬延伸線</p>  
        <p type="p">125:中軸</p>  
        <p type="p">130:第一導流結構</p>  
        <p type="p">1301:起始部</p>  
        <p type="p">1303:分岔部</p>  
        <p type="p">1305:前端部</p>  
        <p type="p">1307,1309:末端部</p>  
        <p type="p">131,133,135,137:導流結構</p>  
        <p type="p">1311,1313,1315,1317:轉折角</p>  
        <p type="p">d1:第一寬度</p>  
        <p type="p">d2:第二寬度</p>  
        <p type="p">a1,a3,a5:至出風口的最短距離</p>  
        <p type="p">x1,x3,x5:在第一軸向上至第一導流結構的最短距離</p>  
        <p type="p">y1,y3,y5:在第二軸向上至第一導流結構的最短距離</p>  
        <p type="p">θ&lt;sub&gt;1&lt;/sub&gt;,θ&lt;sub&gt;2&lt;/sub&gt;,θ&lt;sub&gt;3&lt;/sub&gt;,θ&lt;sub&gt;4&lt;/sub&gt;:角度</p>  
        <p type="p">x:第一軸向</p>  
        <p type="p">y:第二軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="470" publication-number="202611508"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611508.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611508</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134738</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非破壞性金屬檢測方法</chinese-title>  
        <english-title>NONDESTRUCTIVE TESTING METHODS FOR METALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">G01N27/76</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元智大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN ZE UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李歐文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, OU-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳孟群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MENG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡達德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENRY, TSAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秀玫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡依庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種非破壞性金屬檢測方法，其步驟包含：提供第一資訊以及第二資訊至資訊比對模組；提供待測金屬，透過磁感測器陣列模組對待測金屬感測後產生磁感測資訊，並藉由資訊控制模組傳輸至資訊預處理模組；資訊預處理模組消除該磁感測資訊之雜訊並傳輸至資訊比對模組；資訊比對模組比對該磁感測資訊、第一資訊以及第二資訊，並產生比對結果，其係用以判斷待測金屬是否包含缺陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a non-destructive metal detection method, the steps of which include: providing first information and second information to an information matching module; providing a metal to be tested, generating magnetic sensing information after sensing the metal to be tested by a magnetic sensor array module, and transmitting the magnetic sensing information to an information preprocessing module through an information control module; the information preprocessing module eliminating noise of the magnetic sensing information and transmitting it to an information matching module; the information matching module comparing the magnetic sensing information, the first information, and the second information, and generating a matching result, which is used to determine whether the metal to be tested contains defects. The information comparison module compares the magnetic sensing information, the first information, and the second information, and generates a comparison result, which is used to determine whether the metal to be tested contains a defect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟S10-步驟S60</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="471" publication-number="202610570"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610570.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610570</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多功能杯子</chinese-title>  
        <english-title>MULTIFUNCTIONAL CUP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A47G19/22</main-classification>  
        <further-classification edition="200601120240929B">A47G19/30</further-classification>  
        <further-classification edition="200601120240929B">A47G23/16</further-classification>  
        <further-classification edition="200601120240929B">A63B23/00</further-classification>  
        <further-classification edition="200601120240929B">A63B26/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺中科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAICHUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張國賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUO-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯竹芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, JHU-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴韻竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YUN-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俐均</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多功能杯子，其包括：一杯具及一握把。杯具的一側具有孔徑相異的一對應孔及一限位孔，握把具有一環狀本體及一設置於環狀本體的一側的連接件，環狀本體為彈性材料所製成，而連接件可穿設於對應孔，並且在對應孔及限位孔之間移動。其中，當連接件移動至限位孔內時，限位孔的內緣卡合於連接件，而可止擋握把脫離杯具，以及當連接件回復至對應孔內時，釋放握把與杯具相互分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multifunctional cup, which comprises a cup utensil and a handle. One side of the cup has a corresponding hole and a limit hole with different aperture, and the handle has a ring body, and a connecting piece arranged on one side of the ring body, the ring body is made of elastic material, and the connecting piece can be arranged on the corresponding hole and move between the corresponding hole and the limit hole. When the connector is moved into the limit hole, the inner edge of the limit hole snaps to the connector to prevent the grip from being removed from the cup, and when the connector is returned to the corresponding hole, the release grip and the cup are separated from each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多功能杯子</p>  
        <p type="p">10:杯具</p>  
        <p type="p">11:本體</p>  
        <p type="p">12:組裝部</p>  
        <p type="p">121:對應孔</p>  
        <p type="p">122:限位孔</p>  
        <p type="p">20:握把</p>  
        <p type="p">21:環狀本體</p>  
        <p type="p">211:穿孔</p>  
        <p type="p">2121:按壓部</p>  
        <p type="p">23:按摩區</p>  
        <p type="p">231:凸部</p>  
        <p type="p">A1:第一方向</p>  
        <p type="p">A2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="472" publication-number="202610869"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610869.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610869</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車輛轉向自動防撞系統及方法</chinese-title>  
        <english-title>VEHICLE STEERING AUTOMATIC COLLISION AVOIDANCE SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120240929B">B60W30/09</main-classification>  
        <further-classification edition="200601120240929B">G08G1/16</further-classification>  
        <further-classification edition="200601120240929B">B60C23/00</further-classification>  
        <further-classification edition="202201120240929B">G06V10/82</further-classification>  
        <further-classification edition="202201120240929B">G06V20/58</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐崇平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHUNG-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐崇平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHUNG-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳紹良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種車輛轉向自動防撞系統，包括：一行車控制電腦連結一自動緊急煞車輔助系統和一汽車轉向自動防撞系統，該自動緊急煞車輔助系統可以提供一自動緊急煞車輔助資訊，該汽車轉向自動防撞系統啟用後可以提供一轉向防撞決策資訊，該行車控制電腦可以融合該自動緊急煞車輔助資訊和該轉向防撞決策資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vehicle steering automatic collision avoidance system, including: a driving control computer connected to an autonomous emergency braking system and an automobile steering automatic collision avoidance system, the autonomous emergency braking system can provide automatic emergency braking assistance information, when activated, the automobile steering automatic collision avoidance system can provide steering anti-collision decision information, the driving control computer can integrate the automatic emergency braking assistance information and steering anti-collision decision information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:車輛轉向自動防撞系統</p>  
        <p type="p">11:行車控制電腦</p>  
        <p type="p">12:自動緊急煞車輔助系統</p>  
        <p type="p">13:車輛轉向自動防撞系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="473" publication-number="202612247"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612247.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612247</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134748</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>採用漸變式驅動機制的馬達驅動器</chinese-title>  
        <english-title>MOTOR DRIVER PERFORMING PROGRESSIVE DRIVING MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H02P3/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂達電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANPEC ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種採用漸變式驅動機制的馬達驅動器。馬達驅動器包含漸變驅動設定電路、漸變波形建構電路以及馬達驅動電路。漸變驅動設定電路輸出隨時間漸變的一漸變驅動設定訊號，所述漸變驅動設定訊號具有在多個設定時間點分別設定的不同的多個漸變驅動設定電壓。漸變波形建構電路依據多個漸變驅動設定電壓，以設定一漸變波形訊號的多個波形。漸變波形訊號的多個波形分別的多個占空比彼此不同。馬達驅動電路依據漸變波形訊號以驅動馬達。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A motor driver performing a progressive driving mechanism is provided. The motor driver includes a progressive driving setting circuit, a progressive waveform constructing circuit and a motor driving circuit. The progressive driving setting circuit outputs a progressive driving setting signal that is gradually changed over time. The progressive driving setting signal has a plurality of progressive driving setting voltages that are set respectively at a plurality of setting time points. The progressive driving setting voltages are different from each other. The progressive waveform constructing circuit sets a plurality of waveforms of a progressive waveform signal according to the progressive driving setting voltages. Duty cycles respectively of the plurality of waveforms of the progressive waveform signal are different from each other. The motor driving circuit drives a motor according to the progressive waveform signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:漸變驅動設定電路</p>  
        <p type="p">WBS:漸變驅動設定訊號</p>  
        <p type="p">20:漸變波形建構電路</p>  
        <p type="p">DTS:漸變波形訊號</p>  
        <p type="p">30:馬達驅動電路</p>  
        <p type="p">DRS:漸變驅動訊號</p>  
        <p type="p">MT:馬達</p>  
        <p type="p">40:振盪電路</p>  
        <p type="p">WOS:振盪波形訊號</p>  
        <p type="p">50:轉速偵測電路</p>  
        <p type="p">RPMS:馬達轉速偵測訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="474" publication-number="202612254"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612254.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612254</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於溫度設定占空比的馬達驅動器</chinese-title>  
        <english-title>MOTOR DRIVER SETTING DUTY CYCLES BASED ON TEMPERATURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241231B">H02P29/62</main-classification>  
        <further-classification edition="200601120241231B">H02P1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂達電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANPEC ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種基於溫度設定占空比的馬達驅動器。本發明的馬達驅動器感測馬達所在環境的溫度，依據感測到的溫度設定占空比調變值，依據此占空比調變值調變預設占空比以形成啟動占空比。本發明的馬達驅動器將一啟動訊號的一或多個波形的占空比，設定或調變至等於啟動占空比。本發明的馬達驅動器輸出啟動訊號至馬達。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A motor driver setting duty cycles based on a temperature is provided. The motor driver senses a temperature of an environment where a motor is disposed. The motor driver sets a duty cycle modulation value according to the sensed temperature, and modulates a preset duty cycle to form a start-up duty cycle according to the duty cycle modulation value. The motor driver sets or modulates duty cycles of one or more waveforms of a start-up signal to be equal to the start-up duty cycle. The motor driver outputs the start-up signal to the motor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">TSE:溫度感測器</p>  
        <p type="p">TEMP:溫度感測訊號</p>  
        <p type="p">TDY:溫度占空比調變電路</p>  
        <p type="p">MUDUY:占空比調變指示訊號</p>  
        <p type="p">SDT:啟動占空比決定電路</p>  
        <p type="p">STADUTY:啟動占空比指示訊號</p>  
        <p type="p">STA:啟動訊號產生電路</p>  
        <p type="p">DRV:驅動電路</p>  
        <p type="p">MT:馬達</p>  
        <p type="p">PAN:波形圖樣產生電路</p>  
        <p type="p">OSC:振盪訊號產生電路</p>  
        <p type="p">INTDUTY:初始占空比</p>  
        <p type="p">FNLDUTY:最終占空比</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="475" publication-number="202611389"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611389.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611389</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134750</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線微晶片控制捲門系統</chinese-title>  
        <english-title>WIRELESS MICROCHIP CONTROLLED ROLLING DOOR SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">E06B9/68</main-classification>  
        <further-classification edition="200601120241029B">E06B9/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立彰化師範大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHANGHUA UNIVERSITY OF EDUCATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許健泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIEN-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚凱超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, KAI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請為一種捲門系統，其包括一捲門裝置、一馬達裝置及一微控制處理器。捲門裝置不作動時，捲門裝置處於一停留位置；馬達裝置與捲門裝置動力連接，馬達裝置驅使捲門裝置由停留位置上升或下降至一極限位置；微控制處理器與馬達裝置耦接，微控制處理器依據一分割時間資料計算停留位置到達極限位置之一移動距離，並產生一對應移動距離的移動訊號至馬達裝置，令馬達裝置驅使捲門裝置由停留位置移動至極限位置。藉此，本申請以微控制方式控制捲門裝置移動至極限位置，以立即作出反應，而不用花費過多之處理時間。此外，還具有較長之使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A rolling door system, which comprises a rolling door device, a motor device and a microcontrol processor. When the rolling door device does not move, the rolling door device is in a staying position; The motor device is connected with the rolling door device, and the motor device drives the rolling door device to rise or fall from the staying position to a limit position; The microcontrol processor is coupled with the motor device, and the microcontrol processor calculates a moving distance of the staying position to one of the limit positions according to a split time data, and generates a moving signal corresponding to the moving distance to the motor device, so that the motor device drives the rolling door device to move to the limit position. Thus, the application controls the movement of the rolling door device to the limit position in a micro-controlled manner, so that the rolling door system can react immediately without excessive processing time. In addition, it has a long service life.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:捲門系統</p>  
        <p type="p">10:捲門裝置</p>  
        <p type="p">20:馬達裝置</p>  
        <p type="p">30:微控制處理器</p>  
        <p type="p">60:捲門控制器</p>  
        <p type="p">P1:第一極限位置</p>  
        <p type="p">P2:第二極限位置</p>  
        <p type="p">P3:停留位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="476" publication-number="202612121"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612121.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612121</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134754</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構</chinese-title>  
        <english-title>PACKAGE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240923B">H01L23/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>同欣電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG HSING ELECTRONIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭天豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, TIEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳承昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHENG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪立群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, LI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種封裝結構，包括基板、至少一微引流結構及連接膠體。基板具有加工表面。微引流結構設置於加工表面上，每一微引流結構包括至少一引流流道，至少一引流流道由所述加工表面的中央部位朝向加工表面的至少一角落延伸。至少一微引流結構用以導流連接膠體，連接膠體由加工表面的內部位置接觸於微引流結構，流通於至少一引流流道，且經至少一引流流道的導引，連接膠體由內部位置分別朝向加工表面外的多個方向流動，連接膠體流動後分布的區域定義黏著區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A packaging structure includes a substrate, at least one micro-drainage structure and connecting adhesive. The substrate has a processing surface. The micro-drainage structures are disposed on the processing surface, and each micro-drainage structure includes at least one drainage channel. The at least one drainage channel extends from a central portion inside of the processing surface toward at least one corner of the processing surface. The at least one micro-drainage structure is used to guide the connecting adhesive. The connecting adhesive contacts the micro-draining structure from the internal position of the processing surface, flows through at least one drainage channel, and is guided by the at least one drainage channel. The connecting adhesive flows from the internal position to a plurality of directions outside the processing surface. The area where the connecting adhesive is distributed after flowing defines an adhesion area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:加工表面</p>  
        <p type="p">12,12’:微引流結構</p>  
        <p type="p">121,121’:第一引流區段</p>  
        <p type="p">122,122’:第二引流區段</p>  
        <p type="p">123,123’:第二引流區段</p>  
        <p type="p">1211:引流流道</p>  
        <p type="p">15:擋牆結構</p>  
        <p type="p">16:導電層</p>  
        <p type="p">L1:中央線</p>  
        <p type="p">A1:黏著區域</p>  
        <p type="p">CP:中央部位</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="477" publication-number="202611355"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611355.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611355</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134755</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>織物</chinese-title>  
        <english-title>TEXTILE FABRIC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">D03D9/00</main-classification>  
        <further-classification edition="202101120240929B">D03D15/00</further-classification>  
        <further-classification edition="200601120240929B">D04B21/00</further-classification>  
        <further-classification edition="200601120240929B">B32B27/12</further-classification>  
        <further-classification edition="202201120240929B">A43B1/04</further-classification>  
        <further-classification edition="201901120240929B">A41D31/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>織匯貿易有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHIH HUEI TRADING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳永裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUNG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建平</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種織物，包括：一本體、一第一覆層及一第二覆層。該本體由複數織線交織而成且包括相對之二表面及複數穿設該二表面之穿孔，該複數織線包括至少一彈性絲；該第一覆層覆設於該二表面其中一者且包括至少一第一區塊及至少一第二區塊，各該第二區塊之厚度與一該第一區塊之厚度相異；該第二覆層覆設於該二表面之另一者且經由該複數穿孔與該第一覆層相連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A textile fabric is provided, including: a main body, a first covering layer and a second covering layer. The main body is made of a plurality of yarns interlaced with one another and includes two surfaces opposite to each other and a plurality of through holes extending through the two surfaces. The plurality of yarns include at least one elastic yarn. The first covering layer is coveringly disposed on one of the two surfaces and includes at least one first region and at least one second region, a thickness of each said second region is different form a thickness of one said first region. The second covering layer is coveringly disposed on the other of the two surfaces and connected with the first covering layer via the plurality of through holes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:織物</p>  
        <p type="p">10:本體</p>  
        <p type="p">21:第一區塊</p>  
        <p type="p">22:第二區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="478" publication-number="202612181"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612181.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612181</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線端連接器</chinese-title>  
        <english-title>CABLE CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120240930B">H01R12/75</main-classification>  
        <further-classification edition="200601120240930B">H01R13/633</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種線端連接器，包括：絕緣本體，其設有下端面及貫穿所述下端面的至少一個端子腔；及至少一個端子組件，每一所述端子組件包括導電件、導電冠簧及線纜，所述導電件包括柱狀部及平板部，所述柱狀部設有相對的上端面及下端面以及向下貫穿所述下端面的對接腔，所述導電冠簧收容在所述對接腔內，所述柱狀部收容并固定在所述絕緣本體的端子腔內，所述線纜的一端具有裸露的剝皮芯線，所述剝皮芯線焊接在所述平板部；其中，所述平板部自所述柱狀部的上端面或者臨近上端面處向後一體延伸而形成，且所述平板部垂直於所述柱狀部，所述剝皮芯線焊接在所述平板部的下表面，如此，所述剝皮芯線與所述柱狀部位於平板部的下方側。與習知技術相比，本發明的線纜與柱狀體位於平板部沿對接方向的同一側，可以降低線端連接器的整體高度，實現靈巧型連接器之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cable connector includes: an insulating housing defining a bottom face and at least one terminal cavity; and at least one terminal assembly including a conductor, a crown spring and cables. The conductor includes a column portion with a mating cavity opening through a bottom face thereof, and a plate portion. The crown spring is received in the mating cavity, the column portion is received in the terminal cavity. Exposed wires of the cables are welded with a bottom face of the plate portion. The plate portion perpendicularly extends rearwards from a top face of the column portion, so that the cables and the column portion are located at a same side of the plate portion in a mating direction thereof, thereby decreasing a wholly height of the cable connector to get a compact cable connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:柱狀部</p>  
        <p type="p">22:平板部</p>  
        <p type="p">221:下表面</p>  
        <p type="p">321:剝皮芯線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="479" publication-number="202611721"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611721.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611721</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134759</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電器設備監控系統以及電器設備監控方法</chinese-title>  
        <english-title>ELECTRICAL APPLIANCE MONITORING SYSTEM AND ELECTRICAL APPLIANCE MONITORING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G06F11/30</main-classification>  
        <further-classification edition="200601120241007B">G01R31/28</further-classification>  
        <further-classification edition="202301120241007B">G06N3/0464</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人資訊工業策進會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪永杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, YUNG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣貴君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, KUEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電器設備監控系統以及電器設備監控方法。電器設備監控系統包括處理器以及儲存電路，儲存電路儲存有用電數據模型以及多個啟閉識別模型。處理器執行用電數據模型以根據總電力時序資料輸出多筆電力時序資料。處理器從用電數據模型擷取多個特徵波形。處理器執行多個啟閉識別模型，各啟閉識別模型依據多個特徵波形輸出多筆啟閉識別時序資料。處理器根據多個啟閉識別模型針對各電器設備所輸出的多筆啟閉識別時序資料，以產生各電器設備的啟閉狀態時序資料。處理器根據啟閉狀態時序資料產生各電器設備對應的多個啟閉狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical appliance monitoring system and an electrical appliance monitoring method are provided. The electrical appliance monitoring system includes a processor and a storage circuit. The processor is electrically connected to the storage circuit. The storage circuit stores a power consumption data model and multiple on-off state identification models. The processor executes the power consumption data model to output a plurality of power timing records according to the total power timing data. The processor extracts characteristic waveforms from the power consumption data model. The processor executes the on-off state identification models, wherein each on-off state identification model is configured to output multiple on-off state identification timing records according to the characteristic waveforms. The processor outputs on-off state timing data for each of the electrical appliances according to on-off state identification timing records outputted by the on-off state identification models. The processor generates multiple on-off states corresponding to each electrical appliance according to the on-off state timing data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:房屋</p>  
        <p type="p">B_1~B_n:電器設備</p>  
        <p type="p">1:處理器</p>  
        <p type="p">2:感測器</p>  
        <p type="p">3:儲存電路</p>  
        <p type="p">4:第一網路介面</p>  
        <p type="p">5:第二網路介面</p>  
        <p type="p">C:總電源端</p>  
        <p type="p">D:用電數據模型</p>  
        <p type="p">E_1~E_n:啟閉識別模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="480" publication-number="202610559"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610559.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610559</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134764</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>穿戴式裝置和通訊方法</chinese-title>  
        <english-title>WEARABLE DEVICE AND COMMUNICATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">A41D27/00</main-classification>  
        <further-classification edition="201901120241007B">A41D31/04</further-classification>  
        <further-classification edition="200601120241007B">H01P3/00</further-classification>  
        <further-classification edition="202401120241007B">H04B5/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊熠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-YIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦大鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PU, TA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭彥良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種穿戴式裝置，包括一柔性穿戴層和一可拆卸層。柔性穿戴層包括一布料元件和一第一金屬共振結構，其中第一金屬共振結構係與布料元件互相整合。可拆卸層係鄰近於柔性穿戴層。可拆卸層包括一介質基板和一第二金屬共振結構。介質基板具有相對之一第一表面和一第二表面。第二金屬共振結構係分佈於介質基板之第一表面和第二表面。當穿戴式裝置接收到一射頻信號時，柔性穿戴層將會引導射頻信號傳往可拆卸層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wearable device includes a flexible wearable layer and a detachable layer. The flexible wearable layer includes a fabric element and a first metal resonant structure. The first metal resonant structure is integrated with the fabric element. The detachable layer is adjacent to the flexible wearable layer. The detachable layer includes a dielectric substrate and a second metal resonant structure. The dielectric substrate has a first surface and a second surface which are opposite to each other. The second metal resonant structure is distributed over the first surface and the second surface of the dielectric substrate. When the wearable device receives an RF (Radio Frequency) signal, the flexible wearable layer guides the RF signal to the detachable layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:穿戴式裝置</p>  
        <p type="p">110:柔性穿戴層</p>  
        <p type="p">120:布料元件</p>  
        <p type="p">130:第一金屬共振結構</p>  
        <p type="p">140-1,140-2,140-N:第一金屬單元</p>  
        <p type="p">150:可拆卸層</p>  
        <p type="p">160:介質基板</p>  
        <p type="p">170:第二金屬共振結構</p>  
        <p type="p">180-1,180-2,180-M:第二金屬單元</p>  
        <p type="p">D1,D2,DS:間距</p>  
        <p type="p">E1:第一表面</p>  
        <p type="p">E2:第二表面</p>  
        <p type="p">L1,L2:長度</p>  
        <p type="p">SF:射頻信號</p>  
        <p type="p">X:X軸</p>  
        <p type="p">Y:Y軸</p>  
        <p type="p">Z:Z軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="481" publication-number="202611608"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611608.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611608</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134766</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背光模組</chinese-title>  
        <english-title>BACKLIGHT MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">G02F1/13357</main-classification>  
        <further-classification edition="200601120241128B">G02F1/1335</further-classification>  
        <further-classification edition="200601120241128B">G02F1/1333</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和碩聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGATRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林雨德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡宏文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, HUNG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王智勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種背光模組，包括一導光板、一裝飾板以及多個光源。導光板包括多條溝槽，以將導光板區分出多個區域。裝飾板設置於導光板上，且包括一透光圖案，透光圖案重疊於該些區域的至少數者。這些光源包括至少兩個顏色，這些光源設置於導光板旁，且分別對應這些區域，其中這些光源通過導光板的這些溝槽進行分區分色，裝飾板顯示包括至少兩個顏色的透光圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A backlight module includes a light guide plate, a decorating plate and multiple light sources. The light guide plate includes multiple notches to separate the light guide plate to multiple regions. The decorating plate is disposed on the light guide plate and includes a light transmitting pattern. The light transmitting pattern is overlapped on at least some of the multiple regions. The multiple light sources include at least two colors of light. The multiple light sources are disposed besides the light guide plate and correspond to the multiple regions, wherein the at least two colors of light emitted from the multiple light sources can be separated in different regions by the multiple notches of the light guide plate. The decorating plate displays the light transmitting pattern which includes the at least two colors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:背光模組</p>  
        <p type="p">110:導光板</p>  
        <p type="p">111:溝槽</p>  
        <p type="p">113:區域</p>  
        <p type="p">115:第一面</p>  
        <p type="p">120:光源</p>  
        <p type="p">130:裝飾板</p>  
        <p type="p">131:透光圖案</p>  
        <p type="p">D1:出光方向</p>  
        <p type="p">D2:延伸方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="482" publication-number="202611513"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611513.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611513</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134767</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動多面檢測設備</chinese-title>  
        <english-title>AUTOMATIC MULTI-SURFACE INSPECTION EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G01N35/04</main-classification>  
        <further-classification edition="200601120241007B">G01N21/88</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>由田新技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UTECHZONE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒嘉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佳民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種自動多面檢測設備，包括一入出料裝置、至少一正面檢測裝置、一側面檢測裝置及一背面檢測裝置。入出料裝置將至少一承載物件送至一檢測路徑的一入料端，並於檢測路徑的一出料端接收至少一承載物件。至少一承載物件載至少一待測物。至少一正面檢測裝置設置於檢測路徑上，以光學檢測至少一待測物的一第一表面。側面檢測裝置設置於檢測路徑上，以光學檢測至少一待測物的至少一側表面。背面檢測裝置設置於檢測路徑上，以光學檢測至少一待測物的一第二表面。第一表面與第二表面分別為所述至少一待測物的相對面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automatic multi-surface inspection equipment is provided. The equipment includes an inlet-outlet device, at least one front inspection device, a side inspection device and a back inspection device. The inlet-outlet device transports at least one carrier to a loading end of an inspection path, and receives the at least one carrier at an unloading end of the inspection path. The at least one carrier carries at least one object to be tested. The at least one front inspection device is disposed at the inspection path to optically inspect a first surface of the at least one object to be tested. The side inspection device is disposed at the inspection path to optically inspect at least one side surface of the at least one object to be tested. The back inspection device is disposed at the inspection path to optically inspect a second surface of at least one object to be tested. The first surface and the second surface are respectively opposite surfaces of the at least one object to be tested.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:自動多面檢測設備</p>  
        <p type="p">1:管理裝置</p>  
        <p type="p">2:入出料裝置</p>  
        <p type="p">3:正面檢測裝置</p>  
        <p type="p">31:正面光源模組</p>  
        <p type="p">32:正面影像擷取模組</p>  
        <p type="p">4:側面檢測裝置</p>  
        <p type="p">41:側面光源模組</p>  
        <p type="p">42:側面影像擷取模組</p>  
        <p type="p">43:真空旋轉載台</p>  
        <p type="p">5:背面檢測裝置</p>  
        <p type="p">51:背面光源模組</p>  
        <p type="p">52:背面影像擷取模組</p>  
        <p type="p">6:移載裝置</p>  
        <p type="p">61:第一移載模組</p>  
        <p type="p">62:第二移載模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="483" publication-number="202611882"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611882.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611882</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134770</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有漏液警報功能之浸沒式冷卻系統</chinese-title>  
        <english-title>IMMERSION COOLING SYSTEM WITH A LEAKAGE REPORTING FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">G08B21/18</main-classification>  
        <further-classification edition="200601120241105B">F28D1/06</further-classification>  
        <further-classification edition="200601220241105B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李易陞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有漏液警報功能之浸沒式冷卻系統包含浸沒式冷卻槽、漏液儲存槽、冷卻液分配裝置、管路漏液檢測線、多數個積液檢測線與漏液發報裝置。漏液儲存槽設置於浸沒式冷卻槽下方，用以收集並儲存一冷卻液。冷卻液分配裝置設置有一熱交換器與連通於浸沒式冷卻槽之一冷卻管路。管路漏液檢測線纏繞於冷卻管路。積液檢測線設置於浸沒式冷卻槽和冷卻液分配裝置之底部。漏液發報裝置用以在接收到管路漏液檢測線發送出之一管路漏液信號時發出一漏液提示信息，並在接收到積液檢測線發送出之一底部積液信號時發出一漏液警報。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An immersion cooling system with a leakage reporting function includes an immersion cooling tank, a leakage storage tank, a coolant distribution device, at least one pipeline leakage detection line, multiple liquid accumulation detection lines, and a leakage condition reporting device. The leakage storage tank is positioned below the immersion cooling tank to collect and store coolant. The coolant distribution device is equipped with a heat exchanger and a cooling pipeline connected to the immersion cooling tank. The pipeline leakage detection line is wrapped around the cooling pipeline. The liquid accumulation detection lines are placed at the bottom of the leakage storage tank and the coolant distribution device. The leakage condition reporting device is used to emit a leakage alert signal upon receiving a pipeline leakage signal transmitted by the pipeline leakage detection line, and further to emit a leakage alarm signal upon receiving a bottom liquid accumulation signal transmitted by the liquid accumulation detection lines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:浸沒式冷卻系統</p>  
        <p type="p">1:浸沒式冷卻槽</p>  
        <p type="p">11:冷卻液</p>  
        <p type="p">12:電子裝置</p>  
        <p type="p">2:漏液儲存槽</p>  
        <p type="p">3:冷卻液分配裝置</p>  
        <p type="p">31:熱交換器</p>  
        <p type="p">32:冷卻管路</p>  
        <p type="p">321:第一熱交換段</p>  
        <p type="p">322:第一流入段</p>  
        <p type="p">323:第一流出段</p>  
        <p type="p">33:第一幫浦</p>  
        <p type="p">34:熱交換管路</p>  
        <p type="p">341:第二熱交換段</p>  
        <p type="p">342:第二流入段</p>  
        <p type="p">343:第二流出段</p>  
        <p type="p">35:冷卻水儲存槽</p>  
        <p type="p">36:冷卻水</p>  
        <p type="p">37:第二幫浦</p>  
        <p type="p">4a,4b:管路漏液檢測線</p>  
        <p type="p">5a,5b:積液檢測線</p>  
        <p type="p">6:漏液發報裝置</p>  
        <p type="p">61:信號處理單元</p>  
        <p type="p">62:判斷單元</p>  
        <p type="p">63:發報單元</p>  
        <p type="p">7:液位檢測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="484" publication-number="202610711"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610711.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610711</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134771</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空幫浦系統</chinese-title>  
        <english-title>VACUUM PUMP SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">B01D35/02</main-classification>  
        <further-classification edition="202201120241230B">B01D50/20</further-classification>  
        <further-classification edition="200601120241230B">F04B37/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鋒魁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORWARD SCIENCE CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張育銓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種真空幫浦系統，包含氣旋式過濾裝置以及真空幫浦。氣旋式過濾裝置包含外罩、內筒、氣體入口及氣體出口。外罩圍繞出過濾空間。內筒位於外罩內且將過濾空間至少區分為內腔室及外腔室。氣體入口位於外罩的上方且連通外腔室。氣體出口位於外罩的下方且連通內腔室。真空幫浦包含進氣口及幫浦氣室。進氣口與氣體出口連通，幫浦氣室連通進氣口。其中，氣體進入氣體入口以進入外腔室，以分離氣體中的雜質，且經過濾的氣體再由內腔室經氣體出口及進氣口進入幫浦氣室。藉此，可淨化進入幫浦氣室的氣體，增加使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a vacuum pump system including a cyclonic filtering device and a vacuum pump. The cyclonic filtering device includes an outer housing, an inner barrel, a gas inlet and a gas outlet. The outer housing surrounds a filtering space. The inner barrel is located within the filtering space and the filtering space is divided into at least an inner chamber and an outer chamber by the inner barrel. The gas inlet is located at an upper side of the outer housing and is communicated with the outer chamber. The gas outlet is located at a lower side of the outer housing and is communicated with the inner chamber. The vacuum pump includes a gas opening and a pumping chamber. The gas opening is communicated with the gas outlet, and the pumping chamber is communicated with the gas opening. A gas flows into the gas inlet so as to enter the outer chamber, thereby removing a particle. The gas then flows sequentially into the inner chamber, the gas opening and the pumping chamber after being filtered. Therefore, the gas flowing into the pumping chamber can be filtered, and the life time of the vacuum pump is increased.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:氣旋式過濾裝置</p>  
        <p type="p">1110:上蓋</p>  
        <p type="p">1111:蓋體</p>  
        <p type="p">1113:凸管</p>  
        <p type="p">1114:氣體入口</p>  
        <p type="p">1130:固定套筒</p>  
        <p type="p">1140:內筒</p>  
        <p type="p">1141:頂壁</p>  
        <p type="p">1142:筒壁</p>  
        <p type="p">1150:導引片</p>  
        <p type="p">1170:氣流管</p>  
        <p type="p">1171:導入口</p>  
        <p type="p">1172:外管面</p>  
        <p type="p">1173:鎖板</p>  
        <p type="p">1174:氣體出口</p>  
        <p type="p">1180:外罩</p>  
        <p type="p">1210:真空幫浦</p>  
        <p type="p">1211:進氣口</p>  
        <p type="p">1212:幫浦氣室</p>  
        <p type="p">S1:過濾空間</p>  
        <p type="p">S11:外腔室</p>  
        <p type="p">S12:內腔室</p>  
        <p type="p">S13:集塵腔室</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="485" publication-number="202611464"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611464.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611464</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134773</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱器</chinese-title>  
        <english-title>THERMAL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">F28F3/02</main-classification>  
        <further-classification edition="200601120240926B">F28D5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東擎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASROCK INDUSTRIAL COMPUTER CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, I-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱器，包括一底板、一散熱鰭片以及一蒸發腔。底板具有多個第一凹槽；散熱鰭片具有多個第二凹槽，散熱鰭片組裝於底板使得第一凹槽及第二凹槽共構多個流體管路。蒸發腔配置在底板，蒸發腔包括一腔體以及多個柱體。腔體具有位在不同側的多個流體入口以及多個流體出口，而流體管路與流體入口及流體出口連通，柱體設置在腔體內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thermal device including a base, a heat sink and a evaporation chamber is provided. The base has multiple first recesses and the heat sink has multiple second recesses. The first and second recesses co-construct multiple fluid channel while the heat sink assembled onto the base. The evaporation chamber is disposed at the base. The evaporation chamber has a chamber and multiple columns. The chamber has multiple inlets and outlets, wherein the inlets are at different sides form the outlets, and the fluid channels are communicated with the inlets and outlets. The columns are disposed in the chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:散熱器</p>  
        <p type="p">11:底板</p>  
        <p type="p">11a:開口</p>  
        <p type="p">112:第一凹槽</p>  
        <p type="p">12:散熱鰭片</p>  
        <p type="p">12a:底面</p>  
        <p type="p">12b:凹陷</p>  
        <p type="p">122:第二凹槽</p>  
        <p type="p">13:蒸發腔</p>  
        <p type="p">132:腔體</p>  
        <p type="p">132a:流體入口</p>  
        <p type="p">132b:流體出口</p>  
        <p type="p">134:柱體</p>  
        <p type="p">15:第一銅粉燒結層</p>  
        <p type="p">15a:第一區</p>  
        <p type="p">15b:第二區</p>  
        <p type="p">15c:第三區</p>  
        <p type="p">15d:開孔</p>  
        <p type="p">17:頂蓋</p>  
        <p type="p">18:銅粉燒結柱</p>  
        <p type="p">S1:第一側</p>  
        <p type="p">S2:第二側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="486" publication-number="202612128"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612128.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612128</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134778</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝結構</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">H01L23/31</main-classification>  
        <further-classification edition="200601120241128B">H01L23/492</further-classification>  
        <further-classification edition="200601120241128B">H01L23/538</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南茂科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPMOS TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許翰誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HAN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體封裝結構，包括一基板、一第一晶片、一第二晶片以及一封裝膠體。基板的一槽孔具有一槽寬。第一晶片配置於基板的第一表面。第二晶片配置於基板的第二表面，且對應基板的槽孔設置。封裝膠體配置於基板上，填滿槽孔且包覆第一晶片與第二晶片。封裝膠體包括位於基板的第一表面的一上膠體以及位於基板的第二表面的一下膠體。第一晶片沿一第一方向延伸且具有一第一寬度，而第二晶片於第一方向上具有一第二寬度。第二寬度小於第一寬度且大於槽孔的槽寬。第二晶片被下膠體完全包覆。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package structure includes a substrate, a first chip, a second chip and a molding compound. A slot hole of the substrate has a slot width. The first chip is disposed on a first surface of the substrate. The second chip is disposed on a second surface of the substrate and disposed corresponding to the slot hole of the substrate. The molding compound is disposed on the substrate to fill the slot hole and covers the first chip and the second chip. The molding compound includes an upper molding compound disposed on the first surface of the substrate and a lower molding compound disposed on the second surface of the substrate. The first chip extends in a first direction and has a first width, while the second chip has a second width in the first direction. The second width is smaller than the first width and greater than the slot width of the slot hole. The second chip is fully covered by the lower molding compound.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:半導體封裝結構</p>  
        <p type="p">110:基板</p>  
        <p type="p">111:第一表面</p>  
        <p type="p">112、114:接墊</p>  
        <p type="p">113:第二表面</p>  
        <p type="p">115:槽孔</p>  
        <p type="p">120a:第一晶片</p>  
        <p type="p">121a、131a:主動面</p>  
        <p type="p">123a、133a:背面</p>  
        <p type="p">130a:第二晶片</p>  
        <p type="p">140:封裝膠體</p>  
        <p type="p">142:上膠體</p>  
        <p type="p">144:下膠體</p>  
        <p type="p">145:底表面</p>  
        <p type="p">150、160:打線</p>  
        <p type="p">170:錫球</p>  
        <p type="p">171:下表面</p>  
        <p type="p">175、177:黏晶材料</p>  
        <p type="p">H:高度差</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="487" publication-number="202611276"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611276.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611276</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134779</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>柑橘類萃取裝置、柑橘類的精油與純露的萃取方法</chinese-title>  
        <english-title>CITRUS EXTRACTION APPARATUS AND METHOD FOR EXTRACTING ESSENTIAL OIL AND HYDROSOL FROM CITRUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">C11B9/02</main-classification>  
        <further-classification edition="200601120250203B">B01D5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>囍感國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIGAN INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳苡佩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種柑橘類萃取裝置、柑橘類的精油與純露的萃取方法。所述裝置由萃取組件、油水分離槽、加熱槽、冷凝管、冷卻槽與分離槽組成。通過插針與冷壓結構結合進行柑橘果實的萃取，並依次進行過濾、油水分離、加熱、冷凝及二次分離，最終提取高純度的精油與純露。且所述方法應用上述裝置進行萃取，不僅提高萃取效率，還最大程度地保護精油活性成分，實現精油與純露1:1的分離比例。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a citrus extraction apparatus and a method for extracting essential oil and hydrosol from citrus. The apparatus is composed of an extraction component, an oil-water separation tank, a heating tank, a condenser, a cooling tank, and a separation tank. The extraction of citrus fruits is performed through a combination of needle insertion and cold pressing structures, followed by sequential filtration, oil-water separation, heating, condensation, and secondary separation, ultimately obtaining high-purity essential oil and hydrosol. The method, using the aforementioned apparatus, not only improves extraction efficiency but also maximally preserves the active components of the essential oil, achieving a 1:1 separation ratio of essential oil to hydrosol.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:萃取裝置</p>  
        <p type="p">110:萃取組件</p>  
        <p type="p">112:載物件</p>  
        <p type="p">114:榨汁件</p>  
        <p type="p">116:過濾件</p>  
        <p type="p">118:收集槽</p>  
        <p type="p">120:第一輸送管</p>  
        <p type="p">130:油水分離槽</p>  
        <p type="p">140:第二輸送管</p>  
        <p type="p">150:加熱槽</p>  
        <p type="p">160:冷凝管</p>  
        <p type="p">170:冷卻槽</p>  
        <p type="p">180:第三輸送管</p>  
        <p type="p">190:分離槽</p>  
        <p type="p">200:鮮果儲存槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="488" publication-number="202611597"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611597.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611597</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環景抬頭顯示器</chinese-title>  
        <english-title>PANORAMIC HEAD-UP DISPLAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">G02B27/01</main-classification>  
        <further-classification edition="200601120241128B">G02B5/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>怡利電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E-LEAD ELECTRONIC CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳錫勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種環景抬頭顯示器包含設置在儀表台上的一反射鏡及位於反射鏡下方的多個平面顯示模組。反射鏡延伸於儀表台的左右側邊緣之間，反射鏡後方設有提供固定於儀表台的鏡座，反射鏡前方設有提供支撐的透明防護蓋，反射鏡的反射面具有較低的反射率，避免反射儀表台光線，反射鏡可以吸收穿透反射鏡反射面的光線，避免重影，各平面顯示模組投射影像光束至反射鏡，反射鏡將影像光束反射至觀看者的眼睛。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A panoramic head-up display includes a reflector arranged on an instrument desk, and flat-panel display modules located below the reflector. The reflector extends between the left and right A-pillars of the instrument desk. There is a mirror base fixed to the instrument panel behind the reflector, and a transparent protective cover is provided in front of the reflector to provide support. The reflective surface of the reflector has low reflectivity to avoid reflecting the light from the instrument desk. The reflector absorbs the light that penetrates the reflective surface of the reflector and avoids double images. Each flat-panel display modules projects image beam to the reflector, and the reflector reflects the image beam to the viewer’s eyes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:反射鏡</p>  
        <p type="p">11:前表面</p>  
        <p type="p">12:後表面</p>  
        <p type="p">13:深色吸光層</p>  
        <p type="p">3:平面顯示模組</p>  
        <p type="p">31:平面顯示面板</p>  
        <p type="p">32:指向性背光模組</p>  
        <p type="p">4:鏡座</p>  
        <p type="p">41:外表面</p>  
        <p type="p">5:透明防護蓋</p>  
        <p type="p">6:擋風玻璃</p>  
        <p type="p">D:影像光束</p>  
        <p type="p">E:眼睛</p>  
        <p type="p">LSR:避光區域</p>  
        <p type="p">ID:儀表台</p>  
        <p type="p">ID_rc:凹槽</p>  
        <p type="p">VI:影像虛像</p>  
        <p type="p">θm:夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="489" publication-number="202610874"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610874.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610874</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134802</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>行駛紀錄校正系統及其方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241219B">B60W50/04</main-classification>  
        <further-classification edition="200601120241219B">B60W40/02</further-classification>  
        <further-classification edition="201201120241219B">B60W40/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>公信電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許健祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳偉棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張淑婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種行駛紀錄校正系統及其方法，主要是透過一車速線、一GPS天線及一電路板之組合設計，且先將該車速線解析出一脈衝頻率數值，並與該GPS模組之GPS車輛速度相除，以得到一脈衝係數，再經由該脈衝係數來計算出一脈衝車輛速度，當該脈衝車輛速度與該GPS模組之GPS車輛速度的誤差小於一設定值時，則完成該脈衝係數之計算，而當該脈衝車輛速度與該GPS模組之GPS車輛速度的誤差大於一設定值時，則重複該脈衝係數之運算過程，直到完成該脈衝係數的校正，最後，以該脈衝係數來運算出一實際車輛速度，使具有自動校正行駛車速的效能，以提高行駛紀錄的準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:箱體</p>  
        <p type="p">10:車速線</p>  
        <p type="p">20:GPS天線</p>  
        <p type="p">30:電路板</p>  
        <p type="p">31:顯示屏埠口</p>  
        <p type="p">32:列印機埠口</p>  
        <p type="p">33:車速線埠口</p>  
        <p type="p">34:GPS天線埠口</p>  
        <p type="p">35:微控制器(MCU)</p>  
        <p type="p">36:GPS模組</p>  
        <p type="p">40:顯示屏</p>  
        <p type="p">50:列印機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="490" publication-number="202610620"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610620.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610620</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多功能包覆靶向胃黏膜給藥系統、製造方法及其用途</chinese-title>  
        <english-title>MULTI-FUNCTIONAL COATED DRUG DELIVERY SYSTEM TARGETING GASTRIC MUCOSAL, MANUFACTURING METHOD AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250421B">A61K9/48</main-classification>  
        <further-classification edition="200601120250421B">A61K9/30</further-classification>  
        <further-classification edition="200601120250421B">A61K39/02</further-classification>  
        <further-classification edition="200601120250421B">A61P35/00</further-classification>  
        <further-classification edition="200601120250421B">A61P1/00</further-classification>  
        <further-classification edition="200601120250421B">A61P31/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恩基生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENKI BIOMEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃東裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TONG-YUH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游智戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, ZHI-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周鈺章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YU-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豫宛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種多功能包覆靶向胃黏膜給藥系統，包含：一可抗胃酸與胃蛋白酶分解的聚合物組合、一密度增進劑、一具胃黏液黏附的聚合物組合，及一具滲透胃黏液的聚合物組合。此靶向胃黏膜給藥系統可避免藥物及/或抗體在胃液環境中被分解或失去活性，其中藥物可經由高比重沉降，經由黏液附著進入黏液層，再滲透深入黏液層內或黏膜表皮上，以發揮作用。因此，該多功能包覆靶向胃黏膜給藥系統可避免藥物在胃中分解耗損或經由胃排空進入腸道，以降低給藥劑量，且可在較低劑量即能發揮功效，大幅提升藥物效能與生物利用率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a multi-functional coated drug delivery system targeting gastric mucosal, comprising: a polymer combination resistant to digestion of gastric acid and pepsin, a density-increasing agent, a polymer combination for muco-adhesion, and a polymer combination for muco-penetration. The drug delivery system targeting gastric mucosal prevents drugs and/or antibodies from being degraded or losing activity in gastric fluid environments. Drugs can sink by high gravity, adhere to mucus to enter the mucus layer, and then penetrate deeply into the mucus layer or mucosal epithelium to exert their effects. Therefore, the multi- functional coated drug delivery system targeting gastric mucosal prevents drug from being decomposed, inactivated in the stomach or carrying to intestine through gastric emptying, so as to reduce drug dosage while achieving efficacy at lower dosage, significantly enhancing drug efficacy and bioavailability.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="491" publication-number="202610736"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610736.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610736</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134811</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽能板回收方法及回收系統</chinese-title>  
        <english-title>SOLAR PANEL RECYCLING METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120240923B">B09B3/35</main-classification>  
        <further-classification edition="202201120240923B">G06V10/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳品涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳品涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳偉聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張以彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種太陽能板回收方法及回收系統，該回收步驟包括S1移除外框及接線盒，將太陽能板進行破碎，並產生複數設定尺寸範圍之碎粒；S2建立AI影像辨識系統，該AI影像辨識系統對複數之該碎粒拍照並進行AI辨識，並區分該碎粒具複數不同辨識對象，而該辨識對象為電池片、玻璃與電池片複合體、塑膠背板、銅錫導線；S3設置機械手臂系統，對應該辨識對象取出至對應之置料盒回收；藉此本發明可具精確回收及較佳環保功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a solar panel recycling method and recycling system. The recycling steps include: S1: Remove the outer frame and junction box, crush the solar panel, and produce a plurality of fragments within a set size range. S2: Establish an AI image recognition system. This AI image recognition system takes photos of a plurality of fragments and performs AI recognition, distinguishing between different identified objects, such as battery cells, glass and battery cell composites, plastic backplates, and copper-tin conductors.S3: Set up a robotic arm system that corresponds to the identified objects, extracting and placing them into respective collection boxes for recycling. Through this invention, precise recycling and improved environmental benefits can be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:移除外框及接線盒，將太陽能板進行破碎，並產生複數設定尺寸範圍之碎粒</p>  
        <p type="p">S2:建立AI影像辨識系統，該AI影像辨識系統對複數之該碎粒拍照並進行AI辨識，並區分該碎粒具複數不同辨識對象</p>  
        <p type="p">S3:設置機械手臂系統，對應該辨識對象取出至對應之置料盒回收</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="492" publication-number="202611288"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611288.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611288</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生醫檢測晶片</chinese-title>  
        <english-title>BIOMEDICAL DETECTION CHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">C12M1/42</main-classification>  
        <further-classification edition="200601120241125B">C12M1/00</further-classification>  
        <further-classification edition="200601120241125B">C12M3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智湧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉承賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種生醫檢測晶片，包含一檢測模組，且該檢測模組包括一檢測基板、一入料分配單元，及多個流道單元。該入料分配單元具有一設置該檢測基板中的分布部件，該分布部件具有一接收口及多個出口，用於令自該接收口進入的一液體呈高斯分布而自該等出口流出。該等流道單元分別與該等出口連通，且每一該流道單元具有一第一流道部及一第二流道部。該第一流道部及該第二流道部分別包括位於該檢測基板內的一第一流道、一第一腔室及一第二流道、一第二腔室。藉由該入料分配單元與該等流道單元的搭配，達到同時檢測藥物對於不同濃度的目標細胞的影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A biomedical detection chip comprises a detection module, and the detection module includes a detection substrate, a feed dispensing unit and a plurality of flow path units. The feeding dispensing unit has a distributing member disposed in the detection substrate, the distributing member having a receiving opening and a plurality of outlets for making a fluid entered from the receiving opening have a Gaussian distribution and flow out from the outlets. The flow path units are respectively communicated with the outlets, and each of the flow path units has a first flow path portion and a second flow path portion. The first and second flow path portions respectively include a first flow path, a first chamber, and a second flow path, a second chamber located in the detection substrate. With cooperation of the feeding dispensing unit and the flow path units, detecting influence of drug for different concentration of target cells is achieved simultaneously.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:檢測模組</p>  
        <p type="p">3:電極模組</p>  
        <p type="p">4:進料模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="493" publication-number="202611286"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611286.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611286</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生醫檢測晶片</chinese-title>  
        <english-title>BIOMEDICAL DETECTION CHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">C12M1/00</main-classification>  
        <further-classification edition="200601120241125B">C12M1/42</further-classification>  
        <further-classification edition="200601120241125B">C12M3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴俊佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHUN-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉承賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種生醫檢測晶片，包含一第一檢測模組及位於該第一檢測模組下方的一第二檢測模組。該第一檢測模組包括一第一基板及形成於該第一基板的至少一第一流道單元，每一該第一流道單元包括一位於該第一基板內的第一流道，及位於該第一流道兩端的一第一、二開口，該第二檢測模組包括一第二基板，及至少一與該第一流道單元數量相應的第二流道單元，每一該第二流道單元包括一位於該第二基板內的第二流道，及位於該第二流道兩端的一第三、四開口，且該第一基板不會遮蔽該第四開口。藉由多個檢測模組堆疊的設計，達到能夠同時檢測多種器官細胞的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A biomedical detection chip comprising a first detection module and a second detection module located below the first detection module. The first detection module includes a first substrate and at least one first flow path unit formed on the first substrate, each of the first flow path units including a first flow path located in the first substrate, and a first opening and a second opening located at two ends of the first flow path unit, the second detection module including a second substrate, and at least one second flow path unit corresponding in number to the first flow path unit, each of the second flow path units including a second flow path located in the second substrate, and a third opening and a fourth opening located at two ends of the second flow path, and the first substrate does not cover the fourth opening. With the design of stacking a plurality of detection modules, an effect of simultaneously detecting multiple organ cells can be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:第一檢測模組</p>  
        <p type="p">21:第一基板</p>  
        <p type="p">3:第二檢測模組</p>  
        <p type="p">31:第二基板</p>  
        <p type="p">4:電極模組</p>  
        <p type="p">41:電極載板</p>  
        <p type="p">5:進料模組</p>  
        <p type="p">51:進料基板</p>  
        <p type="p">6:進出料管單元</p>  
        <p type="p">61:進出料管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="494" publication-number="202612255"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612255.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612255</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134814</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽能支架系統及其安裝方法</chinese-title>  
        <english-title>SOLAR BRACKET SYSTEM AND INSTALLATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241128B">H02S20/00</main-classification>  
        <further-classification edition="201401120241128B">H02S30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天暘矽晶國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史碩仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, SHOU-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種太陽能支架系統，其包含複數個第一支架、複數個第二支架、複數個緩衝件、複數個光電模組、複數個第一蓋板及複數個第二蓋板。第二支架設置在相鄰的第一支架之間，且設置在第一支架兩側之延伸結構上。光電模組設置在第一支架及第二支架上，第一蓋板及第二蓋板分別設置在光電模組上，且分別與第一支架及第二支架重疊。第一支架、第二支架、第一蓋板及第二蓋板相鄰光電模組之一側分別具有二接合部，且利用複數個連接件以連接光電模組及各二接合部。相鄰第一支架之間設置有緩衝件，使第一支架之二接合部之間的導水槽導通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A solar support system is provided. It includes plurality of the first brackets, plurality of the second brackets, plurality of the buffer members, plurality of photoelectric modules, plurality of the first cover plates, and plurality of the second cover plates. The second brackets are disposed between the adjacent first brackets and disposed on the extended structures on both sides of the first brackets. The photoelectric modules are disposed on the first brackets and the second brackets, and the first cover plates and the second cover plates are respectively disposed on the photoelectric modules, and overlap with the first brackets and the second brackets, respectively. The first brackets, the second brackets, the first cover plates and the second cover plates have two joint portions on one side of the adjacent photoelectric module, and the plurality of connectors are used to connect the photoelectric modules and the two joint portions. A buffer member is disposed between adjacent first brackets to connect the water guiding groove between the two joint portions of the first bracket.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:太陽能支架系統</p>  
        <p type="p">10:第一支架</p>  
        <p type="p">101:接合部</p>  
        <p type="p">102:第一導水槽</p>  
        <p type="p">103:第一延伸結構</p>  
        <p type="p">104:第二導水槽</p>  
        <p type="p">1021:第二延伸結構</p>  
        <p type="p">20:第二支架</p>  
        <p type="p">203:間隙</p>  
        <p type="p">40:光電模組</p>  
        <p type="p">50:第一蓋板</p>  
        <p type="p">501:接合部</p>  
        <p type="p">70:連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="495" publication-number="202611156"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611156.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611156</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134819</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含廢膠粒熱塑性聚氨酯發泡體、其黏著劑組合物與方法</chinese-title>  
        <english-title>THERMOPLASTIC POLYURETHANE FOAM CONTAINING WASTE POLYMER PARTICLES, ADHESIVE COMPOSITION AND METHODS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">C08G18/10</main-classification>  
        <further-classification edition="200601120240927B">C08G18/28</further-classification>  
        <further-classification edition="200601120240927B">C08G18/66</further-classification>  
        <further-classification edition="200601120240927B">C08J9/06</further-classification>  
        <further-classification edition="200601120240927B">C08L75/04</further-classification>  
        <further-classification edition="200601120240927B">C09J175/04</further-classification>  
        <further-classification edition="200601120240927B">C08J11/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三晃股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNKO INK CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃沂榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃亭凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TING-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳蓉慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種含廢膠粒之熱塑性聚氨酯發泡體及其製造方法，該製造方法包含：提供一A劑，該A劑包含一預聚體，該預聚體之NCO範圍為該預聚體之總重量的10wt%至21wt%；提供一B劑，該B劑包含聚醚多元醇、擴鏈劑與催化劑；提供該廢膠粒，該廢膠粒之尺寸範圍為0.4mm至2mm；將該A劑與該B劑混合形成一黏著劑之後，再將該廢膠粉接觸該黏著劑以形成一混合物；使該混合物發泡成型以獲得該熱塑性聚氨酯發泡體。本發明也包含A劑與B劑所組成的黏著劑組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a thermoplastic polyurethane foam containing waste polymer particles and its manufacturing method. The manufacturing method includes: providing an Agent A, the Agent A containing a prepolymer with an NCO range of 10 wt% to 21 wt% based on the total weight of the prepolymer; providing an Agent B, which contains polyether polyol, a chain extender, and catalyst; providing the waste polymer particles, with a size range of 0.4 mm to 2 mm; forming an adhesive by mixing the Agent A and the Agent B, then allow the waste polymer particles to contact the adhesive to form a mixture; and foaming the mixture to obtain the thermoplastic polyurethane foam. The present invention also includes a thermoplastic polyurethane adhesive composition comprising the Agent A and the Agent B.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="496" publication-number="202611876"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611876.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611876</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134824</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像稽核方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241007B">G06V20/62</main-classification>  
        <further-classification edition="202301120241007B">G06Q10/10</further-classification>  
        <further-classification edition="202301120241007B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑克商業自動化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>嘉義市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃秀鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像稽核方法，藉由一儲存有多筆待稽核資料的電腦裝置來實施，每一筆待稽核資料包含一對應一待稽核物件的原始影像資料，並包含：(A) 根據該等原始影像資料分別對應的多筆圖片寬高資訊，統計出每一圖片寬高資訊的一出現次數；(B) 自該等原始影像資料分別對應的該等圖片寬高資訊中，獲得一對應有最多之該出現次數的目標圖片寬高資訊；(C) 對於每一原始影像資料所對應的影像，根據該目標圖片寬高資訊，調整該原始影像資料所對應的影像之寬高，以獲得調整後的該原始影像資料；(D) 根據每一調整後的原始影像資料，獲得至少一影像稽核結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S106:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="497" publication-number="202611383"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611383.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611383</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134841</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陽台修繕工作台</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241031B">E04G23/02</main-classification>  
        <further-classification edition="200601120241031B">E04G1/15</further-classification>  
        <further-classification edition="200601120241031B">E04G3/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王煦凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSU-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王煦凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSU-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林時猛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>嘉義市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種陽台修繕工作台，尤指一種可吊掛在陽台結構體外部的修繕工作台，其主體架構為一承載斗，在該承載斗上設有可活動調整長度的掛勾桿，及可貼接於外牆面橫向位移的導輪組；如上設計，可運用於各種不同類型的陽台結構體修繕施作，係利用該承載斗主體承接修繕施工過程所拆卸的廢棄物，達到防止廢棄物掉落砸傷行人的安全問題。另外，值得說明的是本發明工作台採用輕量化材質設計，且可拆卸掛勾桿及導輪組，利於施工人員拆裝與搬運，並有效降低成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:承載斗</p>  
        <p type="p">11:主板</p>  
        <p type="p">111:鎖固孔</p>  
        <p type="p">112:第一擴孔部</p>  
        <p type="p">12:側板</p>  
        <p type="p">121:調整槽孔</p>  
        <p type="p">122:第二擴孔部</p>  
        <p type="p">13:底板</p>  
        <p type="p">131:突出部</p>  
        <p type="p">14:容置空間</p>  
        <p type="p">15:第一吊孔</p>  
        <p type="p">2:掛勾桿</p>  
        <p type="p">21:勾部</p>  
        <p type="p">22:長槽</p>  
        <p type="p">23:第一螺固件</p>  
        <p type="p">24:補強桿</p>  
        <p type="p">25:第二吊孔</p>  
        <p type="p">3:導輪組</p>  
        <p type="p">31:第二螺固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="498" publication-number="202612209"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612209.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612209</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134854</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池充電放電系統及其充電測試方法與放電測試方法</chinese-title>  
        <english-title>BATTERY CHARGING AND DISCHARGING SYSTEM, CHARGING TEST METHOD AND DISCHARGING TEST METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H02J7/32</main-classification>  
        <further-classification edition="201601120241202B">H02J7/02</further-classification>  
        <further-classification edition="202001120241202B">G01R31/36</further-classification>  
        <further-classification edition="200601120241202B">H01M10/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致茂電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHROMA ATE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, BO-RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭琨懷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHENG, KUN-HUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉利偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池充電放電系統，包含雙向電源供應器以及旁路模組。雙向電源供應器在充電操作下提供充電電流以對電池充電。旁路模組包含並聯的第一電流路徑與第二電流路徑。第一電流路徑包含第一電阻單元與耦接第一電阻單元的該電池，第二電流路徑包含的第二電阻單元。充電電流為流經第一電流路徑的第一充電電流與流經第二電流路徑的第二充電電流之總和。第一電阻單元和第二電阻單元的阻抗經調整分別逐漸增加和逐漸降低，使得第一充電電流的電流值從第一電流值逐漸變成零，同時第二充電電流的電流值從零逐漸變成第二電流值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery charging and discharging system includes a bidirectional power supply and a bypass module. The bidirectional power supply provides a charge current to charge a battery in a charge operation. The bypass module includes a first current path and a second current path that are parallel to each other. The first current path includes a first resistor unit and the battery coupled to the first resistor unit. The second current path includes a second resistor unit. The charge current is a sum of a first charge current flowing through the first current path and a second charge current flowing through the second current path. Impedances of the first resistor unit and the second resistor unit are adjusted to gradually increase and to decrease respectively, so that a current value of the first charge current gradually changes from a first current value to zero and a current value of the second charge current gradually changes from zero to a second current value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電池充電放電系統的充電測試方法</p>  
        <p type="p">S201-S202:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="499" publication-number="202612432"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612432.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612432</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134857</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及散熱組件</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND HEAT DISSIPATION ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H05K7/20</main-classification>  
        <further-classification edition="200601120241101B">H05K5/02</further-classification>  
        <further-classification edition="200601120241101B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林日隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIH LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊遠章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YUAN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包含一機殼以及一散熱組件。散熱組件包含一第一電路板、一第二電路板、至少一熱源以及一散熱器。第一電路板與第二電路板分層設置於機殼內。第一電路板具有至少一導熱部。至少一熱源設置於第二電路板。至少一熱源位於第二電路板與第一電路板之間。散熱器設置於機殼內，並包含一導熱底座以及一鰭片部。鰭片部連接於導熱底座之一側。導熱底座與至少一熱源分別熱耦合於至少一導熱部之相對兩側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a casing and a heat dissipation assembly. The heat dissipation assembly includes a first circuit board, a second circuit board, at least one heat source and a heat sink. The first circuit board and the second circuit board are arranged in layers in the casing. The first circuit board has at least one thermally conductive portion. The at least one heat source is disposed on the second circuit board. The at least one heat source is located between the second circuit board and the first circuit board. The heat sink is disposed in the casing, and includes a thermally conductive base and a fin portion. The fin portion is connected to a side of the thermally conductive base. The thermally conductive base and the at least one heat source are thermally coupled to opposite sides of the at least one thermally conductive portion, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:散熱組件</p>  
        <p type="p">121:第一電路板</p>  
        <p type="p">1211:導熱部</p>  
        <p type="p">122:第二電路板</p>  
        <p type="p">123:熱源</p>  
        <p type="p">124:散熱器</p>  
        <p type="p">1241:導熱底座</p>  
        <p type="p">1242:鰭片部</p>  
        <p type="p">1243:導熱柱</p>  
        <p type="p">13:第一導熱墊</p>  
        <p type="p">14:第二導熱墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="500" publication-number="202611602"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611602.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611602</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">G02F1/1333</main-classification>  
        <further-classification edition="200601120241129B">G02B6/00</further-classification>  
        <further-classification edition="200601120241129B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林日隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIH LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包含一顯示機體、一導光柱以及一遮光筒。顯示機體包含一外殼、一電路板以及一感光元件。外殼包含一容置殼部。容置殼部具有一透光孔。電路板設置於容置殼部內。感光元件設置於電路板。導光柱介於透光孔與感光元件之間。遮光筒圍繞導光柱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a display body, a light guiding pillar and a light shielding tube. The display body includes a casing, a circuit board and a photosensitive component. The casing includes an accommodating portion. The accommodating portion has a light transmitting hole. The circuit board is disposed in the accommodating portion. The photosensitive component is disposed on the circuit board. The light guiding pillar is located between the light transmitting hole and the photosensitive component. The light shielding tube surrounds the light guiding pillar.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示裝置</p>  
        <p type="p">11:顯示機體</p>  
        <p type="p">111:外殼</p>  
        <p type="p">1111:容置殼部</p>  
        <p type="p">1112:螢幕蓋板</p>  
        <p type="p">112:電路板</p>  
        <p type="p">113:感光元件</p>  
        <p type="p">12:導光柱</p>  
        <p type="p">121:頭部</p>  
        <p type="p">122:身部</p>  
        <p type="p">1221:凸起</p>  
        <p type="p">13:遮光筒</p>  
        <p type="p">131:通道</p>  
        <p type="p">14:顯示螢幕</p>  
        <p type="p">A:透光區</p>  
        <p type="p">B:止擋部</p>  
        <p type="p">D1,D2:間距</p>  
        <p type="p">H1:透光孔</p>  
        <p type="p">H2:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="501" publication-number="202611908"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611908.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611908</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134859</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">G11B33/02</main-classification>  
        <further-classification edition="200601120241105B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇維漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, WEI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JIE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包含一殼體、一第一組裝架、一硬碟支架以及一硬碟背板模組。第一組裝架可拆卸地裝設於殼體內。硬碟支架裝設於殼體內，並具有一硬碟組裝空間。硬碟背板模組包含一第二組裝架、一硬碟背板以及至少一硬碟連接器。第二組裝架可拆卸地裝設於第一組裝架。硬碟背板裝設於第二組裝架。至少一硬碟連接器電性連接於硬碟背板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a casing, a first mounting frame, a hard disk cage and a hard disk backplane module. The first mounting frame is detachably disposed in the casing. The hard disk cage is disposed in the casing, and has a hard disk assembling space. The hard disk backplane module includes a second mounting frame, a hard disk backplane and at least one hard disk connector. The second mounting frame is detachably disposed on the first mounting frame. The hard disk backplane is disposed on the second mounting frame. The at least one hard disk connector is electrically connected to the hard disk backplane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">11:殼體</p>  
        <p type="p">111:側板</p>  
        <p type="p">12:第一組裝架</p>  
        <p type="p">121:第一定位結構</p>  
        <p type="p">122:第三定位結構</p>  
        <p type="p">13:硬碟支架</p>  
        <p type="p">14:硬碟背板模組</p>  
        <p type="p">141:第二組裝架</p>  
        <p type="p">142:硬碟背板</p>  
        <p type="p">143:硬碟連接器</p>  
        <p type="p">144:連接器固定架</p>  
        <p type="p">15:緊固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="502" publication-number="202612219"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612219.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612219</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線充電裝置</chinese-title>  
        <english-title>WIRELESS CHARGING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241202B">H02J50/20</main-classification>  
        <further-classification edition="200601120241202B">H05K7/20</further-classification>  
        <further-classification edition="200601120241202B">H05K7/02</further-classification>  
        <further-classification edition="200601120241202B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭啟成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, CHI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無線充電裝置，用以對一電子裝置進行充電。無線充電裝置包含一機殼、一無線充電模組及一風扇。機殼包含一承載面、一導風凹槽、一第一入風口、一內部空間及一出風口。承載面用以承載電子裝置，導風凹槽自承載面凹陷形成，第一入風口位於導風凹槽內且連通於內部空間，且出風口連通於內部空間。無線充電模組設置於內部空間，且用以對應於電子裝置。風扇設置於機殼且對應於出風口。風扇用以將外部空氣自導風凹槽經第一入風口吸入內部空間，且將內部空間的空氣經出風口吹出無線充電裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless charging device is configured to charge an electronic device. The wireless charging device includes a casing, a wireless charging module and a fan. The casing includes a support surface, a guide recess, a firs air inlet, an interior space and an air outlet. The support surface is configured to support the electronic device. The guide recess is recessed from the support surface. The first air inlet is located in the guide recess and communicates with the interior space, and the air outlet communicates with the interior space. The wireless charging module is disposed in the interior space, and is configured to correspond to the electronic device. The fan is disposed on the casing and corresponds to the air outlet. The fan is configured to suck exterior air into the interior space through the first air inlet from the guide recess, and blow air in the interior space to outside of the wireless charging device through the air outlet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:底座</p>  
        <p type="p">111:底板</p>  
        <p type="p">1111:第一分隔結構</p>  
        <p type="p">1112:第二入風口</p>  
        <p type="p">1113:出風口</p>  
        <p type="p">112:圍牆</p>  
        <p type="p">12:蓋體</p>  
        <p type="p">121:第二分隔結構</p>  
        <p type="p">122:承載面</p>  
        <p type="p">123:導風凹槽</p>  
        <p type="p">1231:第一側</p>  
        <p type="p">1232:第二側</p>  
        <p type="p">1233:第三側</p>  
        <p type="p">1234:第四側</p>  
        <p type="p">124:第一入風口</p>  
        <p type="p">128:支撐凸台</p>  
        <p type="p">129:鏡頭容置槽</p>  
        <p type="p">20:無線充電模組</p>  
        <p type="p">21:電路板</p>  
        <p type="p">22:線圈組件</p>  
        <p type="p">30:風扇</p>  
        <p type="p">40:支撐墊</p>  
        <p type="p">41:第一支撐部</p>  
        <p type="p">42:第二支撐部</p>  
        <p type="p">43:第三支撐部</p>  
        <p type="p">44:導風口</p>  
        <p type="p">TH:通口</p>  
        <p type="p">O:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="503" publication-number="202612134"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612134.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612134</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134861</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子組件</chinese-title>  
        <english-title>ELECTRONIC ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">H01L23/46</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林日隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIH LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子組件包含一第一電路板組件、一第二電路板組件、一散熱鰭片組以及一導熱框。第一電路板組件包含一第一電路板及設置於第一電路板上的一第一熱源。第二電路板組件包含一第二電路板及設置於第二電路板上的一第二熱源。第一電路板與第二電路板相間隔。散熱鰭片組介於第一電路板及第二電路板之間並包含一基座及多個散熱鰭片。散熱鰭片凸出於基座的一側。基座熱耦接於第二熱源。導熱框與散熱鰭片凸出於基座的同一側。導熱框的相對兩側分別熱耦接於基座及第一熱源。導熱框圍繞出至少一散熱通道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic assembly including a first circuit board assembly, a second circuit board assembly, a fin assembly and a conductive loop. The first circuit board assembly includes a first circuit board and a first heat source disposed thereon. The second circuit board assembly includes a second circuit board and a second heat source disposed thereon. The first and second circuit boards are spaced apart from each other with the fin assembly located therebetween. The fin assembly includes a base and fins. The fins protrude from a side of the base. The base is thermally coupled to the second heat source. The conductive loop and the fins protrude from the same side of the base. Opposite sides of the conductive loop are thermally coupled to the base and the first heat source, respectively. The conductive loop forms at least one heat dissipation channel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子組件</p>  
        <p type="p">100:第一電路板組件</p>  
        <p type="p">110:第一電路板</p>  
        <p type="p">120:第一熱源</p>  
        <p type="p">200:第二電路板組件</p>  
        <p type="p">210:第二電路板</p>  
        <p type="p">220:第二熱源</p>  
        <p type="p">300:散熱鰭片組</p>  
        <p type="p">310:基座</p>  
        <p type="p">311:底板</p>  
        <p type="p">312:側板</p>  
        <p type="p">320:散熱鰭片</p>  
        <p type="p">330:導熱凸塊</p>  
        <p type="p">400:密封墊</p>  
        <p type="p">500:導熱框</p>  
        <p type="p">540:散熱通道</p>  
        <p type="p">550:分隔板</p>  
        <p type="p">600:螺絲</p>  
        <p type="p">700:風扇</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="504" publication-number="202612433"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612433.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612433</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134862</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子組件</chinese-title>  
        <english-title>ELECTRONIC ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">H05K7/20</main-classification>  
        <further-classification edition="200601120240926B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林日隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIH LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子組件包含一第一電路板組件、一第二電路板組件以及一散熱鰭片組。第一電路板組件包含一第一電路板及設置於第一電路板上的一第一熱源。第二電路板組件包含一第二電路板及設置於第二電路板上的一第二熱源。第一電路板與第二電路板相間隔。散熱鰭片組介於第一電路板及第二電路板之間並包含一基座部、多個鰭片部及一導熱罩部。基座部具有一破孔。鰭片部及導熱罩部凸出於基座部的同一側。導熱罩部遮蔽破孔而圍繞出與破孔相連通的至少一散熱通道。基座部熱耦接於第二熱源，且導熱罩部的相對兩側分別熱耦接於基座部及第一熱源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic assembly including a first circuit board assembly, a second circuit board assembly and a fin assembly. The first circuit board assembly includes a first circuit board and a first heat source disposed thereon. The second circuit board assembly includes a second circuit board and a second heat source disposed thereon. The first and second circuit boards are spaced apart from each other with the fin assembly therebetween. The fin assembly includes a base part, fin parts and a conductive cover part. The base part has a hole. The fin parts and the conductive cover part protrude from the same side of the base part. The conductive cover part covers the hole and forms at least one heat dissipation channel connected to the hole. The base part is thermally coupled to the second heat source, and two opposite sides of the conductive cover part are thermally coupled to the base part and the first heat source, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:第一電路板</p>  
        <p type="p">120:第一熱源</p>  
        <p type="p">311:底板</p>  
        <p type="p">3110:破孔</p>  
        <p type="p">320:鰭片部</p>  
        <p type="p">330:導熱罩部</p>  
        <p type="p">331:第一熱耦接面</p>  
        <p type="p">332:第二熱耦接面</p>  
        <p type="p">333:通風面</p>  
        <p type="p">334:散熱通道</p>  
        <p type="p">335:分隔板</p>  
        <p type="p">500:擋風薄膜</p>  
        <p type="p">A:排列方向</p>  
        <p type="p">P:凸出方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="505" publication-number="202610751"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610751.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610751</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134865</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射加工系統及方法</chinese-title>  
        <english-title>LASER PROCESSING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241204B">B23K26/082</main-classification>  
        <further-classification edition="201401120241204B">B23K26/352</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李益志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王嘉右</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIA-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭樵陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIAO-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡家瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳顯佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷射加工系統及方法，用於對一晶圓進行表面處理。雷射加工系統包含脈衝雷射裝置、空間光學調變器、掃描鏡組、光學感測元件及運算裝置。空間光學調變器設置於脈衝雷射裝置的輸出路徑，用於產生一繞射圖案以調變雷射光束於晶圓表面形成的一光斑形狀。掃描鏡組用於受控以一掃描角度導引雷射光束的光斑形狀沿著晶圓表面的加工區域內的加工軌跡進行加工。光學感測元件用於取得來自加工區域的回饋光訊號以產生一影像。運算裝置用於根據所述影像的色度資料控制空間光學調變器產生所述繞射圖案並控制所述掃描鏡組以所述掃描角度進行掃描。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser processing system and method, configured to perform surface treatment of a wafer. The laser processing system includes a pulse laser device, a spatial optical modulator, a scanning mirror set, an optical sensing element and a computing device. The spatial optical modulator is disposed at the output path of the pulse laser device and is configured to generate a diffraction pattern to modulate a beam spot formed by the laser beam on the wafer surface. The scanning mirror set is configured to be controlled to guide the beam spot of the laser beam according to a scanning angle for processing along the processing trajectory in the processing area of ​​the wafer surface. The optical sensing element is configured to obtain a feedback light signal from the processing area to generate an image. The computing device is configured to control the spatial optical modulator to generate the diffraction pattern and control the scanning mirror set to scan according to the scanning angle according to the chromaticity data of the image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雷射加工系統</p>  
        <p type="p">11:脈衝雷射裝置</p>  
        <p type="p">12:空間光學調變器</p>  
        <p type="p">13:掃描鏡組</p>  
        <p type="p">14:光學感測元件</p>  
        <p type="p">15:運算裝置</p>  
        <p type="p">L:雷射光束</p>  
        <p type="p">F:回饋光訊號</p>  
        <p type="p">2:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="506" publication-number="202610716"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610716.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610716</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134877</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳酸氣之分離裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250121B">B01D53/62</main-classification>  
        <further-classification edition="200601120250121B">B01D53/75</further-classification>  
        <further-classification edition="200601120250121B">B01D53/76</further-classification>  
        <further-classification edition="200601120250121B">B01D53/77</further-classification>  
        <further-classification edition="200601120250121B">B01D53/96</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商奈米霧科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANOMIST TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松浦一雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUURA, KAZUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可使用鹼水高效地將碳酸氣自排氣分離，且削減用於產生鹼水之溶質之消耗量，降低運轉成本。碳酸氣之分離裝置具備：蒸氣產生部，其將鹼水加熱至沸點以上而產生鹼水蒸氣；混合部，其將鹼水蒸氣與排氣混合成為蒸氣混合排氣；冷卻部，其將蒸氣混合排氣冷卻，成為包含鹼水蒸氣吸收碳酸氣而凝結成之碳酸氣之吸收霧氣之含霧排氣；回收水分離部，其自含霧排氣中回收碳酸氣之吸收霧氣作為回收水；汽化部，其將回收水加熱汽化，成為包含碳酸氣與鹼水蒸氣之混合氣體；氣體分離部，其以氣體分離膜過濾混合氣體，將碳酸氣與鹼水之溶質氣體分離；及溶質混合部，其將鹼水之溶質氣體溶解於水而成為鹼水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:蒸氣產生部</p>  
        <p type="p">2:混合部</p>  
        <p type="p">3:冷卻部</p>  
        <p type="p">4:回收水分離部</p>  
        <p type="p">5:汽化部</p>  
        <p type="p">6:氣體分離部</p>  
        <p type="p">7:溶質混合部</p>  
        <p type="p">8:前處理部</p>  
        <p type="p">9:鹼水</p>  
        <p type="p">10:鹼水蒸氣</p>  
        <p type="p">14:噴嘴</p>  
        <p type="p">20:蒸氣混合排氣</p>  
        <p type="p">30:含霧排氣</p>  
        <p type="p">31:熱交換器</p>  
        <p type="p">40:吸收霧氣</p>  
        <p type="p">41:回收水</p>  
        <p type="p">42:旋風分離器</p>  
        <p type="p">50:混合氣體</p>  
        <p type="p">51:熱交換器</p>  
        <p type="p">60:溶質氣體</p>  
        <p type="p">61:氣體分離膜</p>  
        <p type="p">62:封閉腔室</p>  
        <p type="p">63:流入腔室</p>  
        <p type="p">64:排出腔室</p>  
        <p type="p">65:加壓泵</p>  
        <p type="p">66:壓力控制閥</p>  
        <p type="p">80:凝結水</p>  
        <p type="p">81:排氣熱交換器</p>  
        <p type="p">82:氣液分離機</p>  
        <p type="p">83:旋風分離器</p>  
        <p type="p">84:放熱葉片</p>  
        <p type="p">90:設備</p>  
        <p type="p">91:發電廠</p>  
        <p type="p">92:發電機</p>  
        <p type="p">93:蒸氣渦輪機</p>  
        <p type="p">94:凝結器</p>  
        <p type="p">95:鍋爐</p>  
        <p type="p">96:海水用之熱交換器</p>  
        <p type="p">97:鹼水用之熱交換器</p>  
        <p type="p">100:分離裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="507" publication-number="202611685"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611685.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611685</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134879</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控顯示裝置及其加熱操作方法</chinese-title>  
        <english-title>TOUCH DISPLAY APPARATUS AND HEATING OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">G06F3/041</main-classification>  
        <further-classification edition="200601120241001B">G09F9/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江振豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周郢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種觸控顯示裝置及其加熱操作方法。觸控顯示裝置包括觸控顯示面板、驅動感應電路、以及面板加熱電路。觸控顯示面板具有多個畫素、多個觸控電極及多個加熱器電極。驅動感應電路基於所接收的顯示資料提供多個畫素電壓至這些畫素，並且提供觸控驅動訊號至這些觸控電極。面板加熱電路提供加熱器訊號至加熱器電極。在畫面顯示期間，驅動感應電路提供這些畫素電壓至畫素，並且加熱器訊號的電壓準位高於參考電壓。在觸控感測期間，驅動感應電路提供觸控驅動訊號至觸控電極，並且加熱器訊號的電壓準位低於等於參考電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An touch display apparatus and heating operation method thereof are provided. The touch display apparatus includes a touch display panel, a driving sensing circuit, and a panel heating circuit. The touch display panel has multiple pixels, multiple touch electrodes and multiple heater electrodes. The driving sensing circuit provides multiple pixel voltages to the pixels based on a received display data, and provides touch driving signals to the touch electrodes. The panel heating circuit provides a heater signal to the heater electrodes. During image display, the driving sensing circuit provides the pixel voltages to the pixels, and the voltage level of the heater signal is higher than a reference voltage. During touch sensing, the driving sensing circuit provides the touch driving signals to the touch electrodes, and the voltage level of the heater signal is lower than or equal to the reference voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:觸控顯示裝置</p>  
        <p type="p">110:驅動感應電路</p>  
        <p type="p">120:觸控顯示面板</p>  
        <p type="p">130:面板加熱電路</p>  
        <p type="p">DATAdp:顯示資料</p>  
        <p type="p">EHano:陽極加熱器電極</p>  
        <p type="p">EHcath1、EHcath2:陰極加熱器電極</p>  
        <p type="p">LEht:加熱器電極</p>  
        <p type="p">LEtp:觸控電極</p>  
        <p type="p">PX:畫素</p>  
        <p type="p">SHEano:第一加熱器控制訊號</p>  
        <p type="p">SHEcath:第二加熱器控制訊號</p>  
        <p type="p">SSheater:加熱器電極開關訊號</p>  
        <p type="p">SStouch:觸控電極開關訊號</p>  
        <p type="p">SWh:加熱器開關</p>  
        <p type="p">SWt:觸控開關</p>  
        <p type="p">Vcom:共同電壓</p>  
        <p type="p">Vhearter:加熱器訊號</p>  
        <p type="p">Vpixel:畫素電壓</p>  
        <p type="p">Vtouch:觸控驅動訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="508" publication-number="202611598"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611598.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611598</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134882</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>極紫外線或軟X射線輻射束輪廓儀</chinese-title>  
        <english-title>EXTREME ULTRAVIOLET OR SOFT X-RAY RADIATION BEAM PROFILER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">G02B27/18</main-classification>  
        <further-classification edition="200601120241231B">G01N21/64</further-classification>  
        <further-classification edition="201801120241231B">G01N23/04</further-classification>  
        <further-classification edition="200601120241231B">C09K11/65</further-classification>  
        <further-classification edition="201701120241231B">C01B32/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中央研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACADEMIA SINICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張煥正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUAN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊騰毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TENG-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許遠揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUI, YUEN YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何鎮宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種用於極紫外線(EUV)或軟X射線(SXR)輻射之射束輪廓儀，其包含閃爍體及經組態以捕捉由該閃爍體產生之螢光影像的成像系統。該閃爍體包括基板及安置於該基板上方之閃爍體層。該閃爍體層包含一或多個螢光氮空缺鑽石且具有約1至3.5 g/cm &lt;sup&gt;3&lt;/sup&gt;之密度。此創新設計使得能夠進行EUV或SXR輻射之精確量測及輪廓分析，從而提供用於科學研究及工業過程中之各種應用的高靈敏度及空間解析度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a beam profiler for extreme ultraviolet (EUV) or soft X-ray (SXR) radiation, comprising a scintillator and an imaging system configured to capture a fluorescence image generated by the scintillator. The scintillator includes a substrate and a scintillator layer disposed over the substrate. The scintillator layer comprises one or more fluorescent nitrogen-vacancy diamonds and has a density of about 1 to 3.5 g/cm &lt;sup&gt;3&lt;/sup&gt;. This innovative design enables precise measurement and profiling of EUV or SXR radiation, offering high sensitivity and spatial resolution for various applications in scientific research and industrial processes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:閃爍體</p>  
        <p type="p">11:閃爍體</p>  
        <p type="p">20:射束輪廓儀</p>  
        <p type="p">210:成像系統</p>  
        <p type="p">301:輻射</p>  
        <p type="p">302:輻射</p>  
        <p type="p">310:螢光影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="509" publication-number="202611680"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611680.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611680</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134887</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具動態光源裝置的電子裝置及與其相關的控制方法和電腦程式產品</chinese-title>  
        <english-title>ELECTRONIC DEVICE HAVING DYNAMIC LIGHTING DEVICE AND ASSOCIATED CONTROL METHOD AND COMPUTER PROGRAM PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G06F3/01</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉書瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SHU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種包含動態光源裝置的電子裝置及與其相關的控制方法和電腦程式產品。電子裝置包含：動態光源裝置與控制電路。控制電路執行光源設定介面。光源設定介面因應啟用觸發條件與停用觸發條件其中之一者的成立而產生燈效設定信號。動態光源裝置電連接於控制電路。動態光源裝置因應燈效設定信號而改變燈效。在第一步階維持期間，動態光源裝置根據燈效設定信號的控制而產生第一燈效。在第二步階維持期間，動態光源裝置根據燈效設定信號的控制而產生第二燈效。第一步階維持期間早於第二步階維持期間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device, an associated control method, and computer program product are provided. The electronic device includes a dynamic lighting device and a control circuit. The control circuit executes a light-setting interface. The light setting interface generates a lighting-effect setting signal when an activated trigger condition or a suspending trigger condition is satisfied. The dynamic lighting device is electrically connected to the control circuit. The dynamic lighting device changes its lighting effect in response to the lighting-effect setting signal. During a first step duration, the dynamic lighting device is controlled by the lighting-effect signal to generate a first lighting effect. During a second step duration, the dynamic lighting device is controlled by the lighting-effect signal to generate a second lighting effect. The first step duration is earlier than the second step duration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">STA1:參數查詢狀態</p>  
        <p type="p">STA2:參數轉換計算狀態</p>  
        <p type="p">STA3:參數排序狀態</p>  
        <p type="p">STA4:待機狀態</p>  
        <p type="p">STA5:持續使用狀態</p>  
        <p type="p">STA6:漸進式熄滅狀態</p>  
        <p type="p">STA7:漸進式發光狀態</p>  
        <p type="p">STA8:關機狀態</p>  
        <p type="p">STA9:確認既存資料狀態</p>  
        <p type="p">AR1a,AR1b,AR2,AR3a,AR3b,AR4a,AR4b,AR4c,AR5a,AR5b,AR5c,AR6,AR7,AR8,AR9a,AR9b,AR9c,AR9d:箭頭方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="510" publication-number="202610753"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610753.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610753</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134900</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於表面加工的雷射裝置及其操作方法</chinese-title>  
        <english-title>LASER DEVICE FOR SURFACE PROCESSING AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250417B">B23K26/352</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華精測科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA PRECISION TEST TECH. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張中鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHONGMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳伯群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊倬昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於表面加工的雷射裝置及其操作方法，雷射裝置包括一振盪器、一光束整形器、一掃描模組、一平台單元及一處理器，利用光束整形器將雷射光束轉換成平頂光束輸出至加工物件，非接觸式的雷射加工能夠有效取代習知將工件進行研磨的技術。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser device for surface processing and an operating method thereof are provided. The laser device comprises an oscillator, a beam shaper, a scanning module, a platform unit, and a processor. The beam shaper is used to convert a laser beam into a flat-top beam and output the flat-top beam to a workpiece. Non-contact laser processing can effectively replace the conventional grinding technology of workpieces.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:振盪器</p>  
        <p type="p">3:光束整形器</p>  
        <p type="p">4:掃描模組</p>  
        <p type="p">5:平台單元</p>  
        <p type="p">51:平台</p>  
        <p type="p">52:位置偵測器</p>  
        <p type="p">53:平台驅動器</p>  
        <p type="p">6:處理器</p>  
        <p type="p">7:分束器</p>  
        <p type="p">8:光束診斷器</p>  
        <p type="p">L1、L2:光路單元</p>  
        <p type="p">B、B1、B2:路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="511" publication-number="202612265"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612265.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612265</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其屬性匹配方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND AN ATTRIBUTE MATCHING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H03H7/38</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鯨鏈科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHALECHIP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>台北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡至鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置及其屬性匹配方法。半導體裝置包括頻率可變元件、匹配控制單元及匹配調整電路。匹配控制單元與頻率可變元件連接，用以檢測頻率可變元件的雜訊電壓。匹配調整電路頻率可變元件以及匹配控制單元連接。其中，匹配控制單元基於頻率可變元件的雜訊電壓動態地調整匹配調整電路的屬性，以相應的改變半導體裝置的屬性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is related to a semiconductor device and an attribute matching method thereof. The semiconductor device includes a frequency variable element, a matching control unit, and a matching adjustment circuit. The matching control unit is connected to the frequency variable element and used to detect the noise voltage of the frequency variable element. The matching adjustment circuit is connected to the frequency variable element and the matching control unit. The matching control unit dynamically adjusts the attribute of the matching adjustment circuit based on the noise voltage of the frequency variable element. Thus, the attribute of the semiconductor device is changed accordingly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">111:頻率可變元件</p>  
        <p type="p">121:匹配調整電路</p>  
        <p type="p">130:匹配控制單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="512" publication-number="202612513"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612513.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612513</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134903</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調的金氧半電容元件及其半導體裝置</chinese-title>  
        <english-title>ADJUSTABLE MOS CAPACITOR ELEMENT AND A SEMICONDUCTOR DEVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D48/00</main-classification>  
        <further-classification edition="200601120250102B">H01G7/00</further-classification>  
        <further-classification edition="200601120250102B">H03H7/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鯨鏈科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHALECHIP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>台北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　惠禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, HUEY-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可調的金氧半電容元件及其半導體裝置。金氧半電容元件包括一閘極端、一源極端、一汲極端及一基底端。該閘極端接收一閘極電壓。該源極端接收一接地電壓。該汲極端與該源極端電性連接，接收該接地電壓。該基底端接收一控制電壓，該控制電壓與該接地電壓不相同。其中，該金氧半電容元件的一電容值相應於該控制電壓而改變。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adjustable MOS capacitor element and a semiconductor device thereof. The MOS capacitor element includes a gate terminal, a source terminal, a drain terminal and a body terminal. The gate terminal is connected a gate voltage. The source terminal and the drain terminal are shorted to ground. The body terminal is connected to a control voltage which is different from the ground voltage. Wherein, the capacitance value of the MOS capacitor element changes corresponding to the control voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:金氧半電容元件</p>  
        <p type="p">GND:接地電壓</p>  
        <p type="p">B:基底端</p>  
        <p type="p">D:汲極端</p>  
        <p type="p">G:閘極端</p>  
        <p type="p">S:源極端</p>  
        <p type="p">V&lt;sub&gt;G&lt;/sub&gt;:閘極電壓</p>  
        <p type="p">V&lt;sub&gt;B&lt;/sub&gt;:控制電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="513" publication-number="202611846"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611846.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611846</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134905</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有套版的物件資料格式的轉換裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250102B">G06Q50/02</main-classification>  
        <further-classification edition="201901120250102B">G06F16/955</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信義房屋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種具有套版的物件資料格式的轉換裝置，其包含資料套板庫、物件資料庫、平台資料庫、產出模組、資料格式轉換模組。資料格式轉換模組取得欲轉換的平台索引碼、該物件索引碼及其該物件特徵、以及該資料套板索引碼及其該可變動物件資料，而輸出相對該平台資料格式的物件資料，並由資料格式轉換模組將該物件資料中每項物件描述轉換為對應於該物件之物件資料。其中，該可變動物件資料包含物件與實體位置之間的該距離資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:具有套版的物件資料格式的轉換裝置</p>  
        <p type="p">2:資料套板庫</p>  
        <p type="p">4:資料格式轉換模組</p>  
        <p type="p">12:產出模組</p>  
        <p type="p">105:物件資料庫</p>  
        <p type="p">107:平台資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="514" publication-number="202611852"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611852.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611852</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134906</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>商圈範圍適宜性的評估裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250109B">G06Q50/16</main-classification>  
        <further-classification edition="202301120250109B">G06Q30/0202</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信義房屋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種商圈範圍適宜性的評估裝置，包括資料庫、分析模組、地圖模組及傳送模組，並依據該商圈範獲得落在範圍內的物件，而基於第一預定數量的物件之該物件資訊，獲得包含所選定與所調整後的該分店責任範圍之商圈範圍變化度，最後透過傳送模組讓使用者的使用者裝置得以顯示該商圈範圍變化度。其中，商圈範圍變化度採用地圖呈現時，依據物件的物件位置資訊，每個物件被該標示在地圖上，同時依據性質類別中第一性質、該第二性質，使得商圈範圍變化度中的物件帶有第一性質、第二性質相對的標示手段，而不需要重新選擇分店責任範圍，重新計算落入該分店責任範圍中的物件。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:使用者裝置</p>  
        <p type="p">101:使用者介面</p>  
        <p type="p">20:傳送裝置</p>  
        <p type="p">201a、201b:資料庫</p>  
        <p type="p">202:分析模組</p>  
        <p type="p">203:地圖模組</p>  
        <p type="p">204:傳送模組</p>  
        <p type="p">205:抓取資料模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="515" publication-number="202611853"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611853.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611853</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134908</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分析照片的權重性估價裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241031B">G06Q50/16</main-classification>  
        <further-classification edition="201301120241031B">G06F3/048</further-classification>  
        <further-classification edition="201801120241031B">G06F8/34</further-classification>  
        <further-classification edition="202001120241031B">G06F30/12</further-classification>  
        <further-classification edition="201901120241031B">G06F16/44</further-classification>  
        <further-classification edition="201901120241031B">G06F16/54</further-classification>  
        <further-classification edition="202201120241031B">G06V30/413</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信義房屋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊國昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種分析照片的權重性估價裝置，該分析照片的權重性估價裝置包含資料庫、分析模組、估價模組以及傳輸模組。該資料庫儲存複數個不動產資訊，其中各該不動產資訊包括至少物件屬性，該物件屬性中包含房價影響率、位置資訊、交易價格、複數個估價回饋以及相對於估價回饋之一回饋可信度；當使用者按下查詢按鈕之後，分析模組所分析的特定不動產資訊的該位置資訊、以及系統指定且隱藏性的搜尋條件；估價模組則找出與該特定不動產資訊的該位置資訊落在預定距離範圍內，且與該搜尋條件互相符合之複數不動產資訊，而產生包含特定數量的複數不動產資訊之估價結果；傳輸模組則可使得使用者端的顯示裝置得以呈現包含該交易價格的該估價結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:分析照片的權重性估價裝置</p>  
        <p type="p">101:使用者端</p>  
        <p type="p">105:資料庫</p>  
        <p type="p">106:複數個不動產資訊</p>  
        <p type="p">120:分析模組</p>  
        <p type="p">130:估價模組</p>  
        <p type="p">130:傳輸模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="516" publication-number="202610851"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610851.zip"/>
    </tif-files>
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      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610851</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134910</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳纖維輻條防鬆脫結構改良</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">B60B1/04</main-classification>  
        <further-classification edition="200601120240930B">B60B1/06</further-classification>  
        <further-classification edition="200601120240930B">B60B21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中南金記工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱宏昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林邦棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種碳纖維輻條防鬆脫結構改良，包括有一帽頭件與一碳纖維輻條，其主要是先將碳纖維輻條之套接部由帽頭件之導引通道進入至帽頭件之容置空間內，接續再將碳纖維輻條進行旋轉，以使碳纖維輻條二對應之斜部對應於帽頭件之二抵止部上，而由於碳纖維輻條之二斜部受到二抵止部之限制與抵迫，因此使碳纖維輻條之套接部置於帽頭件之容置空間內而固定且不脫離，藉此即可避免帽頭件與碳纖維輻條二者鬆脫之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:帽頭件</p>  
        <p type="p">11:凹部</p>  
        <p type="p">2:碳纖維輻條</p>  
        <p type="p">21:套接部</p>  
        <p type="p">211:窄邊</p>  
        <p type="p">212:寬邊</p>  
        <p type="p">22:斜部</p>  
        <p type="p">23:黏著層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="517" publication-number="202611854"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611854.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611854</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134911</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具得撤銷之補位機制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241024B">G06Q50/16</main-classification>  
        <further-classification edition="202301120241024B">G06Q30/015</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信義房屋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程紹幃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁漢頤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奕棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具得撤銷之補位機制裝置，包含一通訊單元、一記憶單元，及一處理單元。該記憶單元存有多個服務據點所對應的根據路廓劃分出來的服務範圍。該處理單元在藉由該通訊單元接收到來自客戶端裝置的被擱置客戶所提供的地理位置之後，根據被擱置客戶產生目標區域，且在判斷出目標區域與多個服務範圍有重疊時，藉由該通訊單元將相關於被擱置客戶的服務需求的通知訊息傳送至對應該等服務範圍所對應的該分店端裝置，且將服務需求分配給最先回覆通知訊息的該分店端裝置。本發明能將來自使用者的服務需求自動分配給較適當。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:具得撤銷之補位機制裝置</p>  
        <p type="p">11:記憶單元</p>  
        <p type="p">12:通訊單元</p>  
        <p type="p">13:處理單元</p>  
        <p type="p">2:客戶端裝置</p>  
        <p type="p">A~F:服務據點</p>  
        <p type="p">A1~F1:該分店端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="518" publication-number="202611810"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611810.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611810</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134912</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>套殼式聊天裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241127B">G06Q10/10</main-classification>  
        <further-classification edition="201901120241127B">G06F16/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信義房屋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫家政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白濬維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張沛煬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慧如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江佳鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種套殼式聊天裝置包括資料庫、儲存管理模組、互動模組。儲存管理模組經過該通訊模組接收儲存事件(包含該使用者代碼、該對話內容)，以儲存該儲存事件中該使用者代碼所對應的該對話內容。互動模組利用該通訊模組經過該聊天系統的該應用程式介面傳遞顯示資訊，而透過套在該聊天系統的該聊天對話框中的該操作畫面來呈現該顯示資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:套殼式聊天裝置</p>  
        <p type="p">101:資料庫</p>  
        <p type="p">102:通訊模組</p>  
        <p type="p">103:搜尋模組</p>  
        <p type="p">104:互動模組</p>  
        <p type="p">105:訂閱模組</p>  
        <p type="p">106:儲存管理模組</p>  
        <p type="p">107:匯出模組</p>  
        <p type="p">12:使用者設備</p>  
        <p type="p">121:套在該聊天系統的該聊天對話框中的該操作畫面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="519" publication-number="202610641"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610641.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610641</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134913</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物用於製備具有抑制嗜中性球胞外誘捕網之形成功效的保健食品或藥品之用途</chinese-title>  
        <english-title>USE OF CHEMICAL COMPOUNDS FOR MANUFACTURING HEALTH FOOD OR MEDICAMENT FOR INHIBITING NETOSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250417B">A61K31/522</main-classification>  
        <further-classification edition="200601120250417B">A61K31/7048</further-classification>  
        <further-classification edition="200601120250417B">A61K31/37</further-classification>  
        <further-classification edition="200601120250417B">A61P9/00</further-classification>  
        <further-classification edition="200601120250417B">A61P35/00</further-classification>  
        <further-classification edition="200601120250417B">A61P3/00</further-classification>  
        <further-classification edition="200601120250417B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮呂真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUAN LU, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮呂真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUAN LU, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王智彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭小綺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種化合物用於製備具有抑制嗜中性球胞外誘捕網形成 (NETosis)功效的保健食品或藥品，所述化合物包括橙皮苷或前胡素。本發明驗證橙皮苷及前胡素各自皆能達到抑制NETosis形成的功效，並可應用於與NETosis相關的疾病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a use of chemical compounds for the manufacture of health food or medicament for inhibiting the formation of NETs (Neutrophil Extracellular Traps).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="520" publication-number="202611855"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611855.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611855</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134914</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分析照片的權重性估價裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241128B">G06Q50/16</main-classification>  
        <further-classification edition="202301120241128B">G06Q30/02</further-classification>  
        <further-classification edition="201901120241128B">G06F16/53</further-classification>  
        <further-classification edition="202201120241128B">G06V30/413</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信義房屋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊國昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種分析照片的權重性估價裝置，該分析照片的權重性估價裝置包含資料庫、分析模組、估價模組以及傳輸模組。該資料庫儲存複數個不動產資訊，其中各該不動產資訊包括至少物件屬性，該物件屬性中包含房價影響率、位置資訊、交易價格、複數個估價回饋以及相對於估價回饋之一回饋可信度；當使用者按下查詢按鈕之後，分析模組所分析的特定不動產資訊的該位置資訊、以及系統指定且隱藏性的搜尋條件；估價模組則找出與該特定不動產資訊的該位置資訊落在預定距離範圍內，且與該搜尋條件互相符合之複數不動產資訊，而產生包含特定數量的複數不動產資訊之估價結果；傳輸模組則可使得使用者端的顯示裝置得以呈現包含該交易價格的該估價結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:分析照片的權重性估價裝置</p>  
        <p type="p">101:使用者端</p>  
        <p type="p">105:資料庫</p>  
        <p type="p">106:複數個不動產資訊</p>  
        <p type="p">120:分析模組</p>  
        <p type="p">130:估價模組</p>  
        <p type="p">130:傳輸模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="521" publication-number="202611856"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611856.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611856</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134916</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>擴大評估範圍的高潛力物件的分析裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241129B">G06Q50/16</main-classification>  
        <further-classification edition="202301120241129B">G06Q30/02</further-classification>  
        <further-classification edition="202301120241129B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信義房屋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種擴大評估範圍的高潛力物件的分析裝置，包括資料庫、一分析模組、計算模組及傳送模組，其中該成交物件資料庫儲存多個物件的一物件位置資訊以及一物件資訊，該分析模組依據該實價登錄物件中多個物件的流通天數，計算出一好賣物件群，最後透過傳送模組讓使用者的使用者裝置得以顯示該好賣物件群。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:使用者裝置</p>  
        <p type="p">101:使用者介面</p>  
        <p type="p">20:分析裝置</p>  
        <p type="p">201a、201b、201c:資料庫</p>  
        <p type="p">202:分析模組</p>  
        <p type="p">203:計算模組</p>  
        <p type="p">204:傳送模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="522" publication-number="202611857"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611857.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611857</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>納入外部資料源的高潛力物件的分析裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241130B">G06Q50/16</main-classification>  
        <further-classification edition="202401120241130B">G06Q50/163</further-classification>  
        <further-classification edition="202301120241130B">G06Q30/00</further-classification>  
        <further-classification edition="202301120241130B">G06Q10/063</further-classification>  
        <further-classification edition="201901120241130B">G06F16/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信義房屋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種納入外部資料源的高潛力物件的分析裝置，包括資料庫、一分析模組、計算模組及傳送模組，其中該物件資料庫儲存多個物件的一物件位置資訊以及一物件資訊，該分析模組依據該實價登錄物件中多個物件的流通天數，計算出一好賣物件群，最後透過傳送模組讓使用者的使用者裝置得以顯示該好賣物件群。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:使用者裝置</p>  
        <p type="p">101:使用者介面</p>  
        <p type="p">20:分析裝置</p>  
        <p type="p">201a、201b、201c:資料庫</p>  
        <p type="p">202:分析模組</p>  
        <p type="p">203:計算模組</p>  
        <p type="p">204:傳送模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="523" publication-number="202611750"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611750.zip"/>
    </tif-files>
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      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611750</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134920</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於文生圖的分析裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241210B">G06F16/953</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信義房屋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊國昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種基於文生圖的分析裝置，該基於文生圖的分析裝置包含資料庫、分析模組、分析模組以及傳輸模組。該資料庫儲存複數個不動產資訊，其中各該不動產資訊包括至少物件屬性，該物件屬性中包含房價影響率、位置資訊、交易價格、複數個分析回饋以及相對於分析回饋之一回饋可信度；當使用者按下查詢按鈕之後，分析模組所分析的特定不動產資訊的該位置資訊、以及系統指定且隱藏性的搜尋條件；分析模組則找出與該特定不動產資訊的該位置資訊落在預定距離範圍內，且與該搜尋條件互相符合之複數不動產資訊，而產生包含特定數量的複數不動產資訊之分析結果；傳輸模組則可使得使用者端的顯示裝置得以呈現包含該交易價格的該分析結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:基於文生圖的分析裝置</p>  
        <p type="p">101:使用者端</p>  
        <p type="p">105:資料庫</p>  
        <p type="p">106:複數個不動產資訊</p>  
        <p type="p">130:分析模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="524" publication-number="202611959"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611959.zip"/>
    </tif-files>
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      <volno>24</volno>  
      <isuno>6</isuno>  
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        <document-id> 
          <doc-number>202611959</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134922</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光按鍵</chinese-title>  
        <english-title>ILLUMINATED KEYSWITCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240923B">H01H13/83</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達方電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARFON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游偉彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, WEI-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡才榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, TSAI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種發光按鍵包含鍵帽上蓋、導光片、電路板、複數個微型發光元件、鍵帽下蓋以及底板。鍵帽上蓋具有N個透光區域，其中N係自然數。導光片具有複數個貫孔。電路板包含主板部以及連接部。複數個微型發光元件係電性接合於主板部上。每一個微型發光元件置於其對應的貫孔內。鍵帽上蓋、導光片、主板部、複數個微型發光元件與鍵帽下蓋一起相對於底板於未按壓位置與按壓位置之間移動。複數個微型發光元件被驅動以發射光線從複數個貫孔的入光面射入導光片內，並由導光元件導引從導光元件的上表面射出，進而照射N個透光區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An illuminated keyswitch includes miniature a keycap upper cover, a light-guiding sheet, a circuit board, a plurality of miniature light-emitting devices, a keycap lower cover, and a base plate. The keycap upper cover has N translucent regions where N is a natural number. The light-guiding sheet has a plurality of through holes. The circuit board includes a main board portion and a connection portion. The plurality of miniature light-emitting devices are electrically bonded on the main board portion. Each miniature light-emitting is placed within the corresponding through hole. The keycap upper cover, the light-guiding sheet, the main board portion, the plurality of miniature light-emitting devices and the keycap lower cover together move relative to the base plate between an unpressed position and a pressed position. The plurality of miniature light-emitting devices are driven to emit a light to enter into the light-guiding sheet from the light entry surfaces of the through holes. The entered light is then guided by the light-guiding sheet out of the upper surface of the light-guiding sheet to illuminate the N translucent regions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:發光按鍵</p>  
        <p type="p">10:鍵帽上蓋</p>  
        <p type="p">102:透光區域</p>  
        <p type="p">104:底表面</p>  
        <p type="p">11:導光片</p>  
        <p type="p">110:第一上表面</p>  
        <p type="p">112:第一下表面</p>  
        <p type="p">114:第一貫孔</p>  
        <p type="p">1140:入光面</p>  
        <p type="p">12:第一電路板</p>  
        <p type="p">120:主板部</p>  
        <p type="p">122:連接部</p>  
        <p type="p">13:微型發光元件</p>  
        <p type="p">14:鍵帽下蓋</p>  
        <p type="p">140:第三上表面</p>  
        <p type="p">142:第三下表面</p>  
        <p type="p">15:底板</p>  
        <p type="p">152:承接部份</p>  
        <p type="p">16:第二電路板</p>  
        <p type="p">162:開口</p>  
        <p type="p">17:反光層</p>  
        <p type="p">170:第二上表面</p>  
        <p type="p">172:第二下表面</p>  
        <p type="p">174:第二貫孔</p>  
        <p type="p">18:薄膜開關電路板</p>  
        <p type="p">182:開關</p>  
        <p type="p">184:破孔</p>  
        <p type="p">19:升降機構</p>  
        <p type="p">192:內支臂構件</p>  
        <p type="p">194:外支臂構</p>  
        <p type="p">20:彈性致動器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="525" publication-number="202612301"> 
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      <tif no="1" file="202612301.zip"/>
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    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
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        <document-id> 
          <doc-number>202612301</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於封包錯誤感知閾值ALOHA協定之無線感測網路系統及方法</chinese-title>  
        <english-title>WIRELESS SENSOR NETWORK SYSTEM AND METHOD BASED ON PACKET ERROR-AWARE THRESHOLD ALOHA PROTOCOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H04L1/00</main-classification>  
        <further-classification edition="200901120250102B">H04W84/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立高雄師範大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL KAOHSIUNG NORMAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾秀松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZENG, SHOW-SHIOW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林盈甄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YING-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王聲葦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無線感測網路系統，包含基地台及至少一感測器。基地台配置以接收至少一感測資料封包。至少一感測器配置以收集至少一感測資料，並將此些感測資料封裝成此些感測資料封包，其中每一感測器具有瞬時資訊年齡，並配置以依據封包錯誤感知閾值ALOHA協定在訊框中傳送此些感測資料封包至基地台，封包錯誤感知閾值ALOHA協定關聯於封包錯誤機率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless sensor network system includes a base station and at least one sensor. The base station is configured to receive at least one sensing data packet. The at least one sensor is configured to collect at least one sensing data and package the at least one sensing data into the at least one sensing data packet, wherein each of the at least one sensor has an instantaneous age of information and is configured to transmit the at least one sensing data packet to a base station in a frame based on packet error-aware threshold ALOHA (PEATA) protocol, the packet error-aware threshold ALOHA protocol is associated with a packet error rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:無線感測網路系統</p>  
        <p type="p">120:基地台</p>  
        <p type="p">140:感測器</p>  
        <p type="p">R:通訊範圍</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="526" publication-number="202610909"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610909.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610909</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>置物籃堆疊支撐架結構</chinese-title>  
        <english-title>STORAGE BASKET STACKING SUPPORT FRAME STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">B65D21/02</main-classification>  
        <further-classification edition="200601120240929B">B65D1/38</further-classification>  
        <further-classification edition="200601120240929B">A47G29/00</further-classification>  
        <further-classification edition="200601120240929B">B65D25/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永山實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIRE MASTER INDUSTRY CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭西明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, XIMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林見軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種置物籃堆疊支撐架結構，特別是針對兩個或兩個以上之置物籃的堆疊擺置需求而設計者，所述的堆疊支撐架乃於其盤面一側凹設有一可承托上層置物籃底面轉角部位之撐托槽部，於該撐托槽部的外側緣面置設為一可契合靠置於下層置物籃頂端轉角部位內緣之靠抵面，在該靠抵面配合置物籃的框體內側唇邊而成型有可契合卡制之嵌卡凸塊，而在該盤面底部遠離該靠抵面的一側位置另置設有一限位弧凸體，該限位弧凸體的內凹弧面與該靠抵面的型態與距離恰與置物籃頂部的框體唇緣相符，並且該限位弧凸體的下緣乃延設成型得以扣勾於置物籃框體之勾扣部，據以利用前述限位弧凸體的勾扣部扣勾於置物籃的框體上，配合該靠抵面之嵌卡凸塊卡抵於置物籃框體的內側唇邊，即得將堆疊支撐架穩固地組設於置物籃的轉角部位，經由四個堆疊支撐架的配合，乃得在上層置物架堆疊時，對其底部形成四點式撐托，俾可穩固地維持其堆疊型態，並有效防止其任意滑移，從而賦予極佳之產業利用價值者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a storage basket stacking support frame structure, especially designed to meet the stacking and placement requirements of two or more storage baskets. The stacking support frame is provided with a recessed one on one side of the disk surface. The support groove portion that supports the corner portion of the bottom surface of the upper storage basket is provided on the outer edge of the support groove portion as a supporting surface that can fit against the inner edge of the corner portion of the top of the lower storage basket. The surface of the basket is matched with the inner lip of the frame of the storage basket and is formed with a snap-fitting convex block, and a limiting arc convex body is provided at the bottom of the tray on one side away from the abutment surface. The shape and distance between the concave arc surface of the arc convex body and the abutment surface are exactly consistent with the frame lip on the top of the storage basket, and the lower edge of the limiting arc convex body is extended and shaped to hook into the storage basket. The hooking portion of the frame is used to hook on the frame of the storage basket by using the hooking portion of the limiting arc convex body, and the embedded convex block of the abutment surface is engaged with the inner lip of the storage basket frame. side, that is, the stacking support frame can be firmly assembled at the corner of the storage basket. Through the cooperation of the four stacking support frames, when the upper storage rack is stacked, a four-point support is formed on the bottom to ensure stability. It can effectively maintain its stacked form and effectively prevent it from sliding around, thus giving it excellent industrial application value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(10):堆疊支撐架</p>  
        <p type="p">(11):基體</p>  
        <p type="p">(13):靠抵面</p>  
        <p type="p">(14):嵌卡凸塊</p>  
        <p type="p">(15):限位弧凸體</p>  
        <p type="p">(16):內弧凹面</p>  
        <p type="p">(17):勾扣部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="527" publication-number="202612122"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612122.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612122</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子封裝件及其製法</chinese-title>  
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240924B">H01L23/28</main-classification>  
        <further-classification edition="200601120240924B">H01L23/34</further-classification>  
        <further-classification edition="200601120240924B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高灃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡文榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, WEN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林襄宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SIANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子封裝件及其製法，該電子封裝件包括電子元件、光子元件、第一線路結構、第二線路結構、以及導熱層。該電子元件具有相對之作用面與非作用面。該第一線路結構設於該電子元件與該光子元件之間，且電性連接該電子元件與該光子元件。該第二線路結構電性連接該第一線路結構。該導熱層設於該電子元件之非作用面與該第二線路結構之間，且該第二線路結構透過該導熱層而熱耦接該電子元件，以提高該電子元件運作時之散熱效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic package and a manufacturing method thereof are provided. The electronic package includes an electronic component, a photonic component, a first circuit structure, a second circuit structure, and a heat-conducting layer. The electronic component has an active surface and an inactive surface opposite to the active surface. The first circuit structure is disposed between the electronic component and the photonic component and electrically connected to the electronic component and the photonic component. The second circuit structure is electrically connected to the first circuit structure. The heat-conducting layer is disposed between the inactive surface of the electronic component and the second circuit structure, and the second circuit structure is thermally coupled to the electronic component through the heat-conducting layer, so as to improve the heat dissipation efficiency of the electronic component during operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:電子封裝件</p>  
        <p type="p">21:第一線路結構</p>  
        <p type="p">211:絕緣層</p>  
        <p type="p">212:線路層</p>  
        <p type="p">22:導電柱</p>  
        <p type="p">23:電子元件</p>  
        <p type="p">231:第一導電塊體</p>  
        <p type="p">233:導熱層</p>  
        <p type="p">24:包覆層</p>  
        <p type="p">25:第二線路結構</p>  
        <p type="p">251:絕緣層</p>  
        <p type="p">252:線路層</p>  
        <p type="p">253:散熱區域</p>  
        <p type="p">26:傳導元件</p>  
        <p type="p">261:導電元件</p>  
        <p type="p">262:導熱元件</p>  
        <p type="p">27:光子元件</p>  
        <p type="p">271:第二導電塊體</p>  
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;,D&lt;sub&gt;2&lt;/sub&gt;:尺寸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="528" publication-number="202611950"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611950.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611950</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134928</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電阻器及其製作方法</chinese-title>  
        <english-title>RESISTOR AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H01C1/01</main-classification>  
        <further-classification edition="200601120241105B">H01C17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國巨股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGEO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭勝利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, SHEN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尚尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>N/A, SUNEESH MELEDATH VALIYAVEETTIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李煥文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HWAN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電阻器包含電阻層、第一電極及第二電極。電阻層具有於第一方向上相對的第一側及第二側。第一電極設置於第一側並沿不同於第一方向的第二方向延伸。第二電極設置於第二側並沿第二方向延伸。第一電極的上表面及第二電極的上表面分別具有多個條狀凸起結構，且電阻層包含金屬氧化部，金屬氧化部於第一方向上位於第一電極與第二電極之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resistor includes a resistance layer, a first electrode, a resistance layer and a second electrode. The resistance layer has a first side and a second side opposite to each other in a first direction. The first electrode is disposed on the first side and extends along a second direction different from the first direction. The second electrode is disposed on the second side and extends along the second direction. The upper surface of the first electrode and the upper surface of the second electrode each have multiple strip-shaped protruding structures. The resistance layer includes a metal oxide portion, and the metal oxide portion is located between the first electrode and the second electrode in the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電阻器</p>  
        <p type="p">100:電阻層</p>  
        <p type="p">102:金屬氧化部</p>  
        <p type="p">200:第一電極</p>  
        <p type="p">200S、300S、US:上表面</p>  
        <p type="p">300:第二電極</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">E1:第一側</p>  
        <p type="p">E2:第二側</p>  
        <p type="p">M1、M2:條狀凸起結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="529" publication-number="202612488"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612488.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612488</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134938</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D1/62</main-classification>  
        <further-classification edition="202501120250102B">H10D48/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃莉雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHIH-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡博安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, BO-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鵬澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PENG-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江燁瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YEH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構，包括基底與電容器結構。電容器結構包括第一電極層、第一介電層、第二電極層、第二介電層、第三電極層與第一導電插塞。第一電極層位在基底上。第一介電層位在第一電極層上。第二電極層位在第一介電層上。第二介電層位在第二電極層上。第三電極層位在第二介電層上。第一導電插塞位在第一電極層與第三電極層之間。第一導電插塞電性連接於第一電極層與第三電極層。第一導電插塞的底面直接連接於第一電極層的上表面。第一導電插塞的頂面直接連接於第三電極層的下表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure including a substrate and a capacitor structure is provided. The capacitor structure includes a first electrode layer, a first dielectric layer, a second electrode layer, a second dielectric layer, a third electrode layer, and a first conductive plug. The first electrode layer is located on the substrate. The first dielectric layer is located on the first electrode layer. The second electrode layer is located on the first dielectric layer. The second dielectric layer is located on the second electrode layer. The third electrode layer is located on the second dielectric layer. The first conductive plug is located between the first electrode layer and the third electrode layer. The first conductive plug is electrically connected to the first electrode layer and the third electrode layer. The bottom surface of the first conductive plug is directly connected to the upper surface of the first electrode layer. The top surface of the first conductive plug is directly connected to the lower surface of the third electrode layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體結構</p>  
        <p type="p">100:基底</p>  
        <p type="p">102a,114a,130a:電極層</p>  
        <p type="p">102b,130b,130c:導線</p>  
        <p type="p">104a,104b,108a,108b,132a,132b,132c,136a,136b,136c:阻障層</p>  
        <p type="p">106a,106b,134a,134b,134c:導電層</p>  
        <p type="p">112,116a,120,138:介電層</p>  
        <p type="p">122,124,126:導電插塞</p>  
        <p type="p">C1:電容器結構</p>  
        <p type="p">IS1,IS2:內連線結構</p>  
        <p type="p">OP1:開口</p>  
        <p type="p">S1,S5,S6:底面</p>  
        <p type="p">S2:頂面</p>  
        <p type="p">S3:上表面</p>  
        <p type="p">S4:下表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="530" publication-number="202612260"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612260.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612260</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>寄生電容消除電路及寄生電容消除方法</chinese-title>  
        <english-title>PARASITIC CAPACITANCE CANCELLATION CIRCUIT AND PARASITIC CAPACITANCE CANCELLATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H03F1/08</main-classification>  
        <further-classification edition="200601120241101B">H03F3/45</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊凱瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KAI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪崇智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHUNG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">寄生電容消除電路包含第一電晶體、第一耦接器、第二耦接器以及負阻抗產生器。第一電晶體包含第一端、控制端以及第二端。第一耦接器用以耦接第一電晶體之控制端以及第一端。第二耦接器用以耦接第一電晶體之控制端以及第二端。負阻抗產生器用以產生並提供負阻抗至第一電晶體之控制端，藉以消除第一電晶體的寄生電容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A parasitic capacitor cancellation circuit includes a first transistor, a first coupler, a second coupler, and a negative impedance generator. The first transistor includes a first terminal, a control terminal, and a second terminal. The first coupler is configured to couple the control terminal and the first terminal of the first transistor. The second coupler is configured to couple the control terminal and the second terminal of the first transistor. The negative impedance generator is configured to generate and provide a negative impedance to the control terminal of the first transistor to eliminate parasitic capacitance of the first transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:寄生電容消除電路</p>  
        <p type="p">110:第一耦接器</p>  
        <p type="p">120:第二耦接器</p>  
        <p type="p">130:負阻抗產生器</p>  
        <p type="p">A(S):寄生電容</p>  
        <p type="p">M1:第一電晶體</p>  
        <p type="p">M9:電晶體</p>  
        <p type="p">Vg:控制信號</p>  
        <p type="p">Vg2:信號</p>  
        <p type="p">α Y(S):第一參數</p>  
        <p type="p">β H(S):第二參數</p>  
        <p type="p">γ K(S):第三參數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="531" publication-number="202611369"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611369.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611369</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134948</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於軟弱地盤之明挖開挖工法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">E02D3/12</main-classification>  
        <further-classification edition="200601120241129B">E02D17/04</further-classification>  
        <further-classification edition="200601120241129B">E02D19/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立高雄科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈茂松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種應用於軟弱地盤之明挖開挖工法，包含以下步驟；架牆步驟：將阻斷軟牆插入軟弱地盤，阻斷軟牆環繞建築預定區域，且包含相結合的複數個欄桿、包覆欄桿的不透水布，且阻斷軟牆插入軟弱地盤的長度大於建築預定區域地深度；補強步驟：將水泥、碎石添加至阻斷軟牆內側的土壤並攪拌混合，以形成一圈補強區塊，並同時於補強區塊設置複數個補強桿；開挖步驟：於補強區塊環繞的範圍內向下開挖至一開挖深度，開挖深度小於或等於補強區塊的深度。該明挖開挖工法由外而內循環進行架牆步驟、補強步驟及開挖步驟，以將建築預定區域挖空。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S20:外圍補強步驟</p>  
        <p type="p">S21:架牆步驟</p>  
        <p type="p">S22:補強步驟</p>  
        <p type="p">S23:開挖步驟</p>  
        <p type="p">S3:基底補強步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="532" publication-number="202611364"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611364.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611364</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134949</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於軟弱地盤的路基施工方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">E01C3/04</main-classification>  
        <further-classification edition="200601120241129B">E01C21/00</further-classification>  
        <further-classification edition="200601120241129B">E02D3/02</further-classification>  
        <further-classification edition="200601120241129B">E02D3/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立高雄科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈茂松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種應用於軟弱地盤的路基施工方法，包含下述步驟。開挖步驟：確定欲施工形成之道路的路幅，並根據路幅向下開挖軟弱地盤，將軟土挖起而形成施工坑，施工坑的寬度對應路幅；混合步驟：將水泥、碎石混入挖起的軟土並攪拌均勻，形成混合土；補強步驟：將複數個補強桿相聯結而設置於施工坑中，形成支撐網格；回填步驟：以混合土覆蓋支撐網格，並滾壓夯實混合土。透過補強桿形成的支撐網格，搭配以水泥處理土壤的工法形成的混合土，可形成強度高、承載力強的路基，避免路面因鬆軟土壤的承載力不足而下陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:開挖步驟</p>  
        <p type="p">S2:混合步驟</p>  
        <p type="p">S3:補強步驟</p>  
        <p type="p">S4:回填步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="533" publication-number="202612079"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612079.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612079</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134958</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓盒及其支撐架</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">H01L21/673</main-classification>  
        <further-classification edition="200601120241128B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鼎洲科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DNJO TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳延方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶圓盒，包含一殼體及二支撐架，每一該支撐架包括至少一支柱、多個支撐片，及至少一分隔組件。該支柱沿一高度方向延伸。該等支撐片可拆卸地套設於該支柱並沿該高度方向排列。該分隔組件具有可拆卸地套設於該支柱的多個套筒，該等套筒分隔該等支撐片使該等支撐片彼此相間隔，每兩個相鄰的該等支撐片之間的該支柱至少安裝有一個該套筒，每兩個相鄰的該等支撐片之間的該支柱上的該套筒數量能選擇性變換。該支撐架損壞時不需要替換整個晶圓盒，同時不需要為了不同精度的機械手臂另外開模製作整個該晶圓盒，節省開模成本，也降低置換成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶圓盒</p>  
        <p type="p">1:殼體</p>  
        <p type="p">11:底壁</p>  
        <p type="p">12:頂壁</p>  
        <p type="p">13:側壁</p>  
        <p type="p">131:內壁面</p>  
        <p type="p">132:外壁面</p>  
        <p type="p">14:後壁</p>  
        <p type="p">15:容置空間</p>  
        <p type="p">2:支撐架</p>  
        <p type="p">9:基板</p>  
        <p type="p">X:左右方向</p>  
        <p type="p">Y:高度方向</p>  
        <p type="p">Z:前後方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="534" publication-number="202611516"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611516.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611516</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134961</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探針卡ＰＣＢ之結構改良</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">G01R1/067</main-classification>  
        <further-classification edition="200601120241129B">G01R1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全智科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA SOLUTION TECH. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王杰霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIEN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀雲朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YUN-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳伯揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴𢖍君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, HENG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳敏弦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MIN-SIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘東昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAN, TUNG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡正宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, CHENG-YER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇彥文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為有關一種探針卡PCB之結構改良，結構包括有一電路基板、一設置部、一探針卡、一外框體、一支撐元件、一定位導引座、至少一固定結構、一強化元件、及複數水平調整件。藉上述結構，使用者於操作探針卡時，除了利用外框體壓制住探針卡外圍外，並以支撐元件大面積的壓制住電路基板，同時由強化元件搭接在外框體內側壁及結合於支撐元件上，以強化電路基板的強度，此時，由於探針卡利用定位導引座固定在設置部一側，即便在操作時受到外力頂推，也可利用支撐元件及強化元件防止電路基板翹曲變形，或進一步利用水平調整件微調探針卡與外框體間的水平。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:電路基板</p>  
        <p type="p">11:設置部</p>  
        <p type="p">2:外框體</p>  
        <p type="p">3:支撐元件</p>  
        <p type="p">31:定位導引座</p>  
        <p type="p">32:平面部</p>  
        <p type="p">33:定位部</p>  
        <p type="p">4:固定結構</p>  
        <p type="p">41:壓制部</p>  
        <p type="p">42:螺合部</p>  
        <p type="p">5:強化元件</p>  
        <p type="p">51:對接部</p>  
        <p type="p">52:強化結合部</p>  
        <p type="p">6:水平調整件</p>  
        <p type="p">7:探針卡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="535" publication-number="202611421"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611421.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611421</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具自動夾持及自動充氣的氣嘴頭</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F16K15/20</main-classification>  
        <further-classification edition="200601120241105B">B60C29/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>創永實業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許龍國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許龍國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耿禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種具自動夾持及自動充氣的氣嘴頭，用於連接充氣嘴進行充氣作業，該氣嘴頭包含一氣嘴頭本體及一頂針閥，該氣嘴頭本體包含一第一連接體與一第二連接體，該第二連接體包含一結合座、一止氣環、至少一活動咬合件及至少一復位元件，該頂針閥安裝於該第一連接體與該第二連接體內部，並可進行限位滑移，藉以具有自動棘式夾持及自動充氣功能，使得充氣過程可單手操作，並可藉由該頂針閥有效防止氣體洩漏，提升使用便利性，以及可適用於安裝或未安裝閥芯的充氣嘴，從而增強充氣效率和實用性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:氣嘴頭</p>  
        <p type="p">10:氣嘴頭本體</p>  
        <p type="p">10A:第一連接體</p>  
        <p type="p">11:進氣腔室</p>  
        <p type="p">111:內螺紋</p>  
        <p type="p">12:出氣腔室</p>  
        <p type="p">13:組接部</p>  
        <p type="p">131:O型環</p>  
        <p type="p">132:限位槽</p>  
        <p type="p">14:進氣道</p>  
        <p type="p">10B:第二連接體</p>  
        <p type="p">21:結合座</p>  
        <p type="p">21A:座體</p>  
        <p type="p">21B:蓋體</p>  
        <p type="p">21C:槽室</p>  
        <p type="p">211:第一接口</p>  
        <p type="p">214:限位凸塊</p>  
        <p type="p">215:第一樞部</p>  
        <p type="p">216:第三樞部</p>  
        <p type="p">22:止氣環</p>  
        <p type="p">221:通孔</p>  
        <p type="p">222:第一氣密部</p>  
        <p type="p">223:第二氣密部</p>  
        <p type="p">23:活動咬合件</p>  
        <p type="p">231:第二樞部</p>  
        <p type="p">232:齒牙</p>  
        <p type="p">233:連動部</p>  
        <p type="p">24:控制件</p>  
        <p type="p">241:第四樞部</p>  
        <p type="p">242:手動部</p>  
        <p type="p">243:控制部</p>  
        <p type="p">25:復位元件</p>  
        <p type="p">26:復位元件</p>  
        <p type="p">27:迫抵彈簧</p>  
        <p type="p">30:頂針閥</p>  
        <p type="p">31:封閉部</p>  
        <p type="p">32:閥桿</p>  
        <p type="p">321:抵頂部</p>  
        <p type="p">322:受推部</p>  
        <p type="p">33:連桿</p>  
        <p type="p">34:止氣件</p>  
        <p type="p">40:抵壓環</p>  
        <p type="p">41:外螺紋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="536" publication-number="202611911"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611911.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611911</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134965</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置、記憶體控制電路以及讀取方法</chinese-title>  
        <english-title>MEMORY DEVICE, MEMORY CONTROL CIRCUIT, AND READING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G11C7/22</main-classification>  
        <further-classification edition="200601120241202B">G11C7/14</further-classification>  
        <further-classification edition="200601120241202B">G11C11/409</further-classification>  
        <further-classification edition="200601120241202B">G11C16/26</further-classification>  
        <further-classification edition="200601120241202B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳信翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置包含一記憶體單元陣列以及一記憶體控制電路。記憶體單元陣列耦接複數位元線以及複數互補位元線。記憶體控制電路包含一驅動電路、一追蹤電路以及一感測電路。驅動電路用以傳送一字元線訊號至記憶體單元陣列且包含一輔助電路。追蹤電路用以依據一壓降訊號控制一虛擬位元線訊號。感測電路耦接該些位元線以及該些互補位元線且用以依據虛擬位元線訊號讀取記憶體單元陣列中的一記憶體單元。當輔助電路被關閉時，壓降訊號具有一第一電壓。當輔助電路被開啟時，壓降訊號具有一第二電壓。第二電壓低於第一電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a memory cell array and a memory control circuit. The memory cell array is coupled to a plurality of bit lines and a plurality of complementary bit lines. The memory control circuit includes a driver circuit, a tracking circuit, and a sensor circuit. The driver circuit is configured to transmit a word line signal to the memory cell array and includes an assist circuit. The tracking circuit is configured to control a dummy bit line signal according to an under-drive signal. The sensor circuit is coupled to the bit lines and the complementary bit lines and is configured to read a memory cell in the memory cell array according to the dummy bit line signal. When the assist circuit is turned off, the under-drive signal has a first voltage. When the assist circuit is turned on, the under-drive signal has a second voltage. The second voltage is lower than the first voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">WL:字元線訊號</p>  
        <p type="p">BL:位元線訊號</p>  
        <p type="p">BLB:互補位元線訊號</p>  
        <p type="p">DV:電壓差</p>  
        <p type="p">DBL:虛擬位元線訊號</p>  
        <p type="p">SAE:致能訊號</p>  
        <p type="p">DWL:虛擬字元線訊號</p>  
        <p type="p">UD:壓降訊號</p>  
        <p type="p">TP1,TP2:時間點</p>  
        <p type="p">V1,V2,V3,V4,V5:電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="537" publication-number="202611549"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611549.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611549</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134966</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具抗眩光與抗反射功能的塑膠面板的製法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING PLASTIC PANELS WITH ANTI-GLARE AND ANTI-REFLECTIVE FUNCTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120241105B">G02B1/11</main-classification>  
        <further-classification edition="201501120241105B">G02B1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穎華科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENFLEX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳信元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIN YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡毓鈴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, YU LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐瑞琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JUI LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱顯鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, XIAN JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具抗眩光與抗反射功能的塑膠面板的製法，可於高分子材料基板的平整表面先進行硬質層表面塗佈硬化處理以及抗反射層之多層薄膜表面處理，而後再於多層薄膜表面上進行抗眩光層之表面粗糙化處理。硬質層的材料選用有機無機混成紫外光寡聚物/單體、無機粒子材料、或是高延伸特性(延伸率&amp;gt;200%)之紫外光固化長鏈寡聚物/單體。抗反射層的多層薄膜材料組成選用高折射率之紫外光固化寡聚物/單體或無機材料，搭配低折射率之紫外光固化寡聚物/單體或無機材料。藉由本發明製法與材料所製造的塑膠面板成品可兼具有好的外觀品質及產品特性良率，並同時保有抗眩光及抗反射功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing plastic panels with anti-glare and anti-reflective functions. The flat surface of a polymer material substrate is first coated with a hard-coating layer and formed with a multi-layer thin film of an anti-reflective layer. And then, surface roughening treatment of anti-glare layer is applied on the surface of the multi-layered anti-reflective layer. The hard-coating layer is made of organic-inorganic hybrid ultraviolet (UV) oligomers/monomers, inorganic particle materials, or UV-curable long-chain oligomers/monomers with high elongation properties (elongation ratio&amp;gt;200%). The material of the multi-layer thin film of anti-reflective layer is made of high-refractive-index UV-curable oligomers/monomersor inorganic materials, combined with low-refractive-index UV-curable oligomers/monomers or inorganic materials. The plastic panel manufactured by the method and materials of the present invention can have both good appearance quality and product characteristic yield, while providing anti-glare and anti-reflective functions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21~27:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="538" publication-number="202611374"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611374.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611374</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134978</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預鑄牆板快速定位組裝結構</chinese-title>  
        <english-title>QUICK POSITIONING AND ASSEMBLY STRUCTURE FOR PRECAST WALL PANELS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">E04B1/38</main-classification>  
        <further-classification edition="200601120241128B">E04B2/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希伯崙興業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEBRON INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓智聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, CHIH-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種預鑄牆板快速定位組裝結構，其包括一預鑄牆板、數定位固定座體及數工字樑配合，該預鑄牆板設有一牆框、數管狀對接外框及數填充發泡基材，而該數填充發泡基材填充入牆框中，且該數管狀對接外框分別設於牆框各邊緣，該定位固定座體設有至少一穿制固定L形角板及一延伸固定L形支撐板，而該工字樑設有至少一結合立板，其穿制固定L形角板分別穿制固定於管狀對接外框，於數預鑄牆板呈縱向對接延伸並與工字樑組裝時，該數定位固定座體所設延伸固定L形支撐板，能夠相互貼抵固定並與工字樑所設結合立板結合，提供無須加工前置水平量測程序之快速定位組裝，以達使用功能性及使用便利性佳之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a quick positioning and assembly structure for precast wall panels. It includes a precast wall panel, multiple positioning and fixing base units, and several I-beams. The precast wall panel comprises a wall frame, several tubular coupling frames, and foam filling materials, which are filled into the wall frame. The tubular coupling frames are positioned along the edges of the wall frame. Each positioning and fixing base unit is equipped with at least one L-shaped fixing plate and an extending L-shaped support plate. The I-beam includes at least one upright joining plate, with the L-shaped fixing plate inserted and fixed into the tubular coupling frames. When multiple precast wall panels are vertically connected and assembled with the I-beams, the extending L-shaped support plates on the positioning and fixing base units fit and are secured to the upright joining plates of the I-beam. This configuration allows for rapid positioning and assembly without the need for pre-processing horizontal measurements, ensuring excellent functional use and ease of installation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:預鑄牆板</p>  
        <p type="p">11:牆框</p>  
        <p type="p">12:管狀對接外框</p>  
        <p type="p">121:第一穿制件</p>  
        <p type="p">122:第一固定件</p>  
        <p type="p">13:填充發泡基材</p>  
        <p type="p">20:定位固定座體</p>  
        <p type="p">21:穿制固定L形角板</p>  
        <p type="p">22:延伸固定L形支撐板</p>  
        <p type="p">220:固定孔</p>  
        <p type="p">221:第二穿制件</p>  
        <p type="p">222:第二固定件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="539" publication-number="202612434"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612434.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612434</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134979</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相容於多種控制盒的智慧風扇</chinese-title>  
        <english-title>SMART FAN COMPATIBLE WITH VARIOUS CONTROL BOX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240920B">H05K7/20</main-classification>  
        <further-classification edition="200601120240920B">F04D27/00</further-classification>  
        <further-classification edition="200601120240920B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺玖科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROLIFIC TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許家彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余仁淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, REN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種相容於多種控制盒的智慧風扇，其中，該智慧風扇具有一控制晶片與至少一電連接器，且該控制晶片被配置以在該電連接器被電連接至一控制盒後執行一基於信號檢測的模式切換操作，從而依據該控制盒的種類將該智慧風扇切換至一般風扇控制模式或一數據封包通信模式。並且，在所述一般風扇控制模式中，該控制晶片在完成該智慧風扇的一優先識別碼或一非優先識別碼的設定後，將該智慧風扇切換回所述一般風扇控制模式。另一方面，在所述數據封包通信模式下，該控制盒與該智慧風扇之間基於一通信協議進行數據封包之傳輸，藉此方式實現對於該智慧風扇的一轉速控制、一轉速監測以及一風扇功能設定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a smart fan compatible with various control box, wherein the smart fan has an electronic chip and at least one electrical connector, and the electronic chip is configured to, in case of the electrical connector being connected to a control box, conduct an operation mode control of the smart fan based on signal detection, thereby switching the smart fan to a normal fan controlling mode or a data packet transmission mode. When being switched to the normal fan controlling mode, a priority identifier or a non-priority identifier of the smart fan is firstly set, and then the smart fan operates in the normal fan controlling mode. In addition, after being switched to the data packet transmission mode, the control box and the smart fan conduct a data packet transmission according to a specific communication protocol, such that a rotation speed control, a rotation speed monitoring and a function setting of the smart fan can be carried out.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:智慧風扇</p>  
        <p type="p">10:控制晶片</p>  
        <p type="p">11:電連接器</p>  
        <p type="p">2:風扇模組</p>  
        <p type="p">3:控制盒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="540" publication-number="202612236"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612236.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612236</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134980</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>零電壓切換轉換器的閉迴路控制方法</chinese-title>  
        <english-title>A CLOSED-LOOP CONTROL METHOD FOR ZERO VOLTAGE SWITCHING CONVERTERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120250501B">H02M1/44</main-classification>  
        <further-classification edition="200601120250501B">G05F1/565</further-classification>  
        <further-classification edition="200601120250501B">H02M3/156</further-classification>  
        <further-classification edition="200601120250501B">H02M7/217</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商希爾克雷斯特能源科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILLCREST ENERGY TECHNOLOGIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿米尼　賈拉勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMINI, JALAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯格　艾里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERGER, ARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈蒙德　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMOND, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨斯騰伯格　哈拉爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENGSTENBERGER, HARALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏均宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露一種用於輔助諧振換向極(ARCP)轉換器的控制器，該控制器包含：一感測器部分，包含：ZVD感測器，配置為測量該轉換器的開關上的電壓，並偵測該開關上的電壓何時為零；dv/dt感測器，配置為測量該開關上的電壓之時間變化，並偵測該開關上的電壓轉變；及閘極感測器，配置為測量該開關的閘源電壓，並偵測該閘源電壓何時足以使該開關在關和開之間轉換；及一控制部分，配置為：接收來自該ZVD感測器、該dv/dt感測器及該閘極感測器的測量結果；及產生對該開關的控制訊號，其係至少部分地基於接收自該ZVD感測器、該dv/dt感測器及該閘極感測器的該測量結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Herein is disclosed a controller for an auxiliary resonant commutated pole (ARCP) converter, the controller comprising: a sensor section comprising: a ZVD sensor configured to measure a voltage across a switch of the converter, and detect when the voltage across the switch equals zero; a dv/dt sensor configured to measure a change in the voltage over time across the switch, and detect a voltage transition across the switch; and a gate sensor configured to measure a gate-source voltage of the switch, and detect when the gate-source voltage is sufficient for the switch to transition between OFF and ON; and a control section configured to: receive measurements from the ZVD sensor, the dv/dt sensor, and the gate sensor; and generate a control signal for the switch based at least in part on the measurements received from the ZVD sensor, the dv/dt sensor, and the gate sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:功率轉換器；功率部分</p>  
        <p type="p">110:輔助電路；輔助部分</p>  
        <p type="p">111,112:諧振電容器</p>  
        <p type="p">113,114:輔助開關</p>  
        <p type="p">115:諧振電感器</p>  
        <p type="p">116,117:輔助二極體</p>  
        <p type="p">120:直流鏈路；主要部分</p>  
        <p type="p">121,122:主開關</p>  
        <p type="p">123,124:直流鏈電容器</p>  
        <p type="p">125,126:二極體</p>  
        <p type="p">130:輸出點</p>  
        <p type="p">140:直流鏈路</p>  
        <p type="p">150:直流鏈路140的正軌</p>  
        <p type="p">160:直流鏈路140的負軌</p>  
        <p type="p">171:電壓VC1</p>  
        <p type="p">172:電壓VC2</p>  
        <p type="p">173:負載電流IL</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="541" publication-number="202612199"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612199.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612199</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134981</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>母線連接器</chinese-title>  
        <english-title>BUSBAR CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H01R25/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾威勒電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾瑟拉　吉米安立奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACERA, JIMMY ENRIQUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種母線連接器包含兩本體與兩導電片。本體為平板狀且彼此相對並分隔。導電片為片狀且設置於本體中對應之一者，導電片彼此朝向並分隔。每個導電片包含導電框、多個第一導電臂與多個第二導電臂。導電框連接本體並具有第一內緣。第一導電臂連接第一內緣並至少部分朝向第一方向延伸，第一導電臂分別至少部分朝向導電片中另一者呈凸弧狀。第二導電臂連接第一內緣並至少部分朝向第二方向延伸，第二方向相反於第一方向，第二導電臂分別至少部分朝向導電片中另一者呈凸弧狀，第一導電臂與第二導電臂彼此錯開。本體與導電框的厚度比大於或等於3。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A busbar connector includes two bodies and two conductive slices. The bodies have planar shapes and oppositely separated from each other. Each conductive slice is disposed on the corresponding body. The conductive slices face to and are spaced apart from each other. Each conductive slice includes a frame, some first arms and some second arms. The frame connects with the body and has an inner edge. The first arms connect with the inner edge and extend towards a direction. Each first arm has at least partially a convex shape towards another conductive slice. The second arms connect with the inner edge and extend towards an opposite direction. Each second arm has at least partially a convex shape towards another conductive slice. The first arms and the second arms are staggered from each other. A thickness ratio of the body to the frame is larger than or equal to 3.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:本體</p>  
        <p type="p">111:導電板</p>  
        <p type="p">1111:板體</p>  
        <p type="p">1113:第二側壁</p>  
        <p type="p">1115:第二限位部</p>  
        <p type="p">112:導電延伸件</p>  
        <p type="p">114:定位彈臂</p>  
        <p type="p">120:導電片</p>  
        <p type="p">121:導電框</p>  
        <p type="p">122:第一導電臂</p>  
        <p type="p">123:第二導電臂</p>  
        <p type="p">124:第三導電臂</p>  
        <p type="p">125:第四導電臂</p>  
        <p type="p">126:定位片</p>  
        <p type="p">130:殼體</p>  
        <p type="p">131:定位結構</p>  
        <p type="p">140:接地片</p>  
        <p type="p">A-A,B-B,C-C:線段</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">GA:插槽</p>  
        <p type="p">GB:安裝槽</p>  
        <p type="p">GP2:第二間隙</p>  
        <p type="p">Z1:第一接觸區</p>  
        <p type="p">Z2:第二接觸區</p>  
        <p type="p">Z3:第三接觸區</p>  
        <p type="p">Z4:第四接觸區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="542" publication-number="202610939"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610939.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610939</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134983</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙層殼結構中空二氧化矽微球及其製備方法</chinese-title>  
        <english-title>DOUBLE-SHELL STRUCTURE HOLLOW SILICA MICROSPHERE AND PREPARATION METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">C01B33/12</main-classification>  
        <further-classification edition="200601120240930B">C01B33/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長興材料工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETERNAL MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>花玉芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA, YU-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙楚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸樹苹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, SHUPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何苗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游純麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, CHUNLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈炎明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YANMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種雙層殼結構中空二氧化矽微球及其製備方法，該雙層殼結構中空二氧化矽微球為包含內核層和外殼層的球形體，內核層和外殼層均為球形體，內核層和外殼層組成雙層殼結構，內核層位於外殼層內部，內核層的內部為中空結構，內核層與外殼層之間為空心結構；內核層的厚度為10至100奈米；外殼層的厚度為10至50奈米；該內核層和該外殼層上均分佈有複數個介孔，該等介孔的孔徑為1至10奈米。本發明微球粒徑分佈均勻，單分散性好，強度較高，分散性好。微球製備方法簡單易行，易於工業化，藉由自模板法和選擇性蝕刻策略即可製得。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A double-shell structure hollow silica microsphere and a preparation method of the same are provided. The double-shell structure hollow silica microsphere is a spherical body comprising an inner core layer and an outer shell layer. Both the inner core layer and the outer shell layer are spherical bodies. The inner core layer and the outer shell layer form a double-shell structure. The inner core layer is located inside the outer shell layer. The interior of the inner core layer is a hollow structure. There is a hollow structure between the inner core layer and the outer shell layer. The thickness of the inner core layer ranges from 10 to 100 nm, and the thickness of the outer shell layer ranges from 10 to 50 nm. There are multiple mesopores on the surface of both the inner core layer and the outer shell layer. The pore size of mesopores ranges from 1 to 10 nm. The microsphere of the present invention has a uniform particle size distribution, good monodispersity, high strength, and good dispersibility. The method for preparing the microspheres is simple and easy to implement, making it suitable for industrial scale-up. The microspheres can be produced using a self-templating method and selective etching strategy.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="543" publication-number="202610701"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610701.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610701</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134985</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具揚升裝置的履帶式跑步機</chinese-title>  
        <english-title>A SLAT TREADMILL WITH A LIFTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A63B22/02</main-classification>  
        <further-classification edition="200601120240929B">A63B23/035</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力山工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REXON INDUSTRIAL CORP.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文都</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEN-TU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YAO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具揚升裝置的履帶式跑步機，包含一基座、一跑步帶裝置及一揚升裝置。該基座包括二側框架。該揚升裝置包括一揚升架、一連動平衡單元及一揚升驅動器。該揚升架具有二支撐臂、一連接桿及二滾輪。每一該支撐臂具有一支撐端、一受力端，及一位於該支撐端與該受力端間且樞接於各自的側框架的樞接部。藉由該揚升驅動器設置於其中一該側框架且在該基座的框內空間外，達到便於維修的功效；該連動平衡單元連接於該等支撐臂之間且遠離於該等受力端，能在其中一該支撐臂受到該揚升驅動器的驅動時連動該等支撐臂，並達到維持結構穩定性的功能，具使用安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A slat treadmill with a lifting device comprises a base, a slat device and a lifting device. The base includes two side frames. The lifting device includes a lifting frame, a linkage balancing unit and a lifting driver. The lifting frame has two support arms, a connection rod and two rollers. Each of the support arms has a supporting end, a bearing end, and a pivot portion located between the supporting end and the bearing end which is pivoted to each own of the side frames. With the lifting driver mounted on one of the side frames and set outside the frame space of the base, effect of easy maintenance is achieved; both ends of the linkage balancing unit are respectively connected to the support arms and far from the bearing ends, it can coordinate with both of the support arms when one of the support arms is driven by the lifting driver to achieve the effects of maintaining the stability of the structure and the safety of use.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基座</p>  
        <p type="p">11:側框架</p>  
        <p type="p">111:立板</p>  
        <p type="p">112:頂板</p>  
        <p type="p">113:底板</p>  
        <p type="p">115:導槽</p>  
        <p type="p">12:橫框架</p>  
        <p type="p">13:座腳</p>  
        <p type="p">14:框內空間</p>  
        <p type="p">2:跑步帶裝置</p>  
        <p type="p">21:滾軸</p>  
        <p type="p">22:履帶</p>  
        <p type="p">23:轉動驅動器</p>  
        <p type="p">3:揚升裝置</p>  
        <p type="p">4:揚升架</p>  
        <p type="p">41:支撐臂</p>  
        <p type="p">411:支撐端</p>  
        <p type="p">412:受力端</p>  
        <p type="p">413:樞接部</p>  
        <p type="p">42:連接桿</p>  
        <p type="p">43:導引桿</p>  
        <p type="p">44:滾輪</p>  
        <p type="p">5:連動平衡單元</p>  
        <p type="p">6:揚升驅動器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="544" publication-number="202611536"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611536.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611536</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134986</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以電壓平衡檢測電池壽命之系統及其運作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250203B">G01R31/392</main-classification>  
        <further-classification edition="201901120250203B">G01R31/382</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係揭露一種以電壓平衡檢測電池壽命之系統及其運作方法，該系統係包括：電池模組、偵測模組、處理模組、運算模組及警示模組，該電池模組係包括複數以串聯方式連接之電池單元，令該電池模組具有一正極端、至少一接點及一負極端；該系統可進行偵測步驟、運算步驟及警示步驟，先透過該偵測模組偵測該電池模組位於該電池模組之正極端、接點及負極端之電壓，再透過該運算模組計算該正極端之電壓與該接點之電壓的第一電壓差及該接點之電壓與該負極端之電壓的第二電壓差，該處理模組係判斷該第一電壓差、該第二電壓差與一閥值之關係，而決定該警示模組是否發出警示訊息。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:以電壓平衡檢測電池壽命之系統</p>  
        <p type="p">11:電池模組</p>  
        <p type="p">12:偵測模組</p>  
        <p type="p">13:處理模組</p>  
        <p type="p">14:運算模組</p>  
        <p type="p">15:警示模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="545" publication-number="202611603"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611603.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611603</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134987</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光致變色膽固醇液晶面板及其製造方法</chinese-title>  
        <english-title>PHOTOCHROMIC CHOLESTERIC LIQUID CRYSTAL PANEL AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G02F1/1333</main-classification>  
        <further-classification edition="200601120241007B">C09K19/36</further-classification>  
        <further-classification edition="200601120241007B">C09K19/38</further-classification>  
        <further-classification edition="200601120241007B">C09K19/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希映顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEEING DISPLAY TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂志平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIH-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHU-MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭詠心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUNG-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光致變色膽固醇液晶面板，包含：第一驅動基板、第二驅動基板及設置於第一驅動基板與第二驅動基板之間的膽固醇液晶層，其中，膽固醇液晶層係為經光固化光的照射而形成有複數個液晶微胞的液晶微胞結構層，並且膽固醇液晶層具有複數個顯示區塊，複數個顯示區塊中的至少一個係為經光致變色光的照射而呈色改變所形成的變色顯示區塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photochromic cholesteric liquid crystal panel comprises: a first driving substrate, a second driving substrate, and a cholesteric liquid crystal layer disposed between the first driving substrate and the second driving substrate, wherein the cholesteric liquid crystal layer is a liquid crystal microcellular structural layer formed with a plurality of liquid crystal microcells by irradiation of light-curing light, the cholesteric liquid crystal layer has a plurality of display areas, and at least one of the plurality of display areas is a color-changing display area formed by a color change caused by irradiation of photochromic light.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光致變色膽固醇液晶面板</p>  
        <p type="p">10:第一驅動基板</p>  
        <p type="p">11:透明基板層</p>  
        <p type="p">12:透明電極層</p>  
        <p type="p">20:第二驅動基板</p>  
        <p type="p">21:透明基板層</p>  
        <p type="p">22:透明電極層</p>  
        <p type="p">30:膽固醇液晶層</p>  
        <p type="p">31:顯示區塊</p>  
        <p type="p">32:變色顯示區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="546" publication-number="202611537"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611537.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611537</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車載充電測試系統及其方法</chinese-title>  
        <english-title>ON-BOARD CHARGE TESTING SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120240925B">G01R31/40</main-classification>  
        <further-classification edition="201901120240925B">B60L53/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致茂電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHROMA ATE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡守廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, SHOU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游秋榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, CIOU-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李立翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">車載充電測試方法包含根據多個測試參數組之一者，使供電系統提供對應的充電環境，以測試車載充電裝置於充電過程中的多個階段中對應的第一階段下的狀態，該些階段對應於該些測試參數組及多個階段晉升條件；偵測車載充電裝置於各該階段下所產生的控制導引回授訊號；及在車載充電裝置進入第一階段的一段時間後，當控制導引回授訊號的訊號參數滿足第一階段所對應的階段晉升條件時，根據該些測試參數組中之該一者或另一者，使供電系統提供對應的充電環境，以測試車載充電裝置於該些階段中對應的第二階段下的狀態，第二階段接續於第一階段之後。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An On-board charge testing method includes: providing, according to one of a plurality of test parameter sets, a corresponding charging environment by a power supply to test the state of an on-board charger in a corresponding first stage of a plurality of stages of a charging process, wherein the stages correspond to the test parameter sets and a plurality of stage enter condition; detecting a control pilot feedback signal generated by the on-board charger in each of the stages; and after the on-board charger enters the first stage for a period of time, providing, according to the one or another one of the test parameter sets, the corresponding charging environment to test the state of the on-board charger in a corresponding second stage behind the first stage of the stages when the signal parameter of the control pilot feedback signal meets the stage enter condition corresponding to the first stage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S301~S309:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="547" publication-number="202611942"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611942.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611942</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134991</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無臨床病理資料下透過電腦輔助預測基因點位致病性與其遺傳模式之預測系統及其方法、以及離子選取系統及其方法</chinese-title>  
        <english-title>A CLINIC PATHOLOGIC DATA-FREE AND COMPUTER-AIDED SYSTEM FOR PREDICTING INHERITANCE PATTERN OF PATHOGENICITY AND METHOD THEREOF, AND AN ION SELCTION SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241001B">G16H50/80</main-classification>  
        <further-classification edition="201801120241001B">G16H50/30</further-classification>  
        <further-classification edition="201801120241001B">G16H50/20</further-classification>  
        <further-classification edition="201801120241001B">G16H50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學醫學院附設醫院新竹臺大分院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY HOSPITAL HSIN-CHU BRANCH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡政育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳振吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHEN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊立威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LEE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無臨床病理資料下，透過電腦輔助預測基因點位致病性與其遺傳模式之預測方法包含分子動態模擬步驟、計算步驟、判斷步驟及預測結果產生步驟。於分子動態模擬步驟，對通道蛋白構型進行分子建模與電腦模擬，其中通道蛋白構型包含野生型通道或變異型通道；於計算步驟，於一預定時間內，分別計算通過該野生型通道的離子數量與通過該變異型通道的離子數量而得到第一離子數量與第二離子數量；於判斷步驟，依據第一離子數量及第二離子數量，判斷變異型通道的類型；於預測結果產生步驟，依據變異型通道的類型，產生預測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A clinic pathologic data-free and computer-aided method for predicting inheritance pattern of pathogenicity includes a simulation step of molecular dynamics (MD), a computing step, a judgement step, and a production step of prediction. The step of MD simulation is to construct the molecular modelling and perform the computational simulation for a channel protein configuration, wherein the channel protein configuration contains wild-type channel configuration and mutated-type channel configurations. The computing step is to count ions passing through the wild-type channel configuration and the mutated channel configurations, respectively, and to obtain a first ion number and a second ion number. The judgement step is to determine the types of the mutated channel configurations, according to the first ion number and the second ion number. The production step of prediction is to produce a predicted result, according to the types of the mutated channel configurations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11,S12,S15~S17,S19,S112,S114:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="548" publication-number="202611912"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611912.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611912</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134992</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可高速傳輸的資料輸入裝置及可實現高速傳輸的輸入資料的處理方法</chinese-title>  
        <english-title>HIGH-SPEED DATA INPUT DEVICE AND PROCESSING METHOD FOR INPUT DATA ENABLING HIGH-SPEED TRANSMISSION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G11C7/22</main-classification>  
        <further-classification edition="200601120241202B">G11C11/409</further-classification>  
        <further-classification edition="200601120241202B">G11C16/32</further-classification>  
        <further-classification edition="200601120241202B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>乾瞻科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INPSYTECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡浚喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, CHUN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昱錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YU-HSI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛維仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIUE, WEI-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡居諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資料輸入裝置包含輸入端電路、訓練電路、偵測電路、資料延遲線及時鐘延遲線。輸入端電路用以接收第一資料訊號及第一時脈訊號。訓練電路用以依據第一資料訊號及第一時脈訊號設定第一延遲設定。第一延遲設定包含第一資料延遲量及第一時脈延遲量。偵測電路用以依據第一延遲設定及第一時脈訊號的時鐘週期設定第二延遲設定。第二延遲設定包含第二資料延遲量及第二時脈延遲量。資料延遲線用以依據第一資料訊號及第二資料延遲量輸出第二資料訊號。時鐘延遲線用以依據第一時脈訊號及第二時脈延遲量輸出第二時脈訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data input device includes an input circuit, a training circuit, a detection circuit, a data delay line, and a clock delay line. The input circuit is configured to receive a first data signal and a first clock signal. The training circuit is configured to set a first delay setting based on the first data signal and the first clock signal. The first delay setting includes a first data delay amount and a first clock delay amount. The detection circuit is configured to set a second delay setting based on the first delay setting and a clock cycle of the first clock signal. The second delay setting includes a second data delay amount and a second clock delay amount. The data delay line is configured to output a second data signal based on the first data signal and the second data delay amount. The clock delay line is configured to output a second clock signal based on the first clock signal and the second clock delay amount.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資料輸入裝置</p>  
        <p type="p">2:輸出端電路</p>  
        <p type="p">10:輸入端電路</p>  
        <p type="p">11:訓練電路</p>  
        <p type="p">12:偵測電路</p>  
        <p type="p">13:資料延遲線</p>  
        <p type="p">14:時鐘延遲線</p>  
        <p type="p">A:第一延遲設定</p>  
        <p type="p">B:第二延遲設定</p>  
        <p type="p">A1:第一資料延遲量</p>  
        <p type="p">A2:第一時脈延遲量</p>  
        <p type="p">B1:第二資料延遲量</p>  
        <p type="p">B2:第二時脈延遲量</p>  
        <p type="p">D1:第一資料訊號</p>  
        <p type="p">CK:第一時脈訊號</p>  
        <p type="p">D2:第二資料訊號</p>  
        <p type="p">CK2:第二時脈訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="549" publication-number="202612557"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612557.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612557</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134993</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垂直覆晶式發光元件及垂直覆晶式發光元件製作方法</chinese-title>  
        <english-title>VERTICAL FLIP-CHIP LIGHT EMITTING ELEMENT AND MANUFACTURING METHOD FOR VERTICAL FLIP-CHIP LIGHT EMITTING ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H20/857</main-classification>  
        <further-classification edition="202501120250102B">H10H20/81</further-classification>  
        <further-classification edition="202501120250102B">H10H20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶呈科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INGENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王嘉彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIA-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳筱儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIAO-LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉埃森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, AI-SEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮祥銨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, HSIANG-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種垂直覆晶式發光元件包含裸晶組、二第一接墊、二第二接墊以及電連接層。裸晶組包含二裸晶及第一型半導體連接部。第一型半導體連接部連接於二裸晶的第一型半導體層之間。二第一接墊中的第一者設置於二裸晶中的第一者的下方，二第一接墊中的一第二者對應但不直接接觸二裸晶中的一第二者。二第二接墊中的第一者設置於二裸晶中的第一者的上方，二第二接墊中的第二者設置於二裸晶中的第二者的上方。電連接層電性連接二第二接墊及第一接墊中的第二者。藉此，當有裸晶損壞時，電流仍可流入正常的裸晶，因而具有自我補償功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a vertical flip-chip light emitting element including a die set, two first pads, two second pads and an electrical connecting layer. The die set includes two dice and a first type semiconductor connecting portion connecting between two first type semiconductor layers of the two dice. A first one of the two first pads is disposed below a first one of the two dice. A second one of the two first pads is disposed below but does not directly contact a second one of the two dice. A first one of the second pads is disposed above the first one of the two dice, a second one of the second pads is disposed above the second one of the two dice, and the electrical connecting layer is electrically connected to the two second pads and the second one of the first pads. Therefore, as one of the dice is damaged, the current can still flow into the normal die, and a self-compensation function is achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:垂直覆晶式發光元件</p>  
        <p type="p">1100:裸晶組</p>  
        <p type="p">1110,1120:裸晶</p>  
        <p type="p">1111,1121:第一型半導體層</p>  
        <p type="p">1112,1122:第二型半導體層</p>  
        <p type="p">1113,1123:主動層</p>  
        <p type="p">1130:第一型半導體連接部</p>  
        <p type="p">1210,1220:第一接墊</p>  
        <p type="p">1211a,1221a:金屬下表面</p>  
        <p type="p">1221:焊接段</p>  
        <p type="p">1222:凸出段</p>  
        <p type="p">1222a:金屬上表面</p>  
        <p type="p">1230:絕緣層</p>  
        <p type="p">1231:絕緣上表面</p>  
        <p type="p">1310,1320:第二接墊</p>  
        <p type="p">1400:電連接層</p>  
        <p type="p">1500:第一保護層</p>  
        <p type="p">1510:延伸部</p>  
        <p type="p">1520:上部</p>  
        <p type="p">1600:第二保護層</p>  
        <p type="p">I1:第一分流</p>  
        <p type="p">I2:第二分流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="550" publication-number="202611366"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611366.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611366</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134994</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高荷重型覆工板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">E01C9/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳彧機械工程有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳銀庫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昆德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳銀庫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉建忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種高荷重型覆工板，係包含：一盒體、一鋼架及一混凝土，其中，該盒體具一底板，該底板四周具有複數個透孔，周圍往上延伸有一邊框，該邊框的頂端形成一盒口，該盒口的四周頂緣往內翻折形成一橫壁，中間位置具有一容置空間；該鋼架具有一橫隔板、一縱向鋼筋、一橫向鋼筋及複數個中空柱，該橫隔板頂緣具有複數個凹槽；該縱向鋼筋架設於該凹槽上；該橫向鋼筋與該縱向鋼筋夾持固定；該中空柱與該底板的透孔連結固定，上方具有一橫桿；該混凝土進行灌漿，充填該盒體的該容置空間內，使該盒體與該鋼架包覆凝固成型；藉由該高荷重型覆工板結構，達到提升承壓載重強度及增加安全性之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:高荷重型覆工板</p>  
        <p type="p">2:盒體</p>  
        <p type="p">20:底板</p>  
        <p type="p">21:透孔</p>  
        <p type="p">22:邊框</p>  
        <p type="p">23:橫壁</p>  
        <p type="p">24:容置空間</p>  
        <p type="p">3:鋼架</p>  
        <p type="p">30:橫隔板</p>  
        <p type="p">31:縱向鋼筋</p>  
        <p type="p">32:橫向鋼筋</p>  
        <p type="p">33:中空柱</p>  
        <p type="p">34:凹槽</p>  
        <p type="p">35:橫桿</p>  
        <p type="p">36:延伸段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="551" publication-number="202612245"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612245.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612245</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134996</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉換系統以及轉換方法</chinese-title>  
        <english-title>CONVERSION SYSTEM AND CONVERSION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">H02M7/162</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群光電能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHICONY POWER TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴炎生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YEN-SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宏文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HUNG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭左任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, TSO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王思浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SSU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種轉換系統以及轉換方法，其中轉換方法適用於轉換系統，轉換系統包含轉換單元以及控制單元；轉換單元包含第一橋臂、第二橋臂、輸入電感元件、主電容元件、激磁電感元件以及變壓元件；轉換方法包含由控制單元執行：基於轉換單元的輸出電壓產生第一工作週期；基於第一工作週期控制第一開關與第二開關同時在切換區間內的一區間中導通；以及依據輸入電壓的極性，延長導通第一開關以及第二開關中的一個直到停止條件被滿足。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A conversion system and a conversion method, wherein the conversion method is suitable for a conversion system, and the conversion system comprises a conversion unit and a control unit; the conversion unit comprises a first bridge arm, a second bridge arm, an input inductance element, a main capacitor element, an exciting inductance element and a transformation element; the conversion method comprises the steps of being performed by the control unit: generating a first duty cycle based on an output voltage of the conversion unit; controlling the first switch and the second switch to be simultaneously turned on in an interval in the switching interval based on the first duty cycle; and extending turning on one of the first switch and the second switch until a stop condition is satisfied depending on the polarity of the input voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:轉換系統</p>  
        <p type="p">101:轉換單元</p>  
        <p type="p">102:控制單元</p>  
        <p type="p">103:第一橋臂</p>  
        <p type="p">1031:第一開關</p>  
        <p type="p">10311:第一開關的第一端</p>  
        <p type="p">10312:第一開關的第二端</p>  
        <p type="p">10313:第一開關的第三端</p>  
        <p type="p">1032:第二開關</p>  
        <p type="p">10321:第二開關的第一端</p>  
        <p type="p">10322:第二開關的第二端</p>  
        <p type="p">10323:第二開關的第三端</p>  
        <p type="p">1033:第一中心點</p>  
        <p type="p">104:第二橋臂</p>  
        <p type="p">1041:第一導通元件</p>  
        <p type="p">10411:第一導通元件的第一端</p>  
        <p type="p">10412:第一導通元件的第二端</p>  
        <p type="p">1042:第二導通元件</p>  
        <p type="p">10421:第二導通元件的第一端</p>  
        <p type="p">10422:第二導通元件的第二端</p>  
        <p type="p">1043:第二中心點</p>  
        <p type="p">105:輸入電感元件</p>  
        <p type="p">106:主電容元件</p>  
        <p type="p">107:激磁電感元件</p>  
        <p type="p">108:變壓元件</p>  
        <p type="p">1083:標註圓點</p>  
        <p type="p">1081:初級側</p>  
        <p type="p">1082:次級側</p>  
        <p type="p">109:電源</p>  
        <p type="p">110:負載</p>  
        <p type="p">n:正數</p>  
        <p type="p">1a:第一並聯點</p>  
        <p type="p">1b:第二並聯點</p>  
        <p type="p">Do:輸出二極體</p>  
        <p type="p">Co:輸出電容</p>  
        <p type="p">R&lt;sub&gt;L&lt;/sub&gt;:輸出負載電阻</p>  
        <p type="p">Vo:輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="552" publication-number="202610675"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610675.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610675</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134997</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗氧化及抑制體脂肪之錠劑結構及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240924B">A61K36/02</main-classification>  
        <further-classification edition="200601120240924B">A61K36/48</further-classification>  
        <further-classification edition="200601120240924B">A61K36/82</further-classification>  
        <further-classification edition="200601120240924B">A61K36/28</further-classification>  
        <further-classification edition="200601120240924B">A61K36/482</further-classification>  
        <further-classification edition="200601120240924B">A61K36/67</further-classification>  
        <further-classification edition="200601120240924B">A61K47/38</further-classification>  
        <further-classification edition="200601120240924B">A61K47/12</further-classification>  
        <further-classification edition="200601120240924B">A61K9/20</further-classification>  
        <further-classification edition="200601120240924B">A61P3/04</further-classification>  
        <further-classification edition="200601120240924B">A61P39/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昭輝實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳家榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林睿澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳行一</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種抗氧化及抑制體脂肪之錠劑結構及其製造方法，係由粉體型態之複合配方混合後所共構而成的固體型態，其包含一環狀面與上、下端面，該上、下端面係概呈弧凸狀，連接於該環狀面的相對兩端，該複合配方係包含粉體型態之藍藻粉、白腎豆萃取物、綠茶萃取物、向日葵種子萃取物、決明子萃取物、矽化微晶纖維素，交聯羧甲基纖維素鈉、硬脂酸鎂及胡椒萃取物（胡椒鹼），將複合配方經由60篩目(Mesh)之篩網、40~80目的混料造粒及重量600mg、硬度＞8kg條件之打錠，所製成之錠劑可讓使用者易於日常生活中服用，有效降低高熱量食物造成體重、體脂肪量與體脂肪率、血糖濃度等升高，進而達到抗氧化及抑制體脂肪之效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:抗氧化及抑制體脂肪之錠劑</p>  
        <p type="p">11:環狀面</p>  
        <p type="p">12:上端面</p>  
        <p type="p">13:下端面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="553" publication-number="202611872"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611872.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611872</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134998</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>立體圖比對方法</chinese-title>  
        <english-title>COMPARISON METHOD FOR STEREO VIEWS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241007B">G06T19/20</main-classification>  
        <further-classification edition="202401120241007B">G06T3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡中旗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, ZHONG-QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴祐吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏智斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHIH-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣鎧駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, KAI-JYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張明淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MING-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倪崇勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NI, CHUNG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">立體圖比對方法包含以下步驟：根據第一立體圖的對應圖層的線型資料及第二立體圖的對應圖層的線型資料，決定第二立體圖的對應圖層的第一形變量；根據第一立體圖的對應圖層的線型資料、第二立體圖的對應圖層的線型資料、及第一形變量，產生用以將第二立體圖的對應圖層轉換成多個轉換圖層的多個轉換矩陣，其中多個轉換圖層的多個第二形變量小於第一形變量；從多個轉換矩陣中選擇特定轉換矩陣進行轉換以產生特定轉換圖層；以及將特定轉換圖層與第一立體圖的對應圖層比較，找出特定轉換圖層與第一立體圖的對應圖層之間的差異特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A comparison method for stereo views includes following steps of: determining a first deformation of a corresponding layer of a second stereo view, according to linear data of a corresponding layer of a first stereo view and linear data of the corresponding layer of the second stereo view; generating multiple transformation matrix configured to transform the corresponding layer of the second stereo view into multiple transformed layers, according to the linear data of the corresponding layer of the first stereo view, the linear data of the corresponding layer of the second stereo view, and the first deformation, wherein multiple second deformations of the multiple transformed layers is less than the first deformation; selecting a specific transformation matrix from the multiple transformation matrix to execute transformation, to generate a specific transformed layer; and comparing the specific transformed layer with the corresponding layer of the first stereo view to find a different characteristic between the specific transformed layer and the corresponding layer of the first stereo.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140B:操作</p>  
        <p type="p">141B~144B:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="554" publication-number="202612421"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612421.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612421</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伺服器</chinese-title>  
        <english-title>SERVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H05K7/14</main-classification>  
        <further-classification edition="200601120241101B">H05K7/18</further-classification>  
        <further-classification edition="200601120241101B">G06F1/16</further-classification>  
        <further-classification edition="200601120241101B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種伺服器，包含殼體、插槽、滑軌以及滑塊。殼體包含相連的頂板以及背板。插槽設置於背板，並鄰近背板連接頂板的邊緣。滑軌位於插槽與邊緣之間。滑塊可滑動地銜接滑軌。當滑塊沿著滑軌滑動至與插槽對齊時，滑塊在插槽的插拔方向上與插槽靠近邊緣的部分重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a server that includes a housing, a slot, a rail, and slider. The housing includes a top plate and a back plate connected to each other. The slot is disposed on the back plate and adjacent to an edge of the back plate connected to the top plate. The rail is located between the slot and the edge. The slider is slidably engaged with the rail. When the slider slides along the rail to be aligned with the slot, the slider overlaps a portion of the slot proximate to the edge in an insertion and removal direction of the slot.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:殼體</p>  
        <p type="p">110:頂板</p>  
        <p type="p">120:背板</p>  
        <p type="p">122:邊緣</p>  
        <p type="p">200:插槽</p>  
        <p type="p">210:卡栓缺口</p>  
        <p type="p">220:插入口</p>  
        <p type="p">300:滑軌</p>  
        <p type="p">400:滑塊</p>  
        <p type="p">410:本體部</p>  
        <p type="p">4102:底面</p>  
        <p type="p">4104:斜面</p>  
        <p type="p">420:延伸部</p>  
        <p type="p">500:傳輸線</p>  
        <p type="p">510:彈性片</p>  
        <p type="p">520:連接頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="555" publication-number="202612435"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612435.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612435</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135008</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有定向導熱功能的電路板元件及其製作方法</chinese-title>  
        <english-title>CIRCUIT BOARD ASSEMBLY WITH DIRECTIONAL HEAT CONDUCTION FUNCTION AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商慶鼎精密電子（淮安）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QING DING PRECISION ELECTRONICS (HUAIAN) CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牛啟強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIU, QI-QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱賢江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, XIAN-JIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李衛祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEI-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種具有定向導熱功能的電路板元件及其製作方法。本申請通過在內埋的第一電子元件表面設置第一導熱層和第二導熱層，第一電子元件產生的熱量將通過第一導熱層沿水平方向傳輸，且第二導熱層內的相變材料將吸收豎直方向上的熱量，在豎直方向上起到隔熱的作用，因此熱量只能沿著水平方向定向傳輸到電路板元件的外部，而並不能傳輸至表面的第二電子元件，從而實現了在不影響表面的第二電子元件的前提下，解決了內埋的第一電子元件的散熱問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a circuit board assembly with directional heat conduction function and a manufacturing method thereof. The present application achieves directional heat dissipation by arranging the first heat conduction layer and the second heat conduction layer on a surface of the embedded first electronic component. The heat generated by the first electronic component is transmitted horizontally through the first heat conduction layer. Meanwhile, the phase change material within the second heat conduction layer absorbs heat in the vertical direction, thus acting as a thermal insulation in the vertical direction. As a result, heat can only be transmitted directionally along the horizontal direction to the exterior of the circuit board assembly, and cannot be transmitted to the second electronic component on the surface. This solves the heat dissipation problem of the embedded first electronic component without affecting the second electronic component on the surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路板元件</p>  
        <p type="p">10:第一電路板</p>  
        <p type="p">20:第一電子元件</p>  
        <p type="p">30:第一導熱層</p>  
        <p type="p">40:第二導熱層</p>  
        <p type="p">50:第二電路板</p>  
        <p type="p">60:第二電子元件</p>  
        <p type="p">70，80:錫膏</p>  
        <p type="p">11:第一基板</p>  
        <p type="p">12:第二基板</p>  
        <p type="p">13:黏結層</p>  
        <p type="p">111:第一基材層</p>  
        <p type="p">112:第一線路層</p>  
        <p type="p">113:導通孔</p>  
        <p type="p">123:導通孔</p>  
        <p type="p">133:導通孔</p>  
        <p type="p">143:導通孔</p>  
        <p type="p">114，53:防焊層</p>  
        <p type="p">121:第二基材層</p>  
        <p type="p">122:第二線路層</p>  
        <p type="p">124:覆蓋膜層</p>  
        <p type="p">101:第一開槽</p>  
        <p type="p">102:第二開槽</p>  
        <p type="p">103:第三開槽</p>  
        <p type="p">31:凸起</p>  
        <p type="p">41:襯底層</p>  
        <p type="p">42:功能層</p>  
        <p type="p">420:開孔</p>  
        <p type="p">43:相變材料</p>  
        <p type="p">51:第三基材層</p>  
        <p type="p">52:第三線路層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="556" publication-number="202610710"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610710.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610710</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135017</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>免安裝工具之過濾器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">B01D27/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溢泰實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林勝男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHENG NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MING CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種免安裝工具之過濾器，其包含一濾蓋、一濾瓶組件、一切換件以及一快拆裝置，濾蓋具有一相連結之第一端部及一第二端部，第一端部內側設有與水路流道相通之進、出水孔道，第二端部設有一以上嵌溝，濾瓶組件上端緣設具一鎖合部及一抵撐擋塊，內側容設一濾芯，切換件具有一把手及一控制軸桿與濾蓋之水路流道接設，用以切換水路流道進水模式，快拆裝置包括一以上活動組件、一推抵件、一扣件，活動組件呈可彈性往復伸縮於濾蓋第二端部嵌溝，推抵件外側具有一擋部及套合部，內側具有一鎖結部與濾瓶上端鎖合部對應鎖設，扣件設於推抵件套合部，藉此，使操作濾瓶往上推移，推抵件擋部抵入活動組件上方，並令活動組件位於推抵件擋部及扣件間呈卡合狀態，完成濾瓶鎖設；使操作濾瓶往上推至頂點再迅速下拉，利用推動濾瓶上下位移作動，令扣件可移動地抵掣活動組件並與之呈可上下交替錯位對置，由推抵件擋部帶動扣件同步下移，完成濾瓶拆卸，俾達一免工具便利性高可供快速鎖定或拆裝之過濾器。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">100:過濾器</p>  
        <p type="p">20:濾蓋</p>  
        <p type="p">21:第一端部</p>  
        <p type="p">213、214:進、出水接頭</p>  
        <p type="p">22:第二端部</p>  
        <p type="p">23:護套</p>  
        <p type="p">24:固定支架</p>  
        <p type="p">30:濾瓶組件</p>  
        <p type="p">31:濾瓶</p>  
        <p type="p">40:切換件</p>  
        <p type="p">41:把手</p>  
        <p type="p">411:握柄</p>  
        <p type="p">412:指示線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="557" publication-number="202611128"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611128.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611128</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135081</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含磷聚合物、樹脂組合物及其製品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">C08F212/32</main-classification>  
        <further-classification edition="200601120241105B">C08F230/02</further-classification>  
        <further-classification edition="200601120241105B">C08L25/00</further-classification>  
        <further-classification edition="200601120241105B">C08L43/02</further-classification>  
        <further-classification edition="200601120241105B">C08L101/02</further-classification>  
        <further-classification edition="200601120241105B">C08J5/00</further-classification>  
        <further-classification edition="200601120241105B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商台光電子材料（昆山）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚興星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王榮濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉程松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛軼強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
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    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種含磷聚合物，包括衍生自第一單體的結構單元以及衍生自第二單體的結構單元。本發明還公開一種包括含磷聚合物的樹脂組合物及其製品。前述樹脂組合物包括：100重量份的自由基聚合性樹脂，所述自由基聚合性樹脂包括含不飽和碳碳雙鍵的聚苯醚樹脂、馬來醯亞胺樹脂、聚烯烴或其組合；以及12重量份至100重量份的含磷聚合物。前述樹脂組合物或其製品可於玻璃轉化溫度、阻燃性、介電損耗係數、剝離強度、Z軸熱膨脹率、基板外觀、吸濕耐熱性和多層板耐熱性等特性中的至少一者獲得改善。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="558" publication-number="202611799"> 
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      <tif no="1" file="202611799.zip"/>
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      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611799</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預測商品訂購量之裝置、方法及記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR PREDICTING PRODUCT ORDER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250211B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250211B">G06Q30/06</further-classification>  
        <further-classification edition="202301120250211B">G06Q30/02</further-classification>  
        <further-classification edition="200601120250211B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董火明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, HUOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張攀峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, PANFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡馬爾　尤努斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMAL, YUNUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何立文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, LIWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之裝置可包括：一個以上之處理器；及一個以上之記憶體，其等儲存有用以藉由上述一個以上之處理器而執行之命令；上述裝置以如下方式構成，即，於執行上述命令時，上述一個以上之處理器如下：獲得指示商品之第1時間段內之實際訂購量與預測訂購量之資訊；確定上述第1時間段中之除預先確定之類型之日期以外之其餘日期的個數是否為基準值以上；根據確定上述其餘日期之個數為上述基準值以上，基於上述其餘日期內之上述商品之實際訂購量與預測訂購量，確定緊接於上述第1時間段之後的第2時間段內之第1參數值；且上述第1參數值可用於確定上述第2時間段內之上述商品之平均預測訂購量與上述第2時間段內之上述商品之預測訂購量的分位數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S810:動作</p>  
        <p type="p">S820:動作</p>  
        <p type="p">S830:動作</p>  
        <p type="p">S840:動作</p>  
        <p type="p">S850:動作</p>  
        <p type="p">S860:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="559" publication-number="202611821"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611821.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611821</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135264</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預測商品需求量之裝置、方法及記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR PREDICTING PRODUCT DEMAND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250211B">G06Q30/02</main-classification>  
        <further-classification edition="200601120250211B">G06F17/40</further-classification>  
        <further-classification edition="202301120250211B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董火明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, HUOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張攀峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, PANFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之裝置可包括：一個以上之處理器；及一個以上之記憶體，其等儲存有用以藉由上述一個以上之處理器而執行之命令；上述裝置以如下方式構成，即，於執行上述命令時，上述一個以上之處理器如下：於銷售商品之第1時間段中，識別曾對上述商品應用過促銷之一個以上之促銷產生區間；基於上述一個以上之促銷產生區間內之上述商品之需求量，確定上述商品之促銷加權值；獲得指示緊接於上述第1時間段之後的第2時間段內之上述商品之第1預測需求量之資訊，上述第1預測需求量係利用以預測商品之需求量之方式學習之學習模型而算出者；基於指示上述商品之促銷加權值及上述商品之第1預測需求量之資訊，產生與第2預測需求量相關之資訊，該第2預測需求量係隨著產生上述商品之促銷而產生者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S710:動作</p>  
        <p type="p">S720:動作</p>  
        <p type="p">S730:動作</p>  
        <p type="p">S740:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="560" publication-number="202611822"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611822.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611822</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135377</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以顯示商品之優惠資訊之裝置、方法及記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR DISPLAYING BENEFIT INFORMATION OF PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q30/02</main-classification>  
        <further-classification edition="202301120250303B">G06Q30/0207</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許乃京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, NAEKYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李海妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAEYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜珠恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, JU EUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃周安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, JU AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONGEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李延成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YEONSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　伊萊恩　智英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIM, ELAINE JI YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安田　傑弗瑞　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUDA, JEFFREY WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭志秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GWAK, JISU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種用以顯示商品之優惠資訊之電子裝置。本發明之一實施例之電子裝置可包括：一個以上之處理器；及一個以上之記憶體，其等儲存有用以藉由上述一個以上之處理器執行之命令；且上述電子裝置係以如下方式構成：於執行上述命令時，上述一個以上之處理器獲得用戶對電子商務服務之目標商品之商品購買頁面之訪問請求，基於上述用戶之賬戶資訊，識別於購買上述目標商品時可向上述用戶提供之優惠資訊，並產生用於輸出上述商品購買頁面之第1網頁資訊，使得上述商品購買頁面包括不顯示基於上述識別出之優惠資訊而產生之折扣金額或折扣價格之第1優惠介面，並將上述第1網頁資訊傳輸至上述用戶之終端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310,S320,S330,S340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="561" publication-number="202611806"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611806.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611806</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135378</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預測休息日之商品之需求變化之方法、記錄媒體及裝置</chinese-title>  
        <english-title>METHOD, RECORDING MEDIUM, AND APPARATUS OF PREDICTING CHANGE IN DEMAND FOR GOODS DURING HOLIDAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q10/087</main-classification>  
        <further-classification edition="202301120250303B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡馬爾　尤努斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMAL, YUNUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿加瓦爾　拉胡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGARWAL, RAHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴在敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JAEMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種預測休息日之商品之需求變化之技術。本發明之一實施例之方法係藉由電子裝置而實行者，其可包括如下步驟：基於對象商品之需求之變動，判定自過去休息日日期起之基準區間內是否存在發生需求之異常值之基準日期，該過去休息日日期係基於休息日資訊而確定者；基於判定為存在上述基準日期，確定包括上述基準日期之影響區間，上述影響區間係發生上述對象商品之需求之變動之休息日效果所影響之區間；及產生表示上述影響區間中之需求之變動之排列資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:環境</p>  
        <p type="p">110:管理裝置</p>  
        <p type="p">120:用戶終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="562" publication-number="202612298"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612298.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612298</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135471</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含多用途雷射源的相干光傳輸系統及其光收發器</chinese-title>  
        <english-title>COHERENT OPTICAL SYSTEM WITH MULTI-USE LASER EMITTER AND OPTICAL TRANSCEIVER THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250102B">H04B10/60</main-classification>  
        <further-classification edition="201301120250102B">H04B10/61</further-classification>  
        <further-classification edition="201301120250102B">H04B10/40</further-classification>  
        <further-classification edition="201301120250102B">H04B10/25</further-classification>  
        <further-classification edition="201301120250102B">H04B10/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧波環球廣電科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBAL TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯偉康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, WEIKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊璐陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QI, LUYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種相干光傳輸系統，包含一第一光收發器和一第二光收發器，兩光收發器各包含雷射光源、分光模組、光調制器、光混頻器及光偵測器。雷射光源用於發出一初始光。分光模組與該雷射光源光耦合，用於將雷射光源發出的光劃分為參考光及訊號光。光調制器與該分光模組光耦合，用於調制訊號光。光混頻器與該分光模組光耦合。光偵測器與該光混頻器光耦合。第一光收發器的光混頻器用於將第一光收發器的參考光與第二光收發器的訊號光混頻，且第二光收發器的光混頻器用於將第二光收發器的參考光與第一光收發器的訊號光混頻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A coherent optical transmission system includes a first optical transceiver and a second optical transceiver, each including a laser light source, an optical splitting module, an optical modulator, an optical mixer and an optical detector. The laser light source is configured to emit an initial light. The optical splitting module is optically coupled to the laser light source and configured to divide the light emitted by the laser light source into reference light and signal light. The optical modulator is optically coupled to the optical splitting module and configured to modulate the signal light. The optical mixer is optically coupled to the optical splitting module. The optical detector is optically coupled to the optical mixer. The optical mixer of the first optical transceiver is configured to optically mixing the reference light of the first optical transceiver and the signal light of the second optical transceiver, and the optical mixer of the second optical transceiver is configured to optically mixing the reference light of the second optical transceiver and the signal light of the first optical transceiver.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:相干光傳輸系統</p>  
        <p type="p">11,12:光收發器</p>  
        <p type="p">111,121:雷射光源</p>  
        <p type="p">112,122:分光器</p>  
        <p type="p">113,123:波長選擇元件</p>  
        <p type="p">114,124:訊號發射器</p>  
        <p type="p">115,125:光調制器</p>  
        <p type="p">116,126:波長選擇元件</p>  
        <p type="p">117,127:光混頻器</p>  
        <p type="p">118,128:光偵測器</p>  
        <p type="p">119,129:訊號處理器</p>  
        <p type="p">S1,S1’,S2,S2’,S3,S3’:訊號光</p>  
        <p type="p">R1,R1’,R2,R2’:參考光</p>  
        <p type="p">C,C’:耦合光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="563" publication-number="202611823"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611823.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611823</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>商品評價顯示方法及其系統</chinese-title>  
        <english-title>PRODUCT REVIEW DISPLAY METHOD AND SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250213B">G06Q30/02</main-classification>  
        <further-classification edition="202301120250213B">G06Q30/06</further-classification>  
        <further-classification edition="201901120250213B">G06F16/9538</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露實施例的商品評價顯示方法透過計算裝置執行，包括如下步驟：渲染目標商品對應的評價頁面；和在該評價頁面顯示與該目標商品相關的評價，顯示與該目標商品相關的評價的步驟包括如下步驟：接收對於該目標商品的一個或多個屬性中每個屬性的選項的選擇；顯示該目標商品中具有對於該一個或多個屬性中每個屬性選擇的該選項的商品的評價。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A product review display method is performed by a computing device, and may include rendering a review page corresponding to a target product, and displaying a review related to the target product on the review page, wherein the displaying of the review related to the target product includes receiving a selection for an option of each of one or more attributes of the target product, and displaying a review for a product having the selected option for each of the one or more attributes among the target products.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S210、S220、S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="564" publication-number="202611808"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611808.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611808</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訂貨資訊管理方法及其系統</chinese-title>  
        <english-title>METHOD FOR MANAGING PURCHASE ORDER INFORMATION AND SYSTEM THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q10/0875</main-classification>  
        <further-classification edition="202301120250303B">G06Q10/087</further-classification>  
        <further-classification edition="202301120250303B">G06Q10/04</further-classification>  
        <further-classification edition="200601120250303B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁修坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, XIUKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臧勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZANG, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種訂貨資訊管理方法及其系統。根據本揭露一實施例的訂貨資訊管理方法，透過計算裝置執行，可以包括如下步驟：從使用者終端接收第一商品類別中包括的第一商品的訂貨請求；使用預定義的該第一商品類別的訂貨決策場景中包括的訂貨規則，判斷是否批准該訂貨請求；和使用該判斷的結果，確定是否根據該訂貨請求進行該第一商品的訂貨。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There are provided a method for managing purchase order information and a system therefor. The method for managing purchase order information is performed by a computing device, and may include receiving a purchase order request for a first product included in a first product category from a user terminal, deciding whether or not to approve the purchase order request using a purchase order rule included in a purchase order determination scenario predefined for the first product category, and determining whether or not to order the first product according to the purchase order request using a result of the decision.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:服務伺服器</p>  
        <p type="p">20:使用者終端</p>  
        <p type="p">21:第一管理員終端</p>  
        <p type="p">22:第二管理員終端</p>  
        <p type="p">30:第三管理員終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="565" publication-number="202611426"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611426.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611426</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135795</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流體連接器</chinese-title>  
        <english-title>FLUID COUPLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241114B">F16L37/36</main-classification>  
        <further-classification edition="200601120241114B">F16L37/373</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許修源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSIU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀諆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAO-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李凌雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LING-XIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種流體連接器，包括具有流體通道的本體，轉動設置於所述流體通道內具有通孔的閥構件，連接至所述閥構件以控制所述閥構件轉動以實現打開和關閉的把手以及鎖銷組件，所述本體具有用於與一對接連接器結合的對接表面，所述對接表面凹設形成有收容所述鎖銷組件的收容孔，所述流體連接器還包括限制所述把手操控所述閥構件轉動的鎖定構件及控制所述鎖銷組件運動的操作件。本發明中流體連接器通過鎖定構件、操作件以及鎖銷組件與把手之間的配合，防止連接器因誤操作而導通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fluid coupling includes a body having a fluid channel, a valve member having a through hole rotatably arranged in the fluid channel, a handle connected to the valve member to control the rotation of the valve member to achieve opening and closing, and an interlock member assembly. The body has a docking surface for combining with a complementary coupling, and the docking surface is concavely formed with a receiving hole for receiving the interlock member assembly. The fluid coupling also includes a locking member for limiting the rotation of the valve member by the handle and an actuator for controlling the movement of the interlock member assembly. In the present invention, the cooperation between the locking member, the actuator, the interlock member assembly and the handle can prevent the fluid coupling from being opened by mistake.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100’:對接連接器</p>  
        <p type="p">112’:對接孔</p>  
        <p type="p">100:流體連接器</p>  
        <p type="p">111:收容孔</p>  
        <p type="p">3:把手</p>  
        <p type="p">32:凹槽</p>  
        <p type="p">41:第一桿</p>  
        <p type="p">411:收容腔</p>  
        <p type="p">42:第二桿</p>  
        <p type="p">421:抵接部</p>  
        <p type="p">431:第一彈簧</p>  
        <p type="p">432:第二彈簧</p>  
        <p type="p">433:第三彈簧</p>  
        <p type="p">5:螺釘</p>  
        <p type="p">6:操作件</p>  
        <p type="p">61:固定桿</p>  
        <p type="p">62:支腳</p>  
        <p type="p">63:驅動部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="566" publication-number="202611800"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611800.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611800</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135946</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以確定商品之庫存狀態之裝置、方法及記錄有命令之記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR DETERMINING THE STOCK STATUS OF ITEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250213B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250213B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250213B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏巍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臧勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZANG, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁修坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, XIUKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹世才</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAN, SHICAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種裝置，該裝置包括：一個以上之處理器；及一個以上之記憶體，其等儲存有用以藉由上述一個以上之處理器而執行之命令；上述裝置以如下方式構成，即，於執行上述命令時，上述一個以上之處理器如下：獲得與商品於第1日期之庫存量相關之第1資訊；基於以預計上述商品之交貨率之方式學習之學習模型而產生第2資訊，該第2資訊係與上述商品於上述第1日期至上述第1日期之後的第2日期之間的期間內之交貨率相關者；獲得第3資訊，該第3資訊係與上述商品於上述第1日期至上述第2日期之間的期間內之出庫量相關者；基於上述第1資訊、上述第2資訊及上述第3資訊，確定上述商品於上述第1日期至上述第2日期之間的期間內之庫存狀態；基於上述庫存狀態來確定是否存在庫存不足；且上述學習模型係將上述商品之訂貨歷史及交貨歷史用作學習資料而學習之模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:裝置</p>  
        <p type="p">120:用戶終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="567" publication-number="202611801"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611801.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611801</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135947</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以管理商品之庫存之裝置、方法及記錄命令之記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR MANAGING THE STOCK OF ITEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250213B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250213B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250213B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏巍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臧勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZANG, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁修坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, XIUKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹世才</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAN, SHICAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種裝置，該裝置包括一個以上之處理器及儲存有用以藉由上述一個以上之處理器而執行之命令之一個以上之記憶體；且於執行上述命令時，上述一個以上之處理器以如下方式構成：獲得與商品之交貨率(fill rate)有關之第1資訊、與上述商品之庫存量有關之第2資訊、或與上述商品之出庫量有關之第3資訊中之至少一者；基於上述第1資訊、上述第2資訊或上述第3資訊中之至少一者，確定用以消除或防止上述商品之庫存不足(Out-Of-Stock)狀態之推薦措施；產生使得將上述推薦措施顯示於頁面之顯示資訊；上述推薦措施係指示與供應者(vendor)就上述商品之現有訂貨進行商議之第1措施、指示對上述商品產生新訂貨之第2措施、或指示變更上述商品之上述現有訂貨之訂貨狀態之第3措施中的一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:裝置</p>  
        <p type="p">120-1:用戶終端</p>  
        <p type="p">120-2:用戶終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="568" publication-number="202611802"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611802.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611802</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135948</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物流中心出庫管理方法及裝置</chinese-title>  
        <english-title>FULFILLMENT CENTER OUTBOUND MANAGEMENT METHOD AND DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250203B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250203B">G06Q10/087</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙培君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, PEIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬赫什瓦里　迪柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHESHWARI, DEEPAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>強尼　拉維　拉朱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHN, RAVI RAJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋　志訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, JI HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納納維爾　羅漢　馬尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANAWARE, ROHAN MANIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露系有關於預測出庫量並遷移庫存，管理物流中心的出庫量的方法及其裝置。更詳細地，系有關於設置第一物流中心的目標出庫減少量，搜索要遷移第一物流中心的商品的第二物流中心，基於第二物流中心的庫存量調整第一物流中心的目標出庫減少量，基於第一物流中心和第二物流中心的配送數據確定要遷移的商品的種類和量，基於確定的商品的種類和量，確認是否可達到目標出庫減少量，若不能達到目標出庫減少量，則調整從第一物流中心要遷移至第二物流中心的商品的種類和量的方法及裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method and an apparatus for managing the outbound amount of a fulfillment center by predicting the outbound amount and transferring inventory. More specifically, the present disclosure relates to a method and an apparatus for setting a target outbound reduction amount in a first fulfillment center; adjusting a target outbound reduction amount in the first fulfillment center based on an inventory amount of a second fulfillment center; determining the type and amount of products to be transferred based on delivery data of the first and second fulfillment centers; checking that the target outbound reduction amount may be achieved based on the determined type and amount of the products, and adjusting the type and amount of products to be transferred from the first fulfillment center to the second fulfillment center when the target outbound reduction amount may not be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100,S200,S300,S400,S500,S600:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="569" publication-number="202611824"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611824.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611824</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135981</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於地區的優惠券管理方法及裝置</chinese-title>  
        <english-title>REGION-BASED COUPONS MANAGEMENT METHOD AND APPARATUS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250122B">G06Q30/02</main-classification>  
        <further-classification edition="202301120250122B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250122B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露系有關於基於地區的優惠券管理方法及裝置。具體地，系有關於在優惠券中追加地區資訊，藉由一個優惠券管理系統可管理多個地區的優惠券的方法。並且，系有關於考慮其他地區的特性，轉換以往地區的優惠券而生成及管理具有相同效果的優惠券的方法。根據本揭露的一實施例，由計算系統執行的基於地區的優惠券管理方法可包括：輸入打折資訊的步驟，將與上述打折資訊相關的第一地區資訊追加到上述打折資訊的步驟，基於上述打折資訊，生成第一優惠券的步驟，向上述第一地區的客戶顯示上述第一優惠券的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are region-based coupons management method and apparatus. Specifically, the present disclosure relates to a method for managing coupons for a plurality of regions with a single coupon management system by adding regional information to the coupons. In addition, the present disclosure relates to a method for generating and managing coupons having the same effect by converting coupons of existing regions by considering the characteristics of other regions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300、S400:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="570" publication-number="202612337"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612337.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612337</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136245</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像解碼裝置及方法</chinese-title>  
        <english-title>IMAGE DECODING APPARATUS AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250102B">H04N19/85</main-classification>  
        <further-classification edition="201401120250102B">H04N19/89</further-classification>  
        <further-classification edition="201401120250102B">H04N19/513</further-classification>  
        <further-classification edition="201401120250102B">H04N19/61</further-classification>  
        <further-classification edition="201401120250102B">H04N19/42</further-classification>  
        <further-classification edition="201401120250102B">H04N19/176</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張義樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YI-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳伍軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WU-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾偉民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, WEI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAI, CHI-WANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像解碼方法，包含：對根據影像間編碼技術產生的第N個影像畫面判斷錯誤區塊的發生；使影像編碼裝置在影像解碼裝置接收到第N+P-1個影像畫面的對應區塊時接收到錯誤回報資訊，並根據影像間編碼技術對第N+P個影像畫面編碼；擷取第N個影像畫面中錯誤區塊發生前的區塊的移動向量資訊及殘值資訊，根據影像間編碼技術解碼；設置移動向量資訊及殘值資訊為零，根據影像間編碼技術對自錯誤區塊至第N+P-1個影像畫面的最後區塊的區塊解碼；以及擷取對應第N+P個影像畫面的區塊的移動向量資訊及殘值資訊，根據影像間編碼技術對此些區塊解碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image decoding method used in an image decoding apparatus that includes steps outlined below. Occurrence of an error block in an N-th image frame generated according to an inter-frame coding technology is determined. Error report information is received by an image encoding apparatus at a time spot that the image decoding apparatus receives a corresponding block of an N+P-1-th image frame and the N+P image frame is encoded according to an inter-frame coding technology. Motion vector information and residue information of blocks in the N-th image frame before the occurrence of the error block are retrieved and are decoded according to the inter-frame coding technology. The motion vector information and the residue information are set to be zero to decode the blocks from the error block to a final block of the N+P-1-th image frame according to the inter-frame coding technology. The motion vector information and the residue information of the inter-frame coding blocks in the N+P image frame are retrieved to decode the blocks therein according to the inter-frame coding technology.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:影像解碼方法</p>  
        <p type="p">S310~S350:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="571" publication-number="202612338"> 
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      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612338</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136246</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像解碼裝置及方法</chinese-title>  
        <english-title>IMAGE DECODING APPARATUS AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250102B">H04N19/85</main-classification>  
        <further-classification edition="201401120250102B">H04N19/89</further-classification>  
        <further-classification edition="201401120250102B">H04N19/61</further-classification>  
        <further-classification edition="201401120250102B">H04N19/42</further-classification>  
        <further-classification edition="201401120250102B">H04N19/172</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張義樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YI-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳伍軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WU-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾偉民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, WEI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAI, CHI-WANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像解碼方法，包含：對根據影像間編碼技術產生的第N個影像畫面判斷錯誤區塊的發生；使影像編碼裝置在影像解碼裝置接收到第N+P-1個影像畫面的對應區塊時接收到錯誤回報資訊；擷取第N個影像畫面中錯誤區塊發生前的區塊的移動向量資訊及殘值資訊，根據影像間編碼技術解碼；自被辨識為平移影像畫面的第N-1個影像畫面擷取平移向量以設置為移動向量資訊，並設置殘值資訊為零，根據影像間編碼技術對自錯誤區塊至第N+P-1個影像畫面的最後區塊的區塊解碼；以及擷取對應第N+P個影像畫面的區塊的移動向量資訊及殘值資訊，根據影像間編碼技術對此些區塊解碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image decoding method used in an image decoding apparatus that includes steps outlined below. Occurrence of an error block in an N-th image frame generated according to an inter-frame coding technology is determined. Error report information is received by an image encoding apparatus at a time spot that the image decoding apparatus receives a corresponding block of an N+P-1-th image frame and the N+P image frame is encoded according to the inter-frame coding technology. Motion vector information and residue information of blocks in the N-th image frame before the occurrence of the error block are retrieved and are decoded according to the inter-frame coding technology. A panning motion vector is retrieved from an N-1-th image frame identified to be a panning image frame to be set as the motion vector information and the residue information is set to be zero to decode the blocks from the error block to a final block of the N+P-1-th image frame according to the inter-frame coding technology. The motion vector information and the residue information of the inter-frame coding blocks in the N+P image frame are retrieved to decode the blocks therein according to the inter-frame coding technology.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:影像解碼方法</p>  
        <p type="p">S410~S450:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
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      <tif no="1" file="202612339.zip"/>
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      <volno>24</volno>  
      <isuno>6</isuno>  
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        <document-id> 
          <doc-number>202612339</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136247</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像解碼裝置及方法</chinese-title>  
        <english-title>IMAGE DECODING APPARATUS AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250102B">H04N19/89</main-classification>  
        <further-classification edition="201401120250102B">H04N19/85</further-classification>  
        <further-classification edition="201401120250102B">H04N19/513</further-classification>  
        <further-classification edition="201401120250102B">H04N19/61</further-classification>  
        <further-classification edition="201401120250102B">H04N19/42</further-classification>  
        <further-classification edition="201401120250102B">H04N19/176</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳伍軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WU-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾偉民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, WEI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAI, CHI-WANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像解碼方法，包含：對根據影像間編碼技術產生的第N個影像畫面判斷錯誤區塊的發生；使影像編碼裝置在影像解碼裝置接收到第N+P-1個影像畫面的對應區塊時接收到錯誤回報資訊，並根據影像內編碼技術對第N+P個影像畫面編碼；擷取第N個影像畫面中錯誤區塊發生前的區塊的移動向量資訊及殘值資訊，根據影像間編碼技術解碼；設置移動向量資訊以及殘值資訊為零，根據影像間編碼技術對自錯誤區塊至第N+P-1個影像畫面的最後區塊的區塊解碼；以及擷取對應第N+P個影像畫面的影像內參考區塊的殘值資訊，根據影像內編碼技術對影像內參考區塊解碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image decoding method used in an image decoding apparatus that includes steps outlined below. Occurrence of an error block in an N-th image frame generated according to an inter-frame coding technology is determined. Error report information is received by an image encoding apparatus at a time spot that the image decoding apparatus receives a corresponding block of an N+P-1-th image frame and the N+P image frame is encoded according to an intra-frame coding technology. Motion vector information and residue information of blocks in the N-th image frame before the occurrence of the error block are retrieved and are decoded according to the inter-frame coding technology. The motion vector information and the residue information are set to be zero to decode the blocks from the error block to a final block of the N+P-1-th image frame according to the inter-frame coding technology. The residue information of the intra-frame coding blocks in the N+P image frame is retrieved to decode the intra-frame coding blocks according to the intra-frame coding technology.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:影像解碼方法</p>  
        <p type="p">S310~S350:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="573" publication-number="202611427"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611427.zip"/>
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      <volno>24</volno>  
      <isuno>6</isuno>  
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        <document-id> 
          <doc-number>202611427</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136282</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流體連接器</chinese-title>  
        <english-title>FLUID COUPLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241114B">F16L37/36</main-classification>  
        <further-classification edition="200601120241114B">F16L37/373</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許修源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSIU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀諆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAO-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李凌雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LING-XIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種流體連接器，包括具有流體通道的殼體、收容於所述殼體內的設有通孔的球閥、安裝於所述殼體外以操控所述球閥轉動的操作構件及銷構件，所述殼體的前端與前端具有配合孔的適配端連接器配合連接，所述操作構件操控所述球閥以使之能夠在阻斷流體通道的閉合位置和打開流體通道的打開位置之間轉動，當所述球閥處於打開位置時，所述通孔與所述流體通道連通，所述殼體的前端面設置有收容所述銷構件的容置孔，所述容置孔內設置有支撐所述銷構件的彈性構件，當所述流體連接器未與適配端連接器配接時，所述銷構件受所述彈性構件的彈性支撐而伸出所述容置孔，當流體連接器抵接適配端連接器並轉動至銷構件對應適配端連接器的配合孔時，所述銷構件受所述彈性構件的抵壓伸入所述配合孔中，當所述銷構件處於所述配合孔中時，所述操作構件能夠操作所述球閥轉動以打開及閉合，所述銷構件的前端具有引導結構，當所述銷構件處於所述配合孔中且球閥處於閉合時，轉動所述流體連接器，所述銷構件能夠透過所述引導結構的導引而壓縮所述彈性構件以退出所述配合孔，流體連接器僅通過一個銷構件即可實現與適配端連接器之間的可靠對接，並且流體連接器不僅限於與之結構相同的連接器配接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fluid coupling includes a body defining a fluid channel, a ball valve with a through hole contained in the body, an operating member installed outside the body to control the rotation of the ball valve, and a pin member. The front end of the body is mated with an adapter end coupling having a mating hole at the front end, and the operating member controls the ball valve so that it can rotate between a closed position that blocks the fluid channel and an open position that opens the fluid channel. When the ball valve is in the open position, the through hole is connected to the fluid channel, the front end surface of the body is provided with an accommodating hole for accommodating the pin member, and an elastic member for supporting the pin member is disposed in the accommodating hole. When the fluid coupling is not mated with the adapter end coupling, the pin member is elastically supported by the elastic member and extends out of the accommodation hole. When the fluid coupling abuts the adapter end coupling and rotates to the pin member corresponding to the mating hole of the mating end coupling, the pin member is pressed by the elastic member and extends into the mating hole. When the pin member is in the mating hole, the operating member can operate the ball valve to rotate to open and close. The front end of the pin member has a guide structure. When the pin member is in the mating hole and the ball valve is closed, and the fluid coupling is rotated at this time, the pin member can compress the elastic member through the guidance of the guide structure to exit the mating hole. The fluid coupling can achieve reliable docking with the adapter end coupling through only one pin member, and the fluid coupling is not limited to mating with connectors having the same structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1101:主孔</p>  
        <p type="p">1102:拓展孔</p>  
        <p type="p">111:卡爪</p>  
        <p type="p">401:第一凹槽</p>  
        <p type="p">41:上段部</p>  
        <p type="p">42:下段部</p>  
        <p type="p">440:引導面</p>  
        <p type="p">8:限制構件</p>  
        <p type="p">H1:第一高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="574" publication-number="202610746"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610746.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610746</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136579</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拆焊方法及整平裝置</chinese-title>  
        <english-title>DISMANTLING WELDING METHOD AND LEVELING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">B23K1/018</main-classification>  
        <further-classification edition="200601120241230B">B23K3/08</further-classification>  
        <further-classification edition="200601320241230B">B23K101/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭金松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, JIN-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐琴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, QIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔文一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONG, WEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周東海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, DONG-HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王玉濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉文龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEN-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡喜強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, XI-QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開一種拆焊方法及整平裝置，拆焊方法包括將待拆連接板切割成複數報廢段。逐個地加熱每個報廢段，每加熱一個報廢段後，將加熱後之報廢段從主機板分離，直至待拆連接板與主機板分離。於替代連接板設置複數焊球，並將複數焊球壓至同一高度。將替代連接板分成複數連接段。逐個地加熱每個連接段，每加熱一個連接段後，將加熱後之連接段連接於主機板，直至替代連接板連接主機板。使用上述拆焊方法能於一定之程度上防止主機板中間區域之電路系統被高溫破壞，提高了主機板與替代連接板之連接品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application discloses a dismantling welding method and a leveling device, wherein the dismantling welding method comprises cutting a connecting plate to be dismantled into multiple scrap sections. Heat each scrap section one by one, and after heating each scrap section, separate the heated scrap sections from the motherboard until the connecting plate to be dismantled is separated from the motherboard. Set multiple solder balls on the substitute connecting plate and press them to the same height. Divide the substitute connecting plate into multiple connecting section. Heat each connecting section one by one, and after heating each connecting section, connect the heated connecting sections to the motherboard until the substitute connecting plate connects to the motherboard. The above dismantling welding method can prevent the circuit system in the middle area of the motherboard from being damaged by high temperature to a certain extent, and improve the connection quality between the motherboard and the substitute connecting plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1-S5:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="575" publication-number="202611803"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611803.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611803</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136867</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>商品需求預測方法及其系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR FORECASTING DEMAND FOR A PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250208B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250208B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250208B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙培君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, PEIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章希旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, HEE WOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權恩真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, EUN JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何立文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, LIWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種需求預測方法和系統。所述方法包括如下步驟：獲取所述商品的訂單資訊；獲取所述商品的需求歷史資料集；對所述需求歷史資料集進行預處理；從預處理後的所述需求歷史資料集提取與所述訂單資訊中包括的第一交付時間（lead time）對應的需求資料；根據提取的所述需求資料，計算預設的第一期間內的所述商品的預設分位數（quantile）殘差；及根據計算出的所述分位數殘差，計算所述預設的第一期間內的所述商品的第一需求值，所述需求歷史資料集中包括的資料分別由資料對組成，該資料對包括交付時間和實際需求值與預測需求值之間的殘差（residual）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There are provided a method and system for forecasting demand for a product. The method may include obtaining order information for the product, obtaining a demand history data set for the product, performing preprocessing on the demand history data set, extracting demand data corresponding to a first lead time included in the order information from the preprocessed demand history data set, calculating a preset quantile residual for the product during a preset first period based on the extracted demand data, and calculating a first demand value for the product during the preset first period based on the calculated quantile residual, wherein each of data included in the demand history data set may be composed of a data pair including a lead time and a residual between an actual demand value and a forecasted demand value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300、S400、S500、S600:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="576" publication-number="202611902"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611902.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611902</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137188</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>驅動電路及電致變色鏡</chinese-title>  
        <english-title>DRIVING CIRCUIT AND ELECTROCHROMIC GLASS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G09G3/38</main-classification>  
        <further-classification edition="200601120250801B">G09G3/36</further-classification>  
        <further-classification edition="200601120250801B">G02F1/1337</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業桓科技（成都）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE ADVANCED TECHNOLOGY (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業成科技(成都)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業成光電（深圳）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英特盛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>管益章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUAN, I-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖致霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHIH-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅智烜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHIH-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種驅動電路，包括：控制模組，用於輸出控制訊號；放大模組，包括第一放大單元和第二放大單元，所述第一放大模組分別與所述控制模組和所述第二放大模組電性連接，所述第一放大單元用於正向放大所述控制訊號後輸出第一驅動訊號，所述第二放大單元用於將所述第一驅動訊號反向後輸出第二驅動訊號，藉由調變所述控制訊號的幅值，以調節所述第一驅動訊號與所述第二驅動訊號之間的差值。本申請還提供一種包括該驅動電路的電致變色鏡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a driving circuit including a control module for outputting control signal and an amplifying module including a first amplifying unit and a second amplifying unit. The first amplifying unit is electrically connected with the control module and the second amplifying unit respectively. The first amplifying unit is used to output the first driving signal after forward amplifying the control signal, and the second amplifying unit is used to output the second driving signal after reversing the first driving signal. An amplitude of the control signal is modulated to adjust a difference between the first driving signal and the second driving signal. The present disclosure also provides an electrochromic glass including the driving circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:控制模組</p>  
        <p type="p">11:微控制器</p>  
        <p type="p">12:數模轉換器</p>  
        <p type="p">31:第一放大單元</p>  
        <p type="p">310:第一運算放大電路</p>  
        <p type="p">Vip1:第一正向輸入端</p>  
        <p type="p">Vin1:第一反向輸入端</p>  
        <p type="p">Vout1:第一輸出端</p>  
        <p type="p">311:第一電阻</p>  
        <p type="p">312:第二電阻</p>  
        <p type="p">32:第二放大單元</p>  
        <p type="p">320:第二運算放大電路</p>  
        <p type="p">Vip2:第二正向輸入端</p>  
        <p type="p">Vin2:第二反向輸入端</p>  
        <p type="p">Vout2:第二輸出端</p>  
        <p type="p">321:第三電阻</p>  
        <p type="p">322:第四電阻</p>  
        <p type="p">50:第五電阻</p>  
        <p type="p">CS:控制訊號</p>  
        <p type="p">DS1:第一驅動訊號</p>  
        <p type="p">DS2:第二驅動訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="577" publication-number="202611703"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611703.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611703</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137250</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>執行緒分支管理方法和裝置、電子設備、媒體、程式產品</chinese-title>  
        <english-title>THREAD BRANCH MANAGEMENT METHOD AND DEVICE, ELECTRONIC DEVICE, MEDIUM AND PROGRAM PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250102B">G06F9/38</main-classification>  
        <further-classification edition="201801120250102B">G06F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京有竹居網路技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING YOUZHUJU NETWORK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳偉倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEILUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施云峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, YUNFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王劍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種執行緒分支管理方法、執行緒分支管理裝置、電子設備、非暫態電腦可讀取儲存媒體、電腦程式產品。該方法包括：針對執行緒束中的第一執行緒，將第一執行緒的至少部分巢狀的多個條件分支中的第一條件分支的重匯聚指令位址設置為第一條件分支的最鄰近重匯聚指令位址的後序重匯聚指令位址；在執行第一執行緒的過程中，基於第一條件分支的重匯聚指令位址來進行分支管理堆疊的入堆疊。如此，能夠節省分支管理堆疊的硬體儲存空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a thread branch management method, a thread branch management device, an electronic device, a non-transitory computer-readable storage medium, and a computer program product. The method comprises the following steps: for a first thread in a thread bundle, setting a re-convergence instruction address of a first conditional branch among a plurality of conditional branches at least partially nested of the first thread as a subsequent re-convergence instruction address of the nearest re-convergence instruction address of the first conditional branch; during the execution of the first thread, pushing an entry into a branch management stack based on the re-convergence instruction address of the first conditional branch. In this way, the hardware storage space of the branch management stack can be saved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510,520:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="578" publication-number="202612445"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612445.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612445</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137524</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置與其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250102B">H10B12/00</main-classification>  
        <further-classification edition="202501120250102B">H10D64/20</further-classification>  
        <further-classification edition="200601120250102B">H01L21/76</further-classification>  
        <further-classification edition="202301120250102B">H10B99/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許逢文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, FENG WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，包含基板、主動閘極結構、虛設閘極結構，以及儲存節點。基板包含主動區以及圍繞主動區之隔離結構，其中隔離結構為雙層結構，且隔離結構的平均介電常數為小於3.9。主動閘極結構設置於主動區中，虛設閘極結構設置於隔離結構中。儲存節點設置在主動閘極結構與虛設閘極結構之間。一種形成半導體裝置的方法亦在此揭露。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate including an active area and an isolation structure surrounding the active area, an active gate structure disposed in the active area, a passing gate structure disposed in the isolation structure, and a storage node disposed between the passing gate structure and the active gate structure. The isolation structure is a bi-layer structure, and an average dielectric constant of the isolation structure is less than 3.9. A method of manufacturing a semiconductor device is also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">110:基板</p>  
        <p type="p">130:隔離結構</p>  
        <p type="p">132:襯裡層</p>  
        <p type="p">134:介電材料</p>  
        <p type="p">152:閘極介電層</p>  
        <p type="p">156:閘極電極</p>  
        <p type="p">158:蓋層</p>  
        <p type="p">170:蝕刻停止層</p>  
        <p type="p">172:絕緣層</p>  
        <p type="p">180:位元線接觸</p>  
        <p type="p">182:位元線結構</p>  
        <p type="p">190:儲存節點</p>  
        <p type="p">AA:主動區</p>  
        <p type="p">AG:主動閘極結構</p>  
        <p type="p">PG:虛設閘極結構</p>  
        <p type="p">S20:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="579" publication-number="202611804"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611804.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611804</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137674</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管理物流之方法、記錄媒體及裝置</chinese-title>  
        <english-title>METHOD, RECORDING MEDIUM, AND APPARATUS OF MANAGING LOGISTICS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250303B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250303B">G06Q10/06</further-classification>  
        <further-classification edition="202301120250303B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, STACY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HARRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HARRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李順鐸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅希特　庫納爾　羅希特　庫納爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROHIT KUNAL, ROHIT KUNAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏帕迪亞　阿比納夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UPADHYAY, ABHINAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩普特拉　蘇維托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAPUTRA, SOEWITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金德成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DUCKSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王海挺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAITING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣豔陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YANYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴華鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HWAJONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡多納　奧爾蒂斯　何塞　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARDONA ORTIZ, JOSE DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CO</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩諾巴特　拉胡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARNOBAT, RAHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛特雷　姆魯根德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINTRE, MRUGENDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁娥凜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, AHREUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文　孝仁　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, HYO IN JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種管理物流之技術。本發明之一實施例之方法係於裝置中實行者，該裝置包括一個以上之處理器、及儲存有用以藉由上述一個以上之處理器而執行之命令之一個以上的記憶體，上述方法可包括如下步驟，即，上述一個以上之處理器如下：響應於自包括一個以上之包裝作業人員之作業人員組之作業人員終端獲得附著於目標商品的商品識別碼，產生包括與上述目標商品之包裝相關之資訊之包裝資訊；將上述包裝資訊傳輸至上述作業人員終端；及響應於自外部裝置獲得附著於包裝有上述目標商品之目標包裹上之箱子識別碼，產生上述目標包裹與包括包裝上述目標包裹所使用之箱子類型之箱子資訊的映射關係，該外部裝置係根據配送目的地來對包裝完成之包裹進行分揀者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:環境</p>  
        <p type="p">110:裝置</p>  
        <p type="p">120:作業人員終端</p>  
        <p type="p">130:外部裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="580" publication-number="202611749"> 
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      <tif no="1" file="202611749.zip"/>
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      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611749</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137705</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以實行登入處理之裝置、方法及記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR PERFORMING LOGIN PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250401B">G06F16/95</main-classification>  
        <further-classification edition="200601120250401B">G06F17/40</further-classification>  
        <further-classification edition="201301120250401B">G06F3/048</further-classification>  
        <further-classification edition="202301120250401B">G06Q30/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜河羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐郡明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JUNMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>代抗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔允貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, YUNJEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪　國威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, KUO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種用以實行對電子商務服務之登入處理之電子裝置。本發明之電子裝置可包括：一個以上之處理器；及一個以上之記憶體，其儲存有用以藉由上述一個以上之處理器而執行之命令；且上述電子裝置以如下之方式構成：於執行上述命令時，上述一個以上之處理器獲得用戶對電子商務服務之第1網頁之訪問請求，自上述伺服器接收用於露出包括第1登入介面之上述第1網頁之網頁資訊，輸出上述第1網頁，接收於上述第1登入介面輸入第1字串之第1用戶輸入，於判斷為輸入於上述第1登入介面之上述第1字串係第1類型之資訊之情形時，使用於與上述第1類型之資訊相關之追加資訊輸入之第2登入介面包括於上述第1網頁並輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310,S320,S330,S340,S350:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="581" publication-number="202611722"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611722.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611722</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供ＡＰＩ或ＡＰＩ集合之狀態之監控資訊之方法、電子裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, ELECTRONIC APPARATUS AND RECORDING MEDIUM FOR PROVIDING MONITORING INFORMATION ON STATUS OF API OR API SET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G06F11/30</main-classification>  
        <further-classification edition="201801120250801B">G06F8/60</further-classification>  
        <further-classification edition="202501120250801B">G06F11/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鎮安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHENAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃曉路</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, XIAOLU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種提供一個以上之API或一個以上之API集合之狀態之監控資訊的方法、電子裝置及記錄媒體。本發明之一實施例之方法可包括如下步驟：針對一個以上之API或一個以上之API集合，獲得目標日期及目標日期之前的一個以上之比較日期之誤差次數、平均延遲或呼叫次數中之至少一者的資訊；基於目標日期及一個以上之比較日期之誤差次數、平均延遲或呼叫次數中之至少一者的資訊，確定一個以上之API或一個以上之API集合中之滿足特定條件的API或API集合，該特定條件係與誤差次數、平均延遲或呼叫次數中之至少一者相關者；確定與滿足特定條件之API或API集合相關之特定用戶；及向特定用戶提供滿足特定條件之API或API集合之報告。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="582" publication-number="202610674"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610674.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610674</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138513</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>益生菌菌株組合在對抗肝胰腺微孢子蟲感染上的用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120241125B">A61K35/744</main-classification>  
        <further-classification edition="201501120241125B">A61K35/747</further-classification>  
        <further-classification edition="200601120241125B">A61P31/10</further-classification>  
        <further-classification edition="201601120241125B">A23K10/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生合生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNBIO TECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林金生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIN-SENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張孝東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIAO-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種益生菌菌株組合可被用來對抗肝胰腺微孢子蟲感染，其中該益生菌菌株組合包含有：屎腸球菌EF08 (BCRC 910525)、嗜酸乳桿菌LA1063 (BCRC 911041)以及植物乳桿菌LP28 (BCRC 910435)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="583" publication-number="202610808"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610808.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610808</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空覆膜設備</chinese-title>  
        <english-title>VACUUM COATING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241120B">B29C63/00</main-classification>  
        <further-classification edition="200601120241120B">B29C63/02</further-classification>  
        <further-classification edition="200601120241120B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立芯精密智造（昆山）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXIS PRECISION INTELLIGENT MANUFACTURING (KUNSHAN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BI, XIANGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李永光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YONGGUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張賢祝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIANZHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘小波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, XIAOBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周安祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ANLU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧單單</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, DANDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及PCB生產技術領域，具體公開了一種真空覆膜設備，該真空覆膜設備中，覆膜機用於將貼片貼附在工件上；撕膜機用於將工件上的貼片撕下來；料倉用於存放貼片；傳送組件用於將外部的工件輸送至上料位置，並能將下料位置的工件輸送至外部；機械臂的末端設有拾取機構，拾取機構用於拾取工件或貼片，並在機械臂的帶動下在上料位置、覆膜機、料倉、撕膜機和下料位置之間轉移；拾取機構中的拾取固定件均沿第一方向延伸，且沿第二方向可移動地約束於底座，拾取組件中的拾取座沿第一方向位置可調地設於拾取固定件，至少兩個拾取件沿第二方向位置調地間隔設於拾取座。上述設置的拾取製程簡單，覆膜效率高，且拾取機構不易出現損壞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to the technical field of PCB production, and specifically discloses a vacuum coating equipment. In the vacuum coating equipment, the laminating machine is used to attach the patch to the workpiece; the film tearing machine is used to remove the patch on the workpiece. Tear off; the bin is used to store patches; the transmission component is used to transport external workpieces to the loading position, and can transport workpieces from the unloading position to the outside; the end of the robotic arm is equipped with a pickup mechanism, which is used to pick up The workpiece or patch is transferred between the loading position, the laminating machine, the bin, the film tearing machine and the unloading position under the driving of the mechanical arm; the pick-up fixing parts in the pick-up mechanism all extend along the first direction, and The pickup element is movably constrained to the base along the second direction. The pickup base in the pickup element is position-adjustable on the pickup fixture along the first direction. At least two pickup pieces are position-adjustable and spaced apart from the pickup base along the second direction. The pickup process of the above arrangement is simple, the lamination efficiency is high, and the pickup mechanism is not prone to damage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Z:第三方向</p>  
        <p type="p">1000:工件</p>  
        <p type="p">2000:貼片</p>  
        <p type="p">100:工作臺</p>  
        <p type="p">200:覆膜機</p>  
        <p type="p">300:撕膜機</p>  
        <p type="p">400:料倉</p>  
        <p type="p">500:傳送組件</p>  
        <p type="p">600:機械臂</p>  
        <p type="p">700:拾取機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="584" publication-number="202611041"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611041.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611041</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138637</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、組合物及其方法</chinese-title>  
        <english-title>COMPOUNDS, COMPOSITIONS AND METHODS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">C07D417/14</main-classification>  
        <further-classification edition="200601120250303B">C07D401/14</further-classification>  
        <further-classification edition="200601120250303B">C07D471/04</further-classification>  
        <further-classification edition="200601120250303B">C07D401/12</further-classification>  
        <further-classification edition="200601120250303B">C07D413/14</further-classification>  
        <further-classification edition="200601120250303B">C07D405/14</further-classification>  
        <further-classification edition="200601120250303B">A61K31/454</further-classification>  
        <further-classification edition="200601120250303B">A61K31/497</further-classification>  
        <further-classification edition="200601120250303B">A61K31/4545</further-classification>  
        <further-classification edition="200601120250303B">A61K31/501</further-classification>  
        <further-classification edition="200601120250303B">A61K31/55</further-classification>  
        <further-classification edition="200601120250303B">A61P29/00</further-classification>  
        <further-classification edition="200601120250303B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商海湃泰克（北京）生物醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEPAITECH (BEIJING) BIOPHARMA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈　瑞超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, RUICHAO RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷曉光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, XIAOGUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李毓龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YULONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪曉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何若愚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, RUOYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王珏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴國榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">除其他事項外，本公開內容提供了化合物，例如，式I的化合物或其鹽類。在一些實施方式中，本公開內容提供了調節MRGPRX2活性的方法。在一些實施方式中，本公開內容提供了預防或治療病症、紊亂或疾病的方法，例如，與MRGPRX2相關的病症、紊亂或疾病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Among other things, the present disclosure provides compounds, e.g., compounds of formula I or salts thereof. In some embodiments, the present disclosure provides methods for modulating MRGPRX2 activity. In some embodiments, the present disclosure provides methods for preventing or treating conditions, disorders or diseases, e.g., MRGPRX2-associated conditions, disorders or diseases.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="585" publication-number="202612482"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612482.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612482</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138776</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相變化記憶體裝置及其製造方法</chinese-title>  
        <english-title>PHASE-CHANGE MEMORY DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">H10B63/10</main-classification>  
        <further-classification edition="202301120241101B">H10N70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方偉權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, WEI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">相變化記憶體裝置包括基板、第一電極、第二電極、第一碳層、第二碳層及相變化記憶層。第一電極及第二電極設置於基板上且彼此間隔開來。第一碳層及第二碳層設置於基板上且彼此間隔開來。第一碳層及第二碳層分別電性連接第一電極及第二電極，且分別為摻雜奈米碳管層或摻雜石墨烯層。相變化記憶層設置於第一碳層及第二碳層之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A phase-change memory device includes a substrate, a first electrode, a second electrode, a first carbon layer, a second carbon layer, and a phase-change memory layer. The first electrode and the second electrode are disposed on the substrate and spaced apart from each other. The first carbon layer and the second carbon layer are disposed on the substrate and spaced apart from each other. The first carbon layer and the second carbon layer are respectively electrically connected to the first electrode and the second electrode and are respectively a doped carbon nanotube layer or a doped graphene layer. The phase-change memory layer is disposed between the first carbon layer and the second carbon layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210:基板</p>  
        <p type="p">212:半導體基板</p>  
        <p type="p">214:絕緣層</p>  
        <p type="p">220:第一電極</p>  
        <p type="p">222:第一鈦層</p>  
        <p type="p">224、234:金屬層</p>  
        <p type="p">230:第二電極</p>  
        <p type="p">232:第二鈦層</p>  
        <p type="p">310:第一碳層</p>  
        <p type="p">320:第二碳層</p>  
        <p type="p">400:相變化記憶體裝置</p>  
        <p type="p">410:相變化記憶層</p>  
        <p type="p">A-A’:剖面線</p>  
        <p type="p">G:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="586" publication-number="202612446"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612446.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612446</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139000</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡鎮宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JHEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種半導體結構。半導體結構包括基板、第一字元線及第一接觸結構。第一字元線在基板上沿著第一方向延伸，其中第一字元線包括第一尾端部分、第二尾端部分及第一中間部分。第一中間部分在第一尾端部分與第二尾端部分之間，其中第一尾端部分的頂面及第二尾端部分的頂面低於第一中間部分的頂面，以及第二尾端部分的長度大於第一尾端部分的長度。第一接觸結構在第一字元線的第一尾端部分上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor structure. The semiconductor structure includes a substrate, a first word line, and a first contact structure. The first word line extends along a first direction on the substrate, in which the first word line includes a first end portion, a second end portion, and a first middle portion. The first middle portion is between the first end portion and the second end portion, in which a top surface of the first end portion and a top surface of the second end portion are lower than a top surface of the first middle portion, and a length of the second end portion is larger than a length of the first end portion. The first contact structure is on the first end portion of the first word line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:基板</p>  
        <p type="p">11JS:鋸齒狀側壁</p>  
        <p type="p">21:第一字元線</p>  
        <p type="p">22:第二字元線</p>  
        <p type="p">31:第一接觸結構</p>  
        <p type="p">32:第二接觸結構</p>  
        <p type="p">41:虛擬線</p>  
        <p type="p">42:虛擬線</p>  
        <p type="p">111:隔離區域</p>  
        <p type="p">112:主動區域</p>  
        <p type="p">211:第一尾端部分</p>  
        <p type="p">211B:邊界</p>  
        <p type="p">211L:長度</p>  
        <p type="p">212:第二尾端部分</p>  
        <p type="p">212B:邊界</p>  
        <p type="p">212L:長度</p>  
        <p type="p">212P:點</p>  
        <p type="p">213:第一中間部分</p>  
        <p type="p">221:第三尾端部分</p>  
        <p type="p">221B:邊界</p>  
        <p type="p">221L:長度</p>  
        <p type="p">221P:點</p>  
        <p type="p">222:第四尾端部分</p>  
        <p type="p">222B:邊界</p>  
        <p type="p">222L:長度</p>  
        <p type="p">223:第二中間部分</p>  
        <p type="p">1121:長主動區域</p>  
        <p type="p">1121L:長度</p>  
        <p type="p">1122:短主動區域</p>  
        <p type="p">1122L:長度</p>  
        <p type="p">A-A':線</p>  
        <p type="p">B-B':線</p>  
        <p type="p">b-b':線</p>  
        <p type="p">C-C':線</p>  
        <p type="p">c-c':線</p>  
        <p type="p">D-D':線</p>  
        <p type="p">d-d':線</p>  
        <p type="p">H1:水平距離</p>  
        <p type="p">H2:水平距離</p>  
        <p type="p">H3:水平距離</p>  
        <p type="p">H4:水平距離</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="587" publication-number="202612315"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612315.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612315</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>網頁處理方法以及基地台</chinese-title>  
        <english-title>WEB PAGE PROCESSING METHOD AND BASE STATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250401B">H04L67/50</main-classification>  
        <further-classification edition="202201120250401B">H04L67/02</further-classification>  
        <further-classification edition="201901220250401B">G06F16/95</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許秀雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, XIU-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">網頁處理方法應用於基地台，上述網頁處理方法包含：拼接複數個網頁以產生拼接網頁；分割並壓縮拼接網頁為複數個壓縮資料，並產生複數個網頁與複數個壓縮資料之間的對應關係表；以及儲存複數個壓縮資料於快閃記憶體中，並產生複數個壓縮資料在快閃記憶體的對應位置表。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A web page processing method is applied to a base station, and the web page processing method includes: bonding a plurality of web gapes to generate a bonded web page; splitting and compressing the bonded web page into a plurality of compressed data, and generating a corresponding relation table between the plurality of web gapes and the plurality of compressed data; and storing the plurality of compressed data in a flash memory, and generating a corresponding location table of the plurality of compressed data in the flash memory.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">210~230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="588" publication-number="202611829"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611829.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611829</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139264</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管理平台之資料之電子裝置及其方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS FOR MANAGING DATA ON PLATFORMS AND METHOD THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250401B">G06Q30/0282</main-classification>  
        <further-classification edition="202201120250401B">H04L67/10</further-classification>  
        <further-classification edition="200601120250401B">H04L9/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐學志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, XUEZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種管理平台之資料之電子裝置及其方法。根據所揭示之一實施例，藉由第1裝置而實行之平台之資料管理方法可包括如下步驟：自第1用戶終端接收第1資料，該第1資料係於第1裝置所提供之第1平台中產生者；產生包括第1資料之第1交易；請求將第1交易儲存於區塊鏈網路中，該區塊鏈網路包括第1裝置及提供第2平台之第2裝置作為節點；以及將與第1資料對應之第1元資料儲存在與第1裝置繫結之非公開資料庫中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p>  
        <p type="p">S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="589" publication-number="202611263"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611263.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611263</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139491</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液態金屬組成物及方法</chinese-title>  
        <english-title>LIQUID METAL COMPOSITIONS AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C09K5/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商波士頓材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOSTON MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯塔岡　史蒂芬彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAGON, STEPHEN PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫內　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONE, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露一般而言係關於具有在使用期間可變成液態或表現出相變的組份的某些組成物，及與該等組成物相關的方法。例如，此等組成物可用作各種應用的熱介面材料。諸如本文論述者的某些熱介面材料可代表新的結構，其中材料為固態，但在使用期間變成液態，此可改良熱傳輸，例如，因為液態改良表面的接觸或黏結，藉此允許跨於表面之間的介面的改良熱傳輸。例如，在一些狀況下，該組成物可為固相材料及相變材料的複合物。在某些態樣中，該相變材料表現出熔化溫度，例如，其中該相變材料可自液體轉變為固體。該相變材料可包括例如金屬、金屬氧化物、金屬合金等。其他態樣一般而言係關於製造或使用此類組成物的方法、包括此類組成物的套件等。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure generally relates to certain compositions having components that can become liquid or exhibit a phase change during use, and methods related to the same. These can be used, for example, as thermal interface materials for various applications. Certain thermal interface materials such as those discussed herein may represent a new structure in which the material is solid, but becomes liquid during use, which may improve heat transport, for example, because the liquid improves contact or binding of surfaces, thereby allowing improved heat transport across interfaces between surfaces. For example, in some cases, the composition may be a composite of a solid phase material and a phase change material. In certain aspects, the phase change material exhibits a melt temperature, e.g., where the phase change material can transition from a liquid to a solid. The phase change material may include, for example, a metal, a metal oxide, a metal alloy, or the like. Other aspects generally relate to methods of making or using such compositions, kits including such compositions, or the like.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:複合物</p>  
        <p type="p">101:相變材料</p>  
        <p type="p">102:固相材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="590" publication-number="202612447"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612447.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612447</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139573</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡鎮宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JHEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種半導體結構。半導體結構包括基板、字元線及介電層。字元線嵌入基板中，字元線包括高功函數層及在高功函數層上的低功函數層，其中高功函數層的功函數大於低功函數層的功函數。介電層在基板與字元線之間，介電層包括第一部分及第二部分。第一部分在基板與高功函數層之間。第二部分在基板與低功函數層之間，其中第二部分的厚度大於第一部分的厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor structure. The semiconductor structure includes a substrate, a word line, and a dielectric layer. The word line is embedded in the substrate and includes a high work function layer and a low work function layer on the high work function layer, in which a work function of the high work function layer is larger than a work function of the low work function layer. The dielectric layer is between the substrate and the word line, in which the dielectric layer includes a first portion and a second portion. The first portion is between the substrate and the high work function layer. The second portion is between the substrate and the low work function layer, in which a thickness of the second portion is larger than a thickness of the first portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:基板</p>  
        <p type="p">101A:主動區域</p>  
        <p type="p">101I:隔離區域</p>  
        <p type="p">102H:高功函數層</p>  
        <p type="p">102L:低功函數層</p>  
        <p type="p">103:介電層</p>  
        <p type="p">103A:第一部分</p>  
        <p type="p">103B:第二部分</p>  
        <p type="p">103C:第三部分</p>  
        <p type="p">103D:第四部分</p>  
        <p type="p">103E:第五部分</p>  
        <p type="p">105:氮化物層</p>  
        <p type="p">107:虛線框</p>  
        <p type="p">108:接觸</p>  
        <p type="p">109:位元線</p>  
        <p type="p">B-B:線</p>  
        <p type="p">M1:第一層</p>  
        <p type="p">M2:第二層</p>  
        <p type="p">M3:第三層</p>  
        <p type="p">T1:厚度</p>  
        <p type="p">T2:厚度</p>  
        <p type="p">T3:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="591" publication-number="202610918"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610918.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610918</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139623</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>變距拾取機構</chinese-title>  
        <english-title>VARIABLE-DISTANCE PICKUP MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B65G47/90</main-classification>  
        <further-classification edition="200601120241204B">B65G47/91</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立芯精密智造（昆山）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXIS PRECISION INTELLIGENT MANUFACTURING (KUNSHAN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BI, XIANGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李永光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YONGGUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張賢祝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIANZHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘小波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, XIAOBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周安祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ANLU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及搬運設備技術領域，具體公開了一種變距拾取機構，該變距拾取機構中，第一傳動件沿第一方向延伸，且沿自身軸線方向可移動地約束於底座；第二傳動件沿第二方向延伸，且固定於底座；拾取固定件沿第一方向延伸，且設有能拾取工件的拾取部；兩個拾取固定件可移動地約束於第二傳動件，且能沿第二方向相互靠近或遠離；至少兩個傳動組件沿第一方向間隔排布，傳動組件的輸入端和第一傳動件固接，傳動組件的兩個輸出端分別與對應的拾取固定件連接，傳動組件的輸入端移動過程能帶動兩個輸出端沿第二方向相互靠近或分離以驅動兩個拾取固定件沿第二方向相互靠近或遠離。上述設置能適應不同尺寸的工件，且各部件之間的配合關係簡單，運轉流暢。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to the technical field of handling equipment, and specifically discloses a variable-distance pickup mechanism. In the variable-distance pickup mechanism, the first transmission member extends along the first direction and is movably constrained to the base along its own axis; the second transmission member The piece extends along the second direction and is fixed to the base; the pick-up fixing piece extends along the first direction and is provided with a pick-up portion that can pick up the workpiece; the two pick-up fixing pieces are movably constrained to the second transmission member and can move along the second transmission piece. The two directions are close to or away from each other; at least two transmission elements are arranged at intervals along the first direction, the input end of the transmission element is fixedly connected to the first transmission part, and the two output ends of the transmission element are respectively connected to the corresponding pick-up fixing parts. The moving process of the input end of the component can drive the two output ends toward or away from each other along the second direction to drive the two pick-up fixing members toward or away from each other along the second direction. The above-mentioned settings can adapt to workpieces of different sizes, and the cooperation relationship between the components is simple and the operation is smooth.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p>  
        <p type="p">100:底座</p>  
        <p type="p">110:第一限位塊</p>  
        <p type="p">120:第二限位塊</p>  
        <p type="p">300:第二傳動件</p>  
        <p type="p">400:拾取固定件</p>  
        <p type="p">411:拾取座</p>  
        <p type="p">412:拾取件</p>  
        <p type="p">4121:拾取部</p>  
        <p type="p">420:第二固接件</p>  
        <p type="p">500:傳動組件</p>  
        <p type="p">510:第一固接件</p>  
        <p type="p">520:主動件</p>  
        <p type="p">530:從動件</p>  
        <p type="p">600:驅動組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="592" publication-number="202611723"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611723.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611723</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139733</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供測試台之電子裝置及其方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS PROVIDING TESTBED AND METHOD THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F11/34</main-classification>  
        <further-classification edition="202501120250401B">G06F11/36</further-classification>  
        <further-classification edition="202301220250401B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐瑋呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEICHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鍾范</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JONG BUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申志妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, JI YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玹雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUN WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉驚驚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JINGJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種提供測試台之電子裝置及其方法。根據所揭示之一實施例，藉由電子裝置而實行之測試台提供方法可包括如下步驟：接收特定有應用程式之測試目標場景之測試台產生請求；識別與測試目標場景相關聯之複數個服務；及針對可於測試目標場景下根據測試而變更之複數個特徵(feature)各者，產生設定有複數個服務各者之特徵變更與否、及複數個服務間之測試路徑之測試台。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="593" publication-number="202612507"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612507.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612507</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垂直鰭式閘極電晶體和記憶體裝置</chinese-title>  
        <english-title>VERTICAL FIN-GATE TRANSISTOR AND MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250109B">H10D30/62</main-classification>  
        <further-classification edition="202301120250109B">H10B12/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文魁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEN KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開的實施方式提供一種記憶體裝置和垂直鰭式閘極電晶體。記憶體裝置包括記憶體單元，其中記憶體單元包括位元線、位於位元線上方的字元線以及位於位元線上的半導體基板。字元線包括複數個鰭式字元線和連接鰭式字元線的共同字元線，其中鰭式字元線部分覆蓋半導體基板的第一側壁。記憶體單元還包括物理性接觸半導體基板的第二側壁的主體線以及包覆主體線的絕緣層，其中第二側壁相對於半導體基板的第一側壁。主體線接地以將累積電荷引導出半導體基板，從而減少記憶體單元中的浮體效應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a memory device and a vertical fin-gate transistor. The memory device includes a memory cell including a bit line, a word line above the bit line, and a semiconductor substrate on the bit line. The word line includes a plurality of fin type word lines and a common word line connecting the fin type word lines, where the fin type word lines partially cover a first sidewall of the semiconductor substrate. The memory cell also includes a body line physically contacting a second sidewall of the semiconductor substrate opposite to the first sidewall of the semiconductor substrate, and an insulating layer embedding the body line. The body line is grounded to direct the accumulated charges out of the semiconductor substrate, thereby reducing the floating body effect in the memory cell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">200:記憶體單元</p>  
        <p type="p">200a:第一記憶體單元</p>  
        <p type="p">200b:第二記憶體單元</p>  
        <p type="p">200c:第三記憶體單元</p>  
        <p type="p">200d:第四記憶體單元</p>  
        <p type="p">210,210a,210b:位元線</p>  
        <p type="p">220,220a,220b:字元線</p>  
        <p type="p">222,222a,222b,222c,222d:鰭式字元線</p>  
        <p type="p">224,224a,224b:共同字元線</p>  
        <p type="p">230,230a,230b,230c,230d:半導體基板</p>  
        <p type="p">240:存儲節點接觸件</p>  
        <p type="p">250:電容器</p>  
        <p type="p">260,260a,260b:主體線</p>  
        <p type="p">270:絕緣層</p>  
        <p type="p">280:字元線接觸件</p>  
        <p type="p">290:主體線接觸件</p>  
        <p type="p">x,y,z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="594" publication-number="202612508"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612508.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612508</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139804</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垂直鰭式閘極電晶體和記憶體裝置</chinese-title>  
        <english-title>VERTICAL FIN-GATE TRANSISTOR AND MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250109B">H10D30/62</main-classification>  
        <further-classification edition="202301120250109B">H10B12/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文魁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEN KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開的實施方式提供一種記憶體裝置和垂直鰭式閘極電晶體。記憶體裝置包括記憶體單元，其中記憶體單元包括位元線、位於位元線上方的字元線以及位於位元線上的半導體基板。字元線包括複數個鰭式字元、連接鰭式字元線的鰭片連接件和位於鰭片連接件上的共同字元線。記憶體單元還包括物理性接觸半導體基板的側壁之中一者的主體線以及包覆主體線的絕緣層，其中半導體基板的其餘側壁被鰭式字元線部分覆蓋。主體線接地以將累積電荷引導出半導體基板，從而減少記憶體單元中的浮體效應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a memory device and a vertical fin-gate transistor. The memory device includes a memory cell including a bit line, a word line above the bit line, and a semiconductor substrate on the bit line. The word line includes a plurality of fin type word lines, a fin connector connecting the fin type word lines, and a common word line on the fin connector. The memory cell also includes a body line physically contacting one of sidewalls of the semiconductor substrate and an insulating layer embedding the body line, where the fin type word lines partially cover others of the sidewalls of the semiconductor substrate. The body line is grounded to direct the accumulated charges out of the semiconductor substrate, thereby reducing the floating body effect in the memory cell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">200:記憶體單元</p>  
        <p type="p">200a:第一記憶體單元</p>  
        <p type="p">200b:第二記憶體單元</p>  
        <p type="p">200c:第三記憶體單元</p>  
        <p type="p">200d:第四記憶體單元</p>  
        <p type="p">210,210a,210b:位元線</p>  
        <p type="p">220,220a,220b:字元線</p>  
        <p type="p">222,222a,222b,222c,222d:鰭式字元線</p>  
        <p type="p">224,224a,224b,224c,224d:鰭片連接件</p>  
        <p type="p">226,226a,226b:共同字元線</p>  
        <p type="p">230,230a,230b,230c,230d:半導體基板</p>  
        <p type="p">240:存儲節點接觸件</p>  
        <p type="p">250:電容器</p>  
        <p type="p">260,260a,260b:主體線</p>  
        <p type="p">270:絕緣層</p>  
        <p type="p">280:字元線接觸件</p>  
        <p type="p">290:主體線接觸件</p>  
        <p type="p">x,y,z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="595" publication-number="202612509"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612509.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612509</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139829</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垂直鰭式場效應電晶體和記憶體裝置</chinese-title>  
        <english-title>VERTICAL FIN FIELD EFFECT TRANSISTOR AND MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250122B">H10D30/62</main-classification>  
        <further-classification edition="202301120250122B">H10B12/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文魁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEN KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開的實施方式提供一種記憶體裝置和垂直鰭式場效應電晶體。記憶體裝置包括記憶體單元，其中記憶體單元包括位元線、位於位元線上方的字元線、位於位元線上且嵌入字元線中的複數個半導體鰭片、物理性接觸各個半導體鰭片的一個側壁的主體線，以及包覆主體線的絕緣層。主體線接地以將累積電荷引導出半導體鰭片，從而減少記憶體單元中的浮體效應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a memory device and a vertical fin field effect transistor. The memory device includes a memory cell including a bit line, a word line above the bit line, a plurality of semiconductor fins on the bit line and embedded in the word line, a body line physically contacting one of sidewalls of each of the semiconductor fins, and an insulating layer embedding the body line. The body line is grounded to direct the accumulated charges out of the semiconductor fins, thereby reducing the floating body effect in the memory cell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">200:記憶體單元</p>  
        <p type="p">200a:第一記憶體單元</p>  
        <p type="p">200b:第二記憶體單元</p>  
        <p type="p">200c:第三記憶體單元</p>  
        <p type="p">200d:第四記憶體單元</p>  
        <p type="p">210,210a,210b:位元線</p>  
        <p type="p">220,220a,220b:字元線</p>  
        <p type="p">230,230a,230b,230c,230d:半導體鰭片</p>  
        <p type="p">240:存儲節點接觸件</p>  
        <p type="p">250:電容器</p>  
        <p type="p">260,260a,260b:主體線</p>  
        <p type="p">270:絕緣層</p>  
        <p type="p">280:字元線接觸件</p>  
        <p type="p">290:主體線接觸件</p>  
        <p type="p">x,y,z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="596" publication-number="202612026"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612026.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612026</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139856</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造半導體元件的方法</chinese-title>  
        <english-title>METHOD OF FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">H01L21/324</main-classification>  
        <further-classification edition="200601120241104B">H01L21/283</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊英政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YING-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造半導體元件的方法包括在第一溫度下形成第一金屬材料襯於溝槽。溝槽位於半導體基材中。方法還包括在第二溫度下形成第二金屬材料襯於第一金屬材料。第二溫度高於第一溫度。方法還包括對第一金屬材料與第二金屬材料執行退火製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming a semiconductor device includes forming a first metal material lining a trench at a first temperature. The trench is in a semiconductor substrate. The method further includes forming a second metal material lining the first metal material at a second temperature. The second temperature is higher than the first temperature. The method further includes performing an annealing process to the first and second metal materials.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:半導體基材</p>  
        <p type="p">120-1:第一金屬材料</p>  
        <p type="p">120-2:第二金屬材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="597" publication-number="202610770"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610770.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610770</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械研磨墊及其製造方法</chinese-title>  
        <english-title>CHEMICAL MECHANICAL POLISHING (CMP) PAD AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241127B">B24B37/20</main-classification>  
        <further-classification edition="200601120241127B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔耀雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNG, YAO-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昆棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種化學機械研磨墊包含墊體。墊體具有研磨面以及複數個內表面，內表面分別連接研磨面並彼此分隔，內表面分別圍繞以定義柱狀孔，研磨面配置以研磨工件，柱狀孔配置以容置研磨液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chemical mechanical polishing (CMP) pad includes a pad body. The pad body has a polishing surface and a plurality of inner surfaces. The inner surfaces are respectively connected with the polishing surface and separated from each other. The inner surfaces respectively surround to define a columnar hole. The polishing surface is configured to polish against a workpiece. The columnar holes are configured to accommodate a polishing slurry.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:化學機械研磨墊</p>  
        <p type="p">110:墊體</p>  
        <p type="p">111:研磨面</p>  
        <p type="p">112:內表面</p>  
        <p type="p">H:柱狀孔</p>  
        <p type="p">L:長度</p>  
        <p type="p">N:法線方向</p>  
        <p type="p">TK:厚度</p>  
        <p type="p">W:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="598" publication-number="202611833"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611833.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611833</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140072</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供頁面之電子裝置之動作方法及支持該動作方法之電子裝置</chinese-title>  
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR PROVIDING A PAGE AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120250801B">G06Q30/015</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，揭示一種電子裝置提供頁面之方法，其包括如下步驟：獲得針對與上述電子裝置相關之服務中銷售之商品所填寫之第1商品詢問資料；基於為了對上述服務中之商品詢問進行回答而設定之回答資料集來判斷第1回答資料，該第1回答資料係包括對應於上述第1商品詢問資料中包括之詢問內容而提供之回答內容者；及提供包括上述第1回答資料之上述商品之商品詳細頁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301:動作</p>  
        <p type="p">303:動作</p>  
        <p type="p">305:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="599" publication-number="202612497"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612497.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612497</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路裝置及其形成方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250401B">H10D30/60</main-classification>  
        <further-classification edition="202501120250401B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏佳瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何嘉政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHIA-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣柏煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, PO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何文傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, WEN CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　其翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, VICTOR CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些實施例是關於一種積體電路（IC）裝置，其基底包括P阱區及介電結構。介電結構位於基底的表面處、向下延伸到基底中、而且位於P阱區的側向周界處。IC裝置還包括位於P阱區上方且側向延伸於介電結構上方的介電層。IC裝置還包括位於介電層上方的N+閘極結構且包括位於基底的P阱區及介電結構上方的至少一P+區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments relate to an integrated circuit (IC) device that includes a substrate including a P-well region and a dielectric structure. The dielectric structure is disposed at a surface of the substrate, extends downward into the substrate, and is located at a lateral perimeter of the P-well region. The IC device further includes a dielectric layer disposed over the P-well region and extends laterally over the dielectric structure. The IC device also includes an N+ gate structure disposed over the dielectric layer and includes at least one P+ region located over the P-well region of the substrate and the dielectric structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:閘極結構</p>  
        <p type="p">204:介電結構</p>  
        <p type="p">206:P阱區</p>  
        <p type="p">208:介電層</p>  
        <p type="p">400B:剖視圖</p>  
        <p type="p">402:N阱區</p>  
        <p type="p">408:深N阱區</p>  
        <p type="p">410:P+區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="600" publication-number="202612123"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612123.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612123</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140303</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構及其製作方法</chinese-title>  
        <english-title>PACKAGE STRUCTURE AND METHODS FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250317B">H01L23/28</main-classification>  
        <further-classification edition="200601120250317B">H01L23/34</further-classification>  
        <further-classification edition="200601120250317B">H01L23/488</further-classification>  
        <further-classification edition="200601120250317B">H01L21/56</further-classification>  
        <further-classification edition="200601120250317B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪　文興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, WENSEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇彥輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, YEN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳琮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TSUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">封裝結構包括封裝基板、封裝基板上的封裝模組、封裝基板上環繞封裝模組的外部模塑材料層、封裝模組上的熱介面材料層、以及熱介面材料層上並附著於外部模塑材料層的封裝蓋。封裝蓋包括具有第一熱膨脹係數的底部蓋部分、以及附著於底部蓋部分並具有第二熱膨脹係數的頂部蓋部分，第二熱膨脹係數小於第一熱膨脹係數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package structure includes a package substrate, a package module on the package substrate, an outer molding material layer on the package substrate around the package module, a thermal interface material (TIM) layer on the package module, and a package lid on the TIM layer and attached to the outer molding material layer. The package lid includes a bottom lid portion having a first coefficient of thermal expansion (CTE), and a top lid portion attached to the bottom lid portion and having a second CTE less than the first CTE.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝結構</p>  
        <p type="p">101:局部矽互連晶粒</p>  
        <p type="p">112a:貫通孔</p>  
        <p type="p">110:封裝基板</p>  
        <p type="p">110a:上部鈍化層</p>  
        <p type="p">110b:下部鈍化層</p>  
        <p type="p">110c:焊球</p>  
        <p type="p">112:核心</p>  
        <p type="p">114:上部介電層</p>  
        <p type="p">114a:上部接合墊</p>  
        <p type="p">114b、116b:金屬互連結構</p>  
        <p type="p">116:下部介電層</p>  
        <p type="p">116a:下部接合墊</p>  
        <p type="p">119:封裝底部填充層</p>  
        <p type="p">120:封裝模組</p>  
        <p type="p">121:C4凸塊</p>  
        <p type="p">127:下部模塑材料層</p>  
        <p type="p">130:封裝蓋</p>  
        <p type="p">130A:頂部蓋部分</p>  
        <p type="p">130B:底部蓋部分</p>  
        <p type="p">135:接合層</p>  
        <p type="p">140:半導體晶粒</p>  
        <p type="p">141:第一半導體晶粒</p>  
        <p type="p">142:第二半導體晶粒</p>  
        <p type="p">160:黏著層</p>  
        <p type="p">170:熱介面材料層</p>  
        <p type="p">201:局部重佈線互連晶粒</p>  
        <p type="p">327:外部模塑材料層</p>  
        <p type="p">S130A:下表面</p>  
        <p type="p">S130B:上表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="601" publication-number="202611817"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611817.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611817</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140317</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於設定測試之實行之電子裝置的動作方法及支持其的電子裝置</chinese-title>  
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR CONFIGURING PERFORMING OF TEST AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250401B">G06Q30/01</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃凱凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KAIKAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，揭示一種電子裝置設定測試之實行之方法，其包括如下步驟：獲得用以於測試伺服器中測試第1服務之用戶之輸入；對應於上述輸入，確認是否為了上述第1服務而設定了測試實行權證資訊，該測試實行權證資訊係用以管理以使得能夠於上述測試伺服器中對服務實行測試者；及於確認到為了上述第1服務而設定之測試實行權證資訊之情形時，以如下方式進行設定：能夠基於為了上述第1服務而設定之測試實行權證資訊，於上述測試伺服器中對上述第1服務實行測試。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301:動作</p>  
        <p type="p">303:動作</p>  
        <p type="p">305:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="602" publication-number="202612033"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612033.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612033</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140346</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於增強散熱的複合封裝及其形成方法</chinese-title>  
        <english-title>COMPOSITE PACKAGES FOR ENHANCING THERMAL DISSIPATION AND METHODS FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250219B">H01L21/56</main-classification>  
        <further-classification edition="200601120250219B">H01L21/60</further-classification>  
        <further-classification edition="200601120250219B">H01L23/28</further-classification>  
        <further-classification edition="200601120250219B">H01L23/488</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KAI-FUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭禮輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, LI-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施應慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YING-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">複合封裝可具有用於增強散熱的特徵。該特徵可包括位於半導體晶片背側的金屬柱陣列。或者，該特徵可包括腔，半導體晶片的背側表面暴露於該腔，且該腔在側向上被模製化合物框架的部分環繞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composite package may have a feature for enhancing thermal dissipation. The feature may include an array of metal pillar located on a backside of a semiconductor die. Alternatively, the feature may include a cavity, to which a backside surface of a semiconductor die is exposed and which is laterally surrounded by a portion of a molding compound die frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:第一半導體晶片</p>  
        <p type="p">709:半導體基底</p>  
        <p type="p">720:半導體元件</p>  
        <p type="p">741:金屬種子板</p>  
        <p type="p">742:金屬柱</p>  
        <p type="p">760:介電材料層</p>  
        <p type="p">780:金屬互連結構</p>  
        <p type="p">788:第一金屬接合墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="603" publication-number="202612397"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612397.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612397</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140442</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機櫃</chinese-title>  
        <english-title>RACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250224B">H05K1/02</main-classification>  
        <further-classification edition="200601120250224B">H05K7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商鴻運科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭坤洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KUN-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KAI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇宸毫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊方興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FANG-XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文字</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開一種機櫃，包括櫃體、主機殼、抽屜模組與鎖固機構。主機殼設置於櫃體並可從櫃體抽出。抽屜模組設置於主機殼並可從主機殼抽出。鎖固機構包括第一轉動件與鎖定件。第一轉動件轉動設置於主機殼且與櫃體抵接。鎖定件活動設置於主機殼以位於或遠離第一轉動件之轉動路徑。第一轉動件與櫃體抵接之狀態下，主機殼被限制從櫃體抽出。第一轉動件與櫃體分離之狀態下，主機殼被允許從櫃體抽出。當抽屜模組從主機殼抽出時，第一轉動件與櫃體抵接且鎖定件位於第一轉動件之轉動路徑，櫃體與鎖定件配合限制第一轉動件轉動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a rack comprising a cabinet body, a chassis, a drawer module and a locking mechanism. The chassis is provided in the cabinet body and can be withdrawn from the cabinet body. The drawer module is provided in the chassis and withdrawable from the chassis. The locking mechanism includes a first rotating member and a locking member. The first rotating member is rotatably disposed in the chassis and is in contact with the cabinet body. The locking member is movably disposed in the chassis to be located in or away from a rotation path of the first rotation member. In a state in which the first rotation member is against the cabinet body, the chassis is restricted from being withdrawn from the cabinet body. In a state in which the first rotation member is separated from the cabinet body, the chassis is allowed to be withdrawn from the cabinet body. When the drawer module is withdrawn from the cabinet body, the first rotational member is pressed against the cabinet body and the locking member is located in the rotational path of the first rotational member, and the cabinet body cooperates with the locking member to restrict rotation of the first rotational member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機櫃</p>  
        <p type="p">101:第一滑軌</p>  
        <p type="p">102:第二滑軌</p>  
        <p type="p">11:櫃體</p>  
        <p type="p">12:主機殼</p>  
        <p type="p">13:抽屜模組</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="604" publication-number="202612416"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612416.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612416</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140443</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機櫃</chinese-title>  
        <english-title>RACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250620B">H05K5/02</main-classification>  
        <further-classification edition="200601120250620B">H05K7/14</further-classification>  
        <further-classification edition="200601120250620B">H05K7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商鴻運科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭坤洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KUN-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KAI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇宸毫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊方興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FANG-XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文字</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開一種機櫃，包括櫃體、主機殼、抽屜模組與鎖固機構。主機殼設置於櫃體，主機殼可沿第一方向從櫃體抽出。抽屜模組設置於主機殼，抽屜模組可沿第一方向從主機殼抽出。鎖固機構包括轉動件與鎖定件。轉動件轉動設置於抽屜模組且與主機殼抵接。鎖定件沿第二方向活動設置於主機殼以位於或遠離轉動件之轉動路徑。轉動件與主機殼抵接時抽屜模組被限制從主機殼抽出。轉動件與主機殼分離時抽屜模組被允許從主機殼抽出。於主機殼從櫃體抽出後，轉動件與主機殼抵接且鎖定件位於轉動件之轉動路徑，主機殼與鎖定件配合限制轉動件轉動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a rack comprising a cabinet body, a chassis, a drawer module and a locking mechanism. The chassis is provided in the cabinet body, and the chassis is withdrawable from the cabinet body in a first direction. The drawer module is provided in the chassis, and the drawer module is withdrawable from the chassis along the first direction. The locking mechanism includes a rotating member and a locking member. The rotating member is rotatably disposed in the drawer module and is coupled with the chassis. The locking member is movably disposed in the chassis in the second direction to lie in or away from a rotation path of the rotation member. The drawer module is restricted from being withdrawn from the chassis when the rotating member is engaged with the chassis. The drawer module is allowed to be withdrawn from the chassis when the rotating member is separated from the chassis. After the chassis is withdrawn from the cabinet body, the rotating member is pressed against the chassis and the locking member is located in the rotation path of the rotating member, and the chassis cooperates with the locking member to restrict rotation of the rotating member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機櫃</p>  
        <p type="p">101:第一滑軌</p>  
        <p type="p">102:第二滑軌</p>  
        <p type="p">11:櫃體</p>  
        <p type="p">12:主機殼</p>  
        <p type="p">13:抽屜模組</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="605" publication-number="202612082"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612082.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612082</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140781</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造裝置及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">H01L21/677</main-classification>  
        <further-classification edition="200601120250320B">H01L21/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商捷進科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FASFORD TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兒玉薫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KODAMA, KAORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>深澤啓成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKASAWA, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊藤明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題是在於提供一種可除去因為基板的邊緣周邊與搬送部的摩擦而產生的異物之技術。 &lt;br/&gt;其解決手段，半導體製造裝置是具有： &lt;br/&gt;搬送部，其具備一對的搬送道，搬送載置晶粒的基板；及 &lt;br/&gt;異物除去裝置，其設置於前述搬送道， &lt;br/&gt;前述搬送道是具有搬送前述基板的第一溝及第二溝，且在前述第一溝及前述第二溝具備吸引異物的吸引口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">52:滑道(搬送道)</p>  
        <p type="p">53:下板</p>  
        <p type="p">54:滑道支撐部</p>  
        <p type="p">56:驅動機構</p>  
        <p type="p">57:螺帽</p>  
        <p type="p">101A:氣管</p>  
        <p type="p">103:吸引口</p>  
        <p type="p">201:第一溝</p>  
        <p type="p">202:第二溝</p>  
        <p type="p">401:抛光表面處理</p>  
        <p type="p">S:基板</p>  
        <p type="p">E:箭號</p>  
        <p type="p">Z1,Z2:方向</p>  
        <p type="p">Y1,Y2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="606" publication-number="202610853"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610853.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610853</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140828</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>穿置有金屬線之碳纖維自行車輪圈及其成形方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250106B">B60B5/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永湖複合材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖元宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳樹春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種碳纖維自行車輪圈及其成形方法，屬於碳纖維輪圈的強化技術，具體而言，涉及通過將金屬線（鋼絲）穿置於碳纖維輪圈側壁中以提高輪圈的抗衝擊性能和耐變形能力的技術。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:輪圈本體</p>  
        <p type="p">20:金屬線</p>  
        <p type="p">30:側壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="607" publication-number="202612519"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612519.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612519</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141018</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及形成其的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250401B">H10D64/00</main-classification>  
        <further-classification edition="202501120250401B">H10D30/60</further-classification>  
        <further-classification edition="202501120250401B">H10D30/01</further-classification>  
        <further-classification edition="200601120250401B">H01L23/522</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游焜煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, KUN-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳瑞興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, RUEY-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳吉智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">高電壓電晶體包括在高電壓電晶體的閘極結構和汲極區之間的主場板材層、在高電壓電晶體的主場板材層和基底層之間的阻擋層以及橫向位在阻擋層和汲極區之間的圖案場板結構。圖案場板結構可以由閘極結構和相關聯的閘極介電層相同的層形成，這最小化了用於形成圖案場板結構的成本、複雜性以及製造資源。圖案場板結構用作自對準罩幕，用於形成阻擋層、汲極區和/或在汲極區上的金屬矽化物層。這使得阻擋層和在汲極區上的汲極接觸窗的更近的定位，並縮小了汲極區的橫向尺寸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A high-voltage transistor includes a main field plate layer between a gate structure and a drain region of the high-voltage transistor, a blocking layer between the main field plate layer and a substrate layer of the high-voltage transistor, and a pattern field plate structure laterally between the blocking layer and the drain region. The pattern field plate structure may be formed from the same layer(s) as the gate structure and associated gate dielectric layer, which minimizes the cost, complexity, and manufacturing resources for forming the pattern field plate structure. The pattern field plate structure functions as a self-aligned mask for forming the blocking layer, the drain region, and/or a metal silicide layer on the drain region. This enables closer positioning of the blocking layer and a drain contact on the drain region, as well a reduced lateral size of the drain region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">106:基底層</p>  
        <p type="p">108:積體電路裝置</p>  
        <p type="p">110、224:介電層</p>  
        <p type="p">112a、112b、112c:接觸窗結構</p>  
        <p type="p">200:實施例</p>  
        <p type="p">202:主動區</p>  
        <p type="p">206a、206b:源極/汲極區</p>  
        <p type="p">204:塊材區</p>  
        <p type="p">208:閘極結構</p>  
        <p type="p">210:閘極介電層</p>  
        <p type="p">212:側壁間隙壁</p>  
        <p type="p">214:主體植入區</p>  
        <p type="p">216:漂移區</p>  
        <p type="p">218:主場板材層</p>  
        <p type="p">220:阻擋層</p>  
        <p type="p">222:圖案場板結構</p>  
        <p type="p">226:金屬層</p>  
        <p type="p">228:場板接觸窗</p>  
        <p type="p">230a、230b:金屬矽化物層</p>  
        <p type="p">D1、D2、D3、D4、D5、D6、D7:尺寸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="608" publication-number="202611574"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611574.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611574</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141137</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">G02B6/122</main-classification>  
        <further-classification edition="202501120250324B">H10D88/00</further-classification>  
        <further-classification edition="200601120250324B">H01L21/027</further-classification>  
        <further-classification edition="200601120250324B">H01L21/3213</further-classification>  
        <further-classification edition="200601120250324B">H03K3/42</further-classification>  
        <further-classification edition="200601120250324B">H01P3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡志宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體封裝包括具有光耦合器的光子晶粒、接合在光子晶粒上的電子晶粒，以及接合在電子晶粒上的光學支撐件，該光學支撐件包括多個透鏡結構，其中來自外部光訊號源的光依序通過多個透鏡結構耦合到光耦合器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package includes a photonic die including an optical coupler, an electronic die bonded over the photonic die, and an optical support bonded over the electronic die and includes a plurality of lens structures, wherein light from an external optical signal source is coupled to the optical coupler sequentially through the plurality of lens structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體封裝、光子封裝</p>  
        <p type="p">104:波導</p>  
        <p type="p">106:光子元件</p>  
        <p type="p">110:光子晶粒</p>  
        <p type="p">112:光耦合器、光柵耦合器</p>  
        <p type="p">114:互連結構</p>  
        <p type="p">115:通孔</p>  
        <p type="p">120:經包封電子裝置</p>  
        <p type="p">130:光學支撐件</p>  
        <p type="p">140:接合層</p>  
        <p type="p">152,154:透鏡結構</p>  
        <p type="p">1541:填充材料</p>  
        <p type="p">170:導電連接件</p>  
        <p type="p">172:導電接墊</p>  
        <p type="p">173:鈍化層</p>  
        <p type="p">180:光纖、光訊號源</p>  
        <p type="p">S1:上部表面</p>  
        <p type="p">S2:下部表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="609" publication-number="202612448"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612448.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612448</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241128B">H10B12/00</main-classification>  
        <further-classification edition="200601120241128B">H01L21/768</further-classification>  
        <further-classification edition="200601120241128B">H01L23/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝亞侖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YA-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例提供一種半導體結構，包括設置於基板中的主動區、設置於主動區上的閘極結構、設置於閘極結構兩側的基板中的二源極/汲極區、設置於閘極結構的兩側的二位元線觸點、圍繞閘極結構的上部的第一介電層及圍繞每個位元線觸點的上部的第二介電層。每個位元線觸點直接接觸每個源極/汲極區的一部分。此外，本揭露也提供一種製造半導體結構的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of this disclosure provide a semiconductor structure, including an active area disposed in a substrate, a gate structure disposed on the active area, two source/drain regions disposed in the substrate on both sides of the gate structure, two bit line contacts disposed on the both sides of the gate structure, a first dielectric layer surrounding an upper portion of the gate structure and a second dielectric layer surrounding an upper portion of each of the two bit line contacts. Each of the two bit line contacts directly contacts a portion of each of the two source/drain regions. Additionally, a method of manufacturing a semiconductor structure is also provided in this disclosure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板</p>  
        <p type="p">120:閘極結構</p>  
        <p type="p">122:閘極介電層</p>  
        <p type="p">124:閘極電極層</p>  
        <p type="p">126:閘極覆蓋層</p>  
        <p type="p">128:間隔件</p>  
        <p type="p">132:第一介電層</p>  
        <p type="p">134:第二介電層</p>  
        <p type="p">AA:主動區</p>  
        <p type="p">d:距離</p>  
        <p type="p">OP2:第二開口</p>  
        <p type="p">S/D:源極/汲極區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="610" publication-number="202611272"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611272.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611272</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141296</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>丙烯酸酯基質液晶向列型曲線配向相(NCAP)</chinese-title>  
        <english-title>ACRYLATE BASED MATRIX LIQUID CRYSTALS NCAP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09K19/32</main-classification>  
        <further-classification edition="200601120251201B">C09K19/54</further-classification>  
        <further-classification edition="200601120251201B">G02F1/1333</further-classification>  
        <further-classification edition="200601120251201B">G02F1/1335</further-classification>  
        <further-classification edition="200601120251201B">G02F1/1343</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商奧寶科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORBOTECH LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾維夫　亞榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVIV, YARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡區隆　席利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KACHLON, SHIRLY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾弗雷姆　迪法許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EFRAIM, DVASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祖爾　歐姆里　艾維拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZUR, OMRI AVIRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉里　歐菲爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEARI, OFIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史奇瓦茲包姆　埃葉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHWARZBAUM, ARYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛雄　艾倫　勞倫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GERSHON, ALAN LAWRENCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡巴德　瑪辛姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHABAD, MAXIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種包含一調變器材料層之光電調變器。該調變器材料層包含一聚合物基質。液晶液滴分散於該聚合物基質內。該等液晶經組態以調變穿過該光電調變器之透光率。該聚合物基質可包含一丙烯酸酯基質。該聚合物基質可降低該光電調變器之一接通電壓。該光電調變器可為一成像系統之一組件，該成像系統亦指稱一自動化光學檢測(AOI)系統、一電壓成像光學系統(VIOS)、一陣列檢查器及其類似者。藉由降低該接通電壓，可改良光學檢測之程序改良。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electro-optic modulator includes a modulator material layer. The modulator material layer includes a polymer matrix. Droplets of liquid crystals are dispersed within the polymer matrix. The liquid crystals are configured to modulate light transmissivity through the electro-optic modulator. The polymer matrix may include an acrylate-based matrix. The polymer matrix may reduce a turn-on voltage of the electro-optic modulator. The electro-optic modulator may be a component of an imaging system, also referred to as an automated optical inspection (AOI) system, a voltage imaging optical system (VIOS), an array checker, and the like. By reducing the turn-on voltage, process improvements of the optical inspection may be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光電調變器</p>  
        <p type="p">102:抗反射塗層</p>  
        <p type="p">104:玻璃基板</p>  
        <p type="p">110:透明導電層</p>  
        <p type="p">114:調變器材料層</p>  
        <p type="p">118:介電鏡膜</p>  
        <p type="p">120:介電基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="611" publication-number="202612176"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612176.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612176</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線端連接器及連接器組合</chinese-title>  
        <english-title>WIRE-END CONNECTOR AND CONNECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">H01R9/03</main-classification>  
        <further-classification edition="200601120241128B">H01R9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴中元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, ZHONGYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫正國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, ZHENGGUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊海濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HAIBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種線端連接器，包括：具有軸向的絕緣本體；與前述軸向垂直延伸的線纜，前述線纜具有複數芯線；遮蔽殼體，前述遮蔽殼體包覆住前述絕緣本體並限位固持前述線纜；複數導電端子，由前述絕緣本體固持住並露出前述遮蔽殼體，前述導電端子與前述芯線一一對應且電性連接；前述遮蔽殼體能夠帶動前述線纜繞著前述軸向相對於前述絕緣本體正/反向旋轉。本發明還有關於一種連接器組合。本發明中的線纜不會對線端連接器在板端連接器上的安裝造成干涉，有利於線端連接器在板端連接器上的順利對接，提高了工作者的便捷使用體驗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wire-end connector comprising: an insulating body with an axial orientation; a cable extending perpendicular to the axial direction, wherein the cable has a plurality of cores; a shielding shell, the shielding shell wraps the insulating body and holds the cable at a limiting level; a plurality of conductive terminals, wherein the conductive terminals are fixedly held by the insulating body and expose the shielding shell, and the conductive terminals correspond to the cores one-to-one and are electrically connected. The shielding housing can drive the cable to rotate forward/reverse around the axial direction with respect to the insulating body. The present invention also relates to a connector assembly. The cable in the present invention does not interfere with the installation of the wire end connector on the board end connector, is conducive to the smooth docking of the wire end connector on the board end connector, and improves the convenient use experience of workers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絕緣本體</p>  
        <p type="p">100:線端連接器</p>  
        <p type="p">121:第一防呆結構</p>  
        <p type="p">2:導電端子</p>  
        <p type="p">3:遮蔽殼體</p>  
        <p type="p">30:圓形孔</p>  
        <p type="p">4:線纜</p>  
        <p type="p">5:蓋體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="612" publication-number="202611646"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611646.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611646</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141393</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造裝置及其參數調整方法</chinese-title>  
        <english-title>SEMICONDUCTOR MANUFACTURING APPARATUS AND PARAMETER ADJUSTMENT METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G03F9/00</main-classification>  
        <further-classification edition="200601120241202B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀨川一宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEGAWA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體製造裝置及其參數調整方法。於製程裝置執行圖案化製程前，對晶圓的對準標記進行量測，而產生對準標記的位置資料以及品質資料。依據位置資料以及品質資料校正製程裝置執行圖案化製程以及晶圓接合時使用的對準配方參數以及量測裝置量測晶圓的對準標記的相對位置時使用的疊對配方參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor manufacturing apparatus and a parameter adjustment method thereof are provided. Measurement of an alignment mark of a wafer is performed to generate position data and quality data of the alignment mark before a patterning process executed by a process device. Calibration of alignment recipe parameters used in the process device to perform the patterning process and wafer bonding and calibration of overlay recipe parameters used in a measuring device to measure relative position of alignment marks of the wafer are performed according to the position data and the quality data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S202~S210:半導體製造裝置的參數調整方法</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="613" publication-number="202611271"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611271.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611271</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141609</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶組合物、液晶顯示元件或液晶顯示器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">C09K19/18</main-classification>  
        <further-classification edition="200601120241125B">C09K19/20</further-classification>  
        <further-classification edition="200601120241125B">C09K19/30</further-classification>  
        <further-classification edition="200601120241125B">C09K19/42</further-classification>  
        <further-classification edition="200601120241125B">G02F1/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商石家莊誠志永華顯示材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIJIAZHUANG CHENGZHI YONGHUA DISPLAY MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任惜寒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, XI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜開陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, KAI-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張冠超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GUAN-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宰亞孟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZAI, YA-MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹淩威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, LING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JING, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種膽甾相液晶組合物，該液晶組合物含有一種或多種式I所示化合物，一種或多種式II所示化合物，一種或多種式III所示化合物，一種或多種式IV所示化合物以及一種或多種手性活性物質。本發明的液晶組合物具有較大的光學各向異性 (Δn≥0.22)、較大的介電各向異性、超寬的工作溫度範圍 (-30~95℃)、良好的信賴性尤其是對比度高 (對比度＞25)、不同溫度下波長變化小 (△λ≤ 20 nm) 且該液晶組合物可以改善液晶顯示器的抖動不良同時可以在車載環境下有優良的抗震性能，尤其是在-30℃和90℃具有良好的抗震動性能。可以廣泛應用於液晶電子書、戶外和車載顯示等光學器件中。 &lt;br/&gt;&lt;img align="absmiddle" height="318px" width="436px" file="ed10206.JPG" alt="ed10206.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="614" publication-number="202610733"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610733.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610733</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141713</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>集塵系統及其方法</chinese-title>  
        <english-title>METHODS AND SYSTEMS FOR COLLECTING DUST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">B08B5/04</main-classification>  
        <further-classification edition="200601120250328B">B08B17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧佳鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JIA-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張富鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭皓今</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HAO-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">集塵器放置在半導體製造廠的排氣管的彎頭處。集塵器位在頂部閥下方。這減少了排氣管本身的灰塵堆積，減少了停機時間並且易於清潔。描述了數種不同類型的集塵器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Dust traps are placed at elbows in the exhaust duct of a semiconductor fabrication plant. The dust trap is located below a top valve. This reduces dust buildup in the exhaust duct itself, reduces downtime, and provides ease of cleaning. Several different types of dust traps are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">108:灰塵</p>  
        <p type="p">112:水平區段</p>  
        <p type="p">114:垂直區段</p>  
        <p type="p">116:接頭</p>  
        <p type="p">120:集塵器</p>  
        <p type="p">122:圓柱形側壁/側壁</p>  
        <p type="p">124:上端</p>  
        <p type="p">125:高度</p>  
        <p type="p">126:下端</p>  
        <p type="p">128:觀察口</p>  
        <p type="p">150:頂部閥</p>  
        <p type="p">160:底部閥</p>  
        <p type="p">170:箱子</p>  
        <p type="p">B-B:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="615" publication-number="202611834"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611834.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611834</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141778</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其資料處理方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS AND DATA PROCESSING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250715B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120250715B">G06Q30/02</further-classification>  
        <further-classification edition="200601120250715B">G06F3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田得勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, DESHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鈞凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUNKAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電子裝置及其資料處理方法。本發明之電子裝置之資料處理方法可包括如下步驟：於第1虛擬目錄中獲得源表之檔案，該源表包括與電子商務服務相關之複數個第1欄位及製品之第1資料；基於預設之條件，過濾與在上述複數個第1欄位中選擇之第1欄位對應之第1資料；基於與用以管理製品之複數個第2欄位相關之邏輯，自過濾之上述第1資料產生與上述複數個第2欄位對應之製品之第2資料；產生包括上述複數個第2欄位及上述第2資料之目標表；及向用戶終端提供上述目標表之檔案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:步驟</p>  
        <p type="p">203:步驟</p>  
        <p type="p">205:步驟</p>  
        <p type="p">207:步驟</p>  
        <p type="p">209:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="616" publication-number="202611819"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611819.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611819</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141821</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提議提供通知資訊之裝置及其方法</chinese-title>  
        <english-title>APPARATUS FOR PROPOSING TO PROVIDE NOTIFICATION INFORMATION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250401B">G06Q30/015</main-classification>  
        <further-classification edition="202301120250401B">G06Q30/0241</further-classification>  
        <further-classification edition="202301120250401B">G06Q30/0251</further-classification>  
        <further-classification edition="202301120250401B">G06Q30/0601</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣建浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KEON HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉至安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, JI AHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳佳熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, GA HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，揭示一種於電子裝置中處理資訊之方法，其包括如下步驟：確認與第1關鍵字相關聯之顧客之行為滿足設定之條件；基於顧客之服務利用歷史，判斷是否推測為顧客不期望接收通知資訊；於未推測為顧客不期望接收通知資訊之情形時，向顧客提供如下之資訊，即，提議接收與第1關鍵字相關聯之通知資訊之資訊；及於自顧客接收對提供與第1關鍵字相關聯之通知資訊之核准應答之情形時，將顧客確定為與第1關鍵字相關聯之通知資訊之提供對象之候選。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">120:顧客之裝置</p>  
        <p type="p">201:動作</p>  
        <p type="p">202:動作</p>  
        <p type="p">203:動作</p>  
        <p type="p">204:動作</p>  
        <p type="p">205:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="617" publication-number="202612538"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612538.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612538</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電放電保護二極體、其形成方法以及其應用電路</chinese-title>  
        <english-title>DIODE FOR ELECTROSTATIC DISCHARGE PROTECTION, FORMATION METHOD THEREOF AND CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250401B">H10D89/60</main-classification>  
        <further-classification edition="200601120250401B">H01L23/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雋庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪志斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIH-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘錦勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, CHIN-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江蕙宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HUI YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張子恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TZU-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李庭逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">靜電放電（ESD）保護二極體包括P型層和與P型層接觸的N型層，在它們之間的介面形成有PN接面。PN接面是非平面的。在一種製造方法中，執行摻雜物植入以在P型層中形成N型井，N型井與N型層重疊或相鄰，並增加PN接面的表面積。ESD保護二極體還可具有陽極和陰極。被保護的積體電路（IC）可具有配置在IC相對側的第一和第二電源分配網路，與IC連接以為IC供電，ESD保護二極體配置在電源分配網路之間，陰極是一電源分配網路的部分，陽極是另一電源分配網路的部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrostatic discharge (ESD) protection diode includes a P-type layer and an N-type layer in contact with the P-type layer to form a PN junction at an interface therebetween. The PN junction is non-planar. In one fabrication approach, dopant implantation is performed to form N-type wells in the P-type layer, which overlap or are contiguous with the N-type layer and increase a surface area of the PN junction. The ESD protection diode may also have an anode and a cathode. The integrated circuit (IC) being protected may have first and second power distribution networks disposed on opposite sides of the IC that connect with the IC to electrically power the IC, and the ESD protection diode is disposed between the power distribution networks with the cathode being part of one power distribution network and the anode being part of the other power distribution network.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:ESD保護二極體</p>  
        <p type="p">12:N型區域/N型層</p>  
        <p type="p">14:P型區域/P型層</p>  
        <p type="p">16:PN接面</p>  
        <p type="p">20:N型區域接觸件</p>  
        <p type="p">22:P型區域接觸件</p>  
        <p type="p">24:陰極</p>  
        <p type="p">26:陽極</p>  
        <p type="p">28:N&lt;sup&gt;+&lt;/sup&gt;摻雜區域/N&lt;sup&gt;+&lt;/sup&gt;摻雜層</p>  
        <p type="p">30:深N型井(DNW)</p>  
        <p type="p">32:過渡區域</p>  
        <p type="p">34:氧化物區域</p>  
        <p type="p">D1、D2、D3:厚度</p>  
        <p type="p">S1:間距</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="618" publication-number="202610778"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610778.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610778</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142096</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>漿液過濾系統及漿液過濾方法</chinese-title>  
        <english-title>SLURRY FILTRATION SYSTEM AND SLURRY FILTRATION METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">B24B57/00</main-classification>  
        <further-classification edition="200601120250703B">B03B5/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖孜康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, TZU-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊豐安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FENG-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧順展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, SHUN CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江宜蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, I-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴彥程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾易龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, YI-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供方法。該方法包括：將化學機械研磨（CMP）漿液流入過濾組件，過濾組件包括沿過濾件軸延伸的過濾件，所述流入是經由入口，所述入口定義於所述過濾組件的主體中且位於鄰近所述過濾件的第一端的第一位置，所述入口沿與所述過濾件軸不平行的入口軸延伸；以及在將所述CMP漿液流入所述過濾組件之後，將所述CMP漿液經由第一出口流出所述過濾組件，所述第一出口定義於所述過濾組件的所述主體中且位於鄰近所述過濾件的第二端的第二位置，所述第一出口沿與所述過濾件軸不平行的第一出口軸延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method is provided. The method includes: flowing chemical mechanical polishing (CMP) slurry into a filter assembly, the filter assembly including a filter element extending along a filter element axis, the flowing being via an inlet defined in a body of the filter assembly and located at a first location adjacent a first end of the filter element, the inlet extending along an inlet axis non-parallel to the filter element axis; and after flowing the CMP slurry into the filter assembly, flowing the CMP slurry out of the filter assembly via a first outlet, the first outlet defined in the body of the filter assembly and located at a second location adjacent a second end of the filter element, the first outlet extending along a first outlet axis non-parallel to the filter element axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:過濾器</p>  
        <p type="p">310:主體、殼體</p>  
        <p type="p">312,314,316:壁</p>  
        <p type="p">313:入口</p>  
        <p type="p">313,315,318,322:開口</p>  
        <p type="p">315,317:出口</p>  
        <p type="p">317,319,315:第二出口</p>  
        <p type="p">320:過濾件</p>  
        <p type="p">324:第一端</p>  
        <p type="p">326:第二端</p>  
        <p type="p">330,340:第二傳輸管線</p>  
        <p type="p">342:第三傳輸管線</p>  
        <p type="p">382:入口軸</p>  
        <p type="p">386:過濾件軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="619" publication-number="202612534"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612534.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612534</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路及其製造方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250922B">H10D89/10</main-classification>  
        <further-classification edition="202501120250922B">H10D84/83</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張維麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEI-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">積體電路包含第一組主動區及第一組及第二組閘極。第一組主動區在第一方向中延伸，且在第一層級上，第一組主動區對應至第一電晶體。第一組閘極，在第二方向中延伸且在第二層級上，並與第一組主動區重疊，第一組閘極對應至第一電晶體。第一組閘極的每個閘極以第一間距在第二方向中與第二組閘極的相鄰閘極隔開，第二組閘極的每個閘極以不同於第一間距的第二間距在第二方向中與第二組閘極的相鄰閘極隔開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit includes a first set of active regions and a first and second set of gates. The first set of active regions extends in a first direction, and is on a first level. The first set of active regions corresponds to a first transistor. The first set of gates extends in a second direction, is on a second level, and overlaps the first set of active regions. The first set of gates corresponds to the first transistor. Each gate of the first set of gates is separated from an adjacent gate of the second set of gates in the second direction by a first pitch. Each gate of the second set of gates is separated from an adjacent gate of the second set of gates in the second direction by a second pitch different from the first pitch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300C:積體電路</p>  
        <p type="p">322,322a,322b,322c,322d,322e,322f,322g,322h:主動區</p>  
        <p type="p">324,324a,324b,324c,324d,324e,324f,324g,G1,G2:閘極</p>  
        <p type="p">326,326a,326b,326c,326d:接點</p>  
        <p type="p">S:源極區</p>  
        <p type="p">D:汲極區</p>  
        <p type="p">CPP1,CPP2,CPP3:間距</p>  
        <p type="p">L1:長度</p>  
        <p type="p">W1b,W2b:寬度</p>  
        <p type="p">MD:擴散上金屬</p>  
        <p type="p">Poly:多晶矽</p>  
        <p type="p">OD:氧化物擴散</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="620" publication-number="202612214"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612214.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612214</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>不斷電系統以及與其搭配使用的ｉＯＳ行動裝置與Ａｎｄｒｏｉｄ行動裝置</chinese-title>  
        <english-title>UNINTERRUPTIBLE POWER SYSTEM AND IOS AND ANDROID MOBILE DEVICES USED WITH IT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H02J9/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>碩天科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CYBER POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詠翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭皓中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HAO-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱永昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種不斷電系統以及與其搭配使用的iOS行動裝置與Android行動裝置。所述不斷電系統包括有感測電路、記憶空間、控制單元與第一藍芽模組。記憶空間用以儲存不斷電系統之一狀態資訊。控制單元用以依據感測電路提供的感測資訊判斷不斷電系統是否發生一事件，當判斷為是時便更新記憶空間中之狀態資訊。第一藍芽模組用以記憶一行動裝置之訂閱設定，並用以遵循訂閱設定檢視記憶空間中之狀態資訊是否被更新。每當狀態資訊被更新時，第一藍芽模組便將更新後的狀態資訊主動傳送給行動裝置之一第二藍芽模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An uninterruptible power system (UPS) and iOS and Android mobile devices used with it are provided. The UPS comprises a sensing circuit, a memory space, a control unit and a first Bluetooth module. The memory space is used to store a status information of the UPS. The control unit is used to determine whether an event occurs in the UPS based on a sensing information provided by the sensing circuit. When it is determined to be yes, the control unit updates the status information in the memory space. The first Bluetooth module is used to memorize a subscription setting of a mobile device, and to check whether the status information in the memory space is updated according to the subscription setting. Whenever the status information is updated, the first Bluetooth module actively transmits the updated status information to a second Bluetooth module of the mobile device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S302~S304:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="621" publication-number="202611805"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611805.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611805</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142225</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>於取貨服務註冊銷售者之地址之方法、電子裝置及記錄有命令之記錄媒體</chinese-title>  
        <english-title>METHOD, ELECTRONIC DEVICE AND RECORDING MEDIUM STORING INSTRUCTIONS FOR REGISTERING ADDRESS OF SELLER WITH PICKUP SERVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250502B">G06Q10/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜金男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JINNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEIQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李順鐸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHUNDUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋施恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, SEEEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明之一實施例，可提出一種於取貨服務註冊銷售者之地址之電子裝置。本發明之裝置可接收用以將上述銷售者之地址註冊至銷售者之銷售對象商品之取貨服務之註冊請求，基於與上述註冊請求中包括之上述銷售者之地址關聯之字串而識別與上述銷售者之地址對應之地區，並確定上述識別之地區是否支持上述取貨服務，隨著確定為上述識別之地區支持上述取貨服務，將上述銷售者之地址註冊至上述取貨服務，並將指示上述銷售者之地址已註冊至上述取貨服務之第1響應資訊傳輸至上述外部裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:取貨服務</p>  
        <p type="p">110:銷售者</p>  
        <p type="p">113:銷售者地址</p>  
        <p type="p">115:銷售對象商品</p>  
        <p type="p">117:重量類型</p>  
        <p type="p">120:集貨倉庫</p>  
        <p type="p">130:取貨車輛</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="622" publication-number="202611796"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611796.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611796</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142226</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供取貨時間之方法、裝置及記錄有命令之記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM STORING INSTRUCTIONS FOR PROVIDING PICKUP TIME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250508B">G06Q10/02</main-classification>  
        <further-classification edition="202401120250508B">G06Q10/08</further-classification>  
        <further-classification edition="202301120250508B">G06Q10/109</further-classification>  
        <further-classification edition="202301120250508B">G06Q30/01</further-classification>  
        <further-classification edition="202301120250508B">G06Q30/06</further-classification>  
        <further-classification edition="202401120250508B">G06Q50/40</further-classification>  
        <further-classification edition="200601120250508B">G06F9/50</further-classification>  
        <further-classification edition="200601120250508B">G06F13/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜金男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JINNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEIQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHIZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李順鐸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHUNDUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋施恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, SEEEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明一實施例，可提出一種提供取貨時間之裝置。本發明之裝置可自外部裝置接收入庫資訊，該入庫資訊係指示銷售者之目標銷售商品之取貨服務者；基於上述入庫資訊，確定可對上述目標銷售商品實現上述取貨服務之一個以上之取貨時窗；將指示上述一個以上之取貨時窗之取貨資訊傳輸至上述外部裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:取貨服務</p>  
        <p type="p">110:銷售者</p>  
        <p type="p">113:銷售者地址</p>  
        <p type="p">115:代售產品</p>  
        <p type="p">117:取貨類型</p>  
        <p type="p">120:集貨中心</p>  
        <p type="p">130:取貨車輛</p>  
        <p type="p">135:第1路徑</p>  
        <p type="p">140:物流中心</p>  
        <p type="p">145:第2路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="623" publication-number="202611577"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611577.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611577</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142261</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置及其製造方法</chinese-title>  
        <english-title>OPTICAL DEVICE AND METHOD OF MANUFACTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250519B">G02B6/13</main-classification>  
        <further-classification edition="200601120250519B">G02B6/26</further-classification>  
        <further-classification edition="200601120250519B">H01L21/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉家宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒家翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHIA-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林裕翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提出了光學裝置及製造方法，其中當光訊號在諸如光纖的外部元件與位於第一光學封裝內的邊緣耦合器之間傳輸時，利用超表面來輔助光訊號。超表面包括可用於幫助引導光訊號至邊緣耦合器的超原子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Optical devices and methods of manufacture are presented in which a metasurface is utilized to assist optical signals as the optical signals transit between an external device such as an optical fiber and an edge coupler located within a first optical package. The metasurface includes meta-atoms which may be used to help lead the optical signals to the edge coupler.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學中介物</p>  
        <p type="p">201:第一主動層</p>  
        <p type="p">203:第一光學組件</p>  
        <p type="p">205:邊緣耦合器</p>  
        <p type="p">401:第二絕緣體層</p>  
        <p type="p">501:第一金屬化層</p>  
        <p type="p">503:第二光學組件</p>  
        <p type="p">505:第一接合層</p>  
        <p type="p">507:第一接合墊</p>  
        <p type="p">509:第一介電材料</p>  
        <p type="p">511:第三光學組件</p>  
        <p type="p">601:第一半導體元件</p>  
        <p type="p">603:半導體基底</p>  
        <p type="p">605:主動元件</p>  
        <p type="p">607:互連結構</p>  
        <p type="p">609:第二接合層</p>  
        <p type="p">611,909:第三接合墊</p>  
        <p type="p">613:第一間隙填充材料</p>  
        <p type="p">701:第一支撐基底</p>  
        <p type="p">801:第二主動層</p>  
        <p type="p">803:第四光學組件</p>  
        <p type="p">900:第一光學封裝</p>  
        <p type="p">901:第一穿過元件的通孔/第一TDV</p>  
        <p type="p">903:第三接合層</p>  
        <p type="p">911:第五光學組件</p>  
        <p type="p">1001:超表面</p>  
        <p type="p">1003:光訊號</p>  
        <p type="p">1005:光纖</p>  
        <p type="p">1011:光纖陣列單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="624" publication-number="202610760"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610760.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610760</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142344</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電批結構及電批</chinese-title>  
        <english-title>ELECTRIC BATCH STRUCTURE AND ELECTRIC BATCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250421B">B23P19/06</main-classification>  
        <further-classification edition="200601120250421B">B25B21/00</further-classification>  
        <further-classification edition="200601120250421B">B25B15/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣云卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YUN-QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>訾留飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZI, LIU-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡子琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TZYY-CHYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鬱五</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開一種電批結構及電批，電批結構包括主動件、從動件及轉動件。主動件設有複數第一輪齒。從動件包括主體與複數第二輪齒，主體具有外周面，複數第二輪齒設於部分之外周面，主體設有複數棘齒。轉動件包括轉軸與棘爪，棘爪連接於轉軸，轉軸用於安裝刀具。棘爪與棘齒被配置為於主體沿第一旋轉方向轉動時嚙合，棘爪帶動轉軸轉動使刀具轉動，棘爪與棘齒於主體沿第二旋轉方向轉動時不嚙合，轉軸與刀具靜止。外周面光滑之部分朝向產品能增加從動件與產品之間之距離，能防止於刀具作用於螺絲時從動件與產品發生干涉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application discloses an electric batch structure and electric batch, the electric batch structure comprising an active component, a passive component, and a rotating component. The active component is equipped with multiple first gear teeth. The driven component includes a main body and multiple second gear teeth. The main body has an outer peripheral surface, and multiple second gear teeth are located on the outer peripheral surface of a portion. The main body is equipped with multiple ratchet teeth. The rotating component includes a shaft and a pawl, with the pawl connected to the shaft and the shaft used for installing cutting tools. The pawl and ratchet teeth are configured to mesh when the main body rotates in the first direction of rotation. The pawl drives the shaft to rotate, causing the tool to rotate. The pawl and ratchet teeth do not mesh when the main body rotates in the second direction of rotation, and the shaft and tool remain stationary. The smooth part of the outer surface facing the product can increase the distance between the driven part and the product, and prevent interference between the driven part and the product when the tool acts on the screw.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電批結構</p>  
        <p type="p">10:主動件</p>  
        <p type="p">11:第一輪齒</p>  
        <p type="p">20:從動件</p>  
        <p type="p">21:主體</p>  
        <p type="p">211:外周面</p>  
        <p type="p">22:第二輪齒</p>  
        <p type="p">23:棘齒</p>  
        <p type="p">30:轉動件</p>  
        <p type="p">31:轉軸</p>  
        <p type="p">32:棘爪</p>  
        <p type="p">40:驅動件</p>  
        <p type="p">50:傳動件</p>  
        <p type="p">51:第一齒輪</p>  
        <p type="p">52:第二齒輪</p>  
        <p type="p">53:皮帶</p>  
        <p type="p">60:底座</p>  
        <p type="p">61:側面</p>  
        <p type="p">200:刀具</p>  
        <p type="p">a:第一旋轉方向</p>  
        <p type="p">b:第二旋轉方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="625" publication-number="202612034"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612034.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612034</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142370</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝及將散熱器應用於其上的方法與處理器模組</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND METHOD FOR APPLYING HEAT SINK TO SEMICONDUCTOR PACKAGE AND PROCESSOR MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250620B">H01L21/56</main-classification>  
        <further-classification edition="200601120250620B">H01L23/28</further-classification>  
        <further-classification edition="200601120250620B">H01L23/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍嘉昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, JIA-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張睿紳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JUI SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JYUN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊曜群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種熱界面薄膜使用於半導體晶粒和散熱器之間。熱界面薄膜包括至少兩層，第一層具有垂直取向石墨和第二層具有水平取向石墨。熱界面薄膜將熱量從半導體晶粒向上和向外引導，更快地將熱量擴散到較大的表面積上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thermal interface film is used between a semiconductor die and a heat sink. The thermal interface film includes at least two layers, a first layer with vertically oriented graphite and a second layer with horizontally oriented graphite. The thermal interface film directs heat away from the semiconductor die both upwards and outwards, spreading the heat over a larger surface area more quickly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:熱界面薄膜</p>  
        <p type="p">202:垂直取向石墨</p>  
        <p type="p">204:水平取向石墨</p>  
        <p type="p">206:聚合物樹脂</p>  
        <p type="p">210:第一層</p>  
        <p type="p">220:第二層</p>  
        <p type="p">230:第三層</p>  
        <p type="p">H1:第一高度</p>  
        <p type="p">H2:第二高度</p>  
        <p type="p">H2:第三高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="626" publication-number="202612358"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612358.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612358</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142391</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>音頻播放方法及投影裝置</chinese-title>  
        <english-title>AUDIO PLAYING METHOD AND PROJECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H04S5/02</main-classification>  
        <further-classification edition="200601120241204B">H04N5/222</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昆山揚皓光電有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORETRONIC PROJECTION (KUNSHAN) CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫逸飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YI-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種音頻播放方法及投影裝置。音頻播放方法適用於投影裝置，且該方法包括：接收開機信號、模式設定信號或感測信號後，判斷投影裝置的投影模式；當判斷投影模式為背投影且倒置操作或前投影且正置操作時，藉由音頻處理器控制左聲道揚聲器播放左聲道音訊，及控制右聲道揚聲器播放右聲道音訊；當判斷投影模式為背投影且正置操作或前投影且倒置操作時，藉由音頻處理器控制左聲道揚聲器播放右聲道音訊，及控制右聲道揚聲器播放左聲道音訊；當判斷投影模式為縱向模式，藉由音頻處理器控制左聲道揚聲器與右聲道揚聲器播放混合聲道音訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are an audio playing method and a projection device. The audio playing method is applicable to the projection device and the method includes: determining a projection mode of the projection device after receiving a power-on signal, a mode setting signal or a sensing signal; controlling a left-channel speaker to play left-channel audio and controlling a right-channel speaker to play right-channel audio by an audio processor when the projection mode is determined to be a rear projection and inverted operation or a front projection and upright operation; controlling the left-channel speaker to play right-channel audio and controlling the right-channel speaker to play left-channel audio by the audio processor when the projection mode is determined to be a rear projection and upright operation or a front projection and inverted operation; controlling the left-channel speaker and the right channel speaker to play mixed-channel audio by the audio processor when the projection mode is determined to be a portrait mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310,S320,S330,S340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="627" publication-number="202612014"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612014.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612014</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置與其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250529B">H01L21/306</main-classification>  
        <further-classification edition="200601120250529B">H01L21/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-GING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昀錚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">方法包括形成鰭狀結構於基板上；形成多個第一與第二奈米結構於鰭狀結構上，其中第一奈米結構與個別的第二奈米結構為連續結構；形成多個第一介電虛置區於第一奈米結構之間，以及多個第二介電虛置區於第二奈米結構之間；形成多個第一源極/汲極區以與第一奈米結構相鄰，並形成多個第二源極/汲極區以與第二奈米結構相鄰；進行蝕刻製程以移除第一介電虛置區與第二介電虛置區；沉積多個閘極結構層於第一奈米結構上與第二奈米結構上；以及形成隔離區於第一奈米結構與第二奈米結構之間，其中隔離區物理分隔第一奈米結構與第二奈米結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a fin structure over a substrate; forming first nanostructures and second nanostructures over the fin structure, wherein the first nanostructures are continuous with respective second nanostructures; forming first dielectric dummy regions between ones of the first nanostructures, and second dielectric dummy regions between ones of the second nanostructures; forming first source/drain regions adjacent the first nanostructures and second source/drain regions adjacent the second nanostructures; performing an etching process to remove the first dielectric dummy regions and the second dielectric dummy regions; depositing gate structure layers on the first nanostructures and the second nanostructures; and forming an isolation region between the first nanostructures and the second nanostructures, wherein the isolation region physically separates the first nanostructures from the second nanostructures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A1-A1',A2-A2',A3-A3',B1-B1',B2-B2':剖面</p>  
        <p type="p">62A,62B,62C,62D,62E:鰭狀物</p>  
        <p type="p">125:隔離區</p>  
        <p type="p">112:閘極</p>  
        <p type="p">120:閘極隔離區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="628" publication-number="202611858"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611858.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611858</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有物件偵測的影像處理方法及影像處理裝置</chinese-title>  
        <english-title>IMAGE PROCESSING METHOD AND IMAGE PROCSESING DEVICE WITH OBJECT DETECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250102B">G06T5/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張孝恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIAO-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像處理方法及影像處理裝置，此方法包括接收RGB色彩空間中包括多個區塊的輸入影像，計算前述區塊中的第一區塊中的第一像素與第一區塊中的第一像素的多個鄰近像素之間於各個RGB通道的像素值的差值，判斷RGB通道之中第一區塊的像素值具有最大差值的第一色彩通道，根據第一區塊於第一色彩通道的像素值的最大差值，針對第一區塊進行處理，以產生已處理的第一區塊，以及產生包括已處理的第一區塊的輸出影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image processing method and an image processing device are proposed. The method includes to receive an input image including multiple patches in RGB color space, compute a difference of pixel values among a first pixel and neighboring pixels thereof in a first patch among the patches with respect to each of RGB channels, determine a first color channel among the RGB channels having a maximum difference of the pixel values for the first patch, process the first patch according to the maximum difference of the pixel values for the first patch in the first color channel to generate a processed first patch, and generate an output image including the processed first patch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S202~S210:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="629" publication-number="202611724"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611724.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611724</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142549</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其服務提供性能管理方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS AND METHOD OF MANAGING PERFORMANCE OF PROVIDING SERVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F11/34</main-classification>  
        <further-classification edition="200601120250401B">G06F11/28</further-classification>  
        <further-classification edition="200601120250401B">G06F9/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚　得司蒙　新昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEOW, DESMOND SIN TEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈怡露</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YILU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江川</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐承恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>O, SEUNG EUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　尚秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SANGSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄雅慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄔耀平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YAOPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申英弼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, YOUNG PIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴美成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, MI SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉爾汗　普爾基特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RALHAN, PULKIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾卡扎　理查德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALCAZAR, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種電子裝置之服務提供性能管理方法。服務提供性能管理方法可包括如下步驟：確認應用程式之服務中包括之一個以上之後端服務間之依存性的資訊；基於一個以上之後端服務間之依存性之資訊，確認第1後端服務是否對應於與服務之提供相關之故障發生點；於第1後端服務對應於故障發生點之情形時，基於對第1後端服務具有依存性之第2後端服務之服務提供性能指標，確認對應於第1後端服務之故障發生點之類型；及基於所確認之類型，實行與服務之提供相關之故障管理動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310:步驟</p>  
        <p type="p">S320:步驟</p>  
        <p type="p">S330:步驟</p>  
        <p type="p">S340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="630" publication-number="202612532"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612532.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612532</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142899</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250526B">H10D84/83</main-classification>  
        <further-classification edition="202501120250526B">H10D84/01</further-classification>  
        <further-classification edition="202501120250526B">H10D30/01</further-classification>  
        <further-classification edition="202501120250526B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宏誌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HONG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　仁安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, JIN-AUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張世勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHIH-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">方法包括在鰭片基底上方形成具有通道層和犧牲層的堆疊、形成鄰近鰭片基底和堆疊的隔離部件、在堆疊和隔離部件上方形成虛置閘極結構、以及在鰭片基底中形成源極∕汲極溝槽並暴露犧牲層的側壁。犧牲層包括頂部和底部。方法還包括去除頂部以形成頂部開口和去除底部以形成底部開口，在頂部開口和底部開口中沉積虛置層，選擇性地且部分地凹蝕虛置層以形成內間隔凹槽、形成內間隔部件、形成源極∕汲極部件，並用金屬閘極結構替換虛置閘極結構和頂部開口中的虛置層，但不替換底部開口中的虛置層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a stack of channel layers and sacrificial layers over a fin base, forming an isolation feature adjacent to the fin base and the stack, forming a dummy gate structure over the stack and the isolation feature, and forming a source/drain trench in the fin base and exposing sidewalls of the sacrificial layers. The sacrificial layers include a top portion and a bottom portion. The method further includes removing the top portion to form a top opening and the bottom portion to form a bottom opening, depositing a dummy layer in the top and bottom openings, selectively and partially recessing the dummy layer to form inner spacer recesses, forming inner spacer features, forming a source/drain feature, and replacing the dummy gate structure and the dummy layer in the top opening but not the dummy layer in the bottom opening with a metal gate structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:結構</p>  
        <p type="p">202:基板</p>  
        <p type="p">212C:通道區</p>  
        <p type="p">212SD:源極/汲極區域</p>  
        <p type="p">226:閘極間隔層</p>  
        <p type="p">230:虛置層</p>  
        <p type="p">234:內間隔部件</p>  
        <p type="p">236:隔離層</p>  
        <p type="p">238:源極/汲極部件</p>  
        <p type="p">244:介電部件</p>  
        <p type="p">256:閘極結構</p>  
        <p type="p">256a:內部部分</p>  
        <p type="p">258:隔離結構</p>  
        <p type="p">2080:通道構件</p>  
        <p type="p">2080B:邊界半導體構件</p>  
        <p type="p">T0:厚度</p>  
        <p type="p">D3:距離</p>  
        <p type="p">B-B’:剖線</p>  
        <p type="p">C-C’:剖線</p>  
        <p type="p">X:X方向</p>  
        <p type="p">Y:Y方向</p>  
        <p type="p">Z:Z方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="631" publication-number="202611733"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611733.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611733</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142915</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快閃記憶體控制器的控制方法、快閃記憶體控制器及相關的記憶裝置</chinese-title>  
        <english-title>CONTROL METHOD OF FLASH MEMORY CONTROLLER, FLASH MEMORY CONTROLLER AND ASSOCIATED MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250206B">G06F12/0866</main-classification>  
        <further-classification edition="201601120250206B">G06F12/08</further-classification>  
        <further-classification edition="200601120250206B">G11C16/06</further-classification>  
        <further-classification edition="200601120250206B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慧榮科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICON MOTION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊子逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TZU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種快閃記憶體控制器的控制方法，其中該快閃記憶體控制器用來存取一快閃記憶體模組，且該控制方法包含：自該快閃記憶體模組中選擇一區塊，其中該區塊為一空白區塊；將該資料寫入至該區塊；在該區塊寫滿資料之後，決定由一主裝置寫入至該區塊的資料量，其中該主裝置位於該快閃記憶體之外；以及根據由該主裝置寫入至該區塊的資料量以及該區塊的大小，以決定該主裝置是否正在執行一順序寫入操作以將具有連續邏輯位址的該資料寫入至該區塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a control method of a flash memory controller, wherein the flash memory controller is configured to access a flash memory module. The flash memory controller includes the steps of: selecting a block within the flash memory module, wherein the block is a blank block; writing data into the block; after the block is full, determining an amount of data from a host device written into the block, wherein the host device is external to the flash memory controller; and determining if the host device is performing a sequential write operation to write the data with consecutive logical addresses into the block according to a size of the block and the amount of data from the host device written into the block.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶裝置</p>  
        <p type="p">110:快閃記憶體控制器</p>  
        <p type="p">112:微處理器</p>  
        <p type="p">112M:唯讀記憶體</p>  
        <p type="p">112C:程式碼</p>  
        <p type="p">114:控制邏輯</p>  
        <p type="p">116:緩衝記憶體</p>  
        <p type="p">118:介面邏輯</p>  
        <p type="p">120:快閃記憶體模組</p>  
        <p type="p">130:主裝置</p>  
        <p type="p">132:編碼器</p>  
        <p type="p">134:解碼器</p>  
        <p type="p">136:隨機化器</p>  
        <p type="p">138:解隨機化器</p>  
        <p type="p">140:DRAM</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="632" publication-number="202611835"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611835.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611835</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142996</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>執行測試案例之方法及裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR EXECUTING TEST CASE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q30/0601</main-classification>  
        <further-classification edition="202501120250801B">G06F11/36</further-classification>  
        <further-classification edition="200601120250801B">G06F9/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃凱凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KAIKAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之電子裝置利用預存之複數個組件而執行至少一個測試案例之方法的特徵在於包括如下步驟：識別至少一個測試案例中之欲執行之第1測試案例；確定複數個組件中之於第1測試案例中利用之至少一個第1組件；及利用所確定之至少一個第1組件而執行第1測試案例；且複數個組件各者包括將於至少一個測試案例各者中執行之至少一個階段中之一部分，且以能夠於至少一個測試案例間進行共享之方式預存。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:順序圖</p>  
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="633" publication-number="202611726"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611726.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611726</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143124</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其ＡＢ測試代碼管理方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS AND MANAGING AB TEST CODE METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250502B">G06F11/36</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高俊樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, JUNSHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電子裝置之AB測試代碼管理方法。AB測試代碼管理方法可包括如下步驟：確認AB測試檔案所包括之一個以上之AB測試代碼中之作為代碼清理之對象的第1 AB測試代碼、及第1 AB測試代碼之識別資訊；藉由自第1 AB測試代碼中移除第1 AB測試代碼之識別資訊而實行代碼清理；及儲存已實行第1 AB測試代碼之代碼清理之AB測試檔案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">210:處理器</p>  
        <p type="p">220:記憶體</p>  
        <p type="p">230:收發器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="634" publication-number="202611836"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611836.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611836</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供資訊之電子裝置及其方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE FOR PROVIDING INFORMATION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120250801B">G06Q30/0207</further-classification>  
        <further-classification edition="202301120250801B">G06Q30/015</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣建浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KEON HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉至安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, JI AHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西門弘益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEOMOON, HONG IK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳佳熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, GA HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種於電子裝置中提供資訊之方法，其包括如下步驟：基於用戶儲存於願望清單中之至少一個商品之資訊，識別至少一個商品儲存於願望清單中之儲存時點；於至少一個商品中，確認銷售價格相較於儲存時點變便宜之至少一個附加折扣商品；及將至少一個附加折扣商品之折扣資訊提供至用戶終端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">120:用戶終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="635" publication-number="202612520"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612520.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612520</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143156</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置結構與其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250624B">H10D64/01</main-classification>  
        <further-classification edition="202501120250624B">H10D64/20</further-classification>  
        <further-classification edition="202501120250624B">H10D64/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　仁安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, JIN-AUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林大鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁春昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHUN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">此處揭露具有底部絕緣的多閘極裝置與其製作方法。例示性的底部通道絕緣結構包括第一絕緣層位於基板(如其延伸物)上，以及第二絕緣層位於第一絕緣層上。第一絕緣層具有第一組成與第一長度。第二絕緣層具有第二組成與第二長度，第一組成與第二組成不同，且第二長度大於第一長度。第一絕緣層為一組犧牲層的底部犧牲層，而一組犧牲層在製作多閘極裝置時形成且之後置換成閘極堆疊。底部犧牲層為虛置犧牲層，因為其未置換成閘極堆疊，因此提供額外絕緣於閘極堆疊與基板之間及/或源極/汲極之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Multigate devices having bottom insulation and methods of fabrication thereof are disclosed herein. An exemplary bottom channel insulation structure includes a first insulation layer disposed over a substrate (e.g., an extension thereof) and a second insulation layer disposed over the first insulation layer. The first insulation layer has a first composition and a first length. The second insulation layer has a second composition that is different than the first composition and a second length that is greater than the first length. The first insulation layer is a bottom sacrificial layer of a set of sacrificial layers that are formed and subsequently replaced with a gate stack during fabrication of a multigate device. The bottom sacrificial layer is a dummy sacrificial layer because is not replaced with the gate stack, such that additional insulation is provided between the gate stack and the substrate and/or between source/drains.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">205:基板</p>  
        <p type="p">220':通道層</p>  
        <p type="p">236:閘極間隔物</p>  
        <p type="p">246b-2:犧牲層</p>  
        <p type="p">248,252:絕緣層</p>  
        <p type="p">249:內側間隔物</p>  
        <p type="p">250:源極/汲極結構</p>  
        <p type="p">258:摻雜半導體層</p>  
        <p type="p">264:介電層</p>  
        <p type="p">270:閘極堆疊</p>  
        <p type="p">272:閘極介電層</p>  
        <p type="p">274:閘極</p>  
        <p type="p">280:底部通道絕緣結構</p>  
        <p type="p">295:源極/汲極接點</p>  
        <p type="p">300:裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="636" publication-number="202612498"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612498.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612498</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143253</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250624B">H10D30/60</main-classification>  
        <further-classification edition="200601120250624B">H01L21/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃華源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HUA-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇祖輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, TSU-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林大鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖忠志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAW, JHON-JHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，包括：源極∕汲極區；第一奈米結構，鄰近源極∕汲極區；第二奈米結構，鄰近源極∕汲極區，第二奈米結構設置於第一奈米結構之上；第三奈米結構，鄰近源極∕汲極區，第三奈米結構設置於第二奈米結構之上；以及閘極結構，圍繞第一奈米結構、第二奈米結構、以及第三奈米結構。閘極結構的第一部設置於第一奈米結構與第二奈米結構之間，而閘極結構的第二部設置於第二奈米結構與第三奈米結構之間。閘極結構的第二部的長度小於閘極結構的第一部的長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device including a source/drain region, a first nanostructure adjacent the source/drain region, a second nanostructure adjacent the source/drain region, the second nanostructure disposed above the first nanostructure, and a third nanostructure adjacent the source/drain region. The second nanostructure is disposed above the second nanostructure. The semiconductor device also includes a gate structure around the first nanostructure, the second nanostructure, and the third nanostructure. A first portion of the gate structure is disposed between the first nanostructure and the second nanostructure, and a second portion of the gate structure disposed between the second nanostructure and the third nanostructure. The second portion of the gate structure has a smaller length than the first portion of the gate structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:基底</p>  
        <p type="p">50N:N型區</p>  
        <p type="p">50P:P型區</p>  
        <p type="p">54A:第二奈米結構</p>  
        <p type="p">54B:第二奈米結構</p>  
        <p type="p">54C:第二奈米結構</p>  
        <p type="p">66:鰭片</p>  
        <p type="p">81:閘極間隔物</p>  
        <p type="p">91A:內間隔物</p>  
        <p type="p">91B:內間隔物</p>  
        <p type="p">91C:內間隔物</p>  
        <p type="p">94:接觸蝕刻停止層</p>  
        <p type="p">96:第一層間介電質</p>  
        <p type="p">100:閘極介電層</p>  
        <p type="p">102:閘極電極</p>  
        <p type="p">192:磊晶源極/汲極區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="637" publication-number="202610720"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610720.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610720</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143622</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中空樹脂粒子、其製造方法及其用途</chinese-title>  
        <english-title>HOLLOW RESIN PARTICLE, METHOD FOR MANUFACTURING THE SAME, AND USE OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">B01J13/14</main-classification>  
        <further-classification edition="200601120251103B">C08F212/08</further-classification>  
        <further-classification edition="200601120251103B">C08F212/12</further-classification>  
        <further-classification edition="200601120251103B">C08F212/32</further-classification>  
        <further-classification edition="200601120251103B">C08F212/34</further-classification>  
        <further-classification edition="200601120251103B">C08F212/36</further-classification>  
        <further-classification edition="200601120251103B">C08F220/18</further-classification>  
        <further-classification edition="200601120251103B">C08F220/28</further-classification>  
        <further-classification edition="200601120251103B">C08F222/10</further-classification>  
        <further-classification edition="200601120251103B">C08K7/22</further-classification>  
        <further-classification edition="200601120251103B">C08L101/00</further-classification>  
        <further-classification edition="200601120251103B">H05K1/03</further-classification>  
        <further-classification edition="200601120251103B">H01L23/14</further-classification>  
        <further-classification edition="200601120251103B">H01L23/29</further-classification>  
        <further-classification edition="200601120251103B">H01L23/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化成品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI KASEI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中浩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種粗大粒子數降低，且粒子強度優異的中空樹脂粒子。又，本發明係提供一種如此之中空樹脂粒子的用途。又，本發明係提供一種製造如此之中空樹脂粒子的方法。 &lt;br/&gt;本發明之實施型態的中空樹脂粒子，係具有殼部及藉由該殼部所包圍之中空部分，且空隙率為5至90%，在下述測定條件A中使用流動式粒子影像分析裝置所求得之在粒子1,000,000個中的粒徑10μm以上之粒子數為45個以下。 &lt;br/&gt;(測定條件A)粒徑之測定範圍(球換算體積基準)：0.5μm至200.0μm，圓形度之測定範圍：0.97至1.00。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides hollow resin particles having a reduced number of coarse particles and excellent particle strength. The present invention also provides uses of such hollow resin particles. The present invention also provides a method for manufacturing such hollow resin particles. &lt;br/&gt;The hollow resin particle according to the embodiment of the present invention is a hollow resin particle having a shell portion and a hollow portion surrounded by the shell portion, and has a porosity of 5 to 90%, and the number of particles having a particle diameter of 10 μm or more among 1,000,000 particles determined using a flow particle image analyzer with the following measurement condition A is 45 or less. &lt;br/&gt;(Measurement Condition A) Measurement range of particle diameter (based on sphere equivalent volume): 0.5 μm to 200.0 μm, Measurement range of circularity: 0.97~1.00</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="638" publication-number="202611090"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611090.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611090</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143624</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中空樹脂粒子、其製造方法及其用途</chinese-title>  
        <english-title>HOLLOW RESIN PARTICLE, METHOD FOR MANUFACTURING THE SAME, AND USE OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250421B">C08F2/22</main-classification>  
        <further-classification edition="200601120250421B">C08F2/44</further-classification>  
        <further-classification edition="200601120250421B">C08K7/22</further-classification>  
        <further-classification edition="200601120250421B">B01J13/14</further-classification>  
        <further-classification edition="200601120250421B">C08F212/08</further-classification>  
        <further-classification edition="200601120250421B">C08F212/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化成品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI KASEI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中浩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種粗大粒子數降低，且粒子強度優異的中空樹脂粒子。又，本發明係提供一種如此之中空樹脂粒子的用途。又，本發明係提供一種製造如此之中空樹脂粒子的方法。 &lt;br/&gt;本發明之實施型態的中空樹脂粒子，係具有殼部及藉由該殼部所包圍之中空部分，且空隙率為5至90%，相對於粒徑1μm至30μm之粒子的合計，藉由庫爾特計數器法(孔徑50μm)所求得的粒徑10μm以上之粒子的比例為1.0體積%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides hollow resin particles having a reduced number of coarse particles and excellent particle strength. The present invention also provides uses of such hollow resin particles. The present invention also provides a method for manufacturing such hollow resin particles. &lt;br/&gt;The hollow resin particle according to an embodiment of the present invention is a hollow resin particle having a shell portion and a hollow portion surrounded by the shell portion, and has a porosity of 5 to 90%, and a ratio of particles having a particle diameter of 10 μm or more determined by a Coulter counter method (aperture diameter of 50 μm) is 1.0% by volume or less with respect to the total of particles having a particle diameter of 1 μm to 30 μm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">本案無圖式。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="639" publication-number="202611459"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611459.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611459</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷卻系統</chinese-title>  
        <english-title>COOLING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">F28D15/02</main-classification>  
        <further-classification edition="200601120241126B">F28F3/02</further-classification>  
        <further-classification edition="200601120241126B">H05K7/20</further-classification>  
        <further-classification edition="200601120241126B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣達電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTA COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仁茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JEN-MAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王維德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉明翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, MIN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種冷卻系統，用於一計算裝置，冷卻系統包括一冷板，配置以從一熱源傳導熱。冷卻系統更包括一相變冷卻劑模組，設置於熱源與冷板之間，並熱接觸熱源與冷板。相變冷卻劑模組包含一相變冷卻劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cooling system for a computing device includes a cold plate configured for conducting heat away from a heat source. The cooling system further includes a phase-change coolant module disposed between and in thermal contact with the heat source and the cold plate. The phase-change coolant module contains a phase-change coolant.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:冷板</p>  
        <p type="p">105:基座</p>  
        <p type="p">110:鰭片</p>  
        <p type="p">115:蓋</p>  
        <p type="p">120:液體冷卻劑入口</p>  
        <p type="p">125:入口接頭</p>  
        <p type="p">130:液體冷卻劑出口</p>  
        <p type="p">135:出口接頭</p>  
        <p type="p">140:熱源</p>  
        <p type="p">200:冷卻系統</p>  
        <p type="p">205:相變冷卻劑模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="640" publication-number="202610575"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610575.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610575</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143847</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浴室玻璃壁面結構、壁面結構中的導水件及其施作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A47K3/30</main-classification>  
        <further-classification edition="200601120241130B">E04C2/02</further-classification>  
        <further-classification edition="200601120241130B">E04G23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇致豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇致豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種浴室玻璃壁面結構、壁面結構中的導水件及其施作方法，所述玻璃壁面結構包含一間隔層、一導水件與一玻璃層。該間隔層係設置於該浴室壁面下方，該導水件係設置在該間隔層的頂邊，該玻璃層係設置在該導水件的上方，該玻璃層具有至少一玻璃，該等玻璃黏貼於該浴室壁面。藉之，如潑水在該玻璃層上，該等玻璃是非多孔材料，不會吸收水分，水受到地心引力的影響向下滴落在該導水件上，該導水件則可將水導至地面，以避免水滲入該間隔層，從而達到良好的防水效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:玻璃壁面結構</p>  
        <p type="p">301:底邊</p>  
        <p type="p">302:頂邊</p>  
        <p type="p">31:壁磚</p>  
        <p type="p">311:壁磚間隔</p>  
        <p type="p">33:填縫劑</p>  
        <p type="p">40:導水件</p>  
        <p type="p">50:玻璃層</p>  
        <p type="p">501:底邊</p>  
        <p type="p">502:頂邊</p>  
        <p type="p">51:玻璃</p>  
        <p type="p">511:玻璃間隔</p>  
        <p type="p">60:地面</p>  
        <p type="p">70:接著劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="641" publication-number="202611825"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611825.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611825</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144078</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其動作方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250502B">G06Q30/02</main-classification>  
        <further-classification edition="202301120250502B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張世文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHIWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周垚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電子裝置實行之動作方法。動作方法可包括如下步驟：確認傳輸至與上述電子裝置提供之服務相關之複數個目標之複數個電子訊息；確認藉由預設之方法而訓練之模型；基於經訓練之上述模型，將上述複數個電子訊息分類為至少一個叢集；及考慮分類為上述至少一個叢集之結果而監控上述複數個電子訊息之傳輸過程中是否產生誤差。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p>  
        <p type="p">S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="642" publication-number="202611816"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611816.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611816</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144094</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供頁面之電子裝置及其方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE FOR PROVIDING A PAGE AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250701B">G06Q20/38</main-classification>  
        <further-classification edition="201201120250701B">G06Q20/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣建浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KEON HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳慧珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, HYE JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳佳熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, GA HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西門弘益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEOMOON, HONG IK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種提供頁面之方法，其包括如下步驟：基於利用第1結算方式之複數個用戶之結算明細及上述第1結算方式之獎勵規定中的至少一者，產生與上述第1結算方式相關之優惠資訊；及產生包括上述優惠資訊之與上述第1結算方式相關之頁面並提供至用戶之終端；且上述頁面包括與上述第1結算方式之優惠相關之第1介面、及與上述獎勵規定相關之第2介面中之至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">200:用戶終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="643" publication-number="202612492"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612492.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612492</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144273</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置的形成方法</chinese-title>  
        <english-title>METHOD FOR FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250624B">H10D30/01</main-classification>  
        <further-classification edition="200601120250624B">H01L21/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張廷祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯忠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, CHUNG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭玳榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, TAI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林頌恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SUNG-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃泰鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TAI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文各種範例有關於形成於奈米結構場效電晶體裝置的淺溝槽隔離區上的淺溝槽隔離保護結構，淺溝槽隔離保護結構在後續選擇性蝕刻製程期間保護淺溝槽隔離區(例如位於虛設閘極結構正下方的部分)，淺溝槽隔離保護結構包含襯墊層及形成於襯墊層上的硬遮罩層，在第一組範例中，透過各種加工步驟操縱襯墊層上的硬遮罩層，以實現用於淺溝槽隔離保護結構的上表面的不同輪廓(例如凹形、凸形、或平面)，第二組範例為有關於透過不同電漿製程增強淺溝槽隔離保護結構的襯墊層的品質，使得襯墊層對後續蝕刻製程更能抵抗後續的蝕刻製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various examples related to a shallow trench isolation (STI) protection structure formed on the STI regions of a nanostructure field-effect transistor (NSFET) device are disclosed. The STI protection structure protects the STI regions (e.g., portions directly under dummy gate structures) during a subsequent selective etching process. The STI protection structures includes a liner layer and a hard mask layer(s) formed on the liner layer. In a first set of examples, the hard mask layer(s) on the liner layer are manipulated by various processing steps to achieve different profiles (e.g., concave, convex, or flat) for the upper surfaces of the STI protection structure. A second set of examples are disclosed for enhancing the quality of the liner layer of the STI protection structure through different plasma processes, such that the liner layer is more resistant to the subsequent etching process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:基底</p>  
        <p type="p">54:第二半導體材料</p>  
        <p type="p">61:襯墊層</p>  
        <p type="p">63:水平部分</p>  
        <p type="p">68:淺溝槽隔離保護結構</p>  
        <p type="p">71:硬遮罩層</p>  
        <p type="p">90A,90B:鰭</p>  
        <p type="p">93:通道區</p>  
        <p type="p">96:淺溝槽隔離區</p>  
        <p type="p">100:奈米結構場效電晶體裝置</p>  
        <p type="p">120:閘極介電層</p>  
        <p type="p">122:閘極電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="644" publication-number="202612131"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612131.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612131</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144355</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電力模組</chinese-title>  
        <english-title>POWER MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">H01L23/34</main-classification>  
        <further-classification edition="200601120250418B">H01L23/488</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日月光半導體製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡佑先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, YUHSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫培農</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PEINUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐靖堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHINGYAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JENCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於一種電力模組。該電力模組包括：一第一基板，其具有一第一表面及與該第一表面相對的一第二表面；一第一晶粒，其安置在該第一基板之該第一表面上；以及一第二晶粒，其安置在該第一基板之該第二表面上，其中該第一晶粒及該第二晶粒中之至少一者為一電力晶粒。該第一晶粒之一第一厚度不同於該第二晶粒之一第二厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a power module. The power module includes a first substrate having a first surface and a second surface opposite to the first surface; a first die disposed on the first surface of the first substrate; and a second die disposed on the second surface of the first substrate, wherein at least one of the first die and the second die is a power die. A first thickness of the first die is different from a second thickness of the second die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電力模組</p>  
        <p type="p">10:基板</p>  
        <p type="p">11:核心層</p>  
        <p type="p">12:導電層</p>  
        <p type="p">13:導電層</p>  
        <p type="p">20:基板</p>  
        <p type="p">21:核心層</p>  
        <p type="p">22:導電層</p>  
        <p type="p">23:導電層</p>  
        <p type="p">30:基板</p>  
        <p type="p">31:核心層</p>  
        <p type="p">32:導電層</p>  
        <p type="p">33:導電層</p>  
        <p type="p">40:晶粒</p>  
        <p type="p">40s1:焊接材料</p>  
        <p type="p">40s2:焊接材料</p>  
        <p type="p">51:晶粒</p>  
        <p type="p">51s1:焊接材料</p>  
        <p type="p">51s2:焊接材料</p>  
        <p type="p">52:晶粒</p>  
        <p type="p">52s1:焊接材料</p>  
        <p type="p">52s2:焊接材料</p>  
        <p type="p">53:晶粒</p>  
        <p type="p">53s1:焊接材料</p>  
        <p type="p">53s2:焊接材料</p>  
        <p type="p">61:引線框架</p>  
        <p type="p">61s:焊接材料</p>  
        <p type="p">62:引線框架</p>  
        <p type="p">62s:焊接材料</p>  
        <p type="p">63:引線框架</p>  
        <p type="p">63s:焊接材料</p>  
        <p type="p">64:引線框架</p>  
        <p type="p">64s:焊接材料</p>  
        <p type="p">65:引線框架</p>  
        <p type="p">65s:焊接材料</p>  
        <p type="p">66:引線框架</p>  
        <p type="p">66s:焊接材料</p>  
        <p type="p">67:引線框架</p>  
        <p type="p">67s:焊接材料</p>  
        <p type="p">68:引線框架</p>  
        <p type="p">68s:焊接材料</p>  
        <p type="p">70:囊封體</p>  
        <p type="p">70r:凹陷</p>  
        <p type="p">111:第一表面</p>  
        <p type="p">112:第二表面</p>  
        <p type="p">113:側向表面</p>  
        <p type="p">211:第一表面</p>  
        <p type="p">212:第二表面</p>  
        <p type="p">213:側向表面</p>  
        <p type="p">221:第一部分</p>  
        <p type="p">222:第二部分</p>  
        <p type="p">311:第一表面</p>  
        <p type="p">312:第二表面</p>  
        <p type="p">321:第一部分</p>  
        <p type="p">322:第二部分</p>  
        <p type="p">331:第一部分</p>  
        <p type="p">332:第二部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="645" publication-number="202612262"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612262.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612262</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144554</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>源極隨耦器電路以及翻轉源極隨耦器電路</chinese-title>  
        <english-title>SOURCE FOLLOWER CIRCUIT AND FLIPPED SOURCE FOLLOWER CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">H03F3/50</main-classification>  
        <further-classification edition="200601120250418B">H03F1/34</further-classification>  
        <further-classification edition="200601120250418B">H03F1/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIROHA TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳忠儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUNG-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳旻樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MIN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝易耕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YI-KENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種源極隨耦器電路，包含第一MOS電晶體、第二MOS電晶體、第三MOS電晶體及回授迴路電路。關於該第一MOS電晶體，閘極用以接收該源極隨耦器電路之輸入訊號，以及源極用以輸出該源極隨耦器電路之輸出訊號。關於該第二MOS電晶體，閘極耦接至偏壓，源極耦接至第一參考電壓，以及汲極耦接至該第一MOS電晶體的源極。關於該第三MOS電晶體，其是具有本身閘極耦接至本身汲極的自偏壓二極體連接的金屬氧化物半導體電晶體。該第三MOS電晶體的汲極耦接至該第一MOS電晶體的汲極，以及該第三MOS電晶體的源極耦接至第二參考電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A source follower circuit includes a first MOS transistor, a second MOS transistor, a third MOS transistor, and a feedback loop circuit. Regarding the first MOS transistor, a gate terminal receives an input signal of the source follower circuit, and a source terminal outputs an output signal of the source follower circuit. Regarding the second MOS transistor, a gate terminal is coupled to a bias voltage, a source terminal is coupled to a first reference voltage, and a drain terminal is coupled to the source terminal of the first MOS transistor. Regarding the third MOS transistor, it is a self-biased diode-connected MOS transistor with its gate terminal coupled to its drain terminal. The drain terminal of the third MOS transistor is coupled to a drain terminal of the first MOS transistor, and a source terminal of the third MOS transistor is coupled to a second reference voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:源極隨耦器電路</p>  
        <p type="p">102:低通濾波器</p>  
        <p type="p">104:回授迴路電路</p>  
        <p type="p">106:參考電流產生器電路</p>  
        <p type="p">108:高通濾波器</p>  
        <p type="p">M1,M2,M3:MOS電晶體</p>  
        <p type="p">V&lt;sub&gt;IN&lt;/sub&gt;:輸入訊號</p>  
        <p type="p">V&lt;sub&gt;OUT&lt;/sub&gt;:輸出訊號</p>  
        <p type="p">R&lt;sub&gt;B&lt;/sub&gt;,R&lt;sub&gt;LP&lt;/sub&gt;:電阻</p>  
        <p type="p">C&lt;sub&gt;B&lt;/sub&gt;,C&lt;sub&gt;LP&lt;/sub&gt;:電容</p>  
        <p type="p">V&lt;sub&gt;B&lt;/sub&gt;:偏壓</p>  
        <p type="p">V&lt;sub&gt;DD&lt;/sub&gt;:供應電壓</p>  
        <p type="p">GND:接地電壓</p>  
        <p type="p">V&lt;sub&gt;D&lt;/sub&gt;:汲極電壓</p>  
        <p type="p">V&lt;sub&gt;X&lt;/sub&gt;,V&lt;sub&gt;G&lt;/sub&gt;:閘極電壓</p>  
        <p type="p">I&lt;sub&gt;BLEED&lt;/sub&gt;:參考電流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="646" publication-number="202611711"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611711.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611711</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其參數管理方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS AND MANAGING PARAMETERS METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">G06F9/46</main-classification>  
        <further-classification edition="200601120250901B">G06F13/14</further-classification>  
        <further-classification edition="200601120250901B">G06F11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裔傳洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, CHUANZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電子裝置之參數管理方法。參數管理方法可包括如下步驟：基於與第1 API對應之延遲歷史之資訊，確定與上述第1 API對應之第1超時值；基於線程容量之資訊，確定與上述第1 API對應之第2超時值；及將上述第1超時值及上述第2超時值中之較小值設定為與上述第1 API對應之最終超時值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">120:用戶終端</p>  
        <p type="p">160:資料庫</p>  
        <p type="p">S300:步驟</p>  
        <p type="p">S310:步驟</p>  
        <p type="p">S320:步驟</p>  
        <p type="p">S330:步驟</p>  
        <p type="p">S340:步驟</p>  
        <p type="p">S350:步驟</p>  
        <p type="p">S360:步驟</p>  
        <p type="p">S370:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="647" publication-number="202611827"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611827.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611827</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144826</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供推播通知之方法、電子裝置及記錄有命令之記錄媒體</chinese-title>  
        <english-title>METHOD, ELECTRONIC DEVICE AND RECORDING MEDIUM STORING INSTRUCTIONS FOR PROVIDING PUSH NOTIFICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250623B">G06Q30/0241</main-classification>  
        <further-classification edition="202301120250623B">G06Q30/0242</further-classification>  
        <further-classification edition="202301120250623B">G06Q30/0251</further-classification>  
        <further-classification edition="202301120250623B">G06Q30/0601</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鎮安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHENAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉尚明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHANGMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宗文龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZONG, WENLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一實施例之藉由電子裝置而實行之方法可包括如下步驟：獲得一個以上之第1促銷活動各者之活動資料及一個以上之用戶各者之用戶資料；產生第1關聯資料，該第1關聯資料係於一個以上之第1促銷活動中指示一個以上之第2促銷活動者；確定一個以上之第2促銷活動間之優先級；於一個以上之第2活動中確定將傳輸推播通知之一個以上之第3促銷活動；及產生第2關聯資料，該第2關聯資料係指示預先確定之時間窗內之將傳輸推播通知的時槽者，該推播通知係與一個以上之第3促銷活動各者相關聯者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:電子裝置</p>  
        <p type="p">120:用戶終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="648" publication-number="202611465"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611465.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611465</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144938</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱模組、與散熱系統</chinese-title>  
        <english-title>HEAT SINK MODEL, AND HEAT SINK SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">F28F3/04</main-classification>  
        <further-classification edition="200601120250303B">F28F13/00</further-classification>  
        <further-classification edition="200601120250303B">F28D15/02</further-classification>  
        <further-classification edition="200601120250303B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅菁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YA-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李妮晏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, NI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤紹真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SHAO-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅菁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YA-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李妮晏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, NI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤紹真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SHAO-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智為</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李威聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一種散熱鰭片，包含：一鰭片本體，包含：一頂端、以及一相對於該頂端之底端；一凹設部，係形成於該頂端，並自該頂端往該底端之方向延伸，以與該鰭片本體間界定有一容置空間；一散熱液體，係容置於該容置空間中；以及一密封部，係與該凹設部相對應地設置，以可選擇地封閉該容置空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a heat sink fin, comprising: a fin body, comprising: a top and a bottom relative to the top; a concave part, formed on the top and extended toward the bottom so as to define an accommodating space between the fin body; a cooling liquid, accommodated in the accommodating space; and a sealing part, arranged correspondingly to the concave part so as to seal the accommodating space optionally.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:散熱鰭片</p>  
        <p type="p">2:鰭片本體</p>  
        <p type="p">3:頂端</p>  
        <p type="p">4:底端</p>  
        <p type="p">5:凹設部</p>  
        <p type="p">10:第一基板</p>  
        <p type="p">11:第一鰭片單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="649" publication-number="202612278"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612278.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612278</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144983</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>取樣系統</chinese-title>  
        <english-title>SAMPLING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">H03M1/18</main-classification>  
        <further-classification edition="200601120250502B">H03M1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIROHA TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳旻樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MIN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳忠儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUNG-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝易耕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YI-KENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">取樣系統包含取樣器電路、第一穩定誤差消除器電路及第二穩定誤差消除器電路。於第一階段，該取樣器電路與該第一穩定誤差消除器電路均執行取樣操作，且該第二穩定誤差消除器電路執行保持操作。於第二階段，該取樣器電路與該第二穩定誤差消除器電路執行電荷再分布，且該第一穩定誤差消除器電路執行保持操作。於第三階段，該取樣器電路與該第二穩定誤差消除器電路均執行取樣操作，且該第一穩定誤差消除器電路執行保持操作。於第四階段，該取樣器電路與該第一穩定誤差消除器電路執行電荷再分布，且該第二穩定誤差消除器電路執行保持操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sampling system includes a sampler circuit, a first settling error canceller circuit, and a second settling error canceller circuit. During a first phase, each of the sampler circuit and the first settling error canceller circuit perform a sampling operation, and the second settling error canceller circuit performs a holding operation. During a second phase, the sampler circuit and the second settling error canceller circuit perform charge redistribution, and the first settling error canceller circuit performs a holding operation. During a third phase, each of the sampler circuit and the second settling error canceller circuit performs a sampling operation, and the first settling error canceller circuit performs a holding operation. During a fourth phase, the sampler circuit and the first settling error canceller circuit perform charge redistribution, and the second settling error canceller circuit performs a holding operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:取樣系統</p>  
        <p type="p">102:取樣器電路</p>  
        <p type="p">104_1,104_2,104_3,104_4,106_1,106_2,106_3,106_4:部分電路</p>  
        <p type="p">N&lt;sub&gt;IP&lt;/sub&gt;:正輸入節點</p>  
        <p type="p">N&lt;sub&gt;IN&lt;/sub&gt;:負輸入節點</p>  
        <p type="p">N&lt;sub&gt;OP&lt;/sub&gt;:正輸出節點</p>  
        <p type="p">N&lt;sub&gt;ON&lt;/sub&gt;:負輸出節點</p>  
        <p type="p">V&lt;sub&gt;IP&lt;/sub&gt;,V&lt;sub&gt;OP&lt;/sub&gt;:正電壓訊號</p>  
        <p type="p">V&lt;sub&gt;IN&lt;/sub&gt;,V&lt;sub&gt;ON&lt;/sub&gt;:負電壓訊號</p>  
        <p type="p">LEQ:線性等化器</p>  
        <p type="p">BUF:緩衝器</p>  
        <p type="p">ADC:類比數位轉換器</p>  
        <p type="p">C&lt;sub&gt;P&lt;/sub&gt;,C&lt;sub&gt;N&lt;/sub&gt;,C&lt;sub&gt;11&lt;/sub&gt;,C&lt;sub&gt;12&lt;/sub&gt;,C&lt;sub&gt;13&lt;/sub&gt;,C&lt;sub&gt;14&lt;/sub&gt;,C&lt;sub&gt;21&lt;/sub&gt;,C&lt;sub&gt;22&lt;/sub&gt;,C&lt;sub&gt;23&lt;/sub&gt;,C&lt;sub&gt;24&lt;/sub&gt;:取樣電容</p>  
        <p type="p">SW&lt;sub&gt;P&lt;/sub&gt;,SW&lt;sub&gt;N&lt;/sub&gt;,SW&lt;sub&gt;11&lt;/sub&gt;,SW&lt;sub&gt;12&lt;/sub&gt;,SW&lt;sub&gt;13&lt;/sub&gt;,SW&lt;sub&gt;14&lt;/sub&gt;,SW&lt;sub&gt;15&lt;/sub&gt;,SW&lt;sub&gt;16&lt;/sub&gt;,SW&lt;sub&gt;17&lt;/sub&gt;,SW&lt;sub&gt;18&lt;/sub&gt;,SW&lt;sub&gt;21&lt;/sub&gt;,SW&lt;sub&gt;22&lt;/sub&gt;,SW&lt;sub&gt;23&lt;/sub&gt;,SW&lt;sub&gt;24&lt;/sub&gt;,SW&lt;sub&gt;25&lt;/sub&gt;,SW&lt;sub&gt;26&lt;/sub&gt;,SW&lt;sub&gt;27&lt;/sub&gt;,SW&lt;sub&gt;28&lt;/sub&gt;:開關</p>  
        <p type="p">CK&lt;sub&gt;1&lt;/sub&gt;,CK&lt;sub&gt;1&lt;/sub&gt;’,CK&lt;sub&gt;1&lt;/sub&gt;”,CK&lt;sub&gt;2&lt;/sub&gt;,CK&lt;sub&gt;2&lt;/sub&gt;’,CK&lt;sub&gt;2&lt;/sub&gt;”:時脈訊號</p>  
        <p type="p">GND:接地電壓</p>  
        <p type="p">C&lt;sub&gt;PAR&lt;/sub&gt;:寄生電容</p>  
        <p type="p">C&lt;sub&gt;S&lt;/sub&gt;,C&lt;sub&gt;SCP&lt;/sub&gt;,C&lt;sub&gt;SCN&lt;/sub&gt;:電容值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="650" publication-number="202611831"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611831.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611831</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145005</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>產生影像之方法、裝置及記錄有命令之記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM STORING INSTRUCTIONS FOR GENERATING IMAGES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q30/06</main-classification>  
        <further-classification edition="202401120250801B">G06Q10/08</further-classification>  
        <further-classification edition="202201120250801B">G06V20/60</further-classification>  
        <further-classification edition="200601120250801B">G06F17/40</further-classification>  
        <further-classification edition="201301120250801B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡振宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, ZHENYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳忱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一實施例之藉由電子裝置實行之方法可包括如下步驟：獲得與至少一個物件相關聯之至少一個第1影像及與目標物件相關聯之提示輸入；基於上述提示輸入，自上述至少一個第1影像產生與上述目標物件相關聯之複數個第2影像；及基於上述複數個第2影像，產生與至少兩個以上之物件相關聯之複數個第3影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:電子裝置</p>  
        <p type="p">120:資料庫</p>  
        <p type="p">130:伺服器</p>  
        <p type="p">140:網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="651" publication-number="202610819"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610819.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610819</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及影像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B7/12</main-classification>  
        <further-classification edition="200601120251201B">C09J163/00</further-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification>  
        <further-classification edition="200601120251201B">G02F1/1335</further-classification>  
        <further-classification edition="202301120251201B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笹川泰介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAGAWA, TAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三田聰司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可有效地減低外光反射之反射不均的光學積層體。提供一種包含如此的光學積層體的影像顯示裝置。 &lt;br/&gt;本發明之實施形態之光學積層體，是以接著劑層貼合第1透光性光學薄膜與第2透光性光學薄膜而成者，該接著劑層的厚度為50nm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學積層體</p>  
        <p type="p">10:第1透光性光學薄膜</p>  
        <p type="p">20:第2透光性光學薄膜</p>  
        <p type="p">30:接著劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="652" publication-number="202610747"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610747.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610747</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拆焊設備</chinese-title>  
        <english-title>DESOLDERING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250318B">B23K1/018</main-classification>  
        <further-classification edition="200601120250318B">B23K3/08</further-classification>  
        <further-classification edition="200601120250318B">H05K3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王雪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒易鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, YI-XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭金松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, JIN-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫黨飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, DANG-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉文龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEN-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金付新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, FU-XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, QUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周東海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, DONG-HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡喜強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, XI-QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何紅莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, HONG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種拆焊設備，包括承載件、輸送組件、支撐組件、施壓組件、鐳射加熱件及抓取組件。承載件用於定位連接板與主機板。輸送組件用於沿第一方向輸送承載件至拆焊位。支撐組件設於輸送組件之下方，用於定位承載件於拆焊位。施壓組件設於輸送組件之上方，用於下壓位於拆焊位之承載件中之主機板。鐳射加熱件用於加熱位於拆焊位之承載件中之連接板。抓取組件用於抓取施壓組件下壓之主機板上之連接板，以拆下連接板。拆焊設備能夠於不損壞主機板之情況下拆下連接於主機板之連接板，實現主機板之重複利用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A desoldering equipment including a carrier member, a conveyor assembly, a support assembly, a pressing assembly, a laser heating member, and a gripping assembly. The carrier member is used to position a connection board and a motherboard. The conveyor assembly is used to convey the carrier in a first direction to a desoldering position. The support assembly is disposed underneath the conveyor assembly for positioning the carrier in the desoldering position. The pressing assembly is provided above the conveyor assembly for pressing down the main board in the carrier member in the desoldering position. The laser heating member is used to heat the connection board in the carrier in the desoldering position. The gripping assembly is used for gripping the connection board on the main board that is pressed by the pressing assembly to remove the connection board. The desoldering equipment can removing the connection board attached to the motherboard without damaging the motherboard, enabling reuse of the motherboard.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:拆焊設備</p>  
        <p type="p">20:輸送組件</p>  
        <p type="p">92:操作箱</p>  
        <p type="p">95:掃碼件</p>  
        <p type="p">96:開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="653" publication-number="202612272"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612272.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612272</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145358</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可有效降低導通電阻之開關電路</chinese-title>  
        <english-title>SWITCHING CIRCUIT CAPABLE OF EFFECTIVELY REDUCING ON-RESISTANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250528B">H03K17/687</main-classification>  
        <further-classification edition="200601120250528B">H03K19/094</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅立狄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, LI-DI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐健夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, CHIEN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許麗美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種開關電路，包含一第一電晶體，為一化合物接面電晶體；一第二電晶體，為一增強型MOS電晶體；該第一電晶體與該第二電晶體串聯於該開關電路的第一端與第二端之間，用以控制該第一端與該第二端之間的導通與關斷；一第一閘極電壓，用以控制該第一電晶體的閘極；一第二閘極電壓，用以控制該第二電晶體的閘極；一位準移位電路，用以根據一相關於該第二閘極電壓的相關電壓，產生該第一閘極電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A switching circuit includes a first transistor, which is a compound junction transistor; and a second transistor, which is an enhancement-type MOS transistor. The first transistor and the second transistor are connected in series between the first and second ends of the switching circuit and are configured to control conduction and cutoff between these two ends. A first gate voltage is configured to control the gate of the first transistor; a second gate voltage is configured to control the gate of the second transistor. A level-shifting circuit is configured to generate the first gate voltage based on a voltage correlated with the second gate voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:位準移位電路</p>  
        <p type="p">300:開關電路</p>  
        <p type="p">M1:接面場效電晶體</p>  
        <p type="p">M2:增強型MOS電晶體</p>  
        <p type="p">N1:第一端</p>  
        <p type="p">N2:第二端</p>  
        <p type="p">NC:控制端</p>  
        <p type="p">VD2:汲極電壓</p>  
        <p type="p">VDD1:供應電壓</p>  
        <p type="p">VG1,VG2:閘極電壓</p>  
        <p type="p">VR:相關電壓</p>  
        <p type="p">VS2:源極電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="654" publication-number="202611807"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611807.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611807</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146294</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>維護服務系統以及維護服務的處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250313B">G06Q10/087</main-classification>  
        <further-classification edition="201201120250313B">G06Q50/04</further-classification>  
        <further-classification edition="202401120250313B">G06Q50/06</further-classification>  
        <further-classification edition="200601120250313B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木柾仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的一態樣為維護服務系統，包括：設定部，針對與顧客的設備有關的物品，基於風險、購入費用，以及契約期間中的至少一者，決定基於契約的持續計費費用，該契約是保存前述物品作為庫存的契約；物品管理部，管理表示備用物品的備用物品資訊，該備用物品是作為庫存被保存的前述物品；以及持續計費部，持續計費前述持續計費費用。維護服務系統對每個顧客準備基礎設備的元件之庫存，在異常時快速進行給基礎設備的元件供給。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1C:維護服務系統</p>  
        <p type="p">100:管理裝置</p>  
        <p type="p">110:輸入部</p>  
        <p type="p">120:輸出部</p>  
        <p type="p">122:輸出部</p>  
        <p type="p">130C:控制部</p>  
        <p type="p">132C:設定部</p>  
        <p type="p">134:契約部</p>  
        <p type="p">136:物品管理部</p>  
        <p type="p">138:持續計費部</p>  
        <p type="p">142:輸出控制部</p>  
        <p type="p">144:替換計費部</p>  
        <p type="p">160:記憶部</p>  
        <p type="p">162:契約記憶部</p>  
        <p type="p">164:持續計費記憶部</p>  
        <p type="p">166:購入費用記憶部</p>  
        <p type="p">168:庫存記憶部</p>  
        <p type="p">200:終端裝置</p>  
        <p type="p">202:終端輸入部</p>  
        <p type="p">204:終端輸出部</p>  
        <p type="p">206:終端控制部</p>  
        <p type="p">208:終端記憶部</p>  
        <p type="p">300:製造商裝置</p>  
        <p type="p">302:接收部</p>  
        <p type="p">304:製造管理部</p>  
        <p type="p">NW:通訊網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="655" publication-number="202611820"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611820.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611820</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>維修服務系統以及維修服務的處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250102B">G06Q30/016</main-classification>  
        <further-classification edition="202301120250102B">G06Q30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木柾仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的一態樣是維修服務系統，具備：契約記憶部，儲存有表示契約的契約資訊，其中該契約係將表示顧客的顧客資訊、表示該顧客的物品的物品資訊以及持續計費資訊相關聯；物品管理部，管理預備物品資訊，該預備物品資訊係指將該契約資訊與根據該契約持有的該物品的預備物品相關聯的資訊；持續計費部，根據該持續計費資訊對該顧客持續計費；物品選定部，根據輸入資訊中表示的顧客以及物品，依據該預備物品資訊，判斷是否為該契約的對象，若是該契約的對象，則將該物品的預備物品選定為替換品；以及輸出部，輸出該替換品相關資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:維修服務系統</p>  
        <p type="p">100:管理裝置</p>  
        <p type="p">110:輸入部</p>  
        <p type="p">120:輸出部</p>  
        <p type="p">130:控制部</p>  
        <p type="p">132:設定部</p>  
        <p type="p">134:契約部</p>  
        <p type="p">136:物品管理部</p>  
        <p type="p">138:持續計費部</p>  
        <p type="p">140:物品選定部</p>  
        <p type="p">142:輸出控制部</p>  
        <p type="p">144:交換計費部</p>  
        <p type="p">160:記憶部</p>  
        <p type="p">162:契約記憶部</p>  
        <p type="p">164:持續計費記憶部</p>  
        <p type="p">166:購買費用記憶部</p>  
        <p type="p">200:終端裝置</p>  
        <p type="p">202:終端輸入部</p>  
        <p type="p">204:終端輸出部</p>  
        <p type="p">206:終端控制部</p>  
        <p type="p">208:終端記憶部</p>  
        <p type="p">300:製作所裝置</p>  
        <p type="p">302:受理部</p>  
        <p type="p">304:製造管理部</p>  
        <p type="p">NW:網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="656" publication-number="202612124"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612124.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612124</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝體及製造半導體封裝體的方法</chinese-title>  
        <english-title>SEMICONDUCTOR AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250424B">H01L23/28</main-classification>  
        <further-classification edition="200601120250424B">H01L23/34</further-classification>  
        <further-classification edition="200601120250424B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田子容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN, TZU JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張任遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JEN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體封裝體包括帶有金屬導體的基板、設置在基板上且與基板的金屬導體電性連接的積體電路(IC)晶片、與積體電路晶片電性連接且具有設置以冷卻半導體封裝體的分別區域的熱電冷卻器的熱電冷卻器(TEC)晶片、安排以測量半導體封裝體的分別區域的溫度的溫度感測器及控制電路以操作熱電冷卻器冷卻基於分別區域的測量溫度的分別區域。控制可包括決定溫度指示訊號是否滿足熱管理行動準則，且熱管理行動相對於熱管理行動準則的決定反應執行於溫度指示訊號滿足於熱管理行動準則。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package includes a substrate with metal conductors, integrated circuit (IC) chips disposed on the substrate and electrically connected with the metal conductors of the substrate, thermoelectric cooler (TEC) chips thermally connected with the IC chips and having thermoelectric coolers configured to cool respective zones of the semiconductor package, temperature sensors arranged to measure temperatures of the respective zones of the semiconductor package, and control circuitry to operate the thermoelectric coolers to cool the respective zones based on the measured temperatures of the respective zones. The control may include determining whether a temperature-indicative signal satisfies a thermal management action criterion, and performing a thermal management action corresponding to the thermal management action criterion in response to a determination that the temperature-indicative signal satisfies the thermal management action criterion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體封裝體</p>  
        <p type="p">12:基板</p>  
        <p type="p">14:金屬導體</p>  
        <p type="p">16:積體電路(IC)晶片</p>  
        <p type="p">18:導電接合部</p>  
        <p type="p">20:熱電冷卻器(TEC)晶片</p>  
        <p type="p">50:熱介面材料</p>  
        <p type="p">52:蓋體</p>  
        <p type="p">54:填充材料，填充物</p>  
        <p type="p">56:冷卻板</p>  
        <p type="p">60:溫度感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="657" publication-number="202611877"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611877.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611877</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147325</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包裝製程監測系統及包裝製程的監測方法</chinese-title>  
        <english-title>PACKAGING PROCESS MONITORING SYSTEM AND METHOD OF MONITORING PACKAGING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250418B">G06V30/12</main-classification>  
        <further-classification edition="202201120250418B">G06V10/82</further-classification>  
        <further-classification edition="200601120250418B">G08B29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種包裝製程的監測方法。此方法包含：放置材料於材料盒中；印刷條碼於第一標籤以及第二標籤上；張貼第一標籤於材料盒上；擷取包含條碼之第一標籤之第一影像；利用阻隔袋包裝材料盒；張貼第二標籤於阻隔袋上；擷取包含條碼之第二標籤之第二影像；辨識第一影像以及第二影像；以及若第一標籤以及第二標籤中之至少一者被辨識為無法讀取，則發出警示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method of monitoring a package process. The method includes: placing a material into a material box; printing a barcode on a first tag and a second tag; posting the first tag on the material box; capturing a first image of the first tag including the barcode; packaging the material box by a barrier bag; posting the second tag on the barrier bag; capturing a second image of the second tag including the barcode; identifying the first image and the second image; and issuing an alarm if at least one of the first image and the second image is identified as unreadable.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">M:方法</p>  
        <p type="p">S201,S202,S203,S204,S205,S206,S207,S208,S209:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="658" publication-number="202611926"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611926.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611926</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147608</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及記憶體系統</chinese-title>  
        <english-title>MEMORY DEVICE AND MEMORY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G11C16/02</main-classification>  
        <further-classification edition="200601120250801B">G11C15/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺宏電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾柏皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, PO-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栢添賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BO, TIAN-CIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">記憶體裝置包含記憶體字串。記憶體字串用以儲存一儲存資料，並比較一輸入資料與該儲存資料以產生一字串電流信號。記憶體字串包含複數個記憶體單元。記憶體單元包含串聯耦接的複數個開關元件。當該輸入資料的一量化值等於該儲存資料的一量化值時，該些開關元件的一第一開關元件導通且該字串電流信號具有一第一電流準位。當該輸入資料的該量化值不同於該儲存資料的該量化值時，該些開關元件的該第一開關元件關斷且該字串電流信號具有小於該第一電流準位的一第二電流準位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a memory string. The memory string is configured to stored store data, and compare input data with the store data to generate a string current signal, wherein the memory string comprises a plurality of memory cells, the plurality of memory cells comprises a plurality of switch elements coupled in series, when a quantized value of the input data is equal to a quantized value of the stored data, a first switch element of the plurality of switch elements is turned on and the string current signal has a first current level, and when the quantized value of the input data is different from the quantized value of the stored data, the first switch element of the plurality of switch elements is turned off and the string current signal has a second current level lower than the first current level.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:記憶體系統</p>  
        <p type="p">510:記憶體裝置</p>  
        <p type="p">BL1、BL2、BL128K:位元線信號</p>  
        <p type="p">SSL1、SSL2、SSL475、SSL476:字串選擇線信號</p>  
        <p type="p">GSL1、GSL2、GSL475、GSL476:接地選擇線信號</p>  
        <p type="p">520:感測裝置</p>  
        <p type="p">530:暫存編碼裝置</p>  
        <p type="p">540:輸出裝置</p>  
        <p type="p">CHK1、CHK2、CHK128K:記憶體區塊</p>  
        <p type="p">MS1_1、MS1_2、MS1_128K、MS2_1、MS2_2、MS2_128K、MS475_1、MS475_2、MS475_128K、MS476_1、MS476_2、MS476_128K:記憶體字串</p>  
        <p type="p">WL1_1、WL1_2、WL1_47、WL1_48、WL476_1、WL476_2、WL476_47、WL476_48:字元線信號</p>  
        <p type="p">ITXT:輸入文本</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="659" publication-number="202610979"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610979.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610979</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非聚合物化合物及膜形成用組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C49/84</main-classification>  
        <further-classification edition="200601120251201B">C07D251/34</further-classification>  
        <further-classification edition="200601120251201B">C08G18/70</further-classification>  
        <further-classification edition="200601120251201B">C08G18/80</further-classification>  
        <further-classification edition="200601120251201B">C08G59/02</further-classification>  
        <further-classification edition="200601120251201B">C08L63/00</further-classification>  
        <further-classification edition="201801120251201B">C09D7/63</further-classification>  
        <further-classification edition="200601120251201B">C09D133/04</further-classification>  
        <further-classification edition="200601120251201B">C09D201/00</further-classification>  
        <further-classification edition="200601120251201B">C09K3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供下述式(1)所示非聚合物化合物作為具有優異紫外線吸收性、可見光透過性以及對有機溶劑之溶解性的新穎非聚合物化合物。&lt;br/&gt;&lt;img align="absmiddle" height="146px" width="342px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，n表示3~6的整數，A表示可具有選自由氮原子及氧原子所構成之群的雜原子之n價有機基，k表示0或1，X表示紫外線吸收性基)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="660" publication-number="202611329"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611329.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611329</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147889</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置及電漿處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250423B">C23C16/455</main-classification>  
        <further-classification edition="200601120250423B">C23C16/513</further-classification>  
        <further-classification edition="200601120250423B">H01J37/32</further-classification>  
        <further-classification edition="200601120250423B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田村貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMURA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>碇山理究</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKARIYAMA, RIKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可適當地處理基板之電漿處理裝置及電漿處理方法。本發明之電漿處理裝置具備：生成室，其連接於原料供給部，生成自原料供給部供給之原料之電漿；處理室，其與生成室相鄰，供配置基板；及過濾器，其配置於生成室與處理室之間，使生成之電漿所包含之粒子之一部分通過；且過濾器具備：孔，其與生成室及處理室相連。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:生成室</p>  
        <p type="p">10A:內部</p>  
        <p type="p">11:上壁部(原料供給部、第1電極部)</p>  
        <p type="p">13:供給口</p>  
        <p type="p">15:側壁部</p>  
        <p type="p">16:連通部</p>  
        <p type="p">17:排出部</p>  
        <p type="p">18,28:壓力調整機構</p>  
        <p type="p">19:壓力計</p>  
        <p type="p">20:處理室</p>  
        <p type="p">20A:內部</p>  
        <p type="p">21:下壁部</p>  
        <p type="p">22:側壁部</p>  
        <p type="p">26:連通部</p>  
        <p type="p">27:排出部</p>  
        <p type="p">29:壓力計</p>  
        <p type="p">30:過濾器</p>  
        <p type="p">31:端部</p>  
        <p type="p">32:本體部</p>  
        <p type="p">33:孔</p>  
        <p type="p">40:載台</p>  
        <p type="p">40A:突出部</p>  
        <p type="p">41:第2電極部</p>  
        <p type="p">50:控制部</p>  
        <p type="p">51:阻隔電容器</p>  
        <p type="p">52:高頻電源</p>  
        <p type="p">53:接地</p>  
        <p type="p">54:阻隔電容器</p>  
        <p type="p">55:高頻電源</p>  
        <p type="p">56:接地</p>  
        <p type="p">57:接地</p>  
        <p type="p">60:加熱器</p>  
        <p type="p">61:檢測部</p>  
        <p type="p">100:電漿處理裝置</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="661" publication-number="202611575"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611575.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611575</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148328</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241218B">G02B6/122</main-classification>  
        <further-classification edition="200601120241218B">G02B6/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日月光半導體製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊佩蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, PEI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳紀翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電子裝置。該電子裝置包括一光子組件、一連接器及一第一強化元件。該光子組件經組態以光學耦合至一光學元件。該連接器安置於該光子組件下方且經組態以支撐該光學元件。該第一強化元件安置於該光子組件上方且經組態以使得該光子組件耐受將該連接器安置在該光子組件下方所產生的一力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided. The electronic device includes a photonic component, a connector, and a first reinforcement element. The photonic component is configured to optically couple to an optical element. The connector is disposed under the photonic component and configured to support the optical element. The first reinforcement element is disposed over the photonic component and configured to allow the photonic component to withstand a force generated by disposing the connector under the photonic component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子裝置</p>  
        <p type="p">10:基板</p>  
        <p type="p">20:光子組件</p>  
        <p type="p">20a:黏著劑</p>  
        <p type="p">20P:部分</p>  
        <p type="p">20v:導孔</p>  
        <p type="p">30:電子組件</p>  
        <p type="p">40:連接器</p>  
        <p type="p">60:光學元件</p>  
        <p type="p">70A:強化元件</p>  
        <p type="p">70B:強化元件</p>  
        <p type="p">80:散熱片</p>  
        <p type="p">91:電接點</p>  
        <p type="p">91u:保護性元件</p>  
        <p type="p">92:連接元件</p>  
        <p type="p">92u:保護性元件</p>  
        <p type="p">93:黏著層</p>  
        <p type="p">94:黏著層</p>  
        <p type="p">95:黏著層</p>  
        <p type="p">98:固定部件</p>  
        <p type="p">110:導電襯墊</p>  
        <p type="p">120:凹部</p>  
        <p type="p">123:表面</p>  
        <p type="p">200:基板層</p>  
        <p type="p">201:表面</p>  
        <p type="p">202:表面</p>  
        <p type="p">210:導電襯墊</p>  
        <p type="p">210c:導電層</p>  
        <p type="p">211:導電層</p>  
        <p type="p">212:障壁層</p>  
        <p type="p">220:導電襯墊</p>  
        <p type="p">220c:導電層</p>  
        <p type="p">222:障壁層</p>  
        <p type="p">240:光學通道</p>  
        <p type="p">261:介電層</p>  
        <p type="p">262:介電層</p>  
        <p type="p">263:介電層</p>  
        <p type="p">310:導電襯墊</p>  
        <p type="p">710:襯墊</p>  
        <p type="p">G1:間隙</p>  
        <p type="p">G2:間隙</p>  
        <p type="p">T1:厚度</p>  
        <p type="p">T2:厚度</p>  
        <p type="p">T3:厚度</p>  
        <p type="p">T4A:厚度</p>  
        <p type="p">T4B:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="662" publication-number="202611528"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611528.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611528</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148583</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測組件及用於半導體裝置之視覺檢測裝置</chinese-title>  
        <english-title>INSPECTION ASSEMBLY AND VISUAL INSPECTION DEVICE FOR SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250401B">G01R31/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商達邇科技（成都）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIODES TECHNOLOGY (CHENGDU) COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海凱虹科技電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIODES SHANGHAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海凱虹電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI KAIHONG ELECTRONIC COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN, JIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊亞平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YAPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種檢測組件及其半導體裝置之視覺檢測裝置，其係關於裝置檢測技術領域。半導體裝置之視覺檢測裝置包括：底座，其中底座之一面具有可用於固定編帶並提供編帶穿過之凹槽，編帶內置有半導體裝置，且底座上並行設有至少兩個不同尺寸之凹槽，以供不同寬度尺寸之編帶穿過；蓋板，其可翻轉之蓋設在底座上，以防止編帶脫離對應凹槽，且蓋板上設有檢測窗口。底座上設有至少兩個不同尺寸之凹槽，以適用於不同寬度尺寸之編帶穿過進行檢測操作，因此，本裝置可將兩種不同寬度尺寸之編帶集中在一個機構上進行檢測。本裝置係一種可對至少兩種不同寬度之編帶進行檢測之裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An inspection assembly and a visual inspection device for semiconductor device are provided, which relate to the field of device inspection technology. The visual inspection device for semiconductor devices includes: a base, where grooves for fixing and passing tape-and-reel package are provided one side of the base, the semiconductor devices are placed inside the tape-and-reel package, and at least two grooves with different sizes are arranged in parallel on the base to allow tape-and-reel package of different widths to pass through; a cover plate, a reversible cover of which is arranged on the base to prevent the tape-and-reel package from escaping from the corresponding groove, and an inspection window is provided on the cover plate. Since at least two grooves of different sizes are provided on the base to allow tape-and-reel packages of different widths to pass through for inspection. The device can concentrate two tape-and-reel packages of different widths on one mechanism for inspection. The device is a device that can inspect at least two tape-and-reel packages of different widths.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:底座</p>  
        <p type="p">2:蓋板</p>  
        <p type="p">3:電鍍氧化膜/黑色電鍍氧化膜</p>  
        <p type="p">11:凹槽</p>  
        <p type="p">12:第一槽</p>  
        <p type="p">13:第二槽</p>  
        <p type="p">14:底槽</p>  
        <p type="p">15:臺階槽</p>  
        <p type="p">16:圓弧倒角/進料軌道圓弧倒角/出料軌道圓弧倒角</p>  
        <p type="p">21:進料限位凸起</p>  
        <p type="p">22:出料限位凸起</p>  
        <p type="p">23:視覺檢測窗口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="663" publication-number="202612046"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612046.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612046</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148960</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置的顆粒控制方法及基板處理方法</chinese-title>  
        <english-title>METHOD FOR CONTROLLING PARTICLES IN SUBSTRATE PROCESSING APPARATUS AND METHOD FOR PROCESSING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">H01L21/67</main-classification>  
        <further-classification edition="200601120241231B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONIK IPS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李在訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAE HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金燦葉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, CHAN YEOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林兌勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, TAE HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金猷悳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YU DEUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李定祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNG WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林栽甲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JAE GAB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙健熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, GUN HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明一態樣的基板處理方法，利用基板處理裝置，所述基板處理裝置包括：製程腔室、基板支撐部、氣體噴射部及RF電力供應部，所述基板處理方法包括以下步驟：在製程腔室內基板支撐部上放置基板，並在靜電電極施加靜電電壓，以在基板支撐部上吸附基板；向反應空間供應製程氣體，在基板支撐部上吸附的基板上形成薄膜；從基板支撐部解除吸附基板，並從製程腔室運出基板；控制顆粒，在從製程腔室運出基板的狀態下，在靜電電極至少交替施加1次相互不同極性的控制電壓，以減少製程腔室內部的顆粒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10:步驟</p>  
        <p type="p">S20:步驟</p>  
        <p type="p">S30:步驟</p>  
        <p type="p">S40:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="664" publication-number="202611171"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611171.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611171</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149007</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、感光性樹脂層及使用其的半導體裝置</chinese-title>  
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C08G73/10</main-classification>  
        <further-classification edition="200601120250402B">G03F7/004</further-classification>  
        <further-classification edition="200601120250402B">G03F7/027</further-classification>  
        <further-classification edition="200601120250402B">G03F7/037</further-classification>  
        <further-classification edition="200601120250402B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜希炅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HEEKYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金尙洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SANG SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白宅晋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, TAEK-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪忠範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, CHUNGBEUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金知由</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜眞熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, JINHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳虎均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, HOKYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴炳旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, BYEONGWOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金民兼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINGYUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光性樹脂組成物、使用其製造的感光性樹脂層、以及包含感光性樹脂層的半導體裝置，該感光性樹脂組成物包括樹脂，其中該樹脂包括由化學式1表示的聚合物。 &lt;br/&gt;&lt;img align="absmiddle" height="164px" width="514px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(在化學式1中，各取代基如說明書中所定義。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a photosensitive resin composition, a photosensitive resin layer manufactured using the same, and a semiconductor device including the photosensitive resin layer, the photosensitive resin composition including a resin, wherein the resin includes a polymer represented by Chemical Formula 1. &lt;br/&gt;&lt;img align="absmiddle" height="38px" width="219px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="154px" width="512px" file="ed10034.JPG" alt="ed10034.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(In Chemical Formula 1, each substituent is as defined in the specification.)</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="665" publication-number="202610579"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610579.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610579</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149210</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔機器人</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250305B">A47L11/40</main-classification>  
        <further-classification edition="200601120250305B">A47L11/24</further-classification>  
        <further-classification edition="200601120250305B">A47L11/28</further-classification>  
        <further-classification edition="200601120250305B">A47L11/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧遠聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧遠聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種清潔機器人，包括機體與懸崖傳感器，機體的側壁沿著行走路徑的前端、左側與右側均設有懸崖傳感器，懸崖傳感器為向下且向外的傾斜設置，能夠傾斜向外的發送探測信號。懸崖傳感器設於機體的側壁，提高探測的範圍；懸崖傳感器採用鐳射TOF原理進行探測，更精準、可靠，並且可以探測懸崖、臺階與障礙物等，實現多種探測功能，節約傳感器的種類與數量，利於降低成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:機體</p>  
        <p type="p">10:側壁</p>  
        <p type="p">11:凹槽</p>  
        <p type="p">2:懸崖傳感器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="666" publication-number="202611609"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611609.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611609</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149232</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背光模組及顯示裝置</chinese-title>  
        <english-title>BACKLIGHT MODULE AND DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">G02F1/13357</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱敏軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, MIN-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭瑋銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊朝閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHAO-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">背光模組包含切換控制單元、第一光源單元、第二光源單元及第一稜鏡片。第一光源單元位於切換控制單元下方並包含第一光源及第一導光板；第二光源單元位於切換控制單元及第一光源單元之間並包含第二光源及第二導光板；第一稜鏡片設置於第一導光板的出光側，其中在防窺模式中，第二光源關閉，第一光源開啟，且切換控制單元啟動以調控第一光源單元通過第一稜鏡片的光線，使背光模組具有第一出光範圍；在非防窺模式中，第二光源開啟且切換控制單元關閉，以使背光模組具有第二出光範圍，且第二出光範圍大於第一出光範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A backlight module includes a switching control unit, a first lighting unit, a second lighting unit, and a first prism film. The first lighting unit is disposed below the switching control unit and includes a first light source and a first light guide. The second lighting unit is disposed between the switching control unit and the first lighting unit and includes a second light source and a second light guide. In a privacy mode, the second light source is turned off, the first light source is turned on, and the switching control unit is activated to modulate light passing the first prism film from the first light source unit, so the backlight module has a first light output range. In a share mode, the second light source is turned on, and the switching control unit is deactivated, so the backlight module has a second light output range larger than the first light output range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顯示裝置</p>  
        <p type="p">10:背光模組</p>  
        <p type="p">20:顯示面板</p>  
        <p type="p">201:顯示面</p>  
        <p type="p">202:背側</p>  
        <p type="p">110:第一光源單元</p>  
        <p type="p">112:第一光源</p>  
        <p type="p">112a:發光件</p>  
        <p type="p">114:第一導光板</p>  
        <p type="p">114a:出光側</p>  
        <p type="p">120:第二光源單元</p>  
        <p type="p">122:第二光源</p>  
        <p type="p">122a:發光件</p>  
        <p type="p">124:第二導光板</p>  
        <p type="p">124a:出光側</p>  
        <p type="p">130:切換控制單元</p>  
        <p type="p">130a:出光側</p>  
        <p type="p">140:第一稜鏡片</p>  
        <p type="p">142:第一稜鏡條</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="667" publication-number="202612308"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612308.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612308</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149723</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源管理方法</chinese-title>  
        <english-title>POWER MANAGEMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250526B">H04L12/10</main-classification>  
        <further-classification edition="200601120250526B">G06F1/26</further-classification>  
        <further-classification edition="200601120250526B">G06F13/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐啟陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, QI-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡家銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, JIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滕鵬超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, PENG-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁柏文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, BAI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電源管理方法包含：處理單元執行初始化程序；處理單元分時對各通訊埠執行供電程序；處理單元對已上電的各通訊埠所消耗的功率進行計算；處理單元將所有已上電的各通訊埠所消耗的功率加總以獲得本地使用功率值；處理單元將總功率值扣除前一優先級的晶片的儲存單元的已使用功率值及本地使用功率值以獲得第二剩餘可使用功率值；及當第二剩餘可使用功率值大於或等於0時，處理單元將前一優先級的晶片的儲存單元的已使用功率值加上本地使用功率值以獲得已使用功率值並將已使用功率值儲存至儲存單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power management method comprises: a processing unit executes an initialization procedure; the processing unit sequentially executes a power supply procedure for each port; the processing unit calculates the power consumed by each powered port; the processing unit sums the power consumption of all powered ports to obtain a local used power value; the processing unit subtracts the used power value of a storage unit of a previous priority chip and the local used power value from a total power value to obtain a second remaining usable power value; and when the second remaining usable power value is greater than or equal to 0, the processing unit adds the used power value of the storage unit of the previous priority chip and the local used power value to obtain the used power value and stores the used power value in the storage unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01~S09:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="668" publication-number="202612363"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612363.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612363</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藍牙網狀網路的配網方法與裝置</chinese-title>  
        <english-title>PROVISIONING METHOD AND DEVICE FOR BLUETOOTH MESH NETWORK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250203B">H04W4/80</main-classification>  
        <further-classification edition="200901120250203B">H04W84/18</further-classification>  
        <further-classification edition="202201120250203B">H04L41/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱艷娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, YANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張振南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHENNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種藍牙網狀網路的配網方法，該配網方法包含：於一使用者設備上，選擇複數個未配網藍牙設備中的複數個目標藍牙設備；利用該使用者設備中的複數個鏈路模組，分別與該複數個目標藍牙設備中的每一者建立通用屬性配置鏈路；以及利用該複數個鏈路模組，同時執行針對該複數個目標藍牙設備中每一者的一配網程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A provisioning method for a Bluetooth mesh network, comprising: on a user device, selecting a plurality of target Bluetooth devices from a plurality of un-provisioned Bluetooth devices; utilizing a plurality of link modules in the user device to establish generic attribute profile links with each of the plurality of target Bluetooth devices; and simultaneously executing a provisioning procedure for each of the plurality of target Bluetooth devices using the plurality link modules, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:使用者設備</p>  
        <p type="p">20_1~20_K:藍牙設備</p>  
        <p type="p">LK_1~LK_N:鏈路模組</p>  
        <p type="p">PP_1~PP_N:配網程序</p>  
        <p type="p">50:藍牙網狀網路</p>  
        <p type="p">15:操作平台</p>  
        <p type="p">151:操作系統</p>  
        <p type="p">152:應用程式</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="669" publication-number="202610968"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610968.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610968</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可硬化之組成物</chinese-title>  
        <english-title>CURABLE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C15/44</main-classification>  
        <further-classification edition="200601120251201B">C07C15/50</further-classification>  
        <further-classification edition="200601120251201B">C07C43/285</further-classification>  
        <further-classification edition="200601120251201B">C08F2/44</further-classification>  
        <further-classification edition="200601120251201B">C08F12/34</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/16</further-classification>  
        <further-classification edition="200601120251201B">G03F7/26</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商默克專利有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　衛軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬　芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉碧　葛瑞格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARBIG, GREGOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達莫爾　拉夫Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAMMEL,RALPH R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費克勒　菲利浦漢斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FACKLER, PHILIPP HANS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種可硬化之組成物，較佳為光可硬化之組成物，其至少包含第一單體化合物、第二單體化合物及聚合起始劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a curable composition, preferably being a photo-curable composition, comprising at least a 1&lt;sup&gt;st&lt;/sup&gt;monomer compound; a 2&lt;sup&gt;nd&lt;/sup&gt;monomer compound; and a polymerization initiator.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="670" publication-number="202612449"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612449.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612449</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250624B">H10B12/00</main-classification>  
        <further-classification edition="202301120250624B">H10N97/00</further-classification>  
        <further-classification edition="202501120250624B">H10D1/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三鬼悠輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上遠野一広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATONO, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武藤祐輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUTO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田朋紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畑野二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATANO, JIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芹澤百合香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SERIZAWA, YURIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>側瀬聡文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAWASE, AKIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施方式是有關於一種半導體裝置及半導體裝置的製造方法。實施方式的半導體裝置包括：第一電極，包含矽；第二電極，與所述第一電極的上表面相接；第三電極，設在所述第二電極的上方；氧化物半導體，與所述第二電極的上表面相接，沿自所述第二電極朝向所述第三電極的第一方向延伸；絕緣膜，設在所述氧化物半導體的側面；以及第一導電體，與所述絕緣膜的至少一部分相接，所述第二電極包含：第二導電體，包含導電性氧化物，且與所述氧化物半導體的下表面相接；以及第三導電體，設在所述第二導電體與所述第一電極之間，且包含具有鈦及矽的化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21、22、221、222、223:導電體</p>  
        <p type="p">31:絕緣體</p>  
        <p type="p">CC:胞元電容器</p>  
        <p type="p">IF:界面(邊界)</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="671" publication-number="202612125"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612125.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612125</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150642</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構及其形成方法</chinese-title>  
        <english-title>PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250124B">H01L23/28</main-classification>  
        <further-classification edition="200601120250124B">H01L23/488</further-classification>  
        <further-classification edition="200601120250124B">H01L21/56</further-classification>  
        <further-classification edition="200601120250124B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京有竹居網路技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING YOUZHUJU NETWORK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李思捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SIJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃海新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAIXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛思婕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, SIJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅萌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEI, MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李繼峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王劍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開至少一個實施例提供一種封裝結構及其形成方法，所述封裝結構包括：多個子封裝，其中每個子封裝包括第一封裝基板、晶片、中間層和再分佈結構；所述第一封裝基板和所述再分佈結構位於所述中間層的相對兩側，所述晶片嵌置於所述中間層中，且與所述第一封裝基板電連接，所述中間層包括導電構件，以電連接所述第一封裝基板和所述再分佈結構，其中所述多個子封裝在平行於所述第一封裝基板的主表面的方向上並排設置；以及互聯基板，設置於所述多個子封裝上，且與所述多個子封裝的多個再分佈結構電連接，其中所述多個子封裝的多個晶片通過所述多個子封裝各自的所述第一封裝基板、所述導電構件和所述再分佈結構以及所述互聯基板彼此互聯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">At least one embodiment of the present disclosure provides a package structure and method of forming the same, the package structure includes: a plurality of sub-packages, wherein each sub-package includes a first package substrate, a chip, an intermediate layer, and a redistribution structure; the first package substrate and the redistribution structure are located on opposite two sides of the intermediate layer, and the chip is embedded in the intermediate layer and electrically connected to the first package substrate, the intermediate layer includes a conductive component to electrically connect the first package substrate and the redistribution structure, wherein the plurality of sub-packages are disposed side by side in a direction parallel to the main surface of the first package substrate; and an interconnection substrate, disposed on the plurality of sub-packages and electrically connected to a plurality of redistribution structures of the plurality of sub-packages, wherein a plurality of chips of the plurality of sub-packages are interconnected to each other through the first package substrate, the conductive component, the redistribution structure, and the interconnection substrate of each sub-package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31p:導電接墊</p>  
        <p type="p">100:第一封裝基板</p>  
        <p type="p">101:第一接墊</p>  
        <p type="p">102:第二接墊</p>  
        <p type="p">103、202:導電走線</p>  
        <p type="p">110:晶片</p>  
        <p type="p">111:導電凸塊</p>  
        <p type="p">120:中間層</p>  
        <p type="p">121:包封層</p>  
        <p type="p">122:導電構件</p>  
        <p type="p">130:再分佈結構</p>  
        <p type="p">131:再分佈層</p>  
        <p type="p">150:子封裝</p>  
        <p type="p">160:導電端子</p>  
        <p type="p">200:互聯基板</p>  
        <p type="p">201:導電接墊</p>  
        <p type="p">201a:第一導電接墊</p>  
        <p type="p">201b:第二導電接墊</p>  
        <p type="p">300:電路板</p>  
        <p type="p">500:封裝結構</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">GR:間隙區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="672" publication-number="202612289"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612289.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612289</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150743</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>收發機裝置、預失真電路以及預失真補償訊號產生方法</chinese-title>  
        <english-title>TRANSCEIVER DEVICE, PRE-DISTORTION CIRCUIT, AND PRE-DISTORTION COMPENSATION SIGNAL GENERATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250303B">H04B1/40</main-classification>  
        <further-classification edition="200601120250303B">H03F3/24</further-classification>  
        <further-classification edition="200601120250303B">H04B1/04</further-classification>  
        <further-classification edition="200601120250303B">H04B1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖瀟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭建綸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, CHIEN-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張元碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUAN-SHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種收發機裝置包含一預失真電路以及一射頻端電路。預失真電路用以輸出一第一基頻訊號。第一基頻訊號為一非連續單音訊號。射頻端電路耦接預失真電路。射頻端電路包含一傳輸電路以及一接收電路。傳輸電路包含一功率放大器且用以依據第一基頻訊號輸出一回授訊號。接收電路用以接收回授訊號。預失真電路更用以接收依據回授訊號所產生的一第二基頻訊號，且依據第一基頻訊號以及第二基頻訊號產生相應於功率放大器的一非線性特性的一預失真補償訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transceiver device includes a pre-distortion circuit and a radio frequency end circuit. The pre-distortion circuit is configured to output a first baseband signal. The first baseband signal is a non-continuous single-tone signal. The radio frequency end circuit is coupled to the pre-distortion circuit. The radio frequency end circuit includes a transmitter circuit and a receiver circuit. The transmitter circuit includes a power amplifier and is configured to output a loop-back signal according to the first baseband signal. The receiver circuit is configured to receive the loop-back signal. The pre-distortion circuit is further configured to receive a second baseband signal generated according to the loop-back signal, and generate a pre-distortion compensation signal according to the first baseband signal and the second baseband signal. The pre-distortion compensation signal corresponds to a non-linear characteristic of the power amplifier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:基頻訊號</p>  
        <p type="p">G[1]-G[K]:正弦波組</p>  
        <p type="p">AMP[1]-AMP[K]:振幅</p>  
        <p type="p">T1,T2,T3,T(K-1),TK:時間點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="673" publication-number="202610765"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610765.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610765</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150862</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用多模態信號補償的金屬膜厚測量方法、化學機械拋光裝置及電子設備</chinese-title>  
        <english-title>METAL FILM THICKNESS MEASUREMENT METHOD USING MULTIMODAL SIGNAL COMPENSATION, CHEMICAL MECHANICAL POLISHING APPARATUS, AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250122B">B24B37/005</main-classification>  
        <further-classification edition="201201120250122B">B24B37/20</further-classification>  
        <further-classification edition="200601120250122B">B24B49/10</further-classification>  
        <further-classification edition="201201120250122B">B24B53/017</further-classification>  
        <further-classification edition="200601120250122B">G01B7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華海清科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWATSING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王同慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TONGQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田芳馨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, FANGXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戚鈺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QI, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張美潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, MEIJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何啓弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種應用多模態信號補償的金屬膜厚測量方法、裝置及電子設備，方法包括：檢測拋光墊的厚度，根據厚度確定電渦流感測器對應的提離高度；檢測化學機械拋光裝置的拋光墊上拋光液的導電率；根據導電率，對提離高度進行修正；獲得電渦流感測器對晶圓的金屬層進行非接觸測量輸出的測量信號；根據修正後的提離高度以及電渦流感測器輸出的測量信號，得到晶圓的金屬膜厚。本申請提供的方案，基於多模態數據對提離高度進行修正，提高了提離高度的準確性，使得根據提離高度得到的晶圓上的金屬膜厚也更加準確。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A metal film thickness measurement method using multi-modal signal compensation, a chemical mechanical polishing apparatus, and an electronic device are provided in the present disclosure. The method includes: detecting a thickness of a polishing pad, and determining a lift-off height corresponding to a eddy current sensor based on the thickness; detecting an electrical conductivity of a polishing fluid on the polishing pad of the chemical mechanical polishing device; correcting the lift-off height based on the electrical conductivity; obtaining a measurement signal output by the eddy current sensor for non-contact measurement of a metal layer of a wafer; obtaining a metal film thickness of the wafer based the corrected lift-off height and the measurement signal output by the eddy current sensor. The solution provided by the present disclosure corrects the lift-off height based on multi-modal data, which improves the accuracy of the lift-off height and thus makes the metal film thickness of the wafer obtained based on the lift-off height more accurate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S105:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="674" publication-number="202611606"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611606.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611606</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151001</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有反射衰減層的顯示裝置及相關方法</chinese-title>  
        <english-title>DISPLAY DEVICE WITH REFLECTION ATTENUATION LAYERS AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250110B">G02F1/1335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宏志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HUNG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹韋力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, WEL-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王國樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KUO LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一裝置。該裝置包括：一液晶層；一電極層，其在該液晶層之一第一側上；以及一背板，其附接至與該第一側相對之該液晶層之一第二側。該背板包括：一傳導結構，其可操作來與該電極層形成一電壓差；一反射結構，其在該傳導結構與該液晶層之間；一第一反射衰減層，其在該傳導結構之第一側壁及該傳導結構之一第一上表面上；以及一第二反射衰減層，其在該反射結構之第二側壁上，該第二反射衰減層在其中界定一開口，該反射結構之一第二上表面藉由該開口暴露。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device is provided. The device includes: a liquid crystal layer; an electrode layer on a first side of the liquid crystal layer; and a backplane attached to a second side of the liquid crystal layer opposite the first side. The backplane includes: a conductive structure operable to form a voltage difference with the electrode layer; a reflective structure between the conductive structure and the liquid crystal layer; a first reflection attenuation layer on first sidewalls of the conductive structure and a first upper surface of the conductive structure; and a second reflection attenuation layer on second sidewalls of the reflective structure, the second reflection attenuation layer defining an opening therein, a second upper surface of the reflective structure being exposed by the opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:液晶覆矽顯示裝置，LCOS顯示裝置，顯示裝置，顯示器，裝置</p>  
        <p type="p">110:互補式金屬氧化物半導體背板，半導體CMOS背板，CMOS背板，基體，背板</p>  
        <p type="p">110a:上表面</p>  
        <p type="p">120:第一對準層，下對準層，對準層</p>  
        <p type="p">130:液晶層</p>  
        <p type="p">140:第二對準層，上對準層，對準層</p>  
        <p type="p">150:電極層</p>  
        <p type="p">160:覆蓋層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="675" publication-number="202611993"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611993.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611993</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151019</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250926B">H01L21/205</main-classification>  
        <further-classification edition="200601120250926B">H01L21/306</further-classification>  
        <further-classification edition="200601120250926B">H01L21/76</further-classification>  
        <further-classification edition="202501120250926B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀呈彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, CHENG YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置製造方法包含：使用一第一原子層沉積，在一主動區域上沉積一第一薄多晶矽層，其中該主動區域包含一溝槽；使用一第二原子層沉積，在該主動區域上沉積一第二薄多晶矽層；及使用一化學氣相沉積，在該主動區域上沉積一多晶矽層以形成一多晶矽結構，其中用於該化學氣相沉積之一氣體包含二矽烷，該溝槽之一底部中之該多晶矽層的一厚度基本上為零。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of a semiconductor device includes depositing, using a first atomic layer deposition, a first thin poly silicon layer on an active area, in which the active area includes a trench; depositing, using a second atomic layer deposition, a second thin poly silicon layer on the active area; and depositing, using a chemical vapor deposition, a poly silicon layer on the active area to form a poly silicon structure, in which a gas for the chemical vapor deposition includes disilane, a thickness of the poly silicon layer in a bottom of the trenches is substantially zero.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">110:基板</p>  
        <p type="p">112:主動區域</p>  
        <p type="p">114:陣列</p>  
        <p type="p">120:多晶矽結構</p>  
        <p type="p">122:第一薄多晶矽層</p>  
        <p type="p">124:第二薄多晶矽層</p>  
        <p type="p">126:多晶矽層</p>  
        <p type="p">130:淺溝槽隔離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="676" publication-number="202611205"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611205.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611205</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151046</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、成形材料、多層結構體、成形體、食品包裝體、樹脂組成物及多層結構體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">C08K3/11</main-classification>  
        <further-classification edition="200601120251201B">C08K5/09</further-classification>  
        <further-classification edition="200601120251201B">C08L29/04</further-classification>  
        <further-classification edition="200601120251201B">C08J3/12</further-classification>  
        <further-classification edition="200601120251201B">C08J3/20</further-classification>  
        <further-classification edition="200601120251201B">B32B27/20</further-classification>  
        <further-classification edition="200601120251201B">B32B27/30</further-classification>  
        <further-classification edition="200601120251201B">B65D65/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本信行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>冨田結芙子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMITA, YUUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青山眞人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAMA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供下述樹脂組成物作為熱穩定性優異，能夠抑制熱劣化所致之著色之樹脂組成物。&lt;br/&gt;一種樹脂組成物，其含有聚乙烯醇樹脂、鎳化合物、及化合物(X)，前述聚乙烯醇樹脂為含有1~19mol%的乙烯結構單元的含量之乙烯改性聚乙烯醇樹脂，前述化合物(X)為選自鹼土類金屬化合物、以及鹼土類金屬化合物以外的乙酸及/或其鹽中之至少一種，前述鎳化合物的金屬換算含量，相對於樹脂組成物的質量為0.0001~2ppm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="677" publication-number="202611696"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611696.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611696</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體電路及其操作方法</chinese-title>  
        <english-title>MEMORY CIRCUIT AND METHOD OF OPERATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G06F7/50</main-classification>  
        <further-classification edition="200601120250602B">G11C11/409</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森陽紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, HARUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪哲民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, JE-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原英弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, HIDEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李嘉富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池育德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIH, YU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　琮永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JONATHAN TSUNG-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體電路，包括記憶體單元陣列、乘法累加(MAC)電路、第一及第二驅動器電路。記憶體單元陣列用以儲存權重信號之第一集合或第二集合。權重信號之第二集合相對於權重信號之第一集合進行轉置。MAC電路用以回應於輸入資料之集合與權重信號之第一集合或第二集合中之一者而產生資料之第一集合。第一驅動器電路用以回應於由第一啟動信號啟動而將權重信號之第二集合寫入至記憶體單元陣列。第二驅動器電路用以回應於由與第一啟動信號反向的第二啟動信號啟動而將權重信號之第一集合寫入至記憶體單元陣列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory circuit includes a memory cell array, a multiply-accumulate (MAC) circuit, a first and second driver circuit. The memory cell array is configured to store a first or second set of weight signals. The second set of weight signals is transposed with respect to the first set of weight signals. The MAC circuit is configured to generate a first set of data in response to a set of input data and one of the first or second set of weight signals. The first driver circuit is configured to write the second set of weight signals to the memory cell array in response to being enabled by a first enable signal. The second driver circuit is configured to write the first set of weight signals to the memory cell array in response to being enabled by a second enable signal inverted from the first enable signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:方法</p>  
        <p type="p">902~918:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="678" publication-number="202611766"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611766.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611766</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100002</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉助於通道內編碼進行記憶體裝置的增強型資料保護之方法及設備</chinese-title>  
        <english-title>METHOD FOR PERFORMING ENHANCED DATA PROTECTION OF MEMORY DEVICE WITH AID OF IN-CHANNEL CODING, AND ASSOCIATED APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250203B">G06F21/78</main-classification>  
        <further-classification edition="201301120250203B">G06F21/60</further-classification>  
        <further-classification edition="201301120250203B">G06F21/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慧榮科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICON MOTION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宗杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TSUNG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供藉助於通道內編碼進行記憶體裝置的增強型資料保護之方法及設備，記憶體裝置包含記憶體控制器和非揮發性(NV)記憶體並經歷回流製程將記憶體裝置安裝至印刷電路板上。該方法可包含：在電子裝置的系統層次初始化期間，利用記憶體控制器開始對NV記憶體中的預加載資料進行擴展至非擴展儲存格式轉換，預加載資料已經以第一儲存格式預加載到NV記憶體以供插入來自通道內編碼的額外同位資訊於多個資料組塊之間；以及在擴展至非擴展儲存格式轉換期間，將預加載資料從第一儲存格式轉換為第二儲存格式以供收集多個資料組塊並釋放部分儲存空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for performing enhanced data protection of a memory device with aid of in-channel coding and associated apparatus are provided, where the memory device may include a memory controller and a non-volatile (NV) memory, and undergo a reflow process for mounting the memory device onto a PCB of a host device within an electronic device. The method may include: during a system level initialization of the electronic device, utilizing the memory controller to start performing expansion-to-non-expansion storage format conversion on preloaded data in the NV memory, wherein the preloaded data has been preloaded into the NV memory in a first storage format, for inserting extra parity information obtained from the in-channel coding among multiple data chunks; and during the expansion-to-non-expansion storage format conversion, converting the preloaded data from the first storage format into a second storage format, for collecting the multiple data chunks and releasing partial storage space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">PHASE0:開始階段</p>  
        <p type="p">PHASE1:第一階段</p>  
        <p type="p">PHASE2:第二階段</p>  
        <p type="p">S10~S12:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="679" publication-number="202612473"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612473.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612473</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100111</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250703B">H10B43/27</main-classification>  
        <further-classification edition="202301120250703B">H10B43/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅原陽平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAWARA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口将希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠提昇資料保持特性並能夠將寫入飽和提高並且能夠將刪除飽和降低的半導體記憶裝置及其製造方法。&lt;br/&gt;由本實施形態所致之半導體記憶裝置，係具備有使複數之電極膜與複數之第1絕緣膜交互地在第1方向上被作了層積之層積體。柱狀體，係於第1方向上貫通層積體地被作設置。鋁氧化膜，係被設置在柱狀體與前述電極膜之間。第1之4價金屬氧化物，係存在於柱狀體與鋁氧化膜之間之界面處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">CL:柱狀體</p>  
        <p type="p">MH:記憶體洞</p>  
        <p type="p">ST:細縫</p>  
        <p type="p">WL:字元線</p>  
        <p type="p">LI:源極配線</p>  
        <p type="p">21:電極膜</p>  
        <p type="p">22:絕緣膜</p>  
        <p type="p">101:絕緣膜</p>  
        <p type="p">221:覆蓋絕緣膜</p>  
        <p type="p">221a_1:金屬氧化物</p>  
        <p type="p">221a_2:阻隔絕緣膜</p>  
        <p type="p">222:電荷阱膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="680" publication-number="202611980"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611980.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611980</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100402</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體基板之周緣及背側的保護方法</chinese-title>  
        <english-title>METHODS FOR PROTECTING A PERIPHERAL EDGE AND BACKSIDE OF A SEMICONDUCTOR SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/02</main-classification>  
        <further-classification edition="200601120251201B">H01L21/308</further-classification>  
        <further-classification edition="200601120251201B">H01L21/311</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪莉婭　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELIA, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>列斐伏爾　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEFEVRE, SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中提出用於處理半導體基板之處理及方法之各種實施例。更具體而言，提出用於當基板之前側遭受處理時防止對半導體基板之周緣區域及∕或背側之損壞、或在其上之污染之改良的處理及方法。在所揭示的實施例中，在基板之前側上實施處理之前，犧牲膜被旋塗沉積在周緣區域內及∕或沿著背側表面。犧牲膜保護基板之周緣區域及∕或背側，並且在處理之後從基板去除。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments of processes and methods are provided herein for processing a semiconductor substrate. More specifically, improved processes and methods are provided for preventing damage to, or contamination on, a peripheral edge region and/or backside of a semiconductor substrate as the frontside of the substrate undergoes processing. In the disclosed embodiments, a sacrificial film is spin-on deposited within the peripheral edge region and/or along the backside surface before a process is performed on the frontside of the substrate. The sacrificial film protects the peripheral edge region and/or backside of the substrate and is removed from the substrate after processing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體基板</p>  
        <p type="p">110:前側表面</p>  
        <p type="p">120:背側表面</p>  
        <p type="p">130:側邊緣表面</p>  
        <p type="p">140:周緣區域</p>  
        <p type="p">150:前側中央區域</p>  
        <p type="p">155:背側中央區域</p>  
        <p type="p">300:處理流程</p>  
        <p type="p">310,320:步驟</p>  
        <p type="p">325:犧牲膜</p>  
        <p type="p">330:步驟</p>  
        <p type="p">335:點</p>  
        <p type="p">340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="681" publication-number="202612126"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612126.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612126</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100533</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測封裝結構</chinese-title>  
        <english-title>SENSOR PACKAGE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250226B">H01L23/28</main-classification>  
        <further-classification edition="200601120250226B">H01L23/488</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商光寶科技新加坡私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余　汶汶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YII, WEN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何軍華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, JUN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　偉健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEO, WEI JIAN JENSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡伊辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, I-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種感測封裝結構，其包含基板、載座、感測層、蓋體、及封裝體依序堆疊而成。所述載座具有一承載面及自所述承載面凹設的一第一凹槽。所述感測層設置於所述承載面且具有彼此間隔的多個熱接點與彼此間隔的多個冷接點，並且多個所述熱接點位於所述第一凹槽的上方，而多個所述冷接點設置於所述承載面之上。所述蓋體與所述載座共同形成有容納所述感測層的一封閉空間。所述載座及所述蓋體皆埋置於所述封裝體之內，而至少部分所述蓋體對應於多個所述熱接點的位置由所述封裝體露出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a sensor package structure, which includes a substrate, a carrier, a sensing layer, a cap, and an encapsulant that are stacked in sequence. The carrier has a carrying surface and a first slot that is recessed in the carrying surface. The sensing layer is disposed on the carrying surface, and the sensing layer has a plurality of hot junctions spaced apart from each other and a plurality of cold junctions that are spaced apart from each other. The hot junctions are arranged above the first slot, and the cold junctions are arranged above the carrying surface. The cap and the carrier jointly form an enclosed space that receives the sensing layer therein. The cap and the carrier are embedded in the encapsulant, and at least part of the cap corresponding in position to the hot junctions is exposed from the encapsulant.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:感測封裝結構</p>  
        <p type="p">1:基板</p>  
        <p type="p">11:第一板面</p>  
        <p type="p">12:第二板面</p>  
        <p type="p">13:線路層</p>  
        <p type="p">131:串接線路</p>  
        <p type="p">132:外接線路</p>  
        <p type="p">2:處理器</p>  
        <p type="p">3:載座</p>  
        <p type="p">31:承載面</p>  
        <p type="p">32:第一凹槽</p>  
        <p type="p">321:槽口</p>  
        <p type="p">4:感測層</p>  
        <p type="p">4a:第一端</p>  
        <p type="p">4b:第二端</p>  
        <p type="p">41:熱接點</p>  
        <p type="p">42:冷接點</p>  
        <p type="p">43:熱電堆線路</p>  
        <p type="p">44:連接墊</p>  
        <p type="p">5:蓋體</p>  
        <p type="p">51:濾光部</p>  
        <p type="p">52:第二凹槽</p>  
        <p type="p">53:阻隔部</p>  
        <p type="p">6:封裝體</p>  
        <p type="p">61:開口</p>  
        <p type="p">7:導通柱</p>  
        <p type="p">8:金屬線</p>  
        <p type="p">L:長度方向</p>  
        <p type="p">W:寬度方向</p>  
        <p type="p">H:高度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="682" publication-number="202611485"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611485.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611485</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100674</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液位檢測感測器</chinese-title>  
        <english-title>LEVEL SENSING SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250423B">G01F23/24</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商邁達斯Ｈ&amp;Ｔ股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIDAS H&amp;T INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張世潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SEYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴惠智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HYEJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種液位檢測感測器，根據本發明一實施例之液位檢測感測器包括：第一層，其包括第一電極；第二層，其包括第二電極；以及間隔層(spacer)，其將上述第一層與上述第二層隔開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:液位檢測感測器</p>  
        <p type="p">110:第一層</p>  
        <p type="p">112:基板</p>  
        <p type="p">114:第一電極</p>  
        <p type="p">120:間隔層</p>  
        <p type="p">130:第二層</p>  
        <p type="p">132:基板</p>  
        <p type="p">134:第二電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="683" publication-number="202611159"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611159.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611159</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造用晶圓端部保護膜形成用組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G59/17</main-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/031</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/40</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification>  
        <further-classification edition="200601120251201B">H01L21/3065</further-classification>  
        <further-classification edition="200601120251201B">H01L21/308</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田貴文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森谷俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIYA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸岡高広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIOKA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供於半導體裝置之製造中，以利用塗佈之簡單方法，於半導體製造用基板(晶圓)之端部，可形成膜狀態良好、顯示良好的膜硬化性、耐乾蝕刻性亦高的保護膜之保護膜形成用組成物、藉由該保護膜形成用組成物所形成之保護膜、使用該保護膜製造之半導體製造用晶圓、該半導體製造用晶圓及半導體裝置之製造方法。&lt;br/&gt;一種半導體製造用晶圓端部保護膜形成用組成物，其包含：含有聚合性基且碳含有率為70%以上之聚合物或化合物、與溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="684" publication-number="202611636"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611636.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611636</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100856</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新度量衡方法及相關設備</chinese-title>  
        <english-title>NEW METROLOGY METHODS AND ASSOCIATED APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">G03F7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼恩休斯　漢　冠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIENHUYS, HAN-KWANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　登　波斯　西特喜　希巨門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DER POST, SIETSE THIJMEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾　賈瓦瑞　歐瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL GAWHARY, OMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>提那曼斯　派翠西斯　阿若瑟斯　約克伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TINNEMANS, PATRICIUS ALOYSIUS JACOBUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種用於判定一物件上之一週期性目標之一或多個參數的度量衡方法及相關度量衡設備。該週期性目標與一參考標記相鄰，該參考標記之一節距等於該週期性目標之節距。該方法包含將輻射投影至該物件上，使得該輻射之一第一部分入射於該週期性目標上且該輻射之一第二部分入射於該參考標記上。該方法進一步包含量測由輻射之該第一部分及該第二部分兩者對一單個繞射階之貢獻形成的至少一個干涉圖案。該方法進一步包含取決於該至少一個干涉圖案判定該一或多個參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A metrology method, and associated metrology apparatus, for determining one or more parameters of a periodic target on an object is disclosed. The periodic target is adjacent to a reference mark having a pitch equal to that of the periodic target. The method comprises projecting radiation onto the object such that a first portion of the radiation is incident on the periodic target and a second portion of the radiation is incident on the reference mark. The method further comprises measuring at least one interference pattern formed by contributions to a single diffraction order from both the first and second portions of radiation. The method further comprises determining the one or more parameters in dependence on the at least one interference pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:新度量衡方法/方法</p>  
        <p type="p">1100:步驟</p>  
        <p type="p">1200:步驟</p>  
        <p type="p">1300:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="685" publication-number="202611931"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611931.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611931</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>字元線解碼器、記憶體裝置的控制方法和字元線驅動電路</chinese-title>  
        <english-title>WORD LINE DECODER, CONTROL METHOD OF MEMORY DEVICE AND WORD LINE DRIVE CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">G11C16/08</main-classification>  
        <further-classification edition="200601120250501B">G11C16/06</further-classification>  
        <further-classification edition="200601120250501B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳弼相</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYOO, PIL-SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種字元線解碼器、記憶體裝置的控制方法和字元線驅動電路。字元線解碼器包括字元線驅動電路。字元線驅動電路包括第一驅動電晶體和第二驅動電晶體。第一驅動電晶體的第一端接收第一信號，且第一驅動電晶體的控制端接收第一控制信號。第二驅動電晶體耦接到第一驅動電晶體，第二驅動電晶體的第二端接收反相全域字元線電壓，且第二驅動電晶體的控制端接收全域字元線電壓。第二驅動電晶體的第一端和第一驅動電晶體的第二端耦接到記憶體陣列中記憶胞的閘極端。在擦除操作中記憶胞未被選擇用於擦除時，第一信號為高阻抗狀態，且第一信號耦接到記憶胞的閘極端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A word line decoder, a control method of a memory device, and a word line drive circuit are provided. The word line decoder includes a word line drive circuit. The word line drive circuit includes a first and a second drive transistor. A first terminal of the first drive transistor receives a first signal, and a control terminal of the first drive transistor receives a first control signal. The second drive transistor is coupled to the first drive transistor, a second terminal of the second drive transistor receives a revised global word line voltage, and a control terminal of the second drive transistor receives a global word line voltage. The first terminal of the second drive transistor and the second terminal of the first drive transistor are coupled to a gate terminal of a cell in a memory array. In an erase operation and the cell is not selected for erase, the first signal is a Hi-Z state, and the first signal is coupled to the gate terminal of the cell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:字元線解碼器</p>  
        <p type="p">410-1~410-N:字元線驅動電路</p>  
        <p type="p">420-1~420-2:全域字元線解碼器</p>  
        <p type="p">Vpos:第一電壓</p>  
        <p type="p">WL[7：0]、WL[504]、WL[511：505]:字元線電壓</p>  
        <p type="p">HXP[7：0]:第一控制信號</p>  
        <p type="p">HXN[7：0]:第二控制信號</p>  
        <p type="p">HXNB[7：0]:反相第二控制信號</p>  
        <p type="p">GWL:全域字元線電壓</p>  
        <p type="p">GWLB:反相全域字元線電壓</p>  
        <p type="p">PRED:全域控制信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="686" publication-number="202611013"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611013.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611013</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101296</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、組合物及其硬化物、成形物、顯示裝置、以及固體攝像元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C323/52</main-classification>  
        <further-classification edition="200601120251201B">C08G75/06</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G02B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淺津悠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASATSU, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出崎光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEZAKI, HIKARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠賦予顯示出高折射率之硬化物且鹼顯影性優異之組合物。&lt;br/&gt;本發明之組合物含有式(I)所表示之化合物、具有式(X)所表示之基之化合物、及硬化劑。&lt;br/&gt;&lt;img align="absmiddle" height="68px" width="315px" file="ed10061.JPG" alt="ed10061.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(I)中，&lt;br/&gt;L表示可具有取代基之碳原子數2～20之支鏈狀伸烷基，所存在之兩個L可相同，亦可不同；&lt;br/&gt;A表示氫原子或陽離子，所存在之兩個A可相同，亦可不同；&lt;br/&gt;n表示0～6之任一整數；&lt;br/&gt;R表示一價取代基，於存在複數個R之情形時，所存在之複數個R可相同，亦可不同]&lt;br/&gt;&lt;img align="absmiddle" height="72px" width="155px" file="ed10062.JPG" alt="ed10062.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(X)中，&lt;br/&gt;包含硫原子作為構成原子之環Z&lt;sup&gt;x&lt;/sup&gt;表示3員環或4員環；&lt;br/&gt;R&lt;sup&gt;2x&lt;/sup&gt;表示氫原子或一價取代基；&lt;br/&gt;*表示鍵結位置]</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="687" publication-number="202612471"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612471.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612471</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101332</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">H10B43/20</main-classification>  
        <further-classification edition="202301120250303B">H10B43/35</further-classification>  
        <further-classification edition="202301120250303B">H10B99/00</further-classification>  
        <further-classification edition="200601120250303B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉崇史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可更適當地進行構造的測量的半導體裝置及其製造方法。基於本實施形態的半導體裝置包括構造體以及遮光部。遮光部在用於被照射測量光來測量構造體的構造的測量地點，設置於較構造體更靠要照射的測量光的行進方向側的位置，並遮擋測量光。遮光部具有兩層以上的第一金屬層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">61:基板</p>  
        <p type="p">62、70:絕緣膜</p>  
        <p type="p">63、66、71、77:障壁金屬膜</p>  
        <p type="p">64:導電構件</p>  
        <p type="p">65:下層配線</p>  
        <p type="p">67、72、78:配線構件</p>  
        <p type="p">68:第一遮光層</p>  
        <p type="p">69:第一蓋膜</p>  
        <p type="p">73:第二遮光層</p>  
        <p type="p">74:遮光構造</p>  
        <p type="p">75:第二蓋膜</p>  
        <p type="p">76:上層絕緣膜</p>  
        <p type="p">79:上層配線</p>  
        <p type="p">80:上層構造</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="688" publication-number="202610793"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610793.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610793</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101502</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄膜小片的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B26F1/38</main-classification>  
        <further-classification edition="200601120251201B">B26D3/00</further-classification>  
        <further-classification edition="200601120251201B">B65H35/06</further-classification>  
        <further-classification edition="200601120251201B">B65H35/08</further-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道下空</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICHISHITA, SORA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堤清貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUTSUMI, KIYOTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川美優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, MIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種薄膜小片的製造方法，前述薄膜小片的製造方法能夠製造積層有複數個輕剝離層、且輕剝離層的浮起已受到抑制之薄膜小片。&lt;br/&gt;[解決手段]本發明的實施形態之薄膜小片的製造方法包含有以下步驟：將單片片材一邊搬送，一邊藉由旋轉切割器來切斷成製品部分與非製品部分。該單片片材具備有具有5層以上的積層構造之積層薄膜、及貼附於該積層薄膜之複數個輕剝離層。該複數個輕剝離層包含有配置在最外層之第1輕剝離層、及積層有該第1輕剝離層之第2輕剝離層。該旋轉切割器具備有切削刀、與接觸於該切削刀之緩衝材。在將該單片片材切斷之步驟中，上述緩衝材會被該旋轉切割器與該積層薄膜夾住，並被壓縮為60%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:載體片材</p>  
        <p type="p">2:單片片材</p>  
        <p type="p">2a:製品部分</p>  
        <p type="p">2b:非製品部分</p>  
        <p type="p">3:切斷裝置</p>  
        <p type="p">31:旋轉切割器</p>  
        <p type="p">32:相向輥</p>  
        <p type="p">4:圖像辨識部</p>  
        <p type="p">5:片材供給部</p>  
        <p type="p">51:片材托盤</p>  
        <p type="p">52:載台</p>  
        <p type="p">53:輸送機</p>  
        <p type="p">54:拾取裝置</p>  
        <p type="p">55:第1夾送輥</p>  
        <p type="p">6:膠帶貼附部</p>  
        <p type="p">61:膠帶送料輥</p>  
        <p type="p">62:第2夾送輥</p>  
        <p type="p">63:連結材</p>  
        <p type="p">63a:連結膠帶</p>  
        <p type="p">7:載體片材搬送部</p>  
        <p type="p">71:載體片材送料輥(CS送料輥)</p>  
        <p type="p">72:載體片材捲取輥(CS捲取輥)</p>  
        <p type="p">73:緩衝輥</p>  
        <p type="p">74:導引輥</p>  
        <p type="p">74a:第1導引輥</p>  
        <p type="p">74b:剝離輥</p>  
        <p type="p">8:分離部</p>  
        <p type="p">81:分離輥</p>  
        <p type="p">82:捲取輥</p>  
        <p type="p">83:輸送機</p>  
        <p type="p">9:小片回收部</p>  
        <p type="p">91:拾取裝置</p>  
        <p type="p">92:良品托盤</p>  
        <p type="p">93:不良品托盤</p>  
        <p type="p">10:薄膜小片</p>  
        <p type="p">100:薄膜小片製造產線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="689" publication-number="202611753"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611753.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611753</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101527</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>正交化驅動且架構全面化訊號處理方法</chinese-title>  
        <english-title>ORTHOGONALIZATION-DRIVEN AND ARCHITECTURALLY COMPREHENSIVE METHODOLOGY FOR SIGNAL PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F17/16</main-classification>  
        <further-classification edition="200601120250303B">G06F17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商高峰科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL TECHNOLOGY CONSULTANTS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁　聞峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUEN, MAN-FUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭露的是一種新穎的正交化驅動和架構全面化方法，包括電腦實現的方法和模組化架構，可以顯著增強處理並行性並減少各種運算密集型訊號處理任務的處理延遲。這種方法在用於這些任務的高性能積體電路晶片的設計中也發揮著至關重要的作用。開展整體方法需要使用獨特的N個輸入與2N個輸出的處理架構作為基線架構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a novel orthogonalization-driven and architecturally comprehensive methodology, including computer-implemented methods and modular architectures, that can significantly enhance processing parallelism and reduce processing latency for a wide spectrum of computationally intensive signal processing tasks. This methodology also plays a crucial role in the design of high-performance integrated circuit chips for these tasks. Developing the overall methodology requires using an unique N-inputs-with-2N-outputs processing structure as the baseline architecture.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">160:方法示例</p>  
        <p type="p">161、163:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="690" publication-number="202611146"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611146.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611146</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101571</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於形成包括光熱轉換層之層壓體本體的套件、包括光熱轉換層的層壓體本體、及其製造方法</chinese-title>  
        <english-title>KIT FOR FORMING A LAMINATE BODY INCLUDING A LIGHT-TO-HEAT CONVERSION LAYER, A LAMINATE BODY INCLUDING A LIGHT-TO-HEAT CONVERSION LAYER, AND A MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F290/06</main-classification>  
        <further-classification edition="200601120251201B">C08F222/10</further-classification>  
        <further-classification edition="200601120251201B">C09J4/06</further-classification>  
        <further-classification edition="200601120251201B">H01L21/02</further-classification>  
        <further-classification edition="200601120251201B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商3Ｍ新設資產公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田一樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於形成包括光熱轉換層之層壓體本體的套件，其包含：自由基可聚合液體黏著劑，其含有至少一種自由基可聚合化合物及用於聚合該至少一種自由基可聚合化合物的至少一種多價金屬化合物；光熱轉換層油墨組成物，其含有可熱分解光吸收劑及黏合劑或其前驅物；及固化促進劑，其含有β-二羰基化合物或其鹽。該層壓體本體可在室溫下或藉由相對溫和的加熱快速固化而不需要UV輻照，且允許在室溫下長期儲存及較長的使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A kit for forming a laminate body including a light-to-heat conversion layer comprises a free radical polymerizable liquid adhesive containing at leastone free radical polymerizable compound and at least one polyvalent metal compound for polymerizing the at least one free radical polymerizable compound, a light-to-heat conversion layer ink composition containing a thermally decomposable light absorbing agent and a binder or precursor thereof, and a curing accelerator containing a β-dicarbonyl compound or salt thereof. The laminate body can be rapidly cured at room temperature or by relatively gentle heating without requiring UV irradiation, and which allows long-term storage at room temperature and a long usable life.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:層壓體本體</p>  
        <p type="p">12:透光支撐本體</p>  
        <p type="p">14:光熱轉換層</p>  
        <p type="p">16:固化促進劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="691" publication-number="202612499"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612499.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612499</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250513B">H10D30/60</main-classification>  
        <further-classification edition="202501120250513B">H10D30/01</further-classification>  
        <further-classification edition="202001120250513B">G06F30/30</further-classification>  
        <further-classification edition="202001120250513B">G06F30/392</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周雅琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YA-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧麒友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫承霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHEN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳顗伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施例半導體結構包括沿第一方向延伸的第一主動區域以及第二主動區域、彼此對齊並沿第二方向延伸的功能性閘極結構以及非功能性閘極結構、以及功能性閘極結構和非功能性閘極結構上方的金屬化層。金屬化層界定第一金屬化區域、第二金屬化區域、以及第一金屬化區域和第二金屬化區域之間的一個或兩個中間金屬化區域。功能性閘極結構與第一金屬化區域交疊並與一個或兩個中間金屬化區域中的一個交疊，以界定一個或兩個中間金屬化區域中的一個的交疊部分。交疊部分具有其中界定的空間，所述空間的尺寸適合用於功能性閘極結構和一個或兩個中間金屬化區域中的一個之間的連接特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An embodiment semiconductor structure includes a first active region and a second active region extending along a first direction, a functional gate structure and a non-functional gate structure aligned with each other and extending along a second direction, and a metallization layer over the functional gate structure and the non-functional gate structure. The metallization layer defines a first metallization region, a second metallization region, and one or two middle metallization regions between the first metallization region and the second metallization region. The functional gate structure overlaps the first metallization region and overlaps one of the one or two middle metallization regions to define an overlapped portion of the one of the one or two middle metallization regions. The overlapped portion has a space defined therein sized for a connection feature between the functional gate structure and the one of the one or two middle metallization regions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:方法</p>  
        <p type="p">910、920、930、940、950:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="692" publication-number="202612047"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612047.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612047</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101619</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>側軌緩衝設備的載物台裝置及具有此的半導體製程裝置</chinese-title>  
        <english-title>STAGE APPARATUS OF SIDE TRACK BUFFER AND SEMICONDUCTOR PROCESS DEVICE COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H01L21/67</main-classification>  
        <further-classification edition="200601120250401B">H01L21/677</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商責市特馬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUSTEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林榮振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, YOUNG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金容眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YONG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸正勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOUK, JEONG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁淳鐸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, SOON TAEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及在半導體製程設備流動惰性氣體的側軌緩衝設備的載物台裝置及具有此的半導體製程裝置，包括：供應部，設置在第一模組部的第一底座的一側以供應惰性氣體；第一流路控制部，調節惰性氣體的流動量；排放部，放惰性氣體。因此，本發明為，感應從半導體製程裝置排放的惰性氣體的溫度與半導體製程設備的濕度，進而根據溫度與濕度在多個半導體製程裝置個別調節惰性氣體的進氣量與排放量，進而提供可提高半導體製程裝置的生產性能及製程性能的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一模組部</p>  
        <p type="p">110:第一底座</p>  
        <p type="p">120:供應部</p>  
        <p type="p">130:第一流路控制部</p>  
        <p type="p">140:過濾部</p>  
        <p type="p">150:供應管道</p>  
        <p type="p">160:第一感測器部</p>  
        <p type="p">170:排放部</p>  
        <p type="p">180:第二感測器部</p>  
        <p type="p">190:感應部</p>  
        <p type="p">200:第二模組部</p>  
        <p type="p">210:第二底座</p>  
        <p type="p">220:第二流量控制部</p>  
        <p type="p">230:第二排放控制部</p>  
        <p type="p">300:連接部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="693" publication-number="202612450"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612450.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612450</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101799</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置與其製造方法</chinese-title>  
        <english-title>MEMORY DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250207B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置的製造方法，包括以下步驟：在基板上方形成位元線結構；在位元線結構上方共形地形成第一間隔層；對第一間隔層的上部分進行表面處理，其中在表面處理後，第一間隔層的上部的氧濃度高於第一間隔層的下部的氧濃度；移除第一間隔層的上部；形成與位元線結構相鄰的接觸結構；及在接觸結構及位元線結構上方形成著陸墊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of a memory device includes forming a bit line structure over a substrate, conformally forming a first spacer layer over the bit line structure, performing a surface treatment to an upper portion of the first spacer layer, in which an oxygen concentration of the upper portion of the first spacer layer is higher than an oxygen concentration of a lower portion of the first spacer layer after the surface treatment, removing the upper portion of the first spacer layer, forming a contact structure adjacent to the bit line structure, and forming a landing pad over the contact structure and the bit line structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">102、170:隔離結構</p>  
        <p type="p">106:介電層</p>  
        <p type="p">108:位元線觸點</p>  
        <p type="p">110:位元線結構</p>  
        <p type="p">112、114、152、154、156:導電層</p>  
        <p type="p">116:蓋層</p>  
        <p type="p">122、128、129:間隔層</p>  
        <p type="p">124:蝕刻終止層</p>  
        <p type="p">126:填充層</p>  
        <p type="p">150:接觸結構</p>  
        <p type="p">160:著陸墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="694" publication-number="202612451"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612451.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612451</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成記憶體裝置的方法</chinese-title>  
        <english-title>METHOD FOR FORMING A MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250207B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜序</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括以下步驟：在基板上方形成堆疊，堆疊包括第一犧牲層、第一支撐層、第二犧牲層及第二支撐層；形成第一及第二溝槽；在第一及第二溝槽中形成底部電極；在堆疊上方形成圖案化遮罩，其中圖案化遮罩具有曝露堆疊的開口；經由圖案化遮罩的開口對堆疊執行蝕刻製程，其中蝕刻製程蝕刻堆疊的第一部分以形成凹槽，而橫向位於第一溝槽與第二溝槽之間的堆疊的第二部分由聚合物保護，聚合物在執行蝕刻製程期間產生；自堆疊移除第一及第二犧牲層；在底部電極上方形成電容器介電層；及在電容器介電層上方形成頂部電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a stack including a first sacrificial layer, a first supporting layer, a second sacrificial layer, and a second supporting layer over a substrate; forming first and second trenches; forming bottom electrodes in the first and second trenches; forming a patterned mask over the stack, in which the patterned mask has an opening exposing the stack; performing an etch process to the stack through the opening of the patterned mask, in which the etch process etches through a first portion of the stack to form a recess, while a second portion of the stack laterally between the first trench and the second trench is protected by a polymer generated during performing the etch process; removing the first and second sacrificial layers from the stack; forming capacitor dielectric layers over the bottom electrodes; and forming top electrodes over the capacitor dielectric layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">105:基板</p>  
        <p type="p">130:介電層</p>  
        <p type="p">135:觸點</p>  
        <p type="p">145:第一支撐層</p>  
        <p type="p">155:第二支撐層</p>  
        <p type="p">160:底部電極</p>  
        <p type="p">165:圖案化遮罩</p>  
        <p type="p">170:聚合物</p>  
        <p type="p">T1、T3:溝槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="695" publication-number="202612112"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612112.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612112</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101939</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有弓度之玻璃載體晶圓及使用極化步驟製造其之方法</chinese-title>  
        <english-title>A GLASS CARRIER WAFER WITH A BOW AND A METHOD OF MAKING THE SAME WITH A POLING STEP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L23/15</main-classification>  
        <further-classification edition="200601120251204B">H01L21/324</further-classification>  
        <further-classification edition="200601120251204B">C03C3/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克拉倫　查理斯湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCLAREN, CHARLES THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧科羅　恰克伍迪阿祖布克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKORO, CHUKWUDI AZUBUIKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂斐爾　瑪爾多奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REVEIL, MARDOCHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　尼可拉斯詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, NICHOLAS JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　建之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIAN-ZHI JAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種玻璃載體晶圓包括：（a）與第一主表面相連且延伸至晶圓厚度內的第一表面玻璃區域，第一表面玻璃區域包括第一表面玻璃組成物，及（b）介於第一表面玻璃區域與第二主表面之間的塊體玻璃區域，塊體玻璃區域包括塊體玻璃組成物。第一表面玻璃組成物具有鹼金屬氧化物的合計莫耳百分比小於塊體玻璃組成物中的鹼金屬氧化物的合計莫耳百分比。第一表面玻璃區域和塊體玻璃區域是相連玻璃基質。第二主表面處的弓度與至少部分由第二主表面所定義玻璃載體晶圓的最大尺度的比率為在0.00001至0.01的範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A glass carrier wafer includes: (a) a first surface glass region contiguous with a first primary surface and extending into a wafer thickness, the first surface glass region including a first surface glass composition and (b) a bulk glass region between the first surface glass region and a second primary surface, the bulk glass region including a bulk glass composition. The first surface glass composition has a combined mole percentage of alkali oxides that is less than a combined mole percentage of alkali oxides in the bulk glass composition. The first surface glass region and the bulk glass region are of a contiguous glass matrix. A ratio of a bow at the second primary surface to a greatest dimension of the glass carrier wafer defined at least in part by the second primary surface is within a range of from 0.00001 to 0.01.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:玻璃載體晶圓</p>  
        <p type="p">12,14:主表面</p>  
        <p type="p">130:離子交換步驟</p>  
        <p type="p">132:離子交換介質</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="696" publication-number="202611540"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611540.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611540</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102148</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>飛行時間感測器及其製造方法</chinese-title>  
        <english-title>TIME-OF-FLIGHT SENSOR AND METHODS FOR MAKING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G01S7/481</main-classification>  
        <further-classification edition="202001120250602B">G01S17/02</further-classification>  
        <further-classification edition="202501120250602B">H10F55/255</further-classification>  
        <further-classification edition="200601120250602B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田子容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN, TZU JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開的一些實施例揭示飛行時間感測器及其製造方法。發光二極體與影像感測器相鄰，且不透明壁分離發光二極體和影像感測器，從而阻擋直接光徑。飛行時間感測器在面積及高度上均較小，且具有減小的功率消耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Time-of-Flight (ToF) sensors and methods for making are disclosed. A light-emitting diode is adjacent to an image sensor, and they are separated by an opaque wall to block direct light paths. The ToF sensor is smaller in both area and height, and has reduced power consumption.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:感測器</p>  
        <p type="p">110:第一晶粒/底部晶粒</p>  
        <p type="p">120:基板</p>  
        <p type="p">121:第一側/頂表面</p>  
        <p type="p">122:發光二極體區域</p>  
        <p type="p">124:邏輯區域</p>  
        <p type="p">130:發光二極體</p>  
        <p type="p">132:電性互連件</p>  
        <p type="p">140:電晶體</p>  
        <p type="p">142:電晶體/主動裝置</p>  
        <p type="p">144:電晶體/主動裝置</p>  
        <p type="p">146:電晶體/主動裝置</p>  
        <p type="p">148:電性互連件</p>  
        <p type="p">150:阱</p>  
        <p type="p">152:阱</p>  
        <p type="p">154:阱</p>  
        <p type="p">156:阱</p>  
        <p type="p">160:互連層</p>  
        <p type="p">161:頂表面</p>  
        <p type="p">162:介電材料</p>  
        <p type="p">164:金屬佈線</p>  
        <p type="p">166:接觸件通孔</p>  
        <p type="p">168:接合襯墊</p>  
        <p type="p">210:第二晶粒封裝/頂部晶粒</p>  
        <p type="p">220:基板</p>  
        <p type="p">221:第一側/第一表面</p>  
        <p type="p">223:第二側/第二表面</p>  
        <p type="p">230:影像感測器</p>  
        <p type="p">240:第一深阱</p>  
        <p type="p">245:第一深度</p>  
        <p type="p">250:通道</p>  
        <p type="p">252:電極</p>  
        <p type="p">260:第二深阱</p>  
        <p type="p">270:第一阱</p>  
        <p type="p">275:第二深度</p>  
        <p type="p">278:電極</p>  
        <p type="p">280:互連層</p>  
        <p type="p">281:第一側</p>  
        <p type="p">282:介電材料</p>  
        <p type="p">284:金屬佈線</p>  
        <p type="p">286:接觸件通孔</p>  
        <p type="p">288:接合襯墊</p>  
        <p type="p">290:不透明壁</p>  
        <p type="p">DNW:深n型阱</p>  
        <p type="p">HVNW:高電壓n型阱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="697" publication-number="202611981"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611981.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611981</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造裝置及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250804B">H01L21/02</main-classification>  
        <further-classification edition="200601120250804B">H01L21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片岡淳司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAOKA, JUNJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浅川鋼児</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAKAWA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗原一彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURIHARA, KAZUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯野大輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IINO, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤有真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, YUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本直義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, NAOYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小山内誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSANAI, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可於半導體基板的濕式蝕刻步驟中抑制半導體基板上的圖案的倒塌的半導體製造裝置及半導體裝置的製造方法。一實施形態的半導體製造裝置包括第一流體貯存部，所述第一流體貯存部貯存藉由向第一液體添加對pH值進行調整的調整物質而生成的第一流體。第一流體供給部向混合器供給第一流體。第二流體供給部使第二流體變質為超臨界流體並向混合器進行供給。第一加熱機構收容混合器並對混合器進行加熱。第二加熱機構對能夠收容基板的腔室內進行加熱。混合流體供給部向第二加熱機構供給於混合器內將第一流體及超臨界流體混合而成的混合流體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:蝕刻裝置</p>  
        <p type="p">110、120:加熱機構</p>  
        <p type="p">111:腔室</p>  
        <p type="p">112:載台</p>  
        <p type="p">121:混合器</p>  
        <p type="p">122、123:加熱部</p>  
        <p type="p">130、140:送液泵</p>  
        <p type="p">150:第一流體貯存部</p>  
        <p type="p">160:CO&lt;sub&gt;2&lt;/sub&gt;貯存部</p>  
        <p type="p">170、190:pH值調整物質貯存部</p>  
        <p type="p">180:水貯存部</p>  
        <p type="p">L1:第一流體</p>  
        <p type="p">P0、P1、P2、P3、P4、P5、P6、P7:管道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="698" publication-number="202611637"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611637.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611637</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102219</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>度量衡系統中引導模板匹配之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR GUIDED TEMPLATE MATCHING IN METROLOGY SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">G03F7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付　繼有</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, JIYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晨雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHENYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於引導模板匹配之系統及方法，其可包括：產生一樣本之一影像；針對該影像之每單位胞元，判定該影像之該樣本的一對應特徵之一大小；基於該對應特徵之經判定大小產生該樣本的各特徵之一模板；使用運用一系列調整因數進行的該模板之一動態更新來使該模板與該影像之該對應特徵匹配；基於該匹配產生一最終模板；及基於該最終模板計算各特徵之一位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for guided template matching may include generating an image of a sample; per unit cell of the image, determining a size of a corresponding feature of the sample of the image; generating a template of each feature of the sample based on the determined size of the corresponding feature; matching the template to the corresponding feature of the image using a dynamic updating of the template with a range of adjustment factors; generating a final template based on the matching; and calculating a position of each feature based on the final template.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">410:影像/灰階影像/經二進位化影像</p>  
        <p type="p">410a:影像</p>  
        <p type="p">412:特徵</p>  
        <p type="p">414:單位胞元</p>  
        <p type="p">420:經二進位化影像</p>  
        <p type="p">424:第一顏色/亮色光點</p>  
        <p type="p">426:第二顏色</p>  
        <p type="p">430:影像/經濾波影像</p>  
        <p type="p">430a:影像</p>  
        <p type="p">432:特徵</p>  
        <p type="p">434:長度</p>  
        <p type="p">436:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="699" publication-number="202611638"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611638.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611638</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102236</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>度量衡系統中可變形光學組件之致動及調變</chinese-title>  
        <english-title>DEFORMABLE OPTICAL COMPONENT ACTUATION AND MODULATION IN A METROLOGY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">G03F7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華那爾　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARNAAR, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周子理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZILI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩羅門斯　亨利克斯　佩特羅　瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PELLEMANS, HENRICUS PETRUS MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉瑪錢德拉　拉奧　帕德馬庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMACHANDRA RAO, PADMAKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈克　斯喬德　亞瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HACK, SJOERD ARTHUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔克爾　特尼思　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUKKER, TEUNIS WILLEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿赫桑　阿米拉　賽義達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHSAN, AMIRA SAYYIDAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種度量衡設備，其包括一光學組件、一晶圓、一感測器及一處理器。可在多個像差模式之間致動的該光學組件對入射在該光學組件上之光提供一波前校正。由該光學組件反射及/或透射之光係由該晶圓上之一目標散射。該經散射光形成由一感測器收集之一量測信號。該處理器使用該量測信號以判定用於該光學組件之一像差校正。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A metrology apparatus includes an optical component, a wafer, a sensor, and a processor. The optical component, which can actuate between multiple aberration modes, provides a wavefront correction to light incident on the optical component. Light reflected and/or transmitted by the optical component is scattered by a target on the wafer. The scattered light forms a measurement signal that is collected by a sensor. The processor uses the measurement signal to determine an aberration correction for the optical component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">+1(N):+1繞射射線</p>  
        <p type="p">1(S):-1繞射射線</p>  
        <p type="p">11:源</p>  
        <p type="p">12:透鏡</p>  
        <p type="p">13:孔徑板</p>  
        <p type="p">13N:孔徑板</p>  
        <p type="p">13S:孔徑板</p>  
        <p type="p">14:透鏡</p>  
        <p type="p">15:射束分裂器</p>  
        <p type="p">16:物鏡</p>  
        <p type="p">17:第二射束分裂器</p>  
        <p type="p">18:光學系統</p>  
        <p type="p">19:第一感測器</p>  
        <p type="p">20:光學系統</p>  
        <p type="p">21:孔徑光闌</p>  
        <p type="p">22:光學系統</p>  
        <p type="p">23:感測器</p>  
        <p type="p">400:度量衡設備</p>  
        <p type="p">N:孔徑</p>  
        <p type="p">O:光軸</p>  
        <p type="p">PU:處理器</p>  
        <p type="p">S:孔徑</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="700" publication-number="202610946"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610946.zip"/>
    </tif-files>
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      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610946</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102542</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>廢水處理系統</chinese-title>  
        <english-title>WASTEWATER TREATMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250409B">C02F1/08</main-classification>  
        <further-classification edition="202301120250409B">C02F1/469</further-classification>  
        <further-classification edition="200601120250409B">B01D61/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商泰樂科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERRACLE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李聖言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEONG EON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金度完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DO WAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一實施例的廢水處理系統用於處理包含硫酸鈉溶液的廢水，廢水處理系統包括：電滲析裝置，將該廢水的該硫酸鈉溶液分離為包含硫酸離子的第一溶液、包含鈉離子的第二溶液及去除硫酸鈉的循環廢水；第一膜蒸餾裝置，為了濃縮該第一溶液而從該第一溶液中提取純化水；以及第二膜蒸餾裝置，為了濃縮該第二溶液而從該第二溶液中提取純化水。本發明一實施例的廢水處理系統可通過電滲析裝置選擇性地分離廢水內的鹽類化合物和其他有害離子來有效分離高濃度的離子溶液。由此，不僅能夠最大限度地循環利用廢水處理後的物質，而且，可大幅減少鹽類化合物的環境危害性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">P:廢水</p>  
        <p type="p">P1:循環廢水</p>  
        <p type="p">W:純化水</p>  
        <p type="p">W1:冷卻水</p>  
        <p type="p">1:廢水處理系統</p>  
        <p type="p">10:電滲析裝置</p>  
        <p type="p">11:電滲析箱</p>  
        <p type="p">12:陽極</p>  
        <p type="p">13:陰極</p>  
        <p type="p">14:雙極膜</p>  
        <p type="p">15:陰離子滲析膜</p>  
        <p type="p">16:陽離子滲析膜</p>  
        <p type="p">17:中心空間</p>  
        <p type="p">18:第一溶液形成空間</p>  
        <p type="p">19:第二溶液形成空間</p>  
        <p type="p">20:第一膜蒸餾裝置</p>  
        <p type="p">21:第一膜蒸餾箱</p>  
        <p type="p">22:第一疏水性滲析膜</p>  
        <p type="p">23:第一溶液濃縮空間</p>  
        <p type="p">24:第一冷卻空間</p>  
        <p type="p">30:第二膜蒸餾裝置</p>  
        <p type="p">31:第二膜蒸餾箱</p>  
        <p type="p">32:第二疏水性滲析膜</p>  
        <p type="p">33:第二溶液濃縮空間</p>  
        <p type="p">34:第二冷卻空間</p>  
        <p type="p">40:第一溶液濃縮箱</p>  
        <p type="p">50:第二溶液濃縮箱</p>  
        <p type="p">60:廢水箱</p>  
        <p type="p">70:冷卻水槽</p>  
        <p type="p">101:第一溶液匯流點</p>  
        <p type="p">102:第二溶液匯流點</p>  
        <p type="p">103:第一加熱器</p>  
        <p type="p">104:第二加熱器</p>  
        <p type="p">105:第一冷卻器</p>  
        <p type="p">106:第二冷卻器</p>  
        <p type="p">107:泵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="701" publication-number="202611737"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611737.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611737</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102547</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G06F13/14</main-classification>  
        <further-classification edition="200601120250602B">G11C11/4063</further-classification>  
        <further-classification edition="200601120250602B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>会田隆之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIDA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種記憶體系統，其抑制了由訓練動作引起之性能下降。 &lt;br/&gt;本發明之記憶體系統之控制器能夠執行第1寫入動作及第2寫入動作中之任一寫入動作。第1寫入動作中，控制器將作為寫入對象之第1資料傳輸至記憶體裝置，並使記憶體裝置將第1資料儲存於記憶胞陣列。第2寫入動作中，控制器將作為寫入對象之第2資料傳輸至記憶體裝置，並自緩衝電路獲取第2資料，決定所獲取之上述第2資料中包含之錯誤位元之數量，於錯誤位元之數量大於第1閾值之情形時，執行訓練動作來調整延遲電路之延遲時間，於錯誤位元之數量小於第1閾值之情形時，不執行訓練動作，而是使記憶體裝置將緩衝電路中儲存之第2資料儲存於記憶胞陣列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體晶片</p>  
        <p type="p">111:資料暫存器</p>  
        <p type="p">113:記憶胞陣列</p>  
        <p type="p">120:鎖存電路</p>  
        <p type="p">200:控制器</p>  
        <p type="p">206:ECC電路</p>  
        <p type="p">S1,S2,S3,S4-1,S4-2:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="702" publication-number="202612248"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612248.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612248</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102569</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感應馬達控制方法、裝置、設備以及存儲介質</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250806B">H02P6/06</main-classification>  
        <further-classification edition="201601120250806B">H02P6/08</further-classification>  
        <further-classification edition="201601120250806B">H02P21/14</further-classification>  
        <further-classification edition="201601120250806B">H02P25/022</further-classification>  
        <further-classification edition="201601120250806B">H02P29/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商峰岧科技（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢　超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬小俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開一種感應馬達控制方法、裝置、設備以及存儲介質，該方法包括：通過獲取感應馬達零速時的初始等效電路參數確定佳效啟動頻率，以及預設的啟動電流確定啟動電壓，以便使能感應馬達進入啟動運行階段，隨後在確定感應馬達在啟動運行階段時的馬達啟動轉速加速到與預設的穩定運行轉速一致時，則確定感應馬達從啟動運行階段切換至穩定運行階段，並在穩定運行階段利用電壓電流數據對定子、轉子及激磁支路進行在線辨識的運算，進而依據得到的佳效運行頻率驅動感應馬達運行，並實時監測馬達實際轉速，以便依據馬達實際轉速調節驅動電壓以維持感應馬達的穩態運行，從而可在不增加變頻器成本的前提下，實現感應馬達運行效率的與啟動能力的提升。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S30:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="703" publication-number="202611736"> 
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      <tif no="1" file="202611736.zip"/>
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      <isuno>6</isuno>  
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        <document-id> 
          <doc-number>202611736</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102591</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G06F12/14</main-classification>  
        <further-classification edition="201301120250602B">G06F21/78</further-classification>  
        <further-classification edition="201601120250602B">G06F12/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久原亮一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUHARA, RYOHICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川暁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤喜之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDOH, YOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能加強與對儲存器之存取相關之安全之記憶體系統。 &lt;br/&gt;根據實施方式，記憶體系統具備非揮發性記憶體及控制器。控制器管理與第1用戶識別資訊建立關聯之第1認證資訊。控制器產生與第1用戶識別資訊建立關聯之第1認證符。控制器將第1認證符發送至主機。控制器接收包含第1用戶識別資訊及第2認證符之第1存取指令。控制器至少使用第1認證資訊及第1認證符，驗證第2認證符之正當性。控制器於第2認證符之正當性得到確認時，執行按照第1存取指令對非揮發性記憶體之第1處理。控制器於第2認證符之正當性未獲確認時，不執行按照第1存取指令之第1處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:主機</p>  
        <p type="p">3:記憶體系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="704" publication-number="202612452"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612452.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612452</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102644</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250709B">H10B12/00</main-classification>  
        <further-classification edition="202301120250709B">H10B10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井幹也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, MIKIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村瀬正恭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURASE, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松澤雄矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUZAWA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井章輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, SHOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田光太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施形態提供一種能夠製造品質良好的半導體裝置的半導體記憶裝置及半導體裝置。實施形態的半導體記憶裝置包括：氧化物半導體，沿著上下方向延伸；第一電極，包含含有第一氧化物導電材料、且與所述氧化物半導體的上端連接的第一導電體；閘極電極，介隔閘極絕緣膜與所述氧化物半導體相向；第二電極，設置於所述氧化物半導體的下方，且於所述上下方向上延伸；電介質層，設置於所述第二電極的外周面；以及第三電極，設置於所述電介質層的外周面，所述第二電極包含第二導電體，所述第二導電體含有第二氧化物導電材料，且與所述氧化物半導體的下端連接，並具有隔著所述電介質層與所述第三電極的內周面相向的相向面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:電容器</p>  
        <p type="p">21:導電膜</p>  
        <p type="p">22:電介質層</p>  
        <p type="p">22a、22b、45a、45b:絕緣膜</p>  
        <p type="p">22i、25i:內周面</p>  
        <p type="p">22o、24o:外周面</p>  
        <p type="p">23:導電體</p>  
        <p type="p">24、25、50:電極</p>  
        <p type="p">30:半導體裝置</p>  
        <p type="p">32、50a:金屬氧化物層</p>  
        <p type="p">32a:相向面</p>  
        <p type="p">32d、70d:中心軸</p>  
        <p type="p">34、35、63:絕緣層</p>  
        <p type="p">42:導電層</p>  
        <p type="p">43:閘極絕緣膜</p>  
        <p type="p">50b:障壁金屬層</p>  
        <p type="p">50c:金屬膜</p>  
        <p type="p">70:氧化物半導體層</p>  
        <p type="p">70a:上端</p>  
        <p type="p">70b:下端</p>  
        <p type="p">70ZX:剖面</p>  
        <p type="p">101:半導體記憶裝置</p>  
        <p type="p">TH:電晶體孔</p>  
        <p type="p">X、Y、Z:軸/方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="705" publication-number="202611787"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611787.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611787</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102685</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三階段式半監督式實例分割訓練方法與系統</chinese-title>  
        <english-title>THREE-STAGE SEMI-SUPERVISED INSTANCE SEGMENTATION TRAINING METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06N3/088</main-classification>  
        <further-classification edition="201901120250303B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭峻因</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, JIUN-IN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖化仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, HUA-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIUN-SHIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種三階段式的半監督式實例分割訓練方法與系統，其中在第一階段中，通過已標記資料訓練教師模型與學生模型，並且教師模型與學生模型分別採用不同品質的資料進行訓練；在第二階段中，教師模型對無標記資料進行預測，並根據預測結果的信心度生成偽標籤，另一方面，學生模型學習已標記資料，並基於所述偽標籤學習無標記資料；其中，還可通過軟性標籤過濾器過濾出高品質的偽標籤，並通過正樣本損失函數排除因為資訊不完全的偽標籤產生錯誤收斂模型的問題，再以反向傳播更新學生模型的參數；在第三階段中，將學生模型的參數通過指數移動平均演算更新至教師模型，使得教師模型與學生模型皆運作在相同架構下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A three-stage semi-supervised instance segmentation training method and a system are provided. In a first stage, a teacher model and a student model are trained based on labeled data. In a second stage, the teacher model performs prediction on unlabeled data and generates pseudo labels according to a prediction result. On the other hand, a student model learns labeled data and learns unlabeled data based on the pseudo labels. Further, a soft label filter can be used to filter out high-quantity pseudo labels, a positive sample loss function is used to eliminate the problems of incorrect model convergence due to the pseudo labels with incomplete information, and the parameters of the student model can be updated via a backward propagation process. In a third stage, the parameters of the student model are then transferred to the teacher model through an exponential moving average operation, so that the teacher model and the student model are operated under a same architecture.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:教師模型</p>  
        <p type="p">22:學生模型</p>  
        <p type="p">25:無標記資料</p>  
        <p type="p">26:已標記資料</p>  
        <p type="p">27:軟標籤過濾器</p>  
        <p type="p">28:正樣本損失模組</p>  
        <p type="p">281:正樣本損失</p>  
        <p type="p">201:弱資料增強策略</p>  
        <p type="p">203:強資料增強策略</p>  
        <p type="p">205:引入已標記資料</p>  
        <p type="p">207:偽標籤過濾策略</p>  
        <p type="p">209:預測結果</p>  
        <p type="p">211:反向傳播</p>  
        <p type="p">213:更新</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="706" publication-number="202612251"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612251.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612251</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可自適應預測故障之散熱風扇系統及其控制方法</chinese-title>  
        <english-title>ADAPTIVE FAULT PREDICTION COOLING FAN SYSTEM AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250210B">H02P21/14</main-classification>  
        <further-classification edition="201601120250210B">H02P21/24</further-classification>  
        <further-classification edition="200601120250210B">F04D27/00</further-classification>  
        <further-classification edition="200601120250210B">G06F11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHIH-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏道炎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, TAO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林奕圻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, I-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許麗美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱風扇系統，包含：複數風扇電路，用以根據對應的複數脈寬調變訊號驅動對應的複數風扇裝置；以及管理控制器，分別用以於測試及操作程序控制與調整複數風扇電路，藉此偵測複數風扇電路的故障預測狀態。於測試程序中，根據複數風扇電路的每一者所回傳的轉速回傳訊號，回授控制複數風扇電路的當前轉速向量至目標轉速向量，並根據對應於目標轉速向量的預設電氣參數向量建立系統係數表。於操作程序中，根據環境條件決定操作轉速向量，並傳送對應的複數脈寬調變訊號至複數風扇電路，接著根據系統係數表，偵測複數風扇電路的故障預測狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cooling fan system includes: a plurality of fan circuits configured to drive a corresponding plurality of fan devices according to a corresponding plurality of Pulse Width Modulation (PWM) signals; and a management controller configured to control and adjust the fan circuits respectively in a test procedure and an operation procedure. In the test procedure, according to rotational speed feedback signals returned from each of the fan circuits, a present rotational speed vector of the fan circuits is fed back to a target rotational speed vector, and a system coefficient table is established based on a predetermined electrical parameter vector corresponding to the target rotational speed vector. In the operation procedure, an operation rotational speed vector is determined according to environmental conditions, and the fan circuits are controlled with feedback and the corresponding PWM signals are transmitted to the fan circuits. Subsequently, based on the system coefficient table, the fault prediction state of the fan circuits is detected.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100~S111:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="707" publication-number="202611910"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611910.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611910</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統、穩壓器電路及其操作方法</chinese-title>  
        <english-title>MEMORY SYSTEM, VOLTAGE REGULATOR AND METHOD OF OPERATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250909B">G11C5/14</main-classification>  
        <further-classification edition="200601120250909B">G11C11/4074</further-classification>  
        <further-classification edition="200601120250909B">G05F1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喻鵬飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUH, PERNG-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電壓調節系統包含全域電壓產生器電路，該全域電壓產生器電路具有用以接收參考電壓的參考輸入端及用以輸出複製參考電壓的閘極信號的輸出端。複數個驅動器電路各自具有連接至全域產生器電路的輸出端的輸入端。驅動器電路中的每一者的輸出端連接至複數個記憶體巨集中對應的一或多者。驅動器電路各自用以輸出控制信號，該控制信號將參考電壓複製至其對應的記憶體巨集。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A voltage regular system a global voltage generator circuit having a reference input terminal configured to receive a reference voltage and an output terminal configured to output a gate signal that replicates the reference voltage. A plurality of driver circuits each have an input terminal connected to the output terminal of the global generator circuit. An output terminal of each of the driver circuits is connected to a corresponding one or more of a plurality of memory macros. The driver circuits are each configured to output a control signal that replicates the reference voltage to its corresponding memory macro(s).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:穩壓器方法</p>  
        <p type="p">610、612、614、616、618:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="708" publication-number="202612172"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612172.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612172</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102887</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線結構及電子裝置</chinese-title>  
        <english-title>ANTENNA STRUCTURE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250307B">H01Q1/50</main-classification>  
        <further-classification edition="200601120250307B">H01Q1/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啓碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON NEWEB CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫慈寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, TZU-KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳靜雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂仁超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JEN-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐詩鎧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHIH-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線結構，包含一信號單元、一第一接地單元、一第二接地單元及一寄生單元。信號單元用以供設置一饋入埠。第一接地單元與信號單元對應設置並用以連接一系統地。第二接地單元與第一接地單元分離並用以連接系統地。寄生單元鄰近第二接地單元並耦合第一接地單元。信號單元、第一接地單元、第二接地單元及寄生單元為相同或相異的導電材質製成。藉此，有助於第二接地單元作為天線結構的輻射件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna structure includes a signal unit, a first ground unit, a second ground unit and a parasitic unit. The signal unit is configured for disposing a feed port thereon. The first ground unit is disposed correspondingly to the signal unit and is configured to be connected to a system ground. The second ground unit is separated from the first ground unit and configured to be connected to the system ground. The parasitic unit is adjacent to the second ground unit and coupled to the first ground unit. The signal unit, the first ground unit, the second ground unit and the parasitic unit are made of the same or different conductive materials. Therefore, the second ground element is advantageous in serving as a radiating element of the antenna structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:天線結構</p>  
        <p type="p">110:第一接地單元</p>  
        <p type="p">120:第二接地單元</p>  
        <p type="p">130:信號單元</p>  
        <p type="p">133:饋入埠</p>  
        <p type="p">140:寄生單元</p>  
        <p type="p">141:第一耦合部</p>  
        <p type="p">147:連接部</p>  
        <p type="p">151:第一枝部</p>  
        <p type="p">161:第一段</p>  
        <p type="p">162:第二段</p>  
        <p type="p">171:轉角</p>  
        <p type="p">181:間隙</p>  
        <p type="p">197:端</p>  
        <p type="p">410:系統地</p>  
        <p type="p">m1:長度</p>  
        <p type="p">s1:間距</p>  
        <p type="p">t1:總長度</p>  
        <p type="p">x1:第一方向</p>  
        <p type="p">y1:第二方向</p>  
        <p type="p">z1:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="709" publication-number="202612500"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612500.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612500</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102906</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置以及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251020B">H10D30/60</main-classification>  
        <further-classification edition="200601120251020B">H01L23/522</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木野雄介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮田俊敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYATA, TOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施方式提供一種可在抑制寄生電容的增加的同時積層多個電晶體的半導體裝置以及半導體裝置的製造方法。實施方式的半導體裝置包括：半導體基板；第一電晶體，設置於半導體基板；半導體層，設置於半導體基板的上方，且具有較半導體基板小的面積；第二電晶體，設置於半導體層的與半導體基板相向之側；絕緣層，設置於半導體層上，且具有較半導體層大的面積；以及觸點，在上下方向上不與半導體層重疊的位置，自第一電晶體貫通絕緣層並向上方延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">31、32、40、50、60:絕緣層</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">C1h、C1v:層間連接點</p>  
        <p type="p">C3、C4、CC、CGh、CGv、CSh、CSv:觸點</p>  
        <p type="p">CBA:周邊電路</p>  
        <p type="p">D0h、D1h、D0v、D1v:配線層</p>  
        <p type="p">DB:半導體層</p>  
        <p type="p">EL:電極層</p>  
        <p type="p">GEh、GEv:閘極電極</p>  
        <p type="p">GXh、GXv:閘極絕緣層</p>  
        <p type="p">LLh、LLv:襯墊層</p>  
        <p type="p">LM:積層體</p>  
        <p type="p">MR:記憶體區域</p>  
        <p type="p">PD:焊墊區域</p>  
        <p type="p">PG:插頭</p>  
        <p type="p">PL:支柱</p>  
        <p type="p">SB:半導體基板</p>  
        <p type="p">SDh、SDv:源極/汲極區域</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">SP:階梯部</p>  
        <p type="p">SR:階梯區域</p>  
        <p type="p">TRh、TRv:電晶體</p>  
        <p type="p">WL:字元線</p>  
        <p type="p">X、Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="710" publication-number="202611924"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611924.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611924</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種半導體裝置、記憶體系統及其操作方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE, MEMORY SYSTEM AND METHOD OF OPERATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">G11C11/419</main-classification>  
        <further-classification edition="200601120250703B">H01L23/528</further-classification>  
        <further-classification edition="202301120250703B">H10B10/00</further-classification>  
        <further-classification edition="202301120250703B">H10B12/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青柳佑海人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAGI, YUMITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藪内誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YABUUCHI, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體系統，包括耦接至第一字元線的記憶體單元之第一行及耦接至第二字元線的記憶體單元之第二行。第一行中之第一記憶體單元與第二行中之第二記憶體單元處於相同列中。記憶體系統包括字元線驅動器電路，其用以在第一字元線處產生選擇信號，以選擇第一記憶體單元並取消選取第二記憶體單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory system includes a first column of memory cells coupled to a first word line and a second a second column of memory cells coupled to a second word line. A first memory cell of the first column is in the same row as a second memory cell of the second column. The memory system includes a word line driver circuit configured to generate a select signal at the first word line to select the first memory cell and de-select the second memory cell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1800:方法</p>  
        <p type="p">1802~1808:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="711" publication-number="202611933"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611933.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611933</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103116</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G11C16/26</main-classification>  
        <further-classification edition="200601120250602B">G11C16/06</further-classification>  
        <further-classification edition="200601120250602B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石崎佑樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIZAKI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠提高動作速度之半導體記憶裝置。 &lt;br/&gt;實施方式之半導體記憶裝置具備：位元線；記憶胞電晶體，其與上述位元線電性連接；感測放大器模組，其經由上述位元線自上述記憶胞電晶體讀出資料；上述感測放大器模組包含：第1節點，其可與上述位元線電性連接；及第2節點；且於一邊對上述記憶胞電晶體之閘極施加第1電壓，一邊連續讀出第1資料及第2資料之驗證動作期間中，於連續之第1期間及第2期間中之上述第1期間，上述第2節點之電壓對應於上述第1節點之電壓之下降而下降，上述感測放大器模組構成為：基於在上述第1期間下降之上述第2節點之電壓，判定上述第1資料，且基於在上述第2期間下降之上述第1節點之電壓，判定上述第2資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BL:位元線</p>  
        <p type="p">LBUS:匯流排</p>  
        <p type="p">SEN1:節點</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">STB,TTI,TTL,XXL:信號</p>  
        <p type="p">t10~t21:時刻</p>  
        <p type="p">TSH:第2感測期間</p>  
        <p type="p">TSL:第1感測期間</p>  
        <p type="p">VBL,VCGRV,VPC,VREAD,VS,VSEN,VSENP,VSL,VSS:電壓</p>  
        <p type="p">VT:閾值電壓</p>  
        <p type="p">WL,WLnsel,WLsel:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="712" publication-number="202611919"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611919.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611919</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103180</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置、其操作方法及記憶體預充電電路</chinese-title>  
        <english-title>MEMORY DEVICE, OPERATION METHOD OF THE SAME AND MEMORY PRECHARGE CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250908B">G11C11/4091</main-classification>  
        <further-classification edition="200601120250908B">G11C7/12</further-classification>  
        <further-classification edition="200601120250908B">G11C7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李婕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉逸青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　奕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示文件提供一種用於記憶體單元的預充電電路及記憶體裝置。在示例性實施例中，記憶體裝置包含記憶體陣列、位元線、參考位元線及感測放大器電路。記憶體陣列包含記憶體單元。位元線連接至記憶體單元的輸出端子。感測放大器電路耦接至位元線並耦接至參考位元線。記憶體裝置進一步包含預充電電路。預充電電路耦接至位元線及參考位元線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure describes a precharge circuit for a memory cell and a memory device. In an example embodiment, the memory device comprises a memory array including a memory cell, a bit line connected to an output terminal of the memory cell, a reference bit line, and a sensing amplifier circuit coupled to the bit line and coupled to the reference bit line. The memory device further comprises a precharge circuit coupled to the bit line and the reference bit line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">110:BL陣列</p>  
        <p type="p">112:BLB陣列</p>  
        <p type="p">114:電容器</p>  
        <p type="p">116:字元線(WL)電晶體</p>  
        <p type="p">118,120:WL驅動器</p>  
        <p type="p">122,BL0~BLn-1:位元線(BL)</p>  
        <p type="p">124,BLB0~BLBn-1:參考位元線(BLB)</p>  
        <p type="p">126A~126F:感測放大器電路</p>  
        <p type="p">128:預充電電路</p>  
        <p type="p">128A~128F:預充電電路</p>  
        <p type="p">200:單元</p>  
        <p type="p">V&lt;sub&gt;CC&lt;/sub&gt;:電壓供應訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="713" publication-number="202611450"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611450.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611450</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103372</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>泵系統</chinese-title>  
        <english-title>PUMP SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">F25B9/10</main-classification>  
        <further-classification edition="200601120251211B">F04B37/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德華真空有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS VACUUM LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇佐莫拉　尼凡卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOZOMORA, NEVENKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威爾森　德瑞克　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLSON, DEREK PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱爾　考斯塔卜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALE, KAUSTUBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施例係關於一種低溫泵系統。該低溫泵系統包括一低溫冷凍器，其經構形以將製冷劑冷卻至一第一低溫溫度以用於供應至一低溫泵之一單級低溫冷卻器。該低溫泵系統進一步包括該低溫泵，該低溫泵包括該單級低溫冷卻器，該單級低溫冷卻器經構形以將該製冷劑從該第一低溫溫度冷卻至低於該第一低溫溫度之一第二低溫溫度。該單級低溫冷卻器經構形以使用與該低溫冷凍器不同之一製冷循環來操作。該低溫泵進一步包括一低溫表面，其經構形以藉由該單級低溫冷卻器冷卻至該第二低溫溫度用於捕獲氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments relate to a cryopump system. The cryopump system comprises a cryochiller configured to cool refrigerant to a first cryogenic temperature for supply to a single-stage cryocooler of a cryopump. The cryopump system further comprises the cryopump which comprises the single-stage cryocooler configured to cool the refrigerant from the first cryogenic temperature to a second cryogenic temperature lower than the first cryogenic temperature. The single-stage cryocooler is configured to operate using a different refrigeration cycle to the cryochiller. The cryopump further comprises a cryogenic surface configured to be cooled by the single-stage cryocooler to the second cryogenic temperature for capturing gas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:低溫泵系統</p>  
        <p type="p">11:低溫泵</p>  
        <p type="p">13:單級低溫冷卻器</p>  
        <p type="p">14:第一低溫表面及輻射屏蔽件</p>  
        <p type="p">15:第二低溫表面</p>  
        <p type="p">16:壓縮機</p>  
        <p type="p">17:熱交換器</p>  
        <p type="p">18:供應管線</p>  
        <p type="p">19:返回管線</p>  
        <p type="p">20:低溫製冷器</p>  
        <p type="p">21:熱交換器</p>  
        <p type="p">22:低溫冷凍器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="714" publication-number="202611927"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611927.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611927</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置及其控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G11C16/06</main-classification>  
        <further-classification edition="200601120250602B">G11C11/407</further-classification>  
        <further-classification edition="200601120250602B">G11C7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐貫朋也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANUKI, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中瞳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, HITOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野創</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, HAJIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中玲華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, REIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>人見達郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITOMI, TATSURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉水康人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIMIZU, YASUHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施方式提供一種可抑制記憶體特性的劣化或者使記憶體特性恢復的半導體記憶裝置及其控制方法。基於本實施方式的半導體記憶裝置包括記憶體元件，所述記憶體元件包括由電晶體構成且能夠保持資料的多個記憶體單元。控制器使用自第一電壓至最高臨限值電壓的第一範圍，向多個記憶體單元寫入資料，所述第一電壓較最低臨限值電壓高能夠用於保持資料的多個記憶體單元的最低臨限值電壓與最高臨限值電壓之間的範圍的四分之一。控制器在以第一範圍寫入資料的狀態下對多個記憶體單元進行加熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Er:抹除狀態/抹除位準/電壓位準/三位元資料/資料/第一電壓位準</p>  
        <p type="p">LL:最低臨限值電壓</p>  
        <p type="p">LH:最高臨限值電壓</p>  
        <p type="p">R1、R2:範圍</p>  
        <p type="p">Rfull:可運作範圍/範圍</p>  
        <p type="p">S1:電壓位準/三位元資料/資料/第二電壓位準</p>  
        <p type="p">S2:電壓位準/三位元資料/資料/第三電壓位準</p>  
        <p type="p">S3:電壓位準/三位元資料/資料/第四電壓位準</p>  
        <p type="p">S4:電壓位準/三位元資料/資料/第五電壓位準</p>  
        <p type="p">S5:電壓位準/三位元資料/資料/第六電壓位準</p>  
        <p type="p">S6:電壓位準/三位元資料/資料/第七電壓位準</p>  
        <p type="p">S7:電壓位準/三位元資料/資料/第八電壓位準</p>  
        <p type="p">Vth:臨限值電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="715" publication-number="202612386"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612386.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612386</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103878</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於選擇性加熱結合離散碳奈米管的材料的裝置</chinese-title>  
        <english-title>APPARATUS FOR SELECTIVELY HEATING A MATERIAL INTEGRATED WITH DISCRETE CARBON NANOTUBES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">H05B3/14</main-classification>  
        <further-classification edition="201701120251211B">C01B32/158</further-classification>  
        <further-classification edition="200601120251211B">H05B6/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊萊奈米公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELECT NANO, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛德爾　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOWDER, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯威尼　布蘭登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWEENEY, BRANDON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈麥茲　亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOMEZ, AARON MORELOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉斯　布倫特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, BRENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿奇　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACHEE, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">針對選擇性加熱結合加工設計的離散碳奈米管的材料之裝置以及方法。磁場產生器，如感應線圈，與框架或其他硬體對齊，以及施加電磁場以加熱由對齊於框架的托盤所支撐的材料目標，從而避免加熱框架或其他硬體，以及減少所需熔化或熔合材料的時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus and method directed to selectively heating a material integrated with engineered discrete carbon nanotubes integrated into the material. A magnetic field generator, such as an induction coil, is aligned with a frame or other hardware and an electromagnetic field is applied to heat material targets supported by a tray aligned with the frame, thus avoiding heating the frame or other hardware and reducing the time required to melt or fuse a material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:磁場</p>  
        <p type="p">18:焊料目標</p>  
        <p type="p">20:離散碳奈米管</p>  
        <p type="p">22:磁場透鏡</p>  
        <p type="p">30:目標位置</p>  
        <p type="p">32:聚焦</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="716" publication-number="202611992"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611992.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611992</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103930</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>間隔件沉積期間的有機心軸之保護用直流疊加(DCS)</chinese-title>  
        <english-title>DIRECT CURRENT SUPERPOSITION (DCS) FOR PROTECTION OF ORGANIC MANDREL DURING SPACER DEPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/033</main-classification>  
        <further-classification edition="200601120251201B">H01L21/20</further-classification>  
        <further-classification edition="200601120251201B">H01L21/76</further-classification>  
        <further-classification edition="200601120251201B">H01L21/311</further-classification>  
        <further-classification edition="200601120251201B">C23C16/503</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>露特克李　凱蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUTKER-LEE, KATIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科爾　克利斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLE, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露關於製造半導體裝置之方法。該方法包含提供一結構，該結構包含以一圖案來形成的有機心軸以及一下層(underlying layer)。該方法包含使該有機心軸硬化，包含沿該有機心軸之外部部分形成矽基層。該方法包含在硬化的該有機心軸上方沉積間隔層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of manufacturing a semiconductor device are disclosed. The method includes providing a structure comprising an organic mandrel formed in a pattern and an underlying layer. The method includes hardening the organic mandrel including forming a silicon-based layer along an outer portion of the organic mandrel. The method includes depositing a spacer layer over the hardened organic mandrel.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="717" publication-number="202611928"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611928.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611928</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及記憶體系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">G11C16/06</main-classification>  
        <further-classification edition="200601120250701B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前嶋洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEJIMA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>児玉択洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KODAMA, TAKUYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>磯部克明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISOBE, KATSUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施方式之記憶體裝置包含複數個串、複數條位元線、複數條字元線、源極線及控制器。複數個串各自包含串聯連接之複數個記憶胞。複數條位元線分別連接於複數個串各自之一端。複數條字元線分別連接於複數個記憶胞。源極線連接於複數個串各自之另一端。控制器於第1讀出序列中，使複數條字元線之電壓以相同之速度上升，基於隨著複數條字元線之電壓上升而經過複數個串之電流量發生變化之時序，來決定複數個讀出電壓各自之修正值，於第2讀出序列中，使用應用了修正值之複數個讀出電壓來執行讀出動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">ST20~ST22:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="718" publication-number="202611934"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611934.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611934</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104326</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G11C16/26</main-classification>  
        <further-classification edition="200601120251103B">G11C16/06</further-classification>  
        <further-classification edition="200601120251103B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNNO, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 將位元線有效率地進行配線。&lt;br/&gt;[解決手段] 於實施方式的半導體記憶裝置，第2位元線，具有：第2單元模組間配線，其和第2記憶體單元進行電連接，從和第2記憶體單元在上下方向重疊的位置朝往感測放大器模組而在第1方向上延伸；以及第2模組內配線，其在接近於第1模組內配線的位置，和第1模組內配線排列於第1方向而延伸於第2方向，將第2單元模組間配線與第2感測放大器單元進行電連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BL:位元線</p>  
        <p type="p">BL0,BL1,BL2,BL3,BL6,BL9,BL12,BL15,BL18,BL21,BL24,BL27,BL30,BL33:位元線</p>  
        <p type="p">CBL:單元模組間配線</p>  
        <p type="p">CP:連接部分</p>  
        <p type="p">D3&amp;lt;0&amp;gt;:配線</p>  
        <p type="p">D3&amp;lt;1&amp;gt;:配線</p>  
        <p type="p">D3&amp;lt;2&amp;gt;:配線</p>  
        <p type="p">DBL&amp;lt;0&amp;gt;,DBL&amp;lt;1&amp;gt;,DBL&amp;lt;2&amp;gt;,DBL&amp;lt;3&amp;gt;:模組內配線</p>  
        <p type="p">DIV&amp;lt;0&amp;gt;,DIV&amp;lt;1&amp;gt;:區域</p>  
        <p type="p">DIVs&amp;lt;00&amp;gt;,DIVs&amp;lt;01&amp;gt;:子區域</p>  
        <p type="p">DIVs&amp;lt;10&amp;gt;,DIVs&amp;lt;11&amp;gt;:子區域</p>  
        <p type="p">GR&amp;lt;0&amp;gt;,GR&amp;lt;1&amp;gt;:群組</p>  
        <p type="p">SA&amp;lt;00&amp;gt;~SA&amp;lt;03&amp;gt;:感測放大器單元</p>  
        <p type="p">SA&amp;lt;10&amp;gt;~SA&amp;lt;13&amp;gt;:感測放大器單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="719" publication-number="202612218"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612218.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612218</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線充電模組</chinese-title>  
        <english-title>WIRELESS POWER CHARGING MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250303B">H02J50/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊政霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHENG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴育駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏錞靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, CHUN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無線充電模組，包括一磁芯、一線圈以及一磁膠帶。前述線圈以及磁膠帶設置於前述磁芯之一表面上並且圍繞前述磁芯之一中心軸。前述磁膠帶的一彎曲段於一水平方向上位在前述線圈的兩個相鄰彎曲部之間，且前述水平方向垂直於前述中心軸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless power charging module is provided, including a magnetic core, a coil, and a magnetic tape. The coil and the magnetic tape are disposed on a surface of the magnetic core and surround a central axis of the magnetic core. A cured segment of the magnetic tape is located between two curved portions of the coils along a horizontal direction that is perpendicular to the central axis of the magnetic core.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:無線充電模組</p>  
        <p type="p">61:磁芯</p>  
        <p type="p">614:凸出部</p>  
        <p type="p">62:線圈</p>  
        <p type="p">621:彎曲部</p>  
        <p type="p">S:表面</p>  
        <p type="p">T:磁膠帶</p>  
        <p type="p">T’:磁性元件</p>  
        <p type="p">T1:彎曲段</p>  
        <p type="p">Z6:中心軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="720" publication-number="202611155"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611155.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611155</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104507</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製備含聚丙烯醚之熱塑性聚氨酯的方法</chinese-title>  
        <english-title>PROCESS FOR PREPARING POLYPROPYLENE ETHER-CONTAINING THERMOPLASTIC POLYURETHANES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G18/08</main-classification>  
        <further-classification edition="200601120251201B">C08G18/28</further-classification>  
        <further-classification edition="200601120251201B">C08G18/32</further-classification>  
        <further-classification edition="200601120251201B">C08G18/48</further-classification>  
        <further-classification edition="200601120251201B">C08G18/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商科思創德意志股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COVESTRO DEUTSCHLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾曼斯　弗朗茨　海因里奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERMANNS, FRANZ-HEINRICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱斯勒　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KESSLER, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種製備含聚丙烯醚的熱塑性聚氨酯之方法，以及透過這些方法獲得或可獲得的含聚丙烯醚的熱塑性聚氨酯。本發明進一步關於這些含聚丙烯醚的熱塑性聚氨酯之用途，以及包含或由這些含聚丙烯醚的熱塑性聚氨酯組成的物件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a process for preparing polypropylene ether-containing thermoplastic polyurethanes and to polypropylene ether-containing thermoplastic polyurethanes obtained or obtainable by these processes. The invention further relates to the use of these polypropylene ether-containing thermoplastic polyurethanes and to articles comprising or consisting of the polypropylene ether-containing thermoplastic polyurethane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="721" publication-number="202611788"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611788.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611788</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104559</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有平行化及內部視覺化能力之整數閘邏輯（ＩＧＬ）人工神經網路</chinese-title>  
        <english-title>INTEGER GATE LOGIC (IGL) ARTIFICIAL NEURAL NETWORK WITH PARALLELIZATION AND INTERNAL VISUALIZATION CAPABILITIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">G06N3/088</main-classification>  
        <further-classification edition="202301120251201B">G06N3/045</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商穆梨格隆公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MLIGLON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴洛西　麥可　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PELOSI, MICHAEL J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示用於訓練具有一輸入層、一輸出層及至少一個中介隱藏層之一人工神經網路之方法及設備。一訓練電路回應於應用於該輸入層之輸入資料而將節點輸入及輸出值及該輸出層處之一損失函數值儲存於一記憶體中。針對一選定節點，識別沿自該選定節點至該輸出層之一單鏈路徑互連之一組下游節點。調整該選定節點之參數值，判定該選定節點之一新的節點輸出值，且藉由在沒有反向傳播之情況下使用鏈隔離最佳化將該新的節點輸出值前饋至該等下游節點之各者來產生該輸出層處之一更新之損失函數值。查找表可用於消除對各節點之更新之數學計算。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method and apparatus for training an artificial neural network having an input layer, an output layer and at least one intervening hidden layer. A training circuit stores, in a memory, node input and output values and a loss function value at the output layer responsive to input data applied to the input layer. For a selected node, a set of downstream nodes interconnected along a single chain path from the selected node to the output layer are identified. The parameter values of the selected node are adjusted, a new node output value for the selected node is determined, and an updated loss function value at the output layer is generated by feeding forward the new node output value to each of the downstream nodes using chain isolation optimization without backpropagation. Look up tables can be used to eliminate mathematical calculations for the updates to each node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:整數閘邏輯(IGL)人工神經網路(ANN)訓練例程</p>  
        <p type="p">302:步驟</p>  
        <p type="p">304:步驟</p>  
        <p type="p">306:步驟</p>  
        <p type="p">308:步驟</p>  
        <p type="p">310:步驟</p>  
        <p type="p">312:步驟</p>  
        <p type="p">314:步驟</p>  
        <p type="p">316:步驟</p>  
        <p type="p">318:步驟</p>  
        <p type="p">320:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="722" publication-number="202612493"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612493.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612493</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104667</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250801B">H10D30/01</main-classification>  
        <further-classification edition="202501120250801B">H10D30/63</further-classification>  
        <further-classification edition="202501120250801B">H10D62/10</further-classification>  
        <further-classification edition="202501120250801B">H10D62/13</further-classification>  
        <further-classification edition="202501120250801B">H10D64/01</further-classification>  
        <further-classification edition="202501120250801B">H10D64/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上谷竜司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIYA, RYUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水戶守輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITOMORI, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阪元圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>株柳翔一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUYANAGI, SHOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>脇坂祐輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKISAKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤希一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田光太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井章輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, SHOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施形態提供一種可降低通道層與下部電極之接觸電阻之半導體裝置及半導體裝置之製造方法。&lt;br/&gt;本發明之實施形態之半導體裝置具備：第1電極；第1絕緣層，其設置於第1電極上；閘極電極，其設置於第1絕緣層上；第2絕緣層，其設置於閘極電極上；第2電極，其設置於第2絕緣層上；通道層，其一端部連接於第1電極，另一端部連接於第2電極；以及閘極絕緣層，其設置於通道層與閘極電極之間；且於通道層中，於第1絕緣層之層厚方向之兩端部之間之第1高度位置，與層厚方向交叉之第1方向之長度自閘極電極側朝向第1電極側不連續地變大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">10,20,40,50:絕緣層</p>  
        <p type="p">11:下部電極</p>  
        <p type="p">12:襯墊層</p>  
        <p type="p">13:接點</p>  
        <p type="p">30:閘極電極</p>  
        <p type="p">51:上部電極</p>  
        <p type="p">52:插頭</p>  
        <p type="p">60:柱</p>  
        <p type="p">61:通道層</p>  
        <p type="p">61a:上部通道層</p>  
        <p type="p">61b:下部通道層</p>  
        <p type="p">62,62n,62x:閘極絕緣層</p>  
        <p type="p">70:位元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="723" publication-number="202612104"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612104.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612104</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104760</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括具有連接相鄰金屬線的金屬跳位結構的互連結構的半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT STRUCTURE WITH METAL JUMP STRUCTURE CONNECTING ADJACENT METAL LINES AND METHOF OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/768</main-classification>  
        <further-classification edition="200601120251210B">H01L21/027</further-classification>  
        <further-classification edition="200601120251210B">H01L21/302</further-classification>  
        <further-classification edition="200601120251210B">H01L21/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔宰銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JAEMYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金尊洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JOHNSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳重錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JOONGSUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　康一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, KANG-ILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體裝置包括：基礎層；在基礎層上沿第一方向延伸的第一金屬線；在基礎層上沿第一方向延伸，並在相同層級與第一金屬線相鄰的第二金屬線；以及在相同層級位於第一金屬線和第二金屬線之間的金屬跳線，其中金屬跳線連接第一金屬線和第二金屬線。亦提供一種製造半導體裝置的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a semiconductor device which includes: a base layer; a 1 &lt;sup&gt;st&lt;/sup&gt;metal line extended in a 1 &lt;sup&gt;st&lt;/sup&gt;direction on the base layer; a 2 &lt;sup&gt;nd&lt;/sup&gt;metal line extended in the 1 &lt;sup&gt;st&lt;/sup&gt;direction, and adjacent to the 1 &lt;sup&gt;st&lt;/sup&gt;metal line at a same level, on the base layer; and a metal jumper, between the 1 &lt;sup&gt;st&lt;/sup&gt;metal line and the 2 &lt;sup&gt;nd&lt;/sup&gt;metal line, at the same level, wherein the metal jumper connects the 1 &lt;sup&gt;st&lt;/sup&gt;metal line and the 2 &lt;sup&gt;nd&lt;/sup&gt;metal line. A method of manufacturing a semiconductor device is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:互連結構</p>  
        <p type="p">100:基礎層</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">M11、M12:M1金屬線/金屬線</p>  
        <p type="p">M13:M1金屬線</p>  
        <p type="p">M21:M2金屬線</p>  
        <p type="p">V11、V12:通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="724" publication-number="202612501"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612501.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612501</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104783</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構製造方法、半導體裝置結構及其形成方法</chinese-title>  
        <english-title>A METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE, A SEMICONDUCTOR DEVICE STRUCTURE AND ITS FORMING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251110B">H10D30/60</main-classification>  
        <further-classification edition="200601120251110B">H01L23/18</further-classification>  
        <further-classification edition="200601120251110B">H01L21/76</further-classification>  
        <further-classification edition="202501120251110B">H10D64/20</further-classification>  
        <further-classification edition="202501120251110B">H10D62/10</further-classification>  
        <further-classification edition="202501120251110B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUAN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃咸誌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSIEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江國誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, KUO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱熙甯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JU, SHI-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的實施例提供形成半導體裝置結構的方法。該方法包含於基板上形成鰭片，其中鰭片包含交錯地堆疊的第一半導體層及第二半導體層。該方法亦包含於鰭片上形成犧牲閘極結構；移除未被犧牲閘極結構覆蓋之鰭片的部分；以犧牲介電材料取代第二半導體層；凹陷犧牲介電材料的邊緣部分，以形成第一半導體層之間的空腔；透過於每個空腔之曝露的表面上，沉積介電襯墊層的順應層，於空腔中形成介電間隔物；於犧牲閘極結構的兩側上形成源/汲極特徵；以及以環繞包覆第一半導體層的閘極結構，取代犧牲閘極結構及犧牲介電材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiments of the present disclosure provide a method for forming a semiconductor device structure. The method includes forming a fin over a substrate, wherein the fin comprises first semiconductor layers and second semiconductor layers alternating stacked. The method also includes forming a sacrificial gate structure over the fin, removing portions of the fin not covered by the sacrificial gate structure, replacing the second semiconductor layers with a sacrificial dielectric material, recessing edge portions of the sacrificial dielectric material to form cavities between the first semiconductor layers, forming a dielectric spacer in the cavities by depositing a conformal layer of a dielectric liner layer on exposed surfaces of each cavity, forming source/drain features on opposite sides of the sacrificial gate structure, and replacing the sacrificial gate structure and the sacrificial dielectric material with a gate structure wrapping around the first semiconductor layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置結構</p>  
        <p type="p">101:基板</p>  
        <p type="p">106:第一半導體層</p>  
        <p type="p">116:井部</p>  
        <p type="p">138:閘極間隔物</p>  
        <p type="p">142b:氣隙</p>  
        <p type="p">144:介電間隔物</p>  
        <p type="p">146:磊晶源/汲極特徵(磊晶S/D特徵、S/D特徵、磊晶特徵)</p>  
        <p type="p">148:平面結構</p>  
        <p type="p">162:CESL</p>  
        <p type="p">164:第一ILD層</p>  
        <p type="p">178:IL</p>  
        <p type="p">180:閘極介電層</p>  
        <p type="p">182:閘極電極層</p>  
        <p type="p">190:替換閘極結構</p>  
        <p type="p">X,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="725" publication-number="202612453"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612453.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612453</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104792</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含漏電防止層的半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE INCLUDING LEAKAGE PREVENTION LAYER AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂增富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, TSENG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體裝置及其製造方法。半導體裝置包含一基底、一位元線和一字元線。該基底包含一主動區。該字元線嵌入該基底內且沿著一第一方向延伸。該位元線係設置於該基底上且沿著與該第一方向不同的一第二方向延伸。該主動區包含具有一第一摻質濃度的一第一半導體層和具有一第二摻質濃度的一第二半導體層，該第二摻質濃度小於該第一摻質濃度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, a bit line, and a word line. The substrate includes an active region. The word line is embedded within the substrate and extends along a first direction. The bit line is disposed over the substrate and extends along a second direction different from the first direction. The active region includes a first semiconductor layer with a first dopant concentration and a second semiconductor layer with a second dopant concentration less than the first dopant concentration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">110:基底</p>  
        <p type="p">110s1:表面</p>  
        <p type="p">112:隔離結構</p>  
        <p type="p">120:主動區</p>  
        <p type="p">121:半導體層</p>  
        <p type="p">122:半導體層</p>  
        <p type="p">122s1:表面</p>  
        <p type="p">122s2:表面</p>  
        <p type="p">130:字元線</p>  
        <p type="p">131:絕緣膜</p>  
        <p type="p">132:導電層</p>  
        <p type="p">133:接面修改結構</p>  
        <p type="p">134:導電層</p>  
        <p type="p">135:蓋層</p>  
        <p type="p">135s1:表面</p>  
        <p type="p">140:位元線</p>  
        <p type="p">142:位元線接觸</p>  
        <p type="p">144:蓋層</p>  
        <p type="p">150:電容接觸</p>  
        <p type="p">152:介電結構</p>  
        <p type="p">160:電容結構</p>  
        <p type="p">D:方向</p>  
        <p type="p">L1:長度</p>  
        <p type="p">L2:長度</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="726" publication-number="202612148"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612148.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612148</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250616B">H01L23/522</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田光雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, MITSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池野大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKENO, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">第一絕緣體及第二絕緣體在第一方向上具有間隔地排列。記憶體柱沿第一方向延伸，並貫通第一絕緣體及第二絕緣體。第三絕緣體遍及第一絕緣體的面上、第二絕緣體的面上、及記憶體柱的面中的第一絕緣體與第二絕緣體之間的第一部分上。多個點結構位於第三絕緣體的面上，分別包含金屬元素或碳元素。第一導電體遍及第三絕緣體的面上及多個點結構的面上。第二導電體位於第一導電體的面上且包含鉬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">23:配線結構</p>  
        <p type="p">32、51:絕緣體</p>  
        <p type="p">44:電荷蓄積膜</p>  
        <p type="p">45:阻擋絕緣體</p>  
        <p type="p">52:點結構</p>  
        <p type="p">53、54:導電體</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="727" publication-number="202611107"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611107.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611107</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104932</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、硬化體、及顯示裝置</chinese-title>  
        <english-title>COMPOSITION, CURED BODY AND DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F20/20</main-classification>  
        <further-classification edition="200601120251201B">C08G59/18</further-classification>  
        <further-classification edition="201401120251201B">C09D11/101</further-classification>  
        <further-classification edition="201401120251201B">C09D11/102</further-classification>  
        <further-classification edition="201401120251201B">C09D11/106</further-classification>  
        <further-classification edition="201401120251201B">C09D11/30</further-classification>  
        <further-classification edition="200601120251201B">G09F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木麻希子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, MAKIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷川　星野貴子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGAWA　HOSHINO, TAKAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種組成物，其含有聚合性化合物(A)、及聚合起始劑(B)，使用動態黏彈性測定裝置以頻率1Hz、測定溫度範圍10℃至200℃、升溫速度2℃/分鐘、拉伸模式測定由前述組成物構成之硬化物時的在80℃之儲存彈性模數E’為0.5GPa以上5.0GPa以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition of the invention contains a polymerizable compound (A) and a polymerization initiator (B), and when a cured product formed from the composition is measured in tensile mode using a dynamic viscoelasticity analyzer at a frequency of 1 Hz, a temperature measurement range of 10°C to 200°C, and a rate of temperature increase of 2°C/minute, the storage modulus E’ at 80°C is at least 0.5 GPa but not more than 5.0 GPa.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="728" publication-number="202610836"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610836.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610836</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104961</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保護膜形成用膜、保護膜形成用複合片、半導體裝置之製造方法及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B27/20</main-classification>  
        <further-classification edition="200601120251201B">B32B27/30</further-classification>  
        <further-classification edition="200601120251201B">C08K3/36</further-classification>  
        <further-classification edition="200601120251201B">H01L21/301</further-classification>  
        <further-classification edition="200601120251201B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>四宮圭亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINOMIYA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口智子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, TOMOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">議題：提供一種保護膜形成用膜，可以在切割刀片之切削，抑制晶圓發生破裂。&lt;br/&gt;解決方式：一種保護膜形成用膜，其為貼附至晶圓的電路面之熱硬化性的保護膜形成用膜，其含有充填材，在將下述試樣(1)~(3)中至少一個剖面於特定的觀察區域進行觀察而獲得之電子顯微鏡圖像中，當前述充填材之間配置正圓時，前述正圓的直徑的最大值為未滿3.0μm。&lt;br/&gt;試樣(1)：未硬化的前述保護膜形成用膜&lt;br/&gt;試樣(2)：將前述保護膜形成用膜在130℃及無加壓下，熱硬化4小時而獲得的保護膜&lt;br/&gt;試樣(3)：將前述保護膜形成用膜在130℃及加壓下，熱硬化4小時而獲得的保護膜</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:保護膜形成用複合片</p>  
        <p type="p">10:基材</p>  
        <p type="p">12:保護膜形成用膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="729" publication-number="202612454"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612454.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612454</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有凹陷導電插塞和凹陷通道層的記憶體元件</chinese-title>  
        <english-title>MEMORY DEVICE HAVING RECESSED CONDUCTIVE PLUG AND RECESSED CHANNEL LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂增富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, TSENG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種記憶體元件，包括一電容器，設置在一半導體基底上；以及一導電插塞，位在該電容器上方。該導電插塞具有一第一個凹陷上表面。該記憶體元件亦包括一通道層，設置在該導電插塞上方。該通道層具有一第二凹陷上表面。該記憶體元件還包括一位元線，設置在該通道層上方；以及一字元線，設置在該導電插塞與該位元線之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a capacitor disposed over a semiconductor substrate, and a conductive plug disposed over the capacitor. The conductive plug has a first recessed top surface. The memory device also includes a channel layer disposed over the conductive plug. The channel layer has a second recessed top surface. The memory device further includes a bit line disposed over the channel layer, and a word line disposed between the conductive plug and the bit line. The channel layer is surrounded by the word line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體元件</p>  
        <p type="p">101:半導體基底</p>  
        <p type="p">103a:電容器</p>  
        <p type="p">103b:電容器</p>  
        <p type="p">105a:導電插塞</p>  
        <p type="p">105b:導電插塞</p>  
        <p type="p">111a:介電部</p>  
        <p type="p">111b:介電部</p>  
        <p type="p">113a:字元線</p>  
        <p type="p">113b:字元線</p>  
        <p type="p">117:介電層</p>  
        <p type="p">131a:閘極介電層</p>  
        <p type="p">131b:閘極介電層</p>  
        <p type="p">133a:通道層</p>  
        <p type="p">133b:通道層</p>  
        <p type="p">145a:位元線</p>  
        <p type="p">145b:位元線</p>  
        <p type="p">147a:下部</p>  
        <p type="p">147b:下部</p>  
        <p type="p">149a:上部</p>  
        <p type="p">149b:上部</p>  
        <p type="p">B1:下表面</p>  
        <p type="p">B2:下表面</p>  
        <p type="p">B3:下表面</p>  
        <p type="p">E1:邊緣</p>  
        <p type="p">E2:邊緣</p>  
        <p type="p">P:部分</p>  
        <p type="p">T1:上表面</p>  
        <p type="p">T2:上表面</p>  
        <p type="p">T3:上表面</p>  
        <p type="p">T4:上表面</p>  
        <p type="p">T5:上表面</p>  
        <p type="p">T6:上表面</p>  
        <p type="p">T7:上表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="730" publication-number="202612110"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612110.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612110</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105020</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置、及其製造方法等</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L23/14</main-classification>  
        <further-classification edition="200601120251210B">H01L23/12</further-classification>  
        <further-classification edition="200601120251210B">C08G8/00</further-classification>  
        <further-classification edition="200601120251210B">C08G73/10</further-classification>  
        <further-classification edition="200601120251210B">C08G73/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水建樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, TAKEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種半導體裝置，其能夠於絕緣層中形成微細之導孔，且能夠確保絕緣層與配線於高溫回焊步驟後之密接性，抑制絕緣不良。&lt;br/&gt;本發明之半導體裝置1具備：複數個半導體晶片2；密封材3，其覆蓋上述半導體晶片2之一部分；及再配線層4，其配置於上述半導體晶片2中之未被上述密封材3覆蓋之面側，且於俯視下面積大於上述半導體晶片2；上述再配線層4包含和上述半導體晶片2電性連接之配線5、及玻璃轉移點為240～320℃之絕緣層6。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">2:半導體晶片</p>  
        <p type="p">2a:端子</p>  
        <p type="p">3:密封材</p>  
        <p type="p">4:再配線層</p>  
        <p type="p">5:配線</p>  
        <p type="p">5a:配線</p>  
        <p type="p">6:絕緣層(層間絕緣膜)</p>  
        <p type="p">7:外部連接端子</p>  
        <p type="p">7a:外部連接端子</p>  
        <p type="p">8:保護層</p>  
        <p type="p">8a:孔</p>  
        <p type="p">9:堆疊通孔構造</p>  
        <p type="p">A:箭頭方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="731" publication-number="202611996"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611996.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611996</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105022</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層基板及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250627B">H01L21/268</main-classification>  
        <further-classification edition="200601120250627B">H01L21/3215</further-classification>  
        <further-classification edition="200601120250627B">H01L21/3213</further-classification>  
        <further-classification edition="200601120250627B">H01L21/302</further-classification>  
        <further-classification edition="200601120250627B">H01L21/763</further-classification>  
        <further-classification edition="200601120250627B">H01L21/322</further-classification>  
        <further-classification edition="202301120250627B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水田吉郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTA, YOSHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秀和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, HIDEKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於抑制當剝離支持基板時對支持基板造成損傷。&lt;br/&gt;實施形態之積層基板係利用雷射光產生熱膨脹之剝離用之積層基板，且具備：半導體基板；第1絕緣層，其配置於半導體基板之上方；及多晶矽層，其相接而配置於第1絕緣層之上，具有與半導體基板之表面垂直之方向之厚度大於第1絕緣層之部分，且摻雜有磷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:半導體基板</p>  
        <p type="p">90:多層構造體</p>  
        <p type="p">91,92:絕緣層</p>  
        <p type="p">93:多晶矽層</p>  
        <p type="p">SS:支持基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="732" publication-number="202611949"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611949.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611949</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105052</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電性或電子引信的電纜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01B3/30</main-classification>  
        <further-classification edition="200601120251204B">H01B7/28</further-classification>  
        <further-classification edition="200601120251204B">H01B19/04</further-classification>  
        <further-classification edition="200601120251204B">F42D1/045</further-classification>  
        <further-classification edition="200601120251204B">F42C11/00</further-classification>  
        <further-classification edition="200601120251204B">F42C19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商戴維比克福德公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVEY BICKFORD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋琳　艾曼紐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUERIN, EMMANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種電性或電子引信的電纜（10），包含至少一個電導體（11、12）。&lt;br/&gt;電纜（10）塗覆有聚酯熱塑性樹脂（13）。&lt;br/&gt;特別用於連接礦山或採石場使用的電子或電性引信的電子或電性模塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電纜</p>  
        <p type="p">11:電導體</p>  
        <p type="p">12:電導體</p>  
        <p type="p">13:聚酯熱塑性樹脂</p>  
        <p type="p">e:中心距</p>  
        <p type="p">H:高度</p>  
        <p type="p">L:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="733" publication-number="202610823"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610823.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610823</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105062</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B15/08</main-classification>  
        <further-classification edition="200601120251201B">B32B5/10</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification>  
        <further-classification edition="200601120251201B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商味之素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJINOMOTO CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉野正紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種積層體的製造方法，其使用含有長絲的密度稀疏之纖維基材的預浸體，可以一邊抑制長絲從預浸體的端部露出，一邊製造該預浸體的平坦性優異之積層體。&lt;br/&gt;解決手段為一種使用二階段層壓機之積層體的製造方法，於第一階段中在減壓環境下按壓的步驟(II)之前的預浸體之最低熔融黏度，與該步驟(II)之後的預浸體之最低熔融黏度，被控制成滿足特定要件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:樹脂薄片</p>  
        <p type="p">11,12:樹脂薄片的MD端面</p>  
        <p type="p">100:支撐體</p>  
        <p type="p">100U:支撐體之表面</p>  
        <p type="p">200:預浸體</p>  
        <p type="p">210:纖維基材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="734" publication-number="202612472"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612472.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612472</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105069</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置及半導體記憶裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251029B">H10B43/20</main-classification>  
        <further-classification edition="202301120251029B">H10B99/00</further-classification>  
        <further-classification edition="202501120251029B">H10D84/80</further-classification>  
        <further-classification edition="202501120251029B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅野陽介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANNO, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠將層積體端部之虛設（dummy）區域縮小的半導體記憶裝置及半導體記憶裝置之製造方法。 　　其中1個實施形態之半導體記憶裝置，係具備有：層積體，係包含有被一層一層地交互作了層積的複數之導電層與複數之第1絕緣層；和複數之細縫，係於與層積體之層積方向相交叉之第1方向以及層積方向上，而在層積體內延伸，並於與第1方向以及層積方向相交叉之第2方向上而將層積體作分割；和複數之柱，係被配置在複數之細縫之間，並於層積體內而在層積方向上延伸，複數之細縫之中之被配置在第2方向上之層積體之最靠端部處的第1細縫之上端部之全體，係藉由第1材料而被作覆蓋，複數之細縫之中之除了第1細縫以外的複數之第2細縫之各者之上端部之一部分，係藉由第1材料而被作覆蓋。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體記憶裝置</p>  
        <p type="p">24:導電層</p>  
        <p type="p">52:絕緣層</p>  
        <p type="p">53:絕緣層</p>  
        <p type="p">54:絕緣層</p>  
        <p type="p">56:絕緣層</p>  
        <p type="p">60:絕緣層</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">BLK:區塊區域</p>  
        <p type="p">BR:架橋部</p>  
        <p type="p">BSL:中間源極線</p>  
        <p type="p">CH:插塞</p>  
        <p type="p">CN:通道層</p>  
        <p type="p">CP:帽層</p>  
        <p type="p">CR:芯層</p>  
        <p type="p">DSLa:下部源極線</p>  
        <p type="p">DSLb:上部源極線</p>  
        <p type="p">LI:板狀部</p>  
        <p type="p">LM:層積體</p>  
        <p type="p">LMa:層積體</p>  
        <p type="p">LMb:層積體</p>  
        <p type="p">ME:記憶體層</p>  
        <p type="p">MR:記憶體區域</p>  
        <p type="p">OL:絕緣層</p>  
        <p type="p">PL:柱</p>  
        <p type="p">SGD0:選擇閘極線</p>  
        <p type="p">SGD1:選擇閘極線</p>  
        <p type="p">SGS0:選擇閘極線</p>  
        <p type="p">SGS1:選擇閘極線</p>  
        <p type="p">SHE:分離層</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">WL:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="735" publication-number="202612479"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612479.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612479</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體晶片及其製造方法</chinese-title>  
        <english-title>INTEGRATED CHIP AND METHOD OF MANUFACTURING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H10B63/00</main-classification>  
        <further-classification edition="202301120251103B">H10N70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江法伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, FA-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>衛怡揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, YI-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李璧伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, BI-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　海光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRINH, HAI-DANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">降低用於RRAM單元的形成電壓的問題用具有至少兩個不同層的電阻切換結構來解決。選擇層的厚度和組成，使得層之間的氧親和能的差異在層中的一個中產生本徵氧空位。增加耐久性的問題通過將摻雜劑金屬添加至較低氧親和能層來解決。摻雜劑金屬具有比較低氧親和能層的塊狀金屬高的氧親和能。較低氧親和能層可以具有摻雜劑金屬設置在不同層級中的層壓結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The problem of reducing the forming voltage for an RRAM cell is solved with a resistive switching structure having at least two distinct layers. Thicknesses and compositions of the layers are selected so that a difference in oxygen affinity between the layers produces intrinsic oxygen vacancies in one of the layers. The problem of increasing endurance is solved by adding a dopant metal to the lower oxygen affinity layer. The dopant metal has a higher oxygen affinity than the bulk metal of the lower oxygen affinity layer. The lower oxygen affinity layer may have a laminate structure in which the dopant metal is disposed in distinct strata.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體晶片</p>  
        <p type="p">102:基板</p>  
        <p type="p">103:電晶體</p>  
        <p type="p">104:電阻隨機存取記憶體(RRAM)單元</p>  
        <p type="p">105:下部通孔</p>  
        <p type="p">106:下部導線</p>  
        <p type="p">108:底部電極</p>  
        <p type="p">110:電阻切換結構</p>  
        <p type="p">112:封蓋結構</p>  
        <p type="p">114:上部金屬層</p>  
        <p type="p">115:區域</p>  
        <p type="p">116:較低氧親和能切換層</p>  
        <p type="p">118:較高氧親和能切換層</p>  
        <p type="p">120:上部導電結構</p>  
        <p type="p">124:介電結構</p>  
        <p type="p">126:厚度</p>  
        <p type="p">128:厚度</p>  
        <p type="p">130:厚度</p>  
        <p type="p">131:厚度</p>  
        <p type="p">134:厚度</p>  
        <p type="p">141:頂部電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="736" publication-number="202610952"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610952.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610952</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105245</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃基板金屬化加速組成物及其製備方法、製程與基板</chinese-title>  
        <english-title>GLASS SUBSTRATE METALLIZATIONACCELERATING COMPOSITION AND PREPARING METHOD THEREOF, PROCESS AND SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C03C17/10</main-classification>  
        <further-classification edition="200601120251103B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG CHEM, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭大哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, DAE CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權五倬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, OH TAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳相旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, SANGUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔雅湳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, A NAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪尙汶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, SANGMOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露旨在提供一種玻璃基板金屬化加速組成物，包括矽烷偶聯劑和鈀黏合劑，其中鈀黏合劑是含金屬離子化合物，其包括能夠與矽烷偶聯劑結合的官能基。僅通過濕式製程就能在具有高縱橫比的玻璃基板上均勻地形成金屬層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is directed to providing a glass substrate metallization-accelerating composition, including a silane coupling agent and a Pd binder, wherein the Pd binder is a metal ion-containing compound comprising a functional group capable of binding with the silane coupling agent. It is possible to form a metal layer uniformly on a glass substrate having a high aspect ratio merely through a wet process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="737" publication-number="202610953"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610953.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610953</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105247</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃基板金屬化及製造玻璃基板製程與金屬化玻璃基板</chinese-title>  
        <english-title>PROCESSES OF GLASS SUBSTRATE METALLIZATION AND MANUFACTURING GLASS SUBSTRATE AND METALLIZED GLASS SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C03C17/10</main-classification>  
        <further-classification edition="200601120251103B">C23C18/16</further-classification>  
        <further-classification edition="200601120251103B">C23C18/18</further-classification>  
        <further-classification edition="200601120251103B">C23C18/40</further-classification>  
        <further-classification edition="200601120251103B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG CHEM, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔雅湳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, A NAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權五倬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, OH TAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳相旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, SANGUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭大哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, DAE CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪尙汶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, SANGMOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露旨在提供一種玻璃基板金屬化製程，其包括使用特定組成物進行的玻璃基板金屬化加速製程，因此僅通過濕式製程即可在具有高縱橫比的玻璃基板上均勻形成金屬層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is directed to providing a glass substrate metallization process which includes a glass substrate metallization-accelerating process using a specific composition, and thus can form a metal layer uniformly on a glass substrate having a high aspect ratio merely through a wet process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="738" publication-number="202612139"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612139.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612139</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105291</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體晶片系統和形成方法</chinese-title>  
        <english-title>SYSTEM ON INTEGRATED CHIPS AND METHODS OF FORMING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250424B">H01L23/488</main-classification>  
        <further-classification edition="200601120250424B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, KUO-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉松峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SUNG-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋大豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, TA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅新鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, SHIN-JIUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置(例如，積體晶片(SoIC)裝置)是透過垂直積體(例如，接合)半導體晶粒而形成的，其中每個半導體晶粒具有前側互連結構並具有背側互連結構。採用正面對正面接合製程來接合積體半導體晶粒，這縮短了積體半導體晶粒之間的通訊路徑的長度。通訊路徑長度的縮短降低了通訊路徑的電阻和訊號傳輸延遲，從而提高了半導體裝置的處理速度並降低功率消耗。另外，半導體晶粒的接合結構周圍的接合膜堆疊可以形成得更薄，從而降低了金屬破裂的風險，因而提高了元件可靠度和生產良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device (e.g., a System on Integrated Chip (SoIC) device) is formed by vertically integrating (e.g., bonding) semiconductor dies, where each of the semiconductor dies has a front-side interconnect structure and has a backside interconnect structure. A front-side to front-side bonding process is used to bond the integrated semiconductor dies, which reduces the lengths of the communication paths between the integrated semiconductor dies. The reduced lengths of the communication paths reduce the electrical resistance and the signal transmission delay of the communication paths, thus improving the processing speed of the semiconductor device and reducing power consumption. In addition, the bonding film stack around the bonding structure of the semiconductor dies can be formed thinner, which reduces the risk of metal cracking, thus improving device reliability and production yield.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101、201:基底</p>  
        <p type="p">103、203:電氣組件</p>  
        <p type="p">105、205:矽通孔</p>  
        <p type="p">107、111、131、207、211、231:介電層</p>  
        <p type="p">108、208:裝置層</p>  
        <p type="p">109、209:接觸插塞</p>  
        <p type="p">112、132:互連結構</p>  
        <p type="p">117、137、217、237:導電圖案</p>  
        <p type="p">133、139、233、239:通孔</p>  
        <p type="p">135、235:導線</p>  
        <p type="p">142:電容器</p>  
        <p type="p">145、245:載體基底</p>  
        <p type="p">150:半導體晶粒</p>  
        <p type="p">151、251:接合膜堆疊</p>  
        <p type="p">153、253:接合焊墊</p>  
        <p type="p">200:晶圓</p>  
        <p type="p">212:前側互連結構</p>  
        <p type="p">232:背側互連結構</p>  
        <p type="p">242:積體MIM電容器</p>  
        <p type="p">300:半導體結構</p>  
        <p type="p">301:間隙填充材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="739" publication-number="202611734"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611734.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611734</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105294</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統</chinese-title>  
        <english-title>MEMORY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251027B">G06F12/0866</main-classification>  
        <further-classification edition="200601120251027B">G11C16/06</further-classification>  
        <further-classification edition="201601120251027B">G06F12/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田公二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩崎清𨺓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASAKI, KIYOTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦雄志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種性能為高之記憶體系統。&lt;br/&gt;複數之記憶體晶片之各者，係包含有複數之第1記憶區域。複數之記憶體晶片之中之複數之第1記憶體晶片，係被與複數之通道之各者作連接。記憶體控制器，係實行對於第2記憶區域之群而將第1資料作儲存之儲存動作，該第2記憶區域，係身為複數之第1記憶體晶片之各者之複數之第1記憶區域之中之1個。在儲存動作中，記憶體控制器，係產生對應於第1資料之同位檢查碼資料。記憶體控制器，係在複數之第1記憶體晶片之各者之第2記憶區域之任一者之中，均儲存身為同位檢查碼資料之一部分之部分同位檢查碼資料。記憶體控制器，係在1個以上的第2記憶體晶片之第2記憶區域中，而儲存部分同位檢查碼資料、與身為第1資料之一部分之部分第1資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">27:物理頁面</p>  
        <p type="p">40:邏輯頁面</p>  
        <p type="p">ch.0~ch.17:通道</p>  
        <p type="p">P0~P3:平面</p>  
        <p type="p">C0~C5:叢集</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="740" publication-number="202612151"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612151.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612151</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接觸結構、包括接觸結構之半導體裝置及半導體裝置之製造方法</chinese-title>  
        <english-title>CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING A CONTACT STRUCTURE, AND METHOD FOR FABRICATING THE SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H01L23/528</main-classification>  
        <further-classification edition="200601120250401B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種接觸結構、一種包含接觸結構的半導體裝置，以及一種半導體裝置的製造方法。該接觸結構包含一本體部，以及自該本體部向下延伸的一延伸部，且該延伸部包括一溝槽。將該溝槽凹陷進入該延伸部的一底面，將該溝槽朝該本體部凹陷，並暴露出該本體部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a contact structure, a semiconductor device including the contact structure, and a method for fabricating the semiconductor device. The contact structure includes a body portion, and an extending portion extending downward from the body portion and comprising a groove. The groove is recessed into a bottom surface of the extending portion, is recessed toward the body portion, and exposes the body portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:半導體裝置</p>  
        <p type="p">101:基底</p>  
        <p type="p">101P:突出部</p>  
        <p type="p">101PT:頂面</p>  
        <p type="p">101TS:頂面</p>  
        <p type="p">103:隔離層</p>  
        <p type="p">105:雜質區</p>  
        <p type="p">111:底介電層</p>  
        <p type="p">113:中間介電層</p>  
        <p type="p">115:頂介電層</p>  
        <p type="p">200:字元線結構</p>  
        <p type="p">301:位元線接觸</p>  
        <p type="p">303:位元線</p>  
        <p type="p">400:接觸結構</p>  
        <p type="p">401:本體部</p>  
        <p type="p">403:延伸部</p>  
        <p type="p">403BS:底面</p>  
        <p type="p">403E:延伸的單元接觸開口</p>  
        <p type="p">403R:溝槽</p>  
        <p type="p">403TS:頂面</p>  
        <p type="p">AA:主動區</p>  
        <p type="p">H1:高度</p>  
        <p type="p">H2:高度</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="741" publication-number="202612577"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612577.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612577</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105323</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含支撐底材粗糙外露部分的異質結構</chinese-title>  
        <english-title>HETEROSTRUCTURE COMPRISING A ROUGH EXPOSED PORTION OF A SUPPORT SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H10N30/073</main-classification>  
        <further-classification edition="202301120251201B">H10N30/50</further-classification>  
        <further-classification edition="202301120251201B">H10N30/80</further-classification>  
        <further-classification edition="202301120251201B">H10N30/086</further-classification>  
        <further-classification edition="200601120251201B">H01L21/265</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商索泰克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOITEC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯克卡特　馬賽爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROEKAART, MARCEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫盧瓦　塞希爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAUROIS, CECILE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查爾阿佛列　塞德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHARLES-ALFRED, CEDRIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳絲倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭建中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種用於製造供絕緣體上壓電(POI)結構用之一異質結構(H)之方法，包括提供一支撐底材，在該支撐底材上面或上方形成一壓電材料塊體，移除該壓電材料塊體之第一周邊部分及該支撐底材之第一周邊部分，以獲得該支撐底材之一外露部分，其粗糙度的均方根高度Sq在0.4 µm至0.8 µm 的範圍內，在移除該壓電材料塊體之第一周邊部分之後，薄化該壓電材料塊體，以獲得一壓電底材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method of method of manufacturing a heterostructure for the manufacture of a Piezoelectric on Insulator, POI, structure, comprising providing a support substrate, forming a block of a piezoelectric material on or over the support substrate, removing a first peripheral portion of the block of a piezoelectric material and a first peripheral portion of the support substrate to obtain an exposed portion of the support substrate with a roughness with a root-mean-square height, Sq, in the range of 0.4 µm to 0.8 µm, thinning the block of a piezoelectric material after removal of the first peripheral portion of the block of a piezoelectric material to obtain a piezoelectric substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:支撐底材</p>  
        <p type="p">10:壓電底材</p>  
        <p type="p">H:異質結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="742" publication-number="202612502"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612502.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612502</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105457</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置結構與其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251110B">H10D30/60</main-classification>  
        <further-classification edition="202501120251110B">H10D62/60</further-classification>  
        <further-classification edition="200601120251110B">H01L21/205</further-classification>  
        <further-classification edition="200601120251110B">H01L21/76</further-classification>  
        <further-classification edition="200601120251110B">H01L21/265</further-classification>  
        <further-classification edition="200601120251110B">H01L21/306</further-classification>  
        <further-classification edition="200601120251110B">H01L21/301</further-classification>  
        <further-classification edition="200601120251110B">C30B25/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范韻如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, YUN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張羅衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, LO-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇煥傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HUAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供半導體裝置結構與其形成方法。結構包括層間介電層；第一半導體材料，與層間介電層相鄰；半導體層，與第一半導體材料相鄰；第二半導體材料，位於半導體層與第一半導體材料之間；第三半導體材料，位於第一半導體材料上。第三半導體材料包覆第一半導體材料的至少兩側。結構更包括矽化物層位於第三半導體材料上，以及導電結構位於矽化物層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device structure and methods of forming the same are described. The structure includes an interlayer dielectric (ILD) layer, a first semiconductor material disposed adjacent the ILD layer, a semiconductor layer disposed adjacent the first semiconductor material, a second semiconductor material disposed between the semiconductor layer and the first semiconductor material, and a third semiconductor material disposed over the first semiconductor material. The third semiconductor material wraps at least two sides of the first semiconductor material. The structure further includes a silicide layer disposed on the third semiconductor material and a conductive feature disposed on the silicide layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置結構</p>  
        <p type="p">118:絕緣材料</p>  
        <p type="p">138:第一間隔物</p>  
        <p type="p">156:第三半導體材料</p>  
        <p type="p">162:接點蝕刻停止層</p>  
        <p type="p">164:層間介電層</p>  
        <p type="p">180,220:導電結構</p>  
        <p type="p">208:介電層</p>  
        <p type="p">210:四半導體材料</p>  
        <p type="p">212:矽化物層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="743" publication-number="202612297"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612297.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612297</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105589</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光模組及光功率的調整方法</chinese-title>  
        <english-title>OPTICAL MODULE AND METHOD OF ADJUSTING OPTICAL POWER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250327B">H04B10/40</main-classification>  
        <further-classification edition="201301120250327B">H04B10/564</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光興國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OPTOMEDIA TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周暉座</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HUI-TSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐培翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PEI HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種調整光功率的方法，包括以下步驟：1. 利用光接收裝置檢測輸入光功率，並利用光發射裝置檢測輸出光功率；2. 判斷輸出光功率是否必須調整；3. 計算偏置電流以及調變電流；以及4. 根據計算出的偏置電流和調變電流，調整輸出光功率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of adjusting an optical power includes: detecting an input optical power by an optical receiving device and detecting an output optical power by an optical transmitting device; determining whether the output optical power must be adjusted; calculating a bias current and a modulation current; and adjusting the output optical power according to the calculated bias current and the modulation current.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">M:方法</p>  
        <p type="p">S201,S202,S203,S204:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="744" publication-number="202612188"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612188.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612188</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105620</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器</chinese-title>  
        <english-title>CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250224B">H01R13/46</main-classification>  
        <further-classification edition="200601120250224B">H01R13/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞立德精密工業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN LEADER PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬佳美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, JIAMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡建設</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, JIANSHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種連接器，包括：連接座，設置有容置腔，連接座具有相對設置的第一端和第二端，連接座的第一端設置有第一止退機構；插接端子，包括端子本體，端子本體靠近連接座的一端設置於連接座的容置腔內，端子本體設置有與第一止退機構連接的第二止退機構。利用第一止退機構對第二止退機構的作用力，可以防止插接端子受力向後端過度移動，從而保證連接器與外部電器連接的穩定性，同時在連接器和電器的運行中，也能夠防止插接端子受到振動影響而脫離連接座，進一步保證連接器的連接穩定性和工作可靠性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is related to a connector. The connector comprises a connect base and a plug-in terminal. The connect base comprises a receiving cavity. The connection base has a first end and a second end arranged oppositely. The first end of the connect base is provided with a first stop mechanism. The plug-in terminal comprises a terminal body. One end of the terminal body closes to the connect base is arranged in the receiving cavity of the connect base. The terminal body comprises a second stop mechanism connected with the first stop mechanism. The force exerted by the first stop mechanism on the second stop mechanism can be used to prevent the plug-in terminal from excessively moving to the rear end due to force. Therefore, ensuring the stability of the connection between the connector and external electrical appliances. Also, during the operation of connectors and electrical appliances, it is prevented that the plug-in terminal from being affected by vibration and detaching from the connection base. The connection stability and working reliability of the connector are guaranteed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:連接座</p>  
        <p type="p">101:第一端</p>  
        <p type="p">102:第二端</p>  
        <p type="p">11:容置腔</p>  
        <p type="p">12:第一止退機構</p>  
        <p type="p">2:插接端子</p>  
        <p type="p">211:金屬針</p>  
        <p type="p">22:第二止退機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="745" publication-number="202611921"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611921.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611921</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105633</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統、記憶體電路及操作記憶體電路的方法</chinese-title>  
        <english-title>SYSTEM, MEMORY CIRCUIT AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G11C11/413</main-classification>  
        <further-classification edition="200601120251103B">G11C7/10</further-classification>  
        <further-classification edition="200601120251103B">G11C7/12</further-classification>  
        <further-classification edition="200601120251103B">G11C8/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中智孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TOMOTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青柳佑海人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAGI, YUMITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藪内誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YABUUCHI, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示記憶體裝置、電路及其操作方法。在一個態樣中，記憶體系統包括記憶體陣列，該記憶體陣列包含位元線。該記憶體系統包括耦合至追蹤位元線的追蹤記憶體單元陣列，該追蹤位元線模仿該記憶體陣列的該位元線的電氣特性。該記憶體系統包括追蹤預充電電路，該追蹤預充電電路用以根據該位元線的充電時間對該追蹤位元線進行預充電，從而為該記憶體陣列的記憶體操作創建足夠間餘裕。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Memory devices, circuits, and a method of operating the same are disclosed. In one aspect, a memory system includes a memory array comprising a bit line. The memory system includes a tracking memory cell array coupled to a tracking bit line that mimics an electrical characteristic of the bit line of the memory array. The memory system includes a tracking pre-charge circuit configured to pre-charge the tracking bit line according to a charge time of the bit line to create sufficient between margin for memory operations of the memory array.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:記憶體單元陣列</p>  
        <p type="p">104:字元線驅動器電路</p>  
        <p type="p">106:追蹤記憶體單元陣列</p>  
        <p type="p">108:記憶體單元</p>  
        <p type="p">110:追蹤記憶體單元</p>  
        <p type="p">112:控制電路</p>  
        <p type="p">113:時鐘產生器電路</p>  
        <p type="p">114:I/O電路</p>  
        <p type="p">116:追蹤(TRK)預充電電路</p>  
        <p type="p">118:重置觸發電路</p>  
        <p type="p">120,122:緩衝器</p>  
        <p type="p">124:預充電電路</p>  
        <p type="p">BL,BLB:位元線</p>  
        <p type="p">BLPREB:位元線預充電訊號</p>  
        <p type="p">CLK:時鐘</p>  
        <p type="p">ICLK:內部時鐘</p>  
        <p type="p">RST:重置訊號</p>  
        <p type="p">TRKBL:追蹤位元線</p>  
        <p type="p">TRKWL:追蹤字元線</p>  
        <p type="p">WL:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="746" publication-number="202610866"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610866.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610866</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105636</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動輪擋控制系統及其控制方法</chinese-title>  
        <english-title>AUTOMATIC WHEEL CHOCK CONTROL SYSTEM AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">B60T3/00</main-classification>  
        <further-classification edition="200601120250328B">B60T7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾特科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELLTONE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉顯光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSIEN-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張貴香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUE-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫金維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, GIN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高光燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, KUANG-TSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">自動輪擋控制系統及其控制方法。自動輪擋控制方法包含：一來車檢測步驟，檢查一車輛是否駛入並停車就位；一輪擋升起步驟，升起該輪擋並鎖定該輪擋；一降低輪擋步驟，收到下降輪擋命令後，下降該輪擋；以及一離開偵測步驟，檢查該車輛是否離開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automatic wheel chock control system and a control method thereof are provided. The control method of automatic wheel chock includes: a vehicle detection step to check whether a vehicle is entering in and parked in position; a wheel chock raising step to raise the wheel chock and lock the wheel chock; a wheel chock lowering step to lower the wheel chock when receive a lowering wheel chock command; and an exit detection step to check whether the vehicle is leaving.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="747" publication-number="202611763"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611763.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611763</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105691</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>跨越分散式系統追蹤個人可識別資訊流</chinese-title>  
        <english-title>TRACKING PERSONALLY IDENTIFIABLE INFORMATION FLOW ACROSS DISTRIBUTED SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251001B">G06F21/60</main-classification>  
        <further-classification edition="201301120251001B">G06F21/55</further-classification>  
        <further-classification edition="201301120251001B">G06F21/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬修斯　布雷特　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATTHES, BRETT ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚勳宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, XUNYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙馬　基蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMA, KIRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁薩　古爾拜　辛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DHINDSA, GURBHEJ SINGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於用於在分散式系統之中追蹤個人可識別資訊(PII)流之方法及系統。該方法包含在一或多個運算裝置處接收包含一標頭及一有效負載之一資料封包。該資料封包由部署於該分散式系統內之一感測器偵測。該感測器監測通過一應用程式設計介面(API)之資料流。基於該標頭中包含之資訊，識別與通過該API之該資料流相關聯之一源及一目的地。若除其他準則被滿足之外，亦在該資料封包之該有效負載內識別出至少一個PII元素，則識別一資料外洩。回應於判定該資料流構成一資料外洩，產生影響該資料流之一信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to methods and systems for tracking personally identifiable information (PII) flow amongst distributed systems. The method includes receiving, at one or more computing devices, a data packet that includes a header and a payload. The data packet is detected by a sensor deployed within the distributed system. The sensor monitors data flow through an application programming interface (API). Based on information included in the header, a source and a destination associated with the data flow through the API are identified. A data breach is identified, if, in addition to other criteria being satisfied, at least one PII element is identified within the payload of the data packet. In response to determining that the data flow constitutes a data breach, a signal is generated which affects the data flow.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">402:步驟</p>  
        <p type="p">404:步驟</p>  
        <p type="p">406:步驟</p>  
        <p type="p">408:步驟</p>  
        <p type="p">410:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="748" publication-number="202610718"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610718.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610718</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105877</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分離膜、脫氣膜模組、脫氣裝置、液體之製造方法及分離膜之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B01D61/00</main-classification>  
        <further-classification edition="200601120251201B">B01D63/02</further-classification>  
        <further-classification edition="200601120251201B">B01D67/00</further-classification>  
        <further-classification edition="200601120251201B">B01D69/00</further-classification>  
        <further-classification edition="200601120251201B">B01D69/08</further-classification>  
        <further-classification edition="200601120251201B">B01D71/26</further-classification>  
        <further-classification edition="200601120251201B">D01F6/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中良樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿久津美句</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKUTSU, MIKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青山滋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAMA, SHIGERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山村剛平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMURA, GOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水野竣介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUNO, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於自液體除去溶解氣體的脫氣方法、或使液體中的溶解氣體與氣相中的氣體成分交換的氣體交換方法中，提供使用聚(4-甲基-1-戊烯)且兼顧高氣體透過性與低漏出性的分離膜。一種分離膜，以聚(4-甲基-1-戊烯)為主成分，其中，所述分離膜整體的空隙率為30%～70%，於所述分離膜的至少其中一個表面側具有功能層，於所述功能層的表面的面內存在配向度為1.5以上且2.5以下的範圍內的配向方向，所述分離膜的功能層的表面的藉由廣角X射線繞射法測定的結晶配向度為0.20以上且0.60以下，所述分離膜的功能層的表面的微晶尺寸為10 nm以上且20 nm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:膜表面</p>  
        <p type="p">2:功能層</p>  
        <p type="p">3:空隙部</p>  
        <p type="p">4:功能層的厚度</p>  
        <p type="p">5:內層</p>  
        <p type="p">6:功能層的虛擬變動曲線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="749" publication-number="202612149"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612149.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612149</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有電晶體及電阻的半導體元件結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE WITH TRANSISTOR AND RESISTOR AND METHOD FOR PREPARING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H01L23/522</main-classification>  
        <further-classification edition="200601120250303B">H01L23/535</further-classification>  
        <further-classification edition="200601120250303B">H01L23/538</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請揭露一種半導體元件結構及其製造方法。此半導體元件結構包括：一基板；一電晶體及一電阻，設置在該基板中；複數個隔離結構，設置在該基板中；一介電層，設置在該基板之上；以及一互連結構，設置在該電晶體及該電阻之上並且電性連接到該電晶體及該電阻。該電晶體設置在該複數個隔離結構的其中一對之間，且該電阻設置在該複數個隔離結構的另一對之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a semiconductor device structure and a method for fabricating the semiconductor device structure. The semiconductor device structure comprises a substrate; a transistor and a resistor disposed in the substrate; a plurality of isolation structures disposed in the substrate; a dielectric layer disposed over the substrate; and an interconnect structure disposed over and electrically connected to the transistor and the resistor. The transistor is disposed between a pair of the isolation structures, and the resistor is disposed between another pair of the isolation structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電晶體</p>  
        <p type="p">101:半導體基板</p>  
        <p type="p">101T:頂表面</p>  
        <p type="p">103:井區</p>  
        <p type="p">105a:隔離結構</p>  
        <p type="p">105b:隔離結構</p>  
        <p type="p">105c:隔離結構</p>  
        <p type="p">113':介電層</p>  
        <p type="p">115a:閘極電極</p>  
        <p type="p">115b:電阻電極</p>  
        <p type="p">121a:源極/汲極區</p>  
        <p type="p">121b:源極/汲極區</p>  
        <p type="p">123':層間介電層</p>  
        <p type="p">123'T:頂表面</p>  
        <p type="p">131a:阻障層</p>  
        <p type="p">131b:阻障層</p>  
        <p type="p">133a:導電通孔</p>  
        <p type="p">133aS:側壁</p>  
        <p type="p">133aB:底表面</p>  
        <p type="p">133b:導電通孔</p>  
        <p type="p">133c:導電通孔</p>  
        <p type="p">133d:導電通孔</p>  
        <p type="p">134a:導電接觸</p>  
        <p type="p">134b:導電接觸</p>  
        <p type="p">135a:導電層</p>  
        <p type="p">135b:導電層</p>  
        <p type="p">135c:導電層</p>  
        <p type="p">137:互連結構</p>  
        <p type="p">200:電阻</p>  
        <p type="p">300a:半導體元件結構</p>  
        <p type="p">1131:第一部分</p>  
        <p type="p">1133:第二部分</p>  
        <p type="p">AA:主動區</p>  
        <p type="p">BB:主動區</p>  
        <p type="p">T1:第一厚度</p>  
        <p type="p">T2:第二厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="750" publication-number="202612514"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612514.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612514</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106011</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有空氣間隔物的半導體元件及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE WITH AIR SPACERS AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250618B">H10D62/10</main-classification>  
        <further-classification edition="202501120250618B">H10D62/60</further-classification>  
        <further-classification edition="202501120250618B">H10D62/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇國輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, KUO-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案揭露一種半導體元件及其製造方法。此半導體元件包括：一基板；一閘極結構，位於該基板上；複數個內部間隔層，位於該閘極結構的側壁上；複數個外部間隔層，位於該複數個內部間隔層上；複數個氣隙，位於該複數個內部間隔層與該複數個外部間隔層之間；一底部介電層，位於該基板上並且橫向地圍繞該複數個外部間隔層；一底部蓋層，位於該底部介電層、該複數個內部間隔層、該複數個氣隙、該複數個外部間隔層及該閘極結構上；一導電層，位於該底部蓋層上且包含複數個導線；一頂部蓋層，位於該導電層上；以及複數個空氣間隔物，位於該複數個導線之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a gate structure on the substrate; a plurality of inner spacer layers on sidewalls of the gate structure; a plurality of outer spacer layers on the plurality of inner spacer layers; a plurality of air gaps between the inner spacer layers and the outer spacer layers; a bottom dielectric layer on the substrate and laterally surrounding the outer spacer layers; a bottom capping layer on the bottom dielectric layer, the inner spacer layers, the air gaps, the outer spacer layers, and the gate structure; a conductive layer on the bottom capping layer and including a plurality of conductive wires; a top capping layer positioned on the conductive layer; and a plurality of air spacers positioned between the conductive wires.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:半導體元件</p>  
        <p type="p">102:基板</p>  
        <p type="p">104:底部介電層</p>  
        <p type="p">108a:導電部件</p>  
        <p type="p">108b:導電部件</p>  
        <p type="p">120:第一絕緣層</p>  
        <p type="p">122:介電層</p>  
        <p type="p">124:第二絕緣層</p>  
        <p type="p">131:隔離層</p>  
        <p type="p">132:空氣間隔物</p>  
        <p type="p">200:閘極結構</p>  
        <p type="p">201:閘極介電層</p>  
        <p type="p">203:閘極底部導電層</p>  
        <p type="p">205:閘極頂部導電層</p>  
        <p type="p">207:閘極蓋層</p>  
        <p type="p">301:雜質區</p>  
        <p type="p">401:內部間隔層</p>  
        <p type="p">405:外部間隔層</p>  
        <p type="p">605:底部蓋層</p>  
        <p type="p">607:頂部蓋層</p>  
        <p type="p">1061:導線</p>  
        <p type="p">1061a:導線</p>  
        <p type="p">1061b:導線</p>  
        <p type="p">AA:主動區</p>  
        <p type="p">AG:氣隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="751" publication-number="202612467"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612467.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612467</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106237</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有凹陷之閘極的半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE WITH RECESSED GATE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250305B">H10B41/30</main-classification>  
        <further-classification edition="202301120250305B">H10B43/30</further-classification>  
        <further-classification edition="202501120250305B">H10D64/00</further-classification>  
        <further-classification edition="202501120250305B">H10D64/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供半導體裝置及其製造方法。半導體裝置包含基底，包含第一周邊區和第二周邊區；複數個凹陷之閘極，分別包含位於第一周邊區內且包含U形剖面輪廓的凹陷之閘極介電層，位於凹陷之閘極介電層上且包含谷形剖面輪廓從而形成第一谷的凹陷之閘極底導電層，順應性位於凹陷之閘極底導電層的第一谷上的凹陷之閘極頂導電層，以及位於凹陷之閘極頂導電層上的凹陷之閘極蓋層；以及位於第二周邊區上的周邊閘極結構。在複數個凹陷之閘極的每一者內設置的絕緣部分，以及環繞絕緣部份的空隙。第一周邊區的元件密度大於第二周邊區的元件密度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate including a first peripheral region and a second peripheral region; a plurality of recessed gates respectively including a recessed gate dielectric layer positioned in the first peripheral region and including a U-shaped cross-sectional profile, a recessed gate bottom conductive layer positioned on the recessed gate dielectric layer and including a valley-shaped cross-sectional profile, resulting in a first valley, a recessed gate top conductive layer conformally positioned on the first valley of the recessed gate bottom conductive layer, and a recessed gate capping layer positioned on the recessed gate top conductive layer; and a peripheral gate structure positioned on the second peripheral region. An insulative piece is disposed in the each of the plurality of recessed gates, and a void surrounds the insulative piece. An element density of the first peripheral region is greater than an element density of the second peripheral region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101TS:頂面</p>  
        <p type="p">152:絕緣部分</p>  
        <p type="p">170:空隙</p>  
        <p type="p">300:周邊閘極結構</p>  
        <p type="p">301:閘極介電層</p>  
        <p type="p">303:閘極底導電層</p>  
        <p type="p">305:閘極頂導電層</p>  
        <p type="p">307:閘極蓋層</p>  
        <p type="p">400:凹陷之閘極</p>  
        <p type="p">401:凹陷之閘極介電層</p>  
        <p type="p">403:凹陷之閘極底導電層</p>  
        <p type="p">403BP:底部部分</p>  
        <p type="p">403TS:頂面</p>  
        <p type="p">405:凹陷之閘極頂導電層</p>  
        <p type="p">405BS:底面</p>  
        <p type="p">405TS:頂面</p>  
        <p type="p">407:凹陷之閘極蓋層</p>  
        <p type="p">407BS:底部部分</p>  
        <p type="p">727:閘極遮罩層</p>  
        <p type="p">GR:閘極凹陷</p>  
        <p type="p">PR1:第一周邊區</p>  
        <p type="p">PR2:第二周邊區</p>  
        <p type="p">VL1:垂直高度</p>  
        <p type="p">VL2:垂直高度</p>  
        <p type="p">VL3:垂直高度</p>  
        <p type="p">VL4:垂直高度</p>  
        <p type="p">VY1:第一谷</p>  
        <p type="p">VY2:第二谷</p>  
        <p type="p">W2:寬度</p>  
        <p type="p">W3:寬度</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="752" publication-number="202611920"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611920.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611920</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106291</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G11C11/4091</main-classification>  
        <further-classification edition="200601120250801B">G11C7/06</further-classification>  
        <further-classification edition="200601120250801B">G11C7/12</further-classification>  
        <further-classification edition="200601120250801B">G11C16/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲場恒夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INABA, TSUNEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎隆行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠簡化佈線，且減少消耗電力之半導體記憶裝置。本實施方式之半導體記憶裝置具備：用於資料之寫入之複數個第1資料線及複數個第1控制線；用於資料之讀取之複數個第2資料線及複數個第2控制線；以及複數個記憶胞。第1驅動線相對於複數個第1控制線及複數個第2控制線共通地設置，傳輸進行資料之寫入之選擇電壓。複數個第4電晶體連接於複數個第1控制線與第1驅動線之間。複數個第5電晶體連接於複數個第2控制線與第1驅動線之間。複數個第3控制線分別與複數個第4電晶體之閘極連接。複數個第4控制線分別與複數個第5電晶體之閘極連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">bWMWL&amp;lt;0&amp;gt;,bWMWL&amp;lt;1&amp;gt;,bWMWL&amp;lt;2&amp;gt;,bWMWL&amp;lt;3&amp;gt;:非選擇主字元線</p>  
        <p type="p">MC:記憶胞</p>  
        <p type="p">MCsel:選擇記憶胞</p>  
        <p type="p">RBL:讀取位元線</p>  
        <p type="p">RGBL:讀取全局位元線</p>  
        <p type="p">RMWL:讀取主字元線</p>  
        <p type="p">RSEL&amp;lt;0&amp;gt;,RSEL&amp;lt;1&amp;gt;,RSEL&amp;lt;2&amp;gt;,RSEL&amp;lt;3&amp;gt;:讀取選擇線</p>  
        <p type="p">RWL:讀取字元線</p>  
        <p type="p">VUW:非寫入電壓線</p>  
        <p type="p">WBL:寫入位元線</p>  
        <p type="p">WDRV&amp;lt;0&amp;gt;,WDRV&amp;lt;1&amp;gt;,WDRV&amp;lt;2&amp;gt;,WDRV&amp;lt;3&amp;gt;:驅動線</p>  
        <p type="p">WGBL:寫入全局位元線</p>  
        <p type="p">WMWL&amp;lt;0&amp;gt;,WMWL&amp;lt;1&amp;gt;,WMWL&amp;lt;2&amp;gt;,WMWL&amp;lt;3&amp;gt;:寫入主字元線</p>  
        <p type="p">WSEL&amp;lt;0&amp;gt;,WSEL&amp;lt;1&amp;gt;,WSEL&amp;lt;2&amp;gt;,WSEL&amp;lt;3&amp;gt;:寫入選擇線</p>  
        <p type="p">WT1,RT1,WT2,WTbl,RTbl:電晶體</p>  
        <p type="p">WWL:寫入字元線</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="753" publication-number="202611918"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611918.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611918</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106324</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250915B">G11C11/407</main-classification>  
        <further-classification edition="200601120250915B">G11C7/06</further-classification>  
        <further-classification edition="200601120250915B">G11C7/10</further-classification>  
        <further-classification edition="200601120250915B">G11C7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高島大三郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKASHIMA, DAISABURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本實施形態之複數個記憶胞係與複數條字元線及複數條位元線之交叉位置對應，使用氧化物半導體構成。字元線控制電路使依照第1位址選擇之第1字元線之電壓變化而使之活化或非活化。感測放大器電路檢測並鎖存連接於第1字元線之複數個第1記憶胞之資料。讀出電路依照複數個第2位址將鎖存至感測放大器電路之資料連續讀出至外部。於讀出動作中，於第1字元線活化後，感測放大器電路將複數個第1記憶胞之資料鎖存。於讀出電路結束依照複數個第2位址自感測放大器連續讀出複數個第1記憶胞之資料之連續讀出動作之前，字元線控制電路使第1字元線非活化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BL1~BLn:位元線</p>  
        <p type="p">CA:指令位址</p>  
        <p type="p">CLK:時脈信號</p>  
        <p type="p">DQ:資料</p>  
        <p type="p">t1~t13:期間</p>  
        <p type="p">WL1:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="754" publication-number="202612521"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612521.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612521</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106338</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成半導體裝置的方法</chinese-title>  
        <english-title>METHOD OF FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250801B">H10D64/01</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高琬貽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, WAN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUNYAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃泰鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TAI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李資良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TZE-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括形成在基板之上突出的第一鰭片結構及第二鰭片結構，在各第一鰭片結構及第二鰭片結構之相對側上形成淺溝槽隔離區，在淺溝槽隔離區以及第一鰭片結構及第二鰭片結構之頂表面上方、以及第一鰭片結構及第二鰭片結構之側壁上沉積硬遮罩層，在硬遮罩上方沉積帽層，執行第一蝕刻製程以移除帽層之第一部分並曝露硬遮罩之第一部分，執行第二蝕刻製程以移除硬遮罩之經曝露的第一部分，及在第一鰭片結構、第二鰭片結構、及硬遮罩層之剩餘部分上方形成虛設閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a first fin structure and a second fin structure that protrude above a substrate, forming shallow trench isolation (STI) regions on opposing sides of each the first fin structure and the second fin structure, depositing a hard mask layer over the STI regions and top surfaces of the first fin structure and the second fin structure, and on sidewalls of the first fin structure and the second fin structure, depositing a capping layer over the hard mask layer, performing a first etching process to remove first portions of the capping layer and expose first portions of the hard mask layer, performing a second etching process to remove the exposed first portions of the hard mask layer, and forming a dummy gate structure over the first fin structure, the second fin structure, and remaining portions of the hard mask layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">52:第一半導體材料</p>  
        <p type="p">54:第二半導體材料</p>  
        <p type="p">61:介電襯裡</p>  
        <p type="p">73:硬遮罩層</p>  
        <p type="p">90A,90B:鰭片</p>  
        <p type="p">91:鰭片結構</p>  
        <p type="p">96:STI區</p>  
        <p type="p">97:虛設閘極介電質</p>  
        <p type="p">100:NSFET裝置</p>  
        <p type="p">102:虛設閘極</p>  
        <p type="p">104A:第一遮罩層</p>  
        <p type="p">104B:第二遮罩層</p>  
        <p type="p">108:閘極間隔層/閘極間隔物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="755" publication-number="202611517"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611517.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611517</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探針模組、測試系統與測試方法</chinese-title>  
        <english-title>PROBE MODULE, TEST SYSTEM AND TEST METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G01R1/067</main-classification>  
        <further-classification edition="200601120250401B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺矽科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MPI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝明翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種測試系統以及適用該系統的測試方法。測試系統包括測試儀器及探針模組。探針模組包括殼體結構、同軸接頭、板體結構、第一伸縮式探針及第二伸縮式探針。板體結構包括設置在殼體結構內的安裝部以及裸露在殼體結構外的外露部。第一伸縮式探針包括第一探針承載部及第一探針活動部，第一探針承載部設置在外露部且電性連接於板體結構的第一線路。第二伸縮式探針包括第二探針承載部以及第二探針活動部，第二探針承載部設置在外露部且電性連接於板體結構的第二線路。板體結構的外露部的長寬比大於5倍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A test system and a test method that is suitable for the test system are provided. The test system includes a test instrument and a probe module. The probe module includes a housing structure, a coaxial connector, a board structure, a first telescopic probe and a second telescopic probe. The board structure includes a mounting portion that is disposed inside the housing structure and an exposed portion that is exposed outside the housing structure. The first telescopic probe includes a first probe carrying portion and a first probe movable portion. The first probe carrying portion is disposed on the exposed portion and is electrically connected to a first circuit of the board structure. The second telescopic probe includes a second probe carrying portion and a second probe movable portion. The second probe carrying portion is disposed on the exposed portion and is electrically connected to a second circuit of the board structure. An aspect ratio of the exposed portion of the board structure is greater than 5.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">M:探針模組</p>  
        <p type="p">1:殼體結構</p>  
        <p type="p">13:基部</p>  
        <p type="p">2:同軸接頭</p>  
        <p type="p">32:外露部</p>  
        <p type="p">4:第一伸縮式探針</p>  
        <p type="p">5:第一線路</p>  
        <p type="p">6:第二伸縮式探針</p>  
        <p type="p">7:第二線路</p>  
        <p type="p">8:防翹曲部件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="756" publication-number="202612048"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612048.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612048</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106434</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251106B">H01L21/67</main-classification>  
        <further-classification edition="200601120251106B">H01L21/762</further-classification>  
        <further-classification edition="200601120251106B">H01L23/52</further-classification>  
        <further-classification edition="200601120251106B">H01L23/48</further-classification>  
        <further-classification edition="200601120251106B">B08B3/04</further-classification>  
        <further-classification edition="200601120251106B">B08B11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周志勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHIH-SHIUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙翊翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, YI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林侃儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KAN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張阡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴誼寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, YI-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博惟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, BO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊閔媜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, MINZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐巧芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIAO-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡　瑞宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, HARRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種半導體裝置及其形成方法。在半導體裝置的接觸結構上形成半導體裝置的導電結構之前，執行使用金屬前體的預清潔操作以從接觸結構的頂表面去除金屬氧化物層。針對預清潔操作使用金屬前體作為預清潔劑使得能夠完全去除原生氧化物（而不僅是諸如氧之類的組成成分），而不導致在接觸結構的頂表面中形成孔隙，使得能夠在接觸結構和導電結構之間實現低接觸電阻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pre-cleaning operation, using a metal-precursor, is performed to remove a metal-oxide layer from a top surface of a contact structure of a semiconductor device prior to forming a conductive structure of the semiconductor device on the contact structure. The use of the metal precursor as a pre-cleaning agent for the pre-cleaning operation enables native oxides to be fully removed (not just constituent parts such as oxygen) without causing the formation of pores in the top surface of the contact structure, which enables a low contact resistance to be achieved between the contact structure and the conductive structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">102:裝置層</p>  
        <p type="p">104:互連層</p>  
        <p type="p">106:基板層</p>  
        <p type="p">108:電介質層</p>  
        <p type="p">110:積體電路裝置</p>  
        <p type="p">112:源極/汲極區域</p>  
        <p type="p">114:閘極電介質層</p>  
        <p type="p">116:閘極結構</p>  
        <p type="p">118:通道層</p>  
        <p type="p">120a:側壁間隔件</p>  
        <p type="p">120b:內部間隔件</p>  
        <p type="p">122:源極/汲極接觸結構</p>  
        <p type="p">124:襯墊層</p>  
        <p type="p">126:ILD層</p>  
        <p type="p">128:ESL</p>  
        <p type="p">130:金屬化結構</p>  
        <p type="p">132:互連結構</p>  
        <p type="p">134:源極/汲極互連結構</p>  
        <p type="p">136:閘極互連結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="757" publication-number="202611165"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611165.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611165</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106445</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、黏接性薄膜、疊層體、印刷配線板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G63/127</main-classification>  
        <further-classification edition="200601120251201B">C08G63/181</further-classification>  
        <further-classification edition="200601120251201B">C09J11/06</further-classification>  
        <further-classification edition="200601120251201B">C09J167/00</further-classification>  
        <further-classification edition="201801120251201B">C09J7/30</further-classification>  
        <further-classification edition="200601120251201B">B32B27/18</further-classification>  
        <further-classification edition="200601120251201B">B32B27/36</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡ＭＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO MC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤未桜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, MIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>内山翔子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCHIYAMA, SHOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北原飛鳥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAHARA, ASUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本晃一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供具耐熱性且對配線基板之凹凸的填埋性良好而且具有阻燃性的樹脂組成物。本發明還提供含有上述樹脂組成物的黏接性薄膜、包含該黏接性薄膜和基材的疊層體以及包含該疊層體的印刷配線板。一種樹脂組成物，含有：交聯聚酯樹脂(C)，其具有以環氧系交聯劑(B)使側鏈具有羧基之聚酯樹脂(A)之側鏈羧基交聯後得到之結構，該環氧系交聯劑(B)含有分子內具有2個環氧基且不具有3級胺基的環氧化合物(b1)和分子內具有2個以上之環氧基及1個以上之3級胺基的環氧胺化合物(b2)；酯交換觸媒(D)；以及阻燃劑(E)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="758" publication-number="202611277"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611277.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611277</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106502</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理液、半導體基板的處理方法及半導體的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C11D7/06</main-classification>  
        <further-classification edition="200601120251201B">C11D7/08</further-classification>  
        <further-classification edition="200601120251201B">C11D7/10</further-classification>  
        <further-classification edition="200601120251201B">C11D7/32</further-classification>  
        <further-classification edition="200601120251201B">C11D7/34</further-classification>  
        <further-classification edition="200601120251201B">C11D7/50</further-classification>  
        <further-classification edition="200601120251201B">C11D17/00</further-classification>  
        <further-classification edition="200601120251201B">H01L21/02</further-classification>  
        <further-classification edition="200601120251201B">H01L21/311</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関健司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKI, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供可有效率地去除鈦系殘渣且防腐蝕性優異之處理液、以及使用其之半導體基板的洗淨方法及半導體的製造方法。&lt;br/&gt;本發明之解決手段為提供含有(A)可釋出氟化物離子之化合物、(B)選自由鹼金屬離子、鹼土類金屬離子及週期表第III族元素離子所成群組中之至少1種離子與(C)有機溶劑之處理液、以及使用其之半導體基板的處理方法、及半導體的製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">20:金屬配線層</p>  
        <p type="p">30:蝕刻停止層</p>  
        <p type="p">40:層間絕緣膜</p>  
        <p type="p">50:硬遮罩層(HM層)</p>  
        <p type="p">60:乾蝕刻殘渣</p>  
        <p type="p">100:半導體元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="759" publication-number="202610938"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610938.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610938</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成石墨烯層的方法及使用其製造電裝置的方法</chinese-title>  
        <english-title>METHOD OF FORMING GRAPHENE LAYER AND METHOD OF MANUFACTURING ELECTRICAL DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">C01B32/186</main-classification>  
        <further-classification edition="200601120251201B">C23C16/455</further-classification>  
        <further-classification edition="200601120251201B">C23C16/50</further-classification>  
        <further-classification edition="200601120251201B">C23C16/32</further-classification>  
        <further-classification edition="202501120251201B">H10F10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商周星工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元京勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WON, GYEONG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃喆周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, CHUL-JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種形成石墨烯層的方法，其中所述方法包含將烴氣體噴射至基板上並形成第一電漿的步驟，及在基板上形成第二電漿的步驟，其中在未供應氫氣的情況下執行噴射烴氣體並形成第一電漿的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method of forming a graphene layer, wherein the method comprises a step of injecting a hydrocarbon gas onto a substrate and forming a first plasma; and a step of forming a second plasma on the substrate, wherein the step of injecting the hydrocarbon gas and forming the first plasma is performed without supplying a hydrogen gas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10:製程</p>  
        <p type="p">S20:製程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="760" publication-number="202611524"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611524.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611524</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106520</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由氣流之測試互連件溫度控制</chinese-title>  
        <english-title>TEST INTERCONNECT TEMPERATURE CONTROL WITH GAS FLOW</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01R1/44</main-classification>  
        <further-classification edition="200601120251201B">G05D7/06</further-classification>  
        <further-classification edition="202001120251201B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾賽股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESSAI, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈士丁斯　詹姆斯　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASTINGS, JAMES RAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷賈納森　卡爾席克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANGANATHAN, KARTHIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科思　喬伊　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOETH, JOE E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾瓦里奧卡斯提歐　伊森　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALVARIO CASTILLO, ETHAN JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">各種具體實施例包括測試系統中用於控制測試插座之溫度的技術。一溫度控制器判定與裝在該測試插座中之一參考受測裝置(DUT)關聯的一輸入溫度。該溫度控制器基於該輸入溫度來判定一氣體的一流速。該溫度控制器調整一流量控制閥以便使該氣體以該流速供應至該參考DUT。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments include techniques for controlling temperature of a test socket in a test system. A temperature controller determines an input temperature associated with a reference device under test (DUT) mounted in the test socket. The temperature controller determines a flow rate of a gas based on the input temperature. The temperature controller adjusts a flow control valve to supply the gas to the reference DUT at the flow rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:測試系統</p>  
        <p type="p">210:測試插座</p>  
        <p type="p">215:測試夾具</p>  
        <p type="p">220:溫度控制器</p>  
        <p type="p">225:流量控制閥</p>  
        <p type="p">230:氣體調節模組</p>  
        <p type="p">240:溫度訊號</p>  
        <p type="p">245:輔助溫度訊號</p>  
        <p type="p">250:入口</p>  
        <p type="p">255:吹掃氣體</p>  
        <p type="p">260:閥控制訊號</p>  
        <p type="p">265:壓縮氣體</p>  
        <p type="p">270:氣體</p>  
        <p type="p">275:主電源輸入</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="761" publication-number="202612155"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612155.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612155</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106554</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括多個實體介面的訊號傳輸系統</chinese-title>  
        <english-title>SIGNAL TRANSMISSION SYSTEM INCLUDING MULTIPLE PHYSICAL INTERFACES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250807B">H01L23/538</main-classification>  
        <further-classification edition="200601120250807B">G06F13/38</further-classification>  
        <further-classification edition="200601120250807B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋淸基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, CHOUNG KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種訊號傳輸系統包括透過矽穿孔（TSV）被垂直堆疊的基礎晶片和記憶體晶片。基礎晶片包括電連接到TSV的TSV介面電路。基礎晶片透過TSV介面電路輸出控制記憶體晶片的操作的命令和資料。TSV設置在記憶體晶片的邊緣區域中。TSV介面電路設置在基礎晶片的邊緣區域中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A signal transmission system includes a base chip and a memory chip that are vertically stacked through a through silicon via (TSV). The base chip includes a TSV interface circuit that is electrically connected to the TSV. The base chip outputs a command and data that control an operation of the memory chip through the TSV interface circuit. The TSV is disposed in an edge area of the memory chip. The TSV interface circuit is disposed in an edge area of the base chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:訊號傳輸系統</p>  
        <p type="p">100:系統晶片</p>  
        <p type="p">111:處理器(PRC)</p>  
        <p type="p">113:系統控制器(SOC MC)</p>  
        <p type="p">115:系統介面電路(SOC PHY)</p>  
        <p type="p">200:基礎晶片</p>  
        <p type="p">211:記憶體介面電路(D2D PHY)</p>  
        <p type="p">213:記憶體控制器(MC)</p>  
        <p type="p">215:TSV介面電路(TSV PHY)</p>  
        <p type="p">300:記憶體晶片</p>  
        <p type="p">CMD:命令</p>  
        <p type="p">DATA:資料</p>  
        <p type="p">ECA:外部命令</p>  
        <p type="p">ED:外部資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="762" publication-number="202612107"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612107.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612107</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106684</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層基板及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01L21/78</main-classification>  
        <further-classification edition="200601120250902B">H01L23/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水田吉郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTA, YOSHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於抑制剝離支持基板時對於支持基板之損傷。&lt;br/&gt;本發明之實施方式之積層基板係使用利用雷射光之熱膨脹之剝離用積層基板，且該積層基板具備：半導體基板；第1絕緣層，其配置於半導體基板之上方；第1多晶矽層，其相接於第1絕緣層之上而配置，且摻雜磷；及第2多晶矽層，其於第1絕緣層中延伸，將第1多晶矽層與半導體基板直接連接，且摻雜磷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:半導體基板</p>  
        <p type="p">90:多層結構體</p>  
        <p type="p">91,92:絕緣層</p>  
        <p type="p">91r,92r:凹部</p>  
        <p type="p">93:多晶矽層</p>  
        <p type="p">931:突起部</p>  
        <p type="p">SS:支持基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="763" publication-number="202612000"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612000.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612000</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106717</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251023B">H01L21/302</main-classification>  
        <further-classification edition="202501120251023B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野晃人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, AKITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田沼将一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANUMA, MASAKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松葉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUBA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虎谷健一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORATANI, KENICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中田壮哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATA, MASAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">依一實施方式時，半導體裝置之製造方法，包含：準備一第1液體，其中該第1液體，為包含為金屬元素或矽的第1元素，以及包含為金屬元素或矽且和前述第1元素不同的既定的元素者。前述方法進一步包含：從前述第1液體，生成包含前述第1元素及前述既定的元素的第1氣體。前述方法進一步包含：使用前述第1氣體，在基板上，形成包含前述第1元素及前述既定的元素的第1膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:膜</p>  
        <p type="p">11:腔室</p>  
        <p type="p">12:載台</p>  
        <p type="p">13:軸</p>  
        <p type="p">14:加熱器</p>  
        <p type="p">15:氣體供應部</p>  
        <p type="p">16:氣體流路</p>  
        <p type="p">17:噴灑頭</p>  
        <p type="p">18:控制部</p>  
        <p type="p">21:槽</p>  
        <p type="p">22:槽</p>  
        <p type="p">23:槽</p>  
        <p type="p">24:氣源</p>  
        <p type="p">31:加熱器</p>  
        <p type="p">32:加熱器</p>  
        <p type="p">33:加熱器</p>  
        <p type="p">41:MFC</p>  
        <p type="p">42:MFC</p>  
        <p type="p">43:MFC</p>  
        <p type="p">44:MFC</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="764" publication-number="202612145"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612145.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612145</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106818</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路裝置以及其製造方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250715B">H01L23/50</main-classification>  
        <further-classification edition="200601120250715B">H01L23/60</further-classification>  
        <further-classification edition="200601120250715B">H01L23/535</further-classification>  
        <further-classification edition="200601120250715B">H01L21/60</further-classification>  
        <further-classification edition="200601120250715B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商台積電（南京）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSMC NANJING COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商台積電（中國）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSMC CHINA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳村村</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CUNCUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王新泳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XINYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓劉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, LIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳煥能</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUAN-NENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塗俊芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, JUNFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路裝置，包括半導體基板、半導體基板上方的複數個多位元單元、第一襯墊、及第二襯墊。多位元單元中之各者包括第一位元及第二位元。第一位元包括第一靜電放電(ESD)保護電路及半導體基板中的第一帶區。第二位元包括第二ESD保護電路及半導體基板中的第二帶區。在俯視圖中，第一位元之第一帶區與第二位元之第二帶區相對於第一位元與第二位元之間的邊界對稱，且第一位元之第一p型帶區及第二位元之第二帶區具有第一導電類型。第一襯墊及第二襯墊分別連接至第一ESD保護電路及第二ESD保護電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit device includes a semiconductor substrate, a plurality of multi-bit cells over the semiconductor substrate, a first pad, and a second pad. Each of the multi-bit cells includes first and second bits. The first bit includes a first electrostatic discharge (ESD) protection circuit and a first strap region in the semiconductor substrate. The second bit includes a second ESD protection circuit and a second strap region in the semiconductor substrate. The first strap region of the first bit is symmetric to the second strap region of the second bit with respect to a border between the first bit and the second bit in a top view, and the first p-type strap region of the first bit and the second strap region of the second bit have a first conductivity type. The first and second pads are respectively connected to the first and second ESD protection circuits.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101a:I/O電路</p>  
        <p type="p">103a:緩衝電路</p>  
        <p type="p">104a:ESD保護電路</p>  
        <p type="p">BR1:邊界</p>  
        <p type="p">BT1~BT2:位元</p>  
        <p type="p">LY:長度</p>  
        <p type="p">L1:長度</p>  
        <p type="p">MBC:多位元單元</p>  
        <p type="p">ML:金屬接線</p>  
        <p type="p">M1:金屬化層</p>  
        <p type="p">NDE:n型裝置</p>  
        <p type="p">NStrap:n型帶區</p>  
        <p type="p">NW:n型井區</p>  
        <p type="p">N+:n型重摻雜區</p>  
        <p type="p">OD:主動區</p>  
        <p type="p">PDE:p型裝置</p>  
        <p type="p">PODE:輔助結構</p>  
        <p type="p">PP:區</p>  
        <p type="p">PrB:邊界</p>  
        <p type="p">PStrap:p型帶區</p>  
        <p type="p">P+:p型重摻雜區</p>  
        <p type="p">RX:接收電路</p>  
        <p type="p">TX:轉移電路</p>  
        <p type="p">VD:導電結構</p>  
        <p type="p">VDD:高功率電壓線/高功率導軌</p>  
        <p type="p">VSS:低功率電壓線/低功率導軌</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="765" publication-number="202612143"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612143.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612143</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01L23/498</main-classification>  
        <further-classification edition="200601120250902B">H01L23/522</further-classification>  
        <further-classification edition="200601120250902B">H01L23/535</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂入俊和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAIRI, TOSHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體裝置，其能夠抑制因熱應力而產生裂縫。 一實施方式之半導體裝置具備基板。上述基板具有：第1外表面；第2外表面，其位於上述第1外表面之相反側；以及焊墊，其設置於上述第1外表面。上述基板具有：四層或五層之導電層；複數個絕緣層，其等分別介置於上述導電層中相鄰之兩層之間；以及複數個通孔，其等分別將上述導電層中之至少兩層連接；於上述導電層之數量為四層之情形時，上述第1外表面與上述第2外表面之間之距離為50 μm以下，於上述導電層之數量為五層之情形時，上述第1外表面與上述第2外表面之間之距離為60 μm以下。上述導電層具有：上述焊墊，其包含於該導電層中之第1導電層中；端子，其包含於該導電層中之第2導電層中，並且經由上述通孔中之至少一個而連接於上述焊墊；配線，其包含於上述第2導電層中，並且連接於上述端子；第1網格，其包含於上述第2導電層中，並且與上述端子及上述配線分離；以及第2網格，其包含於上述導電層中之上述第1導電層或位於上述第1導電層與上述第2導電層之間之第3導電層中，且與上述焊墊、上述端子、及上述配線電性獨立，於與上述第1外表面正交之方向上至少局部地覆蓋上述端子、上述配線、及上述第1網格之各者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">11:中介層</p>  
        <p type="p">11a,11b:外表面</p>  
        <p type="p">17:密封樹脂</p>  
        <p type="p">18:凸塊</p>  
        <p type="p">21:焊墊</p>  
        <p type="p">21a,21b:平面</p>  
        <p type="p">31,32,33,34,35:導電層</p>  
        <p type="p">41,42,43,44,45:絕緣層</p>  
        <p type="p">41a,45a:表面</p>  
        <p type="p">51,52:通孔</p>  
        <p type="p">61,73:網格</p>  
        <p type="p">62:中繼圖案</p>  
        <p type="p">65,75:孔</p>  
        <p type="p">71:端子</p>  
        <p type="p">71a,73a:邊緣</p>  
        <p type="p">SV1:堆疊通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="766" publication-number="202611813"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611813.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611813</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107052</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金錢交易系統、電腦程式、金錢交易方法、第一資訊終端、第二資訊終端及伺服器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251210B">G06Q20/26</main-classification>  
        <further-classification edition="201201120251210B">G06Q20/38</further-classification>  
        <further-classification edition="201201120251210B">G06Q20/32</further-classification>  
        <further-classification edition="201201120251210B">G06Q20/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商丰富Ｍ1有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VARIETY M-1 INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三嶽敏朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITAKE, TOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種即便為離線亦能夠安全地進行金錢交易之金錢交易系統、電腦程式及金錢交易方法。第一資訊終端20具有：第一獲取手段26，獲取金錢交易中之交易額之資料；第一金錢處理手段26，根據交易額之資料，使第一餘額資料增額或減額；及第一顯示手段26，於完成第一餘額資料之餘額之增額或減額之情形時，顯示包含第一安全資訊、或基於上述第一安全資訊之資訊的影像資訊，第二資訊終端10具有：第二獲取手段16，自影像資訊中獲取第一安全資訊、或基於上述第一安全資訊之資訊；及第二金錢處理手段16，根據第一安全資訊、或基於第一安全資訊之資訊，將第二餘額資料之餘額增額或減額。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:銷售者側終端</p>  
        <p type="p">11:相機</p>  
        <p type="p">12:通訊部</p>  
        <p type="p">13:顯示器</p>  
        <p type="p">14:輸入部</p>  
        <p type="p">15:記憶部</p>  
        <p type="p">16:運算部</p>  
        <p type="p">20:購買者側終端</p>  
        <p type="p">21:相機</p>  
        <p type="p">22:通訊部</p>  
        <p type="p">23:顯示器</p>  
        <p type="p">24:輸入部</p>  
        <p type="p">25:記憶部</p>  
        <p type="p">26:運算部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="767" publication-number="202611966"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611966.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611966</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107056</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>針對阻抗匹配之可變電容器二極體的用途</chinese-title>  
        <english-title>USE OF VARIABLE CAPACITOR DIODES FOR IMPEDANCE MATCHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01J37/32</main-classification>  
        <further-classification edition="200601120251201B">H03H7/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丁　帕特金　約翰　埃爾斯沃思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTIN, PATGING JOHN ELSWORTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙瓦拉尼　卡皮爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWLANI, KAPIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約翰斯頓　斯蒂芬　伯納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSTON, STEPHEN BERNARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露涉及針對阻抗匹配之可變電容器二極體的方法、系統和設備。在一些實施例中，一種在半導體製造腔室中針對阻抗匹配之RF匹配電路可包含一可變電抗，其包含一可變電容器二極體。至少部分基於與在半導體製造腔室的至少一站內之電漿相關的電漿負載的阻抗來修改與可變電容器二極體相關的電壓，從而導致可變電容器二極體的耗盡區的寬度變化，以執行RF源與電漿負載之間的阻抗匹配。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are methods, systems, and apparatuses that involve variable capacitor diodes for impedance matching. In some embodiments, an RF match circuit for impedance matching in a semiconductor fabrication chamber may comprise a variable reactance comprising a variable capacitor diode. A voltage associated with the variable capacitor diode is modified to cause a change in a width of a depletion region of the variable capacitor diode based at least in part on an impedance of a plasma load associated with plasma within at least one station of the semiconductor fabrication chamber to perform impedance matching between an RF source and the plasma load.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:RF輸入</p>  
        <p type="p">104:RF輸出</p>  
        <p type="p">106:匹配電路</p>  
        <p type="p">108:可變電容器</p>  
        <p type="p">110:相位-幅值測量區塊、相位/幅值感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="768" publication-number="202610830"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610830.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610830</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107120</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏光板</chinese-title>  
        <english-title>POLARIZING PLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B27/00</main-classification>  
        <further-classification edition="200601120251201B">B32B27/30</further-classification>  
        <further-classification edition="200601120251201B">B32B7/12</further-classification>  
        <further-classification edition="201801120251201B">C09J7/29</further-classification>  
        <further-classification edition="200601120251201B">C09J201/00</further-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤澤信樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJISAWA, SHINKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昇祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西上由紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKAMI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中谷昭彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATANI, AKIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供於高溫下的耐剝離性優異之偏光板。&lt;br/&gt;本發明之偏光板係具備：依序具有熱塑性樹脂膜A、偏光片、及(甲基)丙烯酸系樹脂膜B之偏光積層體，以及設置在偏光積層體之(甲基)丙烯酸系樹脂膜B上的黏著劑層。偏光積層體在80℃之環境下暴露2小時，則前述熱塑性樹脂膜A側的表面呈凸狀、前述(甲基)丙烯酸系樹脂膜B側的表面呈凹狀之方式捲曲，或者不捲曲，前述偏光積層體在暴露於80℃的環境下2小時之期間的最大捲曲力為3N以下，且前述偏光積層體在暴露於80℃之環境下144小時左右的透射軸方向之尺寸收縮率為1.25%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a polarizing plate with excellent peel resistance at high temperatures.&lt;br/&gt;As a solution, the polarizing plate of the present invention comprises a polarizing laminate comprising a thermoplastic resin film A, a polarizer, and a (meth)acrylic resin film B, in this order, and an adhesive layer provided on the (meth)acrylic resin film B of the polarizing laminate. When exposed to an environment of 80°C for 2 hours, the polarizing laminate curls so that the surface on the thermoplastic resin film A side becomes convex and the (meth)acrylic resin film B becomes concave, or does not curl, and the maximum curling force of the polarizing laminate during exposure to an environment of 80°C for 2 hours is 3 N or less, and the dimensional shrinkage rate of the polarizing laminate in the transmission axis direction before and after exposure to an environment of 80°C for 144 hours is 1.25% or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:黏著劑層</p>  
        <p type="p">20:(甲基)丙烯酸系樹脂膜B</p>  
        <p type="p">20A:(甲基)丙烯酸系樹脂膜B之黏著劑層側的表面</p>  
        <p type="p">20B:(甲基)丙烯酸系樹脂膜B之與黏著劑層接觸側相反側之面對偏光片的表面</p>  
        <p type="p">30:偏光片</p>  
        <p type="p">40:熱塑性樹脂膜A</p>  
        <p type="p">52,54:接著劑層</p>  
        <p type="p">100:偏光板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="769" publication-number="202611936"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611936.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611936</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107153</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置、記憶體裝置之測試方法及記憶體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G11C29/04</main-classification>  
        <further-classification edition="200601120250801B">G11C16/06</further-classification>  
        <further-classification edition="200601120250801B">G06F11/22</further-classification>  
        <further-classification edition="200601120250801B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂上健二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAUE, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒澤泰彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROSAWA, YASUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">使記憶體裝置之良率提升。&lt;br/&gt;其中一個實施形態之記憶體裝置，係具備有第1晶片、和被層積於第1晶片處之第2晶片、以及切換電路。第2晶片，係包含有基板、和被構成為將資料非揮發性地作記憶之記憶體胞陣列、以及各別於層積方向上而通過基板並且被與第1晶片作了連接的第1通孔、第2通孔及第3通孔。切換電路，係構成為對於第1狀態、第2狀態以及第3狀態作切換，該第1狀態，係在第1晶片與第2晶片之間經由第1通孔而使第1訊號被作通訊並且經由第2通孔而使第2訊號被作通訊，該第2狀態，係經由第3通孔而使第1訊號被作通訊並且經由第2通孔而使第2訊號被作通訊，該第3狀態，係經由第1通孔而使第1訊號被作通訊並且經由第3通孔而使第2訊號被作通訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:IF晶片</p>  
        <p type="p">20-1:核心晶片</p>  
        <p type="p">20-2:核心晶片</p>  
        <p type="p">30-1:TSV切換電路</p>  
        <p type="p">30-2:TSV切換電路</p>  
        <p type="p">C0&amp;lt;0&amp;gt;:內部電路</p>  
        <p type="p">C0&amp;lt;1&amp;gt;:內部電路</p>  
        <p type="p">C1&amp;lt;0&amp;gt;:內部電路</p>  
        <p type="p">C1&amp;lt;1&amp;gt;:內部電路</p>  
        <p type="p">C2&amp;lt;0&amp;gt;:內部電路</p>  
        <p type="p">C2&amp;lt;1&amp;gt;:內部電路</p>  
        <p type="p">D0&amp;lt;0&amp;gt;:驅動器</p>  
        <p type="p">D0&amp;lt;1&amp;gt;:驅動器</p>  
        <p type="p">D1&amp;lt;0&amp;gt;:驅動器</p>  
        <p type="p">D1&amp;lt;1&amp;gt;:驅動器</p>  
        <p type="p">dV1&amp;lt;0&amp;gt;:預設通孔</p>  
        <p type="p">dV1&amp;lt;1&amp;gt;:預設通孔</p>  
        <p type="p">dV2&amp;lt;0&amp;gt;:預設通孔</p>  
        <p type="p">dV2&amp;lt;1&amp;gt;:預設通孔</p>  
        <p type="p">dSW0a&amp;lt;0&amp;gt;:開關</p>  
        <p type="p">dSW0a&amp;lt;1&amp;gt;:開關</p>  
        <p type="p">dSW1a&amp;lt;0&amp;gt;:開關</p>  
        <p type="p">dSW1a&amp;lt;1&amp;gt;:開關</p>  
        <p type="p">dSW1b&amp;lt;0&amp;gt;:開關</p>  
        <p type="p">dSW1b&amp;lt;1&amp;gt;:開關</p>  
        <p type="p">rSW0a:開關</p>  
        <p type="p">rSW1a:開關</p>  
        <p type="p">rSW1b:開關</p>  
        <p type="p">rV1:冗長通孔</p>  
        <p type="p">rV2:冗長通孔</p>  
        <p type="p">SIG&amp;lt;0&amp;gt;:訊號</p>  
        <p type="p">SIG&amp;lt;1&amp;gt;:訊號</p>  
        <p type="p">W1&amp;lt;0&amp;gt;:配線</p>  
        <p type="p">W1&amp;lt;1&amp;gt;:配線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="770" publication-number="202612476"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612476.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612476</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H10B61/00</main-classification>  
        <further-classification edition="200601120251103B">G11C11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松下直輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施形態之記憶體裝置提高記憶體裝置之可靠性。&lt;br/&gt;實施形態之記憶體裝置具備：記憶胞陣列，其包含：第1局部配線，其於第1方向延伸；第2局部配線，其於與上述第1方向交叉之第2方向延伸；第3局部配線，其於上述第2方向延伸；第1記憶胞，其設置於上述第1局部配線與上述第2局部配線之間；及第2記憶胞，其設置於上述第1局部配線與上述第3局部配線之間；第1開關電路，其連接於上述第1局部配線，設置於上述記憶胞陣列之上述第1方向之一端側；第2開關電路，其連接於上述第2及第3局部配線，設置於上述記憶胞陣列之上述第2方向之一端側；第1電路，其執行上述記憶胞陣列之寫入動作或讀出動作；及第1及第2全域配線，其等連接於上述第2開關電路與上述第1電路之間；且上述第2局部配線於上述第1方向上，配置於上述第1開關電路與上述第3局部配線之間，上述第2局部配線經由上述第2開關電路，連接於上述第1全域配線，上述第3局部配線經由上述第2開關電路，連接於上述第2全域配線，上述第2全域配線之長度，短於上述第1全域配線之長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:記憶胞陣列</p>  
        <p type="p">121-1:行開關電路</p>  
        <p type="p">131-1:列開關電路</p>  
        <p type="p">BL(BL&amp;lt;1&amp;gt;~BL&amp;lt;N&amp;gt;):位元線</p>  
        <p type="p">GWL&amp;lt;1&amp;gt;,GWL&amp;lt;i&amp;gt;,GWL&amp;lt;xx&amp;gt;:全域字元線</p>  
        <p type="p">LY1,LYi,LYxx:配線長度</p>  
        <p type="p">MCa,MCb,MCc:記憶胞</p>  
        <p type="p">Rs_x:電阻值</p>  
        <p type="p">Rs_y:電阻值</p>  
        <p type="p">SWC:行開關</p>  
        <p type="p">SWR:列開關</p>  
        <p type="p">VP:通孔插塞</p>  
        <p type="p">WG1,WGi,WGxx:字元線群</p>  
        <p type="p">WL(WL&amp;lt;1&amp;gt;~WL&amp;lt;M&amp;gt;):字元線</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="771" publication-number="202612468"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612468.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612468</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107174</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250701B">H10B41/41</main-classification>  
        <further-classification edition="202301120250701B">H10B43/35</further-classification>  
        <further-classification edition="200601120250701B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武木田秀人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEKIDA, HIDETO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可提高良率的半導體記憶裝置。&lt;br/&gt;一實施形態之半導體記憶裝置具備：基板；積層體，其配置於第1方向上之基板之上方；第1導電體層，其配置於基板與積層體之間；記憶體柱，其包含半導體膜，於第1方向上延伸，貫通第1導電體層；及第1構件，其於與第1方向交叉之第2方向上與記憶體柱隔開而配置，於第1方向上延伸，貫通第1導電體層。積層體具有自基板側起，將第1半導體層、第2半導體層、第2導電體層及第3導電體層依序積層而成之構造。第1半導體層覆蓋半導體膜之第1方向上之端部、及第1構件之第1方向上之端部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:半導體記憶裝置</p>  
        <p type="p">10:記憶胞陣列</p>  
        <p type="p">30:導電體層</p>  
        <p type="p">31a,31b:半導體層</p>  
        <p type="p">32a,32b:導電體層</p>  
        <p type="p">33~38:導電體層</p>  
        <p type="p">40~45:絕緣體層</p>  
        <p type="p">50:核心構件</p>  
        <p type="p">51:半導體膜</p>  
        <p type="p">52:積層膜</p>  
        <p type="p">61,62:絕緣體層</p>  
        <p type="p">71:半導體基板</p>  
        <p type="p">100:陣列晶片</p>  
        <p type="p">101~104:導電體層</p>  
        <p type="p">200:電路晶片</p>  
        <p type="p">201~206:導電體層</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">CV:接點</p>  
        <p type="p">LI:導電體</p>  
        <p type="p">MP:記憶體柱</p>  
        <p type="p">MT0~MT7:記憶胞電晶體</p>  
        <p type="p">R1:區域</p>  
        <p type="p">SB:積層體</p>  
        <p type="p">SGD:選擇閘極線</p>  
        <p type="p">SGS:選擇閘極線</p>  
        <p type="p">SHE:構件</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">SLT:構件</p>  
        <p type="p">SP:間隔件</p>  
        <p type="p">ST1:選擇電晶體</p>  
        <p type="p">ST2:選擇電晶體</p>  
        <p type="p">TR1:電晶體</p>  
        <p type="p">WL0~WL7:字元線</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z1:方向</p>  
        <p type="p">Z2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="772" publication-number="202611311"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611311.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611311</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脈衝雷射沉積用除氣模組</chinese-title>  
        <english-title>DEGAS MODULE FOR PULSED LASER DEPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C23C14/02</main-classification>  
        <further-classification edition="200601120251201B">C23C14/34</further-classification>  
        <further-classification edition="200601120251201B">C23C14/50</further-classification>  
        <further-classification edition="200601120251201B">C23C14/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬侯羅　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAROHL, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尚朋　山古特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANGPLUNG, SAANGRUT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露之範例關於在一除氣模組中處理一基板以在藉由脈衝雷射沉積來沉積一膜之前移除水蒸汽。一範例提供一種處理工具。該處理工具包含一搬運模組。該處理工具更包含連接至該搬運模組之一脈衝雷射沉積模組。該處理工具更包含連接至該搬運模組之一除氣模組。該除氣模組包含一基板支撐件。該除氣模組更包含配置以於該除氣模組及該搬運模組中形成高度真空(P ≤ 10&lt;sup&gt;-5&lt;/sup&gt;托)之一低溫泵。該除氣模組更包含一紅外線輻射源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Examples are disclosed that relate to treating a substrate in a degas module to remove water vapor prior to depositing a film by pulsed laser deposition. One example provides a processing tool. The processing tool comprises a transfer module. The processing tool further comprises a pulsed laser deposition module connected to the transfer module. The processing tool further comprises a degas module connected to the transfer module. The degas module comprises a substrate support. The degas module further comprises a cryopump configured to form a high vacuum (P ≤ 10&lt;sup&gt;-5&lt;/sup&gt; Torr) in the degas module and the transfer module. The degas module further comprises an infrared radiation source.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:搬運模組</p>  
        <p type="p">200:除氣模組</p>  
        <p type="p">202:搬運埠</p>  
        <p type="p">204:除氣處理腔室</p>  
        <p type="p">206:基板支撐件</p>  
        <p type="p">208:接觸點</p>  
        <p type="p">210:基板</p>  
        <p type="p">212:低溫泵</p>  
        <p type="p">214:閘閥</p>  
        <p type="p">216:壓縮器</p>  
        <p type="p">220:粗抽泵</p>  
        <p type="p">222:排氣管線</p>  
        <p type="p">224:CDA供給管線</p>  
        <p type="p">226:電離真空計</p>  
        <p type="p">230:IR輻射源</p>  
        <p type="p">232:IR輻射</p>  
        <p type="p">234:窗戶</p>  
        <p type="p">236:第一側</p>  
        <p type="p">238:近接熱電偶(TC)</p>  
        <p type="p">240:第二側</p>  
        <p type="p">250:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="773" publication-number="202612463"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612463.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612463</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107425</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250708B">H10B41/20</main-classification>  
        <further-classification edition="202301120250708B">H10B41/40</further-classification>  
        <further-classification edition="202301120250708B">H10B43/20</further-classification>  
        <further-classification edition="202301120250708B">H10B43/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松下沙緒梨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA, SAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋検世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KENSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明之一實施形態，半導體裝置包含積層膜，該積層膜包含沿第1方向交替設置之複數個電極層及複數個第1絕緣膜。前述裝置進一步包含柱狀部，該柱狀部係於前述積層膜內沿前述第1方向延伸者，且包含：於前述積層膜之側面隔著第2絕緣膜設置之電荷蓄積層、及於前述電荷蓄積層之側面隔著第3絕緣膜設置之半導體層。前述複數個電極層中之第1電極層包含：第1層，其含有鉬、氮、及第14族元素；及第2層，其含有鉬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:電荷蓄積層</p>  
        <p type="p">5:阻擋絕緣膜</p>  
        <p type="p">5a,5b:絕緣膜</p>  
        <p type="p">6:電極層</p>  
        <p type="p">6a,6a’:障壁金屬層</p>  
        <p type="p">6b:電極材層</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="774" publication-number="202610587"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610587.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610587</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107546</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>內視鏡光源同步系統</chinese-title>  
        <english-title>ENDOSCOPE LIGHT SOURCE SYNCHRONIZATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250620B">A61B1/045</main-classification>  
        <further-classification edition="200601120250620B">A61B1/05</further-classification>  
        <further-classification edition="200601120250620B">A61B1/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>互貴興業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUKUI BIOTECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅士哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, SHIH-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱怡銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹明錕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, MING-KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種內視鏡光源同步系統，適於連接一顯示裝置、一內視鏡裝置及一光源裝置，該內視鏡裝置包括一影像感測器，該光源裝置用以發出至少二種光源，包括：一影像處理器；以及一時序控制模組，使用一同步訊號來同步控制該光源裝置及該影像感測器，並根據該影像感測器於每一幀中所需的不同光源，來同步控制該光源裝置進行該些光源之間的切換及啟動，而使該影像感測器對應不同光源產生不同之影像訊號，該影像處理器根據該些影像訊號於該顯示裝置同時顯示相對應的數個影像畫面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides an endoscope light source synchronization system which is adapted to connect a display device, an endoscope device and a light source device, wherein the endoscope device includes an image sensor and the light source device is used to emit at least two kinds of light sources. The endoscope light source synchronization system includes an image signal processor and a timing control module, wherein the timing control module uses a synchronization signal to synchronously control the light source device and the image sensor. According to the different light sources required by the image sensor in each frame, the light source device is synchronously controlled to switch and activate between the light sources, so that the image sensor generates different image signals corresponding to different light sources. The image signal processor simultaneously displays several corresponding image screens on the display device according to the image signals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顯示裝置</p>  
        <p type="p">2:內視鏡裝置</p>  
        <p type="p">21:影像感測器</p>  
        <p type="p">3:光源裝置</p>  
        <p type="p">4:影像處理器</p>  
        <p type="p">5:時序控制模組</p>  
        <p type="p">H:主機本體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="775" publication-number="202610977"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610977.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610977</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107575</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子器件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C43/225</main-classification>  
        <further-classification edition="200601120251201B">C07C309/12</further-classification>  
        <further-classification edition="200601120251201B">C07C311/51</further-classification>  
        <further-classification edition="200601120251201B">C07C317/04</further-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">C07D213/89</further-classification>  
        <further-classification edition="200601120251201B">C07D317/36</further-classification>  
        <further-classification edition="200601120251201B">C07D317/70</further-classification>  
        <further-classification edition="200601120251201B">C07D327/06</further-classification>  
        <further-classification edition="200601120251201B">C07D333/76</further-classification>  
        <further-classification edition="200601120251201B">C01B3/00</further-classification>  
        <further-classification edition="200601120251201B">C08F212/14</further-classification>  
        <further-classification edition="200601120251201B">C08F212/32</further-classification>  
        <further-classification edition="200601120251201B">C08F212/34</further-classification>  
        <further-classification edition="200601120251201B">C08F230/08</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石地洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIJI, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川端健志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABATA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石原英幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIHARA, HIDEYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀込弘記</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIGOME, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤研由</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, AKIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光化射線性或感放射線性樹脂組成物，其含有：樹脂（A），其包含源自具有苯乙烯骨架之化合物的重複單元，並具有酸分解性基，其中，所述具有苯乙烯骨架之化合物的自由基陽離子體之正電荷面積小於150Å&lt;sup&gt;2&lt;/sup&gt;；鎓鹽化合物（B），其包含具有至少一個氟原子的陽離子、和陰離子，並藉由光化射線或放射線之照射而產生酸；以及含硼化合物（C）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="776" publication-number="202610951"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610951.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610951</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107586</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>離子交換裝置及離子交換裝置的管理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">C02F1/42</main-classification>  
        <further-classification edition="202401120251201B">G01N15/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新井伸説</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, NOBUKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種離子交換裝置，為被處理水相對於容器內的離子交換樹脂的填充床以向下流動方式通水的非再生型離子交換裝置，其特徵在於，於所述填充床的上側存在自由空間部的離子交換裝置中，包括：採集所述自由空間部內的水的採水機構、以及對利用所述採水機構採集的水中的微粒子數進行測量的微粒子數測量機構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:離子交換裝置</p>  
        <p type="p">2:容器</p>  
        <p type="p">3:離子交換樹脂的填充床(填充床)</p>  
        <p type="p">4:供給水配管</p>  
        <p type="p">5、6、8:過濾器</p>  
        <p type="p">7、9:配管</p>  
        <p type="p">10:閥</p>  
        <p type="p">F:自由空間部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="777" publication-number="202610857"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610857.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610857</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107603</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動車充電插頭支架</chinese-title>  
        <english-title>HOLDER FOR ELECTRIC VEHICLE CHARGING CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250307B">B60L53/16</main-classification>  
        <further-classification edition="201901120250307B">B60L53/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴奕旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, I-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧廷和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, TING-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝明憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MING-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電動車充電插頭支架，包含基座、容置空間、第一卡合件及第二卡合件。容置空間設置於基座內，用以容置第一規格電動車充電插頭及第二規格電動車充電插頭的其中一者。容置空間包含第一通道，用以接收第一規格電動車充電插頭，以及第二通道，用以接收第二規格電動車充電插頭，且第二通道與第一通道至少部分重疊。第一卡合件設置於第一通道周圍，以卡合第一規格電動車充電插頭。第二卡合件設置於第二通道周圍，以卡合第二規格電動車充電插頭。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A holder for electric vehicle charging connector includes a base, an accommodating space, a first engagement element and a second engagement element. The accommodating space is disposed within the base for receiving one of a first standard electric vehicle charging connector and a second standard electric vehicle charging connector, and includes a first passage for receiving the first standard electric vehicle charging connector, and a second passage for receiving the second standard electric vehicle charging connector. The first passage and the second passage are overlapped at least in part. The first engaging element is disposed around the first passage for engaging with the first standard electric vehicle charging connector, and the second engaging element is disposed around the second passage for engaging with the second standard electric vehicle charging connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:容置空間</p>  
        <p type="p">211:第一內表面</p>  
        <p type="p">221:第二內表面</p>  
        <p type="p">24:第一卡合件</p>  
        <p type="p">25:支撐件</p>  
        <p type="p">26:第二卡合件</p>  
        <p type="p">27:段差</p>  
        <p type="p">30:接收空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="778" publication-number="202612464"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612464.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612464</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107694</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250701B">H10B41/20</main-classification>  
        <further-classification edition="202301120250701B">H10B41/30</further-classification>  
        <further-classification edition="202301120250701B">H10B41/35</further-classification>  
        <further-classification edition="202301120250701B">H10B43/20</further-classification>  
        <further-classification edition="202301120250701B">H10B43/30</further-classification>  
        <further-classification edition="202301120250701B">H10B43/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大澤佐保</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHSAWA, SAHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上暢介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉鷹直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHITAKA, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提高半導體記憶裝置之成品率。&lt;br/&gt;實施形態之半導體記憶裝置具備：複數個配線層及複數個第1絕緣膜，其等於第1方向交替積層；記憶體柱，其於第1方向延伸，通過複數個配線層及複數個第1絕緣膜，此處，記憶體柱具有於第1方向延伸之半導體、設置於半導體與複數個配線層及複數個第1絕緣膜之間之第2絕緣膜、設置於第2絕緣膜與複數個配線層及複數個第1絕緣膜之間之電荷蓄積膜、設置於電荷蓄積膜與複數個配線層之間之複數個第3絕緣膜、及設置於電荷蓄積膜與複數個第1絕緣膜之間之複數個第4絕緣膜；及第5絕緣膜，其以覆蓋複數個配線層之端部中之側面部分之方式設置，對氫氟酸之蝕刻速率低於第4絕緣膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21,22,23,24,26:配線層</p>  
        <p type="p">40,41,42,43,44,45,46:絕緣體層</p>  
        <p type="p">45a:絕緣體</p>  
        <p type="p">45b:塗膜</p>  
        <p type="p">HA:引出區域</p>  
        <p type="p">SGD,SGS:選擇閘極線</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">WL0~WL7:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="779" publication-number="202612271"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612271.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612271</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107696</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體電路</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H03K17/16</main-classification>  
        <further-classification edition="200601120251201B">H03K17/08</further-classification>  
        <further-classification edition="200701120251201B">H02M7/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新電元工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湧口純彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUGUCHI, JUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森永雄司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORINAGA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種使用了寬頻隙半導體的半導體電路，能夠抑制在開關元件的閘極產生的振鈴。&lt;br/&gt;本發明的半導體電路包括：具有至少一個開關元件Q的開關電路；接地佈線；以及連接在開關電路與接地佈線之間的電流檢測電路，其特徵在於：在開關電路與接地佈線之間，以相對於電流檢測電路並聯的關係連接有雜訊去除用電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="780" publication-number="202612469"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612469.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612469</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107900</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置及半導體記憶裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250805B">H10B41/41</main-classification>  
        <further-classification edition="202301120250805B">H10B41/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辻大毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUJI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施方式之半導體記憶裝置具有第1積層體、第2積層體、源極線、第1柱狀部、第2柱狀部、第1位元線及第2位元線。上述源極線於上述第1方向上，配置於上述第1積層體與上述第2積層體之間。上述第1柱狀部於第1方向上於上述第1積層體內延伸。上述第2柱狀部於上述第1方向上於上述第2積層體內延伸。上述第1位元線相對於上述第1積層體，配置於上述源極線之相反側。上述第2位元線相對於上述第2積層體，配置於上述源極線之相反側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:第1晶片</p>  
        <p type="p">3:第2晶片</p>  
        <p type="p">11:記憶單元陣列</p>  
        <p type="p">21:半導體基板</p>  
        <p type="p">22:周邊電路</p>  
        <p type="p">22a:電晶體</p>  
        <p type="p">22b:電性連接線</p>  
        <p type="p">23:絕緣部</p>  
        <p type="p">24:焊墊</p>  
        <p type="p">32:焊墊</p>  
        <p type="p">40:積層體</p>  
        <p type="p">40A:第1積層體</p>  
        <p type="p">40B:第2積層體</p>  
        <p type="p">40C:第3積層體</p>  
        <p type="p">40D:第4積層體</p>  
        <p type="p">41A:閘極電極層(第1閘極電極層)</p>  
        <p type="p">41B:閘極電極層(第2閘極電極層)</p>  
        <p type="p">42A:絕緣層(第1絕緣層)</p>  
        <p type="p">42B:絕緣層(第2絕緣層)</p>  
        <p type="p">43:絕緣層</p>  
        <p type="p">44:絕緣層</p>  
        <p type="p">46A:絕緣層</p>  
        <p type="p">46B:絕緣層</p>  
        <p type="p">47:絕緣層</p>  
        <p type="p">50:分斷部</p>  
        <p type="p">51:絕緣膜</p>  
        <p type="p">51a:第1絕緣膜</p>  
        <p type="p">51b:第2絕緣膜</p>  
        <p type="p">51s1:絕緣膜</p>  
        <p type="p">51s2:絕緣膜</p>  
        <p type="p">52:導電層(導電部)</p>  
        <p type="p">55:接點</p>  
        <p type="p">56:接點</p>  
        <p type="p">60:佈線部</p>  
        <p type="p">60A:佈線部</p>  
        <p type="p">60B:佈線部</p>  
        <p type="p">61:電性連接線</p>  
        <p type="p">62:電性連接線</p>  
        <p type="p">64:電性連接線</p>  
        <p type="p">AR:陣列區域</p>  
        <p type="p">BLA:下位元線(第1位元線)</p>  
        <p type="p">BLB:上位元線(第2位元線)</p>  
        <p type="p">BR:位元線接入區域(位元線連接區域)</p>  
        <p type="p">CS:接點</p>  
        <p type="p">MH:記憶柱(柱狀體)</p>  
        <p type="p">MHA:記憶柱(柱狀體)</p>  
        <p type="p">MHB:記憶柱(柱狀體)</p>  
        <p type="p">MHC:記憶柱(柱狀體)</p>  
        <p type="p">SGDA:汲極側選擇閘極線</p>  
        <p type="p">SGDB:汲極側選擇閘極線</p>  
        <p type="p">SGSA:源極側選擇閘極線</p>  
        <p type="p">SGSB:源極側選擇閘極線</p>  
        <p type="p">SHE:分斷部</p>  
        <p type="p">SHEA:分斷部</p>  
        <p type="p">SHEB:分斷部</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">ST:分斷部</p>  
        <p type="p">STa:第1部分</p>  
        <p type="p">STb:第2部分</p>  
        <p type="p">Ts:階差</p>  
        <p type="p">VA:通孔</p>  
        <p type="p">VB:接點</p>  
        <p type="p">VC:接點</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">W2:寬度</p>  
        <p type="p">WLA:字元線</p>  
        <p type="p">WLB:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="781" publication-number="202612368"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612368.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612368</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107905</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線通訊系統中的服務品質（ＱＯＳ）上下文傳播</chinese-title>  
        <english-title>QUALITY OF SERVICE (QOS) CONTEXT PROPAGATION IN WIRELESS COMMUNICATION SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W36/00</main-classification>  
        <further-classification edition="200901120251201B">H04W36/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏姆利嘉　維倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMRIGAR, VIREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷馬查德利　山迪普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOMCHAUDHURI, SANDIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈札利卡　吉恩藍詹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAZARIKA, GYANRANJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢德拉茂里　阿努拉達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANDRAMOULI, ANURADHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安巴札剛　阿拉芬德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANBAZHAGAN, ARAVIND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用於無線通訊系統中的服務品質(quality of service, QOS)上下文傳播的方法、組件、裝置、及系統。一些態樣更具體地關於一第一無線存取點(AP)，其將在該第一無線AP與一無線站台(STA)之間建立的一第一通訊流的一QoS上下文傳輸至一第二無線AP。該第一無線AP可回應於該無線STA將從與該第一無線AP關聯的一覆蓋區域漫遊至與該第二無線AP關聯的一覆蓋區域的一意圖而將該QoS上下文傳輸至該第二無線AP。根據該經接收QoS上下文，該第二無線AP可判定與該無線STA及該第二無線AP關聯的一第二通訊流的各種QoS策略，且在與該無線STA關聯後，根據該等QoS策略開始與該無線STA通訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides methods, components, devices, and systems for quality of service (QoS) context propagation in wireless communication systems. Some aspects more specifically relate to a first wireless access point (AP), transmitting to a second wireless AP, a QoS context for a first communication flow established between the first wireless AP and a wireless station (STA). The first wireless AP may transmit the QoS context to the second wireless AP in response to an intent of the wireless STA to roam from a coverage area associated with the first wireless AP to a coverage area associated with the second wireless AP. According to the received QoS context, the second wireless AP may determine various QoS policies of a second communication flow associated with the wireless STA and the second wireless AP and begin communicating with the wireless STA according to the QoS policies after association with the wireless STA.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102-a:AP</p>  
        <p type="p">102-b:AP</p>  
        <p type="p">104-a:STA</p>  
        <p type="p">200:程序流程</p>  
        <p type="p">202:伺服器</p>  
        <p type="p">204~224:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="782" publication-number="202612455"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612455.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612455</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107910</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250902B">H10B12/00</main-classification>  
        <further-classification edition="200601120250902B">H01L23/528</further-classification>  
        <further-classification edition="200601120250902B">H01L23/535</further-classification>  
        <further-classification edition="200601120250902B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋貴志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明容易地形成高縱橫比之圖案。&lt;br/&gt;實施方式之半導體裝置1具備：第1結構體；第1柱狀體，其於上述第1結構體內沿第1方向延伸；第2結構體；第2柱狀體，其於上述第2結構體內沿上述第1方向延伸；以及貼合面，其介置於上述第1結構體與上述第2結構體之間；且於上述貼合面中，上述第1柱狀體與上述第2柱狀體於上述第1方向上連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">51,52,60,OL1,OL2,OL3:絕緣層</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">CH:插塞</p>  
        <p type="p">CN1,CN2,CN3:通道層</p>  
        <p type="p">CP:蓋層</p>  
        <p type="p">CR1,CR2,CR3:核心層</p>  
        <p type="p">D1,D2,D3:直徑</p>  
        <p type="p">EC1:導電部</p>  
        <p type="p">EC2:導電部</p>  
        <p type="p">EC3:導電部</p>  
        <p type="p">LI:板狀觸點</p>  
        <p type="p">LI1,LI2,LI3:板狀部</p>  
        <p type="p">LL1:襯墊層</p>  
        <p type="p">LL2:襯墊層</p>  
        <p type="p">LL3:襯墊層</p>  
        <p type="p">LM,LM1,LM2,LM3:積層體</p>  
        <p type="p">ME1,ME2,ME3:記憶體膜</p>  
        <p type="p">MX:上層佈線</p>  
        <p type="p">PE1,PE2:延伸部</p>  
        <p type="p">PJ1,PJ2:接合部</p>  
        <p type="p">PL,PL1,PL2,PL3:柱</p>  
        <p type="p">SE1:面</p>  
        <p type="p">SE2:面</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">SP1,SP2:貼合面</p>  
        <p type="p">WL1,WL2,WL3:字元線</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="783" publication-number="202610741"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610741.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610741</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107929</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、組成物之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">B22F1/00</main-classification>  
        <further-classification edition="202201120251201B">B22F1/05</further-classification>  
        <further-classification edition="202201120251201B">B22F1/068</further-classification>  
        <further-classification edition="202201120251201B">B22F1/10</further-classification>  
        <further-classification edition="202201120251201B">B22F1/107</further-classification>  
        <further-classification edition="202201120251201B">B22F1/14</further-classification>  
        <further-classification edition="202201120251201B">B22F1/148</further-classification>  
        <further-classification edition="202201120251201B">B22F1/17</further-classification>  
        <further-classification edition="202201120251201B">B22F1/18</further-classification>  
        <further-classification edition="200601120251201B">B22F7/08</further-classification>  
        <further-classification edition="200601120251201B">B22F9/00</further-classification>  
        <further-classification edition="200601120251201B">B22F9/24</further-classification>  
        <further-classification edition="200601120251201B">H01L21/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大賽璐股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAICEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東北大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOHOKU UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上島稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UESHIMA, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林大和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, YAMATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石田悠人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIDA, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種當用於燒結接合之情形時，能夠於低溫進行燒結，且同時可牢固地接合，能夠形成耐熱性優異之燒結體的組成物。本揭示內容之組成物含有複合物粒子、有機物及上述複合物粒子以外之含有Ag及／或Cu之粒子，上述複合物粒子含有基材粒子與載持於上述基材粒子上之Ag及／或Cu，上述基材粒子之線膨脹係數為8ppm／K以下，下述式（1）所表示之粒子燒結率為30％以上。 &lt;br/&gt;粒子燒結率＝（對燒結步驟後之燒結體的剖面使用FE－SEM以20000倍拍攝所得到之影像中，至少任一方向之朝向之長度為100nm以上且接合於被接合物的基材粒子之總數）／（對下述燒結步驟後之燒結體的剖面使用FE－SEM以20000倍拍攝所得到之影像中，至少任一方向之朝向之長度為100nm以上的基材粒子之總數）　　　（1）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="784" publication-number="202610723"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610723.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610723</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108019</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>強鹼性陰離子交換樹脂之製造方法及製造設備、以及該強鹼性陰離子交換樹脂之再利用方法</chinese-title>  
        <english-title>PRODUCTION METHOD AND PRODUCTION FACILITY FOR STRONGLY BASIC ANION EXCHANGE RESIN, AND METHOD FOR REUSING STRONGLY BASIC ANION EXCHANGE RESIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">B01J41/05</main-classification>  
        <further-classification edition="201701120251201B">B01J49/57</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商奧璐佳瑙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORGANO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本浩一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, KOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種從使用完畢之非再生型混床離子交換樹脂製造即便在要求高純度的水質的用途中仍可適用的再利用品之強鹼性陰離子交換樹脂的方法。一種從使用完畢之非再生型混床離子交換樹脂製造強鹼性陰離子交換樹脂之方法，具有：分離步驟，係將使用完畢之非再生型混床離子交換樹脂所含的強酸性陽離子交換樹脂與強鹼性陰離子交換樹脂分離；以及再生步驟，係使用選自由氫氧化鈉、氫氧化鉀、及四甲基氫氧化銨(THAM)所構成之群組之1者以上的再生劑來將分離之強鹼性陰離子交換樹脂進行再生；混入至該分離之強鹼性陰離子交換樹脂的強酸性陽離子交換樹脂的比例(異樹脂混入率)相對於離子交換樹脂之總體積為1體積%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the invention is to provide a method for producing, from a used non-regenerable mixed bed ion exchange resin, a recycled strongly basic anion exchange resin that can be used even in applications that require water of high purity. The method for producing a strongly basic anion exchange resin from a used non-regenerable mixed bed ion exchange resin includes: a separation step of separating the strongly acidic cation exchange resin and the strongly basic anion exchange resin contained in the used non-regenerable mixed bed ion exchange resin, and a regeneration step of regenerating the separated strongly basic anion exchange resin using at least one regenerant selected from the group consisting of sodium hydroxide, potassium hydroxide, and tetramethylammonium hydroxide (TMAH), wherein the proportion of the strongly acidic cation exchange resin incorporated in the strongly basic anion exchange resin following the separation step (the foreign resin contamination rate) does not exceed 1% by volume relative to the total volume of the ion exchange resin.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:分離手段(離子交換樹脂塔)</p>  
        <p type="p">2:再生手段(離子交換樹脂塔)</p>  
        <p type="p">A:強鹼性陰離子交換樹脂</p>  
        <p type="p">B:強酸性陽離子交換樹脂</p>  
        <p type="p">L1:化學液管線</p>  
        <p type="p">L2:樹脂管線</p>  
        <p type="p">L3:廢液管線</p>  
        <p type="p">L4:再生劑管線</p>  
        <p type="p">L5:純水管線</p>  
        <p type="p">L6:廢液管線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="785" publication-number="202612477"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612477.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612477</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108032</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251001B">H10B61/00</main-classification>  
        <further-classification edition="200601120251001B">G11C11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉浦邦晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIURA, KUNIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠提昇動作性能之磁性記憶裝置。&lt;br/&gt;實施方式之磁性記憶裝置具備記憶胞MC、定電流源CS、開關S1、S2及S3、峰值檢測電路51、以及感測放大器SA。記憶胞包含可變電阻元件VR及選擇器元件SE。定電流源CS對記憶胞供給電流Ipc。開關S1連接於記憶胞與定電流源CS之間。開關S2連接於接地電壓節點與記憶胞之間。峰值檢測電路51包含比較器CP及二極體D1，充入記憶胞之電壓Vm經由二極體輸入至比較器之第1輸入端子，且電壓Vm輸入至比較器之第2輸入端子。感測放大器SA將電壓Vm與參考電壓Vref進行比較。開關S3連接於記憶胞與感測放大器SA之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">17:讀出電路</p>  
        <p type="p">51:峰值檢測電路</p>  
        <p type="p">52:延遲電路</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">CP:比較器</p>  
        <p type="p">CS:定電流源</p>  
        <p type="p">D1:二極體</p>  
        <p type="p">Ipc:預充電電流</p>  
        <p type="p">MC:記憶胞</p>  
        <p type="p">O1:信號</p>  
        <p type="p">O2:信號</p>  
        <p type="p">S1:預充電開關</p>  
        <p type="p">S2:下拉開關</p>  
        <p type="p">S3:感測放大器開關</p>  
        <p type="p">SA:感測放大器</p>  
        <p type="p">SE:選擇器元件</p>  
        <p type="p">SO:信號</p>  
        <p type="p">Vd:電壓</p>  
        <p type="p">VH:電源</p>  
        <p type="p">Vm:電壓</p>  
        <p type="p">VR:可變電阻元件</p>  
        <p type="p">Vref:參考電壓</p>  
        <p type="p">VSS:接地電壓</p>  
        <p type="p">WL:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="786" publication-number="202612480"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612480.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612480</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108045</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體晶片及其製造方法</chinese-title>  
        <english-title>INTEGRATED CHIP AND MANUFACTURING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251001B">H10B63/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江法伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, FA-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李璧伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, BI-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>衛怡揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, YI-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喻中一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡正原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種積體電路及其製造方法。減小RRAM單元中的形成電壓的問題透過具有至少兩個不同金屬氧化物的不同層的電阻切換結構來解決。選擇層的厚度和組成，使得層之間的氧親和力的差在層中的一個中產生本徵氧空位。增加耐久性的問題透過將摻雜劑金屬添加至較低氧親和力層來解決。摻雜劑金屬具有比較低氧親和力層的塊狀金屬高的氧親和力。較低氧親和力層可以具有摻雜劑金屬設置在不同層級中的層壓結構。摻雜劑金屬在較低氧親和力層內可以具有濃度梯度。使摻雜劑金屬濃度在較高氧親和力層的方向上減少可以進一步降低形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The problem of reducing forming voltage in an RRAM cell is solved by a resistive switching structure having at least two distinct layers of distinct metal oxides. Thicknesses and compositions of the layers are selected so that a difference in oxygen affinity between the layers produces intrinsic oxygen vacancies in one of the layers. The problem of increasing endurance is solved by adding a dopant metal to the lower oxygen affinity layer. The dopant metal has a higher oxygen affinity than the bulk metal of the lower oxygen affinity layer. The lower oxygen affinity layer may have a laminate structure in which the dopant metal is disposed in distinct strata. The dopant metal may have a concentration gradient within the lower oxygen affinity layer. Having the dopant metal concentration diminish in the direction of the higher oxygen affinity layer can further lower the forming voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體晶片</p>  
        <p type="p">102:基板</p>  
        <p type="p">103:電晶體</p>  
        <p type="p">104:電阻隨機存取記憶體(RRAM)單元</p>  
        <p type="p">105:下部通孔</p>  
        <p type="p">106:下部導線</p>  
        <p type="p">108:底部電極</p>  
        <p type="p">110:電阻切換結構</p>  
        <p type="p">112:覆蓋結構</p>  
        <p type="p">114:上部金屬層</p>  
        <p type="p">115:區域</p>  
        <p type="p">116:較低氧親和力切換層</p>  
        <p type="p">116a:第一子層</p>  
        <p type="p">116b:第二子層</p>  
        <p type="p">118:較高氧親和力切換層</p>  
        <p type="p">120:上部導電結構</p>  
        <p type="p">124:介電結構</p>  
        <p type="p">126:厚度</p>  
        <p type="p">128:厚度</p>  
        <p type="p">130:厚度</p>  
        <p type="p">131:厚度</p>  
        <p type="p">132:厚度</p>  
        <p type="p">134:厚度</p>  
        <p type="p">141:頂部電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="787" publication-number="202611584"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611584.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611584</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108157</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學鏡頭、相機模組與電子裝置</chinese-title>  
        <english-title>OPTICAL LENS, CAMERA MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250311B">G02B7/00</main-classification>  
        <further-classification edition="202101120250311B">G02B7/02</further-classification>  
        <further-classification edition="202101120250311B">G03B17/12</further-classification>  
        <further-classification edition="202101120250311B">G03B17/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大根光學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN INDUSTRIAL OPTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃炫欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSUAN-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭鴻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HONG RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭秀儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, HSIU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴昱辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YU CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學鏡頭包含鏡筒、透鏡、間隔元件及維持元件。間隔元件具有近軸側表面、離軸側表面及相對設置的第一表面和第二表面。近軸側表面連接於第一表面與第二表面靠近光軸的一側，並朝向光軸漸縮而形成通光孔。離軸側表面連接於第一表面與第二表面遠離光軸的一側。維持元件與鏡筒固定設置，以維持透鏡與鏡筒之間在光軸上的相對固定位置。間隔元件設置於透鏡與維持元件之間。透鏡具有環繞光軸的第一區域，且第一區域在平行於光軸的方向上支撐於第一表面。維持元件具有環繞光軸的第二區域，且第二區域在平行於光軸的方向上支撐於第二表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical lens includes a lens barrel, a lens element, a spacer element, and a retaining element. The spacer element has a near-axis side surface, a far-axis side surface, and first and second surfaces arranged opposite each other. The near-axis side surface is connected to sides of the first and second surfaces that are closer to an optical axis and tapers toward the optical axis to form a light-passing hole. The far-axis side surface is connected to sides of the first and second surfaces that are farther from the optical axis. The retaining element is fixedly arranged with the lens barrel to maintain a relative fixed position between the lens element and the lens barrel along the optical axis. The spacer element is disposed between the lens element and the retaining element. The lens element has a first region surrounding the optical axis, and the first region is supported on the first surface in a direction parallel to the optical axis. The retaining element has a second region surrounding the optical axis, and the second region is supported on the second surface in a direction parallel to the optical axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學鏡頭</p>  
        <p type="p">10:鏡筒</p>  
        <p type="p">11:透鏡群</p>  
        <p type="p">13:間隔元件</p>  
        <p type="p">15:維持元件</p>  
        <p type="p">E0,E1:透鏡</p>  
        <p type="p">OA:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="788" publication-number="202610724"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610724.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610724</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108259</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混合離子交換樹脂中的陰離子交換樹脂和陽離子交換樹脂的分離方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">B01J47/10</main-classification>  
        <further-classification edition="201701120251201B">B01J49/09</further-classification>  
        <further-classification edition="201701120251201B">B01J49/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川祐一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, YUUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">陰離子交換樹脂2與陽離子交換樹脂3的分離方法為，藉由由分離塔1、賽普雷克斯塔（高度分離塔）8和用於混合陰離子交換樹脂2及NaOH水溶液6的混合槽5所構成的裝置進行。在分離步驟中取出的陰離子交換樹脂2中，混入了微量的陽離子交換樹脂3。因此，將此陰離子交換樹脂2投入混合槽5中排水，之後，注入陰離子交換樹脂2與陽離子交換樹脂3的中間比重的NaOH水溶液6進行浸漬。然後，將陰離子交換樹脂2與NaOH水溶液6的混合液2A一起輸送至預先注入水W的賽普雷克斯塔8中。藉由此種混合離子交換樹脂的分離方法，利用賽普雷克斯法能夠達到極高精度地分離陰離子交換樹脂與陽離子交換樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:分離塔</p>  
        <p type="p">2:陰離子交換樹脂</p>  
        <p type="p">2A:陰離子交換樹脂與NaOH水溶液的混合液</p>  
        <p type="p">3:陽離子交換樹脂</p>  
        <p type="p">4:陰離子交換樹脂提取配管</p>  
        <p type="p">5:混合槽</p>  
        <p type="p">6:NaOH水溶液</p>  
        <p type="p">6A:NaOH水溶液(混合後)</p>  
        <p type="p">7:輸送管</p>  
        <p type="p">7A:泵</p>  
        <p type="p">8:賽普雷克斯塔(高度分離塔)</p>  
        <p type="p">W:水</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="789" publication-number="202612420"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612420.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612420</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108265</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250620B">H05K7/12</main-classification>  
        <further-classification edition="200601120250620B">H05K5/02</further-classification>  
        <further-classification edition="200601120250620B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>粟賀宏介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AWAGA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一實施形態之半導體記憶裝置具有殼體、基板、第1電子零件及第2電子零件。上述基板收容於上述殼體，具有第1面。上述第1電子零件安裝於上述第1面。上述第2電子零件安裝於上述第1面。上述第2電子零件具有較上述第1電子零件距上述第1面之高度高的高度。上述殼體包含第1構件與第2構件。上述第1構件於自上述基板之厚度方向即第1方向觀察之情形時，具有面向上述第1電子零件之第1壁、與面向上述第2電子零件之開口。上述第2構件具有本體部與支持部。上述本體部於較上述第1壁離上述基板較遠之位置覆蓋上述第2電子零件。上述本體部包含1個以上向上述第2電子零件相反側突出之突起。上述支持部與上述第1構件連接而支持上述本體部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:殼體</p>  
        <p type="p">11:第1主壁(第1壁)</p>  
        <p type="p">11h:貫通孔</p>  
        <p type="p">12:第2主壁</p>  
        <p type="p">13:第1側壁</p>  
        <p type="p">14:第2側壁</p>  
        <p type="p">30:第1蓋構件</p>  
        <p type="p">31:支持部</p>  
        <p type="p">31h:貫通孔</p>  
        <p type="p">40:基座構件</p>  
        <p type="p">41:支持部</p>  
        <p type="p">41h:安裝孔</p>  
        <p type="p">42:開口</p>  
        <p type="p">43:第1散熱片</p>  
        <p type="p">50:第2蓋構件</p>  
        <p type="p">51:本體部</p>  
        <p type="p">52:支持部</p>  
        <p type="p">52A:支持部</p>  
        <p type="p">52B:支持部</p>  
        <p type="p">61:蓋部</p>  
        <p type="p">62:第2散熱片</p>  
        <p type="p">63:立起部</p>  
        <p type="p">64:安裝部</p>  
        <p type="p">64h:安裝孔</p>  
        <p type="p">FS2:緊固構件</p>  
        <p type="p">FS3:緊固構件</p>  
        <p type="p">+X,-X,+Y,-Y,+Z,-Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="790" publication-number="202612535"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612535.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612535</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108401</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括對角線電源圖案的積體電路及其製造方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT INCLUDING DIAGONAL POWER PATTERN AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251204B">H10D89/10</main-classification>  
        <further-classification edition="202501120251204B">H10D84/01</further-classification>  
        <further-classification edition="200601120251204B">H01L23/528</further-classification>  
        <further-classification edition="202001120251204B">G06F30/392</further-classification>  
        <further-classification edition="202001120251204B">G06F30/398</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李運基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WOONKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金炫中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNJOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申成墉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, SEONGYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔仁英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, INYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路包括：標準胞元；電源軌，在第一配線層中在第一方向上延伸且被配置成向標準胞元供應電力；以及上部電源圖案，設置於第一配線層上方的第二配線層中。上部電源圖案包括在第一方向上延伸的多個矩形上部電源貼片，且被配置成向電源軌供應電力。所述多個上部電源貼片的隅角部分在第一方向和與第一方向相交的第二方向之間的方向上彼此交疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit includes a standard cell, a power rail extending in a first direction in a first wiring layer and configured to supply power to the standard cell, and an upper power pattern disposed in a second wiring layer above the first wiring layer. The upper power pattern includes a plurality of rectangular upper power patches extending in the first direction, and configured to supply power to the power rail. Corner portions of the plurality of upper power patches overlap each other in a direction between the first direction and a second direction that intersects the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">61:第一電源貼片</p>  
        <p type="p">62:第二電源貼片</p>  
        <p type="p">63:第三電源貼片</p>  
        <p type="p">CL1、CL2:中心線</p>  
        <p type="p">d1:距離</p>  
        <p type="p">hTR01'、hTR02'、hTR03':路徑</p>  
        <p type="p">L1、L2、L3:長度</p>  
        <p type="p">Mx+1:層</p>  
        <p type="p">p3:間距</p>  
        <p type="p">w1、w2、w3:寬度</p>  
        <p type="p">X:方向/軸</p>  
        <p type="p">Y、Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="791" publication-number="202612090"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612090.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612090</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108435</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>定中心裝置以及基板處理裝置</chinese-title>  
        <english-title>CENTERING DEVICE AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/68</main-classification>  
        <further-classification edition="200601120251210B">H01L21/67</further-classification>  
        <further-classification edition="200601120251210B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梶野一樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJINO, ITSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>正司和大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHOJI, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>篠原遼太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINOHARA, RYOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於抑制周邊溫度的變化所造成的影響並防止基板的定中心精度降低。本發明中，多移動部係在於從鉛直上方的俯視下藉由第二抵接構件及第三抵接構件與第一抵接構件圍繞基板保持部的中心的狀態下，於第一水平方向中使第二抵接構件及第三抵接構件一體地移動。該多移動部係具有：多支撐部，係一體地支撐第二抵接構件及第三抵接構件；以及滑動構件，係在連結於多支撐部的狀態下相對於導引構件於第一水平方向滑動自如地安裝，該導引構件係固定地配置於預定位置。然後，多支撐部及滑動構件係由下述材料所構成：相互的線膨脹係數的差dLE滿足下述不等式：dLE＜AE/(0.8597×dTM)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21C:(自轉基座的)中心</p>  
        <p type="p">32:第二抵接構件</p>  
        <p type="p">33:第三抵接構件</p>  
        <p type="p">36:多移動部</p>  
        <p type="p">321,331:抵接面</p>  
        <p type="p">361:基座構件</p>  
        <p type="p">361a:馬達基座部位</p>  
        <p type="p">361b:線性導引件基座部位</p>  
        <p type="p">362:馬達(驅動部)</p>  
        <p type="p">363:線性導引件</p>  
        <p type="p">363a:軌道(滑動構件)</p>  
        <p type="p">363b:塊體(導引構件)</p>  
        <p type="p">364:多支撐部</p>  
        <p type="p">364a:滑動基座</p>  
        <p type="p">364b:多支撐構件</p>  
        <p type="p">364b1:端部(多支撐部的一端部)</p>  
        <p type="p">364b2:端部(多支撐部的另一端部)</p>  
        <p type="p">365:動力傳遞部</p>  
        <p type="p">365a:小齒輪(第一動力傳遞構件)</p>  
        <p type="p">365b:齒條齒輪(第二動力傳遞構件)</p>  
        <p type="p">365b1:齒部</p>  
        <p type="p">S:基板</p>  
        <p type="p">VS:鉛直虛擬平面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="792" publication-number="202611314"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611314.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611314</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108467</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">C23C14/22</main-classification>  
        <further-classification edition="200601120250801B">C23C14/34</further-classification>  
        <further-classification edition="200601120250801B">C23C14/40</further-classification>  
        <further-classification edition="200601120250801B">C23C14/54</further-classification>  
        <further-classification edition="202501120250801B">H10D88/00</further-classification>  
        <further-classification edition="202301120250801B">H10B99/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱口純一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAGUCHI, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川口裕子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, YUUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福本将之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUMOTO, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在基板面內更均勻地進行電漿處理。 &lt;br/&gt;　　實施方式的電漿處理裝置，係具備：處理腔室，其能夠處理基板；設置在處理腔室內且能夠載置基板的載台；在載置有基板的載台的上方產生電漿的電漿產生部；第一環狀構件，其配置在載置於載台的基板周圍，並且分割成沿圓周方向排列的多個第一環狀構件片；第一移動機構，其透過使多個第一環狀構件片的每一個沿基板的徑向移動，將第一環狀構件移動到與基板構成為同心圓的位置，並相對地變化基板的端部與第一環狀構件的內側的端部之間水平方向的距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:覆蓋環</p>  
        <p type="p">15a,15b,15c,15d:覆蓋環片</p>  
        <p type="p">16a,16b,16c,16d:第一移動機構</p>  
        <p type="p">152:端面</p>  
        <p type="p">155a:第一台階部</p>  
        <p type="p">155b:第二台階部</p>  
        <p type="p">W:基板</p>  
        <p type="p">Ws:端部</p>  
        <p type="p">Xa~Xd:覆蓋環片15a~15d的每一個的外周部在圓周方向等分的點</p>  
        <p type="p">CN:基板W的中心點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="793" publication-number="202611132"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611132.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611132</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108479</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合物、光交聯物、圖案及具備其之電子裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F220/18</main-classification>  
        <further-classification edition="200601120251201B">C08F220/26</further-classification>  
        <further-classification edition="200601120251201B">C08F220/30</further-classification>  
        <further-classification edition="200601120251201B">C08F265/04</further-classification>  
        <further-classification edition="200601120251201B">C08F265/06</further-classification>  
        <further-classification edition="200601120251201B">C08K5/10</further-classification>  
        <further-classification edition="200601120251201B">C08L33/04</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="202501120251201B">H10D30/67</further-classification>  
        <further-classification edition="202301120251201B">H10K59/122</further-classification>  
        <further-classification edition="202301120251201B">H10K85/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東楚股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOSOH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李廷輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNGHWI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥慎也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKU, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種固化性優異的組合物，其含有具有在鹼性溶液的可溶性且能夠以低曝光量進行光交聯而變得不溶解於溶劑中。 &lt;br/&gt;一種組合物，含有以下的(I)～(III)： &lt;br/&gt;(I)含有以下述式(1)所表示的重複單元、與選自由含氟原子的重複單元、含酸性官能基的重複單元及含親水性官能基的重複單元所組成的群組中的一種以上的單元的樹脂 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="320px" width="334px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(II)以下述式(b)、下述式(c)及下述式(d)所表示的群組中的一種以上的光交聯性單體 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="89px" width="438px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="111px" width="674px" file="ed10044.JPG" alt="ed10044.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;(III)敏化劑及/或光起始劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="794" publication-number="202611323"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611323.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611323</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鈷和釕的選擇性沉積及相關結構</chinese-title>  
        <english-title>SELECTIVE DEPOSITION OF COBALT AND RUTHENIUM, AND RELATED STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">C23C16/04</main-classification>  
        <further-classification edition="200601120251204B">C23C16/455</further-classification>  
        <further-classification edition="200601120251204B">C23C16/06</further-classification>  
        <further-classification edition="200601120251204B">C23C16/52</further-classification>  
        <further-classification edition="200601120251204B">H01L21/20</further-classification>  
        <further-classification edition="202501120251204B">C01G51/00</further-classification>  
        <further-classification edition="200601120251204B">C01G55/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　君飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, JUN-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢瑟　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BESSER, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　世輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN,PHILIP S.H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示選擇性地將一鈷或釕晶種層沈積至一半導體基板上之方法、在該半導體基板上形成一導電接觸件之方法及根據此等方法形成之半導體基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described are methods of selectively depositing a cobalt or ruthenium seed layer onto a semiconductor substrate, methods of forming a conductive contact on the semiconductor substrate, and semiconductor substrates formed according to the methods.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體基板</p>  
        <p type="p">102:半導體層</p>  
        <p type="p">104:摻雜半導體區</p>  
        <p type="p">106:介電質層</p>  
        <p type="p">108:介電質側壁</p>  
        <p type="p">110:三維開口特徵部/接觸孔</p>  
        <p type="p">120:矽化物層/矽化物</p>  
        <p type="p">122:襯層/鈦及氮化鈦層</p>  
        <p type="p">124:鎢晶種層</p>  
        <p type="p">126:導電接觸件/鎢接觸件</p>  
        <p type="p">128:中心間隙或「接縫」</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="795" publication-number="202612465"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612465.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612465</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108797</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250609B">H10B41/20</main-classification>  
        <further-classification edition="202301120250609B">H10B41/30</further-classification>  
        <further-classification edition="202301120250609B">H10B41/35</further-classification>  
        <further-classification edition="202301120250609B">H10B43/20</further-classification>  
        <further-classification edition="202301120250609B">H10B43/30</further-classification>  
        <further-classification edition="202301120250609B">H10B43/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>須田圭介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUDA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本實施形態的記憶體元件抑制記憶體元件的不良。實施形態的記憶體元件1包括貼合於第一晶片20的第二晶片10，第二晶片包括：積層體900，包含在與晶片表面垂直的第一方向上排列的多個導電層103；積層體上方的半導體層101a；第一接觸件CC1，貫通多個導電層中的至少第一導電層，與第一導電層連接，包含位於半導體層內的部分；第二接觸件CC1，貫通多個導電層中的至少第二導電層，與第二導電層連接，包含位於半導體層內的部分，在和晶片表面平行的第二方向上與第一接觸件並排；以及分離構件BB1，在第一接觸件與第二接觸件間設置於半導體層內。分離構件的與第一晶片為相反側的沿著第二方向的尺寸較分離構件的第一晶片側的沿著第二方向的尺寸大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:記憶體元件</p>  
        <p type="p">10:陣列晶片(第二晶片、半導體晶片、記憶體胞元陣列晶片、晶片)</p>  
        <p type="p">20:第一晶片(CMOS電路晶片、半導體晶片、CMOS晶片、晶片)</p>  
        <p type="p">90:部分(伸出部)</p>  
        <p type="p">91:部分(突出部)</p>  
        <p type="p">101a、101c:半導體層(矽層)</p>  
        <p type="p">102、102A:絕緣層</p>  
        <p type="p">103:導電層(字元線及選擇閘極線)</p>  
        <p type="p">104:導電體</p>  
        <p type="p">106:配線(位元線)</p>  
        <p type="p">109、125、126、128、129、150b、160、162、165、169、260、269:絕緣層</p>  
        <p type="p">111:焊墊(電極、導電層、導電體)</p>  
        <p type="p">120:金屬層(源極線)</p>  
        <p type="p">121:絕緣層(氧化矽層)</p>  
        <p type="p">127、163、205、209:配線</p>  
        <p type="p">142:記憶體層</p>  
        <p type="p">143:半導體層</p>  
        <p type="p">144:芯層</p>  
        <p type="p">150a:絕緣層(側壁間隔膜)</p>  
        <p type="p">151:絕緣體</p>  
        <p type="p">155:絕緣膜</p>  
        <p type="p">161:導電體(通孔插塞)</p>  
        <p type="p">164:導電體</p>  
        <p type="p">200:半導體基板</p>  
        <p type="p">202:閘極絕緣層</p>  
        <p type="p">203:閘極電極</p>  
        <p type="p">204、208、210:導電體(插塞)</p>  
        <p type="p">211:電極(焊墊)</p>  
        <p type="p">900:積層體</p>  
        <p type="p">BB1、BB2:分離構件(絕緣體)</p>  
        <p type="p">BF:貼合面</p>  
        <p type="p">BP:貼合焊墊(虛擬焊墊)</p>  
        <p type="p">CA:接觸區</p>  
        <p type="p">CC1:接觸件(第一接觸件、第二接觸件、接觸插塞)</p>  
        <p type="p">CC2:接觸件(接觸插塞)</p>  
        <p type="p">CX、CZ:接觸件(導電體)</p>  
        <p type="p">DA:平面分離區</p>  
        <p type="p">DM:虛擬層</p>  
        <p type="p">HR:支撐構件(氧化矽柱)</p>  
        <p type="p">MA:記憶體胞元陣列區</p>  
        <p type="p">MP:記憶體柱</p>  
        <p type="p">TR:電晶體</p>  
        <p type="p">X、Y、Z1、Z2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="796" publication-number="202612320"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612320.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612320</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108856</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>投影映射校正系統、方法及其非暫態電腦可讀取記錄媒體</chinese-title>  
        <english-title>PROJECTION MAPPING CALIBRATION SYSTEM, METHOD, AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H04N9/31</main-classification>  
        <further-classification edition="200601120250401B">G03B21/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭家堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIAU, JIA-YAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林邑城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種投影映射校正系統、方法及其非暫態電腦可讀取記錄媒體。該系統擷取對應一投影目標物體之一影像幀。該系統計算該影像幀中對應該投影目標物體的複數個特徵點。該系統投影一光雕影像至該投影目標物體上。該系統擷取對應該光雕影像之一光雕影像幀。該系統計算該光雕影像幀中對應該投影目標物體的複數個光雕特徵點。該系統基於該等特徵點及該等光雕特徵點各者之一差異值，產生對應該光雕影像之一投影映射校正。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A projection mapping calibration system, method, and non-transitory computer readable storage medium thereof are provided. The system captures an image frame corresponding to a projection target object. The system calculates a plurality of feature points corresponding to the projection target object in the image frame. The system projects a light sculpting image onto the projection target object. The system captures a light sculpting image frame corresponding to the light sculpting image. The system calculates a plurality of light sculpting feature points corresponding to the projection target object in the light sculpting image frame. The system generates a projection mapping calibration corresponding to the light sculpting image based on a difference value of each of the feature points and the light sculpting feature points.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:投影映射校正方法</p>  
        <p type="p">S501、S503、S505、S507、S509:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="797" publication-number="202611137"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611137.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611137</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F220/26</main-classification>  
        <further-classification edition="200601120251201B">C08F8/48</further-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本觸媒股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON SHOKUBAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村倫明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平間進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAMA, SUSUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光學膜，其於圖像顯示裝置中即便替換TAC膜亦不需要調整除偏光器保護膜以外之元件之光學特性，且耐濕熱性優異。一種光學膜，其特徵在於：其係由包含(甲基)丙烯酸樹脂之樹脂組成物構成之光學膜，前述樹脂組成物之玻璃轉移溫度為110至160℃，前述(甲基)丙烯酸樹脂包含呈現正極化率各向異性之結構單元(p)與呈現負極化率各向異性之結構單元(q)，前述結構單元(q)包含源自(甲基)丙烯酸烷基酯之結構單元(q1)，於波長400 nm、550 nm及700 nm之光下測定時，面內相位差Re之絕對值均為0至2 nm，厚度方向之相位差Rth之絕對值均為4至20 nm，於入射角45度且波長為λ(nm)之光下測定時之相位差之絕對值為R(45, λ)時，R(45, 400)/R(45, 550)為1.1以上，並且R(45, 550)/R(45, 700)大於1。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="798" publication-number="202612578"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612578.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612578</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250708B">H10N50/10</main-classification>  
        <further-classification edition="202301120250708B">H10N50/80</further-classification>  
        <further-classification edition="202301120250708B">H10N50/85</further-classification>  
        <further-classification edition="202301120250708B">H10B61/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤田和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWADA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>及川忠昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OIKAWA, TADAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>及川壮一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OIKAWA, SOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田健二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可抑制磁阻效應元件之性能之劣化之磁性記憶裝置。&lt;br/&gt;實施形態之磁性記憶裝置包含磁阻效應元件。磁阻效應元件包含：第1鐵磁性層，第2鐵磁性層，第3鐵磁性層，設置於第1鐵磁性層與第2鐵磁性層之間之第1非磁性層，設置於第2鐵磁性層與第3鐵磁性層之間之第2非磁性層，含有選自銥(Ir)、鉑(Pt)、金(Au)、銠(Rh)、鈀(Pd)、銀(Ag)、鎳(Ni)、及銅(Cu)之至少1種元素之第3非磁性層，含有選自鉭(Ta)、鎢(W)、鈮(Nb)、鉬(Mo)、釩(V)、及鉻(Cr)之至少1種元素之第4非磁性層，及含有矽(Si)及鍺(Ge)之至少1種元素之第5非磁性層。第2鐵磁性層位於第1鐵磁性層與第3鐵磁性層之間。第3鐵磁性層位於第2非磁性層與第3非磁性層之間。第4非磁性層位於第3非磁性層與第5非磁性層之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31,32,34,35b,36,38a,38b,38c:非磁性層</p>  
        <p type="p">33,35a,35c,37:鐵磁性層</p>  
        <p type="p">35,38:積層體</p>  
        <p type="p">A1,A2:箭頭</p>  
        <p type="p">BUF:緩衝層</p>  
        <p type="p">bcc:體心立方</p>  
        <p type="p">CAP:覆蓋層</p>  
        <p type="p">fcc:面心立方</p>  
        <p type="p">FL:功能層</p>  
        <p type="p">MRL:主參考層</p>  
        <p type="p">MTJ:磁阻效應元件</p>  
        <p type="p">RL:參考層</p>  
        <p type="p">SCL:移位消除層</p>  
        <p type="p">SL:記憶層</p>  
        <p type="p">SP:間隔層</p>  
        <p type="p">TB:穿隧障壁層</p>  
        <p type="p">TOP:頂層</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="799" publication-number="202610838"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610838.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610838</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109190</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防霧性多層膜、使用其之積層體、及包裝材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">B32B33/00</main-classification>  
        <further-classification edition="200601120251204B">C09K3/18</further-classification>  
        <further-classification edition="200601120251204B">B32B27/36</further-classification>  
        <further-classification edition="200601120251204B">B32B27/32</further-classification>  
        <further-classification edition="200601120251204B">B65D65/40</further-classification>  
        <further-classification edition="202501120251204B">A23B2/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>町田雄太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACHIDA, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浜崎桂輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMASAKI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鏑木悠城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABURAGI, YUUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種多層膜、具有上述多層膜之積層體、使用上述積層體之包裝材、作為食品包裝容器之蓋材之上述包裝材、及以上述包裝材作為蓋材之食品包裝容器，上述多層膜包含密封層（A）、及與上述密封層（A）相鄰之樹脂層（B），上述密封層（A）包含聚酯系樹脂（a）、防霧劑及聚伸烷基二醇，上述樹脂層（B）包含酸改質聚烯烴及聚酯系樹脂（b），且上述食品包裝容器之與上述蓋材接著之部分含有聚酯系樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="800" publication-number="202612200"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612200.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612200</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>DUV光源及操作方法</chinese-title>  
        <english-title>DUV LIGHT SOURCE AND METHOD OF OPERATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01S3/036</main-classification>  
        <further-classification edition="200601120251201B">H01S3/225</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商希瑪有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CYMER, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加格　阿尤許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARG, AYUSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米納凱斯　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINAKAIS, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉斯　史班瑟　萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, SPENCER RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐布萊恩　凱文　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>O'BRIEN, KEVIN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於替換一深紫外線(DUV)光源之一雷射腔室中之一氣體雷射介質的程序，其包括：基於以下中之至少一者而選擇用於替換該雷射腔室中包括氟之該氣體雷射介質的一目標抽氣壓力：(a)該雷射腔室之一時間年限及/或一脈衝計數年限，(b)該雷射腔室中之該氣體之一時間年限及/或一脈衝計數年限，及(c)該雷射腔室之一或多個效能量測；將該雷射腔室中之該氣體之該壓力降低至該目標抽氣壓力；及將更多氣體添加至該雷射腔室以將該雷射腔室中之該氣體之該壓力增加直至一操作壓力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for replacing a gas lasing medium in a laser chamber of a deep ultraviolet (DUV) light source includes: selecting a target pumpdown pressure for replacing the gas lasing medium including fluorine in the laser chamber based on at least one of: (a) a temporal age and/or a pulse-count age of the laser chamber, (b) a temporal age and/or a pulse-count age of the gas in the laser chamber, and (c) one or more performance measures of the laser chamber; reducing the pressure of the gas in the laser chamber to the target pumpdown pressure; and adding more gas to the laser chamber to increase the pressure of the gas in the laser chamber up to an operating pressure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">330:程序</p>  
        <p type="p">331:事項</p>  
        <p type="p">332:事項</p>  
        <p type="p">333:事項</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="801" publication-number="202611405"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611405.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611405</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109333</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣脈衝產生裝置的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF AIR-PULSE GENERATING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250704B">F04B45/047</main-classification>  
        <further-classification edition="200601120250704B">H04R1/32</further-classification>  
        <further-classification edition="200601120250704B">H04R31/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商知微電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XMEMS LABS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　家強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, ELDWIN JIAQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任頡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, JYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　振宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, JEMM YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種氣脈衝產生裝置的製造方法，其包括：提供晶圓，其中晶圓包括第一層與第二層；圖案化晶圓的第一層，以形成具有來回彎折樣式的縫隙；以及移除第二層的第一部。第一層中位於第二層的已移除的第一部上的一部分形成膜結構，具有來回彎折樣式的縫隙將膜結構分隔成第一瓣片與第二瓣片，具有來回彎折樣式的縫隙在第一方向來回彎折並向第二方向延伸，氣脈衝產生裝置透過致動膜結構以產生多個氣脈衝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of an air-pulse generating device is provided. The manufacturing method includes: providing a wafer including a first layer and a second layer; patterning the first layer of the wafer to form a slit with a zigzagging pattern; and removing a first part of the second layer. A portion of the first layer above the removed first part of the second layer forms a film structure. The slit with the zigzagging pattern separates the film structure into a first flap and a second flap. The slit with the zigzagging pattern zigzags in a back-and-forth manner among a first direction and extends toward a second direction. The air-pulse generating device produces a plurality of air pulses by actuating the film structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:膜結構</p>  
        <p type="p">110:錨定結構</p>  
        <p type="p">200:氣脈衝產生裝置</p>  
        <p type="p">212:縫隙</p>  
        <p type="p">AM:致動材料</p>  
        <p type="p">ATR:致動器</p>  
        <p type="p">CPS:補償氧化物層</p>  
        <p type="p">CT1:第一導電層</p>  
        <p type="p">CT2:第二導電層</p>  
        <p type="p">CV:覆蓋層</p>  
        <p type="p">E1,E2:電極</p>  
        <p type="p">PD:連接墊</p>  
        <p type="p">SIL:隔離絕緣層</p>  
        <p type="p">WL1:第一層</p>  
        <p type="p">WL1a:上表面</p>  
        <p type="p">WL2:第二層</p>  
        <p type="p">WL3:絕緣層</p>  
        <p type="p">WF:晶圓</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="802" publication-number="202611600"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611600.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611600</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109340</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250327B">G02F1/133</main-classification>  
        <further-classification edition="200601120250327B">G02F1/13357</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃美蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MEI-LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">顯示裝置，包括一基板、一液晶層、一加熱單元以及一平坦層，基板包括一周邊區及一顯示區，周邊區環繞顯示區，液晶層設置於基板上，加熱單元設置於基板的周邊區上，平坦層設置於基板上，平坦層於周邊區部分重疊加熱單元，加熱單元於基板的周邊區上的投影面積與平坦層於基板的周邊區上的投影面積的比值範圍是落在大於或等於1。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The display device includes a substrate, a liquid crystal layer, a heating unit and a flat layer. The substrate includes a peripheral area and a display area. The peripheral area surrounds the display area. The liquid crystal layer is arranged on the substrate. The heating unit is arranged on the peripheral area of ​​the substrate. The flat layer is arranged on the substrate. The flat layer partially overlaps the heating unit in the peripheral area. The ratio range of the projected area of ​​the heating unit on the peripheral area of ​​the substrate and the projected area of ​​the flat layer on the peripheral area of ​​the substrate is greater than or equal to 1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100F:顯示裝置</p>  
        <p type="p">140:平坦層</p>  
        <p type="p">150d:加熱單元</p>  
        <p type="p">150e:加熱單元</p>  
        <p type="p">AA:區域</p>  
        <p type="p">CU:控制元件</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">DA:顯示區</p>  
        <p type="p">NA:周邊區</p>  
        <p type="p">SM:遮光金屬</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="803" publication-number="202611967"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611967.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611967</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109393</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脈衝計分系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD OF PULSE SCORING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01J37/32</main-classification>  
        <further-classification edition="200601120251201B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>品川淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINAGAWA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方克　梅瑞特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNK, MERRITT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連恩　巴頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANE, BARTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬萊耶夫　伊凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALEEV, IVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩西　賈斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOSES, JUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉斯　克里斯強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里德哈蘭　希亞姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRIDHAR, SHYAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡特薩克　彼得　洛威爾　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENTZEK, PETER LOWELL GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山澤陽平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAWA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口雅司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>持木宏政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOCHIKI, HIROMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大秦充敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHATA, MITSUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種脈衝計分方法。該方法包含執行電漿製程，該電漿製程在第一狀態和第二狀態之間進行脈衝處理。在執行電漿製程的同時，收集由原位感測器所測量的原位資料。處理原位資料以獲得第一狀態的第一脈衝特徵和第二狀態的第二脈衝特徵。在執行電漿製程之後收集度量資料。分析第一脈衝特徵、第二脈衝特徵和度量資料以決定脈衝分數，這些脈衝分數係為第一脈衝特徵和第二脈衝特徵的交互作用項，並且在迴歸分析中與度量資料具有高於目標閾值的相關性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of pulse scoring is provided. The method includes executing a plasma process pulsed between a first state and a second state. In-situ data measured by in-situ sensors are collected while the plasma process is being executed. The in-situ data are processed to obtain first pulse features of the first state and second pulse features of the second state. Metrology data are collected after executing the plasma process. The first pulse features, the second pulse features and the metrology data are analyzed to determine pulse scores that are interaction terms of the first pulse features and the second pulse features and have correlations above a target threshold with the metrology data in regression analysis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:脈衝計分程序/程序</p>  
        <p type="p">101、110、111、113、115、120、121、123、130、131、133、140、141、143、145:方塊</p>  
        <p type="p">103:資料</p>  
        <p type="p">105:脈衝分數</p>  
        <p type="p">150:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="804" publication-number="202611142"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611142.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611142</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多階段聚合物，其製備方法及包含彼之黏著劑組成物</chinese-title>  
        <english-title>MULTISTAGE POLYMER, ITS METHOD OF PREPARATION AND ADHESIVE COMPOSITION COMPRISING IT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F265/06</main-classification>  
        <further-classification edition="200601120251201B">C08F279/02</further-classification>  
        <further-classification edition="200601120251201B">C08F283/12</further-classification>  
        <further-classification edition="200601120251201B">C08F285/00</further-classification>  
        <further-classification edition="200601120251201B">C08F220/14</further-classification>  
        <further-classification edition="200601120251201B">C08F220/54</further-classification>  
        <further-classification edition="200601120251201B">C08F222/10</further-classification>  
        <further-classification edition="200601120251201B">C08L51/00</further-classification>  
        <further-classification edition="200601120251201B">C09J151/00</further-classification>  
        <further-classification edition="200601120251201B">C09J4/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商艾克瑪公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARKEMA FRANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇芬　艾琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUFFIN, ALINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊諾里　雷比</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUBLI, RABI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是關於一種多階段聚合物、其製備方法及包含該多階段聚合物之黏著劑組成物。 &lt;br/&gt;　　特別地，本發明是關於包含官能基之多階段聚合物組成物、其製備方法、其作為衝擊改質劑之用途及包含該多階段聚合物組成物之黏著劑組成物。 &lt;br/&gt;　　更具體而言，本發明是關於包含官能基之多階段聚合物組成物、其製備方法、其作為衝擊改質劑之用途及包含該多階段聚合物組成物之(甲基)丙烯酸黏著劑組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a multistage polymer, its process of preparation and an adhesive composition comprising it. &lt;br/&gt;In particular, the present invention relates to multistage polymer composition comprising functional groups, its process of preparation, its use as impact modifier and an adhesive composition comprising it. &lt;br/&gt;More particularly the present invention relates to a multistage polymer composition comprising functional groups, its process of preparation, its use as impact modifier and a (meth)acrylic adhesive composition comprising it.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="805" publication-number="202611727"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611727.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611727</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109651</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>共享記憶體裝置及包括共享記憶體裝置之記憶體系統</chinese-title>  
        <english-title>SHARED MEMORY DEVICE AND MEMORY SYSTEM INCLUDING SHARED MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250701B">G06F12/08</main-classification>  
        <further-classification edition="200601120250701B">G06F15/167</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河承俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, SEUNGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇鎭麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SO, JININ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNGHAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種共享記憶體裝置，其包括：一記憶體排組，其儲存第一原始資料，該第一原始資料對應於儲存在處理器當中之一第一處理器中的一第一快取行；一監聽過濾器電路，其包括對應於該第一快取行之一第一監聽過濾器條目及對應於該第一監聽過濾器條目之一第一條目存取計數；以及一遷移管理電路，其基於該第一條目存取計數來判定該第一快取行之一熱度且基於該熱度向該第一處理器發出對該第一原始資料之一遷移請求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A shared memory device includes a memory bank that stores first raw data corresponding to a first cache line stored in a first processor among processors, a snoop filter circuit including a first snoop filter entry corresponding to the first cache line and a first entry access count corresponding to the first snoop filter entry, and a migration management circuit that determines a hotness of the first cache line based on the first entry access count and issues a migration request for the first raw data to the first processor based on the hotness.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第一處理器</p>  
        <p type="p">11a:第一快取記憶體</p>  
        <p type="p">11b:資料遷移器</p>  
        <p type="p">12:第二處理器</p>  
        <p type="p">12a:第二快取記憶體</p>  
        <p type="p">100:共享記憶體裝置</p>  
        <p type="p">110:監聽過濾器電路</p>  
        <p type="p">120:遷移管理電路</p>  
        <p type="p">130:後向監聽電路</p>  
        <p type="p">BNK:記憶體排組</p>  
        <p type="p">DMD1:第一專用記憶體裝置</p>  
        <p type="p">DMD2:第二專用記憶體裝置</p>  
        <p type="p">EAC:條目存取計數</p>  
        <p type="p">IFC_SM:共享記憶體介面電路</p>  
        <p type="p">MS:記憶體系統</p>  
        <p type="p">SFE:監聽過濾器條目</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="806" publication-number="202611572"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611572.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611572</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109702</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種光子積體電路結構及其製作方法</chinese-title>  
        <english-title>PHOTONIC INTEGRATED CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250411B">G02B6/12</main-classification>  
        <further-classification edition="200601120250411B">H01S5/20</further-classification>  
        <further-classification edition="200601120250411B">H01S5/30</further-classification>  
        <further-classification edition="200601120250411B">G02B6/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商陝西源傑半導體科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUANJIE SEMICONDUCTOR TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張振甯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHENNING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李馬惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MAHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MU, YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏來嚴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, LAIYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種光子積體電路結構及其製作方法，屬於半導體雷射技術領域，能夠有效達成積體電路中各獨立元件之間的 P\N 電隔離，從而對元件進行 P\N 雙側射頻驅動。所述光子積體電路結構包括：基板；緩衝區，位於基板上；底部導電層，位於緩衝區上，其包括多個底部導電區，相鄰兩個底部導電區之間設有底部隔離區，底部隔離區用於將相鄰兩個底部導電區隔離；底部隔離區與相鄰的底部導電區中摻雜雜質的類型相反；核心層，其包括多個核心區，核心區與底部導電區相互對應；頂部導電層，其包括多個頂部導電區，頂部導電區與核心區相互對應，相鄰兩個頂部導電區之間具有頂部隔離區。本發明用於光子積體電路中各獨立元件之間的 P\N 電隔離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a photonic integrated chip structure and a manufacturing method thereof and belongs to the technical field of semiconductor lasers, which can effectively implement P/N electrical isolation between various discrete devices in an integrated chip, thereby performing P/N dual-side radio frequency driving on the devices. The photonic integrated chip structure includes: a substrate; a buffer layer, formed on the substrate; a bottom conductive layer, formed on the buffer layer, where the bottom conductive layer includes a plurality of bottom conductive regions, a bottom isolation region is disposed between two adjacent bottom conductive regions, the bottom isolation region is configured to isolate the two adjacent bottom conductive regions, and the bottom isolation region has an opposite doped impurity type to the adjacent bottom conductive region; a core layer, where the core layer includes a plurality of core regions, and the core regions are in a one-to-one correspondence with the bottom conductive regions; and a top conductive layer, where the top conductive layer includes a plurality of top conductive regions, the top conductive regions are in a one-to-one correspondence with the core regions, and a top isolation region is formed between two adjacent top conductive regions. The present invention is configured for the P/N electrical isolation between the various discrete devices in the photonic integrated chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一子元件</p>  
        <p type="p">200:第二子元件</p>  
        <p type="p">10:基板</p>  
        <p type="p">20:緩衝區</p>  
        <p type="p">31:第一底部導電區</p>  
        <p type="p">32:第二底部導電區</p>  
        <p type="p">33:底部隔離區</p>  
        <p type="p">34:底部隔離層</p>  
        <p type="p">41:第一核心區</p>  
        <p type="p">42:第二區核心區</p>  
        <p type="p">43:光傳輸區</p>  
        <p type="p">44:第一核心層</p>  
        <p type="p">51:第一頂部導電區</p>  
        <p type="p">52:第二頂部導電區</p>  
        <p type="p">53:頂部隔離區</p>  
        <p type="p">54:第一導電層</p>  
        <p type="p">61:第一薄膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="807" publication-number="202612083"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612083.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612083</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109722</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬運裝置及供氣方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/677</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笠間一樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASAMA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豊巻俊明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOMAKI, TOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的係在對處理基板之處理裝置搬入搬出基板等的搬運裝置中，對搬運空間及與該搬運空間鄰接的儲存空間兩者形成適當之氣流。&lt;br/&gt; 本發明係一種對處理基板之處理裝置搬入搬出基板的搬運裝置，其包含：具有設置搬運該基板之搬運機器人的搬運空間；及連接於該搬運空間並支持該基板的儲存空間的本體部。該本體部包含：配置於該搬運空間之上方並送出供給至該搬運空間之氣體的第一風扇過濾單元；與該第一風扇過濾單元分開設置並送出供給至該儲存空間之氣體的第二風扇過濾單元；將從該第二風扇過濾單元送出之氣體供給至該儲存空間的供氣路徑；及將供給至該儲存空間之氣體進行排氣的排氣路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:搬運裝置</p>  
        <p type="p">110:搬運機器人</p>  
        <p type="p">120:殼體</p>  
        <p type="p">120A:壁部</p>  
        <p type="p">123:側壁</p>  
        <p type="p">123a:側面</p>  
        <p type="p">124:底壁</p>  
        <p type="p">125:頂棚壁</p>  
        <p type="p">128:開口部</p>  
        <p type="p">131:分隔壁</p>  
        <p type="p">132A:開口部</p>  
        <p type="p">240:支持台</p>  
        <p type="p">250:排氣容器</p>  
        <p type="p">260:第一FFU</p>  
        <p type="p">720:第二FFU</p>  
        <p type="p">D:供氣路徑</p>  
        <p type="p">E:排氣路徑</p>  
        <p type="p">S1:搬運空間</p>  
        <p type="p">S2:收納空間</p>  
        <p type="p">S11:儲存空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="808" publication-number="202612049"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612049.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612049</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109794</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配方設定裝置、配方設定方法及程式</chinese-title>  
        <english-title>RECIPE SETTING DEVICE, RECIPE SETTING METHOD, AND PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/67</main-classification>  
        <further-classification edition="200601120251201B">G05B19/418</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>靏田豊久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUDA, TOYOHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村直人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之配方設定裝置130，包含：配方記憶部131，其記憶表示基板處理條件的基準配方；偏置記憶部132，其以與基準配方互相對應的方式記憶包含分別對應複數個模組的複數個偏置值在內的偏置表；選擇部133，其從複數個模組選擇1個模組；偏置值抽出部134，其從複數個偏置值抽出與所選擇的模組對應的偏置值；以及配方產生部135，其根據基準配方以及所抽出的偏置值，產生令所選擇的該1個模組實行的處理配方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A recipe setting device 130 comprises a recipe storage section 131 which stores standard recipes indicating conditions for substrate processing, an offset storage section 132 which contains an offset table that maps a plurality of offset values, each corresponding to one of a plurality of modules, to standard recipes, a selection section 133 which selects one module from the plurality of modules, an offset value extraction section 134 which extracts the offset value corresponding to the selected module from the plurality of offset values, and a recipe generation section 135 which generates a processing recipe to apply to the selected module based on the standard recipe and the extracted offset value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:處理站</p>  
        <p type="p">100:控制裝置</p>  
        <p type="p">110:基板處理控制部</p>  
        <p type="p">120:膜厚算出部</p>  
        <p type="p">130:配方設定裝置</p>  
        <p type="p">131:配方記憶部</p>  
        <p type="p">132:偏置記憶部</p>  
        <p type="p">133:選擇部</p>  
        <p type="p">134:偏置值抽出部</p>  
        <p type="p">135:配方產生部</p>  
        <p type="p">136:偏置編輯部</p>  
        <p type="p">137:偏置變更部</p>  
        <p type="p">138:條件記憶部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="809" publication-number="202611633"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611633.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611633</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109932</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濾色器用感光性組成物、膜、濾光器、固體攝影元件、圖像顯示裝置、及紅外線感測器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G03F7/004</main-classification>  
        <further-classification edition="200601120251201B">G03F7/075</further-classification>  
        <further-classification edition="200601120251201B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋翊絢股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYO VISUAL SOLUTIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤慶一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種感光性組成物、濾光器、圖像顯示裝置、固體攝影元件、及紅外線感測器。所述感光性組成物可形成保存穩定性良好、不易產生顯影斑點及逸氣、低溫硬化步驟後的耐溶劑性優異的膜。一種濾色器用感光性組成物，包含：鹼可溶性樹脂（A）、聚合性化合物（B）、及光聚合起始劑（C），所述濾色器用感光性組成物中，所述光聚合起始劑（C）包含經由連結基而鍵結的光聚合起始劑多聚物（C1），所述連結基包含伸烷氧基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:紅外線感測器</p>  
        <p type="p">110:固體攝影元件</p>  
        <p type="p">111:紅外線截止濾波器</p>  
        <p type="p">112:濾色器</p>  
        <p type="p">113:紅外線透射濾波器</p>  
        <p type="p">114:樹脂膜</p>  
        <p type="p">115:微透鏡</p>  
        <p type="p">116:平坦膜</p>  
        <p type="p">h:入射光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="810" publication-number="202611279"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611279.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611279</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體器件處理用組成物、修飾基板之製造方法、積層體之製造方法、電子器件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C11D7/24</main-classification>  
        <further-classification edition="200601120251201B">C11D7/32</further-classification>  
        <further-classification edition="200601120251201B">C11D7/36</further-classification>  
        <further-classification edition="200601120251201B">C11D7/50</further-classification>  
        <further-classification edition="200601120251201B">H01L21/314</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村松航太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAMATSU, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下重直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOJU, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤克哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, KATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土村智孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIMURA, TOMOTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠形成ALD抑制性優異、且在ALD處理後的去除處理中容易去除的被膜之半導體器件處理用組成物、以及修飾基板之製造方法、積層體之製造方法、及電子器件之製造方法。本發明之半導體器件處理用組成物，係包含具有至少一個與基板相互作用的特定官能基的化合物之半導體器件處理用組成物，其中，上述化合物之分子量為2000以下，上述化合物中除上述特定官能基外的分子結構之ClogP為10.3以上，上述特定官能基為鹼性官能基或酸性官能基，當上述特定官能基為上述鹼性官能基時，質子加成於上述鹼性官能基而得到的上述化合物的共軛酸之酸解離常數為7.0以上，當上述特定官能基為上述酸性官能基時，質子從上述酸性官能基解離時的上述化合物之酸解離常數為5.0以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="811" publication-number="202610916"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610916.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610916</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109965</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送系統</chinese-title>  
        <english-title>CONVEYANCE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B65G35/08</main-classification>  
        <further-classification edition="200601120251201B">B65G54/02</further-classification>  
        <further-classification edition="200601120251201B">H02K41/03</further-classification>  
        <further-classification edition="200601120251201B">B23Q1/60</further-classification>  
        <further-classification edition="200601220251201B">B23Q7/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＨＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山中修平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANAKA, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崎山周治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKIYAMA, SHUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種搬送系統，可增加系統全體的處理量。在複數個滑塊(5)於包含往路(2)及返路(3)之循環路(6)進行循環的搬送系統(1)中，其具備有可使3個移位模組(7a、7b、7c)移動而切換至通常搬送位置與往工件處理裝置之工件投入位置的移位軸(7)。於通常搬送位置中，自3個移位模組(7a、7b、7c)選出2個之第1組合移位模組(7a、7b)被連結於往路模組(2a)及返路模組(3a)。於工件投入位置中，自3個移位模組(7a、7b、7c)選出2個之第2組合移位模組(7b、7c)被連結於往路模組(2a)及返路模組(3a)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a conveyance system capable of increasing the handling capacity of the whole system. The conveyance system (1), with a plurality of sliding blocks (5) circulating in a circulation passage (6) which includes an outward passage (2) and a return passage (3), comprises shift shafts (7) which move three shift modules (7a, 7b, 7c) and switch them to a normal conveyance position and a workpiece drop-in position toward a workpiece handling device. In the normal conveyance position, a first combination of two shift modules (7a, 7b) selected from the three shift modules (7a, 7b, 7c) is connected with outward passage modules (2a) and return passage modules (3a). In the workpiece drop-in position, a second combination of two shift modules (7b, 7c) selected from the three shift modules (7a, 7b, 7c) is connected with the outward passage modules (2a) and the return passage modules (3a).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:搬送系統</p>  
        <p type="p">2:往路</p>  
        <p type="p">2a:往路模組</p>  
        <p type="p">3:返路</p>  
        <p type="p">3a:返路模組</p>  
        <p type="p">5:滑塊</p>  
        <p type="p">6:循環路</p>  
        <p type="p">7:移位軸</p>  
        <p type="p">7a:往路移位模組(移位模組)</p>  
        <p type="p">7b:往路返路兼用移位模組(移位模組)</p>  
        <p type="p">7c:返路移位模組(移位模組)</p>  
        <p type="p">8、9:循環軸</p>  
        <p type="p">8a、9a:移位模組</p>  
        <p type="p">10、11:工作台</p>  
        <p type="p">A~C:工件處理裝置</p>  
        <p type="p">P1:開始端</p>  
        <p type="p">P2:終端</p>  
        <p type="p">P3:開始端</p>  
        <p type="p">P4:終端</p>  
        <p type="p">W:工件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="812" publication-number="202612530"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612530.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612530</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109992</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路以及用於形成積體電路的佈局和方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT, AND LAYOUT AND METHOD FOR FORMING INTEGRATED CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251023B">H10D84/01</main-classification>  
        <further-classification edition="202501120251023B">H10D84/83</further-classification>  
        <further-classification edition="200601120251023B">H01L21/768</further-classification>  
        <further-classification edition="200601120251023B">H01L23/528</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳顗伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧麒友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周雅琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YA-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫承霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHEN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">積體電路包括相鄰的多個單元，多個單元中的每個單元對應於各自的電路元件。多個單元中的每個單元包括：沿著第一側向方向延伸的多個主動區；沿著垂直於第一側向方向的第二側向方向延伸並橫跨一個或多個主動區的多個閘極結構；沿著第一側向方向延伸並垂直配置在多個閘極結構上方的多個第一內連線結構；以及沿著第二側向方向延伸並垂直配置在多個第一內連線結構上方的多個第二內連線結構。多個第二內連線結構中的每一者沿著第一側向方向與多個閘極結構中的相應結構位移一距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit includes a plurality of cells abutted to one another, each of the plurality of cells corresponding to a respective circuit component. Each of the plurality of cells includes: a plurality of active regions extending along a first lateral direction; a plurality of gate structures extending along a second lateral direction perpendicular to the first lateral direction and traversing one or more of the plurality of active regions; a plurality of first interconnect structures extending along the first lateral direction and vertically disposed above the plurality of gate structure; and a plurality of second interconnect structures extending along the second lateral direction and vertically disposed above the plurality of first interconnect structures. Each of the plurality of second interconnect structures is shifted from a corresponding one of the plurality of gate structures with a distance along the first lateral direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:標準胞元</p>  
        <p type="p">101:胞元邊界</p>  
        <p type="p">102、104:主動區</p>  
        <p type="p">110、112、114、116、118、120:閘極結構</p>  
        <p type="p">121-1、121-2、121-3、121-4、121-5:內連線結構/MD</p>  
        <p type="p">122、124、126、128、130:通孔結構/VD</p>  
        <p type="p">132、134、136、138:通孔結構/VG</p>  
        <p type="p">140、142、144、146、148、150、152、154:內連線結構/M0軌道</p>  
        <p type="p">156、158、160、162、164:通孔結構/V0</p>  
        <p type="p">166、168、170、172、174:內連線結構/M1軌道</p>  
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;:間距/距離</p>  
        <p type="p">D&lt;sub&gt;2&lt;/sub&gt;:距離</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="813" publication-number="202611094"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611094.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611094</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110079</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鹼性顯影型感光性樹脂組成物、乾膜、硬化物及印刷配線板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F2/44</main-classification>  
        <further-classification edition="200601120251201B">C08F290/00</further-classification>  
        <further-classification edition="200601120251201B">C08G59/14</further-classification>  
        <further-classification edition="200601120251201B">C08G59/20</further-classification>  
        <further-classification edition="200601120251201B">C08G59/40</further-classification>  
        <further-classification edition="200601120251201B">C08G8/28</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/031</further-classification>  
        <further-classification edition="200601120251201B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商太陽控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三谷毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITANI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田晉一朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, SHINICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鹼性顯影型感光性樹脂組成物，係含有含羧基樹脂、環氧系熱硬化性成分、(甲基)丙烯酸單體及光聚合引發劑者；並且，羧基相對於環氧基之當量比(羧基當量/環氧當量)為5.0~8.0；且，環氧系熱硬化性成分含有酚醛清漆型環氧樹脂與軟化點為70℃~120℃之二官能型結晶性環氧樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="814" publication-number="202612562"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612562.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612562</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110170</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250401B">H10H29/80</main-classification>  
        <further-classification edition="202501120250401B">H10H29/856</further-classification>  
        <further-classification edition="200601120250401B">G09F9/33</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡順源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, SHUN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佳慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIA-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛立維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, LI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置，包含一第一基板；一第二基板，與該第一基板相鄰設置，其中，該第一基板與該第二基板之間具有一拼接縫；多個發光元件，分別設置於該第一基板與該第二基板上；一覆蓋層，設置於該第一基板和該第二基板上，且該覆蓋層覆蓋該多個發光元件；以及一低穿透率膜，設置於該覆蓋層上，其中，於該電子裝置的法線方向上，該低穿透率膜與該拼接縫重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided, which comprises: a first substrate; a second substrate disposed adjacent to the first substrate, wherein there is a tiling gap between the first substrate and the second substrate; a plurality of light emitting elements respectively disposed on the first substrate and the second substrate; a cover layer disposed on the first substrate and the second substrate, and the cover layer covers the plurality of light emitting elements; and a low light transmittance film disposed on the cover layer, wherein in a normal direction of the electronic device, the low light transmittance film overlaps the tiling gap.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電路板</p>  
        <p type="p">21:第一基板</p>  
        <p type="p">22:第二基板</p>  
        <p type="p">3:發光元件</p>  
        <p type="p">4:覆蓋層</p>  
        <p type="p">5:低穿透率膜</p>  
        <p type="p">6:黏著層</p>  
        <p type="p">C1:電連接件</p>  
        <p type="p">G1:第一拼接縫</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:法線方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="815" publication-number="202612522"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612522.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612522</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250917B">H10D64/01</main-classification>  
        <further-classification edition="202501120250917B">H10D64/20</further-classification>  
        <further-classification edition="202501120250917B">H10D62/17</further-classification>  
        <further-classification edition="200601120250917B">H01L21/762</further-classification>  
        <further-classification edition="200601120250917B">B82B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, KUAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江國誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, KUO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在奈米結構場效電晶體(NSFET)裝置的形成期間，使用介電牆將替換閘極結構分割為個別的替換閘極結構。介電牆可藉由以一或多種介電材料取代替換閘極結構之設置於兩個相鄰鰭片/通道堆疊/堆疊奈米結構之間的一部分來形成。介電牆減少了替換閘極結構的尺寸，進而減少了閘極-源極電容(例如：寄生電容)，這又降低了所形成之裝置的RC延遲與功耗。由於介電牆採用了自我對準的方式形成，因此相鄰的鰭片/通道堆疊/堆疊奈米結構之間的距離可以進一步地微縮，以達成更高等級的整合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">During formation of a nanostructure field-effect transistor (NSFET) device, a dielectric wall is used to cut the replacement gate structure into separate replacement gate structures. The dielectric wall may be formed by replacing a portion of the replacement gate structure disposed between two adjacent fins/channel stacks/stacked nanostructures with one or more dielectric materials. The dielectric wall reduces the size of the replacement gate structure, thereby reducing the gate-source capacitance (e.g., a parasitic capacitance), which in turn reduces the RC delay and the power consumption of the device formed. Due to the self-aligned manner of formation for the dielectric wall, the distance between adjacent fins/channel stacks/stacked nanostructures can be scaled down further to achieve higher level of integration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:基板</p>  
        <p type="p">51:介電層/虛擬片</p>  
        <p type="p">54:奈米結構/第二半導體材料</p>  
        <p type="p">61:襯墊層</p>  
        <p type="p">68:STI保護結構</p>  
        <p type="p">73:硬遮罩層</p>  
        <p type="p">90A,90B:半導體鰭片</p>  
        <p type="p">96:STI區域</p>  
        <p type="p">97:虛擬閘極介電質</p>  
        <p type="p">100:NSFET裝置</p>  
        <p type="p">120:閘極介電材料</p>  
        <p type="p">122:閘極電極材料</p>  
        <p type="p">123A~123C:替換閘極結構</p>  
        <p type="p">131:介電材料</p>  
        <p type="p">132:介電材料</p>  
        <p type="p">133:介電牆</p>  
        <p type="p">134:區域</p>  
        <p type="p">135:界面層</p>  
        <p type="p">137:功函數材料</p>  
        <p type="p">141:蝕刻停止層</p>  
        <p type="p">143:介電層</p>  
        <p type="p">145A,145B:閘極接點</p>  
        <p type="p">147:閘極隔離結構</p>  
        <p type="p">H&lt;sub&gt;O&lt;/sub&gt;:距離</p>  
        <p type="p">H&lt;sub&gt;T&lt;/sub&gt;:高度</p>  
        <p type="p">W,W&lt;sub&gt;T&lt;/sub&gt;:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="816" publication-number="202611217"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611217.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611217</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗蝕劑組成物、乾式膜抗蝕劑、乾式膜抗蝕劑的製造方法、抗蝕劑圖案的形成方法及鍍覆造型物的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08L25/18</main-classification>  
        <further-classification edition="200601120251201B">C08L33/08</further-classification>  
        <further-classification edition="200601120251201B">C08L61/06</further-classification>  
        <further-classification edition="200601120251201B">C08K5/42</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/16</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川卓哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉原昌子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIHARA, MASAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種抗蝕劑組成物、乾式膜抗蝕劑、乾式膜抗蝕劑的製造方法、抗蝕劑圖案的形成方法及鍍覆造型物的製造方法，所述抗蝕劑組成物可形成於曝光後不進行加熱處理亦會解析、對於鍍覆處理具有充分的耐受性的抗蝕劑圖案。本發明是有關於一種抗蝕劑組成物、乾式膜抗蝕劑、乾式膜抗蝕劑的製造方法、抗蝕劑圖案的形成方法及鍍覆造型物的製造方法，所述抗蝕劑組成物含有：具有式（1）所表示的基的樹脂（A1）、包含式（a3）所表示的結構單元的樹脂（A2）、以及酸產生劑（B1）。&lt;br/&gt;&lt;img align="absmiddle" height="104px" width="338px" file="ed10068.JPG" alt="ed10068.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式（1）中，R&lt;sup&gt;a1&lt;/sup&gt;及R&lt;sup&gt;a2&lt;/sup&gt;分別獨立地表示氫原子或碳數1～20的烴基，R&lt;sup&gt;a3&lt;/sup&gt;表示碳數1～20的烴基，或者R&lt;sup&gt;a1&lt;/sup&gt;表示氫原子或碳數1～20的烴基，R&lt;sup&gt;a2&lt;/sup&gt;及R&lt;sup&gt;a3&lt;/sup&gt;相互鍵結並與R&lt;sup&gt;a2&lt;/sup&gt;所鍵結的碳原子及R&lt;sup&gt;a3&lt;/sup&gt;所鍵結的X一同形成碳數3～20的雜環，該烴基及該雜環中包含的亞甲基可被氧原子或硫原子取代。X表示氧原子或硫原子。na表示0或1。*表示鍵結部位]&lt;br/&gt;&lt;img align="absmiddle" height="126px" width="522px" file="ed10069.JPG" alt="ed10069.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式（a3）中，R&lt;sup&gt;a31&lt;/sup&gt;及R&lt;sup&gt;a32&lt;/sup&gt;分別獨立地表示碳數1～12的烷基，該烷基中包含的亞甲基可被取代為氧原子。o、p、q及r分別獨立地表示0或未滿1的正數，o及p的至少一者表示未滿1的正數，於o為0的情況下，p及q分別表示未滿1的正數，於p為0時，o及r分別表示未滿1的正數，於q為0時，o及r分別表示未滿1的正數，於r為0時，p及q分別表示未滿1的正數。其中，滿足o+p+q+r=1]</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="817" publication-number="202610999"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610999.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610999</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110266</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有烴末端基之化合物、表面處理劑及物品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C271/12</main-classification>  
        <further-classification edition="200601120251201B">C07C271/20</further-classification>  
        <further-classification edition="200601120251201B">C07C275/06</further-classification>  
        <further-classification edition="200601120251201B">C07C43/15</further-classification>  
        <further-classification edition="200601120251201B">C07F7/18</further-classification>  
        <further-classification edition="200601120251201B">C09K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯田虎之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIDA, TORANOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酒匈隆介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKOH, RYUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">下式(1)表示之含有烴末端基之化合物作為非氟系材料的表面保護劑使用的情況下，提昇分子間相互作用或分子鏈的運動性，包含該化合物的表面處理劑可形成撥水性、光滑性、污漬可擦拭性、耐磨耗性，尤其是耐鋼絲絨磨耗性優異之硬化被膜。 &lt;br/&gt;&lt;img align="absmiddle" height="53px" width="351px" file="ed10259.JPG" alt="ed10259.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(R為碳數1～60之1價的烴基，Z為包含選自O、N、S、Si中之至少1種的2價的連結官能基，Y為碳數1～30之2價的烴基，A為1價的反應性基，k為1～3)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="818" publication-number="202612327"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612327.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612327</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110427</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於指示多個圖像解碼操作的分塊參數的方法和裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR SIGNALLING TILE PARAMETERS FOR MULTIPLE IMAGE CODING OPERATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251201B">H04N19/119</main-classification>  
        <further-classification edition="201401120251201B">H04N19/176</further-classification>  
        <further-classification edition="201401120251201B">H04N19/70</further-classification>  
        <further-classification edition="201401120251201B">H04N19/90</further-classification>  
        <further-classification edition="202301120251201B">G06N3/045</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索洛維耶夫　蒂莫菲　米哈伊洛維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLOVYEV, TIMOFEY MIKHAILOVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紹爾　約翰內斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAUER, JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾希娜　伊蕾娜　亞歷山德羅夫娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALSHINA, ELENA ALEXANDROVNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡拉布托夫　亞歷山大　亞歷山德羅維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARABUTOV, ALEXANDER ALEXANDROVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於從圖像數據單元重建圖像的影像處理設備，所述設備包括一個或多個處理器，所述一個或多個處理器用於：處理所述圖像數據單元以在其中識別第一預定類型的第一欄位和第二預定類型的第二欄位，並且根據所述第一欄位的值，確定用於第二分塊級操作的分塊大小，並且根據所述第二欄位的值，確定用於第一分塊級操作的分塊大小；對從所述圖像數據單元推導的數據執行所述第一分塊級操作以生成中間數據；對所述中間數據執行所述第二分塊級操作。提供了一種附帶的方法和指示語法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image processing device for reconstructing an image from an image data unit, the device comprising one or more processors configured for; processing the image data unit to identify therein a first field of a first predetermined type and a second field of a second predetermined type, and, in dependence on the value of the first field, determining a tile size for a second tilewise operation and, in dependence on the value of the second field, determining a tile size for a first tilewise operation; performing the first tilewise operation on data derived from the image data unit to generate intermediate data; performing the second tilewise operation on the intermediate data. There is provided an accompanying method and signalling syntax.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1900:方法的流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="819" publication-number="202611251"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611251.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611251</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著劑組合物、黏著劑層、黏著片材、附黏著劑層之光學構件、及光學積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09J133/08</main-classification>  
        <further-classification edition="201801120251201B">C09J7/30</further-classification>  
        <further-classification edition="201901120251201B">B32B7/06</further-classification>  
        <further-classification edition="201901120251201B">B32B7/023</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神田栞里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANDA, SHIORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種黏著劑組合物，其可形成於使用時對被黏著體之密接性優異且於刻意進行剝離時容易剝離之黏著劑層。&lt;br/&gt;本發明提供一種用以形成使用於將光學構件黏貼之黏著劑層之活性能量線硬化型黏著劑組合物。上述黏著劑組合物包含除具有含氮原子環之單體以外之親水性成分，上述黏著劑組合物中之上述親水性成分相對於不揮發分之總量之含有比率未達10質量%。上述黏著劑層對玻璃之初始黏著力為10 N/25 mm以上，於將寬度25 mm之上述黏著劑層貼合於玻璃，向上述黏著劑層之長度方向端部與上述玻璃之界面添加水0.1 mL並於90°方向上以1.8 N之荷重進行拉張時，1分鐘後之剝離距離為3 mm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:黏著劑層</p>  
        <p type="p">10:黏著片材</p>  
        <p type="p">11a,11b:剝離襯墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="820" publication-number="202611224"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611224.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611224</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110623</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膜狀接著劑、以及光學用積層體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08L63/00</main-classification>  
        <further-classification edition="200601120251201B">C09J11/08</further-classification>  
        <further-classification edition="200601120251201B">C09J171/00</further-classification>  
        <further-classification edition="200601120251201B">C09J5/00</further-classification>  
        <further-classification edition="201801120251201B">C09J7/30</further-classification>  
        <further-classification edition="200601120251201B">B32B17/10</further-classification>  
        <further-classification edition="200601120251201B">B32B7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, TATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田島慎二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAJIMA, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋洋一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種膜狀接著劑，係含有具有環狀醚基的化合物之活性能量線硬化性的膜狀接著劑，前述膜狀接著劑在硬化後成為在50℃中經施加1kPa的剪切應力300秒時之潛變應變量為5%以下之硬化膜。此膜狀接著劑係使用在接合光學用的硬質構件與光學用的樹脂膜時。一種光學用積層體之製造方法，係使用此膜狀接著劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="821" publication-number="202611153"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611153.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611153</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含氮原子基板塗布劑組成物、光阻下層膜、積層體、光阻圖案之形成方法、及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G12/08</main-classification>  
        <further-classification edition="200601120251201B">G03F7/11</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石橋謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIBASHI, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德永光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUNAGA, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之含氮原子基板塗布劑組成物係含有具有複合單元結構之樹脂（G）及溶劑；&lt;br/&gt;前述複合單元結構係具有：&lt;br/&gt;具芳香族環之單元結構（A）、及&lt;br/&gt;具一個以上的碳原子之單元結構（B）；&lt;br/&gt;前述樹脂（G）係藉由在構成前述單元結構（A）之前述芳香族環之碳原子與前述單元結構（B）中的碳原子之間生成共價鍵之反應而獲得之樹脂；&lt;br/&gt;前述單元結構（A）係包含至少含有氮原子之單元結構（A-I）；&lt;br/&gt;含氮原子基板係由具有金屬原子或是類金屬原子與氮原子之間的鍵之化合物所成之基板、或具有由具有金屬原子或是類金屬原子與氮原子之間的鍵之化合物所成之含氮原子膜之基板；&lt;br/&gt;前述樹脂（G）不是僅由吲哚及1-萘甲醛合成之樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="822" publication-number="202610935"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610935.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610935</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有增強導電性的低膨脹矽-碳複合物、其製備方法以及包含其的矽負極材料</chinese-title>  
        <english-title>LOW EXPANSION SILICON-CARBON COMPLEX HAVING ENHANCED ELECTRO-CONDUCTIVITY, MANUFACTURING METHOD OF THE SAME AND SILICON ANODE MATERIAL CONTAINING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">C01B32/00</main-classification>  
        <further-classification edition="201701120251201B">C01B32/05</further-classification>  
        <further-classification edition="200601120251201B">C01B33/02</further-classification>  
        <further-classification edition="200601120251201B">C01B33/027</further-classification>  
        <further-classification edition="200601120251201B">H01M4/36</further-classification>  
        <further-classification edition="200601120251201B">H01M4/38</further-classification>  
        <further-classification edition="200601120251201B">H01M4/62</further-classification>  
        <further-classification edition="201001120251201B">H01M4/134</further-classification>  
        <further-classification edition="201001120251201B">H01M10/0525</further-classification>  
        <further-classification edition="201001120251201B">H01M10/0562</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商韓華思路信公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANWHA SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任壯彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IM, JANGBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張多元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, DAWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林京元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIM, KYOUNGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全孝鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, HYOJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔宰源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JAEWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及用作二次電池負極材料的矽-碳複合物、其製備方法以及使用其的負極材料，更具體而言，涉及一種低膨脹矽-碳複合物、其製備方法以及使用其的負極材料，當將在碳-矽複合顆粒的表面形成碳包覆層的所述複合物用作二次電池負極材料時，能夠透過使所述複合物的體積增加最小化而增加長期穩定性，並且更能透過在複合物的碳包覆層摻雜特定異種元素來增強導電性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="823" publication-number="202611250"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611250.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611250</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110722</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著片及自黏著片之物體剝離方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09J133/00</main-classification>  
        <further-classification edition="200601120251201B">C09J133/04</further-classification>  
        <further-classification edition="200601120251201B">C09J201/00</further-classification>  
        <further-classification edition="200601120251201B">C09J201/02</further-classification>  
        <further-classification edition="200601120251201B">C09J5/00</further-classification>  
        <further-classification edition="201801120251201B">C09J7/20</further-classification>  
        <further-classification edition="201801120251201B">C09J7/38</further-classification>  
        <further-classification edition="200601120251201B">H01L21/301</further-classification>  
        <further-classification edition="200601120251201B">H01L21/67</further-classification>  
        <further-classification edition="200601120251201B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤友郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, TOMOFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西嶋健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIJIMA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明能夠容易地拾取由具備表面具有凹凸之黏著層之黏著片保持的物體。 &lt;br/&gt;一種黏著片，其具備基材及表面具有凹凸之黏著層。黏著片可沿面方向擴張。將黏著片黏附至物品時之黏著片對物品之黏附面積比率為4%以上60%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:黏著層</p>  
        <p type="p">111:凸部</p>  
        <p type="p">120:基材</p>  
        <p type="p">150:剝離片</p>  
        <p type="p">160:剝離層</p>  
        <p type="p">161:凹部</p>  
        <p type="p">170:基材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="824" publication-number="202612171"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612171.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612171</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110777</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線結構及電子裝置</chinese-title>  
        <english-title>ANTENNA STRUCTURE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">H01Q1/48</main-classification>  
        <further-classification edition="200601120250502B">H01Q1/22</further-classification>  
        <further-classification edition="200601120250502B">H01Q9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啓碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON NEWEB CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫慈寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, TZU-KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳靜雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線結構，包含一信號單元及一第一接地單元。信號單元用以供設置一饋入埠。第一接地單元呈一環形，第一接地單元與信號單元對應設置並包含一第一接地端，第一接地端用以連接一系統地。信號單元及第一接地單元為相同或相異的導電材質製成。藉此，可在滿足天線效率要求下提高頻寬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna structure includes a signal unit and a first ground unit. The signal unit is configured for disposing a feeding port thereon. The first ground unit is in an annular shape. The first ground unit is disposed correspondingly to the signal unit and includes a first ground end. The first ground end is configured to be connected to a system ground. The signal unit and the first ground unit are made of the same or different conductive materials. Therefore, the bandwidth can be increased while meeting the antenna efficiency requirements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:天線結構</p>  
        <p type="p">110:第一接地單元</p>  
        <p type="p">111:第一接地端</p>  
        <p type="p">112:第二接地端</p>  
        <p type="p">113:耦合部</p>  
        <p type="p">120:第二接地單元</p>  
        <p type="p">130:信號單元</p>  
        <p type="p">131:第一信號端</p>  
        <p type="p">132:第二信號端</p>  
        <p type="p">134:饋入埠</p>  
        <p type="p">140:枝節單元</p>  
        <p type="p">145:開放端</p>  
        <p type="p">390:系統地</p>  
        <p type="p">d1:直徑</p>  
        <p type="p">d3:饋入埠距離</p>  
        <p type="p">m1,m3,m4:長度</p>  
        <p type="p">s3:間距</p>  
        <p type="p">x1:第一方向</p>  
        <p type="p">y1:第二方向</p>  
        <p type="p">z1:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="825" publication-number="202611482"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611482.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611482</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110794</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體基板對準用X射線方法及系統</chinese-title>  
        <english-title>X-RAY METHODS AND SYSTEMS FOR SEMICONDUCTOR SUBSTRATE ALIGNMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01B15/00</main-classification>  
        <further-classification edition="200601120251201B">H01L21/66</further-classification>  
        <further-classification edition="200601120251201B">H01L23/544</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丘卡　弗朗西斯科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACHUCA, FRANCISCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田　新康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, XINKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　舒燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHUYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">X射線被引導至處於一接合配置中以彼此接合的第一基板和第二基板。該些X射線被引導至該第一基板中的第一和第三對準標記，以及引導至該第二基板中的第二和第四對準標記。偵測從該第一對準標記和從該第二對準標記發射出的螢光X射線，以基於該第一和該第二對準標記的第一已偵測錯位來測量該第一基板相對於該第二基板的一第一錯位。使用X射線Talbot-Lau干涉法來偵測透射通過該第一和第二基板的X射線，以基於該第三和第四對準標記的第二已偵測錯位來測量該第一和第二基板的第二錯位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">X-rays are directed to a first substrate and to a second substrate in a bonding configuration for bonding together. The X-rays are directed to first and third alignment marks in the first substrate and to second and fourth alignment marks in the second substrate. Fluorescent X-rays are detected upon emission from the first alignment mark and the second alignment mark to measure a first misalignment of the first substrate with respect to the second substrate based on a first detected misalignment of the first and second alignment marks. X-rays transmitted through the first and second substrates using X-ray Talbot-Lau interferometry to measure a second misalignment of the first and second substrates based on a second detected misalignment of the third and fourth alignment marks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雙X射線測量系統</p>  
        <p type="p">110:X射線源</p>  
        <p type="p">112:基板對</p>  
        <p type="p">114:第一偵測器</p>  
        <p type="p">116:第二偵測器</p>  
        <p type="p">118:X射線束</p>  
        <p type="p">120:透射X射線束</p>  
        <p type="p">122:背散射X射線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="826" publication-number="202612031"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612031.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612031</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110834</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及製造具有雙面橋接晶粒的嵌入式跡線基板或小晶片的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MAKING AN ETS OR CHIPLET WITH DOUBLE-SIDED BRIDGE DIE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/50</main-classification>  
        <further-classification edition="200601120251210B">H01L21/60</further-classification>  
        <further-classification edition="200601120251210B">H01L23/538</further-classification>  
        <further-classification edition="202301120251210B">H01L25/065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＪＣＥＴ　星科金朋韓國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JCET STATS CHIPPAC KOREA LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹汝俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, YEOJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李喜秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HEESOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體裝置，其具有雙面橋接晶粒。該橋接晶粒具有位於該橋接晶粒之第一表面上的第一接觸襯墊及位於該橋接晶粒之與該第一表面相對之第二表面上的第二接觸襯墊。該橋接晶粒安置於載體上方。第一導電層形成於該載體上。第一絕緣層形成於該第一導電層及該橋接晶粒上方。開口形成穿過該第一絕緣層以曝露該第一導電層。第二導電層形成於該第一絕緣層上方。該第二導電層將該第一導電層電耦接至該橋接晶粒之該第一接觸襯墊。移除該載體。第一半導體晶粒電耦接至該第一導電層及該橋接晶粒之該第二接觸襯墊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device has a double-sided bridge die. The bridge die has a first contact pad on a first surface of the bridge die and a second contact pad on a second surface of the bridge die opposite the first surface. The bridge die is disposed over a carrier. A first conductive layer is formed on the carrier. A first insulating layer is formed over the first conductive layer and bridge die. An opening is formed through the first insulating layer to expose the first conductive layer. A second conductive layer is formed over the first insulating layer. The second conductive layer electrically couples the first conductive layer to the first contact pad of the bridge die. The carrier is removed. A first semiconductor die is electrically coupled to the first conductive layer and the second contact pad of the bridge die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:橋接晶粒</p>  
        <p type="p">112a:接觸襯墊</p>  
        <p type="p">112b:導電跡線</p>  
        <p type="p">114a:接觸襯墊</p>  
        <p type="p">114b:導電跡線</p>  
        <p type="p">136:接觸襯墊</p>  
        <p type="p">140:絕緣層</p>  
        <p type="p">150:導電層</p>  
        <p type="p">154:絕緣層</p>  
        <p type="p">156:導電層</p>  
        <p type="p">160:阻焊層</p>  
        <p type="p">166:ETS</p>  
        <p type="p">170:半導體晶粒</p>  
        <p type="p">172:焊料凸塊</p>  
        <p type="p">176a:信號路徑</p>  
        <p type="p">176b:信號路徑</p>  
        <p type="p">178:焊料凸塊</p>  
        <p type="p">180:小晶片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="827" publication-number="202612163"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612163.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612163</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110935</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於最小化及防止電化學電池中之枝晶形成的系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR MINIMIZING AND PREVENTING DENDRITE FORMATION IN ELECTROCHEMICAL CELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251201B">H01M10/052</main-classification>  
        <further-classification edition="201001120251201B">H01M10/0525</further-classification>  
        <further-classification edition="201001120251201B">H01M10/058</further-classification>  
        <further-classification edition="201001120251201B">H01M10/0587</further-classification>  
        <further-classification edition="200601120251201B">H01M10/42</further-classification>  
        <further-classification edition="200601120251201B">H01M10/48</further-classification>  
        <further-classification edition="201001120251201B">H01M4/133</further-classification>  
        <further-classification edition="201001120251201B">H01M4/134</further-classification>  
        <further-classification edition="200601120251201B">H01M4/62</further-classification>  
        <further-classification edition="202101120251201B">H01M50/107</further-classification>  
        <further-classification edition="202101120251201B">H01M50/431</further-classification>  
        <further-classification edition="202101120251201B">H01M50/434</further-classification>  
        <further-classification edition="202101120251201B">H01M50/451</further-classification>  
        <further-classification edition="202101120251201B">H01M50/457</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商２４Ｍ科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>24M TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太田直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　君政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUNZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布勞爾　蜜雪兒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROUWER, MICHELLE ROBYN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里夫金　朱莉婭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIFKIN, JULIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋俊華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, JUNHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普圖塞里　丹亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUTHUSSERI, DHANYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>範　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, FRANK YONGZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅哈斯　溫貝托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROJAS, HUMBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉小銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XIAOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙略加　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALAZAR, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特爾　帕斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, PARTH S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所描述之實施例係關於具有枝晶預防機制之電化學電池以及其生產及操作方法。在一些範疇中，一種電化學電池可包括一陽極及安置於一陰極集電器上之一陰極材料，該陰極材料及該陰極集電器形成一陰極。該電化學電池進一步包括安置於該陽極上之一第一隔板、安置於該陰極上之一第二隔板及安置於該第一隔板與該第二隔板之間的一中間層，該中間層包括電活性材料，該中間層包括一鋰離子源，該等鋰離子經組態以在該中間層與該陽極之間的一電壓差超過一臨限值後向該陽極遷移。在一些實施例中，該陽極可包括安置於一陽極集電器上之一陽極材料。在一些實施例中，該陽極材料可包括石墨、矽及/或硬碳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to electrochemical cells with dendrite prevention mechanisms, and methods of producing and operating the same. In some aspects, an electrochemical cell can include an anode and a cathode material disposed on a cathode current collector, the cathode material and the cathode current collector forming a cathode. The electrochemical cell further includes a first separator disposed on the anode, a second separator disposed on the cathode, and an interlayer disposed between the first separator and the second separator, the interlayer including electroactive material, the interlayer including a source of lithium ions, the lithium ions configured to migrate toward the anode upon a voltage difference between the interlayer and the anode exceeding a threshold value. In some embodiments, the anode can include an anode material disposed on an anode current collector. In some embodiments, the anode material can include graphite, silicon, and/or hard carbon.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:電化學電池</p>  
        <p type="p">522:彎曲部分</p>  
        <p type="p">523:導電板</p>  
        <p type="p">524:負極按鈕</p>  
        <p type="p">526:絕緣體</p>  
        <p type="p">542:彎曲部分</p>  
        <p type="p">543:導電板</p>  
        <p type="p">544:正極按鈕</p>  
        <p type="p">546:絕緣體</p>  
        <p type="p">570:外殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="828" publication-number="202611564"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611564.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611564</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110981</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏光板、具備偏光板之圓偏光板、及具備偏光板或圓偏光板之顯示裝置</chinese-title>  
        <english-title>POLARIZING PLATE, CIRCULAR POLARIZING PLATE HAVING POLARIZING PLATE, AND DISPLAY DEVICE HAVING POLARIZING PLATE OR CIRCULAR POLARIZING PLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G02B5/30</main-classification>  
        <further-classification edition="201901120251201B">B32B7/023</further-classification>  
        <further-classification edition="200601120251201B">C08F220/34</further-classification>  
        <further-classification edition="200601120251201B">C08F222/22</further-classification>  
        <further-classification edition="200601120251201B">C09K19/38</further-classification>  
        <further-classification edition="200601120251201B">C09K19/60</further-classification>  
        <further-classification edition="200601120251201B">G02F1/1335</further-classification>  
        <further-classification edition="200601120251201B">G02F1/13363</further-classification>  
        <further-classification edition="200601120251201B">G02F1/1337</further-classification>  
        <further-classification edition="202301120251201B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐原慶亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAHARA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種在高溫及／或高濕條件下之耐久性，尤其密著性及穿透率優異的偏光板。 &lt;br/&gt;關於解決課題之手段，本發明之偏光板包含彼此鄰接的第一樹脂層及偏光片，其中，第一樹脂層為包含單官能(甲基)丙烯酸酯、多官能(甲基)丙烯酸酯及胺甲酸酯丙烯酸酯之硬化性樹脂組成物的硬化物層，胺甲酸酯丙烯酸酯之官能基數為3以上，多官能(甲基)丙烯酸酯相對於單官能(甲基)丙烯酸酯之質量比為1以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a polarizing plate having excellent durability, particularly excellent adhesion and transmittance, under high temperature and/or high humidity conditions. &lt;br/&gt;As a solution, the polarizing plate of the present invention includes a first resin layer and a polarizer adjacent to each other, wherein the first resin layer being a cured layer of a curable resin composition including a monofunctional (meth)acrylate, a polyfunctional (meth)acrylate, and a urethane acrylate, wherein the number of functional groups of the urethane acrylate is 3 or more, and the mass ratio of the polyfunctional (meth)acrylate to the monofunctional (meth)acrylate is 1 or more.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:偏光片</p>  
        <p type="p">2:第一樹脂層</p>  
        <p type="p">3:第二樹脂層</p>  
        <p type="p">10:偏光板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="829" publication-number="202611848"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611848.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611848</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111017</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理系統、資訊處理方法以及程式</chinese-title>  
        <english-title>INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250502B">G06Q50/04</main-classification>  
        <further-classification edition="202301120250502B">G06Q10/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛晶股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIXTAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東海國立大學機構</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國立研究開發法人理化學研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIKEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高石將輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAISHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇治原徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UJIHARA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沓掛健太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUTSUKAKE, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何品毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可實現生產線整體優化的資訊處理系統，包括處理器，其用以讀取程式來執行以下各步驟：在模型取得步驟中，取得前端流程模型，模擬了從原材料生成中間產品的前端流程，以及取得後端流程模型，模擬了從中間產品生成最終產品的流程；在條件取得步驟中，取得前端流程模型與後端流程模型的每個流程條件；在推理步驟中，透過將流程條件輸入到至少與前端流程模型和後端流程模型連結的連結模型中，以取得中間產品的特性值、最終產品的特性值、前端流程所使用的裝置的狀態值、以及後端流程所使用的裝置的狀態值中之至少一個，並作為推斷值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An information processing system capable of achieving overall optimization of a production line comprises a processor, which is configured to execute the following steps by reading a program. In a model obtaining step, a front-end process model that simulates the front-end process of generating an intermediate product from raw materials is obtained; and a back-end process model that simulates the process of generating a final product from the intermediate product is obtained. In a condition obtaining step, process conditions for each of the front-end and back-end process models are obtained. In the inference step, at least one of the characteristic values of the intermediate product, the characteristic values of the final product, the state values of devices used in the front-end process, and the state values of devices used in the back-end process is obtained by inputting the process conditions into a linking model that at least connects the front-end process model and the back-end process model, and the obtained value is used as an inferred value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:資訊處理裝置</p>  
        <p type="p">20:用戶終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="830" publication-number="202611260"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611260.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611260</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111054</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨粒的製造方法、化學機械研磨用組成物及研磨方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09K3/14</main-classification>  
        <further-classification edition="200601120251201B">C09G1/02</further-classification>  
        <further-classification edition="201201120251201B">B24B37/00</further-classification>  
        <further-classification edition="200601120251201B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福與翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUYO, TSUBASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可高速研磨氧化矽膜且可抑制氧化矽膜的研磨時的研磨缺陷的產生、並且貯存後的研磨特性亦優異的化學機械研磨用組成物及使用其的研磨方法。另外，提供一種可用於該化學機械研磨用組成物的研磨粒的製造方法。本發明的化學機械研磨用組成物含有研磨粒與液狀介質，聚合物鏈藉由共價鍵而接枝於所述研磨粒的表面，所述研磨粒於其表面具有選自由下述通式（3）所表示的部分結構及下述通式（4）所表示的部分結構所組成的群組中的至少一種部分結構。 &lt;br/&gt;-NR &lt;sup&gt;2&lt;/sup&gt;R &lt;sup&gt;3&lt;/sup&gt;‧‧‧‧（3） &lt;br/&gt;-N &lt;sup&gt;+&lt;/sup&gt;R &lt;sup&gt;2&lt;/sup&gt;R &lt;sup&gt;3&lt;/sup&gt;R &lt;sup&gt;4&lt;/sup&gt;M &lt;sup&gt;-&lt;/sup&gt;‧‧‧‧（4） &lt;br/&gt;（所述式（3）及式（4）中，R &lt;sup&gt;2&lt;/sup&gt;、R &lt;sup&gt;3&lt;/sup&gt;及R &lt;sup&gt;4&lt;/sup&gt;各自獨立地表示氫原子或者經取代或未經取代的烴基。M &lt;sup&gt;-&lt;/sup&gt;表示陰離子）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="831" publication-number="202611357"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611357.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611357</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多線刺繡機</chinese-title>  
        <english-title>MULTI-THREAD EMBROIDERY MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250714B">D05B69/16</main-classification>  
        <further-classification edition="200601120250714B">D05B53/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩洛哥商康尼利藝術服務有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ART SERVICES CORNELY SARL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾特　穆罕默德　阿里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIT MHAMED,ALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易定芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一種先進的刺繡機，其可同時處理多條繡線，產生自動色澤漸變的繁複圖案，即使在繡線斷裂的情況中，亦不會中斷作業。本發明包括一整合式變速機構，允許快速調整線軸柱組之轉速而不需停止機器；一可調式張力系統，可維持恆定的繡線張力，確保最佳的刺繡品質；此外，還包括一機針及壓布腳桿擺動機構，可提升刺繡圖案的精密度。本發明之刺繡機提供了更高的生產率、使用彈性，並降低維護成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to an advanced embroidery machine capable of handling multiple threads simultaneously to create complex patterns with automatic color transitions, without interruption, even in the event of thread breakage. The invention includes an integrated speed change mechanism, allowing for quick adjustments of the spool holder’s rotation without stopping the machine. An adjustable tension system maintains constant pressure on the thread, ensuring optimal embroidery quality. Additionally, an oscillating mechanism for the needle and pressure foot enhances the precision of the embroidery patterns. This machine offers increased productivity, flexibility or use, and reduced maintenance costs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:機架</p>  
        <p type="p">4:變速器</p>  
        <p type="p">400:殼體</p>  
        <p type="p">401:手柄</p>  
        <p type="p">402:皮帶驅動系統</p>  
        <p type="p">403:主驅動軸</p>  
        <p type="p">403a:鎖止臂</p>  
        <p type="p">403b:滑架</p>  
        <p type="p">406:齒輪</p>  
        <p type="p">407:齒輪</p>  
        <p type="p">408:齒輪</p>  
        <p type="p">409:齒輪</p>  
        <p type="p">414:主凸輪</p>  
        <p type="p">419:銷釘</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="832" publication-number="202611645"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611645.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611645</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偵測和監視在流體浴中的物件以及基於測得物件特性調整流體浴之設備及方法</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR DETECTING AND MONITORING OBJECTS IN A FLUID BATH AND ADJUSTING THE FLUID BATH BASED ON THE MEASURED OBJECT PROPERTIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G03F7/30</main-classification>  
        <further-classification edition="202201120251201B">G06V20/40</further-classification>  
        <further-classification edition="200601120251201B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃斯特雷拉　喬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESTRELLA, JOEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文的技術包括設備和方法，用於測量和監視半導體處理設備中流體中偵測到物件(如氣泡)的特性。該方法可通過多幀的影像資料隨時間追蹤偵測到的物件，以及判定偵測到物件的度量，以改善追蹤準確度，以及將配方參數與通過配方參數處理得到的晶圓品質相關聯。基於晶圓品質資料與判定物件度量之間的判定的相關性，可調整配方參數以進一步改善晶圓品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques herein include an apparatus and method for measuring and monitoring properties of objects, such as bubbles, detected in a fluid in a semiconductor processing apparatus. The method can track the detected objects over time through multiple frames of video data and determine metrics for the detected objects to improve tracking accuracy as well as correlate recipe parameters to resulting wafer quality processed via the recipe parameters. Based on the determined correlation between the wafer quality data and the determined object metrics, the recipe parameters can be adjusted to improve wafer quality further.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">S305~S340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="833" publication-number="202612050"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612050.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612050</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111111</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以促進均勻性的升舉銷，及相關部件、腔室套組、處理腔室及方法</chinese-title>  
        <english-title>LIFT PINS TO FACILITATE UNIFORMITY, AND RELATED COMPONENTS, CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/67</main-classification>  
        <further-classification edition="200601120251210B">H01L21/683</further-classification>  
        <further-classification edition="200601120251210B">C30B25/08</further-classification>  
        <further-classification edition="200601120251210B">C30B25/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>叢　者澎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONG, ZHEPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚　班哲明伊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THAM, BENJAMIN EAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及用以促進均勻性的升舉銷及相關部件、腔室套組、處理腔室與半導體製造的方法。在一或多個實施例中，用於處理腔室的升舉銷包括包含軸段和頭段的桿。該頭段包括在頭段外邊緣形成的開口，該開口向徑向內側延伸。該升舉銷包括尺寸和形狀適合至少部分裝配於該桿的頭段周圍的襯墊，使得該桿的頭段相對於襯墊可在一運動範圍內移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to lift pins that facilitate uniformity, and related components, chamber kits, processing chambers, and methods for semiconductor manufacturing. In one or more embodiments, a lift pin for processing chambers includes a rod including a shaft section and a head section. The head section includes an opening formed in an outer edge of the head section and extending radially inwardly. The lift pin includes a pad sized and shaped to fit at least partially around the head section of the rod such that the head section of the rod is movable relative to the pad within a movement range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:升舉銷</p>  
        <p type="p">201:襯墊</p>  
        <p type="p">203:突起</p>  
        <p type="p">220:套筒段</p>  
        <p type="p">222:第一部分</p>  
        <p type="p">224:第二部分</p>  
        <p type="p">225:環形通道</p>  
        <p type="p">231:外部部分</p>  
        <p type="p">232:外部部分</p>  
        <p type="p">251:桿</p>  
        <p type="p">252:軸段</p>  
        <p type="p">260:頭段</p>  
        <p type="p">261:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="834" publication-number="202611965"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611965.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611965</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111228</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背景波形之取得方法、標記位置檢測方法、電子束描繪方法及電子束描繪裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01J37/317</main-classification>  
        <further-classification edition="200601120251201B">H01J37/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商紐富來科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴田薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUTA, KAORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤大士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>七尾翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANAO, TSUBASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種背景波形之取得方法、標記位置檢測方法、電子束描繪方法及電子束描繪裝置，能以簡易的手法而高精度地取得在標記附近的背景波形。 &lt;br/&gt;　　本發明的一態樣的背景波形之取得方法，在形成有在使用線圖案的情況下的標記的試料的線圖案的附近，於在不和線圖案所延伸的方向成為平行的方向上排列的複數個區域，將試料以電子束進行掃描，從利用在複數個區域被掃描所測定的複數個測定波形之中，判定非標記之背景的波形，進行輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="835" publication-number="202611180"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611180.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611180</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111398</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>矽烷化合物聚合物之製造方法、以及半導體絕緣膜形成劑之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G77/06</main-classification>  
        <further-classification edition="200601120251201B">H01L21/316</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森瑶子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, YOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉康貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, YASUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森岡孝至</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIOKA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合田英生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GODA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種矽烷化合物聚合物之製造方法、以及半導體絕緣膜形成劑之製造方法，該方法具有以下步驟： &lt;br/&gt;將以下述式(a-1)所表示之3官能烷氧基矽烷化合物，在滿足下述要件1及2的溶媒存在下進行水解聚縮合， &lt;br/&gt;&lt;img align="absmiddle" height="47px" width="352px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[R&lt;sup&gt;1&lt;/sup&gt;表示氫原子、未取代的烴基、或具有取代基的烴基。OR表示烷氧基。OR可彼此相同，亦可彼此不同]。 &lt;br/&gt;要件1：與水共沸之溶媒。 &lt;br/&gt;要件2：聚醚系溶媒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="836" publication-number="202610796"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610796.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610796</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111399</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>源自熱可塑性聚合物的成分之回收方法、回收裝置、解聚合中間體組成物、解聚合反應組成物、及再生單體之製造方法、製造裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B29B17/00</main-classification>  
        <further-classification edition="200601120251201B">C08J11/14</further-classification>  
        <further-classification edition="200601120251201B">C08G63/91</further-classification>  
        <further-classification edition="200601120251201B">C08G69/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉富慎一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDOMI, SHINICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村美帆子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, MIHOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森本厚志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIMOTO, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤公哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, KOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於源自熱可塑性聚合物的成分之回收方面，存在有因不溶於水之異素材之固體成分而裝置之流徑等堵塞的問題。為了從含有熱可塑性聚合物與不溶於水之固體成分的熱可塑性聚合物組成物，高效率且穩定地回收源自熱可塑性聚合物的成分，本發明提供一種源自熱可塑性聚合物的成分之回收方法，其係具有：從包含熱可塑性聚合物與不溶於水之固體成分的熱可塑性聚合物組成物與水的混合物，於110℃以上且350℃以下、0.14MPa以上且30MPa以下之條件下，分離不溶於水之固體成分，而獲得源自熱可塑性聚合物的成分的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">7:過濾器</p>  
        <p type="p">15:壓縮器</p>  
        <p type="p">16:壓力容器</p>  
        <p type="p">18:氣體背壓閥</p>  
        <p type="p">19:不溶於水之固體成分</p>  
        <p type="p">20:攪拌機</p>  
        <p type="p">21:閥</p>  
        <p type="p">22:源自熱可塑性聚合物的成分槽</p>  
        <p type="p">D,E,F:手段</p>  
        <p type="p">H:槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="837" publication-number="202610937"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610937.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610937</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111406</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水系碳奈米管漿料及正極用分散體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">C01B32/174</main-classification>  
        <further-classification edition="200601120251201B">C09C1/44</further-classification>  
        <further-classification edition="200601120251201B">H01M4/62</further-classification>  
        <further-classification edition="201001120251201B">H01M4/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱鉛筆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI PENCIL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部寛史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供：提供操作性為良好的非水系碳奈米管漿料及電阻為低的正極的組成物。 &lt;br/&gt;　　一種碳奈米管漿料，其特徵在於，由碳奈米管、非水系分散劑及非水系極性溶劑組成，相對於碳奈米管，鹼土金屬離子之含量為5ppm~2000ppm；及，一種正極用分散體，其係將正極活性物質、碳黑、石墨及黏合材料添加於前述碳奈米管漿料而成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="838" publication-number="202611152"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611152.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611152</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111448</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有芳香族內酯之樹脂及其製造方法、以及硬化性樹脂組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G10/00</main-classification>  
        <further-classification edition="200601120251201B">C08G59/40</further-classification>  
        <further-classification edition="200601120251201B">C08G61/12</further-classification>  
        <further-classification edition="200601120251201B">H01L23/29</further-classification>  
        <further-classification edition="200601120251201B">H01L23/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＵＢＥ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UBE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本慎司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種下述通式(1)所表示之含有芳香族內酯之樹脂。 &lt;br/&gt;式中，R&lt;sub&gt;1&lt;/sub&gt;、R&lt;sub&gt;2&lt;/sub&gt;及R&lt;sub&gt;3&lt;/sub&gt;分別獨立地表示碳原子數1～8之烷基，X表示-CH&lt;sub&gt;2&lt;/sub&gt;-，或者表示包含芳香族環及伸烷基之碳原子數8～24之烴基，該烴基之氫原子可經羥基取代，a表示0～3之整數，b表示0～2之整數，c表示0～3之整數，n表示0～10之整數。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="263px" width="573px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="839" publication-number="202610805"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610805.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610805</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物之製造方法、硬化物、圖案之製造方法、及組成物之檢查方法，以及組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B29C59/02</main-classification>  
        <further-classification edition="200601120251201B">G03F7/00</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袴田旺弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAKAMATA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種組成物之製造方法、藉由上述製造方法獲得的組成物之硬化物、使用藉由上述製造方法獲得的組成物之圖案之製造方法、及組成物之檢查方法，以及組成物，其中，上述組成物之製造方法包括：使用壓印圖案形成用組成物，對上述組成物進行基於光吸收的所含成分的檢測之製程；及藉由包括使上述組成物或從上述組成物得到的粒子帶電的製程的方法來對上述組成物進行所含成分的檢測之製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="840" publication-number="202612273"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612273.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612273</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">H03K17/693</main-classification>  
        <further-classification edition="200601120250502B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖宏昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, HUNG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅閔馨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, MIN-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾名駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, MING-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置包括基板及設置於基板上的第一電子元件、第二電子元件、第一開關電晶體及共用電墊。第一開關電晶體與第一電子元件及第二電子元件耦接。共用電墊透過第一開關電晶體分別與第一電子元件以及該第二電子元件耦接。當第一開關電晶體導通時，從共用電墊可分別量測到來自第一電子元件與第二電子元件的電性，當第一開關電晶體關閉時，則無法從共用電墊分別量測到來自該第一電子元件與該第二電子元件的電性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a substrate, and a first electronic element, a second electronic element, a first switch transistor and a shared electric pad arranged on the substrate. The first switch transistor is coupled to the first electronic element and the second electronic element. The shared electric pad is respectively coupled to the first electronic element and the second electronic element through the first switch transistor. When the first switch transistor is on, the electrical properties of the first electronic element and the second electronic element can be measured from the shared electric pad. When the first switch transistor is off, the electrical properties of the first electronic element and the second electronic element cannot be measured from the shared electric pad.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子裝置</p>  
        <p type="p">10:基板</p>  
        <p type="p">D_1、D_2:電子元件</p>  
        <p type="p">TS_1:開關電晶體</p>  
        <p type="p">12:共用電墊</p>  
        <p type="p">SW_1:開關信號</p>  
        <p type="p">S_1、S_2:輸入信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="841" publication-number="202611113"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611113.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611113</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111673</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>正型阻劑材料及圖型形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/08</main-classification>  
        <further-classification edition="200601120251201B">C08F212/12</further-classification>  
        <further-classification edition="200601120251201B">C08F220/18</further-classification>  
        <further-classification edition="200601120251201B">C08F220/30</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井佑哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林将行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭示，提供一種用於圖型化的能量線之透過率良好，且曝光後的圖型形狀良好之正型阻劑材料及圖型形成方法。本揭示之正型阻劑材料含有樹脂(A)，樹脂(A)為含有下述式(1)表示之構成單元(a-1)與下述式(2)表示之構成單元(a-2)的共聚物。 &lt;br/&gt;&lt;img align="absmiddle" height="250px" width="465px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(1)、(2)中，R&lt;sup&gt;A&lt;/sup&gt;、R&lt;sup&gt;B&lt;/sup&gt;為氫原子或甲基；R&lt;sup&gt;1&lt;/sup&gt;為碳數1～6的烷二基，其碳原子的一部分可被醚鍵或酯鍵取代；R&lt;sup&gt;2&lt;/sup&gt;為氟原子、三氟甲基、氰基或碳數1～6的飽和烴基；a為1或2；b為0～4的整數；其中，1≦a+b≦5；R&lt;sup&gt;4&lt;/sup&gt;為酸不穩定基)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="842" publication-number="202611149"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611149.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611149</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111703</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F290/14</main-classification>  
        <further-classification edition="200601120251201B">C08G73/12</further-classification>  
        <further-classification edition="200601120251201B">C08L79/08</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浅川大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAKAWA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧野雅臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKINO, MASAOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樹脂組成物，其包含含有式（A-1）所表示之重複單元之聚醯亞胺前驅物，式（A-1）中，X為4價連結基，Y為2價連結基，A為-O-、-S-或-NR&lt;sup&gt;1&lt;/sup&gt;-，R&lt;sup&gt;1&lt;/sup&gt;為氫原子或有機基，R&lt;sup&gt;P&lt;/sup&gt;分別獨立地為包含聚合性基之取代基，並且滿足條件1及條件2中的至少1個，條件1：X為不包含芳香環之脂肪族結構；條件2：Y為不包含芳香環之脂肪族結構。&lt;br/&gt;&lt;img align="absmiddle" height="167px" width="336px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="843" publication-number="202611634"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611634.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611634</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111730</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖案形成方法、感光化射線性或感放射線性樹脂組成物、及電子元件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G03F7/004</main-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎北斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, HOKUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸茂和博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUMO, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤亮祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種圖案形成方法、感光化射線性或感放射線性樹脂組成物、及包括上述圖案形成方法的電子元件之製造方法，上述圖案形成方法包括：使用感光化射線性或感放射線性樹脂組成物形成膜之製程，上述感光化射線性或感放射線性樹脂組成物含有藉由酸的作用而極性增大之樹脂（A）、光酸產生劑、酸擴散控制劑、及溶劑，並且光酸產生劑及酸擴散控制劑中的至少一者包含鋶陽離子和具有碘原子的陰離子；對上述膜進行曝光之製程；以及使用含有乙酸丁酯及碳數9以上且12以下之烴的有機系處理液對曝光後的上述膜進行顯影之製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="844" publication-number="202611117"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611117.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611117</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111731</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖案形成方法、感光化射線性或感放射線性樹脂組成物、及電子元件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/14</main-classification>  
        <further-classification edition="200601120251201B">C08F220/06</further-classification>  
        <further-classification edition="200601120251201B">C08F220/28</further-classification>  
        <further-classification edition="200601120251201B">C08F220/30</further-classification>  
        <further-classification edition="200601120251201B">C08F220/38</further-classification>  
        <further-classification edition="200601120251201B">C08F232/08</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉村務</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIMURA, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹呉直紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANGO, NAOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種圖案形成方法、感光化射線性或感放射線性樹脂組成物、及包括上述圖案形成方法的電子元件之製造方法，上述圖案形成方法包括：使用感光化射線性或感放射線性樹脂組成物形成膜之製程，上述感光化射線性或感放射線性樹脂組成物含有樹脂（A）、光酸產生劑、及溶劑，上述樹脂（A）包含具有碘原子的重複單元（a）及具有特定結構的重複單元（b），並藉由酸的作用而極性增大；對上述膜進行曝光之製程；以及使用含有乙酸丁酯及碳數9以上且12以下之烴的有機系處理液對曝光後的上述膜進行顯影之製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="845" publication-number="202611635"> 
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      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611635</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>正型感光性樹脂組成物、感光性膜、抗蝕劑膜、抗蝕劑下層膜及抗蝕劑永久膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G03F7/004</main-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長田裕仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATA, HIROHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊部武史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IBE, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小関裕美子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSEKI, YUMIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種i射線透過性高、可獲得顯影性及耐熱性優異的抗蝕劑膜，並且保管穩定性良好的正型感光性樹脂組成物。一種正型感光性樹脂組成物，含有下述的成分（A）～成分（C）。成分（A）：酚醛清漆型酚樹脂，包含衍生自間甲酚和/或鄰甲酚的酚結構單元（a1）、衍生自水楊醛的醛結構單元（a2）、且具有源自含有兩個以上的乙烯基醚基的化合物的縮醛基系保護基/成分（B）：光酸產生劑/成分（C）：溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="846" publication-number="202611095"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611095.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611095</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111939</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>絕緣膜形成用感光性樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F2/44</main-classification>  
        <further-classification edition="200601120251201B">C08F290/14</further-classification>  
        <further-classification edition="200601120251201B">C08G73/12</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/031</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/40</further-classification>  
        <further-classification edition="200601120251201B">H01L21/312</further-classification>  
        <further-classification edition="200601120251201B">H01L23/485</further-classification>  
        <further-classification edition="200601120251201B">H01L23/532</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千葉朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIBA, ROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯沼洋介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IINUMA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井秀則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, HIDENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荻野浩司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGINO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>敦賀健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUGA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種絕緣膜形成用感光性樹脂組成物，其包含：具有下述式(1)所表示之結構單元與下述式(2)所表示之結構單元之鹼不溶性聚醯亞胺、光自由基聚合起始劑、交聯性化合物、1分鐘半衰期溫度為140℃以上之熱自由基產生劑、及溶劑； &lt;br/&gt;&lt;img align="absmiddle" height="285px" width="563px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式(1)中，A&lt;sub&gt;1&lt;/sub&gt;表示4價的有機基； &lt;br/&gt;式(2)中，A&lt;sub&gt;2&lt;/sub&gt;表示具有光聚合性基之2價的芳香族基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="847" publication-number="202611239"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611239.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611239</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112059</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有導電粒子的分散液、用於形成導電膜的塗布液</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09D5/24</main-classification>  
        <further-classification edition="200601120251201B">H01B1/20</further-classification>  
        <further-classification edition="200601120251201B">H01B5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日揮觸媒化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JGC CATALYSTS AND CHEMICALS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>港康佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINATO, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒金宏忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAKANE, HIROTADA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[技術問題]本發明提供一種能夠實現透明導電膜的低電阻化的導電粒子。&lt;br/&gt;[解決技術問題的技術手段]一種分散液，所述分散液是含有導電粒子、纖維狀導體和親水性有機溶劑的分散液，其中，導電粒子與纖維狀導體的重量比率（導電粒子/纖維狀導體）為100至1000，導電粒子含有率小於15重量%，水分含有率小於9.5重量%。導電粒子包括第一導電粒子和第二導電粒子，第二導電粒子與第一導電粒子的重量比率（第二導電粒子/第一導電粒子）為0.5至20，其中，所述第一導電粒子與纖維狀導體結合，所述第二導電粒子未與纖維狀導體結合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="848" publication-number="202611109"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611109.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611109</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>構件、及半導體製造相關裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F32/08</main-classification>  
        <further-classification edition="200601120251201B">C08L23/00</further-classification>  
        <further-classification edition="202501120251201B">C08L23/02</further-classification>  
        <further-classification edition="200601120251201B">C08L27/04</further-classification>  
        <further-classification edition="200601120251201B">C08L27/24</further-classification>  
        <further-classification edition="200601120251201B">C09K3/10</further-classification>  
        <further-classification edition="200601120251201B">B64G1/58</further-classification>  
        <further-classification edition="200601120251201B">E04C2/20</further-classification>  
        <further-classification edition="200601120251201B">F16J15/10</further-classification>  
        <further-classification edition="200601120251201B">F16L9/12</further-classification>  
        <further-classification edition="200601120251201B">F16L9/127</further-classification>  
        <further-classification edition="200601120251201B">H01L21/02</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥野晋吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUNO, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中友平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種耐腐蝕性優異之構件、及使用其之半導體製造相關裝置。本發明之構件包含選自由聚烯烴樹脂及氯系樹脂所組成之群中之至少1種熱塑性樹脂，上述構件係選自由建築裝修材料用構件、移動裝置（mobility）用構件、航空太空用構件、半導體用構件、及資訊通訊用構件所組成之群中之至少一者，且與腐蝕性物質接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="849" publication-number="202611203"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611203.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611203</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112139</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>粉體、電磁波吸收體及熔融成形體的製造方法</chinese-title>  
        <english-title>POWDER, ELECTROMAGNETIC ABSORBER AND METHOD FOR PRODUCING MELT-MOLDED BODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08K3/04</main-classification>  
        <further-classification edition="200601120251201B">C08K3/08</further-classification>  
        <further-classification edition="200601120251201B">C08K3/20</further-classification>  
        <further-classification edition="200601120251201B">C08L101/00</further-classification>  
        <further-classification edition="200601120251201B">C08L25/12</further-classification>  
        <further-classification edition="200601120251201B">C08L33/04</further-classification>  
        <further-classification edition="200601120251201B">C08L67/00</further-classification>  
        <further-classification edition="200601120251201B">C09D5/03</further-classification>  
        <further-classification edition="201801120251201B">C09D7/61</further-classification>  
        <further-classification edition="200601120251201B">C09D125/08</further-classification>  
        <further-classification edition="200601120251201B">C09D133/04</further-classification>  
        <further-classification edition="200601120251201B">C09D167/00</further-classification>  
        <further-classification edition="200601120251201B">C09D201/00</further-classification>  
        <further-classification edition="200601120251201B">G03G9/08</further-classification>  
        <further-classification edition="200601120251201B">G03G9/087</further-classification>  
        <further-classification edition="200601120251201B">G03G9/097</further-classification>  
        <further-classification edition="200601120251201B">H05K9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本瑞翁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千葉尊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIBA, TAKERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種粉體，其在較以往還寬廣之頻域中具有電磁波吸收特性，能夠形成性能之偏差受到抑制的電磁波吸收層，能夠靜電附著及熱固定於支撐體；以及一種電磁波吸收體，其具備該粉體之熔融成形體作為電磁波吸收層。一種粉體，其係由含有黏結樹脂及分散於該黏結樹脂中之帶電控制劑的多個粒子而成之粉體，其特徵在於前述粉體的每單位面積之帶電量的絕對值為40～1500 mC／cm&lt;sup&gt;2&lt;/sup&gt;，前述粒子的體積平均粒徑為2～100 μm，前述黏結樹脂係熱塑性樹脂，前述粒子100個數%中，5～95個數%之粒子以分散於前述黏結樹脂中之狀態含有添加劑A，剩下的粒子不含添加劑A，所述添加劑A係選自由碳奈米管、碳奈米角及碳纖維而成之群組之至少1種。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a powder configured to form an electromagnetic absorbing layer, which has electromagnetic absorbing properties in a wider frequency range than ever before and in which uneven performance is suppressed, and configured to electrostatically adhere to a support and to be fixed to a support by heat. Also provided is an electromagnetic absorber comprising, as the electromagnetic absorbing layer, a melt-molded body of the powder. A powder comprising particles containing a binder resin and a charge control agent dispersed in the binder resin, wherein an absolute value of a charge amount per unit area of the powder is from 40 mC/cm2 to 1500 mC/cm2; wherein a volume average particle diameter of the particles is from 2 µm to 100 µm; wherein the binder resin is a thermoplastic resin; and wherein 5% to 95% (by number) of the particles contain an additive A, which is at least one kind selected from the group consisting of carbon nanotubes, carbon nanohorns and carbon fibers, in a state of being dispersed in the binder resin, and the rest of the particles are free of the additive A.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="850" publication-number="202612456"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612456.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612456</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112144</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250703B">H10B12/00</main-classification>  
        <further-classification edition="200601120250703B">G11C11/412</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林哉炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JAE HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金柄成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BYUNG-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金兌衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE-HYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種半導體裝置，包括：胞元陣列區域，包括沿彼此相交的第一方向及第二方向二維配置的單位記憶體胞元；第一周邊電路區域，包括沿第二方向配置的第一單位周邊胞元，第一周邊電路區域及胞元陣列區域沿第一方向配置；及第二周邊電路區域，包括沿第二方向配置的第二單位周邊胞元，第一周邊電路區域插入於胞元陣列區域與第二周邊電路區域之間，其中在第二方向上，單位記憶體胞元中各者的第一單位胞元高度與第一單位周邊胞元中各者的第二單位胞元高度彼此相等，且第二單位周邊胞元中各者的第三單位胞元高度小於第二單位胞元高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a cell array area including unit memory cells arranged two-dimensionally along a first direction and a second direction intersecting each other, a first peripheral circuit area including first unit peripheral cells arranged along the second direction, the first peripheral circuit area and the cell array area arranged along the first direction, and a second peripheral circuit area including second unit peripheral cells arranged along the second direction, the first peripheral circuit area interposed between the cell array area and the second peripheral circuit area, wherein in the second direction, a first unit cell height of each of the unit memory cells and a second unit cell height of each of the first unit peripheral cells are equal to each other, and a third unit cell height of each of the second unit peripheral cells is smaller than the second unit cell height.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:單位記憶體胞元</p>  
        <p type="p">20:第一單位周邊胞元</p>  
        <p type="p">30:第二單位周邊胞元</p>  
        <p type="p">CELL:記憶體胞元區域</p>  
        <p type="p">CH1:第一單位胞元高度</p>  
        <p type="p">CH2:第二單位胞元高度</p>  
        <p type="p">CH3:第三單位胞元高度</p>  
        <p type="p">I:第一區域</p>  
        <p type="p">II:第二區域</p>  
        <p type="p">PERI:周邊電路區域</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="851" publication-number="202610609"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610609.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610609</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用音波振動實施按摩的音振按摩機</chinese-title>  
        <english-title>SONIC VIBRATION MASSAGER FOR PERFORMING MASSAGE USING SONIC VIBRATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251130B">A61H23/04</main-classification>  
        <further-classification edition="200601120251130B">A61H1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>督洋生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUYO BIOTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧波秉航科技集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINGBO BEHEALTHY TECHNOLOGY GROUP CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>粘伯勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIEN, PO-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種應用音波振動實施按摩的音振按摩機，具有一機體和配置於上述機體音振裝置，上述音振裝置包括音振發生模組及音振分散模組。音振發生模組，其配置成產生音波振動，上述音振發生模組包括音訊直線電機及振動放大單元。上述音振分散模組其配置成將上述音波振動由上述音振發生模組分散傳遞到一待施療部位，包括一載置部及多個按摩頭。音訊直線電機包括一定子和在上述定子的內腔中做往復直線運動的一動子。振動放大單元包括一彈性構件、以及具有預定重量的一振動按摩頭。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sonic vibration massager for performing massage using sonic vibrations includes a main body and a sonic vibration device arranged on the main body. The sonic vibration device consists of a sonic vibration generation module and a sonic vibration distribution module. &lt;br/&gt;&lt;br/&gt;The sonic vibration generation module is configured to generate sonic vibrations and includes an audio linear motor and a vibration amplification unit. The sonic vibration distribution module is designed to disperse and transmit the sonic vibrations from the sonic vibration generation module to a treatment area and includes a supporting section and multiple massage heads. &lt;br/&gt;The audio linear motor consists of a stator and a mover that reciprocates linearly within the inner cavity of the stator. The vibration amplification unit includes an elastic component and a vibrating massage head with a predetermined weight.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:按摩機</p>  
        <p type="p">10:機體</p>  
        <p type="p">11:腿托</p>  
        <p type="p">111:承托部</p>  
        <p type="p">12:腳托</p>  
        <p type="p">20:音振裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="852" publication-number="202611192"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611192.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611192</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112246</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預浸材及使用於其之碳纖維束與碳纖維束之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08J5/24</main-classification>  
        <further-classification edition="200601120251201B">B29B11/16</further-classification>  
        <further-classification edition="200601120251201B">D01F6/18</further-classification>  
        <further-classification edition="200601120251201B">D01F9/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中文彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, FUMIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中谷達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATANI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種預浸材，係碳纖維束含浸於熱硬化性樹脂而成者，該碳纖維束之股拉張強度為6.7~8.0 GPa、股拉張彈性模數為340~380 GPa，碳纖維束之厚度為0.05~0.10 mm、碳纖維束之厚度之變異係數為5.0%以下，該碳纖維束實質上為無撚，該預浸材之纖維基重為30~100 g/m&lt;sup&gt;2&lt;/sup&gt;、且纖維體積分率為50~80%。藉由本發明之預浸材，所得碳纖維強化複合材料係力學特性之平衡優越、且可達成輕量化，可適合使用於高爾夫球桿身或釣竿等運動用途及其他一般產業用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="853" publication-number="202612436"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612436.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612436</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112474</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">H05K7/20</main-classification>  
        <further-classification edition="200601120250502B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張立勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, LI-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李培嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, PEI CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>解智翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIH-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括一殼體、一第一熱源、一第二熱源以及一風扇。殼體具有一第一腔室、一第二腔室、一第一入風口、一第二入風口、一第一出風口與一第二出風口。第一入風口與第一出風口連通第一腔室。第二入風口與第二出風口連通第二腔室。第一出風口與第二出風口相鄰。第二熱源設置於第一腔室且部分暴露於第二腔室。風扇設置於第一腔室，用以產生從第一入風口進入並通過第一熱源後從第一出風口離開的一第一氣流。第一氣流從第一出風口離開時，引致從第二入風口進入並通過第二熱源暴露於第二腔室的部分後從第二出風口離開的一第二氣流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device comprises a housing, a first heat source, a second heat source and a fan. The housing has a first chamber, a second chamber, a first air inlet, a second air inlet, a first air outlet, and a second air outlet. The first air inlet and the first air outlet communicate with the first chamber. The second air inlet and the second air outlet communicate with the second chamber. The first air outlet and the second air outlet are adjacent to each other. The second heat source is disposed in the first chamber and partially exposed to the second chamber. The fan is disposed in the first chamber for generating a first airflow that enters through the first air inlet, passes through the first heat source, and exits through the first air outlet. When the first airflow exits through the first air outlet, it induces a second airflow that enters through the second air inlet, passes through the portion of the second heat source exposed to the second chamber, and exits through the second air outlet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:殼體</p>  
        <p type="p">120:第一熱源</p>  
        <p type="p">122:第一發熱元件</p>  
        <p type="p">124:第一導熱元件</p>  
        <p type="p">126:第一散熱鰭片</p>  
        <p type="p">130:第二熱源</p>  
        <p type="p">132:第二發熱元件</p>  
        <p type="p">134:第二導熱元件</p>  
        <p type="p">136:第二散熱鰭片</p>  
        <p type="p">140:風扇</p>  
        <p type="p">C12:第一腔室</p>  
        <p type="p">C14:第二腔室</p>  
        <p type="p">H12:第一入風口</p>  
        <p type="p">H14:第二入風口</p>  
        <p type="p">H16:第一出風口</p>  
        <p type="p">H18:第二出風口</p>  
        <p type="p">F12:第一氣流</p>  
        <p type="p">F14:第二氣流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="854" publication-number="202610766"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610766.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610766</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112493</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於資料分析和處理控制的波形訊號封裝</chinese-title>  
        <english-title>WAVEFORM SIGNAL PACKAGING FOR DATA ANALYSIS AND PROCESS CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251201B">B24B37/005</main-classification>  
        <further-classification edition="201201120251201B">B24B49/00</further-classification>  
        <further-classification edition="200601120251201B">G05B23/02</further-classification>  
        <further-classification edition="200601120251201B">G06T11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　浩權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, JUSTIN H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭　迪芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PON, DEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種藉由波形訊號封裝在處理器裝置處進行處理控制的方法。處理器裝置可以接收基於時間的波形資料。該基於時間的波形資料可以包括對應於時域中的一或多個波形訊號的波形資料。處理器裝置可以處理該基於時間的波形資料，以將該基於時間的波形資料轉換為基於頻率的波形資料。該基於頻率的波形資料可以包括頻域中的波形資料。處理器裝置可以將基於頻率的波形資料（及/或基於時間的波形資料）封裝為一或多個聲譜圖影像檔。每個聲譜圖影像檔可以包括二或更多個色彩通道以指示波形資料。處理器裝置可以顯示一或多個聲譜圖影像檔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for process control by waveform signal packaging at a processor device is provided. The processor device may receive time-based waveform data. The time-based waveform data may include waveform data corresponding to one or more waveform signals in a time domain. The processor device may process the time-based waveform data to convert the time-based waveform data into frequency-based waveform data. The frequency-based waveform data may include the waveform data in a frequency domain. The processor device may package the frequency-based waveform data (and/or the time-based waveform data) into one or more spectrogram image files. Each spectrogram image file may include two or more color channels indicating the waveform data. The processor device may display the one or more spectrogram image files.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:方法</p>  
        <p type="p">710:步驟</p>  
        <p type="p">720:步驟</p>  
        <p type="p">730:步驟</p>  
        <p type="p">740:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="855" publication-number="202610726"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610726.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610726</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112588</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電集塵裝置及空氣淨化設備</chinese-title>  
        <english-title>ELECTROSTATIC DUST COLLECTOR AND AIR PURIFICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250422B">B03C3/47</main-classification>  
        <further-classification edition="200601120250422B">B03C3/86</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商蘇州貝昂智能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZHOU BEIANG SMART TECHNOLOGY CO. LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路堯遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YAO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, QI-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JUN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種靜電集塵裝置及空氣淨化設備，包括：分別呈條帶狀的第一電極片和第二電極片，該第一電極片的第一面兩側分設有多個第一支撐凸臺，該第二電極片的第一面兩側分設有多個第二支撐凸臺，該第一電極片的第二面接觸疊放於該第二電極片的第二支撐凸臺上後捲繞形成該靜電集塵裝置。本發明的靜電集塵裝置在捲繞成型時，不需使用保持固定間隙的特定工裝，即可精確保持固定間距，在捲繞成型後，能夠形成層支撐結構，解決兩片靜電集塵片螺旋捲繞成型後間距難以保證的問題，捲繞完成後即可組裝成成品，不需要再進行點膠、插入隔離梳處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrostatic dust collector and an air purification device are disclosed. The electrostatic dust collector includes a first electrode sheet and a second electrode sheet in a strip shape. A plurality of first supporting bumps are disposed on both sides of the first surface of the first electrode sheet. A plurality of second supporting bumps are disposed on both sides of the first surface of the second electrode sheet. The second surface of the first electrode sheet is contacted and stacked on the second supporting bumps of the second electrode sheet and then wound to form the electrostatic dust collector. The electrostatic dust collector of the disclosure accurately maintains a fixed spacing without using a specific tooling for maintaining the fixed spacing during winding and forming. A layer support structure is formed after winding and forming to solve the problem that the spacing between two electrostatic dust collecting sheets is difficult to ensure after winding. Which is assembled into a finished product after winding and forming without the need for glue dispensing or inserting isolation combs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一電極片</p>  
        <p type="p">2:第二電極片</p>  
        <p type="p">3:第一支撐凸臺</p>  
        <p type="p">4:第二支撐凸臺</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="856" publication-number="202610573"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610573.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610573</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112660</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有多種沖泡模式的咖啡機</chinese-title>  
        <english-title>COFFEE BREWER WITH MULTIPLE BREW MODES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">A47J31/44</main-classification>  
        <further-classification edition="200601120251202B">A47J31/46</further-classification>  
        <further-classification edition="200601120251202B">A47J31/56</further-classification>  
        <further-classification edition="200601120251202B">A47J31/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商啡樂實業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FELLOW INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特爾祖力　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERZULLI, NICHOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>屈勃魯　Ｌ•Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEBELEU, LIVIUS DIMITRIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, DENIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡達克　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUDAK, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">咖啡沖泡器可包括主體、水箱、過濾盒和多模式噴頭。所述水箱可提供沖泡用水。所述過濾盒可接收水和咖啡沖泡材料、沖泡咖啡並從所述過濾盒的出口分配沖泡好的咖啡。所述多模式噴頭可位於所述過濾盒處，並可在多種不同的沖泡模式下運行，包括用於沖泡單份咖啡的第一沖泡模式和用於沖泡多份咖啡的第二沖泡模式。所述多模式噴頭可包括在所述過濾盒內分配水的噴嘴。當所述多模式噴頭在所述第一沖泡模式下運行時，所述噴嘴的第一部分可打開並分配水，而所述噴嘴的第二部分可關閉且不分配水。當所述多模式噴頭在所述第二沖泡模式下運行時，所有所述噴嘴均可打開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A coffee brewer can include a main body, water tank, filter box, and multimode showerhead. The water tank can provide water for brewing. The filter box can receive water and coffee brewing materials, brew coffee, and dispense brewed coffee from a filter box outlet. The multimode showerhead can be at the filter box and can operate in multiple different brew modes including a first brew mode for brewing a single serving of coffee and a second brew mode for brewing a multiple serving batch of coffee. The multimode showerhead can include nozzles that dispense water within the filter box. A first portion of the nozzles can be open and dispense water while a second portion of the nozzles can be closed and not dispense water when the showerhead operates in the first brew mode. All nozzles can be open when the showerhead operates in the second brew mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:咖啡沖泡器</p>  
        <p type="p">101:電線</p>  
        <p type="p">110:前控制箱</p>  
        <p type="p">111:輸入旋鈕</p>  
        <p type="p">112:輸出顯示器</p>  
        <p type="p">120:水箱</p>  
        <p type="p">130:泵和加熱器箱</p>  
        <p type="p">140:容器</p>  
        <p type="p">150:底座</p>  
        <p type="p">160:過濾盒</p>  
        <p type="p">161:過濾盒蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="857" publication-number="202611922"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611922.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611922</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112676</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體電路及其製造方法</chinese-title>  
        <english-title>MEMORY CIRCUIT AND METHODS OF MANUFACTURING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G11C11/417</main-classification>  
        <further-classification edition="200601120251103B">G11C7/22</further-classification>  
        <further-classification edition="200601120251103B">G11C8/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>粘逸昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIEN, YI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原英弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, HIDEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳炎輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體電路，其包括第一陣列，該第一陣列包括第一記憶體單元；第二陣列，該第二陣列沿著第一方向靠近第一陣列定位並包括第二記憶體單元；第一輸入/輸出，其沿著第一方向與第二陣列相對第一陣列定位；第二輸入/輸出，其沿著第一方向與第一陣列相對第二陣列定位；及位元線，其耦接至第一輸入/輸出；第一記憶體單元中之第一者的電晶體；及第二記憶體單元中之第一者的電晶體。第一記憶體單元中之第一者的電晶體具有一閘極，該閘極具有在垂直於第一方向的第二方向上延伸的第一長度；第二記憶體單元中之第一者的電晶體具有一閘極，該閘極具有在第二方向上延伸的第二長度，且第一長度短於第二長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory circuit includes a first array including first memory cells, a second array located next to the first array along a first direction and including second memory cells, a first input/output located opposite the first array from the second array along the first direction, a second input/output located opposite the second array from the first array along the first direction, and a bit-line coupled to the first input/output, a transistor of a first one of the first memory cells, and a transistor of a first one of the second memory cells. The transistor of the first one of the first memory cells has a gate with a first length extending in a second direction perpendicular to the first direction, and the transistor of the first one of the second memory cells has a gate with a second length extending in the second direction and the first length is shorter than the second length.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">710~760:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="858" publication-number="202610933"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610933.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610933</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112734</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由聚合物輔助球磨剝離製備二維奈米薄片之方法及系統</chinese-title>  
        <english-title>METHODS AND SYSTEMS OF PRODUCING 2D NANOSHEETS BY POLYMER-ASSISTED BALL-MILL EXFOLIATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C01B21/064</main-classification>  
        <further-classification edition="201701120251201B">C01B32/19</further-classification>  
        <further-classification edition="200601120251201B">B02C17/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉瑪許萊斯大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAM MARSH RICE UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樓　峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張璟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翟天舒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAI, TIANSHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供產生剝離二維(2D)材料之方法及該等二維材料之機器學習引導性產生，其中該方法包括：提供包括二維材料及聚合物添加劑之混合物；及在球磨設備中處理該混合物，由此產生剝離二維材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides methods of producing an exfoliated two-dimensional (2D) material, wherein the method comprises: providing a mixture comprising a 2D material and a polymer additive; and processing the mixture in a ball-mill apparatus, thereby producing an exfoliated 2D material, and the machine-learning guided production of said 2D materials.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="859" publication-number="202612518"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612518.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612518</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112764</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND FORMING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250602B">H10D62/17</main-classification>  
        <further-classification edition="202501120250602B">H10D62/13</further-classification>  
        <further-classification edition="202501120250602B">H10D62/824</further-classification>  
        <further-classification edition="202501120250602B">H10D30/60</further-classification>  
        <further-classification edition="202501120250602B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>碇基半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANCORA SEMICONDUCTORS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林立凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, LI-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉瀅溱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YING-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝包含主動層、源極電極、汲極電極、閘極電極以及多個第一P型氮化鎵島狀物。主動層包含主動區。源極電極、汲極電極以及閘極電極設置於主動層的主動區上且延伸於第一方向。第一P型氮化鎵島狀物設置在主動區上、汲極電極下方。汲極電極在主動區上的垂直投影覆蓋第一P型氮化鎵島狀物中的每一者在主動區上的整個垂直投影。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes an active layer having an active region, a source electrode, a drain electrode, and a gate electrode disposed on the active region of the active layer and extending along a first direction, and multiple first P-GaN islands disposed on the active region and under the drain electrode. A vertical projection of the drain electrode on the active region covers the entirety of a vertical projection of each of the first P-GaN islands on the active region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">100:基板</p>  
        <p type="p">110:主動層</p>  
        <p type="p">116:通道層</p>  
        <p type="p">118:阻障層</p>  
        <p type="p">120:源極電極</p>  
        <p type="p">130:汲極電極</p>  
        <p type="p">140:閘極電極</p>  
        <p type="p">142:閘極P型氮化鎵層</p>  
        <p type="p">144:蕭特基金屬層</p>  
        <p type="p">150:第一P型氮化鎵島狀物</p>  
        <p type="p">160:第二P型氮化鎵島狀物</p>  
        <p type="p">162:第一柱體</p>  
        <p type="p">164:第二柱體</p>  
        <p type="p">166:第三柱體</p>  
        <p type="p">168:第四柱體</p>  
        <p type="p">170:歐姆金屬島狀物</p>  
        <p type="p">180:場板</p>  
        <p type="p">182:第一場板</p>  
        <p type="p">184:第二場板</p>  
        <p type="p">186:第三場板</p>  
        <p type="p">200:金屬層</p>  
        <p type="p">210:第一源極金屬層</p>  
        <p type="p">220:第一汲極金屬層</p>  
        <p type="p">240:第二汲極金屬層</p>  
        <p type="p">242:通孔</p>  
        <p type="p">264:分支部分</p>  
        <p type="p">266:通孔</p>  
        <p type="p">270,280,290:介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="860" publication-number="202611007"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611007.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611007</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112804</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物、阻劑圖型形成方法、化合物、酸擴散控制劑及酸產生劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C309/12</main-classification>  
        <further-classification edition="200601120251201B">C07C309/17</further-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">C07C63/70</further-classification>  
        <further-classification edition="200601120251201B">C07C65/03</further-classification>  
        <further-classification edition="200601120251201B">C07C65/05</further-classification>  
        <further-classification edition="200601120251201B">C07C65/10</further-classification>  
        <further-classification edition="200601120251201B">C07C65/21</further-classification>  
        <further-classification edition="200601120251201B">C07D307/00</further-classification>  
        <further-classification edition="200601120251201B">C08F12/24</further-classification>  
        <further-classification edition="200601120251201B">C08F20/10</further-classification>  
        <further-classification edition="200601120251201B">C09K3/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林諒大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤広樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢田部陸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YATABE, RIKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>末﨑圭恵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUEZAKI, YOSHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為藉由曝光而產生酸，且藉由酸的作用而對於顯影液之溶解性發生變化之阻劑組成物。其含有：藉由酸的作用而對於顯影液之溶解性發生變化之基材成分(A)、與式(d0)表示之化合物(D0)。式(d0)中，Ar&lt;sup&gt;01&lt;/sup&gt;、Ar&lt;sup&gt;02&lt;/sup&gt;及Ar&lt;sup&gt;03&lt;/sup&gt;表示可具有取代基之芳基。但，Ar&lt;sup&gt;01&lt;/sup&gt;包含1個碘原子，Ar&lt;sup&gt;02&lt;/sup&gt;及Ar&lt;sup&gt;03&lt;/sup&gt;合計包含4個以上之氟原子。Ar&lt;sup&gt;0&lt;/sup&gt;表示芳香環。Rd&lt;sup&gt;0&lt;/sup&gt;表示羥基、烷基、烷氧基、硝基、鹵素原子或鹵化烷基。n0於原子價容許時表示0以上之整數。 &lt;br/&gt;&lt;img align="absmiddle" height="206px" width="480px" file="ed10150.JPG" alt="ed10150.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="861" publication-number="202611200"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611200.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611200</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112821</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>再循環材料組成物及製造其之方法</chinese-title>  
        <english-title>RECYCLED MATERIAL COMPOSITION AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08J11/24</main-classification>  
        <further-classification edition="200601120251201B">C07C67/03</further-classification>  
        <further-classification edition="200601120251201B">C07C67/52</further-classification>  
        <further-classification edition="200601120251201B">C07C67/54</further-classification>  
        <further-classification edition="200601120251201B">C07C69/82</further-classification>  
        <further-classification edition="200601120251201B">C08G63/183</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ化學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金芝勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI-HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳佳姈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, GAYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李仲基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JOONG KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種經由廢棄聚酯原料之解聚合所獲得的再循環原料組成物、製備其之方法、及使用其所製備的再循環聚酯樹脂及成型物件。因為該再循環原料組成物具有最小化的低分子量化合物含量，其可在隨著時間之黃度上具有低的變化，且伴隨著高純度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a recycled raw material composition obtained through depolymerization of a waste polyester raw material, a process for preparing the same, and a recycled polyester resin and a molded article prepared using the same. Since the recycled raw material composition has a minimized content of low molecular weight compounds, it can have a low change in the yellowness over time, along with high purity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="862" publication-number="202612525"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612525.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612525</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112977</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體模組及電子電路</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251204B">H10D64/20</main-classification>  
        <further-classification edition="202501120251204B">H10D64/27</further-classification>  
        <further-classification edition="202501120251204B">H10D89/10</further-classification>  
        <further-classification edition="200601120251204B">H01L23/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新電元工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湧口純彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUGUCHI, JUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森永雄司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORINAGA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠抑制構成橋式電路的半導體晶片的閘極電壓・電流中產生的振鈴且可靠性高的半導體模組。&lt;br/&gt;在本發明的半導體模組的一側，電源端子及接地端子在第1、第3閘極控制端子之間以並聯的方式配置。另外，在另一側，第1、第2中點端子在第2、第4閘極控制端子之間以並聯的方式配置。並且，當俯視電子模組時，第2閘極控制佈線及第4閘極控制佈線被配置成沒有與從電源端子到接地端子的貫通電流路徑鄰接並行的部位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體模組</p>  
        <p type="p">10:第1佈線圖案</p>  
        <p type="p">20:第2佈線圖案</p>  
        <p type="p">30:第3佈線圖案</p>  
        <p type="p">40:第4佈線圖案40</p>  
        <p type="p">51:電源端子(正側電源端子)</p>  
        <p type="p">511:第1電源端子</p>  
        <p type="p">512:第2電源端子</p>  
        <p type="p">52:接地端子(負側的電源端子)</p>  
        <p type="p">61:第1中點端子</p>  
        <p type="p">62:第2中點端子</p>  
        <p type="p">70:基板</p>  
        <p type="p">81~84:源極連接構件(第2電極連接構件)</p>  
        <p type="p">111~114:第1~第4閘極控制佈線圖案</p>  
        <p type="p">121~124:第1~第4傳感佈線圖案</p>  
        <p type="p">131~134:第1~第4閘極控制佈線</p>  
        <p type="p">141~144:第1~第4傳感佈線</p>  
        <p type="p">150:密封件的外周</p>  
        <p type="p">A、B:最短電流路徑</p>  
        <p type="p">A1:從第1電源端子511到第1中點端子61的第1最短電流路徑</p>  
        <p type="p">A2:從第2中點端子62到接地端子52的最短電流路徑</p>  
        <p type="p">B1:從第2電源端子512到第2中點端子62的第2最短電流路徑</p>  
        <p type="p">B2:從第1中點端子61到接地端子52最短電流路徑</p>  
        <p type="p">Q1:第1半導體晶片</p>  
        <p type="p">Q2:第2半導體晶片</p>  
        <p type="p">Q3:第3半導體晶片</p>  
        <p type="p">Q4:第4半導體晶片</p>  
        <p type="p">G:半導體晶片Q1~Q4閘極</p>  
        <p type="p">S:半導體晶片Q1~Q4的源極(第2電極)</p>  
        <p type="p">AA、BB:貫通電流路徑</p>  
        <p type="p">GT1~GT4:第1~第4閘極控制端子</p>  
        <p type="p">ST1~ST4:第1~第4傳感端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="863" publication-number="202612558"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612558.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612558</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造具紫外線發光二極體陣列之方法及此陣列</chinese-title>  
        <english-title>METHOD FOR PRODUCING AN ARRAY WITH UV LIGHT-EMITTING DIODES AND ARRAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">H10H29/01</main-classification>  
        <further-classification edition="202501120251201B">H10H29/24</further-classification>  
        <further-classification edition="202501120251201B">H10H29/30</further-classification>  
        <further-classification edition="202501120251201B">H10H29/855</further-classification>  
        <further-classification edition="202501120251201B">H10H29/856</further-classification>  
        <further-classification edition="202501120251201B">H10H20/856</further-classification>  
        <further-classification edition="202501120251201B">H10H20/819</further-classification>  
        <further-classification edition="202501120251201B">H10H20/858</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商ＭＳＧ光刻玻璃有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MSG LITHOGLAS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢森　烏理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSEN, ULLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金格　奧利佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GYENGE, OLIVER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　曉東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, XIAODONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂斯　席蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAUS, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明與一種製造陣列（31）之方法及陣列（31）有關。該方法提供：製造陣列基板（1），其中具傾斜側壁（3）的開口（2）藉由蝕刻形成在半導體基板中；將被配置為發射UV光的發光晶片（32）設置在載體基板（30）上，使得組件間隔形成在相鄰發光晶片（32）之間；及在載體基板（30）上創建發光晶片（32）的殼體（33），其中陣列基板（1）設置在該載體基板（30）上，使得單個發光晶片（32）分別設置在開口（2）中，且開口（2）中的發光晶片（32）橫向地發射的UV光被開口（2）的傾斜側壁（3）反射而通過殼體開口（34）到達背對載體基板（30）的一側。在發光晶片（32）中，包括發光晶片（32）的所有側表面（32a）的總側表面是總發光表面的至少60%，總發光表面由發光晶片（32）的側表面（32a）及頂表面（32b）形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for producing an array (31) and to an array (31). The method provides： manufacturing an array substrate (1), wherein openings (2) with in-clined side walls (3) are formed in a semiconductor substrate by means of etching; ar-ranging light-emitting chips (32), which are configured to emit UV light, on a carrier sub-strate (30) in such a way that a component spacing is formed between adjacent light-emitting chips (32); and creating a housing (33) for the light-emitting chips (32) on the carrier substrate (30), wherein the array substrate (1) is arranged on the carrier substrate (30) in such a way that single light-emitting chips (32) are respectively arranged in the openings (2) and that UV light emitted laterally by the light-emitting chip (32) in the open-ing (2) is reflected by means of the inclined side walls (3) of the opening (2) through a housing opening (34) to a side facing away from the carrier substrate (30). In the light-emitting chips (32), a total side surface comprising all side surfaces (32a) of the light-emitting chip (32) is at least 60% of a light-emitting total surface, the light-emitting total surface being formed by the side surfaces (32a) and a top surface (32b) of the light-emitting chip (32).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:陣列基板</p>  
        <p type="p">3:側壁</p>  
        <p type="p">4a:分隔壁</p>  
        <p type="p">4b:邊緣側壁</p>  
        <p type="p">30:載體基板</p>  
        <p type="p">30a:接觸表面</p>  
        <p type="p">31:陣列</p>  
        <p type="p">32:發光晶片</p>  
        <p type="p">32a:側表面</p>  
        <p type="p">32b:頂表面</p>  
        <p type="p">33:殼體</p>  
        <p type="p">34:殼體開口</p>  
        <p type="p">35:反射塗層</p>  
        <p type="p">36a:前側電觸點</p>  
        <p type="p">36b:後側電觸點</p>  
        <p type="p">37:直通連接件</p>  
        <p type="p">38:散熱片</p>  
        <p type="p">A:出射光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="864" publication-number="202611782"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611782.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611782</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113104</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>系統及邊緣設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251204B">G06N3/063</main-classification>  
        <further-classification edition="202301120251204B">G06N3/045</further-classification>  
        <further-classification edition="201801120251204B">G06F8/41</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商蒂普愛可斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEEPX CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金錄元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, LOK WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>具本圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOO, BON GYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種系統及邊緣設備。IC可以包括包括多個處理元件的神經處理單元（NPU）。每個PE可以包括被配置成執行乘法累加操作的乘法累加電路。IC可以包括耦合到NPU的中央處理單元（CPU）；以及耦合到NPU和CPU的一個或多個儲存電路，儲存電路包括指令，當由CPU執行時，指令使CPU執行操作。操作可以包括：根據指示將第一機器學習框架的元素映射到至少一個NPU或CPU中可執行的函數或操作的第一映射訊息，將與NPU不相容的第一機器學習框架的第一神經網路模型編譯成可由NPU執行的第一機器代碼；儲存第一機器代碼；以及將第一機器代碼發送到NPU以供執行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:神經處理單元(NPU)</p>  
        <p type="p">200-1:(第一)記憶體</p>  
        <p type="p">200-2:(第二)記憶體</p>  
        <p type="p">210:通用編譯器</p>  
        <p type="p">250:記憶體控制器</p>  
        <p type="p">300:中央處理單元(CPU)</p>  
        <p type="p">500:系統匯流排</p>  
        <p type="p">800:輸入輸出埠/顯示設備</p>  
        <p type="p">1000:邊緣設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="865" publication-number="202612093"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612093.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612093</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113105</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有施加至底板之多成分陶瓷塗層的靜電卡盤</chinese-title>  
        <english-title>ELECTROSTATIC CHUCK WITH MULTI-COMPONENT CERAMIC COATING APPLIED TO BASEPLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/683</main-classification>  
        <further-classification edition="200601120251201B">H01L21/687</further-classification>  
        <further-classification edition="200601120251201B">H02N13/00</further-classification>  
        <further-classification edition="200601120251201B">B23Q3/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許　臨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達芬提　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAUGHERTY, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋策爾　大衛　喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WETZEL, DAVID JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史琳瓦森　撒第斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASAN, SATISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供靜電卡盤(ESC，electrostatic chuck)底板，其設有用於支撐邊緣環的肩部區域，並至少在肩部區域上噴塗施加多成分陶瓷塗層，該塗層具有第一成分和第二成分，第一成分具有高於鋁氧化物介電常數的第一介電常數，且亦具有第一熱導率，以及第二成分具有高於第一熱導率的第二熱導率，且其中多成分陶瓷塗層的介電常數高於鋁氧化物的介電常數。多成分陶瓷塗層具有的X的值在10/毫米(mm)至350/mm的範圍內，其中X=k/d，且其中k為多成分陶瓷塗層的介電常數，且d為多成分陶瓷塗層的厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrostatic chuck (ESC) baseplate is provided with a shoulder region configured to support an edge ring, and a multi-component ceramic coating is spray coat applied on at least the shoulder region, the coating having a first component and a second component, the first component having a first dielectric constant that is higher than a dielectric constant of aluminum oxide and also having a first thermal conductivity, and the second component having a second thermal conductivity that is higher than the first thermal conductivity, and wherein a dielectric constant for the multi-component ceramic coating is higher than the dielectric constant of aluminum oxide. The multi-component ceramic coating has a value X within a range of 10/millimeters (mm) to 350/mm, wherein X = k/d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:ESC</p>  
        <p type="p">202:底板</p>  
        <p type="p">204:多成分陶瓷塗層</p>  
        <p type="p">206:肩部區域</p>  
        <p type="p">208:邊緣環</p>  
        <p type="p">210:表面</p>  
        <p type="p">212:基板支撐件</p>  
        <p type="p">214:基板</p>  
        <p type="p">216:厚度</p>  
        <p type="p">218:邊緣區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="866" publication-number="202612018"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612018.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612018</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113121</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有減小之變形的介電質蝕刻</chinese-title>  
        <english-title>DIELECTRIC ETCH WITH REDUCED DISTORTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/3065</main-classification>  
        <further-classification edition="200601120251201B">H01L21/311</further-classification>  
        <further-classification edition="200601120251201B">H01L21/67</further-classification>  
        <further-classification edition="200601120251201B">H01J37/305</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THIE, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　台昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAESEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥基　尼爾　馬卡拉吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACKIE, NEIL MACARAEG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於在堆疊中蝕刻特徵部的方法。提供複數循環，其中各循環包括提供第一蝕刻，該第一蝕刻包括使包含第一蝕刻劑及含金屬鈍化劑的第一蝕刻氣體流動、使第一蝕刻氣體形成為第一電漿、以及將堆疊暴露於第一電漿，以同時將特徵部蝕刻至堆疊中、及在特徵部之側壁上沉積含導電金屬鈍化物；以及提供第二蝕刻，該第二蝕刻包括使包含第二蝕刻劑的第二蝕刻氣體流動、使第二蝕刻氣體形成為第二電漿、以及將堆疊暴露於第二電漿，以同時將特徵部蝕刻至堆疊中、及移除特徵部之側壁上之含導電金屬鈍化物的至少一些者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for etching features in a stack is provided. A plurality of cycles is provided wherein each cycle comprises providing a first etch, comprising flowing a first etch gas comprising a first etchant and a metal containing passivant, forming the first etch gas into a first plasma, and exposing the stack to the first plasma to simultaneously etch features into the stack and deposit electrically conductive metal containing passivation on sidewalls of the features, and providing a second etch, comprising flowing a second etch gas comprising a second etchant, forming the second etch gas into a second plasma, and exposing the stack to the second plasma to simultaneously etch features into the stack and remove at least some of the electrically conductive metal containing passivation on sidewalls of the features.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:步驟</p>  
        <p type="p">108:步驟</p>  
        <p type="p">112:步驟</p>  
        <p type="p">116:步驟</p>  
        <p type="p">120:步驟</p>  
        <p type="p">124:步驟</p>  
        <p type="p">128:步驟</p>  
        <p type="p">132:步驟</p>  
        <p type="p">136:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="867" publication-number="202612004"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612004.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612004</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113138</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓之加工方法、晶錠之加工方法及晶圓</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/304</main-classification>  
        <further-classification edition="200601120251210B">B24B7/04</further-classification>  
        <further-classification edition="200601120251210B">B24B49/12</further-classification>  
        <further-classification edition="201401120251210B">B23K26/352</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪思科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DISCO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関家一馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIYA, KAZUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明能夠形成更多元件。 &lt;br/&gt;本發明之晶圓之加工方法係由半導體材料所構成之晶圓之加工方法，且具備：準備步驟2001，其係準備晶圓，該晶圓包含正面、正面之背面的反面及自正面至反面之側面，且於側面具有表示晶圓之結晶方位之線狀平坦鏡面部；及研削步驟1005，其係對在準備步驟2001中準備之晶圓之反面進行研削而形成凹部並且形成圍繞凹部之凸部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1001:晶圓形成步驟</p>  
        <p type="p">1002:方位檢測步驟</p>  
        <p type="p">1003:線狀平坦鏡面部形成步驟</p>  
        <p type="p">1004:檢測步驟</p>  
        <p type="p">1005:研削步驟</p>  
        <p type="p">1006:收容步驟</p>  
        <p type="p">2001:準備步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="868" publication-number="202611947"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611947.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611947</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導電材料、連接構造體及連接構造體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01B1/22</main-classification>  
        <further-classification edition="200601120251201B">H01B5/16</further-classification>  
        <further-classification edition="200601120251201B">H01R11/01</further-classification>  
        <further-classification edition="200601120251201B">H01R43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山中雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANAKA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於將電極間電性連接之情形時，能夠提高電極部之接合強度，且能夠提高修復後獲得之連接構造體之導通可靠性的導電材料。 &lt;br/&gt;本發明之導電材料係包含焊料粒子、溶劑、活性劑、及黏合劑樹脂者，且將上述導電材料中之除上述焊料粒子以外之組合物以3℃/秒之升溫速度自25℃加熱至上述焊料粒子之熔點＋20℃，並於上述焊料粒子之熔點＋20℃之溫度下保持3分鐘時之重量減少率為50%以下，將上述導電材料中之除上述焊料粒子以外之組合物以50℃/秒之升溫速度自25℃加熱至400℃，並於400℃下保持30秒時之重量減少率為60%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="869" publication-number="202611982"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611982.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611982</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113388</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有超薄ｐ型材料層的錐形超接合</chinese-title>  
        <english-title>TAPERED SUPERJUNCTION WITH ULTRATHIN P-TYPE MATERIAL LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/02</main-classification>  
        <further-classification edition="200601120251201B">H01L21/324</further-classification>  
        <further-classification edition="202501120251201B">H10D30/01</further-classification>  
        <further-classification edition="202501120251201B">H10D62/00</further-classification>  
        <further-classification edition="202501120251201B">H10D62/10</further-classification>  
        <further-classification edition="202501120251201B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能本許　葉門哈森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOURBAKHSH, AMIRHASAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示了與具有超薄p型區域的錐形超接合結構相關的方法和結構。在一些實施例中，該方法可包括在基板上的第一n型材料層中形成開口，其中該開口具有側壁，該側壁具有小於90度的內部漸縮；形成p型材料層，該p型材料層在該第一n型材料層的該側壁上或進入該側壁中，並進入該第一n型材料層中的該開口的底部；移除該p型材料層的在該開口的該底部處的部分；以及沉積第二n型材料層以填充該開口。在一些實施例中，該p型材料層是藉由使用電漿摻雜製程或固態擴散摻雜製程對該第一n型材料層的側壁進行摻雜而形成的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and structures relating to tapered superjunction structures with ultrathin p-type regions. In some embodiments, a method may comprise forming an opening in a first n-type material layer on a substrate where the opening has sidewalls with an inward taper of less than 90 degrees, forming a p-type material layer on or into the sidewalls of the first n-type material layer and into a bottom of the opening in the first n-type material layer, removing a portion of the p-type material layer at the bottom of the opening, and depositing a second n-type material layer to fill the opening. In some embodiments, the p-type material layers are formed by doping the sidewalls of the first n-type material layer with a plasma doping process or a solid-state diffusion doping process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">302:基板</p>  
        <p type="p">304:層</p>  
        <p type="p">306:頂表面</p>  
        <p type="p">308:側壁</p>  
        <p type="p">310:底部</p>  
        <p type="p">380:開口</p>  
        <p type="p">390:結構</p>  
        <p type="p">392:厚度</p>  
        <p type="p">420:層</p>  
        <p type="p">422:材料層</p>  
        <p type="p">424:底部</p>  
        <p type="p">430:材料層</p>  
        <p type="p">432:氧化物層</p>  
        <p type="p">500A:視圖</p>  
        <p type="p">500B:視圖</p>  
        <p type="p">500C:視圖</p>  
        <p type="p">500D:視圖</p>  
        <p type="p">500E:視圖</p>  
        <p type="p">500F:視圖</p>  
        <p type="p">550:層</p>  
        <p type="p">552:擴散</p>  
        <p type="p">560:材料層</p>  
        <p type="p">562:厚度</p>  
        <p type="p">575:製程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="870" publication-number="202611438"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611438.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611438</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電磁爐</chinese-title>  
        <english-title>INDUCTION COOKER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250613B">F24C7/06</main-classification>  
        <further-classification edition="200601120250613B">F24C7/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安捷科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEF TECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅漢清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, HAN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉論善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LUN-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種電磁爐。電磁爐包含一加熱模組、一工作逆變器以及一電源模組。加熱模組能對炊具產生渦流。工作逆變器能輸出高頻電源以驅動加熱模組。電源模組包含一交流電端口、一二極體電橋、一電池單元、一電源切換器、以及一控制單元。交流電端口能通過市電輸出一交流電源。二極體電橋能轉換交流電源為一第一直流電源。電池單元能輸出一第二直流電源。控制單元能控制電源切換器輸出第一直流電源或第二直流電源至工作逆變器，以產生高頻電源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An induction cooker includes a heating module, a working inverter, and a power supply module. The heating module can generate eddy currents in a cookware. The working inverter can output high-frequency power to drive the heating module. The power supply module includes an alternating current (AC) port, a bridge diode, a battery unit, a power switch, and a control unit. The AC power port can output an AC source by utility power. The bridge diode can convert the AC source into a first direct current (DC) power. The battery unit can output a second DC power. The control unit can control the power switch to input the first DC power or the second DC power to the working inverter, so as to generate the high-frequency power.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:工作逆變器</p>  
        <p type="p">3:電源模組</p>  
        <p type="p">31:交流電端口</p>  
        <p type="p">32:電池單元</p>  
        <p type="p">33:控制單元</p>  
        <p type="p">331:電源供應器</p>  
        <p type="p">332:微控制單元</p>  
        <p type="p">333:電源控制器</p>  
        <p type="p">334:輸入源切換器</p>  
        <p type="p">34:二極體電橋</p>  
        <p type="p">35:電源切換器</p>  
        <p type="p">5:用戶介面</p>  
        <p type="p">6:線路濾波器</p>  
        <p type="p">7:溫度傳感器</p>  
        <p type="p">8:分壓器</p>  
        <p type="p">Z:絕緣閘雙極型晶體管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="871" publication-number="202611351"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611351.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611351</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113507</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻燃纖維複合體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">D01F6/14</main-classification>  
        <further-classification edition="200601120251201B">D01F6/40</further-classification>  
        <further-classification edition="200601120251201B">D02G3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹本慎一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEMOTO, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩知道直行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWACHIDO, NAOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緒方宏紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠井航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOI, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種阻燃纖維複合體，其係包含阻燃性丙烯腈系纖維(A)及聚乙烯醇系纖維(B)作為主成分而成之阻燃纖維複合體，前述阻燃性丙烯腈系纖維(A)與前述聚乙烯醇系纖維(B)之複合比率(質量比，阻燃性丙烯腈系纖維(A)/聚乙烯醇系纖維(B))為90/10～30/70，前述阻燃性丙烯腈系纖維(A)具有丙烯腈與含鹵素的乙烯基單體及/或含鹵素的亞乙烯基單體之共聚合結構，且包含銻化合物而成，前述聚乙烯醇系纖維(B)包含有機硫化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="872" publication-number="202612029"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612029.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612029</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃基板堆疊結構及其製作方法</chinese-title>  
        <english-title>GLASS SUBSTRATE STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">H01L21/48</main-classification>  
        <further-classification edition="200601120251202B">H01L23/13</further-classification>  
        <further-classification edition="200601120251202B">H01L23/15</further-classification>  
        <further-classification edition="200601120251202B">H01L23/538</further-classification>  
        <further-classification edition="200601120251202B">H01L25/03</further-classification>  
        <further-classification edition="202301120251202B">H01L25/065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣愛司帝科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTI GLOBAL INC., TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖建碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHIEN-SHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種玻璃基板堆疊結構及其製作方法。玻璃基板堆疊結構包括基底玻璃基板、多個堆疊玻璃基板以及頂端玻璃基板。基底玻璃基板的周圍處具有一基底玻璃黏著部。每一個堆疊玻璃基板的周圍處具有一第一堆疊玻璃黏著部一以及第二堆疊玻璃黏著部。頂端玻璃基板的周圍處具有一頂端玻璃黏著部。基底玻璃基板與最下層的堆疊玻璃基板透過基底玻璃基板的基底玻璃黏著部與最下層的堆疊玻璃基板的第一堆疊玻璃黏著部相互連接。彼此相鄰的兩個堆疊玻璃基板透過彼此相鄰的第一堆疊玻璃黏著部與第二堆疊玻璃黏著部相互連接。頂端玻璃基板與最上層的堆疊玻璃基板透過頂端玻璃基板的頂端玻璃黏著部與最上層的堆疊玻璃基板的第二堆疊玻璃黏著部相互連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a glass substrate stacking structure and a method of manufacturing the same. The glass substrate stacking structure includes a basic glass substrate, a plurality of stacked glass substrates and a top glass substrate. The basic glass substrate has a basic glass adhesive portion therearound. Each stacked glass substrate has a first and a second stacked glass adhesive portion therearound. The top glass substrate has a top glass adhesive portion therearound. The basic glass substrate and the bottommost stacked glass substrate are connected to each other through the basic glass adhesive portion and the first stacked glass adhesive portion. The two adjacent stacked glass substrates are connected to each other through the first and the second stacked glass adhesive portion. The top glass substrate and the topmost stacked glass substrate are connected to each other through the top glass adhesive portion and the second stacked glass adhesive portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S:玻璃基板堆疊結構</p>  
        <p type="p">S1:基底玻璃基板結構</p>  
        <p type="p">S2:堆疊玻璃基板結構</p>  
        <p type="p">S3:頂端玻璃基板結構</p>  
        <p type="p">1:基底玻璃基板</p>  
        <p type="p">100:基底玻璃黏著部</p>  
        <p type="p">11:基底導電線路層</p>  
        <p type="p">2:堆疊玻璃基板</p>  
        <p type="p">201:第一堆疊玻璃黏著部</p>  
        <p type="p">202:第二堆疊玻璃黏著部</p>  
        <p type="p">21:中間導電線路層</p>  
        <p type="p">3:頂端玻璃基板</p>  
        <p type="p">300:頂端玻璃黏著部</p>  
        <p type="p">31:頂端導電線路層</p>  
        <p type="p">4:第一導電貫穿體</p>  
        <p type="p">5:第二導電貫穿體</p>  
        <p type="p">C1:基底半導體晶片</p>  
        <p type="p">C2:中間半導體晶片</p>  
        <p type="p">C3:頂端半導體晶片</p>  
        <p type="p">L:雷射光束</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="873" publication-number="202611983"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611983.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611983</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113663</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>III－V族化合物半導體結構及其製造方法</chinese-title>  
        <english-title>III-V COMPOUND SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖爾庫大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TURUN YLIOPISTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉德　扎赫拉賈漢莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAD, ZAHRA JAHANSHAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路克卡南　佩卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAUKKANEN, PEKKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米耶提寧　米科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIETTINEN, MIKKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龐基寧　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUNKKINEN, MARKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科克　卡萊維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKKO, KALEVI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳孚竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於形成III－V族化合物半導體結構的方法（60），包括：提供具有外表面（61）的GaSb基板層；以及使該外表面經受液態熱水H&lt;sub&gt;2&lt;/sub&gt;O（HW），該HW的溫度在90℃至110℃的範圍內，例如，95℃至105℃的範圍內，例如約100℃，該HW的處理期間為至少30分鐘，例如40至80分鐘，例如約50分鐘、約60分鐘或約75分鐘。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method (60) for forming a III-V compound semiconductor structure comprises: providing a GaSb substrate layer having an outer surface (61); and subjecting the outer surface to liquid hot water H&lt;sub&gt;2&lt;/sub&gt;O, HW, at a temperature of the HW in the range of 90ᵒC to 110ᵒC, for example, in the range of 95ᵒC to 105ᵒC, for example, about 100ᵒC, for an HW treatment period of at least 30 minutes, for example, 40 to 80 minutes, for example, about 50 minutes, about 60 minutes, or about 75 minutes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:III-V族半導體結構、半導體結構</p>  
        <p type="p">110:結晶III-V族化合物半導體基板層、基板層</p>  
        <p type="p">111:外表面</p>  
        <p type="p">120:氧化物層</p>  
        <p type="p">121:結晶奈米顆粒、奈米顆粒</p>  
        <p type="p">D&lt;sub&gt;顆粒&lt;/sub&gt;:奈米顆粒的最大直徑</p>  
        <p type="p">HW:熱水H&lt;sub&gt;2&lt;/sub&gt;O</p>  
        <p type="p">t&lt;sub&gt;氧化物&lt;/sub&gt;:氧化物層的厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="874" publication-number="202610732"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610732.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610732</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113722</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有初給系統的處理模組</chinese-title>  
        <english-title>PROCESSING MODULE HAVING A PRIMING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">B08B3/04</main-classification>  
        <further-classification edition="201201120251210B">B24B53/017</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬洛門　曼尼肯當</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAYARAMAN, MANIKANDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇庫馬倫　喬迪許庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUKUMARAN, JAGADEESH KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朗加拉賈　傑更</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANGARAJAN, JAGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　郁文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YUWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭玥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁　蘊双</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, YUNSHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米克海琳全柯　伊卡特瑞納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKHAYLICHENKO, EKATERINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵　提摩西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THAO, TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露一種初給系統、一種具有初給系統的基板清洗模組，以及一種操作基板清洗模組的方法。初給系統包括配置用以選擇性地引導劑流量的轉向閥；與轉向閥耦合的初給噴嘴機構；以及與初給噴嘴機構耦合的分離腔室。初給噴嘴機構包括配置用以在分離腔室內釋放劑的釋放噴嘴，且該分離腔室配置用於處理該劑。操作基板清洗模組的方法包括在分配噴嘴停止分配劑的時間段內，將劑從分配噴嘴重新引導至釋放噴嘴的操作。此外，該方法還包括在分配噴嘴停止分配劑的同一時間段內，繼續透過釋放噴嘴分配劑的操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are a priming system, a substrate cleaning module having the priming system, and a method of operating the substrate cleaning module. The priming system includes a diversion valve configured to selectively direct a flow of an agent; a priming nozzle mechanism coupled with the diversion valve; and a separation chamber coupled with the priming nozzle mechanism. The priming nozzle mechanism includes a releasing nozzle configured to release the agent inside the separation chamber, and the separation chamber is configured to process the agent. The method of operating the substrate cleaning module includes operations to redirect an agent from a dispensing nozzle to a releasing nozzle during a time period when the dispensing nozzle stops dispensing the agent. The method further includes operations to continue dispensing the agent by the releasing nozzle during the same time period when the dispensing nozzle stops dispensing the agent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:劑供應系統</p>  
        <p type="p">402:劑供應模組</p>  
        <p type="p">404:模組</p>  
        <p type="p">406:初給系統</p>  
        <p type="p">408:三通轉向閥</p>  
        <p type="p">410:轉向閥</p>  
        <p type="p">412:控制器</p>  
        <p type="p">414:劑</p>  
        <p type="p">416:劑</p>  
        <p type="p">418:腔室</p>  
        <p type="p">420:收集模組</p>  
        <p type="p">422:管線接線段</p>  
        <p type="p">423:管線接線段</p>  
        <p type="p">424:接線段</p>  
        <p type="p">425:管線接線段</p>  
        <p type="p">426:接線段</p>  
        <p type="p">427:管線接線段</p>  
        <p type="p">428:噴嘴機構</p>  
        <p type="p">430:噴嘴機構</p>  
        <p type="p">432:第一輸送系統</p>  
        <p type="p">434:第二輸送系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="875" publication-number="202610799"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610799.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610799</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113782</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發泡體之製造方法</chinese-title>  
        <english-title>METHOD FOR PRODUCING FOAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B29C44/60</main-classification>  
        <further-classification edition="201901120251201B">B29C48/40</further-classification>  
        <further-classification edition="200601120251201B">C08J9/00</further-classification>  
        <further-classification edition="200601320251201B">B29K29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關道成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKI, MICHINARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種含有澱粉及乙烯醇系聚合物的發泡體之製造方法，其特徵為：包含在擠出機內混煉含有澱粉、乙烯醇系聚合物及水的原料並藉由水蒸氣使其擠出發泡而得到發泡體之步驟，而在將擠出機中最接近最前端部之混煉部A的擠出機溫度設為TA(℃)、將擠出機最前端部之擠出機溫度設為TB(℃)、將混煉部A的長度設為LA(m)、將從混煉部A的該最前端部側的端部到該最前端部為止的長度設為LB(m)時，滿足下式(I)，且滿足下述條件1或條件2。藉此而提供一種發泡體之製造方法，其減輕對裝置的負荷，可穩定地製造，且能夠得到密度適合用作緩衝材料之發泡體。&lt;br/&gt; 100≦TB   (I)&lt;br/&gt; 條件1：滿足式(II)&lt;br/&gt; 0≦LB≦8LA   (II)&lt;br/&gt; 條件2：滿足式(III)及式(IV)&lt;br/&gt; 8LA＜LB   (III)&lt;br/&gt; TA＜120   (IV)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="876" publication-number="202611436"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611436.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611436</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>火焰檢測裝置、煉鐵相關設備及火焰檢測方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">F23N5/24</main-classification>  
        <further-classification edition="200601120251205B">F27D21/00</further-classification>  
        <further-classification edition="200601120251205B">C10B31/00</further-classification>  
        <further-classification edition="200601120251205B">C10B7/14</further-classification>  
        <further-classification edition="201701120251205B">G06T7/246</further-classification>  
        <further-classification edition="202201120251205B">G06V20/52</further-classification>  
        <further-classification edition="201901120251205B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友重機械過程機器股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO HEAVY INDUSTRIES PROCESS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩朝義典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASA, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>二井大祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUTAI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 本發明係有鑑於以往技術的問題而開發完成者，其目的之一為提供一種能夠減少火焰檢測的錯誤判定之火焰檢測裝置。&lt;br/&gt;[解決手段] 本發明的火焰檢測裝置(1)係煉鐵相關設備的火焰檢測裝置，其具備：影像取得部(10)，其係取得被檢測區域的影像；部分影像檢測部(32)，其係從所取得之影像的幀內檢測具有既定的特徵之部分影像；運動向量檢測部(33)，其係檢測影像的幀之間的部分影像的運動向量；及火焰狀態判定部(36)，其係使用所檢測出之運動向量來判定被檢測區域的火焰的狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:火焰檢測裝置</p>  
        <p type="p">3:資訊處理部</p>  
        <p type="p">10:影像取得部</p>  
        <p type="p">30:輸入部</p>  
        <p type="p">31:影像調整部</p>  
        <p type="p">32:部分影像檢測部</p>  
        <p type="p">33:運動向量檢測部</p>  
        <p type="p">34:面積確定部</p>  
        <p type="p">35:色調確定部</p>  
        <p type="p">36:火焰狀態判定部</p>  
        <p type="p">37:橢圓估計部</p>  
        <p type="p">38:蓋狀態判定部</p>  
        <p type="p">39:重試計數器</p>  
        <p type="p">41:記憶部</p>  
        <p type="p">42:告知部</p>  
        <p type="p">43:模型生成部</p>  
        <p type="p">44:內部資料匯流排</p>  
        <p type="p">61:告知裝置</p>  
        <p type="p">F1:影像</p>  
        <p type="p">F2:影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="877" publication-number="202611168"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611168.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611168</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體基板的製造方法及膜形成用組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G65/34</main-classification>  
        <further-classification edition="200601120251201B">G03F7/11</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木股寛統</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMATA, HIRONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾崎優貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZAKI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芹澤龍一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SERIZAWA, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體基板的製造方法及膜形成用組成物，所述半導體基板的製造方法利用保存穩定性良好、且能夠形成成膜性、耐蝕刻性及耐鹼性液體性優異的膜的膜形成用組成物。一種半導體基板的製造方法，包括於基板上塗敷膜形成用組成物的步驟，所述膜形成用組成物含有至少包含金屬原子及多元醇的金屬化合物、以及溶媒，所述金屬原子為選自由鎂、鈣、鍶、鋇、鈧、釔、鋯、鉿、錳、鈷、鎳、鋅、鋁、鎵、銦、錫及鉛所組成的群組中的至少一種。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="878" publication-number="202611014"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611014.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611014</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113913</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著劑、黏著劑組成物、化合物之製造方法及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C327/22</main-classification>  
        <further-classification edition="200601120251201B">C08F20/38</further-classification>  
        <further-classification edition="200601120251201B">C09J133/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塚田裕以智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKADA, YUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米田周平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEDA, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之黏著劑具有由下式(1)所示化合物衍生之構造單位。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="155px" width="475px" file="ed10052.JPG" alt="ed10052.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，R&lt;sub&gt;1&lt;/sub&gt;表示脂肪族烴基、芳香族烴基或芳香脂肪族烴基；R&lt;sub&gt;2&lt;/sub&gt;彼此相同或相異，表示氫原子或甲基；R&lt;sub&gt;3&lt;/sub&gt;表示氫原子或甲基；n表示1以上之整數；當n表示1時，X表示硫原子，Y表示硫原子；當n表示2以上之整數時，X表示硫原子或氧原子，Y表示硫原子或氧原子，但至少1個Y表示硫原子)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="879" publication-number="202611147"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611147.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611147</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113959</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性樹脂、硬化性樹脂組成物、硬化物、預浸漬物、電路基板、增層薄膜、半導體封裝材料及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F290/06</main-classification>  
        <further-classification edition="200601120251201B">C08J5/24</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification>  
        <further-classification edition="200601120251201B">H01L23/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迫雅樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAZAMA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊立宸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LICHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金榮璨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNGCHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]本發明提供一種硬化性樹脂組成物，其帶來同時滿足低介電特性(低介電常數及低介電損耗角正切)、吸濕後的良好的介電特性、對銅箔的高密合性及高耐熱性的硬化物。&lt;br/&gt; [解決手段]一種硬化性樹脂，其含有式(1)所示的結構單元、以及式(2)所示的結構單元及式(3)所示的結構單元中的至少一者、以及末端(甲基)丙烯醯基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="880" publication-number="202610931"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610931.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610931</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113967</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>純化廠及純化廠之控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C01B3/50</main-classification>  
        <further-classification edition="200601120251211B">C01B3/04</further-classification>  
        <further-classification edition="200601120251211B">B01D53/02</further-classification>  
        <further-classification edition="200601120251211B">B01D53/58</further-classification>  
        <further-classification edition="200601120251211B">F23G7/06</further-classification>  
        <further-classification edition="200601120251211B">F28D21/00</further-classification>  
        <further-classification edition="200601120251211B">G05D23/00</further-classification>  
        <further-classification edition="200601120251211B">F23L15/02</further-classification>  
        <further-classification edition="200601120251211B">F23L15/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>速水翔平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAMI, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>志村良太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMURA, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺谷悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERATANI, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤村寿明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWAMURA, TOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中幸男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YUKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉徳光一朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHITOKU, KOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之純化廠包含：TSA塔，其自分解氣體排出使未反應之前述氨吸附於吸附劑而去除後之處理完成氣體；氣體純化裝置，其自前述處理完成氣體將純化後之產品氣體與廢氣分離並排出；廢氣加熱裝置，其加熱前述廢氣，作為將前述TSA塔之吸附劑再生之再生氣體供給至前述TSA塔；燃燒裝置，其供給使自前述TSA塔排出之前述再生氣體燃燒後之燃燒氣體之一部分，作為前述廢氣加熱裝置之熱源；廢氣流路，其使前述廢氣流通至前述燃燒裝置；及燃燒氣體流路，其使前述燃燒氣體流通至前述廢氣加熱裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:廠</p>  
        <p type="p">2:分解廠</p>  
        <p type="p">3:純化廠</p>  
        <p type="p">10:控制裝置</p>  
        <p type="p">21:氨供給裝置</p>  
        <p type="p">22:氨分解裝置</p>  
        <p type="p">23:氨回收裝置(ARU)</p>  
        <p type="p">30,30A,30B:TSA塔</p>  
        <p type="p">31:氣體純化裝置</p>  
        <p type="p">32:廢氣加熱裝置(第1廢氣加熱裝置)</p>  
        <p type="p">33:空氣供給裝置</p>  
        <p type="p">34:空氣加熱裝置</p>  
        <p type="p">35:燃燒裝置</p>  
        <p type="p">L1:分解氣體流路</p>  
        <p type="p">L2:氣體流路</p>  
        <p type="p">L3:廢氣流路</p>  
        <p type="p">L4:空氣流路</p>  
        <p type="p">L5:燃燒氣體流路</p>  
        <p type="p">L31:副產氣體流路</p>  
        <p type="p">L51:廢氣加熱裝置旁通流路</p>  
        <p type="p">L52:空氣加熱裝置旁通流路</p>  
        <p type="p">S1:濃度計</p>  
        <p type="p">T1,T2:溫度計</p>  
        <p type="p">V31:副產氣體流量調整閥</p>  
        <p type="p">V51,V52:旁通閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="881" publication-number="202612343"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612343.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612343</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113969</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉助於多個虛擬網路功能塊對具有高畫質多媒體介面端口的遠端裝置進行消費性電子控制通訊之方法及設備</chinese-title>  
        <english-title>METHOD FOR PERFORMING CONSUMER ELECTRONICS CONTROL COMMUNICATION WITH REMOTE DEVICE HAVING HIGH-DEFINITION MULTIMEDIA INTERFACE PORT WITH AID OF MULTIPLE VIRTUAL NETWORK BLOCKS, AND ASSOCIATED APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250902B">H04N21/43</main-classification>  
        <further-classification edition="201101120250902B">H04N21/436</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀丞懋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, CHENG-MAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭景升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHING-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李京叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHING-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁沛基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEONG, PUI-KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供藉助於多個虛擬網路功能塊(簡稱VNB)對具有高畫質多媒體介面(簡稱HDMI)端口的遠端裝置進行消費性電子控制(簡稱CEC)通訊之方法以及相關設備。該方法可包含：利用多個VNB中之第一VNB，透過第一CEC線從第一裝置接收第一訊息；利用第一VNB將第一訊息轉換為第一封包，以供進行跨CEC線傳輸；利用第一VNB將第一封包傳送至多個VNB中之第二VNB；利用第二VNB將第一封包轉換為第二訊息，其中第一訊息和第二訊息符合預定訊框格式；以及利用第二VNB，透過第二CEC線將第二訊息傳送至遠端裝置，以容許第一裝置藉由跨CEC線傳輸來間接地對遠端裝置進行CEC通訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for performing consumer electronics control (CEC) communication with a remote device having high-definition multimedia interface (HDMI) port with aid of multiple virtual network blocks (VNBs) and associated apparatus are provided. The method may include: utilizing a first VNB among the multiple VNBs to receive a first message from a first device through a first CEC line; utilizing the first VNB to convert the first message into a first packet, for performing cross-CEC-line transmission; utilizing the first VNB to transmit the first message to a second VNB among the multiple VNBs; utilizing the second VNB to convert the first packet into a second message, the messages conforming to predetermined frame format; and utilizing the second VNB to transmit the second message to the remote device through a second CEC line, to allow the first device to indirectly perform the CEC communication with the remote device via the cross-CEC-line transmission.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6_0~6_2:消費性電子控制(CEC)線</p>  
        <p type="p">110,210,310:虛擬網路功能塊(VNB)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="882" publication-number="202611652"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611652.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611652</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＳＣＡＤＡ　Ｗｅｂ　ＨＭＩ系統</chinese-title>  
        <english-title>SCADA WEB HMI SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">G05B23/02</main-classification>  
        <further-classification edition="200601120250901B">G05B19/05</further-classification>  
        <further-classification edition="200601120250901B">G05B19/418</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＭＥＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TMEIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野島章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOJIMA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水伸夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, NOBUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">應用軟體開發機具有的工程設計工具係構成為執行在更新過的應用軟體內容附加表示應用軟體內容的變更內容的變更等級。附加變更等級係包含：當對SCADA資源資料新增或刪除PLC信號的情形，附加變更等級1；當進行PLC信號的新增或刪除以外的變更的情形，附加變更等級2；當變更畫面固有資料的情形，對HMI畫面資料附加變更等級1；及當變更畫面共通資料的情形，對HMI畫面資料附加變更等級2。SCADA伺服器及監視終端裝置係構成為，依據附加在更新過的應用軟體內容的變更等級，限定令更新過的應用軟體內容反映的反映處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In a SCADA Web HMI system of the present disclosure, an engineering tool included in an application development machine is configured to execute addition of change levels indicative of changes in application content to the updated application content. Addition of change levels includes: adding a change level 1 when a PLC signal is added or deleted from a SCADA resource data; adding a change level 2 when a change other than addition or deletion of a PLC signal is made; adding the change level 1 to HMI screen data when screen-specific data are changed, and adding the change level 2 to the HMI screen data when screen-common data are changed. A SCADA server and a monitoring terminal are configured to limit a reflection process that reflects the updated application content according to the change levels added to the updated application content.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:監視終端裝置</p>  
        <p type="p">3:SCADA伺服器</p>  
        <p type="p">5:應用軟體開發機</p>  
        <p type="p">21:Web瀏覽器</p>  
        <p type="p">22:應用程式</p>  
        <p type="p">23:二次記憶裝置</p>  
        <p type="p">24:記憶體</p>  
        <p type="p">32:SCADA程式</p>  
        <p type="p">33:二次記憶裝置</p>  
        <p type="p">34:記憶體</p>  
        <p type="p">51:應用軟體內容</p>  
        <p type="p">52:二次記憶裝置</p>  
        <p type="p">511:SCADA資源資料</p>  
        <p type="p">512:HMI畫面資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="883" publication-number="202611340"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611340.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611340</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於提高電鍍品質和防止待電鍍物體之光澤劣化的電鍍裝置</chinese-title>  
        <english-title>PLATING DEVICE FOR IMPROVING PLATING QUALITY AND PREVENTING GLOSS DETERIORATION OF OBJECTS TO BE PLATED</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C25D17/04</main-classification>  
        <further-classification edition="200601120251201B">C25D17/06</further-classification>  
        <further-classification edition="200601120251201B">C25D21/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＴＰＳ伊萊康股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TPS ELECOMM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐旻吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, MIN OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於提高電鍍品質及防止一待電鍍物體之光澤劣化的電鍍裝置。本發明之一目標為提高一垂直連續電鍍槽或一普通浸入式電鍍槽之電鍍品質及製造良率兩者。在一具體實例中，本發明提供一種用於提高電鍍品質及防止一待電鍍物體之光澤劣化的電鍍裝置，其中該電鍍裝置包括一電鍍槽、一電子管道、一基板安裝桿及一安裝桿移動單元。因此，本發明之電鍍裝置通過該電子管道注入壓力，同時在該電鍍槽內在向前/向後方向、左/右方向及向上/向下方向上移動該待電鍍物體，使得該電子管道之影響可均勻地施加至具有不同縱橫比及厚度之該待電鍍物體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a plating device for improving plating quality and preventing gloss deterioration of an object to be plated. An object of the present invention is to improve both plating quality and manufacturing yield of a vertical continuous plating bath or a general dip-type plating bath. In an embodiment, the present invention provides a plating device for improving plating quality and preventing gloss deterioration of an object to be plated, wherein the plating device includes a plating bath, an e-duct, a substrate mounting bar, and a mounting bar moving unit. Thus, the inventive plating device injects pressure through the e-duct while moving the to-be-plated object in the forward/rearward, left/right, and upward/downward directions within the plating bath, so that the influence of the e-duct can be evenly applied to to-be-plated objects with different aspect ratios and thicknesses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電鍍槽</p>  
        <p type="p">120:電子管道</p>  
        <p type="p">121a:馬達</p>  
        <p type="p">121b:凸輪</p>  
        <p type="p">121c:汽缸</p>  
        <p type="p">122:循環泵</p>  
        <p type="p">123:連接管</p>  
        <p type="p">130:基板安裝桿</p>  
        <p type="p">131:夾具</p>  
        <p type="p">132:V形鞍座</p>  
        <p type="p">140:安裝桿移動單元</p>  
        <p type="p">141:基座框架</p>  
        <p type="p">141a:垂直支撐件</p>  
        <p type="p">141b:水平支撐件</p>  
        <p type="p">142:上部支撐件</p>  
        <p type="p">143:y軸移動支撐件</p>  
        <p type="p">144:y軸驅動汽缸</p>  
        <p type="p">144a:馬達</p>  
        <p type="p">144b:凸輪</p>  
        <p type="p">145:y軸移動桿</p>  
        <p type="p">146:x軸移動桿</p>  
        <p type="p">146a:馬達</p>  
        <p type="p">147:V形鞍座總成</p>  
        <p type="p">150:屏蔽件</p>  
        <p type="p">151:屏蔽板安裝桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="884" publication-number="202612161"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612161.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612161</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114047</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池電極及其製造方法</chinese-title>  
        <english-title>BATTERY ELECTRODE AND METHOD OF MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251201B">H01M4/139</main-classification>  
        <further-classification edition="200601120251201B">H01M4/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商世索科專業聚合物義大利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYENSQO SPECIALTY POLYMERS ITALY S.P.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝斯考　多明尼奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASCOUR, DOMINIQUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班阿里　伊瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEN ALI, IMED EDDINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬西　文森特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FINSY, VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種凝膠化的電極形成組成物、其製備方法以及其用於製造電化學電池單元用的凝膠化的電極之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a gelled electrode-forming composition, to a method for its preparation and to its use for the manufacture of gelled electrodes for electrochemical cells.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="885" publication-number="202612132"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612132.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612132</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114049</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括基材、整合裝置、及散熱板的封裝</chinese-title>  
        <english-title>PACKAGE INCLUDING SUBSTRATES, INTEGRATED DEVICES, AND HEAT SLUG</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L23/367</main-classification>  
        <further-classification edition="200601120251210B">H01L21/48</further-classification>  
        <further-classification edition="200601120251210B">H01L23/00</further-classification>  
        <further-classification edition="200601120251210B">H01L25/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬爾　拉傑尼希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, RAJNEESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾德雷特　馬努埃爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALDRETE, MANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古普塔　皮尤什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, PIYUSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻　博翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, BOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕提爾　安尼基特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, ANIKET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置包括耦接至一第一基材的一第一整合裝置及耦接至一第二基材的一第二整合裝置。該第一基材設置在該第一整合裝置與該第二整合裝置之間。該第一整合裝置電連接至該第二整合裝置。該裝置亦包括一散熱板，該散熱板界定突起部。該等突起部係經由該第一基材的接觸件熱耦接至該第二整合裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device includes a first integrated device coupled to a first substrate and a second integrated device coupled to a second substrate. The first substrate is disposed between the first integrated device and the second integrated device. The first integrated device is electrically connected to the second integrated device. The device also includes a heat slug defining protrusions. The protrusions are thermally coupled, via contacts of the first substrate, to the second integrated device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:散熱片</p>  
        <p type="p">104:整合裝置</p>  
        <p type="p">106A-106B:整合裝置</p>  
        <p type="p">108:基板</p>  
        <p type="p">110:基板</p>  
        <p type="p">112:介電質</p>  
        <p type="p">114A-114C:金屬層</p>  
        <p type="p">116:介電質</p>  
        <p type="p">118A-118C:金屬層</p>  
        <p type="p">120:導電互連件</p>  
        <p type="p">122:阻焊層</p>  
        <p type="p">124:阻焊層</p>  
        <p type="p">126:模製化合物</p>  
        <p type="p">128:接觸件</p>  
        <p type="p">130:電路板</p>  
        <p type="p">132:接觸件</p>  
        <p type="p">134:封裝外接觸件</p>  
        <p type="p">136:電互連件</p>  
        <p type="p">140A-140B:基板貫孔</p>  
        <p type="p">142A-142B:焊料</p>  
        <p type="p">144A-144B:突起部</p>  
        <p type="p">146A-146B:接觸件</p>  
        <p type="p">148:路由跡線</p>  
        <p type="p">150:底部填充材料</p>  
        <p type="p">152:接觸件</p>  
        <p type="p">154:層</p>  
        <p type="p">156:上表面</p>  
        <p type="p">160:插圖</p>  
        <p type="p">190:封裝</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="886" publication-number="202611478"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611478.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611478</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學單元、處理裝置及處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G01B11/00</main-classification>  
        <further-classification edition="200601120251001B">G02B27/10</further-classification>  
        <further-classification edition="202101120251001B">G02B7/02</further-classification>  
        <further-classification edition="200601120251001B">G06T1/00</further-classification>  
        <further-classification edition="200601120251001B">G06T5/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮原遼太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAHARA, RYOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學單元(1)，在算出已保持於頭部(4)的第1構件(P1)與已保持於載台(5)的第2構件(P2)之相對位置時，拍攝第1構件(P1)及第2構件(P2)，前述光學單元(1)具備光合成部(3)、相機(11)及相機用透鏡(2)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學單元</p>  
        <p type="p">2:相機用透鏡</p>  
        <p type="p">3:光合成部</p>  
        <p type="p">4:頭部</p>  
        <p type="p">5:載台</p>  
        <p type="p">6:運算裝置</p>  
        <p type="p">7:顯示裝置</p>  
        <p type="p">8:校正治具載台</p>  
        <p type="p">10:光學單元保持部</p>  
        <p type="p">11:相機</p>  
        <p type="p">20:光軸</p>  
        <p type="p">21:焦點面</p>  
        <p type="p">22:同軸照明</p>  
        <p type="p">31:稜鏡</p>  
        <p type="p">31a:第1反射面</p>  
        <p type="p">31b:第2反射面</p>  
        <p type="p">31c:反射面交線</p>  
        <p type="p">32:工件側透鏡</p>  
        <p type="p">32a:第1工件側透鏡</p>  
        <p type="p">32b:第2工件側透鏡</p>  
        <p type="p">33:稜鏡背面照明</p>  
        <p type="p">34:斜光照明</p>  
        <p type="p">81:校正治具</p>  
        <p type="p">100:處理裝置</p>  
        <p type="p">A:合成圖像</p>  
        <p type="p">A0:視野邊界線</p>  
        <p type="p">A1:第1圖像</p>  
        <p type="p">A2:第2圖像</p>  
        <p type="p">A3:第3圖像</p>  
        <p type="p">H:水平面</p>  
        <p type="p">M1,M2:基準標記</p>  
        <p type="p">P1:第1構件</p>  
        <p type="p">P2:第2構件</p>  
        <p type="p">X,Y,Z:方向</p>  
        <p type="p">φ1,φ2:角度</p>  
        <p type="p">θ:傾斜角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="887" publication-number="202610949"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610949.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610949</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114158</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紫外線處理裝置</chinese-title>  
        <english-title>ULTRAVIOLET RAY TREATMENT APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251205B">C02F1/32</main-classification>  
        <further-classification edition="202301120251205B">C02F1/78</further-classification>  
        <further-classification edition="200601120251205B">B01J19/12</further-classification>  
        <further-classification edition="200601120251205B">C01B13/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本光電科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHOTOSCIENCE JAPAN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山越裕司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKOSHI, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種兼備紫外線之臭氧產生功能與液體處理功能之紫外線處理裝置。UV照射容器(11)構成為於內部形成氣相空間(GPS)與液相空間(LPS)，且以將紫外線光源(12)設置於氣相空間(GPS)內，自該氣相空間對液相空間(LPS)照射紫外線之方式構成。又，設置：氣體入口(11g)，其將含氧之氣體引入至氣相空間(GPS)內；及氣體出口(11h)，其將含有於該氣相空間中藉由紫外線照射而產生之臭氧的氣體排出至容器外。藉由設置以將被處理液體導入至UV照射容器(11)內之方式構成之液體導入構造(13)，而形成上述液相空間(LPS)。藉由來自紫外線光源(12)之紫外線自氣相空間照射於該液相空間內之被處理液體，對被處理液體進行紫外線處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention seeks to provide an ultraviolet ray treatment apparatus having both of an ozone generation function and a liquid treatment function. A vessel (11) for UV irradiation is constructed to form a gaseous phase space (GPS) and a liquid phase space (LPS) therein in such a manner that a UV light source (12) is disposed in the gaseous phase space (GPS) so as to irradiate ultraviolet rays to the liquid phase space (LPS) from the gaseous phase space (GPS). Also, there are provided a gas inlet (11g) for taking gas including oxygen into the gaseous phase space (GPS) and a gas outlet (11h) for exhausting, out of the vessel, a gas including ozone having been generated as a result of the UV irradiation in the gaseous phase space (GPS). Further, there is provided a liquid-introducing construction (13) that is configured to introduce a liquid to be treated into the vessel (11) for UV irradiation to thereby form the liquid phase space (LPS) in the vessel. Ultraviolet rays from the UV light source (12) are irradiated to the liquid to be treated in the liquid phase space (LPS) from the gaseous phase space (GPS), so that ultraviolet ray treatment to the liquid to be treated is performed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:紫外線處理裝置</p>  
        <p type="p">11:UV照射容器</p>  
        <p type="p">11a:聯結法蘭</p>  
        <p type="p">11b:聯結法蘭</p>  
        <p type="p">11c:O形環</p>  
        <p type="p">11d:O形環</p>  
        <p type="p">11e:端板凸緣</p>  
        <p type="p">11f:端板凸緣</p>  
        <p type="p">11g:氣體入口</p>  
        <p type="p">11h:氣體出口</p>  
        <p type="p">12:紫外線光源</p>  
        <p type="p">13:液體導入構造</p>  
        <p type="p">13a:液體入口</p>  
        <p type="p">13b:液體出口</p>  
        <p type="p">GPS:氣相空間</p>  
        <p type="p">LPS:液相空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="888" publication-number="202611643"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611643.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611643</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114247</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造設備與方法</chinese-title>  
        <english-title>SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250710B">G03F7/26</main-classification>  
        <further-classification edition="200601120250710B">G03F7/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳裕凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尚昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHANG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋易瑾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, I-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露的晶圓處理設備包括內杯、中杯、外杯、及分隔器，內杯包括第一杯壁及第一底表面，中杯包圍內杯，中杯包括第二杯壁及在第一杯壁與第二杯壁之間的第二底表面，外杯包圍中杯，外杯包括第三杯壁及在第二杯壁與第三杯壁之間的第三底表面，分隔器用以在分隔器之頂表面與第二底表面共面的第一位置與分隔器之頂表面上升至高於第二底表面的第二位置之間移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wafer processing apparatus according to the present disclosure includes an inner cup including a first cup wall and a first bottom surface, a middle cup enclosing the inner cup, the middle cup including a second cup wall and a second bottom surface between the first cup wall and the second cup wall, an outer cup enclosing the middle cup, the outer cup including a third cup wall and a third bottom surface between the second cup wall and the third cup wall, and a divider configured to move between a first position where a top surface of the divider is coplanar with the second bottom surface and a second position where the top surface of the divider rises above the second bottom surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶圓處理設備</p>  
        <p type="p">102:晶圓卡盤</p>  
        <p type="p">104:可旋轉軸</p>  
        <p type="p">106:內杯</p>  
        <p type="p">106A:第一斜角頂部部分</p>  
        <p type="p">106B:第一底表面</p>  
        <p type="p">106W:第一杯壁</p>  
        <p type="p">108:中杯</p>  
        <p type="p">108A:第二斜角頂部部分</p>  
        <p type="p">108B:第二底表面</p>  
        <p type="p">108W:第二杯壁</p>  
        <p type="p">110:外杯</p>  
        <p type="p">110A:第三斜角頂部部分</p>  
        <p type="p">110B:第三底表面</p>  
        <p type="p">110W:第三杯壁</p>  
        <p type="p">112:第一排放開口</p>  
        <p type="p">114:第二排放開口</p>  
        <p type="p">116:第三排放開口</p>  
        <p type="p">120:分隔器</p>  
        <p type="p">122:基座構件</p>  
        <p type="p">130:閥</p>  
        <p type="p">H:較高位置</p>  
        <p type="p">L:較低位置</p>  
        <p type="p">OH:上部擷取開口</p>  
        <p type="p">OL:下部擷取開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="889" publication-number="202612487"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612487.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612487</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114370</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>互連區域中的平面電容及三維電容</chinese-title>  
        <english-title>PLANAR AND 3D CAPACITORS IN INTERCONNECT REGION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251204B">H10D1/60</main-classification>  
        <further-classification edition="202501120251204B">H10D62/10</further-classification>  
        <further-classification edition="202501120251204B">H10D64/20</further-classification>  
        <further-classification edition="200601120251204B">H01L21/768</further-classification>  
        <further-classification edition="200601120251204B">H01L21/76</further-classification>  
        <further-classification edition="200601120251204B">H01L23/535</further-classification>  
        <further-classification edition="202501120251204B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商英特爾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛洛斯特　丹席</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FROST, DENZIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全輝燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUN, HWICHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布歇　紀羅姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOUCHE, GUILLAUME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴　昌郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, CHANGYOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古哈尼奧吉　圖欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUHA NEOGI, TUHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">&lt;b&gt; &lt;/b&gt;用於在積體電路的元件層上方或下方的互連區域中的一個或多個平面MIM電容之上形成一個或多個MIM溝槽電容的技術。MIM溝槽電容在互連區域的一個或多個互連層中，且可具有相對較高的高度。MIM溝槽電容包含第一電極、在第一電極上的電容介電質及在電容介電質上的第二電極，且沿複數個介電鰭部的外表面延伸，從而在相對較小的平面佔用面積內增加電容的表面積。平面MIM電容在該MIM溝槽電容之下，與該MIM溝槽電容在相同互連層內。平面MIM電容包含由電容介電質隔開的第一平面電極及第二平面電極，且可與MIM溝槽電容電性隔離或電容耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques for forming one or more MIM trench capacitors over one or more planar MIM capacitors in an interconnect region above or below a device layer of an integrated circuit. The MIM trench capacitor(s) is in one or more interconnect layers of the interconnect region, and can have a relatively high height. The MIM trench capacitor includes a first electrode, a capacitor dielectric on the first electrode, and a second electrode on the capacitor dielectric, and runs along the outside surface of a plurality of dielectric fins, which increases the surface area of the capacitor within a relatively small plan footprint. A planar MIM capacitor is beneath the MIM trench capacitor within a same interconnect layer as the MIM trench capacitor. The planar MIM capacitor includes first and second planar electrodes separated by a capacitor dielectric, and may be electrically isolated from, or capacitively coupled to, the MIM trench capacitor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:介電層</p>  
        <p type="p">204:介電鰭片</p>  
        <p type="p">206:第一電極</p>  
        <p type="p">208:第一頂側接點</p>  
        <p type="p">210:第一介電結構</p>  
        <p type="p">212:第二電極</p>  
        <p type="p">214:第二頂側接點</p>  
        <p type="p">216:導電跡線</p>  
        <p type="p">218:導電跡線</p>  
        <p type="p">220:平面MIM電容</p>  
        <p type="p">222:第三電極</p>  
        <p type="p">224:第二介電結構</p>  
        <p type="p">226:第四電極</p>  
        <p type="p">228:介電層</p>  
        <p type="p">230:導電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="890" publication-number="202611144"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611144.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611144</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114522</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固化物及半導體裝置之製造方法以及組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F290/04</main-classification>  
        <further-classification edition="201601120251201B">C08G75/045</further-classification>  
        <further-classification edition="200601120251201B">C08K3/08</further-classification>  
        <further-classification edition="200601120251201B">C08K5/14</further-classification>  
        <further-classification edition="200601120251201B">C08K5/37</further-classification>  
        <further-classification edition="200601120251201B">C08K5/54</further-classification>  
        <further-classification edition="200601120251201B">C08L33/04</further-classification>  
        <further-classification edition="200601120251201B">C09K5/14</further-classification>  
        <further-classification edition="200601120251201B">H01L23/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舘野貴一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATENO, KIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古川直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>津田義博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUDA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村優希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造方法，其係組成物的固化物之製造方法，前述方法包括在溫度T1下對包含固化性成分、導熱性填料及固化劑之組成物進行加熱之步驟，其中，溫度T1與固化劑的1分鐘半衰期溫度Tm處於下述式（A）的關係。&lt;br/&gt; -20℃≤T1-Tm≤25℃……（A）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體晶片</p>  
        <p type="p">2:散熱器</p>  
        <p type="p">3:組成物</p>  
        <p type="p">10:複合體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="891" publication-number="202611091"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611091.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611091</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114526</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合物、聚合物、硬化物、成形體及聚甲基丙烯酸甲酯之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F2/38</main-classification>  
        <further-classification edition="200601120251201B">C08F2/44</further-classification>  
        <further-classification edition="200601120251201B">C08F20/14</further-classification>  
        <further-classification edition="200601120251201B">C08L33/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安富陽一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUTOMI, YOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>角谷英則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADOYA, HIDENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可獲得耐熱性優異之成形體之組合物、使用該組合物而獲得之聚合物、硬化物及成形體、以及使用該組合物之聚甲基丙烯酸甲酯之製造方法。 &lt;br/&gt;本發明之組合物含有甲基丙烯酸甲酯及碳數1～3之醇，碳數1～3之醇之濃度為組合物整體之超過0質量ppm且10000質量ppm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="892" publication-number="202611096"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611096.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611096</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114539</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、感光性樹脂皮膜、感光性乾薄膜、圖型形成方法、顯示裝置及微發光二極體顯示器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F2/44</main-classification>  
        <further-classification edition="200601120251201B">C08F290/12</further-classification>  
        <further-classification edition="200601120251201B">C08F299/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/031</further-classification>  
        <further-classification edition="200601120251201B">G03F7/033</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/105</further-classification>  
        <further-classification edition="200601120251201B">G03F7/16</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="202501120251201B">H10H29/855</further-classification>  
        <further-classification edition="200601120251201B">G02B5/00</further-classification>  
        <further-classification edition="200601120251201B">B32B27/20</further-classification>  
        <further-classification edition="200601120251201B">B32B27/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊澤久美子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAZAWA, KUMIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]目的在於提供一種可容易形成具有高微影解析性、良好的藍色光吸收特性的被膜的感光性樹脂組成物、使用該感光性樹脂組成物所得到的感光性樹脂皮膜、感光性乾薄膜及使用該等的圖型形成方法，以及使用前述感光性樹脂組成物所得到的顯示裝置。 &lt;br/&gt;　　[解決手段]一種感光性樹脂組成物，其特徵在於，其係用於吸收穿透含有可發射紅色或綠色螢光的量子點的光阻劑硬化膜的藍色發光二極體光的感光性樹脂組成物，包含：(A)支鏈中具有(甲基)丙烯醯基的丙烯酸樹脂、(B)在波長490~430nm之任一波長中具有最大吸收波長的染料、(C)肟系光自由基產生劑、(D)界面活性劑及(E)溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:本發明的感光性樹脂組成物的硬化膜1</p>  
        <p type="p">2:含有量子點的光阻劑硬化膜</p>  
        <p type="p">3:藍色發光二極體</p>  
        <p type="p">10,30:藍色發光二極體光</p>  
        <p type="p">20:紅色螢光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="893" publication-number="202611348"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611348.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611348</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114557</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱塑性聚胺酯（ＴＰＵ）短纖維、其生產方法、以及ＴＰＵ短纖維之用途</chinese-title>  
        <english-title>THERMOPLASTIC POLYURETHANE (TPU) STAPLE FIBER, A PROCESS FOR PRODUCING THE SAME, AND THE USE OF TPU STAPLE FIBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">D01D5/08</main-classification>  
        <further-classification edition="200601120251201B">D01D5/16</further-classification>  
        <further-classification edition="200601120251201B">D01D5/22</further-classification>  
        <further-classification edition="200601120251201B">D01D5/26</further-classification>  
        <further-classification edition="200601120251201B">D01F6/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴斯夫歐洲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹德薈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, DE HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻惠至</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, HUI ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐慶淮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, QING HUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張寅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種新型熱塑性聚胺酯（TPU）短纖維及其生產方法；以及該TPU短纖維在生產用於在鞋面、褲子、T恤、座椅網、錶帶和髮帶中使用的織物的紗線，或用於羽絨服、被子和墊子的填充材料，或用於合成皮革、服裝和鞋的非織造織物，或有機片材中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a novel thermoplastic polyurethane (TPU) staple fiber and a process for producing the same, and to the use of the TPU staple fiber in producing yarns for fabrics used in shoes upper, pants, T-shirt, chair mesh, watch band and hair band, or stuffing materials for down jacket, quilt and cushion, or nonwoven fabric for synthetic leather, apparel and shoe, or organo sheet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:擠出機</p>  
        <p type="p">110:紡絲組件</p>  
        <p type="p">120、130、140、150:導向輥</p>  
        <p type="p">160:絲束收集器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="894" publication-number="202611145"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611145.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611145</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114564</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固化物及半導體裝置之製造方法以及組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F290/04</main-classification>  
        <further-classification edition="201601120251201B">C08G75/045</further-classification>  
        <further-classification edition="201801120251201B">C08K3/013</further-classification>  
        <further-classification edition="200601120251201B">C08K3/08</further-classification>  
        <further-classification edition="200601120251201B">C08K5/14</further-classification>  
        <further-classification edition="200601120251201B">C08K5/37</further-classification>  
        <further-classification edition="200601120251201B">C08K5/54</further-classification>  
        <further-classification edition="200601120251201B">C08J5/00</further-classification>  
        <further-classification edition="200601120251201B">C08L33/04</further-classification>  
        <further-classification edition="200601120251201B">C09K5/14</further-classification>  
        <further-classification edition="200601120251201B">H01L23/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舘野貴一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATENO, KIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古川直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>津田義博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUDA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村優希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造方法，其係組成物的固化物之製造方法，前述方法包括在溫度T1下對包含固化性成分和導熱性填料之前述組成物進行加熱之步驟，其中，溫度T1與藉由以10℃/分鐘的升溫速度從25℃加熱至200℃之示差掃描熱量測定而獲得之組成物的DSC曲線的峰頂溫度Tp處於下述式（A）的關係。&lt;br/&gt;10℃≤T1-Tp≤40℃……（A）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體晶片</p>  
        <p type="p">2:散熱器</p>  
        <p type="p">3:組成物</p>  
        <p type="p">10:複合體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="895" publication-number="202612457"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612457.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612457</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114586</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構以及集成組合件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250508B">H10B12/00</main-classification>  
        <further-classification edition="202501120250508B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長鑫科技集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CXMT CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白　世杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAI, SHIJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛薄輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENG, BOHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>饒得鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAO, DEPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開實施例提供了一種半導體結構，包括：相對的第一表面和第二表面；第一連接墊和第二連接墊，設置於第一表面；第三連接墊、第四連接墊和第五連接墊，設置於第二表面；記憶單元區域，記憶單元區域設置在第一表面與第二表面之間，記憶單元區域包括沿第一方向排布的第一半導體器件和第二半導體器件，第一連接墊和第四連接墊連接第一半導體器件，第二連接墊和第五連接墊連接第二半導體器件，記憶單元區域還包括第一連接部，第一連接部與第一半導體器件和第二半導體器件中的至少一個連接，第一連接部連接第三連接墊。本公開實施例提供的半導體結構具有更高的集成度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:互連層</p>  
        <p type="p">1a:半導體結構</p>  
        <p type="p">2:佈線層</p>  
        <p type="p">3:記憶單元區域</p>  
        <p type="p">21:第一佈線層</p>  
        <p type="p">22:第二佈線層</p>  
        <p type="p">30:第一連接部</p>  
        <p type="p">31:第二連接部</p>  
        <p type="p">32:第三連接部</p>  
        <p type="p">33:第四連接部</p>  
        <p type="p">34、35、36、39:互連結構</p>  
        <p type="p">37、38:連接部</p>  
        <p type="p">110:第一連接墊</p>  
        <p type="p">120:第二連接墊</p>  
        <p type="p">130:第六連接墊</p>  
        <p type="p">140:第八連接墊</p>  
        <p type="p">210:第三連接墊</p>  
        <p type="p">220:第四連接墊</p>  
        <p type="p">230:第五連接墊</p>  
        <p type="p">240:第七連接墊</p>  
        <p type="p">250:第九連接墊</p>  
        <p type="p">310:第一半導體器件</p>  
        <p type="p">320:第二半導體器件</p>  
        <p type="p">3101、3201:汲極</p>  
        <p type="p">3102、3202:源極</p>  
        <p type="p">3103、3203:閘極</p>  
        <p type="p">3104、3105、3204、3205:電極部</p>  
        <p type="p">A:第一表面</p>  
        <p type="p">B:第二表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="896" publication-number="202612084"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612084.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612084</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114692</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>維護系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/677</main-classification>  
        <further-classification edition="200601120251201B">H01L21/3065</further-classification>  
        <further-classification edition="200601120251201B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>照内怜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERUUCHI, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喜多川大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>網倉紀彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMIKURA, NORIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長池宏史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAIKE, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相田航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIDA, KOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供能夠有效率地進行維護的技術，此維護係將使用於基板處理腔室之消耗元件更換。 &lt;br/&gt;[解決手段]一種維護系統，具備陳化站、元件保管站、及自走式元件搬運單元。 &lt;br/&gt;自走式元件搬運單元，構成為執行以下工序： &lt;br/&gt;停靠於陳化站，並將已在陳化站陳化之已陳化消耗元件取出的工序； &lt;br/&gt;停靠於元件保管站，並將自走式元件搬運單元內的已陳化消耗元件搬運至元件保管站的工序； &lt;br/&gt;停靠於元件保管站，並將元件保管站內的已陳化消耗元件取出的工序；及 &lt;br/&gt;停靠於基板處理腔室，並將基板處理腔室內的已使用之消耗元件更換為自走式元件搬運單元內的已陳化消耗元件的工序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">10:電漿處理腔室</p>  
        <p type="p">200:陳化站</p>  
        <p type="p">201:元件保管站</p>  
        <p type="p">202:清洗/維修站</p>  
        <p type="p">203:自走式元件搬運單元</p>  
        <p type="p">500:元件保管腔室</p>  
        <p type="p">AN:對準器</p>  
        <p type="p">C:容器</p>  
        <p type="p">CU:控制部</p>  
        <p type="p">EE1,EE3:末端執行器</p>  
        <p type="p">G1,G2,G3,G4:閘閥</p>  
        <p type="p">LL1,LL2:裝載鎖定模組</p>  
        <p type="p">LM:大氣搬運模組</p>  
        <p type="p">LP1,LP2,LP3,LP4:裝載埠</p>  
        <p type="p">MS:維護系統</p>  
        <p type="p">PM1,PM2,PM3,PM4,PM5,PM6:處理模組</p>  
        <p type="p">PS:基板處理系統</p>  
        <p type="p">TM:真空搬運模組</p>  
        <p type="p">TR1:真空搬運機械臂</p>  
        <p type="p">TR3:大氣搬運機械臂</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="897" publication-number="202611505"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611505.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611505</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114694</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢查系統以及檢查方法</chinese-title>  
        <english-title>INSPECTION SYSTEM AND INSPECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01N21/956</main-classification>  
        <further-classification edition="201401120251201B">G01N21/3563</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩見順一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIOMI, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷田祐太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIDA, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西原栄治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIHARA, EIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金田有美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANETA, YUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">檢查系統1的第一檢查裝置3係具有搬送機構、第一台、第一拍攝單元及第一檢查部301，且執行自動檢查，該自動檢查係包含：藉由搬送機構將對象物搬送至第一台上；藉由第一拍攝單元取得第一台上的對象物的第一拍攝圖像；以及藉由第一檢查部301對第一拍攝圖像執行缺陷檢查。第二檢查裝置4係具有第二台、第二拍攝單元及第二檢查部401，且不具有搬送機構。第二拍攝單元係具有與第一拍攝單元相同構成，且拍攝載置於第二台上的對象物並取得第二拍攝圖像。第二檢查部401係使用第二拍攝圖像製作檢查用資料51，該檢查用資料51係顯示對象物中的複數個檢查區域的位置資訊並顯示對各檢查區域的檢查臨限值。於第一檢查部301中，能夠執行使用了檢查用資料51的缺陷檢查。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A first inspection apparatus 3 of an inspection system 1 has a transport mechanism, a first stage, a first imaging unit, and a first inspection part 301, and performs automatic inspection including transport of an object onto the first stage by the transport mechanism, acquisition of a first captured image of the object on the first stage by the first imaging unit, and defect inspection for the first captured image by the first inspection part 301. A second inspection apparatus 4 has a second stage, a second imaging unit and a second inspection part 401, but does not have any transport mechanism. The second imaging unit has the same configuration as the first imaging unit, and acquires a second captured image by imaging an object placed on the second stage. The second inspection part 401 creates inspection data 51 indicating location information of a plurality of inspection areas on the object and an inspection threshold for each inspection area, by using the second captured image. The first inspection part 301 is capable of performing the defect inspection using the inspection data 51.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:檢查系統</p>  
        <p type="p">3:第一檢查裝置</p>  
        <p type="p">4:第二檢查裝置</p>  
        <p type="p">5:檢查用資料記憶部</p>  
        <p type="p">8:網路</p>  
        <p type="p">30:第一控制部</p>  
        <p type="p">31:第一檢查本體</p>  
        <p type="p">38,48:圖像處理電路</p>  
        <p type="p">40:第二控制部</p>  
        <p type="p">41:第二檢查本體</p>  
        <p type="p">51:檢查用資料</p>  
        <p type="p">301:第一檢查部</p>  
        <p type="p">401:第二檢查部</p>  
        <p type="p">402:拍攝狀態監視部</p>  
        <p type="p">C1:第一修正資料</p>  
        <p type="p">C2:第二修正資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="898" publication-number="202610950"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610950.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610950</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114899</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>UV照射裝置</chinese-title>  
        <english-title>UV IRRADIATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">C02F1/32</main-classification>  
        <further-classification edition="202301120251201B">C02F1/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商奧璐佳瑙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORGANO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧口佳介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIGUCHI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋一重</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KAZUSHIGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋悠介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種UV照射裝置，其係一邊補償因UV燈的點亮部位所導致之UV的照射效率的差異，一邊能以高精度適當地控制UV燈的UV照射量以使其滿足目標照射量。本發明係具備：複數個UV燈L，係將UV照射於流體(一次純水W)之UV照射裝置1，且配置於圓筒C內，以對於流體照射UV；點亮部位控制部13及電流值控制部14，係分別控制UV燈L的點亮部位P及電流值VC；修正係數設定部11，係按藉由UV燈L的點亮支數N與點亮部位P間的位置關係所定義之各個點亮模式A～E，設定用以修正UV的照射效率之修正係數KUV；點亮條件決定部12，以使用來自UV燈L的UV照射量AUVa及修正係數KUV所算出之UV的有效照射量AUVef滿足目標照射量AUVtg之方式，決定UV燈L的點亮部位P及電流值VC。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the invention is to provide a UV irradiation device that can precisely and appropriately control the UV irradiation amount of UV lamps such that a target irradiation amount is reached, while compensating for differences in UV irradiation efficiency between the illuminated regions of the UV lamps. The present invention is a UV irradiation device 1 that irradiates UV light into a fluid (primary pure water W) and comprises a plurality of UV lamps L which are disposed inside a cylinder C and irradiate UV light onto the fluid, an illuminated region control section 13 and a current value control section 14 which respectively control the illuminated regions P and the current values VC of the UV lamps L, a correction coefficient setting section 11 which sets a correction coefficient KUV to correct the UV irradiation efficiency for each illumination pattern A to E defined based on the number N of illuminated UV lamps L and the positional relationship between the illuminated regions P, and an illumination condition determination section 12 which determines the illuminated regions P and the current values VC of the UV lamps L such that the effective UV irradiation amount AUVef calculated using the UV irradiation amount AUVa from the UV lamps L and the correction coefficient KUV satisfies the target irradiation amount AUVtg.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:UV照射裝置</p>  
        <p type="p">2:超純水製造裝置</p>  
        <p type="p">2a:UV氧化裝置</p>  
        <p type="p">2b:UV氧化裝置</p>  
        <p type="p">2c:離子交換裝置</p>  
        <p type="p">2d:使用點</p>  
        <p type="p">KUV:修正係數</p>  
        <p type="p">AUVtg:目標照射量</p>  
        <p type="p">VC:電流值</p>  
        <p type="p">P:點亮部位</p>  
        <p type="p">11:修正係數設定部(照射效率參數設定部)</p>  
        <p type="p">12:點亮條件決定部</p>  
        <p type="p">13:點亮部位控制部</p>  
        <p type="p">14:電流值控制部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="899" publication-number="202611518"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611518.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611518</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114909</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電子裝置的探針頭的接觸探針及相關探針頭</chinese-title>  
        <english-title>CONTACT PROBE FOR PROBE HEADS OF ELECTRONIC DEVICES AND RELATED PROBE HEAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01R1/067</main-classification>  
        <further-classification edition="200601120251201B">G01R1/073</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商探針科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHNOPROBE S.P.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬吉歐尼　弗拉維歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAGGIONI, FLAVIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述了一接觸探針（20），具有一第一端部（2），結束於一接觸尖端（2A），配置成抵接在一待測裝置的一接觸墊上，及一第二端部（4），結束於一接觸頭（5），配置成抵接在一測試設備的一板體的一接觸墊上，以及一探針本體（1A），根據一縱向發展軸（HH）而延伸在該第一端部（2）與該第二端部（4）之間。&lt;br/&gt; 接觸探針（20）包括至少一電阻部（11），包括在第一端部（2）與第二端部（4）之間，該至少一電阻部（11）適合於在該第一端部（2）與該第二端部（4）之間傳遞一電流，反映一電阻值大於20Ω。&lt;br/&gt; 本文亦描述了一相關探針頭，包括該些探針之至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">It is herein described a contact probe (20) having a first end portion (2) that ends with a contact tip (2A) configured to abut onto a contact pad of a device under test and a second end portion (4) which ends with a contact head (5) configured to abut onto a contact pad of a board of a testing apparatus, as well as a probe body (1A) extended between said first end portion (2) and said second end portion (4) according to a longitudinal development axis (HH).&lt;br/&gt; The contact probe (20) comprises at least one resistive portion (11) comprised between the first end portion (2) and the second end portion (4), said at least one resistive portion (11) being adapted for passing a current between said first end portion (2) and said second end portion (4) opposing a resistance value greater than 20 Ω.&lt;br/&gt; A related probe head comprising at least one of said probes is also herein described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:電阻部</p>  
        <p type="p">20:接觸探針</p>  
        <p type="p">20A:探針本體</p>  
        <p type="p">H1:縱向發展尺寸</p>  
        <p type="p">HH:縱向發展軸</p>  
        <p type="p">L:總長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="900" publication-number="202611914"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611914.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611914</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114955</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於非揮發性記憶體解碼器的位址路徑佈線減少策略</chinese-title>  
        <english-title>ADDRESS PATH ROUTING REDUCTION STRATEGY FOR NONVOLATILE MEMORY DECODERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G11C11/02</main-classification>  
        <further-classification edition="200601120251103B">G11C13/02</further-classification>  
        <further-classification edition="202301120251103B">H10B61/00</further-classification>  
        <further-classification edition="200601120251103B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商晟碟科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANDISK TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊里薩里　尼可拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRIZARRY, NICOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特爾　傑迪普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, JAYDIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦什尼　尼迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VARSHNEY, NIDHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩蒂　克里斯多夫Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETTI, CHRISTOPHER J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為了程式化MRAM記憶體單元，電流必須從記憶體單元的對應位元線流向其對應字線，或從字線流向位元線。為了完成這點，位元線及字線解碼器必須能夠供應電流（當將線驅動為正時）及汲取電流（當將線拉為負時），以應對記憶體單元的雙極本質。因此，解碼器必須係雙極性的。對於負選擇開關，使用NMOS裝置，且對於正選擇開關，使用PMOS開關。為了減少佈局面積及佈線，負選擇開關及正選擇開關分開分組，其中正選擇開關的子集位於負選擇開關的子集之間，且反之亦然。解碼器開關的連接經路由至中央配接區域，以用於連接至交叉點陣列的控制線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To program MRAM memory cells current must flow from the memory cell’s corresponding bit line to its corresponding word line or from the word line to bit line. To accomplish this, the bit line and word line decoders must be capable of sourcing current (when driving a line positive) and sinking current (when pulling the line negative) to account the memory cell’s bipolar nature. Consequently, the decoders must be bipolar. For the negative select switches NMOS devices are used and for the positive select switches PMOS switches are used. To reduce layout area and routing, the negative select switches and positive select switches are separately grouped, with a subset of the positive select switches located between subsets of the negative select switches and vice-versa. The connection for the decoder switches are routed to a central hook-up region for connection to the control lines of the cross-point array.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體系統</p>  
        <p type="p">102:控制器</p>  
        <p type="p">104:非揮發性記憶體；記憶體封裝104</p>  
        <p type="p">106:局部記憶體</p>  
        <p type="p">110:前端處理器(FEP)電路</p>  
        <p type="p">112:後端處理器(BEP)電路</p>  
        <p type="p">120:主機</p>  
        <p type="p">122:主機處理器</p>  
        <p type="p">124:機記憶體</p>  
        <p type="p">126:PCIe介面</p>  
        <p type="p">128:匯流排</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="901" publication-number="202611194"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611194.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611194</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115020</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多孔質體、具備該多孔質體之研磨材料、以及具備該多孔質體之洗淨材料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08J9/26</main-classification>  
        <further-classification edition="202401120251201B">B08B1/10</further-classification>  
        <further-classification edition="200601120251201B">B24D3/32</further-classification>  
        <further-classification edition="200601120251201B">B24D11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商井上股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中佳典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤勇史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川原友紀子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWARA, YUKIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西澤祐一朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIZAWA, YUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種兼具耐藥品性以及耐磨耗性，而且溶媒的含浸性亦良好之新穎的多孔質體。解決手段為於本技術提供一種多孔質體，係含有氟樹脂作為樹脂成分，並從前述樹脂成分提取去除氣孔形成材而成，前述多孔質體之氣孔率為85%以下，阿斯克C型硬度為25以上。以往，具有高的耐藥品性之材料係有不易成形且多孔質體耐磨耗性低之傾向，惟本技術的特點在於兼具耐藥品性以及耐磨耗性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="902" publication-number="202611170"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611170.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611170</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115069</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種組成物或由其製成之熱固性樹脂或熱固性聚合物在印刷電路元件中作為增層膜材料之用途</chinese-title>  
        <english-title>USE OF A COMPOSITION OR THERMOSETTING RESIN OR THERMOSET POLYMER MADE THEREFROM AS BUILD-UP FILM MATERIAL IN A PRINTED CIRCUIT ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G73/06</main-classification>  
        <further-classification edition="200601120251201B">C08L79/04</further-classification>  
        <further-classification edition="200601120251201B">C08J5/24</further-classification>  
        <further-classification edition="200601120251201B">B32B15/08</further-classification>  
        <further-classification edition="200601120251201B">B32B27/28</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴斯夫歐洲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕瓦　馬杜拉　史瑞卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAWAR, MADHURA SHREEKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦迪耶納坦　蘇布拉馬尼安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAIDYANATHAN, SUBRAMANIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>什爾　關特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHERR, GUENTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞諾　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARNOLD, MARCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邁爾　迪耶特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAYER, DIETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧卡斯　弗雷德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUCAS, FREDERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述一種用於製造絕緣熱固性樹脂之組成物之用途，或其絕緣熱固性樹脂或絕緣熱固性聚合物之用途，其中該組成物包含可固化組分，該可固化組分包含或由碳二亞胺組分及氰酸酯組分組成，並且其中該用途為用作電絕緣體或在印刷電路元件中用作電絕緣材料及/或在印刷電路元件中用作增層膜材料。另外描述相應組成物、絕緣熱固性樹脂或絕緣熱固性聚合物，以及包含相應組成物、絕緣熱固性樹脂或絕緣熱固性聚合物之層複合物。亦描述一種印刷電路元件，其包含至少一個絕緣層，該絕緣層包含相應組成物、絕緣熱固性樹脂或絕緣熱固性聚合物，以及一種製造該印刷電路元件之方法。其另外描述一種預浸漬纖維製品，其包含如本文所述之相應絕緣熱固性樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein is the use of a composition for making an insulating thermosetting resin, or of an insulating thermosetting resin or an insulating thermoset polymer thereof, where said composition comprises a curable component, comprising or consisting of a carbodiimide component and a cyanate ester component, and wherein the use is as electrical insulation or as electrical insulation material in a printed circuit element and/or as a build-up film material in a printed circuit element. Moreover is described a respective composition, insulating thermosetting resin or insulating thermoset polymer, as well as a layer composite, comprising a respective composition, insulating thermosetting resin or insulating thermoset polymer. Also described is a printed circuit element, comprising at least one insulating layer, comprising a respective composition, insulating thermosetting resin or insulating thermoset polymer, and a method of making said printed circuit element. It is furthermore described a pre-impregnated fiber article, comprising a respective insulating thermosetting resin as described herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="903" publication-number="202611157"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611157.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611157</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115120</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反應性熱熔接著劑、結構體及電子機器</chinese-title>  
        <english-title>REACTIVE HOT MELT ADHESIVE, STRUCTURE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G18/42</main-classification>  
        <further-classification edition="200601120251201B">C08G18/48</further-classification>  
        <further-classification edition="200601120251201B">C08G18/76</further-classification>  
        <further-classification edition="200601120251201B">C09J175/04</further-classification>  
        <further-classification edition="201801120251201B">C09J7/35</further-classification>  
        <further-classification edition="200601120251201B">B32B7/12</further-classification>  
        <further-classification edition="200601120251201B">G09F9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竇君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOU, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小宮聰一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMIYA, SOUICHIROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅野秀治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGANO, SHUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種反應性熱熔接著劑，其包含胺酯預聚物，該胺酯預聚物為多元醇與多異氰酸酯的反應產物，前述多元醇包含結晶性聚酯多元醇及聚烷二醇，前述結晶性聚酯多元醇包含熔點為30℃～52℃的結晶性聚酯多元醇，前述聚烷二醇包含源自碳原子數4～10的烷二醇的結構單元，前述熔點為30℃～52℃的結晶性聚酯多元醇在前述多元醇中所佔的比例為30質量％～80質量％，且前述聚烷二醇在前述多元醇中所佔的比例為30質量％以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A reactive hot melt adhesive, comprising a urethane prepolymer that is a reaction product of a polyol and a polyisocyanate, &lt;br/&gt; the polyol comprising a crystalline polyester polyol and a polyalkylene glycol,&lt;br/&gt; the crystalline polyester polyol comprising a crystalline polyester polyol having a melting point of from 30°C to 52°C,&lt;br/&gt; the polyalkylene glycol including a structural unit derived from an alkylene glycol with a carbon atom number of from 4 to 10, and&lt;br/&gt; a content of the crystalline polyester polyol having a melting point of from 30°C to 52°C in the polyol being 30% by mass or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="904" publication-number="202611172"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611172.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611172</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115157</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>著色阻劑之圖型形成方法及使用其之組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G73/10</main-classification>  
        <further-classification edition="200601120251201B">G03F7/11</further-classification>  
        <further-classification edition="200601120251201B">G03F7/16</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/26</further-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification>  
        <further-classification edition="200601120251201B">G02F1/1335</further-classification>  
        <further-classification edition="200601120251201B">G09F9/30</further-classification>  
        <further-classification edition="202301120251201B">H10K59/122</further-classification>  
        <further-classification edition="202301120251201B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>升永有香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUNAGA, YUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畑中真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATANAKA, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松山元信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUYAMA, MOTONOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為了形成良好之著色阻劑圖型，而提供用以形成配置於基板與著色阻劑膜之間之阻劑下層膜的阻劑下層膜形成用組成物、藉由該阻劑下層膜形成用組成物所形成之阻劑下層膜，以及使用該阻劑下層膜之積層體、著色阻劑之圖型形成方法、自發光型顯示元件及液晶元件。 &lt;br/&gt;　　一種阻劑下層膜形成用組成物，其係用以形成配置於基板與著色阻劑膜之間之阻劑下層膜之阻劑下層膜形成用組成物， &lt;br/&gt;　　前述阻劑下層膜形成用組成物含有鹼可溶性樹脂與溶劑， &lt;br/&gt;　　燒成前述阻劑下層膜形成用組成物所形成之前述阻劑下層膜係對於用以形成前述著色阻劑膜之阻劑材料所含有之溶劑展現耐溶劑性，且對於前述著色阻劑膜之鹼顯影液展現溶解性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="905" publication-number="202611178"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611178.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611178</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115295</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合物及其硬化物、成形物、顯示裝置、以及固態攝像元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G75/06</main-classification>  
        <further-classification edition="200601120251201B">C08G75/08</further-classification>  
        <further-classification edition="200601120251201B">C08K5/151</further-classification>  
        <further-classification edition="200601120251201B">C08L81/02</further-classification>  
        <further-classification edition="201801120251201B">C09D7/63</further-classification>  
        <further-classification edition="200601120251201B">C09D181/02</further-classification>  
        <further-classification edition="200601120251201B">G02B1/04</further-classification>  
        <further-classification edition="200601120251201B">G02B5/20</further-classification>  
        <further-classification edition="200601120251201B">G09F9/30</further-classification>  
        <further-classification edition="202301120251201B">H04N23/12</further-classification>  
        <further-classification edition="202301120251201B">H04N25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淺津悠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASATSU, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出崎光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEZAKI, HIKARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠賦予顯示高折射率且耐黃變性優異之硬化物，進而即便於塗佈於酸性表面之情形時，硬化性亦屬優異之組合物。 &lt;br/&gt;本發明提供一種組合物，其含有具有至少一個硫雜環丙烷基或硫雜環丁烷基之化合物(A)、具有環狀酯結構之化合物(B)、及酸產生劑(C)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="906" publication-number="202611179"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611179.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611179</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115296</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合物及其硬化物、成形物、顯示裝置、以及固態攝像元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G75/06</main-classification>  
        <further-classification edition="200601120251201B">C08G75/08</further-classification>  
        <further-classification edition="200601120251201B">C08L81/02</further-classification>  
        <further-classification edition="200601120251201B">C08K5/5398</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G02B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淺津悠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASATSU, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出崎光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEZAKI, HIKARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠賦予顯示高折射率之硬化物，進而即便於塗佈於酸性表面之情形時，硬化性亦屬優異之組合物。 &lt;br/&gt;本發明提供一種組合物，其含有具有至少一個硫雜環丙烷基或硫雜環丁烷基之化合物(A)、及式(B)所表示之化合物(B)。 &lt;br/&gt;&lt;img align="absmiddle" height="89px" width="321px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(B)中， &lt;br/&gt;A&lt;sup&gt;+&lt;/sup&gt;表示一價陽離子； &lt;br/&gt;X&lt;sup&gt;1&lt;/sup&gt;及X&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示氧原子或硫原子； &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示氫原子或一價取代基]</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="907" publication-number="202611136"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611136.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611136</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115319</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、樹脂片、及多層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F220/20</main-classification>  
        <further-classification edition="200601120251201B">C08F222/40</further-classification>  
        <further-classification edition="200601120251201B">C08F226/06</further-classification>  
        <further-classification edition="200601120251201B">C08F290/06</further-classification>  
        <further-classification edition="200601120251201B">C08L53/02</further-classification>  
        <further-classification edition="200601120251201B">B32B27/30</further-classification>  
        <further-classification edition="200601120251201B">B32B27/34</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古賀将太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOGA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊田航平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUTA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小田原正浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODAWARA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供樹脂組成物、樹脂片、及多層體。本發明所請樹脂組成物含有熔點為30℃以下且5%重量減少溫度為150℃以上之熱硬化性化合物(A)、及能和熱硬化性化合物(A)進行聚合反應之熱硬化性化合物(B)(惟排除屬於熱硬化性化合物(A)者)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="908" publication-number="202611893"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611893.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611893</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115322</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背光驅動系統和方法以及驅動模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251201B">G09G3/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商矽力杰半導體技術（杭州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙品軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種背光驅動系統和方法以及驅動模組，該背光驅動系統包括主機和n個從機；該主機透過同一個輸出埠和每個從機耦接，或/和，該主機透過同一個輸出埠和該n個從機依次串聯耦接以形成通訊鏈路；其中，至少有一個從機包括m個驅動埠以驅動至少一個LED模塊，且至少有一個從機包括k個驅動埠以驅動至少一個LED模塊，m不等於k。本發明的背光驅動系統中至少包括兩種不同通道數的從機，透過對不同通道數的從機的混合使用，避免了使用單一通道數的從機所造成的部分從機的通道冗餘。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">MDO:輸出埠</p>  
        <p type="p">SDI:資料輸入埠</p>  
        <p type="p">SDO:資料輸出埠</p>  
        <p type="p">CH1~CHm,CH1~CHm&lt;sub&gt;1&lt;/sub&gt;,CH1~CHm&lt;sub&gt;2&lt;/sub&gt;,CH1~CHm&lt;sub&gt;p&lt;/sub&gt;:驅動埠</p>  
        <p type="p">IC(1)~IC(n&lt;sub&gt;1&lt;/sub&gt;),IC(n&lt;sub&gt;1&lt;/sub&gt;+1)~IC(n&lt;sub&gt;1&lt;/sub&gt;+n&lt;sub&gt;2&lt;/sub&gt;),IC(n&lt;sub&gt;1&lt;/sub&gt;+....+n&lt;sub&gt;i-1&lt;/sub&gt;+1)~IC(n&lt;sub&gt;1&lt;/sub&gt;+....+n&lt;sub&gt;i-1&lt;/sub&gt;+n&lt;sub&gt;i&lt;/sub&gt;),IC(n&lt;sub&gt;1&lt;/sub&gt;+...+n&lt;sub&gt;p-1&lt;/sub&gt;+1)~IC(n&lt;sub&gt;1&lt;/sub&gt;+...+n&lt;sub&gt;p-1&lt;/sub&gt;+n&lt;sub&gt;p&lt;/sub&gt;):從機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="909" publication-number="202611945"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611945.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611945</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115345</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新氫核融合設備、新氫核融合持續時間的控制方法、暖氣設備、空調設備、熱聲機、氫製造裝置、氦的製造方法及新氫核融合方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G21B3/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新氫核融合能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEW HYDROGEN FUSION ENERGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蜂須賀譲二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HACHISUKA, JOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋亮人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, AKITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露相關的新氫核融合設備，構成為得以：以第一條件引起使用發熱材料的輕氫的核融合反應；以與前述第一條件不同且低於大氣壓的減壓環境之第二條件，引起氦3從用於前述第一條件的發熱材料脫離；以及捕集脫離後的氦3。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:反應器</p>  
        <p type="p">11a,11b,11c,11d:溫度感測器</p>  
        <p type="p">21,22a,22b:加熱器</p>  
        <p type="p">30:氣體供應管</p>  
        <p type="p">40:油液管</p>  
        <p type="p">50:幫浦</p>  
        <p type="p">51:排氣管</p>  
        <p type="p">52:閥</p>  
        <p type="p">60:捕集容器</p>  
        <p type="p">70:精製器</p>  
        <p type="p">80:氣槽</p>  
        <p type="p">90:控制器</p>  
        <p type="p">100:熱反應裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="910" publication-number="202610809"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610809.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610809</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115389</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光硬化性組成物、成形體及成形體的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">B29C64/124</main-classification>  
        <further-classification edition="202001120251201B">B33Y70/00</further-classification>  
        <further-classification edition="200601120251201B">C08F18/02</further-classification>  
        <further-classification edition="200601120251201B">C08F118/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友橡膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO RUBBER INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒田賢一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬戸川広人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SETOKAWA, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原崇博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤尚子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, NAOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種成形體的機械特性優異的光硬化性組成物。本發明的光硬化性組成物的特徵在於，含有胺基甲酸酯(甲基)丙烯酸酯寡聚物、以及作為乙烯基單體的玻璃轉移溫度（Tg1）為10℃以上且40℃以下的第一單體及玻璃轉移溫度（Tg2）為70℃以上且150℃以下的第二單體，第一單體含有丙烯酸環狀烷基酯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="911" publication-number="202611968"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611968.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611968</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115429</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用電漿之基板處理系統及將正偏壓ＤＣ電壓施加至基板之方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING SYSTEM USING PLASMA AND METHOD TO APPLY POSITIVELY BIASED DC VOLTAGE TO SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金大淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DAEYOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔益溱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, IKJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明呈現一種將正偏壓DC電壓施加至一基板以減少基板處理期間之離子損壞的方法及一種使用該方法之基板處理系統。為減少離子轟擊造成的離子損壞，一基板處理系統可包含：一反應室，包含一基座及一基板處理空間，其中該基座包含一加熱器；以及一直流（DC）偏壓單元，包含經組態以產生一三角形脈衝DC電壓信號之一DC供應器及安置於該DC供應器與該基座之間的一開關，該開關經組態以開啟或閉合自該DC供應器至該基座之一管線，其中該三角形脈衝DC電壓信號具有一第一波峰及一第一頻率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method to apply positively biased DC voltage to a substrate to reduce ion damage during substrate processing and a substrate processing system using the method is presented. For reducing ion damage from the ion bombardment, a substrate processing system may comprise a reaction chamber comprising a susceptor and a substrate process space, wherein the susceptor comprises a heater; and a direct current (DC) bias unit comprising a DC supply configured to generate a triangular-pulsed DC voltage signal and a switch disposed between the DC supply and the susceptor, the switch being configured to open or close a line from the DC supply to the susceptor, wherein the triangular-pulsed DC voltage signal has a first crest and a first frequency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板處理系統</p>  
        <p type="p">101:反應室</p>  
        <p type="p">102:基板處理空間</p>  
        <p type="p">110:基座</p>  
        <p type="p">111:基板</p>  
        <p type="p">113:加熱器</p>  
        <p type="p">120:DC供應器</p>  
        <p type="p">121:量測單元</p>  
        <p type="p">122:控制器</p>  
        <p type="p">131:偏壓電壓/正偏壓</p>  
        <p type="p">132:電流</p>  
        <p type="p">140:信號</p>  
        <p type="p">141:開關</p>  
        <p type="p">150:直流偏壓單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="912" publication-number="202611133"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611133.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611133</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115490</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>媒液組成物、漿料組成物及電子零件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F220/18</main-classification>  
        <further-classification edition="200601120251201B">C08F220/14</further-classification>  
        <further-classification edition="200601120251201B">C08L33/10</further-classification>  
        <further-classification edition="200601120251201B">C08K3/08</further-classification>  
        <further-classification edition="200601120251201B">C08K3/40</further-classification>  
        <further-classification edition="200601120251201B">H01B1/22</further-classification>  
        <further-classification edition="200601120251201B">H01G4/008</further-classification>  
        <further-classification edition="200601120251201B">H01G4/12</further-classification>  
        <further-classification edition="200601120251201B">H01G4/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚丈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA, JO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山內健司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAUCHI, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種媒液（vehicle）組成物，其能夠於低溫分解，微細無機粒子之分散性尤其優異，能夠製作具有優異特性之電子零件。又，本發明提供一種包含該媒液組成物之漿料組成物、使用該漿料組成物而成之電子零件。 &lt;br/&gt;本發明係一種媒液組成物，其包含(甲基)丙烯酸樹脂、及有機溶劑，上述有機溶劑包含萜烯系有機溶劑及有機溶劑A，上述有機溶劑A於常壓下之沸點為130℃以下，上述有機溶劑A之含量於有機溶劑100重量%中為0.01重量%以上10重量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="913" publication-number="202610662"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610662.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610662</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115492</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＤＲＧ表現的ｍｉＲＮＡ 的表現控制</chinese-title>  
        <english-title>EXPRESSION CONTROL BY DRG-EXPRESSED MIRNAS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/7088</main-classification>  
        <further-classification edition="200601120251201B">C12N15/63</further-classification>  
        <further-classification edition="200601120251201B">C12N15/861</further-classification>  
        <further-classification edition="200601120251201B">A61K48/00</further-classification>  
        <further-classification edition="200601120251201B">A61P21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商凱特治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATE THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯謝德里　沙奧拉夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SESHADRI, SAURAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔必包德巴爾　瑪哈瑪德沙里夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TABEBORDBAR, MOHAMMADSHARIF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔必包德巴爾　沙雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TABEBORDBAR, SHAYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之各方面提供了表現轉基因和選自miR-338-3p、miR-138-5p和miR-9-5p的至少一種微小RNA（miR）的至少一個結合位點的重組核酸（例如載體，如病毒載體），該等重組核酸選擇性地抑制轉基因在背根神經節（DRG）中的表現。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects of the present invention provide recombinant nucleic acids (&lt;i&gt;e.g.&lt;/i&gt;, vectors such as viral vectors) that express a transgene and at least one binding site of at least one microRNA (miR) selected from miR-338-3p, miR-138-5p, and miR-9-5p, which selectively inhibit expression of the transgene in the dorsal root ganglia (DRG).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="914" publication-number="202611302"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611302.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611302</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115494</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自鋰離子電池鹼性浸出有用金屬之方法</chinese-title>  
        <english-title>METHOD OF ALKALINE LEACHING OF USEFUL METALS FROM LITHIUM-ION BATTERIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C22B26/12</main-classification>  
        <further-classification edition="200601120251201B">C22B3/14</further-classification>  
        <further-classification edition="200601120251201B">H01M10/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞比馬利股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBEMARLE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>季依</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅洛　喬納森Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MELO, JONATHAN L</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏多帕迪亞　齊納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHATTOPADHYAY, KINNOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法，其包括(A)使團塊與包含氨源之液體銨系統接觸，以形成組合，其中該團塊係自至少鋰離子電池形成且包含一或多種含金屬化合物，其中該金屬選自鋰、鈷、鎳、鐵及/或鋁；(B)自該組合分離鹼性浸出液；(C)將一或多種氧化劑輸注至該鹼性浸出液中；(D)調整該鹼性浸出液之pH以增強包含一或多種含金屬化合物之沉澱物的形成，其中該金屬選自鋰、鈷、鎳、鐵及/或鋁；及(E)將二氧化碳、碳酸鈉、碳酸氫鈉、碳酸鋰及碳酸氫鋰中之一或多者輸注至該鹼性浸出液中以增強包含一或多種含金屬化合物之額外沉澱物的形成，其中該金屬選自鈷、鎳、鐵及/或鋁。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process that includes (A) contacting a mass with a liquid ammonium system comprising an ammonia source, to form a combination, wherein the mass was formed from at least lithium-ion batteries and comprises one or more metal-containing compounds, wherein the metal is selected from lithium, cobalt, nickel, iron, and/or aluminum; (B) separating an alkaline leachate from the combination; (C) infusing one or more oxidizing agents into the alkaline leachate; (D) adjusting the pH of the alkaline leachate to enhance formation of a precipitate comprising one or more metal-containing compounds, wherein the metal is selected from lithium, cobalt, nickel, iron, and/or aluminum; and (E) infusing one or more of carbon dioxide, sodium carbonate, sodium bicarbonate, lithium carbonate, and lithium bicarbonate into the alkaline leachate to enhance formation of an additional precipitate comprising one or more metal-containing compounds, wherein the metal is selected from cobalt, nickel, iron, and/or aluminum.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="915" publication-number="202611569"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611569.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611569</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115524</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>體全像曲線波導及其製作方法與裝置</chinese-title>  
        <english-title>VOLUME HOLOGRAPHIC CURVED WAVEGUIDE AND MANUFACTURING METHOD AND DEVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">G02B5/32</main-classification>  
        <further-classification edition="200601120251204B">G02B27/01</further-classification>  
        <further-classification edition="200601120251204B">G02C7/02</further-classification>  
        <further-classification edition="200601120251204B">G02B6/138</further-classification>  
        <further-classification edition="200601120251204B">G02B6/13</further-classification>  
        <further-classification edition="200601120251204B">G03H1/10</further-classification>  
        <further-classification edition="202001120251204B">G02B30/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商尼卡光學(天津)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡德驕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林海斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜有成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種體全息曲面波導及其製作方法和裝置。方法包括曝光步驟，用於干涉曝光位於耦出區和/或轉折區的全息光敏材料層，曝光步驟包括：根據虛擬影像的像素分布，將參考光調整為對應第i像素的單像素參考光，將信號光調整為對應第i像素的單像素信號光；將單像素參考光耦入曲面波導層，使其在曲面波導層內部進行全反射傳播，並在全反射傳播過程中照射全息光敏材料層，與此同時，將單像素信號光徑直出射在全息光敏材料層上，單像素參考光與單像素信號光在全息光敏材料層上發生干涉，全息光敏材料層記錄第i像素對應的干涉條紋；令i=i+1，重複上述步驟，直至全息光敏材料層記錄下所有像素對應的干涉條紋，形成體全息光柵層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a volume holographic curved waveguide and manufacturing method and device thereof. The method comprises an exposure step used for interference exposure of a holographic photosensitive material layer in a coupling-out area and/or a transition area, and the exposure step comprises the following steps: according to pixel distribution of a virtual image, reference light is adjusted to be single-pixel reference light corresponding to an i&lt;sup&gt;th&lt;/sup&gt; pixel, and signal light is adjusted to be single-pixel signal light corresponding to the i&lt;sup&gt;th&lt;/sup&gt; pixel; the single-pixel reference light is coupled into the curved surface waveguide layer, so that the single-pixel reference light is subjected to total reflection propagation in the curved surface waveguide layer, the holographic photosensitive material layer is irradiated in the total reflection propagation process, and meanwhile, the single-pixel signal light is directly emitted to the holographic photosensitive material layer; the single-pixel reference light and the single-pixel signal light interfere on the holographic photosensitive material layer, and the holographic photosensitive material layer records interference fringes corresponding to the i&lt;sup&gt;th&lt;/sup&gt; pixel; and enabling i to be equal to i + 1, and repeating the aforementioned steps until the holographic photosensitive material layer records the interference fringes corresponding to all the pixels, thereby forming the volume holographic grating layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S301、S302、S311、S312、S313:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="916" publication-number="202611969"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611969.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611969</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115634</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電夾盤、其製造方法及基板固定裝置</chinese-title>  
        <english-title>ELECTROSTATIC CHUCK, MANUFACTURING METHOD THEREOF, AND SUBSTRATE FIXING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01J37/32</main-classification>  
        <further-classification edition="200601120251201B">H01L21/683</further-classification>  
        <further-classification edition="200601120251201B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新光電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINKO ELECTRIC INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白岩則雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAIWA, NORIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇留賀京太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URUGA, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林博幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種靜電夾盤，其包括：基體，其具有用來放置待吸附之目標物體於其上的放置表面；及嵌入該基體中的靜電電極，其中該基體之與該放置表面相對的表面係平坦表面，及該放置表面相對於該平坦表面係凸形或凹形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrostatic chuck includes a base body having a placement surface on which a target object to be adsorbed is to be placed; and an electrostatic electrode embedded in the base body, wherein a surface of the base body opposite to the placement surface is a flat surface, and the placement surface is convex or concave with respect to the flat surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板固定裝置</p>  
        <p type="p">10:基底板</p>  
        <p type="p">11:氣體供應部分</p>  
        <p type="p">20:黏著劑層</p>  
        <p type="p">30:靜電夾盤</p>  
        <p type="p">31:基體</p>  
        <p type="p">31a:放置表面</p>  
        <p type="p">31b:平坦表面</p>  
        <p type="p">32:靜電電極</p>  
        <p type="p">33:氣體排放部分</p>  
        <p type="p">111:氣體流動通道</p>  
        <p type="p">112:氣體注入部分</p>  
        <p type="p">311:圓形區域</p>  
        <p type="p">312:環形區域</p>  
        <p type="p">W1:半徑</p>  
        <p type="p">W2:寬度</p>  
        <p type="p">W3:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="917" publication-number="202611767"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611767.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611767</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115658</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訓練方法</chinese-title>  
        <english-title>TRAINING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250915B">G06F30/27</main-classification>  
        <further-classification edition="202301120250915B">G06N3/092</further-classification>  
        <further-classification edition="200601120250915B">H01L21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷　天杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAWAT, TEJENDER SINGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪嘉隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIA-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游瑋丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭逸楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">方法用於訓練強化學習（reinforcement learning, RL）模型以預測具有保護環的半導體裝置的崩潰電壓（breakdown voltage, BV）。方法包括確定半導體裝置的結構參數集合；準備由半導體裝置的多個製造參數形成的訓練數據集，其中多個製造參數包括在半導體裝置上植入保護環（guard ring, GR）的劑量濃度和至少一個劑量能量；以及使用訓練數據集訓練RL模型，通過最大化基於RL模型生成的預測BV值與對應多個製造參數的目標BV值之間計算的獎勵函數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method is used for training a reinforcement learning (RL) model to predict a breakdown voltage (BV) of a semiconductor device with a guard ring. The method comprises determining a set of structural parameters of the semiconductor device; preparing a training dataset formed by a plurality of manufacturing parameters of the semiconductor device, wherein the plurality of manufacturing parameters comprise a dose concentration and at least one dose energy of implanting a guard ring (GR) on the semiconductor device; and training the RL model using the training dataset by maximizing a reward function calculated based on a between a predicted BV value generated by the RL model and a target BV value corresponding to the plurality of manufacturing parameters.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S12:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="918" publication-number="202611223"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611223.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611223</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115688</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱塑性聚合物組成物、薄片或薄膜、積層體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08L33/12</main-classification>  
        <further-classification edition="200601120251201B">C08L53/02</further-classification>  
        <further-classification edition="200601120251201B">C08L91/00</further-classification>  
        <further-classification edition="200601120251201B">C08J5/18</further-classification>  
        <further-classification edition="200601120251201B">B32B27/00</further-classification>  
        <further-classification edition="201901120251201B">B29C48/08</further-classification>  
        <further-classification edition="201901120251201B">B29C48/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗塑料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY PLASTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>服部貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATTORI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤晃平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, KOUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大島啟志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSHIMA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種可形成透明性高且顯示低各向異性之薄片或薄膜，且兼具良好的薄片或薄膜成形加工性之熱塑性聚合物組成物。本發明揭示一種熱塑性聚合物組成物，其以滿足下式(a)、(b)及(c)之比例含有：含有將α-甲基苯乙烯單元作為主體之聚合物嵌段P、與將共軛二烯或異丁烯單元作為主體之氫化或非氫化的聚合物嵌段Q且重量平均分子量為30,000～200,000的嵌段共聚物(I)，包含甲基丙烯酸甲酯單元50質量%以上及可與其共聚合的乙烯基系單體單元50質量%以下且平均聚合度為400～2,000的丙烯酸系樹脂(II)，包含甲基丙烯酸甲酯單元50質量%以上及可與其共聚合的乙烯基系單體單元50質量%以下且平均聚合度為6,000～40,000的丙烯酸系樹脂(III)，及任意的軟化劑(IV)；&lt;br/&gt; 0.1≦W(II)/W(I)≦2.4　(a)、&lt;br/&gt; 0.001≦W(III)/(W(I)+W(II))≦0.04　(b)、&lt;br/&gt; 0≦W(IV)/(W(I)+W(II)+W(III)+W(IV))≦0.5　(c)&lt;br/&gt; [式中，W(I)、W(II)、W(III)及W(IV)分別表示前述熱塑性聚合物組成物中的嵌段共聚物(I)、丙烯酸系樹脂(II)、丙烯酸系樹脂(III)及軟化劑(IV)之含量(質量基準)]。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="919" publication-number="202611158"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611158.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611158</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115709</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括官能性聚醯胺之塗層組成物</chinese-title>  
        <english-title>COATING COMPOSITIONS INCLUDING FUNCTIONAL POLYAMIDES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G18/60</main-classification>  
        <further-classification edition="200601120251201B">C08G18/78</further-classification>  
        <further-classification edition="200601120251201B">C08G18/79</further-classification>  
        <further-classification edition="200601120251201B">C09D175/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商盧伯利索先進材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUBRIZOL ADVANCED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋瑞托瓦　米蓮娜瑪利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARAY-TOVAR, MILENA MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CO</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘迪　錢德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANDEY, CHANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>爾朵第　佳寶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERDODI, GABOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克雷恩　亞歷克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRIENEN, ALEC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德特根　薩曼莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DETGEN, SAMANTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伯遜　艾米莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERTSON, EMILY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供組成物，其包括：聚異氰酸酯，其具有平均每分子多於兩個異氰酸酯基團；官能性聚醯胺，其具有平均每分子多於兩個反應性基團，該等反應性基團與該聚異氰酸酯之異氰酸酯基團具有化學反應性；及溶劑；其中該聚異氰酸酯之該等異氰酸酯基團與該官能性聚醯胺之該等反應性基團的化學計量比係1:1至3:1。亦提供塗層組成物及利用該組成物之經塗佈基材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are compositions including: a polyisocyanate having an average of greater than two isocyanate groups per molecule; a functional polyamide having an average of greater than two reactive groups per molecule which are chemically reactive with an isocyanate group of the polyisocyanate; and a solvent; wherein the stoichiometric ratio of the isocyanate groups of the polyisocyanate to the reactive groups of the functional polyamide is from 1:1 to 3:1. Also provided are coating compositions and coated substrates utilizing the composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="920" publication-number="202611240"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611240.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611240</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115718</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>與彈性增強可施配凝膠相關之總成及方法</chinese-title>  
        <english-title>ASSEMBLIES AND METHODS ASSOCIATED WITH AN ELASTICALLY REINFORCED DISPENSABLE GEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C09D5/34</main-classification>  
        <further-classification edition="200601120251211B">C09K5/08</further-classification>  
        <further-classification edition="200601120251211B">H05K7/20</further-classification>  
        <further-classification edition="200601120251211B">H01L23/36</further-classification>  
        <further-classification edition="201801120251211B">C08K3/013</further-classification>  
        <further-classification edition="200601120251211B">C08K3/22</further-classification>  
        <further-classification edition="200601120251211B">B29C70/88</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商派克漢尼汾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARKER-HANNIFIN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古德里奇　崔佛　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOODRICH, TREVOR L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種實例性熱界面間隙填料包含：一聚合材料；與該聚合材料混合之複數個導熱粒子；及散置於該聚合材料內之複數個彈性粒子，其中該複數個彈性粒子比該複數個導熱粒子更軟及更大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example thermal-interface gap filler includes: a polymeric material; a plurality of thermally-conductive particles mixed with the polymeric material; and a plurality of elastic particles interspersed within the polymeric material, wherein the plurality of elastic particles are softer and larger than the plurality of thermally-conductive particles.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:總成</p>  
        <p type="p">102:熱源</p>  
        <p type="p">104:散熱器</p>  
        <p type="p">106:熱界面間隙填料</p>  
        <p type="p">108:彈性粒子</p>  
        <p type="p">110:導熱粒子</p>  
        <p type="p">112:聚合材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="921" publication-number="202610722"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610722.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610722</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115720</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為吸收材料之經鹼性瀝取的稻殼灰</chinese-title>  
        <english-title>CAUSTIC LEACHED RICE HUSK ASH AS ABSORBENT MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B01J20/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商贏創運營有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVONIK OPERATIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華　敦武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA, DUENWU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫特　納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTL, NATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於在鹼性二氧化矽製造期間在水熱法中以殘渣獲得之經鹼性瀝取的RHA吸收材料，及殘渣作為CO&lt;sub&gt;2&lt;/sub&gt;吸收材料的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to caustic leached RHA absorbent materials obtained as a residue during alkaline silica production in hydrothermal process, and use of residue as CO&lt;sub&gt;2&lt;/sub&gt;absorbent material.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="922" publication-number="202610976"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610976.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610976</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115766</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、具有源自該化合物之單元的聚合物、包含該聚合物的光敏性樹脂組成物、由該光敏性樹脂組成物而成的接合劑、使該光敏性樹脂組成物固化而獲得的固化物、具備該固化物的電子裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C33/42</main-classification>  
        <further-classification edition="200601120251201B">C07C33/44</further-classification>  
        <further-classification edition="200601120251201B">C08F32/08</further-classification>  
        <further-classification edition="200601120251201B">C08G61/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">C09J145/00</further-classification>  
        <further-classification edition="200601120251201B">C09J165/00</further-classification>  
        <further-classification edition="200601120251201B">G02B5/20</further-classification>  
        <further-classification edition="200601120251201B">G09F9/30</further-classification>  
        <further-classification edition="200601120251201B">H01L21/312</further-classification>  
        <further-classification edition="200601120251201B">H01L21/52</further-classification>  
        <further-classification edition="202301120251201B">H01L25/065</further-classification>  
        <further-classification edition="200601120251201B">H01L25/07</further-classification>  
        <further-classification edition="202301120251201B">H01L25/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中央硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木貴志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村鞠香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, MARIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兼子譲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, YUZURU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萩原敬人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGIWARA, KEITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之目的在於提供可提供熱穩定性與相容性均良好之聚合物的化合物、具有源自該化合物之單元的聚合物、包含該聚合物的光敏性樹脂組成物、由該光敏性樹脂組成物而成的接合劑、使該光敏性樹脂組成物固化而獲得的固化物、具備該固化物的電子裝置。本揭露係關於由下述通式（1）所示之化合物。&lt;br/&gt;&lt;img align="absmiddle" height="195px" width="257px" file="ed10052.JPG" alt="ed10052.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="923" publication-number="202611275"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611275.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611275</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115775</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電裂解供烯烴生產用之碳氫化合物進料的加熱器配置</chinese-title>  
        <english-title>HEATER ARRANGEMENT FOR ELECTRICALLY CRACKING HYDROCARBON FEEDS FOR OLEFIN PRODUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C10G7/00</main-classification>  
        <further-classification edition="200601120251201B">C10G9/18</further-classification>  
        <further-classification edition="200601120251201B">C10G9/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商魯瑪斯科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUMMUS TECHNOLOGY LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑達蘭　肯達沙米　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNDARAM, KANDASAMY M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於轉換一碳氫化合物混合物以生產烯烴之方法及系統。該方法及該系統包括在一或多個預熱器中，將一碳氫化合物進料預熱至一預熱溫度，從而生產一經預熱碳氫化合物流。該經預熱碳氫化合物流在一或多個分離系統中分離，從而生產一經汽化碳氫化合物流及一液態碳氫化合物流。該經汽化碳氫化合物流在一次級輸送線交換器中加熱，從而生產一經加熱碳氫化合物流，該經加熱碳氫化合物流在一對流電預熱器中進一步加熱，從而生產一第二經加熱碳氫化合物流。該第二經加熱碳氫化合物流接著使用一輻射電熱裂解加熱器裂解，從而生產一經裂解碳氫化合物產物流，該經裂解碳氫化合物產物流進料至一初級輸送線交換器，以使該經裂解碳氫化合物產物流驟冷且回收一經冷卻碳氫化合物產物流。該經冷卻碳氫化合物產物流接著進料至該次級輸送線交換器，從而生產一碳氫化合物產物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Processes and systems for converting a hydrocarbon mixture to produce olefins. The process and systems include preheating a hydrocarbon feed in one or multiple preheaters to a preheat temperature, producing a preheated hydrocarbon stream. The preheated hydrocarbon stream are separated in one or more separation systems, producing a vaporized hydrocarbon stream and a liquid hydrocarbon stream. The vaporized hydrocarbon stream is heated in a secondary transfer line exchanger, producing a heated hydrocarbon stream that is further heated in a convective electric preheater, producing a second heated hydrocarbon stream. The second heated hydrocarbon stream is then cracked, using a radiant electric thermal cracking heater, producing a cracked hydrocarbon product stream, which is fed to a primary transfer line exchanger for quenching the cracked hydrocarbon product stream and recovering a cooled hydrocarbon product stream. The cooled hydrocarbon product stream is then fed to the secondary transfer line exchanger, producing a hydrocarbon product.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一熱交換系統</p>  
        <p type="p">12:碳氫化合物原料</p>  
        <p type="p">14:第一經預熱碳氫化合物流</p>  
        <p type="p">18:熱源，熱交換介質</p>  
        <p type="p">20:第二熱交換系統</p>  
        <p type="p">22:經預熱碳氫化合物流，經預熱碳氫化合物原料</p>  
        <p type="p">26,36:稀釋蒸汽</p>  
        <p type="p">30:分離器</p>  
        <p type="p">32:經汽化碳氫化合物，蒸汽流</p>  
        <p type="p">34:未汽化碳氫化合物，液體</p>  
        <p type="p">40:電交叉交換器，對流電預熱器</p>  
        <p type="p">42:經加熱碳氫化合物流</p>  
        <p type="p">50:輻射電裂解加熱器</p>  
        <p type="p">52:裂解盤管</p>  
        <p type="p">54:經裂解流出物</p>  
        <p type="p">60:初級輸送線交換器</p>  
        <p type="p">64:經裂解流出物，經冷卻碳氫化合物產物流</p>  
        <p type="p">66:蒸汽流</p>  
        <p type="p">68:過熱蒸汽流</p>  
        <p type="p">70:次級輸送線交換器</p>  
        <p type="p">72:經冷卻碳氫化合物產物流</p>  
        <p type="p">76:經加熱碳氫化合物流，經加熱蒸氣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="924" publication-number="202610663"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610663.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610663</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115837</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多價抗原</chinese-title>  
        <english-title>MULTIVALENT ANTIGENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/7088</main-classification>  
        <further-classification edition="200601120251201B">C12N15/50</further-classification>  
        <further-classification edition="200601120251201B">C12N15/44</further-classification>  
        <further-classification edition="200601120251201B">A61K39/215</further-classification>  
        <further-classification edition="200601120251201B">A61K39/145</further-classification>  
        <further-classification edition="200601120251201B">A61P31/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商嘉晨西海生物療法公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMMORNA BIOTHERAPEUTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布諾　馬辛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUGNO, MARCIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑希爾　瓦多羅斯基　艾蓮娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THORNHILL-WADOLOWSKI, ELENA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於具有針對多種病毒株及/或抗原之多價能力的RNA分子及其製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to RNA molecules with multivalent capability against multiple viral strains and/or antigens and methods of making the same.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="925" publication-number="202612019"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612019.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612019</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115909</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/3065</main-classification>  
        <further-classification edition="200601120251201B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水口知紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUGUCHI, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之蝕刻方法包括：(a)準備具有含矽膜、及含矽膜上之含金屬遮罩之基板之步驟，含矽膜包含含有矽及氧之第1膜、及含有矽及氮之第2膜，含金屬遮罩具有至少一個開口；(b1)將基板暴露於由包含碳及氟之第1處理氣體產生之第1電漿之步驟；(b2)將基板暴露於由包含不含鹵素之含氮氣體之第2處理氣體產生之第2電漿之步驟；(c1)將基板暴露於由包含碳、氫、及氟之第3處理氣體產生之第3電漿之步驟；及(c2)將基板暴露於由包含不含鹵素之含氮氣體之第4處理氣體產生之第4電漿之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">F1:第1膜</p>  
        <p type="p">F2:第2膜</p>  
        <p type="p">F3:第3膜</p>  
        <p type="p">F4:第4膜</p>  
        <p type="p">F5:第5膜</p>  
        <p type="p">MK1:含金屬遮罩</p>  
        <p type="p">OP1:開口</p>  
        <p type="p">PF1:保護膜</p>  
        <p type="p">PL2:第2電漿</p>  
        <p type="p">SF1:含矽膜</p>  
        <p type="p">UF1:基底膜</p>  
        <p type="p">W1:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="926" publication-number="202611206"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611206.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611206</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115933</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>球狀無機組成物、樹脂組成物、漿料組成物、半導體封裝用密封材用填料，及球狀無機組成物之空隙的分析方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08K3/22</main-classification>  
        <further-classification edition="200601120251201B">C08K3/24</further-classification>  
        <further-classification edition="200601120251201B">C08K3/36</further-classification>  
        <further-classification edition="200601120251201B">C08K7/24</further-classification>  
        <further-classification edition="200601120251201B">C08L101/00</further-classification>  
        <further-classification edition="202401120251201B">G01N15/02</further-classification>  
        <further-classification edition="200601120251201B">H01L23/29</further-classification>  
        <further-classification edition="200601120251201B">H01L23/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商亞都瑪科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADMATECHS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺友祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種球狀無機組成物，其包含氧化矽單體除外之球狀無機組成物。前述球狀無機組成物之藉由雷射繞射粒度分佈測定之平均粒徑為0.1~15μm，含有直徑5μm以上之空隙的前述球狀無機組成物之粒子為50個/mm&lt;sup&gt;3&lt;/sup&gt;以下，含有直徑10μm以上之空隙的前述球狀無機組成物之粒子為5個/mm&lt;sup&gt;3&lt;/sup&gt;以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="927" publication-number="202610652"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610652.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610652</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115937</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>大環化合物的固體形式及其用途</chinese-title>  
        <english-title>SOLID FORMS OF MACROCYCLIC COMPOUNDS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/553</main-classification>  
        <further-classification edition="200601120251201B">A61K31/519</further-classification>  
        <further-classification edition="200601120251201B">A61K31/416</further-classification>  
        <further-classification edition="200601120251201B">A61K31/403</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification>  
        <further-classification edition="200601120251201B">C07D491/08</further-classification>  
        <further-classification edition="200601120251201B">C07D491/044</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安進公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMGEN INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝哈特　傑時爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHATT, JAYSHIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅培茲　米加斯　維爾瑪里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOPEZ-MEJIAS, VILMALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿賈瓦　佩若瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGARWAL, PRASHANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維桑太　拉斯洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VISONTAI, LASZLO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後補　後補</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YICONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紐曼　傑克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEWMAN, JAKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈爾丁　泰勒　卡西安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARDIN, TAYLOR CASSIANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　亞當　尼可拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, ADAM NICHOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾哈時姆　瑞恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALHASHIM, RAYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法拉傑　薩維亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARAJ, XAVIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了如本文所述之化合物A的固體形式。本揭露還提供了包含所揭露的固體形式的藥物組成物以及使用所揭露的固體形式和藥物組成物（例如，用於治療癌症）之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides solid forms of Compound A, as described herein. The disclosure also provides pharmaceutical compositions comprising the disclosed solid forms and methods of using the disclosed solid forms and pharmaceutical compositions (e.g., to treat cancer).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="928" publication-number="202610642"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610642.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610642</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116022</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>PDE3A/SLFN12干擾物、製備及其用途</chinese-title>  
        <english-title>PDE3A/SLFN12 DISRUPTORS, PREPARATIONS, AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/535</main-classification>  
        <further-classification edition="200601120251201B">A61K31/519</further-classification>  
        <further-classification edition="200601120251201B">A61K31/506</further-classification>  
        <further-classification edition="200601120251201B">A61K31/502</further-classification>  
        <further-classification edition="200601120251201B">A61K31/498</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4965</further-classification>  
        <further-classification edition="200601120251201B">A61K31/438</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4375</further-classification>  
        <further-classification edition="200601120251201B">A61K31/437</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification>  
        <further-classification edition="200601120251201B">A61P25/00</further-classification>  
        <further-classification edition="200601120251201B">A61P37/00</further-classification>  
        <further-classification edition="200601120251201B">A61P3/00</further-classification>  
        <further-classification edition="200601120251201B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商維泰瑞隆(香港)生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIRONAX (HONG KONG) CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉穎濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YINGTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王曉卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAOQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐星宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, XINGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯偉杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, WEIJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENG, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫衛東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, WEIDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣　益民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉連柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LIANZHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　彥平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YANPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　志遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHIYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容提供式1的化合物、包含該化合物的組成物、使用該化合物的方法，包括醫治各種發炎疾病及病況（例如，包括與發炎及/或缺陷性細胞凋亡相關聯的那些發炎疾病及病況）的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides compounds of Formula 1, compositions comprising the same, and methods of using the same, including use in treating various inflammatory diseases and conditions, e.g., including those associated with inflammation and/or defective apoptosis.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="929" publication-number="202612051"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612051.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612051</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加熱器軌道設備及整合此種加熱器軌道設備的半導體封裝裝配線</chinese-title>  
        <english-title>A HEATER TRACK APPARATUS AND A SEMICONDUCTOR PACKAGE ASSEMBLY LINE INCORPORATING SUCH HEATER TRACK APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/67</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商安世私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEXPERIA B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邁諾　賽斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIANO, SETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　馬可萊斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UY, MARC LESTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加布亞納達　瑞爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GABUANADA, REIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">加熱器軌道設備及包含此種加熱器軌道設備的半導體封裝裝配線。加熱器軌道設備適於接收具備防變色層的捲對捲引線框架帶。加熱器軌道設備包含：殼體，該殼體具有殼體入口及殼體出口，該殼體入口及殼體出口界定用於捲對捲引線框架帶的處理路徑線；以及加熱單元，該加熱單元定位在殼體內、位於處理路徑線旁邊，該加熱單元經結構化以產生熱量並且朝向處理路徑線散發熱量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heater track apparatus and a semiconductor package assembly line comprising such heater track apparatus. The heater track apparatus is adapted to receive a reel-to-reel lead frame tape provided with an anti-tarnish layer. The heater track apparatus comprises a housing having a housing inlet and a housing outlet defining a process path line for the reel-to-reel lead frame tape, and a heating unit positioned within the housing next to the process path line structured to generate and emit heat towards the process path line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:捲對捲引線框架帶</p>  
        <p type="p">2:防變色層</p>  
        <p type="p">1000:加熱器軌道設備</p>  
        <p type="p">1100:殼體</p>  
        <p type="p">1101:殼體入口</p>  
        <p type="p">1102:殼體出口</p>  
        <p type="p">1200:加熱單元</p>  
        <p type="p">1201:加熱單元入口</p>  
        <p type="p">1202:加熱單元出口</p>  
        <p type="p">1205:加熱元件</p>  
        <p type="p">1206:細長的加熱器軌道主體</p>  
        <p type="p">1207:加熱器蓋元件</p>  
        <p type="p">1300:過濾單元</p>  
        <p type="p">1301:過濾單元開口</p>  
        <p type="p">1400:氣流產生單元</p>  
        <p type="p">1402:氣流產生單元出口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="930" publication-number="202612052"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612052.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612052</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116051</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>  
        <english-title>SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/67</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田恵理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, ERI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤雅伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, MASANOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於使殘留於藥液處理後之基板上之雜質減少。 &lt;br/&gt;於該發明中，向於基板之一個主面形成有清洗液膜之基板供給藥液。藉此，於基板之一個主面上，於由清洗液構成之粘性底層上形成藥液朝向基板外流動之主流區域，且藥液所包含之藥液成分自主流區域迅速擴散至粘性底層而到達基板之一個主面，執行藥液處理。另一方面，雜質自主流區域緩慢擴散至粘性底層。因此，於本發明中，於雜質自主流區域向粘性底層擴散而到達一個主面之前，向接受藥液處理之一個主面供給清洗液，存在於主流區域之藥液及雜質被推流至基板外。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">L1:清洗液膜</p>  
        <p type="p">L1a,L2:粘性底層</p>  
        <p type="p">L1b:主流區域</p>  
        <p type="p">L3:主流領域</p>  
        <p type="p">n:藥液處理計數值</p>  
        <p type="p">PT:微粒(雜質)</p>  
        <p type="p">S:基板</p>  
        <p type="p">Sa:上表面(基板之一個主面)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="931" publication-number="202611561"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611561.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611561</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116100</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>各向異性光擴散膜與使用其之顯示器用膜、以及顯示器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G02B5/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商巴川集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMOEGAWA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山仁英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, MASAHIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂野翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKANO, TSUBASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒島純彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARASHIMA, JUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之各向異性光擴散膜係具有由下述組成物之光聚合所形成之各向異性光擴散層(30)的各向異性光擴散膜(3)，該組成物包含光聚合性化合物、光聚合引發劑、及(甲基)丙烯酸聚合物或共聚物或者胺基甲酸酯聚合物或共聚物，且各向異性光擴散層(30)具有基質區域(31)與柱狀區域(32)，該柱狀區域(32)由折射率與基質區域(31)不同之複數個柱狀構造體(33)所構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:各向異性光擴散膜</p>  
        <p type="p">30:各向異性光擴散層</p>  
        <p type="p">31:基質區域</p>  
        <p type="p">32:柱狀區域</p>  
        <p type="p">33:柱狀構造體</p>  
        <p type="p">T:厚度</p>  
        <p type="p">H:平均高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="932" publication-number="202611613"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611613.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611613</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116116</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含超微電池之可變光透射裝置</chinese-title>  
        <english-title>A VARIABLE LIGHT TRANSMISSION DEVICE COMPRISING MICROCELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251201B">G02F1/167</main-classification>  
        <further-classification edition="201901120251201B">G02F1/16757</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商電子墨水股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E INK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNN, BRYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈瑞斯　喬治Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARRIS, GEORGE G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種可變光透射裝置，其緩和負面的孔繞射且展現在開放與閉合光學狀態之間良好的切換速度。該裝置包含設置於二光透射電極層之間的一超微電池層，該超微電池層具有複數個超微電池，每一超微電池包括一電泳介質，且每一超微電池包含一通道、一突出結構，該突出結構具有一個以上凹陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A variable light transmission device is disclosed that mitigates negative aperture diffraction effects and shows good switching speed between the open and the closed optical states. The device comprises a microcell layer disposed between two light transmissive electrode layers, the microcell layer having a plurality of microcells, each microcell including an electrophoretic medium, and each microcell comprising a channel, a protrusion structure, the protrusion structure having one or more concavities.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:可變光透射裝置</p>  
        <p type="p">201:第一光透射基板</p>  
        <p type="p">202:第一光透射電極層</p>  
        <p type="p">203:超微電池層</p>  
        <p type="p">204:複數個超微電池</p>  
        <p type="p">206:密封層</p>  
        <p type="p">207:第二光透射電極層，第二光透射層</p>  
        <p type="p">208:第二光透射基板</p>  
        <p type="p">209:電泳介質</p>  
        <p type="p">210:超微電池底層</p>  
        <p type="p">211:超微電池底部內側表面</p>  
        <p type="p">211a:曝露超微電池底部內側表面</p>  
        <p type="p">212:超微電池壁</p>  
        <p type="p">215:通道</p>  
        <p type="p">217:突出結構</p>  
        <p type="p">218:突出底座</p>  
        <p type="p">222:凹陷</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="933" publication-number="202611998"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611998.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611998</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116190</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體晶片的製造方法、晶圓積層體、及半導體晶片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/301</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東海理化電機製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島健悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMA, KENGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於利用寬度窄的劃片道來更容易地分割晶圓。一種半導體晶片的製造方法，包括下述步驟：準備晶圓，所述晶圓在第一面呈矩陣狀地排列有多個半導體晶片，並且在所述多個半導體晶片之間的劃片道設有至少一個以上的測試電路；以及自與所述第一面為相反側的第二面對與所述劃片道對應的區域進行蝕刻，直至貫穿所述晶圓為止，構成所述測試電路的層結構的一部分的絕緣膜與構成所述多個半導體晶片的層結構的一部分的絕緣膜不連續。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶圓</p>  
        <p type="p">110:半導體晶片</p>  
        <p type="p">111:絕緣膜</p>  
        <p type="p">112:金屬膜</p>  
        <p type="p">120:劃片道</p>  
        <p type="p">121:絕緣膜</p>  
        <p type="p">122:金屬膜</p>  
        <p type="p">200:支持板</p>  
        <p type="p">300:遮罩層</p>  
        <p type="p">H2:開口</p>  
        <p type="p">S1:第一面</p>  
        <p type="p">S2:第二面</p>  
        <p type="p">TE:測試電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="934" publication-number="202611054"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611054.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611054</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116295</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>傳熱流體、用於在物體與傳熱流體之間進行熱交換之方法、組成物之用途及組成物</chinese-title>  
        <english-title>METHOD FOR EXCHANGING HEAT WITH AN OBJECT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07F7/04</main-classification>  
        <further-classification edition="200601120251201B">C07F7/08</further-classification>  
        <further-classification edition="200601120251201B">C07F7/12</further-classification>  
        <further-classification edition="200601120251201B">C07F7/18</further-classification>  
        <further-classification edition="200601120251201B">C07F7/21</further-classification>  
        <further-classification edition="200601120251201B">C09K5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蓋列斯特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GELEST, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　奎余</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KWEI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普許卡雷夫　維拉迪米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUSHKAREV, VLADIMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大村直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOMURA, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐姿漣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種傳熱流體，其於廣泛溫度範圍內熱穩定、根據用途而適宜且具有降低全球暖化潛勢程度之短大氣壽命。本發明之傳熱流體包含下式(A)所示化合物，前述式(A)中之Si元素數為1，傳熱流體中前述式(A)所示化合物之合計質量為5質量%以上。 &lt;br/&gt;&lt;br/&gt; &lt;img align="absmiddle" height="145px" width="450px" file="ed10133.JPG" alt="ed10133.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式(A)中，Y&lt;sup&gt;5&lt;/sup&gt;、Y&lt;sup&gt;6&lt;/sup&gt;、Y&lt;sup&gt;7&lt;/sup&gt;及Y&lt;sup&gt;8&lt;/sup&gt;分別獨立地表示包含1至20個碳原子之取代基）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="935" publication-number="202610960"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610960.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610960</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116316</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經燒結金屬碳化物珠粒粉末之用途</chinese-title>  
        <english-title>USE OF A SINTERED METAL CARBIDE BEAD POWDER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C04B35/56</main-classification>  
        <further-classification edition="200601120251201B">C04B35/567</further-classification>  
        <further-classification edition="200601120251201B">C04B35/626</further-classification>  
        <further-classification edition="200601120251201B">C04B35/64</further-classification>  
        <further-classification edition="201701120251201B">C01B32/90</further-classification>  
        <further-classification edition="201701120251201B">C01B32/949</further-classification>  
        <further-classification edition="200601120251201B">B02C17/20</further-classification>  
        <further-classification edition="200601120251201B">C22C29/08</further-classification>  
        <further-classification edition="202301120251201B">C22C1/051</further-classification>  
        <further-classification edition="202301120251201B">C22C1/053</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商聖高拜歐洲實驗及研究中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAINT-GOBAIN CENTRE DE RECHERCHES ET D'ETUDES EUROPEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布特斯　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOUTTES, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗拉芒　昆汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLAMANT, QUENTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種經燒結珠粒粉末在研磨、濕式介質分散或表面處理應用中之用途，該粉末具有： &lt;br/&gt;-一種化學組成，使得，以基於該珠粒粉末之質量計之質量百分比表示： &lt;br/&gt;- (77 - C4)% ≤ W + Mo ≤ (97.5 - C3)%，其中Mo ≤ 10%； &lt;br/&gt;- C1% ≤ C ≤ C2%； &lt;br/&gt;- 2.5% ＜ 添加劑 ≤ 20.0%，該添加劑表示Ti + Ta + Nb + V + Zr + Hf； &lt;br/&gt;-除W、Mo、C、Ti、Ta、Nb、V、Zr或Hf以外之元素、或「其他元素」：≤ 3%； &lt;br/&gt;其中： &lt;br/&gt;- C1 = 100*(C3 / C5)， &lt;br/&gt;- C2 = 100*(C4 / C6)， &lt;br/&gt;- C3 = k*C7，其中k選自0.5、0.6、0.7、0.8及0.9， &lt;br/&gt;- C4 = k’*C7，其中k’選自1.2及1.1， &lt;br/&gt;- C5 = [m(W) + m(Mo) + m(Ti) + m(Ta) + m(Nb) + m(V) + m(Zr) + m(Hf) + C3]， &lt;br/&gt;- C6 = [m(W) + m(Mo) + m(Ti) + m(Ta) + m(Nb) + m(V) + m(Zr) + m(Hf) + C4]， &lt;br/&gt;- C7 = M(C)*[(m(W) / M(W)) + (m(Mo) / M(Mo)) + (m(Ti) / M(Ti)) + (m(Ta) / M(Ta)) + (m(Nb) / M(Nb)) + (m(V) / M(V)) + (m(Zr) / M(Zr)) + (m(Hf) / M(Hf))]， &lt;br/&gt;m(W)、m(Mo)、m(Ti)、m(Ta)、m(Nb)、m(V)、m(Zr)及m(Hf)分別係元素W、Mo、Ti、Ta、Nb、V、Zr及Hf之質量(以公克計)，且 &lt;br/&gt;M(W)、M(Mo)、M(Ti)、M(Ta)、M(Nb)、M(V)、M(Zr)、M(Hf)及M(C)分別係元素W、Mo、Ti、Ta、Nb、V、Zr、Hf及C之莫耳質量(以g/mol計)； &lt;br/&gt;-一種結晶學組成，使得以基於結晶相之質量計之質量百分比表示，存在於該珠粒粉末中之該等結晶相的多於60%係呈金屬碳化物形式，該等結晶相包括至少一種選自Ti、Ta、Nb、V、Zr及Hf之元素之至少一種碳化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Use, in a grinding, wet-medium dispersion or surface treatment application, of a powder of sintered beads, said powder having: &lt;br/&gt;- a chemical composition such that, as percentages by mass based on the mass of the bead powder: &lt;br/&gt;- (77 - C4)% ≤ W + Mo ≤ (97.5 - C3)%, with Mo ≤ 10%; &lt;br/&gt; - C1% ≤ C ≤ C2%; &lt;br/&gt;- 2.5% ＜ additive ≤ 20.0%, the additive denoting Ti + Ta + Nb + V + Zr + Hf; &lt;br/&gt;- elements other than W, Mo, C, Ti, Ta, Nb, V, Zr or Hf, or "other elements": ≤ 3%; &lt;br/&gt;with: &lt;br/&gt;- C1 = 100*(C3 / C5), &lt;br/&gt;- C2 = 100*(C4 / C6), &lt;br/&gt;- C3 = k*C7, with k chosen from 0.5, 0.6, 0.7, 0.8 and 0.9, &lt;br/&gt; - C4 = k’*C7, with k’ chosen from 1.2 and 1.1, &lt;br/&gt;- C5 = [m(W) + m(Mo) + m(Ti) + m(Ta) + m(Nb) + m(V) + m(Zr) + m(Hf) + C3], &lt;br/&gt;- C6 = [m(W) + m(Mo) + m(Ti) + m(Ta) + m(Nb) + m(V) + m(Zr) + m(Hf) + C4], &lt;br/&gt;- C7 = M(C)*[(m(W) / M(W)) + (m(Mo) / M(Mo)) + (m(Ti) / M(Ti)) + (m(Ta) / M(Ta)) + (m(Nb) / M(Nb)) + (m(V) / M(V)) + (m(Zr) / M(Zr)) + (m(Hf) / M(Hf))], &lt;br/&gt;m(W), m(Mo), m(Ti), m(Ta), m(Nb), m(V), m(Zr) and m(Hf) being the mass, in grams, of the elements W, Mo, Ti, Ta, Nb, V, Zr and Hf, respectively, and &lt;br/&gt;M(W), M(Mo), M(Ti), M(Ta), M(Nb), M(V), M(Zr), M(Hf) and M(C) being the molar mass, in g/mol, of the elements W, Mo, Ti, Ta, Nb, V, Zr, Hf and C, respectively; &lt;br/&gt;- a crystallographic composition such that more than 60% of the crystalline phases present in said bead powder are in a metal carbide(s) form, as percentage by mass based on the mass of the crystalline phases, said crystalline phases including at least one carbide of at least one element from among Ti, Ta, Nb, V, Zr and Hf.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="936" publication-number="202610961"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610961.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610961</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116356</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經燒結金屬碳化物珠粒粉末</chinese-title>  
        <english-title>SINTERED METAL CARBIDE BEAD POWDER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C04B35/56</main-classification>  
        <further-classification edition="200601120251201B">C04B35/567</further-classification>  
        <further-classification edition="200601120251201B">C04B35/626</further-classification>  
        <further-classification edition="200601120251201B">C04B35/64</further-classification>  
        <further-classification edition="201701120251201B">C01B32/90</further-classification>  
        <further-classification edition="201701120251201B">C01B32/949</further-classification>  
        <further-classification edition="200601120251201B">B02C17/20</further-classification>  
        <further-classification edition="200601120251201B">C22C29/08</further-classification>  
        <further-classification edition="202301120251201B">C22C1/051</further-classification>  
        <further-classification edition="202301120251201B">C22C1/053</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商聖高拜歐洲實驗及研究中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAINT-GOBAIN CENTRE DE RECHERCHES ET D'ETUDES EUROPEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布特斯　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOUTTES, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗拉芒　昆汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLAMANT, QUENTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種經燒結珠粒粉末，其具有： &lt;br/&gt;-一種化學組成，使得，以基於該珠粒粉末之質量計之質量百分比表示： &lt;br/&gt;- (77 - C4)% ≤ W + Mo ≤ (95.5 - C3)%，其中Mo ≤ 10%； &lt;br/&gt;- C1% ≤ C ≤ C2%； &lt;br/&gt;- Ti、Ta、Nb、V、Zr及Hf，使得： &lt;br/&gt;Ti + Nb + V + Zr ≥ 4.5%及/或Ta + Hf ≥ 5%，且 &lt;br/&gt;添加劑 ≤ 20.0%，該添加劑表示Ti + Ta + Nb + V + Zr + Hf； &lt;br/&gt;-除W、Mo、C、Ti、Ta、Nb、V、Zr或Hf以外之元素、或「其他元素」：≤ 3%； &lt;br/&gt;其中： &lt;br/&gt;- C1 = 100*(C3 / C5)， &lt;br/&gt;- C2 = 100*(C4 / C6)， &lt;br/&gt;- C3 = k*C7，其中k選自0.5、0.6、0.7、0.8及0.9， &lt;br/&gt;- C4 = k’*C7，其中k’選自1.2及1.1， &lt;br/&gt;- C5 = [m(W) + m(Mo) + m(Ti) + m(Ta) + m(Nb) + m(V) + m(Zr) + m(Hf) + C3]， &lt;br/&gt;- C6 = [m(W) + m(Mo) + m(Ti) + m(Ta) + m(Nb) + m(V) + m(Zr) + m(Hf) + C4]， &lt;br/&gt;- C7 = M(C)*[(m(W) / M(W)) + (m(Mo) / M(Mo)) + (m(Ti) / M(Ti)) + (m(Ta) / M(Ta)) + (m(Nb) / M(Nb)) + (m(V) / M(V)) + (m(Zr) / M(Zr)) + (m(Hf) / M(Hf))]， &lt;br/&gt;m(W)、m(Mo)、m(Ti)、m(Ta)、m(Nb)、m(V)、m(Zr)及m(Hf)分別係元素W、Mo、Ti、Ta、Nb、V、Zr及Hf之質量(以公克計)，且 &lt;br/&gt;M(W)、M(Mo)、M(Ti)、M(Ta)、M(Nb)、M(V)、M(Zr)、M(Hf)及M(C)分別係元素W、Mo、Ti、Ta、Nb、V、Zr、Hf及C之莫耳質量(以g/mol計)； &lt;br/&gt;-一種結晶學組成，使得以基於結晶相之質量計之質量百分比表示，存在於該珠粒粉末中之該等結晶相的多於60%係呈金屬碳化物形式，該等結晶相包括至少一種選自Ti、Ta、Nb、V、Zr及Hf之元素之至少一種碳化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Powder of sintered beads having: &lt;br/&gt;- a chemical composition such that, as percentages by mass based on the mass of the bead powder: &lt;br/&gt;- (77 - C4)% ≤ W + Mo ≤ (95.5 - C3)%, with Mo ≤ 10%; &lt;br/&gt;- C1% ≤ C ≤ C2%; &lt;br/&gt;- Ti, Ta, Nb, V, Zr and Hf such that &lt;br/&gt;Ti + Nb + V + Zr ≥ 4.5% and/or Ta + Hf ≥ 5%, and &lt;br/&gt;additive ≤ 20.0%, the additive denoting Ti + Ta + Nb + V + Zr + Hf; &lt;br/&gt;- elements other than W, Mo, C, Ti, Ta, Nb, V, Zr or Hf, or "other elements": ≤ 3%; &lt;br/&gt;with: &lt;br/&gt;- C1 = 100*(C3 / C5), &lt;br/&gt;- C2 = 100*(C4 / C6), &lt;br/&gt;- C3 = k*C7, with k chosen from 0.5, 0.6, 0.7, 0.8 and 0.9, &lt;br/&gt;- C4 = k’*C7, with k’ chosen from 1.2 and 1.1, &lt;br/&gt;- C5 = [m(W) + m(Mo) + m(Ti) + m(Ta) + m(Nb) + m(V) + m(Zr) + m(Hf) + C3], &lt;br/&gt;- C6 = [m(W) + m(Mo) + m(Ti) + m(Ta) + m(Nb) + m(V) + m(Zr) + m(Hf) + C4], &lt;br/&gt;- C7 = M(C)*[(m(W) / M(W)) + (m(Mo) / M(Mo)) + (m(Ti) / M(Ti)) + (m(Ta) / M(Ta)) + (m(Nb) / M(Nb)) + (m(V) / M(V)) + (m(Zr) / M(Zr)) + (m(Hf) / M(Hf))], &lt;br/&gt;m(W), m(Mo), m(Ti), m(Ta), m(Nb), m(V), m(Zr) and m(Hf) being the mass, in grams, of the elements W, Mo, Ti, Ta, Nb, V, Zr and Hf, respectively, and &lt;br/&gt;M(W), M(Mo), M(Ti), M(Ta), M(Nb), M(V), M(Zr), M(Hf) and M(C) being the molar mass, in g/mol, of the elements W, Mo, Ti, Ta, Nb, V, Zr, Hf and C, respectively; &lt;br/&gt;- a crystallographic composition such that more than 60% of the crystalline phases present in said bead powder are in a metal carbide(s) form, as percentage by mass based on the mass of the crystalline phases, said crystalline phases including at least one carbide of at least one element from among Ti, Ta, Nb, V, Zr and Hf.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="937" publication-number="202610614"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610614.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610614</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116417</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏合性化妝用化合物及其用途</chinese-title>  
        <english-title>ADHESIVE COSMETIC COMPOUNDS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K8/72</main-classification>  
        <further-classification edition="200601120251201B">A61K8/49</further-classification>  
        <further-classification edition="200601120251201B">A61K8/33</further-classification>  
        <further-classification edition="200601120251201B">A61Q1/00</further-classification>  
        <further-classification edition="200601120251201B">A61Q3/02</further-classification>  
        <further-classification edition="200601120251201B">A61Q5/00</further-classification>  
        <further-classification edition="200601120251201B">A61Q19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商肌膚歐希芙公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKINOSIVE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾妮　莉絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AINIE, LISE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯特蘭　朱麗葉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERTRAND, JULIETTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡諾勒　貝努特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANOLLE, BENOIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱薩奇　毛拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KESSACI, MAORA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬克雷魯格拉斯　梅迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKREROUGRAS, MEHDI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普樂帝　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POULETTY, PHILIPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞爾特　伊莎貝爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAULT, ISABELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種由下式(I)表示之化合物： &lt;br/&gt;A[B-(C)&lt;sub&gt;v&lt;/sub&gt;]&lt;sub&gt;w&lt;/sub&gt;     (I)， &lt;br/&gt;其中A為選自護膚劑、美髮劑、修容劑及成膜劑的化妝用活性劑(cosmetic agent)，B為連接基團，C為官能基，v為1至2000之整數，且w為1至6000之整數。本發明亦係關於一種包含該化合物之組合物及其在化妝品應用中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a compound represented by the following formula (I): &lt;br/&gt;A[B-(C)&lt;sub&gt;v&lt;/sub&gt;]&lt;sub&gt;w&lt;/sub&gt; (I), &lt;br/&gt;wherein A is a cosmetic agent chosen among a skin care agent, a hair agent, a make-up agent, and a film-forming agent, B is a linker, C is a functional group, v is an integer from 1 to 2000, and w is an integer from 1 to 6000. It also relates to a composition comprising the same and uses thereof in cosmetic applications.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="938" publication-number="202612441"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612441.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612441</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及其製造方法</chinese-title>  
        <english-title>MEMORY DEVICE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250909B">H10B10/00</main-classification>  
        <further-classification edition="200601120250909B">G11C11/413</further-classification>  
        <further-classification edition="200601120250909B">G11C5/14</further-classification>  
        <further-classification edition="200601120250909B">G11C8/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳家政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳經緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">記憶體裝置包括形成在基材之第一側上並由供應電壓供電的記憶體單元；形成在第一側上並包括第三金屬軌道的第三金屬化層，第三金屬軌道中之至少一者用以僅承載非功率信號而非承載供應電壓；形成在第一側上並包括各個僅組態為字元線的第四金屬軌道的第四金屬化層；形成在基材之第二側上並包括各個用以承載供應電壓或地面電壓的第五金屬軌道的第五金屬化層；及形成在第二側上並包括各個用以承載供應電壓或地面電壓的第六金屬軌道的第六金屬化層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes memory cells formed on a first side of a substrate and powered by a supply voltage; a third metallization layer formed on the first side and including third metal tracks, at least one of the third metal tracks configured to only carry a non-power signal instead of carrying the supply voltage; a fourth metallization layer formed on the first side and including fourth metal tracks, each configured only as a word line; a fifth metallization layer formed on a second side of the substrate and including fifth metal tracks, each configured to carry the supply voltage or a ground voltage; and a sixth metallization layer formed on the second side and including sixth metal tracks, each configured to carry the supply voltage or the ground voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:佈局</p>  
        <p type="p">350~356:BM0軌道</p>  
        <p type="p">360~373:BM1軌道</p>  
        <p type="p">380~383:BM2軌道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="939" publication-number="202612503"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612503.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612503</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116458</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251106B">H10D30/60</main-classification>  
        <further-classification edition="202501120251106B">H10D64/27</further-classification>  
        <further-classification edition="200601120251106B">H01L21/76</further-classification>  
        <further-classification edition="200601120251106B">H01L21/302</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭琮介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, TSUNG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李維元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WEI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王智麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述半導體裝置及用於製造半導體裝置的方法。方法包括在半導體基板上方形成多個主動區；在半導體基板上方且這些主動區之間形成淺溝槽隔離(STI)特徵，其中STI特徵接觸半導體基板的上表面；在主動區上方且STI特徵上方形成閘極結構；藉由蝕刻穿過閘極結構且至STI特徵中來切割閘極結構以形成溝槽，其中溝槽遠離半導體基板的上表面；以及在溝槽中形成絕緣特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor devices and methods for fabricating semiconductor devices are described. A method includes forming active regions over a semiconductor substrate; forming a shallow trench isolation (STI) feature over the semiconductor substrate and between the active regions, wherein the STI feature contacts an upper surface of the semiconductor substrate; forming a gate structure over the active regions and over the STI feature; cutting the gate structure by etching through the gate structure and into the STI feature to form a trench, wherein the trench is distanced from the upper surface of the semiconductor substrate; and forming an insulation feature in the trench.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:基板</p>  
        <p type="p">365:剩餘部分</p>  
        <p type="p">500:切割金屬閘極絕緣特徵</p>  
        <p type="p">501:底表面</p>  
        <p type="p">800:裝置</p>  
        <p type="p">810:第一傳導類型之井</p>  
        <p type="p">815:垂直介面</p>  
        <p type="p">820:第二傳導類型之井</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="940" publication-number="202611342"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611342.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611342</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以鹼金屬富集電極材料用之方法及富集設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C25D21/14</main-classification>  
        <further-classification edition="200601120251201B">C25D17/06</further-classification>  
        <further-classification edition="200601120251201B">C25C1/02</further-classification>  
        <further-classification edition="201001120251201B">H01M10/0525</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商雷納科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RENA TECHNOLOGIES GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫恩蘭　霍格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUEHNLEIN, HOLGER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢森　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSEN, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪拉海　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELAHAYE, FRANCK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏格曼　安卓亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERGMANN, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及以鹼金屬(12)富集電極材料(10)的方法(100)，其中鹼金屬(12)藉著具有鹼金屬(12)的補給帶(14、15)加以補給(102)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電極材料</p>  
        <p type="p">12:鹼金屬</p>  
        <p type="p">14:第一補給帶</p>  
        <p type="p">15:第二補給帶</p>  
        <p type="p">16:承載帶</p>  
        <p type="p">22:電解質槽</p>  
        <p type="p">24:基材帶</p>  
        <p type="p">32a:富集設備</p>  
        <p type="p">34:水池</p>  
        <p type="p">36a:傳輸裝置</p>  
        <p type="p">38a:支架裝置</p>  
        <p type="p">40:補給帶傳輸輪</p>  
        <p type="p">44:垂直方向</p>  
        <p type="p">46:基材帶傳輸輪</p>  
        <p type="p">51:水位降</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="941" publication-number="202610831"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610831.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610831</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116469</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含烷氧基矽烷矽石奈米粒子及官能性聚合物之物品及硬塗層組成物及方法</chinese-title>  
        <english-title>ARTICLES AND HARDCOAT COMPOSITION COMPRISING ALKOXY SILANE SILICA NANOPARTICLES AND FUNCTIONAL POLYMER, AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B27/00</main-classification>  
        <further-classification edition="200601120251201B">B32B27/20</further-classification>  
        <further-classification edition="200601120251201B">B32B27/28</further-classification>  
        <further-classification edition="200601120251201B">C08G77/42</further-classification>  
        <further-classification edition="200601120251201B">C08L83/10</further-classification>  
        <further-classification edition="200601120251201B">C08K3/36</further-classification>  
        <further-classification edition="202001120251201B">C08J7/046</further-classification>  
        <further-classification edition="200601120251201B">C09D183/10</further-classification>  
        <further-classification edition="201801120251201B">C09D7/40</further-classification>  
        <further-classification edition="201801120251201B">C09D7/42</further-classification>  
        <further-classification edition="201801120251201B">C09D7/61</further-classification>  
        <further-classification edition="200601120251201B">C09D5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商3Ｍ新設資產公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳溪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>景　乃勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JING, NAIYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謬智輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIAO, ZHIHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯比　泰勒　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBE, TAYLOR JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯德伯格　約翰　魯本</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUDBERG, JOHN REUBEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢娜　巴斯內特　索尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANNA BASNET, SONI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個實施例中，描述一種物品，其包含：基材；硬塗層，其係設置在該基材上，其中該硬塗層包含組成物之水解及縮合的反應產物，該組成物包含：i)第一矽烷單體，其具有式R&lt;sup&gt;1&lt;/sup&gt;Si(OR)&lt;sub&gt;3&lt;/sub&gt;，其中R及R&lt;sup&gt;1&lt;/sup&gt;係甲基或乙基；ii)至少一種有機聚合物，其包含與該第一矽烷單體之水解的OR基團反應的一或多個官能基；iii)至少10wt.%之矽石奈米粒子；及C)包含親水性矽烷之表面層，其設置在該硬塗層上。亦描述一種硬塗層組成物及使用方法。一種方法包含：在該硬塗層或表面層上書寫；及去除該書寫。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one embodiment, an article is described comprising: a substrate; a hardcoat layer disposed on the substrate wherein the hardcoat layer comprises the hydrolyzed and condensed reaction product of a composition comprising: i) first silane monomer(s) having the formula R&lt;sup&gt;1&lt;/sup&gt;Si(OR)&lt;sub&gt;3&lt;/sub&gt; wherein R and R&lt;sup&gt;1&lt;/sup&gt; is methyl or ethyl; ii) at least one organic polymer comprises one or more functional groups that react with hydrolyzed OR groups of the first silane monomer(s); iii) at least 10 wt.% of silica nanoparticles; and C) a surface layer comprising a hydrophilic silane disposed on the hardcoat layer. Also described is a hardcoat composition and methods of use. One method comprise writing on the hardcoat layer or surface layer; and removing the writing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13:硬塗層</p>  
        <p type="p">15:基材</p>  
        <p type="p">22:主表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="942" publication-number="202610832"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610832.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610832</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116470</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含含有烷氧基矽烷及矽石奈米粒子之硬塗層組成物的物品及其方法</chinese-title>  
        <english-title>ARTICLES COMPRISING HARDCOAT COMPOSITION COMPRISING ALKOXY SILANE AND SILICA NANOPARTICLES, AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B27/00</main-classification>  
        <further-classification edition="200601120251201B">B32B27/20</further-classification>  
        <further-classification edition="200601120251201B">B32B27/28</further-classification>  
        <further-classification edition="200601120251201B">C08G77/04</further-classification>  
        <further-classification edition="200601120251201B">C08G77/42</further-classification>  
        <further-classification edition="200601120251201B">C08L83/04</further-classification>  
        <further-classification edition="200601120251201B">C08L83/10</further-classification>  
        <further-classification edition="200601120251201B">C08K3/36</further-classification>  
        <further-classification edition="202001120251201B">C08J7/046</further-classification>  
        <further-classification edition="200601120251201B">C09D183/04</further-classification>  
        <further-classification edition="200601120251201B">C09D183/10</further-classification>  
        <further-classification edition="201801120251201B">C09D7/40</further-classification>  
        <further-classification edition="201801120251201B">C09D7/61</further-classification>  
        <further-classification edition="200601120251201B">C09D5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商3Ｍ新設資產公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳溪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>景　乃勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JING, NAIYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述一種物品，其包含：A)基材；B)硬塗層，其係設置在該基材上，其中該硬塗層包含組成物之水解及縮合的反應產物，該組成物包含：i)第一矽烷單體，其具有式R1Si(OR)3，其中R及R1係甲基或乙基；ii)矽石奈米粒子，其含量大於30wt.%，具有10至40nm之一次平均粒徑；及C)包含親水性矽烷之表面層，其設置在該硬塗層上。本文亦描述使用之多種方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An article is described comprising A) a substrate; B) a hardcoat layer disposed on the substrate wherein the hardcoat layer comprises the hydrolyzed and condensed reaction product of a composition comprising: i) first silane monomer(s) having the formula R1Si(OR)3 wherein R and R1 is methyl or ethyl; ii) silica nanoparticles having a primary average particle size of 10 to 40 nm in an amount greater than 30 wt.%; and C) a surface layer comprising a hydrophilic silane disposed on the hardcoat layer. Also described are methods of use.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13:硬塗層</p>  
        <p type="p">15:基材</p>  
        <p type="p">22:主表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="943" publication-number="202612401"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612401.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612401</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116475</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面處理銅箔、覆銅積層板及印刷線路板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H05K1/09</main-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification>  
        <further-classification edition="200601120251201B">B32B15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商古河電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野惇郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, JUNRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部聖凪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, MASANAGI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇野岳夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNO, TAKEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三橋嶺人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUHASHI, MINETO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西芳正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHI, YOSHIMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松浦泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUURA, YASUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野川研登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGAWA, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田富美子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, FUMIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種表面處理銅箔，其能製造樹脂製基材與表面處理銅箔之密合性優異、傳輸損耗小且雷射加工性良好的印刷線路板等。表面處理銅箔係在至少其中一面具有粗糙化處理面之表面處理銅箔，該粗糙化處理面形成有粗糙化顆粒，並且針對粗糙化處理面測得之物性值滿足下述條件(甲)、(乙)及(丙)。 &lt;br/&gt;    (甲)使用具有可發射波長600 nm的45°偏光的光源之分光光度計，在入射角與反射角均為70°的條件下測得之粗糙化處理面的鏡面反射率為0.20%以上且0.90%以下。 &lt;br/&gt;    (乙)粗糙化處理面的明度的Y值為10.0以上且15.5以下。 &lt;br/&gt;    (丙)使用雷射顯微鏡測得之粗糙化處理面的Ssk為0.30以上且0.80以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:表面處理銅箔</p>  
        <p type="p">10a:粗糙化處理面</p>  
        <p type="p">20:樹脂製基材</p>  
        <p type="p">30:覆銅積層板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="944" publication-number="202611688"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611688.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611688</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用不可變儲存記憶體中的引導加載程式捕獲來更新裝置韌體的方法和系統</chinese-title>  
        <english-title>METHODS AND SYSTEMS FOR UPDATING DEVICE FIRMWARE USING A BOOTLOADER TRAP IN IMMUTABLE STORAGE MEMORY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F3/06</main-classification>  
        <further-classification edition="201801120251201B">G06F8/65</further-classification>  
        <further-classification edition="201601120251201B">G06F12/0802</further-classification>  
        <further-classification edition="201801120251201B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛思開海力士存儲器產品解決方案公司　(亦以思得名稱營業)</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛文　米倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOEWEN, MYRON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於將韌體加載於包括處理電路系統及不可變儲存記憶體之一裝置上之系統及相關方法，其中該處理電路系統使得基於儲存於該不可變儲存記憶體中之啟動程式碼而起始一裝置啟動。當該裝置啟動正起始時，該處理電路系統用以接收一第一信號且判定在該接收到該第一信號之後的一最小等待時間內未接收到一第二信號。一旦該處理電路系統已判定在該接收到該第一信號之後的該最小等待時間內未接收到該第二信號，該處理電路系統便用以將該韌體加載於該裝置上。當將該韌體加載於複數個裝置中之一或多個裝置上時，可使用一控制器。該第一信號及該第二信號可分別為一第一中斷信號及一第二中斷信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and related method for loading firmware on a device including processing circuitry and immutable storage memory, where the processing circuitry causes a device startup to be initiated based on startup code stored in the immutable storage memory. While the device startup is being initiated, the processing circuitry is to receive a first signal and determine that a second signal was not received within a minimum wait time following the receipt of the first signal. Once the processing circuitry has determined that the second signal was not received within the minimum wait time following the receipt of the first signal, the processing circuitry is to load the firmware on the device. A controller may be used when loading firmware on one or more devices of a plurality of devices. The first signal and the second signal may be a first interrupt signal and a second interrupt signal, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:裝置</p>  
        <p type="p">103:介面</p>  
        <p type="p">104:處理電路系統</p>  
        <p type="p">105:持久儲存媒體</p>  
        <p type="p">106:控制器</p>  
        <p type="p">107:啟動程式碼</p>  
        <p type="p">108:不可變儲存記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="945" publication-number="202611148"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611148.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611148</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116485</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性組成物、硬化物及電子零件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F290/06</main-classification>  
        <further-classification edition="200601120251201B">C08F299/02</further-classification>  
        <further-classification edition="200601120251201B">C08L71/12</further-classification>  
        <further-classification edition="200601120251201B">C08K5/13</further-classification>  
        <further-classification edition="200601120251201B">C08K5/372</further-classification>  
        <further-classification edition="200601120251201B">C08K5/527</further-classification>  
        <further-classification edition="200601120251201B">C09K15/08</further-classification>  
        <further-classification edition="200601120251201B">C09K15/12</further-classification>  
        <further-classification edition="200601120251201B">C09K15/32</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商太陽控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉田侑生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGITA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川信広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, NOBUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関口翔也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIGUCHI, SHOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三島翔子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MISHIMA, SHOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋山茂義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIYAMA, TAKAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供於實施於大氣環境下之硬化或加熱的情況下，可形成容易抑制低介電正切特性的惡化之硬化物的硬化性組成物、使用該硬化性組成物所得之硬化物及具有該硬化物之電子零件。 &lt;br/&gt;　　本發明之一形態包含：具有官能基之聚苯醚(Polyphenylene Ether)，該官能基具有不飽和碳鍵、與抗氧化劑，前述抗氧化劑為包含選自磷系抗氧化劑、硫系抗氧化劑中之1種以上的硬化性組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="946" publication-number="202611150"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611150.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611150</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116565</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無溶劑型組合物及硬化膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F290/14</main-classification>  
        <further-classification edition="200601120251201B">C08G73/02</further-classification>  
        <further-classification edition="200601120251201B">C08L79/02</further-classification>  
        <further-classification edition="200601120251201B">C08K3/36</further-classification>  
        <further-classification edition="200601120251201B">C08K7/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中家直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAIE, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>国見奈穂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNIMI, NAHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中智恵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, CHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村透</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下吉真実</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOYOSHI, MAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井美帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, MIHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種能夠形成能夠使膜厚較厚並且具有低折射率之硬化膜的無溶劑型組合物。該課題係藉由如下無溶劑型組合物解決，該無溶劑型組合物包含含三𠯤環之聚合物、交聯劑及於外殼之內部具有空間之中空二氧化矽粒子，且不包含有機溶劑。其中，含三𠯤環之聚合物係包含式(1)所表示之重複單元結構，具有至少1個三𠯤環末端，該三𠯤環末端之至少一部分經具有交聯基之胺基封端之含三𠯤環之聚合物， &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="254px" width="280px" file="ed10064.JPG" alt="ed10064.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;中空二氧化矽粒子係經選自由下述式(44)、式(45)及式(46)所組成之群中之至少1種矽烷化合物被覆之中空二氧化矽粒子： &lt;br/&gt;R&lt;sup&gt;106&lt;/sup&gt;&lt;sub&gt;a&lt;/sub&gt;Si(R&lt;sup&gt;107&lt;/sup&gt;)&lt;sub&gt;4-a                         &lt;/sub&gt;式(44) &lt;br/&gt;[R&lt;sup&gt;108&lt;/sup&gt;&lt;sub&gt;b&lt;/sub&gt;Si(R&lt;sup&gt;109&lt;/sup&gt;)&lt;sub&gt;3-b&lt;/sub&gt;]&lt;sub&gt;2&lt;/sub&gt;Y&lt;sub&gt;c               &lt;/sub&gt;式(45) &lt;br/&gt;R&lt;sup&gt;110&lt;/sup&gt;&lt;sub&gt;d&lt;/sub&gt;Si(R&lt;sup&gt;111&lt;/sup&gt;)&lt;sub&gt;4-d                         &lt;/sub&gt;式(46)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="947" publication-number="202611794"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611794.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611794</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116578</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>學習模型產生方法、學習模型產生裝置及學習模型產生程式</chinese-title>  
        <english-title>LEARNING MODEL GENERATION METHOD, LEARNING MODEL GENERATION DEVICE AND LEARNING MODEL GENERATION PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">G06N5/046</main-classification>  
        <further-classification edition="200601120251201B">G05B19/418</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀口博司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIGUCHI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之學習模型產生方法基於複數個實際資料集，產生自基板之處理條件預測基板之處理結果之順向模型。使用順向模型，自複數個基板之虛擬處理條件之各者預測基板之虛擬處理結果，藉此產生複數個虛擬資料集。基於複數個虛擬資料集之至少一部分，產生自基板之處理結果預測基板之處理條件之逆向模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:功能部</p>  
        <p type="p">11:順向模型產生部</p>  
        <p type="p">12:虛擬資料產生部</p>  
        <p type="p">13:逆向模型產生部</p>  
        <p type="p">100:學習模型產生裝置</p>  
        <p type="p">140:記憶裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="948" publication-number="202611521"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611521.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611521</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116579</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電性連接裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01R1/073</main-classification>  
        <further-classification edition="200601120251201B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本麥克隆尼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商田中貴金屬工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA PRECIOUS METAL TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大森利則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMORI, TOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孝幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARUMI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤華壽也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下山楓雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOYAMA, FUGA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤俊之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤剛史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">木發明的課題係提供即使在高溫環境下也能提高陶瓷與金屬的密接性並牢固接合的電性連接裝置。 &lt;br/&gt;　　作為解決手段，本發明係使探針電性接觸被檢查體的複數個電極端子中的每一個，並使檢查裝置與被檢查體電性連接的電性連接裝置中，具備與檢查裝置電性連接的配線基板、具有複數個前述探針的探針基板、以及用於在配線基板與探針基板的複數個探針中的每一個之間進行電性連接的電性連接單元，且用於將探針基板連接至連接單元的環狀鍔，係無需使用固著具，透過接合材接合至探針基板的緣部為特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:被檢查體</p>  
        <p type="p">2a:電極端子</p>  
        <p type="p">3:晶圓吸盤</p>  
        <p type="p">9:測試器(檢查裝置)</p>  
        <p type="p">10:電性連接裝置</p>  
        <p type="p">12:支持構件</p>  
        <p type="p">12a:支持構件的下面</p>  
        <p type="p">14:配線基板</p>  
        <p type="p">14a:配線基板的連接端子</p>  
        <p type="p">15:電性連接單元</p>  
        <p type="p">16:探針基板</p>  
        <p type="p">20:探針</p>  
        <p type="p">30:接觸件</p>  
        <p type="p">50:錨固件</p>  
        <p type="p">51:間隔件</p>  
        <p type="p">121:貫通孔</p>  
        <p type="p">141:貫通孔</p>  
        <p type="p">151:凸緣部</p>  
        <p type="p">161:基板構件</p>  
        <p type="p">162:多層配線基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="949" publication-number="202612381"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612381.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612381</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>WiFi系統中增強模式切換方法</chinese-title>  
        <english-title>PROCEDURES OF ENHANCED MODE CHANGE IN WIFI SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H04W72/23</main-classification>  
        <further-classification edition="202301120251201B">H04W72/51</further-classification>  
        <further-classification edition="200901120251201B">H04W74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樓　漢卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOU, HANQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩德　默罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAAD, MAHMOUD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　曉飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAOFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了允許在WiFI網路中進行操作的站（STA）在一對STA之間發啟動動態操作模式改變的方法及結構，其中模式改變可能是暫態的，且STA可以在傳輸操作（TXOP）結束後、在模式改變參數/訊框中定義的特定時間之後及/或在滿足一或更多個特定標準之後改變回原始模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and structures are disclosed that permit a station (STA) operating in a WiFI network to initiate a dynamic operating mode change between a pair of STAs in which the mode change may be transient and the STAs may change back to an original mode after the end of a transmission operation (TXOP), after a certain time defined in mode change parameters/frames and/or after certain one or more criteria are met.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:無線傳輸/接收單元(WTRU)</p>  
        <p type="p">116:空中介面</p>  
        <p type="p">118:處理器</p>  
        <p type="p">120:收發器</p>  
        <p type="p">122:傳輸/接收元件</p>  
        <p type="p">124:揚聲器/麥克風</p>  
        <p type="p">126:小鍵盤</p>  
        <p type="p">128:顯示器/觸控板</p>  
        <p type="p">130:非可移式記憶體</p>  
        <p type="p">132:可移式記憶體</p>  
        <p type="p">134:電源</p>  
        <p type="p">136:全球定位系統(GPS)晶片組</p>  
        <p type="p">138:週邊設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="950" publication-number="202612523"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612523.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612523</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116662</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251001B">H10D64/01</main-classification>  
        <further-classification edition="202501120251001B">H10D30/01</further-classification>  
        <further-classification edition="202501120251001B">H10D64/27</further-classification>  
        <further-classification edition="202501120251001B">H10D64/23</further-classification>  
        <further-classification edition="202501120251001B">H10D62/13</further-classification>  
        <further-classification edition="202501120251001B">H10D62/17</further-classification>  
        <further-classification edition="202501120251001B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宏臺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUNG-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張智強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游明華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, MING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括形成複數個半導體奈米結構，其中該些半導體奈米結構中的上半導體奈米結構與該些半導體奈米結構中的相應下半導體奈米結構重疊。形成複數個半導體層，每一半導體層由該些半導體奈米結構中的一個半導體奈米結構形成。經由蝕刻製程對該些半導體層進行形塑。該些半導體層中的第一半導體層比該些半導體層中的第二半導體層蝕刻得更多，其中該第一半導體層高於該第二半導體層。在對該些半導體層進行形塑之後，形成附加半導體層以電連接至該些半導體層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a plurality of semiconductor nanostructures, wherein upper ones of the plurality of semiconductor nanostructures overlap respective lower ones of the plurality of semiconductor nanostructures. A plurality of semiconductor layers are formed, each from one of the plurality of semiconductor nanostructures. The plurality of semiconductor layers are shaped through an etching process. A first semiconductor layer of the plurality of semiconductor layers is etched more than a second semiconductor layer of the plurality of semiconductor layers, wherein the first semiconductor layer is higher than the second semiconductor layer. After the plurality of semiconductor layers are shaped, an additional semiconductor layer is formed to electrically connect to the plurality of semiconductor layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:基板</p>  
        <p type="p">22B:第二層</p>  
        <p type="p">30:虛設閘極堆疊</p>  
        <p type="p">38:閘極間隔物</p>  
        <p type="p">44:內間隔物</p>  
        <p type="p">47:區域</p>  
        <p type="p">48:源極/汲極區域</p>  
        <p type="p">48A:分離層</p>  
        <p type="p">48B~48D:半導體層</p>  
        <p type="p">48E:覆蓋層</p>  
        <p type="p">48C-T:尖端</p>  
        <p type="p">50:接觸蝕刻終止層</p>  
        <p type="p">52:層間介電層</p>  
        <p type="p">62:閘極介電層</p>  
        <p type="p">68:閘電極</p>  
        <p type="p">70:閘極堆疊</p>  
        <p type="p">78:矽化物區域</p>  
        <p type="p">80B:接觸插塞</p>  
        <p type="p">82:電晶體</p>  
        <p type="p">110:虛線</p>  
        <p type="p">111:中間中心線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="951" publication-number="202610940"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610940.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610940</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116669</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含鋁原子之中空氧化矽溶膠及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C01B33/145</main-classification>  
        <further-classification edition="200601120251201B">C01B33/146</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>実</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOYOSHI, MANAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中田豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKADA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江原和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村透</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, TOHRU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">作為本案發明之課題，為提供一種對溶媒之分散安定性較高，沒有鹼金屬流出等之虞之中空氧化矽粒子。 &lt;br/&gt;　　作為解決手段，為提供一種含鋁原子之中空氧化矽溶膠，且該中空氧化矽溶膠中所包含之硫酸量為1ppm~ 150ppm之中空氧化矽溶膠及其製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="952" publication-number="202611989"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611989.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611989</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膜厚推定裝置、膜厚推定方法及電腦程式</chinese-title>  
        <english-title>FILM THICKNESS ESTIMATION DEVICE, FILM THICKNESS ESTIMATION METHOD AND COMPUTER PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250526B">H01L21/027</main-classification>  
        <further-classification edition="200601120250526B">H01L21/304</further-classification>  
        <further-classification edition="200601120250526B">B05C11/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村崇也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, TAKAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本悟史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安陪裕滋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤祐太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, ITSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木克典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, KATSUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>實井祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JITSUI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可精度良好地對形成在基板上的塗布膜的膜厚進行推定的技術。第一編碼器部（201）將膜厚數據（x&lt;sub&gt;1&lt;/sub&gt;）作為輸入，輸出第一潛在變量（z&lt;sub&gt;1&lt;/sub&gt;）。解碼器部（203）將第一潛在變量（z&lt;sub&gt;1&lt;/sub&gt;）作為輸入，輸出經重構的膜厚數據（x&lt;sub&gt;1&lt;/sub&gt;'）。第二編碼器部（210）將製程參數（x&lt;sub&gt;2&lt;/sub&gt;）作為輸入，輸出第二潛在變量（z&lt;sub&gt;2&lt;/sub&gt;）。在第一學習處理（ST1）中，以使輸入到自動編碼器（200）的膜厚數據（x&lt;sub&gt;1&lt;/sub&gt;）、與所輸出的膜厚數據（x&lt;sub&gt;1&lt;/sub&gt;'）的誤差最小化的方式，使自動編碼器（200）進行學習。在第二學習處理（ST2）中，以使將膜厚數據（x&lt;sub&gt;1&lt;/sub&gt;）輸入到第一編碼器部（201）而得的第一潛在變量（z&lt;sub&gt;1&lt;/sub&gt;）、與將製程參數（x&lt;sub&gt;2&lt;/sub&gt;）輸入到第二編碼器部（210）而得的第二潛在變量（z&lt;sub&gt;2&lt;/sub&gt;）的誤差最小化的方式，使第二編碼器部（210）進行學習。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:自動編碼器</p>  
        <p type="p">201:第一編碼器部</p>  
        <p type="p">203:解碼器部</p>  
        <p type="p">210:第二編碼器部</p>  
        <p type="p">Md1:基礎模型</p>  
        <p type="p">ST1:第一學習處理</p>  
        <p type="p">ST2:第二學習處理</p>  
        <p type="p">x1、x1':膜厚數據</p>  
        <p type="p">x2:製程參數</p>  
        <p type="p">z1:第一潛在變量</p>  
        <p type="p">z2:第二潛在變量</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="953" publication-number="202612094"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612094.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612094</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116704</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>功率半導體設備及其接合方法</chinese-title>  
        <english-title>POWER SEMICONDUCTOR APPARATUS AND BONDING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01L21/683</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商達爾科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIODES INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威爾科森　杜安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILCOXEN, DUANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設備包含：一背側支撐層，其具有一第一厚度；一黏著劑層，其在該背側支撐層之上；一金屬層，其在該黏著劑層之上，其中該金屬層用作一背側連接器；一半導體基板層，其在該金屬層之上，其中該半導體基板主動層具有一第二厚度；及複數個前側連接器，其中該半導體基板層中之主動電路電耦合於該複數個前側連接器與該金屬層之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus includes a backside supporting layer having a first thickness, an adhesive layer over the backside supporting layer, a metal layer over the adhesive layer, wherein the metal layer functions as a backside connector, a semiconductor substrate layer over the metal layer, wherein the semiconductor substrate layer has a second thickness, and a plurality of front side connectors, wherein active circuits in the semiconductor substrate layer over are electrically coupled between the plurality of front side connectors and the metal layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:裝置晶圓</p>  
        <p type="p">102:載體</p>  
        <p type="p">203:黏著劑層</p>  
        <p type="p">601:背側支撐側</p>  
        <p type="p">602:罩蓋層</p>  
        <p type="p">604:金屬層</p>  
        <p type="p">610:半導體基板</p>  
        <p type="p">612:鈍化層</p>  
        <p type="p">621:連接器</p>  
        <p type="p">622:連接器</p>  
        <p type="p">623:連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="954" publication-number="202612186"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612186.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612186</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線端連接器與其殼體</chinese-title>  
        <english-title>CABLE-END CONNECTOR AND THE HOUSING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250528B">H01R13/40</main-classification>  
        <further-classification edition="200601120250528B">H01R13/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾威勒電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李星佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HSING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種線端連接器包括殼體及端子。殼體包括安裝通道及位於安裝通道內的導引結構。端子配置以插入安裝通道並包括對應的二固定臂，其中導引結構配置以引導二固定臂的至少一者彈性變形，而二固定臂的至少一者配置以通過導引結構後彈性恢復而固定於安裝通道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cable-end connector includes a housing and a terminal. The housing includes an installation channel and a guiding structure located within the installation channel. The terminal is configured to insert into the installation channel and includes two corresponding locking arms, in which the guiding structure is configured to drive at least one of the two locking arms to elastically deform, and the two locking arms are configured to elastically recover after passing the guiding structure to be fixed within the installation channel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:線端連接器</p>  
        <p type="p">110:殼體</p>  
        <p type="p">111:安裝通道</p>  
        <p type="p">112:本體</p>  
        <p type="p">113:導引結構</p>  
        <p type="p">114:對接部</p>  
        <p type="p">117:前側面</p>  
        <p type="p">118:卡扣結構</p>  
        <p type="p">119:後側面</p>  
        <p type="p">130:端子</p>  
        <p type="p">131:固定臂</p>  
        <p type="p">131a:抵接面</p>  
        <p type="p">132:接觸部</p>  
        <p type="p">133:倒勾彈片</p>  
        <p type="p">134:纜線連接部</p>  
        <p type="p">200:纜線</p>  
        <p type="p">A,B,C:割面線</p>  
        <p type="p">X,Y,Z:軸向</p>  
        <p type="p">X1:安裝方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="955" publication-number="202612372"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612372.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612372</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在空閒／非活動模式下支援ＬＰ—ＷＵＳ資訊方法及裝置</chinese-title>  
        <english-title>METHODS AND APPARATUSES FOR SUPPORTING LP-WUS INFORMATION IN IDLE/INACTIVE MODES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W52/02</main-classification>  
        <further-classification edition="201801120251201B">H04W76/15</further-classification>  
        <further-classification edition="201801120251201B">H04W76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭榮佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, YOUNG WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MOON IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫拉特　普拉仙納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERATH, PRASANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">無線傳輸接收單元(WTRU)可以基於以下中的一者或更多者來確定用於低功率喚醒信號(LP-WUS)的每LP-WUS測量時機(MO)的子群組數量及/或用於LP-WUS 的子群組識別符(ID)：LP-WUS資訊的大小、LP-WUS支援的子群組數量、及/或每LP-WUS MO的子群組數量(例如可以與用於傳呼早期指示(PEI)的子群組數量不同)的指示。WTRU 可以基於LP-WUS中的子群組數量、LP-WUS MO中的子群組數量、及/或PEI中的子組數量中的一者或更多者來確定用於LP-WUS的WTRU 子群組ID以及要針對LP-WUS進行監控的一或更多LP-WUS MO。例如，WTRU可以監控與WTRU子群組ID相關聯的一或更多LP-WUS MO。例如，WTRU可以監控遞送公用資訊的一或更多LP-WUS MO。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless transmit receive unit (WTRU) may determine a number of subgroups per low-power wake-up signal (LP-WUS) measuring occasion (MO) for a LP-WUS and/or subgroup identifier (ID) for the LP-WUS based on one or more of the size of LP-WUS information, the number of subgroups supported by the LP-WUS, and/or an indication of the number of subgroups per LP-WUS MO (e.g., can be different with number of subgroups for paging early indication (PEI)). The WTRU may determine a WTRU subgroup ID for the LP-WUS and one or more LP-WUS MOs to monitor for the LP-WUS based on one or more of a number of subgroups in the LP-WUS, number of subgroups in an LP-WUS MO, and/or number of subgroups in the PEI. For example, the WTRU may monitor the one or more LP-WUS MOs associated with the WTRU subgroup ID. For example, the WTRU may monitor one or more LP-WUS MOs delivering common information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">DRX:非連續接收</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="956" publication-number="202611154"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611154.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611154</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116873</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用二甲基環磷烯氧化物作為催化劑製備聚碳二亞胺組成物之方法</chinese-title>  
        <english-title>PROCESS FOR PREPARING A POLYCARBODIIMIDE COMPOSITION USING DIMETHYLPHOSPHOLENE OXIDE AS CATALYST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G18/02</main-classification>  
        <further-classification edition="200601120251201B">C08G18/10</further-classification>  
        <further-classification edition="200601120251201B">C08G18/16</further-classification>  
        <further-classification edition="200601120251201B">C08G18/28</further-classification>  
        <further-classification edition="200601120251201B">C08G18/32</further-classification>  
        <further-classification edition="200601120251201B">C08G18/42</further-classification>  
        <further-classification edition="200601120251201B">C08G18/66</further-classification>  
        <further-classification edition="200601120251201B">C08G18/76</further-classification>  
        <further-classification edition="200601120251201B">C08G18/79</further-classification>  
        <further-classification edition="200601120251201B">C08G18/80</further-classification>  
        <further-classification edition="200601120251201B">C08L75/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴斯夫歐洲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧卡斯　弗雷德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUCAS, FREDERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪佛　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEFER, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧特曼斯　安雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLTMANNS, ANJA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於製備聚碳二亞胺組成物的方法，該方法包含(i)製備包含1,3-二(2-異氰氧基丙-2-基)苯（TMXDI）及催化性化合物的混合物，其中該催化性化合物包含1,3-二甲基-2-環磷烯1-氧化物、1,3-二甲基-3-環磷烯1-氧化物或1,3-二甲基-2-環磷烯1-氧化物及1,3-二甲基-3-環磷烯1-氧化物；(ii)使自(i)獲得的混合物在氣體氛圍中經受反應條件，其中該等反應條件包含將該反應混合物加熱至於自80至220 °C的範圍的溫度；以獲得包含該聚碳二亞胺組成物的混合物。此外，本發明係關於藉由或可藉由所述方法獲得的聚碳二亞胺組成物及其用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a process for preparing a polycarbodiimide composition, the process comprising (i) preparing a mixture comprising 1,3-bis(2-isocyanatopropan-2-yl)benzene (TMXDI) and a catalytic compound, wherein the catalytic compound comprises 1,3-dimethyl-2-phospholene 1-oxide, 1,3-dimethyl-3-phospholene 1-oxide, or 1,3-dimethyl-2-phospholene 1-oxide and 1,3-dimethyl-3-phospholene 1-oxide; (ii) subjecting the mixture obtained from (i) to reaction conditions in a gas atmosphere, wherein the reaction conditions comprise heating the reaction mixture to a temperature in the range of from 80 to 220 °C; to obtain a mixture comprising the polycarbodiimide composition. In addition thereto, the present invention relates to a polycarbodiimide composition obtained or obtainable by said process and use thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="957" publication-number="202611198"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611198.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611198</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116896</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自聚己二醯己二胺中性水解所獲得的溶劑分解混合物中回收玻璃纖維</chinese-title>  
        <english-title>RECOVERY OF GLASS FIBERS FROM SOLVOLYSIS MIXTURE OBTAINED BY NEUTRAL HYDROLYSIS OF POLYHEXAMETHYLENE ADIPAMIDE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08J11/14</main-classification>  
        <further-classification edition="200601120251201B">B29B17/02</further-classification>  
        <further-classification edition="200601120251201B">C08K7/14</further-classification>  
        <further-classification edition="200601120251201B">C08L77/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴斯夫歐洲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐特　約翰斯　克里斯提安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTT, JONAS CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克內曼　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOENEMANN, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼戈德　漢娜　史蒂芬妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANGOLD, HANNAH STEPHANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒂特林格　沃爾夫岡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DITTLINGER, WOLFGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德斯博伊　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESBOIS, PHILIPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於處理包含基於聚醯胺66（PA66）之聚合物及至少一種填料（F1）之聚合材料（PM）之方法，該方法包含提供包含基於聚醯胺（PA66）之聚合物及至少一種填料（F1）之聚合材料（PM）及包含水的溶劑組成物（SC）；自該聚合材料（PM）及該溶劑組成物（SC）製備混合物（M-0）；使混合物（M-0）經受用於解聚該基於聚醯胺66之聚合物的條件（D1），該用於解聚該基於聚醯胺66之聚合物的條件（D1）包含於自150至300°C的範圍，尤其於自150至250°C的範圍的解聚溫度T（D1）及至少0.25小時，較佳於自0.25至8小時的範圍，尤其於自0.5至8小時的範圍的解聚時間t（D1），其中因數F（D1）=T（D1） x t（D1）係於自200至10000 K*h，較佳自260至3700 K*h的範圍，獲得包含該溶劑組成物（SC）、該基於聚醯胺66之聚合物之可溶寡聚物及視需要單體、填料（F1）及不溶殘餘物的混合物（M-1）；及自混合物（M-1）分離該填料（F1）及不溶殘餘物而獲得包含該填料（F1）及不溶殘餘物的混合物（M-2）及包含該溶劑組成物（SC）及該基於聚醯胺66之聚合物之可溶寡聚物及視需要單體的混合物（M-3）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a process for treating a polymeric material (PM) comprising a polyamide 66 (PA66) based polymer and at least one filler (F1), the process comprising providing a polymeric material (PM) comprising a polyamide (PA66) based polymer and at least one filler (F1) and a solvent composition (SC) comprising water; preparing a mixture (M-0) from the polymeric material (PM) and the solvent composition (SC); subjecting mixture (M-0) to conditions for depolymerizing the polyamide 66 based polymer (D1) comprising a depolymerization temperature T(D1) in the range of from 150 to 300°C, in particular in the range of from 150 to 250°C, and a depolymerization time t(D1) of at least 0.25 hours, preferably in the range of from 0.25 to 8 hours, in particular in the range of from 0.5 to 8 hours, wherein the factor F(D1)=T(D1) x t(D1) is in the range of from 200 to 10000 K*h, preferably from 260 to 3700 K*h obtaining a mixture (M-1) comprising the solvent composition (SC), soluble oligomers and optionally monomers of the polyamide 66 based polymer, filler (F1), and insoluble residues; and separating the filler (F1) and insoluble residues from mixture (M-1) obtaining mixture (M-2) comprising the filler (F1) and insoluble residues, and mixture (M-3) comprising the solvent composition (SC) and soluble oligomers and optionally monomers of the polyamide 66 based polymer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="958" publication-number="202611199"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611199.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611199</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116898</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自聚醯胺（PA66）工程塑膠鹼性水解所獲得的溶劑分解混合物中回收玻璃纖維</chinese-title>  
        <english-title>RECOVERY OF GLASS FIBERS FROM SOLVOLYSIS MIXTURE OBTAINED BY ALKALINE HYDROLYSIS OF POLYAMIDE (PA66) ENGINEERING PLASTICS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08J11/16</main-classification>  
        <further-classification edition="200601120251201B">B29B17/02</further-classification>  
        <further-classification edition="200601120251201B">C08K7/14</further-classification>  
        <further-classification edition="200601120251201B">C08L77/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴斯夫歐洲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐特　約翰斯　克里斯提安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTT, JONAS CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克內曼　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOENEMANN, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼戈德　漢娜　史蒂芬妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANGOLD, HANNAH STEPHANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德斯博伊　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESBOIS, PHILIPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於處理包含基於聚醯胺（PA66）之聚合物及至少一種填料（F1）之聚合材料（PM）之方法，該方法包含提供包含基於聚醯胺（PA66）之聚合物及至少一種填料（F1）之聚合材料（PM）及包含水及視需要極性溶劑的溶劑組成物（SC）；自該聚合材料（PM）及該溶劑組成物（SC）製備混合物（M-0）；使混合物（M-0）經受解聚條件（D1），該等解聚條件（D1）包含於存在鹼下，於自150至300°C的範圍的解聚溫度T（D1）及至少5分鐘，較佳於自5至120分鐘的範圍，尤其於自5至30分鐘的範圍的解聚時間t（D1），其中因數F（D1）=T（D1）x t（D1）係於自40至2200 K*h的範圍，獲得包含該溶劑組成物（SC）、該基於聚醯胺（PA66）之聚合物之可溶單體及／或寡聚物、填料（F1）、不溶單體及不溶殘餘物的混合物（M-1）；自混合物（M-1）分離該填料（F1）、不溶單體及不溶殘餘物而獲得包含該填料（F1）、不溶單體及不溶殘餘物的混合物（M-2）及包含該溶劑組成物（SC）及該基於聚醯胺（PA66）之聚合物之可溶單體及／或寡聚物的混合物（M-3）；及視需要分離該填料（F1）與混合物（M-2）之其他組分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a process for treating a polymeric material (PM) comprising a polyamide (PA66) based polymer and at least one filler (F1), the process comprising providing a polymeric material (PM) comprising a polyamide (PA66) based polymer and at least one filler (F1) and a solvent composition (SC) comprising water and optionally a polar solvent; preparing a mixture (M-0) from the polymeric material (PM) and the solvent composition (SC); subjecting mixture (M-0) to depolymerization conditions (D1) comprising a depolymerization temperature T(D1) in the range of from 150 to 300°C and a depolymerization time t(D1) of at least 5 minutes, preferably in the range of from 5 to 120 minutes, in particular in the range of from 5 to 30 minutes, in the presence of a base, wherein the factor F(D1)=T(D1) x t(D1) is in the range of from 40 to 2200 K*h, obtaining a mixture (M-1) comprising the solvent composition (SC), soluble monomers and/or oligomers of the polyamide (PA66) based polymer, filler (F1), insoluble monomers and insoluble residues; separating the filler (F1), insoluble monomers and insoluble residues from mixture (M-1) obtaining mixture (M-2) comprising the filler (F1), insoluble monomers and insoluble residues, and mixture (M-3) comprising the solvent composition (SC), and soluble monomers and/or oligomers of the polyamide (PA66) based polymer; and optionally separating the filler (F1) from further components of mixture (M-2).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="959" publication-number="202612133"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612133.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612133</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116910</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於包括先進半導體晶片之封裝中之散熱之虛設特徵</chinese-title>  
        <english-title>DUMMY FEATURES FOR DISSIPATING HEAT IN PACKAGES INCLUDING ADVANCED SEMICONDUCTOR CHIPS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L23/373</main-classification>  
        <further-classification edition="200601120251210B">H01L23/367</further-classification>  
        <further-classification edition="202301120251210B">H01L25/065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安振鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AN, JINHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　源輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEE, GUAN HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍昌範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONG, CHANG BUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例包含半導體晶粒，該晶粒包括：具有前側的基板，該前側與背側相對；安置於基板的前側之上的元件層；形成於元件層之上的互連層；以及至少一個虛設特徵。該至少一個虛設特徵從基板的背側延伸穿過基板的部分，其中該至少一個虛設特徵包括一或多個金屬層。該至少一個虛設特徵藉由基板的一部分與元件層及互連層電氣絕緣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the disclosure include a semiconductor die comprising: a substrate having a frontside opposing a backside; a device layer disposed over the frontside of the substrate; interconnect layers formed over the device layer; and at least one dummy feature. The at least one dummy feature extending from the backside of the substrate through a portion of the substrate, wherein the at least one dummy feature comprises one or more metal layers. The at least one dummy feature being electrically isolated from the device layer and the interconnect layers by a portion of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:半導體晶粒</p>  
        <p type="p">202:基板</p>  
        <p type="p">202b:背側</p>  
        <p type="p">202f:前側</p>  
        <p type="p">203:基板厚度</p>  
        <p type="p">204:元件層</p>  
        <p type="p">206:互連層</p>  
        <p type="p">208:金屬墊</p>  
        <p type="p">210:導電特徵</p>  
        <p type="p">217a:寬度</p>  
        <p type="p">218a:側壁表面</p>  
        <p type="p">219a:底表面</p>  
        <p type="p">226a:虛設特徵</p>  
        <p type="p">226b:實作TSV</p>  
        <p type="p">228:金屬墊</p>  
        <p type="p">230:圖案化遮罩層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="960" publication-number="202610956"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610956.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610956</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116915</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化鋁燒結體、氧化鋁燒結體之製造方法、構件及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C04B35/111</main-classification>  
        <further-classification edition="200601120251201B">C04B41/87</further-classification>  
        <further-classification edition="200601120251201B">C23C14/08</further-classification>  
        <further-classification edition="200601120251201B">C23C14/24</further-classification>  
        <further-classification edition="200601120251201B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商翼真空理研股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUBASA SCIENCE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松村瑠衣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMURA, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木原直人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIHARA, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川修平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石田虎太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHITA, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊浩司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川道夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, MICHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田英一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, EIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種形成於氧化鋁燒結體之表面上之釔質保護膜之耐發塵性優異的氧化鋁燒結體。 &lt;br/&gt;本發明之氧化鋁燒結體之至少1個表面上之孔之個數為12,000個/mm&lt;sup&gt;2&lt;/sup&gt;以下，開口孔隙率較佳為0.30%以下，純度較佳為99.20質量%以上，彎曲強度較佳為320 MPa以上，密度較佳為3.80 g/cm&lt;sup&gt;3&lt;/sup&gt;以上，上述孔之最大直徑較佳為15.00 μm以下，上述孔之最大深度較佳為15.00 μm以下，上述表面上之上述孔之面積率較佳為5.000%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:釔質保護膜</p>  
        <p type="p">5:基材</p>  
        <p type="p">5a:成膜面</p>  
        <p type="p">6:構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="961" publication-number="202611282"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611282.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611282</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116933</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>助焊劑用清潔劑組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C11D7/32</main-classification>  
        <further-classification edition="200601120251201B">C11D7/36</further-classification>  
        <further-classification edition="200601120251201B">C11D7/50</further-classification>  
        <further-classification edition="200601120251201B">C23G1/00</further-classification>  
        <further-classification edition="200601120251201B">C23G5/032</further-classification>  
        <further-classification edition="200601120251201B">B08B3/08</further-classification>  
        <further-classification edition="200601120251201B">H05K3/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛池孝直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEIKE, TAKANAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長沼純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGANUMA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於一態樣中，本發明提供一種助焊劑用清潔劑及清潔方法，該助焊劑用清潔劑能夠於使用包含鉛之高熔點焊料而安裝之電子零件之清潔中，抑制鉛溶出至清潔劑。 &lt;br/&gt;於一態樣中，本發明係關於一種助焊劑用清潔劑組合物，其含有下述成分A、成分B及成分C。 &lt;br/&gt;成分A：有機溶劑 &lt;br/&gt;成分B：下述式(III)所表示之脂肪族三級胺 &lt;br/&gt;成分C：磷酸酯 &lt;br/&gt;&lt;img align="absmiddle" height="92px" width="155px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="962" publication-number="202611197"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611197.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611197</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116940</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>甲基丙烯酸甲酯之製造方法、組合物、聚合物、硬化物及成形體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08J11/12</main-classification>  
        <further-classification edition="200601120251201B">C08L33/12</further-classification>  
        <further-classification edition="200601120251201B">C07C67/333</further-classification>  
        <further-classification edition="200601120251201B">C07C67/56</further-classification>  
        <further-classification edition="200601120251201B">C07C69/54</further-classification>  
        <further-classification edition="200601120251201B">C08F20/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石原悠暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIHARA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>真鍋誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANABE, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種臭氣得到抑制之甲基丙烯酸甲酯之製造方法、組合物、聚合物、硬化物及成形體。 &lt;br/&gt;本發明之甲基丙烯酸甲酯之製造方法包括使含有甲基丙烯酸甲酯及臭氣成分之組合物與吸附劑接觸之工序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="963" publication-number="202610990"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610990.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610990</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116976</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物、阻劑圖型形成方法、化合物及酸擴散控制劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C69/63</main-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">C07D333/76</further-classification>  
        <further-classification edition="200601120251201B">C09K3/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蝦名昌徳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBINA, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明採用藉由曝光而產生酸，且藉由酸的作用而對於顯影液之溶解性發生變化之阻劑組成物，其含有：藉由酸的作用而對於顯影液之溶解性發生變化之基材成分、與式(d0)表示之化合物。式(d0)中，R&lt;sup&gt;d1&lt;/sup&gt;為烷基。k為2以上之整數。h為0以上之整數。R&lt;sup&gt;d0&lt;/sup&gt;為取代基。j為0以上之整數。但，5+2h≧j+k，h為0時，k為2~5之整數，h為1以上之整數時，k為2或3。m為1以上之整數，且M&lt;sup&gt;m+&lt;/sup&gt;表示m價有機陽離子。基於該阻劑組成物，於阻劑圖型形成時，達成高靈敏度化，並提升解像性及尺寸均勻性等微影特性。 &lt;br/&gt;&lt;img align="absmiddle" height="238px" width="328px" file="ed10117.JPG" alt="ed10117.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="964" publication-number="202612366"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612366.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612366</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117043</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>LP-WUS系統中基於LP-SS之RRM測量</chinese-title>  
        <english-title>RRM MEASUREMENT BASED ON LP-SS IN LP-WUS SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W24/10</main-classification>  
        <further-classification edition="200901120251201B">H04W52/02</further-classification>  
        <further-classification edition="200901120251201B">H04W36/00</further-classification>  
        <further-classification edition="202301120251201B">H04W72/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肯貝吉　納茲利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHAN BEIGI, NAZLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭榮佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, YOUNG WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MOON IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬汀　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTIN, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪鍾宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, JONGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫拉特　普拉仙納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERATH, PRASANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加西亞　維吉爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARCIA, VIRGILE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">無線傳輸/接收單元 (WTRU) 接收配置訊息，該訊息包含與第一胞元關聯的第一低功率同步訊號 (LP-SS) 序列和與第二胞元關聯的第二 LP-SS 序列。 WTRU 基於第一個 LP-SS 序列執行第一個無線電資源管理 (RRM) 測量，並基於第二個 LP-SS 序列執行第二個 RRM 測量。WTRU基於第一 RRM 測量小於第一臨界值且第二 RRM 測量大於第二臨界值而喚醒主無線電 (MR)。 MR 對同步訊號區塊 (SSB) 執行第三 RRM 測量，並基於第三 RRM 測量和胞元排序參數的第一集合確定第一胞元的第一胞元排序值，並基於第三 RRM測量和胞元排序參數的第一集合確定第二胞元的第二胞元排序值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless transmit/receive unit (WTRU) receives configuration information comprising a first low power synchronization signal (LP-SS) sequence associated with a first cell and a second LP-SS sequence associated with a second cell. The WTRU performs first radio resource management (RRM) measurements based on the first LP-SS sequence and second RRM measurements based on the second LP-SS sequence. The WTRU wakes up a main radio (MR) based the first RRM measurements being less than a first threshold value and the second RRM measurements being greater than a second threshold value. The MR performs third RRM measurements on a synchronization signal block (SSB) and determines a first cell ranking value of the first cell based on the third RRM measurements and a first set of cell ranking parameters and a second cell ranking value of the second cell based on the third RRM measurements and the first set of cell ranking parameters.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400、405、410、415、420、425、430、435、440、445、450、455、460、465:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="965" publication-number="202612291"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612291.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612291</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117157</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>近場通訊卡、近場通訊系統以及訊框延遲時間計算電路</chinese-title>  
        <english-title>NEAR FIELD COMMUNICATION CARD, NEAR FIELD COMMUNICATION SYSTEM AND FRAME DELAY TIME COUNTING CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250901B">H04B5/00</main-classification>  
        <further-classification edition="201801120250901B">H04W4/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JICHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種近場通訊(NFC)卡，其包括一訊框延遲時間(FDT)，其中FDT計算電路包括：一第一比較器，其經組配以比較包封電壓信號與一第一參考電壓且輸出一第一比較輸出信號；一第二比較器，其經組配以比較該包封電壓信號與一第二參考電壓且輸出一第二比較輸出信號；一FDT補償電路，其經組配以基於該第一比較輸出信號及該第二比較輸出信號而輸出一補償信號；以及一觸發產生電路，其經組配以基於該第一比較輸出信號及該補償信號而輸出觸發信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A near field communication (NFC) card includes a frame delay time (FDT), wherein the FDT counting circuit includes a first comparator configured to compare the envelope voltage signal with a first reference voltage and output a first comparison output signal, a second comparator configured to compare the envelope voltage signal with a second reference voltage and output a second comparison output signal, an FDT compensation circuit configured to output a compensation signal based on the first comparison output signal and the second comparison output signal, and a trigger generation circuit configured to output the trigger signal based on the first comparison output signal and the compensation signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:FDT計算電路</p>  
        <p type="p">210:比較電路</p>  
        <p type="p">220:觸發產生電路</p>  
        <p type="p">230:FDT補償電路</p>  
        <p type="p">240:參考電壓產生電路</p>  
        <p type="p">CLK_INT1,CLK_INT2:內部時脈信號</p>  
        <p type="p">CMO1:第一比較輸出信號</p>  
        <p type="p">CMO2:第二比較輸出信號</p>  
        <p type="p">CMP1:第一比較器</p>  
        <p type="p">CMP2:第二比較器</p>  
        <p type="p">COMP_OFFSET:補償信號</p>  
        <p type="p">TRIGER_RES:觸發信號</p>  
        <p type="p">VENV:包封電壓信號</p>  
        <p type="p">VREF1:第一參考電壓</p>  
        <p type="p">VREF2:第二參考電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="966" publication-number="202611962"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611962.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611962</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117184</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於線上半導體應用的帶電粒子束系統架構</chinese-title>  
        <english-title>ARCHITECTURE OF CHARGED PARTICLE BEAM SYSTEM FOR INLINE-SEMICONDUCTOR APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01J37/02</main-classification>  
        <further-classification edition="200601120251201B">H01J37/16</further-classification>  
        <further-classification edition="200601120251201B">H01J37/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司多重掃描電子顯微鏡有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS MULTISEM GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>列德雷　迪瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEIDLER, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛普史崔　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOOPSTRA, ERIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具備高穩定性的改良型晶圓檢測系統的架構包括一帶電粒子束柱和一晶圓載物台，該帶電粒子束柱和該晶圓載物台均安裝在真空腔體內的底板上。該帶電粒子束柱係藉由至少一個阻尼系統連接至底板，進而將振動干擾降至最低，即使在長時間測量的情況下也能獲得高精度的測量結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An improved architecture of wafer inspection system with high stability comprises a charged particle beam column and a wafer stage, both mounted to a baseplate in a vacuum enclosure. The charged particle beam column is attached to a baseplate via at least one damping system. Thereby, disturbances such as vibrations are reduced to a minimum and high precision measurements can be obtained even for long measurement times.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:帶電粒子束柱/帶電粒子束裝置</p>  
        <p type="p">2:操作控制單元</p>  
        <p type="p">6:檢測區</p>  
        <p type="p">8:晶圓</p>  
        <p type="p">16:載物台控制單元/載物台控制器</p>  
        <p type="p">19:控制單元</p>  
        <p type="p">21:第一位置測量系統</p>  
        <p type="p">21a:第二位置測量系統</p>  
        <p type="p">21b:第三位置測量系統</p>  
        <p type="p">23:主動控制系統</p>  
        <p type="p">25:框架</p>  
        <p type="p">27:雷射束</p>  
        <p type="p">27a:第一雷射束</p>  
        <p type="p">27b:第二雷射束</p>  
        <p type="p">36:視線</p>  
        <p type="p">40:帶電粒子束成像系統</p>  
        <p type="p">61:支撐櫃</p>  
        <p type="p">63:可撓式波紋管/軟性波紋管</p>  
        <p type="p">151:晶圓吸盤</p>  
        <p type="p">155:晶圓載物台</p>  
        <p type="p">801:廠房地板/地板</p>  
        <p type="p">803:真空腔體</p>  
        <p type="p">805:真空泵</p>  
        <p type="p">807:底板</p>  
        <p type="p">809:支撐底座</p>  
        <p type="p">813:阻尼系統/軟性或主動式安裝系統</p>  
        <p type="p">813a:第一主動式安裝基座</p>  
        <p type="p">813b:第二主動式安裝基座</p>  
        <p type="p">815:剛性安裝基座</p>  
        <p type="p">821:真空波紋管/可撓式真空密封波紋管</p>  
        <p type="p">825:框架突起</p>  
        <p type="p">827:系統水平面</p>  
        <p type="p">831:安裝基座/地板安裝基座/被動式基座</p>  
        <p type="p">851:計量框架</p>  
        <p type="p">871:第二阻尼或主動式安裝系統/第二主動式安裝系統</p>  
        <p type="p">1000:晶圓檢測系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="967" publication-number="202612268"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612268.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612268</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117237</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>彈性波元件</chinese-title>  
        <english-title>ELASTIC-WAVE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H03H9/64</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商索泰克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOITEC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米舒利耶　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICHOULIER, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴朗德拉　西爾萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALLANDRAS, SYLVAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉羅什　蒂埃里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAROCHE, THIERRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬克迪西　東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKDISSY, TONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳絲倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭建中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種彈性波元件，屬於電信等領域基於彈性波的組件領域。本發明所請彈性波元件包括第一電機機械元件(尤其是換能器3)和第二電機機械元件(尤其是換能器5)、由至少一個電極組成之陣列，該陣列位於第一換能器3和第二換能器5之間，沿彈性波的傳播方向排列，該陣列中的至少一個電極經由一可調阻抗1003、2003、3003而連接至一預定電位1005、2005、3005，以及用於調節該可調阻抗1003、2003、3003之一控制裝置1007、2007、300。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to an elastic-wave device in the field of elastic wave-based components for fields such as telecommunications. The device according to the invention comprises a first electromechanical device, in particular a transducer 3, and a second electromechanical device, in particular a transducer 5, an array of at least one electrode 4000 located between the first transducer 3 and the second transducer 5 in the propagation direction of the elastic waves, at least one electrode of the array being connected to a predetermined electric potential 1005, 2005, 3005 via a modifiable impedance 1003, 2003, 3003, and a control means 1007, 2007, 3007 for modifying the modifiable impedance 1003, 2003, 3003.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:第一電機機械元件/第一換能器</p>  
        <p type="p">5:第二電機機械元件/第二換能器</p>  
        <p type="p">9:壓電底材</p>  
        <p type="p">11:壓電層</p>  
        <p type="p">13:介電層</p>  
        <p type="p">15:基底底材</p>  
        <p type="p">17,19:空間</p>  
        <p type="p">31,33,51,53:指叉電極梳</p>  
        <p type="p">100:彈性波元件</p>  
        <p type="p">301,501,1005,2005,3005:預定電位</p>  
        <p type="p">303:輸入負載</p>  
        <p type="p">311,313,315,331,333,335,511,513,515,531,533,535,1000,2000,3000:電極</p>  
        <p type="p">503:輸出負載</p>  
        <p type="p">1001,2001,3001:直條端部</p>  
        <p type="p">1003,2003,3003:可調阻抗</p>  
        <p type="p">1007,2007,3007:控制裝置</p>  
        <p type="p">4000:電極陣列</p>  
        <p type="p">a:寬度</p>  
        <p type="p">d&lt;sub&gt;1&lt;/sub&gt;,d&lt;sub&gt;2&lt;/sub&gt;:距離</p>  
        <p type="p">l:長度</p>  
        <p type="p">p:間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="968" publication-number="202611097"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611097.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611097</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117257</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、預浸體、覆銅積層板及層間絕緣膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F2/44</main-classification>  
        <further-classification edition="200601120251201B">C08F212/34</further-classification>  
        <further-classification edition="200601120251201B">C08F290/06</further-classification>  
        <further-classification edition="200601120251201B">C08F290/12</further-classification>  
        <further-classification edition="200601120251201B">C08F299/00</further-classification>  
        <further-classification edition="200601120251201B">C08J5/24</further-classification>  
        <further-classification edition="200601120251201B">B32B15/08</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里中絵里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATONAKA, ERI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亀山洸瑠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMEYAMA, TAKERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤冨晋太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITOMI, SHINTAROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山洋一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, YOUICHIROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石村俊貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIMURA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下奈津子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, NATSUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹下聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANGE, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種樹脂組成物，含有：聚合物（A），具有乙烯性不飽和雙鍵，並且重量平均分子量（Mw）為1,500以上且500,000以下；以及化合物（B），具有兩個以上的下述式（Y）所表示的基，滿足條件（α1）、條件（α2）及條件（α3）；式（Y）中，R&lt;sup&gt;31&lt;/sup&gt;表示氫原子或者碳數1～5的烷基，*表示與化合物（B）中的其他部分的鍵結部位；（α1）分子量為1,000以下；（α2）25℃下的於甲苯中的溶解度為20質量%以上；（α3）藉由示差熱-熱重量同時分析（TG/DTA）的1%重量減少溫度超過130℃。&lt;img align="absmiddle" height="124px" width="231px" file="ed10099.JPG" alt="ed10099.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="969" publication-number="202611529"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611529.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611529</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117286</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有背側金屬晶粒損壞環的半導體結構以及其製造及測試方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURES HAVING BACKSIDE METAL DIE DAMAGE RINGS AND METHODS FOR MANUFACTURING AND TESTING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251110B">G01R31/26</main-classification>  
        <further-classification edition="200601120251110B">H01L21/66</further-classification>  
        <further-classification edition="200601120251110B">H01L21/768</further-classification>  
        <further-classification edition="200601120251110B">H01L23/522</further-classification>  
        <further-classification edition="200601120251110B">H01L23/535</further-classification>  
        <further-classification edition="202501120251110B">H10D62/13</further-classification>  
        <further-classification edition="202501120251110B">H10D64/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹晴堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHAN, CING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江宗育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, TSUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉啟瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHI-RUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供半導體結構及用於製造及測試半導體結構的方法。半導體結構包括：積體電路，形成於半導體基板中；密封環，位於半導體基板的至少第一側上且圍繞積體電路的周邊；輸入組件；輸出組件；及背側金屬晶粒損壞環(backside metal die damage ring，BMDDR)，設置於半導體基板的第一側上，延伸穿過半導體基板，且設置於半導體基板的第二側上，BMDDR設置於積體電路與密封環之間，BMDDR至少部分地圍繞積體電路的周邊，BMDDR耦接至輸入組件及輸出組件且在輸入組件及輸出組件之間形成電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor structures and methods for manufacturing and testing semiconductor structures are provided. The semiconductor structures include an integrated circuit formed in a semiconductor substrate, a seal ring on at least a first side of the semiconductor substrate and surrounding a perimeter of the integrated circuit, an input element, an output element, and a backside metal die damage ring (BMDDR) disposed on the first side of the semiconductor substrate, extending through the semiconductor substrate, and disposed on a second side of the semiconductor substrate, the BMDDR disposed between the integrated circuit and the seal ring, the BMDDR at least partially surrounding the perimeter of the integrated circuit, the BMDDR coupled to and forming an electrical circuit between the input element and the output element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體結構</p>  
        <p type="p">102:半導體基板</p>  
        <p type="p">110:前側</p>  
        <p type="p">112:背側</p>  
        <p type="p">114:積體電路</p>  
        <p type="p">116:密封環</p>  
        <p type="p">120:BMDDR</p>  
        <p type="p">122:輸入組件</p>  
        <p type="p">124:輸出組件</p>  
        <p type="p">126:第一互連介電性結構</p>  
        <p type="p">128:第二互連介電性結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="970" publication-number="202612162"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612162.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612162</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117299</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固態氧化物電池互連件及其藉由鑄造之製造方法</chinese-title>  
        <english-title>SOLID OXIDE CELL INTERCONNECTS AND METHODS OF MAKING THEREOF BY CASTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251201B">H01M8/021</main-classification>  
        <further-classification edition="200601120251201B">C22C37/06</further-classification>  
        <further-classification edition="200601120251201B">C22C37/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商博隆能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOOM ENERGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧爾塔　格拉　羅德里戈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORTA-GUERRA, RODRIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿夏瑞　阿第爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHARY, ADIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楚卡　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETRUCHA, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於電化學堆疊之鑄鐵或鐵鉻合金互連件包含空氣側及相對燃料側、位於該燃料側且包含藉由燃料肋隔開之燃料通道之燃料流場以及位於該空氣側且包含藉由空氣肋隔開之空氣通道之空氣流場。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cast iron or an iron chromium alloy interconnect for an electrochemical stack includes an air side and an opposing fuel side, a fuel flow field located on the fuel side and including fuel channels separated by fuel ribs, and an air flow field located on the air side including air channels separated by air ribs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:模具</p>  
        <p type="p">610:下模</p>  
        <p type="p">612:空腔</p>  
        <p type="p">614:溢流通道</p>  
        <p type="p">620:上模</p>  
        <p type="p">622:檯面結構或沖頭</p>  
        <p type="p">624:開口</p>  
        <p type="p">630:熔融金屬儲槽</p>  
        <p type="p">D:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="971" publication-number="202611531"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611531.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611531</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117300</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測試電子元件的處理機</chinese-title>  
        <english-title>HANDLER FOR TESTING ELECTRONIC COMPONENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">G01R31/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商泰克元股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅閏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, YUN SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示用於測試電子元件的處理機。&lt;br/&gt; 本發明的用於測試電子元件的處理機具有在內部收容除了裝卸區以外的重新配置區、連接區及移動區的密封腔。&lt;br/&gt; 依據本發明，能嚴格控制測試空間的空氣品質而得以防止異物所引起的半導體元件損傷或測試錯誤。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:密封腔</p>  
        <p type="p">910:突出部位</p>  
        <p type="p">911:開放孔</p>  
        <p type="p">X:軸</p>  
        <p type="p">Y:軸</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="972" publication-number="202612032"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612032.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612032</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117302</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合裝置及控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/52</main-classification>  
        <further-classification edition="200601120251210B">H01L21/60</further-classification>  
        <further-classification edition="200601120251210B">H05K13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>窪田雅大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本村耕治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTOMURA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱平大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAHIRA, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種可以提高實現零件的適當移交的可能性之接合裝置。&lt;br/&gt; [解決手段]接合裝置即零件組裝裝置1具備：拾取單元14，是以非接觸方式拾取晶片6a的拾取單元，包含：拾取管嘴14a，具有用於吸引晶片6a的吸引孔14c；及振動器，為了從拾取管嘴14a使音波產生而使拾取管嘴14a振動，前述拾取單元14輸出與拾取管嘴14a的振動因應之檢測訊號；零件組裝管嘴20a，構成為從拾取單元14接收晶片6a，且將晶片6a接合於其他零件；及控制部101，依據檢測訊號，控制零件組裝管嘴20a。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6a:晶片(零件)</p>  
        <p type="p">6b:黏著片材</p>  
        <p type="p">12:Y軸驅動機構</p>  
        <p type="p">13:零件組裝部</p>  
        <p type="p">14:拾取單元</p>  
        <p type="p">14a:拾取管嘴(管嘴)</p>  
        <p type="p">14b:開口</p>  
        <p type="p">14c:吸引孔</p>  
        <p type="p">15:零件保持部</p>  
        <p type="p">15b:旋轉移動機構</p>  
        <p type="p">20a:零件組裝管嘴</p>  
        <p type="p">33:支撐構件</p>  
        <p type="p">34:頂推部</p>  
        <p type="p">34a:頂推銷</p>  
        <p type="p">100:拾取系統</p>  
        <p type="p">101:控制部</p>  
        <p type="p">152a:超音波產生部(振動器)</p>  
        <p type="p">152b:超音波角柄</p>  
        <p type="p">152c:吸引路徑</p>  
        <p type="p">153:負壓產生部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="973" publication-number="202610966"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610966.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610966</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117310</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物及化合物之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C2/64</main-classification>  
        <further-classification edition="200601120251201B">C07C13/19</further-classification>  
        <further-classification edition="200601120251201B">C07C13/567</further-classification>  
        <further-classification edition="200601120251201B">C07C17/266</further-classification>  
        <further-classification edition="200601120251201B">C07C25/24</further-classification>  
        <further-classification edition="200601120251201B">C07D495/04</further-classification>  
        <further-classification edition="200601120251201B">C08G61/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亀山洸瑠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMEYAMA, TAKERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤冨晋太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITOMI, SHINTAROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山洋一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, YOUICHIROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種化合物，由式（1A）、式（1B）、式（2-1）或式（2-2）表示。式中的各取代基的說明示於說明書中。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="715px" width="583px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="974" publication-number="202612027"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612027.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612027</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>掩模與支撐部的連接體及其製造方法</chinese-title>  
        <english-title>MASK-SUPPORT ASSEMBLY AND PRODUCING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/326</main-classification>  
        <further-classification edition="200601120251201B">H01L21/324</further-classification>  
        <further-classification edition="200601120251201B">H01L21/306</further-classification>  
        <further-classification edition="202301120251201B">H10K50/10</further-classification>  
        <further-classification edition="202301120251201B">H10K71/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商奧魯姆材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLUM MATERIAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張澤龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, TAEK YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及掩模與支撐部的連接體及其製造方法。根據本發明的掩模與支撐部的連接體，用於半導體晶圓上的OLED圖元形成工藝，包括：支撐部，其包括邊緣部和柵格部；掩模，其連接在所述支撐部上且包括形成有掩模圖案的多個單元部，所述支撐部的下部進一步形成有防變形部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10：10-3:連接體</p>  
        <p type="p">20:掩模</p>  
        <p type="p">30:支撐部</p>  
        <p type="p">31:邊緣部</p>  
        <p type="p">35:第二柵格部</p>  
        <p type="p">37:段差</p>  
        <p type="p">37a:下部面</p>  
        <p type="p">37b:側面</p>  
        <p type="p">40:連接部</p>  
        <p type="p">50:防變形部</p>  
        <p type="p">51:邊緣防變形部</p>  
        <p type="p">T3,T4:厚度</p>  
        <p type="p">TR:溝槽部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="975" publication-number="202611359"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611359.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611359</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面處理劑組成物、以及撥水撥油性纖維製品及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">D06M13/395</main-classification>  
        <further-classification edition="200601120251201B">D06M15/643</further-classification>  
        <further-classification edition="200601120251201B">C09K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日華化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NICCA CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>定圭一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SADA, KEIICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田高輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, KOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種表面處理劑組成物、以及撥水撥油性纖維製品及其製造方法；前述表面處理劑組成物，係使用聚矽氧系化合物，並兼顧耐久撥水性與耐剝離性。一態樣中，係提供一種表面處理劑組成物，其係含有：聚矽氧樹脂（A）、及含有甲醇基之有機聚矽氧烷（B）；前述聚矽氧樹脂（A），係含有選自MQ、MDQ、MTQ及MDTQ｛M、D、T及Q，各自表示(R’’)&lt;sub&gt;3&lt;/sub&gt;SiO&lt;sub&gt;0.5&lt;/sub&gt;單元、(R’’)&lt;sub&gt;2&lt;/sub&gt;SiO單元、R’’SiO&lt;sub&gt;1.5&lt;/sub&gt;單元及SiO&lt;sub&gt;2&lt;/sub&gt;單元；R’’係表示碳數1～10之一價脂肪族烴基、或碳數6～15之一價芳香族烴基。｝中一種以上作為構成成分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="976" publication-number="202611138"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611138.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611138</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117355</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性組成物、硬化物、光學構件及微透鏡之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F228/02</main-classification>  
        <further-classification edition="200601120251201B">C08F265/04</further-classification>  
        <further-classification edition="200601120251201B">C08F4/00</further-classification>  
        <further-classification edition="200601120251201B">C08K3/22</further-classification>  
        <further-classification edition="200601120251201B">C08L51/06</further-classification>  
        <further-classification edition="200601120251201B">G02B1/04</further-classification>  
        <further-classification edition="200601120251201B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部鉄平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TEPPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種硬化性組成物，其含有：粒子A，包含選自TiO&lt;sub&gt;2&lt;/sub&gt;粒子及ZrO&lt;sub&gt;2&lt;/sub&gt;粒子中的至少1種；樹脂；聚合性單體；及光聚合起始劑，聚合性單體包含選自式（1）～（4）所表示之化合物中的至少1種化合物m1。使用了前述硬化性組成物之硬化物、光學構件及微透鏡之製造方法。&lt;br/&gt;&lt;img align="absmiddle" height="167px" width="560px" file="ed10044.JPG" alt="ed10044.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="977" publication-number="202610833"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610833.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610833</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117367</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脫模膜及燃料電池之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B27/00</main-classification>  
        <further-classification edition="200601120251201B">B32B27/32</further-classification>  
        <further-classification edition="200601120251201B">B32B27/36</further-classification>  
        <further-classification edition="200601120251201B">C08F232/08</further-classification>  
        <further-classification edition="202001120251201B">C08J7/043</further-classification>  
        <further-classification edition="201601120251201B">H01M8/10</further-classification>  
        <further-classification edition="201601120251201B">H01M8/1004</further-classification>  
        <further-classification edition="201601120251201B">H01M8/1067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大賽璐股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAICEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商寶理塑料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLYPLASTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中遼太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, RYOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村協</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, KANAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮城雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAGI, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多田智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TADA, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下杉翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOSUGI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種脫模膜，其具備基材層、及積層於該基材層之至少一面之脫模層，上述脫模層之表面自由能為35 mN/m以下，且上述脫模層包含於150℃以上350℃以下之範圍內具有1個以上之藉由黏彈性測定得到之玻璃轉移溫度之樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="978" publication-number="202610794"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610794.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610794</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117378</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶棒截斷機及其支撐裝置</chinese-title>  
        <english-title>INGOT CROPPING MACHINE AND SUPPORTING DEVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250526B">B28D7/04</main-classification>  
        <further-classification edition="200601120250526B">B28D5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海新昇半導體科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZING SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海新昇晶睿半導體科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZING JR SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬成斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, CHENGBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬靜如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶棒截斷機及其支撐裝置，該支撐裝置包括：一個或者多個支撐件，所述支撐件用於承載晶棒；驅動組件，用於驅動所述一個或者多個支撐件升降，以使所述一個或者多個支撐件中的每一個所述支撐件的高度與其所承載的晶棒部位的直徑相適應。本發明可以使得晶棒在被截斷後不會產生位移，被截下的晶段不會與相鄰的晶段發生碰撞，避免了崩邊、裂紋的產生，提高了產品的良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides an ingot cropping machine and a supporting device thereof. The supporting device comprises: one or more supporting members for bearing the ingot, a driving component for driving the supporting member up and down, causing each supporting member fitting to the diameter of the supported part of the ingot. Accordingly, the displacement of the crystal ingot after cropping can be avoided. The cropped block does not collide with the adjacent crystal segment, such that chipping and cracks can be prevented and the product yield can be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">121:支撐件</p>  
        <p type="p">1211:通孔</p>  
        <p type="p">122:彈性接觸頭</p>  
        <p type="p">123:螺紋件</p>  
        <p type="p">130:限位件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="979" publication-number="202612041"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612041.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612041</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117382</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>標準片及其製作方法、半導體材料缺陷校正方法及量測設備的校正方法</chinese-title>  
        <english-title>STANDARD WAFER AND PREPARATION THEREOF, CORRECTION METHOD OF SEMICONDUCTOR MATERIAL DEFECTS AND CORRECTION METHOD OF MEASUREMENT APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250613B">H01L21/66</main-classification>  
        <further-classification edition="200601120250613B">H01L21/322</further-classification>  
        <further-classification edition="200601120250613B">G01N21/93</further-classification>  
        <further-classification edition="200601120250613B">G01N21/41</further-classification>  
        <further-classification edition="200601120250613B">G01N21/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海新昇半導體科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZING SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聞瀾霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, LANLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, TIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章玲然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LINGRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬靜如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了標準片及其製作方法、半導體材料缺陷校正方法及量測設備的校正方法，屬於半導體領域。該半導體材料缺陷校正方法包括提供一標準片，獲取每一種尺寸的標準顆粒對應的散射信號強度，以建立散射信號強度與顆粒尺寸的函數關係。獲取半導體材料的缺陷顆粒的散射信號強度，基於函數關係，獲取缺陷顆粒的修正尺寸。獲取半導體材料缺陷顆粒的目標尺寸。本發明通過製作具有標準顆粒的標準片，然後建立散射信號強度與顆粒尺寸的函數關係。最後，通過獲取半導體材料缺陷顆粒的散射信號強度，並基於函數關係，以獲取缺陷顆粒的修正尺寸。從而能夠將目標尺寸與修正尺寸進行對比校正，提高了缺陷檢測的準確度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a standard wafer and a preparation method thereof, a correction method of semiconductor material defects and a correction method of measurement apparatus, belonging to semiconductor field. The correction method of semiconductor material defects comprises providing a standard wafer, obtaining a scattering signal intensity corresponding to each size of standard particles, and establishing a functional relationship between the scattered signal intensity and the particle size; obtaining a scattering signal intensity corresponding to a defect particle of the semiconductor material, and obtaining an amended size of the defect particle based on functional relationship; obtaining a target size of the defect particle. In the present application, the standard wafer having standard particles is prepared, and the functional relationship between the scattered signal intensity and the particle size is established. The scattering signal intensity of the defect particles is obtained, then the corrected size of the defect particle can be obtained based on the functional relationship, and the target size and the corrected size can be compared for correction, so that the accuracy of the defect detection can be increased.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11、S12、S13、S14:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="980" publication-number="202611068"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611068.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611068</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117393</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>頭頸部異位性皮膚炎的治療</chinese-title>  
        <english-title>TREATMENT OF HEAD AND NECK ATOPIC DERMATITIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/18</main-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商凱麥博有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYMAB LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾尼高　夏洛特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERNIGAUD, CHARLOTTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴恩基維奇　娜塔莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYNKIEWICZ, NATALIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格雷　科里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRAY, CORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉哈維　卡西姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAHAWI, KASSIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了使用抗OX40L抗體或其抗原結合片段來治療有需要的受試者的頭頸部異位性皮膚炎（AD）之方法。本揭露提供了使用抗OX40L抗體或其抗原結合片段來治療有需要的受試者的以存在苔蘚化為特徵的AD之方法。本揭露提供了使用抗OX40L抗體或其抗原結合片段來治療有需要的受試者的苔蘚化之方法。本揭露還提供了包含藥物配製物的容器和套組、以及該等藥物配製物在治療或預防有需要的受試者的頭頸部AD、與苔蘚化相關的AD、或苔蘚化中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods of treating head and neck atopic dermatitis (AD) in a subject in need thereof using an anti-OX40L antibody or antigen-binding fragment thereof. The present disclosure provides methods of treating AD characterized by the presence of lichenification in a subject in need thereof using an anti-OX40L antibody or antigen-binding fragment thereof. The present disclosure provides methods of treating lichenification in a subject in need thereof using an anti-OX40L antibody or antigen-binding fragment thereof. The present disclosure also provides containers and kits comprising pharmaceutical formulations and the use of these pharmaceutical formulations in treating or preventing head and neck AD, AD associated with lichenification, or lichenification in a subject in need thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="981" publication-number="202610643"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610643.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610643</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>RXFP1受體促效劑</chinese-title>  
        <english-title>RXFP1 RECEPTOR AGONISTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/535</main-classification>  
        <further-classification edition="200601120251201B">A61K31/506</further-classification>  
        <further-classification edition="200601120251201B">A61K31/44</further-classification>  
        <further-classification edition="200601120251201B">A61K31/428</further-classification>  
        <further-classification edition="200601120251201B">A61K31/357</further-classification>  
        <further-classification edition="200601120251201B">A61K31/35</further-classification>  
        <further-classification edition="200601120251201B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德森　艾霖　丹尼愛爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDERSON, ERIN DANIELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲爾茲　陶德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIELDS, TODD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛林　歐頓　羅絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLYNN, AUTUMN ROSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海爾　梅根　麥肯尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HALL, MEGAN MCKENNEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉瑪　傑森　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAMAR, JASON ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥菲汀　伊莉莎白　安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCFADDIN, ELIZABETH ANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅寇夫　安德魯　特倫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METCALF, ANDREW TERRANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供下式化合物， &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="215px" file="ed10515.JPG" alt="ed10515.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中R&lt;sub&gt;a&lt;/sub&gt;及R&lt;sub&gt;b&lt;/sub&gt;如本文所闡述，其醫藥上可接受之鹽及使用該等化合物及其醫藥上可接受之鹽治療患者之心血管、肺及/或腎病狀、疾病及/或病症之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides compounds of the formula: &lt;br/&gt;&lt;img align="absmiddle" height="179px" width="223px" file="ed10516.JPG" alt="ed10516.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein R&lt;sub&gt;a &lt;/sub&gt;and R&lt;sub&gt;b&lt;/sub&gt; are as described herein, pharmaceutically acceptable salts thereof, and methods of using these compounds and pharmaceutically acceptable salts thereof for treating patients for cardiovascular, pulmonary and/or renal conditions, diseases and/or disorders.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="982" publication-number="202610719"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610719.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610719</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117467</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膠束締合的ＰＦＡＳ分子的基於膜的分離</chinese-title>  
        <english-title>MEMBRANE-BASED SEPARATION OF MICELLE-ASSOCIATED PFAS MOLECULES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B01D61/02</main-classification>  
        <further-classification edition="200601120251201B">B01D61/14</further-classification>  
        <further-classification edition="200601120251201B">B01D61/24</further-classification>  
        <further-classification edition="200601120251201B">B01D61/38</further-classification>  
        <further-classification edition="200601120251201B">B01D61/58</further-classification>  
        <further-classification edition="200601120251201B">B01D71/36</further-classification>  
        <further-classification edition="200601120251201B">B03D1/02</further-classification>  
        <further-classification edition="202301120251201B">C02F1/20</further-classification>  
        <further-classification edition="202301120251201B">C02F1/24</further-classification>  
        <further-classification edition="202301120251201B">C02F1/44</further-classification>  
        <further-classification edition="200601320251201B">C02F101/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商格雷迪安特公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRADIANT CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後補　後補</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後補　後補</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAY, MING FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後補　後補</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KENG, WAI REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林蘭君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之某些方面關於與去除PFAS分子相關的系統和方法。在一方面，總體上描述了包括膜分離器和泡沫分餾分離器的系統。在一些實施方式中，該膜分離器和該泡沫分餾分離器流體連接，使得包含PFAS分子、表面活性劑和液體的進料和/或包含PFAS分子和液體的泡沫分餾分離器輸入的一些或全部可以由該膜分離器和/或該泡沫分餾分離器加工。在一些實施方式中，將該PFAS分子的至少一部分從該進料和/或該泡沫分餾分離器輸入中去除。在一些實施方式中，存在該表面活性劑使得該PFAS分子中的一些或全部與膠束締合，這可以促進從該進料和/或該泡沫分餾分離器輸入中去除該PFAS分子。在一些實施方式中，該膜分離器在比某些溶解離子更大程度上截留PFAS分子（例如，與膠束締合）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Certain aspects of the present disclosure are related to systems and methods related to the removal of PFAS molecules. In one aspect, systems comprising a membrane separator and a foam fractionation separator are generally described. In some embodiments, the membrane separator and the foam fractionation separator are fluidically connected such that some or all of a feed comprising PFAS molecules, a surfactant, and a liquid and/or a foam fractionation separator input comprising PFAS molecules and a liquid can be processed by the membrane separator and/or the foam fractionation separator. In some embodiments, at least a portion of the PFAS molecules are removed from the feed and/or the foam fractionation separator input. In some embodiments, the surfactant is present such that some or all of the PFAS molecules are associated with micelles, which may facilitate the removal of the PFAS molecules from the feed and/or the foam fractionation separator input. In some embodiments, the membrane separator rejects PFAS molecules (e.g., associated with micelles) to a greater extent than certain dissolved ions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">105:進料</p>  
        <p type="p">110:膜分離器</p>  
        <p type="p">115:截留物側</p>  
        <p type="p">120:滲透物側</p>  
        <p type="p">125:半滲透膜</p>  
        <p type="p">130:泡沫分餾分離器</p>  
        <p type="p">135:泡沫分餾分離器輸入</p>  
        <p type="p">140:泡沫分餾的回收物輸出</p>  
        <p type="p">145:膜分離器滲透物輸出</p>  
        <p type="p">150:泡沫分餾的產物輸出</p>  
        <p type="p">155:膜分離器截留物輸出</p>  
        <p type="p">160:膜分離器截留物輸入</p>  
        <p type="p">165:入口</p>  
        <p type="p">170B:出口</p>  
        <p type="p">170A:出口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="983" publication-number="202611075"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611075.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611075</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117486</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以雙特異性BCMAxCD3抗體治療輕鏈類澱粉變性症之方法</chinese-title>  
        <english-title>METHODS OF TREATING LIGHT CHAIN AMYLOIDOSIS WITH BISPECIFIC BCMA X CD3 ANTIBODIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/28</main-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">A61P43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商再生元醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬杜里　烏梅舍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAUDHARI, UMESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用於治療輕鏈型澱粉樣變性症的方法。於某些實施例，本方法包含向有需要之個體投予結合至BCMA及CD3的雙特異性抗體或其抗原結合片段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods for treating light chain amyloidosis. In certain embodiments, the present methods comprise administering to a subject in need thereof bispecific antibodies or antigen-binding fragments thereof that bind to BCMA and CD3.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="984" publication-number="202610680"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610680.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610680</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117493</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋁佐劑奈米粒子、其製造方法及其用途</chinese-title>  
        <english-title>ALUMINUM ADJUVANT NANOPARTICLES, METHODS OF MANUFACTURE, AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K39/39</main-classification>  
        <further-classification edition="200601120251201B">A61K9/16</further-classification>  
        <further-classification edition="200601120251201B">A61K9/14</further-classification>  
        <further-classification edition="200601120251201B">A61K31/7088</further-classification>  
        <further-classification edition="202501120251201B">A61K9/127</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商輝瑞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFIZER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　佐爾坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BECK, ZOLTAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飛利浦　夏普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHILIP, SHIBU SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>師帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周雅婧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YAJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個態樣中，本揭露關於佐劑奈米粒子，該等奈米粒子包含鋁及/或CpG寡去氧核苷酸。在具體實施態樣中，該等奈米粒子具有小於約100 nm之平均尺寸。在本文中亦提供的係使用微流體裝置製造該等奈米粒子之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one aspect, the present disclosure relates to adjuvant nanoparticles comprising aluminum and/or CpG oligodeoxynucleotides. In particular embodiments, the nanoparticles have an average size of less than about 100 nm. Also provided herein are methods of making the nanoparticles using a microfluidic device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="985" publication-number="202612561"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612561.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612561</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117506</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子基板及其製造方法</chinese-title>  
        <english-title>ELECTRONIC SUBSTRATE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250526B">H10H29/39</main-classification>  
        <further-classification edition="202501120250526B">H10H29/49</further-classification>  
        <further-classification edition="202501120250526B">H10H29/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱哲丘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHU, JHE-CIOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許詠翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YUNG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭富元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, FU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王東榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TONG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露公開了一種電子基板及其製造方法。電子基板包括基板、電晶體、資料線以及導電元件。電晶體設置在基板上並包括主動層、源極、汲極以及設置在主動層上的閘極，其中主動層設置在源極以及汲極之間並與閘極重疊，且主動層、源極與汲極由同一半導體材料層所形成。資料線設置在基板上並電性連接電晶體。導電元件設置在資料線以及半導體材料層上並電性連接資料線以及源極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic substrate and a manufacturing method thereof are provided. The electronic substrate includes a substrate, a transistor, a data line, and a conductive element. The transistor is disposed on the substrate and includes an active layer, a source electrode, a drain electrode, and a gate electrode disposed on the active layer. The active layer is disposed between the source electrode and the drain electrode and overlaps the gate electrode, and the active layer, the source electrode, and the drain electrode are formed of a same semiconductor material layer. The data line is disposed on the substrate and electrically connected to the transistor. The conductive element is disposed on the data line and the semiconductor material layer and electrically connected to the data line and the source electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:導電元件</p>  
        <p type="p">AL:主動層</p>  
        <p type="p">CE:共用電極</p>  
        <p type="p">DE:汲極</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">GE:閘極</p>  
        <p type="p">IN1,IN11,IN12,IN2,IN21,IN22,IN3:絕緣層</p>  
        <p type="p">M1:第一金屬層</p>  
        <p type="p">M2:第二金屬層</p>  
        <p type="p">PE:像素電極</p>  
        <p type="p">S:狹縫</p>  
        <p type="p">SE:源極</p>  
        <p type="p">SEM:半導體材料層</p>  
        <p type="p">SP:遮光圖案</p>  
        <p type="p">Sub:基板</p>  
        <p type="p">T:電晶體</p>  
        <p type="p">TD:俯視方向</p>  
        <p type="p">TH1,TH2:穿孔</p>  
        <p type="p">TL1:透明導電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="986" publication-number="202611064"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611064.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611064</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117563</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>GIPR和GLP-1R共激動多肽及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K14/575</main-classification>  
        <further-classification edition="200601120251201B">A61K38/16</further-classification>  
        <further-classification edition="200601120251201B">A61P3/04</further-classification>  
        <further-classification edition="200601120251201B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商石藥集團百克（山東）生物製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CSPC BAIKE (SHANDONG) BIO-PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN-LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜甜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, TIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁雪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, XUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳海坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HAIKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱亞楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, YANAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊文寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WENNING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王衛國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEIGUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供GIPR和GLP-1R共激動多肽、或其藥學上可接受的鹽、醯胺或酯，以及上述多肽、鹽、醯胺或酯的用途，包含治療Ⅱ型糖尿病、肥胖或超重等。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="987" publication-number="202610682"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610682.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610682</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117588</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜脈內ＦＣＲＮ拮抗劑調配物及其使用方法</chinese-title>  
        <english-title>INTRAVENOUS FCRN ANTAGONIST FORMULATIONS AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K39/395</main-classification>  
        <further-classification edition="200601120251201B">A61K47/18</further-classification>  
        <further-classification edition="200601120251201B">A61K47/20</further-classification>  
        <further-classification edition="200601120251201B">A61K47/22</further-classification>  
        <further-classification edition="200601120251201B">A61K47/26</further-classification>  
        <further-classification edition="200601120251201B">A61K47/02</further-classification>  
        <further-classification edition="200601120251201B">A61K9/00</further-classification>  
        <further-classification edition="200601120251201B">A61P21/00</further-classification>  
        <further-classification edition="200601120251201B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商阿根思公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARGENX BV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑吉翁　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BORGIONS, FILIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德繆尼克　卡桑德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE MUYNCK, CASSANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩卡迪　埃莫克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SZAKADY, EMOKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯陶斯　希爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STALS, HILDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>努肯斯　珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOUKENS, JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉巴雷　邁克爾　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LABARRE, MICHAEL JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿哈　索菲娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGHA, SOFIANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供包含FcRn拮抗劑(例如，艾加莫德(efgartigimod)或其生物類似物型式)之醫藥組合物，及其用於降低有需要之個體(例如，患有諸如全身型重症肌無力(gMG)之自體免疫疾病的個體)之血清IgG含量的使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are pharmaceutical compositions comprising an FcRn antagonist (&lt;i&gt;e.g.&lt;/i&gt;, efgartigimod, or a biosimilar version thereof) and methods of use thereof for reducing the serum IgG level of a subject in need thereof (&lt;i&gt;e.g&lt;/i&gt;., a subject having an autoimmune disease such as generalized myasthenia gravis (gMG)).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="988" publication-number="202612504"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612504.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612504</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117604</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251106B">H10D30/60</main-classification>  
        <further-classification edition="202501120251106B">H10D62/10</further-classification>  
        <further-classification edition="202501120251106B">H10D64/20</further-classification>  
        <further-classification edition="202501120251106B">H10D88/00</further-classification>  
        <further-classification edition="200601120251106B">H01L21/205</further-classification>  
        <further-classification edition="200601120251106B">H01L21/76</further-classification>  
        <further-classification edition="200601120251106B">H01L21/324</further-classification>  
        <further-classification edition="200601120251106B">H01L21/302</further-classification>  
        <further-classification edition="201101120251106B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李苡宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何韋德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, WEI-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李清晏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHING YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在實施例中，一種方法包括在半導體基板上方形成多層堆疊；對多層堆疊及半導體基板進行圖案化以形成鰭片結構，鰭片結構包括交替的半導體奈米結構與虛設奈米結構，其中虛設奈米結構之最底虛設奈米結構具有第一厚度，其中虛設奈米結構中之第一虛設奈米結構設置在最底虛設奈米結構之上，且第一虛設奈米結構中之各者具有小於第一厚度的第二厚度；在鰭片結構中形成源極/汲極凹槽；在源極/汲極凹槽中蝕刻第一虛設奈米結構及最底虛設奈米結構之側壁以形成側壁凹槽；在第一虛設奈米結構及最底虛設奈米結構中的側壁凹槽中形成內部間隔物；及用閘極結構替換第一虛設奈米結構及最底虛設奈米結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an embodiment, a method includes forming a multi-layer stack over a semiconductor substrate, patterning the multi-layer stack and the semiconductor substrate to form a fin structure, the fin structure including alternating semiconductor nanostructures and dummy nanostructures, where a bottommost dummy nanostructure of the dummy nanostructures has a first thickness, where first dummy nanostructures of the dummy nanostructures are disposed above the bottommost dummy nanostructure, and each of the first dummy nanostructures has a second thickness that is smaller than the first thickness, forming source/drain recesses in the fin structure, etching sidewalls of the first dummy nanostructures and the bottommost dummy nanostructure in the source/drain recesses to form sidewall recesses, forming inner spacers in the sidewall recesses in the first dummy nanostructures and the bottommost dummy nanostructure, and replacing the first dummy nanostructures and the bottommost dummy nanostructure with a gate structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">66L:下部半導體奈米結構</p>  
        <p type="p">66U:上部半導體奈米結構</p>  
        <p type="p">108L:下部磊晶源極/汲極區</p>  
        <p type="p">108U:上部磊晶源極/汲極區</p>  
        <p type="p">132:閘極介電質</p>  
        <p type="p">134L:下部閘電極</p>  
        <p type="p">134U:上部閘電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="989" publication-number="202612392"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612392.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612392</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117653</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光源裝置</chinese-title>  
        <english-title>LIGHT SOURCE APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H05G2/00</main-classification>  
        <further-classification edition="200601120251210B">G03F7/00</further-classification>  
        <further-classification edition="200601120251210B">H01S3/00</further-classification>  
        <further-classification edition="200601120251210B">H01S3/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雷射科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASERTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>折井庸亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORII, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林田慧太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHIDA, KEITARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小市真樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOICHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種光源裝置，係能提高對靶材料照射的光線的穩定性。本發明為一種光源裝置100，係具備：靶保持部110，係藉由繞旋轉軸旋轉所為的離心力而於內壁面保持靶材料112；種子雷射器SL，係以根據藉由光放大器AM所放大的放大光L12的光線激發靶材料112；以及光開關SW或元件群EG，光開關SW係設於光放大器AM與靶材料112之間，元件群EG係設於光放大器AM與靶材料112之間且顯示非線性光學功效。光開關SW或元件群EG係抑制放大光L12中的預定臨限值以下的功率成分；靶材料112係藉由經抑制功率成分的光線產生電漿。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">112:靶材料</p>  
        <p type="p">AM:光放大器</p>  
        <p type="p">L0:光</p>  
        <p type="p">L11:種子光</p>  
        <p type="p">L12:放大光</p>  
        <p type="p">LE:EUV光</p>  
        <p type="p">LR:激發光</p>  
        <p type="p">LS:雷射器</p>  
        <p type="p">SL:種子雷射器</p>  
        <p type="p">SW:光開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="990" publication-number="202611049"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611049.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611049</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>補體因子B抑制劑</chinese-title>  
        <english-title>COMPLEMENT FACTOR B INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D495/10</main-classification>  
        <further-classification edition="200601120251201B">C07D517/10</further-classification>  
        <further-classification edition="200601120251201B">A61K31/438</further-classification>  
        <further-classification edition="200601120251201B">A61K31/095</further-classification>  
        <further-classification edition="200601120251201B">A61P27/02</further-classification>  
        <further-classification edition="200601120251201B">A61P9/00</further-classification>  
        <further-classification edition="200601120251201B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商禮邦醫藥(香港)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALEBUND PHARMACEUTICALS (HONG KONG) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒楚天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHU, CHUTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李加良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIALIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉志千</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZHIQIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉仁傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於能夠抑制補體替代路徑之化合物且尤其係關於因子B之抑制，及使用此等化合物治療或預防與補體替代路徑活化相關之疾病或病症的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to compounds capable of inhibiting the complement alternative pathway and particularly to inhibition of Factor B, and methods of using such compounds for treating or preventing diseases or disorders associated with complement alternative pathway activation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="991" publication-number="202612015"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612015.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612015</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塗布膜評價方法、塗布膜評價裝置及電腦程式</chinese-title>  
        <english-title>COATING FILM EVALUATION METHOD, COATING FILM EVALUATION DEVICE AND COMPUTER PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250908B">H01L21/306</main-classification>  
        <further-classification edition="200601120250908B">H01L21/66</further-classification>  
        <further-classification edition="200601120250908B">B05D3/00</further-classification>  
        <further-classification edition="200601120250908B">B05D1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安陪裕滋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村崇也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, TAKAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本悟史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, ITSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可基於所測量的膜厚分佈來適當地評價塗布膜的技術。邊緣切割寬度設定部（913）設定第一邊緣切割寬度及第二邊緣切割寬度。特徵量算出部（915）獲取膜厚分佈中的除第一邊緣切割寬度的邊緣區域的膜厚以外的分佈的第一特徵量、以及除第二邊緣切割寬度的邊緣區域的膜厚以外的分佈的第二特徵量。判定部（916）基於合格基準值，判定第一邊緣切割寬度的第一特徵量是否合格。成本值算出部（917）在由判定部（916）判定為不合格的情況下，對第一成本函數輸入第一特徵量，算出成本值。成本值算出部（917）在由判定部（916）判定為合格的情況下，對第二成本函數輸入第二特徵量，算出成本值。第二成本函數的輸出為第一成本函數的輸出以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">9:控制部(塗布膜評價裝置)</p>  
        <p type="p">81:泵</p>  
        <p type="p">91:處理器</p>  
        <p type="p">93:記憶體</p>  
        <p type="p">95:顯示器件</p>  
        <p type="p">97:輸入器件</p>  
        <p type="p">910:吐出控制部</p>  
        <p type="p">911:膜厚分佈獲取部</p>  
        <p type="p">913:邊緣切割寬度設定部</p>  
        <p type="p">915:特徵量算出部</p>  
        <p type="p">916:判定部</p>  
        <p type="p">917:成本值算出部</p>  
        <p type="p">919:最優化部</p>  
        <p type="p">931:電腦程式</p>  
        <p type="p">AP1:膜厚測量器</p>  
        <p type="p">M:記錄介質</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="992" publication-number="202611294"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611294.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611294</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117759</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於抑制ＧＰＲ７５基因表達的ＲＮＡｉ劑及其製備方法和用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251201B">C12N15/113</main-classification>  
        <further-classification edition="200601120251201B">A61K31/713</further-classification>  
        <further-classification edition="200601120251201B">A61K31/7115</further-classification>  
        <further-classification edition="200601120251201B">A61P3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳信立泰藥業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　俊軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JUNJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江文娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, WENJUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳霓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIANI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊立新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LIXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張煒極</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, WEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪一諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, YINUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李麗麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LILI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖瑛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸銀鎖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YINSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及用於抑制GPR75基因表達的RNAi劑及其製備方法和用途，所述RNAi劑可以抑制GPR75基因的表達，以治療GPR75基因相關疾病和病症，例如肥胖症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">：無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="993" publication-number="202611187"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611187.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611187</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117769</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>木質素的改性方法、改性木質素、其作為碳纖維前驅物的用途，以及由其獲得的碳纖維</chinese-title>  
        <english-title>PROCESS OF MODIFYING LIGNIN, MODIFIED LIGNIN, USES AS A PRECURSOR OF CARBON FIBERS AND CARBON FIBER OBTAINED THEREFROM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251201B">C08H7/00</main-classification>  
        <further-classification edition="200601120251201B">D01F9/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴西商克拉賓公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLABIN S.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里約熱內盧聯邦大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSIDADE FEDERAL DO RIO DE JANEIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷森德　加布里埃爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESENDE, GABRIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿澤維多　古斯塔沃　迪亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZEVEDO, GUSTAVO DIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡拉多　維羅妮卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALADO, VERONICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索阿雷斯　馬塞洛　科埃略　多斯桑托斯　穆蓋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOARES, MARCELO COELHO DOS SANTOS MUGUET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達席爾瓦　維尼修斯　費爾南德斯　努內斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DA SILVA, VINICIUS FERNANDES NUNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡書慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳嘉敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種木質素的改性方法，旨在提升該生物高分子的附加價值，重點在於透過其結構的化學改性來改善材料的熱性能與機械性能。該方法是使木質素與二羧酸（特別是丁二酸）在具鹼性特性的催化劑存在下發生反應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention refers to a method for the modifying lignin, to increase the added value of this biopolymer, highlighting the chemical modification of its structure in order to improve the thermal and mechanical properties of the material through the reaction with dicarbox-ylic acids, especially succinic acid, in the presence of a catalyst with alkaline characteristics.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="994" publication-number="202611037"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611037.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611037</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117772</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>替戈拉生富馬酸單乙酯、其製備方法、藥物組合物及用途</chinese-title>  
        <english-title>TEGOPRAZAN FUMARIC ACID MONOETHYL ESTER, PREPARATION METHOD THEREOF, PHARMACEUTICAL COMPOSITION THEREOF AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D405/12</main-classification>  
        <further-classification edition="200601120251201B">A61K31/404</further-classification>  
        <further-classification edition="200601120251201B">A61P1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海新禮泰藥業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI NEO-LEADING PHARMATECH CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>應述歡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, SHU-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏南飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, NAN-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪仙陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAN-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒寶勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, BAO-QIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉方國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, FANG-GUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王婷婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了替戈拉生富馬酸單乙酯、其製備方法、藥物組合物及用途。本發明提供的替戈拉富馬酸單乙酯，溶解度相對較好，穩定性好、藉由提高藥物的溶解度來增加藥物的生物利用率，適合於工業化生產，市場化前景佳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides tegoprazan fumaric acid monoethyl ester, a preparation method thereof, a pharmaceutical composition thereof, and uses thereof. The tegoprazan fumaric acid monoethyl ester provided by the present invention has relatively good solubility and excellent stability; it improves the bioavailability of the drug by enhancing the drug's solubility, is suitable for industrial production, and has broad market prospects.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="995" publication-number="202610729"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610729.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610729</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117784</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250609B">B05C5/02</main-classification>  
        <further-classification edition="200601120250609B">B05C11/00</further-classification>  
        <further-classification edition="200601120250609B">B05C13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村翔也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, SHOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基板處理裝置，在使基板浮起並沿規定的搬送方向搬送基板，並且，向所述基板的上表面供給抗蝕劑液等處理液的基板處理裝置中，以低成本且迅速地應對搬送方向上的基板尺寸的變更。在本發明中，上游浮起平台沿搬送方向排列有第一浮起板群組以及第二浮起板群組。在第一浮起板群組以及第二浮起板群組中，第二浮起板群組相對於第一浮起板群組為拆卸自如。例如，若第二浮起板群組與第一浮起板群組鄰接地設置，則能夠將在搬送方向上比較長的基板作為被處理基板進行處理。另一方面，若將第二浮起板群組從第一浮起板群組拆下，則能夠將在搬送方向上比較短的基板作為被處理基板進行處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:浮起平台部</p>  
        <p type="p">31:上游浮起平台</p>  
        <p type="p">32:塗佈平台</p>  
        <p type="p">33:下游浮起平台</p>  
        <p type="p">39:調整螺栓</p>  
        <p type="p">71:噴嘴</p>  
        <p type="p">311:第一浮起板群組</p>  
        <p type="p">312:第二浮起板群組</p>  
        <p type="p">313:第一浮起板</p>  
        <p type="p">314:第二浮起板</p>  
        <p type="p">371、372、373:支撐台</p>  
        <p type="p">381、382、384、385、386:框架部</p>  
        <p type="p">383:精密石</p>  
        <p type="p">B1:第一區塊</p>  
        <p type="p">B2:第二區塊</p>  
        <p type="p">Dt:搬送方向</p>  
        <p type="p">Lf:第二長度</p>  
        <p type="p">RC:塗佈支撐區域</p>  
        <p type="p">RD:下游支撐區域</p>  
        <p type="p">RU:上游支撐區域</p>  
        <p type="p">S:基板</p>  
        <p type="p">Sf:全尺寸基板</p>  
        <p type="p">W:寬度</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="996" publication-number="202611970"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611970.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611970</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117789</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＲＦ電力校正方法、基板處理方法及記錄媒體中儲存的程式</chinese-title>  
        <english-title>RF POWER CALIBRATION METHOD, SUBSTRATE PROCESSING METHOD AND PROGRAM RECORDING MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01J37/32</main-classification>  
        <further-classification edition="200601120251201B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＰＳＫ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金雅蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, A RAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金汎錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BEOM SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種對施加於電漿腔室內電漿的RF電力進行校正的方法。RF電力校正方法可包括如下步驟：根據線纜損失電力的測量值來算出與傳遞電力的大小相應的第1校正因子，並根據電力傳遞效率算出與傳遞電力的大小相應的第2校正因子；及利用上述第1校正因子及上述第2校正因子來算出校正工作表，該校正工作表包括電力供應部需根據上述傳遞電力大小而產生的設定電力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電力供應部</p>  
        <p type="p">20:匹配部</p>  
        <p type="p">30:電漿腔室</p>  
        <p type="p">40:控制器</p>  
        <p type="p">41:處理器</p>  
        <p type="p">42:記憶體</p>  
        <p type="p">50、60:RF線纜</p>  
        <p type="p">70:通訊線纜</p>  
        <p type="p">71:第1通訊線纜</p>  
        <p type="p">72:第2通訊線纜</p>  
        <p type="p">73:第3通訊線纜</p>  
        <p type="p">A:線纜損失的電力</p>  
        <p type="p">B:連接部位損失的電力</p>  
        <p type="p">GO、MO:輸出埠</p>  
        <p type="p">MI、PI:輸入埠</p>  
        <p type="p">PS:電力測量器</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="997" publication-number="202611971"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611971.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611971</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117804</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法、製造方法及基板處理設備</chinese-title>  
        <english-title>SUBSTRATE PROCESSING METHOD, MANUFACTURING METHOD AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01J37/32</main-classification>  
        <further-classification edition="200601120251201B">H01L21/683</further-classification>  
        <further-classification edition="200601120251201B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＰＳＫ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金雅蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, A RAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫鎭哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, JIN CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳炳旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, BYOUNG WOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金汎錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BEOM SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李致榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHI YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基板處理方法。基板處理方法可如下：向腔室所提供的處理空間供應處理氣體，RF電源施加RF電力而自上述處理氣體產生電漿； DC電源以在一個週期內在第1參數及與上述第1參數不同的第2參數之間轉換並施加的方式，即以脈動方式，向在上述處理空間產生磁場的磁線圈施加DC電力；且變更上述DC電力的工作比以調節上述電漿所包含的電子的溫度，其中上述工作比定義為上述第1參數在上述一個週期內所佔的比率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理設備</p>  
        <p type="p">10:腔室</p>  
        <p type="p">11:處理空間</p>  
        <p type="p">12:泵</p>  
        <p type="p">13:介電板</p>  
        <p type="p">14:腔室引線</p>  
        <p type="p">20:基板支撐部</p>  
        <p type="p">21:夾持電極</p>  
        <p type="p">23:夾持電源</p>  
        <p type="p">30:氣體供應部</p>  
        <p type="p">31:氣體供應源</p>  
        <p type="p">32:氣體供應管線</p>  
        <p type="p">40:電漿產生部</p>  
        <p type="p">41:高頻線圈</p>  
        <p type="p">42:第1電源(RF電源)</p>  
        <p type="p">43:匹配器</p>  
        <p type="p">50:磁場產生部</p>  
        <p type="p">51:上部磁線圈</p>  
        <p type="p">52:下部磁線圈</p>  
        <p type="p">53:第2電源(DC電源)</p>  
        <p type="p">60:控制器</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="998" publication-number="202611694"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611694.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611694</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117819</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>情境感知圖框插入</chinese-title>  
        <english-title>CONTEXT AWARE FRAME INSERTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F3/14</main-classification>  
        <further-classification edition="201601120251201B">G09G3/3208</further-classification>  
        <further-classification edition="201901120251201B">G06F1/32</further-classification>  
        <further-classification edition="202301120251201B">H10K59/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商谷歌有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOGLE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金炫哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNCHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫　千惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, CHIEN-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索羅門　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLOMON, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　仕通</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHIYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種實例方法包括：由一行動計算裝置之一系統單晶片(SoC)之一或多個處理器使一顯示驅動器積體電路(DDIC)在該行動計算裝置之一顯示器處顯示一第一圖框；由該一或多個處理器獲得指示該行動計算裝置之一當前狀態之一或多個情境參數之值；由該一或多個處理器基於該一或多個情境參數之該等值來判定在顯示該第一圖框之後將插入之圖框之一數量；及接著在顯示該第一圖框之後由該一或多個處理器使該DDIC在顯示該第一圖框之後且在顯示與該第一圖框不同之一後續圖框之前插入經判定的該數量之圖框。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example method includes: causing, by one or more processors of a system on a chip (SoC) of a mobile computing device, a display driver integrated circuit (DDIC) to display a first frame at a display of the mobile computing device; obtaining, by the one or more processors, values of one or more context parameters that indicate a current status of the mobile computing device; determining, by the one or more processors and based on the values of the one or more context parameters, a quantity of frames to insert after display of the first frame; and causing, subsequent to the display of the first frame and by the one or more processors, the DDIC to insert the determined quantity of frames after display of the first frame and prior to display of a subsequent frame that is different than the first frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">402:步驟</p>  
        <p type="p">404:步驟</p>  
        <p type="p">406:步驟</p>  
        <p type="p">408:步驟</p>  
        <p type="p">410:步驟</p>  
        <p type="p">412:步驟</p>  
        <p type="p">414:步驟</p>  
        <p type="p">416:步驟</p>  
        <p type="p">418:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="999" publication-number="202611312"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611312.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611312</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117820</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遮罩及有機裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">C23C14/04</main-classification>  
        <further-classification edition="200601120251202B">C23C14/12</further-classification>  
        <further-classification edition="202301120251202B">H10K59/10</further-classification>  
        <further-classification edition="202301120251202B">H10K71/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日本印刷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米川司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEKAWA, TSUKASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草原朱洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAHARA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本克美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, KATSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武田利彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古庄宏樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUSYOU, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之遮罩亦可包含：第1層，其包含至少1個第1開口；及金屬層，其包含俯視時與第1開口重疊之複數個第2開口。金屬層亦可包含形成有複數個第2開口之有效區域，與包圍有效區域之周緣區域。周緣區域亦可具有由凹部或缺損部包圍之區塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:遮罩</p>  
        <p type="p">21:遮罩本體</p>  
        <p type="p">39:對準標記</p>  
        <p type="p">40:金屬層</p>  
        <p type="p">41:第2開口</p>  
        <p type="p">43:缺損部</p>  
        <p type="p">48A:區塊</p>  
        <p type="p">48A1:區塊</p>  
        <p type="p">48A2:區塊</p>  
        <p type="p">60:低導電性層</p>  
        <p type="p">202:出射面</p>  
        <p type="p">402:第4面</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1000" publication-number="202611313"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611313.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611313</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117821</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遮罩及有機裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">C23C14/04</main-classification>  
        <further-classification edition="200601120251202B">C23C14/12</further-classification>  
        <further-classification edition="202301120251202B">H10K59/10</further-classification>  
        <further-classification edition="202301120251202B">H10K71/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日本印刷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北山大祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAYAMA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草原朱洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAHARA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武田利彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本克美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, KATSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森井明雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORII, AKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小澤裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZAWA, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古庄宏樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUSYOU, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之遮罩亦可包含：第1層，其包含至少1個第1開口；及金屬層，其包含俯視時與第1開口重疊之複數個第2開口。金屬層亦可包含形成有複數個第2開口之有效區域，與包圍有效區域之周緣區域。亦可於周緣區域形成有凹部或第3開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:遮罩</p>  
        <p type="p">21:遮罩本體</p>  
        <p type="p">30:第1層</p>  
        <p type="p">31:第1開口</p>  
        <p type="p">32:第1壁面</p>  
        <p type="p">35:外側區域</p>  
        <p type="p">36:內側區域</p>  
        <p type="p">40:金屬層</p>  
        <p type="p">41:第2開口</p>  
        <p type="p">43:第3開口</p>  
        <p type="p">48:周緣區域</p>  
        <p type="p">49:有效區域</p>  
        <p type="p">50:中間層</p>  
        <p type="p">54:第4開口</p>  
        <p type="p">55:第4壁面</p>  
        <p type="p">60:散熱促進層</p>  
        <p type="p">301:第1面</p>  
        <p type="p">302:第2面</p>  
        <p type="p">401:第3面</p>  
        <p type="p">402:第4面</p>  
        <p type="p">501:第5面</p>  
        <p type="p">502:第6面</p>  
        <p type="p">P1:間距</p>  
        <p type="p">P2:間距</p>  
        <p type="p">S2:尺寸</p>  
        <p type="p">S5:尺寸</p>  
        <p type="p">S6:間隔</p>  
        <p type="p">S7:間隔</p>  
        <p type="p">S8:尺寸</p>  
        <p type="p">S9:間隔</p>  
        <p type="p">T1:厚度</p>  
        <p type="p">T2:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1001" publication-number="202611289"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611289.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611289</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117840</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微流體裝置、其製造方法及用其細胞培養之方法</chinese-title>  
        <english-title>MICROFLUIDIC DEVICE, MANUFACTURING METHOD THEREOF, AND METHOD FOR CELL CULTURING USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C12M3/00</main-classification>  
        <further-classification edition="201001120251201B">C12N5/071</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久浪智醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANIVANCE AI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹科學園區新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊家維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅皓瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, HAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種微流體裝置，其包含：第一基板，包含環氧基基團或羥基基團；第二基板，包含環氧基基團或羥基基團；以及膜，包含矽氧基基團，且設置在第一基板和第二基板之間。一種製造微流體裝置的方法，其包含：修飾膜之表面，以形成經表面修飾之膜；修飾第一基板之表面，以形成第一經表面修飾之基板；修飾第二基板之表面，以形成包含環氧基基團或羥基基團的第二經表面修飾之基板；用經表面修飾之膜覆蓋第二經表面修飾之基板，以獲得第一結構；用第一經表面修飾之基板覆蓋第一結構，以獲得第二結構；以及乾燥第二結構，以獲得微流體裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A microfluidic device includes: a first substrate including epoxy group or hydroxyl group; a second substrate including epoxy group or hydroxyl group; and a membrane including siloxy group and disposed between the first substrate and the second substrate. A method for manufacturing a microfluidic device includes: modifying a surface of a membrane to form a surface-modified membrane; modifying a surface of a first substrate to form a first surface-modified substrate; modifying a surface of a second substrate to form a second surface-modified substrate including epoxy group or hydroxyl group; covering the second surface-modified substrate with the surface-modified membrane to obtain a first structure; covering the first structure with the first surface-modified substrate to obtain a second structure; and drying the second structure to obtain the microfluidic device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:步驟1</p>  
        <p type="p">S2:步驟2</p>  
        <p type="p">S3:步驟3</p>  
        <p type="p">S4:步驟4</p>  
        <p type="p">S5:步驟5</p>  
        <p type="p">S6:步驟6</p>  
        <p type="p">1:微流體裝置</p>  
        <p type="p">10:膜</p>  
        <p type="p">11:第一基板</p>  
        <p type="p">12:第二基板</p>  
        <p type="p">110:第一微流體通道</p>  
        <p type="p">120:第二微流體通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1002" publication-number="202611061"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611061.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611061</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117850</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎化合物及其治療用途</chinese-title>  
        <english-title>NOVEL COMPOUNDS AND THERAPEUTIC USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K7/62</main-classification>  
        <further-classification edition="201701120251201B">A61K47/54</further-classification>  
        <further-classification edition="200601120251201B">A61P31/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商半人馬治療有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTAURI THERAPEUTICS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘　布朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAM, BROWN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海倫　布萊特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELEN, BRIGHT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露涉及具有將免疫反應與病原體聯繫起來的能力的新型化合物、所述化合物在由感染原介導和/或引起的疾病或病症中的用途、含有所述化合物的組成物、其製備方法以及在所述方法中使用的新型中間體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to novel compounds with the ability to link an immune response to a pathogen, to the use of said compounds in a disease or disorder mediated and/or caused by an infective agent, to compositions containing said compounds, processes for their preparation and to novel intermediates used in said process.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1003" publication-number="202611291"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611291.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611291</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117855</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎基因遞送載體</chinese-title>  
        <english-title>NOVEL GENE DELIVERY VECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C12N5/10</main-classification>  
        <further-classification edition="201001120251201B">C12N5/077</further-classification>  
        <further-classification edition="200601120251201B">C12N15/12</further-classification>  
        <further-classification edition="201501120251201B">A61K35/24</further-classification>  
        <further-classification edition="200601120251201B">A61K48/00</further-classification>  
        <further-classification edition="200601120251201B">A61P21/00</further-classification>  
        <further-classification edition="200601120251201B">A61L27/54</further-classification>  
        <further-classification edition="200601120251201B">A61L27/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商海珀瑞恩藥物發現有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HYPERION DRUG DISCOVERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田村健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMURA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤平莉菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAHIRA, RINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嶽北和宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEKITA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於：如果促進移植細胞的融合能力，則在製造移植細胞時停止增殖，如果促進移植細胞增殖，則移植細胞在移植部位不會進行融合，在這樣的狀況下，無論是否併用免疫抑制劑，皆使移植細胞具有融合能力，並使其於期望的時期在移植部位發揮細胞融合能力，藉此，針對細胞無法植入而受到免疫排斥並消失之問題，使其長期植入。本發明提供一種細胞，其包含細胞間融合基因作為外源基因，並且在細胞外因子的存在下表現細胞間融合基因。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1004" publication-number="202611292"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611292.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611292</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ｓｉＲＮＡ產品單鏈純度分析之優化方法</chinese-title>  
        <english-title>OPTIMIZATION METHOD FOR SINGLE STRAND PURITY ANALYSIS OF A SIRNA PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C12N15/10</main-classification>  
        <further-classification edition="200601120251201B">C12N15/11</further-classification>  
        <further-classification edition="200601120251201B">G01N30/88</further-classification>  
        <further-classification edition="200601120251201B">G01N30/72</further-classification>  
        <further-classification edition="200601120251201B">G01N30/74</further-classification>  
        <further-classification edition="200601120251201B">G01N30/34</further-classification>  
        <further-classification edition="200601120251201B">G01N30/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商再生元醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范庫拉　葉斯明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN CURA, YASMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武潔瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JIEWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　泓鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNTER HONG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供分離和表徵寡核苷酸的系統和方法。小干擾RNA的固定劑量組合可以使用最佳條件進行變性離子對反相液相層析，以分離單鏈RNA用於純度分析。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides systems and methods for separating and characterizing oligonucleotides. Fixed dose combinations of small interfering RNAs can be subjected to denaturing ion pairing reverse phase liquid chromatography using optimal conditions to separate single RNA strands for purity analysis.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1005" publication-number="202611025"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611025.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611025</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種異丙基異喹啉類化合物的製備方法及其中間體</chinese-title>  
        <english-title>A PREPARATION METHOD FOR ISOPROPYLISOQUINOLINE COMPOUNDS AND INTERMEDIATES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D217/24</main-classification>  
        <further-classification edition="200601120251201B">C07C233/05</further-classification>  
        <further-classification edition="200601120251201B">C07D401/14</further-classification>  
        <further-classification edition="200601120251201B">A61K31/506</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐喬亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, QIAOLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周元沖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YUANCHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡錦陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, JINYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種異丙基異喹啉類化合物的製備方法及其中間體。本發明方法克服了現有技術中存在的缺陷，大大縮減了成本，所得產物純度好、收率高、工藝可操作性強、安全性高。因此，適合工業化應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a preparation method for isopropylisoquinoline compounds and intermediates thereof. The method of the invention overcomes the defects existing in the prior art, significantly reduces costs, and provides products with high purity and yield. The process exhibits strong operability and high safety, making it suitable for industrial-scale applications.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1006" publication-number="202611040"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611040.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611040</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117905</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有殺有害生物活性的側氧基四氫噻唑脲化合物的晶型</chinese-title>  
        <english-title>CRYSTALLINE FORMS OF OXOTHIAZOLIDINE UREA COMPOUNDS HAVING PESTICIDAL ACTIVITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D417/12</main-classification>  
        <further-classification edition="200601120251201B">A01N43/78</further-classification>  
        <further-classification edition="200601120251201B">A01P5/00</further-classification>  
        <further-classification edition="200601120251201B">A01P7/04</further-classification>  
        <further-classification edition="200601120251201B">A01P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科迪華農業科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORTEVA AGRISCIENCE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴比吉　尼可拉斯　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BABIJ, NICHOLAS R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　娜言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOY, NAKYEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃森　莫伊拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESSON, MOIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹派特羅　娜塔莉　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIAMPIETRO, NATALIE C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古德　史蒂芬　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOD, STEFFEN N.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豪夫　妮可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOUGH, NICOLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉森　保羅　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARSEN, PAUL A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維恩施　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIENSCH, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露了(&lt;i&gt;Z&lt;/i&gt;)-1-(2-氟-4-(1-(4-(三氟甲氧基)苯基-1&lt;i&gt;H&lt;/i&gt;-1,2,4-三唑-3-基)苯基)-3-(3-(5-甲基-2-((2,2,2-三氟乙氧基)甲基)苯基)-4-側氧基四氫噻唑-2-亞基)脲（Z1）的晶型、用於製備它們之方法以及在農用化學製劑中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are crystalline forms of (&lt;i&gt;Z&lt;/i&gt;)-1-(2-fluoro-4-(1-(4-(trifluoromethoxy)phenyl-1&lt;i&gt;H&lt;/i&gt;-1,2,4-triazol-3-yl)phenyl)-3-(3-(5-methyl-2-((2,2,2-trifluoroethoxy)methyl)phenyl)-4-oxothiazolidin-2-ylidene)urea (Z1), processes for making them and use in agrochemical preparations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1007" publication-number="202612393"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612393.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612393</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>上電極總成</chinese-title>  
        <english-title>UPPER ELECTRODE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H05H1/24</main-classification>  
        <further-classification edition="200601120251201B">H05H1/34</further-classification>  
        <further-classification edition="200601120251201B">H01L21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商哈納新材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANA MATERIALS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓泰揵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, TAE GUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李濟希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JE HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李銀英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, EUN YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容係關於一種上電極總成。該上電極總成包含：一襯套總成，其緊固至一電漿電極板之一插入孔；及一提昇桿，其收納於一電極支撐板之一收納空間中且經組配以將該電漿電極板可拆卸地耦接至該電極支撐板。該襯套總成包含經組配以耦接至該提昇桿之一襯套。該提昇桿包含經組配以與該襯套耦接之一耦接部分。該耦接部分包含：一襯套插入凹槽，該襯套插入至該襯套插入凹槽中；一第一路徑，其經組配以允許該提昇桿在該襯套插入之情況下在一軸向方向上移動；及一第二路徑，其經組配以允許該提昇桿在該襯套定位於該第一路徑之一末端處之情況下旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to an upper electrode assembly. The upper electrode assembly comprises a bush assembly fastened to an insertion hole of a plasma electrode plate, and a lift bar received in a receiving space of an electrode support plate and configured to detachably couple the plasma electrode plate to the electrode support plate. The bush assembly comprises a bush configured to be coupled to the lift bar. The lift bar comprises a coupling portion configured to couple with the bush. The coupling portion comprises a bush insertion groove into which the bush is inserted, a first path configured to allow the lift bar to move in an axial direction with the bush inserted, and a second path configured to allow the lift bar to rotate with the bush positioned at an end of the first path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:上電極總成</p>  
        <p type="p">100:電極支撐板</p>  
        <p type="p">200:電漿電極板</p>  
        <p type="p">300:提昇桿</p>  
        <p type="p">400:襯套總成</p>  
        <p type="p">A-A':線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1008" publication-number="202611051"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611051.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611051</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117916</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製備大環化合物之方法</chinese-title>  
        <english-title>PROCESSES FOR PREPARING MACROCYCLIC COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D519/00</main-classification>  
        <further-classification edition="200601120251201B">C07D235/04</further-classification>  
        <further-classification edition="200601120251201B">C07F5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安進公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMGEN INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑德　泰德　查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUDD, TED CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐提茲　安卓恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTIZ, ADRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿努納查姆皮萊　阿希姆連</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARUNACHALAMPILLAI, ATHIMOOLAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏爾斯　尼可拉斯　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEIRES, NICHOLAS ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>可雅　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLYER, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛拉德費德爾　喬許亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLADFELDER, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利維　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEVY, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏　卡洛琳　夏亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CAROLYN SHYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞茲奇　拉拉　艾蜜莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZETZSCHE, LARA EMILY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣　布蘭登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, BRANDON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了用於製備化合物C-5、A-5和化合物B-5、或其鹽之方法，如本文所述。本揭露還提供了化合物B-5a、B-4a和B-3a、或其鹽，如本文所述。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides processes for preparing Compound C-5, A-5, and Compound B-5, or salts thereof, as described herein. The disclosure also provides Compounds B-5a, B-4a, and B-3a, or salts thereof, as described herein.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1009" publication-number="202610541"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610541.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610541</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環氧乙烷醯胺化合物或其鹽類、及含有該等化合物之農園藝用殺菌劑以及其使用方法</chinese-title>  
        <english-title>OXIRANE AMIDE COMPOUND OR A SALT THEREOF, AND AN AGRICULTURAL/ HORTICULTURAL FUNGICIDE CONTAINING THE SAME AND A METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">A01N43/40</main-classification>  
        <further-classification edition="200601120251203B">A01P1/00</further-classification>  
        <further-classification edition="200601120251203B">C07D303/02</further-classification>  
        <further-classification edition="200601120251203B">A01N43/02</further-classification>  
        <further-classification edition="200601120251203B">A01P3/00</further-classification>  
        <further-classification edition="200601120251203B">A01P7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本農藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIHON NOHYAKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横井由貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮坂彰浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYASAKA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水谷文哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTANI, FUMIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中内愛由子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAUCHI, AYUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平井献士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAI, KENSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷口直哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGUCHI, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上颯斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供新穎的農園藝用殺菌劑。本發明係關於下述通式[I]所示化合物或其鹽類、以其等作為有效成分之農園藝用殺菌劑及其使用方法 &lt;br/&gt;&lt;img align="absmiddle" height="120px" width="302px" file="ed10034.JPG" alt="ed10034.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中的各記號如說明書所記載。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a novel agricultural/horticultural fungicide. &lt;br/&gt;The present invention relates to a compound represented by the following general formula [I] &lt;br/&gt;&lt;img align="absmiddle" height="142px" width="297px" file="ed10035.JPG" alt="ed10035.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(wherein each symbol is as defined in the specification) &lt;br/&gt;or a salt thereof, an agricultural/horticultural fungicide containing it as an active ingredient, and a method of using the same.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">本案無圖式。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1010" publication-number="202611087"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611087.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611087</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117968</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＳＴＮ抗體及其結合物</chinese-title>  
        <english-title>ANTI-STN ANTIBODIES AND CONJUGATES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/30</main-classification>  
        <further-classification edition="200601120251201B">C07K14/705</further-classification>  
        <further-classification edition="201701120251201B">A61K47/68</further-classification>  
        <further-classification edition="202501120251201B">A61K40/11</further-classification>  
        <further-classification edition="202501120251201B">A61K40/31</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商禮新醫藥科技（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANOVA MEDICINES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李潤生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, RUNSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文韜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WENTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦　瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZANG, YING QIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛惠英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, HUIYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供靶向STn之抗體或其抗原結合片段及ADC。本發明亦提供該等抗體或其抗原結合片段及其ADC在治療癌症中之用途及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are antibodies or antigen-binding fragments and ADCs thereof target STn. Also provided herein are the uses and methods of the antibodies or antigen-binding fragments thereof and ADCs thereof in treating cancers.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1011" publication-number="202611639"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611639.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611639</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118005</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多帶電粒子束描繪方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G03F7/20</main-classification>  
        <further-classification edition="201201120251201B">G03F1/20</further-classification>  
        <further-classification edition="201201120251201B">G03F1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商紐富來科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安田淳平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUDA, JUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野村春之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOMURA, HARUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本裕史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">針對應對多射束描繪中的每一擊發的取決於射束道數之位置偏離，提供一種可減低計算處理的負荷之方法。 &lt;br/&gt;　　本發明的一態樣之多帶電粒子束描繪方法，係對一部分的擊發的每一擊發，算出該擊發中的取決於遮沒射束道數之多帶電粒子束的距設計位置的第1位置偏離移位量，判定有無每一擊發的第1位置偏離移位量超過閾值之擊發，當有超過閾值的擊發的情形下，算出全部擊發當中的其餘的擊發中的遮沒射束道數，算出前述全部擊發中的取決於被算出的遮沒射束道數之多帶電粒子束的距設計位置的第2位置偏離移位量，基於被算出的第2位置偏離移位量，算出各擊發的照射位置的修正量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1012" publication-number="202610944"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610944.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610944</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118007</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑材料、乾蝕刻用阻劑材料、圖型形成方法及構造體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C01G41/02</main-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/36</further-classification>  
        <further-classification edition="200601120251201B">G03F7/38</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇野何岸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNO, KAKISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田国宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, KUNIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村謙太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲荷宇俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INARI, TAKATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>脇屋和正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKIYA, KAZUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於，提供關於含有金屬含氧酸陰離子及鎓陽離子之阻劑材料的新穎阻劑材料、乾蝕刻用阻劑材料、圖型形成方法、構造體及圖型化構造體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1013" publication-number="202612314"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612314.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612314</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於醫療裝置識別及存取管理之方法及系統</chinese-title>  
        <english-title>A METHOD AND SYSTEM FOR MEDICAL DEVICE IDENTITY AND ACCESS MANAGEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">H04L67/12</main-classification>  
        <further-classification edition="202201120251201B">H04L9/40</further-classification>  
        <further-classification edition="201801120251201B">G16H20/00</further-classification>  
        <further-classification edition="201801120251201B">G16H80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅氏血糖健康醫護公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROCHE DIABETES CARE GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雪　克里斯托夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISCHER, CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林蘭君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出了一種用於醫療裝置識別及存取管理之方法。該方法包含以下步驟： &lt;br/&gt;a) 待由數位連接裝置 (116) 控制的醫療裝置 (112)，經由未受信任連接向該數位連接裝置 (116) 傳輸來自該醫療裝置 (112) 之鑑別資訊，其中該醫療裝置 (112) 包含至少一個介面，用於與由醫療裝置製造商 (120) 指定之該數位連接裝置 (116) 通訊； &lt;br/&gt;b) 由該醫療裝置製造商 (120) 控制的醫療裝置識別及存取管理雲端後端 (114)，自該數位連接裝置 (116) 接收應用程式設計介面 API 請求，其中該 API 請求包含對由該數位連接裝置 (116) 生成的認證資訊之請求，其中該對認證資訊之請求包含關於該數位連接裝置 (116) 的鑑別資訊，在驗證及確認該 API 請求及該對認證資訊之請求時，生成包含憑證或簽章的該認證資訊，其中該認證資訊取決於由該醫療裝置製造商 (120) 預先指定之該數位連接裝置 (116) 的該鑑別資訊，藉由使用該醫療裝置識別及存取管理雲端後端 (114) 的私鑰對該認證資訊進行簽署，以及將包含經簽署之認證資訊的 API 回應傳輸至該數位連接裝置 (116)； &lt;br/&gt;c) 在該醫療裝置 (112) 處經由該未受信任連接從該數位連接裝置 (116) 接收該經簽署之認證資訊，其中在於該醫療裝置 (112) 處驗證及確認該認證資訊時，使用至少一項密碼金鑰交換程序在該醫療裝置 (112) 與該數位連接裝置 (116) 之間建立應用層安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for medical device identity and access management is proposed. The method comprising the following steps &lt;br/&gt;a) a medical device (112) to be controlled by a digitally connected device (116), transmitting, via an untrusted connection, to the digitally connected device (116) identifying information from the medical device (112), wherein the medical device (112) comprises at least one interface for communication with the digitally connected device (116) specified by the medical device manufacturer (120); &lt;br/&gt;b) a medical device identity and access management cloud backend (114) controlled by the medical device manufacturer (120), receiving an application programming interface, API, request from the digitally connected device (116), wherein the API request comprises a request for authentication information generated by the digitally connected device (116), wherein the request for authentication information comprises identifying information about the digitally connected device (116), generating, upon verifying and validating the API request and the request for authentication information, the authentication information comprising a certificate or a signature, wherein the authentication information depends on the identifying information of the digitally connected device (116) as pre-specified by the medical device manufacturer (120), signing the authentication information by using a private key of the medical device identity and access management cloud backend (114), and transmitting an API response comprising the signed authentication information to the digitally connected device (116); &lt;br/&gt;c) receiving via the untrusted connection at the medical device (112) from the digitally connected device (116) the signed authentication information, wherein, upon verifying and validating the authentication information at the medical device (112), an application layer security is established between the medical device (112) and the digitally connected device (116) using at least one cryptographic key exchange procedure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:醫療裝置識別及存取管理系統(MDIAMS)</p>  
        <p type="p">112:醫療裝置(MD)</p>  
        <p type="p">114:醫療裝置識別及存取管理雲端後端(MDIAMCB)</p>  
        <p type="p">116:數位連接裝置(DCD)</p>  
        <p type="p">118:數位連接裝置雲端後端(DCDCB)</p>  
        <p type="p">120:醫療裝置製造商</p>  
        <p type="p">122:事業主</p>  
        <p type="p">124:數位連接裝置製造商</p>  
        <p type="p">126:終端用戶</p>  
        <p type="p">128:醫療裝置生產系統(MDPS)</p>  
        <p type="p">130:數位連接裝置生產系統(DCDPS)</p>  
        <p type="p">132:健康照護提供者(HCP)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1014" publication-number="202611176"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611176.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611176</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118030</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>負型感光性樹脂組成物、圖案形成方法、硬化被膜形成方法、層間絕緣膜、表面保護膜、及電子零件</chinese-title>  
        <english-title>NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G73/12</main-classification>  
        <further-classification edition="200601120251201B">C07C69/96</further-classification>  
        <further-classification edition="200601120251201B">C07C205/43</further-classification>  
        <further-classification edition="200601120251201B">C07D207/46</further-classification>  
        <further-classification edition="200601120251201B">C07D209/48</further-classification>  
        <further-classification edition="200601120251201B">C07D209/94</further-classification>  
        <further-classification edition="200601120251201B">C07D249/18</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/40</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification>  
        <further-classification edition="200601120251201B">H01L21/312</further-classification>  
        <further-classification edition="200601120251201B">H01L23/485</further-classification>  
        <further-classification edition="200601120251201B">H01L23/532</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹村勝也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEMURA, KATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯尾匡史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIO, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦野宏之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URANO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的是提供一種感光性樹脂組成物，其係能夠在低溫下進行醯亞胺閉環反應，組成物的安定性優良，並且能夠形成微細圖案的使用了聚醯亞胺前驅物的感光性樹脂組成物，該感光性樹脂組成物硬化後能提供對於化學品的耐性。另外，提供一種使用該感光性樹脂組成物的圖案形成方法、以包含感光性樹脂組成物硬化而成的硬化被膜為特徵的層間絕緣膜及半導體器件。 &lt;br/&gt;一種負型感光性樹脂組成物，其包含：(A)具有聚醯亞胺前驅物結構的高分子化合物、(C)光聚合起始劑、(D)下述通式(1)所示的有機化合物、及(E)溶劑。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="191px" width="458px" file="ed10123.JPG" alt="ed10123.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A negative-type photosensitive resin composition, including: (A) a polymer compound including a polyimide precursor structure; (C) a photopolymerization initiator; (D) an organic compound represented by the following general formula (1); and (E) a solvent. This can provide: a photosensitive resin composition that allows an imide ring-closing reaction at low temperature, that has excellent stability of the composition, that uses a polyimide precursor that enables fine patterning, and that can impart resistance against chemicals after curing. In addition, an object of the present invention is to provide: a patterning process using the above photosensitive resin composition; an interlayer insulating film including a cured coating formed by curing the photosensitive resin composition; and a semiconductor device. &lt;br/&gt;&lt;img align="absmiddle" height="89px" width="265px" file="ed10124.JPG" alt="ed10124.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1015" publication-number="202611026"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611026.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611026</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118047</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鏡像異構化合物之製造方法及相關分子</chinese-title>  
        <english-title>PROCESSES FOR PREPARING ENANTIOMERIC COMPOUNDS AND RELATED MOLECULES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D221/02</main-classification>  
        <further-classification edition="200601120251201B">C07D471/04</further-classification>  
        <further-classification edition="200601120251201B">A61K31/506</further-classification>  
        <further-classification edition="200601120251201B">A61P37/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱文　喬爾　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALVIN, JOEL ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利梭　約翰　羅勃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIZZO, JOHN ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於製造至少可用於治療某些免疫介導之疾病之鏡像異構化合物(例如三環雜芳基甲醯胺化合物)之方法。本文所揭示之中間體包含例如下式化合物： &lt;br/&gt;&lt;img align="absmiddle" height="143px" width="216px" file="ed10255.JPG" alt="ed10255.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;本發明亦係關於如此製造之化合物之固體形式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to methods for preparing enantiomeric compounds (such as tricyclic heteroaryl carboxamide compounds) useful at least for treating certain immune-mediated diseases. Intermediates disclosed herein include, for example a compound of formula: &lt;br/&gt;&lt;img align="absmiddle" height="142px" width="231px" file="ed10256.JPG" alt="ed10256.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;The disclosure also relates to a solid form of a compound so prepared.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1016" publication-number="202612102"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612102.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612102</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118062</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於叉型片電晶體的自對準末叉主幹</chinese-title>  
        <english-title>SELF-ALIGNED FORK-LAST BACKBONE FOR FORKSHEET TRANSISTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L21/762</main-classification>  
        <further-classification edition="202501120251204B">H10D62/10</further-classification>  
        <further-classification edition="202501120251204B">H10D64/20</further-classification>  
        <further-classification edition="202301120251204B">H10B80/00</further-classification>  
        <further-classification edition="202501120251204B">H10D88/00</further-classification>  
        <further-classification edition="200601120251204B">B82B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商英特爾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　振榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEUNG, CHUN WING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>褚濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許　國偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, GUOWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙　欣國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, ROBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪挺翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, TING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　侃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　民佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, MINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅　艷斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, YANBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝肯　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PACKAN, PAUL A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林崇勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUNG-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆爾蒂　阿南德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURTHY, ANAND S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許　劭銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOH, SHAO MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="17"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林德　尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINDERT, NICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="18"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒂瓦里　維沙爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIWARI, VISHAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所揭露的實施例包括具有自對準末叉主幹的叉型片電晶體。在一個示例中，一種積體電路結構，包括：電介質主幹。第一垂直堆疊奈米線，與該電介質主幹的第一側橫向相鄰並接觸。第一磊晶源極或汲極結構，位於該第一垂直堆疊奈米線末端。第二垂直堆疊奈米線，與該主幹的第二側橫向相鄰並接觸，該第二側橫向與該第一側相對。第二磊晶源極或汲極結構，位於該第二垂直堆疊奈米線末端，該第二磊晶源極或汲極結構與該第一磊晶源極或汲極結構橫向相鄰但不合併。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments disclosed herein include forksheet transistor transistors with self-aligned fork-last backbones. In an example, an integrated circuit structure includes a dielectric backbone. A first vertical stack of nanowires is laterally adjacent to and in contact with a first side of the dielectric backbone. A first epitaxial source or drain structure is at an end of the first vertical stack of nanowires. A second vertical stack of nanowires is laterally adjacent to and in contact with a second side of the backbone, the second side laterally opposite the first side. A second epitaxial source or drain structure is at an end of the second vertical stack of nanowires, the second epitaxial source or drain structure laterally adjacent to but not merged with the first epitaxial source or drain structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">101:基板</p>  
        <p type="p">105&lt;sub&gt;A&lt;/sub&gt;:片材</p>  
        <p type="p">105&lt;sub&gt;B&lt;/sub&gt;:片材</p>  
        <p type="p">110:主幹</p>  
        <p type="p">112:閘極結構</p>  
        <p type="p">120&lt;sub&gt;A&lt;/sub&gt;:叉型片電晶體</p>  
        <p type="p">120&lt;sub&gt;B&lt;/sub&gt;:叉型片電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1017" publication-number="202611046"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611046.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611046</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118070</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蕈毒鹼1及4受體的選擇性兩用促效劑以及其治療用途</chinese-title>  
        <english-title>SELECTIVE DUAL AGONISTS OF MUSCARINIC 1 AND 4 RECEPTORS AND THERAPEUTIC USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D487/08</main-classification>  
        <further-classification edition="200601120251201B">A61P25/18</further-classification>  
        <further-classification edition="200601120251201B">A61K31/439</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商普諾沃治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRONOVO THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧　曉虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, XIAOHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案揭露了作為蕈毒鹼1及4受體之選擇性兩用促效劑的肟取代之氮雜雙環化合物，以及其醫藥組合物、製備方法及治療用途，作為用於治療與蕈毒鹼1及/或蕈毒鹼4受體相關之神經精神性病症，諸如精神分裂症、雙極性障礙及相關疾患之藥劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application discloses oxime-substituted azabicyclo compounds as selective dual agonists of muscarinic 1 and 4 receptors, and pharmaceutical compositions, preparation methods, and therapeutic uses thereof, as medicaments for treatment of neuropsychiatric disorders associated with muscarinic 1 and/or muscarinic 4 receptors, such as schizophrenia, bipolar disorder, and related conditions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1018" publication-number="202611984"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611984.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611984</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>RF脈衝輔助之高密度低K材料沉積</chinese-title>  
        <english-title>RF PULSING ASSISTED LOW-K MATERIAL DEPOSITION WITH HIGH DENSITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/02</main-classification>  
        <further-classification edition="200601120251201B">H01L21/20</further-classification>  
        <further-classification edition="200601120251201B">C23C16/34</further-classification>  
        <further-classification edition="200601120251201B">C23C16/505</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙　求景</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, KENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧欣儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, XINYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郎　紀一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, CHI-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏　立群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, LI-QUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉馬林格　齊達巴拉Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMALINGAM, CHIDAMBARA A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡卡塔拉曼　尚卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENKATARAMAN, SHANKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">例示性的半導體處理方法可包括向半導體處理腔室的處理區域提供含矽前驅物和含氮前驅物。基板可設置在該半導體處理腔室的該處理區域內。該等方法可包括在該處理區域中形成該含矽前驅物和該含氮前驅物的電漿。該電漿可能至少部分由以小於或約1,000W、小於或約1,000Hz的脈衝頻率及介於約10%與90%之間的工作週期操作的RF功率形成。該等方法可包括在基板上形成材料層。該材料層可能是或包含含矽和氮材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Exemplary semiconductor processing methods may include providing a silicon-containing precursor and a nitrogen-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed within the processing region of the semiconductor processing chamber. The methods may include forming a plasma of the silicon-containing precursor and the nitrogen-containing precursor in the processing region. The plasma may be at least partially formed by an RF power operating at less than or about 1,000 W, at a pulsing frequency less than or about 1,000 Hz, and at a duty cycle between about 10 % and 90 %. The methods may include forming a layer of material on the substrate. The layer of material may be or include a silicon-and-nitrogen-containing material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">305~315:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1019" publication-number="202611024"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611024.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611024</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>選擇性鉀通道調節劑之固態晶型</chinese-title>  
        <english-title>SOLID STATE CRYSTALLINE FORMS OF A SELECTIVE POTASSIUM CHANNEL MODULATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D217/04</main-classification>  
        <further-classification edition="200601120251201B">A61K31/472</further-classification>  
        <further-classification edition="200601120251201B">A61P25/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商再諾製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XENON PHARMACEUTICALS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>必伽勒　保羅　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BICHLER, PAUL ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡地由斯　珍　賈桂斯　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CADIEUX, JEAN-JACQUES A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坦迪　馬修　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANDY, MATTHEW DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>碧曲　格雷果瑞　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEATCH, GREGORY N.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供選擇性鉀通道調節劑之固態形式及包含該等固態晶型及醫藥學上可接受之賦形劑的醫藥組合物；以及用於製備及使用該等固態形式及其醫藥組合物之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides solid state forms of a selective potassium channel modulator and pharmaceutical compositions comprising the solid state crystalline forms and pharmaceutically acceptable excipients, and methods for preparing and using the solid state forms and the pharmaceutical compositions thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1020" publication-number="202612140"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612140.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612140</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118082</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及半導體封裝體</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250521B">H01L23/488</main-classification>  
        <further-classification edition="200601120250521B">H01L23/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛普科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AP MEMORY TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WENLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體裝置以及包括此半導體裝置的半導體封裝體。半導體裝置包括第一半導體晶粒，第一半導體晶粒具有前側及相對於前側的背側，並且包括鄰近設置於第一半導體晶粒前側的第一主動元件。半導體裝置更包括第二半導體晶粒，第二半導體晶粒具有接合至第一半導體晶粒背側的第一側及相對於第一側的第二側。第二半導體晶粒包括被動元件，用於管理第一半導體晶粒的電源輸送。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device and a semiconductor package comprising the semiconductor device are provided. The semiconductor device comprises a first semiconductor die having a front side and a backside opposite to the front side and comprising first active components disposed adjacent to the front side of the first semiconductor die. The semiconductor device also comprises a second semiconductor die having a first side bonded to the backside of the first semiconductor die and a second side opposite to the first side. The second semiconductor die comprises passive components that are configured to manage a power delivery to the first semiconductor die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110a:半導體裝置</p>  
        <p type="p">200’:第一半導體晶粒</p>  
        <p type="p">200a:前側</p>  
        <p type="p">200b:背側</p>  
        <p type="p">202:基底</p>  
        <p type="p">202a:前側表面</p>  
        <p type="p">202b:背側表面</p>  
        <p type="p">204:主動元件</p>  
        <p type="p">206,214,308,312:絕緣層</p>  
        <p type="p">208:多層內連接結構；後段製程(BEOL)層</p>  
        <p type="p">208L:金屬層</p>  
        <p type="p">216P,310P:電源接合墊</p>  
        <p type="p">216S,310S:信號接合墊</p>  
        <p type="p">300:第二半導體晶粒</p>  
        <p type="p">301:第一側</p>  
        <p type="p">302:基底</p>  
        <p type="p">306:被動電路</p>  
        <p type="p">302a:第一表面</p>  
        <p type="p">302b:第二表面</p>  
        <p type="p">303:第二側</p>  
        <p type="p">310:重佈線層(RDL)結構</p>  
        <p type="p">314P:電源輸入接墊</p>  
        <p type="p">314S:信號輸入/輸出接墊</p>  
        <p type="p">400:上蓋基底</p>  
        <p type="p">D1’:距離</p>  
        <p type="p">D3:前側距離</p>  
        <p type="p">D4:背側距離</p>  
        <p type="p">I1,I2:界面</p>  
        <p type="p">T1,T2:貫穿基底導通孔(TSV)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1021" publication-number="202611018"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611018.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611018</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118087</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於從聚醯胺6解聚混合物中分離高沸物之方法</chinese-title>  
        <english-title>PROCESS FOR SEPARATING HIGH BOILERS FROM POLYAMIDE 6 DEPOLYMERIZATION MIXTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D201/16</main-classification>  
        <further-classification edition="200601120251201B">B01D3/38</further-classification>  
        <further-classification edition="200601120251201B">C08J11/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴斯夫歐洲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉維庫瑪　維克拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAVIKUMAR, VIKRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾　圖發里　費索　阿里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL-TOUFAILI, FAISSAL-ALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布莱　史蒂凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLEI, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於從包含單體ε-己內醯胺及一或多種有機化合物X之水性液流S&lt;sub&gt;L0&lt;/sub&gt;中分離該一或多種化合物X之連續方法，該方法包含：（i）提供流S&lt;sub&gt;L0&lt;/sub&gt;；（ii）提供水性汽提氣流S&lt;sub&gt;G0&lt;/sub&gt;；（iii）在汽提單元U&lt;sub&gt;S1&lt;/sub&gt;中，從流S&lt;sub&gt;L0&lt;/sub&gt;製造水性氣流S&lt;sub&gt;V1&lt;/sub&gt;及液流S&lt;sub&gt;L1&lt;/sub&gt;；（iv）在分離單元U&lt;sub&gt;S2&lt;/sub&gt;中，從流S&lt;sub&gt;V1&lt;/sub&gt;製造水性氣流S&lt;sub&gt;V2&lt;/sub&gt;及水性液流S&lt;sub&gt;L2&lt;/sub&gt;；（v）在分離單元U&lt;sub&gt;S3&lt;/sub&gt;中，從流S&lt;sub&gt;L2&lt;/sub&gt;製造水性氣流S&lt;sub&gt;V3&lt;/sub&gt;及液流S&lt;sub&gt;L3&lt;/sub&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A continuous process for separating one or more organic compounds X from an aqueous liquid stream S&lt;sub&gt;L0&lt;/sub&gt; comprising monomeric ε-caprolactam and said one or more compounds X, the process comprising (i) providing the stream S&lt;sub&gt;L0&lt;/sub&gt;; (ii) providing an aqueous stripping gas stream S&lt;sub&gt;G0&lt;/sub&gt;; (iii) producing in a stripping unit U&lt;sub&gt;S1&lt;/sub&gt; from the stream S&lt;sub&gt;L0&lt;/sub&gt; an aqueous gas stream S&lt;sub&gt;V1&lt;/sub&gt; and a liquid stream S&lt;sub&gt;L1&lt;/sub&gt;; (iv) producing in a separation unit U&lt;sub&gt;S2&lt;/sub&gt; from the stream S&lt;sub&gt;V1&lt;/sub&gt; an aqueous gas stream S&lt;sub&gt;V2&lt;/sub&gt; and an aqueous liquid stream S&lt;sub&gt;L2&lt;/sub&gt;; (v) producing in a separation unit U&lt;sub&gt;S3&lt;/sub&gt; from the stream S&lt;sub&gt;L2&lt;/sub&gt; an aqueous gas stream S&lt;sub&gt;V3&lt;/sub&gt; and a liquid stream S&lt;sub&gt;L3&lt;/sub&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S&lt;sub&gt;G0&lt;/sub&gt;:流/汽提氣流</p>  
        <p type="p">S&lt;sub&gt;L0&lt;/sub&gt;:流/水性液流</p>  
        <p type="p">S&lt;sub&gt;L1&lt;/sub&gt;:流/液流</p>  
        <p type="p">S&lt;sub&gt;L2&lt;/sub&gt;:流/水性液流</p>  
        <p type="p">S&lt;sub&gt;L3&lt;/sub&gt;:液流</p>  
        <p type="p">S&lt;sub&gt;V1&lt;/sub&gt;:流/氣流</p>  
        <p type="p">S&lt;sub&gt;V2&lt;/sub&gt;:流/氣流</p>  
        <p type="p">S&lt;sub&gt;V3&lt;/sub&gt;:水性氣流</p>  
        <p type="p">U&lt;sub&gt;S1&lt;/sub&gt;:汽提單元</p>  
        <p type="p">U&lt;sub&gt;S2&lt;/sub&gt;:分離單元/洗滌單元</p>  
        <p type="p">U&lt;sub&gt;S3&lt;/sub&gt;:分離單元/蒸餾單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1022" publication-number="202611048"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611048.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611048</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118134</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種葫蘆脲衍生物的可藥用鹽、其結晶形式及用途</chinese-title>  
        <english-title>PHARMACEUTICALLY ACCEPTABLE SALTS OF A CUCURBITURIL DERIVATIVE, THEIR CRYSTALLINE FORMS, AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D487/22</main-classification>  
        <further-classification edition="200601120251201B">A61K31/4188</further-classification>  
        <further-classification edition="200601120251201B">A61P21/02</further-classification>  
        <further-classification edition="200601120251201B">A61P23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇恒瑞醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尚婷婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANG, TINGTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石巾藝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, JINYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊俊然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUNRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜振興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, ZHENXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及一種葫蘆脲類化合物的可藥用鹽、其結晶形式及用途。具體而言，本公開提供式1化合物的可藥用鹽、晶型及其製備方法，相應鹽具有良好的穩定性，可更好地用於臨床治療。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to pharmaceutically acceptable salts of a cucurbituril compound, their crystalline forms, and uses thereof. Specifically, the present disclosure provides pharmaceutically acceptable salts of a compound of formula 1, crystalline forms and preparation methods thereof, and the corresponding salts have good stability and can be better used in clinical treatment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1023" publication-number="202611875"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611875.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611875</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118144</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用梯度成像技術的自動視覺檢查圖像處理</chinese-title>  
        <english-title>AUTOMATED VISUAL INSPECTION IMAGE PROCESSING USING GRADIENT IMAGING TECHNIQUES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">G06V10/774</main-classification>  
        <further-classification edition="200601120251201B">G06T11/60</further-classification>  
        <further-classification edition="201701120251201B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安進公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMGEN INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米爾內　葛萊漢　Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILNE, GRAHAM F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮爾森　湯瑪士　克拉克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEARSON, THOMAS CLARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古德溫　艾爾　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOODWIN, AL PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肯農　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KENNON, JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沛瑞茲　沛瑞茲　克里斯汀　歐瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEREZ PEREZ, CHRISTIAN OMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">模組可以接收或生成限定第一圖像中描繪的特徵的形狀的掩模。掩模包括限定特徵的外周邊的第一邊界像素。該模組可以在第二圖像中識別特徵將被轉移到的轉移區域，並且將掩模覆蓋在轉移區域上，以將第一邊界像素與第二圖像的限定轉移區域的外周邊的第二邊界像素對準。該模組可以定義第一圖像在掩模的第一邊界像素內的像素的相應梯度值，並且基於第二邊界像素和相應梯度值生成轉移區域的像素的替換值集合。該模組可以藉由用替換值集合替換轉移區域的圖元值生成合成圖像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A module may receive or generate a mask that defines a shape of a feature depicted in a first image. The mask includes first boundary pixels that define an outer perimeter of the feature. The module may identify a transfer area in a second image to which the feature will be transferred and overlay the mask on the transfer area to align the first boundary pixels with second boundary pixels of the second image that define an outer perimeter of the transfer area. The module may define respective gradient values for pixels of the first image within the first boundary pixels of the mask and generate a set of replacement values for pixels of the transfer area based on the second boundary pixels and the respective gradient values. The module may generate the synthetic image by replacing pixel values of the transfer area with the set of replacement values.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:視覺檢查系統</p>  
        <p type="p">104:電腦系統</p>  
        <p type="p">110:處理單元</p>  
        <p type="p">114:記憶體單元</p>  
        <p type="p">120:AVI神經網路模組</p>  
        <p type="p">122:VIS控制模組</p>  
        <p type="p">124:庫擴展模組</p>  
        <p type="p">126:圖像/庫評估模組</p>  
        <p type="p">140:訓練圖像庫</p>  
        <p type="p">142:特徵圖像庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1024" publication-number="202610542"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610542.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610542</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118148</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有殺有害生物效用的氧雜氫噻唑衍生物以及與其相關的中間體和方法</chinese-title>  
        <english-title>OXATHIAZOLIDINE DERIVATIVES HAVING PESTICIDAL UTILITY AND INTERMEDIATES AND PROCESSES RELATED THERETO</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A01N43/78</main-classification>  
        <further-classification edition="200601120251201B">A01N47/36</further-classification>  
        <further-classification edition="200601120251201B">A01N37/40</further-classification>  
        <further-classification edition="200601120251201B">A01N43/22</further-classification>  
        <further-classification edition="200601120251201B">A01N43/36</further-classification>  
        <further-classification edition="200601120251201B">A01N43/40</further-classification>  
        <further-classification edition="200601120251201B">A01N43/54</further-classification>  
        <further-classification edition="200601120251201B">A01N43/56</further-classification>  
        <further-classification edition="200601120251201B">A01N43/80</further-classification>  
        <further-classification edition="200601120251201B">A01N43/90</further-classification>  
        <further-classification edition="200601120251201B">A01N47/02</further-classification>  
        <further-classification edition="200601120251201B">A01N47/06</further-classification>  
        <further-classification edition="200601120251201B">A01N51/00</further-classification>  
        <further-classification edition="200601120251201B">A01N53/00</further-classification>  
        <further-classification edition="200601120251201B">A01P5/00</further-classification>  
        <further-classification edition="200601120251201B">A01P7/04</further-classification>  
        <further-classification edition="200601120251201B">A01P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科迪華農業科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORTEVA AGRISCIENCE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹派特羅　娜塔莉　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIAMPIETRO, NATALIE C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯克　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRK, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐尼爾　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>O'NEAL, SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯爾　德維恩　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RULE, DWAIN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於以下的領域：對節肢動物門、軟體動物門和線蟲動物門中的有害生物具有殺有害生物效用的分子，生產此類分子之方法，在此類方法中使用的中間體，以及使用此類殺有害生物組成物對抗此類有害生物之方法。該等殺有害生物組成物可以例如用作殺蟎劑、殺昆蟲劑、殺蟎藥、殺軟體動物劑、和殺線蟲劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to the field of molecules having pesticidal utility against pests in Phyla Arthropoda, Mollusca, and Nematoda, processes to produce such molecules, intermediates used in such processes, and processes of using such pesticidal compositions against such pests. These pesticidal compositions may be used, for example, as acaricides, insecticides, miticides, molluscicides, and nematicides.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1025" publication-number="202611985"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611985.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611985</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118206</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用非保形毒化由下而上間隙填充</chinese-title>  
        <english-title>BOTTOM-UP GAP FILL USING NON-CONFORMAL POISONING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/02</main-classification>  
        <further-classification edition="200601120251201B">H01L21/32</further-classification>  
        <further-classification edition="200601120251201B">C23C16/04</further-classification>  
        <further-classification edition="200601120251201B">C23C16/40</further-classification>  
        <further-classification edition="200601120251201B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德哈文　蘇克瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DHAWAN, SUKRANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈許　蘇里亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHOSH, SUPRIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索曼　巴斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOMAN, BHASKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛哈羅伊　蘇密特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGHA ROY, SUSMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛哈爾　阿奇爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGHAL, AKHIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬禮克　亞伯希吉特巴蘇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALLICK, ABHIJIT BASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">例示性處理方法可包括將含碳前驅物提供至半導體處理腔室的處理區域。基板可設置在該處理區域內。該基板可以限定特徵。該等方法可包括使該基板與該含碳前驅物接觸。該接觸可在該基板上形成含碳材料，該含碳材料部分加襯於該特徵。該等方法可包括執行含矽原子層沉積（ALD）製程。該含矽ALD製程可在該特徵的底部部分處沉積含矽材料。該等方法可包括重複該等操作以用含矽材料填充該特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Exemplary processing methods may include providing a carbon-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed in the processing region. The substrate may define a feature. The methods may include contacting the substrate with the carbon-containing precursor. The contacting may form a carbon-containing material on the substrate that partially lines the feature. The methods may include performing a silicon-containing atomic layer deposition (ALD) process. The silicon-containing ALD process may deposit a silicon-containing material at a bottom portion of the feature. The methods may include repeating the operations to fill the feature with silicon-containing material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">205:操作</p>  
        <p type="p">210:操作</p>  
        <p type="p">215:操作</p>  
        <p type="p">220:操作</p>  
        <p type="p">225:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1026" publication-number="202610678"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610678.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610678</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118249</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>起因於椎間盤退化之疾病之處置劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K38/46</main-classification>  
        <further-classification edition="200601120251201B">A61P19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商科雅迪斯克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUREDISC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波呂浩孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARO, HIROTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於即便於以人為對象之情形時，亦可使用MMP作為起因於椎間盤退化之疾病之處置劑中之有效成分。 &lt;br/&gt;本發明提供一種起因於椎間盤退化之疾病之處置劑，其含有MMP作為有效成分，且每次之MMP之劑量為100 μg～700 μg。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1027" publication-number="202611620"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611620.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611620</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118261</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相機致動器及包括其之相機模組</chinese-title>  
        <english-title>CAMERA ACTUATOR AND CAMERA MODULE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251211B">G03B5/00</main-classification>  
        <further-classification edition="202101120251211B">G03B17/12</further-classification>  
        <further-classification edition="202101120251211B">G03B3/10</further-classification>  
        <further-classification edition="202301120251211B">H04N23/54</further-classification>  
        <further-classification edition="202101120251211B">G03B13/36</further-classification>  
        <further-classification edition="202301120251211B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金贊中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, CHAN JOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉政起</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, JEONG GI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金承洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEUNG SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一相機致動器，包括：一殼體；複數個鏡頭組件；一基板，設置於該殼體上；及 一第一軛和一第二軛，該第一軛和該第二軛設置在該基板上，其中，該第一軛包括沿一第一方向設置的一第一區域和一第二區域，及該第一區域在垂直於該第一方向的一第二方向上的寬度大於該第二區域在該第二方向上的寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An embodiment discloses a camera actuator including a housing, a plurality of lens assemblies, a substrate disposed on the housing, and a first yoke and a second yoke which are disposed on the substrate, wherein the first yoke includes a first region and a second region which are disposed in a first direction, and a width of the first region in a second direction perpendicular to the first direction is greater than a width of the second region in the second direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:相機模組</p>  
        <p type="p">1300:電路板</p>  
        <p type="p">CV:蓋子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1028" publication-number="202611296"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611296.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611296</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118270</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造重組腺病毒載體之方法</chinese-title>  
        <english-title>METHOD FOR THE MANUFACTURE OF RECOMBINANT ADENOVIRUS VECTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C12N15/86</main-classification>  
        <further-classification edition="200601120251201B">C12N7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商輝凌國際中心公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERRING INTERNATIONAL CENTER S.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈西寧　明娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASSINEN, MINNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於用於生產重組腺病毒載體之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method for producing a recombinant adenovirus vector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1029" publication-number="202611689"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611689.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611689</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118333</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料儲存裝置及其操作方法</chinese-title>  
        <english-title>DATA STORAGE DEVICE AND OPERATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F3/06</main-classification>  
        <further-classification edition="200601120251201B">G06F11/14</further-classification>  
        <further-classification edition="201801120251201B">G06F9/445</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛相勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, SANG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎬省</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HO SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資料儲存裝置的操作方法，包括：接收一控制信號，以指示依一第一記憶體部中儲存的一第一韌體或一第二記憶體部中儲存的一第二韌體作為主韌體運行；根據該控制信號，執行該第一韌體作為主韌體；在執行該第一韌體作為主韌體後，開機成功時，參考該第一韌體更新該第二韌體；在執行該第一韌體作為主韌體後，開機失敗時，執行該第二韌體作為主韌體；以及在執行該第二韌體和主韌體後，開機成功時，參考該第二韌體更新該第一韌體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An operating method of a data storage device according to one embodiment of the present invention includes receiving a control signal for instructing any one of first firmware stored in a first memory part and second firmware stored in a second memory part to operate as main firmware, executing the first firmware as the main firmware according to the control signal, updating the second firmware with reference to the first firmware when booting is successful as a result of the executing of the first firmware as the main firmware, executing the second firmware as the main firmware when the booting fails as the result of the executing of the first firmware as the main firmware, and updating the first firmware with reference to the second firmware when booting is successful as a result of the executing of the second firmware and the main firmware.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:系統</p>  
        <p type="p">100:電源裝置</p>  
        <p type="p">110:轉換器</p>  
        <p type="p">120:輸入電壓檢測器</p>  
        <p type="p">130:檢測信號發送器</p>  
        <p type="p">200:資料存儲裝置</p>  
        <p type="p">210:記憶體部</p>  
        <p type="p">220:電源</p>  
        <p type="p">230:控制器</p>  
        <p type="p">300:控制裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1030" publication-number="202611076"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611076.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611076</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118334</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種抗GIPR抗體或其抗原結合片段及用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/28</main-classification>  
        <further-classification edition="200601120251201B">C12N15/13</further-classification>  
        <further-classification edition="200601120251201B">C12N15/63</further-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="201701120251201B">A61K47/68</further-classification>  
        <further-classification edition="200601120251201B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商信立泰（成都）生物技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALUBRIS (CHENGDU) BIOTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳信立泰藥業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商信立泰（蘇州）藥業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALUBRIS (SUZHOU) PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　軍民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, JUNMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牟宗春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOU, ZONGCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉小紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XIAOHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭小倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, XIAOLUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向蜀州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIANG, SHUZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊曉琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIONG, XIAOLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種抗GIPR抗體或其抗原結合片段，還提供了編碼所述抗體的多核苷酸，用於表達所述抗體的載體和宿主細胞，包含所述抗體的藥物組合物，以及所述抗體用於治療與GIPR相關的疾病的方法和製藥用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1031" publication-number="202611077"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611077.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611077</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靶向EGFR和HER2的雙特異性抗體及抗體-藥物偶聯物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/28</main-classification>  
        <further-classification edition="200601120251201B">C07K16/32</further-classification>  
        <further-classification edition="200601120251201B">C07D491/22</further-classification>  
        <further-classification edition="201701120251201B">A61K47/68</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴曉鵑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAI, XIAOJUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝紅梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, HONGMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仝莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于函希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HANXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯瑀婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YUTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何衛明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, WEIMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翟文強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAI, WENQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊方龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FANGLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　立忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JOHN LIUZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王思勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SIQIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供靶向EGFR和HER2的雙特異性抗體以及抗體-藥物偶聯物，以及它們用於治療腫瘤的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1032" publication-number="202611118"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611118.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611118</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118375</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物體電極組成物、生物體電極、及生物體電極之製造方法</chinese-title>  
        <english-title>BIO-ELECTRODE COMPOSITION, BIO-ELECTRODE, AND METHOD FOR PRODUCING BIO-ELECTRODE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/14</main-classification>  
        <further-classification edition="200601120251201B">C08F220/38</further-classification>  
        <further-classification edition="200601120251201B">C08L25/18</further-classification>  
        <further-classification edition="200601120251201B">C08L33/08</further-classification>  
        <further-classification edition="200601120251201B">C08L33/14</further-classification>  
        <further-classification edition="200601120251201B">C08L75/04</further-classification>  
        <further-classification edition="200601120251201B">C08L83/04</further-classification>  
        <further-classification edition="200601120251201B">C08K3/04</further-classification>  
        <further-classification edition="200601120251201B">C08K3/08</further-classification>  
        <further-classification edition="200601120251201B">H01B1/20</further-classification>  
        <further-classification edition="202101120251201B">A61B5/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠山潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKEYAMA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田譲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, JOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係以提供可形成導電性及生物相容性優良，為輕量，且能以低成本製造，無論被水濡濕或乾燥其導電性都不會大幅降低，柔軟且伸縮性與黏著性優良的生物體電極用之生物體接觸層的生物體電極組成物、以該生物體電極組成物形成生物體接觸層之生物體電極、及其製造方法為目的。&lt;br/&gt; 該課題之解決手段為一種生物體電極組成物，含有(A)離子性之樹脂，其特徵為：該(A)成分包含具有選自參鋶甲基化物(trissulfonium methide)之銨鹽、鋰鹽、鈉鹽、鉀鹽的結構之樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a bio-electrode composition includes (A) an ionic resin, wherein the component (A) contains a resin having a structure selected from an ammonium salt, a lithium salt, a sodium salt, and a potassium salt of trissulfonium methide. This provides a bio-electrode composition capable of forming a living body contact layer for a bio-electrode, which is excellent in electric conductivity and biocompatibility and lightweight, can be produced at low cost, causes no significant decrease in the electric conductivity even when gets wet from water or when dried, and is soft with excellent stretchability and adhesiveness; a bio-electrode including a living body contact layer formed from the bio-electrode composition; and a method for producing the bio-electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:生物體電極</p>  
        <p type="p">2:導電性基材(導電圖案)</p>  
        <p type="p">3:生物體接觸層</p>  
        <p type="p">4:導電粉末</p>  
        <p type="p">5:離子性之樹脂(A)</p>  
        <p type="p">6:樹脂(B)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1033" publication-number="202611265"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611265.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611265</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量子技術</chinese-title>  
        <english-title>QUANTUM TECHNOLOGIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09K11/02</main-classification>  
        <further-classification edition="200601120251201B">C09K11/70</further-classification>  
        <further-classification edition="200601120251201B">C09K11/88</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商納諾柯技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANOCO TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈利斯　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARRIS, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛瑞斯帝　那塔利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRESTY, NATHALIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮凱特　耐吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PICKETT, NIGEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賓柯斯　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BINKS, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩吉　羅伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAGE, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施聶德　朱里恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHNEIDER, JULIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於其中相當大比例經單一摻雜之複數個分子團簇、產生該複數個分子團簇之方法、其中相當大比例經單一摻雜之複數個膠質量子點、產生該複數個膠質量子點之方法及包括該複數個膠質量子點之量子裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relate to a plurality of molecular clusters of which a substantial proportion are singly-doped, methods of producing such pluralities of molecular clusters, pluralities of colloidal quantum dots of which a substantial proportion are singly-doped, methods of producing such pluralities of colloidal quantum dots, and quantum devices comprising such pluralities of colloidal quantum dots.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1034" publication-number="202610767"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610767.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610767</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨具、研磨頭、研磨裝置、研磨方法</chinese-title>  
        <english-title>POLISHING TOOL, POLISHING HEAD, POLISHING APPARATUS, AND POLISHING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251210B">B24B37/005</main-classification>  
        <further-classification edition="200601120251210B">B24B13/01</further-classification>  
        <further-classification edition="201201120251210B">B24B37/11</further-classification>  
        <further-classification edition="200601120251210B">B24B41/04</further-classification>  
        <further-classification edition="200601120251210B">B24B47/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商使能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENABLE K. K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慶應義塾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEIO UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢克伯　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEAUCAMP, ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川秀樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]以簡易的構造實現高精度的研磨。 &lt;br/&gt;　　[解決手段]將研磨材保持在自身的研磨面與工件(W)之間並用以研磨工件(W)的研磨具(200)，具備：在前端具有研磨面(230)並沿研磨軸(J)延伸的主軸部(210)、從主軸部(210)連續向徑方向的外側延伸的複數彈性部(310、320、330)、及在複數彈性部(310、320、330)的徑方向外側連續的複數座部(410、420、430)。再來，彈性部(310、320、330)中，在主軸部(210)連續的位置、與和座部(410、420、430)連續的位置在研磨軸(J)的軸方向不同。藉此，藉由外部的工具驅動機構，將座部(410、420、430)在徑方向作用相同量的變位時，複數彈性部(310、320、330)彈性變形，主軸部(210)沿研磨軸變位。又，藉由外部的工具驅動機構，相對於座部(410、420、430)的各者，作用朝向徑方向的不同量的變位時，主軸部(210)沿研磨軸(J)的徑方向變位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140:工具驅動機構</p>  
        <p type="p">200:研磨具</p>  
        <p type="p">230:研磨面</p>  
        <p type="p">410:第一座部</p>  
        <p type="p">410A:第一座面</p>  
        <p type="p">510:第一驅動部</p>  
        <p type="p">510A:保持第一接觸體</p>  
        <p type="p">510B:第一變位軸</p>  
        <p type="p">510C:調整第一驅動源</p>  
        <p type="p">510D:第一支架</p>  
        <p type="p">510E:第一位置調整部</p>  
        <p type="p">510E1:第一內螺紋座</p>  
        <p type="p">510E2:第一調整外螺紋</p>  
        <p type="p">R1:第一徑方向</p>  
        <p type="p">F1:第一外力</p>  
        <p type="p">J:研磨軸</p>  
        <p type="p">S:周方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1035" publication-number="202612458"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612458.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612458</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118527</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H10B12/00</main-classification>  
        <further-classification edition="202501120251201B">H10D30/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南大鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAM, DAEJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體記憶體裝置包括：基板；隔離絕緣層，佈置於基板上；多條字元線，佈置於基板上以在第一水平方向上延伸且在豎直方向上彼此分開；位元線，在隔離絕緣層上在豎直方向上延伸；多個半導體圖案，在與第一水平方向正交的第二水平方向上自位元線延伸且在豎直方向上彼此分開；以及多個資訊儲存元件，連接至多個所述半導體圖案。多個所述半導體圖案中的每一者包括：源極區，包含與隔離絕緣層相同的雜質；汲極區；以及通道區，位於源極區與汲極區之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory device includes a substrate, an isolation insulating layer arranged on the substrate, a plurality of word lines arranged on the substrate to extend in a first horizontal direction and to be apart from one another in a vertical direction, a bit line extending in the vertical direction on the isolation insulating layer, a plurality of semiconductor patterns extending from the bit line in a second horizontal direction orthogonal to the first horizontal direction and apart from one another in the vertical direction, and a plurality of information storage elements connected to the plurality of semiconductor patterns. Each of the plurality of semiconductor patterns includes a source region including the same impurity as the isolation insulating layer, a drain region, and a channel region between the source region and the drain region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體記憶體裝置</p>  
        <p type="p">102:基板</p>  
        <p type="p">105:隔離絕緣層</p>  
        <p type="p">110:半導體圖案</p>  
        <p type="p">132:閘極介電層</p>  
        <p type="p">150:電容器結構</p>  
        <p type="p">152:第一電極</p>  
        <p type="p">154:電容器介電層</p>  
        <p type="p">156:第二電極</p>  
        <p type="p">B-B':線</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">BLR:區</p>  
        <p type="p">CH:通道區</p>  
        <p type="p">CT:胞元電晶體</p>  
        <p type="p">MC:記憶體胞元</p>  
        <p type="p">SD1:源極區</p>  
        <p type="p">SD2:汲極區</p>  
        <p type="p">SP:資訊儲存元件</p>  
        <p type="p">WL:字元線</p>  
        <p type="p">WLS:字元線結構</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1036" publication-number="202612101"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612101.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612101</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118548</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無襯墊混合接合</chinese-title>  
        <english-title>PAD-LESS HYBRID BONDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L21/76</main-classification>  
        <further-classification edition="200601120251204B">H01L23/535</further-classification>  
        <further-classification edition="200601120251204B">H01L21/31</further-classification>  
        <further-classification edition="200601120251204B">H01L21/302</further-classification>  
        <further-classification edition="200601120251204B">C23C16/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特卡　拉杰詡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATKAR, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈巴　貝高森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HABA, BELGACEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏佐　賽普里恩　艾米卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UZOH, CYPRIAN EMEKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥卡雷米　蘿拉　威爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIRKARIMI, LAURA WILLS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中揭示形成微電子組件之方法。在一些具體實例中，這些方法包括提供具有金屬化層之元件，該金屬化層具有沿著該金屬化層之表面在側向方向上延伸的複數個金屬線。該方法進一步包括在該金屬化層上方形成介電層，製備該元件以用於直接接合，及曝露該複數個金屬線中之至少一者之一部分以界定經曝露部分。該經曝露部分及該介電層形成混合接合表面之部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are methods of forming a microelectronic component. In some embodiments, the methods include providing an element having a metallization layer having a plurality of metal lines extending in a lateral direction along a surface of the metallization layer. The method further includes forming a dielectric layer over the metallization layer, preparing the element for direct bonding, and exposing a portion of at least one of the plurality of metal lines to define an exposed portion. The exposed portion and the dielectric layer form part of a hybrid bonding surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:製程</p>  
        <p type="p">302:區塊</p>  
        <p type="p">304:區塊</p>  
        <p type="p">306:區塊</p>  
        <p type="p">308:區塊</p>  
        <p type="p">310:區塊</p>  
        <p type="p">312:區塊</p>  
        <p type="p">314:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1037" publication-number="202611420"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611420.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611420</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118558</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閘閥及包含其之基底處理裝置</chinese-title>  
        <english-title>GATE VALVE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">F16K3/314</main-classification>  
        <further-classification edition="200601120251201B">F16K3/14</further-classification>  
        <further-classification edition="200601120251201B">F16K3/316</further-classification>  
        <further-classification edition="200601120251201B">F16K51/02</further-classification>  
        <further-classification edition="200601120251201B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商普利西斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRESYS CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廉厦淋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEOM, HA LIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳智慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, JI HYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文在滿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, JAE MAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金勝完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEUNG WAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙殷燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, EUN CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露閘閥及包括其之基底處理裝置。閘閥（10）包括：閥殼（100）具有界定流道（P）的開口（O）和閥座（101）；以及閥板（200）配置為在閥板（200）接觸閥殼（100）內的閥座（101）以關閉流道（P）的關閉位置與閥板（200）開啟流道（P）的開啟位置之間移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a gate valve and a substrate processing apparatus including the same. The gate valve (10) includes: a valve housing (100) having an opening (O) defining a flow path (P) and a valve seat (101); and a valve plate (200) disposed to movable between a closed position in which the valve plate (200) contacts the valve seat (101) within the valve housing (100) to close the flow path (P) and an open position in which the valve plate (200) opens the flow path (P).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:閘閥</p>  
        <p type="p">100,110:閥殼</p>  
        <p type="p">112,114,116:板，分割零件</p>  
        <p type="p">122:第一流道形成部件</p>  
        <p type="p">124:第二流道形成部件</p>  
        <p type="p">400:驅動單元</p>  
        <p type="p">L:方向</p>  
        <p type="p">K:軸線</p>  
        <p type="p">O:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1038" publication-number="202610658"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610658.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610658</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118564</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>魚針草內酯之抗癌衍生物及其用途</chinese-title>  
        <english-title>ANTI-CANCER DERIVATIVES OF OVATODIOLIDE AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">A61K31/575</main-classification>  
        <further-classification edition="200601120251203B">A61K31/56</further-classification>  
        <further-classification edition="200601120251203B">A61K31/343</further-classification>  
        <further-classification edition="200601120251203B">A61K31/336</further-classification>  
        <further-classification edition="200601120251203B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩摩亞商吉亞生技控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARJIL BIOTECH HOLDING COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>WS</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　郁彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YEH B</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, ON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁惠如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, HUI-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊菀溆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WAN-HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭志玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種新穎魚針草內酯的衍生物，對癌細胞表現出不可預期的優異細胞毒性。本發明也提供該新穎魚針草內酯的衍生物之製備方法及其用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention pertains to a new derivative of ovatodiolide, which has unexpectedly good cytotoxicity in cancer cells. Also provided are the preparation process and the use of the new derivative of ovatodiolide.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1039" publication-number="202611078"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611078.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611078</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118627</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以雙特異性BCMAxCD3抗體治療多發性骨髓瘤之方法</chinese-title>  
        <english-title>METHODS OF TREATING MULTIPLE MYELOMA WITH BISPECIFIC BCMA X CD3 ANTIBODIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">C07K16/28</main-classification>  
        <further-classification edition="200601120251203B">A61K39/395</further-classification>  
        <further-classification edition="200601120251203B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商再生元醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克魯格　格倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KROOG, GLENN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用於治療多發性骨髓瘤之方法。於某些實施例，本發明方法包括向有需要之個體投予結合於BCMA及CD3之雙特異性抗體或其抗原結合片段。於某些實施例，該等雙特異性BCMA×CD3抗體係向該有需要之個體皮下投予。於某些實施例，該個體先前已用BCMA-CAR-T細胞療法加以治療。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods for treating multiple myeloma. In certain embodiments, the present methods comprise administering to a subject in need thereof bispecific antibodies or antigen-binding fragments thereof that bind to BCMA and CD3. In certain embodiments, the bispecific BCMAxCD3 antibodies are administered subcutaneously to the subject in need thereof. In certain embodiments, the subject has been previously treated with BCMA-CAR-T cell therapy.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1040" publication-number="202610683"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610683.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610683</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118646</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>艾薩妥昔單抗用於治療復發性和/或難治性多發性骨髓瘤的用途</chinese-title>  
        <english-title>USE OF ISATUXIMAB FOR THE TREATMENT OF RELAPSED AND/OR REFRACTORY MULTIPLE MYELOMA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K39/395</main-classification>  
        <further-classification edition="200601120251201B">A61K31/573</further-classification>  
        <further-classification edition="201901120251201B">A61K38/08</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification>  
        <further-classification edition="200601120251201B">C07K16/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賽諾菲　安萬特美國有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANOFI-AVENTIS U.S. LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里斯　瑪麗　勞爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RISSE, MARIE-LAURE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾薩特　蓋爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASSET, GAELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開文本提供了用於在接受過針對多發性骨髓瘤的一至三種先前療法（或先前治療線）的個體中治療多發性骨髓瘤（如難治性多發性骨髓瘤或復發性難治性多發性骨髓瘤）的方法。所述方法包括向所述個體投予抗CD38抗體、卡非佐米和地塞米松。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods for treating multiple myeloma (such as refractory multiple myeloma or relapsed and refractory multiple myeloma) in an individual who received one to three prior therapies (or prior lines of therapy) for multiple myeloma. The methods comprise administering to the individual an anti-CD38 antibody, carfilzomib, and dexamethasone.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1041" publication-number="202611416"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611416.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611416</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118711</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性動力傳遞結構體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">F16H25/20</main-classification>  
        <further-classification edition="200601120251204B">F16H25/16</further-classification>  
        <further-classification edition="200601120251204B">F16C32/04</further-classification>  
        <further-classification edition="200601120251204B">H01F7/02</further-classification>  
        <further-classification edition="200601120251204B">H01F7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鍋屋百泰股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NABEYA BI-TECH KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東海國立大學機構</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人電氣通信大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE UNIVERSITY OF ELECTRO-COMMUNICATIONS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>間宮寿明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAMIYA, HISAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>部矢明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEYA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上剛志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮎澤颯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYUZAWA, HAYATE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲田佳弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的磁性動力傳遞結構體包括：沿著軸向延伸的轉軸構件、具有沿軸向貫通的中空部的筒狀單元、及沿軸向被磁化的一個以上的第一磁鐵。在轉軸構件的外周面設置繞軸形成的突條。筒狀單元包括第一凸形成部及第二凸形成部。在各凸形成部的內周面，以與轉軸構件的突條相向的方式設置凸部。第二凸形成部在軸向上與第一凸形成部鄰接配置。一個以上的第一磁鐵在軸向上配置於第一凸形成部與第二凸形成部之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:轉軸構件</p>  
        <p type="p">2:螺母單元</p>  
        <p type="p">3:筒狀單元</p>  
        <p type="p">10、x、y、z:軸</p>  
        <p type="p">11:外周面</p>  
        <p type="p">15:突條</p>  
        <p type="p">30:中空部</p>  
        <p type="p">31:第一凸形成部</p>  
        <p type="p">32:第二凸形成部</p>  
        <p type="p">33:第三凸形成部</p>  
        <p type="p">51:第一磁鐵</p>  
        <p type="p">52:第二磁鐵</p>  
        <p type="p">310、320、330:內周面</p>  
        <p type="p">311:第一凸部</p>  
        <p type="p">321:第二凸部</p>  
        <p type="p">331:第三凸部</p>  
        <p type="p">5100、5101:端面</p>  
        <p type="p">S:磁性動力傳遞結構體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1042" publication-number="202611015"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611015.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611015</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118712</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、微影膜形成用組成物、阻劑膜，及阻劑圖型之形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C381/12</main-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/11</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>學校法人關西大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE SCHOOL CORPORATION KANSAI UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤宏人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤𨺓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>越後雅敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECHIGO, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供阻劑感度特性優異，且溶劑溶解性、耐熱性、成膜性優異之化合物。並且提供含有前述化合物之微影膜形成用組成物、阻劑膜，及阻劑圖型之形成方法。下述式(1)所示之化合物。 &lt;br/&gt;&lt;img align="absmiddle" height="127px" width="249px" file="ed10041.JPG" alt="ed10041.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，Ar為具有碳數6~60之芳基之基，R&lt;sup&gt;1&lt;/sup&gt;為具有鋶鹽或錪鹽之有機基，n&lt;sup&gt;A&lt;/sup&gt;為1~9之整數，n&lt;sup&gt;B&lt;/sup&gt;為1以上之整數。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1043" publication-number="202611644"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611644.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611644</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118767</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯影裝置及顯影方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250827B">G03F7/26</main-classification>  
        <further-classification edition="200601120250827B">G03F7/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣瀬幹也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROSE, MIKIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村嘉孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, YOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明在對基板供給顯影液並進行顯影處理的顯影裝置及顯影方法中，在罐內有效率地消除因向罐內回收顯影液而產生的泡，從而提高顯影裝置的運轉率。在本發明中，由於第一罐內的顯影液被循環供給，因此泡因顯影液返回至第一罐而被導入至第一罐內。對所述泡供給與顯影液相同組成的消泡液，其結果，泡被消除。另外，由於消泡液為與顯影液相同的組成，因此防止貯存在第一罐內的顯影液的濃度變化或組成變化，從而能夠始終進行穩定的顯影處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:顯影裝置</p>  
        <p type="p">210:顯影槽</p>  
        <p type="p">230:罐</p>  
        <p type="p">240:循環供給部</p>  
        <p type="p">241:配管</p>  
        <p type="p">242、252:閥</p>  
        <p type="p">243、266:泵</p>  
        <p type="p">244:回收配管</p>  
        <p type="p">250:排液部</p>  
        <p type="p">251:排液配管</p>  
        <p type="p">261:多功能噴嘴</p>  
        <p type="p">262:共用配管</p>  
        <p type="p">263:三向閥</p>  
        <p type="p">264:消泡配管</p>  
        <p type="p">265:泡除去配管</p>  
        <p type="p">280:泡除去部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1044" publication-number="202611211"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611211.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611211</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118775</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有降低密度之聚醯胺組合物</chinese-title>  
        <english-title>POLYAMIDE COMPOSITION HAVING A REDUCED DENSITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08K7/04</main-classification>  
        <further-classification edition="200601120251201B">C08K7/24</further-classification>  
        <further-classification edition="200601120251201B">C08L77/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商堤康那責任有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TICONA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種聚醯胺組合物，該聚醯胺組合物包含：聚合物基質，其包括長鏈脂族聚醯胺；及約50至約200重量份的分佈於該聚合物基質內之無機填料。該無機填料包括無機纖維及中空無機珠。該聚醯胺組合物展現出根據ISO 1183:2019所測定之密度為約1,000 kg/m&lt;sup&gt;3&lt;/sup&gt;或更小及根據ISO 527:2019在約23℃之溫度下所測定之拉伸模數為約4,000 MPa或更大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polyamide composition that comprises a polymer matrix that includes a long-chain aliphatic polyamide and from about 50 to about 200 parts by weight of an inorganic filler distributed within the polymer matrix is provided. The inorganic filler includes inorganic fibers and hollow inorganic beads. The polyamide composition exhibits a density of about 1,000 kg/m&lt;sup&gt;3&lt;/sup&gt; or less as determined in accordance with ISO 1183:2019 and a tensile modulus of about 4,000 MPa or more as determined in accordance with ISO 527:2019 at a temperature of about 23℃.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1045" publication-number="202610978"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610978.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610978</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118827</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、聚合物、使用其等之組合物及交聯高分子、以及新穎化合物之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C43/257</main-classification>  
        <further-classification edition="200601120251201B">C08G65/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東京科學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>早川晃鏡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAKAWA, TERUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠山歓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKEYAMA, KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曽根健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONE, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下幸彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, YUKIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有新穎之多分支結構且於Sub-THz頻帶之高頻帶下介電損耗較小之新穎化合物、及其製造方法等。本發明之化合物由下述通式(1)表示。 &lt;img align="absmiddle" height="261px" width="541px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(通式(1)中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;各自獨立地為氫原子或烷基，Ar&lt;sup&gt;1&lt;/sup&gt;～Ar&lt;sup&gt;4&lt;/sup&gt;各自獨立地為經取代或未經取代之碳原子數為6～24之芳香族烴基，Cy&lt;sup&gt;1&lt;/sup&gt;～Cy&lt;sup&gt;4&lt;/sup&gt;各自獨立地為經取代或未經取代之碳原子數為5～20之脂環式烴基)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1046" publication-number="202611640"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611640.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611640</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118874</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於極紫外光蝕刻之具有薄碳化矽塗層的超薄、超低密度薄膜</chinese-title>  
        <english-title>ULTRA-THIN, ULTRA-LOW DENSITY FILMS WITH THIN SILICON CARBIDE COATING FOR EXTREME ULTRAVIOLET LITHOGRAPHY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">G03F7/20</main-classification>  
        <further-classification edition="201201120251208B">G03F1/22</further-classification>  
        <further-classification edition="201201120251208B">G03F1/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC OF AMERICA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利瑪　瑪西歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIMA, MARCIO D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　瑟爾吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SERGEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉馬尼　胡曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAHMANI, HOOMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古屋拓己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUYA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>植田貴洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加涅耶夫　薩拉弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANEYEV, SERAPHIM IBRAGIMOVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露具有薄碳化矽塗層之經過濾形成之奈米結構光罩護膜(pellicle)薄膜。該經過濾形成之奈米結構光罩護膜薄膜包括複數奈米纖維，其係無規律地交錯以形成具有強化特性之平面定向的互連網絡結構，及碳化矽塗層。具有薄碳化矽塗層之經塗布的互連結構允許至少85%的高最小極紫外光(EUV)透射率及更強的抗氫電漿蝕刻的薄膜機械性質。該互連網絡結構之厚度在下限3 nm至上限100 nm範圍內，及碳化矽塗層之厚度為0.3 nm至4.0 nm，以允許更有效的EUV蝕刻加工。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">&lt;u&gt; &lt;/u&gt; &lt;br/&gt;A filtration formed nanostructure pellicle film with a thin silicon carbide coating is disclosed. The filtration formed nanostructure pellicle film includes a plurality of nanofibers that are intersected randomly to form an interconnected network structure in a planar orientation with enhanced properties, and a silicon carbide-coated layer. The coated interconnected structure with the thin silicon carbide-coated layer allows for a high minimum extreme ultraviolet (EUV) transmission rate of at least 85% and stronger film mechanical properties against hydrogen plasma etching. The interconnected network structure has a thickness ranging from a lower limit of 3 nm to an upper limit of 100 nm and a silicon carbide coating thickness from 0.3 nm to4.0 nm to allow for more effective EUV lithography processing.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1047" publication-number="202612053"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612053.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612053</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118882</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理機台閥用的冷卻套管</chinese-title>  
        <english-title>COOLING SLEEVE FOR PROCESSING TOOL VALVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/67</main-classification>  
        <further-classification edition="200601120251201B">H01L23/36</further-classification>  
        <further-classification edition="200601120251201B">H01L23/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>那舍　沙卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NASR, SAGHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞特克　阿列克謝　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALTECOR, ALEKSEY V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一實例提供一處理機台，其包括使用點閥歧管 (PVM)，配置為將處理化學物質輸送到該處理機台之一處理腔室。該 PVM 包括一閥門及一閥門致動器和感測器組件。該閥門致動器和感測器組件包括一閥門致動器，配置為驅動該 PVM 之該閥門，該閥門具有一開啟狀態和一關閉狀態。該閥門致動器和感測器組件更包括一感測器，配置為感測該閥門之該開啟狀態和該關閉狀態。該處理機台更包括一冷卻套管，圍繞該閥門致動器和感測器組件之外表面，該冷卻套管定義一或更多條流體流路，該流體流路配置為保持冷卻流體的流動，從而從該閥門致動器和感測器組件之該外表面散熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One example provides a processing tool comprising a point-of-use valve manifold (PVM) configured to deliver processing chemicals to a processing chamber of the processing tool. The PVM comprises a valve, and a valve actuator and sensor assembly. The valve actuator and sensor assembly comprises a valve actuator configured to actuate the valve of the PVM, the valve having an open state and a closed state. The valve actuator and sensor assembly further comprises a sensor configured to sense the open state and the closed state of the valve. The processing tool further comprises a cooling sleeve surrounding an exterior surface of the valve actuator and sensor assembly, the cooling sleeve defining one or more fluid flow paths configured to hold a flow of a cooling fluid to remove heat from the exterior surface of the valve actuator and sensor assembly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:局部透視圖</p>  
        <p type="p">202:使用點閥歧管(PVM)</p>  
        <p type="p">204:閥門致動器和感測器組件</p>  
        <p type="p">207:主體</p>  
        <p type="p">208:冷卻套管</p>  
        <p type="p">209:感測器</p>  
        <p type="p">210:入口</p>  
        <p type="p">212:導線</p>  
        <p type="p">214:氣動輸入管線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1048" publication-number="202611581"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611581.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611581</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118888</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>插座、插頭、光連接器及光電迴路基板的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">G02B6/36</main-classification>  
        <further-classification edition="200601120251210B">G02B6/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商白山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAKUSAN INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽塔萬普拉　亞歷山大威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SETIAWAN PUTRA, ALEXANDER WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松田健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野翔平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種小型且能夠同時連接多個多芯套接管的電迴路基板用的光連接器。 &lt;br/&gt;　　[解決手段]光連接器(10)包含：安裝在電迴路基板的插座(100)、以及裝入了多個光纖及多芯套接管的插頭(200)。插座(100)具有：收納部(110)，其係可以收納保持導引腳的接腳保持器(150)及被導引腳插通的多芯套接管；卡止孔(120)，其係可以被插頭的卡止片插通；固定部(140)，其係可以固定在電迴路基板；以及導引部(130)，其係導引插頭的導引片；收納部(110)配置多個，且與電迴路基板的面平行；卡止孔(120)配置一對在多個收納部的兩外側，且具有可以與卡止片卡止的卡止凹窪部(121)；卡止凹窪部(121)配置成彼此朝向外側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:插頭</p>  
        <p type="p">200b:插頭本體</p>  
        <p type="p">213b:止動件卡合部</p>  
        <p type="p">220:卡止片</p>  
        <p type="p">221:卡止突出部</p>  
        <p type="p">222:解除操作部</p>  
        <p type="p">230:導引片</p>  
        <p type="p">240:間隔件</p>  
        <p type="p">250:彈簧</p>  
        <p type="p">260b:止動件</p>  
        <p type="p">270:多芯套接管(插頭)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1049" publication-number="202610543"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610543.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610543</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>纖維狀油脂結晶及其製造方法</chinese-title>  
        <english-title>FIBROUS OIL CRYSTAL AND ITS MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">A23D9/04</main-classification>  
        <further-classification edition="200601120251210B">A61K47/14</further-classification>  
        <further-classification edition="200601120251210B">A61Q19/00</further-classification>  
        <further-classification edition="200601120251210B">A61K8/37</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三吉油脂股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYOSHI OIL &amp; FAT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大石憲孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OISHI, NORITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種纖維狀油脂結晶。纖維狀油脂結晶可藉由包括下列步驟之方法製造。</p>  
        <p type="p">混合作為纖維狀油脂結晶的原料之油脂及親油性溶劑，在加溫下使前述油脂溶解於親油性溶劑，而調製溶液之步驟；</p>  
        <p type="p">冷卻前述溶液，促進結晶核的生成之步驟；及</p>  
        <p type="p">將前述冷卻後的前述溶液升溫並保管，促進前述纖維狀油脂結晶的成長之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides fibrous oil crystals. Fibrous oil crystals can be manufactured by a method containing the following steps:</p>  
        <p type="p">a step of mixing an oil or fat that is a raw material for fibrous oil crystals with a lipophilic solvent, and dissolving the oil or fat in the lipophilic solvent under heating to prepare a solution;</p>  
        <p type="p">a step of cooling the solution and promoting the generation of crystal nuclei; and</p>  
        <p type="p">a step of heating and storing the cooled solution to promote growth of the fibrous fat crystals.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1050" publication-number="202610784"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610784.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610784</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118913</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於將緊固件驅動到工件中的裝置及方法</chinese-title>  
        <english-title>A DEVICE AND A METHOD FOR DRIVING A FASTENER INTO A WORKPIECE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">B25C1/04</main-classification>  
        <further-classification edition="200601120251212B">B25C1/06</further-classification>  
        <further-classification edition="200601120251212B">F16K31/02</further-classification>  
        <further-classification edition="200601120251212B">F15B11/06</further-classification>  
        <further-classification edition="200601120251212B">G05D16/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>列支敦斯登商希爾悌股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILTI AKTIENGESELLSCHAFT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍爾曼　伯恩哈德　安德斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORMANN, BERNHARD ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史丹姆　潔格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAMM, JOERG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>察納　馬里奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZAHNER, MARIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>休爾特　蘇稻弗　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHULTE SUEDHOFF, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容關於一種用於將緊固件驅動到工件中的裝置，該裝置包括： &lt;br/&gt;空氣彈簧腔室、活塞，其中該活塞以該活塞可沿著驅動軸線移動的方式佈置在該空氣彈簧腔室內；加壓容積，其中，該加壓容積至少部分地由壓力腔室形成；氣流調節元件，其中，該氣流調節元件被配置成在該氣流調節元件的關閉位置中將該加壓容積的第一腔室隔室相對於該加壓容積的第二腔室隔室密封；電力驅動的驅動單元，該電力驅動的驅動單元用於該氣流調節元件；其中，該電力驅動的驅動單元被配置成用於將該氣流調節元件從該氣流調節元件的關閉位置帶到該氣流調節元件的至少一個打開位置中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a device for driving a fastener into a workpiece comprising: an air spring chamber, a piston, wherein the piston is arranged within the air spring chamber in a manner that the piston is moveable along a drive axis; a pressurized volume, wherein the pressurized volume is at least partially formed by a pressure chamber; an air flow regulating element, wherein the air flow regulating element is configured to seal, in a closed position of the air flow regulating element, a first chamber compartment of the pressurized volume from a second chamber compartment of the pressurized volume; an electrically driven driving unit for the air flow regulating element; wherein the electrically driven driving unit is configured for bringing the air flow regulating element from the closed position of the air flow regulating element in at least one open position of the air flow regulating element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:裝置</p>  
        <p type="p">112:空氣彈簧腔室</p>  
        <p type="p">114:活塞</p>  
        <p type="p">116:第一壁</p>  
        <p type="p">120:壓力腔室</p>  
        <p type="p">122:第二壁</p>  
        <p type="p">124:氣流調節元件</p>  
        <p type="p">126:第一腔室隔室</p>  
        <p type="p">128:第二腔室隔室</p>  
        <p type="p">130:驅動軸線</p>  
        <p type="p">132:預載入方向</p>  
        <p type="p">134:緊固方向</p>  
        <p type="p">136:電力驅動的驅動單元</p>  
        <p type="p">138:感測單元</p>  
        <p type="p">140:工件接觸單元</p>  
        <p type="p">142:用戶輸入單元</p>  
        <p type="p">144:另外的用戶輸入單元</p>  
        <p type="p">146:檢測裝置</p>  
        <p type="p">148:控制單元</p>  
        <p type="p">150:驅動器</p>  
        <p type="p">152:工作接觸元件</p>  
        <p type="p">156:預載入驅動單元</p>  
        <p type="p">158:觸發器</p>  
        <p type="p">160:致動器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1051" publication-number="202612054"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612054.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612054</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118924</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體供應裝置、氣體供應系統及氣體供應方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/67</main-classification>  
        <further-classification edition="200601120251210B">H01L21/205</further-classification>  
        <further-classification edition="200601120251210B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大陽日酸股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO NIPPON SANSO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙洋志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水秀治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, HIDEHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩本竜弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAMOTO, TATSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和田吉史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WADA, YOSHIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種氣體供應裝置、氣體供應系統及氣體供應方法，其可於使用工業用氣體的現場產生並穩定地供應該工業用氣體。氣體供應裝置包括：自包含原料氣體成分的原料氣體獲得產品氣體的處理部、向處理部供應原料氣體的配管、以及自處理部送出產品氣體的配管。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理部</p>  
        <p type="p">2:分離部</p>  
        <p type="p">3:監視部</p>  
        <p type="p">4:回收部</p>  
        <p type="p">4A:第一回收部</p>  
        <p type="p">4B:第二回收部</p>  
        <p type="p">5:分配部</p>  
        <p type="p">9:處理室</p>  
        <p type="p">10:反應室</p>  
        <p type="p">21:第一分離器</p>  
        <p type="p">22:第二分離器</p>  
        <p type="p">29、72、74、79a、79b、81、82、83、84:配管</p>  
        <p type="p">30:產品監視部</p>  
        <p type="p">31、32:殘渣監視部</p>  
        <p type="p">41:第一分離回收機(回收單元)</p>  
        <p type="p">42:第二分離回收機(回收單元)</p>  
        <p type="p">71:配管(導入部)</p>  
        <p type="p">73:配管(送出部)</p>  
        <p type="p">79:供應配管群組</p>  
        <p type="p">81a、82a:泵</p>  
        <p type="p">85、86:排氣配管</p>  
        <p type="p">89:混合機</p>  
        <p type="p">100:氣體供應裝置</p>  
        <p type="p">200:氣體供應系統</p>  
        <p type="p">C:控制部</p>  
        <p type="p">S:供應源</p>  
        <p type="p">S1、S2:缸體單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1052" publication-number="202612085"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612085.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612085</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118946</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板搬運系統</chinese-title>  
        <english-title>SUBSTRATE TRANSFER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/677</main-classification>  
        <further-classification edition="200601120251210B">B25J13/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋崎知</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIZAKI, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水一平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, IPPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明旨在提供一種基板搬運系統，基板搬運系統(1)包括水平多關節型機器人(2)、相機(5)以及控制器(18、20)，水平多關節型機器人(2)具有保持基板(9)的手部(3)，並搬運基板(9)，相機(5)拍攝基板(9)，控制器(18、20)接收相機的拍攝數據，檢測基板的顏色、溫度或者表面的潤濕。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An objective of the present invention is to provide a substrate transfer system. A substrate transfer system (1) includes a horizontal articulated robot (2), a camera (5) and controllers (18, 20), wherein the horizontal articulated robot (2) has a hand (3) for holding and transporting a substrate (9); the camera (5) photographs the substrate, and the controllers (18, 20) receives photographic data from the camera and detects the color, temperature or surface wetness of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:手部</p>  
        <p type="p">5:相機</p>  
        <p type="p">9:基板</p>  
        <p type="p">30:把持部</p>  
        <p type="p">31:主體</p>  
        <p type="p">32:保持部</p>  
        <p type="p">33:邊緣導引件</p>  
        <p type="p">34:第二導引件</p>  
        <p type="p">35:致動器</p>  
        <p type="p">36:感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1053" publication-number="202610795"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610795.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610795</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119028</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>押出成形機之混練狀態評價裝置及混練狀態評價方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">B29B7/72</main-classification>  
        <further-classification edition="200601120251203B">G01N29/14</further-classification>  
        <further-classification edition="200601120251203B">B29B7/82</further-classification>  
        <further-classification edition="201901120251203B">B29C48/92</further-classification>  
        <further-classification edition="200601120251203B">G01N11/00</further-classification>  
        <further-classification edition="200601120251203B">G05B19/401</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商芝浦機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBAURA MACHINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人金澤大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾原正俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHARA, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKI, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之混練狀態評價裝置(10)係評價對原料添加賦予規定之物理特性之填料、由雙軸押出成形機(30)混練時之混練狀態者，包含：溫度分佈選擇部(61)，其基於預先取得之與在雙軸押出成形機之機筒(32)之複數個溫度分佈下分別混練出之混練物相應之物理特性，選擇獲得與添加之填料之量相應之理想之物理特性之混練物的機筒之溫度分佈；溫度分佈設定部(62)，其將機筒之溫度分佈設定為所選擇之溫度分佈；混練控制部(63)，其在設定之機筒之溫度分佈下進行混練；AE信號檢測部(64)，其在進行混練時，檢測由設置於機筒之表面之AE感測器(20)輸出之信號強度；及混練狀態判定部(65)，其在AE信號檢測部檢測到規定之值之信號強度時，判定為正在進行適切之混練。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:混練狀態評價裝置</p>  
        <p type="p">11:控制部</p>  
        <p type="p">61:溫度分佈選擇部</p>  
        <p type="p">62:溫度分佈設定部</p>  
        <p type="p">63:混練控制部</p>  
        <p type="p">64:AE信號檢測部</p>  
        <p type="p">65:混練狀態判定部</p>  
        <p type="p">66:混練狀態報知部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1054" publication-number="202610891"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610891.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610891</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119062</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車變速器及控制自行車變速器之方法</chinese-title>  
        <english-title>BICYCLE DERAILLEUR AND METHOD OF CONTROLLING BICYCLE DERAILLEUR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251205B">B62M6/40</main-classification>  
        <further-classification edition="201001120251205B">B62M6/45</further-classification>  
        <further-classification edition="200601120251205B">B62M9/12</further-classification>  
        <further-classification edition="201001120251205B">B62M9/122</further-classification>  
        <further-classification edition="201001120251205B">B62M9/132</further-classification>  
        <further-classification edition="200601120251205B">B62M25/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤本尚希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMOTO, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立花克裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TACHIBANA, KATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田裕太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種自行車變速器，其包括一基座構件、一可移動構件、一馬達單元及一控制器。該控制器經組態以控制該馬達單元以在鏈條沿一第一換檔方向之一第一換檔操作期間在一第一最大電壓下使該馬達單元之一輸出軸件旋轉。該控制器經組態以控制該馬達單元以在該鏈條沿一第二換檔方向之一第二換檔操作期間在一第二最大電壓下使該馬達單元之該輸出軸件旋轉。該第一最大電壓不同於該第二最大電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bicycle derailleur comprises a base member, a movable member, a motor unit, and a controller. The controller is configured to control the motor unit to rotate an output shaft of the motor unit at a first maximum voltage during a first shifting operation of the chain in a first shifting direction. The controller is configured to control the motor unit to rotate the output shaft of the motor unit at a second maximum voltage during a second shifting operation of the chain in a second shifting direction. The first maximum voltage is different from the second maximum voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:操作裝置</p>  
        <p type="p">14:可移動構件</p>  
        <p type="p">34:馬達單元</p>  
        <p type="p">CS11:第一控制信號</p>  
        <p type="p">CS12:第二控制信號</p>  
        <p type="p">DS11:第一調整距離</p>  
        <p type="p">DS12:第一返回距離</p>  
        <p type="p">DS21:第二調整距離</p>  
        <p type="p">DS22:第二返回距離</p>  
        <p type="p">EP1:第一電力量</p>  
        <p type="p">EP2:第二電力量</p>  
        <p type="p">EP31:第三電力量</p>  
        <p type="p">EP32:第三電力量</p>  
        <p type="p">MV1:第一最大電壓</p>  
        <p type="p">MV2:第二最大電壓</p>  
        <p type="p">MV31:第三最大電壓</p>  
        <p type="p">MV32:第三最大電壓</p>  
        <p type="p">P1:第一齒輪位置</p>  
        <p type="p">P2:第二齒輪位置</p>  
        <p type="p">P11:第一初始齒輪位置</p>  
        <p type="p">P12:第一調整齒輪位置</p>  
        <p type="p">P21:第二初始齒輪位置</p>  
        <p type="p">P22:第二調整齒輪位置</p>  
        <p type="p">P41:第一超行程位置</p>  
        <p type="p">P42:第二超行程位置</p>  
        <p type="p">PW1:第一輸出功率</p>  
        <p type="p">PW2:第二輸出功率</p>  
        <p type="p">PW31:第三輸出功率</p>  
        <p type="p">PW32:第三輸出功率</p>  
        <p type="p">RG1:齒輪對應區</p>  
        <p type="p">RG21:超行程區</p>  
        <p type="p">RG22:超行程區</p>  
        <p type="p">SP1:第一移動速度</p>  
        <p type="p">SP2:第二移動速度</p>  
        <p type="p">SP31:第三移動速度</p>  
        <p type="p">SP32:第三移動速度</p>  
        <p type="p">T1:第一方向操作時間</p>  
        <p type="p">T2:第二方向操作時間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1055" publication-number="202612182"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612182.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612182</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119068</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高速、高頻寬、高功率卡緣連接器</chinese-title>  
        <english-title>High-speed, high bandwidth, and high-power card edge connectors</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251210B">H01R12/75</main-classification>  
        <further-classification edition="201101120251210B">H01R12/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安費諾商用電子産品（成都）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMPHENOL COMMERCIAL PRODUCTS (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王菁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易陸雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, LUYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種高速、高頻寬、高功率卡緣連接器。連接器可以被配置為接收電路板的邊緣部分，該邊緣部分具有由凹口彼此分開的多個插入部分。連接器包括多個插槽，每個插槽被配置為接收相應的插入部分。第一插槽提供到電力導體的通路。第二插槽提供到電力導體和信號導體兩者的通路。其他插槽提供到信號導體的通路。信號導體可以被配置為提供高速信號傳輸（例如，採用PAM4的112 GT/s）或邊帶信號傳輸。電力導體可以被配置為提供高功率傳輸（例如，200 W），從而能夠支援更耗電的設備，比如AI加速器、存儲控制器或網路模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">High-speed, high bandwidth, and high-power card edge connectors. A connector can be configured to receive a circuit board’s edge portion that has multiple insertion portions separated from each other by notches. The connector include multiple slots, each of which is configured to receive a respective insertion portion. A first slot provides access to power conductors. A second slot provides access to both power and signal conductors. The other slots provide access to signal conductors. The signal conductors can be configured to provide high-speed signal transmission (e.g., 112 GT/s with PAM4) or sideband signal transmission. The power c5onductors can be configured to provide high-power transmission (e.g., 200 W), enabling support for more power-hungry devices like AI accelerators, storage controllers, or networking modules.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子系統</p>  
        <p type="p">10:電連接器</p>  
        <p type="p">100:殼體</p>  
        <p type="p">3:電部件</p>  
        <p type="p">36a、34b、36c、36d、36e、36f:插入部分</p>  
        <p type="p">40:線纜</p>  
        <p type="p">103a:第一插槽</p>  
        <p type="p">103b:第二插槽</p>  
        <p type="p">103c:第三插槽</p>  
        <p type="p">103d:第四插槽</p>  
        <p type="p">103e:第五插槽</p>  
        <p type="p">103f:第六插槽</p>  
        <p type="p">400:元件殼體</p>  
        <p type="p">700:後部構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1056" publication-number="202610810"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610810.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610810</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119094</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反應性染料</chinese-title>  
        <english-title>REACTIVE DYES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">B29D11/00</main-classification>  
        <further-classification edition="200601120251212B">C08F8/30</further-classification>  
        <further-classification edition="200601120251212B">C08F8/34</further-classification>  
        <further-classification edition="200601120251212B">C09B62/04</further-classification>  
        <further-classification edition="200601120251212B">C09B62/085</further-classification>  
        <further-classification edition="200601120251212B">G02B1/04</further-classification>  
        <further-classification edition="200601320251212B">B29K83/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商愛爾康公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALCON INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭德　特洛伊　維農</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLLAND, TROY VERNON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布里克夫　里查德　查里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREITKOPF, RICHARD CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　偉康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於反應性染料，該等反應性染料各自包含二氯三𠯤或氯三𠯤基團並且具有期望的UV/可見光吸收光譜以選擇性地過濾某種彩色光。它們適用於生產各自由具有羥基的矽酮水凝膠材料製成的有色的矽酮水凝膠接觸鏡片之方法。本發明還關於一種有色的矽酮水凝膠接觸鏡片，該有色的矽酮水凝膠接觸鏡片包括有色環形圈和/或有色圓形區域，將反應性染料施加在其中並由此共價附接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is related to reactive dyes each of which comprises a dichlorotriazine or chlorotriazine group and has a desired UV/visible absorption spectrum for selectively filtering a certain color light. They are suitable for method for producing colored silicone hydrogel contact lenses each made of a silicone hydrogel material having hydroxyl groups. The present invention is also related to a colored silicone hydrogel contact lens comprising a colored annular ring and/or a colored circular area in which a reactive dye is applied and thereby covalently attached.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1057" publication-number="202612442"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612442.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612442</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119148</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及其形成方法</chinese-title>  
        <english-title>MEMORY DEVICES AND FORMING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251001B">H10B10/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳亭昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TING-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　露</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於CFET SRAM裝置的單元設計，使用中間帶狀單元來將裝置的後側連接至其前側。本揭示文件提供一種記憶體裝置，包含基板、單元陣列及中間帶狀單元陣列。基板包括前側及與前側相對的後側。單元陣列設置在基板上方，包括在記憶體裝置的俯視圖中沿著第一方向分離且各自包括多個單元的第一陣列部分與第二陣列部分。中間帶狀單元陣列沿著第一方向設置在第一、第二陣列部分之間，包括在俯視圖中沿著垂直於第一方向的第二方向配置的多個中間帶狀單元。每個中間帶狀單元包括通孔結構，通孔結構用以將參考電壓信號從基板後側輸送至基板前側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Cell designs are proposed for power distribution in a CFET SRAM device using middle strap cells to connect a backside of the device to a frontside thereof. A device includes a cell array disposed over a substrate. The cell array includes a first array portion and a second array portion separated along a first direction in a top view of the device. The device further includes a middle strap cell array disposed between the first array portion and the second array portion along the first direction. The middle strap cell array includes a plurality of middle strap cells arranged along a second direction perpendicular to the first direction in the top view. Each middle strap cell includes a via structure configured to deliver a reference voltage signal from a backside of the substrate to a frontside of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:記憶體裝置</p>  
        <p type="p">101:記憶體塊</p>  
        <p type="p">102:第一記憶體陣列</p>  
        <p type="p">102A:第一陣列部分</p>  
        <p type="p">102B:第二陣列部分</p>  
        <p type="p">104:第二記憶體陣列</p>  
        <p type="p">104A:第一陣列部分</p>  
        <p type="p">104B:第二陣列部分</p>  
        <p type="p">110:I/O電路/組件</p>  
        <p type="p">120:控制邏輯電路/組件</p>  
        <p type="p">130:字元線驅動器/組件</p>  
        <p type="p">140:功率分接單元</p>  
        <p type="p">152A:第一MSC陣列</p>  
        <p type="p">154A:第二MSC陣列</p>  
        <p type="p">NW’:寬度</p>  
        <p type="p">W:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1058" publication-number="202612055"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612055.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612055</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119181</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板液處理裝置、基板液處理方法及畫像處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">H01L21/67</main-classification>  
        <further-classification edition="202401120251211B">G06T5/73</further-classification>  
        <further-classification edition="201701120251211B">G06T7/00</further-classification>  
        <further-classification edition="201701120251211B">G06T7/73</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴上元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SANGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久野和哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISANO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種有利於確認被浸漬於處理液之後的基板是否藉由基板保持構件適當地被保持的技術。 &lt;br/&gt;　　[解決手段]基板液處理裝置具備：貯留處理液的處理槽；以起立姿勢且彼此隔著間隔並列地支持複數基板的基板支持構件；支持移動部，其使基板支持構件移動，以將複數基板配置在定位於處理槽內以便浸漬於處理液的處理位置，及定位於處理槽外的退避位置；攝像部，其取得複數基板之外周端面的攝像畫像；以及畫像處理部，其根據被浸漬於處理液之前的複數基板的外周端面的攝像畫像，與被浸漬於處理液之後的複數基板的外周端面的攝像畫像之間的比較，進行因應被浸漬於處理液之前的複數基板，與被浸漬於處理液之後的複數基板之間之位置偏差的判定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:蝕刻處理裝置</p>  
        <p type="p">8:基板</p>  
        <p type="p">8a:外周端面</p>  
        <p type="p">34:處理槽</p>  
        <p type="p">34A:內槽</p>  
        <p type="p">34B:外槽</p>  
        <p type="p">36B:基板支持構件</p>  
        <p type="p">71:第1蓋體</p>  
        <p type="p">72:第2蓋體</p>  
        <p type="p">74:基板按壓件</p>  
        <p type="p">90:攝影機</p>  
        <p type="p">92:照明部</p>  
        <p type="p">92a:點光源</p>  
        <p type="p">94:畫像處理部</p>  
        <p type="p">100:風扇過濾器單元</p>  
        <p type="p">Pa:處理位置</p>  
        <p type="p">Pb:退避位置</p>  
        <p type="p">N:缺口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1059" publication-number="202611504"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611504.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611504</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>逐片式熱處理爐的金屬污染評價方法及半導體晶圓的製造方法</chinese-title>  
        <english-title>EVALUATION METHOD OF METAL CONTAMINATION OF SINGLE WAFER PROCESSING HEAT TREATMENT FURNACE AND FABRICATING METHOD OF SEMICONDUCTOR WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01N21/896</main-classification>  
        <further-classification edition="200601120251201B">H01L21/66</further-classification>  
        <further-classification edition="200601120251201B">H01L21/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMCO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川端友朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABATA, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的是提供評價逐片式熱處理爐的金屬污染的嶄新方法。逐片式熱處理爐的金屬污染評價方法，包含：在評價對象之逐片式熱處理爐，對複數個半導體晶圓實施在此熱處理爐所具備的載置部件上載置並熱處理半導體晶圓；針對上述熱處理後的複數個半導體晶圓，分別取得面內特性值分佈資訊，其中上述複數個半導體晶圓在上述載置部件上，半導體晶圓的基準方向對載置時基準角度方向所成角度θ各自不同；以及對於上述取得的複數個面內特性值分佈資訊的一個以上實施修正處理；其中上述修正處理定出前述角度θ的基準角度θr，針對前述角度θ為θr以外的半導體晶圓的面內特性值分佈資訊，進行基於θ與θr的角度差的座標修正，藉此將面內特性值分佈資訊的座標資訊修正為以基準角度θr載置的情況的在前述載置部件上的位置座標；以及基於在包含前述修正處理後的面內特性值分佈資訊之複數個面內特性值分佈資訊是否在同一區域內觀察到特性值異常位置，評價前述熱處理爐的金屬污染。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A new method for evaluating metal contamination of a single wafer processing heat treatment furnace is provided. The evaluation method of metal contamination of single wafer processing heat treatment furnace includes processing a plurality of semiconductor wafers to place and heat treat the semiconductor wafers on a carrying component provided in the heat treatment furnace; obtaining in-plane characteristic value distribution information for each of the plurality of semiconductor wafers after the heat treatment, wherein the plurality of semiconductor wafers have different angles θ of the reference direction of the semiconductor wafers relative to the reference angular direction at the time of placement on the carrying component; and performing correction processing for one or more of the obtained plurality of in-plane characteristic value distribution information, wherein the correction processing corrects the position coordinate of the in-plane characteristic value distribution information to the position coordinate on the carrying component when the semiconductor wafer is placed at the reference angle θr by determining a reference angle θr for the above angle θ and performing coordinate correction based on the angle difference between θ and θr for the in-plane characteristic value distribution information of the semiconductor wafer whose angle θ is other than θr; and evaluating the metal contamination of the heat treatment furnace based on whether or not abnormal characteristic value positions are observed in the same area in multiple in-plane characteristic value distribution information including the in-plane characteristic value distribution information after the above correction processing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1060" publication-number="202611317"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611317.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611317</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119215</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁控濺鍍陰極、操作磁控濺鍍陰極的方法、濺鍍沉積源、沉積設備及操作濺鍍沉積源的方法</chinese-title>  
        <english-title>MAGNETRON SPUTTER CATHODE, METHOD OF OPERATING A MAGNETRON SPUTTER CATHODE, SPUTTER DEPOSITION SOURCE, DEPOSITION APPARATUS, AND METHOD OF OPERATING A SPUTTER DEPOSITION SOURCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C23C14/35</main-classification>  
        <further-classification edition="200601120251210B">C23C14/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗田真一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了磁控濺鍍陰極（100）。磁控濺鍍陰極（100）包含至少一個磁體組件（120），磁體組件包括連接第一永磁體（121）、第二永磁體（122）和第三永磁體（123）的磁軛（130）。此外，磁控濺鍍陰極（100）還包含圍繞磁軛（130）設置的至少一個線圈（140）。另外，本文還描述了操作磁控濺鍍陰極的方法、一種濺鍍沉積源及操作濺鍍沉積源的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magnetron sputter cathode (100) is described. The magnetron sputter cathode (100) at least one magnet assembly (120) including a yoke (130) connecting a first permanent magnet (121), a second permanent magnet (122) and a third permanent magnet (123). Further, the magnetron sputter cathode (100) includes the at least one coil (140) provided around the yoke (130). Additionally, a method of operating a magnetron sputter cathode, a sputter deposition source, and a method of operating a sputter deposition source are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:磁控濺鍍陰極</p>  
        <p type="p">110:中空的旋轉靶</p>  
        <p type="p">120:磁體組件</p>  
        <p type="p">121:第一永磁體</p>  
        <p type="p">122:第二永磁體</p>  
        <p type="p">123:第三永磁體</p>  
        <p type="p">130:磁軛</p>  
        <p type="p">140:線圈</p>  
        <p type="p">170:磁場</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1061" publication-number="202611874"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611874.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611874</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>計量方法及系統</chinese-title>  
        <english-title>METROLOGY METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251210B">G06V10/25</main-classification>  
        <further-classification edition="202201120251210B">G06V10/22</further-classification>  
        <further-classification edition="200601120251210B">G06T5/50</further-classification>  
        <further-classification edition="202201120251210B">G06V30/14</further-classification>  
        <further-classification edition="201701120251210B">G06T7/55</further-classification>  
        <further-classification edition="200601120251210B">G01C11/06</further-classification>  
        <further-classification edition="201701120251210B">G06T7/62</further-classification>  
        <further-classification edition="202301120251210B">G06F18/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商諾威股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVA LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪莎瓦里阿尼　夫拉地米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACHAVARIANI, VLADIMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科雷特　羅伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORET, ROY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎德爾　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANDEL, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋爾　阿芙倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GER, AVRON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提出了一種用於圖案化結構的計量測量的控制系統，包括數據處理系統，該數據處理系統包括：尺寸計量幾何引擎，提供該結構的預定關注區域ROI的幾何模型；圖像處理方案提供商，生成指示預定義圖像處理方案的數據；合成圖像數據生成器，利用幾何模型並生成與ROI的合成HRI圖像數據相對應的圖像數據；優化模組，被配置為處理第一和第二HRI相關數據之間的輸入相關性數據，第一和第二HRI相關數據分別是指示與ROI的測量的幾何參數相關聯的預定義位置訊息的非圖像數據以及指示合成HRI圖像數據的數據，並生成用於結構的計量測量的ROI的優化幾何模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A control system for use in metrology measurements of patterned structures is presented, which comprises a data processing system comprising: a dimensional metrology geometrical engine providing a geometric model of a predetermined region of interest (ROI) of the structure; an image processing recipe provider generating data indicative of predefined image processing recipe; a synthetic image data generator utilizing said geometrical model and generating image data corresponding to a synthetic HRI image data of said ROI; and an optimization module configured for: processing input correlation data between first and second HRI-related data being, respectively, non-image data indicative of predefined position information associated with measured geometric parameter(s) of the ROI and data indicative of said synthetic HRI image data; and generating an optimized geometric model of the ROI for use in the metrology measurements of the structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:控制系統</p>  
        <p type="p">12:數據輸入實用程式</p>  
        <p type="p">14:數據輸出實用程式</p>  
        <p type="p">16:儲存實用程式</p>  
        <p type="p">18、46:通訊實用程式</p>  
        <p type="p">20:數據處理系統</p>  
        <p type="p">22:尺寸計量幾何引擎</p>  
        <p type="p">24、30:優化模組</p>  
        <p type="p">25:圖像處理方案提供商</p>  
        <p type="p">26:合成TEM圖像生成器</p>  
        <p type="p">28:分析器</p>  
        <p type="p">40:TEM數據提供商</p>  
        <p type="p">42:TEM圖像處理器</p>  
        <p type="p">48:提取器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1062" publication-number="202611557"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611557.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611557</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119249</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學元件、輥母盤及光學元件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251204B">G02B1/118</main-classification>  
        <further-classification edition="200601120251204B">B29C59/04</further-classification>  
        <further-classification edition="201101120251204B">B82Y20/00</further-classification>  
        <further-classification edition="201501120251204B">G02B1/11</further-classification>  
        <further-classification edition="200601120251204B">B32B3/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪睿合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梶谷俊一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJIYA, SHUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">光學元件具備：基材11；及複數個凸狀的構造體3，在基材11的至少一個表面上，以可見光的波長帶以下的間距來配置排列，構造體3具有複合構造，前述複合構造是由形成於基材11的表面上的第1錐形部31、及形成於第1錐形部31上的第2錐形部32所構成，第2錐形部32的錐形比C&lt;sub&gt;2&lt;/sub&gt;比第1錐形部31的錐形比C&lt;sub&gt;1&lt;/sub&gt;更小，第2錐形部32具有比第1錐形部31更細的針狀之錐形形狀，構造體3的高度h為400nm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學薄膜</p>  
        <p type="p">2:微細凹凸構造</p>  
        <p type="p">3:構造體</p>  
        <p type="p">4:凹部</p>  
        <p type="p">11:基材</p>  
        <p type="p">12:樹脂層</p>  
        <p type="p">31:第1錐形部(錐形部)</p>  
        <p type="p">32:第2錐形部(錐形部)</p>  
        <p type="p">33:變化點</p>  
        <p type="p">C&lt;sub&gt;1&lt;/sub&gt;,C&lt;sub&gt;2&lt;/sub&gt;:錐形比</p>  
        <p type="p">h,h&lt;sub&gt;1&lt;/sub&gt;,h&lt;sub&gt;2&lt;/sub&gt;:高度</p>  
        <p type="p">P:間距</p>  
        <p type="p">X:X方向</p>  
        <p type="p">Y:Y方向</p>  
        <p type="p">Z:Z方向</p>  
        <p type="p">φ&lt;sub&gt;1&lt;/sub&gt;,φ&lt;sub&gt;2&lt;/sub&gt;,φ&lt;sub&gt;3&lt;/sub&gt;:直徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1063" publication-number="202612459"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612459.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612459</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119260</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250605B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長鑫科技集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CXMT CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白　世杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAI, SHIJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛薄輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENG, BOHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>饒得鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAO, DEPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開實施例提供了一種半導體結構，包括多行第一字線和多條第一導電線，各第一導電線與奇數行或偶數行的各第一字線對應設置且彼此連接；多個第一導電觸點與各第一導電線對應設置，多個第二導電觸點與各第一導電觸點對應設置且彼此隔離；各第二導電觸點連接至各第一接觸墊。本公開實施例的半導體結構具有更為簡單的互連方式，在增加訊號密度的同時，簡化工藝流程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體結構</p>  
        <p type="p">10:第一記憶單元陣列</p>  
        <p type="p">11:第一互連區域</p>  
        <p type="p">20:第二互連區域</p>  
        <p type="p">110:第一字線</p>  
        <p type="p">111:第一位線</p>  
        <p type="p">120:第一導電線</p>  
        <p type="p">122:第三導電線</p>  
        <p type="p">140、141、142、143:第一導電觸點</p>  
        <p type="p">201、202、203、204:第二導電觸點</p>  
        <p type="p">A1-A2:剖面線</p>  
        <p type="p">D0、D1:最小間距</p>  
        <p type="p">FC:第一導電觸點組合</p>  
        <p type="p">SC:第二導電觸點組合</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1064" publication-number="202610824"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610824.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610824</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119264</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器用金屬板、容器用金屬板的製造方法，及罐的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B15/09</main-classification>  
        <further-classification edition="200601120251201B">B32B27/18</further-classification>  
        <further-classification edition="200601120251201B">B32B27/40</further-classification>  
        <further-classification edition="200601120251201B">B32B37/06</further-classification>  
        <further-classification edition="200601120251201B">B32B37/14</further-classification>  
        <further-classification edition="200601120251201B">B32B37/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＦＥ鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋譲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YUZURU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>氏平智章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UJIHIRA, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤本聡一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMOTO, SOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山中洋一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANAKA, YOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種容器用金屬板等，其具有樹脂被膜層，該樹脂被膜層具有滿足作為金屬容器加工時對樹脂被膜層所要求之物性，且即使施以成形加工及熱處理時亦具有良好外觀。容器用金屬板具有設置於金屬板的至少一者之面上的樹脂被膜層。前述樹脂被膜層包含聚酯樹脂，且積層有複數個樹脂層。前述樹脂被膜層之280℃下之表面張力為26mN/m以上、40mN/m以下。前述樹脂被膜層之280℃下之複數黏度為36Pa•s以上、100Pa•s以下。前述複數個樹脂層具有含有白色顏料的顏料層，以及含有0.01質量%以上、1.15質量%以下之潤滑成分的潤滑層。前述潤滑層配置於前述複數個樹脂層的最外側。前述潤滑層的前述潤滑成分包含含有極性基之聚烯烴。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:金屬板</p>  
        <p type="p">11:表面</p>  
        <p type="p">12:背面</p>  
        <p type="p">20:樹脂被膜層</p>  
        <p type="p">21:第1樹脂層</p>  
        <p type="p">22:第2樹脂層</p>  
        <p type="p">23:第3樹脂層</p>  
        <p type="p">30:樹脂被膜層</p>  
        <p type="p">31:第1樹脂層</p>  
        <p type="p">32:第2樹脂層</p>  
        <p type="p">33:第3樹脂層</p>  
        <p type="p">100:容器用金屬板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1065" publication-number="202611713"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611713.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611713</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119277</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接收器及包括接收器之電子系統</chinese-title>  
        <english-title>RECEIVER AND ELECTRONIC SYSTEM INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G06F11/07</main-classification>  
        <further-classification edition="200601120251103B">G06F13/42</further-classification>  
        <further-classification edition="200601120251103B">G06F13/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙康兌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, KANGTAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金宇一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, WOOIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種電子系統，其包括：一第一電子裝置，其包括經組態以傳輸資料之一發送器；以及一第二電子裝置，其包括經組態以接收該資料之一接收器，其中該發送器經組態以：將一時脈信號、一啟用信號及一心跳信號傳輸至該接收器；回應於該時脈信號及該啟用信號而更新一發送計數值；以及在該發送計數值係一第一值時生成該心跳信號，並且其中該接收器經組態以：回應於該時脈信號及該啟用信號而更新一接收計數值；以及在接收到該心跳信號後，在該接收計數值不具有該第一值時生成一錯誤信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic system including:a first electronic device including a sender that is configured to transmit data; and a second electronic device including a receiver that is configured to receive the data, wherein the sender is configured to:transmit a clock signal, an enable signal, and a heartbeat signal to the receiver; update a sending count value in response to the clock signal and the enable signal; and generate the heartbeat signal when the sending count value is a first value, and wherein the receiver is configured to:update a receiving count value in response to the clock signal and the enable signal; and generate an error signal when the receiving count value does not have the first value upon receipt of the heartbeat signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:發送器</p>  
        <p type="p">510:時脈生成區塊</p>  
        <p type="p">520:啟用信號生成區塊</p>  
        <p type="p">530:發送器計數區塊</p>  
        <p type="p">540:心跳生成區塊</p>  
        <p type="p">550:資料發送區塊</p>  
        <p type="p">600:接收器</p>  
        <p type="p">610:接收器計數區塊</p>  
        <p type="p">620:錯誤偵測區塊</p>  
        <p type="p">630:資料接收區塊</p>  
        <p type="p">CLK:時脈信號</p>  
        <p type="p">EN:啟用信號</p>  
        <p type="p">HB:心跳信號</p>  
        <p type="p">RCV:接收計數值</p>  
        <p type="p">SCL1:第一安全核心邏輯</p>  
        <p type="p">SCL2:第二安全核心邏輯</p>  
        <p type="p">SCV:發送計數值</p>  
        <p type="p">SIG21:第21信號線</p>  
        <p type="p">SIG22:第22信號線</p>  
        <p type="p">SIG23:第23信號線</p>  
        <p type="p">SIG24:第24信號線</p>  
        <p type="p">SP21:第21信號接腳</p>  
        <p type="p">SP22:第22信號接腳</p>  
        <p type="p">SP23:第23信號接腳</p>  
        <p type="p">SP24:第24信號接腳</p>  
        <p type="p">SP25:第25信號接腳</p>  
        <p type="p">SP26:第26信號接腳</p>  
        <p type="p">SP27:第27信號接腳</p>  
        <p type="p">SP28:第28信號接腳</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1066" publication-number="202611297"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611297.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611297</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119315</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由毛細管電泳偵測及量測反向末端重複序列缺失</chinese-title>  
        <english-title>DETECTING AND MEASURING INVERTED TERMINAL REPEAT DELETIONS BY CAPILLARY ELECTROPHORESIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251203B">C12Q1/683</main-classification>  
        <further-classification edition="200601120251203B">B01D15/26</further-classification>  
        <further-classification edition="200601120251203B">C07K1/16</further-classification>  
        <further-classification edition="200601120251203B">G01N27/447</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商再生元醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱內賈　賓迪亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNEJA, BINDIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆圖薩米　卡希爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUTHUSAMY, KATHIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩邁　普拉米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMAI, POULAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧何賽　克拉麗絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOU JOSE, CLARISSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕拉卡爾　妮莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PALACKAL, NISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派爾斯　艾莉卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PYLES, ERICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆勒　探克　斯溫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLLER-TANK, SVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩賓　利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SABIN, LEAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供用於判斷反向重複序列內存在缺失或突變之方法。此外，本揭示提供用於增加反向重複序列之穩定性的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods for determining the presence of a deletion or mutation within an inverted repeat sequence. In addition, the present disclosure provides methods for increasing the stability of an inverted repeat sequence.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1067" publication-number="202612042"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612042.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612042</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119401</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>將具有微細凸部的半導體裝置載入插件中的方法</chinese-title>  
        <english-title>METHOD OF LOADING SEMICONDUCTOR DEVICE WITH FINE BUMPS INTO INSERT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L21/66</main-classification>  
        <further-classification edition="200601120251204B">H01L21/68</further-classification>  
        <further-classification edition="201701120251204B">G06T7/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＡＴＥＣＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATECO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李澤善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TAEK SEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金虎男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HO NAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文成哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, SUNG CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵漢秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, HAN SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供將具有微細凸部的半導體裝置載入插件中的方法，包括：由第一視覺模組捕獲由拾取器拾取的半導體裝置的底部影像；由第二視覺模組捕獲插件的頂部影像；以及基於所述底部影像和頂部影像，由拾取器將半導體裝置載入插件中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The method of loading the semiconductor device having the fine bumps into the insert according to an embodiment of the disclosure comprises: by a first vision module, capturing a bottom image of the semiconductor device picked up by a picker; by a second vision module, capturing a top image of the insert; and by the picker, loading the semiconductor device into the insert, based on the bottom image and the top image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100~S400:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1068" publication-number="202611268"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611268.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611268</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119426</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>選擇性蝕刻液及SiGe基板的評估方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09K13/08</main-classification>  
        <further-classification edition="200601120251201B">G01N21/956</further-classification>  
        <further-classification edition="200601120251201B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大槻剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTSUKI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金井孝弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺嶋輝雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERASHIMA, TERUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種選擇性蝕刻液，用於檢測SiGe基板的缺陷，其中，該選擇性蝕刻液由氫氟酸、硝酸、醋酸、水之四元體系組成，各者的組成比為：HF是1.4～2%的範圍，HNO&lt;sub&gt;3&lt;/sub&gt;是33～38%的範圍，CH&lt;sub&gt;3&lt;/sub&gt;COOH是7～10%的範圍，H&lt;sub&gt;2&lt;/sub&gt;O是52～60%的範圍。藉此，提供一種適合檢測SiGe基板的缺陷之專用於SiGe基板的無鉻蝕刻液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1069" publication-number="202612536"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612536.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612536</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119442</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251204B">H10D89/10</main-classification>  
        <further-classification edition="202501120251204B">H10D88/00</further-classification>  
        <further-classification edition="202501120251204B">H10D80/20</further-classification>  
        <further-classification edition="200601120251204B">H01L23/488</further-classification>  
        <further-classification edition="200601120251204B">H01L23/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>先端系統技術研究組合</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESEARCH ASSOCIATION FOR ADVANCED SYSTEMS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川野連也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWANO, MASAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑田忠廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA, TADAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體模組，其包含：第1基板，包含第1面；堆疊記憶體晶片，設置於第1面之上並包含「堆疊起來之多個記憶體晶片」及「橫跨多個記憶體晶片而設置之第1電感器」；以及第1半導體晶片，設置於第1面之上同時與堆疊記憶體晶片分離，並包含第2電感器；其中堆疊記憶體晶片包含「與第1面平行之係為第1基板側的最外面之第2面」及「垂直於第2面之係為第1半導體晶片側的最外面之第3面」，第1電感器設置為平行於第3面並與第3面分離，第1半導體晶片包含「與第1面平行之係為第1基板側的最外面之第4面」及「與第3面平行之係為堆疊記憶體晶片側的最外面之第5面」，第2電感器設置為平行於第5面並與第5面分離，第1電感器與第2電感器以非接觸方式進行通訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體模組</p>  
        <p type="p">100:堆疊記憶體晶片</p>  
        <p type="p">100A:堆疊記憶體晶片</p>  
        <p type="p">100B:堆疊記憶體晶片</p>  
        <p type="p">100C:堆疊記憶體晶片</p>  
        <p type="p">200:第1半導體晶片</p>  
        <p type="p">220A:CPU</p>  
        <p type="p">220B:CPU</p>  
        <p type="p">220C:CPU</p>  
        <p type="p">30:堆疊晶片群</p>  
        <p type="p">300:堆疊DRAM</p>  
        <p type="p">300A:堆疊DRAM</p>  
        <p type="p">300B:堆疊DRAM</p>  
        <p type="p">400:支撐基板</p>  
        <p type="p">400A:支撐基板</p>  
        <p type="p">400B:支撐基板</p>  
        <p type="p">50:密封結構體</p>  
        <p type="p">60:封裝基板</p>  
        <p type="p">600:第2半導體晶片</p>  
        <p type="p">600A:第2半導體晶片</p>  
        <p type="p">620A:GPU</p>  
        <p type="p">620B:GPU</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1070" publication-number="202611533"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611533.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611533</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119468</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢查方法、檢查裝置及檢查系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01R31/304</main-classification>  
        <further-classification edition="200601120251201B">G01R31/18</further-classification>  
        <further-classification edition="200601120251201B">G01R29/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商山葉汎提克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAHA FINE TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田原浩登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAHARA, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安達俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADACHI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴川勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKAWA, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤友悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, YUGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笹岑敬一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAMINE, KEIICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎良一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASAKI, RYOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松浦秀紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUURA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之一態樣之檢查方法之特徵在於係藉由對檢查對象X施加檢查電壓或流通檢查電流而檢查配線基板P者，且檢查對象X係由絕緣體及導電體構成、供搭載電氣零件之配線基板P之一部分；使用複數個檢查；前述檢查具有：第1檢查，其檢查前述導電體或前述絕緣體之通電狀態；及第2檢查，其檢查前述導電體或前述絕緣體之通電狀態之時間序列資料；前述第1檢查之結果及前述第2檢查之結果被記錄於記錄裝置；前述檢查進一步具有第3檢查，該第3檢查於前述第1檢查及前述第2檢查之後，於在後續之工序中經處理且搭載有電氣零件之狀態下進行；前述第3檢查之結果與前述第1檢查之結果及前述第2檢查之結果建立關聯並記錄。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13:第2檢查裝置</p>  
        <p type="p">31:測定部</p>  
        <p type="p">32:取得部</p>  
        <p type="p">33:判定部</p>  
        <p type="p">34:機器學習模型</p>  
        <p type="p">35:顯示部</p>  
        <p type="p">C:檢查條件</p>  
        <p type="p">D:波形資料</p>  
        <p type="p">D1:正常波形資料</p>  
        <p type="p">D2:異常波形資料</p>  
        <p type="p">I:電流</p>  
        <p type="p">P:配線基板</p>  
        <p type="p">t:時間軸</p>  
        <p type="p">X:檢查對象</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1071" publication-number="202611752"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611752.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611752</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119477</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鐵礦石燒結製程的數值計算方法、計算裝置、數值計算程式及燒結礦之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G06F17/10</main-classification>  
        <further-classification edition="200601120251103B">F27D19/00</further-classification>  
        <further-classification edition="200601120251103B">F27D21/00</further-classification>  
        <further-classification edition="200601120251103B">C22B1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＦＥ鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮村渉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMURA, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩見友司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAMI, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鐵礦石燒結製程的數值計算方法，係在將含有鐵礦石之粉狀物質以燒結機進行燒結來製造燒結礦的燒結製程中，含有：在燒結機上的由原料及燒結塊所構成的領域中，作成計算網格之步驟；和藉由計算各胞格內部的化學反應量、反應熱、氣體分子與固體之熱傳達量、各物質的物性值、溫度變化及各胞格間的機長方向及層厚方向的熱移動量、與各胞格間的機長方向及層厚方向的氣體分子移動量，來計算燒結機內之狀態之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:數值計算系統</p>  
        <p type="p">10:計算裝置</p>  
        <p type="p">11:控制部</p>  
        <p type="p">12:輸入部</p>  
        <p type="p">13:輸出部</p>  
        <p type="p">14:記憶部</p>  
        <p type="p">20:燒結機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1072" publication-number="202611681"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611681.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611681</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119493</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過虛擬物件將共享虛擬經驗之使用者與多個同時地理位置匹配</chinese-title>  
        <english-title>MATCHING USERS FOR A SHARED VIRTUAL EXPERIENCE THROUGH VIRTUAL OBJECTS WITH MULTIPLE SIMULTANEOUS GEOLOCATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F3/01</main-classification>  
        <further-classification edition="201101120251201B">G06T19/00</further-classification>  
        <further-classification edition="201401120251201B">A63F13/53</further-classification>  
        <further-classification edition="201801120251201B">H04N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商尼安蒂克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIANTIC, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅野千尋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANNO, CHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森脇大悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIWAKI, DAIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淺川浩紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAKAWA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野村達雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOMURA, TATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一伺服器代管使用者之間的共享虛擬經驗。該伺服器接收來自一第一使用者之一第一用戶端裝置對參與一共享虛擬經驗之一請求。該請求包含與初始化該共享虛擬經驗相關聯之一物件識別符。該伺服器基於該物件識別符將該第一使用者與一或多個其他使用者匹配以形成一群組。該物件識別符可為具有跨真實世界位置散佈之表示之一虛擬物件。該物件識別符可為一關注點。一經匹配，該伺服器便向該群組中之該等使用者提供該共享虛擬經驗。提供該共享虛擬經驗需要引起該等用戶端裝置之一電子顯示器顯示該共享虛擬經驗之一定製視角，該定製視角包括為參與該共享虛擬經驗之該群組之所有使用者所共有之共享內容及特定於各使用者之玩家特定內容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A server hosts shared virtual experiences between users. The server receives, from a first client device of a first user, a request to participate in a shared virtual experience. The request includes an object identifier associated with initializing the shared virtual experience. The server matches the first user to one or more other users to form a group based on the object identifier. The object identifier may be a virtual object with representations dispersed across real-world locations. The object identifier may be a point of interest. Once matched, the server provides the shared virtual experience to the users in the group. Providing the shared virtual experience entails causing an electronic display of the client devices to display a tailored perspective of the shared virtual experience comprising shared content common to all users of the group participating in the shared virtual experience and player-specific content specific to each user.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:程序</p>  
        <p type="p">710:接收</p>  
        <p type="p">720:匹配</p>  
        <p type="p">730:提供</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1073" publication-number="202611256"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611256.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611256</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119515</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著劑組成物及黏著帶</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09J133/12</main-classification>  
        <further-classification edition="200601120251201B">C07C67/03</further-classification>  
        <further-classification edition="200601120251201B">C09J193/04</further-classification>  
        <further-classification edition="201801120251201B">C09J7/20</further-classification>  
        <further-classification edition="201901120251201B">B32B7/022</further-classification>  
        <further-classification edition="200601120251201B">C08F265/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緒方雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川本友也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMOTO, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本瞭太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, RYOUTAROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧尻絢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIJIRI, AYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤史哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATOU, FUMIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種黏著劑組成物，其能夠發揮高剪切接著強度、及對被黏著體之優異之密接性。又，本發明之目的在於提供一種黏著帶，其具有使用該黏著劑組成物所形成之黏著劑層。 &lt;br/&gt;本發明之黏著劑組成物含有(甲基)丙烯酸共聚物，上述(甲基)丙烯酸共聚物具有：源自具有支鏈狀烷基之(甲基)丙烯酸烷基酯之結構單元，上述具有支鏈狀烷基之(甲基)丙烯酸烷基酯包含設為均聚物時之玻璃轉移溫度為-55℃以上-15℃以下之含支鏈狀烷基之(甲基)丙烯酸烷基酯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1074" publication-number="202611035"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611035.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611035</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119517</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>稠環化合物</chinese-title>  
        <english-title>FUSED RING COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">C07D401/14</main-classification>  
        <further-classification edition="200601120251208B">C07D405/14</further-classification>  
        <further-classification edition="200601120251208B">A61K31/517</further-classification>  
        <further-classification edition="200601120251208B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅爾荷特拉　蘇珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALHOTRA, SUSHANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信建峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIN, JIANFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DO, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰瑞特　傑克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERRETT, JACK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於式(I)之稠環化合物，如本文中進一步詳述，其用於抑制Ras蛋白；以及包含該等化合物之組成物及藉由其投與之治療方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention pertains to fused ring compounds of Formula (I), as further detailed herein, which are used for the inhibition of Ras proteins, as well as compositions comprising these compounds and methods of treatment by their administration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1075" publication-number="202611257"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611257.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611257</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119524</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著帶</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09J133/12</main-classification>  
        <further-classification edition="200601120251201B">C09J11/04</further-classification>  
        <further-classification edition="200601120251201B">C09J11/06</further-classification>  
        <further-classification edition="200601120251201B">B32B27/28</further-classification>  
        <further-classification edition="201801120251201B">C09J7/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤史哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATOU, FUMIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川本友也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMOTO, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本瞭太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, RYOUTAROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧尻絢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIJIRI, AYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緒方雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種高溫保持性及曲面追隨性優異之黏著帶。 &lt;br/&gt;本發明之黏著帶具有使用黏著劑組成物所形成之黏著劑層，上述黏著劑組成物含有(甲基)丙烯酸共聚物，上述(甲基)丙烯酸共聚物具有源自(甲基)丙烯酸烷基酯之結構單元，上述黏著劑層藉由以測定頻率1 Hz、測定溫度範圍-40℃以上200℃以下之動態黏彈性測定所測得之80℃時之剪切儲存彈性模數為15000 Pa以上，上述黏著劑層藉由以測定頻率1 Hz、測定溫度範圍-40℃以上200℃以下之動態黏彈性測定所測得之損耗正切之峰溫度處於-20℃以上0℃以下之範圍內，上述黏著劑層之凝膠分率為10質量%以上45質量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1076" publication-number="202611285"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611285.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611285</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浸麥、發芽和／或粉碎系統</chinese-title>  
        <english-title>A SYSTEM FOR STEEPING, GERMINATION AND/OR MILLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C12C1/02</main-classification>  
        <further-classification edition="200601120251211B">C12C1/15</further-classification>  
        <further-classification edition="200601120251211B">C12C1/027</further-classification>  
        <further-classification edition="200601120251211B">C12C1/13</further-classification>  
        <further-classification edition="200601120251211B">C12C1/125</further-classification>  
        <further-classification edition="200601120251211B">F04D29/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商嘉士伯供應公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARLSBERG SUPPLY COMPANY AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雅各布　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAKOB, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, SURINDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索奈穆圖　烏達亞庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONAIMUTHU, UDAYAKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫爾布里希斯　尤爾根赫爾穆特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBRICH, JURGEN HELMUT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴萊特　埃爾瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARLET, ELMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛克　芬恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOK, FINN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆德　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUND, ERIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布勞內　卡塔日娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRAUNE, KATARZYNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及一種系統，所述系統包括具有上部和下部的容器，其中所述上部包括入口，物料可從該入口進入容器；網狀底板，所述網狀底板包括出口；以及位於網狀底板上方的耙式攪拌單元，所述耙式攪拌單元包括一個或多個臂，所述臂被配置為將位於網狀底板上方的物料移向網狀底板的出口；所述下部朝底部逐漸變細，並包括出口，物料可從該出口排出容器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure regards a system comprising a container comprising an upper part and a lower part, wherein said upper part comprises an inlet, where material can enter the container, a mesh floor, the mesh floor comprising an outlet, a giracleur unit located above the mesh floor, the giracleur unit comprising one or more arms configured to move material positioned above the mesh floor towards the outlet of the mesh floor, said lower part is tapered towards the bottom and comprises an outlet where the material can exit the container.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:上部</p>  
        <p type="p">101:下部</p>  
        <p type="p">102:網狀底板</p>  
        <p type="p">103:耙式攪拌單元</p>  
        <p type="p">104:臂</p>  
        <p type="p">105:中心軸</p>  
        <p type="p">106:網狀底板出口</p>  
        <p type="p">107:出口</p>  
        <p type="p">108:泵</p>  
        <p type="p">109:容器入口</p>  
        <p type="p">110:進水口</p>  
        <p type="p">111:進氣口</p>  
        <p type="p">112:開口角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1077" publication-number="202611986"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611986.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611986</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119641</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自組裝離子液晶(ILC)結構之間距的控制方法</chinese-title>  
        <english-title>METHODS FOR CONTROLLING THE PITCH OF SELF-ASSEMBLED IONIC LIQUID CRYSTAL (ILC) STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">H01L21/02</main-classification>  
        <further-classification edition="200601120251211B">C09K19/02</further-classification>  
        <further-classification edition="200601120251211B">H01L21/3213</further-classification>  
        <further-classification edition="200601120251211B">C09K19/34</further-classification>  
        <further-classification edition="200601120251211B">G02F1/137</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿里爾　迪帕克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARYAL, DIPAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿貝爾　凱特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABEL, KATE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, TAKEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森本保</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIMOTO, TAMOTSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供改進方法之實施例，其利用離子液晶(ILC)之定向自組裝(DSA)在基板表面上形成規則結構。更具體地，提供諸多方法實施例，以控制透過具有陽離子頭基、烷基尾基及陰離子之ILC自組裝形成於基板表面上之層狀結構的間距。在本文所揭示之實施例中，層狀結構的間距係透過以下方式控制 : (a) 控制ILC內所包含之陽離子頭基與陰離子的陽離子/陰離子電荷比，及/或(b)將離子液體加至包含 ILC之溶液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of improved methods are provided to form ordered structures on a surface of a substrate using direct self-assembly (DSA) of ionic liquid crystals (ILCs). More specifically, various embodiments of methods are provided to control the pitch of a layered structure formed on a substrate surface via self-assembly of ILCs having cation head groups, alkyl tail groups and anions. In the embodiments disclosed herein, the pitch of the layered structure is controlled by: (a) controlling the cation/anion charge ratio of the cation head groups and anions included within the ILCs, and/or (b) adding an ionic liquid to a solution comprising the ILCs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">310:步驟</p>  
        <p type="p">320:步驟</p>  
        <p type="p">330:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1078" publication-number="202611241"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611241.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611241</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119684</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學製品</chinese-title>  
        <english-title>OPTICAL PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09D133/10</main-classification>  
        <further-classification edition="200601120251201B">C09D5/16</further-classification>  
        <further-classification edition="201501120251201B">G02B1/18</further-classification>  
        <further-classification edition="200601120251201B">C07C49/76</further-classification>  
        <further-classification edition="200601120251201B">C08F2/06</further-classification>  
        <further-classification edition="200601120251201B">C11D1/40</further-classification>  
        <further-classification edition="200601120251201B">C11D1/83</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水寿人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, HISATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>先崎尊博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENZAKI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">議題：提供具備優異防曇耐久性之防曇塗層膜之光學製品。 &lt;br/&gt;　　解決手段：一種光學製品，其具備透明材料及配置於透明材料表面之防曇塗層膜；其中，防曇塗層膜係將由防曇塗佈用組成物所構成之塗膜，進行乾燥及/或硬化而獲得；防曇塗佈用組成物包含：聚合物(A)、基材成分(B)及界面活性劑(C)；聚合物(A)包含：源自具有乙烯性不飽和基及離子性基之化合物(a)之結構單元、源自具有乙烯性不飽和基及-OH基及/或-NH&lt;sub&gt;2&lt;/sub&gt;基之化合物(b)之結構單元，及源自以下述式(c-1)表示之化合物(c)之結構單元；且於主鏈之至少一者末端具有源自具有硫醇基及碳原子數4以上之烴基之化合物(d)之結構。 &lt;br/&gt;&lt;img align="absmiddle" height="366px" width="308px" file="ed10037.JPG" alt="ed10037.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1079" publication-number="202610991"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610991.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610991</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119691</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有聯萘骨架之二酯化合物之結晶</chinese-title>  
        <english-title>CRYSTAL OF DIESTER COMPOUND HAVING BINAPHTHYL SKELETON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C69/712</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商田岡化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAOKA CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種具有聯萘骨架之新穎的二酯化合物之結晶，其相較於2,2’-雙(乙氧基羰基甲氧基)-1,1’-聯萘，可更容易藉由晶析而得。 &lt;br/&gt;本發明者專心致志進行研究之結果，發現相較於2,2’-雙(乙氧基羰基甲氧基)-1,1’-聯萘，下述式(1)所示的具有聯萘骨架之新穎的二酯化合物係可更容易藉由晶析而得。 &lt;br/&gt;&lt;img align="absmiddle" height="170px" width="472px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to provide crystals of a novel diester compound having a binaphthyl skeleton that can be obtained by crystallization more easily than 2,2'-bis(ethoxycarbonylmethoxy)-1,1'-binaphthyl. &lt;br/&gt;It has been found after extensive research that a novel diester compound having a binaphthyl skeleton that is represented by the following formula (1) can be obtained as crystals by crystallization more easily than 2,2'-bis(ethoxycarbonylmethoxy)-1,1'-binaphthyl. &lt;br/&gt;&lt;img align="absmiddle" height="162px" width="458px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1080" publication-number="202612183"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612183.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612183</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導電接觸元件和絕緣殼體以及插頭連接器或插座連接器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01R13/04</main-classification>  
        <further-classification edition="200601120251205B">H01R13/10</further-classification>  
        <further-classification edition="200601120251205B">H01R13/42</further-classification>  
        <further-classification edition="200601120251205B">H01R13/46</further-classification>  
        <further-classification edition="201101120251205B">H01R12/71</further-classification>  
        <further-classification edition="201101120251205B">H01R24/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商莫仕有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLEX, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓊尼亞克　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONIAK, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬查　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATCHA, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏馬　高塔姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, GAUTAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>Ａ　史瑞納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>A, SREENATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種包括一直角插頭連接器和插座連接器的連接器元件。所述插座連接器可為一直角插座連接器，或可為一有線插座連接器。各直角連接器包括安裝在所述殼體內的至少一個導電接觸元件。所述接觸元件的一本體可具有前部和後部，所述前部和所述後部形成為獨立的構件、機械和電氣地連結在一起從而多個後部能連結於同一前部。所述殼體可具有一後部，所述後部具有比所述殼體的一前部的一高度大的或與所述殼體的前部的高度相等的一高度。所述插座連接器的插頭元件包括一插針，以及所述插座連接器的接觸元件包括一插座。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電連接器</p>  
        <p type="p">12:插頭連接器</p>  
        <p type="p">14:插座連接器</p>  
        <p type="p">16:絕緣殼體</p>  
        <p type="p">16a:頂壁</p>  
        <p type="p">16b:底壁</p>  
        <p type="p">16c:前壁</p>  
        <p type="p">16d:後壁</p>  
        <p type="p">16e:側壁</p>  
        <p type="p">16f:側壁</p>  
        <p type="p">18:導電接觸元件</p>  
        <p type="p">24a:上壁</p>  
        <p type="p">24b:側壁</p>  
        <p type="p">26:前部</p>  
        <p type="p">26d:後壁面</p>  
        <p type="p">28:後部</p>  
        <p type="p">30:鍵壁</p>  
        <p type="p">32:電路板</p>  
        <p type="p">32c:前緣</p>  
        <p type="p">80:鎖扣件</p>  
        <p type="p">82:鎖扣件開口</p>  
        <p type="p">90:工具收容開口</p>  
        <p type="p">T:工具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1081" publication-number="202611220"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611220.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611220</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119702</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氟樹脂片狀素材及含有其之積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">C08L27/18</main-classification>  
        <further-classification edition="200601120251202B">C08J5/22</further-classification>  
        <further-classification edition="200601120251202B">C08F2/22</further-classification>  
        <further-classification edition="200601120251202B">H01L21/324</further-classification>  
        <further-classification edition="200601120251202B">B32B27/08</further-classification>  
        <further-classification edition="201801120251202B">G01N23/2273</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森安礼奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIYASU, REINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲場沙織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INABA, SAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下雅量</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, MASAKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松信之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSU, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種氟樹脂片狀素材，其於以氟樹脂之熔點以下之溫度接著時，與金屬層之接著性亦優異。 &lt;br/&gt;本發明係一種氟樹脂片狀素材，其係包含氟樹脂之片狀素材，且於至少一表面，下述通式（A）成立， &lt;br/&gt;O≧E＋0.5        （A）； &lt;br/&gt;O：藉由掃描式X射線光電子光譜分析裝置（XPS）進行測定時所得之氧元素比率； &lt;br/&gt;E：於120℃之藉由掃描式原子力顯微鏡進行之表面彈性模數之多點測定中，累積相對頻率達到0.99時之表面彈性模數與累積相對頻率達到0.01時之表面彈性模數的差。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1082" publication-number="202611915"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611915.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611915</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119756</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括鐵電記憶體單元的記憶體裝置的操作方法</chinese-title>  
        <english-title>OPERATION METHOD OF MEMORY DEVICE INCLUDING FERROELECTRIC MEMORY CELL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G11C11/02</main-classification>  
        <further-classification edition="200601120251103B">G11C11/16</further-classification>  
        <further-classification edition="202301120251103B">H10B61/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑌眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YEONJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金顥淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HO-YOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭海旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, HAEWOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種記憶體裝置的操作方法，其包括鐵電記憶體單元。方法包括：從控制器接收讀取命令和位址；以及根據讀取命令，基於第一讀取模式或第二讀取模式，對對應於位址的鐵電記憶體單元執行讀取操作。在第一讀取模式中，第一讀取電壓被應用作為包括在鐵電記憶體單元中的鐵電電容器的跨接電壓。在第二讀取模式中，第二讀取電壓被應用作為包括在鐵電記憶體單元中的鐵電電容器的跨接電壓。第一讀取電壓和第二讀取電壓具有相反的極性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is an operation method of a memory device which includes a ferroelectric memory cell. The method includes: receiving a read command and an address from a controller; and performing a read operation on a ferroelectric memory cell corresponding to the address, based on a first read mode or a second read mode, according to the read command. In the first read mode, a first read voltage is applied as an across voltage of a ferroelectric capacitor included in the ferroelectric memory cell. In the second read mode, a second read voltage is applied as the across voltage of the ferroelectric capacitor included in the ferroelectric memory cell. The first read voltage and the second read voltage have opposite polarities.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">110:記憶體單元陣列</p>  
        <p type="p">120:列解碼電路</p>  
        <p type="p">130:感測放大器/寫入驅動器</p>  
        <p type="p">140:輸入/輸出電路</p>  
        <p type="p">150:控制邏輯電路</p>  
        <p type="p">160:讀取模式電路</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">DATA:資料</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">PL:板線</p>  
        <p type="p">WL:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1083" publication-number="202612494"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612494.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612494</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119789</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無內部間隔件之元件中之背側供電</chinese-title>  
        <english-title>BACKSIDE POWER DELIVERY IN DEVICES WITHOUT INNER SPACERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">H10D30/01</main-classification>  
        <further-classification edition="200601120251201B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴斯克　維拉拉格萬Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASKER, VEERARAGHAVAN S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科斯特里尼　葛雷戈里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COSTRINI, GREGORY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕爾　阿希什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAL, ASHISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴吉吉　艾爾梅蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAZIZI, EL MEHDI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哥倫布　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLOMBEAU, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉納塔拉蒂哈蘭　巴拉蘇布拉馬尼安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於形成對半導體結構中的源極/汲極（S/D）區域的背側接觸的方法包含選擇性移除基板至淺溝槽隔離（STI）和擴展區域，以在STI之間形成第一凹部，以第一介電材料填充第一凹部，透過第一介電材料形成對準至S/D區域的第二凹部，以及在第二凹部內形成對擴展區域的背側接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming backside contacts to source/drain (S/D) regions of a semiconductor structure includes removing a substrate selectively to shallow trench isolations (STIs) and the extension regions to form first recesses between the STIs, filling the first recesses with first dielectric material, forming second recesses aligned to the S/D regions through the first dielectric material, and forming backside contacts to the extension regions within the second recesses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:半導體結構</p>  
        <p type="p">202:通道層</p>  
        <p type="p">204:替換金屬閘(RMG)堆疊</p>  
        <p type="p">206:前層間介電質(ILD)</p>  
        <p type="p">208:閘極金屬</p>  
        <p type="p">210:高介電常數材料</p>  
        <p type="p">212:間隔件</p>  
        <p type="p">214:擴展區域</p>  
        <p type="p">216:S/D epi層</p>  
        <p type="p">218:犧牲氧化物層</p>  
        <p type="p">220:淺溝槽隔離(STI)</p>  
        <p type="p">222:金屬填充物</p>  
        <p type="p">224:阻障層</p>  
        <p type="p">226:ILD</p>  
        <p type="p">228:接觸epi層</p>  
        <p type="p">230:空腔</p>  
        <p type="p">232:接觸介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1084" publication-number="202612566"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612566.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612566</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119820</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251211B">H10K50/00</main-classification>  
        <further-classification edition="200601120251211B">G09G3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>初見亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATSUMI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一個方式提供一種顯示品質好的顯示裝置。本發明的一個方式是一種顯示裝置，該顯示裝置在像素中包括：信號線；掃描線；電晶體；像素電極；以及共用電極，其中，該共用電極的形狀為：重疊於信號線的區域的延伸方向與重疊於像素電極的區域的延伸方向在平面形狀不同，並且，該延伸方向在信號線與像素電極之間交叉。本發明的一個方式能夠抑制像素的穿透率的變化，從而抑制閃爍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To provide a display device with excellent display quality, in a display device including a signal line, a scan line, a transistor, a pixel electrode, and a common electrode in a pixel, the common electrode is included in which an extending direction of a region overlapping with the signal line differs from an extending direction of a region overlapping with the pixel electrode in a planar shape and the extending directions intersect with each other between the signal line and the pixel electrode. Thus, a change in transmittance of the pixel can be suppressed; accordingly, flickers can be reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:導電膜</p>  
        <p type="p">4:半導體膜</p>  
        <p type="p">5:像素電極</p>  
        <p type="p">6:導電膜</p>  
        <p type="p">7:導電膜</p>  
        <p type="p">9:共用電極</p>  
        <p type="p">10:點劃線</p>  
        <p type="p">102:電晶體</p>  
        <p type="p">103:像素</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1085" publication-number="202611565"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611565.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611565</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119868</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及影像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">G02B5/30</main-classification>  
        <further-classification edition="201501120251008B">G02B1/14</further-classification>  
        <further-classification edition="200601120251008B">G02F1/1335</further-classification>  
        <further-classification edition="202301120251008B">H10K59/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐菁璠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JINGFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案課題在於提供一種光學積層體，其具有貫通孔，且即便在高溫高濕環境下仍可抑制於相位差層產生裂痕。&lt;br/&gt; 作為其解決手段，本發明實施形態之光學積層體依序具備保護層、偏光件及相位差層。光學積層體具有貫通孔。將光學積層體放置於溫度85℃、濕度85%之環境下120小時後，令相位差層之慢軸方向的斷裂應力為σ&lt;sub&gt;b&lt;/sub&gt;、及令光學積層體在慢軸方向上之內部應力為σ&lt;sub&gt;i&lt;/sub&gt;時，滿足下述式(1)之關係：&lt;br/&gt; σ&lt;sub&gt;i&lt;/sub&gt;/σ&lt;sub&gt;b&lt;/sub&gt;＜1.15　　　・・・(1)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13:硬塗層</p>  
        <p type="p">40:貫通孔</p>  
        <p type="p">100:光學積層體</p>  
        <p type="p">a:距離</p>  
        <p type="p">B-B:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1086" publication-number="202612406"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612406.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612406</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119928</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線路板及其線路電鍍方法</chinese-title>  
        <english-title>CIRCUIT BOARD AND METHOD OF CIRCUIT PLATING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H05K1/11</main-classification>  
        <further-classification edition="200601120251210B">H05K3/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣興電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIMICRON TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白蓉生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAI, YOUNG SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳英仕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING SHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種線路板及其線路電鍍方法。線路板包括基材、導電柱和第一線路層。基材具有第一表面、相對於第一表面的第二表面以及從第一表面朝向第二表面延伸的孔洞。第一線路層設置於第一表面，並連接導電柱。導電柱包括N個柱狀金屬殼，設置於孔洞內，並呈同心環排列。第1個柱狀金屬殼覆蓋及接觸孔洞的孔壁，並施加脈衝電流，以在第1個柱狀金屬殼上電鍍(N-1)個柱狀金屬殼，而脈衝電流的最低值大於零，其中第(K-1)個柱狀金屬殼圍繞及覆蓋第K個柱狀金屬殼，且第(K-1)個柱狀金屬殼與第K個柱狀金屬殼之間形成界面，且N≧K≧3。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board and a method of circuit plating thereof are provided. The circuit board includes a substrate, a conductor post and a first circuit layer. The substrate includes a first surface, a second surface opposite the first surface, and a hole extending from the first surface toward the second surface. The first circuit layer is placed on the first surface and is connected to the conductor post. The conductor post includes N cylindrical metal shells placed inside the hole and arranged in concentric rings. The first cylindrical metal shell covers and touches a wall of the hole, and a pulse current is applied to plating (N-1) cylindrical metal shells on the first cylindrical metal shell ,and a minimum value of the pulse current is greater than zero, in which the (K-1)th cylindrical metal shell surrounds and covers the Kth cylindrical metal shell, and an interface is formed between the (K-1)th cylindrical metal shell and the Kth cylindrical metal shell, and N≧K≧3.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:線路板</p>  
        <p type="p">110:基材</p>  
        <p type="p">114:第一表面</p>  
        <p type="p">116:第二表面</p>  
        <p type="p">120:孔洞</p>  
        <p type="p">125:孔壁</p>  
        <p type="p">130:導電柱</p>  
        <p type="p">135、136:柱狀金屬殼</p>  
        <p type="p">140:第一線路層</p>  
        <p type="p">145:第一疊層</p>  
        <p type="p">150:第二線路層</p>  
        <p type="p">155:第二疊層</p>  
        <p type="p">160:填充物</p>  
        <p type="p">170:通孔</p>  
        <p type="p">180:界面</p>  
        <p type="p">190:厚度</p>  
        <p type="p">195:深度</p>  
        <p type="p">A-A:剖面線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1087" publication-number="202611718"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611718.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611718</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119941</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>內置自測試（ＢＩＳＴ）電路、積體電路元件及內置自測試方法</chinese-title>  
        <english-title>BUILT-IN SELF-TEST (BIST) CIRCUIT, INTEGRATED CIRCUIT DEVICE AND BUILT-IN SELF-TEST METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G06F11/27</main-classification>  
        <further-classification edition="202001120251103B">G06F30/33</further-classification>  
        <further-classification edition="200601120251103B">G01R31/3181</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商台積電（中國）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSMC CHINA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳煥能</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUAN-NENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李紹宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳村村</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CUNCUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及內置自測試（BIST）電路、積體電路元件及方法。內置自測試（BIST）電路包括第一開關、第一電阻器、至少一個第一電晶體和控制電路。第一開關、第一電阻器和至少一個第一電晶體串聯耦合在第一電源電壓的第一電源端子和輸入/輸出（I/O）電路的I/O端子之間。控制電路被配置為在第一BIST操作中閉合第一開關，並且在第一開關閉合時檢測I/O端子和與第一電源電壓不同的第二電源電壓的第二電源端子之間的第一洩漏電流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A built-in self-test (BIST) circuit includes a first switch, a first resistor, at least one first transistor, and a control circuit. The first switch, the first resistor and the at least one first transistor are coupled in series between a first power supply terminal of a first power supply voltage and an input/output (I/O) terminal of an I/O circuit. The control circuit is configured to, in a first BIST operation, close the first switch and, while the first switch is being closed, detect a first leakage current between the I/O terminal and a second power supply terminal of a second power supply voltage different from the first power supply voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體元件</p>  
        <p type="p">110、120:積體電路元件</p>  
        <p type="p">112:功能電路</p>  
        <p type="p">113:I/O電路</p>  
        <p type="p">116:保護電路</p>  
        <p type="p">118、119:內置自測試(BIST)電路</p>  
        <p type="p">130:介面結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1088" publication-number="202611625"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611625.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611625</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於OLED像素沉積之沉積遮罩</chinese-title>  
        <english-title>DEPOSITION MASK FOR OLED PIXEL DEPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251210B">G03F1/22</main-classification>  
        <further-classification edition="202301120251210B">H10K71/10</further-classification>  
        <further-classification edition="202301120251210B">H10K71/00</further-classification>  
        <further-classification edition="200601120251210B">C23C14/04</further-classification>  
        <further-classification edition="200601120251210B">C23C14/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺守鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, SUHYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任昌浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIM, CHANGHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種沉積遮罩，包含：一金屬板，其包含一第一表面與相對該第一表面之一第二表面，並包含複數個貫穿該第一表面與該第二表面之貫穿孔；以及一填充元件，其設置於該金屬板複數個貫穿孔中一第一貫穿孔之一內表面上，其中該第一貫穿孔包含：形成於該金屬板第一表面的一第一小面積孔，以及形成於該金屬板第二表面且經由一連接部與該第一小面積孔相連接的一第一大面積孔，其中該金屬板包含設置於該第一貫穿孔內表面的一第一凹槽，其中該填充元件包含設置於該第一凹槽中的一第一填充元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A deposition mask according to an embodiment includes a metal plate including a first surface and a second surface opposite the first surface, and including a plurality of through holes penetrating the first surface and the second surface; and a filling member disposed on an inner surface of a first through hole among the plurality of through holes of the metal plate, wherein the first through hole includes a first small-area hole formed on the first surface of the metal plate and a first large-area hole formed on the second surface of the metal plate and communicating with the first small-area hole via a communication part, wherein the metal plate includes a first recess provided on an inner surface of the first through hole, wherein the filling member includes a first filling member disposed in the first recess.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100G:沉積遮罩</p>  
        <p type="p">110:金屬板</p>  
        <p type="p">120g:第七填充構件</p>  
        <p type="p">ES1:第一內表面</p>  
        <p type="p">ES2:第二內表面</p>  
        <p type="p">ES2-1:第一部</p>  
        <p type="p">ES2-2:第二部</p>  
        <p type="p">TH:貫穿孔</p>  
        <p type="p">V1:小面積孔</p>  
        <p type="p">V2:大面積孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1089" publication-number="202611098"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611098.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611098</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119976</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、硬化物之製造方法、積層體之製造方法及半導體元件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F2/44</main-classification>  
        <further-classification edition="200601120251201B">C08F290/14</further-classification>  
        <further-classification edition="200601120251201B">C08G73/10</further-classification>  
        <further-classification edition="200601120251201B">C08G73/12</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/031</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/40</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification>  
        <further-classification edition="200601120251201B">H01L23/485</further-classification>  
        <further-classification edition="200601120251201B">H01L23/532</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野越啓介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGOSHI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小澤友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZAWA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種含有樹脂和聚合起始劑之樹脂組成物、使上述樹脂組成物硬化而成之硬化物、上述硬化物之製造方法、包括上述硬化物之製造方法的積層體之製造方法及半導體元件之製造方法，該樹脂具有特定結構的重複單元且具有乙烯性不飽和基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1090" publication-number="202611215"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611215.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611215</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120052</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>彈性體組合物</chinese-title>  
        <english-title>ELASTOMER COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">C08L7/02</main-classification>  
        <further-classification edition="200601120251202B">C08L15/00</further-classification>  
        <further-classification edition="200601120251202B">C08L27/06</further-classification>  
        <further-classification edition="200601120251202B">C08J3/26</further-classification>  
        <further-classification edition="200601120251202B">B29B11/16</further-classification>  
        <further-classification edition="200601120251202B">B29C35/02</further-classification>  
        <further-classification edition="200601120251202B">C23C14/24</further-classification>  
        <further-classification edition="200601120251202B">B25J15/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商艾瑞克斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERIKS N.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴肯恩迪　迪得瑞克　懷慕斯　里恩森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALKENENDE, DIEDERIK WILHELMUS RIENSZEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫南德斯　索墨沙　克里斯蒂娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERNANDEZ SOMOZA, CRISTINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍斯特曼　柯恩　珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORSTMAN, KOEN JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種包含一或多種無氟彈性體之彈性體組合物，其中該彈性體組合物針對水及烴類具有小於10&lt;sup&gt;-6&lt;/sup&gt; mbar*l/(s*cm²)之釋氣值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The current invention relates to an elastomer composition comprising one or more fluorine-free elastomers, wherein said elastomer composition has an outgassing value of less than 10&lt;sup&gt;-6&lt;/sup&gt; mbar*l/(s*cm²) for water and hydrocarbons.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1091" publication-number="202611404"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611404.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611404</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔膜泵及用於隔膜泵的閥總成</chinese-title>  
        <english-title>DIAPHRAGM PUMP AND VALVE ASSEMBLY FOR A DIAPHRAGM PUMP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">F04B43/04</main-classification>  
        <further-classification edition="200601120251203B">F04B53/10</further-classification>  
        <further-classification edition="200601120251203B">F16K15/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瓦那工程公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANNER ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博伊斯埃里克森　格雷　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOYCE-ERICKSON, GREY CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍利斯特　馬修　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLLISTER, MATTHEW WAYNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨布里　理察　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEMBREE, RICHARD DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">隔膜泵與閥系統各自包括有一平面閥接合表面的一閥板，形成於該閥接合表面中的複數個平面閥座，與延伸穿過該等閥座中之各者至對面的一孔。閥設置在該等閥座中。該等閥各自包括一閥桿，其具有延伸穿過該等孔中與其相關之一者的一縱軸，與在該閥之一第一端的一蓋片，其橫向延伸至該縱軸。該閥桿與該蓋片有一非圓形橫截面，且該蓋片及閥桿橫向於該縱軸的寬度大於該蓋片及閥桿沿著該閥橫向於該縱軸的深度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A diaphragm pump and a valve system each include a valve plate having a planar valve engaging surface, a plurality of planar valve seats formed in the valve engaging surface, and a hole extending through each of the valve seats to an opposite face. Valves are disposed in the valve seats. Each of the valves includes a stem having a longitudinal axis extending through an associated one of the holes, and a flap at a first end of the valve extending transversely to the longitudinal axis. The stem and the flap have a non-circular cross-section, and a width of the flap and stem transverse to the longitudinal axis is greater than a depth of the flap and stem transverse to the longitudinal axis along the valve.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">114:流體出口</p>  
        <p type="p">116:流體排放埠</p>  
        <p type="p">122:搖晃板</p>  
        <p type="p">128:隔膜接合構件</p>  
        <p type="p">132:孔口</p>  
        <p type="p">134:元件</p>  
        <p type="p">140:隔膜</p>  
        <p type="p">150:閥板</p>  
        <p type="p">170A,170B:閥元件</p>  
        <p type="p">180:端殼</p>  
        <p type="p">182:墊圈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1092" publication-number="202611019"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611019.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611019</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120083</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>己內醯胺結晶過程的控制方法</chinese-title>  
        <english-title>METHOD FOR CONTROLLING A CAPROLACTAM CRYSTALLIZATION PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D201/16</main-classification>  
        <further-classification edition="200601120251201B">C07D223/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴斯夫歐洲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽爾茲　丹尼爾　魯本</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SELZER, DANIEL RUBEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福格斯　馬蒂亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOGES, MATTHIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴羅斯　葛羅斯　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARROS GROSS, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布莱　史蒂凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLEI, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾　圖發里　費索　阿里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL-TOUFAILI, FAISSAL-ALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里契特　佛羅里昂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTER, FLORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼戈德　漢娜　史蒂芬妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANGOLD, HANNAH STEPHANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉維庫瑪　維克拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAVIKUMAR, VIKRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉瑞亞　伊斯特　馬特卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARYEA, ESTHER MATYKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科爾施　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COELSCH, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於實施ε-己內醯胺結晶程序的結晶單元U，其中該單元U包含結晶子單元U&lt;sub&gt;C(H)&lt;/sub&gt;、批量鼓子單元U&lt;sub&gt;B&lt;/sub&gt;及連接U&lt;sub&gt;B&lt;/sub&gt;與U&lt;sub&gt;C(H)&lt;/sub&gt;的流分配子單元U&lt;sub&gt;D&lt;/sub&gt;；在該結晶單元U中實施的ε-己內醯胺結晶程序；及控制在該單元U中實施的ε-己內醯胺結晶程序的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A crystallization unit U for carrying out an ε-caprolactam crystallization process, wherein the unit U comprises crystallization sub-units U&lt;sub&gt;C(H)&lt;/sub&gt;, a batch drum sub-unit U&lt;sub&gt;B&lt;/sub&gt; and a stream distribution sub-unit U&lt;sub&gt;D&lt;/sub&gt; connecting U&lt;sub&gt;B&lt;/sub&gt; and U&lt;sub&gt;C(H)&lt;/sub&gt;; an ε-caprolactam crystallization process carried out in the crystallization unit U; and a method for controlling the ε-caprolactam crystallization process carried out in the unit U.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">B(1):批量鼓</p>  
        <p type="p">B(2):批量鼓</p>  
        <p type="p">B(3):批量鼓</p>  
        <p type="p">B(4):批量鼓</p>  
        <p type="p">B&lt;sub&gt;EC1&lt;/sub&gt;:膨脹鼓</p>  
        <p type="p">B&lt;sub&gt;EC2&lt;/sub&gt;:膨脹鼓</p>  
        <p type="p">E&lt;sub&gt;C1&lt;/sub&gt;:進入及離開點</p>  
        <p type="p">E&lt;sub&gt;C2&lt;/sub&gt;:進入及離開點</p>  
        <p type="p">HTM:傳熱介質</p>  
        <p type="p">L&lt;sub&gt;B1&lt;/sub&gt;(1):回流輸送線</p>  
        <p type="p">L&lt;sub&gt;B1&lt;/sub&gt;(2):回流輸送線</p>  
        <p type="p">L&lt;sub&gt;B1&lt;/sub&gt;(3):回流輸送線</p>  
        <p type="p">L&lt;sub&gt;B2&lt;/sub&gt;(2):回流輸送線</p>  
        <p type="p">L&lt;sub&gt;B2&lt;/sub&gt;(3):回流輸送線</p>  
        <p type="p">L&lt;sub&gt;B2&lt;/sub&gt;(4):回流輸送線</p>  
        <p type="p">L&lt;sub&gt;C1&lt;/sub&gt;:輸送線</p>  
        <p type="p">L&lt;sub&gt;C2&lt;/sub&gt;:輸送線</p>  
        <p type="p">L&lt;sub&gt;F2&lt;/sub&gt;:輸送線</p>  
        <p type="p">L&lt;sub&gt;S0&lt;/sub&gt;:流輸送線</p>  
        <p type="p">L&lt;sub&gt;S1&lt;/sub&gt;(1):級流輸送線</p>  
        <p type="p">L&lt;sub&gt;S1&lt;/sub&gt;(2):級流輸送線</p>  
        <p type="p">L&lt;sub&gt;S1&lt;/sub&gt;(3):級流輸送線</p>  
        <p type="p">L&lt;sub&gt;S2&lt;/sub&gt;(2):級流輸送線</p>  
        <p type="p">L&lt;sub&gt;S2&lt;/sub&gt;(3):級流輸送線</p>  
        <p type="p">L&lt;sub&gt;S2&lt;/sub&gt;(4):級流輸送線</p>  
        <p type="p">L&lt;sub&gt;R1&lt;/sub&gt;:輸送線</p>  
        <p type="p">M&lt;sub&gt;B&lt;/sub&gt;(1):可控手段</p>  
        <p type="p">M&lt;sub&gt;B&lt;/sub&gt;(2):可控手段</p>  
        <p type="p">M&lt;sub&gt;B&lt;/sub&gt;(3):可控手段</p>  
        <p type="p">M&lt;sub&gt;B&lt;/sub&gt;(4):可控手段</p>  
        <p type="p">M&lt;sub&gt;EC1&lt;/sub&gt;:可控手段</p>  
        <p type="p">M&lt;sub&gt;EC2&lt;/sub&gt;:可控手段</p>  
        <p type="p">M&lt;sub&gt;LB1&lt;/sub&gt;(1):可控手段</p>  
        <p type="p">M&lt;sub&gt;LB1&lt;/sub&gt;(2):可控手段</p>  
        <p type="p">M&lt;sub&gt;LB1&lt;/sub&gt;(3):可控手段</p>  
        <p type="p">M&lt;sub&gt;LB2&lt;/sub&gt;(2):可控手段</p>  
        <p type="p">M&lt;sub&gt;LB2&lt;/sub&gt;(3):可控手段</p>  
        <p type="p">M&lt;sub&gt;LB2&lt;/sub&gt;(4):可控手段</p>  
        <p type="p">M&lt;sub&gt;LC1&lt;/sub&gt;:可控手段</p>  
        <p type="p">M&lt;sub&gt;LC2&lt;/sub&gt;:可控手段</p>  
        <p type="p">M&lt;sub&gt;LF2&lt;/sub&gt;:可控手段</p>  
        <p type="p">M&lt;sub&gt;LR1&lt;/sub&gt;:可控手段</p>  
        <p type="p">M&lt;sub&gt;LS1&lt;/sub&gt;(1):可控手段</p>  
        <p type="p">M&lt;sub&gt;LS1&lt;/sub&gt;(2):可控手段</p>  
        <p type="p">M&lt;sub&gt;LS1&lt;/sub&gt;(3):可控手段</p>  
        <p type="p">M&lt;sub&gt;LS2&lt;/sub&gt;(2):可控手段</p>  
        <p type="p">M&lt;sub&gt;LS2&lt;/sub&gt;(3):可控手段</p>  
        <p type="p">M&lt;sub&gt;LS2&lt;/sub&gt;(4):可控手段</p>  
        <p type="p">S&lt;sub&gt;0&lt;/sub&gt;:粗ε-己內醯胺進料流</p>  
        <p type="p">S&lt;sub&gt;PF&lt;/sub&gt;:最終細產物流</p>  
        <p type="p">S&lt;sub&gt;RF&lt;/sub&gt;:最終殘餘物流</p>  
        <p type="p">U&lt;sub&gt;B&lt;/sub&gt;:批量鼓子單元</p>  
        <p type="p">U&lt;sub&gt;C1&lt;/sub&gt;:子單元</p>  
        <p type="p">U&lt;sub&gt;C2&lt;/sub&gt;:子單元</p>  
        <p type="p">U&lt;sub&gt;D&lt;/sub&gt;:流分配子單元</p>  
        <p type="p">W&lt;sub&gt;C1&lt;/sub&gt;(1):結晶器</p>  
        <p type="p">W&lt;sub&gt;C1&lt;/sub&gt;(2):結晶器</p>  
        <p type="p">W&lt;sub&gt;C2&lt;/sub&gt;(1):結晶器</p>  
        <p type="p">W&lt;sub&gt;C2&lt;/sub&gt;(2):結晶器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1093" publication-number="202611325"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611325.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611325</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120115</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板表面上聚合物膜上之金屬之無電沉積</chinese-title>  
        <english-title>ELECTROLESS DEPOSITION OF METAL ON SURFACE POLYMER FILMS ON SUBSTRATE SURFACES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C23C16/18</main-classification>  
        <further-classification edition="200601120251201B">C23C18/38</further-classification>  
        <further-classification edition="200601120251201B">B32B3/20</further-classification>  
        <further-classification edition="200601120251201B">B05D3/02</further-classification>  
        <further-classification edition="200601120251201B">B05D1/40</further-classification>  
        <further-classification edition="200601120251201B">H01L21/208</further-classification>  
        <further-classification edition="200601120251201B">H01L23/498</further-classification>  
        <further-classification edition="202501120251201B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商易爾德工程系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIELD ENGINEERING SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑森　尼可拉　伊努瓜克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JESSEN, NICOLAJ INUNNGUAQ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴賈吉　拉吉夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAJAJ, RAJEEV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>娜拉雅南　普尼瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARAYANAN, PURNIMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼古拉森　雅各　帕格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKOLAJSEN, JAKOB PAGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿格加德　阿斯格　霍爾姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGERGAARD, ASGER HOLM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼達爾　喬伊德布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANDAL, JOYDEB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅戈吉娜　艾琳娜　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROGOJINA, ELENA V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克努森　克里斯蒂安　巴斯托姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNUDSEN, KRISTIAN BASTHOLM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　炳成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, BYUNG SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於表面聚合物膜上及表面聚合物膜內之金屬之沉積以及此類表面聚合物膜上之金屬之無電沉積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to the depositing of metals on and within surface polymer films and to the electroless deposition of metals on such surface polymer films.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:基板</p>  
        <p type="p">320:聚合引發位點</p>  
        <p type="p">330:聚合物分子</p>  
        <p type="p">340:官能基</p>  
        <p type="p">350:表面聚合物膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1094" publication-number="202611751"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611751.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611751</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搜尋文本生成系統與方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR GENERATION OF DOCUMENT WITH SEARCH FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251001B">G06F16/953</main-classification>  
        <further-classification edition="201901120251001B">G06F16/951</further-classification>  
        <further-classification edition="201901120251001B">G06F16/957</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕奇巨科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RENTPACKAGE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝清茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHING-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃富源</last-name>  
                <first-name>桃園市中壢區延平路500號12樓之1　B室</first-name> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種搜尋文本生成系統，其計算裝置提供操作頁面給搜尋文本創建者操作，以生成搜尋文本給不同使用者或不同用戶群組，讓不同使用者或不同用戶群組使用搜尋文本來對儲存空間儲存的搜尋資料內容進行搜尋。搜尋文本創建者可以將搜尋元件標註於搜尋文本中的位置，及設定搜尋元件能搜尋的搜尋資料內容，並接著將搜尋元件指定給使用者或不同用戶群組。據此，上述搜尋文本生成系統能讓不懂資料庫架構及程式開發語言的搜尋文本創建者輕鬆地建立搜尋文本給不同使用者或不同用戶群組，減少了生成給不同使用者或不同用戶群組的搜尋文本的困難度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In a search document generation system, a computing device provides an operation page for a search document creator to operate to generate a search document to different users or user groups, and the different users or user groups can use the search document to search a search data content stored in a storage space. The search document creator can mark a search component at a position of the search document, sets the search data content which the search component is allowed to search, and then assigns the search component to the user or user group. Accordingly, the search document generation system can make the search document creator without requiring understanding data structure architecture or programming languages easily establish the search document to the different users or user groups, thus reducing difficulty for generating the search document to the different users or user groups.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:計算裝置</p>  
        <p type="p">11:通訊裝置</p>  
        <p type="p">12:儲存空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1095" publication-number="202611266"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611266.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611266</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可固化組成物、使用其的固化層及顯示裝置</chinese-title>  
        <english-title>CURABLE COMPOSITION, CURED LAYER USING THE SAME AND DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09K11/02</main-classification>  
        <further-classification edition="200601120251201B">C09K11/56</further-classification>  
        <further-classification edition="200601120251201B">C09K11/70</further-classification>  
        <further-classification edition="200601120251201B">C09K11/88</further-classification>  
        <further-classification edition="200601120251201B">C08F2/44</further-classification>  
        <further-classification edition="200601120251201B">C08F2/50</further-classification>  
        <further-classification edition="200601120251201B">C08F122/10</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/031</further-classification>  
        <further-classification edition="200601120251201B">G03F7/032</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金昭賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SOHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜龍熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, YONGHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金哲奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, CHUL-KYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林知泫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIM, JIHYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李範珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, BUMJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種可固化組成物、使用可固化組成物來製造的固化層以及包括固化層的顯示裝置，所述可固化組成物包括（A）包括由化學式1表示的官能基的量子點；和（B）可聚合化合物。在化學式1中，每個取代基與具體實施方式中定義的相同。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="109px" width="238px" file="ed10041.JPG" alt="ed10041.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a curable composition, a cured layer produced using the curable composition, and a display device including the cured layer, the curable composition including (A) a quantum dot including a functional group represented by Chemical Formula 1; and (B) a polymerizable compound. In Chemical Formula 1, each substituent is the same as defined in the detailed description.&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="102px" width="241px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1096" publication-number="202612241"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612241.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612241</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120228</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源轉換電路</chinese-title>  
        <english-title>POWER CONVERSION CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">H02M3/325</main-classification>  
        <further-classification edition="200601120250701B">H02M7/217</further-classification>  
        <further-classification edition="200601120250701B">G05F1/565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林梓誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊大勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TA-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電源轉換電路，包括變壓器、諧振電容、上橋電晶體、下橋電晶體、電流偵測電路、回授電路以及控制電路。變壓器包括與諧振電容串接之初級線圈。上橋電晶體以及下橋電晶體耦接至初級線圈。電流偵測電路偵測流經諧振電容之諧振電流，而產生電流偵測信號。回授電路基於電源轉換電路之輸出電壓，產生回授信號。控制電路將電流偵測信號疊加斜率補償信號之疊加信號積分而產生第一積分信號、將回授信號積分而產生第二積分信號且比較第一積分信號以及第二積分信號而驅動上橋電晶體以及下橋電晶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power conversion circuit includes a transformer, a resonant capacitor, a high-side transistor, a low-side transistor, a current detection circuit, a feedback circuit, and a control circuit. The transformer includes a primary coil connected with the resonant capacitor in series. The high-side transistor and the low-side transistor are coupled to the primary coil. The current detection circuit detects a resonant current flowing through the resonant capacitor to generate a current detection signal. . The feedback signal generates a feedback signal based on the output voltage of the power conversion circuit. The control circuit integrates a superposition signal of the current detection signal and a slope compensation signal to generate a first integrated signal, integrates the feedback signal to generate a second integrated signal, and compares the first integrated signal to the second integrated signal to drive the high-side transistor and the low-side transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電源轉換電路</p>  
        <p type="p">TM:變壓器</p>  
        <p type="p">LR:諧振電感</p>  
        <p type="p">CR:諧振電容</p>  
        <p type="p">110:上橋電晶體</p>  
        <p type="p">120:下橋電晶體</p>  
        <p type="p">130:電流偵測電路</p>  
        <p type="p">140:整流電路</p>  
        <p type="p">150:回授電路</p>  
        <p type="p">160:控制電路</p>  
        <p type="p">PS:初級線圈</p>  
        <p type="p">SS:次級線圈</p>  
        <p type="p">NR:諧振節點</p>  
        <p type="p">SW:切換節點</p>  
        <p type="p">VCR:諧振電壓</p>  
        <p type="p">HSG:上橋閘極驅動信號</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">LSG:下橋閘極驅動信號</p>  
        <p type="p">IR:諧振電流</p>  
        <p type="p">SCS:電流偵測信號</p>  
        <p type="p">R1:第一電阻</p>  
        <p type="p">C1:第一電容</p>  
        <p type="p">D1:第一整流元件</p>  
        <p type="p">D2:第二整流元件</p>  
        <p type="p">COUT:輸出電容</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">FB:回授信號</p>  
        <p type="p">R2:第二電阻</p>  
        <p type="p">R3:第三電阻</p>  
        <p type="p">DR:穩壓元件</p>  
        <p type="p">PD:光耦合元件</p>  
        <p type="p">R4:第四電阻</p>  
        <p type="p">VD1:第一分壓電壓</p>  
        <p type="p">LED:二極體</p>  
        <p type="p">Q:電晶體</p>  
        <p type="p">161:第一疊加電路</p>  
        <p type="p">162:第一積分電路</p>  
        <p type="p">163:全波整流裝置</p>  
        <p type="p">164:第二積分電路</p>  
        <p type="p">CMP1:第一比較器</p>  
        <p type="p">LH1:第一閂鎖器</p>  
        <p type="p">LH2:第二閂鎖器</p>  
        <p type="p">SC1:斜率補償信號</p>  
        <p type="p">SP:疊加信號</p>  
        <p type="p">SW1:第一開關</p>  
        <p type="p">SW2:第二開關</p>  
        <p type="p">ADD:加法電路</p>  
        <p type="p">OTA:轉導放大器</p>  
        <p type="p">VB:偏壓電壓</p>  
        <p type="p">CINT:積分電容</p>  
        <p type="p">gm:轉導</p>  
        <p type="p">IINT:積分電流</p>  
        <p type="p">INT1:第一積分信號</p>  
        <p type="p">INT2:第二積分信號</p>  
        <p type="p">FW:全波整流信號</p>  
        <p type="p">HS:上橋驅動信號</p>  
        <p type="p">LS:下橋驅動信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1097" publication-number="202611134"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611134.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611134</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120229</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>丙烯酸系黏著劑、黏著片、光學積層體及影像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F220/18</main-classification>  
        <further-classification edition="200601120251201B">C08F220/28</further-classification>  
        <further-classification edition="200601120251201B">C08F220/30</further-classification>  
        <further-classification edition="200601120251201B">C09J133/14</further-classification>  
        <further-classification edition="200601120251201B">C09J11/06</further-classification>  
        <further-classification edition="201801120251201B">C09J7/30</further-classification>  
        <further-classification edition="200601120251201B">B32B7/12</further-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification>  
        <further-classification edition="200601120251201B">G02F1/1335</further-classification>  
        <further-classification edition="200601120251201B">G09F9/00</further-classification>  
        <further-classification edition="202301120251201B">H10K50/80</further-classification>  
        <further-classification edition="202301120251201B">H10K59/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長田潤枝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATA, MIZUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松多楓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUTA, KAEDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野依慎太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOYORI, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種丙烯酸系黏著劑，其係具有高折射率者，且可抑制在由該丙烯酸系黏著劑構成之黏著片的表面產生析出物(代表上為白色析出物)。又，提供一種包含所述丙烯酸系黏著劑之黏著片、包含所述黏著片之光學積層體及包含所述光學積層體之影像顯示裝置。&lt;br/&gt; 本發明實施形態之丙烯酸系黏著劑，係由包含作為基底聚合物之丙烯酸系聚合物的丙烯酸系黏著劑組成物形成；該丙烯酸系聚合物係將單體成分(M)聚合而得；該單體成分(M)包含30重量%以上之含芳香環單體(m1)；且，該丙烯酸系黏著劑以固體成分換算計含有300ppm以下之選自於由二甲苯磺酸及二甲苯磺酸鹽所構成群組中之至少1種。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第1液晶定向固化層</p>  
        <p type="p">12:第2液晶定向固化層</p>  
        <p type="p">20:黏著片</p>  
        <p type="p">100:光學積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1098" publication-number="202612574"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612574.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612574</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120259</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含超晶格的表面聲波（SAW）元件及相關方法</chinese-title>  
        <english-title>SURFACE ACOUSTIC WAVE (SAW) DEVICES INCLUDING A SUPERLATTICE AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251204B">H10N30/01</main-classification>  
        <further-classification edition="202301120251204B">H10N30/09</further-classification>  
        <further-classification edition="202301120251204B">H10N30/50</further-classification>  
        <further-classification edition="202301120251204B">H10N30/08</further-classification>  
        <further-classification edition="200601120251204B">H03H9/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安托梅拉公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATOMERA INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹內秀樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEUCHI, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米爾斯　羅勃Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEARS, ROBERT J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海太　馬瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HYTHA, MAREK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳絲倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭建中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子元件，可包括一極化區，該極化區具有一淨電偶極矩且包含一半導體層及被侷限在矽層之一晶格內部之至少一非半導體單層。該電子元件可更包括複數個隔開的N型區及P型區交替排列於該極化區內，以對齊該極化區的該淨電偶極矩；及與該極化區相關聯的至少一電極。舉例而言，該極化區可為一超晶格。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device may include a poled region having a net electrical dipole moment and including a semiconductor layer and at least one non-semiconductor monolayer constrained within a crystal lattice of the silicon layer. The electronic device may further include a plurality of spaced apart alternating N-type and P-type regions within the poled region to align the net electrical dipole moment of the poled region, and at least one electrode associated with the poled region. The poled region may be a superlattice, for example.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">225:本質(MST)區</p>  
        <p type="p">250:SAW元件</p>  
        <p type="p">251:P型區/P型層</p>  
        <p type="p">252:N型區/N型層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1099" publication-number="202612211"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612211.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612211</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120302</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於無功負載的電荷分配電池系統</chinese-title>  
        <english-title>BATTERY CHARGE DISTRIBUTION BASED ON REACTIVE LOAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02J7/34</main-classification>  
        <further-classification edition="201901120251201B">B60L58/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澳大利亞商銳萊控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RELECTRIFY HOLDINGS PTY LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅科　托尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROCCO, TONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及電池技術領域，提供了一種被配置為管理電池單元之間的無功能量傳輸的電池系統，所述系統包括：多個電池單元模組；開關電路，所述開關電路被配置為：選擇性地將任意兩個或更多個電池單元模組與無功電路連接，並配置與所述無功電路連接的每個電池單元模組的極性；以及控制器，所述控制器被配置為：控制所述開關電路，用於連接第一組的一個或更多個電池單元模組，從而驅動無功電流經過所述無功電路，以及控制所述開關電路，用於將第二組的一個或更多個電池單元模組以與所述第一組的極性相反的極性連接到所述無功電流，其中，所述第二組的極性連接基於所確定的所述無功電流的相位角。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:電池電路</p>  
        <p type="p">41:第一電池單元</p>  
        <p type="p">42:第二電池單元</p>  
        <p type="p">44:電流測量器件</p>  
        <p type="p">50:無功濾波器</p>  
        <p type="p">53:第二電感器</p>  
        <p type="p">61,62:輸出開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1100" publication-number="202611350"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611350.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611350</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚氯乙烯纖維、包含該聚氯乙烯纖維之布帛、聚氯乙烯纖維之製造方法、離子交換膜</chinese-title>  
        <english-title>POLYVINYL CHLORIDE FIBER, TEXTILE COMPRISING THE SAME, POLYVINYL CHLORIDE FIBER PRODUCING METHOD, AND ION-EXCHANGE MEMBRANE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">D01F6/10</main-classification>  
        <further-classification edition="202101120251201B">D03D15/283</further-classification>  
        <further-classification edition="200601120251201B">D01D5/06</further-classification>  
        <further-classification edition="200601120251201B">D01D5/12</further-classification>  
        <further-classification edition="201701120251201B">B01J47/12</further-classification>  
        <further-classification edition="200601120251201B">B01D69/02</further-classification>  
        <further-classification edition="200601120251201B">B01D69/10</further-classification>  
        <further-classification edition="200601120251201B">B01D69/12</further-classification>  
        <further-classification edition="200601120251201B">B01D71/30</further-classification>  
        <further-classification edition="200601120251201B">B32B5/02</further-classification>  
        <further-classification edition="200601120251201B">B32B5/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商德山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUYAMA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人信州大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINSHU UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤康夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, YASUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中澤優人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAZAWA, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木拓磨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, TAKUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>角田大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUNODA, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三嶋祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MISHIMA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>磯村武範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISOMURA, TAKENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>織田健吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODA, KENGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供PVC纖維，其在作為離子交換膜之基材時，與離子交換樹脂之接著性良好，且為高強度，於作為離子交換膜時不會變脆，且浸漬於單體時之收縮受到抑制。 &lt;br/&gt;　　本發明之聚氯乙烯纖維之結晶化度為10%以上60%以下，浸漬於苯乙烯進行聚合時之苯乙烯含浸量為20wt%以上60wt%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a PVC fiber having a good adhesion to an ion exchange resin and a high strength when used as a matrix in an ion-exchange membrane, being unrupturable when used as an ion-exchange membrane, and contracting in an inhibitive manner when immersed in a monomer. The polyvinyl chloride fiber has a degree of crystallinity of 10% to 60%, and a 20 wt% to 60 wt% add-on of styrene when immersed in styrene and polymerized.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:圓筒</p>  
        <p type="p">20:凝固浴</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1101" publication-number="202612177"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612177.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612177</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單極接合連接器</chinese-title>  
        <english-title>SINGLE POLE SPLICING CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01R9/24</main-classification>  
        <further-classification edition="200601120251201B">H01R4/48</further-classification>  
        <further-classification edition="200601120251201B">H01R13/514</further-classification>  
        <further-classification edition="200601120251201B">H01R25/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商理想企業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEAL INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利德維格　傑森　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUDEWIG, JASON W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晨陶　艾倫　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZANTOUT, ALAN E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑佛德　道格拉斯　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANFORD, DOUGLAS A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種電性連接器，其助益於在多個電性導體與匯流排之間的電性耦合。連接器包括界定導體埠與殼體埠的殼體、定位在殼體內而用於電性耦合導體的匯流排、以及透過殼體埠為可觸及而用於和另一個連接器的第二級匯流排之電性接觸的延伸片。一種連接器系統包含第一連接器與第二連接器，各者具有各別的殼體、匯流排、與延伸片，當延伸片被插入到對應的殼體埠時而致能相互的電性耦合。連接器可為結構上相同且支援各種的埠方向配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector are disclosed for facilitating electrical coupling between multiple electrical conductors and busbars. The connector includes a housing defining conductor ports and a housing port, a busbar positioned within the housing for electrically coupling conductors, and an extension tab accessible through the housing port for electrical contact with a secondary busbar of another connector. A connector system comprises a first connector and a second connector, each with respective housings, busbars, and extension tabs, enabling mutual electrical coupling when the extension tabs are inserted into corresponding housing ports. The connectors may be structurally identical and support various configurations of port orientations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:接合連接器</p>  
        <p type="p">120:殼體</p>  
        <p type="p">122:導體埠</p>  
        <p type="p">128:殼體埠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1102" publication-number="202611553"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611553.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611553</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120373</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學膜及包含其的顯示裝置</chinese-title>  
        <english-title>OPTICAL FILM AND DISPLAY COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251201B">G02B1/111</main-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification>  
        <further-classification edition="200601120251201B">G02F1/13357</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商東麗先端素材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY ADVANCED MATERIALS KOREA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵重碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JOONG SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金潢龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HWANGYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種光學膜，更詳細地，涉及一種光學膜，其能夠改善左右視角，在製造成大面積時仍可均勻表現視角改善效果，並且在改善視角的同時，可以在不降低正面亮度特性的情況下提高對比且可使色彩變化最小化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:各向異性擴散層</p>  
        <p type="p">110:表層</p>  
        <p type="p">200:光學膜</p>  
        <p type="p">X:軸</p>  
        <p type="p">Y:軸</p>  
        <p type="p">Z:軸</p>  
        <p type="p">X-X':邊界線</p>  
        <p type="p">Y-Y':邊界線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1103" publication-number="202611939"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611939.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611939</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120420</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>進度顯示裝置以及電腦可讀取的程式</chinese-title>  
        <english-title>PROGRESS DISPLAYING APPARATUS AND COMPUTER READABLE PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251001B">G16H30/20</main-classification>  
        <further-classification edition="201801120251001B">G16H30/40</further-classification>  
        <further-classification edition="201801120251001B">G16H15/00</further-classification>  
        <further-classification edition="201801120251001B">G16H10/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平井沙耶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAI, SAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荻寛志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古田智靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUTA, TOMOYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">進度顯示裝置(1)係用以顯示針對被使用於標本解析之細胞的集合之處理的進度，並具備：顯示部(11)；以及顯示控制部(12)，係控制朝顯示部(11)的顯示。顯示控制部(12)係使顯示部(11)顯示：進度一覽，係將與至少一個標本有關的進度與各個標本建立關連地顯示；以及解析視野一覽，係將與被設定於各個標本之至少一個解析視野有關的處理的進度與各個解析視野建立關連地顯示。顯示控制部(12)係基於與處理關連地生成的資訊的監視或者該資訊的輸入來更新進度一覽或者解析視野一覽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A progress displaying apparatus (1) displaying progress of processing for groups of cells used for specimen analysis, comprises a display part (11) and a display control part (12) controlling display on the display part (11). The display control part (12) controls the display part (11) to display a progress list showing progress of at least one specimen together with a corresponding specimen and an analysis view field list showing progress of processing for at least one analysis view field set to a corresponding specimen together with a corresponding analysis view field. The display control part (12) updates the progress list or the analysis view field list on the basis of monitoring of information generated along with processing or inputting of the information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:進度顯示裝置</p>  
        <p type="p">11:顯示部</p>  
        <p type="p">12:顯示控制部</p>  
        <p type="p">13:操作部</p>  
        <p type="p">21:進度一覽顯示工序</p>  
        <p type="p">22:解析視野一覽顯示工序</p>  
        <p type="p">23:處方一覽顯示工序</p>  
        <p type="p">24:更新工序</p>  
        <p type="p">41:彙總條件設定部</p>  
        <p type="p">42:彙總部</p>  
        <p type="p">81,82:作業裝置</p>  
        <p type="p">821:生成資訊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1104" publication-number="202610623"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610623.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610623</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120428</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>3,4-二氫喹啉-2(1H)-酮之TSHR抑制劑</chinese-title>  
        <english-title>3,4-DIHYDROQUINOLIN-2(1H)-ONE INHIBITORS OF TSHR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/44</main-classification>  
        <further-classification edition="200601120251201B">A61K31/438</further-classification>  
        <further-classification edition="200601120251201B">A61P27/00</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商塞普特納公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEPTERNA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃爾格拉夫　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOLGRAF, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　卡梅倫　里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, CAMERON REES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫茨勒　貝琳達　伊麗莎白</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HETZLER, BELINDA ELISABETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示作為甲狀腺刺激激素受體拮抗劑之化合物，及可用於預防或治療甲狀腺疾病之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are compounds that are thyroid stimulating hormone receptor antagonists, and methods useful for preventing or treating a thyroid disease.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1105" publication-number="202611166"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611166.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611166</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120439</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱塑性樹脂及包含其之光學透鏡</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G63/672</main-classification>  
        <further-classification edition="200601120251201B">G02B1/04</further-classification>  
        <further-classification edition="200601120251201B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤宣之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, NORIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西森克吏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMORI, KATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂木篤志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTEGI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石原健太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIHARA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高松一貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMATSU, KAZUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下開登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, KAITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田祐太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小寺雅斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KODERA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圓井邦昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUI, KUNIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，可提供一種熱塑性樹脂，其包含源自下述式(1)所示的單體之構成單元(A)。 &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="223px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，R&lt;sub&gt;1&lt;/sub&gt;各自獨立地表示氫原子、甲基或乙基)。 &lt;br/&gt;　　本發明之較佳的實施形態為上述熱塑性樹脂，其中上述通式(1)所示的單體為化學式(1-1)、(1-2)或(1-3)所示的化合物。 &lt;br/&gt;&lt;img align="absmiddle" height="230px" width="552px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1106" publication-number="202611592"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611592.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611592</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學系統及相機模組</chinese-title>  
        <english-title>OPTICAL SYSTEM AND CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">G02B15/14</main-classification>  
        <further-classification edition="200601120251202B">G02B9/34</further-classification>  
        <further-classification edition="200601120251202B">G02B11/20</further-classification>  
        <further-classification edition="200601120251202B">G02B13/18</further-classification>  
        <further-classification edition="202101120251202B">G03B30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金江珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KANG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學系統，包含沿一光軸排列的一第一至第四鏡頭組，其中該第一鏡頭組具有正(+)折射力，該第二鏡頭組具有負(-)折射力，該第三鏡頭組具有正(+)折射力，該第四鏡頭組具有正(+)折射力，且該第一鏡頭組為最接近一物體側的一棱鏡鏡頭， 該棱鏡鏡頭包含一入射面、一反射面及一出射面，且該棱鏡鏡頭的入射面或出射面具有凸面形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The optical system according to an embodiment of the present invention includes a first to fourth lens groups disposed along an optical axis, wherein the first lens group has a positive (+) refractive power, the second lens group has a negative (-) refractive power, the third lens group has a positive (+) refractive power, and the fourth lens group has a positive (+) refractive power, and the first lens group is a prism lens disposed closest to the object side, the prism lens includes an incident surface, a reflective surface, and an exit surface, and the incident surface or the exit surface of the prism lens has a convex shape.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:第一鏡頭</p>  
        <p type="p">102:第二鏡頭</p>  
        <p type="p">103:第三鏡頭</p>  
        <p type="p">104:第四鏡頭</p>  
        <p type="p">105:第五鏡頭</p>  
        <p type="p">106:第六鏡頭</p>  
        <p type="p">107:第七鏡頭</p>  
        <p type="p">108:第八鏡頭</p>  
        <p type="p">300:影像感測器</p>  
        <p type="p">400:濾光片</p>  
        <p type="p">1000:光學系統</p>  
        <p type="p">RS1:反射面</p>  
        <p type="p">S1:入射面</p>  
        <p type="p">S2:出射面</p>  
        <p type="p">S3:第三表面</p>  
        <p type="p">S4:第四表面</p>  
        <p type="p">S5:第五表面</p>  
        <p type="p">S6:第六表面</p>  
        <p type="p">S7:第七表面</p>  
        <p type="p">S8:第八表面</p>  
        <p type="p">S9:第九表面</p>  
        <p type="p">S10:第十表面</p>  
        <p type="p">S11:第十一表面</p>  
        <p type="p">S12:第十二表面</p>  
        <p type="p">S13:第十三表面</p>  
        <p type="p">S14:第十四表面</p>  
        <p type="p">S15:第十五表面</p>  
        <p type="p">S16:第十六表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1107" publication-number="202611506"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611506.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611506</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120475</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由對角碾磨進行晶圓結構３Ｄ重建的方法和系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR 3D RECONSTRUCTION OF WAFER STRUCTURE BY DIAGONAL MILLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">G01N23/2251</main-classification>  
        <further-classification edition="200601120251201B">G01B11/22</further-classification>  
        <further-classification edition="200601120251201B">G01B11/24</further-classification>  
        <further-classification edition="200601120251201B">H01J37/28</further-classification>  
        <further-classification edition="201101120251201B">G06T15/08</further-classification>  
        <further-classification edition="200601120251201B">G06T17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商應用材料以色列公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊坦　蓋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EYTAN, GUY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西加爾　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEGAL, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉翰　歐荷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAHAD, OHR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊爾科　康斯坦丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIRKO, KONSTANTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>理曼　艾隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITMAN, ALON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴歐　隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAR-OR, RON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費德曼　哈姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FELDMAN, HAIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示了藉由以下方式用於對晶圓的3D結構元素進行計量的系統和方法：在該等3D結構元素的子集上以預定對角角度投射聚焦離子束(FIB)，從而在部位子集中的每個部位中產生對角切割；使用掃瞄電子顯微鏡(SEM)掃瞄對角切割中的每個對角切割；基於該SEM影像產生一或多個3D結構元素或其部件的重建；以及對該重建進行計量量測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are system and method for metrology of 3D structural elements of a wafer by projecting, on a subset of the 3D structural elements, a focused ion beam (FIB) at a predefined diagonal angle, thereby generating a diagonal cut in each of the subset of sites, scanning each of the diagonal cuts using a scanning electron microscope (SEM), generating a reconstruction of the one or more 3D structural elements or a component thereof based on the SEM image and performing metrology measurements on the reconstruction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Z&lt;sub&gt;0&lt;/sub&gt;:高度</p>  
        <p type="p">Z&lt;sub&gt;1&lt;/sub&gt;:高度</p>  
        <p type="p">Z&lt;sub&gt;2&lt;/sub&gt;:高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1108" publication-number="202611442"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611442.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611442</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120478</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>排氣清淨裝置及排氣清淨裝置系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250909B">F24F7/06</main-classification>  
        <further-classification edition="200601120250909B">B01D53/44</further-classification>  
        <further-classification edition="200601120250909B">B01D53/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJI INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部寛之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺圭一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明捕集侵入到排氣導管內之油分等。 &lt;br/&gt;本發明提供一種排氣清淨裝置，其具備被強制旋轉之過濾器（10）及可旋轉地內置過濾器（10）之殼體（20），過濾器（10）從周緣側至中心具有複數個孔（11），殼體（20）構成為覆蓋過濾器（10）的周圍之大致筒狀且安裝於排氣導管（1）的通氣路徑中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:過濾器</p>  
        <p type="p">20:殼體</p>  
        <p type="p">21:前板部</p>  
        <p type="p">21a:前板開口部</p>  
        <p type="p">22:後板部</p>  
        <p type="p">25:周壁</p>  
        <p type="p">25b:側板</p>  
        <p type="p">25c:側板</p>  
        <p type="p">25c1:通氣孔</p>  
        <p type="p">25d:側板</p>  
        <p type="p">26c:減振構件</p>  
        <p type="p">26d:減振構件</p>  
        <p type="p">27d:蓋構件</p>  
        <p type="p">27d2:通氣孔</p>  
        <p type="p">28:捕集部</p>  
        <p type="p">29:框構件</p>  
        <p type="p">30:阻力板</p>  
        <p type="p">40:支承構件</p>  
        <p type="p">50:驅動裝置</p>  
        <p type="p">51:馬達部</p>  
        <p type="p">51b:凸緣部</p>  
        <p type="p">52:動力傳遞機構</p>  
        <p type="p">52a:動力傳遞軸</p>  
        <p type="p">52b:旋轉軸方向轉換裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1109" publication-number="202611443"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611443.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611443</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120479</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>排氣清淨裝置及排氣清淨裝置系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250909B">F24F7/06</main-classification>  
        <further-classification edition="200601120250909B">F24F13/28</further-classification>  
        <further-classification edition="200601120250909B">F24C15/20</further-classification>  
        <further-classification edition="200601120250909B">B01D53/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJI INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部寛之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺圭一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明捕集侵入到排氣導管內之油分等。 &lt;br/&gt;本發明提供一種排氣清淨裝置，其具備被強制旋轉之過濾器（10）、可旋轉地內置過濾器（10）之殼體（20）、及從下游側可旋轉地支承過濾器（10）之支承構件（40），過濾器（10）從周緣側至中心具有複數個孔（11），殼體（20）構成為覆蓋過濾器（10）的周圍之大致筒狀且安裝於排氣導管（1）的通氣路徑中，支承構件（40）相對於過濾器（10）的中心軸交叉地支承於殼體（20）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:過濾器</p>  
        <p type="p">20:殼體</p>  
        <p type="p">21:前板部</p>  
        <p type="p">21a:前板開口部</p>  
        <p type="p">22:後板部</p>  
        <p type="p">25:周壁</p>  
        <p type="p">25b:側板</p>  
        <p type="p">25c:側板</p>  
        <p type="p">25c1:通氣孔</p>  
        <p type="p">25d:側板</p>  
        <p type="p">26c:減振構件</p>  
        <p type="p">26d:減振構件</p>  
        <p type="p">27d:蓋構件</p>  
        <p type="p">27d2:通氣孔</p>  
        <p type="p">28:捕集部</p>  
        <p type="p">29:框構件</p>  
        <p type="p">30:阻力板</p>  
        <p type="p">40:支承構件</p>  
        <p type="p">50:驅動裝置</p>  
        <p type="p">51:馬達部</p>  
        <p type="p">51b:凸緣部</p>  
        <p type="p">52:動力傳遞機構</p>  
        <p type="p">52a:動力傳遞軸</p>  
        <p type="p">52b:旋轉軸方向轉換裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1110" publication-number="202611446"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611446.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611446</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>排氣清淨裝置及排氣清淨裝置系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250909B">F24F13/28</main-classification>  
        <further-classification edition="200601120250909B">B01D53/44</further-classification>  
        <further-classification edition="200601120250909B">B01D53/74</further-classification>  
        <further-classification edition="200601120250909B">F24C15/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJI INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部寛之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺圭一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明捕集侵入到排氣導管內之油分等。 &lt;br/&gt;本發明提供一種排氣清淨裝置，其具備：過濾器、可旋轉地內置前述過濾器之殼體、及使前述過濾器旋轉之驅動裝置，前述過濾器從周緣側至中心具有複數個孔，前述殼體構成為覆蓋前述過濾器的周圍之大致筒狀且安裝於排氣導管的通氣路徑中，前述驅動裝置具備馬達部及動力傳遞機構，前述動力傳遞機構將該馬達部的旋轉力傳遞到前述過濾器，前述馬達部設置於前述殼體的周壁的外側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:過濾器</p>  
        <p type="p">20:殼體</p>  
        <p type="p">21:前板部</p>  
        <p type="p">21a:前板開口部</p>  
        <p type="p">22:後板部</p>  
        <p type="p">25:周壁</p>  
        <p type="p">25b:側板</p>  
        <p type="p">25c:側板</p>  
        <p type="p">25c1:通氣孔</p>  
        <p type="p">25d:側板</p>  
        <p type="p">26c:減振構件</p>  
        <p type="p">26d:減振構件</p>  
        <p type="p">27d:蓋構件</p>  
        <p type="p">27d2:通氣孔</p>  
        <p type="p">28:捕集部</p>  
        <p type="p">29:框構件</p>  
        <p type="p">30:阻力板</p>  
        <p type="p">40:支承構件</p>  
        <p type="p">50:驅動裝置</p>  
        <p type="p">51:馬達部</p>  
        <p type="p">51b:凸緣部</p>  
        <p type="p">52:動力傳遞機構</p>  
        <p type="p">52a:動力傳遞軸</p>  
        <p type="p">52b:旋轉軸方向轉換裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1111" publication-number="202611069"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611069.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611069</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120497</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗GRP78抗體、免疫偶聯物及其用途</chinese-title>  
        <english-title>ANTI-GRP78 ANTIBODY, IMMUNOCONJUGATE AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/18</main-classification>  
        <further-classification edition="200601120251201B">C12N15/63</further-classification>  
        <further-classification edition="200601120251201B">C12N5/10</further-classification>  
        <further-classification edition="201701120251201B">A61K47/68</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification>  
        <further-classification edition="200601120251201B">G01N33/68</further-classification>  
        <further-classification edition="200601120251201B">G01N33/574</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友生泰生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCT BIOSCIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佳城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亞薇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳螢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅嘉翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHIA-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種抗葡萄糖相關蛋白質78 (GRP78)抗體或其抗原結合片段。該抗GRP78抗體或其抗原結合片段，諸如單鏈可變片段可用作用於治療及/或預防由GRP78活性或信號傳導引起或與GRP78活性或信號傳導相關之疾病及/或病症的嵌合抗原受體(CAR)或免疫偶聯物之抗原結合域。本發明亦關於一種用於偵測樣品中之GRP78或癌症的方法或套組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to an anti-glucose-related protein 78 (GRP78) antibody or an antigen-binding fragment thereof. The anti-GRP78 antibody or antigen-binding fragment thereof, such as a single chain variable fragment, can be used as an antigen binding domain of chimeric antigen receptors (CARs) or immunoconjugates for treating and/or preventing a disease and/or disorder caused by or related to GRP78 activity or signaling. The present disclosure also relates to a method or kit for detecting GRP78 or a cancer in a sample.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1112" publication-number="202612136"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612136.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612136</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝構造、電子裝置系統及光電融合裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01L23/473</main-classification>  
        <further-classification edition="200601120251001B">H01L23/31</further-classification>  
        <further-classification edition="200601120251001B">G02B6/122</further-classification>  
        <further-classification edition="200601120251001B">H01L23/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芥川泰人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKUTAGAWA, YOSHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木津貴志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIZU, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塚本健人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKAMOTO, TAKEHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石橋正朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIBASHI, MASAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱田哲郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, TETSURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高城總夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, FUSAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太田秋津</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTA, AKITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於，提供一種技術，其係可實現縮短電訊號之傳送距離，並實現高速通訊及半導體晶片之高積體化抑或高速化。 &lt;br/&gt;因此，本發明之封裝構造之特徵在於：在封裝基板上，配置有包含前述封裝基板、框體及頂板之腔室；前述框體，係具備冷卻液之入口及／或出口；在前述腔室內，係配置有半導體晶片及光電轉換元件；前述光電轉換元件，係連接至形成於前述頂板之光波導電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:封裝構造</p>  
        <p type="p">10:封裝基板</p>  
        <p type="p">10a:第一配線層</p>  
        <p type="p">10b:CCL</p>  
        <p type="p">10c:第二配線層</p>  
        <p type="p">10d:電極部</p>  
        <p type="p">12:中介層</p>  
        <p type="p">14:焊料凸塊</p>  
        <p type="p">16:底部填充劑</p>  
        <p type="p">18:端子</p>  
        <p type="p">20,22:電容器</p>  
        <p type="p">24,30:焊料凸塊</p>  
        <p type="p">26,28:光電轉換元件</p>  
        <p type="p">32:底部填充劑</p>  
        <p type="p">34:框體</p>  
        <p type="p">34i:入口</p>  
        <p type="p">34o:出口</p>  
        <p type="p">36:光波導電路</p>  
        <p type="p">38:頂板</p>  
        <p type="p">40:連接器</p>  
        <p type="p">42:光纜線</p>  
        <p type="p">44:接著劑</p>  
        <p type="p">46:樹脂</p>  
        <p type="p">50:半導體晶片</p>  
        <p type="p">52:腔室</p>  
        <p type="p">54:溫度感測器</p>  
        <p type="p">A1,A2:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1113" publication-number="202610955"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610955.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610955</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有自適應熱係數及高溫下高抗氟性的陶瓷</chinese-title>  
        <english-title>CERAMICS WITH ADAPTIVE THERMAL COEFFICIENTS AND HIGH FLUORINE RESISTANCE AT HIGH TEMPERATURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C04B35/03</main-classification>  
        <further-classification edition="200601120251201B">C04B35/10</further-classification>  
        <further-classification edition="200601120251201B">C04B35/50</further-classification>  
        <further-classification edition="200601120251201B">H01J37/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOO, KATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　語南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, JENNIFER Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所描述的實施例大體而言係關於處理用於半導體處理應用的陶瓷組成物的製程。更具體地說，實施例係關於用於半導體處理的抗熱、抗氟及抗電漿的陶瓷組成物。在某些實施例中，陶瓷組成物包含基於第13族金屬的化合物、基於鹼土金屬的化合物、基於稀土金屬的化合物及熱膨脹係數（CTE）修飾化合物。在某些實施例中，電漿處理腔室的部件包含具有陶瓷組成物的外表面。該陶瓷組成物包含基於第13族金屬的化合物、基於鹼土金屬的化合物、基於稀土金屬的化合物及熱膨脹係數（CTE）修飾化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein generally relate to process for processing ceramic compositions for use in semiconductor processing applications. More specifically, embodiments relate to thermal, fluorine, and plasma resistant ceramic compositions for use in semiconductor processing. In some embodiments, a ceramic composition includes a Group 13 metal based compound, an alkaline-earth metal based compound, a rare earth metal based compound, and a coefficient of thermal expansion (CTE) modifying compound. In some embodiments, a component of a plasma processing chamber includes an outer surface having a ceramic composition. The ceramic composition includes a Group 13 metal based compound, an alkaline-earth metal based compound, a rare earth metal based compound, and a coefficient of thermal expansion (CTE) modifying compound.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:陶瓷部件</p>  
        <p type="p">202:習知陶瓷材料</p>  
        <p type="p">204:陶瓷組成物</p>  
        <p type="p">206:氟化物玻璃釉</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1114" publication-number="202612028"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612028.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612028</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120682</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燒結接合用片材及燒結接合用片材之製造方法</chinese-title>  
        <english-title>SINTER BONDING SHEET, AND METHOD FOR PRODUCING SINTER BONDING SHEET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01L21/447</main-classification>  
        <further-classification edition="200601120251205B">B22F7/02</further-classification>  
        <further-classification edition="200601120251205B">B32B3/30</further-classification>  
        <further-classification edition="200601120251205B">B32B15/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大木場祐一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKOBA, YUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三田亮太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITA, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種燒結接合用片材等，上述燒結接合用片材具備：燒結接合層，其包含燒結性粒子及有機黏合劑，該燒結性粒子含有導電性金屬；及基材層，其與上述燒結接合層之至少一個表面重疊，與上述基材層重疊之上述燒結接合層之上述表面具有10.5 nm以上且90.0 nm以下之表面粗糙度Ra。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is, for example, a sinter bonding sheet including: a sinter bonding layer including sinterable particles containing a conductive metal, and an organic binder; and a substrate layer layered on at least one surface of the sinter bonding layer, in which the at least one surface of the sinter bonding layer on which the substrate layer is layered has a surface roughness Ra of 10.5 nm or more and 90.0 nm or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基材層</p>  
        <p type="p">2:燒結接合層</p>  
        <p type="p">10:燒結接合用片材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1115" publication-number="202611388"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611388.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611388</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含ＳＤＬ條之一體式蒙皮、包含該蒙皮之門及製造彼之方法</chinese-title>  
        <english-title>UNITARY SKIN COMPRISING SDL BARS, DOOR COMPRISING THE SKIN, AND METHODS OF MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">E06B3/663</main-classification>  
        <further-classification edition="200601120251203B">E06B3/70</further-classification>  
        <further-classification edition="200601120251203B">E06B3/30</further-classification>  
        <further-classification edition="200601120251203B">E06B3/96</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商普拉斯特普羅２０００有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PLASTPRO 2000, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　雪莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHERYL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約翰遜　斯科特　埃弗特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON, SCOTT EVERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　松斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SUNGSTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種門蒙皮、一種包含至少一個此種門蒙皮之門、及一種包含至少一個此種門蒙皮之套組。該門蒙皮係用於製造包含窗用玻璃單元之門，該窗用玻璃單元包括一或多個玻璃窗格。該門蒙皮包括提供外門表面之蒙皮本體部分。該蒙皮本體部分包括一組模擬分隔輕型(SDL)條，其可包括於兩個不同方向取向之一或多個條。該等條共有至少一個交叉接合，其具有相對於該組SDL條之底表面低於該外門表面之外接合表面。該蒙皮具有一體式結構。該組SDL條及該蒙皮本體部分係由相同材料製成。該門可包括在該窗用玻璃單元之兩側上之兩個門蒙皮。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A door skin, a door comprising at least one such a door skin, and a kit comprising at least one such a door skin are provided. The door skin is used to make a door comprising a glazing unit including one or more glass panes. The door skin includes a skin body portion providing an outer door surface. The skin body portion includes a set of simulated divided lite (SDL) bars, which may include one or more bars oriented in two different directions. The bars share at least one intersecting joint, which has an outer joint surface lower than the outer door surface relative to a bottom surface of the set of the SDL bars. The skin has a unitary structure. The set of SDL bars and the skin body portion are made of a same material. The door may include two door skins on both sides of the glazing unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:第一蒙皮</p>  
        <p type="p">114:第一外門表面</p>  
        <p type="p">118:第一頂端</p>  
        <p type="p">120:第二蒙皮</p>  
        <p type="p">124:第二外門表面</p>  
        <p type="p">128:第二頂端</p>  
        <p type="p">170:SDL條</p>  
        <p type="p">171:外部表面/外接合表面</p>  
        <p type="p">172:交叉接合</p>  
        <p type="p">175:底表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1116" publication-number="202611916"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611916.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611916</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120765</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於ＲＲＡＭ交叉陣列電路之電壓複製電路</chinese-title>  
        <english-title>VOLTAGE REPLICA CIRCUITS FOR RRAM-BASED CROSSBAR CIRCUITS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">G11C11/22</main-classification>  
        <further-classification edition="200601120251208B">G11C7/16</further-classification>  
        <further-classification edition="200601120251208B">G11C7/06</further-classification>  
        <further-classification edition="202301120251208B">H10B63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商特憶智能科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TETRAMEM INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹　文博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, WENBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱恒芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, HENGFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供基於憶阻器的交叉陣列電路。一交叉陣列電路可包括連接至相交的字元線與位元線之交叉點裝置的交叉陣列。該交叉陣列電路進一步包括一個第一讀出電路，其被配置為產生一個輸出電壓，該電壓表示流經連接至一個或多個交叉點裝置之位元線的電流之和。該交叉陣列電路進一步包括一個連接至該第一讀出電路的電壓複製電路。該電壓複製電路包括一個被配置為產生參考單元電流的複製單元、一個運算放大器、以及一個連接至該複製單元與該運算放大器的第二讀出電路。該運算放大器的輸出連接至該第一讀出電路，以向該第一讀出電路提供一個偏壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:交叉陣列電路</p>  
        <p type="p">311a-311n:字元線(WL)</p>  
        <p type="p">313a-313m:位元線(BL)</p>  
        <p type="p">315a-315z:交叉點裝置</p>  
        <p type="p">315:交叉點裝置</p>  
        <p type="p">3151:RRAM裝置</p>  
        <p type="p">3153:電晶體</p>  
        <p type="p">320:輸出感測器</p>  
        <p type="p">321:第一讀出電路</p>  
        <p type="p">323:ADC</p>  
        <p type="p">330:電壓複製電路</p>  
        <p type="p">331:複製單元</p>  
        <p type="p">333:第二讀出電路</p>  
        <p type="p">335:運算放大器</p>  
        <p type="p">341a:第一負載電路</p>  
        <p type="p">341b:第二負載電路</p>  
        <p type="p">343a:第一電晶體</p>  
        <p type="p">343b:第二電晶體</p>  
        <p type="p">Vdd:電源電壓</p>  
        <p type="p">Vout&lt;sub&gt;1&lt;/sub&gt;:第一輸出電壓</p>  
        <p type="p">Vout&lt;sub&gt;2&lt;/sub&gt;:第二輸出電壓</p>  
        <p type="p">Vreplica:複製偏壓</p>  
        <p type="p">VBIAS:偏壓訊號</p>  
        <p type="p">Icell:單元電流</p>  
        <p type="p">Dout:數位輸出</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1117" publication-number="202611641"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611641.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611641</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120777</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>曝光裝置以及管理方法</chinese-title>  
        <english-title>EXPOSURE APPARATUS AND CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G03F7/20</main-classification>  
        <further-classification edition="200601120251103B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡井雅晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAI, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能確認用以驅動空間光調變器的時序訊號是否適當之技術。一種曝光裝置，係具備時序訊號產生部52及時序訊號測量部56。時序訊號產生部52係根據依照基板移動而從編碼器29輸出的脈波訊號Sp產生用以驅動空間光調變器34的時序訊號St。時序訊號測量部56係測量從時序訊號產生部52輸出的時序訊號St的週期T。藉此，能確認根據編碼器29的脈波訊號Sp所產生的時序訊號St的週期T是否適當。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">26:主掃描機構</p>  
        <p type="p">29:編碼器</p>  
        <p type="p">34:空間光調變器</p>  
        <p type="p">40:控制部</p>  
        <p type="p">43:操作部</p>  
        <p type="p">44:顯示部</p>  
        <p type="p">51:脈波訊號取得部</p>  
        <p type="p">52:時序訊號產生部</p>  
        <p type="p">53:調變控制部</p>  
        <p type="p">54:參數記憶部</p>  
        <p type="p">55:移動速度決定部</p>  
        <p type="p">56:時序訊號測量部</p>  
        <p type="p">57:測量值記憶部</p>  
        <p type="p">dT:餘裕時間</p>  
        <p type="p">N:數量</p>  
        <p type="p">Sp:脈波訊號</p>  
        <p type="p">St:時序訊號</p>  
        <p type="p">T:週期</p>  
        <p type="p">Tmin:最短週期</p>  
        <p type="p">V:移動速度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1118" publication-number="202611335"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611335.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611335</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120793</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用六氟丙烯之蝕刻方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">C23F1/24</main-classification>  
        <further-classification edition="200601120251202B">C09K13/08</further-classification>  
        <further-classification edition="200601120251202B">C07C19/08</further-classification>  
        <further-classification edition="200601120251202B">H01L21/311</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江藤友亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山明平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, AKINARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒木克親</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKI, YOSHICHIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村新吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之目的在於提供一種新穎之使用六氟丙烯之蝕刻方法。一種使用六氟丙烯之蝕刻方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1119" publication-number="202611034"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611034.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611034</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120799</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二苯并噻吩鎓鹽化合物、其製造方法、及該化合物之用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D333/76</main-classification>  
        <further-classification edition="200601120251201B">C09K3/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商四國化成工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIKOKU CHEMICALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒木勇介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAKI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥村尚登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUMURA, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤川和之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKAWA, KAZUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富士平和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIHIRA, YAMATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子昌央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橫井彩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOI, AYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武田琢磨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, TAKUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種新穎的二苯并噻吩鎓鹽及其製造方法。又，本發明提供包含該二苯并噻吩鎓鹽之光酸產生劑、包含該光酸產生劑之阻劑組成物、使用該阻劑組成物之阻劑圖案之形成方法等。本發明關於化學式(I)所示化合物、包含該化合物之光酸產生劑、包含該光酸產生劑之阻劑組成物、及使用該阻劑組成物之阻劑圖案之形成方法。&lt;br/&gt;&lt;img align="absmiddle" height="155px" width="290px" file="ed10060.JPG" alt="ed10060.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; (式中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;相同或不同，表示氫原子；鹵素原子；-CF&lt;sub&gt;3&lt;/sub&gt;；-SO&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;3&lt;/sup&gt;；碳數1~10之烷基；-OH；選自式(S-1)~式(S-4)之聚合性基；或選自式(R-1)~式(R-7)之酸反應性基；R&lt;sup&gt;3&lt;/sup&gt;表示-CF&lt;sub&gt;3&lt;/sub&gt;、-CF&lt;sub&gt;2&lt;/sub&gt;CF&lt;sub&gt;3&lt;/sub&gt;、碳數1~10之烷基、或苯基；[A]&lt;sup&gt;-&lt;/sup&gt;表示三氟甲磺酸陰離子(TfO&lt;sup&gt;-&lt;/sup&gt;)或鹵化物離子)。&lt;br/&gt;&lt;img align="absmiddle" height="104px" width="513px" file="ed10061.JPG" alt="ed10061.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; (式中，R&lt;sup&gt;1a&lt;/sup&gt;表示氫原子或甲基，Y表示單鍵或碳數1~3之伸烷基)。&lt;br/&gt;&lt;img align="absmiddle" height="194px" width="615px" file="ed10062.JPG" alt="ed10062.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; (式中，Y與前述相同。R&lt;sup&gt;51&lt;/sup&gt;~R&lt;sup&gt;53&lt;/sup&gt;相同或不同，表示氫原子、碳數1~20之烷基、碳數2~8之烯基或碳數4~18之芳香族基，或者是，亦可R&lt;sup&gt;51&lt;/sup&gt;及R&lt;sup&gt;52&lt;/sup&gt;互相連接，與各別所鍵結之碳原子一同形成碳數3~20之脂肪族烴環；R&lt;sup&gt;54&lt;/sup&gt;及R&lt;sup&gt;55&lt;/sup&gt;相同或不同，表示氫原子、碳數1~6之烷基；R&lt;sup&gt;56&lt;/sup&gt;表示碳數1~20之烷基、碳數3~20之脂環式烴基；前述烷基、脂肪族烴環、及脂環式烴基所含之-CH&lt;sub&gt;2&lt;/sub&gt;-，亦可取代為-O-或-S-；d表示0~4之整數；惟，式(R-1)、式(R-3)、及式(R-5)~(R-7)中，係排除R&lt;sup&gt;51&lt;/sup&gt;~R&lt;sup&gt;53&lt;/sup&gt;全部為氫原子的情況)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1120" publication-number="202610553"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610553.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610553</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含天然纖維之氣溶膠產生物件及相關製造方法</chinese-title>  
        <english-title>AEROSOL GENERATING ARTICLE COMPRISING NATURAL FIBERS AND ASSOCIATED MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">A24D3/04</main-classification>  
        <further-classification edition="200601120251203B">A24D3/06</further-classification>  
        <further-classification edition="202001120251203B">A24F40/20</further-classification>  
        <further-classification edition="201201120251203B">D04H1/4266</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商ＪＴ國際公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JT INTERNATIONAL SA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐比達　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBIDAT, MOHAMMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴納　強漢斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAENNER, JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>板橋謙一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITABASHI, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴亞科諾夫　阿雷克希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIAKONOV, ALEKSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃班　卡門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIRBAN, CARMEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RO</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種氣溶膠產生製品(10)，包括：-過濾嘴部(14)，該過濾嘴部包括聚攏以形成棒的過濾嘴片材和包裹過濾嘴片材的過濾嘴包裹物(22)，過濾嘴片材由包括天然纖維的非織造基質形成；-基質部(12)，該基質部沿著製品軸線與過濾嘴部(14)依次定位並且包括氣溶膠產生基質；-製品包裹物(21)，該製品包裹物被佈置用於包裹基質部(12)和過濾嘴部(14)，並且限定覆蓋過濾嘴部(14)的過濾嘴包裹部分；其中，包括過濾嘴部(14)和製品包裹物(21)的過濾嘴包裹部分的過濾段(29)的整體密度(D)大於或等於0.165 mg/mm&lt;sup&gt;3&lt;/sup&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention concerns an aerosol generating article (10) comprising: - a filter portion (14) comprising a filter sheet gathered to form a rod and a filter wrapper (22) wrapping the filter sheet, the filter sheet being formed of nonwoven substrate comprising natural fibers; - a substrate portion (12) positioned sequentially with the filter portion (14) along an article axis and comprising an aerosol generating substrate; - an article wrapper (21) arranged for wrapping the substrate portion (12) and the filter portion (14), and defining a filter wrapping part covering the filter portion (14); wherein an overall density of a filtering segment (29) comprising the filter portion (14) and the filter wrapping part of the article wrapper (21) is greater than or equal to 0.165 mg/mm&lt;sup&gt;3&lt;/sup&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:氣溶膠產生製品</p>  
        <p type="p">12:基質部</p>  
        <p type="p">14:過濾嘴部</p>  
        <p type="p">16:包裹物</p>  
        <p type="p">21:製品包裹物</p>  
        <p type="p">22:過濾嘴包裹物</p>  
        <p type="p">25:通風孔</p>  
        <p type="p">29:過濾段</p>  
        <p type="p">X:製品軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1121" publication-number="202610826"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610826.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610826</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120814</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於藉由控制所採用之粉末的粒徑分布及比表面積來生產經燒結之積層體之程序</chinese-title>  
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY BY CONTROLLING THE PARTICLE SIZE DISTRIBUTION AND SPECIFIC SURFACE AREA OF A POWDER EMPLOYED</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">B32B18/00</main-classification>  
        <further-classification edition="200601120251203B">B22F3/105</further-classification>  
        <further-classification edition="200601120251203B">B22F3/12</further-classification>  
        <further-classification edition="200601120251203B">C04B35/64</further-classification>  
        <further-classification edition="200601120251203B">C04B35/01</further-classification>  
        <further-classification edition="200601120251203B">H01J37/32</further-classification>  
        <further-classification edition="200601120251203B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　路克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALKER, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑曼　珊曼莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAUMANN, SAMANTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於生產積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.    將第一粉末引入內部容積中以獲得該內部容積中的第一粉末層，其中&lt;br/&gt;i.     該內部容積&lt;br/&gt;A.   具有至少200 mm的橫截面寬度W，且&lt;br/&gt;B.   至少部分地藉由模具之內部表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;ii.    該第一粉末係包含第一成分粉末及另一成分粉末的混合物，其中該第一成分粉末及該另一成分粉末具有不同的化學組成；&lt;br/&gt;b.    使該第一粉末層經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.     該熱藉由跨該模具、該內部容積、或兩者施加的電壓產生，且&lt;br/&gt;ii.    該積層體包含第一層；&lt;br/&gt;其中&lt;br/&gt;該第一粉末之該另一成分粉末具有體積密度q對粒徑χ的粒徑分布D = q(χ)，使得&lt;br/&gt;I.     D在粒徑χ&lt;sub&gt;α&lt;/sub&gt;與體積密度q&lt;sub&gt;α&lt;/sub&gt;下具有全域最大值α，且&lt;br/&gt;II.   若D在粒徑χ&lt;sub&gt;β&lt;/sub&gt;與體積密度q&lt;sub&gt;β&lt;/sub&gt;下具有局部最大值β，則q&lt;sub&gt;α&lt;/sub&gt;/ q&lt;sub&gt;β&lt;/sub&gt;係至少10。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. introducing a first powder into an interior volume to obtain a first powder layer in the interior volume, wherein&lt;br/&gt;i. the interior volume&lt;br/&gt;A. has a cross-sectional width W of at least 200 mm, and&lt;br/&gt;B. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon;&lt;br/&gt;ii. the first powder is a mixture comprising a first constituent powder and a further constituent powder, wherein the first constituent powder and the further constituent powder have different chemical compositions;&lt;br/&gt;b. subjecting the first powder layer to a heat and a pressure to obtain the layered body, wherein&lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and&lt;br/&gt;ii. the layered body comprises a first layer;&lt;br/&gt;wherein&lt;br/&gt;the further constituent powder, of the first powder, has a particle size distribution D = q(χ) of volume density q over particle size χ, such that&lt;br/&gt;I. D has a global maximum α at particle size χ&lt;sub&gt;α&lt;/sub&gt;with volume density q&lt;sub&gt;α&lt;/sub&gt;, and&lt;br/&gt;II. if D has a local maximum β at particle size χ&lt;sub&gt;β&lt;/sub&gt;with volume density q&lt;sub&gt;β&lt;/sub&gt;, then q&lt;sub&gt;α&lt;/sub&gt;/ q&lt;sub&gt;β&lt;/sub&gt;is at least 10.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:第一粉末之成分粉末之粒徑分布</p>  
        <p type="p">601:第一成分粉末之粒徑分布</p>  
        <p type="p">602:另一成分粉末之粒徑分布</p>  
        <p type="p">603:全域最大值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1122" publication-number="202610827"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610827.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610827</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120815</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於生產具有密度梯度之經燒結積層體的程序</chinese-title>  
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY WITH DENSITY GRADIENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">B32B18/00</main-classification>  
        <further-classification edition="200601120251203B">B22F3/105</further-classification>  
        <further-classification edition="200601120251203B">B22F3/12</further-classification>  
        <further-classification edition="200601120251203B">C04B35/64</further-classification>  
        <further-classification edition="200601120251203B">C04B35/01</further-classification>  
        <further-classification edition="200601120251203B">H01J37/32</further-classification>  
        <further-classification edition="200601120251203B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　路克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALKER, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐納隆　馬修喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONELON, MATTHEW JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於生產積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.    將第一粉末及另一粉末引入內部容積中以獲得該內部容積中的第一粉末層及另一粉末層，其中該內部容積&lt;br/&gt;i.     具有至少200 mm的橫截面寬度W，且&lt;br/&gt;ii.    至少部分地藉由模具之內部表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;b.    使該第一粉末層及該另一粉末層經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.     該熱藉由跨該模具、該內部容積、或兩者施加的電壓產生，且&lt;br/&gt;ii.    該積層體包含第一層及另一層，&lt;br/&gt;c.    使該積層體在存在氧的情況下經受熱處理；&lt;br/&gt;其中，&lt;br/&gt;在該積層體之該熱處理之後，ρ&lt;sub&gt;T&lt;/sub&gt; ＞ ρ&lt;sub&gt;M&lt;/sub&gt;，其中ρ&lt;sub&gt;T&lt;/sub&gt;及ρ&lt;sub&gt;M&lt;/sub&gt;係在該另一層中測量之密度，且其中ρ&lt;sub&gt;T&lt;/sub&gt;係在該另一層中之第一位置處測量，且ρ&lt;sub&gt;M&lt;/sub&gt;係在該另一層中之第二位置處測量，且其中該第一位置比該第二位置更接近該第一層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for producing a layered body, comprising the following process steps: &lt;br/&gt;a. introducing a first powder and a further powder into an interior volume to obtain a first powder layer and a further powder layer in the interior volume, wherein the interior volume &lt;br/&gt;i. has a cross-sectional width W of at least 200 mm, and &lt;br/&gt;ii. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon; &lt;br/&gt;b. subjecting the first powder layer and the further powder layer to a heat and a pressure to obtain the layered body, wherein &lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and &lt;br/&gt;ii. the layered body comprises a first layer and a further layer, &lt;br/&gt;c. subjecting the layered body to a heat treatment in the presence of oxygen; &lt;br/&gt;wherein, &lt;br/&gt;following the heat treatment of the layered body, ρ&lt;sub&gt;T&lt;/sub&gt; ＞ ρ&lt;sub&gt;M&lt;/sub&gt;, with ρ&lt;sub&gt;T&lt;/sub&gt; and ρ&lt;sub&gt;M&lt;/sub&gt; being densities measured in the further layer, and wherein ρ&lt;sub&gt;T&lt;/sub&gt; is measured at a first position in the further layer and ρ&lt;sub&gt;M&lt;/sub&gt; is measured at a second position in the further layer, and wherein the first position is closer to the first layer than the second position.&lt;b/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:積層體</p>  
        <p type="p">601:第一層</p>  
        <p type="p">602:另一層</p>  
        <p type="p">603:第一表面</p>  
        <p type="p">604:另一表面</p>  
        <p type="p">605:第一中心線</p>  
        <p type="p">606:另一中心線</p>  
        <p type="p">607:中心</p>  
        <p type="p">608:第一區域</p>  
        <p type="p">609:第二區域</p>  
        <p type="p">610:另一區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1123" publication-number="202610734"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610734.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610734</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120820</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有整合式可調節流量阻尼出口的空氣輸送歧管</chinese-title>  
        <english-title>AIR DELIVERY MANIFOLD WITH INTEGRATED, ADJUSTABLE FLOW DAMPER OUTLETS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">B08B5/04</main-classification>  
        <further-classification edition="200601120251203B">F16L41/02</further-classification>  
        <further-classification edition="200601120251203B">F16K11/10</further-classification>  
        <further-classification edition="200601120251203B">G05B11/32</further-classification>  
        <further-classification edition="200601120251203B">G05D16/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊利諾工具工程公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅德里戈　理查Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RODRIGO, RICHARD D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈爾徹卡　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GORCZYCA, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於清潔一物體之真空系統。該系統包含一空氣歧管，其在一端連接有一阻尼器連接件。阻尼器連接件配置於複數個出口之一者中，阻尼器連接件接收一阻尼器。因此，可透過在各出口中的阻尼器連接件調整該阻尼器之位置及/或方向。在操作中，空氣歧管經配置以自一進氣口凸緣吸入空氣，移除被清潔物體上的灰塵與空氣，並經由該一或多個出口與阻尼器排出至一真空系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vacuum system is provided for cleaning an object. The system includes an air manifold with a damper coupling attached a given end. The damper coupling is arranged within one of a plurality of outlets, the damper coupling receives a damper. Thus, a position and/or orientation of the damper may be adjusted by the damper coupling within the various outlets. In operation, the air manifold is configured to draw air from an intake flange, removing dust and air from the object being cleaned, which is exhausted to a vacuum system via the one or more outlets and dampers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:真空系統</p>  
        <p type="p">102:空氣歧管</p>  
        <p type="p">104:第一端</p>  
        <p type="p">106:第二端</p>  
        <p type="p">108:阻尼器環</p>  
        <p type="p">112:阻尼器連接件</p>  
        <p type="p">113:框架</p>  
        <p type="p">114:空白蓋板</p>  
        <p type="p">115:材料</p>  
        <p type="p">116:可調整緊固件</p>  
        <p type="p">118:槓桿</p>  
        <p type="p">120:阻尼器</p>  
        <p type="p">122:入口凸緣</p>  
        <p type="p">126:空氣管</p>  
        <p type="p">128:靜電棒</p>  
        <p type="p">130:刷</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1124" publication-number="202611305"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611305.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611305</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120826</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銀合金、其濺鍍靶材及其薄膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">C22C5/06</main-classification>  
        <further-classification edition="200601120251202B">C22C9/00</further-classification>  
        <further-classification edition="200601120251202B">C23C14/14</further-classification>  
        <further-classification edition="200601120251202B">C09D5/33</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商古屋金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUYA METAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松村尊信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMURA, TAKANOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原口雅晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARAGUCHI, MASAHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倉田滉平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURATA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種銀合金、其濺鍍靶材、其薄膜及其漿料，上述銀合金滿足如下要求：為容易加工之銀合金，且於製成薄膜時，即便經過熱處理亦能抑制400 nm之光之反射率之降低。進而，本發明之目的在於藉由該銀合金薄膜來提供顯示器、反射電極、電子零件、光碟媒體、照明零件或電磁波屏蔽膜。本發明之銀合金之特徵在於含有0.20～0.50原子%之Cu及0.10～0.40原子%之Ge，其餘量為Ag及不可避免之雜質，且Cu與Ge之合計含量為0.40以上且未達0.80原子%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1125" publication-number="202611225"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611225.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611225</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120844</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環氧樹脂組成物、硬化物及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">C08L63/00</main-classification>  
        <further-classification edition="200601120251215B">C08G59/42</further-classification>  
        <further-classification edition="200601120251215B">C08G73/18</further-classification>  
        <further-classification edition="200601120251215B">C08K5/10</further-classification>  
        <further-classification edition="200601120251215B">C08K3/36</further-classification>  
        <further-classification edition="200601120251215B">H01L23/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納美仕股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂野裕斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIGENO, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田行宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, YUKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供不易發生脫層之環氧樹脂組成物。再者，提供上述環氧樹脂組成物的硬化物、具備上述硬化物之半導體裝置、上述半導體裝置的製造方法。 &lt;br/&gt;　　一種環氧樹脂組成物，其為包含環氧樹脂(A)、硬化促進劑(B)及無機填充材(C)之環氧樹脂組成物， &lt;br/&gt;　　環氧樹脂(A)包含胺基酚型環氧樹脂(A1)及低收縮環氧樹脂(A2)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1126" publication-number="202610714"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610714.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610714</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120878</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣液接觸部及具備該氣液接觸部的濕式集塵機</chinese-title>  
        <english-title>GAS-LIQUID CONTACT PART AND WET DUST COLLECTOR EQUIPPED WITH THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">B01D47/02</main-classification>  
        <further-classification edition="202201120251203B">B01D50/00</further-classification>  
        <further-classification edition="202101120251203B">F24F8/117</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＺＵＭＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZUMA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富田實</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMITA, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>児玉節男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KODAMA, SETUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題係在於提供一種相較於以往的濕式集塵機，即使在氣體流量較小的情況下，也能夠進行氣體與液體混合的氣液接觸部及具備該氣液接觸部的濕式集塵機。 &lt;br/&gt;　　用以解決課題之手段為，藉由一種氣液接觸部，係為具備複數個凹凸連續的受液面、及將液體供給至前述受液面的供液部，前述受液面係以比起一端部，另一端部的高度變高的方式傾斜配置，在前述供液部與前述受液面之間，存在有供前述液體通過的間隙，藉由將包含塵埃的氣體供給至前述間隙，使前述液體與前述氣體接觸的氣液接觸部、及具備該氣液接觸部的濕式集塵機，藉此，解決上述課題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:濕式集塵機</p>  
        <p type="p">11:氣液接觸部</p>  
        <p type="p">12:吸氣口</p>  
        <p type="p">13:儲藏槽</p>  
        <p type="p">14:送風機</p>  
        <p type="p">15:除濕器</p>  
        <p type="p">21:棒狀體</p>  
        <p type="p">23:阻礙板</p>  
        <p type="p">24:液化部</p>  
        <p type="p">25:隔板</p>  
        <p type="p">26:內壁</p>  
        <p type="p">27:配管</p>  
        <p type="p">117:緩衝槽</p>  
        <p type="p">119:泵浦</p>  
        <p type="p">121:過濾器</p>  
        <p type="p">122:殼體</p>  
        <p type="p">123:排出口</p>  
        <p type="p">131:區隔板</p>  
        <p type="p">132:流路</p>  
        <p type="p">133:連通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1127" publication-number="202610913"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610913.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610913</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120882</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流出嘴及附流出嘴之容器</chinese-title>  
        <english-title>SPOUT AND CONTAINER WITH SPOUT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">B65D51/22</main-classification>  
        <further-classification edition="200601120251203B">B65D47/10</further-classification>  
        <further-classification edition="200601120251203B">F16B7/18</further-classification>  
        <further-classification edition="200601120251203B">F16B7/20</further-classification>  
        <further-classification edition="200601120251203B">B65D51/24</further-classification>  
        <further-classification edition="200601120251203B">B65D25/48</further-classification>  
        <further-classification edition="202301120251203B">A61J1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＥＮ大塚製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EN OTSUKA PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相原貴裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIHARA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川啓太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種可容易地製作使穿刺部經由脆弱部而被支持於固定於容器的固定零件之構造的流出嘴及附流出嘴之容器。 &lt;br/&gt;本發明係具備：固定零件21，係固定地配置於容器10，且具有貫通孔31及密封部32，該貫通孔31係將容器10的內外之間予以貫通，該密封部32係在容器10內側封閉該貫通孔31；以及穿刺零件22，係具有穿刺部41及裝設部43，該穿刺部41係可穿刺密封部32，該裝設部43係安裝於固定零件21而被固定，且經由脆弱部42而與穿刺部41連結；在將穿刺部41配置於貫通孔31內的狀態下，使穿刺零件22藉由裝設部43而裝設於固定零件21。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An objective of the present invention is to provide a spout and a container with spout that is capable of easily producing a structure in which a puncture part is supported via a fragile part on a fixed parts fixed to a container. &lt;br/&gt;The present invention includes: a fixed parts 21 that is fixedly arranged on a container 10 and has a through hole 31 penetrated between the inside and outside of the container 10 and a sealing part 32 blocking the through hole 31 in an inner side of the container 10; and a puncture parts 22 that includes a puncture part 41 capable of puncturing the sealing part 32 and an attachment part 43 attached to the fixed parts 21 to be fixed and connecting the puncture part 41 via the fragile part 42; and the puncture parts 22 is attached to the fixed parts 21 by the attachment part 43 in a state that the puncture part 41 is arranged inside the through hole 31.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:流出嘴</p>  
        <p type="p">21:固定零件</p>  
        <p type="p">22:穿刺零件</p>  
        <p type="p">31:貫通孔</p>  
        <p type="p">31a:嵌合部</p>  
        <p type="p">31b:基部用孔</p>  
        <p type="p">31c:突出用孔</p>  
        <p type="p">32:密封部</p>  
        <p type="p">33:本體部</p>  
        <p type="p">34:船形形狀部</p>  
        <p type="p">34a:內側端面</p>  
        <p type="p">35:突出部</p>  
        <p type="p">36:第二被卡合部</p>  
        <p type="p">41:穿刺部</p>  
        <p type="p">42:脆弱部</p>  
        <p type="p">43:裝設部</p>  
        <p type="p">44:貫通中空部</p>  
        <p type="p">45:大徑部</p>  
        <p type="p">46:小徑部</p>  
        <p type="p">51:基部</p>  
        <p type="p">52:突出筒部</p>  
        <p type="p">53:第一被卡合部</p>  
        <p type="p">55:前端部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1128" publication-number="202611238"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611238.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611238</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120887</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>原子筆用水性墨液組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C09D4/02</main-classification>  
        <further-classification edition="200601120251210B">C09D11/18</further-classification>  
        <further-classification edition="200601120251210B">C09D5/04</further-classification>  
        <further-classification edition="200601120251210B">C08K5/053</further-classification>  
        <further-classification edition="200601120251210B">C08L23/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱鉛筆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI PENCIL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林雄介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎祐一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, YUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐川弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAGAWA, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之原子筆用水性墨液組成物， &lt;br/&gt;　　至少含有色材、多元醇及/或二醇醚類，及澱粉分解物或將前述澱粉分解物還原而成之糖醇， &lt;br/&gt;　　前述多元醇及前述二醇醚類，為碳數4以上且於25℃之比重為未達1.00，且 &lt;br/&gt;　　前述澱粉分解物之DE值為10以上20以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1129" publication-number="202610768"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610768.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610768</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120896</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>再循環的拋光墊及其製造方法</chinese-title>  
        <english-title>RECYCLED POLISHING PAD AND PREPARATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250911B">B24B37/22</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商恩普士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENPULSE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李正男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNGNAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹承植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, SEUNGSIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張在哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JAECHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邊在正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BYUN, JAEJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔容壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, YONGSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申有眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, YUJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鍾佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昇炯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, SUNGHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明之實施例，提供一種再循環的拋光墊及一種製造一再循環的拋光墊的方法。該再循環的拋光墊包含一緩衝層、一黏著層及在一側具有複數個凹槽之一再使用的拋光層上，且藉由一特定方程式計算的該再使用的拋光層之壓縮率被控制在一預定範圍內；因此，可再使用該拋光層，同時維持極佳的拋光速率及拋光均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to embodiments of the present invention, there are provided a recycled polishing pad and a process for preparing a recycled polishing pad. The recycled polishing pad comprises a cushion layer, an adhesive layer, and a reused polishing layer having a plurality of grooves on one side, and the compressibility of the reused polishing layer calculated by a specific equation is controlled within a predetermined range; thus, the polishing layer can be reused while excellent polishing rate and polishing uniformity are maintained.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:再循環的拋光墊</p>  
        <p type="p">210:再使用的拋光層</p>  
        <p type="p">215:凹槽</p>  
        <p type="p">220:黏著層</p>  
        <p type="p">230:緩衝層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1130" publication-number="202610555"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610555.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610555</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120911</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造壓紋的過濾材料片材的設備和方法</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR MANUFACTURING A CRIMPED SHEET OF FILTER MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251203B">A24D3/17</main-classification>  
        <further-classification edition="200601120251203B">A24D3/04</further-classification>  
        <further-classification edition="200601120251203B">B29C59/04</further-classification>  
        <further-classification edition="200601120251203B">B01D39/14</further-classification>  
        <further-classification edition="200601120251203B">B29D16/00</further-classification>  
        <further-classification edition="200601120251203B">B29D7/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商ＪＴ國際公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JT INTERNATIONAL SA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>板橋　謙一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITABASHI, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里山　阿麥德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LISAN, AHMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尚達爾　阿諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANDARD, ARNAUD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫奇卡洛夫　達米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUCHKAROV, DAMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種壓紋設備，包括第一壓紋輥(40)和第二壓紋輥(42)，每個壓紋輥設置有在其外表面上周向延伸的一組脊(46)，每個脊(46)具有根部(50)、峰(52)、以及兩個側面(54)，該等脊(46)展現出脊深度(D)並且被該等脊(46)之間的限定節距(P)軸向間隔開。第一壓紋輥(40)和第二壓紋輥(42)中的一個或每一個壓紋輥的脊(46)被配置成使得該等脊(46)之間的節距(P)介於0.8 mm與1.2 mm之間、並且深度節距比(D/P)介於1.1與2.0之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The crimping apparatus comprises a first crimping roller (40) and a second crimping roller (42), each being provided with a set of ridges (46) extending circumferentially on an outer surface thereof, each ridge (46) having a root (50), a crest (52) and two flanks (54), the ridges (46) exhibiting a ridge depth (D) and being axially spaced by a defined pitch (P) between the ridges (46). The ridges (46) of one or each of the first crimping roller (40) and the second crimping roller (42) are configured such that the pitch (P) between the ridges (46) is comprises between 0.8 mm and 1.2 mm and the depth-to pitch-ratio (D/P) is comprised between 1.1 and 2.0.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">46:脊</p>  
        <p type="p">50:根部</p>  
        <p type="p">52:峰</p>  
        <p type="p">54:側面</p>  
        <p type="p">56:脊/輥槽/槽</p>  
        <p type="p">58:底部</p>  
        <p type="p">60:峰圓角</p>  
        <p type="p">62:根部圓角</p>  
        <p type="p">α:側面角度</p>  
        <p type="p">B:底部寬度</p>  
        <p type="p">D:(脊)深度</p>  
        <p type="p">P:節距</p>  
        <p type="p">r:曲率半徑/根部半徑</p>  
        <p type="p">R:曲率半徑/峰半徑</p>  
        <p type="p">W:(峰)寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1131" publication-number="202611337"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611337.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611337</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120913</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電解器系統之暖機方法</chinese-title>  
        <english-title>WARM UP METHOD FOR AN ELECTROLYSER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251203B">C25B15/021</main-classification>  
        <further-classification edition="202101120251203B">C25B9/67</further-classification>  
        <further-classification edition="201601120251203B">H01M8/12</further-classification>  
        <further-classification edition="201601120251203B">H01M8/04007</further-classification>  
        <further-classification edition="200601120251203B">G05D23/19</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商席瑞絲電力有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CERES POWER LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞利　約書亞　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYLEY, JOSHUA CLAYDON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥格林　大衛　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCGLYNN, DAVID CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅思利　伊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METHLEY, IAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法涅爾　丹尼爾　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENNEL, DANIEL ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾茨　佐爾坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERCZ, ZOLTAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電解器系統之暖機方法，該電解器系統包含一或多個堆疊電解器電池，且各該一或多個堆疊具有燃料及氧容積。該方法包含加熱該一或多個堆疊，以將該一或多個堆疊提高至第一閾值溫度T1。當該溫度係大於第一閾值溫度T1時，對各該一或多個堆疊的燃料容積提供一熱傳流體。遞增地增加該熱傳流體之溫度，以將該一或多個堆疊進一步加熱至大於該第一閾值溫度T1。當到達第二閾值溫度T2時，對各該一或多個堆疊的燃料容積提供燃料，並對各該一或多個堆疊提供電流，以經由電解產生產物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of warm up of an electrolyser system comprising one or more stacks of electrolyser cells, each of the one or more stacks with fuel and oxygen volumes. The method comprising heating the one or more stacks to raise the one or more stacks to a first threshold temperature T1. A heat transfer fluid is provided to the fuel volume of each of the one or more stacks when the temperature is above first threshold temperature T1. The temperature of the heat transfer fluid is incrementally increased to further heat the one or more stacks above the first threshold temperature T1. When a second threshold temperature, T2, is reached, fuel is provided to the fuel volume of each of the one or more stacks and electrical current to each of the one or more stacks to generate product via electrolysis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:暖機方法</p>  
        <p type="p">205,210,215,220:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1132" publication-number="202611102"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611102.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611102</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120930</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、其硬化膜及含有該硬化膜的半導體封裝件</chinese-title>  
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, HARDENED FILM THEREOF, AND SEMICONDUCTOR PACKAGE CONTAINING THE HARDENED FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">C08F2/50</main-classification>  
        <further-classification edition="200601120251209B">G03F7/004</further-classification>  
        <further-classification edition="200601120251209B">C08L79/08</further-classification>  
        <further-classification edition="200601120251209B">C08G73/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申在賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, JAEHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本皓史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小沼勇輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONUMA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西岡宏司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIOKA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種感光性樹脂組成物，其即使於低溫下進行醯亞胺化，亦能形成對金屬具有高接著強度的硬化膜。 &lt;br/&gt;為解決該課題，本發明之感光性樹脂組成物含有：聚醯胺酸樹脂，係具有源自四羧酸酐的構成單元(A)及源自二胺的構成單元(B)；非離子系光鹼產生劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a photosensitive resin composition that can form a hardened film with high adhesion strength to metal even when imidized at low temperatures. To solve this issue, the photosensitive resin composition of the present invention comprises: a polyamic acid resin, which has a tetra-carboxylic anhydride-derived constituent unit (A) and a diamine-derived constituent unit (B); a non-ionic photobase generator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1133" publication-number="202610806"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610806.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610806</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121005</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成型設備及物品製造方法</chinese-title>  
        <english-title>SHAPING APPARATUS AND ARTICLE MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">B29C59/02</main-classification>  
        <further-classification edition="200601120251204B">G03F7/00</further-classification>  
        <further-classification edition="200601120251204B">H05F3/04</further-classification>  
        <further-classification edition="200601120251204B">B29C33/34</further-classification>  
        <further-classification edition="200601120251204B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成岡晋太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARIOKA, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案提供一種用於使用模具在基板上成型組合物的成型設備，包括：配置為在保持該基板的同時移動的平臺；以及導電構件，從該平臺突出以非接觸方式從該模具中去除電荷，其中該導電構件配置為藉由該平臺的移動接近該模具並引發從該模具放電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a shaping apparatus for shaping a composition on a substrate using a mold, comprising: a stage configured to move while holding the substrate; and an electrically-conductive member protruding from the stage to remove an electric-charge from the mold in a non-contact manner, wherein the electrically-conductive member is configured to approach the mold by the movement of the stage and cause discharge from the mold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">CNT:控制器</p>  
        <p type="p">CU:固化單元</p>  
        <p type="p">DISP:分配器</p>  
        <p type="p">e:電荷</p>  
        <p type="p">IMP:壓印設備</p>  
        <p type="p">M:模具</p>  
        <p type="p">MD:模具驅動機構</p>  
        <p type="p">MH:模具保持器</p>  
        <p type="p">NDL:靜電消除器</p>  
        <p type="p">NZ:氣體供應器</p>  
        <p type="p">p1,p2,p3:顆粒</p>  
        <p type="p">PC:壓力控制器</p>  
        <p type="p">PR:圖案區域</p>  
        <p type="p">S:基板</p>  
        <p type="p">SB:支撐基座</p>  
        <p type="p">SD:基板驅動機構</p>  
        <p type="p">SP:空間</p>  
        <p type="p">ST:平臺</p>  
        <p type="p">TR:透射構件</p>  
        <p type="p">X1:成型位置</p>  
        <p type="p">X2:供應位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1134" publication-number="202611129"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611129.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611129</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固體組成物、擠製成形體、吹氣成形體、轉注成形體、壓製成形體、射出成形體、被覆電線及成形體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">C08F214/26</main-classification>  
        <further-classification edition="200601120251202B">C08L27/18</further-classification>  
        <further-classification edition="200601120251202B">C08K3/08</further-classification>  
        <further-classification edition="200601120251202B">A61K8/70</further-classification>  
        <further-classification edition="200601120251202B">C08J3/03</further-classification>  
        <further-classification edition="200601120251202B">B29C45/00</further-classification>  
        <further-classification edition="201901120251202B">B29C48/00</further-classification>  
        <further-classification edition="200601120251202B">B29C49/00</further-classification>  
        <further-classification edition="200601120251202B">B29C70/36</further-classification>  
        <further-classification edition="200601120251202B">H01B3/44</further-classification>  
        <further-classification edition="200601120251202B">H01B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豊田瑞菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYODA, MIZUNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田口大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAGUCHI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明課題在於提供一種固體組成物，其可形成高溫拉伸伸度、電絕緣性、耐熱性、彎曲彈性模數、高溫拉伸彈性模數、低著色性及低發泡性優異之成形體；以及，提供擠製成形體、吹氣成形體、轉注成形體、壓製成形體、射出成形體、被覆電線及成形體。&lt;br/&gt; 本發明固體組成物包含共聚物及金屬元素，前述共聚物包含以四氟乙烯為主體之單元與以全氟(烷基乙烯基醚)為主體之單元；相對於共聚物中所含之全部單元，以全氟(烷基乙烯基醚)為主體之單元之含量為2.9~4.0質量%；相對於共聚物中所含之全部單元，以四氟乙烯為主體之單元之含量為96.0~97.1質量%；遵循ASTM D1238，在溫度372℃之條件下測定之固體組成物的熔體流動速率為1.4~2.9g/10分鐘；共聚物之熔點為298℃以上；以共聚物之每10&lt;sup&gt;6&lt;/sup&gt;個碳數計，共聚物所具有之特定官能基數的合計為150個以下；並且，相對於固體組成物之總質量，金屬元素之含量為0.0100~2.0000質量ppm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1135" publication-number="202612156"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612156.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612156</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121028</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">H01L23/538</main-classification>  
        <further-classification edition="200601120251008B">H01L23/053</further-classification>  
        <further-classification edition="202501120251008B">H10D62/13</further-classification>  
        <further-classification edition="202301120251008B">H10B80/00</further-classification>  
        <further-classification edition="202501120251008B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東園正義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGASHIZONO, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種抑制多個半導體晶片的堆疊中所使用的接合材料意外溢出且可靠性高的半導體裝置。根據一個實施例，一種半導體裝置包括基板，所述基板包括第一表面以及位於第一表面中的凹槽部分。在凹槽部分的底表面上設置有第一半導體晶片。第一絕緣材料填充於凹槽部分中且覆蓋第一半導體晶片的至少一個表面。在第一半導體晶片上方堆疊有至少一個第二半導體晶片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a semiconductor device having high reliability where unintended protrusion of a bonding material used for stacking a plurality of semiconductor chips is prevented. According to one embodiment, a semiconductor device includes a substrate including a first surface and a recess portion in the first surface. A first semiconductor chip is disposed on a bottom surface of the recess portion. A first insulating material is filled in the recess portion and covers at least one surface of the first semiconductor chip. At least one second semiconductor chip is stacked above the first semiconductor chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">10:樹脂材料</p>  
        <p type="p">11a、11b:阻焊劑</p>  
        <p type="p">12:配線</p>  
        <p type="p">13a、13b:電極接墊</p>  
        <p type="p">BW:接合配線</p>  
        <p type="p">CAV:凹槽部分</p>  
        <p type="p">CH1、CH2、CH3:半導體晶片</p>  
        <p type="p">D1、D2、D3:絕緣材料</p>  
        <p type="p">F1:第一表面</p>  
        <p type="p">F2:第二表面</p>  
        <p type="p">MR:密封樹脂</p>  
        <p type="p">SUB1:配線基板</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1136" publication-number="202611662"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611662.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611662</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121036</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子電路及操作一電子電路之方法</chinese-title>  
        <english-title>ELECTRONIC CIRCUIT AND METHOD OF OPERATING AN ELECTRONIC CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">G05F1/613</main-classification>  
        <further-classification edition="200601120251215B">H02M3/135</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛爾蘭商納維達斯半導體有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAVITAS SEMICONDUCTOR LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金瑟　丹尼爾　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINZER, DANIEL M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏瑪　善桃喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, SANTOSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　佑　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JU JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電子電路。該電子電路包含具有GaN之一基板，及形成於該基板上且包含一第一控制閘極及一第一源極之一功率開關。該電子電路亦包含形成於該基板上且包含耦合至該第一控制閘極之一輸出之一驅動電路，及具有一供應電壓且耦合至該驅動電路之一電源供應器，其中該輸出可經驅動至該供應電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic circuit is disclosed. The electronic circuit includes a substrate having GaN, and a power switch formed on the substrate and including a first control gate and a first source. The electronic circuit also includes a drive circuit formed on the substrate and including an output coupled to the first control gate, and a power supply having a supply voltage and coupled to the drive circuit, where the output can be driven to the supply voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路/整合式半橋電力轉換電路</p>  
        <p type="p">103:低側GaN裝置/低側裝置</p>  
        <p type="p">104:基於GaN之低側電路/低側電路</p>  
        <p type="p">105:高側GaN裝置/高側裝置</p>  
        <p type="p">106:基於GaN之高側電路/高側電路</p>  
        <p type="p">107:負載</p>  
        <p type="p">110:自舉電容器</p>  
        <p type="p">115:低側電力電晶體/低側電晶體</p>  
        <p type="p">117:低側電晶體控制閘極</p>  
        <p type="p">120:整合式低側電晶體驅動器</p>  
        <p type="p">123:輸出</p>  
        <p type="p">125:高側電力電晶體/高側電晶體</p>  
        <p type="p">127:高側控制閘極</p>  
        <p type="p">130:整合式高側電晶體驅動器</p>  
        <p type="p">133:輸出</p>  
        <p type="p">135:電壓源</p>  
        <p type="p">137:汲極</p>  
        <p type="p">140:源極</p>  
        <p type="p">143:汲極</p>  
        <p type="p">145:切換節點</p>  
        <p type="p">147:源極</p>  
        <p type="p">150:位準移位電路/低側控制電路</p>  
        <p type="p">153:控制電路</p>  
        <p type="p">155:起動電路</p>  
        <p type="p">157:自舉電容器充電電路</p>  
        <p type="p">160:屏蔽電容器</p>  
        <p type="p">161:箝位器電路</p>  
        <p type="p">BOOTFET_DR:閘極驅動信號/信號</p>  
        <p type="p">HS_GATE:信號</p>  
        <p type="p">Iref:參考電流/參考電流槽</p>  
        <p type="p">LS_GATE:閘極信號/信號</p>  
        <p type="p">PWM_LS:信號/低信號</p>  
        <p type="p">PWM_HS:經脈衝寬度調變高側信號/高信號/信號</p>  
        <p type="p">V+:幹線電壓</p>  
        <p type="p">Vboot:信號/最大電壓</p>  
        <p type="p">Vcc:電壓</p>  
        <p type="p">Vdd_hs:源極電壓</p>  
        <p type="p">Vref:參考電壓</p>  
        <p type="p">Vsw:切換節點電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1137" publication-number="202611208"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611208.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611208</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121073</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可自溶解的封裝系統、製備方法及其片劑產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08K5/00</main-classification>  
        <further-classification edition="200601120251201B">C08L101/14</further-classification>  
        <further-classification edition="200601120251201B">C08L71/02</further-classification>  
        <further-classification edition="200601120251201B">C08J5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎　裕德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YUE TAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　忠宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JONG HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎　裕德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YUE TAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　忠宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JONG HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可自溶解的封裝系統，其製備方法及自溶解片劑，包括功能成分和聚合物，功能成分分散並封裝在聚合物中，形成固態且可溶於水的封裝系統。被封裝的功能成分由於不含水，使其可使用相對簡單的容器進行安全運輸，從而大大減少運輸體積和重量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1138" publication-number="202611119"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611119.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611119</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121099</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、及電子器件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/14</main-classification>  
        <further-classification edition="200601120251201B">C08F212/32</further-classification>  
        <further-classification edition="200601120251201B">C08F220/30</further-classification>  
        <further-classification edition="200601120251201B">C08F220/58</further-classification>  
        <further-classification edition="200601120251201B">C08F224/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠山直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKEYAMA, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小島雅史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楜澤佑真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURUMISAWA, YUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸茂和博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUMO, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、及電子器件之製造方法，所述感光化射線性或感放射線性樹脂組成物含有：包含具有酸分解性基的重複單元（a）的樹脂（A）；藉由光化射線或放射線之照射產生酸的化合物（B）；溶劑；以及交聯劑，其中，樹脂（A）中的重複單元（a）的含量相對於樹脂（A）的所有重複單元為40莫耳%以上，所述光阻膜藉由上述感光化射線性或感放射線性樹脂組成物而形成，所述圖案形成方法包括：製程（1），至少使具有特定結構的化合物及具有酸分解性基的單體聚合以得到聚合物（Q）；製程（2），藉由酸或鹼的作用來分解聚合物（Q）以得到聚合物（P）；製程（3），得到含有聚合物（P）、光酸產生劑及溶劑的感光化射線性或感放射線性樹脂組成物；製程（4），使用所述感光化射線性或感放射線性樹脂組成物而形成膜；製程（5），對膜進行曝光；以及製程（6），用含有乙酸丁酯及碳數9以上且12以下的烴的有機系處理液對經曝光後的膜進行顯影，所述電子器件之製造方法包括上述圖案形成方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1139" publication-number="202612168"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612168.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612168</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池組以及包括其之載具</chinese-title>  
        <english-title>BATTERY PACK AND VEHICLE INCLUDING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251204B">H01M50/569</main-classification>  
        <further-classification edition="202101120251204B">H01M50/204</further-classification>  
        <further-classification edition="202101120251204B">H01M50/298</further-classification>  
        <further-classification edition="200601120251204B">H01M10/48</further-classification>  
        <further-classification edition="201901120251204B">G01R31/382</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺龍赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG-HYUCK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋鐘珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, JONG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安埈永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, JUN-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鎭浯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN-OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李庸鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YONG-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭仁赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, IN-HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露的電池組包括：多個電池芯；連接到電池芯的匯流排組件；以及連接到匯流排組件的至少一個感測組件，其中感測組件可包括：感測構件，包括配置為感測多個電池芯中至少一些的至少一個感測分支；以及耦合到感測分支並配置為支撐感測分支的至少一個支撐構件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery pack according to the present disclosure includes: a plurality of battery cells; a bus-bar assembly connected to the battery cells; and at least one sensing assembly connected to the bus-bar assembly, wherein the sensing assembly may include: a sensing member including at least one sensing branch configured to sense at least some of the plurality of battery cells; and at least one support member coupled to the sensing branch and configured to support the sensing branch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電池陣列結構</p>  
        <p type="p">200:匯流排組件</p>  
        <p type="p">300:感測組件</p>  
        <p type="p">X、Y、Z:方向/軸方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1140" publication-number="202611245"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611245.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611245</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251211B">C09J7/20</main-classification>  
        <further-classification edition="201801120251211B">C09J7/40</further-classification>  
        <further-classification edition="200601120251211B">C09J159/00</further-classification>  
        <further-classification edition="201901120251211B">B32B7/023</further-classification>  
        <further-classification edition="200601120251211B">B32B7/12</further-classification>  
        <further-classification edition="200601120251211B">B32B17/10</further-classification>  
        <further-classification edition="200601120251211B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森下凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORISHITA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戸成大祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONARU, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南久遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINAMI, KUON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五枝龍太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOEDA, RYUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之積層體具備接著膜、及設置於上述接著膜之一面之第1剝離性基材，且於將第1剝離性基材與接著膜之間之剝離強度設為A（N/25 mm），並將玻璃板貼附於接著膜之與第1剝離性基材相接之面的相反側之面時接著膜與玻璃板之間之剝離強度設為B（N/25 mm）之情形時，剝離強度比（A/B）為4以上。根據本發明，能夠提供一種二次加工優異之積層體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1141" publication-number="202611258"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611258.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611258</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">C09J159/00</main-classification>  
        <further-classification edition="200601120251212B">C08J5/22</further-classification>  
        <further-classification edition="201901120251212B">B32B7/023</further-classification>  
        <further-classification edition="200601120251212B">B32B27/08</further-classification>  
        <further-classification edition="200601120251212B">B32B27/30</further-classification>  
        <further-classification edition="200601320251212B">B29K29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森下凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORISHITA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南久遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINAMI, KUON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戸成大祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONARU, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之積層體具備熱塑性樹脂片及間隔層，上述間隔層之投影面積為上述熱塑性樹脂片之投影面積以上。 &lt;br/&gt;根據本發明，可提供一種能夠抑制熱塑性樹脂片之黏連（blocking）之積層體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1142" publication-number="202611361"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611361.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611361</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121145</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預測系統及藥液</chinese-title>  
        <english-title>PREDICTION SYSTEM AND CHEMICAL SOLUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">D21F7/00</main-classification>  
        <further-classification edition="200601120251203B">G01N33/18</further-classification>  
        <further-classification edition="200601120251203B">G01N21/88</further-classification>  
        <further-classification edition="202301120251203B">G06F18/21</further-classification>  
        <further-classification edition="202301120251203B">G06N5/04</further-classification>  
        <further-classification edition="201701120251203B">G06T7/00</further-classification>  
        <further-classification edition="200601120251203B">G05B23/02</further-classification>  
        <further-classification edition="200601120251203B">G08B21/18</further-classification>  
        <further-classification edition="200601120251203B">D21H21/14</further-classification>  
        <further-classification edition="200601120251203B">D21H23/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商明答克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAINTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大高弘行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTAKA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野間美沙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOMA, MISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遊佐和之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUSA, KAZUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂田人丸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKATA, HITOMARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関谷宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIYA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種預測系統及藥液，可預測紙張之異常的發生，藉此可防止紙張發生異常。 &lt;br/&gt;本發明之預測系統及藥液當中，預測系統係具備：用以進行紙漿懸浮液之水質測定的測定部(30)；用以拍攝經過乾部的紙張之影像的攝像部(40)；以及與測定部及攝像部連接的控制部(20)，水質測定是從由浮游物質量測定、濁度測定、灰分測定、氧化還原電位測定、原料總濃度測定、原料產出率測定、灰分產出率測定、導電率測定、水溫測定及pH測定所構成的群組中選擇的至少一個，控制部(20)具有：取得影像資料及測定結果的取得手段(21)；用以檢測潛在缺陷的檢測手段(22)；用以抽出潛在缺陷的特徵量的抽出手段(23)；將潛在缺陷依種類加以分類的分類手段(24)；取得顯示出測定資訊及缺陷數量資訊之關係的預測模型的模型取得手段(25)；對從預測模型得到的運算測定結果設定臨界值的設定手段(26)；以及實測到的實測測定結果超過臨界值時發送警告的發送手段(27)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to provide a prediction system that can predict and thereby prevent occurrence of defects in paper, along with a chemical solution. &lt;br/&gt;Provided as a solution in the present invention is a prediction system and a chemical solution. The prediction system includes a measurement unit 30 for measuring water quality of a pulp suspension, an imaging unit 40 for imaging the paper that has passed through a dry part, and a control unit 20 connected to the measurement unit and the imaging unit. Water quality measurement is at least one selected from the group consisting of suspended solids measurement, turbidity measurement, ash content measurement, oxidation-reduction potential measurement, total feedstock concentration measurement, feedstock yield measurement, ash yield measurement, conductivity measurement, water temperature measurement, and pH measurement. The control unit 20 includes an acquisition means 21 for acquiring image data and measurement results; a detection means 22 for detecting potential defects; an extraction means 23 for extracting feature quantities of the potential defects; a classification means 24 for classifying the potential defects by type; a model acquisition means 25 for acquiring a prediction model showing the relationship between measurement information and defect count information; a setting means 26 for setting a threshold for the calculated measurement results obtained from the prediction model; and a transmission means 27 for transmitting an alert when the actual measurement results exceed the threshold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:流漿箱</p>  
        <p type="p">2:網部</p>  
        <p type="p">2a:濕部</p>  
        <p type="p">3:壓水部</p>  
        <p type="p">4:乾部</p>  
        <p type="p">5:捲紙部</p>  
        <p type="p">6:白水池</p>  
        <p type="p">10:抄紙機</p>  
        <p type="p">20:控制部</p>  
        <p type="p">30:測定部</p>  
        <p type="p">34:種箱</p>  
        <p type="p">40:攝像部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1143" publication-number="202612086"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612086.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612086</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板搬運裝置及基板搬運方法</chinese-title>  
        <english-title>SUBSTRATE CARRIER APPARATUS AND SUBSTRATE CARRYING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251105B">H01L21/677</main-classification>  
        <further-classification edition="200601120251105B">B25J9/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮下友希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYASHITA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種有助於避免末端效應器之前端與基板碰撞之技術。 &lt;br/&gt;本發明之基板搬運裝置110包含搬運單元20及感測器30。搬運單元20包含末端效應器21，使末端效應器21自末端效應器21之前端部開始進入基板收容器C之內部，將基板相對於基板收容器C搬入搬出。感測器30包含：發光部31，其朝向位於即將進入基板收容器C之前之正前位置之末端效應器21之前端部輸出測定光L1；及受光部32，其接收來自發光部31之測定光L1；且基於受光部32接收到之測定光L1，檢測末端效應器21之前端部之位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:末端效應器</p>  
        <p type="p">30:感測器</p>  
        <p type="p">31:發光部</p>  
        <p type="p">31s:發光面</p>  
        <p type="p">32:受光部</p>  
        <p type="p">32s:受光面</p>  
        <p type="p">55:開口部</p>  
        <p type="p">110:基板搬運裝置</p>  
        <p type="p">211A:第1長條部分</p>  
        <p type="p">211B:第2長條部分</p>  
        <p type="p">212:連結部分</p>  
        <p type="p">C:基板收容器</p>  
        <p type="p">Dx:進退方向</p>  
        <p type="p">Dy:排列方向</p>  
        <p type="p">L1:測定光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1144" publication-number="202610607"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610607.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610607</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121211</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>按摩機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251130B">A61H7/00</main-classification>  
        <further-classification edition="200601120251130B">A61H9/00</further-classification>  
        <further-classification edition="200601120251130B">A61H15/00</further-classification>  
        <further-classification edition="200601120251130B">A61H23/02</further-classification>  
        <further-classification edition="200601120251130B">A61H39/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大東電機工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAITO ELECTRIC MACHINE INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾根也寸志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONE, YASUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉彪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEIBIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水新策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, SHINSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種能夠對被施療部施加適當的推壓力之按摩機。按摩機1具有：本體部3，與使用者的既定的被施療部相對向地配置；以及按摩機構4，設置於與被施療部相對向的本體部3的施療面S的內側，對被施療部進行推壓按摩。按摩機構4具有：第一施療件51，對被施療部施加按摩；以及位置變更機構26，變更第一施療件51的上下方向的施療件位置；位置變更機構26係使施療件位置在第一施療件51下降到下側的第一狀態、和第一施療件51上升到上側的第二狀態之間進行變更。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:按摩機</p>  
        <p type="p">2:基座部</p>  
        <p type="p">3:本體部</p>  
        <p type="p">3A:座部</p>  
        <p type="p">3B:靠背部</p>  
        <p type="p">3C:擱腳部</p>  
        <p type="p">4:按摩機構</p>  
        <p type="p">4A:第一按摩機構</p>  
        <p type="p">4B:第二按摩機構</p>  
        <p type="p">4C:第三按摩機構</p>  
        <p type="p">5:電源裝置</p>  
        <p type="p">6:致動器裝置</p>  
        <p type="p">7:空氣供給裝置</p>  
        <p type="p">8:座面</p>  
        <p type="p">9:靠背面</p>  
        <p type="p">11:第一導軌</p>  
        <p type="p">11A:前後移動引導部</p>  
        <p type="p">11B:上下移動引導部</p>  
        <p type="p">12:齒條</p>  
        <p type="p">13:引導槽</p>  
        <p type="p">15:施療臂</p>  
        <p type="p">22:施療臂</p>  
        <p type="p">26:位置變更機構</p>  
        <p type="p">47:凸輪</p>  
        <p type="p">51:第一施療件</p>  
        <p type="p">52:第二施療件</p>  
        <p type="p">67:氣囊</p>  
        <p type="p">80:扶手</p>  
        <p type="p">81:氣囊</p>  
        <p type="p">S:施療面</p>  
        <p type="p">P1:空氣管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1145" publication-number="202612098"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612098.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612098</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121222</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加壓裝置以及加壓方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/687</main-classification>  
        <further-classification edition="200601120251201B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＤＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TDK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲村真彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, MASAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷口晋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGUCHI, SUSUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水戸瀬智久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITOSE, TOMOHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大畑修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHHATA, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米澤祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEZAWA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嶋﨑真佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMAZAKI, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種能夠防止工件相對於基板錯位的加壓裝置以及加壓方法。 &lt;br/&gt;[解決手段]加壓裝置1包括載台10以及氣囊20，載台10具有用以直接或間接地配置基板2的基板配置區域11，氣囊20藉由固定構件40而固定在載台10的上方，並且加壓基板2。氣囊20具有藉由固定構件40而固定的固定端部21a以及在固定端部21a的內側膨脹的膨脹部22。膨脹部22具有在基板配置區域11的內側朝向基板2膨脹的內側膨脹部23、以及在基板配置區域11的外側朝向載台10膨脹的外側膨脹部24。在垂直於載台10的剖面，在固定端部21a與基板配置區域11之間形成有膨脹區域50，並且從對應於基板2的上表面的位置往下方形成，用以使外側膨脹部24從對應於基板2的上表面的位置往下方膨脹。在垂直於載台10的方向，膨脹區域50的高度為2.5mm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:基板</p>  
        <p type="p">10:載台</p>  
        <p type="p">11:基板配置區域</p>  
        <p type="p">20:氣囊</p>  
        <p type="p">21a:固定端部</p>  
        <p type="p">22:膨脹部</p>  
        <p type="p">23:內側膨脹部</p>  
        <p type="p">24:外側膨脹部</p>  
        <p type="p">30:頭部</p>  
        <p type="p">31:主體</p>  
        <p type="p">34:凸部</p>  
        <p type="p">40:固定構件</p>  
        <p type="p">50:膨脹區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1146" publication-number="202611212"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611212.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611212</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121238</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">C08L1/06</main-classification>  
        <further-classification edition="200601120251215B">C08L29/02</further-classification>  
        <further-classification edition="200601120251215B">B32B9/02</further-classification>  
        <further-classification edition="200601120251215B">B32B27/10</further-classification>  
        <further-classification edition="200601320251215B">C04B103/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帆玉葵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HODAMA, AOI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤友彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, TOMOHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種薄膜，其係包含多醣類A、及多醣類B之薄膜，其中前述多醣類A具有離子性官能基，前述多醣類B係主鏈僅由β-1,4-鍵結所構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1147" publication-number="202612239"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612239.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612239</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121283</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輕負載條件下之電壓調節器負載電流判定</chinese-title>  
        <english-title>VOLTAGE REGULATOR LOAD CURRENT DETERMINATION UNDER A LIGHT-LOAD CONDITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02M3/158</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科沃美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QORVO US, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野川　正司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGAWA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種輕負載條件下之電壓調節器負載電流判定。電壓調節器被組態成生成輸出電流以將輸出電容器充電至輸出電壓。具體言之，電壓調節器根據具有多個重複工作週期間隔之工作週期信號生成該輸出電流。在輕負載條件下，在每個工作週期間隔中，輸出電容器在工作週期間隔之一部分內由輸出電流充電，且在工作週期間隔之其餘部分內被放電以使輸出電壓維持為高於臨限電壓。在本文中，電壓調節器被組態成基於一組已知參數來估計負載電流。因而，電壓調節器可貫穿工作週期間隔中之各者一致地報告該負載電流，而不依賴於該輸出電流存在與否。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Voltage regulator load current determination under a light-load condition is disclosed. The voltage regulator is configured to generate an output current to charge an output capacitor to an output voltage. Specifically, the voltage regulator generates the output current in accordance with a duty cycle signal having multiple repeating duty cycle intervals. Under the light-load condition, during each of the duty cycle intervals, the output capacitor is charged by the output current for a portion of the duty cycle interval and discharged to maintain the output voltage above a threshold voltage for the remainder of the duty cycle interval. Herein, the voltage regulator is configured to estimate the load current based on a set of known parameters. As such, the voltage regulator can consistently report the load current throughout each of the duty cycle intervals independent of a presence and an absence of the output current.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1148" publication-number="202611070"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611070.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611070</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121295</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於抗N3pGlu類澱粉β抗體之調配物</chinese-title>  
        <english-title>FORMULATIONS FOR ANTI-N3PGLU AMYLOID BETA ANTIBODIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C07K16/18</main-classification>  
        <further-classification edition="200601120251210B">A61K39/395</further-classification>  
        <further-classification edition="200601120251210B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫德　萊恩　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOULD, RYAN E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃納　安德魯　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WERNER, ANDREW G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案係關於穩定的醫藥調配物，其包含特異性結合或靶向N3pGlu類澱粉β (Aβ)之抗N3pGlu Aβ抗體。在某些實施例中，該等調配物除該抗體外，亦含有緩衝液、張力調節劑、抗氧化劑及界面活性劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is related to stable pharmaceutical formulations comprising an anti-N3pGlu amyloid beta (Aβ) antibody that specifically binds to or targets N3pGlu Aβ. In certain embodiments, the formulations contain, in addition to the antibody, a buffer, a tonicity modifier, an antioxidant, and a surfactant.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1149" publication-number="202611283"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611283.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611283</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121297</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有錫之水溶性助焊劑之洗淨方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C11D7/32</main-classification>  
        <further-classification edition="200601120251201B">C11D7/36</further-classification>  
        <further-classification edition="200601120251201B">C11D7/50</further-classification>  
        <further-classification edition="200601120251201B">B08B3/08</further-classification>  
        <further-classification edition="200601120251201B">H05K3/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛池孝直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEIKE, TAKANAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>照屋友太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERUYA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長沼純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGANUMA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於一態樣中，本發明提供一種含有錫之水溶性助焊劑之洗淨方法，其使用如下組合物：於使用包含錫之焊料進行安裝之電子零件之洗淨中，可抑制對於未溶出之錫(零價之錫)之溶解性，並且於洗淨時及沖洗時可維持對於溶出狀態之錫(例如，二價或四價之錫)之溶解性。 &lt;br/&gt;於一態樣中，本發明係關於一種含有錫之水溶性助焊劑之洗淨方法，其包括利用含有有機溶劑(成分A)、選自四級銨氫氧化物及胺化合物之至少一種鹼性化合物(成分B)、及水(成分C)之組合物，處理具有含有錫之水溶性助焊劑殘渣之基板之洗淨步驟，下述導電率II相對於下述導電率I之比率[II/I]為0.03以上1.0以下之範圍。 &lt;br/&gt;導電率I：上述洗淨步驟中用於上述基板之處理之組合物之導電率 &lt;br/&gt;導電率II：將上述洗淨步驟中用於上述基板之處理之組合物稀釋100倍時之導電率</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1150" publication-number="202611686"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611686.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611686</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121361</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控晶片、觸控系統以及觸控筆的擦除方法</chinese-title>  
        <english-title>TOUCH CHIP, TOUCH SYSTEM, AND ERASE METHOD OF STYLUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">G06F3/041</main-classification>  
        <further-classification edition="200601120251203B">G02F1/133</further-classification>  
        <further-classification edition="201301120251203B">G06F3/0354</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯侑穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, YU-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張維仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEIJEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴志章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種觸控晶片用以接收來自一觸控筆的一第一訊號以及一第二訊號且包含一接收電路以及一處理電路。接收電路用以接收第一訊號以及第二訊號。處理電路耦接接收電路且用以執行以下操作：判斷接收到的第一訊號的一訊號強度是否大於一第一門檻值；當訊號強度大於第一門檻值時，判斷是否接收到一第二訊號；當判斷有接收到第二訊號時，判斷第二訊號與第一訊號之間的一訊號強度比例是否大於一第二門檻值以產生一判斷結果；以及依據判斷結果，執行一擦除功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A touch chip is configured to receive a first signal and a second signal from a stylus and includes a receiver circuit and a processor circuit. The receiver circuit is configured to receive the first signal and the second signal. The processor circuit is coupled to the receiver circuit and is configured to perform operations below: determining whether a signal intensity of the received first signal is greater than a first threshold value; determining whether a second signal is received when the signal intensity of the received first signal is greater than the first threshold value; determining whether a signal intensity ratio of the second signal to the first signal is greater than a second threshold value to generate a determination result when it is determined that the second signal is received; and performing an erase function according to the determination result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:觸控筆</p>  
        <p type="p">112:尖端電極</p>  
        <p type="p">114:環狀電極</p>  
        <p type="p">116:末端電極</p>  
        <p type="p">120:觸控面板</p>  
        <p type="p">122:觸控晶片</p>  
        <p type="p">S1:觸控系統</p>  
        <p type="p">TX1a,TX2a:訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1151" publication-number="202610772"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610772.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610772</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121391</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保持環及基板保持裝置</chinese-title>  
        <english-title>RETAINER RING AND SUBSTRATE HOLDER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251201B">B24B37/32</main-classification>  
        <further-classification edition="200601120251201B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山木暁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKI, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村佳貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富樫真吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOGASHI, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍋谷治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NABEYA, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳凱智</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">［課題］提供一種保持環及基板保持裝置，該保持環設置於用於使包含基板的邊緣部的基板整體的研磨輪廓與期望的輪廓一致的基板保持裝置。&lt;br/&gt; ［解決手段］保持環32被使用於基板保持裝置7，該基板保持裝置用於將基板W按壓於經供給研磨液的研磨墊2而研磨該基板W。保持環32具備具有環形狀並支承被按壓於研磨墊2的基板W的外周的環主體50。環主體50具有形成在研磨墊2所按壓的下表面50a且與環主體50呈同心狀地延伸的至少一個環槽51；及阻礙研磨液從環主體50的外部到達內部的屏障55。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32:保持環</p>  
        <p type="p">50:環主體</p>  
        <p type="p">50a:下表面</p>  
        <p type="p">51:環槽</p>  
        <p type="p">55:屏障</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1152" publication-number="202611247"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611247.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611247</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121401</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接著劑組成物、光學構件接著用接著劑及導電性接著劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09J11/06</main-classification>  
        <further-classification edition="200601120251201B">C09J163/00</further-classification>  
        <further-classification edition="200601120251201B">C09J171/00</further-classification>  
        <further-classification edition="200601120251201B">C09J9/02</further-classification>  
        <further-classification edition="202301120251201B">H04N23/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小山太一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOYAMA, TAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田悠生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷本周穗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIMOTO, SHUHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的接著劑組成物，係含有：環氧化合物、含氧雜環丁烷環之化合物、及酸產生劑。環氧化合物係具有2個以上的脂環式環氧基結構。在環氧化合物中，當使原子個數成為最小方式，將其中一個脂環式環氧基結構中的氧、與另一個脂環式環氧基結構的氧相連結時，連結路徑中的原子個數係25以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1153" publication-number="202611333"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611333.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611333</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121416</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無電解鍍敷液</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251022B">C23C18/54</main-classification>  
        <further-classification edition="200601120251022B">C22C13/00</further-classification>  
        <further-classification edition="200601120251022B">C23C18/36</further-classification>  
        <further-classification edition="200601120251022B">C23C22/13</further-classification>  
        <further-classification edition="202301120251022B">C22C1/053</further-classification>  
        <further-classification edition="200601120251022B">C22C49/12</further-classification>  
        <further-classification edition="200601120251022B">C21D9/60</further-classification>  
        <further-classification edition="200601120251022B">B29C41/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納普拉有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAPRA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關根重信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKINE, SHIGENOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]&lt;br/&gt; 如鍍銀、鍍錫皮膜般的貴金屬、單一金屬之鍍敷被膜由於導電率高，因此被廣泛使用於電子機器的連接器、開關、繼電器等的接點或端子零件。但是，使用此種貴金屬、單一金屬的端子在耐久性上有課題。&lt;br/&gt; [解決手段]&lt;br/&gt; 上述課題係藉由一種無電解鍍敷液解決，該無電解鍍敷液係含有金屬離子源，該金屬離子源係在包含Sn與Sn-Cu合金之母相中，分散有包含Sn、Cu、Cr及Al的金屬間化合物結晶。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1154" publication-number="202611273"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611273.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611273</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121417</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>擋火隔熱材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C09K21/02</main-classification>  
        <further-classification edition="200601120251211B">C09K21/12</further-classification>  
        <further-classification edition="200601120251211B">D01F1/07</further-classification>  
        <further-classification edition="201201120251211B">D04H3/013</further-classification>  
        <further-classification edition="201201120251211B">D04H3/015</further-classification>  
        <further-classification edition="200601120251211B">B32B5/02</further-classification>  
        <further-classification edition="200601120251211B">B32B15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上村瑛梨香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEMURA, ERIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為了提供擋火性、隔熱性優良、可用於床墊等的阻燃化且鹵素含量少、不易影響外表的外觀的擋火隔熱材，本發明的擋火隔熱材係一種含有包含無機粒子且依據JIS K7201-2(2007年)的極限氧指數為25以下的非熔融性有機纖維A以及前述極限氧指數為25以上的熱塑性纖維B的擋火隔熱材，其中，&lt;br/&gt; 前述擋火隔熱材係由擋火層與隔熱層至少各一層進行積層一體化而成，&lt;br/&gt; 該擋火層包含前述非熔融性有機纖維A及前述熱塑性纖維B且L&lt;sup&gt;*&lt;/sup&gt;值為60以上，&lt;br/&gt; 該隔熱層包含90質量%以上的前述非熔融性有機纖維A；&lt;br/&gt; 前述擋火隔熱材藉由依據JEITA ET-7304A之方法測得之鹵素含量小於1.00質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1155" publication-number="202612135"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612135.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612135</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121418</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體處理用的流體斷接件</chinese-title>  
        <english-title>FLUIDIC DISCONNECT FOR SEMICONDUCTOR PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">H01L23/467</main-classification>  
        <further-classification edition="200601120251211B">H01L21/67</further-classification>  
        <further-classification edition="200601120251211B">C23C14/56</further-classification>  
        <further-classification edition="200601120251211B">C23C16/455</further-classification>  
        <further-classification edition="200601120251211B">C23C16/52</further-classification>  
        <further-classification edition="202101120251211B">F25B41/20</further-classification>  
        <further-classification edition="202101120251211B">F25B41/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜魯肯　伊克爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DURUKAN, ILKER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　清軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, THANH XUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派　烏迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, UDAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼格倫　漢斯　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NYGREN, HANS PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供流體斷接件及設備。若干流體斷接件具有：一上歧管，建構以定位在一半導體處理機台的上部部分之中；及一下歧管，建構以定位在該上部部分下方的該機台的下部部分之中。該上歧管的一第一埠及該下歧管的一第三埠係建構以在不使用O形環的情況下彼此流體和物理地連接以及流體和物理地斷開，且當連接時，將第一內部氣流路徑與第三內部氣流路徑加以流體連接，且該上歧管的一第二埠及該下歧管的一第四埠係建構以在不使用O形環的情況下彼此流體和物理地連接以及流體和物理地斷開，且當連接時，將第二內部氣流路徑與第四內部氣流路徑加以流體連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Fluidic disconnects and apparatuses are provided. Some fluidic disconnects have an upper manifold configured to be positioned in an upper portion of a semiconductor processing tool and a lower manifold configured to be positioned in a lower portion of the tool below the upper portion. A first port of the upper manifold and a third port of the lower manifold are configured to fluidically and physically connect with, and fluidically and physically disconnect from, each other without using O-rings and when connected, fluidically connect a first internal gas flow path with a third internal gas flow path, and a second port of the upper manifold and a fourth port of the lower manifold are configured to fluidically and physically connect with, and fluidically and physically disconnect from, each other without using O-rings and when connected, fluidically connect a second internal gas flow path with a fourth internal gas flow path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:第一部分</p>  
        <p type="p">106:第二部分</p>  
        <p type="p">111:流體輸送網路(或流體輸送系統)</p>  
        <p type="p">112:分割平面</p>  
        <p type="p">116:氣體分配器</p>  
        <p type="p">120:流體斷接件</p>  
        <p type="p">122:第一歧管</p>  
        <p type="p">123:第一歧管主體</p>  
        <p type="p">124:第二歧管</p>  
        <p type="p">125:第二歧管主體</p>  
        <p type="p">126,128:輸送部分</p>  
        <p type="p">130:第一氣體歧管(歧管B)</p>  
        <p type="p">132:第一輸送流動路徑</p>  
        <p type="p">133:控制器</p>  
        <p type="p">134:第二氣體歧管(歧管A)</p>  
        <p type="p">136:流動路徑</p>  
        <p type="p">138:埠</p>  
        <p type="p">140:第一內部氣流路徑</p>  
        <p type="p">142:第一控制閥門</p>  
        <p type="p">144:第一輸送導管</p>  
        <p type="p">146:第一連接手段</p>  
        <p type="p">148:第二連接手段</p>  
        <p type="p">150:第二輸送導管</p>  
        <p type="p">152:內部氣流路徑</p>  
        <p type="p">154:埠</p>  
        <p type="p">156:控制閥門</p>  
        <p type="p">158:第二輸送流動路徑</p>  
        <p type="p">160:前級管線</p>  
        <p type="p">162:泵</p>  
        <p type="p">164:排放口</p>  
        <p type="p">166:流動路徑</p>  
        <p type="p">168:埠</p>  
        <p type="p">170:內部氣流路徑</p>  
        <p type="p">174:第三輸送導管</p>  
        <p type="p">176:第一連接手段</p>  
        <p type="p">178:第二連接手段</p>  
        <p type="p">180:第四輸送導管</p>  
        <p type="p">182:內部氣流路徑</p>  
        <p type="p">184:埠</p>  
        <p type="p">186:控制閥門</p>  
        <p type="p">188:真空流動路徑</p>  
        <p type="p">192:內部旁路通道</p>  
        <p type="p">194:控制閥門</p>  
        <p type="p">196:部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1156" publication-number="202611576"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611576.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611576</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121441</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用間隔物及修整製造閃耀光柵之方法</chinese-title>  
        <english-title>METHOD TO FABRICATE A BLAZED GRATING USING SPACER AND TRIM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">G02B6/122</main-classification>  
        <further-classification edition="200601120251204B">G02B5/18</further-classification>  
        <further-classification edition="200601120251204B">B81C1/00</further-classification>  
        <further-classification edition="200601120251204B">C23C16/04</further-classification>  
        <further-classification edition="200601120251204B">H01L21/302</further-classification>  
        <further-classification edition="200601120251204B">H01L21/311</further-classification>  
        <further-classification edition="200601120251204B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　文輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WENHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王澤芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZEFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江　雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邢　嬋娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XING, CHAN JUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐永安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YONGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸　瑾宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JINYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的各個態樣包含形成波導的方法。該波導的形成方法包含在安置於基板上的心軸上沉積光阻。蝕刻光阻所暴露的心軸部分。在心軸和基板上沉積間隔物材料。在心軸上沉積遮罩層。移除光阻所暴露的間隔物材料的第一部分。移除遮罩層和間隔物材料的第二部分以形成間隔物。在心軸所暴露的基板第一部分上執行第一梯級蝕刻，以形成第一梯級。修整心軸以暴露基板的第二部分。移除心軸和間隔物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects of the present disclosure includes methods of forming a waveguide. The method of forming a waveguide includes depositing a photo resist over a mandrel disposed over a substrate. Portions of the mandrel exposed by the photo resist are etched. A spacer material is deposited over the mandrel and the substrate. A mask layer is deposited over the mandrel. A first exposed portion of the spacer material exposed by the photo resist is removed. The mask layer and a second exposed portion of the spacer material are removed to form a spacer. A first step etch is performed on a first portion of the substrate exposed by the mandrel to form a first step. The mandrel is trimmed to expose a second portion of the substrate. The mandrel and the spacer are removed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:基板</p>  
        <p type="p">104A:輸入耦合區域</p>  
        <p type="p">106:光柵</p>  
        <p type="p">108:表面</p>  
        <p type="p">110:梯級</p>  
        <p type="p">112:側壁</p>  
        <p type="p">d:線寬</p>  
        <p type="p">f:法線</p>  
        <p type="p">h:深度</p>  
        <p type="p">γ:閃耀角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1157" publication-number="202611424"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611424.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611424</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121443</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閥門機構及其運作方法</chinese-title>  
        <english-title>VALVE MECHANISM AND OPERATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">F16K51/02</main-classification>  
        <further-classification edition="200601120251210B">F16K1/26</further-classification>  
        <further-classification edition="200601120251210B">F16K3/02</further-classification>  
        <further-classification edition="200601120251210B">F16K3/16</further-classification>  
        <further-classification edition="200601120251210B">F16K25/00</further-classification>  
        <further-classification edition="200601120251210B">F16K31/02</further-classification>  
        <further-classification edition="200601120251210B">F16K31/12</further-classification>  
        <further-classification edition="200601120251210B">F16J15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日揚科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGHLIGHT TECH CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳郁祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許俊樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHUN-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡銘昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佑瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林賜民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SZU-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉文勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, WEN-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇崇善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOU, CHWUNG-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張建成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴天琮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種閥門機構及其運作方法，適用於以選擇性封合或開啟腔體上之第一開口埠。閥門機構包含位移元件、載板、密封碟盤以及導正元件。位移元件係經由載板帶動密封碟盤進行往復運動，且導正元件係在密封碟盤進行往復運動時，依據腔體上之第一開口埠之密封面之位向對應地導正密封碟盤之密封面之位向，使得密封碟盤之密封面平行於腔體上之第一開口埠之密封面，藉以對稱施力封合腔體上之第一開口埠。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A valve mechanism and an operating method of the same are disclosed. The valve mechanism is suitable for selectively sealing or opening a first port on a chamber. The valve mechanism includes a displacement element, a carrier plate, a sealing disc, and an adjusting element. The displacement element drives the sealing disc to perform reciprocating motion via the carrier plate, and the adjusting element corrects the orientation of the sealing surface of the sealing disc during the reciprocating motion based on the orientation of the sealing surface of the first port on the chamber. As a result, the sealing surface of the sealing disc remains parallel to the sealing surface of the first port, thereby enabling symmetrical application of force to seal the first port of the chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:閥門機構</p>  
        <p type="p">12:底座</p>  
        <p type="p">14:開口部</p>  
        <p type="p">18:導引插槽</p>  
        <p type="p">20:位移元件</p>  
        <p type="p">21:支撐元件</p>  
        <p type="p">22:支撐片</p>  
        <p type="p">24:卡榫板</p>  
        <p type="p">28:插銷</p>  
        <p type="p">40a、40b:載板</p>  
        <p type="p">42a、42b:第一彈性片</p>  
        <p type="p">43:固定塊</p>  
        <p type="p">44a:第二彈性片</p>  
        <p type="p">60:密封碟盤</p>  
        <p type="p">62:密封面</p>  
        <p type="p">80:導正元件</p>  
        <p type="p">Z:第一軸向</p>  
        <p type="p">X:第二軸向</p>  
        <p type="p">Y:第三軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1158" publication-number="202612129"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612129.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612129</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121449</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及製造電子裝置的方法</chinese-title>  
        <english-title>ELECTRONIC DEVICES AND METHODS FOR MANUFACTURING ELECTRONIC DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L23/31</main-classification>  
        <further-classification edition="200601120251201B">H01L23/367</further-classification>  
        <further-classification edition="200601120251201B">H01L23/49</further-classification>  
        <further-classification edition="200601120251201B">H01L21/60</further-classification>  
        <further-classification edition="200601120251201B">H01L21/56</further-classification>  
        <further-classification edition="200601120251201B">H01L21/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西川健次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKAWA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個實例中，一種電子裝置包括晶粒焊盤和引線。電子組件耦接到所述晶粒焊盤並耦接到所述引線。散熱片耦接到所述電子組件。囊封物覆蓋所述晶粒焊盤、所述引線、所述電子組件和所述散熱片。所述囊封物包含囊封物頂側、與所述囊封物頂側相對的囊封物底側、將所述囊封物頂側連接到所述囊封物底側的囊封物側面以及頂部延伸區域。所述散熱片的頂側從所述囊封物頂側曝露出來。所述晶粒焊盤的底側從所述囊封物底側曝露出來。所述引線的部分從所述囊封物側面曝露出來。所述囊封物的所述頂部延伸區域覆蓋所述散熱片的頂側外圍邊緣。本文還公開了其它實例和相關方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one example, an electronic device includes a die paddle and leads. An electronic component is coupled to the die paddle and to the leads. A heat sink is coupled to the electronic component. An encapsulant covers the die paddle, the leads, the electronic component, and the heat sink. The encapsulant comprises an encapsulant top side, an encapsulant bottom side opposite to the encapsulant top side, an encapsulant lateral side connecting the encapsulant top side to the encapsulant bottom side, and a top extension region. A top side of the heat sink is exposed from the encapsulant top side. A bottom side of the die paddle is exposed from the encapsulant bottom side. Parts of the leads are exposed from the encapsulant lateral side. The top extension region of the encapsulant covers a top side peripheral edge of the heat sink. Other examples and related methods are also disclosed herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:基板</p>  
        <p type="p">112:晶粒焊盤</p>  
        <p type="p">114:引線</p>  
        <p type="p">120:電子組件</p>  
        <p type="p">121:接合焊墊</p>  
        <p type="p">130:組件互連件</p>  
        <p type="p">140:散熱片</p>  
        <p type="p">150:囊封物</p>  
        <p type="p">151:頂部開口</p>  
        <p type="p">152:底部開口</p>  
        <p type="p">153:頂部延伸區域</p>  
        <p type="p">154:底部延伸區域</p>  
        <p type="p">155:底部突出部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1159" publication-number="202611204"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611204.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611204</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08K3/08</main-classification>  
        <further-classification edition="200601120251201B">C08L101/00</further-classification>  
        <further-classification edition="200601120251201B">C08L63/00</further-classification>  
        <further-classification edition="200601120251201B">C08L71/12</further-classification>  
        <further-classification edition="200601120251201B">H01F1/147</further-classification>  
        <further-classification edition="200601120251201B">H01F1/26</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification>  
        <further-classification edition="200601120251201B">H05K1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商味之素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJINOMOTO CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斎藤瑞季</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, MIZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大山秀樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOYAMA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題是提供在低頻帶中可以實現高的相對磁導率，且塗布時的外觀優異的樹脂組成物。本發明的解決手段是一種樹脂組成物，其係包含熱硬化性樹脂及鐵合金系磁性粉體的樹脂組成物，其中，將樹脂組成物的不揮發成分設為100體積%時，(a)具有大於20μm且為50μm以下的粒徑的鐵合金系磁性粉體的含量為26體積%以上且45體積%以下，(b)具有大於2μm且為20μm以下的粒徑的鐵合金系磁性粉體的含量為28體積%以上且68體積%以下，(c)具有2μm以下的粒徑的鐵合金系磁性粉體的含量為1體積%以上且41體積%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:芯基板</p>  
        <p type="p">11:支撐基板</p>  
        <p type="p">12:第一金屬層</p>  
        <p type="p">13:第二金屬層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1160" publication-number="202611230"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611230.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611230</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121494</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、預浸體、堆疊體、覆金屬堆疊板及佈線板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">C08L71/12</main-classification>  
        <further-classification edition="200601120251212B">C08G65/32</further-classification>  
        <further-classification edition="200601120251212B">C08K5/3492</further-classification>  
        <further-classification edition="200601120251212B">C08F287/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本瑞翁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石黑淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIGURO, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供介電特性、耐熱性及對於金屬層之接合性優異的樹脂組成物。本發明之樹脂組成物含有：固化性化合物、熱塑性樹脂與固化助劑，其中固化助劑係具有烷氧基矽基結構的化合物。於此，固化性化合物以包含選自由於末端具有具碳―碳不飽和鍵之取代基的改質聚苯醚化合物、固化性烴、環氧化合物及醯亞胺化合物而成之群組之至少1種為佳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1161" publication-number="202612407"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612407.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612407</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121501</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層配線基板、半導體裝置及多層配線基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H05K1/11</main-classification>  
        <further-classification edition="200601120251201B">H01L23/535</further-classification>  
        <further-classification edition="200601120251201B">H01L23/498</further-classification>  
        <further-classification edition="200601120251201B">H01L23/14</further-classification>  
        <further-classification edition="200601120251201B">H05K3/46</further-classification>  
        <further-classification edition="200601120251201B">H05K3/42</further-classification>  
        <further-classification edition="200601120251201B">H01L21/768</further-classification>  
        <further-classification edition="200601120251201B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱田哲郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, TETSURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土田徹勇起</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIDA, TETSUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種即使在使用不同種類的配線基板之情形時亦可抑制安裝不良的發生且基板之間的連接可靠性高之技術。 &lt;br/&gt;本發明之多層配線基板之一為搭載有半導體晶片之多層配線基板，且特徵係包含：具有配置有電極部之表面層之第一配線基板、配置於前述第一配線基板之表面層上且具有開口部之接著層、配置於前述接著層上且具有貫通孔之玻璃芯、以及連接至前述電極部且將前述接著層之前述開口部與前述玻璃芯之前述貫通孔內連通之導體部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:半導體裝置</p>  
        <p type="p">10:半導體晶片</p>  
        <p type="p">30:FC-BGA基板</p>  
        <p type="p">40:母板</p>  
        <p type="p">50:焊料層</p>  
        <p type="p">70:玻璃配線基板</p>  
        <p type="p">100A:附玻璃芯FC-BGA基板100</p>  
        <p type="p">AL:接著層</p>  
        <p type="p">P1:柱</p>  
        <p type="p">A:框</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1162" publication-number="202610920"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610920.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610920</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121510</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測試電子元件的處理機</chinese-title>  
        <english-title>HANDLER FOR TESTING ELECTRONIC COMPONENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B65G49/07</main-classification>  
        <further-classification edition="200601120251201B">G01R1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商泰克元股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅閏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, YUN SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於測試電子元件的處理機。&lt;br/&gt; 本發明的用於測試電子元件的處理機具有讓複數個堆疊機各自升降的升降機。&lt;br/&gt; 依據本發明，裝載著電子元件的客戶托盤在自動化搬運機器人的搬入或搬出容易而提高了處理容量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">220:供應堆疊機</p>  
        <p type="p">240:供應支撐工具</p>  
        <p type="p">241:供應支撐板</p>  
        <p type="p">271:第一升降機</p>  
        <p type="p">272:第一前進後退機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1163" publication-number="202610954"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610954.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610954</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121543</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電波穿透體及窗材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">C03C17/36</main-classification>  
        <further-classification edition="200601120251205B">H01Q15/00</further-classification>  
        <further-classification edition="201901120251205B">B32B7/05</further-classification>  
        <further-classification edition="200601120251205B">E06B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤木良教</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAGI, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野本博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOMOTO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩野谷健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIONOYA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福山進二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUYAMA, SHINJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕨野智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARABINO, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提高窗材之電波穿透性。本發明係一種電波穿透體4，其係配置於窗材1之表面之透光性電波穿透體，上述窗材1具備透明板2及積層於透明板之金屬層3，上述電波穿透體4具備導電層41及支持導電層之基材層43，導電層41以具有導電區域41C、包圍區域41C之非導電區域42、及包圍區域42之導電區域41A、41B之圖案週期性地縱橫配置有複數個，區域42之寬度W為將區域41C之對向之兩邊連結之線段PB、與將區域41A之對向之兩邊連結之線段PA之差之一半，寬度W與區域42間之間隔之一半即GAP/2之組合為W為0.5 mm以上7.5 mm以下且GAP/2為1.1 mm以上7.5 mm以下之組合、或W為0.5 mm以上7.5 mm以下且GAP/2為13.2 mm以上16.8 mm以下之組合，頻率為3.5 GHz～4.7 GHz之入射電波穿透上述電波穿透體4後的電波強度大於0 dB。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:電波穿透體(超穎表面膜)</p>  
        <p type="p">41:導電層</p>  
        <p type="p">41A:導電區域(第2導電區域)</p>  
        <p type="p">41B:導電區域(第2導電區域)</p>  
        <p type="p">41C:導電區域(第1導電區域)</p>  
        <p type="p">42:非導電區域</p>  
        <p type="p">43:基材層</p>  
        <p type="p">45:保護膜</p>  
        <p type="p">A:部分</p>  
        <p type="p">GAP:間隔</p>  
        <p type="p">PA:線段(第2線段)</p>  
        <p type="p">PB:線段(第1線段)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1164" publication-number="202612174"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612174.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612174</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121544</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電波穿透體及窗材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01Q15/00</main-classification>  
        <further-classification edition="200601120251205B">C03C17/36</further-classification>  
        <further-classification edition="201901120251205B">B32B7/05</further-classification>  
        <further-classification edition="200601120251205B">E06B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤木良教</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAGI, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野本博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOMOTO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩野谷健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIONOYA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕨野智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARABINO, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福山進二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUYAMA, SHINJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提高窗材之電波穿透性。本發明係一種電波穿透體4，其係配置於窗材1之表面之透光性電波穿透體，上述窗材1具備透明板2及積層於透明板之金屬層3，上述電波穿透體4具備導電層41及支持導電層之基材層43，於導電層41中，由導電層41所包圍之無導電層之區域42係空出間隔GAP而週期性地縱橫配置有複數個，區域42由穿過區域42之重心CG並將區域42之兩端連結之線段PA之長度所規定，線段PA之長度係自相鄰之區域42、42之重心CG間之距離減去區域42、42間之間隔GAP所得之長度，線段PA與間隔GAP之組合為線段PA為5.3 mm以上21.1 mm以下且間隔GAP為0.3 mm以上15 mm以下之組合、或線段PA為31.6 mm且間隔GAP為3 mm以上7 mm以下之組合，頻率為3.5 GHz至4.7 GHz之入射電波穿透上述電波穿透體4後的電波強度大於0 dB。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:電波穿透體(超穎表面膜)</p>  
        <p type="p">41:導電層</p>  
        <p type="p">41A:導電層</p>  
        <p type="p">41B:導電層</p>  
        <p type="p">42:非導電區域</p>  
        <p type="p">43:基材層</p>  
        <p type="p">45:保護膜</p>  
        <p type="p">A:部分</p>  
        <p type="p">L6:線寬</p>  
        <p type="p">L7:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1165" publication-number="202612229"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612229.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612229</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121557</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>驅動電路及其驅動方法</chinese-title>  
        <english-title>DRIVING CIRCUIT AND DRIVING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">H02M1/08</main-classification>  
        <further-classification edition="200601120250701B">H03K17/04</further-classification>  
        <further-classification edition="200601120250701B">H02M3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊大勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TA-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱冠任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, KWAN-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉國基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KUO-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種驅動電路包括上橋電晶體、第一下橋電晶體、第二下橋電晶體以及控制電路。上橋電晶體耦接於輸入電壓以及切換節點之間。第一下橋電晶體耦接於切換節點以及接地端之間。第二下橋電晶體耦接於切換節點以及接地端之間。控制電路週期性地且個別地導通上橋電晶體以及第一下橋電晶體。在第一下橋電晶體關斷後，控制電路持續導通第二下橋電晶體直到上橋電晶體導通，以排除第一下橋電晶體之反向恢復電荷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A driving circuit includes a high-side transistor, a first low-side transistor, a second low-side transistor, and a control circuit. The high-side transistor is coupled between an input voltage and a switch node. The first low-side transistor is coupled between the switch node and a ground. The second low-side transistor is coupled between the switch node and the ground. The control circuit periodically and individually turns on the high-side transistor and the first low-side transistor. After the first low-side transistor is turned off, the control circuit continuously turns on the second low-side transistor until the high-side transistor is turned on, so as to expel reverse recovery charge of the first low-side transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:驅動電路</p>  
        <p type="p">210:控制電路</p>  
        <p type="p">211:非重疊電路</p>  
        <p type="p">212:放電控制電路</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">SW:切換節點</p>  
        <p type="p">DP:寄生二極體</p>  
        <p type="p">HS:上橋驅動信號</p>  
        <p type="p">LS:下橋驅動信號</p>  
        <p type="p">QH:上橋電晶體</p>  
        <p type="p">QL1:第一下橋電晶體</p>  
        <p type="p">QL2:第二下橋電晶體</p>  
        <p type="p">INV1:第一反相器</p>  
        <p type="p">INV2:第二反相器</p>  
        <p type="p">AND1:第一及閘</p>  
        <p type="p">AND2:第二及閘</p>  
        <p type="p">S1:第一信號</p>  
        <p type="p">S2:第二信號</p>  
        <p type="p">S1B:第一反相信號</p>  
        <p type="p">S2B:第二反相信號</p>  
        <p type="p">RDL:延遲電阻</p>  
        <p type="p">CDL:延遲電容</p>  
        <p type="p">QCL:箝位電晶體</p>  
        <p type="p">QCNL:控制電晶體</p>  
        <p type="p">RDG:放電電阻</p>  
        <p type="p">S2D:第二延遲信號</p>  
        <p type="p">VCL:箝位電壓</p>  
        <p type="p">NCNL:控制節點</p>  
        <p type="p">SCNL:控制信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1166" publication-number="202612142"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612142.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612142</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121564</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>引線框架、半導體裝置及引線框架的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L23/495</main-classification>  
        <further-classification edition="200601120251201B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新光電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINKO ELECTRIC INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出岡淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZUOKA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林真太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧澤武志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIZAWA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為抑制膠帶之剝離。本發明之引線框架係具有：晶粒座、引腳、匯流排、及膠帶。晶粒座具有半導體晶片的搭載面。引腳配置在晶粒座的周圍。匯流排設於晶粒座與引腳之間，其由懸吊引腳所支撐。膠帶被黏貼於引腳及懸吊引腳。懸吊引腳係在從膠帶的黏貼位置往匯流排側隔開之位置彎折而相對於引腳傾斜，且其使匯流排之導線連接面配置於較引腳的導線連接面更低的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:引腳</p>  
        <p type="p">121:內引腳</p>  
        <p type="p">121a:導線連接面</p>  
        <p type="p">150:晶粒座</p>  
        <p type="p">150a:上表面</p>  
        <p type="p">160:匯流排</p>  
        <p type="p">160a:導線連接面</p>  
        <p type="p">170:懸吊引腳</p>  
        <p type="p">180:膠帶</p>  
        <p type="p">P1:位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1167" publication-number="202612001"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612001.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612001</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121565</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250915B">H01L21/302</main-classification>  
        <further-classification edition="200601120250915B">F26B5/04</further-classification>  
        <further-classification edition="200601120250915B">F26B5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾辻正幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUJI, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木悠太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塙洋祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANAWA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田幸史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, YUKIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國枝省吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNIEDA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>真田雅和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANADA, MASAKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本泰治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, YASUHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基板處理方法，其能夠防止或降低於殘存於固化膜內部之處理液蒸發而形成空隙時所發生之圖案倒塌。本發明係對基板W之圖案形成面進行處理之基板處理方法，且包括：供給步驟S3，其係向上述圖案形成面供給包含昇華性物質及溶劑之處理液；固化膜形成步驟S4，其係使上述溶劑自供給至上述圖案形成面之上述處理液之液膜103中蒸發並使上述昇華性物質析出，而形成固化膜106；冷凍步驟S5(S5')，其係於上述固化膜形成步驟S4中之上述固化膜106之形成中、或上述固化膜106之形成後使殘存於內部之殘留處理液105冷凍；及昇華步驟S6(S6')，其係使上述固化膜106、及已冷凍之上述殘留處理液105昇華。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:洗淨步驟</p>  
        <p type="p">S2:IPA沖洗步驟</p>  
        <p type="p">S3:供給步驟</p>  
        <p type="p">S4:固化膜形成步驟</p>  
        <p type="p">S5,S5':冷凍步驟</p>  
        <p type="p">S6,S6':昇華步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1168" publication-number="202612515"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612515.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612515</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121574</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括多個裝置層之積體電路</chinese-title>  
        <english-title>INTEGRATED CIRCUIT INCLUDING MULTIPLE DEVICE LAYERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251204B">H10D62/10</main-classification>  
        <further-classification edition="202501120251204B">H10D80/20</further-classification>  
        <further-classification edition="202501120251204B">H10D88/00</further-classification>  
        <further-classification edition="202501120251204B">H10D89/10</further-classification>  
        <further-classification edition="200601120251204B">G11C11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞寶　沙耶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REBOH, SHAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下　典洪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, TENKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卜　惠明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BU, HUIMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬札　詹姆士　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAZZA, JAMES PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　瑞龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, RUILONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種積體電路，其包括至少三個垂直配置之裝置層，該等裝置層藉由一水平空間及至少一個垂直延伸之裝置行彼此分離。一半導體裝置安置於該至少三個裝置層中之各者中，且在該裝置行中垂直對準。至少一個垂直延伸之第一類型信號線行包括複數個第一類型信號線對，該複數個第一類型信號線對延伸穿過該水平空間以與安置於該至少三個裝置層中之至少一個半導體裝置建立一第一電連接。至少一個第二類型信號線行垂直延伸且包括至少一條第二類型信號線，該至少一條第二類型信號線與安置於該至少三個裝置層中之該至少一個半導體裝置建立一第二電連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit includes at least three vertically arranged device layers, which are separated from one another by a horizontal space and at least one vertically extending device column. A semiconductor device is disposed in each of the at least three device layers and is aligned vertically in the device column. At least one vertically extending first-type signal line column includes a plurality of first-type signal line pairs that extend through the horizontal space to establish a first electrical connection with the at least one semiconductor device disposed in the at least three device layers. At least one second-type signal line column extends vertically and includes at least one second-type signal line that establishes a second electrical connection with the at least one semiconductor device disposed in the at least three device layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:邏輯截塊</p>  
        <p type="p">110:正面</p>  
        <p type="p">112:背面</p>  
        <p type="p">114a:裝置層</p>  
        <p type="p">114b:裝置層</p>  
        <p type="p">114c:裝置層</p>  
        <p type="p">114d:裝置層</p>  
        <p type="p">115:水平空間</p>  
        <p type="p">116a:裝置行</p>  
        <p type="p">116b:裝置行</p>  
        <p type="p">116c:裝置行</p>  
        <p type="p">116d:裝置行</p>  
        <p type="p">117:行空間</p>  
        <p type="p">120a:電力信號行</p>  
        <p type="p">121a:資料信號行</p>  
        <p type="p">124a:第一電力信號線</p>  
        <p type="p">124b:第二電力信號線</p>  
        <p type="p">125:資料信號線</p>  
        <p type="p">126:垂直電力線部分</p>  
        <p type="p">127:垂直資料線部分</p>  
        <p type="p">128:水平電力線部分</p>  
        <p type="p">129:水平資料線部分</p>  
        <p type="p">200a:半導體裝置</p>  
        <p type="p">200b:半導體裝置</p>  
        <p type="p">200c:半導體裝置</p>  
        <p type="p">200d:半導體裝置</p>  
        <p type="p">202a:第一堆疊式互補金屬氧化物半導體(CMOS)裝置</p>  
        <p type="p">202b:第二堆疊式互補金屬氧化物半導體(CMOS)裝置</p>  
        <p type="p">X:第一水平軸線</p>  
        <p type="p">Y:第二軸線/水平軸線</p>  
        <p type="p">Z:垂直軸線/第三軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1169" publication-number="202610849"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610849.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610849</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121585</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中間轉印介質、附離型構件之中間轉印介質、中間轉印介質與熱轉印片之組合、中間轉印介質與熱轉印片與被轉印物之組合、印相物，及印相物之製造方法</chinese-title>  
        <english-title>INTERMEDIATE TRANSFER MEDIUM, INTERMEDIATE TRANSFER MEDIUM PROVIDED WITH RELEASE MEMBER, COMBINATION OF INTERMEDIATE TRANSFER MEDIUM AND THERMAL TRANSFER SHEET, COMBINATION OF INTERMEDIATE TRANSFER MEDIUM, THERMAL TRANSFER SHEET AND TRANSFER-RECEIVING BODY, PHOTOGRAPHIC PRINTING PRODUCT, AND METHOD FOR PRODUCING PHOTOGRAPHIC PRINTING PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">B41M5/40</main-classification>  
        <further-classification edition="200601120251204B">B41M5/025</further-classification>  
        <further-classification edition="200601120251204B">B41M5/26</further-classification>  
        <further-classification edition="200601120251204B">D06P5/24</further-classification>  
        <further-classification edition="200601120251204B">B44C1/165</further-classification>  
        <further-classification edition="200601120251204B">B32B5/18</further-classification>  
        <further-classification edition="200601120251204B">B32B27/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日本印刷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小高都明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODAKA, TSUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下形貴宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOGATA, TAKANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示中提供一種中間轉印介質，其依序具有基材、含有發泡劑之發泡性層，及轉印層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an intermediate transfer medium comprising a substrate, a foaming layer including a foaming agent, and a transfer layer in this order.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基材</p>  
        <p type="p">2:發泡性層</p>  
        <p type="p">3:轉印層</p>  
        <p type="p">10:中間轉印介質</p>  
        <p type="p">D&lt;sub&gt;T&lt;/sub&gt;:厚度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1170" publication-number="202612111"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612111.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612111</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121665</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體模組及半導體模組的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L23/14</main-classification>  
        <further-classification edition="200601120251204B">H01L21/607</further-classification>  
        <further-classification edition="200601120251204B">H01L23/488</further-classification>  
        <further-classification edition="200601120251204B">H01L23/52</further-classification>  
        <further-classification edition="202501120251204B">H10D64/20</further-classification>  
        <further-classification edition="202501120251204B">H10D80/20</further-classification>  
        <further-classification edition="202501120251204B">H10D88/00</further-classification>  
        <further-classification edition="202301120251204B">H10B80/00</further-classification>  
        <further-classification edition="200601120251204B">G11C5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>先端系統技術研究組合</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESEARCH ASSOCIATION FOR ADVANCED SYSTEMS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川野連也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWANO, MASAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑田忠廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA, TADAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體模組，其包含：第1基板，包含平行於第1方向及與前述第1方向交叉之第2方向的第1面；框體，沿著與前述第1方向及前述第2方向交叉之第3方向配置於前述第1面之上；以及第1立方體晶片，裝配於前述框體同時沿著前述第3方向配置於前述第1面之上並包含堆疊起來之多個IC晶片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體模組</p>  
        <p type="p">30:堆疊記憶體晶片</p>  
        <p type="p">40:絕緣膜</p>  
        <p type="p">41:第1傾斜部</p>  
        <p type="p">45:第3面</p>  
        <p type="p">46:第1面</p>  
        <p type="p">47:第4面</p>  
        <p type="p">48:第2面</p>  
        <p type="p">50:結構體</p>  
        <p type="p">50A:結構體</p>  
        <p type="p">51:第2傾斜部</p>  
        <p type="p">100:立方體晶片</p>  
        <p type="p">110:IC晶片</p>  
        <p type="p">145:第3面</p>  
        <p type="p">146:第1面</p>  
        <p type="p">147:第4面</p>  
        <p type="p">148:第2面</p>  
        <p type="p">162:側面電源佈線</p>  
        <p type="p">163:側面接地佈線</p>  
        <p type="p">164:電源佈線</p>  
        <p type="p">165:接地佈線</p>  
        <p type="p">172:電感器</p>  
        <p type="p">200:框體</p>  
        <p type="p">210:絕緣膜</p>  
        <p type="p">300:第1基板</p>  
        <p type="p">302:第2面</p>  
        <p type="p">304:第1面</p>  
        <p type="p">326:佈線層</p>  
        <p type="p">327:佈線</p>  
        <p type="p">328:佈線層</p>  
        <p type="p">329:佈線</p>  
        <p type="p">330:佈線層</p>  
        <p type="p">331:佈線</p>  
        <p type="p">332:佈線層</p>  
        <p type="p">333:佈線</p>  
        <p type="p">334:佈線層</p>  
        <p type="p">335:佈線</p>  
        <p type="p">372:電感器</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p>  
        <p type="p">D3:第3方向</p>  
        <p type="p">α:角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1171" publication-number="202610932"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610932.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610932</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121671</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物</chinese-title>  
        <english-title>COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C01B6/13</main-classification>  
        <further-classification edition="200601120251211B">C08L33/10</further-classification>  
        <further-classification edition="200601120251211B">C09J4/00</further-classification>  
        <further-classification edition="200601120251211B">C09J123/14</further-classification>  
        <further-classification edition="200601120251211B">C08F2/50</further-classification>  
        <further-classification edition="201101120251211B">C07B60/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商施敏打硬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CEMEDINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部寛生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前川信芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEKAWA, NOBUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種組成物，其係保存穩定性優異、接著速度快、操作性優異、在難接著性被接著材彼此接著時發揮優異之接著強度。 &lt;br/&gt;本發明之解決手段係提供一種組成物，其含有下列(a)至(c)：(a)(甲基)丙烯酸酯化合物、(b)烷基硼烷-胺錯合物、以及(c)光酸產生劑及/或熱酸產生劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a composition which is excellent in storage stability, has a high adhesive speed, is excellent in handleability, and exhibits excellent adhesive strength in bonding hardly-adhesive adherends to each other. As a solution, a composition containing (a) a (meth)acrylate compound, (b) an alkylborane-amine complex, and (c) a photoacid generator and/or a thermal acid generator is provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1172" publication-number="202610813"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610813.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610813</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121680</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有錐形入口的墊料設備</chinese-title>  
        <english-title>DUNNAGE APPARATUS WITH CONICAL INLET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">B31D5/00</main-classification>  
        <further-classification edition="201701120251201B">B31D5/02</further-classification>  
        <further-classification edition="201701120251201B">B31D5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商普里吉斯有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PREGIS LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>範奧肯　瑞安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN AUKEN, RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬伊斯　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOYCE, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>切斯　肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHESS, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於生產墊料的裝置，其包括起皺器，起皺器被配置為將高密度庫存材料轉換為低密度墊料，以及成形器，成形器置於起皺器的上游。外成形器具有內部表面，內部表面界定過道，過道被配置為接收內成形器。內部表面被配置為在庫存材料移動經過過道時，將庫存材料折疊為重疊的層。內成形器的外表面與外成形器的內部表面相對並隔開，使得外表面及外成形器的內部表面界定用於接收庫存材料的通道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Devices for producing dunnage include a crumpler configured to convert a high-density stock material into low-density dunnage, and a former positioned upstream of the crumpler. The outer former has interior surface defining a passage configured to receive the inner former. The interior surface configured to fold the stock material into overlapping layers as the stock material moves through the passage. An outer surface of the inner former opposes and is spaced from the interior surface of the outer former so that the outer surface and the interior surface of the outer former define a channel for receiving the stock material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">118:成形齒</p>  
        <p type="p">120:縫合齒</p>  
        <p type="p">500:裝置</p>  
        <p type="p">502:成形器</p>  
        <p type="p">503:起皺器</p>  
        <p type="p">504:內成形器</p>  
        <p type="p">505:傾斜部份</p>  
        <p type="p">506:外成形器</p>  
        <p type="p">507:內部表面</p>  
        <p type="p">508:入口</p>  
        <p type="p">509:箭頭</p>  
        <p type="p">512:上成形滾筒</p>  
        <p type="p">513:下成形滾筒</p>  
        <p type="p">514:殼體</p>  
        <p type="p">515:絞鏈</p>  
        <p type="p">516:蓋件</p>  
        <p type="p">517:手柄</p>  
        <p type="p">518:出口</p>  
        <p type="p">519:過道</p>  
        <p type="p">520:上出料滾筒</p>  
        <p type="p">522:下出料滾筒</p>  
        <p type="p">526:托架</p>  
        <p type="p">528:凸緣</p>  
        <p type="p">540:主體</p>  
        <p type="p">541:槽</p>  
        <p type="p">542:上構件</p>  
        <p type="p">543:通道</p>  
        <p type="p">544:成形表面</p>  
        <p type="p">548:外表面</p>  
        <p type="p">550:主體</p>  
        <p type="p">552:棒材</p>  
        <p type="p">554:下游壁</p>  
        <p type="p">555:通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1173" publication-number="202612105"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612105.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612105</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121753</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>互連基板及其製造方法</chinese-title>  
        <english-title>INTERCONNECT SUBSTRATE AND METHOD OF MAKING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/768</main-classification>  
        <further-classification edition="200601120251201B">H01L21/60</further-classification>  
        <further-classification edition="200601120251201B">H01L21/98</further-classification>  
        <further-classification edition="200601120251201B">H01L23/544</further-classification>  
        <further-classification edition="200601120251201B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商戴卡科技美國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECA TECHNOLOGIES USA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍夫曼　保羅Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOFFMAN, PAUL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧爾森　提摩西Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLSON, TIMOTHY L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢夏普　克雷格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BISHOP, CRAIG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴維斯　羅賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVIS, ROBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造互連基板的方法，包含以下步驟：在基板核心中設置嵌入部件與至少一個追蹤識別符，以及將基板核心平坦化，以形成平坦表面，在前側平坦表面上方形成導電層，在前側平坦表面、嵌入部件、及導電層上方設置介電層，旋轉基板核心，而使得基板核心的背表面經配置以用於處理，以及在基板核心的背表面上方形成導電層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of making an interconnect substrate, comprising disposing an embedded component and at least one tracking identifier in a substrate core, and planarizing the substrate core to form a planar surface, forming a conductive layer over a frontside planar surface, disposing a layer of dielectric over the frontside planar surface, the embedded component, and the conductive layer, rotating the substrate core such that a back surface of the substrate core is configured for processing, and forming a conductive layer over the back surface of the substrate core.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:部件</p>  
        <p type="p">58:追蹤識別符</p>  
        <p type="p">58a:追蹤識別符</p>  
        <p type="p">58b:追蹤識別符</p>  
        <p type="p">60:基板核心</p>  
        <p type="p">62:對準特徵</p>  
        <p type="p">64:前側</p>  
        <p type="p">66:背側</p>  
        <p type="p">68:導電層</p>  
        <p type="p">70:第二前側導電層</p>  
        <p type="p">78:第一背側導電層</p>  
        <p type="p">80:第二背側導電層</p>  
        <p type="p">120:互連結構</p>  
        <p type="p">130:前側介電層</p>  
        <p type="p">130a:第一前側封裝層</p>  
        <p type="p">130b:第二前側封裝層</p>  
        <p type="p">140:背側介電層</p>  
        <p type="p">140a:第一背側介電層</p>  
        <p type="p">140b:第二背側介電層</p>  
        <p type="p">142:第一背側平坦表面</p>  
        <p type="p">144:第二背側平坦表面</p>  
        <p type="p">150:互連結構</p>  
        <p type="p">160:互連基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1174" publication-number="202611864"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611864.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611864</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121772</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於深度估計之方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR DEPTH ESTIMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">G06T7/593</main-classification>  
        <further-classification edition="201701120251201B">G06T7/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　吉斯特　巴索洛米斯　威爾赫摩斯　黛米安納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN GEEST, BARTHOLOMEUS WILHELMUS DAMIANUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於深度估計之系統及方法。對一場景之一組2D影像執行分割，各2D影像具有該場景之一不同視圖。針對在該分割中識別之至少一個物體，藉由以下操作判定其中出現該物體之至少一個2D影像中之該物體之複數個像素之各者之一深度值：定義該物體之一初始估計區域，該初始估計區域包含在該分割中識別之該物體之一邊界；及迭代地重複以下步驟：判定一目前估計區域中之複數個像素之各者之一深度值且定義該物體之一經更新估計區域，直到已針對該物體之一預定比例判定一深度值為止。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for depth estimation. Segmentation is performed on a set of 2D images of a scene, each 2D image having a different view of the scene. For at least one object identified in the segmentation, a depth value is determined for each of a plurality of pixels of the object in at least one 2D image in which the object appears by: defining an initial estimation region for the object, the initial estimation region comprising a boundary of the object as identified in the segmentation; and iteratively repeating the steps of determine a depth value for each of a plurality of pixels in a current estimation region and defining an updated estimation region for the object, until a depth value has been determined for a predetermined proportion of the object.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:程序</p>  
        <p type="p">210:步驟</p>  
        <p type="p">220:步驟</p>  
        <p type="p">230:步驟</p>  
        <p type="p">240:步驟</p>  
        <p type="p">250:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1175" publication-number="202611627"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611627.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611627</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121774</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於微影設備之配置</chinese-title>  
        <english-title>AN ARRANGEMENT FOR A LITHOGRAPHIC APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251201B">G03F1/48</main-classification>  
        <further-classification edition="201201120251201B">G03F1/62</further-classification>  
        <further-classification edition="201201120251201B">G03F1/84</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡斯　塞爾溫　揚尼克　弗里斯喬夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CATS, SELWYN YANNICK FRITHJOF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倪祺佩洛　安得列</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKIPELOV, ANDREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克林　克里司遜　賈瑞德思　諾伯特斯　亨佐卡司　馬瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOIN, CHRISTIAN GERARDUS NORBERTUS HENDRICUS MARIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范　戴　克豪夫　馬卡斯　安德納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DE KERKHOF, MARCUS ADRIANUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於一微影設備之配置，該配置包含：一圖案化裝置，其經組態以將一圖案賦予至一輻射光束，該圖案化裝置包含一圖案化表面，該圖案化表面上具有一圖案；一支撐結構，其經組態以支撐該圖案化裝置；及一保護隔膜，其安置於該圖案化表面前方；其中該保護隔膜電連接至該支撐結構。此外，本發明揭示一種向一微影設備中之一圖案化裝置施加一偏壓電壓之方法，該方法包含：判定一保護隔膜是否安置於一圖案化表面前方；在該微影設備處於生產狀態且判定該保護隔膜安置於該圖案化表面前方的一狀況下，向該圖案化表面施加一第一偏壓電壓；及在判定該保護隔膜未安置的一狀況下，向該圖案化表面施加一第二偏壓電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An arrangement for a lithographic apparatus, comprising: a patterning device configured to impart a pattern to a beam of radiation, the patterning device comprising a patterning surface with a pattern thereon; a support structure configured to support the patterning device; and a protective membrane disposed in front of the patterning surface; wherein the protective membrane is electrically connected to the support structure. Further, a method of applying a bias voltage to a patterning device in a lithographic apparatus, comprising: determining whether a protective membrane is disposed in front of a patterning surface; in a case that the lithographic apparatus is in the production state and the protective membrane is determined to be disposed in front of the patterning surface, applying a first bias voltage to the patterning surface; and in a case that the protective membrane is determined not disposed, applying a second bias voltage to the patterning surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微影設備/設備</p>  
        <p type="p">104A:電極</p>  
        <p type="p">104B:電極</p>  
        <p type="p">106:支撐突起部/瘤節</p>  
        <p type="p">112:導電塗層</p>  
        <p type="p">113a:第一導電部分</p>  
        <p type="p">131:保護隔膜</p>  
        <p type="p">132:保護隔膜框架</p>  
        <p type="p">133:導電安裝部分/安裝部分</p>  
        <p type="p">207a:導電瘤節/第一導電瘤節</p>  
        <p type="p">207b:導電瘤節/第二導電瘤節</p>  
        <p type="p">213:不連續部</p>  
        <p type="p">240a:第一導電部分</p>  
        <p type="p">240b:第二導電部分</p>  
        <p type="p">250a:第一電壓源</p>  
        <p type="p">250b:第二電壓源</p>  
        <p type="p">260:導電邊緣</p>  
        <p type="p">MA:圖案化裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1176" publication-number="202612169"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612169.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612169</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121816</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線模組、相機模組及電子裝置</chinese-title>  
        <english-title>ANTENNA MODULE, CAMERA MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">H01Q1/22</main-classification>  
        <further-classification edition="200601120250703B">H01Q1/38</further-classification>  
        <further-classification edition="202101120250703B">G03B17/56</further-classification>  
        <further-classification edition="200601120250703B">H01Q1/46</further-classification>  
        <further-classification edition="200601120250703B">H01Q1/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啓碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON NEWEB CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚德劭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, DE SHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連崇哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, CHUNG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴志峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, CHIH FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線模組，包含一第一單元及一第二單元。第一單元包含一第一電路板，其包含一第一信號走線及一第一金屬墊。第二單元包含一第二電路板，其包含一第二信號走線及一第二金屬墊，第二電路板用以設置一饋入埠。第一電路板及第二電路板中各者朝第一方向及第二方向延伸，第一電路板及第二電路板沿第三方向排列並連接，第一電路板沿第三方向的一投影至少部分重疊於第二電路板沿第三方向的一投影，第二信號走線、第二金屬墊、第一金屬墊及第一信號走線依序電性連接。藉此，可節省空間並優化天線特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna module includes a first unit and a second unit. The first unit includes a first circuit board including a first signal trace and a first metal pad. The second unit includes a second circuit board including a second signal trace and a second metal pad, and the second circuit board is configured to dispose a feeding port thereon. Each of the first circuit board and the second circuit board extends in a first direction and a second direction, and the first circuit board and the second circuit board are arranged and connected along a third direction. A projection of the first circuit board along the third direction at least partially overlaps a projection of the second circuit board along the third direction. The second signal trace, the second metal pad, the first metal pad and the first signal trace are electrically connected in sequence. Therefore, it is advantageous in saving space and enhancing antenna characteristics.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:天線模組</p>  
        <p type="p">110:第一單元</p>  
        <p type="p">115:第一電路板</p>  
        <p type="p">118:成像鏡組</p>  
        <p type="p">119:透鏡組</p>  
        <p type="p">120:第二單元</p>  
        <p type="p">125:第二電路板</p>  
        <p type="p">126:表面</p>  
        <p type="p">132:第二信號走線</p>  
        <p type="p">133:暴露信號部</p>  
        <p type="p">136:第二接地走線</p>  
        <p type="p">150:饋入埠</p>  
        <p type="p">151:饋入纜線</p>  
        <p type="p">153:接地元件</p>  
        <p type="p">154:連接器</p>  
        <p type="p">s6:最小間距</p>  
        <p type="p">x1:第一方向</p>  
        <p type="p">y1:第二方向</p>  
        <p type="p">z1:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1177" publication-number="202611675"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611675.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611675</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121822</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用處理器控制進行電壓調節器雜訊減輕</chinese-title>  
        <english-title>VOLTAGE REGULATOR NOISE MITIGATION WITH PROCESSOR CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F1/26</main-classification>  
        <further-classification edition="201901120251201B">G06F1/324</further-classification>  
        <further-classification edition="201901120251201B">G06F1/3296</further-classification>  
        <further-classification edition="201901120251201B">G06F1/3234</further-classification>  
        <further-classification edition="200601120251201B">G05F1/571</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡連南　維杰基藍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALYANAM, VIJAY KIRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩頓　陶德羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUTTON, TODD ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡庫瑪哈帝　蘇瑞許庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENKUMAHANTI, SURESH KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾　季叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHI-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述了一種使用處理器控制進行電壓調節器雜訊減輕之方法。該方法包括：監測執行緒管線執行期間處理器執行緒之總和之功率消耗。該方法亦包括：當該功率消耗超過迴轉功率臨限時偵測電壓調節器雜訊。該方法進一步包括：根據選定節流控件來控制所有該等處理器執行緒的迴轉斜坡上升步進。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for voltage regulator noise mitigation with processor control is described. The method includes monitoring a power consumption of a sum of processor threads during thread pipeline execution. The method also includes detecting a voltage regulator noise when the power consumption exceeds a slew power threshold. The method further includes controlling slew ramp-up steps of all the processor threads according to a selected throttle control.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">220:數位功率計</p>  
        <p type="p">240:組態暫存器</p>  
        <p type="p">241:迴轉斜坡閒置臨限停用信號</p>  
        <p type="p">242:IdletoActive信號</p>  
        <p type="p">243:閒置信號</p>  
        <p type="p">244:DPM總和</p>  
        <p type="p">245:迴轉率最大DPM值</p>  
        <p type="p">246:最大DPM值</p>  
        <p type="p">247:停用信號</p>  
        <p type="p">248:迴轉斜坡閒置臨限週期</p>  
        <p type="p">249:迴轉斜坡週期</p>  
        <p type="p">300:迴轉斜坡控制電路</p>  
        <p type="p">310:迴轉斜坡區塊</p>  
        <p type="p">312:節流控制信號</p>  
        <p type="p">320:比較器區塊</p>  
        <p type="p">322:輸出</p>  
        <p type="p">330:標度區塊</p>  
        <p type="p">332:標度值</p>  
        <p type="p">340:可程式化數位功率計平均電路</p>  
        <p type="p">342:輸出</p>  
        <p type="p">350:求和區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1178" publication-number="202612130"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612130.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612130</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121824</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含封裝中介層的封裝及含開口的蓋框</chinese-title>  
        <english-title>PACKAGE COMPRISING A PACKAGE INTERPOSER AND A LID FRAME WITH AN OPENING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L23/31</main-classification>  
        <further-classification edition="200601120251201B">H01L23/049</further-classification>  
        <further-classification edition="200601120251201B">H01L23/29</further-classification>  
        <further-classification edition="200601120251201B">H01L23/373</further-classification>  
        <further-classification edition="200601120251201B">H01L23/538</further-classification>  
        <further-classification edition="200601120251201B">H01L23/498</further-classification>  
        <further-classification edition="200601120251201B">H01L25/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋　彥梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, YANMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃進宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JINGYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹　善雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, SUN WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史東　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STONE, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置，其包含：一基材；一封裝，其耦接至該基材；一第二整合裝置，其耦接至該基材；及一蓋框，其耦接至該基材，其中該蓋框包含垂直位於該第二整合裝置上方的一開口。該封裝包含：一封裝中介層，該封裝中介層包含：一第一金屬化部分；一第二金屬化部分；一被動裝置，其位於該第一金屬化部分與該第二金屬化部分之間；及一第一整合裝置，其耦接至該封裝中介層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device comprising a substrate; a package coupled to the substrate, a second integrated device coupled to the substrate; and a lid frame coupled to the substrate, wherein the lid frame comprises an opening located vertically over the second integrated device. The package comprises a package interposer comprising a first metallization portion; a second metallization portion; a passive device located between the first metallization portion and the second metallization portion; and a first integrated device coupled to the package interposer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">106:熱界面材料(TIM)</p>  
        <p type="p">108:蓋框</p>  
        <p type="p">109:黏合劑</p>  
        <p type="p">114:焊料互連件</p>  
        <p type="p">181:開口</p>  
        <p type="p">182:開口</p>  
        <p type="p">301:板</p>  
        <p type="p">303a:整合裝置</p>  
        <p type="p">303b:整合裝置</p>  
        <p type="p">305a:整合裝置</p>  
        <p type="p">305b:整合裝置</p>  
        <p type="p">306:橋接器</p>  
        <p type="p">309:囊封層</p>  
        <p type="p">310:板介電層</p>  
        <p type="p">312:板互連件</p>  
        <p type="p">331a:柱狀互連件</p>  
        <p type="p">331b:柱狀互連件</p>  
        <p type="p">350a:柱狀互連件</p>  
        <p type="p">350b:柱狀互連件</p>  
        <p type="p">352a:焊料互連件</p>  
        <p type="p">352b:焊料互連件</p>  
        <p type="p">365:柱互連件</p>  
        <p type="p">367:焊料互連</p>  
        <p type="p">399:底部填充物</p>  
        <p type="p">400:封裝</p>  
        <p type="p">402:封裝中介層</p>  
        <p type="p">404a:被動裝置</p>  
        <p type="p">404b:被動裝置</p>  
        <p type="p">420:金屬化部分</p>  
        <p type="p">422:介電層</p>  
        <p type="p">423:金屬化互連件</p>  
        <p type="p">425:柱狀互連件</p>  
        <p type="p">430:囊封部分</p>  
        <p type="p">432:囊封層</p>  
        <p type="p">433:柱互連件</p>  
        <p type="p">440:金屬化部分</p>  
        <p type="p">442:介電層</p>  
        <p type="p">443:金屬化互連件</p>  
        <p type="p">445a:柱互連件</p>  
        <p type="p">445b:柱互連件</p>  
        <p type="p">447a:焊料互連件</p>  
        <p type="p">447b:焊料互連件</p>  
        <p type="p">448a:互連件</p>  
        <p type="p">448b:互連件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1179" publication-number="202610850"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610850.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610850</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121841</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塗布具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">B43K5/18</main-classification>  
        <further-classification edition="200601120251204B">B43K8/02</further-classification>  
        <further-classification edition="200601120251204B">A46B11/00</further-classification>  
        <further-classification edition="200601120251204B">B01D19/02</further-classification>  
        <further-classification edition="200601120251204B">B05C17/005</further-classification>  
        <further-classification edition="200601120251204B">B05C11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱鉛筆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI PENCIL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武舎龍之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSHA, RYUNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]在提供一種直液式的塗布具，是可有效果地阻止空氣置換用的大氣成為氣泡混入送出到塗布體側的塗布液內，且在軸筒內配置有閥機構。 &lt;br/&gt;　　[解決手段]塗布具(1)，是具備有：具有塗布液收容室(2d)的軸筒(2)；前軸(3)，是配置在軸筒的前端部側，並以塗布體(4)從前端開口(3a)突出狀態下作安裝；以及閥機構(11)，是配置在塗布液收容室(2d)與塗布體(4)之間，被形成在閥機構(11)內的塗布液流路與吸氣流路分別分離形成在第1閥體(13)與塗布液密封體(16)的結合體的內側及外側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:軸筒</p>  
        <p type="p">2d:塗布液收容室</p>  
        <p type="p">3:前軸</p>  
        <p type="p">3a:前端開口</p>  
        <p type="p">3d:胴部</p>  
        <p type="p">3e:突起體</p>  
        <p type="p">3f:卡止凹部</p>  
        <p type="p">3g:肋體</p>  
        <p type="p">4:塗布體</p>  
        <p type="p">4a:凸緣部</p>  
        <p type="p">6:攪拌體</p>  
        <p type="p">8:塗布體保持構件</p>  
        <p type="p">9:液供給管</p>  
        <p type="p">11:閥機構</p>  
        <p type="p">12:閥保持構件</p>  
        <p type="p">12a:凸緣部</p>  
        <p type="p">13:第1閥體</p>  
        <p type="p">14:第2閥體</p>  
        <p type="p">15:第1彈簧</p>  
        <p type="p">16:塗布液密封體</p>  
        <p type="p">17:彈簧承接構件</p>  
        <p type="p">18:第2彈簧</p>  
        <p type="p">U1:塗布部單元</p>  
        <p type="p">U2:塗布液供給單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1180" publication-number="202610924"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610924.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610924</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121855</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>起重設備主控驅動器的可變抗衡</chinese-title>  
        <english-title>VARIABLE COUNTERBALANCE FOR A PRIMARY CONTROLLED DRIVE IN A LIFTING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">B66C13/18</main-classification>  
        <further-classification edition="200601120251204B">B66C23/80</further-classification>  
        <further-classification edition="200601120251204B">F15B1/02</further-classification>  
        <further-classification edition="200601120251204B">B66C13/12</further-classification>  
        <further-classification edition="200601120251204B">G05D16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪爾　吉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIEHL, JIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗雷　喬恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREY, JON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種重型起重機器之長型吊臂可樞轉地安裝在樞軸支座處，其中負載由該吊臂之自由端承載，該長型吊臂由連接至該吊臂之驅動端之主致動器樞轉。抗衡組件嚙合至該吊臂以抗衡該吊臂之重量產生之扭矩。抗衡組件包括液壓致動器，液壓致動器具有連接至該吊臂之活塞及連接至液壓迴路中之充氣蓄能器之液體填充汽缸。蓄能器中之氣體之壓力可藉由提供至液壓致動器之流體調整。該抗衡組件之活塞依據該蓄能器中壓縮之氣體之壓力而將抗衡力施加至該吊臂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An elongated boom of a heavy-lift machine is pivotably mounted at a pivot mount with the load carried by the free end of the boom, pivoted by a primary actuator connected to a drive end of the boom. A counterbalance component is engaged to the boom to counterbalance the weight-generated torque of the boom. The counterbalance component includes a hydraulic actuator with the piston connected to the boom and a liquid-filled cylinder connected to a gas- filled accumulator in a hydraulic circuit. The gas pressure in the accumulator is adjustable by the fluid provided to the hydraulic actuator. The piston of the counterbalance component applies a counterbalance force to the boom as a function of the pressure of the gas compressed in the accumulator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:主致動器</p>  
        <p type="p">20:第一液壓驅動器</p>  
        <p type="p">22:主控驅動器(PCD)控制器</p>  
        <p type="p">30:液壓致動器/抗衡致動器</p>  
        <p type="p">32:活塞</p>  
        <p type="p">34:流體填充汽缸腔室</p>  
        <p type="p">35:致動器輸入管線/入口管線</p>  
        <p type="p">40:液壓迴路</p>  
        <p type="p">41:第二液壓驅動器</p>  
        <p type="p">42:泵進料管線</p>  
        <p type="p">43:儲槽</p>  
        <p type="p">44:單向閥</p>  
        <p type="p">45:蓄能器</p>  
        <p type="p">45a:充氣腔室</p>  
        <p type="p">45b:流體腔室</p>  
        <p type="p">46:可控三通閥</p>  
        <p type="p">47:流體返回管線</p>  
        <p type="p">48:可調整減壓閥</p>  
        <p type="p">49:可調整減壓閥</p>  
        <p type="p">50:壓力轉換器</p>  
        <p type="p">W:重量/負載</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1181" publication-number="202610815"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610815.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610815</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121919</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體</chinese-title>  
        <english-title>OPTICAL LAMINATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251201B">B32B7/023</main-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification>  
        <further-classification edition="202301120251201B">H10K59/50</further-classification>  
        <further-classification edition="202301120251201B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部峻也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, SHUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明目的在於兼顧光學積層體的辨視性(干涉不均等)改善、及高溫高濕環境下的耐久性。本發明的光學積層體，係依序具備有：第一保護層、直線偏光片、第二保護層、具20~200nm厚度之第一貼合層、及相位差層積層體的光學積層體。相位差層積層體係從第一貼合層側起依序設有：第一液晶相位差層、具20~200nm厚度之第二貼合層、及第二液晶相位差層。第一液晶相位差層與第二液晶相位差層間之剝離力係0.20N/25mm以上；將上述相位差層積層體對波長λnm光的面內相位差值設為Re(λ)時，滿足下述式(1)與(2)的關係： &lt;br/&gt;70nm≦Re(450)≦130nm          (1) &lt;br/&gt;Re(450)/Re(550)≦1.00             (2)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The purpose of this invention is to provide an optical laminate which achieves both improved visibility (reduction of interference unevenness and the like) and durability under an environment with high-temperature and high-humidity. The solution of the present invention is an optical laminate includes, in this order, a first protective layer, a linear polarizer, a second protective layer, a first bonding layer having a thickness of 20 to 200 nm, and a phase retardation layer laminate. The phase retardation layer laminate includes, in this order from the above first bonding layer side, a first liquid crystal phase retardation layer, a second bonding layer having a thickness of 20 to 200 nm, and a second liquid crystal phase retardation layer. When the peel force between the first liquid crystal phase retardation layer and the second liquid crystal phase retardation layer is 0.20 N/25 mm or more and the in-plane phase retardation value to the phase retardation layer laminate for light with a wavelength of λ nm is set as Re(λ), the relationship between the following formulas (1) and (2) is satisfied. &lt;br/&gt;70nm≦Re(450)≦130nm (1) &lt;br/&gt;Re(450)/Re(550)≦1.00 (2)</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:第一液晶相位差層</p>  
        <p type="p">40:第二貼合層</p>  
        <p type="p">50:第二液晶相位差層</p>  
        <p type="p">150:第一貼合層</p>  
        <p type="p">180:第一保護層</p>  
        <p type="p">190:第二保護層</p>  
        <p type="p">220:直線偏光片</p>  
        <p type="p">300:相位差層積層體</p>  
        <p type="p">400:光學積層體(圓偏光板)</p>  
        <p type="p">500:外側黏著劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1182" publication-number="202611362"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611362.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611362</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121931</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物分解性紙、育苗用紙筒以及農業用地面被覆紙</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">D21H21/04</main-classification>  
        <further-classification edition="200601120251212B">D21H27/28</further-classification>  
        <further-classification edition="200601120251212B">D21H17/25</further-classification>  
        <further-classification edition="200601120251212B">D21H17/33</further-classification>  
        <further-classification edition="201801120251212B">A01G9/029</further-classification>  
        <further-classification edition="202501120251212B">A01G13/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商王子控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OJI HOLDINGS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本甜菜製糖股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON BEET SUGAR MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小柳淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOYANAGI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中干場亮太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAHOSHIBA, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部一行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KAZUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田英明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喜多勇貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木壮規</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, SOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種生物分解性紙，係包含纖維，前述纖維包含紙漿及生物分解性化學纖維；相對於生物分解性紙之總質量，前述紙漿的含量為72質量%以上至99質量%以下；依據 JIS P 8117：2009所測定之透氣度為8秒以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1183" publication-number="202610962"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610962.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610962</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121937</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>結晶氮化矽粉末、含該粉末之氮化矽燒結體、氮化矽燒結體的製造方法、含有該燒結體的物品及車輛</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">C04B35/584</main-classification>  
        <further-classification edition="200601120251212B">C04B35/593</further-classification>  
        <further-classification edition="200601120251212B">C04B35/565</further-classification>  
        <further-classification edition="202001120251212B">C01F17/218</further-classification>  
        <further-classification edition="200601120251212B">C01F5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＵＢＥ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UBE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小田浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河野孝史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWANO, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴田耕司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBATA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田哲夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, TETSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種結晶氮化矽粉末，其藉由包含特定之雜質碳量，變得能夠製造易燒結且具有優異之機械強度或導熱性之氮化矽燒結體。又，使用該氮化矽粉末，提供一種易燒結且機械強度或導熱性優異之氮化矽燒結體。進而，本發明提供一種易燒結且機械強度或導熱性優異之氮化矽燒結體的製造方法。 &lt;br/&gt;本發明係一種結晶氮化矽粉末，其包含氮化矽、碳及氧，且特徵在於：上述碳相對於粉末整體之質量比率Cp為0.200質量%以下，藉由升溫形態分析測得之在100℃以上且未達700℃內檢測出之第1揮發碳之質量比率C1為0.001質量%以上且0.030質量%以下，藉由升溫形態分析測得之在700℃以上且1200℃以下內檢測出之第2揮發碳之質量比率C2為0.005質量%以上且0.060質量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1184" publication-number="202611972"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611972.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611972</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121945</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿蝕刻方法</chinese-title>  
        <english-title>METHOD OF PLASMA ETCHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01J37/32</main-classification>  
        <further-classification edition="200601120251103B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＳＰＴＳ科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPTS TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡茲米　薩米拉　賓特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAZEMI, SAMIRA BINTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示一種用於電漿蝕刻含添加劑之氮化鋁膜之設備及方法，該含添加劑之氮化鋁膜含有選自鈧(Sc)、釔(Y)或鉺(Er)的添加元素。該方法包含以下步驟： &lt;br/&gt;將工件置放在電漿腔室內之基板支撐件上，該工件包含具有安置於其上之金屬膜之基板、沉積於該金屬膜上之含添加劑之氮化鋁膜及安置於該含添加劑之氮化鋁膜上之遮罩，該遮罩界定至少一個溝槽； &lt;br/&gt;用以sccm為單位之BCl&lt;sub&gt;3&lt;/sub&gt;流速將BCl&lt;sub&gt;3&lt;/sub&gt;氣體引入該腔室中； &lt;br/&gt;用以sccm為單位之H&lt;sub&gt;2&lt;/sub&gt;流速將H&lt;sub&gt;2&lt;/sub&gt;氣體引入該腔室中； &lt;br/&gt;用以sccm為單位之惰性稀釋氣體流速將惰性稀釋氣體引入該腔室中；以及 &lt;br/&gt;在該腔室內建立電漿以電漿蝕刻在該溝槽內暴露的該含添加劑之氮化鋁膜； &lt;br/&gt;其中該惰性稀釋氣體流速與該BCl&lt;sub&gt;3&lt;/sub&gt;流速之比率在1:3至1:11的範圍內，且該BCl&lt;sub&gt;3&lt;/sub&gt;流速與該H&lt;sub&gt;2&lt;/sub&gt;流速之比率在11:1至2:1的範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus and method are disclosed for plasma etching an additive-containing aluminium nitride film containing an additive element selected from scandium (Sc), yttrium (Y) or erbium (Er). The method comprises the steps of: &lt;br/&gt;placing a workpiece upon a substrate support within a plasma chamber, the workpiece comprising a substrate having a metal film disposed thereon, an additive-containing aluminium nitride film deposited on the metal film and a mask disposed upon the additive-containing aluminium nitride film which defines at least one trench; &lt;br/&gt;introducing BCl&lt;sub&gt;3&lt;/sub&gt; gas into the chamber with a BCl&lt;sub&gt;3&lt;/sub&gt; flow rate in sccm; &lt;br/&gt;introducing H&lt;sub&gt;2&lt;/sub&gt; gas into the chamber with a H&lt;sub&gt;2&lt;/sub&gt; flow rate in sccm; &lt;br/&gt;introducing an inert diluent gas into the chamber with an inert diluent gas flow rate in sccm; and &lt;br/&gt;establishing a plasma within the chamber to plasma etch the additive-containing aluminium nitride film exposed within the trench; &lt;br/&gt;wherein a ratio of the inert diluent gas flow rate to the BCl&lt;sub&gt;3&lt;/sub&gt; flow rate is in the range 1:3 to 1:11 and a ratio of the BCl&lt;sub&gt;3&lt;/sub&gt; flow rate to the H&lt;sub&gt;2&lt;/sub&gt; flow rate is in the range 11:1 to 2:1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:設備</p>  
        <p type="p">11:工件</p>  
        <p type="p">11a:基板</p>  
        <p type="p">11b:金屬膜層</p>  
        <p type="p">11c:壓電AlScN膜</p>  
        <p type="p">11d:遮罩</p>  
        <p type="p">11e:溝槽</p>  
        <p type="p">12:腔室</p>  
        <p type="p">12a:腔室壁</p>  
        <p type="p">12b:介電窗區段</p>  
        <p type="p">13:壓板組件</p>  
        <p type="p">13a:主體</p>  
        <p type="p">13b:支撐表面</p>  
        <p type="p">14:陶瓷斷路器</p>  
        <p type="p">15a:第一氣體入口</p>  
        <p type="p">15b:第二氣體入口</p>  
        <p type="p">15c:第三氣體入口</p>  
        <p type="p">15d:第四氣體入口</p>  
        <p type="p">16:出口</p>  
        <p type="p">17:產生器</p>  
        <p type="p">18:天線</p>  
        <p type="p">19:電漿區</p>  
        <p type="p">20a,20b,20c,20d:流量調節器</p>  
        <p type="p">21:電壓產生器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1185" publication-number="202611422"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611422.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611422</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121979</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閥致動器</chinese-title>  
        <english-title>VALVE ACTUATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">F16K31/126</main-classification>  
        <further-classification edition="200601120251204B">F16K37/00</further-classification>  
        <further-classification edition="200601120251204B">G05D7/06</further-classification>  
        <further-classification edition="200601120251204B">C23C16/455</further-classification>  
        <further-classification edition="200601120251204B">H01L21/205</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紐西蘭商全球力量ＩＰ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALFORCE IP LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商漢默佛斯英國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMERFORCE UK LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特森　伊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATERSON, IAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科西尼　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORSINI, PAOLO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普里奇　羅伯托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRICCI, ROBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種隔膜閥1，包括一致動器2，致動器2包括一致動元件3、一導引路徑4、以及一驅動系統5，致動元件3配置以對隔膜閥1之閥塞進行作用，該驅動系統5配置以將動能施加至致動元件3以操作隔膜閥1，驅動系統5包括一可移動質量6，適配以沿導引路徑4移動一非零距離，藉由撞擊瞬時將動能傳遞至致動元件3。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A diaphragm valve 1, comprises an actuator 2, the actuator comprising an actuation element 3 disposed to act upon an obturator of the valve 1, a guide path 4 and a drive system 5, the drive system being disposed to impart kinetic energy to the actuation element 3 to operate the valve, the drive system 5 comprising a moveable mass 6 adapted to achieve instantaneous transfer of kinetic energy via impact to the actuation element 3 through movement of the mass 6 over a non-zero distance along the guide path 4.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:閥</p>  
        <p type="p">2:致動器</p>  
        <p type="p">3:致動元件/桿體</p>  
        <p type="p">4:導引路徑</p>  
        <p type="p">5:驅動系統</p>  
        <p type="p">6:質量</p>  
        <p type="p">8:閥體</p>  
        <p type="p">9:入口</p>  
        <p type="p">10:出口</p>  
        <p type="p">11:隔膜</p>  
        <p type="p">12:上蓋</p>  
        <p type="p">12a:側壁</p>  
        <p type="p">12b:頂蓋</p>  
        <p type="p">12c:底蓋</p>  
        <p type="p">15:壓力腔室</p>  
        <p type="p">15a:第一體積/上體積/第一腔室</p>  
        <p type="p">15b:第二體積/下體積/第二腔室</p>  
        <p type="p">16a、17a:接頭</p>  
        <p type="p">19:開口</p>  
        <p type="p">20:頸部</p>  
        <p type="p">21:腳部</p>  
        <p type="p">22:隔膜座</p>  
        <p type="p">23:通道</p>  
        <p type="p">24:上凸緣/上撞擊表面</p>  
        <p type="p">25:下凸緣/下撞擊表面</p>  
        <p type="p">24a、25a:圓形凸緣</p>  
        <p type="p">27:堰</p>  
        <p type="p">500:感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1186" publication-number="202612217"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612217.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612217</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>最佳化電力開關啟用延遲的邏輯</chinese-title>  
        <english-title>LOGIC OPTIMIZING POWER SWITCH ENABLE DELAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02J13/00</main-classification>  
        <further-classification edition="201901120251201B">G06F1/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　智勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JIHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特爾　維奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, VINAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李在　坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAE GON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜阿　阿克謝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUA, AKSHAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　阿尤什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, AYUSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘帕　賽　阿克希特　庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAMPA, SAI AKSHIT KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾耶爾　維沙爾　斯里尼瓦桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IYER, VISHAL SRINIVASAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬希賈　尼廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKHIJA, NITIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的某些態樣涉及用於電力管理之技術。該等技術提供耦接（例如，電氣耦接）至邏輯電路及一電源的電力開關的啟用信號的傳輸之間的最佳交錯延遲時間。最佳交錯延遲時間可允許以交錯、依序的方式啟用或導通電力開關，同時減少邏輯電路的通電延時。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Certain aspects of the present disclosure are directed towards techniques for power management. The techniques provide an optimal staggering delay time between transmission of enable signals to power switches coupled (e.g., electrically coupled) to logic circuits and a power source. The optimal staggering delay time may allow enabling or turning on of the power switches in a staggered, sequential fashion while reducing power up latency of the logic circuits.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:操作；方法</p>  
        <p type="p">1110:步驟</p>  
        <p type="p">1120:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1187" publication-number="202611594"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611594.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611594</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122089</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於光學探頭的光學校準結構、包含光學校準結構的光學探頭系統以及校準複數個光學探頭的方法</chinese-title>  
        <english-title>OPTICAL CALIBRATION STRUCTURES FOR OPTICAL PROBES, OPTICAL PROBE SYSTEMS THAT INCLUDE THE OPTICAL CALIBRATION STRUCTURES, AND METHODS OF CALIBRATING A PLURALITY OF OPTICAL PROBES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G02B21/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豐菲克特公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORMFACTOR, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, QUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里斯坦森　艾瑞克　羅伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHRISTENSON, ERIC ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里沙維　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RISHAVY, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽門斯　麥克　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMMONS, MICHAEL E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛蘭克爾　約瑟夫　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRANKEL, JOSEPH GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出用於光學探頭的光學校準結構、包含光學校準結構的光學探頭系統以及校準複數個光學探頭的方法。光學校準結構包含反射器、阻障結構及光學偵測器。光學探頭系統包含光學校準結構、夾盤、光學組合件以及信號產生及分析組合件。方法包含操作該光學探頭系統的方法及/或利用該光學校準結構的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Optical calibration structures for optical probes, optical probe systems that include the optical calibration structures, and methods of calibrating a plurality of optical probes. The optical calibration structures include a reflector, an obstructive structure, and an optical detector. The optical probe systems include the optical calibration structure, a chuck, an optical assembly, and a signal generation and analysis assembly. The methods include methods of operating the optical probe systems and/or methods of utilizing the optical calibration structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光學探頭系統</p>  
        <p type="p">20:夾盤</p>  
        <p type="p">22:支撐表面</p>  
        <p type="p">24:熱控制單元</p>  
        <p type="p">26:夾盤傳送結構</p>  
        <p type="p">30:光學探頭組合件</p>  
        <p type="p">32:光學探頭</p>  
        <p type="p">33:探頭間距</p>  
        <p type="p">34:距離感測器</p>  
        <p type="p">36:光學探頭組合件傳送結構</p>  
        <p type="p">38:光纖纜線</p>  
        <p type="p">40:信號產生及分析組合件</p>  
        <p type="p">42:光源</p>  
        <p type="p">44:光偵測器</p>  
        <p type="p">46:測試光束</p>  
        <p type="p">47:光束路徑</p>  
        <p type="p">48:光學合成光束</p>  
        <p type="p">50:成像裝置</p>  
        <p type="p">52:顯微鏡</p>  
        <p type="p">54:物鏡透鏡</p>  
        <p type="p">56:成像裝置傳送結構</p>  
        <p type="p">58:顯示器</p>  
        <p type="p">60:電探頭組合件</p>  
        <p type="p">62:電探測</p>  
        <p type="p">70:圍封件</p>  
        <p type="p">72:圍封體積</p>  
        <p type="p">80:控制器</p>  
        <p type="p">82:非暫時性電腦可讀取儲存媒體</p>  
        <p type="p">90:基板</p>  
        <p type="p">92:光學裝置</p>  
        <p type="p">100:光學校準結構</p>  
        <p type="p">102:輔助夾盤</p>  
        <p type="p">110:反射器</p>  
        <p type="p">112:反射表面</p>  
        <p type="p">130:光學偵測器</p>  
        <p type="p">132:偵測器電輸出</p>  
        <p type="p">140:阻障結構</p>  
        <p type="p">142:非阻障區</p>  
        <p type="p">150:不透明區</p>  
        <p type="p">160:片狀透明材料</p>  
        <p type="p">170:校準結構傳送結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1188" publication-number="202612275"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612275.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612275</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122144</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>邏輯電路、處理裝置、電子構件以及電子裝置</chinese-title>  
        <english-title>LOGIC CIRCUIT, PROCESSING UNIT, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">H03K19/0185</main-classification>  
        <further-classification edition="202501120251215B">H10D86/00</further-classification>  
        <further-classification edition="202501120251215B">H10D30/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上杉航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UESUGI, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田村輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMURA, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>磯部敦生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISOBE, ATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">藉由在邏輯電路中設置保持電路，進行電源閘控。保持電路包括第一端子、節點、電容器以及第一電晶體至第三電晶體。第一電晶體控制第一端子與邏輯電路的輸入端子之間的導通狀態。第二電晶體控制邏輯電路的輸出端子與節點之間的導通狀態。第三電晶體控制節點與邏輯電路的輸入端子之間的導通狀態。第一電晶體的閘極與第二電晶體的閘極電連接。在資料保持期間中，節點處於電浮動狀態。節點的電壓被電容器保持。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A retention circuit provided in a logic circuit enables power gating. The retention circuit includes a first terminal, a node, a capacitor, and first to third transistors. The first transistor controls electrical connection between the first terminal and an input terminal of the logic circuit. The second transistor controls electrical connection between an output terminal of the logic circuit and the node. The third transistor controls electrical connection between the node and the input terminal of the logic circuit. A gate of the first transistor is electrically connected to a gate of the second transistor. In a data retention period, the node becomes electrically floating. The voltage of the node is held by the capacitor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:選擇電路</p>  
        <p type="p">31:正反器</p>  
        <p type="p">SFF110:掃描正反器</p>  
        <p type="p">SFF11:掃描正反器</p>  
        <p type="p">RC11:電路</p>  
        <p type="p">C11:電容器</p>  
        <p type="p">FN11:節點</p>  
        <p type="p">M1~M3:電晶體</p>  
        <p type="p">SD_IN、RE、BK、PL、SD、D、SE、CK、Q:端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1189" publication-number="202611861"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611861.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611861</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖像處理裝置及電腦程式</chinese-title>  
        <english-title>IMAGE PROCESSING APPARATUS AND COMPUTER PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251103B">G06T7/10</main-classification>  
        <further-classification edition="202201120251103B">G06V10/20</further-classification>  
        <further-classification edition="202201120251103B">G06V10/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱田康弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡山敏之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAYAMA, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島田佳典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMADA, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茶谷草汰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHATANI, SOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種技術，其在利用機器學習模型進行圖像之區域分割任務時，用以可視化被選擇的分類類別的反應大小。 &lt;br/&gt;具有該圖像處理裝置的圖像處理部30係包含有：機器學習模型300，其對複數個分類類別中之各者，輸出表示與對象圖像Di之各像素相應符合的分類類別之概然性的輸出值；區域分割圖像製作部32，其根據機器學習模型300之輸出Do而製作區域分割圖像，該區域分割圖像係將對象圖像Di之各像素予以分割為屬於複數個分類類別任一者的每個區域；符合概率計算部33，其根據機器學習模型300之輸出Do，對對象圖像Di之各像素，計算與複數個分類類別各者相符合的符合概率；及評估圖像製作部34，其對分類類別各者製作評估圖像Dv，該評估圖像Dv係因應於符合概率而以不同之顯示態樣予以顯示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:顯示部</p>  
        <p type="p">13:輸入部</p>  
        <p type="p">20:圖像記憶部</p>  
        <p type="p">30:圖像處理部</p>  
        <p type="p">31:區域分割執行部</p>  
        <p type="p">32:區域分割圖像製作部</p>  
        <p type="p">33:概率計算部</p>  
        <p type="p">34:評估圖像製作部</p>  
        <p type="p">300:機器學習模型</p>  
        <p type="p">Di:對象圖像</p>  
        <p type="p">Do:輸出資料</p>  
        <p type="p">Dp:概率資料</p>  
        <p type="p">Ds:區域分割圖像</p>  
        <p type="p">Dt:統合評估圖像</p>  
        <p type="p">Dv:評估圖像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1190" publication-number="202611494"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611494.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611494</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊取得裝置及資訊取得方法</chinese-title>  
        <english-title>INFORMATION ACQUISITION APPARATUS AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G01N1/10</main-classification>  
        <further-classification edition="200601120251001B">G01N21/05</further-classification>  
        <further-classification edition="201401120251001B">G01N21/552</further-classification>  
        <further-classification edition="200601120251001B">G01N21/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田智明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於在一面將流體在設置於流通池之流路中流動、一面測定與位於流路內之特定物質相關之資訊之資訊取得裝置及資訊取得方法中，能夠一面控制流路內之流體之流速，一面進行前述資訊之測定。 &lt;br/&gt;於本發明中，藉由將透明構件設置於池部以封蓋池部之開口，而於流通池形成流路，且於池部設置有調整部。藉由相對於流體之流動方向之正交之前述流路之剖面積因調整部而變化，而控制流經流通池之流路之流體之流速。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">802:流路</p>  
        <p type="p">804:流通池</p>  
        <p type="p">806:全反射測定部</p>  
        <p type="p">808:池部</p>  
        <p type="p">810:透明構件</p>  
        <p type="p">812:導入口</p>  
        <p type="p">814:排出口</p>  
        <p type="p">816:開口</p>  
        <p type="p">818:調整部</p>  
        <p type="p">820:中央流路區域</p>  
        <p type="p">822:導引部位</p>  
        <p type="p">824:凹部</p>  
        <p type="p">826:可動體</p>  
        <p type="p">828:定位塊</p>  
        <p type="p">830:對向部位</p>  
        <p type="p">832:豎立設置部位</p>  
        <p type="p">834:中空間隔件</p>  
        <p type="p">836:連結板</p>  
        <p type="p">838:螺栓</p>  
        <p type="p">840:螺帽</p>  
        <p type="p">842:O型環</p>  
        <p type="p">844:投光部</p>  
        <p type="p">846:稜鏡</p>  
        <p type="p">848:受光部</p>  
        <p type="p">X:方向</p>  
        <p type="p">Z:方向/鉛直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1191" publication-number="202610789"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610789.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610789</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122170</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分散式機器人控制器</chinese-title>  
        <english-title>DISTRIBUTED ROBOT CONTROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">B25J9/16</main-classification>  
        <further-classification edition="200601120251204B">B25J9/06</further-classification>  
        <further-classification edition="200601120251204B">G05B19/418</further-classification>  
        <further-classification edition="200601120251204B">B25J13/08</further-classification>  
        <further-classification edition="201601120251204B">H02P5/00</further-classification>  
        <further-classification edition="200601120251204B">B65G61/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商靈巧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXTERITY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　周文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, ZHOUWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅農　薩米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENON, SAMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>爾夏爾馬　尼爾馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, NIRMAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭詠翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種分散式機器人控制器，其包括：複數個本端控制器，其等各自與包含於構成一機器人之複數個馬達中之一對應馬達相關聯；及一機器人級控制器，其與該等本端控制器之各者通信地耦合，且經組態以判定用以操作該複數個馬達以引起該機器人執行一任務之一計畫，及向包含於該複數個本端控制器中之該等本端控制器之各者發送與該本端控制器所相關聯之該馬達相關聯之至少一組一或多個轉矩。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A distributed robot controller is disclosed, comprising a plurality of local controllers, each associated with a corresponding motor included in a plurality of motors comprising a robot; and a robot level controller coupled communicatively with each of the local controllers and configured to determine a plan to operate the plurality of motors to cause the robot to perform a task and send to each of the local controllers included in the plurality of local controllers at least a set of one or more torques associated with the motor with which that local controller is associated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:機器人</p>  
        <p type="p">102:機器人控制移動底盤</p>  
        <p type="p">104:機械臂</p>  
        <p type="p">105:吸附式末端執行器</p>  
        <p type="p">106:中央控制器</p>  
        <p type="p">107:無線通信介面/天線</p>  
        <p type="p">108:電池</p>  
        <p type="p">110:本端控制器</p>  
        <p type="p">112:本端控制器</p>  
        <p type="p">114:本端控制器/分散式控制器</p>  
        <p type="p">115:關節</p>  
        <p type="p">116:本端控制器/分散式控制器</p>  
        <p type="p">117:關節</p>  
        <p type="p">118:本端控制器/分散式控制器</p>  
        <p type="p">119:關節</p>  
        <p type="p">120:本端控制器/分散式控制器</p>  
        <p type="p">122:關節</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1192" publication-number="202611997"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611997.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611997</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122191</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鍍敷裝置及鍍敷處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01L21/288</main-classification>  
        <further-classification edition="200601120251205B">H01L21/67</further-classification>  
        <further-classification edition="200601120251205B">C25D17/10</further-classification>  
        <further-classification edition="200601120251205B">C25D5/04</further-classification>  
        <further-classification edition="200601120251205B">C25D21/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石豪介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, GOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濵田正人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山村健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMURA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提高鍍敷膜厚的面內均勻性。 &lt;br/&gt;　　[解決手段] 一種鍍敷裝置，具備：基板保持部，是保持基板；陰極，是可以接觸被前述基板保持部所保持的基板；天板，是從上方覆蓋被前述基板保持部所保持的基板；鍍敷液吐出口，設於前述天板，是將鍍敷液吐出至被前述基板保持部所保持的基板與前述天板之間的空間；鍍敷液供給部，是對前述鍍敷液吐出口供給鍍敷液；陽電極板，是板狀體，位於充滿前述空間內的鍍敷液中，從上方覆蓋被前述基板保持部所保持的基板；電源裝置，是在前述陰極與前述陽電極板之間施加電壓，使得接觸前述陰極的基板與前述陽電極板之間流通鍍敷電流；移動機構，是使前述陽電極板於水平方向上對前述天板或前述基板保持部進行相對移動；以及控制部，是控制前述鍍敷液供給部、前述移動機構、前述電源裝置的動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板保持旋轉部</p>  
        <p type="p">12:基板保持部</p>  
        <p type="p">14:旋轉驅動部</p>  
        <p type="p">20:天板</p>  
        <p type="p">21:噴嘴(天板噴嘴)</p>  
        <p type="p">22:鍍敷液供給部</p>  
        <p type="p">23:鍍敷液供給源</p>  
        <p type="p">24:配管</p>  
        <p type="p">25:流量控制機器</p>  
        <p type="p">26:天板升降驅動部</p>  
        <p type="p">27:升降桿</p>  
        <p type="p">30:陽電極板</p>  
        <p type="p">31:貫通孔</p>  
        <p type="p">32:電線</p>  
        <p type="p">34:陽極升降機構</p>  
        <p type="p">35:桿(棒狀體)</p>  
        <p type="p">36:陽極水平移動機構</p>  
        <p type="p">37:基座構件</p>  
        <p type="p">40:陰電極接觸部</p>  
        <p type="p">42:陰電極移動機構</p>  
        <p type="p">43:電線</p>  
        <p type="p">50:電源裝置</p>  
        <p type="p">60:清洗液供給部</p>  
        <p type="p">61:清洗液供給源</p>  
        <p type="p">62:配管</p>  
        <p type="p">64:三向閥</p>  
        <p type="p">65:流量控制機器</p>  
        <p type="p">66:配管</p>  
        <p type="p">70:清洗液噴嘴</p>  
        <p type="p">80:控制部</p>  
        <p type="p">81:控制運算部</p>  
        <p type="p">82:記憶部</p>  
        <p type="p">Av,Bh,Bv,Ch,Dh:箭頭</p>  
        <p type="p">W:晶圓(基板)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1193" publication-number="202611483"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611483.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611483</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122217</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>粉體供給裝置及粉體供給方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">G01F13/00</main-classification>  
        <further-classification edition="200601120251204B">B23D79/02</further-classification>  
        <further-classification edition="200601120251204B">B23D1/02</further-classification>  
        <further-classification edition="200601120251204B">B65G65/34</further-classification>  
        <further-classification edition="200601120251204B">H05F3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗田貴行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻井奈那子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAI, NANAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬傳奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, CHUANQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種粉體供給裝置，其為供給粉體之粉體供給裝置，其具備：線狀構件；及刮落構件，具有插通有線狀構件之插通孔。一種粉體供給方法，該方法為使用上述粉體供給裝置供給粉體之粉體供給方法，其中，使粉體附著於線狀構件的前端部，將前端部配置於供給對象的上方，使線狀構件向從插通孔拔出線狀構件之拔出方向移動，以藉由刮落構件將附著於前端部之粉體刮落。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:粉體供給裝置</p>  
        <p type="p">2:線狀構件</p>  
        <p type="p">3:刮落構件</p>  
        <p type="p">5:架台</p>  
        <p type="p">6:控制裝置</p>  
        <p type="p">21:前端部</p>  
        <p type="p">22:第一線狀部</p>  
        <p type="p">23:第二線狀部</p>  
        <p type="p">24:接頭</p>  
        <p type="p">31:插通孔</p>  
        <p type="p">32:凸部</p>  
        <p type="p">33:內筒</p>  
        <p type="p">34:外筒</p>  
        <p type="p">51:固定架台</p>  
        <p type="p">51a:基座</p>  
        <p type="p">51b:支柱</p>  
        <p type="p">52:水平移動機構</p>  
        <p type="p">52a:轉動部</p>  
        <p type="p">52b:第一驅動部</p>  
        <p type="p">52c:上段臂部</p>  
        <p type="p">52d:上段保持部</p>  
        <p type="p">52e:中段臂部</p>  
        <p type="p">52f:中段支承部</p>  
        <p type="p">52g:下段臂部</p>  
        <p type="p">53:插拔移動機構</p>  
        <p type="p">53a:移動部</p>  
        <p type="p">53b:第二驅動部</p>  
        <p type="p">C:容器(供給對象)</p>  
        <p type="p">D:插拔方向</p>  
        <p type="p">D1:按入方向</p>  
        <p type="p">D2:拔出方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1194" publication-number="202611554"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611554.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611554</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122225</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學膜及包含其的顯示裝置</chinese-title>  
        <english-title>OPTICAL FILM AND DISPLAY COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251201B">G02B1/111</main-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification>  
        <further-classification edition="200601120251201B">G02F1/13357</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商東麗先端素材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY ADVANCED MATERIALS KOREA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵重碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JOONG SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金潢龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HWANGYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種光學膜，更詳細地，在顯示裝置的情況下，能夠改善左右視角，在製造成大面積時仍可均勻表現視角改善效果，並且在改善視角的同時，可以在不降低正面亮度特性的情況下提高對比且可使色彩變化最小化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:各向異性擴散層</p>  
        <p type="p">110:表層</p>  
        <p type="p">200:光學膜</p>  
        <p type="p">X-X':邊界線</p>  
        <p type="p">Y-Y':邊界線</p>  
        <p type="p">X:軸</p>  
        <p type="p">Y:軸</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1195" publication-number="202611321"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611321.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611321</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122226</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於現場純化的系統及相關方法</chinese-title>  
        <english-title>SYSTEMS FOR ON-SITE PURIFICATION AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C23C16/02</main-classification>  
        <further-classification edition="200601120251201B">C23C16/448</further-classification>  
        <further-classification edition="200601120251201B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨德森　盧卡斯　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENDERSON, LUCAS B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢迪克斯　布萊恩　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENDRIX, BRYAN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝托爾　史考特　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BATTLE, SCOTT L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華生　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATSON, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些實施例係關於系統及相關方法。一種系統包括一櫃。該櫃包括一第一安瓿。該第一安瓿包括一第一前驅物材料及至少一種第一雜質。該櫃包括一歧管。該歧管係可連接至一工具。該櫃包括一第一閥。該第一閥將該第一安瓿連接至該歧管。在該第一閥已曝露於該第一前驅物材料之後，該第一閥尚未曝露於一外部環境。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments relate to systems and related methods. A system comprises a cabinet. The cabinet comprises a first ampoule. The first ampoule comprises a first precursor material and at least one first impurity. The cabinet comprises a manifold. The manifold is connectable to a tool. The cabinet comprises a first valve. The first valve connects the first ampoule to the manifold. The first valve has not been exposed to an external environment after the first valve has been exposed to the first precursor material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:櫃</p>  
        <p type="p">104:第一安瓿</p>  
        <p type="p">106:第二安瓿</p>  
        <p type="p">108:歧管</p>  
        <p type="p">110:第一閥</p>  
        <p type="p">112:第二閥</p>  
        <p type="p">114:半導體工具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1196" publication-number="202611795"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611795.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611795</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122232</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量子編碼方法與系統</chinese-title>  
        <english-title>QUANTUM CODING METHODS AND SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250703B">G06N10/40</main-classification>  
        <further-classification edition="202201120250703B">G06N10/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝明修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MIN-HSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露透過量子編碼方法與系統，可將複雜分子中電子的電子軌道分布情形以二進制的方式表示為第一哈密頓量，並且將第一哈密頓量進行壓縮為第二哈頓量。不但可以減少電路設計中量子比特的需求，還可以結合化學基底編排後，壓縮態的漢明權重與電子躍遷資訊連結，使得搜索低能量態時的化學經驗可以被應用在電路設計上，最終搭配固定漢明權重擬設來完成最後的設計。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure uses quantum encoding methods and systems to express the electron orbital distribution of electrons in complex molecules as a first Hamiltonian in a binary manner, and compress the first Hamiltonian into a second Hamiltonian. Not only can it reduce the demand for qubits in circuit design, but it can also be combined with the chemical substrate arrangement to connect the Hamming weight of the compressed state with the electronic transition information, so that the chemical experience in searching for low-energy states can be applied to circuit design, and ultimately matched Fixed Hamming weights were proposed to complete the final design.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110、S120、S130、S140:流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1197" publication-number="202611181"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611181.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611181</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122251</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性組成物，及經圖型化的硬化膜之製造方法</chinese-title>  
        <english-title>PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G77/14</main-classification>  
        <further-classification edition="200601120251201B">C07C309/12</further-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/075</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田知孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, TOMOTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>衣幡慶一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IBATA, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹下優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKESHITA, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供兼顧了蝕刻耐性與微影術特性之可形成微細尺寸的圖型之感光性組成物，及經圖型化的硬化膜之製造方法。 &lt;br/&gt;　　其解決手段為一種感光性組成物，其含有具有酚性羥基，及經酸解離性基保護的鹼可溶性基之含有矽之聚合物(A)，與光酸產生劑(B)，且 &lt;br/&gt;　　前述光酸產生劑(B)，包含具有包含碘原子之鋶陽離子的光酸產生劑(B1)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1198" publication-number="202611182"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611182.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611182</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122254</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>負型感光性組成物，及經圖型化的硬化膜之製造方法</chinese-title>  
        <english-title>NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G77/16</main-classification>  
        <further-classification edition="200601120251201B">C07C309/12</further-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/075</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田知孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, TOMOTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>衣幡慶一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IBATA, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹下優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKESHITA, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供兼顧了蝕刻耐性與微影術特性之可形成微細尺寸的圖型之負型感光性組成物，及經圖型化的硬化膜之製造方法。 &lt;br/&gt;　　其解決手段為一種負型感光性組成物，其含有具有酚性羥基的含有矽之聚合物(A)、光酸產生劑(B)，與交聯劑(C)，且光酸產生劑(B)，包含具有包含碘原子之鋶陽離子的光酸產生劑(B1)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1199" publication-number="202611375"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611375.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611375</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122298</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於複合牆的建築方法的固定裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250620B">E04B1/76</main-classification>  
        <further-classification edition="200601120250620B">E04C2/30</further-classification>  
        <further-classification edition="200601120250620B">E04G11/18</further-classification>  
        <further-classification edition="200601120250620B">E04G17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種固定裝置包含一主桿、一外殼、一第一擋止板及一定位件單元。主桿包括一桿部及一連接該桿部一端的該擋止塊部。外殼包覆部分的該桿部及該擋止塊部。第一擋止板固定地套設於該外殼包覆該桿部的部份主桿且鄰近該第一端。定位件單元可活動地套設於該外接桿部外露於該外殼的部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:固定裝置</p>  
        <p type="p">411:桿部</p>  
        <p type="p">42:外殼</p>  
        <p type="p">43:定位單元</p>  
        <p type="p">431:定位件</p>  
        <p type="p">432:第二擋止板</p>  
        <p type="p">44:第一擋止板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1200" publication-number="202611894"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611894.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611894</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122350</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及包含其之電子裝置</chinese-title>  
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251201B">G09G3/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星顯示器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志朠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔賢榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, HYUNYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李相九</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG-GU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李庸羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YONGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙亨旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HYUNG UK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包含：一顯示面板，該顯示面板包含一像素，該像素包含：一發光元件，該發光元件包含連接至一第一電源線的一陽極及一陰極；一第一電晶體，連接在該陰極及一第二電源線之間，並根據一第一節點的電位進行操作；一第二電晶體，位於該第一節點及一資料線之間，並接收一第一掃描訊號；一第三電晶體，位於該第一節點及一參考電壓線之間，並接收一第二掃描訊號；一第一發射控制電晶體，連接在該第一電晶體及該第二電源線之間，並連接至一第三節點，且接收一第一發射控制訊號；一第一電容器，位於該第一節點及一第二節點之間，其中，該第一電晶體及該第一發射控制電晶體連接至該第一電容器；以及一第二電容器，連接在該第二節點及該第三節點之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes: a display panel including a pixel including: a light emitting element including an anode connected to a first power line and a cathode; a first transistor connected between the cathode and a second power line and operating according to a potential of a first node; a second transistor between the first node and a data line and receiving a first scan signal; a third transistor between the first node and a reference voltage line and receiving a second scan signal; and a first emission control transistor connected between the first transistor and the second power line, connected to a third node, and receiving a first emission control signal; a first capacitor between the first node and a second node, to which the first transistor and the first emission control transistor are connected; and a second capacitor connected between the second node and the third node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C1:第一電容器</p>  
        <p type="p">C2:第二電容器</p>  
        <p type="p">DLj:資料線</p>  
        <p type="p">DSj:資料訊號</p>  
        <p type="p">ED:發光元件</p>  
        <p type="p">ELVDD:第一驅動電壓</p>  
        <p type="p">ELVSS:第二驅動電壓</p>  
        <p type="p">EMi:發射控制訊號</p>  
        <p type="p">EMLi:發射控制線</p>  
        <p type="p">ET1:第一發射控制電晶體</p>  
        <p type="p">ET2:第二發射控制電晶體</p>  
        <p type="p">GCi:補償掃描訊號</p>  
        <p type="p">GCLi:補償掃描線</p>  
        <p type="p">GWi:寫入掃描訊號</p>  
        <p type="p">GWLi:寫入掃描線</p>  
        <p type="p">N1:第一節點</p>  
        <p type="p">N2:第二節點</p>  
        <p type="p">N3:第三節點</p>  
        <p type="p">N4:第四節點</p>  
        <p type="p">PL1:第一電源線</p>  
        <p type="p">PL2:第二電源線</p>  
        <p type="p">PXCa:像素電路，像素驅動電路，像素驅動器</p>  
        <p type="p">PXij:像素</p>  
        <p type="p">T1:第一電晶體，驅動電晶體</p>  
        <p type="p">T2:第二電晶體</p>  
        <p type="p">T3:第三電晶體，補償電晶體</p>  
        <p type="p">T4:第四電晶體</p>  
        <p type="p">VL1:參考電壓線</p>  
        <p type="p">Vref:參考電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1201" publication-number="202610943"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610943.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610943</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122426</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多孔質亞氧化鈦、陽極觸媒、膜電極接合體、以及膜電極接合體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">C01G23/04</main-classification>  
        <further-classification edition="202101120251212B">C25B11/032</further-classification>  
        <further-classification edition="200601120251212B">B01J21/06</further-classification>  
        <further-classification edition="200601120251212B">B01J23/46</further-classification>  
        <further-classification edition="202301120251212B">C02F1/461</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商科納維股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANADEVIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>来田康司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIDA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徳野剛大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUNO, TAKEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濵田尚也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西亜美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHI, TSUGUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">多孔質亞氧化鈦中，微晶直徑為60 nm以上，孔徑超過2 nm且小於50 nm的中孔的容積相對於總細孔容積的比例為70體積%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1202" publication-number="202612402"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612402.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612402</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122429</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>第１積層結構體、第２積層結構體、及印刷配線板之製造方法</chinese-title>  
        <english-title>FIRST LAMINATED STRUCTURE, SECOND LAMINATED STRUCTURE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H05K1/09</main-classification>  
        <further-classification edition="200601120251205B">H05K3/10</further-classification>  
        <further-classification edition="200601120251205B">H05K1/03</further-classification>  
        <further-classification edition="200601120251205B">H05K3/38</further-classification>  
        <further-classification edition="201901120251205B">B32B7/025</further-classification>  
        <further-classification edition="200601120251205B">B32B38/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商太陽控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斧田遥夏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONODA, HARUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤大輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川浩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萩原宏幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGIWARA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIZUKA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山藤征矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAFUJI, SEIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村川昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAWA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>冨士川亘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKAWA, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之第2積層結構體含有支持體、配置於上述支持體上之至少1層樹脂層、及配置於上述樹脂層上之金屬層，上述金屬層及上述樹脂層中之至少任1層為藉由剝離力降低處理而剝離力降低之層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The second laminated structure comprises a support, at least one resin layer disposed on the support, and a metal layer disposed on the resin layer, and at least one of the metal layer and the resin layer is a layer where peel strength is reduced by a peel strength reduction treatment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第1積層結構體</p>  
        <p type="p">11:臨時基材</p>  
        <p type="p">12:金屬層</p>  
        <p type="p">13:樹脂層</p>  
        <p type="p">14:支持體</p>  
        <p type="p">20:第2積層結構體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1203" publication-number="202611649"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611649.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611649</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122445</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動扭矩驅動器解決方案</chinese-title>  
        <english-title>AUTOMATED TORQUE DRIVER SOLUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G05B19/409</main-classification>  
        <further-classification edition="200601120251201B">G05B19/4097</further-classification>  
        <further-classification edition="200601120251201B">B25J9/18</further-classification>  
        <further-classification edition="200601120251201B">H01L21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡森　史班舍格戈里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARSON, SPENCER GREGORY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福賀　維勒莉羅密歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOOHEY, VALERIE ROMERO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班悠明　艾堤夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAYOUMI, ATEF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜哈曼　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOHRMAN, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布思多　羅南迪森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUSTOS, RONALD DIZON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛夏　馬力歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARCIA, MARIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芙方那　阿布多哈金迪巴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOFANA, ABDUL-HAKIM DEMBA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BF</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法可包括由計算系統接收扭矩計畫，該計畫指示緊固件圖案。該方法可包括由計算系統至少部分地基於該扭矩計畫確定半導體製造部件的複數個緊固件中的每個緊固件的相應位置。該方法可包括由計算系統至少部分地基於該扭矩計畫確定與複數個緊固件中的每個緊固件相關聯的預定扭矩。該方法可包括由計算系統使第一機器人臂平移，使得第一驅動器的夾頭尖端與複數個緊固件中的一或多個緊固件接合。該方法可包括由計算系統使第一驅動器旋轉該第一驅動器的夾頭，使得複數個緊固件中的緊固件被緊固至預定扭矩。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method may include receiving, by a computing system, a torque plan indicating a fastener pattern. The method may include determining, by the computing system and based at least in part on the torque plan, a respective position of each of a plurality of fasteners of the semiconductor manufacturing component. The method may include determining, by the computing system and based at least in part on the torque plan, a predetermined torque associated with each of the plurality of fasteners. The method may include causing, by the computing system, a first robotic arm to translate such that a bit tip of a first driver engages with one or more fasteners of the plurality of fasteners. The method may include causing, by the computing system, the first driver to rotate a bit of the first driver such that a fastener of the plurality of fasteners is tightened to a predetermined torque.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102a:機器人臂</p>  
        <p type="p">102b:機器人臂</p>  
        <p type="p">104a:工具頭</p>  
        <p type="p">104b:工具頭</p>  
        <p type="p">106a:驅動器</p>  
        <p type="p">106b:驅動器</p>  
        <p type="p">106c:驅動器</p>  
        <p type="p">106d:驅動器</p>  
        <p type="p">108a:夾頭</p>  
        <p type="p">108d:夾頭</p>  
        <p type="p">110b:夾頭尖端</p>  
        <p type="p">110d:夾頭尖端</p>  
        <p type="p">112:平臺</p>  
        <p type="p">114:氣體面板</p>  
        <p type="p">120:計算系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1204" publication-number="202611248"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611248.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611248</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122458</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>暫時固定用組成物及晶圓之製造方法</chinese-title>  
        <english-title>TEMPORARY FIXING COMPOSITION AND METHOD FOR MANUFACTURING WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09J11/06</main-classification>  
        <further-classification edition="200601120251201B">C09J163/10</further-classification>  
        <further-classification edition="200601120251201B">C09J175/16</further-classification>  
        <further-classification edition="200601120251201B">C09J4/06</further-classification>  
        <further-classification edition="201801120251201B">C09J7/20</further-classification>  
        <further-classification edition="200601120251201B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋佑輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松前佑弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMAE, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷川　星野貴子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGAWA　HOSHINO, TAKAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗村啓之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURIMURA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種暫時固定用組成物，其包含含有（甲基）丙烯酸酯化合物的聚合性成分（A）、光自由基聚合起始劑（B）及紫外線吸收劑（C），藉由特定方法測得之上述暫時固定用組成物的拉伸斷裂應力為10MPa以上，藉由特定方法測得之上述暫時固定用組成物的拉伸斷裂伸長率為5.0%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a temporary fixing composition comprising a polymerizable component (A) including a (meth)acrylate compound, a photoradical polymerization initiator (B), and an ultraviolet absorber (C), wherein the tensile breaking stress of said temporary fixing composition, as measured by a specified method, is 10 MPa or more, and the tensile elongation at break of said temporary fixing composition, as measured by a specified method, is 5.0% or more.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1205" publication-number="202611012"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611012.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611012</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122578</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著劑、黏著劑組成物及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C323/12</main-classification>  
        <further-classification edition="200601120251201B">C08F20/38</further-classification>  
        <further-classification edition="200601120251201B">C09J4/02</further-classification>  
        <further-classification edition="200601120251201B">C09J11/06</further-classification>  
        <further-classification edition="201801120251201B">C09J7/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塚田裕以智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKADA, YUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米田周平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEDA, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之黏著劑具有由下式(1)所示化合物衍生之構造單位。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="241px" width="581px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，R&lt;sub&gt;1&lt;/sub&gt;表示芳香族烴基或芳香脂肪族烴基；R&lt;sub&gt;2&lt;/sub&gt;彼此為相同或相異，表示氫原子或甲基；R&lt;sub&gt;3&lt;/sub&gt;表示氫原子或甲基；m表示1以上之整數；n表示1以上之整數；X表示硫原子或氧原子)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1206" publication-number="202610650"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610650.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610650</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122593</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於增強鎮靜之咪達唑侖及氯胺酮</chinese-title>  
        <english-title>MIDAZOLAM AND KETAMINE FOR ENHANCED SEDATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/5513</main-classification>  
        <further-classification edition="200601120251201B">A61K31/4188</further-classification>  
        <further-classification edition="200601120251201B">A61K31/135</further-classification>  
        <further-classification edition="200601120251201B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商謬特製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MELT PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪拉哈　賴瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DILLAHA, LARRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供包含咪達唑侖及氯胺酮之醫藥組合物、及使用投與此類組合物誘導個體中之鎮靜(例如，手術鎮靜)之方法，該等組合物視情況包括第三類別之醫藥活性化合物。組合物可呈舌下或口頰形式，或併入至媒劑中以延長釋放。本文亦描述用於製造該等組合物及使用其用於麻醉應用之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are pharmaceutical compositions comprising midazolam and ketamine, and methods of inducing sedation (e.g., procedural sedation) in a subject using administration of such compositions, the compositions optionally including a pharmaceutically active compound of a third class. Compositions may be in sublingual or buccal form, or incorporated into vehicles for extended release. Methods for fabricating the compositions and using them for anesthesiological applications are also described.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1207" publication-number="202611451"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611451.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611451</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122615</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱管理流體的現場回收及再生</chinese-title>  
        <english-title>ON-SITE RECOVERY AND RECLAMATION OF THERMAL MANAGEMENT FLUIDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">F25B45/00</main-classification>  
        <further-classification edition="202401120251204B">G06Q10/08</further-classification>  
        <further-classification edition="200601120251204B">F25J3/00</further-classification>  
        <further-classification edition="200601120251204B">B01D53/00</further-classification>  
        <further-classification edition="200601120251204B">C09K5/00</further-classification>  
        <further-classification edition="200601120251204B">G01N33/00</further-classification>  
        <further-classification edition="202201320251204B">B09B101/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科慕ＦＣ有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科班　瑪麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAN, MARY E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭　晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯塔西奧　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STASIO, ANTHONY F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金旼珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實例實施例揭示一種方法，其包括回應於接收與包含熱管理流體的熱系統相關聯之請求；至少部分地基於該熱管理流體的組成來選擇第一工具套件、第二工具套件、第三工具套件、及其任何組合中之一者；將所選擇之第一工具套件、第二工具套件、第三工具套件、或其任何組合遞送至遠端位置；及在該遠端位置處處理待重構為經回收或經再循環之熱管理流體的該熱管理流體。該第一工具套件含有複數個第一項目，該第二工具套件含有複數個第二項目，且該第三工具套件含有複數個第三項目。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Example embodiments disclose a method including in response to receiving a request associated with a thermal system containing a thermal management fluid; selecting one of a first tool kit, a second tool kit, a third tool kit, and any combination thereof, based at least in part in a composition of the thermal management fluid; delivering the selected first tool kit, second tool kit, third tool kit or any combination thereof to a remote location; and processing, at the remote location, the thermal management fluid to be constituted as recovered or recycled thermal management fluid. The first tool kit contains a plurality of first items, the second tool kit contains a plurality of second items and the third tool kit contains a plurality of third items.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:用於冷媒的遞送以及回收、再循環、及再生服務之實例程序</p>  
        <p type="p">5:客戶撥打服務電話</p>  
        <p type="p">6:工具套件A</p>  
        <p type="p">7:工具套件B</p>  
        <p type="p">8:技術人員進行必要的維修以再循環或回收用過的冷媒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1208" publication-number="202611547"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611547.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611547</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122622</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學構件之處理方法及光學構件組合件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">G02B1/04</main-classification>  
        <further-classification edition="200601120251211B">B29C35/02</further-classification>  
        <further-classification edition="200601120251211B">G02B5/30</further-classification>  
        <further-classification edition="200601120251211B">G02F1/1335</further-classification>  
        <further-classification edition="200601120251211B">G02B27/01</further-classification>  
        <further-classification edition="201801120251211B">H04N13/332</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德岡咲美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUOKA, SAKIMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北野康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITANO, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光學構件，能夠提高VR護目鏡之視認性。光學構件之處理方法包括對光學構件進行退火，降低光學構件之表面粗糙度Sa；退火溫度相對於光學構件所包含之樹脂薄膜之玻璃轉移溫度Tg(℃)，設定在Tg－30(℃)～Tg＋20(℃)之範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示系統</p>  
        <p type="p">12:顯示元件</p>  
        <p type="p">12a:顯示面</p>  
        <p type="p">14:反射型偏光構件</p>  
        <p type="p">16:第一透鏡部</p>  
        <p type="p">18:半反射鏡</p>  
        <p type="p">20:第一λ/4構件</p>  
        <p type="p">22:第二λ/4構件</p>  
        <p type="p">24:第二透鏡部</p>  
        <p type="p">26:使用者之眼睛</p>  
        <p type="p">28:吸收型偏光構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1209" publication-number="202611009"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611009.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611009</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋶鹽型單體、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>SULFONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C309/30</main-classification>  
        <further-classification edition="200601120251201B">C07C309/42</further-classification>  
        <further-classification edition="200601120251201B">C07C309/43</further-classification>  
        <further-classification edition="200601120251201B">C07C309/73</further-classification>  
        <further-classification edition="200601120251201B">C07C381/00</further-classification>  
        <further-classification edition="200601120251201B">C07D327/08</further-classification>  
        <further-classification edition="200601120251201B">C07D333/54</further-classification>  
        <further-classification edition="200601120251201B">C07D333/76</further-classification>  
        <further-classification edition="200601120251201B">C09K3/00</further-classification>  
        <further-classification edition="200601120251201B">C08F212/14</further-classification>  
        <further-classification edition="200601120251201B">C08F212/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郡大祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供在使用高能射線的微影中之溶劑溶解性優異、高感度、高對比度且EL、LWR、CDU、DOF等微影性能優異的化學增幅阻劑組成物中使用的鋶鹽型單體、包含來自該鋶鹽型單體的重複單元的聚合物、包含該聚合物的化學增幅阻劑組成物、及使用該化學增幅阻劑組成物的圖案形成方法。 &lt;br/&gt;下述式(A)所示的鋶鹽型單體。 &lt;br/&gt;&lt;img align="absmiddle" height="124px" width="433px" file="ed10441.JPG" alt="ed10441.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sulfonium salt monomer having the formula (A). &lt;br/&gt;&lt;img align="absmiddle" height="120px" width="432px" file="ed10442.JPG" alt="ed10442.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1210" publication-number="202611476"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611476.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611476</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於校正光學元件的測量的方法</chinese-title>  
        <english-title>METHOD FOR CORRECTING MEASUREMENTS OF AN OPTICAL ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">G01B9/02055</main-classification>  
        <further-classification edition="200601120251201B">G01B11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商法格爾光學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOGALE OPTIQUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>列格羅斯　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEGROS, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩蒂格朗　希爾萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETITGRAND, SYLVAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆格　布魯諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUONG, BRUNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於界面之視位置測量的失真校正方法（100），該方法（100）由包含干涉測量構件及低相干光源之測量系統（1）實施，該測量系統配置以產生由待測量物件反射之所謂測量光束與所謂參考光束之間的干涉產生的干涉信號，該方法包含以下步驟： &lt;br/&gt;-    為該參考光束及/或該測量光束提供（102）至少一個界面位置校正函數，該至少一個界面位置校正函數配置以使視（apparent）位置與實際位置相關，該或各校正函數配置以校正該測量光束及/或該參考光束經歷之光失真； &lt;br/&gt;-    測量（106）該界面之位置以從干涉信號獲得該界面之原始所測量位置；及 &lt;br/&gt;-    將該或各位置校正函數應用（108）於該原始所測量位置以獲得該界面之實際所測量位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a distortion correction method (100) for an apparent position measurement of an interface, the method (100) being implemented by a measurement system (1) comprising interferometric measuring means and a low-coherence light source, configured to produce an interference signal resulting from interference between a so-called measuring beam reflected by an object to be measured and a so-called reference beam, the method comprising the following steps: &lt;br/&gt;- providing (102) at least one interface position correction function, for the reference beam and/or the measuring beam, configured to relate an apparent position to an actual position, the or each correction function being configured to correct optical distortions undergone by the measuring beam and/or the reference beam; &lt;br/&gt;- measuring (106) a position of the interface to obtain a raw measured position of the interface from an interference signal; and &lt;br/&gt;- applying (108) the or each position correction function to the raw measured position to obtain an actual measured position of the interface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102:校準階段</p>  
        <p type="p">103:步驟</p>  
        <p type="p">104:步驟</p>  
        <p type="p">106:步驟</p>  
        <p type="p">108:步驟</p>  
        <p type="p">110:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1211" publication-number="202610896"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610896.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610896</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122667</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水上交通工具之鰭舵及舵系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">B63H25/38</main-classification>  
        <further-classification edition="200601120251205B">B63H25/08</further-classification>  
        <further-classification edition="200601120251205B">B63B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商貝克海洋系統有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BECKER MARINE SYSTEMS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫爾曼　亨寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUHLMANN, HENNING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為提供一種用於水上交通工具、特別是船舶之舵，該舵具有鰭片因而具有良好的機動性，且同時可設計成低強度的，使得該舵可以較低成本及經過改善的流體特性製成，本發明提出一種舵（100），該舵具有舵葉（10），其中該舵（100）具有可樞轉地佈置在該舵葉（10）上之鰭片（11），其中該鰭片（11）之最大高度（H2）小於該舵葉（10）之最大高度（Hl），且其中就該鰭片（11）之縱向延伸（L）而言，該鰭片（11）平行於該舵（100）之舵桿（22），其中該舵葉具有上舵葉段（20）及下舵葉段（21）， &lt;br/&gt;其特徵在於，該上舵葉段（20）及該下舵葉段（21）被設計成具有不同的浮力係數，其中該上舵葉段（20）之浮力係數大於該下舵葉段（21）之浮力係數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:舵葉</p>  
        <p type="p">11:鰭片</p>  
        <p type="p">12:舵葉之前緣</p>  
        <p type="p">13:舵葉之後緣</p>  
        <p type="p">13a，13b，13c:後緣之區段</p>  
        <p type="p">14:舵葉之下緣</p>  
        <p type="p">15:舵桿之上緣</p>  
        <p type="p">16:鰭片之下緣</p>  
        <p type="p">17:鰭片之上緣</p>  
        <p type="p">18:連接裝置</p>  
        <p type="p">19:鉸鏈系統</p>  
        <p type="p">20:上舵葉段</p>  
        <p type="p">21:下舵葉段</p>  
        <p type="p">22:舵桿</p>  
        <p type="p">25:鰭片之後緣</p>  
        <p type="p">26:螺旋槳軸線</p>  
        <p type="p">100:舵</p>  
        <p type="p">B1:舵葉之最大寬度</p>  
        <p type="p">B2:鰭片之最大寬度</p>  
        <p type="p">H1:舵葉之最大高度</p>  
        <p type="p">H2:鰭片之最大高度</p>  
        <p type="p">L:縱向延伸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1212" publication-number="202611326"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611326.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611326</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濺鍍裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">C23C16/34</main-classification>  
        <further-classification edition="200601120251205B">C23C14/04</further-classification>  
        <further-classification edition="200601120251205B">C23C14/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛發科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ULVAC, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北沢僚也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAZAWA, RYOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高木大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供一種濺鍍裝置(SM)，其在經由遮罩在基板上進行成膜時，能夠抑制基板的局部性溫度上升。 &lt;br/&gt;　　[解決手段] 具備具有靶材(2)和基板載台(St)的真空腔室(1)。基板載台(St)具有設置基板的載台本體(6)和使其上下移動的移動手段(62)，當載台本體向上移動到基板處理位置時，具備限制對基板的成膜範圍的遮罩單元(Um)。遮罩單元具備：處於電浮動狀態的第一遮罩體(7₁)；及第二遮罩體(7₂)，其以在上下方向具有間隙的方式覆蓋第一遮罩體的上表面部分。在載台本體的上表面上設置有位於基板的周圍外方並向上方豎立的第一突條壁(69)，在第一遮罩體的下表面上設置有接納第一突條壁的第一接納凹部(72)，在基板處理位置處在基板的周圍外方形成第一突條壁與第一接納凹部以非接觸的方式嚙合的迷宮結構的間隙(Gp1)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:真空腔室</p>  
        <p type="p">1a:成膜空間</p>  
        <p type="p">2:靶材</p>  
        <p type="p">3:磁鐵單元</p>  
        <p type="p">4:屏蔽板</p>  
        <p type="p">5:驅動手段</p>  
        <p type="p">6:載台本體</p>  
        <p type="p">6a:環狀的支撐板</p>  
        <p type="p">7&lt;sub&gt;1&lt;/sub&gt;:第一遮罩體</p>  
        <p type="p">7&lt;sub&gt;2&lt;/sub&gt;:第二遮罩體</p>  
        <p type="p">11:排氣口</p>  
        <p type="p">12:排氣管</p>  
        <p type="p">13:真空泵</p>  
        <p type="p">14:氣體導入口</p>  
        <p type="p">15:質量流量控制器</p>  
        <p type="p">16:氣體導入管</p>  
        <p type="p">17:支撐框(支撐部)</p>  
        <p type="p">17a:凸緣部</p>  
        <p type="p">17c:排氣路徑</p>  
        <p type="p">18:基板搬出口</p>  
        <p type="p">21:濺鍍面</p>  
        <p type="p">22:背板</p>  
        <p type="p">23:絕緣板</p>  
        <p type="p">24:濺鍍電源</p>  
        <p type="p">24a:輸出</p>  
        <p type="p">31:支撐板(軛)</p>  
        <p type="p">32:中央磁鐵</p>  
        <p type="p">33:周邊磁鐵</p>  
        <p type="p">41:第一壁部(上筒狀壁部構成要素)</p>  
        <p type="p">42:第二壁部(上筒狀壁部構成要素)</p>  
        <p type="p">51:驅動軸</p>  
        <p type="p">61:驅動軸</p>  
        <p type="p">62:驅動手段</p>  
        <p type="p">63:貫通孔</p>  
        <p type="p">64:支撐桿</p>  
        <p type="p">64a:大徑部</p>  
        <p type="p">64b:小徑部</p>  
        <p type="p">64c:帽體</p>  
        <p type="p">65:導引構件</p>  
        <p type="p">65a:插通孔</p>  
        <p type="p">65b:筒狀構件</p>  
        <p type="p">65c:筒狀的突片部</p>  
        <p type="p">66:導引滾輪</p>  
        <p type="p">67:支撐板</p>  
        <p type="p">68:限制台</p>  
        <p type="p">69:第一突條壁</p>  
        <p type="p">71:前端部分</p>  
        <p type="p">75:貫通孔</p>  
        <p type="p">76:下筒狀壁部</p>  
        <p type="p">83:定位銷</p>  
        <p type="p">84:定位孔</p>  
        <p type="p">85:安裝孔</p>  
        <p type="p">86:固定銷</p>  
        <p type="p">87b:副收容孔</p>  
        <p type="p">Gp3:迷宮結構的間隙</p>  
        <p type="p">Uc:陰極單元</p>  
        <p type="p">Sg:基板</p>  
        <p type="p">SM:磁控濺鍍裝置(濺鍍裝置)</p>  
        <p type="p">St:基板載台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1213" publication-number="202611318"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611318.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611318</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122676</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濺鍍裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251029B">C23C14/56</main-classification>  
        <further-classification edition="200601120251029B">C23C16/34</further-classification>  
        <further-classification edition="200601120251029B">C23C14/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛發科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ULVAC, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北沢僚也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAZAWA, RYOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高木大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供可實現裝置小型化，且能夠有效抑制濺鍍粒子繞過的濺鍍裝置(SM)。 &lt;br/&gt;　　[解決手段]具備：具有靶材(2)和基板載台(St)的真空腔室(1)。基板載台(St)具有：設置基板的載台本體(6)和使其上下移動的移動手段(62)，當載台本體向上移動到基板處理位置時，具備限制對基板的成膜範圍的遮罩體(7₁)。在靶材的周圍配置處於接地電位的屏蔽板(4)，在屏蔽板的下表面分別以與靶材中心的距離不同方式設置2個上筒狀壁部(41、42)。在遮罩體的上表面設置下筒狀壁部(76)，其上端部侵入兩上筒狀壁相互之間的間隙，透過上筒狀壁部與下筒狀壁部在靶材以及該靶材與基板之間的成膜空間的周圍外方形成迷宮結構的間隙(Gp2)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:真空腔室</p>  
        <p type="p">1a:成膜空間</p>  
        <p type="p">2:靶材</p>  
        <p type="p">3:磁鐵單元</p>  
        <p type="p">4:屏蔽板</p>  
        <p type="p">5:驅動手段</p>  
        <p type="p">6:載台本體</p>  
        <p type="p">6a:框狀的支撐板</p>  
        <p type="p">7&lt;sub&gt;1&lt;/sub&gt;:第一遮罩體</p>  
        <p type="p">7&lt;sub&gt;2&lt;/sub&gt;:第二遮罩體</p>  
        <p type="p">11:排氣口</p>  
        <p type="p">12:排氣管</p>  
        <p type="p">13:真空泵</p>  
        <p type="p">14:氣體導入口</p>  
        <p type="p">15:質量流量控制器</p>  
        <p type="p">16:氣體導入管</p>  
        <p type="p">17:支撐框(支撐部)</p>  
        <p type="p">17a:凸緣部</p>  
        <p type="p">17c:排氣路徑</p>  
        <p type="p">18:基板搬出口</p>  
        <p type="p">21:濺鍍面</p>  
        <p type="p">22:背板</p>  
        <p type="p">23:絕緣板</p>  
        <p type="p">24:濺鍍電源</p>  
        <p type="p">24a:輸出</p>  
        <p type="p">31:支撐板(軛)</p>  
        <p type="p">32:中央磁鐵</p>  
        <p type="p">33:周邊磁鐵</p>  
        <p type="p">41:第一壁部(上筒狀壁部構成要素)</p>  
        <p type="p">42:第二壁部(上筒狀壁部構成要素)</p>  
        <p type="p">51:驅動軸</p>  
        <p type="p">61:驅動軸</p>  
        <p type="p">62:驅動手段</p>  
        <p type="p">63:貫通孔</p>  
        <p type="p">64:支撐桿</p>  
        <p type="p">64a:大徑部</p>  
        <p type="p">64b:小徑部</p>  
        <p type="p">64c:帽體</p>  
        <p type="p">65:導引構件</p>  
        <p type="p">65a:插通孔</p>  
        <p type="p">65b:筒狀構件</p>  
        <p type="p">65c:筒狀的突片部</p>  
        <p type="p">66:導引滾輪</p>  
        <p type="p">67:支撐板</p>  
        <p type="p">68:限制台</p>  
        <p type="p">69:第一突條壁</p>  
        <p type="p">71:前端部分</p>  
        <p type="p">75:貫通孔</p>  
        <p type="p">76:下筒狀壁部</p>  
        <p type="p">83:定位銷</p>  
        <p type="p">84:定位孔</p>  
        <p type="p">85:安裝孔</p>  
        <p type="p">86:固定銷</p>  
        <p type="p">87b:副收容孔</p>  
        <p type="p">Gp3:迷宮結構的間隙</p>  
        <p type="p">Sg:基板</p>  
        <p type="p">SM:磁控濺鍍裝置(濺鍍裝置)</p>  
        <p type="p">St:基板載台</p>  
        <p type="p">Uc:陰極單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1214" publication-number="202610679"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610679.zip"/>
    </tif-files>
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      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610679</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122680</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>呼吸道融合病毒mRNA疫苗及其製備方法與應用</chinese-title>  
        <english-title>RESPIRATORY SYNCYTIAL VIRUS MRNA VACCINE, AND PREPARATION METHOD THEREFOR AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">A61K39/155</main-classification>  
        <further-classification edition="200601120251203B">C07K14/135</further-classification>  
        <further-classification edition="200601120251203B">C07K16/10</further-classification>  
        <further-classification edition="200601120251203B">A61K31/7088</further-classification>  
        <further-classification edition="200601120251203B">A61P31/12</further-classification>  
        <further-classification edition="200601120251203B">A61P31/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杭州天龍藥業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU TIANLONG PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋更申</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, GENGSHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董開</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪王</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周玉婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YUTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAI, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郎曉威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, XIAOWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晉瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JINYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁麗敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, LIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王環宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUANYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明屬於mRNA疫苗技術領域，尤其涉及呼吸道融合病毒RSV疫苗及其製備方法和應用。本發明提供的RSV疫苗，含編碼RSV F蛋白或其變體的RNA。所述疫苗能預防RSV感染及其併發症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure belongs to the technical field of mRNA vaccines, and particularly relates to a respiratory syncytial virus (RSV) vaccine, and a preparation method therefor and use thereof. The vaccine provided by the present disclosure comprises RNA encoding an RSV F protein or a variant thereof. The vaccine can prevent an RSV infection and complications thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1215" publication-number="202611623"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611623.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611623</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拍攝裝置以及基板處理裝置</chinese-title>  
        <english-title>IMAGING DEVICE AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251201B">G03B19/22</main-classification>  
        <further-classification edition="202301120251201B">H04N23/667</further-classification>  
        <further-classification edition="202301120251201B">H04N23/56</further-classification>  
        <further-classification edition="200601120251201B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時末尚悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKISUE, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本悟史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村藤和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, FUJIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能即時地檢測對象物的狀態的變化並因應需要進行詳細的觀察之技術。拍攝裝置60係具備分配部62、事件攝影機63以及高速攝影機64。分配部62係將來自對象物的觀察光L分配成第一觀察光L1以及第二觀察光L2。事件攝影機63係藉由第一觀察光L1攝影對象物。高速攝影機64係藉由第二觀察光L2攝影對象物。藉此，能藉由事件攝影機63以及高速攝影機64攝影對象物的同一個範圍。因此，能藉由事件攝影機63即時地檢測對象物的狀態的變化並能因應需要進行高速攝影機64所為的詳細的觀察。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:拍攝裝置</p>  
        <p type="p">61:反射鏡</p>  
        <p type="p">62:分配部</p>  
        <p type="p">63:事件攝影機</p>  
        <p type="p">64:高速攝影機</p>  
        <p type="p">65:照明部</p>  
        <p type="p">621:第一分配器</p>  
        <p type="p">622:第二分配器</p>  
        <p type="p">D1:第一攝影資料</p>  
        <p type="p">D2:第二攝影資料</p>  
        <p type="p">L:觀察光</p>  
        <p type="p">L1:第一觀察光</p>  
        <p type="p">L2:第二觀察光</p>  
        <p type="p">L3:中間光</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1216" publication-number="202610971"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610971.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610971</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122775</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含1,3,3,3-四氟丙烯的組成物、其製備方法及其用途</chinese-title>  
        <english-title>COMPOSITIONS COMPRISING 1,3,3,3-TETRAFLUOROPROPENE, METHODS OF MAKING SAME, AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C17/20</main-classification>  
        <further-classification edition="200601120251201B">C07C17/25</further-classification>  
        <further-classification edition="200601120251201B">C07C17/278</further-classification>  
        <further-classification edition="200601120251201B">C07C19/01</further-classification>  
        <further-classification edition="200601120251201B">C07C21/18</further-classification>  
        <further-classification edition="200601120251201B">C08J9/14</further-classification>  
        <further-classification edition="200601120251201B">C09K3/30</further-classification>  
        <further-classification edition="200601120251201B">C09K5/04</further-classification>  
        <further-classification edition="200601120251201B">C09K13/00</further-classification>  
        <further-classification edition="202201120251201B">C09K23/00</further-classification>  
        <further-classification edition="200601120251201B">C10M131/04</further-classification>  
        <further-classification edition="200601120251201B">F25B45/00</further-classification>  
        <further-classification edition="200601120251201B">F28C3/08</further-classification>  
        <further-classification edition="200601320251201B">C10N40/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科慕ＦＣ有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭　晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>修格斯　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUGHES, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布拉德利　麥克　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRADLEY, MICHAEL A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西蒙尼　盧克　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMONI, LUKE DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所揭示者係氟烯烴組成物、生產該等組成物之方法、使用該等組成物之方法及系統、以及包含HFO-1234ze組成物的系統。本發明之組成物可用作空調及冷凍系統中的冷媒，且亦可用作發泡劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are fluoroolefin compositions, methods of producing the same, methods and systems using the same, and systems containing the HFO-1234ze compositions. The inventive compositions are useful as refrigerants in air conditioning and refrigeration systems, and also as blowing agents.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1217" publication-number="202612390"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612390.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612390</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122779</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>渲染照明效果的方法及裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS OF RENDERING A LIGHTING EFFECT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251201B">H05B47/175</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商双翼公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WYVRN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維佐利　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEZZOLI, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　志雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHEE HIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種渲染照明效果的方法和裝置。為了實施該目的，接收表示一照明裝置組(211至214、221至224、231至233)中至少一個照明裝置位置的第一資料，該位置根據包括該組照明裝置的環境(20)的層級式空間細分進行定義。根據第一資料和表示照明效果的第二資料，確定所述至少一個照明裝置的照明控制參數。所述照明控制參數被傳送至所述至少一個照明裝置以渲染照明效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided methods and apparatus of rendering a lighting effect. To reach that aim, first data representative of position of at least a lighting device of a set of lighting devices (211 to 214, 221 to 224, 231 to 233) is received, position being defined according to a hierarchical spatial subdivision of an environment (20) comprising the set of lighting devices. Lighting control parameters are determined for the at least a lighting device according to the first data and according to second data representative of the lighting effect. The lighting control parameters are transmitted to the at least a lighting device for the rendering of the lighting effect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2、21、22、23:空間單元</p>  
        <p type="p">20:環境</p>  
        <p type="p">211、212、213、214、221、222、223、224、231、232、233:照明裝置</p>  
        <p type="p">O&lt;sub&gt;2&lt;/sub&gt;、O&lt;sub&gt;21&lt;/sub&gt;、O&lt;sub&gt;22&lt;/sub&gt;、O&lt;sub&gt;23&lt;/sub&gt;:參考點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1218" publication-number="202611956"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611956.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611956</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122794</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電容器及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251201B">H01G11/30</main-classification>  
        <further-classification edition="201301120251201B">H01G11/40</further-classification>  
        <further-classification edition="201301120251201B">H01G11/06</further-classification>  
        <further-classification edition="201301120251201B">H01G11/52</further-classification>  
        <further-classification edition="201301120251201B">H01G11/86</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本特殊陶業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITERRA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本肯尼詩和哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, KENNETH KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松浦廣幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUURA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能減低矽化合物的破裂、電極的剝離之電容器(10)及其製造方法。電容器係包含：包含活性物質的正極合材層(17)、包含含矽物質的負極合材層(13)、及隔離正極合材層與負極合材層的隔板(14)，且將正極合材層的容量(mAh/cm&lt;sup&gt;2&lt;/sup&gt;)除以負極合材層的容量(mAh/cm&lt;sup&gt;2&lt;/sup&gt;)而得之值係小於負極合材層中矽所佔的質量分率(%)乘以0.87而得之值。電容器之製造方法係製作正極合材層和負極合材層，以使將正極合材層的容量除以負極合材層的容量而得之值小於負極合材層中矽所佔的質量分率乘以0.87而得之值，並利用隔板來隔離正極合材層與負極合材層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電容器</p>  
        <p type="p">11:負極</p>  
        <p type="p">12:集電層</p>  
        <p type="p">13:負極合材層</p>  
        <p type="p">14:隔板</p>  
        <p type="p">15:正極</p>  
        <p type="p">16:集電層</p>  
        <p type="p">17:正極合材層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1219" publication-number="202612091"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612091.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612091</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">H01L21/68</main-classification>  
        <further-classification edition="200601120251008B">H01L21/67</further-classification>  
        <further-classification edition="200601120251008B">G05B19/402</further-classification>  
        <further-classification edition="200601120251008B">B08B3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒲裕充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABA, HIROMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種可降低將基板進行位置規制之銷對處理造成之影響之技術。 &lt;br/&gt;於基板處理裝置100中，設置於基座板11之複數個位置規制銷13包含靜止銷13a及滑動銷13b。靜止銷13a於其配置於規制位置P2之狀態下，抵接於基板9之周緣部93，將基板9位置規制於規定在基座板11之上方之正規位置Q，且以不相對於基座板11相對旋轉之方式進行旋轉規制，滑動銷13b於其配置於規制位置P2之狀態下，配置於相對於配置在正規位置Q之基板9之周緣部93設置間隙G且對向之位置，將基板9容許其相對於基座板11相對旋轉、且以就基板9之徑向不超出容許範圍地自正規位置Q變位之方式進行位置規制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">9:基板</p>  
        <p type="p">11:基座板</p>  
        <p type="p">13a:靜止銷</p>  
        <p type="p">13b:滑動銷</p>  
        <p type="p">62a,62b:突出部</p>  
        <p type="p">620a:靜止規制面(規制面)</p>  
        <p type="p">620b:滑動規制面</p>  
        <p type="p">G:間隙</p>  
        <p type="p">J1:軸線(旋轉軸線)</p>  
        <p type="p">M2:滑動規制狀態/狀態</p>  
        <p type="p">P1:解除位置(位置)</p>  
        <p type="p">P2:規制位置(位置)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1220" publication-number="202610773"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610773.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610773</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122816</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓加工用帶及晶圓加工方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251201B">B24B37/34</main-classification>  
        <further-classification edition="201201120251201B">B24B37/32</further-classification>  
        <further-classification edition="201901120251201B">B32B7/027</further-classification>  
        <further-classification edition="201901120251201B">B32B7/06</further-classification>  
        <further-classification edition="200601120251201B">B32B27/30</further-classification>  
        <further-classification edition="200601120251201B">B32B27/38</further-classification>  
        <further-classification edition="200601120251201B">H01L21/304</further-classification>  
        <further-classification edition="200601120251201B">H01L21/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金田一修平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINDAICHI, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>升田優亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之晶圓加工用帶具有：追隨層、及積層於上述追隨層之背面之耐熱層，且上述耐熱層為B階段片材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶圓加工用帶</p>  
        <p type="p">11:離型層</p>  
        <p type="p">11a:表面</p>  
        <p type="p">12:追隨層</p>  
        <p type="p">12a:表面</p>  
        <p type="p">12b:背面</p>  
        <p type="p">13:耐熱層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1221" publication-number="202610750"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610750.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610750</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122855</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射加工裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251201B">B23K26/046</main-classification>  
        <further-classification edition="201401120251201B">B23K26/082</further-classification>  
        <further-classification edition="202201120251201B">G01J5/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之雷射加工裝置具備：光源，其發出雷射光；光纖，其使上述雷射光、及加工對象物中被照射上述雷射光之照射點所發出之熱輻射光傳播；監視部，其連接有上述光纖，使來自上述光源之上述雷射光入射至上述光纖，且接收上述光纖中傳播之上述熱輻射光之入射，檢測該熱輻射光；及光掃描部，其具有反射自上述光纖出射之上述雷射光、及上述照射點所發出之上述熱輻射光之反射面，藉由使上述反射面之角度變動，而對上述加工對象物掃描上述雷射光，且使上述熱輻射光入射至上述光纖；且上述反射面由金屬材料形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雷射加工裝置</p>  
        <p type="p">2:光源</p>  
        <p type="p">3:第1光纖</p>  
        <p type="p">4:第2光纖(光纖)</p>  
        <p type="p">5:雷射加工頭</p>  
        <p type="p">6:光掃描部</p>  
        <p type="p">7:fθ透鏡</p>  
        <p type="p">10:雷射加工監視器(監視部)</p>  
        <p type="p">L1:雷射光</p>  
        <p type="p">L1a:雷射光</p>  
        <p type="p">L2:熱輻射光</p>  
        <p type="p">S:加工對象物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1222" publication-number="202612318"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612318.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612318</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122869</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對講機系統、第1對講機裝置及第2對講機裝置</chinese-title>  
        <english-title>INTERCOM SYSTEM, FIRST INTERCOM DEVICE AND SECOND INTERCOM DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251201B">H04M1/71</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口剛史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本尚典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, TAKANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑野剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUWANO, GO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諸橋隆治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOROHASHI, TAKAHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之課題在於減少第2對講機裝置之設定之麻煩。對講機系統(1)包含經由對講機配線(L1)相互通訊之複數個對講機裝置。複數個對講機裝置包含第1對講機裝置(11)、及1個以上之第2對講機裝置(12)。第1對講機裝置(11)將自外部記憶終端經由連接部(39)取得之設定資訊自第1通訊部(通訊部(33))經由對講機配線(L1)發送至第2通訊部(通訊部(43)、(53)、(63))。設定部(第2設定部(410)、(510)、(610))基於由第2通訊部取得之設定資訊，進行第2對講機裝置(12)之設定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:對講機系統</p>  
        <p type="p">3:管理母機</p>  
        <p type="p">4:控制裝置</p>  
        <p type="p">5:玄關子機</p>  
        <p type="p">6:住戶母機</p>  
        <p type="p">7:住戶子機</p>  
        <p type="p">11:第1對講機裝置</p>  
        <p type="p">12:第2對講機裝置</p>  
        <p type="p">31,41,51,61:處理部</p>  
        <p type="p">32,42,52,62:記憶部</p>  
        <p type="p">33:通訊部(第1通訊部)</p>  
        <p type="p">34,54,64:操作部</p>  
        <p type="p">35,55:相機</p>  
        <p type="p">36,56,66:顯示部</p>  
        <p type="p">37,57,67:麥克風</p>  
        <p type="p">38,58,68:揚聲器</p>  
        <p type="p">39:連接部</p>  
        <p type="p">43,53,63:通訊部(第2通訊部)</p>  
        <p type="p">310:第1設定部</p>  
        <p type="p">410,510,610:第2設定部(設定部)</p>  
        <p type="p">L1:對講機配線</p>  
        <p type="p">L2:專用線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1223" publication-number="202611682"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611682.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611682</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作業支援系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">G06F3/01</main-classification>  
        <further-classification edition="200601120250701B">G06F3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大木佑哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGI, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤浩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村俊輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TOSHITERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沼田崇志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUMATA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實現更理想的作業支援。作業支援系統在作業者佩戴於頭部的顯示器中對應作業者的視野的畫面上，以與作業對象物重疊對合之方式，作為作業資訊，顯示具有包含作業對象物的三維空間內之對於作業對象物的基準作業的位置及動作的影像資訊。作業支援系統在實施作業者對於作業對象物所致之作業時，取得具有三維空間內之對於作業對象物的作業資訊的位置及動作的第1資訊，且具有具有與三維空間內之作業者的頭部的位置及動作因應之顯示器的位置及動作的第2資訊，然後，基於第1資訊與第2資訊，計算出顯示器的畫面上之對於作業對象物的作業資訊之顯示的位置及動作，在顯示器的畫面中，顯示對於作業對象物的作業資訊時，限制作業資訊的視野內移動速度，使其成為因應基準作業所設定的允許範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">7:手印(AR物件)</p>  
        <p type="p">7A:手印(AR物件)</p>  
        <p type="p">7B:手印(AR物件)</p>  
        <p type="p">500:視野</p>  
        <p type="p">501:移動量</p>  
        <p type="p">502:移動量</p>  
        <p type="p">510:視點</p>  
        <p type="p">521:部分</p>  
        <p type="p">522:部分</p>  
        <p type="p">a1:點</p>  
        <p type="p">a2:點</p>  
        <p type="p">b1:點</p>  
        <p type="p">b2:點</p>  
        <p type="p">D1:深度距離</p>  
        <p type="p">D2:深度距離</p>  
        <p type="p">θ1:角度</p>  
        <p type="p">θ2:角度</p>  
        <p type="p">△X:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1224" publication-number="202612164"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612164.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612164</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122952</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於形成鋰二次電池電極保護膜的組成物、使用其來形成鋰二次電池電極保護膜的方法以及用於鋰二次電池的電極</chinese-title>  
        <english-title>COMPOSITION FOR FORMING ELECTRODE PROTECTIVE FILM FOR LITHIUM SECONDARY BATTERY, METHOD FOR FORMING ELECTRODE PROTECTIVE FILM FOR LITHIUM SECONDARY BATTERY AND ELECTRODE FOR A LITHIUM SECONDARY BATTERY USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250924B">H01M10/0525</main-classification>  
        <further-classification edition="202101120250924B">H01M50/403</further-classification>  
        <further-classification edition="202101120250924B">H01M50/46</further-classification>  
        <further-classification edition="200601120250924B">C10L1/2383</further-classification>  
        <further-classification edition="200601120250924B">C07C403/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>首爾大學校產學協力團</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEOUL NATIONAL UNIVERSITY R&amp;DB FOUNDATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商可隆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLON INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈智敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIM, JI MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元珖彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WON, GWANG BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭映勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, YEONG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林美素</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, MI SO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔宰赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JAE HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍多徑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONG, DA KYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安賢優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, HYUN WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露是有關於一種用於形成保護膜的組成物，所述保護膜能夠保護鋰二次電池的電極的表面以防止樹枝狀晶體生長，且能夠提高電池的壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a composition for forming a protective film capable of protecting a surface of an electrode for a lithium secondary battery to prevent dendrites from growing, and improving a lifetime of a battery.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1225" publication-number="202611003"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611003.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611003</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123014</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子器件之製造方法、及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C309/07</main-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤亮祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎北斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, HOKUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小島雅史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠形成截面形狀為矩形狀之圖案的感光化射線性或感放射線性樹脂組成物。本發明之感光化射線性或感放射線性樹脂組成物包含由式（1）表示的化合物（N）、及樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1226" publication-number="202611089"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611089.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611089</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123036</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含氟聚合物之製造方法</chinese-title>  
        <english-title>METHODS OF PRODUCING FLUORINE-CONTAINING POLYMER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F2/10</main-classification>  
        <further-classification edition="200601120251201B">C08F210/02</further-classification>  
        <further-classification edition="200601120251201B">C08F214/18</further-classification>  
        <further-classification edition="200601120251201B">C08F214/26</further-classification>  
        <further-classification edition="200601120251201B">C08F214/28</further-classification>  
        <further-classification edition="200601120251201B">C08F216/14</further-classification>  
        <further-classification edition="200601120251201B">C08F220/18</further-classification>  
        <further-classification edition="200601120251201B">C08L27/18</further-classification>  
        <further-classification edition="200601120251201B">C08L27/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀圭司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORI, KEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>織岡真理子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIOKA, MARIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴崎浩輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBASAKI, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹內優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEUCHI, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西有里繪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, YURIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種含氟聚合物之製造方法，包含下述步驟：在包含第1含氟聚合物及水性介質之水性分散液中，使包含含氟單體之單體進行聚合，製造與第1含氟聚合物不同之第2含氟聚合物；第1含氟聚合物包含以TFE為主體之第1結構單元與以選自於由HFP及下述式(1)所示化合物所構成群組中之至少1種為主體之第2結構單元，並且前述第1含氟聚合物之Tg為10℃以下，且在DSC測定中，在300℃至50℃之區域之放熱量的合計為10J/g以下；並且，含氟乳化劑之含量為100質量ppm以下。CZ&lt;sub&gt;2&lt;/sub&gt;=CX(CF&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;m&lt;/sub&gt;Y　…(1)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1227" publication-number="202611712"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611712.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611712</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123040</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>不確定性追蹤</chinese-title>  
        <english-title>UNCERTAINTY TRACKING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F9/46</main-classification>  
        <further-classification edition="200601120251201B">G06F17/18</further-classification>  
        <further-classification edition="200601120251201B">G06F7/483</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商西格納洛德有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIGNALOID LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史坦利馬貝爾　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STANLEY-MARBELL, PHILLIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特索索拉斯　瓦西萊奧斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOUTSOURAS, VASILEIOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比爾金　比爾格蘇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BILGIN, BILGESU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露案涉及用於計算分佈的電腦實施方法，包含：&lt;br/&gt;   獲得至少第一分佈變數的第一表示以及第二分佈變數的第二表示；並且&lt;br/&gt;   對第一表示及第二表示執行運算操作，以獲得第三分佈變數的第三表示形式的計算結果，&lt;br/&gt;   其中對第一表示及第二表示執行運算操作為基於，或包括相關性資訊，相關性資訊指示第一表示以及第二表示中至少一者與一或多個相關的分佈變數的相關性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a computer-implemented method for computation on distributions, comprising: &lt;br/&gt; obtaining at least a first representation of a first distributional variable and a second representation of a second distributional variable; and &lt;br/&gt; executing an arithmetic operation on the first representation and the second representation to obtain a computation result in the form of a third representation of a third distributional variable, &lt;br/&gt; wherein executing the arithmetic operation on the first representation and the second representation is based on, or includes, correlation information, which indicates a correlation of at least one of the first representation and the second representation with one or more correlated distributional variables.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1228" publication-number="202610972"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610972.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610972</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123044</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎓鹽型單體、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>ONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C25/18</main-classification>  
        <further-classification edition="200601120251201B">C07C309/42</further-classification>  
        <further-classification edition="200601120251201B">C07C309/43</further-classification>  
        <further-classification edition="200601120251201B">C07C309/73</further-classification>  
        <further-classification edition="200601120251201B">C07C309/75</further-classification>  
        <further-classification edition="200601120251201B">C07C311/29</further-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">C07D327/08</further-classification>  
        <further-classification edition="200601120251201B">C09K3/00</further-classification>  
        <further-classification edition="200601120251201B">C08F212/14</further-classification>  
        <further-classification edition="200601120251201B">C08F212/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種鎓鹽型單體、包含來自該鎓鹽型單體的重複單元的聚合物、包含該聚合物的化學增幅阻劑組成物、及使用該化學增幅阻劑組成物的圖案形成方法，該鎓鹽型單體係在使用高能射線的微影中，溶劑溶解性優異，為高感度、高對比度，EL、LWR、CDU、DOF等微影性能優異，並且在微細圖案形成中也不易發生圖案崩塌、蝕刻耐性也優異的化學增幅阻劑組成物中使用。 &lt;br/&gt;下述式(a)表示的鎓鹽型單體。 &lt;br/&gt;&lt;img align="absmiddle" height="244px" width="523px" file="ed10446.JPG" alt="ed10446.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are: an onium salt monomer used in a chemically amplified resist composition that is excellent in solvent solubility and has high sensitivity and high contrast in photolithography using a high energy ray, is excellent in lithographic performance of EL, LWR, CDU, DOF, or the like, is resistant to pattern collapse even in fine pattern formation, and is excellent in etching resistance; a polymer containing a repeat unit derived from the onium salt monomer; a chemically amplified resist composition containing the polymer; and a pattern forming method using the chemically amplified resist composition. &lt;br/&gt;An onium salt monomer having the following formula (a): &lt;br/&gt;&lt;img align="absmiddle" height="244px" width="509px" file="ed10447.JPG" alt="ed10447.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1229" publication-number="202610912"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610912.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610912</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123062</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有滑動器裝置的拉鍊封口、可重複封合袋、及方法</chinese-title>  
        <english-title>ZIPPER CLOSURE WITH SLIDER DEVICE; RECLOSEABLE POUCH; &amp; METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">B65D33/25</main-classification>  
        <further-classification edition="200601120251211B">B65D33/16</further-classification>  
        <further-classification edition="200601120251211B">A44B19/30</further-classification>  
        <further-classification edition="200601120251211B">A44B19/24</further-classification>  
        <further-classification edition="200601120251211B">B65B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雷諾普雷斯托產品公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REYNOLDS PRESTO PRODUCTS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德魯　尼可拉斯Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DERUE, NICHOLAS A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋爾勒　理查Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEHRLE, RICHARD T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯普森　葛瑞格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMPSON, GREGG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴利　奧斯汀Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAILEY, AUSTIN B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於袋的可重封合的拉鍊封口，包含相對設置的母輪廓與公輪廓、母翼片與公翼片，以及母耳部與公耳部。一滑動裝置具有一犁頭，可楔入對向的第一耳部與第二耳部之間以將其分開，並且使公輪廓與母輪廓脫離。此滑動裝置包括第一與第二肩部，以及第一與第二凸部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A recloseable zipper closure for use with a pouch includes opposing female and male profiles, female and male fins, and female and male ears. A slider device having a plow is positioned to wedge between the opposing first ear and second ear to drive them apart and disengage the male profile and female profile. The slider device includes first and second shoulders and first and second bumpouts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:袋</p>  
        <p type="p">62:拉鍊封口</p>  
        <p type="p">64:第一袋板</p>  
        <p type="p">66:上緣</p>  
        <p type="p">68:第二袋板</p>  
        <p type="p">70:上緣</p>  
        <p type="p">72:壁</p>  
        <p type="p">74:內部</p>  
        <p type="p">76:袋口</p>  
        <p type="p">78:封閉底部</p>  
        <p type="p">80:側邊緣</p>  
        <p type="p">81:側邊緣</p>  
        <p type="p">84:滑動器裝置</p>  
        <p type="p">86:箭頭</p>  
        <p type="p">88:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1230" publication-number="202611334"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611334.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611334</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法</chinese-title>  
        <english-title>ETCHING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C23F1/02</main-classification>  
        <further-classification edition="200601120251210B">C23F1/12</further-classification>  
        <further-classification edition="200601120251210B">C09K13/08</further-classification>  
        <further-classification edition="200601120251210B">H01L21/311</further-classification>  
        <further-classification edition="200601120251210B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下愛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, AI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中健大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神谷一平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOYA, IPPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸本裕太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIMOTO, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種含矽膜之蝕刻方法，其包括下述步驟： &lt;br/&gt;(1) 於腔室內提供具有含矽膜之基板；以及 &lt;br/&gt;(2) 使用含有氟化氫及反應促進劑之蝕刻氣體，在電漿條件下蝕刻前述含矽膜； &lt;br/&gt;其中，在前述蝕刻氣體中，氟化氫之分壓為最大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for etching a silicon-containing film, including: &lt;br/&gt;(1) providing a substrate having a silicon-containing film in a chamber, and &lt;br/&gt;(2) etching the silicon-containing film under plasma conditions using an etching gas containing hydrogen fluoride and a reaction accelerator, &lt;br/&gt;wherein in the etching gas, the hydrogen fluoride has the highest partial pressure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1231" publication-number="202610989"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610989.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610989</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>(甲基)丙烯酸酯之製造方法</chinese-title>  
        <english-title>PROCESS FOR MANUFACTURE OF (METH)ACRYLATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C67/08</main-classification>  
        <further-classification edition="200601120251201B">C07C67/54</further-classification>  
        <further-classification edition="200601120251201B">C07C69/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴地斯顏料化工廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯納爾　查帕羅　迪莉婭　艾洛伊薩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERNAL CHAPARRO, DELIA ELOISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭　歐特姆德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, ORTMUND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華特　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALTER, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德　魯伊特　科內利斯　亨德里克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE RUITER, CORNELIS HENDRICUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克藍普　瑪賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRAMP, MARVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於(甲基)丙烯酸酯之製造方法，其包含下列步驟： &lt;br/&gt;a.提供醇及酸， &lt;br/&gt;b.在觸媒之存在下，將該醇及該酸轉化成(甲基)丙烯酸酯，其中產生包含該(甲基)丙烯酸酯及製程水物流(3)之至少一部分之產物混合物物流(1)， &lt;br/&gt;c.於具有頂端(9)之汽提裝置(7)中汽提該製程水物流(3)，特定言之利用蒸汽(5)，其中自該汽提裝置(7)之該頂端(9)抽出汽提出口物流(11)， &lt;br/&gt;d.於具有再沸器(15)之蒸餾塔(13)中加熱該產物混合物物流(1)之至少一部分， &lt;br/&gt;e.將該汽提出口物流(11)之至少一部分(16)進料至該蒸餾塔(13)之該再沸器(15)中，其中熱量自該汽提出口物流(11)之該部分(16)轉移至該產物混合物物流(1)之至少一部分。 &lt;br/&gt;本發明進一步關於用於進行該方法之裝置(27)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a process for manufacture of (meth)acrylates comprising the following steps: &lt;br/&gt;a. Providing an alcohol and an acid, &lt;br/&gt;b. Conversion of the alcohol and the acid in presence of a catalyst to the (meth)acrylate, wherein a product mixture stream (1) comprising the (meth)acrylate and at least part of a process water stream (3) are generated, &lt;br/&gt;c. Stripping the process water stream (3), in particular with steam (5), in a stripping device (7) having a top end (9), wherein a stripping outlet stream (11) is withdrawn from the top end (9) of the stripping device (7), &lt;br/&gt;d. Heating at least part of the product mixture stream (1) in a distillation column (13) with a reboiler (15), &lt;br/&gt;e. Feeding at least a part (16) of the stripping outlet stream (11) into the reboiler (15) of the distillation column (13), wherein heat is transferred from the part (16) of the stripping outlet stream (11) to the at least part of the product mixture stream (1). &lt;br/&gt;The invention further relates to a device (27) for carrying out the process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:產物混合物物流</p>  
        <p type="p">3:製程水物流</p>  
        <p type="p">5:蒸汽</p>  
        <p type="p">7:汽提裝置</p>  
        <p type="p">9:頂端</p>  
        <p type="p">11:汽提出口物流</p>  
        <p type="p">13:蒸餾塔</p>  
        <p type="p">15:再沸器</p>  
        <p type="p">16:汽提出口物流之一部分</p>  
        <p type="p">17:間接熱交換器</p>  
        <p type="p">19:剩餘部分</p>  
        <p type="p">21:冷凝器</p>  
        <p type="p">23:收集容器</p>  
        <p type="p">25:泵</p>  
        <p type="p">27:裝置</p>  
        <p type="p">31:出口</p>  
        <p type="p">33:入口</p>  
        <p type="p">45:殘留部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1232" publication-number="202612541"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612541.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612541</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光檢測裝置及測距裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">H10F30/225</main-classification>  
        <further-classification edition="202501120251201B">H10F39/10</further-classification>  
        <further-classification edition="202501120251201B">H10F77/40</further-classification>  
        <further-classification edition="200601120251201B">G01S17/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村章太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之一實施形態之光檢測裝置包含：第1半導體基板，其具有對向之第1面及第2面，於面內方向呈陣列狀配置複數個像素，且在複數個像素各者設置有藉由高電場區域使載子倍增之單光子突崩二極體；第2半導體基板，其積層於第1半導體基板之第1面側，具有與第1半導體基板之第1面對向之第3面及在與第3面為相反側具有第4面，且設置有1或複數個電晶體；及遮光構造，其設置為至少於第2半導體基板之第4面側沿積層方向延伸，至少包圍複數個像素各者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光檢測裝置</p>  
        <p type="p">10:第1基板</p>  
        <p type="p">11:半導體基板</p>  
        <p type="p">11S1:第1面</p>  
        <p type="p">11S2:第2面</p>  
        <p type="p">12:受光元件</p>  
        <p type="p">12X:突崩倍增區域</p>  
        <p type="p">13:受光部</p>  
        <p type="p">14:倍增部</p>  
        <p type="p">14X:p型半導體區域(p&lt;sup&gt;+&lt;/sup&gt;)</p>  
        <p type="p">14Y:n型半導體區域(n&lt;sup&gt;+&lt;/sup&gt;)</p>  
        <p type="p">15:接觸層</p>  
        <p type="p">16:接觸層</p>  
        <p type="p">17:像素分離部</p>  
        <p type="p">17A:絕緣膜</p>  
        <p type="p">17B:遮光膜</p>  
        <p type="p">17X:擴寬部</p>  
        <p type="p">18:固定電荷層</p>  
        <p type="p">19:層間絕緣層</p>  
        <p type="p">20:第2基板</p>  
        <p type="p">21:半導體基板</p>  
        <p type="p">21S1:第3面</p>  
        <p type="p">21S2:第4面</p>  
        <p type="p">22:分離部</p>  
        <p type="p">24:多層配線層</p>  
        <p type="p">30:第3基板</p>  
        <p type="p">31:半導體基板</p>  
        <p type="p">31S1:第5面</p>  
        <p type="p">31S2:第6面</p>  
        <p type="p">32:多層配線層</p>  
        <p type="p">32S1:表面</p>  
        <p type="p">41:保護層</p>  
        <p type="p">42:彩色濾光器</p>  
        <p type="p">43:微透鏡</p>  
        <p type="p">111:n型半導體區域(n)</p>  
        <p type="p">112:p型半導體區域(p)</p>  
        <p type="p">241:閘極</p>  
        <p type="p">242:配線層</p>  
        <p type="p">243:層間絕緣層</p>  
        <p type="p">244:墊部</p>  
        <p type="p">321:閘極配線</p>  
        <p type="p">322,323,324,325:配線層</p>  
        <p type="p">326:層間絕緣層</p>  
        <p type="p">327:墊電極</p>  
        <p type="p">L:光</p>  
        <p type="p">P:單位像素</p>  
        <p type="p">V1a:貫通接點</p>  
        <p type="p">V2:接點/貫通接點</p>  
        <p type="p">V3:通孔</p>  
        <p type="p">V&lt;sub&gt;x&lt;/sub&gt;:貫通配線</p>  
        <p type="p">X,Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1233" publication-number="202612478"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612478.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612478</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123223</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置之蛇形電極</chinese-title>  
        <english-title>SERPENTINE ELECTRODE FOR MEMORY DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H10B61/00</main-classification>  
        <further-classification edition="202301120251201B">H10N50/10</further-classification>  
        <further-classification edition="202301120251201B">H10N50/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范　德　史特瑞特恩　奧斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DER STRATEN, OSCAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬區瑞森　威力　萊斯特　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUCHRISON, WILLIE LESTER, JR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧卡雷利　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUCARELLI, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　智超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於一記憶體裝置之具有一蛇形圖案之底部電極，其中該底部電極定位於一含MTJ柱與一第一導電結構之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bottom electrode having a serpentine pattern is provided for a memory device in which the bottom electrode is located between a MTJ-containing pillar and a first electrically conductive structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一ILD層</p>  
        <p type="p">12:第一擴散障壁襯裡</p>  
        <p type="p">14:第一導電結構</p>  
        <p type="p">16:介電蓋/經圖案化介電蓋</p>  
        <p type="p">18:金屬蓋</p>  
        <p type="p">20:第二ILD層</p>  
        <p type="p">21:多層含ILD區</p>  
        <p type="p">25:第一底部電極</p>  
        <p type="p">27:第二底部電極</p>  
        <p type="p">28:間隙填充ILD層</p>  
        <p type="p">32:底部含磁性材料層</p>  
        <p type="p">34:隧道障壁層</p>  
        <p type="p">36:上部含磁性材料層</p>  
        <p type="p">38:頂部電極</p>  
        <p type="p">42:囊封襯裡</p>  
        <p type="p">44:第四ILD層</p>  
        <p type="p">46:第二擴散障壁襯裡</p>  
        <p type="p">48:第二導電結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1234" publication-number="202611011"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611011.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611011</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123229</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>萘化合物、其合成方法及含有該萘化合物之樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C319/18</main-classification>  
        <further-classification edition="200601120251201B">C07C321/28</further-classification>  
        <further-classification edition="200601120251201B">C07C321/30</further-classification>  
        <further-classification edition="200601120251201B">C07C323/12</further-classification>  
        <further-classification edition="200601120251201B">C07C323/52</further-classification>  
        <further-classification edition="200601120251201B">C08F28/04</further-classification>  
        <further-classification edition="200601120251201B">C08L41/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商四國化成工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIKOKU CHEMICALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩入僚祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIOIRI, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天野幸惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMANO, SACHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穴吹翔馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANABUKI, SHOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏原隆志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHIWABARA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木和德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊野岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMANO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種新穎的萘化合物、該萘化合物之合成方法及含有該萘化合物之樹脂組成物。本發明之樹脂組成物可適用於塗布材、墨水、接著劑、黏著劑、阻氣薄膜、彩色濾光片、稜鏡、繞射光柵、光學反射鏡、光學薄膜、光學透鏡等。本發明係有關於以化學式(I)表示的萘化合物、其合成方法、包含該化合物之樹脂組成物及其硬化物。&lt;br/&gt;&lt;img align="absmiddle" height="68px" width="449px" file="ed10059.JPG" alt="ed10059.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; (式中，Y表示選自式(1)~(7)之基團。n表示1~10之整數。)&lt;br/&gt;&lt;img align="absmiddle" height="190px" width="564px" file="ed10060.JPG" alt="ed10060.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; (式中，m1表示1~3之整數。m2表示1~2之整數。m3係相同且表示1~3之整數。m4表示1~3之整數。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1235" publication-number="202611940"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611940.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611940</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123238</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測用於連續分析物監測的分析物感測器的操作狀態之經由電腦執行的方法、電腦系統、電腦程式產品及連續葡萄糖監測系統</chinese-title>  
        <english-title>COMPUTER IMPLEMENTED METHOD FOR DETECTING AN OPERATION STATUS OF AN ANALYTE SENSOR FOR CONTINUOUS ANALYTE MONITORING, COMPUTER SYSTEM, COMPUTER PROGRAM PRODUCT, AND CONTINUOUS GLUCOSE MONITORING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251204B">G16H40/63</main-classification>  
        <further-classification edition="200601120251204B">A61B5/145</further-classification>  
        <further-classification edition="200601120251204B">G05B23/02</further-classification>  
        <further-classification edition="200601120251204B">G01D18/00</further-classification>  
        <further-classification edition="200601120251204B">G01R31/00</further-classification>  
        <further-classification edition="200601120251204B">G01N27/416</further-classification>  
        <further-classification edition="200601120251204B">G01N33/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅氏血糖健康醫護公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROCHE DIABETES CARE GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑勒　弗雷德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAILER, FREDRIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡斯基托　湯尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUSCHTO, TONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林格曼　克利斯添</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RINGEMANN, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林蘭君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種檢測用於連續監測分析物的分析物感測器 (10) 的操作狀態之經由電腦執行的方法，該方法包含：接收由分析物感測器 (10) 檢測到的針對分析物的連續監測資料；檢測針對該分析物感測器 (10) 的靈敏度喪失，包含：從該連續監測資料確定指示該分析物感測器 (10) 之感測器靈敏度的靈敏度指標，提供針對該靈敏度指標的臨界量度，及若該靈敏度指標與針對該靈敏度指標的該臨界量度相匹配，則確定針對該分析物感測器 (10) 的該靈敏度喪失；以及檢測針對該分析物感測器 (10) 的缺陷狀態，包含：接收指示針對該分析物感測器 (10) 測量的阻抗的阻抗值，提供針對該分析物感測器 (10) 之該阻抗的臨界量度，及若該阻抗值與針對該分析物感測器 (10) 之該阻抗的該臨界量度相匹配，則確定針對該分析物感測器 (10) 的該缺陷狀態。若針對該分析物感測器 (10)，該靈敏度喪失及該缺陷狀態中的至少一者係經確定，則檢測到該分析物感測器 (10) 之失效；以及回應於檢測到該分析物感測器 (10) 之該失效，進行以下中的至少一者：提供指示該分析物感測器 (10) 之該失效的失效資料，及停用該分析物感測器 (10)。此外，提供了一種電腦系統、一種電腦程式產品及一種連續葡萄糖監測系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure refers to a computer implemented method for detecting an operation status of an analyte sensor (10) for continuous monitoring an analyte, comprising: receiving continuous monitoring data for an analyte detected by an analyte sensor (10); detecting a loss of sensitivity for the analyte sensor (10), comprising determining a sensitivity indicator indicative of a sensor sensitivity of the analyte sensor (10) from the continuous monitoring data, providing a critical measure for the sensitivity indicator, and determining the loss of sensitivity for the analyte sensor (10), if the sensitivity indicator matches the critical measure for the sensitivity indicator; and detecting a defect status for the analyte sensor (10), comprising receiving an impedance value indicative of an impedance measured for the analyte sensor (10), providing a critical measure for the impedance of the analyte sensor (10), and determining the defect status for the analyte sensor (10), if the impedance value matches the critical measure for the impedance of the analyte sensor (10). A failure of the analyte sensor (10) is detected if for the analyte sensor (10) at least one of the loss of sensitivity and the defect status is determined, and, in response to detecting the failure of the analyte sensor (10), at least one of providing failure data indicative of the failure of the analyte sensor (10) and deactivating the analyte sensor (10) is conducted. Further, a computer system, a computer program product, and a continuous glucose monitoring system are provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:分析物感測器</p>  
        <p type="p">11:電腦系統</p>  
        <p type="p">12:無線資料通訊</p>  
        <p type="p">13:使用者介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1236" publication-number="202612025"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612025.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612025</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123244</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合操作後之修復低K材料的方法</chinese-title>  
        <english-title>METHODS OF REPAIRING LOW-K MATERIALS AFTER INTEGRATION OPERATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/3105</main-classification>  
        <further-classification edition="200601120251201B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡利亞班　姆蘇庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALIAPPAN, MUTHUKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">示範性處理方法可能包含將具有多個官能基團的含矽前驅物提供至半導體處理腔室的處理區域。基板可能被裝設於處理區域內。基板可能包含含矽材料的層，該層限定一或多個孔隙。這些方法可能包括使含矽材料的層與含矽前驅物接觸。含矽前驅物可能擴散至一或多個孔隙中，並可能減少一或多個孔隙內的Si-OH鍵及/或Si-H鍵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Exemplary processing methods may include providing a silicon-containing precursor having multiple functional groups to a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region. The substrate may include a layer of silicon-containing material defining one or more pores. The methods may include contacting the layer of silicon-containing material with the silicon-containing precursor. The silicon-containing precursor may diffuse into the one or more pores and may reduce Si-OH bonds and/or Si-H bonds within the one or more pores.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">205:操作</p>  
        <p type="p">210:操作</p>  
        <p type="p">215:操作</p>  
        <p type="p">220:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1237" publication-number="202610762"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610762.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610762</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123245</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>振動解析方法及振動解析系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">B23Q17/12</main-classification>  
        <further-classification edition="200601120251204B">G01M7/02</further-classification>  
        <further-classification edition="200601120251204B">G01H1/00</further-classification>  
        <further-classification edition="200601120251204B">G06T17/00</further-classification>  
        <further-classification edition="202001120251204B">G06F30/20</further-classification>  
        <further-classification edition="201101120251204B">G06T13/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＨＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井龍也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青山將大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAMA, SHODAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松永智善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAGA, TOMOYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩中秀晉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWANAKA, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高塚千尋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKATSUKA, CHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古澤龍二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUSAWA, RYUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種振動解析方法，其具有以下之步驟：三維模型生成步驟，其生成對象裝置(100)之三維模型(200)；振動資料收集步驟，其使對象裝置(100)進行動作，並收集對象裝置(100)之振動資料的實測值；及三維動態影像生成步驟，其生成將三維模型(200)與振動資料之實測值予以組合的三維動態影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:對象裝置</p>  
        <p type="p">101:固定部</p>  
        <p type="p">102:移動部</p>  
        <p type="p">103:振動感測器</p>  
        <p type="p">103C:第3振動感測器群</p>  
        <p type="p">110:基座</p>  
        <p type="p">120:第1平台</p>  
        <p type="p">130:第2平台</p>  
        <p type="p">200:三維模型</p>  
        <p type="p">201:固定部模型</p>  
        <p type="p">202:移動部模型</p>  
        <p type="p">203:振動感測器模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1238" publication-number="202611008"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611008.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611008</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123349</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法及電子器件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C309/24</main-classification>  
        <further-classification edition="200601120251201B">C07C381/00</further-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">C07D211/46</further-classification>  
        <further-classification edition="200601120251201B">C07D235/06</further-classification>  
        <further-classification edition="200601120251201B">C07D277/64</further-classification>  
        <further-classification edition="200601120251201B">C07D307/93</further-classification>  
        <further-classification edition="200601120251201B">C07D327/06</further-classification>  
        <further-classification edition="200601120251201B">C07D327/08</further-classification>  
        <further-classification edition="200601120251201B">C07D333/22</further-classification>  
        <further-classification edition="200601120251201B">C07D333/46</further-classification>  
        <further-classification edition="200601120251201B">C07D333/76</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉野文博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO, FUMIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子明弘</last-name>  
                <first-name/> 
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                <last-name>KANEKO, AKIHIRO</last-name>  
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                <last-name>川端健志</last-name>  
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                <last-name>KAWABATA, TAKESHI</last-name>  
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        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法及電子器件之製造方法</chinese-title>  
        <english-title/> 
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        <main-classification edition="200601120251201B">C07C309/07</main-classification>  
        <further-classification edition="200601120251201B">C07C309/12</further-classification>  
        <further-classification edition="200601120251201B">C07C309/17</further-classification>  
        <further-classification edition="200601120251201B">C07C317/44</further-classification>  
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        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">C07D211/46</further-classification>  
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        <further-classification edition="200601120251201B">C07D327/08</further-classification>  
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        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
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                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
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                <last-name>FUJIFILM CORPORATION</last-name>  
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                <last-name>吉野文博</last-name>  
                <first-name/> 
              </chinese-name>  
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                <last-name>YOSHINO, FUMIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
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              <address>臺北市</address> 
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        <p type="p">本發明提供一種感光化射線性或感放射線性樹脂組成物、使用上述感光化射線性或感放射線性樹脂組成物形成的光阻膜、使用上述感光化射線性或感放射線性樹脂組成物的圖案形成方法及電子器件之製造方法，所述感光化射線性或感放射線性樹脂組成物含有藉由酸的作用而極性增大之樹脂和具有特定結構的鎓鹽。</p> 
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      <isu-abst lang="en"> 
        <p type="p"></p> 
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      <representative-img> 
        <p type="p">無</p> 
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    </description> 
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          <doc-number>114123377</doc-number> 
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      </application-reference>  
      <invention-title> 
        <chinese-title>感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法</chinese-title>  
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      </invention-title>  
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        <main-classification edition="200601120251201B">C08F212/02</main-classification>  
        <further-classification edition="200601120251201B">C08F220/06</further-classification>  
        <further-classification edition="200601120251201B">C08F220/10</further-classification>  
        <further-classification edition="200601120251201B">C08F230/08</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
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      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
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                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
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                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川端健志</last-name>  
                <first-name/> 
              </chinese-name>  
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                <last-name>KAWABATA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤研由</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, AKIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
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    </tw-bibliographic-data-application>  
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        <p type="p">本發明提供一種感光化射線性或感放射線性樹脂組成物、使用上述感光化射線性或感放射線性樹脂組成物的感光化射線性或感放射線性膜、圖案形成方法、及電子器件之製造方法，所述感光化射線性或感放射線性樹脂組成物含有：樹脂（P），其包含說明書中所記載之由通式（1）或通式（2）表示的重複單元和說明書中所記載之由通式（3）表示且不具有矽原子的重複單元；以及樹脂（A），其與上述樹脂（P）不同且藉由酸的作用而極性增大。</p> 
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      <isu-abst lang="en"> 
        <p type="p"></p> 
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      <representative-img> 
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      <isuno>6</isuno>  
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      </publication-reference>  
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        <document-id> 
          <doc-number>114123381</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磺酸鹽、肟磺酸鹽、醯亞胺磺酸鹽、醯胺磺酸鹽、含上述化合物之酸產生劑、含上述酸產生劑之光阻劑、及電子裝置或光學裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C25/18</main-classification>  
        <further-classification edition="200601120251201B">C07C381/00</further-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">C07D209/48</further-classification>  
        <further-classification edition="200601120251201B">C07D213/71</further-classification>  
        <further-classification edition="200601120251201B">C07D311/64</further-classification>  
        <further-classification edition="200601120251201B">C07D405/12</further-classification>  
        <further-classification edition="200601120251201B">C08F212/14</further-classification>  
        <further-classification edition="200601120251201B">C08F220/38</further-classification>  
        <further-classification edition="200601120251201B">C09K3/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
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        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三亞普羅股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAN-APRO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石篤志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
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      <isu-abst lang="tw"> 
        <p type="p">本發明提供新穎之化合物，其不具有全氟甲基及全氟亞甲基，且藉由照射光線容易分解而產生具有較高之酸強度之磺酸。 &lt;br/&gt;本發明之化合物為下述式（a-1）或（a-2）所表示之陰離子、與陽離子之鹽。下述式中，R&lt;sup&gt;1&lt;/sup&gt;表示氫原子、烴基、或雜環式基、或2個以上之上述基經由連結基鍵結而成之基。R&lt;sup&gt;10&lt;/sup&gt;表示氟原子、或芳香族烴基、或芳香族雜環式基。R&lt;sup&gt;20&lt;/sup&gt;表示氫原子、或鹵素原子、或可具有取代基之烴基、或可具有取代基之雜環式基、或具有上述基與連結基鍵結而成之基的基。n表示0或1。 &lt;br/&gt;&lt;img align="absmiddle" height="310px" width="315px" file="ed10101.JPG" alt="ed10101.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
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      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
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        <document-id> 
          <doc-number>114123387</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法及電子器件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
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        <main-classification edition="200601120251201B">C07C309/04</main-classification>  
        <further-classification edition="200601120251201B">C07C309/09</further-classification>  
        <further-classification edition="200601120251201B">C07C309/10</further-classification>  
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        <further-classification edition="200601120251201B">C07D211/62</further-classification>  
        <further-classification edition="200601120251201B">C07D307/93</further-classification>  
        <further-classification edition="200601120251201B">C07D327/06</further-classification>  
        <further-classification edition="200601120251201B">C07D327/08</further-classification>  
        <further-classification edition="200601120251201B">C07D333/46</further-classification>  
        <further-classification edition="200601120251201B">C07D333/76</further-classification>  
        <further-classification edition="200601120251201B">C07D405/04</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
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        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子明弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川端健志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABATA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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                <last-name>後藤研由</last-name>  
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                <last-name>GOTO, AKIYOSHI</last-name>  
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                <first-name/> 
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                <last-name>吉野文博</last-name>  
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                <last-name>YOSHINO, FUMIHIRO</last-name>  
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                <first-name/> 
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                <last-name>山本慶</last-name>  
                <first-name/> 
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                <last-name>YAMAMOTO, KEI</last-name>  
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              <address/>  
              <english-country>JP</english-country> 
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      <isu-abst lang="en"> 
        <p type="p"></p> 
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      <representative-img> 
        <p type="p">無</p> 
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          <doc-number>114123388</doc-number> 
        </document-id> 
      </application-reference>  
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        <chinese-title>感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法</chinese-title>  
        <english-title/> 
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        <main-classification edition="200601120251201B">C08F220/10</main-classification>  
        <further-classification edition="200601120251201B">C08F230/08</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
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              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
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              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
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        </applicants>  
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              <chinese-name name-type="organization"> 
                <last-name>川端健志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABATA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
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                <last-name>吉野文博</last-name>  
                <first-name/> 
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                <last-name>YOSHINO, FUMIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
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              <chinese-name name-type="organization"> 
                <last-name>後藤研由</last-name>  
                <first-name/> 
              </chinese-name>  
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                <last-name>GOTO, AKIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
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                <last-name>卓俊傑</last-name>  
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      <isu-abst lang="en"> 
        <p type="p"></p> 
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        <further-classification edition="200601120251201B">C08F220/06</further-classification>  
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        <further-classification edition="200601120251201B">C08F220/36</further-classification>  
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        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
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                <last-name>日商富士軟片股份有限公司</last-name>  
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                <last-name>FUJIFILM CORPORATION</last-name>  
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        </applicants>  
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              <chinese-name name-type="organization"> 
                <last-name>川端健志</last-name>  
                <first-name/> 
              </chinese-name>  
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                <last-name>KAWABATA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
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              <chinese-name name-type="organization"> 
                <last-name>後藤研由</last-name>  
                <first-name/> 
              </chinese-name>  
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                <last-name>GOTO, AKIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
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              <address>臺北市</address> 
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        <p type="p">本發明提供一種感光化射線性或感放射線性樹脂組成物、由上述感光化射線性或感放射線性樹脂組成物形成的感光化射線性或感放射線性膜、使用上述感光化射線性或感放射線性樹脂組成物的圖案形成方法及電子器件之製造方法，所述感光化射線性或感放射線性樹脂組成物含有：樹脂（P），其具有說明書中所記載的由通式（1）或（2）表示的重複單元；以及樹脂（A），其與上述樹脂（P）不同且藉由酸的作用而極性增大，其中，上述樹脂（P）含有具有鹼性部位的基團、或藉由酸或熱的作用而產生鹼性部位的基團。</p> 
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      <isu-abst lang="en"> 
        <p type="p"></p> 
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      <representative-img> 
        <p type="p">無。</p> 
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      <invention-title> 
        <chinese-title>感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法及電子器件的製造方法</chinese-title>  
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        <main-classification edition="200601120251201B">C08F30/08</main-classification>  
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        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
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        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川端健志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABATA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤研由</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, AKIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
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          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
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        </agents> 
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        <p type="p">本發明提供一種感光化射線性或感放射線性樹脂組成物、由上述感光化射線性或感放射線性樹脂組成物形成的感光化射線性或感放射線性膜、使用上述感光化射線性或感放射線性樹脂組成物的圖案形成方法及電子器件的製造方法，所述感光化射線性或感放射線性樹脂組成物含有：樹脂（P），其含有具有矽原子的重複單元和具有藉由鹼顯影液的作用分解而在鹼顯影液中的溶解度增大之基團的重複單元，並且重量平均分子量為8000以上；以及樹脂（A），其與上述樹脂（P）不同且藉由酸的作用而極性增大。</p> 
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      <isu-abst lang="en"> 
        <p type="p"></p> 
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      <representative-img> 
        <p type="p">無</p> 
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      <invention-title> 
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法及電子器件之製造方法</chinese-title>  
        <english-title/> 
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        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
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        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
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                <first-name/> 
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              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
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                <first-name/> 
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                <first-name/> 
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                <first-name/> 
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                <last-name>山本慶</last-name>  
                <first-name/> 
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                <first-name/> 
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                <last-name>髙嶋美沙樹</last-name>  
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        <p type="p"></p> 
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          <doc-number>114123404</doc-number> 
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        <chinese-title>感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法</chinese-title>  
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                <last-name>川端健志</last-name>  
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                <last-name>KAWABATA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
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                <last-name>金子明弘</last-name>  
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                <first-name/> 
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              <address/>  
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                <last-name>後藤研由</last-name>  
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              <english-name name-type="organization"> 
                <last-name>GOTO, AKIYOSHI</last-name>  
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                <first-name/> 
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              <address/>  
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                <last-name>吉野文博</last-name>  
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                <first-name/> 
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                <last-name>KAWABATA, TAKESHI</last-name>  
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                <first-name/> 
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                <last-name>後藤研由</last-name>  
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                <last-name>GOTO, AKIYOSHI</last-name>  
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                <first-name/> 
              </english-name>  
              <address/>  
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                <last-name>吉野文博</last-name>  
                <first-name/> 
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                <last-name>YOSHINO, FUMIHIRO</last-name>  
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                <first-name/> 
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                <first-name/> 
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                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
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      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光化射線性或感放射線性樹脂組成物、使用上述感光化射線性或感放射線性樹脂組成物形成的光阻膜、使用上述感光化射線性或感放射線性樹脂組成物的圖案形成方法及電子器件之製造方法，所述感光化射線性或感放射線性樹脂組成物含有藉由酸作用而極性增大之樹脂和具有特定結構的鎓鹽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1250" publication-number="202610664"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610664.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610664</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123412</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通過表觀編輯靶向調節PCSK9的方法及其用途</chinese-title>  
        <english-title>METHOD OF EPIGENETIC MODULATING PCSK9 AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/7088</main-classification>  
        <further-classification edition="200601120251201B">C12N15/861</further-classification>  
        <further-classification edition="200601120251201B">C12N15/12</further-classification>  
        <further-classification edition="200601120251201B">A61K48/00</further-classification>  
        <further-classification edition="200601120251201B">A61P3/00</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification>  
        <further-classification edition="200601120251201B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商益杰立科新加坡有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EPIGENIC THERAPEUTICS PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭文博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, WENBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛少帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, SHAOSHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳壘磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, LEILEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉鈞健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JUNJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂瑞敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LV, RUIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供了用於活體內靶向減少或消除PCSK9基因產物之表觀遺傳編輯工具及引導RNA。本揭示亦關於製劑、其生產方法及使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1251" publication-number="202611139"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611139.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611139</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123417</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F230/08</main-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/075</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川端健志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABATA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤研由</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, AKIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光化射線性或感放射線性樹脂組成物、由上述感光化射線性或感放射線性樹脂組成物形成的感光化射線性或感放射線性膜、使用上述感光化射線性或感放射線性樹脂組成物的圖案形成方法及電子器件之製造方法，上述感光化射線性或感放射線性樹脂組成物含有：樹脂（P），其具有重複單元，該重複單元具有藉由酸或鹼的作用而脫離的基團，並且上述藉由酸或鹼的作用而脫離的基團具有矽原子；以及樹脂（A），其與上述樹脂（P）不同且藉由酸的作用而極性增大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1252" publication-number="202612293"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612293.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612293</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123434</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置、電子裝置的操作方法及基地台</chinese-title>  
        <english-title>AN ELECTRONIC DEVICE, AN OPERATING METHOD OF AN ELECTRONIC DEVICE AND A BASE STATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251103B">H04B7/0456</main-classification>  
        <further-classification edition="201701120251103B">H04B7/0413</further-classification>  
        <further-classification edition="200601120251103B">H04L25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳珍宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供電子裝置、電子裝置的操作方法和基地台。電子裝置包括從基地台接收物理通道的通訊電路、記憶體、以及判定是否從基地台接收預編碼維護訊號並基於判定未接收預編碼維護訊號而傳輸預編碼變更限制請求至基地台的處理器。預編碼變更限制請求對應至請求基地台在特定間隔內維持應用的預編碼矩陣的請求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device, an operating method of an electronic device and a base station are provided. An electronic device includes a communication circuit that receives a physical channel from a base station, a memory, and a processor that determines whether a precoding maintenance signal is received from the base station, and based on a determination that the precoding maintenance signal is not received, transmits a precoding change restriction request to the base station. The precoding change restriction request corresponds to a request to maintain a precoding matrix applied by the base station for a certain interval.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:電子裝置</p>  
        <p type="p">310:通訊電路</p>  
        <p type="p">320:記憶體</p>  
        <p type="p">330:控制電路</p>  
        <p type="p">331:預編碼控制電路</p>  
        <p type="p">333:通道估計電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1253" publication-number="202610897"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610897.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610897</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無人飛行器</chinese-title>  
        <english-title>UNMANNED FLYING VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251204B">B64U10/10</main-classification>  
        <further-classification edition="202301120251204B">B64U20/70</further-classification>  
        <further-classification edition="202301120251204B">B64U30/29</further-classification>  
        <further-classification edition="202301120251204B">B64U40/00</further-classification>  
        <further-classification edition="200601120251204B">B64C9/04</further-classification>  
        <further-classification edition="202001120251204B">G01S17/87</further-classification>  
        <further-classification edition="202401320251204B">G05D109/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商諾迪克防空有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORDIC AIR DEFENCE AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維伯格　古斯塔夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIBERG, GUSTAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種無人機，其包含： &lt;br/&gt;主體，其為細長的且具有一縱向軸線，該主體在該細長主體之一端處可旋轉地附接至具有一軸之螺槳主體，使得該主體及該螺槳主體經配置以相對於彼此旋轉，使得該螺槳在該軸之方向上提供推力，其中該主體繞其縱向軸線旋轉， &lt;br/&gt;該無人機包含機械式地連接至該軸之驅動構件，該驅動構件驅動所述主體相對於彼此之旋轉， &lt;br/&gt;該無人機包含控制裝置，該控制裝置經配置以控制該驅動構件之旋轉速度以控制該推力且進一步經配置以控制該無人機之飛行方向， &lt;br/&gt;其中該無人機經組態以使該螺槳主體相對於外部參考座標系以大於該主體之第二旋轉速度的第一旋轉速度旋轉，該第二旋轉速度稱為滾轉速度， &lt;br/&gt;其中該無人機經組態以使得該主體之該縱向軸線在飛行期間相對於該無人機之該飛行方向具有大於零之攻角，該縱向軸線繞該無人機之該飛行方向旋轉，該飛行方向相對於該外部參考座標系，其中繞該飛行方向之該旋轉以與該主體繞該縱向軸線滾轉（滾轉速度）相同之角速度發生， &lt;br/&gt;其中該控制裝置經配置以高於該滾轉速度之頻率判定該主體之該縱向軸線相對於該外部參考座標系的定向，且在該主體相對於該外部參考座標系之完整繞轉之一分段期間調整該推力以便調整該攻角，藉此調整該無人機之該飛行方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a drone comprising, &lt;br/&gt;a main body which is elongated and having a longitudinal axis, the main body being rotatable attached at one end of the elongated body to a propeller body with a shaft so that the main body and the propeller body are arranged to rotate in relation to each other, so that the propeller provides thrust in the direction of the shaft, where the main body rotates around its longitudinal axis, &lt;br/&gt;the drone comprising driving means mechanically connected to the shaft, the driving means driving rotation of the bodies in relation to each other, &lt;br/&gt;the drone comprising a control device arranged to control the speed of rotation of the driving means to control the thrust and further arranged to control the flight direction of the drone, &lt;br/&gt;where the drone is configured to rotate the propeller body at a first rotation speed that is greater than a second rotation speed of the main body in relation to an external frame of reference, the second rotation speed being referred to as roll speed, &lt;br/&gt;where the drone is configured such that the longitudinal axis of the main body has, during flight, an angle of attack greater than zero to the flight direction of the drone, said longitudinal axis rotating around the flight direction of the drone, the flight direction being in relation to the external frame of reference, where the rotation around the flight direction occurs with the same angular speed as the main body rolls around the longitudinal axis (roll speed), &lt;br/&gt;where the control device is arranged to determine the orientation of the longitudinal axis of the main body in relation to the external frame of reference with a frequency that is higher than the roll speed and adjust the thrust during a subsection of a complete revolution of the main body in relation to the external frame of reference in order to adjust the angle of attack, thereby adjusting the flight direction of the drone.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:無人飛行器，無人機</p>  
        <p type="p">2:主體</p>  
        <p type="p">3:縱向軸線</p>  
        <p type="p">4:螺槳主體</p>  
        <p type="p">5:軸</p>  
        <p type="p">6:驅動構件</p>  
        <p type="p">7:控制裝置</p>  
        <p type="p">8:電源</p>  
        <p type="p">9:螺槳葉片</p>  
        <p type="p">12:力向量，垂直力</p>  
        <p type="p">16:質心</p>  
        <p type="p">17:箭頭</p>  
        <p type="p">18:旋轉</p>  
        <p type="p">19:酬載</p>  
        <p type="p">21:當前飛行方向</p>  
        <p type="p">24:攻角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1254" publication-number="202611360"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611360.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611360</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123477</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人工皮革基材、絨毛人工皮革及粒面狀人工皮革</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">D06N3/00</main-classification>  
        <further-classification edition="200601120251201B">D06N3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三輪英二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIWA, EIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山公男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, KIMIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種人工皮革基材，其包含纏結了極細纖維而成之不織布、與含浸賦予於不織布之聚胺基甲酸酯。聚胺基甲酸酯在高分子多元醇單元總量中包含60~95%的縮合型聚酯多元醇單元、與5~25%的選自由聚乙二醇單元及聚丙二醇單元組成之群組中之聚醚多元醇單元。縮合型聚酯多元醇單元不含環結構且其重複單元中的排除酯鍵的碳之平均碳數為5~7。包含聚胺基甲酸酯與被聚胺基甲酸酯包圍之空孔之聚胺基甲酸酯區域的空孔率為30%以下，且聚胺基甲酸酯區域相對於剖面的總剖面積之面積比例為10~30%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1255" publication-number="202610754"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610754.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610754</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面改質方法</chinese-title>  
        <english-title>SURFACE MODIFICATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251205B">B23K26/352</main-classification>  
        <further-classification edition="200601120251205B">H01L21/67</further-classification>  
        <further-classification edition="201401120251205B">B23K26/36</further-classification>  
        <further-classification edition="201401120251205B">B23K26/00</further-classification>  
        <further-classification edition="200601320251205B">B23K101/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格羅切爾　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GROECHEL, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法爾科內　克里斯托弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FALCONE, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈利爾　奧薩馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHALIL, OSAMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彼得斯　萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETERS, RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>興茨　傑弗瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HINTZ, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一態樣中，本文揭露一種用於對一組件表面進行改質之方法、系統及設備，其包含：使該表面與一雷射光束接觸，該表面包含一半導體工具製造組件；回應於該接觸而對該表面進行改質，其中該對該表面進行改質包含藉由微機械加工、蝕刻、剝蝕、離子化、陽極處理、氧化、紋理化或粗糙化或其一組合而在該表面中形成一功能特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an aspect, disclosed herein are a methods, systems and apparatus for modifying a component surface comprising, contacting the surface, with an laser beam, the surface comprising a semiconductor tool manufacturing component; modifying the surface responsive to the contacting, wherein the modifying the surface comprises forming, by micro-machining, etching, ablating, ionizing, anodizing, oxidizing, texturing, or roughening, or a combination thereof, a functional feature in the surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">702:區塊</p>  
        <p type="p">704:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1256" publication-number="202610764"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610764.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610764</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123493</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨條件決定裝置、單面研磨裝置、研磨條件決定方法、以及單面研磨方法</chinese-title>  
        <english-title>Device for determining polishing condition, single-side polishing device, method for determining polishing condition, and single-side polishing method</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251112B">B24B37/00</main-classification>  
        <further-classification edition="201201120251112B">B24B37/005</further-classification>  
        <further-classification edition="201201120251112B">B24B37/10</further-classification>  
        <further-classification edition="200601120251112B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMCO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本篤哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, ASTUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉森勝久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIMORI, KATSUHSA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒木卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAKI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的是提供研磨條件決定裝置，可抑制研磨去除量的差異值。研磨條件決定裝置決定在將經由背墊保持在研磨頭的晶圓推進至研磨墊的同時、利用從圍繞前述晶圓的固定環與前述研磨墊的間隙供給至前述研磨墊的研磨液、研磨前述晶圓時的研磨條件。研磨條件決定裝置包括：取得前述背墊的累積使用時間以及前述研磨墊的累積使用時間之取得部、以及基於前述背墊以及前述研磨墊的前述累積使用時間決定前述晶圓的研磨條件之決定部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The purpose of the present invention is to provide a device for determining polishing condition capable of suppressing variations in polishing removal amount. The device for determining polishing condition determines the polishing conditions for polishing a wafer held by a backing pad on a polishing head as it is advanced toward a polishing pad, utilizing polishing slurry supplied to the polishing pad through a gap between a retainer ring surrounding the wafer and the polishing pad. The device for determining polishing condition includes a obtaining portion for obtaining the cumulative usage time of the backing pad and the cumulative usage time of the polishing pad; and a determination portion for determining the polishing conditions for the wafer based on the cumulative usage times of the backing pad and the polishing pad.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1,S2,S3,S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1257" publication-number="202610569"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610569.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610569</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123511</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>廚房通道系統、控制裝置、廚房通道系統之控制方法、及店舖系統</chinese-title>  
        <english-title>KITCHEN LANE SYSTEM, CONTROL DEVICE, KITCHEN LANE SYSTEM CONTROL METHOD, AND STORE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">A47F10/06</main-classification>  
        <further-classification edition="200601120251205B">B65G15/00</further-classification>  
        <further-classification edition="200601120251205B">B65G17/00</further-classification>  
        <further-classification edition="200601120251205B">B65G37/00</further-classification>  
        <further-classification edition="200601120251205B">B65G43/08</further-classification>  
        <further-classification edition="200601120251205B">B65G43/10</further-classification>  
        <further-classification edition="201201120251205B">G06Q50/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商藏壽司股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURA SUSHI, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中邦彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KUNIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">廚房通道系統係具備：裝設於廚房、沿著預定的搬運通路循環搬運商品的循環通道；將根據顧客的訂單所準備的至少一個商品投入循環通道之投入裝置；以及控制投入裝置之控制裝置。循環通道係具備：於第1方向搬運商品的第1搬運區；以及相對於裝設於飲食店的店內之點餐通道而言，位於比第1搬運區還更遠離的位置，在與第1方向不同的方向之第2方向搬運商品之第2搬運區。控制裝置為用於控制投入裝置，且構成為：能夠將至少一個商品投入循環通道中之第1搬運區及第2搬運區中之任一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A kitchen lane system comprises a circulation lane that is installed in the kitchen and circulates along a predetermined transport route to transport products, an input device that inputs at least one product prepared in response to an order from a customer into the circulation lane, and a control device that controls the input device. The circulation lane includes a first transport area for transporting products in a first direction, and a second transport area that is located farther away from the order lane installed inside the restaurant than the first transport area and that transports products in a second direction different from the first direction. The control device is configured to control the input device to input at least one product into either the first transport area or the second transport area in the circulation lane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:商品</p>  
        <p type="p">10:廚房通道系統(店舖系統)</p>  
        <p type="p">12:店內</p>  
        <p type="p">14:廚房</p>  
        <p type="p">16:點餐通道</p>  
        <p type="p">18:座位(餐桌)</p>  
        <p type="p">20:店內終端裝置</p>  
        <p type="p">22:終端裝置(廚房終端裝置)</p>  
        <p type="p">26:監視裝置</p>  
        <p type="p">28:循環通道</p>  
        <p type="p">30A:第1運送裝置</p>  
        <p type="p">30B:第2運送裝置</p>  
        <p type="p">32A:第1投入裝置</p>  
        <p type="p">32B:第2投入裝置</p>  
        <p type="p">34:交付裝置</p>  
        <p type="p">44:讀取機(偵測部)</p>  
        <p type="p">50A、50B:快捷裝置</p>  
        <p type="p">52A、52B:迂迴裝置</p>  
        <p type="p">60A、60B:第1投入用搬運路</p>  
        <p type="p">62A、62B:第2投入用搬運路</p>  
        <p type="p">64A、64B:投入口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1258" publication-number="202611067"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611067.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611067</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123515</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>Ｂ群維生素調節</chinese-title>  
        <english-title>B VITAMIN MODULATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/00</main-classification>  
        <further-classification edition="200601120251201B">C12P21/00</further-classification>  
        <further-classification edition="200601120251201B">C12N5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商建南德克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENENTECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郁　茵　黃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUK, INN HUAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安姚　派翠克　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHYOW, PATRICK DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹　艾希莉　詩　琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, ASHLEY SHI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　當　安　翠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN DANG, ANH THUY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係涉及使重組多肽之醣基化最佳化之方法。亦提供了使重組多肽之電荷模式最佳化之方法。亦提供了使重組多肽之大小分布最佳化之方法。該等方法包含調節細胞培養物中的 B 群維生素含量，該細胞培養物包含經工程改造以表現該重組多肽之細胞株。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to methods of optimizing glycosylation of a recombinant polypeptide. Also provided are methods of optimizing charge pattern of a recombinant polypeptide. Also provided are methods of optimizing size distribution of a recombinant polypeptide. The methods comprise modulating the level of B vitamins in a cell culture comprising a cell line engineered to express the recombinant polypeptide.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1259" publication-number="202611216"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611216.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611216</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123532</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含含有烯烴官能基的多環烯烴聚合物、三聚氰胺及黏土之無鹵無磷低損耗阻燃性組成物</chinese-title>  
        <english-title>HALOGEN FREE AND PHOSPHORUS FREE LOW LOSS FLAME RETARDANT COMPOSITIONS CONTAINING POLYCYCLIC-OLEFINIC POLYMER WITH OLEFINIC FUNCTIONALITY, MELAMINE AND CLAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">C08L23/08</main-classification>  
        <further-classification edition="200601120251201B">C08L45/00</further-classification>  
        <further-classification edition="200601120251201B">C08L47/00</further-classification>  
        <further-classification edition="200601120251201B">C08K3/22</further-classification>  
        <further-classification edition="200601120251201B">C08K3/34</further-classification>  
        <further-classification edition="200601120251201B">C08K3/36</further-classification>  
        <further-classification edition="200601120251201B">C08K3/38</further-classification>  
        <further-classification edition="200601120251201B">C08K5/134</further-classification>  
        <further-classification edition="200601120251201B">C08K5/14</further-classification>  
        <further-classification edition="200601120251201B">C08K5/3445</further-classification>  
        <further-classification edition="200601120251201B">C08K5/3492</further-classification>  
        <further-classification edition="200601120251201B">C08K5/526</further-classification>  
        <further-classification edition="200601120251201B">C08K7/14</further-classification>  
        <further-classification edition="200601120251201B">C08J5/18</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商普羅梅勒斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROMERUS, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崁達那拉曲奇　帕拉蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANDANARACHCHI, PRAMOD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明之實施形態包括一種組成物，其包含由各種多環烯烴單體形成之聚合物（其中至少一種單體包含其他未聚合的乙烯鍵）、三聚氰胺、黏土如膨土或蒙脫石，根據需要的填料如六方氮化硼或二氧化矽、交聯劑、自由基起始劑、增黏劑及一種以上合適的添加劑。本發明的組成物在曝光於合適的高溫下時能夠形成各種三維絕緣物如膜。由本發明的組成物形成之物體顯示出至今未能實現的低介電常數、低損耗特性、阻燃性及極高的熱特性。本發明的組成物可用於各種應用中，包括在毫米波雷達天線中作為絕緣材料等。由本發明的組成物形成之膜顯示出至少為V-1的UL-94等級、未達2.9的介電常數（Dk）及未達0.003的介電損耗因數（Df）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments in accordance with the present invention encompass compositions containing the polymer formed from a variety of polycycloolefinic monomers at least one of which monomer contains an additional unpolymerized ethylenic bond, melamine, clay such as bentonite or montmorillonite, optionally fillers such as hexagonal boron nitride or silica, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, fire-retardancy and very high thermal properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others. The films formed from the compositions of this invention exhibit a UL-94 rating of at least V-1, dielectric constant (Dk) less than 2.9 and dielectric dissipation factor (Df) of less than 0.003.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1260" publication-number="202611946"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611946.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611946</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支援反應器功率分佈量測與放射性同位素生產活動之多用途可移動式核爐心系統</chinese-title>  
        <english-title>A MULTI-USE MOVABLE INCORE SYSTEM TO SUPPORT REACTOR POWER DISTRIBUTION MEASUREMENTS AND RADIOISOTOPE PRODUCTION ACTIVITIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">G21C23/00</main-classification>  
        <further-classification edition="200601120251204B">B25F3/00</further-classification>  
        <further-classification edition="200601120251204B">G21K5/08</further-classification>  
        <further-classification edition="200601120251204B">G21C17/00</further-classification>  
        <further-classification edition="200601120251204B">G01T3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商西屋電器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WESTINGHOUSE ELECTRIC COMPANY LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫保　麥可　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIBEL, MICHAEL D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊克　克里斯托福　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLACK, CHRISTOPHER J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥可阿戴爾　馬修　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCARDLE, MATTHEW D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於與一核反應器一起使用之多用途核爐心系統，該核反應器具有包含一儀表管之一反應器核心。該多用途核爐心系統包括一驅動纜、一中子偵測器、一電磁工具及一輻照目標。該驅動纜在其遠端處包括一配接器。該驅動纜可滑動地接收至該儀表管中。該中子偵測器可移除地附接至該驅動纜之該配接器以監測核心功率分佈。該中子偵測器可藉由該驅動纜可滑動地接收至該儀表管中。該電磁工具可代替該中子偵測器可移除地附接至該驅動纜之該配接器。該輻照目標係用於產生一放射性同位素。該驅動纜可藉由該電磁工具選擇性附接至該輻照目標以將該輻照目標嵌入至該儀表管中及自該儀表管移除該輻照目標。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-use incore system for use with a nuclear reactor having a reactor core including an instrumentation tube is disclosed. The multi-use incore system comprises a drive cable, a neutron detector, an electromagnetic tool, and an irradiation target. The drive cable comprises an adapter at its distal end. The drive cable is slidably receivable into the instrumentation tube. The neutron detector is removably attachable to the adapter of the drive cable to monitor core power distribution. The neutron detector is slidably receivable into the instrumentation tube by the drive cable. The electromagnetic tool is removably attachable to the adapter of the drive cable in lieu of the neutron detector. The irradiation target is to produce a radioisotope. The drive cable is selectively attachable to the irradiation target by the electromagnetic tool to insert the irradiation target into the instrumentation tube and remove the irradiation target from the instrumentation tube.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:反應器核心</p>  
        <p type="p">102:儀表管</p>  
        <p type="p">104:貫穿件</p>  
        <p type="p">1000:可移動式核爐心偵測器系統(MIDS)</p>  
        <p type="p">1100:驅動纜</p>  
        <p type="p">1200:反應器核心儀表管線</p>  
        <p type="p">1300:驅動馬達</p>  
        <p type="p">1310:驅動輪</p>  
        <p type="p">1320:儲存捲筒</p>  
        <p type="p">1500:纜驅動單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1261" publication-number="202610925"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610925.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610925</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123643</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於判定貨櫃輪之貨櫃艙上之貨櫃位置的方法、控制器、定位裝置及電腦程式</chinese-title>  
        <english-title>METHOD, A CONTROLLER, A POSITIONING DEVICE, AND A COMPUTER PROGRAM FOR DETERMINING A POSITION OF A CONTAINER ON A CONTAINER BAY OF A CONTAINER VESSEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">B66C13/46</main-classification>  
        <further-classification edition="200601120251205B">B63B35/40</further-classification>  
        <further-classification edition="200601120251205B">B65G67/60</further-classification>  
        <further-classification edition="201701120251205B">G06T7/70</further-classification>  
        <further-classification edition="202301120251205B">H04N23/45</further-classification>  
        <further-classification edition="202201120251205B">G06V10/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商ＡＢＢ瑞士公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABB SCHWEIZ AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬拉諾　史提芬諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARANO, STEFANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪斯　狄倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAAS, DERAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾斯納利　布魯諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARSENALI, BRUNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述一種用於判定一貨櫃輪(20)之一貨櫃艙(22)上之一貨櫃(24)之一位置的方法。該方法包括：接收來自安裝於一起重機(30)之一結構上之至少一個相機(40、44)之影像資料，其中該起重機(30)之該結構至少部分在該貨櫃艙(22)上方延伸，且其中該等影像資料表示一第一影像及至少一第二影像，各影像展示該貨櫃(24)配置於其中之該貨櫃艙(22)之至少一區域；及藉由一機器學習演算法取決於該等影像資料判定該貨櫃(24)之該位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for determining a position of a container (24) on a container bay (22) of a container vessel (20) is described. The method comprises: receiving image data from at least one camera (40, 44) mounted on a structure of a crane (30), wherein the structure of the crane (30) at least partly extends over the container bay (22) and wherein the image data are representative of a first image and at least a second image each showing at least an area of the container bay (22) in which the container (24) is arranged; and determining the position of the container (24) depending on the image data by a machine learning algorithm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:貨櫃輪</p>  
        <p type="p">22:貨櫃艙</p>  
        <p type="p">24:貨櫃</p>  
        <p type="p">30:起重機</p>  
        <p type="p">32:支撐件</p>  
        <p type="p">34:吊臂</p>  
        <p type="p">36:行車</p>  
        <p type="p">38:吊具</p>  
        <p type="p">39:定位裝置</p>  
        <p type="p">40:第一相機</p>  
        <p type="p">42:第一視場</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1262" publication-number="202611201"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611201.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611201</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123660</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>廢塑膠熱裂解油之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">C08J11/28</main-classification>  
        <further-classification edition="200601120251202B">C10G1/06</further-classification>  
        <further-classification edition="200601120251202B">C10L5/48</further-classification>  
        <further-classification edition="202201320251202B">B09B101/77</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商出光興產股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商環境能量股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENVIRONMENT ENERGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦公平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松廣格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUHIRO, ITARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田修嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, SHUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉木伸茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMAKI, NOBUSHIGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種即使在將含氯樹脂之含有比例偏高之廢塑膠作為原料利用時仍可防止腐蝕等問題而穩定製造熱裂解油之技術。亦即，提供一種廢塑膠熱裂解油之製造方法，特徵在於包含：使包含含氯樹脂之廢塑膠原料熱裂解來製得廢塑膠熱裂解油之步驟，並且，以使洗淨前述熱裂解油後之水的pH大於5.0之方式來調整前述廢塑膠原料中之含氮量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1263" publication-number="202611954"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611954.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611954</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123712</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層型電子零件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01G4/01</main-classification>  
        <further-classification edition="200601120251204B">H01G4/224</further-classification>  
        <further-classification edition="200601120251204B">H01G4/232</further-classification>  
        <further-classification edition="200601120251204B">H01G4/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商京瓷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYOCERA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, HISASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木竜也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴林大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUBAYASHI, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三輪智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIWA, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之積層型電子零件具備積層體、基底電極及外部電極，上述積層體係將內部電極與介電層交替地積層而成。內部電極具有第1內部電極及第2內部電極。基底電極具有第1基底電極及第2基底電極。外部電極具有第1外部電極及第2外部電極。第1基底電極及第2基底電極分別包含由介電粒子形成之複數個燒結體。複數個燒結體中之至少一部分位於各基底電極與積層體之界面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1264" publication-number="202611955"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611955.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611955</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123714</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層陶瓷電容器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251107B">H01G4/30</main-classification>  
        <further-classification edition="200601120251107B">H01G4/228</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富永健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMINAGA, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠提高積層陶瓷電容器之耐濕性之積層陶瓷電容器。 本發明之積層陶瓷電容器10係具備積層體及配置於積層體之4個外部電極之積層陶瓷電容器，積層體具有於積層方向上相對之第1面及第2面、於與積層方向正交之第1方向上相對之第3面及第4面、以及於與積層方向及第1方向正交之第2方向上相對之第5面及第6面。積層體具有：第1內部電極，其一端露出於第3面上，另一端露出於第4面上；及第2內部電極，其一端露出於第3面上，另一端露出於第4面上。將從積層方向觀察時由第3面、第1內部電極及第2內部電極包圍之區域設為第1區域時，第1區域之第1方向之尺寸為5 μm以上，第1區域之第2方向之尺寸為70 μm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積層陶瓷電容器</p>  
        <p type="p">12:積層體</p>  
        <p type="p">12c:第3面</p>  
        <p type="p">12d:第4面</p>  
        <p type="p">12e:第5面</p>  
        <p type="p">12f:第6面</p>  
        <p type="p">14a:內層介電層</p>  
        <p type="p">16a:第1內部電極</p>  
        <p type="p">22a:第1對向電極部</p>  
        <p type="p">24a:第1引出電極部</p>  
        <p type="p">24b:第2引出電極部</p>  
        <p type="p">24c:第3引出電極部</p>  
        <p type="p">24d:第4引出電極部</p>  
        <p type="p">26a:積層體之側部(W間隙)</p>  
        <p type="p">26b:積層體之側部(W間隙)</p>  
        <p type="p">27a:積層體之端部(L間隙)</p>  
        <p type="p">27b:積層體之端部(L間隙)</p>  
        <p type="p">30:外部電極</p>  
        <p type="p">30a:第1外部電極</p>  
        <p type="p">30b:第2外部電極</p>  
        <p type="p">30c:第3外部電極</p>  
        <p type="p">30d:第4外部電極</p>  
        <p type="p">34a:第1下層鍍覆層</p>  
        <p type="p">34b:第2下層鍍覆層</p>  
        <p type="p">34c:第3下層鍍覆層</p>  
        <p type="p">34d:第4下層鍍覆層</p>  
        <p type="p">36a:第1表層鍍覆層</p>  
        <p type="p">36b:第2表層鍍覆層</p>  
        <p type="p">36c:第3表層鍍覆層</p>  
        <p type="p">36d:第4表層鍍覆層</p>  
        <p type="p">40:空隙</p>  
        <p type="p">A&lt;sub&gt;1&lt;/sub&gt;:第1區域</p>  
        <p type="p">A&lt;sub&gt;2&lt;/sub&gt;:第2區域</p>  
        <p type="p">A&lt;sub&gt;3&lt;/sub&gt;:第3區域</p>  
        <p type="p">A&lt;sub&gt;4&lt;/sub&gt;:第4區域</p>  
        <p type="p">a&lt;sub&gt;1&lt;/sub&gt;:第1區域之第1方向之尺寸</p>  
        <p type="p">a&lt;sub&gt;2&lt;/sub&gt;:第2區域之第1方向之尺寸</p>  
        <p type="p">b&lt;sub&gt;1&lt;/sub&gt;:第1區域之第2方向之尺寸</p>  
        <p type="p">b&lt;sub&gt;2&lt;/sub&gt;:第2區域之第2方向之尺寸</p>  
        <p type="p">c&lt;sub&gt;1&lt;/sub&gt;:第3區域之第2方向之尺寸</p>  
        <p type="p">c&lt;sub&gt;2&lt;/sub&gt;:第4區域之第2方向之尺寸</p>  
        <p type="p">d&lt;sub&gt;1&lt;/sub&gt;:第3區域之第1方向之尺寸</p>  
        <p type="p">d&lt;sub&gt;2&lt;/sub&gt;:第4區域之第1方向之尺寸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1265" publication-number="202611309"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611309.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611309</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電氣鋼及電氣鋼加工</chinese-title>  
        <english-title>ELECTRICAL STEEL AND ELECTRICAL STEEL PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C22C38/00</main-classification>  
        <further-classification edition="200601120251210B">C22C38/02</further-classification>  
        <further-classification edition="200601120251210B">C22C38/04</further-classification>  
        <further-classification edition="200601120251210B">C22C38/06</further-classification>  
        <further-classification edition="200601120251210B">C21D8/02</further-classification>  
        <further-classification edition="200601120251210B">C21D8/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商紐柯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUCOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＦＥ鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加洛　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALLO, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬納斯　布萊德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONAS, BRAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉森　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARSON, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村井剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水藤政人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUITO, MASAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤勇人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山茂宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, SHIGEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大久保智幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUBO, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田明男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, AKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多田睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TADA, CHIKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙島稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKASHIMA, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根岸秀光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEGISHI, HIDEMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田令</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, REI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施例係關於一種由鐵單元及優質廢料之一或多種裝料形成之電氣鋼組合物，其中由該一或多種裝料形成之電氣鋼在400 Hz下在1.0T下測試時具有大於或等於1.58 T之B&lt;sub&gt;50&lt;/sub&gt;及小於或等於13.5 W/kg之鐵損。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments are directed to an electrical steel composition formed from one or more charges of iron units and prime scrap, wherein the electrical steel formed from the one or more charges has a B50 greater than or equal to 1.58 T and a core loss less than or equal to 13.5 W/kg when tested at 1.0T at 400 Hz.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:程序流程</p>  
        <p type="p">102:區塊</p>  
        <p type="p">104:區塊</p>  
        <p type="p">106:區塊</p>  
        <p type="p">108:區塊</p>  
        <p type="p">110:區塊</p>  
        <p type="p">112:區塊</p>  
        <p type="p">114:區塊</p>  
        <p type="p">116:區塊</p>  
        <p type="p">118:區塊</p>  
        <p type="p">120:區塊</p>  
        <p type="p">122:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1266" publication-number="202611555"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611555.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611555</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學元件、其製造方法、光學儀器及防反射膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251201B">G02B1/111</main-classification>  
        <further-classification edition="200601120251201B">G02B3/00</further-classification>  
        <further-classification edition="200601120251201B">C09D129/14</further-classification>  
        <further-classification edition="200601120251201B">C09D17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索馬龍股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOMAR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂爪直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAZUME, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種針對光學元件1的防反射膜4，有效地減少雜散光、提高設計性和耐擦傷性的技術。將黏合劑樹脂設為A成分，將聚乙烯縮醛樹脂設為A1成分，將黑色材料設為B成分，黑色顏料和樹脂的複合物設為B1成分。用於光學儀器的光學元件1，於基底構件2的光學有效部外（例如平面部2b）具有防反射膜4。防反射膜4由樹脂組成物形成，至少包含A成分和B成分。A成分包含A1成分。B成分包含平均粒徑為2μm以上且6μm以下的B1成分。相對A成分之B成分的質量比在7以上且14以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1267" publication-number="202610738"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610738.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610738</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123765</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無方向性電磁鋼板用鋼胚的製造方法</chinese-title>  
        <english-title>METHOD OF MANUFACTURING SLABS FOR NONORIENTED ELECTRICAL STEEL SHEET ELECTRICAL STEEL SHEET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B22D11/00</main-classification>  
        <further-classification edition="200601120251201B">C21C7/00</further-classification>  
        <further-classification edition="200601120251201B">C21C7/04</further-classification>  
        <further-classification edition="200601120251201B">C21C7/06</further-classification>  
        <further-classification edition="200601120251201B">C21C7/064</further-classification>  
        <further-classification edition="200601120251201B">C21C7/068</further-classification>  
        <further-classification edition="200601120251201B">C21C7/10</further-classification>  
        <further-classification edition="200601120251201B">C21D8/12</further-classification>  
        <further-classification edition="200601120251201B">C21D9/46</further-classification>  
        <further-classification edition="200601120251201B">C22B9/04</further-classification>  
        <further-classification edition="200601120251201B">C22C38/14</further-classification>  
        <further-classification edition="200601120251201B">H01F1/147</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＦＥ鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商努可爾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUCOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村井剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水藤政人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUITO, MASAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多田睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TADA, CHIKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙島稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKASHIMA, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田明男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, AKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根岸秀光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEGISHI, HIDEMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name></last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, REI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加洛　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALLO, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬納斯　布拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONAS, BRAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉爾森　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARSON, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">無方向性電磁鋼板用鋼胚的製造方法，包含：出鋼步驟，將未脫氧之熔鋼，從電爐出鋼至其與熔渣接觸之面內襯有氧化鎂系耐火物的盛鋼桶；脫碳處理步驟；脫氧處理步驟，從盛鋼桶之上方添加含金屬Al物質；脫氮脫硫處理步驟，攪拌與熔渣接觸之熔鋼；以及鑄造步驟，從出鋼步驟完成後至脫碳處理步驟結束為止之期間，將含CaO及/或Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;物質添加至盛鋼桶內，於脫氮脫硫處理步驟之開始時，將熔渣中之CaO與Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;之質量比C/A(-)，設為1.0以上、1.4以下之範圍，於脫氮脫硫處理步驟之開始時，將熔渣之厚度設為100mm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:熔鋼</p>  
        <p type="p">2:盛鋼桶</p>  
        <p type="p">3:真空罐</p>  
        <p type="p">4:噴嘴(底吹氣體吹入管)</p>  
        <p type="p">5:熔渣</p>  
        <p type="p">21:氧化鎂系耐火物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1268" publication-number="202612095"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612095.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612095</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123784</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱結構化陶瓷台座</chinese-title>  
        <english-title>THERMALLY STRUCTURED CERAMIC PEDESTAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01L21/683</main-classification>  
        <further-classification edition="200601120251205B">F27D5/00</further-classification>  
        <further-classification edition="201501120251205B">B33Y80/00</further-classification>  
        <further-classification edition="200601120251205B">C04B35/581</further-classification>  
        <further-classification edition="200601120251205B">C04B35/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瓦特洛威電子製造公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATLOW ELECTRIC MANUFACTURING COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍　提姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, TIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里薩富利　羅根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRISAFULLI, LOGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　傑森　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, JASON E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種供使用於受控氛圍腔室中之組件，諸如於一半導體處理腔室中之一台座之一軸桿，包括一外壁及從該外壁徑向向內延伸之一徑向壁熱結構化填充圖案。一中空內孔於該組件之一長度內且沿其形成。該組件可使用一增式製造程序形成，以使得複雜的幾何形狀可被建造來減少作業期間之熱損失。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A component for use in controlled atmosphere chambers, such as a shaft of a pedestal in a semiconductor processing chamber, includes an outer wall and a thermally structured infill pattern of radial walls extending from the outer wall radially inward. A hollow internal bore is formed within and along a length of the component. The component may be formed using an additive manufacturing process such that complex geometries can be created to reduce thermal losses during operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:台座，台座總成</p>  
        <p type="p">110:板子</p>  
        <p type="p">112:下表面</p>  
        <p type="p">114:基座部分</p>  
        <p type="p">120:軸桿</p>  
        <p type="p">122:中空內孔</p>  
        <p type="p">124:嵌埋式通路</p>  
        <p type="p">126:外壁</p>  
        <p type="p">128:內壁</p>  
        <p type="p">130:轂體</p>  
        <p type="p">140:電氣功能元件</p>  
        <p type="p">142:加熱電路</p>  
        <p type="p">144:RF天線</p>  
        <p type="p">150:上部分</p>  
        <p type="p">154:下部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1269" publication-number="202611489"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611489.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611489</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123785</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於加熱器組件之早期熱效能評估的方法</chinese-title>  
        <english-title>METHOD FOR EARLY THERMAL PERFORMANCE ASSESSMENT OF A HEATER COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">G01J5/48</main-classification>  
        <further-classification edition="200601120251201B">H05B3/14</further-classification>  
        <further-classification edition="200601120251201B">H05B1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瓦特洛威電子製造公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATLOW ELECTRIC MANUFACTURING COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮塔賽恩斯基　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PTASIENSKI, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章　三紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SANHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約翰尼斯　奧斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHANNES, AUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧頓　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNDON, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">以各種形式提供用於對加熱器組件之效能進行評估的方法及系統。一種方法包括：控制至該加熱器組件的電力；在對該加熱器控制該電力的同時，接收加熱器組件之藉由一感測器所測得的感測器資料；基於該感測器資料而產生該加熱器組件之第一熱影像資料；基於該加熱器組件之一第一模型及該第一熱影像資料而判定該加熱器組件之配電；基於該加熱器組件及包含該加熱器組件的一總成其中至少一者之一第二模型以及該配電而運算該加熱器組件之第二熱影像資料；以及，基於該第二熱影像資料而評估該加熱器組件之一效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In various forms, methods and systems are provided for evaluating the performance of a heater component. A method includes: controlling power to the heater component; receiving sensor data measured, by a sensor, of a heater component while the power is controlled to the heater; generating first thermal image data of the heater component based on the sensor data; determining a power distribution of the heater component based on a first model of the heater component and the first thermal image data; computing second thermal image data of the heater component based on a second model of at least one of the heater component and an assembly comprising the heater component, and the power distribution; and evaluating a performance of the heater component based on the second thermal image data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:處理程序</p>  
        <p type="p">302:操作</p>  
        <p type="p">304:操作</p>  
        <p type="p">306:操作</p>  
        <p type="p">308:操作</p>  
        <p type="p">310:操作</p>  
        <p type="p">312:操作</p>  
        <p type="p">314:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1270" publication-number="202611120"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611120.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611120</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑材料及圖案形成方法</chinese-title>  
        <english-title>RESIST COMPOSITION AND PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/14</main-classification>  
        <further-classification edition="200601120251201B">C08F220/38</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大友雄太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTOMO, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片山和弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAYAMA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐見武志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAMI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辻佳弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUJI, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供超過習知阻劑材料之高感度、高解析度，且LWR小、CDU良好、曝光後之圖案形狀良好的阻劑材料、及圖案形成方法。 &lt;br/&gt;該課題之解決手段為一種阻劑材料，含有： &lt;br/&gt;基礎聚合物，含有下式(a)表示之重複單元及下式(b)表示之重複單元，及 &lt;br/&gt;有機溶劑。 &lt;br/&gt;&lt;img align="absmiddle" height="380px" width="617px" file="ed10149.JPG" alt="ed10149.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resist composition comprising a base polymer comprising repeat units consisting of a carboxylic acid anion having iodine and a specific functional group, bonded to the backbone and an organic cation and repeat units consisting of a sulfonic acid anion bonded to the backbone and a sulfonium cation has a high sensitivity and a high contrast of alkaline dissolution rate before and after exposure. A pattern of satisfactory profile with reduced LWR and improved CDU is formed therefrom.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1271" publication-number="202611243"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611243.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611243</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123824</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塗料組成物及多層塗膜形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250905B">C09D175/04</main-classification>  
        <further-classification edition="201801120250905B">C09D7/40</further-classification>  
        <further-classification edition="200601120250905B">C09D5/02</further-classification>  
        <further-classification edition="200601120250905B">B05D1/36</further-classification>  
        <further-classification edition="200601120250905B">B05D7/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商關西塗料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANSAI PAINT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田浩紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之目的在於提供一種塗料組成物，其能夠形成具有優異的平滑性及鮮映性之外觀之塗膜。本揭示之塗料組成物具有以下構成。&lt;br/&gt; 本揭示之塗料組成物係包含被膜形成樹脂(A)及硬化劑(B)，且該塗料組成物於溫度23℃、頻率0.50Hz、應力測定範圍0.1～100Pa之條件下之動態黏彈性測定中，以應力為0.1Pa時之儲存彈性模數G'1為基準，儲存彈性模數首次減少10%時之應力σ2係於3.5～100Pa之範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1272" publication-number="202612243"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612243.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612243</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123827</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>諧振式電源轉換電路</chinese-title>  
        <english-title>RESONANT POWER CONVERSION CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H02M3/335</main-classification>  
        <further-classification edition="200601120251001B">H02M3/156</further-classification>  
        <further-classification edition="200601120251001B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林梓誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊大勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TA-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉國基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KUO-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐易民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIU, YI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種諧振式電源轉換電路，用以將輸入電壓轉換至輸出電壓，包括變壓器、諧振電容、上橋電晶體、下橋電晶體以及控制電路。變壓器包括初級線圈。諧振電容與初級線圈串接於切換節點。上橋電晶體將輸入電壓提供至切換節點，下橋電晶體將切換節點耦接至接地端。在每一切換週期中，控制電路依序導通上橋電晶體、導通下橋電晶體、再次導通上橋電晶體、再次導通下橋電晶體以及同時關斷上橋電晶體以及下橋電晶體。當下橋電晶體在切換週期中第一次導通後，回應於流經諧振電容之電流降至零且延遲既定時間，控制電路關斷下橋電晶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resonant power conversion circuit for converting an input voltage to an output voltage includes a transformer, a resonant capacitor, a high-side transistor, a low-side transistor, and a control circuit. The transformer includes a primary coil. The resonant capacitor and the primary coil are connected in series to a switch node. The high-side transistor provides the input voltage to the switch node, and the low-side transistor couples the switch node to the ground. In each switch cycle, the control circuit sequentially turns on the high-side transistor, turns on the low-side transistor, turns on the high-side transistor twice, turns on the low-side transistor twice, and simultaneously turns off the high-side transistor and the low-side transistor. After the low-side transistor is turned on first time during the switch cycle, the control circuit turns off the low-side transistor in response to a current flowing through the resonant capacitor falling to zero and delaying a predetermined period.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電源轉換電路</p>  
        <p type="p">TM:變壓器</p>  
        <p type="p">LR:諧振電感</p>  
        <p type="p">CR:諧振電容</p>  
        <p type="p">110:上橋電晶體</p>  
        <p type="p">120:下橋電晶體</p>  
        <p type="p">130:電流偵測電路</p>  
        <p type="p">140:整流電路</p>  
        <p type="p">150:回授電路</p>  
        <p type="p">160:控制電路</p>  
        <p type="p">PS:初級線圈</p>  
        <p type="p">SS:次級線圈</p>  
        <p type="p">NR:諧振節點</p>  
        <p type="p">SW:切換節點</p>  
        <p type="p">VCR:諧振電壓</p>  
        <p type="p">HSG:上橋閘極驅動信號</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">LSG:下橋閘極驅動信號</p>  
        <p type="p">IR:諧振電流</p>  
        <p type="p">SCS:電流偵測信號</p>  
        <p type="p">R1:第一電阻</p>  
        <p type="p">C1:第一電容</p>  
        <p type="p">D1:第一整流元件</p>  
        <p type="p">D2:第二整流元件</p>  
        <p type="p">ID1:第一整流電流</p>  
        <p type="p">ID2:第二整流電流</p>  
        <p type="p">COUT:輸出電容</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">FB:回授信號</p>  
        <p type="p">R2:第二電阻</p>  
        <p type="p">R3:第三電阻</p>  
        <p type="p">DR:穩壓元件</p>  
        <p type="p">PD:光耦合元件</p>  
        <p type="p">R4:第四電阻</p>  
        <p type="p">VD1:第一分壓電壓</p>  
        <p type="p">LED:二極體</p>  
        <p type="p">Q:電晶體</p>  
        <p type="p">161:第一疊加電路</p>  
        <p type="p">162:第一積分電路</p>  
        <p type="p">163:全波整流裝置</p>  
        <p type="p">164:第二積分電路</p>  
        <p type="p">165:驅動電路</p>  
        <p type="p">CMP1:第一比較器</p>  
        <p type="p">SC1:第一斜率補償信號</p>  
        <p type="p">SP:疊加信號</p>  
        <p type="p">SW1:第一開關</p>  
        <p type="p">SW2:第二開關</p>  
        <p type="p">ADD:加法電路</p>  
        <p type="p">OTA:轉導放大器</p>  
        <p type="p">VB:偏壓電壓</p>  
        <p type="p">CINT:積分電容</p>  
        <p type="p">gm:轉導</p>  
        <p type="p">IINT:積分電流</p>  
        <p type="p">INT1:第一積分信號</p>  
        <p type="p">FW:全波整流信號</p>  
        <p type="p">INT2:第二積分信號</p>  
        <p type="p">CP1:第一比較信號</p>  
        <p type="p">CP2:第二比較信號</p>  
        <p type="p">SKD:休止調整電路</p>  
        <p type="p">LT1:第一閂鎖器</p>  
        <p type="p">LH2:第二閂鎖器</p>  
        <p type="p">LH3:第三閂鎖器</p>  
        <p type="p">LH4:第四閂鎖器</p>  
        <p type="p">OR1:第一或閘</p>  
        <p type="p">OR2:第二或閘</p>  
        <p type="p">CMP2:第二比較器</p>  
        <p type="p">DTP:既定延遲電路</p>  
        <p type="p">AND1:第一及閘</p>  
        <p type="p">LSG1:第一下橋閘極驅動信號</p>  
        <p type="p">LSG2:第二下橋閘極驅動信號</p>  
        <p type="p">LSG2B:第二反相下橋閘極驅動信號</p>  
        <p type="p">HS1:第一上橋驅動信號</p>  
        <p type="p">HS2:第二上橋驅動信號</p>  
        <p type="p">HSG1:第一上橋閘極驅動信號</p>  
        <p type="p">HSG2:第二上橋閘極驅動信號</p>  
        <p type="p">SET:設置信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1273" publication-number="202612329"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612329.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612329</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>點雲之幾何的編碼及解碼</chinese-title>  
        <english-title>ENCODING AND DECODING THE GEOMETRY OF A POINT CLOUD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251201B">H04N19/176</main-classification>  
        <further-classification edition="201401120251201B">H04N19/42</further-classification>  
        <further-classification edition="201401120251201B">H04N19/61</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔坤　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAQUET, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉賽爾　賽巴斯欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASSERRE, SEBASTIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示一種用於編碼及解碼一點雲幾何的概念。在一編碼方法中，基於一目前點雲的幾何與一屬性參考點雲的一幾何的一比較，來判定該目前點雲的至少一個幾何部分；基於該屬性參考點雲的屬性，獲得與該目前點雲的該至少一個幾何部分相關聯的屬性的屬性預測子；將該等屬性預測子指派給與該目前點雲的該至少一個幾何部分相關聯的屬性，及基於該屬性預測子，在一位元串流中編碼該目前點雲的該至少一個幾何部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Concepts for encoding and decoding a point cloud geometry are disclosed. In an encoding method, at least one portion of geometry of a current point cloud based on a comparison of the geometry of the current point cloud with a geometry of a reference point cloud for attributes are determined; attribute predictors of attributes associated with the at least one portion of geometry of the current point cloud based on attributes of the reference point cloud for attributes are obtained; the attribute predictors to attributes associated with the at least one portion of geometry of the current point cloud are assigned, and, in a bitstream, the at least one portion of geometry of the current point cloud based on the attribute predictor are encoded.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1222:幾何部分</p>  
        <p type="p">1231:模式資訊</p>  
        <p type="p">1310:方塊</p>  
        <p type="p">1311:經選擇屬性寫碼模式</p>  
        <p type="p">1320:方塊</p>  
        <p type="p">1321:MV場</p>  
        <p type="p">1322:屬性參考點雲</p>  
        <p type="p">1323:已經寫碼部分</p>  
        <p type="p">1324:屬性預測子</p>  
        <p type="p">1330:方塊</p>  
        <p type="p">2722:幾何部分</p>  
        <p type="p">2730:方塊</p>  
        <p type="p">2732:屬性資訊</p>  
        <p type="p">2733:經解碼屬性</p>  
        <p type="p">2800:程序</p>  
        <p type="p">2810:方塊</p>  
        <p type="p">2890:位元串流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1274" publication-number="202612330"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612330.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612330</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123844</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>點雲之幾何的編碼及解碼</chinese-title>  
        <english-title>ENCODING AND DECODING THE GEOMETRY OF A POINT CLOUD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251201B">H04N19/176</main-classification>  
        <further-classification edition="201401120251201B">H04N19/42</further-classification>  
        <further-classification edition="201401120251201B">H04N19/61</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉賽爾　賽巴斯欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASSERRE, SEBASTIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔坤　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAQUET, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示一種用於編碼及解碼一點雲幾何的概念。在一編碼方法中，將一目前點雲的一幾何分段成幾何部分之一集合，其中各幾何部分包含該目前點雲中之至少一個點；基於各部分幾何，針對幾何部分之該集合中之各幾何部分選擇一屬性寫碼模式；基於該經選擇屬性寫碼模式，編碼與各幾何部分相關聯的屬性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Concepts for encoding and decoding a point cloud geometry are disclosed. In an encoding method, a geometry of a current point cloud into a set of portions of geometry is segmented, wherein each portion of geometry comprises at least one point of the current point cloud; for each portion of geometry of the set of portions of geometry, an attribute coding mode is selected based on each portion geometry; attributes associated with each portion of geometry based on the selected attribute coding mode are encoded.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1222:幾何部分</p>  
        <p type="p">1230:方塊</p>  
        <p type="p">1320:方塊</p>  
        <p type="p">1321:MV場</p>  
        <p type="p">1322:屬性參考點雲</p>  
        <p type="p">1323:已經寫碼部分</p>  
        <p type="p">1324:屬性預測子</p>  
        <p type="p">1330:方塊</p>  
        <p type="p">2600:程序</p>  
        <p type="p">2610:方塊</p>  
        <p type="p">2611:屬性寫碼模式</p>  
        <p type="p">2622:幾何部分</p>  
        <p type="p">2631:模式資訊</p>  
        <p type="p">2632:屬性資訊</p>  
        <p type="p">2633:經解碼屬性</p>  
        <p type="p">2690:位元串流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1275" publication-number="202610982"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610982.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610982</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123848</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋶鹽型單體、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>SULFONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C59/135</main-classification>  
        <further-classification edition="200601120251201B">C07C65/05</further-classification>  
        <further-classification edition="200601120251201B">C07C65/21</further-classification>  
        <further-classification edition="200601120251201B">C07C69/773</further-classification>  
        <further-classification edition="200601120251201B">C07C309/73</further-classification>  
        <further-classification edition="200601120251201B">C07C381/00</further-classification>  
        <further-classification edition="200601120251201B">C07D327/08</further-classification>  
        <further-classification edition="200601120251201B">C07D333/76</further-classification>  
        <further-classification edition="200601120251201B">C09K3/00</further-classification>  
        <further-classification edition="200601120251201B">C08F212/14</further-classification>  
        <further-classification edition="200601120251201B">C08F212/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供：在使用高能射線之光微影中，係溶劑溶解性優異、高感度、高對比度，且EL、LWR、CDU、DOF等微影性能優異，同時即便在微細圖案形成中仍抗圖案崩塌強，蝕刻耐性亦優異的化學增幅阻劑組成物中使用的鋶鹽型單體；包含來自該鋶鹽型單體之重複單元的聚合物；包含該聚合物的化學增幅阻劑組成物；以及使用該化學增幅阻劑組成物的圖案形成方法。 &lt;br/&gt;本發明之解決手段為下式(a)表示之鋶鹽型單體。 &lt;br/&gt;&lt;img align="absmiddle" height="112px" width="431px" file="ed10455.JPG" alt="ed10455.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sulfonium salt monomer having the formula (a). &lt;br/&gt;&lt;img align="absmiddle" height="112px" width="431px" file="ed10456.JPG" alt="ed10456.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1276" publication-number="202611202"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611202.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611202</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123863</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層結構基板用氟樹脂膜、多層結構基板用氟樹脂膜之製造方法、覆銅積層板、多層結構基板、多層結構基板之製造方法以及電路基板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">C08K3/013</main-classification>  
        <further-classification edition="200601120251201B">C08L27/18</further-classification>  
        <further-classification edition="200601120251201B">C08J5/18</further-classification>  
        <further-classification edition="200601120251201B">B32B15/082</further-classification>  
        <further-classification edition="200601120251201B">B32B27/20</further-classification>  
        <further-classification edition="200601120251201B">B32B27/30</further-classification>  
        <further-classification edition="200601120251201B">B32B37/06</further-classification>  
        <further-classification edition="200601120251201B">B32B37/10</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification>  
        <further-classification edition="200601120251201B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商霓佳斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NICHIAS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤木洋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKI, HIRONARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉智和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, TOMOKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田村雅信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMURA, MASANOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇梶友乃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UKAJI, YUNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種多層結構基板用氟樹脂膜、多層結構基板用氟樹脂膜之製造方法、覆銅積層板、多層結構基板、多層結構基板之製造方法以及電路基板，其能夠在不使用黏著劑的情況下製造在高頻通訊時傳輸損耗較少的多層結構基板。一種多層結構基板用氟樹脂膜，包括氟樹脂以及分散於所述氟樹脂中的無機填料，其中介電損耗正切Df為0.0013以下，溫度350°C時的損耗彈性模數為1.6MPa以上，所述多層結構基板用氟樹脂膜，是用於將多個兩層結構覆銅積層板，在無黏著劑的狀態下接合以製造多層結構基板的用途的膜，所述兩層結構覆銅積層板是將銅箔與所述多層結構基板用氟樹脂膜積層而成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:電路圖案</p>  
        <p type="p">300:多層結構基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1277" publication-number="202611110"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611110.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611110</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123871</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自由基聚合控制劑、自由基聚合用組成物及聚合物之製造方法</chinese-title>  
        <english-title>RADICAL POLYMERIZATION CONTROL AGENT, COMPOSITION FOR RADICAL POLYMERIZATION AND METHOD FOR PRODUCING POLYMER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F118/08</main-classification>  
        <further-classification edition="200601120251201B">C08F126/10</further-classification>  
        <further-classification edition="200601120251201B">C08F16/06</further-classification>  
        <further-classification edition="200601120251201B">C08F293/00</further-classification>  
        <further-classification edition="200601120251201B">C08F2/38</further-classification>  
        <further-classification edition="200601120251201B">C08F4/04</further-classification>  
        <further-classification edition="200601120251201B">C08F8/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土屋日奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIYA, HINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高山拓未</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAYAMA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>犬伏康貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INUBUSHI, YASUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自由基聚合控制劑，其包含有機化合物(A)，該有機化合物(A)係最高佔用分子軌域(HOMO)的電子能量與最低未佔用分子軌域(LUMO)的電子能量之差為0.0770Hartree以上0.130Hartree以下。此種自由基聚合控制劑係除了分子量控制性高之外，聚合速度亦高。因此，若依據該自由基聚合控制劑，可一邊精密地控制分子排列，一邊以高聚合速度且生產性佳地合成聚合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1278" publication-number="202611101"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611101.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611101</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123966</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光硬化性樹脂組成物的硬化方法、使用該硬化方法之接著、密封及塗覆方法、以及其硬化物</chinese-title>  
        <english-title>METHOD FOR CURING PHOTOCURABLE RESIN COMPOSITIONS, BONDING, SEALING AND COATING METHODS USING THE SAME, AND CURED PRODUCTS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F2/48</main-classification>  
        <further-classification edition="200601120251201B">C08F122/10</further-classification>  
        <further-classification edition="200601120251201B">C08L35/02</further-classification>  
        <further-classification edition="200601120251201B">C08K5/01</further-classification>  
        <further-classification edition="200601120251201B">C08K5/3467</further-classification>  
        <further-classification edition="200601120251201B">C08K5/357</further-classification>  
        <further-classification edition="200601120251201B">C09J4/02</further-classification>  
        <further-classification edition="200601120251201B">C09J11/06</further-classification>  
        <further-classification edition="200601120251201B">C09J5/00</further-classification>  
        <further-classification edition="200601120251201B">C09D4/02</further-classification>  
        <further-classification edition="201801120251201B">C09D7/63</further-classification>  
        <further-classification edition="200601120251201B">C09K3/10</further-classification>  
        <further-classification edition="200601120251201B">B05D3/06</further-classification>  
        <further-classification edition="200601120251201B">H01L23/29</further-classification>  
        <further-classification edition="200601120251201B">H01L23/31</further-classification>  
        <further-classification edition="200601120251201B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納美仕有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大坪広大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUBO, KODAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤信雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, NOBUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩谷一希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAYA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永田理恵子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATA, RIEKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供：使用光子上轉換機制將光硬化性樹脂組成物於大氣條件下硬化之方法，該方法可兼具光硬化性樹脂組成物之表面硬化性及深部硬化性、使用該硬化方法之接著、密封及塗覆方法、以及其硬化物。 &lt;br/&gt;本發明係提供：包含在大氣條件下，對包含聚合性化合物之光硬化性樹脂組成物，同時或依序照射波長500nm以下的光及波長超過500nm之光，並至少使用光子上轉換機制使前述聚合性化合物聚合之步驟之光硬化性樹脂組成物的硬化方法、使用該硬化方法之接著、密封及塗覆方法、以及其硬化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to provide a method for curing photocurable resin compositions under atmospheric conditions using a photon upconversion mechanism, which achieves both surface curability and deep curability of the photocurable resin compositions, bonding, sealing and coating methods using the same curing method, as well as cured products thereof. &lt;br/&gt;Provided as solutions in the present invention are a method for curing photocurable resin compositions, bonding, sealing and coating methods using the curing method, and cured products thereof. The curing method includes the following steps: simultaneously or sequentially irradiating a photocurable resin composition containing a polymerizable compound with light having a wavelength of 500 nm or less and light having a wavelength of more than 500 nm under atmospheric conditions; and polymerizing the polymerizable compound by at least using a photon upconversion mechanism.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1279" publication-number="202611232"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611232.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611232</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123969</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光硬化性樹脂組成物、接著劑、密封材、塗覆劑、硬化物、半導體裝置、電子零件、以及使用光硬化性樹脂組成物之硬化、接著、密封及塗覆方法</chinese-title>  
        <english-title>PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, ENCAPSULANT, COATING, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING AND COATING METHODS USING A PHOTOCURABLE RESIN COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08L79/04</main-classification>  
        <further-classification edition="200601120251201B">C08K5/01</further-classification>  
        <further-classification edition="200601120251201B">C08K5/3467</further-classification>  
        <further-classification edition="200601120251201B">C09K3/10</further-classification>  
        <further-classification edition="200601120251201B">C09D179/04</further-classification>  
        <further-classification edition="201801120251201B">C09D7/63</further-classification>  
        <further-classification edition="200601120251201B">C09J179/04</further-classification>  
        <further-classification edition="200601120251201B">C09J11/06</further-classification>  
        <further-classification edition="200601120251201B">B05D3/06</further-classification>  
        <further-classification edition="200601120251201B">H01L23/29</further-classification>  
        <further-classification edition="200601120251201B">H01L23/31</further-classification>  
        <further-classification edition="200601120251201B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納美仕有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大坪広大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUBO, KODAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊藤信雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, NOBUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩谷一希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAYA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永田理恵子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATA, RIEKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種僅靠光照射即可完成硬化而無須經由加熱來進行正式硬化之光硬化性樹脂組成物、包含該光硬化性樹脂組成物之接著劑、密封材或塗覆劑、其硬化物、包含該硬化物之半導體裝置或電子零件、以及使用光硬化性樹脂組成物之硬化方法、接著方法、密封方法及塗覆方法。 &lt;br/&gt;本發明係提供一種包含(A)馬來醯亞胺化合物及(B)光子上轉換材料之光硬化性樹脂組成物、包含該光硬化性樹脂組成物之接著劑、密封材或塗覆劑、其硬化物、包含該硬化物之半導體裝置或電子零件，以及使用光硬化性樹脂組成物之硬化方法、接著方法、密封方法及塗覆方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An objective of the present invention is to provide a photocurable resin composition that cures completely by light irradiation alone and does not need thermal curing; an adhesive, encapsulant, or coating containing the same; a cured product thereof; a semiconductor device or electronic component containing the cured product; and curing, bonding, sealing and coating methods using the photocurable resin composition. &lt;br/&gt;Provided in the present invention are a photocurable resin composition containing (A) a maleimide compound and (B) a photon upconversion material; an adhesive, encapsulant or coating containing the same; a cured product thereof; a semiconductor device or electronic component containing the cured product; and curing, bonding, sealing and coating methods using the photocurable resin composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1280" publication-number="202612240"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612240.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612240</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123970</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在輸入電壓ＶＩＮ與輸出電壓ＶＯＵＴ之間執行直流對直流（ＤＣ－ＤＣ）電壓轉換的電路</chinese-title>  
        <english-title>ELECTRICAL CIRCUIT CONFIGURED TO PERFORM A DC TO DC VOLTAGE CONVERSION BETWEEN AN INPUT VOLTAGE VIN AND AN OUTPUT VOLTAGE VOUT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02M3/158</main-classification>  
        <further-classification edition="200601120251201B">H02M3/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛比克微系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EPIC MICROSYSTEMS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內格魯　勞倫蒂烏　索林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEGRU, LAURENTIU SORIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃夫蒂米　薩賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EFTIMIE, SABIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案揭示一種混合式直流-直流（DC-DC）轉換器。其中一個實施例為一電路，其被配置以在輸入電壓與輸出電壓之間執行直流-直流電壓轉換。該電路可包括第一電性網路，該第一電性網路連接於輸入節點與輸出節點之間。該第一電性網路可包含八個切換電晶體，其中六個切換電晶體以交叉耦合方式連接。該電路可進一步包括第二電性網路，該第二電性網路連接於一切換節點與一接地節點之間，並具有六個飛跨電容（flying capacitors）分別連接於第一電性網路與第二電性網路之間。該電路亦可包括一電感器，該電感器連接於該切換節點與該輸出節點之間。在一實施例中，該直流-直流電壓轉換涉及四種不同切換系統狀態的循環週期，每一切換系統狀態對應於該電路中一特定的電流路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Hybrid DC-DC converters are described. One aspect is an electrical circuit configured to perform a DC-DC voltage conversion between an input voltage and an output voltage. The electrical circuit may include a first electrical network connected between an input node and an output node. The first electrical network may include eight switching transistors, with six of the eight switching transistors being cross-coupled. The electrical circuit may further include a second electrical network connected between a switching node and a ground node, and six flying capacitors connected between the first electrical network and the second electrical network. The electrical circuit may also include an inductor connected between the switching node and the output node. In an aspect, the DC-DC voltage conversion involves a repeated cycle of four distinct switching system states, with each switching system state being associated with a distinct electric current path through the electrical circuit..</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:混合式DC-DC轉換器</p>  
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;in&lt;/i&gt;
        &lt;/sub&gt;:輸入電壓</p>  
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;out&lt;/i&gt;
        &lt;/sub&gt;:輸出電壓</p>  
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;LX&lt;/i&gt;
        &lt;/sub&gt;:電壓</p>  
        <p type="p">Q1,Q2,Q3,Q4,Q5,Q6,Q7,Q8,Q9,Q10,Q11,Q12:切換電晶體</p>  
        <p type="p">C1,C2,C3,C4,C5,C6:飛跨電容</p>  
        <p type="p">PGND:電源接地</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1281" publication-number="202611173"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611173.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611173</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123994</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體之圖型形成方法及用於該方法之組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G73/10</main-classification>  
        <further-classification edition="200601120251201B">C08L79/08</further-classification>  
        <further-classification edition="200601120251201B">C08K3/22</further-classification>  
        <further-classification edition="200601120251201B">B32B27/08</further-classification>  
        <further-classification edition="200601120251201B">B32B27/20</further-classification>  
        <further-classification edition="200601120251201B">B32B27/28</further-classification>  
        <further-classification edition="200601120251201B">B32B27/30</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/09</further-classification>  
        <further-classification edition="200601120251201B">G03F7/11</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G09F9/30</further-classification>  
        <further-classification edition="200601120251201B">H05B33/22</further-classification>  
        <further-classification edition="202501120251201B">H10H20/854</further-classification>  
        <further-classification edition="202501120251201B">H10H20/856</further-classification>  
        <further-classification edition="202301120251201B">H10K59/122</further-classification>  
        <further-classification edition="202301120251201B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森元雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIMOTO, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畑中真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATANAKA, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松山元信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUYAMA, MOTONOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供阻劑下層膜形成用組成物，其係用以形成配置在基板與光吸收性阻劑膜之間的阻劑下層膜之阻劑下層膜形成用組成物，其特徵為 &lt;br/&gt;　　前述阻劑下層膜形成用組成物係含有：鹼可溶性樹脂、與具有光反射性及光散射性之至少任一者的粒子、與溶劑， &lt;br/&gt;　　燒成前述阻劑下層膜形成用組成物所形成之前述阻劑下層膜，相對於用以形成前述光吸收性阻劑膜之阻劑材料所含有之溶劑，顯示溶劑耐性，相對於前述光吸收性阻劑膜的鹼顯影液，顯示溶解性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1282" publication-number="202612194"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612194.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612194</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123997</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電氣零件用插座</chinese-title>  
        <english-title>SOCKET FOR ELECTRIC COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01R13/629</main-classification>  
        <further-classification edition="200601120251201B">H01R13/639</further-classification>  
        <further-classification edition="200601120251201B">H01R33/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商恩普拉斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENPLAS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萩原嘉伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGIWARA, YOSHINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可抑制電氣零件的端子的損壞及電氣零件的頂面的刮痕的發生的電氣零件用插座。電氣零件用插座係具備：可動支持構件，係以可往上下方向移動的方式設於插座本體的一端側；蓋體構件，其基端側以可旋轉的方式與可動支持體的支持部連結；操作桿構件，其基端側以可旋轉的方式與插座本體的一端側連結；以及連桿構件，其基端側以可旋轉的方式與插座本體的另一端側連結。蓋體構件的一部分係藉由蓋體構件之關閉方向的旋轉動作而卡止於連桿構件的被卡止部。藉由操作桿構件之關閉方向的旋轉動作而使被卡止部及支持部將蓋體構件往下壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a socket for electric component that is capable of suppressing occurrence of damages to terminals of an electric component and scratches on an upper surface of the electric component. The socket for electric component includes: a movable support member that is disposed at one end side of a socket body and capable of moving in an up and down direction; a cover member whose base end side is rotatably connected to a support part of the movable support member; a lever member whose base end side is rotatably connected to one end side of the socket body; and a link member whose base end side is rotatably connected to the other end side of the socket body. A part of the cover member engages with a part-to-be-engaged of the link member by a rotational movement of the cover member in a closing direction. The part-to-be-engaged and the support part push down the cover member by a rotational movement of the lever member in the closing direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電氣零件用插座</p>  
        <p type="p">12:插座本體</p>  
        <p type="p">14:底板</p>  
        <p type="p">16:固定框架</p>  
        <p type="p">18:連結框架</p>  
        <p type="p">20:觸針單元</p>  
        <p type="p">22:下側板</p>  
        <p type="p">24:上側板</p>  
        <p type="p">26:浮板(收容部)</p>  
        <p type="p">26f:載置面</p>  
        <p type="p">28:可動支持構件</p>  
        <p type="p">32:蓋體構件</p>  
        <p type="p">34:蓋體構件本體</p>  
        <p type="p">36:按壓構件</p>  
        <p type="p">38:閂扣構件</p>  
        <p type="p">44:旋轉軸(鉸鏈軸)</p>  
        <p type="p">46:操作桿構件</p>  
        <p type="p">48:連桿構件</p>  
        <p type="p">50:旋轉銷(鉸鏈銷)</p>  
        <p type="p">52:被卡止部</p>  
        <p type="p">56:按壓機構(第一連動機構)</p>  
        <p type="p">62:凸輪機構(第二連動機構)</p>  
        <p type="p">P:電氣零件</p>  
        <p type="p">BD:後方向</p>  
        <p type="p">DD:下方向</p>  
        <p type="p">LD:左方向</p>  
        <p type="p">RD:右方向</p>  
        <p type="p">UD:上方向</p>  
        <p type="p">FD:前方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1283" publication-number="202611121"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611121.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611121</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學增幅負型阻劑組成物及阻劑圖案形成方法</chinese-title>  
        <english-title>CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/14</main-classification>  
        <further-classification edition="200601120251201B">C08F212/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="201201120251201B">G03F1/24</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>船津顕之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNATSU, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増永恵一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUNAGA, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小竹正晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOTAKE, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松澤雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUZAWA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供具有優良之蝕刻耐性、及有機溶劑溶解性，且含有能產生具有適當的酸強度且擴散小之酸之聚合物鍵結型酸產生劑的化學增幅負型阻劑組成物、以及使用該化學增幅阻劑組成物之阻劑圖案形成方法。 &lt;br/&gt;本發明之解決手段係一種化學增幅負型阻劑組成物，含有(A)基礎聚合物，該(A)基礎聚合物包含含有下式(A1)表示之重複單元及下式(A2)表示之重複單元，且藉由酸之作用而對於鹼水溶液之溶解性減少的聚合物。 &lt;br/&gt;&lt;img align="absmiddle" height="342px" width="506px" file="ed10287.JPG" alt="ed10287.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chemically amplified negative resist composition containing (A) a base polymer containing a polymer which contains a repeat unit having formula (A1) and a repeat unit having formula (A2), the polymer being adapted to decrease its solubility in an aqueous alkaline solution under an action of an acid. &lt;br/&gt;&lt;img align="absmiddle" height="346px" width="492px" file="ed10288.JPG" alt="ed10288.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1284" publication-number="202610867"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610867.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610867</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124051</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液壓控制單元及跨騎式車輛</chinese-title>  
        <english-title>HYDRAULIC PRESSURE CONTROL UNIT AND STRADDLE-TYPE VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">B60T8/40</main-classification>  
        <further-classification edition="200601120251209B">F04B53/14</further-classification>  
        <further-classification edition="200601120251209B">F04B53/12</further-classification>  
        <further-classification edition="200601120251209B">F04B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>ＮＡ　耐克　維賈揚　蘇巴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, NIKE VIJAYAN SUBHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪　文妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WENNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明獲得一種液壓控制單元，上述液壓控制單元相較於以往能夠進行小型化，且能夠抑制液壓控制單元之運轉中之回動彈簧的徑方向之移動。上述液壓控制單元具備使將輪缸與主缸連通之內部流路之剎車液移動之泵，上述泵具備：活塞部，將輸入側端部推壓至馬達，劃分側端部插入上述壓縮室，對該壓縮室進行劃分；及回動彈簧，設置於上述活塞部之外側，將上述活塞部朝向上述馬達進行推壓，上述活塞部具備：階部，設置於該活塞部之外周部，供上述回動彈簧之活塞部側端部抵接，沿著朝向上述馬達之方向被上述回動彈簧推壓；及擴徑部，與上述活塞部側端部之內周部相向設置，直徑伴隨著靠近上述階部而擴大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To obtain a hydraulic pressure control unit capable of having a reduced size as compared with a conventional hydraulic pressure control unit and suppressing radial movement of a return spring during operation of the hydraulic pressure control unit. &lt;br/&gt;The hydraulic pressure control unit includes a pump that transfers brake fluid in an internal channel that causes a wheel cylinder and a master cylinder to communicate with one another. The pump includes a piston part and a return spring. The piston part includes an input-side end portion that is pressed by a motor and a partition-side end portion that is inserted into the compression chamber to partition the compression chamber. The return spring is provided on an outer side of the piston part and presses the piston part toward the motor. The piston part includes a stepped portion and an increased-diameter portion. The stepped portion is provided to an outer peripheral portion of the piston part in such a manner as to be in contact with a piston-part-side end portion of the return spring and is pressed by the return spring in a direction toward the motor. The increased-diameter portion is provided to be opposed to an inner peripheral portion of the piston-part-side end portion and has a diameter increasing toward the stepped portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:泵</p>  
        <p type="p">51:缸體</p>  
        <p type="p">52:壓縮室</p>  
        <p type="p">53、68:排出流路</p>  
        <p type="p">54、64:階部</p>  
        <p type="p">55:活塞部</p>  
        <p type="p">55a:輸入側端部</p>  
        <p type="p">55b:劃分側端部</p>  
        <p type="p">56:第一活塞構件</p>  
        <p type="p">57:第一零件</p>  
        <p type="p">58:第二零件</p>  
        <p type="p">61:第二活塞構件</p>  
        <p type="p">62:擴徑部</p>  
        <p type="p">64a:面</p>  
        <p type="p">65:流入流路</p>  
        <p type="p">66:回動彈簧</p>  
        <p type="p">66a:活塞部側端部</p>  
        <p type="p">67:蓋部</p>  
        <p type="p">70:流入側止回閥</p>  
        <p type="p">71:球</p>  
        <p type="p">72:彈簧</p>  
        <p type="p">73:座部</p>  
        <p type="p">75:流出側止回閥</p>  
        <p type="p">85:保持器</p>  
        <p type="p">86:過濾器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1285" publication-number="202610739"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610739.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610739</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124070</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連續鑄造用模鑄粉</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B22D11/108</main-classification>  
        <further-classification edition="200601120251201B">C22C38/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大野浩之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHNO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小田垣智也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODAGAKI, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤堂渉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TODO, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸本龍介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIMOTO, RYUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤村誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMURA, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係可廉價地提供連續鑄造高Al鋼時，可製造高品質之鑄片及防止操作故障的連續鑄造用模鑄粉。本發明的連續鑄造用模鑄粉係具有由骨材碳、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、BaO、CaO、Li&lt;sub&gt;2&lt;/sub&gt;O、MgO、氟化合物、及剩餘部分為不可避免之雜質所構成的成分所組成，全C含有量：0.5~5.0質量%、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;含有量：17~25質量%、Ba以BaO換算的含有量：22~30質量%、Ca以CaO換算的含有量：31~41質量%、Li以Li&lt;sub&gt;2&lt;/sub&gt;O換算的含有量：2.0~5.0質量%、Mg以MgO換算的含有量：0.8~2.0質量%、F含有量：12~20質量%、上述不可避免之雜質的合計含有量：2.0質量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1286" publication-number="202611704"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611704.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611704</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124114</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料處理單元</chinese-title>  
        <english-title>DATA PROCESSING UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">G06F9/38</main-classification>  
        <further-classification edition="201801120251201B">G06F9/30</further-classification>  
        <further-classification edition="200601120251201B">G06F9/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布羅瑟斯三世　約翰韋克菲爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROTHERS III, JOHN WAKEFIELD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽姆斯　多米尼克雨果</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYMES, DOMINIC HUGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅絲瑪琳　艾略特莫里斯西蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSEMARINE, ELLIOT MAURICE SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧爾森　傑斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLSON, JENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼伯格　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NYBERG, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊姆克　奧拉馬庫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEMBKE, OLA MARKUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種資料處理單元，其包含一處置單元，該處置單元經組態以將包括第一操作及第二操作的叫用資料發送至一執行單元，以使該執行單元處理該叫用資料。該執行單元藉由以下處理該資料：基於一第一操作的一邏輯源管道從一非本機儲存器獲得資料，對從該邏輯源管道接收的該資料的部分執行該第一操作及一第二操作。回應於參考一邏輯轉發管道的該第一操作的輸出及該第二操作的輸入，該執行單元針對該資料的一部分執行該第一操作及該第二操作的處理，而不將該第一操作的該輸出資料儲存在該非本機儲存器中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data processing unit is provided comprising a handling unit configured to send invocation data including the first and second operation to an execution unit to cause the execution unit to process the invocation data. The execution unit processes the data by: obtaining data from a non-local storage based on a logical source pipe of a first operation, performing the first and a second operation for portions of the data received from the logical source pipe. In response to the output of the first operation and input of the second operation referring to a logical forwarding pipe, the execution unit performs processing for a portion of the data for the first and second operation without storing the output data of the first operation in the non-local storage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:圖表；步驟</p>  
        <p type="p">1110:區段1；區段</p>  
        <p type="p">1120:區段2；區段</p>  
        <p type="p">1130:區段3；區段</p>  
        <p type="p">1140:區段</p>  
        <p type="p">1150:區段</p>  
        <p type="p">1160:區段</p>  
        <p type="p">1170:區段</p>  
        <p type="p">1210:管道</p>  
        <p type="p">1220:管道</p>  
        <p type="p">1230:管道</p>  
        <p type="p">1240:管道</p>  
        <p type="p">1250:管道</p>  
        <p type="p">1260:管道</p>  
        <p type="p">1270:管道</p>  
        <p type="p">1280:管道</p>  
        <p type="p">1290:管道</p>  
        <p type="p">1310:子圖表</p>  
        <p type="p">1320:子圖表</p>  
        <p type="p">1330:子圖表</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1287" publication-number="202611330"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611330.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611330</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有受控氣相沉積均勻性的噴頭</chinese-title>  
        <english-title>SHOWERHEAD WITH CONTROLLED VAPOR DEPOSITION UNIFORMITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C23C16/455</main-classification>  
        <further-classification edition="200601120251201B">C23C16/52</further-classification>  
        <further-classification edition="200601120251201B">H01L21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　偉雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM, HYMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信宰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, SHINJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZIYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉雲臺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YUN-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯奇霍夫　文斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRCHHOFF, VINCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳典曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, DIEN-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聞成語</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, CHENGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">氣相沉積腔室的噴頭面板，具有厚度以及位於面板中心與周邊邊緣之間的複數個區域。該面板包括複數個氣體開口，複數個開口的每個開口的整體長度延伸穿過噴頭面板的厚度，整體長度由具有上部長度的上部和具有下部長度的下部所定義，上部具有第一直徑，下部具有小於第一直徑的第二直徑，其中在第一區域中，第一部分的複數個氣體開口的下部長度與在第二區域中，第二部分的複數個氣體開口的下部長度不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vapor deposition chamber showerhead faceplate having a thickness and a plurality of zones between a center of the faceplate and the peripheral edge. The faceplate includes a plurality of gas openings, each of the plurality of gas openings comprising an overall length that extends through the thickness of the showerhead faceplate, the overall length defined by an upper part having an upper part length and a lower part having a lower part length, the upper part having a first diameter and the lower part having a second diameter that is less than the first diameter, wherein the lower part length of a first portion of the plurality of gas openings in a first zone is different than the lower part length of a second portion of the plurality of gas openings in a second zone.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:上表面</p>  
        <p type="p">202:下表面</p>  
        <p type="p">211:噴頭面板</p>  
        <p type="p">222:氣體開口</p>  
        <p type="p">222L:下部</p>  
        <p type="p">222U:上部</p>  
        <p type="p">225:周邊邊緣</p>  
        <p type="p">C:中心</p>  
        <p type="p">d:直徑</p>  
        <p type="p">D1:第一直徑</p>  
        <p type="p">D2:第二直徑</p>  
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;:下部長度</p>  
        <p type="p">L&lt;sub&gt;2&lt;/sub&gt;:下部長度</p>  
        <p type="p">L&lt;sub&gt;3&lt;/sub&gt;:下部長度</p>  
        <p type="p">t:厚度</p>  
        <p type="p">U&lt;sub&gt;1&lt;/sub&gt;:上部長度</p>  
        <p type="p">U&lt;sub&gt;2&lt;/sub&gt;:上部長度</p>  
        <p type="p">U&lt;sub&gt;3&lt;/sub&gt;:上部長度</p>  
        <p type="p">Z1:外周邊區域</p>  
        <p type="p">Z2:中間區域</p>  
        <p type="p">Z3:中央區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1288" publication-number="202611958"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611958.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611958</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鍵盤按鍵</chinese-title>  
        <english-title>KEYSWITCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251106B">H01H13/7065</main-classification>  
        <further-classification edition="200601120251106B">H01H13/705</further-classification>  
        <further-classification edition="200601120251106B">H01H13/70</further-classification>  
        <further-classification edition="200601120251106B">H01H13/14</further-classification>  
        <further-classification edition="200601120251106B">G06F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達方電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARFON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種鍵盤按鍵。鍵盤按鍵包括一鍵帽。鍵帽具有一鍵頂以及一鍵裙。鍵裙圍繞鍵頂並朝下朝外延伸。鍵裙具有複數裙角與複數裙邊。鍵裙之複數裙角與複數裙邊可供光線分別穿過。鍵裙具有環狀的一裙底面。裙底面由複數側底面和複數角底面所構成。角底面之寬度對側底面之寬度的比值位於1與3之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A keyswitch is provided. The keyswitch comprises a keycap. The keycap has a key top and a key skirt. The key skirt surrounds the key top and extends downward and outward. The key skirt includes a plurality of skirt corners and a plurality of skirt sides. The skirt corners and the skirt sides allow light to pass through. A ring-shaped skirt undersurface is provided at an outer edge of the key skirt. The skirt undersurface consists of a plurality of side undersurfaces and a plurality of corner undersurfaces. A ratio of a width of the corner undersurface to a width of the side undersurface is between 1 and 3.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">KCC-2:鍵帽</p>  
        <p type="p">KTP:鍵頂</p>  
        <p type="p">KSP:鍵裙</p>  
        <p type="p">SE:裙邊</p>  
        <p type="p">BS1:角底面</p>  
        <p type="p">BS2:側底面</p>  
        <p type="p">CR:裙角</p>  
        <p type="p">CV:角弧面</p>  
        <p type="p">CC1:第一弧面</p>  
        <p type="p">CC2:第二弧面</p>  
        <p type="p">B&lt;sub&gt;12&lt;/sub&gt;:中交界</p>  
        <p type="p">B&lt;sub&gt;V2&lt;/sub&gt;:角交界</p>  
        <p type="p">Bi:內交界</p>  
        <p type="p">Bo:外交界</p>  
        <p type="p">E:外角緣</p>  
        <p type="p">HK:卡勾</p>  
        <p type="p">W&lt;sub&gt;BS1&lt;/sub&gt;,W&lt;sub&gt;BS2&lt;/sub&gt;,W&lt;sub&gt;B12&lt;/sub&gt;,W&lt;sub&gt;BV2&lt;/sub&gt;:寬度</p>  
        <p type="p">W&lt;sub&gt;CR&lt;/sub&gt;,W&lt;sub&gt;HK&lt;/sub&gt;:投影寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1289" publication-number="202611614"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611614.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611614</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124139</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含微單元之可變光透射裝置</chinese-title>  
        <english-title>A VARIABLE LIGHT TRANSMISSION DEVICE COMPRISING MICROCELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251201B">G02F1/167</main-classification>  
        <further-classification edition="201901120251201B">G02F1/16757</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商電子墨水股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E INK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNN, BRYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈瑞斯　喬治Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARRIS, GEORGE G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種可變光透射裝置，其能夠減輕負孔徑繞射效應(negative aperture diffraction effects)，並在開啟光學狀態與閉合光學狀態之間顯現良好的切換速度。該裝置包括設置在兩個透光電極層之間的一微單元層，該微單元層具有複數個微單元，每個微單元包括一電泳介質，以及每個微單元包括一通道及一突起結構，突起結構包括一錐形幾何形體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A variable light transmission device is disclosed that mitigates negative aperture diffraction effects and shows good switching speed between the open and the closed optical states. The device comprises a microcell layer disposed between two light transmissive electrode layers, the microcell layer having a plurality of microcells, each microcell including an electrophoretic medium, and each microcell comprising a channel, a protrusion structure, the protrusion structure comprising a conoid geometric solid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:可變光透射裝置</p>  
        <p type="p">201:第一透光基板</p>  
        <p type="p">202:第一透光電極層</p>  
        <p type="p">203:微單元層</p>  
        <p type="p">204:微單元</p>  
        <p type="p">206:密封層</p>  
        <p type="p">207:第二透光電極層</p>  
        <p type="p">208:第二透光基板</p>  
        <p type="p">209:電泳介質</p>  
        <p type="p">210:微單元底層</p>  
        <p type="p">211:微單元底部內表面</p>  
        <p type="p">211a:暴露的微單元底部內表面</p>  
        <p type="p">212:微單元壁</p>  
        <p type="p">215:通道</p>  
        <p type="p">217:突起結構</p>  
        <p type="p">218:突起底面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1290" publication-number="202610547"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610547.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610547</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>果實風味飲料及其製造方法、以及果實風味飲料之風味提升方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A23L2/56</main-classification>  
        <further-classification edition="201601120251201B">A23L33/135</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商麒麟飲料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRIN BEVERAGE COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤淳史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉澤真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIZAWA, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂知奈美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKA, CHINAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種含有有用細菌之死菌及糠醛之果實風味飲料。該果實風味飲料中，有用細菌之死菌濃度為5億個/L以上，糠醛之濃度為0.001 ppm以上10 ppm以下，並且波長660 nm下之吸光度為1.00以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1291" publication-number="202611185"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611185.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611185</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性組成物、經圖型化之含矽樹脂膜之製造方法，及含矽樹脂</chinese-title>  
        <english-title>PHOTOSENSITIVE COMPOSITION, METHOD FOR PRODUCING PATTERNED SILICON-CONTAINING RESIN FILM, AND SILICON-CONTAINING RESIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G77/24</main-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/075</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林三朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, SABURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大內隼人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OUCHI, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>衣幡慶一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IBATA, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種高感度，且能形成粗度小之微細尺寸圖型之感光性組成物、使用該感光性組成物而經圖型化之含矽樹脂膜之製造方法，及能適宜摻合於前述感光性組成物之含矽樹脂。 &lt;br/&gt;　　[解決手段]一種感光性組成物，其包含：含矽樹脂(A)、光酸產生劑(B)，及交聯劑(C)，且前述含矽樹脂(A)具有被1個以上之碘原子所取代之芳香族基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1292" publication-number="202611183"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611183.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611183</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性組成物，及經圖型化之含矽樹脂膜之製造方法</chinese-title>  
        <english-title>PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED SILICON-CONTAINING RESIN FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G77/16</main-classification>  
        <further-classification edition="200601120251201B">C08G77/18</further-classification>  
        <further-classification edition="200601120251201B">C08G77/26</further-classification>  
        <further-classification edition="200601120251201B">C07C309/12</further-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">C07D333/76</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/075</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大內隼人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OUCHI, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>衣幡慶一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IBATA, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林三朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, SABURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供可形成粗度受到抑制之經圖型化之含矽樹脂膜的感光性組成物，及經圖型化之含矽樹脂膜之製造方法。 &lt;br/&gt;　　[解決手段]在包含含矽樹脂(A)及光酸產生劑(B)之感光性組成物中，藉由使含矽樹脂(A)包含具有酚性羥基與因應酸之作用而能與具有酚性羥基之香族基進行交聯之基，且使用包含具有氟原子之鋶陽離子之鋶鹽(B1)作為光酸產生劑(B)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1293" publication-number="202611774"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611774.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611774</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124162</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器管理系統、容器管理裝置、容器管理用軟體及容器管理方法</chinese-title>  
        <english-title>CONTAINER MANAGING SYSTEM, CONTAINER MANAGING APPARATUS, CONTAINER MANAGING SOFTWARE, AND CONTAINER MANAGING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06K7/10</main-classification>  
        <further-classification edition="200601120251201B">G06K7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大陽日酸股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO NIPPON SANSO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西田修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIDA, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城和則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOU, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口明之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, AKIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種容器管理系統、容器管理裝置、容器管理用軟體及容器管理方法，在一個收納庫收納複數個容器時，可容易地進行容器的識別。就解決手段而言，將前端側21的輸出電波最強且輸出電波會隨著靠近端子側22而變弱的纜線形狀的RFID天線20，相對於安裝於第一容器11的第一RFID標籤的位置及安裝於第二容器12的第二RFID標籤的位置，水平地設置於收納庫10內。RFID天線20係比較RFID天線20從第一RFID標籤及第二RFID標籤接收到的接收電波強度，且判定接收電波強度較強的RFID標籤位於RFID天線20的前端側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to provide a container managing system, a container managing apparatus, a container managing software, and a container managing method that enable easy container identification when a plurality of containers are stored in a single storage cabinet. Provided as a solution, a cable-shaped RFID antenna 20, where the output radio wave is strongest at the tip side 21 and weakens as it approaches the terminal side 22, is installed horizontally within a storage cabinet 10 relative to the position of a first RFID tag attached to a first container 11 and the position of a second RFID tag attached to a second container 11. The RFID antenna 20 compares the strength of the radio waves received from the first and second RFID tags, and determines that the RFID tag with the stronger received radio wave strength is located at the tip side 21 of the RFID antenna 20.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:收納庫</p>  
        <p type="p">11:容器</p>  
        <p type="p">12:RFID標籤保持器</p>  
        <p type="p">20:RFID天線</p>  
        <p type="p">21:前端側</p>  
        <p type="p">22:端子側</p>  
        <p type="p">23:通信線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1294" publication-number="202611262"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611262.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611262</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124192</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水溶性熱處理油組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">C09K3/32</main-classification>  
        <further-classification edition="200601120251202B">C10M169/04</further-classification>  
        <further-classification edition="200601120251202B">C08G14/073</further-classification>  
        <further-classification edition="200601120251202B">C23F11/12</further-classification>  
        <further-classification edition="200601120251202B">C21D1/18</further-classification>  
        <further-classification edition="200601120251202B">C10M101/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商出光興產股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉浦崇仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIURA, TAKAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本徹朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TETSURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三阪佳孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MISAKA, YOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀野孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORINO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋夏海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, NATSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種具有優異油份分離性之水溶性熱處理油組成物。解決手段則是製成一種水溶性熱處理油組成物，其含有下述通式(a-1)所示含羥基單胺化合物(A)及聚乙亞胺(B)；&lt;br/&gt; R&lt;sup&gt;1&lt;/sup&gt;-NH-R&lt;sup&gt;2&lt;/sup&gt;・・・(a-1)&lt;br/&gt; (前述通式(a-1)中，R&lt;sup&gt;1&lt;/sup&gt;為氫原子或不具有取代基之碳數1~6之烷基，R&lt;sup&gt;2&lt;/sup&gt;為具有1個羥基之經取代烷基；但，R&lt;sup&gt;2&lt;/sup&gt;中前述經取代烷基之-CH&lt;sub&gt;2&lt;/sub&gt;-可各自獨立地以-O-來取代)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1295" publication-number="202611526"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611526.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611526</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124199</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多頻精度電壓及電流感測器</chinese-title>  
        <english-title>MULTI-FREQUENCY PRECISION VOLTAGE AND CURRENT SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01R15/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＭＫＳ韓國股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MKS KOREA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>釜山大學校</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUSAN NATIONAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＭＫＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MKS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李濬植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JOONSIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李虎炯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HOHYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭在哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, JAECHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李厚鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HOJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐浚恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JONGHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之電壓/電流感測器可包括：導體部，其包括內部圓筒與外部圓筒；感測器部，其位於導體部之內部圓筒與外部圓筒之間，包括至少纏繞有1圈電線之線圈；測量部，其構成為線圈之兩末端部分與設置於外部圓筒上之一對連接器連接，於一對連接器上連接具有相同之長度之2個同軸電纜，於2個同軸電纜之各端部上分別連接具有相同之電阻值&lt;i&gt;R&lt;sub&gt;p&lt;/sub&gt;&lt;/i&gt;之電阻，測量2個同軸電纜之各端部之第一電壓&lt;i&gt;V&lt;sub&gt;1&lt;/sub&gt;&lt;/i&gt;與第二電壓&lt;i&gt;V&lt;sub&gt;2&lt;/sub&gt;&lt;/i&gt;；及處理器部，其利用第一電壓&lt;i&gt;V&lt;sub&gt;1&lt;/sub&gt;&lt;/i&gt;與第二電壓&lt;i&gt;V&lt;sub&gt;2&lt;/sub&gt;&lt;/i&gt;而導出藉由高頻功率線路來傳輸之高頻功率之電壓&lt;i&gt;V&lt;/i&gt;及電流&lt;i&gt;I&lt;/i&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:導體部</p>  
        <p type="p">110:內部圓筒</p>  
        <p type="p">120:外部圓筒</p>  
        <p type="p">200:感測器部</p>  
        <p type="p">300:測量部</p>  
        <p type="p">310:連接器</p>  
        <p type="p">320:同軸電纜</p>  
        <p type="p">330:電阻</p>  
        <p type="p">400:處理器部</p>  
        <p type="p">V&lt;sub&gt;1&lt;/sub&gt;:第一電壓</p>  
        <p type="p">V&lt;sub&gt;2&lt;/sub&gt;:第二電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1296" publication-number="202610974"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610974.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610974</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124275</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎓鹽、化學增幅阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>ONIUM SALT, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C25/18</main-classification>  
        <further-classification edition="200601120251201B">C07C211/63</further-classification>  
        <further-classification edition="200601120251201B">C07C381/00</further-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">C07D307/12</further-classification>  
        <further-classification edition="200601120251201B">C07D307/93</further-classification>  
        <further-classification edition="200601120251201B">C07D327/08</further-classification>  
        <further-classification edition="200601120251201B">C07D333/54</further-classification>  
        <further-classification edition="200601120251201B">C07D333/76</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，溶劑溶解性優良，為高感度，且為高對比度而且LWR、CDU、MEF、EL、DOF等微影性能優良的化學增幅阻劑組成物所使用的鎓鹽、含有該鎓鹽之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。&lt;br/&gt; 該課題之解決手段為一種鎓鹽，係以下式(1)表示。&lt;br/&gt;&lt;img align="absmiddle" height="137px" width="461px" file="ed10333.JPG" alt="ed10333.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An onium salt has the formula (1):&lt;br/&gt;&lt;img align="absmiddle" height="128px" width="455px" file="ed10334.JPG" alt="ed10334.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1297" publication-number="202611246"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611246.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611246</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124298</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓加工用帶</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251210B">C09J7/22</main-classification>  
        <further-classification edition="200601120251210B">B32B27/28</further-classification>  
        <further-classification edition="200601120251210B">H01L21/463</further-classification>  
        <further-classification edition="200601120251210B">H01L21/461</further-classification>  
        <further-classification edition="201901120251210B">B32B7/06</further-classification>  
        <further-classification edition="201401120251210B">B23K28/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萩原健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGIWARA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楯洋亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATE, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>升田優亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種能夠抑制晶圓之翹曲之晶圓加工用帶、及使用該晶圓加工用帶之晶圓加工方法。本發明係關於一種晶圓加工用帶，其於23℃下以壓縮率40%經壓縮15小時之情形時之永久壓縮應變Cs為10%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶圓加工用帶</p>  
        <p type="p">110:中間層</p>  
        <p type="p">111:第1面</p>  
        <p type="p">112:第2面</p>  
        <p type="p">120:表面層</p>  
        <p type="p">130:基材層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1298" publication-number="202612080"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612080.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612080</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124299</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓加工用帶</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L21/673</main-classification>  
        <further-classification edition="200601120251204B">H01L21/67</further-classification>  
        <further-classification edition="200601120251204B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萩原健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGIWARA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楯洋亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATE, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>升田優亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種能夠抑制晶圓之翹曲之晶圓加工用帶、及使用該晶圓加工用帶之晶圓加工方法。本發明係關於一種晶圓加工用帶，其具備基材層，於上述基材層之面內之至少一個方向上，上述基材層之120℃下之收縮作功量W&lt;sub&gt;120&lt;/sub&gt;為8 mJ/20 mm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶圓加工用帶</p>  
        <p type="p">10:基材層</p>  
        <p type="p">11:第1面</p>  
        <p type="p">12:第2面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1299" publication-number="202611219"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611219.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611219</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124323</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>橡膠組成物、含氟彈性體、密封材料、及橡膠組成物的保管方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08L27/12</main-classification>  
        <further-classification edition="200601120251201B">C08K3/36</further-classification>  
        <further-classification edition="200601120251201B">C08K5/02</further-classification>  
        <further-classification edition="200601120251201B">C08K5/13</further-classification>  
        <further-classification edition="200601120251201B">C08K5/14</further-classification>  
        <further-classification edition="200601120251201B">C08K5/3492</further-classification>  
        <further-classification edition="200601120251201B">C08J3/20</further-classification>  
        <further-classification edition="200601120251201B">C09K3/10</further-classification>  
        <further-classification edition="200601120251201B">F16J15/10</further-classification>  
        <further-classification edition="201601120251201B">F16J15/3284</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商霓佳斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NICHIAS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤佑太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂口(藤村)涼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAGUCHI(FUJIMURA), RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大谷浩二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTANI, KOJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 以提供保管特性優異的橡膠組成物為課題。&lt;br/&gt; [解決手段] 一種橡膠組成物，包含：&lt;br/&gt; （a）交聯反應性氟橡膠及/或交聯反應性全氟橡膠，&lt;br/&gt; （b）交聯劑，及&lt;br/&gt; （c）含有苯酚性羥基的化合物，&lt;br/&gt; 前述交聯劑至少包含下述式（1）所表示的化合物；&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="131px" width="432px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; （在式（1）中，A為單鍵、-O-、亞烷基、或氟化亞烷基。R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;分別獨立為氫原子、氟原子、烷基、或氟化烷基。但R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;之至少1者為氟原子或氟化烷基）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1300" publication-number="202612160"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612160.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612160</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124348</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極活性物質層、包含前述電極活性物質層之電極、及前述電極活性物質層之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251201B">H01M4/131</main-classification>  
        <further-classification edition="201001120251201B">H01M4/133</further-classification>  
        <further-classification edition="200601120251201B">H01M4/36</further-classification>  
        <further-classification edition="201001120251201B">H01M4/48</further-classification>  
        <further-classification edition="201001120251201B">H01M4/583</further-classification>  
        <further-classification edition="200601120251201B">H01M4/62</further-classification>  
        <further-classification edition="201001120251201B">H01M10/0525</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光森春菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUMORI, HARUNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀越敬史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIKOSHI, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勝谷鄉史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATSUYA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永田恭平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATA, KYOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種電極活性物質層，其係包含纖維、黏結劑、及電極活性物質之電極活性物質層，其中前述纖維包含纖維徑1～15μm的纖維，前述纖維之纖維長度之變異係數CV為0～0.30，前述電極活性物質層之表面粗糙度Sa為0～10μm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1301" publication-number="202611501"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611501.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611501</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124377</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分析物光譜資料的利用方法及系統、分析物檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR USING ANALYTE SPECTRAL DATA, METHOD AND SYSTEM FOR DETECTING ANALYTE, COMPUTER-READABLE STORAGE MEDIUM, AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01N21/64</main-classification>  
        <further-classification edition="201801120251201B">G16H50/20</further-classification>  
        <further-classification edition="200601120251201B">A61B5/02</further-classification>  
        <further-classification edition="200601120251201B">A61B5/1455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商森舒瑞私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENSURA PTE. LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宏志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, HONGZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分析物光譜數據的利用及分析物檢測方法、系統、媒體及設備，屬於光學分析領域，包括：分析步驟：將獲取的光譜數據輸入本地檢測模型得到分析物的信息，並提供校正選項；信息上傳步驟：在所述校正選項被觸發後，獲取用戶輸入的校正信息，並將所述校正信息和所述獲取的光譜數據上傳至雲端平臺；模型訓練步驟：雲端平臺將獲取的光譜數據作為輸入，將獲取的校正信息作為輸出，對雲端檢測模型進行訓練；模型更新步驟：根據訓練後的所述雲端檢測模型對本地檢測模型進行更新。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method, system, media and device for using analyte spectral data and detecting analytes belong to the field of optical analysis, which comprise: an analysis step: inputting the acquired spectral data into a local detection model to obtain analyte information and providing a correction option; an information uploading step: after the correction option is triggered, obtaining correction information input by the user, and uploading the correction information and the acquired spectral data to a cloud platform; a model training step: the cloud platform uses the acquired spectral data as input and the acquired correction information as output to train a cloud detection model; and a model updating step: updating the local detection model according to the trained cloud detection model.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1302" publication-number="202611502"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611502.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611502</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124381</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用紫外光進行螢光光譜資料採集的方法及系統、分析物的檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>  
        <english-title>IMAGE PROCESSING METHOD AND SYSTEM FOR ANALYTE DETECTION, ANALYTE DETECTION METHOD AND SYSTEM, COMPUTER-READABLE STORAGE MEDIUM, AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">G01N21/64</main-classification>  
        <further-classification edition="200601120251210B">G01J3/28</further-classification>  
        <further-classification edition="202401120251210B">G06T5/00</further-classification>  
        <further-classification edition="200601120251210B">G06F17/10</further-classification>  
        <further-classification edition="200601120251210B">G02B21/16</further-classification>  
        <further-classification edition="200601120251210B">A61B5/1455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商森舒瑞私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENSURA PTE. LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宏志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, HONGZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種利用紫外光進行螢光光譜數據採集的方法、系統及媒體，包括：紫外光照步驟：通過波長在300-390奈米的紫外光照射第一區域；信號採集步驟：獲取所述第一區域被激發而發出的包含螢光光譜數據的螢光輻射信號，並進行成像得到圖像；光譜數據採集步驟：從所述圖像中選擇數據採集點，將數據採集點的灰度值代入光譜重構算法，計算得到螢光光譜數據，所述螢光光譜數據的譜線峰值位於400-800奈米之間。本申請的技術方案能夠讓不同分析物的光譜數據的波峰位於成像光譜探測設備的可識別範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method, system, and media for collecting fluorescence spectral data using ultraviolet light include: an ultraviolet illumination step: irradiating a first region with ultraviolet light having a wavelength between 300 and 390 nanometers; a signal acquisition step: acquiring a fluorescence radiation signal containing fluorescence spectral data emitted by the first region upon excitation, and imaging the signal to produce an image; and a spectral data acquisition step: selecting data acquisition points from the image, substituting the grayscale values of the data acquisition points into a spectral reconstruction algorithm, and calculating fluorescence spectral data. The peaks of the spectral lines of the fluorescence spectral data are located between 400 and 800 nanometers. The technical solution of the application ensures that the peaks of the spectral data for different analytes are within the recognizable range of the imaging spectral detection device.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1303" publication-number="202611498"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611498.zip"/>
    </tif-files>
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      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611498</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124382</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分析物檢測系統及裝置</chinese-title>  
        <english-title>ANALYTE DETECTION SYSTEM AND DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01N21/01</main-classification>  
        <further-classification edition="200601120251201B">G01N21/33</further-classification>  
        <further-classification edition="201401120251201B">G01N21/35</further-classification>  
        <further-classification edition="200601120251201B">G01N21/47</further-classification>  
        <further-classification edition="200601120251201B">G01N21/63</further-classification>  
        <further-classification edition="200601120251201B">G02B5/20</further-classification>  
        <further-classification edition="200601120251201B">G01J3/12</further-classification>  
        <further-classification edition="200601120251201B">G01N33/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商森舒瑞私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENSURA PTE. LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宏志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, HONGZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分析物檢測系統及裝置，屬於光學分析領域，所述檢測系統包括光源、成像光譜探測裝置以及控制器，所述控制器分別與光源和成像光譜探測裝置電連接或通信連接，所述光源能夠提供預設波長範圍內的光線；在所述控制器的作用下：所述光源向指定區域提供預設波長範圍內的光線，所述成像光譜探測裝置對指定區域進行成像得到對應的圖像和/或光譜數據。本申請通過控制器控制光源和成像光譜探測裝置對成像區域進行成像得到對應的圖像和/或光譜數據，操作簡單，且能夠集成於便攜式設備中，適用性強。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and device for detecting an analyte belong to the field of optical analysis. The detection system includes a light source, an imaging spectrum detection device, and a controller. The controller is electrically or communicatively connected to the light source and the imaging spectrum detection device, respectively. The light source is capable of providing light within a preset wavelength range. Under the action of the controller, the light source provides light within the preset wavelength range to a designated area, and the imaging spectrum detection device images the designated area to obtain corresponding images and/or spectral data. The application uses a controller to control the light source and the imaging spectrum detection device to image the imaging area to obtain corresponding images and/or spectral data. The system is simple to operate, can be integrated into portable devices, and has strong applicability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:成像區域</p>  
        <p type="p">200:檢測設備</p>  
        <p type="p">201:光源</p>  
        <p type="p">202:成像光譜探測裝置</p>  
        <p type="p">203:控制器</p>  
        <p type="p">204:第一帶通濾光片</p>  
        <p type="p">205:鏡頭</p>  
        <p type="p">206:第二帶通濾光片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1304" publication-number="202611487"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611487.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611487</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分析物照明系統及檢測系統</chinese-title>  
        <english-title>ANALYTE ILLUMINATION SYSTEM AND DETECTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01J3/28</main-classification>  
        <further-classification edition="200601120251201B">G02B5/20</further-classification>  
        <further-classification edition="200601120251201B">G01N21/01</further-classification>  
        <further-classification edition="200601120251201B">G01N21/33</further-classification>  
        <further-classification edition="201401120251201B">G01N21/35</further-classification>  
        <further-classification edition="200601120251201B">G01N33/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商森舒瑞私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENSURA PTE. LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宏志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, HONGZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分析物照明系統及檢測系統，屬於光學分析領域，包括殼體和光源，所述光源能夠提供預設波長範圍內的光線；所述殼體能夠與檢測者的檢測部位貼合併在貼合處形成成像區域，所述光源照射成像區域。本申請通過光源提供的光線的波長範圍同時覆蓋能夠獲取分析物分佈情況數據的波長範圍、能夠獲取分析物光譜數據的波長範圍，且將光源設置為環形光源，一方面能夠為成像區域提供穩定且均勻的光照，檢測時無需與分析物進行電化學反應，檢測方式更為便捷，特別是在對活體中的分析物進行檢測時，可以實現無創檢測的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An analyte illumination system and detection system belong to the field of optical analysis, which include a housing and a light source, the light source capable of providing light within a preset wavelength range; the housing can be attached to a detection area of a subject to be detected to form an imaging area at the attachment point, and the light source illuminates the imaging area. The wavelength range of the light provided by the light source in the application covers both the wavelength range capable of obtaining analyte distribution data and the wavelength range capable of obtaining analyte spectral data, and the light source is configured as a ring-shaped light source. This can provide stable and uniform illumination for the imaging area, and does not require electrochemical reaction with the analyte during detection, making the detection method more convenient. In particular, non-invasive detection can be achieved when detecting analytes in living organisms.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:成像區域</p>  
        <p type="p">200:檢測設備</p>  
        <p type="p">201:光源</p>  
        <p type="p">202:成像光譜探測裝置</p>  
        <p type="p">203:控制器</p>  
        <p type="p">204:第一帶通濾光片</p>  
        <p type="p">205:鏡頭</p>  
        <p type="p">206:第二帶通濾光片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1305" publication-number="202610828"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610828.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610828</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124403</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">B32B25/04</main-classification>  
        <further-classification edition="200601120251209B">B32B27/36</further-classification>  
        <further-classification edition="200601120251209B">B32B27/06</further-classification>  
        <further-classification edition="200601120251209B">H01G4/30</further-classification>  
        <further-classification edition="200601120251209B">H01G4/12</further-classification>  
        <further-classification edition="202501120251209B">H10D1/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒木裕太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉松王彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIMATSU, KIMIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之積層膜10具備：基材膜11；及橡膠層12，其積層於基材膜11上，且包含彈性物作為主成分；利用下述壓縮試驗A測得之厚度方向之變形量為14.5 μm以上。 &lt;br/&gt;＜壓縮試驗A＞ &lt;br/&gt;利用直徑1 mm之圓柱狀之壓縮探針，於溫度25℃、壓縮速度50 g/分鐘之條件下，自積層膜10之橡膠層12側，於厚度方向上施加5 MPa之壓力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積層膜</p>  
        <p type="p">10t:積層膜之厚度</p>  
        <p type="p">11:基材膜</p>  
        <p type="p">11t:基材膜之厚度</p>  
        <p type="p">12:橡膠層</p>  
        <p type="p">12t:橡膠層之厚度</p>  
        <p type="p">101:第1主面</p>  
        <p type="p">102:第2主面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1306" publication-number="202611973"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611973.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611973</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理方法及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250708B">H01J37/32</main-classification>  
        <further-classification edition="200601120250708B">H01L21/687</further-classification>  
        <further-classification edition="200601120250708B">G06F17/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥村忠嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUMURA, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name></last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATAKE, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電漿處理方法具備：第一工程，其求取：晶圓中的第二物理量的面內分佈近似函數其定義為具有以下要素的權重線性和用於測量第二物理量的晶圓表面上的多個位置中的每一個位置為中心的多個徑向基底函數作為第一基底函數群F；針對電漿處理裝置預先定義了的第二基底函數群G；及常數值；以及第二工程，其針對晶圓，根據基於面內分佈近似函數計算出的預定位置處的第二物理量與測量到的預定位置處的第一物理量之間的相關性，來控制反饋機構使得處理對象的晶圓的預定位置處的第二物理量達到目標值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1307" publication-number="202610993"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610993.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610993</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124459</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物、阻劑圖型之形成方法、含氟高分子化合物及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C69/88</main-classification>  
        <further-classification edition="200601120251201B">C07C69/90</further-classification>  
        <further-classification edition="200601120251201B">C08F212/14</further-classification>  
        <further-classification edition="200601120251201B">C08F220/18</further-classification>  
        <further-classification edition="200601120251201B">C08F220/30</further-classification>  
        <further-classification edition="200601120251201B">C08F220/32</further-classification>  
        <further-classification edition="200601120251201B">C08F220/36</further-classification>  
        <further-classification edition="200601120251201B">C08F220/40</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　慶信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, KHANHTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋本悠里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIMOTO, YURI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長峰高志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAMINE, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供阻劑組成物，其係含有：藉由酸的作用，變更相對於顯影液的溶解性之樹脂成分(A1)、與具有衍生自一般式(f0-1)表示之化合物的構成單位(f0)之含氟高分子化合物(F0)。式中，W&lt;sup&gt;1&lt;/sup&gt;為含有聚合性基之基。Lf&lt;sup&gt;00&lt;/sup&gt;係具有至少1個之羥基作為取代基之有機基。Lf&lt;sup&gt;02&lt;/sup&gt;為l價的連結基。Rf&lt;sup&gt;01&lt;/sup&gt;為包含氟醇構造之基。 &lt;br/&gt;&lt;img align="absmiddle" height="110px" width="349px" file="ed10132.JPG" alt="ed10132.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1308" publication-number="202610627"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610627.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610627</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>家族性良性慢性天疱瘡用醫藥組成物及其用途</chinese-title>  
        <english-title>PHARMACEUTICAL COMPOSITION FOR FAMILIAL BENIGN CHRONIC PEMPHIGUS AND ITS USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/495</main-classification>  
        <further-classification edition="200601120251201B">A61P37/02</further-classification>  
        <further-classification edition="200601120251201B">A61P17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商田邊三菱製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI TANABE PHARMA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊藤隆太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, RYUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種針對家族性良性慢性天疱瘡之新穎的醫藥組成物。 &lt;br/&gt;本發明之家族性良性慢性天疱瘡用醫藥組成物係包含5-甲基-2-(1-哌𠯤基)苯磺酸。前述化合物係將其無水物、其鹽、其水合物或是溶劑合物、或其鹽之水合物或是溶劑合物作為有效成分。前述水合物係例如為5-甲基-2-(1-哌𠯤基)苯磺酸一水合物。本發明之醫藥組成物係可進行家族性良性慢性天疱瘡之治療或預防。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a novel pharmaceutical composition for Hailey-Hailey disease. &lt;br/&gt;The pharmaceutical composition for Hailey-Hailey disease of the present invention comprises 5-methyl-2-(1-piperazinyl)benzenesulfonic acid. The above compound is an active ingredient as its anhydrate, a salt thereof, a hydrate or solvate thereof, or a hydrate or solvate of a salt thereof. An example of the above hydrate is 5-methyl-2-(1-piperazinyl)benzenesulfonic acid monohydrate. The pharmaceutical composition of the present invention can be used to treat or prevent Hailey-Hailey disease.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1309" publication-number="202611135"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611135.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611135</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124465</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高分子化合物、光阻劑用樹脂組成物及半導體的製造方法</chinese-title>  
        <english-title>HIGH MOLECULAR COMPOUND, PHOTORESIST RESIN COMPOSITION, AND MANUFACTURING METHOD OF SEMICONDUCTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F220/18</main-classification>  
        <further-classification edition="200601120251201B">C08F220/28</further-classification>  
        <further-classification edition="200601120251201B">C08F220/32</further-classification>  
        <further-classification edition="200601120251201B">C08F220/36</further-classification>  
        <further-classification edition="200601120251201B">C08F220/38</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大賽璐股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAICEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村政通</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, MASAMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種高分子化合物，其在用於光阻劑用樹脂組成物時，具有高感度而可以良好的精度形成解析度優良的微細圖案，並且可減少顯影缺陷的產生。又，提供一種光阻劑用樹脂組成物，其具有高感度而可以良好的精度形成解析度優良的微細圖案，並且可減少顯影缺陷的產生。 &lt;br/&gt;本發明之高分子化合物至少包含式(a)表示的單體單元a及含有具有極性基之脂環式骨架的單體單元b(惟不包含式(c)表示的單體單元c)，相對於構成前述高分子化合物的所有單體單元，前述單體單元c的含量小於5莫耳%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a high molecular compound that, when used in a photoresist resin composition, offers high sensitivity, enabling the formation of fine patterns with excellent resolution and good precision, while also reducing development defects. The invention also provides a photoresist resin composition that offers high sensitivity, enabling the formation of fine patterns with excellent resolution and good precision, while also reducing development defects. &lt;br/&gt;The high molecular compound of the invention contains at least a monomer unit 'a' represented by formula (a) and a monomer unit 'b' containing an alicyclic skeleton with a polar group (but not a monomer unit 'c' represented by formula (c)). The content of a monomer unit 'c' represented by formula (c) is less than 5 mol% of all the monomer units constituting the polymer compound.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">本案無圖式。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1310" publication-number="202610967"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610967.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610967</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藥物組合物、劑型及其製備方法和使用方法</chinese-title>  
        <english-title>PHARMACEUTICAL COMPOSITIONS, DOSAGE FORMS, AND METHODS OF MAKING AND USING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C5/11</main-classification>  
        <further-classification edition="200601120251201B">C07C13/38</further-classification>  
        <further-classification edition="200601120251201B">C07C23/10</further-classification>  
        <further-classification edition="200601120251201B">A61K31/025</further-classification>  
        <further-classification edition="200601120251201B">A61K31/277</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商阿克思生物科學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARCUS BIOSCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕提爾　悠葛什　巴拉薩賀伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, YOGESH BALASAHEB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘奈爾　安德魯　Ｍ　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENNELL, ANDREW M.K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普魯修塔曼　普維茲　波納莫爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PURUSHOTHAMAN, POOVIZHI PONNAMMAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　文瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEUNG, MANSHIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供化合物(I)之藥物組合物，其包含化合物(I)之固體分散體及化合物(I)之奈米結晶粉末形式。本發明亦提供相關單位劑型，及其製備方法和使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Pharmaceutical compositions of Compound (I) including solid dispersions of Compound (I) and nanocrystalline powder forms of Compound (I). Related unit dosage forms, and methods of making and using the same are also provided.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1311" publication-number="202610790"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610790.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610790</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124475</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於控制具有多個自由度的欠致動機械系統的系統和方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR CONTROLLING AN UNDERACTUATED MECHANICAL SYSTEM WITH MULTIPLE DEGREES OF FREEDOM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">B25J9/16</main-classification>  
        <further-classification edition="200601120251210B">G05B13/04</further-classification>  
        <further-classification edition="201901120251210B">G06N20/00</further-classification>  
        <further-classification edition="202301120251210B">G06N7/00</further-classification>  
        <further-classification edition="200601120251210B">B25J13/08</further-classification>  
        <further-classification edition="200601120251210B">G05B11/32</further-classification>  
        <further-classification edition="200601120251210B">G05B19/406</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅梅雷斯　迭戈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROMERES, DIEGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈科穆佐　朱利奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIACOMUZZO, GIULIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡利　魯傑羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARLI, RUGGERO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達拉　里貝拉　阿爾貝托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DALLA LIBERA, ALBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於控制機械系統的方法利用基於能量的逆動力學模型，所述模型係訓練為將機械系統的動力學狀態映射到機械系統的複數個致動器的相應扭矩。所述方法包括收集包含機械系統的當前的動力學狀態的反饋訊號。所述方法還包括用基於能量的逆動力學模型處理當前的動力學狀態，以產生複數個致動器的扭矩值以及機械系統的勢能值和動能值。所述方法還包括基於所產生的機械系統的複數個致動器的扭矩值以及機械系統的勢能值和動能值來控制機械系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for controlling a mechanical system utilizes an energy-based inverse dynamics model trained to map dynamic states of the mechanical system to corresponding torques for a plurality of actuators of the mechanical system. The method comprises collecting a feedback signal including current states of dynamics of the mechanical system. The method further comprises processing the current states of dynamics with the energy-based inverse dynamics model to produce values of the torques for the plurality of actuators and values of the potential and kinetic energy of the mechanical system. The method further comprises controlling the mechanical system based on the produced values of the torques for the plurality of actuators of the mechanical system and the values of the potential and kinetic energy of the mechanical system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方塊圖</p>  
        <p type="p">101:控制器</p>  
        <p type="p">103:處理器</p>  
        <p type="p">105:記憶體</p>  
        <p type="p">107:基於能量的逆動力學模型</p>  
        <p type="p">109:機械系統</p>  
        <p type="p">111:反饋控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1312" publication-number="202610698"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610698.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610698</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於陣列定位之設備及方法</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR ARRAY POSITIONING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">A61N1/04</main-classification>  
        <further-classification edition="200601120251205B">A61N1/32</further-classification>  
        <further-classification edition="200601120251205B">A47C16/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商諾沃庫勒有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVOCURE GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇帝斯　伍德寇克　奈文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CURTIS-WOODCOCK, NIVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫爾曼　亨利　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOORMAN, HENRY JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓊斯　麥可　羅伯特　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONES, MICHAEL ROBERT GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮傑昂　安德魯　當肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIDGEON, ANDREW DUNCAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於將至少一個電極陣列定位於一使用者之一背部上的設備。該設備可包括一本體，該本體可在一第一組態與一第二擴展組態周圍及之間摺疊。該本體可包括一座位部分及一靠背部分。在該第二擴展組態中，該本體之該座位部分可經組態以用於定位於一椅子之一座位上，且該靠背部分可經組態以靠在該椅子之一靠背上。該本體之該靠背部分可具有包含至少一個標記或附接元件的一面向前之表面，該至少一個標記或附接元件指示該至少一個電極陣列之一置放部位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus for positioning at least one electrode array on a back of a user. The apparatus can include a body that is foldable about and between a first configuration and a second, expanded configuration. The body can include a seat portion and a back portion. In the second, expanded configuration, the seat portion of the body can be configured for positioning on a seat of a chair and the back portion can be configured to rest against a back of the chair. The back portion of the body can have a forward-facing surface comprising at least one marking or attachment element, the at least one marking or attachment element indicating a location for placement of the at least one electrode array.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:設備</p>  
        <p type="p">100:椅子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1313" publication-number="202610638"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610638.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610638</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124515</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含維爾納症候群解旋酶抑制劑之組成物及其使用方法</chinese-title>  
        <english-title>COMPOSITIONS COMPRISING WERNER SYNDROME HELICASE INHIBITORS AND METHODS OF USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/519</main-classification>  
        <further-classification edition="200601120251201B">A61K31/506</further-classification>  
        <further-classification edition="200601120251201B">A61K31/497</further-classification>  
        <further-classification edition="200601120251201B">C07D487/04</further-classification>  
        <further-classification edition="200601120251201B">C07D487/14</further-classification>  
        <further-classification edition="200601120251201B">C07D519/00</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛康醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EIKON THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　敏婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOO, MANDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　希拉蕊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BECK, HILARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫瑪　普尼特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, PUNEET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪納　瑪杜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANNA, MADHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯克比　艾蜜莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRKEBY, EMILY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮歐特洛斯基　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIOTROWSKI, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加格　柯莫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARG, KOMAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡帕尼　喬瑟夫　Ｓ　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAPANI, JOSEPH S. JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李培軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, PEIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯奈羅　朱麗安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUNELLO, JULIANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿凱拉　拉克希米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKELLA, LAKSHMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所揭示之主題係關於包含維爾納症候群解旋酶（Werner Syndrome Helicase，WRN）抑制劑之組成物及其使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The presently disclosed subject matter relates to compositions comprising Werner Syndrome Helicase (WRN) inhibitors and methods of using the same.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1314" publication-number="202611122"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611122.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611122</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學增幅正型阻劑組成物及阻劑圖案形成方法</chinese-title>  
        <english-title>CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/14</main-classification>  
        <further-classification edition="200601120251201B">C08F220/38</further-classification>  
        <further-classification edition="200601120251201B">C08F220/58</further-classification>  
        <further-classification edition="200601120251201B">C08F220/30</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="201201120251201B">G03F1/24</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>船津顕之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNATSU, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増永恵一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUNAGA, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小竹正晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOTAKE, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松澤雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUZAWA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供在使用高能射線之光微影中，溶劑溶解性良好，解像性、LER、圖案形狀等微影性能優良，同時在微細圖案形成中會抗圖案崩塌，蝕刻耐性亦優良之化學增幅正型阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。本發明之解決手段係一種化學增幅正型阻劑組成物，包含：基礎聚合物(A)，係因酸之作用而對鹼水溶液之溶解性會增大之聚合物，其包含：含有由下式(A1-1)表示之芳香族磺酸陰離子及下式(A1-2)表示之鋶陽離子構成之重複單元、及下式(A2)表示之重複單元，且因酸之作用而對鹼水溶液之溶解性會增大之聚合物。 &lt;br/&gt;&lt;img align="absmiddle" height="292px" width="487px" file="ed10413.JPG" alt="ed10413.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="178px" width="307px" file="ed10414.JPG" alt="ed10414.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chemically amplified positive resist composition containing a base polymer (A) which is a polymer whose solubility in an aqueous alkaline solution is increased by the action of an acid, contains a repeat unit containing an aromatic sulfonate anion having the formula (A1-1) and a sulfonium cation having the formula (A1-2) and a repeat unit having the formula (A2), and contains a polymer whose solubility in an aqueous alkaline solution is increased by the action of an acid. &lt;br/&gt;&lt;img align="absmiddle" height="478px" width="517px" file="ed10415.JPG" alt="ed10415.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1315" publication-number="202611053"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611053.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611053</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造用組成物及膜形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07F7/00</main-classification>  
        <further-classification edition="200601120251201B">C07F11/00</further-classification>  
        <further-classification edition="200601120251201B">C07C69/67</further-classification>  
        <further-classification edition="200601120251201B">C07C69/675</further-classification>  
        <further-classification edition="200601120251201B">C07C69/708</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/11</further-classification>  
        <further-classification edition="200601120251201B">G03F7/16</further-classification>  
        <further-classification edition="200601120251201B">G03F7/26</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田拓巳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>外山瑛章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYAMA, EISHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤英之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, HIDEYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>越後雅敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECHIGO, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之半導體製造用組成物，含有：金屬化合物或半金屬化合物(A)、含有下述通式(b-1)表示之化合物(B1)的溶劑(B)，前述半導體製造用組成物以總量基準計之有效成分的含量為45質量%以下。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="176px" width="328px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[上述式(b-1)中，R&lt;sup&gt;1&lt;/sup&gt;為碳數1~10之烷基。]</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1316" publication-number="202610983"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610983.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610983</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124570</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、該化合物之製造方法、包含該化合物之感光性組合物、使用該組合物之圖案形成方法、基板及基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C61/04</main-classification>  
        <further-classification edition="200601120251201B">C07C61/22</further-classification>  
        <further-classification edition="200601120251201B">C07F7/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H05K3/06</further-classification>  
        <further-classification edition="200601120251201B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山元啓司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, KEISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>服部繁樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATTORI, SHIGEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長山和弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAYAMA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋田拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKITA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤茜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, AKANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本洋揮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可實現電路圖案之微細化之過渡金屬團簇化合物及包含其之感光性組合物。 &lt;br/&gt;本發明之過渡金屬團簇化合物之特徵在於：其係包含過渡金屬原子及羧酸酯配體A者，該羧酸酯配體A具有羧酸酯基所鍵結之脂環式結構且該脂環式結構中鍵結於上述羧酸酯基之碳為四級碳，上述過渡金屬團簇化合物可含有氧及/或羥基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1317" publication-number="202612528"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612528.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612528</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124576</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混合接合裝置中的電感結構</chinese-title>  
        <english-title>INDUCTOR STRUCTURES IN HYBRID BONDED DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251204B">H10D80/20</main-classification>  
        <further-classification edition="202501120251204B">H10D1/20</further-classification>  
        <further-classification edition="200601120251204B">H01L21/768</further-classification>  
        <further-classification edition="200601120251204B">H01L21/762</further-classification>  
        <further-classification edition="200601120251204B">H01L21/324</further-classification>  
        <further-classification edition="200601120251204B">H01L23/535</further-classification>  
        <further-classification edition="200601120251204B">H01L23/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈亞南　基斯翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAYANAND, KISHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕拉莫夫　尼可拉斯　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLOMOFF, NICHOLAS ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普羅希特　維斯瓦絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUROHIT, VISWAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊瑟姆　尼可拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LATHAM, NICHOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>度塔　艾西瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUTTA, ASHIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　智超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種裝置，其包含：一第一半導體結構，其安置於一第二半導體結構上；及複數個金屬結構，其在該第一半導體結構與該第二半導體結構之一介面部分處。該第一半導體結構包含一電感結構之一第一部分，且該第二半導體結構包含該電感結構之一第二部分。該複數個金屬結構連接該電感結構之該第一部分與該電感結構之該第二部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device comprises a first semiconductor structure disposed on a second semiconductor structure, and a plurality of metal structures at an interface portion of the first semiconductor structure and the second semiconductor structure. The first semiconductor structure comprises a first part of an inductor structure and the second semiconductor structure comprises a second part of the inductor structure. The plurality of metal structures connect the first part of the inductor structure with the second part of the inductor structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一半導體結構</p>  
        <p type="p">200:第二半導體結構</p>  
        <p type="p">H:混合接合程序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1318" publication-number="202610986"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610986.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610986</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124578</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、該化合物之製造方法、包含該化合物之感光性組合物、使用該組合物之圖案形成方法、基板以及基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C61/22</main-classification>  
        <further-classification edition="200601120251201B">C07F9/94</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H05K3/06</further-classification>  
        <further-classification edition="200601120251201B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立研究開發法人量子科學技術研究開發機構</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL INSTITUTES FOR QUANTUM SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山元啓司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, KEISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>服部繁樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATTORI, SHIGEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長山和弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAYAMA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋田拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKITA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤茜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, AKANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本洋揮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠實現電路圖案之微細化之化合物及包含其之感光性組合物。 &lt;br/&gt;本發明之化合物之特徵在於：其係含有貧金屬原子及羧酸酯配位基A者，且該羧酸酯配位基A具有鍵結有羧酸酯基之脂環式結構，該脂環式結構具有1個雙鍵且與上述羧酸酯基鍵結之碳為四級碳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1319" publication-number="202612056"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612056.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612056</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124611</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理腔室的溫度及膜調整以及相關系統及方法</chinese-title>  
        <english-title>TEMPERATURE AND FILM ADJUSTMENTS FOR PROCESS CHAMBERS, AND RELATED SYSTEMS AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/67</main-classification>  
        <further-classification edition="200601120251201B">C23C16/54</further-classification>  
        <further-classification edition="200601120251201B">C23C16/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>保羅　寇康Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAUL, KHOKAN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伽瑞　沙亞史里尼瓦斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHARY, SATHYA SHRINIVAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅羅特拉　阿奇爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEHROTRA, AKHIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華盛頓　羅莉Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WASHINGTON, LORI D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例係關於處理腔室的溫度及膜調整，以及相關系統和方法。在一或多個實施例中，基板處理系統包括腔室主體，至少部分定義處理空間，以及設置在處理空間內並配置以支撐基板的基板支撐。該基板處理系統包括一或多個氣體進口，可提供處理氣體，使其在處理空間內水平流動並經過基板支撐，以及一或多個熱源，可對基板加熱。該基板處理系統還包括雷射源，可將能量導向基板以提供補充加熱；厚度感測器，可測量基板上的膜厚度；以及控制器，可根據測得的膜厚度控制雷射源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure relate to temperature and film adjustments for process chambers, and related systems and methods. In one or more embodiments, a substrate processing system includes a chamber body at least partially defining a processing volume, and a substrate support disposed in the processing volume and configured to support a substrate. The substrate processing system includes one or more gas inlets operable to provide a processing gas that flows horizontally across the processing volume and over the substrate support, and one or more heat sources operable to heat the substrate. The substrate processing system includes a laser source operable to direct energy to the substrate to provide supplemental heating, a thickness sensor operable to measure a film thickness on the substrate, and a controller operable to control the laser source based on the measured film thickness.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:基板/表面</p>  
        <p type="p">103:外殼</p>  
        <p type="p">103b:外殼</p>  
        <p type="p">110:內部空間/處理空間</p>  
        <p type="p">175:控制器</p>  
        <p type="p">205:鏡</p>  
        <p type="p">205b:鏡</p>  
        <p type="p">211:能量路徑</p>  
        <p type="p">213:能量</p>  
        <p type="p">215:準直器</p>  
        <p type="p">215b:準直器</p>  
        <p type="p">219:外部通道</p>  
        <p type="p">227:反射能量</p>  
        <p type="p">229:傳遞能量</p>  
        <p type="p">231:通道</p>  
        <p type="p">241:能量</p>  
        <p type="p">243:能量</p>  
        <p type="p">247:能量</p>  
        <p type="p">271:腔室蓋</p>  
        <p type="p">272:感測器</p>  
        <p type="p">274:能量源</p>  
        <p type="p">274b:能量源</p>  
        <p type="p">276:感測器</p>  
        <p type="p">276b:厚度感測器</p>  
        <p type="p">277:溫度感測器/附加感測器</p>  
        <p type="p">280:熱源/光源</p>  
        <p type="p">285:ISR系統</p>  
        <p type="p">285b:第二ISR</p>  
        <p type="p">421:濾波器</p>  
        <p type="p">421b:濾波器</p>  
        <p type="p">A1:入射角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1320" publication-number="202612178"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612178.zip"/>
    </tif-files>
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      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612178</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124651</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多向接線盒及其製造方法</chinese-title>  
        <english-title>MULTI-DIRECTIONAL TERMINAL BLOCK AND METHOD OF MAKING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01R9/24</main-classification>  
        <further-classification edition="200601120251201B">H01R4/40</further-classification>  
        <further-classification edition="201101120251201B">H01R12/52</further-classification>  
        <further-classification edition="200601120251201B">H01R43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商艾意斯全球控股私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AES GLOBAL HOLDINGS PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查維茲　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAVEZ, PAOLO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波仙庫拉　馬克　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PORCIUNCULA, MARK ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布拉沃　海蘇斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRAVO, JESUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">接線盒包括端子殼體和多個端子，端子殼體具有多個壁，多個壁形成多個端子開口，每個端子定位在多個端子開口中的相應端子開口中。多個端子中的每個端子是導電的並且包括前部部分，前部部分具有前表面、第一側表面和後表面，前表面具有形成在前表面中的第一緊固件開口，第一側表面具有形成在第一側表面中的第二緊固件開口，後表面與前表面相反。每個端子還包括後部部分和適配器，後部部分從後表面延伸。後部部分具有形成在後部部分中的適配器緊固件開口，並且適配器經由適配器緊固件聯接到後部部分，適配器緊固件定位在適配器緊固件開口內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A terminal block comprises a terminal housing having a plurality of walls forming a plurality of terminal openings and a plurality of terminals, each terminal positioned in a respective terminal opening of the plurality of terminal openings. Each terminal of the plurality of terminals is electrically conductive and includes a front portion having a front surface having a first fastener opening formed therein, a first side surface having a second fastener opening formed therein, and a rear surface opposite the front surface. Each terminal also includes a rear portion extending from the rear surface and an adaptor. The rear portion has an adaptor fastener opening formed therein, and the adaptor is coupled to the rear portion via an adaptor fastener positioned within the adaptor fastener opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:接線盒</p>  
        <p type="p">101:端子殼體；殼體</p>  
        <p type="p">102:端子開口</p>  
        <p type="p">103:端子</p>  
        <p type="p">104:線緊固件</p>  
        <p type="p">105:線緊固件</p>  
        <p type="p">106:適配器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1321" publication-number="202611548"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611548.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611548</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有塗層的光學元件、光學配置以及光學元件的製造方法</chinese-title>  
        <english-title>OPTICAL ELEMENT HAVING A COATING, OPTICAL ARRANGEMENT AND METHOD OF PRODUCING AN OPTICAL ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251201B">G02B1/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾曼　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERMANN, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃克斯邁耶　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERXMEYER, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案發明說明係有關於一種光學元件(1)，其包含：一基板(2)；及一塗層(3)，其對輻射(4)為部分反射性或抗反射性，優選對紫外線(UV)或可見光(VIS)波長範圍內輻射，其中該塗層(3)具有複數個第一層(6)及第二層(7)，其中該等第一層(6)包括一第一材料，優選為氟化物或氧化物；且該等第二層(7)包括一第二材料，優選為氟化物或氧化物，所述材料對該輻射(4)之折射率(n&lt;sub&gt;2&lt;/sub&gt;)係不同於該第一材料對該輻射(4)之折射率(n&lt;sub&gt;1&lt;/sub&gt;)。該塗層(3)具有用於反射率匹配之至少一群組層(8)，該群組包含一不相符於該第一材料及該第二材料的第三材料之第三層(9)。本案發明亦關於一種光學配置，優選為雷射或半導體技術系統，其包含：至少一光學元件(1)，如前述；及一生成光學元件(1)之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to an optical element (1) comprising: a substrate (2), and a coating (3) which is partly reflective or antireflective to radiation (4), preferably to radiation in the UV or VIS wavelength region, wherein the coating (3) has a plurality of first layers (6) and second layers (7), wherein the first layers (6) include a first, preferably fluoridic or oxidic material and the second layers (7) include a second, preferably fluoridic or oxidic material, the refractive index (n&lt;sub&gt;2&lt;/sub&gt;) of which for the for radiation (4) differs from the refractive index (n&lt;sub&gt;1&lt;/sub&gt;) of the first material for the radiation (4). The coating (3) has at least one group of layers (8) for reflectivity matching, which comprises a third layer (9) of a third material which does not correspond to the first material and the second material. The invention also relates to an optical arrangement, preferably a laser or a semiconductor technology system, comprising: at least one optical element (1) as described further up, and to a method of producing an optical element (1).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學元件/反射鏡/分束器</p>  
        <p type="p">2:基板</p>  
        <p type="p">2a:表面</p>  
        <p type="p">3:塗層</p>  
        <p type="p">4:輻射</p>  
        <p type="p">4a:第一部分</p>  
        <p type="p">4b:第二部分/未反射部分</p>  
        <p type="p">5:透明表面</p>  
        <p type="p">6:第一層/第一氟化物層/層</p>  
        <p type="p">6':補償層</p>  
        <p type="p">7:第二層/第二氟化物層/層</p>  
        <p type="p">7a:相移層</p>  
        <p type="p">8:層</p>  
        <p type="p">9:第三層/SiO&lt;sub&gt;2&lt;/sub&gt;層/層</p>  
        <p type="p">10:層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1322" publication-number="202610633"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610633.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610633</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124669</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>嗒酮化合物及其醫藥用途</chinese-title>  
        <english-title>PYRIDAZINONE COMPOUNDS AND PHARMACEUTICAL USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">A61K31/501</main-classification>  
        <further-classification edition="200601120251203B">A61K31/397</further-classification>  
        <further-classification edition="200601120251203B">A61P37/00</further-classification>  
        <further-classification edition="200601120251203B">A61P1/00</further-classification>  
        <further-classification edition="200601120251203B">A61P1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本煙草產業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN TOBACCO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩山俊彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAYAMA, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西丸達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMARU, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大竹和樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTAKE, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大下賢吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSHITA, KENGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供具有Mas相關G蛋白質共軛受體X2抑制活性之化合物。本發明提供下述結構式等的化合物或其製藥上所容許之鹽。 &lt;br/&gt;&lt;img align="absmiddle" height="173px" width="176px" file="ed10354.JPG" alt="ed10354.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a compound having inhibitory activity against Mas-related G protein-coupled receptor X2. The present invention provides a compound having the following structural formula or a pharmaceutically acceptable salt thereof: &lt;br/&gt;&lt;img align="absmiddle" height="168px" width="174px" file="ed10355.JPG" alt="ed10355.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1323" publication-number="202611964"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611964.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611964</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124678</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偵測器及測定裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250708B">H01J37/244</main-classification>  
        <further-classification edition="200601120250708B">H01J37/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關口好文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIGUCHI, YOSHIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>望月誠仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOCHIZUKI, MASAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安部悠介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今村伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAMURA, SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水谷俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTANI, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種偵測器，係具備：複數個發光元件，係藉由對試料的射束之照射，而藉由從試料所被放出之量子的碰撞而發光；和受光元件，係將前記發光元件所發生的光，藉由受光面而予以受光；和光導，係使前記發光元件所發光的光傳播至前記受光元件；其特徵為：前記發光元件，係為平面狀，且具有透明部和發光層；前記透明部係較前記發光層還厚，並使前記發光層所發光的光，出射至前記透明部；於前記透明部中，令具有與前記發光層之法線平行的法線且對向於前記發光層的面為對向面，令與前記發光層平行之方向上具有法線的面為側面的情況下，具有：使光從前記透明部的側面入射至前記光導的第1構成；或前記發光元件是相對於前記射束之照射方向之垂直面而被傾斜配置，且使光從前記透明部的側面和對向面之雙方入射至前記光導的第2構成之至少任一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5g:偵測元件群</p>  
        <p type="p">10a:發光元件</p>  
        <p type="p">10b:發光元件</p>  
        <p type="p">10c:發光元件</p>  
        <p type="p">10ia:入射面</p>  
        <p type="p">10ib:入射面</p>  
        <p type="p">10ic:入射面</p>  
        <p type="p">11a:光導</p>  
        <p type="p">11b:光導</p>  
        <p type="p">11c:光導</p>  
        <p type="p">12a:受光元件</p>  
        <p type="p">12b:受光元件</p>  
        <p type="p">12c:受光元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1324" publication-number="202610984"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610984.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610984</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>過渡金屬團簇化合物、該化合物之製造方法、包含該化合物之感光性組合物、使用該組合物之圖案形成方法、基板及基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C61/04</main-classification>  
        <further-classification edition="200601120251201B">C07C61/06</further-classification>  
        <further-classification edition="200601120251201B">C07C61/08</further-classification>  
        <further-classification edition="200601120251201B">C07F7/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>服部繁樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATTORI, SHIGEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長山和弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAYAMA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山元啓司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, KEISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤茜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, AKANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋田拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKITA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本洋揮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠實現電路圖案之微細化之過渡金屬團簇化合物以及包含其之感光性組合物等。 &lt;br/&gt;本發明之過渡金屬團簇化合物之特徵在於包含過渡金屬原子、及具有飽和烴之脂環式結構之羧酸根配位基A，較佳為上述羧酸根配位基A包含具有至少1個取代基R之飽和烴之脂環式結構，上述取代基R為有機基或鹵素原子，又，上述脂環式結構之碳數為3～10。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1325" publication-number="202611917"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611917.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611917</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124718</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251114B">G11C11/401</main-classification>  
        <further-classification edition="202301120251114B">H10B12/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林漢鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, HANJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體記憶體裝置包括：一作用區，其與一基體在一垂直方向上間隔開且在一第一方向上延伸，該作用區包括一隱埋接點、一通道區及一直接接點；一字元線，其環繞該通道區且在與該第一方向相交之一第二方向上延伸；一電容器，其包括內含一電極支撐部分及一主電極部分之一第一電極，該電極支撐部分連接於該隱埋接點且在該垂直方向上具有一第一寬度，該主電極部分一體地連接於該電極支撐部分，且該主電極部分在該垂直方向上具有一第二寬度，其中該第二寬度大於該第一寬度；以及一絕緣襯裡，其環繞該隱埋接點及該第一電極之該電極支撐部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory device includes an active region spaced apart from a substrate in a vertical direction and extending in a first direction, the active region including a buried contact, a channel region, and a direct contact, a word line surrounding the channel region and extending in a second direction that crosses the first direction, a capacitor including a first electrode including an electrode support portion and a main electrode portion, the electrode support portion being connected to the buried contact and having a first width in the vertical direction, the main electrode portion being integrally connected to the electrode support portion, and the main electrode portion having a second width in the vertical direction, wherein the second width is greater than the first width, and an insulating liner surrounding the buried contact and the electrode support portion of the first electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體記憶體裝置</p>  
        <p type="p">102:基體</p>  
        <p type="p">102M:主表面</p>  
        <p type="p">129:絕緣結構</p>  
        <p type="p">130:閘極介電膜</p>  
        <p type="p">152:金屬矽化物膜</p>  
        <p type="p">154:傳導襯裡</p>  
        <p type="p">156:傳導插塞</p>  
        <p type="p">186:電極支撐部分</p>  
        <p type="p">187:介電膜</p>  
        <p type="p">188:第二電極</p>  
        <p type="p">190:板電極</p>  
        <p type="p">190A:中心部分</p>  
        <p type="p">190B:指狀部分</p>  
        <p type="p">BC:隱埋接點</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">CAP:電容器</p>  
        <p type="p">CB:記憶體胞元區塊</p>  
        <p type="p">DC:直接接點</p>  
        <p type="p">EX1:部分區</p>  
        <p type="p">WL:字元線</p>  
        <p type="p">X:第一側向方向、方向</p>  
        <p type="p">X1-X1':線</p>  
        <p type="p">Y:第二側向方向、方向</p>  
        <p type="p">Z:垂直方向、方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1326" publication-number="202610981"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610981.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610981</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物或團簇化合物、化合物之製造方法、包含該等化合物之感光性組合物、使用該組合物之圖案形成方法、基板及基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C51/41</main-classification>  
        <further-classification edition="200601120251201B">C07C61/04</further-classification>  
        <further-classification edition="200601120251201B">C07C61/08</further-classification>  
        <further-classification edition="200601120251201B">C07C62/24</further-classification>  
        <further-classification edition="200601120251201B">C07C61/39</further-classification>  
        <further-classification edition="200601120251201B">C07C67/30</further-classification>  
        <further-classification edition="200601120251201B">C07C69/75</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>服部繁樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATTORI, SHIGEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長山和弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAYAMA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山元啓司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, KEISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤茜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, AKANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋田拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKITA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本洋揮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種化合物或團簇化合物，其可獲得作為能夠形成超微細圖案之光阻具有較高實用性的感光性組合物。 &lt;br/&gt;本發明之化合物或團簇化合物之特徵在於，其係包含貧金屬元素、及具有飽和環狀結構之羧酸根配位基的化合物或團簇化合物，較佳為，上述羧酸根配位基中之貧金屬元素為鉍、在與羧酸根基所鍵結之碳C&lt;sub&gt;1&lt;/sub&gt;相鄰之碳C&lt;sub&gt;2&lt;/sub&gt;上具有取代基R&lt;sup&gt;1&lt;/sup&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1327" publication-number="202612020"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612020.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612020</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>即時電腦視覺端點偵測管線</chinese-title>  
        <english-title>REAL-TIME COMPUTER VISION END-POINT DETECTION PIPELINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/3065</main-classification>  
        <further-classification edition="200601120251201B">H01L21/66</further-classification>  
        <further-classification edition="200601120251201B">G01R33/10</further-classification>  
        <further-classification edition="202301120251201B">G06N5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商英富康公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INFICON, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴斯克斯　安東尼　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VASQUEZ, ANTHONY J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德雷克　凱爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRAKE, KYLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋　春花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, CHUNHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種半導體蝕刻程序端點偵測系統，其包含：一感測器，其經組態以即時量測與一半導體蝕刻程序相關聯之電性質且產生原始感測器資料；及一計算裝置，其經組態以接收該原始感測器資料。該計算裝置包含頻譜分析儀電路系統及一記憶體，其經組態以經由至少一個處理器執行該頻譜分析儀電路系統之指令。該等指令包含經由該感測器獲得該原始感測器資料；在該計算裝置處接收該原始感測器資料；預處理該原始感測器資料以將該原始感測器資料正規化至一標準範圍或分佈；選擇該經正規化感測器資料之至少一個最佳得分信號；將該至少一個最佳得分信號轉換至一像素空間；及對該像素空間執行一端點預測演算法以預測該半導體蝕刻程序之該端點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor etching process end-point detection system includes a sensor configured to measure in real-time electrical properties associated with a semiconductor etching process and to generate raw sensor data, and a computing device configured to receive the raw sensor data. The computing device includes spectrum analyzer circuitry and a memory configured to execute instructions of the spectrum analyzer circuitry via at least one processor. The instructions include obtaining, via the sensor, the raw sensor data; receiving, at the computing device, the raw sensor data; preprocessing the raw sensor data to normalize the raw sensor data to a standard range or distribution; selecting at least one best scoring signal of the normalized sensor data; converting the at least one best scoring signal to a pixel space; and performing an end-point prediction algorithm on the pixel space to predict the end-point of the semiconductor etching process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">210:接收原始感測器資料/原始感測器資料區塊</p>  
        <p type="p">230:信號選擇</p>  
        <p type="p">240:像素轉換</p>  
        <p type="p">250:輸入以客製經訓練之機器學習(「ML」)演算法</p>  
        <p type="p">260:端點(「EP」)預測</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1328" publication-number="202611545"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611545.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611545</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有峰值電流抑制技術之低功率單光子崩潰二極體光子計數器</chinese-title>  
        <english-title>LOW POWER SINGLE PHOTON AVALANCHE DIODE PHOTON COUNTER WITH PEAK CURRENT SUPPRESSION TECHNIQUE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251205B">G01S17/89</main-classification>  
        <further-classification edition="202001120251205B">G01S7/4865</further-classification>  
        <further-classification edition="202301120251205B">H04N25/70</further-classification>  
        <further-classification edition="202001120251205B">G01S7/4861</further-classification>  
        <further-classification edition="200601120251205B">G01J1/42</further-classification>  
        <further-classification edition="202501120251205B">H10D8/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>代　鐵軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, TIEJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於時差測距計算之感測器，其包含：一雷射，其經組態以向一目標處發射複數個光脈衝；一或多個SPAD，其經組態以偵測一TDC觸發事件，其中第一TDC觸發事件包含在該複數個光脈衝中之一初始光脈衝被反射至該一或多個SPAD時偵測到一或多個光子；一計數器，其經組態以計數該第一TDC觸發事件之該一或多個光子且以一第一解析度產生該一或多個光子之一第一直方圖；一全域窗口處理器，其經組態以讀取該第一直方圖且偵測該第一直方圖之一峰值；及一全域直方圖處理器，其經組態以偵測第二直方圖之一峰值，其中該第二直方圖之該峰值判定該感測器與該目標之間的一距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sensor for time of flight calculation, including a laser configured to emit a plurality of pulses of light at a target, one or more SPADs configured to detect a TDC trigger event, where the first TDC trigger event includes one or more photons detected as an initial pulse of light of the plurality of pulses of light is reflected to the one or more SPADs, a counter configured to count the one or more photons of the first TDC trigger event and generate a first histogram of the one or more photons at a first resolution, a global window processor configured to read the first histogram and detect a peak of the first histogram, and a global histogram processor configured to detect a peak of the second histogram, wherein the peak of the second histogram determines a distance between the sensor and the target.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:時間轉數位轉換感測器</p>  
        <p type="p">120:光源/雷射</p>  
        <p type="p">1000:時差測距量測設置/量測設置</p>  
        <p type="p">L:光</p>  
        <p type="p">T1:第一目標/目標</p>  
        <p type="p">T2:第二目標/目標</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1329" publication-number="202610987"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610987.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610987</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124763</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物或團簇化合物、化合物之製造方法、包含該等化合物之感光性組合物、使用該組合物之圖案形成方法、基板及基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C61/22</main-classification>  
        <further-classification edition="200601120251201B">C07C69/75</further-classification>  
        <further-classification edition="200601120251201B">C07C69/753</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>服部繁樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATTORI, SHIGEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長山和弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAYAMA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤茜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, AKANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山元啓司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, KEISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋田拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKITA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本洋揮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種化合物，其可獲得作為能夠形成超微細圖案之光阻具有較高實用性的感光性組合物。 &lt;br/&gt;本發明之化合物之特徵在於：其係含有金屬原子、及具有環狀結構之羧酸根配位基A者，且該羧酸根配位基A具有與羧酸根基鍵結之環狀結構，於該環狀結構中，與上述羧酸根基鍵結之環狀結構中之碳C&lt;sub&gt;1&lt;/sub&gt;為3級或4級碳，該環狀結構中之碳C&lt;sub&gt;1&lt;/sub&gt;所相鄰之碳C&lt;sub&gt;2&lt;/sub&gt;具有取代基R&lt;sup&gt;1&lt;/sup&gt;，該取代基R&lt;sup&gt;1&lt;/sup&gt;為有機基或鹵素原子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1330" publication-number="202611016"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611016.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611016</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124799</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋶鹽、酸擴散抑制劑、阻劑組成物、及圖案形成方法</chinese-title>  
        <english-title>SULFONIUM SALT, ACID DIFFUSION INHIBITOR, RESIST COMPOSITION, AND PATTERNING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C381/12</main-classification>  
        <further-classification edition="200601120251201B">C07D333/76</further-classification>  
        <further-classification edition="200601120251201B">C09K3/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/16</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原敬之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田美優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, MIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供光微影中無損感度而CDU、LWR等微影性能優異之化學增幅型阻劑材料使用之酸擴散抑制劑。一種下列通式(1)表示之鋶鹽。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="299px" width="477px" file="ed10247.JPG" alt="ed10247.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、及R&lt;sup&gt;3&lt;/sup&gt;各自獨立地表示氟原子、羥基、三氟甲基、三氟甲氧基、三氟乙醯氧基、氰基、胺甲醯基、醯胺基、或也可以含有雜原子之碳數1～15之直鏈狀、分支狀、或環狀之1價烴基。r表示0～4之整數，p表示0～5之整數，q表示0～5之整數，x表示0～4之整數，y表示0～5之整數，z表示0～5之整數，r、p、q、x、y、z為符合x＋y＋z≧1、4≧r＋x≧0、5≧p＋y≧0、及5≧q＋z≧0之整數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a sulfonium salt represented by the following general formula (1). In the formula, R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, and R&lt;sup&gt;3&lt;/sup&gt; represent a fluorine atom, a hydroxy group, a trifluoromethyl group, a trifluoromethoxy group, a trifluoroacetyloxy group, a cyano group, a carbamoyl group, an amide group, or a linear, branched, or cyclic monovalent hydrocarbon group having 1 to 15 carbon atoms and optionally having a heteroatom; “r” represents an integer of 0 to 4, “p” represents an integer of 0 to 5, “q” represents an integer of 0 to 5, “x” represents an integer of 0 to 4, “y” represents an integer of 0 to 5, “z” represents an integer of 0 to 5, and “r”, “p”, “q”, “x”, “y”, and “z” satisfy x+y+z≥1, 4≥r+x≥0, 5≥p+y≥0, and 5≥q+z≥0. This can provide an acid diffusion inhibitor used for a chemically-amplified resist material that does not impair sensitivity in photolithography and is excellent in lithography performances such as CDU and LWR. &lt;br/&gt;&lt;img align="absmiddle" height="229px" width="404px" file="ed10248.JPG" alt="ed10248.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1331" publication-number="202611020"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611020.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611020</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124809</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>胺基醛中間體之鈀催化合成</chinese-title>  
        <english-title>PALLADIUM CATALYZED SYNTHESIS OF AMINOALDEHYDE INTERMEDIATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D205/04</main-classification>  
        <further-classification edition="200601120251201B">C07D401/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泛特夏　莎琳娜　瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANTASIA, SERENA MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費杜　尼古拉斯　米凱爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEDOU, NICOLAS MICKAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供了合成經取代之氟烷基四氫吖唉基-胺基-苯甲醛衍生物的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are processes for the synthesis of substituted fluoroalkyl azetidinyl-amino-benzaldehyde derivatives.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1332" publication-number="202610975"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610975.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610975</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124830</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎓鹽型單體、聚合物、化學增幅負型阻劑組成物及阻劑圖案形成方法</chinese-title>  
        <english-title>ONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C25/18</main-classification>  
        <further-classification edition="200601120251201B">C07C309/73</further-classification>  
        <further-classification edition="200601120251201B">C07C309/74</further-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">C07D327/08</further-classification>  
        <further-classification edition="200601120251201B">C07D333/76</further-classification>  
        <further-classification edition="200601120251201B">C08F212/14</further-classification>  
        <further-classification edition="200601120251201B">C08F212/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="201201120251201B">G03F1/24</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供具有優異的蝕刻耐性、有機溶劑溶解性和適度的酸強度、並且能夠產生擴散小的酸的鎓鹽型單體、使用其的包含聚合物鍵結型酸產生劑的基礎聚合物、使用其的化學增幅負型阻劑組成物、以及使用該化學增幅負型阻劑組成物的阻劑圖案形成方法。 &lt;br/&gt;本發明之解決手段為下述式(A1)所示的鎓鹽型單體。 &lt;br/&gt;&lt;img align="absmiddle" height="125px" width="435px" file="ed10425.JPG" alt="ed10425.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are an onium salt monomer which has excellent etching resistance, organic solvent solubility, and appropriate acid strength, and can generate an acid with low diffusion, a base polymer comprising a polymer-bonded acid generator using the same, a chemically amplified negative resist composition using the same, and a resist pattern forming process using the chemically amplified negative resist composition. &lt;br/&gt;An onium salt monomer has the formula (A1): &lt;br/&gt;&lt;img align="absmiddle" height="132px" width="442px" file="ed10426.JPG" alt="ed10426.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1333" publication-number="202611322"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611322.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611322</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124850</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鉬的金屬膜的成膜方法及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C23C16/02</main-classification>  
        <further-classification edition="200601120251201B">C23C16/06</further-classification>  
        <further-classification edition="200601120251201B">C23C16/455</further-classification>  
        <further-classification edition="200601120251201B">C23C16/52</further-classification>  
        <further-classification edition="200601120251201B">C23C16/54</further-classification>  
        <further-classification edition="200601120251201B">H01L21/02</further-classification>  
        <further-classification edition="200601120251201B">H01L21/285</further-classification>  
        <further-classification edition="200601120251201B">H01L21/768</further-classification>  
        <further-classification edition="200601120251201B">H01L23/532</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北條大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOJO, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤夕佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, YUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野一修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, KAZUNAGA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>若林哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKABAYASHI, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠成膜出比電阻小的鉬的金屬膜之技術。 &lt;br/&gt;在基板上成膜出鉬的金屬膜時，實施在基板上成膜出鎢的金屬基底膜之工序及在金屬基底膜上成膜出該金屬膜之工序。藉由在鎢的金屬基底膜上成膜出鉬的金屬膜，能夠成膜出鉬的晶粒尺寸增大且比電阻小的鉬的金屬膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:SiO&lt;sub&gt;2&lt;/sub&gt;膜(矽氧化膜)</p>  
        <p type="p">12:W膜(鎢的金屬基底膜)</p>  
        <p type="p">13:Mo膜(鉬的金屬膜)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1334" publication-number="202611226"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611226.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611226</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124856</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環氧樹脂組成物、硬化物、半導體裝置及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08L63/00</main-classification>  
        <further-classification edition="200601120251201B">C08K5/10</further-classification>  
        <further-classification edition="200601120251201B">C08K3/36</further-classification>  
        <further-classification edition="200601120251201B">H01L23/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納美仕股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂野裕斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIGENO, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大江貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OE, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種於模鑄後晶圓難以產生翹曲的環氧樹脂組成物。又，提供上述環氧樹脂組成物的硬化物、具備上述硬化物的半導體裝置、上述半導體裝置之製造方法。 &lt;br/&gt;　　一種環氧樹脂組成物，包含：環氧樹脂(A)、分子內具有聚四亞甲基醚構造的化合物(B)、無機填充材(C)及硬化劑(E)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1335" publication-number="202612087"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612087.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612087</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124866</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250806B">H01L21/677</main-classification>  
        <further-classification edition="200601120250806B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. LINGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖臘財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種半導體處理系統，包括：橫截面呈三角形的適配器；第一傳送室的第一側壁連接到適配器並氣體聯通，第二側壁連接到第一連接腔；多個製程處理室，與適配器的外壁和第一傳送室至少一個第三側壁連接，其中第一連接腔、第一傳送室的橫截面整體呈長方形，機械手臂，設置在第一傳送室內；機械手臂用於將待處理基材傳送於各個製程處理室之間。本發明可較大程度降低腔體加工難度和加工成本，實現系統靈活組合，提高基片傳送效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:適配器</p>  
        <p type="p">200:第一連接腔</p>  
        <p type="p">201:第二狹縫閥</p>  
        <p type="p">300:第一傳送室</p>  
        <p type="p">301:機械手臂</p>  
        <p type="p">302:第一側壁</p>  
        <p type="p">303:第二側壁</p>  
        <p type="p">304:第三側壁</p>  
        <p type="p">312:第一傳送區域</p>  
        <p type="p">400:製程處理室</p>  
        <p type="p">401:第一狹縫閥</p>  
        <p type="p">500:前端模組</p>  
        <p type="p">501:第五縫隙閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1336" publication-number="202611316"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611316.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611316</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124870</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源饋入組件、罩體、上電極裝置及濺射沉積設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">C23C14/34</main-classification>  
        <further-classification edition="200601120251204B">C23C14/35</further-classification>  
        <further-classification edition="200601120251204B">C23C14/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李兆晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連增迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　狄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, DEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　身健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHENJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張旭彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇宜龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周子琛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種電源饋入組件、罩體、上電極裝置及濺射沉積設備。電源饋入組件，包括輸入端和環，輸入端用於電連接電源，環用於電連接靶材，以及自輸入端至環形成的軸向多層環形樹狀導體結構，樹狀導體結構自輸入端逐層分支出多個末端，末端電連接至環，末端在環上周向均勻分佈，且自輸入端至每一個末端的阻抗相等。本發明通過樹狀弧形電連接結構形成電源饋入組件，使電源饋入組件可由邊緣區域電連接電源後，經樹狀弧形電連接結構沿邊緣區域均勻分散至饋入環上，從而避讓出中部區域的磁控管驅動結構安裝空間，並保證了電源饋入均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電源饋入組件</p>  
        <p type="p">110:環</p>  
        <p type="p">120:輸入端</p>  
        <p type="p">131:a導體</p>  
        <p type="p">132:b導體</p>  
        <p type="p">141:a接頭</p>  
        <p type="p">142:b接頭</p>  
        <p type="p">151:c導體</p>  
        <p type="p">152:d導體</p>  
        <p type="p">153:e導體</p>  
        <p type="p">154:f導體</p>  
        <p type="p">161:c接頭</p>  
        <p type="p">162:d接頭</p>  
        <p type="p">163:e接頭</p>  
        <p type="p">164:f接頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1337" publication-number="202610898"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610898.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610898</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124879</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有螺旋齒形的捆紮裝置張緊輪</chinese-title>  
        <english-title>STRAPPING DEVICE TENSION WHEEL WITH A HELICAL TOOTHING PATTERN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">B65B13/02</main-classification>  
        <further-classification edition="200601120251211B">B65B13/18</further-classification>  
        <further-classification edition="200601120251211B">B65H59/10</further-classification>  
        <further-classification edition="200601120251211B">F16H55/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賽諾得工業集團有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIGNODE INDUSTRIAL GROUP LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯利格　庫爾特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOLLIGER, KURT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開的各種實施例提供了一種用於捆紮裝置的張緊輪。該張緊輪包括主體，該主體包括具有縱軸的圓柱形外表面以及該主體的該外表面上的多個齒。該等齒沿著圍繞該外表面的螺旋路徑佈置。本公開的各種實施例提供了一種捆紮裝置，該捆紮裝置包括張緊輪、張緊板、馬達和靠近該張緊板的帶止動件。該螺旋路徑被配置使得當該帶層被引入到該張緊輪和該張緊板之間並且啟動該馬達時，該馬達沿著張緊旋轉方向旋轉該張緊輪，使得該等齒在縱向帶方向上對該帶層施加縱向力，並在該橫向帶方向上對該帶層施加朝向該帶止動件的橫向力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments of the present disclosure provide a tension wheel for a strapping device. The tension wheel includes a body including a cylindrical outer surface having a longitudinal axis and multiple teeth on the outer surface of the body. The teeth are arranged along a helical path around the outer surface. Various embodiments of the present disclosure provide a strapping device including the tension wheel, a tension plate, a motor, and a strap stop near the tension plate. The helical path is configured such that, when a strap layer is introduced between the tension wheel and the tension plate and the motor is activated, the motor rotates the tension wheel in a tensioning rotational direction, causing the teeth to impose a longitudinal force on the strap layer in a longitudinal strap direction and a transverse force on the strap layer toward the strap stop in a transverse strap direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:張緊輪</p>  
        <p type="p">110:主體</p>  
        <p type="p">120:外齒</p>  
        <p type="p">130:內齒</p>  
        <p type="p">A&lt;sub&gt;100&lt;/sub&gt;:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1338" publication-number="202611413"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611413.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611413</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124888</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有可調節遲滯帶與定時咬合之輪轂系統、方法及裝置</chinese-title>  
        <english-title>HUB SYSTEM, METHOD AND DEVICE WITH ADJUSTABLE DEADBAND AND TIMED ENGAGEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">F16D41/30</main-classification>  
        <further-classification edition="200601120251209B">F16D7/04</further-classification>  
        <further-classification edition="200601120251209B">B62M9/00</further-classification>  
        <further-classification edition="200601120251209B">F16D27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勁鋒鐵馬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE HIVE GLOBAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格雷格　史瑞西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREG, THRASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬治　杜波依斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEORGE, DUBOIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬　彼德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOEL, PETERS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種飛輪輪轂，其具有非零遲滯帶距離，以減少或消除踏板反衝。該遲滯帶距離能夠具有或調節到所需長度，並且咬合正時能夠調節到所需對準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A freewheel hub having a non-zero deadband distance in order to reduce or eliminate pedal kickback. The deadband distance is able to have or be adjusted to a desired length and the engagement timing is able to be adjusted to a desired alignment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:自行車總成、總成、自行車</p>  
        <p type="p">202:自行車後輪、後輪、車輪</p>  
        <p type="p">204:自行車架、自行車前三角架</p>  
        <p type="p">206:自行車架、自行車後三角架</p>  
        <p type="p">208:自行車曲柄、踏板曲柄、曲柄</p>  
        <p type="p">209:自行車齒盤、齒盤</p>  
        <p type="p">210:自行車後避震器</p>  
        <p type="p">212:自行車鏈條、鏈條</p>  
        <p type="p">214:自行車飛輪、飛輪</p>  
        <p type="p">215:自行車後撥鏈器、撥鏈器</p>  
        <p type="p">216:自行車懸吊連桿、懸吊連桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1339" publication-number="202611235"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611235.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611235</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124904</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物分解性聚酯不織布及其所成之不織布製品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08L101/16</main-classification>  
        <further-classification edition="200601120251201B">C08L67/04</further-classification>  
        <further-classification edition="200601120251201B">C08K5/527</further-classification>  
        <further-classification edition="200601120251201B">D01F1/10</further-classification>  
        <further-classification edition="200601120251201B">D01F6/62</further-classification>  
        <further-classification edition="200601120251201B">D01F6/92</further-classification>  
        <further-classification edition="201201120251201B">D04H1/435</further-classification>  
        <further-classification edition="201201120251201B">D04H3/011</further-classification>  
        <further-classification edition="200601120251201B">D21H13/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商帝人富瑞特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEIJIN FRONTIER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能登愛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOTO, AI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神山三枝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIYAMA, MIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種生物分解性聚酯不織布，其含有20重量%以上之由脂肪族聚酯樹脂所成之纖度為0.1dtex以上，且含有亞磷酸酯系分解促進劑之升溫結晶化峰值溫度為100℃以下之未延伸纖維。進一步地，較佳為含有延伸纖維，或為海洋生物分解性。此外，內含使用本發明的不織布之不織布製品，即茶包、咖啡過濾器、高湯包、容器、包裝、面罩、過濾器、衛生用品、擦拭布、濕紙巾等。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1340" publication-number="202612057"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612057.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612057</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124919</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腔體頂蓋及ＣＶＤ反應裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250908B">H01L21/67</main-classification>  
        <further-classification edition="200601120250908B">C23C16/455</further-classification>  
        <further-classification edition="200601120250908B">C23C16/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. LINGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭振宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種腔體頂蓋及CVD反應裝置，涉及半導體設備技術領域。腔體頂蓋設置在CVD反應裝置的反應腔上，包括：限制環，其位於反應腔的上方並沿反應腔的軸向延伸；氣體供給部，其設置在限制環的頂端，用於向反應腔內注入工藝氣體；頂蓋側壁，其圍繞在限制環的外周；頂蓋蓋板，其固定設置在頂蓋側壁的頂端，並圍繞在氣體供給部的外周，限制環、頂蓋側壁、頂蓋蓋板共同圍成頂蓋緩衝腔，通過頂蓋緩衝腔向反應腔內注入吹掃氣體；阻流板，其設置在頂蓋緩衝腔內的底部，並圍繞在限制環的外周，阻流板與頂蓋側壁和限制環之間具有間隙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:CVD反應裝置</p>  
        <p type="p">10:腔體頂蓋</p>  
        <p type="p">10a:進氣區域</p>  
        <p type="p">10b:頂蓋緩衝腔</p>  
        <p type="p">101:頂蓋側壁</p>  
        <p type="p">1011:頂蓋沿邊</p>  
        <p type="p">102:頂蓋蓋板</p>  
        <p type="p">103:限制環</p>  
        <p type="p">104:氣體供給部</p>  
        <p type="p">105:勻流板</p>  
        <p type="p">1051:勻氣槽</p>  
        <p type="p">1052:勻氣孔</p>  
        <p type="p">106:阻流板</p>  
        <p type="p">113:保護罩</p>  
        <p type="p">114:隔板</p>  
        <p type="p">115:台階螺絲</p>  
        <p type="p">116:連接桿</p>  
        <p type="p">121:第一冷卻部</p>  
        <p type="p">122:第二冷卻部</p>  
        <p type="p">20:反應腔</p>  
        <p type="p">201:反應腔側壁</p>  
        <p type="p">202:底板</p>  
        <p type="p">203:排氣口</p>  
        <p type="p">205:密封圈</p>  
        <p type="p">211:旋轉筒</p>  
        <p type="p">212:托盤</p>  
        <p type="p">213:下加熱器</p>  
        <p type="p">214:反射板</p>  
        <p type="p">215:保溫層</p>  
        <p type="p">221:上襯套</p>  
        <p type="p">222:下襯套</p>  
        <p type="p">230:反射環</p>  
        <p type="p">240:安裝環</p>  
        <p type="p">251:上隔熱筒</p>  
        <p type="p">252:下隔熱筒</p>  
        <p type="p">260:側加熱器</p>  
        <p type="p">270:第三冷卻部</p>  
        <p type="p">271:凸台</p>  
        <p type="p">280:吸熱筒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1341" publication-number="202610930"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610930.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610930</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124931</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一氧化碳及氫之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C01B3/38</main-classification>  
        <further-classification edition="201701120251201B">C01B32/40</further-classification>  
        <further-classification edition="200601120251201B">B01J23/10</further-classification>  
        <further-classification edition="200601120251201B">B01J23/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商柯萊斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRASUS CHEMICAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松原仁志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUBARA, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITAGAKI, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>細木康弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSOGI, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為提供一種方法，其係藉由對觸媒施加電壓，使二氧化碳與甲烷於氣相中進行反應，製造一氧化碳及氫的方法，其特徵為改善目的物之一氧化碳及氫的STY之方法。一邊於對具有3.3～6.0eV之帶隙(Band gap)的半導體載體載持釕(Ru)的觸媒流通電流，一邊在反應溫度80～400℃，於觸媒的存在下，使二氧化碳與甲烷於氣相中進行反應之一氧化碳及氫之製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:二氧化碳與甲烷的反應裝置</p>  
        <p type="p">2:觸媒層</p>  
        <p type="p">3:反應管</p>  
        <p type="p">4:高壓側電極</p>  
        <p type="p">5:接地側電極</p>  
        <p type="p">6:電源</p>  
        <p type="p">7:加熱器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1342" publication-number="202610540"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610540.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610540</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124958</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>釣魚用紡車式捲線器</chinese-title>  
        <english-title>SPINNING REEL FOR FISHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251114B">A01K89/01</main-classification>  
        <further-classification edition="200601120251114B">A01K89/015</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辻崇文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUJI, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>落合浩士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OCHIAI, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種釣魚用紡車式捲線器，其能夠在捲筒軸與套環構件接觸並產生卡滯時，藉由轉子的旋轉使軸環構件旋轉，從而消除捲筒軸與軸環構件接觸時的黏滑現象，並使捲筒軸的前後往復運動及轉子的旋轉變得順暢。 &lt;br/&gt;　　用以解決課題之手段為，本發明提供一種釣魚用紡車式捲線器，係具備：相對於捲線器本體(10)往復移動的捲筒軸(15)；在捲筒軸(15)周圍旋轉的小齒輪(19)；與小齒輪(19)一體旋轉的轉子(30)；配置於捲筒軸(15)周緣，並將轉子(30)固定於小齒輪(19)的轉子螺帽(21)；配置於捲筒軸(15)與轉子螺帽(21)的徑向之間，並可旋轉地支承轉子螺帽(21)的軸承(23)；配置於捲筒軸(15)與軸承(23)之間的圓筒構件(25)；及將圓筒構件(25)切換為與轉子螺帽(21)一體旋轉或無需旋轉的旋轉控制構件(110)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:捲筒軸</p>  
        <p type="p">19:小齒輪</p>  
        <p type="p">21:轉子螺帽</p>  
        <p type="p">21a:筒部</p>  
        <p type="p">21b:裝設部</p>  
        <p type="p">23:軸承</p>  
        <p type="p">25:圓筒構件</p>  
        <p type="p">29:保持構件</p>  
        <p type="p">30:轉子</p>  
        <p type="p">30a:轉子抵接部</p>  
        <p type="p">50:密封構件</p>  
        <p type="p">100:轉子接收部</p>  
        <p type="p">110:旋轉控制構件</p>  
        <p type="p">111:第1彈性部</p>  
        <p type="p">112:第2彈性部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1343" publication-number="202611000"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611000.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611000</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124972</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、包含該化合物之感光性組合物、使用該組合物之圖案形成方法、基板及基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C271/28</main-classification>  
        <further-classification edition="200601120251201B">C07D211/60</further-classification>  
        <further-classification edition="200601120251201B">C07F7/00</further-classification>  
        <further-classification edition="200601120251201B">C07F7/22</further-classification>  
        <further-classification edition="200601120251201B">C07F9/94</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石橋孝一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIBASHI, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>服部繁樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATTORI, SHIGEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋田拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKITA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長山和弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAYAMA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉田敦大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMADA, ATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本洋揮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠實現電路圖案之微細化之化合物、及包含其之感光性組合物。 &lt;br/&gt;本發明之化合物之特徵在於具有金屬原子及配位基，且該配位基包含下述式(1)所表示之部分結構。 &lt;br/&gt;&lt;img align="absmiddle" height="91px" width="170px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;於上述式(1)中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;為氫原子或任意取代基，各自可相同亦可不同，又，可形成環。但R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;不同時為氫原子。R&lt;sup&gt;3&lt;/sup&gt;為胺基甲酸酯之氧側之含α氫取代基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1344" publication-number="202611123"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611123.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611123</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125005</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑下層膜形成用組成物、圖案形成方法、及阻劑下層膜形成方法</chinese-title>  
        <english-title>COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/14</main-classification>  
        <further-classification edition="200601120251201B">C08F220/18</further-classification>  
        <further-classification edition="200601120251201B">C08F220/28</further-classification>  
        <further-classification edition="200601120251201B">C08F220/32</further-classification>  
        <further-classification edition="200601120251201B">C08F220/58</further-classification>  
        <further-classification edition="200601120251201B">C08L33/14</further-classification>  
        <further-classification edition="200601120251201B">C08L33/24</further-classification>  
        <further-classification edition="200601120251201B">C08K5/3492</further-classification>  
        <further-classification edition="200601120251201B">G03F7/11</further-classification>  
        <further-classification edition="200601120251201B">G03F7/16</further-classification>  
        <further-classification edition="200601120251201B">G03F7/40</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林直貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郡大佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢野俊治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANO, TOSHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供作為抗反射膜發揮功能，具有優異的鹼性過氧化氫水耐性、良好的填埋/平坦化特性、和乾蝕刻特性的阻劑下層膜形成用組成物、使用其的圖案形成方法、和阻劑下層膜形成方法。 &lt;br/&gt;一種阻劑下層膜形成用組成物，其特徵在於包含： &lt;br/&gt;(A)具有下述式(A-1)表示的結構單元(a1)和選自下述式(A-2)~(A-4)表示的結構單元中的至少1種結構單元(a2)的高分子化合物、 &lt;br/&gt;(B)下述式(B-1)表示的交聯劑、 &lt;br/&gt;(C)有機溶劑。 &lt;br/&gt;[化1] &lt;br/&gt;&lt;img align="absmiddle" height="302px" width="411px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a composition for forming a resist underlayer film, which serves as an antireflective film and which has excellent resistance to alkaline hydrogen peroxide water and favorable filling/planarization characteristics and dry etching characteristics, as well as a patterning process and a resist underlayer film formation process each using the composition. A composition for forming a resist underlayer film, the composition including: (A) a polymer compound having a structural unit (a1) represented by the following formula (A-1) and at least one structural unit (a2) selected from structural units represented by the following formulae (A-2) to (A-4); (B) a crosslinking agent represented by the following formula (B-1); and (C) an organic solvent. &lt;br/&gt;&lt;img align="absmiddle" height="302px" width="411px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:被加工層</p>  
        <p type="p">2a:形成於基板的圖案</p>  
        <p type="p">3:阻劑下層膜</p>  
        <p type="p">3a:阻劑下層膜圖案</p>  
        <p type="p">4:阻劑中間膜</p>  
        <p type="p">4a:阻劑中間膜圖案</p>  
        <p type="p">5:阻劑上層膜</p>  
        <p type="p">5a:阻劑圖案</p>  
        <p type="p">6:所用部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1345" publication-number="202611106"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611106.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611106</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125014</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>RESIST COMPOSITION AND PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F12/16</main-classification>  
        <further-classification edition="200601120251201B">C08F12/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊地駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草間理志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAMA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大山皓介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHYAMA, KOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，感度及極限解析度優良的非化學增幅阻劑組成物，以及提供使用該阻劑組成物之圖案形成方法。 &lt;br/&gt;該課題之解決手段為一種阻劑組成物，含有： &lt;br/&gt;含有下式(1)表示之具有超原子價碘結構之重複單元的聚合物， &lt;br/&gt;含羧基之化合物，及 &lt;br/&gt;溶劑。 &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="315px" file="ed10056.JPG" alt="ed10056.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resist composition containing a polymer containing a repeat unit having a hypervalent iodine structure having the formula (1), a carboxy group-containing compound, and a solvent. &lt;br/&gt;&lt;img align="absmiddle" height="147px" width="324px" file="ed10057.JPG" alt="ed10057.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1346" publication-number="202610988"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610988.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610988</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125035</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>３，４，５，６－四氫鄰苯二甲酸金屬鹽、聚烯烴系樹脂用結晶成核劑、聚烯烴系樹脂組成物、及聚烯烴系樹脂成形體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C61/24</main-classification>  
        <further-classification edition="200601120251201B">C08K5/098</further-classification>  
        <further-classification edition="200601120251201B">C08L23/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新日本理化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEW JAPAN CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩崎祥平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASAKI, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供：能夠提高聚烯烴系樹脂成形體之結晶化溫度之聚烯烴系樹脂用結晶成核劑。 &lt;br/&gt;又，本發明提供：可用作上述聚烯烴系樹脂用結晶成核劑之3,4,5,6-四氫鄰苯二甲酸金屬鹽、使用上述聚烯烴系樹脂用結晶成核劑之聚烯烴系樹脂組成物、及聚烯烴系樹脂成形體。 &lt;br/&gt;本發明係一種3,4,5,6-四氫鄰苯二甲酸金屬鹽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1347" publication-number="202612331"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612331.zip"/>
    </tif-files>
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      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612331</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於渲染階層編碼視訊序列中之疊加層之方法、裝置、系統及非暫時性電腦可讀儲存媒體</chinese-title>  
        <english-title>METHOD, DEVICE, SYSTEM, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM FOR RENDERING OVERLAYS IN A HIERARCHICALLY ENCODED VIDEO SEQUENCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251201B">H04N19/176</main-classification>  
        <further-classification edition="201401120251201B">H04N19/174</further-classification>  
        <further-classification edition="201101120251201B">H04N21/4408</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商安訊士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AXIS AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰瑞森　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORESSON, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾多　比約恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARDO, BJORN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於渲染具有一增強層及一基底層之一階層編碼視訊序列中之疊加層之方法(800)、裝置、系統及軟體。依一第一解析度及一第二解析度表示(S802)一視訊序列。依該第一解析度在該視訊序列中渲染(S804)包括字形之一第一圖案之一第一疊加層，其中依該第一解析度在該視訊序列中之一第一像素處渲染一或多個字形之一第一字形。依該第二解析度在該視訊序列中渲染(S810)包括該第一圖案之一第二疊加層。控制(S812)該第二疊加層之該渲染以渲染藉由根據該第一解析度與該第二解析度之間的一比率將第一像素位置映射至第二像素位置來獲得之一第二像素位置處之該第一字形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to methods (800), devices, systems and software for rendering overlays in a hierarchically encoded video sequence having an enhancement layer and a base layer. A video sequence is represented (S802) at a first resolution and a second resolution. A first overlay comprising a first pattern of glyphs is rendered (S804) in the video sequence at the first resolution, wherein a first glyph of the one or more glyphs is rendered at a first pixel in the video sequence at the first resolution. A second overlay comprising the first pattern is rendered (S810) in the video sequence at the second resolution. The rendering of the second overlay is controlled (S812) to render the first glyph at a second pixel position obtained by mapping the first pixel position to the second pixel position according to a ratio between the first resolution and the second resolution.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:方法</p>  
        <p type="p">S802:步驟</p>  
        <p type="p">S804:步驟</p>  
        <p type="p">S806:步驟</p>  
        <p type="p">S808:步驟</p>  
        <p type="p">S810:步驟</p>  
        <p type="p">S812:步驟</p>  
        <p type="p">S814:步驟</p>  
        <p type="p">S816:步驟</p>  
        <p type="p">S818:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1348" publication-number="202611058"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611058.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611058</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125045</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環狀胜肽的純化方法及製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K1/14</main-classification>  
        <further-classification edition="200601120251201B">C07K5/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中外製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUGAI SEIYAKU KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中耕太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種純化方法，其為環狀胜肽的純化方法，其包括從含有純化目標物之環狀胜肽及作為雜質之胜肽的混合物中，將純化目標物之前述環狀胜肽或作為雜質之前述胜肽作成與二價金屬離子或者含有二價金屬離子的金屬鹽的複合物並進行分離之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1349" publication-number="202611449"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611449.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611449</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125052</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>極低溫冷凍機及緩衝裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">F25B9/06</main-classification>  
        <further-classification edition="200601120251211B">F04B41/06</further-classification>  
        <further-classification edition="200601120251211B">F17C1/00</further-classification>  
        <further-classification edition="200601120251211B">F25B9/10</further-classification>  
        <further-classification edition="200601120251211B">F25B9/00</further-classification>  
        <further-classification edition="200601120251211B">F25B49/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友重機械工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横土敬幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKODO, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 小型化與極低溫冷凍機一同使用之緩衝容積。 &lt;br/&gt;　　[解決手段] 極低溫冷凍機(10)具備：主壓縮機(12)，係使工作氣體升壓；膨脹機(14)，係藉由工作氣體的膨脹而產生寒冷；氣體管路(62)，係連接主壓縮機(12)與膨脹機(14)以使工作氣體在主壓縮機(12)與膨脹機(14)之間循環；及緩衝管路(68)，係構成為對氣體管路(62)進行工作氣體的供排。緩衝管路(68)具備：副壓縮機(70)，使工作氣體升壓；及緩衝容積(72)，連接於副壓縮機(70)的吐出側與氣體管路(62)之間或氣體管路(62)與副壓縮機(70)的吸入側之間，儲存工作氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:極低溫冷凍機</p>  
        <p type="p">12:主壓縮機</p>  
        <p type="p">14:膨脹機</p>  
        <p type="p">16:冷凍機缸體</p>  
        <p type="p">16a:第1缸體</p>  
        <p type="p">16b:第2缸體</p>  
        <p type="p">18:置換器組裝體</p>  
        <p type="p">18a:第1置換器</p>  
        <p type="p">18b:第2置換器</p>  
        <p type="p">20:冷凍機殼體</p>  
        <p type="p">22:高壓氣體入口</p>  
        <p type="p">24:低壓氣體出口</p>  
        <p type="p">33:第1冷卻臺</p>  
        <p type="p">35:第2冷卻臺</p>  
        <p type="p">40:壓力切換閥</p>  
        <p type="p">42:膨脹機馬達</p>  
        <p type="p">43:運動轉換機構</p>  
        <p type="p">44:置換器驅動軸</p>  
        <p type="p">46:溫度感測器</p>  
        <p type="p">50:高壓氣體出口</p>  
        <p type="p">51:低壓氣體入口</p>  
        <p type="p">52:高壓流路</p>  
        <p type="p">53:低壓流路</p>  
        <p type="p">54:第1壓力感測器</p>  
        <p type="p">55:第2壓力感測器</p>  
        <p type="p">56:旁通管路</p>  
        <p type="p">57:壓縮機本體</p>  
        <p type="p">58:壓縮機殼體</p>  
        <p type="p">60:溢流閥</p>  
        <p type="p">62:氣體管路</p>  
        <p type="p">63:高壓管路</p>  
        <p type="p">64:低壓管路</p>  
        <p type="p">65:高壓配管</p>  
        <p type="p">66:低壓配管</p>  
        <p type="p">68:緩衝管路</p>  
        <p type="p">68a:吸入流路</p>  
        <p type="p">68b:吐出流路</p>  
        <p type="p">70:副壓縮機</p>  
        <p type="p">72:緩衝容積</p>  
        <p type="p">74:緩衝槽</p>  
        <p type="p">76:供給閥</p>  
        <p type="p">78:緩衝壓力感測器</p>  
        <p type="p">100:控制裝置</p>  
        <p type="p">110:控制器</p>  
        <p type="p">PB:測定緩衝壓力訊號</p>  
        <p type="p">PH:第1測定壓力訊號</p>  
        <p type="p">PL:第2測定壓力訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1350" publication-number="202610759"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610759.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610759</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125053</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低溫泵搬運支援器具及其使用方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">B23P19/04</main-classification>  
        <further-classification edition="200601120251211B">F04B37/08</further-classification>  
        <further-classification edition="200601120251211B">B66F5/00</further-classification>  
        <further-classification edition="200601120251211B">B66C7/02</further-classification>  
        <further-classification edition="200601120251211B">F16M11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友重機械工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太田賢一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩屋口大造</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAYAGUCHI, TAIZO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]本發明提供一種支援在真空腔室中安裝或拆卸低溫泵之技術。 &lt;br/&gt;　　[解決手段]本發明提供一種用於在真空腔室(102)中安裝或拆卸低溫泵(200)之低溫泵搬運支援器具(10)。低溫泵搬運支援器具(10)具備：底座(12)，係可拆卸地設置於真空腔室(102)的下方，並且構成為將低溫泵(200)從搬入或搬出低溫泵(200)之底座(12)上的第1位置(P1)引導至與真空腔室(102)的開口部(104)對向之底座(12)上的第2位置(P2)、或者從第2位置(P2)引導至第1位置(P1)；及千斤頂(20)，係在低溫泵(200)位於第2位置時，使低溫泵(200)向開口部(104)上升或從開口部(104)下降。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:低溫泵搬運支援器具</p>  
        <p type="p">12:底座</p>  
        <p type="p">14:底座本體</p>  
        <p type="p">16:導軌</p>  
        <p type="p">18:低溫泵基座</p>  
        <p type="p">18a:第1低溫泵基座</p>  
        <p type="p">18b:第2低溫泵基座</p>  
        <p type="p">20:千斤頂</p>  
        <p type="p">26:支撐腳</p>  
        <p type="p">100:真空程序裝置</p>  
        <p type="p">102:真空腔室</p>  
        <p type="p">104:開口部</p>  
        <p type="p">106:收納箱</p>  
        <p type="p">108:配置空間</p>  
        <p type="p">110:地面</p>  
        <p type="p">200:低溫泵</p>  
        <p type="p">202:低溫板容器</p>  
        <p type="p">204:連接容器</p>  
        <p type="p">206:冷凍機</p>  
        <p type="p">208:吸氣口凸緣</p>  
        <p type="p">P1:第1位置</p>  
        <p type="p">P2:第2位置</p>  
        <p type="p">A1:箭頭</p>  
        <p type="p">A2:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1351" publication-number="202611193"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611193.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611193</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於耐刮擦防霧塗層之共聚物及塗層組合物</chinese-title>  
        <english-title>COPOLYMER AND COATING COMPOSITION FOR SCRATCH RESISTANT ANTI-FOG COATING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251212B">C08J7/054</main-classification>  
        <further-classification edition="200601120251212B">C08G77/44</further-classification>  
        <further-classification edition="200601120251212B">C09D133/26</further-classification>  
        <further-classification edition="200601120251212B">C08F220/18</further-classification>  
        <further-classification edition="200601120251212B">C09D5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商邁圖高新材料公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOMENTIVE PERFORMANCE MATERIALS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>單小鷹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAN, XIAOYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫巴爾　拉加文德拉　塞塔拉馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEBBAR, RAGHAVENDRA SEETHARAMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昊哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HAOZHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於共聚物、其製備方法及包含其之塗層組合物。共聚物包含衍生自矽氧基官能化單體及衍生自親水性有機單體的重複單元。共聚物及塗層組合物可用於賦予防霧及/或耐刮擦性質。本發明亦關於包含由塗層組合物形成之塗膜的製品及賦予基材或製品防霧及/或耐刮擦性質的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1352" publication-number="202611299"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611299.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611299</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125068</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於冶金爐的雙噴槍和探針接入裝置</chinese-title>  
        <english-title>DUAL LANCE AND PROBE ACCESS DEVICE FOR METALLURGIC FURNACES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C21C5/52</main-classification>  
        <further-classification edition="200601120251210B">G01K13/12</further-classification>  
        <further-classification edition="201901120251210B">G01N33/205</further-classification>  
        <further-classification edition="200601120251210B">F27D19/00</further-classification>  
        <further-classification edition="200601120251210B">F27D3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴西商維蘇威耐火材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VESUVIUS REFRATARIOS LTDA.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西普里亞尼　費爾南多多納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CIPRIANI, FERNANDO DORNAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>密佐特　羅傑坎迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZOTE, ROGER KENDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬德科肯　蒂亞戈平托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANDEKOKEN, THIAGO PINTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍珀迪澤爾　保羅羅伯托奧利亞里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOPPERDIZEL, PAULO ROBERTO OGLIARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一固定至冶金爐(10)之壁(10w)的噴槍系統，用於將組件注射進入其中所含之金屬熔體，亦適於允許將探針元件(1)插入冶金爐(10)內部所含的金屬熔體(11)。此裝置包含一條帶有通道之細長管，及一將通道帶入與組件的來源流體連通之耦接元件(2t)。提供一裝置開關(2v)及一流量控制單元(9p、9v)，以確保：&lt;br/&gt; 在組件流動位置中，裝置開關(2v)係於關閉位置中，而流量控制單元(9p、9v)係在開啟位置中，允許此組件經過通道由此來源流入冶金爐(10)的內部；及&lt;br/&gt; 於探測位置中，流量控制單元(9p、9v)係在關閉位置中，防止組件流入冶金爐(10)之內部，且裝置閥門(2v)係於開啟位置中，允許探針元件(1)經過細長通道插入冶金爐的內部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a lance system fixed to a wall (10w) of a metallurgic furnace (10) for injecting a component into a metal melt contained therein, adapted to also allow insertion of a probe element (1) into the metal melt (11) contained in the interior of the metallurgic furnace (10). The device comprises an elongated tube with a channel and a coupling element (2t) bringing in fluid communication the channel with a source of the component. A device switch (2v) and a flow control unit (9p, 9v) are provided to ensure that, &lt;br/&gt; In a component flow position, the device valve (2v) is in a closed position, and the flow control unit (9p, 9v) is in an open position allowing the component to flow from the source into the interior of the metallurgic furnace (10) through the channel, and&lt;br/&gt; In a probing position, the flow control unit (9p, 9v) is in a closed position preventing the component from flowing into the interior of the metallurgic furnace (10) and the device valve (2v) is in an open position allowing the probe element (1) to be inserted into the interior of the metallurgic furnace through the elongated channel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:探針元件</p>  
        <p type="p">1p:探針</p>  
        <p type="p">2:裝置</p>  
        <p type="p">2d:下游通道部分</p>  
        <p type="p">2i:上游通道部分的入口</p>  
        <p type="p">2o:下游通道部分的出口</p>  
        <p type="p">2t:至組件的耦接元件(=供氣或供碳)</p>  
        <p type="p">2u:上游通道部分</p>  
        <p type="p">2v:裝置閥門</p>  
        <p type="p">2vn:裝置閥門控制耦接件</p>  
        <p type="p">3:用於收納裝置的壁插件</p>  
        <p type="p">5:用於氣體注射器的固持管</p>  
        <p type="p">7:氣體注射噴槍</p>  
        <p type="p">9C:顆粒材料組件(例如碳)</p>  
        <p type="p">9p:流量控制單元的泵浦</p>  
        <p type="p">9pn:泵浦控制耦接件</p>  
        <p type="p">9t:組件管</p>  
        <p type="p">10:冶金爐</p>  
        <p type="p">10d:出渣門</p>  
        <p type="p">10w:冶金爐壁</p>  
        <p type="p">11:熔融金屬</p>  
        <p type="p">11s:熔渣</p>  
        <p type="p">20:控制器</p>  
        <p type="p">30:機器人</p>  
        <p type="p">30n:機器人控制耦接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1353" publication-number="202611880"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611880.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611880</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125070</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遊戲卡激活方法、裝置及存儲介質</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250724B">G07F17/32</main-classification>  
        <further-classification edition="201401120250724B">A63F13/35</further-classification>  
        <further-classification edition="201401120250724B">A63F13/77</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商廣州華立科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇本立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種遊戲卡激活方法、裝置及存儲介質，該方法包括：在出遊戲卡前，進行遊戲裝置與伺服器之間的網路環境檢測；若網路正常，則檢測當前是否滿足遊戲卡激活條件，所述遊戲卡激活條件包括觸發出卡對應的第一條件、遊戲卡狀況對應的第二條件；其中，滿足所述第一條件包括遊戲進度達到遊戲中的出卡環節、用戶通過所述遊戲裝置正常投遊戲幣出卡中的至少一種；滿足所述第二條件包括所述遊戲卡為未激活狀態；若滿足所述遊戲卡激活條件，則出遊戲卡，並通知所述伺服器對所述遊戲卡進行激活。本揭露實現了提升遊戲卡激活的成功率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101:步驟</p>  
        <p type="p">S102:步驟</p>  
        <p type="p">S103:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1354" publication-number="202611566"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611566.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611566</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及圖像顯示裝置</chinese-title>  
        <english-title>OPTICAL LAMINATE AND IMAGE DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">G02B5/30</main-classification>  
        <further-classification edition="200601120251210B">G02B1/04</further-classification>  
        <further-classification edition="200601120251210B">G02F1/13363</further-classification>  
        <further-classification edition="201501120251210B">G02B1/11</further-classification>  
        <further-classification edition="201901120251210B">B32B7/023</further-classification>  
        <further-classification edition="200601120251210B">B32B7/12</further-classification>  
        <further-classification edition="200601120251210B">G02F1/01</further-classification>  
        <further-classification edition="201801120251210B">C09J7/30</further-classification>  
        <further-classification edition="202301120251210B">H10K59/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬杉直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMASUGI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本知典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高松睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMATSU, MUTSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祖父江彰二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOBUE, SHOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供可兼具抗反射性能及抑制彎折後之皺褶之性能的光學積層體。 &lt;br/&gt;本發明之光學積層體具備直線偏光件及相位差層積層體。相位差層積層體具有λ/2部與λ/4部。λ/2部包含兩層以上的面內相位差層，λ/2部的厚度為4至80μm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide an optical laminate which is capable of achieving both antireflection performance and suppression of wrinkles after bending. &lt;br/&gt;The optical laminate includes a linear polarizer and a retardation layer laminate. The retardation layer laminate has a λ/2 portion and a λ/4 portion. The λ/2 portion contains two or more in-plane retardation layers, and the thickness of the λ/2 portion is 4 to 80 μm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:圖像顯示裝置</p>  
        <p type="p">10:光學積層體(橢圓偏光板)</p>  
        <p type="p">100:偏光板</p>  
        <p type="p">110:第一保護層</p>  
        <p type="p">120:直線偏光件</p>  
        <p type="p">130:第二保護層</p>  
        <p type="p">200:貼合層D</p>  
        <p type="p">300:λ/2部</p>  
        <p type="p">310:面內相位差層</p>  
        <p type="p">320:厚度方向相位差層</p>  
        <p type="p">330:貼合層A</p>  
        <p type="p">400:λ/4部</p>  
        <p type="p">410:面內相位差層</p>  
        <p type="p">420:厚度方向相位差層</p>  
        <p type="p">430:貼合層C</p>  
        <p type="p">500:貼合層B</p>  
        <p type="p">700:黏著劑層Z</p>  
        <p type="p">600:相位差層積層體</p>  
        <p type="p">900:圖像顯示元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1355" publication-number="202610816"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610816.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610816</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125091</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體、偏光積層體及圓偏光板的製造方法</chinese-title>  
        <english-title>OPTICAL LAMINATE, POLARIZED LAMINATE, AND MANUFACTURING METHOD OF CIRCULARLY POLARIZING PLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251201B">B32B7/023</main-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification>  
        <further-classification edition="200601120251201B">G09F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬杉直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMASUGI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本知典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高松睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMATSU, MUTSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祖父江彰二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOBUE, SHOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種可降低反射率之光學積層體。 &lt;br/&gt;本發明之光學積層體依序具備基材層、第一液晶硬化物層、第二液晶硬化物層。基材層及前述第一液晶硬化物層之間的剝離力為0.025至0.150N／25mm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The objective of the present invention is to provide an optical laminate that can reduce reflectance. &lt;br/&gt;The optical laminate of the present invention is sequentially provided with a substrate layer, a first liquid crystal cured layer, and a second liquid crystal cured layer. The peeling force between the substrate layer and the aforementioned first liquid crystal cured layer is 0.025 to 0.150 N/25mm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:光學積層體</p>  
        <p type="p">810:基材層</p>  
        <p type="p">820:第一定向膜</p>  
        <p type="p">830:第一液晶硬化物層</p>  
        <p type="p">840:第二定向膜</p>  
        <p type="p">850:第二液晶硬化物層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1356" publication-number="202611002"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611002.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611002</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125117</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎的磺酸鹽、阻燃劑、添加劑組成物、樹脂組成物及成形體</chinese-title>  
        <english-title>NOVEL SULFONATE, FLAME RETARDANT, ADDITIVE COMPOSITION, RESIN COMPOSITION, AND MOLDED ARTICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C309/06</main-classification>  
        <further-classification edition="200601120251201B">C08K5/42</further-classification>  
        <further-classification edition="200601120251201B">C08L69/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中央硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦雅大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嘉村弘基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMURA, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本純基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, JUNKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松崎寬樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUZAKI, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>增田隆司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">透過第1發明，提供新穎的磺酸鹽。透過第2發明，提供可獲得阻燃性及外觀優異之成形體的阻燃劑、包含該阻燃劑的添加劑組成物、樹脂組成物及成形體。&lt;br/&gt; 第1發明之新穎的磺酸鹽由下述通式（1）表示。&lt;br/&gt;&lt;img align="absmiddle" height="122px" width="251px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; （通式（1）中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;分別獨立表示氫原子、氟原子或氯原子，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;之至少2者分別獨立表示氟原子或氯原子。&lt;br/&gt; M表示鈉原子、鉀原子或銫原子。&lt;br/&gt; 其中，排除「R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;全部做成氟原子」的情形、「R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;全部做成氯原子」的情形、「選自R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;之2者係氟原子，其餘係氫原子，M做成鉀原子」的情形，以及「選自R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;之2者係氟原子，其餘係氯原子，M做成鈉原子」的情形。）&lt;br/&gt; 第2發明之阻燃劑包含由下述通式（2）所示之磺酸鹽。&lt;br/&gt;&lt;img align="absmiddle" height="129px" width="290px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; （通式（2）中，Q&lt;sup&gt;1&lt;/sup&gt;、Q&lt;sup&gt;2&lt;/sup&gt;及Q&lt;sup&gt;3&lt;/sup&gt;分別獨立表示氫原子、鹵原子，Q&lt;sup&gt;1&lt;/sup&gt;、Q&lt;sup&gt;2&lt;/sup&gt;及Q&lt;sup&gt;3&lt;/sup&gt;之至少1者表示鹵原子。&lt;br/&gt; X表示鹼金屬或鹼土金屬。&lt;br/&gt; 其中，排除Q&lt;sup&gt;1&lt;/sup&gt;、Q&lt;sup&gt;2&lt;/sup&gt;及Q&lt;sup&gt;3&lt;/sup&gt;全部做成氟原子的情形。）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A novel sulfonate is provided by the first invention. A flame retardant that can produce molded articles with excellent flame retardance and appearance, as well as an additive composition, resin composition, and molded article that contain the flame retardant are provided by the second invention.&lt;br/&gt; The novel sulfonate of the first invention is represented by the following general formula (1).&lt;br/&gt;&lt;img align="absmiddle" height="117px" width="256px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; (In general formula (1), R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, and R&lt;sup&gt;3&lt;/sup&gt; each independently represent a hydrogen atom, a fluorine atom, or a chlorine atom, and at least two of R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, and R&lt;sup&gt;3&lt;/sup&gt; each independently represent a fluorine atom or a chlorine atom.&lt;br/&gt; M represents a sodium atom, a potassium atom, or a cesium atom.&lt;br/&gt; However, the cases where “all of R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, and R&lt;sup&gt;3&lt;/sup&gt; are fluorine atoms”, “all of R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, and R&lt;sup&gt;3&lt;/sup&gt; are chlorine atoms”, “two selected from R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, and R&lt;sup&gt;3&lt;/sup&gt; are fluorine atoms and the rest is hydrogen atom and M is a potassium atom”, and “two selected from R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, and R&lt;sup&gt;3&lt;/sup&gt; are fluorine atoms and the rest is chlorine atom and M is a sodium atom” are excluded.)&lt;br/&gt; The flame retardant of the second invention comprises a sulfonate represented by the following general formula (2).&lt;br/&gt;&lt;img align="absmiddle" height="118px" width="280px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; (In general formula (2), Q&lt;sup&gt;1&lt;/sup&gt;, Q&lt;sup&gt;2&lt;/sup&gt;, and Q&lt;sup&gt;3&lt;/sup&gt; each independently represent a hydrogen atom, or a halogen atom, and at least one of Q&lt;sup&gt;1&lt;/sup&gt;, Q&lt;sup&gt;2&lt;/sup&gt;, and Q&lt;sup&gt;3&lt;/sup&gt; represents a halogen atom.&lt;br/&gt; X represents an alkali metal or an alkaline earth metal.&lt;br/&gt; However, the case where all of Q&lt;sup&gt;1&lt;/sup&gt;, Q&lt;sup&gt;2&lt;/sup&gt;, and Q&lt;sup&gt;3&lt;/sup&gt; are fluorine atoms is excluded.)</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1357" publication-number="202611287"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611287.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611287</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125120</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種細胞操作裝置用於細胞球體培養與分析</chinese-title>  
        <english-title>A CELL OPERATION DEVICE FOR CELL SPHEROIDS CULTURE AND ANALYSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C12M1/18</main-classification>  
        <further-classification edition="200601120251201B">C12M3/00</further-classification>  
        <further-classification edition="200601120251201B">C12M1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人國家衛生研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL HEALTH RESEARCH INSTITUTES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許佳賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉鵑鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHUAN-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李奇翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊景奕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡坤旺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於製備、培養與收集細胞球體的操作裝置。本發明裝置包含多個可獨立操作的元件，其包括垂直排列的第一腔室與第二腔室。第一腔室設有微流道與複數通孔，可形成均一的懸吊滴珠，促進細胞球體的形成。第二腔室位於第一腔室下方，用於接收細胞球體，進行影像拍攝或後續分析。本發明可實現具擴展性與可重複性的三維細胞培養與收集，適用於生醫研究與藥物篩選等應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to a cell operation device for the generation, culture, and collection of cellular spheroids. The device comprises a plurality of independently operable units, each including a vertically aligned first chamber and second chamber. The first chamber is configured with a microchannel and an array of through holes that enable the formation of uniform hanging drops, facilitating spheroid formation under controlled conditions. The second chamber is positioned below to receive and immobilize the spheroids for imaging or downstream processing. This modular design enables scalable and reproducible 3D cell culture suitable for biomedical research and drug screening applications.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一腔室</p>  
        <p type="p">20:第二腔室</p>  
        <p type="p">11:第一注入口</p>  
        <p type="p">12:儲液槽</p>  
        <p type="p">13:複數通孔</p>  
        <p type="p">14:第二注入口</p>  
        <p type="p">21:收集孔</p>  
        <p type="p">300:銅柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1358" publication-number="202611567"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611567.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611567</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125121</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及圖像顯示裝置</chinese-title>  
        <english-title>OPTICAL LAMINATE AND IMAGE DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">G02B5/30</main-classification>  
        <further-classification edition="201901120251210B">B32B7/023</further-classification>  
        <further-classification edition="200601120251210B">B32B7/10</further-classification>  
        <further-classification edition="200601120251210B">B32B7/12</further-classification>  
        <further-classification edition="202001120251210B">C08J7/044</further-classification>  
        <further-classification edition="200601120251210B">G09F9/30</further-classification>  
        <further-classification edition="200601120251210B">C09J133/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬杉直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMASUGI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本知典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高松睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMATSU, MUTSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祖父江彰二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOBUE, SHOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種即使於直線偏光片的配向為不均一時，反射精度，亦即面內之反射率的均一性亦優異之光學積層體。 &lt;br/&gt;本發明之解決手段為一種光學積層體，係具備第一直線偏光片及相位差層積層體。相位差層積層體具有3層以上的相位差層，3層以上之相位差層中的至少3層為面內相位差層。第一直線偏光片為吸收型偏光片及反射型偏光片之任一方，第一直線偏光片的視感度修正偏光度Py的面內之標準差σ為0.001%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The purpose of the present invention is to provide is an optical laminate that is excellent in reflection accuracy, that is, in uniformity of in-plane reflectance, even when the orientation of a linear polarizer is non-uniform. &lt;br/&gt; The solution of the present invention is an optical laminmate that includes a first linear polarizer and a phase difference layer laminate. The phase difference layer laminate has three or more phase difference layers, at least three of the three or more phase difference layers are in-plane phase difference layers. The first linear polarizer is either an absorptive polarizer or a reflective polarizer, and the in-plane standard deviation σ of the luminous efficiency-corrected polarization degree Py of the first linear polarizer is 0.001% or more.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:圖像顯示裝置</p>  
        <p type="p">10:光學積層體(圓偏光板)</p>  
        <p type="p">100A:第一偏光板</p>  
        <p type="p">110:第一保護層</p>  
        <p type="p">120A:第一直線偏光片</p>  
        <p type="p">130:第二保護層</p>  
        <p type="p">200:貼合層D</p>  
        <p type="p">300:λ/2部</p>  
        <p type="p">310:面內相位差層(第一面內相位差層、第二面內相位差層)</p>  
        <p type="p">320:厚度方向相位差層</p>  
        <p type="p">330:貼合層A1、貼合層A2、貼合層A3</p>  
        <p type="p">400:λ/4部</p>  
        <p type="p">410:面內相位差層(第三面內相位差層)</p>  
        <p type="p">420:厚度方向相位差層</p>  
        <p type="p">430:貼合層C</p>  
        <p type="p">500:貼合層B</p>  
        <p type="p">600:相位差層積層體</p>  
        <p type="p">700:黏著劑層Z</p>  
        <p type="p">900:圖像顯示元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1359" publication-number="202611550"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611550.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611550</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及圖像顯示裝置</chinese-title>  
        <english-title>OPTICAL LAMINATE AND IMAGE DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251201B">G02B1/11</main-classification>  
        <further-classification edition="201901120251201B">B32B7/023</further-classification>  
        <further-classification edition="200601120251201B">B32B7/12</further-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬杉直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMASUGI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本知典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高松睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMATSU, MUTSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祖父江彰二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOBUE, SHOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種抗反射性能優異之光學積層體。 &lt;br/&gt;本發明之解決手段為一種光學積層體，係具備直線偏光片及相位差層積層體之光學積層體，相位差層積層體具有：3層以上的相位差層，及配置在前述相位差層之間之2層以上的貼合層。前述3層以上之相位差層中的至少3層為面內相位差層，至少一層前述貼合層的面內平均折射率高於其他貼合層的面內平均折射率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The object is to provide an optical laminate with excellent anti-reflection performance. The solution means is an optical laminate includes a linear polarizer and a retardation layer laminate, and the retardation layer laminate has three or more retardation layers and two or more bonding layers disposed between the above retardation layers. At least three of the three or more retardation layers are in-plane retardation layers, and the in-plane average refractive index of at least one of the bonding layer is higher than that of the other bonding layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:圖像顯示裝置</p>  
        <p type="p">10:光學積層體(橢圓偏光板)</p>  
        <p type="p">100:偏光板</p>  
        <p type="p">110:第一保護層</p>  
        <p type="p">120:直線偏光片</p>  
        <p type="p">130:第二保護層</p>  
        <p type="p">200:貼合層D(第一貼合層)</p>  
        <p type="p">300:λ/2部</p>  
        <p type="p">310:面內相位差層(相位差層)</p>  
        <p type="p">320:厚度方向相位差層(相位差層)</p>  
        <p type="p">330:貼合層A1,A2,A3(第二貼合層)</p>  
        <p type="p">400:λ/4部</p>  
        <p type="p">410:面內相位差層</p>  
        <p type="p">420:厚度方向相位差層</p>  
        <p type="p">430:貼合層C</p>  
        <p type="p">500:貼合層B(第三貼合層)</p>  
        <p type="p">600:相位差層積層體</p>  
        <p type="p">700:貼合層Z(第四貼合層)</p>  
        <p type="p">900:圖像顯示元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1360" publication-number="202611551"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611551.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611551</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及圖像顯示裝置</chinese-title>  
        <english-title>OPTICAL LAMINATE AND IMAGE DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251201B">G02B1/11</main-classification>  
        <further-classification edition="201901120251201B">B32B7/023</further-classification>  
        <further-classification edition="201901120251201B">B32B7/02</further-classification>  
        <further-classification edition="200601120251201B">B32B7/12</further-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬杉直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMASUGI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本知典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高松睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMATSU, MUTSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祖父江彰二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOBUE, SHOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種即使在高溫環境下使用時色相亦不易變化的光學積層體。 &lt;br/&gt;本發明之光學積層體具有直線偏光件與相位差層積層體。相位差層積層體具有三層以上之相位差層，三層以上之相位差層中的至少三層為面內相位差層。在105℃、1小時的在高溫耐久試驗後，在面內之中互相不同的五處測得的下式所示之面內相位差的波長分散參數α的標準偏差αSD為0.0020以下。 &lt;br/&gt;α=Re(450)/Re(550)，Re(X)表示在波長Xnm的面內相位差(nm)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide an optical laminate in which a hue change hardly changes even when the optical laminate is used in a high temperature environment. &lt;br/&gt;The optical laminate includes a linear polarizer and a retardation layer laminate. The retardation layer laminate has three or more retardation layers and at least three of the three or more retardation layers are in-plane retardation layers. The standard deviation αSD of the wavelength dispersion parameter α of the in-plane phase difference represented by the following formula, measured at five different points in the plane after the high temperature durability test at 105℃ for 1 hour, is 0.0020 or less. &lt;br/&gt;α = Re(450)/Re(550), wherein Re(X) represents an in-plane retardation (nm) at a wavelength of Xnm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:圖像顯示裝置</p>  
        <p type="p">10:光學積層體</p>  
        <p type="p">100:偏光板</p>  
        <p type="p">110:第一保護層</p>  
        <p type="p">120:直線偏光件</p>  
        <p type="p">130:第二保護層</p>  
        <p type="p">200:貼合層D</p>  
        <p type="p">300:λ/2部</p>  
        <p type="p">310:面內相位差層</p>  
        <p type="p">320:厚度方向相位差層</p>  
        <p type="p">400:λ/4部</p>  
        <p type="p">410:面內相位差層</p>  
        <p type="p">420:厚度方向相位差層</p>  
        <p type="p">330:貼合層A</p>  
        <p type="p">430:貼合層C</p>  
        <p type="p">500:貼合層B</p>  
        <p type="p">600:相位差層積層體</p>  
        <p type="p">900:圖像顯示元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1361" publication-number="202612568"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612568.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612568</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125128</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板以及電子裝置</chinese-title>  
        <english-title>DISPLAY PANEL AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251204B">H10K59/12</main-classification>  
        <further-classification edition="202301120251204B">H10K59/122</further-classification>  
        <further-classification edition="202301120251204B">H10K59/131</further-classification>  
        <further-classification edition="202301120251204B">H10K59/82</further-classification>  
        <further-classification edition="202301120251204B">H10K71/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星顯示器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金慶昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高裕敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, YOOMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴注燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUCHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔忠碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, CHUNG SOCK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露為顯示面板，包含：驅動元件層，其包含像素驅動部分；第一電極，其設置在驅動元件層上；像素定義層，其設置在驅動元件層上，並且其中定義有暴露出第一電極的至少一部分的開口；中間層，其設置在第一電極上，並且包含至少一個發光層；第二電極，其設置在中間層上；下部黏合層，其設置在第二電極上；封蓋電極，其設置在第二電極上；以及分隔件，其設置在像素定義層上。下部黏合層的至少一部分與像素定義層的開口重疊。封蓋電極在與像素定義層的開口分隔開的區域中與第二電極的一部分接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a display panel including a driving element layer including a pixel driving portion, a first electrode disposed on the driving element layer, a pixel definition layer disposed on the driving element layer, and in which an opening exposing at least a portion of the first electrode is defined, an intermediate layer disposed on the first electrode, and including at least one light emission layer, a second electrode disposed on the intermediate layer, a lower adhesive layer disposed on the second electrode, a capping electrode disposed on the second electrode, and a separator disposed on the pixel definition layer. At least a portion of the lower adhesive layer overlaps the opening of the pixel definition layer. The capping electrode contacts a portion of the second electrode in an area spaced apart from the opening of the pixel definition layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10,20,30,40,50,60:絕緣層</p>  
        <p type="p">71:第一感測絕緣層</p>  
        <p type="p">72:第二感測絕緣層</p>  
        <p type="p">73:第三感測絕緣層</p>  
        <p type="p">BCL:下部導電層</p>  
        <p type="p">BS:基底層</p>  
        <p type="p">C1:第一電容器</p>  
        <p type="p">C2:第二電容器</p>  
        <p type="p">CA:接觸區域</p>  
        <p type="p">CCE1:第一電容器電極</p>  
        <p type="p">CCE2:第二電容器電極</p>  
        <p type="p">CCE3:第三電容器電極</p>  
        <p type="p">CN:中間連接電極</p>  
        <p type="p">CNA:連接區域</p>  
        <p type="p">CNE:連接電極</p>  
        <p type="p">CNT:接觸孔</p>  
        <p type="p">CNT1:第一接觸孔</p>  
        <p type="p">CNT2:第二接觸孔</p>  
        <p type="p">CNT3:第三接觸孔</p>  
        <p type="p">CPE:封蓋電極</p>  
        <p type="p">CR:通道區域</p>  
        <p type="p">DDL:驅動元件層</p>  
        <p type="p">DP:顯示面板</p>  
        <p type="p">DR:汲極區域</p>  
        <p type="p">EA:發光區域</p>  
        <p type="p">ECL:封裝層</p>  
        <p type="p">EG1c:第一邊緣</p>  
        <p type="p">EG2c:第二邊緣</p>  
        <p type="p">EL1:第一電極</p>  
        <p type="p">EL2:第二電極</p>  
        <p type="p">EML:發光層</p>  
        <p type="p">FNL:功能層</p>  
        <p type="p">GE:閘極</p>  
        <p type="p">IL1:第一無機層</p>  
        <p type="p">IL2:第二無機層</p>  
        <p type="p">IML:中間層</p>  
        <p type="p">ISL:感測層</p>  
        <p type="p">L1:第一層</p>  
        <p type="p">L2:第二層</p>  
        <p type="p">L3:第三層</p>  
        <p type="p">LD:發光元件</p>  
        <p type="p">MA:中間區域</p>  
        <p type="p">MTL1:第一感測導電層</p>  
        <p type="p">MTL2:第二感測導電層</p>  
        <p type="p">OL:有機層</p>  
        <p type="p">OP-P,OP-60:通孔</p>  
        <p type="p">OP-PDL:發光開口</p>  
        <p type="p">PDC:像素驅動部分</p>  
        <p type="p">PDL:像素定義層</p>  
        <p type="p">SP:半導體圖案</p>  
        <p type="p">SPR:分隔件</p>  
        <p type="p">SR:源極區域</p>  
        <p type="p">TR:電晶體</p>  
        <p type="p">UP:虛設層</p>  
        <p type="p">UP1:第一虛設層</p>  
        <p type="p">UP2:第二虛設層</p>  
        <p type="p">UP3:第三虛設層</p>  
        <p type="p">W1:源極圖案</p>  
        <p type="p">W2:汲極圖案</p>  
        <p type="p">WAL:下部黏合層</p>  
        <p type="p">DR3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1362" publication-number="202611043"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611043.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611043</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125150</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種MOR受體促效劑的液體組合物及其製備方法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D487/04</main-classification>  
        <further-classification edition="200601120251201B">A61K31/4439</further-classification>  
        <further-classification edition="200601120251201B">A61K9/08</further-classification>  
        <further-classification edition="200601120251201B">A61K47/02</further-classification>  
        <further-classification edition="200601120251201B">A61K47/26</further-classification>  
        <further-classification edition="200601120251201B">A61P29/00</further-classification>  
        <further-classification edition="200601120251201B">A61P37/00</further-classification>  
        <further-classification edition="200601120251201B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海海雁醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HAIYAN PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商揚子江藥業集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANGTZE RIVER PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫曉陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, XIAOYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>但招陵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAN, ZHAOLING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周錫群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, XIQUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>單文俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAN, WENJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王如偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RUWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種MOR受體促效劑的液體組合物及其製備方法和應用，所述液體組合物包含式I所示化合物或其鹽、緩衝鹽和pH調節劑，所述液體組合物pH值為6.0-7.4，所述的液體組合物穩定性好，長期、高溫或光照下總雜質含量≤3.0%，雜質風險可控，安全性得以保障，&lt;img align="absmiddle" height="152px" width="221px" file="ed10006.JPG" alt="ed10006.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1363" publication-number="202611174"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611174.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611174</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125162</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶配向劑、液晶配向膜、及液晶顯示元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G73/10</main-classification>  
        <further-classification edition="200601120251201B">G02F1/1337</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柿崎知典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAKIZAKI, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田一平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, IPPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中原翔一朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAHARA, SHOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供液晶之扭轉角的變異小且可在短時間內減少所產生之電荷的液晶配向膜。 &lt;br/&gt;本發明之液晶配向劑，其特徵為含有下述聚合物(A)及聚合物(B)。聚合物(A)：聚醯亞胺(A)，其係具有式(1Ta)所示之結構單元、源自「H-N(Z)-Ar1-L1-A-L1’-Ar1’-N(Z)-H」之結構單元以及式(1Da1)所示之結構單元的聚醯亞胺前驅物的醯亞胺化物。(各記號的定義如說明書中所記載。) &lt;br/&gt;聚合物(B)：聚醯胺酸(B)，其具有式(1Tb)所示之結構單元與式(1Db)所示之結構單元。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="250px" width="554px" file="ed10044.JPG" alt="ed10044.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(各記號的定義如說明書中所記載。) &lt;br/&gt;&lt;img align="absmiddle" height="40px" width="61px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="145px" width="119px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(各記號的定義如說明書中所記載。) &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="182px" width="647px" file="ed10047.JPG" alt="ed10047.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(各記號的定義如說明書中所記載。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:橫向電場液晶顯示元件</p>  
        <p type="p">2:梳齒電極基板</p>  
        <p type="p">2a:基材</p>  
        <p type="p">2b:線狀電極</p>  
        <p type="p">2c:液晶配向膜</p>  
        <p type="p">3:液晶</p>  
        <p type="p">4:對向基板</p>  
        <p type="p">4a:液晶配向膜</p>  
        <p type="p">4b:基材</p>  
        <p type="p">L:電力線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1364" publication-number="202611349"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611349.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611349</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚乙烯纖維、以及使用有該聚乙烯纖維之製品、以及該聚乙烯纖維之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">D01F6/04</main-classification>  
        <further-classification edition="200601120251209B">C08L23/06</further-classification>  
        <further-classification edition="200601120251209B">C08F10/02</further-classification>  
        <further-classification edition="200601120251209B">D01D5/12</further-classification>  
        <further-classification edition="200601120251209B">D02J1/00</further-classification>  
        <further-classification edition="200601120251209B">D01D10/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡ＭＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO MC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田優二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>津島広樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUSHIMA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴨崎剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMOSAKI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古田明久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUTA, AKIHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島靖憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲富伸一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INATOMI, SHINICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種抑制纖維不均及熔接且耐蠕變特性優異之聚乙烯纖維。本發明為一種聚乙烯纖維，在將單絲纖度之直徑(μm)設為橫軸、頻度(%)設為縱軸之分佈中，包含最頻值之直徑的波峰之半值寬相對於顯示分佈曲線之前述最頻值之直徑(半值寬/最頻值)為0.1至0.7；於測定溫度為20℃、測定荷重為800MPa之蠕變測定中，最小蠕變速度為1×10&lt;sup&gt;-8&lt;/sup&gt;sec&lt;sup&gt;-1&lt;/sup&gt;以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1365" publication-number="202611017"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611017.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611017</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125175</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋶鹽、酸擴散抑制劑、阻劑組成物、及圖案形成方法</chinese-title>  
        <english-title>SULFONIUM SALT, ACID DIFFUSION INHIBITOR, RESIST COMPOSITION, AND PATTERNING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C381/12</main-classification>  
        <further-classification edition="200601120251201B">C07D307/93</further-classification>  
        <further-classification edition="200601120251201B">C07D327/08</further-classification>  
        <further-classification edition="200601120251201B">C07D333/76</further-classification>  
        <further-classification edition="200601120251201B">C09K3/00</further-classification>  
        <further-classification edition="200601120251201B">C08F212/14</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原敬之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口智成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, TOMONARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村純也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, JUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大友雄太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTOMO, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供光微影中無損感度而CDU、LWR等微影性能優異之化學增幅型阻劑材料使用之酸擴散抑制劑。一種下列通式(1)表示之鋶鹽。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="413px" width="640px" file="ed10246.JPG" alt="ed10246.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、及R&lt;sup&gt;3&lt;/sup&gt;各自獨立地表示氟原子、羥基、三氟甲基、三氟甲氧基、氰基、胺甲醯基、醯胺基、或也可以含有雜原子之碳數1~15之直鏈狀、分支狀、或環狀之1價烴基。r表示0~4之整數，p表示0~5之整數，q表示0~5之整數，x表示0~4之整數，y表示0~5之整數，z表示0~5之整數，r、p、q、x、y、z為符合x＋y＋z≧1、4≧r＋x≧0、5≧p＋y≧0、及5≧q＋z≧0之整數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a sulfonium salt represented by the following general formula (1). In the formula, R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, and R&lt;sup&gt;3&lt;/sup&gt; represent a fluorine atom, a hydroxy group, a trifluoromethyl group, a trifluoromethoxy group, a cyano group, a carbamoyl group, an amide group, or a linear, branched, or cyclic monovalent hydrocarbon group having 1 to 15 carbon atoms and optionally having a heteroatom; “r” represents an integer of 0 to 4, “p” represents an integer of 0 to 5, “q” represents an integer of 0 to 5, “x” represents an integer of 0 to 4, “y” represents an integer of 0 to 5, “z” represents an integer of 0 to 5, and “r”, “p”, “q”, “x”, “y”, and “z” satisfy x+y+z≥1, 4≥r+x≥0, 5≥p+y≥0, and 5≥q+z≥0. This can provide an acid diffusion inhibitor used for a chemically-amplified resist material that does not cause impairing sensitivity in photolithography and is excellent in lithography performances such as CDU and LWR. &lt;br/&gt;&lt;img align="absmiddle" height="184px" width="288px" file="ed10247.JPG" alt="ed10247.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1366" publication-number="202611300"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611300.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611300</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125176</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熔鐵之製造裝置及熔鐵之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">C21C5/52</main-classification>  
        <further-classification edition="200601120251209B">F27D13/00</further-classification>  
        <further-classification edition="200601120251209B">H05B6/02</further-classification>  
        <further-classification edition="200601120251209B">F27B3/08</further-classification>  
        <further-classification edition="200601120251209B">F27D19/00</further-classification>  
        <further-classification edition="200601120251209B">F27D11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三輪善廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIWA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小田信彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODA, NOBUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堤康一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUTSUMI, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川畑涼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABATA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根岸秀光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEGISHI, HIDEMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供可高效率地使用能量而預熱冷鐵源以製造熔鐵的熔鐵之製造裝置及熔鐵之製造方法。 &lt;br/&gt;本發明的熔鐵之製造裝置1，係具備有：預熱室7，其內部被裝入冷鐵源；閘門11，被設於預熱室；電弧式電爐8，其藉由開放閘門11而朝預熱室7內裝入冷鐵源2，再將裝入的冷鐵源2利用電弧熱而熔解並製造熔鐵；如此之製造裝置，其具備有：捲繞於預熱室7外周面的線圈9、以及對線圈9供應被預先設定頻率之電流的電源10。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:熔鐵製造裝置</p>  
        <p type="p">2:冷鐵源</p>  
        <p type="p">3:廢鐵</p>  
        <p type="p">4:還原鐵</p>  
        <p type="p">5:底開式料桶</p>  
        <p type="p">6:游走台車</p>  
        <p type="p">7:預熱室</p>  
        <p type="p">8:電弧式電爐</p>  
        <p type="p">9:線圈</p>  
        <p type="p">10:電源單元</p>  
        <p type="p">10A:交流電源</p>  
        <p type="p">10B:頻率轉換器</p>  
        <p type="p">11:預熱室閘門/閘門</p>  
        <p type="p">12:滑槽</p>  
        <p type="p">13:爐蓋</p>  
        <p type="p">14:熔解爐</p>  
        <p type="p">15:貫通孔</p>  
        <p type="p">16:上部電極</p>  
        <p type="p">17:氧吹入噴槍</p>  
        <p type="p">18:炭材吹入噴槍</p>  
        <p type="p">19:助燃燃燒器</p>  
        <p type="p">20:爐底電極</p>  
        <p type="p">21:出鐵口</p>  
        <p type="p">22:出鐵用門</p>  
        <p type="p">30:致動器</p>  
        <p type="p">40:控制裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1367" publication-number="202611901"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611901.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611901</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125182</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其顯示面板的驅動方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND METHOD FOR DRIVING DISPLAY PANEL THEREIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250714B">G09G3/36</main-classification>  
        <further-classification edition="200601120250714B">G02F1/137</further-classification>  
        <further-classification edition="200601120250714B">G02F1/133</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虹彩光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富田順二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMITA, JUNJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖奇璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHI CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，其包括一處理器及一顯示面板。處理器經配置以採用多列為基礎以排列一顯示影像中的多個像素以產生一第一影像。顯示面板包括：複數個掃描電極，沿著一第一方向延伸；複數個資料電極，沿著一第二方向延伸；複數個膽固醇液晶像素電路，設置在該等掃描電極與該等資料電極的多個交叉處；及一驅動電路部，經配置以在一掃描程序的期間依序每次啟動該等掃描電極中的兩個或更多個相鄰的掃描電極以將該第一影像的像素資料寫入至該等膽固醇液晶像素電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided, which includes a processor and a display panel. The processor is configured to arrange pixels in a display image on a multiple-line basis to generate a first image. The display panel includes a plurality of scanning electrodes, a plurality of data electrodes, a plurality of cholesteric liquid crystal pixel circuits, and a driving circuit section. The plurality of scanning electrodes extend in a first direction. The plurality of data electrodes extend in a second direction. The plurality of cholesteric liquid crystal pixel circuits are disposed at intersections between the plurality of scanning electrodes and the plurality of data electrodes. The driving circuit section is configured to simultaneously activate two or more adjacent scanning electrodes among the plurality of scanning electrodes in sequence during a scanning procedure for writing pixel data of the first image to the plurality of cholesteric liquid crystal pixel circuits.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:方法</p>  
        <p type="p">1110:步驟</p>  
        <p type="p">1120:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1368" publication-number="202611114"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611114.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611114</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>RESIST COMPOSITION AND PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/08</main-classification>  
        <further-classification edition="200601120251201B">C08F212/14</further-classification>  
        <further-classification edition="200601120251201B">C08F220/22</further-classification>  
        <further-classification edition="200601120251201B">C08F8/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊地駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草間理志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAMA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大山皓介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHYAMA, KOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，感度及極限解析度優良的非化學增幅阻劑組成物，以及提供使用該阻劑組成物之圖案形成方法。 &lt;br/&gt;該課題之解決手段為一種阻劑組成物，含有： &lt;br/&gt;含有具有下式(1)表示之超原子價碘結構之重複單元的聚合物， &lt;br/&gt;含羧基之化合物，及 &lt;br/&gt;溶劑。 &lt;br/&gt;&lt;img align="absmiddle" height="195px" width="301px" file="ed10067.JPG" alt="ed10067.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resist composition containing a polymer containing a repeat unit having a hypervalent iodine structure having the formula (1), a carboxy group-containing compound, and a solvent. &lt;br/&gt;&lt;img align="absmiddle" height="180px" width="282px" file="ed10068.JPG" alt="ed10068.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1369" publication-number="202611430"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611430.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611430</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125206</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於隔熱真空幫浦系統之一或多個組件之複合材料</chinese-title>  
        <english-title>COMPOSITE MATERIAL FOR INSULATING ONE OR MORE COMPONENTS OF A VACUUM PUMP SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">F16L59/02</main-classification>  
        <further-classification edition="200601120251209B">B32B15/04</further-classification>  
        <further-classification edition="200601120251209B">B32B5/18</further-classification>  
        <further-classification edition="200601120251209B">F16L59/08</further-classification>  
        <further-classification edition="200601120251209B">B32B37/04</further-classification>  
        <further-classification edition="200601120251209B">F04B37/14</further-classification>  
        <further-classification edition="200601120251209B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德華真空有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS VACUUM LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗克納　巴德　艾德華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAULKNER, BUDD EDWARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種製造用於隔熱一真空幫浦系統之一或多個組件之一複合材料之方法 (400)，其包括：提供(410)具有一外表面之一第一材料，其中該第一材料包括一氣凝膠；及將一第二材料配置(420)於該第一材料之該外表面上以圍封該第一材料，其中該第二材料包括一金屬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a method (400) of manufacturing a composite material for insulating one or more components of a vacuum pump system, comprising: providing (410) a first material having an exterior surface, wherein the first material comprises an aerogel; and arranging (420) a second material on the exterior surface of the first material to enclose the first material, wherein the second material comprises a metal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">410:提供步驟</p>  
        <p type="p">420:配置步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1370" publication-number="202612081"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612081.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612081</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125209</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板容器之轉接器</chinese-title>  
        <english-title>SUBSTRATE CONTAINER ADAPTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/673</main-classification>  
        <further-classification edition="200601120251201B">B65D85/86</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>當洛普　傑克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNLOPE, JACK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富勒　馬修　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FULLER, MATTHEW A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史崔克豪斯　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRICKHOUSER, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慕麗克　柯特　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MULICK, CURT A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供包含基板容器附接介面及基板容器轉接器之設備。該等基板容器附接介面及基板容器轉接器包含經構形以與設置於一基板容器中之一突出部或凹槽接合之至少一個接合特徵。轉接器可包含經構形以附接至或一體形成為包含該等基板容器附接介面之一匣。該等基板容器附接介面可附接至設置於基板容器中之側柱。該等基板容器附接介面可包含或連結至環境調節包及/或感測器。該等轉接器可經構形為處於預定高度，且該等預定高度可基於與自動化處置之相互作用來選擇。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatuses including substrate container attachment interfaces and substrate container adapters are provided. The substrate container attachment interfaces and substrate container adapters include at least one engagement feature configured to engage with a projection or recess provided in a substrate container. Adapters can include a cassette configured to be attached to, or integrally formed including the substrate container attachment interfaces. The substrate container attachment interfaces can attach to side columns provided in substrate containers. The substrate container attachment interfaces can include or be joined to environmental adjustment packs and/or sensors. The adapters can be configured to be at predetermined heights, and the predetermined heights can be selected based on interactions with automated handling.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板容器</p>  
        <p type="p">102:基板容器本體</p>  
        <p type="p">104:側柱</p>  
        <p type="p">106:支撐擱架</p>  
        <p type="p">108:轉接器</p>  
        <p type="p">110:第一基板容器介面</p>  
        <p type="p">112:匣</p>  
        <p type="p">114:第二基板容器介面</p>  
        <p type="p">116:第二支撐擱架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1371" publication-number="202611698"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611698.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611698</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125211</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>統一乘法累加單元</chinese-title>  
        <english-title>UNIFIED MULTIPLY-ACCUMULATE UNITS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F7/544</main-classification>  
        <further-classification edition="200601120251201B">G06F7/485</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商谷歌有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOGLE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米尼雅　奧姆卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINIYAR, OMKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>優佩斯　莫漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UPASE, MOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏杜帕　普拉莫德　帕拉梅什瓦拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UDUPA, PRAMOD PARAMESHWARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本說明書係關於用於乘法累加(MAC)單元之方法、系統及設備，該等MAC單元具有用於執行浮點MAC運算及整數MAC運算兩者之統一架構。一種用於利用具有一第一統一加法器及一第二統一加法器之一MAC胞元執行一MAC運算的實例方法包括接收浮點輸入運算元，該等浮點輸入運算元包括一第一運算元、一第二運算元、一第三運算元及一第四運算元。該方法進一步包括執行一前乘法對齊程序，該前乘法對齊程序基於對以下兩項進行比較來使該等浮點輸入運算元中之一或多者之一尾數對齊：1)該第一運算元及該第二運算元之指數的一第一和；及2)該第三運算元及該第四運算元之指數的一第二和。該方法進一步包括執行該第一運算元與該第二運算元之經對齊尾數之間的一第一乘法以產生一第一尾數乘積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This specification relates to methods, systems, and apparatus for multiply-accumulate (MAC) units having a unified architecture for performing both floating point MAC operations and integer MAC operations. An example method for performing a MAC operation with a MAC cell having a first unified adder and a second unified adder includes receiving floating point input operands including a first operand, a second operand, a third operand, and a fourth operand. The method further includes performing a pre-multiplication alignment process that aligns a mantissa of one or more of the floating point input operands based on comparing 1) a first sum of exponents of the first operand and the second operand, and 2) a second sum of exponents of the third operand and the fourth operand. The method further includes performing a first multiplication between aligned mantissas of the first operand and the second operand to generate a first mantissa product.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:計算系統/系統</p>  
        <p type="p">102:系統單晶片/SoC</p>  
        <p type="p">104:中央處理單元/CPU</p>  
        <p type="p">106:共用記憶體/記憶體</p>  
        <p type="p">110:IP區塊/電路區塊</p>  
        <p type="p">112:影像信號處理器/ISP</p>  
        <p type="p">114:ML加速器</p>  
        <p type="p">116:數位信號處理器/DSP</p>  
        <p type="p">118:圖形處理單元/GPU</p>  
        <p type="p">120:MAC單元</p>  
        <p type="p">122:匯流排</p>  
        <p type="p">130:使用者/用戶端裝置</p>  
        <p type="p">130a:網路伺服器</p>  
        <p type="p">130b:智慧型電話</p>  
        <p type="p">130c:平板電腦</p>  
        <p type="p">130d:膝上型電腦</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1372" publication-number="202610995"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610995.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610995</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125267</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電解液</chinese-title>  
        <english-title>ELECTROLYTE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C211/63</main-classification>  
        <further-classification edition="200601120251201B">C07D207/06</further-classification>  
        <further-classification edition="201301120251201B">H01G11/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大塚化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川泰治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, TAIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍋島亮浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NABESHIMA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濵口典久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAGUCHI, NORIHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的係提供一種新穎的電解液。 &lt;br/&gt;該電解液係含有異丙基三C1至2烷基銨鹽者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The purpose of the present invention is to provide a novel electrolyte. &lt;br/&gt;The electrolyte contains isopropyl triC1-C2alkyl ammonium salt.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1373" publication-number="202611595"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611595.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611595</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學偵測結構、包括光學偵測結構的探針系統以及相關方法</chinese-title>  
        <english-title>OPTICAL DETECTION STRUCTURES, PROBE SYSTEMS THAT INCLUDE OPTICAL DETECTION STRUCTURES, AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G02B21/04</main-classification>  
        <further-classification edition="202001120251201B">G01S17/10</further-classification>  
        <further-classification edition="202001120251201B">G01S17/32</further-classification>  
        <further-classification edition="200601120251201B">G01R1/073</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豐菲克特公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORMFACTOR, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根岸一樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEGISHI, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, QUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里斯坦森　艾瑞克　羅伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHRISTENSON, ERIC ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露光學偵測結構、包含所述光學偵測結構的探針系統、以及相關方法。所述光學偵測結構包含一雷射光源、一光學定向耦合器、一光學偵測器、一光纖、以及一透鏡組件。所述探針系統包含一探針組件、一夾頭、以及所述光學偵測結構。所述方法包含確定一光學偵測結構的一透鏡組件的一物鏡被定位於離一基板的一基板表面的一物鏡焦距處的方法。映射一基板的一基板表面的一表面構形的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Optical detection structures, probe systems that include the optical detection structures, and related methods are disclosed herein. The optical detection structures include a laser light source, an optical directional coupler, an optical detector, an optical fiber, and a lens assembly. The probe systems include a probe assembly, a chuck, and the optical detection structures. The methods include methods of determining when an objective lens of a lens assembly of an optical detection structure is positioned an objective focal length from a substrate surface of a substrate. The methods of mapping a surface topography of a substrate surface of a substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:探針系統</p>  
        <p type="p">20:探針組件</p>  
        <p type="p">22:探針</p>  
        <p type="p">30:夾頭</p>  
        <p type="p">32:支撐表面</p>  
        <p type="p">40:信號產生及分析組件</p>  
        <p type="p">42:測試信號</p>  
        <p type="p">44:所產生的信號</p>  
        <p type="p">50:基板</p>  
        <p type="p">52:基板表面</p>  
        <p type="p">54:受測裝置(DUT)</p>  
        <p type="p">100:顯微鏡</p>  
        <p type="p">102:光學偵測結構</p>  
        <p type="p">110:雷射光源</p>  
        <p type="p">112:源雷射光束</p>  
        <p type="p">114:光學定向耦合器</p>  
        <p type="p">116:輸入埠</p>  
        <p type="p">118:輸出埠</p>  
        <p type="p">120:耦合的埠</p>  
        <p type="p">130:光學偵測器</p>  
        <p type="p">132:強度輸出</p>  
        <p type="p">134:光二極體</p>  
        <p type="p">136:類比信號處理器</p>  
        <p type="p">140:光纖</p>  
        <p type="p">142:傳輸軸</p>  
        <p type="p">144:橫向的光纖表面</p>  
        <p type="p">146:針孔結構</p>  
        <p type="p">160:發射的雷射光束</p>  
        <p type="p">162:發射的光束路徑</p>  
        <p type="p">164:準直的發射的雷射光束</p>  
        <p type="p">166:聚焦的發射的雷射光束</p>  
        <p type="p">170:反射的雷射光束</p>  
        <p type="p">172:反射的光束路徑</p>  
        <p type="p">174:準直的反射的雷射光束</p>  
        <p type="p">180:準直的偵測光束</p>  
        <p type="p">182:偵測反射的光束路徑</p>  
        <p type="p">184:聚焦的反射的雷射光束</p>  
        <p type="p">186:接收到的雷射光束</p>  
        <p type="p">190:準直的成像光束</p>  
        <p type="p">192:成像反射的光束路徑</p>  
        <p type="p">194:聚焦的成像光束</p>  
        <p type="p">200:透鏡組件</p>  
        <p type="p">210:物鏡</p>  
        <p type="p">212:物鏡焦距</p>  
        <p type="p">220:筒鏡</p>  
        <p type="p">222:筒鏡焦距/偵測筒鏡焦距</p>  
        <p type="p">224:偵測筒鏡</p>  
        <p type="p">226:成像筒鏡</p>  
        <p type="p">228:成像筒鏡焦距</p>  
        <p type="p">230:分光鏡</p>  
        <p type="p">240:影像感測器</p>  
        <p type="p">242:影像感測器輸出</p>  
        <p type="p">250:影像顯示器</p>  
        <p type="p">260:平移結構</p>  
        <p type="p">270:控制器</p>  
        <p type="p">272:非暫態的電腦可讀取的儲存媒體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1374" publication-number="202611347"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611347.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611347</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125322</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>溶解及脫泡設備</chinese-title>  
        <english-title>DISSOLVING AND DEGASSING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">D01D1/10</main-classification>  
        <further-classification edition="200601120251209B">B01D19/00</further-classification>  
        <further-classification edition="200601120251209B">B01D29/50</further-classification>  
        <further-classification edition="202201120251209B">B01F27/00</further-classification>  
        <further-classification edition="200601120251209B">B01D35/01</further-classification>  
        <further-classification edition="200601120251209B">F04C11/00</further-classification>  
        <further-classification edition="200601120251209B">B01D37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華紙漿股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG HWA PULP CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林道榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TAO-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許惠雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋憶青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, YI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉昭暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHAO-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種溶解及脫泡設備包括溶解槽、真空泵、循環泵與至少一過濾器。溶解槽配置以容納黏膠液。真空泵連接溶解槽的頂部，配置以移除黏膠液中的氣泡。循環泵連接溶解槽的底部，配置以從溶解槽抽取黏膠液。過濾器連接循環泵與溶解槽，且位於循環泵的下游與溶解槽的上游。過濾器具有複數個篩網，且這些篩網的網目數不同，配置以捕捉從溶解槽抽取的黏膠液中不同大小的雜質與其他氣泡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dissolving and degassing equipment includes a dissolution tank, a vacuum pump, a circulation pump, and at least one filter. The dissolution tank is configured to accommodate dope. The vacuum pump is connected to the top portion of the dissolution tank, and is configured to remove bubbles in the dope. The circulation pump is connected to the bottom portion of the dissolution tank, and is configured to draw the dope from the dissolution tank. The filter is connected to the circulation pump and the dissolution tank, and is located downstream of the circulation pump and upstream of the dissolution tank. The filter has plural sieves. The sieves have different numbers of meshes, and are configured to capture impurities with different sizes and other bubbles in the dope drawn from the dissolution tank.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:溶解及脫泡設備</p>  
        <p type="p">102:黏膠液</p>  
        <p type="p">110:溶解槽</p>  
        <p type="p">120:真空泵</p>  
        <p type="p">130:循環泵</p>  
        <p type="p">140,140a,140b,140c,140d:過濾器</p>  
        <p type="p">141,142:篩網</p>  
        <p type="p">150:攪拌器</p>  
        <p type="p">152:馬達</p>  
        <p type="p">154:葉片</p>  
        <p type="p">162:保溫夾套</p>  
        <p type="p">164:加熱及溫度控制器</p>  
        <p type="p">171,172,173,174,175:開關閥</p>  
        <p type="p">176:加壓閥</p>  
        <p type="p">177:開關閥</p>  
        <p type="p">178:真空閥</p>  
        <p type="p">179:開關閥</p>  
        <p type="p">180:空氣壓縮機</p>  
        <p type="p">F1:流動路徑</p>  
        <p type="p">L:循環管路</p>  
        <p type="p">P:壓力計</p>  
        <p type="p">T:溫度計</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1375" publication-number="202610996"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610996.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610996</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125331</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電解液</chinese-title>  
        <english-title>ELECTROLYTE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C211/63</main-classification>  
        <further-classification edition="200601120251201B">C07D207/06</further-classification>  
        <further-classification edition="201301120251201B">H01G11/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大塚化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川泰治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, TAIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍋島亮浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NABESHIMA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濵口典久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAGUCHI, NORIHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的係提供一種新穎的電解液。 &lt;br/&gt;電解液，係包含具有選自支鏈脂肪族烴基及脂環族烴基中至少1個的四級銨鹽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The purpose of the present invention is to provide a novel electrolyte. &lt;br/&gt;The electrolyte comprises a quaternary ammonium salt containing at least one group selected from branched aliphatic hydrocarbon groups and cycloaliphatic hydrocarbon groups.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">本案無圖式。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1376" publication-number="202610688"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610688.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610688</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＲＯＲ２抗體－藥物結合物</chinese-title>  
        <english-title>ANTI-ROR2 ANTIBODY-DRUG CONJUGATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">A61K47/68</main-classification>  
        <further-classification edition="200601120251201B">C07K16/28</further-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">C07D207/08</further-classification>  
        <further-classification edition="200601120251201B">A61K31/437</further-classification>  
        <further-classification edition="200601120251201B">A61K31/40</further-classification>  
        <further-classification edition="200601120251201B">C07D403/12</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商解方治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLVE THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭努蒂　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANNUTTI, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃特金斯　傑夫瑞　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATKINS, JEFFRY D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑森　凱蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JESSEN, KATTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供包含抗ROR2抗體或其抗原結合部分及細胞毒性藥物部分的抗體-藥物結合物，以及使用其等治療表現ROR2之癌症之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides antibody-drug conjugates comprising an anti-ROR2 antibody or an antigen-binding portion thereof and a cytotoxic drug moiety, and methods of using them to treat ROR2-expressing cancers.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1377" publication-number="202611615"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611615.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611615</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125384</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光調變器、光調變器之方法及具有加熱功能的光調變器基板</chinese-title>  
        <english-title>LIGHT MODULATOR, LIGHT MODULATOR METHOD AND SUBSTRATE FOR A LIGHT MODULATOR WITH HEATING FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251202B">G02F1/167</main-classification>  
        <further-classification edition="201901120251202B">G02F1/1676</further-classification>  
        <further-classification edition="201901120251202B">G02F1/1677</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商艾爾星動力學專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELSTAR DYNAMICS PATENTS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬薩德　羅馬利克　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASSARD, ROMARIC MATHIEU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米蒂奧盧　阿納托利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITIOGLU, ANATOLIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RO</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些實施例係針對一種光調變器。該光調變器具有依一迴路橫跨其基板之一表面延伸之至少一個電極。該迴路可用於使一電流流入及流出該迴路以誘發橫跨該基板加熱，特別是在該光調變器之一光學層中。該迴路中可包含一系列導電橋接線以在該光學層中產生電場。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments are directed to a light modulator. The light modulator has at least one electrode extending across a surface of its substrates with a loop. The loop may be used for the flow of an electrical current into and out of the loop to induce heating across the substrate, in particular in an optical layer of the light modulator. A series of conductive bridging lines may be included in the loop to create the electric field in the optical layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">62:電極</p>  
        <p type="p">600:基板</p>  
        <p type="p">611,612:電極線</p>  
        <p type="p">621至624:一系列導電橋接電極線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1378" publication-number="202612527"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612527.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612527</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125386</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層構造及其製造方法以及半導體裝置</chinese-title>  
        <english-title>LAMINATED STRUCTURE, METHOD OF PRODUCING SAME, AND SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">H10D64/62</main-classification>  
        <further-classification edition="200601120251201B">B32B15/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立研究開發法人產業技術總合研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文馨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEN-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>入沢寿史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRISAWA, TOSHIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊藤雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畑山祥吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAYAMA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">此積層構造(100)為n型鍺層(10)和金屬層(20)透過層狀化合物層(30)接合，具有歐姆特性的積層構造，層狀化合物層(30)為由一般式Ge&lt;sub&gt;x&lt;/sub&gt;Bi&lt;sub&gt;3-x&lt;/sub&gt;Te&lt;sub&gt;4&lt;/sub&gt; (但0＜x≦1)表示的化合物所形成，n型鍺層(10)和層狀化合物層(30)透過凡得瓦界面接合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The laminated structure is a laminated structure with ohmic characteristics, in which an n-type germanium layer (10) and a metal layer (20) are joined via a layered compound layer (30). The layered compound layer (30) is formed of a compound, which is represented by a general formula Ge&lt;sub&gt;x&lt;/sub&gt;Bi&lt;sub&gt;3-x&lt;/sub&gt;Te&lt;sub&gt;4&lt;/sub&gt;, where 0＜x≤1. The n-type germanium layer (10) and the layered compound layer (30) are joined with a van der Waals interface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積層構造</p>  
        <p type="p">10:n型鍺層</p>  
        <p type="p">20:金屬層</p>  
        <p type="p">30:層狀化合物層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1379" publication-number="202611558"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611558.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611558</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125404</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固態攝像元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G02B3/00</main-classification>  
        <further-classification edition="202501120251201B">H10F77/40</further-classification>  
        <further-classification edition="202501120251201B">H10F39/12</further-classification>  
        <further-classification edition="202301120251201B">H04N23/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田和紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂木涼真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTEGI, RYOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">固態攝像元件(1)係包含每4個像素配置有1個微透鏡(ML)的QPD結構的固態攝像元件。微透鏡為，包含有光軸(AX)的中央部(CP)是以第1曲率半徑(r1)所形成，中央部周圍的周邊部(PP)是以小於第1曲率半徑的第2曲率半徑(r2)所形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:固態攝像元件</p>  
        <p type="p">10:半導體基板</p>  
        <p type="p">12:光電轉換元件</p>  
        <p type="p">14:間隔壁</p>  
        <p type="p">16:封填用樹脂</p>  
        <p type="p">20:彩色濾波器</p>  
        <p type="p">20B:藍色濾波器</p>  
        <p type="p">20G:綠色濾波器</p>  
        <p type="p">32:密封玻璃</p>  
        <p type="p">34:光學低通濾波器</p>  
        <p type="p">36:IR截止濾波器</p>  
        <p type="p">ML:微透鏡</p>  
        <p type="p">MLA:微透鏡陣列</p>  
        <p type="p">PX1,PX3:像素</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1380" publication-number="202612545"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612545.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612545</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125405</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固態攝像元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">H10F77/40</main-classification>  
        <further-classification edition="202501120251201B">H10F39/12</further-classification>  
        <further-classification edition="200601120251201B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田和紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂木涼真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTEGI, RYOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">固態攝像元件(1)乃係具備設有呈周期性排列的複數個微透鏡(ML)的微透鏡陣列(MLA)的固態攝像元件。微透鏡為，包含有光軸(AX)的中央部(CP)是以第1曲率半徑(r1)所形成，中央部周圍的周邊部(PP)是以小於第1曲率半徑的第2曲率半徑(r2)所形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:固態攝像元件</p>  
        <p type="p">10:半導體基板</p>  
        <p type="p">12:光電轉換元件</p>  
        <p type="p">14:間隔壁</p>  
        <p type="p">16:封填用樹脂</p>  
        <p type="p">20:彩色濾波器</p>  
        <p type="p">20B:藍色濾波器</p>  
        <p type="p">20G:綠色濾波器</p>  
        <p type="p">32:密封玻璃</p>  
        <p type="p">34:光學低通濾波器</p>  
        <p type="p">36:IR截止濾波器</p>  
        <p type="p">ML:微透鏡</p>  
        <p type="p">MLA:微透鏡陣列</p>  
        <p type="p">PX1:像素</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1381" publication-number="202611161"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611161.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611161</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125428</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合物及其硬化物、成形物、顯示裝置、以及固體攝像元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G59/42</main-classification>  
        <further-classification edition="200601120251201B">C08G75/06</further-classification>  
        <further-classification edition="200601120251201B">C08L63/00</further-classification>  
        <further-classification edition="200601120251201B">C08L81/02</further-classification>  
        <further-classification edition="200601120251201B">G02B1/04</further-classification>  
        <further-classification edition="200601120251201B">G09F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淺津悠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASATSU, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出崎光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEZAKI, HIKARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種組合物，其能夠形成顯示出較高之折射率之硬化物，進而具有良好之製膜性。 &lt;br/&gt;本發明提供一種組合物，其含有：化合物(A)，其具有環硫乙烷基或環硫丙烷基；及環氧樹脂(B)，其具有式(b-1)所表示之結構。 &lt;br/&gt;&lt;img align="absmiddle" height="99px" width="308px" file="ed10047.JPG" alt="ed10047.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(b-1)中， &lt;br/&gt;W&lt;sup&gt;0&lt;/sup&gt;表示2價基。 &lt;br/&gt;＊表示鍵結位置]。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1382" publication-number="202612058"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612058.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612058</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125469</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造裝置</chinese-title>  
        <english-title>SEMICONDUCTOR MANUFACTURING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L21/67</main-classification>  
        <further-classification edition="200601120251204B">H01L21/683</further-classification>  
        <further-classification edition="200601120251204B">H01L21/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商帝國貼膜系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEIKOKU TAPING SYSTEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勝島吉則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATSUSHIMA, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">作為本公開的實施形態的半導體製造裝置的一例的膜貼附裝置（100）包括：工作臺（TB），用於載置半導體晶圓（W）；按壓輥（20），用於對要貼附到被載置在工作臺（TB）上的半導體晶圓（W）上的膜（6）進行按壓；以及真空腔（VC），用於容納被載置在工作臺（TB）上的半導體晶圓（W）和按壓輥（20）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">As one example of the semiconductor manufacturing device according to the present disclosure, a film attaching device (100) includes: a table (TB) configured to hold a semiconductor wafer (W); a pressing roller (20) configured to press a film (6) to be attached onto the semiconductor wafer (W) held on the table (TB); and a vacuum chamber (VC) configured to accommodate the semiconductor wafer (W) held on the table (TB) and the pressing roller (20).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:膜供給部</p>  
        <p type="p">4:膜捲取部</p>  
        <p type="p">5:外周側支承部件</p>  
        <p type="p">6:膜</p>  
        <p type="p">7:載膜</p>  
        <p type="p">8:載膜捲取部</p>  
        <p type="p">9:夾送輥</p>  
        <p type="p">10L:左側板部件</p>  
        <p type="p">10R:右側板部件</p>  
        <p type="p">10U:上側板部件</p>  
        <p type="p">10BL:左后側板部件</p>  
        <p type="p">10BR:右后側板部件</p>  
        <p type="p">10DC:中央下側板部件</p>  
        <p type="p">10IL:左內側板部件</p>  
        <p type="p">10IR:右內側板部件</p>  
        <p type="p">11L:左側門部件</p>  
        <p type="p">11R:右側門部件</p>  
        <p type="p">13U:上側加強部件</p>  
        <p type="p">14U:上側透光部件</p>  
        <p type="p">20:按壓輥</p>  
        <p type="p">MU:移動單元</p>  
        <p type="p">MU1:第1移動單元</p>  
        <p type="p">MU2:第2移動單元</p>  
        <p type="p">VC:真空腔</p>  
        <p type="p">UH:上側開口</p>  
        <p type="p">TC:上側蓋部件</p>  
        <p type="p">SX:滑動軸部件</p>  
        <p type="p">R1:虛線包圍的範圍</p>  
        <p type="p">R2:虛線包圍的範圍</p>  
        <p type="p">LH:下側開口</p>  
        <p type="p">BC:下側蓋部件</p>  
        <p type="p">TB:工作臺</p>  
        <p type="p">W:半導體晶圓</p>  
        <p type="p">GVU:上側槽</p>  
        <p type="p">GVD:下側槽</p>  
        <p type="p">RGU:上側O型環</p>  
        <p type="p">RGD:下側O型環</p>  
        <p type="p">Z1:Z軸的一個方向</p>  
        <p type="p">Z2:Z軸的另一個方向</p>  
        <p type="p">Y1:Y軸的一個方向</p>  
        <p type="p">Y2:Y軸的另一個方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1383" publication-number="202612184"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612184.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612184</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125474</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導電片、連接組件以及導電片的製造方法</chinese-title>  
        <english-title>CONDUCTIVE SHEET, CONNECTION ASSEMBLY AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250821B">H01R13/11</main-classification>  
        <further-classification edition="200601120250821B">H01R13/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞立訊技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭金闖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, JINCHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚坤磷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, KUNLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種導電片包括骨架以及彈性組件。前述彈性組件包括彈性體以及複數導電元件。前述複數導電元件包括第一訊號元件、第二訊號元件以及複數接地元件，其中前述第一訊號元件與前述第二訊號元件組成差分訊號對。每一個導電元件包括第一對接面以及第二對接面。前述第一對接面配置為與第一對接模組的第一導電構件相抵接，前述第二對接面配置為與第二對接模組的第二導電構件相抵接。本發明的前述彈性體能夠吸收平面度誤差，提高了對接可靠性。本發明還揭示了一種包括前述導電片的連接組件以及前述導電片的製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A conductive sheet includes a skeleton and an elastic component. The elastic component includes an elastomer and a plurality of conductive elements. The plurality of conductive elements include a first signal element, a second signal element, and a plurality of grounding elements. The first signal element and the second signal element form a differential signal pair. Each conductive element includes a first mating surface and a second mating surface. The first mating surface is configured to abut against a first conductive component of a first mating module, and the second mating surface is configured to abut against a second conductive component of a second mating module. The elastomer of the present invention is able to absorb flatness errors and improve mating reliability. The present invention also discloses a connection assembly having the conductive sheet, and a method of manufacturing the conductive sheet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:導電片</p>  
        <p type="p">111:第一表面</p>  
        <p type="p">121:第二表面</p>  
        <p type="p">22:導電元件</p>  
        <p type="p">221:第一對接面</p>  
        <p type="p">222:第二對接面</p>  
        <p type="p">3:第一對接模組</p>  
        <p type="p">31:第一導電構件</p>  
        <p type="p">32:第一絕緣本體</p>  
        <p type="p">33:第一接地部</p>  
        <p type="p">4:第二對接模組</p>  
        <p type="p">41:第二導電構件</p>  
        <p type="p">42:第二絕緣本體</p>  
        <p type="p">43:第二接地部</p>  
        <p type="p">D:圖8中畫框部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1384" publication-number="202611860"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611860.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611860</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125528</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於紊流液體表面之雜訊影像特徵識別之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR NOISY IMAGE FEATURE IDENTIFICATION FOR TURBULENT LIQUID SURFACES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">G06T7/00</main-classification>  
        <further-classification edition="201701120251201B">G06T7/70</further-classification>  
        <further-classification edition="200601120251201B">G01N21/15</further-classification>  
        <further-classification edition="200601120251201B">C30B29/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅爾　班傑明　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEYER, BENJAMIN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧特　威廉　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUTTER, WILLIAM L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電腦裝置包含與至少一個記憶體裝置進行通信之至少一個處理器。該至少一個處理器經程式化以：a)接收複數個影像；b)對於該複數個影像中之每一影像，分析該對應影像中之複數個像素中之每一像素以判定該對應像素之一色彩像素強度；c)若該判定係該色彩像素強度超過一預定色彩臨限值，則遞增該對應像素之一像素位置之一命中計數；d)對於該複數個像素中之每一像素，比較該對應像素之該命中計數與一預定命中臨限值；e)若該命中計數超過該預定命中臨限值，則將該對應像素指派為接通；及f)基於該複數個像素及其對應指派而判定該反射之一中心。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computer device includes at least one processor in communication with at least one memory device. The at least one processor is programmed to: a) receive a plurality of images; b) for each image of the plurality of images, analyze each pixel of a plurality of pixels in the corresponding image to determine a color pixel intensity for the corresponding pixel; c) if the determination is that the color pixel intensity exceeds a predetermined color threshold, increment a hit count for a pixel location for the corresponding pixel; d) for each pixel of the plurality of pixels, compare the hit count for the corresponding pixel to a predetermined hit threshold; e) if the hit count exceeds the predetermined hit threshold, assign the corresponding pixel as on; and f) determine a center for the reflection based on the plurality of pixels and their corresponding assignments.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1385" publication-number="202611029"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611029.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611029</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125554</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、電洞輸送材料、鈣鈦礦太陽能電池用電洞輸送材料、鈣鈦礦太陽能電池、構造物及鈣鈦礦太陽能電池之製造方法</chinese-title>  
        <english-title>COMPOUND, HOLE TRANSPORT MATERIAL, HOLE TRANSPORT MATERIAL FOR PEROVSKITE SOLAR CELL, PEROVSKITE SOLAR CELL, STRUCTURE, AND METHOD OF MANUFACTURING PEROVSKITE SOLAR CELL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D235/02</main-classification>  
        <further-classification edition="200601120251201B">C07D401/14</further-classification>  
        <further-classification edition="200601120251201B">C07D409/14</further-classification>  
        <further-classification edition="200601120251201B">C07D495/04</further-classification>  
        <further-classification edition="200601120251201B">C07D495/14</further-classification>  
        <further-classification edition="202301120251201B">H10K30/50</further-classification>  
        <further-classification edition="202301120251201B">H10K85/50</further-classification>  
        <further-classification edition="202301120251201B">H10K85/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰魯古　比姆拉朱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TELUGU, BHIM RAJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松島敏則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHIMA, TOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之化合物由式(X)表示。R&lt;sub&gt;1&lt;/sub&gt;為H或烴基，R&lt;sub&gt;2&lt;/sub&gt;為烷氧基或烷硫基，Y&lt;sub&gt;2&lt;/sub&gt;為N或P，C&lt;sub&gt;1&lt;/sub&gt;、C&lt;sub&gt;3&lt;/sub&gt;及C&lt;sub&gt;4&lt;/sub&gt;之各者為C，n為2或4，當n為2之情形時，X為基(X3)～基(X6)中之任一者，且Y&lt;sub&gt;1&lt;/sub&gt;為鹵素，當n為4之情形時，X為基(X1)或基(X2)，且Y&lt;sub&gt;1&lt;/sub&gt;為H或烴基。 &lt;br/&gt;&lt;img align="absmiddle" height="547px" width="605px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1386" publication-number="202612005"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612005.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612005</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125562</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251119B">H01L21/304</main-classification>  
        <further-classification edition="200601120251119B">H01L21/683</further-classification>  
        <further-classification edition="200601120251119B">B24B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤方淳平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKATA, JUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳凱智</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可在削薄積層基板時抑制基板之碎屑及／或龜裂。本發明所提供之基板處理方法包含以下工序：在基板之第一面沿著前述基板之邊緣部與該邊緣部內側之中央部的邊界，於前述邊緣部上形成溝；將形成有前述溝之前述基板的第一面與支撐體接合；及藉由磨削與前述基板之第一面相反側的第二面來削薄前述基板，並且在前述基板之前述中央部及前述邊緣部兩者與前述支撐體接合的狀態下，藉由前述溝使前述基板之前述中央部與前述邊緣部分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:溝</p>  
        <p type="p">20:磨削裝置</p>  
        <p type="p">30:磨石</p>  
        <p type="p">C&lt;sub&gt;W&lt;/sub&gt;1,C&lt;sub&gt;W&lt;/sub&gt;2:中央部</p>  
        <p type="p">D&lt;sub&gt;W&lt;/sub&gt;1,D&lt;sub&gt;W&lt;/sub&gt;2:元件區域</p>  
        <p type="p">E&lt;sub&gt;W&lt;/sub&gt;1,E&lt;sub&gt;W&lt;/sub&gt;2:邊緣部</p>  
        <p type="p">W1,W2:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1387" publication-number="202611867"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611867.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611867</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125568</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於多攝影機校準的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR MULTI-CAMERA CALIBRATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">G06T7/80</main-classification>  
        <further-classification edition="200601120251201B">G06K19/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維爾甘　克莉斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAREKAMP, CHRISTIAAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏曼　阿諾德斯　渥納　喬翰尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOMEN, ARNOLDUS WERNER JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於多攝影機擷取的系統及方法。一空間變化圖案顯示在一第一無線連接裝置上，並擷取在由複數個攝影機取得的視訊序列中。各攝影機皆提供在一另外的各別無線連接裝置中。該等視訊序列經處理以識別該經顯示空間變化圖案，且該空間變化圖案用以判定各攝影機的一初始相對姿勢。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for multi-camera capture. A spatially varying pattern is displayed on a first wirelessly-connected device and captured in video sequences acquired by a plurality of cameras. Each camera is provided in a respective further wirelessly-connected device. The video sequences are processed to identify the displayed spatially varying pattern, and the spatially varying pattern is used to determine an initial relative pose of each camera.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:第一無線連接裝置</p>  
        <p type="p">120:另外的無線連接裝置；另外的無線連接行動裝置；無線連接裝置</p>  
        <p type="p">125:視訊序列</p>  
        <p type="p">130:處理系統</p>  
        <p type="p">140:空間變化圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1388" publication-number="202610839"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610839.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610839</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層成形系統及積層成形品之製造方法</chinese-title>  
        <english-title>LAMINATION-FORMING SYSTEM AND METHOD OF MANUFACTURING LAMINATION-FORMED PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">B32B39/00</main-classification>  
        <further-classification edition="200601120251210B">B65H18/08</further-classification>  
        <further-classification edition="200601120251210B">B32B37/10</further-classification>  
        <further-classification edition="200601120251210B">B32B37/08</further-classification>  
        <further-classification edition="200601120251210B">B29C35/02</further-classification>  
        <further-classification edition="200601120251210B">B29C35/16</further-classification>  
        <further-classification edition="200601120251210B">F04D27/00</further-classification>  
        <further-classification edition="200601120251210B">F04D25/00</further-classification>  
        <further-classification edition="200601120251210B">G05D23/19</further-classification>  
        <further-classification edition="200601320251210B">B29L9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本製鋼所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE JAPAN STEEL WORKS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本隆幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永井岳志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉崎桂一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGISAKI, KEIICHIROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>植田直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">施行層壓處理以抑制平台的污染。本發明之積層成形系統係具備有：一對載體膜，其從上下夾持被積層體上積層有積層材的積層對象物沿著搬送方向進行搬送；薄膜捲出機，其捲出載體膜；積層裝置，其配置於薄膜捲出機之後段並對積層對象物加壓而使積層成形品成形；冷卻部，其配置於積層裝置之後段並對積層成形品冷卻；及薄膜捲取機，其配置於積層裝置之後段並搬出載置於載體膜之積層成形品。冷卻部係具有：氣流產生手段，其從相對於搬送方向大略垂直方向朝向前述搬送方向之後段側，以傾斜既定角度之方向使冷卻風流動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:供給裝置</p>  
        <p type="p">11:上薄膜捲出裝置</p>  
        <p type="p">12:上薄膜清潔裝置</p>  
        <p type="p">13:下薄膜捲出裝置</p>  
        <p type="p">14:下薄膜清潔裝置</p>  
        <p type="p">15:基板接收單元</p>  
        <p type="p">20:成形裝置</p>  
        <p type="p">21:第一平台</p>  
        <p type="p">22:第二平台</p>  
        <p type="p">23:第三平台</p>  
        <p type="p">30:冷卻裝置</p>  
        <p type="p">31:冷卻風扇</p>  
        <p type="p">40:回收裝置</p>  
        <p type="p">41:上薄膜捲取裝置</p>  
        <p type="p">42:下薄膜捲取裝置</p>  
        <p type="p">100:積層成形系統</p>  
        <p type="p">F1:上薄膜</p>  
        <p type="p">F2:下薄膜</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1389" publication-number="202611169"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611169.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611169</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125584</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含聚合物的樹脂組成物及聚合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G65/40</main-classification>  
        <further-classification edition="200601120251201B">C08L71/10</further-classification>  
        <further-classification edition="200601120251201B">C08J5/18</further-classification>  
        <further-classification edition="200601120251201B">H01L21/60</further-classification>  
        <further-classification edition="200601120251201B">H01L23/29</further-classification>  
        <further-classification edition="200601120251201B">H01L23/31</further-classification>  
        <further-classification edition="200601120251201B">G09F9/30</further-classification>  
        <further-classification edition="200601120251201B">G09F9/33</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅原峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAWARA, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱玲史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMA, REIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大西耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONISHI, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榎本智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENOMOTO, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種作為可得到介電特性優異之薄膜的樹脂組成物，其係包含：具有由下述式(1)表示之重複單元結構，且不具有馬來醯亞胺基之直鏈狀的聚合物；以及不包含無機粒子。 &lt;br/&gt;&lt;img align="absmiddle" height="125px" width="461px" file="ed10053.JPG" alt="ed10053.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　[(式中，X是分別獨立地表示烯丙基或乙烯基，Z是表示選自由下述式(z1)~(z9)所組成的群組中之2價的基。) &lt;br/&gt;&lt;img align="absmiddle" height="333px" width="442px" file="ed10054.JPG" alt="ed10054.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，黑點「・」表示與苯環之鍵結鍵。)]。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1390" publication-number="202611324"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611324.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611324</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125601</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在矽上阻擋膜沉積之炔烴及烯烴</chinese-title>  
        <english-title>ALKYNES AND ALKENES FOR BLOCKING FILM DEPOSITION ON SILICON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C23C16/04</main-classification>  
        <further-classification edition="200601120251201B">C23C16/30</further-classification>  
        <further-classification edition="200601120251201B">C23C16/455</further-classification>  
        <further-classification edition="200601120251201B">H01L21/314</further-classification>  
        <further-classification edition="202501120251201B">H10D30/01</further-classification>  
        <further-classification edition="202501120251201B">H10D30/60</further-classification>  
        <further-classification edition="202501120251201B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恩曼　莉莎Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENMAN, LISA J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布洋　巴斯卡爾喬帝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHUYAN, BHASKAR JYOTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹爵菲德　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANGERFIELD, AARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　世海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEONG, SAI HOOI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩利　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALY, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡路塔瑞奇　蘭卡摩Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALUTARAGE, LAKMAL C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡賽尼　賽義德馬哈茂德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSSEINI, SEYED MAHMOUD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了選擇性地沉積低介電常數介電膜的方法。在一或多個實施例中，方法包含將基板暴露於阻擋化合物，該基板包含第一表面和第二表面，該第一表面包含氫終止的矽，該阻擋化合物選擇性地沉積在第一表面上，以形成被阻擋的第一表面；以及在第二表面上選擇性地沉積低介電常數介電膜。描述了形成內間隔層的方法。在一或多個實施例中，方法包含預處理基板以移除基板的氫終止的矽（Si）通道上的氧化物，該基板包含氫終止的矽通道和矽鍺（SiGe）表面；將基板暴露於阻擋化合物，該阻擋化合物選擇性地沉積在氫終止的矽（Si）通道上，以形成被阻擋的矽通道；以及在矽鍺表面上選擇性地沉積內間隔層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of selectively depositing a low-k dielectric film are described. In one or more embodiments, the methods include exposing a substrate to a blocking compound, the substrate including a first surface and a second surface, the first surface including hydrogen-terminated silicon, the blocking compound selectively depositing on the first surface to form a blocked first surface; and selectively depositing the low-k dielectric film on the second surface. Methods of forming an inner spacer layer are described. In one or more embodiments, the methods include pretreating a substrate to remove oxide from a hydrogen-terminated silicon (Si) channel of the substrate, the substrate including the hydrogen-terminated silicon channel and a silicon germanium (SiGe) surface; exposing the substrate to a blocking compound, the blocking compound selectively depositing on the hydrogen-terminated silicon (Si) channel to form a blocked silicon channel; and depositing the inner spacer layer selectively on the silicon germanium surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:基板</p>  
        <p type="p">102:第一表面</p>  
        <p type="p">104:第二表面</p>  
        <p type="p">106:末端氫</p>  
        <p type="p">108:第一表面</p>  
        <p type="p">110:低介電常數介電膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1391" publication-number="202612088"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612088.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612088</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125608</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置、容器搬運方法、基板處理方法、半導體裝置的製造方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/677</main-classification>  
        <further-classification edition="200601120251201B">H01L21/683</further-classification>  
        <further-classification edition="200601120251201B">B65G49/07</further-classification>  
        <further-classification edition="200601120251201B">B65G43/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷川理沙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIKAWA, RISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]能夠提高基板的搬運處理量。 &lt;br/&gt;　　[解決手段]具有：第一容器支撐部，其係能夠支撐能夠收納基板的容器；第二容器支撐部，其係配置在前述第一容器支撐部的上方，能夠載置前述容器的多個載置部設在圓周方向；旋轉軸，其係使前述第二容器支撐部公轉；搬運機器人，其係能夠與前述第一容器支撐部或是前述第二容器支撐部交接前述容器；升降部，其係能夠沿升降軸來升降前述搬運機器人；以及控制部，其係能夠控制前述旋轉軸及前述搬運機器人，使得在從前述搬運機器人移載前述容器至規定的前述載置部時，從前述載置部從前述搬運機器人移動至能夠接受前述容器的位置之第一移動速度，加速到使前述搬運機器人升降的前述升降部之第二移動速度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:裝載埠</p>  
        <p type="p">50:旋轉架</p>  
        <p type="p">52A:支柱旋轉機構</p>  
        <p type="p">70:匣移送裝置</p>  
        <p type="p">74:升降機</p>  
        <p type="p">78:搬運機器人</p>  
        <p type="p">100:舟皿升降裝置</p>  
        <p type="p">110:晶圓移載裝置</p>  
        <p type="p">114:旋轉致動器</p>  
        <p type="p">116:第一線型致動器</p>  
        <p type="p">118:第二線型致動器</p>  
        <p type="p">124:升降機</p>  
        <p type="p">237:子控制器</p>  
        <p type="p">237a:CPU</p>  
        <p type="p">237b:RAM</p>  
        <p type="p">237c:記憶裝置</p>  
        <p type="p">237d:I/O埠</p>  
        <p type="p">239:主控制部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1392" publication-number="202610837"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610837.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610837</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125619</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>剝離紙用原紙及剝離紙</chinese-title>  
        <english-title>BASE PAPER FOR RELEASE PAPER AND RELEASE PAPER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B29/00</main-classification>  
        <further-classification edition="200601120251201B">D21H19/36</further-classification>  
        <further-classification edition="200601120251201B">D21H27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本製紙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON PAPER INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>登坂昌也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOSAKA, MASAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田義雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, YOSHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古井信太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUI, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平井健二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAI, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供具有透光性的剝離紙用原紙與具有該剝離紙用原紙的剝離紙。用以解決課題的手段係提供一種剝離紙用原紙，其具備基紙與位於前述基紙之至少一面上的填孔層，其密度為0.85g/cm&lt;sup&gt;3&lt;/sup&gt;以上1.05g/cm&lt;sup&gt;3&lt;/sup&gt;以下且依據JIS P 8149：2000的不透明度為45%以上65%以下；以及提供一種剝離紙用原紙的製造方法，其具有藉由聯機型塗佈機在基紙的至少一面上塗佈填孔層用塗佈液的步驟，所得之剝離紙用原紙之密度為0.85g/cm&lt;sup&gt;3&lt;/sup&gt;以上1.05g/cm&lt;sup&gt;3&lt;/sup&gt;以下，且依據JIS P 8149：2000的不透明度為45%以上65%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a base paper for release paper with light permeability, and a release paper having the base paper. As a means for attaining the objective is to provide a base paper for release paper, which has a substrate paper and a filling layer on at least one surface of the substrate paper, the base paper having a density of not less than 0.85 g/cm&lt;sup&gt;3&lt;/sup&gt; and not more than 1.05 g/cm&lt;sup&gt;3&lt;/sup&gt;, and an opacity of not less than 45% and not more than 65% conforming to JIS P 8149:2000. Also provided is a method for manufacturing base paper for release paper, comprising a step of coating at least one surface of the substrate paper with a coating liquid for filling layer by using an on-machine coater, wherein the obtained base paper for release paper has a density of not less than 0.85 g/cm&lt;sup&gt;3&lt;/sup&gt; and not more than 1.05 g/cm&lt;sup&gt;3&lt;/sup&gt;, and an opacity of not less than 45% and not more than 65% conforming to JIS P 8149: 2000.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">本案無圖式。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1393" publication-number="202611105"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611105.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611105</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125621</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F6/06</main-classification>  
        <further-classification edition="200601120251201B">C08F8/12</further-classification>  
        <further-classification edition="200601120251201B">C08F212/14</further-classification>  
        <further-classification edition="200601120251201B">C08F220/38</further-classification>  
        <further-classification edition="200601120251201B">C08F220/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商丸善石油化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUZEN PETROCHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村𨺓太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, RYUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相原大路</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIHARA, HIROMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供會得到含有具有酚性羥基之結構單元、具有易酸解離性基之結構單元、具有光酸產生基之結構單元之高純度的阻劑用聚合物，且操作性優良之阻劑用聚合物之製造方法。 &lt;br/&gt;　　[解決手段]一種聚合物之製造方法，其係含有具有酚性羥基之結構單元、具有酸解離性基之結構單元、具有光酸產生基之結構單元之聚合物之製造方法， &lt;br/&gt;　　其包含：將至少具有以縮醛基保護酚性羥基之結構之單體、具有酸解離性基之單體、具有光酸產生基之單體，在溶劑中進行聚合之步驟，及 &lt;br/&gt;　　脫保護步驟，其係使前述聚合步驟中得到的聚合物，在pKa係8以下之酸不存在下，與成為質子源的化合物接觸，並將前述縮醛基進行脫保護之步驟；前述縮醛基之脫保護率係98莫耳%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1394" publication-number="202611826"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611826.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611826</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125628</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理系統、資訊處理方法及電腦程式產品</chinese-title>  
        <english-title>INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND COMPUTER PROGRAM PRODUCTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">G06Q30/02</main-classification>  
        <further-classification edition="201901120251201B">G06N20/00</further-classification>  
        <further-classification edition="202001120251201B">G06F40/20</further-classification>  
        <further-classification edition="201901120251201B">G06F16/951</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂天集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKUTEN GROUP, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴達夫尼　安奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BADAVNE, ANAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種資訊處理系統、資訊處理方法、及電腦程式產品。 &lt;br/&gt;　　[解決手段]藉由至少1個處理器而被執行的資訊處理方法，係含有：向機器學習的生成模型輸入提詞，其中，生成模型係被構成為，一旦輸入用來令該生成模型生成資料所需之指示，就將隨應於指示而生成的資料予以輸出；提詞係含有：用來發送至1個以上之使用者終端所需之通知文的1個原案、和用來令其修正1個原案所需之修正指示；和將生成模型依照修正指示而修正了1個原案而成的草案，從生成模型加以取得；和向機器學習的預測模型輸入草案，其中，預測模型係被構成為，一旦輸入草案，就將表示接收到草案時的使用者之反應的指標的預測結果，予以輸出；和將針對預測模型所輸出之草案的預測結果，加以取得。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:資訊處理系統</p>  
        <p type="p">14:生成模型</p>  
        <p type="p">20:資訊處理裝置</p>  
        <p type="p">21,31,41,51,61,81:處理器</p>  
        <p type="p">22,32,42,52,62,82:記憶體</p>  
        <p type="p">23,33,43,53,63,83:通訊IF</p>  
        <p type="p">24,34,44,84:程式</p>  
        <p type="p">25,35:資料庫</p>  
        <p type="p">26:預測模型</p>  
        <p type="p">30:伺服器</p>  
        <p type="p">40:學習模型生成裝置</p>  
        <p type="p">45:學習模型</p>  
        <p type="p">46:資料集</p>  
        <p type="p">50:委託者終端</p>  
        <p type="p">54:輸入裝置</p>  
        <p type="p">55:輸出裝置</p>  
        <p type="p">60:使用者終端</p>  
        <p type="p">64:顯示器</p>  
        <p type="p">66:結帳用之代碼</p>  
        <p type="p">67:結帳用畫面</p>  
        <p type="p">70:通知連結鈕</p>  
        <p type="p">80:終端裝置</p>  
        <p type="p">85:輸入裝置</p>  
        <p type="p">86:顯示器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1395" publication-number="202611657"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611657.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611657</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調節閥、質量流量控制器及其流量控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">G05D7/06</main-classification>  
        <further-classification edition="200601120251210B">F16K31/02</further-classification>  
        <further-classification edition="200601120251210B">G01D5/24</further-classification>  
        <further-classification edition="200601120251210B">C23C16/455</further-classification>  
        <further-classification edition="200601120251210B">F16K37/00</further-classification>  
        <further-classification edition="200601120251210B">G05B19/401</further-classification>  
        <further-classification edition="200601120251210B">H01L21/67</further-classification>  
        <further-classification edition="200601120251210B">H01L21/205</further-classification>  
        <further-classification edition="200601120251210B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京華丞電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班雲升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉健龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬俊博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種調節閥、質量流量控制器及其流量控制方法，該調節閥包括閥體組件、閥芯組件和位置檢測裝置，其中，閥體組件具有閥口；閥芯組件包括閥芯結構，閥芯結構具有密封面，閥芯結構被設置為能夠使密封面相對於閥體組件沿靠近或遠離閥口的方向移動，以打開或關閉閥口，以及調節流體流經閥口的流量；位置檢測裝置用於檢測密封面相對於閥口的位置。本方案對流量控制的精度和重複性更高，可以滿足半導體高端製程對於控制精度和重複性的需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:調節閥</p>  
        <p type="p">11:閥體組件</p>  
        <p type="p">111:閥體</p>  
        <p type="p">112:閥座</p>  
        <p type="p">112a:第一表面</p>  
        <p type="p">112b:閥座進流通道</p>  
        <p type="p">112c:閥座出流通道</p>  
        <p type="p">113:閥口</p>  
        <p type="p">114a:進流通道</p>  
        <p type="p">114b:出流通道</p>  
        <p type="p">12:閥芯組件</p>  
        <p type="p">121:閥芯安裝件</p>  
        <p type="p">122:閥芯結構</p>  
        <p type="p">122a:閥芯杆</p>  
        <p type="p">122b:彈性件</p>  
        <p type="p">122c:貫通空間</p>  
        <p type="p">13:位置檢測裝置</p>  
        <p type="p">131:固定件</p>  
        <p type="p">131c:避讓部</p>  
        <p type="p">132:移動件</p>  
        <p type="p">134:容置空間</p>  
        <p type="p">d0:初始距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1396" publication-number="202610621"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610621.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610621</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>苯並咪唑衍生物及其用途</chinese-title>  
        <english-title>BENZIMIDAZOLE DERIVATIVE AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/416</main-classification>  
        <further-classification edition="200601120251201B">A61K31/4025</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4192</further-classification>  
        <further-classification edition="200601120251201B">A61K31/357</further-classification>  
        <further-classification edition="200601120251201B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商石藥集團中奇製藥技術（石家莊）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CSPC ZHONGQI PHARMACEUTICAL TECHNOLOGY (SHIJIAZHUANG) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫曉偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, XIAO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊玉曉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU-XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAO-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊青山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, QING-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖琳琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, LIN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種式(I)所示的苯並咪唑衍生物或其互變異構物、立體異構物、氘代物或其藥學上可接受的鹽及其用途，該衍生物具有更加利於成藥的物理性質（如更高的溶解度）以及更加優異的藥代動力學性質。 &lt;br/&gt;&lt;img align="absmiddle" height="290px" width="350px" file="ed10380.JPG" alt="ed10380.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;b&gt;  &lt;/b&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a benzimidazole derivative represented by Formula (I), or a tautomer, stereoisomer, deuterated compound, pharmaceutically acceptable salt or use thereof. The derivative exhibits physical properties more conducive to drug development (such as higher solubility) and superior pharmacokinetic properties.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1397" publication-number="202612230"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612230.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612230</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125670</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具常通電晶體之電力開關</chinese-title>  
        <english-title>POWER SWITCH WITH NORMALLY ON TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H02M1/08</main-classification>  
        <further-classification edition="200701120251103B">H02M1/32</further-classification>  
        <further-classification edition="202501120251103B">H10D30/47</further-classification>  
        <further-classification edition="202501120251103B">H10D30/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商ＶｉｓＩＣ科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VISIC TECHNOLOGIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏皮羅　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAPIRO, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班亞科夫　什穆爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEN-YAAKOV, SHMUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾和　迪米崔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVO, DMITRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維塔克　格雷柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VETAKH, GLEB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華格納　沙哈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAGNER, SHAHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電力開關，其包含：一疊接，其具有在一疊接節點處與一常斷電晶體串聯連接之一常通電晶體；一安全開關，其介於該常通電晶體之一閘極與對該疊接及該開關共用之一第一接地之間；以及一控制器，其包含：一控制器電力供應器，其具有連接至該疊接節點之一電力供應器輸出，該控制器電力供應器於此輸出處提供相對於一第二接地之一電壓，該第二接地相對於該第一接地浮動；一第一控制器輸出，其係連接至該常通電晶體之該閘極，該控制器於此處產生相對於該第二接地之一第一電壓；其中該控制器電力供應器係連接至該安全開關，並且藉由該控制器電力供應器提供之電壓係耦合至該安全開關並進行操作以使該安全開關維持斷開且非導通，以及在沒有該電壓的情況下，該安全開關係切換為接通並且導通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power switch comprising: a cascode having a normally ON transistor connected in series with a normally OFF transistor at a cascode node; a safety switch between a gate of the normally ON transistor and a first ground common to the cascode and the switch; and a controller comprising: a controller power supply having a power supply output connected to the cascode node at which output the controller power supply provides a voltage relative to a second ground that is floating relative to the first ground; a first controller output connected to the gate of the normally ON transistor at which the controller generates a first voltage relative to the second ground; wherein the controller power supply is connected to the safety switch and voltage provided by the controller power supply is coupled to and operates to maintain the safety switch OFF and nonconducting and in the absence of the voltage the safety switch is turned ON and conducting.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:疊接</p>  
        <p type="p">31:常通電晶體；電晶體</p>  
        <p type="p">32:常斷電晶體；電晶體</p>  
        <p type="p">40:電阻器；負載</p>  
        <p type="p">41:端子</p>  
        <p type="p">42:端子</p>  
        <p type="p">60:控制器</p>  
        <p type="p">61:輸出</p>  
        <p type="p">62:直流隔離器；隔離型閘極驅動器；閘極驅動器</p>  
        <p type="p">70:閘極驅動器</p>  
        <p type="p">71:輸出</p>  
        <p type="p">72:輸入</p>  
        <p type="p">75:電壓脈衝；開關控制脈衝</p>  
        <p type="p">76:輸出脈衝；脈衝；電壓脈衝；閘極驅動器輸出脈衝；閘極驅動器脈衝</p>  
        <p type="p">362:比較器</p>  
        <p type="p">366:輸出</p>  
        <p type="p">720:D&lt;sup&gt;3&lt;/sup&gt;GaN</p>  
        <p type="p">750:安全開關；開關</p>  
        <p type="p">751:電晶體</p>  
        <p type="p">752:電晶體</p>  
        <p type="p">754:直流隔離器</p>  
        <p type="p">756:安全開關節點；節點</p>  
        <p type="p">757:文件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1398" publication-number="202611295"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611295.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611295</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125684</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表現ＩＬ－１０及嵌合抗原受體之ＣＤ４＋Ｔ細胞及其用途</chinese-title>  
        <english-title>CD4+ T CELLS EXPRESSING IL-10 AND CHIMERIC ANTIGEN RECEPTORS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C12N15/85</main-classification>  
        <further-classification edition="200601120251201B">C12N15/63</further-classification>  
        <further-classification edition="200601120251201B">C12N15/24</further-classification>  
        <further-classification edition="200601120251201B">A61K31/7088</further-classification>  
        <further-classification edition="200601120251201B">A61K38/20</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification>  
        <further-classification edition="200601120251201B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＴＲ1Ｘ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TR1X, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾卡羅洛　瑪麗亞　拉吉安諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RONCAROLO, MARIA GRAZIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德　弗瑞斯　珍　愛柏革</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE VRIES, JAN EGBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寶利雅德　澤維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PALIARD, XAVIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>休姆斯　戴爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUMES, DARYL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福萊柏恩　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREEBORN, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供藉由對CD4&lt;sup&gt;+&lt;/sup&gt; T細胞進行基因修飾以表現IL-10及嵌合抗原受體而產生的CD4&lt;sup&gt;IL&lt;/sup&gt;&lt;sup&gt;-&lt;/sup&gt;&lt;sup&gt;10&lt;/sup&gt;&lt;sup&gt;/&lt;/sup&gt;&lt;sup&gt;CAR&lt;/sup&gt;細胞群(自體或同種異體單供體及同種異體多供體)。另外提供產生CD4&lt;sup&gt;IL&lt;/sup&gt;&lt;sup&gt;-&lt;/sup&gt;&lt;sup&gt;10&lt;/sup&gt;&lt;sup&gt;/&lt;/sup&gt;&lt;sup&gt;CAR&lt;/sup&gt;細胞的方法及使用CD4&lt;sup&gt;IL&lt;/sup&gt;&lt;sup&gt;-&lt;/sup&gt;&lt;sup&gt;10&lt;/sup&gt;&lt;sup&gt;/&lt;/sup&gt;&lt;sup&gt;CAR&lt;/sup&gt;細胞達成免疫耐受、治療GvHD、細胞及器官移植、癌症以及自體免疫及發炎性病症的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a population of CD4&lt;sup&gt;IL-10/CAR&lt;/sup&gt; cells (autologous or allogeneic single-donor and allogeneic polydonor) generated by genetically modifying CD4&lt;sup&gt;+&lt;/sup&gt; T cells to express IL-10 and a chimeric antigen receptor. Further provided are methods of generating the CD4&lt;sup&gt;IL-10/CAR&lt;/sup&gt; cells and methods of using the CD4&lt;sup&gt;IL-10/CAR&lt;/sup&gt; cells for immune tolerization, treating GvHD, cell and organ transplantation, cancer, and autoimmune and inflammatory disorders.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1399" publication-number="202611709"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611709.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611709</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>系統單晶片、虛擬化系統及其操作方法</chinese-title>  
        <english-title>SYSTEM-ON-CHIP, VIRTUALIZED SYSTEM, AND OPERATING METHOD OF THE VIRTUALIZED SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F9/455</main-classification>  
        <further-classification edition="201601120251201B">G06F12/1081</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金正泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUNGTAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴根榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, KEUNYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴東珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, DONGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安泰仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AN, TAEIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹富永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, BUYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及系統單晶片、虛擬化系統以及虛擬化系統的操作方法。系統單晶片包括經組態以對記憶體執行直接記憶體存取操作的輸入輸出裝置、經組態以搜尋分別對應複數個虛擬機器的複數個虛擬識別之間的映射資訊，並基於搜尋的結果來阻擋直接記憶體存取操作的存取控制裝置，以及經組態以向存取控制裝置提供由直接記憶體存取操作存取的目標位址以及對應驅動輸入輸出裝置的驅動虛擬機器的目標虛擬識別的主機處理器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a system-on-chip, a virtualized system and an operating method of the virtualized system. The system-on-chip includes an input output (IO) device configured to perform a direct memory access operation on a memory, an access control device configured to search for mapping information between a plurality of virtual identifiers respectively corresponding to a plurality of virtual machines, and block the direct memory access operation based on the search result, and a host processor configured to provide, to the access control device, a target address accessed by the direct memory access operation and a target virtual identifier corresponding to a driving virtual machine driving the IO device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子裝置</p>  
        <p type="p">100:系統單晶片(SoC)</p>  
        <p type="p">110:主機處理器</p>  
        <p type="p">120:輸入/輸出(IO)裝置</p>  
        <p type="p">130:記憶體控制器</p>  
        <p type="p">140:虛擬識別(VID)產生器</p>  
        <p type="p">150:存取控制裝置</p>  
        <p type="p">200:記憶體</p>  
        <p type="p">VM1、VMn:虛擬機器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1400" publication-number="202612249"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612249.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612249</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125699</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測方法及檢測裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">H02P6/06</main-classification>  
        <further-classification edition="201601120250901B">H02P29/024</further-classification>  
        <further-classification edition="202001120250901B">G01R31/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科儀器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC INSTRUMENTS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井誠也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, SEIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於抑制誤檢測的發生，並且迅速地檢測被伺服控制的馬達的失控。本發明設置組合判定邏輯，所述組合判定邏輯對於從指令值及關於馬達所獲得的狀態值選擇的多個項目分別求出二值的指標或三值的指標，並基於指標的組合判定馬達的失控的有無。組合判定邏輯例如包括符號不一致判定器（41～44）、AND電路（45～47）、OR電路（48）、及選擇器（51、52）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">41~44:符號不一致判定器</p>  
        <p type="p">45~47:AND電路</p>  
        <p type="p">48:OR電路</p>  
        <p type="p">49、50:接通延遲電路</p>  
        <p type="p">51、52:選擇器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1401" publication-number="202612253"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612253.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612253</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125700</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測方法及檢測裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250901B">H02P29/024</main-classification>  
        <further-classification edition="200601120250901B">H02P6/06</further-classification>  
        <further-classification edition="201601120250901B">H02P6/16</further-classification>  
        <further-classification edition="202001120250901B">G01R31/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科儀器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC INSTRUMENTS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井誠也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, SEIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於抑制誤檢測的發生，並且迅速地檢測將對馬達進行伺服控制的馬達控制裝置與所述馬達連接的動力線的斷線。本發明設置組合判定邏輯，所述組合判定邏輯對於從指令值及關於馬達所獲得的狀態值選擇的多個項目分別求出二值的指標或三值的指標，並基於指標的組合對動力線中斷線的有無進行判定。組合判定邏輯例如包括範圍內比較器（41）、選擇器（42～46）、AND電路（47～50）、符號不一致判定器（51、52）、及OR電路（53、54）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">41:範圍內比較器</p>  
        <p type="p">42~46:選擇器</p>  
        <p type="p">47~50:AND電路</p>  
        <p type="p">51、52:符號不一致判定器</p>  
        <p type="p">53、54:OR電路</p>  
        <p type="p">55:接通延遲電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1402" publication-number="202610906"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610906.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610906</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125727</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">B65D1/02</main-classification>  
        <further-classification edition="200601120251202B">B65D1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>若林裕樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKABAYASHI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溝上彩香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZOKAMI, AYAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種抑制突出區域中之變形產生之容器。 &lt;br/&gt;本發明係一種容器，其具備主體部，該主體部具有筒形狀且形成內容物之收容空間，上述主體部具有相互對向之2個主面、及位於上述2個主面之間且相互對向之2個側面，上述2個主面中之至少1個主面具有沿著與上述主體部之周向交叉之方向之2個第1交叉方向肋，上述2個第1交叉方向肋形成於上述主體部之周向上隔著上述主面之中心位置之位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:容器</p>  
        <p type="p">20:主體部</p>  
        <p type="p">24:底部</p>  
        <p type="p">26:肩部</p>  
        <p type="p">28:口頸部</p>  
        <p type="p">210:主面</p>  
        <p type="p">212,214:縱向肋</p>  
        <p type="p">216:周向肋</p>  
        <p type="p">220:側面</p>  
        <p type="p">242:底部肋</p>  
        <p type="p">D1,D2,D4,D6:長度</p>  
        <p type="p">D3:距離</p>  
        <p type="p">L:中心軸</p>  
        <p type="p">O:中心位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1403" publication-number="202612006"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612006.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612006</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125728</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>監測保持環磨損</chinese-title>  
        <english-title>MONITORING RETAINING RING WEAR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01L21/304</main-classification>  
        <further-classification edition="201201120251205B">B24B37/005</further-classification>  
        <further-classification edition="201201120251205B">B24B37/27</further-classification>  
        <further-classification edition="200601120251205B">H01L21/677</further-classification>  
        <further-classification edition="200601120251205B">B24B49/10</further-classification>  
        <further-classification edition="200601120251205B">G01B21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤川孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKAWA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　正勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JEONGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　永豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAU, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露了一種用於在處理系統中移送基板的裝載罩設備，該裝載罩包含：底座組件，該底座組件具有基板支撐，該基板支撐可能包含多個引導銷和感測器銷，其中感測器銷可壓入基板支撐；致動器，該致動器被配置為將底座組件移動到第一位置，該第一位置使得感測器銷與承載頭的保持環的第一底表面接觸；感測器，該感測器被配置為基於感測器銷所行進的距離來產生訊號；以及控制器，該控制器被配置為自感測器接收訊號，並且基於該訊號來產生保持環厚度值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is a load cup apparatus for transferring a substrate in a processing system, the load cup including a pedestal assembly having a substrate support, the substrate support may include multiple guide pins and a sensor pin, where the sensor pin is depressible into the substrate support; an actuator configured to move the pedestal assembly into a first position which brings the sensor pin into contact with a first bottom surface of a retaining ring of a carrier head; a sensor configured to generate a signal based on a distance traveled by the sensor pin; and a controller configured to receive the signal from the sensor and to generate a retaining ring thickness value based on the signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">110:裝載罩</p>  
        <p type="p">128:底座組件</p>  
        <p type="p">130:罩</p>  
        <p type="p">133:致動器</p>  
        <p type="p">136:軸</p>  
        <p type="p">146:凹槽</p>  
        <p type="p">150:保持環</p>  
        <p type="p">198:凸緣</p>  
        <p type="p">202:上底座</p>  
        <p type="p">204:頂表面</p>  
        <p type="p">206:邊緣</p>  
        <p type="p">212:引導銷</p>  
        <p type="p">214:內壁</p>  
        <p type="p">215:側表面</p>  
        <p type="p">216:頂表面</p>  
        <p type="p">220:底表面</p>  
        <p type="p">222:頂表面</p>  
        <p type="p">224:下部分</p>  
        <p type="p">226:上部分</p>  
        <p type="p">230:傾斜部分</p>  
        <p type="p">231:側表面</p>  
        <p type="p">232:下表面</p>  
        <p type="p">235:側表面</p>  
        <p type="p">236:平坦銷</p>  
        <p type="p">237:側表面</p>  
        <p type="p">238:感測器銷</p>  
        <p type="p">239:最上表面</p>  
        <p type="p">240:距離感測器</p>  
        <p type="p">242:彈簧</p>  
        <p type="p">A:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1404" publication-number="202610821"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610821.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610821</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125739</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包覆板、氣密密封用蓋材及小型零組件收容封裝</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B15/01</main-classification>  
        <further-classification edition="201901120251201B">B32B7/02</further-classification>  
        <further-classification edition="201901120251201B">B32B7/027</further-classification>  
        <further-classification edition="200601120251201B">H01L23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商博邁立鋮股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROTERIAL, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田圭一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, KEIICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加治優太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJI, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川堯生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, TAKAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供下述包覆板、及使用該包覆板的氣密密封用蓋材。該包覆板係具備有：第1金屬層，係由含Ni與Cr的Fe合金構成，熱膨脹率為5.0×10&lt;sup&gt;-6&lt;/sup&gt;/K以上且15.0×10&lt;sup&gt;-6&lt;/sup&gt;/K以下、且厚度為TB；第2金屬層，係由Cu或Cu合金構成，熱膨脹率為16.0×10&lt;sup&gt;-6&lt;/sup&gt;/K以上且21.0×10&lt;sup&gt;-6&lt;/sup&gt;/K以下、熱傳導率為100W/(m・K)以上且400W/(m・K)以下、厚度為TC；及第3金屬層，係由含Ag與Cu的Ag合金構成；在第1金屬層與第2金屬層之間、及第2金屬層與第3金屬層之間設有擴散層，TB係0.015mm以上且0.080mm以下，TC係0.005mm以上且0.020mm以下，TB/TC係2.0以上且12.0以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:包覆板</p>  
        <p type="p">11:第1金屬層</p>  
        <p type="p">12:第2金屬層</p>  
        <p type="p">13:第3金屬層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1405" publication-number="202611690"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611690.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611690</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125741</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於多處理器區塊之ＮＡＮＤ記憶體存取介面</chinese-title>  
        <english-title>MULTI-PROCESSOR BLOCK BASED NAND MEMORY ACCESS INTERFACES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F3/06</main-classification>  
        <further-classification edition="200601120251201B">G06F13/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛思開海力士存儲器產品解決方案公司(亦以思得名稱營業)</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX NAND PRODUCT SOLUTIONS CORP.(DBA SOLIDIGM)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾坎塔拉　席爾瓦　科斯塔　愛馬仕亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALCANTARA SILVA COSTA, HERMES ALEXANDRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉斯　史蒂文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝祥揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案係針對經由一記憶體裝置內之內部介面處理計算儲存處理器與非揮發性記憶體之間的資料。該記憶體裝置具有：一晶片，其包括一第一處理器及一第二處理器；以及一非揮發性記憶體，其儲存一第一資料區塊集合。一種用於處理資料之方法包括藉由該第二處理器產生對於該第一資料區塊集合之一第一請求。該方法亦包括將該第一請求自該第二處理器發送至該第一處理器。該方法進一步包括回應於該第一請求，藉由該第一處理器自該非揮發性記憶體擷取該第一資料區塊集合。該方法進一步包括藉由該第一處理器將該第一資料區塊集合提供至該第二處理器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application is directed to processing data between a computational storage processor and a non-volatile memory via an internal interface within a memory device. The memory device has a chip, including a first processor and a second processor, and a non-volatile memory storing a first data block set. A method for processing data includes generating a first request for the first data block set by the second processor. The method also includes sending the first request from the second processor to the first processor. The method further includes in response to the first request, extracting the first data block set from the non-volatile memory by the first processor. The method further includes providing, by the first processor, the first data block set to the second processor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">220:主機裝置</p>  
        <p type="p">240:記憶體裝置/計算儲存裝置</p>  
        <p type="p">304:揮發性記憶體</p>  
        <p type="p">306:非揮發性記憶體</p>  
        <p type="p">500:電子系統</p>  
        <p type="p">502:系統單晶片</p>  
        <p type="p">504:第一處理器</p>  
        <p type="p">506:第二處理器</p>  
        <p type="p">508:裝置作業系統</p>  
        <p type="p">510:區塊裝置驅動器</p>  
        <p type="p">512:第一請求</p>  
        <p type="p">514:第一資料區塊集合</p>  
        <p type="p">516:第二請求</p>  
        <p type="p">518:第二資料區塊集合</p>  
        <p type="p">519:寫入結果</p>  
        <p type="p">522:裝置PCIe緩衝器</p>  
        <p type="p">524:嵌入式緩衝器</p>  
        <p type="p">540:處理器-處理器介面</p>  
        <p type="p">560:主機區塊驅動器</p>  
        <p type="p">570:主機記憶體緩衝器</p>  
        <p type="p">572:主機PCIe緩衝器</p>  
        <p type="p">580:PCIe通信介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1406" publication-number="202611743"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611743.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611743</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>與不同組態相關聯的介接模組</chinese-title>  
        <english-title>INTERFACING MODULES ASSOCIATED WITH DIFFERENT CONFIGURATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G06F13/42</main-classification>  
        <further-classification edition="200601120251103B">G06F13/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多迪　拉文德拉納特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DODDI, RAVINDRANATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑德拉拉曼　拉瑪查蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNDARARAMAN, RAMACHARAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之各種態樣大致上係關於積體電路。在一些態樣中，一種裝置可包括複數個模組。該裝置可在一初始化參數交換期間，經由該複數個模組中的一模組，指示該模組是否支援一彈性模組組態，該彈性模組組態使該模組能夠介接與和該模組不同的組態相關聯的另一模組。經由一多模組實體邏輯並基於該初始化參數交換，該裝置可在該複數個模組中的一第一模組集合與該複數個模組中的一第二模組集合之間組態一介接，其中該介接係至少部分地基於與該第一模組集合相關聯的一第一組態、及不同於該第一組態且與該第二模組集合相關聯的一第二組態來組態。描述多種其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various aspects of the present disclosure generally relate to integrated circuits. In some aspects, a device may include a plurality of modules. The device may indicate, via a module of the plurality of modules and during an initialization parameter exchange, whether the module supports a flexible module configuration that enables the module to be interfaced with another module associated with a different configuration than the module. The device may configure, via a multi-module physical logic and based on the initialization parameter exchange, an interfacing between a first set of modules, of the plurality of modules, and a second set of modules, of the plurality of modules, wherein the interfacing is configured based at least in part on a first configuration associated with the first set of modules and a second configuration associated with the second set of modules that is different from the first configuration. Numerous other aspects are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">502:裝置</p>  
        <p type="p">504:模組</p>  
        <p type="p">506:多模組邏輯</p>  
        <p type="p">508:暫存器</p>  
        <p type="p">510,512:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1407" publication-number="202612016"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612016.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612016</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125761</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化矽的保形選擇性蝕刻</chinese-title>  
        <english-title>CONFORMAL SELECTIVE ETCHING OF SILICON OXIDE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/306</main-classification>  
        <further-classification edition="200601120251201B">H01L21/311</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯羅立克　米克海爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOROLIK, MIKHAIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德維勒茲　扎卡里Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEVEREAUX, ZACHARY J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼斯里　湯瑪士喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNISLEY, THOMAS JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恩曼　莉莎Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENMAN, LISA J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">示範性的半導體處理方法可能包含提供催化劑前驅物至半導體處理腔室的處理區域。基板可能安置於處理區域內。該基板可能包含含矽和氧材料以及一或多個含矽材料。這些方法可能包含將基板與催化劑前驅物接觸。該接觸可能在含矽和氧材料及/或一或多個含矽材料上吸附催化劑前驅物。這些方法可能包含提供蝕刻劑前驅物至處理區域。這些方法可能包含將基板與蝕刻劑前驅物接觸。該接觸可能選擇性地移除含矽和氧材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Exemplary semiconductor processing methods may include providing a catalyst precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed within the processing region. The substrate may include a silicon-and-oxygen-containing material and one or more silicon-containing materials. The methods may include contacting the substrate with the catalyst precursor. The contacting may adsorb the catalyst precursor on the silicon-and-oxygen-containing material and/or the one or more silicon-containing materials. The methods may include providing an etchant precursor to the processing region. The methods may include contacting the substrate with the etchant precursor. The contacting may selectively remove the silicon-and-oxygen-containing material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">505:基板</p>  
        <p type="p">510:含矽和氧材料</p>  
        <p type="p">515:含矽和氮材料</p>  
        <p type="p">520:含矽和鍺材料</p>  
        <p type="p">540:催化部分</p>  
        <p type="p">545:催化部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1408" publication-number="202612375"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612375.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612375</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125781</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於功率放大器失真補償之增強型功率餘量報告</chinese-title>  
        <english-title>ENHANCED POWER HEADROOM REPORTING BASED ON POWER AMPLIFIER DISTORTION COMPENSATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W52/36</main-classification>  
        <further-classification edition="200901120251201B">H04W52/14</further-classification>  
        <further-classification edition="200601120251201B">H04B1/04</further-classification>  
        <further-classification edition="200601120251201B">H04L25/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商ＬＭ艾瑞克生(ＰＵＢＬ)電話公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布蘭克許普　玉菲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLANKENSHIP, YUFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法哈迪　哈梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARHADI, HAMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞爾　安德斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REIAL, ANDRES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡賽尼　阿里　艾爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUSSEINI, ALI EL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉怡岑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施例包含用於經組態以產生至一接收器之傳輸的一傳輸器之方法。此等方法包含判定自一第一傳輸之一最大容許輸出功率的一回退，該第一傳輸待由一功率放大器(PA)放大。該所判定之回退與該第一傳輸中歸因於該PA之非線性之一失真量反相關。此等方法包含基於對該失真之補償是否在該接收器及/或該傳輸器處可用而選擇性地將該所判定之回退減小一第一量。此等方法包含將以下資訊之一或多者發送至該接收器：該所判定之回退、該所判定之回退是否被減小之一指示，及該所判定之回退被減小之該第一量。其他實施例包含用於一接收器之互補方法，以及經組態以執行此等方法之傳輸器及接收器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments include methods for a transmitter configured to generate transmissions to a receiver. Such methods include determining a backoff from a maximum allowed output power for a first transmission, which is to be amplified by a power amplifier (PA). The determined backoff is inversely related to an amount of distortion in the first transmission due to non-linearity of the PA. Such methods include selectively reducing the determined backoff by a first amount, based on whether compensation for the distortion is available at the receiver and/or at the transmitter. Such methods include sending one or more of the following information to the receiver: the determined backoff, an indication of whether the determined backoff was reduced, and the first amount by which the determined backoff was reduced. Other embodiments include complementary methods for a receiver, as well as transmitters and receivers configured to perform such methods.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1410:方塊</p>  
        <p type="p">1420:方塊</p>  
        <p type="p">1430:方塊</p>  
        <p type="p">1440:方塊</p>  
        <p type="p">1450:方塊</p>  
        <p type="p">1451:操作</p>  
        <p type="p">1452:操作</p>  
        <p type="p">1460:方塊</p>  
        <p type="p">1470:方塊</p>  
        <p type="p">1471:子方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1409" publication-number="202611188"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611188.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611188</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蓄電元件結構體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">C08J5/02</main-classification>  
        <further-classification edition="202101120251212B">H01M50/383</further-classification>  
        <further-classification edition="201401120251212B">H01M10/658</further-classification>  
        <further-classification edition="201301120251212B">H01G11/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>八木稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGI, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的蓄電元件結構體包含蓄電元件及具有空隙地包圍該蓄電元件的殼體，具有在蓄電元件與殼體的空隙中配置有熱解聚性聚合物的發泡成形體的結構。若為此種蓄電元件結構體，則能夠減少在蓄電元件、特別是積層有多個蓄電元件的蓄電元件堆疊體破損或過充電等異常時起火的風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1410" publication-number="202611371"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611371.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611371</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125821</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>挖掘工具及使用挖掘工具安裝地基之方法</chinese-title>  
        <english-title>EXCAVATION TOOL AND METHOD OF INSTALLING A FOUNDATION USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">E02D7/24</main-classification>  
        <further-classification edition="200601120251210B">E02D7/28</further-classification>  
        <further-classification edition="200601120251210B">B05B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商沃旭能源公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORSTED WIND POWER A/S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏普　詹斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHUPP, JENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於在插入方向(11)上將地基(100)安裝到土壤(200)中時使用的挖掘工具(10)。挖掘工具包括主體(12)、設置在主體(12)上的接合表面(18)以及設置在主體上的複數個噴嘴(38)，接合表面(18)用於與地基(100)可釋放地接合，以沿插入方向(11)將主體(12)打入土壤(200)中，複數個噴嘴(38)用於噴射流體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Excavation tool (10) for use during installation of a foundation (100) into soil (200) in an insertion direction (11). The excavation tool comprises a body (12), an engagement surface (18) provided on the body (12) for releasable engagement with the foundation (100) for driving the body (12) into the soil (200) in the insertion direction (11); and a plurality of nozzles (38) provided on the body for jetting a fluid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:挖掘工具</p>  
        <p type="p">11:插入方向</p>  
        <p type="p">12:主體</p>  
        <p type="p">14:中心孔</p>  
        <p type="p">16:對準結構</p>  
        <p type="p">18:頂表面</p>  
        <p type="p">20:外側</p>  
        <p type="p">22:內側</p>  
        <p type="p">24:閂鎖</p>  
        <p type="p">26:頂邊緣</p>  
        <p type="p">28:歧管</p>  
        <p type="p">30:流體進料管</p>  
        <p type="p">32:入口端</p>  
        <p type="p">34:內圓周</p>  
        <p type="p">36:控制器</p>  
        <p type="p">38:噴嘴</p>  
        <p type="p">40:底表面</p>  
        <p type="p">42:激活器</p>  
        <p type="p">44:連接器</p>  
        <p type="p">100:地基</p>  
        <p type="p">102:中空管狀主體</p>  
        <p type="p">104:外側面</p>  
        <p type="p">106:內側面</p>  
        <p type="p">108:內部空腔</p>  
        <p type="p">110:開口</p>  
        <p type="p">112:遠端</p>  
        <p type="p">114:樁尖</p>  
        <p type="p">116:近端</p>  
        <p type="p">200:土壤</p>  
        <p type="p">202:海床</p>  
        <p type="p">204:通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1411" publication-number="202611253"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611253.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611253</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125832</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著劑組成物、以及保護片材</chinese-title>  
        <english-title>ADHESIVE COMPOSITION, AND PROTECTIVE SHEET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C09J133/10</main-classification>  
        <further-classification edition="200601120251210B">C08F2/50</further-classification>  
        <further-classification edition="201801120251210B">C09J7/20</further-classification>  
        <further-classification edition="201801120251210B">C09J7/40</further-classification>  
        <further-classification edition="200601120251210B">H01L21/461</further-classification>  
        <further-classification edition="201901120251210B">B32B7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肥後友紀子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGO, YUKIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宍戸雄一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHISHIDO, YUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種黏著劑組成物等，其係用以形成在製造電子零件裝置時保護基板之保護對象面之黏著性的保護層，並含有：藉由活性能量射線之照射而產生酸之化合物；及於分子中具有因前述酸而水解並產生親水基之酯基之聚合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is, for example, an adhesive composition for forming an adhesive protective layer that protects a protection target surface of a board when an electronic component apparatus is manufactured. The adhesive composition includes: a compound that produces an acid through irradiation of an active energy ray; and a polymer having, in a molecule, an ester group hydrolyzed by the acid to produce a hydrophilic group.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:保護片材</p>  
        <p type="p">11:保護層</p>  
        <p type="p">15:離型紙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1412" publication-number="202610899"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610899.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610899</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125835</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>底部成形站、形成折疊底部的方法、及用於製造織物袋的裝置</chinese-title>  
        <english-title>BOTTOM FORMING STATION, METHOD FOR FORMING A FOLD-OVER BOTTOM, AND DEVICE FOR MANUFACTURING FABRIC BAGS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">B65B43/10</main-classification>  
        <further-classification edition="201701120251210B">B31B70/36</further-classification>  
        <further-classification edition="200601120251210B">B65B47/06</further-classification>  
        <further-classification edition="200601120251210B">B65B51/10</further-classification>  
        <further-classification edition="201701120251210B">B31B70/64</further-classification>  
        <further-classification edition="200601120251210B">B65D33/02</further-classification>  
        <further-classification edition="201701320251210B">B31B155/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商史太林格有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STARLINGER &amp; CO GESELLSCHAFT M.B.H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦爾納　克里斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALLNER, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種底部成形站（16）和底部成形方法，用於在織物筒狀段（11）上形成折疊底部，較佳為捏合底部，織物筒狀段（11）由塑膠帶的帶狀織物製成，較佳為實質由半結晶熱塑性塑膠製成，較佳為由聚烯烴製成，例如聚丙烯或聚乙烯，或由聚酯製成，例如聚對苯二甲酸乙二醇酯或聚乳酸，包括：輸送裝置（20），用於沿輸送平面在輸送方向（21）上輸送所述織物筒狀段（11），折疊裝置（22），用於將所述織物筒狀段（11）的端部折疊到所述織物筒狀段（11）的織物筒壁（11A）上，其中，折疊裝置（22）包括壓緊單元（26），所述壓緊單元具有至少兩個在輸送方向（21）上連續的壓緊部件（27），這些壓緊部件被設計成在輸送方向（21）上將織物筒狀段（11）的端部逐漸靠近織物筒壁（11A），其中，在輸送方向（21）上各個連續的壓緊部件（27）之間形成凹槽（28），用於容納織物筒狀段（11）端部的材料堆積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bottom forming station (16) and method for forming a fold-over bottom, preferably a pinch bottom, on a fabric tube section (11) with a banded fabric of plastic bands, preferably substantially of semi-crystalline thermoplastic, preferably of polyolefin, for example polypropylene (PP) or polyethylene (PE), or of polyester, for example polyethylene terephthalate (PET) or polylactide (PLA), comprising: a conveying device (20) for conveying the fabric tube sec-tion (11) in a conveying direction (21) along a conveying plane, a folding device (22) for folding an end portion of the fabric tube section (11) onto a fabric tube wall (11A) of the fabric tube section (11), wherein the folding device (22) comprises a holding-down unit (26) with at least two successive holding-down parts (27) in the conveying direction (21) which are designed to increasingly bring the end portion of the fabric tube section (11) closer to the fabric tube wall (11A) in the conveying direction (21), wherein a recess (28) is formed between each of the successive holding-down parts (27) in the conveying direction (21) for receiving a material accumulation of the end portion of the fabric tube section (11).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11A:第一織物筒壁</p>  
        <p type="p">11B:第二織物筒壁</p>  
        <p type="p">11C:連接段</p>  
        <p type="p">14A:輸送方向</p>  
        <p type="p">16:底部成形站</p>  
        <p type="p">20:輸送裝置</p>  
        <p type="p">21:輸送方向</p>  
        <p type="p">22:折疊裝置</p>  
        <p type="p">23:熱氣噴嘴</p>  
        <p type="p">24:導引裝置</p>  
        <p type="p">25:壓合裝置</p>  
        <p type="p">26:壓緊單元</p>  
        <p type="p">27:壓緊部件</p>  
        <p type="p">27A:壓緊邊</p>  
        <p type="p">27B:共同後壁</p>  
        <p type="p">27':最後一個壓緊部件</p>  
        <p type="p">28:凹槽</p>  
        <p type="p">29:立起單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1413" publication-number="202611525"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611525.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611525</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125839</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測試應用的整合式加熱器及冷板</chinese-title>  
        <english-title>INTEGRATED HEATER AND COLD PLATE FOR TEST APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01R1/44</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商永科新加坡有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AEM SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克伯尼　薩摩爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABBANI, SAMER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓊斯　湯瑪士　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONES, THOMAS P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴恩斯庫　索霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DINESCU, SORIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種包括一整合式加熱器及冷板之熱控制系統。該整合式加熱器及冷板包括用於將熱自該加熱器傳遞至該冷板之一熱傳遞幾何結構。該熱傳遞幾何結構可包括可構形用於改變該加熱器與該冷板之間的熱傳遞速率之複數個鰭片。例如，鰭片之數目、鰭片之間的間距、該冷板之基座之大小、透過該等鰭片之流體流量等可經構形以增加或降低熱傳遞速率。在一些實例中，該熱傳遞幾何結構可直接沉積於該冷板或加熱器之該基座上或永久地附接至該冷板或加熱器之該基座。在一些實例中，該加熱器可直接接觸該熱傳遞幾何結構。該熱控制系統可不包含該加熱器與該熱傳遞幾何結構之間的空氣或一熱介面材料(TIM)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thermal control system comprising an integrated heater and cold plate is disclosed. The integrated heater and cold plate comprises a heat transfer geometry for transferring heat from the heater to the cold plate. The heat transfer geometry may comprise a plurality of fins configurable for changing the heat transfer rate between the heater and the cold plate. For example, the number of fins, spacing between fins, size of the base of the cold plate, fluid flow through the fins, etc. may be configured to increase or decrease the heat transfer rate. In some examples, the heat transfer geometry may be deposited directly on or permanently attached to the base of the cold plate or heater. In some examples, the heater may directly contact the heat transfer geometry. The thermal control system may not include air or a thermal interface material (TIM) between the heater and the heat transfer geometry.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:待測裝置(DUT)</p>  
        <p type="p">102:插座</p>  
        <p type="p">104:第一熱介面材料(TIM)</p>  
        <p type="p">105:第二熱介面材料(TIM)</p>  
        <p type="p">106:加熱器</p>  
        <p type="p">108:基座/配接器</p>  
        <p type="p">110:冷板</p>  
        <p type="p">112:入口</p>  
        <p type="p">114:出口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1414" publication-number="202610992"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610992.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610992</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物及硬化物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C69/734</main-classification>  
        <further-classification edition="200601120251201B">C07C317/22</further-classification>  
        <further-classification edition="200601120251201B">C07C323/11</further-classification>  
        <further-classification edition="200601120251201B">C07C323/19</further-classification>  
        <further-classification edition="200601120251201B">C07C323/20</further-classification>  
        <further-classification edition="200601120251201B">C07D251/24</further-classification>  
        <further-classification edition="200601120251201B">C07D251/30</further-classification>  
        <further-classification edition="200601120251201B">C07D333/50</further-classification>  
        <further-classification edition="200601120251201B">C08F16/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本觸媒股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON SHOKUBAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上原貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEHARA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橘敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TACHIBANA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水亮佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種折射率高之化合物。本發明係關於一種下述通式（1）所表示之化合物。（式（1）中，R&lt;sup&gt;1&lt;/sup&gt;表示結構中含有碳數10以上之芳香族環的有機基、包含芳香族雜環之有機基、含有2個以上之苯環直接鍵結或透過碳原子、氧原子、硫原子、－CH－、－C（CH&lt;sub&gt;3&lt;/sub&gt;）&lt;sub&gt;2&lt;/sub&gt;－、－SO－或者－SO&lt;sub&gt;2&lt;/sub&gt;－鍵結之結構的有機基、下述通式（2）所表示之有機基或者下述通式（3）所表示之有機基。Z相同或不同，表示－CR&lt;sup&gt;2&lt;/sup&gt;R&lt;sup&gt;3&lt;/sup&gt;－、－O－、－S－或－NH－。R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;相同或不同，表示氫原子或甲基。n相同或不同，表示0～20之整數。m表示1～3之整數。）（式（2）中，R&lt;sup&gt;21&lt;/sup&gt;表示直接鍵結或伸烷基。R&lt;sup&gt;22&lt;/sup&gt;相同或不同，表示鹵素原子。a表示1～3之整數。）（式（3）中，R&lt;sup&gt;31&lt;/sup&gt;表示不飽和脂肪族烴基。R&lt;sup&gt;32&lt;/sup&gt;相同或不同，表示取代基。b表示0～5之整數。） &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="314px" width="454px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="133px" width="310px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1415" publication-number="202611697"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611697.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611697</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125848</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於數位處理系統的較佳化方法</chinese-title>  
        <english-title>OPTIMIZATION FOR DIGITAL PROCESSING SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F7/50</main-classification>  
        <further-classification edition="200601120251201B">G06F7/38</further-classification>  
        <further-classification edition="201801120251201B">G06F8/41</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商沃達豐集團服務有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VODAFONE GROUP SERVICES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡法雷納　費爾南德斯　加布里埃爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAFFARENA FERNÁNDEZ, GABRIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於降低量化誤差的系統及方法，包含用於具有固定長度二補數二進位表示法的硬體處理系統中，對程式例程進行較佳化的方法，包含：接收用於執行該程式例程的指令序列，其中該指令序列包括一組算術運算，而該組算術運算的輸出超出硬體處理系統的精度；識別指令序列中一個或複數個指令子集配對，其中每個配對的子集具有各自可比較的截斷誤差； 生成一個較佳的程式例程，方法包括：對每個配對中的一個指令子集進行修改，使該指令子集的一個或複數個輸入的符號反轉，並修改指令序列以補償該符號反轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There are provided systems and methods for reducing quantization errors, including method of optimizing a routine for a hardware-based processing system having a fixed length two’s complement binary representation, the method comprising: receiving an instruction sequence arranged to perform the routine, wherein the instruction sequence comprises a set of arithmetic operations, wherein the outputs of the arithmetic operations exceed a precision of the hardware-based processing system; identifying one or more pairs of sub-sets of instructions in the sequence of instructions, the sub-sets of each pair having a respective comparable truncation error; generating an optimized routine by modifying one of the sub-sets of each pair to invert the sign of one or more inputs to said sub-sets, and modifying the instruction sequence to compensate for the said inversion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">410:步驟一</p>  
        <p type="p">420:步驟二</p>  
        <p type="p">430:步驟三</p>  
        <p type="p">432:步驟三之一</p>  
        <p type="p">434:步驟三之二</p>  
        <p type="p">440:步驟四</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1416" publication-number="202611871"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611871.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611871</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多使用者擴展實境</chinese-title>  
        <english-title>MULTI-USER EXTENDED-REALITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251103B">G06T19/00</main-classification>  
        <further-classification edition="201101120251103B">G06T19/20</further-classification>  
        <further-classification edition="200601120251103B">G06F3/01</further-classification>  
        <further-classification edition="200601220251103B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞迪　瓦倫　阿瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REDDY, VARUN AMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿卡拉力南　索尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKKARAKARAN, SONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述用於擴展實境的系統及技術。例如，提供一種用於擴展實境之方法。該方法可包括在一第一XR裝置處獲得一第二XR裝置的一使用者在該第一XR裝置的一環境中的一位置；基於該位置來在該第一XR裝置處演現與該第二XR裝置相關聯的一化身的一表示；及基於該第一XR裝置與該第二XR裝置之間交換的訊息來修改該化身的該表示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and techniques are described herein for extended reality. For instance, a method for extended reality is provided. The method may include obtaining, at a first XR device, a location for a user of a second XR device in an environment of the first XR device; rendering, at the first XR device, a representation of an avatar associated with the second XR device based on the location; and modifying the representation of the avatar based on messages exchanged between the first XR device and the second XR device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:XR系統</p>  
        <p type="p">102:XR裝置</p>  
        <p type="p">108:使用者</p>  
        <p type="p">110:視場</p>  
        <p type="p">112:場景</p>  
        <p type="p">114:物件</p>  
        <p type="p">116:XR內容</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1417" publication-number="202610811"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610811.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610811</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125866</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體、偏光透鏡及眼用配戴具</chinese-title>  
        <english-title>OPTICAL LAMINATE, POLARIZATION LENS AND EYE WEAR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B29D11/00</main-classification>  
        <further-classification edition="200601120251201B">B32B27/20</further-classification>  
        <further-classification edition="200601120251201B">B32B27/30</further-classification>  
        <further-classification edition="200601120251201B">G02B1/08</further-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification>  
        <further-classification edition="200601120251201B">G02C7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本化藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川島孝之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASHIMA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沼陽介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUMA, YOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種光學積層體(100，110)，其具備第一支撐體(10)、第二支撐體(10)，以及在第一支撐體(10)與第二支撐體(10)之間配置的偏光元件(20)。偏光元件(20)係含有1種以上之染料系雙色性色素，其在最大吸收波長(λmax)之雙色比(Rd)為38以上，且光學積層體(100，110)具有43%以上55%以下之能見度校正透射率(Ys)及78%以上85%以下之能見度校正偏光率(Py)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an optical laminate(100,110) comprising a first support 10), a second support(10), and a polarizing element (20) disposed between the first support(10) and the second support(10). The polarizing element contains at least one dye-based dichroic dye with a dichroic ratio (Rd) of 38 or more at maximum absorption wavelength (λmax). Furthermore, the optical laminate (100, 110) has a luminosity-corrected transmittance (Ys) of 43% or more to 55% or less and a luminosity-corrected polarization degree (Py) of 78% or more to 85% or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支撐體(第一支撐體、第二支撐體)</p>  
        <p type="p">20:偏光元件</p>  
        <p type="p">30:接著層</p>  
        <p type="p">40:透鏡基材</p>  
        <p type="p">100:光學積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1418" publication-number="202612369"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612369.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612369</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125883</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偵測多躍U2N中繼中連結故障或降級之方法、架構、裝置及系統</chinese-title>  
        <english-title>METHODS, ARCHITECTURES, APPARATUSES AND SYSTEMS FOR DETECTING LINK FAILURE OR DEGRADATION IN MULTIHOP U2N RELAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W40/22</main-classification>  
        <further-classification edition="201801120251201B">H04W76/18</further-classification>  
        <further-classification edition="200901120251201B">H04W24/10</further-classification>  
        <further-classification edition="200901120251201B">H04W88/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫仲濟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, JUNG JE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿巴斯　泰穆爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABBAS, TAIMOOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛迪　沙米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERDI, SAMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於偵測多躍U2N中繼中的連結故障或降級之程序、方法、架構、設備、系統、裝置、及電腦程式。第一中繼裝置接收第一訊息，其包括指出維持無線傳輸/接收單元（WTRU）與端中繼裝置之間的連接的請求的資訊，連接使用經由第一中繼裝置的端對端路徑，端對端路徑包含WTRU與第一中繼裝置之間的第一路徑及來自第一中繼裝置及端中繼裝置的第二路徑；在第二路徑中的連結上轉發請求；偵測第二路徑中的連結上的連結故障或連結質量降級；及在第一路徑中的連結上發送第二訊息，第二訊息包括第一中繼裝置的識別符及指出連結故障或連結質量降級的原因的資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Procedures, methods, architectures, apparatuses, systems, devices, and computer program products for detecting link failure or degradation in multihop U2N relay. A first relay device receives a first message comprising information indicative of a request to maintain a connection between a wireless transmit/receive unit, WTRU, and an end relay device, the connection using an end-to-end path via the first relay device including a first path between the WTRU and the first relay device and a second path from the first relay device and the end relay device, forwards the request on a link in the second path, detects link failure or link quality degradation on the link in the second path, and sends, on a link in the first path, a second message comprising an identifier of the first relay device and information indicative of a cause of the link failure or link quality degradation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401:遠端UE(遠端使用者設備)</p>  
        <p type="p">403:第一IM中繼、IM中繼1</p>  
        <p type="p">405:第二IM中繼、IM中繼2</p>  
        <p type="p">407:IM中繼3</p>  
        <p type="p">409:U2N中繼</p>  
        <p type="p">S402:多躍U2N中繼連接建立</p>  
        <p type="p">S404、S406、S408:持久連接請求(遠端UE、U2N中繼)</p>  
        <p type="p">S410:連結故障或降級</p>  
        <p type="p">S412:偵測連結故障或降級</p>  
        <p type="p">S414:至U2N中繼的發現程序</p>  
        <p type="p">S416、S418:持久連接回應(遠端UE、U2N中繼)</p>  
        <p type="p">S420:多躍U2N中繼重選程序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1419" publication-number="202611332"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611332.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611332</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有整合式腔室襯墊的電漿源</chinese-title>  
        <english-title>PLASMA SOURCE WITH INTEGRATED CHAMBER LINER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">C23C16/50</main-classification>  
        <further-classification edition="200601120251204B">H05H1/16</further-classification>  
        <further-classification edition="200601120251204B">H05H1/18</further-classification>  
        <further-classification edition="200601120251204B">H05H1/46</further-classification>  
        <further-classification edition="200601120251204B">H05H1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉裘　史瑞肯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAJU, SRIKANTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍納瓦爾　奇朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONNAVAR, KIRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊利薩格　拉瑞Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELIZAGA, LARRY D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡度希　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARDUCCI, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅德里格斯　錫爾弗斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RODRIGUES, SILVERST</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉莫斯　賈斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMOS, JUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫提尼歐　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUTINHO, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所描述的實施例係關於一種包含來源組件的設備，該來源組件具有第一表面和與第一表面相對的第二表面。在實施例中，襯墊耦接至來源組件的第一表面。在實施例中，該襯墊包含覆蓋第一表面的至少一部分的第一襯墊，以及從第一襯墊延伸出的第二襯墊。在實施例中，第二襯墊具有環形形狀，且第一襯墊和第二襯墊為單體結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to an apparatus that includes a source assembly with a first surface and a second surface opposite from the first surface. In an embodiment, a liner is coupled to the first surface of the source assembly. In an embodiment, the liner includes a first liner over at least a portion of the first surface, and a second liner that extends away from the first liner. In an embodiment, the second liner includes a ring shape, and the first liner and the second liner are a monolithic structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電漿工具</p>  
        <p type="p">105:腔室</p>  
        <p type="p">106:陰極組件</p>  
        <p type="p">107:吸盤</p>  
        <p type="p">120:來源組件</p>  
        <p type="p">121:金屬部分</p>  
        <p type="p">122:來源襯墊</p>  
        <p type="p">124:間隙</p>  
        <p type="p">125:襯墊組件</p>  
        <p type="p">126:金屬環</p>  
        <p type="p">127:腔室襯墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1420" publication-number="202611343"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611343.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611343</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125917</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於向拉錠器設備添加摻雜物之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR ADDING DOPANT TO AN INGOT PULLER APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C30B15/20</main-classification>  
        <further-classification edition="200601120251210B">C30B31/00</further-classification>  
        <further-classification edition="200601120251210B">B01J4/02</further-classification>  
        <further-classification edition="200601120251210B">C30B29/06</further-classification>  
        <further-classification edition="200601120251210B">C30B35/00</further-classification>  
        <further-classification edition="200601120251210B">G05D11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　雨樵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUCHIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾奧夫　斯姆士　迪恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EOFF, JAMES DEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾賢達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HSIEN-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種摻雜物進料器包含界定一內部腔室之一殼體及自該內部腔室延伸之一通路。該摻雜物進料器進一步包含可旋轉地安裝至該殼體之一輪轂。該輪轂包含一框架及附接至該框架之摻雜物艙。該等摻雜物艙經定大小以接納一定劑量之摻雜物且包含一蓋，該蓋可相對於該框架在一閉合位置與一敞開位置之間移動以將該一定劑量之摻雜物釋放至該通路中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dopant feeder includes a housing defining an interior chamber and a passageway extending from the interior chamber. The dopant feeder further includes a hub rotatably mounted to the housing. The hub includes a frame and dopant capsules attached to the frame. The dopant capsules are sized to receive a dose of dopant and include a lid that is moveable relative to the frame between a closed position and an open position for releasing the dose of dopant into the passageway.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:進料器/摻雜物進料器/實例性摻雜物進料器</p>  
        <p type="p">202:摻雜物模組/摻雜模組</p>  
        <p type="p">204:驅動模組</p>  
        <p type="p">205:殼體</p>  
        <p type="p">212:腔室/內部腔室/真空腔室</p>  
        <p type="p">214:第一感測器</p>  
        <p type="p">216:腔室門</p>  
        <p type="p">296:通路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1421" publication-number="202611648"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611648.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611648</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125935</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>將參數時間序列轉換為語言元素以饋入分析工業機器的操作的神經網路</chinese-title>  
        <english-title>CONVERTING PARAMETER TIME-SERIES TO LANGUAGE ELEMENTS IN ORDER TO FEED NEURAL NETWORKS THAT ANALYZE THE OPERATION OF INDUSTRIAL MACHINES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G05B19/00</main-classification>  
        <further-classification edition="201901120251201B">G06N20/00</further-classification>  
        <further-classification edition="202301120251201B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧森堡商保爾伍斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAUL WURTH S. A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞德里克　肖卡特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHOCKAERT, CEDRIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種工業機器（100~4）執行工業過程，並且標識對應於機器的技術狀態的狀態標識符（S2~4）。預訓練的轉換器模組（600~4）接收單變量參數時間序列（{Pn}~4）並且將其轉換為語言序列（{Ln}~4），即具有語言元素的序列。預訓練的生成變換器模組（700~4）基於語言元素的預訓練的出現概率生成語言序列（{Ln}~4）的擴展（E~4），並且提供狀態標識符（S2~4），作為至少包括擴展（E~4）的語句。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An industrial machine (100~4) performs an industrial process, and a state identifier (S2~4) that corresponds to the technical state of the machine is identified. A pre-trained converter module (600~4) receives a single-variate parameter time-series ({Pn}~4) and converts it to a language series ({Ln}~4), that is a series with language elements. A pre-trained generative transformer module (700~4), generates an extension (E~4) to the language series ({Ln}~4) based on a pre-trained probability of occurrence of language elements and provides the state identifier (S2~4) as a statement that comprises at least the extension (E~4).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:工業機器</p>  
        <p type="p">190:機器操作員</p>  
        <p type="p">500:神經網路</p>  
        <p type="p">600:轉換器</p>  
        <p type="p">700:發生器</p>  
        <p type="p">201、202:數據集合</p>  
        <p type="p">501、701:通知</p>  
        <p type="p">E:擴展</p>  
        <p type="p">L:語言</p>  
        <p type="p">P:參數</p>  
        <p type="p">S:狀態</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1422" publication-number="202611522"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611522.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611522</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125941</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>介面裝置及自動試驗裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01R1/073</main-classification>  
        <further-classification edition="200601120251201B">H01R31/06</further-classification>  
        <further-classification edition="200601120251201B">H01R33/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛德萬測試股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANTEST CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森祐人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於改善插座板的接觸位置精度。介面裝置200D設置於測試頭與被試驗設備（DUT）之間。前端模組300包含接腳電子電路與FPC電纜222。中介層218載置於柔性基板222上，形成與插座板的接觸面512。FPC框架500組裝於前端模組300。框架500具有基準面510，在基準面510與接觸面512抵接的狀態下組裝於前端模組300。插座板組裝於框架500。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200D:介面裝置</p>  
        <p type="p">218:中介層</p>  
        <p type="p">219:電纜夾</p>  
        <p type="p">222:FPC電纜</p>  
        <p type="p">300:前端模組</p>  
        <p type="p">500:FPC框架(框架)</p>  
        <p type="p">502:定位銷</p>  
        <p type="p">510:基準面</p>  
        <p type="p">512:接觸面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1423" publication-number="202611141"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611141.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611141</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125952</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、乾膜、膜、積層片、預浸漬體、印刷配線基板及電子機器</chinese-title>  
        <english-title>RESIN COMPOSITION, CURED PRODUCT, DRY FILM, FILM, LAMINATED SHEET, PREPREG, PRINTED WIRING BOARD AND ELECTRONIC APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C08F232/08</main-classification>  
        <further-classification edition="200601120251103B">C08G61/08</further-classification>  
        <further-classification edition="200601120251103B">C08G8/30</further-classification>  
        <further-classification edition="200601120251103B">C08L45/00</further-classification>  
        <further-classification edition="200601120251103B">C07D207/448</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倉内啓輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURAUCHI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城崎梨紗子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOZAKI, RISAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種兼顧低介電性與高溫耐熱性的樹脂組成物、以及使用所述樹脂組成物形成的兼顧低介電性與高溫耐熱性的硬化物、乾膜、膜、積層片、預浸漬體、印刷配線基板及電子機器。所述課題可藉由如下樹脂組成物來解決，所述樹脂組成物包含：環狀烯烴樹脂（A），具有源自選自α蒎烯、β蒎烯、α水芹烯及β水芹烯中的至少一種的結構單元；以及硬化性化合物（B），所述樹脂組成物中，環狀烯烴樹脂（A）的含量以所述樹脂組成物中的總固體成分為基準而為0.5質量%～50質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1424" publication-number="202610665"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610665.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610665</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125968</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靶向SERPINC1的雙鏈核糖核酸</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/7088</main-classification>  
        <further-classification edition="201001120251201B">C12N15/113</further-classification>  
        <further-classification edition="200601120251201B">A61K48/00</further-classification>  
        <further-classification edition="200601120251201B">A61P7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商正大天晴藥業集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIA TAI TIANQING PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐宏江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, HONGJIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛興楓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, XINGFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭佳佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, JIAJIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧丹丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, DANDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請屬於生物醫藥領域，提供一種靶向SERPINC1的雙鏈核糖核酸、其藥學上可接受的鹽或其配體綴合物，還提供了包含所述雙鏈核糖核酸、其藥學上可接受的鹽或其配體綴合物的藥物組合物，以及所述雙鏈核糖核酸、其藥學上可接受的鹽或其配體綴合物的治療用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1425" publication-number="202611739"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611739.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611739</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125972</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於晶粒架構內的中斷控制的設備及方法</chinese-title>  
        <english-title>APPARATUS AND METHODS FOR INTERRUPT CONTROL WITHIN DIE ARCHITECTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F13/24</main-classification>  
        <further-classification edition="200601120251201B">G06F13/40</further-classification>  
        <further-classification edition="200601120251201B">G06F3/06</further-classification>  
        <further-classification edition="200601120251201B">G06F9/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, CAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派翠克　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATRICK, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁　宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VUONG, HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿雷帕利　納文庫馬古德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AREPALLI, NAVEEN KUMAR GOUD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供在晶粒架構內提供多裝置中斷支援的方法及設備。例如，在一個實例中，一晶粒包括中斷路由邏輯及一基底位址暫存器。該中斷路由邏輯經組態以回應於諸如已完成之一記憶體轉移的已完成之一事件而接收一向量值。該中斷路由邏輯亦經組態以判定該向量值處於與該基底位址暫存器相關聯之一向量值範圍內。此外，該中斷路由邏輯經組態以自該基底位址暫存器讀取一基底位址，且將該向量值寫入至該基底位址。例如，該基底位址可係另一裝置之一門鈴暫存器。該將該向量值寫入至該基底位址可導致該對應裝置上之中斷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatuses are provided that provide multiple device interrupt support within die architectures. For instance, in one example, a die includes interrupt routing logic and a base address register. The interrupt routing logic is configured to receive a vector value in response to a completed event, such as a completed memory transfer. The interrupt routing logic is also configured to determine the vector value is within a range of vector values associated with the base address register. Further, the interrupt routing logic is configured to read a base address from the base address register, and to write the vector value to the base address. The base address may be a doorbell register of another device, for example. The writing of the vector value to the base address may cause an interrupt on the corresponding device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體電路封裝</p>  
        <p type="p">102:非揮發性大量儲存裝置</p>  
        <p type="p">103:互連件</p>  
        <p type="p">104:多裝置中斷支援主機控制器；MDIS主機控制器</p>  
        <p type="p">106:第二通用中斷控制器</p>  
        <p type="p">108:第一通用中斷控制器</p>  
        <p type="p">110:第三通用中斷控制器</p>  
        <p type="p">120:互連件</p>  
        <p type="p">121A:互連件</p>  
        <p type="p">121B:互連件</p>  
        <p type="p">121C:互連件</p>  
        <p type="p">136:中央處理單元(CPU)</p>  
        <p type="p">138:圖形處理單元(GPU)</p>  
        <p type="p">140:輸入/輸出</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1426" publication-number="202610757"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610757.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610757</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125995</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於確定以金屬板部分製成的金屬板圓柱體周長的裝置</chinese-title>  
        <english-title>DEVICE FOR DETERMINING THE CIRCUMFERENCE OF A SHEET METAL CYLINDER PRODUCED FROM A SHEET METAL SECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251210B">B23K37/053</main-classification>  
        <further-classification edition="200601120251210B">B21D51/18</further-classification>  
        <further-classification edition="200601120251210B">F16C11/12</further-classification>  
        <further-classification edition="200601120251210B">B23K37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商蘇德龍尼克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOUDRONIC AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤姆布什特　魯道夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMBRICHT, RUDOLF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布勒　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUEHLER, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於確定以金屬板部分製造之金屬板圓柱體（2）周長的裝置（1），該裝置用於焊接該金屬板圓柱體以產生容器主體。該裝置包含複數個導引滾筒（3），該複數個導引滾筒配置成環形且圍繞該金屬板圓柱體（2）之通道開口（4）。所述導引滾筒（3）由支撐結構（5）支撐，該支撐結構之幾何形狀可以一種方式調整，該方式使得由所述導引滾筒（3）圍繞之該通道開口（4）可藉由改變該支撐結構（5）之該幾何形狀來改變。該支撐結構（5）之支撐導引滾筒（3）之部分（Sections）（6a、6b）經由一或多個撓性軸承耦接至該支撐結構之其餘部分，且該支撐結構（5）之該幾何形狀之該調整以一種方式進行，該方式使得所述部分（6a、6b）藉由使用所述撓性軸承（8）相對於該支撐結構之該其餘部分移動。 &lt;br/&gt;所述裝置在製造及維護方面為簡單且具成本效益的，且其使得能夠藉助於相對簡單支撐結構使受所述導引滾筒限制之所述通道開口之該幾何形狀極為接近於理想主體幾何形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a device (1) for determining the circumference of a sheet metal cylinder (2) manufactured from a sheet metal section for welding it to yield a container body. It comprises a plurality of guiding rollers (3), which are arranged in a ring and surround a passage opening (4) for the sheet metal cylinder (2). The guiding rollers (3) are supported by a supporting structure (5), which is adjustable in its geometry in such a way that the passage opening (4) surrounded by the guiding rollers (3) can be changed by changing the geometry of the supporting structure (5). Sections (6a, 6b) of the supporting structure (5), which support guiding rollers (3), are coupled to the rest of the supporting structure via one or more flexure bearings, and the adjustment of the geometry of the supporting structure (5) is done in such a way that these sections (6a, 6b) are moved with respect to the rest of the supporting structure by using the flexure bearings (8). &lt;br/&gt;Such devices are simple and cost effective with regard to manufacturing and maintenance and they enable keeping the geometry of the passage openings limited by the guiding rollers very close to the ideal body geometry by means of a relatively simple supporting structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一裝置</p>  
        <p type="p">2:金屬板圓柱體</p>  
        <p type="p">3:導引滾筒</p>  
        <p type="p">4:通道開口</p>  
        <p type="p">5:支撐結構</p>  
        <p type="p">6a:部分</p>  
        <p type="p">6b:部分</p>  
        <p type="p">7a:部分</p>  
        <p type="p">7b:部分</p>  
        <p type="p">8:撓性軸承</p>  
        <p type="p">9:支撐部分</p>  
        <p type="p">10:差動螺紋螺絲</p>  
        <p type="p">11:上部滾筒電極</p>  
        <p type="p">12:下部滾筒電極</p>  
        <p type="p">13a:調整塊</p>  
        <p type="p">13b:調整塊</p>  
        <p type="p">14a:固定螺絲</p>  
        <p type="p">14b:固定螺絲</p>  
        <p type="p">15:金屬板邊緣</p>  
        <p type="p">18:閉合板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1427" publication-number="202611162"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611162.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611162</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G61/02</main-classification>  
        <further-classification edition="200601120251201B">C08G65/40</further-classification>  
        <further-classification edition="200601120251201B">C08G77/46</further-classification>  
        <further-classification edition="200601120251201B">C08L65/00</further-classification>  
        <further-classification edition="200601120251201B">C08L71/10</further-classification>  
        <further-classification edition="200601120251201B">C08L71/12</further-classification>  
        <further-classification edition="200601120251201B">C08L79/04</further-classification>  
        <further-classification edition="200601120251201B">C08L83/12</further-classification>  
        <further-classification edition="200601120251201B">C08K3/36</further-classification>  
        <further-classification edition="200601120251201B">C08J5/18</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification>  
        <further-classification edition="200601120251201B">H01L23/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商味之素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJINOMOTO CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滑方奈那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMEKATA, NANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中沢正和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAZAWA, MASAKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供實現顯示出優異介電特性和優異密合性的硬化物的樹脂組成物。樹脂組成物，其含有(1A)具有下式(A-1)所示的結構單元和下式(A-2)所示的結構單元的聚合物、(B)自由基聚合系樹脂和(C)無機填充材料，(B)成分包含(B1)具有乙烯性不飽和鍵的液態硬化劑。(式(A-1)和式(A-2)中，R&lt;sup&gt;1&lt;/sup&gt;各自獨立表示一價有機基。A各自獨立表示具有可被氫化的雙酚骨架的二價有機基。) &lt;br/&gt;&lt;img align="absmiddle" height="110px" width="388px" file="ed10127.JPG" alt="ed10127.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1428" publication-number="202610689"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610689.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610689</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126022</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靶向免疫球蛋白Ｅ（ＩＧＥ）之循環溶酶體靶向嵌合體</chinese-title>  
        <english-title>CYCLING LYSOSOMAL TARGETING CHIMERAS TARGETING IMMUNOGLOBULIN E (IGE)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">A61K47/68</main-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4965</further-classification>  
        <further-classification edition="200601120251201B">A61K31/44</further-classification>  
        <further-classification edition="200601120251201B">A61K31/351</further-classification>  
        <further-classification edition="200601120251201B">A61P43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萊西亞醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LYCIA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫根塔基斯　克里斯托斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOUGENTAKIS, CHRISTOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林德　尼可拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIND, NICHOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒特利夫　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHURTLEFF, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供結合物，其包含靶向溶酶體靶向分子之部分、連接子及特異性結合經靶向用於降解之細胞表面目標分子或細胞外目標分子的抗體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides conjugates comprising a moiety that targets a lysosomal targeting molecule, a linker, and an antibody that specifically binds a cell surface target molecule or extracellular target molecule that is targeted for degradation.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1429" publication-number="202610787"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610787.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610787</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126037</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>消音裝置及氣動工具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">B25F5/00</main-classification>  
        <further-classification edition="200601120251128B">B25B21/00</further-classification>  
        <further-classification edition="200601120251128B">B25D17/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東工器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO KOHKI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井大心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, TAISHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種氣動工具的消音裝置，可獲得更高的消音效果。 &lt;br/&gt;　　[技術內容]該當消音裝置(30)，是被安裝於氣動工具(1)的工具排氣口(22)。消音裝置(30)，具備裝置本體(32)及袋體(34)。裝置本體(32)，具有：流路(46)，從與工具排氣口(22)連通的開口部(42)延伸至閉塞端部(44)為止；及貫通路(48)，在開口部(42)及閉塞端部(44)之間的位置沿著與長度軸線(L)交叉的方向貫通裝置本體(32)。袋體(34)，具有：膨脹室(56)，與貫通路(48)連通；及排氣孔(58)，在沿著長度軸線(L)的方向遠離貫通路(48)的位置將膨脹室(56)與外部空間連通。從工具排氣口(22)被排出的排氣，是使流路(46)沿著長度軸線(L)的方向流動，通過貫通路(48)由與長度軸線(L)交叉的方向進入膨脹室(56)，吹到袋體(34)的內周面(34a)在膨脹室(56)內沿著長度軸線(L)的方向流動，從排氣孔(58)朝外部空間被排氣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:消音裝置</p>  
        <p type="p">32:裝置本體</p>  
        <p type="p">32a:外周面</p>  
        <p type="p">34:袋體</p>  
        <p type="p">34a:內周面</p>  
        <p type="p">36:螺旋狀構件</p>  
        <p type="p">38:側壁部</p>  
        <p type="p">40:端壁部</p>  
        <p type="p">42:開口部</p>  
        <p type="p">44:閉塞端部</p>  
        <p type="p">46:流路</p>  
        <p type="p">48:貫通路</p>  
        <p type="p">50:公螺紋部</p>  
        <p type="p">52:環狀凹部</p>  
        <p type="p">54:環狀突部</p>  
        <p type="p">56:膨脹室</p>  
        <p type="p">58:排氣孔</p>  
        <p type="p">60:一端</p>  
        <p type="p">62:卡止面</p>  
        <p type="p">64:另一端</p>  
        <p type="p">66:卡止面</p>  
        <p type="p">L:長度軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1430" publication-number="202611293"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611293.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611293</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126056</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真核半合成生物</chinese-title>  
        <english-title>EUKARYOTIC SEMI-SYNTHETIC ORGANISMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C12N15/10</main-classification>  
        <further-classification edition="200601120251201B">C12N5/10</further-classification>  
        <further-classification edition="200601120251201B">A61K31/7088</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商史基普研究協會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE SCRIPPS RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅曼斯柏格　佛洛伊德　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROMESBERG, FLOYD E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　安　曉珘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ANNE XIAOZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛開</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供真核半合成生物以及其等使用及製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are eukaryotic semi-synthetic organisms and their methods of use and manufacture.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:工作流</p>  
        <p type="p">101:DNA</p>  
        <p type="p">102:蛋白質</p>  
        <p type="p">103:tRNA</p>  
        <p type="p">104:轉錄</p>  
        <p type="p">105:非天然胺基酸</p>  
        <p type="p">106:tRNA</p>  
        <p type="p">107:mRNA</p>  
        <p type="p">108:轉譯</p>  
        <p type="p">109:非天然胺基酸</p>  
        <p type="p">110:蛋白質</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1431" publication-number="202610693"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610693.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610693</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126058</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遞送揮發性材料的匣</chinese-title>  
        <english-title>CARTRIDGE FOR DELIVERING A VOLATILE MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">A61L9/12</main-classification>  
        <further-classification edition="200601120251211B">B65D3/02</further-classification>  
        <further-classification edition="200601120251211B">B65D51/18</further-classification>  
        <further-classification edition="200601120251211B">B65D41/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商寶鹼公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE PROCTER &amp; GAMBLE COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維亞斯　拉胡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VYAS, RAHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　家偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, DESMOND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　美珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, MEI SAN GIGI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供一種用於遞送揮發性材料的匣，該匣包含： &lt;br/&gt;一貯存器，其含有液體形式的揮發性組成物，該貯存器具有一開口； &lt;br/&gt;一膜，其封閉該貯存器的該開口，該膜經組態以允許該揮發性組成物蒸發；及 &lt;br/&gt;一密封基材，其封閉該貯存器的該開口， &lt;br/&gt;其中： &lt;br/&gt;該匣係用於放置到一可再用殼體中的一單次使用匣； &lt;br/&gt;該匣包含一握持端及相對於該握持端的一插入端，該握持端包含具有至少1 cm&lt;sup&gt;2&lt;/sup&gt;之一面積的一握持片，該握持片延伸超出該膜的一蒸發邊緣至少0.6 cm的一距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein is a cartridge for delivering a volatile material, the cartridge comprising: &lt;br/&gt;a reservoir containing a volatile composition in liquid form, the reservoir having an opening; &lt;br/&gt;a membrane enclosing the opening of the reservoir, the membrane configured to allow evaporation of the volatile composition; and &lt;br/&gt;a sealing substrate enclosing the opening of the reservoir, &lt;br/&gt;wherein: &lt;br/&gt;the cartridge is a single-use cartridge for placing into a reusable housing; &lt;br/&gt;the cartridge comprises a gripping end and an insertion end opposing the gripping end, the gripping end comprising a gripping tab having an area of at least 1 cm2, the gripping tab extending beyond an evaporative edge of the membrane by a distance of at least 0.6 cm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200b:揮發性組成物匣</p>  
        <p type="p">201:貯存器</p>  
        <p type="p">201a:肩部區域</p>  
        <p type="p">201b:周邊部分</p>  
        <p type="p">201c:握持片端部分</p>  
        <p type="p">201d:相對端部分</p>  
        <p type="p">201e:中間部分</p>  
        <p type="p">204:握持片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1432" publication-number="202610611"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610611.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610611</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126067</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隆培生長激素的凍乾方法、隆培生長激素凍乾製劑和注射劑</chinese-title>  
        <english-title>Lyophilization methods, lyophilized formulations, and injections for Lonapegsomatropin for injection</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61J3/02</main-classification>  
        <further-classification edition="200601120251201B">A61J1/20</further-classification>  
        <further-classification edition="200601120251201B">A61K38/27</further-classification>  
        <further-classification edition="200601120251201B">A61K9/19</further-classification>  
        <further-classification edition="200601120251201B">A61K9/00</further-classification>  
        <further-classification edition="200601120251201B">A61P5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商維昇藥業（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VISEN PHARMACEUTICALS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜豔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧安邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, AN-BANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種隆培生長激素的凍乾方法包括：向雙腔卡式瓶中加入中塞，灌入待凍乾的隆培生長激素，將雙腔卡式瓶放置並固定於凍乾支架上；將頂塞限位在雙腔卡式瓶的瓶口上；分別對待凍乾的隆培生長激素進行冷凍、一次乾燥和二次乾燥；用頂蓋固定頂塞並密閉瓶口。本發明提供的凍乾方法可以提供高品質凍乾參數與凍乾操作，以利用頂塞和頂蓋完成對雙腔卡式瓶一體化壓塞封蓋，以使獲得的隆培生長激素凍乾製劑保持更優品質，提高其使用效果和貯存時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lyophilization method for Lonapegsomatropin for injection, comprises: inserting a middle stopper into a dual-chamber cartridge bottle, filling the dual-chamber cartridge bottle with a Lonapegsomatropin to be lyophilized, positioning and securing the dual-chamber cartridge bottle onto a lyophilization bracket; positioning the top stopper over the bottle opening of the dual-chamber cartridge bottle; subjecting the Lonapegsomatropin to be lyophilized to freezing, primary drying, and secondary drying; securing the top stopper with a cap to seal the bottle opening. The lyophilization method provides high-quality lyophilization parameters and operations, using the top stopper and the cap to achieve integrated stoppering and capping of the dual-chamber cartridge bottle, thereby enabling the lyophilized formulations of the Lonapegsomatropin for injection maintain superior quality, the efficacy and storage duration of the products are enhanced.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1433" publication-number="202611151"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611151.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611151</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126083</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>疊層體、疊層體之製造方法及圖案形成方法</chinese-title>  
        <english-title>LAMINATE, PREPARATION OF LAMINATE AND PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G8/04</main-classification>  
        <further-classification edition="200601120251201B">C08G8/20</further-classification>  
        <further-classification edition="200601120251201B">C08G8/28</further-classification>  
        <further-classification edition="200601120251201B">C08F212/08</further-classification>  
        <further-classification edition="200601120251201B">C08F212/14</further-classification>  
        <further-classification edition="200601120251201B">C08F212/32</further-classification>  
        <further-classification edition="200601120251201B">C08F220/06</further-classification>  
        <further-classification edition="200601120251201B">C08F220/18</further-classification>  
        <further-classification edition="200601120251201B">C08F220/30</further-classification>  
        <further-classification edition="200601120251201B">C08F220/32</further-classification>  
        <further-classification edition="200601120251201B">C08L61/06</further-classification>  
        <further-classification edition="200601120251201B">C08L33/00</further-classification>  
        <further-classification edition="200601120251201B">C08K5/095</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/09</further-classification>  
        <further-classification edition="200601120251201B">G03F7/11</further-classification>  
        <further-classification edition="200601120251201B">G03F7/16</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊地駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郡大佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>半田龍之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANDA, RYUNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草間理志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAMA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大山皓介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHYAMA, KOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種疊層體，具備：由可應用於使用高能射線之光微影，尤其可應用於電子束(EB)微影及EUV微影，且感度及極限解析性優異的非化學增幅阻劑組成物而得之阻劑膜、以及在其下之密合膜；且提供一種疊層體上層的圖案形成方法。&lt;br/&gt; 一種疊層體，按順序具備：基板；密合膜，由包含含有式(1)或(2)表示之重複單元之聚合物及有機溶劑之密合膜形成組成物而得；以及阻劑膜，由包含選自下式(3)表示之超原子價碘化合物、下式(4)表示之超原子價碘化合物及下式(5)表示之超原子價碘化合物中之至少1種超原子價碘化合物、含羧基之化合物以及溶劑之阻劑組成物而得。&lt;br/&gt;&lt;img align="absmiddle" height="198px" width="566px" file="ed10096.JPG" alt="ed10096.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="251px" width="638px" file="ed10097.JPG" alt="ed10097.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1434" publication-number="202612490"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612490.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612490</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251204B">H10D8/01</main-classification>  
        <further-classification edition="202501120251204B">H10D62/10</further-classification>  
        <further-classification edition="202501120251204B">H10D62/60</further-classification>  
        <further-classification edition="202501120251204B">H10D64/20</further-classification>  
        <further-classification edition="200601120251204B">H01L21/302</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新電元工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商秋田新電元股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKITA SHINDENGEN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊谷渉吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAGAI, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭明</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奕軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體裝置，藉由減小晶片的翹曲、提高機械強度而使晶片不易破裂，而能夠容易地製造。本發明是一種半導體裝置，具有：第二導電型半導體層（13），其配置在第一個第一導電型半導體層（11）的上方，在俯視觀察時形成於比第一個第一導電型半導體層（11）更靠內側的位置；第二個第一導電型半導體層（12），其與第一個第一導電型半導體層（11）接觸地配置在第一個第一導電型半導體層（11）的下方；平台結構的槽（11a），其形成於第二導電型半導體層（13）的上表面側，在俯視觀察時形成於第二導電型半導體層（13）的外周部以及位於所述外周部的外側的第一個第一導電型半導體層（11）；以及鈍化層（15），其形成於槽（11a），並形成於第二導電型半導體層（13）的上表面側的側面以及第一個第一導電型半導體層（11）的上表面側，槽（11a）的底面位於第二導電型半導體層（13）以及第一個第一導電型半導體層（11）的上方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無。</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第一個第一導電型半導體層(N&lt;sup&gt;-&lt;/sup&gt;)</p>  
        <p type="p">11a:平台結構的槽</p>  
        <p type="p">12:第二個第一導電型半導體層(陰極層，N&lt;sup&gt;+&lt;/sup&gt;)</p>  
        <p type="p">13:第二導電型半導體層(陽極層，P&lt;sup&gt;+&lt;/sup&gt;)、第二個第二導電型半導體層(陽極層，P&lt;sup&gt;+&lt;/sup&gt;)</p>  
        <p type="p">13a:第二導電型半導體層(陽極層，P&lt;sup&gt;+&lt;/sup&gt;)的最外周</p>  
        <p type="p">15:鈍化層</p>  
        <p type="p">15a:第二導電型半導體層(陽極層，P&lt;sup&gt;+&lt;/sup&gt;)的上表面側的側面</p>  
        <p type="p">21:第一電極層</p>  
        <p type="p">21a:第一電極層的外周</p>  
        <p type="p">22:第二電極層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1435" publication-number="202612312"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612312.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612312</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126110</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信裝置、及通信方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">H04L47/20</main-classification>  
        <further-classification edition="202201120251201B">H04L47/22</further-classification>  
        <further-classification edition="202201120251201B">H04L69/40</further-classification>  
        <further-classification edition="202201120251201B">H04L69/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺真一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於抑制傳送效率降低。 &lt;br/&gt;本發明提供一種通信裝置，其具備接收自經由以A-PHY規格規定之A-PHY I/F連接之其他通信裝置發送之資料之通信部，且通信部就其他通信裝置所具有之暫存器之每一位址，將包含Read(讀出)資料之資料長度之封包發送至其他通信裝置。例如，本揭示可應用於遵循A-PHY規格之通信裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:通信系統</p>  
        <p type="p">11:通信裝置</p>  
        <p type="p">12:通信裝置</p>  
        <p type="p">13:傳送路</p>  
        <p type="p">21:處理部</p>  
        <p type="p">22:通信部</p>  
        <p type="p">31:處理部</p>  
        <p type="p">32:通信部</p>  
        <p type="p">41:圖像系統</p>  
        <p type="p">42:PAL/CSI-2</p>  
        <p type="p">43:控制系統</p>  
        <p type="p">44:PAL/I2C</p>  
        <p type="p">45:A-PHY</p>  
        <p type="p">51:圖像系統</p>  
        <p type="p">52:PAL/CSI-2</p>  
        <p type="p">53:控制系統</p>  
        <p type="p">54:PAL/I2C</p>  
        <p type="p">55:A-PHY</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1436" publication-number="202610709"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610709.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610709</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126111</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬加工方法</chinese-title>  
        <english-title>METALWORKING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B01D17/05</main-classification>  
        <further-classification edition="200601120251201B">B23Q11/10</further-classification>  
        <further-classification edition="200601120251201B">C10M133/04</further-classification>  
        <further-classification edition="200601320251201B">C10N40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商開麥妥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEMETALL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雷拉　康德　瑪麗安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERREIRA CONDE, MARIANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於金屬加工方法，其中金屬加工工具在金屬加工機器之加工區域處加工工件；將全合成金屬加工液供應至該金屬加工機器、該金屬加工工具及該工件中之至少一者；該全合成金屬加工液吸收浮油，因此形成用過含浮油全合成金屬加工液；將該用過含浮油全合成金屬加工液收集於容器中；將一或多種式[N&lt;sup&gt;+&lt;/sup&gt;(R&lt;sup&gt;1&lt;/sup&gt;)(R&lt;sup&gt;2&lt;/sup&gt;)(R&lt;sup&gt;3&lt;/sup&gt;)(R&lt;sup&gt;4&lt;/sup&gt;)]&lt;sub&gt;n&lt;/sub&gt; X&lt;sup&gt;n-&lt;/sup&gt;之季銨鹽添加至該用過金屬加工液中，因此破壞乳化浮油之乳液，從而形成游離浮油，其中殘基R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;選自芳脂族及脂族烴殘基，限制條件為殘基R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;中之兩者為具有1至4個碳原子之烴基且此等殘基中之另外兩者為具有6至20個碳原子之烴殘基，X&lt;sup&gt;n-&lt;/sup&gt;為n價陰離子，且n為1、2或3；該游離浮油累積在空氣-金屬加工液界面處及自其移除。此外，本發明係關於在全合成金屬加工液中自其乳液移除乳化浮油之方法；及特定季銨鹽於此種移除步驟中自該全合成金屬加工液移除乳化浮油之用途。此外，本發明係關於含有該季銨鹽之全合成金屬加工液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to metalworking process wherein a metalworking tool processes a workpiece at a processing area of a metalworking machine; a fully synthetic metalworking fluid is supplied to at least one of the metalworking machine, the metalworking tool and the workpiece; the fully synthetic metalworking fluid takes up tramp oil, thus forming a used, tramp oil containing fully synthetic metalworking fluid; the used, tramp oil containing fully synthetic metalworking fluid is collected in a container; one or more quaternary ammonium salts of formula [N&lt;sup&gt;+&lt;/sup&gt;(R&lt;sup&gt;1&lt;/sup&gt;)(R&lt;sup&gt;2&lt;/sup&gt;)(R&lt;sup&gt;3&lt;/sup&gt;)(R&lt;sup&gt;4&lt;/sup&gt;)]&lt;sub&gt;n&lt;/sub&gt; X&lt;sup&gt;n-­&lt;/sup&gt;, wherein residues R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt; and R&lt;sup&gt;4&lt;/sup&gt; are selected from araliphatic and aliphatic hydrocarbon residues, with the proviso that two of residues R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt; and R&lt;sup&gt;4&lt;/sup&gt; are hydrocarbon groups with 1 to 4 carbon atoms and the other two of these residues are hydrocarbon residues with 6 to 20 carbon atoms, X&lt;sup&gt;n-&lt;/sup&gt; being an n-valent anion, and n being 1, 2 or 3, are added to the used metalworking fluid, thus breaking the emulsion of emulsified tramp oil forming free tramp oil; the free tramp oil accumulates at an air-metalworking fluid interface and is removed thereof. Moreover, the invention relates to a method of removing emulsified tramp oil from its emulsion in a fully synthetic metalworking fluid; and the use of the specific quaternary ammonium salts in such removal step to remove emulsified tramp oil from the fully synthetic metalworking fluid. Furthermore, the invention relates to a fully synthetic metalworking fluid containing said quaternary ammonium salt.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1437" publication-number="202612250"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612250.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612250</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126122</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>馬達控制裝置及馬達控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251103B">H02P6/16</main-classification>  
        <further-classification edition="200601120251103B">H02P27/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新唐科技日本股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION JAPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下亨一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, KYOUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田大祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森和輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種可以用無感測器方式精度良好地進行3相馬達的啟動前的位置推定之馬達控制裝置。&lt;br/&gt; [解決手段]一種馬達控制裝置，具有：控制驅動電路30，將驅動訊號供給至驅動馬達10之逆變器20；時間點設定電路31，設定馬達10的啟動前的由控制驅動電路30從馬達10的3相當中選擇2相並進行通電之期間中的第1時間點以及第2時間點；及非通電相電壓偵測電路32，比較在第1時間點的馬達10的非通電相的電壓、與在第2時間點的馬達10的非通電相的電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:馬達</p>  
        <p type="p">20:逆變器</p>  
        <p type="p">30:控制驅動電路</p>  
        <p type="p">31:時間點設定電路</p>  
        <p type="p">32:非通電相電壓偵測電路</p>  
        <p type="p">Im:電流</p>  
        <p type="p">U:U相</p>  
        <p type="p">UH,VH,WH:高側開關元件的驅動訊號(驅動訊號)</p>  
        <p type="p">UL,VL,WL:低側開關元件的驅動訊號(驅動訊號)</p>  
        <p type="p">V:V相</p>  
        <p type="p">Vu:U相電壓</p>  
        <p type="p">W:W相</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1438" publication-number="202610545"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610545.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610545</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126151</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經口用組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A23F5/22</main-classification>  
        <further-classification edition="201601120251201B">A23L33/105</further-classification>  
        <further-classification edition="200601120251201B">C07C69/732</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林由典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田村亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMURA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種綠原酸類及奎尼酸之酸味被抑制之經口用組合物。 &lt;br/&gt;本發明係一種經口用組合物，其含有以下成分(A)、(B)及(C)： &lt;br/&gt;(A)綠原酸類 0.01質量%以上50質量%以下、 &lt;br/&gt;(B)奎尼酸、及 &lt;br/&gt;(C)異戊酸，且 &lt;br/&gt;成分(A)與成分(B)之質量比[(B)/(A)]為0.01以上0.1以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1439" publication-number="202612563"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612563.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612563</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126155</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造顯示設備之方法及設備</chinese-title>  
        <english-title>METHODS AND APPARATUS FOR MANUFACTURING A DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251204B">H10H29/854</main-classification>  
        <further-classification edition="202501120251204B">H10H29/855</further-classification>  
        <further-classification edition="202501120251204B">H10H29/80</further-classification>  
        <further-classification edition="202501120251204B">H10H29/49</further-classification>  
        <further-classification edition="202501120251204B">H10H29/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡諾　尚恩馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARNER, SEAN MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　沈平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHENPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕斯戴爾　大衛安祖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PASTEL, DAVID ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包　艾倫王</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAO, ALLEN WANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉建偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JIANWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬修　詹姆士羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATTHEWS, JAMES ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示設備包括：一基板；複數個發光二極體，其耦接至該基板；及一間隔構件，其耦接至該基板且定位於一第一發光二極體與一第二發光二極體之間的一間隙中。該間隔構件包括可處置高溫之一半導體材料、一無機材料或一有機材料。該顯示設備包括位於該複數個發光二極體及該間隔構件上方之一光學透明黏著劑。該光學透明黏著劑藉由該間隔構件與該基板間隔開。該顯示設備包括耦接至該光學透明黏著劑之一光散射層。該顯示設備包括耦接至該光散射層之一玻璃層。提供製造一顯示設備之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus includes a substrate, a plurality of light emitting diodes coupled to the substrate, and a spacing member coupled to the substrate and positioned in a gap between a first light emitting diode and a second light emitting diode. The spacing member includes a semiconductor material, an inorganic material, or an organic material which can handle high temperature. The display apparatus includes an optically clear adhesive over the plurality of light emitting diodes and the spacing member. The optically clear adhesive is spaced apart from the substrate by the spacing member. The display apparatus includes a light scattering layer coupled to the optically clear adhesive. The display apparatus includes a glass layer coupled to the light scattering layer. Methods of manufacturing a display apparatus are provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2-2:線</p>  
        <p type="p">4:環</p>  
        <p type="p">101:顯示設備</p>  
        <p type="p">103:基板</p>  
        <p type="p">104:發光方向</p>  
        <p type="p">105:發光二極體</p>  
        <p type="p">107:光學透明黏著劑</p>  
        <p type="p">109:光散射層</p>  
        <p type="p">111:玻璃層</p>  
        <p type="p">119:間隙</p>  
        <p type="p">121:間隔構件</p>  
        <p type="p">123:第一間隔構件表面</p>  
        <p type="p">125:第二間隔構件表面</p>  
        <p type="p">131:第一發光二極體</p>  
        <p type="p">133:第二發光二極體</p>  
        <p type="p">141:間隔構件高度</p>  
        <p type="p">143:二極體高度</p>  
        <p type="p">147:間隔構件寬度</p>  
        <p type="p">149:間隙寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1440" publication-number="202612059"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612059.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612059</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126156</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在處理腔室中使用的薄面板設計</chinese-title>  
        <english-title>THIN FACEPLATE DESIGN FOR USE IN A PROCESSING CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/67</main-classification>  
        <further-classification edition="200601120251210B">C23C16/455</further-classification>  
        <further-classification edition="200601120251210B">F16L51/00</further-classification>  
        <further-classification edition="200601120251210B">F16J15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　段安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, TUAN ANH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅恰　朱安Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROCHA, JUAN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例通常涉及一種面板，包括用於半導體處理腔室的熱膨脹部分。在一或多個實施例中，用於處理腔室的面板包含內部部分。內部部分包括複數個孔。面板還包括具有環狀的外部部分，該外部部分圍繞內部部分。面板還包括熱膨脹部分，其厚度小於內部部分的厚度和外部部分的厚度。熱膨脹部分將內部部分與外部部分連接。熱膨脹部分被配置為在內部部分膨脹時變形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure generally relate to a faceplate including a thermal expansion section for use in a semi-conductor processing chamber. In one or more embodiments, a faceplate for a process chamber includes an inner section. The inner section includes a plurality of apertures. The faceplate further includes an outer section having a ring shape. The outer section surrounds the inner section. The faceplate further includes a thermal expansion section having a thickness less than a thickness of the inner section and a thickness the outer section. The thermal expansion section connects the inner section and the outer section. The thermal expansion section is configured to deform when the inner section expands.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">118:面板</p>  
        <p type="p">119:孔</p>  
        <p type="p">202:內部部分</p>  
        <p type="p">204:外部部分</p>  
        <p type="p">206:熱膨脹部分/外部部分</p>  
        <p type="p">D1:外徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1441" publication-number="202612336"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612336.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612336</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126164</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於Ｖ－ＤＭＣ的提升參數語法精化</chinese-title>  
        <english-title>LIFTING PARAMETER SYNTAX REFINEMENTS FOR V-DMC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251201B">H04N19/70</main-classification>  
        <further-classification edition="200601120251201B">G06T9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范德奧維拉　吉爾特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DER AUWERA, GEERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉瑪蘇拉莫尼安　艾達希克里斯南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMASUBRAMONIAN, ADARSH KRISHNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡達　瑞圖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOODA, REETU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿克塔　安尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKHTAR, ANIQUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾切維奇　瑪塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARCZEWICZ, MARTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於解碼經編碼網格資料的裝置經組態以：接收第一旗標，其中該第一旗標的第一值指示待更新提升變換參數，且該旗標的第二值指示不更新該等提升變換參數；回應於該第一旗標等於該第一值而接收一第二旗標，其中該第二旗標的一第一值指示在一細節層級(LoD)層級傳訊提升變換參數，且該第二旗標的一第二值指示不在該LoD層級傳訊該等提升變換參數；回應於該第二旗標等於該第二值而更新該等提升變換參數；基於該等提升變換參數來判定經更新提升變換參數；且基於該等經更新提升變換參數來判定位移向量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for decoding encoded mesh data is configured to receive a first flag, wherein a first value of the first flag indicates lifting transform parameters are to be updated and a second value for the flag indicates the lifting transform parameters are not to be updated; receive a second flag in response to the first flag being equal to the first value, wherein a first value for the second flag indicates lifting transform parameters are signaled at a level of detail (LoD) level and a second value for the second flag indicates the lifting transform parameters are not signaled at the LoD level; update the lifting transform parameters in response to the second flag being equal to the second value; determine updated lifting transform parameters based on the lifting transform parameters; and determine displacement vectors based on the updated lifting transform parameters.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1302~1320:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1442" publication-number="202610685"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610685.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610685</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126170</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有減少的固態反應的穩定製劑</chinese-title>  
        <english-title>STABLE FORMULATIONS WITH REDUCED SOLID STATE REACTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">A61K47/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古普塔　奈哈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, NEHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加納帕西　巴拉吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANAPATHY, BALAJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴納特　蘇吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEBNATH, SUJIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡丹　安庫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADAM, ANKUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於一種包括經塗覆的成分顆粒的穩定藥物組成物，以及其用於減少固態反應的用途。亦提供了用於製造此類穩定藥物組成物的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure is directed at a stable pharmaceutical composition comprising a coated ingredient particle, and the use thereof for reducing solid state reactions. Methods for manufacturing such an stable pharmaceutical composition are also provided.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1443" publication-number="202610637"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610637.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610637</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種雜芳基類化合物、其製備方法及其在醫藥上的應用</chinese-title>  
        <english-title>A HETEROARYL COMPOUND, A PREPARATION METHOD THEREOF AND A MEDICAL USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/513</main-classification>  
        <further-classification edition="200601120251201B">A61K31/506</further-classification>  
        <further-classification edition="200601120251201B">A61K31/501</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4985</further-classification>  
        <further-classification edition="200601120251201B">C07D239/47</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification>  
        <further-classification edition="200601120251201B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHIGAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳凌翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LINGXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛東昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, DONGSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董文明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, WENMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝志超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, ZHICHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種雜芳基類化合物、其製備方法及其在醫藥上的應用。具體而言，本揭露涉及一種通式(I)所示的雜芳基類化合物、其製備方法及含有該雜芳基類化合物的醫藥組成物以及其作為治療劑的用途，特別是作為BTK抑制劑或降解劑的用途和在製備用於治療和/或預防BTK介導的或依賴性的疾病或病症的藥物中的用途。其中通式(I)中各基團如說明書中所定義。</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="142px" width="426px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a heteroaryl compound, a preparation method thereof and a medical use thereof. In particular, the present disclosure relates to a heteroaryl compound shown in general formula (I), its preparation method, a pharmaceutical composition containing such heteroaryl compound and its use as a therapeutic agent, especially as a BTK inhibitor or degrader, and its use in the preparation of a medicament for the treatment and/or prevention a BTK-mediated or dependent disease or condition. Wherein each group in the general formula (I) is as defined in the specification.</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="134px" width="429px" file="d10003.TIF" alt="化學式ed10003.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10003.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1444" publication-number="202611331"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611331.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611331</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126212</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體晶圓製程期間之反應器裝置之控制之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR REACTOR APPARATUS CONTROL DURING SEMICONDUCTOR WAFER PROCESSES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C23C16/46</main-classification>  
        <further-classification edition="200601120251201B">C23C16/52</further-classification>  
        <further-classification edition="200601120251201B">H01L21/205</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　慶旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, QINGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅托斯　查爾斯　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOTTES, CHARLES R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李伯特　傑佛瑞　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIBBERT, JEFFREY L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種在一沈積製程期間操作一反應器裝置之方法，其包含：控制該反應器裝置以起始該沈積製程；接收來自定位於該反應器裝置之各自區中之溫度感測器之溫度回饋信號；在至少兩個製程步驟之各製程步驟期間：對自該等溫度感測器接收之該等溫度回饋信號應用一組各自偏移，其中針對各製程步驟應用之該組偏移係針對該各自製程步驟預定以控制半導體晶圓在該各自製程步驟之後的一特性；及向各定位於該反應器裝置之該等區之一者中之加熱器件傳輸功率指令，其中該等功率指令係藉由使用具有該所應用組偏移之該等溫度回饋信號及用於該各自製程步驟之一目標溫度執行回饋控制來判定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of operating a reactor apparatus during a deposition process includes controlling the reactor apparatus to initiate the deposition process; receiving temperature feedback signals from temperature sensors positioned in respective zones of the reactor apparatus; during each process step of at least two process steps: applying a respective set of offsets to the temperature feedback signals received from the temperature sensors, wherein the set of offsets applied for each process step are predetermined for the respective process step to control a characteristic of the semiconductor wafer following the respective process step; and transmitting power instructions to heating devices each positioned in one of the zones of the reactor apparatus, wherein the power instructions are determined by executing feedback control using the temperature feedback signals with the applied set of offsets and a target temperature for the respective process step.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:製程流程</p>  
        <p type="p">902:控制</p>  
        <p type="p">904:接收</p>  
        <p type="p">906:應用</p>  
        <p type="p">908:應用</p>  
        <p type="p">910:執行</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1445" publication-number="202611458"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611458.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611458</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126272</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於氣體純化熱回收系統之緊密型熱交換器</chinese-title>  
        <english-title>COMPACT HEAT EXCHANGERS FOR GAS PURIFICATION HEAT RECOVERY SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">F28D9/00</main-classification>  
        <further-classification edition="200601120251210B">F28F13/08</further-classification>  
        <further-classification edition="200601120251210B">F28F3/12</further-classification>  
        <further-classification edition="200601120251210B">B01D53/34</further-classification>  
        <further-classification edition="200601120251210B">F28F13/06</further-classification>  
        <further-classification edition="200601120251210B">F28F3/02</further-classification>  
        <further-classification edition="200601120251210B">F28F27/02</further-classification>  
        <further-classification edition="201701120251210B">B29C64/00</further-classification>  
        <further-classification edition="201501120251210B">B33Y80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦桑塔古瑪　亞拉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VASANTHAKUMAR, ARAVIND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古達蒂　蘇巴斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUDDATI, SUBHASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　學豫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEO, EGNATIUS XUE YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王城城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENGCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路克曼　艾爾蘇菲安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUKMAN, ELSUFYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里菲　蒙特雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEAVY, MONTRAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾頓　布魯斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILTON, BRUCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑克森　米契爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JACKSON, MITCHELL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種熱交換器，其包含具有用於熱及冷流體之相異入口及出口之一圍封殼。該圍封殼亦容置包含界定熱及冷流體通道組之一分區之一熱交換器芯。此分區具備一冷流體通道與一熱流體通道之間之一共同邊界，促成該等熱與冷流體之間之熱交換。該分區經設計使得至少一些冷流體通道展現沿著其等延伸部在每單位長度之該共同邊界之面積上之變動。此等改變經設計以促進該等冷與熱流體之間之一預定且經最佳化熱交換，增加熱交換器之效率且提供一緊密型且良好結構化構形中之經增強熱效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat exchanger includes an enclosure with distinct inlets and outlets for hot and cold fluids. The enclosure also houses a heat exchanger core, which includes a partition defining sets of hot and cold fluid channels. This partition features a common boundary between a cold fluid channel and a hot fluid channel facilitating heat exchange between the hot and cold fluids. The partition is designed such that at least some cold fluid channels exhibit variations in the common boundary's area per unit length along their extensions. These changes are designed to promote a predetermined and optimized heat exchange between the cold and hot fluids, increasing heat exchanger's efficiency and offering enhanced thermal performance in a compact and well-structured configuration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p>  
        <p type="p">420:週期性晶格結構</p>  
        <p type="p">422:胞元</p>  
        <p type="p">424A:第一區</p>  
        <p type="p">424B:第二區</p>  
        <p type="p">426:轉變區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1446" publication-number="202612060"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612060.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612060</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126279</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於減少基板翹曲的方法及處理腔室</chinese-title>  
        <english-title>METHOD AND PROCESSING CHAMBER FOR REDUCING WARPAGE OF A SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/67</main-classification>  
        <further-classification edition="200601120251201B">C23C16/455</further-classification>  
        <further-classification edition="200601120251201B">C23C16/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格羅內特　克里斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRONET, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯洛斯　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURROWS, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川　大衛正幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, DAVID MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　勁文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KELVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露一種在處理腔室中包括的翹曲控制方法和翹曲控制系統。翹曲控制方法包括透過包含複數個可獨立控制加熱區域的加熱組件來加熱基板，基於第一波長的輻射來測量基座的背部溫度，基於第二波長的輻射來測量基板的頂側溫度，基於第三波長的輻射來測量基板的曲率，並根據背部溫度、頂側溫度和曲率來控制加熱組件。翹曲控制系統包括設置於基板上方的第一熱感測器和翹曲感測器、設置於基板下方的第二熱感測器、加熱組件，和與加熱組件、第一熱感測器、第二熱感測器以及翹曲感測器耦合的控制器，用於控制基板的翹曲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are a warpage control method and system for warpage control included in a processing chamber. The warpage control method includes heating a substrate by a heating assembly comprising a plurality of independently controllable heating zones, measuring a backside temperature of a susceptor based on radiation at a first wavelength, measuring a topside temperature of the substrate based on radiation at a second wavelength, measuring a curvature of the substrate based on radiation at a third wavelength, and controlling the heating assembly based on the backside temperature, the topside temperature, and the curvature. The warpage control system includes a first thermal sensor and an warp sensor disposed above a substrate, a second thermal sensor disposed below the substrate, a heating assembly, and a controller coupled with the heating assembly, the first thermal sensor, the second thermal sensor, and the warp sensor for controlling the warpage of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:翹曲控制方法</p>  
        <p type="p">602:操作</p>  
        <p type="p">604:操作</p>  
        <p type="p">606:操作</p>  
        <p type="p">608:操作</p>  
        <p type="p">610:操作</p>  
        <p type="p">612:操作</p>  
        <p type="p">614:操作</p>  
        <p type="p">616:操作</p>  
        <p type="p">618:操作</p>  
        <p type="p">620:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1447" publication-number="202612180"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612180.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612180</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126291</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器設備及方法</chinese-title>  
        <english-title>ELECTRICAL CONNECTOR APPARATUS AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251201B">H01R12/72</main-classification>  
        <further-classification edition="200601120251201B">H01R13/514</further-classification>  
        <further-classification edition="200601120251201B">H01R13/506</further-classification>  
        <further-classification edition="201101120251201B">H01R13/6587</further-classification>  
        <further-classification edition="201101120251201B">H01R13/6589</further-classification>  
        <further-classification edition="201101120251201B">H01R13/6474</further-classification>  
        <further-classification edition="201101120251201B">H01R13/6471</further-classification>  
        <further-classification edition="201101120251201B">H01R13/646</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商山鐵克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMTEC, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆瑟　蘭德爾　尤金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSSER, RANDALL EUGENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒙古爾德　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONGOLD, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水村晶範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUMURA, AKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種如本文中描述之電連接器設備及方法。該電連接器可包含一插頭連接器。該電連接器可包含一契合介面。該契合介面可包含複數個板。該電連接器可包含一基板。該電連接器可包含一纜線連接器。該電連接器可至少具有每平方英寸至少213個差動對，包含每平方英寸256個差動對之一密度。該電連接器可包含至少一個內部及/或外部鎖定機構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector apparatus and method as described herein. The electrical connector may include a plug connector. The electrical connector may include a mating interface. The mating interface may include a plurality of plates. The electrical connector may include a substrate. The electrical connector may include a cable connector. The electrical connector may have at least a density of at least 213 differential pairs per square inch, including 256 differential pairs per square inch. The electrical connector may include at least one internal and/or external locking mechanism.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32:間隙/空間</p>  
        <p type="p">42:電/信號接觸件</p>  
        <p type="p">50:電路基板</p>  
        <p type="p">62:互鎖/互連板/蛋簍型屏蔽件/第一部分</p>  
        <p type="p">62c:第三/相對/平行板</p>  
        <p type="p">62d:第四/平行板</p>  
        <p type="p">82b:內部/中間面板</p>  
        <p type="p">90:纜線</p>  
        <p type="p">120:電連接器總成</p>  
        <p type="p">171:信號導體/電/信號接觸件/單端接觸件</p>  
        <p type="p">173:母屏蔽接觸件/臂</p>  
        <p type="p">174:公屏蔽接觸件</p>  
        <p type="p">175:突出部件/殼體部件</p>  
        <p type="p">260:纜線或契合連接器</p>  
        <p type="p">270:電/板連接器</p>  
        <p type="p">R1:第一陣列/列</p>  
        <p type="p">R2:第二陣列/列</p>  
        <p type="p">R3:第三列</p>  
        <p type="p">R162:列/陣列/蛋簍型屏蔽列</p>  
        <p type="p">R262:列/陣列/蛋簍型屏蔽列</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1448" publication-number="202611511"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611511.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611511</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126292</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量測系統、量測方法、及資訊處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">G01N33/483</main-classification>  
        <further-classification edition="200601120251211B">C12M1/34</further-classification>  
        <further-classification edition="201701120251211B">G06T7/11</further-classification>  
        <further-classification edition="200601120251211B">G01R27/02</further-classification>  
        <further-classification edition="200601120251211B">G01N27/327</further-classification>  
        <further-classification edition="200601120251211B">B81B7/04</further-classification>  
        <further-classification edition="201901120251211B">G16B40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀江寿雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIE, JUUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木郁郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, IKURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤祐理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, YURI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本技術係關於一種可以更高精度且短時間內特定關注區域之量測系統、量測方法、及資訊處理方法。 &lt;br/&gt;本發明之量測系統具備：控制部，其對配置於培養有細胞之孔內之MEA具有之複數個電極之各者，進行基於與由電極自身之量測獲得之量測資訊不同之其他量測資訊之處理，藉此來特定關注區域，且僅使用關注區域內包含之電極來進行新量測、或自複數個電極之量測資訊刪除關注區域內包含之電極以外之電極之量測資訊。本技術可應用於量測系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:量測系統</p>  
        <p type="p">21:MEA晶片</p>  
        <p type="p">22:讀出電路基板</p>  
        <p type="p">23:FPGA</p>  
        <p type="p">24:量測PC</p>  
        <p type="p">25:顯微鏡</p>  
        <p type="p">26:孔</p>  
        <p type="p">31:控制部</p>  
        <p type="p">32:存儲裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1449" publication-number="202611030"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611030.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611030</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126311</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於合成化合物之方法</chinese-title>  
        <english-title>METHODS FOR SYNTHESIZING COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D249/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉桑堤蘭　瓦古萊簡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALASANTHIRAN, VAGULEJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭曼　史考特　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANEMAN, SCOTT A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾朗姆　科　馬赫富茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALAM, KH MAHFUZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克爾米西　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KERMIS, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於合成化合物之方法。一種合成化合物之方法包括獲得包括α鹵化物基團及保護基團之化合物；及使該化合物與足以去除該保護基團(去保護)並將該α鹵化物基團轉化為烯基、醛或其任何組合中之至少一者之至少一種試劑接觸以獲得高純度之反應產物。尤其亦提供相關組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for synthesizing compounds are provided. A method of synthesizing a compound comprises obtaining a compound comprising an alpha halide group and a protecting group; and contacting the compound with at least one reagent sufficient to remove the protecting group (deprotect) and convert the alpha halide group to at least one of an alkenyl, an aldehyde, or any combination thereof, to obtain a reaction product at high purity. Related compositions are also provided, among other things.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:合成方法</p>  
        <p type="p">102:步驟</p>  
        <p type="p">104:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1450" publication-number="202611284"> 
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      <tif no="1" file="202611284.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611284</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理液及其使用方法</chinese-title>  
        <english-title>TREATMENT SOLUTION AND METHOD OF USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C11D7/32</main-classification>  
        <further-classification edition="200601120251201B">C11D7/50</further-classification>  
        <further-classification edition="200601120251201B">G03F7/42</further-classification>  
        <further-classification edition="200601120251201B">B08B3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本化藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲垣真也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INAGAKI, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種處理液，其係因光阻剝離性優異，且保存安定性，尤其在低溫下之保存安定性優異，故實用性極高。 &lt;br/&gt;本發明之處理液，係具有下述通式(1)所示的(A)四級銨鹽、(B)烷醇胺、及(C)二醇系溶劑； &lt;br/&gt;[NR&lt;sup&gt;1&lt;/sup&gt;R&lt;sup&gt;2&lt;/sup&gt;R&lt;sup&gt;3&lt;/sup&gt;R&lt;sup&gt;4&lt;/sup&gt;]&lt;sup&gt;+&lt;/sup&gt;[OH]&lt;sup&gt;-&lt;/sup&gt;　…(1) &lt;br/&gt;式中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;可互為相同或相異，係碳數1至6之烷基、碳數7至10之芳基烷基、或碳數6至10之芳基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Proposed in the present invention is a highly practical treatment solution that exhibits excellent photoresist stripping properties and excellent storage stability, especially at low temperatures. &lt;br/&gt;A treatment solution according to the present invention contains (A) a quaternary ammonium salt represented by general formula (1) below, (B) an alkanolamine, and (C) a glycol-based solvent. &lt;br/&gt;[NR&lt;sup&gt;1&lt;/sup&gt;R&lt;sup&gt;2&lt;/sup&gt;R&lt;sup&gt;3&lt;/sup&gt;R&lt;sup&gt;4&lt;/sup&gt;] + [OH]&lt;sup&gt;-&lt;/sup&gt; ... (1) &lt;br/&gt;In the formula, R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, and R&lt;sup&gt;4&lt;/sup&gt; may be the same or different and represent an alkyl group having 1 to 6 carbon atoms, an arylalkyl group having 7 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1451" publication-number="202610653"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610653.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610653</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126365</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療疾病之螺環KRAS抑制劑</chinese-title>  
        <english-title>SPIROCYCLIC KRAS INHIBITORS FOR TREATING DISEASE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/553</main-classification>  
        <further-classification edition="200601120251201B">A61K31/5365</further-classification>  
        <further-classification edition="200601120251201B">A61K31/519</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4985</further-classification>  
        <further-classification edition="200601120251201B">A61K31/42</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4188</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4162</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4155</further-classification>  
        <further-classification edition="200601120251201B">A61K31/403</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商榮山醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOSSOMHILL THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔　景榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUI, JINGRONG JEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芮　元金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUI, EUGENE YUANJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅傑斯　伊凡　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROGERS, EVAN W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於靶向KRAS之螺環化合物、含有該等化合物之醫藥組合物及使用該等化合物治療諸如癌症之疾病的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to spirocyclic compounds targeting KRAS, pharmaceutical compositions containing the compounds, and methods of using such compounds to treat disease, such as cancer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1452" publication-number="202610617"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610617.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610617</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126388</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陽離子脂質、包含其之脂質奈米顆粒及傳遞核酸之方法</chinese-title>  
        <english-title>CATIONIC LIPIDS, LIPID NANOPARTICLES COMPRISING THE SAME AND METHODS OF DELIVERING NUCLEIC ACIDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">A61K9/127</main-classification>  
        <further-classification edition="202501120251201B">A61K9/1271</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉吉賽帝　錢德拉爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAGISETTI, CHANDRAIAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛堤　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAUDETTE, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾　國賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSANG, KWOK YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞達米　羅傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADAMI, ROGER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杨　怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德賽　迪堤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESAI, DITI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾爾頓　溫蒂　蜜雪兒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNOWLTON, WENDY MICHELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杨　春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種陽離子脂質、一種含有該陽離子脂質之脂質奈米顆粒，及一種將囊封於該脂質奈米顆粒中之核酸傳遞至細胞或個體之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cationic lipid, a lipid nanoparticle containing the cationic lipid, and a method of delivering a nucleic acid encapsulated in the lipid nanoparticle to a cell or a subject.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1453" publication-number="202610618"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610618.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610618</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126389</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陽離子脂質、包含其之脂質奈米顆粒及傳遞核酸之方法</chinese-title>  
        <english-title>CATIONIC LIPIDS, LIPID NANOPARTICLES COMPRISING THE SAME AND METHODS OF DELIVERING NUCLEIC ACIDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">A61K9/127</main-classification>  
        <further-classification edition="202501120251201B">A61K9/1271</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉吉賽帝　錢德拉爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAGISETTI, CHANDRAIAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛堤　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAUDETTE, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種陽離子脂質、一種含有該陽離子脂質之脂質奈米顆粒，及一種將囊封於該脂質奈米顆粒中之核酸傳遞至細胞或個體之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cationic lipid, a lipid nanoparticle containing the cationic lipid, and a method of delivering a nucleic acid encapsulated in the lipid nanoparticle to a cell or a subject.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1454" publication-number="202611079"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611079.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611079</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126431</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＣＤ８結合多肽及使用方法</chinese-title>  
        <english-title>CD8 BINDING POLYPEPTIDES AND METHODS OF USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/28</main-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">C12N15/13</further-classification>  
        <further-classification edition="200601120251201B">C12N15/86</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商歐特佩斯生物股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OUTPACE BIO, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝可　勞拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAKER, LAURA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德文波特　塔底烏斯　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVENPORT, THADDEUS M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德薩特拉　約瑟夫　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESAUTELLE, JOSEPH E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈默森　布拉德利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMERSON, BRADLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉喬伊　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAJOIE, MARC JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊諾克斯　普拉葛林　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LENOX-PULGARIN, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林斯納　蜜雪兒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LISSNER, MICHELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>墨菲特　豪威爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOFFETT, HOWELL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏茲納　布萊恩　道格拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEITZNER, BRIAN DOUGLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁　蜀軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, SHUJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於新穎的CD8結合多肽、其結合物及其使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to novel CD8 binding polypeptides, conjugates thereof, and methods of use thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1455" publication-number="202610936"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610936.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610936</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126435</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱塑性樹脂組成物及樹脂成形體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251212B">C01B32/158</main-classification>  
        <further-classification edition="200601120251212B">C08L101/12</further-classification>  
        <further-classification edition="200601120251212B">C08L69/00</further-classification>  
        <further-classification edition="200601120251212B">C08K3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋色材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOCOLOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢部謙太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YABE, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大川萌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAWA, MOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題可藉由如下熱塑性樹脂組成物來解決，所述熱塑性樹脂組成物包含熱塑性樹脂（A）以及碳奈米管（B），碳奈米管（B）滿足下述（1）及（2）的全部。（1）金屬總含量為10,000 ppm以下。（2）於粉末X射線繞射分析中，（002）面的繞射峰的半值寬為2.0°～6.0°。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1456" publication-number="202610673"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610673.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610673</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126439</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>細菌纖維素於治療或預防氣道疾病的用途</chinese-title>  
        <english-title>USE OF BACTERIAL CELLULOSE IN TREATING OR PREVENTING RESPIRATORY TRACT DISEASES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251021B">A61K31/717</main-classification>  
        <further-classification edition="200601120251021B">A61K9/12</further-classification>  
        <further-classification edition="200601120251021B">A61K9/14</further-classification>  
        <further-classification edition="200601120251021B">A61P11/00</further-classification>  
        <further-classification edition="200601120251021B">A61P11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商益昌納米新材料科技（廣東）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI CHANG NANO NEW MATERIAL TECHNOLOGY (GUANGDONG) CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瓊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, QIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董航明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, HANG MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>禹啟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭思瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, SI HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘柏均</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種細菌纖維素於治療或預防氣道疾病的用途，特別是在治療或預防有關氣道上皮細胞受損的發炎性氣道疾病，例如哮喘，的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a use of bacterial cellulose in treating or preventing respiratory tract diseases, especially a use in treating or preventing inflammatory respiratory tract diseases related to the damage of respiratory epithelial cells such as asthma.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1457" publication-number="202610666"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610666.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610666</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126474</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於活體外轉錄之改良方法</chinese-title>  
        <english-title>IMPROVED METHODS FOR IN VITRO TRANSCRIPTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/7088</main-classification>  
        <further-classification edition="201801120251201B">C12Q1/6844</further-classification>  
        <further-classification edition="200601120251201B">A61K48/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞克圖羅斯醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARCTURUS THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾　布雷特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILL, BRETT DALLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔　京珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, KYOUNG-JOO JENNY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示產生產量增加且RNA降解減少之轉錄RNA產物之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are methods of producing transcribed RNA product with increased yield and reduced RNA degradation.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1458" publication-number="202612103"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612103.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612103</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126477</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用背面加熱調節半導體基板介電層厚度之方法</chinese-title>  
        <english-title>METHODS FOR TUNABLE DIELECTRIC THICKNESS OF A SEMICONDUCTOR SUBSTRATE USING BACK SURFACE HEATING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L21/762</main-classification>  
        <further-classification edition="200601120251204B">B08B3/08</further-classification>  
        <further-classification edition="200601120251204B">B08B3/10</further-classification>  
        <further-classification edition="202501120251204B">H10D62/40</further-classification>  
        <further-classification edition="200601120251204B">C07C45/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林旺樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WANGHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳東朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, DONG-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林振宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JENYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韋婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEITING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHUNWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱永星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YUNG HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳亮欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中描述一種在一單晶半導體基板之一表面上生長一介電層之方法。該方法包含：提供該單晶半導體基板，該單晶半導體基板包含：兩個主要的、大體上平行表面，該等表面之一者係該單晶半導體基板之一正面且該等表面之另一者係該單晶半導體基板之一背面；一圓周邊緣，其結合該等正面及背面；及一塊體區域，其介於該等正面與背面之間；將該正面與包含氧化劑之氧化溶液接觸；及同時將該背面與促成增加該氧化劑與該正面之間的一反應速率之一熱源接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein is a method of growing a dielectric layer on a surface of a single crystal semiconductor substrate. The method includes providing the single crystal semiconductor substrate, the single crystal semiconductor substrate including two major, generally parallel surfaces, one of which is a front surface of the single crystal semiconductor substrate and the other of which is a back surface of the single crystal semiconductor substrate, a circumferential edge joining the front and back surfaces, and a bulk region between the front and back surfaces, contacting the front surface with an oxidizing solution including an oxidizing agent, and simultaneously, contacting the back surface with a heat source that facilitates increasing a reaction rate between the oxidizing agent and the front surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:單晶半導體基板</p>  
        <p type="p">3:正面</p>  
        <p type="p">5:背面</p>  
        <p type="p">7:假想中心平面</p>  
        <p type="p">9:半導體基板塊體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1459" publication-number="202611367"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611367.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611367</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋼製防護柵欄、鋼製防護柵欄用的梁、及鋼製防護柵欄用的梁材料之選定方法</chinese-title>  
        <english-title>STEEL SAFETY FENCE, BEAM FOR STEEL SAFETY FENCE, AND METHOD FOR SELECTING BEAM MATERIAL FOR STEEL SAFETY FENCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">E01F15/02</main-classification>  
        <further-classification edition="200601120251210B">C23C2/06</further-classification>  
        <further-classification edition="200601120251210B">C23C2/28</further-classification>  
        <further-classification edition="200601120251210B">C22C38/00</further-classification>  
        <further-classification edition="200601120251210B">C22C18/00</further-classification>  
        <further-classification edition="200601120251210B">C23C2/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本製鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水信孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, NOBUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中安誠明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYASU, NARIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野晉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤圭一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">鋼製防護柵欄用的梁是由鍍敷鋼材所形成，前述鍍敷鋼材具備：鋼製的母材，板厚為3.2mm以下，並且降伏應力超過400MPa且為800MPa以下；及鍍敷層，被覆前述母材的表面，由Zn-Al-Mg系鍍敷所構成，前述鋼製防護柵欄用的梁具有形成於前述鍍敷鋼材的至少1個端面的切斷端面，前述鍍敷鋼材的板厚為2.0mm以上且小於4.0mm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鋼製防護柵欄</p>  
        <p type="p">12:支柱</p>  
        <p type="p">12A:兩端支柱</p>  
        <p type="p">16:梁</p>  
        <p type="p">31:連接連結具與梁的緊固具(緊固具)</p>  
        <p type="p">32:將梁相互連接的緊固具(緊固具)</p>  
        <p type="p">33:梁與梁的疊合接頭(疊合接頭)</p>  
        <p type="p">UD:上側方向</p>  
        <p type="p">LD:下側方向</p>  
        <p type="p">ID:內側方向</p>  
        <p type="p">OD:外側方向</p>  
        <p type="p">FD:前進方向</p>  
        <p type="p">BD:後退方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1460" publication-number="202611414"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611414.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611414</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126506</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於人力驅動車之碟剎碟盤</chinese-title>  
        <english-title>DISC BRAKE ROTOR FOR HUMAN-POWERED VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251106B">F16D65/84</main-classification>  
        <further-classification edition="200601120251106B">F16D65/12</further-classification>  
        <further-classification edition="200601120251106B">F16D65/092</further-classification>  
        <further-classification edition="200601120251106B">F16D65/04</further-classification>  
        <further-classification edition="200601120251106B">F16D55/22</further-classification>  
        <further-classification edition="200601120251106B">B62L5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山中大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANAKA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷口誠典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGUCHI, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種人力驅動車的碟剎碟盤，其包括一碟盤本體和一第一硬化層。該碟盤本體由至少包含不銹鋼的基材製成。第一硬化層由具有比該基材硬度更高的第一硬度之第一材料製成。第一硬化層可與碟剎卡鉗的第一剎車來令片接觸。碟盤本體具有沿著與碟剎碟盤的旋轉軸線平行之軸向限定厚度。該第一硬化層具有定義在該軸向內的一第一厚度。第一厚度與該碟盤本體的厚度之比率從0.04至0.2。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A disc brake rotor for a human-powered vehicle comprises a rotor body and a first hardened layer. The rotor body is made of a base material including at least stainless steel. The first hardened layer is made of a first material having first hardness higher than hardness of the base material. The first hardened layer is contactable with a first brake pad of a disc brake caliper. The rotor body has a thickness defined in an axial direction parallel to a rotational axis of the disc brake rotor. The first hardened layer has a first thickness defined in the axial direction. A ratio of the first thickness to the thickness of the rotor body ranges from 0.04 to 0.2.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:碟剎卡鉗</p>  
        <p type="p">6A:第一剎車來令片</p>  
        <p type="p">6B:第二剎車來令片</p>  
        <p type="p">10:碟剎碟盤</p>  
        <p type="p">16:碟盤本體</p>  
        <p type="p">16A:第一軸表面</p>  
        <p type="p">16B:第二軸表面</p>  
        <p type="p">20:臂</p>  
        <p type="p">24:第一摩擦表面</p>  
        <p type="p">26:第二摩擦表面</p>  
        <p type="p">28:第一硬化層</p>  
        <p type="p">28A:第一表面</p>  
        <p type="p">30:第二硬化層</p>  
        <p type="p">30A:第二表面</p>  
        <p type="p">32:一個開口</p>  
        <p type="p">A1:旋轉軸線</p>  
        <p type="p">D1:軸向</p>  
        <p type="p">T0:厚度</p>  
        <p type="p">T1:第一厚度</p>  
        <p type="p">T2:第二厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1461" publication-number="202610994"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610994.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610994</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二氧化碳吸收劑、二氧化碳之回收方法及二氧化碳分離回收裝置</chinese-title>  
        <english-title>CARBON DIOXIDE ABSORBENT, METHOD FOR RECOVERING CARBON DIOXIDE, AND APPARATUS FOR CARBON DIOXIDE SEPARATION AND RECOVERY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C211/17</main-classification>  
        <further-classification edition="200601120251201B">C07C211/27</further-classification>  
        <further-classification edition="200601120251201B">B01D53/14</further-classification>  
        <further-classification edition="200601120251201B">B01D53/18</further-classification>  
        <further-classification edition="200601120251201B">B01D53/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川島裕貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASHIMA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河野和起</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOUNO, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為含有下述通式(1)表示之胺化合物(A)之二氧化碳吸收劑、使用了該二氧化碳吸收劑的二氧化碳之回收方法、及二氧化碳分離回收裝置。 &lt;br/&gt;H&lt;sub&gt;2&lt;/sub&gt;N-(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;m&lt;/sub&gt;-X-(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;-NHR&lt;sup&gt;1&lt;/sup&gt;   (1) &lt;br/&gt;式(1)中，X為伸苯基或伸環己基，R&lt;sup&gt;1&lt;/sup&gt;為碳數3~6之脂肪族烴基。m及n分別獨立地為1~6之數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A carbon dioxide absorbent containing an amine compound (A) represented by general formula (1), &lt;br/&gt;a method for recovering carbon dioxide using the absorbent, &lt;br/&gt;and an apparatus for the separation and recovery of carbon dioxide. &lt;br/&gt;H&lt;sub&gt;2&lt;/sub&gt;N-(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;m&lt;/sub&gt;-X-(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;-NHR&lt;sup&gt;1&lt;/sup&gt;&lt;br/&gt;(In formula (1), X represents a phenylene group or a cyclohexylene group; R&lt;sup&gt;1&lt;/sup&gt;represents an aliphatic hydrocarbon group having 3 to 6 carbon atoms; m and n are independently integers from 1 to 6.)</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1462" publication-number="202612037"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612037.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612037</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126529</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於接合基板之方法及設備</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR BONDING SUBSTRATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01L21/60</main-classification>  
        <further-classification edition="200601120251205B">H01L21/687</further-classification>  
        <further-classification edition="200601120251205B">H01L23/34</further-classification>  
        <further-classification edition="200601120251205B">C23C16/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倪祺佩洛　安得列</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKIPELOV, ANDREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種將一第一基板接合至一第二基板之方法，該第一基板包含一第一接合表面及自該第一接合表面突出或與該第一接合表面齊平或自該第一接合表面凹入之第一導電襯墊，且該第二基板包含一第二接合表面及自該第二接合表面突出或與該第二接合表面齊平或自該第二接合表面凹入之第二導電襯墊，該方法包含：減小該第一接合表面與該第二接合表面之間的一距離；將一介電層選擇性地沉積至該第一接合表面及/或該第二接合表面上以填充該第一接合表面與該第二接合表面之間的一間隙，惟在該等第一導電襯墊及該等第二導電襯墊之位置處除外；及促使該等第一導電襯墊中之各者與該等第二導電襯墊中之一各別者電接觸以便獲得一經接合基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method of bonding a first substrate to a second substrate, the first substrate comprising a first bonding surface and first electrically conductive pads protruding from, or levelled with, or recessed from the first bonding surface and the second substrate comprising a second bonding surface and second electrically conductive pads protruding from, or levelled with, or recessed from the second bonding surface, the method comprising: reducing a distance between the first bonding surface and the second bonding surface; selectively depositing a dielectric layer onto the first bonding surface and/or the second bonding surface to fill a gap between the first and second bonding surface except at the locations of the first and second electrically conductive pads; and bringing each of the first electrically conductive pads into electrical contact with a respective one of the second electrically conductive pads so as to obtain a bonded substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">710:步驟/方法步驟</p>  
        <p type="p">ACT1:第一致動器/致動器</p>  
        <p type="p">ACT2:第二致動器/致動器</p>  
        <p type="p">BL1:第一瘤節</p>  
        <p type="p">BL2:第二瘤節</p>  
        <p type="p">BS1:第一接合表面/接合表面</p>  
        <p type="p">BS2:第二接合表面/接合表面</p>  
        <p type="p">CS1:第一夾頭支撐件</p>  
        <p type="p">CS2:第二夾頭支撐件</p>  
        <p type="p">DF1:第一可變形層</p>  
        <p type="p">DF2:第二可變形層</p>  
        <p type="p">EC1:第一基板夾頭/頂部靜電夾頭/第一(頂部)基板夾頭</p>  
        <p type="p">EC2:第二靜電夾頭/底部靜電夾頭/第二(底部)基板夾頭</p>  
        <p type="p">MP1:第一金屬襯墊/金屬襯墊</p>  
        <p type="p">MP2:第二金屬襯墊/金屬襯墊</p>  
        <p type="p">P1:橫向平面</p>  
        <p type="p">P2:橫向平面</p>  
        <p type="p">PU:處理單元/處理器</p>  
        <p type="p">US1:第一上表面</p>  
        <p type="p">US2:第二上表面</p>  
        <p type="p">W1:第一基板/第一晶圓/經接合晶圓</p>  
        <p type="p">W2:第二基板/第二晶圓/經接合晶圓</p>  
        <p type="p">X:X軸</p>  
        <p type="p">Y:Y軸</p>  
        <p type="p">Z:Z軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1463" publication-number="202610667"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610667.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610667</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126532</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於寡核苷酸之口服投予的新穎調配物</chinese-title>  
        <english-title>NOVEL FORMULATIONS FOR ORAL ADMINISTRATION OF OLIGONUCLEOTIDES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">A61K31/7088</main-classification>  
        <further-classification edition="200601120251203B">A61K47/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布拉布約格　拉斯　英格斯萊夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLAABJERG, LASSE INGERSLEV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉默茨　延斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAMERZ, JENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧利維拉　維倫　菲力普　約瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLIVEIRA VARUM, FELIPE JOSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了用於向患者口服遞送寡核苷酸的新穎醫藥組成物，以及該等組成物之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides novel pharmaceutical compositions for oral delivery of an oligonucleotide to a patient, as well as uses of those compositions.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1464" publication-number="202612061"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612061.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612061</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體面板外殼</chinese-title>  
        <english-title>GAS PANEL ENCLOSURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/67</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佟明樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, MINGLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露的是氣體面板外殼，該氣體面板外殼包括分隔板，用於分隔氣體面板的各種部件。在一個實例中，氣體面板組件可能包括外殼，該外殼定義第一、第二和第三腔室，其中第一和第三腔室由分隔件與第二腔室分隔，其中第一腔室連接到排氣裝置，並且該分隔件包括允許流體在第二腔室和第一腔室之間流動的開口。該組件可能包括位於第三腔室內的電氣部件，其中第三腔室和第一腔室由內壁分隔。氣體面板組件還可能包括位於第二腔室內的氣體棒，其中電氣部件由分隔件和內壁與氣體棒組件分隔，以防止流體從第二腔室流向第三腔室。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is a gas panel enclosure including a divider plate for separating various components of the gas panel. In one example, a gas panel assembly may include an enclosure defining first, second, and third chambers, wherein the first and third chambers are separated from the second chamber by a divider, wherein the first chamber is connected to an exhaust, and wherein the divider comprises openings permitting fluid flow between the second and first chambers. The assembly may include electrical components within the third chamber, wherein the third and first chambers are separated by an internal wall. The gas panel assembly may further include a gas sticks within the second chamber, wherein the electrical components are separated from the gas stick assembly by the divider and by the internal wall to prevent fluid flow from the second chamber to the third chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:組件</p>  
        <p type="p">101:氣體面板</p>  
        <p type="p">102:外殼</p>  
        <p type="p">104:主壁</p>  
        <p type="p">106:主壁</p>  
        <p type="p">107:第一壁</p>  
        <p type="p">108:第二壁</p>  
        <p type="p">109:上端壁</p>  
        <p type="p">110:下端壁</p>  
        <p type="p">112:腔室</p>  
        <p type="p">114:腔室</p>  
        <p type="p">116:腔室</p>  
        <p type="p">117:第一側</p>  
        <p type="p">118:隔板</p>  
        <p type="p">119:第二側</p>  
        <p type="p">120:內壁</p>  
        <p type="p">122:上部區域</p>  
        <p type="p">123:下部區域</p>  
        <p type="p">124:排氣裝置</p>  
        <p type="p">125:排氣管</p>  
        <p type="p">126:主部分</p>  
        <p type="p">127:上部區域</p>  
        <p type="p">128:開口</p>  
        <p type="p">128A:上列</p>  
        <p type="p">129:開口</p>  
        <p type="p">130:開口</p>  
        <p type="p">140:開口</p>  
        <p type="p">141:開口</p>  
        <p type="p">D1:第一尺寸</p>  
        <p type="p">D2:第二尺寸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1465" publication-number="202611786"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611786.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611786</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126570</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>域泛化及調適</chinese-title>  
        <english-title>DOMAIN GENERALIZATION AND ADAPTATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">G06N3/08</main-classification>  
        <further-classification edition="202301120251201B">G06N3/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　潔米明杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JAMIE MENJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭吉秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JISOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波里科利　費提穆瑞特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PORIKLI, FATIH MURAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之某些態樣提供用於執行域泛化(domain generalization)之技術，其包括：將第一輸入資料輸入至第一機器學習模型中；由該第一機器學習模型輸出一第二機器學習模型之一超參數之一第一值；將該第一輸入資料、及該超參數之該第一值輸入至該第二機器學習模型中；及由該第二機器學習模型基於該第一輸入資料、及該超參數之該第一值而輸出一第一結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Certain aspects of the present disclosure provide techniques for performing domain generalization, including: inputting first input data into a first machine learning model; outputting, by the first machine learning model, a first value for a hyperparameter of a second machine learning model; inputting the first input data and the first value for the hyperparameter into the second machine learning model; and outputting, by the second machine learning model, a first result based on the first input data and the first value for the hyperparameter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:輸入資料</p>  
        <p type="p">104:機器學習模型；模型</p>  
        <p type="p">106:超參數值</p>  
        <p type="p">108:機器學習模型</p>  
        <p type="p">110:輸出</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1466" publication-number="202610742"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610742.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610742</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126579</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅粒子分散體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">B22F1/052</main-classification>  
        <further-classification edition="202201120251201B">B22F1/054</further-classification>  
        <further-classification edition="202201120251201B">B22F1/0545</further-classification>  
        <further-classification edition="202201120251201B">B22F1/102</further-classification>  
        <further-classification edition="202201120251201B">B22F1/107</further-classification>  
        <further-classification edition="200601120251201B">H01B1/02</further-classification>  
        <further-classification edition="200601120251201B">H01B1/22</further-classification>  
        <further-classification edition="201101120251201B">B82Y30/00</further-classification>  
        <further-classification edition="201101120251201B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江山誉昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EYAMA, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木佑京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, UKYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種保存後之結合強度保持性優異之銅粒子分散體之製造方法，其具有將銅奈米粒子A、銅微粒子B、及分散介質C混合之步驟，且該銅奈米粒子A包含銅粒子a及被覆劑D，該銅奈米粒子A之平均粒徑為50 nm以上300 nm以下，該銅微粒子B係包含銅粒子b及被覆劑E者、或包含該銅粒子b且不含該被覆劑E者，該銅微粒子B之平均粒徑為0.5 μm以上10 μm以下，該銅奈米粒子A與該銅微粒子B之漢森溶解度參數之距離Ra&lt;sub&gt;(A&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;B)&lt;/sub&gt;為9.0 MPa&lt;sup&gt;1/2&lt;/sup&gt;以下。&lt;b&gt;  &lt;/b&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1467" publication-number="202611280"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611280.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611280</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>助焊劑殘餘物除去用清潔劑組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C11D7/24</main-classification>  
        <further-classification edition="200601120251201B">C11D7/26</further-classification>  
        <further-classification edition="200601120251201B">C11D7/32</further-classification>  
        <further-classification edition="200601120251201B">C11D7/36</further-classification>  
        <further-classification edition="200601120251201B">C23G1/24</further-classification>  
        <further-classification edition="200601120251201B">B08B3/08</further-classification>  
        <further-classification edition="200601120251201B">H05K3/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長沼純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGANUMA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛池孝直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEIKE, TAKANAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>照屋友太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERUYA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明於一態樣中提供一種殘留於間隙中之助焊劑殘餘物之除去性優異之助焊劑殘餘物除去用清潔劑組合物。 &lt;br/&gt;本發明於一態樣中係關於一種助焊劑殘餘物除去用清潔劑組合物，其含有下述成分A、成分B及成分C，成分A及成分B之合計與成分C之質量比[(A＋B)/C]超過0.9且未達7.6。 &lt;br/&gt;成分A：於20℃下在水中之溶解度為10質量%以上之二醇醚 &lt;br/&gt;成分B：於20℃下在水中之溶解度未達10質量%之二醇醚 &lt;br/&gt;成分C：烴</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1468" publication-number="202612359"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612359.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612359</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126585</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測距操作的功率最佳化</chinese-title>  
        <english-title>POWER-OPTIMIZATION FOR RANGING OPERATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">H04W4/02</main-classification>  
        <further-classification edition="200901120251201B">H04W48/08</further-classification>  
        <further-classification edition="200901120251201B">H04W40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑德胡　希夫拉吉辛格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANDHU, SHIVRAJ SINGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞西尼亞　阿利雷扎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAISSINIA, ALIREZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於在無線通訊中功率最佳化測距的技術。一種裝置在一通道上傳輸一訊框並從一無線節點獲得一回應。然後，該裝置執行一測距能力交換，與該無線節點共用測距屬性。基於此交換，該裝置協商一測距通道。該裝置定義一可用性窗，該可用性窗具有用於測距工作階段的一固定持續時間，並基於應用程式需求選擇該窗步調的一標稱速率。該裝置將這些參數傳達給該無線節點，從而實現窗之間的省電。在該可用性窗期間，該裝置進行測距測量，且可使用一指定欄位請求參數重新協商。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques for power-optimized ranging in wireless communication. A device transmits a frame on a channel and obtains a response from a wireless node. The device then performs a ranging capability exchange, sharing ranging attributes with the wireless node. Based on this exchange, the device negotiates a ranging channel. It defines an availability window with a fixed duration for ranging sessions and selects a nominal rate for the window’s cadence based on application needs. The device communicates these parameters to the wireless node, enabling power-saving between windows. During availability windows, the device conducts ranging measurements and can request parameter renegotiation using a designated field.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:無線通訊網路</p>  
        <p type="p">302:存取點(AP)</p>  
        <p type="p">304:無線站台(STA)</p>  
        <p type="p">312:中間裝置</p>  
        <p type="p">314:無線通訊裝置</p>  
        <p type="p">316:無線通訊鏈路</p>  
        <p type="p">318:Wi-Fi鏈路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1469" publication-number="202610707"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610707.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610707</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126600</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含微小有用物質之濃縮液之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">B01D11/04</main-classification>  
        <further-classification edition="200601120251208B">B01D15/26</further-classification>  
        <further-classification edition="200601120251208B">B01D29/50</further-classification>  
        <further-classification edition="200601120251208B">B01D61/14</further-classification>  
        <further-classification edition="200601120251208B">C12M3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大賽璐股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAICEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田太史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, FUTOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種製造微小有用物質之濃縮液之方法。 &lt;br/&gt;本發明係設為一種包含微小有用物質之濃縮液之製造方法，其係製造包含微小有用物質之濃縮液之方法，且其包括：向包含微小有用物質之一次液體原料添加山梨醇酐不飽和脂肪酸酯之氧乙烯（oxyethylene）加成物而獲得二次液體原料；及將上述二次液體原料適用於中空纖維膜，將上述二次液體原料濃縮。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:濃縮裝置</p>  
        <p type="p">10:第1槽</p>  
        <p type="p">20:第2槽</p>  
        <p type="p">30:中空纖維膜</p>  
        <p type="p">35:濃縮液回收槽</p>  
        <p type="p">40:三通活栓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1470" publication-number="202610904"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610904.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610904</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126607</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電池單元的標籤貼附裝置及標籤貼附方法</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR ATTACHED LABEL AT BATTERY CELL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">B65C9/26</main-classification>  
        <further-classification edition="200601120251210B">B65C9/28</further-classification>  
        <further-classification edition="200601120251210B">B65C9/30</further-classification>  
        <further-classification edition="200601120251210B">B65C9/20</further-classification>  
        <further-classification edition="202101120251210B">H01M50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹慜九</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, MIN KOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種用於電池單元的標籤貼附裝置及標籤貼附方法，其能夠使用空氣注入和側塊確保貼附到電池單元B的外周表面的標籤L具有均勻的貼附品質。根據示例性實施例的電池單元的標籤貼附裝置包括配置為安裝電池單元（B）並在電池單元（B）的正面上貼附標籤（L）的電池安裝部，設置在電池安裝部的底表面上的空氣注入部，電池單元（B）安裝在底表面上，以向上注入空氣，從電池安裝部的兩側朝向電池單元（B）的兩側表面水平移動以按壓標籤（L）的壓塊，以及在電池單元（B）的頂表面上水平移動的滾輪部，使得標籤（L）的部分貼附以與電池單元（B）的頂表面緊密接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to an apparatus and method for attaching a label for a battery cell, which are capable of securing uniform attachment quality of a label L attached to an outer circumferential surface of a battery cell B using air injection and a side block. An apparatus for attaching a label for a battery cell in accordance with an exemplary embodiment includes a cell mounting part configured to mount a battery cell (B) and attach a label (L) on a front surface of the battery cell (B), an air injection part disposed on a bottom surface of the cell mounting part, on which the battery cell (B) is mounted, to inject air upward, a pressing block horizontally moving from both sides of the cell mounting part toward both side surfaces of the battery cell (B) to press the label (L), and a roller part horizontally moving on a top surface of the battery cell (B) so that a portion of the label (L) is attached to be in close contact with the top surface of the battery cell (B).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:標籤貼附單元</p>  
        <p type="p">410:電池安裝部</p>  
        <p type="p">420:空氣注入部</p>  
        <p type="p">430:壓塊</p>  
        <p type="p">440:滾輪部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1471" publication-number="202610755"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610755.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610755</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126613</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>焊料連接材料、連接結構體之製造方法、及連接結構體</chinese-title>  
        <english-title>SOLDER CONNECTION MATERIAL,CONNECTION STRUCTURE MANUFACTURING METHOD AND CONNECTION STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B23K35/26</main-classification>  
        <further-classification edition="200601120251201B">C09J11/08</further-classification>  
        <further-classification edition="200601120251201B">C09J163/02</further-classification>  
        <further-classification edition="200601120251201B">H05K3/34</further-classification>  
        <further-classification edition="200601120251201B">B23K3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪睿合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳谷洋夢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGIYA, HIROMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柄木田充宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARAKITA, MITSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]本發明提供一種能夠抑制焊料之散亂，處理性良好之膜狀焊料連接材料。 &lt;br/&gt;[解決手段]本發明之焊料連接材料21含有膜形成樹脂、液狀環氧樹脂、熱硬化劑、焊料粒子20、及助焊劑成分，於170℃以上之最高熔融黏度為40,000 Pa･s以下。膜形成樹脂之重量平均分子量之算術平均較佳為10,000～20,000。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:配線基板</p>  
        <p type="p">11:端子行</p>  
        <p type="p">20:焊料粒子</p>  
        <p type="p">21:焊料連接材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1472" publication-number="202610635"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610635.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610635</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126634</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多特異性多藥物之抗體藥物結合物</chinese-title>  
        <english-title>MULTISPECIFIC MULTI-DRUG ANTIBODY-DRUG CONJUGATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">A61K31/502</main-classification>  
        <further-classification edition="200601120251208B">A61K31/4184</further-classification>  
        <further-classification edition="201701120251208B">A61K47/68</further-classification>  
        <further-classification edition="200601120251208B">A61K39/395</further-classification>  
        <further-classification edition="200601120251208B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商美勒斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERUS N.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德　克魯伊夫　科內利斯　阿德里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE KRUIF, CORNELIS ADRIAAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫騰森　法蘭西斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORTENSEN, FRANZISKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅威　彼得　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOWE, PETER RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯索　居利奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUSSO, GIULIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西爾弗曼　彼得　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILVERMAN, PETER BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於抗體藥物結合物(antibody-drug conjugate；ADC)之領域。具體而言係關於用於治療疾病(尤其用於治療癌症)之治療性抗體的領域。更具體而言係關於多特異性多藥物之抗體藥物結合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to the field of antibody-drug conjugates (ADCs). In particular it relates to the field of therapeutic antibodies for the treatment of disease, in particular for the treatment of cancer. More particularly it relates to multispecific multi-drug antibody-drug conjugates.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1473" publication-number="202611683"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611683.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611683</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126653</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>平台及系統</chinese-title>  
        <english-title>PLATFORM AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">G06F3/01</main-classification>  
        <further-classification edition="200601120251202B">G06F1/16</further-classification>  
        <further-classification edition="201401120251202B">A63F13/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紐西蘭商動感實境有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTIVE REALITIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海　瑞秋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATCH, RACHEL ANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯姆森　約翰海伍德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMSON, JOHN HEYWOOD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　永道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BATEMAN, BRUCE W</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭明</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奕軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種平台，其包含：核心；以及配置成在使用中包覆該核心的網罩，該網罩包含由鏈結件互連的節點網路；其中該網罩配置成相對於該核心全向地移動；其中該節點網路的每個節點包含一或多個凸形滑動軸承，其配置成嵌合該核心的外表面並減低該網罩與該核心之間的黏滯摩擦及動摩擦。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A platform comprising: a core; and a mesh configured to envelope the core in use, the mesh comprising a network of nodes interconnected by links; wherein the mesh is configured to move omnidirectionally relative to the core; wherein each node of the network of nodes comprises one or more convex sliding bearings configured to engage an outer surface of the core and reduce stiction and kinetic friction between the mesh and the core.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:平台</p>  
        <p type="p">101:核心</p>  
        <p type="p">102:網罩</p>  
        <p type="p">103:節點</p>  
        <p type="p">104:鏈結件</p>  
        <p type="p">105:碟件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1474" publication-number="202610889"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610889.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610889</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以複合材料製作特別是用於自行車或類似者之車架的方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING FRAMES MADE OF COMPOSITE MATERIALS, PARTICULARLY FOR BICYCLES AND THE LIKE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">B62K19/02</main-classification>  
        <further-classification edition="200601120251210B">B29C70/68</further-classification>  
        <further-classification edition="200601120251210B">B29C53/56</further-classification>  
        <further-classification edition="200601120251210B">B29C53/82</further-classification>  
        <further-classification edition="200601120251210B">B32B37/10</further-classification>  
        <further-classification edition="200601120251210B">B29C35/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商康波希特爵士有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPOSITE JAZZ S.R.L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅梅羅　皮內達　恩里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROMERO PINEDA, ENRIQUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種以複合材料製作特別是用於自行車或類似者之車架的方法(100)，其包括以下步驟： &lt;br/&gt;提供(101)形成一中央空腔(12)之一心軸(10)，該中央空腔適於容納一中央間隔元件(13)，該中央間隔元件在其端部處自該心軸(10)突出； &lt;br/&gt;組裝及擴展(102)該心軸(10)； &lt;br/&gt;提供一纖維織物及用一熱固性結合材料處理該纖維織物(103)； &lt;br/&gt;將該心軸(10)放置(104)在用於以織物形式纏繞材料之一機器中； &lt;br/&gt;將該經處理纖維織物(16)纏繞(105)至該心軸(10)上以形成至少一個第一層； &lt;br/&gt;加熱(106)纏繞在該心軸(10)上之層以用於活化該熱固性結合材料； &lt;br/&gt;重複(107)該前兩個步驟以獲得一多層管狀結構(16)； &lt;br/&gt;分別自該纏繞機器及自該多層管狀結構(16)移除及取出(108)該心軸(10)； &lt;br/&gt;切割(109)該多層管狀結構(16)以形成個別管狀元件(17)，該等管狀元件形成一自行車或類似者之一車架(1)； &lt;br/&gt;連接(110)該等管狀元件(17)及由包括該纖維織物且源自其他生產程序之一複合材料製成之任何額外預成型件； &lt;br/&gt;在一模具(19)中放置及準備(111)該等管狀元件(17)、該等可選額外預成型件及插入件以及機械部件； &lt;br/&gt;密封地封閉(112)該模具(19)； &lt;br/&gt;對該模具(19)加壓(113)以在該模具(19)中產生一真空； &lt;br/&gt;將一熱固性樹脂注射(114)至該模具(19)中； &lt;br/&gt;使該熱固性樹脂聚合(115)； &lt;br/&gt;打開(116)該模具(19)； &lt;br/&gt;取出(117)由該等管狀元件(17)、該等可選額外預成型件、該等插入件及該等機械部件構成之該車架(1)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method (100) for manufacturing frames made of composite materials, particularly for bicycles and the like, comprising the following steps: &lt;br/&gt; – providing (101) a mandrel (10) forming a central cavity (12) adapted to accommodate a central spacer element (13) which protrudes at its ends from the mandrel (10); &lt;br/&gt; – assembling and expanding (102) the mandrel (10); &lt;br/&gt; – providing and treating (103) a fiber fabric with a thermosetting bonding material; &lt;br/&gt; – placing (104) the mandrel (10) in a machine for wrapping material in fabric form; &lt;br/&gt; – wrapping (105) the treated fiber fabric (16) onto the mandrel (10) to form at least one first layer; &lt;br/&gt; – heating (106) the layer wrapped on the mandrel (10) for the activation of the thermosetting bonding material; &lt;br/&gt; – repeating (107) the two previous steps to obtain a multilayer tubular structure (16); &lt;br/&gt; – removing and extracting (108) the mandrel (10) from the wrapping machine and from the multilayer tubular structure (16), respectively; &lt;br/&gt; – cutting (109) the multilayer tubular structure (16) to form individual tubular elements (17) which form a frame (1) of a bicycle or the like; &lt;br/&gt; – connecting (110) the tubular elements (17) and any additional preforms made of a composite material comprising the fiber fabric and deriving from other production processes; &lt;br/&gt; – placing and preparing (111) in a mold (19) the tubular elements (17), the optional additional preforms and inserts and mechanical parts; &lt;br/&gt; – closing (112) the mold (19) hermetically; &lt;br/&gt; – pressurizing (113) the mold (19) to produce a vacuum in the mold (19); &lt;br/&gt; – injecting (114) a thermosetting resin into the mold (19); &lt;br/&gt; – polymerizing (115) the thermosetting resin; &lt;br/&gt; – opening (116) the mold (19); &lt;br/&gt; – extracting (117) the frame (1) constituted by the tubular elements (17), the optional additional preforms, the inserts and the mechanical parts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">101:提供步驟</p>  
        <p type="p">102:擴展步驟</p>  
        <p type="p">103:處理步驟</p>  
        <p type="p">104:放置步驟</p>  
        <p type="p">105:纏繞步驟</p>  
        <p type="p">106:加熱步驟</p>  
        <p type="p">107:反覆/重複</p>  
        <p type="p">108:移除及取出步驟</p>  
        <p type="p">109:切割步驟</p>  
        <p type="p">110:連接步驟</p>  
        <p type="p">111:放置及準備步驟</p>  
        <p type="p">112:封閉步驟</p>  
        <p type="p">113:加壓步驟</p>  
        <p type="p">114:注射步驟</p>  
        <p type="p">115:聚合步驟</p>  
        <p type="p">116:打開步驟</p>  
        <p type="p">117:取出步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1475" publication-number="202610696"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610696.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610696</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126687</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>霧化裝置</chinese-title>  
        <english-title>NEBULIZATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61M15/00</main-classification>  
        <further-classification edition="200601120251201B">A61M15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>心誠鎂行動醫電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HCMED INNOVATIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳弘文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮俊嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUAN, CHUN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種霧化裝置，其包括杯體、霧化模組以及偵測模組。杯體具有一開口與一通孔，開口與通孔分別設置於杯體的頂部與底部。杯體內部具有用於容納藥液的一儲液槽，且儲液槽連通開口及通孔。霧化模組及偵測模組設置於杯體內部。霧化模組位於通孔的正上方，偵測模組位於霧化模組上方。偵測模組具有一偵測區域，偵測區域的垂直投影完全位於通孔的垂直投影的範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A nebulization device includes a cup body, a nebulization module, and a detection module. The cup body includes an opening and a through hole, which are respectively provided at a top portion and a bottom portion of the cup body. A liquid storage chamber is formed inside the cup body for containing liquid medicine, and the liquid storage chamber is in fluid communication with the opening and the through hole. An atomizing module and a detection module are disposed inside the cup body. The nebulization module is located directly above the through hole, and the detection module is positioned above the nebulization module. The detection module has a detection region, and an orthogonal projection of the detection region is completely located within an orthogonal projection of the through hole.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:杯體</p>  
        <p type="p">10:開口</p>  
        <p type="p">5:偵測模組</p>  
        <p type="p">5R:偵測區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1476" publication-number="202612462"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612462.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612462</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126702</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H10B12/10</main-classification>  
        <further-classification edition="200601120251103B">G11C11/401</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金錫源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEOK-WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNG HA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李道仙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DO SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宣姃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUN JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴相炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SANG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體記憶體裝置包括：基板；多個字元線，在基板上在第一方向上堆疊；通道區，在第一方向上在相鄰的字元線之間並在第二方向上延伸；第一源極/汲極區，在通道區的第一側上；第二源極/汲極區，在通道區的第二側上；位元線，在基板上在第一方向上延伸並分別連接到第一源極/汲極區中的對應者；資料儲存元件，分別連接到第二源極/汲極區；以及頂蓋膜，分別在第二源極/汲極區和資料儲存元件中的對應者之間，頂蓋膜分別包括插入孔洞，其中第二源極/汲極區的至少部分分別插入到頂蓋膜的插入孔洞中的對應插入孔洞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory device includes a substrate, a plurality of wordlines stacked in a first direction on the substrate, channel regions between adjacent wordlines in the first direction and extending in a second direction, first source/drain regions on first sides of the channel regions, second source/drain regions on second sides of the channel regions, bitlines extending in the first direction on the substrate and connected to corresponding ones of the first source/drain regions, respectively, data storage elements connected to the second source/drain regions, respectively, and capping films between the second source/drain regions and corresponding ones of the data storage elements, respectively, the capping films including insertion holes, respectively, wherein at least portions of the second source/drain regions are inserted into corresponding ones of the insertion holes of the capping films, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140:間隔件絕緣膜</p>  
        <p type="p">141:內部絕緣膜</p>  
        <p type="p">141BS,170BS,SD2_2BS:下表面</p>  
        <p type="p">141US,170US,SD2_2US:上表面</p>  
        <p type="p">170:頂蓋膜</p>  
        <p type="p">170IWS:內側壁</p>  
        <p type="p">170OWS:外側壁</p>  
        <p type="p">170P:突出部分</p>  
        <p type="p">170V:垂直部分</p>  
        <p type="p">CAP:資料儲存元件</p>  
        <p type="p">CH:通道區</p>  
        <p type="p">D1,D2,D3:方向</p>  
        <p type="p">OP:插入孔洞</p>  
        <p type="p">Q:部分</p>  
        <p type="p">SD2:第二源極/汲極區</p>  
        <p type="p">SD2_1:第一部分</p>  
        <p type="p">SD2_2:第二部分</p>  
        <p type="p">SD2_2S:第一表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1477" publication-number="202612007"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612007.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612007</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126712</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板洗淨刷及基板處理裝置</chinese-title>  
        <english-title>SUBSTRATE CLEANING BRUSH AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251105B">H01L21/304</main-classification>  
        <further-classification edition="202401120251105B">B08B1/32</further-classification>  
        <further-classification edition="200601120251105B">B08B3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋拓馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TAKUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之基板洗淨刷用於基板之洗淨。基板洗淨刷包含基座部、洗淨部及洗淨部。基座部具有圓形之基座上表面。洗淨部形成為自基座部之基座上表面向上方突出。洗淨部沿著基座上表面之外緣連續或斷續地延伸。洗淨部自洗淨部之1或複數個部分向基座上表面之中心延伸且未到達基座上表面之前述中心。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板洗淨刷</p>  
        <p type="p">110:基座部</p>  
        <p type="p">113:貫通孔</p>  
        <p type="p">120,130:洗淨部</p>  
        <p type="p">200:刷基座</p>  
        <p type="p">300:刷單元</p>  
        <p type="p">310,320:螺釘構件</p>  
        <p type="p">A-A:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1478" publication-number="202612021"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612021.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612021</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126722</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>深溝渠隔離蝕刻</chinese-title>  
        <english-title>DEEP TRENCH ISOLATION ETCHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/3065</main-classification>  
        <further-classification edition="200601120251201B">H01L21/762</further-classification>  
        <further-classification edition="202501120251201B">H10D84/01</further-classification>  
        <further-classification edition="202301120251201B">H10B12/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　吉尼Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, GENE H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了一種製造半導體元件的方法。在基板上的膜堆疊暴露於氯（Cl&lt;sub&gt;2&lt;/sub&gt;）、溴化氫（HBr）、氧（O&lt;sub&gt;2&lt;/sub&gt;）和含氟碳氫化合物的混合物中，以在膜堆疊中蝕刻出開口。該含氟碳氫化合物的通式為（I）CxHyFz，其中x為範圍在1至4的整數，y為範圍在0至8的整數，z為範圍在1至8的整數。膜堆疊還可能暴露於電漿的蝕刻循環中，電漿可以週期性地關閉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of manufacturing semiconductor devices are described. A film stack on a substrate is exposed to a mixture of chlorine (Cl&lt;sub&gt;2&lt;/sub&gt;), hydrogen bromide (HBr), oxygen (O&lt;sub&gt;2&lt;/sub&gt;), and a fluorine-containing hydrocarbon to etch an opening in the film stack. The fluorine-containing hydrocarbon may have a general formula (I) CxHyFz wherein x is an integer in a range of from 1 to 4, y is an integer in a range of from 0 to 8, and z is an integer in a range of from 1 to 8. The film stack may additionally be exposed to etch cycles of a plasma where the plasma can be turned off periodically.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301:基板</p>  
        <p type="p">302:矽(Si)/第一材料層</p>  
        <p type="p">304:矽鍺(SiGe)/第二材料層</p>  
        <p type="p">306:超晶格結構</p>  
        <p type="p">308:氧化矽</p>  
        <p type="p">310:深溝渠/開口</p>  
        <p type="p">312:超晶格結構區域</p>  
        <p type="p">314:聚合物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1479" publication-number="202612460"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612460.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612460</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126759</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>層積記憶體及積體模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251204B">H10B12/00</main-classification>  
        <further-classification edition="202301120251204B">H10B61/00</further-classification>  
        <further-classification edition="202301120251204B">H10B80/00</further-classification>  
        <further-classification edition="202501120251204B">H10D88/00</further-classification>  
        <further-classification edition="200601120251204B">G11C11/54</further-classification>  
        <further-classification edition="200601120251204B">H01L21/768</further-classification>  
        <further-classification edition="200601120251204B">H01L23/535</further-classification>  
        <further-classification edition="200601120251204B">H01L23/538</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東北大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOHOKU UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤哲郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDOH, TETSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供對應來自層積記憶體的發熱的層積記憶體及使用其的積體模組。層積記憶體(10)，依序設置：記憶體控制器(11)；以一或複數第1記憶體晶片(12a)構成的第1記憶體部(12)；以一或複數第2記憶體晶片(13a)構成的第2記憶體部(13)；其中，第1記憶體部(12)未包含第2記憶體晶片，第2記憶體部未包含第1記憶體晶片；第1記憶體晶片(12a)，在耐熱性、讀取電力及消耗電力的至少任一觀點上優於第2記憶體晶片(13a)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:層積記憶體</p>  
        <p type="p">11:記憶體控制器</p>  
        <p type="p">12:第1記憶體部</p>  
        <p type="p">12a:第1記憶體晶片</p>  
        <p type="p">13:第2記憶體部</p>  
        <p type="p">13a:第2記憶體晶片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1480" publication-number="202612204"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612204.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612204</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126763</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電纜管理系統</chinese-title>  
        <english-title>CABLE MANAGEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02G7/08</main-classification>  
        <further-classification edition="200601120251201B">F16L3/11</further-classification>  
        <further-classification edition="201401120251201B">H02S40/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商班狄特公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANDUIT CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西維斯特　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYLVESTER, DAVID J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞力　羅得尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROULEAU, RODNEY G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電纜管理系統設計用於支撐太陽能應用中的電纜。電纜管理系統包括U形支架和至少一個夾具半部。U形支架具有帶兩個臂的底座，每個臂包括一固定槽。夾具半部具有頂部、底部、前面、後面和側面，按鈕墊從側面延伸。夾具半部安裝在U形支架內，使得按鈕墊在固定槽中滑動以將夾具半部定位在U形支架中。夾具半部分離及支撐安裝在U形支架中的電纜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cable management system designed to support cables in solar applications. The cable management system includes a U-shaped bracket and at least one clamp half. The U-shaped bracket has a base with two arms with each arm including a securement slot. The clamp half has a top, a bottom, a front, a back, and sides with button pads extending from the sides. The clamp half is installed within the U-shaped bracket such that the button pads slide in the securement slots to position the clamp half in the U-shaped bracket. The clamp half separates and supports the cables installed in the U-shaped bracket.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電纜管理系統</p>  
        <p type="p">230:U形支架</p>  
        <p type="p">300:閉合支架</p>  
        <p type="p">370:電纜夾具組裝件</p>  
        <p type="p">380:電纜夾具半部</p>  
        <p type="p">450:電纜間隔件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1481" publication-number="202612030"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612030.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612030</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126771</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝基板的製作方法</chinese-title>  
        <english-title>MANUFACTURING METHOD FOR PACKAGING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/48</main-classification>  
        <further-classification edition="200601120251201B">H01L21/475</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛玻索立克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABSOLICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗玹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JONG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實例的封裝基板的製作方法包括：準備步驟，準備包括核心基板及配置於所述核心基板的絕緣層的目標基板；蝕刻步驟，利用蝕刻掩膜對所述絕緣層進行選擇性蝕刻；以及製作步驟，從結束所述蝕刻步驟的基底基板中製作封裝基板。蝕刻掩膜配置於絕緣層，且包括金屬圖案膜及配置於所述金屬圖案膜的抗蝕劑圖案膜。在這種情況下，可在絕緣層的圖案化過程中輕鬆去除抗蝕劑圖案膜，並可以抑制絕緣層的受損。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing a packaging substrate according to the present disclosure comprises a preparation step of preparing a base substrate comprising a core substrate and an insulating layer disposed on the core substrate, an etching step of selectively etching the insulating layer using an etching mask, and a manufacturing step of manufacturing the packaging substrate from the base substrate after the etching step. The etching mask is disposed on the insulating layer and comprises a metal pattern film and a resist pattern film disposed on the metal pattern film. In such a case, it may be possible to suppress damage to the insulating layer while easily removing the resist pattern film during the patterning process of the insulating layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:核心基板</p>  
        <p type="p">100:基底基板</p>  
        <p type="p">20:絕緣層</p>  
        <p type="p">31:金屬圖案膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1482" publication-number="202611909"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611909.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611909</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126783</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在記憶體胞元之區塊之間建立橋接的技術</chinese-title>  
        <english-title>TECHNIQUES TO FORM BRIDGES BETWEEN BLOCKS OF MEMORY CELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">G11C5/02</main-classification>  
        <further-classification edition="202501120251204B">H10D62/10</further-classification>  
        <further-classification edition="202501120251204B">H10D62/60</further-classification>  
        <further-classification edition="202501120251204B">H10D62/80</further-classification>  
        <further-classification edition="202501120251204B">H10D88/00</further-classification>  
        <further-classification edition="200601120251204B">H01L21/762</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古普塔　席德哈沙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, SIDHARTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾　理查　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILL, RICHARD J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金恩　馬修　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING, MATTHEW J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述用於在記憶體胞元之區塊之間建立橋接的技術之方法、系統及裝置。一記憶體系統可包含跨記憶體胞元之區塊之間的一槽區延伸之一組部分氧化物橋接。例如，一記憶體系統之區塊可包含一種氧化物材料及一導電材料之交替層。該等區塊可藉由一槽區分離。該等氧化物材料層之一第一子集可跨該槽區延伸以建立氧化物橋接，此可為該記憶體系統提供結構穩定性。該等氧化物層之一第二子集連同該等導電層可不跨該槽區延伸，此可支援在該記憶體系統之一製造程序期間形成一溝槽。此一溝槽可提供至該層堆疊之一接達點以移除氮化物材料且沈積該導電材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and devices for techniques to form bridges between blocks of memory cells are described. A memory system may include a partial set of oxide bridges extending across a slot region between blocks of memory cells. For example, blocks of a memory system may include alternating layers of an oxide material and a conductive material. The blocks may be separated by a slot region. A first subset of the layers of oxide material may extend across the slot region to form oxide bridges, which may provide structural stability to the memory system. A second subset of the oxide layers, along with the conductive layers, may not extend across the slot region, which may support forming a trench during a manufacturing process of the memory system. Such a trench may provide an access point to the stack of layers to remove nitride material and deposit the conductive material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">420:槽區</p>  
        <p type="p">423-a:區</p>  
        <p type="p">423-b:區</p>  
        <p type="p">425:第二腔</p>  
        <p type="p">430:保護帽</p>  
        <p type="p">445-a:疊層</p>  
        <p type="p">445-b:疊層</p>  
        <p type="p">445-c:疊層</p>  
        <p type="p">500:佈局</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1483" publication-number="202611523"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611523.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611523</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126808</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電性連接裝置</chinese-title>  
        <english-title>ELECTRICAL CONNECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01R1/073</main-classification>  
        <further-classification edition="200601120251201B">G01R1/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本麥克隆尼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横内匡俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOUCHI, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福士直城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅田竜一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMEDA, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈良勇斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARA, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電性連接裝置，係使用於檢查對象物的檢查，電性連接裝置係具備：探針，係前端部與檢查對象物接觸；及配線基板，係於第一表面配置有連接著探針之基端部的表面電極配線。配線基板的內部係配置有與表面電極配線電性連接的內部電極配線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connection device that is used to test an object to be tested includes a probe having a tip thereof in contact with the object to be tested, and a wiring board having, on a first surface thereof, surface electrode wiring connected to the base end of the probe. Internal electrode wiring electrically connected to the surface electrode wiring is located inside the wiring board.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電性連接裝置</p>  
        <p type="p">2:檢查對象物</p>  
        <p type="p">10G:接地探針</p>  
        <p type="p">10S:信號探針</p>  
        <p type="p">10V:電源探針</p>  
        <p type="p">20:探針導板</p>  
        <p type="p">30:配線基板</p>  
        <p type="p">31G:表面接地配線</p>  
        <p type="p">31S:表面信號配線</p>  
        <p type="p">31V:表面電源配線</p>  
        <p type="p">32:電極端子</p>  
        <p type="p">33G:內部接地配線</p>  
        <p type="p">33V:內部電源配線</p>  
        <p type="p">34G:接地通孔</p>  
        <p type="p">34V:電源通孔</p>  
        <p type="p">200:導板孔</p>  
        <p type="p">301:第一表面</p>  
        <p type="p">302:第二表面</p>  
        <p type="p">L1:第一配線層</p>  
        <p type="p">L2:第二配線層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1484" publication-number="202610792"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610792.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610792</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126811</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通知裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251213B">B25J19/06</main-classification>  
        <further-classification edition="201901120251213B">G01R31/382</further-classification>  
        <further-classification edition="200601120251213B">G08B21/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥山翔平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUYAMA, SHOUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通知裝置，用以通知沒有連接機器人控制裝置的機器手臂的蓄電池狀態，包括本體部、控制部及通知部。本體部能取下地連接機器手臂。控制部取得蓄電池的狀態資訊。其中，控制部在取得的狀態資訊低於預定基準時，使用通知部進行通知。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">53:接腳</p>  
        <p type="p">60:蓄電池</p>  
        <p type="p">61:電壓檢測部</p>  
        <p type="p">62:輸出部</p>  
        <p type="p">63:變壓部</p>  
        <p type="p">64:電位測量部</p>  
        <p type="p">65:電子開關</p>  
        <p type="p">66:檢測控制部</p>  
        <p type="p">70:通知裝置</p>  
        <p type="p">71:本體部</p>  
        <p type="p">71A:第一卡合部</p>  
        <p type="p">72:突出部</p>  
        <p type="p">73A、73B:被連接部</p>  
        <p type="p">74:蓄電池裝置</p>  
        <p type="p">75:控制部</p>  
        <p type="p">76:發光裝置控制部</p>  
        <p type="p">76A:發光裝置</p>  
        <p type="p">77:聲音發生裝置控制部</p>  
        <p type="p">77A:聲音發生裝置</p>  
        <p type="p">78:電子開關</p>  
        <p type="p">80:機器人側安裝部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1485" publication-number="202612166"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612166.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612166</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126825</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全固態電池用固態電解質及包含其之全固態電池</chinese-title>  
        <english-title>SOLID ELECTROLYTE FOR ALL SOLID-STATE BATTERY AND SOLID-STATE BATTERY COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250801B">H01M10/0562</main-classification>  
        <further-classification edition="201001120250801B">H01M10/0525</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商博思有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASS CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴兌浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, TAE HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金吉鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KIL HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安炫俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, HYUN JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿姆帕杜　以馬內利夸梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMPADU, EMMANUEL KWAME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴珉緖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, MIN SEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種全固態電池用固態電解質及包含其之全固態電池。依本發明的一實施例之全固態電池用固態電解質由包含Li、Mg、Zn、P及Cl之氧化物形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:全固態電池</p>  
        <p type="p">14,15:外部電極</p>  
        <p type="p">16:殼體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1486" publication-number="202612244"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612244.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612244</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126839</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脈波寬度調變控制裝置以及電源系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02M3/335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商達宜明股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIAMET CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤本三直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMOTO, MITSUNAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">脈波寬度調變控制裝置係用以控制切換電源電路，前述切換電源電路係具備切換變壓器以及至少包含前導開關以及後導開關之兩個以上的一次側的切換元件；前述脈波寬度調變控制裝置係以箝位控制模式控制前述前導開關以及前述後導開關的導通狀態，前述箝位控制模式係將前述前導開關的工作比以及前述後導開關的工作比設定成略相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1487" publication-number="202611229"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611229.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611229</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126853</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚碳酸酯樹脂組成物及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08L69/00</main-classification>  
        <further-classification edition="200601120251201B">C08K5/103</further-classification>  
        <further-classification edition="200601120251201B">C08K5/134</further-classification>  
        <further-classification edition="200601120251201B">C08K5/1565</further-classification>  
        <further-classification edition="200601120251201B">C08K5/526</further-classification>  
        <further-classification edition="200601120251201B">C08K5/527</further-classification>  
        <further-classification edition="200601120251201B">C08J3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤宣之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, NORIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西森克吏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMORI, KATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂木篤志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTEGI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石原健太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIHARA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田鈴木章子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA SUZUKI, SHOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新井雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>須賀達哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施形態為提供一種聚碳酸酯樹脂組成物，其係包含聚碳酸酯樹脂與一般式(I)表示之化合物與一般式(II)表示之化合物之聚碳酸酯樹脂組成物，該聚碳酸酯樹脂包含說明書所記載之來自式(1)表示之單體之構成單位(A)與來自式(2)表示之單體之構成單位(B)或來自下述式(3)表示之單體之構成單位(C)，且相對於一般式(I)表示之化合物之前述一般式(II)表示之化合物之存在比([前述一般式(II)表示之化合物]/[前述一般式(I)表示之化合物])為1.0~10.0。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1488" publication-number="202611642"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611642.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611642</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126857</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體封裝的數位偏置和數位單元佈局技術</chinese-title>  
        <english-title>DIGITAL BIASING AND DIGITAL CELL PLACEMENT TECHNIQUE FOR SEMICONDUCTOR PACKAGING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G03F7/20</main-classification>  
        <further-classification edition="201201120251201B">G03F1/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘　欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, QIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊迪格　湯瑪斯Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAIDIG, THOMAS L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康　宗勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, CHUNG-SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例涉及一種用於半導體封裝的數位微影方法和一種軟體應用程式。該方法包括將計量資料傳送至數位微影系統，該計量資料對應於佈置在晶粒上複數個不均勻柱的柱高度和柱的臨界尺寸，其中至少有兩個柱具有不同的柱高度和不同的柱臨界尺寸，該數位微影系統可操作以更新遮罩圖案，該遮罩圖案對應於均勻柱的圖案，根據計量資料更新遮罩圖案以生成補償遮罩圖案，並進行數位微影製程，在阻劑上圖案化以形成複數個通孔，這些通孔是在複數個不均勻柱的每個不均勻柱上形成的，並且在阻劑顯影後包含通孔深度和通孔臨界尺寸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure relate to a method of digital lithography for semiconductor packaging and a software application. The method includes receiving metrology data to a digital lithography system, the metrology data corresponding to the pillar heights and pillar critical dimensions of a plurality of non-uniform pillars disposed over the die, wherein at least two pillars have different pillar heights and different pillar critical dimensions, the digital lithography system is operable to update a mask pattern, the mask pattern corresponding to a pattern of uniform pillars, updating the mask pattern according to the metrology data to generate a compensated mask pattern, and conducting a digital lithography process to pattern on a resist to form a plurality of vias, the vias are formed over each non-uniform pillar of the plurality of non-uniform pillars and include a via depth and a via critical dimension after the resist is developed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:基板</p>  
        <p type="p">302:第一晶粒</p>  
        <p type="p">304:第二晶粒</p>  
        <p type="p">306:不均勻柱</p>  
        <p type="p">312:形成結構/處理結構</p>  
        <p type="p">314:焊錫凸塊</p>  
        <p type="p">316:柱高度</p>  
        <p type="p">318:柱臨界尺寸</p>  
        <p type="p">326:均勻高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1489" publication-number="202610612"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610612.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610612</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126865</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於緩解由外部刺激及／或視黃醇引起的皮膚刺激的組合物</chinese-title>  
        <english-title>COMPOSITION FOR RELIEVING SKIN IRRITATION CAUSED BY EXTERNAL IRRITANTS AND/OR RETINOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K8/42</main-classification>  
        <further-classification edition="200601120251201B">A61P19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商愛茉莉太平洋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMOREPACIFIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白秉烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAIK, BYUNGRYOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳美賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, MIHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹珍榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, JINYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李素英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SOYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金西英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEOYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴城逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SUNGIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪載元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, JAEWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鍾碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JONGSUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種用於緩解皮膚刺激的組合物，其含有鯨蠟基-PG羥乙基棕櫚醯胺作為有效成分，與現有的神經醯胺NP相比具有顯著的皮膚刺激緩解效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1490" publication-number="202610613"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610613.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610613</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126866</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含脂質複合物的用於緩解皮膚刺激的組合物</chinese-title>  
        <english-title>COMPOSITION FOR RELIEVING SKIN IRRITATION CONTAINING LIPID COMPLEX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">A61K8/42</main-classification>  
        <further-classification edition="200601120251208B">A61K31/16</further-classification>  
        <further-classification edition="200601120251208B">A61P17/00</further-classification>  
        <further-classification edition="200601120251208B">A61Q19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商愛茉莉太平洋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMOREPACIFIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白秉烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAIK, BYUNGRYOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳美賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, MIHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹珍榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, JINYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李素英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SOYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金西英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEOYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴城逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SUNGIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪載元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, JAEWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鍾碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JONGSUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種包含含有神經醯胺或類神經醯胺及脂肪酸的脂質複合物，從而劑型穩定且具有皮膚刺激緩解的組合物。根據本公開，由於包含具有與皮膚角質層相似結構的脂質複合物，因此當塗敷於敏感皮膚時，可以表現出優秀的皮膚刺激緩解效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1491" publication-number="202612089"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612089.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612089</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126869</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">H01L21/677</main-classification>  
        <further-classification edition="200601120251202B">H01L21/683</further-classification>  
        <further-classification edition="200601120251202B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中井仁司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAI, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之基板處理裝置具備腔室、基板保持部、及回轉機構。腔室具有連通內部與外部而供搬入基板之第1開口，及連通內部與外部而供搬出基板之第2開口。基板保持部配置於腔室內，逐片保持基板。回轉機構藉由使基板保持部回轉，而於腔室內，使基板保持部於藉由處理液處理基板之複數個處理位置之間移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate processing apparatus includes a chamber, a substrate holding portion, and a turning mechanism. The chamber has a first opening through which an inside and an outside communicate with each other and a substrate is carried in, and a second opening through which the inside and the outside communicate with each other and the substrate is carried out. The substrate holding portion is disposed in the chamber and holds the substrates one by one. The turning mechanism turns the substrate holding portion to move the substrate holding portion between a plurality of processing positions at which the substrate is processed with a processing liquid in the chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板處理單元</p>  
        <p type="p">11:腔室</p>  
        <p type="p">12:開口</p>  
        <p type="p">12a:第1開口</p>  
        <p type="p">12b:第2開口</p>  
        <p type="p">13:擋板</p>  
        <p type="p">100:基板處理裝置</p>  
        <p type="p">101:控制裝置</p>  
        <p type="p">102:控制部</p>  
        <p type="p">104:記憶部</p>  
        <p type="p">111:通路</p>  
        <p type="p">200:基板保持部</p>  
        <p type="p">200a:基端部</p>  
        <p type="p">200b:前端部</p>  
        <p type="p">400:浸漬槽</p>  
        <p type="p">C200:圓</p>  
        <p type="p">CR:中心機器人</p>  
        <p type="p">IR:傳載機器人</p>  
        <p type="p">L200:回轉軸線</p>  
        <p type="p">LP:裝載埠</p>  
        <p type="p">Q:處理位置</p>  
        <p type="p">Q1:處理位置</p>  
        <p type="p">Q2:處理位置</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1492" publication-number="202611990"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611990.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611990</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多帶電粒子束描繪裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">H01L21/027</main-classification>  
        <further-classification edition="200601120251128B">H01L21/263</further-classification>  
        <further-classification edition="200601120251128B">H01J37/147</further-classification>  
        <further-classification edition="200601120251128B">H01J37/30</further-classification>  
        <further-classification edition="200601120251128B">H01J37/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商紐富來科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村駿生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, HIROFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種多帶電粒子束描繪裝置，可修正由於在安裝基板流通的電路電流而產生的磁場所造成的多帶電粒子束的位置變動，其中在該安裝基板配置了供多帶電粒子束通過的遮沒孔徑陣列晶片。 &lt;br/&gt;　　本發明的一態樣之多帶電粒子束描繪裝置，其特徵為，具備：遮沒孔徑陣列機構，具有：遮沒孔徑陣列晶片，具有複數個遮沒器，其將入射的多帶電粒子束藉由射束偏向而個別地切換成射束ON狀態及射束OFF狀態；安裝基板，支撐遮沒孔徑陣列晶片，並且形成有對遮沒孔徑陣列晶片供給電源的電源平面；限制孔徑基板，將通過了遮沒孔徑陣列機構的多帶電粒子束當中的射束OFF狀態的射束予以遮蔽；電流取得電路，取得在電源平面流通的電流；1段以上的偏向器，將通過了遮沒孔徑陣列機構的多帶電粒子束予以偏向；偏向器控制電路，控制1段以上的偏向器，以便修正根據在電源平面流通的電流而發生的多帶電粒子束的位置變動；平台，載置試料；電子光學系統，藉由已修正位置變動的多帶電粒子束照射試料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:多電子束</p>  
        <p type="p">60:偏向控制部</p>  
        <p type="p">62:虛設電路</p>  
        <p type="p">64:電流測定部</p>  
        <p type="p">70:擊發資料生成部</p>  
        <p type="p">72:資料加工部</p>  
        <p type="p">74:轉送處理部</p>  
        <p type="p">76:描繪控制部</p>  
        <p type="p">100:描繪裝置</p>  
        <p type="p">101:試料</p>  
        <p type="p">102:電子鏡筒</p>  
        <p type="p">103:描繪室</p>  
        <p type="p">105:XY平台</p>  
        <p type="p">106:標記</p>  
        <p type="p">110:控制計算機</p>  
        <p type="p">112:記憶體</p>  
        <p type="p">130:偏向控制電路</p>  
        <p type="p">131:邏輯電路</p>  
        <p type="p">132,134:DAC放大器單元</p>  
        <p type="p">136:透鏡控制電路</p>  
        <p type="p">138:平台控制機構</p>  
        <p type="p">139:平台位置測定器</p>  
        <p type="p">140,142:記憶裝置</p>  
        <p type="p">150:描繪機構</p>  
        <p type="p">151:電子光學系統</p>  
        <p type="p">160:控制系統電路</p>  
        <p type="p">161:偏向器控制電路</p>  
        <p type="p">162,164:DAC放大器單元</p>  
        <p type="p">200:電子束</p>  
        <p type="p">201:電子槍</p>  
        <p type="p">202:照明透鏡</p>  
        <p type="p">203:成形孔徑陣列基板</p>  
        <p type="p">204:遮沒孔徑陣列機構</p>  
        <p type="p">205:縮小透鏡</p>  
        <p type="p">206:限制孔徑基板</p>  
        <p type="p">207:對物透鏡</p>  
        <p type="p">208:偏向器</p>  
        <p type="p">209:偏向器</p>  
        <p type="p">210:鏡</p>  
        <p type="p">211:安裝基板</p>  
        <p type="p">212:偏向器</p>  
        <p type="p">213:遮沒孔徑陣列晶片</p>  
        <p type="p">214,215,219:偏向器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1493" publication-number="202611418"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611418.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611418</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126888</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管理變速箱中齒輪換檔的方法</chinese-title>  
        <english-title>METHOD FOR MANAGING A GEAR SHIFT IN A GEARBOX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">F16H63/50</main-classification>  
        <further-classification edition="200601120251201B">F16H63/42</further-classification>  
        <further-classification edition="200601120251201B">B60W10/06</further-classification>  
        <further-classification edition="201201120251201B">B60W10/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商舍弗勒科技股份有限兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEFFLER TECHNOLOGIES AG &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩恩　朱利安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAYEN, JULIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於管理變速箱中升檔的控制方法，該檔用以從一起始檔位過渡到一目標檔位而無須離開離合器，該變速箱包括可在對應於該起始檔位之一第一位置以及對應於該目標檔位之一第二位置之間移動之一選擇軸，提供對應於該選擇軸之一目前角位置之一電壓值之一角位置感測器，該方法包括：&lt;br/&gt; 重複地取得對應於該選擇軸之該角位置之該電壓值；&lt;br/&gt; 當該目前電壓值(61)變得大於第一預定閾值(VS1)時，便觸發該引擎轉矩的降低；&lt;br/&gt; 當該目前電壓值增加並大於一第二預定閾值(VS2)時，便取消引擎轉矩的降低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A control method for managing an upshift in a gearbox, the shift being intended to transition from a starting gear to a target gear, without declutching, the gearbox comprising a selection shaft movable between a first position corresponding to the starting gear and a second position corresponding to the target gear, an angular position sensor providing a voltage value corresponding to a current angular position of the selection shaft, the method comprising:&lt;br/&gt; iteratively acquiring the voltage value corresponding to the angular position of the selection shaft;&lt;br/&gt; when the current voltage value (61) becomes greater than a first predetermined threshold (VS1), then triggering a reduction in the engine torque;&lt;br/&gt; when the current voltage value increases and becomes greater than a second predetermined threshold (VS2), then cancelling the reduction in engine torque.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:角位置感測器</p>  
        <p type="p">3:檔位排檔桿</p>  
        <p type="p">ta:時間</p>  
        <p type="p">tb:時間</p>  
        <p type="p">tc:時間</p>  
        <p type="p">td:時間</p>  
        <p type="p">V1:第一參考值</p>  
        <p type="p">VS1:第一預定閾值</p>  
        <p type="p">V2:第二參考值</p>  
        <p type="p">VS2:第二預定閾值</p>  
        <p type="p">61:目前電壓值</p>  
        <p type="p">62:過渡</p>  
        <p type="p">66:過渡</p>  
        <p type="p">E1:第一差值</p>  
        <p type="p">E2:第二差值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1494" publication-number="202610959"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610959.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610959</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>強介電體材料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C04B35/495</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東京大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE UNIVERSITY OF TOKYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永井隆之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之強介電體材料兼具結晶學之鐵手性序與鐵軸序，或者，兼具結晶學之反鐵手性序與反鐵軸序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1495" publication-number="202612547"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612547.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612547</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126920</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於發光二極體晶片的反射結構及相關方法</chinese-title>  
        <english-title>REFLECTIVE STRUCTURES FOR LIGHT-EMITTING DIODE CHIPS AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251204B">H10H20/01</main-classification>  
        <further-classification edition="202501120251204B">H10H20/80</further-classification>  
        <further-classification edition="202501120251204B">H10H20/822</further-classification>  
        <further-classification edition="202501120251204B">H10H20/814</further-classification>  
        <further-classification edition="202501120251204B">H10H20/841</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科銳ＬＥＤ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CREELED, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>切克　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHECK, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍斯特　史蒂文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUESTER, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯爾　尼古拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HALL, NIKOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">包含發光二極體(LED)的固態照明裝置及更特別用於LED晶片的反射結構及相關方法被揭示。反射結構包含在金屬反射層之內的第一金屬及第二金屬的配置。相對第一金屬，第二金屬在金屬反射層的整個厚度可具有非均勻的分布。相對第二金屬，第一金屬可促進增大的反射度，且第二金屬可促進增大的機械穩定性、增大的黏著、及降低的電遷移。範例金屬反射層在靠近金屬反射層與LED晶片的其它層之間的介面包含增大濃度的第二金屬。第二金屬亦可在遠離介面的方向形成濃度梯度。相關方法是包含依序形成第一及第二金屬的離散層，接著退火以形成金屬反射層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly reflective structures for LED chips and related methods are disclosed. Reflective structures include arrangements of a first metal and a second metal within a metal reflective layer. The second metal may have a nonuniform distribution throughout a thickness of the metal reflective layer relative to the first metal. The first metal may promote increased reflectivity relative to the second metal, and the second metal may promote increased mechanical stability, increased adhesion, and reduced electromigration. An exemplary metal reflective layer includes increased concentrations of the second metal near interfaces between the metal reflective layer and other layers of the LED chip. The second metal may also form concentration gradients in directions away from the interfaces. Related methods include sequentially forming discrete layers of the first and second metals, followed by annealing to form the metal reflective layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:LED晶片</p>  
        <p type="p">12:主動LED結構</p>  
        <p type="p">14:p型層</p>  
        <p type="p">16:n型層</p>  
        <p type="p">18:主動層</p>  
        <p type="p">20:基板</p>  
        <p type="p">20’:圖案化的表面</p>  
        <p type="p">22:介電反射層</p>  
        <p type="p">24:金屬反射層</p>  
        <p type="p">26:反射層互連</p>  
        <p type="p">28:阻障層</p>  
        <p type="p">30:鈍化層</p>  
        <p type="p">32:黏著層</p>  
        <p type="p">34:p-接觸</p>  
        <p type="p">36:n-接觸</p>  
        <p type="p">38:p-接觸互連</p>  
        <p type="p">40:n-接觸互連</p>  
        <p type="p">42:電流分散層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1496" publication-number="202611210"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611210.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611210</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126929</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、接著膜、高頻基板、毫米波雷達基板、印刷線路基板及半導體裝置</chinese-title>  
        <english-title>RESIN COMPOSITION, ADHESIVE FILM, HIGH FREQUENCY SUBSTRATE, MILLIMETER WAVE RADAR SUBSTRATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08K5/5399</main-classification>  
        <further-classification edition="200601120251201B">C08L101/00</further-classification>  
        <further-classification edition="200601120251201B">C09K21/12</further-classification>  
        <further-classification edition="200601120251201B">C09J11/06</further-classification>  
        <further-classification edition="200601120251201B">C09J201/00</further-classification>  
        <further-classification edition="201801120251201B">C09J7/30</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification>  
        <further-classification edition="200601120251201B">H01L23/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納美仕有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒川津与志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKAWA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種樹脂組成物，其可形成耐燃性優異、在高頻帶域中在25℃之比介電率及介電正切之值小、且介電正切之溫度依存性亦小的硬化物。 &lt;br/&gt;本發明之樹脂組成物包含：含有以下述通式(A1)所示的具有含磷雜菲環結構之環狀膦氮烯化合物的耐燃劑，其硬化物之在10GHz、25℃之比介電率為3.5以下，硬化物之在10GHz、25℃的介電正切為0.003以下，且相對於在10GHz、25℃的介電正切，硬化物之在120℃的介電正切為±30%以下。 &lt;br/&gt;&lt;img align="absmiddle" height="178px" width="267px" file="ed10034.JPG" alt="ed10034.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[在式(A1)中，n為3至8之整數， a及b為0至4之整數，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;係具有在相互間形成(i)烷基或者烷氧基、及芳基或者芳基氧基之中的任一者、或者(ii)飽和的或不飽和的環狀結構之結構。]</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An objective of the present invention is to provide a resin composition capable of forming a cured product that has excellent flame retardancy, a small relative permittivity and dielectric loss tangent at 25°C in a high-frequency band, and a small temperature dependency of the dielectric loss tangent. &lt;br/&gt; The resin composition of the present invention comprises a flame retardant containing a cyclic phosphazene compound having a phosphaphenanthrene ring structure represented by the following general formula (A1). The cured product thereof has a relative permittivity of 3.5 or less at 10 GHz and 25°C, a dielectric loss tangent of 0.003 or less at 10 GHz and 25°C, and the dielectric loss tangent of the cured product at 120°C is within ±30% of the dielectric loss tangent at 25°C, both measured at 10 GHz. &lt;br/&gt;&lt;img align="absmiddle" height="178px" width="268px" file="ed10035.JPG" alt="ed10035.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; [In formula (A1), n is an integer from 3 to 8, a and b are integers from 0 to 4. R&lt;sup&gt;1&lt;/sup&gt; and R&lt;sup&gt;2&lt;/sup&gt; have a structure that forms either (i) an alkyl group, an alkoxy group, an aryl group, or an aryloxy group, or (ii) a saturated or unsaturated cyclic structure between each other.]</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1497" publication-number="202610803"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610803.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610803</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126938</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合式包材容器成型方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">B29C49/22</main-classification>  
        <further-classification edition="200601120251212B">D21J3/00</further-classification>  
        <further-classification edition="200601120251212B">B32B29/00</further-classification>  
        <further-classification edition="200601120251212B">B65D1/02</further-classification>  
        <further-classification edition="200601120251212B">B29C49/02</further-classification>  
        <further-classification edition="200601120251212B">B65D65/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>優藶國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OUNI WORLD INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林原禾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昆葆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昆賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳芳池</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種複合式包材容器成型方法，包含以下步驟，將複數之凹模浸入一紙漿中，凹模具有一模穴與一氣穴，模穴與氣穴間貫通有數氣孔，凹模透過氣穴及氣孔抽氣將紙漿真空吸附於模穴內側上，以一模心插入模穴將擠壓紙漿濾除多餘水分定型並加熱烘乾紙漿成形製成一瓶身與一瓶底，瓶身底部有一瓶底孔以卡入瓶底，並去除瓶身頂部形成一瓶口孔，加熱一熱塑性瓶胚，利用一吹瓶機移動瓶底與瓶胚，令瓶胚穿過瓶口孔插入瓶身內，二合模接近夾住瓶身限制其外側，以一吹瓶器下降插入瓶胚內吹氣使其膨脹貼於瓶身與瓶底內側形成一內瓶從而完成一複合式包材容器。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">(10):複合式包材容器</p>  
        <p type="p">(11):瓶身</p>  
        <p type="p">(111):瓶底孔</p>  
        <p type="p">(112):瓶口孔</p>  
        <p type="p">(113):通孔</p>  
        <p type="p">(12):瓶底</p>  
        <p type="p">(13):瓶口</p>  
        <p type="p">(14):內瓶</p>  
        <p type="p">(141):填充部</p>  
        <p type="p">(441):推桿</p>  
        <p type="p">(50):合模</p>  
        <p type="p">(60):吹瓶器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1498" publication-number="202610639"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610639.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610639</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126941</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>SOS-1抑制劑之鹽</chinese-title>  
        <english-title>SALT OF A SOS-1 INHIBITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/519</main-classification>  
        <further-classification edition="200601120251201B">A61K31/095</further-classification>  
        <further-classification edition="200601120251201B">A61K31/66</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商拜耳廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAYER AKTIENGESELLSCHAFT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾　馬克西米利安　弗朗茨　路德維希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARL, MAXIMILIAN FRANZ LUDWIG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴蒂可　卡特琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARTIKEL, KATRIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼古拉延科　瓦瓦拉　伊戈里夫娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKOLAYENKO, VARVARA IGORIVNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>UA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施焦度　德特勒夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STOECKIGT, DETLEF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕普　菲立克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAPE, FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　努斯包默　法蘭茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VON NUSSBAUM, FRANZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史黛福　提摩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STELLFELD, TIMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於1-{4-[2-甲基-4-({1-[2-甲基-3-(三氟甲基)苯基]乙基}胺基)吡啶并[3,4-d]嘧啶-6-基]-4-氧離子基-1,4-氮雜磷雜環己烷-1-基}乙酮之苯磺酸鹽之任一其無水形式或任一水合物或其混合物、其用於治療病症之用途及該苯磺酸鹽用於製備藥劑之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to the besylate salt of 1-{4-[2-methyl-4-({1-[2-methyl-3-(trifluoromethyl)phenyl]ethyl}amino) pyrido[3,4-d]pyrimidin-6-yl]-4-oxido-1,4-azaphosphinan-1-yl}ethanone, in any of its anhydrous forms or any hydrate(s), or mixtures thereof, its use for the treatment of disorders, and the use of the besylate salt for the preparation of a medicament.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1499" publication-number="202611352"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611352.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611352</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126946</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚醚酯彈性纖維及該纖維之捲紗體、以及包含該纖維之布帛及衣料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">D01F6/86</main-classification>  
        <further-classification edition="200601120251210B">C08L67/00</further-classification>  
        <further-classification edition="200601120251210B">C08G63/00</further-classification>  
        <further-classification edition="200601120251210B">D01D5/08</further-classification>  
        <further-classification edition="202101120251210B">D03D15/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下浦史也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOURA, FUMIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤英之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, HIDEYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種聚醚酯彈性纖維及該纖維之捲紗體、以及包含該纖維之布帛及衣料，該聚醚酯彈性纖維具有良好之伸縮追隨性及伸縮回復性，並且具有即便經過染色加工步驟亦可充分抑制拉伸應力之降低及因收縮所致之布料褶皺之產生之耐熱性，並且作為布料之審美性良好。本發明之聚醚酯彈性纖維之總纖度為5 dtex以上80 dtex以下，利用小角度X射線散射裝置測得之相分離指標為0.20以上0.65以下，並且利用拉曼光譜法測得之硬鏈段區域之纖維軸方向之配向性指標為10.00以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1500" publication-number="202612212"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612212.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612212</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126956</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>再生能源發電用供電裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02J7/34</main-classification>  
        <further-classification edition="200601120251201B">H02J7/35</further-classification>  
        <further-classification edition="200601120251201B">H02J15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商康門乃克科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEC COMNECT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石山大揮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIYAMA, TAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種即便在從包含太陽光發電的可再生能源來源而來的發電電力不安定的情況下也可以有效率地進行蓄電和供電之體系。其特徵為具備：蓄電器電池(13)，其係形成使用充電有大容量的電能的電容器，並對前述發電電力進行蓄電；電力分配控制部(11)，其係進行分配控制，把從可再生能源來源而來的發電電力分配成向電力公司進行輸電的販售電力或是蓄電到蓄電器電池(13)的蓄電電力；蓄電器控制部(12)，其係進行把從電力分配控制部(11)所分配到的前述蓄電電力蓄電到前述蓄電器電池(13)之控制，並且，進行對蓄電在蓄電器電池(13)的電力進行放電並蓄電到二次電池(20)之控制、以及對蓄電在蓄電器電池(13)的電力進行放電並供電到外部機器之控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:再生能源發電用供電裝置</p>  
        <p type="p">11:電力分配控制部</p>  
        <p type="p">12:蓄電器控制部</p>  
        <p type="p">13:蓄電器電池</p>  
        <p type="p">14:DC/DC轉換器</p>  
        <p type="p">15:DC/AC逆變器</p>  
        <p type="p">20:二次電池</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1501" publication-number="202610624"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610624.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610624</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126960</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>TYK2抑制劑之晶型及其用途</chinese-title>  
        <english-title>CRYSTALLINE FORMS OF A TYK2 INHIBITOR AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">A61K31/44</main-classification>  
        <further-classification edition="200601120251203B">A61K31/4196</further-classification>  
        <further-classification edition="200601120251203B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雅盧米斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALUMIS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>百　考博特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BY, KOLBOT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱班森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, BENSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿隆佐　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALONZO, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑪姬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MAGGIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明部分地關於&lt;i&gt;N&lt;/i&gt;-(4-((3-甲氧基-4-(1-(甲基-&lt;i&gt;d&lt;/i&gt;&lt;sub&gt;3&lt;/sub&gt;)-1&lt;i&gt;H&lt;/i&gt;-1,2,4-三唑-3-基)吡啶-2-基)胺基)-5-丙醯基吡啶-2-基)環丙烷甲醯胺之結晶鹽形式、其醫藥組合物及使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure is in part directed to crystalline salt forms of &lt;i&gt;N&lt;/i&gt;-(4-((3-methoxy-4-(1-(methyl-&lt;i&gt;d&lt;/i&gt;&lt;sub&gt;3&lt;/sub&gt;)-1&lt;i&gt;H&lt;/i&gt;-1,2,4-triazol-3-yl)pyridin-2-yl)amino)-5-propionylpyridin-2-yl)cyclopropane carboxamide, pharmaceutical compositions thereof, and methods of use.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1502" publication-number="202610681"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610681.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610681</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126973</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療猝睡症之耐受性免疫修飾奈米粒子</chinese-title>  
        <english-title>TOLERIZING IMMUNE MODIFYING NANOPARTICLES FOR TREATMENT OF NARCOLEPSY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K39/39</main-classification>  
        <further-classification edition="200601120251201B">C07K14/705</further-classification>  
        <further-classification edition="200601120251201B">A61P25/00</further-classification>  
        <further-classification edition="200601120251201B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商庫爾製藥發展公司股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUR PHARMACEUTICALS DEVELOPMENT COMPANY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥卡爾錫　德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCCARTHY,DERRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案大體上係關於用於治療NT1之包含猝睡症伴猝倒(NT1)抗原之耐受性免疫介導之粒子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application is directed, in general, to tolerizing immune mediated particles comprising narcolepsy with cataplexy (NT1) antigens for use in treating NT1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1503" publication-number="202610625"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610625.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610625</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126976</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>TYK2抑制劑之晶型及其用途</chinese-title>  
        <english-title>CRYSTALLINE FORMS OF A TYK2 INHIBITOR AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">A61K31/44</main-classification>  
        <further-classification edition="200601120251208B">A61K31/4196</further-classification>  
        <further-classification edition="200601120251208B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雅盧米斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALUMIS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>百　考博特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BY, KOLBOT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱班森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, BENSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿隆佐　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALONZO, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑪姬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MAGGIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明部分地關於&lt;i&gt;N&lt;/i&gt;-(4-((3-甲氧基-4-(1-(甲基-&lt;i&gt;d&lt;/i&gt;&lt;sub&gt;3&lt;/sub&gt;)-1&lt;i&gt;H&lt;/i&gt;-1,2,4-三唑-3-基)吡啶-2-基)胺基)-5-丙醯基吡啶-2-基)環丙烷甲醯胺反丁烯二酸氫鹽之晶型、其醫藥組合物及使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure is in part directed to crystalline forms of &lt;i&gt;N&lt;/i&gt;-(4-((3-methoxy-4-(1-(methyl-&lt;i&gt;d&lt;/i&gt;&lt;sub&gt;3&lt;/sub&gt;)-1&lt;i&gt;H&lt;/i&gt;-1,2,4-triazol-3-yl)pyridin-2-yl)amino)-5-propionylpyridin-2-yl)cyclopropane carboxamide hydrogen fumarate, pharmaceutical compositions thereof, and methods of use.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1504" publication-number="202612202"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612202.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612202</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126993</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>離子發生裝置以及電子設備</chinese-title>  
        <english-title>（無）</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251017B">H01T19/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商夏普股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARP KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀川幸司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIKAWA, KOUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供使離子的發生量增加之離子發生裝置以及電子設備。離子發生裝置包括：感應電極；放電電極，其通過與所述感應電極之間的電位差來產生放電；以及絕緣物，其覆蓋所述感應電極，所述放電電極具有露出部，所述露出部向外部露出，所述感應電極被配置在比所述露出部的基端更靠近所述露出部的前端的一側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:離子發生裝置</p>  
        <p type="p">2:殼體</p>  
        <p type="p">3:放電電極基板</p>  
        <p type="p">4:感應電極基板</p>  
        <p type="p">5:放電電極(第一放電電極)</p>  
        <p type="p">6:放電電極(第二放電電極)</p>  
        <p type="p">5a、6a:內置部</p>  
        <p type="p">5b、6b:露出部</p>  
        <p type="p">7、8:面電極</p>  
        <p type="p">9:感應電極(第二電極)</p>  
        <p type="p">10:絕緣樹脂(絕緣物)</p>  
        <p type="p">11、12:電容器</p>  
        <p type="p">21:主體部</p>  
        <p type="p">21a:基體部</p>  
        <p type="p">21b:凸部</p>  
        <p type="p">22:蓋部</p>  
        <p type="p">P:位置</p>  
        <p type="p">D:距離</p>  
        <p type="p">R:範圍</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1505" publication-number="202611124"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611124.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611124</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127007</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子元件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/14</main-classification>  
        <further-classification edition="200601120251201B">C08F220/18</further-classification>  
        <further-classification edition="200601120251201B">C08F220/22</further-classification>  
        <further-classification edition="200601120251201B">C08F220/28</further-classification>  
        <further-classification edition="200601120251201B">C08F220/32</further-classification>  
        <further-classification edition="200601120251201B">C08F220/38</further-classification>  
        <further-classification edition="200601120251201B">C08F220/40</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戸次洋佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEKKI, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡宏哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKA, HIRONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小島雅史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤研由</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, AKIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠形成解析度優異之圖案的感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、及電子元件之製造方法。本發明的感光化射線性或感放射線性樹脂組成物含有樹脂，上述樹脂具有由通式（I）表示的重複單元A1和由通式（II）表示的重複單元A2。 &lt;br/&gt;&lt;img align="absmiddle" height="228px" width="375px" file="ed10054.JPG" alt="ed10054.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1506" publication-number="202610684"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610684.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610684</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127033</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含ＫＲＡＳ　Ｇ１２Ｃ抑制劑及帕博利珠單抗的組合療法</chinese-title>  
        <english-title>COMBINATION THERAPIES COMPRISING A KRAS G12C INHIBITOR AND PEMBROLIZUMAB</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K39/395</main-classification>  
        <further-classification edition="200601120251201B">A61K31/517</further-classification>  
        <further-classification edition="200601120251201B">A61K31/519</further-classification>  
        <further-classification edition="200601120251201B">A61K31/496</further-classification>  
        <further-classification edition="200601120251201B">A61K31/553</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4985</further-classification>  
        <further-classification edition="200601120251201B">A61K31/573</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商建南德克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENENTECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　鼎堃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TING-KUN MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼德里克　桑迪亞　維納亞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANDLEKAR, SANDHYA VINAYAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷曼　艾哈邁杜爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAHMAN, AHMADUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供藉由投予 KRAS G12C 抑制劑及帕博利珠單抗與預防劑量的類固醇之組合來治療 KRAS G12C 陽性 NSCLC 之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are methods of treating KRAS G12C-positive NSCLC by administering a combination of a KRAS G12C inhibitor and pembrolizumab with a prophylactic dose of a steroid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1507" publication-number="202612385"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612385.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612385</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127035</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>六十千兆赫無線通信系統</chinese-title>  
        <english-title>SIXTY GIGAHERTZ WIRELESS COMMUNICATION SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W88/08</main-classification>  
        <further-classification edition="200601120251201B">H04B7/06</further-classification>  
        <further-classification edition="201701120251201B">H04B7/04</further-classification>  
        <further-classification edition="202301120251201B">H04W72/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商天梭康有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENSORCOM, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商南坦智財控股有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANT HOLDINGS IP, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　馨祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOON-SHIONG, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑟　札烏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOE, ZAW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳致豫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種示例通信系統包括：前傳通信系統架構的分散式單元，其中，該分散式單元與通信系統的核心網路通信；前傳通信系統架構的無線電單元，其中，該無線電單元與至少一個蜂巢式天線電耦合，並且該無線電單元被配置為發射和接收無線蜂巢式信號；以及位於分散式單元與無線電單元之間的無線通信鏈路。無線通信鏈路包括與無線電單元電耦合的第一片上系統（SoC）設備以及與分散式單元電耦合的第二SoC設備，其中，該第一SoC設備和該第二SoC設備被配置為以至少六十千兆赫的頻率在無線電單元與分散式單元之間無線地傳輸通信信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example communication system includes a distributed unit of a fronthaul communication system architecture, wherein the distributed unit is in communication with a core network of the communication system, a radio unit of the fronthaul communication system architecture, wherein the radio unit is electrically coupled with at least one cellular antenna, and the radio unit is configured to transmit and receive wireless cellular signals, and a wireless communication link between the distributed unit and the radio unit. The wireless communication link includes a first system-on-chip (SoC) device electrically coupled with the radio unit, and a second SoC device electrically coupled with the distributed unit, wherein the first SoC device and the second SoC device are configured to wirelessly transmit communication signals between the radio unit and the distributed unit at a frequency of at least sixty Gigahertz.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:通信系統</p>  
        <p type="p">102:核心網路</p>  
        <p type="p">104:計算單元</p>  
        <p type="p">106:分散式單元</p>  
        <p type="p">108:無線電單元</p>  
        <p type="p">112:天線</p>  
        <p type="p">114:60GHz無線通信連接</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1508" publication-number="202612292"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612292.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612292</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127040</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多ＷＩＧＩＧ通道多工器</chinese-title>  
        <english-title>MULTI-WIGIG CHANNEL MULTIPLEXOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">H04B7/0452</main-classification>  
        <further-classification edition="201301120251201B">H04B10/25</further-classification>  
        <further-classification edition="200601120251201B">H04L12/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商天梭康有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENSORCOM, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商南坦智財控股有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANT HOLDINGS IP, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　馨祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOON-SHIONG, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　文森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANG, VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳致豫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通信系統包括與資料網路的第一對等節點耦合的第一通信電纜、包括第一無線介面和第二無線介面的第一無線主機設備、耦合在第一無線主機設備與第一通信電纜的端點之間的第一適配器、與資料網路的第二對等節點耦合的第二通信電纜、以及包括第三無線介面和第四無線介面的第二無線主機設備。該第三無線介面被配置為經由第一無線通信通道與第一無線介面通信，並且該第四無線介面被配置為經由第二無線通信通道與第二無線介面通信。第二適配器耦合在第二無線主機設備與第二通信電纜之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication system includes a first communication cable coupled with a first peer node of a data network, a first wireless host device including a first wireless interface and a second wireless interface, a first adapter coupled between the first wireless host device and an end point of the first communication cable, a second communication cable coupled with a second peer node of the data network, and a second wireless host device including a third wireless interface and a fourth wireless interface. The third wireless interface is configured to communicate with the first wireless interface via a first wireless communication channel, and the fourth wireless interface is configured to communicate with the second wireless interface via a second wireless communication channel. A second adapter is coupled between the second wireless host device and the second communication cable.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:通信系統</p>  
        <p type="p">102:核心網路</p>  
        <p type="p">104:計算單元</p>  
        <p type="p">106:分散式單元</p>  
        <p type="p">108:無線電單元</p>  
        <p type="p">112:天線</p>  
        <p type="p">114:60GHz無線通信連接</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1509" publication-number="202612288"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612288.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612288</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127043</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>六十千兆赫多輸入多輸出收發器</chinese-title>  
        <english-title>SIXTY GIGAHERTZ MULTIPLE INPUT MULTIPLE OUTPUT TRANSCEIVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251201B">H04B1/38</main-classification>  
        <further-classification edition="201801120251201B">H04B7/02</further-classification>  
        <further-classification edition="200601120251201B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商天梭康有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENSORCOM, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商南坦智財控股有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANT HOLDINGS IP, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　馨祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOON-SHIONG, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑟　札烏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOE, ZAW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　文森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANG, VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳致豫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於通信系統的示例片上系統（SoC）設備包括：快速週邊部件互連（PCIe）介面，該快速週邊部件互連介面被配置為從通信系統的回程現場可程式設計閘陣列（FPGA）接收資料；以及生產者埠，該生產者埠藉由直接記憶體存取（DMA）與消費者埠連結。由PCIe介面接收的資料被指派給生產者埠。該設備包括：雙硬體媒體存取控制（MAC），該雙硬體媒體存取控制被配置為消費指派給生產者埠的資料；以及至少一個處理器，該至少一個處理器被配置為向無線介面供應資料，用於以至少六十千兆赫的頻率傳輸到通信系統的另一無線通信設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example system-on-chip (SoC) device for a communication system includes a peripheral component interconnect express (PCIe) interface configured to receive data from a backhaul field programmable gate array (FPGA) of the communication system, and a producer port linked with a consumer port through direct memory access (DMA). Data received by the PCIe interface is assigned to the producer port. The device includes dual hardware media access controls (MACs) configured to consume the data assigned to the producer port, and at least one processor configured to supply the data to a wireless interface for transmission to another wireless communication device of the communication system at a frequency of at least sixty Gigahertz.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:通信系統</p>  
        <p type="p">102:核心網路</p>  
        <p type="p">104:計算單元</p>  
        <p type="p">106:分散式單元</p>  
        <p type="p">108:無線電單元</p>  
        <p type="p">112:天線</p>  
        <p type="p">114:60GHz無線通信連接</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1510" publication-number="202611186"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611186.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611186</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>純化的聚醚矽氧烷Ｉ</chinese-title>  
        <english-title>PURIFIED POLYETHER SILOXANES I</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G77/46</main-classification>  
        <further-classification edition="201801120251201B">C09D7/65</further-classification>  
        <further-classification edition="200601120251201B">C09D175/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商贏創運營有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVONIK OPERATIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲岱爾　歐加</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIEDEL, OLGA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法輪斯　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERENZ, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於包含至少一種矽氧烷嵌段及至少一種聚醚嵌段之聚醚矽氧烷，其特徵在於該聚醚矽氧烷包含不超過0.015重量%之至少一種環狀矽氧烷D4至D6。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a polyether siloxane comprising at least one siloxane block and at least one polyether block, characterized in that the polyether siloxane comprises not more than 0.015 wt.-% of at least one cyclic siloxane D4 to D6.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1511" publication-number="202611022"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611022.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611022</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127077</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>方酸菁化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D209/40</main-classification>  
        <further-classification edition="200601120251201B">C07D215/38</further-classification>  
        <further-classification edition="200601120251201B">C07F7/18</further-classification>  
        <further-classification edition="200601120251201B">C08K5/3417</further-classification>  
        <further-classification edition="200601120251201B">C08K5/3437</further-classification>  
        <further-classification edition="200601120251201B">C08K5/42</further-classification>  
        <further-classification edition="200601120251201B">C08K5/5465</further-classification>  
        <further-classification edition="200601120251201B">C08L101/00</further-classification>  
        <further-classification edition="200601120251201B">G02B5/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本觸媒股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON SHOKUBAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>二村晋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIMURA, SHIMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀岡亜美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIOKA, AMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木正矩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方酸菁化合物，其由下式(1)表示。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="243px" width="387px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;[式(1)中，R&lt;sup&gt;11&lt;/sup&gt;與R&lt;sup&gt;21&lt;/sup&gt;表示烷基或芳烷基，R&lt;sup&gt;12&lt;/sup&gt;、R&lt;sup&gt;13&lt;/sup&gt;、R&lt;sup&gt;22&lt;/sup&gt;以及R&lt;sup&gt;23&lt;/sup&gt;表示氫原子或烷基，R&lt;sup&gt;14&lt;/sup&gt;與R&lt;sup&gt;24&lt;/sup&gt;表示C26至35之支鏈狀烷基、由下式(2)所表示之基團、或由下式(3)所表示之基團，環A&lt;sup&gt;1&lt;/sup&gt;與環A&lt;sup&gt;2&lt;/sup&gt;表示含氮雜環] &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="173px" width="269px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;[式(2)及式(3)中，R&lt;sup&gt;31&lt;/sup&gt;包含-C(=O)-R&lt;sup&gt;34&lt;/sup&gt;所表示之基團、-SO&lt;sub&gt;2&lt;/sub&gt;-R&lt;sup&gt;35&lt;/sup&gt;所表示之基團、或-SiR&lt;sup&gt;36&lt;/sup&gt;R&lt;sup&gt;37&lt;/sup&gt;R&lt;sup&gt;38&lt;/sup&gt;所表示之基團，環B表示烴環，R&lt;sup&gt;32&lt;/sup&gt;至R&lt;sup&gt;38&lt;/sup&gt;中之至少一者為C12以上之直鏈狀烷基、芳基或芳烷基]。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1512" publication-number="202611023"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611023.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611023</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127078</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含氧碳系化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D209/94</main-classification>  
        <further-classification edition="200601120251201B">C08K5/3417</further-classification>  
        <further-classification edition="200601120251201B">C08L101/00</further-classification>  
        <further-classification edition="200601120251201B">G02B5/22</further-classification>  
        <further-classification edition="202301120251201B">H04N23/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本觸媒股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON SHOKUBAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>二村晋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIMURA, SHIMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀岡亜美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIOKA, AMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種由下式(1)或式(2)表示之含氧碳系化合物。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="210px" width="590px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;式(3)中，環A表示4至9員之不飽和烴環，環B表示芳香族烴環、芳香族雜環或包含該等環結構之縮合環，R&lt;sup&gt;a&lt;/sup&gt;表示烷基或芳基，*表示與式(1)中之4員環或式(2)中之5員環之鍵合部位，當環A之環員數為4至6時，分子中具有3個以上鍵合有1至3個氟原子之sp&lt;sup&gt;3&lt;/sup&gt;碳原子，當環A之環員數為7至9時，分子中具有2個以上鍵合有1至3個氟原子之sp&lt;sup&gt;3&lt;/sup&gt;碳原子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1513" publication-number="202612002"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612002.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612002</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127081</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置之製造方法、耐熱構件及密封材料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L21/302</main-classification>  
        <further-classification edition="200601120251204B">H01L21/324</further-classification>  
        <further-classification edition="200601120251204B">H01L21/31</further-classification>  
        <further-classification edition="200601120251204B">H01L21/56</further-classification>  
        <further-classification edition="200601120251204B">C08G73/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎聰美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SATOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜東哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, DONGCHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種半導體裝置之製造方法中的偽固定製程的一例。在該製程中，在玻璃基材（10）上形成剝離層（11），在剝離層（11）的周緣（11a）上設置耐熱構件（12）。耐熱構件（12）例如為耐熱聚醯亞胺帶。在設置耐熱構件（12）後，在剝離層（11）上形成接著層（13），將接著層（13）作為預烘烤而進行加熱。其後，在拆卸耐熱構件（12）後，在接著層（13）上安裝半導體構件（20）。對剝離層（11）照射雷射，使玻璃基材（10）與半導體構件（20）分離。依據該方法，由於可防止剝離層（11）的周緣（11a）中的燒結，因此能夠容易分離玻璃基材（10）。又，由於能夠以乾淨的狀態分離玻璃基材（10），因此能夠再利用玻璃基材（10）。在基材為價格昂貴的玻璃晶圓之情況下，尤其有益。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基材</p>  
        <p type="p">11:剝離層</p>  
        <p type="p">11a:周緣</p>  
        <p type="p">12:耐熱構件(耐熱區域)</p>  
        <p type="p">13:接著層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1514" publication-number="202611559"> 
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      <tif no="1" file="202611559.zip"/>
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      <volno>24</volno>  
      <isuno>6</isuno>  
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        <document-id> 
          <doc-number>202611559</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127092</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快門裝置、光學機器、抗反射膜、及快門葉片之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G02B5/00</main-classification>  
        <further-classification edition="201501120251201B">G02B1/111</further-classification>  
        <further-classification edition="202101120251201B">G03B9/08</further-classification>  
        <further-classification edition="200601120251201B">B29D11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索馬龍股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOMAR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂爪直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAZUME, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種有效地去除入射至快門裝置的不必要光的技術。將黏合劑樹脂設為A成分，將聚乙烯縮醛樹脂設為A1成分，將黑色材料設為B成分，黑色顏料和樹脂的複合物設為B1成分。焦平面快門101中使用的快門葉片11至14、21至24在其端面上具有抗反射膜40。抗反射膜40由樹脂組成物形成，至少包含A成分和B成分。A成分包含A1成分，B成分包含平均粒徑在2μm以上且6μm以下的B1成分。相對於A成分之B成分的質量比為7以上且14以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1515" publication-number="202611560"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611560.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
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        <document-id> 
          <doc-number>202611560</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127093</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遮光構件、抗反射膜、及遮光構件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">G02B5/00</main-classification>  
        <further-classification edition="201501120251212B">G02B1/111</further-classification>  
        <further-classification edition="202101120251212B">G03B11/00</further-classification>  
        <further-classification edition="200601120251212B">B29D11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索馬龍股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOMAR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂爪直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAZUME, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種有效地去除入射至光學機器的不必要光的技術。將黏合劑樹脂設為A成分，將聚乙烯縮醛樹脂設為A1成分，將黑色材料設為B成分，黑色顏料和樹脂的複合物設為B1成分。焦平面快門101中使用的快門葉片11至14、21至24在其端面上具有抗反射膜40。抗反射膜40由樹脂組成物形成，至少包含A成分和B成分。A成分包含A1成分，B成分包含平均粒徑在2μm以上且6μm以下的B1成分。相對於A成分之B成分的質量比為7以上且14以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1516" publication-number="202611044"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611044.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611044</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127106</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製備ＢＴＫ抑制劑中間體之製程</chinese-title>  
        <english-title>PROCESS FOR PREPARING BTK INHIBITOR INTERMEDIATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D487/04</main-classification>  
        <further-classification edition="200601120251201B">A61K31/4985</further-classification>  
        <further-classification edition="200601120251201B">A61P37/00</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德拉什　提克斯恩特　芙洛恩斯　妮可　安東妮爾特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELARCHE EP. TIXERONT, FLORENCE NICOLE ANTOINETTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍夫曼　厄蘇拉　卡林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOFFMANN, URSULA　KARIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘莫洛　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMMERER, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯賓　米里亞姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUPPEN, MIRIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒維特　厄爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHWITTER, URS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供了在製備布魯頓氏酪胺酸激酶 (「BTK」) 抑制劑化合物 2-{3'-羥基甲基-1-甲基-5-[5-((S)-2-甲基-4-氧雜環丁烷-3-基-哌嗪-1-基)-吡啶-2-基胺基]-6-側氧-1,6-二氫-[3,4']聯吡啶-2'-基}-7,7-二甲基-3,4,7,8-四氫-2H,6H-環戊[4,5]吡咯并[1,2-a]吡嗪-1-酮中的中間體化合物 190 之結晶形式；製備此類結晶形式之方法；包括此類結晶形式之組成物；以及此類結晶形式之用途。 &lt;br/&gt;&lt;img align="absmiddle" height="251px" width="328px" file="ed10092.JPG" alt="ed10092.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Crystalline forms of intermediate compound 190 in the preparation of Bruton's Tyrosine Kinase ("BTK") inhibitor compound 2-{3'-hydroxymethyl-1-methyl-5-[5-((S)-2-methyl-4-oxetan-3-yl-piperazin-1-yl)-pyridin-2-ylamino]-6-oxo-1,6-dihydro-[3,4']bipyridinyl-2'-yl}-7,7-dimethyl-3,4,7,8-tetrahydro-2H,6H-cyclopenta[4,5]pyrrolo[1,2-a]pyrazin-1-one; methods of preparing such crystalline forms; compositions including such crystalline forms; and uses of such crystalline forms are provided herein. &lt;br/&gt;&lt;img align="absmiddle" height="283px" width="305px" file="ed10093.JPG" alt="ed10093.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1517" publication-number="202611071"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611071.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611071</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127113</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＧＮＲＨ組合物及避孕方法</chinese-title>  
        <english-title>GNRH COMPOSITIONS AND METHODS FOR CONTRACEPTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/18</main-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">C12N15/13</further-classification>  
        <further-classification edition="200601120251201B">C12N15/861</further-classification>  
        <further-classification edition="200601120251201B">A61P15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商邁克爾遜動物基金會公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE MICHELSON FOUND ANIMALS FOUNDATION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康倫　湯瑪斯　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONLON, THOMAS J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷克　大衛　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRAKE, DAVID A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>考克斯　葛拉漢　ＪＭ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COX, GRAHAM J.M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約翰森　卡爾　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON, CARL D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案係關於一種多肽，該多肽包含結合GnRH之VHH結構域。本揭示案亦係關於藉由投與包含GnRH結合多肽之組合物、包含編碼GnRH結合多肽之核酸之核酸或包含含有編碼GnRH結合多肽之可操作地連接至一或多個調控元件之核酸之載體之組合物在個體中降低生育力及/或預防或延遲青春期及/或避孕之組合物及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a polypeptide comprising a VHH domain that binds GnRH. The present disclosure also relates to compositions and methods of reducing fertility and/or preventing or delaying puberty and/or contraception in subjects by administering a composition comprising a GnRH binding polypeptide, a nucleic acid comprising a nucleic acid encoding a GnRH binding polypeptide, or a composition comprising a vector comprising a nucleic acid encoding a GnRH binding polypeptide operatively linked to one or more regulatory elements.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1518" publication-number="202610656"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610656.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610656</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濃縮的穩定靜脈注射依前列醇以及依前列醇鈉配方</chinese-title>  
        <english-title>CONCENTRATED STABLE IV EPOPROSTENOL AND EPOPROSTENOL SODIUM FORMULATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">A61K31/5585</main-classification>  
        <further-classification edition="200601120251208B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商威奧拉治療股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEOLA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾克特　史蒂芬羅柏特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECKERT, STEVEN ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">闡述包含依前列醇(epoprostenol)或依前列醇鈉及醫藥上可接受之載劑之醫藥組合物。該等醫藥組合物之一個實例用途係治療肺動脈高血壓。在某些實施例中，該醫藥組合物係溶液且具有隨時間增強之穩定性(即，產品將作為溶液在小瓶中供應)。目前市售之含有依前列醇或依前列醇鈉之醫藥產品呈凍乾形式以提供所需產品穩定性，且因此在使用前需要復水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Pharmaceutical compositions comprising epoprostenol or epoprostenol sodium, and a pharmaceutically acceptable carrier are described. One example use of such pharmaceutical compositions is the treatment of pulmonary arterial hypertension. In certain embodiments, the pharmaceutical composition is a solution and has enhanced stability over time (i.e., product will be supplied as a solution in a vial). The presently commercially available pharmaceutical products containing epoprostenol or epoprostenol sodium are in lyophilized forms to provide required product stability, and therefore require reconstitution before use.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1519" publication-number="202612353"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612353.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612353</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127154</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於群集的分布式虛擬電路型光交換網路系統</chinese-title>  
        <english-title>CLUSTER-BASED DISTRIBUTED OPTICAL VIRTUAL-CIRCUIT-SWITCHING NETWORK SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H04Q11/00</main-classification>  
        <further-classification edition="201301120251001B">H04B10/27</further-classification>  
        <further-classification edition="200601120251001B">H04L12/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商構光科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENOPSYS TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　啟瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUANG, CHI-JUI MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾　山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田伯隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN, PO-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種基於群集的分布式虛擬電路型光交換網路系統，包含下層光交換網路模組以及上層光交換網路模組。下層光交換網路模組包含複數第一光交換網路子系統，各第一光交換網路子系統定義一群集。上層光交換網路模組包含至少一第二光交換網路子系統，其具有相互連接的複數上層光交換機，所述上層光交換機分別對應連接所述第一光交換網路子系統。當所述光訊號於所述群集之間傳遞時，所述光訊號自所述第一光交換網路子系統之其中之一，經由至少一第二光交換網路子系統之所述上層光交換機，傳遞至所述第一光交換網路子系統之其中另一。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cluster-based distributed optical virtual-circuit-switching network system comprises a tier-1 optical switching network module and a tier-2 optical switching network module. The tier-1 optical switching network module includes multiple first optical switching network subsystems, each of which defines a cluster. The tier-2 optical switching network module includes at least one second optical switching network subsystem, which comprises multiple optical switches connected to each other. Each of the optical switches correspondingly connects to one of the first optical switching network subsystems. When the optical signals are transmitted between the clusters, they are transmitted from one of the first optical switching network subsystems to another via the optical switches of the at least one second optical switching network subsystem.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:基於群集的分布式虛擬電路型光交換網路系統</p>  
        <p type="p">100:下層光交換網路模組</p>  
        <p type="p">110:第一光交換網路子系統</p>  
        <p type="p">120:下層光交換機</p>  
        <p type="p">130:橋接光交換機</p>  
        <p type="p">140:頂部交換機</p>  
        <p type="p">150:橋接頂部交換機</p>  
        <p type="p">160:伺服器機櫃</p>  
        <p type="p">200:上層光交換網路模組</p>  
        <p type="p">210:第二光交換網路子系統</p>  
        <p type="p">210’:第二光交換網路子系統</p>  
        <p type="p">220:上層光交換機</p>  
        <p type="p">220’:上層光交換機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1520" publication-number="202611475"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611475.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611475</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測量晶圓的裝置及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251202B">G01B9/02</main-classification>  
        <further-classification edition="200601120251202B">G01B11/06</further-classification>  
        <further-classification edition="200601120251202B">G01B11/14</further-classification>  
        <further-classification edition="200601120251202B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商普雷茨特光電有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRECITEC OPTRONIK GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯汀格　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOTTINGER, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋斯　史蒂汎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEISS, STEPHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於測量晶圓（10）的一種裝置（14）及一種方法，具有光學相干斷層掃描儀（22），其係配置成產生測量光束（24）並且透過光學系統（38）將測量光束指向晶圓（10），掃描裝置（26），其係配置成使測量光束（24）沿兩個空間方向偏轉，控制單元（36），其係配置成如此控制掃描裝置（26），使得測量光束（24）相繼地在數個測量點處掃描晶圓（10）之表面，並且具有評估單元（57），其係配置成根據光學相干斷層掃描儀（22）所提供之干涉訊號計算出距離值及/或厚度值，以及攝影機（80），其係配置成擷取晶圓（10）之表面之影像，其中攝影機（80）將至少部分自晶圓（10）出發穿過光學系統（38）的攝影機光（83）成像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶圓</p>  
        <p type="p">80:攝影機</p>  
        <p type="p">81:照明模組</p>  
        <p type="p">83:攝影機光</p>  
        <p type="p">84:分束器，分束板</p>  
        <p type="p">85:感測器</p>  
        <p type="p">86:評估單元</p>  
        <p type="p">L1:透鏡</p>  
        <p type="p">L2:透鏡</p>  
        <p type="p">L3:透鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1521" publication-number="202611480"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611480.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611480</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127160</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測量距離及厚度的方法及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">G01B11/06</main-classification>  
        <further-classification edition="200601120251202B">G01B11/14</further-classification>  
        <further-classification edition="200601120251202B">G01B11/24</further-classification>  
        <further-classification edition="202201120251202B">G01B9/02091</further-classification>  
        <further-classification edition="200601120251202B">H01L21/66</further-classification>  
        <further-classification edition="200601120251202B">G02B26/10</further-classification>  
        <further-classification edition="200601120251202B">G02B27/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商普雷茨特光電有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRECITEC OPTRONIK GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧斯特　多明尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUTH, DOMINIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里格　安德烈斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRIEGER, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>密斯　賽門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIETH, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普魯紹夫　提爾曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PREUSCHOFF, TILMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種測量與工件（10）的距離以及/或者測量工件（10）之厚度的方法，具有以下步驟：藉由攝影機（80）拍攝工件（10）之至少一分區之影像；基於影像之強度值確定輸入向量；透過將經機器學習訓練的模型應用於該輸入向量來確定輸出向量；藉由光學相干斷層掃描儀（22）產生測量光束（24）；藉由光學系統（38）將測量光束（24）指向該透明物體（10）；藉由掃描裝置（26）使得測量光束（24）沿兩個空間方向偏轉，該掃描裝置被如此控制，使得測量射束相繼地在數個測量點處掃描工件（10）之表面（40）；基於光學相干斷層掃描儀（22）所提供的干涉訊號計算出距離值及/或厚度值。本發明亦有關於一種用於實施該方法的裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:工件</p>  
        <p type="p">22:光學相干斷層掃描儀</p>  
        <p type="p">24:測量光束</p>  
        <p type="p">38:光學系統</p>  
        <p type="p">80:攝影機</p>  
        <p type="p">85:感測器</p>  
        <p type="p">86:評估單元</p>  
        <p type="p">100:評估單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1522" publication-number="202610644"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610644.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610644</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127188</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>Cbl-b抑制劑的前藥化合物</chinese-title>  
        <english-title>Cbl-b inhibitor prodrug compound</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/535</main-classification>  
        <further-classification edition="200601120251201B">A61K31/437</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4196</further-classification>  
        <further-classification edition="200601120251201B">A61K31/407</further-classification>  
        <further-classification edition="200601120251201B">A61P37/00</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商廣州宇繁南圖生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANGZHOU YUFAN NANTU BIOTECHNOLOGIES CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林星雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AN, NA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸婷婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, TING-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種Cbl-b抑制劑的前藥化合物。所述化合物具有較佳的Cbl-b抑制活性和藥代特性（特別是對於口服給藥），預期在Cbl-b活性相關疾病的預防和治療方面具有非常好的研究和應用價值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a prodrug compound of a Cbl-b inhibitor. The compound exhibits excellent Cbl-b inhibitory activity and pharmacokinetic properties (particularly for oral administration), and is expected to possess significant research and application value in the prevention and treatment of diseases associated with Cbl-b activity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1523" publication-number="202611415"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611415.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611415</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127198</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多關節支撐構件、扁平狀傳送裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251130B">F16G13/16</main-classification>  
        <further-classification edition="200601120251130B">F16G13/06</further-classification>  
        <further-classification edition="200601120251130B">H02G3/04</further-classification>  
        <further-classification edition="200601120251130B">H02G11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商椿本鏈條股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUBAKIMOTO CHAIN CO.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>月芳圭一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKIYOSHI, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種即使產生製造時的尺寸偏差，亦可抑制彎曲不良及晃動的多關節支撐構件、扁平狀傳送裝置。構成多關節支撐構件（20）的鏈節構件（21）分別具有爪部（23）以及接受部（24），在卡合的狀態下藉由連結銷（25）而連結。爪部及接受部分別具有作為在連結的狀態下相互相向的相向面的側面（23A、24A）。在該些側面中的至少一個形成有與作為另一個相向面的側面（24A、23A）接觸的凸形狀部（40）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:多關節支撐構件</p>  
        <p type="p">21:鏈節構件</p>  
        <p type="p">22:基部</p>  
        <p type="p">23:爪部(卡合部)</p>  
        <p type="p">23A、24A:側面(相向面)</p>  
        <p type="p">24:接受部(卡合接受部)</p>  
        <p type="p">25:連結銷</p>  
        <p type="p">31B:直線姿勢保持面</p>  
        <p type="p">40:凸形狀部</p>  
        <p type="p">C:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1524" publication-number="202611130"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611130.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611130</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127223</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成形材料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">C08F214/26</main-classification>  
        <further-classification edition="200601120251202B">C08L27/20</further-classification>  
        <further-classification edition="200601120251202B">A61K8/70</further-classification>  
        <further-classification edition="200601120251202B">C08L101/04</further-classification>  
        <further-classification edition="200601120251202B">C08L101/12</further-classification>  
        <further-classification edition="200601120251202B">B29C65/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡貫俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANUKI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田島信哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAJIMA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明課題在於提供一種加熱初始黏度降低速度大之成形材料。&lt;br/&gt; 本發明成形材料包含含氟樹脂，該含氟樹脂包含以四氟乙烯為主體之單元、以全氟(烷基乙烯基醚)為主體之單元及以六氟丙烯為主體之單元；相對於上述含氟樹脂之全部單元，上述以全氟(烷基乙烯基醚)為主體之單元之含量為1.0~5.0質量%；相對於上述含氟樹脂之全部單元，上述以六氟丙烯為主體之單元之含量為2.4~4.8質量%；遵循ASTM D1238，在溫度372℃之條件下測定之上述成形材料的熔體流動速率為10.0~30.0g/10分鐘；以每10&lt;sup&gt;6&lt;/sup&gt;個上述含氟樹脂之主鏈碳數計，上述含氟樹脂所具有之官能基數的合計小於100個；且，預定參數A為0.005(h&lt;sup&gt;-1&lt;/sup&gt;)以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1525" publication-number="202611496"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611496.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611496</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127224</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣膠流形成裝置、粒子性狀測定裝置及粒子性狀測定方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251211B">G01N15/02</main-classification>  
        <further-classification edition="202401120251211B">G01N15/06</further-classification>  
        <further-classification edition="200601120251211B">B05B1/24</further-classification>  
        <further-classification edition="200601120251211B">B05B1/02</further-classification>  
        <further-classification edition="200601120251211B">G01N1/22</further-classification>  
        <further-classification edition="200601120251211B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商德山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUYAMA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>保坂俊輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSAKA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙井陽平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAI, YOUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下義晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, YOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種氣膠流形成裝置，其係自包含非揮發性雜質之揮發性液體形成氣膠流的裝置，其具備：管體；噴射部，其被設置於前述管體的中心軸或其附近，噴射前述揮發性液體而形成霧流；及加熱部，其將前述管體的中心軸方向的規定區域加熱，使包含於前述霧流的揮發性液體汽化而形成氣膠流；並且，前述管體在前述噴射部的下游側的端部與前述規定區域的上游側的端部之間的區域中，前述霧流擴散流動區域的距下游側的端部一半的區域以上的區域的內壁面，具有朝下游側口徑變大的倒錐形，並且前述規定區域中，距上游側的端部超過一半的區域的口徑大致相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:管體</p>  
        <p type="p">2:噴射部</p>  
        <p type="p">3:霧流</p>  
        <p type="p">4:規定區域</p>  
        <p type="p">5:氣膠流</p>  
        <p type="p">6:冷卻部</p>  
        <p type="p">7:樣品供給部</p>  
        <p type="p">8:霧流形成區域</p>  
        <p type="p">9:霧流擴張區域</p>  
        <p type="p">10:倒錐形</p>  
        <p type="p">11:距上游側的端部超過一半的區域</p>  
        <p type="p">12:直徑縮小區域</p>  
        <p type="p">13:錐形</p>  
        <p type="p">14:加熱部</p>  
        <p type="p">X:空氣吸入位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1526" publication-number="202610668"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610668.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610668</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127243</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>胜肽型核酸載體、含彼之基因治療組合物及其用途</chinese-title>  
        <english-title>PEPTIDE-TYPE NUCLEIC ACID CARRIER, GENE THERAPEUTIC COMPOSITION INCLUDING IT AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/7088</main-classification>  
        <further-classification edition="201701120251201B">A61K47/64</further-classification>  
        <further-classification edition="200601120251201B">A61K48/00</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹正雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAN, JENG-SHIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宇楓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-FON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智為</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李威聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種胜肽型核酸載體、含彼之基因治療組合物及其用途，其中，該胜肽型核酸載體包括一或多條共聚胜肽鏈，該共聚胜肽鏈包含：一親水胜肽片段及一疏水胜肽片段，該疏水胜肽片段配置於該親水胜肽片段之C端或N端，其中，該親水胜肽片段由多個攜帶正電荷的胺基酸所組成；藉由攜帶正電荷之親水胜肽片段吸引核酸片段，形成共聚胜肽-核酸複合體以遞送核酸片段至目標細胞中，由該疏水胜肽片段保護該核酸片段免於體內循環之酵素與胞內之內核體降解，增加轉染效率，提供具有前景的新型態基因治療手段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided in the present invention is a peptide-type nucleic acid carrier, a gene therapeutic composition including it and a use thereof, wherein the peptide-type nucleic acid carrier comprises one or multiple copolypeptide chain comprising: a hydrophilic peptidyl segment and a hydrophobic peptidyl segment disposed at C-terminus of the hydrophilic peptidyl segment. The hydrophilic peptidyl segment is consisted of a plurality of positively charged amino acids. With the positively charge, the hydrophilic peptidyl segment attracts nuclear fragments and form a copolypeptide-nucleic acid complex, enabling nuclear fragments’ delivery to target cells. On the other hand, the hydrophobic peptidyl segment protects the nuclear fragments from degradation by circulatory enzymes or intracellular endosome, thereby enhancing transfection efficiency. In light of this, the present invention provides an innovative means of gene therapy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:胜肽型核酸載體</p>  
        <p type="p">200:核酸片段</p>  
        <p type="p">300:共聚胜肽-核酸複合體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1527" publication-number="202611209"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611209.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611209</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127248</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合物、硬化劑、密著劑、防銹劑、樹脂組合物、硬化物、樹脂糊料、樹脂膜、印刷電路板、半導體封裝及電子裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C08K5/18</main-classification>  
        <further-classification edition="200601120251211B">C08G59/08</further-classification>  
        <further-classification edition="200601120251211B">C07D235/04</further-classification>  
        <further-classification edition="200601120251211B">C08L63/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林尚裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, NAOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種組合物，其含有成分(A)：規定之式(1)所表示之化合物及/或規定之式(2)所表示之化合物、以及成分(B)：具有成為氫鍵之受體之結構之化合物(但成分(A)除外)。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="182px" width="369px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，R&lt;sub&gt;1&lt;/sub&gt;、R&lt;sub&gt;2&lt;/sub&gt;分別獨立地為氫原子、羥基、羧基等； &lt;br/&gt;X為氫原子、可具有取代基之碳數1～20之烷基等； &lt;br/&gt;Y為氫原子、鹵素原子、羥基、羧基等； &lt;br/&gt;m為1～4之整數) &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="183px" width="403px" file="ed10020.JPG" alt="ed10020.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(2)中，X為氫原子、可具有取代基之碳數1～20之烷基等； &lt;br/&gt;Y、Z為氫原子、鹵素原子、羥基、羧基等； &lt;br/&gt;m、n分別獨立地為1～4之整數)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1528" publication-number="202610636"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610636.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610636</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127272</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療性化合物(一)</chinese-title>  
        <english-title>THERAPEUTIC COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/506</main-classification>  
        <further-classification edition="200601120251201B">A61P1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商Ｃ4Ｘ探索有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>C4X DISCOVERY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣德　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HYND, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布拉尼　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLANEY, PAUL MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博蒙特　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEAUMONT, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克恩　奧利佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KERN, OLIVER THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於作為α4β7整聯蛋白抑制劑之化合物。該等化合物具有本文所定義之結構式I。本發明亦係關於用於製備該等化合物之方法、包含該等化合物之醫藥組合物及其在治療與α4β7相關之疾病或病症中之用途。&lt;b&gt;  &lt;/b&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to compounds that are α4β7 integrin inhibitors. The compounds have the structural formula I defined herein. The present invention also relates to processes for the preparation of these compounds, to pharmaceutical compositions comprising them, and to their use in the treatment of diseases or disorders associated with α4β7.&lt;b&gt;  &lt;/b&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1529" publication-number="202612008"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612008.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612008</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127276</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">H01L21/304</main-classification>  
        <further-classification edition="200601120251203B">H01L21/677</further-classification>  
        <further-classification edition="200601120251203B">H01L21/68</further-classification>  
        <further-classification edition="200601120251203B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永松辰也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAMATSU, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森本大貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIMOTO, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供可減低製程性能之偏差的技術。 &lt;br/&gt;本揭示之一態樣的基板處理方法具有下列步驟：進行將複數片基板一併處理之批次次處理；於該批次次處理後，進行將複數片該基板逐片處理之單片處理；確定設置於已進行該批次次處理之該基板的外周之缺口部的位置；使該基板旋轉成所確定之該缺口部的該位置為第1位置；進行該單片處理之步驟包含使該基板乾燥之步驟，使該基板旋轉之步驟係於使該基板乾燥之步驟前進行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S103:步驟</p>  
        <p type="p">S111~S117:步驟</p>  
        <p type="p">S121~S122:步驟</p>  
        <p type="p">S124~S126:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1530" publication-number="202612335"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612335.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612335</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127284</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於端對端學習之動態點雲編碼框架</chinese-title>  
        <english-title>END-TO-END LEARNING-BASED DYNAMIC POINT CLOUD CODING FRAMEWORK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251201B">H04N19/597</main-classification>  
        <further-classification edition="201401120251201B">H04N19/50</further-classification>  
        <further-classification edition="201401120251201B">H04N19/42</further-classification>  
        <further-classification edition="201401120251201B">H04N19/513</further-classification>  
        <further-classification edition="201401120251201B">H04N19/91</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位ＶＣ控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL VC HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龐　家昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANG, JIAHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛迪　穆罕默德　阿薩德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LODHI, MUHAMMAD ASAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安鼎鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, JUNGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田　棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">方法的一些實施方式可包含：藉由存取運動位元流而解碼運動特徵；基於運動特徵及一或更多個參考點雲訊框而預測所預測特徵；解碼表示子級立體像素的佔用狀態的第一特徵；基於第一特徵及預測特徵而預測第二特徵；及經由第二特徵而解碼子級立體像素的樹立體像素佔用狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments of a method may include: decoding a motion feature by accessing a motion bitstream; predicting a predicted feature based on the motion feature and one or more reference point cloud frames; decoding a first feature representing an occupancy status of a child level voxel; predicting a second feature based on the first feature and the predicted feature; and decoding a tree voxel occupancy status of the child level voxel via the second feature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1700:程序</p>  
        <p type="p">1702,1704,1706,1708,1710,1712,1714,1716:類CNN神經網路區塊</p>  
        <p type="p">1718,1720,1722,1724:運動評估區塊(ME)</p>  
        <p type="p">1726,1728,1730,1732:特徵編碼器(FE)區塊</p>  
        <p type="p">1734,1736,1738,1740:運動位元流BS&lt;sub&gt;mot&lt;/sub&gt;</p>  
        <p type="p">1742,1744,1746,1748:特徵解碼器(FD)區塊</p>  
        <p type="p">1750,1752,1754:參數評估器(PE)</p>  
        <p type="p">1756,1758,1760,1762:預測器產生器區塊(PG)</p>  
        <p type="p">CNN:3D卷積神經網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1531" publication-number="202610774"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610774.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610774</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127296</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械拋光屏蔽</chinese-title>  
        <english-title>CHEMICAL MECHANICAL POLISHING SHIELDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251204B">B24B37/34</main-classification>  
        <further-classification edition="200601120251204B">B24B57/00</further-classification>  
        <further-classification edition="200601120251204B">B08B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昊晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HAOSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡德芬　蕭恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DER VEEN, SHAUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾　艾爾頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, ELTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬有道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, YUTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛洛德　愛德華Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLOYD, EDWARD L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧加森　艾蜜莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUGASON, EMILY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡　阿希什庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAIN, ASHEESH KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德什潘德　山彌爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESHPANDE, SAMEER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">拋光系統包括外殼，具有側壁和天花板以形成拋光腔室，位於腔室內的平臺用以支撐拋光墊，位於腔室內的承載頭用以固定基板，電動機用於生成平臺和承載頭之間的相對運動，具有與位於外殼外部的儲液庫流體連通的拋光液供應線的拋光液分配器，以及位於腔室內的屏蔽裝置。該屏蔽裝置具有背板，其平坦的內表面面對平臺，並有複數個可單獨剝離的層片附著於背板的內表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polishing system includes a housing having sidewalls and a ceiling to form a polishing chamber, a platen located in the chamber to support a polishing pad, a carrier head located in the chamber to hold a substrate, a motor to generate relative motion between the platen and the carrier head, a polishing liquid dispenser having a polishing liquid supply line in fluid communication with a reservoir positioned outside the housing, and a shield positioned inside the chamber. The shield has a backing plate having a flat inner surface facing the platen, and a laminate of a plurality of individually peelable layers attached to the inner surface of the backing plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">40:外殼</p>  
        <p type="p">42:側壁</p>  
        <p type="p">46:拋光腔室</p>  
        <p type="p">49:埠</p>  
        <p type="p">50:轉移站</p>  
        <p type="p">52:基板支撐</p>  
        <p type="p">60:拋光平臺</p>  
        <p type="p">70:拋光墊</p>  
        <p type="p">80:承載頭</p>  
        <p type="p">86:扣環</p>  
        <p type="p">100:分配器</p>  
        <p type="p">102:供應埠</p>  
        <p type="p">104:漿料供應臂</p>  
        <p type="p">106:基座</p>  
        <p type="p">110:拋光液儲液庫</p>  
        <p type="p">112:管道</p>  
        <p type="p">114:泵</p>  
        <p type="p">116:控制閥</p>  
        <p type="p">130:調節系統</p>  
        <p type="p">132:調節頭</p>  
        <p type="p">134:臂</p>  
        <p type="p">136:基座</p>  
        <p type="p">140:沖洗液分配器</p>  
        <p type="p">142:臂</p>  
        <p type="p">144:孔</p>  
        <p type="p">146:管道</p>  
        <p type="p">148:沖洗液供應</p>  
        <p type="p">150:加熱或冷卻流體分配器</p>  
        <p type="p">152:臂</p>  
        <p type="p">154:孔</p>  
        <p type="p">156:管道</p>  
        <p type="p">158:加熱或冷卻流體供應</p>  
        <p type="p">160:擋板</p>  
        <p type="p">190:控制器</p>  
        <p type="p">200:屏蔽裝置</p>  
        <p type="p">200a:屏蔽裝置</p>  
        <p type="p">200b:屏蔽裝置</p>  
        <p type="p">210:背板</p>  
        <p type="p">220:層片/層壓體</p>  
        <p type="p">A:箭頭</p>  
        <p type="p">B:箭頭</p>  
        <p type="p">C:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1532" publication-number="202610945"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610945.zip"/>
    </tif-files>
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      <volno>24</volno>  
      <isuno>6</isuno>  
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        <document-id> 
          <doc-number>202610945</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127297</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體、元件及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">C01G49/02</main-classification>  
        <further-classification edition="200601120251202B">C23C14/08</further-classification>  
        <further-classification edition="201901120251202B">B32B7/028</further-classification>  
        <further-classification edition="200601120251202B">B32B27/04</further-classification>  
        <further-classification edition="200601120251202B">H01L21/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立研究開發法人理化學研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIKEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎安達洛賈斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LLANDRO, JUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村優男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, MASAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田口康二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAGUCHI, YASUJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>十倉好紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKURA, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之積層體具備基板、及形成於上述基板上之膜。上述膜具有包含Y型六角鐵氧體之磊晶層。上述Y型六角鐵氧體以通式(Ba&lt;sub&gt;1&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;x&lt;/sub&gt;Sr&lt;sub&gt;x&lt;/sub&gt;)&lt;sub&gt;2&lt;/sub&gt;Co&lt;sub&gt;2&lt;/sub&gt;Fe&lt;sub&gt;12&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;y&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;δ&lt;/sub&gt;Al&lt;sub&gt;y&lt;/sub&gt;X&lt;sub&gt;δ&lt;/sub&gt;O&lt;sub&gt;22&lt;/sub&gt;表示。X為選自由Cr、Sb、In及V所組成之群中之至少一種元素。0≤x≤1，1＜y≤6，且0≤δ≤1。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1533" publication-number="202612403"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612403.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612403</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合金屬箔及該複合金屬箔的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">H05K1/09</main-classification>  
        <further-classification edition="200601120251209B">C25D5/10</further-classification>  
        <further-classification edition="200601120251209B">B32B15/01</further-classification>  
        <further-classification edition="200601120251209B">C25D7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福田金屬箔粉工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA METAL FOIL &amp; POWDER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白井佑季</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森岡伸哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIOKA, NOBUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種複合金屬箔，其是在異種金屬層上層疊有第二銅層的複合金屬箔，能夠通過選擇性蝕刻而形成電路，並且異種金屬層與第二銅層的對比度清晰而易於識別，因此，不易產生圖像檢查中的電路圖案的錯誤檢測或檢測遺漏、以及多層化時的位置偏移，因此，能夠適宜用於印刷線路板。複合金屬箔包括至少一個第一銅層/異種金屬層/第二銅層的層結構，其中，層疊第二銅層的異種金屬層表面的亮度L*&lt;sub&gt;A&lt;/sub&gt;值-第二銅層表面的亮度L*&lt;sub&gt;Cu&lt;/sub&gt;值為15以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:複合金屬箔</p>  
        <p type="p">20:第一銅層</p>  
        <p type="p">30:異種金屬層</p>  
        <p type="p">40:第二銅層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1534" publication-number="202612404"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612404.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612404</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127306</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合金屬箔及該複合金屬箔的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">H05K1/09</main-classification>  
        <further-classification edition="200601120251209B">C25D5/10</further-classification>  
        <further-classification edition="200601120251209B">B32B15/01</further-classification>  
        <further-classification edition="200601120251209B">C25D5/38</further-classification>  
        <further-classification edition="200601120251209B">C25D7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福田金屬箔粉工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA METAL FOIL &amp; POWDER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白井佑季</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大城行弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHSHIRO, YUKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森岡伸哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIOKA, NOBUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種複合金屬箔，其是在鎳層上層疊有第二銅層的複合金屬箔，能夠通過選擇性蝕刻而形成電路，並且異種金屬間的對比度清晰而易於識別，因此，不易產生圖像檢查中的電路圖案的錯誤檢測或檢測遺漏、以及多層化時的位置偏移，因此，能夠適宜用於印刷線路板。複合金屬箔包括至少一個第一銅層/鎳層/第二銅層的層結構，其中，所述第二銅層表面的亮度L*&lt;sub&gt;Cu&lt;/sub&gt;值與層疊所述第二銅層的鎳層表面的亮度L*&lt;sub&gt;Ni&lt;/sub&gt;值之差的絕對值為15以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:複合金屬箔</p>  
        <p type="p">20:第一銅層</p>  
        <p type="p">30:鎳層</p>  
        <p type="p">30a:鎳包覆層</p>  
        <p type="p">40:第二銅層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1535" publication-number="202610965"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610965.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610965</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127323</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>由含丁烯烴流生產Ｃ９醛／Ｃ９醇的方法</chinese-title>  
        <english-title>PROCESS FOR PRODUCING C9-ALDEHYDES/C9-ALCOHOLS FROM BUTENE-CONTAINING HYDROCARBON STREAMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C2/30</main-classification>  
        <further-classification edition="200601120251201B">C07C7/04</further-classification>  
        <further-classification edition="200601120251201B">C07C11/02</further-classification>  
        <further-classification edition="200601120251201B">C07C47/02</further-classification>  
        <further-classification edition="200601120251201B">C07C45/50</further-classification>  
        <further-classification edition="200601120251201B">C07C45/82</further-classification>  
        <further-classification edition="200601120251201B">C07C29/141</further-classification>  
        <further-classification edition="200601120251201B">C07C31/125</further-classification>  
        <further-classification edition="200601120251201B">B01J23/755</further-classification>  
        <further-classification edition="200601120251201B">B01J31/14</further-classification>  
        <further-classification edition="200601120251201B">B01J31/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商贏創奧克森諾有限責任兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVONIK OXENO GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法蘭克　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRANKE, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷赫　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRAECHER, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福立達格　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRIDAG, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬爾科維奇　安納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARKOVIC, ANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RS</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯尼格　馬蒂亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOENIG, MATTHIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫米切奇克　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUCMIERCZYK, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽爾　安娜　基亞拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALE, ANNA CHIARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布倫斯　巴斯提安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUNS, BASTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杰倫　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEILEN, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽門　貝爾諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMON, BERNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案係關於一種由含丁烯烴流生產C9醇，較佳異壬醇的方法。該方法包括使丁烯發生低聚合反應，使低聚合反應產物發生氫甲醯化反應，得到C9醛，較佳異壬醛，及使C9醛發生氫化反應，獲得C9醇，較佳異壬醇。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a process for producing C9-alcohols, preferably isononanol, from butene-containing hydrocarbon streams. The process comprises oligomerization of the butenes, hydroformylation of the oligomerization products to afford C9-aldehydes, preferably isononanal, and hydrogenation of the C9-aldehydes to obtain the C9-alcohols, preferably the isononanol.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:反應器/階段/工段</p>  
        <p type="p">200:汽提塔/階段/工段</p>  
        <p type="p">300:蒸發器/階段/工段</p>  
        <p type="p">400:冷箱/階段/工段</p>  
        <p type="p">500:蒸餾塔/階段/工段</p>  
        <p type="p">600:階段/工段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1536" publication-number="202611227"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611227.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611227</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127334</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、預浸體、積層板、覆金屬積層板、印刷線路板及半導體封裝體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08L63/00</main-classification>  
        <further-classification edition="200601120251201B">C08K5/5399</further-classification>  
        <further-classification edition="200601120251201B">C08K9/06</further-classification>  
        <further-classification edition="200601120251201B">C08J5/24</further-classification>  
        <further-classification edition="200601120251201B">B32B15/092</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本德彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, NORIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>須藤恭介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUTOU, KYOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>砂入允哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNAIRI, YOSHIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城野啓太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNO, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種樹脂組成物，其會顯現優異的阻燃性以及高銅箔剝離強度及高耐除膠渣性。並且，提供一種預浸體、積層板、覆金屬積層板、印刷線路板及半導體封裝體，其使用該樹脂組成物來製造。前述樹脂組成物具體而言為一種樹脂組成物，其含有：(A)熱硬化性樹脂、及(B)阻燃劑，並且，前述(B)阻燃劑包含(B1)具有苯乙烯骨架的磷系阻燃劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1537" publication-number="202611425"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611425.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611425</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配管或配線的固定構造</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">F16L5/02</main-classification>  
        <further-classification edition="200601120251202B">F17C13/12</further-classification>  
        <further-classification edition="200601120251202B">F17C7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士金股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKIN INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗城春彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURIKI, HARUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">固定構造(10)，用於固定從氣體箱(30)的內部向外部延伸的配管(20)或配線，具備有：板狀構件(12)，配置為覆蓋氣體箱的開口部(30H)並固定於氣體箱，並且具有供配管(20)或配線通過的貫通孔(12H)；塊構件(14)，固定於板狀構件(12)，並且具有供配管(20)或配線通過的貫通孔(14H)；及環狀密封構件(18)，配置於塊構件的貫通孔(14H)中，並與配管(20)或配線的外周面接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:固定構造</p>  
        <p type="p">12:板狀構件</p>  
        <p type="p">12H:貫通孔</p>  
        <p type="p">14:塊構件</p>  
        <p type="p">14H:貫通孔</p>  
        <p type="p">20:配管</p>  
        <p type="p">30:氣體箱</p>  
        <p type="p">30H:開口部</p>  
        <p type="p">40:氣體處理裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1538" publication-number="202610660"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610660.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610660</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127406</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療及預防ＨＩＶ與ＡＩＤＳ之方法</chinese-title>  
        <english-title>METHODS FOR TREATMENT AND PROPHYLAXIS OF HIV AND AIDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/7076</main-classification>  
        <further-classification edition="200601120251201B">A61P31/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商默沙東有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK SHARP &amp; DOHME LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈族達　達利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAZUDA, DARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米勒　麥可　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLER, MICHAEL D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>果卜勒　潔　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GROBLER, JAY A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼寇　古利非斯　黛柏拉　安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NICOLL-GRIFFITH, DEBORAH ANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於藉由低於每日投藥一次的頻率投與結構式I之化合物或其醫藥學上可接受之鹽或共晶體來抑制HIV反轉錄酶、治療HIV感染、預防HIV感染，及治療、預防及/或延遲AIDS或ARC之發作或演進的方法 &lt;br/&gt;&lt;img align="absmiddle" height="175px" width="229px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;其中X為-F或-Cl。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is directed to methods for inhibition of HIV reverse transcriptase, treatment of infection by HIV, prophylaxis of infection by HIV, and the treatment, prophylaxis and/or delay in the onset or progression of AIDS or ARC by administering a compound of structural Formula I &lt;br/&gt;&lt;img align="absmiddle" height="193px" width="233px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;or a pharmaceutically acceptable salt or co-crystal thereof, wherein X is -F or -Cl, less frequently than once daily.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1539" publication-number="202610557"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610557.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610557</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127435</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸嚐裝置及方法</chinese-title>  
        <english-title>INHALING DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251209B">A24F40/57</main-classification>  
        <further-classification edition="202001120251209B">A24F40/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本煙草產業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN TOBACCO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田学</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, MANABU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種吸嚐裝置，該吸嚐裝置係具備：加熱部，係將吸嚐物品源予以加熱；電源部，係供給電力至加熱部；通知部，係對於吸嚐裝置的使用者進行通知；及控制部，係依據規定有整個吸嚐期間之加熱部之目標溫度之時間序列變化的加熱設定資料而執行吸嚐期間。在此吸嚐裝置中，控制部構成為根據吸嚐物品源中所含的水分量而決定是否要使通知部執行促使使用者進行預定之行動的第一通知動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is an inhaling device that includes a heating unit for heating an inhalable article source, a power supply unit for supplying power to the heating unit, a notification unit for notifying a user of the inhaling device, and a control unit for executing an inhalation session according to a heating profile that defines a time series transition of a target temperature of the heating unit over the inhalation session. In this device, the control unit is configured to determine, based on the amount of moisture contained in the inhalable article source, whether to cause the notification unit to execute a first notification operation that prompts the user to take a predetermined action.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1540" publication-number="202611112"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611112.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611112</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127446</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>RESIST COMPOSITION AND PATTERNING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/02</main-classification>  
        <further-classification edition="200601120251201B">C08F220/06</further-classification>  
        <further-classification edition="200601120251201B">C08F220/18</further-classification>  
        <further-classification edition="200601120251201B">C08F220/30</further-classification>  
        <further-classification edition="200601120251201B">C08F220/22</further-classification>  
        <further-classification edition="200601120251201B">C07C25/18</further-classification>  
        <further-classification edition="200601120251201B">C07C69/63</further-classification>  
        <further-classification edition="200601120251201B">C07C381/12</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊地駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草間理志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAMA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大山皓介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHYAMA, KOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，感度及極限解析度優良的非化學增幅阻劑組成物，以及使用該阻劑組成物之圖案形成方法。 &lt;br/&gt;該課題之解決手段為一種阻劑組成物，含有： &lt;br/&gt;式(1)~(4)中之任一者表示之至少1種超原子價碘化合物， &lt;br/&gt;預定之鎓鹽化合物， &lt;br/&gt;含羧基之化合物，及 &lt;br/&gt;溶劑。 &lt;br/&gt;&lt;img align="absmiddle" height="335px" width="567px" file="ed10203.JPG" alt="ed10203.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resist composition comprising a hypervalent iodine compound, an onium salt, a carboxy-containing compound, and a solvent is provided. When processed by photolithography using high-energy radiation, the resist composition exhibits a high sensitivity and resolution.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1541" publication-number="202610998"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610998.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610998</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127479</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄膜形成用原料、薄膜、薄膜之製造方法及化合物</chinese-title>  
        <english-title>THIN-FILM FORMING RAW MATERIAL, THIN-FILM, METHOD OF PRODUCING THIN-FILM, AND COMPOUND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C257/12</main-classification>  
        <further-classification edition="200601120251201B">C07F5/00</further-classification>  
        <further-classification edition="200601120251201B">C23C16/40</further-classification>  
        <further-classification edition="200601120251201B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＤＥＫＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEKA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畑瀨雅子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATASE, MASAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島亮太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示係有關於含有下述通式(1)所示之化合物之薄膜形成用原料、薄膜之製造方法及下述通式(3)所示之化合物。 &lt;br/&gt;　　M(L)&lt;sub&gt;n&lt;/sub&gt;  (1) &lt;br/&gt;　　(通式(1)中，M表示鑭除外之稀土類元素，L表示下述式(2)所示之脒配位基，n表示2~4的整數。) &lt;br/&gt;&lt;img align="absmiddle" height="201px" width="262px" file="ed10061.JPG" alt="ed10061.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(通式(2)中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示碳原子數1以上、8以下的烷基，R&lt;sup&gt;3&lt;/sup&gt;表示氫原子或碳原子數1以上、5以下的烷基，*表示與M之鍵結位置。惟，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;為相異之基。) &lt;br/&gt;&lt;img align="absmiddle" height="232px" width="300px" file="ed10062.JPG" alt="ed10062.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(通式(3)中，M表示鑭除外之稀土類元素，R&lt;sup&gt;4&lt;/sup&gt;及R&lt;sup&gt;5&lt;/sup&gt;分別獨立地表示碳原子數1以上、8以下的烷基，R&lt;sup&gt;6&lt;/sup&gt;表示氫原子或碳原子數1以上、5以下的烷基。惟，R&lt;sup&gt;4&lt;/sup&gt;及R&lt;sup&gt;5&lt;/sup&gt;為相互不同之基，R&lt;sup&gt;4&lt;/sup&gt;及R&lt;sup&gt;5&lt;/sup&gt;所示之基的碳原子數之總計為7以上、15以下。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1542" publication-number="202612510"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612510.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612510</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127488</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＬＤＭＯＳ電晶體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251002B">H10D30/64</main-classification>  
        <further-classification edition="202501120251002B">H10D62/10</further-classification>  
        <further-classification edition="202501120251002B">H10D64/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商矽力杰半導體技術（杭州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喻慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種LDMOS電晶體，包含：井區；位於所述井區中的第一摻雜類型的源極區和第一摻雜類型的汲極區；臨近所述源極區的閘極介電層，位於所述井區的上表面上；臨近所述汲極區的耐壓層，位於所述井區上，以及緩衝場板，位於所述閘極介電層和所述耐壓層之間，且位於所述井區的上表面上，其中，所述耐壓層的厚度大於所述緩衝場板的厚度，所述緩衝場板的厚度大於所述閘極介電層的厚度。所述緩衝場板用於緩解所述閘極介電層靠近汲極區側的電場，可減小閘極介電層長度，降低開啟該電晶體所需電荷，並可減緩電晶體在高電壓下工作時出現在所述閘極介電層處的穿隧電流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:基板</p>  
        <p type="p">102:井區</p>  
        <p type="p">103:漂移區</p>  
        <p type="p">104:體區</p>  
        <p type="p">105:源極區</p>  
        <p type="p">106:汲極區</p>  
        <p type="p">107:體接觸區</p>  
        <p type="p">111:閘極介電層</p>  
        <p type="p">112:緩衝場板</p>  
        <p type="p">113:耐壓層</p>  
        <p type="p">120:閘極導體</p>  
        <p type="p">121:場遮罩導體</p>  
        <p type="p">D:汲極電極</p>  
        <p type="p">S:源極電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1543" publication-number="202612511"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612511.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612511</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127489</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＬＤＭＯＳ電晶體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251105B">H10D30/65</main-classification>  
        <further-classification edition="202501120251105B">H10D62/10</further-classification>  
        <further-classification edition="200601120251105B">H01L21/762</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商矽力杰半導體技術（杭州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喻慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種LDMOS電晶體，包含：井區；第二摻雜類型的體區，從所述井區的上表面延伸至所述井區的內部；第一摻雜類型的源極區和第二摻雜類型的體接觸區，從所述體區的上表面延伸至其內部；第一摻雜類型的汲極區，位於所述井區中；以及源極，與所述體接觸區和所述源極區接觸；其中，所述體接觸區的接面深度大於所述源極區的接面深度，以減小表面寄生電晶體的基極電阻，進而減小該寄生電晶體對LDMOS電晶體穩健性的影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:基板</p>  
        <p type="p">102:井區</p>  
        <p type="p">103:漂移區</p>  
        <p type="p">104:體區</p>  
        <p type="p">105:源極區</p>  
        <p type="p">106:汲極區</p>  
        <p type="p">107:體接觸區</p>  
        <p type="p">140:閘極導體</p>  
        <p type="p">141:閘極介電層</p>  
        <p type="p">142:耐壓層</p>  
        <p type="p">D:汲極電極</p>  
        <p type="p">S:源極電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1544" publication-number="202611870"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611870.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611870</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127500</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>產生三維手部模型的方法及其系統、非暫態電腦可讀取媒體</chinese-title>  
        <english-title>METHOD FOR GENERATING A THREE-DIMENSIONAL HAND MODEL AND SYSTEM THEREOF, NON-TRANSITORY COMPUTER READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06T17/20</main-classification>  
        <further-classification edition="201701120251201B">G06T7/33</further-classification>  
        <further-classification edition="200601120251201B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張夢翮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, MENGHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金俊燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JOONYEOUP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　揚文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YANGWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　雙全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHUANGQUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋　基逢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, KEE-BONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供產生三維手部模型的方法和系統。方法包括：接收從複數個追蹤系統收集的異質手部關鍵點；執行粗略優化程序以將異質手部關鍵點對齊到解剖學參考系中以產生統一的手部關鍵點；執行精細優化程序以將手部網格模型適配到統一的手部關鍵點；使用適配到統一的手部關鍵點的手部網格模型產生3D手部網格；使用已訓練的模型從3D手部網格獲得解剖學接頭位置；以及輸出包括3D手部網格和解剖學接頭位置的3D手部模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and a system for generating a 3D hand model are provided. The method includes: receiving heterogeneous hand keypoints collected from a plurality of tracking systems; performing a coarse optimization process to align the heterogeneous hand keypoints into an anatomical reference frame to produce unified hand keypoints; performing a fine optimization process to fit a hand mesh model to the unified hand keypoints; generating a 3D hand mesh using the hand mesh model fit to the unified hand keypoints; obtaining anatomical joint positions from the 3D hand mesh using a trained model; and outputting the 3D hand model including the 3D hand mesh and the anatomical joint positions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">105、110、115、120、125、130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1545" publication-number="202611327"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611327.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611327</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127514</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成過渡金屬二硫屬化物膜的方法</chinese-title>  
        <english-title>METHODS OF FORMING TRANSITION METAL DICHALCOGENIDE FILMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">C23C16/40</main-classification>  
        <further-classification edition="200601120251205B">C23C16/455</further-classification>  
        <further-classification edition="200601120251205B">C23C16/52</further-classification>  
        <further-classification edition="200601120251205B">C23C16/56</further-classification>  
        <further-classification edition="200601120251205B">H01L21/324</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡國立大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY OF SINGAPORE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達斯　昌丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAS, CHANDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼加圖查利　穆罕默德朱維德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANGATTUCHALI, MUHAMMED JUVAID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　杰叢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, JIECONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇迪喬諾　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUDIJONO, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格拉德卡克加拉杰　希薇亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRADECAK-GARAJ, SILVIJA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了沉積過渡金屬二硫屬化物（TMDC）膜的方法。該等TMDC膜可用於電子裝置中，例如，取決於TMDC的生長溫度，作為後段製程（BEOL）和前段製程（FEOL）應用兩者中的通道材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of depositing transition metal dichalcogenide (TMDC) films are described. The TMDC films can be used in electronic devices as, for example, a channel material in both back-end-of-line (BEOL) and front-end-of line (FEOL) applications depending on the TMDC growth temperature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">105:操作</p>  
        <p type="p">110:沉積製程循環</p>  
        <p type="p">112:第一階段</p>  
        <p type="p">113:操作</p>  
        <p type="p">114:操作</p>  
        <p type="p">115:操作</p>  
        <p type="p">116:操作</p>  
        <p type="p">120:第二階段</p>  
        <p type="p">121:操作</p>  
        <p type="p">122:操作</p>  
        <p type="p">130:操作</p>  
        <p type="p">140:操作</p>  
        <p type="p">150:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1546" publication-number="202610921"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610921.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610921</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127517</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送設備</chinese-title>  
        <english-title>TRANSPORT FACILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">B65G67/02</main-classification>  
        <further-classification edition="200601120251203B">B65G43/08</further-classification>  
        <further-classification edition="200601120251203B">B65G47/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村和誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, KAZUNARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種搬送設備，具備搬送車2及供搬送車2行走之地板面31。搬送車2會搬送搬送對象物。搬送車2具備在地板面31上滾動之車輪222、及用於辨識地板面31上的自身車位置的自身車位置辨識裝置23。搬送車2構成為依據自身車位置辨識裝置23所辨識之自身車位置的辨識結果，以事先設定之基準位置為基準來進行方向轉換。搬送車2會執行方向轉換位置分散處理，前述方向轉換位置分散處理是在以相同的基準位置為基準之複數次方向轉換中，在已設定之分散範圍P內使方向轉換位置分散。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:搬送車</p>  
        <p type="p">222:車輪</p>  
        <p type="p">23:自身車位置辨識裝置</p>  
        <p type="p">23A:行走路徑</p>  
        <p type="p">23R:可行走路徑</p>  
        <p type="p">231:被檢測部</p>  
        <p type="p">232:檢測部</p>  
        <p type="p">31:地板面</p>  
        <p type="p">4:補強構件</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p>  
        <p type="p">P:分散範圍</p>  
        <p type="p">P1:第1位置</p>  
        <p type="p">P2:第2位置</p>  
        <p type="p">P3:第3位置</p>  
        <p type="p">P4:第4位置</p>  
        <p type="p">P5:第5位置</p>  
        <p type="p">W1:驅動輪</p>  
        <p type="p">W2:從動輪</p>  
        <p type="p">WX:旋繞中心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1547" publication-number="202611587"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611587.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611587</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容納光學元件的裝置</chinese-title>  
        <english-title>DEVICE FOR ACCOMMODATING OPTICAL ELEMENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251205B">G02B7/198</main-classification>  
        <further-classification edition="200601120251205B">G02B27/18</further-classification>  
        <further-classification edition="201201120251205B">G03F1/22</further-classification>  
        <further-classification edition="201201120251205B">G03F1/66</further-classification>  
        <further-classification edition="201201120251205B">G03F1/84</further-classification>  
        <further-classification edition="200601120251205B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史坦普　提姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAMPE, TIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於容納半導體技術設備的光學元件（25）的裝置 （100）。該裝置（100）包含多個支撐元件（120），該些支撐元件 （120） 實質上彼此平行延伸，並以懸臂方式在其彈性極限內彈性變形，並經成型與排列，使得該光學元件（25）可連接至該支撐元件（120）的自由端（121）以進行容納，其中在施加一限定的槓桿力時，該至少部分支撐元件（120）產生塑性變形，使得該自由端（121）從先前該已容納的光學元件（25）上脫離。本發明還關於一種設備，該設備包含本發明的裝置（100）、用於施加限定槓桿力的工具（200）及其用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a device (100) for accommodating optical elements (25) of a semiconductor technology apparatus. The device (100) comprises a plurality of holding elements (120) which extend substantially parallel to one another, are elastically deformable in the manner of a cantilever to their elastic limit, and are formed and arranged in such a way that an optical element (25) is connectable for accommodation purposes to the free ends (121) of the holding elements (120), wherein at least part of the holding elements (120) are plastically deformable when applying a defined lever force in such a way that the free ends (121) are removed from a previously accommodated optical element (25). The invention further relates to an apparatus comprising a device (100) according to the invention, a tool (200) for applying the defined lever force and its use.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:裝置/腳座</p>  
        <p type="p">101:容納環/底座</p>  
        <p type="p">120:支撐元件</p>  
        <p type="p">121:自由端</p>  
        <p type="p">122:黏合表面</p>  
        <p type="p">123:凹口/嚙合部</p>  
        <p type="p">125:突起</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1548" publication-number="202610969"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610969.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610969</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127551</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單氟乙烷的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">C07C17/08</main-classification>  
        <further-classification edition="200601120251203B">C07C19/08</further-classification>  
        <further-classification edition="200601120251203B">B01J27/132</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増川和樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUKAWA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩崎淳平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASAKI, JUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種單氟乙烷的製造方法，其即使在溫和的反應條件下亦能以高轉化率地從乙烯與氟化氫製造單氟乙烷。單氟乙烷的製造方法包含：使乙烯之氣體與氟化氫之氣體在觸媒的存在下進行反應而得到單氟乙烷。觸媒係含有作為氟化鉻及氟氧化鉻中的至少一者之鉻化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1549" publication-number="202611088"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611088.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611088</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127553</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>5T4結合多肽及其用途</chinese-title>  
        <english-title>5T4 BINDING POLYPEPTIDES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">C07K16/30</main-classification>  
        <further-classification edition="200601120251208B">A61K39/395</further-classification>  
        <further-classification edition="200601120251208B">A61K51/10</further-classification>  
        <further-classification edition="200601120251208B">A61P35/00</further-classification>  
        <further-classification edition="200601320251208B">A61K103/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雅博得樂醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABDERA THERAPEUTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼德爾　亞歷山大　羅倫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANDEL, ALEXANDER LAURENCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維斯渥　拉傑　所羅門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VISWAS, RAJA SOLOMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬祺　亞當　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUDGE, ADAM DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雅伯瑞　麥可　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABRAMS, MICHAEL J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡明斯　艾瑪　珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUMMINS, EMMA JANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥可歐德　布蘭登　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCLEOD, BRANDON ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫立克　伊法</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KULIC, IVA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥凱　道格拉斯　布魯斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACKAY, DOUGLAS BRUCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述結合至5T4之多肽，其可用於癌症療法。本文中進一步揭示結合至5T4之多肽，其軛合至螯合劑或放射性核種錯合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are polypeptides that bind to 5T4 useful for cancer therapy. Further disclosed herein are polypeptides that bind to 5T4 that are conjugated to a chelating agent or a radionuclide complex thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1550" publication-number="202611231"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611231.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611231</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127570</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚醯胺組成物及由彼製造的物件</chinese-title>  
        <english-title>POLYAMIDE COMPOSITION AND ARTICLES PREPARED THEREFROM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">C08L77/08</main-classification>  
        <further-classification edition="200601120251203B">C08L53/00</further-classification>  
        <further-classification edition="200601120251203B">C08G69/30</further-classification>  
        <further-classification edition="200601120251203B">C08J5/22</further-classification>  
        <further-classification edition="200601120251203B">C08K5/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商贏創運營有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVONIK OPERATIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇特　麥希米里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOERDT, MAXIMILIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹奇　瓦倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANKE, VARUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克林　安德魯斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLEIN, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根斯海默　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENSHEIMER, MARCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種聚醯胺組成物，其包含：a)環脂族聚醯胺；b)經酸改質之聚合物；及c)經胺改質之聚合物。亦揭示一種製造該組成物的方法及由該聚醯胺組成物製造的物件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a polyamide composition comprising a) a cycloaliphatic polyamide; b) an acid modified polymer; and c) an amine modified polymer. Also disclosed is a method to prepare the composition and an article prepared from the polyamide composition.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1551" publication-number="202612400"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612400.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612400</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127583</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配線基板及樹脂膜</chinese-title>  
        <english-title>WIRING BOARD AND RESIN FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H05K1/03</main-classification>  
        <further-classification edition="200601120251204B">H05K1/09</further-classification>  
        <further-classification edition="200601120251204B">H05K1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＮＯＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小紫秀人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMURASAKI, HIDETO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大庭久恵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBA, HISAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種包括具有可撓性的絕緣基材以及形成於絕緣基材的導電層之配線基板，包括相互位於相反側的第一面及第二面，以及在平面視角下以曲線的波浪形狀沿第一軸延伸的複數條折曲線。複數條折曲線的各者沿著與第一軸相交的第二軸排列，第一面及第二面的各者包括複數條稜線及複數條谷線，複數條折曲線的各者對應於第一面中的複數條稜線的任一者及第二面中的複數條谷線的任一者，或者，對應於第一面中的複數條谷線的任一者及第二面中的複數條稜線的任一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wiring board, including a flexible insulating substrate and a conductive layer formed on the insulating substrate, includes a first surface and a second surface located on opposite sides of each other, and a plurality of fold lines extending along a first axis in a wavy curved shape when viewed from a planar perspective. Each of the plurality of fold lines is arranged along a second axis intersecting the first axis, each of the first surface and the second surface includes a plurality of ridge lines and a plurality of valley lines. Each of the plurality of fold lines corresponds to any one of the plurality of ridge lines on the first surface and any one of the plurality of valley lines on the second surface, or corresponds to any one of the plurality of valley lines on the first surface and any one of the plurality of ridge lines on the second surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:折曲構造</p>  
        <p type="p">Qa1:第一頂部</p>  
        <p type="p">Qa2:第二頂部</p>  
        <p type="p">Qb1:第一底部</p>  
        <p type="p">Qb2:第二底部</p>  
        <p type="p">R1:第一區域</p>  
        <p type="p">R2:第二區域</p>  
        <p type="p">W1:第一折曲線</p>  
        <p type="p">W2:第二折曲線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1552" publication-number="202612387"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612387.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612387</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127584</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配線基板</chinese-title>  
        <english-title>WIRING BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H05B3/20</main-classification>  
        <further-classification edition="201901120251204B">B32B7/027</further-classification>  
        <further-classification edition="201901120251204B">B32B7/025</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＮＯＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小紫秀人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMURASAKI, HIDETO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大庭久恵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBA, HISAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種配線基板，包括具有可撓性的絕緣基材以及形成於該絕緣基材的導電層，其中，在剖面視角下，導電層呈波浪形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wiring board includes a flexible insulating substrate and a conductive layer formed on the insulating substrate, wherein the conductive layer has a wave shape in a cross-sectional view.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:折曲構造</p>  
        <p type="p">Qa1:第一頂部</p>  
        <p type="p">Qa2:第二頂部</p>  
        <p type="p">Qb1:第一底部</p>  
        <p type="p">Qb2:第二底部</p>  
        <p type="p">W1:第一折曲線</p>  
        <p type="p">W2:第二折曲線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1553" publication-number="202610791"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610791.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610791</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>過載適應性機器人系統</chinese-title>  
        <english-title>OVERLOAD ADAPTIVE ROBOTIC SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B25J9/16</main-classification>  
        <further-classification edition="200601120251201B">B25J9/22</further-classification>  
        <further-classification edition="200601120251201B">B25J9/10</further-classification>  
        <further-classification edition="200601120251201B">B25J13/08</further-classification>  
        <further-classification edition="200601120251201B">B25J19/02</further-classification>  
        <further-classification edition="200601120251201B">G05B19/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商靈巧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXTERITY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　周文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, ZHOUWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭詠翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種過載適應性機器人系統。在各項實施例中，該系統包含：一機器人手臂，其包括一或多個連桿、一或多個關節及定位於該機器人手臂之一遠端自由移動端處之一末端執行器；及一處理器，其經組態以：制訂並開始實施用以抓握一物品、將該物品移動通過一經規劃軌跡且將該物品放置於一目的地處之一規劃；偵測影響包含於該一或多個關節中之一關節之一過載狀況；及回應於偵測到該過載狀況而調適該規劃。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An overload adaptive robotic system is disclosed. In various embodiments, the system includes a robotic arm comprising one or more links, one or more joints, and an end effector positioned at a distal free moving end of the robotic arm; and a processor configured to: make and begin to implement a plan to grasp an item, move the item through a planned trajectory, and place the item at a destination; detect an overload condition affecting a joint include in the one or more joints; and adapt the plan in response to detecting the overload condition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:機器人系統</p>  
        <p type="p">602:肩關節</p>  
        <p type="p">604:上臂連桿</p>  
        <p type="p">606:肘關節</p>  
        <p type="p">608:前臂連桿</p>  
        <p type="p">610:腕關節</p>  
        <p type="p">612:吸取式末端執行器</p>  
        <p type="p">614:物品</p>  
        <p type="p">620:相機</p>  
        <p type="p">622:控制電腦</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1554" publication-number="202611125"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611125.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611125</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127618</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>RESIST COMPOSITION AND PATTERNING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/14</main-classification>  
        <further-classification edition="200601120251201B">C08F220/06</further-classification>  
        <further-classification edition="200601120251201B">C08F220/38</further-classification>  
        <further-classification edition="200601120251201B">C07C69/63</further-classification>  
        <further-classification edition="200601120251201B">C07D347/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/039</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊地駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草間理志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAMA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大山皓介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHYAMA, KOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，感度及極限解析度優良的非化學增幅阻劑組成物，以及使用該阻劑組成物之圖案形成方法。 &lt;br/&gt;該課題之解決手段為一種阻劑組成物，含有： &lt;br/&gt;超原子價碘化合物，為下式(1)～(4)中之任一者表示之至少1種， &lt;br/&gt;含羧基之聚合物，及 &lt;br/&gt;溶劑； &lt;br/&gt;該含羧基之聚合物含有下式(5)表示之重複單元與選自下式(6)表示之重複單元、下式(7)表示之重複單元、下式(8)表示之重複單元、下式(9)表示之重複單元及下式(10)表示之重複單元中之至少1種。 &lt;br/&gt;&lt;img align="absmiddle" height="338px" width="595px" file="ed10321.JPG" alt="ed10321.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="420px" width="594px" file="ed10322.JPG" alt="ed10322.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resist composition comprising a hypervalent iodine compound, a carboxy-containing polymer, and a solvent is provided. When processed by EB or EUV lithography, the resist composition exhibits a high sensitivity and resolution.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1555" publication-number="202610648"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610648.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610648</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎的胺基羰基化製程</chinese-title>  
        <english-title>NOVEL AMINOCARBONYLATION PROCESSES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">A61K31/55</main-classification>  
        <further-classification edition="200601120251208B">A61K31/506</further-classification>  
        <further-classification edition="200601120251208B">A61K31/4184</further-classification>  
        <further-classification edition="200601120251208B">A61K31/403</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商賽諾菲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANOFI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴特　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARTHES, MATTHIEU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拜倫　克里斯托福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAYLON, CHRISTOPHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾特蘭　拉斐爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELTRAN, RAPHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞澤拉克　傑羅姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CEZERAC, JEROME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜泰爾　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUTHEIL, STEPHANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博魯霍娃　斯維特蘭娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BORUKHOVA, SVETLANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬戈索　毛里里奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAGOSSO, MAURILIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃倫巴斯　史提芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELENBAAS, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供將式(I)化合物轉化為式(II)化合物的方法： &lt;br/&gt;&lt;img align="absmiddle" height="169px" width="418px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Herein are provided processes of converting the compound of Formula (I) to the compound of Formula (II): &lt;br/&gt;&lt;img align="absmiddle" height="161px" width="438px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1556" publication-number="202611218"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611218.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611218</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>擦子、擦子製造用組成物、以及擦子之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08L27/06</main-classification>  
        <further-classification edition="200601120251201B">C08K3/26</further-classification>  
        <further-classification edition="200601120251201B">C08K3/36</further-classification>  
        <further-classification edition="200601120251201B">C08K5/11</further-classification>  
        <further-classification edition="200601120251201B">C08K7/26</further-classification>  
        <further-classification edition="200601120251201B">B43L19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國譽股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野之紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, YUKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水貴弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木尚香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, NAOKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種耐折性及消字性優良之擦子、用於製造其之組成物、以及前述擦子之製造方法。本發明係提供一種擦子，其係含有藉由懸浮聚合法或本體聚合法所製造之氯乙烯樹脂、塑化劑、及多孔質填充劑。本發明係進一步提供一種擦子製造用組成物，其係含有前述氯乙烯樹脂、塑化劑、及多孔質填充劑。本發明係進一步提供一種擦子之製造方法，其係包含以下步驟：在加熱條件下將前述擦子製造用組成物進行成形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1557" publication-number="202611963"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611963.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611963</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127676</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚焦環的控溫方法、下電極組件及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01J37/04</main-classification>  
        <further-classification edition="200601120251001B">H01J37/21</further-classification>  
        <further-classification edition="200601120251001B">H05H1/34</further-classification>  
        <further-classification edition="200601120251001B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. LINGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周俊卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳紫陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種聚焦環的控溫方法、下電極組件及電漿處理裝置，所述下電極組件包括基座、絕緣環、聚焦環和設置在絕緣環內的控溫組件，所述控溫組件包括加熱器和導熱腔，加熱器設置在絕緣環內，導熱腔設置在絕緣環內加熱器的下方，其內設有可形變部件；當加熱器對聚焦環進行加熱時，可形變部件與絕緣環或基座之間存在間隙，以減少聚焦環的熱量損失，加快聚焦環升溫；當加熱器停止對聚焦環進行加熱時，可形變部件膨脹，與絕緣環和基座均接觸，絕緣環通過可形變部件傳遞熱量至基座，以加快聚焦環的熱量向基座傳導，從而加快聚焦環降溫。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">220:基座</p>  
        <p type="p">221:中央區域</p>  
        <p type="p">222:邊緣區域</p>  
        <p type="p">230:絕緣環</p>  
        <p type="p">231:凹槽</p>  
        <p type="p">240:聚焦環</p>  
        <p type="p">241:第三導熱膠</p>  
        <p type="p">270:控溫組件</p>  
        <p type="p">271:加熱器</p>  
        <p type="p">272:導熱腔</p>  
        <p type="p">2731:可形變部件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1558" publication-number="202612062"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612062.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612062</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控溫系統、半導體處理設備及溫度控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01L21/67</main-classification>  
        <further-classification edition="200601120251205B">F25B29/00</further-classification>  
        <further-classification edition="200601120251205B">F16K11/00</further-classification>  
        <further-classification edition="200601120251205B">G05D23/13</further-classification>  
        <further-classification edition="200601120251205B">F28F27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋靖鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李開元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了控溫系統、半導體處理設備及溫度控制方法，本發明提供的控溫系統通過第一~第五三通閥的組合設置，可以實現第一部件和第二部件的獨立控溫或者是快速的溫度切換，以在快速升降溫和精確控制之間取得平衡，提高了半導體器件的生產效率和成品率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:第一部件</p>  
        <p type="p">102:第二部件</p>  
        <p type="p">111:第一控溫源</p>  
        <p type="p">112:第二控溫源</p>  
        <p type="p">113:第三控溫源</p>  
        <p type="p">V1:第一三通閥</p>  
        <p type="p">V2:第二三通閥</p>  
        <p type="p">V3:第三三通閥</p>  
        <p type="p">V4:第四三通閥</p>  
        <p type="p">V5:第五三通閥</p>  
        <p type="p">V6:三通</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1559" publication-number="202611974"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611974.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611974</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127678</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250904B">H01J37/32</main-classification>  
        <further-classification edition="200601120250904B">H05H1/24</further-classification>  
        <further-classification edition="200601120250904B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹　志堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, GERALD ZHE YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　如彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, RUBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種電漿處理裝置，包括：一真空腔室和位於所述真空腔室內的基座；一介電窗，位於所述真空腔室的頂部，與所述基座相對設置；一線圈，至少部分地位於所述介電窗上方，包括至少兩個縱長形的激發段；射頻電源，施加射頻信號至所述線圈，使得所述兩個激發段的電流方向相同，旋轉驅動裝置，用於驅動所述線圈和/或所述基座轉動，使得所述線圈和所述基座在工藝過程中可相對旋轉。本發明設置的線圈結構可以提高電磁場分佈的均勻性以及射頻電源的利用效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:真空腔室</p>  
        <p type="p">105:介電窗</p>  
        <p type="p">110:基片</p>  
        <p type="p">115:基座</p>  
        <p type="p">120:線圈</p>  
        <p type="p">126:激發段</p>  
        <p type="p">130:高度連接段</p>  
        <p type="p">132:返回段</p>  
        <p type="p">141:馬達</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1560" publication-number="202611975"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611975.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611975</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127679</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿腔及向其施加射頻能量的裝置、基片處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01J37/32</main-classification>  
        <further-classification edition="200601120251103B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹　志堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, GERALD ZHE YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　如彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, RUBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種向電漿處理腔施加射頻能量的裝置，包括一個線圈，具有一個接收射頻功率的輸入端以及一個接地的輸出端；一個非接觸耦合器，具有連接到線圈輸入端的接收連接器和一個與射頻功率源耦合的傳輸連接器，所述接收連接器和所述傳輸連接器非接觸耦合以使得二者之間直流斷開，同時允許射頻功率傳輸，所述接收連接器相對於所述傳輸連接器可旋轉；一個接地耦合器，連接在線圈的輸出端和地電位之間。本發明可以確保線圈在旋轉過程中維持穩定的射頻能量輸入至電漿處理腔內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:真空腔室</p>  
        <p type="p">105:介電窗</p>  
        <p type="p">110:基片</p>  
        <p type="p">115:基座</p>  
        <p type="p">120:線圈</p>  
        <p type="p">126:激發段</p>  
        <p type="p">130:高度連接段</p>  
        <p type="p">132:返回段</p>  
        <p type="p">141:馬達</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1561" publication-number="202610777"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610777.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610777</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127689</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測定裝置、研磨系統及測定方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">B24B53/12</main-classification>  
        <further-classification edition="201401120251204B">G01N21/55</further-classification>  
        <further-classification edition="201201120251204B">B24B37/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河邊篤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABE, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種使修整板的尺寸之測定精度提升的技術。本發明之解決手段係一種測定裝置，測定用於研磨工具之修整之修整板的尺寸。測定裝置，包括：平台，固持修整板；反射體，載置在由前述平台所固持之前述修整板的上表面；光感測器，將光照射向前述反射體的上表面，並接收由前述反射體的上表面所反射之光；以及支持體，將前述反射體支持成自由升降。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:測定裝置</p>  
        <p type="p">21:平台</p>  
        <p type="p">22:反射體</p>  
        <p type="p">23:光感測器</p>  
        <p type="p">24:支持體</p>  
        <p type="p">25:升降機構</p>  
        <p type="p">26:移動機構</p>  
        <p type="p">27:夾持器</p>  
        <p type="p">221:軸部</p>  
        <p type="p">222:凸緣部</p>  
        <p type="p">241:插穿孔</p>  
        <p type="p">242:收納孔</p>  
        <p type="p">B:修整板</p>  
        <p type="p">B1:支持板</p>  
        <p type="p">B2:修整砥石</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1562" publication-number="202612394"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612394.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612394</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脈衝電源裝置</chinese-title>  
        <english-title>PULSED POWER SUPPLY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H05H1/46</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商京三製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYOSAN ELECTRIC MFG. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國玉史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNITAMA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安達俊幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADACHI, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之脈衝電源裝置，係藉由使固定電壓之直流電壓與折線波形電壓重疊的方式，生成具有複數個預定電壓梯度之任意波形的脈衝。折線波形電壓，係具有從接地電位起以複數個預定電壓變化率dV/dt而發生時間變化之複數個直線波形電壓所連結的折線波形電壓。脈衝電源裝置，係以變流器控制來生成該折線波形電壓，使直流電壓與折線波形電壓重疊而生成任意波形電壓，並從任意波形電壓生成脈衝波形，藉此，生成不使用電流源而具有任意之電壓梯度的脈衝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pulsed power supply device of the present invention superimposes a constant DC voltage on a piecewise linear waveform voltage so as to generate a pulse with an arbitrary waveform having multiple predetermined voltage gradients. The piecewise linear waveform voltage includes a polyline voltage waveform in which multiple linear waveform voltages that change over time at multiple predetermined voltage change rates dV/dt from ground potential are connected. The pulsed power supply device conducts inverter control to generate this piecewise linear waveform voltage, then superimposes a DC voltage on the piecewise linear waveform voltage to generate an arbitrary waveform voltage, and generates a pulse waveform from the arbitrary waveform voltage, thereby generating a pulse having an arbitrary voltage gradient without using a current source.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:脈衝電源裝置</p>  
        <p type="p">2:電漿腔室</p>  
        <p type="p">10:電源部</p>  
        <p type="p">11:第1直流電源</p>  
        <p type="p">12:任意波形電壓產生部</p>  
        <p type="p">13:開關部</p>  
        <p type="p">13a:脈衝開關部</p>  
        <p type="p">13b:放電電路</p>  
        <p type="p">15:控制部</p>  
        <p type="p">21:負載</p>  
        <p type="p">SWA:開關</p>  
        <p type="p">SWB:開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1563" publication-number="202611306"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611306.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611306</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127691</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>焊接合金、焊接膏、焊球、焊接預製體、焊接點、車載電子電路、ＥＣＵ電子電路、車載電子電路裝置及ＥＣＵ電子電路裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C22C13/02</main-classification>  
        <further-classification edition="200601120251211B">C22C12/00</further-classification>  
        <further-classification edition="200601120251211B">B23K35/14</further-classification>  
        <further-classification edition="200601120251211B">B32B15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商千住金屬工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENJU METAL INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横山貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOYAMA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川俊策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKAWA, SHUNSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯島裕貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIJIMA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為提供一種藉由液相線溫度不會過高，拉伸強度高，且熔融焊接的表面張力低，且老化後之拉伸強度亦高，而具有優異之信賴性的焊接合金、焊接膏、焊球、焊接預製體、焊接點、車載電子電路、ECU電子電路、車載電子電路裝置及ECU電子電路裝置。焊接合金係以質量%具有由Ag：3.0～4.0%、Cu：0.1～1.0%、Sb：3.1～6.0%、Bi：0.1～1.5%、In：0.2～6.0%、Ni：0.02～0.07%、Co：0.0010～0.0200%及殘餘為Sn所構成之合金組成。較佳之合金組成係進一步以質量%合計含有0.1%以下之Ge、Ga、As、Pd、Mn、Zn、Zr及Mg的至少1種。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1564" publication-number="202612439"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612439.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612439</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127695</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板保護裝置及半導體處理設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H05K9/00</main-classification>  
        <further-classification edition="200601120251001B">H05K1/02</further-classification>  
        <further-classification edition="200601120251001B">H03H7/01</further-classification>  
        <further-classification edition="200601120251001B">H05K5/04</further-classification>  
        <further-classification edition="200601120251001B">H05K5/02</further-classification>  
        <further-classification edition="200601120251001B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王紅軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周曉鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜琨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種電路板保護裝置及半導體處理設備，電路板設置於一反應腔的外部，反應腔中可施加射頻訊號；所述電路板保護裝置包括：金屬箱體，位於所述反應腔的外部，用於容置所述電路板；低通濾波器，其設置於所述金屬箱體上，其輸入端與所述反應腔內的受控部件電連接，其輸出端與所述電路板電連接；所述低通濾波器用於抑制所述射頻訊號對所述電路板產生的傳導干擾。本發明可以有效降低電路板的故障率和返修率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:反應腔</p>  
        <p type="p">110:電路板</p>  
        <p type="p">120:受控部件</p>  
        <p type="p">130:基座</p>  
        <p type="p">140:噴淋頭</p>  
        <p type="p">210:金屬箱體</p>  
        <p type="p">220:低通濾波器</p>  
        <p type="p">221:穿心電容</p>  
        <p type="p">222:第一訊號線</p>  
        <p type="p">223:片狀三端子電容器</p>  
        <p type="p">224:第二訊號線</p>  
        <p type="p">230:電源</p>  
        <p type="p">231:電纜</p>  
        <p type="p">240:直流濾波器</p>  
        <p type="p">300:電氣箱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1565" publication-number="202612096"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612096.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612096</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127696</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓吸盤結構及電漿蝕刻設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01L21/683</main-classification>  
        <further-classification edition="200601120250902B">H02N13/00</further-classification>  
        <further-classification edition="200601120250902B">H01J37/32</further-classification>  
        <further-classification edition="200601120250902B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　如彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, RUBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種晶圓吸盤結構及電漿蝕刻設備。晶圓吸盤結構的上表面用於承載晶圓，其內設有用於向晶圓下方輸送冷卻氣體的氣體通道，其中，沿冷卻氣體的輸送方向上，氣體通道包括相連通的第一區段和第二區段，第二區段形成於晶圓吸盤結構的上表面，第一區段的孔徑大於第二區段的孔徑，第一區段內設有具有多孔結構的第一多孔塞，冷卻氣體能夠流經第一多孔塞進入第二區段，第一多孔塞的頂部設有過渡層，過渡層介於第一多孔塞與第一區段頂部壁面之間，以避免第一多孔塞與第一區段的頂部壁面之間摩擦形成顆粒物污染第二區段的氣體通道。本發明用於防止多孔塞表面摩擦形成的顆粒物進入工藝腔體內部污染晶圓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:晶圓</p>  
        <p type="p">110:底座</p>  
        <p type="p">120:黏合層</p>  
        <p type="p">130:介電板</p>  
        <p type="p">112:通道</p>  
        <p type="p">140:氣體通道</p>  
        <p type="p">141:第一區段</p>  
        <p type="p">142:第二區段</p>  
        <p type="p">150:第一多孔塞</p>  
        <p type="p">160:過渡層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1566" publication-number="202610686"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610686.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610686</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127719</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療肥胖及代謝病症的化合物</chinese-title>  
        <english-title>COMPOUNDS FOR USE IN THE TREATMENT OF OBESITY AND METABOLIC DISORDERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">A61K47/42</main-classification>  
        <further-classification edition="200601120251201B">A61P3/00</further-classification>  
        <further-classification edition="200601120251201B">A61P3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商維京治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIKING THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麗安　布瑞恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAN, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供使用化合物1或其醫藥上可接受之鹽治療肥胖及代謝病症之方法。 &lt;br/&gt;&lt;img align="absmiddle" height="300px" width="525px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are methods of treating obesity and metabolic disorders using Compound 1 or pharmaceutically acceptable salts thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1567" publication-number="202610615"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610615.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610615</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127780</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含富含甜菜鹼的酵母發酵提取物的組合物、使用其之方法及其用途</chinese-title>  
        <english-title>COMPOSITION COMPRISING BETAINE ENRICHED YEAST FERMENT EXTRACT, METHOD OF USING THE SAME AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">A61K8/9789</main-classification>  
        <further-classification edition="201701120251201B">A61K8/9728</further-classification>  
        <further-classification edition="200601120251201B">A61Q19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＥＬＣ管理有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELC MANAGEMENT LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚繼宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, JIZONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周奐君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, HUANJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張豔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瞿玉蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QU, YULAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及包含富含甜菜鹼的酵母發酵提取物和生理上可接受的介質的化妝品和/或皮膚病學組合物。本發明還涉及使用所述組合物的非治療方法和所述組合物用於護理角蛋白材料的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a cosmetic and/or dermatologic composition comprising a betaine enriched yeast ferment extract and a physiologically acceptable medium. The present disclosure also relates to a non-therapeutic method using said composition and use of said composition for caring for keratin material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1568" publication-number="202611895"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611895.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611895</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127790</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於掃描背光控制的LED驅動IC</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251208B">G09G3/32</main-classification>  
        <further-classification edition="200601120251208B">G02F1/133</further-classification>  
        <further-classification edition="200601120251208B">G09G5/18</further-classification>  
        <further-classification edition="202001120251208B">H05B45/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商六科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROKU, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林逸凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂　太全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, TAIQUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱鐘毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　紹中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, STEVE SHAW-JONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文公開了用於在具有驅動IC的媒體設備中控制背光裝置的系統、裝置、製品、方法和/或計算機程序產品實施例，和/或其組合及子組合。在一些實施例中，媒體設備可包括顯示螢幕和背光裝置。在一些實施例中，背光裝置可包括在第一水平區中的第一LED和第二LED以及在第二水平區中的第三LED和第四LED。背光裝置可包括第一驅動IC，該第一驅動IC連接到第一LED和第三LED，並被配置為在第一時間段期間開啟第一LED並在第二時間段期間開啟第三LED。背光裝置可包括第二驅動IC，該第二驅動IC連接到第二LED和第四LED，並被配置為在第一時間段期間開啟第二LED並在第二時間段期間開啟第四LED。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:多媒體環境</p>  
        <p type="p">104:媒體系統</p>  
        <p type="p">106:媒體設備</p>  
        <p type="p">108:顯示設備</p>  
        <p type="p">110:遠程控制</p>  
        <p type="p">112:麥克風</p>  
        <p type="p">114:通訊設備</p>  
        <p type="p">116:鏈路</p>  
        <p type="p">118:網路</p>  
        <p type="p">120:內容服務器</p>  
        <p type="p">122:內容</p>  
        <p type="p">124:元數據</p>  
        <p type="p">126:系統服務器</p>  
        <p type="p">128:眾包服務器</p>  
        <p type="p">130:音訊命令處理模組</p>  
        <p type="p">132:用戶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1569" publication-number="202611687"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611687.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611687</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127844</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測定作業支援方法及測定作業支援系統</chinese-title>  
        <english-title>MEASUREMENT WORK ASSISTANCE METHOD AND MEASUREMENT WORK ASSISTANCE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">G06F3/0481</main-classification>  
        <further-classification edition="200601120251201B">G06F3/01</further-classification>  
        <further-classification edition="201101120251201B">G06T19/00</further-classification>  
        <further-classification edition="202501120251201B">G06F11/36</further-classification>  
        <further-classification edition="200601120251201B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏宏修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, HUNGHSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水進二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種即使為狹窄空間亦可放入虛擬測定工具而執行測定作業之測定作業支援方法及測定作業支援系統。 &lt;br/&gt;與用於對測定對象之尺寸等進行測定之虛擬測定工具91一起，於與該虛擬測定工具91隔開規定間隔之位置製作操作用虛擬工具95並加以顯示。藉由作業者對操作用虛擬工具95進行伸縮、旋轉或移動之操作，虛擬測定工具91亦與該操作用虛擬工具95之動作同步伸縮、旋轉或移動。佩戴有智慧型眼鏡10之作業者並非以手直接持握虛擬測定工具91進行操作，而是以手對操作用虛擬工具95進行操作，與其連動地操縱虛擬測定工具91而使其移動至測定對象。即使為手無法伸入之狹窄空間，亦可放入虛擬測定工具91而執行測定作業。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">55:杯</p>  
        <p type="p">57:旋轉卡盤</p>  
        <p type="p">60:處理液噴嘴</p>  
        <p type="p">91:虛擬測定工具</p>  
        <p type="p">95:操作用虛擬工具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1570" publication-number="202610835"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610835.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610835</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127881</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學薄膜及顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B27/18</main-classification>  
        <further-classification edition="201501120251201B">G02B1/10</further-classification>  
        <further-classification edition="200601120251201B">G09F9/30</further-classification>  
        <further-classification edition="200601120251201B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金田怜士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANATA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種光學薄膜，其具備基材、和包含功能性粒子與樹脂的功能層，其中該功能性粒子係抗菌劑及抗病毒劑的至少一者。於功能層中與基材相接的面係功能層的背面，且相對於該背面而位於與基材相反側之光學薄膜的最外表面係光學薄膜的表面。功能性粒子的平均粒徑係光學薄膜的表面和功能層的背面間之平均膜厚的0.8倍以下。光學薄膜係被配置於顯示裝置中之顯示影像的顯示面上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1571" publication-number="202611419"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611419.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611419</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>殼體及具備其的流量控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">F16K3/12</main-classification>  
        <further-classification edition="200601120251203B">G05D7/06</further-classification>  
        <further-classification edition="200601120251203B">F16K31/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士金股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKIN INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日高敦志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIDAKA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤大輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>綾井裕太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYAI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中谷貴紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATANI, TAKATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種殼體及具備其的流量控制裝置，殼體具備密閉構造，且在維護時，能減輕拆卸構成殼體的面板之作業。 &lt;br/&gt;　　[解決手段]具備：主框架(2)，具備下框(2a)、被立起設置在下框(2a)的縱框(2b)、以及被懸臂支承在縱框(2b)且與下框(2a)平行地延伸的上框(2c)，並具有通道形狀，其中，下框(2a)及上框(2c)具備腹板(2d)及一對凸緣(2e、2f)；罩面板(3)，可裝卸地被安裝至主框架(2)，且具備相對向的一對側面板(3a、3b)及繫接一對側面板(3a、3b)的後面板(3c)，一對側面板(3a、3b)係抵接於一對凸緣(2c、2f)的內側面而為可滑動；以及固定部(4)，將已安裝至主框架(2)的罩面板(3)固定在主框架(2)；其中，被構成為：罩面板(3)藉由固定部(4)被固定至主框架(2)時，一對側面板(3a、3b)係壓接至縱框(2b)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">2:主框架</p>  
        <p type="p">2a:下框</p>  
        <p type="p">2a1:下部凸緣</p>  
        <p type="p">2a2:第一內螺紋孔</p>  
        <p type="p">2b:縱框</p>  
        <p type="p">2c:上框</p>  
        <p type="p">2c1:上部凸緣</p>  
        <p type="p">2c2:第二內螺紋孔</p>  
        <p type="p">2d:腹板</p>  
        <p type="p">2e,2f:凸緣</p>  
        <p type="p">3:罩面板</p>  
        <p type="p">3a,3b:側面板</p>  
        <p type="p">3a2,3a3,3a4:緣部</p>  
        <p type="p">3c:後面板</p>  
        <p type="p">4:固定部</p>  
        <p type="p">4a:通孔</p>  
        <p type="p">4b:固定螺絲</p>  
        <p type="p">5:傾斜板</p>  
        <p type="p">7:折返板</p>  
        <p type="p">X,Y:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1572" publication-number="202610926"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610926.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610926</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127890</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手動鏈式吊車</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">B66D1/28</main-classification>  
        <further-classification edition="200601120251212B">B66D3/12</further-classification>  
        <further-classification edition="200601120251212B">B66D3/26</further-classification>  
        <further-classification edition="200601120251212B">B66D5/02</further-classification>  
        <further-classification edition="200601120251212B">B66D5/14</further-classification>  
        <further-classification edition="200601120251212B">B66C1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商開道股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城田明典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIROTA, AKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河西貴幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASAI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種能夠可靠地傳遞解除嚙入所需之轉矩，並且成本低且小型化之手動鏈式葫蘆；手動鏈式吊車10係包括：驅動軸8，係形成有公螺紋8a；驅動部件14，係呈筒狀，且具有母螺紋14a，並且具有插裝在操縱輪7中心部之小徑部14b以及大徑部14c；施力部件16，在由摩擦板F1、F2夾持了操縱輪7之狀態下，此施力部件16對驅動部件14施力；壓板15，係將作用力向摩擦板F2傳遞；制動機構20，係透過公螺紋8a與母螺紋14a的螺合而產生之緊固力被按壓，並且係具有：深度沿著大徑部14c的外周面漸增之凹部以及滾動部件；在向捲繞方向旋轉時，向較深側滾動而允許操縱輪7之相對旋轉，而在向解繞方向旋轉時，滾動部件向較淺側滾動而被咬入，從而制止操縱輪7之相對旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鏈式吊車主體</p>  
        <p type="p">6a:金屬環</p>  
        <p type="p">7:操縱輪</p>  
        <p type="p">7a:內周部</p>  
        <p type="p">7b:縮徑部</p>  
        <p type="p">8:驅動軸</p>  
        <p type="p">8a:公螺紋</p>  
        <p type="p">8b:螺紋部</p>  
        <p type="p">8c:階梯部</p>  
        <p type="p">8d:凸緣部</p>  
        <p type="p">8e:螺栓部</p>  
        <p type="p">8f:螺合部</p>  
        <p type="p">14:驅動部件</p>  
        <p type="p">14a:母螺紋</p>  
        <p type="p">14b:小徑部</p>  
        <p type="p">14c:大徑部</p>  
        <p type="p">14g:空間</p>  
        <p type="p">14h:公螺紋</p>  
        <p type="p">15:壓板</p>  
        <p type="p">16:碟形彈簧(施力部件)</p>  
        <p type="p">17:彈簧緊固螺母</p>  
        <p type="p">18:開槽螺母</p>  
        <p type="p">20:制動機構</p>  
        <p type="p">21:襯套</p>  
        <p type="p">22:棘輪</p>  
        <p type="p">23:爪部</p>  
        <p type="p">71:鏈槽</p>  
        <p type="p">B:制動板</p>  
        <p type="p">F1:摩擦板</p>  
        <p type="p">F2:摩擦板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1573" publication-number="202611143"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611143.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611143</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">C08F279/06</main-classification>  
        <further-classification edition="200601120251203B">G03F7/028</further-classification>  
        <further-classification edition="200601120251203B">C08L33/26</further-classification>  
        <further-classification edition="200601120251203B">C08F2/50</further-classification>  
        <further-classification edition="200601120251203B">B32B27/08</further-classification>  
        <further-classification edition="200601120251203B">H01L21/312</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古谷創</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUTANI, HAJIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種感光性樹脂積層體，其係具備支撐膜、及含有感光性樹脂組成物之感光性樹脂層之用以形成金屬柱及半導體凸塊之光阻圖案形成用感光性樹脂積層體；並且前述感光性樹脂組成物，相對於前述感光性樹脂組成物之固體成分總量，係含有：（A）鹼可溶性高分子30質量%～70質量%；（B）具有乙烯性不飽和鍵之化合物20質量%～50質量%；及（C）光聚合起始劑0.01質量%～20質量%；前述（B）成分，係含有：（B-1）於一分子中具有環式基團、環氧乙烷鏈、及2個丙烯醯基之化合物；以及（B-2）具有3個以上丙烯醯基之化合物；且前述感光性樹脂層之厚度為80 μm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1574" publication-number="202610634"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610634.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610634</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127903</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療癌症之組合療法</chinese-title>  
        <english-title>COMBINATION THERAPY FOR TREATING CANCERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/501</main-classification>  
        <further-classification edition="200601120251201B">A61K31/4965</further-classification>  
        <further-classification edition="200601120251201B">A61K31/44</further-classification>  
        <further-classification edition="200601120251201B">A61K31/427</further-classification>  
        <further-classification edition="200601120251201B">A61K31/403</further-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金犁天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, LITIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鹿語</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裘虹霞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, HONGXIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈　宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻志鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, ZHIPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鉅皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚向瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, XIANGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張衛星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, WEIXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及治療有需要之個體的癌症之方法，該方法包含向該個體投予治療有效量之 RAS 抑制劑與其他治療劑之組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to methods of treating cancer in a subject in need thereof, comprising administering to the subject a therapeutically effective amount of a combination of a RAS inhibitor and other therapeutic agents.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1575" publication-number="202610690"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610690.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610690</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127905</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靶向ＣＤＨ３之抗體－藥物結合物及其製備方法及用途</chinese-title>  
        <english-title>ANTIBODY-DRUG CONJUGATES TARGETING CDH3 AND PREPARATION METHODS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">A61K47/68</main-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">A61K31/438</further-classification>  
        <further-classification edition="200601120251201B">A61K31/437</further-classification>  
        <further-classification edition="200601120251201B">A61K31/436</further-classification>  
        <further-classification edition="200601120251201B">A61K31/407</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商四川科倫博泰生物醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SICHUAN KELUN-BIOTECH BIOPHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁曉曦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, XIAOXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉瀟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋宏梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, HONGMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚淼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚　向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, XIANGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛均友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, JUNYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示係關於一種用於治療CDH3陽性癌症之抗體-藥物結合物(ADC)。該等ADC具有CDH3抗體及結合至該抗體之藥物-連接子分子。本揭示之ADC具有更好之藥物-抗體結合比率且對CDH3陽性癌症具有良好之靶向殺傷作用。亦提供該抗體-藥物結合物之製備方法及其在治療該CDH3陽性癌症中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to an antibody-drug conjugate (ADC) for treating CDH3-positive cancer. The ADCs have a CDH3 antibody and a drug-linker molecule conjugated to the antibody. The ADC of the present disclosure has a better drug-antibody conjugation ratio and a good, targeted killing effect on CDH3-positive cancer. Also provided is a preparation method of the antibody-drug conjugate and use thereof in the treatment of the CDH3-positive cancer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1576" publication-number="202611432"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611432.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611432</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127909</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液態氫儲槽、液態氫儲槽之製造方法、及液態氫儲槽之設計方法</chinese-title>  
        <english-title>LIQUID HYDROGEN TANK, METHOD FOR PRODUCING LIQUID HYDROGEN TANK, AND METHOD FOR DESIGNING LIQUID HYDROGEN TANK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">F17C1/00</main-classification>  
        <further-classification edition="200601120251211B">C22C38/00</further-classification>  
        <further-classification edition="200601120251211B">C21D8/02</further-classification>  
        <further-classification edition="200601120251211B">C21D1/18</further-classification>  
        <further-classification edition="200601120251211B">F17C5/04</further-classification>  
        <further-classification edition="200601120251211B">G01N3/30</further-classification>  
        <further-classification edition="200601120251211B">G01N3/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本製鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大川鐵平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAWA, TEPPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滑川哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMEGAWA, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高峰史壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMINE, FUMITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豬狩玄樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGARI, HARUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液態氫儲槽，具有以吸收能量sE滿足下述式1或下述式2之鋼材構成之供接觸液態氫之槽，前述吸收能量sE係藉由使用三面狹縫沙丕衝擊試驗片並在-196℃以下之測定溫度下之衝擊試驗測得者。&lt;br/&gt; sE≧19+0.68×ΔT　　・・・　式1；&lt;br/&gt; 式1中，前述測定溫度係在高於-253℃且在-196℃以下之範圍內，ΔT係前述測定溫度與-253℃之溫度差。&lt;br/&gt; sE≧19　・・・　式2；&lt;br/&gt; 式2中，測定溫度為-253℃以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:液態氫儲槽</p>  
        <p type="p">102:內槽</p>  
        <p type="p">104:外槽；外層</p>  
        <p type="p">110:鋼板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1577" publication-number="202612264"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612264.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612264</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>體聲波結構及其製造方法</chinese-title>  
        <english-title>BULK ACOUSTIC WAVE STRUCTURES AND FABRICATION METHODS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H03H3/08</main-classification>  
        <further-classification edition="200601120251204B">H03H9/15</further-classification>  
        <further-classification edition="200601120251204B">H01L21/768</further-classification>  
        <further-classification edition="200601120251204B">H01L23/488</further-classification>  
        <further-classification edition="202501120251204B">H10D88/00</further-classification>  
        <further-classification edition="202501120251204B">H10D62/10</further-classification>  
        <further-classification edition="202501120251204B">H10D62/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科沃美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QORVO US, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史托克斯　保羅麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STOKES, PAUL MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆達雷斯扎達　穆罕默德賈法爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MODARRES-ZADEH, MOHAMMAD JAFAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩杜　喬提斯瓦魯普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SADHU, JYOTHI SWAROOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種體聲波（BAW）裝置。該BAW裝置包括一聲學諧振器。該聲學諧振器包括一壓電層、安置於該壓電層之一第一表面上的一第一電極，及安置於該壓電層之一第二表面上的一第二電極。該聲學諧振器亦包括與該第一電極導電耦合之一第一導熱結構。該聲學諧振器亦包括與該第二電極導電耦合之一第二導熱結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bulk acoustic wave (BAW) device is provided. The BAW device includes an acoustic resonator. The acoustic resonator includes a piezoelectric layer, a first electrode disposed on a first surface of the piezoelectric layer, and a second electrode disposed on a second surface of the piezoelectric layer. The acoustic resonator also includes a first thermally conductive structure conductively coupled with the first electrode. The acoustic resonator also includes a second thermally conductive structure conductively coupled with the second electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1578" publication-number="202612226"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612226.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612226</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127956</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於可旋轉機械加工平台的低輪廓轉子</chinese-title>  
        <english-title>LOW PROFILE ROTOR FOR ROTATABLE MACHINING PLATFORMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251105B">H02K15/02</main-classification>  
        <further-classification edition="200601120251105B">H02K1/06</further-classification>  
        <further-classification edition="200601120251105B">H02K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商斯凱孚加拿大有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKF CANADA LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔梅恩　戴倫　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TREMAINE, DAREN PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邁斯納　麥克尼爾　伊凡　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEISNER MCNEIL, EVAN CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加富爾　歐斯馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHAFOOR, OSAMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈里斯　蒂莫西　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARRIS, TIMOTHY ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容描述一種用於使一平台圍繞一中心軸線成角度地移位之轉子組合件，該轉子組合件包括一定子組合件，該定子組合件具有一中心孔且包括圍繞該中心軸線沿圓周隔開之複數個電磁線圈組合件。一環形轉子可與該平台連接且安置於該定子組合件之該中心孔內以便以該中心軸線為中心。該轉子包括一圓柱形側壁，該圓柱形側壁具有一內圓周表面、一外圓周表面、沿著該中心軸線間隔開之上部軸向端及下部軸向端，以及複數個貫通開口，該複數個貫通開口在該內圓周表面與該外圓周表面之間徑向地延伸且圍繞該中心軸線沿圓周隔開。因而，複數個齒中之一單獨齒界定於各對鄰近開口之間，且一下部環形輪緣部分軸向地界定於該複數個貫通開口與該側壁之該下端之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A rotor assembly for angularly displacing a platform about a central axis includes a stator assembly having a central bore and including a plurality of electromagnetic coil assemblies spaced circumferentially about the central axis. An annular rotor is connectable with the platform and is disposed within the central bore of the stator assembly so as to be centered about the central axis. The rotor includes a cylindrical sidewall having an inner circumferential surface, an outer circumferential surface, upper and lower axial ends spaced apart along the central axis and a plurality of through openings extending radially between the inner and outer circumferential surfaces and spaced circumferentially about the central axis. As such, a separate one of a plurality of teeth are defined between each pair of adjacent openings and a lower annular rim portion is defined axially between the plurality of through openings and the lower end of the sidewall.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:平台</p>  
        <p type="p">2:軸向延伸耦接器</p>  
        <p type="p">10:轉子組合件</p>  
        <p type="p">12:定子組合件</p>  
        <p type="p">14:電磁線圈組合件</p>  
        <p type="p">16:環形轉子</p>  
        <p type="p">18:外殼</p>  
        <p type="p">19:中心孔</p>  
        <p type="p">20:圓柱形側壁/圓柱形壁</p>  
        <p type="p">22:貫通開口</p>  
        <p type="p">24:齒</p>  
        <p type="p">25:圓柱形實心部分/側壁實心部分</p>  
        <p type="p">30:徑向凸緣</p>  
        <p type="p">44:徑向致動器</p>  
        <p type="p">46:懸浮致動器</p>  
        <p type="p">A&lt;sub&gt;C&lt;/sub&gt;:中心垂直軸線/中心軸線</p>  
        <p type="p">E:製造設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1579" publication-number="202610630"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610630.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610630</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127969</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阿卡拉布替尼馬來酸鹽劑型</chinese-title>  
        <english-title>ACALABRUTINIB MALEATE DOSAGE FORMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">A61K31/4985</main-classification>  
        <further-classification edition="200601120251208B">A61K9/20</further-classification>  
        <further-classification edition="200601120251208B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商艾森塔製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACERTA PHARMA B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝索　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BETHEL, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比理司　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLYTH, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科思古羅夫　史提夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COSGROVE, STEVE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高登　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOLDEN, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼恩　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANN, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派品　夏維爾　傑科斯　亨利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEPIN, XAVIER JACQUES HENRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅彬斯　安得魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBBINS, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛普森　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMPSON, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露總體上關於：(a) 包含阿卡拉布替尼馬來酸鹽的固體藥物劑型；(b) 使用這樣的藥物劑型治療B細胞惡性腫瘤和/或其他病症之方法；(c) 包含這樣的藥物劑型和視需要的含有另一種治療劑的第二藥物劑型的套組；(d) 用於製備這樣的藥物劑型之方法；以及 (e) 藉由這樣之方法製備的藥物劑型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates, in general, to: (a) solid pharmaceutical dosage forms comprising acalabrutinib maleate; (b) methods of using such pharmaceutical dosage forms to treat B-cell malignancies and/or other conditions; (c) kits comprising such pharmaceutical dosage forms and, optionally, a second pharmaceutical dosage form comprising another therapeutic agent; (d) methods for the preparation of such pharmaceutical dosage forms; and (e) pharmaceutical dosage forms prepared by such methods.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1580" publication-number="202611907"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611907.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611907</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127989</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>束編碼編解碼器</chinese-title>  
        <english-title>BUNDLE ENCODING CODEC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251201B">G10L25/30</main-classification>  
        <further-classification edition="201301120251201B">G10L19/00</further-classification>  
        <further-classification edition="202301120251201B">G06N3/044</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索堤爾　古拉麥　康瑞德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAUTIERE, GUILLAUME KONRAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯科迪利斯　齊西斯　伊阿森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKORDILIS, ZISIS IASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉金德蘭　維韋克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAJENDRAN, VIVEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置包括經組態以儲存視訊資料的一記憶體。該裝置亦包括一或多個處理器，該一或多個處理器經組態以獲得N個特徵陣列，各特徵陣列表示該音訊資料的一訊框（其中N係對應於一束訊框計數的一整數）。該一或多個處理器經組態以對該N個特徵陣列執行時間交錯操作，以產生表示該N個特徵陣列的一束內上下文陣列。該一或多個處理器經組態以編碼該束內上下文陣列，以產生一束編碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device includes a memory configured to store audio data. The device also includes one or more processors configured to obtain N feature arrays, each feature array representing a frame of the audio data (where N is an integer corresponding to a bundle frame count). The one or more processors are configured to perform temporal intermingling operations on the N feature arrays to generate an intra-bundle context array representing the N feature arrays. The one or more processors are configured to encode the intra-bundle context array to generate a bundle encoding.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:裝置</p>  
        <p type="p">114:麥克風</p>  
        <p type="p">118:音訊訊框</p>  
        <p type="p">120:編解碼器</p>  
        <p type="p">122:預處理器</p>  
        <p type="p">124:特徵提取器</p>  
        <p type="p">126:束編碼器</p>  
        <p type="p">128:束解碼器</p>  
        <p type="p">130:神經合成器</p>  
        <p type="p">132:後處理器</p>  
        <p type="p">140:記憶體</p>  
        <p type="p">142:束訊框計數</p>  
        <p type="p">146:音訊資料</p>  
        <p type="p">150:回饋連接；編碼資料</p>  
        <p type="p">170:數據機</p>  
        <p type="p">172:無線電前端(RFE)</p>  
        <p type="p">174:天線</p>  
        <p type="p">176:通道</p>  
        <p type="p">178:傳輸</p>  
        <p type="p">182:裝置</p>  
        <p type="p">190:處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1581" publication-number="202612227"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612227.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612227</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127993</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於形成電動機之方法</chinese-title>  
        <english-title>METHOD FOR FORMING A DYNAMOELECTRIC MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">H02K15/0273</main-classification>  
        <further-classification edition="202501120251201B">H02K15/0275</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內克斯鮑爾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEXTPOWER360 CO.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雅可维利　貝內德托　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IACOVELLI, BENEDETTO ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於形成一電動機之方法，其包括：提供一夾具；在該夾具上配置一內部軛及一外部軛；在該內部軛與該外部軛之間提供同心配置的轉子層；用將界定定子層之一粉末填充該等同心配置的轉子層中之鄰近者之間的空間；將該粉末壓製於該等同心配置的轉子層中之該等鄰近者之間的該等空間內；及對經壓製粉末進行加熱、燒結及/或固化以在該等同心配置的轉子層中之該等鄰近者之間形成該等定子層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for forming a dynamoelectric machine including providing a jig, arranging an inner yoke and an outer yoke on the jig, providing concentrically arranged rotor layers between the inner yoke and the outer yoke, filling spaces between adjacent ones of the concentrically arranged rotor layers with a powder which will define stator layers, pressing the powder within the spaces between the adjacent ones of the concentrically arranged rotor layers, and heating, sintering, and/or curing the pressed powder to form the stator layers between the adjacent ones of the concentrically arranged rotor layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:內部軛</p>  
        <p type="p">32:外部軛</p>  
        <p type="p">40:轉子層</p>  
        <p type="p">50:定子層</p>  
        <p type="p">70:總成</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1582" publication-number="202611653"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611653.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611653</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128008</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>異常檢測方法、半導體檢測設備及半導體製程設備</chinese-title>  
        <english-title>ABNORMALITY DETECTION METHOD, SEMICONDUCTOR INSPECTION EQUIPMENT, AND SEMICONDUCTOR PROCESSING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G05B23/02</main-classification>  
        <further-classification edition="200601120251201B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧淩雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, LING YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳玉靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉夢佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, MENG JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種異常檢測方法、半導體檢測設備及半導體製程設備，異常檢測方法包括：響應於針對目標設備模組對應的製程文件的檢測指令，解析製程文件包括的目標資訊；目標資訊包括處理對象在目標設備模組中的滯留時長；基於目標資訊和預設滯留閾值，確定目標設備模組是否存在滯留異常。如此，可以在半導體製程製程中，及時、快速發現可能存在的製備異常情況和異常發生的位置，相較於人工查驗，大大節省了檢測時間，提高了檢測效率和檢測準確率，為提高產品品質和產品製備效率提供了保障。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an abnormality detection method, semiconductor inspection equipment, and semiconductor processing equipment. The abnormality detection method includes: in response to a detection instruction for a process file corresponding to a target equipment module, parsing the target information included in the process file; the target information includes the retention time of the processed object in the target equipment module; based on the target information and a preset retention threshold, determining whether there is a retention abnormality in the target equipment module. In this way, possible preparation abnormalities and the locations where abnormalities occur can be discovered promptly and quickly during the semiconductor processing process. Compared to manual inspection, this greatly saves inspection time, improves inspection efficiency and accuracy, and provides assurance for improving product quality and manufacturing efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一機械手</p>  
        <p type="p">11:製程腔室</p>  
        <p type="p">21:晶圓裝卸位</p>  
        <p type="p">22:校準模組</p>  
        <p type="p">23:冷卻盤</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1583" publication-number="202612537"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612537.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612537</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128022</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於堆疊半導體系統中混合接合之聚合物材料間隙填充</chinese-title>  
        <english-title>POLYMER MATERIAL GAP-FILL FOR HYBRID BONDING IN A STACKED SEMICONDUCTOR SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251213B">H10D89/10</main-classification>  
        <further-classification edition="200601120251213B">H01L23/538</further-classification>  
        <further-classification edition="200601120251213B">H01L21/768</further-classification>  
        <further-classification edition="200601120251213B">H01L21/56</further-classification>  
        <further-classification edition="200601120251213B">H01L23/528</further-classification>  
        <further-classification edition="200601120251213B">H01L23/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述用於一堆疊半導體系統中混合接合之聚合物材料間隙填充之方法、系統及裝置。一堆疊半導體可包含一半導體晶圓上之一第一半導體晶粒。一聚合物材料可在該半導體晶圓上且可至少部分環繞該第一半導體晶粒。氮化矽材料可在該第一半導體晶粒及該聚合物材料上。且一第二半導體晶粒可與該氮化矽材料上之一接合材料混合接合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and devices for polymer material gap-fill for hybrid bonding in a stacked semiconductor system are described. A stacked semiconductor may include a first semiconductor die on a semiconductor wafer. A polymer material may be on the semiconductor wafer and may at least partially surround the first semiconductor die. A silicon nitride material may be on the first semiconductor die and on the polymer material. And a second semiconductor die may be hybrid bonded with a bonding material on the silicon nitride material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:系統</p>  
        <p type="p">205-a:晶粒</p>  
        <p type="p">207:介電材料</p>  
        <p type="p">210:主機處理器</p>  
        <p type="p">212:接觸件</p>  
        <p type="p">215:控制器</p>  
        <p type="p">216:主機介面</p>  
        <p type="p">220-a-1:介面區塊</p>  
        <p type="p">220-a-2:介面區塊</p>  
        <p type="p">221-a-1:匯流排</p>  
        <p type="p">221-a-2:匯流排</p>  
        <p type="p">222-a-1:接觸件</p>  
        <p type="p">222-a-2:接觸件</p>  
        <p type="p">223-a-1:匯流排</p>  
        <p type="p">223-a-2:匯流排</p>  
        <p type="p">225:邏輯區塊</p>  
        <p type="p">230:邏輯區塊</p>  
        <p type="p">232:匯流排</p>  
        <p type="p">234:接觸件</p>  
        <p type="p">235:非揮發性儲存裝置</p>  
        <p type="p">237:感測器</p>  
        <p type="p">240-a-1:晶粒</p>  
        <p type="p">240-a-2:晶粒</p>  
        <p type="p">242:介電材料</p>  
        <p type="p">245-a-1:介面區塊</p>  
        <p type="p">245-a-2:介面區塊</p>  
        <p type="p">246-a-1:匯流排</p>  
        <p type="p">246-a-2:匯流排</p>  
        <p type="p">247-a-1:接觸件</p>  
        <p type="p">247-a-2:接觸件</p>  
        <p type="p">250-a-1:記憶體陣列</p>  
        <p type="p">250-a-2:記憶體陣列</p>  
        <p type="p">255-a-1:匯流排</p>  
        <p type="p">256-a-1:接觸件</p>  
        <p type="p">256-a-2:接觸件</p>  
        <p type="p">257-a-1:接觸件</p>  
        <p type="p">257-a-2:接觸件</p>  
        <p type="p">260-a-1:接觸件</p>  
        <p type="p">265-a-1:單元</p>  
        <p type="p">265-a-2:單元</p>  
        <p type="p">280-a-1:單元</p>  
        <p type="p">280-a-2:單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1584" publication-number="202610957"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610957.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610957</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128047</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製程腔室內低溫泵部件的保護塗層</chinese-title>  
        <english-title>PROTECTIVE COATINGS FOR CRYOGENIC PUMP COMPONENTS IN PROCESS CHAMBERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C04B35/14</main-classification>  
        <further-classification edition="200601120251201B">C04B35/48</further-classification>  
        <further-classification edition="200601120251201B">C04B35/505</further-classification>  
        <further-classification edition="200601120251201B">C23C16/40</further-classification>  
        <further-classification edition="200601120251201B">C23C16/455</further-classification>  
        <further-classification edition="200601120251201B">F04B37/08</further-classification>  
        <further-classification edition="200601120251201B">F04D19/04</further-classification>  
        <further-classification edition="200601120251201B">F04D29/58</further-classification>  
        <further-classification edition="200601120251201B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高　賈斯汀姜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAU, JUSTIN CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路柏曼斯基　迪米奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUBOMIRSKY, DIMITRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯日卡卡爾坎迪　拉胡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOZHIKKALKANDI, RAHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恰克羅堤　艾倫恰克羅堤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAKRAVARTHY, ARUN CHAKRAVARTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">低溫泵包括製冷單元和與該製冷單元耦接的低溫板。該低溫板包括板主體和在板主體的至少一個表面上的保護塗層。該保護塗層包括稀土氧化物或SiO&lt;sub&gt;2&lt;/sub&gt;中的至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cryogenic pump includes a refrigeration unit and a cryogenic plate coupled with the refrigeration unit. The cryogenic plate includes a plate body and a protective coating on at least one surface of the plate body. The protective coating includes at least one of a rare earth oxide or SiO&lt;sub&gt;2&lt;/sub&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">160:低溫泵</p>  
        <p type="p">162:低溫板</p>  
        <p type="p">163:保護塗層</p>  
        <p type="p">166A:外殼</p>  
        <p type="p">166B:外殼</p>  
        <p type="p">167A:主體</p>  
        <p type="p">167B:臂</p>  
        <p type="p">168:環</p>  
        <p type="p">170:製冷單元</p>  
        <p type="p">192:水蒸汽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1585" publication-number="202611264"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611264.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611264</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128052</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>B階段的熱導黏著劑</chinese-title>  
        <english-title>B-STAGE THERMALLY CONDUCTIVE ADHESIVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C09K5/08</main-classification>  
        <further-classification edition="200601120251210B">C08L63/04</further-classification>  
        <further-classification edition="200601120251210B">C08K3/08</further-classification>  
        <further-classification edition="200601120251210B">C09J11/04</further-classification>  
        <further-classification edition="201801120251210B">C09J7/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商漢高股份有限及兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENKEL AG &amp; CO. KGAA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高　軍波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, JUNBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹新培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, XINPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓綺茁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHUO, QIZHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪　伊麗莎貝斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOANG, ELIZABETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">熱導可固化組合物係可分配的以形成薄膜，且隨後進行B階段以降低流動性，由此防止該組合物在晶粒附著製程期間溢出。該熱導可固化組合物包括可在固化溫度下固化之基質前驅物、熱導顆粒填料及有機溶劑或溶劑混合物。該熱導顆粒填料可在等於或低於該固化溫度之燒結溫度下燒結，且該有機溶劑或溶劑混合物之閃點溫度等於或低於200℃。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thermally conductive curable composition is dispensable to form a thin film and subsequently B-staged to reduce the flowability and to thereby prevent overflow of the composition during the die attach process. The thermally conductive curable composition includes a matrix precursor that is curable at a cure temperature, a thermally conductive particulate filler, and an organic solvent or solvent mixture. The thermally conductive particulate filler is sinterable at a sintering temperature that is equal to or lower than the cure temperature, and the organic solvent or solvent mixture has a flash point temperature equal to or less than 200 &lt;sup&gt;o&lt;/sup&gt;C.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1586" publication-number="202611729"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611729.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611729</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於多通道ＤＤＲ　ＰＨＹ之共同ＩＣＣＭ　ＳＲＡＭ</chinese-title>  
        <english-title>COMMON ICCM SRAM FOR MULTI-CHANNEL DDR PHYS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251201B">G06F12/0815</main-classification>  
        <further-classification edition="201601120251201B">G06F12/084</further-classification>  
        <further-classification edition="200601120251201B">G06F13/16</further-classification>  
        <further-classification edition="200601220251201B">G11C11/4193</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商谷歌有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOGLE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔帕西　阿魯納　古瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIPATHY, ARUNA KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　阿比納夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, ABHINAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古迪薩　尼希倫德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUDISA, NIKHILENDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在系統單晶片(SoC)中實施之系統包括位於該SoC之一記憶體控制器中的一共用多埠靜態隨機存取記憶體(SRAM)。該SoC包括多個記憶體通道，該多個記憶體通道與該記憶體控制器中之該SRAM實質上等距置放。電腦指令儲存在該共用SRAM中。該多個記憶體通道存取儲存於該共用SRAM中之該等指令。多於一個記憶體通道可同時存取該等指令。該等指令可包括用於該系統之共同處理影像。共同處理影像可包括該SoC之韌體、任務模式韌體及/或記憶體位址映射。該共用SRAM滿足與一記憶體通道相關聯之微控制器的要求。與置放於各記憶體通道中的一指令SRAM相比，SRAM之數量減少為該系統中之通道數量分之一。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system implemented in a system on chip (SoC) includes a shared multi-port static random-access memory (SRAM) located in a memory controller of the SoC. The SoC includes a number of memory channels that are placed substantially equidistant from the SRAM in the memory controller. Computer instructions are stored in the shared SRAM. The number of memory channels access the instructions stored in the shared SRAM. More than one memory channel may access the instructions concurrently. The instructions can include common processing images for the system. Common processing images may include firmware of the SoC, mission mode firmware, and/or memory address mappings. The shared SRAM meets requirements of the microcontroller associated with a memory channel. The amount of SRAM is reduced by a factor of the number of channels in the system compared to an instruction SRAM placed in each memory channel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">113a:DRAM</p>  
        <p type="p">113b:DRAM</p>  
        <p type="p">113c:DRAM</p>  
        <p type="p">113d:DRAM</p>  
        <p type="p">400:SoC</p>  
        <p type="p">401a:資料</p>  
        <p type="p">401b:資料</p>  
        <p type="p">401c:資料</p>  
        <p type="p">401d:資料</p>  
        <p type="p">403:SRAM/共用SRAM</p>  
        <p type="p">405:記憶體子系統/MSS</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1587" publication-number="202610927"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610927.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610927</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鏈式吊車</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">B66D1/28</main-classification>  
        <further-classification edition="200601120251205B">B66D3/04</further-classification>  
        <further-classification edition="200601120251205B">B66D3/12</further-classification>  
        <further-classification edition="200601120251205B">B66D3/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商開道股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河西貴幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASAI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種鏈式吊車，包括鏈式吊車主體，此鏈式吊車主體具有無需對框架彼此之間的對接面進行機械加工即可嵌入軸承之軸承嵌合部。鏈式吊車（10）具有鏈式吊車主體（CB1），鏈式吊車主體係依序層疊透過鋁壓鑄形成之第一壓鑄框架（11）、第二壓鑄框架（12）以及第三壓鑄框架（13）而構成，在第一壓鑄框架（11）、第二壓鑄框架（12）以及第三壓鑄框架（13）上設置有可使軸承（B1〜B6）（軸承）嵌合之軸承嵌合部（11a7、11b3、11b4、12b3、13a3、13a4）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鏈式吊車</p>  
        <p type="p">11:第一壓鑄框架</p>  
        <p type="p">12:第二壓鑄框架</p>  
        <p type="p">13:第三壓鑄框架</p>  
        <p type="p">14:連接軸</p>  
        <p type="p">15:輪罩</p>  
        <p type="p">16:支撐板</p>  
        <p type="p">17:保護部件</p>  
        <p type="p">20:上部掛鉤</p>  
        <p type="p">30:操作輪組</p>  
        <p type="p">33:過載防止機構</p>  
        <p type="p">40:驅動軸</p>  
        <p type="p">53:棘輪</p>  
        <p type="p">54:棘爪部件</p>  
        <p type="p">70:負載齒輪</p>  
        <p type="p">100:下部掛鉤</p>  
        <p type="p">B1~B6:軸承</p>  
        <p type="p">BT:螺栓</p>  
        <p type="p">C1:手鏈</p>  
        <p type="p">C2:負載鏈</p>  
        <p type="p">N1,N2:螺母</p>  
        <p type="p">S1:螺絲</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1588" publication-number="202611028"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611028.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611028</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>合成包含胺基甲酸酯或尿素基團之環化合物之方法</chinese-title>  
        <english-title>METHOD TO SYNTHESISE CYCLIC COMPOUNDS CONTAINING URETHANE OR UREA GROUPS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D233/34</main-classification>  
        <further-classification edition="200601120251201B">C07D263/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商漢士門石油化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNTSMAN PETROCHEMICAL LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布歐諾　彼得羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUONO, PIETRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪索薩　布蘭登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D'SOUZA, BRENDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳致豫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於合成環狀胺基甲酸酯化合物或環狀尿素化合物之方法，其包括混合結構(I)之反應物 &lt;br/&gt;&lt;img align="absmiddle" height="171px" width="302px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;與結構(II)之溶劑 &lt;br/&gt;&lt;img align="absmiddle" height="264px" width="297px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;以形成混合物，及將二氧化碳添加至該混合物中並使該混合物進行反應以獲得結構(II)之產物，其中在結構(I)中，X&lt;sub&gt;1&lt;/sub&gt;係-OH或-NHR&lt;sub&gt;8&lt;/sub&gt;；且在結構(II)中，X&lt;sub&gt;2&lt;/sub&gt;係-O-或-NR&lt;sub&gt;8&lt;/sub&gt;-；在結構(I)及(II)中，n係選自0、1、2及3；在結構(I)及(II)中，R&lt;sub&gt;1&lt;/sub&gt;至R&lt;sub&gt;8&lt;/sub&gt;各自獨立地選自H、經取代或未經取代之烷基、經取代或未經取代之芳基、經取代或未經取代之烷氧基，及經取代或未經取代之芳基烷基，且其中該溶劑中之結構(II)之化合物及該產物具有相同化學結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of synthesising a cyclic urethane compound or cyclic urea compound including mixing a reactant of structure (I) &lt;br/&gt;&lt;img align="absmiddle" height="145px" width="276px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;with a solvent of structure (II) &lt;br/&gt;&lt;img align="absmiddle" height="258px" width="297px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;to form a mixture, and adding carbon dioxide to the mixture and reacting the mixture to obtain a product of structure (II), wherein in structure (I), X&lt;sub&gt;1&lt;/sub&gt; is -OH or -NHR&lt;sub&gt;8&lt;/sub&gt;; and in structure (II), X&lt;sub&gt;2&lt;/sub&gt; is -O- or -NR&lt;sub&gt;8&lt;/sub&gt;-; in both structures (I) and (II), n is selected from 0, 1, 2 and 3; in both structures (I) and (II), R&lt;sub&gt;1&lt;/sub&gt; to R&lt;sub&gt;8&lt;/sub&gt; is each independently selected from H, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted alkoxy group, and a substituted or unsubstituted arylalkyl, and wherein the compound according to structure (II) in the solvent and the product has the same chemical structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1589" publication-number="202610622"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610622.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610622</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128116</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>2-(3,5-二氯-1-甲基-吲唑-4-基)-1-[(1S,3R)-3-(羥甲基)-5-(1-羥基-1-甲基-乙基)-1-甲基-3,4-二氫-1H-異喹啉-2-基]乙酮一水合物之製造方法</chinese-title>  
        <english-title>PROCESS FOR THE PREPARATION OF 2-(3,5-DICHLORO-1-METHYL-INDAZOL-4-YL)-1-[(1S,3R)-3-(HYDROXYMETHYL)-5-(1-HYDROXY-1-METHYL-ETHYL)-1-METHYL-3,4-DIHYDRO-1H-ISOQUINOLIN-2-YL]ETHANONE MONOHYDRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/438</main-classification>  
        <further-classification edition="200601120251201B">A61K31/416</further-classification>  
        <further-classification edition="200601120251201B">A61P25/00</further-classification>  
        <further-classification edition="200601120251201B">A61P25/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商優稀美生物醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCB BIOPHARMA SRL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴特姆　亞歷山大皮耶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARTHELME, ALEXANDRE PIERRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德拉亭尼　尚皮耶米榭瑪利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELATINNE, JEAN-PIERRE MICHEL MARIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>狄亞柯佛塔奇　克莉絲汀納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIACOFOTAKI, CHRISTINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑哈德　朱利安法蘭索瓦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GERARD, JULIEN FRANCOIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉爾森　菲德瑞克朱勒Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILSON, FREDERIC JULES L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐艾特　傑宏阿爾貝Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOET, JEROME ALBERT J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西蒙　法蘭索瓦帕特里克Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMON, FRANCOIS PATRICK C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種2-(3,5-二氯-1-甲基-吲唑-4-基)-1-[(1&lt;i&gt;S&lt;/i&gt;,3&lt;i&gt;R&lt;/i&gt;)-3-(羥甲基)-5-(1-羥基-1-甲基-乙基)-1-甲基-3,4-二氫-1&lt;i&gt;H&lt;/i&gt;-異喹啉-2-基]乙酮一水合物之製造方法。&lt;br/&gt;&lt;img align="absmiddle" height="138px" width="176px" file="ed10053.JPG" alt="ed10053.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Process for the preparation of 2-(3,5-dichloro-1-methyl-indazol-4-yl)-1-[(1&lt;i&gt;S&lt;/i&gt;,3&lt;i&gt;R&lt;/i&gt;)-3-(hydroxymethyl)-5-(1-hydroxy-1-methyl-ethyl)-1-methyl-3,4-dihydro-1&lt;i&gt;H&lt;/i&gt;-isoquinolin-2-yl]ethanone monohydrate.&lt;br/&gt;&lt;img align="absmiddle" height="134px" width="180px" file="ed10054.JPG" alt="ed10054.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1590" publication-number="202611579"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611579.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611579</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於異質光子整合之光耦合</chinese-title>  
        <english-title>OPTICAL COUPLING FOR HETEROGENEOUS PHOTONIC INTEGRATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G02B6/26</main-classification>  
        <further-classification edition="200601120251201B">G02B6/42</further-classification>  
        <further-classification edition="200601120251201B">G02B6/12</further-classification>  
        <further-classification edition="200601120251201B">G02B6/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商量子電晶體科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTUM TRANSISTORS TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊恩　伊格　Ｉ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAYN, IGAL I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雷拉　德　利馬　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERREIRA DE LIMA, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托德曼　摩西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORDJMAN, MOSHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示用於光耦合之系統及方法。一種用於在一目標波長下操作之光耦合器包含：一第一介電材料之一層，其在該目標波長下具有一第一折射率；一第一脊，其包含該第一介電材料，沿一第一軸線安置於該層上，經組態以在該目標波長下導引一光波且終止於一第一終止點處；及一第二脊，其包含在該目標波長下具有大於該第一折射率之一第二折射率之一第二介電材料，沿平行於該第一軸線之一第二軸線安置且終止於安置於該層上之一錐形，該錐形具有在沿該第二軸線之一方向上減小至接近該第一終止點之一第二終止點之一變化寬度，藉此該經導引光波絕熱地耦合於該等第一與第二脊之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for optical coupling are disclosed. An optical coupler for operation at a target wavelength includes a layer of a first dielectric material having a first refractive index at the target wavelength; a first ridge including the first dielectric material, disposed on the layer along a first axis, configured to guide an optical wave at the target wavelength and terminating at a first termination point; and a second ridge including a second dielectric material having a second refractive index greater than the first refractive index at the target wavelength, disposed along a second axis, parallel to the first axis, and terminating in a taper, disposed on the layer, having a varying width that decreases in a direction, along the second axis to a second termination point in proximity to the first termination point, whereby the guided optical wave is adiabatically coupled between the first and second ridges.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光耦合器</p>  
        <p type="p">110:光子積體電路(PIC)</p>  
        <p type="p">115:層</p>  
        <p type="p">120:脊</p>  
        <p type="p">125:波導區</p>  
        <p type="p">128:基部</p>  
        <p type="p">130:脊</p>  
        <p type="p">140:錐形</p>  
        <p type="p">142:終止點</p>  
        <p type="p">145:軸線</p>  
        <p type="p">150:軸線</p>  
        <p type="p">160:錐形</p>  
        <p type="p">162:終止點</p>  
        <p type="p">164:波導區</p>  
        <p type="p">165:錐形</p>  
        <p type="p">168:基部</p>  
        <p type="p">170:介面</p>  
        <p type="p">175:量子位元區</p>  
        <p type="p">180:軸線</p>  
        <p type="p">185:埋藏氧化物(BOX)/熱氧化物(ThOX)層</p>  
        <p type="p">190:基板</p>  
        <p type="p">195:空腔</p>  
        <p type="p">Dx:位移</p>  
        <p type="p">Dy:間隔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1591" publication-number="202611072"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611072.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611072</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128158</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種BCMA結合蛋白、雙特異性抗體及其製備方法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/18</main-classification>  
        <further-classification edition="200601120251201B">C07K16/46</further-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">C12N15/13</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商和鉑醫藥（上海）有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARBOUR BIOMED (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戎一平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RONG, YIPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雪坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XUEKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種BCMA結合蛋白、雙特異性抗體及其製備方法及應用。所述BCMA結合蛋白包括重鏈可變區和輕鏈可變區，所述的輕鏈可變區包含LCDR1、LCDR2和LCDR3；所述的重鏈可變區包含HCDR1、HCDR2和HCDR3。所述LCDR1、LCDR2和LCDR3以及所述HCDR1、HCDR2和HCDR3之胺基酸序列詳見本發明。本發明之BCMA結合蛋白具有良好特異性親合力，其在腫瘤細胞系上比對照抗體結合更好，且其內化效應優於對照，因此可以作為ADC候選物進一步開發；雙特異性抗體有效的同時靶向人BCMA和人CD3。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1592" publication-number="202610769"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610769.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610769</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體混成式接合之拋光墊及使用其之半導體裝置的製備方法</chinese-title>  
        <english-title>POLISHING PAD FOR SEMICONDUCTOR HYBRID BONDING AND PREPARATION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251201B">B24B37/24</main-classification>  
        <further-classification edition="201201120251201B">B24B37/26</further-classification>  
        <further-classification edition="200601120251201B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商恩普士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENPULSE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳信一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, SHINIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐章源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JANGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申有眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, YUJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金京煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金潁煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明的具體實例，有提供一種拋光墊及使用該拋光墊來製備半導體裝置之方法。該拋光墊包含一具有在預定範圍內的拋光選擇性之拋光層，其中該範圍係依該欲拋光的物體之熱膨脹係數而定。該半導體基材的碟陷在該拋光製程期間係經控制，藉此可減少半導體裝置的表面缺陷及接合失效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to embodiments of the present invention, there are provided a polishing pad and a process for preparing a semiconductor device using the polishing pad. The polishing pad comprises a polishing layer having a polishing selectivity within a predetermined range depending on the coefficient of thermal expansion of an object to be polished. The dishing of the semiconductor substrate is controlled during the polishing process, whereby surface defects and bonding failures of semiconductor devices can be reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:欲拋光的物體，物體</p>  
        <p type="p">105:基礎基材</p>  
        <p type="p">110:第一區域</p>  
        <p type="p">120:第二區域，區域</p>  
        <p type="p">200:拋光墊</p>  
        <p type="p">250:拋光層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1593" publication-number="202611832"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611832.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611832</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一個可結合電子地圖搜尋服務的商店整合伺服器、商店整合系統及其使用方法</chinese-title>  
        <english-title>A STORE ALLOCATION SERVER, STORE ALLOCATION SYSTEM AND METHOD THAT COLLABORATE WITH THE MAPPING SERVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250901B">G06Q30/06</main-classification>  
        <further-classification edition="202401120250901B">G06Q10/08</further-classification>  
        <further-classification edition="200601120250901B">G06K7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雲創通訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>M2 COMMUNICATION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏駿愷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, DERRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於整合多個商店的商店整合伺服器，包括處理器；與該處理器連接的儲存裝置，用以儲存多個商店中多個電子貨架標籤(Electronic Shelf Label, ESL)與多個產品之間的第一關聯，以及多個產品與多個貨架之間的第二關聯；與該處理器連接的應用介面模組，用以允許使用者裝置與商店整合伺服器無線通訊；以及與處理器及儲存裝置連接的搜尋單元，用以：基於使用者裝置的搜尋請求，在儲存裝置中搜尋特定產品，並產生搜尋結果，其中當搜尋請求是由顧客的使用者裝置發出時，搜尋結果包括以電子地圖顯示具有特定產品的至少一商店的資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a store allocation server. The store allocation server includes a processor; a storage device configured to the processor and configured to store a first association between the plurality of ESLs and a plurality of products of each store, and a second association between the plurality of products and a plurality of shelves of each store; an application interface module connected to the processor and configured to allow a user device to wirelessly communicate with the store integration server; and a searching unit connected to the processor and the storage device, and configured to search a specific product in the storage device based on a search request from the user device and produce a search result, wherein when the search request is transmitted from the user device by a customer, the search result includes information of at least one store having the specific product with an e-map.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:伺服器</p>  
        <p type="p">210:處理器</p>  
        <p type="p">220:儲存裝置</p>  
        <p type="p">221、222:儲存單元</p>  
        <p type="p">230:無線收發器</p>  
        <p type="p">240:搜尋單元</p>  
        <p type="p">250:應用介面模組</p>  
        <p type="p">2211、2221:商店資料庫</p>  
        <p type="p">2212、2222:產品資料庫</p>  
        <p type="p">2213、2223:ESL資料庫</p>  
        <p type="p">2214、2224:關聯資料庫</p>  
        <p type="p">2215、2225:銷售資訊資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1594" publication-number="202612237"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612237.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612237</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>驅動單元</chinese-title>  
        <english-title>DRIVING CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250804B">H02M3/06</main-classification>  
        <further-classification edition="200701120250804B">H02M1/00</further-classification>  
        <further-classification edition="200601120250804B">H02M1/088</further-classification>  
        <further-classification edition="200701120250804B">H02M1/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓少鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SHAOPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏炎冰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, YANBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫柯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案為一種驅動單元，包含：驅動器，接收第一控制信號；負壓產生電路，包含第一端、第二端、第一電阻、第一電容及第二電阻，第一端電連接於驅動器，第一電阻及第一電容串聯電連接且構成串聯支路而與第二電阻並聯，負壓產生電路於第二端輸出第一開關信號；以及負壓控制電路，包含二極體及輔助開關，串聯電連接於負壓產生電路的第二端及接地端之間，當第一控制信號由高電平變為低電平時，第一開關信號通過負壓產生電路而由正電壓變為負電壓，且經過死區時間後，第一開關信號通過負壓控制電路的控制而由負電壓變為零電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A driving circuit includes a driver, a negative voltage generating circuit and a negative voltage control circuit. The driver receives a first control signal. The negative voltage generating circuit includes a first terminal, a second terminal, a first resistor, a first capacitor and a second resistor. The first terminal is electrically connected to the driver, and the first resistor and the first capacitor are electrically connected in series to form a series branch and connected in parallel with the second resistor. The negative voltage generating circuit outputs a first switch signal at the second terminal. The negative voltage control circuit includes a diode and an auxiliary switch , which are electrically connected in series between the second terminal of the negative voltage generating circuit and a ground terminal. When the first control signal is changed from a high level state to a low level state, the first switching signal is changed from a positive voltage to a negative voltage through the negative voltage generating circuit. After the dead time, the first switching signal is changed from the negative voltage to a zero voltage through a negative voltage generating circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:驅動單元</p>  
        <p type="p">9:電源轉換裝置</p>  
        <p type="p">2:開關電路</p>  
        <p type="p">3:控制器</p>  
        <p type="p">Q1:第一上開關</p>  
        <p type="p">Q2:第一下開關</p>  
        <p type="p">Q3:第二上開關</p>  
        <p type="p">Q4:第二下開關</p>  
        <p type="p">PWM_MCU1:第一控制信號</p>  
        <p type="p">PWM_MCU2:第二控制信號</p>  
        <p type="p">PWM1:第一開關信號</p>  
        <p type="p">PWM2:第二開關信號</p>  
        <p type="p">10:第一驅動器</p>  
        <p type="p">11:第一負壓產生電路</p>  
        <p type="p">12:第一負壓控制電路</p>  
        <p type="p">VCC:電壓源</p>  
        <p type="p">R1:第一電阻</p>  
        <p type="p">C1:第一電容</p>  
        <p type="p">R2:第二電阻</p>  
        <p type="p">D1:第一二極體</p>  
        <p type="p">Q5:第一輔助開關</p>  
        <p type="p">13:第二驅動器</p>  
        <p type="p">14:第二負壓產生電路</p>  
        <p type="p">15:第二負壓控制電路</p>  
        <p type="p">R3:第三電阻</p>  
        <p type="p">C2:第二電容</p>  
        <p type="p">R4:第四電阻</p>  
        <p type="p">D2:第二二極體</p>  
        <p type="p">Q6:第二輔助開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1595" publication-number="202612352"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612352.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612352</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128195</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有單晶片基於事件視覺感測器(EVS)降噪器之影像感測器</chinese-title>  
        <english-title>IMAGE SENSOR WITH ON-CHIP EVENT-BASED VISION SENSOR (EVS) DENOISER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H04N25/703</main-classification>  
        <further-classification edition="202301120251103B">H04N25/75</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍怡翾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, YIXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慕　博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MU, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊文磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WENLEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於一種具有單晶片基於事件視覺感測器(EVS)降噪器之影像感測器。該影像感測器包括一像素陣列、一降噪訊框緩衝器、一降噪處理器及一事件掃描器。該像素陣列包含複數個EVS像素。該降噪訊框緩衝器經組態以儲存一事件位元映圖。該事件位元映圖包含單元之一陣列。該等單元與該像素陣列之該等EVS像素具有一種一對一對應關係。每一單元儲存一事件位元。該降噪處理器包含儲存指令之邏輯，該等指令在由該降噪處理器執行時，致使該影像感測器執行包括以下各項之操作：更新該事件位元映圖之該等事件位元；及基於該事件位元映圖而對由該像素陣列感測之一事件串流進行濾波以輸出一EVS資料。該事件掃描器經組態以自該降噪處理器接收該經濾波事件串流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to an image sensor with on-chip event-based vision sensor (EVS) denoiser. The image sensor comprises a pixel array, a denoise frame buffer, a denoise processor and an event scanner. The pixel array incudes a plurality of EVS pixels. The denoise frame buffer is configured to store an event bit map. The event bit map includes an array of units. The units have a one-to-one correspondence with the EVS pixels of the pixel array. Each unit stores an event bit. The denoise processor includes logic storing instructions that, when executed by the denoise processor, causes the image sensor to perform operations comprising:updating the event bits of the event bit map; and filtering an event stream sensed by the pixel array based on the event bit map to output an EVS data. The event scanner is configured to receive the filtered event stream from the denoise processor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:影像感測器</p>  
        <p type="p">101:像素陣列</p>  
        <p type="p">102a:降噪器訊框緩衝器</p>  
        <p type="p">102b:降噪器訊框緩衝器</p>  
        <p type="p">102c:降噪器訊框緩衝器</p>  
        <p type="p">103:降噪處理器</p>  
        <p type="p">104:列控制器</p>  
        <p type="p">105:事件掃描器</p>  
        <p type="p">106:資料路徑</p>  
        <p type="p">1011:基於事件視覺感測器像素</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1596" publication-number="202610645"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610645.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610645</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128202</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙環IL-17A/F抑制劑及其製備方法與應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/535</main-classification>  
        <further-classification edition="200601120251201B">A61K31/498</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4155</further-classification>  
        <further-classification edition="200601120251201B">A61P19/00</further-classification>  
        <further-classification edition="200601120251201B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳信立泰藥業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴　英傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YINGJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊金鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIONG, JINFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>段振芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUAN, ZHENFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉漢斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HANBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧生祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, SHENGLU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖萬龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, WANLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張才榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CAIRONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖瑛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周雨薇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YUWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明屬化學藥物技術領域，提供一種雙環IL-17A/F抑制劑化合物及其製備方法與應用，具體涉及通式(I)所示的化合物，或其消旋體、或其異構體、或其可藥用的鹽， &lt;img align="absmiddle" height="118px" width="249px" file="ed10344.JPG" alt="ed10344.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，作為IL-17A/F抑制劑，用於治療銀屑病、關節炎等疾病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1597" publication-number="202610910"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610910.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610910</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128244</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拉鍊封口；可重複封合的袋體；及其方法</chinese-title>  
        <english-title>ZIPPER CLOSURE; RECLOSEABLE POUCH; &amp; METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">B65D33/16</main-classification>  
        <further-classification edition="200601120251202B">B65D33/24</further-classification>  
        <further-classification edition="200601120251202B">B65D30/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雷諾普雷斯托產品公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REYNOLDS PRESTO PRODUCTS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德魯　尼可拉斯Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DERUE, NICHOLAS A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋爾勒　理查Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEHRLE, RICHARD T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯普森　葛瑞格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMPSON, GREGG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於彈性包裝的可重複封合的拉鍊封口，包含一母型材，該母型材具有第一與第二間隔配置的型材支腿，由一母基座連接，以界定一中央連續細長型之接收凹槽。與該母型材相對之一公型材，包含從公基座延伸的一公型材元件，該公型材元件之尺寸與位置設計為可釋放性地插入該接收凹槽並與該第一與第二型材支腿接合。一母翅片於沿該基座之一接合區域連接至該母型材，該母翅片配置為可固定於該彈性包裝之一部分。一公翅片連接至該公型材元件，該公翅片配置為可固定於該彈性包裝之另一部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A recloseable zipper closure for use with a flexible package has a female profile including first and second spaced profile legs joined by a female base to define a central, continuous, elongate receiver recess. A male profile opposing the female profile includes a male profile member extending from a male base, the male profile member being sized and positioned to be releasably inserted in the receiver recess and engaged with the first and second profile legs. A female fin is attached to the female profile at an attachment area along the base; the female fin being positioned to be secured to a portion of the flexible package. A male fin is attached to the male profile member and is positioned to be secured to another portion of the flexible package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:袋</p>  
        <p type="p">62:拉鍊封口</p>  
        <p type="p">64:第一面板</p>  
        <p type="p">66:上邊緣</p>  
        <p type="p">70:上邊緣</p>  
        <p type="p">74:內部</p>  
        <p type="p">76:開口</p>  
        <p type="p">78:封合底部</p>  
        <p type="p">80:側邊緣</p>  
        <p type="p">81:側邊緣</p>  
        <p type="p">84:滑動器</p>  
        <p type="p">86:箭頭</p>  
        <p type="p">88:箭頭</p>  
        <p type="p">90:缺口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1598" publication-number="202611490"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611490.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611490</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128252</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>溫度測定用晶圓及使用其之基板處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251211B">G01K1/024</main-classification>  
        <further-classification edition="202101120251211B">G01K1/14</further-classification>  
        <further-classification edition="200601120251211B">G01K1/00</further-classification>  
        <further-classification edition="200601120251211B">H01L21/67</further-classification>  
        <further-classification edition="200601120251211B">H01L21/677</further-classification>  
        <further-classification edition="200601120251211B">H01L23/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西幸治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHI, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稻垣幸彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INAGAKI, YUKIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可提升運作效率，且可在更高溫條件下使用的溫度測定用晶圓，以及使用其之基板處理系統。 &lt;br/&gt;本發明之溫度測定用晶圓1具備有溫度感測器3、發送部8、及電池基板7。發送部8將由溫度感測器3所檢測出之溫度測定對象的溫度數據以無線發送至溫度測定用晶圓1。亦即，由於溫度測定用晶圓1以無線方式對外部進行資訊通訊，因此其可避免因通訊用線路所造成之運作效率降低。電池基板7使用全固態二次電池21對溫度感測器3及發送部8各者供給電力。藉由使用全固態二次電池21，即使於更高溫條件下其性能不致劣化而可使溫度測定用晶圓1運作。因此，其可提升溫度測定用晶圓1的運作效率，並可在更高溫條件下使用溫度測定用晶圓1。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:溫度測定用晶圓</p>  
        <p type="p">3:溫度感測器</p>  
        <p type="p">5:計測基板</p>  
        <p type="p">6:A/D轉換器</p>  
        <p type="p">7:電池基板</p>  
        <p type="p">8:發送部</p>  
        <p type="p">9:受電基板</p>  
        <p type="p">11:電池溫度檢測部</p>  
        <p type="p">13:受電部</p>  
        <p type="p">14:基板溫度檢測部</p>  
        <p type="p">21:全固態二次電池</p>  
        <p type="p">30:基板處理裝置</p>  
        <p type="p">43:熱處理單元</p>  
        <p type="p">45:待機單元</p>  
        <p type="p">46:接收單元</p>  
        <p type="p">76:保持旋轉部</p>  
        <p type="p">80:供電單元</p>  
        <p type="p">85:控制部</p>  
        <p type="p">86:溫度控制部</p>  
        <p type="p">87:操作部</p>  
        <p type="p">88:冷卻控制部</p>  
        <p type="p">89:記憶部</p>  
        <p type="p">91:報知部</p>  
        <p type="p">100:基板處理系統(基板處理單元、基板測定單元)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1599" publication-number="202612038"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612038.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612038</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>沉積貫穿玻璃通孔的襯墊層的方法</chinese-title>  
        <english-title>METHODS OF DEPOSITING LINER LAYERS OF THROUGH GLASS VIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/60</main-classification>  
        <further-classification edition="200601120251201B">C23C16/52</further-classification>  
        <further-classification edition="200601120251201B">C09J11/04</further-classification>  
        <further-classification edition="200601120251201B">H01L23/538</further-classification>  
        <further-classification edition="200601120251201B">H01L23/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任東吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIM, DONG KIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昌陵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHANGLING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙　來</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔　壽永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SOO YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例大體係關於襯墊層及形成貫穿玻璃通孔的襯墊層的方法。在一或多個實施例中，襯墊層被沉積在具有複數個通孔的玻璃基板上，該複數個通孔設置貫穿該玻璃基板。該方法包括在複數個通孔中的通孔上和通孔中沉積黏著層以形成黏著層，該黏著層的厚度為約100埃至約550埃，拉應力為約-30MPa至約80MPa，以及楊氏模量為約115GPa至約200GPa，並在黏著層上沉積一層第二層，該第二層的厚度為約2,000埃至約60,000埃，壓應力大於-50MPa，以及楊氏模量為約35GPa至約70GPa。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Implementations of the present disclosure generally relate to liner layers and methods of forming liner layers for through glass vias. In one or more implementations, a liner layer is deposited on a glass substrate having a plurality of vias disposed through the glass substrate. The method includes depositing an adhesion layer onto and in a via of the plurality of vias to form the adhesion layer, the adhesion layer having a thickness of about 100 Angstroms to about 550 Angstroms, a tensile stress of about -30 MPa to about 80 MPa, and a Young’s modulus of about 115 GPa to about 200 GPa and depositing a second layer onto the adhesion layer, the second layer having a thickness of about 2,000 Angstroms to about 60,000 Angstroms, a compressive stress greater than about -50 MPa, and a Young’s modulus of about 35 GPa to about 70 GPa.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">303:襯墊層</p>  
        <p type="p">400:邊緣部分</p>  
        <p type="p">401:表面</p>  
        <p type="p">406:黏著層</p>  
        <p type="p">407:第二層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1600" publication-number="202611486"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611486.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611486</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128304</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分光器及分光系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251110B">G01J3/12</main-classification>  
        <further-classification edition="200601120251110B">G01J3/28</further-classification>  
        <further-classification edition="200601120251110B">G02B27/10</further-classification>  
        <further-classification edition="200601120251110B">G02B5/20</further-classification>  
        <further-classification edition="200601120251110B">G05B19/404</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能野隆文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKINO, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤勝彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, KATSUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔵本有未</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURAMOTO, YUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上滉士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴山勝己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBAYAMA, KATSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之分光器具備具有光通過部之光檢測元件、及分光部。光檢測元件具有：第1光檢測部，其包含複數個第1像素，且檢測由分光部分光之繞射光；及第2光檢測部，其包含複數個第2像素，且檢測0次光。於自第1方向觀察之情形時，光通過部於第2方向上，配置於第1光檢測部與第2光檢測部之間。分光部對互為相同波長之繞射光及0次光，以第2光檢測部中之0次光之半高寬大於第1光檢測部中之繞射光之半高寬之方式，將測定光分光並反射。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:光檢測元件</p>  
        <p type="p">2a:光通過部</p>  
        <p type="p">3:分光部</p>  
        <p type="p">3a:光柵圖案</p>  
        <p type="p">4:支持構件</p>  
        <p type="p">4c:曲面</p>  
        <p type="p">20:半導體基板</p>  
        <p type="p">20a:表面</p>  
        <p type="p">20b:表面</p>  
        <p type="p">21:第1光檢測部</p>  
        <p type="p">22:第2光檢測部</p>  
        <p type="p">210:受光面</p>  
        <p type="p">220:受光面</p>  
        <p type="p">A2:第2直線</p>  
        <p type="p">C:中心</p>  
        <p type="p">L:測定光</p>  
        <p type="p">L0:0次光</p>  
        <p type="p">L1:-1次光(規定次數之繞射光)</p>  
        <p type="p">P0,P1:聚光位置</p>  
        <p type="p">S0:偏移量</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1601" publication-number="202612302"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612302.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612302</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128315</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於系統極化碼的速率匹配及位元凍結</chinese-title>  
        <english-title>RATE MATCHING AND BIT FREEZING FOR SYSTEMATIC POLAR CODES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H04L1/00</main-classification>  
        <further-classification edition="200601120251201B">H03M13/13</further-classification>  
        <further-classification edition="200601120251201B">H04L5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李察德森　湯瑪斯喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHARDSON, THOMAS JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾法諾夫　基瑞爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IVANOV, KIRILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩爾基斯　蓋比</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARKIS, GABI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江勁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。例如，當來自一系統極化編碼器的一輸出具有與一目標碼長度&lt;i&gt;E&lt;/i&gt;不同的一經寫碼位元長度&lt;i&gt;N&lt;/i&gt;時，可選擇位元凍結的位置，使得一組所得資訊位元位置（包括循環冗餘碼(CRC)位元位置）滿足一系統編碼條件。此外，當該經寫碼位元長度&lt;i&gt;N&lt;/i&gt;超出該目標碼長度&lt;i&gt;E&lt;/i&gt;時，使得執行縮短或刪餘以達成該目標碼長度，可選擇縮短或刪餘的位置以確保該組資訊位元位置滿足該系統編碼條件。以此方式，該系統極化碼可在與該等資訊位元相同的該等位置包括一組系統位元，且該等系統位元不出現在任何不傳輸（例如，經刪餘或經縮短的）位置上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. For example, when an output from a systematic polar encoder has a coded bit length N that differs from a target code length E, locations for bit freezing may be selected such that a resulting set of information bit locations (including cyclic redundancy code (CRC) bit locations) satisfy a systematic encoding condition. Furthermore, when the coded bit length N exceeds the target code length E, such that shortening or puncturing is performed to achieve the target code length, locations for shortening or puncturing may be selected to ensure that the set of information bit locations satisfy the systematic encoding condition. In this way, the systematic polar code may include a set of systematic bits at the same locations as the information bits, and the systematic bits do not appear in any untransmitted (for example, punctured or shortened) locations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:實例</p>  
        <p type="p">710:第一操作</p>  
        <p type="p">730:第二操作</p>  
        <p type="p">740:第三操作</p>  
        <p type="p">750:第四操作</p>  
        <p type="p">760:第五操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1602" publication-number="202610911"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610911.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610911</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128330</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶有用於滑動器接合的耳部的拉鍊封口；可重新封合的袋；及方法</chinese-title>  
        <english-title>ZIPPER CLOSURE WITH EARS FOR SLIDER ENGAGEMENT; RECLOSEABLE POUCH; &amp; METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">B65D33/16</main-classification>  
        <further-classification edition="200601120251204B">B65D33/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雷諾普雷斯托產品公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REYNOLDS PRESTO PRODUCTS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德魯　尼可拉斯Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DERUE, NICHOLAS A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋爾勒　理查Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEHRLE, RICHARD T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯普森　葛瑞格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMPSON, GREGG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴利　奧斯汀Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAILEY, AUSTIN B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於一袋的可重新封合的拉鍊封口，包含一母輪廓，母輪廓包含第一與第二間隔配置的輪廓支腿，並由一母基座連接，以定義一中央連續細長的一接收器凹槽；以及與母輪廓相對設置的一公輪廓。一第一耳部從第二輪廓支腿向遠離母翅片方向延伸，第一耳部具有設置於最遠離母與公輪廓之處的一第一尖端。一第二耳部，與第一耳部相對設置，第二耳部自公基座向遠離公翅片方向延伸，第二耳部具有一設置於最遠離母與公輪廓之處的第二尖端。一第一凸出部從第一耳部以非零角度朝向第二耳部延伸，並且一第二凸出部從第二耳部以非零角度朝向第一耳部延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A recloseable zipper closure for use with a pouch includes a female profile including first and second spaced profile legs joined by a female base to define a central, continuous, elongate receiver recess; a male profile opposing the female profile. A first ear extends from the second profile leg in a direction away from the female fin, the first ear has a first tip positioned a furthest distance away from the female and male profiles. A second ear, opposing the first ear, extends from the male base in a direction away from the male fin. The second ear has a second tip positioned a furthest distance away from the female and male profiles. A first protrusion extends from the first ear at a non-zero angle in a direction toward the second ear; and a second protrusion extends from the second ear at a non-zero angle in a direction toward the first ear.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:袋</p>  
        <p type="p">62:拉鍊封口</p>  
        <p type="p">63:封口導軌</p>  
        <p type="p">64:第一袋板</p>  
        <p type="p">66:上緣</p>  
        <p type="p">68:第二袋板</p>  
        <p type="p">70:上緣</p>  
        <p type="p">72:壁</p>  
        <p type="p">74:內部</p>  
        <p type="p">76:袋口</p>  
        <p type="p">78:封閉底部</p>  
        <p type="p">80:側邊緣</p>  
        <p type="p">81:側邊緣</p>  
        <p type="p">84:滑動器裝置</p>  
        <p type="p">86:箭頭</p>  
        <p type="p">88:箭頭</p>  
        <p type="p">90:缺口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1603" publication-number="202612063"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612063.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612063</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128333</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學容器更換系統</chinese-title>  
        <english-title>CHEMICAL CONTAINER REPLACEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01L21/67</main-classification>  
        <further-classification edition="200601120251205B">B65G65/30</further-classification>  
        <further-classification edition="200601120251205B">B25J9/16</further-classification>  
        <further-classification edition="200601120251205B">B67B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金平鋼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, PYUNGKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高鍾星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, JONGSEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴正濬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙容敃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, YONGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴俊赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNHYEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴柾俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNGJOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐庸準</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, YONGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李供雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KONGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金大容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DAEYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李旻栽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MINJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李賢英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUNYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙成珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, SUNGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔現雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, HYUNWOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容描述一種更換機器人，其包括：一機器人本體；在該機器人本體上之一機器人臂；一設備蓋夾持器，其在該機器人臂上且組配來開啟及關閉連接於一化學容器之一設備蓋模組，該化學容器係一空容器；以及在該機器人本體上之一容器台。該容器台包括：一台本體；一第一容器殼，其在該台本體上且組配來容納一空容器；一第二容器殼，其在該台本體上且組配來容納一滿容器；以及一殼驅動裝置，其組配來使該第一容器殼朝向該第二容器殼旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A replacement robot includes a robot body, a robot arm on the robot body, an equipment cap gripper on the robot arm and configured to open and close an equipment cap module connected to a chemical container, the chemical container being an empty container, and a container table on the robot body. The container table includes a table body, a first container case on the table body and configured to accommodate an empty container, a second container case on the table body and configured to accommodate a full container, and a case driving device configured to rotate the first container case toward the second container case.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:更換機器人</p>  
        <p type="p">200:返回機器人</p>  
        <p type="p">300:機櫃裝置</p>  
        <p type="p">400:容器埠</p>  
        <p type="p">500:伺服器</p>  
        <p type="p">1000:化學容器更換系統</p>  
        <p type="p">A,B:區</p>  
        <p type="p">EQ:化學設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1604" publication-number="202612152"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612152.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612152</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128336</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背側供電附接</chinese-title>  
        <english-title>BACKSIDE POWER DELIVERY ATTACHMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L23/528</main-classification>  
        <further-classification edition="200601120251201B">H01L23/498</further-classification>  
        <further-classification edition="200601120251201B">H01L23/31</further-classification>  
        <further-classification edition="200601120251201B">H01L21/768</further-classification>  
        <further-classification edition="200601120251201B">H01L21/60</further-classification>  
        <further-classification edition="200601120251201B">H01L21/24</further-classification>  
        <further-classification edition="200601120251201B">H01L21/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈巴　貝高森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HABA, BELGACEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特卡　拉杰詡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATKAR, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種供電基板，其可包括摻雜半導體，該摻雜半導體包括接地區塊、與這些接地區塊平行且共面的電源區塊，及位於這些接地區塊與這些電源區塊之間的絕緣體。第一絕緣體層可安置在該摻雜半導體上方且包括第一溝槽及第二溝槽。這些第一溝槽及第二溝槽可與這些接地區塊及電源區塊交叉。第一導電跡線可被包括於這些第一溝槽中且與這些接地區塊電接觸。第二導電跡線可被包括於這些第二溝槽中且與這些電源區塊電接觸。第二絕緣體層可安置在這些第一導電跡線及這些第二導電跡線上方，且接合襯墊可嵌入在該第二絕緣體層中。這些接合襯墊可電連接至這些第一導電跡線及這些第二導電跡線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power delivery substrate may include a doped semiconductor including ground blocks, power blocks parallel to and coplanar with the ground blocks, and an insulator between the ground and power blocks. A first insulator layer can be disposed over the doped semiconductor and include first trenches and second trenches. The first and second trenches can be crossing with the ground and power blocks. First conductive traces may be included in the first trenches and in electrical contact with the ground blocks. Second conductive traces may be included in the second trenches and in electrical contact with the power blocks. A second insulator layer can be disposed over the first and the second conductive traces, and bonding pads can be embedded in the second insulator layer. The bonding pads can be electrically connected to the first and the second conductive traces.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:供電基板</p>  
        <p type="p">202:區塊</p>  
        <p type="p">506:絕緣體</p>  
        <p type="p">700:晶片</p>  
        <p type="p">701:第一介電質</p>  
        <p type="p">703:第一接合襯墊</p>  
        <p type="p">708:第二介電質</p>  
        <p type="p">710:互連件</p>  
        <p type="p">712:第二接合襯墊</p>  
        <p type="p">714:接合界面</p>  
        <p type="p">716:液體冷卻結構</p>  
        <p type="p">718:空腔</p>  
        <p type="p">720:入口</p>  
        <p type="p">722:出口</p>  
        <p type="p">724:接合界面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1605" publication-number="202611773"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611773.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611773</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128339</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提示產生裝置及方法</chinese-title>  
        <english-title>PROMPT GENERATING DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250901B">G06F40/40</main-classification>  
        <further-classification edition="202001120250901B">G06F40/56</further-classification>  
        <further-classification edition="202001120250901B">G06F40/30</further-classification>  
        <further-classification edition="201901120250901B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗永徽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUNG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖宜斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, I-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種提示產生裝置及方法。該提示產生裝置接收一情境提問。該提示產生裝置傳送複數個個性類別中之一目標個性類別及該情境提問至一提示產生器，以產生對應該目標個性類別之複數個候選提示及對應該等候選提示之複數個獎勵信號，其中該提示產生器是基於一大型語言模型及對應該等個性類別之一回饋模型訓練。該提示產生裝置基於對應該等候選提示的該等獎勵信號，自該等候選提示中決定一最佳提示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A prompt generating device and method are provided. The prompt generating device receives a situational question. The prompt generating device transmits a target personality category among a plurality of personality categories and the situational question to a prompt generator to generate a plurality of candidate prompts corresponding to the target personality category and a plurality of reward signals corresponding to the candidate prompts, wherein the prompt generator is trained based on a large language model and a reward model corresponding to the personality categories. The prompt generating device determines a best prompt from the candidate prompts based on the reward signals corresponding to the candidate prompts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:提示產生方法</p>  
        <p type="p">S801、S803:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1606" publication-number="202612388"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612388.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612388</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128349</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>切換式電源及其積體電路和方法</chinese-title>  
        <english-title>A SWITCHING POWER SUPPLY AND ASSOCIATED INTEGRATED CIRCUIT AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251103B">H05B45/3725</main-classification>  
        <further-classification edition="200601120251103B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚軍鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, JUNXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李光輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GUANGHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了切換式電源、用於該切換式電源的積體電路以及方法，該切換式電源為負載提供輸出電壓。該積體電路包括多個端子、模式判斷電路以及閘極驅動電路。其中，模式判斷電路提供決定第一驅動電壓或第二驅動電壓的模式訊號，其中，模式訊號具有第一電位和第二電位。閘極驅動電路接收模式訊號，基於模式訊號而選擇將第一驅動電壓或第二驅動電壓提供至第一電晶體的控制端，其中，第一驅動電壓小於第二驅動電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a switching power supply for providing an output voltage for a load, an integrated circuit for the switching power supply and a method. The integrated circuit has a plurality of terminals, a mode determination circuit and a gate driver. The mode determination circuit provides a mode signal to determine a first drive voltage or a second drive voltage. The gate driver receives the mode signal, provides the determined drive voltage to a control terminal of the first transistor based on the mode signal. The first drive voltage is less than the second drive voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積體電路</p>  
        <p type="p">100:切換式電源</p>  
        <p type="p">101:模式判斷電路</p>  
        <p type="p">102:閘極驅動電路</p>  
        <p type="p">103:開關控制電路</p>  
        <p type="p">104:負載</p>  
        <p type="p">105:電流調節電路</p>  
        <p type="p">BST:第四端子</p>  
        <p type="p">C1:第一電容器</p>  
        <p type="p">C2:第二電容器</p>  
        <p type="p">C3:第三電容器</p>  
        <p type="p">Cin:輸入電容器</p>  
        <p type="p">CP:第三端子</p>  
        <p type="p">GND:第六端子</p>  
        <p type="p">IN:第一端子</p>  
        <p type="p">L:電感器</p>  
        <p type="p">LEDx:接腳</p>  
        <p type="p">M1:第一電晶體</p>  
        <p type="p">M2:第二電晶體</p>  
        <p type="p">M3:第三電晶體</p>  
        <p type="p">M4:第四電晶體</p>  
        <p type="p">MS:模式訊號</p>  
        <p type="p">OUT:第五端子</p>  
        <p type="p">S1:第一控制訊號</p>  
        <p type="p">SW:第二端子</p>  
        <p type="p">VD1:第一驅動電壓</p>  
        <p type="p">VD2:第二驅動電壓</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">VSW:第一電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1607" publication-number="202610629"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610629.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610629</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128358</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造海鞘素化合物的合成方法</chinese-title>  
        <english-title>SYNTHETIC PROCESS FOR THE MANUFACTURE OF ECTEINASCIDIN COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">A61K31/498</main-classification>  
        <further-classification edition="200601120251208B">C07D498/22</further-classification>  
        <further-classification edition="200601120251208B">C07D487/18</further-classification>  
        <further-classification edition="200601120251208B">C07D491/22</further-classification>  
        <further-classification edition="200601120251208B">C07D515/22</further-classification>  
        <further-classification edition="200601120251208B">A61P31/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西班牙商瑪製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHARMA MAR, S.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丁　羅培茲　瑪麗亞　耶穌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTIN LOPEZ, MARIA JESUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅德里格斯　阿比斯　拉奎爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RODRIGUEZ ACEBES, RAQUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔拉松納　拉摩斯　吉列莫爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TARAZONA RAMOS, GUILLERMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇洽羅　聖塔瑪麗亞　荷賽　路易斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHICHARRO SANTAMARIA, JOSE LUIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於使用化合物&lt;b&gt;1&lt;/b&gt;作為起始物質製造海鞘素的改良方法。 &lt;br/&gt;&lt;img align="absmiddle" height="141px" width="167px" file="ed10069.JPG" alt="ed10069.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to improved processes for the manufacture of ecteinascidins that employ compound &lt;b&gt;1&lt;/b&gt; as starting material. &lt;br/&gt;&lt;img align="absmiddle" height="146px" width="168px" file="ed10070.JPG" alt="ed10070.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1608" publication-number="202611080"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611080.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611080</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128379</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種ＧＩＰＲ抗體融合蛋白質的藥用穩定溶液製劑及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">C07K16/28</main-classification>  
        <further-classification edition="200601120251208B">A61K39/395</further-classification>  
        <further-classification edition="200601120251208B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商鴻運華寧（杭州）生物醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GMAX BIOPHARM LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王葉飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YEFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊豐雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FENGYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>景　書謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JING, SHUQIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種GIPR抗體融合蛋白質之藥用穩定溶液製劑，其包含達到治療有效量之GIPR抗體融合蛋白質；醫藥學上可接受之pH緩衝劑1-500 mM，pH緩衝範圍為4.0-9.0；第一種醫藥學上可接受之保護劑1-500 mM；第二種醫藥學上可接受之保護劑1-500 mM，前述藥用穩定溶液製劑進一步包含一種或數種醫藥學上可接受之抗氧化劑1-500 mM；及一種或數種醫藥學上可接受之表面活性劑0.01%-10%（w/v）。此種GIPR抗體融合蛋白質之藥用穩定溶液製劑無需稀釋，可用於皮下注射給藥。本文還提供此種GIPR抗體融合蛋白質之藥用穩定溶液製劑在治療、預防或改善超重或肥胖症、二型糖尿病及非酒精性脂肪性肝病或非酒精性脂肪性肝炎等疾病或症狀中的應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1609" publication-number="202612154"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612154.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612154</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128389</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高效率微裝置</chinese-title>  
        <english-title>HIGH EFFICIENT MICRO DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">H01L23/535</main-classification>  
        <further-classification edition="202501120251215B">H10D30/60</further-classification>  
        <further-classification edition="202501120251215B">H10H20/812</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商弗瑞爾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VUEREAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查吉　格拉姆瑞札</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAJI, GHOLAMREZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法西　伊莎諾拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FATHI, EHSANOLLAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西柏尼　何賽恩　薩曼尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIBONI, HOSSEIN ZAMANI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種固態微裝置結構，其包括：形成於基板上之該微裝置；p及n摻雜層；至少該兩個摻雜層之間的活性層，同時墊經耦合至各摻雜層，其中該等摻雜層之該至少一者小於該活性層且處於該活性層之周長內；及該兩個耦合墊位於其中該摻雜層較小之相同側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a solid state micro device structure comprising: the microdevice formed on a substrate; p and n doped layers; active layers between at least the two doped layers while a pad is coupled to each doped layer, wherein the at least one of the doped layers is smaller than the active layer and within a perimeter of the active layer; and the two coupled pads are located on the same side where the doped layer is smaller.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微裝置</p>  
        <p type="p">102:基板</p>  
        <p type="p">104:緩衝層/黏合層</p>  
        <p type="p">106:活性層</p>  
        <p type="p">108:p摻雜層</p>  
        <p type="p">110:n摻雜層</p>  
        <p type="p">112:接觸層/接點</p>  
        <p type="p">114:接觸層/接點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1610" publication-number="202611344"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611344.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611344</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128391</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含原位纜線清潔器之拉錠器設備</chinese-title>  
        <english-title>INGOT PULLER APPARATUS INCLUDING IN-SITU CABLE CLEANER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C30B15/32</main-classification>  
        <further-classification edition="200601120251211B">C30B15/10</further-classification>  
        <further-classification edition="200601120251211B">B08B9/032</further-classification>  
        <further-classification edition="200601120251211B">B08B3/02</further-classification>  
        <further-classification edition="200601120251211B">C30B15/30</further-classification>  
        <further-classification edition="200601120251211B">C30B15/20</further-classification>  
        <further-classification edition="200601120251211B">C30B29/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　雨樵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YU-CHIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾奧夫　斯姆士　迪恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EOFF, JAMES DEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路特　威廉　里恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUTER, WILLIAM LYNN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種拉錠器設備，其包含：一坩堝總成，其用於固持一矽熔體；一拉晶器外殼，其界定一生長腔室，該坩堝總成安置於該生長腔室內；一提拉機構，其包含一晶種纜線；及一清潔工具，其用於清潔該晶種纜線。該清潔工具包含：一主體，其界定延伸穿過該主體用於接納該晶種纜線之一槽；一噴嘴，其連接至該主體用於將一加壓流體引導至該晶種纜線處；及一排放導管，其連接至該主體用於排出自該噴嘴排放之流體。該主體附接至該拉晶器外殼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An ingot puller apparatus includes a crucible assembly for holding a silicon melt, a crystal puller housing that defines a growth chamber, the crucible assembly being disposed within the growth chamber, a pulling mechanism including a seed cable, and a cleaning tool for cleaning the seed cable. The cleaning tool includes a main body defining a slot that extends through the main body for receiving the seed cable, a nozzle connected to the main body for directing a pressurized fluid at the seed cable, and a discharge conduit connected to the main body for evacuating fluid discharged from the nozzle. The main body is attached to the crystal puller housing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:拉錠器設備</p>  
        <p type="p">210:提拉腔室</p>  
        <p type="p">224:晶種纜線</p>  
        <p type="p">231:方向箭頭/氣流</p>  
        <p type="p">232:提拉機構/提拉頭</p>  
        <p type="p">234:阻尼器</p>  
        <p type="p">300:清潔工具/晶種清潔器工具</p>  
        <p type="p">302:中心槽</p>  
        <p type="p">306:供應噴嘴/第一噴嘴</p>  
        <p type="p">310:流體源</p>  
        <p type="p">312:供應管</p>  
        <p type="p">316:排放導管</p>  
        <p type="p">320:可選擇性控制閥</p>  
        <p type="p">322:排放管</p>  
        <p type="p">324:管配接器</p>  
        <p type="p">326:真空產生器</p>  
        <p type="p">340:主體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1611" publication-number="202610922"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610922.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610922</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128420</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可收合軸心之系統及方法</chinese-title>  
        <english-title>COLLAPSIBLE CORE SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">B65H19/00</main-classification>  
        <further-classification edition="200601120251212B">B25B27/00</further-classification>  
        <further-classification edition="200601120251212B">B41J2/315</further-classification>  
        <further-classification edition="200601120251212B">B41J31/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伯蘭帝全球股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRADY WORLDWIDE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞尼斯　克夏漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANISH, KRISHNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大衛　當恩　瑞德里茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVID, DON RODRIGUEZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　玫恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOO, MUI HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　一昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAP, EE SIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯格　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUGER, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡賽洛　蕾貝卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VANSELOW, REBECCA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於促進移除一列印機中之用過之色帶材料之心軸。該心軸包含可移動地附接至該列印機之一轉軸及定位於該轉軸上以供收集該用過之色帶材料之一心軸臂。該心軸臂具有一第一側及與該第一側對置之一第二側。該心軸包含一滑動件，其安置於該轉軸與該心軸臂之間且經構形用於沿該轉軸在一第一位置與一第二位置之間的雙向移動。該心軸亦包含連接至該滑動件之一第一擦拭器。一按鈕連接至該滑動件且可操作地接合該轉軸。接合該按鈕允許該滑動件沿該轉軸自該第一位置移動至該第二位置，藉此引起該第一擦拭器朝向該心軸臂之一端移動該用過之色帶材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A spindle for facilitating removal of used ribbon material in a printer is disclosed. The spindle includes a shaft movably attached to the printer and a spindle arm positioned on the shaft for collecting the used ribbon material. The spindle arm has a first side and a second side opposite the first side. The spindle includes a slider disposed between the shaft and the spindle arm and configured for bidirectional movement along the shaft between a first position and a second position. The spindle also includes a first wiper connected to the slider. A button is connected to the slider and operably engaging the shaft. Engaging the button permits movement of the slider along the shaft from the first position to the second position thereby causing the first wiper to move the used ribbon material toward an end of the spindle arm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:可收合軸心總成</p>  
        <p type="p">202:可收合外軸心</p>  
        <p type="p">204:外軸心本體</p>  
        <p type="p">206:外軸心第一端</p>  
        <p type="p">208:外軸心第二端</p>  
        <p type="p">210:上部</p>  
        <p type="p">212:下部</p>  
        <p type="p">214:端壁</p>  
        <p type="p">216:心軸臂</p>  
        <p type="p">218:外軸心通道</p>  
        <p type="p">220a:擦拭器</p>  
        <p type="p">220b:擦拭器</p>  
        <p type="p">222:中心轉軸</p>  
        <p type="p">224:帽</p>  
        <p type="p">228:按鈕</p>  
        <p type="p">338:保持構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1612" publication-number="202610848"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610848.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610848</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128421</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>色帶匣自動對中系統及方法</chinese-title>  
        <english-title>RIBBON CARTRIDGE AUTOMATIC CENTERING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">B41J35/28</main-classification>  
        <further-classification edition="200601120251212B">B65H19/30</further-classification>  
        <further-classification edition="200601120251212B">B41J2/315</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伯蘭帝全球股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRADY WORLDWIDE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大衛　當恩　瑞德里茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVID, DON RODRIGUEZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧多納　亞倫　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORDONA, AARON P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　玫恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOO, MUI HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於在一印表機中安裝色帶材料之系統。該系統包含以一心軸臂之形式提供之一心軸及與該心軸臂相關聯之一鍵。該系統亦包含具有經配置以與該心軸臂之該鍵對準之一鍵槽之一色帶匣及包含色帶材料之一供應源之一色帶卷。該鍵與該鍵槽之間的接合將該色帶匣以一正確定向定位於該心軸臂上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is directed to a system for installing ribbon material in a printer. The system includes a spindle provided in the form of a spindle arm and a key associated with the spindle arm. The system also includes a ribbon cartridge having a keyway arranged to align with the key of the spindle arm and a ribbon roll including a supply of ribbon material. Engagement between the key and the keyway positions the ribbon cartridge on the spindle arm in a correct orientation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:心軸</p>  
        <p type="p">202:軸</p>  
        <p type="p">204:襯套</p>  
        <p type="p">208:附接端</p>  
        <p type="p">212:凹口部分</p>  
        <p type="p">226:心軸臂</p>  
        <p type="p">228:心軸凸緣</p>  
        <p type="p">230:第一/上襯套部分</p>  
        <p type="p">232:第二/下襯套部分</p>  
        <p type="p">234:心軸配合面</p>  
        <p type="p">236:鍵</p>  
        <p type="p">238:接觸窗</p>  
        <p type="p">240:標記</p>  
        <p type="p">256:輸入觸點</p>  
        <p type="p">257:輸入觸點突片</p>  
        <p type="p">258:下襯套部分底側</p>  
        <p type="p">260:附接區</p>  
        <p type="p">262:葉片彈簧</p>  
        <p type="p">274:端面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1613" publication-number="202610847"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610847.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610847</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128422</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>印表機色帶定向系統及方法</chinese-title>  
        <english-title>PRINTER RIBBON ORIENTATION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">B41J33/14</main-classification>  
        <further-classification edition="200601120251204B">B41J25/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伯蘭帝全球股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRADY WORLDWIDE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧多納　亞倫　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORDONA, AARON P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　玫恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOO, MUI HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於防止將色帶材料不正確地安裝於一印表機中之系統。該系統包含可在一第一方向或一第二方向上旋轉之一心軸。該心軸能夠支撐一批色帶材料以用於與該心軸一起旋轉。該系統亦包含與該心軸相關聯之一觸發器。該觸發器與該心軸一起在該第一方向或該第二方向上旋轉。該系統進一步包含與該心軸鄰近且經組態以經由該觸發器偵測該心軸是否在該第一方向或該第二方向上旋轉之一致動器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is directed to a system for preventing incorrect installation of ribbon material in a printer. The system includes a spindle rotatable in a first direction or a second direction. The spindle is capable of supporting a supply of ribbon material for rotation with the spindle. The system also includes a trigger associated with the spindle. The trigger rotates with the spindle in the first direction or the second direction. The system further includes an actuator adjacent the spindle and configured to detect whether the spindle is rotating in the first direction or the second direction via the trigger.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">158:實質上圓柱形軸件</p>  
        <p type="p">162:軸件凹口部分</p>  
        <p type="p">184:安裝壁內表面</p>  
        <p type="p">188:色帶供應區</p>  
        <p type="p">194:心軸套環</p>  
        <p type="p">198:心軸套環第二端</p>  
        <p type="p">202a:第一致動器安裝部件</p>  
        <p type="p">202b:第二致動器安裝部件</p>  
        <p type="p">204:硬止擋</p>  
        <p type="p">210:致動器安裝體</p>  
        <p type="p">212:第一衝擊表面</p>  
        <p type="p">214:第二衝擊表面</p>  
        <p type="p">240:色帶定向系統</p>  
        <p type="p">242:致動器</p>  
        <p type="p">244:觸發器</p>  
        <p type="p">246:連接環</p>  
        <p type="p">288:斷續器</p>  
        <p type="p">292:第一斷續器端壁</p>  
        <p type="p">294:第二斷續器端壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1614" publication-number="202610845"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610845.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610845</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128423</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>列印頭開啟系統及方法</chinese-title>  
        <english-title>PRINTHEAD OPENING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">B41J2/32</main-classification>  
        <further-classification edition="200601120251204B">B41J23/10</further-classification>  
        <further-classification edition="200601120251204B">B41J29/58</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伯蘭帝全球股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRADY WORLDWIDE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大衛　當恩　瑞德里茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVID, DON RODRIGUEZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　玫恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOO, MUI HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係針對一種用於一列印機中之列印頭總成。該列印頭總成包含連接至一列印頭固持器之一列印頭。該列印頭可移動於一降低位置與一提升位置之間。該列印頭總成亦包含一槓桿子總成。該槓桿子總成包含：一槓桿軸(lever shaft)；一鎖定機構，其經構形以在接合該鎖定機構時使該列印頭總成維持一關閉位置；及一槓桿凸輪，其連接至該槓桿軸且定位成相鄰於該列印頭固持器之一部分。該槓桿凸輪藉由接合該列印頭固持器使該列印頭自該降低位置移動至該提升位置。當使該列印頭總成自該關閉位置移動至一開啟位置時，該列印頭在脫離該鎖定機構之前移動至該提升位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is directed to a printhead assembly for use in a printer. The printhead assembly includes a printhead connected to a printhead holder. The printhead is movable between a lowered position and a lifted position. The printhead assembly also includes a lever subassembly. The lever subassembly includes a lever shaft, a locking mechanism configured to maintain the printhead assembly in a closed position when the locking mechanism is engaged, and a lever cam connected to the lever shaft and positioned adjacent to a portion of the printhead holder. The lever cam moves the printhead from the lowered position to the lifted position by engaging the printhead holder. The printhead is moved to the lifted position prior to disengaging the locking mechanism when moving the printhead assembly from the closed position to an open position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140:壓平滾筒</p>  
        <p type="p">202:列印頭模組</p>  
        <p type="p">280:對接板</p>  
        <p type="p">282:列印頭固持器</p>  
        <p type="p">284a:第一彈簧</p>  
        <p type="p">284b:第二彈簧</p>  
        <p type="p">286:推板</p>  
        <p type="p">288:力凸輪</p>  
        <p type="p">290:凸輪軸</p>  
        <p type="p">296:凸緣部件</p>  
        <p type="p">354:托盤部件</p>  
        <p type="p">358:槓桿軸開口</p>  
        <p type="p">366:槓桿衝擊表面</p>  
        <p type="p">372:凸緣衝擊表面</p>  
        <p type="p">374:凸輪軸開口</p>  
        <p type="p">430:連結軸</p>  
        <p type="p">630:槓桿軸</p>  
        <p type="p">756a:第一槓桿凸輪</p>  
        <p type="p">756b:第二槓桿凸輪</p>  
        <p type="p">770:槓桿凸輪空閒段</p>  
        <p type="p">772:槓桿凸輪現用段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1615" publication-number="202610846"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610846.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610846</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128424</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>列印頭力調整與升降系統及方法</chinese-title>  
        <english-title>PRINTHEAD FORCE ADJUST AND LIFT SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">B41J25/312</main-classification>  
        <further-classification edition="200601120251212B">B41J29/38</further-classification>  
        <further-classification edition="200601120251212B">B41J2/235</further-classification>  
        <further-classification edition="200601120251212B">B41J2/315</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伯蘭帝全球股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRADY WORLDWIDE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大衛　當恩　瑞德里茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVID, DON RODRIGUEZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　玫恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOO, MUI HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係針對一種用於一列印機中之列印頭總成。該列印頭總成包含經定位以接合該列印機之一壓平滾筒之一列印頭及保持該列印頭之一列印頭固持器。該列印頭總成亦包含經設計以旋轉至一無效位置及一或多個有效位置中之一凸輪軸(cam shaft)及連接至該凸輪軸且經定位以將一可變向下力施加至該列印頭之一力凸輪。該列印頭總成進一步包含連接至該凸輪軸且經定位以接合該列印頭固持器之升降凸輪。該力凸輪引起該列印頭在該凸輪軸處於該等有效位置之任何者中時將一夾力施加至該壓平滾筒。當該凸輪軸處於該無效位置中時，該等升降凸輪接合該列印頭固持器且使該列印頭移動至脫離該壓平滾筒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is directed to a printhead assembly for use in a printer. The printhead assembly includes a printhead positioned to engage a platen roller of the printer and a printhead holder retaining the printhead. The printhead assembly also includes a cam shaft designed to rotate into an idle position and one or more active positions and a force cam connected to the cam shaft and positioned to apply a variable downward force to the printhead. The printhead assembly further includes lift cams connected to the cam shaft and positioned to engage the printhead holder. The force cam causes the printhead to apply a nip force to the platen roller when the cam shaft is in any of the active positions. The lift cams engage the printhead holder and move the printhead out of engagement with the platen roller when the cam shaft is in the idle position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">138:列印頭</p>  
        <p type="p">140:壓平滾筒</p>  
        <p type="p">202:列印頭模組</p>  
        <p type="p">280:對接板</p>  
        <p type="p">282:列印頭固持器</p>  
        <p type="p">284a:第一彈簧</p>  
        <p type="p">284b:第二彈簧</p>  
        <p type="p">286:推板</p>  
        <p type="p">288:力凸輪</p>  
        <p type="p">290:凸輪軸</p>  
        <p type="p">292:凸輪調整齒輪</p>  
        <p type="p">294a:第一升降凸輪</p>  
        <p type="p">294b:第二升降凸輪</p>  
        <p type="p">296:凸緣部件</p>  
        <p type="p">356:第一連結軸開口</p>  
        <p type="p">358:槓桿軸開口</p>  
        <p type="p">364:矩形開槽</p>  
        <p type="p">372:凸緣衝擊表面</p>  
        <p type="p">374:凸輪軸開口</p>  
        <p type="p">416:上擱板</p>  
        <p type="p">418:下擱板</p>  
        <p type="p">558:感測器旗標</p>  
        <p type="p">A:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1616" publication-number="202612009"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612009.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612009</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128429</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用乙二胺對半導體基板進行精細拋光之方法</chinese-title>  
        <english-title>METHODS FOR FINISH POLISHING SEMICONDUCTOR SUBSTRATES WITH ETHYLENEDIAMINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/304</main-classification>  
        <further-classification edition="200601120251201B">C09K3/14</further-classification>  
        <further-classification edition="200601120251201B">C09G1/02</further-classification>  
        <further-classification edition="201201120251201B">B24B37/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許致遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李孟鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MENG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示用於在精細拋光序列期間減少缺陷之方法。在存在一拋光漿料之情況下使結構之前表面與一拋光墊接觸。該拋光漿料包含膠體二氧化矽、氫氧化物及乙二胺。該拋光漿料中之乙二胺濃度可小於0.4 wt%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for reducing defects during finish polishing sequences. The front surface of the structure is contacted with a polishing pad in the presence of a polishing slurry. The polishing slurry includes colloidal silica, a hydroxide, and ethylenediamine. The concentration of ethylenediamine in the polishing slurry may be less than 0.4 wt%.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:拋光方法/方法</p>  
        <p type="p">110:第一拋光步驟</p>  
        <p type="p">120:第二拋光步驟/第二步驟</p>  
        <p type="p">130:第三拋光步驟/第三步驟</p>  
        <p type="p">140:第四拋光步驟/第四步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1617" publication-number="202610894"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610894.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610894</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128439</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑行水翼電動船裝置的系統與方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR A SKIM FOILING ELECTRIC-POWERED BOAT APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251211B">B63B1/24</main-classification>  
        <further-classification edition="200601120251211B">B63H21/17</further-classification>  
        <further-classification edition="200601120251211B">B63H25/42</further-classification>  
        <further-classification edition="200601120251211B">B63H25/02</further-classification>  
        <further-classification edition="200601120251211B">B63B39/06</further-classification>  
        <further-classification edition="202401120251211B">G05D1/20</further-classification>  
        <further-classification edition="201501120251211B">H02P101/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商恩夫高股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENVGO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔布　麥可Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIBOU, MICHAEL J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮斯古德　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEASGOOD, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滑行水翼電動船裝置的系統與方法。此電動休閒船或水上載具將利用「水翼滑航」，這是一種簡化的水翼方法，旨在使水翼技術之優點。該裝置由位於重心（CG）後方之主水翼組成，以產生俯衝力矩，以及與水接觸並淹沒在水下之左側和右側安裝在船尾板上之升降副翼。該裝置配置用於低速淺浸和高速淺浸。隨著速度增加，該裝置沿水面變平。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method of skim foiling electric-powered boat apparatus. This electric recreational boat or watercraft will utilize "skim foiling," a simplified hydrofoil approach designed to make the benefits of hydrofoil technology. The apparatus consists of a main foil behind a center of gravity (CG) to create a nose-down moment and a left-side and right-side mounted transom elevons that are in contact with and submerged underwater. The apparatus is configured for low-speed skimming and high-speed skimming. As speed increases, the apparatus flattens along the surface of the water.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:水上載具</p>  
        <p type="p">110:船體</p>  
        <p type="p">115:CG</p>  
        <p type="p">120:推進單元</p>  
        <p type="p">130:主水翼</p>  
        <p type="p">132:支柱</p>  
        <p type="p">140R:控制面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1618" publication-number="202610731"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610731.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610731</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128449</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>能夠節省清潔紙的網版印刷機之刮刷清潔器以及利用該刮刷清潔器之光罩清潔方法</chinese-title>  
        <english-title>SQUEEGEE CLEANER FOR SCREEN PRINTING MACHINE CAPABLE OF SAVING CLEANING PAPER AND MASK CLEANING METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251211B">B08B1/30</main-classification>  
        <further-classification edition="202401120251211B">B08B1/16</further-classification>  
        <further-classification edition="200601120251211B">B08B3/02</further-classification>  
        <further-classification edition="200601120251211B">B41F35/00</further-classification>  
        <further-classification edition="200601120251211B">B08B13/00</further-classification>  
        <further-classification edition="200601120251211B">H05K3/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商源潭科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高亨來</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, HYUNG RAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明哲弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MYUNG, CHEOL HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭明</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奕軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種能夠節省清潔紙的網版印刷機之刮刷清潔器以及利用該刮刷清潔器之光罩清潔方法，係關於如下能夠節省清潔紙的網版印刷機之刮刷清潔器以及利用該刮刷清潔器之光罩清潔方法：能夠減少清潔所需的清潔紙的使用量，能夠藉由一個清潔紙卷增加使用次數而增加更換周期，由此能夠減少一天的更換次數而能夠減少成本，藉由減少使用量而能夠最大限度減少廢棄物的產生，由此能夠防止環境污染，並且更換周期增加而能夠減少工作人員的工作負擔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a squeegee cleaner for a screen printing machine capable of saving cleaning paper and a mask cleaning method using the squeegee cleaner, and relates to such a squeegee cleaner for a screen printing machine capable of saving cleaning paper and such a mask cleaning method using the squeegee cleaner that can reduce the usage amount of cleaning paper required for cleaning and can extend a replacement cycle by allowing one roll of cleaning paper to be used more times, thereby lowering costs by reducing the number of daily replacements, can maximize the reduction in waste generation by reducing the usage amount, thus contributing to the prevention of environmental pollution, and can alleviate the workload of workers by extending the replacement cycle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基座</p>  
        <p type="p">200:紙控制機構</p>  
        <p type="p">210:支撐輥</p>  
        <p type="p">220:接收輥</p>  
        <p type="p">230:正向旋轉調節馬達</p>  
        <p type="p">240:反向旋轉調節馬達</p>  
        <p type="p">300:刮刷清潔機構</p>  
        <p type="p">310:刮片</p>  
        <p type="p">320:刮板</p>  
        <p type="p">330:頂部真空殼體</p>  
        <p type="p">332:刮刷結合部</p>  
        <p type="p">334:真空孔</p>  
        <p type="p">340:底部真空殼體</p>  
        <p type="p">370:導向輥</p>  
        <p type="p">400:清潔液噴射機構</p>  
        <p type="p">500:計數機構</p>  
        <p type="p">510:導向齒輪輥</p>  
        <p type="p">520:軸塊</p>  
        <p type="p">530:計數旋轉構件</p>  
        <p type="p">540:計數感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1619" publication-number="202610628"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610628.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610628</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128459</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磺醯胺化合物及其在醫藥上的應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/4965</main-classification>  
        <further-classification edition="200601120251201B">A61K31/433</further-classification>  
        <further-classification edition="200601120251201B">A61K31/416</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4155</further-classification>  
        <further-classification edition="200601120251201B">A61K31/145</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商海思科醫藥集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAISCO PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王健民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIANMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢國飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, GUOFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泉龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, QUANLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴龐科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, PANGKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磺醯胺化合物及其在醫藥上的應用，具體涉及一種通式(II)所述的化合物或消旋體、立體異構體、互變異構體、藥學上可接受的鹽，及其中間體和製備方法，以及在製備治療實體瘤的藥物中的應用。 &lt;br/&gt;&lt;img align="absmiddle" height="120px" width="203px" file="ed11716.JPG" alt="ed11716.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; </p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1620" publication-number="202610985"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610985.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610985</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128465</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非化學增幅型阻劑組成物之製造方法、及圖案形成方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING NON-CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C61/135</main-classification>  
        <further-classification edition="200601120251201B">C07C63/26</further-classification>  
        <further-classification edition="200601120251201B">C07C69/63</further-classification>  
        <further-classification edition="200601120251201B">C07D347/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/26</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草間理志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAMA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊地駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大山皓介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHYAMA, KOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西川諒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKAWA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供已將品質管理成標準化之非化學增幅型阻劑組成物之製造方法、及圖案形成方法。&lt;br/&gt; 該課題之解決手段為一種非化學增幅型阻劑組成物之製造方法，其特徵為按順序包含：&lt;br/&gt; 步驟(i)，於容器中放入羧酸化合物、超原子價碘化合物、及溶劑並進行混合，製備阻劑組成物原始型態，&lt;br/&gt; 步驟(ii)，收集一部分該阻劑組成物原始型態，並使用該收集來的阻劑組成物原始型態於試驗用基板上形成阻劑膜，再評價該阻劑膜之膜物性，及&lt;br/&gt; 步驟(iii)，基於該步驟(ii)之評價結果，為了獲得作為目的之膜物性而在該阻劑組成物原始型態中進一步添加追加材料並進行混合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a method for manufacturing a non-chemically amplified resist composition, including, in the following order, the steps of: (i) placing a carboxylic acid compound, a hypervalent iodine compound, and a solvent in a container and mixing together to prepare a fundamental resist composition; (ii) collecting part of the fundamental resist composition, forming a resist film on a test substrate by using the collected fundamental resist composition, and evaluating a film physical property of the resist film; and (iii) adding an additional material to the fundamental resist composition and mixing together to achieve a target film physical property based on an evaluation result of the step (ii). This can provide: a method for manufacturing a non-chemically amplified resist composition whose quality is controlled to be constant; and a patterning process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1621" publication-number="202611126"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611126.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611126</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128470</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>密封材用硬化性組成物及其製造方法、混合物、密封材及電子零件裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/14</main-classification>  
        <further-classification edition="200601120251201B">C08F232/08</further-classification>  
        <further-classification edition="200601120251201B">C08L25/18</further-classification>  
        <further-classification edition="200601120251201B">C08L61/06</further-classification>  
        <further-classification edition="200601120251201B">C08K5/3435</further-classification>  
        <further-classification edition="200601120251201B">C08K5/46</further-classification>  
        <further-classification edition="200601120251201B">C09K3/10</further-classification>  
        <further-classification edition="200601120251201B">H01L23/29</further-classification>  
        <further-classification edition="200601120251201B">H01L23/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長島和史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASHIMA, KAZUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山浦格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAURA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施形態是有關於一種含有具有乙烯基苯基的化合物以及包含TEMPO化合物的聚合抑制劑的密封材用硬化性組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1622" publication-number="202610852"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610852.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610852</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>纖維強化熱塑性樹脂製輪圈的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING FIBER-REINFORCED THERMOPLASTIC RESIN WHEEL RIM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">B60B5/00</main-classification>  
        <further-classification edition="200601120251212B">B29C70/08</further-classification>  
        <further-classification edition="200601120251212B">B29C70/18</further-classification>  
        <further-classification edition="200601120251212B">B29C70/68</further-classification>  
        <further-classification edition="200601120251212B">B29C43/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商拾壹國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELEVEN INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五十川幸宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISOGAWA, SACHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤沙織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITOU, SAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>板倉剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITAKURA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種纖維強化熱塑性樹脂製輪圈的製造方法，可在短時間內將輪框部分及盤面部分形為一體，製造出成形性佳的高強度樹脂製輪圈。本方法將纖維強化熱塑性樹脂所構成的素材以模具成形為樹脂製輪圈，模具的溫度係設定低於素材之樹脂基體的熔點。製造時準備塊狀素材及薄片狀素材做為前述素材，將其加熱至高於素材之樹脂基體的熔點的溫度。加熱後，將塊狀素材保持在模具內由盤面外表面模具及輪框外徑模具所包圍的位置，並將薄片狀素材保持在輪框外徑模具靠近衝孔模具的側面。接著使衝孔模具下降，使薄片狀素材外周部的缺口閉合成形而形成輪圈的輪框部分，一部分的薄片狀素材將推壓塊狀素材讓兩者接合，使塊狀素材壓縮成形而形成輪圈的盤面部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a method for manufacturing a fiber-reinforced thermoplastic resin wheel rim, which can form the rim part and the disk part into one piece in a short time, and manufacture a high-strength resin wheel rim with good formability. In this method, a material composed of a fiber-reinforced thermoplastic resin is molded into a resin wheel rim by a mold, and the temperature of the mold is set to be lower than the melting point of the resin of the material. During the manufacturing process, block materials and thin sheet materials are prepared as the aforementioned material, and they are heated to a temperature higher than the melting point of the resin of the material. The heated block materials are kept in a mold space surrounded by a disk surface mold and a rim outer-axial mold, and the thin sheet materials are kept at one side of the rim outer-axial mold close to a punching mold. Then, the punching mold is lowered to close the gaps between the outer peripheries of the thin sheet materials to form the rim part of the wheel rim, and a part of the thin sheet materials will push the block materials so as to allow the two to join, so that the block materials are compressed to form the disk part of the wheel rim.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:素材</p>  
        <p type="p">12:薄片狀素材</p>  
        <p type="p">13:塊狀素材</p>  
        <p type="p">13a:SMC</p>  
        <p type="p">18:保持環</p>  
        <p type="p">31:模具</p>  
        <p type="p">32:盤面外表面模具</p>  
        <p type="p">33:輪框外徑模具</p>  
        <p type="p">34:衝孔模具</p>  
        <p type="p">35:保持模具</p>  
        <p type="p">35a:定位孔</p>  
        <p type="p">36:軸部</p>  
        <p type="p">36a:嵌合部</p>  
        <p type="p">36b:段差部</p>  
        <p type="p">36c:大徑部</p>  
        <p type="p">36d:傾斜形狀部</p>  
        <p type="p">37:起伏形狀面</p>  
        <p type="p">38:支持面</p>  
        <p type="p">39:凹所</p>  
        <p type="p">41:凹凸形狀部</p>  
        <p type="p">42:角落曲面部</p>  
        <p type="p">43:嵌合凹部</p>  
        <p type="p">44:外周面</p>  
        <p type="p">46:環狀凹部</p>  
        <p type="p">47:突出部</p>  
        <p type="p">51、52:加熱裝置</p>  
        <p type="p">53:加熱器</p>  
        <p type="p">54:送入口</p>  
        <p type="p">55:輸出口</p>  
        <p type="p">56:保溫槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1623" publication-number="202611249"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611249.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611249</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接著劑組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C09J123/08</main-classification>  
        <further-classification edition="200601120251211B">C09J153/00</further-classification>  
        <further-classification edition="200601120251211B">C08F4/6592</further-classification>  
        <further-classification edition="200601120251211B">C09J125/08</further-classification>  
        <further-classification edition="201901120251211B">B32B7/06</further-classification>  
        <further-classification edition="200601120251211B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵜野和英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNO, KAZUHIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂井傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, SUGURU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山貴史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於將支持體與器件層貼合之接著劑組合物，該接著劑組合物能夠形成可抑制相對於外力之變形、並且可提高與器件層之密接性之接著層。本發明採用下述接著劑組合物，其係用於形成支持體12、第1接著層3A、第2接著層3B及器件層45依序積層而成之積層體100中之第2接著層者，該接著劑組合物含有具有第1嵌段與第2嵌段之嵌段共聚物，第1嵌段係由包含自可具有取代基之降莰烯衍生之結構單元(u1)之重複結構的聚合物所構成之嵌段，該接著劑組合物之260℃時之彈性模數顯示出20 MPa以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:支持基體</p>  
        <p type="p">2:分離層</p>  
        <p type="p">3A:第1接著層</p>  
        <p type="p">3B:第2接著層</p>  
        <p type="p">4:基板</p>  
        <p type="p">5:密封材料層</p>  
        <p type="p">12:支持體</p>  
        <p type="p">45:器件層</p>  
        <p type="p">100:積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1624" publication-number="202612408"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612408.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612408</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128527</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>錫膏管裝配裝置、包括其的印刷機及錫膏管的裝配方法</chinese-title>  
        <english-title>SOLDER PASTE TUBE ASSEMBLY DEVICE, PRINTING MACHINE COMPRISING SAME, AND SOLDER PASTE TUBE ASSEMBLY METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">H05K3/12</main-classification>  
        <further-classification edition="200601120251212B">B05C11/10</further-classification>  
        <further-classification edition="200601120251212B">B05C17/005</further-classification>  
        <further-classification edition="200601120251212B">G05B19/402</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊利諾工具工程公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程在在</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, ZAIZAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱虹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供了一種錫膏管裝配裝置、包括其的印刷機及錫膏管的裝配方法。錫膏管裝配裝置用於固定並密封錫膏管，其中所述錫膏管的底部具有噴嘴，所述錫膏管通過所述噴嘴提供錫膏，所述錫膏管裝配裝置包括支架、頂部密封裝置以及底部支撐裝置。所述頂部密封裝置被設置為可控地進行升降運動，以用於密封地連接在不同高度的所述錫膏管的頂部。本案的錫膏管裝配裝置通過能夠自動進行上升和下降運動的頂部密封裝置，能夠自動地完成錫膏管的拆卸與更換，並且能夠自動更換不同高度的錫膏管。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a solder paste tube assembly device, a printing machine comprising same and a solder paste tube assembly method. The solder paste tube assembly device is used for securing and sealing a solder paste tube, in which a nozzle is arranged at the bottom of the solder paste tube, and the solder paste tube provides a solder paste by means of the nozzle, the solder paste tube assembly device comprises a support, a top sealing device and a bottom support device, the top sealing device is configured to controllably ascend and descend for connecting to the top of the solder paste tube at different heights in a sealing manner. The solder paste tube assembly device of the present disclosure can automatically complete the disassembly and replacement of the solder paste tubes and can automatically replace the solder paste tubes of different heights by means of the top sealing device capable of automatically ascending and descending.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:印刷頭</p>  
        <p type="p">113:z方向移動機構</p>  
        <p type="p">118:錫膏裝配裝置</p>  
        <p type="p">120:錫膏管</p>  
        <p type="p">201:支架</p>  
        <p type="p">221:噴嘴</p>  
        <p type="p">230:頂部密封裝置</p>  
        <p type="p">231:密封元件</p>  
        <p type="p">233:導氣管</p>  
        <p type="p">240:底部支撐裝置</p>  
        <p type="p">241:支撐座</p>  
        <p type="p">251:氣缸滑塊</p>  
        <p type="p">252:導桿</p>  
        <p type="p">255:限位件</p>  
        <p type="p">261:氣缸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1625" publication-number="202610669"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610669.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610669</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128530</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可觸發基因沉默的核糖核酸化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">A61K31/7088</main-classification>  
        <further-classification edition="201001120251208B">C12N15/113</further-classification>  
        <further-classification edition="200601120251208B">A61K48/00</further-classification>  
        <further-classification edition="200601120251208B">A61P35/00</further-classification>  
        <further-classification edition="200601120251208B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商倍臻生物技術（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BISIRNA THERAPEUTICS (SUZHOU) CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸劍宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JIANYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀輝君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, HUIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, NA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒　曉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, XIAOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃雅君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案揭示了一類可觸發基因靜默的核糖核酸化合物，具體揭示了如式(I)所示結構的核糖核酸化合物、其綴合體及其應用。 &lt;br/&gt;&lt;img align="absmiddle" height="78px" width="118px" file="ed10190.JPG" alt="ed10190.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1626" publication-number="202612526"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612526.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612526</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128531</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路及其製造方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251204B">H10D64/20</main-classification>  
        <further-classification edition="202501120251204B">H10D64/27</further-classification>  
        <further-classification edition="202501120251204B">H10D89/10</further-classification>  
        <further-classification edition="200601120251204B">H01L21/301</further-classification>  
        <further-classification edition="200601120251204B">H01L23/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴志䛵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JISOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李正韓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNGHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金柄成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BYUNGSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴世韓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SAEHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千寬永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUN, KWANYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路包括在第一水平方向延伸的第一列單元，第一列單元包括：外壁單元，包括第一圖案隔離壁、第一主動圖案、以及第一閘極電極，其中第一圖案隔離壁在第一水平方向沿著外壁單元的邊界延伸，並在垂直於第一水平方向的第二水平方向上與第一主動圖案和第一閘極電極相鄰；以及內壁單元，包括第二圖案隔離壁、第二主動圖案、以及第二閘極電極，其中第二圖案隔離壁在內壁單元內部在第一水平方向延伸，並在第二水平方向上與第二主動圖案和第二閘極電極相鄰。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit includes a first row of cells extending in a first horizontal direction, the first row of cells including: an out-wall cell including a first pattern isolation wall, first active patterns, and a first gate electrode, wherein the first pattern isolation wall extends in the first horizontal direction along a boundary of the out-wall cell, and is adjacent, in a second horizontal direction perpendicular to the first horizontal direction, to the first active patterns and the first gate electrode; and an in-wall cell including a second pattern isolation wall, second active patterns, and a second gate electrode, wherein the second pattern isolation wall extends, inside the in-wall cell, in the first horizontal direction, and is adjacent, in the second horizontal direction, to the second active patterns and the second gate electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積體電路</p>  
        <p type="p">FC:填充單元</p>  
        <p type="p">FCA:填充單元區域</p>  
        <p type="p">IWA:內壁區域</p>  
        <p type="p">IWC:內壁單元</p>  
        <p type="p">OWA:外壁區域</p>  
        <p type="p">OWC:外壁單元</p>  
        <p type="p">R1:第一列</p>  
        <p type="p">R2:第二列</p>  
        <p type="p">R3:第三列</p>  
        <p type="p">R4:第四列</p>  
        <p type="p">X:軸</p>  
        <p type="p">Y:軸</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1627" publication-number="202610884"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610884.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610884</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128532</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>徑向插入式行程可調節型升降座桿組件</chinese-title>  
        <english-title>RADIAL INSERT TRAVEL ADJUSTABLE DROPPER SEATPOST ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">B62J1/08</main-classification>  
        <further-classification edition="200601120251210B">B62J1/06</further-classification>  
        <further-classification edition="200601120251210B">B62K19/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商福克斯制造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOX FACTORY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧特尼斯　克里斯托弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTTERNESS, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科普倫　喬舒亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COAPLEN, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波洛克　托馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLLOCK, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種徑向插入式行程可調節型升降座桿組件。該組件包括下柱，該下柱包括穿過其中的行程調節開口。上柱構造成相對於下柱交互地操作，上柱包括行程調節接合部。至少一個徑向行程調節插入件從下柱的外部安裝並且安裝在行程調節開口內，至少一個徑向行程調節與上柱的行程調節接合部相互作用，以減少上柱相對於下柱的交交互操作的行程距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A radial insert travel adjustable dropper seatpost assembly is disclosed. The assembly includes a lower post comprising a travel adjustment opening therethrough. An upper post configured to interactively operate with respect to the lower post, the upper post comprising a travel adjust interface. At least one radial travel adjust insert installed from an exterior of the lower post and within the travel adjustment opening, the at least one radial travel adjust to interact with the travel adjust interface of the upper post to reduce a travel distance of the interactive operation of the upper post with respect to the lower post.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">25:座桿夾持件</p>  
        <p type="p">500:徑向插入式行程可調節型升降座桿</p>  
        <p type="p">501:上密封件保持器</p>  
        <p type="p">510:上柱</p>  
        <p type="p">515:下柱</p>  
        <p type="p">525:行程調節開口</p>  
        <p type="p">530:徑向行程調節插入件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1628" publication-number="202612221"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612221.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612221</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128539</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>定子鐵芯、旋轉電機及加壓治具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02K1/20</main-classification>  
        <further-classification edition="200601120251201B">H02K1/18</further-classification>  
        <further-classification edition="202501120251201B">H02K15/0273</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本製鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上川畑正仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIKAWABATA, MASAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種定子鐵芯，其特徵在於：前述定子鐵芯(30)具備積層之複數個電磁鋼板(40)；及接著部(100)，分別配置在於積層方向上相鄰之前述電磁鋼板(40)彼此之間，前述電磁鋼板(40)分別包含：環狀的芯背(41)；複數個齒部(42)，在圓周方向上隔著間隔從前述芯背(41)朝徑方向突出；及連結部(43)，連結相鄰之前述齒部(42)的前端部彼此，前述接著部(100)包含第1接著部(110)，前述第1接著部(110)包圍前述複數個電磁鋼板(40)的藉由前述芯背(41)、前述相鄰之齒部(42)以及前述連結部(43)所形成之空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:旋轉電機</p>  
        <p type="p">10:定子</p>  
        <p type="p">20:轉子</p>  
        <p type="p">20e:元件</p>  
        <p type="p">30:定子鐵芯</p>  
        <p type="p">40:電磁鋼板</p>  
        <p type="p">41:芯背</p>  
        <p type="p">41e:外緣</p>  
        <p type="p">41i:內緣</p>  
        <p type="p">42:齒部</p>  
        <p type="p">43:連結部</p>  
        <p type="p">44:槽</p>  
        <p type="p">100:接著部</p>  
        <p type="p">110:第1接著部</p>  
        <p type="p">120:第2接著部</p>  
        <p type="p">C:中心軸</p>  
        <p type="p">D:徑方向</p>  
        <p type="p">R:圓周方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1629" publication-number="202612398"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612398.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612398</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128571</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>撓性多層電路基板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251124B">H05K1/02</main-classification>  
        <further-classification edition="200601120251124B">H05K1/11</further-classification>  
        <further-classification edition="200601120251124B">H05K3/10</further-classification>  
        <further-classification edition="200601120251124B">H05K3/32</further-classification>  
        <further-classification edition="200601120251124B">H05K3/46</further-classification>  
        <further-classification edition="202301120251124B">H10K77/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今泉卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAIZUMI, TAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種撓性多層電路基板，具備絕緣層、第1層、第2層及配線部，前述第1層配置於前述絕緣層之厚度方向一側，前述第2層配置於前述絕緣層之厚度方向另一側，且&lt;br/&gt; 前述第1層具有將複數個第1導體墊呈圖案狀配置而成之第1接地導體部、及第1電磁波屏蔽層，&lt;br/&gt; 前述第2層具有將複數個第2導體墊呈圖案狀配置而成之第2接地導體部，&lt;br/&gt; 前述複數個第1導體墊埋設於前述第1電磁波屏蔽層，&lt;br/&gt; 於將前述第1接地導體部及前述第2接地導體部投影至與前述厚度方向正交之平面時，前述第1接地導體部與前述第2接地導體部之圖案重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絕緣層</p>  
        <p type="p">1a:第1樹脂層</p>  
        <p type="p">1b:接著層</p>  
        <p type="p">1c:第2樹脂層</p>  
        <p type="p">2:第1層</p>  
        <p type="p">2a:第1導體墊</p>  
        <p type="p">2b:第1電磁波屏蔽層</p>  
        <p type="p">3:第2層</p>  
        <p type="p">3a:第2導體墊</p>  
        <p type="p">3b:第2電磁波屏蔽層</p>  
        <p type="p">4:配線部</p>  
        <p type="p">5:導體通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1630" publication-number="202612572"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612572.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612572</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128577</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250915B">H10K59/80</main-classification>  
        <further-classification edition="202301120250915B">H10K59/82</further-classification>  
        <further-classification edition="201601120250915B">G09G3/3208</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔惠珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, HYEJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋泰俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, TAEJOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包括：基板，包含顯示區域及圍繞顯示區域的非顯示區域；晶片焊墊區域，設置於基板的非顯示區域上，其中複數個晶片焊墊設置於晶片焊墊區域中，並佈置為複數個列，以構成複數個焊墊列；驅動電路晶片，安裝於晶片焊墊區域上；以及至少一個壓力分散結構，與驅動電路晶片垂直地重疊，並設置為相鄰於該複數個焊墊列中的每一個。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a substrate including a display area and a non-display area around the display area; a chip pad area disposed on the non-display area of the substrate, wherein a plurality of chip pads are disposed in the chip pad area and are arranged in a plurality of rows to constitute a plurality of pad rows; a driving circuit chip mounted on the chip pad area; and at least one pressure distribution structure vertically overlapping the driving circuit chip and disposed adjacent to each of the plurality of pad rows.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">AA:顯示區域</p>  
        <p type="p">CIC:控制電路晶片</p>  
        <p type="p">CPA:晶片焊墊區域</p>  
        <p type="p">CPD:晶片焊墊</p>  
        <p type="p">CPD1:輸出焊墊</p>  
        <p type="p">CPD2:輸入焊墊</p>  
        <p type="p">DIC:驅動電路晶片</p>  
        <p type="p">DP:顯示面板</p>  
        <p type="p">DR1:第一方向</p>  
        <p type="p">DR2:第二方向</p>  
        <p type="p">DR3:第三方向</p>  
        <p type="p">NAA:非顯示區域</p>  
        <p type="p">PCB:印刷電路板</p>  
        <p type="p">PD:焊墊</p>  
        <p type="p">PDS:壓力分散結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1631" publication-number="202612576"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612576.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612576</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128587</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可撓性聲學感測器系統及其製造</chinese-title>  
        <english-title>FLEXIBLE ACOUSTIC SENSOR SYSTEMS AND FABRICATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H10N30/071</main-classification>  
        <further-classification edition="202301120251201B">H10N39/00</further-classification>  
        <further-classification edition="202501120251201B">H10D86/60</further-classification>  
        <further-classification edition="200601120251201B">G01H11/08</further-classification>  
        <further-classification edition="202201120251201B">G06V40/13</further-classification>  
        <further-classification edition="200601120251201B">H05K3/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　在　亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JAE HYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王宏仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUNG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁偉翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, WEI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施卓勒曼　潔西卡　劉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STROHMANN, JESSICA LIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詳淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIANG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班差瓦加　赫瑞什科士　維加伊庫瑪爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANCHAWAGH, HRISHIKESH VIJAYKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示可撓性聲學感測器系統的製造及處理以及與該等可撓性聲學感測器系統相關聯的感測器堆疊的各種組態。在一些實施例中，一種用於製造一可撓性聲學感測設備的方法可包括：在一玻璃晶圓上獲得一材料堆疊，該材料堆疊包括：具有一可撓性基材的一薄膜電晶體(TFT)組件；該TFT組件上的一壓電組件，該壓電組件經組態以回應於接收到一聲學信號，而向具有該TFT組件上的相關聯電路系統的一或多個接收器元件提供一電信號；及該壓電組件上的一電極組件，該電極組件包括一或多個聲學傳輸器元件，該一或多個聲學傳輸器元件經組態以傳輸一或多個聲學信號；執行一雷射剝離(LLO)程序以將該材料堆疊與該玻璃晶圓分開；及利用一顯示組件來實施該材料堆疊的至少一部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Fabrication and processing of flexible acoustic sensor systems and various configurations of sensor stacks associated therewith are disclosed. In some embodiments, a method for fabrication of a flexible acoustic sensing apparatus may include: obtaining a stack of materials on a glass wafer, the stack of materials including: a thin-film transistor (TFT) component having a flexible substrate; a piezoelectric component on the TFT component, the piezoelectric component configured to, responsive to receipt of an acoustic signal, provide an electrical signal to one or more receiver elements having associated circuitry on the TFT component; and an electrode component on the piezoelectric component, the electrode component including one or more acoustic transmitter elements configured to transmit one or more acoustic signals; performing a laser liftoff (LLO) process to separate the stack of materials from the glass wafer; and implementing at least a portion of the stack of materials with a display component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1300:方法</p>  
        <p type="p">1310,1320,1325,1330:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1632" publication-number="202611610"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611610.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611610</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128594</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可提高亮度的背光模組</chinese-title>  
        <english-title>BACKLIGHT MODULE CAPABLE OF ENHANCING BRIGHTNESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250818B">G02F1/13357</main-classification>  
        <further-classification edition="200601120250818B">G02B5/30</further-classification>  
        <further-classification edition="201501120250818B">G02B1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穎台科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTIRE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張裕偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚佳吟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, CHIA YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾仁鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, JEN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種可提高亮度的背光模組，可搭配液晶顯示器使用。該背光模組包括了能將LED發出的光適當地配光的二次光學透鏡、以及具獨特光擴散效果的擴散板。本發明的背光模組，不僅在LED上設置折反射式二次光學透鏡來對LED發出的光進行適當地配光，且搭配在擴散板入光面設置微結構，以及在擴散板中還添加擴散粒子，並以發泡技術押出使擴散板內包含均勻分佈的微氣泡。藉此，可將LED的光線做最佳化的配光與擴散，進而達到遮蔽MURA，以產生一個輝度提高且均勻的面光源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A backlight module capable of enhancing brightness can be used with a Liquid Crystal Display (LCD). The backlight module comprises a secondary optical lens that can appropriately distribute the light emitted by the LED, and a diffusion plate with a unique light diffusion effect. The backlight module not only provides a catadioptric secondary optical lens on the LED to appropriately distribute the light emitted by the LED, but also provides a plurality of microstructures on the light-inlet surface of the diffuser plate, and provides a plurality of diffusion particles in the diffuser plate, and also provides a plurality of microbubbles evenly distributed in the diffuser plate by using extruding foaming technology. In this way, the light of the LED can be optimally distributed and diffused, thereby shielding the MURA to produce a surface light source with increased brightness and uniformity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:擴散板</p>  
        <p type="p">10:板體</p>  
        <p type="p">101:主板層</p>  
        <p type="p">1011、1021、1031:擴散粒子</p>  
        <p type="p">1012:微氣泡</p>  
        <p type="p">102、103:表層</p>  
        <p type="p">1032:微結構</p>  
        <p type="p">151:光學膜</p>  
        <p type="p">152:增亮膜</p>  
        <p type="p">153:偏光增亮膜</p>  
        <p type="p">20:二次光學透鏡</p>  
        <p type="p">91:基板</p>  
        <p type="p">911:頂面</p>  
        <p type="p">92:發光元件</p>  
        <p type="p">93:液晶顯示器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1633" publication-number="202611960"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611960.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611960</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128632</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路保護裝置、保險絲及操作電路保護裝置的方法</chinese-title>  
        <english-title>CIRCUIT PROTECTION DEVICE, FUSE, AND METHOD OF OPERATING CIRCUIT PROTECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251029B">H01H37/76</main-classification>  
        <further-classification edition="200601120251029B">H01H37/60</further-classification>  
        <further-classification edition="200601120251029B">H01C7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商力特福斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITTELFUSE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　建華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIANHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多姆斯　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOMS, MARCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾　俊昆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSANG, CHUN-KWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路保護裝置，可包括變阻器本體，變阻器本體包括第一側，其中熱電極沿第一側設置，且其中第一導線電氣連接至熱電極且第二導線電氣連接至第二側。電路保護裝置可進一步包括位於熱電極上的可回流電路保護，以及連接至可回流電路保護裝置的第三導線，其中第三導線的端部是彈簧，彈簧藉由導電元件連接至熱電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit protection device may include a varistor body including a first side, wherein a thermal electrode is disposed along the first side, and wherein a first lead is electrically connected to the thermal electrode and a second lead is electrically connected to a second side. The circuit protection device may further include a reflowable circuit protection device atop the thermal electrode, and a third lead connected to the reflowable circuit protection device, wherein an end of the third lead is a spring connected to the thermal electrode by a conductive element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電路保護組件、裝置</p>  
        <p type="p">12:變阻器本體</p>  
        <p type="p">13:外周</p>  
        <p type="p">18:熱電極</p>  
        <p type="p">21:第一導線</p>  
        <p type="p">22:第二導線</p>  
        <p type="p">23:第三導線</p>  
        <p type="p">24:可回流電路保護裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1634" publication-number="202611160"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611160.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611160</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128634</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環氧樹脂組成物及其硬化物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">C08G59/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田駿介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下山祥弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOYAMA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今喜裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KON, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種高度地兼顧貯藏穩定性與反應性的環氧樹脂組成物及其硬化物。具體而言，一種環氧樹脂組成物，包含環氧樹脂（A）以及硬化劑（B），所述硬化劑（B）包含化合物（b1）以及金屬（b2）作為原料，所述化合物（b1）在分子內具有選自由氮、氧及磷所組成的群組中的一種以上的雜原子，作為所述化合物（b1），包含羧酸類，所述硬化劑（B）的含量相對於所述環氧樹脂（A）100質量份而為0.1質量份～15質量份。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1635" publication-number="202611863"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611863.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611863</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128638</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於深度估計之方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR DEPTH ESTIMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">G06T7/50</main-classification>  
        <further-classification edition="201701120251201B">G06T7/593</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維爾甘　克莉斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAREKAMP, CHRISTIAAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於深度估計之系統及方法。2D影像由攝影機獲取，該等攝影機根據焦距劃分成至少兩組。由該等組攝影機之一組獲取的影像經處理以產生語意資訊，語意資訊繼而經處理以產生由另一組攝影機獲取的各影像的深度圖。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for depth estimation. 2D images are acquired by cameras that are divided into at least two sets according to focal length. Images acquired by one of the sets of cameras are processed to generate semantic information, which is in turn processed to generate a depth map for each image acquired by another set of cameras.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:工作流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1636" publication-number="202611400"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611400.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611400</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形狀記憶合金感測與致動開關</chinese-title>  
        <english-title>SHAPE MEMORY ALLOY SENSING AND ACTUATION SWITCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">F03G7/06</main-classification>  
        <further-classification edition="200601120251211B">H01H37/32</further-classification>  
        <further-classification edition="200601120251211B">G01D5/16</further-classification>  
        <further-classification edition="202301120251211B">H10N39/00</further-classification>  
        <further-classification edition="200601120251211B">H01H1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商哈欽森技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUTCHINSON TECHNOLOGY INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅恩　麥可　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROEN, MICHAEL E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施尼茨勒　理查　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHNITZLER, RICHARD A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯茲卡　萊恩　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUZICKA, RYAN N.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里克特森　馬克　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICKERTSEN, MARK M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施例係關於一種形狀記憶合金(SMA)感測器，其係開關之部分。例如，SMA感測器可包含經組態以與鎖定機構接合之致動器，其在鎖定機構在鎖定位置中時修改SMA感測器之電阻。SMA感測器之電阻無法被外部磁場修改，從而提高SMA感測器電阻判定鎖定機構之狀態之可靠性。作為另一實例，SMA感測器係在鎖定位置中與鎖定機構接觸之SMA線，藉此增大SMA線在鎖定位置中之電阻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present embodiments relate to a shape memory alloy (SMA) sensor being part of a switch. For instance, an SMA sensor can include an actuator configured to engage with a locking mechanism that modifies the resistance of the SMA sensor when the locking mechanism is in the locked position. The resistance of the SMA sensor cannot be modified by an external magnetic field, increasing reliability of the SMA sensor resistance determining a state of the locking mechanism. Another example, SMA sensor is an SMA wire being in contact with a locking mechanism in the locked position, thereby increasing a resistance of the SMA wire in the locked position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200A:感測器設計</p>  
        <p type="p">200C:裝置</p>  
        <p type="p">202A:鎖定機構</p>  
        <p type="p">204A:移動機構/致動器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1637" publication-number="202611045"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611045.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611045</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128672</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種氮雜腺嘌呤化合物及其製備方法與應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251021B">C07D487/04</main-classification>  
        <further-classification edition="200601120251021B">C08G73/12</further-classification>  
        <further-classification edition="200601120251021B">G03F7/004</further-classification>  
        <further-classification edition="200601120251021B">G03F7/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州強力電子新材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU TRONLY NEW ELECTRONIC MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州強力先端電子材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU TRONLY ADVANCED ELECTRONIC MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州力得爾電子新材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU LEADER NEW ELECTRONIC MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種氮雜腺嘌呤化合物及其製備方法與應用，所述氮雜腺嘌呤化合物具有式(I)所示結構，在式(I)中，R&lt;sub&gt;1&lt;/sub&gt;選自氫或氘、硝基或氰基，R&lt;sub&gt;2&lt;/sub&gt;選自C1-C20的直鏈烷基、C3-C20的支鏈烷基、C3-C10的環烷基、C6-C12的芳基或者C6-C18的芳氧基烷基。本發明的氮雜腺嘌呤化合物應用於聚醯亞胺材料中，無需改變現有的使用配方，其應用後能夠保持產品原有的應用性能，並且提高了產品的安定性，耐熱性優異。</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="159px" width="199px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1638" publication-number="202611055"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611055.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611055</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128703</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物及使用其之圖案形成方法</chinese-title>  
        <english-title>RESIST COMPOSITION AND PATTERN FORMATION METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07F7/22</main-classification>  
        <further-classification edition="200601120251201B">C07C309/77</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高行德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOH, HAENGDEOG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李善英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUNYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李智娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIYOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全震洹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, JINWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡貞廈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAE, JUNGHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種阻劑組成物及使用其之圖案形成方法，該阻劑組成物包括一由式1表示之有機金屬化合物及一由式2表示之添加劑：&lt;br/&gt; 式1&lt;br/&gt; M&lt;sub&gt;11&lt;/sub&gt;(R&lt;sub&gt;x&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;(R&lt;sub&gt;y&lt;/sub&gt;)&lt;sub&gt;(m-n)&lt;/sub&gt;&lt;br/&gt; 式2&lt;br/&gt; (X&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;c2&lt;/sub&gt;-(L&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;a2&lt;/sub&gt;-[Y&lt;sub&gt;2&lt;/sub&gt;-Z&lt;sub&gt;2&lt;/sub&gt;]&lt;sub&gt;b2&lt;/sub&gt;。&lt;br/&gt; 本說明書中提供對式1及式2中之M&lt;sub&gt;11&lt;/sub&gt;、R&lt;sub&gt;x&lt;/sub&gt;、R&lt;sub&gt;y&lt;/sub&gt;、n、m、X&lt;sub&gt;2&lt;/sub&gt;、Y&lt;sub&gt;2&lt;/sub&gt;、Z&lt;sub&gt;2&lt;/sub&gt;、L&lt;sub&gt;2&lt;/sub&gt;、a2、b2及c2的描述。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a resist composition including an organometallic compound represented by Formula 1 and an additive represented by Formula 2, and a pattern formation method using the same:&lt;br/&gt; Formula 1&lt;br/&gt; M&lt;sub&gt;11&lt;/sub&gt;(R&lt;sub&gt;x&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;(R&lt;sub&gt;y&lt;/sub&gt;)&lt;sub&gt;(m-n)&lt;/sub&gt;&lt;br/&gt; Formula 2&lt;br/&gt; (X&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;c2&lt;/sub&gt;-(L&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;a2&lt;/sub&gt;-[Y&lt;sub&gt;2&lt;/sub&gt;-Z&lt;sub&gt;2&lt;/sub&gt;]&lt;sub&gt;b2&lt;/sub&gt;.&lt;br/&gt; Descriptions of M&lt;sub&gt;11&lt;/sub&gt;, R&lt;sub&gt;x&lt;/sub&gt;, R&lt;sub&gt;y&lt;/sub&gt;, n, m, X&lt;sub&gt;2&lt;/sub&gt;, Y&lt;sub&gt;2&lt;/sub&gt;, Z&lt;sub&gt;2&lt;/sub&gt;, L&lt;sub&gt;2&lt;/sub&gt;, a2, b2, and c2 in Formulae 1 and 2 are provided in the specification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1639" publication-number="202612373"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612373.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612373</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128713</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用者裝備、網路裝置、由支援低功率喚醒訊號的使用者裝備實行的方法、以及由支援低功率喚醒訊號的網路裝置實行的方法</chinese-title>  
        <english-title>USER EQUIPMENT, NETWORK DEVICE, METHOD PERFORMED BY USER EQUIPMENT SUPPORTING LOW POWER WAKE-UP SIGNAL AND METHOD PERFORMED BY NETWORK DEVICE SUPPORTING LOW POWER WAKE-UP SIGNAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W52/02</main-classification>  
        <further-classification edition="200901120251201B">H04W52/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯賽尼安　賽義德　莫森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSSEINIAN, SEYED MOHSEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩托里　菲利普　瓊　馬克　米歇爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARTORI, PHILIPPE JEAN MARC MICHEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福亞德　亞瑟　穆罕默德　穆斯塔法　卡梅爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOUAD, YASER MOHAMED MOSTAFA KAMAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種用於報告LP-WUR雜訊指數的系統及方法。一種由支援LP-WUS的UE實行的方法包括：建立與網路裝置的連接；以及向網路裝置提供對UE中所包括的LP-WUR的雜訊指數值的指示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and a method are disclosed for reporting LP-WUR noise figures. A method performed by a UE supporting an LP-WUS includes establishing a connection with a network device; and providing, to the network device, an indication of a noise figure value of an LP-WUR included in the UE.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301、302、303、304、305:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1640" publication-number="202612412"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612412.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612412</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128733</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>零件埋入基板的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">H05K3/46</main-classification>  
        <further-classification edition="200601120251212B">H05K1/18</further-classification>  
        <further-classification edition="200601120251212B">C08J5/24</further-classification>  
        <further-classification edition="200601120251212B">H05K1/03</further-classification>  
        <further-classification edition="200601120251212B">C08G59/18</further-classification>  
        <further-classification edition="200601120251212B">C08L63/00</further-classification>  
        <further-classification edition="200601120251212B">B32B27/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商味之素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJINOMOTO CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>依田正応</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YODA, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮仲健人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYANAKA, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋永有輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKINAGA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種零件埋入基板的製造方法等，其可抑制在空腔內之零件與絕緣層之間所形成之脫層的產生，及往空腔外周部的滲出性。 &lt;br/&gt;　　[解決手段]一種製造方法，其依序包含：準備形成有在第一面上開口之空腔之基板的步驟、在前述空腔內裝設零件的步驟、將液狀樹脂組成物選擇性地填充於前述空腔的步驟、使前述液狀樹脂組成物進行硬化而在前述空腔內形成第一硬化層的步驟、在前述第一硬化層上積層樹脂組成物層的步驟，及使前述樹脂組成物層進行硬化而形成第二硬化層的步驟；其中，形成有在第一面上開口之空腔之基板之厚度為1.0mm以上，液狀樹脂組成物之硬化物之平均線熱膨脹係數未滿20ppm/℃。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:空腔基板</p>  
        <p type="p">10D:第二面</p>  
        <p type="p">10U:第一面</p>  
        <p type="p">20:空腔</p>  
        <p type="p">21:開口部</p>  
        <p type="p">22:開口部</p>  
        <p type="p">30:暫時裝設材料</p>  
        <p type="p">30U:黏著面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1641" publication-number="202611252"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611252.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611252</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接著劑組成物、積層體、及加工後之半導體基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09J133/08</main-classification>  
        <further-classification edition="200601120251201B">C09J183/05</further-classification>  
        <further-classification edition="200601120251201B">C09J183/07</further-classification>  
        <further-classification edition="200601120251201B">B32B7/12</further-classification>  
        <further-classification edition="200601120251201B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧野貴久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUNO, TAKAHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田貴文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸岡高廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIOKA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種可形成剝離性優異的接著劑層之接著劑組成物等。 &lt;br/&gt;本發明之接著劑組成物係用以形成接著劑層，前述接著劑層係用於將半導體基板或電子裝置層與支撐基板暫時接著；且前述接著劑組成物係含有接著劑成分、及具有由下述式（1）表示之重複單元之(甲基)丙烯酸酯系聚合物。 &lt;br/&gt;&lt;img align="absmiddle" height="238px" width="217px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體基板</p>  
        <p type="p">2:接著劑層</p>  
        <p type="p">4:支撐基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1642" publication-number="202611027"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611027.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611027</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128751</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性元件、抗蝕劑圖案的形成方法及配線基板的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D233/20</main-classification>  
        <further-classification edition="200601120251201B">C08F2/44</further-classification>  
        <further-classification edition="200601120251201B">C08F2/50</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/028</further-classification>  
        <further-classification edition="200601120251201B">G03F7/031</further-classification>  
        <further-classification edition="200601120251201B">G03F7/033</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/09</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/40</further-classification>  
        <further-classification edition="200601120251201B">H05K3/06</further-classification>  
        <further-classification edition="200601120251201B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大野茜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, AKANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新井達彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, TATSUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂下裕亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKASHITA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的感光性元件包括支撐體以及在所述支撐體上形成的感光層，所述感光層含有黏合劑聚合物、光聚合性化合物、光聚合起始劑以及增感劑，所述光聚合起始劑包含六芳基聯咪唑化合物，相對於所述黏合劑聚合物及所述光聚合性化合物的總量100質量份，所述增感劑的含量為0.019質量份以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:感光性元件</p>  
        <p type="p">2:支撐體</p>  
        <p type="p">3:感光層</p>  
        <p type="p">4:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1643" publication-number="202610670"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610670.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610670</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>心肌細胞遞送平台及使用方法</chinese-title>  
        <english-title>CARDIOMYOCYTE DELIVERY PLATFORMS AND METHODS OF USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">A61K31/7088</main-classification>  
        <further-classification edition="201001120251208B">C12N15/113</further-classification>  
        <further-classification edition="201701120251208B">A61K47/56</further-classification>  
        <further-classification edition="200601120251208B">A61P21/00</further-classification>  
        <further-classification edition="200601120251208B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛羅海德製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARROWHEAD PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納克勒爾里歐　喬治　三世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NACLERIO, GEORGE, III</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAIN, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　曉愷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOKAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴　濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEI, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於可在活體內特異性及有效地將酬載引導至個體心肌細胞之遞送媒劑。本文所揭示之該等遞送媒劑包含靶向配體(例如對升糖素樣肽受體(包含GLP1R)具有親和力之化合物)及藥物動力學/藥效學(PK/PD)調節劑，以促進將酬載遞送至細胞(包含至心肌細胞)。用於本文所揭示之該等遞送媒劑的適宜酬載包含RNAi藥劑，其可與該等遞送媒劑連接或偶聯，且當在活體內遞送時，可抑制心肌細胞中之基因表現。本文亦闡述包含心肌細胞遞送媒劑之醫藥組合物，以及期望將治療性酬載地送至心肌細胞來治療各種疾病及病症之使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to delivery vehicles that specifically and efficiently direct payloads to cardiomyocytes in a subject, &lt;i&gt;in vivo&lt;/i&gt;. The delivery vehicles disclosed herein include targeting ligands (such as compounds that have affinity for glucagon like peptide receptors, including GLP1R) and pharmacokinetic/pharmacodynamic (PK/PD) modulators, to facilitate the delivery of payloads to cells, including to cardiomyocytes. Suitable payloads for use in the delivery vehicles disclosed herein include RNAi agents, which can be linked or conjugated to the delivery vehicles, and when delivered &lt;i&gt;in vivo&lt;/i&gt;,&lt;i/&gt;provide for the inhibition of gene expression in cardiomyocytes. Pharmaceutical compositions that include the cardiomyocyte delivery vehicle are also described, as well as methods of use for the treatment of various diseases and disorders where delivery of a therapeutic payload to a cardiomyocyte is desirable.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1644" publication-number="202611746"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611746.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611746</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128768</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用機器學習進行線鋸製程控制之晶圓形狀分類之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR WAFER SHAPE CLASSIFICATION USING MACHINE LEARNING FOR WIRE SAW PROCESS CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251201B">G06F16/55</main-classification>  
        <further-classification edition="202201120251201B">G06V10/778</further-classification>  
        <further-classification edition="200601120251201B">B23D59/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅瑞茲　安德瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAURENZI, ANDREA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波達　費瑞依歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONDA, FABRIZIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電腦裝置包含與至少一個記憶體裝置通信之至少一個處理器。該至少一個處理器經程式化以：a)接收物件之複數個歷史影像；b)訓練一模型以對該複數個歷史影像進行分類；c)接收待分析之一物件之掃描資料；d)執行該模型以判定待分析之該物件之一類別；及e)基於該物件之該類別判定是否核准該物件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computer device includes at least one processor in communication with at least one memory device. The at least one processor is programmed to: a) receive a plurality of historical images of objects; b) train a model to classify the plurality of historical images; c) receive scan data of an object to be analyzed; d) execute the model to determine a category for the object to be analyzed; and e) determine whether or not to approve the object based on the category for the object.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:製程</p>  
        <p type="p">205:接收</p>  
        <p type="p">210:訓練</p>  
        <p type="p">215:接收</p>  
        <p type="p">220:執行</p>  
        <p type="p">225:判定</p>  
        <p type="p">230:判定</p>  
        <p type="p">235:調整</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1645" publication-number="202611467"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611467.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611467</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128771</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理器與電壓調節器的冷卻組件</chinese-title>  
        <english-title>COOLING ASSEMBLY FOR PROCESSORS AND VOLTAGE REGULATORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250930B">F28F3/12</main-classification>  
        <further-classification edition="200601120250930B">F28F3/02</further-classification>  
        <further-classification edition="200601120250930B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美超微電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUPER MICRO COMPUTER,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣政栓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHENG-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳加偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭露一種用於處理器與電壓調節器的冷卻組件。處理器貼置於冷卻板。電壓調節器散熱器可拆卸地貼置於該冷卻板。該電壓調節器散熱器包含散熱鰭片與散熱器基座。該散熱器基座貼置於電壓調節器。液體冷卻劑流經該冷卻板，以冷卻處理器與電壓調節器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure is a cooling assembly for processors and voltage regulators. A processor is attached to a cold plate. A voltage regulator heatsink is removably attached to the cold plate. The voltage regulator heatsink has cooling fins and a heatsink base. The heatsink base is attached to a voltage regulator. Liquid coolant is flowed through the cold plate to cool the processor and the voltage regulator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:冷卻組件</p>  
        <p type="p">120-1、120-2:電壓調節器散熱器</p>  
        <p type="p">121:散熱器基座</p>  
        <p type="p">150:冷卻板</p>  
        <p type="p">154:蓋板</p>  
        <p type="p">201:螺絲</p>  
        <p type="p">300:基板</p>  
        <p type="p">301:處理器</p>  
        <p type="p">310:電壓調節器</p>  
        <p type="p">311:積體電路封裝</p>  
        <p type="p">312:散熱器安裝面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1646" publication-number="202611190"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611190.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611190</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128803</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙軸配向聚乳酸膜、以及積層膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">C08J5/22</main-classification>  
        <further-classification edition="200601120251208B">B32B27/28</further-classification>  
        <further-classification edition="200601120251208B">A61L17/12</further-classification>  
        <further-classification edition="200601120251208B">B29C55/00</further-classification>  
        <further-classification edition="200601120251208B">B29C55/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川口健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部尭永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TAKAHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲垣潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INAGAKI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤田薫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWADA, KAORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>図師太一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZUSHI, TAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種雙軸配向聚乳酸膜，係自包含聚乳酸之膜形成材料所形成；於以傅立葉轉換紅外光譜術之全反射法所測定之光譜中，前述聚乳酸膜之中間相配向參數(757cm&lt;sup&gt;-1&lt;/sup&gt;/2996cm&lt;sup&gt;-1&lt;/sup&gt;之波峰強度比)滿足4.0以下；內部霧度較佳為6%以下；較佳為寬度方向之斷裂應力為100MPa以上，且長度方向與寬度方向之斷裂應力之比為0.7以下；經150℃、30分鐘之加熱的情形，長度方向之熱收縮率較佳為10%以下；聚乳酸較佳係L-乳酸/D-乳酸之質量比為100/0至85/15。根據本發明，可提供一種聚乳酸膜，係關於源自生質原料且具生物分解性的聚乳酸，且透明性及加工性優異。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1647" publication-number="202612010"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612010.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612010</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128818</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板加工方法及基板加工系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/304</main-classification>  
        <further-classification edition="200601120251210B">B24B49/02</further-classification>  
        <further-classification edition="201201120251210B">B24B37/005</further-classification>  
        <further-classification edition="200601120251210B">G01B11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溝本康隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZOMOTO, YASUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>早川晋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAKAWA, SUSUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種技術，可在經由中間層而與第二基板貼合的第一基板研磨後，以不受起因於中間層之邊緣塌邊(edge roll-off)的雜訊影響的方式測量第一基板的厚度。 &lt;br/&gt;本發明之基板加工方法包含以下步驟：將具有第一基板、貼合於該第一基板之第二基板，及設於該第一基板與該第二基板之間之中間層的貼合基板之該第一基板加以研磨。該基板加工方法更包含以下步驟：取得該第一基板研磨前的該貼合基板之該貼合基板的厚度從徑向內側越往徑向外側越薄的第一區域之徑向內端的位置資訊；及在從該第一區域之徑向內端往徑向內側遠離設定距離以上的圓狀之第二區域中，測量該第一基板研磨後的該第一基板之厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">D:設定距離</p>  
        <p type="p">H1~H4,HR,HT:厚度</p>  
        <p type="p">W1:第一基板</p>  
        <p type="p">W2:第二基板</p>  
        <p type="p">W3,W4:中間層</p>  
        <p type="p">WA:第一區域</p>  
        <p type="p">WA1:徑向內端</p>  
        <p type="p">WB:第二區域</p>  
        <p type="p">WB1:徑向外端</p>  
        <p type="p">WC:第三區域</p>  
        <p type="p">WD:第四區域</p>  
        <p type="p">WR:殘餘部</p>  
        <p type="p">WT:貼合基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1648" publication-number="202610671"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610671.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610671</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128830</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>細胞外囊泡的製備方法及其應用</chinese-title>  
        <english-title>METHOD FOR PRODUCING EXTRACELLULAR VESICLES AND THE APPLICATIONS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/7088</main-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification>  
        <further-classification edition="200601120251201B">A61K48/00</further-classification>  
        <further-classification edition="200601120251201B">C12N15/86</further-classification>  
        <further-classification edition="202501120251201B">A61K9/127</further-classification>  
        <further-classification edition="200601120251201B">A61P9/00</further-classification>  
        <further-classification edition="200601120251201B">A61P3/00</further-classification>  
        <further-classification edition="200601120251201B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安和生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANHO BIOMEDICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何志煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHIH-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開揭露提供了一種製備含有標的功能分子，特別是含有標的RNA的細胞外囊泡的方法。本公開揭露也描述了使用以此方法製備的細胞外囊泡來誘導細胞或生物體的RNA干擾，以及使用以此方法製備的細胞外囊泡以使細胞/生物體回春以及/或治療與老化相關之疾病/狀況和/或美容問題的方法。此外，本公開揭露還提供了一種使細胞回春和/或延長細胞增殖壽命的方法，該方法包括將編碼一組重編程因子的質體直接導入細胞中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein is a method of producing extracellular vesicles containing desired function molecules, in particular, extracellular vesicles containing a RNA of interest. Also described herein are methods of inducing RNA interference in a cell or an organism, and methods of rejuvenating cells/organisms, and/or treating aging related diseases/conditions and/or aesthetic issues using the extracellular vesicles produced by the methods disclosed herein. Additionally, methods for rejuvenating a cell and/or extending a cell’s proliferative lifespan are provided, comprising incorporating plasmids encoding a set of reprogramming factors directly into the cell.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1649" publication-number="202610771"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610771.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610771</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拋光墊及使用其之半導體裝置的製備方法</chinese-title>  
        <english-title>POLISHING PAD AND PREPARATION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251118B">B24B37/26</main-classification>  
        <further-classification edition="200601120251118B">H01L21/67</further-classification>  
        <further-classification edition="200601120251118B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商恩普士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENPULSE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳信一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, SHINIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐章源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JANGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申有眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, YUJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金潁煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金京煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明之實施例等，提供一拋光墊及使用該拋光墊用於製備一半導體裝置之方法。該拋光墊包含一拋光層，其包含一拋光表面且具有於其內形成的多個孔隙，其中根據方程式1之該拋光表面的接觸面積比為0.76%或更高。可以抑制待拋光薄膜物質的表面缺陷，並可以改善拋光效率和均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to embodiments of the present invention, there are provided a polishing pad and a process for preparing a semiconductor device using the polishing pad. The polishing pad comprises a polishing layer comprising a polishing surface and having a plurality of pores formed therein, wherein the contact area ratio of the polishing surface according to Equation 1 is 0.76% or more. Surface defects of a film substance to be polished can be suppressed, and polishing efficiency and uniformity can be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:拋光墊</p>  
        <p type="p">110:拋光表面</p>  
        <p type="p">200:半導體基板</p>  
        <p type="p">310:壓板</p>  
        <p type="p">320:拋光頭部</p>  
        <p type="p">330:噴嘴</p>  
        <p type="p">340:拋光漿料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1650" publication-number="202611270"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611270.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611270</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128845</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶性樹脂組合物及使用此之薄膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C09K19/10</main-classification>  
        <further-classification edition="200601120251211B">C08L67/03</further-classification>  
        <further-classification edition="200601120251211B">C08F8/46</further-classification>  
        <further-classification edition="200601120251211B">C08L101/12</further-classification>  
        <further-classification edition="200601120251211B">C08G63/16</further-classification>  
        <further-classification edition="200601120251211B">B29B11/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商寶理塑料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLYPLASTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川原俊紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAHARA, TOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青島広宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOSHIMA, HIRONOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中根敏雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANE, TOSHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長永昭宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAE, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供可賦予介電特性、製膜性、及機械強度良好平衡、優良的薄膜之液晶性樹脂組合物及使用此之薄膜。 &lt;br/&gt;本發明之液晶性樹脂粒料含有（A）液晶性樹脂及（B）非晶性聚芳酯，前述（A）液晶性樹脂含有下列結構單元（I）及（II）為必要結構成分，相對於前述（A）液晶性樹脂中的所有結構單元，結構單元（I）的含量為60～85莫耳%，結構單元（II）的含量為12～40莫耳%，相對於前述液晶性樹脂組合物全體，前述（A）液晶性樹脂的含量為95.5～99.9質量%，前述（B）非晶性聚芳酯的含量為0.1～4.5質量%。 &lt;br/&gt;&lt;img align="absmiddle" height="282px" width="387px" file="ed10006.JPG" alt="ed10006.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1651" publication-number="202612022"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612022.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612022</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128852</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置的製造方法及電漿處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250804B">H01L21/3065</main-classification>  
        <further-classification edition="202501120250804B">H10D30/01</further-classification>  
        <further-classification edition="202501120250804B">H10D30/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name></last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤清彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KIYOHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平林英史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRABAYASHI, HIDEFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供在以具有積層有導線狀或薄片狀的通道的構造的GAA型FET，依據電晶體的種類來分別製造work function金屬的步驟中，即使於上述通道上形成閘極絕緣膜和work function金屬後，於積層的通道(3)間存在間隙的情況下，仍可不須使用填埋間隙的犠牲層且分別製造work function金屬的電漿處理方法。為此，將覆蓋上述積層通道的有機膜遮罩予以塗布，實施用於使必須的電晶體區域露出的圖案成形來將上述有機膜遮罩進行垂直蝕刻後，將保護絕緣膜(13)堆積於全面。接下來，對保護絕緣膜(13)進行各向同性蝕刻，使保護絕緣膜(13)僅殘留於上述有機膜遮罩的側壁。在此狀態，藉著在前述圖案開口部的work function金屬及前述圖案開口部將填埋於通道(3)間之間隙的有機膜遮罩除去，可僅將上述圖案開口部的work function金屬除去。藉著將從上述有機膜遮罩的垂直蝕刻至除去上述work function金屬為止於使用同一裝置的連續過程中進行，以達到步驟的簡略化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1652" publication-number="202610659"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610659.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610659</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128853</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療例如發炎病症之組合物</chinese-title>  
        <english-title>COMPOSITION FOR USE IN TREATMENT OF FOR EXAMPLE INFLAMMATORY DISORDERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">A61K31/60</main-classification>  
        <further-classification edition="200601120251208B">A61K31/415</further-classification>  
        <further-classification edition="200601120251208B">A61K31/407</further-classification>  
        <further-classification edition="200601120251208B">A61K31/196</further-classification>  
        <further-classification edition="200601120251208B">A61K31/192</further-classification>  
        <further-classification edition="200601120251208B">A61P19/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商美德晶醫療有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDCRYST THERAPEUTICS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡珀　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOOPER, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述用於治療發炎病症之組合物，其包含：35重量%至87重量%水；1重量%至10重量%苄醇；1重量%至5重量%油酸；1重量%至5重量%胺鹼；及10重量%至50重量%二醇醚，其中胺鹼之莫耳量等於或大於油酸之莫耳量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Herein describes a composition for use in the treatment of an inflammatory disorder comprising: 35 wt% to 87 wt% water; 1 wt% to 10 wt% benzyl alcohol; 1 wt% to 5 wt% oleic acid; 1 wt% to 5 wt% amine base; and 10 wt% to 50 wt% glycol ether, wherein the molar amount of amine base is equal to or greater than the molar amount of oleic acid.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1653" publication-number="202612267"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612267.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612267</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128856</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>音叉諧振器</chinese-title>  
        <english-title>TUNING FORK RESONATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H03H9/21</main-classification>  
        <further-classification edition="200601120251103B">H03H9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商微晶體公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRO CRYSTAL SA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達拉皮薩　西爾維歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DALLA PIAZZA, SILVIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史塔伯　菲立克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAUB, FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一種態樣涉及一種音叉諧振器，其設計允許縮小諧振器的尺寸，同時保持高品質因子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One aspect of the present invention is related to a tuning fork resonator having a design allowing reduced dimensions of resonators while maintaining a high quality factor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:音叉諧振器</p>  
        <p type="p">11:桿部</p>  
        <p type="p">14:第二基部</p>  
        <p type="p">15a:第一諧振器束</p>  
        <p type="p">15b:第二諧振器束</p>  
        <p type="p">16a:表面</p>  
        <p type="p">16b:表面</p>  
        <p type="p">18a:寬度</p>  
        <p type="p">18b:寬度</p>  
        <p type="p">19:間隙</p>  
        <p type="p">20:寬度</p>  
        <p type="p">21:長度</p>  
        <p type="p">22:長度</p>  
        <p type="p">23a:長度</p>  
        <p type="p">23b:長度</p>  
        <p type="p">27:中間薄片</p>  
        <p type="p">28a:壓電組件</p>  
        <p type="p">28b:壓電組件</p>  
        <p type="p">29a:壓電組件</p>  
        <p type="p">29b:壓電組件</p>  
        <p type="p">30:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1654" publication-number="202612570"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612570.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612570</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128888</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及顯示面板</chinese-title>  
        <english-title>DISPLAY DEVICE AND DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250805B">H10K59/127</main-classification>  
        <further-classification edition="202301120250805B">H10K59/131</further-classification>  
        <further-classification edition="202301120250805B">H10K59/82</further-classification>  
        <further-classification edition="202301120250805B">H10K77/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓詮襅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JEONPHILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白承漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAEK, SEUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南大鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAM, DAE-HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元奎植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WON, GYU-SIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種顯示裝置及顯示面板。根據本揭露之顯示裝置可包括包含溝槽之顯示面板以及連接至所述顯示面板之電路板，且所述顯示面板包括包含藉由所述溝槽與彼此相隔之第一基板及第二基板的基板、設置於第一基板上且包含電晶體的電路層、自電路層延伸並設置於溝槽上的平坦化層、設置於第二基板上並連接至電路板的接墊部、設置於平坦化層上的彎曲線以及連接至彎曲線之連接線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to a display device and a display panel. A display device according to the present disclosure may include a display panel including a groove and a circuit board connected to the display panel, and the display panel may include: a substrate including a first substrate and a second substrate spaced apart from each other by the groove; a circuit layer arranged on the first substrate and including a transistor; a planarization layer extending from the circuit layer and arranged on the groove; a pad portion arranged on the second substrate and connected to the circuit board; a bending wire arranged on the planarization layer; and a connection wire connected to the bending wire.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100,110,120:基板</p>  
        <p type="p">200:電路層</p>  
        <p type="p">210:電晶體</p>  
        <p type="p">211:閘極電極</p>  
        <p type="p">212:主動層</p>  
        <p type="p">213:源極電極</p>  
        <p type="p">214:汲極電極</p>  
        <p type="p">220:閘極絕緣層</p>  
        <p type="p">230,260:層間介電層</p>  
        <p type="p">240:平坦化層</p>  
        <p type="p">250,270:電極</p>  
        <p type="p">300:液晶層</p>  
        <p type="p">310:密封劑</p>  
        <p type="p">320:支柱</p>  
        <p type="p">321,322:柱狀部</p>  
        <p type="p">400:圖案層</p>  
        <p type="p">500:彩色濾光層</p>  
        <p type="p">600:黑矩陣</p>  
        <p type="p">700:覆蓋構件</p>  
        <p type="p">A:區域</p>  
        <p type="p">BA:彎曲區域</p>  
        <p type="p">BL:彎曲線</p>  
        <p type="p">CH1,CH2:接觸孔</p>  
        <p type="p">DA:顯示區域</p>  
        <p type="p">DPOL,UPOL:偏光層</p>  
        <p type="p">G:溝槽</p>  
        <p type="p">GAP:間隙</p>  
        <p type="p">H:高度</p>  
        <p type="p">L1:長度</p>  
        <p type="p">LL,LL1,LL2:連接線</p>  
        <p type="p">NA1,NA2:非顯示區域</p>  
        <p type="p">PAD1,PAD2:接墊部</p>  
        <p type="p">PAD2a,PAD2b:墊層</p>  
        <p type="p">W1,W2:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1655" publication-number="202612569"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612569.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612569</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128889</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透明顯示設備</chinese-title>  
        <english-title>TRANSPARENT DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251204B">H10K59/12</main-classification>  
        <further-classification edition="202301120251204B">H10K59/35</further-classification>  
        <further-classification edition="202301120251204B">H10K59/38</further-classification>  
        <further-classification edition="202301120251204B">H10K59/82</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BINN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鍍振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DOJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露實施例之透明顯示設備包含：基板，配設有多個像素，該些像素中之每一者具有多個子像素；透光區域，配設於基板上並佈置為於該些子像素之間的至少一些子像素相鄰；以及彩色圖案部，部分地與透光區域重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transparent display apparatus according to an embodiment of the present disclosure comprises a substrate provided with a plurality of pixels each having a plurality of sub-pixels; a transmissive area provided on the substrate and arranged adjacent to at least some subpixels among the plurality of subpixels; and a color pattern portion partially overlapping the transmissive area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板</p>  
        <p type="p">111:電路元件層</p>  
        <p type="p">111b:層間絕緣層</p>  
        <p type="p">111c:鈍化層</p>  
        <p type="p">112:薄膜電晶體</p>  
        <p type="p">112a:主動層</p>  
        <p type="p">112b:閘極電極</p>  
        <p type="p">112c:源極電極</p>  
        <p type="p">112d:汲極電極</p>  
        <p type="p">113:塗覆層</p>  
        <p type="p">114:像素電極</p>  
        <p type="p">115:堤岸</p>  
        <p type="p">116:有機發光層</p>  
        <p type="p">117:對向電極</p>  
        <p type="p">118:填充層</p>  
        <p type="p">120:彩色圖案部</p>  
        <p type="p">200:對向基板</p>  
        <p type="p">BM:黑色矩陣</p>  
        <p type="p">BL:緩衝層</p>  
        <p type="p">CF:彩色濾光片</p>  
        <p type="p">CF1:藍色濾光片</p>  
        <p type="p">CFW,BMW:寬度</p>  
        <p type="p">DL,DL3,DL4:資料線</p>  
        <p type="p">E:發光元件層</p>  
        <p type="p">EVSS:共用電源線</p>  
        <p type="p">EA:發光區域</p>  
        <p type="p">NEA:非發光區域</p>  
        <p type="p">RL:參考線</p>  
        <p type="p">TA:透光區域</p>  
        <p type="p">T1,T2:厚度</p>  
        <p type="p">UD:向上方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1656" publication-number="202612109"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612109.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612109</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128893</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01L23/13</main-classification>  
        <further-classification edition="200601120251001B">H01H29/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權鍍鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, DOHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈完建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIM, WANGEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示關於一種顯示裝置，其於各角隅部包含一樣條區域。為實現此目的，本揭示的顯示裝置可具有與一顯示面板接合且具有四個樣條區域的一支撐基板，這四個樣條區域分別對應於顯示面板的四個弧形角隅部，且各樣條區域內分別形成一有通孔圖案。藉此，於支撐基板與顯示面板的接合過程中，支撐基板各樣條區域內所形成的通孔圖案可吸收接合壓力，從而防止支撐基板發生皺褶或位移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a display device including a spline area in a respective corner. To realize this, the display device of the present disclosure may have a support substrate bonded to a display panel and having four spline areas respectively corresponding to four arc-shaped corners of the display panel, and the spline areas may have respective a hole pattern formed therein. Thereby, during the bonding of the support substrate and the display panel, the bonding pressure can be absorbed by the hole patterns formed in the respective spline areas of the support substrate, thus preventing the occurrence of wrinkle or displacement in the support substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板</p>  
        <p type="p">145:支撐基板</p>  
        <p type="p">AA:有效區</p>  
        <p type="p">NA,NA1,NA2:非有效區</p>  
        <p type="p">SPA1,SPA2,SPA3,SPA4:樣條區域</p>  
        <p type="p">BA:彎折區</p>  
        <p type="p">PAD:焊盤部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1657" publication-number="202612474"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612474.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612474</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128979</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置</chinese-title>  
        <english-title>MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251204B">H10B53/00</main-classification>  
        <further-classification edition="202501120251204B">H10D62/40</further-classification>  
        <further-classification edition="202501120251204B">H10D62/80</further-classification>  
        <further-classification edition="200601120251204B">H01L21/20</further-classification>  
        <further-classification edition="200601120251204B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗林德斯大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLINDERS UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澳大利亞商新南威爾斯創新有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEWSOUTH INNOVATIONS PTY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘卡吉　夏爾馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANKAJ, SHARMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡　賽德爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAN, SEIDEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦拉諾爾　納加拉詹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VALANOOR, NAGARAJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐吉良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一種記憶體裝置。該記憶體裝置包括一個包含鐵電活性材料的基底層和一個結合於該基底層表面的磁疇壁(domain wall)，該磁疇壁在施加一變形刺激(deforming stimulus)下可變形以在該基底層中採用一穩定配置，其中該穩定配置定義該記憶體裝置之一可辨識或可測量電特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">110:基底層</p>  
        <p type="p">120:磁疇壁</p>  
        <p type="p">120A:穩定配置</p>  
        <p type="p">120B、120C:額外穩定配置</p>  
        <p type="p">130:表面</p>  
        <p type="p">150A、150B:鐵活性疇區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1658" publication-number="202611929"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611929.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611929</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128992</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理功率損耗的記憶體控制器和存儲系統</chinese-title>  
        <english-title>MEMORY CONTROLLER AND MEMORY SYSTEM HANDLING POWER LOSS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G11C16/06</main-classification>  
        <further-classification edition="201601120251103B">G06F12/0866</further-classification>  
        <further-classification edition="200601120251103B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長江存儲科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳衛林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在某些方面中，一種存儲系統包括非揮發性存儲裝置和耦合到非揮發性存儲裝置的記憶體控制器。記憶體控制器被配置為：基於要被初始編程到非揮發性存儲裝置的資料來生成指示符資料，並且響應於存儲系統的功率損耗，控制指示符資料到非揮發性存儲裝置的傳輸。指示符資料被配置為恢復來源資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In certain aspects, a memory system includes a non-volatile memory device, and a memory controller coupled to the non-volatile memory device. The memory controller is configured to generate indicator data based on data to be initially programmed to the non-volatile memory device, and, in response to power loss of the memory system, control transmission of the indicator data to the non-volatile memory device. The indicator data is configured to recover the source data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:存儲系統</p>  
        <p type="p">802:非揮發性存儲裝置</p>  
        <p type="p">804:記憶體控制器</p>  
        <p type="p">806:揮發性存儲裝置</p>  
        <p type="p">808:PLP電路</p>  
        <p type="p">810:指示符(ID)資料生成器</p>  
        <p type="p">812:主機資料</p>  
        <p type="p">814:來源資料</p>  
        <p type="p">816:中間資料</p>  
        <p type="p">818:指示符資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1659" publication-number="202612484"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612484.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612484</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129004</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251203B">H10B80/00</main-classification>  
        <further-classification edition="200601120251203B">H01L23/535</further-classification>  
        <further-classification edition="200601120251203B">H01L23/538</further-classification>  
        <further-classification edition="200601120251203B">G11C11/4067</further-classification>  
        <further-classification edition="200601120251203B">G11C11/4063</further-classification>  
        <further-classification edition="200601120251203B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔海禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, HAEJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金柱成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JOOSEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴力燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HIMCHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁埈赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUNHYEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庾成敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, SUNGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔　炳䝬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置包括在第一製程條件下製造的第一晶粒和在第二製程條件下製造的第二晶粒。第一晶粒包括參考產生電路，包括雙極性接面電晶體（BJT）元件。第二晶粒被配置為基於由參考產生電路產生的參考值操作。第一製程條件不同於第二製程條件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a first die manufactured under first process conditions and a second die manufactured under second process conditions. The first die includes a reference generation circuit including a bipolar junction transistor (BJT) element. The second die is configured to operate based on a reference value generated by the reference generation circuit. The first process conditions are different from the second process conditions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">110:第一晶粒</p>  
        <p type="p">111:參考產生電路</p>  
        <p type="p">112:第一內部電路</p>  
        <p type="p">120:第二晶粒</p>  
        <p type="p">121:第二內部電路</p>  
        <p type="p">130:通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1660" publication-number="202612011"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612011.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612011</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129043</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/304</main-classification>  
        <further-classification edition="200601120251210B">H01L21/67</further-classification>  
        <further-classification edition="200601120251210B">H01L21/683</further-classification>  
        <further-classification edition="200601120251210B">H01L23/473</further-classification>  
        <further-classification edition="200601120251210B">G03F7/42</further-classification>  
        <further-classification edition="200601120251210B">B05B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基板處理裝置及基板處理方法，其能夠降低排液配管堵塞之風險，且能夠減少液體消耗量，從而有助於降低環境負荷及運轉成本。本發明之基板處理裝置包含：膜片排出部，其利用第1液體將從基板之表面剝離之處理膜之膜片引導至排液配管；第2液體供給部，其向排液配管供給第2液體；分離機構，其將第1液體與第2液體分離；以及第1液體收容機構及第2液體收容機構，其等分別接收分離出之第1液體及第2液體。處理膜可溶於第1液體及第2液體中之一者，且不溶或難溶於其等中之另一者。分離機構可包含排液截留槽及閥機構，該閥機構藉由浮體之上下移動而將第1排出埠及第2排出埠中之一者打開，將其等中之另一者關閉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate processing apparatus includes a spin chuck; a nozzle to supply a processing liquid to a surface of a substrate; a processing film forming portion to solidify or cure the processing liquid to form a processing film; a peeling portion to peel off the processing film; a drain piping to discharge a waste liquid; a film piece discharge portion to guide film pieces of the processing film peeled off and discharged from the surface of the substrate to the drain piping using a first liquid; a second liquid supplying portion to supply a second liquid to the drain piping; a separator to separate the first liquid and the second liquid; a first liquid storage; and a second liquid storage. The processing film is soluble in one of the first liquid and the second liquid, and is insoluble or poorly soluble in the other of them.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:旋轉夾頭</p>  
        <p type="p">40:殘渣去除液配管</p>  
        <p type="p">42:剝離液配管</p>  
        <p type="p">60:排液配管</p>  
        <p type="p">60A:第1排液配管</p>  
        <p type="p">60B:第2排液配管</p>  
        <p type="p">60C:第3排液配管、排液配管</p>  
        <p type="p">60D:第4排液配管、排液配管</p>  
        <p type="p">71:擋板</p>  
        <p type="p">71A:第1擋板、擋板</p>  
        <p type="p">71B:第2擋板、擋板</p>  
        <p type="p">110:分離機構</p>  
        <p type="p">111:排液截留槽</p>  
        <p type="p">112:閥機構</p>  
        <p type="p">113:浮體</p>  
        <p type="p">114:支點</p>  
        <p type="p">114a:旋動軸線</p>  
        <p type="p">115:桿</p>  
        <p type="p">116A:第1閥構件</p>  
        <p type="p">116B:第2閥構件</p>  
        <p type="p">117A:第1閥桿</p>  
        <p type="p">117B:第2閥桿</p>  
        <p type="p">118A:第1閥體</p>  
        <p type="p">118B:第2閥體</p>  
        <p type="p">119A:第1閥座</p>  
        <p type="p">119B:第2閥座</p>  
        <p type="p">151:第1液體收容機構</p>  
        <p type="p">152:第2液體收容機構</p>  
        <p type="p">153:第1箱</p>  
        <p type="p">154:泵</p>  
        <p type="p">155:過濾器</p>  
        <p type="p">156:第2箱</p>  
        <p type="p">157:泵</p>  
        <p type="p">158:過濾器</p>  
        <p type="p">161:泵</p>  
        <p type="p">162:閥</p>  
        <p type="p">163:泵</p>  
        <p type="p">164:閥</p>  
        <p type="p">200:排液系統</p>  
        <p type="p">PA:第1排出埠</p>  
        <p type="p">PB:第2排出埠</p>  
        <p type="p">VA:第1閥</p>  
        <p type="p">VB:第2閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1661" publication-number="202612137"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612137.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612137</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129061</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背側局部阱分接頭</chinese-title>  
        <english-title>BACKSIDE LOCAL WELL TAP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L23/482</main-classification>  
        <further-classification edition="202501120251201B">H10D84/83</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維嘉　雷納多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEGA, REINALDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　曉鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XIAOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周慧梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, HUIMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　瑞龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, RUILONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德森　布萊特　愛倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDERSON, BRENT ALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克烈文格　勞倫斯　阿佛烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLEVENGER, LAWRENCE ALFRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　文熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, ALBERT MANHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭齊洛　尼可拉斯　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANZILLO, NICHOLAS ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHUANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉瑪承德蘭　拉維庫馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMACHANDRAN, RAVIKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫瑪　馬翰德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, MAHENDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供半導體裝置，其包括位於一淺溝槽隔離結構中之一導體結構，該淺溝槽隔離結構定位於具有一相同導電性類型的兩個場效電晶體之間。該導體結構電連接至一背側接觸結構，且該背側接觸結構電連接至橫跨該背側接觸結構之一側壁的至少一個阱區。該背側接觸結構與該阱區之間的接觸區域為該半導體裝置提供一局部阱分接頭。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor devices are provided that include a conductor structure located in a shallow trench isolation structure that is positioned between two field effect transistors of a same conductivity type. The conductor structure is electrically connected to a backside contact structure, and the backside contact structure is electrically connected to at least one well region that straddles a sidewall of the backside contact structure. The area of contact between the backside contact structure and the well region provides a local well tap to the semiconductor device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:n阱區</p>  
        <p type="p">14:p阱區</p>  
        <p type="p">16:pFET</p>  
        <p type="p">18:nFET</p>  
        <p type="p">22:淺溝槽隔離結構</p>  
        <p type="p">24:襯裡</p>  
        <p type="p">26:導體接觸柱</p>  
        <p type="p">28:背側ILD層</p>  
        <p type="p">32A:背側接觸結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1662" publication-number="202611452"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611452.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611452</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129069</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過潛熱紅外線反射的凍結庫及凍結器具</chinese-title>  
        <english-title>FREEZING CHAMBER AND FREEZING APPARATUS UTILIZING LATENT-HEAT INFRARED REFLECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">F25D11/00</main-classification>  
        <further-classification edition="200601120251212B">F25D21/04</further-classification>  
        <further-classification edition="200601120251212B">F25D31/00</further-classification>  
        <further-classification edition="200601120251212B">F26B5/06</further-classification>  
        <further-classification edition="202501120251212B">A23B2/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＺＥＲＯ　ＦＯＯＤ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZERO FOOD CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木野正人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINO, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮谷茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYATANI, SHIGERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂田剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKATA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">將反射98%以上的潛熱紅外線的紅外線反射板配置於凍結室的內表面整面，將食品凍結時的凍結潛熱紅外線返回至食品表面，來延遲表面的凍結，以使凍結從內部開始，並用未凍結的表層部吸收內部的凍結膨脹，藉此能夠提升凍結的品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">By disposing an infrared reflecting plate, which reflects 98% or more of latent-heat infrared radiation, over the entire inner surface of the freezing chamber, the latent-heat infrared rays during the freezing of food is reflected back to the food surface, thereby delaying surface freezing and initiating freezing from the interior, and enables the unfrozen surface layer to absorb the internal freezing expansion, thereby improving the quality of the freezing process.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1663" publication-number="202611103"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611103.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611103</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>負型感光性樹脂組合物、使用其之硬化膜、硬化浮凸圖案之製造方法及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">C08F2/50</main-classification>  
        <further-classification edition="200601120251209B">C08G73/12</further-classification>  
        <further-classification edition="200601120251209B">C08L79/08</further-classification>  
        <further-classification edition="200601120251209B">C08K5/3462</further-classification>  
        <further-classification edition="200601120251209B">G03F7/004</further-classification>  
        <further-classification edition="200601120251209B">G03F7/40</further-classification>  
        <further-classification edition="200601120251209B">H01L23/522</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩間翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAMA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北畠大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITABATAKE, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小倉知士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGURA, TOMOHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種負型感光性樹脂組合物，其包含下述(A)～(C)成分： &lt;br/&gt;(A)聚醯亞胺前驅物、及/或聚醯亞胺、 &lt;br/&gt;(B)光聚合起始劑、以及 &lt;br/&gt;(C)自由基聚合性化合物， &lt;br/&gt;上述(C)成分包含(C1)具有茀骨架之化合物， &lt;br/&gt;相對於總固形物成分質量，上述(C1)具有茀骨架之化合物除外之分子量為370以上且未達3000之化合物之質量比率為2.4質量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1664" publication-number="202612367"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612367.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612367</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理擁塞拒絕的方法和設備</chinese-title>  
        <english-title>METHODS AND APPARATUS FOR CONGESTION REJECTION HANDLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W28/02</main-classification>  
        <further-classification edition="201801120251201B">H04W76/18</further-classification>  
        <further-classification edition="200901120251201B">H04W48/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅韻帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, YUN-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林雨新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊詠竣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YUNG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YOU-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提出處理擁塞拒絕的方法和設備。其中一處理擁塞拒絕的方法包括由設備的處理器接收具有指示擁塞的原因值的NAS消息；以及  在該設備被配置為高優先級設備時，由該處理器執行移動性管理，其中該移動性管理包括：基於重試計數器啟動重試計時器；增加重試計數器的值；以及基於該重試計時器確定是否啟動移動性管理過程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus and methods are provided for congestion rejection handling. In one novel aspect, a method may involve an apparatus receiving a non-access stratum (NAS) message with a cause value indicating a congestion. The method may also involve the apparatus performing a mobility management in an event that the apparatus is configured as a high priority apparatus. The performing of the mobility management includes starting a reattempting timer based on a reattempting counter, increasing the reattempting counter, and determining whether to initiate a mobility management procedure based on the reattempting timer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:過程</p>  
        <p type="p">410-420:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1665" publication-number="202612189"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612189.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612189</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129148</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250917B">H01R13/46</main-classification>  
        <further-classification edition="200601120250917B">H01R13/40</further-classification>  
        <further-classification edition="200601120250917B">H01R13/24</further-classification>  
        <further-classification edition="200601120250917B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商莫仕有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLEX, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊喆元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHE-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接裝置，包含一連接器組件及一散熱器組件。所述連接器組件包括供一可插拔組件沿一插接方向插入的一插接通道。所述散熱器組件設置在所述連接器組件外，並包括一液冷板及一可滑動機構。所述液冷板具有一主體及一散熱座。所述主體用以供冷卻液在其內部流動。所述散熱座可相對於所述主體浮動並用以與所述可插拔組件熱接合。所述可滑動機構可移動地設置於所述液冷板，且所述可滑動機構的一部分伸入至所述插接通道並能夠供所述可插拔組件推抵。所述可滑動機構在所述可插拔組件插入所述插接通道的過程中，受到所述可插拔組件推動而連動所述散熱座由與所述可插拔組件間隔的狀態變換成觸抵所述可插拔組件的狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:連接器組件</p>  
        <p type="p">211:插接通道</p>  
        <p type="p">211a:窗口</p>  
        <p type="p">33:散熱座</p>  
        <p type="p">331:散熱主體部</p>  
        <p type="p">332:緣延伸部</p>  
        <p type="p">333:鰭片部</p>  
        <p type="p">4:可滑動機構</p>  
        <p type="p">41:致動件</p>  
        <p type="p">411:致動件本體部</p>  
        <p type="p">412:突出部</p>  
        <p type="p">413:接觸部</p>  
        <p type="p">414:活動孔</p>  
        <p type="p">415:壓抵部</p>  
        <p type="p">42:彈性件</p>  
        <p type="p">X:插接方向</p>  
        <p type="p">Y:排列方向</p>  
        <p type="p">Z:上下方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1666" publication-number="202610646"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610646.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610646</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129188</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硫甲基羰基化合物及其作為ＨＤＡＣ６抑制劑的用途</chinese-title>  
        <english-title>THIOMETHYL CARBONYL COMPOUNDS AND USE THEREOF AS HDAC6 INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">A61K31/535</main-classification>  
        <further-classification edition="200601120251208B">A61K31/519</further-classification>  
        <further-classification edition="200601120251208B">A61K31/517</further-classification>  
        <further-classification edition="200601120251208B">A61K31/4965</further-classification>  
        <further-classification edition="200601120251208B">A61K31/4375</further-classification>  
        <further-classification edition="200601120251208B">A61P37/00</further-classification>  
        <further-classification edition="200601120251208B">A61P35/00</further-classification>  
        <further-classification edition="200601120251208B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商奧古斯丁治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUGUSTINE THERAPEUTICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑟倫尼爾　西爾文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CELANIRE, SYLVAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆柏茲　佛瑞德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROMBOUTS, FREDERIK JAN RITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯杰里　巴蒂斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUGERI, BAPTISTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於式(I)化合物 &lt;br/&gt;&lt;img align="absmiddle" height="130px" width="371px" file="ed10899.JPG" alt="ed10899.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;或其醫藥上可接受之鹽及/或溶劑合物， &lt;br/&gt;其中&lt;b&gt;Y&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;為9員或10員雙環雜芳基，&lt;b&gt;X&lt;/b&gt;及&lt;b&gt;W&lt;/b&gt;為碳或氮，&lt;b&gt;L&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;及&lt;b&gt;L&lt;sup&gt;2&lt;/sup&gt;&lt;/b&gt;為簡單鍵或連接體，且&lt;b&gt;Z&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;及&lt;b&gt;R&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;為氫或各種基團。 &lt;br/&gt;本發明進一步係關於式(I)化合物，其係作為HDAC6抑制劑，典型地用於治療及/或預防諸如癌症之HDAC6相關疾病、神經退化性疾病、神經病變或心血管疾病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a compound of formula (I) &lt;br/&gt;&lt;img align="absmiddle" height="114px" width="366px" file="ed10900.JPG" alt="ed10900.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;or a pharmaceutically acceptable salt and/or solvate thereof, &lt;br/&gt;wherein&lt;b&gt;Y&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt; is a 9-or 10-membered bicyclic heteroaryl, &lt;b&gt;X &lt;/b&gt;and&lt;b&gt; W &lt;/b&gt;arecarbon ornitrogen, &lt;b&gt;L&lt;sup&gt;1 &lt;/sup&gt;&lt;/b&gt;and&lt;b&gt; L&lt;sup&gt;2&lt;/sup&gt;&lt;/b&gt;aresimple bonds or linkers, and &lt;b&gt;Z&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;and&lt;b&gt;R&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;arehydrogen or various groups. &lt;br/&gt;The present invention further relates to a compound of formula (I) as HDAC6 inhibitor, typically for use in the treatment and/or the prevention of an HDAC6-associated disease, such as cancers, neurodegenerative diseases, neuropathies or cardiovascular diseases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1667" publication-number="202611222"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611222.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611222</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏光片、偏光板、附光學層之偏光板、圖像顯示面板、圖像顯示裝置</chinese-title>  
        <english-title>POLARIZER, POLARIZING PLATE, POLARIZING PLATE WITH OPTICAL LAYER, IMAGE DISPLAY PANEL, IMAGE DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C08L29/04</main-classification>  
        <further-classification edition="200601120251211B">C08J5/18</further-classification>  
        <further-classification edition="200601120251211B">G02B5/30</further-classification>  
        <further-classification edition="200601120251211B">B32B27/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久米悦夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUME, ETSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村勇気</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, YUUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種可抑制高溫環境下偏光片之色相變化的偏光片。 &lt;br/&gt;本發明之解決手段係一種偏光片1，其係由聚乙烯醇系樹脂膜形成，且包含鋰原子，並且經元素分析求得的鋰原子之含量為0.005質量%以上0.100質量%以下。鋰原子藉由與聚乙烯醇之羥基之氫原子進行離子交換來抑制脫水反應，從而抑制聚烯化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An objective of present invention is to provide a polarizer that can suppress the change in hue of the polarizer in a high-temperature environment. &lt;br/&gt;As a solution in the present invention is a polarizer 1 which is formed from a polyvinyl alcohol resin film and contains lithium atom. The content of the lithium atom, determined by elemental analysis, is 0.005 mass% or more and 0.100 mass% or less. The lithium atom is believed to suppress the dehydration reaction by performing ion exchange with the hydrogen atoms of the hydroxyl groups of the polyvinyl alcohol, thereby suppressing polyene formation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:偏光片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1668" publication-number="202612377"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612377.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612377</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129229</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊方法及通訊裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND COMMUNICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H04W72/04</main-classification>  
        <further-classification edition="200601120251201B">H04L27/26</further-classification>  
        <further-classification edition="200601120251201B">H04L5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王碧釵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, BICHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏秀紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, XIUHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李雪茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XUERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周永行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YONGXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種通訊方法及通訊裝置。方法包括：接收第一指示資訊，第一指示資訊指示與第一序列關聯的第一參數，第一參數的取值和第一序列的長度是用以確定第三序列的長度；第一頻域資源上發送及/或接收參考訊號，參考訊號是基於第三序列所產生，第三序列是基於第一序列及第一參數所產生，第一頻域資源包括的頻域單元之個數大於或等於第三序列的長度。基於此，可根據實際通訊情況，配置合適的第一參數和第一序列。例如，可基於盡可能地提升感測效能，為終端設備配置第一序列以及與第一序列關聯的第一參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a communication method and a communication device. The method includes: receiving first indication information, where the first indication information indicates a first parameter associated with a first sequence, and the value of the first parameter and the length of the first sequence are used to determine the length of a third sequence; transmitting and/or receiving reference signals on a first frequency domain resource, where the reference signals are generated based on the third sequence, and the third sequence is generated based on the first sequence and the first parameter, and the number of frequency domain units included in the first frequency domain resource is greater than or equal to the length of the third sequence. Based on this, appropriate first parameters and first sequences can be configured according to actual communication conditions. For example, the first sequence and the first parameter associated with the first sequence can be configured for terminal devices to enhance sensing performance as much as possible.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:方法</p>  
        <p type="p">S510、S520:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1669" publication-number="202612310"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612310.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612310</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129230</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法和通信裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND COMMUNICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H04L27/26</main-classification>  
        <further-classification edition="200601120251201B">H04L5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王碧釵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, BICHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏秀紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, XIUHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李雪茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XUERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周永行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YONGXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種通信方法和通信裝置。方法包括：生成第一信號，第一信號是通過對第二信號執行第一變換得到的，其中，第一信號包括N個第一子信號，第一子信號包括L個元素，第二信號包括N個第二子信號，第二子信號包括L個元素；在第一資源上發送第三信號，第三信號是基於從N個第一子信號中的每個第一子信號中選取M個元素生成的；其中，N表示第一資源包括的時域單元的個數，M表示第一資源包括的頻域單元的個數，M、L、以及第一參數的取值之間關聯，N為大於1的整數，M為正整數，L為大於M的整數。本申請中，L大於M，因此可以在M個頻域單元上傳輸L（大於M）個調製符號，提升頻譜效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a communication method and a communication device. The method includes: generating a first signal, which is obtained by performing a first transformation on a second signal, wherein the first signal includes N first sub-signals, each first sub-signal includes L elements, the second signal includes N second sub-signals, each second sub-signal includes L elements; transmitting a third signal on a first resource, wherein the third signal is generated by selecting M elements from each of the N first sub-signals; wherein N represents the number of time-domain units included in the first resource, M represents the number of frequency-domain units included in the first resource, the values of M, L, and a first parameter are related, N is an integer greater than 1, M is a positive integer, and L is an integer greater than M. In this application, L is greater than M, thus allowing the transmission of L (greater than M) modulation symbols on M frequency-domain units, thereby improving spectral efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:方法</p>  
        <p type="p">S510、S520:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1670" publication-number="202610818"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610818.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610818</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129232</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏光片、偏光板、附光學層之偏光板、圖像顯示面板、圖像顯示裝置</chinese-title>  
        <english-title>POLARIZER, POLARIZING PLATE, POLARIZING PLATE WITH OPTICAL LAYER, IMAGE DISPLAY PANEL, IMAGE DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">B32B7/10</main-classification>  
        <further-classification edition="200601120251211B">B32B27/30</further-classification>  
        <further-classification edition="201501120251211B">G02B1/14</further-classification>  
        <further-classification edition="200601120251211B">G02B5/30</further-classification>  
        <further-classification edition="200601120251211B">G02F1/1335</further-classification>  
        <further-classification edition="200601120251211B">C08J5/18</further-classification>  
        <further-classification edition="200601120251211B">C08L29/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久米悦夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUME, ETSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村勇気</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, YUUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種可抑制高溫環境下偏光片之色相變化的偏光&lt;br/&gt; 片。 &lt;br/&gt;本發明之解決手段係一種偏光片1，其係由聚乙烯醇系樹脂膜形成，且包含鉀原子、及選自下述A群組中的至少一種原子，並且經元素分析求得的選自下述A群組中的至少一種原子之含量合計為0.10質量%以上。該原子藉由結合聚乙烯醇的羥基來抑制脫水反應，從而抑制聚烯化。 &lt;br/&gt;A群組：屬於鹼金屬之原子(排除鉀原子)、屬於鹼土金屬之原子、鋁原子、鉻原子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An objective of present invention provides a polarizer that can suppress the change in hue of the polarizer in a high-temperature environment. &lt;br/&gt;As a solution in the present invention is a polarizer 1 formed from a polyvinyl alcohol resin film and contains potassium atom and at least one kind of atom selected from Group A below. The total content of the at least one kind of atom selected from Group A, determined by elemental analysis, is 0.10 mass% or more. It is believed that this atom suppresses the dehydration reaction by bonding to the hydroxyl groups of the polyvinyl alcohol, thereby suppressing polyene formation. &lt;br/&gt;Group A: atoms belonging to alkali metals (excluding potassium atom), atoms belonging to alkaline earth metals, aluminum atom, and chromium atom.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:偏光片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1671" publication-number="202612374"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612374.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612374</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括傳送功率控制（TPC）之個別功率控制</chinese-title>  
        <english-title>SEPARATE POWER CONTROL INCLUDING TRANSMIT POWER CONTROL (TPC)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W52/04</main-classification>  
        <further-classification edition="202301120251201B">H04W72/12</further-classification>  
        <further-classification edition="200901120251201B">H04W88/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鍾賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JONGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肯貝吉　納茲利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHAN BEIGI, NAZLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MOON IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬里內爾　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARINIER, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾漢斯　阿塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL HAMSS, AATA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加西亞　維吉爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARCIA, VIRGILE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供了一種無線傳輸/接收單元 (WTRU)，其維護第一和第二傳輸功率控制 (TPC) 累加器。WTRU從基地台接收一個配置，該配置包含分別與第一和第二TPC累加器相關聯的第一和第二集合之功率控制 (PC) 參數。WTRU從基地台接收與第一TPC累加器相關聯的第一TPC指令。如果第二TPC累加器依賴第一TPC累加器，則WTRU基於第一TPC指令更新第一TPC累加器和第二TPC累加器。WTRU可以維護多個TPC累加器，並且可以為不同的TPC累加器實作不同的TPC過程。不同的TPC累加器可以與不同的符號類型相關聯。因此，WTRU可以透過利用對應的TPC累加器，以不同的傳輸功率等級動態地傳輸一個或多個上行鏈通道及/或一個或多個上鏈訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a wireless transmit/receive unit (WTRU) that maintains first and second transmit power control (TPC) accumulators. The WTRU receives, from a base station, a configuration including first and second sets of power control (PC) parameters associated with the first and second TPC accumulators, respectively. The WTRU receives a first TPC command, associated with the first TPC accumulator, from the base station. The WTRU updates the first TPC accumulator and the second TPC accumulator based on the first TPC command if the second TPC accumulator is dependent on the first TPC accumulator. The WTRU may maintain multiple TPC accumulators and may implement different TPC processes for different TPC accumulators. The different TPC accumulators may be associated with different symbol types. Hence, the WTRU may dynamically transmit one or more uplink channels and/or one or more uplink signals at different transmit power levels by utilizing corresponding TPC accumulators.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700、710、720、730、740、750、760、770:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1672" publication-number="202611175"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611175.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611175</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129249</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶配向劑、液晶配向膜及液晶元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">C08G73/10</main-classification>  
        <further-classification edition="200601120250901B">C08G77/38</further-classification>  
        <further-classification edition="200601120250901B">C08F212/14</further-classification>  
        <further-classification edition="200601120250901B">C08F220/06</further-classification>  
        <further-classification edition="200601120250901B">C08F220/10</further-classification>  
        <further-classification edition="200601120250901B">C08F222/40</further-classification>  
        <further-classification edition="200601120250901B">C08L25/18</further-classification>  
        <further-classification edition="200601120250901B">C08L33/02</further-classification>  
        <further-classification edition="200601120250901B">C08L33/14</further-classification>  
        <further-classification edition="200601120250901B">C08L79/08</further-classification>  
        <further-classification edition="200601120250901B">C08L83/06</further-classification>  
        <further-classification edition="200601120250901B">C08K5/13</further-classification>  
        <further-classification edition="200601120250901B">C08K5/17</further-classification>  
        <further-classification edition="200601120250901B">C08K5/205</further-classification>  
        <further-classification edition="200601120250901B">C08K5/3432</further-classification>  
        <further-classification edition="200601120250901B">C08K5/3445</further-classification>  
        <further-classification edition="200601120250901B">C08K5/5419</further-classification>  
        <further-classification edition="200601120250901B">G02F1/1337</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中宏樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上嘉崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, YOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種液晶配向劑，其能夠獲得可迅速地緩和蓄積電荷，且密封密接性、耐雜質性及高溫背光可靠性優異的液晶配向膜。一種液晶配向劑，含有聚合物成分以及化合物[A]，所述化合物[A]為選自由式（1）所表示的化合物及式（2）所表示的化合物所組成的群組中的至少一種。式（1）及式（2）中，Y&lt;sup&gt;11&lt;/sup&gt;及Y&lt;sup&gt;21&lt;/sup&gt;為碳原子、氮原子等。X&lt;sup&gt;11&lt;/sup&gt;及X&lt;sup&gt;21&lt;/sup&gt;為二價連結基。R&lt;sup&gt;11&lt;/sup&gt;及R&lt;sup&gt;21&lt;/sup&gt;為含氮雜環基。X&lt;sup&gt;12&lt;/sup&gt;為二價鏈狀烴基等。X&lt;sup&gt;12&lt;/sup&gt;中的將Y&lt;sup&gt;11&lt;/sup&gt;與R&lt;sup&gt;12&lt;/sup&gt;連結的直鏈是由四個以上的原子利用單鍵連結而構成。R&lt;sup&gt;12&lt;/sup&gt;為經保護的胺基等。X&lt;sup&gt;22&lt;/sup&gt;為單鍵或二價連結基。R&lt;sup&gt;22&lt;/sup&gt;為氫原子或一價有機基，R&lt;sup&gt;22&lt;/sup&gt;存在多個，多個R&lt;sup&gt;22&lt;/sup&gt;中的至少一個為一價有機基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1673" publication-number="202610548"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610548.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610548</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129260</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>功能性組成物及其製造方法</chinese-title>  
        <english-title>FUNCTIONAL COMPOSITION AND METHOD OF PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251204B">A23L29/244</main-classification>  
        <further-classification edition="201601120251204B">A23L33/125</further-classification>  
        <further-classification edition="201601120251204B">A23L33/16</further-classification>  
        <further-classification edition="200601120251204B">A61K31/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雪國農業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKIGUNI AGURI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋元英梨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIMOTO, ERI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>室井文篤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUROI, FUMIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種在含有甘露糖及/或甘露寡醣之組成物中，減少了二氧化硫之功能性組成物。 &lt;br/&gt;在將源自成為原料之蒟蒻芋的蒟蒻粉予以分解後，將得到之含有甘露糖及/或甘露寡醣之組成物在105℃以上予以加熱處理，藉此能夠減少功能性組成物中的二氧化硫濃度。減少了二氧化硫(亞硫酸)之功能性組成物，在法規上沒有問題，變得可作為飲食品流通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The objective of the present invention is to provide a functional composition containing mannose and/or mannooligosaccharide and having the reduced sulfur dioxide content. The objective can be achieved to decompose konjac flour derived from konjac potatoes, which is a raw material to obtain a composition containing mannose and/or mannooligosaccharide followed by subjecting the composition to heat treatment at a temperature of 105 °C or higher to reduce the sulfur dioxide content in the functional composition. The functional composition with sulfur dioxide (sulfurous acid) reduced can be distributed as foods and beverages without any legal or regulatory problem.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1674" publication-number="202610640"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610640.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610640</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129264</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>毒蕈鹼M4受體促效劑及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/519</main-classification>  
        <further-classification edition="200601120251201B">A61K31/437</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4155</further-classification>  
        <further-classification edition="200601120251201B">A61P25/00</further-classification>  
        <further-classification edition="200601120251201B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商海思科醫藥集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAISCO PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張國彪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GUOBIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀羚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YAOLING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張敏杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, MINJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘啟杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, QIJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王浩東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAODONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>耿鵬鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENG, PENGXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐營德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, YINGDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張浩亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HAOLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴龐科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, PANGKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種CHRM4受體促效劑及其用途，特別地，本發明公開了一種式(I)所示的化合物，或其立體異構體或藥學上可接受的鹽和它們的藥物組合物，及其在製備治療/預防CHRM4介導的疾病的藥物中的用途，式(I)中各基團如說明書之定義。 &lt;br/&gt;&lt;img align="absmiddle" height="87px" width="297px" file="ed10840.JPG" alt="ed10840.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1675" publication-number="202611630"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611630.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611630</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129295</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光罩檢測裝置以及調整光罩檢測裝置的方法</chinese-title>  
        <english-title>MASK INSPECTION DEVICE AND METHOD FOR ADJUSTING A MASK INSPECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251202B">G03F1/84</main-classification>  
        <further-classification edition="201201120251202B">G03F1/76</further-classification>  
        <further-classification edition="202501120251202B">H10F39/12</further-classification>  
        <further-classification edition="200601120251202B">G02B27/18</further-classification>  
        <further-classification edition="200601120251202B">G02B13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷克波姆　鹿茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREKERBOHM, LUTZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅德　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROEDER, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光罩檢測裝置包含：一真空外殼（28）、一EUV相機（23）以及一投影透鏡（22），該投影透鏡設置在該真空外殼（28）內部，其中該投影透鏡用於將EUV 光罩（17）的一部分（20）成像到該EUV相機（23）的影像感測器（24）上。該EUV相機（23）安裝在該真空外殼（28）上。該光罩檢測裝置包含一致動器（50），其中該致動器用於調整該EUV相機（23）位置，且該致動器（50）作用於設置在該真空外殼（28）與該EUV相機（23）之間的該轉換構件（43）。該轉換構件（43）將該致動器（50）的致動行程（48）轉換為該EUV相機（23） 的調整行程 （47），其中該致動行程（48）長於該調整行程 （47）。本發明亦關於一種用於調整光罩檢測裝置的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Mask inspection device, comprising a vacuum housing (28), an EUV camera (23) and, arranged in the interior of the vacuum housing (28), a projection lens (22) for imaging at least one portion (20) of an EUV photomask (17) onto an image sensor (24) of the EUV camera (23). The EUV camera (23) is mounted on the vacuum housing (28). The mask inspection device comprises an actuator (50) for adjusting the position of the EUV camera (23), wherein the actuator (50) acts on a conversion member (43) arranged between the vacuum housing (28) and the EUV camera (23). The conversion member (43) converts an actuation travel (48) of the actuator (50) into an adjusting travel (47) of the EUV camera (23), wherein the actuation travel (48) is longer than the adjusting travel (47). The invention also relates to a method for adjusting a mask inspection device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">23:EUV相機</p>  
        <p type="p">28:真空外殼</p>  
        <p type="p">31:真空法蘭/法蘭</p>  
        <p type="p">36:致動器單元</p>  
        <p type="p">37:柔性壁部/波紋管</p>  
        <p type="p">43:轉換構件/液壓轉換構件</p>  
        <p type="p">44:驅動馬達</p>  
        <p type="p">45:輸出活塞</p>  
        <p type="p">46:輸入活塞</p>  
        <p type="p">47:調整行程</p>  
        <p type="p">48:致動行程/Z方向</p>  
        <p type="p">49:內部/腔體</p>  
        <p type="p">50:致動器</p>  
        <p type="p">51:螺桿</p>  
        <p type="p">52:螺桿套筒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1676" publication-number="202611789"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611789.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611789</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有量化之張量矩陣乘法</chinese-title>  
        <english-title>TENSOR MATRIX MULTIPLICATION WITH QUANTIZATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">G06N3/10</main-classification>  
        <further-classification edition="201801120251211B">G06F9/44</further-classification>  
        <further-classification edition="201901120251211B">G06F16/17</further-classification>  
        <further-classification edition="200601120251211B">G06N3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里奇丹拿　塞德瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LICHTENAU, CEDRIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛瑞納　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREINER, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲古力　瑞文　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIGULI, RAZVAN PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴比克　賽門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUBECK, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供具有量化之張量乘法，其包括：獲得第一輸入張量及第二輸入張量；基於該第一輸入張量之元素及該第二輸入張量之元素獲得一所選資料類型之元素；對該所選資料類型之該等元素執行矩陣乘法，該矩陣乘法包括執行中間結果之量化，且該量化縮放該等中間結果以提供該矩陣乘法之縮放結果；以及使用該等縮放結果產生用於一輸出張量之輸出元素。對一輸入張量之元素執行可選額外量化，以提供用於該矩陣乘法的該所選資料類型之該等元素中之至少一些。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Tensor multiplication with quantization includes obtaining first and second input tensors, obtaining elements of a selected data type based on elements of the first input tensor and elements of the second input tensor, performing matrix multiplication on the elements of the selected data type, the matrix multiplication including performing quantization of intermediate results, and the quantization scaling the intermediate results to provide scaled results of the matrix multiplication, and generating output elements, for an output tensor, using the scaled results. Optional additional quantization is performed on elements of an input tensor to provide at least some of the elements of the selected data type for the matrix multiplication.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1302:步驟</p>  
        <p type="p">1304:步驟</p>  
        <p type="p">1306:步驟</p>  
        <p type="p">1308:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1677" publication-number="202611790"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611790.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611790</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129306</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>張量矩陣乘法中之維度控制</chinese-title>  
        <english-title>DIMENSION CONTROL IN TENSOR MATRIX MULTIPLICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">G06N3/10</main-classification>  
        <further-classification edition="200601120251211B">G06F17/16</further-classification>  
        <further-classification edition="201801120251211B">G06F9/44</further-classification>  
        <further-classification edition="200601120251211B">G06N3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里奇丹拿　塞德瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LICHTENAU, CEDRIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴比克　賽門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUBECK, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧保　普里坦　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOBO, PREETHAM M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛瑞納　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREINER, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供張量乘法中之維度控制，其包括：獲得第一輸入張量及第二輸入張量以用於矩陣乘法；獲得一維度控制指示符，其指示該第一輸入張量之待用作用於該矩陣乘法之一共同維度的一第一維度，且指示該第二輸入張量之待用作用於該矩陣乘法之該共同維度的一第二維度；以及執行該矩陣乘法以獲得一或多個結果，其中執行該矩陣乘法包括基於由該維度控制指示符指示之該第一維度選擇該第一輸入張量之至少一個向量，且基於由該維度控制指示符指示之該第二維度選擇該第二輸入張量之至少一個向量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Dimension control in tensor multiplication includes obtaining first and second input tensors for matrix multiplication, obtaining a dimension control indicator that indicates a first dimension for the first input tensor to use as a common dimension for the matrix multiplication and indicates a second dimension for the second input tensor to use as the common dimension for the matrix multiplication, and performing the matrix multiplication to obtain one or more results, where performing the matrix multiplication includes selecting at least one vector of the first input tensor based on the first dimension indicated by the dimension control indicator and selecting at least one vector of the second input tensor based on the second dimension indicated by the dimension control indicator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1402:步驟</p>  
        <p type="p">1404:步驟</p>  
        <p type="p">1406:步驟</p>  
        <p type="p">1408:步驟</p>  
        <p type="p">1410:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1678" publication-number="202611791"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611791.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611791</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129307</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>張量轉換</chinese-title>  
        <english-title>TENSOR TRANSFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">G06N3/10</main-classification>  
        <further-classification edition="200601120251211B">G06F17/16</further-classification>  
        <further-classification edition="201801120251211B">G06F9/44</further-classification>  
        <further-classification edition="200601120251211B">G06N3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里奇丹拿　塞德瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LICHTENAU, CEDRIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛瑞納　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREINER, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史洛格　提姆西　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SLEGEL, TIMOTHY J</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧保　普里坦　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOBO, PREETHAM M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供張量轉換，其包括：獲得具有一第一資料佈局格式及一第一資料類型之元素的一輸入張量；以及重新格式化該輸入張量以提供具有一第二資料佈局格式及一第二資料類型之元素的一輸出張量，其中該第二資料佈局格式不同於該第一資料佈局格式，且該第二資料類型不同於該第一資料類型。視情況，該重新格式化包括對該輸入張量之輸入元素的元素量化，其中對該輸入張量之一輸入元素執行的該元素量化包括將該輸入元素變換為該第二資料類型之一輸出元素，作為該輸出張量之一元素，該變換使用比例值來對該輸入元素進行縮放，使用偏移值來施加一偏移，且使用裁剪最大值及裁剪最小值來強制實施該輸出元素之一最大值及一最小值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Tensor transformation includes obtaining an input tensor having a first data-layout format and elements of a first data type, and reformatting the input tensor to provide an output tensor having a second data-layout format and elements of a second data type, where the second data-layout is different from the first data-layout format and the second data type is different from the first data type. Optionally, the reformatting includes element quantization on input elements of the input tensor, where the element quantization performed on an input element of the input tensor includes converting the input element to an output element, of the second data type, as an element of the output tensor, using the scale value to scale to the input element, the offset value to apply an offset, and the clip maximum and clip minimum values to enforce a maximum value and a minimum value for the output element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1302:步驟</p>  
        <p type="p">1304:步驟</p>  
        <p type="p">1306:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1679" publication-number="202611792"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611792.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611792</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129308</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有維度廣播之張量處理</chinese-title>  
        <english-title>TENSOR PROCESSING WITH DIMENSION BROADCASTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">G06N3/10</main-classification>  
        <further-classification edition="200601120251208B">G06N3/06</further-classification>  
        <further-classification edition="200601120251208B">G06F17/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里奇丹拿　塞德瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LICHTENAU, CEDRIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛瑞納　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREINER, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴比克　賽門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUBECK, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲古力　瑞文　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIGULI, RAZVAN PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供具有廣播之張量處理，其包括：獲得一第一輸入張量，該第一輸入張量包括一具有索引大小1之維度；以及使用該第一輸入張量及一第二輸入張量執行一人工智慧處理運算以獲得結果，該第二輸入張量包括一具有大於1之索引大小之維度，其中執行該人工智慧處理運算包括廣播該第一輸入張量之該具有索引大小1之維度以匹配該第二輸入張量之該具有大於1之索引大小之維度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Tensor processing with broadcasting includes obtaining a first input tensor, the first input tensor including a dimension of index size one, and performing an artificial intelligence processing operation using the first input tensor and a second input tensor to obtain results, the second input tensor including a dimension of index size greater than one, where performing the artificial intelligence processing operation includes broadcasting the dimension of index size one of the first input tensor to match the dimension of index size greater than one of the second input tensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1402:步驟</p>  
        <p type="p">1404:步驟</p>  
        <p type="p">1406:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1680" publication-number="202611976"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611976.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611976</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129314</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title>PLASMA PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01J37/32</main-classification>  
        <further-classification edition="200601120251205B">H05H1/46</further-classification>  
        <further-classification edition="200601120251205B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>輿水地塩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSHIMIZU, CHISHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所揭示之電漿處理裝置具有基板支持器。基板支持器具有支持基板之第1區域及支持邊緣環之第2區域。第1電極設置於第1區域內，第2電極設置於第2區域內。第1偏壓電源經由第1電路連接於第1電極。第2偏壓電源經由第2電路連接於第2電極。第2電路於第1偏壓電源產生之第1電性偏壓及第2偏壓電源產生之第2電性偏壓之共通之偏壓頻率下具有較第1電路之阻抗高之阻抗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A disclosed plasma processing apparatus includes a substrate support. The substrate support has a first region configured to support a substrate and a second region configured to support an edge ring. The first electrode is provided in the first region. The second electrode is provided in the second region. The first bias power source is connected to the first electrode via the first circuit. The second bias power source is connected to the second electrode via the second circuit. The second circuit has impedance higher than impedance of the first circuit at a common bias frequency of a first electrical bias generated by the first bias power source and a second electrical bias generated by the second bias power source.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">10:腔室</p>  
        <p type="p">10s:內部空間</p>  
        <p type="p">16:基板支持器</p>  
        <p type="p">18:下部電極</p>  
        <p type="p">20:靜電吸盤</p>  
        <p type="p">20d:介電體部</p>  
        <p type="p">21:第1區域</p>  
        <p type="p">21a:電極</p>  
        <p type="p">21c:第1電極</p>  
        <p type="p">22:第2區域</p>  
        <p type="p">22a:電極</p>  
        <p type="p">22b:電極</p>  
        <p type="p">22c:第2電極</p>  
        <p type="p">22g:氣體管線</p>  
        <p type="p">55:直流電源</p>  
        <p type="p">56:開關</p>  
        <p type="p">57:高頻電源</p>  
        <p type="p">58:匹配器</p>  
        <p type="p">61:第1偏壓電源</p>  
        <p type="p">62:阻尼電路</p>  
        <p type="p">63:第1電路</p>  
        <p type="p">64:濾波器</p>  
        <p type="p">71:直流電源</p>  
        <p type="p">72:開關</p>  
        <p type="p">73:濾波器</p>  
        <p type="p">74:直流電源</p>  
        <p type="p">75:開關</p>  
        <p type="p">76:濾波器</p>  
        <p type="p">81:第2偏壓電源</p>  
        <p type="p">82:阻尼電路</p>  
        <p type="p">83:第2電路</p>  
        <p type="p">84:濾波器</p>  
        <p type="p">86:氣體供給機構</p>  
        <p type="p">ER:邊緣環</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1681" publication-number="202611995"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611995.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611995</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129343</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基材之接合與去接合之方法</chinese-title>  
        <english-title>METHOD FOR THE BONDING AND DEBONDING OF SUBSTRATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">H01L21/26</main-classification>  
        <further-classification edition="200601120251215B">H01L21/673</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商ＥＶ集團Ｅ塔那有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EV GROUP E. THALLNER GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯格拉夫　喬根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURGGRAF, JURGEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威司鮑爾　哈拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIESBAUER, HARALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種經由連接層(4)將產品基材(2)接合至載體基材(5)之方法，其中將可溶層(3)施加於該連接層(4)與該產品基材(2)之間，及其中 &lt;br/&gt;a)該可溶層(3)可因與輻射源之電磁輻射相互作用而溶解，及 &lt;br/&gt;b)該連接層(4)及該載體基材(5)對該電磁輻射係至少主要透明的。 &lt;br/&gt;此外，本發明係關於用於自經由連接層(4)接合至產品基材(2)之載體基材(5)去接合該產品基材(2)之方法，其中一可溶層(3)施加於該連接層(4)與該產品基材(2)之間，及其中 &lt;br/&gt;a)該可溶層(3)係通過與輻射源之電磁輻射相互作用而溶解，及 &lt;br/&gt;b)該連接層(4)及該載體基材(5)對該電磁輻射係至少主要透明的。 &lt;br/&gt;此外，本發明係關於相應之產品基材至載體基材之接合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for bonding a product substrate (2) to a carrier substrate (5) via a connection layer (4), wherein a soluble layer (3) is applied between the connection layer (4) and the product substrate (2), and wherein &lt;br/&gt;a) the soluble layer (3) is soluble due to an interaction with an electromagnetic radiation of a radiation source and &lt;br/&gt;b) the connection layer (4) and the carrier substrate (5) are at least predominantly transparent to the electromagnetic radiation. &lt;br/&gt;Furthermore the invention relates to a method for debonding a product substrate (2) from a carrier substrate (5) bonded to the product substrate (2) via a connection layer (4) wherein a soluble layer (3) is applied between the connection layer (4) and the product substrate (2), and wherein &lt;br/&gt;a) the soluble layer (3) is dissolved through an interaction with an electromagnetic radiation of a radiation source, and &lt;br/&gt;b) the connection layer (4) and the carrier substrate (5) are at least predominantly transparent to the electromagnetic radiation. &lt;br/&gt;Furthermore the present invention relates to a corresponding product-substrate-to-carrier-substrate bond.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基材堆疊</p>  
        <p type="p">2:產品基材</p>  
        <p type="p">3:可溶層</p>  
        <p type="p">3o:可溶層之表面</p>  
        <p type="p">4:連接層</p>  
        <p type="p">5:載體基材</p>  
        <p type="p">6:功能單元</p>  
        <p type="p">7:凸起結構</p>  
        <p type="p">9:雷射</p>  
        <p type="p">10:雷射束</p>  
        <p type="p">15:經溶解之可溶層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1682" publication-number="202612378"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612378.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612378</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有單一DL子頻帶的SBFD感知UE</chinese-title>  
        <english-title>SBFD-AWARE UE WITH SINGLE DL SUBBAND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H04W72/04</main-classification>  
        <further-classification edition="200601120251201B">H04L5/14</further-classification>  
        <further-classification edition="200901120251201B">H04W24/10</further-classification>  
        <further-classification edition="200901120251201B">H04W24/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿布達加法爾　穆罕默德賽義德凱里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABDELGHAFFAR, MUHAMMAD SAYED KHAIRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞伯陶　亞麥德阿緹雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABOTABL, AHMED ATTIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊普拉欣　阿普杜勒拉曼穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IBRAHIM, ABDELRAHMAN MOHAMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於在一使用者設備(UE)處之無線通訊的方法及相關設備。在該方法中，UE向網路實體報告與下行鏈路頻寬部分(BWP)中包括的多個下行鏈路子頻帶中的一個下行鏈路子頻帶相關聯的能力。該多個下行鏈路子頻帶對應於第一時域資源。第一時域資源可係子頻帶全雙工(SBFD)符號或SBFD時槽。UE進一步使用來自該多個下行鏈路子頻帶的一經選擇下行鏈路子頻帶與該網路實體進行通訊，該經選擇下行鏈路子頻帶係針對包括該第一時域資源的一或多個時域資源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for wireless communication at a user equipment (UE) and related apparatus are provided. In the method, the UE reports to a network entity a capability associated with one downlink subband among multiple downlink subbands included in a downlink bandwidth part (BWP). The multiple downlink subbands correspond to a first time-domain resource. The first time-domain resource may be a subband full duplex (SBFD) symbol or an SBFD slot. The UE further communicates with the network entity using a selected downlink subband from the multiple downlink subbands for one or more time-domain resources including the first time-domain resource.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1300:呼叫流程圖</p>  
        <p type="p">1302:UE</p>  
        <p type="p">1304:基地台</p>  
        <p type="p">1306,1308,1310,1312,1314,1316,1318,1320,1322,1324,1326:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1683" publication-number="202612201"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612201.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612201</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129389</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光模組</chinese-title>  
        <english-title>LIGHT EMITTING MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251208B">H01S5/022</main-classification>  
        <further-classification edition="202101120251208B">H01S5/0225</further-classification>  
        <further-classification edition="202501120251208B">H10H20/855</further-classification>  
        <further-classification edition="200601120251208B">G02B6/42</further-classification>  
        <further-classification edition="200601120251208B">H01S3/0941</further-classification>  
        <further-classification edition="200601120251208B">H01S3/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日亞化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NICHIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠山和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKEYAMA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中政信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, MASANOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之發光模組包含：支持基體，其具有沿第1方向排列之複數個載置面，複數個載置面之高度沿著第1方向減小；複數個第1雷射光源，其等在各載置面配置1個以上，各自朝第2方向出射第1峰值波長區域之第1雷射光束；複數個第2雷射光源，其等在各載置面配置1個以上，各自朝第3方向出射第2峰值波長區域之第2雷射光束；複數個第1反射鏡構件，其等在各載置面配置1個以上，各自將第1雷射光束朝第1方向反射；複數個第2反射鏡構件，其等在各載置面配置1個以上，各自將第2雷射光束朝第1方向反射；及集光透鏡，其將包含由第1及第2反射鏡構件反射之第1及第2雷射光束之複數個雷射光束耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The light emitting module comprises: a support base having a plurality of placement surfaces aligned in a first direction, heights of the plurality of placement surfaces decreasing in the first direction; a plurality of first light sources, one or more of the plurality of first light sources being arranged on each of the plurality of placement surfaces, each of the plurality of first light sources emitting a first laser beam of a first wavelength region in a second direction; a plurality of second light sources, one or more of the plurality of second light sources being arranged on each of the plurality of placement surfaces, each of the plurality of second light sources emitting a second laser beam of a second wavelength region in a third direction; a plurality of first mirror members, one or more of the plurality of first mirror members being arranged on each of the plurality of placement surfaces, each of the plurality of first mirror members reflecting the first laser beam in the first direction; a plurality of second mirror members, one or more of the plurality of second mirror members being arranged on each of the plurality of placement surfaces, each of the plurality of second mirror members reflecting the second laser beam in the first direction; and a condenser lens coupling a plurality of laser beams including the first laser beam and the second laser beam.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支持基體</p>  
        <p type="p">12a:第1載置面</p>  
        <p type="p">12b:第2載置面</p>  
        <p type="p">20a:第1雷射光源</p>  
        <p type="p">20b:第2雷射光源</p>  
        <p type="p">21a:第1基台(Submount)</p>  
        <p type="p">21b:第2基台(Submount)</p>  
        <p type="p">22a:第1半導體雷射元件</p>  
        <p type="p">22b:第2半導體雷射元件</p>  
        <p type="p">23a:第1透鏡支持構件</p>  
        <p type="p">23b:第2透鏡支持構件</p>  
        <p type="p">24a:第1速軸準直透鏡</p>  
        <p type="p">24b:第2速軸準直透鏡</p>  
        <p type="p">30a:第1慢軸準直透鏡</p>  
        <p type="p">30b:第2慢軸準直透鏡</p>  
        <p type="p">40a:第1反射鏡構件</p>  
        <p type="p">40b:第2反射鏡構件</p>  
        <p type="p">50:集光透鏡</p>  
        <p type="p">50a:速軸集光透鏡</p>  
        <p type="p">50b:慢軸集光透鏡</p>  
        <p type="p">60:光纖</p>  
        <p type="p">62:支持構件</p>  
        <p type="p">100A1:發光模組</p>  
        <p type="p">La:第1雷射光束</p>  
        <p type="p">Lb:第2雷射光束</p>  
        <p type="p">X,Y,Z:軸/方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1684" publication-number="202611320"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611320.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611320</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129394</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在高溫下處理基板的腔室</chinese-title>  
        <english-title>CHAMBER FOR PROCESSING SUBSTRATES AT HIGH TEMPERATURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C23C16/00</main-classification>  
        <further-classification edition="200601120251211B">C23C14/06</further-classification>  
        <further-classification edition="200601120251211B">C23C14/18</further-classification>  
        <further-classification edition="200601120251211B">C30B31/16</further-classification>  
        <further-classification edition="200601120251211B">C30B35/00</further-classification>  
        <further-classification edition="202501120251211B">H10F77/1226</further-classification>  
        <further-classification edition="202501120251211B">H10D84/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格羅內特　克里斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRONET, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯洛斯　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURROWS, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川　大衛正幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, DAVID MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　勁文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KELVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露了一種用於處理SiC基板的處理腔室及方法。該處理腔室包括氣體噴頭；基座，設置於該氣體噴頭下方，該氣體噴頭被配置為使製程氣體流向該基座；保護區域，設置於該基座下方；以及加熱組件，其前側直接面對該基座的背側。該加熱組件進一步包括複數個燈。該基座的該背側和該加熱組件的該前側均暴露於該保護區域，該等燈亦暴露於該保護區域。該處理腔室包括由蓋襯墊遮蔽的蓋、側襯墊遮蔽的上側區段、下側區段和底部區段所形成的腔室主體。該蓋包含冷卻通道。該上側區段亦包含冷卻通道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are a processing chamber and a method for processing a SiC substrate. The processing chamber includes a gas showerhead; a susceptor disposed below the gas showerhead, the gas showerhead configured to flow a process gas toward the susceptor; a protective region disposed below the susceptor; and a heating assembly having a front side facing directly a backside of the susceptor. The heat assembly further includes a plurality of lamps. Both the backside of the susceptor and the front side of the heating assembly are exposed to the protective region. The lamps are also exposed to the protective region. The processing chamber includes a chamber body formed by a lid shielded by a lid liner, an upper side section shielded by a side liner, a lower side section, and a bottom section. The lid includes cooling channels. The upper side section also includes cooling channels.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:加熱組件</p>  
        <p type="p">302:底座</p>  
        <p type="p">304:反射體口袋</p>  
        <p type="p">306:輻射側</p>  
        <p type="p">308:插座側/底壁</p>  
        <p type="p">310:側壁</p>  
        <p type="p">312:反射體冷卻腔室</p>  
        <p type="p">314:底座冷卻腔室</p>  
        <p type="p">316:菲涅耳形狀</p>  
        <p type="p">318:套管</p>  
        <p type="p">320:光管</p>  
        <p type="p">322:反射體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1685" publication-number="202611259"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611259.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611259</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129407</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接著劑組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09J183/07</main-classification>  
        <further-classification edition="200601120251201B">C09J183/05</further-classification>  
        <further-classification edition="201801120251201B">C09J7/30</further-classification>  
        <further-classification edition="201901120251201B">B32B7/06</further-classification>  
        <further-classification edition="200601120251201B">B32B7/12</further-classification>  
        <further-classification edition="200601120251201B">H01L21/683</further-classification>  
        <further-classification edition="200601120251201B">H01L23/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阪口加奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAGUCHI, KANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳井昌樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臼井友輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USUI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森谷俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIYA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸岡高廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIOKA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種接著劑組成物，其係為了製造扇出型半導體封裝，在依序具有支撐基板、剝離劑層、接著劑層、電子裝置基板（具有半導體晶片、及密封半導體晶片之密封層之基板）之積層體中，可形成即使膜厚薄亦可抑制缺陷之接著劑層。此外，提供一種使用該接著劑組成物之積層體、及扇出型半導體封裝之製造方法。 &lt;br/&gt;進一步地，提供一種接著劑組成物，其係為了製造加工後之半導體基板或電子裝置基板，在依序具有支撐基板、剝離劑層、接著劑層、半導體基板或電子裝置基板之積層體中，可形成即使膜厚薄亦可抑制缺陷之接著劑層。此外，提供一種使用該接著劑組成物之積層體、及加工後之半導體基板或電子裝置基板之製造方法。 &lt;br/&gt;本發明之接著劑組成物，其係用於形成接著劑層，該接著劑層係用於暫時接著半導體基板或電子裝置基板、及支撐基板；前述接著劑組成物中，除去固體成分後之溶劑之含量係20質量%以上，且前述溶劑中，沸點150℃以下之溶劑（S）之占有比例，係20質量%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1686" publication-number="202611336"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611336.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611336</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129427</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制電解器電池堆疊之方法</chinese-title>  
        <english-title>METHOD OF CONTROLLING AN ELECTROLYSER CELL STACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">C25B1/02</main-classification>  
        <further-classification edition="202101120251202B">C25B9/21</further-classification>  
        <further-classification edition="201601120251202B">H01M8/2404</further-classification>  
        <further-classification edition="200601120251202B">B01D53/22</further-classification>  
        <further-classification edition="200601120251202B">F25D5/00</further-classification>  
        <further-classification edition="200601120251202B">G06E1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商席瑞絲電力有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CERES POWER LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞利　約書亞　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYLEY, JOSHUA CLAYDON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥格林　大衛　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCGLYNN, DAVID CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈爾馬森　佩爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HJALMARSSON, PER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於控制在電解器系統中之電解器之電解器電池堆疊的方法及控制裝置。該堆疊包含一流體入口及一或多個流體出口。該電解器系統包含一流體溫度控制系統，其用於控制在該流體入口處進入該堆疊之流體的溫度；一功率控制系統，其用於控制對該堆疊之電流供應或電壓供應中之一者，並用於測定對該堆疊之電流供應或電壓供應中之另一者；一入口溫度監測及/或控制系統，其用於測定在該流體入口處之入口溫度；以及一出口溫度監測及/或控制系統，其用於測定在該一或多個流體出口中之至少一者處的出口溫度。該方法包含將對該堆疊之該電流供應控制為一固定輸入電流或將對該堆疊之該電壓供應控制為一固定輸入電壓，並將該入口溫度控制為自一所測定出口溫度偏移一偏移值並高於該所測定出口溫度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of and control device for controlling an electrolyser cell stack of an electrolyser in an electrolyser system. The stack comprises a fluid inlet and one or more fluid outlets. The electrolyser system comprises a fluid temperature control system for controlling temperature of a fluid entering the stack at the fluid inlet, a power control system for controlling one of a current supply to or a voltage supply to the stack and for determining the other one of current supply to or voltage supply to the stack, an inlet temperature monitoring and/or control system for determining an inlet temperature at the fluid inlet and an outlet temperature monitoring and/or control system for determining an outlet temperature at at least one of the one or more fluid outlets. The method comprises controlling either the current supply to the stack to a fixed input current or the voltage supply to the stack to a fixed input voltage and controlling the inlet temperature to be offset from and higher than a determined outlet temperature by an offset value.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1687" publication-number="202611354"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611354.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611354</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129437</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>假撚加工機</chinese-title>  
        <english-title>FALSE-TWIST TEXTURING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250809B">D02G1/02</main-classification>  
        <further-classification edition="200601120250809B">D02G1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＭＴ機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TMT MACHINERY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今中昭仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMANAKA, AKIHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川重樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, SHIGEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關於一種假撚加工機，在氣流產生裝置中降低壓力損失，實現節能。本發明的假撚加工機具備：主機體；加工部，分別配置於主機體的寬度方向的一方以及另一方，對在主機體的長度方向上排列的多根絲線進行加工；以及包含於加工部的氣流產生裝置(32)。氣流產生裝置(32)具備：第一延伸管道(61)，相對於通過主機體的上述寬度方向的中心並沿上述長度方向延伸的中心線(C)配置於上述寬度方向的一方，並沿上述長度方向延伸；第二延伸管道(62)，相對於中心線(C)配置於上述寬度方向的另一方，並沿上述長度方向延伸；以及鼓風機(63)。鼓風機(63)與第一延伸管道(61)的一端(61x)及第二延伸管道(62)的一端(62x)連接，由第一延伸管道(61)及第二延伸管道(62)共用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an airflow generator (32), pressure loss is reduced and energy saving is achieved. A false-twist texturing machine (1) of the present invention includes a main frame (8), a processing unit (3) which is provided on each of one side and the other side in the width direction of the main frame (8) and is configured to process yarns (Y) aligned in the longitudinal direction of the main frame (8), and an airflow generator (32) included in the processing unit (3). The airflow generator (32) includes a first extending duct (61) which is on one side in the width direction of a center line (C) extending in the longitudinal direction and passing through the center in the width direction of the main frame (8) and extends along the longitudinal direction, a second extending duct (62) which is on the other side in the width direction of the center line (C) and extends along the longitudinal direction, and a blower (63). The blower (63) is connected to one end (61x) of the first extending duct (61) and one end (62x) of the second extending duct (62), and is shared between the first extending duct (61) and the second extending duct (62).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">α1:角度</p>  
        <p type="p">α2:角度</p>  
        <p type="p">β1:角度</p>  
        <p type="p">β2:角度</p>  
        <p type="p">C:主機體的中心線</p>  
        <p type="p">L1:第一假想直線</p>  
        <p type="p">L2:第二假想直線</p>  
        <p type="p">N:交點</p>  
        <p type="p">V:空間(第一延伸管道與第二延伸管道之間的空間)</p>  
        <p type="p">X1~X5:管道的中心線</p>  
        <p type="p">32:氣流產生裝置</p>  
        <p type="p">61:第一延伸管道</p>  
        <p type="p">61x:一端</p>  
        <p type="p">62:第二延伸管道</p>  
        <p type="p">62x:一端</p>  
        <p type="p">63:鼓風機</p>  
        <p type="p">71:第一傾斜管道</p>  
        <p type="p">71s:內表面</p>  
        <p type="p">72:第二傾斜管道</p>  
        <p type="p">72s:內表面</p>  
        <p type="p">73:夾設管道</p>  
        <p type="p">731:突出部</p>  
        <p type="p">731a:第一傾斜面</p>  
        <p type="p">731b:第二傾斜面</p>  
        <p type="p">73s:內表面</p>  
        <p type="p">634:殼體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1688" publication-number="202612303"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612303.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612303</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半持續性排程實體下行鏈路共用通道之取消</chinese-title>  
        <english-title>CANCELATION OF SEMI-PERSISTENT SCHEDULING PHYSICAL DOWNLINK SHARED CHANNEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H04L1/1812</main-classification>  
        <further-classification edition="202301120251201B">H04W72/23</further-classification>  
        <further-classification edition="202301120251201B">H04W72/1273</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍什內維桑　幕斯塔法</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHOSHNEVISAN, MOSTAFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　晉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄　易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述用於無線通訊的方法、系統、及裝置。各種態樣大致上係關於半持續性排程(SPS)實體下行鏈路共用通道(PDSCH)傳輸之取消，且更具體地係關於在未成功接收的PDSCH傳輸隨後的SPS PDSCH傳輸之取消，該PDSCH傳輸具有與SPS PDSCH相同的混合自動重複請求(HARQ)識別符(ID)。在一些態樣中，使用者設備(UE)可避免監測具有與UE已針對其傳輸否定確認(NACK)的PDSCH傳輸相同的HARQ ID的經排程SPS PDSCH傳輸。在一些態樣中，網路實體可取消（例如，可不傳輸）具有與網路實體已針對其接收NACK的PDSCH傳輸相同的HARQ ID的經排程SPS PDSCH傳輸。經否定確認PDSCH傳輸可係DG PDSCH傳輸或早先的SPS PDSCH傳輸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and devices for wireless communications are described. Various aspects generally relate to cancelation of semi-persistent scheduling (SPS) physical downlink shared channel (PDSCH) transmissions, and more particularly to cancelation of an SPS PDSCH transmission that follows an unsuccessfully received PDSCH transmission that has the same hybrid automatic repeat request (HARQ) identifier (ID) as the SPS PDSCH. In some aspects, a user equipment (UE) may refrain from monitoring for a scheduled SPS PDSCH transmission that has a same HARQ ID as a PDSCH transmission for which the UE transmitted a negative acknowledgment (NACK). In some aspects, a network entity may cancel (for example, may not transmit) a scheduled SPS PDSCH transmission that has a same HARQ ID as a PDSCH transmission for which the network entity received a NACK. The NACKed PDSCH transmission may be a DG PDSCH transmission or a prior SPS PDSCH transmission.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:PDSCH排程及時序圖</p>  
        <p type="p">505:PDSCH傳輸</p>  
        <p type="p">510:NACK</p>  
        <p type="p">515:SPS PDSCH傳輸</p>  
        <p type="p">520:PDSCH傳輸</p>  
        <p type="p">525:ACK</p>  
        <p type="p">530:SPS PDSCH傳輸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1689" publication-number="202612505"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612505.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612505</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含不同類型場效電晶體的半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE INCLUDING DIFFERENT TYPES OF FIELD-EFFECT TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251106B">H10D30/60</main-classification>  
        <further-classification edition="202501120251106B">H10D62/10</further-classification>  
        <further-classification edition="202501120251106B">H10D64/20</further-classification>  
        <further-classification edition="202501120251106B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙南奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, EDWARD NAMKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴起丙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, KIBYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐俊浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JUNHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　康一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, KANG-ILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體裝置，包括：第一電晶體結構，包括第一NFET（n型場效電晶體）和垂直在其上方的第一PFET（p型場效電晶體），第一NFET具有比第一PFET更大的通道寬度；以及第二電晶體結構，包括第二PFET和垂直在其上方的第二NFET，第二NFET具有比第二PFET更大的通道寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a semiconductor device which includes: a 1&lt;sup&gt;st&lt;/sup&gt; transistor structure including a 1&lt;sup&gt;st&lt;/sup&gt; n-type field-effect transistor (NFET) and a 1&lt;sup&gt;st&lt;/sup&gt; p-type field-effect transistor (PFET) vertically thereabove, the 1&lt;sup&gt;st&lt;/sup&gt; NFET having a greater channel width than the 1&lt;sup&gt;st&lt;/sup&gt; PFET; and a 2&lt;sup&gt;nd&lt;/sup&gt; transistor structure including a 2&lt;sup&gt;nd&lt;/sup&gt; PFET and a 2&lt;sup&gt;nd&lt;/sup&gt; NFET vertically thereabove, the 2&lt;sup&gt;nd&lt;/sup&gt; NFET having a greater channel width than the 2&lt;sup&gt;nd&lt;/sup&gt; PFET.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">80:半導體裝置</p>  
        <p type="p">8A、8C:CPU</p>  
        <p type="p">8B:SRAM</p>  
        <p type="p">8D:GPU</p>  
        <p type="p">8E:NPU</p>  
        <p type="p">8F:額外邏輯電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1690" publication-number="202611039"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611039.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611039</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129488</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＴＡＣＣ抑制劑化合物、藥物組合物及其製備方法和用途</chinese-title>  
        <english-title>TACC INHIBITOR COMPOUND, AND PHARMACEUTICAL COMPOSITION, PREPARATION METHOD AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D413/12</main-classification>  
        <further-classification edition="200601120251201B">C07D413/14</further-classification>  
        <further-classification edition="200601120251201B">C07D401/14</further-classification>  
        <further-classification edition="200601120251201B">C07D491/08</further-classification>  
        <further-classification edition="200601120251201B">C07D491/10</further-classification>  
        <further-classification edition="200601120251201B">C07D519/00</further-classification>  
        <further-classification edition="200601120251201B">A61K31/5377</further-classification>  
        <further-classification edition="200601120251201B">A61K31/496</further-classification>  
        <further-classification edition="200601120251201B">A61K31/537</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京康辰藥業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING KONRUNS PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聶昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIE, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MI, ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊曉娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XIAO-NA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種式（I）所示的具有二芳胺類結構的化合物或其藥學上可接受的鹽，可作為TACC抑制劑用於治療癌症。 &lt;br/&gt;&lt;img align="absmiddle" height="188px" width="408px" file="ed10909.JPG" alt="ed10909.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This present disclosure provides a compound with a diarylamine structure as shown in formula (I) or a pharmaceutically acceptable salt thereof, which can be used as a TACC inhibitor for the treatment of cancer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1691" publication-number="202611444"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611444.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611444</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129496</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空氣淨化器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251106B">F24F8/10</main-classification>  
        <further-classification edition="202101120251106B">F24F8/26</further-classification>  
        <further-classification edition="202101120251106B">F24F8/30</further-classification>  
        <further-classification edition="200601120251106B">A61L9/03</further-classification>  
        <further-classification edition="200601120251106B">A61L9/22</further-classification>  
        <further-classification edition="200601120251106B">B01D53/66</further-classification>  
        <further-classification edition="200601120251106B">B01D53/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商夏普股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARP KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊豆晃一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZU, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田憲司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上林弘和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMBAYASHI, HIROKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊川彰仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUGAWA, AKIHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鬼木涉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONIKI, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朝倉俊哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAKURA, SHUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松山貴一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUYAMA, KIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>增田宗一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, SOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠執行對用戶而言更為適宜的動作的空氣淨化器。空氣淨化器具備流通氣流的風路、過濾器（20）以及切換部（23）。切換部（23）對氣流流過過濾器20的有效狀態和氣流不流過過濾器（20）的無效狀態進行切換。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:過濾器</p>  
        <p type="p">21:除臭過濾器</p>  
        <p type="p">23:切換部</p>  
        <p type="p">24:集塵過濾器</p>  
        <p type="p">211:(第一)過濾片</p>  
        <p type="p">212:(第二)過濾片</p>  
        <p type="p">231:(第一)遮蔽部件</p>  
        <p type="p">232:(第二)遮蔽部件</p>  
        <p type="p">241:第一集塵過濾器</p>  
        <p type="p">242:第二集塵過濾器</p>  
        <p type="p">D1:上下方向</p>  
        <p type="p">D2:左右方向</p>  
        <p type="p">D3:前後方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1692" publication-number="202611904"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611904.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611904</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129530</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能音量控制器及其方法</chinese-title>  
        <english-title>SMART VOLUME CONTROLLER AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G10K15/02</main-classification>  
        <further-classification edition="200601120251201B">G06F3/16</further-classification>  
        <further-classification edition="200601120251201B">H04R3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商知微電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XMEMS LABS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　振宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, JEMM YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　延禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YANCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種控制器，用來控制一發聲模組，該控制器包含有一音量控制單元，用來決定對應於一目標音量之一解調振幅及一調變振幅。該發聲模組包含有一驅動電路及一氣脈衝產生裝置。該驅動電路根據該解調振幅來產生一解調驅動訊號並根據該調變振幅來產生一調變驅動訊號，以驅動該氣脈衝產生裝置。該氣脈衝產生裝置藉由以一超音波脈衝率產生複數個氣脈衝來發出聲音。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A controller configured to control a sound producing module includes a volume controlling unit configured to determine a demodulation amplitude and a modulation amplitude corresponding to a target volume. The sound producing module comprises a driving circuit and an air-pulse generating device. The driving circuit generates a demodulation driving signal according to the demodulation amplitude and generates a modulation driving signal according to the modulation amplitude, so as to drive the air-pulse generating device. The air-pulse generating device produces sound via generating a plurality of air pulses at an ultrasonic pulse rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:發聲系統</p>  
        <p type="p">20:控制器</p>  
        <p type="p">22:發聲模組</p>  
        <p type="p">10:氣脈衝產生裝置</p>  
        <p type="p">12:驅動電路</p>  
        <p type="p">200:音量控制單元</p>  
        <p type="p">Vol&lt;sub&gt;tg&lt;/sub&gt;:目標音量</p>  
        <p type="p">S&lt;sub&gt;mode&lt;/sub&gt;:模式訊號</p>  
        <p type="p">SVamp:解調振幅</p>  
        <p type="p">SMamp:調變振幅</p>  
        <p type="p">101A,103A:致動器</p>  
        <p type="p">S101,S103,+SV,-SV,SV:解調驅動訊號</p>  
        <p type="p">SM:調變驅動訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1693" publication-number="202611184"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611184.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611184</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含矽之阻劑膜形成用組成物、及圖案形成方法</chinese-title>  
        <english-title>COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">C08G77/20</main-classification>  
        <further-classification edition="200601120251209B">G03F7/004</further-classification>  
        <further-classification edition="200601120251209B">C08L83/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤村昂志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWAMURA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>間下貴斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASHITA, TAKATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三井亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種含矽之阻劑膜形成用組成物，其能形成LWR及CDU優良之超微細的阻劑圖案，形成之阻劑膜在和有機材料之間具有高蝕刻選擇性，且可進行不會發生因為圖案化結束後殘存之殘渣導致缺陷之圖案形成，並提供使用此組成物之圖案形成方法。 &lt;br/&gt;一種含矽之阻劑膜形成用組成物，其特徵為：含有含下式(A-1)表示之重複單元、下式(A-2)表示之重複單元、及下式(A-3)表示之次結構中之至少任一者之聚矽氧烷。 &lt;br/&gt;&lt;img align="absmiddle" height="47px" width="68px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="466px" width="318px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，R&lt;sup&gt;1&lt;/sup&gt;為因熱、酸或鹼而作為脫離基作用之亦可具有取代基之碳數1~30之1價有機基、鹵素原子、羥基、磺基、硝基或羧基，R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;各自獨立地表示也可具有取代基之碳數1~30之1價有機基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a composition for forming a silicon-containing resist film contains a polysiloxane containing at least one of any of a repeating unit represented by formula (A-1), a repeating unit represented by formula (A-2), or a substructure represented by formula (A-3): &lt;br/&gt;&lt;img align="absmiddle" height="264px" width="189px" file="ed10047.JPG" alt="ed10047.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein R&lt;sup&gt;1&lt;/sup&gt; is a monovalent organic group, a halogen atom, a hydroxy group, a sulfo group, a nitro group, or a carboxyl group, functioning as a group eliminated by heat, acid, or base, and R&lt;sup&gt;2&lt;/sup&gt; and R&lt;sup&gt;3&lt;/sup&gt; represent a monovalent organic group. The present invention can provide a composition for forming a silicon-containing resist film such that an ultra-fine resist pattern with excellent LWR (line width roughness) and CDU (critical dimension uniformity) can be formed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1694" publication-number="202611578"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611578.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611578</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學元件之製造方法及光波導</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G02B6/25</main-classification>  
        <further-classification edition="200601120251201B">G02B6/13</further-classification>  
        <further-classification edition="200601120251201B">G02B6/122</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三重野寛之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIENO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係包含支持層、及1層以上之其他層之2層以上之光學元件之製造方法，支持層係於至少一部分包含感光性物質之感光性基板，對成為支持層之感光性基板，藉由微影法形成一對空心部，該一對空心部成為長條狀之光學元件之外框形狀之寬度方向兩端，於支持層之上積層成為其他層之膜，藉由切取形成於支持層之一對空心部之長度方向兩端，而將光學元件單片化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">72a:下包覆層</p>  
        <p type="p">81:感光性基板</p>  
        <p type="p">82:空心部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1695" publication-number="202612489"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612489.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612489</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129584</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成電容的方法</chinese-title>  
        <english-title>METHOD OF FORMING CAPACITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">H10D1/62</main-classification>  
        <further-classification edition="200601120251201B">C23C16/34</further-classification>  
        <further-classification edition="200601120251201B">C23C16/40</further-classification>  
        <further-classification edition="200601120251201B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商周星工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONG YEUP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃喆周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, CHUL-JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種形成電容的方法，包含於基板上形成含有氮化鈦的第一電極層的步驟、於第一電極層上形成含有氮氧化鈦的第一阻障層的步驟，以及於第一阻障層上形成含有氧化鈦的介電層的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method of forming a capacitor comprising a step of forming a first electrode layer containing titanium nitride (TiN) on a substrate; a step of forming a first barrier layer containing titanium oxynitride (TiON) on the first electrode layer; and a step of forming a dielectric layer containing titanium oxide (TiO) on the first barrier layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">200a:第一電極層</p>  
        <p type="p">200b:第二電極層</p>  
        <p type="p">310:第一阻障層</p>  
        <p type="p">400:介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1696" publication-number="202612146"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612146.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612146</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129590</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250811B">H01L23/52</main-classification>  
        <further-classification edition="202301120250811B">H01L25/065</further-classification>  
        <further-classification edition="202501120250811B">H10D88/00</further-classification>  
        <further-classification edition="202301120250811B">H10B12/00</further-classification>  
        <further-classification edition="202301120250811B">H10B63/10</further-classification>  
        <further-classification edition="202301120250811B">H10B99/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長江存儲科技控股有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANGTZE MEMORY TECHNOLOGIES HOLDING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙祎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>苗利娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIAO, LI-NA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周文斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, WEN-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍宗亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUO, ZONG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體結構包括第一半導體晶片和沿著第一方向與第一半導體晶片堆疊的第二半導體晶片。所述第一半導體晶片包括包含沿著第一方向延伸的第一接觸結構的第一存儲結構和被設置在第一基板上的第一週邊結構，所述第一週邊結構與所述第一存儲結構接觸並且包括沿著所述第一方向延伸的第二接觸結構。所述第二半導體晶片通過晶片到晶片鍵合層鍵合到所述第一半導體晶片，並且所述第一接觸結構和所述第二接觸結構通過第一耦合層耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure includes a first semiconductor chip and a second semiconductor chip stacking with the first semiconductor chip along a first direction. The first semiconductor chip includes a first memory structure including a first contact structure extending along the first direction, and a first periphery structure disposed on a first substrate, and the first periphery structure is in contact with the first memory structure and includes a second contact structure extending along the first direction. The second semiconductor chip is bonded to the first semiconductor chip through a chip-to-chip bonding layer, and the first contact structure and the second contact structure are coupled through a first coupling layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體結構</p>  
        <p type="p">110:第一半導體晶片</p>  
        <p type="p">111:第一存儲結構</p>  
        <p type="p">112:第一耦合層</p>  
        <p type="p">113:第一週邊結構</p>  
        <p type="p">114:第一接觸結構</p>  
        <p type="p">115:第二接觸結構</p>  
        <p type="p">116、136、151:金屬結構</p>  
        <p type="p">117、137、152:電介質鍵合材料</p>  
        <p type="p">118:電容器</p>  
        <p type="p">119:垂直電晶體</p>  
        <p type="p">120:第一基板</p>  
        <p type="p">121、141:背側佈線結構</p>  
        <p type="p">130:第二半導體晶片</p>  
        <p type="p">131:第二存儲結構</p>  
        <p type="p">132:第二耦合層</p>  
        <p type="p">133:第二週邊結構</p>  
        <p type="p">134:第三接觸結構</p>  
        <p type="p">135:第四接觸結構</p>  
        <p type="p">140:第二基板</p>  
        <p type="p">150:晶片鍵合層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1697" publication-number="202611042"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611042.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611042</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129644</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雜環化合物和包括其的有機發光器件</chinese-title>  
        <english-title>HETEROCYCLIC COMPOUND AND ORGANIC LIGHT EMITTING DEVICE COMPRISING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C07D471/04</main-classification>  
        <further-classification edition="200601120251103B">C09K11/06</further-classification>  
        <further-classification edition="202301120251103B">H10K85/60</further-classification>  
        <further-classification edition="202301120251103B">H10K50/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＴ素材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LT MATERIALS CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昭燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SO-YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭元場</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, WON-JANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONG-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔大赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, DAE-HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓孟儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了化學式1的雜環化合物和包括所述雜環化合物的有機發光器件。所述雜環化合物由以下化學式1表示： &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="174px" width="279px" file="ed10161.JPG" alt="ed10161.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;在化學式1中，各取代基的定義與說明書所定義的相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a heterocyclic compound of Chemical Formula 1 and an organic light emitting device including the same. The heterocyclic compound is represented by the following chemical formula 1: &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="170px" width="304px" file="ed10162.JPG" alt="ed10162.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;in Chemical Formula 1, the definitions of each substituent are the same as those defined in the specification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">200:正電極</p>  
        <p type="p">300:有機材料層</p>  
        <p type="p">400:負電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1698" publication-number="202611937"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611937.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611937</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>CXL記憶體控制器、其操作方法及CXL記憶體裝置</chinese-title>  
        <english-title>CXL MEMORY CONTROLLER, OPERATING METHOD THEREFOR, AND CXL MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">G11C29/52</main-classification>  
        <further-classification edition="200601120251208B">G06F11/16</further-classification>  
        <further-classification edition="201601120251208B">G06F12/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李起準</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MYUNGKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴星柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SUNGJOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫敎民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOHN, KYOMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及計算表達式鏈路（CXL）記憶體控制器、其操作方法、以及CXL記憶體裝置。CXL記憶體控制器包括資料轉換裝置，接收故障位元圖並將故障位元圖轉換為符號單元中的錯誤校正碼（ECC）預解碼資訊，唯讀記憶體（ROM），儲存ECC預解碼資訊，以及ECC引擎，基於ECC預解碼資訊執行解碼操作。ECC預解碼資訊包括位址資訊，指示發生錯誤的位址，錯誤符號位置資訊，指示從對應於位址的符號中發生錯誤的一個或多個符號，以及錯誤類型資訊，指示一個或多個符號的錯誤類型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to compute expression link (CXL) memory controller, an operating method therefor, and a CXL memory device. The CXL memory controller includes a data conversion device that receives a fail bit map and converts the fail bit map into error correction code (ECC) predecoded information in a symbol unit, a read only memory (ROM) that stores the ECC predecoded information, and an ECC engine that performs a decoding operation based on the ECC predecoded information. The ECC predecoded information includes address information indicating an address in which an error occurs, error symbol position information indicating one or more symbols in which the error occurs from among symbols corresponding to the address, and error type information indicating an error type of the one or more symbols.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:CXL記憶體控制器</p>  
        <p type="p">510:唯讀記憶體</p>  
        <p type="p">520:唯讀記憶體</p>  
        <p type="p">530:ECC引擎</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1699" publication-number="202611033"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611033.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611033</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129654</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>芳香並環類衍生物及其製備方法和用途</chinese-title>  
        <english-title>AROMATIC CYCLIC DERIVATIVES AND THEIR PREPARATION METHOD AND USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D333/64</main-classification>  
        <further-classification edition="200601120251201B">C07D209/36</further-classification>  
        <further-classification edition="200601120251201B">C07D471/04</further-classification>  
        <further-classification edition="200601120251201B">C07D487/04</further-classification>  
        <further-classification edition="200601120251201B">C07D495/04</further-classification>  
        <further-classification edition="200601120251201B">C07D307/83</further-classification>  
        <further-classification edition="200601120251201B">C07D491/048</further-classification>  
        <further-classification edition="200601120251201B">A61K31/381</further-classification>  
        <further-classification edition="200601120251201B">A61K31/404</further-classification>  
        <further-classification edition="200601120251201B">A61K31/437</further-classification>  
        <further-classification edition="200601120251201B">A61K31/407</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4365</further-classification>  
        <further-classification edition="200601120251201B">A61K31/343</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4355</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商浙江海正藥業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHEJIANG HISUN PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海昂睿醫藥技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI ARYL PHARMTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張盼盼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, PAN PAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武海潮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HAI CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵林江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, LIN JIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林承才</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG CAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞　鳴烽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, MING FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭曉鶴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, XIAO HE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周厚江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, HOU JIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種芳香並環類衍生物、其製備方法及含有該衍生物的藥物組合物在醫藥上的應用。具體而言，本發明涉及一種通式(I)所示的並環類衍生物、其製備方法及其可藥用的鹽，以及它們作為治療劑，特別是作為WRN抑制劑的用途，其中通式(I)中各取代基的定義與說明書中的定義相同。&lt;br/&gt;&lt;img align="absmiddle" height="139px" width="184px" file="ed10273.JPG" alt="ed10273.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an aromatic paracyclic derivative, a method for preparing the same, and the medical use of a pharmaceutical composition containing the same. Specifically, the present invention relates to a paracyclic derivative represented by general formula (I), a method for preparing the same, and pharmaceutically acceptable salts thereof, as well as their use as therapeutic agents, particularly as WRN inhibitors. The definitions of the substituents in general formula (I) are the same as those in the specification.&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="143px" width="182px" file="ed10274.JPG" alt="ed10274.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1700" publication-number="202611987"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611987.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611987</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>批量型基板處理裝置</chinese-title>  
        <english-title>BATCH TYPE SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250912B">H01L21/02</main-classification>  
        <further-classification edition="200601120250912B">H05H1/46</further-classification>  
        <further-classification edition="200601120250912B">H05H1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商尤金科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EUGENE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙政熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, JEONG HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的批量型基板處理裝置包括：反應管，配置為提供容納多個基板的處理空間；以及電極單元，設置有多個棒狀電極，多個棒狀電極沿反應管的圓周方向配置並沿反應管的縱向方向延伸，其中多個棒狀電極包括：第一電源電極和第二電源電極，彼此間隔設置；以及第一接地電極和第二接地電極，設置為在第一電源電極和第二電源電極之間彼此間隔設置，其中第一電源電極和第二電源電極中的至少一個，以及第一接地電極和第二接地電極中的至少一個具有不同長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A batch type substrate processing apparatus of the present disclosure includes: a reaction tube configured to provide a processing space in which a plurality of substrates are accommodated; and an electrode unit provided with a plurality of rod-shaped electrodes arranged in a circumferential direction of the reaction tube and extending along a longitudinal direction of the reaction tube, wherein the plurality of rod-shaped electrodes include: a first power electrode and a second power electrode, which are spaced apart from each other; and a first ground electrode and a second ground electrode, which are provided to be spaced apart from each other between the first power electrode and the second power electrode, wherein at least one of the first power electrode and the second power electrode, and at least one of the first ground electrode and the second ground electrode have a different length.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">121a:第一電源電極</p>  
        <p type="p">121b:第二電源電極</p>  
        <p type="p">122a:第一接地電極</p>  
        <p type="p">122b:第二接地電極</p>  
        <p type="p">131a:第一電極保護管</p>  
        <p type="p">131b:第四電極保護管</p>  
        <p type="p">132a:第二電極保護管</p>  
        <p type="p">132b:第三電極保護管</p>  
        <p type="p">133a:第一橋接管</p>  
        <p type="p">133b:第二橋接管</p>  
        <p type="p">150:高頻電源供應單元</p>  
        <p type="p">155:功率分配單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1701" publication-number="202612395"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612395.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612395</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129664</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>批量型基板處理裝置</chinese-title>  
        <english-title>BATCH TYPE SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">H05H1/46</main-classification>  
        <further-classification edition="200601120251008B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商尤金科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EUGENE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙政熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, JEONG HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的批量型基板處理裝置包括反應管，配置為提供容納多個基板的處理空間，以及第一電極單元至第二電極單元，沿反應管的圓周方向配置並分別設置有沿反應管的縱向方向延伸的多個棒狀電極。第一電極單元包括第一電源電極和第二電源電極，設置為彼此間隔，第二電極單元包括第三電源電極和第四電源電極，設置為彼此間隔，第三電源電極的長度和第三電極的長度均小於第一電源電極的長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A batch type substrate processing apparatus of the present disclosure includes a reaction tube configured to provide a processing space in which a plurality of substrates are accommodated, and a first electrode unit to a second electrode unit which are arranged in a circumferential direction of the reaction tube and are respectively provided with a plurality of rod-shaped electrodes extending in a longitudinal direction of the reaction tube. The first electrode unit includes a first power electrode and a second power electrode, which are provided to be spaced apart from each other, the second electrode unit includes a third power electrode and a fourth power electrode, which are provided to be spaced apart from each other, and each of a length of the third power electrode and a length of the third electrode is less than a length of the first power electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">110:反應管</p>  
        <p type="p">111:處理空間</p>  
        <p type="p">115:隔間牆</p>  
        <p type="p">120:電極單元</p>  
        <p type="p">121、122:棒狀電極</p>  
        <p type="p">123:注入埠</p>  
        <p type="p">125:放電空間</p>  
        <p type="p">130:電極保護單元</p>  
        <p type="p">131:第一電源電極保護管</p>  
        <p type="p">132:第一接地電極保護管</p>  
        <p type="p">150:高頻電源供應單元</p>  
        <p type="p">155:功率分配單元</p>  
        <p type="p">160:控制器</p>  
        <p type="p">170:氣體供應管</p>  
        <p type="p">171:放電埠</p>  
        <p type="p">175:源氣體供應管</p>  
        <p type="p">180:排氣單元</p>  
        <p type="p">215:第二隔間牆</p>  
        <p type="p">220:第二電極單元</p>  
        <p type="p">221、222:棒狀電極</p>  
        <p type="p">223:第二注入埠</p>  
        <p type="p">225:第二放電空間</p>  
        <p type="p">230:第二電極保護單元</p>  
        <p type="p">231:第二電源電極保護管</p>  
        <p type="p">232:第二接地電極保護管</p>  
        <p type="p">250:第二高頻電源供應單元</p>  
        <p type="p">255:第二功率分配單元</p>  
        <p type="p">260:第二控制器</p>  
        <p type="p">270:氣體供應管</p>  
        <p type="p">271:放電埠</p>  
        <p type="p">A:第一電漿形成部</p>  
        <p type="p">B:第二電漿形成部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1702" publication-number="202612300"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612300.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612300</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129668</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>跨鏈路干擾報告</chinese-title>  
        <english-title>CROSS-LINK INTERFERENCE REPORTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251201B">H04B17/318</main-classification>  
        <further-classification edition="201501120251201B">H04B17/345</further-classification>  
        <further-classification edition="200901120251201B">H04W24/10</further-classification>  
        <further-classification edition="200901120251201B">H04W24/08</further-classification>  
        <further-classification edition="200601120251201B">H04L25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊布拉辛　艾德拉罕　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IBRAHIM, ABDELRAHMAN MOHAMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿布達加法爾　穆罕默德　賽義德　凱利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABDELGHAFFAR, MUHAMMAD SAYED KHAIRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在一些態樣中，一種使用者設備(UE)可接收與一組跨鏈路干擾(CLI)資源相關聯的組態。該UE可使用該組CLI資源執行測量，以判定一組CLI測量。該UE可至少部分地基於一最大測量數量傳輸該組CLI測量的一子集的一報告。該報告可包括：該組CLI資源的一子集的一或多個識別符，其對應於CLI測量之該子集；CLI測量之該子集中使用量化至一第一位元數量的一絕對值的一第一測量；及CLI測量之該子集中使用量化至一第二位元數量的差分值的剩餘測量。描述多種其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive a configuration associated with a set of cross-link interference (CLI) resources. The UE may perform measurements using the set of CLI resources to determine a set of CLI measurements. The UE may transmit a report for a subset, of the set of CLI measurements, based at least in part on a maximum quantity of measurements. The report may include: one or more identifiers of a subset, of the set of CLI resources, corresponding to the subset of CLI measurements; a first measurement in the subset of CLI measurements using an absolute value quantized to a first quantity of bits; and remaining measurements in the subset of CLI measurements using differential values quantized to a second quantity of bits. Numerous other aspects are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:網路節點</p>  
        <p type="p">120:使用者設備(UE)</p>  
        <p type="p">500:實例</p>  
        <p type="p">505,510,515,520,525:元件符號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1703" publication-number="202612064"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612064.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612064</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板清洗裝置及基板清洗方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01L21/67</main-classification>  
        <further-classification edition="200601120251001B">B08B3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金井隆宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提高使用冷凍清洗法的基板清洗方法的通過量。實施方式的基板清洗裝置包括：旋轉保持部，保持基板；液體供給部，向所述基板的第一面供給液體；第一冷卻介質供給部，朝向所述基板的與所述第一面為相反側的第二面供給第一冷卻介質；第二冷卻介質供給部，朝向所述第一面供給第二冷卻介質；以及控制部，對所述旋轉保持部、所述第一冷卻介質供給部、所述第二冷卻介質供給部及所述液體供給部進行控制，執行對所述基板的清洗處理，所述清洗處理包括：第一冷卻處理，通過朝向所述第二面供給所述第一冷卻介質，使所述第一面上的所述液體冷凍而形成冷凍體；以及第二冷卻處理，通過朝向所述第一面供給所述第二冷卻介質，進一步使所述冷凍體冷卻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11、12:旋轉軸</p>  
        <p type="p">100:基板清洗裝置</p>  
        <p type="p">110:旋轉保持部</p>  
        <p type="p">111a:圓筒狀部分</p>  
        <p type="p">112:罩部</p>  
        <p type="p">113:保持部</p>  
        <p type="p">114:驅動部</p>  
        <p type="p">120:第一冷卻介質供給部</p>  
        <p type="p">121b:下方部分</p>  
        <p type="p">123、134:冷卻介質供給裝置</p>  
        <p type="p">130:第二冷卻介質供給部</p>  
        <p type="p">131:遮斷構件</p>  
        <p type="p">132:檢測部</p>  
        <p type="p">133:升降機構</p>  
        <p type="p">133a、141:第一支撐框架</p>  
        <p type="p">133b、142:第二支撐框架</p>  
        <p type="p">133c:支撐臂</p>  
        <p type="p">133d:連結部</p>  
        <p type="p">140:液體供給部</p>  
        <p type="p">143:供給噴嘴</p>  
        <p type="p">143a:液體噴出口</p>  
        <p type="p">150:排出杯部</p>  
        <p type="p">160:控制部</p>  
        <p type="p">161:運算裝置</p>  
        <p type="p">162:存儲裝置</p>  
        <p type="p">162a:控制程式</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1704" publication-number="202611261"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611261.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611261</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於鎢及鉬之化學機械拋光(CMP)之低腐蝕高移除率組合物</chinese-title>  
        <english-title>LOW CORROSION HIGH REMOVAL RATE COMPOSITION FOR TUNGSTEN AND MOLYBDENUM CMP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">C09K3/14</main-classification>  
        <further-classification edition="200601120251205B">C09G1/02</further-classification>  
        <further-classification edition="200601120251205B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達克利　凱文　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOCKERY, KEVIN P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索尼　波斯基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONI, BOSKY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祖彼　塔拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZUBI, TALA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯柏德　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEABOLD, JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科塔利　萊斯瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOTHARI, RAJSHREE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, NA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">化學機械拋光組合物包括以下各項、由其組成或基本上由其組成：液體載劑、分散於該液體載劑中之膠質二氧化矽顆粒、含鐵拋光加速劑、結合至該含鐵拋光加速劑之穩定劑、包含具有至少8個碳原子之烷基之烷基-N-氧化物化合物及小於約4之pH。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chemical mechanical polishing composition comprises, consists of, or consists essentially of a liquid carrier, colloidal silica particles dispersed in the liquid carrier; an iron-containing polishing accelerator; a stabilizer bound to the iron-containing polishing accelerator; an alkyl-N-oxide compound including an alkyl group having at least 8 carbon atoms; and a pH of less than about 4.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1705" publication-number="202611658"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611658.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611658</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129725</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鐵路車輛之控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251126B">G05D19/02</main-classification>  
        <further-classification edition="200601120251126B">B61F5/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本製鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">鐵路車輛(1)，係包含車體(3)用之服務機器(7)、空氣供給源(8)。空氣供給源(8)，係對於服務機器(7)供給壓縮空氣。壓縮空氣，係藉由壓縮機(9)生成。鐵路車輛(1)之控制裝置(10)，係具備取得部(11)、算出部(12)、指令部(14)。取得部(11)，係取得空氣供給源(8)之壓力資訊(Ip)。算出部(12)，係根據壓力資訊(Ip)，算出：壓縮機(9)之運轉率(R)，係對於空氣供給源(8)之壓力之下降時間(Td)與空氣供給源(8)之壓力之上升時間(Tu)之和之該上升時間(Tu)之比。指令部(14)，於運轉率(R)超過預定之閾值(A)之情形，對於服務機器(7)，傳送用以使服務機器(7)之動作停止之指令。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鐵路車輛</p>  
        <p type="p">2:台車</p>  
        <p type="p">3:車體</p>  
        <p type="p">4:輪軸</p>  
        <p type="p">4a:車輪</p>  
        <p type="p">4b:車軸</p>  
        <p type="p">5:軸箱</p>  
        <p type="p">6:空氣彈簧</p>  
        <p type="p">7:服務機器</p>  
        <p type="p">8:空氣供給源</p>  
        <p type="p">9:壓縮機</p>  
        <p type="p">10:控制裝置</p>  
        <p type="p">11:取得部</p>  
        <p type="p">12:算出部</p>  
        <p type="p">13:判定部</p>  
        <p type="p">14:指令部</p>  
        <p type="p">51:速度感測器</p>  
        <p type="p">71:LV</p>  
        <p type="p">72:加速度感測器</p>  
        <p type="p">73:閥</p>  
        <p type="p">81:配管</p>  
        <p type="p">82:MR管</p>  
        <p type="p">83:壓力感測器</p>  
        <p type="p">711:旋轉軸</p>  
        <p type="p">712:旋轉角度感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1706" publication-number="202610842"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610842.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610842</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種用於噴墨裝置的驅動系統和噴墨裝置</chinese-title>  
        <english-title>INKJET DEVICE DRIVE SYSTEM AND INKJET DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">B41J2/045</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪嘉祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIA-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣欣哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, XINZHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙魏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦培培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PU, PEIPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗建民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIANMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帥文峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHUAI, WENFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露屬噴墨裝置領域，具體涉及一種用於噴墨裝置的驅動系統，該驅動系統包括多個脈寬調變器、多個波形切換電路、多個驅動電路及控制訊號輸出電路、多組噴頭，該多個脈寬調變器各自輸出不同的脈衝波形，每個脈寬調變器連接至所有的波形切換電路，該波形切換電路根據控制訊號輸出電路提供的控制資訊，從該多個脈寬調變器中選擇或切換一種脈衝波形，並將該脈衝波形作為驅動波形提供給與之對應的驅動電路，從而使得驅動電路根據該驅動波形驅動對應的噴頭進行打印操作，以實現獨立精致的噴頭控制，本揭露也具有節能、解堵、兼容不同打印材料的效果，在噴墨裝置領域將具有廣泛用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure belongs to the field of inkjet devices, and in particular relates to a driving system for an inkjet device. The said driving system comprises multiple pulse-width modulators, multiple waveform-switching circuits, multiple drive circuits and a control-signal-output circuit, and multiple groups of nozzles. Each of the multiple pulse-width modulators outputs a different pulse waveform, and each pulse-width modulator is connected to all of the waveform-switching circuits. The waveform-switching circuits, based on control information provided by the control-signal-output circuit, select or switch one pulse waveform from among the multiple pulse-width modulators, and provide that pulse waveform as a drive waveform to its corresponding drive circuit, thereby causing the drive circuit to drive its corresponding nozzle for printing operations, so as to achieve independent and precise nozzle control. The present disclosure also has the effects of energy saving, deblocking, and compatibility with different printing materials, and will have broad utility in the field of inkjet devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">01-1:脈寬調變器</p>  
        <p type="p">01-2:脈寬調變器</p>  
        <p type="p">01-3:脈寬調變器</p>  
        <p type="p">02-1:波形切換電路</p>  
        <p type="p">02-2:波形切換電路</p>  
        <p type="p">02-32:波形切換電路</p>  
        <p type="p">03-1:驅動電路</p>  
        <p type="p">03-2:驅動電路</p>  
        <p type="p">03-32:驅動電路</p>  
        <p type="p">05:控制訊號輸出電路</p>  
        <p type="p">4:噴頭</p>  
        <p type="p">4-1:噴頭</p>  
        <p type="p">4-2:噴頭</p>  
        <p type="p">4-32:噴頭</p>  
        <p type="p">10:脈寬調變器</p>  
        <p type="p">20:波形切換電路</p>  
        <p type="p">30:驅動電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1707" publication-number="202611328"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611328.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611328</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129751</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成膜方法、成膜裝置及氧化物膜的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C23C16/40</main-classification>  
        <further-classification edition="200601120251103B">C23C16/455</further-classification>  
        <further-classification edition="200601120251103B">C23C16/511</further-classification>  
        <further-classification edition="200601120251103B">C23C16/52</further-classification>  
        <further-classification edition="200601120251103B">H01L21/02</further-classification>  
        <further-classification edition="202501120251103B">H10D30/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商堀場ＳＴＥＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIBA STEC, CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人奈良先端科學技術大學院大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARA INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦岡行治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URAOKA, YUKIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋崇典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TAKANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川戸勇人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWATO, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉井駿宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMAI, TOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>味上俊一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKAMI, SHUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種包含氧化銦及氧化鎵的氧化物膜的新的成膜方法。成膜方法包括使用微波遠程電漿在基板上形成包含氧化銦及氧化鎵的氧化物膜的工序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:成膜裝置</p>  
        <p type="p">21:腔室</p>  
        <p type="p">22:微波遠程電漿裝置</p>  
        <p type="p">23:控制部</p>  
        <p type="p">211:載置台</p>  
        <p type="p">212:溫度調節機構</p>  
        <p type="p">213:電漿導入口</p>  
        <p type="p">214、224:氣體導入口</p>  
        <p type="p">215:氣體排出口</p>  
        <p type="p">221:電漿生成部</p>  
        <p type="p">222:微波產生部</p>  
        <p type="p">223:導波管</p>  
        <p type="p">225:配管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1708" publication-number="202612365"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612365.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612365</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129759</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊方法、裝置及儲存介質</chinese-title>  
        <english-title>COMMUNICATION METHOD, DEVICE, AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W24/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王四海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SIHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鋭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李雪茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XUERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種通訊方法、裝置及儲存介質，可以獲得滿足處理需求的AI/ML模型。該方法中，網路設備向終端設備發送第一資料，該第一資料是通過第一處理方式對第二資料進行處理得到的，第一處理方式包括如下至少一項：調變、編碼、或參考訊號生成；終端設備基於第一資料和第一AI模型，得到第三資料，該第一AI模型對第一資料的處理方式與第一處理方式對應；以及基於第三資料和第二資料，確定第一指標；在第一指標滿足目標指標的情況下，終端設備向網路設備發送第一資訊，該第一資訊用於指示第一AI模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a communication method, device, and storage medium that can obtain an AI/ML model that meets processing requirements. In this method, a network device sends a first data to a terminal device, the first data is obtained by processing a second data with a first processing method. The first processing method includes at least one of the following: modulation, encoding, or reference signal generation. The terminal device obtains a third data based on the first data and a first AI model, where the processing method of the first AI model corresponds to the first processing method. Furthermore, the terminal device determines a first indicator based on the third data and the second data. If the first indicator meets a target indicator, the terminal device sends first information to the network device, which is used to indicate the first AI model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:方法</p>  
        <p type="p">S601,S602,S603,S604,S605:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1709" publication-number="202611837"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611837.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611837</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129789</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>產生裝置、產生方法及程式</chinese-title>  
        <english-title>GENERATION DEVICE, GENERATION METHOD, AND PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120251201B">G06Q30/0241</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂天集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKUTEN GROUP, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高坂豪一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSAKA, HIDEKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢後志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGO, SHIMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松山由希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUYAMA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種可支援電子市場之店鋪製作發揮廣告作用之說明資訊之產生裝置等。 &lt;br/&gt;本發明之產生裝置100之受理部101藉由公開用於特定商品之參數資訊及用於促進商品之購買之說明資訊，而自店鋪受理應附加於欲在讓店鋪銷售商品之電子市場上架之對象商品之參數資訊的輸入。選擇部102藉由公開與所受理之輸入之參數資訊類似之參數資訊，來選擇於電子市場中銷售之複數個類似商品。特定部103特定出複數個類似商品之複數個說明資訊中共通出現之共通表述。製作部104製作用於產生基於參數資訊與共通表述之說明資訊的提示詞。產生部105藉由將提示詞賦予大規模語言模型，來產生應附加於對象商品之說明資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:產生裝置</p>  
        <p type="p">101:受理部</p>  
        <p type="p">102:選擇部</p>  
        <p type="p">103:特定部</p>  
        <p type="p">104:製作部</p>  
        <p type="p">105:產生部</p>  
        <p type="p">106:編輯部</p>  
        <p type="p">107:儲存部</p>  
        <p type="p">200:店鋪終端</p>  
        <p type="p">300:電子市場伺服器</p>  
        <p type="p">400:外部伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1710" publication-number="202610843"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610843.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610843</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129794</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種聯排噴墨裝置驅動系統及聯排噴墨裝置</chinese-title>  
        <english-title>MULTI-HEAD INKJET DEVICE DRIVE SYSTEM AND MULTI-HEAD INKJET DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">B41J2/045</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪嘉祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIA-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣欣哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, XINZHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙魏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦培培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PU, PEIPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗建民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIANMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帥文峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHUAI, WENFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種聯排噴墨裝置驅動系統，所述系統包括：總控板、多個驅動板、與所述多個驅動板對應的多組噴頭、多個同步模組和多個通訊模組；所述總控板通過所述多個同步模組發送用於控制所述多組噴頭的列印時序的同步資訊給所述多個驅動板；所述總控板通過所述多個通訊模組發送列印資料給所述多個驅動板；所述多組噴頭的每個響應對應的驅動板輸出的驅動訊號，並同時噴印相應部分列印資料，從而實現快捷的拼接列印，本揭露將在高效精準的拼接列印領域有廣泛的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a multi-head inkjet device drive system, the system comprising: a main control board, a plurality of driver boards, multiple groups of printheads corresponding to the plurality of driver boards, a plurality of synchronization modules, and a plurality of communication modules. The main control board, via the plurality of synchronization modules, sends synchronization information for controlling the print timing of the multiple printhead groups to the plurality of driver boards. The main control board, via the plurality of communication modules, sends print data to the plurality of driver boards. Each of the multiple printhead groups responds to the driving signal output by the corresponding driver board and simultaneously prints the corresponding portion of the print data, thereby realizing fast splicing printing. This present disclosure will have broad utility in the field of efficient and precise splicing printing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">04-1:通訊模組</p>  
        <p type="p">04-2:通訊模組</p>  
        <p type="p">04-16:通訊模組</p>  
        <p type="p">1:總控板</p>  
        <p type="p">2-1:驅動板</p>  
        <p type="p">2-2:驅動板</p>  
        <p type="p">2-16:驅動板</p>  
        <p type="p">4:噴頭</p>  
        <p type="p">4-1:噴頭</p>  
        <p type="p">4-2:噴頭</p>  
        <p type="p">4-16:噴頭</p>  
        <p type="p">5-1:同步模組</p>  
        <p type="p">5-2:同步模組</p>  
        <p type="p">5-16:同步模組</p>  
        <p type="p">6:上位機</p>  
        <p type="p">7:電源模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1711" publication-number="202610631"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610631.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610631</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129829</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於以２，２＇－二硫基雙乙烷磺化物、卡鉑及吡咯葉酸治療非小細胞肺癌的方法</chinese-title>  
        <english-title>METHODS FOR TREATING NON-SMALL CELL LUNG CANCER WITH 2,2'-DITHIO-BIS-ETHANE SULFONATE, CARBOPLATIN, AND PEMETREXED</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/4985</main-classification>  
        <further-classification edition="200601120251201B">A61K31/4025</further-classification>  
        <further-classification edition="200601120251201B">A61K31/282</further-classification>  
        <further-classification edition="200601120251201B">A61K31/255</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商藍騰製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANTERN PHARMA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴蒂亞　基紹爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHATIA, KISHOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃韋蘇埃多　雷吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EWESUEDO, REGGIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於治療非小細胞肺癌(NSCLC)的方法包括投予2,2’-二硫基雙乙烷磺化物、卡鉑及吡咯葉酸之一組合。該等方法係基於腫瘤突變負荷(TMB)評估，其中具體的治療方案係根據該腫瘤的該突變概況所量身定制。當在一腫瘤樣本中檢測到一低腫瘤突變負荷時，投予2,2’-二硫基雙乙烷磺化物、卡鉑及吡咯葉酸之該組合療法，提供經增強之治療效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for treating non-small cell lung cancer (NSCLC) include the administration of a combination of 2,2’-dithio-bis-ethane sulfonate, carboplatin, and pemetrexed. The methods are based on tumor mutational burden (TMB) assessment, with specific treatment regimens tailored to the mutational profile of the tumor. When a low tumor mutational burden is detected in a tumor sample, the combination therapy of 2,2’-dithio-bis-ethane sulfonate, carboplatin, and pemetrexed is administered, offering enhanced therapeutic efficacy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1712" publication-number="202611448"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611448.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611448</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129867</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>漁船用冷凍系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">F25B7/00</main-classification>  
        <further-classification edition="200601120251215B">F25B1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商前川製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAYEKAWA MFG. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増井克教</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUI, KATSUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松永謙之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAGA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関口壮哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIGUCHI, MASAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白澤真一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAGASAWA, SHINICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係具備：複數個油冷式單段螺旋式壓縮機(第一壓縮機(4)至第三壓縮機(6))；以及第一魚艙(2)與至少一個第二魚艙(3)，係藉由複數個油冷式單段螺旋式壓縮機(第一壓縮機(4)至第三壓縮機(6))從而受到冷卻。第一魚艙(2)與第二魚艙(3)係保冷溫度區段分別不同。將各複數個油冷式單段螺旋式壓縮機(第一壓縮機(4)至第三壓縮機(6))以單段壓縮方式來並聯運行藉此冷卻第一魚艙(2)，並且將複數個油冷式單段螺旋式壓縮機(第一壓縮機(4)至第三壓縮機(6))結合成串聯運行來作為二段壓縮方式的低段側以及高段側藉此冷卻第二魚艙(3)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:漁船用冷凍系統</p>  
        <p type="p">2:第一魚艙</p>  
        <p type="p">3:第二魚艙</p>  
        <p type="p">4:第一油冷式單段螺旋式壓縮機(第一壓縮機；油冷式單段螺旋式壓縮機)</p>  
        <p type="p">4a,5a,6a:吸入口(吸入側)</p>  
        <p type="p">4b,5b,6b:排放口(排放側)</p>  
        <p type="p">5:第二油冷式單段螺旋式壓縮機(第二壓縮機；油冷式單段螺旋式壓縮機)</p>  
        <p type="p">6:第三油冷式單段螺旋式壓縮機(第三壓縮機；油冷式單段螺旋式壓縮機)</p>  
        <p type="p">7:冷凝器</p>  
        <p type="p">8:第一連接路徑</p>  
        <p type="p">9a:第一魚艙流出路徑</p>  
        <p type="p">9b:第二魚艙流出路徑</p>  
        <p type="p">10a:第一吸入路徑</p>  
        <p type="p">10b:第二吸入路徑</p>  
        <p type="p">10c:第三吸入路徑</p>  
        <p type="p">11:吸入閥</p>  
        <p type="p">12a:第一排放路徑</p>  
        <p type="p">12b:第二排放路徑</p>  
        <p type="p">12c:第三排放路徑</p>  
        <p type="p">13:第二連接路徑</p>  
        <p type="p">14a:第一魚艙流入路徑</p>  
        <p type="p">14b:第二魚艙流入路徑</p>  
        <p type="p">15a:第一魚艙閥</p>  
        <p type="p">15b:第二魚艙閥</p>  
        <p type="p">16:排放閥(第二閥)</p>  
        <p type="p">20:二段壓縮用連接路徑</p>  
        <p type="p">20a:第一低段路徑</p>  
        <p type="p">20b:第二低段路徑</p>  
        <p type="p">20c:交會路徑</p>  
        <p type="p">22:低段排放閥(第一閥)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1713" publication-number="202611905"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611905.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611905</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129882</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發聲器及穿戴式聲音裝置</chinese-title>  
        <english-title>SOUND PRODUCING APPARATUS AND WEARABLE SOUND DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G10K15/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商知微電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XMEMS LABS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王煥堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUANN-YAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李家文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種發聲器，包括用來產生一氣流的一氣流產生器、一第一諧振腔室及一第二諧振腔室。第二諧振腔室堆疊在第一諧振腔室上。聲音是利用氣流產生器產生的氣流經過第一諧振腔室及第二諧振腔室而產生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sound producing apparatus includes an airflow generator configured to generate an airflow, a first resonance chamber and a second resonance chamber. The second resonance chamber is stacked on the first resonance chamber. A sound is produced via the airflow generated by the airflow generator passing through the first resonance chamber and the second resonance chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:發聲器</p>  
        <p type="p">AFG:氣流產生器</p>  
        <p type="p">141:第一諧振腔室</p>  
        <p type="p">143:第二諧振腔室</p>  
        <p type="p">AF:氣流</p>  
        <p type="p">142:第二蓋體結構</p>  
        <p type="p">1420:密封結構</p>  
        <p type="p">1422:封蓋層</p>  
        <p type="p">140:氣脈衝產生封裝體</p>  
        <p type="p">1401:氣脈衝產生裝置</p>  
        <p type="p">1402:第一蓋體結構</p>  
        <p type="p">145:第一出口</p>  
        <p type="p">147:第二出口</p>  
        <p type="p">143':空腔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1714" publication-number="202611862"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611862.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611862</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129887</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對齊樣本上不同層之影像</chinese-title>  
        <english-title>ALIGNING IMAGES OF DIFFERENT LAYERS ON A SPECIMEN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251213B">G06T7/30</main-classification>  
        <further-classification edition="200601120251213B">H01L21/66</further-classification>  
        <further-classification edition="200601120251213B">G01N21/88</further-classification>  
        <further-classification edition="200601120251213B">H01L21/67</further-classification>  
        <further-classification edition="200601120251213B">G06T5/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維瑪　普拉尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERMA, PRASHANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭守靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, SHOUJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特瓦里　諾莫哈德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATWARY, NURMOHAMMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　詹姆士　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, JAMES A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　曉春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於對齊一樣本上不同層之影像之方法及系統。實施例對於用於缺陷偵測之基於奇異值分解(SVD)之跨層對齊可能特別有用。一種系統包含一電腦子系統，該電腦子系統經組態用於分別針對一樣本上分別第一及第二層之第一及第二影像產生第一及第二基於SVD之雜訊影像。繼該樣本上形成該第二層之後，形成該第一層。該電腦子系統亦經組態用於：藉由將該等第一基於SVD之雜訊影像對齊至該等第二基於SVD之雜訊影像來運算一或多個全域偏移；將該一或多個全域偏移應用於該等第二影像以藉此將該等第二影像對齊至該等第一影像；及基於該等經對齊之第一及第二影像來判定該樣本之資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems for aligning images of different layers on a specimen are provided. The embodiments may be particularly useful for singular value decomposition (SVD) based cross-layer alignment for defect detection. One system includes a computer subsystem configured for generating first and second SVD based noise images for first and second images, respectively, of first and second layers, respectively, on a specimen. The first layer is formed subsequent to formation of the second layer on the specimen. The computer subsystem is also configured for computing one or more global offsets by aligning the first SVD based noise images to the second SVD based noise images, applying the one or more global offsets to the second images to thereby align the second images to the first images, and determining information for the specimen based on the aligned first and second images.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:成像子系統</p>  
        <p type="p">14:樣本</p>  
        <p type="p">16:光源</p>  
        <p type="p">18:光學元件</p>  
        <p type="p">20:透鏡</p>  
        <p type="p">22:載物台</p>  
        <p type="p">24:集光器</p>  
        <p type="p">26:元件</p>  
        <p type="p">28:偵測器</p>  
        <p type="p">30:集光器</p>  
        <p type="p">32:元件</p>  
        <p type="p">34:偵測器</p>  
        <p type="p">36:電腦子系統</p>  
        <p type="p">102:電腦系統/電腦子系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1715" publication-number="202611310"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611310.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611310</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129927</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熔融鍍敷鋼材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C22C38/12</main-classification>  
        <further-classification edition="200601120251201B">C22C18/04</further-classification>  
        <further-classification edition="200601120251201B">C23C2/06</further-classification>  
        <further-classification edition="200601120251201B">B32B15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本製鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德田公平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUDA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤靖人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, YASUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川本浩輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMOTO, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案熔融鍍敷鋼材具有：鋼材、及配置於鋼材表面的鍍敷層；鍍敷層以質量%計具有如下的化學組成：Al：大於10%且小於40%、Mg：4.0%以上且15.0%以下、剩餘部分：Zn及不純物、V及Mn的合計量ΣTR1：0.05%以上且3.0%以下；從鍍敷層之表面朝向鋼材在鋼材之厚度方向上進行GDS分析時的元素分布剖繪中，Fe濃度達95%的深度位置定為鍍敷層與鋼材的界面，鍍敷層之表面起至界面為止的間隔定為鍍敷層的厚度t，此時，相對於厚度t，合計量ΣTR1顯示0.1%以上之深度的比例為10%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1716" publication-number="202610721"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610721.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610721</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129930</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>迴路反應器以及製備加成產物的方法</chinese-title>  
        <english-title>LOOP REACTOR AND METHOD FOR PRODUCING AN ADDITION PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B01J19/24</main-classification>  
        <further-classification edition="200601120251201B">B01J4/00</further-classification>  
        <further-classification edition="200601120251201B">C07C17/02</further-classification>  
        <further-classification edition="200601120251201B">C07C19/045</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商蒂森克魯伯伍德有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THYSSENKRUPP UHDE GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商蒂森克魯伯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THYSSENKRUPP AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商西湖維諾立有限兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WESTLAKE VINNOLIT GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班傑　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENJE, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡默霍夫　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMMERHOFER, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克雷奇　克勞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KREJCI, KLAUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩勒　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PELLER, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關於一種迴路反應器以及一種製備加成產物的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">provided. The present invention relates to a loop reactor and a method for producing an addition product.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:EDC/液態二氯乙烷</p>  
        <p type="p">2:反應器</p>  
        <p type="p">3:下降管</p>  
        <p type="p">4:上升管</p>  
        <p type="p">5:偏轉區</p>  
        <p type="p">6:脫氣/蒸發區/頂部區域</p>  
        <p type="p">7:流動整流器/壓降產生器</p>  
        <p type="p">8:乙烯</p>  
        <p type="p">9:第一供料裝置/分配裝置</p>  
        <p type="p">10:第一靜態混合器</p>  
        <p type="p">11:循環幫浦</p>  
        <p type="p">12:部分流</p>  
        <p type="p">13:熱交換器</p>  
        <p type="p">14:部分流</p>  
        <p type="p">15:壓縮機/混合器</p>  
        <p type="p">16:氣態氯氣/第二反應物</p>  
        <p type="p">17:部分流</p>  
        <p type="p">20:第二供料裝置/分配裝置</p>  
        <p type="p">21:反應混合器/靜態混合器</p>  
        <p type="p">22:出口/抽取器</p>  
        <p type="p">23:部分流</p>  
        <p type="p">24:幫浦</p>  
        <p type="p">25:散熱器/熱交換器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1717" publication-number="202612379"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612379.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612379</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>子頻帶全雙工中的上行鏈路控制及上行鏈路靜默型樣的無線電資源控制組態之技術</chinese-title>  
        <english-title>TECHNIQUES FOR RADIO RESOURCE CONTROL CONFIGURATION OF UPLINK CONTROL AND UPLINK MUTING PATTERN IN SUB-BAND FULL-DUPLEX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H04W72/04</main-classification>  
        <further-classification edition="200601120251201B">H04L5/14</further-classification>  
        <further-classification edition="202301120251201B">H04W72/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊普拉欣　阿普杜勒拉曼穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IBRAHIM, ABDELRAHMAN MOHAMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿布達加法爾　穆罕默德賽義德凱里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABDELGHAFFAR, MUHAMMAD SAYED KHAIRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述用於無線通訊之方法、系統、及裝置。本文所述的技術提供用於上行鏈路傳輸程序及技術，以利用來自一或多個資源靜默型樣的速率匹配。UE可接收指示速率匹配資訊的實體上行鏈路共用通道(PUSCH)組態。UE可從該速率匹配資訊來判定待應用速率匹配的一或兩個符號的以頻率為基礎之速率匹配型樣。UE可根據該以頻率為基礎之速率匹配型樣將PUSCH傳輸傳送至網路實體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and devices for wireless communication are described. Techniques described herein provide for uplink transmission procedures and techniques to utilize rate matching from one or more resource muting patterns. A UE may receive a physical uplink shared channel (PUSCH) configuration indicating rate matching information. From the rate matching information, the UE may determine a frequency-based rate matching pattern for one or two symbols where rate matching is to be applied. A UE may send a PUSCH transmission to a network entity in accordance with the frequency-based rate matching pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">105-c:網路實體</p>  
        <p type="p">115-e:使用者設備(UE)</p>  
        <p type="p">600:程序流程圖</p>  
        <p type="p">605:步驟</p>  
        <p type="p">610:步驟</p>  
        <p type="p">615:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1718" publication-number="202610873"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610873.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610873</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129947</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於減弱車輛傾角之測量中的干擾之方法</chinese-title>  
        <english-title>METHOD FOR ATTENUATING INTERFERENCE IN THE MEASUREMENT OF A TILT ANGLE OF A VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251215B">B60W40/103</main-classification>  
        <further-classification edition="200601120251215B">G01M17/007</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商舍弗勒科技股份有限兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEFFLER TECHNOLOGIES AG &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富瑞茂克思　琴路克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREMAUX, JEAN-LUC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一種用於減弱機動兩輪車輛(1)的側向傾角之測量中的干擾之方法，車輛(1)包含一構造為由傾斜感測器(111)的測量來計算車輛之側向傾角的電子控制單元(11)，所述方法包含以下步驟：&lt;br/&gt; -接收(E1)藉由測速模組(13)所測量之車輛(1)的速率值；&lt;br/&gt; -接收(E2)引擎(10)之每分鐘轉數；&lt;br/&gt; -計算(E3)所接收之速率值與所接收的每分鐘轉數之間的比率；&lt;br/&gt; -比較(E7)所接收之速率值與每分鐘轉數之間的比率和一減弱區間；&lt;br/&gt; -如果此比率係在減弱區間以外，則計算未減弱之傾角；&lt;br/&gt; -如果此比率係於減弱區間內，則計算(E7)具有減弱的傾角。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for attenuating interference in the measurement of an angle of sideways tilt of a motorized two-wheeled vehicle (1) comprising an electronic control unit (11) configured to compute an angle of sideways tilt of the vehicle from the measurements of a tilt sensor (111), said method comprising the steps of:&lt;br/&gt; - reception (E1) of the value of the speed of the vehicle (1) measured by the speed-measuring module (13),&lt;br/&gt; - reception (E2) of the number of revolutions per minute of the engine (10),&lt;br/&gt; - computation (E3) of the ratio between the received speed value and the received number of revolutions per minute,&lt;br/&gt; - comparison (E7) of the ratio between the received speed value and the number of revolutions per minute with an attenuation interval,&lt;br/&gt; - if the ratio is outside the attenuation interval, computation of the tilt angle without attenuation,&lt;br/&gt; - if the ratio is within the attenuation interval, computation (E7) of the tilt angle with attenuation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:車輛</p>  
        <p type="p">10:引擎</p>  
        <p type="p">11:電子控制單元</p>  
        <p type="p">13:測速模組</p>  
        <p type="p">111:傾斜感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1719" publication-number="202612554"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612554.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612554</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129961</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光二極體（LED）封裝件中LED晶片的透鏡結構</chinese-title>  
        <english-title>LENS STRUCTURES FOR LIGHT-EMITTING DIODE (LED) CHIPS IN LED PACKAGES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251208B">H10H20/85</main-classification>  
        <further-classification edition="202501120251208B">H10H20/855</further-classification>  
        <further-classification edition="200601120251208B">H01L21/67</further-classification>  
        <further-classification edition="200601120251208B">H01L23/28</further-classification>  
        <further-classification edition="200601120251208B">H01L25/03</further-classification>  
        <further-classification edition="202301120251208B">H01L25/16</further-classification>  
        <further-classification edition="202501120251208B">H10H29/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科銳ＬＥＤ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CREELED, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇伊希　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUICH, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克萊爾　Ｆ　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLAIRE, F. JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索科爾　約瑟夫　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOKOL, JOSEPH G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威爾科克斯　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILCOX, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊克利　科林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLAKELY, COLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示發光二極體（LED）裝置，且更尤其揭示LED封裝件中LED晶片之透鏡結構。透鏡結構包括用於實現LED封裝件中之各種發射圖案的複雜形狀。複雜透鏡形狀包括在同一LED封裝件內之多個透鏡的布置。在具有自形成形狀之LED晶片上布置第一透鏡，隨後布置囊封該第一透鏡之第二透鏡。該第一透鏡之該自形成形狀使得透鏡寬度能夠向內變窄，且凹陷相對於下方LED晶片定位。該第一透鏡及該第二透鏡之形狀的組合可配置以在對應LED封裝件中共同提供經定製光發射輪廓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Light-emitting diode （LED） devices and more particularly lens structures for LED chips in LED packages are disclosed. Lens structures include complex shapes for achieving various emission patterns in LED packages. Complex lens shapes include arrangements of multiple lenses within a same LED package. A first lens is arranged on an LED chip with a self-forming shape, followed by a second lens that encapsulates the first lens. The self-forming shape of the first lens provides the ability to have lens widths that taper inward and depressions positioned relative to the underlying LED chip. Combinations of shapes for the first and second lenses may be configured to collectively provide tailored light emission profiles in corresponding LED packages.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:LED封裝件</p>  
        <p type="p">12-1:第一透鏡</p>  
        <p type="p">12-2:第二透鏡</p>  
        <p type="p">14:支撐結構</p>  
        <p type="p">16:基座</p>  
        <p type="p">18-1:封裝件安裝墊</p>  
        <p type="p">18-2:封裝件安裝墊</p>  
        <p type="p">18-3:封裝件安裝墊</p>  
        <p type="p">20:LED晶片</p>  
        <p type="p">22:附接墊</p>  
        <p type="p">24:附接墊</p>  
        <p type="p">W1:第一寬度</p>  
        <p type="p">W2:第二寬度</p>  
        <p type="p">W3:第三寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1720" publication-number="202611031"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611031.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611031</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法、半導體元件、樹脂以及酸二酐</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D307/00</main-classification>  
        <further-classification edition="200601120251201B">C08G73/10</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/38</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧野雅臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKINO, MASAOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光性樹脂組成物、將上述組成物硬化而成之硬化物及其製造方法、包含硬化物之積層體及其製造方法、半導體元件及其製造方法、以及新型樹脂，該感光性樹脂組成物含有具有聚合性基之樹脂及聚合起始劑，上述樹脂具有式（A-1a）及式（A-1b）的至少一種部分結構；式（A-1a）中，X&lt;sup&gt;1&lt;/sup&gt;表示特定的結構，Y&lt;sup&gt;1&lt;/sup&gt;表示2價的有機基；式（A-1b）中，X&lt;sup&gt;1&lt;/sup&gt;表示特定的結構，Ax&lt;sup&gt;1&lt;/sup&gt;及Ax&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示氫原子或1價的有機基，Y&lt;sup&gt;1&lt;/sup&gt;表示2價的有機基。 &lt;br/&gt;&lt;img align="absmiddle" height="164px" width="539px" file="ed10114.JPG" alt="ed10114.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1721" publication-number="202611032"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611032.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611032</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130044</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、膜、濾光器、固體攝像元件、圖像顯示裝置、紅外線感測器、相機模組、化合物及化合物之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D327/06</main-classification>  
        <further-classification edition="200601120251201B">C07F5/02</further-classification>  
        <further-classification edition="200601120251201B">C08K5/00</further-classification>  
        <further-classification edition="200601120251201B">C08K5/55</further-classification>  
        <further-classification edition="200601120251201B">C08L101/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G02B5/22</further-classification>  
        <further-classification edition="202301120251201B">H04N23/55</further-classification>  
        <further-classification edition="202301120251201B">H04N23/57</further-classification>  
        <further-classification edition="202501120251201B">H10F39/12</further-classification>  
        <further-classification edition="202501120251201B">H10F77/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴田拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUTA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原彰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮田哲志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYATA, TETSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松村季彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMURA, TOKIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉壮一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, SOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種組成物，其包含：包含顏料之色材；式（1）所表示之化合物；具有胺值之樹脂；及溶劑。一種膜、濾光器、固體攝像元件、圖像顯示裝置、紅外線感測器、相機模組、化合物及化合物之製造方法。 &lt;br/&gt;&lt;img align="absmiddle" height="99px" width="357px" file="ed10106.JPG" alt="ed10106.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1722" publication-number="202611341"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611341.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611341</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電鍍期間用於流動隔離與集中的設備</chinese-title>  
        <english-title>APPARATUS FOR FLOW ISOLATION AND FOCUSING DURING ELECTROPLATING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">C25D17/06</main-classification>  
        <further-classification edition="200601120251212B">C25D17/12</further-classification>  
        <further-classification edition="200601120251212B">C25D21/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼克二世　史帝芬　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANIK II, STEPHEN J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴克羅　布萊恩　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUCKALEW, BRYAN L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯克　亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERKE, AARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福特納　詹姆士　艾薩克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORTNER, JAMES ISAAC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥伯斯特　賈斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBERST, JUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邁爾　史蒂芬　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAYER, STEVEN T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉許　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RASH, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">此處所述各種實施例關於方法和設備，用於將材料電鍍至半導體基板上。在一些實例中，可設置一或多個隔膜與一離子電阻元件接觸，以在電鍍期間將電解液從一橫向流歧管向後通過該離子電阻元件而進入一離子電阻元件歧管的程度最小化。該隔膜可加以設計以在一些實施例中使電解液以所欲方式擇路。在這些或其他實例中，在該離子電阻元件歧管中可設置一或多個擋板，以將電解液藉由向後流動通過離子電阻元件且在離子電阻元件歧管內橫跨電鍍槽而能夠繞過橫向流歧管的程度降低。這些技術可用以改善電鍍結果的均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments described herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. In some cases, one or more membrane may be provided in contact with an ionically resistive element to minimize the degree to which electrolyte passes backwards from a cross flow manifold, through the ionically resistive element, and into an ionically resistive element manifold during electroplating. The membrane may be designed to route electrolyte in a desired manner in some embodiments. In these or other cases, one or more baffles may be provided in the ionically resistive element manifold to reduce the degree to which electrolyte is able to bypass the cross flow manifold by flowing back through the ionically resistive element and across the electroplating cell within the ionically resistive element manifold. These techniques can be used to improve the uniformity of electroplating results.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:電鍍槽</p>  
        <p type="p">102:基板</p>  
        <p type="p">103:基板固持器</p>  
        <p type="p">104:陽極</p>  
        <p type="p">105:隔膜</p>  
        <p type="p">106:隔膜框架</p>  
        <p type="p">107:離子電阻元件</p>  
        <p type="p">108:前側插件</p>  
        <p type="p">109:堰牆</p>  
        <p type="p">110:橫向流歧管</p>  
        <p type="p">111:離子電阻元件歧管</p>  
        <p type="p">112:陽極腔室</p>  
        <p type="p">113:側入口</p>  
        <p type="p">114:側出口</p>  
        <p type="p">115:肋部</p>  
        <p type="p">116:入口</p>  
        <p type="p">130:擋板</p>  
        <p type="p">139:擋板區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1723" publication-number="202610610"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610610.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610610</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130068</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於筋膜管理的磁化按摩器</chinese-title>  
        <english-title>MAGNETIZING MASSAGE TOOL FOR FASCIA TREATMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">A61H39/04</main-classification>  
        <further-classification edition="200601120250901B">A61H23/02</further-classification>  
        <further-classification edition="200601120250901B">A61H7/00</further-classification>  
        <further-classification edition="200601120250901B">A61N2/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李侑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YOO MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李侑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YOO MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種用於筋膜管理的磁化按摩器，所述磁化按摩器用於利用磁波來矯正筋膜的扭曲，包括：手柄環，具有向左右延伸的手柄桿和從手柄桿的兩端部向前方延伸的一對連接臂；連接桿，配置於手柄桿的前方，左右兩端部連接於該對連接臂，在內部左右並排形成有複數個容納部，所述複數個容納部具有朝向前方的開口；複數個圓盤狀磁鐵，其後半部容納於複數個容納部，其前半部分別透過開口向外部突出，且彼此隔著微小間距；及複數個刮刀罐（Scraper can），具有半圓形的容納空間，用於覆蓋複數個圓盤狀磁鐵的前半部。據此，透過滲透到皮膚深層處的磁力和抗磁性刮刀罐形成的磁力的渦旋效應，啟動或正常化筋膜的生物電流，從而可有效緩解筋膜和肌肉的緊張或扭曲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:手柄環</p>  
        <p type="p">41:手柄桿</p>  
        <p type="p">42、43:連接臂</p>  
        <p type="p">50:連接桿</p>  
        <p type="p">70、80:刮刀罐</p>  
        <p type="p">70p、80p:前端部</p>  
        <p type="p">72、82:半圓盤部</p>  
        <p type="p">73、83:半圓周面部</p>  
        <p type="p">74、84:邊緣線部</p>  
        <p type="p">I:凹陷空間</p>  
        <p type="p">S:內側空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1724" publication-number="202610807"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610807.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610807</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130072</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膜形成方法及物品製造方法</chinese-title>  
        <english-title>FILM FORMATION METHOD AND ARTICLE MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B29C59/02</main-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神保悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIMBO, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒澤史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROSAWA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在基板上形成平坦化膜的膜形成方法，包括：使模具中應形成平坦化膜的圓形區域與基板上的組成物接觸；在組成物與模具接觸的狀態下，進行基板與模具之間的對準，以及在進行對準之後，對組成物施加固化能量，其中，在使模具與組成物接觸的過程中，當模具的一部分接觸組成物之後，在模具的圓形區域的整個表面接觸組成物之前開始進行對準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A film formation method of forming a planarized film on a substrate, includes bringing a circular region of a mold, in which the planarized film should be formed, into contact with a composition on the substrate, performing alignment between the substrate and the mold in a state in which the composition and the mold are in contact, and applying curing energy to the composition after the performing alignment, wherein after a part of the mold contacts the composition in the bringing the mold into contact with the composition, the performing alignment is started before an entire surface of the circular region of the mold contacts the composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:膜形成裝置</p>  
        <p type="p">2:成分供給單元</p>  
        <p type="p">3:膜形成單元</p>  
        <p type="p">5:控制器</p>  
        <p type="p">6:基板</p>  
        <p type="p">7,10:基板台</p>  
        <p type="p">8:供給單元</p>  
        <p type="p">9:成分</p>  
        <p type="p">20:液膜</p>  
        <p type="p">21:模具</p>  
        <p type="p">22:模具支架</p>  
        <p type="p">23:照射器</p>  
        <p type="p">24:光透射構件</p>  
        <p type="p">25:快門</p>  
        <p type="p">26:壓力調節器</p>  
        <p type="p">27:TTM測量單元</p>  
        <p type="p">R:封閉空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1725" publication-number="202611710"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611710.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611710</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130081</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像信號處理器硬體之虛擬化</chinese-title>  
        <english-title>VIRTUALIZATION OF IMAGE SIGNAL PROCESSOR HARDWARE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F9/455</main-classification>  
        <further-classification edition="200601120251201B">G06F9/50</further-classification>  
        <further-classification edition="202301120251201B">H04N23/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商谷歌有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOGLE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大泉宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OIZUMI, MUNENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩達特　科赫　莫塔莎　賽意德　侯賽因</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SADAT KOOCH MOHTASHA, SEYED HOSSEIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳菀瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於虛擬化影像信號處理(ISP)之方法、系統及設備，包括編碼在電腦儲存媒體上之電腦程式。一種方法可包括：將一第一虛擬機(VM)指派給一第一影像捕捉裝置且將一第二VM指派給一第二影像捕捉裝置；將裝置記憶體之一第一部分分配給該第一VM且將該裝置記憶體之一第二部分分配給該第二VM；將一第一ISP區塊之處理參數儲存於該裝置記憶體之該第一部分中；將指示該裝置記憶體之該第一部分之一位置的資料提供至耦合至複數個ISP區塊之一微控制器；將來自該裝置記憶體之該第一部分的處理參數傳輸至與該第一ISP區塊相對應之ISP暫存器；及使用該等處理參數處理來自該第一影像捕捉裝置之影像資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and apparatus, including computer programs encoded on computer storage media, for virtualizing image signal processing (ISP). A method can include assigning a first virtual machine (VM) to a first image capture device and a second VM to a second image capture device; allocating a first portion of the device memory to the first VM and a second portion of the device memory to the second VM; storing processing parameters of a first ISP block in the first portion of the device memory; providing data indicating a location of the first portion of the device memory to a microcontroller coupled to the plurality of ISP blocks; transmitting the processing parameters from the first portion of the device memory to ISP registers corresponding to the first ISP block; and processing image data from the first image capture device using the processing parameters.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">102:裝置</p>  
        <p type="p">102a:智慧型電話</p>  
        <p type="p">102b:平板電腦</p>  
        <p type="p">102c:膝上型電腦</p>  
        <p type="p">102d:可穿戴裝置</p>  
        <p type="p">104:記憶體裝置</p>  
        <p type="p">106:SoC</p>  
        <p type="p">108:處理區塊</p>  
        <p type="p">110:記憶體單元</p>  
        <p type="p">112:中央處理單元</p>  
        <p type="p">120:原始影像資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1726" publication-number="202611562"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611562.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611562</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130083</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於極紫外（ＥＵＶ）成像系統之基於閃耀光柵之反射式光譜純度濾光器</chinese-title>  
        <english-title>BLAZED GRATING BASED REFLECTIVE SPECTRAL PURITY FILTER FOR EUV IMAGING SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">G02B5/26</main-classification>  
        <further-classification edition="200601120251209B">G02B5/18</further-classification>  
        <further-classification edition="200601120251209B">G02B27/44</further-classification>  
        <further-classification edition="200601120251209B">G02B27/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱文華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, WENHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>是　瑞方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, RUI-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉詹德蘭　拉吉夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAJENDRAN, RAJEEV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於極紫外(EUV)光之反射式光譜純度濾光器(SPF)，其包含：一基板，其具有一反射表面及至少60度之一入射角；及一閃耀繞射光柵，其形成於該基板上，該閃耀繞射光柵具有一光柵節距及閃耀角(固定的或可變的)，經組態以同時將入射EUV光繞射成一更高階繞射角且將頻帶外(OOB)光限制在一0階反射角以角度分離該EUV光與該OOB光。一成像系統包含該反射式SPF，該成像系統具有一視場(FOB)，經組態以收集經空間濾光EUV光且基於該等光之角度分離拒斥該OOB光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A reflective spectral purity filter (SPF) for extreme ultraviolet (EUV) light includes a substrate having a reflective surface and an angle of incidence of at least 60 degrees, and a blazed diffraction grating formed on the substrate, the blazed diffraction grating having a grating pitch and blaze angle (fixed or variable) configured to simultaneously diffract incident EUV light into a higher-order diffraction angle and confine out-of-band (OOB) light to a 0th order reflection angle to angularly separate the EUV light and the OOB light. An imaging system including the reflective SPF, the imaging system having a field of view (FOV) configured to collect the spatially filtered EUV light and reject the OOB light based on angular separation of the lights.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:反射式光譜純度濾光器(SPF)</p>  
        <p type="p">102:掠入射反射鏡</p>  
        <p type="p">104:閃耀繞射光柵</p>  
        <p type="p">106:塗層</p>  
        <p type="p">θ&lt;sub&gt;B&lt;/sub&gt;:閃耀角</p>  
        <p type="p">θ&lt;sub&gt;i&lt;/sub&gt;:入射角</p>  
        <p type="p">θ&lt;sub&gt;s&lt;/sub&gt;:1階繞射角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1727" publication-number="202612540"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612540.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612540</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130090</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發電參數匹配之光伏電池總成</chinese-title>  
        <english-title>PHOTOVOLTAIC CELL ASSEMBLIES FOR POWER GENERATION PARAMETER MATCHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251212B">H10F19/00</main-classification>  
        <further-classification edition="202501120251212B">H10F19/30</further-classification>  
        <further-classification edition="202501120251212B">H10F19/90</further-classification>  
        <further-classification edition="202501120251212B">H10F77/20</further-classification>  
        <further-classification edition="201401120251212B">H02S40/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商坦登光伏公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANDEM PV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝利　柯林大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAILIE, COLIN DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃伯斯帕赫　克里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBERSPACHER, CHRIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光伏裝置包括一第一光伏電池總成及一第二光伏電池總成。該第一光伏電池總成包括串聯地電連接之薄膜光伏電池之一第一群組及串聯地電連接之光伏電池之一第二群組。該第二光伏電池總成包括串聯地電連接之薄膜光伏電池之一第三群組及串聯地電連接之光伏電池之一第四群組。該第一群組及該第三群組具有一共同電極。該第一光伏電池總成與該第二光伏電池總成之一電連接經組態以匹配由該第一群組及該第三群組以及由該第二群組及該第四群組所產生之一最大功率下電壓(Vmp)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photovoltaic device includes a first photovoltaic cell assembly and a second photovoltaic cell assembly. The first photovoltaic cell assembly includes a first group of thin-film photovoltaic cells electrically connected in series and a second group of photovoltaic cells electrically connected in series. The second photovoltaic cell assembly includes a third group of thin-film photovoltaic cells electrically connected in series and a fourth group of photovoltaic cells electrically connected in series. The first group and the third group have a common electrode. An electrical connection of the first photovoltaic cell assembly and the second photovoltaic cell assembly is configured to match a voltage at maximum power (Vmp) generated by the first group and the third group and by the second group and the fourth group.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:示意表示</p>  
        <p type="p">202:光伏電池</p>  
        <p type="p">204:鈣鈦礦光伏電池</p>  
        <p type="p">206:堆疊模組總成</p>  
        <p type="p">208:第一串聯連接</p>  
        <p type="p">210:第二串聯連接</p>  
        <p type="p">212:第三串聯連接</p>  
        <p type="p">214:第四串聯連接</p>  
        <p type="p">216:第五串聯連接</p>  
        <p type="p">218:第六串聯連接</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1728" publication-number="202612539"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612539.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612539</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130106</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發電參數匹配之光伏電池總成</chinese-title>  
        <english-title>PHOTOVOLTAIC CELL ASSEMBLIES FOR POWER GENERATION PARAMETER MATCHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251212B">H10F10/19</main-classification>  
        <further-classification edition="202501120251212B">H10F19/30</further-classification>  
        <further-classification edition="202501120251212B">H10F19/00</further-classification>  
        <further-classification edition="202501120251212B">H10F77/20</further-classification>  
        <further-classification edition="202501120251212B">H10F19/90</further-classification>  
        <further-classification edition="201401120251212B">H02S40/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商坦登光伏公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANDEM PV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝利　柯林大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAILIE, COLIN DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃伯斯帕赫　克里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBERSPACHER, CHRIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光伏裝置包括一第一光伏電池總成及一第二光伏電池總成。該第一光伏電池總成包括串聯地電連接之薄膜光伏電池之一第一群組及串聯地電連接之光伏電池之一第二群組。該第二光伏電池總成包括串聯地電連接之薄膜光伏電池之一第三群組及串聯地電連接之光伏電池之一第四群組。該第一群組及該第三群組具有一共同電極。該第一光伏電池總成及該第二光伏電池總成之一電連接經組態以匹配由該第一群組及該第三群組以及由該第二群組及該第四群組所產生之一最大功率下電壓(Vmp)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photovoltaic device includes a first photovoltaic cell assembly and a second photovoltaic cell assembly. The first photovoltaic cell assembly includes a first group of thin-film photovoltaic cells electrically connected in series and a second group of photovoltaic cells electrically connected in series. The second photovoltaic cell assembly includes a third group of thin-film photovoltaic cells electrically connected in series and a fourth group of photovoltaic cells electrically connected in series. The first group and the third group have a common electrode. An electrical connection of the first photovoltaic cell assembly and the second photovoltaic cell assembly is configured to match a voltage at maximum power (Vmp) generated by the first group and the third group and by the second group and the fourth group.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1729" publication-number="202611977"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611977.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611977</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130115</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01J37/32</main-classification>  
        <further-classification edition="200601120251201B">H01L21/3065</further-classification>  
        <further-classification edition="200601120251201B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊倉翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAKURA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種降低環境負荷並且選擇性地蝕刻含有矽之膜之基板處理方法及電漿處理裝置。 &lt;br/&gt;本發明之基板處理方法具有如下工序：(a)於電漿處理腔室內之基板支持部上提供基板，該基板具有由含有矽及氮之膜所構成之第1區域、及由含有矽與碳及/或氧之膜所構成之第2區域；(b)將上述基板暴露於由包含第1含氫氣體之第1處理氣體產生之第1電漿；及(c)將上述基板暴露於包含含有氟及氫之單一氣體或混合氣體之第2處理氣體，或將上述基板暴露於由上述第2處理氣體產生之第2電漿。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101:步驟</p>  
        <p type="p">S102:步驟</p>  
        <p type="p">S103:步驟</p>  
        <p type="p">S104:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1730" publication-number="202612281"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612281.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612281</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於資料重構之方法及設備</chinese-title>  
        <english-title>METHODS AND APPARATUSES FOR DATA RESTRUCTURING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H03M7/30</main-classification>  
        <further-classification edition="201401120251201B">H04N19/132</further-classification>  
        <further-classification edition="201401120251201B">H04N19/30</further-classification>  
        <further-classification edition="201401120251201B">H04N19/34</further-classification>  
        <further-classification edition="201101120251201B">H04N21/234</further-classification>  
        <further-classification edition="200601120251201B">G06T9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商維諾瓦國際公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>V-NOVA INTERNATIONAL LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米德爾頓　科林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIDDLETON, COLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲爾曼　露西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIRMAN, LUCY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一第一範疇，提供一種資料重構之電腦實施方法，該方法包含：接收包含輸入元素之輸入資料，各輸入元素表示一輸入值；針對各輸入值產生一對應經裁剪值；針對各輸入值產生包含表示一溢位值之一對應溢位元素的溢位資料；針對各輸入值產生一對應模數值；及針對各輸入元素產生經重構資料，該經重構資料包含一對應經重構元素，該對應經重構元素包含該對應經裁剪值及該模數值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to a first aspect, there is provided a computer-implemented method of data restructuring, the method comprising: receiving input data comprising input elements, each input element representing an input value; generating, for each input value, a corresponding clipped value; generating overflow data comprising, for each input value, a corresponding overflow element representing an overflow value; generating, for each input value, a corresponding modulus value; and generating restructured data comprising, for each input element, a corresponding restructured element comprising the corresponding clipped value and modulus value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S200:步驟</p>  
        <p type="p">S202:步驟</p>  
        <p type="p">S204:步驟</p>  
        <p type="p">S206:步驟</p>  
        <p type="p">S208:步驟</p>  
        <p type="p">S210:步驟</p>  
        <p type="p">S212:步驟</p>  
        <p type="p">S214:步驟</p>  
        <p type="p">S216:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1731" publication-number="202610917"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610917.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610917</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130193</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在多層商店設施中排程物件順序交付的裝置和方法</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR SCHEDULING SEQUENCED DELIVERY OF ITEMS IN A MULTILEVEL STORE FACILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">B65G47/26</main-classification>  
        <further-classification edition="200601120251210B">B65G47/46</further-classification>  
        <further-classification edition="200601120251210B">B65G43/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商辛波提克有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYMBOTIC LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐尼　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOWNEY, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　優平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, RICK YOUPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種產品訂單履行系統，包括：多層傳輸系統，其每一層級具有混合箱盒的相應的獨立非同步層級傳輸系統，與該多層傳輸系統的其他各層級相應的該非同步層級傳輸系統獨立且不同，該非同步層級傳輸系統定義相應於該層級的非同步層級傳輸軸陣列，且被配置以裝載和非同步傳輸至少一箱盒，從而提供沿著該非同步層級傳輸軸陣列的混合箱盒的傳輸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A product order fulfillment system comprising: a multi-level transport system, each level thereof having a corresponding independent asynchronous level transport system, of mixed cases, separate and distinct from the asynchronous level transport system corresponding to each other level of the multi-level transport system, the asynchronous level transport system defining an array of asynchronous level transport axes, corresponding to the level, and being configured to hold and asynchronously transport at least one case providing transport of mixed cases along the array of asynchronous level transport axes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:自動導引車</p>  
        <p type="p">120B:軌道</p>  
        <p type="p">130L:層級</p>  
        <p type="p">150:升降機</p>  
        <p type="p">150B1:升降機</p>  
        <p type="p">150B2:升降機</p>  
        <p type="p">150B3:升降機</p>  
        <p type="p">150B4:升降機</p>  
        <p type="p">150CEL:升降機</p>  
        <p type="p">150X1:升降軸</p>  
        <p type="p">150X2:升降軸</p>  
        <p type="p">150X3:升降軸</p>  
        <p type="p">150X4:升降軸</p>  
        <p type="p">300:公共輸出</p>  
        <p type="p">500:升降和傳輸系統</p>  
        <p type="p">555:公共進給介面</p>  
        <p type="p">ALM:非同步層級傳輸系統</p>  
        <p type="p">LHD:負載處理裝置</p>  
        <p type="p">TJ:軌跡</p>  
        <p type="p">TL1:堆疊層</p>  
        <p type="p">TL2:堆疊層</p>  
        <p type="p">TS:傳送站</p>  
        <p type="p">VLC:垂直升降控制</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1732" publication-number="202610812"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610812.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610812</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130247</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加壓裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">B30B5/04</main-classification>  
        <further-classification edition="200601120251215B">B30B11/18</further-classification>  
        <further-classification edition="200601120251215B">B21B13/14</further-classification>  
        <further-classification edition="200601120251215B">B21B29/00</further-classification>  
        <further-classification edition="200601120251215B">F16C13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯吉克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SGIC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勢井啟介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勢井秀平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEI, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">若於加壓輥的兩端部設置軸頸部，有時會造成加壓輥的結構變得複雜。加壓裝置(1)具有：一對傳輸帶(B1、B2)，其夾持並輸送被加工物(W)；及一對加壓輥(R1、R2)，其配置在夾持一對傳輸帶的位置處並通過一對傳輸帶向被加工物施加負重。一對加壓輥中的至少一加壓輥具有空心結構，並透過與傳輸帶的摩擦力進行旋轉。具有空心結構之加壓輥能形成為圓柱狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:加壓裝置</p>  
        <p type="p">10:壓力調節機構</p>  
        <p type="p">11,21:支撐輥</p>  
        <p type="p">12:支撐構件</p>  
        <p type="p">13:可動構件</p>  
        <p type="p">14:汽缸單元</p>  
        <p type="p">15:活塞</p>  
        <p type="p">16:導引構件</p>  
        <p type="p">20:支撐機構</p>  
        <p type="p">22:支撐構件</p>  
        <p type="p">30:第一裝置主體</p>  
        <p type="p">40:第二裝置主體</p>  
        <p type="p">B1,B2:傳輸帶</p>  
        <p type="p">D1,D2,D3:箭頭方向</p>  
        <p type="p">R1,R2:加壓輥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1733" publication-number="202610562"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610562.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610562</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130251</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有可調整扣件總成的錶帶</chinese-title>  
        <english-title>WATCHBANDS WITH ADJUSTABLE BUCKLE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">A44B11/14</main-classification>  
        <further-classification edition="200601120251103B">A44C5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆斯塔法　札基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOUSTAFA, ZAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒂桑迪耶　克雷門　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TISSANDIER, CLEMENT C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐任俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JEN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德森　茉莉　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDERSON, MOLLY J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢部修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YABE, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種錶帶可包括可調整扣件總成。此一扣件總成可提供對使用者的穩固附接，以及可調整的大小。例如，扣件可釋離地耦接至扣件接合器，該扣件接合器將帶體保持在使用者的手腕上。藉由進一步的實例，扣件接合器可相對於帶體調整，以提供對使用者的客製適配。此一扣件總成可提供由使用者輕鬆調整以及穩固附接，以避免在外力下意外釋離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A watchband can include an adjustable buckle assembly. Such a buckle assembly can provide secure attachment to a user as well as adjustable sizing. For example, a buckle can releasably couple to a buckle engager that retains a band body onto a wrist of a user. By further example, the buckle engager can be adjusted with respect to the band body to provide a custom fit to the user. Such a buckle assembly can provide ease of adjustment by a user as well as secure attachment to avoid inadvertent release under external forces.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:電子裝置</p>  
        <p type="p">16:殼體</p>  
        <p type="p">20:錶帶</p>  
        <p type="p">22:內帶部分</p>  
        <p type="p">24:外帶部分</p>  
        <p type="p">30:殼體連接器</p>  
        <p type="p">32:帶體</p>  
        <p type="p">40:保持環</p>  
        <p type="p">50:扣件總成</p>  
        <p type="p">100:扣件接合器</p>  
        <p type="p">110:夾鉗槓桿</p>  
        <p type="p">200:扣件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1734" publication-number="202610651"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610651.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610651</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130252</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液體組合物</chinese-title>  
        <english-title>LIQUID COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/5513</main-classification>  
        <further-classification edition="200601120251201B">A61K31/4965</further-classification>  
        <further-classification edition="200601120251201B">A61K31/438</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4353</further-classification>  
        <further-classification edition="200601120251201B">A61K31/403</further-classification>  
        <further-classification edition="200601120251201B">A61P27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商庫博光學國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COOPERVISION INTERNATIONAL LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　玉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YUWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯得　羅伯特　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROAD, ROBERT ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供阿托品(atropine)及其他毒蕈鹼乙醯膽鹼受體拮抗劑之眼科上可接受之調配物，其可經熱滅菌而不會顯著降解毒蕈鹼乙醯膽鹼受體拮抗劑。該等調配物之酸性比先前毒蕈鹼乙醯膽鹼受體拮抗劑眼部調配物低，從而使其在投與至眼睛時更舒適。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Ophthalmically-acceptable formulations of atropine and other muscarinic acetylcholine receptor antagonists are provided that can be heat-sterilized without significant degradation of the muscarinic acetylcholine receptor antagonist. The formulations are less acidic than prior muscarinic acetylcholine receptor antagonist ophthalmic formulations, making them more comfortable when administered to the eye.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1735" publication-number="202611768"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611768.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611768</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130254</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體參數的設計方法及電子裝置</chinese-title>  
        <english-title>DESIGN METHOD FOR SEMICONDUCTOR PARAMETERS AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251103B">G06F30/30</main-classification>  
        <further-classification edition="202001120251103B">G06F30/20</further-classification>  
        <further-classification edition="200601120251103B">H01L21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林沂蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹念怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAN, NIEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗永徽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUNG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷　天杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAWAT, TEJENDER SINGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游瑋丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭逸楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪嘉隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIA-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭浩中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HAO-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體參數的設計方法及電子裝置。半導體參數的設計方法包含將條件參數輸入至條件變量自動編碼器（conditional variational autoencoder, CVAE）模型的解碼器，以產生預測設計參數；將預測設計參數輸入至CVAE模型的編碼器，以產生對應預測設計參數的預測條件參數；以及依據預測條件參數以及條件參數來修正預測設計參數，以產生輸出設計參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Design method and electronic device of semiconductor parameters. The design method of semiconductor parameters includes: inputting a conditional parameter to a conditional variational autoencoder (CVAE) model, to generate a predicted design parameter; inputting the predicted design parameter to an encoder of the CVAE model to generate a predicted conditional parameter corresponding to the predicted design parameter; and calibrating the predicted design parameter according to the predicted conditional parameter and the conditional parameter to generate an output design parameter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S12:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1736" publication-number="202611868"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611868.zip"/>
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      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611868</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130270</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於學習之點雲幾何壓縮架構</chinese-title>  
        <english-title>A LEARNING-BASED POINT CLOUD GEOMETRY COMPRESSION FRAMEWORK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06T9/00</main-classification>  
        <further-classification edition="201101120251201B">G06T19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位ＶＣ控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL VC HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龐　家昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANG, JIAHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛迪　穆罕默德　阿薩德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LODHI, MUHAMMAD ASAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安廷炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, JUNGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田　棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個實施方案中，對一點雲之幾何形狀進行編碼/解碼。在編碼器側上，編碼器基於該點雲之一當前層級及/或一或多個更精細層級之一三維像素佔用狀態判定表示該當前層級及/或該等更精細層級之該三維像素佔用狀態的一第一特徵；判定表示該點雲之該當前層級及/或該等更精細層級之該三維像素佔用狀態之預測的一第二特徵；基於該第一特徵及該第二特徵判定與該當前層級及/或該等更精細層級之該三維像素佔用狀態相關聯的一第三特徵；及對該第三特徵進行編碼。在解碼器側上，自一位元串流對該第一特徵進行解碼，與該編碼器側類似地判定該第二特徵，且基於該第一特徵及該第二特徵判定該第三特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one implementation, geometry of a point cloud is encoded/decoded. On the encoder side, the encoder determines a first feature representing a voxel occupancy status of a current level and/or one or more finer levels of the point cloud, based on the voxel occupancy status of the current level and/or the finer levels; determines a second feature representing prediction of the voxel occupancy status of the current level and/or the finer levels of the point cloud; determines a third feature associated with the voxel occupancy status of the current level and/or the finer levels, based on the first feature and the second feature; and encodes the third feature. On the decoder side, the first feature is decoded from a bitstream, the second feature is determined similarly as the encoder side, and the third feature is determined based on the first feature and the second feature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1110:減少取樣模組(D)</p>  
        <p type="p">1120:特徵彙總(FA)模組</p>  
        <p type="p">1130:條件編碼器(CE)模組</p>  
        <p type="p">1140:特徵編碼器(FE)</p>  
        <p type="p">1145:八元樹編碼器</p>  
        <p type="p">1150:特徵解碼器(FD)</p>  
        <p type="p">1160:條件解碼器(CD)</p>  
        <p type="p">1170:超先驗合成(HS)模組</p>  
        <p type="p">1180:佔用解碼器(OD)</p>  
        <p type="p">1190:特徵增加取樣(FU)模組</p>  
        <p type="p">1195:連接</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1737" publication-number="202612228"> 
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      <tif no="1" file="202612228.zip"/>
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    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612228</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>振動產生裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">H02K33/18</main-classification>  
        <further-classification edition="200601120251212B">B06B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商阿爾卑斯阿爾派股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPS ALPINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水津貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUIZU, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之振動產生裝置於使用磁鐵產生振動之構成中提高磁鐵之定位精度。保持永久磁鐵之磁軛具有載置永久磁鐵之平板狀部、及分別形成於平板狀部之沿第1方向上之兩端邊之區域之可動體孔，可動體孔之緣部中之可動體孔所沿著之平板狀部之端邊側之緣部沿第2方向延伸，平板狀部之可動體孔與可動體孔所沿著之端邊之間成為以向第3方向之上側突出之方式變形而成之可動體突出部，於分別設置於平板狀部之第1方向上之兩端邊之可動體突出部之可動體孔側之端面之間保持有永久磁鐵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:罩構件</p>  
        <p type="p">2:基座構件</p>  
        <p type="p">101:振動產生裝置</p>  
        <p type="p">CTR:控制部</p>  
        <p type="p">HS:殼體</p>  
        <p type="p">NV:非振動體</p>  
        <p type="p">VB:振動體</p>  
        <p type="p">VE:振動裝置</p>  
        <p type="p">X1:方向</p>  
        <p type="p">X2:方向</p>  
        <p type="p">Y1:方向</p>  
        <p type="p">Y2:方向</p>  
        <p type="p">Z1:方向</p>  
        <p type="p">Z2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1738" publication-number="202611728"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611728.zip"/>
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    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
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        <document-id> 
          <doc-number>202611728</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130294</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於基於歸約之記憶體中處理架構的自動索引機制</chinese-title>  
        <english-title>AUTO-INDEXING MECHANISMS FOR REDUCTION-BASED PROCESSING-IN-MEMORY ARCHITECTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251201B">G06F12/08</main-classification>  
        <further-classification edition="200601120251201B">G06F13/16</further-classification>  
        <further-classification edition="200601120251201B">G06F3/06</further-classification>  
        <further-classification edition="201801120251201B">G06F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商谷歌有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOGLE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙　英宰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, BENJAMIN YOUNGJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹洪日</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, HONGIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　仁浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, INHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕魯古帕利　阿萊克亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERUGUPALLI, ALEKHYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了用於實施用於一積體記憶體裝置之基於歸約之記憶體中處理架構之自動索引機制的方法及系統，包括電腦可讀媒體。一種方法包括：對於一第一PiM命令，儲存一第一位置索引，該第一位置索引與從中獲得一第一權重縮放係數的一記憶體庫之一列及行相對應；及基於該第一PiM命令使用該第一權重縮放係數執行一計算。該方法包括：對於一第二PiM命令，基於該第一位置索引及一第二權重之位置資訊來計算一距離值；基於該距離值來判定用於獲得一第二權重縮放係數之一第二權重縮放係數索引；及基於該第二PiM命令使用該第二權重縮放係數來執行一計算，該第二權重縮放係數係使用該第二權重縮放係數索引來獲得的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems, including computer-readable media, are described for implementing auto-indexing mechanisms for reduction-based processing-in-memory architectures of an integrated memory device. A method includes, for a first PiM command, storing a first location index corresponding to a row and column of a memory bank from which a first weight scale is obtained and executing a computation using the first weight scale based on the first PiM command. The method includes, for a second PiM command, computing a distance value based on the first location index and location information of a second weight, determining, based on the distance value, a second weight scale index for obtaining a second weight scale and executing, based on the second PiM command, a computation using the second weight scale obtained using the second weight scale index.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:程序</p>  
        <p type="p">1002:步驟</p>  
        <p type="p">1004:步驟</p>  
        <p type="p">1006:步驟</p>  
        <p type="p">1008:步驟</p>  
        <p type="p">1010:步驟</p>  
        <p type="p">1020:步驟</p>  
        <p type="p">1030:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1739" publication-number="202611951"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611951.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611951</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130311</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供高磁導率的複合磁性材料</chinese-title>  
        <english-title>COMPOSITE MAGNETIC MATERIAL PROVIDING HIGH MAGNETIC PERMEABILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01F1/147</main-classification>  
        <further-classification edition="200601120251201B">H01F1/24</further-classification>  
        <further-classification edition="200601120251201B">H01F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫至堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, ZHIJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金洸洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KWANG-SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　劍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種複合磁性材料，包括複合非磁性材料(MA)和磁性填料(MB)。磁性填料(MB)包括散佈在複合非磁性材料(MA)中的包覆型磁性顆粒。包覆型磁性顆粒(MB)包括表面包覆有絕緣包覆層(MB2)的磁性金屬顆粒(MB1)。該複合磁性材料在頻率不超過200MHz時具有不低於13的相對磁導率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composite magnetic material including a composite non-magnetic material (MA) and a magnetic filler (MB). The magnetic filler (MB) includes coated magnetic particles dispersed in the composite non-magnetic material (MA). The coated magnetic particles (MB) include magnetic metal particles (MB1) that are surface coated with an insulation coating layer (MB2). The composite magnetic material provides a high relative magnetic permeability no lower than 13 at a frequency of no greater than 200MHz.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:封裝模組</p>  
        <p type="p">11:基板</p>  
        <p type="p">11D:第二表面</p>  
        <p type="p">11U:第一表面</p>  
        <p type="p">12:功率開關單元</p>  
        <p type="p">12B:背面</p>  
        <p type="p">12T:頂面</p>  
        <p type="p">13:導電線圈</p>  
        <p type="p">13S:主體</p>  
        <p type="p">14:磁性模塑料(MMC)</p>  
        <p type="p">15:電容性儲能裝置</p>  
        <p type="p">111:導電佈線結構</p>  
        <p type="p">112:焊墊</p>  
        <p type="p">113:接腳</p>  
        <p type="p">121:導電焊墊</p>  
        <p type="p">122:底部填充材料</p>  
        <p type="p">123:導電柱/凸塊</p>  
        <p type="p">124:導電晶片附著材料</p>  
        <p type="p">131:第一線圈端子</p>  
        <p type="p">132:第二線圈端子</p>  
        <p type="p">133:導電附著材料</p>  
        <p type="p">136:薄絕緣層</p>  
        <p type="p">141:非磁性材料</p>  
        <p type="p">142:包覆型磁性金屬顆粒</p>  
        <p type="p">143:磁性金屬顆粒</p>  
        <p type="p">144:絕緣包覆層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1740" publication-number="202612485"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612485.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612485</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種具有低模量複合磁性材料的封裝模組</chinese-title>  
        <english-title>PACKAGED MODULE WITH LOW MODULUS COMPOSITE MAGNETIC MOLDING MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251212B">H10D1/20</main-classification>  
        <further-classification edition="200601120251212B">H01F1/20</further-classification>  
        <further-classification edition="202301120251212B">H01L25/16</further-classification>  
        <further-classification edition="200601120251212B">H01F17/02</further-classification>  
        <further-classification edition="200601120251212B">H01F1/26</further-classification>  
        <further-classification edition="200601120251212B">H01F27/28</further-classification>  
        <further-classification edition="200601120251212B">H01L23/29</further-classification>  
        <further-classification edition="200701120251212B">H02M1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫至堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, ZHIJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金洸洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KWANG-SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　劍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝模組，包括導電線圈；和覆蓋該導電線圈的複合磁性材料，該複合磁性材料包括：磁性填料，該磁性填料包括散佈在所述複合非磁性材料(MA)中的包覆型磁性顆粒(MB)；降膜量填料(MC)，其包括降膜量顆粒或橡膠顆粒，或者包括具有-OH或-COOH官能團的填料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A packaged module includes an electrically conductive coil and a composite magnetic molding material covering the electrically conductive coil. The composite magnetic molding material includes a magnetic filler including coated magnetic particles (MB) dispersed in a composite non-magnetic material (MA). The composite magnetic molding material further includes a modulus reducing filler (MC) including modulus reducing particles or rubber particles or including functional groups having -OH or -COOH.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:封裝模組</p>  
        <p type="p">11:基板</p>  
        <p type="p">11D:第二表面</p>  
        <p type="p">11U:第一表面</p>  
        <p type="p">12:功率開關單元</p>  
        <p type="p">12B:背面</p>  
        <p type="p">12T:頂面</p>  
        <p type="p">13:導電線圈</p>  
        <p type="p">13S:主體</p>  
        <p type="p">14:磁性模塑料(MMC)</p>  
        <p type="p">15:電容性儲能裝置</p>  
        <p type="p">111:導電佈線結構</p>  
        <p type="p">112:焊墊</p>  
        <p type="p">113:接腳</p>  
        <p type="p">121:導電焊墊</p>  
        <p type="p">122:底部填充材料</p>  
        <p type="p">123:導電柱/凸塊</p>  
        <p type="p">124:導電晶片附著材料</p>  
        <p type="p">131:第一線圈端子</p>  
        <p type="p">132:第二線圈端子</p>  
        <p type="p">133:導電附著材料</p>  
        <p type="p">136:薄絕緣層</p>  
        <p type="p">141:非磁性材料</p>  
        <p type="p">142:包覆型磁性金屬顆粒</p>  
        <p type="p">143:磁性金屬顆粒</p>  
        <p type="p">144:絕緣包覆層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1741" publication-number="202612486"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612486.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612486</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130314</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種具有效能改進的複合磁性材料的封裝模組</chinese-title>  
        <english-title>PACKAGED MODULE WITH COMPOSITE MAGNETIC MOLDING MATERIAL HAVING IMPROVED PERFORMANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251212B">H10D1/20</main-classification>  
        <further-classification edition="200601120251212B">H01F1/20</further-classification>  
        <further-classification edition="202301120251212B">H01L25/16</further-classification>  
        <further-classification edition="200601120251212B">H01F17/02</further-classification>  
        <further-classification edition="200601120251212B">H01F1/26</further-classification>  
        <further-classification edition="200601120251212B">H01F27/28</further-classification>  
        <further-classification edition="200601120251212B">H01L23/29</further-classification>  
        <further-classification edition="200701120251212B">H02M1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫至堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, ZHIJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金洸洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KWANG-SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　劍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝模組，包括導電線圈；以及覆蓋該導電線圈的複合磁性材料，其中該複合磁性材料包括散佈在所述複合非磁性材料(MA)中的包覆型磁性顆粒(MB)；所述包覆型磁性顆粒(MB)的表面由絕緣包覆層(MB2)包覆，該絕緣包覆層(MB2)含有矽(Si)、碳(C)和氧(O)元素，和/或所述絕緣包覆層(MB2)中含有矽(Si)，所述矽(Si)的含量，以在所述複合磁性材料中的質量百分比衡量為0.52%至2.93%之間，且允許±20%的預定公差範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A packaged module includes an electrically conductive coil and a composite magnetic molding material covering the electrically conductive coil. The magnetic molding compound includes coated magnetic particles (MB) dispersed in a composite non-magnetic material (MA). The coated magnetic particles (MB) are surface coated with an insulation coating layer (MB2) that contains elements Silicon (Si), Carbon (C), and Oxygen (O) or that contains element Si in an amount of 0.52% to 2.93% by mass with a predetermined tolerance margin of ±20%.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:封裝模組</p>  
        <p type="p">11:基板</p>  
        <p type="p">12:功率開關單元</p>  
        <p type="p">13:導電線圈</p>  
        <p type="p">14:磁性模塑料(MMC)</p>  
        <p type="p">15:電容性儲能裝置</p>  
        <p type="p">111:導電佈線結構</p>  
        <p type="p">112:焊墊</p>  
        <p type="p">113:接腳</p>  
        <p type="p">121:導電焊墊</p>  
        <p type="p">122:底部填充材料</p>  
        <p type="p">123:導電柱/凸塊</p>  
        <p type="p">124:導電晶片附著材料</p>  
        <p type="p">130:功率轉換拓撲</p>  
        <p type="p">131:第一線圈端子</p>  
        <p type="p">132:第二線圈端子</p>  
        <p type="p">133:導電附著材料</p>  
        <p type="p">136:薄絕緣層</p>  
        <p type="p">141:非磁性材料</p>  
        <p type="p">142:包覆型磁性金屬顆粒</p>  
        <p type="p">143:磁性金屬顆粒</p>  
        <p type="p">144:絕緣包覆層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1742" publication-number="202611233"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611233.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611233</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130333</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚醯亞胺膜之製造方法及聚醯亞胺膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">C08L79/08</main-classification>  
        <further-classification edition="200601120251209B">C08G73/10</further-classification>  
        <further-classification edition="200601120251209B">C08J5/22</further-classification>  
        <further-classification edition="200601120251209B">B32B27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＵＢＥ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UBE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根本雄基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMOTO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小濱幸徳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOHAMA, YUKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本間壮輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONMA, SOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種透光性得到改善之芳香族系聚醯亞胺膜之製造方法。該聚醯亞胺膜之製造方法包括：步驟(1)，其係將使含有芳香族四羧酸二酐之四羧酸成分與含有芳香族二胺之二胺成分反應而獲得之聚醯亞胺前驅物組合物塗佈於支持基材上；步驟(2)，其係自所塗佈之聚醯亞胺前驅物組合物去除溶劑；步驟(3)，其係使聚醯亞胺前驅物組合物進行醯亞胺化，而獲得聚醯亞胺膜；及步驟(4)，其係將包含300 nm～500 nm之波長之光照射於聚醯亞胺前驅物組合物及/或聚醯亞胺膜；將步驟(4)與選自步驟(1)、步驟(2)及步驟(3)中之至少1個步驟同時實施，以及/或者在選自步驟(1)、步驟(2)及步驟(3)中之至少1個步驟之後實施。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1743" publication-number="202610942"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610942.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610942</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130344</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化銀膠、使用該氧化銀膠之半導體器件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C01G5/00</main-classification>  
        <further-classification edition="200601120251210B">C09J1/00</further-classification>  
        <further-classification edition="200601120251210B">C09J9/02</further-classification>  
        <further-classification edition="200601120251210B">H01L21/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中央硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉村亮太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIMURA, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高崎幹大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKASAKI, MIKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中辻惇也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATSUJI, JUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱田潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供即使在低溫下之接合中亦可獲得良好之接合強度並且能夠達成超過20 μm之接合層之厚度的氧化銀膠。本發明係一種氧化銀膠，其包含：平均厚度為1～100 nm且D50為100～350 nm的具有薄片形狀之氧化銀粒子，以及深寬比為6.0以下且D50為2.0 μm以下的含銀粒子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:半導體</p>  
        <p type="p">3:乾燥膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1744" publication-number="202611228"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611228.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611228</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130367</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物可降解的樹脂組成物和使用其製造的生物可降解的物件</chinese-title>  
        <english-title>BIODEGRADABLE RESIN COMPOSITION AND BIODEGRADABLE ARTICLE MANUFACTURED USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">C08L67/04</main-classification>  
        <further-classification edition="200601120251205B">C08K5/10</further-classification>  
        <further-classification edition="200601120251205B">C08L101/16</further-classification>  
        <further-classification edition="200601120251205B">A01K85/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＣＪ第一製糖股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CJ CHEILJEDANG CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許旻行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEO, MIN HAENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成學永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, HAKYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金志勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卞榮碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BYUN, YOUNG SUCK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李恩惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, EUN-HYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金廷洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JEONGSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹基哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, KI CHULL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張允在</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, YUNJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種生物可降解的樹脂組成物以及一種使用其製備的生物可降解的物件。該生物可降解的樹脂組成物包含一聚羥基烷酸酯(PHA)樹脂及一塑化劑，其中該樹脂組成物具有一塑化劑吸收速率控制在一具體的範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a biodegradable resin composition and to a biodegradable article prepared using the same. The biodegradable resin composition comprises a polyhydroxyalkanoate (PHA) resin and a plasticizer, wherein the resin composition has a plasticizer absorption rate controlled to a specific range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1745" publication-number="202610632"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610632.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610632</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130374</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗過量給藥的組合物及其用途</chinese-title>  
        <english-title>ANTI-OVERDOSING COMPOSITIONS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/4985</main-classification>  
        <further-classification edition="200601120251201B">A61K31/4188</further-classification>  
        <further-classification edition="200601120251201B">A61K31/357</further-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">A61P9/00</further-classification>  
        <further-classification edition="200601120251201B">A61P3/00</further-classification>  
        <further-classification edition="200601120251201B">A61P25/00</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商珀立康（美國）醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLYKLEITOS PHARMACEUTICALS LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張詩宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHIYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊立楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LINAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供了抗過量給藥的組合物及其用途。具體而言，本文提供了包含線粒體解偶聯劑和GLP-1R激動劑的抗過量給藥的藥物組合物及其用途，以及預防過量給藥該解偶聯劑的方法。此類藥物組合物可以用於治療疾病，諸如但不限於NASH、超重、肥胖、與超重或肥胖相關的醫學併發症、2型糖尿病(T2D)和阿爾茨海默病及相關癡呆(AD/ADRD)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are anti-overdosing compositions and uses thereof. Specifically, provided herein are anti-overdosing pharmaceutical compositions comprising a mitochondrial uncoupler and a GLP-1R agonist and uses thereof as well as methods for preventing overdosing of the uncoupler. Such pharmaceutical compositions can be useful for treating diseases, such as but not limited to NASH, overweight, obesity, medical complications related to overweight or obesity, type 2 diabetes (T2D), and Alzheimer’s disease and related dementias (AD/ADRD).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1746" publication-number="202612190"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612190.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612190</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130409</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高密度、高速電連接器及其系統</chinese-title>  
        <english-title>HIGH-DENSITY, HIGH-SPEED ELECTRICAL CONNECTOR AND SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">H01R13/502</main-classification>  
        <further-classification edition="201101120251202B">H01R13/646</further-classification>  
        <further-classification edition="201101120251202B">H01R12/71</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安費諾商用電子産品（成都）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMPHENOL COMMERCIAL PRODUCTS (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡小東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, XIAODONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了高密度、高速電連接器及其系統。連接器可以包括波紋遮罩件。該遮罩件包括形成凹槽的第一部分以及連接相鄰第一部分的第二部分，一個或多個信號端子可以設置在凹槽處。第二部分包括配置用於接觸配合連接器的互補樑的樑部。信號端子和遮罩件的樑部兩者均配置用於兩個接觸點。遮罩件配置為使得兩個配合連接器的遮罩件形成圍繞配合接觸部（例如，兩個接觸點）的外殼。包括電源端子和一對或多對電源引腳和電源插座的電源導體可以對稱設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">High-density, high-speed electrical connectors and system thereof are provided. A connector can include a corrugated shield. The shield includes first portions forming recesses where one or more signal terminals can be disposed, and second portions connecting adjacent first portions. The second portions include beams configured for contacting complementary beams of a mating connector. Both the signal terminals and the beams of the shield are configured for two contact points. The shields are configured such that the shields of two mating connectors form enclosures around the mating contact portions (e.g., both of the two contact points). Power conductors, including power terminals and one or more pairs of power pin and power receptacle, can be symmetrically disposed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一電連接器</p>  
        <p type="p">200:殼體組件</p>  
        <p type="p">201:上殼體</p>  
        <p type="p">202:下殼體</p>  
        <p type="p">211:第一配合介面</p>  
        <p type="p">212:第一安裝介面</p>  
        <p type="p">230:第一邊緣</p>  
        <p type="p">231:肋條</p>  
        <p type="p">232:定位柱</p>  
        <p type="p">2321:定位孔</p>  
        <p type="p">240:第二邊緣</p>  
        <p type="p">241:定位銷</p>  
        <p type="p">250:定位槽</p>  
        <p type="p">261:第一倒角</p>  
        <p type="p">262:第二倒角</p>  
        <p type="p">2012:壁</p>  
        <p type="p">300:端子</p>  
        <p type="p">800:第一電氣元件</p>  
        <p type="p">900:第二電氣元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1747" publication-number="202611254"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611254.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611254</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著帶、及黏著帶之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C09J133/10</main-classification>  
        <further-classification edition="200601120251210B">C09J127/06</further-classification>  
        <further-classification edition="201801120251210B">C09J7/22</further-classification>  
        <further-classification edition="200601120251210B">C08F2/22</further-classification>  
        <further-classification edition="200601120251210B">B32B25/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石田泰則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIDA, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓮見水貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASUMI, MIZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種長期內不易產生剝落之黏著帶。 &lt;br/&gt;本發明之一態樣係一種黏著帶，其具備包含聚氯乙烯樹脂之基材層、及設置於上述基材層之至少一面之橡膠系黏著劑層。上述橡膠系黏著劑層含有(甲基)丙烯酸聚合物。上述黏著帶於23℃下利用依據JIS Z0237：2000之方法測得之黏著力V&lt;sub&gt;1&lt;/sub&gt;為1.8～4.0 N/10 mm。進而，基於將上述黏著帶於60℃氛圍下保管10天後測得之黏著力V&lt;sub&gt;2&lt;/sub&gt;及V&lt;sub&gt;1&lt;/sub&gt;而算出之黏著力維持率為90%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1748" publication-number="202611255"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611255.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611255</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130474</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著帶、及黏著帶之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09J133/10</main-classification>  
        <further-classification edition="200601120251201B">C09J127/06</further-classification>  
        <further-classification edition="201801120251201B">C09J7/25</further-classification>  
        <further-classification edition="200601120251201B">C09J11/04</further-classification>  
        <further-classification edition="200601120251201B">C09J11/08</further-classification>  
        <further-classification edition="201901120251201B">B32B7/027</further-classification>  
        <further-classification edition="200601120251201B">H01L23/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石田泰則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIDA, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓮見水貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASUMI, MIZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種長期內不易產生剝落及黏膩且適合於低溫環境下使用之黏著帶。 &lt;br/&gt;本發明之一態樣係一種黏著帶，其具備包含聚氯乙烯樹脂之基材層、及設置於上述基材層之至少一面之橡膠系黏著劑層。上述黏著帶於-33℃下利用依據JIS Z0237：2009之方法測得之拉伸斷裂伸長率為50%以上。又，上述橡膠系黏著劑層中之(甲基)丙烯酸聚合物之含量為5～25質量%。進而，上述橡膠系黏著劑層之23℃下之儲存彈性模數為0.25～0.45 MPa。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1749" publication-number="202611319"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611319.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611319</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物理氣相沉積模組及包括物理氣相沉積模組之半導體處理系統</chinese-title>  
        <english-title>PHYSICAL VAPOR DEPOSITION MODULE AND SEMICONDUCTOR PROCESSING SYSTEM INCLUDING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C23C14/56</main-classification>  
        <further-classification edition="200601120251211B">C23C14/34</further-classification>  
        <further-classification edition="200601120251211B">H01L21/67</further-classification>  
        <further-classification edition="200601120251211B">H01L21/677</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　品成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, TONY PING-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露揭露了物理氣相沉積(PVD)系統及模組。例示性系統可包括一或多個PVD模組、一除氣模組、一預清洗模組及/或一或多個輔助模組。該等輔助模組可用作冷卻模組、度量衡模組或類似者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Physical vapor deposition (PVD) systems and modules are disclosed. Exemplary systems can include one or more PVD modules, a degas module, a preclean module, and/or one or more ancillary modules. The ancillary modules can be used as cool down modules, metrology modules, or the like.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:前端模組</p>  
        <p type="p">104:負載鎖設備</p>  
        <p type="p">106:模組</p>  
        <p type="p">106A:第一處理室</p>  
        <p type="p">106B:第二處理室</p>  
        <p type="p">108:模組</p>  
        <p type="p">108A:第一處理室</p>  
        <p type="p">108B:第二處理室</p>  
        <p type="p">110:模組</p>  
        <p type="p">110A:第一處理室</p>  
        <p type="p">110B:第二處理室</p>  
        <p type="p">112:模組</p>  
        <p type="p">112A:第一處理室</p>  
        <p type="p">112B:第二處理室</p>  
        <p type="p">113:基材搬運室</p>  
        <p type="p">114:機器人</p>  
        <p type="p">116:負載埠</p>  
        <p type="p">118:第一機器人</p>  
        <p type="p">120:第一端效器</p>  
        <p type="p">122:第二端效器</p>  
        <p type="p">124:對準器</p>  
        <p type="p">126:對準器</p>  
        <p type="p">128:轉台</p>  
        <p type="p">130:感測器</p>  
        <p type="p">132:轉台</p>  
        <p type="p">134:感測器</p>  
        <p type="p">136:冷卻台</p>  
        <p type="p">138:負載鎖</p>  
        <p type="p">140:負載鎖</p>  
        <p type="p">142:閘閥</p>  
        <p type="p">144:閘閥</p>  
        <p type="p">146:閘閥</p>  
        <p type="p">148:第一部分</p>  
        <p type="p">150:第二部分</p>  
        <p type="p">152:雙臂基材/晶圓搬運臂</p>  
        <p type="p">154:閘閥</p>  
        <p type="p">156:閘閥</p>  
        <p type="p">158:閘閥</p>  
        <p type="p">160:閘閥</p>  
        <p type="p">162:閘閥</p>  
        <p type="p">164:閘閥</p>  
        <p type="p">168:閘閥</p>  
        <p type="p">170:閘閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1750" publication-number="202611884"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611884.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611884</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130619</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於高衝擊環境的ＬＥＤ顯示螢幕</chinese-title>  
        <english-title>LED DISPLAY FOR USE IN HIGH IMPACT ENVIRONMENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">G09F9/33</main-classification>  
        <further-classification edition="200601120251215B">F16F15/02</further-classification>  
        <further-classification edition="200601120251215B">F16F15/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商全球產品資源有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBAL PRODUCT SOURCES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　傑瑞米Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JEREMY D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於高衝擊環境的LED顯示單元，包括設置在外殼內的框架，框架上附接有多個LED顯示模組。每個顯示模組包含支撐結構、泡沫減震器、多個彈簧偏置減震器、印刷電路板和前保護面板。泡沫減震器與彈簧偏置減震器佈置在框架和支撐結構的後表面之間。印刷電路板附接在支撐結構的前表面，包括由前保護面板覆蓋的LED陣列。當前保護面板受到異物撞擊時，泡沫減震器和彈簧偏置減震器的組合可提供足夠的減震，防止印刷電路板受損。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An LED display unit for use in high impact environments includes a frame disposed within a housing, with multiple LED display modules attached to the frame. Each display module includes a support structure, a foam shock absorber, multiple spring-biased shock absorbers, a printed circuit board, and a front protective panel. The foam shock absorber and the spring-biased shock absorbers are disposed between the frame and a rear surface of the support structure. The printed circuit board, which is attached to a front surface of the support structure, includes an array of LEDs that are covered by the front protective panel. The combination of the foam shock absorber and the spring-biased shock absorbers provides adequate shock absorption to prevent damage to the printed circuit board when the front protective panel is impacted by a foreign object.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:單元</p>  
        <p type="p">12:顯示模組</p>  
        <p type="p">14:外殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1751" publication-number="202612012"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612012.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612012</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251124B">H01L21/304</main-classification>  
        <further-classification edition="202401120251124B">B08B1/12</further-classification>  
        <further-classification edition="200601120251124B">B05C11/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋拓馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TAKUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於本發明之基板處理裝置中，基板由吸附保持部吸附下表面中央區域，且繞上下方向之軸旋轉。將洗淨液供給至旋轉之基板之下表面。以與旋轉之基板之下表面外側區域接觸之方式，移動刷，洗淨基板之下表面外側區域。此時，刷以第1刷旋轉速度繞上下方向之軸旋轉。將刷與基板接觸時之刷之狀態稱為洗淨狀態。於下表面外側區域之洗淨後，刷以與基板分開之方式移動。將刷與基板分開時之刷之狀態稱為待機狀態。於刷開始自洗淨狀態向待機狀態轉移時，將刷之旋轉速度變更為較第1刷旋轉速度高之第4刷旋轉速度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">bv1:第1刷旋轉速度</p>  
        <p type="p">bv2:第2刷旋轉速度</p>  
        <p type="p">bv3:第3刷旋轉速度</p>  
        <p type="p">bv4:第4刷旋轉速度</p>  
        <p type="p">t1~t15:時點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1752" publication-number="202611346"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611346.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611346</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130697</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>矽物品之製造方法、矽物品及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">C30B29/06</main-classification>  
        <further-classification edition="200601120251205B">C30B33/04</further-classification>  
        <further-classification edition="200601120251205B">C30B33/06</further-classification>  
        <further-classification edition="200601120251205B">C30B33/12</further-classification>  
        <further-classification edition="200601120251205B">C30B35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長山将之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAYAMA, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一例示性實施方式之矽物品之製造方法包含如下步驟：準備分別形成為圓弧狀之單晶矽製之複數個第1矽構件，以複數個第1矽構件中相鄰之第1矽構件之端部彼此相向之方式沿著周向配置複數個第1矽構件；及將複數個第1矽構件接合以製造具有中心軸線之圓筒構件；且製造圓筒構件之步驟包含如下步驟：對包含相鄰之第1矽構件之端部之第1區域內之第1位置照射第1光，並且對與第1位置不同之第1區域內之第2位置照射第2光，以將相鄰之第1矽構件之端部熔融，從而將第1區域中相鄰之第1矽構件相互接合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">MT1:製造方法</p>  
        <p type="p">ST1:步驟</p>  
        <p type="p">ST2:步驟</p>  
        <p type="p">ST3:步驟</p>  
        <p type="p">ST4:步驟</p>  
        <p type="p">ST5:步驟</p>  
        <p type="p">ST6:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1753" publication-number="202612382"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612382.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612382</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130708</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於行動通訊的方法</chinese-title>  
        <english-title>METHODS FOR MOBILE COMMUNICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H04W72/23</main-classification>  
        <further-classification edition="200901120251201B">H04W16/14</further-classification>  
        <further-classification edition="201701120251201B">H04B7/026</further-classification>  
        <further-classification edition="201801120251201B">H04B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳管元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡隆盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, LUNG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於行動通訊的方法，包括：由裝置的處理器向協作設備發送至少一個配置參數，其中該配置參數被發送到該協作設備以確定啟動該協作設備的資料轉發操作的時間；由該處理器根據該配置參數在第一頻段向網路節點發送第一射頻訊號；以及在該協作設備的資料轉發操作被啟動的事件中，由該處理器在第二頻段向該協作設備發送第二射頻訊號，其中該第一射頻訊號和該第二射頻訊號攜帶要發送到該網路節點的上行資料，並且該第一頻段不同於該第二頻段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for mobile communications, comprising: transmitting, by a processor of an apparatus, at least one configuration parameter to a collaborative device, wherein the configuration parameter is transmitted to the collaborative device to determine a time to activate a data forwarding operation of the collaborative device; transmitting, by the processor, a first radio frequency (RF) signal in a first frequency band to a network node according to the configuration parameter; and transmitting, by the processor, a second RF signal in a second frequency band to the collaborative device in an event that the data forwarding operation of the collaborative device is activated, wherein the first RF signal and the second RF signal carry uplink data to be transmitted to the network node, and the first frequency band is different from the second frequency band.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:過程</p>  
        <p type="p">610~630:塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1754" publication-number="202611626"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611626.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611626</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130733</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反射型空白光罩</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251211B">G03F1/24</main-classification>  
        <further-classification edition="201201120251211B">G03F1/58</further-classification>  
        <further-classification edition="201201120251211B">G03F1/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙坂卓郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSAKA, TAKURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生越大河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGOSE, TAIGA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[解決手段] 一種反射型空白光罩，其具有：基板、形成於基板上並反射曝光光的多層反射膜、形成於多層反射膜上的保護膜、及接觸於保護膜而形成並吸收曝光光的吸收體膜，且成為將EUV光作為曝光光的EUV微影術中所使用的反射型光罩的素材，吸收體膜包含佔吸收體膜之厚度的94%以上的主區域，主區域係由鉭(Ta)及氮(N)構成，且由包含以20原子%以下含有氮(N)的低氮化度層及以40原子%以上60原子%以下含有氮(N)的高氮化度層各自1層以上之多層構成。 &lt;br/&gt;　　[效果] 本發明之反射型空白光罩由於吸收體膜的膜應力小，且表面粗度低，因此圖案轉印性能良好，可製造吸收體膜的圖案之缺陷檢查中的靈敏度良好的反射型光罩。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:多層反射膜</p>  
        <p type="p">3:保護膜</p>  
        <p type="p">4:吸收體膜</p>  
        <p type="p">101:反射型空白光罩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1755" publication-number="202610654"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610654.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610654</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130764</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＫＲＡＳ調節化合物</chinese-title>  
        <english-title>KRAS MODULATING COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/553</main-classification>  
        <further-classification edition="200601120251201B">A61K31/55</further-classification>  
        <further-classification edition="200601120251201B">A61K31/5355</further-classification>  
        <further-classification edition="200601120251201B">A61K31/519</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4375</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4184</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4162</further-classification>  
        <further-classification edition="200601120251201B">A61K31/416</further-classification>  
        <further-classification edition="200601120251201B">A61K31/407</further-classification>  
        <further-classification edition="200601120251201B">A61K31/403</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商基利科學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILEAD SCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡納利斯　艾達　Ｙ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANALES, EDA Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克萊克　克里斯多幅　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLARK, CHRISTOPHER T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜　志敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, ZHIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃爾巴特拉維　亞辛　Ｍ　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELBATRAWI, YASSIN M.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格雷文　奎因　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREVEN, QUINN B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘尼　泰茲坎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUNEY, TEZCAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加登　達里爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, DARRYL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金弗　赫諾克　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINFE, HENOK H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ER</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇布魯　艾琳　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIBURU, IRENE N.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉澤威斯　史考特　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAZERWITH, SCOTT E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>密斯　湯瑪斯　Ｃ　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIES, THOMAS C.J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史旺克　克里斯多夫　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWANK, CHRISTOPHER J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯姆士　崔　萊茵農</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMAS-TRAN, RHIANNON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佟廣虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, GUANGHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦特金恩斯　威廉　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATKINS, WILLIAM J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科托帕西　科埃略　威廉　奧古斯托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORTOPASSI COELHO, WILIAN AUGUSTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供可用作為KRAS抑制劑之化合物及其醫藥上可接受之鹽、製造及使用其等（單獨或與額外藥劑組合）之方法、及其醫藥組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are compounds, and pharmaceutically acceptable salts thereof, useful as KRAS inhibitors, methods of making and using the same (singly or in combination with additional agents), and pharmaceutical compositions thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1756" publication-number="202610655"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610655.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610655</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>KRAS抑制劑</chinese-title>  
        <english-title>KRAS INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/553</main-classification>  
        <further-classification edition="200601120251201B">A61K31/519</further-classification>  
        <further-classification edition="200601120251201B">A61K31/438</further-classification>  
        <further-classification edition="200601120251201B">A61K31/35</further-classification>  
        <further-classification edition="200601120251201B">A61K31/416</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商必治妥美雅史谷比公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRISTOL-MYERS SQUIBB COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬克　布萊恩　愛德華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FINK, BRIAN EDWARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席魯德　柏敏　蘇達卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRUDE, PRAVIN SUDHAKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查多帕迪艾　亞密特　庫買</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHATTOPADHYAY, AMIT KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘達　曼諾瑞吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANDA, MANORANJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉卡拉胡　西里什　考許克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAKKARAJU, SIRISH KAUSHIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班納吉　莫洛伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANERJEE, MOLOY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古哈　索姆拉傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUHA, SOMRAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了KRAS抑制劑。還提供了使用該等化合物治療癌症之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides KRAS inhibitors. Methods of treating cancers using the compounds are also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1757" publication-number="202611695"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611695.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611695</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於動態空間音訊演現之多模態追蹤之方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM OF MULTI-MODAL TRACKING FOR DYNAMIC SPATIAL AUDIO RENDERING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F3/16</main-classification>  
        <further-classification edition="200601120251201B">H04S7/00</further-classification>  
        <further-classification edition="200601120251201B">H04R5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴維斯　格雷厄姆布拉德利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVIS, GRAHAM BRADLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩加杜爾席瓦帕　山卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THAGADUR SHIVAPPA, SHANKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉諾維斯　安德烈亞費利斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENOVESE, ANDREA FELICE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩爾基斯　麥克阿迪卜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARKIS, MICHEL ADIB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲斯勒　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISCHLER, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭卡特　法瓦德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAUKAT, FAWAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇梅　亭賽伊特巴里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUME, TINSAYE YITBAREK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃品言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PIN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置包括經組態以儲存多通道音訊內容之一記憶體。該裝置亦包括一或多個處理器，其耦接至該記憶體且經組態以基於來自一第一感測器之第一感測器資料來獲得第一資訊並基於來自一第二感測器之第二感測器資料來獲得第二資訊。該一或多個處理器進一步經組態以基於該第一資訊、該第二資訊、或其組合來選擇一判定方案。該一或多個處理器經組態以基於該判定方案來產生與一音訊輸出裝置相關聯之判定資訊。判定資訊指示定向、定位、或其組合。該一或多個處理器經組態以基於該判定資訊及該多通道音訊內容來產生與該音訊輸出裝置相關聯之一空間音訊輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device includes a memory configured to store multi-channel audio content. The device also includes one or more processors coupled to the memory and configured to obtain first information based on first sensor data from a first sensor and to obtain second information based on second sensor data from a second sensor. The one or more processors are further configured to select, based on the first information, the second information, or a combination thereof, a determination scheme. The one or more processors are configured to generate, based on the determination scheme, determination information associated with an audio output device. The determination information indicates an orientation, a position, or a combination thereof. The one or more processors are configured to generate, based on the determination information and the multi-channel audio content, a spatial audio output associated with the audio output device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:來源裝置；裝置</p>  
        <p type="p">106:記憶體</p>  
        <p type="p">108:處理器</p>  
        <p type="p">110:通訊介面</p>  
        <p type="p">112:第一感測器</p>  
        <p type="p">114:第二感測器</p>  
        <p type="p">116:多通道音訊內容</p>  
        <p type="p">120:估計器</p>  
        <p type="p">122:同步器</p>  
        <p type="p">124:選擇器</p>  
        <p type="p">126:判定器</p>  
        <p type="p">130:音訊單元</p>  
        <p type="p">132:空間音訊演現器</p>  
        <p type="p">140:影像單元</p>  
        <p type="p">142:定向估計器</p>  
        <p type="p">150:音訊輸出裝置；音訊回放裝置</p>  
        <p type="p">156:記憶體</p>  
        <p type="p">158:處理器</p>  
        <p type="p">160:通訊介面</p>  
        <p type="p">162:第三感測器</p>  
        <p type="p">163:揚聲器</p>  
        <p type="p">164:定向估計器</p>  
        <p type="p">172:第一資訊</p>  
        <p type="p">174:第二資訊；第三資訊</p>  
        <p type="p">176:第三資訊</p>  
        <p type="p">180:同步資訊；時間同步資訊</p>  
        <p type="p">182:判定方案</p>  
        <p type="p">184:定向</p>  
        <p type="p">186:定位</p>  
        <p type="p">188:空間音訊輸出</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1758" publication-number="202612220"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612220.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612220</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130908</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線電力系統中之熱管理</chinese-title>  
        <english-title>THERMAL MANAGEMENT IN A WIRELESS POWER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251209B">H02J50/80</main-classification>  
        <further-classification edition="201601120251209B">H02J50/20</further-classification>  
        <further-classification edition="200601120251209B">H02J7/32</further-classification>  
        <further-classification edition="200601120251209B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商杜比智財授權有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLBY INTELLECTUAL PROPERTY LICENSING, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘尼許　賈彥提</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANESH, JAYANTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔提柯達　舍巴雷歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATIKONDA, SUBBARAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎納卡薩巴　維斯瓦娜坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAKASABAI, VISWANATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於一無線電力系統中之熱管理之系統、方法及設備。在一些態樣中，一電力傳輸器(PTx)可基於一電力接收器(PRx)之熱條件來啟動PTx冷卻選項。例如，該PTx可從該PRx接收溫度資訊。當溫度上升時，或當該溫度超過一PRx參考溫度時，該PTx可啟動PTx冷卻及/或一或多個PTx冷卻組件。在一些態樣中，該PTx向該PRx通知PTx冷卻能力，且該PRx使用一或多個冷卻控制封包控制該PTx冷卻(或PTx冷卻組件)之該啟動。當該PTx冷卻不足以將PRx溫度維持低於該PRx參考溫度時，該PTx或該PRx可實施功率降低、暫停電力傳送(在一掩蔽狀態下)或停止無線電力傳送。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides systems, methods and apparatuses for thermal management in a wireless power system. In some aspects, a Power Transmitter (PTx) can activate PTx cooling options based on thermal conditions of a Power Receiver (PRx). For example, the PTx can receive temperature information from the PRx. When the temperature is rising, or when the temperature exceeds a PRx reference temperature, the PTx can activate PTx cooling and/or one or more PTx cooling components. In some aspects, the PTx informs the PRx about PTx cooling capabilities, and the PRx controls the activation of the PTx cooling (or PTx cooling components) using one or more cooling control packets. When the PTx cooling is not sufficient to maintain the PRx temperature below the PRx reference temperature, the PTx or the PRx can implement power reduction, suspend power transfer (in a cloak state), or cease the wireless power transfer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電力傳輸器</p>  
        <p type="p">140:電力接收器</p>  
        <p type="p">408:電力傳送階段</p>  
        <p type="p">410:掩蔽階段</p>  
        <p type="p">700:訊息流程圖</p>  
        <p type="p">702:方塊</p>  
        <p type="p">704:電力傳輸器(PTx)能力資訊</p>  
        <p type="p">706:熱管理資訊</p>  
        <p type="p">708:無線電力</p>  
        <p type="p">710a:熱狀態封包</p>  
        <p type="p">710b:熱狀態封包</p>  
        <p type="p">710c:熱狀態封包</p>  
        <p type="p">710d:熱狀態封包</p>  
        <p type="p">710e:熱狀態封包</p>  
        <p type="p">712:方塊</p>  
        <p type="p">714:電力傳輸器(PTx)冷卻狀態封包</p>  
        <p type="p">716:方塊</p>  
        <p type="p">718:掩蔽封包</p>  
        <p type="p">720:認可封包</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1759" publication-number="202611052"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611052.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611052</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130913</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>攝像用的光電轉換元件用色素材料及使用其的光電轉換元件及使用其的影像感測器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07F5/02</main-classification>  
        <further-classification edition="202501120251201B">H10F30/20</further-classification>  
        <further-classification edition="202501120251201B">H10F39/12</further-classification>  
        <further-classification edition="202501120251201B">H10F39/18</further-classification>  
        <further-classification edition="202301120251201B">H10K39/32</further-classification>  
        <further-classification edition="202301120251201B">H10K85/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日鐵化學材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上棟智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, MUNETOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木寺紗友里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITERA, SAYURI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種實現攝像用的光電轉換元件的高感度化、高解析度化的攝像用的光電轉換元件用色素材料、與使用其的攝像用的光電轉換元件、及將該光電轉換元件積層而使用的影像感測器。具體而言，為一種以滿足下述條件1～條件3的全部為特徵的攝像用的光電轉換元件用色素材料、與使用該色素材料的攝像用的光電轉換元件、及將該攝像用的光電轉換元件積層而成的影像感測器。 &lt;br/&gt;1.   吸收光譜的位於最長波長側的波峰的極大吸收波長的莫耳吸光係數為10&lt;sup&gt;4&lt;/sup&gt; Lmol&lt;sup&gt;-1&lt;/sup&gt;cm&lt;sup&gt;-1&lt;/sup&gt;以上 &lt;br/&gt;2.   吸收光譜的位於最長波長側的波峰的半值寬度為50 nm以下 &lt;br/&gt;3.   ΔEst為0.50 eV以下</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電極</p>  
        <p type="p">2:電洞阻擋層</p>  
        <p type="p">3:光電轉換層</p>  
        <p type="p">4:電子阻擋層</p>  
        <p type="p">5:電極</p>  
        <p type="p">6:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1760" publication-number="202611081"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611081.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611081</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130924</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種阻斷ＢＡＦＦ、ＡＰＲＩＬ作用其受體的融合蛋白</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/28</main-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">C12N15/13</further-classification>  
        <further-classification edition="200601120251201B">C12N15/86</further-classification>  
        <further-classification edition="200601120251201B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　立忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JOHN LIUZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯瑀婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YUTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐赫男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, HENAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, GUANCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李靈芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LINGYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷　鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖雪梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, XUEMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金后聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, HOUCONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王思勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SIQIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了能夠抑制BAFF和APRIL信號傳導的融合蛋白，含有所述融合蛋白的藥物組合物，以及相關用途。此外，本發明還提供了特異性結合血清白蛋白的單域抗體或其抗原結合片段，含有所述單域抗體或其抗原結合片段的融合蛋白，以及其用於延長藥物半衰期的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1761" publication-number="202611073"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611073.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611073</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130935</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>同時結合ＶＥＧＦ及Ａｎｇ－２的Ｆｃ融合蛋白及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/18</main-classification>  
        <further-classification edition="200601120251201B">C07K16/28</further-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">C12N15/63</further-classification>  
        <further-classification edition="200601120251201B">A61P27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐小培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, XIAOPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷　鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楚雪斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, XUEBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, QUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃薪宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, XINYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張春生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHUNSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, NA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯頌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉灝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏　谷良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, GULIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　立忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JOHN LIUZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王思勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SIQIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了能夠同時結合VEGF-A、VEGF-C、VEGF-D和Ang-2的Fc融合蛋白，含有所述融合蛋白的藥物組合物，以及相關用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1762" publication-number="202611269"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611269.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611269</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具複合海綿體結構的層析樹脂</chinese-title>  
        <english-title>CHROMATOGRAPHY RESIN WITH COMPOSITE SPONGE-LIKE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">C09K17/22</main-classification>  
        <further-classification edition="200601120251209B">B01D15/20</further-classification>  
        <further-classification edition="200601120251209B">B01J20/26</further-classification>  
        <further-classification edition="200601120251209B">B01J20/281</further-classification>  
        <further-classification edition="200601120251209B">B01J20/285</further-classification>  
        <further-classification edition="200601120251209B">G01N30/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣創新材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANTTI LABORATORY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜宗翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, TSUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王斯瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHIH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴羽庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周正三</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, BRUCE C. S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李珩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種用於吸附層析的靜相媒質，其包含複數個由交聯高分子材料所製成的複合微球，各個微球包含一內部以及一外表面，該內部包含多個透過連通孔相互連通的球狀巨孔，從而於該內部構成一開放性多孔網絡，該外表面包含複數個開口，而該內部之多孔網絡經由這些開口與該外表面呈流體連通，且該外表面上共價結合有一親水性高分子層；本發明亦提供製造該靜相媒質的方法，以及用於大分子層析分離的相關組成物與方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are stationary phase media for adsorption chromatography comprising a plurality of composite microspheres made of a cross-linked polymeric material, each comprising an interior comprising multiple spherical macropores interconnected with one another via interconnecting pores to constitute an open porous network in the interior, and an outer surface comprising a plurality of openings through which the porous network of the interior is in fluid communication with the outer surface and a layer of a hydrophilic polymer covalently attached to the outer surface; methods of making the stationary phase media, and related compositions and methods for chromatographic separation of macromolecules.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1763" publication-number="202610980"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610980.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610980</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130947</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、填充有組成物的容器、組成物的保管方法及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">C07C49/92</main-classification>  
        <further-classification edition="200601120250901B">C07F11/00</further-classification>  
        <further-classification edition="200601120250901B">C23C16/18</further-classification>  
        <further-classification edition="200601120250901B">H01L21/285</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>志水誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>一戸大吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHINOHE, DAIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村直人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種組成物，其使用水系溶媒，且金屬錯合物的溶解性及保存穩定性均優異。一種組成物，含有：第一化合物，由下述式（1）表示；以及水系溶媒。 &lt;br/&gt;&lt;img align="absmiddle" height="188px" width="414px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1764" publication-number="202611747"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611747.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611747</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130982</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於影像分析的自動化後設資料標記</chinese-title>  
        <english-title>AUTOMATED METADATA TAGGING FOR IMAGE ANALYSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251201B">G06F16/583</main-classification>  
        <further-classification edition="202201120251201B">G06V10/70</further-classification>  
        <further-classification edition="202201120251201B">G06V10/764</further-classification>  
        <further-classification edition="202201120251201B">G06V20/69</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＦＥＩ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEI COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格爾茨　雷姆科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEURTS, REMCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波托切克　帕維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POTOCEK, PAVEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CZ</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了用於輸入影像的自動化後設資料標記的系統或技術。在各種實施例中，一科學儀器可包含電子顯微鏡。在各個態樣中，該科學儀器可使用一分類模型基於一輸入影像的提取性質產生該輸入影像的一或多個部分的形態描述。在各個態樣中，該科學儀器可使用一LLM基於該等提取性質及該等形態描述利用後設資料標記註釋該輸入影像的一或多個部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems or techniques are provided for automated metadata tagging of input images. In various embodiments, a scientific instrument can comprise an electron microscope. In various aspects, the scientific instrument can generate, using a classification model, morphology descriptions for one or more portions of an input image based on extracted properties of the input image. In various aspects, the scientific instrument can annotate, using an LLM, the one or more portions of the input image with metadata tags based on the extracted properties and the morphology descriptions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:電腦實施的方法</p>  
        <p type="p">802:動作</p>  
        <p type="p">804:動作</p>  
        <p type="p">806:動作</p>  
        <p type="p">808:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1765" publication-number="202611628"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611628.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611628</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130986</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔微影設備的部分</chinese-title>  
        <english-title>CLEANING A PORTION OF A LITHOGRAPHIC APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251211B">G03F1/82</main-classification>  
        <further-classification edition="200601120251211B">G03F7/20</further-classification>  
        <further-classification edition="200601120251211B">H05F3/00</further-classification>  
        <further-classification edition="200601120251211B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾瓦雷斯　迪亞茲　曼努埃爾　安東尼奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALVAREZ DIAZ, MANUEL ANTONIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　家宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIAZONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴海堤　安庫爾　拉梅什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAHETI, ANKUR RAMESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席摩曼　約翰　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZIMMERMAN, JOHN DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述一種用於自一微影設備之一夾鉗清潔金屬及聚合物污染粒子的系統。該系統包括一基板，該基板經組態以插入至該微影設備中，由該微影設備之一工具處置器嚙合，並由該工具處置器定位以由該夾鉗夾緊。一層安置於該基板上且經組態以接觸該夾鉗以自該夾鉗移除該等聚合物及金屬粒子。該層經組態有一硬度及一電導率，以致使該層在該層接觸該夾鉗時接納並保留該等粒子，以有利於將該等粒子自該夾鉗轉移至該層，並消散該夾鉗上之靜電荷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for cleaning metallic and polymeric contamination particles from a clamp of a lithographic apparatus is described. The system includes a substrate configured to be inserted into the lithographic apparatus, engaged by a tool handler of the lithographic apparatus, and positioned by the tool handler for clamping by the clamp. A layer is disposed on the substrate and configured to contact the clamp to remove the polymeric and metallic particles from the clamp. The layer is configured with a hardness and a conductivity to cause the layer to receive and retain the particles when the layer contacts the clamp to facilitate transfer of the particles from the clamp to the layer, and to dissipate electrostatic charge on the clamp.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:清潔系統</p>  
        <p type="p">250:基板</p>  
        <p type="p">252:層</p>  
        <p type="p">254:氮化鉻導體</p>  
        <p type="p">700:程序循環</p>  
        <p type="p">702:粒子</p>  
        <p type="p">704:夾頭</p>  
        <p type="p">706:夾鉗</p>  
        <p type="p">708:電極</p>  
        <p type="p">710:倍縮光罩載台</p>  
        <p type="p">712:瘤節</p>  
        <p type="p">750:初始步驟</p>  
        <p type="p">752:接觸步驟</p>  
        <p type="p">754:縮回步驟</p>  
        <p type="p">770:接觸方向</p>  
        <p type="p">780:縮回方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1766" publication-number="202612065"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612065.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612065</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130989</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理液供給裝置、基板處理系統、處理液供給方法及基板處理方法</chinese-title>  
        <english-title>PROCESSING LIQUID SUPPLY DEVICE, SUBSTRATE PROCESSING SYSTEM, PROCESSING LIQUID SUPPLY METHOD AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251120B">H01L21/67</main-classification>  
        <further-classification edition="200601120251120B">B05C11/10</further-classification>  
        <further-classification edition="200601120251120B">B05D1/26</further-classification>  
        <further-classification edition="200601120251120B">B08B3/02</further-classification>  
        <further-classification edition="200601120251120B">B08B3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋賢二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KENJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之基板處理裝置在不朝處理基板之處理部導入處理液之準備狀態、與藉由朝處理部導入處理液而能夠執行基板處理之執行狀態之間選擇性地轉變。於處理液供給裝置中，藉由循環配管將處理液循環。於基板處理裝置處於執行狀態時，將閥單元之動作模式切換為以較高之精度調整流經循環配管之處理液之流量之微調模式。於基板處理裝置轉變為準備狀態之時點以後之時點，將閥單元之動作模式切換為以較低之精度調整流經循環配管之處理液之流量之粗調模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:排液配管</p>  
        <p type="p">11:開閉閥</p>  
        <p type="p">20:供給配管</p>  
        <p type="p">21:泵</p>  
        <p type="p">22:流量感測器</p>  
        <p type="p">23:加熱器</p>  
        <p type="p">24:過濾器</p>  
        <p type="p">30:循環配管</p>  
        <p type="p">31:流量感測器</p>  
        <p type="p">40:循環配管</p>  
        <p type="p">41:開閉閥</p>  
        <p type="p">42:流量感測器</p>  
        <p type="p">50:補充配管</p>  
        <p type="p">51:開閉閥</p>  
        <p type="p">60:分支配管</p>  
        <p type="p">100:處理液供給裝置</p>  
        <p type="p">110:儲存部</p>  
        <p type="p">111:送出部</p>  
        <p type="p">112:送出部</p>  
        <p type="p">113:送入部</p>  
        <p type="p">114:送入部</p>  
        <p type="p">115:送入部</p>  
        <p type="p">116:液面感測器</p>  
        <p type="p">117:液面感測器</p>  
        <p type="p">118:液面感測器</p>  
        <p type="p">119:液面感測器</p>  
        <p type="p">120:閥單元</p>  
        <p type="p">200:基板處理裝置</p>  
        <p type="p">260:處理部</p>  
        <p type="p">261:旋轉夾具</p>  
        <p type="p">262:噴嘴</p>  
        <p type="p">263:杯</p>  
        <p type="p">264:開閉閥</p>  
        <p type="p">270:流量調整部</p>  
        <p type="p">300:基板處理系統</p>  
        <p type="p">310:控制裝置</p>  
        <p type="p">320:處理液源</p>  
        <p type="p">330:氣體源</p>  
        <p type="p">340:廢液裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1767" publication-number="202610941"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610941.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610941</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131032</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>前驅粉體製作方法、陶瓷件製造方法以及陶瓷件</chinese-title>  
        <english-title>PRECURSOR POWDER PRODUCTION METHOD, CERAMIC PART PRODUCTION METHOD, AND CERAMIC PART</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251111B">C01F17/218</main-classification>  
        <further-classification edition="200601120251111B">B22F3/16</further-classification>  
        <further-classification edition="200601120251111B">C04B35/10</further-classification>  
        <further-classification edition="200601120251111B">C04B35/40</further-classification>  
        <further-classification edition="200601120251111B">C04B41/87</further-classification>  
        <further-classification edition="200601120251111B">H01L21/3065</further-classification>  
        <further-classification edition="200601120251111B">D21D1/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王悅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種前驅粉體製作方法、陶瓷件製造方法以及陶瓷件。前驅粉體製作方法包括：獲取純陶瓷粉料作為原材料；採用碳化鎢磨球對原材料進行球磨，以獲得初級前驅粉體；其中，球磨製程包括第一球磨階段和至少一個第二球磨階段；第一球磨階段的球磨速度小於第二球磨階段的球磨速度；對所述初級前驅粉體進行過篩，以得到前驅粉體。本申請利用碳化鎢材料的高硬度、高耐磨性和高密度的特點，對原材料進行球磨，以在保證碳化鎢磨球的重量足以擊碎原材料顆粒的條件下，可以使磨球的體積盡可能地小，以與原材料顆粒充分接觸，能縮短球磨步驟所需的時長。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A precursor powder production method, ceramic part production method, and ceramic part are disclosed. The precursor powder production method includes obtaining pure ceramic powders as a raw material; ball-milling the raw material using tungsten carbide grinding balls to obtain a primary precursor powders; wherein the ball milling process includes a first ball milling stage and at least one second ball milling stage; the ball milling speed in the first ball milling stage is lower than the ball milling speed in the second ball milling stage; and sieving the primary precursor powders to obtain the precursor powders. This application utilizes the high hardness, high wear resistance, and high density of tungsten carbide materials to ball mill the raw material. While ensuring that the weight of the tungsten carbide grinding balls is sufficient to crush the raw material particles, the volume of the grinding balls can be minimized to ensure sufficient contact with the raw material particles, thereby shortening the time required for the ball milling step.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11,S12,S13:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1768" publication-number="202610647"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610647.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610647</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>６－（４－（（１Ｓ，３Ｓ）－１－氨基－３－羥基環丁基）苯基）－１－乙基－７－苯基－１Ｈ－吡啶并［２，３－Ｂ］［１，４］噁嗪－２（３Ｈ）－酮的鹽及晶體形式</chinese-title>  
        <english-title>SALT AND CRYSTALLINE FORMS OF 6-(4-((1S,3S)-1-AMINO-3-HYDROXYCYCLOBUTYL)PHENYL)-1-ETHYL-7-PHENYL-1H-PYRIDO[2,3-B][1,4]OXAZIN-2(3H)-ONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/535</main-classification>  
        <further-classification edition="200601120251201B">A61K31/4353</further-classification>  
        <further-classification edition="200601120251201B">A61P43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商阿爾麥克探索有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALMAC DISCOVERY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈米爾　諾埃爾安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMILL, NOEL ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加爾布雷斯　賈娜路易絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALBRAITH, JANA LOUISE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　特雷西安妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALKER, TRACY ANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛里默　基斯理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LORIMER, KEITH RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明內容涉及6-(4-((1s,3s)-1-氨基-3-羥基環丁基)苯基)-1-乙基-7-苯基-1H-吡啶并[2,3-b][1,4]噁嗪-2(3H)-酮或其鹽、溶劑化物或溶劑化物鹽的晶體形式。 &lt;br/&gt;&lt;img align="absmiddle" height="143px" width="357px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to crystalline forms of 6-(4-((1s,3s)-1-amino-3-hydroxycyclobutyl)phenyl)-1-ethyl-7-phenyl-1H-pyrido[2,3-b][1,4]oxazin-2(3H)-one, &lt;br/&gt;&lt;img align="absmiddle" height="141px" width="361px" file="ed10020.JPG" alt="ed10020.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;  &lt;br/&gt;or a salt, solvate, or solvate salt thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1769" publication-number="202611195"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611195.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611195</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多孔化用延伸膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C08J9/40</main-classification>  
        <further-classification edition="200601120251211B">C08J5/22</further-classification>  
        <further-classification edition="200601120251211B">A61L17/12</further-classification>  
        <further-classification edition="201801120251211B">C08K3/017</further-classification>  
        <further-classification edition="201901120251211B">B29C48/08</further-classification>  
        <further-classification edition="201901120251211B">B32B7/035</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商王子控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OJI HOLDINGS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥村麻子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUMURA, MAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野勝則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種含有生物降解性樹脂、開孔加工性優異、抑制了熱水處理所引起的應變、並且對開孔時的熱水處理所引起的孔縮小的耐性優異的多孔化用膜。一種多孔化用延伸膜，其含有生物降解性樹脂，且在100℃的水中浸漬5分鐘後的面積收縮率為1.0%以上且15.0%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1770" publication-number="202610958"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610958.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610958</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131117</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓電體組成物、壓電體器件、積層致動器、壓電體組成物之製造方法、以及積層致動器之製造方法</chinese-title>  
        <english-title>PIEZOELECTRIC COMPOSITION, PIEZOELECTRIC DEVICE, LAMINATED ACTUATOR, METHOD OF MANUFACTURING PIEZOELECTRIC COMPOSITION, AND METHOD OF MANUFACTURING LAMINATED ACTUATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C04B35/462</main-classification>  
        <further-classification edition="202301120251201B">H10N30/01</further-classification>  
        <further-classification edition="202301120251201B">H10N30/097</further-classification>  
        <further-classification edition="202301120251201B">H10N30/20</further-classification>  
        <further-classification edition="202301120251201B">H10N30/50</further-classification>  
        <further-classification edition="202301120251201B">H10N30/85</further-classification>  
        <further-classification edition="202301120251201B">H10N30/853</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東金股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKIN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立研究開發法人產業技術總合研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊勢理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISE, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤薫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KAORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瑞平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RUIPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種可降低形成壓電體組成物時的燒成溫度之壓電體組成物。本發明的一態樣之壓電體組成物，係將以下述組成式A所表示之組成物作為主成分，且相對於該主成分1mol，包含jmol%的錳元素以及kmol%的銀元素之壓電體組成物。組成式A：{(Na&lt;sub&gt;a&lt;/sub&gt;K&lt;sub&gt;b&lt;/sub&gt;)&lt;sub&gt;1-c-d&lt;/sub&gt;Ba&lt;sub&gt;c&lt;/sub&gt;(Bi&lt;sub&gt;0.5&lt;/sub&gt;Li&lt;sub&gt;0.5&lt;/sub&gt;)&lt;sub&gt;d&lt;/sub&gt;}&lt;sub&gt;e&lt;/sub&gt;(Nb&lt;sub&gt;1-f-g&lt;/sub&gt;Sb&lt;sub&gt;f&lt;/sub&gt;Ta&lt;sub&gt;g&lt;/sub&gt;)&lt;sub&gt;1-h-i&lt;/sub&gt;Zr&lt;sub&gt;h&lt;/sub&gt;Ti&lt;sub&gt;i&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;。此處，0.3＜a＜0.7、0.3＜b＜0.7、0.03＜c＜0.09、0＜d＜0.05、0.9＜e＜1.1、0≦f＜0.04、0.02＜g＜0.08、0.03＜h＜0.09、0＜i＜0.05、0.5＜j＜5、0＜k＜5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1771" publication-number="202612565"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612565.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612565</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光檢測元件及影像感測器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H10K30/85</main-classification>  
        <further-classification edition="202301120251201B">H10K30/86</further-classification>  
        <further-classification edition="202301120251201B">H10K39/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅原怜子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAHARA, REIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光檢測元件，其具有：第1電極；第2電極；光電轉換層，設置於第1電極與第2電極之間；及電洞傳輸層，設置於第2電極與光電轉換層之間，光電轉換層包含量子點QD1及配位體L1，電洞傳輸層包含量子點QD2及配位體L2，量子點QD1及量子點QD2為帶隙為0.72eV以上且1.55eV以下的III-V族量子點，量子點QD2的帶隙Eg2大於量子點QD1的帶隙Eg1，並且量子點QD2的帶隙Eg2與量子點QD1的帶隙Eg1之差為0.06eV以上，配位體L2包含pKa為3以下的化合物或其鹽。一種影像感測器，其包含前述光檢測元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光檢測元件</p>  
        <p type="p">11:第1電極</p>  
        <p type="p">12:第2電極</p>  
        <p type="p">13:光電轉換層</p>  
        <p type="p">21:電子傳輸層</p>  
        <p type="p">22:電洞傳輸層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1772" publication-number="202611385"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611385.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611385</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旅行箱儲存架用鎖定裝置</chinese-title>  
        <english-title>LOCKING DEVICE FOR TRAVEL CARRIER STORAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251016B">E05B65/52</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商莫麗絲安克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORRIS &amp; CO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭泰奉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, TAEBONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的旅行箱儲存架用鎖定裝置包括旅行箱儲存架，旅行箱儲存架包括：多個垂直框架，分別沿垂直方向設置；以及多個水平框架，通過連接多個垂直框架來形成開放的旅行箱儲存空間，旅行箱儲存架用鎖定裝置設置在水平框架，以防止儲存在旅行箱儲存空間的旅行箱被盜，該裝置包括：卡定部，形成有鎖定孔，鎖定孔從水平框架的垂直部連接至水平部，通過鎖定孔在垂直部和水平部形成懸臂結構的支撐端；鎖定模組，設置在垂直部，並具備密碼按鈕和鎖定解鎖旋鈕，且具有設置在垂直部背面的鎖定解鎖部件，從而通過在設定角度內轉動鎖定解鎖部件來選擇性地開閉鎖定孔；以及鎖定金屬線，一端固定在水平框架或垂直框架，在另一端形成用於使支撐端貫通的鎖環。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:旅行箱儲存架</p>  
        <p type="p">12:垂直框架</p>  
        <p type="p">14:水平框架</p>  
        <p type="p">30:強制解除防止單元</p>  
        <p type="p">S:旅行箱儲存空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1773" publication-number="202610558"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610558.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610558</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131237</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手套構造及手套</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251031B">A41D19/015</main-classification>  
        <further-classification edition="200601120251031B">A41D13/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旗艦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLAGSHIP CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野時夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, TOKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之手套2係能夠穿戴於手之物，並具備：手套本體10；設於手套本體10之指節護手部件20；使指節護手部件20與手套本體10連結之連結構造30；及設於手套本體10之緊固部件40。連結構造30係接縫且為使指節護手部件20與手套本體10連結之物。連結構造30，係具備：設於背側第二指片102之第二指片連結部32；設於背側第三指片103之第三指片連結部33；設於背側第四指片104之第四指片連結部34；設於背側第五指片105之第五指片連結部35；及設於第二指片連結部32及第五指片連結部35之兩外側之側邊連結部38。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:手套</p>  
        <p type="p">10:手套本體</p>  
        <p type="p">10X:手腕插入孔</p>  
        <p type="p">11:第一指收容袋</p>  
        <p type="p">12:第二指收容袋</p>  
        <p type="p">13:第三指收容袋</p>  
        <p type="p">14:第四指收容袋</p>  
        <p type="p">15:第五指收容袋</p>  
        <p type="p">18:掌收容袋</p>  
        <p type="p">20:指節護手部件</p>  
        <p type="p">21:指節護手材料</p>  
        <p type="p">25:保持片</p>  
        <p type="p">30:連結構造</p>  
        <p type="p">40:緊固部件</p>  
        <p type="p">41:帶部</p>  
        <p type="p">42:公面黏扣帶</p>  
        <p type="p">43:母面黏扣帶</p>  
        <p type="p">44:掌缺口部</p>  
        <p type="p">100:背側本體片</p>  
        <p type="p">200:掌側本體片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1774" publication-number="202611544"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611544.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611544</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131244</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>協同環境中之低功率存在偵測</chinese-title>  
        <english-title>LOW POWER PRESENCE DETECTION IN COLLABORATIVE ENVIRONMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01S15/87</main-classification>  
        <further-classification edition="202001120251201B">G01S15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索門　梅荷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOMAN, MEHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤迪言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, DIYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特里維迪　尼薩格凱尤爾巴伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIVEDI, NISARG KEYURBHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些實施方案中，一協調裝置可藉由識別一預定區域內之複數個感測裝置並從該複數個感測裝置獲得超音波感測能力報告而基於協同超音波感測執行存在偵測。該協調裝置亦可基於該等超音波感測能力報告而判定該複數個感測裝置的一協同超音波感測組態，用於在該複數個感測裝置的一裝置資源之約束下，增加由該複數個感測裝置之個別視場(field of view, FOV)形成的集體感測FOV。該協調裝置亦可將用於執行該協同超音波感測的該協同超音波感測組態傳輸至該複數個感測裝置中之至少一個感測裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some implementations, a coordinating device may perform presence detection based on collaborative ultrasound sensing by identifying a plurality of sensing devices within a predetermined area and obtaining ultrasound sensing capability reports from the plurality of sensing devices. The coordinating device may also determine a collaborative ultrasound sensing configuration for the plurality of sensing devices based on the ultrasound sensing capability reports for increasing a collective sensing field of view (FOV) formed by individual FOVs of the plurality of sensing devices, under constraints of a device resource for the plurality of sensing devices. The coordinating device may also transmit, to at least one sensing device of the plurality of sensing devices, the collaborative ultrasound sensing configuration for performing the collaborative ultrasound sensing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:存在偵測方法</p>  
        <p type="p">1010:方塊</p>  
        <p type="p">1020:方塊</p>  
        <p type="p">1030:方塊</p>  
        <p type="p">1040:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1775" publication-number="202611744"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611744.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611744</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學互連體</chinese-title>  
        <english-title>OPTICAL INTERCONNECTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F13/42</main-classification>  
        <further-classification edition="200601120251201B">G02B6/42</further-classification>  
        <further-classification edition="201301120251201B">H04B10/556</further-classification>  
        <further-classification edition="201301120251201B">H04B10/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商光程研創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTILUX, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>那允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, NEIL Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學互連體包括發射器單元及接收器單元。發射器單元包括產生源光學訊號的雷射裝置；調變器單元調變源光學訊號，並且產生具有同相分量及正交分量的經調變光學訊號；以及將具有經調變光學訊號的發射光學訊號耦合出發射器單元的第一光學耦合器，其中源光學訊號及經調變光學訊號沿著發射器單元的表面在平面內傳播，並且其中發射光學訊號從發射器單元的表面向平面外傳播。接收器單元包括將發射光學訊號耦合入接收器單元的第二光學耦合器；以及接收發射光學訊號及參考光學訊號的解調變單元，並且產生具有同相及正交分量的經解調變電訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical interconnect includes a transmitter unit and a receiver unit. The transmitter unit includes a laser device configured to generate a source optical signal; a modulator unit configured to modulate the source optical signal and to generate a modulated optical signal having an in-phase component and a quadrature component; and a first optical coupler configured to couple a transmitted optical signal having the modulated optical signal out of the transmitter, where the source optical signal and the modulated optical signal propagate in-plane along a surface of the transmitter, and where the transmitted optical signal propagates out-of-plane from the surface of the transmitter. The receiver unit includes a second optical coupler configured to couple the transmitted optical signal into the receiver; and a demodulator unit configured to receive the transmitted optical signal and a reference optical signal, and generate a demodulated electrical signal having the in-phase and the quadrature components.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:光學互連體</p>  
        <p type="p">110:發射器單元</p>  
        <p type="p">112:雷射裝置</p>  
        <p type="p">114:光學I-Q調變器；第一光學I-Q調變器</p>  
        <p type="p">116:第一光學耦合器；光學耦合器</p>  
        <p type="p">120:接收器單元</p>  
        <p type="p">122:局部參考</p>  
        <p type="p">124:光學I-Q解調變器；第一光學I-Q解調變器</p>  
        <p type="p">126:第二光學耦合器；光學耦合器</p>  
        <p type="p">130:第一數位訊號處理器；第一DSP；DSP</p>  
        <p type="p">140:第一數位類比轉換器；DAC；第一DAC</p>  
        <p type="p">150:第一類比數位轉換器；ADC；第一ADC</p>  
        <p type="p">160:第二數位訊號處理器；DSP</p>  
        <p type="p">170:光纜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1776" publication-number="202611066"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611066.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611066</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131298</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>GLP-1類似物的醫藥用途</chinese-title>  
        <english-title>PHARMACEUTICAL USE OF GLP-1 ANALOGS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K14/605</main-classification>  
        <further-classification edition="200601120251201B">A61K38/17</further-classification>  
        <further-classification edition="200601120251201B">A61P3/00</further-classification>  
        <further-classification edition="200601120251201B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳虹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王明麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MINGLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王一珂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YIKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王泉人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, QUANREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余曉玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, XIAOLING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯雅迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, YADI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王菁菁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JINGJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及GLP-1類似物的醫藥用途。具體而言，本揭露涉及GLP-1類似物或其可藥用鹽用於治療、預防或延遲睡眠呼吸暫停或與其有關病症的醫藥用途和方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to the pharmaceutical use of GLP-1 analogs. Specifically, the disclosure relates to the pharmaceutical use and methods of GLP-1 analogs or their pharmaceutically acceptable salts for treating, preventing, or delaying sleep apnea or related conditions.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1777" publication-number="202612259"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612259.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612259</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131308</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>減小功率管理電路中之供應電壓範圍</chinese-title>  
        <english-title>REDUCING SUPPLY VOLTAGE RANGE IN A POWER MANAGEMENT CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H03F1/06</main-classification>  
        <further-classification edition="201501120251201B">H04B1/38</further-classification>  
        <further-classification edition="200901120251201B">H04W52/34</further-classification>  
        <further-classification edition="200901120251201B">H04W52/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＱＯＲＶＯ美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QORVO US, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克拉特　納迪姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHLAT, NADIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷茲　詹姆斯・Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RETZ, JAMES M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了減小一功率管理電路中之一供應電壓範圍。該功率管理電路包括一收發器電路、一功率管理積體電路(PMIC)及經組態以放大一射頻(RF)訊號以供在一無線裝置中傳輸之一功率放大器電路。具體而言，該收發器電路產生一目標電壓，該PMIC基於該目標電壓產生一供應電壓，且該功率放大器電路基於該供應電壓放大該RF訊號。在本文中，該功率放大器電路可經組態以根據該RF訊號之一瞬時功率位準執行供應調變及/或負載調變，以提高該供應電壓之一最小位準且藉此減小該供應電壓之一峰值至峰值(亦稱為最大值至最小值)範圍。因此，該功率管理電路可以改良之效率及線性度進行操作，以藉此改良一整體使用者體驗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Reducing a supply voltage range in a power management circuit is provided. The power management circuit includes a transceiver circuit, a power management integrated circuit (PMIC), and a power amplifier circuit that are configured to amplify a radio frequency (RF) signal for transmission in a wireless device. Specifically, the transceiver circuit generates a target voltage, the PMIC generates a supply voltage based on the target voltage, and the power amplifier circuit amplifies the RF signal based on the supply voltage. Herein, the power amplifier circuit can be configured to perform supply modulation and/or load modulation in accordance with an instantaneous power level of the RF signal to raise a minimum level of the supply voltage and thereby reduce a peak-to-peak (a.k.a. maximum-to-minimum) range of the supply voltage. As a result, the power management circuit can operate with improved efficiency and linearity to thereby improve an overall user experience.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1778" publication-number="202612198"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612198.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612198</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131322</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電纜組件</chinese-title>  
        <english-title>CABLE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251205B">H01R13/6592</main-classification>  
        <further-classification edition="201101120251205B">H01R12/75</further-classification>  
        <further-classification edition="201101120251205B">H01R12/70</further-classification>  
        <further-classification edition="201101120251205B">H01R12/61</further-classification>  
        <further-classification edition="200601120251205B">H01R9/03</further-classification>  
        <further-classification edition="200601120251205B">H02G1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商太谷康奈特提威提索洛訊有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TE CONNECTIVITY SOLUTIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾　艾伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSANG, ALBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普特　小羅伯特　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUTT, ROBERT LEE, JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉赫曼　茱莉亞　安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LACHMAN, JULIA ANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯明克　魯特格　威廉姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMINK, RUTGER WILHELMUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖恩　雅各布斯　尼可拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUIN, JACOBUS NICOLAAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾茲　琳達　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIELDS, LINDA ELLEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電纜組件(130)，其包括一電纜(14)，該電纜包括具有一端部的電纜導體(142)。該電纜組件包括端接至該電纜導體之該端部的接點(150)。該接點包括一對接端(160)以及一端接端(162)。該對接端具有設置成與一對接接點對接的一對接介面。該端接端設置成在端接處(164)接合至該電纜導體的該端部。該端接端包括一折疊部分(170)，以增加該端接端在該端接處的厚度(154)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cable assembly (130) includes a cable (140) that includes a cable conductor (142) having an end portion. The cable assembly includes a contact (150) terminated to the end portion of the cable conductor. The contact includes a mating end (160) and a terminating end (162). The mating end has a mating interface configured to be mated to a mating contact. The terminating end is configured to be joined to the end portion of the cable conductor at a termination (164). The terminating end includes a folded portion (170) to increase a thickness (154) of the terminating end at the termination.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:電纜組件</p>  
        <p type="p">142:第一電纜導體；電纜導體；導體</p>  
        <p type="p">143:第一絕緣體；絕緣體</p>  
        <p type="p">144:第二電纜導體；電纜導體；導體</p>  
        <p type="p">145:第二絕緣體；絕緣體</p>  
        <p type="p">146:電纜屏蔽</p>  
        <p type="p">148:電纜護套；護套</p>  
        <p type="p">150:接點</p>  
        <p type="p">164:端接處</p>  
        <p type="p">170:折疊部分</p>  
        <p type="p">172:第一面板；面板</p>  
        <p type="p">174:第二面板；面板</p>  
        <p type="p">175:搭接接頭</p>  
        <p type="p">176:折疊的折邊；折邊</p>  
        <p type="p">178:連接部分</p>  
        <p type="p">180:第一外側</p>  
        <p type="p">182:第一邊緣；邊緣</p>  
        <p type="p">184:第一內側</p>  
        <p type="p">190:第二外側</p>  
        <p type="p">192:第二邊緣；邊緣</p>  
        <p type="p">194:第二內側</p>  
        <p type="p">200:接縫</p>  
        <p type="p">202:接縫接頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1779" publication-number="202611705"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611705.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611705</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支援來自處理器指令管線的記憶體存取階段的儲存操作的儲存釋放組合以用於有效率處理儲存釋放指令的寫入緩衝電路及相關方法</chinese-title>  
        <english-title>WRITE BUFFER CIRCUIT SUPPORTING STORE RELEASE COMBINING OF STORE OPERATIONS FROM A MEMORY ACCESS STAGE OF A PROCESSOR INSTRUCTION PIPELINE FOR EFFICIENT PROCESSING OF STORE RELEASE INSTRUCTIONS, AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251117B">G06F9/38</main-classification>  
        <further-classification edition="201801120251117B">G06F9/30</further-classification>  
        <further-classification edition="200601120251117B">G06F9/06</further-classification>  
        <further-classification edition="201601120251117B">G06F12/08</further-classification>  
        <further-classification edition="200601120251117B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜比　桑迪普庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUBEY, SANDEEP KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">支援來自一處理器指令管線的一記憶體存取階段的儲存操作的儲存釋放組合以用於有效率處理儲存釋放指令的寫入緩衝電路及相關方法。該寫入緩衝電路與一處理器的一指令管線介接，以接收經執行儲存指令且將該等經執行儲存指令提交（將資料寫入）至記憶體。即使待審的較早期儲存指令尚未被提交至不可快取記憶體，該寫入緩衝電路允許對一寫入組合緩衝器(WCB)啟動來自一儲存佇列(STQ)的儲存釋放指令。該寫入緩衝電路經組態以延遲釋放來自該WCB的儲存釋放指令以用於將其等的資料寫入至不可快取記憶體，直到任何待審的較早期的儲存指令已被提交為止。此有助於組合該WCB中的位址相關儲存釋放指令，該等位址相關儲存釋放指令可在一單一寫入操作中被寫入至記憶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Write buffer circuit supporting store release combining of store operations from a memory access stage of a processor instruction pipeline for efficient processing of store release instructions, and related methods. The write buffer circuit is interfaced with an instruction pipeline of a processor to receive and commit (write data) executed store instructions to memory. The write buffer circuit allows launching of store release instructions from a store queue (STQ) to a write combining buffer (WCB) even if pending, older store instructions are not yet committed to non-cacheable memory. The write buffer circuit is configured to delay release of store release instructions from the WCB for their data to be written to non-cacheable memory until any pending, older store instructions have been committed. This facilitates combining of address related store-release instructions in the WCB that can be written to memory in a single write operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:指令處理電路</p>  
        <p type="p">108E-R:儲存指令/可組合的儲存釋放指令</p>  
        <p type="p">108E:經執行指令/經執行的儲存指令/儲存指令/已佇列儲存指令</p>  
        <p type="p">116:記憶體系統</p>  
        <p type="p">136:可快取記憶體</p>  
        <p type="p">138:不可快取記憶體</p>  
        <p type="p">202:儲存佇列/STQ</p>  
        <p type="p">203(1)-203(X):指令緩衝器項</p>  
        <p type="p">204:啟動電路</p>  
        <p type="p">205(1)-205(X):輸出埠</p>  
        <p type="p">207(1)-207(B):組合緩衝器項</p>  
        <p type="p">210:待審可快取儲存計數</p>  
        <p type="p">212:可快取待審儲存計數器</p>  
        <p type="p">214:待審不可快取儲存計數</p>  
        <p type="p">216:不可快取待審儲存計數器</p>  
        <p type="p">218:釋放電路</p>  
        <p type="p">219(1)-219(B):輸出埠</p>  
        <p type="p">220:不可快取記憶體介面/不可快取的可觀察記憶體介面</p>  
        <p type="p">222:記憶體匯流排</p>  
        <p type="p">224:儲存操作確認</p>  
        <p type="p">226:待審儲存指示符</p>  
        <p type="p">300:寫入緩衝電路</p>  
        <p type="p">308:啟動控制電路</p>  
        <p type="p">318:釋放電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1780" publication-number="202610756"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610756.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610756</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131364</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>助焊劑配方及接合方法</chinese-title>  
        <english-title>FLUX FORMULATIONS AND JOINING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251021B">B23K35/26</main-classification>  
        <further-classification edition="200601120251021B">B23K35/22</further-classification>  
        <further-classification edition="200601120251021B">B23K35/363</further-classification>  
        <further-classification edition="200601120251021B">B23K35/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商阿爾發金屬化工公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPHA ASSEMBLY SOLUTIONS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕瑪　英德瓦丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARMAR, INDRAVADAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達斯　安蘇曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAS, ANSUMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩里科　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERICO, DANIELE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾　伯尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, BERNICE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里巴斯　莫加納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIBAS, MORGANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種焊料助焊劑，其包含：一或多種胺；鋅化合物；及有機錫化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A solder flux comprising: one or more amines; a zinc compound; and an organotin compound.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1781" publication-number="202611859"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611859.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611859</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像擴增裝置及方法</chinese-title>  
        <english-title>IMAGE AUGMENTATION DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250901B">G06T5/60</main-classification>  
        <further-classification edition="202401120250901B">G06T5/70</further-classification>  
        <further-classification edition="200601120250901B">G06T11/60</further-classification>  
        <further-classification edition="201701120250901B">G06T7/11</further-classification>  
        <further-classification edition="202201120250901B">G06V10/82</further-classification>  
        <further-classification edition="202301120250901B">G06N3/045</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗永徽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUNG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹念怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAN, NIEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊凱霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KAI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林沂蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛煜東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, YUDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉一兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YIBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像擴增裝置及方法，該影像擴增裝置將對應一原始影像之一雜訊影像、對應該原始影像之一語義資訊及一文本向量輸入至一擴散模型，以產生一生成影像，其中該生成影像包含該原始影像之一部分輪廓。該影像擴增裝置將該生成影像及複數個引導影像進行合成，以產生一擴增影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image augmentation device and method are provided. The image augmentation device inputs a noise image corresponding to an original image, a semantic information corresponding to the original image and a text vector into a diffusion model to generate a generated image, wherein the generated image contains a partial contour of the original image. The image augmentation device composites the generated image and a plurality of guide images to generate an augmented image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:影像擴增方法</p>  
        <p type="p">S601、S603:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
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    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611065.zip"/>
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      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611065</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131422</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>pUDK-HGF注射液的用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K14/575</main-classification>  
        <further-classification edition="200601120251201B">A61K38/22</further-classification>  
        <further-classification edition="200601120251201B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商武漢光谷人福生物醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUHAN OPTICS VALLEY HUMANWELL BIO-PHARMACEUTICAL CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商湖北生物醫藥產業技術研究院有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUBEI BIO-PHARMACEUTICAL INDUSTRIAL TECHNOLOGICAL INSTITUTE INC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱聖姬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, SHENGJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何震宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, ZHENYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊簡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIONG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何昆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許晶喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JINGQIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, LAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李小妹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡晶晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, JINGJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛瑤珺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, YAOJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈婉瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, WANYAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳健剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIANGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="17"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂鵬雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUE, PENGYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="18"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LV, SI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="19"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LV, QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="20"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春情</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUNQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="21"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何時明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, SHIMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="22"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余瀾濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, LANTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="23"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王海朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAIPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="24"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳春雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="25"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣鈺霏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YUFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="26"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬錚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="27"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種pUDK-HGF注射液在製備藥物中的用途，所述藥物用於治療患者的肢體靜息痛。本發明的pUDK-HGF注射液可有效治療肢體靜息痛，可降低患者的疼痛完全消失時間、提高患者的疼痛完全消失比例、以及增加患者的疼痛NRS評分下降值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1783" publication-number="202611021"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611021.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611021</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組成物、抗蝕劑圖案形成方法、聚合物及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">C07D207/452</main-classification>  
        <further-classification edition="200601120250901B">C08F222/40</further-classification>  
        <further-classification edition="200601120250901B">G03F7/004</further-classification>  
        <further-classification edition="200601120250901B">G03F7/039</further-classification>  
        <further-classification edition="200601120250901B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白谷宗大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRATANI, MOTOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅珊斯基　伊果</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROZHANSKII, IGOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸田高典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIDA, TAKANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森秀斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, SHUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可形成顯示出良好的CDU性能、由曝光條件的不同引起的CDU性能的變化小、而且缺陷的產生少的抗蝕劑圖案的感放射線性組成物。一種感放射線性組成物，含有包含式（1）所表示的結構單元的聚合物（A），並滿足要件1及要件2中的一個以上，選自由組成物中所含的聚合物（A）及作為非聚合物的感放射線性鎓鹽（B）所組成的群組中的至少一種具有碘原子。要件1：聚合物（A）更包含源自感放射線性鎓鹽的結構單元。要件2：更含有作為非聚合物的感放射線性鎓鹽（B）。式（1）中，L&lt;sup&gt;1&lt;/sup&gt;為單鍵或二價有機基。P&lt;sup&gt;1&lt;/sup&gt;為酸解離性基。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="242px" width="231px" file="ed10048.JPG" alt="ed10048.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1784" publication-number="202610997"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610997.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610997</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131471</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光硬化性組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法、半導體元件及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C251/56</main-classification>  
        <further-classification edition="200601120251201B">C08K5/33</further-classification>  
        <further-classification edition="200601120251201B">C08L101/00</further-classification>  
        <further-classification edition="200601120251201B">C08F283/04</further-classification>  
        <further-classification edition="200601120251201B">C08F290/14</further-classification>  
        <further-classification edition="200601120251201B">C08F299/02</further-classification>  
        <further-classification edition="200601120251201B">C08G73/10</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/40</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification>  
        <further-classification edition="200601120251201B">H01L23/485</further-classification>  
        <further-classification edition="200601120251201B">H01L23/532</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧野雅臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKINO, MASAOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光硬化性組成物、藉由硬化上述組成物而成之硬化物及其製造方法、包含硬化物之積層體及其製造方法、半導體元件及其製造方法以及新型化合物，該光硬化性組成物包含：化合物A，係式（1）所表示之化合物；及化合物B，係具有聚合性基之化合物。 &lt;br/&gt;&lt;img align="absmiddle" height="139px" width="280px" file="ed10100.JPG" alt="ed10100.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1785" publication-number="202611093"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611093.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611093</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性元件、抗蝕劑圖案的形成方法及印刷電路板的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F2/40</main-classification>  
        <further-classification edition="200601120251201B">C08F2/44</further-classification>  
        <further-classification edition="200601120251201B">C08F2/50</further-classification>  
        <further-classification edition="200601120251201B">C08F222/20</further-classification>  
        <further-classification edition="200601120251201B">C08F290/06</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/031</further-classification>  
        <further-classification edition="200601120251201B">G03F7/033</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/09</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">H05K3/06</further-classification>  
        <further-classification edition="200601120251201B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戸田夏木</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TODA, NATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海老原雅彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBIHARA, MASAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>星野稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHINO, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎梨世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, RISE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的感光性元件包括支撐體以及在所述支撐體上形成的感光層，所述感光層含有黏合劑聚合物、光聚合性化合物、光聚合起始劑以及光聚合抑制劑，所述光聚合起始劑包含含芳基的聯咪唑化合物作為第一光聚合起始劑，所述光聚合抑制劑包含在一個分子內具有兩個羥基且在760 mmHg下的沸點為290℃以上的化合物作為第一光聚合抑制劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:感光性元件</p>  
        <p type="p">2:支撐體</p>  
        <p type="p">3:感光層</p>  
        <p type="p">4:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1786" publication-number="202612066"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612066.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612066</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131516</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理基板之歧管結構及使用其之反應器</chinese-title>  
        <english-title>MANIFOLD STRUCTURE FOR PROCESSING SUBSTRATES IN REACTOR AND A REACTOR USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">H01L21/67</main-classification>  
        <further-classification edition="200601120251209B">C23C16/455</further-classification>  
        <further-classification edition="200601120251209B">C23C16/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏帕達亞　維韋克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UPADHAYA, VIVEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金大淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DAEYOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全然孮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, YONJONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳鍾夏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JONGHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種在處理基板之反應器中使用的歧管結構及配備有該歧管結構之該反應器。該歧管結構包含：一歧管圓柱體，豎直地安置且包含一電氣入口；一直流（DC）偏壓電源，經組態以將負偏壓DC供應至該歧管圓柱體，且進一步經組態以連接至該電入口；一頂部注入單元，安置於該歧管圓柱體之頂側處且包含一反應物氣體入口管，且經組態以經由該反應物氣體入口管接收一反應物氣體；以及一底部注入單元，安置於該歧管圓柱體之下側處且包含一源氣體入口管，且經組態以經由該源氣體入口管接收一源氣體，其中該歧管圓柱體由一高導電材料製成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manifold structure used in reactors which process substrates and the reactor equipped with the manifold structure are disclosed. The manifold structure comprises a manifold cylinder disposed vertically and comprising an electrical inlet; a direct current (DC) bias power source configured to supply negatively biased DC to the manifold cylinder and further configured to be connected to the electrical inlet; a top injection unit disposed at topside of the manifold cylinder and comprises a reactant gas inlet tube and configured to receive a reactant gas via the reactant gas inlet tube; and a bottom injection unit disposed at downside of the manifold cylinder and comprises a source gas inlet tube and configured to receive a source gas via the source gas inlet tube, wherein the manifold cylinder is made of a highly electrically conductive material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:歧管結構</p>  
        <p type="p">210:頂部注入單元</p>  
        <p type="p">211:頂部注入入口</p>  
        <p type="p">212:反應物氣體入口管</p>  
        <p type="p">220:歧管圓柱體</p>  
        <p type="p">221:電入口</p>  
        <p type="p">230:底部注入單元</p>  
        <p type="p">231:底部注入入口</p>  
        <p type="p">232:源氣體入口管</p>  
        <p type="p">250:內部通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1787" publication-number="202612550"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612550.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612550</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光二極體晶片結構及相關方法</chinese-title>  
        <english-title>LIGHT-EMITTING DIODE CHIP STRUCTURES AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251209B">H10H20/816</main-classification>  
        <further-classification edition="202501120251209B">H10H20/814</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科銳ＬＥＤ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CREELED, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>切克　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHECK, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍斯特　史蒂文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUESTER, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德里斯柯爾　丹尼爾　卡爾頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRISCOLL, DANIEL CARLETON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了包括發光二極體（LED）的固態照明裝置，更特定而言揭示了LED晶片結構及相關方法。LED晶片結構包括相對於主動LED結構之電流分散層及介電反射層的配置。電流分散層可經定位以提供引導朝向主動LED結構之大部分並遠離相關聯台面側壁之電子路徑。介電反射層可覆蓋電流分散層，同時亦延伸以覆蓋所述台面側壁。介電反射層包括蝕刻停止層，後續接著為一個或多個介電層。所述蝕刻停止層允許對所述介電層進行過蝕刻，以確保相關方法中透過該介電反射層形成之各種電互連的開口的完整性。亦提供了電互連配置，其為LED晶片提供經定製之電流平衡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Solid-state lighting devices including light-emitting diodes （LEDs） and more particularly LED chip structures and related methods are disclosed. LED chip structures include arrangements of current spreading layers and dielectric reflective layers relative to active LED structures. Current spreading layers may be positioned to provide electron path steering toward bulk portions of active LED structures and away from associated mesa sidewalls. Dielectric reflective layers may cover current spreading layers while also extending to cover the mesa sidewalls. Dielectric reflective layers include etch stop layers followed by one or more dielectric layers. The etch stop layers allow over-etching of the dielectric layers to ensure integrity of openings for various electrical interconnects formed through the dielectric reflective layer in related methods. Arrangements of electrical interconnects are also provided that provide tailored current balancing for LED chips.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:LED晶片</p>  
        <p type="p">12:主動LED結構</p>  
        <p type="p">12&lt;sub&gt;S&lt;/sub&gt;:台面側壁</p>  
        <p type="p">12&lt;sub&gt;T&lt;/sub&gt;:頂面</p>  
        <p type="p">14:p型層</p>  
        <p type="p">16:n型層</p>  
        <p type="p">18:主動層</p>  
        <p type="p">20:基板</p>  
        <p type="p">20':圖案化表面</p>  
        <p type="p">22:介電反射層</p>  
        <p type="p">24:金屬反射層</p>  
        <p type="p">26:反射層互連件</p>  
        <p type="p">28:障壁層</p>  
        <p type="p">30:鈍化層</p>  
        <p type="p">32:黏著層</p>  
        <p type="p">34:p型接觸件</p>  
        <p type="p">36:n型接觸件</p>  
        <p type="p">38:p型接觸互連件</p>  
        <p type="p">40:n型接觸互連件</p>  
        <p type="p">42:電流分散層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1788" publication-number="202611735"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611735.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611735</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131546</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於從使用者空間存取系統單晶片（ＳＯＣ）記憶體之方法</chinese-title>  
        <english-title>METHOD FOR ACCESSING SYSTEM-ON-CHIP (SOC) MEMORY FROM USER SPACE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251201B">G06F12/1081</main-classification>  
        <further-classification edition="200601120251201B">G06F9/54</further-classification>  
        <further-classification edition="201601120251201B">G06F12/1036</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山姆帕提勞　哈里普拉薩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMPATIRAO, HARI PRASAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷馬查德利　山迪普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOMCHAUDHURI, SANDIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費德瑞克斯　貴多羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREDERIKS, GUIDO ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於一種用於存取記憶體之方法。該方法包括將該記憶體的位址空間映射至核心空間的位址空間。該方法包括將該記憶體的該位址空間映射至使用該核心空間的使用者空間的位址空間。該方法包括經由該核心空間的該位址空間以及該使用者空間的該位址空間存取該記憶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is directed to a method for accessing memory. The method includes mapping an address space for the memory to an address space for a kernel space. The method includes mapping the address space for the memory to an address space for a user space using the kernel space. The method includes accessing the memory via the address space for the kernel space and the address space for the user space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">402,404,406:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1789" publication-number="202612067"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612067.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612067</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131591</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製程設備</chinese-title>  
        <english-title>SEMICONDUCTOR PROCESS EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250910B">H01L21/67</main-classification>  
        <further-classification edition="200601120250910B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈海波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, HAI BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李洪利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HONG LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔祥天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONG, XIANG TIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了半導體製程設備，其包括製程腔室、分流管路和供流管路；製程腔室的底部設有開口，分流管路設於製程腔室內，且至少與製程腔室的頂面貼合，分流管路設有多個噴氣孔；供流管路伸入製程腔室內，且與分流管路連通，供流管路用於向分流管路供應製程氣體，以使製程氣體通過多個噴氣孔傳輸至製程腔室內。藉由將分流管路貼合安裝在製程腔室的頂面，一方面能對製程腔室的頂面進行結構加強，使得頂面不易軟化塌陷；另一方面，分流管路內流動的製程氣體也可將頂面的一部分熱量帶走，故能夠降低頂面的溫度，並降低頂面出現軟化塌陷的概率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses semiconductor process equipment, which includes a process chamber, a distribution pipeline, and a supply pipeline. The bottom of the process chamber is provided with an opening. The distribution pipeline is arranged inside the process chamber and is at least in contact with the top surface of the process chamber. The distribution pipeline is provided with multiple jet holes. The supply pipeline extends into the process chamber and is in communication with the distribution pipeline. The supply pipeline is used to supply process gas to the distribution pipeline, so that the process gas is delivered into the process chamber through the multiple jet holes. By installing the distribution pipeline in contact with the top surface of the process chamber, on one hand, the structure of the top surface of the process chamber can be reinforced, making it less likely to soften and collapse; on the other hand, the process gas flowing inside the distribution pipeline can also carry away part of the heat from the top surface, thereby reducing the temperature of the top surface and lowering the probability of softening and collapse of the top surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:製程腔室</p>  
        <p type="p">120:分流管路</p>  
        <p type="p">121:噴氣孔</p>  
        <p type="p">130:供流管路</p>  
        <p type="p">150:爐體</p>  
        <p type="p">160:支撐架</p>  
        <p type="p">161:排氣口</p>  
        <p type="p">170:晶圓</p>  
        <p type="p">180:腔室密封門</p>  
        <p type="p">190:保溫桶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1790" publication-number="202611099"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611099.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611099</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131605</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光硬化性組成物、膜、濾光器、固體攝像元件及圖像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F2/44</main-classification>  
        <further-classification edition="200601120251201B">C08F2/50</further-classification>  
        <further-classification edition="200601120251201B">C08F222/22</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/031</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G02B5/20</further-classification>  
        <further-classification edition="200601120251201B">G09F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳俊佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGI, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤憲晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, NORIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光硬化性組成物，其包含聚合性單體及光聚合起始劑，其中，上述聚合性單體包含式（1）所表示之化合物。一種使用了前述光硬化性組成物之膜、濾光器、固體攝像元件及圖像顯示裝置。 &lt;br/&gt;&lt;img align="absmiddle" height="136px" width="353px" file="ed10129.JPG" alt="ed10129.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1791" publication-number="202611748"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611748.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611748</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131619</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連結預測方法、模型訓練方法、裝置以及設備</chinese-title>  
        <english-title>LINK PREDICTION METHOD, MODEL TRAINING METHOD, APPARATUS AND DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251001B">G06F16/901</main-classification>  
        <further-classification edition="201901120251001B">G06F16/953</further-classification>  
        <further-classification edition="202301120251001B">G06N3/042</further-classification>  
        <further-classification edition="202301120251001B">G06N3/045</further-classification>  
        <further-classification edition="202301120251001B">G06N3/0464</further-classification>  
        <further-classification edition="202301120251001B">G06N3/084</further-classification>  
        <further-classification edition="202301120251001B">G06N5/01</further-classification>  
        <further-classification edition="202401120251001B">G06Q50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中國銀聯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉礪志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LIZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佟志臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, ZHICHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣海儉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, HAIJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閔青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIN, QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例提供一種連結預測方法、模型訓練方法、裝置以及設備，涉及人工智慧領域。該方法包括：獲取目標原始圖，目標原始圖中包括至少一個表徵實體物件的節點，實體物件為使用者；並根據目標原始圖，確定節點的嵌入表示；根據各節點中各個目標節點對的嵌入表示，生成各目標節點對的內容成對特徵；確定目標節點對的至少一個共同鄰居節點，並對各共同鄰居節點的嵌入表示進行聚合處理，得到目標節點對的鄰居成對特徵；根據目標節點對的內容成對特徵和鄰居成對特徵，生成目標節點對的連結預測資訊。本申請的方法，提高了連結預測精度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present application provide a link prediction method, a model training method, an apparatus and a device, and relate to the field of artificial intelligence. The method includes: acquiring a target original graph, where the target original graph includes at least one node representing an entity object, and the entity object is a user; and determining an embedding representation of the node based on the target original graph; generating a content pairwise feature of each target node pair according to the embedding representation of each target node pair in the node; determining at least one common neighbor node of the target node pair and performing aggregation processing on the embedding representation of each common neighbor node to obtain a neighbor pairwise feature of the target node pair; and generating link prediction information of the target node pair based on the content pairwise feature and the neighbor pairwise feature of the target node pair. The method of the present application improves the precision of link prediction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201、202、203、204:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1792" publication-number="202611661"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611661.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611661</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基準電壓產生電路</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">G05F1/567</main-classification>  
        <further-classification edition="200601120251209B">G05F3/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三美電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUMI ELECTRIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上林俊也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIBAYASHI, TOSHIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋佳周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基準電壓產生電路，改善帶隙基準電壓的溫度特性。具備：第一雙極電晶體及第二雙極電晶體；第一電阻，連接在第二電源端子與第一雙極電晶體的發射極之間；第二電阻，串聯連接在第一電阻的與第一雙極電晶體的發射極連接的一側的端部和第二雙極電晶體的發射極之間；第三電阻，連接在第一電源端子與第一雙極電晶體的集電極之間；第四電阻，連接在第一電源端子與第二雙極電晶體的集電極之間；放大器，將第一雙極電晶體的集電極和第二雙極電晶體的集電極作為輸入；以及溫度補償電路，對第二雙極電晶體的發射極的電流或第一雙極電晶體的集電極的電流進行校正。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基準電壓產生電路</p>  
        <p type="p">102:差動對</p>  
        <p type="p">TR1:第一雙極電晶體</p>  
        <p type="p">TR2:第二雙極電晶體</p>  
        <p type="p">TR3:反相輸入的電晶體</p>  
        <p type="p">TR4:非反相輸入的電晶體</p>  
        <p type="p">TR9:電晶體(第一電流源)</p>  
        <p type="p">TR10:PMOS電晶體</p>  
        <p type="p">R1:第一電阻</p>  
        <p type="p">R2:第二電阻</p>  
        <p type="p">R3:第三電阻</p>  
        <p type="p">R4:第四電阻</p>  
        <p type="p">R6:第六電阻</p>  
        <p type="p">AMP:放大器</p>  
        <p type="p">VDD:第一電源端子</p>  
        <p type="p">VSS:第二電源端子</p>  
        <p type="p">VREF:輸出端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1793" publication-number="202611100"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611100.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611100</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131653</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、感光性樹脂層以及使用其的半導體裝置</chinese-title>  
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER, AND SEMICONDUCTOR DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">C08F2/44</main-classification>  
        <further-classification edition="200601120251001B">C08F2/50</further-classification>  
        <further-classification edition="200601120251001B">C08F290/14</further-classification>  
        <further-classification edition="200601120251001B">C08G73/12</further-classification>  
        <further-classification edition="200601120251001B">G03F7/004</further-classification>  
        <further-classification edition="200601120251001B">G03F7/027</further-classification>  
        <further-classification edition="200601120251001B">G03F7/031</further-classification>  
        <further-classification edition="200601120251001B">G03F7/075</further-classification>  
        <further-classification edition="200601120251001B">G03F7/038</further-classification>  
        <further-classification edition="200601120251001B">G03F7/20</further-classification>  
        <further-classification edition="200601120251001B">G03F7/40</further-classification>  
        <further-classification edition="200601120251001B">H05K1/03</further-classification>  
        <further-classification edition="200601120251001B">H01L23/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳虎均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, HOKYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金尙洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SANG SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白宅晋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, TAEK-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜希炅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HEEKYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金民兼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINGYUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜眞熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, JINHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴炳旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, BYEONGWOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪忠範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, CHUNGBEUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光性樹脂組成物，包括由化學式1表示的聚醯亞胺樹脂；光聚合化合物；光聚合起始劑；以及溶劑，利用感光性樹脂組成物製造的感光性樹脂層，以及包括感光性樹脂層的半導體裝置。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="210px" width="304px" file="ed10035.JPG" alt="ed10035.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photosensitive resin composition including a polyimide resin represented by Chemical Formula 1; a photopolymerizable compound; a photopolymerization initiator; and a solvent, a photosensitive resin layer manufactured utilizing the photosensitive resin composition, and a semiconductor device including the photosensitive resin layer are disclosed. &lt;br/&gt;&lt;b/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="228px" width="336px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1794" publication-number="202610761"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610761.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610761</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131699</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工具機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251124B">B23Q15/14</main-classification>  
        <further-classification edition="200601120251124B">B23Q5/10</further-classification>  
        <further-classification edition="200601120251124B">B23Q3/18</further-classification>  
        <further-classification edition="200601120251124B">B23Q3/154</further-classification>  
        <further-classification edition="200601120251124B">B23Q1/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南岡和彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINAMIOKA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">工具機1具備：自動工具交換裝置10，可相對於床台部50擺動；馬達12，固定於自動工具交換裝置10，用以驅動自動工具交換裝置10；纜線C，連接於馬達12，用以傳達驅動馬達12的訊號及電力的至少一者；纜線固定構件16，固定於自動工具交換裝置10，與馬達12一起擺動；及固定部17，將纜線C固定於纜線固定構件16。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:自動工具交換裝置</p>  
        <p type="p">11:轉塔</p>  
        <p type="p">12:馬達</p>  
        <p type="p">12a:連接部</p>  
        <p type="p">16:纜線固定構件</p>  
        <p type="p">16a:側面</p>  
        <p type="p">16b:貫通孔</p>  
        <p type="p">16c:端部</p>  
        <p type="p">17:固定部</p>  
        <p type="p">18:保持構件</p>  
        <p type="p">41:支撐部</p>  
        <p type="p">111:基座部</p>  
        <p type="p">151:擺動軸</p>  
        <p type="p">152:凸輪從動件</p>  
        <p type="p">A,B:箭頭</p>  
        <p type="p">C:纜線</p>  
        <p type="p">+Y:+Y側</p>  
        <p type="p">-Y:-Y側</p>  
        <p type="p">+Z:+Z側</p>  
        <p type="p">-Z:-Z側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1795" publication-number="202611546"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611546.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611546</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131718</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全球導航衛星系統接收器以及全球導航衛星系統接收方法</chinese-title>  
        <english-title>GLOBAL NAVIGATION SATELLITE SYSTEM RECEIVER AND GLOBAL NAVIGATION SATELLITE SYSTEM RECEIVING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251105B">G01S19/13</main-classification>  
        <further-classification edition="201001120251105B">G01S19/33</further-classification>  
        <further-classification edition="200601120251105B">H04B1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIROHA TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李易庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃競儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>官靖喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUAN, CHING-CHIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佳龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李育瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　政宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JENG-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">全球導航衛星系統接收器包含多工器電路、快速傅立葉轉換電路、預取樣器電路、碼產生器電路及假設排程機。該多工器電路具有第一輸入埠、第二輸入埠及輸出埠。該快速傅立葉轉換電路耦接至該輸出埠。該預取樣器電路產生並輸出資料序列輸出至該多工器電路的該第一輸入埠。該碼產生器電路產生並輸出本地副本輸出至該多工器電路的該第二輸入埠。該假設排程機耦接至該多工器電路、該預取樣器電路及該碼產生器電路。在該假設排程機的協調之下，該快速傅立葉轉換電路會透過該多工器電路而在該預取樣器電路與該碼產生器電路之間被共用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A global navigation satellite system (GNSS) receiver includes a multiplexer circuit, a fast Fourier transform (FFT) circuit, a pre-sampler circuit, a code generator circuit, and a hypothesis scheduling machine (HSM). The multiplexer circuit has a first input port, a second input port, and an output port. The FFT circuit is coupled to the output port. The pre-sampler circuit generates and outputs a data sequence output to the first input port of the multiplexer circuit. The code generator circuit generates and outputs a local replica output to the second input port of the multiplexer circuit. The HSM is coupled to the multiplexer circuit, the pre-sampler circuit, and the code generator circuit. Under coordination of the HSM, the FFT circuit is shared between the pre-sampler circuit and the code generator circuit through the multiplexer circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:全球導航衛星系統接收器系統單晶片</p>  
        <p type="p">102:射頻前端</p>  
        <p type="p">104:類比數位轉換器</p>  
        <p type="p">106:基頻處理器</p>  
        <p type="p">108:微控制器單元</p>  
        <p type="p">110:預處理器電路</p>  
        <p type="p">112:預取樣器電路</p>  
        <p type="p">114:碼產生器電路</p>  
        <p type="p">115:假設排程機</p>  
        <p type="p">116:多工器電路</p>  
        <p type="p">118:低複雜度快速傅立葉轉換電路</p>  
        <p type="p">120:低複雜度逆快速傅立葉轉換電路</p>  
        <p type="p">122:相關性電路</p>  
        <p type="p">124:頻譜記憶體</p>  
        <p type="p">126:非相干積分記憶體</p>  
        <p type="p">128:樣本記憶體</p>  
        <p type="p">S&lt;sub&gt;IF&lt;/sub&gt;:低中頻訊號</p>  
        <p type="p">S&lt;sub&gt;D&lt;/sub&gt;:類比數位轉換器輸出訊號</p>  
        <p type="p">DS_IN:資料序列輸入</p>  
        <p type="p">DS_OUT:資料序列輸出</p>  
        <p type="p">Code_OUT:本地複本輸出</p>  
        <p type="p">M_OUT:多工輸出</p>  
        <p type="p">BS&lt;sub&gt;FFT&lt;/sub&gt;:基頻頻譜輸出</p>  
        <p type="p">CS&lt;sub&gt;FFT&lt;/sub&gt;:碼頻譜輸出</p>  
        <p type="p">COR&lt;sub&gt;FFT&lt;/sub&gt;:相關性頻譜輸出</p>  
        <p type="p">COR&lt;sub&gt;IFFT&lt;/sub&gt;:相關性結果</p>  
        <p type="p">C1,C2,C3:控制訊號</p>  
        <p type="p">FW:韌體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1796" publication-number="202612417"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612417.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612417</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131728</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷式散熱器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">H05K5/02</main-classification>  
        <further-classification edition="200601120251211B">H05K7/20</further-classification>  
        <further-classification edition="200601120251211B">F28D1/06</further-classification>  
        <further-classification edition="200601120251211B">F28D15/02</further-classification>  
        <further-classification edition="200601120251211B">F28F3/12</further-classification>  
        <further-classification edition="200601120251211B">H01L23/433</further-classification>  
        <further-classification edition="200601120251211B">H01L23/473</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商古河電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name></last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCHIMURA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, HIROFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>引地秀太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIKICHI, SHUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATADA, MASANOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤裕士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為了提供一種液冷式散熱器，當將發熱體裝設於殼體時，縱使液冷式散熱器的緊壓負載為36牛頓以下仍可確實地進行發熱體和液冷式散熱器之熱接觸，而能設置在狹小空間內。 &lt;br/&gt;　　一種液冷式散熱器，其具有冷板、第1配管、第2配管、第1歧管及第2歧管，前述冷板，係與前述發熱體熱連接，在內部形成有供液相的熱介質流過之熱介質流通空間或熱介質流通部，用於將從前述發熱體吸收的熱釋放到前述熱介質，前述第1配管的一端與形成在前述冷板的熱介質流入部連接，前述第2配管的一端與形成在前述冷板的熱介質流出部連接，前述第1歧管與前述第1配管的另一端連接且將前述熱介質供應給前述第1配管，前述第2歧管與前述第2配管的另一端連接且從前述第2配管接收前述熱介質，前述第1配管的一端與前述冷板之前述熱介質流入部一體化，前述第2配管的一端與前述冷板的前述熱介質流出部一體化，前述第1配管的另一端與前述第1歧管一體化，前述第2配管的另一端與前述第2歧管一體化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:液冷式散熱器</p>  
        <p type="p">10:冷板</p>  
        <p type="p">11:熱介質流入部</p>  
        <p type="p">12:熱介質流出部</p>  
        <p type="p">20:第1配管</p>  
        <p type="p">21:第1配管的一端</p>  
        <p type="p">22:第1配管的另一端</p>  
        <p type="p">30:第2配管</p>  
        <p type="p">31:第2配管的一端</p>  
        <p type="p">32:第2配管的另一端</p>  
        <p type="p">40:第1歧管</p>  
        <p type="p">50:第2歧管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1797" publication-number="202610798"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610798.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610798</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種清洗滾輪製作裝置、方法及清洗滾輪</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">B29C44/12</main-classification>  
        <further-classification edition="202401120251215B">B08B1/12</further-classification>  
        <further-classification edition="202401120251215B">B08B1/32</further-classification>  
        <further-classification edition="200601120251215B">B29C44/58</further-classification>  
        <further-classification edition="200601120251215B">B29C69/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州歆靈沐歌科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU XINLING MUGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王伟伟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及晶圓清洗設備技術領域，具體涉及一種清洗滾輪製作裝置、方法及清洗滾輪。清洗滾輪製作方法，包括以下步驟：在中心桿件上塗注固化海綿，將內模具同軸套設安裝在中心桿件上，內模具上設置有多個海綿生長通孔，在內模具外套設安裝外模具；向中心桿件與內模具之間注入發泡液使固化海綿發泡生長成發泡海綿，至發泡海綿貫穿海綿生長通孔；將切割刀具插入至內模具與外模具之間，將海綿生長通孔與外模具之間的發泡海綿完全切斷，取下切割刀具、外模具和內模具，得到成型後的海綿清洗滾輪。移除緻密層的清洗海綿具有良好的吸水效果，不會阻擋水分子由海綿內往外流出，而且能夠有效排除沾附在海綿表面的髒汙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:空心桿</p>  
        <p type="p">2:貫穿孔</p>  
        <p type="p">3:內模具</p>  
        <p type="p">4:外模具</p>  
        <p type="p">7:發泡海綿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1798" publication-number="202611778"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611778.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611778</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種製程參數的確定方法、裝置及半導體製程設備</chinese-title>  
        <english-title>METHOD AND DEVICE FOR DETERMINING PROCESS PARAMETERS AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251205B">G06N3/04</main-classification>  
        <further-classification edition="202301120251205B">G06N3/08</further-classification>  
        <further-classification edition="202001120251205B">G06F30/27</further-classification>  
        <further-classification edition="200601120251205B">G05B13/04</further-classification>  
        <further-classification edition="200601120251205B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜佳佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, JIA JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴家樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, JIA LE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施方式提供了一種製程參數的確定方法、裝置及半導體製程設備，該製程參數的確定方法包括：回應於使用者輸入的目標製程資訊，將目標製程資訊輸入至目標網路模型；目標製程資訊包括待確定製程配方所能達到的製程結果；藉由目標網路模型預測達到製程結果所需的製程參數；目標網路模型包括：基於膠囊網路構建的膠囊網路層；將目標網路模型輸出的預測結果，確定為待確定製程配方的製程參數。本申請可以快速確定能夠滿足製程需求的製程參數，節省大量時間，且目標網路模型包括基於膠囊網路構建的膠囊網路層，可以提升製程參數的準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiments of the present application provide a method and a device for determining process parameters and a semiconductor process equipment. The method for determining process parameters includes: in response to a target process information input by a user, inputting the target process information into a target network model; the target process information includes the process results that can be achieved by the process recipe to be determined; predicting the process parameters required to achieve the process results through the target network model, the target network model including a capsule network layer constructed based on a capsule network; determining the predicted results output by the target network model as the process parameters of the process recipe to be determined. The present application can quickly determine process parameters that meet process requirements, saving a significant amount of time. Furthermore, since the target network model includes a capsule network layer constructed based on a capsule network, the accuracy of the process parameters can be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201:步驟</p>  
        <p type="p">S202:步驟</p>  
        <p type="p">S203:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1799" publication-number="202612466"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612466.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612466</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131788</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251105B">H10B41/27</main-classification>  
        <further-classification edition="202301120251105B">H10B43/27</further-classification>  
        <further-classification edition="202301120251105B">H10B12/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張誠桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, SUNG-HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金燦爛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BIT NA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體記憶體裝置包括：位元線，在基板上在第一方向上延伸；第一主動圖案與第二主動圖案，位於位元線上且在第一方向上彼此間隔開；至少一條導電閘極線，位於第一主動圖案與第二主動圖案之間且在第二方向上延伸；閘極屏蔽圖案，位於所述至少一條導電閘極線與位元線之間且包含摻雜有磷（P）的絕緣材料；以及資料儲存圖案，位於第一主動圖案及第二主動圖案上且電性連接至第一主動圖案及第二主動圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory device includes a bitline that extends in a first direction on a substrate, a first active pattern and a second active pattern that are on the bitline and spaced apart from each other in the first direction, at least one conductive gate line that is between the first active pattern and the second active pattern and extends in a second direction, a gate shielding pattern that is between the at least one conductive gate line and the bitline and includes an insulating material that is doped with phosphorus (P), and a data storage pattern that is on and electrically connected to the first active pattern and the second active pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:背部閘極分隔圖案</p>  
        <p type="p">113:背部閘極絕緣圖案</p>  
        <p type="p">115:背部閘極屏蔽圖案</p>  
        <p type="p">145:閘極屏蔽圖案</p>  
        <p type="p">145_S1:底表面</p>  
        <p type="p">145_S2、BL_US:上表面</p>  
        <p type="p">145_SW:側壁</p>  
        <p type="p">161:半導體圖案</p>  
        <p type="p">163:金屬圖案</p>  
        <p type="p">212:接觸蝕刻停止膜</p>  
        <p type="p">231:接觸層間絕緣膜</p>  
        <p type="p">AP1:第一主動圖案/主動圖案</p>  
        <p type="p">AP2:第二主動圖案/主動圖案</p>  
        <p type="p">AP_SDR:第一雜質摻雜區</p>  
        <p type="p">BC:接觸圖案</p>  
        <p type="p">BG:背部閘極電極</p>  
        <p type="p">BG_S1、S1、WL_S1:第一表面</p>  
        <p type="p">BG_S2、S2、WL_S2:第二表面</p>  
        <p type="p">DR1:第一方向</p>  
        <p type="p">DR2:第二方向</p>  
        <p type="p">DR3:第三方向</p>  
        <p type="p">GOX:閘極絕緣圖案</p>  
        <p type="p">GSS:閘極分隔圖案</p>  
        <p type="p">P:部分</p>  
        <p type="p">SS1:第一側壁</p>  
        <p type="p">SS2:第二側壁</p>  
        <p type="p">WL1:第一字元線/字元線</p>  
        <p type="p">WL2:第二字元線/字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1800" publication-number="202612481"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612481.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612481</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131789</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保持氧化物式隨機存取記憶體　(OxRAM)的高阻態　(HRS)與低阻態　(LRS)之改良式堆疊結構</chinese-title>  
        <english-title>IMPROVED STACK STRUCTURE FOR RETENTION OF HIGH (HRS) AND LOW (LRS) RESISTIVE STATES OF AN OXIDE-BASED RANDOM-ACCESS MEMORY (OXRAM)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251008B">H10B63/00</main-classification>  
        <further-classification edition="202501120251008B">H10D88/00</further-classification>  
        <further-classification edition="202501120251008B">H10D62/10</further-classification>  
        <further-classification edition="202501120251008B">H10D62/80</further-classification>  
        <further-classification edition="202501120251008B">H10D64/20</further-classification>  
        <further-classification edition="200601120251008B">H01L21/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商威必特奈米有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEEBIT NANO LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫拉　嘉比耶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLAS, GABRIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳絲倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭建中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於電阻式隨機存取記憶體單元的電阻式堆疊（Stck），該電阻式堆疊包括：第一電極（El1）；第二電極（El2）；介電層（Diel），該介電層插置在第一電極（El1）和第二電極（El2）之間，該介電層包括：第一介電層（Diel1），該第一介電層由第一過渡金屬氧化物形成；第二介電層（Diel2），該第二介電層由與第一過渡金屬氧化物不同的第二過渡金屬氧化物形成；和擴散阻擋層（DiffBar），該擴散阻擋層插置在第一介電層（Diel1）和第二介電層（Diel2）之間，並且由對於氧空位（oxygen vacancies）具有阻擋特性的材料形成，該阻擋特性高於第一過渡金屬氧化物和第二過渡金屬氧化物對於氧空位的阻擋特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resistive stack (Stck) for a resistive random-access memory cell, the resistive stack comprising: a first electrode (El1) ; a second electrode (El2) ; a dielectric layer (Diel) interposed between the first electrode (El1) and the second electrode (El2), the dielectric layer comprising: a first dielectric layer (Diel1) formed from a first transition metal oxide; a second dielectric layer (Diel2) formed from a second transition metal oxide different from the first transition metal oxide ; and a diffusion barrier layer (DiffBar) interposed between the first dielectric layer (Diel1) and the second dielectric layer (Diel2), and formed from a material having a barrier property with regard to oxygen vacancies, that is higher than barrier properties with regard to oxygen vacancies of the first transition metal oxide and the second transition metal oxide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Diel:介電層</p>  
        <p type="p">Diel1:第一介電層</p>  
        <p type="p">Diel2:第二介電層</p>  
        <p type="p">DiffBar:擴散阻擋層</p>  
        <p type="p">DisFil:細絲</p>  
        <p type="p">El1:第一電極</p>  
        <p type="p">El2:第二電極</p>  
        <p type="p">HRS:高電阻狀態</p>  
        <p type="p">Oxy:氧離子</p>  
        <p type="p">V&lt;sub&gt;Oxy&lt;/sub&gt;:氧空位</p>  
        <p type="p">Stck:堆疊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1801" publication-number="202612158"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612158.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612158</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131799</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及其製作方法</chinese-title>  
        <english-title>MEMORY DEVICES AND FABRICATION METHODS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H01L25/18</main-classification>  
        <further-classification edition="200601120251103B">H01L21/70</further-classification>  
        <further-classification edition="200601120251103B">H01L23/538</further-classification>  
        <further-classification edition="200601120251103B">H01L23/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長江存儲科技控股有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANGTZE MEMORY TECHNOLOGIES HOLDING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>苗利娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIAO, LI-NA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖文靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, WEN-JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周文斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, WEN-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍宗亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUO, ZONG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置，包括第一半導體晶片、第二半導體晶片、第一接觸結構及第二接觸結構。第一半導體晶片包括第一半導體結構及穿透第一半導體結構的第一電介質層。第二半導體晶片沿第一方向與第一半導體晶片堆疊，並且第二半導體晶片包括第二半導體結構及穿透第二半導體結構的第二電介質層。第一接觸結構在第一電介質層中沿第一方向延伸，並且與第一半導體晶片的第一金屬層接觸。第二接觸結構在第一電介質層及第二電介質層中沿第一方向延伸，並且與第二半導體晶片的第二金屬層接觸。第一電介質層及第二電介質層在第一方向上對準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a first semiconductor chip, a second semiconductor chip, a first contact structure, and a second contact structure. The first semiconductor chip includes a first semiconductor structure and a first dielectric layer penetrating the first semiconductor structure. The second semiconductor chip stacks with the first semiconductor chip along a first direction, and the second semiconductor chip includes a second semiconductor structure and a second dielectric layer penetrating the second semiconductor structure. The first contact structure extends along the first direction in the first dielectric layer and is in contact with a first metal layer of the first semiconductor chip. The second contact structure extends along the first direction in the first dielectric layer and the second dielectric layer and is in contact with a second metal layer of the second semiconductor chip. The first dielectric layer and the second dielectric layer are aligned in the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">200:記憶體系統</p>  
        <p type="p">202:中介層</p>  
        <p type="p">204:計算裸晶</p>  
        <p type="p">206:基礎裸晶</p>  
        <p type="p">208:凸塊結構</p>  
        <p type="p">210:鍵合層</p>  
        <p type="p">X:第二方向</p>  
        <p type="p">Z:第一方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1802" publication-number="202610608"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610608.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610608</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131833</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>肩頸按摩儀</chinese-title>  
        <english-title>SHOULDER AND NECK MASSAGER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251106B">A61H23/02</main-classification>  
        <further-classification edition="200601120251106B">A61H15/00</further-classification>  
        <further-classification edition="200601120251106B">A61H7/00</further-classification>  
        <further-classification edition="200601120251106B">A61F7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商未來穿戴健康科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKG HEALTH TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖文濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, WEN-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種肩頸按摩儀，包括主體、電路主機板、二第一按摩機構、驅動機構及熱敷模組，第一按摩機構與熱敷模組設在主體的近膚側，電路主機板及驅動機構設於主體內，驅動機構連接第一按摩機構，二第一按摩機構在驅動機構驅動下沿第一方向靠攏或遠離時近膚側遠離或靠近人體，熱敷模組在近膚側靠近人體時對按摩部位進行熱敷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A shoulder and neck massager includes a main body, a circuit board, two first massage mechanisms, a driving mechanism and a hot compress module. The first massage mechanisms and the hot compress module are arranged on a skin-proximal side of the main body. The circuit board and the driving mechanism are arranged in the main body. The driving mechanism is connected to the first massage mechanisms. When the two first massage mechanisms are driven by the driving mechanism to move towards or away from each other along the first direction, the skin-proximal side moves away from or close to the human body. The hot compress module performs hot compress on the massage part when the skin-proximal side is close to the human body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:肩頸按摩儀</p>  
        <p type="p">1:主體</p>  
        <p type="p">1a:近膚側</p>  
        <p type="p">3:第一按摩機構</p>  
        <p type="p">4:熱敷模組</p>  
        <p type="p">6:第二按摩機構</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1803" publication-number="202610649"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610649.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610649</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131845</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氮雜并環類衍生物及其製備方法和用途</chinese-title>  
        <english-title>AZAPARACYCLIC DERIVATIVES AND THEIR PREPARATION METHOD AND USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/551</main-classification>  
        <further-classification edition="200601120251201B">A61K31/519</further-classification>  
        <further-classification edition="200601120251201B">A61K31/5025</further-classification>  
        <further-classification edition="200601120251201B">A61K31/502</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4375</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商浙江海正藥業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHEJIANG HISUN PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海昂睿醫藥技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI ARYL PHARMTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張盼盼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, PANPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞鳴烽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, MINGFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛利飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, LIFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭曉鶴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, XIAOHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周厚江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, HOUJIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種氮雜并環類衍生物、其製備方法及含有該衍生物的藥物組合物在醫藥上的應用。具體而言，本發明涉及一種通式(I)所示的并環類衍生物、其製備方法及其可藥用的鹽，以及它們作為治療劑，特別是作為WRN抑制劑的用途，其中通式(I)中各取代基的定義與說明書中的定義相同。 &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="231px" file="ed10345.JPG" alt="ed10345.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an azaparacyclic derivative, a method for preparing the same, and the medical use of a pharmaceutical composition containing the same. Specifically, the present invention relates to a paracyclic derivative represented by general formula (I), a method for preparing the same, and pharmaceutically acceptable salts thereof, as well as their use as therapeutic agents, particularly as WRN inhibitors. The definitions of the substituents in general formula (I) are the same as those in the specification. &lt;br/&gt;&lt;img align="absmiddle" height="171px" width="221px" file="ed10346.JPG" alt="ed10346.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1804" publication-number="202611632"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611632.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611632</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131869</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>催化配置、雷射系統及微影系統</chinese-title>  
        <english-title>CATALYTIC ARRANGEMENT, LASER SYSTEM AND LITHOGRAPHIC SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">G03F7/00</main-classification>  
        <further-classification edition="200601120251212B">G03F7/20</further-classification>  
        <further-classification edition="201201120251212B">G03F1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　德仁特　威廉　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DRENT, WILLIAM PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>密特拉　伊凡潔莉亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITRAKA, EVANGELIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於一雷射系統中之一催化配置，其中該催化配置包含： &lt;br/&gt;一金屬體或金屬基底層， &lt;br/&gt;一黏著層，其塗佈於該金屬體或基底層上，及 &lt;br/&gt;一催化劑層，其配置於該黏著層上， &lt;br/&gt;其中該黏著層由在低於攝氏300度之溫度下實質上不擴散穿過該催化劑層之一材料製成，或 &lt;br/&gt;其中一擴散障壁層設置於該黏著層與該催化劑層之間，其中該擴散障壁層在低於攝氏300度之溫度下減少或防止該黏著層之材料擴散穿過該催化劑層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a catalytic arrangement for use in a laser system, wherein the catalytic arrangement comprises: &lt;br/&gt;a metal body or metal base layer, &lt;br/&gt;an adhesion layer coated on the metal body or base layer, and &lt;br/&gt;a catalyst layer arranged on the adhesion layer, &lt;br/&gt;wherein the adhesion layer is made of a material that is substantially free of diffusion through the catalyst layer at temperatures below 300 degrees Celsius, or &lt;br/&gt;wherein a diffusion barrier layer is provided between the adhesion layer and the catalyst layer, wherein the diffusion barrier layer reduces or prevents diffusion of material of the adhesion layer through the catalyst layer at temperatures below 300 degrees Celsius.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">360:催化配置</p>  
        <p type="p">361:金屬基底層</p>  
        <p type="p">362:黏著層</p>  
        <p type="p">363:催化劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1805" publication-number="202612316"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612316.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612316</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131905</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分散代理系統及其方法</chinese-title>  
        <english-title>DISTRIBUTED AGENTIC SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">H04L67/60</main-classification>  
        <further-classification edition="202001120251201B">G06F40/20</further-classification>  
        <further-classification edition="201901120251201B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　曉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇俊明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHUN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分散代理系統包括多個通信連接的節點。每個節點是邊緣設備和在該邊緣設備上運行的虛擬機器（VM）之一。交互外設耦合到節點的子集以接收用戶請求並輸出響應。在分散代理系統中，代理管理器通過交互外設之一接收用戶請求。根據用戶請求，代理管理器向由模型服務管理的人工智能（AI）模型發送提示。代理管理器從AI模型接收行動計劃，並根據行動計劃調用至少一個應用以生成對用戶請求的響應。代理管理器、AI模型、模型服務和至少一個應用位於兩個或多個節點上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A distributed agentic system includes multiple nodes that are communicatively connected. Each node is one of an edge device and a virtual machine (VM) operating on the edge device. Interaction peripherals are coupled to a subset of the nodes to receive user requests and output responses. In the distributed agentic system, an agentic manager receives a user request via one of the interaction peripherals. Based on the user request, the agentic manager sends a prompt to an artificial intelligence (AI) model managed by a model service. The agentic manager receives an action plan from the AI model, and calls at least one app according to the action plan to generate a response to the user request. The agentic manager, the AI model, the model service, and the at least one app are located on two or more of the nodes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:方法</p>  
        <p type="p">710:步驟</p>  
        <p type="p">720:步驟</p>  
        <p type="p">730:步驟</p>  
        <p type="p">740:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1806" publication-number="202612317"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612317.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612317</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>代理管理器之協作、更新及即時摘要的方法</chinese-title>  
        <english-title>FRAMEWORK FOR PROVIDING AGENTIC EXPERIENCES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">H04L67/60</main-classification>  
        <further-classification edition="202201120251201B">H04L67/306</further-classification>  
        <further-classification edition="202301120251201B">G06N3/08</further-classification>  
        <further-classification edition="201901120251201B">G06F16/951</further-classification>  
        <further-classification edition="202001120251201B">G06F40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　曉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇俊明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHUN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">第一代理管理器和第二代理管理器協作以響應用戶請求。第一代理管理器在原始設備上接收用戶請求，並使用第一人工智能（AI）模型處理用戶請求以生成子請求序列。第一代理管理器將一個或多個子請求發送到目標設備上的第二代理管理器。第二代理管理器使用目標設備上的第二AI模型處理一個或多個子請求，並將目標設備上的應用輸出發送到第一代理管理器。根據應用的輸出，第一代理管理器在原始設備上生成對用戶請求的響應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A first agentic manager and a second agentic manager collaborate to respond to user requests. The first agentic manager on an originating device receives a user request and processes the user request using a first artificial intelligence (AI) model to generate a sequence of sub-requests. The first agentic manager sends one or more of the sub-requests to a second agentic manager on a target device. The second agentic manager processes the one or more of the sub-requests using a second AI model on the target device, and sends an output of an app on the target device to the first agentic manager. Based on the output of the app, the first agentic manager generates a response to the user request on the originating device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:方法</p>  
        <p type="p">1010:步驟</p>  
        <p type="p">1020:步驟</p>  
        <p type="p">1030:步驟</p>  
        <p type="p">1040:步驟</p>  
        <p type="p">1050:步驟</p>  
        <p type="p">1060:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1807" publication-number="202610672"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610672.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610672</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131949</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於抑制ＸＤＨ表達之組成物及方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR INHIBITING XDH EXPRESSION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/7088</main-classification>  
        <further-classification edition="200601120251201B">A61K48/00</further-classification>  
        <further-classification edition="200601120251201B">A61P19/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商諾佛　儂迪克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVO NORDISK A/S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐史崔克　艾利森　雪莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSTRIKER, ALLISON CHERRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科瑟　馬丁　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSER, MARTIN LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供抑制&lt;i&gt;XDH&lt;/i&gt;表達之寡核苷酸。亦提供包括該等寡核苷酸之組成物及其用途，特別是關於治療與異常&lt;i&gt;XDH&lt;/i&gt;表達相關之疾病、病症及/或病狀的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Oligonucleotides are provided herein that inhibit &lt;i&gt;XDH&lt;/i&gt; expression. Also provided are compositions including the same and uses thereof, particularly uses relating to treating diseases, disorders and/or conditions associated with aberrant &lt;i&gt;XDH&lt;/i&gt; expression.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1808" publication-number="202612346"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612346.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612346</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131970</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>判定影像擷取設定</chinese-title>  
        <english-title>DETERMINING IMAGE-CAPTURE SETTINGS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H04N23/60</main-classification>  
        <further-classification edition="200601120251201B">G06F3/16</further-classification>  
        <further-classification edition="202001120251201B">G06F40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏努伽瓦迪維魯　卡提凱延</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANMUGAVADIVELU, KARTHIKEYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕拉梅斯瓦蘭　維斯維什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARAMESWARAN, VISWESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉米爾　桑德什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHIMIRE, SANDESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄　豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, HAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　世忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHIZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱　景川</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHINCHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述用於擷取影像的系統及技術。例如，提供一種用於擷取影像的方法。該方法可包括獲得來自一使用者的一自然語言請求；基於該自然語言請求判定一或多個關鍵字；及基於該一或多個關鍵字調整一影像擷取裝置的影像擷取設定或影像處理設定中之至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and techniques are described herein for capturing images. For instance, a method for capturing images is provided. The method may include obtaining a natural-language request from a user; determining one or more keywords based on the natural-language request; and adjusting at least one of image-capture settings or image-processing settings of an image-capture device based on the one or more keywords.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:影像處理系統</p>  
        <p type="p">102:影像擷取裝置</p>  
        <p type="p">104:影像處理裝置</p>  
        <p type="p">106:場景</p>  
        <p type="p">108:透鏡</p>  
        <p type="p">110:控制機構</p>  
        <p type="p">112:曝光控制機構</p>  
        <p type="p">114:聚焦控制機構</p>  
        <p type="p">116:變焦控制機構</p>  
        <p type="p">118:影像感測器</p>  
        <p type="p">120:隨機存取記憶體(RAM)</p>  
        <p type="p">122:唯讀記憶體(ROM)</p>  
        <p type="p">124:影像處理器</p>  
        <p type="p">126:主機處理器</p>  
        <p type="p">128:影像信號處理器(ISP)</p>  
        <p type="p">130:輸入/輸出(I/O)埠</p>  
        <p type="p">132:輸入/輸出(I/O)裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1809" publication-number="202610657"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610657.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610657</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131988</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自噬誘導劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">A61K31/56</main-classification>  
        <further-classification edition="200601120251204B">C07J63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商舫茵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FINE JAPAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木義晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, YOSHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榊原學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAKIBARA, GAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之課題在於提供新穎的自噬誘導劑。&lt;br/&gt; 本揭示關於含有三萜烯化合物的自噬誘導劑等。特別是，藉由含有具5環結構之齊墩果烷型三萜烯、齊墩果酸、橄欖葉萃取物、還有女貞萃取物等，會有效促進細胞的自噬誘導作用。其等可作為固態組成物、飲食品組成物、化妝料或醫藥來製劑化，亦可併用賦形劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1810" publication-number="202611935"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611935.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611935</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131997</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶裝置及其上電讀取方法</chinese-title>  
        <english-title>MEMORY DEVICE AND POWER-ON READING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251106B">G11C16/26</main-classification>  
        <further-classification edition="200601120251106B">G11C16/06</further-classification>  
        <further-classification edition="200601120251106B">G11C17/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　毓明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, JOHNNY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　紀舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHI-SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶裝置及其上電讀取方法被提出。記憶體裝置的上電讀取方法包括：根據記憶體裝置的電源電壓的電壓位準產生上電讀取信號；依序分別檢測記憶體裝置中多個電路的多個準備狀態以產生多個就緒信號；依序讀取多個熔絲狀態以產生多個熔絲狀態信號；以及通過串聯耦接的多個暫存器根據上電讀取信號、多個就緒信號和多個熔絲狀態信號依序移位參考信號以產生讀取通過信號，其中多個暫存器中的每個在上電讀取信號、相應就緒信號或相應熔絲狀態信號處於設置邏輯值時被觸發。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device and a power-up reading method thereof are provided. The power-on reading method of the memory device includes: generating a power-on read signal according to a voltage level of a power voltage of the memory device; respectively detecting a plurality of ready states of a plurality of circuits in the memory device sequentially to generate a plurality of ready signals; reading a plurality of fuse states sequentially to generate a plurality of fuse state signals; and shifting a reference signal sequentially to generate a read pass signal according to the power-on read signal, the plurality of ready signals and the plurality of fuse state signals by a plurality of registers coupled in series, wherein each of the plurality of registers is triggered when the power-on read signal, corresponding ready signal or corresponding fuse state signal is at a setting logic value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110~S140:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1811" publication-number="202610606"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610606.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610606</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132072</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於微波和超短波的多探頭模組化人體康復理療系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250830B">A61G13/10</main-classification>  
        <further-classification edition="200601120250830B">A61N5/02</further-classification>  
        <further-classification edition="200601120250830B">A61G7/047</further-classification>  
        <further-classification edition="200601120250830B">A61B5/00</further-classification>  
        <further-classification edition="200601120250830B">A61N1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商河南理行合醫療科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENAN LIXINGHE MEDICAL TECHNOLOGY CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晏銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YANMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種基於微波和超短波的多探頭模組化人體康復理療系統，涉及理療設備技術領域，包括患者支撐裝置、活動式理療裝置，患者支撐裝置包括理療床，活動式理療裝置包括理療模組，每個理療模組設置有獨立的理療探頭；理療探頭包括微波理療頭、超短波理療頭；理療模組包括架設在理療床上方的半環型支架，半環型支架上設置有用於驅動理療探頭左右擺動的擺動驅動機構；半環型支架兩端分別設置在理療床兩側位置，理療床上設置有用於驅動半環型支架沿理療床長度方向移動的橫移驅動機構；其中橫移驅動機構、擺動驅動機構配合實現三維空間內理療位置的多角度、多方向的調節，利用微波理療頭、超短波理療頭配合理療，同時理療位置調節便利可實現三維空間內的多位置調整。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:活動式理療裝置</p>  
        <p type="p">2:患者支撐裝置</p>  
        <p type="p">3:理療模組</p>  
        <p type="p">4:理療探頭</p>  
        <p type="p">5:監測台</p>  
        <p type="p">6:微波理療頭</p>  
        <p type="p">7:超短波理療頭</p>  
        <p type="p">22:橫移座</p>  
        <p type="p">23:導向絲槓</p>  
        <p type="p">24:橫移滑動器</p>  
        <p type="p">25:驅動套</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1812" publication-number="202612159"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612159.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612159</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有不對稱內部和外部頻寬的記憶體內處理裝置和記憶體內處理封裝</chinese-title>  
        <english-title>PROCESSING-IN-MEMORY DEVICE AND PROCESSING-IN-MEMORY PACKAGE WITH ASYMMETRIC INTERNAL AND EXTERNAL BANDWIDTH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H01L25/18</main-classification>  
        <further-classification edition="200601120251201B">H01L23/00</further-classification>  
        <further-classification edition="200601120251201B">G11C5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李性柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEONG JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">記憶體內處理(PIM)裝置包括處理單元晶粒，其配置為通過外部頻寬與外部設備通訊，以及記憶體晶粒，其配置為通過內部頻寬與處理單元晶粒通訊。外部頻寬和內部頻寬不對稱地配置，以在不同的數據傳輸速率下運行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A processing-in-memory (PIM) device includes a processing unit die configured to communicate with an external device with an external bandwidth, and a memory die configured to communicate with the processing unit die with an internal bandwidth. The external bandwidth and the internal bandwidth are asymmetrically configured to operate at different data transfer rates.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:PIM裝置</p>  
        <p type="p">100:處理單元晶粒</p>  
        <p type="p">200:記憶體晶粒</p>  
        <p type="p">300:信號選擇邏輯；多個墊</p>  
        <p type="p">400:導線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1813" publication-number="202611519"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611519.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611519</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132096</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探針單元、探針頭、探針卡及探針系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G01R1/067</main-classification>  
        <further-classification edition="200601120251103B">G01R1/073</further-classification>  
        <further-classification edition="202001120251103B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺矽科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MPI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林進億</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林哲緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈昀徽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YUN-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃至敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宗毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TSUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種探針單元，包含有長度相同的一第一探針及一第二探針，其針身皆設有沿其縱長方向延伸的至少一貫穿的狹縫而呈鏤空狀，且被狹縫定義出至少二片體，第一探針之片體的總橫截面積大於第二探針之片體的總橫截面積；或者，第二探針的針身不具有狹縫而呈實心狀，第一探針之片體的總橫截面積大於第二探針之針身的橫截面積。所述片體的形狀被選擇為使得第一探針的接觸力大於第二探針的接觸力，藉以滿足電子受測裝置上不同尺寸的針測接觸區塊之測試需求，並同時可避免針尖磨耗速率不同的問題，以及針痕面積比差異過大的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:空間轉換器</p>  
        <p type="p">151:下表面</p>  
        <p type="p">153:接觸墊</p>  
        <p type="p">16:探針頭</p>  
        <p type="p">31:上導板單元</p>  
        <p type="p">311:上導孔</p>  
        <p type="p">32:下導板單元</p>  
        <p type="p">321:下導孔</p>  
        <p type="p">33:探針單元</p>  
        <p type="p">34:容置空間</p>  
        <p type="p">40A:第一探針</p>  
        <p type="p">40B:第二探針</p>  
        <p type="p">41:針尾</p>  
        <p type="p">42:針尖</p>  
        <p type="p">43:針身</p>  
        <p type="p">431:狹縫</p>  
        <p type="p">432:片體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1814" publication-number="202611274"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611274.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611274</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132116</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>實質上不含銻之阻燃聚合組合物</chinese-title>  
        <english-title>FLAME RETARDED POLYMERIC COMPOSITION SUBTANTIALLY FREE OF ANTIMONY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">C09K21/08</main-classification>  
        <further-classification edition="201801120251209B">C08K3/016</further-classification>  
        <further-classification edition="200601120251209B">C08L25/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞比馬利股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBEMARLE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德許瑞佛　丹尼爾Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE SCHRYVER, DANIEL A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所闡述之技術提供阻燃組合物及含聚合物之阻燃組合物，該等組合物實質上不含氧化銻。該組合物之實例包括包含聚合物、溴化阻燃劑及視情況一或多種填料之聚合組合物。該聚合組合物實質上不含氧化銻，但提供類似或更佳之加工特性。該溴化阻燃劑可為數目平均分子量為約750至約20,000且溴含量大於約55 wt%之溴化陰離子苯乙烯系聚合物，或溴化二苯基烷烴，或該兩者之混合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Technologies described herein provide flame retardant compositions and polymers containing flame retardant compositions that are substantially free of antimony oxide. Examples of the composition include a polymeric composition comprising a polymer, a brominated flame retardant and optionally one or more fillers. The polymeric composition is substantially free of antimony oxide but provide similar or better processing characteristics. The brominated flame may be a brominated anionic styrenic polymer having a number average molecular weight of about 750 to about 20,000 and a bromine content of greater than about 55 wt% or a brominated diphenylalkanes or mixtures of the two.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1815" publication-number="202611621"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611621.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611621</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132141</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁懸浮攝像系統及其控制方法</chinese-title>  
        <english-title>MAGNETIC LEVITATION IMAGING SYSTEM AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250910B">G03B5/00</main-classification>  
        <further-classification edition="200601120250910B">H02N15/00</further-classification>  
        <further-classification edition="202301120250910B">H04N23/61</further-classification>  
        <further-classification edition="202301120250910B">H04N23/60</further-classification>  
        <further-classification edition="202301120250910B">H04N23/13</further-classification>  
        <further-classification edition="202301120250910B">H04N23/53</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英華達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC APPLIANCES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦榮林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, RONG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種磁懸浮攝像系統及其控制方法，其中，磁懸浮攝像系統包括：底座，底座包括第一磁懸浮永磁體；攝像組件，攝像組件包括第二磁懸浮永磁體、外殼、豎直轉動機構以及鏡頭；第一磁懸浮永磁體和第二磁懸浮永磁體始終保持相對平行，並且攝像組件通過第一磁懸浮永磁體和第二磁懸浮永磁體懸浮於底座上方；其中，外殼具有在豎直轉動機構的作用下相對於第二磁懸浮永磁體豎直旋轉的運動行程，並且鏡頭與外殼固定連接。本發明能夠實現磁懸浮鏡頭的豎直旋轉，增加磁懸浮鏡頭的旋轉角度和圖像捕捉範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a magnetic levitation imaging system and a control method thereof, wherein the magnetic levitation imaging system comprises a base including a first magnetic levitation permanent magnet, and an imaging assembly including a second magnetic levitation permanent magnet, a housing, a vertical rotation mechanism, and a camera; the first magnetic levitation permanent magnet and the second magnetic levitation permanent magnet are maintained in a mutually parallel relationship at all times, and the imaging assembly is suspended above the base via the first and second magnetic levitation permanent magnets; the housing has a vertical rotational travel relative to the second magnetic levitation permanent magnet under the action of the vertical rotation mechanism, and the camera is fixedly connected to the housing; the present invention enables vertical rotation of a magnetic levitation camera, thereby increasing its rotation angle and image capture range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:底座</p>  
        <p type="p">11:第一磁懸浮永磁體</p>  
        <p type="p">20:攝像組件</p>  
        <p type="p">21:第二磁懸浮永磁體</p>  
        <p type="p">22:外殼</p>  
        <p type="p">23:豎直轉動機構</p>  
        <p type="p">24:鏡頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1816" publication-number="202611074"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611074.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611074</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132162</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種多肽化合物及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/18</main-classification>  
        <further-classification edition="200601120251201B">A61K38/16</further-classification>  
        <further-classification edition="200601120251201B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海瀚辰星泰醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI PEPTIDSTAR THERAPEUTICS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范珺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭淑春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, SHUCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　海兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, HAIBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉力鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種多肽化合物及其應用，具體公開了一種如式（I）所示的多肽化合物或其藥學上可接受的鹽、其組合物及其應用。本發明提供的多肽化合物具有極強生物活性及良好藥代性質，動物藥效上顯示出良好藥效。 &lt;br/&gt;c[X4‑X5‑X6‑X7‑X8‑X9]‑X10‑X11‑X12‑X13‑X14‑X15‑X16</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1817" publication-number="202610748"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610748.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610748</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132167</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用閃光燈之晶圓脫離技術</chinese-title>  
        <english-title>WAFER DEBONDING USING FLASHLAMP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B23K1/018</main-classification>  
        <further-classification edition="200601120251201B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商脈衝鍛造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PULSEFORGE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅森　伊恩　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAWSON, IAN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖爾卡尼　維克拉姆　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TURKANI, VIKRAM S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種用於在積體電路製造期間附接及分離電子結構之方法。形成包括一載體及一電子結構之一堆疊。在該載體與電子結構之間，提供一寬頻吸收層。該寬頻吸收層包括寬頻吸收材料及聚合物。在該載體與該電子結構之間亦提供一紫外(UV)光可固化黏著劑層。引導UV光通過該載體，以固化該UV可固化黏著劑。當該電子結構固定在該載體上時可處理該電子結構。藉由將從一閃光燈之光脈衝發射通過該載體，以加熱該寬頻吸收層，該載體可由該電子結構移除。該熱可分解該聚合物，以允許該電子結構由該載體移除。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for attaching and detaching electronics structures during integrated circuit manufacturing is disclosed. A stack is formed including a carrier and an electronics structure. Between the carrier and electronics structure, a broadband absorber layer is provided. The broadband absorber layer includes broadband absorber material and polymer. A layer of ultraviolet (UV) light curable adhesive is also provided between the carrier and the electronics structure. UV light is directed through the carrier in order to cure the UV curable adhesive. The electronics structure can be processed while secured to the carrier. The electronics structure is removable from the carrier by transmitting a light pulse from a flashlamp through the carrier to heat the broadband absorber layer. The heat can decompose the polymer to permit removal of the electronics structure from the carrier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100,110,120,130,140,150,160:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1818" publication-number="202611353"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611353.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611353</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132168</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚丙烯腈原絲和碳纖維及其製備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">D01F9/22</main-classification>  
        <further-classification edition="200601120251201B">D01F6/38</further-classification>  
        <further-classification edition="200601120251201B">D01D5/06</further-classification>  
        <further-classification edition="200601120251201B">D01D5/12</further-classification>  
        <further-classification edition="200601120251201B">D01D10/00</further-classification>  
        <further-classification edition="200601120251201B">D01F11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, ZHIGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王建寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIANNING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>屠曉萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, XIAOPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳展俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了聚丙烯腈原絲、碳纖維及其製備方法。碳纖維束包括經GB/T 3362~2017測試後斷面有凹陷/凸起的纖維和斷面有溝槽的纖維，所述斷面有凹陷/凸起的纖維的根數佔碳纖維束纖維總根數的比例X%不大於25%；和其中所述斷面有溝槽的纖維的根數佔碳纖維束纖維總根數的比例Y%不大於20%。所述碳纖維拉伸強度高、拉伸模數高、伸長率高以及CV值低。聚丙烯腈原絲的製備方法包括凝固成型和凝固牽伸的步驟，在所述凝固成型步驟中，滿足關係式：0.4(V&lt;sub&gt;S&lt;/sub&gt;-V&lt;sub&gt;E&lt;/sub&gt;)≤ (V&lt;sub&gt;E&lt;/sub&gt;-V&lt;sub&gt;C&lt;/sub&gt;) ≤1.1(V&lt;sub&gt;S&lt;/sub&gt;-V&lt;sub&gt;E&lt;/sub&gt;)，其中在聚丙烯腈原液離開噴絲板表面2 cm處，絲束中心點的凝固液流速為V&lt;sub&gt;C&lt;/sub&gt;，絲束上邊緣處的凝固液流速為V&lt;sub&gt;E&lt;/sub&gt;，且凝固液表層流速為V&lt;sub&gt;S&lt;/sub&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1819" publication-number="202611520"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611520.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611520</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電探針卡、光電測試器及相關方法</chinese-title>  
        <english-title>OPTOELECTRONIC PROBE CARDS, OPTOELECTRONIC TESTERS, AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">G01R1/07</main-classification>  
        <further-classification edition="200601120251204B">G01R1/073</further-classification>  
        <further-classification edition="200601120251204B">G01R31/28</further-classification>  
        <further-classification edition="200601120251204B">G01R31/308</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豐菲克特公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORMFACTOR, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, QUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里沙維　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RISHAVY, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽門斯　麥克　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMMONS, MICHAEL E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉塔普　迪維亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRATAP, DIVYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">光電探針卡、光電測試器及相關方法。該等光電探針卡經組態用於與一裝置基板上之一受測裝置（DUT）進行光通信及電通信，該裝置基板包括複數個DUT且包括一光學探針總成及一電探針總成。該光學探針總成包括複數個具透鏡光學探針，該複數個具透鏡光學探針經組態用於與該DUT之至少一個光電裝置進行非接觸式光通信。該電探針總成包括複數個電探針，該複數個電探針經組態用於經由在該複數個電探針與該DUT之複數個接觸墊之間的電接觸與該DUT進行電通信。該等光電測試器包括一夾頭、該光電探針卡、一光信號產生與分析總成，及一電信號產生與分析總成。該等方法包括將該光電探針卡之組件與該DUT之對應組件主動及/或被動地對準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Optoelectronic probe cards, optoelectronic testers, and related methods. The optoelectronic probe cards are configured for optical and electrical communication with a device under test (DUT) on a device substrate that includes a plurality of DUTs and includes an optical probe assembly and an electrical probe assembly. The optical probe assembly includes a plurality of lensed optical probes configured for non-contact optical communication with at least one optoelectronic device of the DUT. The electrical probe assembly includes a plurality of electrical probes configured for electrical communication with the DUT via electrical contact between the plurality of electrical probes and a plurality of contact pads of the DUT. The optoelectronic testers include a chuck, the optoelectronic probe card, an optical signal generation and analysis assembly, and an electrical signal generation and analysis assembly. The methods include actively and/or passively aligning components of the optoelectronic probe card with corresponding components of the DUT.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光電測試器</p>  
        <p type="p">20:裝置基板</p>  
        <p type="p">22:受測裝置(DUT)</p>  
        <p type="p">24:上表面</p>  
        <p type="p">25:光柵耦合器</p>  
        <p type="p">26:側壁表面</p>  
        <p type="p">27:波導</p>  
        <p type="p">28:光電裝置</p>  
        <p type="p">30:接觸墊</p>  
        <p type="p">32:信號接收接觸墊</p>  
        <p type="p">34:信號發射接觸墊</p>  
        <p type="p">40:夾頭</p>  
        <p type="p">42:支撐表面</p>  
        <p type="p">50:夾頭載台</p>  
        <p type="p">52:第一維度</p>  
        <p type="p">54:第二維度</p>  
        <p type="p">56:第三維度</p>  
        <p type="p">60:光信號產生與分析總成</p>  
        <p type="p">62:光學測試信號</p>  
        <p type="p">64:光學合成信號</p>  
        <p type="p">70:電信號產生與分析總成</p>  
        <p type="p">72:電測試信號</p>  
        <p type="p">74:電合成信號</p>  
        <p type="p">80:控制器</p>  
        <p type="p">82:電腦可讀取儲存媒體</p>  
        <p type="p">100:光電探針卡</p>  
        <p type="p">102:卡基板</p>  
        <p type="p">110:光學探針總成</p>  
        <p type="p">112:具透鏡光學探針</p>  
        <p type="p">114:信號發射具透鏡光學探針</p>  
        <p type="p">116:信號接收具透鏡光學探針</p>  
        <p type="p">118:光纖</p>  
        <p type="p">120:光學介面結構</p>  
        <p type="p">122:光纖插座</p>  
        <p type="p">124:光柵耦合器</p>  
        <p type="p">126:光纖介接光柵耦合器</p>  
        <p type="p">128:透鏡介接光柵耦合器</p>  
        <p type="p">130:探針透鏡</p>  
        <p type="p">132:波導</p>  
        <p type="p">150:電探針總成</p>  
        <p type="p">152:電探針</p>  
        <p type="p">154:信號發射電探針</p>  
        <p type="p">156:信號接收電探針</p>  
        <p type="p">158:電探針卡</p>  
        <p type="p">160:開口/孔隙</p>  
        <p type="p">162:裝置基板相對側</p>  
        <p type="p">164:裝置基板面向側</p>  
        <p type="p">170:成像裝置</p>  
        <p type="p">180:探針總成致動器</p>  
        <p type="p">190:支撐結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1820" publication-number="202612210"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612210.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612210</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電力系統、直流耦合裝置及其控制方法</chinese-title>  
        <english-title>POWER SYSTEM, DC COUPLING DEVICE AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H02J7/32</main-classification>  
        <further-classification edition="200601120251204B">H02J15/00</further-classification>  
        <further-classification edition="200601120251204B">H02J4/00</further-classification>  
        <further-classification edition="201601120251204B">H01M8/04298</further-classification>  
        <further-classification edition="200601120251204B">H01M8/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商台達電子企業管理（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS (SHANGHAI) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王長永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHANGYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸岩松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YANSONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案關於一種電力系統、直流耦合裝置及其控制方法，其中電力系統根據電源、儲能裝置和製氫裝置中一個或多個的狀態和參數，確定操作模式，選擇製氫的電力來源和對應的電力傳輸路徑，利用選擇的電力來源提供電能，以通過選擇的電力傳輸路徑進行電能轉換和傳輸以提供製氫裝置所需的電能。被選擇的最優電力來源和電力傳輸路徑可以穩定、持續、高效率、低成本的方式為製氫裝置供電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power system and a control method of the power system are provided. The power system determines the operating mode according to the states and parameters of one or more of the power sources, the energy storage device and the hydrogen generation device. The power source and the corresponding power transmission path for hydrogen generation is selected. The selected power source supplies power. The selected power is converted and transmitted to provide the electric power required by the hydrogen generation device through the selected power transmission path. The selected optimal power source and the power transmission path supply power to the hydrogen generation device with stable, continuous, enhanced efficiency and reduced cost.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電力系統</p>  
        <p type="p">20:交流母線</p>  
        <p type="p">21:電網</p>  
        <p type="p">2a:第一發電裝置</p>  
        <p type="p">2b:第二發電裝置</p>  
        <p type="p">3:製氫供電裝置</p>  
        <p type="p">31:交流端</p>  
        <p type="p">32:直流輸出端</p>  
        <p type="p">33:直流耦合端</p>  
        <p type="p">4:製氫裝置</p>  
        <p type="p">5:儲能裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1821" publication-number="202612246"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612246.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612246</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132187</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>射頻驅動電路、射頻電源和半導體製程設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120251204B">H02M7/5387</main-classification>  
        <further-classification edition="200601120251204B">H03F3/193</further-classification>  
        <further-classification edition="200601120251204B">H03F3/20</further-classification>  
        <further-classification edition="200601120251204B">C23C14/34</further-classification>  
        <further-classification edition="200601120251204B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京華丞電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛浩龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李加波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例提供了一種射頻驅動電路、射頻電源和半導體製程(process)設備；包括：信號輸入模組輸出射頻驅動信號以及初始致能(enable)信號；一級全橋驅動放大模組在致能時，對射頻驅動信號進行放大，生成放大射頻驅動信號；主路全橋放大模組對放大射頻驅動信號進行放大，生成並輸出射頻功率；信號輸入檢測保護模組在獲取到初始致能信號時根據放大射頻驅動信號生成工作致能信號，致能一級全橋驅動放大模組；通過本申請實施例可以快速回應高頻射頻信號，並且對射頻驅動電路進行保護，提高穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:信號輸入模組</p>  
        <p type="p">200:一級全橋驅動放大模組</p>  
        <p type="p">300:主路全橋放大模組</p>  
        <p type="p">400:信號輸入檢測保護模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1822" publication-number="202612304"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612304.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612304</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法、通信裝置和通信系統</chinese-title>  
        <english-title>COMMUNICATION METHOD, COMMUNICATION APPARATUS AND COMMUNICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H04L5/00</main-classification>  
        <further-classification edition="201701120251103B">H04B7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊特拉卡　羅杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHITRAKAR, ROJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李云波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUNBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請的實現方式提供了一種通信方法和通信裝置。所述方法包括：AMP標籤獲取時間偏移，所述時間偏移用於估計攜帶載波信號的激勵PPDU的起始時間。在控制PPDU與所述激勵PPDU之間存在長時間間隔的情況下，所述AMP標籤可以找到正確的載波信號，並在正確的時間對正確的載波信號進行反向散射。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Implementations of the present application provide a communication method and a communication apparatus. The method includes: an AMP tag obtains a time-offset used to estimate the start time of the energizer PPDU carrying the carrier signal. In the situation that there is a long-time gap between the control PPDU and the energizer PPDU, the AMP tag can figure out the right carrier signal and backscatter on it at the right time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401、402、403、404、405:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1823" publication-number="202611725"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611725.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611725</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132259</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>未來資源利用率預測</chinese-title>  
        <english-title>FUTURE RESOURCE UTILISATION PREDICTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F11/34</main-classification>  
        <further-classification edition="200601120251201B">G06F9/50</further-classification>  
        <further-classification edition="200601120251201B">G06F11/30</further-classification>  
        <further-classification edition="201801120251201B">G06F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比薩大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSITY OF PISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德魯齊　馬泰奧瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREOZZI, MATTEO MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯蒂亞　喬凡尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEA, GIOVANNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濟波　拉斐爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZIPPO, RAFFAELE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛尼　愛德華多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONI, EDOARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設備，其包含：資源監測電路系統，其經組態以獲得指示處理系統資源的利用率的一資源利用率度量；及未來資源利用率預測電路系統，其經組態以基於由該資源監測電路系統擷取的該資源利用率度量，預測指示該處理系統資源的經預測未來利用率的至少一個未來資源利用率度量。該未來資源利用率預測電路系統經組態以使一系統資源管理代理可存取該至少一個未來資源利用率度量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus comprises resource monitoring circuitry configured to obtain a resource utilisation metric indicative of utilisation of processing system resource; and future resource utilisation prediction circuitry configured to predict, based on the resource utilisation metric captured by the resource monitoring circuitry, at least one future resource utilisation metric indicative of predicted future utilisation of the processing system resource. The future resource utilisation prediction circuitry is configured to make the at least one future resource utilisation metric accessible to a system resource management agent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:資源監測電路系統</p>  
        <p type="p">32:未來資源利用率預測電路系統</p>  
        <p type="p">42:預處理單元；預處理步驟；預處理</p>  
        <p type="p">44:預測模型</p>  
        <p type="p">46:模型參數</p>  
        <p type="p">48:暫存器</p>  
        <p type="p">50:模型訓練電路系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1824" publication-number="202611948"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611948.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611948</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132281</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01B3/02</main-classification>  
        <further-classification edition="200601120251204B">H01B3/18</further-classification>  
        <further-classification edition="200601120251204B">H01B3/56</further-classification>  
        <further-classification edition="200601120251204B">H01B17/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電工器件創新股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種減少絕緣膜之剝離之半導體裝置。 &lt;br/&gt;半導體裝置具備：第1金屬層，其設置於基板上；第1無機絕緣膜，其覆蓋上述第1金屬層，且具有露出上述第1金屬層之上表面中之中央部之第1開口；第2金屬層，其設置於上述第1金屬層上，且下表面中之中央部經由上述第1開口而與上述第1金屬層接觸，上述下表面中之周緣部與上述第1開口之外側之上述第1無機絕緣膜接觸；第2無機絕緣膜，其覆蓋上述第2金屬層，且具有露出上述第2金屬層之上表面中之中央部之第2開口；及有機絕緣膜，其覆蓋上述第2無機絕緣膜，且具有露出上述第2金屬層之上表面中之上述中央部且自上述基板之厚度方向觀察時與上述第2開口重疊之第3開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10,10A:基板</p>  
        <p type="p">10B:半導體層</p>  
        <p type="p">11(第1無機絕緣膜),12(第2無機絕緣膜),13(第3無機絕緣膜):無機絕緣膜</p>  
        <p type="p">11A(第1開口),12A(第2開口),13A(第4開口),14A(第3開口):開口</p>  
        <p type="p">14:有機絕緣膜</p>  
        <p type="p">15(第3金屬層),16(第1金屬層),16A,16B,18(第2金屬層),18A(密接層),18B(低電阻層):金屬層</p>  
        <p type="p">15A,17A,19A:上表面</p>  
        <p type="p">17B,19B:下表面</p>  
        <p type="p">100:半導體裝置</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1825" publication-number="202612043"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612043.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612043</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132360</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓檢測系統及對象體檢測方法</chinese-title>  
        <english-title>WAFER INSPECTION SYSTEM AND OBJECT INSPECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01L21/66</main-classification>  
        <further-classification edition="200601120251001B">H01L21/67</further-classification>  
        <further-classification edition="200601120251001B">G01N21/88</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＥＯ科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EO TECHNICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李璂洪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KI HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙容徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李定敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JEONG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善重</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUN JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋好憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, HO HEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據例示性實施例的晶圓檢測系統被構成為對裝載至載台的晶圓進行檢測，包括：第一影像感測器，對所述晶圓的一面進行多次拍攝；第二影像感測器，對所述晶圓的相反面進行多次拍攝；以及控制部，藉由對所述第一影像感測器及所述第二影像感測器分別施加拍攝訊號來控制對所述晶圓進行拍攝的時間點，所述第一影像感測器及所述第二影像感測器分別相對於所述載台在第一方向上產生相對移動，且所述第一影像感測器及所述第二影像感測器可分別在對所述晶圓進行多次拍攝的過程中連續地進行所述相對移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wafer inspection system according to an embodiment is configured to inspect a wafer loaded on a stage, and comprises a first image sensor for photographing one side of the wafer multiple times; a second image sensor for photographing the opposite side of the wafer multiple times; and a control unit for controlling a time point for photographing the wafer by applying a photographing signal to each of the first image sensor and the second image sensor; wherein each of the first image sensor and the second image sensor moves relative to the stage in a first direction, and the relative movement can be continuously performed during a process in which each of the first image sensor and the second image sensor photographs the wafer multiple times.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶圓檢測系統</p>  
        <p type="p">3:載台</p>  
        <p type="p">4:第一影像感測器</p>  
        <p type="p">5:第二影像感測器</p>  
        <p type="p">6:控制部</p>  
        <p type="p">10:晶圓</p>  
        <p type="p">11:一面</p>  
        <p type="p">12:相反面</p>  
        <p type="p">61:第一訊號</p>  
        <p type="p">62:第二訊號</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">R:檢測列</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1826" publication-number="202611706"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611706.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611706</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132411</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>競爭預測器</chinese-title>  
        <english-title>CONTENTION PREDICTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251113B">G06F9/38</main-classification>  
        <further-classification edition="200601120251113B">G06F12/02</further-classification>  
        <further-classification edition="200601120251113B">G06F13/14</further-classification>  
        <further-classification edition="200601120251113B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利傑達爾　艾瑞克奧拉哈拉爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LILJEDAHL, ERIC OLA HARALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯派爾　湯馬斯菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPEIER, THOMAS PHILIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍斯奈爾　馬修詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORSNELL, MATTHEW JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭德爾　喬舒亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANDALL, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設備包含：一競爭預測器，其經組態以回應於能夠導致與一目標位址之經快取資料相關聯之一致性狀態的一改變之一讀取/寫入觸發而預測存取對應於該目標位址之該資料的一競爭級別；及控制電路系統，其經組態以基於由該競爭預測器預測的該競爭級別而選擇用於處理該讀取/寫入觸發之一處理行為。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus comprises a contention predictor configured to predict, in response to a read/write trigger capable of causing a change of coherency state associated with cached data for a target address, a level of contention for access to the data corresponding to the target address; and control circuitry configured to select, based on the level of contention predicted by the contention predictor, a processing behaviour for processing the read/write trigger.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:控制電路系統</p>  
        <p type="p">32:競爭預測器；本地節點本機競爭預測器；處理器本機競爭預測器</p>  
        <p type="p">34:預測資料結構；競爭表；項目</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1827" publication-number="202611775"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611775.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611775</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用具有通道跳躍的基於同步相位的測距之射頻識別（ＲＦＩＤ）標籤定位</chinese-title>  
        <english-title>RADIO FREQUENCY IDENTIFICATION (RFID) TAG LOCALIZATION USING SYNCHRONIZED PHASE-BASED RANGING WITH CHANNEL HOPPING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06K7/10</main-classification>  
        <further-classification edition="200601120251201B">G01S13/75</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希斯科克　保羅　多米尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISCOCK, PAUL DOMINIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯克　約瑟夫　派崔克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURKE, JOSEPH PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾格洛華　蘇密</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGRAWAL, SUMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂　昇元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, SHENG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於無線通訊的系統及技術。一種無線通訊裝置可獲得指示與該無線通訊裝置與一射頻識別(RFID)標籤之間的基於相位的測距(PBR)距離估計相關聯的一經組態載波頻率序列的資訊。可偵測從一第一RFID讀取器裝置傳輸至該RFID標籤的一RFID查詢命令。使用在至少該無線通訊裝置與該第一RFID讀取器裝置之間同步的一對應複數個跳頻，一引導頻音調可在該經組態序列中之各個各別載波頻率上依序傳輸至該RFID標籤。基於與針對該經組態載波頻率序列中之各個各別載波頻率從該RFID標籤接收的一背向散射信號相關聯的相對相位測量，可判定指示從該無線通訊裝置至該RFID標籤的一估計距離的一PBR測量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and techniques are provided for wireless communications. A wireless communication device can obtain information indicative of a configured sequence of carrier frequencies associated with phase-based ranging (PBR) distance estimation between the wireless communication device and a Radio Frequency Identification (RFID) tag. An RFID Query command transmitted from a first RFID reader device to the RFID tag can be detected. A pilot tone can be sequentially transmitted to the RFID tag on each respective carrier frequency of the configured sequence, using a corresponding plurality of frequency hops synchronized between at least the wireless communication device and the first RFID reader device. A PBR measurement can be determined, indicative of an estimated distance from the wireless communication device to the RFID tag based on relative phase measurement associated with a backscatter signal received from the RFID tag for each respective carrier frequency of the configured sequence of carrier frequencies.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:RFID系統</p>  
        <p type="p">710:RFID讀取器</p>  
        <p type="p">712:RFID讀取器</p>  
        <p type="p">714:RFID讀取器</p>  
        <p type="p">716:RFID讀取器</p>  
        <p type="p">718:RFID讀取器</p>  
        <p type="p">730:容器；籃子</p>  
        <p type="p">740:RFID標籤</p>  
        <p type="p">742:RFID標籤</p>  
        <p type="p">747:RFID標籤</p>  
        <p type="p">750A:固定參考RFID標籤；RFID參考標籤A</p>  
        <p type="p">750B:固定參考RFID標籤；RFID參考標籤B</p>  
        <p type="p">750C:固定參考RFID標籤；RFID參考標籤C</p>  
        <p type="p">750D:固定參考RFID標籤；RFID參考標籤D</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1828" publication-number="202610876"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610876.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610876</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132508</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於車架的可收合支架、車架及嬰兒車</chinese-title>  
        <english-title>FOLDABLE BRACKET FOR FRAME, FRAME AND BABY STROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B62B7/06</main-classification>  
        <further-classification edition="200601120251201B">B62B9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱萬權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, WANQUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於車架的可收合支架，其包括：車手組件；後腳組件；底架組件；以及收合組件，活動聯接於車手組件與後腳組件之間以及後腳組件與底架組件之間，使得可收合支架以及由此車架處於車手組件相對於底架組件呈完全展開的推車狀態、車手組件相對於底架組件呈半收合的拖車狀態、和車手組件相對於底架組件呈完全收合的收納狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A foldable bracket for a frame includes: a handle assembly; a rear leg assembly; a bottom frame assembly; and a folding assembly, which is movably connected between the handle assembly and the rear leg assembly and between the rear leg assembly and the bottom frame assembly, enabling the foldable support and thus the frame to be in a stroller state where the handle assembly is fully extended relative to the bottom frame assembly, a trailer state where the handle assembly is partially folded relative to the bottom frame assembly, and a storage state where the handle assembly is fully folded relative to the bottom frame assembly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:車手組件</p>  
        <p type="p">200:後腳組件</p>  
        <p type="p">300:底架組件</p>  
        <p type="p">400:釋鎖操作組件</p>  
        <p type="p">500:收合組件</p>  
        <p type="p">510:第一關節組件</p>  
        <p type="p">520:第二關節組件</p>  
        <p type="p">530:上支撐件</p>  
        <p type="p">540:下支撐件</p>  
        <p type="p">600:座椅支撐組件</p>  
        <p type="p">610:第一座椅支撐件</p>  
        <p type="p">620:第二座椅支撐件</p>  
        <p type="p">700:扶手組件</p>  
        <p type="p">800:頂篷支架</p>  
        <p type="p">20:車輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1829" publication-number="202611783"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611783.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611783</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132556</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理神經網路的處理單元、電子裝置及主機處理器</chinese-title>  
        <english-title>PROCESSING UNIT FOR PROCESSING NEURAL NETWORK, ELECTRONIC DEVICE, AND HOST PROCESSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">G06N3/063</main-classification>  
        <further-classification edition="200601120251201B">G06F9/06</further-classification>  
        <further-classification edition="200601120251201B">G06T1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪正埈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, JEONGJOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金娜炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, NAHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸東珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOOK, DONGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹富永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, BUYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田在熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUN, JAEHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙勳熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HOONHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪利爍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, ISAAC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳景柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, KYONGJOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>殷鍾赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EUN, JONGHYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於處理神經網路的處理單元包括協調器，用以自主機處理器接收內核命令、確定對應於內核命令的內核類型、以及基於內核類型產生不同的附加命令，內核命令被用於執行處理神經網路所需的內核，以及命令處理器，用以基於內核命令和附加命令排程以使得當執行消耗內核時參考藉由產生內核所產生的資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A processing unit for processing a neural network includes a coordinator configured to receive a kernel command from a host processor, determine a type of kernel corresponding to the kernel command, and generate an additional command different according to the type of kernel, the kernel command being used to execute kernels required to process the neural network, and a command processor configured to schedule such that the data produced by the producing kernel is referred to when the consuming kernel is executed based on the kernel command and the additional command.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:主機處理器</p>  
        <p type="p">110:使用者模式驅動程式</p>  
        <p type="p">120:內核模式驅動程式</p>  
        <p type="p">130:主機程式</p>  
        <p type="p">200:處理單元</p>  
        <p type="p">210:協調器</p>  
        <p type="p">220:命令處理器</p>  
        <p type="p">CMD:命令</p>  
        <p type="p">EVT:事件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1830" publication-number="202611731"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611731.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611731</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132557</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓縮組相聯快取中浮動標籤利用的方法、儲存裝置以及使用者設備</chinese-title>  
        <english-title>METHOD FOR FLOATING TAG UTILIZATION IN A COMPRESSED SET-ASSOCIATIVE CACHE, STORAGE DEVICE AND USER EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251201B">G06F12/0846</main-classification>  
        <further-classification edition="201601120251201B">G06F12/0802</further-classification>  
        <further-classification edition="200601120251201B">G06F3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施韋多克　布萊恩　康納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHWEDOCK, BRIAN CONNOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬爾　沙希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, SHASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納克拉　塔倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKRA, TARUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種方法和裝置，其中儲存裝置的控制器確定儲存裝置的快取記憶體中的標籤陣列和浮動標籤陣列的項目是否包括對應於快取記憶體的資料陣列中要擷取或更新的物件的項目。如果項目包括對應於物件的項目，控制器也擷取或更新資料陣列中的物件。項目包括標籤陣列的標籤項目和浮動標籤陣列的浮動標籤項目。浮動標籤項目與資料陣列的一或多個資料項目中的物件相關聯，且物件小於或等於資料陣列的資料項目大小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and device are provided in which a controller of a storage device determines whether entries of a tag array and a floating tag array, in a cache memory of the storage device, include an entry that corresponds to an object, in a data array of the cache memory, that is to be fetched or updated. In case that the entries comprise the entry that corresponds to the object, the controller also fetches or updates the object in the data array. The entries comprise tag entries of the tag array and floating tag entries of the floating tag array. The floating tag entries are associated with objects in one or more data entries of the data array, and the objects are smaller than or equal to a data entry size of the data array.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">402、404、406、408、410、412:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1831" publication-number="202611104"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611104.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611104</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132560</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>活性能量射線固化性組成物、固化塗膜和薄膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">C08F2/50</main-classification>  
        <further-classification edition="200601120251212B">C09D4/04</further-classification>  
        <further-classification edition="200601120251212B">C09D5/24</further-classification>  
        <further-classification edition="200601120251212B">C08L33/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長野尭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGANO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥村彰朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUMURA, AKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供塗布於基材表面使其固化而賦予抗靜電性，具有在光學用途中能使用程度的透明性、透光性且具有耐擦傷性及耐彎曲性的活性能量射線固化性組合物、固化塗膜和薄膜。該組合物含有（A）~（D）成分，相對於組合物中的樹脂固體成分100質量份，（C）成分的含量為4質量份以下，相對於組合物中的樹脂固體成分100質量%，不含10質量%以上的羥值60mgKOH/g以上的樹脂成分。（A）成分：含水溶性光引發劑（a1）的光引發劑；（B）成分：包含含氧亞烷基鏈的化合物（b1）的多官能（甲基）丙烯酸酯；（C）成分：導電性高分子微粒；（D）成分：含沸點130℃以上且漢森溶解度參數δH12.0以上的溶劑（d1）的有機溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1832" publication-number="202612068"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612068.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612068</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132573</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251007B">H01L21/67</main-classification>  
        <further-classification edition="200601120251007B">B08B3/10</further-classification>  
        <further-classification edition="200601120251007B">B08B3/02</further-classification>  
        <further-classification edition="200601120251007B">B08B11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出村健介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEMURA, KENSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山華雅司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGE, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能抑制在基板的面內產生溫度偏差的基板處理裝置。實施方式的基板處理裝置包括：載置部，具有能夠載置基板的載置台，能夠使所載置的所述基板旋轉；冷卻部，能夠經由冷卻氣體噴嘴向所述載置台與所述基板之間的空間供給冷卻氣體；以及液體供給部，能夠向所述基板的與所述載置台的面相反的面供給液體。所述冷卻氣體噴嘴具有隨著接近所述基板側而向遠離所述基板的旋轉中心軸的方向傾斜的至少一個第一噴嘴孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:冷卻氣體噴嘴</p>  
        <p type="p">10a:供給口</p>  
        <p type="p">10b、10c:流路</p>  
        <p type="p">10d:噴嘴孔</p>  
        <p type="p">10d1:延長線</p>  
        <p type="p">100:基板</p>  
        <p type="p">100a:背面</p>  
        <p type="p">100b:表面</p>  
        <p type="p">100c:旋轉中心軸</p>  
        <p type="p">A:點</p>  
        <p type="p">da:開口</p>  
        <p type="p">G、R:距離</p>  
        <p type="p">θ:傾斜角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1833" publication-number="202610626"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610626.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610626</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132576</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>HER2/mutEGFR抑制劑之結晶型式及製備彼等之方法</chinese-title>  
        <english-title>CRYSTALLINE FORMS OF HER2/MUTEGFR INHIBITORS AND PROCESS FOR THEIR PREPARATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61K31/44</main-classification>  
        <further-classification edition="200601120251201B">A61K31/437</further-classification>  
        <further-classification edition="200601120251201B">A61K31/357</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商拜耳廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAYER AKTIENGESELLSCHAFT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希瑞爾　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHREYER, LUCAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希倫布蘭德　文森　朱利葉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILLENBRAND, JULIUS VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雅各　蒂亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JACOBS, TIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ZA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱爾　比爾吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEIL, BIRGIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐萊尼克　布瑞塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLENIK, BRITTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索瓦　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOWA, MICHAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏尼克　崔斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHENCK, TRISTAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加保爾　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEBAUER, JOERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷米爾　奈尼恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREMEYER, NADINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海佐　特倫斯　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HETZEL, TERENCE ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡丁　多明尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAEDING, DOMENIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古曼　尼可拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUIMOND, NICOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格羅特約翰　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GROTJOHANN, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吾斯區　亨利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUNSCH, HENRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於： &lt;br/&gt;•  式(A)之化合物3-(3-氯-2-甲氧基-苯胺基)-2-[3-[[(2S)-1,4-二噁烷-2-基]甲氧基]-4-吡啶基]-1,5,6,7-四氫吡咯并[3,2-c]吡啶-4-酮之結晶水合物1變體A型式： &lt;br/&gt;&lt;img align="absmiddle" height="368px" width="243px" file="ed10163.JPG" alt="ed10163.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;&lt;br/&gt;其中水之含量大於0 % (w/w)且≤ 4.0 % (w/w)； &lt;br/&gt;•  製備該式(A)之化合物之該結晶水合物1變體A型式之方法及該方法中所使用之中間體化合物； &lt;br/&gt;•  包括該式(A)之化合物之該結晶水合物1變體A型式之醫藥組合物及組合；及 &lt;br/&gt;•  該式(A)之化合物之該結晶水合物1變體A型式及包括其之醫藥組合物或組合，其用於治療或預防癌症、例如肺癌、尤其非小細胞肺癌。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates: &lt;br/&gt;• to the crystalline Hydrate 1 Modification A form of the compound 3-(3-chloro-2-methoxy-anilino)-2-[3-[[(2S)-1,4-dioxan-2-yl]methoxy]-4-pyridyl]-1,5,6,7-tetrahydropyrrolo[3,2-c]pyridine-4-one of formula (A): &lt;br/&gt;&lt;img align="absmiddle" height="377px" width="271px" file="ed10164.JPG" alt="ed10164.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;&lt;br/&gt;wherein the content of water is greater than 0 % (w/w) and ≤ 4.0 % (w/w); &lt;br/&gt;• to a method of preparing said crystalline Hydrate 1 Modification A form of said compound of formula (A) and to intermediate compounds used in said method; &lt;br/&gt;• to pharmaceutical compositions and combinations comprising said crystalline Hydrate 1 Modification A form of said compound of formula (A); and &lt;br/&gt;• to said crystalline Hydrate 1 Modification A form of the compound of formula (A), and to pharmaceutical compositions or combinations comprising same for use in the treatment or prevention of a cancer, such as lung cancer, particularly non-small cell lung carcinoma.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1834" publication-number="202611707"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611707.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611707</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132612</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>推測屏障</chinese-title>  
        <english-title>SPECULATION BARRIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251103B">G06F9/38</main-classification>  
        <further-classification edition="201801120251103B">G06F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費爾南德斯盧比奧　亞伯拉罕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERNANDEZ RUBIO, ABRAHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維拉鮑西利　荷西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VILA BAUSILI, JOSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設備包含經組態以執行資料處理之處理電路系統及經組態以解碼指令以控制該處理電路系統執行該資料處理之指令解碼電路系統。該指令解碼電路系統回應於具有取決於一條件之一指令結果之一條件指令之一推測屏障變體，而控制該處理電路系統：在該條件尚未解決時，施加一推測屏障要求，以限制依程式次序在該條件指令之該推測屏障變體之後出現之一後續操作之推測處置，且回應於該條件之解決，而放寬由該條件指令之該推測屏障變體施加之該推測屏障要求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus comprises processing circuitry configured to perform data processing and instruction decoding circuitry configured to decode instructions to control the processing circuitry to perform the data processing. The instruction decoding circuitry is responsive to a speculation barrier variant of a conditional instruction having an instruction outcome depending on a condition, to control the processing circuitry to: while the condition is not yet resolved, impose a speculation barrier requirement to restrict speculative handling of a subsequent operation appearing in program order after the speculation barrier variant of the conditional instruction, and in response to resolution of the condition, relax the speculation barrier requirement imposed by the speculation barrier variant of the conditional instruction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:步驟</p>  
        <p type="p">302:步驟</p>  
        <p type="p">304:步驟</p>  
        <p type="p">306:步驟</p>  
        <p type="p">308:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1835" publication-number="202612290"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612290.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612290</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132619</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於調變頻寬及功率回退而操作功率管理電路</chinese-title>  
        <english-title>OPERATING A POWER MANAGEMENT CIRCUIT BASED ON MODULATION BANDWIDTH AND POWER BACKOFF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251201B">H04B1/40</main-classification>  
        <further-classification edition="200601120251201B">H04B1/16</further-classification>  
        <further-classification edition="200601120251201B">H04B1/04</further-classification>  
        <further-classification edition="200601120251201B">H03F3/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＱＯＲＶＯ美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QORVO US, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫拉特　納迪姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHLAT, NADIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷茲　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RETZ, JAMES M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供基於調變頻寬及功率回退而操作一功率管理電路。該功率管理電路包括：一收發器電路；一功率管理積體電路(PMIC)；及一功率放大器電路，其經組態以放大一射頻(RF)訊號以供在一無線裝置中傳輸。在本文中，該功率管理電路可經組態在由該RF訊號之調變頻寬及該功率放大器電路之功率回退所界定的不同操作條件下操作。該收發器電路經組態以基於該等不同操作條件而調適該PMIC及/或該功率放大器電路的組態及/或控制策略。因此，有可能提高該功率管理電路在該等不同操作條件下的功率附加效率(PAE)、線性度及/或雜訊容忍度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Operating a power management circuit based on modulation bandwidth and power backoff is provided. The power management circuit includes a transceiver circuit, a power management integrated circuit (PMIC), and a power amplifier circuit that are configured to amplify a radio frequency (RF) signal for transmission in a wireless device. Herein, the power management circuit can be configured to operate under different operating conditions that are defined by modulation bandwidth of the RF signal and power backoff of the power amplifier circuit. The transceiver circuit is configured to adapt configurations and/or controls for the PMIC and/or the power amplifier circuit based on the different operating conditions. As a result, it is possible to improve power added efficiency (PAE), linearity, and/or noise tolerance in the power management circuit under the different operating conditions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:功率管理電路</p>  
        <p type="p">12:收發器電路</p>  
        <p type="p">14:功率管理積體電路(PMIC)</p>  
        <p type="p">16:功率放大器電路</p>  
        <p type="p">18:射頻(RF)訊號</p>  
        <p type="p">20:第一功率放大器</p>  
        <p type="p">22:第二功率放大器</p>  
        <p type="p">24:阻抗調變電路</p>  
        <p type="p">26、28:輸出</p>  
        <p type="p">30:負載調變訊號</p>  
        <p type="p">31:負載電路</p>  
        <p type="p">38:控制電路</p>  
        <p type="p">40:峰值偵測器</p>  
        <p type="p">42:移相器</p>  
        <p type="p">44:偏壓訊號</p>  
        <p type="p">46:電流產生電路</p>  
        <p type="p">48:電壓放大器</p>  
        <p type="p">50:多級電壓轉換器(MCP)</p>  
        <p type="p">52:功率電感器</p>  
        <p type="p">54:控制訊號</p>  
        <p type="p">C&lt;sub&gt;OFF&lt;/sub&gt;:偏移電容器</p>  
        <p type="p">I&lt;sub&gt;DC&lt;/sub&gt;:低頻電流</p>  
        <p type="p">I&lt;sub&gt;負載&lt;/sub&gt;:負載電流</p>  
        <p type="p">LUT-1:第一查找表</p>  
        <p type="p">LUT-2:第二查找表</p>  
        <p type="p">LUT-3:第三查詢表</p>  
        <p type="p">P&lt;sub&gt;輸出&lt;/sub&gt;:時變輸出功率</p>  
        <p type="p">V&lt;sub&gt;CC&lt;/sub&gt;:供電電壓</p>  
        <p type="p">V&lt;sub&gt;AMP&lt;/sub&gt;:初始供電電壓</p>  
        <p type="p">V&lt;sub&gt;BAT&lt;/sub&gt;:電池電壓</p>  
        <p type="p">V&lt;sub&gt;SUP&lt;/sub&gt;:偏壓電壓</p>  
        <p type="p">V&lt;sub&gt;TGT&lt;/sub&gt;:目標電壓</p>  
        <p type="p">Z&lt;sub&gt;輸入&lt;/sub&gt;、Z&lt;sub&gt;L&lt;/sub&gt;:負載阻抗</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1836" publication-number="202610616"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610616.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610616</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132734</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調節皮脂產生的外用組合物</chinese-title>  
        <english-title>TOPICAL COMPOSITIONS FOR REGULATING SEBUM PRODUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">A61K8/9794</main-classification>  
        <further-classification edition="201701120251201B">A61K8/9711</further-classification>  
        <further-classification edition="200601120251201B">A61K8/35</further-classification>  
        <further-classification edition="200601120251201B">A61Q19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＥＬＣ管理公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELC MANAGEMENT LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史塔法　科洛德貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAFA, KLODJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范倩文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, QIANWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫瑞斯　凱爾希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORRIS, KELSEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周奐君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, HUANJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬莫內　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAMMONE, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派諾帝　奈丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERNODET, NADINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">包含鋸葉棕(鋸棕櫚)果實提取物、糖海帶(褐藻)提取物和脹果甘草根提取物的組合物可有效抑制5-α還原酶的活性；降低中性脂質含量；幷减少人皮脂腺細胞中SREBP1、FASN和ACACA的表達。通過調節過量的皮脂産生，本發明的組合物可用于改善皮膚健康和外觀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Compositions comprising &lt;i&gt;Serenoa serrulata&lt;/i&gt; (saw palmetto) fruit extract, &lt;i&gt;Laminaria&lt;/i&gt;&lt;i&gt; saccharina&lt;/i&gt; (brown algae) extract, and &lt;i&gt;Glycyrrhiza inflata&lt;/i&gt; root extract are effective inhibit the activity of 5-alpha Reductase; lower neutral lipid content; and reduce expression of SREBP1, FASN and ACACA, in human sebocytes. By regulating excess sebum production, compositions of the invention are useful to improve the health and appearance of skin.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1837" publication-number="202611441"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611441.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611441</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132761</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體除濕裝置及其除濕方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEHUMIDIFYING DEVICE AND DEHUMIDIFYING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251104B">F24F3/14</main-classification>  
        <further-classification edition="200601120251104B">F24F13/22</further-classification>  
        <further-classification edition="200601120251104B">B01D53/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英華達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC APPLIANCES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉國棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, GUO-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體除濕裝置及其除濕方法，其中，半導體除濕裝置包括：殼體、位於殼體內的半導體冷熱片；冷熱片將殼體的內部空間分為相互連通的冷凝室和散熱室，冷熱片的冷面位於冷凝室，熱面位於散熱室；冷凝室具有一第一流通口，散熱室具有一第二流通口，冷凝室和散熱室透過一第三流通口相互連通；其中，沿第一流通口向第三流通口的方向，冷凝室內具有多個可調節彎折角度的凝露網，以調節空氣經過凝露網的凝露效率。本發明能夠提高空氣中水汽的冷凝效率，提高半導體除濕裝置的除濕效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a semiconductor dehumidifying device and a dehumidifying method thereof, wherein the semiconductor dehumidifying device comprises: a housing and a semiconductor thermoelectric module disposed within the housing; the thermoelectric module divides the internal space of the housing into a condensation chamber and a heat dissipation chamber that are in fluid communication with each other, with the cold side of the thermoelectric module located in the condensation chamber and the hot side located in the heat dissipation chamber; the condensation chamber has a first flow port, and the heat dissipation chamber has a second flow port, with the condensation chamber and the heat dissipation chamber being in communication through a third flow port; wherein, along the direction from the first flow port to the third flow port, the condensation chamber is provided with a plurality of dew-collecting meshes with adjustable bending angles to regulate the condensation efficiency of air passing through the dew-collecting meshes. The present invention can improve the condensation efficiency of moisture in the air and enhance the dehumidifying efficiency of the semiconductor dehumidifying device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:殼體</p>  
        <p type="p">20:半導體冷熱片</p>  
        <p type="p">21:冷面</p>  
        <p type="p">22:熱面</p>  
        <p type="p">30:冷凝室</p>  
        <p type="p">31:凝露網</p>  
        <p type="p">40:散熱室</p>  
        <p type="p">41:散熱網</p>  
        <p type="p">53:風門軸</p>  
        <p type="p">54:風門電機</p>  
        <p type="p">61:第一導風扇</p>  
        <p type="p">62:第二導風扇</p>  
        <p type="p">63:第三導風扇</p>  
        <p type="p">71:儲水盒</p>  
        <p type="p">80:霧化器</p>  
        <p type="p">91:第一溫濕度傳感器</p>  
        <p type="p">92:第二溫濕度傳感器</p>  
        <p type="p">93:主板</p>  
        <p type="p">94:顯示器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1838" publication-number="202611484"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611484.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611484</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132764</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>油位準警報感測器及其使用方法</chinese-title>  
        <english-title>OIL LEVEL ALARM SENSOR AND METHOD OF USING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01F23/18</main-classification>  
        <further-classification edition="202201120251201B">G01F23/26</further-classification>  
        <further-classification edition="200601120251201B">G01F23/02</further-classification>  
        <further-classification edition="200601120251201B">G01F23/16</further-classification>  
        <further-classification edition="200601120251201B">G01F23/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商ＩＦＤ科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IFD TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范霍恩　傑瑞米　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN HORN, JEREMY MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　彥佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEN-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗雷澤　約翰　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRASER, JOHN DUNCAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施耐德　馬休　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHNEIDER, MATHIEU GARRET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威爾比　傑森　Ｐ　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILBEE, JASON PETER DOUGLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖林　班傑明　Ｄ　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TULINE, BENJAMIN DONALD CORMAC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭德克　詹姆斯　Ｔ　Ｉ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANDECKER, JAMES THOMAS ISAAC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉默　科堤斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAMMER, KURTIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聖古塔　亞曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENGUPTA, ARMAAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅哈斯　卡洛斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROJAS, CARLOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫阿扎米古達齊　海珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOAZAMIGOODARZI, HOSEIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">數種設備及方法用於判定殼體內含流體是否正在洩漏。提供一種用於判定殼體內之測定流體位準的位準感測器。提供一種參考感測器用於判定可用來提供殼體內之預測流體位準的一參考參數。比較該測定流體位準與該預測流體位準以判定流體是否可能正在從殼體洩漏。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus and methods for determining if fluid contained within a housing is leaking. A level sensor is provided for determining a measured level of fluid within the housing. A reference sensor is provided for determining a reference parameter that can be used to provide a predicted level of fluid within the housing. The measured level of fluid is compared with the predicted level of fluid to determine if it is likely fluid is leaking from the housing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:設備</p>  
        <p type="p">12:殼體</p>  
        <p type="p">14:流體</p>  
        <p type="p">16A,16B,16C:流體位準</p>  
        <p type="p">18:頂部空間</p>  
        <p type="p">20:垂直方向</p>  
        <p type="p">50:垂直延伸陣列</p>  
        <p type="p">52A,52B,52C,52D,52E,52F,52G,52H,52I,52J,52K,52L,52M,52N:感測器</p>  
        <p type="p">60:參考感測器</p>  
        <p type="p">62A,62B:預測位準</p>  
        <p type="p">80:機上處理器</p>  
        <p type="p">85:機上通訊模組</p>  
        <p type="p">90:訊號產生單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1839" publication-number="202611670"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611670.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611670</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132768</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伺服器電腦中之電力供應單元</chinese-title>  
        <english-title>POWER SUPPLY UNITS IN SERVER COMPUTERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F1/16</main-classification>  
        <further-classification edition="200601120251201B">G06F1/26</further-classification>  
        <further-classification edition="200601120251201B">H05K7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美超微電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUPER MICRO COMPUTER,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳禎傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林世斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案係針對一種使用多個電力供應信號之電子系統。該電子系統包括用於接收一第一電力供應信號之一第一電力介面、用於接收一第二電力供應信號之一第二電力介面、一電力轉換器及一控制器。該電力轉換器經組態以基於該第一電力供應信號及該第二電力供應信號中之至少一者而產生複數個DC電力供應。該控制器經組態以控制該第一電力介面及該第二電力介面且選擇該第一電力供應信號及該第二電力供應信號中之該至少一者以產生該複數個DC電力供應。該第一及該第二電力介面中之各者可具有一電力開關且經控制以向該電力轉換器提供各別電力供應信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application is directed to an electronic system that uses multiple power supply signals. The electronic system includes a first power interface for receiving a first power supply signal, a second power interface for receiving a second power supply signal, a power converter, and a controller. The power converter is configured to generate a plurality of DC power supplies based on at least one of the first power supply signal and the second power supply signal. The controller is configured to control the first power interface and the second power interface and select the at least one of the first power supply signal and the second power supply signal to generate the plurality of DC power supplies. Each of the first and second power interfaces may have a power switch and be controlled to provide a respective power supply signal to the power converter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">216:電力供應單元</p>  
        <p type="p">218:電源管理積體電路</p>  
        <p type="p">250:DC電力供應</p>  
        <p type="p">250-1:第一DC電力供應</p>  
        <p type="p">250-2:第二DC電力供應</p>  
        <p type="p">260A:AC電力供應信號</p>  
        <p type="p">260A1:AC電力供應信號，第一電力供應信號</p>  
        <p type="p">260A2:AC電力供應信號，第二電力供應信號</p>  
        <p type="p">302:電力介面</p>  
        <p type="p">302A:第一電力介面</p>  
        <p type="p">302B:第二電力介面</p>  
        <p type="p">302C:第三電力介面</p>  
        <p type="p">302N:第N電力介面</p>  
        <p type="p">304:電力轉換器</p>  
        <p type="p">306:控制器</p>  
        <p type="p">308:傳入處理器請求</p>  
        <p type="p">310-1:第一輸入控制信號</p>  
        <p type="p">310-2:第二輸入控制信號</p>  
        <p type="p">320:外部電源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1840" publication-number="202610801"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610801.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610801</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132778</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>射出成型系統及射出成型方法</chinese-title>  
        <english-title>INJECTION MOLDING SYSTEM AND INJECTION MOLDING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250903B">B29C45/24</main-classification>  
        <further-classification edition="200601120250903B">B29C45/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅鋼機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING STEEL MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳璟浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉良輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, LIANG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種射出成型系統。混合單元配置以將可流動之聚合材料與發泡劑混合以形成混合物。流體供應單元配置以將發泡劑提供至混合單元。流體供應單元包含耦接至混合單元之注射出口、配置以產生發泡劑之壓縮機、設置於注射出口與壓縮機之間且配置以經由第一通道接收來自壓縮機之發泡劑之注射閥、以及配置以清潔注射閥之清潔機構。清潔機構包含經由第二通道耦接至壓縮機且經由連接至第一通道之第三通道耦接至注射閥之控制閥、以及配置以致動控制閥之致動裝置。經由控制閥，發泡劑可流動至注射閥。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An injection molding system is provided. A mixing unit is configured to mix a flowable polymeric material with a blowing agent to form a mixture. A fluid supply unit is configured to provide the blowing agent to the mixing unit. The fluid supply unit includes an injection outlet coupled to the mixing unit, a compressor configured to generate the blowing agent, an injection valve disposed between the injection outlet and the compressor and configured to receive the blowing agent from the compressor through a first passage, and a cleaning mechanism configured to clean the injection valve. The cleaning mechanism includes a control valve coupled to the compressor through a second passage and coupled to the injection valve through a third passage connected to the first passage, and an actuating device configured to actuate the control valve. The blowing agent is flowable to the injection valve through the control valve.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:流體供應單元</p>  
        <p type="p">106:第一氣體源</p>  
        <p type="p">107:第二氣體源</p>  
        <p type="p">108:壓縮機</p>  
        <p type="p">109:注射出口</p>  
        <p type="p">110:注射閥</p>  
        <p type="p">111:控制閥</p>  
        <p type="p">112:致動裝置</p>  
        <p type="p">113:第三通道</p>  
        <p type="p">113a:子通道</p>  
        <p type="p">113b:子通道</p>  
        <p type="p">115:計量單元</p>  
        <p type="p">116:第二單向閥</p>  
        <p type="p">117:第一單向閥</p>  
        <p type="p">118:第一通道</p>  
        <p type="p">118a:子通道</p>  
        <p type="p">118b:子通道</p>  
        <p type="p">118c:子通道</p>  
        <p type="p">119:第二通道</p>  
        <p type="p">200:清潔機構</p>  
        <p type="p">250:監測裝置</p>  
        <p type="p">260:感測器</p>  
        <p type="p">Ctrl:訊號</p>  
        <p type="p">G1:氣體</p>  
        <p type="p">G2:氣體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1841" publication-number="202611434"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611434.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611434</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132788</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>照明器具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251124B">F21V23/06</main-classification>  
        <further-classification edition="200601120251124B">F21V21/03</further-classification>  
        <further-classification edition="201501120251124B">F21V3/00</further-classification>  
        <further-classification edition="200601120251124B">F21S8/04</further-classification>  
        <further-classification edition="200601120251124B">G02F1/13357</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>外村楓夏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOTOMURA, FUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山岡裕幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAOKA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北出眞人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITADE, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">照明器具(1)具備：金屬製的本體(10)、相對於本體(10)靜止並且搭載有發光部之基板(80)、及覆蓋基板(80)的內側蓋(20)，本體(10)及內側蓋(20)係從高度方向觀看時於大致相同的位置具有孔。照明器具(1)具備：螺絲(56)，其包含被收納於內側蓋(20)的孔中之第1收納部、及被收納於本體(10)的孔中的第2收納部；供電零件，固定於建築物並且被用於從外部進行供電；接地線，與接地的金屬零件電性連接。接地線係經由螺絲(56)而與本體(10)電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:照明器具</p>  
        <p type="p">10:本體</p>  
        <p type="p">13:圓環狀的凹陷</p>  
        <p type="p">15:本體的筒狀部</p>  
        <p type="p">16:本體的筒狀部的螺絲孔</p>  
        <p type="p">20:內側蓋</p>  
        <p type="p">52:蓋</p>  
        <p type="p">53:安裝台</p>  
        <p type="p">54:間隔件</p>  
        <p type="p">55:壓接端子</p>  
        <p type="p">55a:壓接端子的圓環狀部</p>  
        <p type="p">56:螺絲</p>  
        <p type="p">56a:螺絲的軸部</p>  
        <p type="p">56b:螺絲的頭部</p>  
        <p type="p">57:墊圈</p>  
        <p type="p">73:蓋的平板部的貫通孔</p>  
        <p type="p">75:安裝台的筒狀部</p>  
        <p type="p">75a:安裝台的筒狀部的圓筒孔</p>  
        <p type="p">80:基板</p>  
        <p type="p">80b:基板的貫通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1842" publication-number="202611339"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611339.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611339</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132821</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電鍍裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">C25D17/00</main-classification>  
        <further-classification edition="200601120251001B">C25D17/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈照偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, ZHAOWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宏超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HONGCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>刁建華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIAO, JIANHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖炎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種用於襯底的電鍍裝置，所述襯底包括電鍍區域，所述電鍍區域包括中心區域與和包圍所述中心區域的邊緣區域，包括：襯底支架，用於保持並旋轉所述襯底；邊緣板，連接於所述襯底支架的下方；其中，所述邊緣板包括環形的遮擋部，所述電鍍區域的一圈邊緣落入所述遮擋部在所述襯底上的投影範圍內，所述遮擋部在所述襯底上的投影範圍由外向內逐漸減小以使所述遮擋部對所述邊緣區域的電場屏蔽強度由外向內逐漸減小，導致作用於邊緣區域的電流密度與作用於中心區域的電流密度均勻，從而使邊緣區域與中心區域的鍍膜厚度均勻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電鍍腔</p>  
        <p type="p">2:襯底支架</p>  
        <p type="p">21:箭頭</p>  
        <p type="p">22:中心軸</p>  
        <p type="p">3:邊緣板</p>  
        <p type="p">4:間隙</p>  
        <p type="p">50:正面</p>  
        <p type="p">51:背面</p>  
        <p type="p">52:邊緣區域</p>  
        <p type="p">53:中心區域</p>  
        <p type="p">54:外邊緣</p>  
        <p type="p">6:連接件</p>  
        <p type="p">B、C:箭頭</p>  
        <p type="p">L:電鍍液</p>  
        <p type="p">O:襯底中心</p>  
        <p type="p">W:襯底</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1843" publication-number="202612069"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612069.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612069</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132827</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藥液循環系統及濕法設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01L21/67</main-classification>  
        <further-classification edition="200601120251205B">H01L21/306</further-classification>  
        <further-classification edition="200601120251205B">B08B3/02</further-classification>  
        <further-classification edition="200601120251205B">B08B3/04</further-classification>  
        <further-classification edition="200601120251205B">B01D35/00</further-classification>  
        <further-classification edition="200601120251205B">F04F5/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳澤輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZEHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫鰲飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, AOFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUNKAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種藥液循環系統及濕法設備，藥液循環系統包括噴嘴、儲液槽、供液管路以及氣體吹掃組件，噴嘴用於向基板供應藥液；儲液槽用於儲存藥液；供液管路連接儲液槽的出液口和噴嘴；氣體吹掃組件包括吹掃管路和調節元件，吹掃管路與供液管路連接，調節元件設置於吹掃管路上，用於調節吹掃管路中的氣體的輸出氣壓；藥液循環系統被配置為：當需要排空供液管路中的藥液時，吹掃管路中的氣體以第一預定輸出氣壓將供液管路中位於氣體吹掃組件和噴嘴之間的藥液從噴嘴吹出。本申請有利於將供液管路中的殘液排乾淨。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:噴嘴</p>  
        <p type="p">20:儲液槽</p>  
        <p type="p">21:槽底</p>  
        <p type="p">30:供液管路</p>  
        <p type="p">31:內循環管路</p>  
        <p type="p">32:內循環開關閥</p>  
        <p type="p">34:供液開關閥</p>  
        <p type="p">40:氣體吹掃組件</p>  
        <p type="p">41:吹掃管路</p>  
        <p type="p">43:調節元件</p>  
        <p type="p">431:電氣比例閥</p>  
        <p type="p">432:手動閥</p>  
        <p type="p">45:單向閥</p>  
        <p type="p">47:氣體開關閥</p>  
        <p type="p">50:接液杯</p>  
        <p type="p">60:抽吸組件</p>  
        <p type="p">61:抽吸管路</p>  
        <p type="p">63:虹吸閥</p>  
        <p type="p">631:吸入口</p>  
        <p type="p">632:出口</p>  
        <p type="p">633:流體入口</p>  
        <p type="p">65:流體管路</p>  
        <p type="p">67:抽吸開關閥</p>  
        <p type="p">69:流體開關閥</p>  
        <p type="p">71:過濾器</p>  
        <p type="p">73:排放管路</p>  
        <p type="p">75:排放開關閥</p>  
        <p type="p">81:排液管路</p>  
        <p type="p">83:氣動泵</p>  
        <p type="p">85:排液開關閥</p>  
        <p type="p">90:控制閥</p>  
        <p type="p">100:藥液循環系統</p>  
        <p type="p">200:腔室</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1844" publication-number="202611191"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611191.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611191</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132839</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學薄膜及影像顯示裝置</chinese-title>  
        <english-title>OPTICAL FILM AND IMAGE DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C08J5/22</main-classification>  
        <further-classification edition="200601120251211B">C08G73/10</further-classification>  
        <further-classification edition="200601120251211B">C07C69/82</further-classification>  
        <further-classification edition="201501120251211B">G02B1/14</further-classification>  
        <further-classification edition="200601120251211B">B32B27/28</further-classification>  
        <further-classification edition="201901120251211B">B32B7/022</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版巴川光學薄膜股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN TOMOEGAWA OPTICAL FILMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤駿一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, SHUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上壘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大畑浩一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHATA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學薄膜，其係於厚度10μm以上100μm以下的樹脂基材之一側的面，依序具備硬塗層與低折射率層，且硬塗層的厚度為2.0μm以上7.0μm以下之光學薄膜，其中拉伸率為3.0%以上30.0%以下，以低折射率層在內側的方式捲繞而不產生裂痕之圓柱的最小直徑為1.0mm以下，以低折射率層在外側的方式捲繞而不產生裂痕之圓柱的最小直徑為6.0mm以下，使橡皮擦以荷重1.0kg/6.0mmΦ於低折射率層表面滑動5000次之後的水接觸角變化率係20%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:樹脂基材</p>  
        <p type="p">2:硬塗層</p>  
        <p type="p">3:低折射率層</p>  
        <p type="p">4:易接著層</p>  
        <p type="p">20:光學薄膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1845" publication-number="202610802"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610802.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610802</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中空成型品成型方法及此方法中所用延伸桿及射出延伸吹氣成型機</chinese-title>  
        <english-title>METHOD FOR MOLDING HOLLOW MOLDED ARTICLE, AND STRETCHING ROD AND INJECTION STRETCH BLOW MOLDING MACHINE USED IN THE METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250915B">B29C49/06</main-classification>  
        <further-classification edition="200601120250915B">B29C49/12</further-classification>  
        <further-classification edition="200601120250915B">B29C49/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商青木固研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI TECHNICAL LABORATORY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹內秀樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEUCHI, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下形隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOGATA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酒井理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可抑制預形體的變形且可縮短中空成型品的成型週期的中空成型品成型方法及在該方法中使用的一種延伸桿及一種射出延伸吹氣成型機。中空成型品成型方法包含：射出成型預形體的射出成型製程；及吹氣成型製程，藉由在吹氣成型區中拉伸吹氣成型預形體獲得中空成型品。吹氣成型製程包含：預形體支撐步驟，將延伸桿的遠端部插入預形體內且使遠端部與預形體產生接觸，從而支撐預形體；及預形體分離步驟，將吹入空氣供給至預形體內，以釋放預形體與遠端部之間的接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for molding a hollow molded article, which can suppress deformation of a preform and shorten a molding cycle of the hollow molded article, and a stretching rod and an injection stretch blow molding machine used in the method are provided. The method for molding a hollow molded article, includes: an injection molding process of injection molding a preform; and a blow molding process of obtaining a hollow molded article by stretch blow molding the preform in a blow molding section. The blow molding process includes a preform supporting step of inserting a distal end portion of a stretching rod into the preform and bringing the distal end portion into contact with the preform to support the preform, and a preform separation step of supplying blow air into the preform to release the contact between the preform and the distal end portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1、S2、S7、S8、S9、S10、S11、S12:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1846" publication-number="202611761"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611761.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611761</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132871</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有主動暫存器庫的金鑰庫</chinese-title>  
        <english-title>KEY VAULTS WITH ACTIVE REGISTER BANKS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251118B">G06F21/45</main-classification>  
        <further-classification edition="201301120251118B">G06F21/77</further-classification>  
        <further-classification edition="201301120251118B">G06F21/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫爾圖瓦　尼可拉斯薩迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COURTOIS, NICOLAS THADDEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾米爾　費德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMIEL, FREDERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波蘇艾菲　丹尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POCHUEV, DENIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩林　傑羅姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERRINE, JEROME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於安全運算的系統及技術。例如，一種程序可包括產生一主私鑰；產生一組第一虛置值；將該主私鑰分成一第一組份額，其中該第一組份額的份額的一總和等於該主私鑰的一值；用一整數模數加法序列來起始一主動記憶體庫的部分，其中該整數模數加法包含：遮罩該主私鑰的該第一組份額；及使用一加法序列將該主私鑰的該經遮罩第一組份額加至該主動記憶體庫的部分，該加法序列將該主私鑰的該經遮罩第一組份額與虛置值相加及混合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and techniques are provided for secure computing. For instances, a process can include generating a master private key; generating a set of first dummy values; dividing the master private key into a first set of shares, wherein a sum of shares of the first set of shares equals a value of the master private key; initiating portions of an active memory bank with a sequence of integer modular additions, wherein the integer modular additions comprise: masking the first set of shares of the master private key; and adding the masked first set of shares of the master private key to portions of the active memory bank using a sequence of adds that adds and mixes the masked first set of shares of the master private key with dummy values.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統單晶片(SoC)</p>  
        <p type="p">102:中央處理單元(CPU)；CPU</p>  
        <p type="p">104:圖形處理單元(GPU)；GPU</p>  
        <p type="p">106:數位信號處理器(DSP)</p>  
        <p type="p">108:神經處理單元(NPU)</p>  
        <p type="p">110:連接性區塊</p>  
        <p type="p">112:多媒體處理器</p>  
        <p type="p">114:感測器處理器</p>  
        <p type="p">116:影像信號處理器(ISP)</p>  
        <p type="p">118:記憶體區塊</p>  
        <p type="p">120:安全硬體模組</p>  
        <p type="p">122:主動暫存器庫</p>  
        <p type="p">124:金鑰管理模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1847" publication-number="202612070"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612070.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612070</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132877</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板升降機構及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01L21/67</main-classification>  
        <further-classification edition="200601120251001B">H01L21/683</further-classification>  
        <further-classification edition="200601120251001B">H01L21/687</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛帷半導體設備（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH (LINGANG), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李亞洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈社娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, SHENA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種基板升降機構及基板處理裝置。該基板升降機構包括：固定板，具有相對設置的第一側面和第二側面；第一支撐組件，可升降設置於第一側面，用於支撐和帶動基板升降；第二支撐元件，可升降設置於第一側面，用於支撐和帶動基板升降，且第一支撐元件和第二支撐元件被構造為具有同一對稱面；驅動元件，用於驅動第二支撐元件升降；第一連杆元件，設置於第二側面，第一連杆元件包括第一鉸接軸和第二鉸接軸，第一鉸接軸與第二支撐元件鉸接連接，第二鉸接軸與第一支撐元件鉸接連接；導滑板，設置於第二側面，與第一連杆元件相配合。本申請提升了基板升降機構的可靠性，降低基板掉落的風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:基板升降機構</p>  
        <p type="p">111:固定板</p>  
        <p type="p">1111:第一側面</p>  
        <p type="p">112:第一支撐元件</p>  
        <p type="p">1121:第一滑塊</p>  
        <p type="p">1122:第一支架</p>  
        <p type="p">1125:第一支架主體</p>  
        <p type="p">1126:第一齒槽</p>  
        <p type="p">113:第二支撐元件</p>  
        <p type="p">1131:第二滑塊</p>  
        <p type="p">1132:第二支架</p>  
        <p type="p">1134:第二支架主體</p>  
        <p type="p">114:驅動元件</p>  
        <p type="p">117:連接元件</p>  
        <p type="p">1171:銷釘</p>  
        <p type="p">1172:驅動器</p>  
        <p type="p">1173:插孔</p>  
        <p type="p">1174:凸塊</p>  
        <p type="p">119:限位柱</p>  
        <p type="p">1191:固定部</p>  
        <p type="p">1192:緩衝部</p>  
        <p type="p">20:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1848" publication-number="202610728"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610728.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610728</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132879</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加熱機構及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251008B">B05B12/18</main-classification>  
        <further-classification edition="200601120251008B">B08B3/10</further-classification>  
        <further-classification edition="200601120251008B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉鼎新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, DINGXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樊昌昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, CHANGHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何西登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, XIDENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種加熱機構及基板處理裝置，加熱機構包括加熱盤元件和至少兩根管道，加熱盤元件內部開設有至少兩個沿徑向方向間隔設置的流道空腔；加熱盤組件的頂部開設有至少兩組流體流出孔，加熱盤組件的底部設有至少兩個管道連介面，每根管道的輸入端用於連接熱流體輸送管，每根管道的輸出端連接於對應設置的管道連介面。本申請中的加熱機構中加熱盤元件的厚度減小，增大加熱盤元件上表面和基板下表面之間的距離，使得從加熱盤元件頂部噴出的流體能夠及時排出，防止基板泡在加熱盤組件噴出的流體裡；將不同的管道直接插入其對應的管道連介面，能夠避免通入不同的流道空腔的流體之間的串流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:加熱盤元件</p>  
        <p type="p">113:管道連介面</p>  
        <p type="p">1131:管道接頭</p>  
        <p type="p">114:上層加熱盤</p>  
        <p type="p">115:下層加熱盤</p>  
        <p type="p">1152:第二連接孔</p>  
        <p type="p">13:安裝軸</p>  
        <p type="p">131:貫穿孔</p>  
        <p type="p">132:安裝部</p>  
        <p type="p">134:第二連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1849" publication-number="202610580"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610580.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610580</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132922</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>殼體組件、清潔設備和清潔系統</chinese-title>  
        <english-title>SHELL COMPONENT, CLEANING EQUIPMENT, AND CLEANING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251016B">A47L11/40</main-classification>  
        <further-classification edition="200601120251016B">A47L11/24</further-classification>  
        <further-classification edition="200601120251016B">A47L11/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐洪亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, HONGLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種殼體組件、清潔設備和清潔系統。其中，殼體組件包括：基體和蓋體元件，基體設置有用於容納發熱元件的第一容納倉，蓋體元件包括蓋體和第一導熱件，蓋體可打開或閉合第一容納倉，第一導熱件穿設於蓋體，第一導熱件的兩端分別位於第一容納倉的內部和外部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a shell component, cleaning equipment, and a cleaning system. The shell component includes: a base and a cover element, where the base is equipped with a first receiving chamber for accommodating a heating element. The cover element includes a cover and a first heat conduction member, which can open or close the first receiving chamber. The first heat conduction member is penetrated through the cover, with both ends of the first heat conduction member located inside and outside the first receiving chamber, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:殼體組件</p>  
        <p type="p">110:基體</p>  
        <p type="p">113:清潔倉</p>  
        <p type="p">120:蓋體組件</p>  
        <p type="p">121:蓋體</p>  
        <p type="p">122:第一導熱件</p>  
        <p type="p">130:底殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1850" publication-number="202611497"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611497.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611497</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132940</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>粒徑分佈測定裝置、粒徑分佈測定方法及攝像部的配置方法</chinese-title>  
        <english-title>PARTICLE SIZE DISTRIBUTION MEASURING DEVICE, PARTICLE SIZE DISTRIBUTION MEASURING METHOD, AND PHOTOGRAPHING UNIT ARRANGING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251205B">G01N15/0205</main-classification>  
        <further-classification edition="200601120251205B">G01N21/47</further-classification>  
        <further-classification edition="200601120251205B">G02B21/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商堀場製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIBA, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立脇康弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATEWAKI, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>箕輪大輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINOWA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, TAKERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博農　安德森　傑蘇斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONON, ANDERSON JESUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為了提供一種可在不對檢測器所進行的繞射光及/或散射光的檢測造成影響的情況下由相互不同的第一攝像部51及第二攝像部52對池2內的試樣進行拍攝的粒徑分佈測定裝置，使池2的攝像面的法線N與第一攝像部51的攝像軸C1所呈的角度和池2的攝像面的法線N與第二攝像部52的攝像軸C2所呈的角度不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To provide a particle size distribution measuring device that can photograph a sample in a cell 2 by using a first photographing unit 51 and a second photographing unit 52 different from each other without affecting the detection of diffracted light and/or scattered light performed by a detector, the angle defined between the normal N of the photographing surface of the cell 2 and the photographing axis C1 of the first photographing unit 51 and the angle defined between the normal N of the photographing surface of the cell 2 and the photographing axis C2 of the second photographing unit 52 are different.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:池</p>  
        <p type="p">3:光照射部</p>  
        <p type="p">4:檢測器</p>  
        <p type="p">6:控制裝置</p>  
        <p type="p">8:透鏡</p>  
        <p type="p">51:第一攝像部</p>  
        <p type="p">52:第二攝像部</p>  
        <p type="p">61:粒徑分佈計算部</p>  
        <p type="p">62:圖像分析部</p>  
        <p type="p">71:第一攝像光照射部</p>  
        <p type="p">72:第二攝像光照射部</p>  
        <p type="p">100:粒徑分佈測定裝置</p>  
        <p type="p">a1:入口埠</p>  
        <p type="p">a2:出口埠</p>  
        <p type="p">B:基座</p>  
        <p type="p">S1:照射面</p>  
        <p type="p">S2:射出面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1851" publication-number="202611869"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611869.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611869</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>將動畫資料映射至用於擴展實境（ＸＲ）媒體通訊對話的化身格式</chinese-title>  
        <english-title>MAPPING ANIMATION DATA TO AN AVATAR FORMAT FOR EXTENDED REALITY (XR) MEDIA COMMUNICATION SESSIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251201B">G06T13/40</main-classification>  
        <further-classification edition="200601120251201B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堡爾吉吉　依梅德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOUAZIZI, IMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩爾基斯　邁克爾　阿迪布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARKIS, MICHEL ADIB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史塔克漢莫　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STOCKHAMMER, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆　尼可　康德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEUNG, NIKOLAI KONRAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於傳達擴增實境(augmented reality, AR)媒體資料之實例裝置包括：一記憶體，其經組態以儲存AR媒體資料；及一處理系統，其以電路系統實施且經組態以：接收映射資訊，該映射資訊包括定義在一第一框架與一第二框架的對應輸出動畫之間的映射的資料，該第一框架定義一AR媒體通訊對話的輸入動畫，該第二框架係用以將參與該AR媒體通訊對話的一使用者的一基本化身模型動畫化；接收該使用者的一動畫串流，該動畫串流包括該等輸入動畫中之一或多者的資料；使用該映射資訊及來自該動畫串流的該等輸入動畫中之該一或多者來判定用來將該使用者的該基本化身模型動畫化的該等輸出動畫的一子集；及使用該輸出動畫的子集將該基本化身模型動畫化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example device for communicating augmented reality (AR) media data includes: a memory configured to store AR media data; and a processing system implemented in circuitry and configured to: receive mapping information including data defining mappings between a first framework defining input animations of an AR media communication session and corresponding output animations of a second framework to be used to animate a base avatar model of a user participating in the AR media communication session; receive an animation stream for the user, the animation stream including data for one or more of the input animations; determine a subset of the output animations to be used to animate the base avatar model of the user using the mapping information and the one or more of the input animations from the animation stream; and animate the base avatar model using the subset of the output animations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">380:攝影機</p>  
        <p type="p">382:特徵提取單元</p>  
        <p type="p">384:臉部特徵</p>  
        <p type="p">386:基本化身模型</p>  
        <p type="p">388:身份驗證單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1852" publication-number="202611437"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611437.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611437</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132995</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>烹調器具以及烹調設備</chinese-title>  
        <english-title>COOKING UTENSIL AND COOKING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251017B">F24C7/04</main-classification>  
        <further-classification edition="200601120251017B">F24C1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商象印股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOJIRUSHI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>椋田朋訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKUDA, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡部正好</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本玉将平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONTAMA, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤駆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, KAKERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種抑制火花的產生的烹調器具以及烹調設備。烹調器具（1）是在烹調設備中使用的烹調器具（1），所述烹調設備能夠通過從微波產生器放射的微波對烹調物進行烹調，所述烹調器具（1）具備：金屬制的托盤主體部（2）；以及絕緣部（3），其覆蓋托盤主體部（2）的至少一部分，托盤主體部（2）具有：載置部（21），其具有載置烹調物的載置面；以及凸緣部（23），其比載置部（21）向外側擴展，絕緣部（3）覆蓋凸緣部（23）的外周端面的至少一部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a cooking utensil and a cooking device capable of suppressing the generation of sparks. The cooking utensil (1) is a cooking utensil used in the cooking device (1), which cooks food using microwaves emitted from a microwave generator. The cooking utensil (1) comprises: a tray main body (2) made of metal; and an insulating portion (3) covering at least a part of the tray main body (2). The tray main body (2) includes: a placing portion (21) having a placing surface for placing food to be cooked; and a flange portion (23) extending outward beyond the placing portion (21). The insulating portion (3) covers at least a part of an outer peripheral end surface of the flange portion (23).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:托盤(烹調器具)</p>  
        <p type="p">2:托盤主體部</p>  
        <p type="p">21:載置部</p>  
        <p type="p">211:板狀部</p>  
        <p type="p">211s:主面</p>  
        <p type="p">22:周壁部</p>  
        <p type="p">23:凸緣部</p>  
        <p type="p">231:基部</p>  
        <p type="p">232:傾斜部</p>  
        <p type="p">233:翼部</p>  
        <p type="p">3:絕緣部</p>  
        <p type="p">31:第一絕緣部</p>  
        <p type="p">32:第二絕緣部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1853" publication-number="202611267"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611267.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611267</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133008</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量子點墨水組成物、其製備方法、以及包含其的固化膜、濾色器和顯示裝置</chinese-title>  
        <english-title>QUANTUM DOT INK COMPOSITION, METHOD OF PREPARING THE SAME, AND CURED FILM, COLOR FILTER AND DISPLAY DEVICE COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">C09K11/62</main-classification>  
        <further-classification edition="201401120251212B">C09D11/101</further-classification>  
        <further-classification edition="200601120251212B">C09D133/10</further-classification>  
        <further-classification edition="200601120251212B">G02F1/017</further-classification>  
        <further-classification edition="200601120251212B">G03F7/028</further-classification>  
        <further-classification edition="202301120251212B">H10K85/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商韓松化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSOL CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉敬薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIL, KYEONG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河眞荷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, JIN HA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓渼來</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, MI RAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秀眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SU JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙亞永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, AH YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵閏珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, YUN JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張璌洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, IN SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金吉蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, GIL RAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示量子點墨水組成物、製備該組成物的方法、以及包括該組成物的固化膜、濾色器和顯示裝置。量子點墨水組成物包括特別適合於AIGS量子點的配位體化合物，藉此進一步改善量子點的光學性質和穩定性。此外，製備量子點墨水組成物的方法允許以良好效率在量子點的表面上取代配位體化合物，並且可以使取代的配位體化合物更強地結合至量子點的表面以製備具有良好物理性質的量子點墨水組成物，藉此提供具有進一步改善的光學性質的高品質顯示裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a quantum dot ink composition, a method of preparing the same, and a cured film, a color filter, and a display device including the same. The quantum dot ink composition includes ligand compounds particularly suitable for AIGS quantum dots, thereby further improving optical properties and stability of the quantum dots. In addition, the method of preparing the quantum dot ink composition allows substitution of the ligand compounds on the surfaces of the quantum dots with good efficiency and can make the substituted ligand compound bind more strongly to the surfaces of the quantum dots to prepare a quantum dot ink composition with good physical properties, thereby providing a high-quality display device with further improved optical properties.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1854" publication-number="202611308"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611308.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611308</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133030</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相變金屬合金及結合圖案化金屬箔與相變金屬合金之熱介面材料總成</chinese-title>  
        <english-title>PHASE CHANGE METAL ALLOYS AND THERMAL INTERFACE MATERIAL ASSEMBLY COMBINING A PATTERNED METAL FOIL WITH A PHASE CHANGE METAL ALLOY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C22C28/00</main-classification>  
        <further-classification edition="200601120251210B">H01L23/373</further-classification>  
        <further-classification edition="200601120251210B">H01L23/367</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國銦泰公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE INDIUM CORPORATION OF AMERICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克多諾　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCDONOUGH, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈瑞特　羅伯特　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JARRETT, ROBERT N.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述相變金屬合金及其等在電子總成中作為熱介面材料之用途。在一個實施方案中，一種相變金屬合金包含：50 wt%至70 wt%的In；以下之至少一者：20 wt%至40 wt%的Bi及10 wt%至50 wt%的Sn；及大於0 wt%至5.0 wt%的Zn。該相變金屬合金亦可包含以下之一或多者：大於0 wt%至5.0 wt%的Ga；大於0 wt%至1.0 wt%的Ag；大於0 wt%至1.0 wt%的Cu；大於0 wt%至1.0 wt%的Au；大於0 wt%至0.1 wt%的Ni；及大於0 wt%至0.1 wt%的Ge。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Phase change metal alloys and their uses as thermal interface materials in electronic assemblies are described. In one implementation, a phase change metal alloy includes: 50wt% to 70wt% In; at least one of: 20wt% to 40wt% Bi and 10wt% to 50wt% Sn; and greater than 0wt% to 5.0wt% Zn. The phase change metal alloy can also include one or more of: greater than 0wt% to 5.0wt% Ga; greater than 0wt% to 1.0wt% Ag; greater than 0wt% to 1.0wt% Cu; greater than 0wt% to 1.0wt% Au; greater than 0wt% to 0.1wt% Ni; and greater than 0wt% to 0.1wt% Ge.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210:導熱金屬箔</p>  
        <p type="p">220:相變金屬合金(PCMA)</p>  
        <p type="p">230:金屬層</p>  
        <p type="p">240:發熱裝置</p>  
        <p type="p">250:取熱裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1855" publication-number="202611656"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611656.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611656</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133061</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔系統、清潔控制方法及裝置、計算機可讀儲存介質及電子設備</chinese-title>  
        <english-title>CLEANING SYSTEM, CLEANING CONTROL METHOD AND APPARATUS, COMPUTER-READABLE STORAGE MEDIUM, AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250903B">G05D1/661</main-classification>  
        <further-classification edition="202401120250903B">G05D1/646</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>单建强</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAN, JIANQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種清潔系統、清潔控制方法、清潔控制裝置、計算機可讀儲存介質及電子設備，包括：清潔機器人，所述清潔機器人包括第一容器、管路、清潔部，所述管路至少包括將所述第一容器連接到外部的管路；基站，所述基站包括第二容器；泵，所述泵具有第一工作模式和第二工作模式；其中，所述泵在第一工作模式下，驅動液體由所述第二容器流向所述第一容器；所述泵在第二工作模式下，驅動液體由所述管路流向所述第二容器。清潔系統提供了泵的不同工作模式，使清潔機器人能夠在不同場景下具有較好的清潔效果，降低了機器的維護成本和維護難度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a cleaning system, a cleaning control method, a cleaning control apparatus, a computer-readable storage medium, and an electronic device, including: a cleaning robot, the cleaning robot including a first container, a pipeline, and a cleaning part, where the pipeline at least includes a pipeline connecting the first container to the exterior; a base station, the base station including a second container; and a pump, the pump having a first working mode and a second working mode; where, in the first working mode, the pump drives liquid to flow from the second container to the first container; and in the second working mode, the pump drives liquid to flow from the pipeline to the second container. This cleaning system provides different working modes for the pump, enabling the cleaning robot to have better cleaning effects in different scenarios, and reducing the maintenance cost and difficulty of the machine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:清潔機器人</p>  
        <p type="p">111:第一容器</p>  
        <p type="p">112:管路</p>  
        <p type="p">113:清潔部</p>  
        <p type="p">120:基站</p>  
        <p type="p">130:第二容器</p>  
        <p type="p">140:泵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1856" publication-number="202612035"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612035.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612035</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133065</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251113B">H01L21/56</main-classification>  
        <further-classification edition="200601120251113B">H01L23/28</further-classification>  
        <further-classification edition="200601120251113B">C09J11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置的製造方法，包含：準備步驟，準備結構體（100），所述結構體（100）包括黏著性膜（10）、所述黏著性膜（10）的第一面（S1）側的電子零件（a）（20）、及與所述第一面（S1）相反的一側的所述黏著性膜（10）的第二面（S2）側的支撐基板（30）；以及密封步驟，利用包含填料的密封材（50）對所述電子零件（a）（20）進行密封，所述電子零件（a）（20）包括一對連接部（21）及主體部（22），且所述主體部（22）以於所述主體部（22）的下表面（U2）與所述黏著性膜（10）的所述第一面（S1）之間具有間隙的方式保持於所述一對連接部（21）之間，根據所述一對連接部（21）的下表面（U1）與所述主體部（22）的所述下表面（U2）的距離T、所述一對連接部（21）向所述黏著性膜（10）的埋入量R、及所述填料的最大直徑M而算出的（T-R）/M為1.0以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:黏著性膜</p>  
        <p type="p">20:電子零件(a)</p>  
        <p type="p">21:一對連接部</p>  
        <p type="p">22:主體部</p>  
        <p type="p">30:支撐基板</p>  
        <p type="p">50:密封材</p>  
        <p type="p">100:結構體</p>  
        <p type="p">A:基材層</p>  
        <p type="p">A1:基材層(A)的第一面</p>  
        <p type="p">A2:基材層(A)的第二面</p>  
        <p type="p">B:黏著性樹脂層</p>  
        <p type="p">C:黏著性樹脂層</p>  
        <p type="p">D:中間層</p>  
        <p type="p">S1:黏著性膜10的第一面</p>  
        <p type="p">S2:黏著性膜10的第二面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1857" publication-number="202611811"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611811.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611811</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133155</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支付系統、支付方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251210B">G06Q20/06</main-classification>  
        <further-classification edition="201201120251210B">G06Q20/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂天集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKUTEN GROUP, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂天信用卡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKUTEN CARD CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉武季槻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHITAKE, KIZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤涼奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, SUZUNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之支付系統(1)之顯示控制部(101)使受理用於指定與可由使用者終端(30)利用之支付方式之分期付款、固定限額繳款或獎金付款相關之設定的設定畫面，顯示於上述使用者終端。處理執行部(102)基於設定，執行與分期付款、固定限額繳款或獎金付款相關之處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支付伺服器</p>  
        <p type="p">20:卡片伺服器</p>  
        <p type="p">30:使用者終端</p>  
        <p type="p">40:店舖終端</p>  
        <p type="p">100:資料記憶部</p>  
        <p type="p">101:顯示控制部</p>  
        <p type="p">102:處理執行部</p>  
        <p type="p">200:資料記憶部</p>  
        <p type="p">201:處理執行部</p>  
        <p type="p">300:資料記憶部</p>  
        <p type="p">301:操作受理部</p>  
        <p type="p">302:顯示控制部</p>  
        <p type="p">400:資料記憶部</p>  
        <p type="p">401:支付請求發送部</p>  
        <p type="p">DB1:支付資料庫</p>  
        <p type="p">DB2:卡片資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1858" publication-number="202611812"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611812.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611812</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133157</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支付系統、支付方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251210B">G06Q20/06</main-classification>  
        <further-classification edition="201201120251210B">G06Q20/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂天集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKUTEN GROUP, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂天信用卡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKUTEN CARD CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉武季槻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHITAKE, KIZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤涼奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, SUZUNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之支付系統(1)之設定取得部(104)取得與使用者可利用之支付方式之分期付款、固定限額繳款或獎金付款相關之設定。處理執行部(102)基於設定，執行與分期付款、固定限額繳款或獎金付款相關之處理。設定解除部(105)基於規定解除條件，解除上述設定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支付伺服器</p>  
        <p type="p">20:卡片伺服器</p>  
        <p type="p">30:使用者終端</p>  
        <p type="p">40:店舖終端</p>  
        <p type="p">100:資料記憶部</p>  
        <p type="p">102:處理執行部</p>  
        <p type="p">104:設定取得部</p>  
        <p type="p">105:設定解除部</p>  
        <p type="p">200:資料記憶部</p>  
        <p type="p">201:處理執行部</p>  
        <p type="p">300:資料記憶部</p>  
        <p type="p">301:操作受理部</p>  
        <p type="p">302:顯示控制部</p>  
        <p type="p">400:資料記憶部</p>  
        <p type="p">401:支付請求發送部</p>  
        <p type="p">DB1:支付資料庫</p>  
        <p type="p">DB2:卡片資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1859" publication-number="202610863"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610863.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610863</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133176</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兒童安全座椅</chinese-title>  
        <english-title>CHILD SAFETY SEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250909B">B60N2/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張大亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DALIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁嘉俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, JIAJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種兒童安全座椅，包括座椅本體和頂部繫帶機構，所述頂部繫帶機構連接至所述座椅本體的背靠部，所述頂部繫帶機構包括：上拉帶組件，其一端連接至所述座椅本體，另一端設置有用於卡合車輛座椅的卡合件；以及保持件，其分別連接座椅本體和所述上拉帶組件，所述保持件為彈性件，並對所述上拉帶組件施加向上的力，以使得所述保持件能夠支撐所述上拉帶組件相對于所述兒童安全座椅向上突起，當所述上拉帶組件處於鬆弛狀態時，所述保持件能夠支撐所述上拉帶組件相對於所述背靠部向上突起；當所述上拉帶組件處於拉緊狀態時，所述上拉帶組件能夠抵壓所述保持件，使所述保持件發生彈性形變。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure discloses a child safety seat, including a seat body and a top strap mechanism. The top strap mechanism is connected to a backrest portion of the seat body. The top strap mechanism includes a pull-up strap assembly and a retaining member. One end of the pull-up strap assembly is connected to the seat body, and another end of the top strap mechanism is provided with a snapping member configured to be engaged with a car seat. The retaining member is connected to both the seat body and the pull-up strap assembly. The retaining member is an elastic member, and an upward force is applied to the pull-up strap assembly, such that the retaining member is capable of supporting the pull-up strap assembly to protrude upward relative to the child safety seat. When the pull-up strap assembly is in a relaxed state, the retaining member is capable of supporting the pull-up strap assembly to protrude downward relative to the backrest portion. When the pull-up strap assembly is in a tensioned state, the pull-up strap assembly is capable of pressing against the retaining member, such that the retaining member is elastically deformed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:兒童安全座椅</p>  
        <p type="p">1:頭靠部</p>  
        <p type="p">2:背靠部</p>  
        <p type="p">202:上端邊緣</p>  
        <p type="p">3:座部</p>  
        <p type="p">4:頂部繫帶機構</p>  
        <p type="p">41:上拉帶組件</p>  
        <p type="p">411:織帶</p>  
        <p type="p">412:卡合件</p>  
        <p type="p">414:長度調節件</p>  
        <p type="p">42:保持件</p>  
        <p type="p">422:支撐段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1860" publication-number="202610581"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610581.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610581</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133202</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備控制方法、基樁控制方法、電腦程式產品、電腦可讀存儲介質、清潔設備、基樁及清潔系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251112B">A47L11/40</main-classification>  
        <further-classification edition="202401120251112B">G05D1/00</further-classification>  
        <further-classification edition="200601120251112B">A47L11/24</further-classification>  
        <further-classification edition="200601120251112B">A47L11/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁勝軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露公開了一種清潔設備控制方法、基樁控制方法、裝置及清潔系統，所述方法包括：在清潔設備上樁成功之後，控制所述清潔設備在基樁內部按照上樁方向執行擠壓動作，以修正所述清潔設備在所述基樁內部的姿態。透過本揭露提供的技術方案能夠提高清潔設備在基樁內部姿態的精準性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1861" publication-number="202610582"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610582.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610582</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133203</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉動配合組件和清潔設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251015B">A47L11/40</main-classification>  
        <further-classification edition="200601120251015B">A47L11/24</further-classification>  
        <further-classification edition="200601120251015B">A47L11/283</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘潤偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡彩云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱中岩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳定迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露公開一種轉動配合組件和清潔設備，所述轉動配合組件包括：第一連接件、連接軸、中間連接件和第二連接件，所述連接軸與所述第一連接件轉動配合，所述中間連接件與所述連接軸相連且與所述第二連接件配合，在所述連接軸與所述第一連接件相對靜止時，所述中間連接件和/或所述第二連接件的至少部分能夠形變，使得所述第二連接件與所述連接軸相對轉動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:轉動配合組件</p>  
        <p type="p">1:第一連接件</p>  
        <p type="p">2:連接軸</p>  
        <p type="p">21:螺紋部</p>  
        <p type="p">3:中間連接件</p>  
        <p type="p">31:彈性變形部</p>  
        <p type="p">311:彈性凸起</p>  
        <p type="p">32:本體部</p>  
        <p type="p">33:變形空間</p>  
        <p type="p">4:第二連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1862" publication-number="202611167"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611167.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611167</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133210</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有自由基聚合性基之酯化合物</chinese-title>  
        <english-title>ESTER COMPOUND CONTAINING RADICAL POLYMERISABLE GROUP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C08G63/91</main-classification>  
        <further-classification edition="200601120251103B">H05K1/03</further-classification>  
        <further-classification edition="200601120251103B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一工業製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DKS CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>門脇利治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADOWAKI, TOSHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上賢志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種可兼具硬化後之介電特性與除膠渣(Desmear)性的新穎化合物。 &lt;br/&gt;作為本發明之解決課題之手段之實施型態之含有自由基聚合性基之酯化合物，具有含酯鍵之分子及連接於前述含酯鍵之分子各分子末端的自由基聚合性基；該含酯鍵之分子僅由一個以上的第1單元與一個以上的第2單元所構成；該第1單元有源自兩末端具有羥基之聚苯醚的結構，該第2單元有源自2官能或3官能之芳香族醯鹵化物的結構並藉由酯鍵與前述第1單元進行鍵結。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An objective of the present invention is to provide a novel compound that combines cured dielectric property and desmear property. &lt;br/&gt;As a means for attaining the objective of the present invention is a ester compound contains a molecule containing an ester bond and a radical polymerizing group attached to the ends of each of the molecules of the aforesaid molecule containing an ester bond.The molecule containing an ester bond consists only of more than one unit 1 and more than one unit 2.The unit 1 has a structure derived from polyphenylene ether having hydroxyl group at both ends, and the unit 2 has a structure derived from a difunctional or trifunctional group aromatic acyl halide and is bonded to the aforesaid unit 1 by ester bonding.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1863" publication-number="202612071"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612071.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612071</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133212</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塗膠顯影模組和裝置</chinese-title>  
        <english-title>GLUE COATING AND DEVELOPING MODULE AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250916B">H01L21/67</main-classification>  
        <further-classification edition="200601120250916B">H01L21/677</further-classification>  
        <further-classification edition="200601120250916B">G03F7/16</further-classification>  
        <further-classification edition="200601120250916B">G03F7/30</further-classification>  
        <further-classification edition="200601120250916B">B25J9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商瀋陽芯源微電子設備股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENYANG KINGSEMI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王超群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHAOQUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳艷雙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YANSHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及塗膠顯影模組和裝置，所述塗膠顯影模組包括：製程組件，包含用於熱處理或液處理晶圓的多個製程單元；製程機械手，裝備有多個獨立運動的執行器，用於吸附並移動晶圓；所述製程單元關於中分線對稱設置在所述製程機械手的相對兩側；所述製程機械手用於將晶圓移入或移出任一側的所述製程單元；製程機械手被配置為繞其旋轉軸轉動，以使所述執行器朝向其中一側的製程單元。該塗膠顯影模組用於提升製程機械手的靈活性以提升製程組件的利用率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a glue coating and developing module and an apparatus. The glue coating and developing module comprises: a process assembly, including a plurality of process units configured to heat processing or liquid processing a wafer; a process manipulator, including a plurality of actuators being able to move independently, configured to move the wafer by suction; the process units are symmetrically arranged on two opposite sides of the process manipulator with respect to a center line; the process manipulator is configured to move a wafer into or out of the process unit on either of the two opposite sides; while the process manipulator is configured to rotate around a rotation axis thereof, so that the actuator faces a process unit on one of the two opposite sides. The glue coating and developing module is configured to improve the flexibility of the process manipulator, so as to improve a utilization rate of the process assembly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:塗膠顯影模組</p>  
        <p type="p">61:製程組件</p>  
        <p type="p">62:製程機械手</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1864" publication-number="202610691"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610691.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610691</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種包含NMT抑制劑的抗體藥物偶聯物及其製備方法和用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">A61K47/68</main-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4155</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4184</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商蘇州宜聯生物醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDILINK THERAPEUTICS (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　家強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, JIAQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧漢文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, HANWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛彤彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, TONGTONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種包含NMT抑制劑的藥物連接體偶聯物和其抗體藥物偶聯物。本申請還提供所述藥物連接體偶聯物及其抗體藥物偶聯物的製備方法，以及所述抗體藥物偶聯物在預防和/或治療與細胞活動異常相關的疾病，包括但不限於在預防和/或治療腫瘤疾病中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1865" publication-number="202611541"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611541.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611541</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133249</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射雷達和清潔設備</chinese-title>  
        <english-title>LASER RADAR AND CLEANING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G01S7/481</main-classification>  
        <further-classification edition="200601120251001B">G01S17/08</further-classification>  
        <further-classification edition="200601120251001B">G02B5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種雷射雷達和清潔設備。其中，雷射雷達包括：發射單元、接收單元和基板，發射單元和接收單元安裝在基板的同一側，發射單元包括依次佈置的雷射發射器和光處理組件，雷射發射器與基板連接，光處理組件遠離雷射發射器的端部設置為出光口，光處理組件配置為調節出光口和基板之間的距離以適配接收單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application provides a laser radar and cleaning equipment. The laser radar includes a transmission unit, a reception unit, and a substrate. The transmission unit and the reception unit are installed on the same side of the substrate. The transmission unit consists of a laser emitter and an optical processing component arranged in sequence. The laser emitter is connected to the substrate, and the end of the optical processing component away from the laser emitter is set as the light emission port. The optical processing component is configured to adjust the distance between the light emission port and the substrate to accommodate the reception unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雷射雷達</p>  
        <p type="p">110:發射單元</p>  
        <p type="p">111:出光口</p>  
        <p type="p">112:雷射發射器</p>  
        <p type="p">113:光處理組件</p>  
        <p type="p">120:接收單元</p>  
        <p type="p">121:入光口</p>  
        <p type="p">122:雷射接收器</p>  
        <p type="p">123:接收透鏡</p>  
        <p type="p">130:基板</p>  
        <p type="p">200:視窗</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1866" publication-number="202612564"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612564.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612564</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133271</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽能電池單元的製造方法以及太陽能電池單元和太陽能電池模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H10K30/82</main-classification>  
        <further-classification edition="202301120251103B">H10K30/40</further-classification>  
        <further-classification edition="202301120251103B">H10K30/85</further-classification>  
        <further-classification edition="202301120251103B">H10K30/86</further-classification>  
        <further-classification edition="202301120251103B">H10K85/50</further-classification>  
        <further-classification edition="202301120251103B">H10K71/00</further-classification>  
        <further-classification edition="202301120251103B">H10K39/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商夏普能源科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARP ENERGY SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西康哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供能夠提高耐久性、轉換效率的太陽能電池單元的製造方法和太陽能電池模組的製造方法以及太陽能電池單元和太陽能電池模組。太陽能電池單元（10）的製造方法包括在第一電極（2）上形成電子傳輸層（3）的工序、在電子傳輸層（3）上形成鈣鈦礦化合物的光吸收層（4）的工序、在光吸收層（4）上形成空穴傳輸層（5）的工序、在空穴傳輸層（5）上形成第二電極（6）的工序，形成所述空穴傳輸層（5）的工序及/或形成所述電子傳輸層（3）的工序具有緩衝層形成工序，所述緩衝層形成工序是在所述空穴傳輸層（5）與光吸收層（4）的層間及/或所述電子傳輸層（3）與光吸收層（4）的層間形成緩衝層（31、51），該緩衝層形成工序添加包含聚氨基酸的溶液，該聚氨基酸是具有反應性官能團的帶電側鏈的氨基酸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">（無）</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基體</p>  
        <p type="p">2:第一電極</p>  
        <p type="p">3:電子傳輸層</p>  
        <p type="p">31:緩衝層</p>  
        <p type="p">4:光吸收層</p>  
        <p type="p">5:空穴傳輸層</p>  
        <p type="p">51:緩衝層</p>  
        <p type="p">6:第二電極</p>  
        <p type="p">10:太陽能電池單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1867" publication-number="202611127"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611127.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611127</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133273</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有機EL元件的平坦化膜或隔離壁形成用感放射線性組成物、硬化物、有機EL顯示元件、及硬化物的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C08F212/14</main-classification>  
        <further-classification edition="200601120251103B">C08F220/06</further-classification>  
        <further-classification edition="200601120251103B">C08F220/14</further-classification>  
        <further-classification edition="200601120251103B">C08F220/18</further-classification>  
        <further-classification edition="200601120251103B">C08F220/32</further-classification>  
        <further-classification edition="200601120251103B">C08F220/36</further-classification>  
        <further-classification edition="200601120251103B">C08F222/40</further-classification>  
        <further-classification edition="200601120251103B">C08G73/10</further-classification>  
        <further-classification edition="200601120251103B">C08K5/109</further-classification>  
        <further-classification edition="200601120251103B">C08K5/132</further-classification>  
        <further-classification edition="200601120251103B">C08K5/315</further-classification>  
        <further-classification edition="200601120251103B">C08K5/3475</further-classification>  
        <further-classification edition="200601120251103B">C08K5/3492</further-classification>  
        <further-classification edition="200601120251103B">C08L101/00</further-classification>  
        <further-classification edition="200601120251103B">G03F7/004</further-classification>  
        <further-classification edition="200601120251103B">G03F7/20</further-classification>  
        <further-classification edition="200601120251103B">G03F7/40</further-classification>  
        <further-classification edition="202301120251103B">H10K50/826</further-classification>  
        <further-classification edition="202301120251103B">H10K50/828</further-classification>  
        <further-classification edition="202301120251103B">H10K50/844</further-classification>  
        <further-classification edition="202301120251103B">H10K59/12</further-classification>  
        <further-classification edition="202301120251103B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>角田裕志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUNODA, YUUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本田晃久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA, AKIHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倉田亮平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURATA, RYOUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種有機EL元件的感放射線性組成物包含鹼可溶性聚合物（A）及光酸產生劑（B），鹼可溶性聚合物（A）為(甲基)丙烯酸系聚合物或聚醯亞胺系聚合物，且滿足1）及2）中的至少一者。1）組成物包含選自由紫外線吸收劑（C1）、及通過加熱而顯現出紫外線吸收功能的紫外線吸收劑前體化合物（C2）中的一種以上；2）所述（A）包含源自紫外線吸收性化合物（a）的結構單元（III）。其中，1）的（C1）與2）的（a）: 在波長250至350 nm間具有極大吸收波長且將其設為1時的波長365 nm下的吸光度為0.4以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1868" publication-number="202611691"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611691.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611691</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133349</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在處理器裝置中執行「冷」記憶體依賴性識別</chinese-title>  
        <english-title>PERFORMING "COLD" MEMORY DEPENDENCY IDENTIFICATION IN PROCESSOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F3/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布拉斯科　康拉多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLASCO, CONRADO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示了在處理器裝置中執行「冷」記憶體依賴性識別。在一些態樣中，處理器裝置包括依賴性識別符電路，依賴性識別符電路包含儲存指令佇列。依賴性識別符電路在指令處理電路前端中偵測包含單一儲存位址暫存器編號及儲存立即值的儲存指令。依賴性識別符電路將儲存實體暫存器編號、儲存立即值及年齡指示符寫入儲存指令佇列的條目中。依賴性識別符電路在指令處理電路前端中偵測包含單一載入位址暫存器編號及載入立即值的載入指令。依賴性識別符電路判定儲存指令佇列的條目是否儲存對應的載入實體暫存器編號及載入立即值，且若是，則在載入指令與對應於該條目的儲存指令之間建立依賴性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Performing “cold” memory dependency identification in processor devices is disclosed herein. In some aspects, a processor device includes a dependency identifier circuit comprising a store instruction queue. The dependency identifier circuit detects a store instruction comprising a single store address register number and a store immediate value in an instruction processing circuit front end. The dependency identifier circuit writes a store physical register number, the store immediate value, and an age indicator in an entry of the store instruction queue. The dependency identifier circuit detects a load instruction comprising a single load address register number and a load immediate value in the instruction processing circuit front end. The dependency identifier circuit determines whether an entry of the store instruction queue stores a corresponding load physical register number and the load immediate value, and, if so, establishes a dependency between the load instruction and a store instruction corresponding to the entry.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基於處理器之裝置</p>  
        <p type="p">102:處理器裝置</p>  
        <p type="p">104:指令處理電路</p>  
        <p type="p">106:前端</p>  
        <p type="p">108:後端</p>  
        <p type="p">110:指令</p>  
        <p type="p">110D:經解碼指令</p>  
        <p type="p">110E:執行指令</p>  
        <p type="p">110F:經提取指令</p>  
        <p type="p">112:指令記憶體</p>  
        <p type="p">114:提取電路</p>  
        <p type="p">116:指令快取記憶體</p>  
        <p type="p">118:執行電路</p>  
        <p type="p">120:解碼電路</p>  
        <p type="p">122:重新命名電路</p>  
        <p type="p">124:暫存器存取電路</p>  
        <p type="p">126(0)-126(R):實體暫存器</p>  
        <p type="p">128:實體暫存器檔案(PRF)</p>  
        <p type="p">130(0)-130(R):實體暫存器編號</p>  
        <p type="p">132:排程器電路</p>  
        <p type="p">134:寫入電路</p>  
        <p type="p">136:儲存單元</p>  
        <p type="p">138(0)-138(S):儲存單元識別符</p>  
        <p type="p">140:重排序緩衝器</p>  
        <p type="p">142(0)-142(B):重排序緩衝器索引</p>  
        <p type="p">144:依賴性預測器電路</p>  
        <p type="p">146:依賴性識別符電路</p>  
        <p type="p">148:儲存指令佇列</p>  
        <p type="p">150(0)-150(E):條目</p>  
        <p type="p">I&lt;sub&gt;0&lt;/sub&gt;-I&lt;sub&gt;N&lt;/sub&gt;:指令管線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1869" publication-number="202610725"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610725.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610725</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133362</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>密封總成</chinese-title>  
        <english-title>SEALING ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250922B">B03C3/38</main-classification>  
        <further-classification edition="200601120250922B">B03C3/40</further-classification>  
        <further-classification edition="200601120250922B">B01D35/01</further-classification>  
        <further-classification edition="200601120250922B">B01D35/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＶＤＬ創能科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VDL ENABLING TECHNOLOGIES GROUP B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布隆　保羅・彼得魯斯・瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOM, PAUL PETRUS MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅伊亞爾特　派崔克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEIJAARD, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種密封總成，用以捕捉一氣體流中沿著一氣體流路的雜散粒子，該密封總成包含作為該氣體流路之一部分的一收集區，該收集區包含一電場產生單元，其係用以在該氣體流中產生一靜電場，以從該氣體流中清除帶電雜散粒子。該電場產生單元包含一第一電極與一第二電極，其彼此間隔開並且相對設置，方向大致垂直於通過該收集區之該氣體流，且該收集區包含一第三電極，該第三電極遮蔽該第一電極或該第二電極中之一者，以避免其受該氣體流影響，其中該第三電極為一穿孔或網格狀電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sealing assembly for capturing stray particles in a gas flow along a gas flow path is proposed, the sealing assembly comprising a collection region being part of the flow path of the gas, comprising an electric field generating unit structured to generate a static electric field across the gas flow for removing charged stray particles from the gas flow. The electric field generating unit comprises a first and second electrode positioned spaced apart from each other and facing each other in a direction more or less perpendicular to the gas flow through the collection region, and the collection region comprises a third electrode, shielding one of the first or second electrode from the gas flow, wherein the third electrode is formed as a perforated or grid formed electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:密封總成</p>  
        <p type="p">1:第一電極</p>  
        <p type="p">2:第二電極</p>  
        <p type="p">4:氣體分子</p>  
        <p type="p">4q:帶電氣體分子</p>  
        <p type="p">5q:帶電污染性雜散粒子、帶電雜散粒子、污染性雜散粒子</p>  
        <p type="p">10:初始氣體區</p>  
        <p type="p">40:收集區</p>  
        <p type="p">50:潔淨氣體區</p>  
        <p type="p">100:內部空間結構、流動通道、氣體流路</p>  
        <p type="p">200:電漿源</p>  
        <p type="p">300:電場產生單元</p>  
        <p type="p">400:氣體注入器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1870" publication-number="202612516"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612516.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612516</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133385</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251203B">H10D62/10</main-classification>  
        <further-classification edition="202501120251203B">H10D62/80</further-classification>  
        <further-classification edition="202501120251203B">H10D64/20</further-classification>  
        <further-classification edition="202501120251203B">H10D80/20</further-classification>  
        <further-classification edition="200601120251203B">H01L23/535</further-classification>  
        <further-classification edition="200601120251203B">H01L23/538</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楠紘慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSUNOKI, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉一徳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一個實施方式的目的是提供一種新穎的半導體裝置。第一電晶體的第一端子與第五電晶體的第一端子及第二電容器的第一端子連接，第五電晶體的第二端子與第二電晶體的第一端子、第四電晶體的第一端子、第六電晶體的第一端子及第七電晶體的第一端子連接，第四電晶體的第二端子與第一電容器的第一端子及第二電容器的第二端子連接，第二電晶體的閘極與第三電晶體的第一端子及第一電容器的第二端子連接，第六電晶體的第二端子與發光元件的第一端子連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">101:像素電路</p>  
        <p type="p">M11:電晶體</p>  
        <p type="p">M12:電晶體</p>  
        <p type="p">M13:電晶體</p>  
        <p type="p">M14:電晶體</p>  
        <p type="p">M15:電晶體</p>  
        <p type="p">M16:電晶體</p>  
        <p type="p">M17:電晶體</p>  
        <p type="p">C11:電容器</p>  
        <p type="p">C12:電容器</p>  
        <p type="p">LD:發光元件</p>  
        <p type="p">SL:佈線</p>  
        <p type="p">GW:佈線</p>  
        <p type="p">GC1:佈線</p>  
        <p type="p">GC2:佈線</p>  
        <p type="p">GI1:佈線</p>  
        <p type="p">EM1:佈線</p>  
        <p type="p">EM2:佈線</p>  
        <p type="p">ANO:佈線</p>  
        <p type="p">CATH:佈線</p>  
        <p type="p">VL1:佈線</p>  
        <p type="p">ND1:節點</p>  
        <p type="p">ND2:節點</p>  
        <p type="p">ND3:節點</p>  
        <p type="p">ND4:節點</p>  
        <p type="p">ND5:節點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1871" publication-number="202611701"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611701.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611701</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133387</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>卸載共用記憶體更新任務</chinese-title>  
        <english-title>OFFLOADING SHARED MEMORY UPDATE TASK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251114B">G06F9/30</main-classification>  
        <further-classification edition="200601120251114B">G06F9/34</further-classification>  
        <further-classification edition="200601120251114B">G06F12/02</further-classification>  
        <further-classification edition="200601120251114B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利傑達爾　艾瑞克奧拉哈拉爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LILJEDAHL, ERIC OLA HARALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾約萊　姆布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EYOLE, MBOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設備包含解碼電路系統，其經組態以解碼指令；及處理電路系統，其經組態以回應於由解碼電路系統解碼之指令而執行資料處理操作。回應於一共用記憶體更新任務卸載指令，該解碼電路系統經組態以控制將一共用記憶體更新任務卸載至延伸處理電路系統，該共用記憶體更新任務將由該延伸處理電路系統相對於由該處理電路系統執行之其他資料處理操作異步執行，該共用記憶體更新任務包含對共用記憶體資料的至少一次原子讀取-修改-寫入更新。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus comprises decoding circuitry configured to decode instructions; and processing circuitry configured to perform data processing operations in response to the instructions decoded by the decoding circuitry. In response to a shared memory update task offloading instruction, the decoding circuitry is configured to control offloading, to extension processing circuitry, of a shared memory update task to be performed by the extension processing circuitry asynchronously with respect to other data processing operations performed by the processing circuitry, the shared memory update task comprising at least one atomic read-modify-write update to shared memory data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:處理電路系統</p>  
        <p type="p">8:暫存器</p>  
        <p type="p">10:設備；處理器</p>  
        <p type="p">13:解碼電路系統</p>  
        <p type="p">23:延伸處理電路系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1872" publication-number="202611177"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611177.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611177</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物的製造方法、積層體的製造方法、半導體元件的製造方法及半導體元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G73/12</main-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/16</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浅川大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAKAWA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樹脂組成物、硬化上述樹脂組成物而成之硬化物、包含上述硬化物之積層體、上述硬化物之製造方法、上述積層體之製造方法、包括上述硬化物之製造方法之半導體元件之製造方法、及包含上述硬化物之半導體元件，前述樹脂組成物為包含聚醯亞胺或聚醯亞胺前驅物之樹脂，並且上述樹脂為在熱、酸或鹼中的任一者的作用下生成由下述式（A-1）表示之結構之樹脂，R&lt;sup&gt;1&lt;/sup&gt;表示氫原子或取代基，Ar表示芳香族基，芳香族基的氫原子中的至少1個為與樹脂結構的鍵結部位。 &lt;br/&gt;&lt;img align="absmiddle" height="124px" width="201px" file="ed10074.JPG" alt="ed10074.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1873" publication-number="202612575"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612575.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612575</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133418</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層構造體及電子裝置</chinese-title>  
        <english-title>LAMINATED STRUCTURE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H10N30/01</main-classification>  
        <further-classification edition="202301120251201B">H10N30/05</further-classification>  
        <further-classification edition="202301120251201B">H10N30/85</further-classification>  
        <further-classification edition="200601120251201B">C23C14/06</further-classification>  
        <further-classification edition="200601120251201B">C23C14/08</further-classification>  
        <further-classification edition="200601120251201B">C23C14/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商蓋亞尼克斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAIANIXX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木島健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIJIMA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關雅志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKI, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種可提升形成於Si基板上之電介質膜或是導電體膜或半導體膜的結晶性之積層構造體及電子裝置。 &lt;br/&gt;本發明之解決手段為一種積層構造體(10)，係具有：基板(11)、及形成於基板(11)上之緩衝膜(12)。基板(11)係由Si基板，或是SOI基板所構成，該SOI基板包含：由Si基板所構成之基體、基體上的絕緣層、及由絕緣層上的Si膜所構成之SOI層。緩衝膜(12)係由第1金屬氧化物所構成，該第1金屬氧化物含有：選自由第4族元素所組成之群組之1種以上的金屬元素，以及選自由Nb、Ta、Si、Ti、稀土類元素、Al及第2族元素所組成之群組之1種以上的金屬元素，第1金屬氧化物以擬立方晶(Pseudo-cubic Crystal)標示時呈(111)配向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a laminated structure and an electronic device capable of improving the crystallinity of a dielectric film, a conductive film, or a semiconductor film formed on a Si substrate. &lt;br/&gt;A laminated structure (10) as a solution of the present invention comprises: a substrate (11); and a buffer film (12) formed on the substrate (11). The substrate (11) is a Si substrate or an SOI substrate that includes: a base body composed of a Si substrate, an insulating layer on the base body, and an SOI layer composed of a Si film on the insulating layer. The buffer film (12) is composed of a first metal oxide. The first metal oxide contains: one or more metal elements selected from the group consisting of Group 4 elements, and one or more metal elements selected from the group consisting of Nb, Ta, Si, Ti, rare earth elements, Al, and Group 2 elements. The first metal oxide is (111)-oriented when indexed as a pseudo-cubic crystal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積層構造體</p>  
        <p type="p">11:基板</p>  
        <p type="p">11p:主面</p>  
        <p type="p">12,13:緩衝膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1874" publication-number="202610825"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610825.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610825</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133426</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控面板顯示裝置</chinese-title>  
        <english-title>TOUCH PANEL DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">B32B17/10</main-classification>  
        <further-classification edition="200601120251103B">B32B27/30</further-classification>  
        <further-classification edition="201901120251103B">B32B7/02</further-classification>  
        <further-classification edition="200601120251103B">B32B7/12</further-classification>  
        <further-classification edition="200601120251103B">C09J133/00</further-classification>  
        <further-classification edition="200601120251103B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山昌哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, MASAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種進行黑白顯示時的黑色顯示與白色顯示的對比度優異且高溫高濕環境下的對比度下降的抑制性能優異之觸控面板顯示裝置。本發明的觸控面板顯示裝置依序具備覆蓋構件、第1黏著層、觸控感測器、第2黏著層及有機電致發光顯示面板，觸控感測器具有丙烯酸系基材，丙烯酸系基材的厚度為40μm以下，第2黏著層的厚度為100μm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a touch panel display device that has excellent contrast between black display and white display in a case of black-and-white display and has excellent performance of suppressing a decrease in contrast in a high-temperature and high-humidity environment. A touch panel display device according to an aspect of the present invention is a touch panel display device including a cover member, a first pressure-sensitive adhesive layer, a touch sensor, a second pressure-sensitive adhesive layer, and an organic electroluminescence display panel in this order, in which the touch sensor has an acrylic substrate, a thickness of the acrylic substrate is 40 μm or less, and a thickness of the second pressure-sensitive adhesive layer is 100 μm or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:OLED面板</p>  
        <p type="p">1a:顯示面</p>  
        <p type="p">2:第2黏著層</p>  
        <p type="p">3:觸控感測器</p>  
        <p type="p">3a:表面</p>  
        <p type="p">3b:表面</p>  
        <p type="p">4:第1黏著層</p>  
        <p type="p">5:覆蓋構件</p>  
        <p type="p">5a:表面</p>  
        <p type="p">10:觸控面板顯示裝置</p>  
        <p type="p">30:丙烯酸系基材</p>  
        <p type="p">31A(31):第1檢測電極</p>  
        <p type="p">32A(32):第2檢測電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1875" publication-number="202610708"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610708.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610708</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133447</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>油分及污泥回收槽</chinese-title>  
        <english-title>OIL AND SLUDGE COLLECTION TANK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B01D17/00</main-classification>  
        <further-classification edition="200601120251201B">B01D17/02</further-classification>  
        <further-classification edition="200601120251201B">B01D17/04</further-classification>  
        <further-classification edition="200601120251201B">B01D17/12</further-classification>  
        <further-classification edition="202301120251201B">C02F1/40</further-classification>  
        <further-classification edition="200601120251201B">C02F11/18</further-classification>  
        <further-classification edition="200601320251201B">C02F101/32</further-classification>  
        <further-classification edition="200601320251201B">C02F103/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>ＴＢＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TBM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐原邦宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAHARA, KUNIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳英本</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種油分及污泥回收槽，可安裝在排放含油廢水的食品工廠等的現場，並可從含油廢水中回收油分與污泥，同時最大程度地減少打開蓋子的需要，避免產生惡臭。該油分及污泥回收槽包含：安裝在其側面底部的油取出閥；從頂部看呈U形的廢固形分去除體，其由從回收槽底面豎立的三個矩形柱狀廢固形分去除板組成；以及由該側面和廢固形分去除體圍成的吸引空間，用於透過油取出閥吸入回收槽中儲存的油分及污泥。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An oil and sludge collection tank which can be installed on-site in a food factory or the like that discharges oil-containing wastewater, and can collect oil and sludge from the oil-containing wastewater while minimizing the work of opening a lid that causes bad odors. The oil and sludge collection tank includes an oil take-out valve provided on a bottom of a side thereof, a waste solid content removing body having a U-shape in a top view and including three quadrangular prism-shaped waste solid content removing plates erected from a bottom surface of the oil and sludge collection tank, and a suction space surrounded by the side and the waste solid content removing body for sucking oil stored in the collection tank via the oil take-out valve.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:廢固形分去除體</p>  
        <p type="p">4a、4b、4c:廢固形分去除板</p>  
        <p type="p">41:薄板</p>  
        <p type="p">42:穿孔</p>  
        <p type="p">43:玻璃棉</p>  
        <p type="p">AS:吸引空間</p>  
        <p type="p">OV:油取出閥</p>  
        <p type="p">S1:油分選擇分離機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1876" publication-number="202610934"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610934.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610934</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133453</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>羥胺游離鹼及其製備方法與反應系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">C01B21/14</main-classification>  
        <further-classification edition="200601120251001B">B01J29/40</further-classification>  
        <further-classification edition="200601120251001B">B01J8/02</further-classification>  
        <further-classification edition="200601120251001B">B01J19/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華茂偉業綠色科技（石嘴山）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>B-FCTL (SHIZUISHAN) LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華茂偉業綠色科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>B-FCTL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路萬里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, WAN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張峰敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, FENG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭本榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, BEN-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐天祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, TIAN-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳曉亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, XIAO-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIONG, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種羥胺游離鹼及其製備方法與反應系統，反應系統包括精餾塔、加熱裝置和冷凝裝置。精餾塔內設置有催化劑裝填段，催化劑裝填段上方的精餾塔的側壁上設置有雙氧水進料口，催化劑裝填段下方的精餾塔的側壁上設置有氨進料口；加熱裝置用於對所述精餾塔的塔釜進行加熱；冷凝裝置與精餾塔的塔頂連通，用於冷凝精餾塔的塔頂流出的蒸汽，以及控制所述精餾塔的回流比。本發明利用精餾塔實現雙氧水和氨反應製備游離羥胺，利用水、氨和羥胺之間的沸點差異，不僅能夠促進反應進行，避免雙氧水與羥胺之間的進一步反應，還能避免催化劑中金屬引起的羥胺分解反應，進而使得生成的純淨的羥胺在塔釜富集，提高游離羥胺的純度和收率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:精餾塔</p>  
        <p type="p">11:催化劑裝填段</p>  
        <p type="p">12:雙氧水進料口</p>  
        <p type="p">13:氨進料口</p>  
        <p type="p">14:精餾填料</p>  
        <p type="p">2:加熱裝置</p>  
        <p type="p">3:冷凝裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1877" publication-number="202612072"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612072.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612072</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133470</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置</chinese-title>  
        <english-title>SUBSTRATE PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250912B">H01L21/67</main-classification>  
        <further-classification edition="200601120250912B">H01L21/50</further-classification>  
        <further-classification edition="200601120250912B">G05D7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田恭輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, KYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋朋宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明在於消除處理液在處理槽內流動之速度偏差，進一步抑制基板面內之處理不均。本發明之基板處理裝置包含外側氣泡產生管及內側氣泡產生管，外側氣泡產生管及內側氣泡產生管各者所具有之複數個噴出孔至少包含：具有第1孔徑之第1噴出孔、及具有較前述第1孔徑大之第2孔徑之第2噴出孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:氣體供給源</p>  
        <p type="p">6,61~64:第1流量控制機構</p>  
        <p type="p">7:第2流量控制機構</p>  
        <p type="p">21:內槽</p>  
        <p type="p">31,32:外側氣泡產生管</p>  
        <p type="p">31A~34A,41A,42A:噴出孔</p>  
        <p type="p">33,34:內側氣泡產生管</p>  
        <p type="p">41,42:液體噴出管</p>  
        <p type="p">51,52:第1氣體供給管</p>  
        <p type="p">53,54:第2氣體供給管</p>  
        <p type="p">71,72:液體供給管</p>  
        <p type="p">100:基板處理裝置</p>  
        <p type="p">W:基板</p>  
        <p type="p">WS:主面</p>  
        <p type="p">X,Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1878" publication-number="202612073"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612073.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612073</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133471</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01L21/67</main-classification>  
        <further-classification edition="200601120251001B">B05B1/30</further-classification>  
        <further-classification edition="200601120251001B">H01L21/306</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田恭輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, KYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋朋宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係即便上升流流量變多，亦進一步抑制基板面內之處理不均。本發明之基板處理裝置包含控制部，該控制部基於第2流量控制機構控制之處理液之流量，以朝第1氣體供給管供給之氣體之流量較朝第2氣體供給管供給之氣體之流量多之方式，控制第1流量控制機構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:氣體供給源</p>  
        <p type="p">6:第1流量控制機構</p>  
        <p type="p">7:第2流量控制機構</p>  
        <p type="p">21:內槽</p>  
        <p type="p">31,32:外側氣泡產生管</p>  
        <p type="p">31A~34A,41A,42A:噴出孔</p>  
        <p type="p">33,34:內側氣泡產生管</p>  
        <p type="p">41,42:液體噴出管</p>  
        <p type="p">51,52:第1氣體供給管</p>  
        <p type="p">53,54:第2氣體供給管</p>  
        <p type="p">61~64:第1流量控制機構</p>  
        <p type="p">71,72:液體供給管</p>  
        <p type="p">100:基板處理裝置</p>  
        <p type="p">W:基板</p>  
        <p type="p">WS:主面</p>  
        <p type="p">X,Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1879" publication-number="202611702"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611702.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611702</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133500</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於亂序處理之旁路網路中之比較消除</chinese-title>  
        <english-title>COMPARE ELIMINATION IN BYPASS NETWORKS FOR OUT OF ORDER PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">G06F9/30</main-classification>  
        <further-classification edition="201801120251201B">G06F9/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商谷歌有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOGLE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇拉　維蒂莎　瑞迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIRRA, VIDISHA REDDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　東國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, DUNG QUOC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普里亞達什　施瓦姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIYADARSHI, SHIVAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博南諾　詹姆斯　喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONANNO, JAMES JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉爾森　理查　亨利　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARSON, RICHARD HENRY, JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬斯特森　康納　柯倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASTERSON, CONNOR CURRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃司伯　約翰　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESPER, JOHN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於亂序處理中的旁路之方法、系統及設備，包括編碼在電腦儲存媒體上之電腦程式。 該等方法中之一者包括：在一保留站中儲存一旁路值，該旁路值指示用於執行一生產者指令之一執行管線之一級；使用該旁路值自由用於執行該生產者指令之至少兩個執行管線產生之資料選擇來自該執行管線之該級之輸出資料；及使用該選定輸出執行儲存於該保留站中之與該旁路值相關聯之一消費者指令。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and apparatus, including computer programs encoded on computer storage media, for bypassing in out of order processing. One of the methods includes storing, in a reservation station, a bypass value that indicates a stage of an execution pipeline used to execute a producer instruction; selecting, using the bypass value, output data from the stage of the execution pipeline from data generated by at least two execution pipelines used to execute the producer instruction; and executing a consumer instruction stored in the reservation station associated with the bypass value using the selected output.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">102:裝置</p>  
        <p type="p">102a:智慧型電話</p>  
        <p type="p">102b:平板電腦</p>  
        <p type="p">102c:膝上型電腦</p>  
        <p type="p">102d:可穿戴裝置</p>  
        <p type="p">104:記憶體裝置</p>  
        <p type="p">106:系統單晶片</p>  
        <p type="p">108:處理區塊</p>  
        <p type="p">110:記憶體單元</p>  
        <p type="p">112:中央處理單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1880" publication-number="202611573"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611573.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611573</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133531</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>計算、記憶體晶片封裝結構和裝置以及資源池化系統</chinese-title>  
        <english-title>COMPUTING AND MEMORY CHIP PACKAGE STRUCTURES AND DEVICES AND RESOURCE POOLING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250905B">G02B6/12</main-classification>  
        <further-classification edition="200601120250905B">G02B6/26</further-classification>  
        <further-classification edition="200601120250905B">G02B6/04</further-classification>  
        <further-classification edition="200601120250905B">H01L23/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商杭州光智元科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU GUANGZHIYUAN TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟怀宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENG, HUAIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈亦晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YICHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐叶龙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YELONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于山山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SHANSHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱剑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">記憶體晶片封裝結構包括：封裝基板；光互連模組，包括光電訊號轉換模組和第一收發電晶片；第一光子積體電路晶片，設置在封裝基板上；以及記憶體晶片模組，設置在第一光子積體電路晶片上並包括第一電互連介面。第一收發電晶片包括與第一電互連介面通過第一光子積體電路晶片彼此電性連接的第二電互連介面。第一收發電晶片將來自記憶體晶片模組的第一電訊號轉換為第二電訊號並將來自光電訊號轉換模組的第三電訊號轉換為發送到記憶體晶片模組的第四電訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The memory chip package structure includes: a package substrate; an optical interconnection module, including a photoelectric signal conversion module and a first transceiver electric chip; a first photonic integrated circuit chip, arranged on the package substrate; and a memory chip module, arranged on the first photonic integrated circuit chip and including a first electrical interconnection interface. The first transceiver electric chip includes a second electrical interconnection interface electrically connected to the first electrical interconnection interface through the first photonic integrated circuit chip. The first transceiver electric chip converts a first electrical signal from the memory chip module into a second electrical signal and converts a third electrical signal from the photoelectric signal conversion module into a fourth electrical signal sent to the memory chip module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:記憶體晶片封裝結構</p>  
        <p type="p">400:記憶體晶片組件</p>  
        <p type="p">401:第一電互連介面</p>  
        <p type="p">410:記憶體晶片模組</p>  
        <p type="p">420:光互連模組</p>  
        <p type="p">423:光訊號輸入埠</p>  
        <p type="p">425:光訊號輸出埠</p>  
        <p type="p">427:光源輸入埠</p>  
        <p type="p">440:光子積體電路晶片</p>  
        <p type="p">460:收發電晶片</p>  
        <p type="p">461:第二電互連介面</p>  
        <p type="p">470:切換單元</p>  
        <p type="p">480:封裝基板</p>  
        <p type="p">490:光纖</p>  
        <p type="p">OS41:第一光訊號</p>  
        <p type="p">OS42:第二光訊號</p>  
        <p type="p">L:光載波</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1881" publication-number="202611315"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611315.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611315</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133558</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成膜裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251127B">C23C14/32</main-classification>  
        <further-classification edition="200601120251127B">C23C14/50</further-classification>  
        <further-classification edition="200601120251127B">C23C14/54</further-classification>  
        <further-classification edition="200601120251127B">H01L21/67</further-classification>  
        <further-classification edition="200601120251127B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友重機械工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>一色雅仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISSHIKI, MASAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]本發明的課題為提供一種能夠藉由簡單的結構防止片劑從爐床機構落下之成膜裝置。 &lt;br/&gt;　　[解決手段]供給部(41)具備防落下機構(30)。在對保持部(21)供給新的片劑(TB)時，防落下機構(30)防止保持部(21)內的現有片劑(TB)的落下。因此，供給部(41)能夠在防止現有的片劑(TB)落下之狀態下，順暢地連續供給新的片劑(TB)。因此，能夠進行連續成膜運轉。又，防落下機構(30)藉由機械作用支撐片劑(TB)。因此，與使用控制等之機構相比，防落下機構(30)能夠簡化結構。藉此，能夠藉由簡單的結構防止片劑(TB)從爐床機構(2)落下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">17(2):主爐床(爐床機構)</p>  
        <p type="p">21:保持部</p>  
        <p type="p">21a:上端部</p>  
        <p type="p">21b:內周面</p>  
        <p type="p">22:貫通孔</p>  
        <p type="p">23:凸緣部</p>  
        <p type="p">23a:凸緣部的下端</p>  
        <p type="p">24:筒部</p>  
        <p type="p">24a:下端</p>  
        <p type="p">24b:開口部</p>  
        <p type="p">30:防落下機構</p>  
        <p type="p">31:本體部</p>  
        <p type="p">31a:孔部</p>  
        <p type="p">32:按壓部</p>  
        <p type="p">32a:孔部</p>  
        <p type="p">33:彈性構件</p>  
        <p type="p">36:背面構件</p>  
        <p type="p">39:一對支撐部</p>  
        <p type="p">51:旋轉軸</p>  
        <p type="p">52:基座部</p>  
        <p type="p">53a:彎曲面</p>  
        <p type="p">53b:傾斜面</p>  
        <p type="p">TB(Ma):片劑</p>  
        <p type="p">X:水平方向</p>  
        <p type="p">Y:水平方向</p>  
        <p type="p">Z:鉛直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1882" publication-number="202611961"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611961.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611961</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133573</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於保險絲座的保護裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">H01H85/25</main-classification>  
        <further-classification edition="200601120251212B">H01H85/175</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商創浦半導體製造雷射系統歐洲股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝翠吉　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BETTRIDGE, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱艾爾　莫瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEHRER, MAREK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝祖威特　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALZUWEIT, MARCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波納斯　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PONNATH, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夕博　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEYB, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於保險絲座(10)的保護裝置(20、120)，在該保險絲座上設置有一個或多個保險絲(12、14、16)，該保護裝置具有由電絕緣材料製成的基體(22、122)，該等基體具有至少一個通向保險絲緊固裝置、特別是螺絲的接入口(156、158、160)，其中，設置有遮蓋件(24，124)，透過該等遮蓋件防止物體意外插入該等接入口(156、158、160)。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:保險絲座</p>  
        <p type="p">12,14,16:保險絲</p>  
        <p type="p">20:保護裝置</p>  
        <p type="p">22:基體</p>  
        <p type="p">24:遮蓋件</p>  
        <p type="p">26:操作手柄</p>  
        <p type="p">28,30:導向裝置</p>  
        <p type="p">32,34,36:輔助裝置</p>  
        <p type="p">38:接片</p>  
        <p type="p">40,42:相鄰區域</p>  
        <p type="p">44,46:槽</p>  
        <p type="p">48:腹板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1883" publication-number="202610745"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610745.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610745</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133575</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工具機</chinese-title>  
        <english-title>MACHINE TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250908B">B23C3/12</main-classification>  
        <further-classification edition="200601120250908B">B23Q11/00</further-classification>  
        <further-classification edition="200601120250908B">B23Q5/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商星精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAR MICRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加茂正太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMO, SHOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安池誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUIKE, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種工具機，該工具機提昇去除毛刺時之便利性。 &lt;br/&gt;工具機(1)之刀架30安裝有去毛刺工具TO3，使去毛刺工具TO3以去毛刺工具中心線AX3為中心旋轉，該去毛刺工具TO3對工件W1中與主軸中心線AX1交叉之方向之孔(C1)之周部C1p進行切削。工具機(1)之控制部U1獲取指令(CM1～CM4)，進行如下控制：於切削位置P1上保持用指令(CM1～CM4)所指示之切削方式來切削周部C1p，上述指令(CM1～CM4)指示對周部C1p進行順切、抑或對周部C1p進行逆切，順切時，旋轉之去毛刺工具TO3之切削方向D1與該去毛刺工具TO3之相對移動方向D2為相反方向，逆切時，切削方向D1與相對移動方向D2一致。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To provide a machine tool that improves convenience when removing burrs. &lt;br/&gt;A deburring tool that cuts a periphery of a hole in an orientation intersecting a spindle axis in a workpiece is attached to a tool post of a machine tool and the tool post rotates the deburring tool around a deburring tool center axis. A control unit of the machine tool acquires a command (CM1 to CM4) for instructing the deburring tool to either perform, on the periphery, down-cutting in which a cutting direction by the rotating deburring tool is opposite to a relative movement direction of the deburring tool or to perform, on the periphery, up-cutting in which the cutting direction and the relative movement direction are the same, and performs control to cut the periphery so as to maintain the cut instructed by the command (CM1 to CM4) at a cutting position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C1o:中心</p>  
        <p type="p">C1p:周部</p>  
        <p type="p">D21:第一方向</p>  
        <p type="p">D22:第二方向</p>  
        <p type="p">P0:基準位置</p>  
        <p type="p">P2:中間位置</p>  
        <p type="p">PA0:切削路徑</p>  
        <p type="p">PA1:第一路徑</p>  
        <p type="p">PA2:第二路徑</p>  
        <p type="p">R1:第一反轉位置</p>  
        <p type="p">R2:第二反轉位置</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1884" publication-number="202611403"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611403.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611403</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133577</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低溫泵及控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251124B">F04B37/08</main-classification>  
        <further-classification edition="200601120251124B">F04B49/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友重機械工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五反田修平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTANDA, SHUUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 使低溫泵適應輻射環境。 &lt;br/&gt;　　[解決手段] 低溫泵(10)具備：冷頭馬達(16a)；逆變器(32b)，係遠離冷頭馬達(16a)而配置，並且構成為輸出能夠以所決定之運轉頻率驅動冷頭馬達(16a)之PWM電壓；及至少1個轉換器(34)，係連接於逆變器(32b)與冷頭馬達(16a)之間。轉換器(34)構成為從逆變器(32b)接收PWM電壓，並將PWM電壓轉換為以所決定之運轉頻率驅動冷頭馬達(16a)之冷頭馬達驅動電壓，並將冷頭馬達驅動電壓輸出到冷頭馬達(16a)。冷頭馬達驅動電壓具有與PWM電壓相比降低了高頻成分之波形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:低溫泵</p>  
        <p type="p">12:低溫泵本體</p>  
        <p type="p">14:極低溫冷凍機</p>  
        <p type="p">16:冷頭</p>  
        <p type="p">16a:冷頭馬達</p>  
        <p type="p">18:壓縮機</p>  
        <p type="p">20a:高壓管路</p>  
        <p type="p">20b:低壓管路</p>  
        <p type="p">30:低溫泵控制器</p>  
        <p type="p">32:I/O裝置</p>  
        <p type="p">32a:I/O電路</p>  
        <p type="p">32b:逆變器</p>  
        <p type="p">34:轉換器</p>  
        <p type="p">36:電力電纜</p>  
        <p type="p">38:電力電纜</p>  
        <p type="p">40:電源</p>  
        <p type="p">100:真空裝置</p>  
        <p type="p">102:真空容器</p>  
        <p type="p">104:主機控制器</p>  
        <p type="p">106:輻射管理區域</p>  
        <p type="p">108:輻射遮蔽壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1885" publication-number="202611278"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611278.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611278</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133580</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、藉由使用該組成物處理含金屬膜之方法及藉由使用該組成物製備半導體裝置之方法</chinese-title>  
        <english-title>COMPOSITION, METHOD OF TREATING METAL-CONTAINING FILM BY USING THE COMPOSITION, AND METHOD OF PREPARING SEMICONDUCTOR DEVICE BY USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C11D7/08</main-classification>  
        <further-classification edition="200601120251201B">C11D7/36</further-classification>  
        <further-classification edition="200601120251201B">C23F11/167</further-classification>  
        <further-classification edition="200601120251201B">H01L21/02</further-classification>  
        <further-classification edition="200601120251201B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李錦喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUM HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜炳俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, BYUNGJOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金大鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DAIHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金榮燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNGCHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金貞兒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUNGAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴仁仙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, INSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>禹熙錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOO, HEESUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃圭榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, KYUYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種組成物、一種藉由使用該組成物處理一含金屬膜之方法、及一種藉由使用該組成物製備一半導體裝置之方法。該組成物可包括氫氟酸及一蝕刻控制劑，且該組成物可不包括過氧化氫。該蝕刻控制劑可包括至少一種由式1表示之化合物：&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="137px" width="183px" file="ed10020.JPG" alt="ed10020.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; 式1之描述提供於本說明書中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a composition, a method of treating a metal-containing film by using the composition, and a method of preparing a semiconductor device by using the composition. The composition may include hydrofluoric acid and an etching controller and the composition may not include hydrogen peroxide. The etching controller may include at least one compound represented by Formula 1:&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="136px" width="177px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; A description of Formula 1 is provided in the present specification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1886" publication-number="202612437"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612437.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612437</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133586</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於耗散伺服器系統處之熱的方法、裝置及系統</chinese-title>  
        <english-title>METHODS, DEVICES, AND SYSTEMS FOR DISSIPATING HEAT AT A SERVER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251113B">H05K7/20</main-classification>  
        <further-classification edition="200601120251113B">F28D5/00</further-classification>  
        <further-classification edition="200601120251113B">G05D23/19</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美超微電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUPER MICRO COMPUTER,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳加偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易介士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, CHIEH SHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　曜燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YAOTSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　凱翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, KAI XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案係針對一伺服器系統之熱耗散。一伺服器機架包括一機架結構，該機架結構包括複數個槽。該伺服器機架包括耦接至該機架結構之一第一前邊緣的一第一冷卻劑分配歧管，該第一前邊緣鄰近於該複數個槽延伸。該第一冷卻劑分配歧管包括複數個出口用以將冷卻劑流自該機架結構之該第一前邊緣提供至伺服器。該伺服器機架進一步包括耦接至該機架結構之一第二前邊緣的一第二冷卻劑分配歧管，該第二前邊緣鄰近於該複數個槽延伸。該第二冷卻劑分配歧管包括複數個入口，該入口經組態以自該機架結構之該第二前邊緣收集離開該伺服器之該等冷卻劑流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application is directed to heat dissipation for a server system. A server rack includes a rack structure including a plurality of slots for receiving at least one or more rack servers. The server rack includes a first coolant distribution manifold coupled to a first front edge of the rack structure that extends adjacent to the plurality of slots. The first coolant distribution manifold includes a plurality of outlets configured to provide coolant flows to the one or more rack servers from the first front edge of the rack structure. The server rack further includes a second coolant distribution manifold coupled to a second front edge of the rack structure that extends adjacent to the plurality of slots. The second coolant distribution manifold includes a plurality of inlets configured to collect, from the second front edge of the rack structure, the coolant flows exiting the one or more rack servers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:伺服器機架</p>  
        <p type="p">102:機架結構</p>  
        <p type="p">140:前邊緣</p>  
        <p type="p">140-1:第一前邊緣</p>  
        <p type="p">140-2:第二前邊緣</p>  
        <p type="p">142:出口</p>  
        <p type="p">142-1:出口</p>  
        <p type="p">142-2:出口</p>  
        <p type="p">142-T:出口</p>  
        <p type="p">144:入口</p>  
        <p type="p">144-1:入口</p>  
        <p type="p">144-2:入口</p>  
        <p type="p">144-U:入口</p>  
        <p type="p">150:底座</p>  
        <p type="p">302:冷卻劑分配歧管</p>  
        <p type="p">302-1:第一冷卻劑分配歧管</p>  
        <p type="p">302-2:第二冷卻劑分配歧管</p>  
        <p type="p">304:支撐表面</p>  
        <p type="p">310:冷卻劑分配單元</p>  
        <p type="p">312:冷卻劑管</p>  
        <p type="p">312-1:第一冷卻劑管</p>  
        <p type="p">312-2:第二冷卻劑管</p>  
        <p type="p">314:前表面</p>  
        <p type="p">316:後表面</p>  
        <p type="p">330:入口</p>  
        <p type="p">332:出口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1887" publication-number="202612092"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612092.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612092</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133605</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>被單切後工件的對準</chinese-title>  
        <english-title>ALIGNMENT OF SINGULATED WORKPIECES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">H01L21/68</main-classification>  
        <further-classification edition="200601120251008B">H01L21/683</further-classification>  
        <further-classification edition="200601120251008B">H01L21/677</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商先進裝配系統新加坡有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASMPT SMT SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕普　西蒙　斯圖爾特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAPE, SIMON STUART</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖特　尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHORT, NEIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧爾德漢　雅各布　迪倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLDHAM, JACOB DYLAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃德爾斯坦　傑森　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDELSTEIN, JASON MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內爾　馬里烏斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEL, MARIUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ZA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱昱宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種工件對準器，包括：底座；用於移動工件支撐部的驅動元件，其中，所述驅動元件包括第一、第二和第三旋轉驅動器，每個旋轉驅動器驅動相應的凸輪式轉子，所述凸輪式轉子旋轉時使所述支撐部相對於所述底座移動，以便所述驅動組件可選擇性地操作用於使所述支撐部移動，從而引起所述支撐部平行於平面的平移、所述支撐部圍繞與該平面正交的軸線旋轉，或所述平移與所述旋轉的組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A workpiece aligner, comprising: a base, an actuation assembly for moving a workpiece support, and wherein the actuation assembly comprises first, second and third rotary actuators, each rotary actuator driving a respective cammed rotor which, when rotated, causes the support to move relative to the base, such that the actuation assembly is selectively operative to move the support to cause a translation of the support parallel to a plane, a rotation of the support about an axis orthogonal to that plane, or a combination of said translation and said rotation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:工件對準器</p>  
        <p type="p">12:座</p>  
        <p type="p">14:頭部</p>  
        <p type="p">16:支撐部</p>  
        <p type="p">18A、18B、18C:旋轉驅動器</p>  
        <p type="p">20:軸</p>  
        <p type="p">22A、22B、22C:凸輪式轉子</p>  
        <p type="p">24:止擋構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1888" publication-number="202611988"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611988.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611988</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垂直二維材料選擇性生長方法、垂直二維材料層及半導體裝置</chinese-title>  
        <english-title>METHOD FOR SELECTIVE GROWTH OF VERTICAL 2-DIMENSIONAL MATERIAL, VERTICAL 2-DIMENSIONAL MATERIAL LAYER, AND SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/02</main-classification>  
        <further-classification edition="202501120251201B">H10D30/01</further-classification>  
        <further-classification edition="202501120251201B">H10D62/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商提迪艾思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TDS INNOVATION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓國科學技術院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜奇範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, KI BUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東協</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONG HYEOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴正原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JEONG WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權聖大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, SEONG DAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於垂直二維材料的選擇性成長的方法、通過該方法產生的垂直二維材料層、以及其應用。根據實施例的用於垂直二維材料的選擇性成長的方法包括步驟：形成堆疊結構，其中提供成長區域的選擇性材料層和提供非成長區域的非選擇性材料層在基板上彼此相鄰地堆疊，其中選擇性材料層和非選擇性材料層的每個側表面的至少部分暴露；以及在選擇性材料層的暴露側表面上選擇性地成長二維材料層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for selective growth of a vertical 2-dimensional material, a vertical 2-dimensional material layer produced by the method, and an application of the same are provided. A method for selective growth of a vertical 2-dimensional material according to an embodiment includes steps of; forming a stacked structure in which a selective material layer providing a growth region and a non-selective material layer providing a non-growth region are stacked adjacent to each other on a substrate, in which at least a portion of each side surface of the selective material layer and the non-selective material layer is exposed; and selectively growing a 2-dimensional material layer on an exposed side surface of the selective material layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1889" publication-number="202611358"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611358.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611358</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133630</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液體投放裝置、洗滌裝置及液體投放方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251010B">D06F39/02</main-classification>  
        <further-classification edition="202001120251010B">D06F33/37</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商南京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡承兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHENGBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周寧波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, NINGBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喻飆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, BIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈慎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元瓷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓先山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, XIANSHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種液體投放裝置、洗滌裝置及液體投放方法。該液體投放裝置包括：分液盒，內部形成分液腔，分液盒開設有第一通孔；分液盒開設有與分液腔連通的入液口、第一出液口和第二出液口；儲液件，內部形成儲液腔，至少部分位於分液腔內，且儲液件開設有第二通孔；抽液泵，固定於分液盒，抽液泵的入液端藉由第一通孔、第二通孔連通儲液腔，抽液泵的出液端連通入液口；文丘裡管，與分液盒固定連接，包括漏斗狀結構和文丘裡管主體，文丘裡管主體的收縮段的臨近喉部的部分連接漏斗狀結構，漏斗狀結構具有與第二出液口連通的負壓吸口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:分液盒</p>  
        <p type="p">111:第一出液口</p>  
        <p type="p">161:第二出液通道</p>  
        <p type="p">163:安裝筒</p>  
        <p type="p">164:定位柱</p>  
        <p type="p">400:抽液泵</p>  
        <p type="p">800:文丘裡管</p>  
        <p type="p">810:負壓吸口</p>  
        <p type="p">820:文丘裡管主體</p>  
        <p type="p">830:漏斗狀結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1890" publication-number="202610877"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610877.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610877</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133656</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>載具</chinese-title>  
        <english-title>CARRIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251009B">B62B7/06</main-classification>  
        <further-classification edition="200601120251009B">B60N2/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘知仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, ZHIREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種載具，包括：車架組件；座椅組件，可相對於車架組件轉動並具有第一使用狀態和第二使用狀態；以及連動機構，連接在座椅組件和車架組件之間，用於允許或限制座椅組件在第一使用狀態和第二使用狀態之間切換。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to a carrier, including: a frame assembly; a seat assembly, rotatable relative to the frame assembly and having a first usage state and a second usage state; and a linkage mechanism, connected between the seat assembly and the frame assembly and configured to allow or restrict switching of the seat assembly between the first usage state and the second usage state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:載具</p>  
        <p type="p">100:車架組件</p>  
        <p type="p">110:前輪架</p>  
        <p type="p">111:前杆件</p>  
        <p type="p">112:前橫杆</p>  
        <p type="p">113:前輪座</p>  
        <p type="p">114:前輪</p>  
        <p type="p">120:後輪架</p>  
        <p type="p">121:後杆件</p>  
        <p type="p">122:後輪座</p>  
        <p type="p">123:後輪</p>  
        <p type="p">124:後加強杆</p>  
        <p type="p">125:滑動件</p>  
        <p type="p">200:座椅組件</p>  
        <p type="p">210:圍框架</p>  
        <p type="p">213:連接座</p>  
        <p type="p">230A:連接件</p>  
        <p type="p">230B:配合件</p>  
        <p type="p">240:座椅</p>  
        <p type="p">241:座椅部</p>  
        <p type="p">242:背靠部</p>  
        <p type="p">250:扶手管</p>  
        <p type="p">300:連動機構</p>  
        <p type="p">310:第一連動件</p>  
        <p type="p">320:調節件</p>  
        <p type="p">340:第二連動件</p>  
        <p type="p">400:頂篷組件</p>  
        <p type="p">600:菜籃組件</p>  
        <p type="p">700:車手組件</p>  
        <p type="p">710:上車手架</p>  
        <p type="p">711:第一支撐管</p>  
        <p type="p">712:推手管</p>  
        <p type="p">720:下車手架</p>  
        <p type="p">721:第二支撐管</p>  
        <p type="p">750:卡合件</p>  
        <p type="p">751:滑套</p>  
        <p type="p">F:前向</p>  
        <p type="p">B:後向</p>  
        <p type="p">L:左向</p>  
        <p type="p">R:右向</p>  
        <p type="p">D1:橫向</p>  
        <p type="p">D2:縱向</p>  
        <p type="p">Q1:第一樞轉點</p>  
        <p type="p">Q3:第三樞轉點</p>  
        <p type="p">Q4:第四樞轉點</p>  
        <p type="p">Q5:第五樞轉點</p>  
        <p type="p">W1:第一限位支撐點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1891" publication-number="202610563"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610563.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610563</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133722</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>按扣及帶有織帶的按扣</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251202B">A44B17/00</main-classification>  
        <further-classification edition="200601120251202B">A44B11/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商摩理都股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼崎製罐股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMAGASAKI SEIKAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前川美菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEGAWA, MINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三好貞雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYOSHI, SADAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保裕太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBO, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在雌按扣與雄按扣相卡合的狀態下，雌按扣的卡合突起的外周部分與雌按扣的卡合接收部的外周部分之間存在間隙，當雄按扣的外周部分被按壓時，以嵌合孔與卡合突起的卡合部為支點，雄按扣相對於雌按扣傾斜規定角度，從而雌按扣與雄按扣之間的卡合被解除。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:雌側布料</p>  
        <p type="p">3:雄側布料</p>  
        <p type="p">10:按扣</p>  
        <p type="p">20:雌按扣</p>  
        <p type="p">21:雌側基部</p>  
        <p type="p">22:卡合接收部</p>  
        <p type="p">23:嵌合孔</p>  
        <p type="p">24:卡合槽部</p>  
        <p type="p">25:凹部</p>  
        <p type="p">30:雄按扣</p>  
        <p type="p">31:雄側基部</p>  
        <p type="p">32:卡合突起</p>  
        <p type="p">33:基座部</p>  
        <p type="p">34:突起部</p>  
        <p type="p">35:大徑部</p>  
        <p type="p">Y1:箭頭</p>  
        <p type="p">α1:傾斜角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1892" publication-number="202611994"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611994.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611994</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133769</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用選擇性介電質上介電質(DOD)沉積製程製造半導體裝置之技術</chinese-title>  
        <english-title>MANUFACTURING SEMICONDUCTOR DEVICE USING SELECTIVE DIELECTRIC ON DIELECTRIC (DOD) DEPOSITION PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L21/205</main-classification>  
        <further-classification edition="200601120251204B">H01L21/324</further-classification>  
        <further-classification edition="200601120251204B">B08B3/08</further-classification>  
        <further-classification edition="200601120251204B">B08B3/04</further-classification>  
        <further-classification edition="200601120251204B">C23C18/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商默克專利有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成永薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, YOUNGHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, GUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程嵐霞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, LANXIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佩　布尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOPE, BHUSHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　秉槿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, BYUNGKEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宣惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, SUNHYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺侖廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, YOUNJOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種製造半導體裝置之方法，其包括：提供包括安置於一基體上之一第一絕緣圖案及一金屬圖案的一結構；執行清潔該結構之一清潔製程；將該結構暴露於一還原劑；在該金屬圖案上選擇性地形成一鈍化層；在該第一絕緣圖案上選擇性地形成一第二絕緣圖案；以及對該結構執行熱處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing a semiconductor device includes providing a structure including a first insulating pattern and a metal pattern disposed on a substrate, performing a cleaning process cleaning the structure, exposing the structure to a reduction agent, forming, selectively, a passivation layer on the metal pattern, forming, selectively, a second insulating pattern on the first insulating pattern, and performing thermal processing on the structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基體</p>  
        <p type="p">110:第一絕緣圖案</p>  
        <p type="p">120:金屬圖案</p>  
        <p type="p">160:第二絕緣圖案</p>  
        <p type="p">STR:結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1893" publication-number="202611056"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611056.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611056</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133779</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光刻膠組合物及使用所述組合物形成圖案的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">C07F7/22</main-classification>  
        <further-classification edition="200601120251001B">C08F30/04</further-classification>  
        <further-classification edition="200601120251001B">C08F220/10</further-classification>  
        <further-classification edition="200601120251001B">C08K5/57</further-classification>  
        <further-classification edition="200601120251001B">C08L33/04</further-classification>  
        <further-classification edition="200601120251001B">C08L43/00</further-classification>  
        <further-classification edition="200601120251001B">G03F7/004</further-classification>  
        <further-classification edition="200601120251001B">G03F7/20</further-classification>  
        <further-classification edition="200601120251001B">G03F7/40</further-classification>  
        <further-classification edition="200601120251001B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河京珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, KYOUNGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南宮爛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMGUNG, RAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋大錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, DAESEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體光刻膠組合物及使用所述半導體光刻膠組合物形成圖案的方法。半導體光刻膠組合物包含：有機金屬化合物；(甲基)丙烯酸酯類聚合物，包含選自各自具有2到6的化合價的金屬之中的至少一者；以及溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor photoresist composition and a method of forming patterns using the semiconductor photoresist composition are provided. The semiconductor photoresist composition includes an organometallic compound; a (meth)acrylate-based polymer including at least one selected from among metals each having a valence of 2 to 6; and a solvent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板/半導體基板</p>  
        <p type="p">108:光刻膠圖案</p>  
        <p type="p">112:有機膜圖案</p>  
        <p type="p">114:薄膜圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1894" publication-number="202611647"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611647.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611647</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133792</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控壓閥控制方法、控制裝置以及半導體加工設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">G05B11/42</main-classification>  
        <further-classification edition="200601120251128B">F16K31/00</further-classification>  
        <further-classification edition="200601120251128B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京華丞電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜傳正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭文寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒義濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹洋湧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種控壓閥控制方法、控制裝置以及半導體加工設備。其中，方法包括：回應於檢測到的被控部件的實際壓力值未達到預設的目標壓力值，確定由實際壓力值到達目標壓力值所需的第一剩餘時間；回應於第一剩餘時間大於預設時間閾值，對實際壓力值和目標壓力值的差值採用PID演算法計算出第一調整量；基於使被控部件的實際壓力值達到目標壓力值所需的控壓閥的控制參數對第一調整量進行調整，得到第二調整量；根據第二調整量對控壓閥的控制參數進行調整，以使被控部件達到目標壓力值的第二剩餘時間小於第一剩餘時間，從而提高控壓閥的調節效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1,S21~S23,S31~S32:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1895" publication-number="202612013"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612013.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612013</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨墊的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251026B">H01L21/304</main-classification>  
        <further-classification edition="201201120251026B">B24B37/04</further-classification>  
        <further-classification edition="201201120251026B">B24B37/22</further-classification>  
        <further-classification edition="201201120251026B">B24B37/013</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士紡控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIBO HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮内慶樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAUCHI, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種窗構件的背面與第二片的接著面的密接性優異的帶終點檢測窗（窗構件）的研磨墊的製造方法。揭示一種研磨墊的製造方法，包括如下步驟：準備研磨墊的步驟；以及於所述研磨墊周圍的壓製機下壓盤上配置規定厚度的間隔件，利用壓製機對所述研磨墊進行壓製的步驟，所述研磨墊包含具有第一貫通孔的第一片、具有第二貫通孔的第二片、及窗構件，所述研磨墊中，所述第一片具有用於研磨被研磨物的研磨面，所述第二片與所述第一片的與研磨面為相反側的面貼合，所述第二貫通孔形成為，所述第二貫通孔的外周部被所述第一貫通孔的外周部覆蓋，以所述窗構件的最上部較研磨面更低的方式將所述窗構件配置於所述第一貫通孔內且為所述第二片上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:研磨墊</p>  
        <p type="p">2:第一片</p>  
        <p type="p">3:第二片</p>  
        <p type="p">4:窗構件</p>  
        <p type="p">4':窗構件的最上部</p>  
        <p type="p">5:第一貫通孔</p>  
        <p type="p">6:第二貫通孔</p>  
        <p type="p">7:露出部</p>  
        <p type="p">8:槽</p>  
        <p type="p">8':槽的最下部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1896" publication-number="202611047"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611047.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611047</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133820</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種作為TNF活性調節劑的稠合五環苯並咪唑衍生物及其製備方法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251021B">C07D487/14</main-classification>  
        <further-classification edition="200601120251021B">C07D487/22</further-classification>  
        <further-classification edition="200601120251021B">A61K31/506</further-classification>  
        <further-classification edition="200601120251021B">A61P29/00</further-classification>  
        <further-classification edition="200601120251021B">A61P37/00</further-classification>  
        <further-classification edition="200601120251021B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商蘇州湃玥生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZHOU PAIYUE THERAPEUTICS CO. LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王靖方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JINGFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋治東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, ZHIDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仝思雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, SIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淩煒康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LING, WEIKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種式（I）所示的作為TNF活性調節劑的稠合五環苯並咪唑衍生物，其製備方法，包含其的藥物組合物，及其醫藥用途，所述化合物對TNFα誘導的NF-κB訊號通路活化具有較強的抑制作用，同時所述化合物具有優異的藥代動力學和藥效動力學特性，可用於治療TNFα相關疾病，臨床應用前景高。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1897" publication-number="202611779"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611779.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611779</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133841</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>神經處理器中非線性函數的參數程式化</chinese-title>  
        <english-title>PROGRAMMING OF PARAMETERS FOR NONLINEAR FUNCTION IN NEURAL PROCESSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">G06N3/04</main-classification>  
        <further-classification edition="202301120251201B">G06N3/063</further-classification>  
        <further-classification edition="200601120251201B">G06T1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德爾　湯瑪斯　格雷戈里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDERL, THOMAS GREGORY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈塔米法爾德　賽義德　卡倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHATAMIFARD, SAYYED KAREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬克爾　傑佛瑞　丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARKER, JEFFREY DEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例係關於將表示非線性函數的參數儲存在神經處理器電路的可程式化記憶體電路中，並跨多個任務重複使用經儲存參數。該等參數最初包括在定義一任務的神經處理器電路組態的任務描述符中，並經程式化至可程式化記憶體電路中。其他非線性函數的參數儲存在非可程式化記憶體電路中。在後續任務中，藉由在後續任務的任務描述符中指示待從其檢索參數的可程式化或非可程式化記憶體電路，重複使用經儲存參數來產生激勵值，以應用於來自乘法累加(MAC)電路的經處理輸出。藉由在後續任務中用記憶體電路的指示來取代非線性函數的參數，減少待包括在後續任務的任務描述符中的資料量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure relate to storing parameters representing nonlinear functions in programmable memory circuits of a neural processor circuit and reusing the stored parameters across multiple tasks. The parameters are initially included in a task descriptor defining the configuration of the neural processor circuit for a task and are programmed into programmable memory circuits. Parameters for other nonlinear functions are stored in non-programmable memory circuits. In subsequent tasks, the stored parameters are reused to generate activation values for applying to processed output from multiply-accumulate (MAC) circuit by indicating, in task descriptors for the subsequent tasks, programmable or nonprogrammable memory circuits from which the parameters are to be retrieved. By replacing the parameters of the nonlinear functions with the indication of the memory circuits in the subsequent tasks, the amount of data to be included in the task descriptors of the subsequent tasks is reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">218:神經處理器電路</p>  
        <p type="p">230:系統記憶體</p>  
        <p type="p">310:神經任務管理器</p>  
        <p type="p">314A~314N:神經引擎</p>  
        <p type="p">318:資料緩衝器</p>  
        <p type="p">320:緩衝器DMA</p>  
        <p type="p">322A~322N:輸入資料</p>  
        <p type="p">324:核心直接記憶體存取(DMA)</p>  
        <p type="p">326A~326N:核心資料</p>  
        <p type="p">336:編譯器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1898" publication-number="202611038"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611038.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611038</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133847</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用作CDK4蛋白激酶抑制劑的化合物及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D405/14</main-classification>  
        <further-classification edition="200601120251201B">C07D417/14</further-classification>  
        <further-classification edition="200601120251201B">C07D413/14</further-classification>  
        <further-classification edition="200601120251201B">C07D491/052</further-classification>  
        <further-classification edition="200601120251201B">C07D401/14</further-classification>  
        <further-classification edition="200601120251201B">A61K31/506</further-classification>  
        <further-classification edition="200601120251201B">A61K31/4439</further-classification>  
        <further-classification edition="200601120251201B">A61P29/00</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification>  
        <further-classification edition="200601120251201B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商浙江同源康醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYK MEDICINES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁阿朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, APENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, ZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　少清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHAOQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　豫生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　美華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MEIHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及用作CDK4蛋白激酶抑制劑的化合物及其應用。本發明還公開了所述化合物的製備方法及其在預防和/或治療CDK4相關疾病方面的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1899" publication-number="202610577"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610577.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610577</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133853</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔機器人的控制方法及裝置、介質及電子設備</chinese-title>  
        <english-title>CONTROL METHOD AND APPARATUS FOR CLEANING ROBOT, MEDIUM AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251027B">A47L11/28</main-classification>  
        <further-classification edition="200601120251027B">A47L11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>单建强</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAN, JIANQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種清潔機器人的控制方法、清潔機器人的控制裝置、電腦可讀取儲存介質及電子設備，方法包括：在識別到待清潔區域中包括地毯的情況下，從多個候選地毯類型中確定所述地毯的目標地毯類型；所述多個候選地毯類型包括根據地毯毛的長度對地毯劃分的類型；根據所述目標地毯類型，控制所述清潔機器人執行相應的指令。該方法可以在待清潔區域包括地毯的情況下，對清潔機器人進行合理、有效的控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a control method for a cleaning robot, a control apparatus for a cleaning robot, a computer-readable storage medium and an electronic device. The method includes: in a case of identifying that a carpet is included in a region to be cleaned, determining a target carpet type of the carpet from a plurality of candidate carpet types, where the plurality of candidate carpet types include carpet types classified based on lengths of carpet fibers; and controlling, according to the target carpet type, the cleaning robot to execute a corresponding instruction. According to this method, in a case that a carpet is included in a region to be cleaned, the cleaning robot may be controlled reasonably and effectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110,S120:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1900" publication-number="202611082"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611082.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611082</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種抗CEACAM5抗體及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/28</main-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">C12N15/13</further-classification>  
        <further-classification edition="200601120251201B">C12N15/63</further-classification>  
        <further-classification edition="200601120251201B">C12N15/64</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京泰德製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING TIDE PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李维</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何景昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, JINGCHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孙宇航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YUHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彦明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YANMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭婷婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, TINGTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于红亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HONGLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種抗CEACEA5抗體及其應用，特別是特異性結合CEACAM5 A3-B3結構域的抗體。本發明的CEACAM5抗體與人、食蟹猴CEACEA5具有交叉活性，且特異結合CEACAM5的A3-B3表位，為靶向CEACAM5分子的腫瘤治療或診斷試劑開發提供抗體候選分子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1901" publication-number="202611468"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611468.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611468</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133871</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保護殼及其氣流產生方法</chinese-title>  
        <english-title>PROTECTIVE CASE AND AIRFLOW GENERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251126B">F28F9/24</main-classification>  
        <further-classification edition="200601120251126B">F04D29/40</further-classification>  
        <further-classification edition="200601120251126B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商知微電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XMEMS LABS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　馬丁喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, MARTIN GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一種保護殼及其氣流產生方法可為一便攜式電子裝置散熱。保護殼包括適於容置便攜式電子裝置的一殼體以及整合在殼體內的一氣流產生裝置。藉由提供外部主動冷卻及包覆保護功能，保護殼可在不修改便攜式電子裝置內部結構的情況下，提升便攜式電子裝置的性能及可靠性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A protective case and an airflow generating method thereof are disclosed to dissipate heat from a portable electronic device. The protective case includes a housing, adapted to accommodate the portable electronic device, and an airflow generating device, integrated in the housing. By providing external active cooling and protective covering functions, the protective case improves performance and reliability of the portable electronic device without requiring modifications to its internal configuration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:保護殼</p>  
        <p type="p">100:AFG裝置</p>  
        <p type="p">100S1,100S2,150Si:表面</p>  
        <p type="p">150:殼體</p>  
        <p type="p">155:空間</p>  
        <p type="p">156:開口</p>  
        <p type="p">159:凹部</p>  
        <p type="p">190:便攜式電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1902" publication-number="202612185"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612185.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612185</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133890</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器和電連接組件</chinese-title>  
        <english-title>CONNECTOR AND ELECTRICAL CONNECTION ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250926B">H01R13/11</main-classification>  
        <further-classification edition="200601120250926B">H01R13/115</further-classification>  
        <further-classification edition="200601120250926B">H01R13/436</further-classification>  
        <further-classification edition="200601120250926B">H01R13/514</further-classification>  
        <further-classification edition="200601120250926B">H01R13/652</further-classification>  
        <further-classification edition="200601120250926B">H01R25/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商泰科電子(上海)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYCO ELECTRONICS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商太谷康奈特提威提索洛訊有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TE CONNECTIVITY SOLUTIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉嬌勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JIAOYONG (MAC)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, JIE (ROGER)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪保拉　帕特里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DI PAOLA, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種連接器和電連接組件。所述連接器包括：絕緣殼，具有在其縱向上相對的前對配口和後開口、在其橫向上相對的一對側開口以及在其橫向上並排佈置的兩個容納室；一對接觸端子，分別安裝到所述絕緣殼的兩個容納室中並分別具有前接觸部和側接觸部；和一對連接端子，分別插裝到所述絕緣殼的一對側開口中並分別與所述一對接觸端子的側接觸部對配，所述一對接觸端子的前接觸部位於所述絕緣殼的前對配口中，用於與插入所述前對配口的對配連接器的對配插頭電接觸，所述連接端子的一部分從所述絕緣殼的側開口外露出，用於電連接至電連接件。因此，本發明能夠極大地減小連接器在其縱向上的長度尺寸，擴大了連接器的應用範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a connector and an electrical connection assembly. The connector comprises: an insulation shell which has a front mating port and a rear opening that are opposite in its longitudinal direction, a pair of side openings that are opposite in its transverse direction, and two receiving chambers arranged side by side in its transverse direction; a pair of contact terminals which are respectively installed into two receiving chambers of the insulation shell and each has a front contact part and a side contact part; and a pair of connection terminals which are respectively inserted into the pair of side openings of the insulation shell and respectively mated with the side contact parts of the pair of contact terminals. The front contact parts of the pair of contact terminals are located in the front mating port of the insulation shell for electrical contact with a mating plug of a mating connector inserted into the front mating port; a part of the connection terminal is exposed from the side opening of the insulation shell for electrical connection to an electrical connecting member. Therefore, the present invention can greatly reduce the length dimension of the connector in its longitudinal direction, expanding the application range of the connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:接觸端子</p>  
        <p type="p">3:連接端子</p>  
        <p type="p">4:套筒</p>  
        <p type="p">14:前壁部</p>  
        <p type="p">14a:卡槽</p>  
        <p type="p">21:前接觸部</p>  
        <p type="p">22:側接觸部</p>  
        <p type="p">42:固定部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1903" publication-number="202612195"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612195.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612195</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133891</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251001B">H01R13/6461</main-classification>  
        <further-classification edition="200601120251001B">H01R13/648</further-classification>  
        <further-classification edition="201101120251001B">H01R13/6587</further-classification>  
        <further-classification edition="200601120251001B">H01R13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商泰科電子(上海)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYCO ELECTRONICS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄔恒康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HENGKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張新杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XINJIE (DAVID)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中描述一種電連接器，包括：殼體；和兩個端子組件，相鄰且並列置於所述殼體內，每個端子組件包括端子組件包括：至少一組導電端子，平行於所述殼體的縱向延伸，每組導電端子包括一對信號端子和一對接地端子；至少一根電纜，每根電纜包括分別與相應組導電端子中的信號端子成導電連接的一對信號芯線；和安裝基座，所述至少一組導電端子穿過所述安裝基座且由所述安裝基座分為在朝向所述至少一根電纜一側的安裝段、和相反側上的自由端。所述電連接器還包括接地件，與一個端子組件的相應接地端子成導電連接，且整體覆蓋所述一個端子組件的相應信號端子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13:接地件</p>  
        <p type="p">131:上游接地部</p>  
        <p type="p">131a:主體</p>  
        <p type="p">131b:焊接腳</p>  
        <p type="p">131c:凸片</p>  
        <p type="p">132:下游接地部</p>  
        <p type="p">133:過渡部</p>  
        <p type="p">1311:安裝基部</p>  
        <p type="p">1312:接觸臂</p>  
        <p type="p">1320:焊接孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1904" publication-number="202612325"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612325.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612325</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133898</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊編解碼方法及相關裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251103B">H04N19/117</main-classification>  
        <further-classification edition="201401120251103B">H04N19/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱世鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, SHIH-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭裕霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江宥呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YOU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TZU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳渏紋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃毓文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種用於重構視訊的適應性環路濾波器 (ALF) 處理的方法和裝置。根據該方法，接收輸入資料，其中，所述輸入資料包括當前塊中的當前重構像素。所述方法發送或解析編碼在一個或多個自適應參數集 (APS) 中的至少一部分 ALF 控制資訊。根據所述 ALF 控制資訊，透過對當前重構像素應用 ALF 處理，得到濾波後的輸出資料。提供濾波後重構像素，其中，所述濾波後重建像素包括濾波後的輸出資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and apparatus for Adaptive Loop Filter (ALF) processing of reconstructed video are disclosed. According to the method, input data is received, wherein the input data comprises current reconstructed pixels in a current block. At least part of ALF control information coded in one or more APSs (Adaptation Parameter Sets) is signalled or parsed. Filtered output data by applying ALF process to the current reconstructed pixels according to the ALF control information is derived. Filtered-reconstructed pixels are provided, wherein the filtered-reconstructed pixels comprise the filtered output data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1210~1240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1905" publication-number="202610578"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610578.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610578</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133900</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔組件的控制方法、清潔設備、存儲介質、電子設備</chinese-title>  
        <english-title>CONTROL METHOD OF CLEANING ASSEMBLY, CLEANING DEVICE, STORAGE MEDIUM AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251017B">A47L11/28</main-classification>  
        <further-classification edition="200601120251017B">A47L11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張鎮鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHENPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙立棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LIDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>單建強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAN, JIANQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘潤偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, RUNWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及智慧家居技術領域，提供了一種清潔組件的控制方法、清潔設備、電腦可讀存儲介質、電子設備，其中，清潔組件包含磁體，清潔組件通過磁體可拆卸的設於清潔模組中的升降套筒上，升降套筒至少部分由與磁體產生磁力的材料構成，清潔模組中還設置有驅動電機和磁敏感測器，上述方法包括：在接收到清潔組件控制指令後，通過磁敏感測器採集磁體產生的磁感應資料以檢測目標清潔組件的初始位置；清潔組件控制指令包括安裝指令或拆卸指令；根據清潔組件控制指令的類型，結合驅動電機的里程資料和磁感應資料中的至少一項，控制目標清潔組件從初始位置變動至期望位置，實現對目標清潔組件的安裝或拆卸操作。本公開能實現清潔組件的自動安裝或拆卸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to the technical field of smart homes, and provides a control method of a cleaning assembly, a cleaning device, a computer-readable storage medium and an electronic device, wherein the cleaning assembly comprises a magnet, the cleaning assembly is detachably arranged on a lifting sleeve in a cleaning module through the magnet, the lifting sleeve is at least partially made of a material which generates magnetic force with the magnet, and a driving motor and a magnetic sensor are also arranged in the cleaning module. The above method comprises: after receiving a control instruction of the cleaning assembly, collecting magnetic induction data generated by a magnet through a magnetic sensor to detect the initial position of a target cleaning assembly; the control instruction of the cleaning assembly includes an installation instruction or a disassembly instruction; according to the type of the control instruction of the cleaning assembly, combining at least one of the mileage data and the magnetic induction data of the driving motor, controlling the target cleaning assembly to move from the initial position to the expected position, so as to realize the installation or disassembly operation of the target cleaning assembly. The present disclosure can realize automatic installation or disassembly of the cleaning assembly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110:步驟</p>  
        <p type="p">S120:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1906" publication-number="202610603"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610603.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610603</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於眼用裝置的藍色過濾器組合</chinese-title>  
        <english-title>BLUE FILTER COMBINATIONS FOR OPHTHALMIC DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61F2/16</main-classification>  
        <further-classification edition="200601120251201B">A61L27/16</further-classification>  
        <further-classification edition="200601120251201B">A61L27/34</further-classification>  
        <further-classification edition="200601120251201B">A61L27/50</further-classification>  
        <further-classification edition="200601120251201B">C08F220/18</further-classification>  
        <further-classification edition="200601120251201B">C08F220/28</further-classification>  
        <further-classification edition="200601120251201B">C08F220/34</further-classification>  
        <further-classification edition="200601120251201B">C08F220/60</further-classification>  
        <further-classification edition="200601120251201B">C08F222/20</further-classification>  
        <further-classification edition="200601120251201B">C08L33/10</further-classification>  
        <further-classification edition="200601120251201B">C09B69/10</further-classification>  
        <further-classification edition="200601120251201B">G02B1/04</further-classification>  
        <further-classification edition="200601120251201B">G02C7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商德雷安控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TELEON HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡洛里　朱塞佩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAROLI, GIUSEPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供具備改良之藍色過濾功能的眼用裝置，其可能比以往更接近地模擬人類老化眼睛之透射率。本發明另外提供獲得此類眼用裝置之方法，以及其用於預防或治療一退行性眼部疾病之應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides ophthalmic devices provided with improved blue filtering, mimicking the transmittance of the human ageing eye closer than hitherto possible. The invention furthermore provides methods to obtain such ophthalmic devices, as well as application thereof for prevention or treatment of a degenerative eye disease.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1907" publication-number="202612294"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612294.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612294</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133979</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H04B7/22</main-classification>  
        <further-classification edition="202301120251201B">H04W72/541</further-classification>  
        <further-classification edition="200601120251201B">H04B1/04</further-classification>  
        <further-classification edition="200601120251201B">H04L27/26</further-classification>  
        <further-classification edition="200601120251201B">H04L5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李盼盼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, PANPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊訊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及通信技術領域，尤其涉及一種通信方法及裝置。例如：本申請可以應用於AMP領域本申請的通信方法及裝置支援AMP有關的協定，或者適用於IEEE 802.11a/b/g協定、802.11n協定、802.11ac協定、802.11ax協定、802.11be協定或者802.11bn協定以及IEEE802.11系列的其他協定。該方法中，信號的傳輸頻寬或者發送功率可以由OOK調製中開符號的持續時長（或資料率）確定，或者由拓撲結構確定。從而，通過調整傳輸頻寬或發送功率，可以降低信號的旁瓣幅度，降低對相鄰通道的干擾。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to the field of communication technology, particularly to a communication method and device. For instance, the communication method and device of this application can be applied to the AMP domain, or applied to IEEE 802.11a/b/g protocols, 802.11n protocol, 802.11ac protocol, 802.11ax protocol, 802.11be protocol, or 802.11bn protocol, as well as other protocols in the IEEE 802.11 series. In this method, the transmission bandwidth or transmission power of the signal can be determined by the duration (or data rate) of the ON symbol in OOK modulation, or by the topology structure. Thus, by adjusting the transmission bandwidth or transmission power, the side lobe amplitude of the signal can be reduced and interference with adjacent channels can be decreased.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500、501、502、511、512、513:步驟</p>  
        <p type="p">51、52:方式</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1908" publication-number="202612097"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612097.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612097</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134008</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基座</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01L21/683</main-classification>  
        <further-classification edition="200601120251001B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商美科陶瓷科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICO CERAMICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳正哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, JUNG CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種基座。根據本發明的基座包括絕緣板，在所述絕緣板配置有層疊的第一層的第一發熱體和第二層的第二發熱體；所述第一發熱體連接在第一端子對之間，所述第二發熱體連接在第二端子對之間；所述第一發熱體包括：多個同心的圓弧形第一電阻部；以及多個第一連接部，用於使位於不同直徑的位置的多個所述電阻部連接，多個所述第一連接部的至少一個橫穿用於使多個所述第一電阻部中的每一個的兩側端部之間的多個中心連接的虛擬線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301a、301b:第一端子對</p>  
        <p type="p">302a、302b:第二端子對</p>  
        <p type="p">310:主發熱體</p>  
        <p type="p">320:第一補償發熱體</p>  
        <p type="p">500:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1909" publication-number="202611938"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611938.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611938</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134031</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於動態位址的資料可靠性</chinese-title>  
        <english-title>DYNAMIC ADDRESS-BASED DATA RELIABILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251113B">G11C29/52</main-classification>  
        <further-classification edition="200601120251113B">G06F11/08</further-classification>  
        <further-classification edition="200601120251113B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑特　羅伯特　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JETER, ROBERT E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭靖奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, JINGKUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種記憶體子系統。該記憶體子系統包括一記憶體控制器及具有至少一第一秩及一第二秩的一記憶體，該第一秩及該第二秩可彼此分開定址。該記憶體控制器經組態以回應於接收到一寫入命令而判定對應資料將寫入至一單一秩或多個秩。當寫入至多個秩時，資料可從該多個秩讀取，其中執行比較以用於錯誤檢查。與一些寫入命令相關聯的資料可僅寫入至一單一秩，從而放棄錯誤保護。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory subsystem is disclosed. The memory subsystem includes a memory controller and a memory having at least a first rank and a second rank, the first and second ranks being separately addressable from one another. The memory controller is configured to, in response to receiving a write command, determine if corresponding data is to be written to a single rank or to multiple ranks. When written to multiple ranks, data can be read from the multiple ranks, with comparisons being performed for error checking. Data associated with some write commands may be written to only a single rank, forgoing error protection.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體子系統</p>  
        <p type="p">105:記憶體控制器</p>  
        <p type="p">107:位址</p>  
        <p type="p">107A:位址位元</p>  
        <p type="p">107C:碼</p>  
        <p type="p">110:記憶體電路；記憶體</p>  
        <p type="p">110A:第一秩</p>  
        <p type="p">110B:第二秩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1910" publication-number="202610964"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610964.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610964</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化鋯增韌氧化鋁、燒結陶瓷體、及相關方法</chinese-title>  
        <english-title>ZIRCONIA-TOUGHENED ALUMINA, SINTERED CERAMIC BODIES, AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251017B">C04B41/87</main-classification>  
        <further-classification edition="200601120251017B">C04B35/106</further-classification>  
        <further-classification edition="200601120251017B">C03C6/04</further-classification>  
        <further-classification edition="200601120251017B">C04B35/575</further-classification>  
        <further-classification edition="200601120251017B">H01L21/423</further-classification>  
        <further-classification edition="202201120251017B">C01F7/02</further-classification>  
        <further-classification edition="200601120251017B">C01G25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　路克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALKER, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐納隆　馬修喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONELON, MATTHEW JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊特　傑米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WRIGHT, JEREMY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯伊拉臘　蘇迪普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOIRALA, SUDIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述經燒結氧化鋯增韌氧化鋁(zirconia-toughened alumina, ZTA)（例如，呈經燒結氧化鋯增韌氧化鋁體的形式）、及製備此等燒結體之方法，其中該經燒結ZTA包括二氧化矽，其用以改善該經燒結ZTA的機械加工性性質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described is sintered zirconia-toughened alumina (ZTA), e.g., in the form of a sintered zirconia-toughened alumina body, and methods of preparing these sintered bodies, wherein the sintered ZTA includes silica to improve a machinability property of the sintered ZTA.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:耐電漿層</p>  
        <p type="p">102:支撐層</p>  
        <p type="p">d1:厚度</p>  
        <p type="p">d2:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1911" publication-number="202611057"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611057.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611057</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134061</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分子內穩定化單烷基金屬烷氧基化合物及其用途</chinese-title>  
        <english-title>INTRAMOLECULAR STABILIZED MONO ALKYL METAL ALKOXIDES AND THEIR USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07F7/22</main-classification>  
        <further-classification edition="200601120251201B">C07F7/30</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/16</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞伊　珍　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WREE, JAN-LUCAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅希曼　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEHLMANN, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥伊　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAI, LUKAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬圖里　馬克馬塞洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATURI, MARK MARCELLO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海爾　霍格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIL, HOLGER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷　新建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, XINJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊瓦諾夫　塞基Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IVANOV, SERGEI V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳展俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示及請求保護的標的涉及式(XR)M(OR&lt;sup&gt;1&lt;/sup&gt;)&lt;sub&gt;3&lt;/sub&gt;的單烷基金屬化合物、其在沉積含金屬膜的配方和方法中的用途以及其在EUV光微影中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosed and claimed subject matter relates to mono alkyl metal compounds of the formula (XR)M(OR&lt;sup&gt;1&lt;/sup&gt;)&lt;sub&gt;3&lt;/sub&gt;, the use thereof in formulations and methods for depositing metal-containing films and the use thereof for EUV lithography.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1912" publication-number="202612299"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612299.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612299</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於通道估計的系統和方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR CHANNEL ESTIMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251208B">H04B17/309</main-classification>  
        <further-classification edition="201501120251208B">H04B17/318</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿蒂亞　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATTIA, MOHAMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩納　費德里科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENNA, FEDERICO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權　赫俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, HYUK JOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵東運</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAI, DONGWOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露用於通道估計的系統和方法。在一些實施例中，方法包括：由接收器在第n點時間計算第一通道估計，計算包括計算第（n+D）個狀態向量，第（n+D）個狀態向量對應於第（n+D）個時間點的通道歷史，D為正整數；基於第一通道估計對接收信號執行信號處理，以產生處理資料；以及發射處理資料至資料消費者，第（n+D）個狀態向量包括自p個更新間隔的元件，第n點時間的第一通道估計包括k個子載波中每一個的元件，k為正整數，以及第（n+D）個狀態向量具有少於kp（D+1）個元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and a method are disclosed for channel estimation. In some embodiments, a method includes: calculating, by a receiver, a first channel estimate, at an nth point in time, the calculating including calculating an (n+D)th state vector, the (n+D)th state vector corresponding to a channel history at an (n+D)th point in time, D being a positive integer; performing signal processing of a received signal, based on the first channel estimate, to generate processed data; and transmitting the processed data to a data consumer, the (n+D)th state vector including elements from p update intervals, the first channel estimate at the nth point in time including an element for each of k subcarriers, k being a positive integer, and the (n+D)th state vector having fewer than kp(D+1) elements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600、605、610:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1913" publication-number="202611059"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611059.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611059</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134108</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種二肽類化合物的製備方法</chinese-title>  
        <english-title>A METHOD FOR PREPARING A DIPEPTIDE COMPOUND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K5/06</main-classification>  
        <further-classification edition="200601120251201B">A61K38/05</further-classification>  
        <further-classification edition="200601120251201B">C07K1/00</further-classification>  
        <further-classification edition="200601120251201B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商浙江華海藥業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHEJIANG HUAHAI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種二肽類化合物的製備方法，所述方法易實施，總收率高，所得產物雜質含量少，易純化，各中間體品質易於控制，適合工業化生產。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for preparing a dipeptide compound. The method is easy to implement, has a high total yield, results in products with low impurity content, is easy to purify, allows for easy control of the quality of each intermediate, and is suitable for industrial production.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1914" publication-number="202612153"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612153.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612153</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134116</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L23/528</main-classification>  
        <further-classification edition="200601120251201B">H01L23/535</further-classification>  
        <further-classification edition="200601120251201B">H01L23/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱桑茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, SANG-MAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳麒元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林世欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭益廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種半導體結構。該半導體結構包括一基板。該基板包括一具有第一頂面和第一底面的第一核心。第一介電層設置在該第一核心的第一頂面和第一底面上。該基板具有穿過該第一核心的第一孔。此外，該基板具有穿過該第一核心和該第一介電層的第二孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure is provided. The semiconductor structure includes a substrate. The substrate includes a first core having a first top surface and a first bottom surface. First dielectric layers are disposed on the first top surface and the first bottom surface of the first core. The substrate has a first hole passing through the first core. In addition, the substrate has a second hole passing through the first core and the first dielectric layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:核心</p>  
        <p type="p">204:導電材料</p>  
        <p type="p">205:非導電材料</p>  
        <p type="p">206:導電材料</p>  
        <p type="p">208:導電層</p>  
        <p type="p">210:介電層</p>  
        <p type="p">212:通孔</p>  
        <p type="p">222:通孔</p>  
        <p type="p">224:導電層</p>  
        <p type="p">230:基板重分佈層</p>  
        <p type="p">200A:基板</p>  
        <p type="p">202B:底面</p>  
        <p type="p">202T:頂面</p>  
        <p type="p">204T1:端子</p>  
        <p type="p">204T2:端子</p>  
        <p type="p">205-1:非導電材料部分</p>  
        <p type="p">205-2:非導電材料部分</p>  
        <p type="p">206T1:端子</p>  
        <p type="p">206T2:端子</p>  
        <p type="p">210-1:核心重分佈層</p>  
        <p type="p">210-1B:內表面</p>  
        <p type="p">210-2:核心重分佈層</p>  
        <p type="p">210-2B:內表面</p>  
        <p type="p">220A:核心結構</p>  
        <p type="p">220AB:底面</p>  
        <p type="p">220AT:頂面</p>  
        <p type="p">222-1:通孔</p>  
        <p type="p">222-2:通孔</p>  
        <p type="p">224-1:導電層</p>  
        <p type="p">224-2:導電層</p>  
        <p type="p">230-1:基板重分佈層</p>  
        <p type="p">230-2:基板重分佈層</p>  
        <p type="p">240-1:焊料掩膜層</p>  
        <p type="p">240-2:焊料掩膜層</p>  
        <p type="p">500A:半導體結構</p>  
        <p type="p">D1:第一直徑</p>  
        <p type="p">D100:方向</p>  
        <p type="p">D120:方向</p>  
        <p type="p">D2:第二直徑</p>  
        <p type="p">L1:尺寸</p>  
        <p type="p">L2:尺寸</p>  
        <p type="p">P1:深度</p>  
        <p type="p">P2:深度</p>  
        <p type="p">PH1:導電佈線</p>  
        <p type="p">PH2:導電佈線</p>  
        <p type="p">T1:厚度</p>  
        <p type="p">TH1:孔</p>  
        <p type="p">TH2:孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1915" publication-number="202612517"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612517.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612517</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251110B">H10D62/10</main-classification>  
        <further-classification edition="202501120251110B">H10D62/80</further-classification>  
        <further-classification edition="202501120251110B">H10D88/00</further-classification>  
        <further-classification edition="200601120251110B">H01L21/301</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大槻高志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTSUKI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣瀬貴史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROSE, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳澤悠一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGISAWA, YUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村川努</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAWA, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置包括氧化物半導體、其上的第一及第二導電體、設在其上且具有重疊於第一導電體與第二導電體之間的區域的開口部的第一絕緣體、設在該開口部中的第二絕緣體、該開口部中設在第二絕緣體上的第三導電體、設在第三導電體及第一絕緣體上的第三絕緣體、設在形成在第一及第三絕緣體中的到達第一導電體的開口部中的第四導電體、設在形成在第一及第三絕緣體中的到達第二導電體的開口部中的第五導電體，第四及第五導電體都包括第六導電體及與其底面及側面接觸的第七導電體，第七導電體具有氫濃度低於1×10&lt;sup&gt;22&lt;/sup&gt;atoms/cm&lt;sup&gt;3&lt;/sup&gt;的區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電晶體</p>  
        <p type="p">205:導電體</p>  
        <p type="p">212:絕緣體</p>  
        <p type="p">214:絕緣體</p>  
        <p type="p">216:絕緣體</p>  
        <p type="p">221:絕緣體</p>  
        <p type="p">222:絕緣體</p>  
        <p type="p">224:絕緣體</p>  
        <p type="p">230:氧化物</p>  
        <p type="p">240a:導電體</p>  
        <p type="p">240b:導電體</p>  
        <p type="p">241a:絕緣體</p>  
        <p type="p">241b:絕緣體</p>  
        <p type="p">242a:導電體</p>  
        <p type="p">242b:導電體</p>  
        <p type="p">250:絕緣體</p>  
        <p type="p">260:導電體</p>  
        <p type="p">271a:絕緣體</p>  
        <p type="p">271b:絕緣體</p>  
        <p type="p">275:絕緣體</p>  
        <p type="p">280:絕緣體</p>  
        <p type="p">282:絕緣體</p>  
        <p type="p">283:絕緣體</p>  
        <p type="p">285:絕緣體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1916" publication-number="202612165"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612165.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612165</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134145</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池單元陣列、包括此電池單元陣列的電池組和車輛</chinese-title>  
        <english-title>BATTERY CELL ARRAY, AND BATTERY PACK AND VEHICLE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251202B">H01M10/0525</main-classification>  
        <further-classification edition="201601120251202B">H01M8/0267</further-classification>  
        <further-classification edition="202101120251202B">H01M50/258</further-classification>  
        <further-classification edition="200601120251202B">H02J7/04</further-classification>  
        <further-classification edition="200601120251202B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳侊根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, KWANG-KEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鎭浯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN-OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳寅石</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, IN-SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種能夠增加冷卻效率的電池單元陣列，以及包括此電池單元陣列的電池組和車輛，電池單元陣列包括：多個電池單元，排列成具有預定長度的列，多個電池單元如此設置為n列；以及冷卻管，配置為冷卻多個電池單元並接觸多個電池單元以圍繞每個多個電池單元的至少一部分，其中冷卻管設置為n個冷卻管以與排列成n列的多個電池單元形成一對一關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a battery cell array capable of increasing cooling efficiency, and a battery pack and a vehicle including the same, and the battery cell array includes a plurality of battery cells arranged in a column having a predetermined length, the plurality of battery cells being provided as n such columns; and a cooling tube configured to cool the plurality of battery cells and contact the plurality of battery cells to surround at least a portion of each of the plurality of battery cells, wherein the cooling tube is provided as n cooling tubes to form a one-to-one relationship with the plurality of battery cells arranged in n columns.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電池單元陣列</p>  
        <p type="p">100:電池單元</p>  
        <p type="p">200:冷卻管</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1917" publication-number="202610583"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610583.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610583</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備和清潔系統</chinese-title>  
        <english-title>CLEANING DEVICE AND CLEANING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251010B">A47L11/40</main-classification>  
        <further-classification edition="200601120251010B">A47L11/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHANGCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊志敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZHIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾令星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, LINGXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐洪亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, HONGLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例涉及智慧家居技術領域公開了一種清潔設備和清潔系統，包括了清潔設備主體、安裝板、抓取組件、定位件和緊固件，清潔設備主體包括了殼體，在裝配過程中，可以將安裝板上的定位件與定位孔對齊，完成抓取組件和安裝板的初步定位，之後可以將緊固件穿過殼體和裝配孔連接到抓取組件之上。本申請實施例提供的清潔設備，一方面，使得抓取組件至少能夠通過定位件和緊固件進行定位，使得抓取組件的固定更加可靠；第二方面，在裝配過程中，可以利用安裝板上的定位孔和定位件進行配合，能夠實現抓取組件的初步定位，能夠提高裝配效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This embodiment of the application relates to the field of smart home technology and discloses a cleaning device and cleaning system, which includes a cleaning device body, an installation plate, a grabbing component, a positioning part, and a fastener. The cleaning device body includes a housing. During the assembly process, the positioning part on the installation plate can be aligned with the positioning hole to complete the initial positioning of the grabbing component and the installation plate. Then, the fastener can be passed through the housing and assembly hole to connect to the grabbing component.The cleaning device provided in this embodiment of the application has the following advantages: On one hand, it allows the grabbing component to be positioned by the positioning part and fastener, making the fixation of the grabbing component more reliable; On the other hand, during the assembly process, the positioning hole and positioning part on the installation plate can be cooperated, achieving the initial positioning of the grabbing component and improving assembly efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:機械臂</p>  
        <p type="p">113:倉位</p>  
        <p type="p">120:安裝板</p>  
        <p type="p">140:定位件</p>  
        <p type="p">150:緊固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1918" publication-number="202610576"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610576.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610576</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134188</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔機器人及其控制方法、電腦可讀存儲介質及電腦程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250930B">A47L11/24</main-classification>  
        <further-classification edition="200601120250930B">A47L11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王佃鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種清潔機器人及其控制方法、存儲介質及程式產品。該控制方法包括：獲取清潔機器人繪製的感知地圖；基於獲取到的感知地圖執行環境探索步驟，環境探索步驟包括：控制清潔機器人沿感知地圖中的類牆邊界行走，並在行走過程中對環境進行探索，其中，類牆邊界為長度滿足預設條件的障礙物邊界</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101:步驟</p>  
        <p type="p">S102:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1919" publication-number="202611092"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611092.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611092</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134190</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組成物、圖案形成方法及聚合物的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C08F2/38</main-classification>  
        <further-classification edition="200601120251103B">C08F8/00</further-classification>  
        <further-classification edition="200601120251103B">C08F212/14</further-classification>  
        <further-classification edition="200601120251103B">C08F220/18</further-classification>  
        <further-classification edition="200601120251103B">C08F220/22</further-classification>  
        <further-classification edition="200601120251103B">C08F220/38</further-classification>  
        <further-classification edition="200601120251103B">G03F7/004</further-classification>  
        <further-classification edition="200601120251103B">G03F7/039</further-classification>  
        <further-classification edition="200601120251103B">G03F7/20</further-classification>  
        <further-classification edition="200601120251103B">G03F7/32</further-classification>  
        <further-classification edition="200601120251103B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島田雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMADA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本山和樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTOYAMA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野野山桂生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NONOYAMA, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於圖案形成時可以與先前同等以上的水準發揮感度或CDU、過度曝光CDU、曝光不足CDU的感放射線性組成物及圖案形成方法。一種感放射線性組成物，含有第一聚合物及溶劑，所述第一聚合物包含：結構單元（I），具有酸解離性基；結構單元（II），包含具有有機酸根陰離子與鎓陽離子並藉由曝光而產生酸的酸產生結構；及部分結構（a），由下述式（a）表示。 &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="185px" width="274px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（a）中，Z為氫原子、鹵素原子、硝基或碳數1～20的一價有機基；*為與所述聚合物的其他結構的鍵結鍵）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1920" publication-number="202611684"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611684.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611684</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134196</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其操作方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F3/01</main-classification>  
        <further-classification edition="200601120251201B">G06F1/16</further-classification>  
        <further-classification edition="202301120251201B">H04N23/90</further-classification>  
        <further-classification edition="202301120251201B">H04N23/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳漢銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HAN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦汶賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, WEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宜靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昱伶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YU-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括顯示機體、轉軸結構以及運算機體。顯示機體包括顯示模組。運算機體包括處理單元、攝像窗口與可切換攝像模組，且具有相對的第一端以及第二端。可切換攝像模組與攝像窗口配置鄰近第二端。可切換攝像模組包括乘載元件、至少一攝像單元、遮擋件以及切換機構。切換機構連接於乘載元件，用以帶動乘載元件以切換至少一攝像單元與遮擋件的僅其中一者暴露於攝像窗口。其中當至少一攝像單元暴露於攝像窗口時，處理單元控制顯示模組以顯示攝像模式畫面。當遮擋件暴露於攝像窗口時，處理單元控制顯示模組以顯示隱私模式畫面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device comprising a display body, a hinge structure, and a computing body is provided. The display body includes a display module. The computing body includes a processing unit, a camera window, and a switchable camera module, and has opposing first and second ends. The switchable camera module and the camera window are arranged adjacent to the second end. The switchable camera module includes a carrier element, at least one camera unit, a blocking member, and a switching mechanism. The switching mechanism is connected to the carrier element for driving the carrier element to switch, such that only one of the at least one camera unit and the blocking member is exposed at the camera window. When the at least one camera unit is exposed at the camera window, the processing unit controls the display module to display a camera mode screen. When the blocking member is exposed at the camera window, the processing unit controls the display module to display a privacy mode screen.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:顯示機體</p>  
        <p type="p">112:顯示模組</p>  
        <p type="p">120:運算機體</p>  
        <p type="p">122:鍵盤模組</p>  
        <p type="p">124:觸控板</p>  
        <p type="p">130:轉軸機體</p>  
        <p type="p">200:可切換攝像模組</p>  
        <p type="p">A1:第一端</p>  
        <p type="p">A2:第二端</p>  
        <p type="p">A3:側邊</p>  
        <p type="p">C:攝像窗口</p>  
        <p type="p">S:操作面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1921" publication-number="202612380"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612380.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612380</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種UE能力上報方法及裝置</chinese-title>  
        <english-title>A METHOD AND APPARATUS FOR REPORTING UE CAPABILITIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H04W72/04</main-classification>  
        <further-classification edition="200901120251103B">H04W8/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李嬌嬌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIAOJIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>常俊仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JUNREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秉肇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BINGZHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝曦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, XI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種UE能力上報方法及裝置，用於降低UE能力上報的信令開銷以及如何適應產品開發節奏。本申請中通過在終端設備的能力資訊中包括特性相關的能力資訊所對應的標識，可以將各特性的能力資訊與終端設備的基礎能力資訊進行隔離，並且各特性的能力資訊之間也相互獨立，實現上報順序（或上報位置）的解耦，從而本申請可以通過標識靈活的在終端設備的能力資訊中添加或刪減特性的能力資訊，一方面可以提前開發某一特性，從而可以適應產品發佈節奏和市場節奏，另一方面可以降低信令開銷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a method and device for UE capability reporting, aimed at reducing the signaling overhead of UE capability reporting and adapting to the pace of product development. In this application, by including identifiers corresponding to feature-related capability information within the capability information of the terminal device, the capability information of each feature can be isolated from the basic capability information of the terminal device. Moreover, the capability information of each feature is independent of one another, achieving decoupling of the reporting order (or reporting position). Consequently, this application can flexibly add or remove feature capability information in the terminal device's capability information through identifiers. On one hand, this allows for the early development of a certain feature, thereby adapting to the product release and market pace. On the other hand, it reduces the signaling overhead.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S701、S702:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1922" publication-number="202611409"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611409.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611409</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134212</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種軸結構及氮化鋁加熱器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250930B">F16C3/02</main-classification>  
        <further-classification edition="200601120250930B">C04B35/581</further-classification>  
        <further-classification edition="200601120250930B">C04B35/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商君原電子科技（海寧）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石鍺元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張衛軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裘祝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張倩雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱昱宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種軸結構及氮化鋁加熱器，屬於氮化鋁加熱器技術領域，所述軸結構包括氮化鋁陶瓷段、氮化鋁和氧化鋁過渡段、氧化鋁陶瓷段，所述氮化鋁陶瓷段、所述氮化鋁和氧化鋁過渡段、所述氧化鋁陶瓷段由上往下依次連接設置，所述氮化鋁加熱器包括氮化鋁加熱盤，所述氮化鋁加熱盤與所述氮化鋁陶瓷段連接。本申請技術方案，不僅可以保證軸結構和氮化鋁加熱盤在結合處為的材料相同或者相近，使其熱膨脹係數基本一致，又可以經過渡層過渡至氧化鋁，利用氧化鋁較氮化鋁有著較低的導熱係數，從而降低氮化鋁加熱盤上的熱量經軸結構散失。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一氮化鋁段</p>  
        <p type="p">11:氮化鋁加熱盤</p>  
        <p type="p">2:第二氮化鋁段</p>  
        <p type="p">3:第三氮化鋁段</p>  
        <p type="p">4:第一過渡段</p>  
        <p type="p">5:第二過渡段</p>  
        <p type="p">6:第三過渡段</p>  
        <p type="p">7:第一氧化鋁段</p>  
        <p type="p">8:第二氧化鋁段</p>  
        <p type="p">9:第三氧化鋁段</p>  
        <p type="p">10:第四氧化鋁段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1923" publication-number="202611780"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611780.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611780</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134266</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微型深度神經網路架構及使用微型深度神經網路架構執行的方法</chinese-title>  
        <english-title>TINY DEEP NEURAL NETWORK ARCHITECTURE AND METHOD PERFORMED USING A TINY DEEP NEURAL NETWORK ARCHITECTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251118B">G06N3/045</main-classification>  
        <further-classification edition="202301120251118B">G06N3/04</further-classification>  
        <further-classification edition="201301120251118B">G10L17/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴巴霍拉米　穆罕默德巴迪　貝納姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BABAGHOLAMI MOHAMADABADI, BEHNAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊爾　哈米　莫斯塔法</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL-KHAMY, MOSTAFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露微型深度神經網路架構及使用微型深度神經網路架構執行的方法。微型深度神經網路架構可包括編碼器，包括複數個門控循環單元，用於接收雜訊輸入幅度並從雜訊輸入幅度提取特徵；注意力模組，用於提取從雜訊輸入幅度中的提取的特徵之間的高階關係；以及遮罩解碼器，用於基於高階關係和提取的特徵預測遮罩，以輸出估計的乾淨幅度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tiny deep neural network architecture and method performed using a tiny deep neural network architecture are disclosed. The tiny DNN architecture may include an encoder comprising a plurality of GRUs for receiving a noisy input magnitude and extracting features from the noisy input magnitude; an attention module for extracting a higher order relationship between the extracted features from the noisy input magnitude; and a mask decoder for predicting a mask, based on the higher order relationship and the extracted features, to output an estimated clean magnitude.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:編碼器</p>  
        <p type="p">102:MHSA模組</p>  
        <p type="p">103:遮罩解碼器</p>  
        <p type="p">104:跳躍連接</p>  
        <p type="p">105:混頻器</p>  
        <p type="p">106:單向多層GRU、GRU、最後GRU</p>  
        <p type="p">107:層正規化模組</p>  
        <p type="p">108:批次正規化層模組</p>  
        <p type="p">109a、109b:FC層</p>  
        <p type="p">109c:最後輸出的FC層、FC層</p>  
        <p type="p">110:ReLU激活函數</p>  
        <p type="p">111:Sigmoid激活函數</p>  
        <p type="p">
        &lt;i&gt;Y&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;m&lt;/i&gt;
        &lt;/sub&gt;:輸入幅度</p>  
        <p type="p">
        &lt;img align="absmiddle" height="27px" width="28px" file="d10001.TIF" alt="其他非圖式ed10001.png" img-content="character" orientation="portrait" inline="no" giffile="ed10001.png"&gt;
        &lt;/img&gt;:估計的乾淨幅度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1924" publication-number="202611189"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611189.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611189</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134306</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導電阻燃透濕薄膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250917B">C08J5/18</main-classification>  
        <further-classification edition="200601120250917B">C08L75/04</further-classification>  
        <further-classification edition="201701120250917B">C01B32/182</further-classification>  
        <further-classification edition="201901120250917B">B32B7/025</further-classification>  
        <further-classification edition="200601120250917B">B32B27/18</further-classification>  
        <further-classification edition="200601120250917B">B32B27/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇興碳素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳定宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一種導電阻燃透濕薄膜，將相對於導電阻燃透濕薄膜固含重量比30〜70wt%的寡層石墨烯與固含重量比15〜35wt%的聚輪烷添加至聚氨酯樹脂中，聚輪烷包含直鏈狀高分子及環狀分子之化合物，還令聚輪烷的環狀分子經一無鹵的阻燃高分子材料做表面修飾進行改質，而除了聚氨酯樹脂具有的透濕性及防水性之外，再利用添加寡層石墨烯增加導電性，並透過添加聚輪烷提升寡層石墨烯的分散性，且改善聚氨酯樹脂的柔韌性，還運用聚輪烷的改質提升聚氨酯樹脂的阻燃性。藉此，提供一種導電阻燃透濕薄膜，具有運用添加改質後的聚輪烷提升聚氨酯的阻燃性及柔韌性，且同步提高石墨烯的添加量進而提升導電性之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基底支撐材</p>  
        <p type="p">11:中間離型層</p>  
        <p type="p">20:導電阻燃透濕薄膜層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1925" publication-number="202612319"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612319.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612319</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134402</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高畫質多媒體介面固定速率鏈路校正系統及其方法</chinese-title>  
        <english-title>HDMI FRL CORRECTION SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H04N7/015</main-classification>  
        <further-classification edition="201101120251001B">H04N21/436</further-classification>  
        <further-classification edition="200601120251001B">H04L1/00</further-classification>  
        <further-classification edition="200601120251001B">H04L25/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JENG, YOU-TSAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, KAI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭盟鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, MENG-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭國章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KUO-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐其煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, CHI-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉甄詒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林金龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴科印</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, KO-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童泰來</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNG, TAI-LAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種高畫質多媒體介面固定速率鏈路錯誤校正系統，包括一擾碼重置和超級塊開始相關器、一擾碼重置/超級塊鎖定檢測器、一擾碼重置/超級塊預測器、一擾碼重置/超級塊位元錯誤校正器，以及一擾碼重置/超級塊檢測器。該擾碼重置和超級塊開始相關器用於將輸入擾碼重置信號與擾碼重置信號相關，或將輸入超級塊信號與超級塊信號相關，並相應地生成一相關結果。該擾碼重置/超級塊鎖定檢測器用於根據該相關結果設置一鎖定標誌。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An HDMI FRL error correction system includes a SR/SSB correlator, an SR/SSB lock detector coupled to the SR/SSB correlator, an SR/SSB predictor coupled to the SR/SSB lock detector, an SR/SSB bit error corrector coupled to the SR/SSB correlator, the SR/SSB lock detector and the SR/SSB predictor, and an SR/SSB detector coupled to the SR/SSB bit error corrector. The SR/SSB correlator is used to correlate an input SR signal to a SR signal or correlate an input SSB signal to a SSB signal and generate a correlation result accordingly. The SR/SSB lock detector is used to set a lock flag according to the correlation result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:錯誤校正方法</p>  
        <p type="p">S502~S510:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1926" publication-number="202611730"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611730.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611730</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134411</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有基於補充程式計數器之學習的型樣匹配預提取器</chinese-title>  
        <english-title>PATTERN MATCH PREFETCHER WITH SUPPLEMENTAL PROGRAM-COUNTER-BASED LEARNING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251201B">G06F12/0842</main-classification>  
        <further-classification edition="201601120251201B">G06F12/0877</further-classification>  
        <further-classification edition="200601120251201B">G06F3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅爾　史蒂芬　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEIER, STEPHAN G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>休伯蒂　泰勒　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUBERTY, TYLER J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭示的技術係關於一基於型樣之預提取器的補充的基於PC之學習。在一些實施例中，預提取電路系統經組態以：基於對應於記憶體存取的位址資訊來儲存存取映射資料；及基於該存取映射資料及經儲存存取型樣來產生一或多個預提取請求，以將資料預提取至一快取記憶體。在一些實施例中，補充存取追蹤電路系統經組態以：儲存對應於從該預提取電路系統驅逐的一第一存取映射之偏移的初始存取追蹤資訊；儲存與觸及該第一存取映射的一初始記憶體存取相關聯的程式計數器資訊；基於從該預提取電路系統驅逐的匹配該經儲存程式計數器資訊的一或多個額外存取映射，更新該存取追蹤資訊；及回應於一命中且基於該經更新存取追蹤資訊來產生用於在該預提取電路系統中分配的一起始存取映射。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed techniques relate to supplemental PC-based learning for a pattern-based prefetcher. In some embodiments, prefetch circuitry is configured to store access map data based on address information corresponding to memory accesses and generate, based on the access map data and stored access patterns, one or more prefetch requests to prefetch data to a cache. In some embodiments, supplemental access tracking circuitry is configured to store initial access tracking information for offsets corresponding to a first access map evicted from the prefetch circuitry, store program counter information associated with an initial memory access that touched the first access map, update the access tracking information, based on one or more additional access maps evicted from the prefetch circuitry that match the stored program counter information, and generate, in response to a hit and based on the updated access tracking information, a starting access map for allocation in the prefetch circuitry.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:補充存取追蹤電路系統；電路系統</p>  
        <p type="p">120:預提取電路系統</p>  
        <p type="p">130:存取映射資料</p>  
        <p type="p">140:存取型樣資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1927" publication-number="202611700"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611700.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611700</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134413</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理器電路中的遮罩/歸零斷定</chinese-title>  
        <english-title>MASKING/ZEROING PREDICATION IN PROCESSOR CIRCUITS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251113B">G06F9/06</main-classification>  
        <further-classification edition="201801120251113B">G06F9/30</further-classification>  
        <further-classification edition="200601120251113B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛尼恩　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONION, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔克　查理　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUCKER, CHARLES E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種可執行斷定式向量運算的處理器電路。該處理器電路可比較在指定一述詞向量的一經提取向量指令中所識別的來源及目的地暫存器位置。該處理器電路亦可基於該述詞向量而執行該經提取向量指令以產生一輸出向量。基於來源及目的地暫存器的該等各別名稱的該比較的一結果，該處理器電路可藉由在寫入至該目的地暫存器之前將該輸出向量中的非作用中元素歸零，或藉由遮罩該輸出向量的該等非作用中元素至該目的地暫存器的一寫入，來判定該輸出向量中的該等非作用中元素的值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A processor circuit that can perform predicated vector operations is disclosed. The processor circuit may compare source and destination register locations as identified in a fetched vector instruction that specifies a predicate vector. The processor circuit may also execute the fetched vector instruction based on the predicate vector to generate an output vector. Based on a result of the comparison of the respective names of source and destination registers, the processor circuit may determine values for inactive elements in the output vector by either zeroing the inactive elements in the output vector prior to writing to the destination register or by masking a write of the inactive elements of the output vector to the destination register.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理器電路</p>  
        <p type="p">101:記憶體電路</p>  
        <p type="p">102:提取電路</p>  
        <p type="p">103:執行電路</p>  
        <p type="p">104A:通道</p>  
        <p type="p">104B:通道</p>  
        <p type="p">104C:通道</p>  
        <p type="p">105:暫存器電路</p>  
        <p type="p">106:格式化電路</p>  
        <p type="p">107:指令</p>  
        <p type="p">108:向量指令</p>  
        <p type="p">109:經解碼指令</p>  
        <p type="p">110:輸出向量</p>  
        <p type="p">111:運算元</p>  
        <p type="p">112:來源暫存器</p>  
        <p type="p">113:目的地暫存器</p>  
        <p type="p">114:運算</p>  
        <p type="p">115:述詞向量</p>  
        <p type="p">116:述詞元素</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1928" publication-number="202612364"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612364.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612364</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134450</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251103B">H04W12/10</main-classification>  
        <further-classification edition="202101120251103B">H04W12/03</further-classification>  
        <further-classification edition="202101120251103B">H04W12/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時代</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊曉春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIONG, XIAOCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通信方法及裝置，能夠有效降低PDCP層的下層資料/信令被仿冒和篡改的風險，提高資料傳輸的安全性。該方法包括：第一通信裝置和第二通信裝置之間交互PDCP層的下層的資料包（第一資料包）的過程中，第一通信裝置基於第一COUNT對第一資料包進行完整性保護和/或加密，第二通信裝置基於第一COUNT對第一資料包進行完整性校驗和/或解密，實現對PDCP層的下層的資料包的安全保護，第一COUNT根據第一資料包對應的第一空口時間和第一空口時間對應的第一HFN確定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication method and device that can effectively reduce the risk of forgery and tampering of data/signaling at a layer lower than the PDCP layer, thereby enhancing the security of data transmission. The method includes: during the process of exchanging a data packet (a first data packet) at a layer lower than the PDCP layer between a first communication device and a second communication device, the first communication device performs integrity protection and/or encryption on the first data packet based on the first COUNT, and the second communication device performs integrity verification and/or decryption on the first data packet based on the first COUNT, thereby achieving secure protection of the data packet at the layer lower than the PDCP layer. The first COUNT is determined based on a first air interface time corresponding to the first data packet and a first HFN corresponding to the first air interface time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1201、S1202、S1203:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1929" publication-number="202610963"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610963.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610963</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134523</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種氮化鋁陶瓷靜電卡盤的製備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250924B">C04B35/645</main-classification>  
        <further-classification edition="200601120250924B">C04B35/58</further-classification>  
        <further-classification edition="200601120250924B">H01L21/683</further-classification>  
        <further-classification edition="200601120250924B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商君原電子科技（海寧）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石鍺元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奚宏暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃青林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱昱宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種氮化鋁陶瓷靜電卡盤的製備方法，屬於半導體技術領域，包括：準備氮化鋁粉料和壓制模具；填粉：第一模具板放進模具本體內側底部，稱量氮化鋁粉料振動填充，將平板放置在振動填充好的粉料上，調整平板使其平整，再將孔板放置在平板上，在上述平板上再次放置孔板，孔板上放置第二模具板，第二模具板調平，然後在第二模具板上通過振動填ALN粉料，第二模具板上的氮化鋁粉料上再放置平板，繼續在該平板上方放置孔板，孔板上放置第三模具板，在第三模具板上通過振動填ALN粉料，填粉完畢後在粉料上方再放置平板，平板上方放置孔板，最上方孔板的上方則蓋上模具蓋；捆紮、靜壓和燒結：密封捆紮後等靜壓壓制，壓制後燒結。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:模具本體</p>  
        <p type="p">2:第一模具板</p>  
        <p type="p">3:第二模具板</p>  
        <p type="p">4:第三模具板</p>  
        <p type="p">5:第一平板</p>  
        <p type="p">6:第二平板</p>  
        <p type="p">7:第三平板</p>  
        <p type="p">8:第一孔板</p>  
        <p type="p">9:第二孔板</p>  
        <p type="p">10:第三孔板</p>  
        <p type="p">11:第一坯體</p>  
        <p type="p">12:第二坯體</p>  
        <p type="p">13:第三坯體</p>  
        <p type="p">14:模具蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1930" publication-number="202611514"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611514.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611514</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134528</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於單一雷射原子力顯微鏡之懸臂</chinese-title>  
        <english-title>CANTILEVER FOR SINGLE LASER ATOMIC FORCE MICROSCOPE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251201B">G01Q60/24</main-classification>  
        <further-classification edition="201001120251201B">G01Q10/04</further-classification>  
        <further-classification edition="201001120251201B">G01Q20/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商近場儀器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEARFIELD INSTRUMENTS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮斯庫諾夫　塔拉斯　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PISKUNOV, TARAS SERGEIEVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於一原子力顯微鏡之懸臂，其包含設置於該懸臂上之面向一光學系統的一吸收層，使得在使用期間，由該光學系統發射之光的一第一部分由該吸收層吸收；&lt;br/&gt; 其中該吸收層具有小於該吸收層之光吸收深度的一厚度，使得在使用期間自該光學系統發射之該光的一第二部分穿過該吸收層；且&lt;br/&gt; 其中該懸臂經配置以將該光之該第二部分反射回該光學系統，使得由該懸臂反射之該光之至少一部分在使用期間由該光學系統捕獲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Cantilever for use in an atomic force microscope comprising an absorption layer provided on the cantilever facing an optical system such that, during use, a first fraction of light emitted by the optical system is absorbed by the absorption layer;&lt;br/&gt; wherein the absorption layer has a thickness less than the light absorption depth of the absorption layer such that a second fraction of the light emitted from the optical system during use passes through the absorption layer; and&lt;br/&gt; wherein the cantilever is arranged to reflect the second fraction of the light back to the optical system such that at least a part of the light reflected by the cantilever is captured by the optical system during use.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:懸臂</p>  
        <p type="p">2:吸收層</p>  
        <p type="p">3:發射光</p>  
        <p type="p">4:反射光</p>  
        <p type="p">6:探針載體</p>  
        <p type="p">A:細節</p>  
        <p type="p">D:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1931" publication-number="202611050"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611050.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611050</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134535</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>四並環芳香醯胺類衍生物及其製備方法和用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D495/14</main-classification>  
        <further-classification edition="200601120251201B">C07D487/14</further-classification>  
        <further-classification edition="200601120251201B">C07D491/147</further-classification>  
        <further-classification edition="200601120251201B">A61K31/55</further-classification>  
        <further-classification edition="200601120251201B">A61K31/5517</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商浙江海正藥業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHEJIANG HISUN PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海昂睿醫藥技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI ARYL PHARMTECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仇宗興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, ZONG-XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭記磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, JI-LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪澤峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZE-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種四並環芳香醯胺類衍生物、其製備方法及含有該衍生物的藥物組合物在醫藥上的應用。具體而言，本發明涉及一種通式(I)所示的四並環芳香醯胺類衍生物、其製備方法及其可藥用的鹽，以及它們作為治療劑，特別是DHX9抑制劑的用途，其中通式(I)中的各取代基的定義與說明書中的定義相同&lt;br/&gt;&lt;img align="absmiddle" height="223px" width="318px" file="ed10173.JPG" alt="ed10173.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1932" publication-number="202612351"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612351.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612351</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於預測環境的立體像素表示中的佔用之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR PREDICTING OCCUPANCY IN A VOXEL REPRESENTATION OF AN ENVIRONMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H04N23/95</main-classification>  
        <further-classification edition="201801120251201B">H04N13/10</further-classification>  
        <further-classification edition="200601120251201B">G06T1/20</further-classification>  
        <further-classification edition="201101120251201B">G06T15/08</further-classification>  
        <further-classification edition="202401120251201B">G06T3/4046</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施雲霄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, YUNXIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安薩里　艾明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANSARI, AMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波里克利　法提赫　穆拉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PORIKLI, FATIH MURAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬許　艾德赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOSHI, AVDHUT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩德克　艾哈邁德　卡梅爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SADEK, AHMED KAMEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述成像系統及技術。在一些實例中，一種成像系統從一環境的該複數個影像提取複數個特徵。該複數個影像包括對於該環境的不同視角。該成像系統處理該複數個特徵以產生該環境的一基於立體像素的表示。該基於立體像素的表示包括複數個立體像素。該成像系統分析該複數個影像及該基於立體像素的表示，以將該複數個立體像素的一第一子集分類成一第一物體類別，且將該複數個立體像素的一第二子集分類成一第二物體類別。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Imaging systems and techniques are described. In some examples, an imaging system extracts a plurality of features from the plurality of images of an environment. The plurality of images include different perspectives on the environment. The imaging system processes the plurality of features to generate a voxel-based representation of the environment. The voxel-based representation includes a plurality of voxels. The imaging system analyzes the plurality of images and the voxel-based representation to classify a first subset of the plurality of voxels into a first object category and to classify a second subset of the plurality of voxels into a second object category.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:成像系統</p>  
        <p type="p">405:輸入</p>  
        <p type="p">410:影像</p>  
        <p type="p">415:環境</p>  
        <p type="p">420:視角</p>  
        <p type="p">430:特徵提取</p>  
        <p type="p">435:特徵平均</p>  
        <p type="p">440:3D立體像素表示</p>  
        <p type="p">450:3D預測產生器</p>  
        <p type="p">455:3D佔用預測圖</p>  
        <p type="p">460:2D深度圖產生器</p>  
        <p type="p">465:2D深度圖</p>  
        <p type="p">470:2D語義圖產生器</p>  
        <p type="p">475:2D語義圖</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1933" publication-number="202610567"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610567.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610567</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>餐椅</chinese-title>  
        <english-title>DINING CHAIR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250920B">A47D1/10</main-classification>  
        <further-classification edition="200601120250920B">A47D15/00</further-classification>  
        <further-classification edition="200601120250920B">A47C4/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚青梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, QINGMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王麗怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LIYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡問渠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, WENQU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡留輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, LIUHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MINGPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提出了一種餐椅，包括：座椅，包括座位部和自該座位部的後端向上延伸的背靠部；基座，支撐座椅；餐盤，可拆卸地連接於座椅，該餐盤包括位於背靠部前方且位於座位部上方的餐盤部；座椅墊，可拆卸地設置於座椅，該座椅墊包括座位墊和背靠墊，該座位墊位於座位部上方且低於餐盤部，該背靠墊在前後方向上位於餐盤部和背靠部之間；以及靠墊，可拆卸地設置在背靠墊上，該靠墊包括墊體，該墊體在前後方向上位於餐盤部與背靠墊之間。由此，可以縮小餐盤部與背靠墊之間在前後方向上的距離，為乘坐其中的兒童提供更加貼合和穩固的支撐，進而減少兒童傾倒的風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a dining chair including: a seat including a seat portion and a backrest portion extending upwardly from a rear end of the seat portion; a base supporting the seat; a tray detachably connected to the seat and including a tray portion located in front of the backrest portion and above the seat portion; a seat pad detachably disposed on the seat, in which the seat pad includes a seat cushion and a backrest cushion, the seat cushion is located above the seat portion and below the tray portion, and the backrest cushion is located between the tray portion and the backrest cushion in a front-rear direction; and a back pad detachably disposed on the backrest cushion, in which the back pad includes a cushion body and the cushion body is located between the tray portion and the backrest cushion in the front-rear direction. As a result, the distance between the tray portion and the backrest cushion can be reduced in the front-rear direction to provide a more snug and stable support for the child riding therein, thereby reducing a risk of the child tipping over.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:餐椅</p>  
        <p type="p">20:座椅</p>  
        <p type="p">210:座位部</p>  
        <p type="p">220:背靠部</p>  
        <p type="p">230:腿靠部</p>  
        <p type="p">30:基座</p>  
        <p type="p">310,320:U形構件</p>  
        <p type="p">330:橫向件</p>  
        <p type="p">40:餐盤</p>  
        <p type="p">410:餐盤部</p>  
        <p type="p">4101:餐盤內邊緣</p>  
        <p type="p">420:突出肋</p>  
        <p type="p">430:餐盤鎖扣</p>  
        <p type="p">50:座椅墊</p>  
        <p type="p">510:座位墊</p>  
        <p type="p">520:背靠墊</p>  
        <p type="p">530:腿靠墊</p>  
        <p type="p">60:靠墊</p>  
        <p type="p">70:保護件</p>  
        <p type="p">90:腳踏裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1934" publication-number="202612334"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612334.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612334</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134656</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生成經內插影像資料</chinese-title>  
        <english-title>GENERATING INTERPOLATED IMAGE DATA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251201B">H04N19/513</main-classification>  
        <further-classification edition="202401120251201B">G06T3/40</further-classification>  
        <further-classification edition="201701120251201B">G06T7/246</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>爾沙地　阿霞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERSHADI, ARSHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖海薩尼拉許丹　阿里雷薩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHOA HASSANI LASHDAN, ALIREZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉米亞斯里尼瓦桑　維斯努桑杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMIYA SRINIVASAN, VISHNU SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述用於對影像資料進行內插的系統及技術。例如，提供一種用於對影像資料進行內插之方法。該方法可包括：使用一運動估計器處理一第一影像圖框及一第二影像圖框以生成第一運動向量，其中該運動估計器包含經訓練以基於影像圖框生成運動向量的一機器學習模型；投影該等第一運動向量以生成第二運動向量；及基於該第一影像圖框、該第二影像圖框、及該等第二運動向量生成一第三影像圖框。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and techniques are described herein for interpolating image data. For instance, a method for interpolating image data is provided. The method may include processing a first image frame and a second image frame using a motion estimator to generate first motion vectors, wherein the motion estimator comprises a machine-learning model trained to generate motion vectors based on image frames; projecting the first motion vectors to generate second motion vectors; and generating a third image frame based on the first image frame, the second image frame, and the second motion vectors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:影像圖框之第一實例集合；影像圖框之集合</p>  
        <p type="p">104:輸入圖框</p>  
        <p type="p">106,108,110:經內插圖框</p>  
        <p type="p">112:輸入圖框</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1935" publication-number="202612309"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612309.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612309</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134743</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線通信方法及相關的無線通信裝置</chinese-title>  
        <english-title>WIRELESS COMMUNICATION METHOD AND ASSOCIATED WIRELESS COMMUNICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H04L12/413</main-classification>  
        <further-classification edition="202401120251001B">H04W74/0816</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬家順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, CHIA-SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方　永剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, YONGGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃祺翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃坤聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種由無線通信設備通過信道進行通信的方法，包括：執行包含在突發中的第一子突發的傳輸；在該第一子突發的傳輸完成後，通過該信道傳輸高優先級觸發（HPT）幀，以指示該突發的傳輸是可中斷的；以及，在該HPT幀的傳輸完成後的預定時間間隔內，檢測該信道是否忙碌，以確定是否執行包含在該突發中的第二子突發的傳輸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for performing communications via a channel by a wireless communication device includes: performing transmission of a first sub-burst included in a burst; after the transmission of the first sub-burst is completed, transmitting a high-priority trigger (HPT) frame via the channel for indicating transmission of the burst is interruptible; and during a predetermined time interval after transmission of the HPT frame is completed, detecting whether the channel is busy in order to determine whether to perform transmission of a second sub-burst included in the burst.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:IB發起者</p>  
        <p type="p">550:目標設備</p>  
        <p type="p">502:RTS幀</p>  
        <p type="p">504:CTS幀</p>  
        <p type="p">506,512:PPDU</p>  
        <p type="p">508,514:BA幀</p>  
        <p type="p">510:HPT幀</p>  
        <p type="p">SUB_B1,SUB_B2:子突發</p>  
        <p type="p">NAV_1:RTS幀502的NAV保留</p>  
        <p type="p">NAV_2:CTS幀504的NAV保留</p>  
        <p type="p">NAV_3:PPDU506的NAV保留</p>  
        <p type="p">NAV_4:BA幀508的NAV保留</p>  
        <p type="p">NAV_5:HPT幀510的NAV保留</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1936" publication-number="202611568"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611568.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611568</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134754</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏光板和包括所述偏光板的光學顯示設備</chinese-title>  
        <english-title>POLARIZING PLATE AND OPTICAL DISPLAY APPARATUS COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G02B5/30</main-classification>  
        <further-classification edition="201501120251001B">G02B1/10</further-classification>  
        <further-classification edition="200601120251001B">C08F220/06</further-classification>  
        <further-classification edition="200601120251001B">G02F1/1335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宇鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, WOO JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李泰賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TAE HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐美蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, MI RAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金一鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, IL JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種偏光板和光學顯示裝置。所述偏光板包括：偏光片；以及堆疊在偏光片的一個表面上的阻擋層，其中阻擋層包含用於阻擋層的組成物的固化產物，所述用於阻擋層的組成物包含：包含環氧化合物和(甲基)丙烯酸化合物的可固化化合物；光起始劑；以及金屬螯合交聯劑，所述(甲基)丙烯酸化合物包括含羧酸基的(甲基)丙烯酸化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polarizing plate and an optical display apparatus are disclosed. The polarizing plate includes a polarizer and a barrier layer stacked on one surface of the polarizer, wherein the barrier layer comprises a cured product of a composition for barrier layers comprising: a curable compound comprising an epoxy compound and a (meth)acrylic compound; a photoinitiator; and a metal chelate crosslinking agent, the (meth)acrylic compound comprising a carboxylic acid group-containing (meth)acrylic compound.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:偏光片</p>  
        <p type="p">200:保護層</p>  
        <p type="p">300:阻擋層</p>  
        <p type="p">400:第一延遲層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1937" publication-number="202611036"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611036.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611036</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>取代雙環類衍生物及其製備方法和用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C07D401/14</main-classification>  
        <further-classification edition="200601120251103B">A61K31/454</further-classification>  
        <further-classification edition="200601120251103B">A61K31/4545</further-classification>  
        <further-classification edition="200601120251103B">A61P3/00</further-classification>  
        <further-classification edition="200601120251103B">A61P9/00</further-classification>  
        <further-classification edition="200601120251103B">A61P13/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商浙江海正藥業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHEJIANG HISUN PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海昂睿醫藥技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI ARYL PHARMTECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張盼盼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, PAN-PAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程超英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHAO-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武海潮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HAI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅鵬昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, PENG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞　鳴烽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, MING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭曉鶴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, XIAO-HE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周厚江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, HOUJIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種取代雙環類衍生物、其製備方法及含有該衍生物的藥物組合物以及它們在醫藥上的應用。具體而言，本發明涉及一種通式(I)所示的取代雙環類衍生物、其製備方法及其立體異構體、互變異構體、氘代物、可藥用的鹽和藥物組合物，以及它們作為治療劑，特別是作為20-HETE生成抑制劑的用途，其中通式(I)中各取代基的定義與說明書中的定義相同，&lt;br/&gt;&lt;img align="absmiddle" height="117px" width="300px" file="ed10137.JPG" alt="ed10137.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1938" publication-number="202611236"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611236.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611236</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134825</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種偶氮染料化合物及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C09B35/362</main-classification>  
        <further-classification edition="200601120251103B">C09B35/56</further-classification>  
        <further-classification edition="200601120251103B">C09B35/60</further-classification>  
        <further-classification edition="200601120251103B">C09K19/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商石家莊誠志永華顯示材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIJIAZHUANG CHENGZHI YONGHUA DISPLAY MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王璐璐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LU-LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭曉闊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, XIAO-KUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬彥濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, YAN-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫新戰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, XIN-ZHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巨鵬瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JU, PENG-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑永鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAO, YONG-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張虎波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HU-BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及偶氮染料材料技術領域，具體公開一種偶氮染料化合物及其應用。本發明提供的偶氮染料化合物，最大吸收波長範圍為470 nm~560 nm，具有二色比高、溶解度良好、在極端環境條件（UV、高溫、高溫高濕）下的色差小、穩定性和耐久性優異等特性。本發明提供的偶氮染料化合物在液晶材料中的溶解度可達3wt%以上，可長期保存於液晶介質中，將其應用於液晶組合物中，可在UV 168 h、高溫85℃ 1000 h和高溫85℃-高濕85% 1000 h後保持小的色差變化，具有優異的穩定性和耐久性。本發明偶氮染料化合物的合成方法簡單，可滿足工業的生產需求，應用在調光元件上光學性能顯著。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1939" publication-number="202611759"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611759.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611759</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134831</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>身份註冊方法及身份驗證方法</chinese-title>  
        <english-title>DENTITY REGISTRATION METHOD AND IDENTITY VERIFICATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251113B">G06F21/32</main-classification>  
        <further-classification edition="200601120251113B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義隆電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELAN MICROELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃榮壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JUNG-SHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡呈新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡松軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, SUNG-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種身份註冊方法，包括：藉由一指紋感測器感測一使用者的指紋，以獲得n張第一指紋圖像，n為大於等於1的正整數；根據該n張第一指紋圖像產生n個第一模板；儲存該n個第一模板；在一顯示器上顯示一圖形鎖，該圖形鎖包括多個節點；偵測該使用者的手指在該指紋感測器上的移動以決定該圖形鎖的一註冊解鎖順序；以及儲存該註冊解鎖順序，其中該n個第一模板與該註冊解鎖順序用於進行身份驗證。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An identity registration method includes the steps: sensing a fingerprint of user by a fingerprint sensor to obtain n first fingerprint images, wherein n is a positive integer greater than or equal to 1; generating n first templates according to the n first fingerprint images; storing the n first templates; displaying a pattern lock on a display, wherein the pattern lock includes a plurality of nodes; detecting a movement of a finger of the user on the fingerprint sensor to determine a registered unlock order of the pattern lock; and storing the registered unlock order, where the n first templates and the registered unlock order are used for identity authentication.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S15:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1940" publication-number="202611392"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611392.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611392</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浮動發電廠</chinese-title>  
        <english-title>FLOATING ELECTRICAL ENERGY GENERATION PLANT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251110B">F02C3/24</main-classification>  
        <further-classification edition="200601120251110B">F02C7/12</further-classification>  
        <further-classification edition="200601120251110B">F02C7/00</further-classification>  
        <further-classification edition="200601120251110B">B63B35/44</further-classification>  
        <further-classification edition="200601120251110B">B01D53/62</further-classification>  
        <further-classification edition="200601120251110B">B01D53/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商德希尼布能源法國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHNIP ENERGIES FRANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祖爾加雷　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZUELGARAY, PHILIPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露一種浮動發電廠。該浮動發電廠可包括一可浮動船。該浮動發電廠可包括用於液化天然氣之船載儲存器，及用於使該液化天然氣再氣化以促進一船載發電機之至少一個氣體渦輪發電機中之燃燒之一再氣化單元。該浮動發電廠可進一步包括一船載碳捕獲系統，以捕獲來自該船載發電機之廢氣中存在之二氧化碳、將其液化、並將液化天然氣儲存在一或多個船載儲存槽中。來自該船載發電機之操作之蒸汽可用作該碳捕獲系統之一再生塔之熱源，且該液化天然氣之冷卻可用於幫助液化經捕獲之該二氧化碳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A floating electrical energy generation plant is disclosed. The floating electrical energy generation plant can include a floatable vessel. The floating electrical energy generation plant may include onboard storage for liquefied natural gas, and a regasification unit for regasifying the liquefied natural gas to facilitate combustion in at least one gas turbine generator of an onboard power generator. The floating electrical energy generation plant can further include an onboard carbon capture system to capture carbon dioxide present in exhaust gases from the onboard power generator, liquefy, and store the liquefied natural gas in one or more onboard storage tanks. Steam from operation of the onboard power generator can be used as heat source for a regeneration column of the carbon capture system, and the coldness of the liquefied natural gas may be utilized to help liquefy the captured carbon dioxide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:浮動發電廠</p>  
        <p type="p">102:可浮動船</p>  
        <p type="p">104:船體</p>  
        <p type="p">106:甲板</p>  
        <p type="p">108:開放內部體積</p>  
        <p type="p">110:船載液化天然氣(LNG)儲存槽</p>  
        <p type="p">112:可撓性軟管</p>  
        <p type="p">114:船載再氣化單元</p>  
        <p type="p">116:壓縮機/蒸發氣體壓縮機</p>  
        <p type="p">118:再冷凝器</p>  
        <p type="p">120:泵</p>  
        <p type="p">122:中間流體汽化器</p>  
        <p type="p">124:下游船載發電機/船載發電機</p>  
        <p type="p">132:冷卻塔</p>  
        <p type="p">134:船載碳捕獲系統</p>  
        <p type="p">136:排氣煙囪</p>  
        <p type="p">138:吸收塔</p>  
        <p type="p">140:水洗塔</p>  
        <p type="p">142:再生塔</p>  
        <p type="p">144:船載二氧化碳液化單元</p>  
        <p type="p">146:船載二氧化碳儲存單元</p>  
        <p type="p">148:液化二氧化碳儲存槽</p>  
        <p type="p">150:電能輸出線</p>  
        <p type="p">152:排放口</p>  
        <p type="p">154:焚化爐</p>  
        <p type="p">156:冷卻水泵</p>  
        <p type="p">158:建築物</p>  
        <p type="p">160:起重機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1941" publication-number="202610895"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610895.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610895</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134852</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浮動平台繫泊系統及安裝方法</chinese-title>  
        <english-title>FLOATING PLATFORM MOORING SYSTEM AND METHOD OF INSTALLATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">B63B21/04</main-classification>  
        <further-classification edition="200601120251128B">B63B21/20</further-classification>  
        <further-classification edition="200601120251128B">B63B35/44</further-classification>  
        <further-classification edition="201601120251128B">F03D13/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商德希尼布能源法國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHNIP ENERGIES FRANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜里克斯　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DURIX, MATHIEU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴斯特　帕特里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASTET, PATRICE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪　馬喬　朱塞佩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DI-MAGGIO, GIUSEPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">張緊的腿浮動平台繫泊系統及相關方法可用於固定浮動平台之位置。例如，該浮動平台繫泊系統可包括耦接於浮動平台與一或多個繫泊樁中之一者之間的不同位置處之至少三條長度固定繫泊索。額外地，該張緊的腿浮動平台繫泊系統可包括耦接於該浮動平台與該一或多個繫泊樁中之一者之間之一長度可調整繫泊索。該浮動平台繫泊系統可進一步包括耦接至該長度可調整繫泊索之繫泊索張力裝置。該繫泊索張力裝置可藉由原位調整該長度可調整繫泊索之長度來調整該長度可調整繫泊索之張力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tensioned leg floating platform mooring system and related methods may be used to secure the position of a floating platform. For example, the floating platform mooring system may include at least three fixed-length mooring lines coupled at different locations between a floating platform and one of one or more mooring piles. Additionally, the tensioned leg floating platform mooring system can include an adjustable-length mooring line coupled between the floating platform and one of the one or more mooring piles. The floating platform mooring system may further include a mooring line tension device coupled to the adjustable-length mooring line. The mooring line tension device may adjust a tension of the adjustable-length mooring line by adjusting a length of the adjustable-length mooring line in situ.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:浮動平台繫泊系統</p>  
        <p type="p">102:浮動風力渦輪機平台</p>  
        <p type="p">104,106,108:柱</p>  
        <p type="p">110:支架</p>  
        <p type="p">111a~111c:上部連接部構件</p>  
        <p type="p">112:風力渦輪機</p>  
        <p type="p">113a~113c:浮筒</p>  
        <p type="p">114:向上延伸支撐結構</p>  
        <p type="p">115a~115c:耦接點</p>  
        <p type="p">116:機艙</p>  
        <p type="p">118:轉子葉片</p>  
        <p type="p">120:張力腿平台浮標</p>  
        <p type="p">122a~122c:長度固定繫泊索</p>  
        <p type="p">124:繫泊樁</p>  
        <p type="p">126a~126c:長度可調整繫泊索</p>  
        <p type="p">130:繫泊索配置</p>  
        <p type="p">202:繫泊索張力裝置</p>  
        <p type="p">302:固定連接件/第一固定連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1942" publication-number="202611678"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611678.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611678</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>與電流臨限違反成比例的網狀架構資料速率限制</chinese-title>  
        <english-title>FABRIC DATA RATE LIMITING PROPORTIONAL TO ELECTRICAL CURRENT THRESHOLD VIOLATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251201B">G06F1/32</main-classification>  
        <further-classification edition="201901120251201B">G06F1/3206</further-classification>  
        <further-classification edition="201901120251201B">G06F1/3296</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹德勒　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENDLER, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納薩爾　薩默</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NASSAR, SAMER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席密特　里爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZIMET, LIOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杰莫爾　札克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEMER, TZACH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭示的技術係關於與一電力相關臨限的一違反成比例地限制網狀架構電路系統上之通訊的一資料速率。測量一給定介面電路與該網狀架構電路系統之間的一雙態觸變率的雙態觸變率偵測器電路系統可分布在耦接該網狀架構電路系統與多個客戶端電路的介面處。電力控制電路系統可基於一給定客戶端電路的介面與該網狀架構電路系統之間的一雙態觸變率並基於一通訊事件，而產生該客戶端電路之電流使用的一估計。該電力控制電路系統可基於電流使用的該等估計而偵測一電流臨限的一違反。額外地，該電力控制電路系統可與該違反的一量值成比例地限制該網狀架構電路系統上之通訊的該資料速率。相對於傳統技術，所揭示的技術可隨著對於效能的影響減少而減輕違反。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed techniques relate to limiting a data rate of communications on fabric circuitry proportionally to a violation of a power-related threshold. Toggle rate detector circuitry, measuring a toggle rate between a given interface circuit and the fabric circuitry, may be distributed at interfaces that couple the fabric circuitry and multiple client circuits. Power control circuitry may generate an estimate of electrical current use by a given client circuit based on a toggle rate between the client circuit’s interface and the fabric circuitry and based on a communication event. The power control circuitry may detect, based on the estimates of electrical current use, a violation of an electrical current threshold. Additionally, the power control circuitry may limit the data rate of communications on the fabric circuitry, proportionally to a magnitude of the violation. Disclosed techniques may mitigate violations with reduced impacts on performance relative to traditional techniques.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體電路晶粒</p>  
        <p type="p">106A~106N:介面電路系統</p>  
        <p type="p">110:電力控制；電力控制電路系統</p>  
        <p type="p">118A~118N:雙態觸變資訊</p>  
        <p type="p">120A~120N:雙態觸變偵測器電路系統；雙態觸變率偵測器電路系統</p>  
        <p type="p">122:通訊事件</p>  
        <p type="p">126:比例資料速率限制控制信號；資料速率限制控制信號</p>  
        <p type="p">134:電流汲取估計</p>  
        <p type="p">138:電流臨限</p>  
        <p type="p">140:網狀架構電路系統</p>  
        <p type="p">150A~150N:客戶端電路系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1943" publication-number="202610584"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610584.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610584</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>避障的處理方法、清潔設備、清潔系統及計算機可讀取儲存介質</chinese-title>  
        <english-title>METHOD, CLEANING DEVICE, CLEANING SYSTEM AND COMPUTER-READABLE STORAGE MEDIUM FOR OBSTACLE AVOIDANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250930B">A47L11/40</main-classification>  
        <further-classification edition="200601120250930B">A47L11/24</further-classification>  
        <further-classification edition="200601120250930B">A47L11/28</further-classification>  
        <further-classification edition="202401120250930B">G05D1/622</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUAN, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供了一種避障的處理方法、清潔設備、清潔系統、計算機可讀取儲存介質、電子設備，其中，避障的處理方法包括：通過障礙物感測器探測清潔設備的周圍環境，生成所述周圍環境對應的低矮障礙物地圖；所述低矮障礙物地圖至少用於指示低矮障礙物在所述周圍環境中的邊界輪廓；根據所述低矮障礙物在所述周圍環境中的邊界輪廓確定針對所述低矮障礙物的避障路徑；在所述清潔設備靠近所述低矮障礙物時，所述清潔設備沿著所述避障路徑進行移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an obstacle avoidance processing method for a cleaning device, a cleaning device, a cleaning system, a computer-readable storage medium, and an electronic device. The obstacle avoidance processing method for the cleaning device includes: detecting a surrounding environment of the cleaning device via an obstacle sensor to generate a low-obstacle map corresponding to the surrounding environment; where the low-obstacle map is at least configured to indicate the boundary contours of low obstacles within the surrounding environment; determining an obstacle avoidance path for the low obstacles based on the boundary contours of the low obstacles within the surrounding environment; and when the cleaning device approaches the low obstacles, the cleaning device moving along the obstacle avoidance path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110:步驟</p>  
        <p type="p">S120:步驟</p>  
        <p type="p">S130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1944" publication-number="202612370"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612370.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612370</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134919</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種通信方法及裝置</chinese-title>  
        <english-title>A COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W40/24</main-classification>  
        <further-classification edition="200901120251201B">H04W48/18</further-classification>  
        <further-classification edition="200901120251201B">H04W8/02</further-classification>  
        <further-classification edition="200901120251201B">H04W8/04</further-classification>  
        <further-classification edition="201801120251201B">H04W76/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李浩然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HAORAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐藝珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YISHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓之琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, ZHILIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種通信方法及裝置，涉及通信技術領域，接入網設備接收來自終端的第一消息，第一消息包括：第一指示資訊和第一請求消息，第一指示資訊指示終端請求的業務資訊；根據第一指示資訊獲取第一請求消息的目的位址。本申請中，接入網設備接收到同第一請求消息共同發送的指示終端請求的業務資訊的第一指示資訊後，可基於第一指示資訊確定將第一請求消息路由到大網或子網處理，基於此，可以明確第一請求消息的路由位址，進而提高資料處理效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a communication method and device, which relates to the field of communication technology. The access network device receives a first message from the terminal, wherein the first message includes: a first indication information and a first request message, the first indication information indicates the service information requested by the terminal; and the destination address of the first request message is obtained based on the first indication information. In this application, after the access network device receives the first indication information that indicates the service information requested by the terminal, which is sent together with the first request message, it can determine to route the first request message to the main network or a subnet for processing based on the first indication information. Based on this, the routing address of the first request message can be clearly determined, thereby improving data processing efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401、402、403、404、405、406、407、408、409、410、411:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1945" publication-number="202612003"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612003.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612003</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134975</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基片乾燥方法和裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01L21/302</main-classification>  
        <further-classification edition="200601120251001B">F26B1/00</further-classification>  
        <further-classification edition="200601120251001B">F26B21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐園園</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YUANYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙利萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LIPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請的實施例提供了一種基片乾燥方法和裝置，基片經過清洗液清洗後基片表面具有殘留的清洗液，方法包括基片向基片噴灑與清洗液互溶的第一液體，直至基片表面的清洗液被清洗乾淨，基片表面殘留第一液體；向腔體內通入設定量的第一乾燥氣體，同時向基片噴灑改性藥液，改性藥液與第一液體互溶，並使基片表面變為疏水表面；向基片噴第二乾燥氣體基片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110,S120,S130,S140,S150,S160:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1946" publication-number="202612044"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612044.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612044</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134976</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加熱機構的製程參數獲取裝置和方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">H01L21/66</main-classification>  
        <further-classification edition="200601120251008B">H01L21/67</further-classification>  
        <further-classification edition="200601120251008B">G05D23/19</further-classification>  
        <further-classification edition="200601120251008B">G05D7/06</further-classification>  
        <further-classification edition="200601120251008B">B05B12/08</further-classification>  
        <further-classification edition="201801120251008B">B05B12/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WENJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種加熱機構的製程參數獲取裝置和方法，裝置包括測溫機構和控制單元，測溫機構用於保持在夾持機構上並置於液體噴頭和加熱機構之間，加熱機構包括分佈在不同半徑上的流道空腔，測溫機構內設有溫度感測器；控制單元被配置成調節與該區域對應半徑上的流道空腔對應連接的流體輸送單元內的流體的溫度和/或流量，直到該區域對應半徑的一組溫度感測器測得的溫度位於第一預設溫度範圍內，存儲模組存儲此時的流體溫度和流體流量以作為該區域對應的製程參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:測溫機構</p>  
        <p type="p">20:夾持機構</p>  
        <p type="p">21:定位銷</p>  
        <p type="p">30:噴頭機構</p>  
        <p type="p">31:液體噴頭</p>  
        <p type="p">40:加熱機構</p>  
        <p type="p">41:加熱盤</p>  
        <p type="p">42:軸體</p>  
        <p type="p">50:控制單元</p>  
        <p type="p">70:轉軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1947" publication-number="202612311"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612311.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612311</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134979</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>性能維護系統和性能維護方法</chinese-title>  
        <english-title>PERFORMANCE MAINTENANCE SYSTEM AND PERFORMANCE MAINTENANCE METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">H04L41/06</main-classification>  
        <further-classification edition="200601120251201B">H04L1/24</further-classification>  
        <further-classification edition="200601120251201B">G06F11/30</further-classification>  
        <further-classification edition="200601120251201B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周志杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐偉烝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許軒榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSUAN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪仕哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, SHIH-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JYUN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>闕禮宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIUEH, LI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王信友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種性能維護系統包括第一裝置、主機和處理器。該主機包括主機控制器、傳輸協定層元件、實體層元件。該處理器配置為根據來自記憶體的多個指令執行以下步驟：進入第一模式；監控多個訊號和溫度訊號；確定該多個訊號的第一值或該溫度訊號的第二值是否大於電壓閾值或溫度閾值；當確定該多個訊號的第一值或該溫度訊號的第二值大於電壓閾值或溫度閾值時，退出第一模式；以及控制第一裝置向主機的第一接收器發送訓練訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A performance maintenance system includes a first device, a host, and a processor. The host includes a host controller, a transport protocol layer component, a physical layer component. The processor is configured to execute the following steps based on a plurality of instructions from a memory: entering a first mode; monitoring the plurality of signals and the temperature signal; determining whether a first value of the plurality of signals or a second value of the temperature signal is greater than a voltage threshold value or a temperature threshold value; when it is determined that the first value of the plurality of signals or the second value of the temperature signal is greater than the voltage threshold value or the temperature threshold value, exiting the first mode; and controlling the first device to send a training signal to a first receiver of the host.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:操作示意圖</p>  
        <p type="p">410:第一操作</p>  
        <p type="p">411、412、413、414:步驟</p>  
        <p type="p">420:第二操作</p>  
        <p type="p">421、422、423:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1948" publication-number="202612283"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612283.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612283</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134993</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編碼方法、解碼方法及裝置</chinese-title>  
        <english-title>ENCODING METHOD, DECODING METHOD, ENCODING APPARATUS AND DECODING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H03M13/11</main-classification>  
        <further-classification edition="200601120251103B">H04L1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淦明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAN, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛　岩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIN, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及通信技術領域，尤其涉及一種編碼方法、解碼方法及裝置。本申請可以應用於IEEE 802.11ax標準、802.11be標準、802.11bn標準等以及IEEE 802.11系列的其他標準，如802.15標準、802.11bf標準或IMMW標準或星閃標準等。該方法包括：第一站點獲取資訊位元，並基於校驗矩陣對該資訊位元進行LDPC編碼，獲得編碼後的位元，並輸出該序列。第二站點在獲得待解碼資訊之後，結合校驗矩陣進行LDPC解碼，得到資訊位元。該校驗矩陣對應的碼長為7776，該校驗矩陣對應的碼率為3/4，該校驗矩陣的擴展因子為162。上述校驗矩陣可以更好地匹配更長碼長，提高編解碼性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to the field of communication technology, particularly to an encoding method, decoding method, encoding apparatus and decoding apparatus. The application can be applied to the IEEE 802.11ax standard, 802.11be standard, 802.11bn standard, and other standards in the IEEE 802.11 series, such as the 802.15 standard, 802.11bf standard, IMMW standard, or Starlink standard. The method includes: a first station obtaining information bits and performing LDPC encoding on these information bits based on a parity-check matrix to obtain encoded bits, and outputting the encoded bits. After obtaining the information to be decoded, the second station performs LDPC decoding in conjunction with the parity-check matrix to retrieve obtain information bits. The parity-check matrix corresponds to a code length of 7776, a code rate of 3/4, and an expansion factor of 162. The aforementioned parity-check matrix can match longer code lengths better, thereby improving the performance of encoding and decoding.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401、402、403、404:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1949" publication-number="202610585"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610585.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610585</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134995</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備的控制方法、清潔設備、電腦設備及電腦可讀儲存媒體</chinese-title>  
        <english-title>CONTROL METHOD OF CLEANING EQUIPMENT, CLEANING EQUIPMENT, COMPUTER EQUIPMENT AND COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251031B">A47L11/40</main-classification>  
        <further-classification edition="200601120251031B">A47L11/22</further-classification>  
        <further-classification edition="200601120251031B">A47L11/30</further-classification>  
        <further-classification edition="200601120251031B">A47L11/29</further-classification>  
        <further-classification edition="200601120251031B">A47L11/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳洛克創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, RUIYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容關於一種清潔設備的控制方法、清潔設備、電腦設備及電腦可讀儲存媒體，其中，清潔設備包括滾刷和吸污機構，吸污機構包括污水箱、吸污風機和吸污管道，在清潔設備從運行狀態切換至駐停狀態的情況下，首先獲取清潔設備從運行狀態切換至駐停狀態的過程中滾刷的運動狀態；其次，根據滾刷的運動狀態，控制滾刷沿目標方向移動第一距離，以將清潔設備駐停時殘留在作業面上的污水吸到滾刷上；最後，控制吸污風機將滾刷上的污水經過吸污管道吸入污水箱。這樣，可以減少清潔設備駐停時殘留在作業面上的水漬，提高了清潔設備的清潔效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiment of the application discloses a control method of cleaning equipment, cleaning equipment, computer equipment and computer-readable storage medium, wherein the cleaning equipment comprises roller brush and sewage suction mechanism, and the sewage suction mechanism comprises sewage tank, sewage suction fan and sewage suction pipeline, when the cleaning equipment is switched from the running state to the stopping state, firstly, the motion state of the roller brush in the process of switching the cleaning equipment from the running state to the stopping state is obtained; secondly, according to the motion state of the roller brush, the roller brush is controlled to move for a first distance in the target direction, so as to suck the sewage left on the working surface when the cleaning equipment stops; finally, the sewage suction fan is controlled to suck the sewage on the roller brush into the sewage tank through the sewage suction pipeline. In this way, the water stains left on the working surface when the cleaning equipment is stopped can be reduced, and the cleaning effect of the cleaning equipment is improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201:步驟</p>  
        <p type="p">S202:步驟</p>  
        <p type="p">S203:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1950" publication-number="202612197"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612197.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612197</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135042</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>屏蔽殼組件、連接器和電子產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251124B">H01R13/659</main-classification>  
        <further-classification edition="200601120251124B">H01R13/648</further-classification>  
        <further-classification edition="201101120251124B">H01R13/6586</further-classification>  
        <further-classification edition="201101120251124B">H01R13/6587</further-classification>  
        <further-classification edition="201101120251124B">H01R24/30</further-classification>  
        <further-classification edition="201101120251124B">H01R24/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商泰科電子(上海)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYCO ELECTRONICS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
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              <chinese-name name-type="organization"> 
                <last-name>大陸商青島安普泰科電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYCO ELECTRONICS AMP QINGDAO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
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        </applicants>  
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              <chinese-name name-type="organization"> 
                <last-name>張杰峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIEFENG (LEAR)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
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              <chinese-name name-type="organization"> 
                <last-name>李志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHIQIANG (SIMON)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
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              <chinese-name name-type="organization"> 
                <last-name>王金強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JINQIANG (JEFF)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
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              <chinese-name name-type="organization"> 
                <last-name>沈國曉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, GUOXIAO (NEO)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
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              <chinese-name name-type="organization"> 
                <last-name>趙衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, WEI (DAVID)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林桂濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, GUIBIN (GABBY)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
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          <agent rep-type="agent" sequence="1"> 
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              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
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          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
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              <address>臺北市</address> 
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    <description> 
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        <p type="p">本發明公開一種屏蔽殼組件、連接器和電子產品。所述屏蔽殼組件包括：屏蔽殼；和安裝框，被固定到所述屏蔽殼的外側上。所述安裝框具有適於被按壓在電路板的加載框的頂面上的加載板，使得所述屏蔽殼適於通過所述加載板被加載到所述電路板上。在本發明中，連接器的屏蔽殼通過加載板被按壓和加載到電路板的加載框上。因此，本發明不需要在屏蔽殼上形成插腳和在電路板上形成與插腳接合的插孔。本發明不會影響電路板上的佈線，而且能夠減小電子產品的體積和提高電子產品的電氣性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
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        <p type="p">2:屏蔽殼</p>  
        <p type="p">10:子框架</p>  
        <p type="p">11:側板部</p>  
        <p type="p">12:端板部</p>  
        <p type="p">21:側壁</p>  
        <p type="p">22:端壁</p>  
        <p type="p">121:連接板</p>  
        <p type="p">122:加載板</p> 
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          <doc-number>202612284</doc-number> 
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        <document-id> 
          <doc-number>114135076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編碼方法、譯碼方法及裝置</chinese-title>  
        <english-title>ENCODING METHOD, DECODING METHOD, ENCODING APPARATUS AND DECODING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H03M13/11</main-classification>  
        <further-classification edition="200601120251103B">H03M13/03</further-classification>  
        <further-classification edition="200601120251103B">H04L1/00</further-classification> 
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      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
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          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淦明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAN, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛　岩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIN, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
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          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
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        <p type="p">本申請涉及通信技術領域，尤其涉及一種編碼方法、譯碼方法及裝置。本申請可以應用於IEEE 802.11ax標準、802.11be標準、802.11bn標準等以及IEEE 802.11系列的其他標準，如802.15標準、802.11bf標準或IMMW標準或星閃標準等。該方法包括：第一站點獲取資訊位元，並基於校驗矩陣對該資訊位元進行LDPC編碼，獲得編碼後的位元，並輸出該序列。第二站點在獲得待譯碼資訊之後，結合校驗矩陣進行LDPC譯碼，得到資訊位元。該校驗矩陣對應的碼長為7776，該校驗矩陣對應的碼率為5/6，該校驗矩陣的擴展因子為162。上述校驗矩陣可以更好地匹配更長碼長，提高編譯碼性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to the field of communication technology, particularly to an encoding method, decoding method, encoding apparatus and decoding apparatus. The application can be applied to the IEEE 802.11ax standard, 802.11be standard, 802.11bn standard, and other standards in the IEEE 802.11 series, such as the 802.15 standard, 802.11bf standard, IMMW standard, or Starlink standard. The method includes: a first station obtaining information bits and performing LDPC encoding on these information bits based on a parity-check matrix to obtain encoded bits, and outputting the encoded bits. After obtaining the information to be decoded, the second station performs LDPC decoding in conjunction with the parity-check matrix to obtain information bits. The parity-check matrix corresponds to a code length of 7776, a code rate of 5/6, and an expansion factor of 162. The aforementioned parity-check matrix can match longer code lengths better, thereby improving the performance of encoding and decoding.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401、402、403、404:步驟</p> 
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      <isuno>6</isuno>  
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          <doc-number>202612285</doc-number> 
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      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135092</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編碼方法、解碼方法及裝置</chinese-title>  
        <english-title>ENCODING METHOD, DECODING METHOD, ENCODING APPARATUS AND DECODING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H03M13/11</main-classification>  
        <further-classification edition="200601120251103B">H04L1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淦明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAN, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛　岩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIN, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及通信技術領域，尤其涉及一種編碼方法、解碼方法及裝置。本申請可以應用於IEEE 802.11ax標準、802.11be標準、802.11bn標準等以及IEEE 802.11系列的其他標準，如802.15標準、802.11bf標準或IMMW標準或星閃標準等。該方法包括：第一站點獲取資訊位元，並基於校驗矩陣對該資訊位元進行LDPC編碼，獲得編碼後的位元，並輸出該序列。第二站點在獲得待解碼資訊之後，結合校驗矩陣進行LDPC解碼，得到資訊位元。該校驗矩陣對應的碼長為7776，該校驗矩陣對應的編碼率為2/3，該校驗矩陣的擴展因數為162。上述校驗矩陣可以更好地匹配更長碼長，提高編解碼性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to the field of communication technology, particularly to an encoding method, decoding method, encoding apparatus and decoding apparatus. The application can be applied to the IEEE 802.11ax standard, 802.11be standard, 802.11bn standard, and other standards in the IEEE 802.11 series, such as the 802.15 standard, 802.11bf standard, IMMW standard, or Starlink standard. The method includes: a first station obtaining information bits and performing LDPC encoding on these information bits based on a parity-check matrix to obtain encoded bits, and then outputting the encoded bits. After obtaining the information to be decoded, the second station performs LDPC decoding in conjunction with the parity-check matrix to obtain information bits. The parity-check matrix corresponds to a code length of 7776, a code rate of 2/3, and an expansion factor of 162. The aforementioned parity-check matrix can match longer code lengths better, thereby improving the performance of encoding and decoding.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401~404:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1953" publication-number="202612074"> 
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      <isuno>6</isuno>  
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          <doc-number>202612074</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135101</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>映射裝置及裝載埠裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">H01L21/67</main-classification>  
        <further-classification edition="200601120251212B">H01L21/677</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＤＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TDK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤絋大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KODAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部知史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TOMOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小番達裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOTSUGAI, TATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">映射裝置檢測複數方型板狀對象物，具有：第一檢測部，具有與方型板狀對象物的第一邊和與第一邊大致垂直的第二邊交叉的第一檢測軸，檢測第一角部厚度；第二檢測部，具有與第一邊和第三邊交叉的第二檢測軸，檢測第二角部厚度；第一資訊獲取部，獲取與方型板狀對象物相關的第一方向的撓曲量的第一資訊；校正值計算部，對相對於方型板狀對象物的第一角部厚度和第二角部厚度之和或第一角部厚度和第二角部厚度的平均值進行基於第一資訊的校正，計算與方型板狀對象物的第一方向的厚度相關的校正後檢測值；判別部，使用校正後檢測值判別收納狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:第一檢測部</p>  
        <p type="p">32:第一檢測軸</p>  
        <p type="p">34:第一發光部</p>  
        <p type="p">36:第一受光部</p>  
        <p type="p">40:第二檢測部</p>  
        <p type="p">42:第二檢測軸</p>  
        <p type="p">44:第二發光部</p>  
        <p type="p">46:第二受光部</p>  
        <p type="p">54:映射臂</p>  
        <p type="p">56:寬度方向部分</p>  
        <p type="p">56a:一側</p>  
        <p type="p">56b:另一側</p>  
        <p type="p">57:第一突出部分</p>  
        <p type="p">58:第二突出部分</p>  
        <p type="p">80:基板</p>  
        <p type="p">81a:第一角部</p>  
        <p type="p">81b:第二角部</p>  
        <p type="p">82a:第一邊</p>  
        <p type="p">82b:第二邊</p>  
        <p type="p">82c:第三邊</p>  
        <p type="p">82d:第四邊</p>  
        <p type="p">86:中心</p>  
        <p type="p">90:第三檢測部</p>  
        <p type="p">92:第三檢測軸</p>  
        <p type="p">94:第三發光部</p>  
        <p type="p">96:第三受光部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1954" publication-number="202612141"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612141.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612141</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135112</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251113B">H01L23/492</main-classification>  
        <further-classification edition="200601120251113B">H01L23/532</further-classification>  
        <further-classification edition="200601120251113B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方略電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANELSEMI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李晉棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHIN-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電子裝置，包括一核心基板、一導電層構造、一接著圖層，與一導電件。核心基板界定兩相對之表面，並具有一貫穿其兩表面之通孔；導電層構造疊設於該核心基板之一側；其中，該導電層構造至少部分覆蓋該通孔之一開口。接著圖層位於該導電層構造與該核心基板之間，並將該導電層構造接合於該核心基板；該接著圖層具有一開口區，該開口區顯露該導電層構造之至少一部分；其中，該通孔與該開口區於該投影方向至少部分重疊。導電件由經熱固化之導電材形成，設置於該核心基板之通孔中，其一端經由該開口區電性連接至該導電層構造。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a core substrate, a conductive layer structure, an adhesive pattern layer, and a conductive member. The core substrate defines two opposite surfaces and has a through hole penetrating the two surfaces. The conductive layer structure is stacked over one side of the core substrate, at least partially covering one opening of the through hole. The adhesive pattern layer is disposed between the conductive layer structure and the core substrate, bonding the conductive layer structure to the core substrate; the adhesive pattern layer has an opening window exposing at least a portion of the conductive layer structure; the through hole and the opening window at least partially overlap in the projection direction. The conductive member is formed from a thermally cured conductive material, disposed in the through hole of the core substrate, with one end electrically connected to the conductive layer structure through the opening window.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子裝置</p>  
        <p type="p">10:核心基板</p>  
        <p type="p">11:初始基板、裸基板</p>  
        <p type="p">111S、112S:表面</p>  
        <p type="p">12:通孔</p>  
        <p type="p">121O、122O:開口</p>  
        <p type="p">20:導電件</p>  
        <p type="p">21:導電芯</p>  
        <p type="p">30:導電層構造</p>  
        <p type="p">31:導電結構</p>  
        <p type="p">311:導電層</p>  
        <p type="p">312:絕緣層</p>  
        <p type="p">40:接著構造</p>  
        <p type="p">40W:窗口</p>  
        <p type="p">D1:投影方向</p>  
        <p type="p">Z1:單面結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1955" publication-number="202612108"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612108.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612108</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝組件</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L23/045</main-classification>  
        <further-classification edition="200601120251201B">H01L23/528</further-classification>  
        <further-classification edition="200601120251201B">H01L23/538</further-classification>  
        <further-classification edition="202301120251201B">H01L25/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭筌安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHUAN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊挺立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TING-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃震麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHENG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種半導體封裝組件。該半導體封裝組件包括一基板、一第一小芯片結構、一記憶體結構、一第一載體結構以及一第二載體結構。該第一小芯片結構設置於該基板上，且該第一小芯片結構具有第一高度。該記憶體結構設置於該基板上且位於該第一小芯片結構旁，該記憶體結構具有第二高度，該第二高度在與該基板頂表面基本垂直的方向上不同於該第一高度。該第一載體結構鍵合於該第一小芯片結構。該第二載體結構鍵合於該記憶體結構且位於該第一載體結構旁。該第一載體結構與該第二載體結構的頂表面彼此對齊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package assembly is provided. The semiconductor package assembly includes a substrate, a first chiplet structure, a memory structure, a first carrier structure, and a second carrier structure. The first chiplet structure is disposed on the substrate. The first chiplet structure has a first height. The memory structure is disposed on the substrate and beside the first chiplet. The memory structure has a second height that is different from the first height in a direction that is substantially perpendicular to a top surface of the substrate. The first carrier structure is bonded to the first chiplet structure. The second carrier structure is bonded to the memory structure and beside the first carrier structure. Top surfaces of the first carrier structure and second carrier structure are aligned with each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500A:半導體封裝組件</p>  
        <p type="p">200:基板</p>  
        <p type="p">202:核心</p>  
        <p type="p">204:導電材料</p>  
        <p type="p">205:非導電材料</p>  
        <p type="p">206:介電層</p>  
        <p type="p">208:導電層</p>  
        <p type="p">212:孔</p>  
        <p type="p">214:導電墊</p>  
        <p type="p">222:導電結構</p>  
        <p type="p">230:底填充物</p>  
        <p type="p">250:橋接結構</p>  
        <p type="p">260:加強環</p>  
        <p type="p">322:導電結構</p>  
        <p type="p">422:導電結構</p>  
        <p type="p">200B:底表面</p>  
        <p type="p">200E:邊緣</p>  
        <p type="p">200T:頂表面</p>  
        <p type="p">202B:底表面</p>  
        <p type="p">202T:頂表面</p>  
        <p type="p">210-1:重分佈層</p>  
        <p type="p">210-2:重分佈層</p>  
        <p type="p">260E:邊緣</p>  
        <p type="p">300-1:小芯片結構</p>  
        <p type="p">300-2:小芯片結構</p>  
        <p type="p">350-1:載體結構</p>  
        <p type="p">350-1T:頂表面</p>  
        <p type="p">350-2:載體結構</p>  
        <p type="p">350-2T:頂表面</p>  
        <p type="p">370-1:散熱層</p>  
        <p type="p">370-2:散熱層</p>  
        <p type="p">400-1:記憶體結構</p>  
        <p type="p">400-2:記憶體結構</p>  
        <p type="p">450-1:載體結構</p>  
        <p type="p">450-1T:頂表面</p>  
        <p type="p">450-2:載體結構</p>  
        <p type="p">450-2T:載體結構</p>  
        <p type="p">470-1:散熱層</p>  
        <p type="p">470-2:散熱層</p>  
        <p type="p">D100:方向</p>  
        <p type="p">D120:方向</p>  
        <p type="p">H1-1:高度</p>  
        <p type="p">H1-2:高度</p>  
        <p type="p">H2-1:高度</p>  
        <p type="p">H2-2:高度</p>  
        <p type="p">H3-1:高度</p>  
        <p type="p">H3-2:高度</p>  
        <p type="p">H4-1:高度</p>  
        <p type="p">H4-2:高度</p>  
        <p type="p">HT1:總高度</p>  
        <p type="p">HT2:總高度</p>  
        <p type="p">HT3:總高度</p>  
        <p type="p">HT4:總高度</p>  
        <p type="p">S1:堆疊</p>  
        <p type="p">S2:堆疊</p>  
        <p type="p">S3:堆疊</p>  
        <p type="p">S4:堆疊</p>  
        <p type="p">TH:孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1956" publication-number="202610586"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610586.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610586</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135210</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔機器人的控制方法及控制裝置、清潔機器人、清潔系統、電腦可讀儲存媒體及電子設備</chinese-title>  
        <english-title>CONTROL METHOD AND CONTROL DEVICE OF A CLEANING ROBOT, CLEANING ROBOT, CLEANING SYSTEM, COMPUTER-READABLE STORAGE MEDIUM, AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250927B">A47L11/40</main-classification>  
        <further-classification edition="200601120250927B">A47L11/24</further-classification>  
        <further-classification edition="202401120250927B">G05D1/43</further-classification>  
        <further-classification edition="200601120250927B">G05B19/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余文昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, WENHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種清潔機器人的控制方法、清潔機器人的控制裝置、電腦可讀儲存媒體及電子設備，方法包括：獲取工作區域中的非清潔區域；所述工作區域包括可清潔區域以及一個或多個非清潔區域，所述可清潔區域中的至少部分區域為未清潔區域；在所述非清潔區域的邊界與預設區域的邊界之間的中間區域確定第一檢查點；在與所述第一檢查點符合預設關係的未清潔區域中確定目標點；控制清潔機器人移動至所述目標點，並執行預設清潔指令。該方法可以對清潔機器人的工作區域進行充分、有效的清潔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a control method for a cleaning robot, a control apparatus for the cleaning robot, a computer-readable storage medium and an electronic device. The method comprises: acquiring a non-cleaning area in a working area; the working area comprises a cleanable area and one or more non-cleaning areas, and at least part of the cleanable areas are uncleaned areas; determining a first checkpoint in an intermediate area between the boundary of the non-cleaning area and the boundary of a preset area; determining a target point in an uncleaned area that conforms to a preset relationship with the first checkpoint; controlling the cleaning robot to move to the target point and executing a preset cleaning instruction. This method can fully and effectively clean the working area of the cleaning robot.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310-S340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1957" publication-number="202612286"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612286.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612286</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135228</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編碼方法、譯碼方法及裝置</chinese-title>  
        <english-title>ENCODING METHOD, DECODING METHOD, ENCODING APPARATUS AND DECODING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H03M13/11</main-classification>  
        <further-classification edition="200601120251103B">H04L1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淦明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAN, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛　岩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIN, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及通信技術領域，尤其涉及一種編碼方法、譯碼方法及裝置。本申請可以應用於IEEE 802.11ax標準、802.11be標準、802.11bn標準等以及IEEE 802.11系列的其他標準，如802.15標準、802.11bf標準或IMMW標準或星閃標準等。該方法包括：第一站點獲取資訊位元，並基於校驗矩陣對該資訊位元進行LDPC編碼，獲得編碼後的位元，並輸出該序列。第二站點在獲得待解碼資訊之後，結合校驗矩陣進行LDPC解碼，得到資訊位元。該校驗矩陣對應的碼長為7776，該校驗矩陣對應的碼率為1/2，該校驗矩陣的擴展因子為162。上述校驗矩陣可以更好地匹配更長碼長，提高編解碼性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to the field of communication technology, particularly to an encoding method, decoding method, encoding apparatus and decoding apparatus. The application can be applied to the IEEE 802.11ax standard, 802.11be standard, 802.11bn standard, and other standards in the IEEE 802.11 series, such as the 802.15 standard, 802.11bf standard, IMMW standard, or Starlink standard. The method includes: a first station obtaining information bits and performing LDPC encoding on these information bits based on a parity-check matrix to obtain encoded bits, and then outputting the encoded bits. After obtaining the information to be decoded, the second station performs LDPC decoding in conjunction with the parity-check matrix to obtain information bits. The parity-check matrix corresponds to a code length of 7776, a code rate of 1/2, and an expansion factor of 162. The aforementioned parity-check matrix can match longer code lengths better, and improve the performance of encoding and decoding.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401、402、403、404:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1958" publication-number="202610804"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610804.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610804</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135371</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具抗眩光與抗反射功能的塑膠面板的製法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING PLASTIC PANELS WITH ANTI-GLARE AND ANTI-REFLECTIVE FUNCTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250922B">B29C51/30</main-classification>  
        <further-classification edition="200601120250922B">B29C51/42</further-classification>  
        <further-classification edition="200601120250922B">B29C51/46</further-classification>  
        <further-classification edition="200601120250922B">B29D11/00</further-classification>  
        <further-classification edition="200601120250922B">G02B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穎華科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENFLEX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳信元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIN YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡毓鈴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, YU LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐瑞琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JUI LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱顯鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, XIAN JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具抗眩光與抗反射功能的塑膠面板的製法，可於高分子材料基板的平整表面先進行硬質層表面塗佈硬化處理以及抗反射層之多層薄膜表面處理，而後再於多層薄膜表面上進行抗眩光層之表面粗糙化處理。硬質層的材料選用有機無機混成紫外光寡聚物/單體、無機粒子材料、或是高延伸特性(延伸率&amp;gt;200%)之紫外光固化長鏈寡聚物/單體。抗反射層的多層薄膜材料組成選用高折射率之紫外光固化寡聚物/單體或無機材料，搭配低折射率之紫外光固化寡聚物/單體或無機材料。藉由本發明製法與材料所製造的塑膠面板成品可兼具有好的外觀品質及產品特性良率，並同時保有抗眩光及抗反射功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing plastic panels with anti-glare and anti-reflective functions. The flat surface of a polymer material substrate is first coated with a hard-coating layer and formed with a multi-layer thin film of an anti-reflective layer. And then, surface roughening treatment of anti-glare layer is applied on the surface of the multi-layered anti-reflective layer. The hard-coating layer is made of organic-inorganic hybrid ultraviolet (UV) oligomers/monomers, inorganic particle materials, or UV-curable long-chain oligomers/monomers with high elongation properties (elongation ratio&amp;gt;200%). The material of the multi-layer thin film of anti-reflective layer is made of high-refractive-index UV-curable oligomers/monomers or inorganic materials, combined with low-refractive-index UV-curable oligomers/monomers or inorganic materials. The plastic panel manufactured by the method and materials of the present invention can have both good appearance quality and product characteristic yield, while providing anti-glare and anti-reflective functions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21~27:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1959" publication-number="202611552"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611552.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611552</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135372</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具抗眩光與抗反射功能的塑膠面板的製造系統</chinese-title>  
        <english-title>SYSTEM FOR MANUFACTURING PLASTIC PANELS WITH ANTI-GLARE AND ANTI-REFLECTIVE FUNCTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251001B">G02B1/11</main-classification>  
        <further-classification edition="201501120251001B">G02B1/14</further-classification>  
        <further-classification edition="200601120251001B">B29C43/08</further-classification>  
        <further-classification edition="200601120251001B">B29C43/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穎華科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENFLEX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳信元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIN YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡毓鈴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, YU LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐瑞琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JUI LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱顯鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, XIAN JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具抗眩光與抗反射功能的塑膠面板的製法，可於高分子材料基板的平整表面先進行硬質層表面塗佈硬化處理以及抗反射層之多層薄膜表面處理，而後再於多層薄膜表面上進行抗眩光層之表面粗糙化處理。硬質層的材料選用有機無機混成紫外光寡聚物/單體、無機粒子材料、或是高延伸特性(延伸率&amp;gt;200%)之紫外光固化長鏈寡聚物/單體。抗反射層的多層薄膜材料組成選用高折射率之紫外光固化寡聚物單體或無機材料，搭配低折射率之紫外光固化寡聚物/單體或無機材料。藉由本發明製法與材料所製造的塑膠面板成品可兼具有好的外觀品質及產品特性良率，並同時保有抗眩光及抗反射功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing plastic panels with anti-glare and anti-reflective functions. The flat surface of a polymer material substrate is first coated with a hard-coating layer and formed with a multi-layer thin film of an anti-reflective layer. And then, surface roughening treatment of anti-glare layer is applied on the surface of the multi-layered anti-reflective layer. The hard-coating layer is made of organic-inorganic hybrid ultraviolet (UV) oligomers/monomers, inorganic particle materials, or UV-curable long-chain oligomers/monomers with high elongation properties (elongation ratio&amp;gt;200%). The material of the multi-layer thin film of anti-reflective layer is made of high-refractive-index UV-curable oligomers/monomers or inorganic materials, combined with low-refractive-index UV-curable oligomers/monomers or inorganic materials. The plastic panel manufactured by the method and materials of the present invention can have both good appearance quality and product characteristic yield, while providing anti-glare and anti-reflective functions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21~27:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1960" publication-number="202612349"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612349.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612349</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135574</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置、深度影像組件及深度影像調整方法</chinese-title>  
        <english-title>DISPLAY DEVICE, DEPTH IMAGE ASSEMBLY AND DEPTH IMAGE ADJUSTMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251128B">H04N23/73</main-classification>  
        <further-classification edition="200601120251128B">G01S17/08</further-classification>  
        <further-classification edition="202401120251128B">G06T5/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅嘉聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊勝傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHENG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置、深度影像組件及深度影像調整方法。顯示裝置包含深度影像組件及顯示面板。深度影像組件包含測距感測器組及處理器。測距感測器組用以於掃描距離內發送測距光線，並依據掃描距離及曝光時間接收測距光線。處理器依據接收到的測距光線獲得深度圖像，並以深度圖像進行曝光調整程序。處理器根據曝光調整程序的執行結果，選擇性產生第一調整信號或第二調整信號。測距感測器組依據第一調整信號減少曝光時間，或依據第二調整信號增加曝光時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device, a depth image assembly, and a depth image adjustment method are provided. The display device includes a depth image assembly and a display panel. The depth image assembly includes a ranging sensor set and a processor. The ranging sensor set is configured to emit a ranging light within a scanning distance and to receive the ranging light according to the scanning distance and an exposure time. The processor obtains a depth image based on the received ranging light and performs an exposure adjustment procedure according to the depth image. According to an execution result of the exposure adjustment procedure, the processor selectively generates a first adjustment signal or a second adjustment signal. The ranging sensor set decreases the exposure time according to the first adjustment signal, or increases the exposure time according to the second adjustment signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">104:顯示面板</p>  
        <p type="p">106:測距感測器組</p>  
        <p type="p">110:第一面</p>  
        <p type="p">112:第二面</p>  
        <p type="p">114:光發射器</p>  
        <p type="p">116:光接收器</p>  
        <p type="p">117:鏡片</p>  
        <p type="p">118:濾光薄膜</p>  
        <p type="p">L1:測距光線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1961" publication-number="202612560"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612560.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612560</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136590</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">H10H29/10</main-classification>  
        <further-classification edition="200601120251201B">H01L25/075</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹科學園區新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, KUO-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張暉谷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUI-KU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇智淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, JHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包含呈陣列排列的多個佈局單元、設置於佈局單元中的多個發光元件。各佈局單元包含多個畫素單元、多個修補單元及共同電極。各畫素單元包含多個子畫素單元，各子畫素單元包含畫素電極。修補單元其中之一用以修補三個子畫素單元中的任一個，且各修補單元包含修補電極，於各佈局單元中，修補電極的數量小於畫素電極的數量。各發光元件包含電連接畫素電極或修補電極的第一接墊及電連接共同電極的第二接墊，各發光元件的第一接墊與第二接墊的最短連線彼此平行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes multiple layout units arranged in an array and multiple light-emitting elements disposed in the layout units. Each layout unit includes multiple pixel units, multiple repair units and a common electrode. Each pixel unit includes multiple sub-pixel units, and each sub-pixel unit includes a pixel electrode. One of the repair units is used to repair any one of three of the sub-pixel units, and each repair unit includes a repair electrode. In each layout unit, the number of the repair electrodes is smaller than the number of the pixel electrodes. Each light-emitting element includes a first pad electrically connected to the pixel electrode or the repair electrode and a second pad electrically connected to the common electrode. The light-emitting elements have a shortest connecting line between the first pad and the second pad apiece while the shortest connecting lines are parallel to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100、100’:佈局單元</p>  
        <p type="p">111、112、113、114:畫素單元</p>  
        <p type="p">B1、B2、B2’、B3、B4、B4’:第三子畫素單元</p>  
        <p type="p">CE:共同電極</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">ED:發光元件</p>  
        <p type="p">FE:修補電極</p>  
        <p type="p">F1:第一修補單元</p>  
        <p type="p">F2:第二修補單元</p>  
        <p type="p">F3:第三修補單元</p>  
        <p type="p">F4:第四修補單元</p>  
        <p type="p">F5:第五修補單元</p>  
        <p type="p">F6:第六修補單元</p>  
        <p type="p">G1、G2、G2’、G3、G4、G4’:第二子畫素單元</p>  
        <p type="p">PE:畫素電極</p>  
        <p type="p">P1:第一接墊</p>  
        <p type="p">P2:第二接墊</p>  
        <p type="p">R1、R2:第一子畫素單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1962" publication-number="202612075"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612075.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612075</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137531</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於防止流體之滲透及洩漏的多層且多環密封件</chinese-title>  
        <english-title>MULTI-LAYER AND MULTI-RINGED SEALS FOR PREVENTING PERMEATION AND LEAK-BY OF FLUID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">H01L21/67</main-classification>  
        <further-classification edition="201601120251208B">F16J15/3284</further-classification>  
        <further-classification edition="201601120251208B">F16J15/3292</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑟　卡爾　費德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEESER, KARL FREDERICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施特倫　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRENG, TAYLOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小萊恩巴格　尼可　雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINEBARGER JR., NICK RAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一密封件係用於防止流體通過該密封件與第一主體之間的第一界面，該密封件包含第一與第二帶狀構件及橋接構件。第一帶狀構件在該第一帶狀構件之第一側界定第一帶狀密封表面。該第一帶狀構件係配置以在被擠壓至該第一主體時與該第一主體一起提供第一流體密封。第二帶狀構件在該第二帶狀構件之第一側界定第二帶狀密封表面。該第二帶狀構件係配置以在被擠壓至該第一主體時與該第一主體一起提供第二流體密封。該第一帶狀構件及該第二帶狀構件至少部分地在該第一帶狀構件與該第二帶狀構件之間界定一空腔。橋接構件延伸通過該空腔並且將該第一帶狀構件連接至該第二帶狀構件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A seal to prevent fluid through a first interface between the seal and a first body, includes first and second band members and a bridge member. The first band member defines a first band seal surface on first side of the first band member. The first band member is configured to provide a first fluid seal with the first body when compressed to the first body. The second band member defines a second band seal surface on a first side of the second band member. The second band member is configured to provide a second fluid seal with the first body when compressed to the first body. The first band member and the second band member at least partially define a cavity between the first band member and the second band member. The bridge member extends through the cavity and connects the first band member to the second band member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:密封系統</p>  
        <p type="p">202:界面</p>  
        <p type="p">204:O形環</p>  
        <p type="p">206:O形環</p>  
        <p type="p">208:通道</p>  
        <p type="p">210:通道</p>  
        <p type="p">211:中心線</p>  
        <p type="p">212:第一界面主體</p>  
        <p type="p">213:參考平面</p>  
        <p type="p">214:第二界面主體</p>  
        <p type="p">220:第一空間</p>  
        <p type="p">222:箭頭</p>  
        <p type="p">223:第二空間</p>  
        <p type="p">224:箭頭</p>  
        <p type="p">226:通道</p>  
        <p type="p">227:充氣部</p>  
        <p type="p">228:第一泵</p>  
        <p type="p">229:第二泵</p>  
        <p type="p">230:第一空間</p>  
        <p type="p">231:腔室</p>  
        <p type="p">232:第三空間</p>  
        <p type="p">234:頂表面</p>  
        <p type="p">235:頂表面</p>  
        <p type="p">236:底表面</p>  
        <p type="p">237:底表面</p>  
        <p type="p">240:芯部</p>  
        <p type="p">242:芯部</p>  
        <p type="p">244:塗層</p>  
        <p type="p">246:塗層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1963" publication-number="202612076"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612076.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612076</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138220</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴淋頭板及反應器總成</chinese-title>  
        <english-title>SHOWERHEAD PLATE AND REACTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/67</main-classification>  
        <further-classification edition="200601120251201B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南德瓦納　丁卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANDWANA, DINKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>懷特　卡爾　路易斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHITE, CARL LOUIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪洛　艾立克　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHERO, ERIC JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩特羅　威廉　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETRO, WILLIAM GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特后司特　赫伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERHORST, HERBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特里維迪　格尼亞奈斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIVEDI, GNYANESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史墨塞　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMOTZER, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐施塔　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLSTAD, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方杜拉利亞　凱爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FONDURULIA, KYLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威克勒　傑瑞德　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINKLER, JERELD LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金堤　安基特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMTEE, ANKIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露是關於一種噴淋頭總成的實施例，其可用以使用諸如原子層沉積(ALD)之製程沉積半導體層。該噴淋頭總成具有一噴淋頭，其具有有利地減小反應器室大小並減小循環時間的一增加厚度。減小循環時間可改善產出量並減小成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure pertains to embodiments of a showerhead assembly which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The showerhead assembly has a showerhead which has an increased thickness which advantageously decreases reactor chamber size and decreases cycling time. Decreased cycling time can improve throughput and decrease costs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:反應器總成</p>  
        <p type="p">300:噴淋頭總成</p>  
        <p type="p">301:噴淋頭充氣部</p>  
        <p type="p">302:噴淋頭板</p>  
        <p type="p">303:底表面</p>  
        <p type="p">304:孔口</p>  
        <p type="p">305:支撐頂表面</p>  
        <p type="p">306:反應室</p>  
        <p type="p">308:間隔器</p>  
        <p type="p">310:基材支撐</p>  
        <p type="p">311:頂表面</p>  
        <p type="p">312:頂板</p>  
        <p type="p">314:基材</p>  
        <p type="p">316:流量控制環</p>  
        <p type="p">318:下部室隔離組件</p>  
        <p type="p">A:厚度</p>  
        <p type="p">B:高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1964" publication-number="202612332"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612332.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612332</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138399</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊解碼方法、視訊編碼方法及相關之非暫態紀錄媒體</chinese-title>  
        <english-title>VIDEO DECODING METHOD, VIDEO ENCODING METHOD AND RELATED NON-TRANSITORY RECORDING MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251205B">H04N19/51</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓國電子通信研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓國慶熙大學校產學協力團</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金暉容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HUI YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林成昶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, SUNG CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鎭浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔振秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JIN SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIN WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴光勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, GWANG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金耿龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNG YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種影像編碼及解碼之方法及裝置。該影像解碼方法包括：依據一當前區塊是否係一變換跳過區塊而導出該當前區塊之殘餘信號之一掃描類型；及將該掃描類型應用於該當前區塊之該等殘餘信號，其中該變換跳過區塊係尚未對其應用變換之該當前區塊，且係基於指示是否對該當前區塊應用該變換之資訊而指定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are an image encoding and decoding method and apparatus. The image decoding method includes deriving a scan type for the residual signals of a current block depending on whether or not the current block is a transform skip block and applying the scan type to the residual signals of the current block, wherein the transform skip block is the current block to which transform has not been applied and is specified based on information indicating whether or not to apply the transform to the current block.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1965" publication-number="202612333"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612333.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612333</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138422</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊解碼方法、視訊編碼方法及相關之非暫態紀錄媒體</chinese-title>  
        <english-title>VIDEO DECODING METHOD, VIDEO ENCODING METHOD AND RELATED NON-TRANSITORY RECORDING MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251205B">H04N19/51</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓國電子通信研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓國慶熙大學校產學協力團</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金暉容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HUI YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林成昶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, SUNG CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鎭浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔振秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JIN SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIN WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴光勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, GWANG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金耿龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNG YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種影像編碼及解碼之方法及裝置。該影像解碼方法包括：依據一當前區塊是否係一變換跳過區塊而導出該當前區塊之殘餘信號之一掃描類型；及將該掃描類型應用於該當前區塊之該等殘餘信號，其中該變換跳過區塊係尚未對其應用變換之該當前區塊，且係基於指示是否對該當前區塊應用該變換之資訊而指定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are an image encoding and decoding method and apparatus. The image decoding method includes deriving a scan type for the residual signals of a current block depending on whether or not the current block is a transform skip block and applying the scan type to the residual signals of the current block, wherein the transform skip block is the current block to which transform has not been applied and is specified based on information indicating whether or not to apply the transform to the current block.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1966" publication-number="202610879"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610879.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610879</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139118</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兒童載具及其車輪組件</chinese-title>  
        <english-title>CHILD CARRIER AND WHEEL ASSEMBLY THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">B62B9/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘知仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, ZHIREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐頌雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種兒童載具及其車輪組件。車輪組件包括：輪軸；車輪，具有輪圈以及安裝在輪軸上以支撐輪圈的輪轂；發電機總成，其被安裝在車輪內並被配置為由輪軸可轉動地支撐；及傳動機構，被配置為能夠將輪軸的轉動所產生之扭矩選擇性地傳送至發電機總成，其中傳動機構包括：第一驅動構件，其可滑動地設置在輪軸上且與輪軸可同步轉動；及第一操作構件，與第一驅動構件連接，第一操作構件可在第一位置和第二位置之間移動而致使第一驅動構件沿著輪軸滑動，其中第一驅動構件和第一操作構件可移動以將傳動機構在使發電機總成能夠接收扭矩之傳動狀態和使發電機總成不能接收扭矩之非傳動狀態之間轉換，第一操作構件之第一位置對應傳動狀態，第一操作構件之第二位置對應非傳動狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a child carrier and its wheel assembly. The wheel assembly includes: a wheel axle; a wheel having a wheel rim, and a wheel hub installed on the wheel axle for supporting the wheel rim; an electric generator assembly installed within the wheel and configured to be rotatably supported by the wheel axle; and a transmisson mechanism configured to selectively transmit a torque generated by a rotation of the wheel axle to the electric generator assembly, wherein the tramsmission mechanism includes: a first driving element slidably disposed on the wheel axle and rotatable along with the wheel axle; and a first operating element connected to the first driving element, the first operating element being movable between a first position and a second position to cause the first driving element to slide along the wheel axle, wherein the first driving element and the first operating element are movable to switch the transmission mechanism between a transmitting state where the electric generator assembly can receive the torque and a non-transmitting state where electric generator assembly cannot receive the torque, the first position of the first operating element corresponding to the transmitting state and the second position of the first operating element corresponding to the non-transmitting state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:兒童載具</p>  
        <p type="p">10:車架主體</p>  
        <p type="p">11:第一連接件</p>  
        <p type="p">111:管狀連接部</p>  
        <p type="p">112:連接肋</p>  
        <p type="p">20:車頭組件</p>  
        <p type="p">211:車把</p>  
        <p type="p">30:前輪組件</p>  
        <p type="p">31:前車輪</p>  
        <p type="p">40:後輪組件</p>  
        <p type="p">41:後車輪</p>  
        <p type="p">42:後輪架</p>  
        <p type="p">50:車座</p>  
        <p type="p">60:推桿</p>  
        <p type="p">80:釋鎖組件</p>  
        <p type="p">90:背靠組件</p>  
        <p type="p">95:遮陽組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1967" publication-number="202611466"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611466.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611466</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140702</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷盒及具有液冷盒的雙液泵液冷散熱器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">F28F3/06</main-classification>  
        <further-classification edition="200601120251201B">F28F13/00</further-classification>  
        <further-classification edition="200601120251201B">F28D5/00</further-classification>  
        <further-classification edition="200601120251201B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃崇賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TSUNG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃崇賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TSUNG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡建全</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種液冷盒及具有液冷盒的雙液泵液冷散熱器，該液冷盒為背板及周邊側板圍成的矩形盒體，在液冷盒內的中間設有隔板定位部，用於安裝隔板以分隔成兩個液室。該背板內面凸設液泵座，背板外面設有凹入於液泵座的液泵腔，液泵腔用於安裝液泵。液泵座設有連接於周邊側板內面的第一連接塊，側面另設有凸出的第二連接塊，第二連接塊的端面超過其中間的隔板定位部。藉此可選擇在液冷盒的第一連接塊或第二連接塊鑽孔，使同樣結構的兩個液冷盒，只要改變鑽孔方向就能製成兩個孔位不同的液冷盒，進而安裝應用在雙液泵液冷散熱器的散熱排管兩端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:液冷盒</p>  
        <p type="p">11:背板</p>  
        <p type="p">111:凸肋條</p>  
        <p type="p">12:周邊側板</p>  
        <p type="p">13:隔板定位部</p>  
        <p type="p">131:定位凸條</p>  
        <p type="p">132:定位凹槽</p>  
        <p type="p">14:液泵座</p>  
        <p type="p">141:液泵腔</p>  
        <p type="p">142:第二進液孔</p>  
        <p type="p">15:第一連接塊</p>  
        <p type="p">16:第二連接塊</p>  
        <p type="p">161:端面</p>  
        <p type="p">17:第一凸柱</p>  
        <p type="p">18:第二凸柱</p>  
        <p type="p">19:第三凸柱</p>  
        <p type="p">101:第一液室</p>  
        <p type="p">102:第二液室</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1968" publication-number="202612383"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612383.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612383</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140767</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>上鏈及側鏈同步操作的裝置及方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR SIMULTANEOUS UPLINK AND SIDELINK OPERATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251205B">H04W72/56</main-classification>  
        <further-classification edition="202301120251205B">H04W72/23</further-classification>  
        <further-classification edition="202301120251205B">H04W72/12</further-classification>  
        <further-classification edition="202301120251205B">H04W72/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法瑞達　馬提諾　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREDA, MARTINO M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李汶宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MOON-IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　祥德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOANG, TUONG DUC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬里內爾　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARINIER, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧　濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置可以被配置為：在UL優先化臨界值被配置的情況下，基於SL優先化臨界值以及UL優先化臨界值來確定是否優先化側鏈(SL)邏輯通道組(LCG)。該裝置可以被配置為確定與該SL LCG相關聯的優先化值是否低於該SL優先化臨界值。該裝置可以被配置為(例如，至少)確定上鏈(UL) LCG是否具有等於或高於該UL優先化臨界值的優先化值。該裝置可以被配置為：基於UL授權的大小和是否對該SL LCG進行優先化的該確定，確定是否對SL緩衝器狀態報告(BSR)進行優先化。該裝置可以被配置為：基於是否對該SL BSR進行優先化的該確定，報告緩衝器狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus may be configured to determine whether to prioritize a sidelink (SL) logical channel group (LCG) based on an SL prioritization threshold and a UL prioritization threshold, on a condition that a UL prioritization threshold is configured. The apparatus may be configured to determine whether a prioritization value associated with the SL LCG is lower than the SL prioritization threshold. The apparatus may be configured to determine (e.g., at least) whether an uplink (UL) LCG has a prioritization value that is equal to or higher than the UL prioritization threshold. The apparatus may be configured to determine whether to prioritize SL buffer status reporting (BSR) based on a size of a UL grant and the determination of whether to prioritize the SL LCG. The apparatus may be configured to report a buffer status based on the determination of whether to prioritize the SL BSR.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:範例</p>  
        <p type="p">302、304、306、308、310:步驟</p>  
        <p type="p">BSR:緩衝器狀態報告</p>  
        <p type="p">LCG:邏輯通道組</p>  
        <p type="p">SL:側鏈</p>  
        <p type="p">UL:上鏈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1969" publication-number="202612354"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612354.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612354</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>震動隔離器及音訊設備</chinese-title>  
        <english-title>AN ISOLATOR ANDOR AUDIO EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">H04R1/02</main-classification>  
        <further-classification edition="200601120251211B">F16F15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商世紀輝途音響技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTURY STEP AUDIOTECH LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎　玉成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YUK SHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明適用於震動隔離器技術領域，提供了一種震動隔離器及音訊設備，震動隔離器安裝在音訊裝置與基體之間，用於解耦音訊裝置傳遞到基體上的震動，並將從外部環境中傳遞到基體上的震動與音訊裝置分離，震動隔離器包括：底座組件及支撐組件、活動安裝部及減震部，其中支撐組件安裝於底座組件，底座組件放置於支架裝置，支撐組件用於支撐音訊裝置；活動安裝部安裝於底座組件，支撐組件通過活動安裝部與底座組件活動配合或彈性配合；減震部安裝在底座組件與支撐組件之間，用於在支撐組件相對於底座組件進行移動的過程中，對支撐組件減震。本發明所提供的震動隔離器能夠解耦音訊裝置傳遞到支架裝置上的震動，降低音訊裝置的震動對支架裝置的影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:底座組件</p>  
        <p type="p">20:支撐組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1970" publication-number="202612258"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612258.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612258</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141053</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽能循環供電系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251201B">H02S40/38</main-classification>  
        <further-classification edition="200601120251201B">G08G1/005</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻光能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORNG GUANG NENG TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許順興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHUN-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種太陽能循環供電系統，包含日間供電裝置與夜間供電裝置。日間供電裝置會將太陽能轉換成電能並進行蓄電，且會在日間輸出電能以驅動擺臂機構。該夜間供電裝置會將太陽能轉換成電能並進行蓄電，且會在夜間輸出電能以驅動該擺臂機構。透過該太陽能循環供電系統能在白天期間與夜晚期間，持續利用太陽能轉換產生之電能驅動該擺臂機構的設計，不用擔心該擺臂機構會在日落入夜後停止運作，確實可改善目前電動擺臂機器的供電缺點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:擺臂機構</p>  
        <p type="p">3:支架</p>  
        <p type="p">31:底座</p>  
        <p type="p">311:板本體部</p>  
        <p type="p">312:提抓部</p>  
        <p type="p">313:抓握孔</p>  
        <p type="p">32:輪組</p>  
        <p type="p">33:支撐模組</p>  
        <p type="p">331:下支撐桿</p>  
        <p type="p">332:定位孔</p>  
        <p type="p">333:上支撐桿</p>  
        <p type="p">334:定位孔</p>  
        <p type="p">335:定位件</p>  
        <p type="p">34:頂座</p>  
        <p type="p">35:模型頭具</p>  
        <p type="p">4:減速馬達裝置</p>  
        <p type="p">5:擺臂模組</p>  
        <p type="p">51:搖擺座</p>  
        <p type="p">511:樞轉部</p>  
        <p type="p">512:偏心部</p>  
        <p type="p">52:擺臂</p>  
        <p type="p">53:傳動連桿</p>  
        <p type="p">6:太陽能循環供電系統</p>  
        <p type="p">61:第一太陽能模組</p>  
        <p type="p">62:第二太陽能模組</p>  
        <p type="p">63:第一電池</p>  
        <p type="p">64:第二電池</p>  
        <p type="p">65:控制裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1971" publication-number="202612127"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612127.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612127</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141486</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>集成封裝件和其製造方法</chinese-title>  
        <english-title>INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L23/28</main-classification>  
        <further-classification edition="200601120251201B">H01L23/52</further-classification>  
        <further-classification edition="200601120251201B">H01L21/56</further-classification>  
        <further-classification edition="200601120251201B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商星科金朋私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　貴忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KAICHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　佩燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUA, PEIEE LINDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　耀劍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YAOJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種集成封裝件和其製造方法。所述集成封裝件包括：天線模組，所述天線模組包括天線模組基底和頂部天線結構，所述頂部天線結構設置在所述天線模組基底上；第一密封劑，所述第一密封劑密封所述天線模組；第一再分布結構，所述第一再分布結構設置在所述第一密封劑的底表面上，所述第一再分布結構包括被配置成與所述頂部天線結構進行電磁能量耦合的底部天線結構；以及半導體晶片，所述半導體晶片安裝在所述第一再分布結構的底表面上並且與所述底部天線結構電耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:集成封裝件</p>  
        <p type="p">110:天線模組</p>  
        <p type="p">112:頂部天線結構</p>  
        <p type="p">114:天線模組基底</p>  
        <p type="p">116:底部鈍化層</p>  
        <p type="p">118:蓋鈍化層</p>  
        <p type="p">120:第一密封劑</p>  
        <p type="p">130:第一再分布結構</p>  
        <p type="p">131:第一介電層</p>  
        <p type="p">132:第一再分布層</p>  
        <p type="p">132a:底部天線結構</p>  
        <p type="p">132b:第二部分</p>  
        <p type="p">133:第二介電層</p>  
        <p type="p">134:第二再分布層</p>  
        <p type="p">140:半導體晶片</p>  
        <p type="p">140a:有源表面</p>  
        <p type="p">140b:非有源表面</p>  
        <p type="p">142:黏合劑層</p>  
        <p type="p">143:互連焊盤/凸塊</p>  
        <p type="p">150:第二密封劑</p>  
        <p type="p">152:導電柱</p>  
        <p type="p">160:第二再分布結構</p>  
        <p type="p">170:導電凸塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1972" publication-number="202611582"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611582.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611582</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141551</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光子積體電路及其製造方法</chinese-title>  
        <english-title>PHOTONIC INTEGRATED CIRCUIT AND FABRICATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">G02B6/42</main-classification>  
        <further-classification edition="200601120251212B">G02B6/122</further-classification>  
        <further-classification edition="200601120251212B">G02B6/136</further-classification>  
        <further-classification edition="200601120251212B">G02B6/132</further-classification>  
        <further-classification edition="202501120251212B">H10F55/00</further-classification>  
        <further-classification edition="200601120251212B">H01L23/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商匹西量子公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSIQUANTUM, CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡蜜奈爾　菲莫古瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMINENI, VIMAL KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史塔法羅尼　馬特歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAFFARONI, MATTEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>那札菲　法拉茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAJAFI, FARAZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅爾尼丘克　安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MELNICHUK, ANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>可法爾　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOVALL, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置包括包括一基板、處於該基板上之一介電層、處於該介電層內之一波導及光學耦合至該波導之一光電偵測器。該光電偵測器經佈置在該波導層上方並與該基板單片集成。該光電偵測器經組態為在低溫(諸如低於約50 K或約 20K)下操作。在一些實施例中，該單片光子裝置包括熱隔離結構及光學隔離結構。亦描述了用於製造包括該等熱隔離結構及該等光學隔離結構的該單片光子裝置之技術。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device including a substrate, a dielectric layer on the substrate, a waveguide within the dielectric layer, and a photodetector optically coupled to the waveguide. The photodetector is disposed above the waveguide layer and is monolithically integrated with the substrate. The photodetector is configured to operate at low temperatures, such as below about 50 K or about 20 K. In some embodiments, the monolithic photonic device includes thermal isolation structures and optical isolation structures. Techniques for manufacturing the monolithic photonic device, including the thermal isolation structures and optical isolation structures, are also described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學裝置</p>  
        <p type="p">110:雷射</p>  
        <p type="p">120:光子積體電路</p>  
        <p type="p">130:光電偵測器</p>  
        <p type="p">140,150:雜散光</p>  
        <p type="p">160,170,180:隔離結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1973" publication-number="202612231"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612231.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612231</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141780</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多相電源轉換器電路及其控制電路</chinese-title>  
        <english-title>MULTI-PHASE POWER CONVERTER CIRCUIT AND CONTROL CIRCUIT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02M1/08</main-classification>  
        <further-classification edition="200601120251201B">H02M3/156</further-classification>  
        <further-classification edition="200601120251201B">G05F1/565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能創半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇志傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供多相電源轉換器電路及其控制電路。多相電源轉換器電路在電壓輸入端接收輸入電壓，在電壓輸出端輸出輸出電壓，並包含功率級電路以及控制電路。功率級電路耦接於電壓輸入端，並經由電感器耦接於相輸出端。控制電路耦接於功率級電路、相輸出端及電壓輸出端，依據相輸出端的相電流、輸出電壓及參考電壓產生誤差訊號，依據參考電壓及誤差訊號產生補償訊號，依據誤差訊號產生斜坡訊號，並在斜坡訊號跨越補償訊號時，控制功率級電路依據預設占空比運作，使相電流增加。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a multi-phase power converter circuit and a control circuit thereof. The multi-phase power converter circuit receives an input voltage at a voltage input terminal, outputs an output voltage at a voltage output terminal, and includes a power stage circuit and a control circuit. The power stage circuit is coupled to the voltage input terminal, and is coupled to a phase output terminal via an inductor. The control circuit is coupled to the power stage circuit, the phase output terminal and the voltage output terminal, generates an error signal according to a phase current of the phase output terminal, the output voltage and a reference voltage, generates a compensation signal according to the reference voltage and the error signal, generates a ramp signal according to the error signal, and controls the power stage circuit to operate according to a predetermined duty ratio when the ramp signal crosses the compensation signal, so as to increase the phase current.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:功率級電路</p>  
        <p type="p">11:驅動電路</p>  
        <p type="p">12:高側開關</p>  
        <p type="p">13:低側開關</p>  
        <p type="p">20:控制電路</p>  
        <p type="p">21:誤差偵測電路</p>  
        <p type="p">22:補償產生電路</p>  
        <p type="p">23:斜坡產生電路</p>  
        <p type="p">24:比較電路</p>  
        <p type="p">30:導通時間產生電路</p>  
        <p type="p">100:多相電源轉換器電路</p>  
        <p type="p">RCO:電阻器</p>  
        <p type="p">CO:去耦合電容器</p>  
        <p type="p">GND:接地電壓</p>  
        <p type="p">IL:相電流</p>  
        <p type="p">L:電感器</p>  
        <p type="p">NIN:電壓輸入端</p>  
        <p type="p">NPHA:相輸出端</p>  
        <p type="p">NPS:輸出端</p>  
        <p type="p">NOUT:電壓輸出端</p>  
        <p type="p">PTRI:觸發脈衝</p>  
        <p type="p">RL:負載電阻器</p>  
        <p type="p">VCOMP:補償訊號</p>  
        <p type="p">VDAC:參考電壓</p>  
        <p type="p">VERR:誤差訊號</p>  
        <p type="p">VGH,VGL:驅動訊號</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">VRAMP:斜坡訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1974" publication-number="202612347"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612347.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612347</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141792</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於機器學習的對焦方法和影像系統</chinese-title>  
        <english-title>FOCUSING METHOD AND IMAGING SYSTEM BASED ON MACHINE LEARNING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251128B">H04N23/67</main-classification>  
        <further-classification edition="202301120251128B">G06N3/0464</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅嘉聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳慶祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHING-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳梅芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MEI-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種基於機器學習的對焦方法和影像系統。此方法包含：由影像擷取裝置以第一焦距設定值擷取第一影像，此第一焦距設定值用以決定影像擷取裝置擷取第一影像時的焦距；將第一影像的至少一部份以及多個特徵輸入至機器學習模型以得到預測焦距設定值，其中這些特徵包含第一焦距設定值；以及根據預測焦距設定值來控制影像擷取裝置以擷取第二影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a focusing method and an imaging system based on machine learning. The method includes: capturing a first image by an image capturing device with a first focal setting value which is configured to determine a focal length when the image capturing device captures the first image; inputting at least a portion of the first image and a plurality of features into a machine learning model to obtain a predicted focal setting value, wherein the features include the first focal setting value; and controlling the image capturing device to capture a second image according to the predicted focal setting value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201~203:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1975" publication-number="202611221"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611221.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611221</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141957</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氟樹脂組成物、及成形體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">C08L27/18</main-classification>  
        <further-classification edition="201701120251215B">B29C67/04</further-classification>  
        <further-classification edition="200601120251215B">C22B1/26</further-classification>  
        <further-classification edition="200601320251215B">B29K27/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迎弘文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKAE, HIROFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸川洋介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIKAWA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山中拓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANAKA, TAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤丈人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, TAKETO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤龍王</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITOH, RYUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田大貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種氟樹脂組成物、及由上述氟樹脂組成物所得之成形體，上述氟樹脂組成物儘管含有具加熱至熔點以上之溫度之歷程之氟樹脂，但操作性及拉伸特性仍優異。本發明提供一種氟樹脂組成物，其含有氟樹脂A及氟樹脂B，且含有四氟乙烯單元、及基於可與四氟乙烯共聚之改質單體的改質單體單元，上述氟樹脂A具有加熱至熔點以上之溫度之歷程且未表現出熔融流動性，上述氟樹脂B無加熱至熔點以上之溫度之歷程且未表現出熔融流動性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1976" publication-number="202611692"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611692.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611692</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141979</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搜尋裝置及產生裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F3/06</main-classification>  
        <further-classification edition="200601120251201B">G06F12/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立野賢登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATSUNO, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮下大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYASHITA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種可進行記憶體使用量較少之搜尋動作之索引資訊之產生方法、使用該索引資訊之搜尋方法、及產生裝置。 &lt;br/&gt;產生方法包含設定與寫入。設定係將對應於搜尋範圍所含之複數個第1向量之複數個第1節點中之1個，設定為第2節點。寫入係寫入資訊片，上述資訊片包含第2向量、及第2節點之外相鄰節點即1個以上之第3節點各者相關之ID及對應於第3節點之向量即第3向量。第2向量係複數個第1向量中對應於第2節點之第1向量。資訊片係對應於有向圖之索引資訊中之第2節點相關之要件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S107:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1977" publication-number="202612282"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612282.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612282</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142328</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線內解壓縮</chinese-title>  
        <english-title>INLINE DECOMPRESSION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">H03M7/30</main-classification>  
        <further-classification edition="201901120251208B">G06F16/22</further-classification>  
        <further-classification edition="200601120251208B">G06N3/02</further-classification>  
        <further-classification edition="202301120251208B">G06N3/04</further-classification>  
        <further-classification edition="201801120251208B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛瑞利　柯林比頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERRILLI, COLIN BEATON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法德亞納森　納塔那拉珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAIDHYANATHAN, NATARAJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了用於對已經被堆疊壓縮的資料進行解壓縮的技術和裝置。堆疊壓縮代表按照一或多個維度對資料的壓縮。對於非常稀疏的未經壓縮的資料區塊，即包含許多零的資料區塊，堆疊壓縮可為有效的。在堆疊壓縮中，經由從未經壓縮的資料區塊中移除一或多個零字，來將未經壓縮的資料區塊壓縮成經壓縮的資料區塊。在壓縮期間產生映射未經壓縮的資料區塊的零字的映射中繼資料。經由使用映射中繼資料，可對經壓縮的資料區塊進行解壓縮，以恢復未經壓縮的資料區塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques and apparatuses to decompress data that has been stack compressed is described. Stack compression refers to compression of data in one or more dimensions. For uncompressed data blocks that are very sparse, i.e., data blocks that contain many zeros, stack compression can be effective. In stack compression, uncompressed data block is compressed into compressed data block by removing one or more zero words from the uncompressed data block. A map metadata that maps the zero words of the uncompressed data block is generated during compression. With the use of the map metadata, the compressed data block can be decompressed to restore the uncompressed data block.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:方法</p>  
        <p type="p">610:步驟</p>  
        <p type="p">620:步驟</p>  
        <p type="p">630:步驟</p>  
        <p type="p">640:步驟</p>  
        <p type="p">650:步驟</p>  
        <p type="p">660:步驟</p>  
        <p type="p">670:步驟</p>  
        <p type="p">680:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1978" publication-number="202611991"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611991.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611991</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142507</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於多層晶圓影像分析的遮罩影像最佳化方法、機器可讀媒體、系統以及電腦程式產品</chinese-title>  
        <english-title>METHOD, MACHINE-READABLE MEDIUM, SYSTEM, AND COMPUTER PROGRAM PRODUCT FOR MASK IMAGE OPTIMIZATION BASED ON MULTI-LAYER WAFER IMAGE ANALYSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/027</main-classification>  
        <further-classification edition="201201120251201B">G03F1/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商Ｄ２Ｓ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D2S, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐里歐丹　唐納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIORDAN, DONALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤村晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMURA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些實施例提供一種最佳化遮罩布局的方法，遮罩布局用於生產遮罩，遮罩用於製造包含多層部件的積體電路（IC）。方法接收遮罩布局，遮罩布局包含一組對應IC的第一層部件的遮罩影像，第一層部件鄰近第二層部件。方法產生第一晶圓影像，第一晶圓影像包含被預測為待製造以用於第一層的IC部件的代表圖像，此預測係基於所接收的對應第一層的遮罩影像。基於第一晶圓影像中的至少一被預測的IC部件與第二層的第二晶圓影像中的至少一被預測的IC部件之間的位置關係，方法修改第一層的該組遮罩影像中的至少一遮罩影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments provide a method for optimizing a mask layout for producing masks that are used for manufacturing an integrated circuit (IC) having multiple layers of components. The method receives a mask layout including a set of mask images corresponding to a first layer of components of the IC that is adjacent to at least a second layer of components. The method generates a first wafer image including representations of IC components that are predicted to be manufactured for the first layer based on the received set of mask images corresponding to the first layer. Based on a positional relationship between at least one predicted IC component in the first wafer image and at least one predicted IC component in a second wafer image for the second layer, the method modifies at least one mask image in the set of mask images for the first layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:程序</p>  
        <p type="p">1105:目標晶圓影像</p>  
        <p type="p">1110:初始單層遮罩</p>  
        <p type="p">1115:製程資訊</p>  
        <p type="p">1120:單層遮罩影像</p>  
        <p type="p">1125:晶圓空間影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1979" publication-number="202611923"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611923.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611923</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142747</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統中列解碼器及列位址方案</chinese-title>  
        <english-title>ROW DECODER AND ROW ADDRESS SCHEME IN A MEMORY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">G11C11/418</main-classification>  
        <further-classification edition="200601120251215B">G11C7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商超捷公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, KHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LY, ANH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　曉萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, HIEU VAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范　賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHAM, HIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　亨利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, HENRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種列位址解碼方案的許多實例。在一個實例中，一種記憶體系統包括：m個記憶庫的非揮發性記憶體單元，該m個記憶庫分別包括n個或較之為少的區段，並且該等區段分別包括p列；以及，一列解碼器，用於接收包含r個位元的一列位址，並且，(i)使用該r個位元中的t個最低有效位元來識別一列，(ii)使用緊鄰的u個最低有效位元來識別一記憶庫，並且，(iii)使用緊鄰的v個最低有效位元來識別一區段，其中，m≤2&lt;sup&gt;u&lt;/sup&gt;，n≤2&lt;sup&gt;v&lt;/sup&gt;，且p≤2&lt;sup&gt;t&lt;/sup&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Numerous examples are disclosed of a row address decoding scheme. In one example, a memory system comprises m banks of non-volatile memory cells, the m banks respectively comprising n or fewer sectors and the sectors respectively comprising p rows, and a row decoder to receive a row address comprising r bits and to identify (i) a row using the least significant t bits in the r bits, (ii) a bank using the next u least significant bits, and (iii) a sector using the next v least significant bits, where m≤2&lt;sup&gt;u&lt;/sup&gt;, n≤2&lt;sup&gt;v&lt;/sup&gt;, and p≤2&lt;sup&gt;t&lt;/sup&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:記憶體系統</p>  
        <p type="p">801:記憶庫</p>  
        <p type="p">802:記憶庫</p>  
        <p type="p">803:記憶庫</p>  
        <p type="p">804:記憶庫</p>  
        <p type="p">805:行多工器</p>  
        <p type="p">806:行多工器</p>  
        <p type="p">807:行多工器</p>  
        <p type="p">808:行多工器</p>  
        <p type="p">809:感測放大器及行驅動器</p>  
        <p type="p">810:感測放大器及行驅動器</p>  
        <p type="p">811:列解碼器</p>  
        <p type="p">812:列解碼器</p>  
        <p type="p">813:列解碼器</p>  
        <p type="p">814:列解碼器</p>  
        <p type="p">815:高電壓解碼器及閂鎖器</p>  
        <p type="p">816:高電壓解碼器及閂鎖器</p>  
        <p type="p">817:高電壓解碼器及閂鎖器</p>  
        <p type="p">818:高電壓解碼器及閂鎖器</p>  
        <p type="p">819:高電壓解碼器及閂鎖器</p>  
        <p type="p">820:高電壓解碼器及閂鎖器</p>  
        <p type="p">850:邏輯陣列</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1980" publication-number="202611196"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611196.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611196</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>再生增強纖維的製造方法</chinese-title>  
        <english-title>METHOD OF PRODUCING RECYCLED REINFORCING FIBERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">C08J11/08</main-classification>  
        <further-classification edition="200601120251205B">C08L63/00</further-classification>  
        <further-classification edition="200601120251205B">C08L75/06</further-classification>  
        <further-classification edition="200601120251205B">C08K7/06</further-classification>  
        <further-classification edition="202201120251205B">B09B3/00</further-classification>  
        <further-classification edition="202201120251205B">B09B3/40</further-classification>  
        <further-classification edition="200601120251205B">B32B17/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商未來化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIRAIKASEI INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>円子春菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUKO, HARUNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>掛端康成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAKEHATA, YASUNARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤真明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種再生增強纖維的製造方法，可在比較溫和的條件下自纖維強化樹脂材料有效率地回收增強纖維。一種再生增強纖維的製造方法，具有：第一步驟，藉由處理液對包含樹脂以及增強纖維的纖維強化樹脂材料進行處理，使所述纖維強化樹脂材料的所述樹脂的至少一部分溶解於所述處理液；以及第二步驟，在150℃以上的氣體氣氛下對所述纖維強化樹脂材料進行加熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1981" publication-number="202611063"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611063.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611063</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143097</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製備最佳化之多聚化斯塔都聚體(STRADOMER)　GL-2045</chinese-title>  
        <english-title>MANUFACTURING OPTIMIZATION OF GL-2045, A MULTIMERIZING STRADOMER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K14/47</main-classification>  
        <further-classification edition="200601120251201B">C07K16/18</further-classification>  
        <further-classification edition="200601120251201B">C07K16/28</further-classification>  
        <further-classification edition="200601120251201B">C07K16/32</further-classification>  
        <further-classification edition="200601120251201B">C07K16/46</further-classification>  
        <further-classification edition="200601120251201B">C12P21/08</further-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="201701120251201B">A61K47/64</further-classification>  
        <further-classification edition="200601120251201B">C07K1/14</further-classification>  
        <further-classification edition="200601120251201B">B01D15/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商吉林尼克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLIKNIK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布洛克　大衛　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOCK, DAVID S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湄利穹　依曼紐　Ｙ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERIGEON, EMMANUEL Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐爾森　亨利克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLSEN, HENRIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及產生稱為最佳製備之斯塔都聚體(stradomer)之生物活性蛋白的最佳化方法。本發明進一步提供可用於治療疾病及病況、包括自體免疫疾病、發炎性疾病或傳染性疾病之組合物及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure involves optimized methods for production of biologically active proteins termed optimally manufactured stradomers. The present disclosure further provides compositions and methods useful in the treatment of diseases and conditions including autoimmune diseases, inflammatory diseases, or infectious diseases.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1982" publication-number="202611304"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611304.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611304</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143277</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適於利用大氣熔煉進行加工之鎂鋰鋁鋅合金及其用途</chinese-title>  
        <english-title>Magnesium-Lithium-Aluminum-Zin calloy suitable for being processed through air melt and use thereof</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">C22C1/03</main-classification>  
        <further-classification edition="200601120251215B">C22C23/00</further-classification>  
        <further-classification edition="200601120251215B">C22F1/06</further-classification>  
        <further-classification edition="202501120251215B">H05K5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安立材料科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMLI MATERIALS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭建奕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, JIAN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范謹婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, CHIN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種鎂鋰鋁鋅合金，其組成以重量百分比計係包括：5~15wt%的Li、1.5~9.0wt%的Al、0.5~1.5wt%的Zn、0.4~1.3wt%的Y、0.18~1.01wt%的Nd、0.09~0.65wt%的Ce以及平衡量的Mg和不可避免之雜質。實驗數據顯示，本發明之鎂鋰鋁鋅合金的閃燃點係介於620°C至700°C之間，故高於商用的鎂鋰鋁鋅合金LAZ521、LAZ721、LAZ771、LAZ921及LAZ1491。因此，本發明之鎂鋰鋁鋅合金適於利用大氣熔煉將其熔融，接著利用澆鑄成型或射出成型而被加工成一結構件，例如為3C產品的殼件、內構件和輪框。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention primarily discloses a signal bridging circuit integrated within an electronic device comprising a processor and a plurality of transceiver modules. The signal bridging circuit is configured to implement protocol bridging between enhanced Serial Peripheral Interface (eSPI) and Management Data Input/Output (MDIO). Specifically, the signal bridging circuit decodes an eSPI data packet received from the processor to obtain a plurality of bytes, which are correspondingly stored in a plurality of registers. Subsequently, the plurality of bytes are encoded into an MDIO data packet and transmitted to the corresponding transceiver module to perform a control command write operation, or alternatively, the MDIO data packet is transmitted and a response data packet is received from the transceiver module to perform a read operation for obtaining transceiver status data. In short, the disclosed circuit enables the processor to communicate with a new PHY chip that lacks driver support, thereby achieving control over the status and operating mode of the downstream chip.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1983" publication-number="202612232"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612232.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612232</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143570</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多相開關電源及其相數控制方法、控制電路</chinese-title>  
        <english-title>MULTIPHASE SWITCHING POWER SUPPLY AND PHASE NUMBER CONTROL METHOD AND CONTROL CIRCUIT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">H02M1/08</main-classification>  
        <further-classification edition="200601120251128B">H02M3/156</further-classification>  
        <further-classification edition="200601120251128B">G05F1/565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杰華特微電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOULWATT TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韌剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, REN GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉銀象</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YIN XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種多相開關電源及其相數控制方法、控制電路。所述多相開關電源包括n相功率轉換電路，其中n為大於等於2的整數。相數控制方法包括：根據第一參數和負載電流控制所述多相開關電源的工作相數；所述第一參數包括所述多相開關電源的輸入電壓、輸出電壓和溫度中的至少之一，所述工作相數為進行功率運行的功率轉換電路的相數。相對於現有技術的僅根據負載電流控制多相開關電源的工作相數，本發明能夠使得多相開關電源工作得更接近真實的最優效率曲線，甚至工作在真實的最優效率曲線上，提升效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a multiphase switching power supply and phase number control method and control circuit thereof. The multiphase switching power supply comprises an n-phase power conversion circuit, wherein n is an integer greater than or equal to 2. The phase number control method comprises: controlling an operating phase number of the multiphase switching power supply based on a first parameter and load current. The first parameter comprises at least one of input voltage, output voltage, and temperature of the multiphase switching power supply, and the operating phase number refers to the number of power conversion circuits performing power operation. Compared to the prior art that controls the operating phase number solely based on load current, the multiphase switching power supply of the present invention operates closer to or even on a true optimal efficiency curve, so that an efficiency is improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100，S200:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1984" publication-number="202611510"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611510.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611510</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143619</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物質譜自動分析系統及其伺服主機</chinese-title>  
        <english-title>COMPOUND MASS SPECTRUM AUTOMATED ANALYSIS SYSTEM AND THE SERVO HOST THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01N30/72</main-classification>  
        <further-classification edition="200601120251201B">G01N30/82</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>農業部農業藥物試驗所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGRICULTURAL CHEMICALS RESEARCH INSTITUTE, MOA.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪淋楊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LING-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林韶凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHAO-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊瑋臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳國樟</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種化合物質譜自動分析系統，包括一質譜儀（mass spectrometer）、耦接質譜儀的一用戶電腦、及耦接該用戶電腦的一伺服主機，質譜儀用以檢驗一待測溶液，並對應產出一質譜檔案（mass spectrometry file）於該用戶電腦，該用戶電腦用以將該質譜檔案傳送給該伺服主機，該伺服主機具有一讀取程式模組，該讀取程式模組用以從質譜檔案讀取到該待測溶液所含的每一化合物的名稱、多個離子對(ion pair)、及每一離子對的全部波峰（peaks）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A compound mass spectrum automated analysis system includes a mass spectrometer, a client computer coupled to the mass spectrometer, and a servo host coupled to the client computer, a test solution used by the mass spectrometer for testing, to generate a mass spectrometry file to the client computer, and the client computer sends the mass spectrometry file to the servo host, the servo host has a read program module, the read program module is used to read from the mass spectrometry file the names of each compound present in the test solution, multiple ion pairs, and all the peaks of each ion pair.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:質譜儀</p>  
        <p type="p">2:用戶電腦</p>  
        <p type="p">21:收集程式模組</p>  
        <p type="p">3:伺服主機</p>  
        <p type="p">31:化合物清單</p>  
        <p type="p">32:讀取程式模組</p>  
        <p type="p">33:轉換程式</p>  
        <p type="p">34:檢查程式模組</p>  
        <p type="p">35:篩選參數表</p>  
        <p type="p">36:篩選程式模組</p>  
        <p type="p">37:質譜圖繪製程式模組</p>  
        <p type="p">38:訊噪比計算程式模組</p>  
        <p type="p">39:面積比計算程式模組</p>  
        <p type="p">40:特徵波峰抓取程式模組</p>  
        <p type="p">4:待測溶液</p>  
        <p type="p">41:質譜比對程式模組</p>  
        <p type="p">51:標準質譜檔案</p>  
        <p type="p">52:樣品質譜檔案</p>  
        <p type="p">53:檢量點質譜檔案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1985" publication-number="202611571"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611571.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611571</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143809</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導光元件、導光結構及調控曝光角度的調光模組</chinese-title>  
        <english-title>LIGHT GUIDE ELEMENT, LIGHT GUIDE STRUCTURE AND LIGHT ADJUSTMENT MODULE FOR CONTROLLING EXPOSURE ANGLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">G02B6/10</main-classification>  
        <further-classification edition="200601120251128B">G02B26/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅嘉聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉怡緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種導光元件，其包括導光柱。導光柱具有位在相對二端的入光面與出光面。其中，導光柱的一截面垂直於入光面及出光面，以及此截面於出光面的第二側邊對此截面於入光面的第一側邊的長度比值為1.5至4.5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light guide element includes a light guide column having a light incident surface and a light emitting surface at opposite ends respectively. A cross section of the light guide column is substantially perpendicular to the light incident surface and the light emitting surface, and the ratio of the length of the second side of the cross section at the light emitting surface to the first side of the cross section at the light incident surface is 1.5 to 4.5.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:調光模組</p>  
        <p type="p">1:準直器</p>  
        <p type="p">2:發光單元</p>  
        <p type="p">3:光調制單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1986" publication-number="202612234"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612234.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612234</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143943</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>功率變換器及其控制電路、控制方法</chinese-title>  
        <english-title>POWER CONVERTER AND CONTROL CIRCUIT AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120251128B">H02M1/42</main-classification>  
        <further-classification edition="200601120251128B">H02M1/08</further-classification>  
        <further-classification edition="200601120251128B">H02M3/156</further-classification>  
        <further-classification edition="200601120251128B">G05F1/565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杰華特微電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOULWATT TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔昌為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONG, CHANG WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種功率變換器及其控制電路、控制方法，在功率變換器的二次側對獲得的開關頻率資訊和/或電流基準資訊進行調製處理後生成一個參考脈衝信號，通過數位隔離器將該脈衝信號傳遞至一次側，從而在一次側對該參考脈衝信號進行相應的解調處理後即可獲得一次側控制信號，實現對一次側功率電晶體的開關狀態的控制。其中，本發明方案通過特殊的調製解調設置，使得只需單一通道即可在二次側至一次側之間傳遞多種資訊，減少了對一二次側之間的隔離器件的使用數量，簡化了系統結構，降低了系統成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a power converter and control circuit and control method thereof. A reference pulse signal is generated by modulating switching frequency information and/or current reference information on a secondary side of the power converter. The pulse signal is transmitted to a primary side through a digital isolator, so that a primary control signal could be obtained by demodulating the reference pulse signal on the primary side, and control of a switching state of a power transistor on the primary side is achieved. Wherein, the present application uses special modulation and demodulation settings to transmit several information between the secondary side and primary sides through a single channel, the number of isolation devices used between the primary side and secondary side is reduced, system structure is simplified, and system costs is reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:功率變換器</p>  
        <p type="p">21:整流電路</p>  
        <p type="p">22:功率因數校正電路</p>  
        <p type="p">23:功率轉換單元</p>  
        <p type="p">24:一次側控制電路</p>  
        <p type="p">25:協定晶片</p>  
        <p type="p">26:二次側控制電路</p>  
        <p type="p">27:數位隔離器</p>  
        <p type="p">C2:電容</p>  
        <p type="p">Co:輸出電容</p>  
        <p type="p">COMP:誤差信號</p>  
        <p type="p">D1:二極體</p>  
        <p type="p">Drain:汲極</p>  
        <p type="p">Np:一次繞組</p>  
        <p type="p">Ns:二次繞組</p>  
        <p type="p">PFC_EN:第一使能信號</p>  
        <p type="p">PFC-S:第一使能指示信號</p>  
        <p type="p">Q1:功率電晶體</p>  
        <p type="p">Q2:整流管</p>  
        <p type="p">Rcs:採樣電阻</p>  
        <p type="p">R1:電阻</p>  
        <p type="p">TR:變壓器</p>  
        <p type="p">V&lt;sub&gt;AC&lt;/sub&gt;:交流信號</p>  
        <p type="p">Vcs:採樣信號</p>  
        <p type="p">Vgs1:驅動信號</p>  
        <p type="p">Vo:輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1987" publication-number="202611083"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611083.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611083</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144234</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗SIRPα抗體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/28</main-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人神戶大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>的崎尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATOZAKI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>須江真由美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUE, MAYUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村健介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, KENSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉村千草</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIMURA, CHIGUSA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的係提供可使用作為抗腫瘤劑的抗SIRPα抗體、及作為有效成分而含有該抗體的抗腫瘤劑。 &lt;br/&gt;本發明為一種與人類SIRPα特異性結合，且抑制人類SIRPα與CD47之結合的抗體，其包含： &lt;br/&gt;(a)由序列識別號1所表示的胺基酸序列所構成的輕鏈CDRL1、 &lt;br/&gt;(b)由序列識別號2所表示的胺基酸序列所構成的輕鏈CDRL2、 &lt;br/&gt;(c)由序列識別號3所表示的胺基酸序列所構成的輕鏈CDRL3、 &lt;br/&gt;(d)由序列識別號4表示的胺基酸序列所構成的重鏈CDRH1、 &lt;br/&gt;(e)由序列識別號5表示的胺基酸序列所構成的重鏈CDRH2、及 &lt;br/&gt;(f)由序列識別號6表示的胺基酸序列所構成的重鏈CDRH3， &lt;br/&gt;且包含特定的重鏈及輕鏈。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1988" publication-number="202611784"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611784.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611784</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144445</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複數域資料處理方法與人工智慧晶片</chinese-title>  
        <english-title>METHOD FOR PROCESSING COMPLEX NUMBER DATA AND AARTIFICIAL INTELLIGENCE CHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251212B">G06N3/063</main-classification>  
        <further-classification edition="200601120251212B">G06N3/10</further-classification>  
        <further-classification edition="200601120251212B">G06F17/16</further-classification>  
        <further-classification edition="201801120251212B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海壁仞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI BIREN TECHNOLOGY CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種複數域資料處理方法與人工智慧晶片。所述方法包括：取得多個複數域資料；由人工智慧晶片的向量計算核心，從所述多個複數域資料中提取實部資料與虛部資料，並將實部資料與虛部資料分類儲存於人工智慧晶片的共享記憶體中；以及由人工智慧晶片的張量計算核心，從共享記憶體讀取實部資料與虛部資料，並對所讀取的實部資料與所讀取的虛部資料進行交錯運算處理，以取得對應於所述多個複數域資料的運算結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for processing complex number data and an artificial intelligence chip. The method includes: obtaining multiple complex number data; obtaining real part data and imaginary part data from the complex number data by a vector computing core of the artificial intelligence chip, and storing the real part data and the imaginary part data separately in a shared memory of the artificial intelligence chip; and reading the real part data and the imaginary part data from the shared memory by a tensor computing core of the artificial intelligence chip, and performing interleaving operation on the read real part data and the read imaginary part data to obtain an operation result corresponding to the complex domain data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S601~S603:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1989" publication-number="202611084"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611084.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611084</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144479</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗CCR8抗體</chinese-title>  
        <english-title>ANTI-CCR8 ANTIBODIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/28</main-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification>  
        <further-classification edition="200601120251201B">C12N15/13</further-classification>  
        <further-classification edition="200601120251201B">C12N15/86</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾伯維有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABBVIE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薇爾斯巴雀　茱麗　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILSBACHER, JULIE L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史綺米特　帕絲蒂安　雅曼達　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMIDT PAUSTIAN, AMANDA M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席格　珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEAGAL, JANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克羅思基　安卓　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCCLUSKEY, ANDREW J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供抗CCR8抗體，包括使用此類抗體之組成物及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides anti-CCR8 antibodies, including compositions and methods of using such antibodies.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1990" publication-number="202610556"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610556.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610556</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144599</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種氣溶膠生成製品</chinese-title>  
        <english-title>AN AEROSOL-GENERATING PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251128B">A24F40/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳華寶協同創新技術研究院有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN HUABAO COLLABORATIVE INNOVATION TECHNOLOGY RESEARCH INSTITUTE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬早兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, ZAOBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙闖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, CHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許俊鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JUNXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種氣溶膠生成製品，該氣溶膠生成製品包括依次連接的前塞部、氣溶膠生成基質部、支撐部、濾嘴部，以及用於包裝連接的卷包層，卷包層將多個部件卷接為總長42mm~50mm的棒狀製品；本發明的纖維支撐管的壁厚較小，使得纖維支撐管在相同的直徑範圍內具有更大的空間，進而有利於提升支撐部的冷卻能力，有利於減少高溫和高濃度煙氣對纖維支撐管的浸潤效果，此外，利用成形紙和接裝紙的配合，進一步提升了支撐部的支撐能力和降溫能力。支撐部上設置有通孔，通孔的設計便於空氣進入空腔，從而進一步提升降溫能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides an aerosol-generating product including a front plug section, an aerosol-generating substrate section, a support section, and a mouthpiece section that are sequentially connected, and a wrapping layer for packaging and connection., wherein the wrapping layer wraps and connects multiple components into a rod-shaped product with an overall length of 42 mm to 50 mm. The fiber support tube of the present invention has a smaller wall thickness, which allows the fiber support tube to provide a larger internal space within the same diameter range. This design is advantageous for improving the cooling capacity of the support section and helps reduce the infiltration effect of high-temperature and high-concentration aerosol on the fiber support tube. In addition, through the cooperation between the forming paper and the tipping paper, the supporting and cooling performance of the support section is further enhanced. Vent holes are provided on the support section, and the design of these vent holes facilitates air entry into the cavity, thereby further improving the cooling capability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:氣溶膠生成製品</p>  
        <p type="p">110:前塞部</p>  
        <p type="p">120:氣溶膠生成基質部</p>  
        <p type="p">121:金屬感受器</p>  
        <p type="p">122:煙草棒</p>  
        <p type="p">123:捲煙紙包覆層</p>  
        <p type="p">130:支撐部</p>  
        <p type="p">131:纖維支撐管</p>  
        <p type="p">132:空腔</p>  
        <p type="p">133:通孔</p>  
        <p type="p">140:濾嘴部</p>  
        <p type="p">141:易碎風味膠囊</p>  
        <p type="p">150:成形紙</p>  
        <p type="p">160:接裝紙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1991" publication-number="202610554"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610554.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610554</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144604</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種氣溶膠生成製品和提升氣溶膠濃度逐口穩定性的方法</chinese-title>  
        <english-title>AN AEROSOL-GENERATING PRODUCT AND A METHOD FOR IMPROVING PUFF-BY-PUFF STABILITY OF AEROSOL CONCENTRATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251127B">A24D3/04</main-classification>  
        <further-classification edition="202001120251127B">A24F40/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商廣東省金葉科技開發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANGDONG GOLDEN LEAF TECHNOLOGY DEVELOPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬早兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, ZAOBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許俊鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JUNXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙闖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, CHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅源鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, YUANFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, XU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種氣溶膠生成製品和提升氣溶膠濃度逐口穩定性的方法。所述氣溶膠生成製品包括：氣溶膠生成基質段、氣溶膠儲藏段和外包裹件，氣溶膠儲藏段包括管壁和位於管壁內的氣溶膠儲藏室；外包裹件至少包裹氣溶膠生成基質段和氣溶膠儲藏段；氣溶膠生成製品上設置有沿其周向分佈的若干個通孔，氣溶膠儲藏室的直徑與氣溶膠生成製品的外徑之比為75-95%，通孔的總面積與通孔所在的氣溶膠生成製品外周上的環形帶狀區域的面積之比為2.7%-13.6%，通孔與氣溶膠儲藏段的下游端部之間的距離與氣溶膠儲藏段的長度之比為34-60%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application relates to an aerosol-generating product and a method for improving puff-by-puff stability of aerosol concentration. The aerosol-generating product includes an aerosol-generating substrate segment, an aerosol storage segment, and an outer wrapping member. The aerosol storage segment includes a tube wall and an aerosol storage chamber located inside the tube wall; the outer wrapping member at least wraps the aerosol-generating substrate segment and the aerosol storage segment. A plurality of through holes are provided on the aerosol-generating product and are distributed circumferentially. The ratio of the diameter of the aerosol storage chamber to the outer diameter of the aerosol-generating product is 75% to 95%. The ratio of the total area of the through holes to the area of the annular band-shaped region on the outer periphery of the aerosol-generating product where the through holes are located is 2.7% to 13.6%. The ratio of the distance between the through holes and the downstream end of the aerosol storage segment to the length of the aerosol storage segment is 34% to 60%.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:外包裹件</p>  
        <p type="p">2:前部塞</p>  
        <p type="p">3:氣溶膠生成基質段</p>  
        <p type="p">4:氣溶膠儲藏段</p>  
        <p type="p">5:過濾段</p>  
        <p type="p">6:通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1992" publication-number="202610687"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610687.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610687</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144605</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種氣溶膠發生製品及防止氣溶膠生成基質段釋放的焦油被二次氣化的方法</chinese-title>  
        <english-title>AN AEROSOL-GENERATING PRODUCT AND A METHOD FOR PREVENTING RE-VAPORIZATION OF TAR RELEASED FROM THE AEROSOL-GENERATING SUBSTRATE SEGMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251203B">A61K47/61</main-classification>  
        <further-classification edition="202001120251203B">A24F40/465</further-classification>  
        <further-classification edition="202001120251203B">A24F47/00</further-classification>  
        <further-classification edition="202001120251203B">A24D1/22</further-classification>  
        <further-classification edition="202001120251203B">A24B15/167</further-classification>  
        <further-classification edition="200601120251203B">A61M15/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商廣東省金葉科技開發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANGDONG GOLDEN LEAF TECHNOLOGY DEVELOPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛壯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, ZHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙闖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, CHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>繆金波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIAO, JINBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許俊鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JUNXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種氣溶膠發生製品及防止氣溶膠生成基質段釋放的焦油被二次氣化的方法。氣溶膠發生製品包括：遠唇端的前部塞、位於所述前部塞下游的氣溶膠生成基質段；氣溶膠生成基質段內包含氣溶膠生成基質和電磁發熱元件；前部塞材質為聚多糖類材料，所述氣流通道沿著軸向方向延伸的長度大於其沿著徑向方向延伸的長度。前部塞具有能軸嚮導流的氣流通道，焦油易於沿著氣流通道流動。此外，前部塞具有較強的吸附作用，可在焦油流動的同時進行吸附，減少了停留在前部塞近唇端面被反復加熱的焦油量，危害性相對比醋酸纖維大大減小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application relates to an aerosol-generating product and a method for preventing re-vaporization of tar released from the aerosol-generating substrate segment. The aerosol-generating product includes a front plug located at mouth-distal end, and an aerosol-generating substrate segment located downstream of the front plug. The aerosol-generating substrate segment includes an aerosol-generating substrate and an electromagnetic heating element. The front plug is made of a polysaccharide material, and the airflow channel has a length extending in the axial direction that is greater than its length extending in the radial direction. The front plug is provided with an airflow channel capable of guiding airflow in the axial direction, along which tar can easily flow. In addition, the front plug has a strong adsorption capability, allowing it to adsorb tar while it flows, thereby reducing the amount of tar remaining on the mouth-proximal end surface of the front plug that would otherwise be repeatedly heated. Consequently, its harmfulness is greatly reduced compared with cellulose acetate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:前部塞</p>  
        <p type="p">2:氣溶膠生成基質段</p>  
        <p type="p">3:電磁發熱元件</p>  
        <p type="p">4:中空降溫段</p>  
        <p type="p">5:過濾段</p>  
        <p type="p">6:通孔</p>  
        <p type="p">7:捲煙紙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1993" publication-number="202610915"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610915.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610915</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144689</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含一體成形排液管的桶槽</chinese-title>  
        <english-title>A TANK WITH AN INTEGRALLY FORMED DRAINPIPE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">B65D90/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上品綜合工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALLIED SUPREME CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮祈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, JUNG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑩奕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許勝富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHENG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種包含一體成形排液管的桶槽，其包含一桶槽以及一排液管。該排液管包含一貼合部以及一管部，該貼合部以及該管部為一體成形之設計。其中，該貼合部將貼合於該桶槽底部的一底板，該管部經由該穿孔穿設於該槽體。本發明該一體成形之設計不僅免除額外的法蘭，同時亦能避免過往該槽體與一管材焊接後所產生間隙之問題，使該槽體內之液體不易殘留於其中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tank with an integrally formed drainpipe includes a tank and a drain pipe. The drain pipe comprises a contact part and a pipe part. The contact part and the pipe part are integrally formed. Wherein, the contact part is attached to a bottom plate at the bottom of the tank. The pipe part extends through the tank via a hole. The integrally formed designed of the present invention not only eliminates the use of an extra flange, but also avoids the problem of weld seams formed when the flange is welded to the tank, preventing liquid from remaining in the tank.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:槽體</p>  
        <p type="p">11:開口端</p>  
        <p type="p">12:底板</p>  
        <p type="p">121:穿孔</p>  
        <p type="p">122:斜面</p>  
        <p type="p">20:排液管</p>  
        <p type="p">21:管部</p>  
        <p type="p">22:貼合部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1994" publication-number="202611085"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611085.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611085</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144709</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全人源的抗Ｂ細胞成熟抗原（ＢＣＭＡ）單鏈抗體及其應用</chinese-title>  
        <english-title>FULL-HUMAN ANTI-B CELL MATURE ANTIGEN (BCMA) SINGLE CHAIN ANTIBODY AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/28</main-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification>  
        <further-classification edition="200601120251201B">G01N33/574</further-classification>  
        <further-classification edition="200601120251201B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商信達生物製藥（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOVENT BIOLOGICS (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHIYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翟天航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAI, TIANHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周帥祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, SHUAIXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞德超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, DECHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及特異性結合B細胞成熟抗原(BCMA)的新型抗體和抗體片段，尤其是全人源的單鏈抗體scFv。本發明還涉及編碼這些抗體的核酸、載體和表達該核酸的宿主細胞。此外，本發明也涉及包含本發明抗體的組合物、及其在治療和診斷中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to novel antibodies and antibody fragments that specifically bind to B cell mature antigen (BCMA), particularly full-human single chain antibody scFv. The invention also relates to nucleic acids encoding the antibodies, vectors and host cells expressing the nucleic acids. Furthermore, the invention also relates to compositions comprising the antibodies of the invention, and their use in therapy and diagnosis.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1995" publication-number="202611086"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611086.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611086</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144762</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>特異性結合Claudin　18.2的抗體及其製法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/28</main-classification>  
        <further-classification edition="200601120251201B">C12N15/13</further-classification>  
        <further-classification edition="200601120251201B">C12N15/63</further-classification>  
        <further-classification edition="200601120251201B">A61K39/395</further-classification>  
        <further-classification edition="201701120251201B">A61K47/68</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商亘喜生物科技（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRACELL BIOTECHNOLOGIES (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈　連軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>殷文劼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及特異性結合Claudin 18.2的抗體及其製法和應用。具體地，本發明提供了一種抗Claudin 18.2奈米抗體或其結合片段。本發明的抗體具有良好的特異性，並且所述抗體和將該抗體用於製備標靶Claudin 18.2的免疫效應細胞，在治療或改善Claudin 18.2陽性表現的疾病，表現出良好的治療效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1996" publication-number="202611591"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611591.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611591</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144866</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251127B">G02B13/06</main-classification>  
        <further-classification edition="200601120251127B">G02B11/30</further-classification>  
        <further-classification edition="200601120251127B">G02B9/60</further-classification>  
        <further-classification edition="202101120251127B">G02B7/02</further-classification>  
        <further-classification edition="200601120251127B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅嘉聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, TSUNG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，從物側至像側沿光軸依序包括第一透鏡、第二透鏡、第三透鏡、第四透鏡以及第五透鏡。第一透鏡至第五透鏡各自包括朝向物側且使成像光線通過的物側面以及朝向像側且使成像光線通過的像側面。第一透鏡具有負屈光度，且第一透鏡的物側面的光軸區域為凸面。第二透鏡具有正屈光度。第三透鏡具有負屈光度。第四透鏡具有正屈光度。第五透鏡具有負屈光度。光學成像鏡頭具有屈光度的透鏡只有上述五片，並且光學成像鏡頭更滿足以下的條件式：-6.1 ＜ (sag_L5S1_0.8F / sag_L5S1_1.0F) * (sag_L5S2_0.8F / sag_L5S2_1.0F) / CT5 ＜ -0.2。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens, sequentially including a first, a second, a third, a fourth and a fifth lens element along an optical axis from an object side to an image side, is provided. Each of the first to fifth lens elements includes an object-side surface facing the object side and allowing imaging rays to pass through, and an image-side surface facing the image side and allowing the imaging rays to pass through. The first lens element has a negative refracting power, and an optical axis region of the object-side surface of the first lens element is convex. The second lens element has a positive refracting power. The third lens element has a negative refracting power. The fourth lens element has a positive refracting power. The fifth lens element has a negative refracting power. Lens elements of the optical imaging lens are only the five lens elements, and the optical imaging lens satisfies following conditional expressions: -6.1 ＜ (sag_L5S1_0.8F / sag_L5S1_1.0F) * (sag_L5S2_0.8F / sag_L5S2_1.0F) / CT5 ＜ -0.2.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光學成像鏡頭</p>  
        <p type="p">100:光圈</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">111,121,131,141,151,161:物側面</p>  
        <p type="p">112,122,132,142,152,162:像側面</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:濾光片</p>  
        <p type="p">170:成像面</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">I:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1997" publication-number="202610820"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610820.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610820</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144960</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層薄膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B7/12</main-classification>  
        <further-classification edition="201901120251201B">B32B7/06</further-classification>  
        <further-classification edition="200601120251201B">B32B27/00</further-classification>  
        <further-classification edition="201801120251201B">C09J7/38</further-classification>  
        <further-classification edition="201801120251201B">C09J7/40</further-classification>  
        <further-classification edition="200601120251201B">H01L21/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>越智元氣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OCHI, GENKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沖田奈津子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKITA, NATSUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野呂弘司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可在半導體裝置之製造過程中提升作業效率之積層薄膜。&lt;br/&gt; 本發明積層薄膜1之特徵在於：其係依序積層有第1分離件、第1黏著劑層、基材、第2黏著劑層及第2分離件者；前述第1黏著劑層係由低黏著性黏著劑層構成，且前述第2黏著劑層係由剝離性黏著劑層構成；前述第1分離件對前述第1黏著劑層之180°剝開剝離力F(1)、前述第2分離件對前述第2黏著劑層之180°剝開剝離力F(2)、前述第2黏著劑層對玻璃板之180°剝開黏著力P(2)、及前述第2黏著劑層在160℃下經過5分鐘後對玻璃板之180°剝開黏著力P’(2)(N/50mm)滿足下述式之關係。&lt;br/&gt; F(1)≦F(2)&lt;br/&gt; P(2)≧F(1)&lt;br/&gt; P’(2)/P(2)＜1.20&lt;br/&gt; P’(2)＜1.00</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:積層薄膜</p>  
        <p type="p">10:基材</p>  
        <p type="p">11:第1黏著劑層</p>  
        <p type="p">12:第2黏著劑層</p>  
        <p type="p">110:第1分離件</p>  
        <p type="p">120:第2分離件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1998" publication-number="202612345"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612345.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612345</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相機模組</chinese-title>  
        <english-title>CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251128B">H04N23/52</main-classification>  
        <further-classification edition="202101120251128B">G03B17/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅嘉聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉敏男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, MIN-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種相機模組，包括：一影像感測器；一基板，所述影像感測器配置於所述基板的第一側；一延伸部，由第一電路板與第二電路板構成，與所述基板相接；一電極部，由第三電路板與第四電路板構成，所述第三電路板與所述第一電路板電性相連，所述第四電路板與所述第二電路板電性相連；一導熱線，所述導熱線的第一端固定於所述基板的與第一側相對的第二側，並延伸通過所述延伸部與所述電極部；以及一導熱塊，與所述導熱線的第二端相接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a camera module, including: an image sensor; a substrate, wherein the image sensor is configured on a first side of the substrate; an extension portion, composed of a first circuit board and a second circuit board, and connected to the substrate; an electrode portion, composed of a third circuit board and a fourth circuit board, wherein the third circuit board is electrically connected to the first circuit board, and the fourth circuit board is electrically connected to the second circuit board; a heat conductive wire, wherein a first end of the heat conductive wire is fixed to a second side of the substrate opposite to the first side and extends through the extension portion and the electrode portion; and a heat conductive block, connected to a second end of the heat conductive wire.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:影像感測器</p>  
        <p type="p">14:基板</p>  
        <p type="p">14A:基板固定塊</p>  
        <p type="p">16A:第一電路板</p>  
        <p type="p">16B:第二電路板</p>  
        <p type="p">18A:第三電路板</p>  
        <p type="p">18B:第四電路板</p>  
        <p type="p">20:電極</p>  
        <p type="p">22:固定板</p>  
        <p type="p">22A:固定板固定塊</p>  
        <p type="p">24:發光元件</p>  
        <p type="p">26:導熱線</p>  
        <p type="p">27:導熱線固定裝置</p>  
        <p type="p">28:導熱線固定塊</p>  
        <p type="p">30:管體</p>  
        <p type="p">30A:固化膠</p>  
        <p type="p">32:視窗</p>  
        <p type="p">32A:光學膠</p>  
        <p type="p">34:管線尾蓋</p>  
        <p type="p">34A:固化膠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1999" publication-number="202610551"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610551.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610551</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145283</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有生物降解度的環保過濾嘴</chinese-title>  
        <english-title>ECO-FRIENDLY FILTER WITH BIODEGRADABILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">A24D1/04</main-classification>  
        <further-classification edition="200601120251212B">A24D3/04</further-classification>  
        <further-classification edition="200601120251212B">A24D3/06</further-classification>  
        <further-classification edition="200601120251212B">A24D3/10</further-classification>  
        <further-classification edition="200601120251212B">A24D3/18</further-classification>  
        <further-classification edition="200601120251212B">B01D39/18</further-classification>  
        <further-classification edition="200601120251212B">D01D5/06</further-classification>  
        <further-classification edition="200601120251212B">D01D5/22</further-classification>  
        <further-classification edition="200601120251212B">D01F2/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商韓國煙草人參股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KT&amp;G CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商可隆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLON INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河成薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, SUNG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁眞哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬京培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, KYENG BAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭奉洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEONG, BONG SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐昇潼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, SEUNG DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李廷薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JEONG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭鍾喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JONG CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦尙佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SANG WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃永男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, YEONG NAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種吸煙製品用過濾嘴以及包含其的吸煙製品，吸煙製品用過濾嘴包含含有萊賽爾纖維的萊賽爾絲束、黏合劑溶液、以及過濾嘴包裝紙，在30℃海水(Marine)條件下根據ASTM D6691在6個月內測量的生物降解度(biodegradation)為90%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:吸煙製品</p>  
        <p type="p">10:吸煙物質部</p>  
        <p type="p">20:香煙用過濾嘴部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2000" publication-number="202612023"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612023.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612023</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145293</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脈衝式電容耦合電漿製程</chinese-title>  
        <english-title>PULSED CAPACITIVELY COUPLED PLASMA PROCESSES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">H01L21/3065</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡特薩克　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENTZEK, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭傑　艾洛克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANJAN, ALOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷口謙介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGUCHI, KENSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森北信也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIKITA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法，包含實施一第一開啟階段，該第一開啟階段包含將一SP脈衝施加至一SP電極以產生電漿，在該第一開啟階段之後實施一第二開啟階段，在該第二開啟階段之後實施一角隅蝕刻階段，以及在該角隅蝕刻階段之後實施一副產物管理階段。該SP脈衝於該第一開啟階段結束時終止。該第二開起階段包含將一第一BP脈衝施加於與一目標基板耦合的一BP電極。該第一BP脈衝包含一第一BP功率準位，並且將該電漿之離子朝向目標基板加速。該角隅蝕刻階段包含施加一BP尖峰，該BP尖峰包含大於該第一BP功率準位的一第二BP功率準位。該BP尖峰之持續期間小於該第一BP脈衝之持續時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes performing a first on phase including applying an SP pulse to an SP electrode to generate plasma, performing a second on phase after the first on phase, performing a corner etch phase after the second on phase, and performing a by-product management phase after the corner etch phase. The SP pulse terminates at the end of the first on phase. The second on phase includes applying a first BP pulse to a BP electrode coupled to a target substrate. The first BP pulse includes a first BP power level and accelerates ions of the plasma toward to target substrate. The corner etch phase includes applying a BP spike including a second BP power level greater than the first BP power level. The duration of the BP spike is less than the duration of the first BP pulse.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:目標基板</p>  
        <p type="p">160:可蝕刻材料</p>  
        <p type="p">161:遮罩</p>  
        <p type="p">162:凹部</p>  
        <p type="p">163:角隅堆積</p>  
        <p type="p">165:混合層</p>  
        <p type="p">166:循環蝕刻深度</p>  
        <p type="p">167:副產物</p>  
        <p type="p">168:內部角隅蝕刻</p>  
        <p type="p">169:遮罩及側壁清理</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2001" publication-number="202611616"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611616.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611616</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145323</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於生產電光顯示器和光調節薄膜中使用的無縫微結構的連續微影製程</chinese-title>  
        <english-title>CONTINUOUS PHOTOLITHOGRAPHIC FABRICATION PROCESS FOR PRODUCING SEAMLESS MICROSTRUCTURES USED IN ELECTRO-OPTIC DISPLAYS AND LIGHT MODULATING FILMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251215B">G02F1/167</main-classification>  
        <further-classification edition="201901120251215B">G02F1/1675</further-classification>  
        <further-classification edition="201901120251215B">G02F1/1681</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商電子墨水股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E INK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNN, BRYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔爾夫　史蒂芬Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TELFER, STEPHEN J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康　義明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, YIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>惠德瑪　霍瑪艾澤亞可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUITEMA, HJALMAR EDZER AYCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種製造無縫微結構的輥對輥方法，包括以下步驟：(a)連續地形成一層壓結構，包含疊加於基材上之光罩薄膜，在其間具有一層光敏材料，光罩薄膜包括透光區域及遮光區域的圖案；(b)照射於步驟(a)中形成之層壓結構的光罩薄膜，使得光通過光罩薄膜之透光區域，以固化藉由透光區域所暴露的光敏材料之各部分，而使藉由遮光區域所覆蓋的光敏材料之其餘部分未固化；(c)由在步驟(b)中選擇性固化的光敏材料剝離光罩薄膜；及(d)移除光敏材料之未固化部分，以於基材上由光敏材料的固化部分形成一層微結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A roll-to-roll method of fabricating seamless microstructures is provided, including the steps of: (a) continuously forming a laminated structure comprising a photomask film superimposed on a substrate with a layer of photo-sensitive material therebetween, the photomask film including a pattern of light-transmissive regions and light-blocking regions; (b) illuminating the photomask film of laminated structure formed in step (a) such that light passes through the light-transmissive regions of the photomask film to cure portions of the photo-sensitive material exposed by the light-transmissive regions, while leaving the remaining portions of the photo-sensitive material covered by the light-blocking regions uncured; (c) delaminating the photomask film from the photo-sensitive material selectively cured in step (b); and (d) removing the uncured portions of the photo-sensitive material to form a layer of microstructures on the substrate from the cured portions of the photo-sensitive material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光罩薄膜</p>  
        <p type="p">101:基材</p>  
        <p type="p">102:光敏材料</p>  
        <p type="p">103:微結構</p>  
        <p type="p">104:離型襯墊</p>  
        <p type="p">105:遮光層</p>  
        <p type="p">110’:層壓結構</p>  
        <p type="p">112:壓緊輥</p>  
        <p type="p">114:光源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2002" publication-number="202612077"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612077.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612077</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145402</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板剝離裝置、基板剝離方法以及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/67</main-classification>  
        <further-classification edition="200601120251201B">H01L21/683</further-classification>  
        <further-classification edition="201401120251201B">B23K26/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水田吉郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTA, YOSHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本實施形態是有關於一種基板剝離裝置、基板剝離方法以及半導體裝置的製造方法。藉由一個實施形態，提供一種具有吸附載台以及光源的基板剝離裝置。在吸附載台吸附有多個基板的接合體。吸附載台包含第一區域以及第二區域。第二區域較第一區域更靠內側。光源能夠朝向第一區域及第二區域依次照射雷射光。吸附載台的第二區域中的接合體的吸附力較第一區域中的接合體的吸附力弱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板剝離裝置</p>  
        <p type="p">10:吸附載台</p>  
        <p type="p">10a:吸附面</p>  
        <p type="p">10a1、13a1:平坦面</p>  
        <p type="p">10a2、13a2:凸面</p>  
        <p type="p">10b、13b:底面</p>  
        <p type="p">11、12:支撐銷</p>  
        <p type="p">13:載台基座</p>  
        <p type="p">13a:主表面</p>  
        <p type="p">14:支撐構件</p>  
        <p type="p">18:隔壁</p>  
        <p type="p">20:雷射模組</p>  
        <p type="p">21:光源</p>  
        <p type="p">22:光學系統</p>  
        <p type="p">23:框體</p>  
        <p type="p">30:驅動機構</p>  
        <p type="p">31:致動器</p>  
        <p type="p">32:轉軸</p>  
        <p type="p">40:驅動機構</p>  
        <p type="p">50:排氣裝置</p>  
        <p type="p">51:真空泵</p>  
        <p type="p">52:排氣管</p>  
        <p type="p">53:排氣管</p>  
        <p type="p">60:控制器</p>  
        <p type="p">131:主體部分</p>  
        <p type="p">132:真空孔</p>  
        <p type="p">200:雷射光</p>  
        <p type="p">1311:凸部</p>  
        <p type="p">CB:接合體</p>  
        <p type="p">RG1、RG2:區域</p>  
        <p type="p">SP1、SP2:凹空間</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2003" publication-number="202612506"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612506.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612506</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垂直場效應裝置及其製造方法</chinese-title>  
        <english-title>VERTICAL FIELD EFFECT DEVICE AND METHOD OF MANUFACTURING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251215B">H10D30/60</main-classification>  
        <further-classification edition="202501120251215B">H10D30/01</further-classification>  
        <further-classification edition="200601120251215B">H01L21/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西班牙商艾戴德有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEADED, S.L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕瑪　傑米思瑪漢德海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARMAR, JEMISH MAHENDRABHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿柏達派科爾　格雷模</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBAREDA PIQUER, GUILLERMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種垂直場效應電晶體。根據本發明的垂直FET包括基板及配置為電晶體的源極或汲極的第一電極。所述裝置包括配置為電晶體的源極及汲極中的另一個的第二電極，第二電極至少部分地在重疊區域與所述第一電極重疊。此外，所述裝置包括夾在第一電極與第二電極之間的主動層以及具有閘極導體部及閘極絕緣層的閘極，閘極絕緣層被配置在主動層及閘極導體部之間，以避免主動層及閘極導體部的直接接觸。主動層包括配置成縱軸大致與基板平行的1D材料，及/或配置成平面大致與基板平行的2D材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to vertical field effect transistors. The vertical FET according to the invention includes a substrate and a first electrode configured as either a source or a drain of the transistor. The device includes a second electrodeconfigured as the other of the source and the drain, where the second electrode at least partially overlaps the first electrode in an overlapping region. Moreover, the device comprises an active layer that is sandwiched between the first electrode and the second electrode and a gate arrangement including a gate conductor portion and a gate insulating layer, which is arranged between the active layer and a gate conductor portion so as to prevent direct contact between the active layer and the gate conductor portion. The active layer comprises a 1D material arranged with its longitudinal axis parallel to the substrate and/or a 2D material arranged with its plane substantially parallel to the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:垂直場效應電晶體</p>  
        <p type="p">101:基板</p>  
        <p type="p">102:第一電極</p>  
        <p type="p">103:主動層</p>  
        <p type="p">104:第二電極</p>  
        <p type="p">105:第一層間介電層</p>  
        <p type="p">106:閘極絕緣層</p>  
        <p type="p">107:閘極導體部</p>  
        <p type="p">108:第二介電質</p>  
        <p type="p">109:第一源極/汲極接觸件</p>  
        <p type="p">110:第二源極/汲極接觸件</p>  
        <p type="p">111:第三源極/汲極接觸件</p>  
        <p type="p">d1:長</p>  
        <p type="p">d2:寬</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2004" publication-number="202611714"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611714.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611714</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145496</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶可配置糾錯碼（ＥＣＣ）資料保護的系統和記憶體及相關方法</chinese-title>  
        <english-title>SYSTEM AND MEMORY WITH CONFIGURABLE ERROR-CORRECTION CODE (ECC) DATA PROTECTION AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">G06F11/08</main-classification>  
        <further-classification edition="200601120251215B">G11C29/52</further-classification>  
        <further-classification edition="200601120251215B">G06F13/14</further-classification>  
        <further-classification edition="201601120251215B">G06F12/08</further-classification>  
        <further-classification edition="202201120251215B">H04L69/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　正元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUH, JUNGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千　德斯特塔密歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUN, DEXTER TAMIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯瑞尼瓦桑　安納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASAN, ANAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾拉佛納　奧利佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALAVOINE, OLIVIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫兒　勞倫特瑞內</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLL, LAURENT RENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了用於系統糾錯碼功能的方法和裝置。該裝置包括記憶體，該記憶體被配置成經由至少一個資料連接和至少一個非資料連接來與主機進行通訊。該記憶體包括記憶體陣列。該記憶體陣列包括第一部分和第二部分。該記憶體被進一步配置成在第一模式中在該記憶體陣列的第一部分和第二部分中儲存和輸出資料。第一部分可由第一位址定址，而第二部分可由第二位址定址。該記憶體被進一步配置成在第二模式中經由該至少一個非資料連接來從該主機接收資料的ECC，在該記憶體陣列的第一部分中儲存資料，並基於第一位址在該記憶體陣列的第二部分中儲存資料的ECC。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatuses for a system error-correction code function are presented. The apparatus includes a memory configured to communicate with a host via at least one data connection and at least one non-data connection. The memory includes a memory array. The memory array includes a first portion and a second portion. The memory is further configured to, in a first mode, store and output data in the first portion and the second portion of the memory array. The first portion is addressable by a first address, and the second portion is addressable by a second address. The memory is further configured to, in a second mode, receive ECC of the data from the host via the at least one non-data connection, store the data in the first portion of the memory array, and store the ECC of the data in the second portion of the memory array based on the first address.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100_s:裝置</p>  
        <p type="p">110_s:主機</p>  
        <p type="p">115:匯流排系統</p>  
        <p type="p">120:處理器</p>  
        <p type="p">122:CPU</p>  
        <p type="p">123:GPU</p>  
        <p type="p">124:NPU</p>  
        <p type="p">130_s:記憶體控制器</p>  
        <p type="p">131:系統ECC解碼器</p>  
        <p type="p">132:系統ECC編碼器</p>  
        <p type="p">134_s:控制器PHY模組</p>  
        <p type="p">135:鏈路ECC解碼器</p>  
        <p type="p">136:鏈路ECC編碼器</p>  
        <p type="p">150_s:記憶體</p>  
        <p type="p">160:記憶體I/O模組</p>  
        <p type="p">161:記憶體鏈路ECC解碼器</p>  
        <p type="p">162:記憶體鏈路ECC編碼器</p>  
        <p type="p">163:節點</p>  
        <p type="p">164:節點</p>  
        <p type="p">171:陣列ECC解碼器</p>  
        <p type="p">172:陣列ECC編碼器</p>  
        <p type="p">173:節點</p>  
        <p type="p">174:節點</p>  
        <p type="p">175_s:記憶體陣列</p>  
        <p type="p">176:陣列ECC</p>  
        <p type="p">190_s:190_s</p>  
        <p type="p">932:第一部分</p>  
        <p type="p">934:第二部分</p>  
        <p type="p">936:第三部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2005" publication-number="202611715"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611715.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611715</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145506</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶可配置糾錯碼（ＥＣＣ）資料保護的系統和記憶體及相關方法</chinese-title>  
        <english-title>SYSTEM AND MEMORY WITH CONFIGURABLE ERROR-CORRECTION CODE (ECC) DATA PROTECTION AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">G06F11/08</main-classification>  
        <further-classification edition="200601120251215B">G11C29/52</further-classification>  
        <further-classification edition="200601120251215B">G06F13/14</further-classification>  
        <further-classification edition="201601120251215B">G06F12/08</further-classification>  
        <further-classification edition="202201120251215B">H04L69/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　正元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUH, JUNGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千　德斯特塔密歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUN, DEXTER TAMIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯瑞尼瓦桑　安納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASAN, ANAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾拉佛納　奧利佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALAVOINE, OLIVIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫兒　勞倫特瑞內</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLL, LAURENT RENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了用於系統糾錯碼功能的方法和裝置。該裝置包括記憶體，該記憶體被配置成經由至少一個資料連接和至少一個非資料連接來與主機進行通訊。該記憶體包括記憶體陣列。該記憶體陣列包括第一部分和第二部分。該記憶體被進一步配置成在第一模式中在該記憶體陣列的第一部分和第二部分中儲存和輸出資料。第一部分可由第一位址定址，而第二部分可由第二位址定址。該記憶體被進一步配置成在第二模式中經由該至少一個非資料連接來從該主機接收資料的ECC，在該記憶體陣列的第一部分中儲存資料，並基於第一位址在該記憶體陣列的第二部分中儲存資料的ECC。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatuses for a system error-correction code function are presented. The apparatus includes a memory configured to communicate with a host via at least one data connection and at least one non-data connection. The memory includes a memory array. The memory array includes a first portion and a second portion. The memory is further configured to, in a first mode, store and output data in the first portion and the second portion of the memory array. The first portion is addressable by a first address, and the second portion is addressable by a second address. The memory is further configured to, in a second mode, receive ECC of the data from the host via the at least one non-data connection, store the data in the first portion of the memory array, and store the ECC of the data in the second portion of the memory array based on the first address.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100_s:裝置</p>  
        <p type="p">110_s:主機</p>  
        <p type="p">115:匯流排系統</p>  
        <p type="p">120:處理器</p>  
        <p type="p">122:CPU</p>  
        <p type="p">123:GPU</p>  
        <p type="p">124:NPU</p>  
        <p type="p">130_s:記憶體控制器</p>  
        <p type="p">131:系統ECC解碼器</p>  
        <p type="p">132:系統ECC編碼器</p>  
        <p type="p">134_s:控制器PHY模組</p>  
        <p type="p">135:鏈路ECC解碼器</p>  
        <p type="p">136:鏈路ECC編碼器</p>  
        <p type="p">150_s:記憶體</p>  
        <p type="p">160:記憶體I/O模組</p>  
        <p type="p">161:記憶體鏈路ECC解碼器</p>  
        <p type="p">162:記憶體鏈路ECC編碼器</p>  
        <p type="p">163:節點</p>  
        <p type="p">164:節點</p>  
        <p type="p">171:陣列ECC解碼器</p>  
        <p type="p">172:陣列ECC編碼器</p>  
        <p type="p">173:節點</p>  
        <p type="p">174:節點</p>  
        <p type="p">175_s:記憶體陣列</p>  
        <p type="p">176:陣列ECC</p>  
        <p type="p">190_s:190_s</p>  
        <p type="p">932:第一部分</p>  
        <p type="p">934:第二部分</p>  
        <p type="p">936:第三部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2006" publication-number="202611716"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611716.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611716</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145510</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶可配置糾錯碼（ＥＣＣ）資料保護的系統和記憶體及相關方法</chinese-title>  
        <english-title>SYSTEM AND MEMORY WITH CONFIGURABLE ERROR-CORRECTION CODE (ECC) DATA PROTECTION AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">G06F11/08</main-classification>  
        <further-classification edition="200601120251215B">G11C29/52</further-classification>  
        <further-classification edition="200601120251215B">G06F13/14</further-classification>  
        <further-classification edition="201601120251215B">G06F12/08</further-classification>  
        <further-classification edition="202201120251215B">H04L69/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　正元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUH, JUNGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千　德斯特塔密歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUN, DEXTER TAMIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯瑞尼瓦桑　安納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASAN, ANAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾拉佛納　奧利佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALAVOINE, OLIVIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫兒　勞倫特瑞內</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLL, LAURENT RENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了用於系統糾錯碼功能的方法和裝置。該裝置包括記憶體，該記憶體被配置成經由至少一個資料連接和至少一個非資料連接來與主機進行通訊。該記憶體包括記憶體陣列。該記憶體陣列包括第一部分和第二部分。該記憶體被進一步配置成在第一模式中在該記憶體陣列的第一部分和第二部分中儲存和輸出資料。第一部分可由第一位址定址，而第二部分可由第二位址定址。該記憶體被進一步配置成在第二模式中經由該至少一個非資料連接來從該主機接收資料的ECC，在該記憶體陣列的第一部分中儲存資料，並基於第一位址在該記憶體陣列的第二部分中儲存資料的ECC。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatuses for a system error-correction code function are presented. The apparatus includes a memory configured to communicate with a host via at least one data connection and at least one non-data connection. The memory includes a memory array. The memory array includes a first portion and a second portion. The memory is further configured to, in a first mode, store and output data in the first portion and the second portion of the memory array. The first portion is addressable by a first address, and the second portion is addressable by a second address. The memory is further configured to, in a second mode, receive ECC of the data from the host via the at least one non-data connection, store the data in the first portion of the memory array, and store the ECC of the data in the second portion of the memory array based on the first address.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100_s:裝置</p>  
        <p type="p">110_s:主機</p>  
        <p type="p">115:匯流排系統</p>  
        <p type="p">120:處理器</p>  
        <p type="p">122:CPU</p>  
        <p type="p">123:GPU</p>  
        <p type="p">124:NPU</p>  
        <p type="p">130_s:記憶體控制器</p>  
        <p type="p">131:系統ECC解碼器</p>  
        <p type="p">132:系統ECC編碼器</p>  
        <p type="p">134_s:控制器PHY模組</p>  
        <p type="p">135:鏈路ECC解碼器</p>  
        <p type="p">136:鏈路ECC編碼器</p>  
        <p type="p">150_s:記憶體</p>  
        <p type="p">160:記憶體I/O模組</p>  
        <p type="p">161:記憶體鏈路ECC解碼器</p>  
        <p type="p">162:記憶體鏈路ECC編碼器</p>  
        <p type="p">163:節點</p>  
        <p type="p">164:節點</p>  
        <p type="p">171:陣列ECC解碼器</p>  
        <p type="p">172:陣列ECC編碼器</p>  
        <p type="p">173:節點</p>  
        <p type="p">174:節點</p>  
        <p type="p">175_s:記憶體陣列</p>  
        <p type="p">176:陣列ECC</p>  
        <p type="p">190_s:190_s</p>  
        <p type="p">932:第一部分</p>  
        <p type="p">934:第二部分</p>  
        <p type="p">936:第三部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2007" publication-number="202611717"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611717.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611717</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶可配置糾錯碼（ＥＣＣ）資料保護的系統和記憶體及相關方法</chinese-title>  
        <english-title>SYSTEM AND MEMORY WITH CONFIGURABLE ERROR-CORRECTION CODE (ECC) DATA PROTECTION AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">G06F11/08</main-classification>  
        <further-classification edition="200601120251215B">G11C29/52</further-classification>  
        <further-classification edition="200601120251215B">G06F13/14</further-classification>  
        <further-classification edition="201601120251215B">G06F12/08</further-classification>  
        <further-classification edition="202201120251215B">H04L69/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　正元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUH, JUNGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千　德斯特塔密歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUN, DEXTER TAMIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯瑞尼瓦桑　安納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASAN, ANAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾拉佛納　奧利佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALAVOINE, OLIVIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫兒　勞倫特瑞內</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLL, LAURENT RENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了用於系統糾錯碼功能的方法和裝置。該裝置包括記憶體，該記憶體被配置成經由至少一個資料連接和至少一個非資料連接來與主機進行通訊。該記憶體包括記憶體陣列。該記憶體陣列包括第一部分和第二部分。該記憶體被進一步配置成在第一模式中在該記憶體陣列的第一部分和第二部分中儲存和輸出資料。第一部分可由第一位址定址，而第二部分可由第二位址定址。該記憶體被進一步配置成在第二模式中經由該至少一個非資料連接來從該主機接收資料的ECC，在該記憶體陣列的第一部分中儲存資料，並基於第一位址在該記憶體陣列的第二部分中儲存資料的ECC。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatuses for a system error-correction code function are presented. The apparatus includes a memory configured to communicate with a host via at least one data connection and at least one non-data connection. The memory includes a memory array. The memory array includes a first portion and a second portion. The memory is further configured to, in a first mode, store and output data in the first portion and the second portion of the memory array. The first portion is addressable by a first address, and the second portion is addressable by a second address. The memory is further configured to, in a second mode, receive ECC of the data from the host via the at least one non-data connection, store the data in the first portion of the memory array, and store the ECC of the data in the second portion of the memory array based on the first address.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100_s:裝置</p>  
        <p type="p">110_s:主機</p>  
        <p type="p">115:匯流排系統</p>  
        <p type="p">120:處理器</p>  
        <p type="p">122:CPU</p>  
        <p type="p">123:GPU</p>  
        <p type="p">124:NPU</p>  
        <p type="p">130_s:記憶體控制器</p>  
        <p type="p">131:系統ECC解碼器</p>  
        <p type="p">132:系統ECC編碼器</p>  
        <p type="p">134_s:控制器PHY模組</p>  
        <p type="p">135:鏈路ECC解碼器</p>  
        <p type="p">136:鏈路ECC編碼器</p>  
        <p type="p">150_s:記憶體</p>  
        <p type="p">160:記憶體I/O模組</p>  
        <p type="p">161:記憶體鏈路ECC解碼器</p>  
        <p type="p">162:記憶體鏈路ECC編碼器</p>  
        <p type="p">163:節點</p>  
        <p type="p">164:節點</p>  
        <p type="p">171:陣列ECC解碼器</p>  
        <p type="p">172:陣列ECC編碼器</p>  
        <p type="p">173:節點</p>  
        <p type="p">174:節點</p>  
        <p type="p">175_s:記憶體陣列</p>  
        <p type="p">176:陣列ECC</p>  
        <p type="p">190_s:190_s</p>  
        <p type="p">932:第一部分</p>  
        <p type="p">934:第二部分</p>  
        <p type="p">936:第三部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2008" publication-number="202612567"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612567.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612567</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145552</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示設備</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251215B">H10K59/00</main-classification>  
        <further-classification edition="202301120251215B">H10K50/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金榮均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNG-KWUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明的實施例的顯示設備包含顯示區域、設置於顯示區域中且包含孔區域以及環繞孔區域的第一圖案部分的第一區域、設置於第一圖案部分中的多個第一圖案，以及設置於這些第一圖案上的第一絕緣層以及第二絕緣層，其中第一絕緣層以及第二絕緣層在這些第一圖案之間彼此分離，且其中第一絕緣層以及第二絕緣層在這些第一圖案中的每一者的上表面上彼此接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus according to an embodiment of the present disclosure comprises a display area, a first area disposed in the display area and comprising a hole region and a first pattern portion surrounding the hole region, a plurality of first patterns disposed in the first pattern portion, and a first insulating layer and a second insulating layer disposed on the plurality of first patterns, wherein the first insulating layer and the second insulating layer are spaced apart from each other between the plurality of first patterns, and wherein the first insulating layer and the second insulating layer are in contact with each other on an upper surface of each of the plurality of first patterns.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示設備</p>  
        <p type="p">AA:顯示區域</p>  
        <p type="p">A-A&lt;i&gt;'&lt;/i&gt;,B-B&lt;i&gt;'&lt;/i&gt;:線</p>  
        <p type="p">H:孔區域</p>  
        <p type="p">NA:非顯示區域</p>  
        <p type="p">PH:第一區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2009" publication-number="202610878"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610878.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610878</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145593</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>嬰兒載具</chinese-title>  
        <english-title>BABY CARRIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">B62B7/06</main-classification>  
        <further-classification edition="200601120251215B">B62B7/14</further-classification>  
        <further-classification edition="200601120251215B">B62B9/10</further-classification>  
        <further-classification edition="200601120251215B">B62B9/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張小健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種嬰兒載具，包括扶手固定座、座椅固定座、連接固定座、第一鎖定機構和車架組件。扶手固定座、座椅固定座和連接固定座同軸樞接，連接固定座連接於車架組件上。第一鎖定機構具有鎖定狀態和解鎖狀態。扶手固定座的轉動使第一鎖定機構由鎖定狀態轉換為解鎖狀態。當第一鎖定機構處於鎖定狀態時，座椅固定座和連接固定座相對固定；當第一鎖定機構處於解鎖狀態時，座椅固定座和連接固定座相對轉動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A baby carrier is provided, including an armrest fixing base, a seat fixing base, a connection fixing base, a first locking mechanism and a frame assembly. The armrest fixing base, the seat fixing base and the connection fixing base are coaxially pivoted, the connection fixing base is connected to the frame assembly. The first locking mechanism has a locked state and an unlocked state. The armrest fixing base is rotated to convert the first locking mechanism from the locked state to the unlocked state. When the first locking mechanism is in the locked state, the seat fixing base and the connection fixing base are relatively fixed, when the first locking mechanism is in the unlocked state, the seat fixing base and the connection fixing base are capable of rotating relative to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:座椅組件</p>  
        <p type="p">111:扶手支撐桿</p>  
        <p type="p">112:背靠支撐桿</p>  
        <p type="p">113:座椅支撐桿</p>  
        <p type="p">114:扶手橫桿</p>  
        <p type="p">120:車架組件</p>  
        <p type="p">121:車手支撐桿</p>  
        <p type="p">122:前腳支撐桿</p>  
        <p type="p">123:後腳支撐桿</p>  
        <p type="p">124:U型連動桿</p>  
        <p type="p">200:扶手固定座</p>  
        <p type="p">300:背靠固定座</p>  
        <p type="p">400:座椅固定座</p>  
        <p type="p">500:連接固定座</p>  
        <p type="p">600:第一車架固定座</p>  
        <p type="p">700:第二車架固定座</p>  
        <p type="p">850:第五鎖定機構</p>  
        <p type="p">851:背靠解鎖件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2010" publication-number="202612222"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612222.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612222</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145617</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於軸向磁通機器之平面定子型態</chinese-title>  
        <english-title>PLANAR STATOR CONFIGURATIONS FOR AXIAL FLUX MACHINES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">H02K3/46</main-classification>  
        <further-classification edition="200601120251212B">H02K35/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商Ｅ電路馬達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E-CIRCUIT MOTORS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭　史蒂芬　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAW, STEVEN ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米爾漢姆　喬治　哈迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILHEIM, GEORGE HARDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些實施例中，兩個或更多個不同類型之定子結構可經安置於一軸向磁通機器之一間隙內。此等配置可有利地例如用於產生針對諸如機械扭矩產生、機械扭矩至電功率之轉換及/或機械功率耗散之多個操作模式最佳化之一機器。此外，在一些實施例中，一種軸向磁通機器可包含一平面定子，該平面定子具有經配置以定位於該機器之主動區域內之一繞組，且可進一步包含經組態以在該繞組未耦合至一外部電源時選擇性地閉合以在該繞組之各自端部之間建立一電連接之至少一個開關</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some embodiments, two or more different types of stator structures may be disposed within a gap of an axial flux machine. Such arrangements may be advantageous, for example, for producing a machine optimized for multiple modes of operation, such as mechanical torque generation, conversion of mechanical torque to electrical power, and/or dissipation of mechanical power. Further, in some embodiments, an axial flux machine may include a planar stator having a winding arranged to be positioned within the machine’s active region, and may further include at least one switch configured to be selectively closed to establish an electrical connection between respective ends of the winding at a time that the winding is not coupled to an external power source</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104b:磁體</p>  
        <p type="p">110:軸件</p>  
        <p type="p">114:外殼</p>  
        <p type="p">118:控制器/相關聯電路</p>  
        <p type="p">406a至406c:端子</p>  
        <p type="p">706a至706c:繞組</p>  
        <p type="p">708:相關聯電路/電源(或能量儲存單元)</p>  
        <p type="p">1104:繞組</p>  
        <p type="p">1106:控制器/相關聯電路</p>  
        <p type="p">1110:耗散元件/相關聯電路</p>  
        <p type="p">1200:平面軸向磁通機器</p>  
        <p type="p">1202:定子片段</p>  
        <p type="p">1204:定子片段</p>  
        <p type="p">1206a:端子</p>  
        <p type="p">1206b:端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2011" publication-number="202610600"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610600.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610600</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145619</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安裝於阻生齒的固定器與導線裝置、將該導線裝置穿過該阻生齒的方法與協助該導線裝置穿過該阻生齒的工具</chinese-title>  
        <english-title>FIXATOR AND WIRE DEVICE INSTALLED ON AN IMPACTED TOOTH, METHOD FOR PASSING THE WIRE DEVICE THROUGH THE IMPACTED TOOTH, AND TOOL FOR ASSISTING THE WIRE DEVICE IN PASSING THROUGH THE IMPACTED TOOTH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">A61C7/02</main-classification>  
        <further-classification edition="200601120251212B">A61C7/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳良誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳良誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種安裝於阻生齒的導線裝置，其包括一彎勾及連接於該彎勾的一後端的一線材。該彎勾具有一弧形造型，且能穿過該且該阻生齒的該橫向穿孔。一種將該導線裝置穿過阻生齒的方法，主要是利用該彎勾來導引該線材穿過該橫向穿孔。一種安裝於該阻生齒上的固定器，主要是利用前述方法來形成的。一種協助將該導線裝置穿過該阻生齒的工具，其包括一握把及連接該握把的一接收部，該接收部包括一接收孔及一剖槽，該接收孔能緊迫地接收該導線裝置的該彎勾，該剖槽與該接收孔相通，且能允許該導線裝置的該線材通過並伸出到該接收部的外面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wire device for installation in an impacted tooth comprises a hook, and a wire connected to one end of the hook. The hook has an arc-shape, and is able to pass through the perforation of the impacted tooth. A method for threading the wire device through an impacted tooth by using the hook to guide the wire through the perforation. A fixator installed on the impacted tooth by using the aforementioned method. A tool used to assist in threading the wire through the impacted tooth comprises a handle and a receiving portion connected to the handle, the receiving portion include a receptive hole and a slot, the receptive hole is able to receive the hook of the wire device tightly, the slot and the receptive hole are in communication with each other, and allows the wire of the wire device to pass through and extend to the outside of the receiving portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:工具</p>  
        <p type="p">11:握把</p>  
        <p type="p">12:接收部</p>  
        <p type="p">122:剖槽</p>  
        <p type="p">13:彎曲量尺</p>  
        <p type="p">2:導線裝置</p>  
        <p type="p">21:彎勾</p>  
        <p type="p">211:前端</p>  
        <p type="p">212:後端</p>  
        <p type="p">22:線材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2012" publication-number="202612224"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612224.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612224</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145668</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制結構、電機及電動設備</chinese-title>  
        <english-title>CONTROL STRUCTURE, MOTOR, AND ELECTRIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H02K9/04</main-classification>  
        <further-classification edition="200601120251204B">H02K5/18</further-classification>  
        <further-classification edition="200601120251204B">H02K9/14</further-classification>  
        <further-classification edition="200601120251204B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳兢先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JING-SIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林映竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YING-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉家頊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIA-HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇奕丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪崇傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, CHONG-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開一種控制結構、電機及電動設備，控制結構包括蓋體、控制組件、第一導熱件及第二導熱件，蓋體具有收納倉；控制組件包括電路板與電子組件，電路板設有避讓槽，電子組件包括第一面與第二面，第一面接觸蓋體；第一導熱件嵌設於避讓槽，並疊置於第二面；第二導熱件至少部分疊置於第一導熱件，並至少部分抵靠於蓋體；第一導熱件傳導電子組件之熱量至第二導熱件，第二導熱件將熱量傳導至蓋體。利用電子組件之相對兩面同時建立導熱路徑，增大了電子組件之散熱面積，能夠高效地對電子組件進行散熱，增大控制組件之使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application discloses a control structure, a motor, and an electric device. The control structure comprises a cover, a control assembly, a first heat conduction member, and a second heat conduction member. The cover is provided with an accommodation chamber. The control assembly includes a circuit board and an electronic component. The circuit board is provided with an avoidance slot. The electronic component includes a first surface and a second surface, with the first surface contacting the cover. The first heat conduction member is embedded in the avoidance slot and stacked against the second surface. The second heat conduction member is at least partially stacked against the first heat conduction member and at least partially abuts the cover. The first heat conduction member transfers heat from the electronic component to the second heat conduction member, and the second heat conduction member transfers the heat to the cover. By establishing heat conduction paths simultaneously on both opposite sides of the electronic component, the heat dissipation area of the electronic component is increased, enabling efficient cooling of the electronic component and extending the service life of the control assembly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電機</p>  
        <p type="p">300:電動設備</p>  
        <p type="p">310:風扇組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2013" publication-number="202611593"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611593.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611593</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">G02B15/20</main-classification>  
        <further-classification edition="200601120251204B">G02B13/06</further-classification>  
        <further-classification edition="200601120251204B">G02B11/32</further-classification>  
        <further-classification edition="200601120251204B">G02B9/62</further-classification>  
        <further-classification edition="202101120251204B">G02B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅嘉聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翰琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HAN LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，從物側至像側沿光軸依序包括第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡以及第六透鏡。第一透鏡具有正屈光度，第一透鏡的物側面的光軸區域為凸面。第二透鏡具有負屈光度，第二透鏡的物側面的光軸區域為凸面，且像側面的光軸區域為凹面。第三透鏡具有正屈光度，第三透鏡的物側面的光軸區域為凹面，且像側面的光軸區域為凸面。第四透鏡具有負屈光度，第四透鏡的物側面的光軸區域為凹面，且像側面的光軸區域為凸面。第五透鏡具有正屈光度。第六透鏡具有負屈光度，第六透鏡的像側面的光軸區域為凹面，像側面具有反曲點，因此光軸區域外圍部分為凸面。第一透鏡至第六透鏡皆為非球面透鏡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens, sequentially including a first, a second, a third, a fourth, a fifth and a sixth lens element along an optical axis from an object side to an image side, is provided. The first lens element has a positive refracting power, and an optical axis region of an object-side surface of the first lens element is convex. The second lens element has a negative refracting power, an optical axis region of an object-side surface of the second lens element is convex, and an optical axis region of an image-side surface is concave. The third lens element has a positive refracting power, an optical axis region of an object-side surface of the third lens element is concave, and an optical axis region of an image-side surface is convex. The fourth lens element has a negative refracting power, an optical axis region of an object-side surface of the fourth lens element is concave, and an optical axis region of an image-side surface is convex. The fifth lens element has a positive refracting power. The sixth lens element has a negative refracting power, an optical axis region of an image-side surface of the sixth lens is concave, the image-side surface has an inflection point, so a portion other than the optical axis region is convex. The first to sixth lens elements are all aspherical lenses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光學成像鏡頭</p>  
        <p type="p">100:光圈</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">111,121,131,141,151,161,171:物側面</p>  
        <p type="p">112,122,132,142,152,162,172:像側面</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:濾光片</p>  
        <p type="p">180:成像面</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">I:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2014" publication-number="202612017"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612017.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612017</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145912</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>  
        <english-title>SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">H01L21/306</main-classification>  
        <further-classification edition="200601120251212B">B05C11/10</further-classification>  
        <further-classification edition="200601120251212B">B08B3/04</further-classification>  
        <further-classification edition="200601120251212B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊豆田崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZUTA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基板處理方法及基板處理裝置。本發明之基板處理方法包含：第1藥液工序(步驟S2)，其對基板(W)供給第1藥液；沖洗工序(步驟S3)，其對基板(W)供給沖洗液；去除工序(步驟S4)，其於使沖洗液停止供給之狀態下使基板(W)旋轉，自凹部(320)排出沖洗液；及第2藥液工序(步驟S5)，其對經去除沖洗液之基板(W)供給第2藥液。於第1藥液工序(步驟S2)中，藉由第1護罩(61a)承接自旋轉之基板(W)排出之第1藥液。於沖洗工序(步驟S3)中，自第1護罩(61a)調換為第2護罩(61b)。於去除工序(步驟S4)及第2藥液工序(步驟S5)中，藉由第2護罩(61b)承接自旋轉之基板(W)排出之第1沖洗液及第2藥液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate processing method and a substrate processing apparatus are provided. The substrate processing method includes a first chemical liquid step (Step S2) of supplying a first chemical liquid to a substrate (W), a rinsing step (Step S3) of supplying a rinse liquid to the substrate (W), a removal step (Step S4) of rotating the substrate (W) in a state in which the supply of the rinse liquid is stopped, and discharging the rinse liquid from a recess portion (320), and a second chemical liquid step (Step S5) of supplying a second chemical liquid to the substrate (W) from which the rinse liquid has been removed. In the first chemical liquid step (Step S2), the first chemical liquid discharged from the rotating substrate (W) is received by a first guard (61a). In the rinsing step (Step S3), the first guard (61a) is switched to a second guard (61b). In the removal step (Step S4) and in the second chemical liquid step (Step S5), the first rinse liquid and the second chemical liquid discharged from the rotating substrate (W) are received by the second guard (61b).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:基板保持部</p>  
        <p type="p">3:基板旋轉部</p>  
        <p type="p">4:處理液供給部</p>  
        <p type="p">6:護罩部</p>  
        <p type="p">6a:第1護罩部</p>  
        <p type="p">6b:第2護罩部</p>  
        <p type="p">6c:第3護罩部</p>  
        <p type="p">7:升降部</p>  
        <p type="p">8:排液部</p>  
        <p type="p">9:回收部</p>  
        <p type="p">10:控制裝置</p>  
        <p type="p">21:自旋基座</p>  
        <p type="p">22:卡盤構件</p>  
        <p type="p">32:軸</p>  
        <p type="p">43:沖洗液供給部</p>  
        <p type="p">43a:第3噴出噴嘴</p>  
        <p type="p">43b:沖洗液供給配管</p>  
        <p type="p">43c:沖洗液開閉閥</p>  
        <p type="p">61a:第1護罩</p>  
        <p type="p">61b:第2護罩</p>  
        <p type="p">61c:第3護罩</p>  
        <p type="p">62a:第1杯</p>  
        <p type="p">62b:第2杯</p>  
        <p type="p">62c:第3杯</p>  
        <p type="p">71:第1升降部</p>  
        <p type="p">72:第2升降部</p>  
        <p type="p">73:第3升降部</p>  
        <p type="p">81:第1排液部</p>  
        <p type="p">81a:第1排液配管</p>  
        <p type="p">81b:第1排液開閉閥</p>  
        <p type="p">84:排洩槽</p>  
        <p type="p">91:回收配管</p>  
        <p type="p">92:回收開閉閥</p>  
        <p type="p">100:基板處理裝置</p>  
        <p type="p">101:流體艙</p>  
        <p type="p">200:基板處理部</p>  
        <p type="p">AX1:第1旋轉軸線</p>  
        <p type="p">D1:上下方向</p>  
        <p type="p">LF2:液膜</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2015" publication-number="202611542"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611542.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611542</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於偵測、追蹤及傳輸至經識別物件之模組化系統</chinese-title>  
        <english-title>MODULAR SYSTEM FOR DETECTING, TRACKING, AND TRANSMITTING TO IDENTIFIED OBJECTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01S13/06</main-classification>  
        <further-classification edition="200601120251201B">H04B7/06</further-classification>  
        <further-classification edition="200601120251201B">H04B7/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安督瑞歐工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDURIL INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛爾　雅卡得　山姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL-AKKAD, SAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雪　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISCHER, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>惠塔卡　崔維斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHITAKER, TRAVIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮爾森　布萊登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEARSON, BRYDEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波克　陶德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERK, TODD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘　陶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHAM, THAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　瓊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達特　卡麥隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DART, CAMERON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種模組化射頻(「RF」)系統，其包含一或多個定向天線且經組態具有硬體及軟體組件兩者以使該RF系統能夠在特定方向上監測物件(例如，偵測或追蹤信號或物件)及/或與物件互動(例如，追蹤信號或物件，或傳輸信號)。該RF系統包含一或多個機器學習模型以基於經接收信號判定用以傳輸之一或多個信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A modular, radio frequency (“RF”) system includes one or more directional antennas and is configured with both hardware and software components to enable the RF system to monitor (e.g., detect or track signals or objects) and/or interact with (e.g., track signals or objects, or transmit signals) objects in particular directions. The RF system includes one or more machine learning models to determine, based on received signals, one or more signals to transmit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:操作環境</p>  
        <p type="p">102:射頻(RF)系統/射頻(RF)模組</p>  
        <p type="p">103:硬體組件</p>  
        <p type="p">104:額外系統或感測器</p>  
        <p type="p">105:軟體組件</p>  
        <p type="p">106:選用額外射頻(RF)系統</p>  
        <p type="p">107:中央處理伺服器</p>  
        <p type="p">110:使用者器件</p>  
        <p type="p">112:網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2016" publication-number="202612225"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612225.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612225</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146049</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線性馬達裝配設備</chinese-title>  
        <english-title>LINEAR MOTOR ASSEMBLY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251215B">H02K15/00</main-classification>  
        <further-classification edition="200601120251215B">H02K5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊智造科技（常熟）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE INTELLIGENT MANUFACTURE TECHNOLOGY (CHANGSHU) CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍永林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, YONGLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊承龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHENGLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樊志峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, ZHIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的線性馬達裝配設備包括承載台，具有承載面，所述承載面用於設置線性振動馬達；多個第一定位部，用於分別接觸運動單元兩側；第二定位部，具有第三定位面；第三定位部，具有第四定位面；所述第三定位面位於所述承載面的側向，所述第四定位面可操作地相對一所述第三定位面運動並與所述第三定位面形成夾持對；所述夾持對被配置為在第一方向上，驅動所述第四定位面靠近所述第三定位面，以將彈簧片的一端推至與所述殼體內壁貼合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiment of the invention discloses a linear motor assembly device includes a carrying platform having a carrying surface, the carrying surface being configured to accommodate a linear vibration motor; a plurality of first positioning sections configured to respectively contact two sides of a motion unit; a second positioning section having a third positioning surface; and a third positioning section having a fourth positioning surface. The third positioning surface is located laterally of the carrying surface, and the fourth positioning surface is operably movable relative to the third positioning surface to form a clamping pair with the third positioning surface. The clamping pair is configured to drive the fourth positioning surface toward the third positioning surface in a first direction so as to push one end of a spring plate into abutment with an inner wall of a housing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一定位部</p>  
        <p type="p">11:夾持片</p>  
        <p type="p">111:第一定位面</p>  
        <p type="p">112:第二定位面</p>  
        <p type="p">12:導向塊</p>  
        <p type="p">121:導向孔</p>  
        <p type="p">2:第二定位部</p>  
        <p type="p">3:第三定位部</p>  
        <p type="p">31:第四定位面</p>  
        <p type="p">4:承載台</p>  
        <p type="p">41:承載面</p>  
        <p type="p">42:彈簧定位銷</p>  
        <p type="p">55:底板</p>  
        <p type="p">56:第二滑道</p>  
        <p type="p">58:頂蓋</p>  
        <p type="p">59:中體</p>  
        <p type="p">6:第一驅動部</p>  
        <p type="p">7:頂出部</p>  
        <p type="p">71:頂出頭</p>  
        <p type="p">711:頂出凹陷</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2017" publication-number="202611978"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611978.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611978</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146087</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反應器系統及電漿設備</chinese-title>  
        <english-title>REACTOR SYSTEM AND PLASMA APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　山姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中宏治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於反應器系統的基座總成可提供各種電漿控制益處。根據各種實施例，基座總成包括本體、加熱器元件、第一電極及第二電極。本體可具有頂表面、側表面及底表面，其中頂表面係基材支撐表面。加熱器元件可嵌入本體內。第一及第二電極亦可嵌入基座總成之本體內，其中第一電極設置於加熱器元件與本體之頂表面之間。第二電極可大致鄰近側表面及底表面之至少一者設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A susceptor assembly for a reactor system may provide various plasma control benefits. The susceptor assembly includes a body, a heater element, a first electrode, and a second electrode, according to various embodiments. The body may have a top surface, a side surface, and a bottom surface, wherein the top surface is a substrate support surface. The heater element may be embedded within the body. The first and second electrodes may also be embedded within the body of the susceptor assembly, with the first electrode disposed between the heater element and the top surface of the body. The second electrode may be generally disposed proximate at least one of the side surface and the bottom surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:反應室</p>  
        <p type="p">6:基座</p>  
        <p type="p">8:流體分配系統</p>  
        <p type="p">10,12:反應物源</p>  
        <p type="p">14:載體及/或吹掃氣體源</p>  
        <p type="p">16,18,20:管線</p>  
        <p type="p">22,24,26:閥或控制器</p>  
        <p type="p">28:真空源</p>  
        <p type="p">30:基材</p>  
        <p type="p">50:反應器系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2018" publication-number="202611742"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611742.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611742</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於UCIe的資料傳輸方法、記錄媒體及芯片</chinese-title>  
        <english-title>DATA TRANSMISSION METHOD BASED ON UCIE, STORAGE MEDIUM, AND CHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">G06F13/38</main-classification>  
        <further-classification edition="200601120251204B">G06F13/14</further-classification>  
        <further-classification edition="201501120251204B">H04B3/46</further-classification>  
        <further-classification edition="202401120251204B">H04L12/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海壁仞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI BIREN TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基於UCIe的資料傳輸方法、電腦可讀取記錄媒體、電子裝置及人工智能芯片。本發明的資料傳輸方法包括以下步驟：通過第一芯粒與第二芯粒進行通信；通過所述第二芯粒預先採樣多個先前有效圖框信號；通過所述第一芯粒傳送當前有效圖框信號以及資料信號至所述第二芯粒；通過所述第二芯粒判斷所述多個先前有效圖框信號的錯誤位元位置；通過所述第二芯粒根據所述錯誤位元位置來產生偵測信號；以及通過所述第二芯粒根據所述偵測信號來決定是否將所述資料信號寫入所述第二芯粒的接收緩存模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data transmission method based on universal chiplet interconnect express （UCIe）, a storage medium, and chip. The data transmission method includes the following steps: communicating with a second chip via a first chip; pre-sampling a plurality of previously valid frame signals via the second chip; transmitting a current valid frame signal and a data signal to the second chip via the first chip; determining the error bit positions of the plurality of previously valid frame signals via the second chip; generating a detection signal via the second chip based on the error bit positions; and deciding whether to write the data signal into the receive buffer module of the second chip based on the detection signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:資料傳輸系統</p>  
        <p type="p">110:第一芯粒</p>  
        <p type="p">120:第二芯粒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2019" publication-number="202612438"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612438.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612438</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子總成、電子系統及OSFP光收發器模組</chinese-title>  
        <english-title>ELECTRONIC ASSEMBLY, ELECTRONIC SYSTEM, AND OSFP OPTICAL TRANSCEIVER MODULES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">H05K7/20</main-classification>  
        <further-classification edition="201501120251215B">H04B1/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商谷歌有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOGLE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛德華茲　威廉　Ｆ　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS, WILLIAM F., JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布琪明　馬蘭妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEAUCHEMIN, MELANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　提摩西　康拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TIMOTHY CONRAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森托拉　費德里科　皮奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTOLA, FEDERICO PIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾揚格　馬杜蘇丹　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IYENGAR, MADHUSUDAN K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　浩然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAU, MICHAEL CHI KIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈　佐偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, ZUOWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　世雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUSTIN SISHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了用於使OSFP模組能夠在較高頻寬下操作之熱耗散及電屏蔽技術及設備。論述了OSFP相容技術，包括水冷卻之使用，熱管之添加，中間冷卻器、空氣散熱片及空氣翼片之使用，冷卻散熱片之最佳化，蒸汽室之使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:八進位小型外觀尺寸可插拔(OSFP)模組</p>  
        <p type="p">1010:外殼體</p>  
        <p type="p">1020:外部散熱器</p>  
        <p type="p">1030:頂表面</p>  
        <p type="p">1040:入口</p>  
        <p type="p">1050:入口</p>  
        <p type="p">1060:表面</p>  
        <p type="p">1070:部分</p>  
        <p type="p">1080:出口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2020" publication-number="202612324"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612324.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612324</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用基於矩陣之內預測及二次轉換之寫碼技術</chinese-title>  
        <english-title>CODING USING MATRIX BASED INTRA-PREDICTION AND SECONDARY TRANSFORMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251215B">H04N19/103</main-classification>  
        <further-classification edition="201401120251215B">H04N19/159</further-classification>  
        <further-classification edition="201401120251215B">H04N19/513</further-classification>  
        <further-classification edition="201401120251215B">H04N19/61</further-classification>  
        <further-classification edition="201401120251215B">H04N19/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗勞恩霍夫爾協會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕雅夫　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFAFF, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛茲　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HINZ, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希利　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELLE, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬克爾　飛利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERKLE, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史泰倫柏格　柏喬恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STALLENBERGER, BJOERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏佛　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEFER, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布洛斯　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROSS, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文肯　馬汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINKEN, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希克曼　米斯洽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIEKMANN, MISCHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史瓦茲　希可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHWARZ, HEIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬皮　迪特利夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARPE, DETLEV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威剛德　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIEGAND, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示用於高效地基於矩陣預測一圖像之一區塊的技術。一實施例係關於一種用於使用內預測解碼一圖像之一預定區塊之設備，其經組配以基於資料串流選擇多個內預測模式中之一預定內預測模式，該預定內預測模式包含包含一DC內預測模式及角預測模式之內預測模式之一第一集合以及基於矩陣之內預測模式之一第二集合，根據其中之各者，使用自該預定區塊之一鄰域中的參考樣本導出的一向量與相關聯於該個別基於矩陣之內預測模式的一預測矩陣之間的一矩陣向量乘積來獲得一預測向量，基於該預測向量來預測該預定區塊之樣本。該設備經組配以使用該預定內預測模式導出用於該預定區塊之一預測信號，且以取決於該預定內預測模式之一方式選擇二次轉換之一集合中的一或多個二次轉換之一子集，以使得在該預定內預測模式含於內預測模式之該第一集合中且該預定內預測模式含於基於矩陣之內預測模式之該第二集合中的情況下，該子集為非空。另外，該設備經組配以在該預定內預測模式含於內預測模式之該第一集合中的情況下且在該預定內預測模式含於基於矩陣之內預測模式之該第二集合中的情況下，經由藉由一個一次轉換(Tp)與應用於該一次轉換之係數之一子集上的二次轉換之該子集中的一預定二次轉換(Ts)之一串接界定的一轉換(T)自該資料串流導出用於該預定區塊之一預測殘差之一經轉換版本，該經轉換版本與該預定區塊之該預測殘差之一空間域版本有關。該設備經組配以使用用於該預定區塊之該預測信號及該預測殘差來重建構該預定區塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There are disclosed techniques for matrix-based predicting a block of a picture efficiently. An embodiment relates to an apparatus for decoding a predetermined block (18) of a picture using intra-prediction, configured to select (602), based on the data stream, a predetermined intra prediction mode (604) out of a plurality (600) of intra-prediction modes which comprises a first set (508) of intra-prediction modes comprising a DC intra prediction mode (506) and angular prediction modes (500), and a second set (520) of matrix-based intra-prediction modes (510) according to each of which a matrix-vector product (512) between a vector (514) derived from reference samples (17) in a neighbourhood of the predetermined block and a prediction matrix (516) associated with the respective matrix-based intra-prediction mode is used to obtain a prediction vector (518), on the basis of which samples of the predetermined block are predicted. The apparatus is configured to derive a prediction signal (606) for the predetermined block using the predetermined intra-prediction mode and select (608) a subset (610) of one or more secondary transforms out of a set (612) of secondary transforms in a manner dependent on the predetermined intra prediction mode so that the subset (610) is nonempty in case of the predetermined intra prediction mode being contained in the first set (508) of intra-prediction modes and the predetermined intra prediction mode being contained in the second set (520) of matrix-based intra-prediction modes (510). Additionally the apparatus is configured to derive (614), from the data stream, a transformed version (616) of a prediction residual for the predetermined block (18), which is related to a spatial domain version (618) of the prediction residual of the predetermined block via a transform (T) defined by a concatenation of a primary transform (Tp) and a predetermined secondary transform (Ts) out of the subset (610) of secondary transforms applied onto a subset (622) of coefficients (620) of the primary transform, in case of the predetermined intra prediction mode being contained in the first set (508) of intra-prediction modes and in case of the predetermined intra prediction mode being contained in the second set (520) of matrix-based intra-prediction modes (510). The apparatus is configured to reconstruct (624) the predetermined block using the prediction signal and the prediction residual for the predetermined block (18).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:資料串流</p>  
        <p type="p">17:參考樣本</p>  
        <p type="p">18:區塊</p>  
        <p type="p">500:角內預測模式</p>  
        <p type="p">504:非角內預測模式</p>  
        <p type="p">506:DC模式</p>  
        <p type="p">508,612:集合</p>  
        <p type="p">510:內預測方向</p>  
        <p type="p">512,520:矩陣向量乘積</p>  
        <p type="p">514:向量</p>  
        <p type="p">516:預定預測矩陣</p>  
        <p type="p">518:預測向量</p>  
        <p type="p">600,602:語法元素</p>  
        <p type="p">604:預定內預測模式</p>  
        <p type="p">606:預測信號</p>  
        <p type="p">608:選擇</p>  
        <p type="p">610:子集</p>  
        <p type="p">614:導出</p>  
        <p type="p">616:預測殘差之經轉換版本</p>  
        <p type="p">618:預測殘差之空間域版本</p>  
        <p type="p">624:重建構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2021" publication-number="202612196"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612196.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612196</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146368</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線纜組件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251212B">H01R13/6585</main-classification>  
        <further-classification edition="200601120251212B">H01R13/631</further-classification>  
        <further-classification edition="200601120251212B">H01R13/436</further-classification>  
        <further-classification edition="200601120251212B">H01R13/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商莫仕有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLEX, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克葛瑞維　西恩法蘭西斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCGREEVY, SEAN FRANCIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭格　哈洛德Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, HAROLD KEITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文說明在線纜組件中在導線上應變釋放的各種方面。在一個示例中，一種線纜組件包括一線纜以及處於所述線纜的一端的一模組化插頭。所述線纜包括一外套以及在所述外套內延伸的多個導線。所述模組化插頭包括一模組化殼體以及用於在所述導線與所述模組化插頭之間的在導線上應變釋放的一互鎖結構。因為，所述線纜內的所述多個導線利用所述在導線上應變釋放的互鎖結構的特徵而被機械地固持在所述模組化插頭內，所以所述線纜組件能抵抗所述線纜與所述模組化插頭之間的顯著的相反的拉力，而不會分離、受損或在訊號耦合完整性上損失。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:線纜組件</p>  
        <p type="p">12:模組化插頭</p>  
        <p type="p">20:模組化插頭殼體</p>  
        <p type="p">21:接觸通道</p>  
        <p type="p">22:插頭互鎖臂</p>  
        <p type="p">40:屏蔽件</p>  
        <p type="p">50:模製成型件</p>  
        <p type="p">52:周向抓環</p>  
        <p type="p">54:頂部</p>  
        <p type="p">60:線纜</p>  
        <p type="p">61:外套</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2022" publication-number="202612138"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612138.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612138</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146372</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>印刷封裝及其製造方法</chinese-title>  
        <english-title>PRINTED PACKAGE AND METHOD OF MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">H01L23/482</main-classification>  
        <further-classification edition="200601120251215B">H01L23/498</further-classification>  
        <further-classification edition="200601120251215B">H01L21/98</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商德州儀器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEXAS INSTRUMENTS INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科杜里　史林尼巴桑　卡萊彥尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KODURI, SREENIVASAN KALYANI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂正忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種使用印刷導電互連件代替接合線將半導體晶粒或器件之接合墊與一引線框架中之對應引線互連之方法(500)及一種由上述方法產生之裝置。更特定言之，一些實例包含印刷從一半導體晶粒上的接合墊至該半導體晶粒附接至之一引線框架之引線的一絕緣基礎路徑(510)。在從該晶粒上的各接合墊至該引線框架之一對應引線的該絕緣基礎路徑之頂部上印刷一基礎導電跡線(512)。視情況，在該導電跡線之頂部上，將一覆蓋絕緣覆蓋層施加在該等導電互連件及該基礎絕緣層之暴露部分上(514)。較佳地，此可為與基礎層相同之材料以完全黏附且融接為一整塊結構，而非單獨層。視情況，接著將一保護層施加在該所得裝置上(516)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method (500) for interconnecting bond pads of semiconductor dies or devices with corresponding leads in a lead frame with printed conductive interconnects in lieu of bond wires and an apparatus resulting from the above method. More specifically, some examples include printing an insulating foundation path from bond-pads on a semiconductor die to leads of a lead frame to which the semiconductor die is attached (510). A foundation conductive trace is printed on top of the insulating foundation path from each bond pad on the die to a corresponding lead of the lead frame (512). Optionally, on top of the conductive trace, a cover insulating cover layer is applied on exposed portions of the conductive interconnects and the foundation insulating layer (514). Preferably, this can be the same material as foundation layer to fully adhere and blend into a monolithic structure, rather than separate layers. Optionally, a protective layer is then applied on the resulting apparatus (516).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:方法</p>  
        <p type="p">502:步驟</p>  
        <p type="p">504:步驟</p>  
        <p type="p">506:步驟</p>  
        <p type="p">508:步驟</p>  
        <p type="p">510:步驟</p>  
        <p type="p">512:步驟</p>  
        <p type="p">514:步驟</p>  
        <p type="p">516:步驟</p>  
        <p type="p">518:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2023" publication-number="202612328"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612328.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612328</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146406</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在樣本陣列多元樹細分中之繼承技術</chinese-title>  
        <english-title>INHERITANCE IN SAMPLE ARRAY MULTITREE SUBDIVISION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251215B">H04N19/119</main-classification>  
        <further-classification edition="201401120251215B">H04N19/129</further-classification>  
        <further-classification edition="201401120251215B">H04N19/124</further-classification>  
        <further-classification edition="201401120251215B">H04N19/159</further-classification>  
        <further-classification edition="201401120251215B">H04N19/513</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＧＥ影像壓縮有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE VIDEO COMPRESSION, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希利　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELLE, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧汀　西蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OUDIN, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬皮　迪特利夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARPE, DETLEV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威剛德　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIEGAND, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在編碼複雜度與可達成之率失真比間的較佳折衷，及/或欲達成較佳率失真比係藉由使用多元樹細分而達成，使用該多元樹細分不僅係用來將一連續區，亦即該樣本陣列細分成多個葉區，同時也使用該中間區來在相對應之共同定位葉區塊間共享編碼參數。藉此措施，在局部拼貼葉區所進行的編碼程序可與個別編碼參數相關聯，但無需分開地對各葉區明確地傳輸整個編碼參數。反而，藉使用該多元樹細分可有效地探討相似性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A better compromise between encoding complexity and achievable rate distortion ratio, and/or to achieve a better rate distortion ratio is achieved by using multitree sub-divisioning not only in order to subdivide a continuous area, namely the sample array, into leaf regions, but using the intermediate regions also to share coding parameters among the corresponding collocated leaf blocks. By this measure, coding procedures performed in tiles – leaf regions – locally, may be associated with coding parameters individually without having to, however, explicitly transmit the whole coding parameters for each leaf region separately. Rather, similarities may effectively exploited by using the multitree subdivision.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2024" publication-number="202612553"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612553.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612553</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146562</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氮化物半導體紫外線發光元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251212B">H10H20/825</main-classification>  
        <further-classification edition="202501120251212B">H10H20/812</further-classification>  
        <further-classification edition="202501120251212B">H10H20/816</further-classification>  
        <further-classification edition="202501120251212B">H10H20/817</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日機裝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKKISO COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長澤陽祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASAWA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">氮化物半導體紫外線發光元件係具備閃鋅礦構造之AlGaN系半導體所成n型層、活性層、及p型層，層積於上下方向之發光元件構造部，n型層以n型AlGaN系半導體構成，活性層係包含以AlGaN系半導體所構成之1層以上之井層，p型層係以p型AlGaN系半導體所構成，n型層與活性層內之各半導體層係具有形成平行於(0001)面之多段狀之平台之表面的磊晶成長層，n型層則在n型層內一樣地分散存在之局部AlN莫耳分率低之層狀領域中，具有包含AlGaN組成比為整數比之Al&lt;sub&gt;7&lt;/sub&gt;Ga&lt;sub&gt;5&lt;/sub&gt;N&lt;sub&gt;12&lt;/sub&gt;之n型AlGaN領域的複數之第1Ga富化領域，層狀領域之各延伸方向係具有對於n型層之上面具有傾斜之部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:氮化物半導體紫外線發光元件</p>  
        <p type="p">10:基材部</p>  
        <p type="p">11:藍寶石基板</p>  
        <p type="p">11a:藍寶石基板之主面</p>  
        <p type="p">12:AlN層</p>  
        <p type="p">20:發光元件構造部</p>  
        <p type="p">21:n型包覆層(n型層)</p>  
        <p type="p">21a:第1Ga富化領域(n型層)</p>  
        <p type="p">21b:n型本體領域(n型層)</p>  
        <p type="p">22:活性層</p>  
        <p type="p">23:電子阻障層(p型層)</p>  
        <p type="p">24:p型包覆層(p型層)</p>  
        <p type="p">25:p型連接層(p型層)</p>  
        <p type="p">26:p電極</p>  
        <p type="p">27:n電極</p>  
        <p type="p">220:井層</p>  
        <p type="p">221:阻障層</p>  
        <p type="p">R1:第1領域</p>  
        <p type="p">R2:第2領域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2025" publication-number="202611345"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611345.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611345</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在氮化鋁化合物上磊晶生長鋁</chinese-title>  
        <english-title>EPITAXIAL GROWTH OF ALUMINUM ON ALUMINUM-NITRIDE COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">C30B25/02</main-classification>  
        <further-classification edition="200601120251215B">C30B25/10</further-classification>  
        <further-classification edition="200601120251215B">C30B25/14</further-classification>  
        <further-classification edition="200601120251215B">C30B29/02</further-classification>  
        <further-classification edition="200601120251215B">H03H9/02</further-classification>  
        <further-classification edition="200601120251215B">C23C14/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雷森公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYTHEON COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅根　約翰　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOGAN, JOHN ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>修茲　布萊恩　道格拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHULTZ, BRIAN DOUGLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘迺迪　西奧多　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KENNEDY, THEODORE D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之裝置及相關方法關於在氮化鋁化合物上形成鋁之一磊晶層。藉由在一真空室內將一結晶氮化鋁化合物之溫度保持在一有利於團簇之溫度臨限值以下，該鋁在該結晶氮化鋁化合物上磊晶生長。接著，將該結晶氮化鋁化合物暴露於元素鋁原子中一預定持續時間。該鋁依此方式磊晶生長一預定持續時間，以便產生一預定厚度之一層磊晶鋁。此磊晶生長單晶鋁具有比多晶鋁更低之一電阻率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus and associated methods relate to forming an epitaxial layer of aluminum on an aluminum-nitride compound. The aluminum is epitaxially grown on the crystalline aluminum-nitride compound by maintaining temperature of a crystalline aluminum-nitride compound below a cluster-favoring temperature threshold within a vacuum chamber. Then, the crystalline aluminum-nitride compound is exposed to atoms of elemental aluminum for a predetermined time duration. The aluminum is epitaxially grown in this fashion for a predetermined time duration so as to produce a layer of epitaxial aluminum of a predetermined thickness. Such epitaxially-grown mono-crystalline aluminum has a lower resistivity than poly-crystalline aluminum.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:方法</p>  
        <p type="p">52:步驟</p>  
        <p type="p">56:步驟</p>  
        <p type="p">66:步驟</p>  
        <p type="p">68:步驟</p>  
        <p type="p">72:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2026" publication-number="202611570"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611570.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611570</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光纖終端構造及其製造方法和光連接元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">G02B6/032</main-classification>  
        <further-classification edition="200601120251215B">G02B6/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商白山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAKUSAN INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上綱秀樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMITSUNA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長瀬亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASE, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的光纖終端構造，包括：具有光傳輸的中空部的空心光纖（1）、包覆中空部的平板玻璃（2）之光透過構件。在插通空心光纖之套箍的端面上，具備收容光透過構件的凹槽。光透過構件被黏合於凹槽的平坦部，且由在兩面貼上反射防止膜的平板玻璃（2）所構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:空心光纖</p>  
        <p type="p">2:平板玻璃(光透過構件)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2027" publication-number="202610864"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610864.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610864</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旋轉側向定位機構及兒童載具</chinese-title>  
        <english-title>LATERAL ROTARY POSITIONING MECHANISM AND CHILD CARRIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">B60N2/28</main-classification>  
        <further-classification edition="200601120251215B">B60N2/14</further-classification>  
        <further-classification edition="200601120251215B">B60N2/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張大亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DALIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種旋轉側向定位機構設置於底座及本體之間，底座可轉動地設置於本體上，其中，包含卡合銷及卡合凹，卡合銷可伸縮地設置於本體，卡合凹設置於底座的底面且位於底座的側向方向的至少一側，在底座旋轉到相對本體側向時，卡合銷伸入卡合凹內限制底座轉動。本發明旋轉側向定位機構可旋轉至側向時對載具進行定位，具有結構簡單、能提高兒童載具使用的便捷性及安全性的優點。另，本發明還公開一種兒童載具。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure discloses a lateral rotary positioning mechanism arranged between a base and a body, the base is rotatably arranged on the body and includes an engaging pin and an engaging recess, the engaging pin is telescopically arranged on the body, the engaging recess is arranged on a bottom surface of the base and at least one side of the base in a lateral direction, and when the base is rotated to a lateral direction with respect to the body, the engaging pin is inserted into the engaging recess to limit rotation of the base. The lateral rotary positioning mechanism capable of being rotatable to a lateral direction to position the carrier of the present disclosure has advantages of a simple structure and capability of improving the use convenience and safety of the child carrier. In addition, the present disclosure also discloses a child carrier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:兒童載具</p>  
        <p type="p">1:載具主體</p>  
        <p type="p">2:底座</p>  
        <p type="p">3:本體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2028" publication-number="202612144"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612144.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612144</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146679</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括貫通電極的半導體晶片以及包括其的半導體封裝件</chinese-title>  
        <english-title>SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">H01L23/498</main-classification>  
        <further-classification edition="200601120251215B">H01L23/485</further-classification>  
        <further-classification edition="200601120251215B">H01L23/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫晧榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, HO YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNG KYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李美仙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MI SEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體晶片可以包括：主體部分，主體部分具有前表面和後表面；一對貫通電極，該一對貫通電極穿透主體部分；絕緣層，絕緣層設置在主體部分的後表面和該一對貫通電極上；以及後連接電極，後連接電極設置在絕緣層上並且同時與該一對貫通電極連接，其中，該一對貫通電極之間的距離大於絕緣層的厚度的兩倍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor chip may include: a body portion with a front surface and a rear surface; a pair of through electrodes penetrating the body portion; an insulating layer disposed over the rear surface of the body portion and the pair of through electrodes; and a rear connection electrode disposed over the insulating layer and connected simultaneously with the pair of through electrodes, wherein a distance between the pair of through electrodes is greater than twice a thickness of the insulating layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210:初始主體部分</p>  
        <p type="p">210A:主體部分</p>  
        <p type="p">211:前表面</p>  
        <p type="p">212A:後表面</p>  
        <p type="p">220:佈線部分</p>  
        <p type="p">230A:貫通電極</p>  
        <p type="p">230PA:電源貫通電極</p>  
        <p type="p">230SA:信號貫通電極</p>  
        <p type="p">240P:電源後連接電極</p>  
        <p type="p">240S:信號後連接電極</p>  
        <p type="p">250:前連接電極</p>  
        <p type="p">260:接合層</p>  
        <p type="p">280A:絕緣層</p>  
        <p type="p">292A:含金屬薄膜層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2029" publication-number="202610712"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202610712.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202610712</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146732</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合多孔過濾器膜，製備其之方法，過濾器及自液體移除不純物之方法</chinese-title>  
        <english-title>COMPOSITE POROUS FILTER MEMBRANE, METHOD OF MAKING THE SAME, FILTER AND METHOD FOR REMOVING IMPURITY FROM LIQUID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">B01D39/16</main-classification>  
        <further-classification edition="200601120251212B">B01D69/02</further-classification>  
        <further-classification edition="200601120251212B">B01D69/12</further-classification>  
        <further-classification edition="200601120251212B">B01D71/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　國舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KWOK SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑柏　杰德　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JABER, JAD A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余　超成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, TONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　美寶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOO, MAYBELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳東柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, DONGZHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈姆茲克　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMZIK, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供可用於自液體移除各種雜質之特定複合膜。在某些態樣中，該等複合膜包含其上塗有一聚醯胺之一疏水性聚合物，且在其他態樣中，此類複合膜上塗有某些丙烯酸聚合物。該等複合膜可用於移除液體(諸如工業及生命科學過程中遇到之彼等液體)中之各種雜質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are certain composite membranes useful for removing various impurities from liquids. In certain aspects, the composite membranes comprise a hydrophobic polymer having a polyamide coated thereon, and in other aspects, such composite membranes having certain acrylic polymers coated thereon. The composite membranes are useful in the removal of various impurities in liquids, such as those encountered in industrial and life sciences processes.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2030" publication-number="202612099"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612099.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612099</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146733</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於絕對樣本定位之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR ABSOLUTE SAMPLE POSITIONING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">H01L21/687</main-classification>  
        <further-classification edition="200601120251215B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格勞爾　約阿夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRAUER, YOAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬那森　阿農</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANASSEN, AMNON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾　安卓　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILL, ANDREW V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩夫蘭尼　阿夫納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAFRANI, AVNER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種樣本映射系統包含：一樣本卡盤，其包含絕對參考標記；一成像度量衡工具，其用於擷取在與該樣本卡盤上之一樣本上之樣本標記相關聯之位置處之對準影像組；及一控制器。在一特定位置處之對準影像之一特定組可包含與一特定樣本標記相關聯之至少一個對準影像及與透過該樣本可見之該成像度量衡工具之一視場內之該等絕對參考標記之一特定部分相關聯之至少一個對準影像。該控制器可基於對準影像之該等組判定該等樣本標記之絕對座標。判定該特定樣本標記之該等絕對座標可包含基於該特定樣本標記相對於該等絕對參考標記之該特定部分之一位置判定該特定樣本標記之該等絕對座標。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sample mapping system includes a sample chuck including absolute reference marks, an imaging metrology tool to capture sets of alignment images at locations associated with sample marks on a sample on the sample chuck, and a controller. A particular set of alignment images at a particular location may include at least one alignment image associated with a particular sample mark and at least one alignment image associated with a particular portion of the absolute reference marks within a field of view of the imaging metrology tool visible through the sample. The controller may determine absolute coordinates of the sample marks based on the sets of alignment images. Determining the absolute coordinates of the particular sample mark may include determining the absolute coordinates of the particular sample mark based on a position of the particular sample mark relative to the particular portion of the absolute reference marks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:樣本映射系統</p>  
        <p type="p">102:樣本卡盤</p>  
        <p type="p">104:絕對參考標記</p>  
        <p type="p">106:成像度量衡工具</p>  
        <p type="p">108:樣本</p>  
        <p type="p">110:樣本標記</p>  
        <p type="p">112:平移載物台</p>  
        <p type="p">168:樣本接合器</p>  
        <p type="p">170:控制器</p>  
        <p type="p">172:處理器</p>  
        <p type="p">174:記憶體裝置</p>  
        <p type="p">176:使用者介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2031" publication-number="202611500"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611500.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611500</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146853</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於驗證一物品之設備、及用於驗證一反應室之系統</chinese-title>  
        <english-title>APPARATUS FOR VERIFYING AN ARTICLE, AND SYSTEM FOR VERIFYING A REACTION CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">G01N21/59</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆拉里達　席法　Ｋ　Ｔ　　拉傑夫魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURALIDHAR, SHIVA K.T. RAJAVELU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾凡迪　塔布瑞里　尤尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALVANDI-TABRIZI, YOUNESS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪山托　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DISANTO, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　山姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭示者係用於測量光強度之方法及設備。此方法及設備可用以驗證一物品（諸如一反應室）。例示性設備包括一第一臂；一光源，其耦接至第一臂；一第二臂；及一感測器，其耦接至第二臂。感測器可接收來自光源的光，光透射通過物品的至少一部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatus for measuring light intensity are disclosed. The methods and apparatus can be used to verify an article, such as a reaction chamber. Exemplary apparatus include a first arm, a light source coupled to the first arm, a second arm, and a sensor coupled to the second arm. The sensor can receive light from the light source that is transmitted through at least a portion of the article.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:設備</p>  
        <p type="p">102:第一臂</p>  
        <p type="p">104:第二臂</p>  
        <p type="p">106:光源</p>  
        <p type="p">108:感測器</p>  
        <p type="p">110:構件</p>  
        <p type="p">112:第一馬達</p>  
        <p type="p">114:第二馬達</p>  
        <p type="p">116:第一移動裝置</p>  
        <p type="p">118:第二移動裝置</p>  
        <p type="p">120:反應室</p>  
        <p type="p">122:可旋轉物體</p>  
        <p type="p">130:支撐結構</p>  
        <p type="p">131:上部區段</p>  
        <p type="p">132:壁</p>  
        <p type="p">133:下部區段</p>  
        <p type="p">134:控制器</p>  
        <p type="p">136:資料庫</p>  
        <p type="p">140:殼體</p>  
        <p type="p">200:夾具</p>  
        <p type="p">202:框架</p>  
        <p type="p">204:振動阻尼裝置</p>  
        <p type="p">206:振動阻尼裝置，光源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2032" publication-number="202611207"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611207.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611207</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146864</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱塑性樹脂組成物，彼之製法，及含彼之模製物件</chinese-title>  
        <english-title>THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">C08K3/22</main-classification>  
        <further-classification edition="200601120251215B">C08K3/32</further-classification>  
        <further-classification edition="200601120251215B">C08K9/12</further-classification>  
        <further-classification edition="200601120251215B">C08L25/10</further-classification>  
        <further-classification edition="200601120251215B">C08L51/04</further-classification>  
        <further-classification edition="200601120251215B">C08L55/02</further-classification>  
        <further-classification edition="200601120251215B">C08L77/12</further-classification>  
        <further-classification edition="200601120251215B">A01N59/16</further-classification>  
        <further-classification edition="200601120251215B">A01N59/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG CHEM, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEONGKYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金瑞和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEO HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜秉逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, BYOUNG IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓世鎮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SEJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金榮民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於熱塑性樹脂組成物、彼之製法，及含彼之模製物件。更特別地，本發明係關於熱塑性樹脂組成物，其包括100重量份的基礎樹脂(A)，其包括丙烯腈化合物-共軛二烯化合物-芳族乙烯基化合物接枝共聚物(A-1)和芳族乙烯基化合物-丙烯腈化合物共聚物(A-2)；0.1至32重量份的聚合物(B)，其重量平均分子量大於500,000g/mol且含有未共用的電子對；0.1至5重量份的無機抗菌劑(C)，其包括選自由磷酸鹽玻璃、矽石凝膠、磷酸鈣、和磷酸鋯鈉所組成之群組中之一或多種載體；和0.2至10重量份之BET表面積為28m&lt;sup&gt;2&lt;/sup&gt;/g或更高的氧化鋅(D)、該熱塑性樹脂組成物之製法、和包括該熱塑性樹脂組成物之模製物件。 &lt;br/&gt;　　本發明具有提供不具有人體毒性、並具有優異的熱安定性、初始抗菌性、和抗菌持久性之熱塑性樹脂組成物、彼之製法、和包括彼之模製物件的效果。除了這些優點以外，本發明之熱塑性樹脂組成物被射出時，沒有氣體缺陷也沒有剝離現象。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a thermoplastic resin composition, a method of preparing the same, and a molded article including the same. More particularly, the present invention relates to a thermoplastic resin composition including 100 parts by weight of a base resin (A) including a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound graft copolymer (A-1) and an aromatic vinyl compound-vinyl cyanide compound copolymer (A-2); 0.1 to 32 parts by weight of a polymer (B) having a weight average molecular weight of greater than 500,000 g/mol and containing an unshared electron pair; 0.1 to 5 parts by weight of an inorganic antibacterial agent (C) including one or more carriers selected from the group consisting of phosphate glass, silica gel, calcium phosphate, and zirconium sodium phosphate; and 0.2 to 10 parts by weight of zinc oxide (D) having a BET surface area of 28 m&lt;sup&gt;2&lt;/sup&gt;/g or more, a method of preparing the thermoplastic resin composition, and a molded article including the thermoplastic resin composition. &lt;br/&gt; The present invention has an effect of providing a thermoplastic resin composition having no human toxicity, and having excellent thermal stability, initial antibacterial properties, and antibacterial durability; a method of preparing the same, and a molded article including the same. In addition to these advantages, the thermoplastic resin composition of the present invention has neither a gas defect nor exhibits a peeling phenomenon when being injected.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2033" publication-number="202612573"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612573.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612573</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鐳射加工方法及利用其的方法、縮小投影光學系統、基板的製造方法及鐳射加工裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251215B">H10K71/00</main-classification>  
        <further-classification edition="200601120251215B">H01L21/18</further-classification>  
        <further-classification edition="200601120251215B">H01L25/13</further-classification>  
        <further-classification edition="201401120251215B">B23K26/351</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山岡裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAOKA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲田悟基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKADA, SATOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小澤周作</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZAWA, SHUSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供鐳射加工方法及利用其的方法、縮小投影光學系統、基板的製造方法及鐳射加工裝置。在保持高轉移位置精度的同時實現轉移裝置的受體基板的大型化、精細化和縮短節拍時間。在以保持放置有轉移對象物的供體基板和/或光束整形光學系統以及縮小投影光學系統的狀態移動的各台組、以及保持作為轉移目的物的受體基板的台組構建在分開的平台上而構成的機構中，使伴隨各基板相對於鐳射的相對掃描而產生的振動和承擔該掃描的台的同步位置精度的異常最小化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BP:共焦點光束輪廓儀</p>  
        <p type="p">CCD:高倍率照相機</p>  
        <p type="p">D:供體基板</p>  
        <p type="p">F:場鏡</p>  
        <p type="p">G:基礎平台</p>  
        <p type="p">G1:平台1</p>  
        <p type="p">G11:平台11</p>  
        <p type="p">G12:平台12</p>  
        <p type="p">G2:平台2</p>  
        <p type="p">H:整形光學系統</p>  
        <p type="p">LS:鐳射</p>  
        <p type="p">M:光罩</p>  
        <p type="p">Pl:投影透鏡</p>  
        <p type="p">R:受體基板</p>  
        <p type="p">TE:望遠鏡</p>  
        <p type="p">Xd:供體台的X軸</p>  
        <p type="p">Xo:光學台(X軸)</p>  
        <p type="p">Yd:供體台的Y軸</p>  
        <p type="p">Yl:投影透鏡和照相機的切換台</p>  
        <p type="p">Yr:受體台的Y軸</p>  
        <p type="p">Zl:投影透鏡的Z軸台</p>  
        <p type="p">Zr:受體台的Z軸</p>  
        <p type="p">θd:供體台的θ軸</p>  
        <p type="p">θr:受體台的θ軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2034" publication-number="202611532"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611532.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611532</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146895</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測試包括積體光學元件的探針頭</chinese-title>  
        <english-title>PROBE HEAD FOR TESTING ELECTRONIC DEVICES COMPRISING INTEGRATED OPTICAL ELEMENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">G01R31/28</main-classification>  
        <further-classification edition="200601120251209B">G01R1/07</further-classification>  
        <further-classification edition="200601120251209B">G01R31/311</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商探針科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHNOPROBE S.P.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克立巴　羅貝多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRIPPA, ROBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋托裡　裡卡爾多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VETTORI, RICCARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於電子裝置的測試設備的探針頭（10），包括：多個接觸探針（11），適於與一待測裝置（13）的多個接觸墊（12a）電性或機械性接觸，至少一引導件（20），提供有多個引導孔（20h），用於可滑動地容置該些接觸探針（11），一容納元件（40），其適於支撐該引導件（20）並容置該些接觸探針（11）的至少一部分，其中，該容納元件（40）包括一第一部（40a）及相對於該第一部（40a）可移動的一第二部（40b），移動裝置（60），適於使該容納元件（40）的該第二部（40b）相對於該第一部（40a）移動，及至少一測試光訊號分配元件（50），配置成向該待測裝置（13）傳輸一測試光訊號。適當地，該測試光訊號分配元件（50）關聯於該容納元件（40）的該第二部（40b）並設置成藉由該移動裝置（60）與其整體移動，該移動裝置（60）配置成允許對位該測試光訊號分配元件（50）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A probe head (10) for a testing apparatus of electronic devices, comprises a plurality of contact probes (11) adapted to electrically and mechanically contact contact pads (12a) of a device under test (13), at least one guide (20) provided with a plurality of guide holes (20h) for slidingly housing the contact probes (11), a containment element (40) which is adapted to support the guide (20) and which houses at least one portion of the contact probes (11), wherein said containment element (40) comprises a first portion (40a) and a second portion (40b) which is movable with respect to said first portion (40a), movement means (60) adapted to move the second portion (40b) of the containment element (40) with respect to the first portion (40a), and at least one test optical signal distribution element (50) configured to transmit a test optical signal to the device under test (13). Suitably, the test optical signal distribution element (50) is associated with the second portion (40b) of the containment element (40) and is arranged to be moved integrally therewith by means of the movement means (60), said movement means (60) being configured to allow the alignment of said test optical signal distribution element (50).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:探針頭</p>  
        <p type="p">11:接觸探針</p>  
        <p type="p">11':主體</p>  
        <p type="p">11a:第一端</p>  
        <p type="p">11b:第二端</p>  
        <p type="p">12a:接觸墊</p>  
        <p type="p">12b:光學接口</p>  
        <p type="p">12r:光柵</p>  
        <p type="p">13:待測裝置</p>  
        <p type="p">20:引導件</p>  
        <p type="p">20h:引導孔</p>  
        <p type="p">26:螺釘</p>  
        <p type="p">30:引導件</p>  
        <p type="p">30h:引導孔</p>  
        <p type="p">40:容納元件</p>  
        <p type="p">40a:第一部</p>  
        <p type="p">40b:第二部</p>  
        <p type="p">50:測試光訊號分配元件</p>  
        <p type="p">50':主體</p>  
        <p type="p">50f:光纖陣列</p>  
        <p type="p">52:電纜</p>  
        <p type="p">60:移動裝置</p>  
        <p type="p">G:中空空間</p>  
        <p type="p">H-H:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2035" publication-number="202611586"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611586.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611586</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146896</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251205B">G02B7/02</main-classification>  
        <further-classification edition="200601120251205B">G02B9/64</further-classification>  
        <further-classification edition="200601120251205B">G02B11/34</further-classification>  
        <further-classification edition="200601120251205B">G02B13/18</further-classification>  
        <further-classification edition="202301120251205B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫住和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, JU HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃孝眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, HYO JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鏞主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張相鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, SANG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李種奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JONG GI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像系統包括：第一透鏡組，包括第一透鏡及第二透鏡；第二透鏡組，包括第三透鏡、第四透鏡及第五透鏡；以及第三透鏡組，包括第六透鏡及第七透鏡。所述第一透鏡至所述第七透鏡自物側依次排列，所述第一透鏡組至所述第三透鏡組中的至少一者在光軸上移動以改變所述第一透鏡組至所述第三透鏡組之間的距離，且滿足以下條件表達式：0.2 ＜ BFL/(2*IMG HT) ＜ 2.0。其中BFL是所述光軸上自所述第七透鏡的像側表面至影像感測器的成像表面的距離，並且IMG HT是所述影像感測器的所述成像表面的對角線長度的一半。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes a first lens group including a first lens and a second lens, a second lens group including a third lens, a fourth lens, and a fifth lens, and a third lens group including a sixth lens and a seventh lens. The first to seventh lenses are arranged in order from an object side, at least one of the first lens group to the third lens group is moved on an optical axis to change a distance between the first lens group to the third lens group, and the following conditional expression is satisfied: 0.2 ＜ BFL/(2*IMG HT) ＜ 2.0. Where BFL is a distance on the optical axis from an image-side surface of the seventh lens to an imaging surface of an image sensor, and IMG HT is half a diagonal length of the imaging surface of the image sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">180:濾光片</p>  
        <p type="p">190:影像感測器</p>  
        <p type="p">D1、D2:距離</p>  
        <p type="p">G1:第一透鏡組</p>  
        <p type="p">G2:第二透鏡組</p>  
        <p type="p">R:反射構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2036" publication-number="202612326"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612326.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612326</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編碼裝置及解碼裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251215B">H04N19/117</main-classification>  
        <further-classification edition="201401120251215B">H04N19/14</further-classification>  
        <further-classification edition="201401120251215B">H04N19/157</further-classification>  
        <further-classification edition="201401120251215B">H04N19/176</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商松下電器（美國）知識產權公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加納龍一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANOH, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西孝啓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠間正真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMA, TADAMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">編碼裝置包含有處理器及記憶體，處理器是使用記憶體，根據量化參數，決定夾區塊邊界呈非對稱的濾波器特性，並進行具有已決定的濾波器特性的解區塊濾波處理。例如，在濾波器特性的決定上，也可以量化參數愈大，該解區塊濾波處理的影響變得愈大的方式，來決定濾波器特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S161至S162:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2037" publication-number="202612555"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612555.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612555</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於將發光二極體晶片調光的金屬層</chinese-title>  
        <english-title>METALLIC LAYER FOR DIMMING LIGHT-EMITTING DIODE CHIPS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251205B">H10H20/851</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科銳ＬＥＤ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CREELED, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍斯特　史蒂文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUESTER, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴爾基　賽斯　約瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALKEY, SETH JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯圖爾特　科林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STUART, COLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德魯　彼得　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREWS, PETER SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示固態發光裝置，其包含發光二極體及沉積於LED晶片上之半透明金屬層，該半透明金屬層能對該LED晶片之光輸出進行調光。該半透明金屬層之厚度能基於所需的調光位準而調整。在實施例中，該金屬層能沉積於LED結構上方之鈍化層的頂部上，使得該金屬層不電耦接至該LED。該金屬層能額外覆蓋該LED結構之台面側壁。在其他實施例中，該金屬層能為鈦或鉑、或者其他適合的金屬。在實施例中，該金屬層能沉積於該鈍化層上，其中該金屬層沉積的時間長度能基於所需的調光量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Solid-state lighting devices including light-emitting diodes （LEDs） and a semi-transparent metallic layer deposited on an LED chip that can dim a light output of the LED chip are disclosed. The thickness of the semi-transparent metal layer can be adjusted based on the desired dimming level. In an embodiment, the metallic layer can be deposited on top of a passivation layer over the LED structure, so that the metallic layer is not electrically coupled to the LED. The metallic layer can additionally cover the mesa sidewalls of the LED structure. The metallic layer can be titanium, or platinum, or other suitable metals in other embodiments. In an embodiment, the metallic layer can be deposited on to the passivation layer, where a length of time the metallic layer is deposited, can be based on the amount of dimming desired.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:LED晶片</p>  
        <p type="p">12:主動LED結構</p>  
        <p type="p">12':側壁</p>  
        <p type="p">14:載體子基座</p>  
        <p type="p">22:接合金屬</p>  
        <p type="p">24:第一反射層</p>  
        <p type="p">34:障壁層</p>  
        <p type="p">36:p接觸</p>  
        <p type="p">38:鈍化層</p>  
        <p type="p">42:n接觸金屬層</p>  
        <p type="p">46-1:鈍化層</p>  
        <p type="p">46-2:鈍化層</p>  
        <p type="p">48:金屬層</p>  
        <p type="p">50:外層/頂層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2038" publication-number="202612150"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612150.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612150</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146932</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及製造半導體裝置的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01L23/522</main-classification>  
        <further-classification edition="200601120251205B">H01L23/552</further-classification>  
        <further-classification edition="200601120251205B">H01L21/56</further-classification>  
        <further-classification edition="200601120251205B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢田貴弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YADA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高岩司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAIWA, TSUKASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個實例中，一種半導體結構或裝置包括：基板，所述基板包括導電結構，所述導電結構具有頂側和在所述導電結構的所述頂側上的第一屏蔽端子；電子組件，所述電子組件處於所述導電結構的所述頂側上；封裝體，所述封裝體處於所述導電結構的所述頂側上並且接觸所述電子組件的一側；屏蔽件，所述屏蔽件處於所述封裝體的頂側和所述封裝體的側面上；以及屏蔽互連件，所述屏蔽互連件將所述屏蔽件耦接到所述導電結構的所述第一屏蔽端子。本文中還公開了其它實例和相關方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">11:基板</p>  
        <p type="p">12:電子組件</p>  
        <p type="p">13:組件互連件</p>  
        <p type="p">14:封裝體</p>  
        <p type="p">15:屏蔽件</p>  
        <p type="p">111:導電結構</p>  
        <p type="p">112:介電結構</p>  
        <p type="p">121:黏合劑</p>  
        <p type="p">151:屏蔽層/第一屏蔽層</p>  
        <p type="p">152:屏蔽層/第二屏蔽層</p>  
        <p type="p">1111:槳片</p>  
        <p type="p">1111a:槳片頂部墊</p>  
        <p type="p">1111b:槳片底部墊</p>  
        <p type="p">1112:互連端子</p>  
        <p type="p">1112a:互連端子頂部墊</p>  
        <p type="p">1112b:互連端子底部墊</p>  
        <p type="p">1511:脊突出部</p>  
        <p type="p">1512:脊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2039" publication-number="202612078"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612078.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612078</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146969</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理設備</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">H01L21/67</main-classification>  
        <further-classification edition="200601120251215B">C23C16/44</further-classification>  
        <further-classification edition="200601120251215B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭元基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, WONKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李主日</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張夏碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, HASEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有改進的排氣結構的基板處理設備，包括接地的導電延伸部，配置以防止在連接到反應空間的排氣空間中產生寄生電漿。基板處理設備防止在反應空間以外的區域(譬如反應空間)中產生寄生電漿。因此，可以防止功率損失並且可以實現穩定的電漿處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate processing apparatus having an improved exhaust structure includes a grounded conductive extension portion configured to prevent generation of parasitic plasma in an exhaust space connected to a reaction space. The substrate processing apparatus prevents generation of parasitic plasma in an area, such as the reaction space, other than the reaction space. Thus, power loss may be prevented and a stable plasma process may be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:導電環</p>  
        <p type="p">13:排氣埠</p>  
        <p type="p">51:反應空間</p>  
        <p type="p">55:排氣空間</p>  
        <p type="p">100:分隔壁</p>  
        <p type="p">110:處理單元</p>  
        <p type="p">120:排氣單元</p>  
        <p type="p">130:導電延伸部</p>  
        <p type="p">150:基板支撐單元</p>  
        <p type="p">C:連接壁</p>  
        <p type="p">E:間隔，間隙</p>  
        <p type="p">FCR:流動控制環</p>  
        <p type="p">G:間隙</p>  
        <p type="p">O:開口</p>  
        <p type="p">TLD:支撐部</p>  
        <p type="p">W:阻擋壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2040" publication-number="202611781"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611781.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611781</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147642</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>深度學習人工神經網路中電性參數的校準</chinese-title>  
        <english-title>CALIBRATION OF ELECTRICAL PARAMETERS IN A DEEP LEARNING ARTIFICIAL NEURAL NETWORK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">G06N3/06</main-classification>  
        <further-classification edition="200601120251215B">G11C11/54</further-classification>  
        <further-classification edition="200601120251215B">G06F17/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商超捷公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　曉萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, HIEU VAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示用於在一深度學習人工神經網路中執行各種電性參數之校準的眾多實施例。在一個實施例中，一種方法包含：調整施加至一人工神經網路中之一或多個非揮發性記憶體胞元的一偏壓電壓；對該人工神經網路中之該一或多個非揮發性記憶體胞元執行一效能目標檢查；及重複該調整及該執行直至該效能目標檢查指示一電性參數在一預定範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Numerous examples are disclosed for performing calibration of various electrical parameters in a deep learning artificial neural network. In one example, a method comprises adjusting a bias voltage applied to one or more non-volatile memory cells in an artificial neural network, performing a performance target check on the one or more non-volatile memory cells in the artificial neural network, and repeating the adjusting and performing until the performance target check indicates an electrical parameter is within a predetermined range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C1:層</p>  
        <p type="p">C2:層</p>  
        <p type="p">C3:層</p>  
        <p type="p">CB1:突觸</p>  
        <p type="p">CB2:突觸</p>  
        <p type="p">CB3:突觸</p>  
        <p type="p">CB4:突觸</p>  
        <p type="p">P1:激勵函數</p>  
        <p type="p">P2:激勵函數</p>  
        <p type="p">S1:層</p>  
        <p type="p">S2:層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2041" publication-number="202612266"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612266.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612266</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147645</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線阻抗調諧器及用於調諧阻抗之方法</chinese-title>  
        <english-title>ANTENNA IMPEDANCE TUNER AND METHOD FOR TUNING IMPEDANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">H03H7/38</main-classification>  
        <further-classification edition="200601120251215B">H03H11/28</further-classification>  
        <further-classification edition="201501120251215B">H04B1/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商天工方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYWORKS SOLUTIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多密諾　威廉　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOMINO, WILLIAM J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線阻抗調諧器，其可包含第一節點及第二節點、一旁通路徑、第一串聯電容路徑及第二串聯電容路徑以及一電感路徑，其中各路徑實施於該第一節點與該第二節點之間，且包含經組態以容許該路徑耦合或解耦合該第一節點及該第二節點之一開關。該調諧器可進一步包含第一分路路徑及第二分路路徑，其中各分路路徑實施於該第二節點與接地之間，且包含經組態以容許該分路路徑耦合或解耦合該第二節點及該接地之一開關。該調諧器可進一步包含一可切換接地路徑，其沿著該電感路徑實施且經組態以容許該電感路徑用作該第一節點與該第二節點之間之一串聯電感路徑，或用作該接地與沿著該電感路徑之一節點之間之一分路電感路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna impedance tuner can include first and second nodes, a bypass path, first and second series capacitance paths, and an inductance path, with each path being implemented between the first and second nodes and including a switch configured to allow the path to couple or uncouple the first and second nodes. The tuner can further include first and second shunt paths, with each shunt path being implemented between the second node and ground and including a switch configured to allow the shunt path to couple or uncouple the second node and the ground. The tuner can further include a switchable grounding path implemented along the inductance path and configured to allow the inductance path to function as a series inductance path between the first and second nodes, or as a shunt inductance path between the ground and a node along the inductance path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:阻抗調諧器</p>  
        <p type="p">172:總成/電路總成</p>  
        <p type="p">C1:串聯電容</p>  
        <p type="p">C2:串聯電容</p>  
        <p type="p">C3:分路電容</p>  
        <p type="p">C4:分路電容</p>  
        <p type="p">L:電感</p>  
        <p type="p">S1至S7:開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2042" publication-number="202611677"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202611677.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202611677</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>判定非揮發性記憶體快速（ＮＶＭＥ）固態驅動器（ＳＳＤ）之斷電持續時間</chinese-title>  
        <english-title>DETERMINATION OF POWER-OFF DURATION OF NVME SSD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">G06F1/28</main-classification>  
        <further-classification edition="200601120251215B">G06F12/02</further-classification>  
        <further-classification edition="200601120251215B">G06F13/42</further-classification>  
        <further-classification edition="201801120251215B">G06F9/4401</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德偉高達　傑德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEVEGOWDA, JITHENDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種SSD包括具有儲存斷電時戳之第一非揮發性記憶體的控制器以及可由主機存取的硬體暫存器。所述SSD亦包括耦接至控制器之第二非揮發性記憶體，所述第二非揮發性記憶體儲存用於SSD之至少一啟動模式的指令。在控制器之電力開啟時並且在控制器執行用於SSD之至少一啟動模式的指令之前，控制器在硬體暫存器中接收來自主機之通電時戳，並且基於通電時戳及儲存的斷電時戳判定SSD的啟動模式。&lt;b&gt;&lt;br/&gt;   &lt;/b&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An SSD includes a controller having a first non-volatile memory in which a power-off timestamp is stored, and a hardware register accessible by a host. The SSD also includes a second non-volatile memory coupled to the controller, the second non-volatile memory storing instructions for at least one boot-up mode of the SSD. Upon power up of the controller and prior to the controller executing the instructions for at least one boot-up mode of the SSD, the controller receives, in the hardware register, a power-on timestamp from the host and determines, based on the power-on timestamp and the stored power-off timestamp, a boot-up mode of the SSD.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:SSD記憶體裝置系統</p>  
        <p type="p">102:主機</p>  
        <p type="p">104:SSD</p>  
        <p type="p">106:控制器</p>  
        <p type="p">107:唯讀記憶體(ROM)</p>  
        <p type="p">108:暫存器</p>  
        <p type="p">110:非揮發性記憶體</p>  
        <p type="p">111:快閃記憶體</p>  
        <p type="p">112:匯流排</p>  
        <p type="p">114,115:連接</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2043" publication-number="202612321"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202612321.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>6</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612321</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148698</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊寫碼中之色度量化</chinese-title>  
        <english-title>CHROMA QUANTIZATION IN VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H04N11/06</main-classification>  
        <further-classification edition="201401120251216B">H04N19/122</further-classification>  
        <further-classification edition="201401120251216B">H04N19/186</further-classification>  
        <further-classification edition="201401120251216B">H04N19/102</further-classification>  
        <further-classification edition="201401120251216B">H04N19/124</further-classification>  
        <further-classification edition="201401120251216B">H04N19/126</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖拉比斯　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOURAPIS, ALEXANDROS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯特　蓋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COTE, GUY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用信號發送特定於量化群組之額外色度量化參數(QP)偏移值的方法，其中每一量化群組明確地規定其自身的色度QP偏移值集合。或者，在圖像之標頭區域中規定色度QP偏移值之可能集合之一表，且每一量化群組使用一索引自該表中選擇用於判定量化群組自身的色度QP偏移值集合的一項目。除針對視訊寫碼階層之較高層級已規定之色度QP偏移值之外，亦接著使用該等量化群組特定色度QP偏移值來判定量化群組內之區塊之色度QP值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of signaling additional chroma QP offset values that are specific to quantization groups is provided, in which each quantization group explicitly specifies its own set of chroma QP offset values. Alternatively, a table of possible sets of chroma QP offset values is specified in the header area of the picture, and each quantization group uses an index to select an entry from the table for determining its own set of chroma QP offset values. The quantization group specific chroma QP offset values are then used to determine the chroma QP values for blocks within the quantization group in addition to chroma QP offset values already specified for higher levels of the video coding hierarchy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:處理程序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application> 
</tw-patent-applications>
